A multilevel cascade voltage source inverter having separate DC sources is described herein. This inverter is applicable to high voltage, high power applications such as flexible AC transmission systems (FACTS) including static VAR generation (SVG), power line conditioning, series compensation, phase shifting and voltage balancing and fuel cell and photovoltaic utility interface systems. The M-level inverter consists of at least one phase wherein each phase has a plurality of full bridge inverters equipped with an independent DC source. This inverter develops a near sinusoidal approximation voltage waveform with only one switching per cycle as the number of levels, M, is increased. The inverter may have either single-phase or multi-phase embodiments connected in either wye or delta configurations.

With long distance electrical power transmission and load growth, active control of reactive power (VAR) is indispensable with regard to stabilizing power systems and maintaining supply voltages. Static VAR generators (SVGs) using voltage-source inverters have been widely accepted as the next generation of reactive power controllers for power systems replacing conventional VAR compensators such as Thyristor Switched Capacitors (TSCs) and Thyristor Controlled Reactors (TCRs).
Delivering power from a power generating station to the ultimate power consumers over long transmission lines can be very costly for an electric utility. The electric utility passes on these costs to the ultimate consumers as higher electricity bills. Inductive and capacitive losses affect a reactive component of power which is measured in volt-ampere-reactive (VAR) units. These reactive power (VAR) losses may be compensated using a static VAR compensator to more economically transmit thereby reducing overall electricity bills as well as stabilizing the supplied voltage to the end user.
The state of the art VAR compensating approach uses transformer coupling voltage source inverters. A transformer coupling voltage source inverter comprising eight six-pulse converters connected in either a zig-zag, wye or delta configuration has a 48-pulse or a 48-step staircase inverter output voltage waveform which dramatically reduces harmonics. The major problem of using this transformer coupling approach resides in the transformer as a function of harmonic neutralizing magnetics. The transformer with the inherent harmonic neutralizing magnetics deficiency:
(a) is the most expensive equipment in the system; PA1 (b) produces approximately 50% of the total system losses; PA1 (c) occupies approximately 40% of the system layout; and PA1 (d) causes difficulties in system control due to DC magnetizing and surge overvoltage problems resulting from saturation of the transformers on the transient state. PA1 (a) the multilevel voltage source inverter having separate DC sources is more suitable to high voltage, high power applications than conventional inverters; PA1 (b) the multilevel voltage source inverter having separate DC sources generates a multistep staircase voltage waveform with the switching of each device only once per line cycle, thus reaching a nearly sinusoidal output voltage approximation by increasing the number of voltage levels; PA1 (c) since the multilevel voltage source inverter having separate DC sources consists of cascade connections of a plurality of single-phase full bridge inverters fed with a separate DC source, neither voltage balancing nor voltage matching of switching devices is required; and PA1 (d) system packaging and layout is streamlined due to the simplicity and symmetry of structure as well as the minimization of component count.
In recent years, a relatively new type of inverter, a multilevel voltage source inverter, has attracted the attention of many researchers. The transformerless multilevel inverter can reach high voltage and minimize induced harmonics as a function of inverter structure.
A multilevel, referred to as M-level, diode clamped inverter can reach high performance without the benefit of transformers. This inverter does, however, require the implementation of additional clamping diodes. The number of diodes required is equal to (M-1)*(M-2)*3 for an M-level inverter. For example, if M=51, for direct connection to a 69 kV power system, then the number of required clamping diodes will be 7350. These clamping diodes not only increase the cost of the system but also cause packaging/layout problems and introduce parasitic inductances into the system. Thus, for practicality, the number of levels of a conventional multilevel diode clamped inverter is typically limited to seven or nine levels.
A relatively new inverter structure, the multilevel flying capacitor inverter has the capability to solve the voltage balance problems and aforementioned problems associated with the multilevel diode clamped inverters. The required number of flying capacitors for an M-level inverter, provided that the voltage rating of each capacitor used is the same as the main power switches is determined by the formula, (M-1)*(M-2)*3/2+(M-1). Using the assumption of having capacitors with the same voltage rating, an M-level diode clamped inverter requires only (M-1) capacitors. Therefore, the flying capacitor inverter requires capacitors of substantial size compared with the conventional inverter. In addition, control is very complicated and higher switching frequency is required to balance the voltages between each capacitor in the inverter.
A multilevel cascade inverter with separate DC sources for reactive power compensation in AC power systems which is directed toward overcoming and is not susceptible to the above limitations and disadvantages is described herein. The multilevel voltage source inverter having separate DC sources eliminates the excessively large number of transformers required by conventional multipulse inverters, clamping diodes required by multilevel diode-clamped inverters and flying capacitors required by multilevel flying-capacitor inverters. The multilevel voltage source inverter having separate DC sources also has the following features:
Thus, a need for a multilevel cascade voltage source inverter with separate DC sources for reactive power compensation in AC power systems is clearly evident.

Multilevel cascade voltage source inverter with seperate DC sources


A sanitary material moving pump having a ram mounted for rreciprocal movement in a pumping chamber. An elongte tubular housing is connected at one end to the ram for purposes of reciprocal movement of the ram to move material through the pumping chamber. A piston shaft is mounted in stationary relationship relative to the pumping chamber in alignment with the design pumping axis of the pumping chamber. The end of the housing opposite the ram extends outward of the pumping chamber and is installed on the working end of the piston shaft. A piston is mounted on the inside end of the piston shaft. Hydraulic fluid lines communicate with opposite sides of the piston to reciprocate the housing on the piston shaft and the ram in the pumping chamber. Apparatus is provided for correctly adjusting the alignment of the hydraulic power unit to be as coincident as possible with the design pumping axis of the machine.

Material moving pumps, whether for moving liquids, solids or liquid entrained discrete solid material, or other product, for example manure, straw, crushed animal bones, sawdust, or feathers, typically include a ram that reciprocates in a pumping chamber undergoing a working stroke or power stroke during which material is moved through the chamber, and a return stroke whereby the ram returns to its starting position and more material is introduced into the chamber ahead of it. The ram is driven by a hydraulic motor of the cylinder-piston variety with the cylinder mounted in stationary relationship to and outside of the pumping chamber. The piston-rod is attached to the ram and reciprocates in the chamber. For example, see U.S. Pat. No. 4,322,023 to Olson issued Mar. 30, 1982 entitled Material Moving Apparatus. Such pumps are satisfactory for the pumping of most materials. However certain materials require a high degree of sanitation when being handled, such as food or food ingredients, or substances used in the manufacture of drugs and chemical products where purity is important. The presence of a piston shaft that reciprocates in and out of a cylinder can contaminate the environment of the pumping chamber, rendering the use of such pumps undesirable for handling these materials.


An improved magnetically driven resistor gauge (50) which includes a plastic base and plastic cap hermetically sealed together by ultra sonic welding to isolate the interior (90) of the gauge from the external environment. A dedicated ground terminal (100) is molded into the cap to ensure an effective ground. A contact plate (118), forming a part of the pivotal pointer assembly, includes resilient arms (120, 121 and 122) which are in electrical contact with the ground terminal and resistance wire (94), respectively.

Numerous applications exist where monitoring of a fluid level is important. For example, one application is in monitoring the level in an LPG tank, where both a visual indication of fluid level and electrical indication are desirable.
In the early sixties, Rochester Gauges, Inc. of Dallas, Texas introduced a magnetically driven variable resistor known as a "twin site" sender. This design utilized an annular resistance wire and cooperating arm in the electric circuit, and a pointer and dial for a visual output of fluid level.
The design of this sender included a formed metal base, on which is formed the dial face. The annular resistance wire was connected at one end to an external contact. A magnetically driven pointer assembly, having a resilient contact to sweep along the resistance wire, was grounded through the case by contact between the pointer assembly and the pointer stem on which the pointer assembly pivoted.
The magnetic drive feature is important because some fluid products, such as LPG, are stored under pressure. The magnetic drive allows the signal from the float mechanism inside of the tank to be transmitted through a solid, non-magnetic bulkhead without the necessity of dynamic seals or pressure tight conductors.
While a significant advance in the art, and still used today, a need exists for an improved sender which can be manufactured for less cost and be as reliable or more reliable than the original sender. Further, occasionally the ground contact between the pointer assembly and the case would be affected by corrosion, leading to a false resistance read out.

Magnetically driven variable resistor gauge


A simple and low cost device to detect the presence of mercury or other trace metals in the environment and quantify said concentration by spectrophotometric, colorimetric, or electrical conductivity is disclosed. Owing to its small size, it is suitable for portable mercury detectors or detectors that may be worn as badges in the breathing zone of workers.

Mercury is a deleterious anthropogenic pollutant. Mercury is a heavy, silvery, odorless liquid that may be released into the atmosphere in a number of ways, including but not limited to, the burning of fossil fuels. In 1999, the Environmental Protection Agency ("EPA") estimated that a year's worth of coal (in the US) contains approximately 75 tons of mercury, and the burning of this coal will lead to about 50 tons of mercury being released into our atmosphere. As part of this release mercury settles in the aquatic biosphere rendering fish potentially poisonous with recommended exposure limits. Additionally, mercury has been incorporated into everyday items, such as long-tube fluorescent light bulbs, which contain on average from 10 to 20 mg of mercury that affects the environment if not disposed of properly.
Adding to mercury's toxicity is the fact that at normal temperatures, mercury can evaporate into the air. Furthermore, when it is heated, this evaporation occurs at an elevated rate. Mercury vapor is extremely toxic to inhale, but difficult to detect due to its colorless and odorless nature. An acute exposure to mercury vapor inhaled into the lung results in a variety of lung and neurological problems including: headaches, cough, chest pain, and difficulty breathing. Continued exposure will eventually lead to loss of teeth, nausea, diarrhea and permanent lung scarring. Further, this exposure can cause severe kidney damage. Long-term exposure to mercury may cause shaking of the hands and facial muscles. However, the most deleterious neurological effects may be: headaches, trouble sleeping, personality change, memory loss, irritability, indecisiveness and loss of intelligence. Many of these symptoms can be attenuated or eliminated by avoiding further exposure, but first personnel must be able to detect mercury vapor in such areas. The termination of exposure is cogent because continual chronic exposure results in permanent injury. Consequently, mercury vapor is of major concern in the work environment, yet real-time detection and measurement of ambient mercury vapor remains costly and limited to bulky devices unsuitable to be worn in the breathing zone of workers.
In part, as a result of this heightened understanding of the consequences to humans and the environment posed by mercury and the costs associated with reducing and monitoring the release of mercury, in 1990 the Clean Air Act was amended, and the EPA was given authority to regulate mercury emissions. In recent years, the EPA has reduced the permitted concentration levels of mercury to trace levels (e.g. pursuant to the EPA the permitted concentration of mercury in drinking water is 0.002 part per million) to protect against these adverse health effects. Due to the EPA's regulations there is a need to measure the concentrations of various metal species, and this need is exacerbated by the lack of technologies to measure the presence of metals in the ultra-low (trace) concentration range. Currently only Atomic Absorbance, Atomic Emission, and Atomic Fluorescence Spectroscopies and their variants, and gold electrode conductivity meters are suitable for measurement, but such techniques require expensive and bulky equipment unsuitable for direct read operation in the breathing zone. For these reasons there is a need for a portable and comparatively inexpensive instrument, which allows for multiple approaches to detection and quantification of trace elements.

This patent is subject to a terminal disclaimer.

Colorimetric or electrochemical mercury and trace metal detector


A method and arrangement of increasing impairment co-variance matrix Ru estimation accuracy in downlink in a user equipment in a communication network system. De-spread is performed on HS-DSCH symbols to form a matrix X of de-spread symbols. The matrix X and channel estimates hc from CPiCH and modulation scheme information are used to form a matrix S of recovered symbols in hard value. The matrix X and the channel estimates hc, the modulation scheme information and the matrix S output are used to increase the estimation accuracy of the matrix S. The previous step is repeated until the output symbols are the same as the input symbols or the number of iterations reaches a pre-defined maximum value. The matrix X and the matrix S with increased estimation accuracy are used to form an impairment co-variance matrix Ru estimate.

RAKE receivers are well known in the communication arts and find widespread use in Code Division Multiple Access (CDMA) systems, such as in IS-95, IS-2000 (cdma2000), and Wideband CDMA (WCDMA) wireless communication networks. The name derives from the rake-like appearance of such receivers, wherein multiple, parallel receiver fingers are used to receive multiple signal images in a received multipath signal. By coherently combining the finger outputs in a RAKE combiner, the conventional RAKE receiver can use multipath reception to improve the Signal-to-Noise Ratio (SNR) of the received multipath signal.
Generalized RAKE (G-RAKE), or chip level equalizer, is an enhancement of the traditional RAKE receiver in a CDMA system. To cope with sudden changes in the interference, it is highly desirable to have a G-RAKE at each time slot and not to rely on cross-slot average. The difficulty is the estimation of the impairment co-variance matrix, i.e. the so-called Ru matrix.
In uplink, non-parametric G-RAKE employs un-used Walsh codes to estimate the impairment co-variance matrix, which leads to extremely good performance close to an ideal G-RAKE. The Walsh code tree structure in uplink implies that there always exist a number of un-used Walsh codes and the network knows them.
Walsh Code is a group of spreading codes having good autocorrelation properties and poor crosscorrelation properties. Walsh codes are the backbone of CDMA systems and are used to develop the individual channels in CDMA. For IS-95, there are 64 codes available. Code 0 is used as the pilot and code 32 is used for synchronization. Codes 1 though 7 are used for control channels, and the remaining codes are available for traffic channels. Codes 2 through 7 are also available for traffic channels if they are not needed. For cdma2000, there exists a multitude of Walsh codes that vary in length to accommodate the different data rates and Spreading Factors of the different Radio Configurations.
The information of complete downlink Walsh code allocation is not available to User Equipment (UE), moreover Walsh codes might be fully occupied by High Speed Downlink Packet Access (HSDPA), Release 99 (R99) and control channels and left no available un-used Walsh codes. Thereby UE cannot rely on un-used Walsh codes to estimate the impairment co-variance matrix. Instead, it uses either Common Pilot Channel (CPiCH), which is a commonly used method but very noisy, or potentially some data covariance or data-aided methods. So far there has been no sufficiently robust product algorithm proposal developed.
In downlink, G-RAKE is primarily intended for the reception of High Speed-Downlink Shared Channel (HS-DSCH), which is always associated with a High Speed-Shared Control Channel (HS-SCCH). HS-SCCH carries scheduling information like: 1) UE ID; 2) HS-DSCH transport format including Walsh code set (starting node and number of codes), modulation scheme and transport block size; 3) hybrid-ARQ-related parameters. The timing relation between HS-SCCH and HS-DSCH ensures that information like Walsh code set and modulation scheme is available for HS-DSCH on-the-fly demodulation. The structure of HS-SCCH limits the scheduling information only available to the intended UE, i.e. a UE which is not scheduled has no access to this information.
Since un-used Walsh codes are not available in downlink, a practical solution would be to have a parametric G-RAKE based on CPiCH, but it would not perform very well especially at high geometry (>15 dB), or to build a non-parametric G-RAKE for low mobile speed in order to allow for cross-slot average, which becomes an issue when facing sudden changes of interference, or to build a Minimum Mean Square Error (MMSE) G-RAKE or chip-level equalizer, but it can have catastrophic performance at high Signal to Interference-plus-Noise Ratio (SINR) regions, especially for Higher Order Modulation (HOM) like 16QAM (Quadrature amplitude modulation).
In order to overcome the shortage of number of pilots, 10 symbols per time slot, in the impairment co-variance estimation, US2009310715 proposes to use "soft pilots", which are "constant envelope" modulation symbols, for example Binary Phase Shift Keying (BPSK) or Quadrature Phase Shift Keying (QPSK), with higher reliability than others. A two-pass G-RAKE is proposed, where the 1st pass employs MMSE G-RAKE to recover "soft pilots" and the 2nd pass uses them to estimate the impairment co-variance matrix and form combining weights to recover all the traffic data. However, it was found that the performance leaves room for further improvement. So far this desire remains very challenging to be met.

Method and arrangement of increasing impairment co-variance matrix estimation accuracy


A method and apparatus for performing on-board corrections to the computed navigation variables of an inertial system on an aircraft while flying over a body of water. Onboard instruments, including a barometric altimeter and a radar altimeter, measure the vertical distance of the aircraft above an ellipsoidal model of the earth and above the body of water respectively. An on-board computer calculates the differences between such heights over a plurality of points along the path the aircraft travels over the water as indicated by its inertial navigation system. The differences are compared with a map of the undulation of the geoid encompassing the region to determine the deviation of the navigated course from the true course. Appropriate corrections to the aircraft's inertial system may then be made to reduce error.

1. Field of the Invention
The present invention relates to apparatus and methods for in-flight correction of an inertial navigation system employed on an aircraft. More particularly, this invention pertains to the performance of such calibration over a body of water without resort to devices and signals generated by external sources.
2. Description of the Prior Art
The in-flight correction of an aircraft's inertial navigation system is complicated when the aircraft proceeds over a body of water. When flying over land, the navigation system can rely upon known monument locations to provide the necessary feedback for updating the navigation variables of the inertial system and thereby overcome the effects of inertial instrument (accelerometer, gyro) errors.
When the aircraft proceeds over water, it no longer can rely upon the monuments that prove so useful over land as benchmarks. Rather, externally-based radio navigation systems must be utilized. LORAN, for example, can provide the over-water pilot with signals indicative of the aircraft's position. By taking radio fixes from such a system the pilot may then periodically correct the on-board inertial navigation system and its instruments.
Unfortunately, the use of externally-generated radio signals is not always possible. Military applications, for example, must be take into account the risk of destruction of an external signal source, the need for radio silence and other potential disruptions to the use of externally-generated navigation signals.

Self-contained method for correction of an inertial system over a body of water


A curable organopolysiloxane composition comprising a vinyl-containing organopolysiloxane, organohydrogenpolysiloxane and platinum catalyst is proposed which is cured into a gel-like material suitable as a potting and encapsulating agent for protecting, for example, electronic components from mechanical shocks and adverse influence of the ambient atmosphere. Different from conventional similar compositions, the gelled material from the inventive composition little suffers from the problem of bleeding of oily materials contained therein on the surface. This unique advantage is obtained by using, in place of the conventional vinyl-containing organopolysiloxanes in which the vinyl groups are bonded to the silicon atoms at random position in the molecular chain, a combination of two vinyl-containing organopolysiloxanes having a specified viscosity in a limited proportion, of which one has two and only two vinyl groups in a molecular each bonded to one of the silicon atoms at the molecular chain ends and the other has one and only one vinyl group in a molecule bonded to one of the silicon atoms at the molecular chain ends alone. The composition may further contain a low-viscosity dimethylpolysiloxane so that the silicone gel can be imparted with softness and adhesiveness without increasing the amount of bleeding of the oily constituents.

The present invention relates to a curable organopolysiloxane composition or, more particularly, to an organopolysiloxane composition curable into a gelled mass suitable as a potting and encapsulating agent, for example, for protecting various electric and electronic components from mechanical shocks and influences of the ambient atmosphere without the problem of oozing or bleeding of the oily constituents contained therein.
Organopolysiloxane compositions cured to have a gel-like consistency, referred to as a silicone gel hereinafter, are widely used as a potting and encapsulating agent of various kinds of electric and electronic devices and components by virtue of their excellent electric properties such as insulation with stability and mechanical properties such as shockabsorbing power. For example, components of electronic circuits such as power transistors, integrated circuits, capacitors and the like are embedded in a silicon gel so as to be protected from mechanical shocks and thermal and corrosive influences of the outer atmosphere which would otherwise cause a damage on the component.
Organopolysiloxane compositions capable of giving a silicone gel are cured by a crosslinking reaction which proceeds by several different mechanisms. Most of the organo-polysiloxane compositions to give a silicone gel utilize the so-called addition reaction or hydrosilation reaction between vinyl groups directly bonded to the silicon atoms in a first organopolysiloxane and hydrogen atoms directly bonded to the silicon atoms in a second organopolysiloxane or organo-hydrogenpolysiloxane in the presence of a platinum catalyst. Various formulations have been proposed in the prior art for the addition-curable organopolysiloxane-based silicone gel compositions with an object to obtain an adequately controlled gel-like consistency. For example, Japanese Patent Kokai 56-143241, 62-39659, 63-35655 and 63-33475 disclose a composition comprising a vinyl-containing organopolysiloxane and an organohydrogenpolysiloxane in such a proportion as to provide a relatively small amount or from 0.3 to 0.6 moles of the silicon-bonded hydrogen atoms in the organohydrogenpolysiloxane per mole of the vinyl groups n the vinyl-containing organopolysiloxane or a composition formulated with a vinyl-containing organopolysiloxane containing from 0.1 to 1.8 moles of the silicon-bonded vinyl groups per mole on an average.
These prior art organopolysiloxane compositions, however, have a problem in common that the oily constituents contained in the silicone gel obtained therefrom more or less subsequently bleed out of the surface or migrate toward a body embedded therein or in contact therewith. In the composition of the former type containing the silicon-bonded vinyl groups in an amount smaller than equimolar to the silicon-bonded hydrogen atoms, namely, the silicone gel obtained therefrom necessarily contains a considerable amount of the uncrosslinked organopolysiloxane which is responsible for the undesirable phenomenon of bleeding. In the composition of the latter type utilizing a vinyl-containing organopolysiloxane containing a relatively small amount of the silicon-bonded vinyl groups on an average, the organopolysiloxane as a product of the equilibration reaction is a mixture containing molecular species of the organopolysiloxane having no silicon-bonded vinyl groups and hence incapable of pertaining to the crosslinking reaction so that the silicone gel obtained from the composition always contains such as unreactive constituent responsible for bleeding. Once the phenomenon of bleeding has taken place, the bleeding oily matter badly contaminates the electric or electronic component in contact with the silicon gel to cause troubles of failure in the electric connection between contacting terminals and the like. When such a silicone gel is in contact with a part made from a silicon rubber, in addition, the oily matter bleeding out of the silicon gel acts as a swelling agent of the silicone rubber to cause volume expansion or deformation of the silicon rubber parts.


A clamping tool for securing a heat sink to a holding frame, which is disposed on top of a central processing unit (CPU), includes a support arm, a press handle, an elastic member, and an engaging arm. The support arm provides a horizontal arm member and an elastic vertical arm member being attached to an end with a lower hook end thereof engaging with a lock hole disposed at a lateral side of the holding frame. An end of the press handle has a round projection with an eccentric pivotal hole. The elastic member is a bow shaped plate being disposed under at an end of the horizontal arm member. The engaging arm has an upper end with a pivotal hole and a lower bent end and the upper end passes through the elastic member and pivotally fits with the press handle by way of a pivotal shaft passing through the pivotal hole and the eccentric pivotal hole. The lower bent end engages with another lock hole at another lateral side of the holding frame. whereby, the press handle is stirred, the heat sink is capable of being clamped against the CPU due to the elastic member providing a capability to bias the engaging arm toward the holding frame.

1. Field of the Invention
The present invention is related to a condensation device for a fuel cell and particularly to a condensation device, which is capable of guiding heat outward and condensing high heat and humidity gas produced while the fuel cell being in operation without consuming extra energy under conditions of limited volume of the fuel cell and limited space available for the condensation device.
2. Brief Description of the Related Art
It is known that various portable electronic information products have been developed due to technologies related to electronics, communication and internet progressing rapidly. Usually, the portable products need batteries as power source for supplying electric energy. But, the batteries have limited capacities and become exhausted after being used a period of time. In order to overcome the preceding deficiency of the ordinary batteries, a method for making fuel cell has been disclosed in Taiwanese Patent No. 1241048. The fuel in the cell is a methyl alcohol solution or pure methyl alcohol and a chemical reaction is processed to transfer chemical energy to electric power output. Comparing to the conventional power generation, methyl alcohol cell provides advantages such as low pollution, high energy intensity and higher energy transfer density.
When the fuel battery is in operation, preferable effect can be reached under conditions of proper work temperature and humidity. Thus, structure of the fuel cell has passages for gas and often needs active cooling component such as cooling chips or guiding heat pipes for reducing temperature in addition to having cooling passages for maintaining the fuel cell at a proper temperature. However, gross power consumption of all components in the fuel cell system is an important factor needed to consider to the entire design. How to design a cooling device with no energy consumption and high efficiency is worth us to care. Besides, how to recycle and reuse moisture in the high heat and humidity gas produced during the fuel cell being in operation is a problem worth us to solve too.


A locking cable device, which generally inhibits the theft of portable and more specifically inhibits the theft of expensive, electronic devices such as computers, laptops, and projectors. The security device works by use of a hook that hooks through an opening in an outside wall of the equipment to be secured. The hole can be an existing hole in the outside wall of the equipment, either round, square, or rectangular, such as a vent slot or security slot. A user may also add the opening by merely drilling an aperture or slot, sized appropriately for the corresponding hook on the security device. The hooked position is maintained by use of a housing locked on to the cable, close enough to the equipment being secured that the hook cannot be moved to an angle necessary for removal.

The present invention relates to anti-theft devices for deterring the theft of small but expensive pieces of equipment. Many devices have been developed to help prevent the theft of computers and other electronic equipment. Since many systems that need security include several items, such as a computer and a monitor and a printer, such security devices often utilize a cable which connects each of the components to each other and/or to a relatively immovable object such as a desk.
Most computer manufacturers incorporate some attachment method for security devices. This practice began on some of the earliest Macintosh computer models, where they provided several different sized security slots designed to accept 'snap-in' security attachments that would then allow a security cable to pass through that attachment. Other manufacturers provided reversible brackets built into the computer chassis that allowed you to remove the computer cover and turn the bracket around for use with a security cable. Even others had nothing but regular chassis screws that were secured by use of "screw-on" fasteners that security cables passed through to prevent unscrewing the fastener and thus secure the equipment. All this has evolved over the years to the point where most manufacturers of desktop computers provide a bracket already protruding from the back of the chassis with a hole that a security cable can pass through.
On smaller devices like laptops where a protruding bracket is undesirable, manufacturers have adopted a small security slot in the exterior wall. Many different security devices have been developed over the years to fit into this security slot. The majority of those devices rely on two or more tiny opposing hooks to maintain a locked position in the security slot, or one slot engagement member with one or two pins also entering the slot to maintain the locked position of the slot engagement member, the pins preventing rotation of the entire housing to prevent moving the slot engagement member to align with the slot and pull back out of the security slot.
One of the biggest drawbacks of the existing devices is that all the laptop manufacturers design this security slot in vastly different sizes and the wall through which the hole, opening aperture or slot passes is made of a wide range of thicknesses. The existing security devices must be designed to fit the thickest of these walls, and thus they "flop around loosely" on most laptops. This creates a perception of insecurity that has plagued the industry since its inception. The present inventor has been in the industry for almost 15 years and dealt with many different laptop security devices and has had to deal with this major complaint from customers ever since computer manufacturers started putting existing slots into the computers.
The second major drawback of existing devices for laptop security is that previous thinking has limited the inventions to a slot engagement member providing security and a second engagement member or pin entering the security slot to maintain the locked position. This cuts down the raw physical size of the engagement member to a fraction of the size of the available security slot, making the device much easier to break, or snap off, at the point of security. The present inventor has seen customer tests of existing products that work with the small security slot in laptops fail by breaking year after year.
Overriding the considerations of laptop security are computer security needs in general. For many years, there have been countless security devices for computers that were model-specific, such as special sized enclosures or straps, or cables with special fasteners for the exact computer they were meant to protect. Many times the user did not realize that the security device they purchased would not work on other computers until they replaced the computer with the next model. With today's constant upgrades, this type of security device is simply inefficient and costly.


The invention relates to a display device including a luminous element and a light guide which has coupling locations and decoupling locations and transports a light signal that is emitted by the luminous element. The inventive luminous element has a radiation characteristic, the solid angle of which can be controlled.

The invention relates to a display device comprising a luminous element and a light guide having incoupling and outcoupling locations, the light guide being able to transport a light signal emerging from the luminous element.
In display devices of this type, signals are displayed on a projection surface by means of a differentiating optical signal transmitter via an optically conducting element. In such displays, individual light-emitting elements, or an electronic display, are used. Examples of the application of such display devices are multistatus displays in tacographs or car radios that display a number of display states on a display field via a light guide and, for example, two LEDs. Another application are economy displays, arranged in the form of a ring or bar, that are implemented, for example, by means of 20 light-emitting diodes (LED) or by a liquid crystal display (LCD). The disadvantages of such a display are the complex layout of the circuitry and the large number of discrete components that thereby entail high production costs and a low degree of design freedom.

Display device comprising a luminous element with an emission characteristic of controllable solid angle


A device is dedicated to generating messages relating to at least one satellite navigation system and to be sent to navigation receivers. This device comprises processor means responsible for generating “description” messages to be broadcast to the navigation receivers from a chosen date and comprising a description of a format of future messages to be broadcast to the navigation receivers from a date after the chosen date.

1. Field of the Invention
The invention concerns satellite navigation systems (of RNSS (Radio Navigation Satellite System) or GNSS (Global Navigation Satellite System) type), and more precisely the generation of messages that relate to such systems and are to be sent to navigation receivers.
Here "satellite navigation system" means any system dedicated to navigation and including a constellation of satellites placed in orbit around a heavenly body (for example the Earth), a set of (terrestrial or spatial) satellite surveillance stations, and a computer center. It could be one of the existing systems (GPS, GLONASS), for example, or one of the planned systems (GALILEO, COMPASS), or one of their equivalents or derivatives.
2. Description of the Prior Art
As the person skilled in the art knows, satellite navigation systems periodically broadcast (navigation and integrity) messages including navigation information relating to the orbital positions and/or synchronizations (internal clock offset relative to the reference clock of the system) of their satellites to navigation receivers of users by means of their satellites (and/or associated equipments, for example pseudolites (such as transmitters on the ground or onboard high-altitude aircraft)).
Such messages generally consist of parameters having their own type and representation (integer, floating point, number of bits and the like) that are predefined and contained in successive data fields associated with each other in a predefined way.
The navigation receivers therefore have available an interface knowing the parameter types and representations that are contained in the broadcast messages and how the fields containing these parameters are associated with each other in broadcast messages. In other words, the interface of each navigation receiver is specifically configured as a function of the format of the messages received in order to be able to understand their contents.
Navigation systems are subject to increasingly frequent changes to implement new services and/or to correct problems. Some of these changes may necessitate modification of the format of the messages. For example, a change may add one or more parameters or modify the type and/or the representation of one or more parameters.
Such format modifications are often incompatible with existing navigation receivers and so certain changes to the navigation systems cannot be put into effect.
For the GPS, it has been proposed to add a new dedicated signal "L1C" to the signal "L1 C/A". The messages of the new signal L1C are understandable to new generations of navigation receiver and are much more effective than those of the signal L1 C/A. This new signal L1C is transmitted on the same frequency as the signal L1 C/A. The drawback of this solution lies in the fact that it imposes the broadcasting of both signals L1 C/A and L1C, which is costly and consumes too much of the limited resources.
Another solution has been proposed for "augmented" navigation systems or SBAS (Satellite Based Augmentation Systems) that currently have limited capacities that in particular prevent surveillance of more than 51 satellites. It has therefore been proposed to add to the signal "L1" dedicated to messages understandable by older generation navigation receivers a new signal "L5 I" dedicated to messages understandable by new generations of navigation receiver. This new signal L5 I is transmitted on a frequency different from that used for the signal L1. The drawback of this solution lies in the fact that the service offered by the signal L1 is significantly inferior to that offered by the new signal L5 I, which is detrimental to older generation receivers adapted only to the signal L1.
Thus an object of the invention is to remove some or all of the drawbacks referred to above.

Device for generation of format description messages of future messages relating to a satellite navigation system


Disclosed herein are a CMP slurry composition with high-planarity and a CMP process for polishing a dielectric film using the same. More specifically, a CMP slurry composition with high-planarity includes a carbon compound having tens of thousands of carboxyl groups and having a molecular weight ranging from hundreds of thousands to millions, an abrasive, and water. A CMP process for polishing a dielectric film utilizes the disclosed slurry composition. The slurry composition enables complete and overall planarization of the dielectric film by polishing the part of the film having a higher step difference through CMP process. Accordingly, the disclosed slurry composition is useful for the CMP process of all semiconductor devices including those having ultrafine patterns.

1. Field of the Disclosure
The disclosure generally relates to a slurry composition with high planarity and a chemical mechanical polishing (CMP) process of a dielectric film using the same. More particularly, the disclosure relates to a high-planarity slurry composition comprising water, an abrasive, and an anionic polymeric carbon compound including a plurality of carboxyl groups, and a CMP process of a dielectric film using the same.
2. Description of the Related Technology
In fabrication of semiconductor devices, if planarity of each layer in the multi-lines is not good enough, it exerts adverse effects on the contact between the lines. As the width of circuit lines become thinner, it has become more difficult to obtain a plane wafer by a conventional etch-back or reflow process. Therefore, there has been a need for a new planarization process and a new wafer polishing process combining a mechanical process and a chemical process called chemical mechanical polishing (abbreviated as CMP), which was developed by IBM Company in the late 1980's. A deformed layer formed by a conventional mechanical polishing process can be a flaw on a semiconductor chip. In addition, although the deformed layer is not formed by a chemical polishing process, a flat pattern (i.e., pattern accuracy) cannot be achieved; instead, only a simple flat surface can be obtained. The basic concept of the CMP process is to polish a wafer by combining advantages of the above-described two processes.
As described above, the planarization process is necessarily required in fabrication of semiconductor devices, and such process includes resist etch back process, spin on glass (abbreviated as "SOG") process, boro-phospho-silicate-glass (abbreviated as "BPSG") reflow process, and CMP. Among them, CMP has been known to have a planarization range larger by 100 to 1,000 times those of other planarization processes.
A wafer is polished by a pad and slurry in the CMP process. However, the wafer is not completely planarized in the CMP process using conventional slurry. The degree of planarity (abbreviated as "DOP") of the CMP process, which is generally defined by Equation 1 (below) cannot reach 1 through a removal of a step difference by the conventional CMP process. If a step difference still exists after the CMP process, a margin shortage of the depth of focus (abbreviated as "DOF") in a subsequent exposure step and a margin shortage in an etching step induce a bridge formation or increase a leakage current, thereby causing the device to fail. Particularly, the margin shortage in a subsequent self-aligned contact (abbreviated as "SAC") process affects the device fail when the wafer is not completely planarized in an inter layer dielectric (ILD) CMP process of a DRAM fabrication.
                              Degree                                                              of                                                              Planarity                =                  1          -                                    SH              f                                      SH              i                                                          [                  Equation                                                              1                ]
In Equation 1, SHi is the abbreviation for initial step height, which represents a step difference before the CMP process, and SHf is the abbreviation for final step height, which represents another step difference after the CMP process. When the SHf is 0, then the DOP becomes 1, meaning complete planarization is achieved.
FIGS. 1a to 1c show the conventional CMP process. Pattern 1 is formed through a photo-etching process in the fabrication of a semiconductor device, and a region where the pattern is not formed is filled with an dielectric film 2 (see FIG. 1a). Herein, in order to remove step difference t1, a CMP process using abrasive 3 and pad 4 is conducted (see FIG. 1b). However, step difference t2 still remains after the CMP process was completed (see FIG. 1c).
When the step difference is removed by conventional CMP process, the degree of planarity cannot exceed 0.7 at its maximum due to various factors such as dielectric film deposition characteristics before the CMP process, degree of elasticity of the pad, characteristics of slurry and non-uniformity in the polishing process. In other words, the conventional method cannot decrease the step difference by more than 70% of the initial step height SHi and about 30% of the initial step height remains after the CMP process. As a result, it is difficult to apply the conventional method to a semiconductor device having fine circuit pattern, such as a device having a circuit line width of less than 100 nanometers (nm).

Slurry composition with high planarity and CMP process of dielectric film using the same


The present invention involves a fabric craft article and an associated method and kit for producing making the same. The disclosed fabric craft article comprises a substrate having a design depicted in the surface thereof by scored channels or grooves extending into the surface of the substrate, which design is defined by discrete design sections each having a predetermined shape and size; a discontinuous padding layer carried by the substrate; and in turn a discontinuous fabric layer which secures the padding layer to the substrate. The padding layer is defined by discrete padding sections, each of which corresponds to the predetermined shape and size of a different one of the design sections. The discontinuous fabric layer overlies the padding layer, and is defined by a plurality of discrete fabric sections, each of which corresponds in shape to the predetermined shape of one of the design sections, but is of a size larger than that of the corresponding design section such that the peripheral edges of each fabric section extends beyond the peripheral edges of the corresponding design section in each lateral dimension. The corresponding padding and fabric sections are located in registration with the corresponding design sections and the peripheral edges of the fabric sections are adhesively tucked into the scored channels or grooves which define the design sections to thereby adhesively secure the padding and fabric sections to the substrate. The disclosed kit includes all of the necessary material and a tool for construction a fabric craft article of a predetermined design.

Various craft articles similar to that disclosed herein are known in the art. For example, U.S. Pat. No. 4,514,175 to Zaruba, et al. discloses a reusable craft kit which comprises a rigid background board with a playful design depicted on its front surface. Various portions of the design are defined by openings in the background board which extend through its depth. Backing pieces that conform in shape to the openings extending through the background board, but which are slightly smaller than the openings are included in the kit. These backing pieces may be covered with padding and an appropriately colored fabric and inserted into the corresponding holes in the background board to allow the artisan to add a personal touch to the depicted design. When the backing pieces are covered by padding and fabric and inserted into the corresponding openings, the peripheral edges of the fabric become wedged between the circumferential edge of the backing piece and the defining edge of the corresponding opening to frictionally secure the covered backing pieced within the background board. By completing the craft set in this fashion, one can create a design having three-dimensional accentuated areas.
Because the craft kit disclosed in the Zaruba patent depends upon the frictional relationship between the background board and the associated backing pieces to secure the padded sections to the background board, there must of necessity be portions of the design which remain uncovered by padding or fabric. Accordingly, only various portions of the overall design can be depicted in a three-dimensional manner.
U.S. Pat. No. 4,814,218 to Shane discloses a quilted craft article and method for making the same. The disclosed article comprises a substrate in which slits on the surface define a pattern for the quilted article and individual sections of the overall pattern. In the method, the quilted craft article is adorned with preselected pieces of fabric by selecting fabric pieces corresponding in shape to, yet are slightly larger than, the individual sections of the pattern. Accordingly, the peripheral edges of the fabric sections can be grippingly fastened to the substrate material by tucking the peripheral edges of the fabric sections into the slits and thus into the interior of the substrate.
Although the craft article disclosed in the Shane patent overcomes the problems associated with the Zaruba article, i.e. that only portions of the overall design may be covered by the fabric, the Shane construction has proven undesirable in practice because the "gripping" engagement of the fabric sections provided within the slits formed in the substrate lacks sufficient strength to maintain the integrity of the craft article over an extended period of time. That is, the tucked edges of the fabric sections are free to become disengaged from the substrate, and over time tend to do so, thus destroying the aesthetic nature of the craft article.
In addition, the Shane construction is ornamentally undesirable because it yields a flat or two-dimensional product lacking a truly soft or "cushioned" appearance.
Another craft article similar to that disclosed by Shane is known in the art, but is not the subject of a patent. This article avoids the undesirable aesthetic attributes which burden the Shane construction by employing a loose-fill padding layer between the substrate and fabric layer. This construction supplies the desired "cushioned" appearance, yet does not solve, and in fact aggravates, the integrity problem which renders the Shane construction impractical. In addition, because this approach contemplates a loose-fill padding layer, it is attended by an untidy fabrication process as well as a similarly untidy problem should the fabric sections eventually become dislodged from the substrate. Furthermore and also due to the loose nature of the padding material used in this type of construction, the "cushioned" areas in this type of craft article are prone to lose their uniform shape and appearance with age. Such undesirable attributes are the result of movement of the padding material within the "cushioned" areas in response to, for example, rough handling or gravity.
Accordingly, it is the object of the present invention to provide a fabric craft article that overcomes the problems associated with these conventional articles, yet one which can be simply and economically produced.
More particularly, it is an object of the present invention to provide a fabric craft article having a three-dimensional topography across its entire face, while at the same time maintaining the structural integrity of the article over extended periods of time.


A semiconductor IC device includes a memory cell group; a pair of bit lines connected to the cell group; plural equalization transistors T.sub.R connected between the bit lines; address transition detectors ATD for detecting changes in address bits; and plural equalizing pulse generating circuits composed of plural logical gates, 15 to 22, respectively and provided for each equalization transistor to generate an equalizing pulse signal to each equalization transistor so that the levels of the two bit lines can be equalized with each other. Since signals outputted from the address transition detectors are synthesized, in particular at a node to which the equalizing pulse signal is applied, the number of logical gate stages to synthesize the detector output signals can be reduced and the wire lengths (e.g. wire capacitances) of the logical gates can be well balanced, thus improving the equalizing speed of the IC device.

The present invention relates to a semiconductor integrated circuit device provided with equalizing pulse generating circuits.
In prior-art semiconductor integrated circuit devices (referred to as IC, hereinafter), that is, in static LSI memory devices in particular, an equalizing pulse generating circuit is provided for increasing data read speed from memory cells. The above-mentioned equalization is effected as follows: an equalization transistor is provided between a pair of bit lines b; address transition detectors are provided to detect a change in address; a plurality of the address transition detection signals are synthesized by an equalizing pulse generating circuit composed of logical circuits to generate an equalizing signal which can turn on the equalization transistor to equalize the voltage levels of the two bit lines.
In designing the equalizing pulse generating circuit for equalizing the bit lines in level as described above, the following points must be taken into account:
(1) The logical circuits constituting the equalizing pulse generating circuit must be combined efficiently so that the level of the bit lines is equalized on the basis of pulse signals generated by the address transition detectors and a control circuit. In addition, the number of stages of the logical circuits must be minimized; PA1 (2) The optimum dimensions must be determined for the respective logical circuits under due consideration of the wire capacitance, the gate capacitance of the succeeding stage, etc.; and PA1 (3) The pattern of the logical circuits formed on a chip must be optimized so that the lengths of wires from the address transition detectors and the control circuit to the logical circuits can be minimized. PA1 (a) The equalizing pulse signals are generated from the equalizing pulse generating circuit composed of combined logical circuits, on the basis of change in address detected by all the address transition detectors. Therefore, there exists such a tendency that the scale of the equalizing pulse generating circuit increases with an increasing number of address inputs and the advance of the memory capacities, with the result that it has become difficult to further reduce the number of stages of the logical circuits for improvement of the data read speed to the memory cells. PA1 (b) Within the chip, the number and the length of wires between the address transition detectors, the control circuit and the logical circuits inevitably increase with increasing memory capacity, as compared with those of the conventional memory device. Accordingly, since the respective output load capacitances of the respective logical circuits increase with increasing wire capacitances, the dimensions of the respective logical circuits or the inverter circuits in particular, increase. In the case where the dimensions increase, since the output load capacitance of the preceding stage logical circuit tends to drive the inverter circuit of increased dimensions, it is also necessary to increase the preceding stage circuit dimensions, thus resulting in a vicious circle. To avert this vicious circle, a method of driving the logical circuits by large dimensional circuits or the method of increasing the number of logical gates is required, thus reducing the data read speed to the memory cells. PA1 (c) With respect to the peripheral circuits, there exists a tendency that the number of stages of the logical circuits from address inputs to word lines WL connected to the memory cells decreases due to miniaturization of the device or formation of the circuits into BiCMOS devices. In contrast with this, since the number of logical stages of the equalizing pulse circuit for generating an equalizing pulse signal does not change or tends to be increased for the reason as described in items (a) and (b) above, there exists a problem in that only the speed of equalization is not increased. PA1 The above-mentioned problem will be explained in more detail with reference to FIG. 5, which shows an arrangement on a prior-art semiconductor IC device chip. In FIG. 5, address transition detectors ATD.sub.i (i=1, . . . 7) and a control circuit CC are arranged on predetermined positions on the chip in such a way that the detectors ATD.sub.4 . . . ATD.sub.7 are formed on the left side of the memory cell section; the detectors ATD.sub.2 and ATD.sub.3 are formed on the upper side of the memory cell section; and the detector ATD.sub.1 and the control circuit CC are formed on the right side of the memory cell section. Further, logical circuits 50 . . . 60 which constitute an equalizing pulse generating circuit are arranged at appropriate positions under due consideration of the afore-mentioned items (1), (2) and (3). Input nodes 301, . . . 308 of NAND gates 50, . . . 53 are roughly equal to each other in wire length and therefore there exists no specific problem. However, only an input node 311 to a NOR gate 55 is longer in wire length than other input nodes 309, 310, and 312 to NOR gates 54 and 55. Further, an input node 314 to a NAND gate 56 is much longer in wire length than an input node 313 to the same NAND gate 56, thus resulting in an unbalanced wire layout.
With the advance of the larger capacity and higher speed static memory devices, recently, the following problems arise in designing the above-mentioned equalizing pulse generating circuit.
When a pair of nodes to be compared is in unbalanced condition; that is, when one of the node wire lengths is longer than the other node wire lengths, the capacitance of the long node wire is larger than that of the short node wire. For instance, the wire capacitance of the node 311 is large, and the wire capacitances of the nodes 309, 310, and 312 are roughly equal to each other and small in comparison with that of the node 311. Therefore, even if the circuit dimensions of the NAND gates 50, . . . 53 are all the same, since only the NAND gate 52 whose output terminal is connected to the node 311 has a large wire capacitance as compared with those of the other NAND gates 50, 51 and 53, a problem arises in that the operation speed of the equalizing pulse generating circuit composed of the logical circuits is inevitably reduced.


Metallic or non-metallic wires or bristles are attached to a hollow, cylindrical core. The wires or fibers are quite fine in diameter. Space is provided in the core in the shape of perforations for the transfer of electrolyte, which is fed from the hollow inner portion of the cylinder, along the fibers, to the copper substrate on an imaged substrate.. Electrical or non-electrical sources are employed. The wires may be electrically connected through the metal cylinder to the positive pole (anode) of the DC power source. The non-conductive fibers make direct contact with the metal to be etched. In the electrical device within the hollow cylinder but separated from the cylinder is positioned a perforated or mesh copper, which is connected electrically to the negative pole (cathode) of the DC power supply. A cell is now made between the copper laminate and the perforated copper inside the cylinder. Copper from the laminate (anode) is removed and deposited on the perforated copper (cathode).. The same apparatus is used for electroforming applications. The wires can be connected to the negative pole of the rectifier, while an anodically insoluble conductive substrate can be used in place of the counter-electrode within the hollow cylinder. By contacting an activated or metallic substrate with negatively charged fibers one can deposit metal in the exposed areas.

1. Field of the Invention
This invention relates to methods and apparatus for fabrication of fine line and space interconnections in electronic packaging. The invention is in particular applicable for printed circuit boards (PCB), tape automated bonding (TAB) systems and other electronic devices with the need for fine line and space interconnects.
The technical content of PCBs are based on three aspects: density of the electronic circuitry, number of layers, and the quality of material used in lamination of the boards. This invention relates to the first aspect, the density of the board. Density is determined by the relative proximity of the electrically active elements and their number per unit area of the board. The elements that constitute the majority of electrical elements on the board are the copper conductor lines. Hence, the density of the PCB is dependent upon the lateral spacing of the conductor lines and their width.
2. Description of the Prior Art
The trend towards finer lines and decreasing interline spacing has been strong in recent years, and will continue into the future. There have been several articles on this subject. In the article "Shrinking Semiconductors", PC Fabrication, May, 1988, R. W. Allison, Jr. and others state that "a steadily decreasing IC line width increases the number of connections to be made on package/board interface. These require an increase in PCB line density and the number of layers in the board." In concurrence with the great majority of authorities in the field they conclude that PCBs with 2 mil lines will become the standard in the industry in the early 1990s.
In the June 1987 edition of Printed Circuit Fabrication, Vol. 10, No. 6, at pages 37-44, an article by R. D. Rust, entitled "Fine Line Technology: The Impact of Dry Plasma Processing", discusses the supplanting of the wet chemical processes by dry plasma processes for printed circuit fabrication. One of the issues noted by Rust is the need for generation of fine line features of less than four mils. Rust notes that photolithographic resolution is not the limiting process in generating these features; rather, the subsequent processes of developing, etching or plating are the limiting processes.
Conventional printed circuit boards are manufactured in the following manner: the process consists of first joining epoxy and copper laminates by heat and pressure. The epoxy laminate is much thicker than the copper laminate as it provides the mechanical support. Application of heat and pressure causes the epoxy to soften and bond to the copper laminate. The copper surface is either chemically treated, or electrochemically with dendritic treatment, both of which produce a jagged surface on a microscopic scale, which promotes adhesion.
Photo-resist is then applied on the copper surface. Liquid photo-resist application has been replaced lately by `dry` photo-resist methods. In the dry photo-resist technique, a photo-resist film is laminated on the copper again by heat and pressure
The conductor pattern is then `exposed` on the photo-resist. The exposed board is `developed` in an appropriate chemical solution that dissolves the photo-resist, consequently exposing the copper surface along the areas which needed to be etched in the following `copper etching` operation.
In the copper etching operation, the developed board is passed through a chemical spray chamber, where jets spray chemicals which dissolve copper. The photo-resist and the copper etching solution have been so chosen that the chemicals only attack copper and not the photo-resist. At the conclusion of the copper etching process a well defined conductor pattern with an overlay of photo-resist is left on the epox substrate.
The photo-resist overlay is then etched away by another chemical solution which only etches the photo-resist and not the copper
In printed wiring board manufacturing involving `multi-layers`, i.e. boards containing several layers of alternate copper conductors and epoxy laminates, interconnection between the copper conductors on different levels is necessary. That is accomplished by drilling holes at the appropriate levels and depositing copper in the holes, with a prior treatment which assures adhesion of the deposited copper to the epox sidewalls.
This etching technology employs an oxidizing solution consisting typically of ferric, cupric or persalfate ions which is sprayed over an imaged laminate. In a subsequent process, copper surfaces protected by an insulating film become part of the circuitry following removal of the film by chemical dissolution.
By the nature of the hydrodynamics of the typical spraying process, the etching solution is unable to penetrate deeper into the recesses formed at levels of less than five mils in spacing. Therefore, the exchange of matter is slowed considerably so that the etching process in narrower spaces is so slow that it does not accomplish the necessary copper removal in comparison with wider spacing. These limitations in mass transport is a major limitation in spray chemical etching process.
Two approaches are known in the art. In one of these methods, the circuitry is made additive. Negative masking leaves openings for the circuitry. Bare substrate in these openings is sensitized with a palladium activator such as employed in electroless copper. Activation is followed by growth of the electroless copper to the required thickness.
Transport of matter is a limiting aspect of this process in the same manner as in the etching process. Other problems with this technique is a slow rate of line formation. Problems also occur in the mechanical properties and quality of the formed copper.
Another method employed in the prior art involves electrochemically assisting the chemical etching. In this method, a positive electrical field is applied to the laminate. Electrical contact is typically made at one side of a board. As long as electrical connection is maintained, dissolution occurs both chemically and electrochemically. Problems with this method include resulting electrical discontinuities in the patterns produced.
Derek Pletcher, in his book Industrial Electrochemistry (Chapman & Hall, 1982), mentions an electrochemical etching method for making PCBs where the laminated copper with developed photo-resist that exposes only the area to be etched is subjected to a mixture of graphite particles and sulfuric acid. The graphite particles have been previously charged by being in contact with the anode. This process, however, has not proven to be successful on a commercial scale due to the expensive etching method involving the use of graphite, its recovery, and etchants at high concentrations. In addition, this method suffers of standard problems in substrative technology, i.e. mass transport limitations and the undercutting of the copper with dissolution propagating in all directions with equal rate.

Method and apparatus for manufacturing interconnects with fine lines and spacing


A cable attachment includes a base portion bent such that a first end portion and a second end portion are oriented in the same direction; a plurality of first type of attachment portions that are arranged in spaced relation to each other along a length of the first end portion of the base portion; and a plurality of second type of attachment portions that are arranged in spaced relation to each other along a length of the second end portion of the base portion. The first type of attachment portions and the second type of attachment portions are alternately disposed in the length direction.

1. Field of the Invention
The present invention relates to a cable attachment for attachment thereto of a plurality of cables in a parallel arrangement, and a cable assembly and a connector that include the cable attachment.
2. Description of the Related Art
For a conventional connection structure of a plurality of cables to a connector, there is one in which a plurality of cables are respectively fixed, by applying pressure, to a plurality of contacts and the contacts are incorporated one by one into a body of the connector. This connection structure has a drawback that when the number of cables increases, it takes time to fix cables respectively to contacts by applying pressure and incorporate the contacts into a body. Moreover, since cables are connected one by one, there is another drawback that such connection structure is apt to cause wiring errors.
In view of these drawbacks, there is another connection structure in which a plurality of cables are attached to attachment hardware and the attachment hardware is then attached to a body of the connector while the plurality of cables are respectively brought into contact with a plurality of contacts of the connector, whereby the plurality of cables are connected to the connector at once.
As examples of such attachment hardware, there are one to which a plurality of cables are attached by soldering or the like, and one in which a plurality of cables are sandwiched respectively by a plurality of attachment portions which are arranged on the above-described attachment hardware so as to be spaced apart from one another in a length direction (see Japanese Patent Application Laid-Open No. 11-260439 and Japanese Patent Application Laid-Open No. 2006-54102, for example).
The former example has a drawback that if cables are single-core cables or the like whose outer peripheries are covered with insulators, the cables are not adapted for soldering. Even if cables are coaxial cables or the like that have solderable shields, the shield may be hardened by soldering. Thus, there is another drawback that when the cables are bent, the shields may break.
The latter example does not have drawbacks such as those of the former. Attachment portions are formed by being cut and raised from a plate body to serve as attachment hardware. In addition, in order that attachment portions suitably sandwich cables, the attachment portions require a developed length that corresponds to the outer diameter of the cables.
Hence, through to miniaturization of connectors, spaces between cables become smaller, three times or less than the outer diameter of the cables. When an attempt is made to set the same spaces between the attachment portions as the spaces between the cables, the attachment portions may not have sufficient developed lengths to suitably sandwich cables because those attachment portions are cut and raised from a plate body.
In short, the latter attachment hardware has an essential drawback, that is, when the spaces between cables are small relative to outer diameters of the cables, it is impossible to dedicate enough developed lengths of the attachment portions.

Cable attachment, cable assembly including the same, and connector including the assembly


A computer-implemented method includes: obtaining and storing, by a computer device, a service profile defining writing style rules, scoring information, and threshold information; receiving, by the computer device, an extracted program integrated information (PII) message from a client device; determining, by the computer device, an overall validation score of the extracted PII message is less than a threshold defined by the threshold information; generating, by the computer device, a modified PII message by changing content of the extracted PII message; and returning, by the computer device, the modified PII message to the client device for replacing the extracted PII message in a source code.

The present invention relates generally to automated code validation and, more particularly, to automated source code writing style evaluation, validation, and modification.
An integrated development environment (IDE) is a software application that provides comprehensive facilities to computer programmers for software development. Natural language processing, cognitive technologies, and DevOps environments make it possible to integrate globalization and document development in an IDE. Program Integrated Information (PII) is the function of writing run time messages (e.g. warning, help, usage, error, status) for a software product. Globalization enablement features are used in processing data in a correct format, language, and information. Machine translation (MT) is an automatic translation tool used to translate information content from a first language to a second language.

Automated source code writing style evaluation, validation, and modification

INTERNATIONAL BUSINESS MACHINES CORPORATION


A resin-sealed semiconductor device includes and has a size that is substantially the same as a semiconductor element. The semiconductor device is easily handled and highly reliable. First ends of terminals made of a conductor, such as copper or the like, are respectively electrically connected to corresponding electrodes of the semiconductor element. The semiconductor element is sealed with a sealing resin so that second ends of the terminals are exposed at the surface of the sealing resin. Since the terminals are strong and are not easily damaged, there are no voids and a highly reliable semiconductor device is achieved.

1. Field of the Invention
The present invention relates to a resin-sealed semiconductor device, and particularly to a resin-sealed semiconductor device which is easy to handle and has a package structure with high reliability.
2. Description of Related Art
FIG. 11 is a partially broken-away perspective view showing a conventional resin-sealed semiconductor device 1a. In the drawing , a semiconductor element 1 having a integrated circuit or the like formed on the surface of a semiconductor wafer such as silicon or the like is mounted on a substrate 2 and secured thereto by an adhesive layer 3. Electrodes (not shown) on the semiconductor element 1 are connected to inner leads 6 by bonding wires 7. The semiconductor element 1 and the inner leads 6 are covered with a sealing resin 4, while outer leads 5 connected to the inner leads 6 project to outside of the sealing resin 4.
In the conventional resin-sealed semiconductor device 1a configured as described above, the semiconductor element 1 is connected to the outer leads 5 through the bonding wires 7 and the inner leads 6 so that electrical signals are input and output through the outer leads 5 when the semiconductor device 1a is used.
In the above resin-sealed semiconductor device 1a, the inner leads 6 must be connected to the semiconductor element 1. There is thus the need for some distance between the semiconductor element 1 and each of the inner leads 6 from the viewpoint of the characteristics of metal wires such as a gold (Au), copper (Cu), aluminum (Al) wire or the like, which is used as the bonding wires 7. In addition, the length of each of the inner leads 6 must be secured for preventing the outer leads 5 and the inner leads 6 from slipping off the sealing resin 4 during forming (bending) of the outer leads 5. The size of the resin-sealed semiconductor device 1a is thus significantly increased, as compared with that of the semiconductor element 1. The conventional semiconductor device thus has the problem that it is difficult to reduce the size, weight and thickness thereof.
On the other hand, mounting a semiconductor element by the flip chip method, as shown in FIG. 12, has the possibility that the semiconductor element 1 is damaged during mounting because a bare chip, i.e., the semiconductor element 1, is handled to place it on a substrate 11 for mounting. The method also requires the step of covering the whole element with a potting resin (not shown) or the like after the electrodes 8 of the semiconductor element 1 are mounted on lands 9 of the substrate 11, with bumps 10 therebetween. The method thus has the problem that the resin sealing work is further required before or after the usual reflowing step.
The conventional bumps 10 also have the problems that it is difficult to make the height uniform and voids easily occur in the bumps 10, that the bumps 10 are easily damaged due to their low strength because they are made of solder, gold or the like. There is the great possibility that the bumps 10 will become separated after mounting on the substrate because the bumps 10 have low shear strength.


The organic EL device of the present invention includes an anode, a cathode (e.g., an Al layer (15)), and an organic layer 20 that is disposed between the anode and the cathode and that includes a light emitting layer 14. At least one side of the anode nearer to the organic layer (20) is formed of a transparent oxide semiconductor layer (e.g., an ITO layer (12)). The molybdenum oxide layer is disposed between the oxide semiconductor layer and the organic layer (20). The thickness of the molybdenum oxide layer is less than 2 nm when the molybdenum oxide layer is assumed to have a uniform thickness.

Organic EL devices have received a great deal of attention because they can be used to produce displays and light sources that have the advantage of being flexible, thin, and lightweight. However, organic EL devices still have many problems, and further improvement in their characteristics is desired in order to expand their use.
As one of techniques for improving the characteristics of organic EL devices, a technique of interposing a hole-injection layer at the interface between an anode and a hole-transport layer has been known. In addition, it has been reported that the characteristics can be improved by using a MoO3 layer as the hole-injection layer. Such information is disclosed in JP 2005-32618 A and JP 2006-344774 A. Moreover, S. Tokito et al. also reported such information (J. Phys. D: Appl. Phys., 29, 2750 (1996)). Moreover, T. Miyashita et al. also reported such information (Jpn. J. Appl. Phys., 44, 3682 (2005)). Moreover, C.-W. Chen et al. also reported such information (Appl. Phys. Lett., 87, 241121 (2005)). Moreover, R. Satoh et al. also reported such information (Jpn. J. Appl. Phys., 45, 1829 (2006)). Moreover, H. You et al. also reported such information (J. Appl. Phys., 101, 026105 (2007)). The thicknesses of MoO3 layers that generally have been used were in a range of 2 to 50 nm.
The object of the invention disclosed in JP 2006-344774 A is to increase the brightness and to reduce the power consumption of an organic EL device. JP 2006-344774 A discloses a top emission type organic EL device that emits light from the side opposite to a substrate. In this organic EL device, an anode formed of aluminum, an organic layer, and a cathode formed of ITO are stacked on the substrate in this order. The light generated in the organic layer is emitted outward through the cathode. A Mo oxide layer (thickness is, for example, 3.5 to 1000 angstroms) is disposed between the anode and the organic layer. In the case where the anode of the top emission type organic EL device mentioned above includes a transparent electrode such as ITO, the light heading for the anode from the light emitting layer passes through the transparent electrode twice before exiting the device. Because of this, JP 2006-344774 A teaches that when the top emission type organic EL device mentioned above includes a transparent electrode such as ITO, the optical absorption of the transparent electrode becomes a problem (paragraph [0004] of JP 2006-344774 A). Moreover, JP 2006-344774 A teaches that an anode formed of ITO causes a problem in that the current density decreases (paragraph [0005] of JP 2006-344774 A).

Japan Advanced Institute of Science and Technology


A storage server receives a data access request in a standard communication format, such as the Storage Management Initiative-Specification (SMI-S). A single mode request is received at a disk module of the storage server and a cluster mode request is received at a management host of the storage server. The request is forwarded to a communication agent in a management module of the storage server. The communication agent translates the request from the standard communication format to a proprietary format used by the storage server to communicate with an attached storage subsystem. The storage server services the request from the attached storage subsystem through a disk module. In cluster mode, the request is forwarded to corresponding disk modules in each storage server in the cluster.

Various forms of network storage systems are known today. These forms include network attached storage (NAS), storage area networks (SANs), and others. Network storage systems are commonly used for a variety of purposes, such as providing multiple users with access to shared data, backing up critical data (e.g., by data mirroring), etc.
A network storage system can include at least one storage system, which is a processing system configured to store and retrieve data on behalf of one or more storage client processing systems ("clients"). In the context of NAS, a storage system may be a file server, which is sometimes called a "filer." A filer operates on behalf of one or more clients to store and manage shared files in a set of mass storage devices, such as magnetic or optical disks or tapes, or flash drives. The mass storage devices may be organized into one or more volumes of a Redundant Array of Inexpensive Disks (RAID). In a SAN context, the storage server provides clients with block-level access to stored data, rather than file-level access. Some storage servers are capable of providing clients with both file-level access and block-level access.
In a typical storage system, client devices and storage servers from different manufacturers may be used together. To enable effective communication between the different devices, a storage communication standard may be used. One example is the Storage Management Initiative-Specification (SMI-S) maintained by the Storage Networking Industry Association (SNIA). A communication agent (i.e., SMI-S agent) is used to translate standard SMI-S commands into a proprietary format used by the storage server. In conventional systems, the communication agent runs outside the storage server on a host computing device running an operating system such as Windows™ or Linux. This host machine requires additional hardware increasing the cost of the system. In addition, being outside the storage server limits the scalability of the agent and limits the number of nodes in the storage system that it can support. As the communication agent on the host machine communicates with one or more nodes in the storage system, a latency may develop in communications between the different devices. The latency may be increased especially if the host machine and storage servers are in different subnets. In addition, if the storage system includes storage devices from a number of different vendors, there may need to be a different communication agent for each storage vendor. Running multiple communication agents on a single host machine may cause conflicts and result in decreased performance. Having a separate host machine for each communication agent can lead to increased costs.

Storage server with embedded communication agent


The disclosure is directed to hand forceps usable by medical personnel, and others, to protect them from incurring injury and contamination when handling intravenous (IV) needles, suture needles, scalpels, and vessels containing body fluids, during surgical procedures and otherwise. The forceps comprises thumb and index finger encasing portions hinged together. A skirt area extends over a portion of the back of a user's hand from the base of the thumb and index finger encasing portions. The forceps can be made of various plastics, metals, and the like and can be coated with a trauma preventing, invasive device snagging layer of latex or similar material. Outwardly extending protective flanges can be provided longitudinally disposed on the thumb and index finger encasing portions. A central shield can also be provided.

With the increase in contagious body fluid carried organisms such as the Acquired Immune Deficiency Syndrome (AIDS) virus, there is an increasing need to protect medical, health and other workers who can come into contact with the body fluids of others. In particular, there is a need to protect personnel providing personal care, such as physicians, nurses and medical workers who administer intravenous needles and surgical procedures, and handle vessels such as glass test tubes. Thus, the need exists to prevent such personnel from sticking themselves with used (and therefore possibly contaminated) needles, cutting themselves with scalpels during surgical procedures and otherwise, or cutting themselves with contaminated pieces of glass from breaking vessels.
During many medical procedures, one hand of a practitioner is used to hold a body portion or a vessel while the other hand inserts a needle, cuts with a scalpel, or performs other functions. Not infrequently, during such procedures, a practitioner can inadvertently stick himself with a needle or cut himself with a scalpel. Too, glass and other types of vessels containing blood and other body fluids sometimes break and a person holding the vessel ends up with cuts from fragments or slivers of broken glass or shards. These needle penetrations and outs offer invasive paths for contaminants carried on the needles, scalpel blades and fragments or slivers.
Although it is increasingly important to protect such practitioners from possible contamination and consequent disease caused by viral and other agents within such invasive body fluids, gloves and vessel holding devices available at present provide insufficient protection in view of new and deadly viral and other contaminants now being encountered by various workers in medical, radiological, chemical and other fields.

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An installation device for a slide assembly includes a first rail and a second rail which has a guide seat and two slots for being connected with an exterior equipment. A positioning member is fixed to the second rail and an arm board has a positioning hole located corresponding to one of the slots of the second rail so that one of installation members of the exterior equipment is engaged with the positioning hole. An end board has a through hole and an end piece extending toward the second rail. The release member is movably installed to the second rail. When the release member is moved by an exterior force and positioned by the guide seat, the protrusion of the release member pushes the end piece to keep the positioning hole away from the second rail and the exterior equipment is removed from the positioning hole.

The conventional exterior equipment such as a drawer is installed to the slide assembly by fixing two inner rails to the two sides of the drawer by screws, or by setting pins to the metal drawer so as to be connected with holes or plates of the rails. The latest techniques are more convenient to fix these parts and some of the techniques are used to the racks for servers of computers, such as disclosed in U.S. Pat. Nos. 4,331,369, 5,632,542, 6,123,314, 6,209,979 B1, 6,588,866 B2, 6,601,933 B1, 6,938,967 B2, 6,948,691 B2, 7,481,504 B2, 7,604,307 B2 and U.S. Patent Laid-Open Publication No. 2004/0108797 A1.
In the above mentioned prior arts, the resilient plate or swing plate that contacts the protrusions on two sides of the drawer has to be operated by user's finger or by using a tool to shift it. The resilient plate or swing plate has to be maintained its shifted status so that the protrusions of the drawer can be removed from their positions. When the rails are installed to the rack and the drawer is to be removed from the rails, the user has to use one hand to shift the resilient plate or swing plate, and the other hand is used to move the protrusions. This is inconvenient for the users. If the exterior equipment is a server for a computer, the server is heavy so that it is difficult for a user to separate the server from the rails. Usually it requires at least two people to compete the removal of the server.
The applicant owns U.S. Pat. No. 7,661,778 B2 which discloses an inner rail 1, a positioning member 5 and a release member 6, wherein the inner rail has at least two mounting holes 11. The positioning member has one end fixed to the inner rail and the other end has a protruding bit 51 which is located corresponding to the mounting holes. The release member is located in the inside of the inner rail and is movable relative to the positioning member and pushes the positioning member so that the protruding bit is removed in opposite direction from the inner rail. The two protrusions on two sides of the drawer are able to be installed to the inner rails or removed from the inner rails. Furthermore, when the release member is moved and pushes the protruding bit of the positioning member upward, the extension 65b of the release member moves the push block 66b to contact the protrusion member 52b of the positioning member. By this way, the positioning member that is pushed upward is engaged with the middle rail 2b, the middle rail 2b hits the push block of the release member and the moves the release member back to its position via the extension.
Nevertheless, the U.S. Pat. No. 7,661,778 B2 is suitable for the specific the server and the extension between the push block and the release member is an elongate and thin part which may be bent when applied by a force, and the portion that the protruding bit is located is located remote from the inside of the inner rail, so that a larger space is needed. The positioning member may be improperly lifted or deformed by squeezing. Besides, the allocation of the positioning member, the release member and the inner rails does not meet the requirement of the latest servers, so that an improved installation device is needed.
The present invention intends to provide an installation device for a slide assembly and the exterior equipment can be quickly connected to the slide assembly or removed from the slide assembly.


A document architecture system includes an intelligent document processing engine that can receive raw data streamed from external data source(s), analyze the raw data to identify triggering events, apply rules to the triggering events identified, break down the raw data accordingly, and generating messages in an internal format to represent the pieces of data without any formatting or layout information. The messages can be augmented with custom metadata and stored as fragments that reference, but that do not physically incorporate, the messages. The stored fragments can be used by the document process engine to intelligently render documents and versions thereof. The messages and fragments are in internal formats under control of the document architecture system. The renditions are in final formats that can be delivered, for instance, via an output connector to various output delivery channels.

In computing, a data stream refers to a sequence of data elements that a system may receive over time. Often the data elements are processed one at a time as the data stream is received. This is quite unlike batch data processing, in which a finite amount of data is received in batches and the finite amount of data is processed as a whole per batch. This is also quite unlike bulk data processing, in which a finite amount of data is received at once and then processed as a whole. That is, normal computer functions cannot operate on data streams as a whole. Rather, processing data streams requires a steady high-speed rate sufficient to support applications that consume the data streams and a queuing or buffering mechanism to make sure that enough data is being continuously received without any noticeable time lag.
To this end, U.S. Pat. No. 7,127,520 utilizes queuing in a data transformation solution for transforming an input data stream in a first data format to an output data stream in a second format. The input data stream is stored in one of a plurality of input queues. The input queues are operatively connected to job threads. The job threads, independent of one another and in parallel, receive input data streams from the input queues, format the input data steams into output data streams, and store the output data streams in the output queues, from where output connectors can pick them up and pass them on to their final destination. The use of queuing is one embodiment of the system disclosed in U.S. Pat. No. 7,127,520.
U.S. Pat. No. 8,914,809 provides another solution for processing data streams. In this case, a message broker can be configured to receive the message instances output as input message instances, store the input message instances in a message store, alter the structure or content of the input message instances according to a message brokering model to generate output message instances and provide output message instances to one or more downstream processors. This solution allows for autonomous storage and alteration of messages generated when processing a data stream of a first format to transform it into a second format.
With the amount of data produced by data streams growing continuously in today's world, management and processing of data stream have become exceedingly complex. Accordingly, there is a continuing need for innovations and improvements.

Document architecture with smart rendering


A high efficiency grinding machine for grinding the pin on a crankshaft has a machining space with a grinding wheel mounted on the lower end of an arm to form a pendulum assembly. A headstock supports the crankshaft in the machining space. A pivot drive rocks the pendulum assembly back and forth equal distances about the equilibrium position causing the grinding wheel to follow the non-circular path of a pin as the crankshaft as it is rotated about its elongated axis.

In a typical prior art crankshaft grinder, the crankshaft is mounted between a headstock and a tailstock or between two headstocks, with one or more grinding wheels being used to grind the pin bearings on the crankshaft. The grinding wheel is normally mounted on the side of the crankshaft, and because of the orbital motion of the pins relative to the main bearings of the crankshaft, the grinding wheel has to move in and out relative to the crankshaft in order to accurately create the surface of the pin that is being ground. The grinding wheel and the work centerline in these designs exist on a common plane that is essentially horizontal. The grinding wheel spindle is normally supported on a hydrostatic linear bearing so that it can be moved in and out relative to the crankshaft smoothly, and with the least amount of friction. Such a machine arrangement may be called planar or Cartesian.
For reasons of economy, it would be desirable to design a crankshaft grinding machine which requires less floor space than conventional planar or Cartesian crankshaft grinding machines. It would further be desirable to design a high efficiency crankshaft grinding machine that requires less power to move the grinding wheel in and out relative to the crankshaft, and that does not utilize a hydrostatic linear bearing which requires lubrication to support the grinding wheel feed axis.