A method is used to select a multimode fiber meeting requirements of a first minimum bandwidth at a first wavelength and a second minimum bandwidth at a second wavelength different from the first wavelength. Differential mode delay (DMD) data is measured for the multimode fiber at the first wavelength. The DMD data comprises output laser pulse data as a function of the radial position of an input laser pulse having the first wavelength. The DMD data is transformed into mode group space, to obtain relative mode group delay data as a function of mode group. The multimode fiber is selected based on meeting requirements of the first minimum bandwidth at the first wavelength based on a first set of criteria, comprising a first criterion using as input the measured differential mode delay (DMD) data for the multimode fiber measured at the first wavelength. The multimode fiber is selected based on meeting requirements of the second minimum bandwidth at the second wavelength based on a second set of criteria, comprising: a second criterion using as input the relative mode group delay data. A related system is also described.

Multimode optical fiber used with short-wavelength VCSELs (vertical cavity surface emitting lasers) has emerged as a dominant technology for short-reach high data networks. Examples of such networks include office buildings and data centers. Copper networks are increasingly unable to meet the requirements of such networks. Single mode optical fiber can achieve much greater data rates and transmission lengths than multimode optical fiber. But, a network using multimode fiber coupled with VCSELs is less expensive than a network using single mode optical fiber coupled with the types of lasers, splices and connectors required by single mode optical fiber and the small core diameter of single mode fiber. The higher data rates and transmission lengths achievable with single mode fiber are not required for short-reach high data networks. So, multimode fiber provides an effective low-cost optical connectivity solution for such networks.
Multimode fiber operated at 850 nm is presently a leading optical media used in short-reach high data networks. Such fiber typically meets an industry-standard set of requirements referred to as "OM4," which imposes minimum bandwidth requirements at 850 nm. But, recent trends are driving multimode fiber to longer wavelengths. So, the recently ratified OM5 industry-standard requirements impose minimum bandwidth requirements at 953 nm. Due to desires for compatibility with legacy 850 nm systems and wavelength division multiplexing capability, OM5 fiber must also meet the OM4 requirements. So, the OM5 standard includes all of the requirements of the OM4 standard, plus additional minimum bandwidth requirements at 953 nm.
The manufacturing process for optical fiber inevitably leads to variations from fiber to fiber that affects fiber performance. For example, a process designed to produce OM4 fiber may result in a high yield of fiber that actually meets the OM4 requirements, but there may be some fibers that do not. So, before being sold, each fiber is typically measured and verified to meet the OM4 specifications prior to shipment. For example, a bandwidth measurement at 850 nm may determine that a fiber does not meet the OM4 requirements, but does meet the OM3 requirements. If the measured 850 nm bandwidth verifies that a fiber meets the OM4 requirements, a second bandwidth measurement at 953 nm may be performed to determine if this fiber also meets the OM5 requirements. There are other types of industry-standard requirements, such as OM1, OM2 and OM3. In addition, customers sometimes ask for fiber that meets non-standard requirements, for example a minimum bandwidth requirement at a wavelength not specified in the industry standards, or a minimum bandwidth requirement higher than those required by industry standards.
Table 1 shows the industry standard requirements for OM1, OM2, OM3, OM4 and OM5 fibers as of June, 2018. OM1 and OM2 are now in an informative annex for IEC11801 as grandfathered specifications.
TABLE 1Multimode optical fiber nomenclature and bandwidthsNomenclature reference: ISO/IEC 11801 and ANSI/TIA-568-C.3Minimum Modal Bandwidth (MHz-km)OverfilledEffective BandwidthCoreLaunch Bandwidth(Laser Launch)FiberDiameterYear(OFL BW)(EMB)Type(μm)Introduced850 nm1300 nm953 nm850 nm953 nmOM162.51986-89200500n/an/an/aOM2501981500500n/an/an/aOM35020021500500n/a2000n/aOM45020093500500n/a4700n/aOM55020163500500185047002470
Multimode fiber is verified to meet the OM4 standard requirement of 4700 Mhz-km for a 850 nm laser source by performing an industry standard measurement referred to as a Differential Mode Delay, or "DMD" measurement, on the fiber using an 850 nm laser. Industry standards allow this measurement to be used in two different ways. First, the results of the DMD measurement, which provide data for various radial positions of an input laser pulse, may be compared to a mask. If the DMD measurement meets the requirements of the mask, the fiber qualifies as meeting the 4700 MHz-km requirement. Second, the results of the DMD measurement may be used to calculate an effective minimum bandwidth (calculated), or "minEMBc." If the minEMBc is above a threshold value the fiber is verified to meet the OM4 requirement, which is (4700 MHz-km/1.13)=4160 MHz-km at 850 nm. The ISO/IEC 11801 and ANSI/TIA-568-C.3 standards define a fiber as meeting the requirements for an OM4 or OM5 fiber if minEMBc is greater than or equal to the Minimum Modal Bandwidth numbers in Table 1 divided by 1.13, as opposed to a direct comparison to the bandwidth numbers in Table 1. Similarly, minEMBc times 1.13 may be compared to the values in Table 1 for purposes of verifying OM4 and OM5 fiber. Unless otherwise specified, this document uses the same convention. The DMD measurement at 850 nm may also be used to qualify the fiber as meeting the OM4 standard requirement of 3500 MHz-km for an overfilled launch, or OFL, using a different set of calculations. For OM5 fiber the same specifications at 850 nm are required, as well as a DMD measurement and minEMBc at a wavelength of 953 nm.
Some fiber manufacturers have an installed base of equipment tailored to performing this DMD measurement at 850 nm. In addition, a fiber manufacturer may have a database of DMD measurements measured at 850 nm for OM4 fiber in inventory. An additional DMD measurement may be performed at a second wavelength, such as the 953 nm of the OM5 standard, or at other customer-specified wavelengths. However, given that the fibers meeting this second criterion are a small subset of the manufacturing distribution, it is not cost-effective to perform the second measurement on every single fiber. Accordingly, there is a need for a method to select multimode fibers likely to meet bandwidth requirements at 953 nm or other wavelengths based on DMD measurements performed at 850 nm. More generally, there is a need for a method to select fiber likely to meet bandwidth requirements at a second wavelength based on DMD measurements performed at a first wavelength different from the second wavelength.

Method of identifying wideband MMF from 850 nm DMD measurements


There is disclosed a container comprising a container portion for storing one or more items. The container portion is accessible via a movable closure. The container portion also comprises an input device and a lock for selectively configuring the container portion in a locked state or an unlocked state. The container also comprises a communication module for communicating with a user device of a user. A controller is configured such that, in response to actuation of the input device when the container portion is in the locked state, the controller causes a request for access to the container portion to be sent by the communication module to the user device of a user only on condition that one or more items is determined by the controller to be present in the container portion.

It is known for people to order items that need to be delivered to their home or office. A problem exists when there is no-one available at the delivery address to accept the items. In such situations the delivery person often returns the items to a depot for subsequent collection by the intended recipient. This is inconvenient. Alternatively a designated "safe-place" is agreed beforehand between the recipient and the sender of the items (or the delivery service). The safe-place may be for example a rear door-step or an unlocked box. Such safe-places may lack the necessary security to stop thieves from stealing the delivered items.


Crystalline micronized particulate of a glycopyrronium salt may be prepared by hydrodynamic cavitation. The resulting drug particles are physically stable with regard to agglomeration and/or aggregation on storage.

Field of the Invention
The present invention relates to processes for the manufacture of crystalline particles of an anti-muscarinic drug. The present invention also relates to Said particles pharmaceutical formulations which contain such particles and methods for the prevention and/or treatment of respiratory diseases by administering such a formulation.
Discussion of the Background
It is known that water soluble quaternary ammonium compounds with antimuscarinic activity tend to agglomerate during storage. This is attributed to the formation of crystal bridges between neighboring particulates due to the absorption of moisture post micronization and subsequent recrystallization of surface amorphous content which is generated by the high energy micronization process. This problem particularly affects the physical stability of the drug and its subsequent performance in formulations.
Glycopyrronium is an anti-muscarinic drug commercially available as bromide salt since many years.
Glycopyrronium bromide has two chiral centers corresponding to four isomeric forms comprising two pairs of diastereoisomers, namely (3S,2′R)-, (3R,2′S)-, (3R,2′R)-, and (3S,2′S)-[(cyclopentyl-hydroxyphenylacetyl)oxy]-1,1-dimethylpyrrolidinium bromide. Commercially available glycopyrronium bromide consists of the purified "threo" diastereoisomer (3R,2′S) and (3S,2′R) and is hereinafter indicated as rac-glycopyrronium bromide.
However, similarly to other anti-muscarinic agents, glycopyrronium salts have significant stability problems, especially immediately following conventional micronization processes by milling.
In fact, glycopyrronium bromide, once micronized, has a strong tendency to aggregate and/or agglomerate, which severely hinders downstream drug processing, particularly the preparation of dry powder formulations for administration by inhalation capable of delivering a good respirable fraction.
Various processes have been proposed in order to change certain physicochemical properties of the drug. However many of these processes involve the use of solvents which tend to cause local solvation processes that, in turn, lead to particle growth and/or irreversible aggregation and agglomeration during drying or storage.
In addition, it is well known that the current state-of-the-art high energy physical processing procedures, such as air jet milling, dry powder ball-milling or high pressure homogenization, give rise to a partial loss of drug crystallinity. These micronized materials are often subjected to post micronization conditioning at high temperature for long periods in order to condition out any process-induced structural disorder and/or amorphous content.
In view of these considerations, it would be highly advantageous to provide a process for preparing crystal particles of a glycopyrronium salt, physically stable, with a narrow particle size suitable for delivery by inhalation.
This problem is solved by the process of the present invention.

Preparation of micronized particles of an antimuscarinic compound by hydrodynamic cavitation


A touch panel includes a substrate, plural first coils, plural second coils, plural sensing pads, plural connection lines, and a control circuit. The first coils, the second coils, the sensing pads and the connection lines are configured on the substrate. Each first coil has a first connection portion and a first coil portion connected to the first connection portion and extending along a first direction. Each second coil has a second connection portion and a second coil portion connected to the second connection portion and extending along a second direction. Plural overlapping regions are defined by areas occupied by the first coil portions and the second coil portions on the substrate, and the sensing pads are located in the overlapping regions. The connection lines are respectively connected to the sending pads. The connection lines, the first connection portions and the second connection portions are connected to the control circuit.

1. Field of the Invention
The present invention generally relates to a touch panel, in particular, to a touch panel having diversified functions.
2. Description of Related Art
In recent years, various electronic products are continuously developed towards simple operation, small volume, and large screen size. Particularly, portable electronic products have more strict requirements on the volume and the screen size. Therefore, in many electronic products, a touch panel and a liquid crystal display panel are integrated, so as to save a space required by a keyboard or manipulation press keys, so that an area in which the screen may be configured is enlarged.
Generally, the touch panel may be approximately divided into a resistance touch panel, a capacitance touch panel, an optical touch panel, an acoustic wave touch panel, and an electromagnetic touch panel according to different sensing manners. The capacitance touch panel has advantages of having quick action time, good reliability, and high durability, so as to be widely used in the electronic products. In addition, a plurality of electrodes is disposed on the touch panel to realize a touch sensing circuit with column and row configuration, so that in addition to providing a touch sensing function, the touch panel may also be used to realize other functions, so as to diversify functions of the electronic device without increasing a volume.


A support mechanism and a mobile terminal are provided. The support mechanism comprises: a first support plate, a second support plate, and a transmission mechanism for connecting the first support plate with the second support plate. When the support mechanism is in a support state, the first support plate and the second support plate are in a first relative position with respect to each other to form a support surface. The mobile terminal includes a first body, a second body connected to the first body, a support mechanism and a display screen. The display screen comprises: fixed portions fixed to at least one of the first body or the second body, and a deformable portion. The support mechanism is arranged on the second body.

With the development of Internet and informatization, electronic products have become a necessity in people's daily life. Now the shapes of electronic products have slowly become homogenized, basically giving the appearance of a bar-phone. Moreover, due to different usage scenarios, when people want to get a good user experience, there is a conflict between the size of a display screen of an electronic product and the volume of the electronic product itself. For example, an electronic product with a small volume is easy to carry, but inevitably the size of its display screen is small, which influences watching experience, and consequently reduces the user experience.
Now, a flexible screen, that is capable of being bended, has been produced in mass, and it can be used as the display screen of the electronic product to solve the conflict between the size of the display screen of the electronic product and the volume of the mobile terminal. As such, the problem to be solved is how to realize a bigger display screen in the same volume of the mobile terminal by a deformable characteristic of the flexible display screen in the electronic product, and provide a better service for users.


Systems, apparatus and methods for handling verification violations are disclosed. In one aspect, a method stores a list of fix information in addition to geometric shapes for each layer during verification, such as design rule checking For each primitive operation step performed during verification, two tasks are performed. First, if the primitive operation is a dimensional checking operation (i.e., width, spacing or enclosure), then for each violation, the first task creates fix information containing violation edge pairs and adds the created fix information to the fix information list on the output layer. Second, for all operations and after the output shapes on the output layer are generated, a second task passes the fix information on input layers which overlap any output shape of the output layer to the output layer's fix information list. Finally, fix guides for the final violation results are generated and drawn based on the final fix information list.

Electronic design automation (EDA) is a general term used to describe computer-based design tools that assist an engineer or designer in their design tasks. EDA tools are especially useful in the integrated circuit (IC) design field. The improvement of EDA tools for IC design work has enabled a corresponding increase in speed to market for electronic products and facilitated a greater level of sophisticated interoperability between systems used by disparate designers and manufacturers.
EDA tools often involve circuit schematic capture, design verification and circuit layout for IC circuit design in the analog, digital, mixed signal, and custom circuit devices fields. With the layout aspect of EDA work, IC designers continue to strive towards more efficient use of a device's physical space. Manual and automated layout tools within conventional EDA tools commonly assist IC designers in this manner. In doing so, the EDA tools rely upon design rules that provide working parameters for an acceptable design and that can be verified for a particular design.
As technology advances, the details and complexity of design rules are commonly known to increase at a rapid pace. IC layout typically follows semiconductor foundry design rules for a particular process that will implement the designed IC (e.g., a 65 nm process). Following such design rules helps to ensure the yield rate at manufacturing. When design rules are found to be in violation by a particular design, an EDA tool user typically uses one or more aspects or features of the EDA tool to fix or otherwise change the current design to remove the design rule violations. However, at times, this can be cumbersome and quite complicated as what may appear at first to be a desired fix for a detected DRC error or violation may actually introduce or induce other errors or violations. Additionally, some errors may be multi-faceted in that a given layout may violate several rules in several different ways. Thus, there is a need to easily detect and implement fixes to remove verification rule violations without causing or while minimizing new violations and to handle more complex verification rule violations.

System and methods for handling verification errors


A server includes memory storing management information including: first correspondence information representing correspondence between an output format for printing process and price for the printing process based on the output format; and second correspondence information representing correspondence between an account information of a user and balance spendable by the user and a controller configured to perform: receiving a printing request using an account information item; determining whether an object price is equal to or less than an object balance; if the object price is more than the object balance, extracting candidate output format that is different from the object output format and usable to perform a printing process based on the printing request within the object balance, with reference to the first correspondence information; and transmitting information representing the extracted candidate output format to an external device.

The have been proposed various technologies in which a plurality of users uses a printer through a network. For example, the following technology has been proposed. A server manages the maximum number of printable pages and a threshold, for each of identification numbers identifying users. Also, the server manages the printing history of each identification number using information from a printer having performed printing. In the case where the printer newly performs printing, if the number of printed pages exceeds the product of the threshold and the maximum number of printable pages, the server determines that it is impossible to perform printing. In the case where it is determined that it is impossible to perform printing, a personal computer selects a printing option (such as 1-UP, 2-UP, or 4-UP) usable to perform printing within the maximum number of printable pages.

Server stores and determines print output format and account information represnting remaining balance amount spendable by user for printing process


There is provided a server including a reception section which receives, from a client terminal, present position information showing a position of the client terminal, and direction information showing an orientation of the client terminal, a retrieval section which retrieves sensory data to which detection position information is added corresponding to a position in a vicinity of an axial line extending in a direction shown by the direction information from the position of the client terminal, and a transmission section which transmits the sensory data retrieved by the retrieval section to the client terminal.

The present disclosure relates to a server, a client terminal, and a program.
Usually, when a zoom operation is performed in an imaging apparatus such as a digital camera or a video camera, an image focused on a point in the distance is taken by a telescopic function. On the other hand, in recent years, zoom sound collection technology has been proposed which emphasizes target sounds in accordance with the zoom position.
For example, JP 2002-204493A discloses a zoom microphone apparatus which collects target sounds from a distance at the time of telephotography in accordance with the zoom position. Further, JP 2006-339991A discloses a multichannel sound collection apparatus which can change the zoom of sounds at the time of reproduction.


The present invention relates to a heat recovery device particularly suitable for internal combustion engines, and more particularly suitable for engines incorporating a WHRS (waste heat recovery system). The device of the invention relates to the occasional recovery of heat from the exhaust gases where the invention carries out this function such that the main conduit where the exhaust gases circulate is not affected by a noticeable increase in heat loss due to the incorporation of said device. It provides a heat exchanger (3.6) and a bypass flap valve (3.8) upstream for selectively diverting the exhaust gases to the main exhaust conduit (1) or to the heat exchanger (3.6).

The basic principles of heat recovery in internal combustion engines are simple. Exhaust gases are high-temperature gases that are given off into the atmosphere wasting a large amount of energy. If these gases are passed through a heat exchanger, part of the heat is transferred to another fluid for being used in various applications and its energy is partially exploited. These applications include, mentioned by way of example, heating the vehicle interior or increasing the engine oil temperature at the moment of starting so that it reaches optimal lubrication conditions in the shortest time possible.
The passage of exhaust gases through the heat exchanger does not have to occur at all times, so the existence of a bypass valve that manages the passage of hot gas either through the heat exchanger or through the main conduit arranged in parallel with the heat exchanger and therefore without the interposition of the exchanger is necessary.
Bypass valves have a primary chamber which is in fluidic communication with one inlet and two outlets such that the position of an internal flap establishes if the fluid is diverted from the inlet to one outlet or to the other. The diversion of the flow in one direction or the other always entails a pressure loss.
When heat exchanger is used only on occasions because heat recovery is a function that is used only now and again, the pressure loss in the bypass valve penalizes the overall performance of the engine continuously even in the event that the heat recovery function is not used.
The present invention solves this technical problem as it is provided with a heat recovery device that almost introduces no loss and produces almost no modifications in the flow when the bypass valve is positioned such that the gas goes through the main conduit by closing and preventing passage through the heat exchanger. This technical problem is solved with a special configuration of the valve such that the main conduit has an internal configuration that is almost identical to the configuration that it would have without incorporating the heat recovery device, i.e., the flow path is virtually left unaffected by the incorporation of the heat recovery device.

BorgWarner Emissions Systems Spain, S.L.U.


The present invention relates to payment handling apparatus (10) which is operable to effect payment from a purchaser to a vendor. The payment handling apparatus (10) comprises a purchaser's device running a purchaser program (12) which is operable by the purchaser and a vendor's device running a vendor program (16) which is operable by the vendor. The purchaser's device (12) and the vendor's device (16) are in data communication with each other by way of a communication channel (26). The purchaser program is configured to encrypt a payment message and to convey a payment request to the vendor program by way of the communication channel (26). The payment request comprises the encrypted payment message. The payment handling apparatus is configured to encrypt a confirmation message and to convey a confirmation code to the purchaser program in dependence on receipt of the payment request by the vendor program. The confirmation code comprises the encrypted confirmation message.

Arrangements for making payments by way of a mobile device are known. According to one longer used approach, the vendor has apparatus comprising a handheld device such as a smartphone and a credit/debit card reader. The handheld device and the credit/debit card reader are in data communication and normally wireless data communication with each other such as by way of Bluetooth. Payment for goods or services is accomplished by the vendor entering the transaction details including the cost of the goods or services into the apparatus before the purchaser's credit/debit card is read by the credit/debit card reader and the purchaser authorises payment by entering a PIN associated with the credit/debit card.
More recently approaches to making payments without operative use of a credit/debit card have been introduced. One such approach involves the purchaser entering credit/debit card data into the vendor's mobile device or into a client process running on the purchaser's mobile device which is controlled over the Internet by a vendor process. This approach relies on underlying card payment infrastructure. A further known approach involves the purchaser logging into his banking application before the vendor passes a code containing payment details including the vendor's banking details to the purchaser. The purchaser then enters the code into the banking application which is then operative by way of data communication with the vendor's bank server to effect payment to the vendor such as by way of a faster Automated Clearing House (ACH) payment.
The present inventors have appreciated the above described known approaches to have vulnerabilities when at least one of the purchaser's mobile device and the vendor's mobile device is not in communication with the respective bank server. The purchaser's mobile device or the vendor's mobile device may not, for example, be in communication with a bank server on account of a fault in the communication channel. By way of another example, the purchase may be taking place where there is no communication with a bank server for either of the purchaser's mobile device and the vendor's mobile device such as in an aircraft when the aircraft is in flight.
The present invention has been devised in light of this appreciation. It is therefore an object for the present invention to provide improved payment handling apparatus which is operable to effect payment from a purchaser to a vendor. It is a further object for the present invention to provide an improved payment handling method which effects payment from a purchaser to a vendor.


A method for simultaneous analysis of individual samples for crude fat content. This method utilizes a process of encapsulation of a sample in filter media and the batch processing of numerous samples in one vessel. The method involves the quantitative encapsulation of a sample in a filter media. Multiple samples are subsequently extracted in batch with a suitable solvent, under controlled temperature and pressure conditions. The quantitative determination of crude fat is accomplished by measuring the difference between the residue remaining in the filter media and the weight of the original sample. This method greatly improves the efficiency of crude fat determinations and allows the processing of numerous samples simultaneously saving analytical time.

The evaluation of the nutrient composition of feeds and foods has traditionally included an analysis of crude fat. Crude fat is primarily a measure of the triglyceride content of the food or feed and represents the more energy dense component. Fat is commonly extracted from feed and food with diethyl either or petroleum ether. Compounds other than fat are soluble in diethyl ether or petroleum ether but they represent minor components in relation to the energy contribution to the diet and generally fall in the category of lipids. The quantitative analysis of crude fat has traditionally been accomplished by the Soxhlet extraction technique (Quantitative Chemical Analysis, by Hamilton and Simpson). The current state of the art of fat analysis is described in, "Methods of Analysis for Nutritional Labeling". The standardized Soxhlet technique is detailed by the Association of Official Analytical Chemists in the AOAC Official Method 920.39. This Soxhlet technique involves placing an individual sample in a filter chamber. This filter chamber is then placed in the siphoning compartment. The heater boils the solvent, commonly petroleum ether, and passes the vapor into a condenser. The condenser condenses the vapor into a liquid, channels it into the filter chamber and siphoning compartment. The solvent is periodically siphoned back into the distilling flask after it reaches a certain level in the siphoning compartment. The distillation/extraction process is continued for four to sixteen hours. The fat content of the sample is then determined either by evaporating the solvent and measuring the remaining fat directly or indirectly by weighting the weight loss of the sample contained in the filter chamber. The filter chambers that are commonly used are thimble shaped filter paper. Glass filter chambers with fritted glass filters and fritted Alundum thimbles are also used.
As described above, the prior art for crude fat analysis that is currently being used by regulatory laboratories, industry and academia involves individual analysis based on the traditional Soxhlet technique.
Apparatus designed to expedite the Soxhlet extraction process and improve the manual efficiency of the extraction process are described in U.S. Pat. No. 4,184,961. Improvements in the rate of extraction and solvent penetration of the sample matrix have been achieved by increasing the temperature and pressure of the extracting solvent as taught by U.S. Pat. No. 4,265,860. These instruments have the same limitation as the standard Soxhlet process of dealing with individual samples individually throughout the analysis. These instruments deal with individual samples in multiple setups and semi-automate or automate individual steps such as extraction, rinsing and solvent evaporation. These instruments can only process a limited number of samples since they deal with samples individually (up to twelve), and require costly equipment when calculated on a per sample basis.
In all of the systems described above, the samples are processed individually in order to yield a unique value for each sample. This requirement of individual sample processing limits the efficiency of the analysis and increases the cost of the instrument by requiring a replicate of the apparatus for each sample capable of being analyzed by the instrument.
U.S. Pat. No. 5,370,007 is directed to a Fiber Analysis System in which a sample of a feedstuff or food of a predetermined weight is sealed in a filter bag with selected porosity which recovers the fiber components while allowing the removal of the detergent soluble components of the sample. The fiber analysis taught by the '007 patent is accomplished by exposing the sample to an aqueous detergent solution (polar solvent) under heated conditions for a time sufficient to remove substantially all soluble solids from the feed while retaining the fiber components within the filter bag. The preparation of samples for analysis requires that the samples be ground to a fine particle size in order to ensure a representative aliquot. The sample grinding process fractures and fragments the different components of the feed differently. Non-fiber components such as non-structural carbohydrates, sugars, proteins, and minerals fracture into much finer particles than the fiber components. Because the large majority of fine particles are not fiber, their passage through the fiber filter media causes no error. Therefore the filtration media used in these filter bags benefits from the surface tension of the aqueous solution, and from the fact that very fine particles are soluble and do not need to be retained. To ensure accurate fiber results, only retention of particles larger than 25 microns is required for the filter media.
The significant differences between fiber analysis of the prior art and fat analysis of the present invention include: retention vs extraction of the analyte; the use of aqueous solutions vs. organic solvents; and the retention of coarse particle vs fine particle; 25 micron vs <4 micron filter media. These differences will become more apparent with a reading of the detailed description of the invention.

Method for determining the fat content of feed, food, and other materials utilizing filter media encapsulation


A light sailboat is provided with a transversely disposed sliding rail which extends from one side of the boat to the other. The sailboat is also provided with a seat which slides freely along this sliding rail.

In fact, in this type of boat the crew which constitutes the ballast of the boat must constantly place itself in a good position to effectively assure the balance. To compensate for the heel, it must put itself as counter-balance by being, for example, at the gunwale in case of a monokeel boat construction. When the wind is very strong, this counter-balance must be increased by leaning outwardly while passing the feet through slings to stop the outward dipping of the boat; this corresponds to the action called return movement. Finally, in racing sailboats a crewman must put himself completely outside the cockpit with the help of a system known as a "trapeze".

Light dropkeel boat with sliding means to control the transverse balance thereof


Apparatus is provided for measuring the potential for mutual coupling in an integrated circuit package of any type or configuration using a network analyzer in conjunction with a coaxial test probe. Simple, low-cost test fixturing and methods of testing may be used to measure the parasitic capacitance and inductance of one or more I/O leads of an integrated circuit package, the measured parasitic capacitances and inductances providing an indication of the susceptibility of the integrated circuit package to mutual coupling between electrical leads of the package or between an electrical lead and other components of the integrated circuit package.

1. Field of the Invention
The present invention relates generally to the design and testing of integrated circuit devices. Specifically, the present invention relates to the electrical characterization of integrated circuit device packages at high operating frequencies and, in particular, to apparatus and methods for measuring parasitic capacitance and inductance of one or more I/O leads of an integrated circuit device package using a network analyzer.
2. State of the Art
Designers of integrated circuit devices are facing increasingly difficult challenges as a result of the current trend toward integrated circuit devices exhibiting small overall package dimensions and having a large number of leads, yet being capable of operating at high frequencies. Such an integrated circuit device may include a complex array of closely spaced electrical leads adapted for establishing electrical communication with a semiconductor die, each lead having one end electrically connected to the semiconductor die and an opposing end adapted for electrical connection to an external device, such as a printed circuit board. Presently, a wide variety of integrated circuit package types and configurations are commercially available, including, for example, Ball Grid Array (BGA) packages, Thin Small Outline Packages (TSOPs), as well as other package types. It is a continuing goal of integrated circuit package designers to adapt these package configurations to fit within ever-decreasing volumes, to include a large number of electrical leads, and to operate at high frequencies in order to meet the demand for such devices.
An exemplary embodiment of a conventional BGA package 100 is shown in FIGS. 1 and 2. The conventional BGA package 100 may be a memory device, such as a DRAM chip, a processor, or any other integrated circuit device known in the art. The conventional BGA package 100 includes a semiconductor die 110 secured to a die-attach pad 112 formed on an upper surface 106 of a substrate 105, which may also be termed an interposer. The BGA package 100 also includes a plurality of electrical leads 130 adapted to provide electrical communication between the semiconductor die 110 and one or more external devices (not shown). The semiconductor die 110 and at least a portion of each electrical lead 130 may be encased by an encapsulant material 120 or, alternatively, the conventional BGA package 100 may have no encapsulant material 120, depending upon the particular package construction and intended use.
Each of the electrical leads 130 includes an external ball lead 132 configured for electrical connection to an external device. The ball lead 132 may be secured to a conductive pad 133 formed on a lower surface 107 of the substrate 105. Each electrical lead 130 further comprises a conductive via 134 extending from the conductive pad 133 and through the substrate 105 to a conductive trace 136. The conductive trace 136 is formed on the upper surface 106 of the substrate 105 and provides an electrical path from the conductive via 134 to a bond end 137 located proximate the semiconductor die 110. A bond wire 138 attached to the bond end 137 of the conductive trace 136 and extending to the semiconductor die 110, where the bond wire 138 is attached to a bond pad thereon, electrically connects the electrical lead 130 to the semiconductor die 110. At least the bond wire 138 and conductive trace 136 of each electrical lead 130 may be encased by the encapsulant material 120.
The conventional BGA package 100 may include a plurality of the ball leads 132 arranged, for example, in an array or arrays of mutually adjacent rows and columns. Referring to FIG. 1, the ball leads 132 may be arranged in two arrays 150, 160, each array 150, 160 disposed between an edge of the semiconductor die 110 and a peripheral edge of the substrate 105. Each array 150, 160 comprises three columns 151, 152, 153, 161, 162, 163, respectively, of ball leads 132. The arrangement of ball leads 132 is typically referred to as the "pin-out" or the "footprint" of the BGA package 100. The pin-out of the BGA package 100 may, by way of example, comprise outer and inner columns 151, 161, 153, 163, respectively, of ball leads 132 adapted to provide input and output of electrical signals to and from the semiconductor die 110, such ball leads 132 being referred to herein as "I/O leads." The pin-out may further comprise center columns 152, 162 of ball leads 132 adapted to provide a power signal to the semiconductor die 110 (a "VCC lead"), to provide a ground potential for the semiconductor die 110 (a "VSS lead"), or to provide a reference voltage to the semiconductor die 110 (a "VREF lead"). However, those of ordinary skill in the art will understand that the particular pin-out of an integrated circuit device may vary depending upon the application and that the pin-out may be of any suitable configuration.
An exemplary embodiment of a conventional TSOP 200 is shown in FIGS. 3 and 4. The conventional TSOP 200 may be a memory device, such as a DRAM chip, a processor, or any other integrated circuit device known in the art. The conventional TSOP 200 includes a semiconductor die 210 secured to a die-attach pad 212. The TSOP 200 further includes a plurality of electrical leads 230 adapted to provide electrical communication between the semiconductor die 210 and one or more external devices (not shown). The semiconductor die 210 and at least a portion of each electrical lead 230 are encased by an encapsulant material 220.
Each of the electrical leads 230 includes an external portion 232 configured for electrical connection to an external device. Each electrical lead 230 also includes an internal portion 234 extending from the external portion 232 to a bond end 235 located proximate the semiconductor die 210. A transversely extending bus bar or bars 239 may extend between two or more electrical leads 230. A bond wire 238 electrically connects the bond end 235 of the internal portion 234 to a bond pad on the semiconductor die 210 to establish electrical communication therebetween. Bond wires 238 may also extend between the transverse bus bar or bars 239 and one or more bond pads on the semiconductor die 210. At least the internal portion 234 and bond wire 238 of each electrical lead 230 are encased by the encapsulant material 220.
The external portion 232 and internal portion 234 of each electrical lead 230 typically comprise a single piece of material commonly referred to as a lead finger. Further, the lead fingers (external and internal portions 232, 234), bus bar or bars 239, and die-attach pad 212 typically comprise a structure usually referred to as a lead frame. Integrated circuit packages utilizing lead frame construction are well known in the art. It will be appreciated by those of ordinary skill in the art that the conventional TSOP 200 may include a lead frame of any configuration known in the art and, further, that the internal portion 234 may extend over and directly attach to the semiconductor die 210, such a lead frame being commonly referred to as a Leads-Over-Chip (LOC) configuration.
The external portions 232 of the electrical leads 230 extend from one or more edges of the TSOP 200 and are arranged in a row therealong. For example, as shown in FIG. 3, the TSOP 200 may include a row 250 of electrical leads 230 extending from an edge of the TSOP 200 and another row 260 of electrical leads 230 extending from an opposing edge of the TSOP 200. The arrangement of the external portions 232 of the electrical leads 230 comprises the pin-out or footprint of the TSOP 200. An electrical lead 230 may be an I/O lead, a VCC lead, a VSS lead, or a VREF lead, as noted above, and the particular configuration of the pin-out will vary depending upon the application.
For both the conventional BGA package 100 and the conventional TSOP 200, as well as for other conventional integrated circuit package types, the spacing between the electrical leads 130, 230—especially between adjacent conductive traces 136 and between adjacent internal portions 234 thereof, respectively—is becoming increasingly smaller to accommodate smaller overall package sizes and greater numbers of electrical leads 130, 230, as was suggested above. This close spacing between adjacent electrical leads 130, 230 in the conventional BGA and TSOP packages 100, 200, respectively, in conjunction with increasingly higher operating frequencies for newer integrated circuit devices, may lead to mutual coupling between adjacent electrical leads 130, 230, which may compromise signal integrity during operation of the integrated circuit package.
Mutual coupling between adjacent electrical leads of an integrated circuit device, especially at high frequencies, presents a difficult problem for integrated circuit package designers. The mutual coupling between adjacent electrical leads of an integrated circuit package, as well as between an electrical lead and other components of the integrated circuit package, may include mutual capacitance and mutual inductance, both of which are frequency dependent. Thus, as newer integrated circuit packages are being designed to operate in relatively higher frequency ranges—e.g., in the range of 100 MHz to 400 MHz and higher—the deleterious effects of mutual coupling on signal integrity become increasingly significant, and package designers must have tools available to quantify such effects. Mutual capacitances and mutual inductances within an integrated circuit package are commonly referred to as parasitic capacitance and parasitic inductance, or simply parasitics.
Shown in FIG. 5 is an electrical model of two adjacent electrical leads 130a, 130b in the conventional BGA package 100. The electrical lead 130a includes a resistance 801a, an inductance 802a, and a capacitance 803a. Similarly, the electrical lead 130b includes a resistance 801b, an inductance 802b, and a capacitance 803b. The electrical model depicted in FIG. 5 is commonly referred to as a "lumped" model.
Referring to FIG. 5, the resistance 801a comprises the individual resistances of the bond wire 138, the conductive trace 136, the conductive via 134, the conductive pad 133, and the ball lead 132 of electrical lead 130a. The inductance 802a comprises the individual inductances of the bond wire 138, the conductive trace 136, the conductive via 134, the conductive pad 133, and the ball lead 132 of electrical lead 130a, and further includes mutual inductances generated between the electrical lead 130a and the adjacent electrical lead 130b, as well as between the electrical lead 130a and other components of the BGA package 100. The capacitance 803a comprises the individual capacitances of the bond wire 138, the conductive trace 136, the conductive via 134, the conductive pad 133, and the ball lead 132 of electrical lead 130a, and further includes mutual capacitances generated between the electrical lead 130a and the adjacent electrical lead 130b, as well as between the electrical lead 130a and other components of the BGA package 100. The mutual inductances and mutual capacitances are, at least in part, dependent upon the configuration of, and the distance between, the adjacent electrical leads 130a, 130b and upon the magnitude and frequency of the electrical signals propagating through each of the adjacent electrical leads 130a, 130b, as well as through other surrounding electrical leads 130 and other components of the BGA package 100.
Similarly, the resistance 801b comprises the individual resistances of the bond wire 138, the conductive trace 136, the conductive via 134, the conductive pad 133, and the ball lead 132 of the electrical lead 130b. The inductance 802b comprises the individual inductances of the bond wire 138, the conductive trace 136, the conductive via 134, the conductive pad 133, and the ball lead 132 of electrical lead 130b, and further includes mutual inductances generated between the electrical lead 130b and the adjacent electrical lead l30a, as well as between the electrical lead 130b and other components of the BGA package 100. The capacitance 803b comprises the individual capacitances of the bond wire 138, the conductive trace 136, the conductive via 134, the conductive pad 133, and the ball lead 132 of electrical lead 130b, and further includes mutual capacitances generated between the electrical lead 130b and the adjacent electrical lead 130a, as well as between the electrical lead 130b and other components of the BGA package 100. Again, the mutual inductances and mutual capacitances are, at least in part, dependent upon the configuration of, and the distance between, the adjacent electrical leads 130b, 130a and upon the magnitude and frequency of the electrical signals propagating through each of the adjacent electrical leads 130b, 130a, as well as through other surrounding electrical leads 130 and other components of the BGA package 100.
Shown in FIG. 6 is an electrical model of two adjacent electrical leads 230a, 230b in the conventional TSOP 200. The electrical lead 230a includes a resistance 901a, an inductance 902a, and a capacitance 903a. Similarly, the electrical lead 230b includes a resistance 901b, an inductance 902b, and a capacitance 903b. The electrical model depicted in FIG. 6 is commonly referred to as a "lumped" model, as noted above.
Referring to FIG. 6, the resistance 901a comprises the individual resistances of the bond wire 238, the internal portion 234, and the external portion 232 of electrical lead 230a. The inductance 902a comprises the individual inductances of the bond wire 238, the internal portion 234, and the external portion 232 of electrical lead 230a, and further includes mutual inductances generated between the electrical lead 230a and the adjacent electrical lead 230b, as well as between the electrical lead 230a and other components of the TSOP 200. The capacitance 903a comprises the individual capacitances of the bond wire 238, the internal portion 234, and the external portion 232 of electrical lead 230a, and further includes mutual capacitances generated between the electrical lead 230a and the adjacent electrical lead 230b, as well as between the electrical lead 230a and other components of the TSOP 200. The mutual inductances and mutual capacitances are, at least in part, dependent upon the configuration of, and the distance between, the adjacent electrical leads 230a, 230b and upon the magnitude and frequency of the electrical signals propagating through each of the adjacent electrical leads 230a, 230b, as well as through other surrounding electrical leads 230 and other components of the TSOP 200.
Similarly, the resistance 901b comprises the individual resistances of the bond wire 238, the internal portion 234, and the external portion 232 of electrical lead 230b. The inductance 902b comprises the individual inductances of the bond wire 238, the internal portion 234, and the external portion 232 of electrical lead 230b, and further includes mutual inductances generated between the electrical lead 230b and the adjacent electrical lead 230a, as well as between the electrical lead 230b and other components of the TSOP 200. The capacitance 903b comprises the individual capacitances of the bond wire 238, the internal portion 234, and the external portion 232 of electrical lead 230b, and further includes mutual capacitances generated between the electrical lead 230b and the adjacent electrical lead 230a, as well as between the electrical lead 230b and other components of the TSOP 200. Again, the mutual inductances and mutual capacitances are, at least in part, dependent upon the configuration of, and the distance between, the adjacent electrical leads 230b, 230a and upon the magnitude and frequency of the electrical signals propagating through each of the adjacent electrical leads 230b, 230a, as well as through other surrounding electrical leads 230 and other components of the TSOP 200.
Mutual coupling between the electrical leads of an integrated circuit package, and between an electrical lead and other components of the integrated circuit package, are often difficult for the integrated circuit package designer to accurately model, either by direct computation methods or by using computer-based simulation techniques. However, integrated circuit package characterization is a critical, if not essential, aspect of the integrated circuit package design process. Package designers must be able to verify that a proposed package configuration will behave electrically as intended, and that parasitic capacitances and inductances will not compromise signal integrity. Thus, in addition to modeling the electrical behavior of an integrated circuit package design using direct computation methods or computer-based simulation, it is often desirable to directly measure certain electrical characteristics—such as parasitic capacitance and inductance—of an integrated circuit package design-using measuring instruments in order to validate the electrical model.
One type of conventional measuring instrument routinely used to measure inductance and capacitance is what is often referred to as an RLC meter. There are numerous types of RLC meters commercially available from a number of manufacturers; however, most conventional RLC meters suffer from the same limitation—i.e., the inability to accurately measure inductance and capacitance at high frequencies. Conventional RLC meters have an upper frequency limit of approximately 13 MHz. As noted above, new integrated circuit packages are being designed to operate in frequency ranges of 100 MHz to 400 MHz and higher, requiring that package characterization be performed at frequencies up to 3 GHz and higher in order to obtain accurate data. Thus, for newer integrated circuit packages designed to operate at relatively high frequencies, conventional RLC meters will not provide an accurate indication of the potential for mutual coupling in an integrated circuit package during operation.
One type of measuring instrument that has demonstrated an ability to provide relatively accurate measurements of parasitic capacitances and inductances in integrated circuit packages is a vector network analyzer (VNA), which may simply be referred to as a network analyzer. Generally, a network analyzer is a two-port measuring device having the ability to send a test signal or signals to a device under test (DUT) from one port and to receive a reflected signal or signals from the DUT at the same port. The ratio of the reflected signal to the original test signal (or a ratio of the average of the reflected signals to the original test signal if multiple test signals are sent) may be used to calculate what is commonly referred to as the S11 parameter or the S22 parameter. Use of a network analyzer to measure a reflected signal or signals is often referred to as using the network analyzer in the "S11 mode." Alternatively, the network analyzer may send a test signal or signals to a DUT from one port and receive a signal or signals transmitted through the DUT at the other port. The ratio of the transmitted signal to the original test signal (or a ratio of the average of the transmitted signals to the original test signal if multiple test signals are sent) may be used to calculate what is commonly referred to as the S12 parameter or the S21 parameter. Use of a network analyzer to measure the transmitted signal or signals is often referred to as using the network analyzer in the "S12 mode." Each port of the network analyzer is adapted to both send and receive high frequency electrical signals in the 3 GHz range as well as higher frequencies. The S11, S12, S21, and S22 parameters are often referred to as "scatter" parameters.
Although traditionally used by radio frequency and transmission line designers, a network analyzer may be used to characterize integrated circuit packages. In the S11 mode, a network analyzer can be configured to send a high frequency test signal or signals to a selected lead or leads of an integrated circuit package and to measure the signal or signals reflected back from the integrated circuit package. Contact between a port of the network analyzer and a lead or leads of the integrated circuit package can be established by a test probe, such as a coaxial probe, electrically connected to the port of the network analyzer. The power exhibited by the reflected signal (or the average power of multiple reflected signals if more than one test signal is sent) received from the integrated circuit package is directly related to the impedance of the integrated circuit package and to the impedance of the network analyzer and test probe. By appropriate test setup and calibration, the impedance of the network analyzer and test probe can be removed from the measured data, such that the impedance indicated by the network analyzer is substantially that of the integrated circuit package. Also, the network analyzer may be configured to provide capacitance and inductance data for the integrated circuit package in a Smith chart format (see FIGS. 16 and 17).
Thus, a network analyzer may be used to measure the parasitic capacitances and inductances at high frequencies of one or more electrical leads of an integrated circuit package. However, though it is known in the art to use network analyzers to measure high frequency parasitics in an integrated circuit package, conventional apparatus and methods for acquiring such data utilize complex and expensive test fixtures and methods. For the integrated circuit package designer, who may need an indication of the potential for mutual coupling in a proposed package design at an intermediate phase of the design process, a relatively simple, fast, and low-cost method for measuring parasitic capacitances and inductances is preferred.
Therefore, a need exists in the art for apparatus and methods for determining the susceptibility of a proposed integrated circuit package design to mutual coupling between electrical leads, or between an electrical lead and other components of the integrated circuit device package, using a network analyzer. Such apparatus and methods must provide a relatively simple and low-cost approach to integrated circuit package characterization.

Apparatus for measuring parasitic capacitance and inductance of I/O leads on an electrical component using a network analyzer


This invention relates to a catalyst which comprises palladium metal as the main catalyst, tin metal or a mixture of tin and additional metals as the promoter, in combination with an alkali or alkaline earth metal compound, supported on the outer surface of a porous carrier. The catalyst is used in the process for producing allyl acetate through the oxacylation of propylene, acetic acid and oxygen in a vapor phase. The catalyst of the present invention exhibits high catalytic activity, high catalytic selectivity and high catalytic life, which greatly increases the economic utility of the oxacylation process.

Previously, in the production of allyl acetate through the oxacylation of propylene, acetic acid and oxygen in a vapor phase, a silica carrier impregnated with palladium only was the main catalyst, and alkali or alkaline earth metal compound was used as the activator (U.S. Pat. No. 3,925,452). In order to get better activity from this catalyst, the oxacylation should be performed at higher temperatures. Under these conditions, the formation of carbon dioxide byproduct was increased, and the space time yield (STY, the yield per hour per liter of the catalyst) of allyl acetate was unable to be promoted even by increasing the amounts of palladium or the activator. Generally, by only using palladium as the catalyst during the oxacylation process, the space time yield of allyl acetate would not exceed 60 (g/hr/l of catalyst), and the selectivity of such a catalyst to allyl acetate would only reach 87%. In other words, most of propylene reactant was burned into carbon dioxide or converted into other byproducts. Apparently, when only palladium and the activator were used as the catalyst, the catalytic ability of the catalyst was rather low, and waste resulted from the complete burning of propylene into carbon dioxide, which adversely influenced the industrial process.
In order to improve on this drawback, in the preparation process of the catalyst for oxacylation reaction, other metals were added so as to increase the activity and selectivity of the catalyst (U.S. Pat. No. 3,917,676). Therefore, most of the compositions of the catalysts were comprised of, not only palladium, the main catalyst, and alkali or alkaline earth metal, the activator, but also other metals, as the promoters. For example, along with catalysts with the combination of the main catalyst palladium and the promoters of potassium, bismuth and barium (U.S. Pat. No. 4,571,431), the combination of the main catalyst palladium and the promoters of copper, lead, ruthenium and rhenium (EP 0361484), etc. have been disclosed. Among these, a catalyst with the combination of the main catalyst palladium and the promoter copper exhibited higher activity and selectivity (U.S. Pat. No. 5,011,980).
For the purpose of high catalytic activity and high catalyst selectivity, besides the addition of other metals as the promoter in preparing the catalyst, a certain amount of water as a diluent should be added into the feeding materials of propylene, acetic acid and oxygen for performing the oxacylation reaction, in the traditional process of producing ally acetate. If moisture content was under a certain ratio, the catalytic activity and life of the catalyst could not be retained and would deteriorate rapidly. Usually, the addition of the water diluent would limit the yield of the final product. Further, the final product, allyl acetate, should be purified after the oxacylation, which would result in consuming and wasting energy of the whole process, and the economical effect could not be attained.
In the presence of the catalyst produced in this invention, while no water is added into the reactant materials for the oxacylation process, or only a small amount of water is added in accordance with the requirement of the process, not only will the catalytic activity and life of the catalyst be retained and not deteriorate, but a high catalytic activity and high selectivity will be attained. Therefore, the energy consumed and wasted resulting from the addition of water can be avoided, and the economical effect of the oxacylation process can be greatly increased.

Catalytic oxacylation vapor phase process


A headset and a method of manufacturing headsets are disclosed where a single transceiver form-factor design is utilized with a number of styles of housings. By utilizing the same transceiver with the different styles of housings, manufacturing costs are reduced while at the same time providing a wider variety of choices to the consumer.

1. Field of the Invention
The present invention relates to headsets and, more particularly, to a headset and method of manufacturing headsets that utilize a single transceiver form-factor design with a number of different housing styles.
2. Description of the Related Art
A headset is a device that, when worn by a user, positions a speaker next to the user""s ear and a microphone next to the user""s mouth. The headset, which allows hands-free operation, is commonly worn by telephone operators and is increasingly being worn by personal computer users for telephony over the internet, gaming, and speech recognition. In addition, more and more cell phone users are utilizing headsets.
FIG. 1 shows a perspective view that illustrates a prior-art headset 100. As shown in FIG. 1, headset 100 has an elongated support member 110, a speaker 112 which is connected to one end of support member 110, and a microphone 114 which is connected to the opposite end of support member 110.
Further, headset 100 has a positioning member 116 that is connected to support member 110. Positioning member 116, which is designed to be worn over the ear, has a first section that is connected to member 110, a second angled section that is connected to the first section, and an arcuate-shaped third section that is connected to the second section.
In addition to the ear-type headset shown in FIG. 1, headsets are also commonly available that use a headband to hold the support member, and thereby the speaker and microphone, in place. With a headband support member, the speaker is placed over one ear with the headband extending over and contacting the head with a padded end that the rests above the opposite ear.
Another common type of headset, sometimes referred to as soap-on-a-rope, utilizes a speaker which is placed in or next to the ear, and a microphone which is located somewhere on the wire that connects the speaker to a telephone or computer. Although this soap-on-a-rope type headset is very compact and easy to transport, the location of the microphone, which is often clipped to the user""s clothing, is susceptible to excessive background noise.
The present invention provides a method of manufacturing headsets that utilizes a single transceiver form-factor design with a number of housing styles. By utilizing a single transceiver form-factor with a number of housing styles, development costs, manufacturing costs, and time to market are reduced while at the same time providing a wider variety of choices to the consumer. In addition, after buying the first headset, the consumer can purchase additional housings without purchasing additional transceivers as the transceiver from the first headset can be used in whatever housing the consumer desires to wear.
The method of the present invention includes the step of forming a plurality of substantially identical transceivers. Each transceiver has a body, a speaker transducer connected to the body that outputs sound in response to a sound signal, and a microphone transducer connected to the body that outputs an electrical speech signal in response to input sound. The method also includes the step of forming a number of housings with different housing styles. The method further includes the step of attaching the substantially identical transceivers to the housings so that transceivers are attached to different housing styles. This, in turn, allows different headsets to be built with different outer shapes, all using the same transceiver design.
The method of the present invention may also include the steps of displaying the housing styles to a user population, and receiving an order from a user. The order identifies a style of housing selected by the user.
The method of the present invention produces a collection of headsets that include a number of first and second housings. The first and second housings each have an inner cavity. The collection of headsets also includes a number of substantially-identical transceivers. The transceivers are positioned within the inner cavity of each first housing and the inner cavity of each second housing.
A better understanding of the features and advantages of the present invention will be obtained by reference to the following detailed description and accompanying drawings that set forth an illustrative embodiment in which the principles of the invention are utilized.

Headset and method of manufacturing headsets that utilize a single transceiver form-factor design with a number of different housing styles


In a photosensitive material processing apparatus having a wash tank for washing photosensitive material with a relatively large volume of water after development, means for releasing silver cations into wash water is provided for preventing bio-slime generation in the wash tank. Silver cations can be dissolved out from a silver alloy through electrolysis or from a silver release agent. A method for preventing bio-slime from accumulating in the wash tank includes the steps of: releasing silver cations into wash water, and optionally, draining wash water from the wash tank, and forcedly drying the wash tank.

Photographic black-and-white silver halide photosensitive materials are generally processed through steps of development, fixation, and water washing. This type of processing, presents problems relating to environmental protection and water conservation.
One approach to minimizing environmental effects is to reduce the necessary amount of wash water which has been used in processing 3 to 20 liters of wash water per square meter of photosensitive film is typical. For example, counter current washing through a plurality of wash tanks is disclosed in S. R. Goldwasser, "Water flow rate in immersion-washing of motion picture film," J. SMPTE, 64, 248-253, May 1955. This technique is commonly used to reduce wash water volumes in automatic processors for photographic color film.
In automatic processors for x-ray photosensitive film, it is now common to conserve water as much as possible by opening an electromagnetic valve to supply wash water only during a processing period. If the multiple-tank counter current washing technique is applied to automatic processors for sheet photosensitive material such as x-ray photosensitive film and printing photosensitive material, a number of rollers and racks corresponding to the number of wash tanks must be utilized, adding to push the initial cost of the automatic processor beyond a commercially acceptable level and increasing the space for the installation thereof.
Therefore, most automatic processors for processing sheet black-and-white photosensitive material depend on the conventional mass water washing mode wherein the processor is equipped with a single wash tank, or primary and auxiliary wash tanks, or at most double wash tanks. In such a system at least 3 liters per square meter of the photosensitive material of wash water is replenished.
Often wash water is kept for some time in a wash tank. Then bio-slime will adhere to the tank wall within 2 or 3 weeks and the water will stagnate or rot giving off foul odors. When the automatic processor is turned off and discontinued for several days, suspended matter will appear in the water in the wash tank. Such suspended matter will eventually adhere to a photosensitive material or cause clogging of associated filters. Therefore, the wash tank must be periodically scrubbed to remove bio-slime and suspended matter. When bio-slime accumulates on a roller conveyor system which includes a number of moving components, scrubbing the rollers and racks to remove the bio-slime is a cumbersome operation.
For bio-slime control, it was a common practice to add chelating agents and biocidal agents to wash water as disclosed in L. E. West, Water Quality Criteria Phot. Sci. and Eng., Vol. 9, No. 6, 398 (1965); M. E. Beach, "Microbiological growth in Motion-Picture Processing," SMPTE Journal, Vol. 85, Mar. 1976; and R. O. Deegan, "Photoprocessing Wash Water Biocides," J. Imaging Tech., Vol. 10, No. 6, Dec. 1984. Also, Japanese Patent Application Unexamined Publication (JP-A) Nos. 8542/1982, 105145/1983, and 157244/1982 disclose the addition of various antifungal agents such as thiazolylbenzimidazoles and isothiazolones. Although the concept of adding a biocidal or fungicidal compound to wash water is helpful, the mass water washing mode, however, makes it difficult to maintain the compound at an effective concentration so as to provide biocidal and fungicidal action. In addition, some chemical agents are costly and some are toxic. No satisfactory method of bio-slime prevention has previously been achieved.

Photographic silver halide photosensitive material processing apparatus and method of preventing bio-slime generation in a wash tank thereof


Disclosed is a device for recognizing a dot pattern, including: a dot pattern recognizing unit configured to recognize a first dot pattern and a second dot pattern on a recording medium, on which a dot pattern is formed; a location information extracting unit configured to extract first location information from the first dot pattern, and extract second location information from the second dot pattern; a communication unit configured to transmit the first location information and the second location information to the content executing device; and a controller configured to control the dot pattern recognizing unit, the location information extracting unit, and the communication unit, in which the first dot pattern is a dot pattern recognized when the device is spaced apart from the recording medium, and the second dot pattern is a dot pattern recognized when the device is in contact with the recording medium.

A dot pattern has a characteristic of indicating a unique location. The unique location may be associated with specific contents or a specific function. Accordingly, interest in technology of linking a dot pattern recognizing device and contents and applying the dot pattern has increased.
In general, the dot pattern recognizing device recognizes a dot pattern, extracts location information from the recognized dot pattern, maps the extracted location information with specific contents or a specific function, and outputs the mapped contents or function. The dot pattern recognizing device has a complex configuration, and has high cost.
Accordingly, there is an attempt to insert only a function of recognizing a dot pattern and extracting location information from the recognized dot pattern into the dot pattern recognizing device. The dot pattern recognizing device transmits the extracted location information to an external device, and the external device maps the received location information with specific contents or a specific function, and outputs the mapped contents or function. The dot pattern recognizing device has a simple configuration, and has low cost, but has a problem in that a reaction rate is low.

Dot pattern recognizing device and content executing device


In a disposable absorbent garment, an absorbent structure includes liquid absorbing material comprising an upper layer comprising preferably softwood fibers and having a density from about 0.03 to about 0.14 g/cc, a lower layer comprising preferably hardwood fibers, formed substantially separately from and underlying at least a portion of the upper layer, the second layer having top and bottom surfaces, a density from about 0.14 to about 0.3 g/cc, a total void volume greater than about 80%, an average pore size distribution generally less than the average pore size distribution of the upper layer. There is an overlap in the pore size distributions of the upper and lower layers such that the smallest pores in the upper layer are smaller than the largest pores in the lower layer and front and rear fluid storage pouches, preferably spaced from one another at the front one-third and rear one-third of the absorbent structure, respectively, each pouch comprise superabsorbent material disposed in a hydrophilic web. The spaced fluid storage pouches are preferably located underlying the bottom surface of the lower layer so that the absorbent structure is substantially free of superabsorbent material in the middle one-third thereof.

This invention relates to an absorbent structure such as may be used in a disposable diaper, which is an improvement upon U.S. Pat. No. 4,699,619 issued Oct. 13, 1987, to Bernardin, upon which prior published British Application No. 2,165,757A and European Application No. 0158914 are based.
Disposable diapers generally include an inner, liquid permeable liner that lies closest to the wearer's skin. An outer, liquid impermeable cover is disposed at the outside of the diaper, furthest away from the wearer. In between the liner and the cover is a fibrous liquid absorbent material or batt.
In general, the most economical liquid absorbent material for use in disposable diapers is cellulosic fibers such as comminuted wood pulp, commonly known in the art as "fluff pulp," or simply "fluff." Batts made from these fibers have a low density and a high capacity for absorbing fluids, but their wicking ability is very poor. Thus, the low central crotch portion of the diaper as worn tends to become very wet when waste fluids are released thereupon, while the fluff included in the higher portions of the diaper (as worn) can remain dry with its absorbent capacity unused.
Several problems are posed by this. First, it is uneconomical to line a diaper with fluff, the majority of which will be wasted. Further, there can be leakage from the liquid saturated central portion of the diaper. Still further, this concentration of liquid localized in one region of the diaper can cause discomfort to the wearer of the diaper.
One prior art approach noted by Sigl in U.S. Pat. No. 4,213,459 to avoid some of these problems is to decrease the pore size such that the improved capillary action of the pores overcomes the force of gravity sufficiently to cause the waste liquid to move upwardly in the diaper. However, it has been noted that the total absorption capacity is reduced by reducing the average pore size. Nevertheless, the use of this approach to achieve a better distribution of fluid throughout the available area in the diaper has generally been the approach of choice despite the resulting loss in absorption capacity.
A further step was taken towards the solution of these problems by Sigl (in U.S. Pat. No. 4,213,459, assigned to the assignee of the present invention). Sigl discloses providing a localized area of increased density fluff in the batt for wicking waste fluid to a higher portion of the diaper. Although this presented an advance in the art, it was not without drawbacks. First, the surface of the diaper nearest the wearer's skin directly beneath the lining becomes soaked. Further, the only places where liquid could be transferred from the lower density material to the higher density material were at the borders or edges where the lower density material adjoins the higher density material. Thus, it was suggested in that patent that the areas around the densified region of the batt should remain undensified.
Prior published British patent applications Nos. 2,132,897 and 2,063,683 of Colgate-Palmolive each disclose diapers having multi-layered absorbent pads. The 2,132,897 reference disclosed spaced, lengthwise strips of hydrogel, coated upon and sandwiched between the surfaces of the pads.
Likewise, prior published British Patent Application Nos. 2,061,115, 2,089,214 and 2,111,836 of the instant assignee all disclose sanitary napkins having multi-layered absorbent pads.
Prior published British Patent Application Nos. 2,175,024A and 2,175,212A of Procter & Gamble also disclose absorbent articles which either have a concentration of superabsorbent material in the back face half of a single pad or a discrete superabsorbent treated core underlying a top pad in the front of a diaper wherein urine is immediately excreted.
The prior art does not recognize that fluid can be distributed to remote areas of a diaper and retained remote from the crotch area of a wearer, as well as being retained in the immediate urination target zone.
The present invention provides a further advancement in the art, as will be fully explained below.

Absorbent structure designed for absorbing body fluids


Methods and associated structures of forming a microelectronic device are described. Those methods may comprise forming a channel region on a substrate, wherein the channel region comprises at least one CNT, forming at least one source/drain region adjacent the channel region, and then forming a gate electrode on the channel region, wherein a width of the gate electrode comprises about 50 percent to about 90 percent of a width of the contact region.

Scaling of silicon technology continues while researchers investigate alternative novel materials for future technology generations beyond year 2015. Carbon nanotubes (CNTs) with their excellent carrier mobility are a potential candidate. CNT's have been evaluated for use as field effect transistors (FETs), and may have applications for fast switch devices. Optimization of architectural design and structural features will be necessary for providing the highest performing devices required for high performance circuit operation.

Methods of forming carbon nanotube transistors for high speed circuit operation and structures formed thereby


An electronic apparatus having an input device is disclosed. The input device is capable of reducing the sound generated when an operation-input part returns to its original position after being pressed. The input device includes a base plate having a hook standing towards the operation-input part. The operation-input part has an arm member that can come into contact with the hook. A contact of the arm member with the hook specifies an ascending limit of the operation-input part, and at least one of the arm member and the hook has elasticity in their contacting direction to reduce rebound sound.

1. Technical Field
The present invention relates to electronic apparatuses in general, and particularly to an electronic apparatus having an input device for receiving an input operation.
2. Description of Related Art
In addition to a keyboard device, a laptop personal computer (laptop PC) is typically provided with various input devices, such as a touch pad and a pointing device, as an alternative to a mouse. A touch pad enables the manipulation of a cursor displayed on a display device in response to a touch operation thereto with a fingertip or a pen tip.
A touch pad is commonly provided with a member to specify the ascending limit (position) of the touch pad. When the pressed touch pad returns to the original position, the touch pad comes into contact with such a member to specify the ascending limit, which usually emits a rebound sound. It would be desirable to reduce such rebound sound that is generated when a touch pad comes into contact with a member to specify the ascending limit.

Touch pad for a portable electronic apparatus


The invention discloses a method of for changing the water permeability of a subterranean formation of a well, the method comprising: providing a fluid comprising a liquid carrier and a viscoelastic surfactant; introducing the fluid into the well; and contacting the fluid and the subterranean formation wherein the action of the liquid carrier and the viscoelastic surfactant is able to change the water permeability of the subterranean formation. The fluid may further comprise methanol, or a salt which can be embodied within the carrier fluid. Advantageously, no further RPM polymer is used. In a first aspect the method is used for reducing the amount of water produced, in as second aspect for improving the oil recovery.

The statements in this section merely provide background information related to the present disclosure and may not constitute prior art.
Most mature sandstone reservoirs produce crude oil along with an increasing volume of water. The percentage of water is defined as the Water Oil Ratio (WOR) for a given well. The water may either be what is known as good water, which displaces the crude oil out of the reservoir or bad water which is produced without contributing to the production of crude. Bad water is often the result of water invading the reservoir and communicating with the wellbore through permeable channels/fissures etc. As the water usually has a much lower viscosity than the crude oil at reservoir conditions, the effective permeability of the formation to water is much higher than to crude, which tends to result in more water than crude being produced once the water is in direct communication with the wellbore. Bad water production generally increases with time, as the water invades more of the reservoir and after stimulation treatments. The treatment either selectively stimulates the intervals with water due to differences in relative permeability (in the case of matrix treatment), or due to increased communication with the water bearing intervals in the case of a hydraulic fracturing.
In some cases it may be possible to decrease the production of water using a chemical or more commonly a polymer which provides a disproportionate permeability reduction with respect to water. These polymers are more commonly known as Relatively Permeability Modifiers (RPM) and decrease the effective permeability of the reservoir to water without decreasing the effective permeability to crude. An RPM is usually a low viscosity polymer which when injected into the matrix a) is highly charged and adheres to the surfaces in the pore spaces, and b) through a number of different mechanisms, such as swelling in the presence of water, reduces the size of the pore throats and hence the relative permeability of the matrix to water. The success of an RPM treatment depends among other things on distance from the sandface that the RPM can be placed; the greater the distance, the longer the effect of the RPM will last. RPMs have been used to treat both stimulated and un-stimulated reservoirs. In the case of stimulated reservoirs, RPMs have been included as part of both matrix and hydraulic fracturing treatments.

Disproportionate permeability reduction using a viscoelastic surfactant


A device receives information associated with a job implemented in a network, calculates a statistic based on the information associated with the job, calculates a score for the statistic, calculates health check information based on the information associated with the job, receives information associated with an executing job, and provides for display the calculated statistic, the statistic score, the calculated health check information, and a snapshot of the information associated with the executing job.

Daily monitoring and maintenance of one or more networks, devices (e.g., servers, clients, routers, cluster nodes, drives, circuits, etc.) associated with the networks, and applications executing on the network devices are challenging tasks. For example, health checks may be regularly performed to ensure availability of network databases (e.g., by checking that cluster services are started and executing), to check that cluster nodes, and drives are configured and available, etc. Proactive maintenance of storage for network devices may be conducted by cleaning up old backup files, shrinking databases, providing backup plans for databases, providing regular backups of databases on a periodic basis, etc.
Monitoring and maintenance challenges may be further complicated if users (e.g., network administrators, network engineers, network technicians, etc.) responsible for maintaining the one or more networks are in different locations. For example, hardware issues or outages may occur at a location closer to an off-duty user (e.g., during off hours), but may be discovered by an on-duty user (e.g., during working hours) at another location. The on-duty user may need to wait for the off-duty user to resume work before the hardware issues or outages may be resolved.
Jobs may be generated (e.g., by a job or issue tracking system) to address issues in the one or more networks. However, not all users responsible for maintaining the one or more networks have access to view jobs or statuses of jobs. Such users may view the statuses of jobs by accessing logs or log files (e.g., files that list actions, such as requests made to a server, that have occurred in the one or more networks). Immediate and quick actions need to be taken on any abnormalities in jobs, and accessing logs is too time consuming and inefficient for such quick reactions. Furthermore, accessing logs does not permit such users to detect all job failures and data inconsistencies.


A method of separating a mixture of acoustic signals from a plurality of sources comprises: providing pressure signals indicative of time-varying acoustic pressure in the mixture; defining a series of time windows; and for each time window: a) providing from the pressure signals a series of sample values of measured directional pressure gradient; b) identifying different frequency components of the pressure signals c) for each frequency component defining an associated direction; and d) from the frequency components and their associated directions generating a separated signal for one of the sources.

The separation of convolutive mixtures aims to estimate the individual sound signals in the presence of other such signals in reverberant environments. As sound mixtures are almost always convolutive in enclosures, their separation is a useful pre-processing stage for speech recognition and speaker identification problems. Other direct application areas also exist such as in hearing aids, teleconferencing, multichannel audio and acoustical surveillance. Several techniques have been proposed before for the separation of convolutive mixtures, which can be grouped into three different categories: stochastic, adaptive and deterministic.
Stochastic methods, such as the independent component analysis (ICA), are based on a separation criterion that assumes the statistical independence of the source signals. ICA was originally proposed for instantaneous mixtures. It is applied in the frequency domain for convolutive mixtures, as the convolution corresponds to multiplication in the frequency domain. Although faster implementations exist such as the FastICA, stochastic methods are usually computationally expensive due to the several iterations required for the computation of the demixing filters. Furthermore, frequency domain ICA-based techniques suffer from the scaling and permutation issues resulting from the independent application of the separation algorithms in each frequency bin.
The second group of methods are based on adaptive algorithms that optimize a multichannel filter structure according to the signal properties. Depending on the type of the microphone array used, adaptive beamforming (ABF) utilizes spatial selectivity to improve the capture of the target source while suppressing the interferences from other sources. These adaptive algorithms are similar to stochastic methods in the sense that they both depend on the properties of the signals to reach a solution. It has been shown that the frequency domain adaptive beamforming is equivalent to the frequency domain blind source separation (BSS). These algorithms need to adaptively converge to a solution which may be suboptimal. They also need to tackle with all the targets and interferences jointly. Furthermore, the null beamforming applied for the interference signal is not very effective under reverberant conditions due to the reflections, creating an upper bound for the performance of the BSS.
Deterministic methods, on the other hand, do not make any assumptions about the source signals and depend solely on the deterministic aspects of the problem such as the source directions and the multipath characteristics of the reverberant environment. Although there have been efforts to exploit direction-of-arrival (DOA) information and the channel characteristics for solving the permutation problem, these were used in an indirect way, merely to assist the actual separation algorithm, which was usually stochastic or adaptive.
A deterministic approach that leads to a closed-form solution is very desirable from the computational point of view. However, no such method with satisfactory performance has been proposed so far. There are two reasons for this. Firstly, the knowledge of the source directions is not sufficient for good separation, because without adaptive algorithms, the source directions can be exploited only by simple delay-and-sum beamformers. However, due to the limited number of microphones in an array, the spatial selectivity of such beamformers is not sufficient to perform well under reverberant conditions. Secondly, the multipath characteristics of the environment can not be found with sufficient accuracy while using non-coincident arrays, as the channel characteristics are different at each sensor position which in turn makes it difficult to determine the room responses from the mixtures.
Almost all of the source separation methods employ non-coincident microphone arrays to the extent that the existence of such an array geometry is an inherent assumption by default in the formulation of the problem. The use of a coincident microphone array was previously proposed to exploit the directivities of two closely positioned directional microphones (J. M. Sanchis and J. J. Rieta, "Computational Cost Reduction using coincident boundary microphones for convolutive blind signal separation"Electronics Lett., vol. 41, no. 6 pp. 374-376 March 2005). However, the construction of the solution disregarded the fact that the reflections are weighted with different directivity factors according to their arrival directions for two directional microphones pointing at different angles. Therefore, the method was, in fact, not suitable for convolutive mixtures. In literature, coincident microphone arrays have been investigated mostly for intensity vector calculations and sound source localization (H. E. de Bree, W. F. Druyvesteyn, E. Berenschot, and M. Elwenspoek, "Three dimensional sound intensity measurements using Microflown particle velocity sensors", in Proc. 12th IEEE Int. Conf. on Micro Electro Mech. Syst., Orlando, Fla., USA, January 1999, pp. 124-129; J. Merimaa and V. Pulkki, "Spatial impulse response rendering I: Analysis and synthesis," J. Audio Eng. Soc., vol. 53, no. 12, pp. 1115-1127, December 2005; B. Gunel, H. Hacihabiboglu, and A. M. Kondoz, "Wavelet-packet based passive analysis of sound fields using a coincident microphone array," Appl. Acoust., vol. 68, no. 7, pp. 778-796, July 2007).


A transmitter that can reduce noise without using an SAW filter whose IC integration is hard, and copes with two modulation formats of constant envelope modulation and non-constant envelope modulation, and a downsized and low-cost wireless communication apparatus that uses the transmitter are provided. The transmitter includes a quadrature modulator that modulates an input signal by quadrature modulation, a first amplifier that amplifies a modulation signal outputted by the quadrature modulator, and a second amplifier that amplifies an output signal of the first amplifier. The first amplifier operates as a limiter when the modulation format is the constant envelope modulation, and performs linear operation when the modulation format is the non-constant envelope modulation.

Wireless communication has increased explosively in the number of subscribers centering around a voice service during the last ten years. An example of such a communication system includes a GSM (Global System for Mobile Communications). On the other hand, in recent years, the needs for high speed data communication as well as the voice service have been increasing. Also in the GSM, a method that uses conventional GMSK (Gaussian Minimum Shift Keying) modulation which is constant envelope modulation is being scheduled to shift to an EDGE (Enhanced Data for Global Evolution) method that uses 8-level PSK (Phase Shift Keying) modulation which is multi-level modulation and non-constant envelope modulation. An apparatus that copes with this EDGE method must be a dual mode apparatus that copes with two methods of a conventional GSM method (constant envelope GMSK modulation) and an EDGE method (non-constant envelope 8-level PSK modulation).
An example of a transmitter that can cope with two modulation formats of these constant envelope modulation and non-constant envelope modulation is disclosed in a Patent document 1.
[Patent Document 1] JP-A No. 193430/1995

Transmitter and wireless communication apparatus using same