A process for manufacturing integrated circuits comprising insulated gate MOS transistors and double gate memory components, comprises the following steps: forming on the areas where the memory components will be formed a first insulating layer (2) and a first gate level (4); forming on the transistor areas and the memory areas a second insulating layer (5), a second gate level (6) and a first photoresist layer (7); etching the first photoresist layer and the second gate level according to chosen configurations; coating the transistor areas with a second photoresist layer (20). This process further comprises the following steps: selectively etching the second photoresist layer at the center of the places where the transistor drains and sources are to be formed; etching the apparent oxide areas and then the apparent gate and substrate areas; removing the second photoresist layer; and carrying out an ionic implantation of the drains and sources.

The instant invention relates to a process for manufacturing integrated circuits comprising, on the one hand, insulated gate MOS transistors provided with one gate level and, on the other hand, components provided with at least two gate levels, integrated on the same semiconductor substrate.
FIGS. 1A to 1F show the conventional manufacturing steps of an integrated circuit comprising, on the one hand, a MOS transistor on the left part of the figure and, on the other hand, a double gate component, for example a memory.
FIG. 1A shows an initial step of the process wherein, on a semiconductor substrate 1, for example a silicon substrate, one has formed, on the one hand, a thin layer of silicon oxide (hereinafter called oxide for the sake of simplicity) 2 and, on the other hand, a layer of thick oxide 3 designed to insulate two components one from the other.
During the step illustrated in FIG. 1B, one has formed above the structure a first polycrystalline silicon layer 4, a second layer of thin oxide (or another electrical insulator) 5, a second layer of polycrystalline silicon 6 coated with a resist mask 7, the structure being represented after photoetching of the resist mask 7 and of the second layer of the polycrystalline silicon 6 for delineating the upper gate of the memory type component and the FET gate.
During the step illustrated in FIG. 1C, one uses as a mask the openings previously formed for etching the oxide layer 5 and leaving in place a portion of the oxide layer 8 between the two gates of the memory type component and a portion of the oxide layer 9 under the MOS transistor gate. Besides, it will be noted that the oxide layer 9 remaining on the MOS transistor may result from a portion of the layer 2 formed during the step shown in FIG. 1A or from a portion of the layer 5 formed during the step shown in FIG. 1B, depending on whether the portion on which one forms the MOS transistor has been masked or not during either of the oxidation steps.
During the step illustrated in FIG. 1D, the photoetching of the first level of polycrystalline silicon 4 is shown, the etchings previously carried out being used as a mask. It will be noted that during this etching phase one etches, on the one hand, as it is deemed desirable, the polycrystalline silicon 4 and, on the other hand, the silicon substrate apparent on the MOS transistor whereby recesses 10 are formed in this substrate on both sides of the gate area of this MOS transistor.
Then, as shown in FIG. 1E, the oxide layer 2 is etched out. It will be noted that, during this etching phase, one overetches the silicon layers 8 and 9 previously etched under the polycrystalline silicon areas 6. In FIG. 1E, the upper resist layer 7, which besides could have been removed during the step represented in FIG. 1D according to some technologies, is no longer shown.
After the step illustrated in FIG. 1E, doping steps are generally carried out, usually by means of ionic implantation, for forming the source and drain regions of the components. Before or after this step, a thermal oxidation step will also be carried out for laterally insulating the gates.
FIG. 1F shows an enlarged although schematic view of the gate area of the MOS transistor after a reoxidation phase. Due to the presence of overetchings in the oxide layer 9, during the reoxidation phase, a dilatation of the oxide layer will occur as well as a raising of the gate edges. The same phenomenon occurs for the upper gate layer 6 of the memory type component. This raising phenomenon of the gate area presents a quite specific drawback when it relates to a MOS transistor because the threshold voltages are therefore not precisely determined due to the fact that improperly determined voltages are applied on the limits of the transistor channel area. The drawback is less important as regards the upper gate of the memory type component since the transfer phenomena which are produced between said gate and the underlying gate are not specifically correlated with the lateral fields.
Another drawback of the process according to FIG. 1E is due to the fact that, during the drain and source doping steps of the MOS transistor, because of the presence of the recess 10 in the drain and source areas, the resulting doping profile will not be precisely controlled at the limits of the channel area.
Thus, an object of the instant invention is to provide for a process for manufacturing an integrated circuit simultaneously comprising MOS transistors and multi-gate components avoiding the drawbacks of the prior art such as hereinabove described.
In order to achieve this purpose, the instant invention provides for a process for manufacturing integrated circuits comprising insulated gate MOS transistors and components provided with at least a double gate component on a semiconductor substrate, comprising the steps consisting in insulating by means of insulating regions the areas wherein the various components will be formed forming a first insulating layer and a first gate level on the areas where the multi-gate components will be formed ; forming on the transistor areas and the multi-gate areas a second insulating layer, at least a second gate level and a first level of photoresist ; etching the first layer of photoresist and the second gate level according to the configurations chosen in the transistor areas and in the multi-gate ; areas coating the transistor areas with a second layer of photoresist ; selectively etching the second layer of photoresist in the center of the places where the drains and sources of the transistors are to be formed ; etching the apparent oxide areas, then the apparent gate and substrate areas ; removing the second layer of photoresist ; and carrying out an ionic drain and source implantation in one single step, possibly preceded by a thermal step.
An advantage obtained by this process is that there is no longer any raising phenomenon of the gate such as hereinabove described more particularly in connection with FIG. 1F and, moreover, as it will be seen hereinafter, a profile particularly interesting for the gate and drain areas is obtained in one single implantation step, this profile being usually designated by LDD (low drain diffusion), to indicate there is a shallower doping area at the channel limits and a deeper and more highly doped area at the places where the drain and source contacts will be established.
Another advantage of this manufacturing process is, during the doping step, that the diffusion depth is limited to the boundaries of the field oxide areas, which permits to obtain MOS transistors operating at a higher voltage.

Manufacturing process for an integrated circuit comprising double gate components


A boat storage canopy fitted to a boat storage lift has an entry portion, raised center portion and shore side portion with downwardly depending curtains on first and second sides and the shore side end with a hinged curtain at the entry end.

1. Field of the Invention
The invention is a boat storage canopy and apparatus adapted to lift and provide dry storage for a boat having a wakeboard tower or other elevated midships structure.
2. Description of Related Art
Boat houses and canopies raised above the water surface are known for the weather protection of a boat and permit a floating boat to enter and exit. Boat lifts, hoists and the like are known and permit a boat to be lifted from the water's surface for dry storage, maintenance and the like. Lifts are known to be used in boathouses and to have canopies fitted or otherwise used in conjunction with mooring or storage structures.
While various flat, peaked or curved roofs, when looking at a transverse section, are known, substantially all the length is of uniform height having a horizontal ridge or equivalent.
Horizontal ridge canopies or roofs when used to receive a boat having an elevated superstructure such as a wakeboard tower, flying bridge, radar arch or the like have to be mounted with a vertical dimension adequate to permit ingress and egress. Traditionally, boat canopies have been either flat topped or barn roof type of structures that either do not provide sufficient protection because the boat cannot be raised high enough with a wakeboard tower in place or are structurally demanding, provide high windage and are aesthetically unpleasing. Simply elevating the flat canopy or roof will either leave substantial portions of the boat exposed to weather, such as driving rain, or will require extensively downwardly extending walls or curtains thereby requiring additional structure with incumbent additional expense, complexity and windage.

Boat storage canopy apparatus for boats with wake board towers


A carpet mat is produced for use on a floor carpet. The carpet mat is comprised of a carpet component with at least one gripping member of its underside. The gripping member is a thin plate having a first set of vertically extending protrusions which extend into a fibrous portion of the carpet component. Substantially all the tips of the protrusions are distorted in a random fashion to interlock with the fibrous portion of the carpet component to cause a permanent attachment thereto. A second set of vertically extending protrusions extend from an opposite side of the thin plate and are for the purpose of interacting with the floor carpet to prevent a shifting of the carpet mat when placed onto the floor carpet.

Carpets are found in the home, commercial establishments, and motor vehicles such as automobiles, vans and even some trucks. The carpet provides a pleasing appearance, but also adds comfort, warmth and improved acoustic characteristics. It can be subjected to constant foot traffic. It is quite usual for a small area of the carpet to receive substantially more wear and tear than other areas. For instance, a carpeted room in a house will usually have a certain traffic pattern depending on where doors and other entrance ways are located. A hallway will receive much more traffic than an edge of a room away from doors and windows. Rooms and hallways in commercial establishments also will have certain established traffic patterns. Carpets in motor vehicles will have developed a localized heavy usage also, particularly in the foot well of the driver's side of the vehicle.
It is possible to even-out wear on a carpet by rotating it or even shifting its room locale if feasible. Wall to wall carpet and motor vehicle carpet, however, are permanently installed in one position. When one area of the carpet shows excessive wear and tear, it is necessary to discard the whole carpet.
Carpet mats of various shapes have been designed to provide a measure of protection to those areas of an underlying carpet which receive the most traffic. Thus, floor runners have been used in hallways. Foot mats have been used near an outside door. Car mats have been used for placement in the vehicle's front foot wells and even in the rear foot wells. The mats are typically made of a low quality carpet material which is itself discarded and replaced when necessary.
A problem inherent with a carpet mat used on a carpet is its tendency to slip. A carpet mat often has a smooth backing. The carpet will have a fibrous surface. The smooth backing of the mat on the fibrous surface of the carpet is very conducive to slippage during use. The problem is well recognized. Different solutions have been used. For instance, a mat with a roughened back side has been used. A mat with a low slip backing such as a foam layer has been used. Double-sided carpet tapes have also been used.
One carpet mat which has met with limited success has a backing with a set of vertically extending protrusions. The protrusions extend into the fibrous portion of the carpet being protected. They physically interact to prevent the mat from moving in a lateral direction. A particular problem with this type of gripping member is the initial positioning of the protrusions on the mat's underside. If the mat has a heavy plastic backing, the protrusions are simply included in the backing's mold design. This represents an added cost. Additionally, many carpet mats of various qualities are designed without a plastic backing and necessarily present no economical means for inclusion of the protrusions.
There has now been developed a carpet mat with an improved gripping member on its underside. The carpet mat of the invention is produced in an economical fashion without extensive capital costs or labor needs. The mat is capable of retaining its position when used on different carpets without damaging the carpet.

Carpet mat with improved gripping surface


A method includes placing a plurality of bottom units onto a jig, wherein the plurality of bottom units is not sawed apart and forms an integrated component. Each of the plurality of bottom units includes a package substrate and a die bonded to the package substrate. A plurality of upper component stacks is placed onto the plurality of bottom units, wherein solder balls are located between the plurality of upper component and the plurality of bottom units. A reflow is performed to join the plurality of upper component stacks with respective ones of the plurality of bottom units through the solder balls.

In the packaging of integrated circuits, dies may be packaged onto a package substrate (sometimes known as a laminate substrate), which includes metal connections that may route electrical signals between opposite sides of the laminate substrate. The dies may be bonded onto one side of a laminate substrate using flip chip bonding, and a reflow is performed to melt the solder bumps that interconnect the dies and the laminate substrate. Laminate substrates may be used in package-on-package structures and system-in-package structures.
In a conventional packaging and testing process, a plurality of known-good-dies that is sawed from a wafer is first bonded on a package substrate strip, which comprises a plurality of package substrates therein. The bonding may be a flip chip bonding. Underfill is then dispensed into the gaps between the known-good-dies and the package substrates. Solder balls are also placed on the package substrate strip, and are reflowed. The package substrate strip is then separated into a plurality of units, wherein each of the resulting units has a known-good-die and a single package substrate.
A first function test is performed on the plurality of units to find failed units. Next, each of the plurality of units that passes the first function test is placed on a jig that has the size to fit one unit. An upper component stack may then be placed on the unit. The upper component stack may be a package that includes an additional die and additional package substrate.
Next, the jig, the unit, and the upper component stack go through a reflow process, so that the upper component stack is bonded with the unit to form a package. A second function test may then be performed on the resulting package to determine the quality of the resulting package.
With the increasing down scaling of integrated circuits, the units comprising the packages and the overlying dies also become increasing smaller. This requires that the size of the corresponding jig to be small. The small jigs are difficult to handle during the step of bonding the upper component stacks to the units. This results in a low throughput and possibly a low yield.

Packaging and function tests for package-on-package and system-in-package structures

Taiwan Semiconductor Manufacturing Company, Ltd.


A holder for sustaining a handheld electronic device is provided. The holder includes a sucker and a positioning device. The sucker has a central and peripheral portion. The positioning device, which is disposed on a side of the sucker, comprises a housing, a ball, a clamping assembly and a rod. The housing is disposed on the sucker and has a receiving space for the ball and the clamping assembly. The rod has a first end connecting to the central portion of the sucker and a second end extending towards the receiving space. When the rod is led to position the sucker onto an object, the clamping assembly is adapted to restrict the ball simultaneously.

1. Field of the Invention
The present application relates to a holder, and more particularly, to a holder for sustaining a handheld electronic device.
2. Descriptions of the Related Art
Driven by the advancement in science and technology as well as the demands of various applications, electronic devices with various functions such as mobile phones, global positioning system (GPS) devices, audio & video players and the like have become increasingly popular and are becoming smaller for portability. If an electronic device is to be used by a user at irregular times on a non-continuous basis, the electronic device will need to be disposed near the user for use at any time, an example of which is the GPS device that is used during traveling. In such a case, an appropriate holder becomes necessary for disposing the electronic device at a specific location in a configuration that facilitates operation.
A conventional holder typically has an end thereof adsorbed to a specific surface by means of a sucker or the like, leaving the other end for placement of the electronic device. To facilitate the adjustment of the displaying angle of the electronic device by the user, an angle adjustment and locking mechanism is provided at a position on the holder that engages with the electronic device. In other words, the user must have the holder attached first before adjusting the position of the electronic device. Hence, such a holder is still inconvenient for use.


In accordance with an embodiment, a method for inspecting pipe is provided. The method includes transmitting an ultrasound pulse through a pipe or a fluid container from inside the pipe or the fluid container. The method further includes receiving echoes via a plurality of sensors, based on the ultrasound pulse, and combining echo data from the plurality of sensors. The method additionally includes deriving an environmental assessment based on the combining the echo data.

Certain equipment and facilities utilize pipeline systems having pipes or conduits to transport fluids or products, e.g. hydrocarbonic fluids, over distances. However, certain products may leak out of the pipes, leading to product loss, corrosion, pitting, and other unwanted conditions. Visual inspection of the pipe leakage may be very difficult. In some pipeline systems, the pipe may include long "runs" having, tens, hundreds, if not thousands of miles. The need thus exists for improved systems and methods for inspecting for certain conditions and anomalies within a pipeline system.

Combined pulse echo inspection of pipeline systems


The present invention provides a system, method, and computer-readable medium that adjusts pointer movement when an input device causes the pointer to intersect one or more alignment areas. Pointer movement is adjusted in the alignment areas to allow users to easily align GUI objects. The adjusted pointer movement is not proportional to input received from an input device. Instead alignment areas have “friction” in that the pointer is less responsive to input compared to other areas of the computer display.

A great number of computer devices (e.g., personal computer, personal digital assistants ("PDAs"), cellular telephones, etc.) employ a graphical user interface (hereinafter "GUI") to interact with users. A GUI is an input/output (I/O) system characterized by the use of graphics on a computer display to communicate with a computer user. Frequently, the user employs an input device, such as a mouse or trackball, to manipulate and relocate a pointer on the computer display. When a user activates or "clicks" the input device while the pointer is at a designated position on the display, information is input into a computer device. Accordingly, a user does not need to memorize commands or have a knowledge of keyboard typing to provide input to the computer device.
A GUI generally presents graphical display elements (hereinafter "GUI objects") as two-dimensional images of pixels on a computer display. Often, users want to align GUI objects in order to perform a desired function or create documents with specific characteristics. For example, to create a document with a professional appearance, users may want to align GUI objects at the same vertical or horizontal position. One alignment task that is particularly common is "stacking" GUI objects so they are aligned in succession on a computer display.
Frequently, users align GUI objects using a "click and drag" technique where a single pointer event such as a button click selects the GUI object. Once the GUI object is selected, the pointer moves the GUI object to a new location where a second pointer event places the GUI object. Using dragging, aligning two or more GUI objects is often difficult to accomplish, leading to frustration and lowered productivity. In some instances, users with diminished visual or physical abilities, or lack of training have difficulty correctly positioning the dragged object. In other instances, pointer positioning difficulty may be attributable to the computer device.
An inability to place an object at a specific location on a computer display creates problems because the desired function may not easily be performed. Instead, the user may need to repetitively re-adjust the pointer to perform the desired function. Systems have been developed that improve on the "click and drag" technique used to align GUI objects. For example, some systems support a "snapping" option where a GUI object is automatically moved (i.e., snapped) when positioned within a predetermined distance relative to an aligned coordinate position. A drawback to this approach is that GUI objects may not be positioned less than the predetermined distance from the aligned coordinate position. Stated differently, a user may not place a GUI object close to, but not at, the aligned coordinate position without the object "snapping" to the aligned coordinate position. Another drawback to this approach is that a user must activate the snapping option by, for example, selecting a menu item from a pull-down menu. Some users may not know that options such as "snapping" are available, and may continue to use the "click and drag" technique. As described above, this approach leads to frustration because users are often required to repetitively re-adjust the position of the pointer in order to accurately place the object being dragged.
What is needed is a system and method for aligning GUI objects that allows placement of GUI objects at any location on a computer display. Desirably, the system and method should be easy to use and not require knowledge or training on the part of the user. The present invention addresses these needs and other shortcomings that currently exist.

System and method for aligning objects using non-linear pointer movement


A guiding catheter system employs a flexible shaft having a preformed bend at a distal end. An ultrasound transducer is mounted proximal to the pre-formed bend. The ultrasound transducer has a field of view directed to a distal tip of the guiding catheter. The guiding catheter includes an open lumen adapted for the introduction of payloads through the catheter system. The guiding catheter system can be used to direct a smaller guiding catheter or guide wire into a destination vessel from a heart chamber. In one application, the guiding catheter system is used to introduce a guiding catheter into the coronary sinus ostium from the right atrium.

Guiding catheters are instruments that allow a physician to locate and cannulate vessels in a patient's heart for performing various medical procedures, including venography and implanting of cardiac pacing devices. Cannulating heart vessels requires navigating a small diameter, flexible guide through convoluted vasculature into a heart chamber, and then into a destination heart vessel. Once the destination heart vessel is reached, the catheter acts as a conduit for insertion of payloads into the vessel.
A pre-shaped guiding catheter is typically used to locate the destination vessel. A fixed shape catheter is adequate in many cases where the pathway is not significantly convoluted and the pathway does not deviate significantly between patients. In situations where structural anomalies or significant variations exist, use of a fixed shape catheter may require that the clinician stock multiple size and shapes of catheters to account for potential variations. In many applications, however, the simple and familiar pre-shaped catheter makes it the preferred tool of choice.
The major goal of a guiding catheter procedure is to find and cannulate a vessel of interest in the least amount of time. Finding and cannulating the coronary sinus, for example, can become a time consuming, trial and error procedure even in a healthy patient. Patients exhibiting symptoms of advanced heart disease can have blockages or deformations of heart structure, further complicating the task of locating the ostium.
Some common techniques are used to aid the physician in visualizing the distal end of a guiding catheter during cannulation. These techniques include the procedures of angiography and venography. The procedures involve injecting a radio-opaque dye into the bloodstream to X-ray map blood vessels. Typically, the catheter is radio-opaque as well in order to be clearly located. Although effective, this method requires exposing the patient to radiation, and therefore exposure times are necessarily limited. Further, injection of the dye can cause local thrombophlebitis, though this is now rare with modern contrast agents.
Another approach used in assisting catheter guidance is endoscopy, a technique using a fiber optic camera to visualize the blood vessel interior. This method can be effective, but is expensive and is not always adaptable to the geometries required of a guiding catheter intended for applications such as right heart access.
There is a need for an improved guiding catheter for accessing heart vessels that can be easily guided by a clinician through a convoluted pathway. There is a further need for a catheter that provides an inexpensive and safe way to visualize the location of the catheter tip relative to an opening of a destination vessel during a cannulation procedure. The present invention fulfills these and other needs, and addresses other deficiencies of prior art implementations and techniques.

Ultrasound directed guiding catheter system and method


A liquid edible dip that includes a first lactose-based composition, a second lactose-based composition, at least one spice, and a cucumber extract based bitter-blocking agent that can block the bitter tastes present in certain edible foods. The cucumber extract based bitter-blocking agent can modify, reduce, or block the bitter taste present in some edible foods. The first lactose-based composition may be a strained yogurt and the second lactose-based composition may be an evaporated milk powder.

Current dips and sauces present in the market contain numerous ingredients to add or enhance flavor of edible foods that are consumed with the dips or sauces. These conventional dips and sauces are made only to add flavor to the edible foods they are eaten with. However, the currently available dips or sauces are unable to modify the taste of the edible foods.
Some edible foods high in nutritious value, such as, for example, raw vegetables, have an undesirable, bitter taste. Conventional dips and sauces may add flavor to this taste but cannot modify it. Accordingly, there exists a need for a dip that can add flavor and at the same time modify, alter, or reduce the bitter taste present in bitter edible foods.

Bitter-blocking agent and process for making same


The present invention provides stretchable, and optionally printable, semiconductors and electronic circuits capable of providing good performance when stretched, compressed, flexed or otherwise deformed. Stretchable semiconductors and electronic circuits of the present invention preferred for some applications are flexible, in addition to being stretchable, and thus are capable of significant elongation, flexing, bending or other deformation along one or more axes. Further, stretchable semiconductors and electronic circuits of the present invention may be adapted to a wide range of device configurations to provide fully flexible electronic and optoelectronic devices.

Since the first demonstration of a printed, all polymer transistor in 1994, a great deal of interest has been directed at a potential new class of electronic systems comprising flexible integrated electronic devices on plastic substrates. [Garnier, F., Hajlaoui, R., Yassar, A. and Srivastava, P., Science, Vol. 265, pgs 1684-1686] Recently, substantial research has been directed toward developing new solution processable materials for conductors, dielectrics and semiconductors elements for flexible plastic electronic devices. Progress in the field of flexible electronics, however, is not only driven by the development of new solution processable materials but also by new device component geometries, efficient device and device component processing methods and high resolution patterning techniques applicable to plastic substrates. It is expected that such materials, device configurations and fabrication methods will play an essential role in the rapidly emerging new class of flexible integrated electronic devices, systems and circuits.
Interest in the field of flexible electronics arises out of several important advantages provided by this technology. First, the mechanical ruggedness of plastic substrate materials provides electronic devices less susceptible to damage and/or electronic performance degradation caused by mechanical stress. Second, the inherent flexibility of these substrate materials allows them to be integrated into many shapes providing for a large number of useful device configurations not possible with brittle conventional silicon based electronic devices. Finally, the combination of solution processable component materials and plastic substrates enables fabrication by continuous, high speed, printing techniques capable of generating electronic devices over large substrate areas at low cost.
The design and fabrication of flexible electronic devices exhibiting good electronic performance, however, present a number of significant challenges. First, the well developed methods of making conventional silicon based electronic devices are incompatible with most plastic materials. For example, traditional high quality inorganic semiconductor components, such as single crystalline silicon or germanium semiconductors, are typically processed by growing thin films at temperatures (>1000 degrees Celsius) that significantly exceed the melting or decomposition temperatures of most plastic substrates. In addition, most inorganic semiconductors are not intrinsically soluble in convenient solvents that would allow for solution based processing and delivery. Second, although many amorphous silicon, organic or hybrid organic-inorganic semiconductors are compatible with incorporation into plastic substrates and can be processed at relatively low temperatures, these materials do not have electronic properties capable of providing integrated electronic devices capable of good electronic performance. For example, thin film transistors having semiconductor elements made of these materials exhibit field effect mobilities approximately three orders of magnitude less than complementary single crystalline silicon based devices. As a result of these limitations, flexible electronic devices are presently limited to specific applications not requiring high performance, such as use in switching elements for active matrix flat panel displays with non-emissive pixels and in light emitting diodes.
Progress has recently been made in extending the electronic performance capabilities of integrated electronic devices on plastic substrates to expand their applicability to a wider range of electronics applications. For example, several new thin film transistor (TFT) designs have emerged that are compatible with processing on plastic substrate materials and exhibit significantly higher device performance characteristics than thin film transistors having amorphous silicon, organic or hybrid organic-inorganic semiconductor elements. One class of higher performing flexible electronic devices is based on polycrystalline silicon thin film semiconductor elements fabricated by pulse laser annealing of amorphous silicon thin films. While this class of flexible electronic devices provides enhanced device electronic performance characteristics, use of pulsed laser annealing limits the ease and flexibility of fabrication of such devices, thereby significantly increasing costs. Another promising new class of higher performing flexible electronic devices is devices that employ solution processable nanoscale materials, such as nanowires, nanoribbons, nanoparticles and carbon nanotubes, as active functional components in a number of macroelectronic and microelectronic devices.
Use of discrete single crystalline nanowires or nanoribbons has been evaluated as a possible means of providing printable electronic devices on plastic substrates that exhibit enhanced device performance characteristics. Duan et al. describe thin film transistor designs having a plurality of selectively oriented single crystalline silicon nanowires or CdS nanoribbons as semiconducting channels [Duan, X., Niu, C., Sahl, V., Chen, J., Parce, J., Empedocles, S, and Goldman, J., Nature, Vol. 425, pgs, 274-278]. The authors report a fabrication process allegedly compatible with solution processing on plastic substrates in which single crystalline silicon nanowires or CdS nanoribbons having thicknesses less than or equal to 150 nanometers are dispersed into solution and assembled onto the surface of a substrate using flow-directed alignment methods to produce the semiconducting element of at thin film transistor. An optical micrograph provided by the authors suggests that the disclosed fabrication process prepares a monolayer of nanowires or nanoribbons in a substantially parallel orientation and spaced apart by about 500 nanometers to about 1,000 nanometers. Although the authors report relatively high intrinsic field affect mobilities for individual nanowires or nanoribbons (≈119 cm2 V−1 s−1), the overall device field effect mobility has recently been determined to be "approximately two orders of magnitude smaller" than the intrinsic field affect mobility value reported by Duan et al. [Mitzi, D. B, Kosbar, L. L., Murray, C. E., Copel, M. Afzali, A., Nature, Vol. 428, pgs. 299-303]. This device field effect mobility is several orders of magnitude lower than the device field effect mobilities of conventional single crystalline inorganic thin film transistors, and is likely due to practical challenges in aligning, densely packing and electrically contacting discrete nanowires or nanoribbons using the methods and device configurations disclosed in Duan et al. Use of nanocrystal solutions as precursors to polycrystalline inorganic semiconductor thin films has also been explored as a possible means of providing printable electronic devices on plastic substrates that exhibit higher device performance characteristics. Ridley et al. disclose a solution processing fabrication method wherein a solution cadmium selenide nanocrystals having dimensions of about 2 nanometers is processed at plastic compatible temperatures to provide a semiconductor element for a field effect transistor. [Ridley, B. A., Nivi, B. and Jacobson, J. M., Science, Vo. 286, 746-749 (1999)] The authors report a method wherein low temperature grain growth in a nanocrystal solution of cadmium selenide provides single crystal areas encompassing hundreds of nanocrystals. Although Ridley et al. report improved electronic properties relative to comparable devices having organic semiconductor elements, the device mobilities achieved by these techniques (≈1 cm2V−1 s−1) are several orders of magnitude lower than the device field effect mobilities of conventional single crystalline inorganic thin film transistors. Limits on the field effect mobilities achieved by the device configurations and fabrication methods of Ridley et al. are likely to arise from the electrical contact established between individual nanoparticles. Particularly, the use of organic end groups to stabilize nanocrystal solutions and prevent agglomeration may impede establishing good electrical contact between adjacent nanoparticles that is necessary for providing high device field effect mobilities.
Although Duan et al. and Ridley et al. provide methods for fabricating thin film transistors on plastic substrates, the device configurations described are transistors comprising mechanically rigid device components, such as electrodes, semiconductors and/or dielectrics. Selection of a plastic substrate with good mechanical properties may provide electronic devices capable of performing in flexed or distorted orientations, however, such deformation is expected to generate mechanical strain on the individual rigid transistor device components. This mechanical strain may induce damage to individual components, for example by cracking, and also may degrade or disrupt electrical contact between device components.
Moreover, it is unclear if the plastic substrate-based electronic systems developed by Duan et al., Ridley et al. and others provide mechanical extensibility necessary for many important device applications, including flexible sensor arrays, electronic paper, and wearable electronic devices. While these groups demonstrate electronic devices having the ability to undergo deformation caused by flexing, it is unlikely that these plastic substrate-based systems are capable of stretching appreciably without damage, mechanical failure or significant degradation in device performance. Therefore, it is unlikely that these systems are capable of deformation caused by expansion or compression, or capable of deformation required to conformally cover highly contoured surfaces, such as curved surfaces having a large radius of curvature.
As discussed above, progress in the field of flexible electronics is expected to play a critical role in a number of important emerging and established technologies. The success of these applications of flexible electronics technology depends strongly, however, on the continued development of new materials, device configurations and commercially feasible fabrication pathways for making integrated electronic circuits and devices exhibiting good electronic, mechanical and optical properties in flexed, deformed and bent conformations. Particularly, high performance, mechanically extensible materials and device configurations are needed exhibiting useful electronic and mechanical properties in stretched or contracted conformations.

Stretchable form of single crystal silicon for high performance electronics on rubber substrates

The Board of Trustees of the University of Illinois


The invention is directed to a magnetic eyeglasses holder that includes a support and a magnet. The support includes an upright member and a base. The magnet allows for attractive magnetic communication with at least one temple bar of an eyeglasses such that when folded the eyeglasses are held in place on the holder. The magnet can be positioned at least partially within at least one recess in the upright member or on the surface of the upright member. The magnet can be fixed or removably positioned in at least one recess and/or the surface of the upright member.

Typical eyeglasses consist of a frame body that houses two lenses on either side of a nose piece. Attached to the frame body are two temple bars that extend from two ends of the frame body. The temple bars pivot between an open position perpendicular with the frame body and a closed position parallel with the frame body. Sometimes attached to the temple bars are separate ear pieces, or temple tips. The temple bars and nose piece support the frame on the head of the wearer.
Individuals often remove their eyeglasses during the course of the day. They may hang them around their neck where they bounce against their chest, they may put them in a pocket and have them fall out or they may put them in a place where they can get damaged. Especially when individuals go to bed at night, they may put down their eyeglasses somewhere and not recall where the next morning when they need them.
To solve this problem, the prior art teaches a variety of eyeglass holders, including stand-alone and eyeglass holders which are fixed to a solid surface. However, unlike the present invention, none of these eyeglass holders include a magnetic means of holding the eyeglasses.
The use of magnets on eyeglass frames for various purposes is also well known in the art. For example, a number of eyeglass frames have magnets that magnetize the wearer for health benefits. Other eyeglass frames use magnets to hold eyeglass frame sections together, thereby facilitating disassembly and reassembly in a new configuration, with auxiliary frames, lenses, or the like.


A method for detecting objects comprising radiation-absorbent material includes transmitting signals of two different frequencies to a target location and receiving an intermodulation product from the target location. The signals are transmitted via separate antennas connected with respective transmitters. The intermodulation product is received by a receiving antenna connected with a receiver and arranged to receive the intermodulation product reradiated from the target location. The intermodulation product comprises a harmonic of the two signals.

Radiation-absorbent materials are a class of materials used in stealth technology and included coatings to disguise vehicles or structures from radar detection. A radiation-absorbent material is a material that has been specially designed and shaped to absorb incident radiation from a ground or air based radar station into the coating and convert it to heat rather than reflect the radiation back for detection by the radar station. The absorbency of a material at a given frequency of radio wave depends upon the composition of the material, and a given composition will have greater absorbency at some frequencies than others. While radiation-absorbent material cannot perfectly absorb radio waves at any frequency, a radiation-absorbent material applied to an object can significantly reduce the radar cross-section of the object in specific frequencies.

System and method for detecting vehicles and structures including stealth aircraft


A saw having an angle adjustable blade includes a handle and a blade. The handle includes a body and a ratchet structure. The ratchet structure includes a positioning member and a ratchet rod. Thus, the angle of the blade relative to the handle may be adjusted arbitrarily by rotating the blade relative to the handle, without having to change and adjust the angle of the handle, thereby facilitating the user operating the handle, and thereby preventing the user""s wrist from being hurt.

1. Field of the Invention
The present invention relates to a saw having an angle adjustable blade, and more particularly to a saw having an angle adjustable blade, wherein the angle of the blade relative to the handle may be adjusted arbitrarily by rotating the blade relative to the handle, without having to change and adjust the angle of the handle, thereby facilitating the user operating the handle, and thereby preventing the user""s wrist from being hurt.
2. Description of the Related Art
A conventional saw comprises a handle and a blade. However, in the conventional saw, the blade is fixed on the handle, so that the angle of the blade cannot be adjusted so as to fit the orientation of the workpiece that is to be sawed, thereby causing inconvenience to the user, and thereby decreasing the versatility of the conventional saw.
The closest prior art of which the applicant is aware is disclosed in his U.S. Pat. No. 6,349,619-B1 and his U.S. patent application Ser. No. 09/909,019.
The present invention has arisen to mitigate and/or obviate the disadvantage of the conventional saw.
The primary objective of the present invention is to provide a saw having an angle adjustable blade, wherein the angle of the blade relative to the handle may be adjusted arbitrarily by rotating the blade relative to the handle, without having to change and adjust the angle of the handle, thereby facilitating the user operating the handle, and thereby preventing the user""s wrist from being hurt.
Another objective of the present invention is to provide a saw having an angle adjustable blade, wherein the angle of the blade relative to the handle may be adjusted arbitrarily so as to match the direction of the workpiece, so that the blade is used to saw the workpiece in the right direction, thereby preventing the blade from being broken, and thereby increasing the lifetime of the blade.
In accordance with the present invention, there is provided a saw having an angle adjustable blade, comprising a handle and a blade, the handle including a body and a ratchet structure, the ratchet structure including a positioning member and a ratchet rod, wherein:
the positioning member is mounted on the body and has a periphery formed with two adjacent notches for receiving two toothed ratchet blocks and a through hole located between the two notches for receiving an elastic member which is urged between the two ratchet blocks, a rotation ring is mounted on the positioning member to encompass the two ratchet blocks, the rotation ring has an inner wall formed with three positioning recesses, a restoring spring is mounted in the periphery of the positioning member, for pressing a positioning ball which is locked in one of the three positioning recesses of the rotation ring; and
the ratchet rod is mounted between the positioning member and the rotation ring, and has a rear side having an inner wall formed with a plurality of ratchet teeth meshing with the two ratchet blocks, and a front side for mounting the blade.


The present invention provides a multicolor OLED pixel structure having a plurality of light emitting color elements, each color element emitting light of a particular color. Optical centers of the color elements coincide substantially at an optical center for the pixel structure and any portion of a color element of the pixel structure has an equally luminous portion of the same color element located diametrically opposite thereto with respect to the optical center of the pixel structure. Light from all the color elements adds to be able to form emitted white light. A plurality of pixel structures may be formed into an array for an active or passive display.

Emissive, fixed format especially direct view displays such as Light Emitting Diode (LED), Field-Emission (FED), Plasma, EL and OLED displays have been used in situations where conventional CRT displays are too bulky and/or heavy and provide an alternative to non-emissive displays such as Liquid Crystal displays (LCD). Fixed format means that the displays comprise an array of light emitting cells or pixel structures that are individually addressable rather than using a scanning electron beam as in a CRT. Fixed format relates to pixelation of the display as well as to the fact that individual parts of the image signal are assigned to specific pixels in the display. Even in a color CRT, the phosphor triads of the screen do not represent pixels; there is neither a requirement nor a mechanism provided, to ensure that the samples in the image in any way align with these. The term "fixed format" is not related to whether the display is extendable, e.g. via tiling, to larger arrays. Fixed format displays may include assemblies of pixel arrays, e.g. they may be tiled displays and may comprise modules made up of tiled arrays which are themselves tiled into supermodules. Thus "fixed format" does not relate to the fixed size of the array but to the fact that the display has a set of addressable pixels in an array or in groups of arrays. Making very large fixed format displays as single units manufactured on a single substrate is difficult. To solve this problem, several display units or "tiles" may be located adjacent to each other to form a larger display, i.e. multiple display element arrays are physically arranged side-by-side so that they can be viewed as a single image. Transferring image data by packetized data transmission to the various display devices makes segregation of the displayed image into tiles relatively easy. At the junction of the tiles, usually some means to hide the join is applied. Such could be an opaque mask, as is for instance done in the case of tiled LCD displays, where the image of individual LCD panels is projected on a black matrix. To maintain a uniform appearance to the display, this mask is extended over the complete surface of the display and comprises an array of openings that coincide with the light emitting pixel structures of the display, or an array of openings that coincides with a group of light emitting pixel structures of the display (e.g. array of 4×4 pixels in one opening of the mask). OLED displays provide certain advantages for tiled displays such as light-weight, ease of manufacture, wide angle of view, and the ability to use back-connectors which allows close tiling with the smallest joint between tiles.
The human eye can detect very subtle color shifts or brightness changes and the optical non-uniformity and asymmetry introduced at the borders of tiles can produce disturbing optical effects. The traditional method of manufacture of OLED displays results in a pixel structure as shown schematically in FIG. 1 with a transparent substrate 2, usually a glass substrate, being closest to the viewer and facing in the display direction. Behind this substrate a series of layers 4-8 are deposited, e.g. at least a first transparent electrode 4, the organic light emitting element 6 and a second electrode 8. An organic LED material is deposited for each color in each pixel structure, e.g. three color elements 6, red, green and blue, for each pixel structure. Thus, each pixel structure can emit white light or any color by controlling the light energy emitted from each color element of a pixel structure. Usually additional layers are deposited such as electron and hole transport layers 7, 5 (see FIG. 1 that has been adapted from FIG. 4-13 of "Display Interfaces", R. L. Myers, Wiley, 2002). Thus, the light emitting elements 6 are located at a certain distance below the transparent substrate 2 and light can be reflected towards the viewer from the edges of the glass substrate 2 at the tile edges. Which light is reflected depends on which color element 6 of the edge-closest pixel structure is closest to the edge of the tile. The conventional color elements 6R, 6G, 6B of one pixel structure of an OLED are shown in FIG. 2 deposited onto a substrate 2—the electrodes and other layers are not shown. The color elements 6R, 6G, 6B are arranged in parallel, rectangular strips. The tile edge effect of such an arrangement differs depending upon which edge 10, 12 of the tile is closest to the pixel structure. If the edge (10) is parallel to the strips, then the light reflected towards the viewer from the edge of the glass substrate 2 at certain viewing angles will be dominated by the color of the closest color emitting element 6, e.g. 6B emitting blue light. This color will generate a color shift near the tile edge 10 generating a colored "halo" effect along edge 10, particularly at certain viewing angles. At the edge 12, all three color elements are equally close to the edge and therefore balanced colored light is reflected from the tile edge. This will not cause a color shift but may make the edge look slightly brighter or darker at certain viewing angles.
A further problem is the effect of viewing angle and parallax resulting in vignetting, e.g. with masks or other optical elements. As there is a significant distance in the viewing direction between the emitting point of light of the OLED pixel structure and the mask, a viewer will see light emitted from more or less of the pixel structure surface area depending on the angle of view (see FIG. 3a). This distance is determined as a minimum by the thickness of the substrate 2. This problem can be reduced by using non-occluded masks. A non-occluded mask has openings which are larger than the light emitting surface area of a pixel structure so that when viewed along a normal to the pixel structure, light from the complete emitting surface of the pixel structure can be seen (non-occluded mask 9 of FIG. 3a). However, even with a non-occluded mask 9, parallax effects caused by the mask can occur at larger angles of view, an effect called vignetting. The effect of vignetting is to reduce the light intensity from a part of the pixel structure. If this part has a predominance in one of the colors emitted from the pixel structure, the result will be a color shift which depends on viewing angle. In addition, mask misalignment can reduce the viewing angle in the direction in which an edge of the mask opening is closest to the pixel structure (see FIG. 3b) and/or can produce color shifts.
A further problem can occur with displays in which an array of optical elements is used, e.g. commercial large size displays such as e.g. as used in shopping malls, train stations, airports etc. Such displays may be arranged on a wall at a certain distance from the average viewer. Due to physical restrictions such as the height of the target observer who will normally be between 1 and 2 meters, it is not necessary for the display to emit light in a wide angle. Power and cost can be saved by directing the display beam only within a useful angle. One way of doing this is to provide an optical element such as a lens in front of the display that concentrates the emitted light within the desired viewing angle. For instance, each pixel structure may be associated with a lens. However, misalignments between the optical axis of the lens and the pixel structure as well as the difference in optical centers of gravity of each color element of a conventional pixel structure means that the color displayed depends on the angle of view. A known partial solution to this problem is described in US 2002/0050958 that requires each color element of a pixel structure to have its own lens. However, for high resolution displays this involves manufacturing and accurately placing very small lenses. The array of optical elements can have other functions besides the tailoring of the light distribution produced by the pixels.

Display element array for emissive, fixed format display


The use of marker(s) in the source code of a program under evaluation. A representation of the marker(s) remains in the binary version of the program under evaluation. During execution, upon executing the marker, data is gathered regarding the timeline of the execution of the marker in the context of overall timeline of execution. A visualization of the marker is then displayed that illustrates the execution of the marker in the context of a larger timeframe of execution. Optionally, the marker may be associated with text, or other data, at least some of which being rendered with the visualization. Accordingly, an application developer, or indeed anyone evaluating the program, may place markers within source code and/or evaluate the timeline of execution of those markers.

Computing systems are providing ever more complex and sophisticated functionality. Such functionality is often primarily driven by underlying software, which itself is becoming ever more complex. Application developers have the task of developing such software, and to appropriately "debug" the application to ensure proper functionality.
Application developers have a wide variety of tools at their disposal in order to author software. First, source code allows the application developer to author software using instructions that are more understandable and intuitive to a human than is binary or intermediate code. The source code is ultimately compiled and/or interpreted into binary to allow readability of the code by a computing processor. In addition, various authoring tools allow for various visualizations that allow a developer to have a good understanding of how the application is currently functioning. For instance, some authoring tools allow a programmer to step through the execution of a program, one line of source code at a time, and evaluate the values associated to various parameters and variables. Authors might also insert temporary lines of code with the design for use in debugging.

Marker correlation of application constructs with visualizations


An IC package provides structural rigidity to a flexible substrate, but still allows access to mounted capacitors after package assembly. In a flip chip package, the IC die is mounted face down on a flexible laminate substrate. A metal lid is mounted above and in contact with the die. The metal lid includes openings over portions of an outer region of the substrate to accommodate the capacitors. However, portions of the metal lid extend to the corners of the substrate to provide structural rigidity to the flexible substrate. Some embodiments are directed to packages configured as described above, but in which an IC die has yet to be mounted.

The invention relates to packages for integrated circuits (ICs). More particularly, the invention relates to an IC package that includes a lid specialized for including external capacitors within the package, while providing the structural rigidity that is needed when flexible substrates are used.
IC packages are available in many different forms and configurations. One popular configuration is the xe2x80x9cflip chipxe2x80x9d configuration, in which the IC die is mounted face-down in the package (i.e., with the active surface of the die towards the package pins). Thus, the pads on the active surface of the IC (e.g., power pads, ground pads, and/or input/output or I/O pads) can be brought into contact (e.g., through xe2x80x9csolder bumpsxe2x80x9d) with lands disposed across the surface of the substrate. The lands are in turn coupled through vias (i.e., holes through the substrate filled with a conductive material) to package pins (e.g., balls or pins) on the bottom surface of the package.
Some IC packages include provision for capacitors mounted inside the package. Providing capacitors within the package has some strong advantages over the alternative approaches of including capacitors on the surface of the die, or mounting capacitors outside the package. Including capacitors on the surface of the die increases the surface area, and thus the cost, of the die. Further, changing the size of a capacitor included on the die requires making new masks and manufacturing new die, while capacitors implemented as separate units from the die are easily modified. On the other hand, mounting capacitors outside the package introduces noise into the circuits in the die and consumes valuable area on the PC board.
ICs are becoming more sensitive to noise as the typical operating voltages drop to levels closer to the threshold voltages of the IC transistors on the die. Therefore, it is desirable to reduce noise as much as possible. Further, the number of pads per area of die is also increasing, so today""s ICs typically have a higher switching current than in the past. Hence, the capability of mounting capacitors within an IC package is becoming more and more desirable.
FIG. 1 shows a well known type of flip chip package that includes capacitors within the package. On a laminate substrate 101 are mounted the die 102 and the desired number of capacitors 104, 105. The exemplary package in FIG. 1 includes two different types of capacitors (104 and 105), but any number of different types of capacitors can be included. The terminals of the capacitors are coupled to connection points (e.g., ground pads, power pads, and/or I/O pads, not shown) of the die 102 through metal traces (not shown) layered in the laminate substrate 101. The terminals of the capacitors can also be coupled through the metal traces to the package pins on the bottom surface of the package. Over the surface of this structure is laid a metal lid 103, which is typically in direct contact with the backside of the die 102 (the upper surface as shown in FIG. 1). If any of capacitors 104, 105 protrudes above the backside of the die 102, a rectangular portion of the inside surface of the lid 103 is manufactured to protrude from the inner surface of the lid, to maintain contact with the backside of the die.
One type of IC package that was once commonly used is the ceramic dual in-line (CERDIP) package, in which the IC die is mounted with the active surface away from the package pins. In CERDIP packages, the ceramic substrate and ceramic lid are made relatively thick to provide structural strength. A flip chip package is generally thinner than a ceramic package, partially because a laminate substrate is used rather than a ceramic substrate, and partially because a metal lid is used rather than a ceramic lid. The metal lid also has another advantage when used with a laminate substrate; it provides the structural rigidity that the flexible laminate substrate lacks. Without this structural rigidity, applying mechanical or thermal stress to the package could cause damage to the connections between the substrate and the board to which it is mounted, or between the pads of the die and the lands in the substrate. Also, the metal lid prevents the laminate substrate from warping under heat, e.g., when the package is being mounted to the board. This warping could cause disconnects or poor connections between the substrate and the board.
FIG. 2 illustrates a laminate substrate that can be used, for example, with the IC package structure shown in FIG. 1. Laminate substrate 201 includes an inner region 206 (indicated by a dotted line) and an outer region 207. The inner region 206 includes lands 208, and the outer region 207 includes lands 209. Inner lands 208 come into contact with pads on the IC die (e.g., die 102 in FIG. 1), while outer lands 209 are coupled to terminals of the capacitors (e.g., capacitors 104 and 105 of FIG. 1). Traces 210 interconnect the inner lands with the outer lands. The traces are typically copper traces sandwiched within the laminate substrate. Only two traces are shown in FIG. 2, for clarity, but many more traces are typically present. When the die (not shown) is in place, the traces electrically couple the capacitors (not shown) to one or more desired pads of the die.
There are drawbacks to the IC package structure shown in FIG. 1. For example, it is not possible to visually inspect capacitors after the lid has been applied. In fact, it can be difficult or impossible even to test the capacitors, as they are not readily accessible to test probes after the lid has been applied. Further, the capacitors cannot be reworked without removing the lid, which process can damage or detach the die and otherwise undamaged capacitors.
FIG. 3 shows another known IC package that addresses these drawbacks by eliminating the lid altogether. FIG. 3 illustrates substrate 301, die 302, and capacitors 304, 305. However, no lid is shown or provided. When the package of FIG. 3 is used, the capacitors can be mounted in the package, yet remain available for visual inspection, testing, and replacement, if necessary. However, clearly the die is left exposed. A lid provides mechanical protection for the die that is often desirable and even necessary in many applications. The lid also provides mechanical protection for the capacitors, e.g., during the testing sequence of the packaged device. Further, as previously described, the lid also provides structural rigidity (i.e., acts as a xe2x80x9cstiffenerxe2x80x9d) for the package. Removing the lid can make the package significantly more susceptible to warping, which can affect the second level board assembly and reliability.
Therefore, it is desirable to provide an IC package that can include capacitors within the package, make the capacitors accessible after the lid is applied, and still supply all the necessary structural rigidity required by the use of a flexible substrate.
The invention provides an IC package that provides structural rigidity to a flexible substrate, but still allows access to mounted capacitors after package assembly. In a flip chip package, the IC die is mounted face down on a flexible laminate substrate. A metal lid is mounted above and in contact with the die. The metal lid includes openings over portions of an outer region of the substrate to accommodate the capacitors. However, portions of the metal lid extend to the corners of the substrate to provide structural rigidity to the flexible substrate. Some embodiments are directed to packages configured as described above, but in which an IC die has yet to be mounted.
According to a first embodiment, a packaged IC includes a flexible substrate, an IC die, and a structurally rigid lid. The flexible substrate includes an inner region, an outer region, inner lands disposed in the inner region, outer lands disposed in the outer region, and a plurality of traces each coupled between an inner land and an outer land. The IC die has an active surface and an upper surface, and is mounted in the inner region of the flexible substrate with the active surface facing the flexible substrate. Pads of the IC die are in electrical contact with the inner lands of the substrate. The structurally rigid lid is disposed in contact with the upper surface of the IC die and sealed to the flexible substrate. The structurally rigid lid also has openings that expose only a portion of the outer region of the flexible substrate.
In some embodiments, the packaged IC also includes capacitors mounted to the flexible substrate within the openings in the structurally rigid lid. Terminals of each capacitor are in electrical contact with a plurality of the outer lands. In some embodiments, the structurally rigid lid is a metal lid. In some embodiments, the flexible substrate is a laminate substrate. In some embodiments, the structurally rigid lid is sealed to the flexible substrate using a non-hermetic seal.
In some embodiments, the outer region of the flexible substrate has outer corners at a plurality of points furthest from a center point of the flexible substrate. The structurally rigid lid has outer corners corresponding to the outer corners of the outer region of the flexible substrate. In some of these embodiments, the outer corners of the two elements are sealed together, with either a hermetic seal or a non-hermetic seal.
According to another embodiment, a packaged IC includes a laminate substrate, an IC die, and a metal lid. The laminate substrate includes an inner region and an outer region. The IC die has an active surface and an upper surface, and is mounted in the inner region of the laminate substrate with the active surface facing the laminate substrate. The metal lid includes openings that expose only a portion of the outer region of the laminate substrate. Some embodiments also include a plurality of capacitors mounted to the laminate substrate within the openings in the metal lid.
In some embodiments, the outer region of the laminate substrate includes outer corners at the points furthest from a center point of the laminate substrate. The metal lid has outer corners that correspond to the outer corners of the laminate substrate and are sealed thereto. Thus, the metal lid adds structural rigidity to the laminate substrate.
According to another embodiment, a packaged IC includes a flexible rectangular substrate, an IC die, and a structurally rigid lid. The flexible rectangular substrate includes four edges, four corners located between adjacent ones of the edges, an outer region touching each of the four corners, and a rectangular inner region encompassed by the outer region. The IC die has an active surface and an upper surface, and is mounted in the inner region of the substrate with the active surface facing the substrate. The structurally rigid lid is disposed in contact with the upper surface of the IC die. The lid has four corners corresponding to the four corners of the substrate, and also has openings that expose only a portion of the outer region of the substrate. The exposed portion does not include any of the four corners of the substrate. The four corners of the structurally rigid lid are sealed to the four corners of the substrate. Therefore, the lid provides structural rigidity to the four corners of the substrate. Some embodiments also include a plurality of capacitors mounted to the flexible rectangular substrate within the openings in the structurally rigid lid.
Other aspects of the invention are directed to packages for accommodating both capacitors and an integrated circuit (IC) die. According to one embodiment, a package comprises a flexible substrate and a structurally rigid lid. The flexible substrate includes an inner region, an outer region, inner lands disposed in the inner region and adapted for coupling to the IC die, outer lands disposed in the outer region and adapted for coupling to the capacitors, and a plurality of traces each coupled between an inner land and an outer land. The structurally rigid lid is configured to be disposed in contact with the upper surface of the IC die after mounting the IC die in the package. The structurally rigid lid has openings that expose only a portion of the outer region of the flexible substrate.
Some embodiments also include an IC die. The IC die has an active surface and an upper surface, and is mounted in the inner region of the flexible substrate with the active surface facing the flexible substrate. The IC die has pads in electrical contact with the inner lands of the flexible substrate.
Some embodiments also include a plurality of capacitors. The capacitors are mounted to the flexible substrate within the openings in the structurally rigid lid. Each capacitor has a plurality of terminals in electrical contact with a plurality of the outer lands.
According to another embodiment, a package includes a flexible rectangular substrate and a structurally rigid lid. The flexible rectangular substrate includes four edges, four corners located between adjacent ones of the edges, an outer region touching each of the four corners, and a rectangular inner region encompassed by the outer region. The inner region includes a plurality of inner lands adapted for coupling to the IC die. The outer region includes a plurality of outer lands adapted for coupling to the capacitors. The structurally rigid lid is configured to be disposed in contact with the upper surface of the IC die after mounting the IC die in the package. The lid has four corners corresponding to the four corners of the substrate. The lid also includes openings that expose only a portion of the outer region of the substrate. The exposed portion does not include any of the four corners of the substrate. The four corners of the structurally rigid lid are configured to be sealed to the four corners of the substrate. Thus, the lid provides structural rigidity to the four corners of the substrate.

Flip chip integrated circuit packages accommodating exposed chip capacitors while providing structural rigidity


In an embodiment of the invention, a method of classifying a data object includes: scanning the data object; evaluating contents of data objects base on at least one selected rule; and generating a digital DNA sequence that classifies at least some contents in the data object.

Interconnected systems, such as, for example, the global Internet, can deliver information to more people at a faster speed and is important in the current global economy. However, as recent history has shown, these interconnected systems are often dealing with security risk issues. Security risks include, but are not limited to, for example, identity theft and theft of proprietary information.
However, previous approaches are unable to detect variations of an original file in memory (RAM). Furthermore, previous approaches are not efficient in detecting executables in RAM, particularly if some parts of the executable portions are altered at runtime. Additionally, previous approaches are not efficient in detecting variants of the same malware or malware protected by a packer or encryptor. Malware is typically is software designed to infiltrate or damage a computer system without the owner's informed consent. Therefore, the current technology is limited in its capabilities and suffers from at least the above constraints and deficiencies.


A user device establishes a first connection with a first carrier network of a first carrier. The first carrier issues a first phone number used by the user device. The user device further establishes a second connection with a second carrier network of a second carrier. The second carrier issues a second phone number used by the user device. The user device receives a notification about a call from the first carrier network while connected to the first carrier network and the second carrier network.

Users are increasingly relying on mobile phone devices to stay in contact with other people for business and personal reasons. Carriers provide mobile phone services within limit geographic areas (e.g., a particular country). Users who travel between multiple locations, with different carriers, often want to simultaneously be accessible and use multiple local phone numbers associated with those locations. Currently, standard mobile phones allow a user to place/receive calls only via a single local phone number issued by a carrier. As a result, a user who wants to utilize local numbers in, for example, multiple countries must carry multiple mobile phones. To be accessible by a primary local number while in a foreign country or market, the user must roam with a primary mobile phone associated with the primary local number. A mobile phone with dual subscriber identity module (SIM) cards may, theoretically, allow a user of the mobile phone to communicate by using two different local numbers. However, the dual SIM cards require specialized hardware that supports the dual SIM cards. Furthermore, the dual SIM cards require a user to roam using any one of the two dual SIM cards in multiple countries.


A gear having a tooth form shape includes, on a tooth root side of a tooth, (1) a first curved surface connected to a tooth face of an involute tooth form and convex in a direction opposite to the tooth face, (2) a flat surface connected to the first curved surface, and (3) a second curved surface connected to the flat surface and convex in the same direction as the first curved surface. The shape of the flat surface in a normal plane is a tangent in contact with a tip side end of a trajectory of motion B of a tooth of a meshing partner gear and intersecting with a tooth form center line at a 30° angle. The shapes of the first and the second curved surfaces in a normal plane are circular arcs.

1. Field of the Invention
The present invention relates to a gear widely used in a power transmission mechanism of automobiles, precision machineries, industrial machineries, components used therein, and the like.
2. Description of the Related Art
Various modifications have been made to enhance tooth strength in gears used in power transmission mechanisms of automobiles, precision machineries, and the like.
FIG. 19 is a diagram of a tooth form shape of such a gear 100. In the gear 100 shown in FIG. 19, the shape of a tooth 101 on the bottom side is an arch-shaped curved surface 102 matching a trajectory of motion of a tooth of a meshing partner gear (pinion) to an extent in which the arch-shaped curved surface 102 does not interfere with the trajectory. Tooth strength is enhanced by the position of a critical section in a 30° tangent method being moved closer to the top side, from P1 to P2 (refer to Patent Literature 1).    Patent Literature 1: Japanese Patent Laid-open Publication No. 2004-519644
However, in the gear 100 shown in FIG. 19, the arch-shaped curved surfaces 102 and 102 of adjacent teeth 101 and 101 merge, forming a pointed triangular peak 103 at the bottom. Therefore, in the gear 100 shown in FIG. 19, stress tends to be concentrated at the peak 103 at the bottom. There is a demand for strength enhancement of the overall tooth 101 including the bottom.


A greaseless bushing assembly for the gauge wheel arms of an agricultural row planter. The greaseless bushing includes an outer threaded tube for threaded mounting within the gauge wheel arm, and an internal non-metallic sleeve through which the wheel bolt extends for mounting the gauge wheel onto the arm. The sleeve provides dry lubrication for the bushing. The bushing may also include a lip or wiper seal at each end to prevent entry of dust into the bushing.

Row planter units are precision tools used in farming to plant high tech seeds at uniform depth and spacing to ensure the highest yield potential. To achieve maximum results, the row planter unit must be properly maintained and periodically adjusted.
Row planter units typically include a pair of angularly disposed opening discs to form a V-shaped opening or furrow in the soil into which seeds are planted. The disc openers are followed by a pair of gauge wheels that aid in holding the V-shaped profile of the furrow. The gauge wheels are parallel to and contact the disc openers when properly positioned. The gauge wheels are mounted on pivoting arms, which include bushings.
The bushings must be greased, preferably daily. The greasing operation takes considerable time on a multi-unit planter, particularly during the busy planting season. Conventional planters may have up to 71 row units, such that daily greasing of the bushings cuts into valuable and sometimes scarce planting time. Eliminating the greasing requirement and the time saving to farmers is a huge benefit. When lubrication is neglected, the rocking action of the gauge wheel arms generates substantial friction, which leads to wear on the bushings, which then causes the gauge wheel angles to change and the gauge wheels to move away from the disc openers. As the bushings wear, the disc openers spread apart, forming a gap between the disc openers, which leads to deterioration of the V-shaped seed furrow profile, which is extremely undesirable, and which ultimately adversely affects yield.
Therefore, a primary objective of the present invention is the provision of a greaseless bushing for the gauge wheels of an agricultural row unit.
Another objective of the present invention is the provision of an improved bushing for laterally adjustable gauge wheels on an agricultural row unit.
A further objective of the present invention is the provision of a greaseless bushing for the gauge wheels of a seed planter unit, wherein the bushing includes outer threads and an internal composite, non-metallic wear sleeve.
Still another objective of the present invention is a provision of a laterally adjustable dry lubricated bushing for use on the gauge wheel arm of an agricultural row unit.
Yet another objective of the present invention is the provision of a dry bushing for a row unit gauge wheel arm which eliminates dust attraction to the bushing.
A further objective of the present invention is a provision of a laterally adjustable bushing having seals to preclude dust from entering the bushing.
Another objective of the present invention is a provision of an improved bushing for gauge wheel arms on an agricultural unit, which minimizes maintenance of the bushing while increasing the life expectancy of the bushing.
Still another objective of the present invention is a provision of a bushing for use on the gauge wheel arms of agricultural row planters which eliminates the need for greasing.
Yet another objective of the present invention is the provision of a greaseless bushing for agricultural row planter gauge wheel arms which is economical to manufacture, easy to install, and durable in use.
These and other objectives have become apparent from the following description of the invention.

Greaseless bushing for agricultural row unit


A hand-held power tool includes a housing, a filter support, a plurality of securing element, and an actuating unit. The filter support has receiving openings, at least one first fixing element, and at least one second fixing element. The receiving openings are configured to receive filter elements configured to seal the hand-held power tool against a penetration of dust into the housing of the hand-held power tool. First and second fixing elements are fixable to corresponding securing elements arranged on the hand-held power tool, and are configured to releasably fix the filter support to the housing. The actuation unit is actuatable to release the filter support from the hand-held power tool.

The disclosure relates to a hand-held power tool.
In DE 2008 009 277 A1 is ah electric hand-held power appliance, having a housing body that accommodates the electric-motor drive components and in which air inlet openings are also provided for a cooling air flow applied to the electric-motor drive components. Furthermore, the appliance is realized such that a filter means is provided, in the region of the air inlet openings, by means of which, in particular, magnetization dust can be kept away from the electric-motor drive components.

Hand-held power tool comprising a filter support


A method of screwing medication vials to IV-bags utilizing a power tool having a socket (58) with a bowl-shaped hard shell (60) defining a mouth (86) with a resilient material insert (62) lining an interior surface thereof and being held therein by a removable retainer at a lip of the mouth. The lining material defines a cylindrically-shaped vial-receiving cavity (88) of a size for receiving a bottom-end portion (96) of a medication vial, with lining material engaging radially the received bottom-end portion for imparting movement thereto. The socket has an attachment device (66) positioned at an end of the socket opposite the mouth for attaching the socket to a rotary motor (54, 102) of a rotating tool.

This invention relates generally to the art of intravenous bags (IV-bags) and more specifically to devices for charging IV-bags with medications and the like.
IV-bags are used in large quantities in hospitals, clinics and other facilities where patients are being treated. In this regard, IV-bags are not only used for giving blood transfusions, but are also used extensively for providing nourishment and medications to patients. Regarding medications, they are often administered intravenously mixed in a saline or sugar carrier solution. It is important that many of these medications not be mixed with the carrier solutions in the IV-bags until immediately before the mixtures are to be "fed" into patients. Further, it is extremely important that IV-bags be charged with the correct medications for corresponding patients. That is, it would be extremely easy for nurses who would both prepare IV-bags and administer them to patients to become confused and administer the wrong medications to patients. Also, it is not a good idea to combine the medications with the IV-bags on hospital floors where conditions are less than sterile. Thus, most hospitals, especially larger hospitals, have found it to be beneficial for technicians to combine medications with IV-bags in sterile laboratories and then deliver these "combined bags", properly marked as to patients and medications, to the appropriate hospital rooms. A nurse then, upon administering an IV to a patient, checks the marked medication against the patient's chart and, if they correspond, she activates the medication so that it is only then mixed with the carrier solution, immediately before the IV is administered. Normally, medication vials are combined, or assembled, with IV-bags by screwing male-threaded necks of the medication vials into female-threaded mouths of the IV-bags, with sterile stoppers of the medication vials extending into the IV-bags. The medication vials are then left, thus attached, or screwed, to the IV-bags until they are to be used. In order to use an IV-bag with an attached medication vial, a nurse manipulates the flexible bag itself to cause a stopper remover in the bag to remove the stopper from the medication vial, with the stopper remover and stopper falling into the interior of the bag, thereby allowing the medication in the medication vial to enter into the IV-bag and mix with a carrier solution therein.
Although the above described system functions quite well, it has been found that it is extremely burdensome for and dangerous to technicians who must assemble the medication vials with the IV-bag. In this regard, often hundreds of medication vials are combined with IV-bags daily, thereby requiring many repetitions of screwing male threads on necks of medication vials into female threads on mouths of IV-bags. When these two members are being screwed together, the stopper remover is simultaneously screwed into an opening of the stopper. Thus, the screwing action involves overcoming much friction and, therefore, requires the expenditure of quite a bit of effort. Not only is this procedure unduly slow and burdensome for the technicians, it is also not accurate and increases the risk of getting a wrist abnormality known as "Carpal Tunnel Syndrome".
Therefore, it is an object of this invention to provide a tool and method for attaching medication vials to IV-bags which is fast, not unduly burdensome, and does not increase the risk of getting carpal tunnel syndrome. Similarly, it is an object of this invention to provide a tool and method for attaching medication vials to IV-bags which is not unduly expensive.

Method for screwing medication vials to IV-bags


A method or system for application program interface (API) request conversion, includes generating a plurality of configuration files, each associated with a different API format. A first API format of the first API request is identified and a first configuration file is identified based on the first API format. A second API request having a second API format is generated by applying the first API request to the first configuration file. A third API request is received and a third API format of the third API request is identified. A second configuration file is identified based on the third API format. A fourth API request is generated having the second API format by applying the third API request to the second configuration file.

The present disclosure relates generally to systems and methods for integrating systems using different application programming interface structures (APIs). The present disclosure relates more particularly to converting API requests in multiple formats to a common format.
The technological landscape of APIs is ever growing, forking, fragmenting, and recombining. While this provides users and developers with a large number of choices when it comes to how and when to interface with new systems, it can be difficult for the new systems to communicate or otherwise integrate with each other. In one example, to interface or integrate between modern web-based systems, APIs are used. If a user is interested in integrating or allowing different systems to communicate with each other, the user may have to constantly update the code to interface with the systems' APIs and formats thereof, which can be considerably different. This can result in "code rot" in which code gradually deteriorates or becomes unusable over time due to the failure to adequately integrate with the different APIs or failure to keep up with the updates of those APIs.
The above information disclosed in this Background section is for enhancement of understanding of the background of the disclosure, and therefore, it can contain information that does not constitute prior art.

Systems and methods for API request conversion


A drive mechanism for a camera having a lens including a drive member, a motor for driving the drive member in a clockwise and a counterclockwise direction, a range setting device operated by the drive member operable to effect movement of a lens member to a plurality of positions corresponding to a plurality of focused positions of the lens when the drive member is rotated by the motor, an exposure actuation device operable upon actuation to effect exposure operation of the camera, and actuating cams on the drive member for actuating the exposure actuation device as the range setting device maintains a focused position of the lens.

In a recent known compact camera, there is provided a shutter with a lens drive mechanism which performs lens focusing automatically. Such a shutter with a lens drive mechanism is shown in FIG. 11, and has been proposed in Japanese Utility Model Application No. SH062-133112.
In this shutter with a lens drive mechanism, a drive ring 101 and a range ring 102 are rotatably driven by a non-illustrated step motor through a pinion 103 and an idler 104, thereby moving a photographing lens from an initial position so as to actuate exposure, That is, in order to set the photographing lens to a position corresponding to a focusing signal, the range ring 102 attached with the photographing lens is driven to rotate and the range ring 102 is retained at a proper position by a retaining lever 106.
The drive ring 101 is driven to rotate so as to rotate a sector lever 105, thereby to actuate exposure. When exposure actuation is performed, the state in which the range ring 102 is retained by the retaining lever 106 is released by a release lever 107, thereby to drive and rotate the range ring 102 and the drive ring 101 to the initial position. In such a manner, by controlling the range ring 102 and the drive ring 101 with the step motor, the impact when the photographing lens returns to the initial position is reduced.
In such a conventional shutter with a lens drive mechanism, however, the range ring 102, the retaining lever 106, the release lever 107 and the like have been required in order to set the photographing lens at a focused position and actuate exposure. Accordingly, the construction becomes complicated as a whole for the shutter with a lens drive mechanism, and also a large number of parts are required.


The method for making a low resin content polymer concrete article includes the steps of: supplying a quantity of polymer or monomer resin; adding a non-reactive solvent, vehicle, dispersant or diluent to the resin; supplying the mixture of diluent and resin to a mixing station; supplying filler material to the mixing station; mixing the diluent, resin and filler material at the mixing station; supplying the resultant mixture to an eduction chamber; educing the non-reactive diluent from the eduction chamber; and supplying the resulting mixture with diluent educed to a forming station for shaping and curing.

1. Field of the Invention
The present invention relates to a method and apparatus for making a composite, such as a polymer concrete wherein the concrete has a low percentage of resin therein, such as below ten percent (10%) by weight resin.
2. Description of the Prior Art
Heretofore it has been known in the production of composite articles, which are defined as articles made from a filler material, e.g., a particulate material, and a binder such as cement and water or a liquid thermosetting resin, that polymer concrete articles such as those made using a polymer or monomer resin as a binder have desirable properties, particularly high strength over cement based concrete articles.
However, the cost of the polymer or monomer resin relative to the particulate material is very high and typically the amount of polymer in a polymer concrete article costs twenty times more than the particulate material or aggregate in the polymer concrete article. As a result, the cost of polymer concrete articles has prevented more widespread use of polymer concrete articles.
With present manufacturing methods and apparatus for the manufacture of polymer concrete articles, it is very difficult to manufacture a concrete article with less than ten percent (10%) by weight resin in the article if the filler mix contains many fine particles.
The problem is that when the amount of the binder, e.g., resin, is very low, it is very difficult to mix the binder with the particulate material or aggregate because there is insufficient liquid to wet the surface of the particles of the filler mixture. An analogy would be the mixing of pancake mix, which calls for one cup of water, with one teaspoon of water. It may be possible eventually to obtain substantial mixing and partial or sufficient wetting throughout the mixture but it will take a long time to effect such mixing.
Thus, prior attempts to produce polymer concrete articles with a low percentage of resin have been self-defeating since, to obtain the low resin polymer concrete article, one had to spend several hours mixing the low content resin with the particulate matter prior to casting, heating, if necessary, and setting, polymerization, gelling or curing of the thermosetting resin based polymer concrete material.
Examples of methods and apparatus for producing polymer concrete are disclosed in German Offenlugungsschrift 32 07 432; and, 36 37 755. The polymer concrete machines disclosed in these Published German patent applications are manufactured by Respecta Baumaschinen-Gesellschaft MBH of Dusseldorf, West Germany.
Furthermore, process for casting products having a thermosetting resin binder therein are disclosed in U.S. Pat. Nos. 4,473,673 and 4,652,596.
Also, it is known from U.S. Pat. No. 3,633,880 to place a vacuum on an extrusion device for venting volatile elements from an extrudate.
Additionaly, polymer concrete systems have been proposed wherein a low resin percentage is obtained in the polymer concrete product by a method of over vibration of a mold filled with a mixture of resin and filler causing filler particles to settle to the bottom of the mold thereby displacing some of the resin binder which forms a resin-rich layer at the top of the mold cavity, after the resin has set (polymerized). This resin rich layer is then cut off and thrown away thereby wasting the excess resin required for mixing.
As will be described in greater detail hereinafter, the method and apparatus of the present invention provide a solution to the problem of obtaining a low cost polymer concrete article having a low percentage by weight of resin binder therein. As will be described in greater detail hereinafter, this is achieved by first mixing a quantity of resin binder with a non-reactive diluent. Then, the resulting liquid comprising diluent and resin is mixed with particulate material/aggregate, which can be, for example, sand and gravel. A catalyst can be added and the mixture is then thoroughly mixed and passed into an eduction chamber. The eduction chamber can include a screw type agitator which moves the mixture through the chamber while heat is supplied to the chamber and/or a vacuum is placed on the chamber to withdraw volatilized diluent This is done prior to supplying the mixture to a mold or forming station. Then, the mixture is supplied to a forming station where an article is shaped, formed or molded and more heat can be applied to the mixture to heat it to the setting temperature determined by the resin and catalyst mixture, which is greater than the temperature of any heat supplied to the eduction chamber.

Method for making low resin content polymer concrete


A method of testing a resiliently covered roll for surface flat spots involves rotating the roll and applying a film of water with a sponge roller to at least a portion of the length of the rotating roll surface. Then doctoring the rotating surface with a blade to remove the film, and detecting any flat spot by observing any puddle of water remaining after the doctoring. A testing device preferably is handheld and comprises a forwardly extending doctor blade below which is rotatably mounted the sponge roller. A rubber wipe roll for flexographic printing can be so advantageously tested for flat spots before installation.

Rolls having their cylindrical surface formed by a resilient material cover, for example a rubber covered wipe roll as used in flexographic printing, at times develop flat spots, or areas, on the surface. It is believed this occurs when the surface is distorted, or flattened, for too long a period of time, e.g. during transportation. It has been customary to dial the surface of these rolls with a dial instrument to test for concentricity before use. However, such dialling does not necessarily detect any flat spots in the cylindrical surface. Such flat spots are usually only detected after the roll is assembled in a printing machine and printing commenced; any flat spot then becomes apparent, as it creates an area of over inking of the material being printed, e.g. corrugated container blanks. The defective roll then has to be removed from the printing machine and replaced. It may be possible to salvage the defective roll after removal by re-grinding a new surface.

Locating flat spots on rubber wipe rolls