An oxidative composition for the removal of natural and/or synthetic color from keratinaceous fibers may include a pellet or tablet that when added to a sufficient quantity of a peroxide developer solution readily disperses. The composition may include a gas generating agent to facilitate breakdown and dispersion of the pellet or tablet. The composition added to the developer may be agitated to forms homogeneous cream-like mixture for application to keratinaceous fibers.

The bleaching of human keratinaceous fibers, particularly human hair, is accomplished by oxidative degradation of the melanin pigment in hair. This is generally accomplished by application of a two-component mixture in which the first component is an alkaline mixture containing a persulfate and the second component is an aqueous developer solution of hydrogen peroxide. The first component is an oxidative composition and generally includes one or more peroxygenated ingredients such as ammonium, sodium or potassium persulfates, perborates or percarbonates. At the time of use, the first component is combined with the second component and the mixture is subsequently agitated, usually using an application tool such as a brush, to form a cream-like fluid or slurry suitable for application to hair. This bleach mixture is then allowed to remain on the hair for a specified process time, which generally does not exceed 60 minutes. The hair is then rinsed with potable water and may be shampooed or subjected to further processing, such as coloring.
The first component is typically provided as a powdered mixture. Powdered mixtures of oxidizers, alkalis and other ingredients, however, are irritants to the respiratory system. When working with these powders, a portion of the powder particulates inevitably becomes airborne, risking aspiration of the irritant ingredients. These airborne particulates pose a potential hazard to individuals in proximity. Several compositions have addressed this issue by adding mineral oil or nonreactive oils, esters or similar fluids which coat or agglomerate the particles, thereby limiting the generation of airborne particulates during normal handling. U.S. Pat. No. 9,248,080 B2 describes a process whereby an oxidative composition is formed into a pellet or tablet by a compression process. Such dedusting processes are relatively effective in controlling airborne particulates. However, while compressing the oxidizer component may reduce airborne particulates, it may also create a number of issues unique to the compressed form.

Oxidative hair color remover in tablet or pellet form


The present disclosure is directed to intravascular devices, systems, and methods having a core wire with multiple flattened sections. In one aspect, a sensing guide wire is provided. The guide wire includes a first flexible elongate member; a sensing element positioned at a distal portion of the first flexible elongate member; and a second flexible elongate member coupled to the first flexible elongate member such that the second flexible elongate member extends distally from the first flexible elongate member; and wherein a distal portion of the first flexible elongate member includes at least two flattened sections, and wherein the first and second flexible elongate members are coupled along a portion of one of the at least two flattened sections. In other aspects, methods of forming a sensing guide wire are provided.

Heart disease is very serious and often requires emergency operations to save lives. A main cause of heart disease is the accumulation of plaque inside the blood vessels, which eventually occludes the blood vessels. Common treatment options available to open up the occluded vessel include balloon angioplasty, rotational atherectomy, and intravascular stents. Traditionally, surgeons have relied on X-ray fluoroscopic images that are planar images showing the external shape of the silhouette of the lumen of blood vessels to guide treatment. Unfortunately, with X-ray fluoroscopic images, there is a great deal of uncertainty about the exact extent and orientation of the stenosis responsible for the occlusion, making it difficult to find the exact location of the stenosis. In addition, though it is known that restenosis can occur at the same place, it is difficult to check the condition inside the vessels after surgery with X-ray.
A currently accepted technique for assessing the severity of a stenosis in a blood vessel, including ischemia causing lesions, is fractional flow reserve (FFR). FFR is a calculation of the ratio of a distal pressure measurement (taken on the distal side of the stenosis) relative to a proximal pressure measurement (taken on the proximal side of the stenosis). FFR provides an index of stenosis severity that allows determination as to whether the blockage limits blood flow within the vessel to an extent that treatment is required. The normal value of FFR in a healthy vessel is 1.00, while values less than about 0.80 are generally deemed significant and require treatment.
Often intravascular catheters and guide wires are utilized to measure the pressure within the blood vessel, visualize the inner lumen of the blood vessel, and/or otherwise obtain data related to the blood vessel. Guide wires can include pressure sensors, imaging elements, and/or other electronic, optical, or electro-optical components to obtain such data. A core member generally extends along the length of the guide wire. The one or more components are disposed near the distal portion of the core member. The core member is generally formed of elastic and durable material, which allows the guide wire to traverse the tortuous anatomy, such as a patient's blood vessels. However, the elastic and durable characteristics of the core member also make it difficult for a user to shape the distal tip of the guide wire. It can be important for the distal tip of the guide wire to be shapeable so that the guide wire can be steered through tortuous anatomy.
Conventionally, the distal tip of the guide wire has been formed by attaching a shapeable ribbon to the distal end of the core member. The ribbon is generally tack soldered to the core member. A problem with existing distal tips is that the transition at the tack solder location is not smooth. For example, during use, the tack solder location is a kink point at which the ribbon folds over onto the core member. Such behavior by the distal tip obviates the benefits gained from combining the shapeable ribbon with the durable core member.
Accordingly, there remains a need for improved intravascular devices, systems, and methods that include smooth transition between two components at a distal tip.

Intravascular devices, systems, and methods having a core wire with multiple flattened sections

PHILIPS IMAGE GUIDED THERAPY CORPORATION


Embodiments of the invention describe systems, apparatuses and methods that enable sharing Remote Direct Memory Access (RDMA) device hardware between a host and a peripheral device including a CPU and memory complex (alternatively referred to herein as a processor add-in card). Embodiments of the invention utilize interconnect hardware such as Peripheral Component Interconnect express (PCIe) hardware for peer-to-peer data transfers between processor add-in cards and RDMA devices. A host system may include modules or logic to map memory and registers to and/or from the RDMA device, thereby enabling I/O to be performed directly to and from user-mode applications on the processor add-in card, concurrently with host system I/O operations.

Computing systems include various devices connected to one another via an interconnectivity fabric such as a network or bus structure. These devices typically contain local memory, and multiple devices are operated in parallel to provide processing speed and flexibility within the computing environment.
Remote Direct Memory Access (RDMA) is a network interface card (NIC) feature that enables a computing device to access information in a memory of another computing device. Specifically, via RDMA technology, the computing device may read information from the memory of another computing device, as well as write information to the memory of another computing device, without involvement of a host operating system (OS).
FIG. 1 illustrates a prior art system including a peripheral device having a CPU and memory complex. System 100 includes system CPU 110, system memory 120, peripheral device controller 130, peripheral device 140 and RDMA device 150. Peripheral device 140 includes processor 141 and memory 142. Peripheral device 140 and RDMA device 150 may be referred to as "peer" devices.
Peripheral device 140 may need to access data that is stored in RDMA device 150, and vice versa. Presently, implementations of many interconnectivity fabric standards such as InfiniBand specifications or RDMA Consortium specifications and the like do not enable a peer device to be able to directly access data stored in another peer device's address space.
Current solutions require peer devices to write requested data to a commonly available memory—in this illustration, system memory 120, which is accessible by any peripheral device connected to the interconnectivity fabric; however, using common system memory for such data transfers is time consuming and increases overhead processing. Furthermore, the use of common system memory slows processing operations of the peripheral devices.
Descriptions of certain details and implementations follow, including a description of the figures, which may depict some or all of the embodiments described below, as well as discussing other potential embodiments or implementations of the inventive concepts presented herein. An overview of embodiments of the invention is provided below, followed by a more detailed description with reference to the drawings.

Direct I/O access for system co-processors


A fluid priming pump in combination with a reed valve for the control of incoming and exiting fluid flow is disclosed. The fluid priming pump includes a pump body and a movable plunger with the reed valve positioned adjacent the pump body. Two embodiments of the reed valve are disclosed, including an integral design where the unitary valve panel is insert molded with the valve body. In the second embodiment, the unitary reed valve is based on co-injection molding technology. Each reed valve design comprises only two component parts and becomes operable without the need for any additional mechanical components or fasteners. Pressure forces created by the fluid priming pump govern the opening and closing of valve panel portions for controlling the incoming and exiting fluid flow through the fluid priming pump.

The present invention relates in general to priming pumps that are part of fluid systems constructed and arranged to draw in fluid from a supply and deliver the fluid to a downstream site. More specifically, the present invention relates to the use of a valve arrangement to manage and control the flow of fluid through the priming pump. The valve arrangement of the present invention includes a first valving portion on the intake side of the priming pump and a second and cooperating valving portion on the outlet (i.e., delivery) side of the priming pump.
While the present invention is disclosed in the context of a priming pump, some earlier valve designs are used for related fluid pumps, such as the valve plate assembly disclosed in U.S. Pat. No. 4,776,776, issued Oct. 11, 1988 to Jones. The '776 patent is directed to a valve plate assembly for use in small reciprocating piston pumps such as small air compressors used for medical purposes. The '776 patent also includes a background description that covers some of the earlier valve designs and some of the problems associated with those earlier valve designs. For example, one of these earlier valve designs is described in the '776 patent as including a valve plate containing inlet and outlet ports that is mechanically clamped between a cylinder and a cylinder head. As described, valve reeds are riveted or otherwise attached to opposite sides of the valve plate to form check valves which allow air to flow through the inlet port into the cylinder during intake or suction stroke of the piston and to flow through the outlet port during the compression stroke.
As described in the '776 patent, problems are often encountered during manufacture of compressors having reed valves. The prior art valve plate assemblies are relatively expensive to manufacture and tend to leak, which as a consequence reduces the output from the compressor. The metal valve reeds are subject to bending during assembly handling. Therefore, it is necessary to test each compressor after it is assembled and it often is necessary to partially dismantle a newly manufactured compressor to replace a faulty valve plate assembly.
Further, the '776 patent describes the prior art as disclosing valve plate assemblies in which a flat resilient member is clamped over ports. Circular or somewhat parabolic-shaped flaps are cut in the resilient member to form valves attached to the member by resilient hinges. The valves are positioned to cover the ports. This arrangement eliminates some of the problems with reed valves. However, closing of the valve flaps is limited by the limited force exerted by the resilient hinge. Also, additional components, such as a second rigid plate, are required to form both intake and exhaust valves.
The '776 invention is described as being directed to a valve plate assembly for use in small reciprocating piston fluid pumps such as low capacity air compressors. The assembly has a valve plate similar to the prior art valve plate having openings which define inlet and outlet ports. A rubber valve molding is wrapped around the edge of the valve plate to form a seal between the valve plate and the cylinder head. The valve molding has an integral first flap which covers the inlet port opening only on the cylinder side of the valve plate to form an intake check valve and has an integral second flap which covers the outlet port opening only on the cylinder head side of the valve plate to form an outlet check valve.
Another reference of interest for its description of a reed valve assembly is U.S. Pat. No. 4,437,490, issued Mar. 30, 1984 to Demers, et al. The disclosed reed valve assembly includes a reed sandwiched between two base members, such as a valve plate and a cylinder head of a compressor. The reed is clamped between the two members at a central part whereby both free ends of the reed can flex. The base members are so structured that one free end of the reed forms an intake valve member and the other a discharge valve member, whereby a single reed serves both as an intake valve member and as a discharge valve member. The Demers, et al. structure is noticeably different from the present invention in that the single reed must be clamped between two separate components and those two separate components must in turn be joined together by the use of threaded fasteners. Not only is there added size and cost with the Demers, et al. design, but there is the potential for the clamping force to weaken and the reed to loosen or shift position. The integrally molded combination of the present invention and the unitarily molded design of the second embodiment offer improvements to the Demers, et al. design.
While there are other earlier patent references that disclose pump designs and other earlier patent references that disclose cooperating valve assemblies, the '776 and '490 patents should provide a good, basic understanding of how fluid pump valves can be constructed and assembled and how they function.
Since the present invention is disclosed in the context of a priming pump, it should be noted that the priming pumps used today as part of fluid systems employ several different schemes of controlling pump valve action. Each of these different schemes typically require several components to accomplish the task of controlling the valve action at the fluid inlet and the valve action at the fluid outlet (i.e., discharge). As an improvement to these more complicated designs, the present invention focuses on simplicity and a minimal number of parts. As will be described in greater detail, the present invention is configured with a reed valve molded into a carrier device or substrate, without the use of any additional components, connecting hardware, etc. The present invention does not involve any mechanical components, fasteners, or devices to secure the reed valve and valve body or substrate together. The assembled state is achieved by the molding process. The valving system of the present invention works on the pump actions that draw fluid through one valve portion and exhausts it out through the other valve portion. The concept of having no additional parts makes the design of the present invention smaller, more efficient and less expensive compared to other designs in terms of component part reduction and labor cost.


Computer-implemented methods, computer program products and computer systems for facilitating a customer's online purchase of school supplies listed on one or more generic teacher school supply lists using an online store's website. The computer-implemented methods, computer program products and computer systems provide a user access to select one or more teacher's generic school supply lists from a plethora of generic school supply lists. Online retailer's products are indexed against items on the teacher's generic school supply list so that after user selection of a particular teacher's generic school list, the user is provided with one or more graphical user interfaces identifying all matching items of the retailer for a given teacher's school supply list. The customer is presented with one or more graphical user interfaces that allow the user to purchase the matching items. UPC codes can be used to index a retailer's product to a corresponding item on a teacher's generic school supply list.

Online shopping has become a more commonly used technological process by which individuals acquire products and/or services that individuals use and/or need in their daily lives. Brick and mortar retailers have recognized the need to provide online shopping websites that allow their customers to purchase goods over the Internet. It is important to the viability of an online retailer's business that the online shopping experience for customers is easy, informative, quick, productive and ultimately successful. To that end, online retailers have developed online shopping sites that allow customers to purchase goods over the Internet.
For example, in the area of school supplies, one or more retailers have developed one or more web sites that teachers can use to create a web generated teacher school supply list that can be shared with the parents of their students. However, previously developed sites that allow a teacher to create a web generated teacher school supply list place an undue burden on teachers. Specifically, such sites require the teachers to browse a retailer's online web site and select specific products offered by the retailer and upon a teacher's selection of a specific product, the product is added to create a web generated teacher school supply list. This time consuming process is believed to have created a significant obstacle to teachers using retailer sites of this kind to create a web generated teacher school supply list. Further, such web generated teacher school supply lists are tied to a single retailer significantly limiting a parent's purchasing options.
The discussion above is merely provided for general background information and is not intended to be used as an aid in determining the scope of the claimed subject matter. The claimed subject matter is not limited to implementations that solve any or all disadvantages noted in the background.

Method and system for online shopping for school supplies based on generic lists provided by teachers for searching and selection by users


A device for lifting and transporting a patient from a bed includes a base frame with ground wheels for rolling across the ground. The frame includes two parallel horizontal rails with each rail having a main fixed center wheel and castor wheels at forward and rearward ends of the rail. A post mounted on the frame can move vertically and carries a push bar. A seat is mounted on the post on a U-shape frame with the seat including a base and a back rest portion. The base is pivotally mounted on one leg of the U-shape member and the back rest can pivot and slide relative to the other leg of the U-shape. The U-shape support is mounted on the post so as to swivel about a vertical axis with the vertical axis also translating relative to the post to move the center of gravity of the patient from an initial lifting position to a transport position.

This invention relates to a device for lifting and transporting bed ridden patients which is operable to move the patient from the lying position within the bed to a seated position in which the patient can be transported for toileting or transferring to a chair.
Many different devices have been proposed for transferring patients from the bed situation to a seating position for toileting or transfer to a chair and one example is shown in U.S. Pat. No. 4,856,123 of Henderson. In this device there is provided a base frame on which the device can roll across the floor with a single vertical post on which a patient support assembly can be raised and lowered. The patient support assembly includes a seat back portion and a seat bottom portion which are relatively hinged and moveable from a first horizontal position to an inclined seating position.
The device is somewhat difficult to push and maneuver due to the general configuration of the arrangement and due to the relatively large size necessary for the base to maintain stability of the patient over the base.
Presently available on the marketplace are also different designs of lifting device but in most cases these comprise effectively a crane arrangement with an overhead boom on which is suspended a sling of a fabric material. These arrangements are disadvantageous in that the patient is effectively suspended and hence feel insecure due to the relatively large amount of movement which can occur by pivotal action about the end of the boom. The use of the sling which is necessary for lifting a patient in this way can cause squeezing or compression of the patient as the fabric wraps around the patient and the forces are applied to the sides of the patient. This can be uncomfortable or painful for arthritic patients or patients with damaged bone structures. Furthermore the overhead boom and the pivotal action require a very large and widely spaced base frame to maintain stability. The large base significantly reduces maneuverability and hence the large base is difficult to enter limited areas and since it is difficult to rotate the large base due to the wide spacing of the wheels.
Other devices for transferring a patient from a lying position to its seated position comprise effectively collapsible wheelchairs but these have achieved little success in the marketplace due to their complexity and due to the fact that they require the patient to be rotated on the bed to a position transverse to the bed before the device can be moved into position. This type of movement is very difficult in comparison with the arrangement in which the patient is simply rolled side to side.

Lifting and transportation device for bed ridden patients

Canadian Aging & Rehabilitation Product Development Corporation


Local bit lines (LBL) are respectively provided for a plurality of sectors, corresponding to each of the global bit lines (GBL). Sector select transistors connect a LBL to a GBLector select lines control the on/off state of the sector select transistors for the corresponding sectors. A plurality of word lines (WL) intersect the local bit lines. Memory cells are located at the intersections between the LBL and the WL. Each memory cell connects a source line with the corresponding LBL and includes an n-channel transistor that is turned on/off by the corresponding WL. A precharge voltage is applied to a charging line. Charging transistors connect the LBL to the charging line. A charging gate line controls the on/off state of the charging transistors.

To achieve a larger memory capacity in a smaller chip area, some NOR type non-volatile semiconductor memory devices have a hierarchical bit line structure in which a plurality of local bit lines are connected to each of global bit lines. Described below is the working mechanism of a typical conventional n-channel floating gate type flash memory with a bit line hierarchy.
To write data, 5V, 0V, and 9V are applied to the local bit line (drain), source line, and word line (gate) for the selected cell. Electrons accelerated between the source and the drain are injected into the floating gate to cause a negative voltage, thereby decreasing the effective gate voltage applied to the gate (control gate). This increases the required gate voltage for inducing an inversion layer at the channel surface, leading to an increased threshold voltage of the memory transistor.
To erase data, the local bit line and the source line are brought into a floating state, and 9V and −9V are applied to the p-type well containing the memory transistor and the word line (gate), respectively. The negative voltage is removed as the electrons stored in the floating gate are extracted into the substrate. The threshold voltage of the memory transistor decreases, and becomes lower than that in the state when electrons were stored.
To read data, 0.9V, 0V, and 5V are applied to the local bit line (drain), source line, and word line (gate) for the selected cell. No electric current flows when the memory transistor is in written state, and a current flows when it is in erased state.
High-voltage transistors are used in the bit line control circuit since application of a voltage of 5 V to the local bit line is required to write data. Accordingly, the bit line control circuit occupies a relatively large area in the chip, restricting the reduction in chip size. To read data, on the other hand, 0.9 V is applied to the local bit line. The high-voltage transistors in the bit line control circuit are driven at a relatively low voltage, making it difficult to increase the data read speed.
High-voltage transistors are commonly used in column decoders (for instance, see Japanese Patent No. 4317745, Japanese Unexamined Patent Publication (Kokai) No. HEI-5-243531).
In a p-channel floating gate type flash memory, the drain of the memory transistor in a non-selected memory cell is in a floating state during a write process. Unexpected data writing (program disturbance) can take place if the electric potential in the drain in a non-selected memory cell comes closer to the drain voltage of the selected memory cell due to capacitive coupling with the substrate (for instance, see Japanese Unexamined Patent Publication (Kokai) No. 2008-192254).

Non-volatile semiconductor memory with bit line hierarchy


A holder includes a double ended needle supporting insert translatable within a cylinder for receiving a blood collection tube during a medical procedure. Upon translation of the insert posteriorly, the double ended needle becomes fully enclosed within the cylinder and the insert is locked in place to shield the double ended needle from contact by medical personnel. An adapter fits within the insert to accommodate pediatric tubes.

1. Field of the Invention
The present invention relates to a guard for blood collection needles and, more particularly, to a holder for a double ended needle axially translatable within a guard to protectively enclose the needle after use.
2. Description of the Prior Art
A needle shield which must be removed anteriorly from the hub of a double ended needle before the needle can be used for a blood collection procedure is well known. Remounting such a shield requires a user to insert the point of the needle into the open end of the shield and draw the shield posteriorly over the needle until the needle is fully enclosed and the shield lodged in place. Such a removable needle shield contains several limitations, including: (1) after blood has been drawn, medical personnel may occasionally delay capping of the needle with the shield, which delay creates a possibility of accidental contact with blood upon the needle, dripping blood or accidental puncture; (2) in order to recover the used needle, it is necessary to replace the shield over the pointed end of the needle, which replacement increases the risk to medical personnel of accidentally puncturing themselves; and (3) if a needle has been accidentally bent during a blood collection procedure or if the shield is replaced over the needle at an incorrect angle, the needle point may inadvertently pierce the side of the shield and puncture the fingers or hand.
In order to avoid problems attendant needle shields which must be remounted posteriorly from a location anterior of the needle point, various devices have been developed. A sleeve can be translatably mounted upon the barrel of a hypodermic syringe along with a locking arrangement to lock the sleeve in place upon anterior translation to enclose the needle within the sleeve. In another device, a single ended needle can be enclosed by drawing the barrel of an attached syringe posteriorly to draw the needle into a shield; for double ended needles, the collection tube, penetrably engaged with the posterior needle, is drawn posteriorly to locate the anterior needle within the shield. Various other known other devices also exist but each of them suffers from various impediments, including functional efficiency, manipulative ease under medical emergencies, structural integrity or cost.

Holder for double ended blood collection retractable needle


A magnetic field sensor includes a magnetic sense element and a shield structure formed on a substrate. The shield structure fully encircles the magnetic sense element for suppressing stray magnetic fields along a first axis and a second axis, both of which are parallel to a surface of the substrate and perpendicular to one another. A magnetic field is oriented along a third axis perpendicular to the surface of the substrate, and the magnetic sense element is configured to sense a magnetic field along the first axis. A magnetic field deflection element, formed on the substrate proximate the magnetic sense element, redirects the magnetic field from the third axis into the first axis to be sensed as a measurement magnetic field by the magnetic sense element. At least two magnetic field sensors, each fully encircled by a shield structure, form a gradient unit for determining a magnetic field gradient.

Magnetic field sensor systems are utilized in a variety of commercial, industrial, and automotive applications to measure magnetic fields for purposes of speed and direction sensing, rotation angle sensing, proximity sensing, and the like. A magnetic interference field, also referred to as a stray magnetic field, along non-sensing and sensing axes of a magnetic field sensor may change the sensitivity and linearity range of the sensor, thus negatively effecting the magnetic field detection quality.

Stray magnetic field robust magnetic field sensor and system


Several embodiments of improved thermocouples that can be formed without necessitating welding of small diameter wires. In each embodiment, the thermocouple is formed by depositing strips of dissimilar materials on an insulating base with the ends of the strips in contacting relationship to form a junction.

This invention relates to a thermocouple temperature sensor and more particularly to an improved temperature sensor of the thermocouple type.
Thermocouple type sensors are used for sensing temperature in a variety of applications. Such temperature sensors consist generally of two wires that are formed from a different material and connected to form a closed circuit. The difference in the materials gives rise to an electromotive force, the magnitude of which depends upon the temperature of the materials. By utilizing this variation in electromotive force, it is possible to accurately sense temperature. However, there are certain disadvantages to the thermocouple type sensors of the type previously employed which has limited their application in certain environments.
That is, in most conventional thermocouples, the ends of the two dissimilar wires must be welded to each other to form the closed circuit. As a result, the application of this principle to very thin wires has been extremely difficult if not impossible. This is because of the difficulty of handling and welding small diameter wires.
In addition to the assembly problem, it would be desirable to employ a plurality of thermocouple type sensors at different locations so as to measure temperature distribution. However, because of the aforedescribed problems in assembly, thermocouples have not been as widely utilized for such an application as measuring temperature distribution as would be desirable. Furthermore, the problem of welding small diameter wire ends to each other and then employing such a thermocouple in application gives rise to the necessity to ensure against shocks and other loading of the fine diameter wires when temperatures are being measured.
It is, therefore, a principal object of this invention to produce a thermocouple which can be manufactured without the necessity of welding small diameter wires.
It is a further object of this invention to provide a very small thermocouple which nevertheless will be able to withstand shocks in application.
It is a yet further object of this invention to provide an improved type of thermocouple for measuring temperature distribution or average temperatures of large bodies.


There is provided an image processing apparatus including a representative pixel calculation unit configured to select some pixels in an input image as representative pixels, a representative pixel update unit configured to update pixel values of the representative pixels, and a corrected image generation unit configured to set pixel values for pixels other than the representative pixels by applying the updated pixel values of the representative pixels. The representative pixel update unit is configured to, based on pixels around a position of the representative pixels in a smoothed image generated based on the input image as reference pixels, execute pixel value correction of the representative pixels by applying the pixel values of the reference pixels.

The present disclosure relates to an image processing apparatus, an imaging apparatus, an image processing method, and a program. More particularly, the present disclosure relates to an image processing apparatus, an imaging apparatus, an image processing method, and a program for performing image correction such as reducing noise included in an image.
An image sensor, such as a CCD sensor or a CMOS (complementary metal oxide semiconductor), that is used in a video camera or a still camera accumulates charge based on the amount of incident light, and performs photoelectric conversion for outputting an electric signal corresponding to the accumulated charge. A color filter for individually accumulating signals corresponding to specific wavelength light, namely, a specific color, for each pixel unit is mounted in such an image sensor. For example, a filter having a Bayer array configured from the respective colors of red, green, and blue (RGB) is often used.
On the other hand, recently, pixels are becoming smaller due to the decreasing size of image sensors and the increasing number of pixels. An image sensor having such a high density of pixels is important when capturing high-resolution images.
However, the amount of charge that can be accumulated per pixel in an image sensor having such a high density of pixels is reduced, so that there is the problem that the noise amount included in the signal from each pixel is comparatively greater.
For example, especially for images captured under low illuminance, the S/N ratio of the color signals (chroma signals) deteriorates due to the carrying out of a large gain adjustment as well as gamma correction and the like, which leads to substantial unevenness in the color signals, namely, chroma noise, of the output image.
As a related-art technology disclosing reduction processing of such chroma noise, for example, JP 2006-302023-A discloses a configuration that executes correction processing based on the pixel values of surrounding pixels using a bilateral filter as a smoothing filter to reduce the noise included in the pixels.
However, since a reference pixel area of a bilateral filter is a comparatively narrow pixel area, it is difficult in correction processing that uses a bilateral filter to remove ultra-low frequency chroma noise spread out over a wide area.
Further, JP 2010-239271-A discloses a configuration that performs noise reduction by executing interpolation processing, in which the pixel values in a noise area are set by utilizing the pixel values of representative pixels obtained by calculating a statistic consisting of two elements, "color" and "position", from an image and determining the representative pixels in area units based on analysis of the calculated statistic.
With this configuration, it is possible to remove the low-frequency chroma noise that is not resolved by the above-described bilateral filter.
However, in this configuration, there is the problem that if noise is included in the selected representative pixels themselves, the noise reduction effect substantially deteriorates.

Image processing apparatus, imaging apparatus, image processing method, and computer readable medium storing instructions for performing image correction


A system for securing objects in an aircraft can comprise a structure in an aircraft having a plurality of receiving holes and a tie down. The tie down can comprise a housing and a fitting. The housing can have at least one engagement pin for selective positioning wherever the receiving holes are located. The fitting can be capable of receiving and securing a restraint to the housing and configured to rotate about the engagement pin to facilitate securing objects in an aircraft.

1. Field of the Invention
The invention is directed to tie downs for securing cargo in aircraft.
2. Background
Stabilizing cargo during shipment is an important objective of aircraft cargo transport systems. In addition, aircraft cargo transport systems should be flexible enough to adapt to conditions during loading, stowage and unloading of the cargo. Typically, cargo shipped by air is first loaded onto specially configured pallets, or into specially configured containers commonly referred to as Unit Load Devices ("ULDs"). Cargo is loaded, stowed and secured within the aircraft for shipment. The cargo deck, roller trays, and sidewalls of a cargo compartment typically include a plurality of restraint devices attached at various installation points located on the cargo deck and sidewalls that can be used to engage and secure cargo.
Two types of devices typically used to secure cargo during shipment are primary and supplemental restraint devices. Primary restraint devices are stationary and positioned at predetermined installation points on a cargo deck or roller tray. Predetermined installation points, however, may not provide optimal attachment locations for securing a ULD. Often, cargo may not fit within the ULD and thus may not fit within the predetermined installation points. Supplemental devices are moveable and can be fixed to any location capable of receiving a supplemental restraint. Attachment locations for supplemental devices may be best determined by which location best minimizes lateral or longitudinal movement of cargo. The loader is tasked with optimizing the use of primary and supplemental restraint devices available at the time of loading and stowage.
The attachment location that minimizes cargo movement, however, may result in damage to the supplemental restraint device and the aircraft. Restraint straps can attach from numerous directions and angles and can place non optimal forces on supplemental restraint devices. For example, the position of the supplemental restraint device on a cargo deck may not align with the direction the restraint strap extends from the cargo. The optimal attachment location, therefore, may not adequately or optimally distribute load from the restraint to the cargo deck. Excessive forces and resultant damage to a restraint device undermine cargo stability. Thus, the ability to adequately distribute the load from the restraint strap to the attachment locations facilitates cargo stabilization. Moveable supplemental restraint devices that are also adaptable to distribute loads from the restraint to the cargo deck provide the loader with the flexibility needed to optimize cargo stabilization.
While movable supplemental devices provide increased flexibility for a loader, the "moveable" nature of these devices could lead to greater theft, loss or misplacement.
Thus, there is a need for supplemental restraints that are capable of attachment to a variety of locations along a roller tray, adaptable to the circumstances of loading and stowage of the cargo and that have design features that discourage theft or loss.


Disclosed herein are displays and related methods for providing stereoscopic imagery, wherein an air gap may be provided between components of the display to allow a reduction in the amount of bonding material used to bond a stereoscopic display panel with a polarization control panel (PCP) element comprising an active switchable retarder. In some embodiments, the PCP element is at least the size of the display panel such that the entirety of the display panel is covered by the PCP element, and thus there would be neither tight tolerance horizontal nor vertical alignment requirements between the PCP element and the display panel. Structural support of the components of the display may be provided by bonding around the edges of the rigid or semi-rigid stereoscopic display panel and PCP element. For example, the air gap may be created with uniform spacers between the stereoscopic display panel and the PCP element.

Stereoscopic, or stereo, 3D displays enhance the perception of images presented on a 2D screen by presenting different images to each eye of the viewer. The viewer's visual system fuses these disparate images in such a way as to create a sensation of depth. To create 3D effects, conventional approaches have used eyewear to determine which image data goes to the left or right eye. Conventional approaches may be applied to both cinema and direct-view display systems.

Stereoscopic display system with active switchable retarder


The present invention relates to modification of the chemical structure of ricinoleic acid, which is present to an extent of 85-90% in castor oil into triacyloxy alkyl ester derivatives. Accordingly, 9,10,12-trihydroxy octadecanoic acid rich fatty acid mixture was prepared from castor oil and converted to their alkyl esters followed by acylation of hydroxy groups to get 9,10,12-triacyloxy octadecanoic acid alkyl ester rich fatty acid alkyl esters mixture. The 9,10,12-triacyloxy octadecanoic acid alkyl esters were purified from the crude product and characterized by 1H NMR studies. The crude products were also evaluated for acid value (A.V.), hydroxyl value (H. V.), iodine value (I. V.), viscosity, viscosity index (V.I.), pour point, flash point and copper strip corrosion and found to be potential base stocks for hydraulic, metal working fluids and other industrial fluids.

Vegetable oils such as rapeseed oil and high oleic varieties of oils are considered to be potential candidates to prepare bio-lubricant feed stocks which replace conventional mineral oil based lubricating oils and synthetic esters [Randles, S. J. et al.; J. Synthetic Lubrication., 9:145 (1992); Asadauskas, S. et al.; Lub. Eng., 52:877 (1996)]. Vegetable oil-based derivatives are attractive alternatives to petroleum derived products because they have enhanced biodegradability, lower toxicity and they originate from renewable oilseed sources. The ester linkages deliver inherent lubricity and enable the oils to adhere to metal surfaces. In addition, vegetable oils have higher solubilising capacity for contaminants and additives than mineral oil base fluids. Most of the work reported on lubricant base stocks in the literature is based on edible oils.
A major non-edible oil namely castor oil serves as an industrial raw material for the manufacture of a number of functional derivatives [J. Am. Oil Chem. Soc. 51, 65 (1974), J. Am. Oil Chem. Soc. 48, 759 (1971)]. Castor oil is a well known lubricant due to the presence of hydroxyl fatty acid (12-Hydroxy 9 cis-octadecenoic acid or ricinoleic acid) to an extent of 85-90% (Chemical Business, 1991, 55-60). J. Synthetic Lubrication 24,181 (2007) reported the physico-chemical characteristics of castor oil.
Castor oil has undesirable very high viscosity at 40° C. as well as at 100° C. castor oil also gets dehydrated at temperature of about 200° C. and above.
The rheological characteristics of chemically modified castor oil are much better than mineral oil and other plant oils based lubricants. Castor oil based esters with hydroxyl group at position 12 esterified with C6, C12, C16 and C18 fatty acids are of interest, mainly due to their physical characteristics at low temperature (Eur J Lipid Sci. Technol. 2003, 105, 214-218). Esters with a free hydroxyl group are efficient in improving the lubrication ability of petroleum fuels. Methyl and ethyl esters of ricinoleic and 12-hydroxy octadecanoic acids were prepared and their physico-chemical properties were determined and the results suggested that with the exception of the viscosity, density and cetane number the presence of free hydroxyl group had no influence on their parameters and does not limit the use of their esters as fuels (Eur J. lipid Sci. Technol., 2006, 108, 629-635). Soybean oil was modified to convert sites of unsaturation to C2 to C10 diesters which have utility as hydraulic fluids, metal working fluids and other industrial fluids (U.S. Pat. No. 6,583,302). There were no reports on the preparation of derivatives of these tri hydroxy fatty acid rich mixture for their usefulness as lubricant base stocks.

9,10,12-triacyloxy octadecanoic acid alkyl ester and 9,10,12-triacyloxy octadecanoic acid alkyl ester rich fatty acid alkyl esters mixture and a process for preparation thereof

Council of Scientific & Industrial Research


By formulating permanent wave compositions with chlorophyll derivatives of water soluble alkaline divalent cations selected from the group consisting of magnesium, manganese, calcium, copper, and zinc, an easily employed malodor reducing composition is achieved for use with conventional reducing agents employed for permanently waving hair. In accordance with the present invention, chlorophyll derivative compositions soluble in propylene glycol and glycerol are employed in pre-treatments, waving lotions, or as additives to the waving lotions using various different reducing agents salts and esters of TGA, TLA, Cysteine, Cysteamine, and Bisulfite.

The present invention relates to treatments for reducing the perm odor in hair produced during the permanent wave operation. Perm odors have been found to exist due to the use of hair reducing agents such Thioglycolic Acid, Thiolactic Acid, GTG, Cysteine, Cysteamine, Bisulfite or other product compounds that are entrapped into the porous structure of hair. The higher the porosity of hair the higher the binding affinity of the chemical compounds with hair or the higher the level of the odoriferous residues. Other factors that affect the binding affinity are molecular size, net change of reducing agent, electro-static charge of hair and the pH of the waving lotion.
Impurities, volatile mercaptans and other by-products that are formed from complex reactions of the reducing or oxidizing agents with hair are also responsible for the post permanent malodor.
The profile, duration and intensity of the perm odor appears to be dependent on the concentration, reducing agent type used and pH of the waving lotion. Another factor in the perm odor is the odor intensity of the reducing agent. Waving lotions prepared with Cysteine and Bisulfite are less odoriferous than Ammonium Thioglycolate (ATG) and Glyceryl Thioglycolate (GTG). However, all of these agents produce offensive odors.
There are no specific reaction mechanisms for the formation of the odoriferous residues in hair during the operation from the different type of reducing agents. However the perm odor in hair from the different reducing agents or perm products is easily differentiated by the human nose.
The present invention involves the reduction of permanent wave odors formed during and after the perm operation of hair permed with the conventional, well-known reducing agents. Although the intensity and type of the malodor varies depending upon the agent employed, such post-perm malodor in hair is referred or described by individuals as "corn chips", "burned pop corn" or "wet dog" or "cat urine". The intensity of the post-perm malodor is also amplified in cigarette smokers and the body chemistry of individuals.
The post-perm malodor resulting from Cysteamine permanent wave products is not affected by shampooing and it persists in hair for many weeks. The malodor is not noticeable in dry hair but appears to be strong and is released upon water contact. The malodor is continuously being released upon rewetting of the hair.
Therefore, it is a principal object of the present invention to provide a hair treatment composition for reducing the odor in hair caused from a permanent wave operation which is long lasting and is easily applied to the hair during the permanent wave operation or subsequent thereto.
Another object of the present invention is to provide a hair treatment composition having the characteristic features described above which is retained in the hair fibers and avoids removal or dilution by normal hair shampooing or washing.
Another object of the present invention is to provide a hair treatment composition having the characteristic features described above which possesses a unique combination of fragrances that are retained by the hair fibers and effectively render any malodor to be more pleasant.
Another object of the present invention is to provide a hair treatment composition having the characteristic features described above which is capable of reducing, masking, and/or eliminating permanent wave malodor which occurs due to the re-wetting of hair fibers after a permanent wave operation.
Other and more specific objects will in part be obvious and will in part appear hereinafter.

Method and composition for reducing malodor in permanently waved hair


A device and method for providing selective concealment and access to items stored on an overhead part of a retail shelving system. The device includes one or more mounting posts attachable to the retail shelving system and one or more panel support units. The mounting posts further include one or more substantially vertical channels. The panel support unit is engaged with the mounting posts and extends above the retail shelving system. The panel support unit is selectively moveable between an open configuration and a closed configuration such that when in the open configuration the panel support unit is displaced to provide access to the items stored on the overhead part of the retail shelving system, and when in the closed configuration the panel support unit conceals the items stored on the overhead part of the retail shelving system.

Retail stores require large amounts of shelving both to display items and to store inventory. As a result, gondola shelving systems are commonly employed in the retail industry. Gondola shelving systems comprise metal shelves attached to slotted upright support beams. In response to the widespread usage of gondola shelving systems, framing systems have been designed to improve the appeal and appearance of existing gondola shelving systems.
Framing systems provide a structure wherein graphic signs may be displayed over the front portion of a gondola shelving system, serving both to display graphics and to conceal items stocked within the existing body of the shelving system. While many framing systems also translate to provide access to items concealed behind the graphic signs, these framing systems are aimed primarily at covering stocked items stored within the body of the shelving system and fail to address overhead stock items stored on the uppermost shelf of the gondola shelving system. Thus, improvements to overhead category frame systems are desired.


A solid-state image pickup element includes: (A) a light receiving/charge accumulating region formed in a semiconductor layer and formed by laminating M (where M≧2) light receiving/charge accumulating layers; (B) a charge outputting region formed in the semiconductor layer; (C) a depletion layer forming region formed of a part of the semiconductor layer, the part of the semiconductor layer being situated between the light receiving/charge accumulating region and the charge outputting region; and (D) a control electrode region for controlling a state of formation of a depletion layer in the depletion layer forming region, wherein the solid-state image pickup element further includes a light receiving/charge accumulating layer extending section extending from each light receiving/charge accumulating layer to the depletion layer forming region.

1. Field of the Invention
The present invention relates to a solid-state image pickup element and a driving method thereof, and particularly to a single plate type color solid-state image pickup element and a driving method thereof.
2. Description of the Related Art
In a related-art single plate type color solid-state image pickup element such as a CCD (Charge Coupled Device) image sensor, a CMOS (Complementary Metal Oxide Semiconductor) image sensor, a color filter transmitting red, green, or blue is disposed above a light receiving/charge accumulating layer. In order to obtain color video information, visible light transmitted by the color filter and received by the light receiving/charge accumulating layer is output as a signal from the solid-state image pickup element. The color filter of each color absorbs about ⅔ of incident light. There are thus disadvantages of poor efficiency of use of visible light and low sensitivity. In addition, because each solid-state image pickup element provides a color signal of only one color, there are other disadvantages of poor resolution and noticeable false color, in particular.
Accordingly, in order to overcome such disadvantages, a solid-state image pickup element in which three light receiving/charge accumulating layers are laminated has been studied and developed (see Japanese Patent Laid-Open No. 2006-278446, for example). The solid-state image pickup element of such a structure has a pixel structure in which three light receiving/charge accumulating layers for generating charges with respect to light of the three primary colors of blue, green, and red are laminated in order from a light incidence surface, for example. Each solid-state image pickup element has a signal reading circuit for reading the charges generated in the respective light receiving/charge accumulating layers independently, and performs photoelectric conversion on most of incident light. Therefore, the efficiency of use of visible light is close to 100%, and signals corresponding to the three primary colors of blue, green, and red are obtained by one solid-state image pickup element. There is thus an advantage in that an excellent image of high sensitivity and high resolution is obtained.

Solid-state image pickup element and driving method thereof


A method for establishing a route over which data packets are to be sent from a source node to a destination node in an ad-hoc network is provided. A source having packets to send to a destination node employs a reactive routing protocol if it does not posses the route to the destination node. Initially, it may be determined whether or not the source node is a member of an existing piconet. If the source node is a member of an existing piconet, a ROUTE request message may be broadcast to the nodes of the existing piconet, while the source awaits a timely REPLY message. If the source node is not a member of an existing piconet, or if a time REPLY message is not received, the source node may initiate a new route discovery process wherein the nodes attempt to establish new piconets that enable more efficient communication between the source and destination nodes.

The present invention relates to the field of telecommunications. More particularly, the present invention relates to the field of ad-hoc network telecommunications.
xe2x80x9cBluetoothxe2x80x9d is an example of an ad-hoc wireless network technology that uses a frequency hopping scheme in the unlicensed 2.4 Ghz ISM (Industrial-Scientific-Medical) band. The original intention of Bluetooth was to eliminate cables between devices such as phones, PC-cards, wireless headsets, etc., in a short-range radio environment. Today, however, Bluetooth is a true ad-hoc wireless network technology intended for both synchronous traffic, e.g., voice and asynchronous traffic, e.g., IP based data traffic. The aim is that any digital communication device such as telephones, PDAs, laptop computers, digital cameras, video monitors, printers, fax machines, etc. should be able to communicate over a radio interface through the use of a Bluetooth radio chip and its accompanying software.
FIGS. 1A-C illustrate three exemplary Piconets. In accordance with, the Bluetooth technology, two or more Bluetooth (BT) units sharing the same channel form a piconet. Within a piconet, a BT unit can be either a master or a slave, although each piconet must have only one master and up to seven active slaves. Any BT unit can become a master.
FIG. 2 illustrates a scatternet. A scatternet is formed through the interconnection of two or more piconets. Two or more piconets connect with each other through a commonly shared BT unit, that is a member of each piconet. BT unit 205 is an example of a BT unit that is shared by three piconets 1, 2 and 3.
FIG. 2 further illustrates that a BT unit, which is shared by two or more piconets, may be a slave unit in several piconents, but a master unit in only one piconet. For example, BT unit 210 is the master unit in piconet 10, but only a slave unit in piconet 11 and 12. In addition, a BT unit that is a member of two or more piconets may transmit and receive data in one piconet at a time. Accordingly, participation in multiple piconets has to be on a time division multiplex basis. It should be noted that there is no direct transmission between slaves, only between master and slave and vice versa.
Each BT unit has a globally unique 48-bit IEEE 802 address. This address, called the Bluetooth Device Address (BD_ADDR), is assigned when the BT unit is manufactured, and it never changes. In addition, the master of a piconet assigns a local, Active Member Address (AM_ADDR) to each active member of the piconet. The AM_ADDR, which is only three bits long, is dynamically assigned and deassigned and is unique only within a single piconet. The master uses the AM_ADDR to poll a particular slave in the piconet. When the slave, triggered by a polling packet from the master, transmits a packet to the master, it includes its own AM_ADDR in the packet header.
Though all data is transmitted in packets, the packets may contain synchronous data, on SCO links, which is primarily intended for voice traffic, and/or asynchronous data, on Asynchronous Connectionless (ACL) links. If the packet contains asynchronous data, an acknowledgment and retransmission scheme is used to ensure reliable transfer of data, as is forward error correction (FEC) in the form of channel coding.
FIG. 3 illustrates the standard format of a Bluetooth packet, although there are exceptions for certain control packets. The AM_ADDR is located in the packet header, followed by control parameters (e.g., a bit indicating acknowledgment or retransmission request, when applicable, and a header error check (HEC) code.
The format of the payload depends on the type of packet. The payload of an ACL packet consists of a header, a data field and, in most instances, a cyclic redundancy check (CRC) code. The payload of an SCO packet only contains a data field. In addition, there are hybrid packets that include two data fields, one for synchronous data and one for asynchronous data. Packets which do not include a CRC are neither acknowledged nor retransmitted.
FIG. 4 illustrates the protocol layers of a Bluetooth system. The Baseband, LMP and L2CAP are existing Bluetooth specific protocols, the xe2x80x9chigh level protocol or applicationxe2x80x9d layer represents protocols that may or may not be Bluetooth specific, while the Network layer does not currently exist in the current Bluetooth specifications.
A significant limitation associated with Bluetooth is that there is no defined method for addressing and routing packets from a BT unit in one piconet to a BT unit in another piconet. In other words, the current Bluetooth specification does not specify how inter-piconet communication is performed in a scatternet.
An important capability in any ad-hoc networking technology is the neighbor discovery feature. This is also true for Bluetooth. Without a neighbor discovery capability, a BT unit can not find other BT units with which to communicate, and consequently, no ad-hoc network would be formed. The neighbor discovery procedure in Bluetooth involves an INQUIRY message and an INQUIRY RESPONSE message. A BT unit wanting to discover neighboring BT units within radio coverage will, according to well specified timing and frequency sequences, repeatedly transmit INQUIRY messages and listen for INQUIRY RESPONSE messages. An INQUIRY message consists of only an Inquiry Access Code. The Inquiry Access Code can be a General Inquiry Access Code (GIAC), which is sent to discover any BT unit in the neighborhood, or a Dedicated Inquiry Access Code (DIAC), which is sent to discover a certain type of BT unit, for which a particular DIAC is dedicated.
A BT unit receiving an INQUIRY message, whether it contains a GIAC or a DIAC responds with an INQUIRY RESPONSE message. The INQUIRY RESPONSE message is, in actuality, a Frequency Hop Synchronization (FHS) packet. Bluetooth uses FHS packets for other purposes, e.g., for synchronization of the frequency hop channel sequence, as the name suggests. In any event, by listening for INQUIRY RESPONSE messages, the BT unit that initiated the INQUIRY can collect the BD_ADDR and internal clock values, both of which are included in the FHS packet, of the neighboring BT units.
Related to the INQUIRY procedure is the PAGE procedure. A PAGE procedure is used to establish an actual connection between two BT units. Once the BD_ADDR of a neighboring BT unit is known, as a result of an INQUIRY procedure, the neighboring BT unit can be paged with a PAGE message. Knowing the internal clock value of the BT unit being paged speeds up the PAGE procedure, since it is possible for the paging unit to estimate when and on what frequency hop channel the neighboring BT unit will listen for PAGE messages.
A PAGE message consists of the Device Access Code (DAC), derived from the BD_ADDR of the paged BT unit. A BT unit receiving a PAGE message that includes its DAC, responds with an identical packet. The paging BT unit then replies with an FHS packet, including the BD_ADDR of the paging BT unit, the current value of the internal clock of the paging BT unit, the AM_ADDR assigned to the paged BT unit and other parameters. The paged BT unit then responds once again with its DAC, and the connection between the two BT units is established.
If the paging BT unit is already the master of an existing piconet, the paged BT unit joins the existing piconet as a new slave unit. Otherwise, the two BT units form a new piconet with the paging BT unit as the master unit. Since the INQUIRY message does not include any information about its sender, the BT unit initiating the INQUIRY procedure is the only one that can initiate a subsequent PAGE procedure. Thus, the BT unit initiating an INQUIRY procedure will also be the master of any piconet that is formed as a result of a subsequent PAGE procedure. However, if considered necessary, the roles of master and slave can be switched using a master-slave-switch mechanism in Bluetooth. This, however, is a complex and extensive procedure resulting in a redefinition of the entire piconet which may involve other slave units in the piconet.
The INQUIRY and PAGE procedures are well specified in the current Bluetooth standard. These are all the tools that are needed to form a new Bluetooth piconet or to add a new BT unit to an existing piconet. However, even though these tools are well specified, there are no rules or guidelines as to how to use them. When neighbors are discovered, there is no way to know with whom to connect in order to form an appropriate piconet. Moreover, even if the master-slave-switch mechanism exists, using it is an extensive procedure, as stated, and it is hard to know when to use it in order to improve the efficiency of a piconet. Hence, piconets will more or less form at random, often resulting in far from optimal piconet and scatternet structures. An exception is when the BT unit initiating the INQUIRY procedure already knows the BD_ADDR of the BT unit it wants to connect to.
An important aspect of Bluetooth is the ability to support IP on top of the Bluetooth protocol stack. There are currently two proposals for achieving this. The first proposal regards each piconet as an IP subnet, and runs IP on top of L2CAP in each piconet. The second proposal regards an entire Bluetooth scatternet as an IP subnet. This requires that an adaptation layer, herein referred to as the Network Adaptation Layer (NAL), be inserted between L2CAP and the IP layer, as illustrated in FIG. 5. The purpose of the NAL is to emulate a shared medium network (i.e., a broadcast medium) which is assumed by the IP layer.
The first proposal suffers from a number of problems, due, in part, to the fact that Bluetooth piconets are not shared medium networks. The second proposal is of course, not without problems, but it seems to be a more promising approach. The present invention is applicable to the second proposal. Accordingly, the present invention assumes protocol layers as illustrated in FIG. 5, which includes a NAL.
The NAL layer has to support a number of features. For instance, it must support a routing mechanism to route packets within a scatternet while causing the scatternet to emulate a single shared medium network which is assumed by the IP layer. Regardless of the routing scheme used to route packets through the scatternet, the scheme must rely on BT units that are members of more than one piconet to forward packets from one piconet to another. These BT units are referred to herein below as forwarding nodes.
In general, routing protocols can be classified as proactive or reactive. A proactive routing protocol maintains routes between nodes, even if the route is not currently needed. Proactive routing protocols react to network topology changes even if no traffic is affected by the topology change. Proactive routing protocols are very costly in terms of overhead, because every node must periodically send out control information to other nodes in the network.
An alternative approach is to use reactive routing. In accordance with reactive routing, routes are established only when there is an explicit need to route packets to a particular destination. This means that the routing protocol only keeps track of routes that actually are needed for sending data. Therefore, there is less cost in terms of overhead to maintain the routes.
To establish a route from a source to a destination, the source node typically broadcasts a REQUEST message which requests a route to a stated destination. All nodes that are within range receive this REQUEST message. A node that receives the REQUEST message but is neither the destination node or a node with a valid route to the destination node, will rebroadcast the REQUEST message to its neighbors. When the destination node, or a node with a valid route to the destination node receives the REQUEST message, it limits network flooding by not rebroadcasting the REQUEST message, and it sends a Unicast REPLY message back to the source node.
Typically, the source node uses the first reply message received, and it only requests a new route when the actual route breaks. The routing can be accomplished according to one of the following disciplines. First, there is source routing, where the entire route is received in the REPLY message. No information is needed in the intermediate nodes, only the source needs to keep track of the route. The entire route is specified in every packet sent. The second involves a distance vector, which means that the REPLY message stores information in the routing tables of the intermediate nodes. This means that only the destination is needed in sent packets.
The Bluetooth specification, as stated, has the INQUIRY and PAGE procedure to establish piconets, but it fails to describe how these can be used to form efficient scatternets. Moreover, current solutions do not provide a procedure for nodes that have packets to send to a destination, wherein these nodes are not members of any piconet.
These and other problems, drawbacks and limitations associated with present techniques are overcome according to the present invention, wherein a source node in a telecommunications network (i.e., a node from which a packet is sent) can form one or more new network connections based upon predetermined events.
Accordingly, it is an objective of the present invention to allow reactive ad-hoc routing protocols to determine whether new network connections are to be made in order to form a route between the source node and the destination node.
It is another objective of the present invention to provide means for a source node in a network, upon the occurrence of a predetermined event, to create new network connections in forming a route between the source node and the destination node.
In accordance with one aspect of the present invention, the foregoing and other objectives are achieved by a method in a communications network for establishing a route over which data packets are to be sent from a source node to a destination node. The method involves requesting route discovery between the source node and the destination node over existing network connections. Ultimately, a determination is made as to whether the request for route discovery has failed. If the request for route discovery failed, a route between the source node and the destination node is formed by creating one or more new network connections.


An imaging lens assembly includes, in order from an object side to an image side, a first lens element, a second lens element, a third lens element, a fourth lens element and a fifth lens element. The first lens element with negative refractive power has an object-side surface being concave at a paraxial region thereof, wherein the surfaces thereof are aspheric. The second lens element has refractive power. The third lens element has positive refractive power. The fourth lens element has negative refractive power. The fifth lens element with positive refractive power has an object-side surface being convex at a paraxial region thereof and an image-side surface being concave at a paraxial region thereof, wherein the object-side surface thereof changes from convex at the paraxial region thereof to concave at a peripheral region thereof, and the surfaces thereof are aspheric.

1. Technical Field
The present invention relates to an imaging lens assembly. More particularly, the present invention relates to a compact imaging lens assembly applicable to electronic products.
2. Description of Related Art
In recent years, with the popularity of mobile products with camera functionalities, the demand of miniaturized optical lens systems is increasing. The sensor of a conventional photographing camera is typically a CCD (Charge-Coupled Device) or a CMOS (Complementary Metal-Oxide Semiconductor) sensor. As the advanced semiconductor manufacturing technologies have allowed the pixel size of sensors to be reduced and compact optical lens systems have gradually evolved toward the field of higher megapixels, there is an increasing demand for compact optical lens systems featuring better image quality.
A conventional compact optical lens system employed in a portable electronic product mainly adopts a structure of four-element lens such as the one disclosed in U.S. Pat. No. 8,179,470. Due to the popularity of mobile products with high-end specifications, such as smart phones and PDAs (Personal Digital Assistants), the requirements for high resolution and image quality of modem compact optical lens systems has been increasing significantly. However, the conventional four-element lens structure cannot satisfy these requirements of the compact optical lens system.
Although other conventional optical lens systems with five-element lens structure such as the ones disclosed in U.S. Pat. No. 8,000,031, however, the object-side surface of the first lens element of the optical lens system is not concave which can enlarge a field of view. Thus, the field of view of the optical lens system would be restricted, and the distortion is more pronounced with the current lens configuration dictated by the surface shape, so that the image quality suffers substantially.


There is provided a display device including a plurality of pixels. Each of the plurality of pixels may include a plurality of switching devices, at least one capacitor, and a semiconductor light-emitting device. The display device may further include a driving circuit configured to apply currents to the semiconductor light-emitting device through the plurality of switching devices and at least one capacitor. The semiconductor light-emitting device may emit red light, green light, and blue light through the currents applied by the driving circuit.

The present inventive concept relates to a display device and a display panel.
Among flat panel display (FPD) devices, an organic light-emitting display device, unlike a liquid crystal display (LCD) device, may not require an additional backlight unit, since an organic light-emitting diode (OLED), emitting light by itself when current flows therethrough, is disposed in each pixel. Due to such an advantage, the application range of organic light-emitting display devices has been gradually broadened.
However, since the OLED disposed in each pixel of the organic light-emitting display device may have a low light conversion efficiency, it may be difficult to apply the organic light-emitting display device to a low power-consumption apparatus. Accordingly, when it is applied to a wearable electronic device which is currently commercialized in various fields, battery power consumption may increase. In addition, since a single pixel may include one OLED emitting one of red light (R), green light (G), and blue light (B), the quality of colored light emitted by the organic light-emitting display device may change, according to arrangements of R, G, and B pixels.


In one embodiment of the invention, an integrated circuit, such as an FPGA, has one or more programmable termination schemes, each having a plurality of resistive termination legs connected in parallel, and a calibration circuit designed to control each termination scheme for process, voltage, and temperature (PVT) variations. The sense element in the calibration circuit and each resistive leg in each termination scheme has a transistor-based transmission gate connected in series with a non-silicided poly (NSP) resistor. The negative temperature coefficient of resistivity of each NSP resistor offsets the positive temperature coefficient of resistivity of the corresponding transmission gate to provide a temperature-independent sense element and temperature-independent termination legs. The temperature-independence and constant IV characteristic of the sense element and termination legs enable a single calibration circuit to simultaneously control multiple termination schemes operating at different termination voltage levels.

Signal integrity has become a critical issue in the design of high-speed chip-to-chip communications systems. Using the proper termination scheme can be critical to maintaining good signal integrity. Improper terminations can lead to poor quality due to reflections or signal attenuation. On-chip termination can eliminate the need for external termination resistors on the board, thereby avoiding signal reflections caused by stubs between an on-chip buffer and an off-chip termination resistor.
Unfortunately, in high-speed operations, signals can be distorted as a result of non-linearities in the IV (current-voltage) curve of the on-chip termination resistance. In differential I/O signaling, non-linearity can contribute to different edge rates between the pair of signals, which can adversely impact timing and reduce the data valid window. In addition, conventional on-chip termination schemes are susceptible to process, voltage, and temperature (PVT) variations. As a result, the termination resistance levels will typically vary over different PVT conditions.
As a particular technology matures, process variations usually decrease sufficiently to enable acceptable implementation of on-chip termination. However, the resistance of on-chip termination resistors can vary by 10% to 60% across a temperature range of operation of −40 C. to +125 C., especially in termination schemes that use transistors as the resistive elements. In addition to their wide variations in resistance with respect to temperature, transistors also have inherent non-linearities in their IV curves. Both of these characteristics make it very difficult to control the accuracy and constancy of on-chip impedances implemented using transistors. To compensate for such wide variations in resistance as a function of temperature, elaborate PVT calibration circuits are typically employed to control the configuration of programmable, on-chip termination schemes used for I/O buffers. These calibration circuits increase the complexity of the I/O buffers and require additional layout area.
Moreover, in certain applications, such as in field-programmable gate arrays (FPGAs), I/O buffer modes that operate at different power supply voltage levels are frequently deployed on a single chip. Because of the non-linearity of the IV curve of the on-chip impedance, a separate PVT calibration circuit may need to be implemented for each different voltage level and/or each different I/O bank, since the calibration circuit for one voltage level will typically not properly calibrate the on-chip impedance used for a different voltage level. Implementing multiple calibration circuits, each of which may require one or more pads and may need to be placed close to its associated I/O bank, increases die size and reduces the number of pads that can be used as I/O signal pads.

Temperature-independent, linear on-chip termination resistance


A semiconductor apparatus includes a thin film belt-like insulating tape having a plurality of predetermined wire patterns thereon, and a plurality of IC chips that are provided on a surface of the insulating tape at uniform spaces in a lengthwise direction and electrically connected with the wire patterns, and further includes thick film reinforcing tapes with sprocket holes for transport use provided at uniform spaces, the reinforcing tapes being provided on both side portions of the insulating tape, in the lengthwise direction.

The present invention relates to a semiconductor apparatus, a method of fabrication of the same, and a reinforcing tape used in fabrication of the same. The semiconductor apparatus is, for example, a tape carrier in a belt form on which a plurality of semiconductor devices flexible and bendable are provided in a lengthwise direction.
Recently, a semiconductor package applied to a middle-size or small-size liquid crystal product or the like is increasingly required to be further smaller, lighter, and thinner. A driver semiconductor package applied to a small liquid crystal panel in a frame size, particularly, is required to have flexibility. Semiconductor packages classified into a TCP (tape carrier package) type and a COF (chip on film) type have conventionally been applicable for the foregoing object.
A TCP-use tape carrier 100 is a tape carrier in a long belt form as shown in FIGS. 18(a) and 18(b), which is composed of an insulating tape 111 having sprocket holes 101 on both sides so that handling of the same, for example, transport and position adjustment, in the process of fabrication is facilitated. The tape carrier 100 is designed so that a plurality of devices 102 are disposed at uniform spaces in a lengthwise direction (in FIGS. 18(a) and 18(b), however, only one device 102 is shown). Each device 102 is to be cut out therefrom along a cutout line 103 so as to be used as an independent semiconductor device. Besides, each device 102 is equipped with an IC chip 104 and a wire pattern 105, and further, has an installation-use opening 106 which is usually called xe2x80x9cdevice holexe2x80x9d is provided for installation of the IC chip 104.
Wires (inner leads) 107 of the wire patterns 105, which are drawn to the opening 106, are electrically connected with corresponding electrode terminals 108 of the IC chips 104, respectively, as shown in FIG. 18(b). Connections of wires 107 of the wire patterns 105 with the IC chips 104 are sealed with resin 109. Exposed parts of the wire patterns 105, except connector sections at ends which are, upon use, to be connected with other substrates or the like, are coated with solder resist 110 so that a state of insulation is secured.
On the other hand, a COF-use tape carrier 120 is a tape carrier formed relatively short, in a rectangular or square shape as shown in FIGS. 19(a) and 19(b). Since a thin film 121 is used therein as a substrate, a reinforcing film 122 is made to adhere with use of an adhesive 126 to an entirety of a lower surface of the thin film 121. A plurality of devices 123 are disposed on the thin film 121 at uniform spaces, and each device 123 is cut out therefrom along an cutout line 127 so as to be used as an independent semiconductor device.
Each device 123 is equipped with an IC chip 124 and a wire pattern 125, but unlike the TCP-use tape carrier 100, the device 123 does not have an installation-use opening for installation of the IC chip 124. In other words, the IC chip 124 is provided on a surface of the thin film 121, as shown in FIG. 19(b).
Wires 128 of the wire patterns 125 are electrically connected with corresponding electrode terminals 129 of the IC chips 124, respectively. Connections of the wires 128 with the IC chips 124 are sealed with resin 130. Exposed parts of the wire patterns 125, except connector sections at ends which are, upon use, to be connected with other substrates or the like, are coated with solder resist 131 so that a state of insulation is secured.
As to the above-described conventional tape carriers, following problems arise in the process of fabrication.
In the case of the TCP-use tape carrier 100, if formed thinner, it becomes very soft thereby becoming fragile against pulling stress, and the sprocket holes 101 for transport use tend to be broken, thereby making the fabrication difficult. Further, in the case where each device 102 is used in a bent state, the conventional tape carrier 100 is hard per se, therefore additionally needs a bending-use hole 113 at a portion at which it is bent (see FIG. 18(a)). This causes the costs for fabrication to rise the more.
Further, the design with the device hole 106 makes the inner leads 107 free, thereby making the device prone to defects of connection between the IC chip 104 and the wire pattern 105. As a result, finer pitched wire pattern 105 becomes difficult.
Further, to fabricate the tape carrier 100, the adhesive 112 is preliminarily applied onto the insulating tape 111, and after holes are formed, a copper foil is laminated on the adhesive 112 and then subjected to etching to a predetermined pattern so as to have the wire pattern 105. Thus, the fabrication is performed in a state in which the adhesive 112 is applied to the insulating tape 111, thereby making the work awkward.
On the other hand, in the case of the COF-use tape carrier 120, which uses the thin film 121 but does not have sprocket holes, transport and position adjustment in the process of fabrication are not facilitated as compared with the case of the TCP-use tape carrier 100. Further, after each device 123 is cut out along the cutout line 127, a step of peeling off the reinforcing film 122 from the thin film 121 is needed, and the process of fabrication is complicated the more for the foregoing step.
The object of the present invention is to provide (i) a semiconductor apparatus that enables to provide a semiconductor device bendable when used and that is treated with ease during process of fabrication of the same, (ii) a process of fabrication of the foregoing semiconductor apparatus, and (iii) a reinforcing tape used in the process of fabrication of the semiconductor apparatus.
To achieve the foregoing object, a semiconductor apparatus of the present invention, which includes a thin film belt-like insulating tape having a plurality of predetermined wire patterns thereon, and a plurality of semiconductor elements provided on a surface of the insulating tape at uniform spaces in a lengthwise direction and electrically connected with the wire patterns, comprises a thick film reinforcing member with holes for transport use provided at uniform spaces, the reinforcing members being provided on both side portions of the insulating tape, in the lengthwise direction.
With foregoing configuration wherein the insulating tape is formed thin, it is possible to provide a semiconductor device which can be bent when used. Further, since the thick reinforcing member having transport-use holes at uniform spaces is provided, transport, position adjustment, and other works in the process of fabrication are executed in a good state.
The semiconductor element is installed on the insulating tape and no opening for semiconductor element installation use is formed in the insulating tape. Therefore, the semiconductor elements and the wire patterns can be connected with each other in a good state, thereby allowing the wire patterns to be finer pitched, as compared with a case where installation-use openings are formed.
Besides, in the case where a tape with a width equal to that of a standardized TCP-use tape is used as a material for forming the reinforcing member, the conventional facilities used for fabrication of the conventional TCPs can be used for fabrication of the semiconductor apparatuses of the present invention.
To achieve the aforementioned object, a method of fabrication of a semiconductor apparatus of the present invention comprises the steps of (1) forming first holes for transport use, on both sides of a reinforcing tape formed with a thick film, at uniform spaces in a lengthwise direction of the reinforcing tape, and forming second holes for separation use so as to make lines in the lengthwise direction, on both sides of the reinforcing tape and on inner sides to the first holes, (2) making an insulating tape, formed with a thin film narrower than a distance from the first holes on one side to those on the other side, adhere onto an inside part of the reinforcing tape so as to cover the second holes on both the sides, (3) providing a plurality of predetermined wire patterns on the insulating tape in a lengthwise direction of the same, (4) installing a plurality of semiconductor elements on a surface of the insulating tape in the lengthwise direction at uniform spaces, in a manner such that the semiconductor elements are electrically connected with the corresponding wire patterns, respectively, and further, (a) forming third holes, each at a position between two neighboring second holes in each line, in a manner such that each third hole bridges the two neighboring second holes so that the second holes in each line become continued, the step (a) being performed either before the step (3), between the steps (3) and (4), or after the step (4).
According to the foregoing method, the thick film reinforcing tape is made to adhere to the thin film insulating tape, so that the insulating tape is reinforced. Besides, transport and position adjustment of the insulating tape can be executed with use of the first holes of the reinforcing tape. Therefore, in transport and other works with respect to the thin film insulating tape in the process of fabrication of a semiconductor device that can be bent when used, the works of transport and the like are executed in a good state.
Further, after formation of the second holes in lines on both sides of the reinforcing tape, the third holes are formed so that the second holes become continued. This enables subsequent separation of the inside part of the reinforcing tape between the two lines of the second holes from the insulating tape.
Furthermore, by using as the reinforcing tape a tape with a width equal to that of a standardized TCP-use tape, the conventional facilities used for fabrication of the conventional TCPs can be used for fabrication of the semiconductor apparatuses of the present invention.
To achieve the aforementioned object, another method of fabrication of a semiconductor apparatus of the present invention comprises the steps of (1) forming second holes for separation use on both sides of a reinforcing tape formed with a thick film, on inner sides to first holes to be formed later, so as to make lines in a lengthwise direction of the reinforcing tape, (2) making an insulating tape, formed with a thin film with a width substantially equal to that of the reinforcing tape, adhere onto the reinforcing tape so as to be laminated thereon, (3) boring both the reinforcing tape and the insulating tape laminated on each other, so as to form the first holes for transport use, on both sides of the tapes, at uniform spaces in the lengthwise direction, (4) providing a plurality of predetermined wire patterns on the insulating tape in a lengthwise direction of the same, (5) installing a plurality of semiconductor elements on a surface of the insulating tape in the lengthwise direction at uniform spaces, in a manner such that the semiconductor elements are electrically connected with the corresponding wire patterns, respectively, and further, (a) forming third holes, each at a position between two neighboring second holes in each line, in a manner such that each third hole bridges the two neighboring second holes so that the second holes in each line become continued, the step (a) being performed either before the step (4), between the steps (4) and (5), or after the step (5) According to the foregoing method, the thick film reinforcing tape is made to adhere to the thin film insulating tape, so that the insulating tape is reinforced. Besides, transport and position adjustment of the insulating tape can be executed with use of the first holes formed in not only the reinforcing tape but also the insulating tape. Therefore, in the case where the thin film insulating tape is transported and the like in the process of fabrication of a semiconductor device that can be bent when used, the work of transport and the like is executed in a good state.
Furthermore, wide areas can be used for adhesion of the insulating tape to the reinforcing tape, thereby further improving the workability in the process of fabrication.
Furthermore, after formation of the second holes in lines on both sides of the reinforcing tape, the third holes are formed so that the second holes become continued. This enables subsequent separation of the inside part of the reinforcing tape between the two lines of the second holes from the insulating tape.
Furthermore, by using as the reinforcing tape a tape with a width equal to that of a standardized TCP-use tape, the conventional facilities used for fabrication of the conventional TCPs can be used for fabrication of the semiconductor apparatuses of the present invention.
To achieve the aforementioned object, still another method of fabrication of a semiconductor apparatus of the present invention comprises the steps of (1) forming fourth holes in a plurality of areas in which wire patterns and semiconductor elements are to be formed later, the areas being provided in a reinforcing tape formed with a thick film, at uniform spaces in a lengthwise direction of the reinforcing tape, (2) making an insulating tape, formed with a thin film with a width substantially equal to that of the reinforcing tape, adhere onto the reinforcing tape so as to be laminated thereon, (3) boring both the reinforcing tape and the insulating tape laminated on each other, so as to form first holes for transport use, on both sides of the tapes, at uniform spaces in lines in the lengthwise direction, (4) providing a plurality of predetermined wire patterns on the insulating tape in a lengthwise direction of the same, at positions corresponding to the fourth holes, and (5) installing a plurality of semiconductor elements on a surface of the insulating tape in the lengthwise direction at uniform spaces, at positions corresponding to the fourth holes, in a manner such that the semiconductor elements are electrically connected with the corresponding wire patterns, respectively.
According to the foregoing method, the thick film reinforcing tape is made to adhere to the thin film insulating tape, so that the insulating tape is reinforced. Besides, transport and position adjustment of the insulating tape can be executed with use of the first holes formed in not only the reinforcing tape but also the insulating tape. Therefore, in the case where the thin film insulating tape is transported and the like in the process of fabrication of a semiconductor device that can be bent when used, the work of transport and the like is executed in a good state.
Furthermore, wide areas can be used for adhesion of the insulating tape to the reinforcing tape, thereby further improving the workability in the process of fabrication.
Furthermore, since fourth holes are formed, after each semiconductor element and each wire pattern connected therewith are cut out as a semiconductor device, a step of removing the reinforcing tape from each semiconductor device is unnecessary. Therefore, the process of fabrication can be simplified. Moreover, separation of the reinforcing member from the insulating tape is unnecessary in the process of fabrication, resulting in that the process of fabrication is further simplified.
Furthermore, by using as the reinforcing tape a tape with a width equal to that of a standardized TCP-use tape, the conventional facilities used for fabrication of the conventional TCPs can be used for fabrication of the semiconductor apparatuses of the present invention.
To achieve the aforementioned object, a reinforcing tape of the present invention is a reinforcing tape in a belt form, which is made to adhere to a belt-form insulating tape so as to be laminated thereon, to reinforce the insulating tape in a manufacturing process, and has second holes used for removing a part of the reinforcing tape from the insulating tape after the adhesion.
With the foregoing configuration wherein the reinforcing tape has the second holes for separation use, it is possible to remove the reinforcing tape from the insulating tape along the lines of the separation-use second holes, after installation of the semiconductor elements on the insulating tape in the process of fabrication (or before such step). Therefore, after each semiconductor element and each wire pattern connected therewith are cut out as a semiconductor device, a step of removing the reinforcing tape from each semiconductor device is unnecessary. Therefore, the process of fabrication can be simplified.
For a fuller understanding of the nature and advantages of the invention, reference should be made to the ensuing detailed description taken in conjunction with the accompanying drawings.

Semi-conductor apparatus, a method of fabrication of the same, and a reinforcing tape used in fabrication of the same


A 3-layer acoustic insulator system includes an acoustic de-coupler layer, a film acoustic barrier layer connected to the de-coupler layer, and a microfiber acoustic absorber layer connected to an opposite side of the barrier film layer as the acoustic de-coupler layer. The acoustic de-coupler layer is positioned in direct contact with a vehicle component and mimics the geometry of the vehicle component. The acoustic absorber layer is positioned on a passenger compartment facing side of the vehicle component.

This section provides background information related to the present disclosure which is not necessarily prior art.
Vehicle manufacturers in the past relied on two layers of foam and/or "shoddy" material built up for lightweight constructions, in thicknesses of approximately one-fourth inch to multiple inches, which were applied in a blanket form to cover surface areas of the vehicle, such as the engine firewall and transmission tunnel, to attenuate vehicle and road noise entering the vehicle passenger compartment. When fuel economy concerns were not as stringent and higher horsepower engines were used, the attenuation systems could be thicker, increasing both their weight and thereby their noise attenuation capability, without significant impact on vehicle performance. As vehicle mile-per-gallon fuel rates have increased and horsepower ratings have decreased, attenuation system weight allowances have necessarily decreased, forcing attenuation system manufacturers to use lighter weight materials. Attenuation system weight has subsequently decreased, but at a tradeoff with acoustic attenuation achieved. It has therefore become desirable to provide acoustic attenuation systems that provide attenuation levels similar to the prior thicker/heavier designs while providing the benefits of reduced weight.