A prismatic sealed battery has a prismatic battery case (3) which includes a plurality of prismatic containers (4) coupled in a row via partitions (5), electrode plate assemblies (8), and collectors (10) which are joined to lead portions on both sides of the electrode plate assemblies (8). Each container (4) contains the electrode plate assembly (8) to which said collectors 10 are joined. An opening (21) is formed in at least one side wall (20) of the prismatic battery case (3) and in a position where each partition (5) is disposed, in such a manner as to face the containers (4) on both sides, and a conductive connection member (23) disposed in the opening (21) is connected to the collectors (10, 10) on both sides of the partition (5). Since the current-carrying path between the electrode plate assemblies (8) becomes short, internal resistance decreases, and hence internal resistance per cell (2) is reduced. Even and full use of the whole electrode plate assembly (8) achieves higher power output.

A conventional battery module, including a plurality of connected individual cells to obtain predetermined capacity, includes a plurality of prismatic cells which are so disposed that the wide-width sides of containers thereof are opposed to each other, end plates attached to the outside of the containers of both end cells, a restraining band for integrally binding the cells and the end plates. In each cell, leads upwardly drawn out of the upper end portions of electrode plates are connected to terminals attached to a lid of the container, and connection plates connect the terminals of every cell to constitute the battery module.
In the conventional battery module, the resistance of component parts including connection parts is high due to long connection paths among cells and many connection points. Since the ratio between the resistance of parts and the resistance of cell reaction by positive and negative electrodes and an electrolytic solution reaches 40 to 50%:60 to 50%, high internal resistance increases the heat generation of the battery. Increase in heat generation becomes barriers to the actualization of high power output and improvement in a lifetime. Also there is a problem that the complex connection structure among the cells and the many component parts increase cost.
Thus, the present applicants, as shown in FIGS. 22 and 23, formerly suggested a prismatic sealed battery 1 containing a plurality of cells 2. A prismatic battery case 3 taking the shape of a flat prism comprises containers 4 of the prismatic cells 2, each of which has narrow-width sides and wide-width sides. In the prismatic battery case 3, the containers 4 are integrally coupled in a row in such a manner as to share their narrow-width sides as partitions 5, and the upper openings of every container 4 are integrally closed by an integral lid 6. A connection hole 7 is formed in the outer narrow-width sides of both end containers 4, and in the upper portion of the partitions 5 between the containers 4, 4. An electrode plate assembly 8 as an electric power generation element, which comprises rectangular positive and negative electrode plates laminated with separators interposed therebetween, is contained in each container 4 with an electrolytic solution to compose the cell 2. One side of the positive electrode plates and the other side of the negative electrode plates of the electrode plate assembly 8 protrude oppositely to each other to form lead portions 9a and 9b of the positive and negative electrode plates, and collector plates 10a and 10b are connected to the side end of the lead portions 9a and 9b, respectively, by welding or the like.
A connection projection 11, which is fitted into the connection hole 7, is provided in the upper end portion of the collector plates 10a and 10b, and the connection projections 11 of the positive and negative collector plates 10a and 10b are connected to each other by welding between the adjoining containers 4, 4. In the outer narrow-width sides of both end containers 4, a positive or negative connection terminal 12 is attached to the connection hole 7, and a connection projection 13 thereof is connected to the connection projection 11 of the collector plate 10a or 10b by welding. Therefore, the plurality of cells 2 contained in the prismatic battery case 3 are connected in series, and electric power is outputted between both connection terminals 12, 12.
The lid 6 is provided with communicating paths 14 for even the internal pressure of each container 4, safety vents (not illustrated) for releasing the internal pressure when it exceeds a predetermined value, a sensor attachment hole 15 for attaching a temperature sensor which detects the temperature of the predetermined cell 2 and the like.
According to the structure described above, since the connection path between the positive or negative electrode plate of the electrode plate assembly 8 and the lead portion 9a or 9b becomes short, and the lead portions 9a and 9b are connected inside the prismatic battery case 3 via the collector plates 10a and 10b, it is possible to decrease the resistance of component parts including connection parts due to the short connection path and the small number of connection points, as compared with the above-mentioned conventional battery module in which individual cells are connected, and hence internal resistance decreases.
In the structure illustrated in FIGS. 22 and 23, although the connection path from the positive or negative electrode plate to the lead portion 9a or 9b and the collector plate 10a or 10b is short, since the collector plates 10a and 10b are connected by welding at one point between the ends of the connection projections 11 provided upper end portion thereof, the connection path detours and becomes long as shown by arrows S in FIG. 24, and the single connection point increases internal resistance.
In accordance with the detour of the connection path, as shown by arrows T, a large amount of electric current passes through the electrode plate assembly 8 in a portion near the connection point between the collector plates 10a and 10b, but the amount of current decreases with distance from the connection point. Thus, since current distribution passing through the electrode plate assembly 8 becomes uneven, the whole electrode plate assembly 8 does not evenly exercise its electric power generation capability, so that there is a problem that a large loss occurs.
An object of the present invention is to provide a prismatic sealed battery that have higher power output by further decreasing internal resistance per cell, and making the whole electrode plate assembly, as an electric power generation element, evenly and fully exercise its capability.

Matsushita Electric Industrial Co., Ltd.


A pipe coupling is provided that facilitates an operation of opening or closing a ball valve and suppresses damage to a cylindrical seal member by the ball valve when rotated, thereby enabling an improvement in durability. A socket fluid passage (4) in a socket (1) is opened or closed with a ball valve (5). A cylindrical seal member (11) is disposed in a primary fluid passage portion (4a) of the socket fluid passage (4) in such a manner as to be in pressure contact with the ball valve (5) to seal between the ball valve (5) and the inner wall of the socket fluid passage (4). The ball valve (5) is rotatable to open when the socket (1) and a plug (2) are locked to each other by a lock mechanism (16). The ball valve (5) is provided with a sub-valve bore (33) that allows fluid in the primary fluid passage portion (4a) to be delivered to a secondary fluid passage portion (4b) of the socket fluid passage (4) through the ball valve (5) before a valve bore (7) of the ball valve (5) opens into the socket fluid passage (4) when the ball valve (5) is rotated.

The following type of pipe coupling is generally frequently used to connect or disconnect a path for supplying a high-pressure fluid. The pipe coupling incorporates a valve element opened or closed by a manual operation. The operation for opening or closing the valve element is conducted as follows. The valve element is opened after the completion of connection between a socket and a plug that constitute the pipe coupling. The plug is disconnected from the socket after the completion of the operation for closing the valve element. Thus, the operating procedure is restricted.
A conventional pipe coupling of the above-described type is disclosed in Japanese Patent No. 2,694,302. This pipe coupling has three valve elements constituting an inlet valve member, a vent valve member, and an outlet valve member, respectively. The three valve elements are disposed in series in the pipe coupling. Accordingly, the overall length of the pipe coupling is unfavorably long, and the pressure loss is undesirably large. Consequently, the packing efficiency is degraded.
Under these circumstances, a pipe coupling has been proposed in which a ball valve is used as a valve element for opening or closing a fluid passage, thereby reducing the pressure loss while making the whole structure compact.
However, if a conventionally known ball valve is employed as it is, in a pipe coupling for a high-pressure fluid under a high-pressure environment, the following problem arises. In the pipe coupling, a seal is effected between the ball valve and the primary fluid passage portion of a socket fluid passage. Therefore, the pressure of a fluid acting in the primary fluid passage portion of the socket fluid passage is applied as a large back pressure to a cylindrical seal member that is disposed in the primary fluid passage portion in such a manner as to be in pressure contact with the ball valve to seal between the ball valve and the inner wall of the socket fluid passage.
Accordingly, the cylindrical seal member offers a large resistance to the ball valve as it is rotated, making it difficult to perform the operation for opening or closing the ball valve. Further, because a high pressure acts only on the primary fluid passage side of the ball valve, a ball rotating shaft which rotates the ball valve is undesirably decentered by the pressure. This also makes it difficult to perform the ball valve open-close operation.
Further, the cylindrical seal member is strongly pressed against the ball valve under the high pressure of the fluid. Therefore, the seal member may be worn away and damaged by the opening edge of the valve bore of the ball valve when rotated.


Some embodiments of the present invention comprise a method, system, and/or computer program product for a publish/subscribe messaging system. A processor identifies a subscriber of a pub/sub messaging system. The processor retrieves a stored encrypted key for the identified subscriber of the pub/sub messaging system. The processor communicates the retrieved encrypted key to a user selected from a group comprising a publisher of the pub/sub messaging system and the identified subscriber of the pub/sub messaging system. The processor implements end-to-end encryption of messages of the pub/sub messaging system based on key-groups.

The present invention relates generally to the field of publish/subscribe messaging (typically referred to as pub/sub messaging), and in particular to middleware for a pub/sub messaging system.
Messaging systems are common and widely used. Conventional examples range from social media applications to large financial messaging systems that conduct, for example, inter-bank and intra-bank financial transfers using messaging middleware.
Middleware is software that lies between a computer operating system and software applications. Middleware comprises functions that can be registered against routes in an application. These middleware functions are able to execute code, alter requests and/or response objects, and end a request-response cycle. Once a function of the middleware is completed, the middleware typically calls a route handler function. The route handler function, which can be another middleware, receives the altered request and/or response object as an input from the middleware. Third parties can implement custom middleware to add functionality, such as authentication and sessions, to their applications.
Some messaging systems provide "end-to-end" encryption wherein sending applications encrypt messages before transmission in such a way that they can only be decrypted by the intended recipient. If the messaging system is compromised in some way, for example a malicious third party gains access to the encrypted messages, the third party is unable to decrypt the messages to recover the content encoded therein.

International Business Machines Corporation


An eddy current sensor having a coil set with a reference coil and a measng coil, and a sine generator whose output signal is applied to the reference coil and the measuring coil. The output signals of these coils are subtracted from one another by a first subtracter, whose ouput signal is applied to a first modulator and to a second demodulator through a 90 degree phase shifter. The output signal of the sine generator is provided to the first and second demodulators as an additional signal via a phase shifter having an adjustable phase angle. A phase angle is selected such that the interference signals have a specified direction in the formed signal plane. The output signal from the first demodulator is applied through an amplifier having an adjustable amplifying factor (a) to an input of a second subtracter. Similarly, the output signal of the second demodulator is provided through an amplifier having an adjustable amplifying factor (b) to the second subtracter. The second subtracter output provides an output signal from which a trigger threshold can be formed and an object to be identified measured.

The present invention relates to an eddy current sensor having a measuring coil forming a magnetic field in which an object to be identified is insertable.
Eddy current sensors, which by way of illustration are utilized in non-destructive testing are known, for example, from the book "Magnetische und magnetinduktive Werkstoffprufung" by H. Heppner and H. Stroppe, VEB Deutscher Verlag fur Grundstoffindustrie, Leipzig, 2. Auflage, 1969 or from the article "Elektronik in der zerstorungsfreien Werkstoffprufung" by H. Luz, published in "Der Elektroniker", 1974, issue 9, pages 9 to 11.
The state of the art eddy current sensors are usually provided with a measuring coil, in the magnetic field of which the object to be identified is arranged, as well as with a reference coil. Furthermore, a signal generator, by way of illustration a sine generator, is provided, the output signal of which is applied to the coils. The output signals applied to the two coils are subtracted from each other by means of a subtracter. The output signal from the subtracter is directly applied to the first demodulator and via a 90.degree. phase shifter to a second demodulator, whereby the output signal from the sine generator, which is shifted via a phase shifter with an adjustable phase angle, is applied to the demodulators as an additional signal.
Due to the twofold demodulation, the (amplified) sensor signal is present as a vector in the "complex impedance plane", whereby the magnitude and the phase of the signal may be drawn upon for evaluation.
As, furthermore, the signal from the sine generator is phase shifted by 0.degree..ltoreq..gamma..ltoreq.360.degree. (.gamma. describing the angle about which the axes of the signal plane formed are turned compared to the axes of the impedance plane), in a parallel branch by means of an adjustable phase angle, the desired signal, e.g. the signal of a welded seam, and the interference signal, which by way of illustration may be produced by lifting effects of one or both coils, can lie in any angle .alpha. to one another, the interference signal usually being substantially greater in magnitude than the desired signal.
Customarily, the complex signal is displayed on a screen and visually assessed. In order to be able to identify the interesting signal (desired signal), the angle .gamma. at the phase shifter is set in such a manner that the interference signal comes to lie exactly in the direction of the y axis. "Channel X" is subsequently drawn upon for evaluation, e.g. by means of an "intuitively" set trigger threshold.
The state of the art sensors utilized, by way of illustration, for material testing have a number of disadvantages.
First of all, it should be understood that a visual assessment on a screen is not suitable if the sensor is to be integrated in automated equipment for testing material.
Moreover, in the known sensors only the projection of the desired signal on the x axis is evaluated. In this manner the signal-to-interference ratio to the interference signal and to noise is further reduced.
Moreover, the angle .gamma. has to be precisely adjusted in known sensors. Minimal changes in the properties of the object to be tested-such as occur, by way of illustration, when changing the batch-may result in incorrect identification.
An object of the present invention is to provide an eddy current sensor, which, by way of illustration, can be utilized for material testing, permitting automated evaluation of the signal at full signal-to-interference ratio.
A solution to the aforegoing object in accordance with the present invention and its further embodiments is set forth in the claims hereto.
Other objects, advantages and novel features of the present invention will become apparent from the following detailed description of the invention when considered in conjunction with the accompanying drawings.

Eddy current system with interference signal rejection

Fraunhofer-Gesellschaft zur Forderung der angewandten Forschung e.V .


There are provided a device for sampling a tone signal applied from outside, a built-in tone source, responsive to tone pitch information, a tone signal having tone pitch corresponding to the tone pitch of the tone pitch information, a memory capable of both writing and reading for storing waveform sampled data and a control circuit for selectively writing a tone signal sampled or a tone signal generated from the built-in tone source. The waveform sampled data in the memory is read out in accordance with designated tone pitch. A circuit is provided which, when input of a tone signal sampled has not been detected for a predetermined period, causes a tone signal generated from the built-in tone source and written in the memory. There is also provided a circuit which generates a tone of a reference pitch when a predetermined switch operation has been made with the tuning operation. There is also provided a circuit for selecting whether pitch adjustment should be made in both a sample tone source having a memory storing a tone signal sampled and the built-in tone source or the pitch adjustment should be made only in the sampled tone source. There are provided a circuit for generating pattern data designating tone sounding timing and tone pitch in accordance with a rhythm pattern and a circuit for performing selection as is whether the sampled tone source be driven in accordance with this pattern data or in accordance with a key depression.

The present invention relates to a tone signal generation device of a sampling system type which samples a tone signal applied from outside and stores it in a memory and generates a tone signal by reading out waveform sampled data stored in this memory at a desired tone pitch by key operation or the like operation and, more particularly, to a tone signal generation device having a built-in tone source and being capable of storing either a tone signal generated from this built-in tone source or a sampled tone signal from outside selectively in the memory and thereby being capable of treating the tone signal generated from the built-in tone source in the same manner as the sampled tone signal from outside.
The present invention relates also to a tone signal generation device of a sampling system type capable of storing a tone signal from a built-in tone source when a tone signal from outside has not been applied for a predetermined period of time after designation of sampling of a tone signal from outside.
The present invention further relates to a tone signal generation device of a sampling system type having various functions.
As electronic musical instruments of a sampling system type, there are ones such as disclosed in Japanese Patent Publication Nos. 33199/1986 and 47435/1986. In these prior art electronic musical instruments of a sampling system type, a tone signal from outside is merely sampled and stored in a memory and, even if there is a tone source in the electronic musical instrument, a tone signal from this internal tone source cannot be stored in the memory for sampling. Accordingly, a tone signal from the internal tone source cannot be subjected to the same processings, i.e., sampled tone editing processings, as are applied to a tone signal sampled from outside. The sampled tone editing processings herein mean processings including ones according to which a sampled tone is sounded repeatedly and reading of a sampled tone from the memory is made by reading addresses in a reverse direction.
In a case where waveform sampled data of a tone signal sampled from outside is written in a memory, write address of the memory generally changes at a predetermined reference rate (e.g., tone pitch of A4 tone). If this memory is accessed with an address signal which changes in accordance with the same reference rate, waveform sampled data is read out from the memory and sounded at the same tone pitch as the tone pitch of the sampled external tone. Further, by changing the rate of the read address signal in accordance with a desired tone pitch, a tone signal corresponding to the sampled external tone can be sounded at a desired tone pitch corresponding to the read rate.
On the other hand, it has been conceived that, in a case where a tone signal from outside is sampled, selection is made as to whether the sampled tone signal should be used in a part of bass tones or in a part of normal tone range such as melody or chord. In this case, the prior art tone generation device is so constructed that a tone signal sampled from outside is written in a memory as it is at a predetermined reference rate.
In the above described prior art electronic musical instrument of a sampling system type, a tone signal from outside is merely sampled and stored in a memory and, accordingly, even if there is an internal tone source in the electronic musical instrument, a tone signal from this internal tone source cannot be stored in the memory for sampling so that the tone signal from the internal tone source cannot be subjected to the same processings, i.e., the sampled tone editing processings, as are applied to the tone signal sampled from outside. The prior art device is therefore disadvantageous in that it cannot utilize functions of the electronic musical instrument of a sampling system type to the fullest extent.
Besides, the prior art electronic musical instrument is not so adapted that a write control of a sampled tone is performed having regard to a performance part in which the sampled tone signal is used and, accordingly, a sampled tone of a part of lower tone range such as bass tones and a sampled tone of a part of a normal tone range are sometimes written in a memory at the same tone pitch. This necessitates capability of a read control circuit to cope with a broader tone range for enabling a tone to be sounded in sufficiently broad tone range during reading and performance of a tone with resulting complication in the circuit design.
In a case where an external tone signal has not been applied or sampled due to some reason (e.g., erroneous operation in sampling the external tone, disorder of a microphone, failure in inputting of the external tone, or interruption of the external tone sampling operation by leaving of the performer from his seat) notwithstanding that the performer has designated sampling of the external tone signal by operation of a switch or the like means, the prior art device maintains a standby state to receive an external tone signal. This is because an external tone must be always sampled for a sampled tone to be sounded during performance.
In the electronic musical instrument of a sampling system, as described above, if an external tone signal has not been applied or sampled for some reason notwithstanding that sampling of the external tone signal has once been designated, a standby state to receive an external tone signal is maintained indefinitely. Therefore, when the performer who is not aware of this erroneous operation or who has returned to his seat after leaving it starts to play on the keyboard, a tone sometimes is not sounded despite depression of a key because the tone has not been sampled in the memory yet. Moreover, the performer tends to misunderstand this state in which the tone is not sounded despite depression of the key to be a disorder of the device.

Tone signal generation device having a sampling function


A method includes determining a delivery performance of a data flow being transmitted from a first network equipment to a second network equipment over a network; determining whether the network is congested based on the determined delivery performance of the data flow being transmitted to the second network equipment; and pacing delivery of the data flow to the second network equipment by reducing a rate at which the data flow is delivered to the second network equipment when the network is determined to be congested.

The present invention is generally related to computer networks, and more particularly related file transmission over such networks.
Networks such as the Internet and wide area networks (WANs) have significant amounts of installed equipment to furnish such services as file transfer services. Based upon capacity of the installed equipment certain sized files can be transmitted efficiently over these networks using conventional transmission methods without sizable impact upon the networks.
Other desired scenarios involving file transfer services have been largely avoided by conventional file transfer methods due to massive sizes of files to be transmitted and/or distribution demands, such as with large scale multicasting of significantly sized files. Examples of such massive file sizes can include large format high-resolution audio-video or electronic game files. Transmissions of massive sized files using conventional methods for networks such as the Internet or WANs including but not limited to wired (Digital Subscriber Line (DSL), cable, powerline), fiber, wireless, satellite, and cellular types, given their current equipment base, could cause significant impact upon these networks, especially if done on a frequent basis, so do not appear to be practical or possibly even feasible. Conventional solutions have focused upon expanding network transmission capacities to meet peak traffic demands. Unfortunately, these conventional solutions require huge expenditure of resources and funds so for the most part remain as questionable options.

System and method for peak flow detection in a communication network


A mobile sieving apparatus and method for harvesting cannabis pollen and trichomes separates the flowers of a cannabis plant. A large sieve panel, a medium sieve panel, a small sieve panel, and a silk screen panel are arranged in a spaced-apart stacked arrangement inside a harvesting vehicle. The sieved panels have different sized openings to enable passage of corresponding portions of the cannabis plant. The sieve panels are arranged by graduated separation, in which the distance between panels correlates to the size of the cannabis plant components passing through the opening. A harvesting panel has a solid, flat surface, and positions below the sieve panels to catch the pollens and trichomes falling through. The panels are stacked in a harvesting vehicle, sliding onto docking rails that slidably receive the edges of panels. The harvesting vehicle is lightweight to enable manual agitation of the vehicle, and enhance mobility of the panels.

The following background information may present examples of specific aspects of the prior art (e.g., without limitation, approaches, facts, or common wisdom) that, while expected to be helpful to further educate the reader as to additional aspects of the prior art, is not to be construed as limiting the present invention, or any embodiments thereof, to anything stated or implied therein or inferred thereupon.
Typically, cannabis plants grow in a bush configuration, which often includes intertwined stems with leaves and buds. The stems of the cannabis plant do not contain the consumable portion of the cannabis plant. Therefore, when harvesting the cannabis plant, the leaves and buds are separated from the undesirable stems. Conventional manual processes for the separating step include holding the stem with one hand while simultaneously pulling off the leaves and buds with the opposite hand or cutting the buds from the stem with scissors.
Generally, cannabis plants can be harvested and processed to obtain numerous kinds of chemical compounds used in medical products. The compound tetrahydrocannabinol (THC) can be extracted from cannabis plants. In particular, THC can be obtained by refining micron-sized outgrowths on the cannabis plant called trichomes. Trichomes may vary in size (e.g., between 60 to 200 microns).
Generally, the pollen and trichomes harvested from cannabis plant is a fine to coarse powder containing the micro gametophytes of seed plants, which produce the male gametes (sperm cells). Pollen and trichomes grains have a hard coat that protects the sperm cells during the process of their movement between the stamens to the pistil of flowering plants or from the male cone to the female cone of coniferous plants. When pollen and trichomes lands on a compatible pistil of flowering plants, it germinates and produces a pollen and trichomes tube that transfers the sperm to the ovule of a receptive ovary.
Consequently, the individual pollen and trichomes grains are small enough to require magnification to see detail. For cannabis pollen and trichomes, once the male cannabis plants begin to flower, the pollen and trichomes can be harvested. If the female plant is feminizing its seeds, the pollen and trichomes can also be harvested. For example, as soon as the pollen and trichomes sacs begin cracking on the marijuana plant as if to open, the pollen and trichomes is ready for harvesting
Other proposals have involved systems for harvesting cannabis plants. The problem with these harvesting systems is that they are not easy to manually agitate or carry to the cannabis plant or field. Also, the sieves are not stacked in a graduated arrangement, so as to optimize space in the harvesting vehicle carrying the sieve panels. Even though the above cited systems for harvesting cannabis plants meet some of the needs of the market, a mobile sieving apparatus and method for harvesting cannabis pollen and trichomes that separates flowers, trimmings, pollen, and trichomes of a cannabis plant with sequential sieving through a stacked arrangement of graduated sieved panels arranged by graduated separation, and a harvesting panel that collects the pollen and trichomes that pass through all the sieved panels; and further carries the panels in a harvesting vehicle that is lightweight to enhance agitation and mobility, is still desired.

Mobile sieving apparatus and method for harvesting cannabis pollen and trichomes


An FM transmitter forms a Digital Audio Broadcasting (DAB) signal comprising a digital FM signal and an analog FM signal. The FM transmitter comprises an RF nonlinear amplifier coupled to a first antenna and an RF linear amplifier coupled to a second antenna. The RF non-linear amplifier and antenna transmit the analog FM signal. The RF linear amplifier and antenna transmit the digital FM signal. The FM transmitter controls the signal transmissions such that the transmitted analog FM signal and the transmitted digital FM signal are combined, or multiplexed, together in the channel itself (here, the atmosphere) to form the DAB signal.

This invention relates generally to communications, more particularly, to the multiplexing of signals for transmission.
In systems where multiple signals are desired to be transmitted simultaneously within a given frequency band, some form of signal combination is required. When the signaling formats of the multiple signals are similar, simple frequency division multiplexing is a convenient solution. However, any proposed solution becomes more complicated when different signal formats are used. Some signaling formats that require different handling are: spread spectrum, single-tone QAM, multi-tone QAM, and analog modulation schemes.
In particular, consider the proposed In Band On Channel (IBOC) scheme for Digital Audio Broadcasting (DAB). In switching to the DAB system, it is envisioned that there will be a period of time (a transition period) during which both analog FM signals and digital FM signals co-exist. This spectral allocation is illustrated in FIG. 1. In FIG. 1, the triangular spectrum is produced by standard FM modulation as is currently used in the commercial FM band (88-108 Mhz), wherein stands for carrier frequency. The two rectangular sidebands are envisioned to be digitally modulated multi-tone versions of Quadrature Phase Shift Keying (QPSK). Thus, this DAB transition period requires the frequency division multiplexing of analog and digitally modulated signals. (The analog and digital bands simulcast the program material so that this IBOC approach will be compatible with current analog FM receivers.)
Currently, there are two schools of thought on how to mix multiple signals in a single transmission. These methods can be described as pre-amplification and post amplification mixing.
The pre-amplification mixing method is illustrated by FIG. 2. As shown in FIG. 2, combiner 20 provides a combined signal 3, which is the combination of the analog (1) and digitally (2) modulated signals. Combined signal 3 is applied to RF amplifier 25, which drives antenna 30. Although is it relatively simple to combine these signals (via combiner 20), there remains the problem of designing RF amplifier 25 to simultaneously process the two signals. In general, the amplifiers currently used in FM transmissions are of the class C variety. More specifically, these amplifiers are not linear. While this is not a problem for the analog portion of the combined FM signal, this means that current FM amplifiers cannot effectively pass a QAM (or digitally modulated) type signal with any true fidelity. Further, current FM amplifiers have an effective bandwidth of 200 kHz (fcxc2x1100 kHz). As such, to use the architecture of FIG. 2 in a DAB system requires existing FM stations buy a new type of high power linear RF amplifier (with a bandwidth of 400 kHz (fcxc2x1200 kHz)) so that both digital and analog modulated signals can be effectively combined. In addition, any such new RF amplifier design would become obsolete once a transition to an all digital version of IBOC is desired.
The second method, post amplification, requires two amplifiers (40 and 45) and a combining network (50) rated for high power as illustrated in FIG. 3. Unfortunately, such a combining network is typically expensive and inefficientxe2x80x94significant power is lost between RF amplifiers 40 and 45 and antenna 30. Thus, there is no way for the radio station to continue to broadcast the analog FM signal with the power it uses today. Radio Stations will either have to replace the amplifier with one of higher power or suffer the loss of analog FM coverage.
As a result, during this transition period both of the above-described solutions are undesirable because of the expense or loss of coverage area incurred.
We have discovered another alternative for multiplexing disparate signals that is more cost effective than the above-mentioned approaches. In particular, and in accordance with the principles of the invention, a multiplexed signal is formed by separately transmitting each signal in such a way that the multiplexing of the signals occurs in the channel. This eliminates the need for a combiner and cost is reduced.
In an embodiment of the invention, an FM transmitter comprises an RF nonlinear amplifier coupled to a first antenna and an RF linear amplifier coupled to a second antenna. The RF non-linear amplifier and antenna transmit an analog FM signal. The RF linear amplifier and antenna transmit a digital FM signal. The FM transmitter controls the signal transmissions such that the transmitted analog FM signal and the transmitted digital FM signal are combined, or multiplexed, together in the channel itself (here, the atmosphere) to form the transition DAB signal.
As a result there is virtually no attenuation of either signal between the RF amplifier and the antenna. Further, this approach provides a low cost alternative to the earlier described approaches. The linear amplifier is not required to be very high power since it must fit within the FCC mask (which is some 20 dB below the analog signal) in the sideband. Also, there is no change to their current analog FM signal processing. It should also be noted that when the time comes to transition to an all digital approach, the FM transmitting station can simply substitute another high power linear amplifier for the class C amplifier used for the analog FM.

Method and apparatus for combining signals


An assembly useful in conjunction with a signal transmission means for the measurement of a compositional parameter of the blood of a patient is disclosed. This assembly comprises a housing adapted and sized to be located outside the body of a patient and having a fluid flow passage therethrough into which blood from the patient is passed from a hollow tube, the fluid flow passage being defined by a wall which is substantially impermeable to blood, the housing being adapted to be removeably secured to a signal transmission system such that the housing is capable of being removed from the signal transmission system without disrupting the fluid flow passage; and a sensing element located in the housing in or near the fluid flow passage for providing a signal directly to the signal transmission system in response to a compositional parameter of blood located in the fluid flow passage.

It is often necessary or desirable to measure various parameters of blood, such as temperature, pressure and compositional parameters of blood, i.e., the presence and/or concentration of blood constituents, such as blood gases, hydrogen ions (pH), other electrolytes, glucose, red blood cells and the like. Measurement of compositional parameters of blood can be accomplished in real time using fluorescent sensors. For example, this can be accomplished in an extracorporeal blood loop as shown in Cooper U.S. Pat. No. 4,640,820 and in vivo as disclosed in Lubbers et al Reissue Patent No. 31,879. The system disclosed in this Cooper patent involves a fluid (blood) passageway partly defined by membranes which are permeable to one or more blood constituents. For in vivo sensing, a probe or catheter carrying an appropriate sensor is inserted into a blood vessel of the patient. Because blood vessels are quite small, sensors designed to be inserted in such vessels must be very small. This size constraint may have a detrimental effect on the accuracy of the determination made by the sensor.
Kater U.S. Pat. No. 4,535,786 discloses a method and apparatus for measuring parameters of body fluids, e.g., blood, using sensing electrodes which are calibrated periodically. Kater discloses a system in which the sensing electrodes are located at a relatively large area of the blood path. That is, the cross-sectional area of the blood path is increased relative to the cross-sectional area of this path immediately upstream of the sensing electrodes. Thus, a relatively large volume of blood must be drawn from the patient in order to obtain the desired measurements with the system.
Parker U.S. Pat. No. 4,573,968 discloses a system in which blood drawn from a patient into a cassette comes into direct contact with electrochemical sensors which are mounted along a flow path inside the cassette. The wires leading from the cassette to the analyzer appear to be an integral part of the cassette. Thus, both the cassette and the wires of the Parker system require disposal after use, in order to avoid blood contamination between patients. The Kater system has similar disposal concerns. It would be advantageous to have to dispose of as little as possible in order to minimize costs.
Other patents which have been considered in preparing the application include Kulick U.S. Pat. No. 2,629,399; Cunningham et al U.S. Pat. No. 4,398,542; Koning et al U.S. Pat. No. 4,478,222; and Heitzmann U.S. Pat. No. 4,557,900.

Minnesota Mining and Manufactoring Company


A physically integrated manufacturing and materials handling system comprising a conveyor system and a storage system. A conveyor system is described which includes structure for receiving pallets having metal sheets or the like placed thereon so that the metal sheets may be removed therefrom and placed on a storage system pallet. The loaded storage system pallets are transported to storage bays or other locations within the facility by means of an electronically guided forklift truck.

In many manufacturing facilities, stacks of material such as metal sheets or the like are delivered to the facility on wooden skids or pallets. Although materials other than metal sheets may be delivered to manufacturing facilities, the term metal sheets will be used herein for purposes of clarity and conciseness. The wooden skids do not lend themselves to convenient handling or storage so it is necessary to transfer the metal sheets from the wooden skids to some form of metal pallet which may be more conveniently handled. In most cases, the pallets are moved from location to location within the facility by means of forklift trucks which usually include a pair of vertically movable forks which engage the underside of the pallet. If the forks of the forklift truck are not precisely positioned beneath as in the pallet, the pallet could fall from the forks since the pallets are being supported at approximately the center thereof.
Once the metal sheets have been removed from the wooden pallets and placed on a metal pallet, the problem of conveying the same to the press brakes, etc. is troublesome as is the storage of the same if the material is not going to be used immediately. Further, once the material has been fabricated into a finished product, the handling, storage and shipment of the same is also inconvenient.
Therefore, it is a principal object of the invention to provide an improved materials handling system for use in a metal fabrication facility.
Still another object of the invention is to provide a physically integrated manufacturing system.
Still another object of the invention is to provide a materials handling system which conveniently provides a means for handling metal sheets from delivery to fabrication to shipment.
Still another object of the invention is to provide a materials handling system for transferring metal sheets positioned on wooden pallets to system pallets.
Still another object of the invention is to provide an improved pallet having recesses at its lower outer ends for receiving the forks of a forklift truck.
Still another object of the invention is to provide an improved pallet which is engaged at the ends thereof by the forks of a forklift truck for increased stability and safety.
Still another object of the invention is to provide an improved pallet which permits the forks of a forklift vehicle to bypass the load on a pallet positioned below the pallet being handled.
Still another object of the invention is to provide a system of the type described including elongated conveyors having transversely extending conveyors associated therewith for supplying empty pallets thereto, and removing loaded pallets therefrom.
Yet another object of the invention is to provide an electronically guided vehicle for conveying or transporting materials from one location to another within the facility.
Yet another object of the invention is to provide a cantilevered side-loading forklift vehicle.
Yet another object of the invention is to provide a system for removing loaded pallets from a storage bay.
These and other objects will be apparent to those skilled in the art.

Physically integrated manufacturing and materials handling system


Disclosed is a precise grinding grindstone in which the-heights of the grinding particles can be aligned even if large particles are employed. An underlying plated layer is formed on a substrate, and grinding particles are dispersed as a single layer thereon. The grinding particles are pressed toward the plated layer by a mold member and are partly pressed into the plated layer, whereby the heights of the grinding particles are aligned. Then, the particles are supported by a binding plated layer. The protrusion of the particles can be arbitrarily selected by regulating the thickness of the binding plated layer.

1. Field of the Invention
The present invention relates to a precise grinding grindstone for grinding the surface of a hard brittle material such as glass or a semiconductive material with a satisfactory surface roughness, and a process for producing the same.
2. Related Background Art
Among such precise grinding grindstones, there are already known a grindstone in which plural layers of grinding particles are dispersed in a binder and fixed onto a substrate, and another grindstone in which a layer of grinding particles are fixed on a substrate by an electroplating process.
However, in such conventionally known grindstones, the one having plural layers of grinding particles dispersed in and fixed by the binder on the substrate shows unaligned end positions of the grinding particles because they are randomly supported in the binder. Also, the grindstone prepared by the electro-plating method has a layer of grinding particles fixed on the substrate, but the heights of the grinding particles are uneven, because of the unevenness in the size or shape of the grinding particles themselves. When the end positions of the grinding particles are unaligned, a high load is applied in the grinding operation to several grinding particles most protruding from the grindstone, thus providing a large cutting depth by such protruding several grinding particles.
In the grinding operation of a hard brittle article, the grinding is conducted in the shear mode if the cutting depth is less than a predetermined depth, and in the brittle mode if the cutting depth exceeds the predetermined depth. The predetermined cutting depth is called a critical cutting depth d.sub.c, which is an inherent value of the material. In the brittle-mode grinding, the article is ground with brittle breaking, and the ground surface becomes rougher than the desired surface roughness. Thus, when the cutting depth becomes larger and exceeds the critical depth d.sub.c, the work article is not ground with the shear mode indicating no brittle breaking but with the brittle mode, so that the desired surface roughness is hardly obtained.
The unevenness in the end heights of the grinding particles may be reduced by decreasing the size of the grinding particles, but, in such case, the amount of protrusion of the grinding particles becomes smaller, so that the gaps between the grinding particles will be easily clogged. Also, a smaller size of the grinding particles leads to a drawback that the particles tend to drop off due to a weakened holding force for the particles.

Polishing/grinding tool and process for producing the same


A monitor circuit for monitoring a level of a first and second regulated source may monitor a voltage level of regulated voltages or a current level of regulated currents. In an embodiment, the monitor circuit includes circuitry responsive to a first regulated current and to a second regulated current. A first circuit responsive to the first regulated current and to the second regulated current generates a first error signal indicative of at least one of an overcurrent condition of the first regulated current and an undercurrent condition of the second regulated current. A second circuit responsive to the first regulated current and to the second regulated current generates a second error signal indicative of at least one of an undercurrent condition of the first regulated current and an overcurrent condition of the second regulated current. A method for monitoring the levels of first and second regulated sources is also provided.

As is known, electronic circuits are used in a variety of applications. One example application is in sensing applications where a circuit including one or more sensing elements (e.g., pressure sensing elements, temperature sensing elements, light sensing elements, acoustic sensing elements, and magnetic field sensing elements) is used to detect one or more parameters (e.g., pressure, temperature, light, sound, magnetic field). Magnetic field sensors, for example, are circuits including one or more magnetic field sensing elements, generally in combination with other circuit components (e.g., analog, digital and/or mixed signal components), and are used to detect a magnetic field.
In motion (e.g., rotation) detectors, for example, a magnetic field sensor may used to detect motion of an object, such as a ferromagnetic object, for example, a gear or ring magnet. A magnetic field associated with the object is typically detected by one or more magnetic field sensing elements, such as a Hall effect elements or a magnetoresistance elements (e.g., giant magnetoresistance (GMR) elements), which provide a signal (i.e., a magnetic field signal) proportional to a detected magnetic field. One example motion detector is described in U.S. Pat. No. 8,624,588 entitled "Apparatus and Method for Providing an Output Signal Indicative of a Speed of Rotation and a Direction of Rotation as a Ferromagnetic Object," which is assigned to the assignee of the present disclosure and incorporated herein by reference in its entirety.
The magnetic field sensing elements and other circuitry may have different power requirements and, thus, may be powered by signals (e.g., voltage or current signals) of varying levels (e.g., voltage or current levels) as may be generated by one or more signal sources (e.g., voltage or current regulators). Some magnetic field sensor integrated circuits (ICs) contain signal regulation circuitry and methods to provide substantially fixed output signals (e.g., voltage or current signals) to power the magnetic field sensing elements and other circuit components.
In high precision applications such as automobiles, accuracy variations in the detected motion of a target object (e.g., resulting from irregularities in a sensed target profile of the target object) can be problematic. Engine ignition timing, for example, depends on consistent detection accuracy. As one example, when magnetic field sensing elements and other circuitry of a magnetic field sensor IC are not powered properly, for example, detection accuracy of the magnetic field sensor IC can be negatively impacted. Furthermore, in safety critical applications such as automobiles, compliance with standards such as Automotive Safety Integrity Level (ASIL) standards, generally require safety mechanisms to ensure proper circuit operation.

Methods and apparatus for monitoring a level of a regulated source


A microphone amplifier comprises an input terminal (E100) for applying an input signal (IN), an output terminal (A100a) for outputting an output signal (OUT), and an additional output terminal (A100b) for outputting an additional output signal (VBIAS). The microphone amplifier also contains an amplifying circuit (10) for generating the output signal (OUT) by amplifying the input signal (IN), wherein the amplifying circuit (10) is connected between the input terminal (E100) and the output terminal (A100a), and a voltage generator (30) for generating the additional output signal (VBIAS). A supply voltage terminal (V30) of the voltage generator (30) is connected to the output terminal (A100a) of the microphone amplifier. Since the amplifying circuit (10) makes available a supply voltage (V) for the voltage generator (30), the microphone amplifier can be operated without a separate supply voltage terminal.

The output signals of microphones are usually amplified by an amplifying circuit before they are forwarded, for example, to an analog/digital converter or other downstream amplifying units. In the widely used two-wire ECM (electret condenser microphone) microphones, the microphone features an output terminal for outputting a voice signal and a reference voltage terminal for applying a reference voltage. The output terminal is generally connected to a voltage source and downstream signal processing circuits such as, for example, amplifying circuits or analog/digital converters via a coaxial cable. Since ECM microphones merely feature two terminals, microphones of this type are used, for example, in connection with headsets, wherein a shielded wire (coaxial cable) can be used for transmitting the voice signals.
In addition to ECM microphones, MEMS microphones are also used. Three terminals are generally provided on the housing of a MEMS microphone. One terminal is provided for applying a supply voltage, another terminal is provided for contacting a reference voltage, and another terminal is provided for outputting the output signal. In contrast to ECM microphones, MEMS microphones therefore feature an additional terminal, namely the terminal for applying the supply voltage.
The external supply voltage is respectively used for operating other amplifying circuits integrated into the microphone and for generating a bias voltage for the microphone membrane of the MEMS microphone. This bias voltage is generally slightly higher than the voltage at the output terminal of the MEMS microphone. In order to operate the MEMS microphone, the terminal for applying the supply voltage therefore is usually connected to an external supply voltage source.
Due to the fact that these microphones feature, in comparison with an ECM microphone, an additional terminal for applying the supply voltage, the use of MEMS microphones is frequently associated with a higher wiring complexity, higher production costs, and the use of a larger portion of the chip surface. In addition, an exchange between the different types of microphones is generally complicated or in the most instances impossible due to the lacking compatibility with respect to the terminals.


An improved swimming pool construction of the kind capable of being erected, at least substantially, above ground on a substantially flat surface is provided. The swimming pool is of a construction whose modular components are prefabricated and delivered to the building site for assembly. A bracing member comprised of four cut pieces of standard construction lumber, and provided in pre-assembled modular form, provides load bearing qualities that afford sufficient strength without the need to supply any additional support means that are anchored in the ground. The swimming pool is fabricated from a plurality of wall panels that are secured end-to-end and form the periphery of the swimming pool and contain integrally formed flanges that retain the brace in position. The prefabricated pool delivered to the building site as a package, employs an arrangement of modular elements to provide a self standing swimming pool that can be assembled, using only hand tools to lock together the respective modular parts. The modular brace which integrates the entire swimming pool performs the triple function of affording strengthening means to resist buckling of the wall panels from water pressure, supports a deck and is used to secure a screening/protective fence surrounding the periphery and above the top of the swimming pool wall.

Various swimming pool constructions which employ an assembly of modular wall panels connected end-to-end to form the perimeter of a swimming pool and include accessory related modular components to provide a self standing swimming pool are known. All such known constructions, however appear to require some substantial on-site building, at least with respect to reinforcement and/or stabilizing, as distinguished from solely assembling and securing modular components that are delivered to a buiding site.
Because of the high and rising cost of labor, it is increasingly important, from a cost standpoint and to promote affordability of swimming pool of this kind, that the labor required in building a swimming pool be kept to a minimum. Obviously when it is necessary to "tailor make" the the component parts of the swimming pool at the building site, this has a direct effect in raising the cost to the consumer for such pools.
It is thus apparent that a need exists for an improved above ground swimming pool of the kind wherein essentially all the components of the structure are prefabricated as modular units and brought onto the building site in a package and wherein the on-site labor requirements is limited essentially to the assembly of the modular components to provide a completely finished swimming pool including bracing means, peripheral deck and screening/protective fence surrounding the swimming pool.


Disclosed are an impedance matching method, an impedance matching apparatus for the same, and a record medium. The impedance matching apparatus includes a storage part to store information about an impedance matching point according a state of an obstacle, an impedance matching part connected to an antenna and including at least one variable element, a detector to detect transmit power and reflected power reflected by the antenna, and a controller to search for an impedance matching point within a variation range of the variable element by using at least one of the transmit power and the reflected power, and to detect a state of a surrounding obstacle by comparing information about the searched impedance matching point with the stored information about the impedance matching point.

An antenna circuit of a mobile communication terminal allows an antenna to transmit or receive predetermined radio signals. In order to optimize the transmit/receive radiation performance of the antenna, impedance matching must be exactly performed. Therefore, the antenna circuit includes capacitors and inductors, and the impedance of the antenna is matched in the optimal status by adjusting values of the capacitors and the inductors.
In general, the impedance matching of the antenna is achieved in a state that the mobile communication terminal is positioned in a free space.
Meanwhile, the mobile communication terminal may be used by a user in a state that the user grips the body of the mobile communication terminal with the hand of the user and adheres a speaker to the ear of the user due to the mechanical characteristic of the mobile communication terminal, or may be used by the user through an ear-phone in a state that the body of the mobile communication terminal is put into a pocket or a bag of the user.
As the user uses the mobile communication terminal by gripping the mobile communication terminal with the hand of the user and adhering the speaker to the ear of the user, or as the user uses the mobile communication terminal put into the pocket or the bag, the conditions for the impedance matching of the antenna may vary, so that the transmit/receive radiation performance of the antenna subject to impedance matching in the free space may be degraded.
Therefore, the mobile communication terminal employs an adaptive tuning antenna circuit to automatically adjust the impedance of the antenna when the conditions for the impedance matching of the antenna vary, so that the antenna has the optimal transmit/receive radiation performance.

Impedance matching method, impedance matching apparatus for the same, and record medium


An object of the present invention is to make it possible to effect a reliable and compact configuration for a semiconductor device when mounting a plurality of semiconductor elements in a single package, and achieve higher integration and higher functionality more effectively. In a multi-layer wiring board 20 in which wiring patterns (conductor layers) 22, 24, and 26, and insulating layers 23, 25, and 27, are formed alternately in multiple layers on a base substrate, and electrically connections are made between the wiring patterns through via holes VH1 and VH2, semiconductor elements 30 are imbedded and mounted inside the insulating layers 23, 25, and 27, and the semiconductor elements 30 are deployed so that they are electrically connected to wiring patterns that are covered by the insulating layers, and so that they are stacked up in a direction perpendicular to the planar dimension of the multi-layer wiring board 20.

1. Field of the Invention
This invention relates to a semiconductor device and manufacturing method therefor, and particularly to technology useful for effectively realizing higher integration and higher functionality in a semiconductor device wherein a plurality of semiconductor elements (chips) is mounted in a single package.
2. Description of the Related Art
In FIG. 1 are diagrammed examples of semiconductor devices of the type described above.
In the examples diagrammed, semiconductor devices are represented wherein a plurality of semiconductor chips is mounted on one substrate. In the example in FIG. 1A, semiconductor chips 2 are mounted on both surfaces of a substrate 1; in the example in FIG. 1B, semiconductor chips 2 and 2a are mounted in a stacked configuration on one surface of the substrate 1; in the example in FIG. 1C, a plurality of semiconductor chips 2 is mounted in a plane on the substrate 1; and in the example in FIG. 1D, one semiconductor chip 2 is mounted on one surface of the substrate 1, while a plurality of semiconductor chips 2 is mounted on the other surface thereof. These examples are respectively diagrammed schematically.
On the surface of the substrate 1, wiring patterns are formed as appropriate. To the wiring patterns, the electrode terminals (not shown) of the semiconductor chips 2 and 2a are electrically connected by wire bonding. The electrical connections between the semiconductor chips and the wiring patterns are not limited to wire bonding connection, and flip chip connections or TAB connections or the like can also be used.
In a conventional semiconductor device as described above, the semiconductor chips 2 and 2a are mounted in a mounting surface of the substrate 1, wherefore, due to the fact that the substrate 1 is made in regular sizes, the number of semiconductor chips that can be mounted is limited, which is a disadvantage.
When the semiconductor chips 2 and 2a are mounted in a stack, as diagrammed in FIG. 1B, the upper chip 2 must be made smaller than the lower chip 2a by an amount necessary for the area which is required to make the wire bonding connections. For that reason, the mounting area for the upper chip 2 becomes smaller, and there is inherently a limit to the number of chips that can be stacked.
In this case, when flip chip connections are used, there is no need to provide a region for bonding as described above, wherefore it is possible to increase the number of mounted chip as compared to the case of wire bonding connection. However, other difficulties arise instead.
With flip chip mounting, in general, solder bumps or other metal bumps (electrode terminals) are formed on the electrode pads of the semiconductor chips, and connections are effected by thermally pressing these bumps down on corresponding electrode pads on a mounting substrate such as a printed circuit board. When this method is applied to a stacked chip configuration as diagrammed in FIG. 1B, the upper chip 2 will be flip-chip connected to the lower chip 2a. In this case, it is necessary to form the electrode pads on the upper surface of the lower chip 2a so as to correspond with the positions of the bumps that are the electrode terminals of the upper chip 2. Also, when stacking the chips, alignment must be effected between the bumps on the upper chip and the electrode pads on the lower chip, making the overall process complex, which is a disadvantage.
When mounting a plurality of semiconductor chips in a single package in this manner, with a method as diagrammed in FIG. 1 in which the semiconductor chips 2 and 2a are simply mounted on the mounting surface or surfaces of the substrate 1, the number of semiconductor chips that are mounted is limited, and it is not always possible to realize adequately high integration and functionality.
That being so, in terms of a method for effecting higher integration and higher functionality, semiconductor device configurations have been devised in which the substrate is made in multiple layers, and semiconductor elements are provided inside the substrate. If use is made of a multi-layer substrate structure wherein a plurality of wiring layers is provided, for example, it is possible to electrically interconnect the semiconductor chips and deploy them three-dimensionally inside the substrate. It is not necessarily easy, however, to imbed the semiconductor chips inside the substrate and form the wiring layers in multiple layers. When the recent demands for making packages smaller and lighter in weight are taken into consideration, furthermore, there are problems which must be faced, such as the necessity of forming the semiconductor devices compactly with the overall thickness thereof made thinner.
An object of the present invention, which was devised in view of such problems in the prior art, is to provide a semiconductor device, and manufacturing method therefor, with which it is possible, when mounting a plurality of semiconductor elements (chips) in a single package, to make the configuration reliable and compact, and wherewith higher integration and higher functionality can be realized more effectively.
In order to resolve the problems with the prior art stated in the foregoing, in the present invention, effective use is made of the build-up method and other multi-layer wiring technologies in which advances have been made in recent years, in terms of effecting practicality, in the field of semiconductor packaging.
A multi-layer wiring board for which the build-up method is used, for example, is generally built up by sequentially repeating a process for forming an insulating layer, a process for forming a via hole in the insulating layer, and a process for forming a conductor layer (wiring pattern) that includes the interior of the via hole. If a multi-layer wiring board obtained by such a build-up method is used, it is possible to imbed and mount semiconductor elements (chips) exhibiting enhanced integration levels, etc., in the built-up layers, and to provide electrical connection therebetween.
Accordingly, based on one aspect of the present invention, a semiconductor device is provided that comprises: a multi-layer wiring board in which conductor layers having wiring patterns formed thereon are formed in multiple layers with an insulating layer interposed therebetween and the wiring patterns are mutually electrically connected through via holes that pass through the insulating layers; and semiconductor elements that are mounted and imbedded inside each of the insulating layers of that multi-layer wiring board; wherein the semiconductor elements are electrically connected to the wiring patterns that are covered by those insulating layers, and are stacked up in a direction perpendicular to plane of the surface of the multi-layer wiring board.
More specifically, the present invention is as follows.
1. A semiconductor device comprising:
a base substrate on one surface of which wiring patterns are formed;
a plurality of insulating layers located on and above the surface thereof;
conductor layers having wiring patterns formed therein and located on the insulating layers; and
semiconductor elements imbedded and mounted inside the insulating layers; wherein:
the wiring patterns are mutually electrically connected, passing through the insulating layers; and
the semiconductor elements are electrically connected to the wiring patterns.
2. The semiconductor device described in 1 above, wherein one or more semiconductor elements are imbedded and mounted inside each of the plurality of insulating layers.
3. The semiconductor device described in 1 above, wherein two or more semiconductor elements are imbedded and mounted inside each of the plurality of insulating layers.
4. The semiconductor device described in 1 above, wherein the thickness of the semiconductor elements is 50 xcexcm or less.
5. The semiconductor device described in 1 above, wherein the semiconductor elements and wiring patterns corresponding thereto are electrically connected by flip chip mounting.
6. The semiconductor device described in 1 above, wherein the semiconductor elements and wiring patterns corresponding thereto are electrically connected via an anisotropically conductive film.
7. A semiconductor device manufacturing method comprising:
a first step for forming a wiring pattern on one surface of an insulative base substrate;
a second step for mounting a prescribed number of semiconductor elements on the wiring patterns;
a third step for forming an insulating layer on the base substrate and the wiring patterns so as to cover the semiconductor elements;
a fourth step for forming via holes in the insulating layer so as to reach to the wiring pattern on the base substrate;
a fifth step for forming a conductor layer having a wiring pattern, on the insulating layer, inclusive of the inner walls of the via holes;
a sixth step for repeating steps similar to the second to fifth steps until the requisite number of wiring pattern layers is formed, and finally forming an insulating layer at the uppermost layer; and
a seventh step for forming, on the other surface of the base substrate, external connection terminals which are electrically connected with the wiring patterns on the base substrate through the base substrate.
8. The semiconductor device manufacturing method described in 7 above, wherein the seventh step comprises a step for dividing the structure such that one or more semiconductor elements are comprised inside each insulating layer, respectively.
9. The semiconductor device manufacturing method described in 7 above, wherein the seventh step comprises a step for dividing the structure such that two or more semiconductor elements are comprised inside each insulating layer, respectively.
10. The semiconductor device manufacturing method described in 7 above, wherein the via holes are formed by a laser beam machining in the fourth step.
11. The semiconductor device manufacturing method described in 7 above, wherein a photosensitive resin is used for the material of the insulating layer in the third step, and the via holes are formed by photolithography in the fourth step.
12. The semiconductor device manufacturing method described in 7 above, wherein, in the second step, the semiconductor elements and the wiring patterns corresponding thereto are electrically connected by flip chip mounting.
13. The semiconductor device manufacturing method described in 7 above, wherein, in the second step, the semiconductor elements and the wiring patterns corresponding thereto are electrically connected using an anisotropically conductive film.
With the semiconductor device described in 1 above, when a plurality of semiconductor elements is mounted in a single package, the configuration can be made reliable and compact, as a consequence of which it becomes possible to more effectively realize higher integration and higher functionality.
In the device described in 1 above, the wiring patterns need not all be on insulation layers. Nor do all of the semiconductor elements need be inside the insulation layers. Nor is it necessary that the wiring patterns all be electrically connected to each other. The present invention also comprehends such cases as these.
Accordingly, as indicated in 1, 2, and 3 above, all of the combinations, namely of an insulating layer or layers not containing a semiconductor element, of an insulating layer or layers containing only one semiconductor element, or of an insulating layer or layers containing a plurality of semiconductor elements, come within the scope of the present invention.
The present invention, furthermore, is particularly useful in cases where the semiconductor elements used are thin and the thickness required in the mountings thereof is thin, and flip chip mounting and anisotropically conductive film mounting are especially effective when the thickness of the semiconductor elements is 50 xcexcm or less.
The manufacture of the semiconductor device described in 1 above can be effected in stages as described in 7, and the via holes can be formed by laser beam machining or photolithography. When the final division into semiconductor devices is made, as described in 8 and 9 above, the division can be performed so that either one or more semiconductors are contained in each insulating layer.

Semiconductor device and manufacturing method therefor


A camera system and method are provided which are particularly well-suited for use in school buses for recording vehicles violating the stop-arm on the bus. The system and method provide advantages in terms of the ability to record both oncoming and upcoming vehicles relative to the bus that violate the stop-arm via one camera mounted to the bus and a redirecting mechanism disposed in the camera""s field of view. More particularly, the redirecting mechanism can be a prism having reflective surfaces mounted in front of the lens of the camera with the surfaces oriented to redirect images from forward and rearward of the stop-arm through the camera lens. A video recording mechanism records the images redirected through the lens. In a preferred form, a video display monitor displays the images redirected through the lens to the driver of the school bus.

The invention relates to an image recording system and, more particularly, to a video recording system for recording school bus stop-arm violations.
A typical school bus is equipped with a stop-arm that extends from the side of the school bus when the school bus is stopped and its door is opened to let people, usually children, on or off the bus. School buses can also be equipped with flashing lights on the front and rear of the bus that are activated when the school bus is stopped and its door is opened.
The stop-arm and flashers alert motorists that children are entering or exiting the school bus so that motorists can stop their vehicles to permit the children to cross the street if necessary. Motorists are also required to stop their vehicles by state motor vehicle laws. A serious hazard is created by motorists who disobey the stop-arm and flashers and continue traveling past the school bus as they endanger the safety of the children and violate the motor vehicle laws.
In an effort to record and monitor vehicles around school buses, a number of recording systems have been proposed. However, these prior recording systems face significant drawbacks in terms of the number of cameras they employ and the complexity of their installation and use which can drive up their costs and render them more difficult to install and use than is desirable.
U.S. Pat. No. 5,382,953 discloses a recording system that includes a sensor positioned on a school bus to detect vehicles violating an extended stop-arm. A camera is positioned on the exterior of the school bus toward its rear facing forwardly. In this manner, the camera only takes pictures of oncoming vehicles when the sensor, which is mounted at the front end of the bus, detects the vehicle. A detection mechanism detects the extension of the stop arm on the school bus. A control unit is operable with the sensor and the detection mechanism and provides a control signal for activating the camera upon receipt of signals from the detection mechanism that the stop-arm is extended and the sensor to indicate the presence of a vehicle in the violation zone. The camera then takes still photographs of the violating vehicle while it is adjacent to the school bus.
The recording system of U.S. Pat. No. 5,793,420 employs video cameras mounted on either side of a passenger vehicle, such as a school bus, for recording passing traffic as it is adjacent to the school bus. The cameras face either rearwardly or forwardly relative to the school bus to record passing vehicles and to record license plate numbers, respectively. A switching system is used that is responsive to detectors or a switching signal to determine which of the video cameras is in communication with the video recorder so as to select which view of passing traffic is recorded and displayed on a video screen in the school bus. Operator control over switching can be provided to allow the bus driver to switch between an interior camera and the external driver""s side camera.
U.S. Pat. No. 5,027,200 teaches a system for providing enhanced viewing coverage about a vehicle using multiple cameras mounted to the exterior of the vehicle like the school bus video camera system of the ""420 patent. To this end, the cameras are directed toward the direction in which viewing is desired. Accordingly, both systems suffer from the need to have several cameras to capture images from different fields of view with the complexity and cost disadvantages this entails.
The ""200 patent also discloses use of a split CRT screen fed by corresponding cameras on either side of the vehicle as opposed to separate screens associated with each camera. In this manner, viewing of images from two different fields of view is done by looking at a single screen. Nevertheless, two cameras are still needed to produce these images.
Accordingly, there is a need for a simpler and/or less expensive image recording system that maximizes the viewing coverage provided about a vehicle without requiring multiple cameras. More particularly, a system that simultaneously records images from different views about a school bus in a simple and inexpensive manner is desirable.
In accordance with the present invention, an image recording system is provided for recording images from different fields of view about a vehicle that maximizes the viewing area provided by a camera of the system. To this end, the present image recording system allows for use of a single camera to capture images from desired areas about the vehicle over the field of view provided by the camera lens. More particularly, the system is especially adapted for use with a school bus for simultaneously recording images forwardly and rearwardly of the bus. The system includes a video camera mounted to the bus and a redirecting mechanism in its field of view so that images of both oncoming vehicles forward of the bus and upcoming vehicles rearward of the bus are simultaneously recorded by the camera. When the school bus is stopped with its stop-arm extended, the camera is effective to record vehicles that fail to stop as required by law.
In one form of the invention, an image recording system is provided for simultaneously recording images in different fields of view. The image recording system includes a camera and a lens of the camera for receiving images in a predetermined field of view. A redirecting mechanism is disposed in the predetermined field of view. The redirecting mechanism simultaneously redirects images in at least two fields of view that are not in the predetermined field of view through the lens. An image recording mechanism of the camera transfers the simultaneously received images through the lens onto an image recording medium. Accordingly, the system herein allows the camera to record images from a greater field of view than that provided by its lens.
Herein, when referring to manipulation of images, e.g. redirecting, receiving, transmitting, recording, displaying, etc., it will be understood that this can mean manipulating representations of the images such as provided by image forming light, electronic signals, or the like.
In a preferred form, the lens has a central axis, and the redirecting mechanism includes light reflective surfaces at predetermined angles relative to the central axis for reflecting images from at least two fields of view off the surfaces and through the lens.
In another form, the redirecting mechanism includes a prism having light reflected surfaces thereon. Use of the prism to capture images from different fields of view is significantly less expensive and less complicated to implement than prior systems using multiple cameras for capturing images from different areas about a vehicle.
In one form, the camera is a video camera and the image recording mechanism includes video tape on which the simultaneously received images are recorded. In this manner, the recorded images can be viewed at a later time, such as for determining the identity of vehicles that violate traffic laws.
The video camera can include a tape speed control for adjusting the speed at which the video tape records images thereon.
The camera can be a video camera including a mount for attaching the camera to a vehicle. A monitor can be provided inside the vehicle for simultaneously displaying the images from the two fields of view. This allows the vehicle operator to easily see the images in the different fields of view by viewing of the monitor.
The monitor can include a screen having a section of the screen for displaying images from one of the two fields of view and another section of the screen for displaying images from the other of the two fields of view. The camera lens can face out laterally from the vehicle. The redirecting mechanism redirects images from forwardly and rearwardly directed fields of view relative to the vehicle for recording oncoming and upcoming other vehicles.
In another form of the invention, a video camera system for vehicles, such as school buses is provided that simultaneously records images of cars from different predetermined areas about the bus. The video camera system includes a video camera mounted to the bus for recording images received from a first area about the bus. An imaging redirecting mechanism is provided in the first area that redirects images from predetermined second and third areas about the bus to the video camera so that images from the different predetermined areas are simultaneously recorded by the video camera. The present system is advantageous in that it increases the coverage of that provided by a standard video camera to allow it to record images from a greater area about the bus. In particular, the system herein minimizes camera costs while still being effective to record school bus stop-arm violators.
In one form, the second and third areas are distinct from each other.
In another form, the second and third areas are forwardly and rearwardly of the bus for simultaneously recording oncoming and approaching vehicles, respectively, relative to the bus. In this manner, stop-arm violators that do not stop when the arm is extended will be recorded by the video camera of the present system irrespective of from which direction they pass the arm.
Preferably, the video camera is mounted to the bus to face laterally out therefrom, and the redirecting mechanism includes light reflective surfaces at predetermined positions relative to the camera such that images from either side of the camera are reflected thereto.
In another aspect of the invention, a method is provided for recording images from different fields of view. The method includes positioning a camera so that it has a selected field of view, providing an image reflector in the predetermined field of view of the camera, redirecting images with the image reflector to the camera from at least two fields of view different from the camera selected field of view, and recording the redirected images from the at least two fields of view with the camera.


The present invention provides methods and compositions for modulating levels of amyloid-β peptide (Aβ) exhibited by cells or tissues. The invention also provides pharmaceutical compositions and methods of screening for compounds that modulate Aβ levels. The invention also provides modulation of Aβ levels via selective modulation (e.g., inhibition) of ATP-dependent γ-secretase activity. The invention also provides methods of preventing, treating or ameliorating the symptoms of a disorder, including but not limited to an Aβ-related disorder, by administering a modulator of γ-secretase, including, but not limited to, a selective inhibitor of ATP-dependent γ-secretase activity or an agent that decreases the formation of active (or optimally active) γ-secretase. The invention also provides the use of inhibitors of ATP-dependent γ-secretase activity to prevent, treat or ameliorate the symptoms of Alzheimer's disease.

Amyloid-β (Aβ) peptides are metabolites of the Alzheimer's disease-associated precursor protein, β-amyloid precursor protein (APP), and are believed to be the major pathological determinants of Alzheimer's disease (AD). These peptides consist mainly of 40 to 42 amino acids, Aβ1-40 ("Aβ40") and Aβ1-42 ("Aβ42"), respectively. Aβ40 and Aβ42 are generated by two enzymatic cleavages occurring close to the C-terminus of APP. The enzymes responsible for the cleavage, β-secretase and γ-secretase, generate the—and C-termini of Aβ, respectively. The amino terminus of Aβ is formed by β-secretase cleavage between methionine residue 596 and aspartate residue 597 of APP (APP 695 isoform numbering) (see, e.g., U.S. Pat. No. 6,440,698; and U.S. Pat. No. 5,744,346).
γ-secretase activity cleaves at varying positions 38-, 40- or 43-residues C-terminal of this β-secretase cleavage to release Aβ peptides (for a review of γ-secretase and γ-secretase activity, see, e.g., U.S. Patent Application 20020025540). The complete molecular identity of γ-secretase enzyme is still unknown. Presenilin 1, or the closely related presenilin 2, is needed for γ-secretase activity. γ-secretase activity is reduced 80% in cultured cells derived from embryos genetically deleted for presenilin 1. All γ-secretase activity is lost in cells lacking both presenilin 1 and presenilin 2. Peptidomimetic inhibitors of γ-secretase activity can be crosslinked to presenilins 1 and 2, suggesting that these proteins are catalytic subunits for the cleavage. However, γ-secretase activity isolated from cells chromatographs as a large complex >1M daltons. Recent genetic studies have identified three more proteins required for γ-secretase activity; nicastrin, aph-1 and pen-1. (Francis et al., 2002, Developmental Cell 3(1): 85-97; Steiner et al., 2002, J. Biol. Chemistry: 277(42): 39062-39065; and Li et al., 2002, J. Neurochem. 82(6): 1540-1548). Accumulation of presenilin into high molecular weight complexes is altered in cells lacking these proteins.
A third enzyme, α-secretase, cleaves the precursor protein between the β- and γ-cleavage sites, thus precluding Aβ production and releasing an approximately 3 kDa peptide known as P3, which is non-pathological. Both β- and α-secretase cleavage also result in soluble, secreted—terminal fragments of APP, known as sAPPβ and sAPPα, respectively. The sAPPα fragment has been suggested to be neuroprotective.
In normal individuals, the Aβ peptide is found in two predominant forms, the majority Aβ-40 (also known as Aβ1-40) form and the minority Aβ42 (also known as Aβ1-42) form, each having a distinct COOH-terminus. The major histological lesions of AD are neuritic plaques and neurofibrillary tangles occurring in affected brain regions. Neuritic plaques consist of Aβ peptides, primarily Aβ40 and Aβ42. Although healthy neurons produce at least ten times more Aβ40 compared to Aβ42, plaques contain a larger proportion of the less soluble Aβ42. Patients with the most common form of familial Alzheimer's disease show an increase in the amount of the Aβ42 form. The Aβ40 form is not associated with early deposits of amyloid plaques. In contrast, the Aβ42 form accumulates early and predominantly in the parenchymal plaques and there is strong evidence that Aβ42 plays a major role in amyloid plaque deposits in familial Alzheimer's disease patients (Roher et al., 1993, Proc. Natl. Acad. Sci. USA 90:10836; Iwatasubo, T., et al., 1994 Neuron 13:45; Yamaguchi et al., 1995, Amyloid Int. J. Clin. Invest. 2:7-16; and Mann et al., 1996 Am. J. Pathol. 148:1257).
Neurofibrillary tangles consist of aggregated tau protein and their role in AD pathology is less clear. AD symptoms are most closely correlated with total brain Aβ rather than plaques. About 10% of AD cases result from autosomal dominant inheritance of mutations in either the APP or the presenilin 1 and presenilin 2 genes. In both cases, increased production of total Aβ or Aβ42 versus Aβ40 results. There is strong evidence that Aβ peptides are critical in the pathogenesis of Alzheimer's disease. Therefore, compositions which modulate the activity and/or levels of these peptides are desired.
For example, U.S. Patent Application 20020128319 A1 states that certain non-steroidal anti-inflammatory drugs (NSAIDS) lower production and/or levels of Aβ42 in cell cultures expressing Aβ40 and Aβ42 derived from the cleavage of APP. Since there is good evidence that high Aβ42 levels are a major risk factor for AD, such drugs may be useful in preventing, delaying or reversing the progression of AD. The drawback of the use of such drugs, however, is that large doses of NSAIDS are required for significant lowering of Aβ42, and significant gastrointestinal side effects, including bleeding ulcers, are associated with prolonged use of NSAIDS at high doses (Langman et al., 1994, Lancet 343: 1075-1078). In addition, there remains an unknown risk for Alzheimer's disease due to amyloid formation from Aβ40 and other forms unaffected by Aβ42 lowering agents.
There is, therefore, a need in the art to develop treatments for diseases or disorders related to the regulation of Aβ production. Furthermore, there is a need to develop methods of screening that can be used to identify compounds to treat such diseases or disorders.
Citation or identification of any reference in Section 2, or in any other section of this application, shall not be considered an admission that such reference is available as prior art to the present invention.

Compositions and methods for prevention and treatment of amyloid-β peptide-related disorders


A twine dispensing arm of a wrapping arrangement for a large round baler is provided with a dispensing end defined by a component which, at the time when twine wrapped about a bale is separated from a length of twine carried by the arm, prevents a length of recoiling twine from becoming entangled or incorrectly oriented for a subsequent wrapping cycle.

EP-A1-1 308 080 discloses a large round baler with a wrapping arrangement, that permits wrapping twine to reach a baling chamber through a slot from above. The wrapping twine is guided by means of a twine dispensing arm to the slot, as soon as the wrapping process is to begin, whereupon a free end section of the wrapping twine hanging downward is carried along by the bale moving in the baling chamber. As soon as the bale is wrapped sufficiently with wrapping twine, the twine is clamped briefly, so that it is drawn into the surface of the cylindrical bale and is subsequently cut. Since the wrapping twine is under high tension immediately before the cut, it recoils after the cut and is thrown upward.
The problem to be solved is seen in the fact that the free end of the wrapping twine wraps itself around the twine dispensing arm after the cutting process on the basis of its inherent elasticity or it takes on a shape bent upward, which finally leads to the fact that the wrapping twine no longer reaches through the slot and the wrapping process is not triggered.

Twine dispensing arm of a bale wrapping arrangement of large round baler


A method of repairing a native cardiac valve such as the aortic valve includes positioning a cardiac valve prosthesis at an implantation site proximate the native cardiac valve to be repaired. The cardiac valve prosthesis includes an armature and a plurality of prosthetic valve leaflets, the armature including first and second annular elements, a plurality of anchor members extending between the first and second annular elements, and a plurality of valve support members extending from at least one of the first and second annular elements, the plurality of prosthetic valve leaflets being coupled to and supported by the valve support members. The method further includes radially expanding the cardiac valve prosthesis such that each of the anchor members arches radially outward from the first annular element to the second annular element and engages a wall of a respective one of a plurality of native Valsalva sinuses located distal to the native cardiac valve so as to enable anchorage of the cardiac valve prosthesis at the implantation site.

Recently, there has been increasing consideration given to the possibility of using, as an alternative to traditional cardiac-valve prostheses, valves designed to be implanted using minimally-invasive surgical techniques or endovascular delivery (the so-called "percutaneous valves"). Implantation of a percutaneous valve (or implantation using thoracic-microsurgery techniques) is a far less invasive act than the surgical operation required for implanting traditional cardiac-valve prostheses. Further details of exemplary percutaneous implantation techniques are provided in U.S. Publication 2002/0042651, U.S. Pat. No. 3,671,979, and U.S. Pat. No. 5,954,766, which are hereby incorporated by reference.
These prosthetic valves typically include an anchoring structure, which is able to support and fix the valve prosthesis in the implantation position, and prosthetic valve elements, generally in the form of leaflets or flaps, which are stably connected to the anchoring structure and are able to regulate blood flow.
Furthermore, the methods of implantation of valves via a percutaneous route or by means of thoracic microsurgery are very frequently irrespective of the effective removal of the natural valve leaflets. Instead, the cardiac valve may be introduced in a position corresponding to the natural annulus and deployed in situ by simply divaricating definitively the natural valve leaflets.
There is a need for a percutaneous valve that does not run the risk of being displaced (dislodged) with respect to the implantation position, as a result of the hydraulic thrust exerted by the blood flow. There is a further need for a percutaneous valve that secures tightly to the flow duct generally defined by the natural valve annulus, such that it resists blood flow around the outside of the percutaneous valve structure.

This patent is subject to a terminal disclaimer.