A voltage/current (V/I) source includes circuitry having first, second, third and fourth nodes, a first current source electrically connected to the first node, a second current source electrically connected to the second node, where the third and fourth nodes are between the first and second nodes, and an operational amplifier (op-amp) having an output, an inverting input, and a non-inverting input. The output is electrically connected to the third node, and the non-inverting input is electrically connected to a voltage source. A feedback line is between the fourth node and the inverting input.

1. Field of the Invention
The present invention relates generally to a V/I source and more particularly, to automatic test systems for electronic devices containing a V/I source. The invention furthermore relates to a method for forming a V/I source and a method for testing an electronic device. Specifically, the V/I source of the present invention is capable of selectively providing predetermined output loads or output voltages to a device under test (DUT).
2. Description of Related Art
Automatic test equipment is frequently employed to run diagnostic tests on integrated circuit devices. In this respect, the test equipment for example ensures that integrated circuits under test provide the proper output voltages in response to a given input by the test equipment during a functional test. The test equipment can also provide parametric tests for determining electrical characteristics of a device such as resistance and leakage.
Automatic test systems commonly employ circuits for communicating electronic signals with devices to be tested. Devices under test (DUT's) typically include many input/output nodes having similar electronic interface characteristics. Therefore, tester circuits that communicate with these nodes tend to be identical. Testers generally include tens or even hundreds or more of identical, general-purpose interface circuits known in the art as "pin electronics" circuits. Pin electronics circuits, also called "channels," can differ widely in construction, but most commonly include three basic elements: a driver, a detector, and an active load.
The driver is a source of electronic signals. Typically, drivers are optimized for producing digital signals, which are either high (logic 1) or low (logic 0). Drivers are commonly designed to switch their outputs between predetermined high and low levels under strict timing control.
The detector is a receiver of electronic signals. It receives a signal from the DUT and indicates the state of that signal at particular instants in time.
The active load is a provider/dissipater of electrical energy. The active load subjects output signals of the DUT to loading conditions (e.g., sourcing or sinking current) that are similar to those expected during the DUT's normal operating conditions. Such active loads are generally programmable and the levels of currents they provide/absorb (source and/or sink) can be adjusted.
Test systems generally include timing circuitry for synchronizing drivers, detectors, and active loads. Signals are generated, signals are detected, and loads are applied under strict timing control.
FIG. 1 shows a simplified schematic of a pin electronics channel 110 of the type described above, wherein the channel 110 is connected to a pin of a DUT 120 for performing tests on the DUT. The channel 110 includes a driver 112, a detector 114, and an active load 116. In practice several channels 110 may be connected to a DUT, depending on the amount of driver signals required and the amount of output signals to be detected. Each channel 110 may selectively act as a driver or a detector/load. In the configuration shown in FIG. 1, two channels 110 are provided, wherein for the upper one acts as a driver, while the lower one acts as a detector, as will be described above. The driver 112 of the upper channel 110 supplies a test signal to an input circuit 122 of the DUT, such as the input of a latch. The detector 114 of the lower channel 110 receives an output signal from an output circuit 124 of the DUT, such as the output of a latch. The active load 116 of the lower channel typically also receives the output signal and depending on the output signal absorbs current from the output circuit 124 or supplies current thereto. Test systems generally include a great number of channels like the channel 110, and those channels can be connected to large numbers of input and output circuits of a DUT. This arrangement is merely an example of how a driver, detector, and active load can be used when testing a device. Other arrangements are common.
While channels 110 may be used for functional tests of a DUT, they are typically not capable of performing parametric tests thereon. Thus, in the past, separate parametric measuring units (PMU's) 130 have been used. Inasmuch as functional tests can typically be performed much faster than parametric tests, a single PMU may be assigned to several pins of a DUT 120. The PMU 130 may be connected to a DUT via respective switches 135, 136. During parametric measurements it may be required to disconnect the channels 110 from the DUT, which may be achieved via respective switches 140.
FIG. 2 shows a more detailed view of a typical active load 116 used in automatic test equipment. The active load 116 includes a pair of programmable current sources 210 and 212 that connect to opposite ends of a diode quad 216. One side of the diode quad 216 receives a programmable signal, VCOM, via a respective device 214. The other side of the diode quad (node 220) is adapted to receive a signal to be loaded from a DUT.
The active load 216 operates generally as follows. Assuming that the currents from the current sources 210 and 212 are equal and the node 220 is open, all current flowing into the top of the diode quad 216 flows out the bottom of the diode quad 216. The current divides approximately equally between the left and right sides of the diode quad, i.e., the same current flows through diodes 216a and 216d as flows through diodes 216b and 216c. Because all diodes 216a-216d are conductive, the voltage VCOM applied to the left of the diode quad is approximately duplicated to the right of the diode quad.
If an output signal, such as from a DUT, is now applied to node 220, the balanced state of the diode quad is disturbed. When the voltage at node 220 exceeds VCOM, diode 216a is cut off (reverse-biased) and the current source 212 sinks all of its current from the DUT via diode 216b. Diode 216c is also cut off, and the current source 210 supplies all of its current to VCOM. When the voltage at node 220 is less than VCOM, diodes 216b and 216d are cut off. All current from the current source 210 is sourced to the DUT, and all the current to the current source 212 is sourced from VCOM.
The effect of this behavior is that the DUT sources the current of the current source 212 when its output is higher than VCOM, and sinks the current of current source 210 when its output is lower than VCOM.
The currents of the current sources 210 and 212 need not be the same. For instance, if the current through the current source 210 is greater than the current through the current source 212, the DUT is forced to sink a greater current when outputting a low signal than it is forced to source when outputting a high signal.
Such a load is well suited for loading the output of a DUT for functional tests thereon. Such a load, however, is not well suited for parametric measurements. During parametric measurements it may for example be necessary to force a predetermined current through a DUT (for example a diode) and to measure the voltage drop there across (force current/measure voltage). Additionally it may be necessary to create a predetermined Voltage across a DUT (for example a resistor or a reverse diode) and to measure the current or leaking current flowing therethrough (force voltage/measure current). Though the known load circuit is capable of providing (forcing) a predetermined current, it is not capable of providing (forcing) a predetermined voltage to a DUT. Therefore, different and separate circuits, especially different driver and load circuits had to be provided for different types of tests, leading to a high count of components in the automatic test equipment.
Furthermore, in the force current/measure voltage situation it may be necessary to limit the maximum voltage applied across the DUT, in order to protect the DUT and the automatic test equipment (e.g. in an open circuit situation).
In the force voltage/measure current situation it is necessary to limit the current flowing through the DUT, in order to protect the DUT and the automatic test equipment (e.g. in a short circuit situation).

V/I source and test system incorporating the same


A method for removing an oxide layer such as a natural oxide layer and a semiconductor manufacturing apparatus which uses the method to remove the oxide layer. A vertically movable susceptor is installed at the lower portion in a processing chamber and a silicon wafer is loaded onto the susceptor when it is at the lower portion of the processing chamber. The air is exhausted from the processing chamber to form a vacuum condition therein. A hydrogen gas in a plasma state and a fluorine-containing gas are supplied into the processing chamber to induce a chemical reaction with the oxide layer on the silicon wafer, resulting in a reaction layer. Then, the susceptor is moved up to the upper portion of the processing chamber, to anneal the silicon wafer on the susceptor with a heater installed at the upper portion of the processing chamber, thus vaporizing the reaction layer. The vaporized reaction layer is exhausted out of the chamber. The oxide layer can be removed with a high selectivity while avoiding damage or contamination of the underlying layer.

1. Field of the Invention
The present invention relates to a method of manufacturing semiconductor devices, and more particularly, to a method of eliminating an oxide layer such as a natural oxide layer, and a semiconductor manufacturing apparatus for use in the removal of the oxide layer.
2. Description of the Related Art
Silicon wafers are susceptible to react with oxygen or moisture in the air, and thus a silicon dioxide (SiO2) layer, which deteriorates the characteristics of a semiconductor device, is formed on the surface of a silicon wafer by spontaneous oxidation. For example, if such a natural oxide layer is formed on the surface of contacts, contact resistance increases. Also, if a natural oxide layer is formed before growth of a gate oxide layer, the characteristics of the gate oxide layer can be altered or deteriorated.
The most popular method used to remove a natural oxide layer in semiconductor fabrication is a wet cleaning technique. In the wet cleaning technique, a hydrofluoric acid (HF), which has a high selectivity between the silicon dioxide to be removed and the silicon wafer, is used as an etching solution. Also, the hydrofluoric acid has an additional advantage of coating the surface of the silicon wafer with hydrogen, in addition to the intrinsic function of removing the silicon dioxide.
However, in the case of using the HF acid to eliminate an oxide layer, other manufacturing steps cannot be carried out in-situ and thus contamination more likely occurs after the cleaning process, increasing the period of time required to complete the overall manufacturing process.
Another disadvantage is that cleaning step with the HF acid must be accompanied by a drying process. However, it is not possible to control the contamination that may occur during the drying process.
In addition, when a semiconductor wafer to be cleaned has small, deep contact holes, inevitably the cleaning solution enters the contact holes. However, due to the intrinsic viscosity of the cleaning solution, the rinsing solution may remain in the small, deep contact holes. Thus, removal of the residues remaining after the cleaning process is also an important concern.
Alternatively, the natural oxide layer can be removed by a dry etching process. For dry etching, a reactive ion etching technique is used with a gas mixture containing tetra-fluoro methane (CF4) and hydrogen (H2), or tri-fluoro methane (CHF3) and oxygen (O2). However, the dry etching process also leaves fluorine (F) on the surface of a silicon wafer which is the underlying layer of the oxide layer. Furthermore, the amount of fluorine remaining after the dry etching process is greater compared to using the wet cleaning technique, and thus the produced semiconductor device may be deteriorated to a greater degree by the dry etching process.
Also, during the dry etching process, damage to the surface of the silicon wafer occurs by the implantation energy of the etching gas, so that the surface of the silicon wafer becomes rough, and a pn junction underneath the wafer surface may be damaged.

Method of removing oxide layer and semiconductor manufacturing apparatus for removing oxide layer


A printed wiring board includes a first terminal array and a second terminal array comprising a plurality of terminals, a first differential signal line connecting a first terminal of the first terminal array to a predetermined number of terminals including a second terminal of the second terminal array, a second differential signal line connecting a third terminal of the first terminal array to a number of terminals including a fourth terminal of the second terminal array, which is bigger than the predetermined number of terminals wherein at least one of a line width and a line interval of one pair signal lines configuring the first differential signal line and the second differential signal line is determined so that differential impedance of the second differential signal line becomes higher compared with differential impedance of the first differential signal line.

1. Field of the Invention
The present invention relates to a printed wiring board having a differential signal line and a device including the printed wiring board.
2. Description of the Related Art
A printed wiring board having a thin insulation layer, such as a flexible board, has been used in a device (an electronic device). Japanese Patent Application Laid-Open No. 7-321463 discusses a technology which realizes necessary characteristic impedance by providing a ground line having a mesh shape on a printed wiring board. In this method, capacitance C of the signal line is suppressed without largely narrowing a width of the signal line.
However, Japanese Patent Application Laid-Open No. 7-321463 does not discuss an impedance design considering a connection form of a signal line, e.g., connection of 1 to 1 or 1 to a plurality. In a printed board, various signal lines are connected to a circuit (aboard). A plurality of terminals is provided on the circuit (the board) for connecting other circuits. In such a plurality of terminals, it is conceivable that the terminals include a connection form of 1 to 1 and a connection form of 1 to a plurality. Further, it is also conceivable that in such a plurality of terminals, a connection form of 1 to n and a connection form of 1 to m are included. Further, in such a configuration, if only a signal line of part of connection forms is matched to a termination resistor but a signal line of other connection forms cannot be matched to the termination resistor, reflection of a signal or a wave form distortion occur. As the result of this, a quality of signal transmission to a circuit (a board) decreases.

Printed wiring board and device including printed wiring board


The invention relates to a method for background removal from documents. The method includes obtaining an image of a document, performing a clustering operation on the image to obtain a plurality of image segments, and performing, for each image segment, a foreground/background classification to determine whether the image segment includes foreground. The method further includes obtaining an augmented image by combining the image segments that include foreground, and obtaining a background-treated image by cropping the image of the document, based on the foreground in the augmented image.

Paper-based documents such as forms are frequently digitized using digital cameras. The digitized document may then be further processed, e.g., using optical character recognition. When a paper-based document is photographed, a background surrounding the document may be captured by the digital camera, in addition to the document itself. Such a background may complicate further processing.

Method and system for background removal from documents


A helicopter windshield defogger and/or deicer system is discussed which is connectable with a high pressure, high temperature air supply from the compression stage of a helicopter turbine engine. The system utilizes a coanda ejector type nozzle to mix and distribute high temperature bleed air and aspirated cabin air to a dispersal shroud fixed adjacent to the helicopter windshield.

The Bell 206 helicopter has been in production since 1963. The windshield defroster system for this helicopter consists of vane axial type blowers connected to polycarbonate air dispersal shrouds.
The function of the blowers is to circulate cabin air across the windshield. There is no direct heat source for this system.
The Bell 206 windshield is particularly difficult to defrost because of its large surface area and because it is located so far forward from the cabin heater outlets. The manufacturer's defroster design is a compromise which is only partially effective.
Experience has shown this defroster system to be ineffective when the cabin air temperature is initially cold, and marginally effective when the cabin air temperature is warm. Furthermore, the circulation blowers are expensive, very noisy, and have limited service life.
Based on a review of the Federal Aviation Administration document "Summary of Supplemental Type Certificates" (any design changes to the helicopter, not incorporated by the manufacturer, must be FAA approved under authority of a supplemental type certificate) and based on common knowledge in the industry there is no engine bleed air type defroster system available for the Bell 206 helicopter.
This invention is intended to be used in conjunction with the existing air dispersal shroud. The blower may be retained or discarded.

Windshield defroster system for the Bell Helicopter Textron, Inc., model 206 helicopter and military derivatives


A material for an organic photoelectric device includes a compound represented by the following Formula 1:

1. Field
Embodiments relate to a material for an organic photoelectric device, and an organic photoelectric device including the same.
2. Description of the Related Art
A photoelectric device is, in a broad sense, a device for transforming photo energy to electrical energy, and conversely, for transforming electrical energy to photo energy. The photoelectric device may be exemplified by an organic light emitting diode, a solar cell, a transistor, and so on.
Particularly, among these photoelectric devices, the organic light emitting device employing organic light emitting diodes (OLED) has recently drawn attention due to the increase in demand for flat panel displays.
The organic light emitting device transforms electrical energy into light by applying current to an organic light emitting material. It has a structure in which a functional organic material layer is interposed between an anode and a cathode.
The organic light emitting diode has similar electrical characteristics to those of light emitting diodes (LEDs) in which holes are injected from an anode and electrons are injected from a cathode, then the holes and electrons move to opposite electrodes and are recombined to form excitons having high energy. The formed excitons generate light having a certain wavelength while shifting to a ground state.
In 1987, Eastman Kodak, Inc., developed an organic light emitting diode including a low molecular weight aromatic diamine and an aluminum complex as an emission-layer-forming material (Applied Physics Letters. 51, 913, 1987). C. W. Tang et al. disclosed a practicable device as an organic light emitting diode in 1987 (Applied Physics Letters, 51 12, 913-915, 1987).
The organic layer may have a structure in which a thin film (hole transport layer (HTL)) of a diamine derivative and a thin film of tris(8-hydroxy-quinolate)aluminum (Alq3) are laminated. The Alq3 thin film of Alq3 functions an emission layer for transporting electrons.
Generally, the organic light emitting diode is composed of an anode of a transparent electrode, an organic thin layer of a light emitting region, and a metal electrode (cathode) formed on a glass substrate, in that order. The organic thin layer may include an emission layer, a hole injection layer (HIL), a hole transport layer (HTL), an electron transport layer (ETL), or an electron injection layer (EIL). It may further include an electron blocking layer or a hole blocking layer according to the emission characteristics of the emission layer.
When an electric field is applied to the organic light emitting diode, the holes and electrons are injected from the anode and the cathode, respectively. The injected holes and electrons are recombined on the emission layer though the hole transport layer (HTL) and the electron transport layer (ETL) to provide light emitting excitons. The provided light emitting excitons emit light by transiting to the ground state.
The light emitting material may be classified as a fluorescent material including singlet excitons and a phosphorescent material including triplet excitons.
The phosphorescent light emitting material may be useful as a light emitting material (D. F. O'Brien et al., Applied Physics Letters, 74 3, 442-444, 1999; M. A. Baldo et al., Applied Physics letters, 75 1, 4-6, 1999). Such phosphorescent emission occurs by transition of electrons from the ground state to the exited state, non-radiative transition of a singlet exciton to a triplet exciton through intersystem crossing, and transition of the triplet exciton to the ground state to emit light.
When the triplet exciton transitions, it cannot directly transition to the ground state. Therefore, the electron spin is flipped, and then it transitions to the ground state. Thus, it provides a characteristic of extended lifetime (emission duration) relative to that of fluorescent emission.
In other words, the duration of fluorescent emission is extremely short (at several nanoseconds), but the duration of phosphorescent emission is relatively long (such as at several microseconds), so that phosphorescent emission provides a characteristic of extending the lifetime (emission duration) to more than that of the fluorescent emission.
Quantum mechanically, when holes injected from the anode are recombined with electrons injected from the cathode to provide light emitting excitons, the singlet and the triplet are produced in a ratio of 1:3, in which the triplet light emitting excitons are produced at three times the amount of the singlet light emitting excitons in the organic light emitting diode.
Accordingly, the percentage of the singlet exited state is 25% (the triplet is 75%) in the case of a fluorescent material, so it has limits in luminous efficiency. On the other hand, in the case of a phosphorescent material, it can utilize 75% of the triplet exited state and 25% of the singlet exited state, so theoretically the internal quantum efficiency can reach up to 100%. When phosphorescent light emitting material is used, it has advantages in an increase in luminous efficiency of around four times that of the fluorescent light emitting material.
In the above-mentioned organic light emitting diode, a light emitting colorant (dopant) may be added in an emission layer (host) in order to increase the efficiency and stability in the emission state. In this structure, the efficiency and properties of the light emission diodes are dependent on the host material in the emission layer.

Material for organic photoelectric device, and organic photoelectric device including the same


The invention relates to a 3.5 mm audio plug with built-in light source, particularly to a light-emitting element arranged in a hollow tube and two conductive portions and several insulating portions arranged on a predetermined position of a surface of the audio plug for acquiring power and supplying the power to the light-emitting element in order to form a laser pen. At the same time, the electronic products are able to maintain normal output sound from a speaker when the audio plug is inserted into the audio jack of the predetermined electronic product, avoiding missed calls. Moreover, the audio plug is arranged in the audio jack except the light-emitting hole; that is, the present invention is nearly integrated with the smartphone 70, which is not only beautiful but easy to carry.

1. Field of the Invention
The invention relates to a 3.5 mm audio plug with built-in lighting source, particularly to a built-in light-emitting element with only light-emitting hole exposed out of an audio jack for saving space and easily carrying.
2. Description of the Related Art
With the rapid development of computer and communications technology, electronic products have become increasingly popular; especially mobile phones have become one of the essential devices of modern people. At the same time, the industry continues to introduce new mobile phones with various functions for enhancing the convenience and practicality of mobile phones. For example, smart phones have become the market mainstream, and the all-inclusive applications won the love of consumers.
Laser pens are required for business people and teachers while making a presentation or teaching. However, some laser pens need a mouse or adjust key for projection function so that it is inconvenience to carry all the things for a presentation or teaching.
With the references to FIGS. 1A and 1B, a multifunction laser pen 90 can be inserted into an audio jack 60 of a mobile phone 70. However, the laser pen 90 is exposed out of the audio jack 60 at least 4 to 5 cm when using the conventional laser pen 90; hence, it is inconvenient to carry and requires more space for storing. Moreover, when inserting the conventional laser pen 90 into the audio jack 60, a plug 80 is separated into a first conductive portion 81, a second conductive portion 82, a third conductive portion 83 and a fourth conductive portion 84 by a first insulating layer 85, a second insulating layer 86 and a third insulating layer 87 and the first, second, third and fourth conductive portion 81, 82, 83, 84 are electronically connected to a first terminal 61, a second terminal 62, a third terminal 63 and a fourth terminal 64 in a inserted hole 60; such that, a sound of the mobile phone 70 cannot be outputted by a speaker 71. Therefore, there is room for improvement.


A hot rolled light-gauge martensitic steel sheet made by the steps comprising: (a) preparing a molten steel melt comprising: (i) by weight, between 0.20% and 0.35% carbon, less than 1.0% chromium, between 0.7% and 2.0% manganese, between 0.10% and 0.50% silicon, between 0.1% and 1.0% copper, less than 0.05% niobium, less than 0.5% molybdenum, and silicon killed containing less than 0.01% aluminum, and (ii) the remainder iron and impurities resulting from melting; (b) solidifying at a heat flux greater than 10.0 MW/m2 and cooling the molten melt into a steel sheet less than 2.0 mm in thickness in a non-oxidizing atmosphere to below 1080° C. and above Ar3 temperature at a cooling rate greater than 15° C./s; and (c) hot rolling the steel sheet to between 15% and 50% reduction and rapidly cooling.

This invention relates to the making of hot rolled light-gauge martensitic steel sheet and the method for making the same by a twin roll caster.
In a twin roll caster, molten metal is introduced between a pair of counter-rotated, internally cooled casting rolls so that metal shells solidify on the moving roll surfaces, and are brought together at the nip between them to produce a solidified strip product, delivered downwardly from the nip between the casting rolls. The term "nip" is used herein to refer to the general region at which the casting rolls are closest together. The molten metal is poured from a ladle through a metal delivery system comprised of a tundish and a core nozzle located above the nip to form a casting pool of molten metal, supported on the casting surfaces of the rolls above the nip and extending along the length of the nip. This casting pool is usually confined between refractory side plates or dams held in sliding engagement with the end surfaces of the rolls so as to dam the two ends of the casting pool against outflow.
Martensite is formed in carbon steels by the rapid cooling, or quenching, of austenite. Austenite has a particular crystalline structure known as face-centered cubic (FCC). If allowed to cool naturally, austenite turns into ferrite and cementite. However, when the austenite is rapidly cooled, or quenched, the face-centered cubic austenite transforms to a highly strained body-centered tetragonal (BCT) form of ferrite that is supersaturated with carbon. The shear deformations that result, produce large numbers of dislocations, which is a primary strengthening mechanism of steels. The martensitic reaction begins during cooling when the austenite reaches the martensite start temperature and the parent austenite becomes thermodynamically unstable. As the sample is quenched, an increasingly large percentage of the austenite transforms to martensite until the lower transformation temperature is reached, at which time the transformation is completed.
Martensitic steels are increasingly being used in applications that require high strength, for example, in the automotive industry. Martensitic steel provides the strength necessary by the automotive industry while decreasing energy consumption and improving fuel economy.
Presently disclosed is a hot rolled light-gauge martensitic steel sheet made by the steps comprising: (a) preparing a molten steel melt comprising: (i) by weight, between 0.20% and 0.35% carbon, less than 1.0% chromium, between 0.7% and 2.0% manganese, between 0.10% and 0.50% silicon, between 0.1% and 1.0% copper, less than 0.05% niobium, less than 0.5% molybdenum, and silicon killed containing less than 0.01% aluminum, and (ii) the remainder iron and impurities resulting from melting; (b) solidifying at a heat flux greater than 10.0 MW/m2 into a steel sheet less than 2.0 mm in thickness and cooling the sheet in a non-oxidizing atmosphere to below 1080° C. and above Ar3 temperature at a cooling rate greater than 15° C./s; and (c) hot rolling the steel sheet to between 15% and 50% reduction and rapidly cooling to form a steel sheet with a microstructure having by volume at least 75% martensite, a yield strength of between 700 and 1300 MPa, a tensile strength of between 1000 and 1800 MPa and an elongation of between 1% and 10%. Here and elsewhere in this disclosure elongation means total elongation. And by "rapidly cooling" is meant to cool at a rate of more than 100° C./s to between 100 and 20° C.
The present steel sheet cannot be made with carbon levels below 0.20% because it is inoperative with peritectic cracking of the steel sheet as explained below.
Further, the steel sheet may be tempered at a temperature between 150° C. and 250° C. for between 2 and 6 hours. The martensitic steel sheet may further comprise by weight greater than 0.005% niobium or greater than 0.01% or 0.02% niobium. The martensitic steel sheet may further comprise by weight greater than 0.05% molybdenum or greater than 0.1% or 0.2% molybdenum.
The molten melt may be solidified at a heat flux greater than 10.0 MW/m2 into a steel sheet less than 2.0 mm in thickness, and the sheet may be cooled in a non-oxidizing atmosphere to below 1080° C. and above Ar3 temperature at a cooling rate greater than 15° C./s. A non-oxidizing atmosphere is an atmosphere typically of an inert gas such as nitrogen or argon, or a mixture thereof, which contains less than about 5% oxygen by weight.
In some embodiments, the martensite in the steel sheet may come from an austenite grain size of greater than 100 μm. In other embodiments, the martensite in the steel sheet may come from an austenite grain size of greater than 150 μm.
The steel sheet may be hot rolled to between 15% and 35% reduction and rapidly cooled to form a steel sheet with a microstructure having at least 75% martensite, a yield strength of between 700 and 1300 MPa, a tensile strength of between 1000 and 1800 MPa and an elongation of between 1% and 10%. In other embodiments, the steel sheet may be hot rolled to between 15% and 50% reduction and rapidly cooled to form a steel sheet with a microstructure having at least 75% martensite plus bainite, a yield strength of between 700 and 1300 MPa, a tensile strength of between 1000 and 1800 MPa and an elongation of between 1% and 10%. Further, the steel sheet may be hot rolled to between 15% and 35% reduction and rapidly cooled to form a steel sheet with a microstructure having at least 75% martensite plus bainite, a yield strength of between 700 and 1300 MPa, a tensile strength of between 1000 and 1800 MPa and an elongation of between 1% and 10%.
The molten steel used to produce the hot rolled light gauge martensitic steel sheet is silicon killed (i.e., silicon deoxidized). The martensitic steel sheet may further comprise by weight less than 0.008% aluminum or less than 0.006% aluminum. The molten melt may have a free oxygen content between 5 to 70 ppm. The steel sheet may have a total oxygen content greater than 50 ppm. The inclusions include MnOSiO2 typically with 50% less than 5 μm in size and have the potential to enhance microstructure evolution and, thus, the strip mechanical properties.
Also disclosed is a method of making hot rolled light-gauge martensitic steel sheet comprising the steps of: (a) preparing a molten steel melt comprising: (i) by weight, between 0.20% and 0.35% carbon, less than 1.0% chromium, between 0.7% and 2.0% manganese, between 0.10% and 0.50% silicon, between 0.1% and 1.0% copper, less than 0.05% niobium, less than 0.5% molybdenum, and silicon killed containing less than 0.01% aluminum, and (ii) the remainder iron and impurities resulting from melting; (b) forming the molten melt into a casting pool supported on casting surfaces of a pair of cooled casting rolls having a nip there between; (c) counter rotating the casting rolls and solidifying at a heat flux greater than 10.0 MW/m2 producing a steel sheet less than 2.0 mm in thickness and cooling the sheet in a non-oxidizing atmosphere to below 1080° C. and above Ar3 temperature at a cooling rate greater than 15° C./s and (d) hot rolling the steel sheet to between 15% and 50% reduction and rapidly cooling to form a steel sheet with a microstructure having at least 75% martensite, a yield strength of between 700 and 1300 MPa, a tensile strength of between 1000 and 1800 MPa and an elongation of between 1% and 10%. The steel sheet composition cannot be made with carbon levels below 0.20% because it is inoperative with peritectic cracking of the steel sheet.
Further, the method of making hot rolled light-gauge martensite steel sheet may comprise the step of tempering the steel sheet at a temperature between 150° C. and 250° C. for between 2 and 6 hours.
The martensitic steel sheet may further comprise by weight greater than 0.005% niobium or greater than 0.01% or 0.02% niobium. The martensitic steel sheet may further comprise by weight greater than 0.05% molybdenum or greater than 0.1% or 0.2% molybdenum. The martensitic steel sheet may be silicon killed containing by weight less than 0.008% aluminum or less than 0.006% aluminum.
The molten melt may have a free oxygen content between 5 to 70 ppm. The steel sheet may have a total oxygen content greater than 50 ppm. The molten melt may be solidified at a heat flux greater than 10.0 MW/m2 into a steel sheet less than 2.0 mm in thickness, and cooled in a non-oxidizing atmosphere to below 1080° C. and above Ar3 temperature at a cooling rate between greater than 15° C./s.
In some embodiments, the martensite in the steel sheet may come from an austenite grain size of greater than 100 μm. In other embodiments, the martensite in the steel sheet may come from an austenite grain size of greater than 150 μm.
The method of making hot rolled light-gauge martensitic steel sheet may further comprise hot rolling the steel sheet to between 15% and 35% reduction and rapidly cooling to form a steel sheet with a microstructure having at least 75% by volume martensite, a yield strength of between 700 and 1300 MPa, a tensile strength of between 1000 and 1800 MPa and an elongation of between 1% and 10%. In some embodiments, the method of making hot rolled light-gauge martensitic steel sheet may further comprise hot rolling the steel sheet to between 15% and 50% reduction and rapidly cooling to form a steel sheet with a microstructure having at least 75% by volume martensite plus bainite, a yield strength of between 700 and 1300 MPa, a tensile strength of between 1000 and 1800 MPa and an elongation of between 1% and 10%. Furthermore, the method of making hot rolled light-gauge martensitic steel sheet may comprise hot rolling the steel sheet to between 15% and 35% reduction and rapidly cooling to form a steel sheet with a microstructure having at least 75% by volume martensite plus bainite, a yield strength of between 700 and 1300 MPa, a tensile strength of between 1000 and 1800 MPa and an elongation of between 1% and 10%.

Hot rolled light-gauge martensitic steel sheet and method for making the same


The invention relates to a vessel (1) comprising a hull (2) for non-planing operation, during operation displaying a waterline (3) and having a forward direction in a horizontal plane (4) with a forward portion, an aft portion (5), and a central portion, the aft portion having a smaller water displacement relative to a water displacement of the central portion; and an aft, primary foil (6) affixed to the aft hull portion with a connecting member (7), configured to be below the waterline during operation, spaced from the hull, the aft foil having a span, a chord, a profile, a leading edge (8) and a trailing edge (9) relative to the forward direction, characterized by adjustment means (10) connected to the aft foil and configured for adjusting an angle of incidence (βc, af) of the chord of the aft foil.

A stationary, aft foil oriented horizontally below the hull of a vessel, such as described in WO2004020276 A1, WO2007148966 A2 and/or WO2016010423 A1 by the present applicant, does not make optimal use of the energy that is present in the flow in developing thrust. At the location where the aft foil is fitted to ships (near the stern of the vessel) the flow is inclined aft and upwards. When the aft foil is positioned in this flow a lift force is developed at right angles thereto such that the horizontal component thereof constitutes a thrust force. The aft foil as disclosed in the above patent publications is presently optimized for the flow that is present when the vessel operates in calm water.
However, the vessel rarely operates in still water. The waves that are nearly always present along the routes that ships adopt cause the vessel to pitch, heave and roll. The effect thereof on the angle of inflow at the aft foil is significant, causing a large variation in the angle of incidence. When the depth of the aft foil below the water surface decreases (when a wave trough is present above the aft foil) the flow experiences an additional downward velocity component which reduces the angle of incidence, and when the depth of the aft foil below the surface increases (in the presence of a wave peak) the flow experiences an additional upwards velocity component which increases the angle of incidence.
For example, when a ship with a length of 100 m displays a pitching motion with a period of 5 seconds in seas which cause an average undulation of the water surface of 1 m at the location of the aft foil, when the horizontal component of the inflow is 7 m/s (for a ship speed of about 15 knots), the variation in the angle of incidence is some ±3.3 degrees and when the undulation is 2 m, about ±6.6 degrees. In actual fact this variation is about 60% higher because the vertical velocity component is not constant during one wave period but similar to a sine or cosine function. Furthermore, a ship rarely displays a pure pitching motion. Usually it also heaves and rolls and these motions also influence the direction of the inflow near the stern of a vessel. Thus, to constantly obtain the best lift-to-drag ratio from the aft foil—or the maximum thrust (whichever might be the case), the angle of attack of the foil needs to be constantly adapted to the direction of the inflow below the hull. An object of the invention is thus to provide an aforementioned vessel with an aft foil for generating a lift force—with a forwardly directed thrust component—wherein the angle of attack of the foil can be (constantly) adapted to the direction of the inflow below the hull.

Vessel for operating on a body of water, comprising an aft foil for generating a thrust force and adjustment means for adjusting an angle of incidence of the aft foil


In a xerographic printing apparatus, a blade is used to clean the surface of a rotating photoreceptor. At an end of the blade is disposed a flexible sealing member. The sealing member includes a bulk portion, one part of which contacts the surface of the photoreceptor and another part of which is attached to a stationary surface. Extending from the bulk portion is a tab which defines a diagonal edge. A portion of the diagonal edge contacts a surface of the blade.

The present invention relates to a development module for a xerographic printing apparatus, and more specifically to blade seal used in such a module.
The basic principles of electrostatographic printing with dry marking material (hereinafter generally referred to as xerography) are well known: an electrostatic latent image is created on a charge-retentive surface, such as a photoreceptor or other charge receptor, and the latent image is developed by exposing it to a supply of toner particles, which are attracted as needed to appropriately-charged areas of the latent image. The toner particles are then transferred in imagewise fashion from the photoreceptor to a print sheet, the print sheet being subsequently heated to permanently fuse the toner particles thereto to form a durable image.
Following the transfer of the image from the photoreceptor to the print sheet, residual toner particles remaining on the photoreceptor are removed by any number of known means, such as including a cleaning blade, brush, and/or vacuum. In a typical embodiment, the removed toner is then accumulated in a hopper, and then the accumulated waste toner is directed, typically by means of an auger, into a waste container.
It is a common design challenge to provide a functional housing around the photoreceptor, which allows operation of the xerographic apparatus while preventing leakage of stray toner particles to unwanted areas within the apparatus.
U.S. Pat. Nos. 5,389,732; 5,475,467; and 5,701,558 each disclose a blade and seal arrangement in a xerographic printer.
According to one aspect of the invention, there is provided an apparatus for use in electrostatographic printing, comprising a roller; a blade positioned against the roller; and an end seal disposed at an end of the blade. The end seal comprises a flexible member defining a main surface and a profile. The profile includes a diagonal edge which is oriented diagonally to a direction of rotation of the roller. The diagonal edge contacts the blade.


A method for removing sulphur from a fluid by the steps of providing a first fluid comprising a sulphur-containing compound; adsorbing the sulphur of sulphur-containing compound onto an adsorbent; regenerating the adsorbent by oxidation of the adsorbed sulphur to sulphur dioxide thereby yielding an off-gas stream comprising sulphur dioxide; providing a second fluid comprising hydrogen sulphide, using the second fluid and the off-gas stream as reactants in a Claus process for producing elemental sulphur, wherein a part of hydrogen sulphide provided by the second fluid is oxidized to sulphur dioxide and water at reaction temperature, the residual hydrogen sulphide, the resulting sulphur oxide and the sulphur oxide provided by the off-gas stream are converted to elemental sulphur, the oxygen required for the oxidation of the hydrogen sulphide provided by the second fluid is provided by an air stream, and the off-gas stream dilutes the second fluid in the Claus process.

The present invention relates to a method for removing sulphur from a fluid.
Such a method comprises the steps of providing a first fluid comprising a sulphur-containing compound, adsorbing the sulphur of the sulphur-containing compound onto an adsorbent, particularly in the presence of hydrogen, regenerating the adsorbent by oxidation of the adsorbed sulphur to sulphur dioxide thereby yielding an off-gas stream comprising sulphur dioxide, providing a second fluid comprising hydrogen sulphide, using the second fluid and the off-gas stream as reactants in a Claus process for producing elemental sulphur, wherein a part of hydrogen sulphide provided by the second fluid is oxidized to sulphur dioxide and water at an reaction temperature, and wherein the residual hydrogen sulphide, the resulting sulphur oxide and the sulphur oxide provided by the off-gas stream are converted to elemental sulphur, and wherein the oxygen required for the oxidation of the hydrogen sulphide provided by the second fluid is provided by an air stream, and wherein the off-gas stream dilutes the second fluid in the Claus process.
Sulphur recovery units based on the so-called "Modified Claus Process" produce elemental sulphur from feed gases with high concentration of H2S by partial oxidation of the latter using air as the primary oxidant. This air oxidation is performed by applying an open flame inside a combustion chamber (also denoted as Claus furnace). Feeds of Claus units operated in oil refineries are typically gas streams having a high concentration of H2S (i.e., acid gas) sometimes combined with a second stream of so-called sour water stripper gas containing H2S and major amounts of ammonia (NH3).
The stability of any flame based on fuel combustion is highly dependent on the concentration of inflammables within the fuel stream; i.e. the more diluted the fuel with compounds not taking part in the oxidation process the lower the flame temperature. In the extreme case the flame may even expire. In case of inerts like nitrogen this effect is most obvious but if SO2 is being imported into a Claus furnace the complication is even compounded by a second effect—namely that even less of the main combustible (e.g. H2S) can be oxidized to SO2, which is the important reaction partner of residual H2S within the down-stream sections of the Claus unit. Therefore, in cases of import of gases containing SO2 into a Claus furnace the natural consequence is a, under circumstances even substantial, drop of the furnace temperature. The secondary effects of such temperature decrease are widely known.
Most notorious is the incomplete destruction of so-called trace compounds like persistent hydrocarbons (benzene, toluene, xylenes, styrene) and also NH3. A breakthrough of hydrocarbons leads to catalyst fouling/deactivation and reduced sulphur quality. Even more sensitive to reduced furnace temperature is the efficiency of NH3 destruction. If the latter is incomplete NH3 builds up solid salts at "cold spots" of the downstream Claus section, which can lead to effects like lowered sulphur recovery efficiency, more down-time of the plant, considerable damage due to corrosion, reduced plant capacity etc.
Based on this background, it is the objective of the present invention to provide an efficient and economic method for sulphur removal.


A variety of systems, methods, and compositions are disclosed, including in one method, a security arm barrier system, the system comprising: a drive stanchion mounted to a first substructure; an arm barrier coupled to the drive stanchion, wherein the arm barrier further comprises: a first member, wherein a proximal end of the first member is coupled to the drive stanchion; a second member, wherein a proximal end of the second member coupled to a distal end of the first member; and an articulating joint that couples the first member and the second member, and an energy absorbing material disposed within the first member and the second member; and a receiver stanchion mounted to a second substructure capable of receiving a distal end of the second member.

Conventional security arm barrier systems are designed to control traffic (vehicular or otherwise), while also deterring potential threats by vehicles to personnel and/or property. Security arm barrier systems may be configured to stop unwanted intruders from breaching a secure area are often used in association with key assets, such as, government installations, petrochemical facilities, parking garages, and other protected locations.
Currently, fortified barriers are capable of dissipating the momentum energy associated with impacts from moving masses. A standard barrier takes the momentum energy from the moving mass and transfers it to a foundation system. Various barrier designs dissipate momentum energy in excess of 1.2 million ft-lbs (15,000 lbs moving 50 mph) in a distance of less than 3.3 ft. Often these types of barriers are heavy steel structures requiring large foundations to hold in place. The energy is often dissipated in the crushing of the vehicle and absorption into barrier and foundation components. Drop arm barrier structures are increasingly difficult since the impacted arm structure must be capable of withstanding the impact and transferring the energy to side stanchions. Arms of this type are often metal structures with internal cables, chains, or straps (nylon, polyester, etc). The internal materials are heavy and do not bend freely. In addition to the structural aspects of the arm, often there are requirements for safety lighting, and other electrical sensors and warning devices requiring external conduits to protect the wiring.

B & B Roadway and Security Solutions, LLC


Disclosed is a polygon mirror device with discontinuous angles of reflections discontinuously to reflect a light beam from a light source with at least one angle. The polygon mirror device with discontinuous angles of reflections comprises a motor connecting with a base to rotate the base around a rotation axis. The base has an axial end surface to form a reference plane. The reference plane is approximately perpendicular to the rotation axis. A plurality of reflectors is positioned on the reference plane circularly around the rotation axis. The reflectors tilt relative to the reference plane with respective angles to form respective included angles. When the base is rotated around the rotation axis, at least one of the reflectors is moved to a reflecting location for receiving the light beam from the light source and reflects the light beam with an angle of reflection to form an image at a specific place.

1. Field of the Invention
The present invention generally relates to a polygon (this term is proper without concern) mirror device, and more particularly to a polygon mirror device with discontinuous angles of reflections.
2. Description of Prior Art
In prior arts which a laser is employed as a light source in a scanning projector, a reflectors combination swing control by a MEMS (Micro Electro Mechanical System) is generally utilized for the scanning projection of the scanning projector. Alternatively, a multiple polygon mirrors rotating combination also can be utilized for the scanning projection. Speaking of the reflectors combination swing control, the MEMS lags the physical motion in the swing control because an air damping exists during the control of the swing angles of the reflectors and the damping oscillations of the reflectors and the whole MEMS, the control of swing angles of the reflectors in the MEMS has to be more considerate to precisely control the accuracy of the scanning projection procedure.
Mentioning about the multiple polygon mirrors rotating combination, the drawbacks of the aforesaid reflectors combination swing control by the MEMS can be avoided. Due to the angle control of the reflectors is discontinuous, the scanning projection time can be shortened and the aforesaid kinds of dampings also can be prevented to simplify the control procedure of the scanning projection. However, Most of the multiple polygon mirrors rotating combinations today change the angle discontinuously to control the angles of reflecting the light source. Meanwhile, all the compositions of the multiple polygon mirrors rotating combinations and respective driving motors occupy a quite large space which truly violates the almost mainstream of miniaturization design. Moreover, the high speed rotations of the multiple motors and the multiple polygon mirrors cause vibrations, noises of the whole scanning projector and lead to disadvantages of instability and a short usage lifetime of the products.
Consequently, there is a need to develop a polygon mirror device with discontinuous angles of reflections to efficiently solve the problems of laser light source scanning projector according to prior art.

Polygon mirror device with discontinuous angles of reflections


Techniques to optimize video-call communications are disclosed. The link quality capability of a wireless video-call session and the requirements of the video-call session are determined. The link quality capability determination is based at least on measurements through the entire communications chain, including user, client device, operating system, application, air interface, cell sector, and backhaul parameters. Those parameters may be determined from static profiles, dynamically determined or be statistically derived. Client device response may include adapting the rate of data captured by a video camera, microphone, or other data capture device used in the video-call session. For video-conferencing scenarios, communications throughput is optimized by consolidating video streams.

Increasing numbers of user have come to make video-calls on electronic multimedia terminals such as personal computers with web cameras ("webcams") and microphones. Specifically, a user is able to create a communications connection with one or more other users with electronic multimedia terminals, and transmit and receive both voice data and video data to those users. Typically the video data will be of the user, but alternatively could be a video camera view of some other object, as is common with multi-camera smart phones. In other scenarios, such as video conferencing, the video may be of a static document, such as a text document or a spreadsheet.
As mobile terminals, including smart phones and mobile tablets have acquired multimedia capabilities; those mobile terminals have come to support video-calls as well. Such mobile terminals are typically wireless devices with less bandwidth than non-mobile clients with fixed networks. Wireless mobile terminals may make use of unlicensed spectrum such as Wi-Fi or make use of licensed spectrum such as the air interface to cellular carriers. In addition to potentially having less bandwidth, a particular communications link's bandwidth may fluctuate based on changing conditions. For example, a wireless network may have less bandwidth for a particular communications link during peak hours as opposed to the middle of the night. Alternatively, a wireless network may have less bandwidth due to a temporary router outage.
To adapt to fluctuating wireless communication bandwidth, and in general to fluctuating link quality capabilities, video-call software clients may adapt their data transmission rate based on available link quality capabilities, by capturing the video data from a client device video camera, and then using in-software transformations to change the resolution of the transmitted video data to match available bandwidth. Specifically, where there is less link quality capability, the video-call software client decreases the resolution of the transmitted video and where there is more link quality capability, the video-call software increases the resolution.
However, in-software transformations to throttle data throughput for video-calls makes extensive use of processor resources and battery power. Accordingly, there is an opportunity to optimize video calls by adapting data transmission rates without processor intensive in-software transformations, and thereby preserving processor cycles and battery lifetime.
Furthermore, the efficacy of present video-call adaptation techniques is based on measuring link quality capability for a call. However present video-call adaptation techniques are optimized for wired communications, rather than wireless communications. Accordingly, present video-call adaptation techniques do not take into account link quality fluctuations caused by interruptions in the wireless communications stack, resulting in sub-optimal adaption.

Optimizing video-call quality of service


A method and apparatus for applying liquid coating materials, adhesives or other liquids is provided in which the liquid material is pumped from a source through a pneumatically operated, diaphragm-type pressure regulator which discharges the liquid at a controlled pressure to a dispenser such as a spray gun. Pressurized air from a pneumatic panel or other air supply device is transmitted to one side of the diaphragm in the pressure regulator through a one-way valve such as a check valve which protects the pneumatic panel from an upstream flow of liquid from the pressure regulator in the event of a failure of its diaphragm. A fluid bleed device such as a choke is located downstream from the check valve and upstream from the diaphragm in the pressure regulator to vent pressurized air located therebetween, and to permit the escape of at least some of the liquid flowing upstream from the pressure regulator in the event of a failure of its diaphragm which provides a visual indication of the failure of the diaphragm.

Systems for the application of liquid coating materials, adhesives and the like include liquid dispensing devices such as spray guns which are supplied with liquid from a pump operatively connected to a tank or other source of the liquid. In order to control the pressure at which the liquid is supplied to the spray guns, pressure regulators are commonly interposed between the pump and spray guns.
One type of pressure regulator used in applications of this type includes a regulator body formed with a liquid passageway having an inlet which receives liquid from the pump and outlet which discharges the liquid to at least one spray gun. A poppet valve or similar flow control device is carried by a thin, flexible diaphragm within the regulator body. In response to flexing of the diaphragm, the poppet valve is movable relative to a valve seat located within the liquid passageway to control the pressure at which the liquid is discharged from the outlet of the passageway to the spray gun. Many pressure regulators of this type are pneumatically operated, i.e., a pneumatic panel or other air supply device transmits operating air to the side of the diaphragm opposite the liquid passageway to flex the diaphragm and thereby adjust the poppet valve to the desired position relative to the valve seat within the liquid passageway. The thin, flexible diaphragm is highly responsive to the flow of operating air from the pneumatic panel, and thus good control of the pressure of the liquid discharged from the pressure regulator can be obtained.
One problem with pneumatically operated, diaphragm-type pressure regulators is the damage to the pneumatic panel or other air supply device which can be created in the event of a failure of the diaphragm. Because the liquid flowing through the passageway in the pressure regulator is located on the side of the diaphragm opposite the operating air, a rupture or leak in the diaphragm can result in the flow of liquid past the diaphragm and then upstream from the pressure regulator into the pneumatic panel. The pneumatic panels are expensive units and can be severely damaged by the back flow of liquid therein.
One proposed solution to this problem has been to incorporate redundant or additional diaphragms within the pressure regulator so that in the event of the failure of one diaphragm, a second or third diaphragm is available to block the escape of liquid upstream to the pneumatic panel. But pressure regulators employing two or more diaphragms are relatively expensive and complicated. In addition, such pressure regulators provide no means to indicate if a rupture, leak or other failure of the diaphragm(s) has occurred.

Method and apparatus of isolating pneumatic panels in liquid application systems


Systems and methods for enhancing the cold-formability of Ti 6-2-4-2 sheet material are described herein. Embodiments of these methods comprise cold-forming a predetermined, pretreated Ti 6-2-4-2 alloy into a cold-formed shape; subjecting the cold-formed shape to a post-forming annealing cycle comprising: heating the cold-formed shape to about 1450±25 ° F.; holding the cold-formed shape at about 1450±25° F. for about 15±2 minutes; and cooling the cold-formed shape to room temperature. Embodiments of these methods further comprise subjecting the predetermined Ti 6-2-4-2 alloy to a pre-forming annealing cycle comprising: heating the predetermined alloy to a pre-forming annealing temperature of about 1550-1750° F.; holding the predetermined alloy at the pre-forming annealing temperature for about 30 minutes; and cooling the predetermined alloy to room temperature. These methods allow components comprising 90° bend angles, having a bend factor as low as about 6.2 T, to be achieved.

Titanium 6Al-2Sn-4Zr-2Mo sheet material in various thicknesses, also known as Ti 6-2-4-2 sheet, is commercially available in a duplex annealed condition according to AMS 4919 specifications. According to AMS 4919 specifications, Ti 6-2-4-2 sheets under 0.1875 inches (4.762 mm) in nominal thickness are heated to 1650±25° F. (899±14° C.), held there for 30±3 minutes, cooled in air to room temperature, reheated to 1450±25° F. (788±14° C.), held there for 15±2 minutes, and then cooled in air to room temperature. In this condition, Ti 6-2-4-2 sheet is not very cold-formable, and a bend factor (bend diameter/sheet thickness) of about 12-14 T is generally required to reliably produce crack-free components with 90° bend angles.
Ti 6-2-4-2 sheets are commonly utilized to make gas turbine engine components such as nozzle sidewalls, flaps, ducts, cases, brackets, etc. Cold-forming such components from Ti 6-2-4-2 sheet is difficult, and often times, cracks are formed in such parts when they are cold-formed, resulting in poor production yields. Additionally, for successful cold-forming, bend radii need to be very large, which increases the weight of the part and reduces the stiffness thereof. Ti 6-2-4-2 sheet may be hot formed to tighter bend radii, but this requires expensive tooling and chemical milling after forming.
Therefore, it would be desirable to have improved techniques for cold-forming Ti 6-2-4-2 sheet material so that hot forming would not be required. It would also be desirable to have cold-forming techniques that allow better production yields than currently possible to be obtained when cold-forming Ti 6-2-4-2 sheet material. Furthermore, it would be desirable to have techniques that allow Ti 6-2-4-2 sheet components having 90° bend angles and bend factors of less than about 12-14 T to be formed via cold-forming without cracking.

Ti 6-2-4-2 sheet with enhanced cold-formability


A method (300) for monitoring a data processing system is proposed. The method involves the measuring (306) of state parameters of the system. Indicators of the performance of the system are then inferred (324-330) from the state parameters by applying fuzzy-logic rules. The proposed solution is based on the idea of estimating (336) the expected value of each performance indicator in the future from a set of corresponding samples. In this way, it is possible to predict the evolution of the system and then detect (351) any problem in advance.

Applications for monitoring data processing systems play a key role in their management. For example, those applications are used to detect any critical condition in the system (so that appropriate corrective actions can be taken in an attempt to remedy the situation). Typically, the essential information relating to the critical conditions being detected is logged; the information is then available for off-line analysis through data warehousing techniques.
For this purpose, predefined state parameters of the system (such as a processing power consumption, a memory space usage, a bandwidth occupation, and the like) are measured periodically. The information so obtained is then interpreted according to a decision tree. The decision tree includes intermediate nodes each one defining a test based on the state parameters; the branches descending from the intermediate node correspond to the possible outcomes of the test. Each leaf node identifies the condition of the system (correct or critical). Typically, the tests are based on comparisons between one or more state parameters and corresponding threshold values. The threshold values are defined statically by an administrator of the system; for example, the occurrence of a low response time of the system can be inferred when the processing power consumption exceeds 70% and at the same time the memory space usage exceeds 60%.
A drawback of the solution described above is that the definition of the threshold values is strongly dependent on the characteristics of the system to be monitored. Therefore, this process implies a deep knowledge of the system; in any case, the results are always dependent on the skill of the administrator. Moreover, the threshold values cannot be defined in general terms for every system. For example, a processing power consumption lower than 70% can be acceptable in most practical situations; however, a far lower threshold value (for example, 50%) could be necessary in critical applications. Likewise, the behavior of the system usually changes at run-time, so that the threshold values that have been set at the beginning can be no longer valid later on. As a consequence, the threshold values must be selected according to the worst case, thereby increasing the detection of (alleged) critical conditions.
In any case, the available solutions can only be used to recover the correct operation of the system. Indeed, the decision tree detects any critical condition when it has already occurred and the system cannot continue working properly. Therefore, those solutions are completely ineffective in preventing the occurrence of problems in the system.
A possible solution could be that of lowering the threshold values; in this manner, it is possible to reduce the risk of experiencing any malfunctioning in the system (since the critical conditions are detected in advance). However, this approach has a deleterious effect on the operation of the system; indeed, the use of lower threshold values involves a dramatic increase of the detection of (alleged) critical conditions.
An additional drawback is due to the fact that the corrective actions that are taken in response to the detection of the critical conditions can be ineffective. Particularly, in many situations it is not possible to ascertain whether the critical condition detected by the monitoring application actually requires any corrective action. A typical example is that of a transient phenomenon, wherein the system automatically recovers to its correct operation; in this case, it would be preferred to take no correction action (since any intervention on the system could worsen the situation).

International Business Machines Corporation


A system and method for imaging a subject includes a first imaging pulse sequence having gradient blips along an x-direction and a y-direction to acquire calibration image data from multiple slices. The imaging pulse sequence also includes a plurality of Z-shimming gradient blips coincident in time with the gradient blips along the x- and y-directions and varied within each slice. A plurality of calibration images are reconstructed from the calibration image data and a comparison image is formed by selecting an image from the calibration images corresponding to at least one of the varied Z-shimming gradient blips for each slice to determine a desired value of the Z-shimming gradient blips. The desired values are used to perform a second pulse sequence to acquire clinical image data from the subject. The second pulse sequence is used to acquire clinical images having been compensated for magnetic susceptibility variations within the subject.

The present disclosure relates to medical imaging. More particularly, the disclosure relates to Z-shim compensation for magnetic resonance imaging (MRI).
When a substance such as human tissue is subjected to a uniform magnetic field (polarizing field B0) applied along, for example, a Z axis of a Cartesian coordinate system, the individual magnetic moments of the spins in the tissue attempt to align with this polarizing field, but precess about it in random order at their characteristic Larmor frequency. If the substance, or tissue, is subjected to a magnetic field (excitation field B1) that is in the x-y plane and that is near the Larmor frequency, the net aligned moment, Mz, may be rotated, or "tipped," into the x-y plane to produce a net transverse magnetic moment Mt. A NMR signal is emitted by the excited spins after the excitation signal B1 is terminated, this signal may be received and processed to form an image or produce a spectrum.
The MR signals acquired with an MRI system are signal samples of the subject of the examination in Fourier space, or what is often referred to in the art as "k-space." Typically, a region to be imaged is scanned by a sequence of measurement cycles in which gradients vary according to the particular localization method being used. Each MR measurement cycle, or pulse sequence, typically samples a portion of k-space along a sampling trajectory characteristic of that pulse sequence. This is accomplished by employing magnetic fields (Gx, Gy, and Gz) that have the same direction as the polarizing field B0, but which have a gradient along the respective x, y, and z axes. By controlling the strength of these gradients during each NMR cycle, the spatial distribution of spin excitation can be controlled and the location of the resulting NMR signals can be identified. The acquisition of the NMR signals samples is referred to as sampling k-space, and a scan is completed when enough NMR cycles are performed to adequately sample k-space. The resulting set of received NMR signals are digitized and processed to reconstruct the image using one of many well known reconstruction techniques.
Functional magnetic resonance imaging (fMRI) provides an approach to study neuronal activity. Conventional fMRI detects changes in cerebral blood volume, flow, and oxygenation that locally occur in association with increased neuronal activity that is induced by functional paradigms. This physiological response is often referred to as the "hemodynamic response." The hemodynamic response to neuronal activity provides a mechanism for image contrast commonly referred to as the blood-oxygen level dependent (BOLD) signal contrast. An MRI system can be used to acquire signals from the brain over a period of time. As the brain performs a task, these signals are modulated synchronously with task performance to reveal which regions of the brain are involved in performing the task. The series of fMRI time course images must be acquired at a rate that is high enough to see the changes in brain activity induced by the functional paradigm. In addition, because neuronal activity may occur at widely dispersed locations in the brain, a relatively large 3D volume or multi-slice volume must be acquired in each time frame.
Unfortunately, fMRI imaging of the brain acquired using gradient-echo echo-planar imaging (GE-EPI) consistently suffers adverse effects from magnetic field inhomogeneity in regions close to nasal sinuses and ear canals. The presence of both air and tissue causes magnetic susceptibility variation at the boundary of the two regions, resulting in both geometric distortion and signal loss. Signal loss occurs due to phase accumulation, which pushes the signal outside the slice encoding region. This signal can be recovered back into the imaging plane via Z-shim methods, where a Z gradient is applied across the slice prior to data acquisition. This is commonly implemented as a two-shot protocol, where each final image is formed through a combination of two Z-shimmed images, each emphasizing signal regions that are "dark" in the complementary image. However, doing so necessarily reduces the temporal resolution by half.
Single-shot Z-shim methods are attractive because data can be acquired for both components of the final image after a single RF excitation pulse. However, these methods commonly require longer EPI echo-trains, which can increase susceptibility effects resulting in increased geometric distortion.
It would be desirable to have a system and method for controlling or compensating for magnetic susceptibility variations within a subject to be imaged using an MRI system, such as during an fMRI study.

System and method for Z-shim compensated echo-planar magnetic resonance imaging


An array substrate comprising a plurality of pixel units and an external compensation circuit; wherein, for each pixel unit of the plurality of pixel units, the pixel unit comprises a detection switch device, and the pixel unit is connected to a corresponding input end of a multiplexer of the external compensation circuit through the detection switch device; the external compensation circuit is configured: to acquire first data in a case that the detection switch device is opened, the first data comprising noise data caused by a level jump of the multiplexer of the external compensation circuit; to acquire second data in a case that the detection switch device is closed, the second data comprising the noise data and electrical data of the pixel unit; and to obtain the electrical data according to the first data and the second data.

At present, for AMOLED display devices, in the art of external compensation known to the inventors, an external compensation circuit collects noise data of each pixel unit separately in a time-division multiplexing manner. After a multiplexer of the external compensation circuit selects an acquiring channel through a switch, there will be a voltage floating in the initial stage of the establishment of the GOA level VGH/VGL of the pixel unit, and the voltage floating is coupled to a sensing line by a parasitic capacitor, resulting in a large error in noise data extracted by the analog-to-digital converter (ADC) in the external compensation circuit.

Method and device of obtaining electrical data of pixel unit, and array substrate


A cycloid pinwheel speed reducer includes a first housing, two cycloidal gears, a plurality of rollers, an output shaft, a second housing, a mounting frame, an input gear, a transmission gear, and a first transmission shaft. The mounting frame includes a mounting portion, a first eccentric portion, and a second eccentric portion. The cycloidal gears are respectively sleeved on the first eccentric portion and the second eccentric portion. The second housing is sleeved on the mounting portion. The rollers are sandwiched between the second housing and the cycloidal gears. The transmission gear is rotatably mounted within the mounting portion and sleeved on the first transmission shaft, and meshes with the input gear and the first housing.

1. Technical Field
The present disclosure relates to speed reducers, particularly to a cycloidal pinwheel speed reducer.
2. Description of Related Art
A cycloidal pinwheel speed reducer may include an input shaft mounted on a frame by a bearing. The input shaft includes an eccentric shaft, and is assembled with two cycloidal gears by the eccentric shaft. The two cycloidal gears are respectively connected to an output shaft. The eccentric shaft rotates the cycloidal gears, and the cycloidal gears rotate the output shaft. However, when in use, each cycloidal gear simultaneously rotates around its own axis and an additional axis, a high rotation concentricity of the cycloidal pinwheel speed reducer is needed to achieve a stable transmission. However, in order to achieve a high transmission ratio, the cycloidal gears may be used in a second transmission stage, and the input shaft is used to output a movement of a first transmission stage. The first transmission stage may affect a rotation concentricity of the input shaft, which reduces the rotation concentricity of the cycloidal pinwheel speed reducer.
Therefore, there is room for improvement in the art.

HONG FU JIN PRECISION INDUSTRY (ShenZhen) CO., LTD.


A protective device for a vehicle is described which is deactivatable by a switch, the state of the switch being analyzable by a processor in a control unit and by an independent hardware path. The independent hardware path has at least one logic module which makes the setting of delay times highly flexible.

A safety device for motor vehicles is described in German Published Patent Application No. 199 60 179. The motor vehicle has one airbag or multiple airbags in this case which can be deactivated via a switching arrangement. The switching arrangement is configured here in the form of a deactivation switch.


A method to fabricate a photovoltaic device includes forming first and second contact regions at the first surface of a semiconductor donor body. A cleave plane may be formed by implanting ions into the donor body, and a lamina that includes the contact regions is cleaved from the donor body at the cleave plane. The first surface of the lamina may be contacted with a temporary support and fabricated into a photovoltaic device, wherein the lamina comprises the base of the photovoltaic device.

The invention relates to a photovoltaic cell electrically contacted only at its back surface, the photovoltaic cell comprising a thin semiconductor lamina.
In conventional crystalline photovoltaic cells formed from silicon wafers, the cell is generally thicker than actually required by the device. Making a thinner crystalline cell using conventional methods can be difficult, as thin wafers are prone to breakage. A photovoltaic cell includes an emitter and a base; typically one of the emitter or the base is contacted at the light-facing surface, while the other is contacted at the opposite face. As will be described, methods of forming a thin photovoltaic cell may present challenges in making electrical contact to both the light-facing and back surfaces of the photovoltaic cell.
There is a need, therefore, for a thin photovoltaic cell where electrical contact to both the emitter and base regions is readily made.

Back-contact photovoltaic cell comprising a thin lamina having a superstrate receiver element


A sensor substrate (20) which includes phototransistors (7), each having a photosensitive semiconductor layer, and auxiliary capacitances (17) connected to the drain electrodes D of the corresponding phototransistors (7), and detecting ICs (25) for detecting a photoelectric conversion amount of the sensor substrate (20), which is connected to a source electrode S of the phototransistor (7), are provided. In the auxiliary capacitance (17), a predetermined amount of charge is stored, and also stored are the charge as generated by an emission of a light beam onto a photosensitive semiconductor layer in the non-conductive state of the phototransistor (7). Each detecting IC (25) detects a photoelectric conversion amount of the sensor substrate (20) based on the amount of charge remaining in the auxiliary capacitance (17).

Conventionally, as means for inputting an image in a personal computer, a facsimile machine, etc., adopted is an image input device (an image scanner, for example) adopting a combination of a 1D image sensor and a mechanical scanner. For such image input device, a mechanical scanning is necessary to scan an image in a document either by moving the 1D image sensor relative to the document or moving the document relative to the 1D image sensor. A problem therefore arises in that the speed of reading images is lowered, or the apparatus cannot be reduced in size and weight as desired.
On the other hand, various types of close coupling image sensors which do not require mechanical scanning have been proposed. Such two-dimensional image sensors generally include pixels arranged in a 2D matrix form, each pixel being made up of a pixel selection transistor which serves to prevent crosstalk, and a photodiode or a photo transistor, which functions as a photosensor.
The foregoing two-dimensional image sensor is typically arranged such that the amount of charge generated according to an amount of light incident on each photosensor is stored in each pixel, and an amount of charge is read from each pixel by conducting pixel selection transistors in order by electric scanning. For such two-dimensional image sensor, for example, ITE Technical Report Vol. 17. No. 16. pp 25 to 30 discloses a test sample adopting a pin photodiode as a photosensor.
Incidentally, to realize a high density pixel, the structure which adopts a pixel selection transistor and a photosensor as one integral part has been proposed. For example, Japanese Patent No. 2796336 (Japanese Laid-Open Patent Application No. 2-246272/1990 Tokukaihei 2-246272/2000 (published on Oct. 2, 1990), and Japanese Patent No. 3019632 (Japanese Laid-Open Patent Application No. 6-132560/1994 Tokukaihei 6-132560/1994 (published on May 13, 1994)) discloses the structure wherein the photosensor itself functions not only as a photosensor but also to select pixel to realize a pixel with a smaller area.
For the described beneficial features which realize high speed image reading, lighter weight, thinner structure without requiring mechanical scanning, various types of close coupling two-dimensional image sensors have been proposed, but none of them have not yet been used in practical applications.
Essential factors which hinder the practical applications of the foregoing close coupling image sensor include the complex structure of the pixel and the array. Specifically, to fabricate a photosensor, a larger number of processes are needed, or the pixel of more complicated structure is needed, or a larger pixel area is required as compared to the case of fabricating the TFT array adopted in the active matrix liquid crystal array subjected to mass production, and a higher resolution is therefore difficult to be realized.
For the arrangement wherein the photosensor itself serves not only as a photosensor but also as a member for selecting the pixel, such complicated structure that an inverse stagger type thin film transistor and a stagger type thin film transistor are combined by adopting a semiconductor layer of a monolayer structure is adopted, and the complicated manufacturing processes are therefore needed.
The present invention is achieved in view of the foregoing problems associated with the conventional structure, and it is therefore an object of the present invention to provide a photoelectric converter which realizes a higher resolution by simplifying the pixel structure to be adopted in a photosensor, and which permits the manufacturing process to be simplified, and also to provide an image input device and a two-dimensional image sensor adopting such photoelectric converter.

Method for detecting photoelectric conversion amount and photoelectric converter, method for inputting image and device for inputting image, two-dimensional image sensor and method for driving two-dimensional image sensor


An electrically programmable memory device is proposed including: a matrix of memory cells arranged in a plurality of memory arrays and at least one redundancy array; and a substituting structure that substitutes the use of each memory array with the use of one of the at least one redundancy array in response to a failure of the memory array, wherein the memory arrays are grouped into at least one set. The substituting structure includes: a structure for associating each set with a predetermined one of the at least one redundancy array; a flag for each memory array indicative of the failure of the memory array; and a selecting for enabling each memory array or the associated redundancy array according to the corresponding flag.

1. Field of the Invention
The present invention generally relates to the field of solid-state memories, particularly to semiconductor memories and, even more particularly, to the field of non-volatile memories. Specifically, the invention relates to non-volatile memories that are electrically programmable.
2. Description of the Related Art
Non-volatile memory devices are commonly used in several applications when the data stored in the memory device need to be preserved even when the power supply is off. Within the class of non-volatile memory devices, electrically programmable (and erasable) memory devices, such as flash memories, have become very popular in applications in which the data to be stored is not immutable (as it might be the case of, e.g., a consolidated code for a microprocessor), being instead necessary from time to time to store new data, or to update the data already stored.
Typically, the memory device includes an arrangement of memory cells, disposed for example in rows and columns, so as to form a matrix integrated on a chip of semiconductor material together with read/program circuits and control circuits for managing read/write operations on the memory device.
Before shipping, each memory device undergoes a testing phase, particularly, a so-called Electrical-Wafer Sorting (EWS) in which some invalid memory cells, i.e., containing invalid data bits not repairable, can be found and identified. The presence of at least one inoperative memory cell is sufficient to put the whole memory device out of use.
In order to increase the yield of the manufacturing process, commonly spare memory cells are provided, designed to be used in substitution of invalid memory cells. These spare memory cells are defined as redundancy (or redundant) cells and are identical to the memory cells of the matrix. In particular, the layout of the memory cell matrix favors the use of entire rows or entire columns of redundancy cells (redundancy rows or columns) in place of rows or columns in which a memory cell has been found defective. A number of redundancy rows or columns is chosen on the basis of a compromise between the capability of correcting the failures and the area required for implementing not only the redundancy but also possible additional on-chip circuit for managing the redundancy.
In the solutions known in the art, an additional memory is provided for mapping the rows or columns including identified defective memory cells. Typically, the additional memory stores in a non-volatile way memory addresses (associative memory) corresponding to the faulty rows or columns. For example, the additional memory may be an Electrically Erasable Programmable ROM (EEPROM) Content Addressable Memory (CAM) or also an Unerasable Programmable ROM (UPROM). An additional register is provided for storing redundancy addresses of the redundancy rows or columns to be used in substitution of the faulty rows or columns. Before any operation on the memory device the memory addresses are compared with the content of the additional memory and, if found therein, they are discarded and substituted with the associated redundancy addresses stored in the register.
One of the main disadvantages of such solutions is a penalization on the access time of a memory location, depending on the time required to carry out the comparison between received memory addresses and all the faulty memory addresses stored in the additional memory. Accordingly, the access time increases with the size of the memory device.
Many solutions are known in the art, in which the additional memory is integrated on the same chip of the memory device together with a circuitry adapted to manage the redundancy in order to render the access to the memory device completely transparent to the final user. For example, reference can be made to U.S. Pat. No. 6,301,152 B1, U.S. Pat. No. 6,418,051 B2, EP 1 357 559 A1 and EP 1 365 419 A1 of STMicroelectronics Srl, in which efforts are made also to improve the access time.
Such a choice is very advantageous, but every increase of the corrective capability of the redundancy provokes an increase of the required area for its control circuitry, as well as an increase of the whole device complexity.

Programmable memory device with an improved redundancy structure


A drive wheel for driving a feed chain for dry-feeding livestock includes a base wheel having an axial passage for receiving a drive shaft and a gear rim having a toothed external circumferential face, wherein the external circumferential face has a multiplicity of tooth elements. Each tooth element has two tooth tips and one chain clearance disposed between the two tooth tips. At least the gear rim composed of an elastic material.

Dry feed in the form of meal, crumbs, or pellets is often transported and metered in livestock farming, in particular pig farming. Feeding systems for dry-feeding are used to this end. Such a feeding system transports the dry feed from a feed silo by way of an onward line to feeding stations, for example, for feeding individual animals, for supplying automatic feeders for breeding piglets, or for fattening pigs, or for supplying on-demand feeding stations for pregnant sows in group pens. The feed line in most instances comprises a conveyor pipe having a feed chain on which baffle disks are disposed. The feed chain is driven by way of a drive station and is moved through the conveyor pipe, wherein feed from the feed silo makes its way between the baffle disks and by the latter is moved through the conveyor pipe to the feeding stations
Further improvements to the drive unit are desirable in particular for large feeding systems having long feed lines.

Drive wheel for driving a feed chain for the dry feeding of livestock


Agriculturally useful compositions comprise individual quantities of anhydrous ammonia, ammonia solution, and one or more agricultural actives different than anhydrous ammonia. The compositions may include polyanionic polymers, fertilizers, and/or biocidal agents. Preferably, the compositions are created in pressurized tanks and are applied in the same fashion as anhydrous ammonia.

1. Field of the Invention
The present invention is broadly concerned with new agriculturally useful compositions comprising anhydrous ammonia supplemented with one or more types of agricultural actives. More particularly, the invention is concerned with such compositions, and methods of preparing and using the compositions. In general, the products include respective quantities of anhydrous ammonia, ammonia solution, and one or more agricultural actives.
2. Description of the Prior Art
Anhydrous ammonia is widely used as a fertilizer. This material is gaseous at normal ambient temperatures, and therefore is maintained under pressure in tanks to keep it in a liquid form prior to application. Anhydrous ammonia is typically injected from a pressure tank into the soil below grade in order to inhibit the volatilization of the ammonia into the atmosphere. Although anhydrous ammonia has no pH owing to the fact that it is water-free, it is an extremely caustic material which must be handled with great care. For example, if water is injected into anhydrous ammonia, the result is a violent and uncontrolled exothermic reaction. Although not generally practiced, it has been known to mix fertilizer components with anhydrous ammonia prior to application thereof to the soil. See, e.g., U.S. Pat. No. 3,997,319, which describes the addition of zinc acetate to anhydrous ammonia to form a mixed fertilizer.
In recent years a series of U.S. patents have issued describing biodegradable polymers having significant agricultural facilities, particularly when used in combination with conventional fertilizers or pesticides. For example, U.S. Pat. No. 6,515,090 describes dicarboxylic copolymers made up, e.g., of moieties of itaconic acid and maleic anhydride. This patent also discloses that such copolymers may be partially neutralized with metal or other cations, and can be used to form composite products with fertilizers. These combined fertilizer-copolymer products have been shown to increase the availability of phosphorous and other nutrients for uptake by growing plants, and can be applied to soil adjacent the plants or in foliar applications. Moreover, these copolymers can be used to good effect in combination with various pesticides, as described in U.S. Pat. No. 7,655,597. Polymers in accordance with the '090 and '597 patents are commercially available from Specialty Fertilizer Products, LLC of Leawood, Kans. under the designations NUTRISPHERE-N® and AVAIL®. NUTRISPHERE-N® is a 40% by weight solids aqueous copolymer of substantially equimolar amounts of itaconic and maleic anhydride moieties partially neutralized with calcium ion (CAS#877469-38-0) and having a pH of 2.5-5. AVAIL® is a 40% by weight solids aqueous copolymer of substantially equimolar amounts of itaconic and maleic anhydride moieties partially neutralized with sodium ion (CAS#556055-76-6) and having a pH of 6-8.
As indicated, these synthetic polymers are provided as aqueous mixtures containing approximately 40% by weight polymer. Therefore, these aqueous polymer mixtures are not suitable for direct injection into anhydrous ammonia even though, from a plant nutrition standpoint, such mixtures would be highly useful.
Similarly, other types of solid or liquid agriculturally useful ingredients could be advantageously mixed with anhydrous ammonia, except for the tendency of solids to segregate from anhydrous ammonia, and/or because of the presence of water.
There is accordingly a need in the art for new agriculturally useful compositions and methods permitting actives such valuable fertilizers to be incorporated into anhydrous ammonia without experiencing the aforementioned problems.

Anhydrous ammonia supplemented with agricultural actives


Image carrying member units are each provided with an image carrying member, a charging device, and a pair of support frames. The charging device has: a charging roller that charges the image carrying member by rotation driven by the image carrying member; a cleaning member for cleaning the charging roller; a pair of bearing members for rotatably supporting both end parts of the cleaning member and the charging roller; and biasing members for biasing the bearing members in a direction in which the same moves closer to the image carrying member. An image carrying member bearing part and a first cleaning member bearing part for rotatably supporting one end part of the rotating shaft for the cleaning member where an input side gear is provided, are formed integrally on a first support frame for supporting one end part of the image carrying member where an output side gear is provided.

In conventional image forming apparatuses exploiting electrophotography, a charging device is incorporated for electrostatically charging the surface of a photosensitive member which is an image carrying member. There are known charging devices of a corona charging type in which a photosensitive member and a corona wire are arranged with no contact with each other to electrostatically charge the surface of the photosensitive member by corona discharge, and charging devices of a contact charging type in which contact is made with the surface of a photosensitive member by use of a charging member such as a charging roller. However, in recent years, to reduce the amount of discharged ozone, which is harmful to the human body, the contact charging-type charging devices, which discharge less ozone, have been increasingly used.
When a charging roller is brought into contact with the surface of a photosensitive member in such a contact charging-type charging device, foreign matter such as a toner component or paper dust of sheets may attach to the surface of the photosensitive member, and the foreign matter may move to the surface of the charging roller. The foreign matter attached to the surface of the charging roller causes failure to electrostatically charge the surface of the photosensitive member, greatly affecting the image quality of images printed. To prevent the foreign matter from attaching to the charging roller as described above, conventionally, by bringing a cleaning member such as a cleaning brush or a cleaning roller into contact with the surface of the charging roller, the foreign matter attached to the charging roller is removed.
For example, Patent Document 1 discloses an image forming apparatus in which a cleaning roller in pressed contact with the circumferential surface of a charging roller is driven to rotate while keeping a linear velocity difference relative to the charging roller, and the cleaning roller reciprocates in the axial direction of the charging roller so that soil on the charging roller is removed.

Image carrying member unit and image forming apparatus provided with same