An SRAM cell eliminates the p-channel pull-up resistors to decrease its physical size. A tracking circuit generates a control signal used to ensure that the memory state is preserved during the idle state. The control signal controls the wordline voltage during the idle state to vary the leakage through the access transistors to ensure that current into the node through the access device is not exceeded by leakage current out of the output nodes through the storage devices. The tracking circuit control signal can also be used to vary the well to substrate bias voltage of the storage devices to decrease the leakage through the storage devices. The control signal can also be used to bias the supply rail voltage to which the storage devices are directly coupled to decrease the amount of leakage through the storage devices. The tracking circuit comprises a number of half configured memory cells that are placed in a state which mimics the stored state in a normal memory cell that would degrade during the idle state. A differential amplifier detects when the output state of the dummy cells have fallen below a predetermined reference voltage. The differential amplifier generates the control signal at a level required to restore the output state to at or near the reference voltage.

1. Technical Field of the Invention
This invention relates to memory circuits, and more particularly to SRAM memory circuits.
2. Description of Related Art
As a result of the never-ending quest to integrate more circuitry onto a single integrated circuit, designers are driven to find ways in which to increase the density of their circuit designs. The goal of integrating entire systems on a chip (SOC) has resulted in the motivation to include more memory capacity for those systems, particularly in view of the speed advantage in accessing integrated memory rather than off-chip.
One of the ways in which circuitry in general has become more dense is to simply shrink the circuitry photolithographically. Although steady gains in the ability to further shrink feature sizes has been beneficial, the rate at which such gains are being made has tapered off recently. Another technique for making circuits smaller is to eliminate devices from the circuit design. This can reduce not only the silicon real estate occupied by the circuit devices, but also the additional interconnect typically required for those devices.
With respect to memory cells, and SRAM cells particularly, attempts have been made to reduce their gate count while maintaining proper performance and reliability. FIG. 1 illustrates a standard prior art SRAM cell. Access transistors 30 and 14 isolate the cell and selectively access the cell during read and write operations. Transistors 9 and 7 are storage transistors that effectively store a binary one and zero state on the Q 28 and Qbar 18 output nodes of the cell. The storage transistors can be pull-up or pull-down transistors, depending upon the design of the cell. In the case of the cell in FIG. 1, they are pull-down transistors. The state of the cell is programmed during a write operation, and then isolated by the access transistors. The bi-stable nature of the storage devices is designed to hold the state until it is flipped by a write of an opposite polarity.
The P-channel transistors 24, 20 perform two functions in the cell of FIG. 1. First, they can assist a change of state to VDD during a write operation that is flipping the state of the cell. The second function is to supply charge to nodes 28 and 18 during the idle state. By doing so, they effectively replenish charge lost from isolated nodes 28 and 18 (whichever is at VDD) due to leakage through the pull-down storage transistors 9, 7. Although access transistors can and do provide some replenishing charge to nodes 28 and 18 (whichever is at VDD) through leakage current of their own, the magnitude of the leakage they provide by itself is not guaranteed to be sufficient to exceed the outflow from output nodes 28, 18, which is required to maintain the VDD state.
One way to shrink a cell such as the one in FIG. 1 is to replace the p-channel pull-ups 24, 20 with resistors. This can provide some additional density if the resistors can be implemented on a separate integrated circuit processing layer such that the resistors can overlap the cell transistors. Another solution is to simply eliminate the pull-up transistors altogether. The assistance they provide in flipping the cell state is not absolutely necessary, and in fact while one is helping, the other is actually resisting the change in state on the other side of the cell, increasing the power dissipation and write time of the cell. It is because the pull-ups are always the weakest of the three types of devices that the cell operates correctly. However, if the pull-up transistors are eliminated, there must be another way to ensure that the leakage provided by the access transistors is not exceeded by the leakage out of the nodes 28, 18, or the VDD state on one of the output nodes will deteriorate over time. This is difficult because the proper operation of the cell requires that the storage device be the largest and therefore the strongest in terms of current.
As a result, eliminating the p-channel devices as a solution to shrinking the memory cell has met with varying success. Some additional important points with regard to the operation of the SRAM cell of FIG. 1 should be noted. There is a hierarchy with respect to the relative strength of the devices in the SRAM cell. Storage transistors 9 and 7 should be the strongest transistors. Slightly less strong are the access transistors 30, 14. The weakest transistor will be the P-channel pull-up transistors 24, 20. The reason that the storage transistors 9, 7 must be stronger than the access transistors 30, 14 is that during a read operation, the access transistor 30, 14 should not be so strong as to disturb the state of the SRAM cell during the read. This is referred to as the beta ratio which is the ratio of relative strength between the pull-down transistors 9, 7 and the access transistors 30, 14. Typically, a beta ratio of greater than 1.5 is desirable to ensure that the cell is stable and will not be disturbed during a read access. This ratio virtually assures that the leakage supplied by the access transistor will not exceed the leakage through the storage devices.
Therefore, there is still a need in the art for SRAM cells that are as device efficient as possible, while still providing optimal and reliable performance.
An embodiment of a dense memory cell in accordance with the invention includes two access transistors, each having a gate tied to a wordline input, a first one of the access transistors having a drain and source coupled between a bit line and an output node. The cell further includes two storage transistors, a first one having a drain and source coupled between the output line and a power signal and a gate couple to an output bar node, the second one having a drain and source coupled between the output bar node and the power rail, and a gate coupled to the output node. The cell also has a control circuit generating a tracking voltage coupled to the wordline, the track voltage for adjusting the voltage on the wordline during an idle state to ensure that leakage current through the two access transistors exceeds the leakage through the two storage transistors where the output node to which it is coupled is at VDD. The track voltage is a function of a reference voltage determined to provide a leakage through the access transistors that exceeds the leakage through the storage devices. The tracking voltage is buffered to substantially reduce disturbances to a reference voltage resulting from switching states on the wordline.
An embodiment of tracking circuit that generates the tracking voltage is a reference circuit, the reference circuit that includes a plurality of partial memory cells, each partial memory cell comprising one access transistor and storage transistor configured in a worst case leakage condition. It includes a differential amplifier having a voltage reference input and a second input coupled to an output node of each of the partial memory cells, the output of the differential amplifier being the tracking voltage.
An embodiment of the memory cell of the invention includes two access transistors, each having a gate tied to a well bias input, a first one of the access transistors having a drain and source coupled between a bit line and an output node, and two storage transistors, a first one having a drain and source coupled between the output line and a power signal and a gate couple to an output bar node, the second one having a drain and source coupled between the output bar node and the power signal, and a gate coupled to the output node. A control circuit generating a tracking voltage is coupled to the well bias. The track voltage for adjusting the voltage on the well bias during an idle state ensures that leakage current through the two access transistors exceeds the leakage through the two storage transistors where the output node to which it is coupled is at VDD.
An embodiment of the memory cell of the invention includes two access transistors, each having a gate tied to a power signal input, a first one of the access transistors having a drain and source coupled between a bit line and an output node. It further includes two storage transistors, a first one having a drain and source coupled between the output line and the power signal and a gate couple to an output bar node, the second one having a drain and source coupled between the output bar node and the power rail, and a gate coupled to the output node. It further includes a control circuit generating a tracking voltage coupled to the power signal, the track voltage for adjusting the voltage on the power signal during an idle state to ensure that leakage current through the two access transistors exceeds the leakage through the two storage transistors where the output node to which it is coupled is at VDD.


A vortical energy wind apparatus translates wind gusts to vertical air streams that disrupt the streams of air in the atmosphere that pose high tornado-risks. The apparatus comprises a lower half-spheroid part and an upper half-spheroid part both placed by their convexities to each other. A toroidal-shaped axial-symmetric core has a set of curved blades attached to the core. Streams of air penetrate a rotary wheel inside it, and the blades attached to the core rotate the wheel. Essentially, the upper part acts like an upside-down wing at streamlining the wind and an exit hole centered at a top of the upper part provides means for the vortical stream of air to leave the apparatus.

1. Field of the Invention
The present invention relates generally to an apparatus for and a method of generating a vertical stream of air with a predefined and regulated vorticity.
2. Description of the Related Art
Thirty years ago, new phenomena in hydrodynamics forced a reexamination of the entire approach to the efficacy problem in stream energy-conversion processes. The central problem was to overcome the losses of energy on turbulence. The solution was found in a study of laminar flow, which is based on the premise that fields of velocity of any stable flow are determined in local if the source of energy, the boundary walls, and the free surfaces are all known. It was concluded that a continuous medium guarantees streamlines of flow; therefore, certain stream machines were projected and created.
A formula for a stationary tornado stream was discovered in 1986 to describe laminar circular rotation of outlaying flow of viscous fluid. The formula promoted further development of technologies to enclose tornadoes into tornado chambers, also known as the tornado-stream technique. Certain boundary walls are chosen, s. a., hyperboloids, that outlay flows through the areas created therein. Entrance and exit surfaces normal to the axis of symmetry are specific features of these chambers that effect the flow of working fluids.
The present invention is a novel tornado-stream chamber: natural wind gusts enter the chamber between a lower half-spheroid part and an upper half-spheroid part that are placed by their convexities towards each other. The wind stream flows upwards through the boundary walls created by a toroidal-shaped axial-symmetric core and hyperbolic inner surface of the half-spheroid upper bowl. Essentially, the upper part acts like an upside-down wing at streamlining the wind. The wind exits the apparatus through the hole centered at the top of upper half-spheroid part of the apparatus.
The present invention solves a long-felt need for a type of tornado-stream chamber that converts wind gusts to vertical air streams that are able to disrupt streams of air in the atmosphere that pose high tornado-risks.


An automatic loader has a vibrational feeding assembly for vibrationally feeding ferrules to a loader of a ferrule assembling machine. The vibrational feeding assembly has a frame for containing the ferrules and a guide channel having a transport surface along which the ferrules are vibrationally transported from the frame to the loader of the ferrule assembling machine. A detecting device detects an orientation of each ferrule while the ferrule is vibrationally transported along the transport surface of the guide channel. An expulsion device expels the ferrule back to the frame of the vibrational feeding assembly when the orientation of the ferrule detected by the detecting device does not correspond to a preselected orientation of the ferrule.

1. Filed of the Invention
This invention concerns an automatic loader of ferrules for brushes as set forth in the main claim.
The invention is applied in the production of brushes, particularly to feed the ferrules in a desired and correct manner to the ferrule-assembling machine located downstream of the loader, wherein the bundle of bristles, and possibly also the handle, is associated with the ferrules.
The invention is applied to brushes of the flat type where the ferrule consists of a band of metal strip closed in a ring of whatsoever shape, either rectangular, round, polygonal, etc.
2. Background Information
Ferrule-assembling machines are known in the brush industry, which are fed separately by bundles of bristles, which constitute the terminal end of the brush, and by ferrules on which the bundles of bristles are attached, normally by means of glueing.
The ferrules are made by closing a band of metallic strip in a ring-shape, then super-imposing and crushing the edges along one of the narrow sides so as to constitute an outer closing projection.
The ferrules generally bear perimeter ribs and writings to identify the brush such as size, brand name, type of bristle or other information in order to define a univocal position wherein the bundle of bristles and the handle are assembled.
The function of the ribs is to stiffen the ferrule but they also function as an element to anchor the adhesive substance, for example the rubber cement, which is used to attach the bundle of bristles to the ferrule.
It is the presence of these ribs which determines univocally the side of the ferrule where the bundle of bristles will be inserted and the side of the ferrule, opposite the first, where the handle of the brush will be inserted.
At present, the operation of feeding the ferrules into the loader of the ferrule-assembling machine is performed manually by a worker who positions them one by one in the only correct feeding position inside the loader.
This manual operation takes a long time and involves a considerable increase in the costs of the operation of assembling the brushes.
To be more exact, the fact that the worker must be present conditions the productivity of the ferrule-assembling machine which, for this reason, is slowed down; this signifies that the full potential of the machine is not exploited and therefore businessmen working in this field have been complaining of this problem for some time.
To overcome this problem and to automate the step of feeding and loading the ferrules to the ferrule-assembling machine there has been a proposal to combine, upstream of the ferrule-assembling machine, a vibrator-feeder device to feed the ferrules automatically, separating them one by one and sending them towards the feeder zone of the ferrule-assembling machine.
This feeder device has the disadvantage that it cannot make a distinction between the side of the ferrule which will cooperate with the bundle of bristles and the side of the ferrule wherein the handle of the brush will be inserted.
In order to overcome this problem, the feeder device can be used only with particular ferrules of a symmetrical type, which increases costs due to the production of the particular ferrules and moreover it means that non-specialised ferrules obviously cannot be used.
The present applicant has designed, tested and embodied this invention to overcome the shortcomings of the state of the art, and to provide further advantages.
The invention is set forth and characterised in the main claim, while the dependent claims describe variants of the idea of the main embodiment.

Automatic loader of ferrules for brushes


A laser oscillator is disclosed by means of current excitation by using a light-emitting element containing an organic matter. The present invention is a semiconductor device oscillating laser by current excitation comprising a light-emitting element having a laminated body which is formed by stacking sequentially a first layer made from an organic matter, a second layer containing an organic matter and a metal compound, and a third layer made from an organic matter interposed; and a first electrode and a second electrode formed over a substrate, the electrodes interposing the laminated body therebetween; wherein the organic matter contained in the second layer includes at least a light-emitting material.

1. Field of the Invention
The present invention relates to laser equipment employing a light-emitting element made from a material containing an organic mater, and more particularly such a current excitation organic laser oscillator.
2. Related Art
Solid laser has characteristics of high output, high efficiency, high energy storage properties, wide wavelength variable characteristics, and being small, and so the solid layer has a wide application field. Among all, semiconductor laser has main features of being small, lightweight, and having a small threshold value. Semiconductor laser employing inorganic semiconductor had already been developed and put into practice in many fields.
If laser oscillation employing an organic compound is realized, characteristics which cannot be obtained from inorganic semiconductor laser can be given the laser employing an organic compound. The characteristics are the following: for example, flexible laser can be manufactured based on flexibility of a material, a manufacturing process can be simplified, costs can be reduced, and a manufacturing process is diverse (a vapor deposition method, a spin coating method, a printing method, a dip coating method, or the like can be applied), and the like. An outline of laser employing an organic compound material is compiled in a non patent document 1.
As a typical light-emitting element which makes a material containing an organic material emit light, a light-emitting element which emits light by applying an electric field is known. The element is composed of a material containing an organic material interposed between a pair of electrodes, and is formed by stacking functioning layers referred to as a hole transporting layer, a light-emitting layer, and an electron transporting layer. The element emits light by applying voltage between the electrodes to inject electrons and holes to the light-emitting layer. A range of wavelengths of light emission can be varied depending on kinds of materials used for the light-emitting layer or kinds of guest materials to be added.
Non patent document 1: Nir Tessler "quot; Lasers Based on Semiconducting Organic Materials", Adv. Mater., 1999, 11, p. 363-370
If laser is manufactured by using such the light-emitting element containing an organic material, the laser can be easily enlarged and manufacturing costs can be reduced. Current excitation laser can be easier controlled than light excitation laser, and so whole laser equipment can be downsized.

Semiconductor Energy Laboratory Co., Ltd.


A semiconductor device includes a first conductive layer, a first insulating layer over the first conductive layer, first and second oxide semiconductor layers over the first insulating layer, a second conductive layer over the first oxide semiconductor layer, a third conductive layer over the second oxide semiconductor layer, a fourth conductive layer over the first oxide semiconductor layer and the second oxide semiconductor layer, a second insulating layer over the second conductive layer, the third conductive layer, and the fourth conductive layer, a fifth conductive layer electrically connected to the first conductive layer over the second insulating layer, and a sixth conductive layer over the second insulating layer. Each of the first and fifth conductive layers includes an area overlapping with the first oxide semiconductor layer. The sixth conductive layer includes an area overlapping with the second oxide semiconductor layer.

1. Field of the Invention
The technical field relates to a semiconductor device.
2. Description of the Related Art
Patent Document 1 discloses a semiconductor device including a transistor.
Paragraph 0012 in Patent Document 1 discloses the following: "it is said that a substance containing a hydrogen element is an element which prevents an oxide semiconductor layer from being highly purified so that the oxide semiconductor layer is not close to an i-type oxide semiconductor layer because a hydrogen element has two factors of inducing carriers".
Paragraph 0013 in Patent Document 1 discloses the following: "as a substance containing a hydrogen element, for example, hydrogen, moisture, hydroxide, hydride, and the like can be given".
Patent Document 1 also discloses that, when a substance containing a hydrogen element is contained in an oxide semiconductor layer of a transistor, the threshold voltage of the transistor shifts in a negative direction.

This patent is subject to a terminal disclaimer.

Semiconductor device having an effective use of the conductive layer formed in the same process as one electrode


A driving force distribution control device for a four wheel drive vehicle having a mechanism that distributes the torque of an engine, which is transmitted to a main drive wheel, to a secondary drive wheel determines a first torque to be distributed to the secondary drive wheel on the basis of the engine torque, and corrects the determined first torque on the basis of a yaw rate deviation between a target yaw rate and an actual yaw rate of the vehicle. When an absolute value of the yaw rate deviation is equal to or greater than a predetermined value, the mechanism is controlled on the basis of the corrected torque.

In a four wheel drive vehicle, a mechanism including a torque distribution clutch, a generator and a motor is known as a mechanism that distributes a torque of an engine, which is transmitted to a main drive wheel, to a secondary drive wheel. In a four wheel drive vehicle having the torque distribution clutch, an engaging force of the clutch is determined on the basis of a rotation speed difference between a front wheel and a rear wheel. Further, in a related art, a correction coefficient is determined on the basis of a deviation between a target yaw rate and an actual yaw rate, and a torque distribution clutch is controlled on the basis of a corrected clutch engaging force determined by multiplying the clutch engaging force by the correction coefficient (see JP5-278490A).

Driving force distribution control method and device for four wheel drive vehicle


Method and apparatus for toggling service options after completion of call setup, is disclosed for use in a wireless communication system. A service option preferred by the base station (30, 32) or other portion of the system infrastructure is compared to service option capabilities of the mobile station (26) requesting service. If the mobile station (26) is capable of accommodating the service option preferred by the base station (30, 32), a service connect message (64) is sent to the mobile station (26) to initiate toggling of the service option.

The present invention pertains to improved service in mobile communication systems, and more particularly to service changes carried out under base station control to implement a base station""s preferred service option assignment.
In current wireless communication systems, a mobile station and its supporting infrastructure equipment are able to negotiate with one another to reach a particular service configuration. This process is typically referred to as a service negotiation procedure. Such negotiation is necessary, for example, because a mobile station may request certain services which are not supported by the base station or other infrastructure equipment. To implement the service negotiation procedure, the services are assigned service options, and within the infrastructure equipment, a plurality of different transcoders may be associated with different service options. When communication between the base station and the mobile stations is established, only one type of transcoder within the infrastructure equipment is assigned to the particular combination. If, during the communication, the mobile station requests a different type of service to be implemented, a new service negotiation procedure is implemented to fulfill the request.
However, a commercially significant problem arises when the base station or other infrastructure equipment is not efficiently used. For example, less efficient service options are often invoked by mobile stations which are pre-programmed to request a lesser service option which is more likely to be accommodated by the largest number of base stations likely to be encountered. Thus, a need exists for more efficient service option procedures and the equipment for carrying out such procedures. It would be desirable to provide base stations of mobile communication systems with improved control after call setup so as to move the mobile subscriber to a service option pre-determinedly preferred by the base station, while the call is in a steady/conversation state.

Mobile communication system with improved base station control


A fuel cell system according to the present invention comprises a hydrogen generator including a burner which is detachably accommodated in the hydrogen generator in a manner to allow the burner to be detached from and attached to the hydrogen generator through the top of the hydrogen generator, a stack configured to generate power by causing hydrogen generated by the hydrogen generator and an oxidizing gas to react with each other, and a main body package which includes at least a top plate and within which the hydrogen generator and the stack are disposed. Detachable piping, which is detachably configured, is provided above the hydrogen generator. Space that is formed above the burner when the detachable piping is removed from the main body package has a size larger than or equal to the size of the burner.

Conventional fuel cell systems include: a reformer configured to generate hydrogen gas (fuel gas) from a natural gas or the like; a fuel cell configured to generate power through an electrochemical reaction between the hydrogen gas and oxygen (air) acting as an oxidant (hereinafter, the fuel cell may be referred to as a stack, as necessary); a power conversion circuit configured to convert electrical energy generated by the stack into a voltage/frequency for commercial use (hereinafter, the power conversion circuit may be referred to as an inverter, as necessary); a ventilator configured to ventilate a package; and auxiliary devices (accessories) for allowing the stack and the reformer to operate smoothly. These devices are disposed within the package (see Patent Literature 1, for example).
FIG. 6 is a schematic diagram showing a schematic configuration of a fuel cell apparatus disclosed in Patent Literature 1.
As shown in FIG. 6, the fuel cell apparatus disclosed in Patent Literature 1 includes: a package 101; a fuel reforming device 102; a fuel cell 103; an electric control device 104 including an inverter; accessories 105; and a ventilation fan 106 serving as a ventilator for introducing external air into the package 101.
Within the package 101, the accessories 105 are disposed at the lowermost position. The fuel reforming device 102 and the electric control device 104 are arranged side by side above the accessories 105. The fuel cell 103 is disposed above the electric control device 104. The ventilation fan 106 is disposed, above the fuel reforming device 102, at a side face of the package 101.
The fuel reforming device 102 includes: a reformer configured to generate a hydrogen gas from a reforming reaction between water (steam) and a raw material gas such as a natural gas; and a burner for heating the reformer. The burner is a component which requires maintenance. Therefore, the burner is configured such that the burner is detachable from the reformer. Generally speaking, the burner has a length that is similar to the overall length of the reformer so that the burner can heat a wide area within the reformer, and the burner is detachably configured so that the burner can be inserted into or removed from the fuel reforming device 102 through the top of the reformer.
There is a very strong demand particularly for household fuel cell systems to be compact in size so that they can be installed in various houses having a wide variety of structures. Therefore, in general, in fuel cell systems, space between the components is reduced as much as possible, and thereby the fuel cell systems are configured to be compact in size.    PTL 1: Japanese Laid-Open Patent Application Publication No. 2003-229148

Fuel cell system and method for performing maintenance on fuel cell system

Panasonic Intellectual Property Management Co., Ltd.


A super wide angle lens substantially consists of a positive first lens group in which a positive first lens, a negative second lens, a negative third lens, a negative fourth lens, a positive fifth lens, a sixth lens unit that is a cemented lens, a seventh lens, an aperture stop, and an eighth lens unit that is a cemented lens are arranged in this order from an object side, a second lens group in which a first lens unit that is a positive single lens or a cemented lens and a second lens unit that is a cemented lens are arranged in this order from the object side, and a third lens group including a positive lens. The super wide angle lens is structured in such a manner to satisfy conditional formula (1): 0.8<(T16+T17)/f<2.5.

1. Field of the Invention
The present invention relates to a small-size super wide angle lens with high performance usable in a digital camera, a camera for broadcasting and a camera for shooting a movie.
2. Description of the Related Art
Conventionally, imaging lenses with full angles of view: 2ω exceeding 80 degrees were proposed.
For example, Japanese Patent Publication No. 5(1993)-074806 (Patent Document 1) discloses a super wide angle lens with an angle of view exceeding 94 degrees. Further, Japanese Unexamined Patent Publication No. 8(1996)-094926 (Patent Document 2) discloses a super wide angle lens with an angle of view of 102.2 degrees in which chromatic aberrations are excellently corrected. Further, Japanese Unexamined Patent Publication No. 2004-219610 (Patent Document 3) proposes a rear-focus-type super wide angle lens with an angle of view of 88.7 degrees.

Super wide angle lens and imaging apparatus using it


A system and method for improving the gripping surface of the handle of a manual tool, implement, or instrument. In a preferred embodiment the present invention includes one or more elastomeric bands stretched over the handle of the tool, implement, or instrument. A shrinkable sleeve is then placed over the bands and shrunk tightly over the handle. The result is a ribbed gripping surface on the handle to improve gripability of the tool, implement, or instrument. In another preferred embodiment, adhesive is used to secure the elastomeric band to the handle before shrinking the sleeve to improve precision in the placement of the rings and durability of the finished gripping surface.

1. Field of the Invention
The present invention relates to a system and method for improving the gripping surface of a hand tool handle or implement. More particularly, but not by way of limitation, the invention provides a method for applying a rubber-like gripping surface on a drum stick, tool, or other implement, without significantly increasing the diameter of the handle.
2. Background of the Invention
Hand tools with wood, fiberglass, or even metal handles are well known in the art. Other implements, such as drumsticks, sporting equipment handles with similar gripping surfaces are likewise quite common. A trait of such tools is that the gripping surface of the handle is some what slick to start our with but becomes even more problematic as the user tires, the user's hands become sweaty, or the user fatigued. In such situations, tools are known to dangerously slip from the user's hand. In fact wooden implements may become even slicker over time as the user's hand wears the surface smoother and as skin oils are absorbed into the implement.
The problem is well recognized and there are a few solutions available. For example, hammers are commonly available with a fiberglass handle having a rubber grip. Many craftsman prefer wood handles over fiberglass handles and there are few options for applying grips to handles which have been manufactured without such a grip.
One solution sometimes employed is to dip the handle in a solution that leaves a rubbery coating over the grip. This solution has not been well received for a number of reasons. The technique requires a person to buy much more of the solution than is actually applied to achieve the dipping process, the material does not always adhere well and may actually make a tool more dangerous, the material runs to the lowest part of the handle and usually creates a "bump" in the handle at the lowest point, the process can objectionably increase the diameter of the gripping surface, and many materials "grow" with use and become loose on the handle. Such materials may also eventually shred, causing hand blistering.
In relation to drumsticks, percussion mallets, and the like, musicians have long preferred wooden implements, whether because of mass of the implement, the subjective feel, the sound produced by wood versus other materials, or simply even tradition, such implements can become quite slippery when the musician's hands become sweaty. To produce certain percussion effects, the musician may actually need a light grip on the implement, further compounding the problem.
It is thus an object of the present invention to provide a system and method for improving the gripping surface of a tool or implement which provides a secure gripping surface, is relatively inexpensive, easily applied and does not significantly increase the diameter of the handle.

System and method for handle grip improvement


During operation of a vending machine, a dispensed product moves from a product dispensing location to a product retrieval location. To detect movement of the dispensed product to the dispensing location, the intensity of light at an array of pixels is monitored. The monitored array of pixels forms a portion of a larger group of pixels. A change in the intensity of light at pixels in the array of pixels is detected upon movement of a dispensed product to a product retrieval location.

The present invention relates to a new and improved method and apparatus for use in a vending machine which dispenses products to customers.
Vending machines have been utilized to provide various snacks, beverages and other products to customers. When a customer has selected a product, the customer inserts money or a credit card into the known vending machine. In addition, the customer actuates a selection switch panel to indicate the location of the product which has been selected. When this has occurred, a dispensing device for the selected product is operated. The selected product then moves from a dispensing location to a product retrieval location. The customer manually retrieves the product at the product retrieval location.
During the use of these known vending machines, there is a possibility of a failed transaction. In a failed transaction, the machine attempts to dispense a product selected by a customer but fails to have the product move to the product retrieval location where it is accessible to the customer. In such a situation, the machine may assume that the selected product was dispensed and may not account to the customer for the product which failed to be dispensed.
Thus, after paying for the selected product, the customer may fail to receive the product. This may result in the customer becoming frustrated with the vending machine. Frustrated customers result in poor relations between the company operating the vending machine and the customer and may adversely affect sales from vending machines.
To prevent customers from becoming frustrated at a failure of a vending machine to dispense a selected product to a product retrieval location, devices have been provided to detect when a selected product moves to a product retrieval location. Known vending machines having devices to detect when a product moves to a product retrieval location are disclosed in U.S. Pat. Nos. 6,920,372; 7,191,034; and 7,286,901. In addition, such a device is disclosed in United States Published Patent Application 2008/0033596.
One of the draw backs of these known dispensed product detection devices is the cost of installing the devices in a vending machine. Accordingly, it is desirable to minimize the cost of a dispensed product detection device used in a vending machine. It is also desirable to facilitate installation of a dispensed product detection device in a vending machine.

Method and apparatus for use in a vending machine


A high flow EGR system for an internal combustion engine having a pair of series connected EGR coolers and a water droplet condensation collector and reservoir connected to the gas flow. The reservoir feeds a pump which is actuated to inject the liquid to the engine adjacent each cylinder for uniform distribution of the water to the engine cylinders. The pump is controlled to inject the water at appropriate conditions during the engine operating cycle.

1. Field of the Invention
The invention relates to exhaust gas recirculation (EGR) systems in which significant quantities of exhaust gas are recirculated to the intake of an internal combustion engine.
2. Description of the Related Art
In the continuing quest to meet lower emissions levels for internal combustion engines, the use of ever increasing quantities of EGR has been proposed. In order to reduce the combustion temperatures and, therefore, the generation of oxides of nitrogen, percentages of up to 50% and higher have been implemented. In order to minimize the effect of the large quantities of exhaust gas recirculation, it has become necessary to significantly cool the exhaust gasses to a point that greatly increases their density and minimizes the effect on power and fuel consumption when combined with the combustion air for the engine.
One of the problems with a system of this type is that the moisture in the products of combustion reaches a point where the water condenses into droplets that can accumulate or puddle at random locations within the system. Depending upon the engine operating conditions, the random collection of droplets may be swept into the intake of one or more cylinders in an uneven manner. While the engine can function with this occurrence, it can cause excess oxides of nitrogen in some cylinders and increased smoke and hydrocarbons in other cylinders.
What is needed in the art, therefore, is an EGR system that recirculates high percentages of exhaust gas but avoids the uncontrolled ingestion of water droplets into the engine.


An adsorbent pouch assembly for removing gaseous contaminants and impurities from a gas stream. The assembly is particularly designed for non-adhesively mounting into the internal enclosure of a disk drive.

Adsorbent filters have a variety of uses, including uses in electronic equipment and chemical manufacturing and storage. For example, in the computer industry, adsorbent filters are used within the housings or casings of electronic devices to protect the electronic components from contaminants and impurities, such as water vapor, acid gases, and volatile organic compounds. For example, disk drives often include adsorbent filters within the enclosure of the disk drive and/or over an opening in the disk drive housing to protect the drive components and the disks from contaminants. Without such protection, these contaminants can lead to stiction, corrosion, and, in some instances, drive failure. Inclusion of an adsorbent filter improves the performance of the disk drive and extends its life. Typically, the adsorbent filter includes an adsorbent material, such as activated carbon or a desiccant, within the filter material. Pores within the filter allow contaminants to diffuse through the filter material and be adsorbed by the adsorbent material.
U.S. Pat. No. 5,593,482 discloses a thin compact adsorbent assembly for adhesively mounting in an enclosure such as a computer disk drive. This self-stick adsorbent assembly has a low profile container for selectively adsorbing gaseous components. The assembly comprises one or more layers of adhesive, one of which adheres the assembly to a surface of the disk drive. The assembly also includes one or more layers of adsorbent or reactant material and a layer of filter material.
As aerial densities continue to grow and flying heights between the disk and read head lessen, disk drives are becoming increasingly sensitive to contamination. Adhesively mounting a filter assembly on a surface of a disk drive enclosure may contribute to this contamination. For example, if the adhesively mounted filter assembly is removed or repositioned, the adhesive may leave an adhesive residue on the surface of the disk drive enclosure. If the adhesive is left exposed, the adhesive residue may outgas (or offgas). Outgassing includes the release and/or production of gaseous or other contaminants by the adhesive. Outgassing by the adhesive residue can produce additional contaminants that are introduced into the disk drive environment. Further, the residue may accumulate and retain particulate contaminants and dust. These contaminants, or the adhesive itself, could loosen, flake, or become dislodged, providing debris in the disk drive enclosure. This debris can permanently damage a disk drive. To eliminate or reduce the contaminants caused by the adhesive residue, the adhesive residue may be removed and the surface cleaned. A solvent may be needed to thoroughly clean the surface of adhesive; however, these solvents may also cause contamination that can damage the drive assembly. Gaseous contaminants, similar to those produced by the adhesive residue outgassing, are also produced by solvents used to remove the residue.
In addition to eliminating or reducing contaminants caused by adhesive, eliminating the adhesive residue on the disk drive enclosure also greatly reduces the number of disk drive assemblies that might be thrown away. Disk drive assemblies are often discarded if the filter is mounted incorrectly because it is easier, less expensive, and/or results in less contamination to get a new assembly than to clean the contaminated one.

Adsorbent pouch for removal of gaseous contaminants


A method of dispensing a user-determined length of sheet product from a roll of sheet product via a sheet product dispenser is provided. The method includes the steps of providing the roll of sheet product rotatably supported by the sheet product dispenser for dispensing sheet product therefrom, wherein the roll of sheet product rotates in response to a pull force applied to a tail portion of the roll of sheet product; and providing, via the sheet product dispenser, a pull force resistance opposing the rotation of the roll of sheet product, wherein the pull force resistance is between 36 grams-force and 96 grams-force throughout a majority of a life of the roll of sheet product.

Various types of sheet product dispensers are known in the art, including dispensers configured to allow a user to obtain a user-determined length of sheet product from a roll of sheet product supported by the dispenser. According to certain configurations, sheet product dispensers may be relatively simple mechanical devices including a roll support mechanism configured to rotatably support the roll for dispensing sheet product therefrom. During use of such dispensers, the user may grasp a "tail" portion (i.e., an exposed free end portion) of the roll and apply a pull force thereto sufficient to rotate the roll about the roll support mechanism and unwind a length of sheet product from the roll. The user may separate the unwound length of sheet product from the roll by tearing the sheet product along a predefined area of weakness, such as a line of perforations, or elsewhere as desired.
Some conventional sheet product dispensers may provide insignificant resistance opposing the pull force applied by the user and thus may allow "free-wheeling" of the roll of sheet product as it rotates about the roll support mechanism. In this manner, due to inertia, the roll may continue to rotate well after application of the pull force and well beyond a point necessary to unwind an adequate or intended length of sheet product, resulting in user frustration. Upon over-rotation of the roll, the user may rewind a portion of the sheet product or may simply separate the entire unwound length of sheet product. Ultimately, such dispensers may provide an undesirable user experience and/or may cause the user to knowingly or unknowingly dispense excess sheet product, resulting in considerable waste and increased cost to a provider of the sheet product.
Other conventional sheet product dispensers may provide significant resistance opposing the pull force applied by the user and thus may reduce or prevent free-wheeling and over-rotation of the roll of sheet product. However, the resistance may be intermittent and may vary significantly as the roll of sheet product rotates during a single use occasion, resulting in user frustration. Furthermore, the resistance may vary significantly over a life of the roll, as an outer diameter of the roll decreases, resulting in inconsistent user feel and perception from one use occasion to another. Ultimately, such dispensers may provide an undesirable user experience and may cause the user to knowingly or unknowingly dispense excess sheet product, resulting in considerable waste and increased cost to a provider of the sheet product.
There is thus a desire for improved sheet product dispensers and related methods for reducing sheet product usage and for improving user experience.

Sheet product dispensers and related methods for reducing sheet product usage


An apparatus to be inspected is mounted on one surface of a socket board. An auxiliary inspecting apparatus for adjusting timing of write signals transmitted from a semiconductor inspecting apparatus is mounted on the other surface of the socket board. Input/output (I/O) pins of the auxiliary inspecting apparatus are connected to corresponding I/O pins of the inspected device via through holes in the socket board on a one-to-one basis. This semiconductor inspecting method is thus capable of easily suppressing the delay difference between a plurality of signals output from the semiconductor inspecting apparatus.

1. Field of the Invention
The present invention generally relates to a semiconductor inspecting method for inspecting a semiconductor integrated circuit device. More particularly, the present invention relates to a semiconductor inspecting method using a semiconductor inspecting apparatus.
2. Description of the Background Art
The semiconductor integrated circuit devices are subjected to evaluation test before shipment using a semiconductor inspecting apparatus, so that only the non-defective products are shipped.
FIG. 16 is a block diagram showing the schematic structure of a conventional semiconductor inspecting apparatus.
Referring to FIG. 16, the semiconductor inspecting apparatus 1 includes a main body 10 and a general-purpose board 20.
The general-purpose board 20 is connected to the main body 10 through connectors 70. The general-purpose board 20 is mounted for signal transmission between the main body 10 and a semiconductor integrated circuit device 50 to be inspected.
Each pad 31 of a socket board 30 is connected to the general-purpose board 20 through a coaxial cable 60. The general-purpose board 20 and the socket board 30 are replaced according to the type of the semiconductor integrated circuit device 50 to be inspected.
The semiconductor integrated circuit device 50 to be inspected (hereinafter, sometimes referred to as inspected device 50) is connected to the socket board 30 through an IC (integrated circuit) socket 40. The IC socket 40 electrically connects input/output (I/O) pins of the inspected device 50 to the pads 31.
The semiconductor inspecting apparatus 1 transmits a plurality of test pattern signals to the inspected device 50 as write signals. The inspected device 50 outputs read signals according to the write signals. The main body 10 receives the read signals from the inspected device 50 and determines whether the inspected device 50 is defective or not.
In recent years, rapid response to external circuit devices has been required for the semiconductor integrated circuit devices. In particular, a higher frequency has been increasingly used for the synchronous semiconductor integrated circuit devices operating in synchronization with an external clock signal. As a result, AC (alternating current) parameter values such as setup time, hold time and access time of the external clock signal and each control signal have been increasingly reduced.
Such an increased response speed of the semiconductor integrated circuit device requires that the semiconductor inspecting apparatus be capable of receiving and determining a high-frequency signal and also accurately adjusting the difference in timing of applying each signal to the inspected device (hereinafter, such a difference is referred to as skew).
One method for adjusting the skew is to adjust the skew on a pin-by-pin basis of the IC socket by using an oscilloscope and a reference comparator in order to accurately adjust the timing at the IC socket end connected to the semiconductor inspecting apparatus and the inspected device. In another method, pins of IC sockets are short-circuitted with each other, and delay difference of signals flowing between each of the short-circuitted pins is measured and adjusted by the semiconductor inspecting apparatus. The information on the adjustment result of such methods is stored in the semiconductor inspecting apparatus for use in semiconductor inspection.
Such skew-adjusting methods have variation in accuracy due to the difference between the environment upon adjusting the skew and the environment upon inspection. For example, if the ambient temperature of the semiconductor inspecting apparatus upon adjusting the skew is different from that upon inspection, characteristics of the circuitry within the semiconductor inspecting apparatus such as a timing generation circuit are varied.
One countermeasure against such variation in accuracy due to the environment is to use a cooling mechanism for circulating a liquid retained at an approximately constant temperature around the main circuitry in the semiconductor inspecting apparatus such as the timing generation circuit. This prevents temperature rise resulting from the effects of the ambient temperature of the semiconductor inspecting apparatus and the heat generated by the main circuitry itself in the semiconductor inspecting apparatus, thereby enabling accurate inspection by the semiconductor inspecting apparatus.
However, the aforementioned skew adjusting methods complicate the circuit structure of the semiconductor inspection apparatus, resulting in increased costs of the semiconductor inspection apparatus.
It is an object of the present invention to provide a semiconductor inspecting method capable of easily suppressing the delay difference between a plurality of signals output from a semiconductor inspecting apparatus.
According to one aspect of the present invention, a semiconductor inspecting system for inspecting a semiconductor integrated circuit device includes: a semiconductor inspecting apparatus; a socket board for mounting the semiconductor integrated circuit device thereon for inspection; and an auxiliary inspecting apparatus mounted on the socket board. The auxiliary inspecting apparatus includes a receiving circuit for receiving a plurality of write signals from the semiconductor inspecting apparatus, a timing adjustment circuit for adjusting timing of the plurality of write signals, an output circuit for outputting the write signals adjusted by the timing adjustment circuit to the semiconductor integrated circuit device, and an input/output (I/O) terminal for receiving and outputting the write signals.
Thus, timing adjustment of the write signals can be conducted in the auxiliary inspecting apparatus. This enables suppression of the delay difference between the write signals that are applied to the semiconductor integrated circuit device.
Preferably, the auxiliary inspecting apparatus further includes a determination circuit for determining whether a signal output from the semiconductor integrated circuit device in response to each write signal is a prescribed signal or not.
Thus, the determination can be made before the delay difference is produced between the signals output from the semiconductor integrated circuit device, thereby improving semiconductor inspection accuracy.
Preferably, the auxiliary inspecting apparatus is included in another semiconductor integrated circuit device having a same specification as that of the semiconductor integrated circuit device.
This enables one of the semiconductor integrated circuit devices to be used as an auxiliary inspecting apparatus in order to inspect a semiconductor integrated circuit device of a new standard. This eliminates the need to fabricate an additional auxiliary inspecting apparatus according to change in standard of the semiconductor integrated circuit device.
Preferably, the semiconductor inspecting system further includes an IC (integrated circuit) socket. The auxiliary inspecting apparatus is included in the IC socket. The IC socket includes a spring for enabling electric connection between the I/O terminal of the auxiliary inspecting apparatus and a corresponding I/O terminal of the semiconductor integrated circuit device. The semiconductor integrated circuit device is connected to the socket board through the IC socket.
This facilitates replacement of the semiconductor integrated circuit device. This also facilitates replacement of the auxiliary inspecting apparatus in the case of a failure.
According to another aspect of the present invention, a semiconductor inspecting system for inspecting a semiconductor integrated circuit device includes: a semiconductor inspecting apparatus; a socket board for mounting the semiconductor integrated circuit device thereon for inspection; and an auxiliary inspecting apparatus mounted on the socket board. The auxiliary inspecting apparatus includes a pattern generation circuit for generating a plurality of write signals, a determination circuit for determining whether a signal output from the semiconductor integrated circuit device in response to each write signal is a prescribed signal or not, and an input/output (I/O) circuit for outputting the write signals to the semiconductor integrated circuit device, outputting the determination result of the determination circuit to the semiconductor inspecting apparatus, and receiving the signals output from the semiconductor integrated circuit device.
Thus, the auxiliary inspecting apparatus outputs the write signals and determines the semiconductor integrated circuit device. By mounting the auxiliary inspecting apparatus near the semiconductor integrated circuit device, the delay difference between the write signals can be suppressed. Moreover, since the auxiliary inspecting apparatus determines the semiconductor integrated circuit device, semiconductor inspection accuracy is improved.
According to still another aspect of the present invention, a semiconductor inspecting method for inspecting a semiconductor integrated circuit device using a semiconductor inspecting system including a semiconductor inspecting apparatus and an auxiliary inspecting apparatus includes the steps of: mounting the auxiliary inspecting apparatus and the semiconductor integrated circuit device on a same socket board; outputting a plurality of write signals from the semiconductor inspecting apparatus to the auxiliary inspecting apparatus; adjusting timing of the plurality of write signals by the auxiliary inspecting apparatus; and receiving the adjusted signals by the semiconductor integrated circuit device.
Thus, timing adjustment of the write signals can be conducted in the auxiliary inspecting apparatus. This enables suppression of the delay difference between the write signals that are applied to the semiconductor integrated circuit device.
Preferably, the semiconductor inspecting method further includes the steps of: outputting a signal from the semiconductor integrated circuit device in response to each write signal; receiving the signal from the semiconductor integrated circuit device by the auxiliary inspecting apparatus; and determining by the auxiliary inspecting apparatus whether the signal output from the semiconductor integrated circuit device is a prescribed signal or not.
Thus, the determination can be made before the delay difference is produced between the signals output from the semiconductor integrated circuit device, thereby improving semiconductor inspection accuracy.
Preferably, the step of mounting the auxiliary inspecting apparatus and the semiconductor integrated circuit device on the same socket board includes the steps of (a) mounting the auxiliary inspecting apparatus on one surface of the socket board, and (b) mounting the semiconductor integrated circuit device on the other surface of the socket board. In the steps (a) and (b), an I/O terminal of the auxiliary inspecting apparatus is connected to a corresponding I/O terminal of the semiconductor integrated circuit device via a through hole.
Thus, the wirings required on the socket board can be minimized, enabling suppression of the signal delay difference resulting from the wiring length.
Preferably, the step of mounting the auxiliary inspecting apparatus and the semiconductor integrated circuit device on the same socket board includes the steps of connecting the auxiliary inspecting apparatus to the socket board through an IC socket, and connecting the semiconductor integrated circuit device to the socket board through an IC socket.
This facilitates replacement of the auxiliary inspecting apparatus or the semiconductor integrated circuit device.
Preferably, the step of mounting the auxiliary inspecting apparatus and the semiconductor integrated circuit device on the same socket board includes the step of (c) connecting the semiconductor integrated circuit device to the socket board through an IC socket including the auxiliary inspecting apparatus. In the step (c), an I/O terminal of the semiconductor integrated circuit device is connected to a corresponding I/O terminal of the auxiliary inspecting apparatus included in the IC socket.
This facilitates replacement of the semiconductor integrated circuit device. This also facilitates replacement of the auxiliary inspecting apparatus in the case of a failure.
According to yet another aspect of the present invention, a semiconductor inspecting method for inspecting a semiconductor integrated circuit device using a semiconductor inspecting system including a semiconductor inspecting apparatus and an auxiliary inspecting apparatus includes the steps of: outputting a test pattern from the auxiliary inspecting apparatus to the semiconductor integrated circuit device; outputting a signal from the semiconductor integrated circuit device in response to each write signal; receiving the signal from the semiconductor integrated circuit device by the auxiliary inspecting apparatus; determining by the auxiliary inspecting apparatus whether the signal output from the semiconductor integrated circuit device is a prescribed signal or not; and transmitting the determination result from the auxiliary inspecting apparatus to the semiconductor inspecting apparatus.
Thus, the auxiliary inspecting apparatus outputs the write signals and determines the semiconductor integrated circuit device. By mounting the auxiliary inspecting apparatus near the semiconductor integrated circuit device, the delay difference between the write signals can be suppressed. Moreover, since the auxiliary inspecting apparatus determines the semiconductor integrated circuit device, semiconductor inspection accuracy is improved.
According to a further aspect of the present invention, a semiconductor inspecting method for inspecting a semiconductor integrated circuit device using a semiconductor inspecting apparatus includes the steps of: (d) mounting on one surface of a socket board of the semiconductor inspecting apparatus the semiconductor integrated circuit device to be inspected; (e) mounting another semiconductor integrated circuit device on the other surface of the socket board, the another semiconductor integrated circuit device having a same specification as that of the semiconductor integrated circuit device and having been determined as non-defective; (f) outputting a plurality of write signals from the semiconductor inspecting apparatus to the semiconductor integrated circuit devices; and (g) receiving by the semiconductor inspecting apparatus a power supply current flowing through the semiconductor integrated circuit device in response to the write signals.
By using as a reference sample the semiconductor integrated circuit device having been determined as non-defective by inspection, accurate inspection can be conducted in a more simplified manner.
Preferably, the steps (d) and (e) include the step of connecting the semiconductor integrated circuit devices to the socket board through an IC socket.
This facilitates replacement of the semiconductor integrated circuit device.
According to the present invention, the auxiliary inspecting apparatus is mounted near the device to be inspected, and timing adjustment of the write signals is conducted in the auxiliary inspecting apparatus. This facilitates suppression of the signal delay difference resulting from the impedance of coaxial cables.
A non-defective inspected device may be used as a reference sample instead of the auxiliary inspecting apparatus. In this case as well, the signal delay difference can be easily suppressed.
The foregoing and other objects, features, aspects and advantages of the present invention will become more apparent from the following detailed description of the present invention when taken in conjunction with the accompanying drawings.

Semiconductor inspecting system for inspecting a semiconductor integrated circuit device, and semiconductor inspecting method using the same


Systems and methods described herein use pairing to associate a wireless sensor with a patient monitoring device such as a bedside patient monitor or a mobile device. A signal emitted by a patient monitoring device can be detected by a wireless sensor. The wireless sensor can be associated with the detected signal and pair the wireless sensor with the patient monitoring device. The wireless sensor can be configured to enter into a patient parameter sensing mode of operation after the association of the wireless sensor with the patient monitoring device.

In clinical settings, such as hospitals, nursing homes, convalescent homes, skilled nursing facilities, post-surgical recovery centers, and the like, patients are frequently monitored using one more different types of physiological sensors. Various types of sensors include a magnetometer that detects patient movement or orientation to track and prevent patient ulcers, a temperature sensor, an acoustic respiration sensor, an electrocardiogram (ECG) sensor, an electroencephalography (EEG) sensor, one or more pulse oximetry sensors, a moisture sensor, a blood pressure sensor, and an impedance sensor, among other sensors.
Wires leading to and from traditional physiological sensors inhibit patient movement and make it difficult to provide care to a patient. Often sensors are accidentally removed by patient movement. At other times, sensors must be moved or replaced when a patient is moved to a different location or when certain types of care are provided to the patient. Wireless sensors provide a solution to the patient movement and access. However, in busy hospital environments with non-technical staff operating these wireless devices, it can be difficult to correctly configure wireless sensors for communication with the correct monitors.
Similarly, other wireless devices including consumer devices such as, but not limited to, speakers, phones, headphones, watches, keyboards, mice, and so forth, capable of being paired have similar issues. These devices are often used by non-technically oriented users that encounter cumbersome pairing requirements.

Patient-worn wireless physiological sensor with pairing functionality


Processes of treating grain (e.g., corn), involving milling the grain to produce milled grain wherein the grain germ remains intact in the milled grain, and producing a mixture by mixing the milled grain with water and at least one enzyme selected from the group consisting of protease, alpha amylase, glucoamylase, cell wall degrading enzyme, and mixtures thereof, wherein the pH of the mixture is optionally adjusted to a pH of about 3.5 to about 6.5, and incubating the mixture for about 1 to about 3 hours to produce an incubated mixture.

Disclosed are processes of treating grain (e.g., corn), involving milling the grain to produce milled grain wherein the grain germ remains intact in the milled grain, and producing a mixture by mixing the milled grain with water and at least one enzyme selected from protease, alpha amylase, glucoamylase, cell wall degrading enzyme, or mixtures thereof, wherein the pH of the mixture is optionally adjusted to a pH of about 3.5 to about 6.5, and incubating the mixture for about 1 to about 3 hours to produce an incubated mixture.
The majority of fuel ethanol plants today currently utilize similar processes to produce Distillers Dried Grains with Solubles (DDGS), some produce liquid carbon dioxide, and most produce post-fermentation corn oil as the only coproducts. Several plants have modified processes to utilize a dry milling fractionation process prior to fermentation for recovery of germ and pericarp fiber. A few plants have wet separation processes that allow the production of a protein rich feed (about 50% protein) with relatively low fiber content as a new coproduct. Most of the other variations are strictly towards process improvements and do not produce additional new coproducts.
Removal of germ and pericarp fiber using a dry milling fractionation process prior to ethanol fermentation has energy saving advantages over the conventional process because the components removed are not wetted before separation and removal. However, the dry fractionation process unfortunately removes some essential nutrients needed for efficient fermentation with the germ fraction and can lose a significant amount of starch if processing is not done properly. The germ is also relatively low in oil concentration (″18%) because it retains these soluble components; additionally, the pericarp fiber is not by itself a particularly valuable co-product.
Wet fractionation processes such as quick germ/fiber or E-Mill processing require relatively more energy for drying but do not lose fermentation nutrients or as much starch relative to dry fractionation (Singh, V., and S. R. Eckhoff, Cereal Chemistry, 73(6): 716-720 (1996); Singh, V., et al., Cereal Chemistry, 82(2): 187-190 (2005); Murthy, G. S., et al., Cereal Chemistry, 83(5): 455-459 (2006); Murthy, G. S., et al., Industrial Biotechnology, 7(4): 298-307 (2011); U.S. Pat. No. 6,899,910). The germ is higher in oil concentration relative to dry milled germ, making it as valuable as germ from the wet milling process. In both germ recovery processes it is essential that the germ is not broken during the milling processes or oil can be lost.
In the dry process, tempering of the kernel (which raises the moisture content of the kernel) prior to grinding in a special mill is required. There are also sizing and air classification steps taken to separate components after grinding. With the existing wet fractionation processes, the whole kernels need to be soaked in water from about 3 to about 12 hours prior to grinding in a toothed disk mill. This keeps the germ from breaking during milling and helps remove endosperm (and starch) from the separated fractions. The hydration also results in the leaching of the soluble components from the germ that aid in fermentation and help concentrate the oil within the germ. The loss of these soluble components during the dry fraction process results in sluggish or stuck fermentations, and has forced plants utilizing dry fractionation to incompletely recover germ and/or to add supplemental nutrients in order to alleviate these problems.
Several processes that combine dry fractionation with wet milling have also been developed (U.S. Pat. Nos. 3,597,274; 4,181,748). The goals of these processes were to isolate starch by first dry milling the corn and then treating all or part of the ground kernel with sulfur dioxide in order to isolate starch. These processes resulted in significant starch losses that would be unacceptable from an economic standpoint if applied in an ethanol process.
Work done in our laboratory on the development of the E-Milling (Enzymatic Wet Milling) process (U.S. Pat. No. 6,566,125; Johnston, D. B., and V. Singh, Cereal Chemistry, 78(4): 405-411 (2001)) showed that the addition of a protease could replace the sulfite chemical processing and release starch for separation. We later expanded on this technology for the development of the germ and pericarp fiber fractionation process (E-Mill) for use with ethanol production that could utilize other enzymes in addition to proteases (Johnston, D. B., et al., JAOCS, 82(8): 603-608 (2005); Singh et al, 2005). With both of these processes, it was necessary to break the corn kernel without disrupting the germ before the enzyme treatment would be effective. This mandated some form of soaking process be utilized prior to grinding with a toothed disc mill. The capital cost of implementing the soaking step is one of the reasons the wet fraction processes have not found broad acceptance. Reduction of the initial capital costs or significant reduction in operating costs could result in broad adoption of wet fractionation technology in the fuel ethanol industry.
We have developed a simplified enzymatic germ and fiber (pericarp and endosperm) recovery process for use in an ethanol production system that could be implemented using less capital relative to the E-Mill or Quick Germ/Fiber processes and surprisingly does not have the significant ethanol loss issues of other processes.

The United States of America, as represented by the Secretary of Agriculture


A servo control device comprises a motor and continuously acting friction device, which is coupled to the output shaft of the motor and arranged in a housing having an aperture through which the motor output shaft extends. The housing is mounted so as to float radially in a mounting which is provided for it in a casing. Resilient tongues are provided so as to act between the housing and the mounting. The invention is particularly applicable to the motorized servo control of a clutch.

Such an arrangement is for example disclosed in U.S. Pat. No. 4,750,596, in which the retarding means that is used is arranged in a housing, having an opening through which the motor output shaft extends. The housing is mounted so as to float radially in a mounting which is provided for it in a casing. The housing has an annular rib for transverse engagement on the internal surface of the mounting. This rib, being formed by local thickening of the housing wall, is rigid.
However, because of the manufacturing tolerances that are unavoidable, a certain amount of clearance inevitably exists between the housing and its mounting, which results in some scope for transverse displacement of the housing to take place within the mounting.
The motor that is used in such an arrangement in practice is a stepping motor, which accordingly operates by pulsing action. On each pulse, and due to entrainment by friction effects, the housing of the retarding means is subjected to forces tending to displace it and therefore, once the clearance has been taken up, to bring it into contact with the internal surface of its mounting. This inevitably produces undesirable noise.

Control device for a coupling means such as a clutch


The compounds of the following formula:

1. Field of the Invention
This invention pertains to new adenosine receptor agonists and methods of their use. More particularly, this invention provides a genus of sulfonamido derivatives with a conserved ethyl uronamide group.
2. Background
Adenosine exerts a number of physiological functions through activation of four cell membrane receptors classified as A1, A2A, A2B and A3. The most recently discovered A3 subtype has been the subject of intensive pharmacological characterization. Although all adenosine subclasses belong to the G protein-coupled receptors they are associated with different second messenger systems. The A3 subtype is believed to have a characteristic second messenger profile, in that it has been shown to mediate adenylyl cyclase inhibition and phospholipase C activation.
It is also believed that the adenosine A3 receptor may play a basic role in modulation of cerebral ischemia, inflammation, hypotension, ischemic heart pre-conditioning and asthma. This has made the A3 receptor a therapeutic target on cell growth, on apoptosis, malignant cell growth, on leukemic Jurkat T cells, on human malignant melanoma A375 cell line and on human neutrophils. The human cloned A3 adenosine receptor was first characterized with N6-(4-amino-3-[125I]iodobenzyl)adenosine.
It is believed that the presence of an N6 benzyl moiety in the adenosine structure provides a significant increase in A3 receptor affinity and selectivity. It is also believed that a methyl or ethyl uronamide moiety confers better affinity and selectivity at the A3 adenosine receptor. This combination of substitutions is present in N6-(3-iodo-benzyl)-adenosine-5′-N-methyl-uronamide (IB-MECA). IB-MECA is 50 fold selective for the A3 receptor versus either the A1 or A2A receptors. A selective radioligand, the [125I]-N6-(4 amino-3-iodo-benzyl)-adenosine-5′-N-methyl-uronamide ([125I]-AB-MECA) has also been developed. This compound has a high affinity, although less selectivity, but is still considered to be a standard agonist for the A3 adenosine receptor.
It is also thought that substitutions at the 2-position on the benzyl group with halogen, methylamino or thiomethyl groups increase both affinity and selectivity at the A3 receptor subtype. Substituents at the 3-position on the benzyl group also appear to be well tolerated. Both affinity and selectivity for the A3 receptor subtype seems to be related more to the type of substitution on the phenyl ring than to the position of the substituent.
Purine and ribose-modified adenosine analogs have been studied for their affinity at rat A3 adenosine receptors, but these compounds have typically not shown a better profile with respect to reference compounds. Several modifications utilized have suggested that: i) deaza derivatives are well tolerated at the A3 receptor; ii) substitutions at the 8 position are detrimental in terms of affinity; iii) carbocyclic nucleosides exhibit, in general, weak affinity at all receptor subtypes; iv) replacement of 6-NHCH2 linkage with hydroxylamino or hydrazino moieties is well tolerated; v) substitution of 4′ hydrogen with a methyl group retains agonist activity and selectivity at rat A3 adenosine receptors.

Abstract: The compounds of the following formula:

Abstract: wherein Ar, R and R1 have the meanings given in the specification. This series of sulfonamido derivatives with a conserved uronamide group at the 5′ position provide superior A3 receptor affinity as well as selectivity. These new adenosine agonists are sulfonamido derivatives N-substituted with aliphatic groups (cyclic or linear) or aromatic radicals.

King Pharmaceuticals Research and Development, Inc.


A printing apparatus includes a head and a control unit. The head discharges an imaging liquid for forming an image, and a supplementary liquid for supplementing formation of the image onto a printing medium. The control unit controls the head to execute a first operation, in which the imaging liquid is discharged onto a first region and a second operation, in which the supplementary liquid is discharged onto a region of the printing medium onto which the imaging liquid is not discharged. The control unit controls the head such that the discharge amount of the supplementary liquid on a second region, which is adjacent to the first region, is less than the discharge amount of the supplementary liquid on a third region, which is a region onto which the imaging liquid is not discharged and is not adjacent to the first region.

1. Technical Field
The present invention relates to a printing apparatus.
2. Related Art
As the printing apparatus, an ink jet printer is known, which forms an image on a printing medium by discharging an ink from a head.
As an example of such an ink jet printer, there is a printer that performs printing using colored inks such as CMY and a non-colored transparent ink (clear ink).
JP-A-2002-307755 is an example of the related art.
Here, there is a case in which a film-based medium that is configured from polystyrene, polypropylene or the like is used as the printing medium. In regard to the film-based medium, there is a case in which a charge is generated on the medium surface due to friction and the like between the film-based medium and a paper feed roller, which is formed from a metal (aluminum, steel or the like), within the printer. The amount of charge is influenced by the state of the friction; therefore, there is variation on the medium surface.
When the ink is discharged onto the printing medium in which there is variation in the amount of charge, an ink mist (so-called satellites) which is generated together with the discharging accumulates in a region at which the amount of charge is great. As a result, there is a case in which hazy image degradation occurs in the printed object.
On the other hand, it is possible to reduce the amount of charge to be substantially uniform by applying a supplementary ink such as a clear ink to the entire printing medium in advance.
However, when the clear ink is applied to the printing medium, there is a problem in that the imaging ink (colored ink) and the clear ink mix together, causing bleeding to occur in the image.


The present invention provides a method for configuring a Sounding Reference Signal (SRS). The method includes: determining, by a base station, an SRS periodicity available for a cell, and determining at least one SRS configuration position available in a sub-frame for the cell based on the SRS periodicity determined; and jointly coding, by the base station, the SRS periodicity and the at least one SRS configuration position, and transmitting a result of the joint coding to all User Equipments (UE) in the cell through broadcast signaling. The present invention also provides an apparatus for configuring an SRS. The present invention implements configuration of SRS transmission and can avoid conflict between SRS and uplink control information.

An uplink sounding reference signal (SRS) is an uplink signal transmitted by a user equipment (UE) to a base station. The base station measures quality of the uplink channel based on the SRS received.
Currently configuration of SRS transmission may be: for a frequency division duplex (FDD) system and a time division duplex (TDD) system, eight types of transmission periodicities, including 2 ms, 5 ms, 10 ms, 20 ms, 40 ms, 80 ms, 160 ms and 320 ms are supported by UEs. For the TDD system, an SRS may be transmitted in an uplink pilot time slot (UpPTS). When the UpPTS includes only one single carrier-frequency division multiple access (SC-FDMA) symbol, the SC-FDMA symbol can be used for SRS transmission. If the UpPTS includes two SC-FDMA symbols, both SC-FDMA symbols may be configured by the base station for SRS transmission. In the UpPTS, the SRS can be transmitted over the whole uplink bandwidth. Because neither of uplink data and control signaling is transmitted in the UpPTS, SRS transmitted in the UpPTS would not conflict with physical uplink shared channel (PUSCH), physical uplink control channel (PUCCH), etc. If the SRS is configured in a regular uplink sub-frame, the SRS is transmitted at the last symbol of the uplink sub-frame. When PUSCH is transmitted in the uplink sub-frame, all UEs should remove the last symbol of the uplink sub-frame.
When an SRS is transmitted in a regular uplink sub-frame, the SRS would conflict with uplink control information. Specifically, in the regular uplink sub-frame, the SRS should not be transmitted in the frequency band of the PUCCH. If a UE needs to transmit an Acknowledgement/Negative Acknowledgement (ACK/NACK) and an SRS simultaneously in the same uplink sub-frame, a shortened format of the ACK/NACK is transmitted or the SRS will not be transmitted. If the UE needs to transmit a Channel Quality Indicator (CQI) and an SRS simultaneously in the same uplink sub-frame, the SRS will not be transmitted. If the UE needs to transmit a scheduling request (SR) and an SRS simultaneously in the same uplink sub-frame, the SRS will not be transmitted.
As can be seen, the prior art does not provide a specific solution for configuring SRS transmission in a system. As a result, SRS can not be transmitted normally.

Method and device for configuring uplink sounding reference signal

China Academy of Telecommunications Equipment Co., Ltd.


The present invention provides a model for assessing performance of a dynamic collaborative relationship. The present invention provides a method of modeling dynamic relationships by inputting data related to the collaborative relationship into a model, which comprises a plurality of components key to the collaborative relationship. Each of these components is interrelated with the model, and the model generates a value indicative of a condition or performance of the relationship. The relationship value can be analyzed by comparison with baseline values correlated to exemplary collaborative relationships. The present invention further provides methods of developing a model capable of assessing dynamic collaborative relationships.

Collaborative relationships, such as collaborative partnerships, are prevalent in the public, private, and non-profit sectors. Each entity involved in a collaborative relationship, brings a unique set of skills, knowledge, and talents, providing important contributions in their respective areas of specialty. Such partnering entities may be intra-organizational (e.g. the entities in the collaborative relationship are different divisions or departments within the same organization) or inter-organizational (e.g. two distinct organizations in a collaborative relationship). Generally, collaborative partnering relationships are initiated due to the anticipated benefits they bestow on the respective entities. However, each entity brings a unique set of relationship issues, conditions, and values that affect the partnership. Many different relationship characteristics impact the overall performance of the partnership relationship, and it is desirable to be able to predict the important issues that arise in a collaborative relationship, prior to failure or significant expenditure of resources. Thus, there is a need to accurately model and simulate current partnering relationships, to understand how relationships change over time for assessment and characterization of such relationships.

System and model for performance value based collaborative relationships


Embodiments of the present invention implement computing circuits comprising a number of interconnectable nanoscale computational stages. Each nanoscale computational stage includes: (1) a nanoscale logic array; and (2) a number of nanoscale latch arrays interconnected with the configurable logic array. Each nanoscale computational stage receives signals and passes the signals through the nanoscale logic array and to a nanoscale latch array. Signals output from the nanoscale latch array can be routed to another nanoscale computational stage or out of the computing circuit.

During the past fifty years, the electronics and computing industries have been relentlessly propelled forward by ever decreasing sizes of basic electronic components, such as transistors and signal lines, and by correspondingly ever increasing component densities of integrated circuits, including processors and electronic memory chips. Eventually, however, it is expected that fundamental component-size limits will be reached in semiconductor-circuit-fabrication technologies based on photolithographic methods. As the size of components decreases below the resolution limit of ultraviolet light, for example, far more technically demanding and expensive higher-energy-radiation-based technologies need to be employed to create smaller components using photolithographic techniques. Expensive semiconductor fabrication facilities may need to be rebuilt in order to use the new techniques. Many new obstacles are also expected to be encountered. For example, it is necessary to fabricate semiconductor devices through a series of photolithographic steps, with precise alignment of the masks used in each step with respect to the components already fabricated on the surface of a nascent semiconductor. As the component sizes decrease, precise alignment becomes more and more difficult and expensive. As another example, the probabilities that certain types of randomly distributed defects in semiconductor surfaces result in defective semiconductor devices may increase as the sizes of components manufactured on the semiconductor surfaces decrease, resulting in an increasing proportion of defective devices during manufacture, and a correspondingly lower yield of useful product. Ultimately, various quantum effects that arise only at molecular-scale distances may altogether overwhelm current approaches to component fabrication in semiconductors.
In view of these problems, researchers and developers have expended considerable research effort in fabricating sub-microscale and nanoscale electronic devices using alternative technologies. Nanoscale electronic devices generally employ nanoscale signal lines having widths, and nanoscale components having dimensions, of less than 100 nanometers. More densely fabricated nanoscale electronic devices may employ nanoscale signal lines having widths, and nanoscale components having dimensions, of less than 50 nanometers, and, in certain types of devices, less than 10 nanometers. A nanoscale electronic device may include sub-microscale, microscale, and larger signal lines and components.
Although general nanowire technologies have been developed, it is not necessarily straightforward to employ nanowire technologies to miniaturize existing types of circuits and structures. While it may be possible to tediously construct miniaturized, nanowire circuits similar to the much larger, current circuits, it is impractical, and often impossible, to manufacture such miniaturized circuits using current technologies. Even were such straightforwardly miniaturized circuits able to be feasibly manufactured, the much higher component densities that ensue from combining together nanoscale components necessitate much different strategies related to removing waste heat produced by the circuits. In addition, the electronic properties of substances may change dramatically at nanoscale dimensions, so that different types of approaches and substances may need to be employed for fabricating even relatively simple, well-known circuits and subsystems at nanoscale dimensions. Thus, new implementation strategies and techniques need to be employed to develop and manufacture useful circuits and structures at nanoscale dimensions using nanowires.
Digital electronic systems, such as synchronous pipelines and state machines, are generally described as collections of logic functions and memory functions that implement complex computations. Synchronous pipelines and state machines commonly store logical-variable values in memory and subsequently reuse stored logical-variable values as inputs for logic functions. Latches can be employed for storing logical-variable values and outputting the stored logical-variable values in either true or inverted form. Although microscale latches and logic are well-known in the art of general computing, the design and manufacture of nanoscale circuits combining nanoscale latches and logic present numerous challenges. Therefore, designers, manufacturers, and users of nanoscale logic devices have recognized the need for methods of combining nanoscale latches and nanoscale logic into circuits that implement complex computations.

Interconnectable nanoscale computational stages

Hewlett-Packard Development Company, L.P.


The present disclosure relates to a rubber composition that includes an aromatic-compound based resin and a styrene-butadiene copolymer and a tire using the same as the tread rubber or a component thereof. The rubber composition provides improved wet traction.

Wet traction is a property of rubber that has an impact on tire performance. Generally, as the amount of water on the road surface increases, traction decreases due to the reduction in contact between the tire and the road surface. As a result, there may be a decrease in handling and stopping distance.
Inorganic fillers, such as silica, impart improved wet traction and improved snow traction when used within tire treads. Mixing silica into a tire stock, however, is difficult because silica particles agglomerate and therefore they are not easily dispersed. The poor dispersing of silica in rubber may affect the wearing and lifespan of a tire. In response, processing and dispersing aids, such as processing oils, are used during compounding. Unfortunately, the use of these processing and dispersing aids may enhance a decrease in modulus that is typically observed at high temperatures.
Because better wet traction characteristics provide improved safety and stopping distance, there is a need to overcome the difficulties associated with the use of silica and processing oils in tire treads.
It is an objective of the present disclosure to alleviate or overcome one or more difficulties related to the prior art. It has been found that aromatic-compound based resins can be used in rubber compositions that include styrene-butadiene copolymers to provide enhanced wet traction.

Tread composition and tire produced by using the same


A labyrinth section for a submersible pump includes an outer housing having a coupling sealingly engaged at each longitudinal end of the outer housing. An inner tube is sealingly engaged at each end to one of the couplings to define a sealed annular space. A plurality of labyrinth tube sections are disposed in the annular space, each comprising labyrinth tubes engaged with end plates. A plurality of the labyrinth tube sections enable movement of fluid through the labyrinth tubes, spaces external to the labyrinth tubes and between the end plates to fill the annular space. One of the labyrinth tube sections constrains fluid to move only within the labyrinth tubes and wherein the inner tube between the end plates of the one of the labyrinth tubes comprises a fluid port into an interior of the inner tube.

Some examples relate to a labyrinth seal for a submersible pump, an electrical submersible pump, and/or a method for pumping fluid.
This disclosure relates to the field of submersible well pumps, such as electric submersible pumps (ESPs). More specifically, the disclosure relates to labyrinth type seal sections that enable dielectric fluid to be maintained at well ambient pressure while substantially excluding well fluid from entering components of the ESP requiring exclusion of well fluid.
Pressure within the electrical submersible pump (ESP) is at atmospheric pressure prior to the ESP being inserted into a wellbore. Since well pressure often significantly exceeds atmospheric pressure, the pressure within the ESP should be equalized to well pressure, thereby reducing pressure differential across the ESP housing and seals. A hazard of differential pressure is that well fluid could breach seals and leak into the motor of the ESP. This is of special concern with regard to the motor, where the well fluids, which are electrically conductive and may have solid particles therein could create electrical short circuits and mechanically damage the motor. A protector communicates well fluid pressure to the motor fluid pressure thereby minimizing pressure differential and prolonging seal life. To perform such function, the protector contains a pressure compensation device to act as a barrier to well fluid entering the upper drive train (i.e., components proximate to and including the motor) while still transmitting the pressure from the well to upper drive train. A protector also has a tortuous fluid path that slows down the migration of well fluid through the protector to reduce the chance of well fluid entering the upper drivetrain through any leak in the pressure compensating device or mechanical seal.

Modular labyrinth seal system usable with electric submersible pumps


The present general inventive concept describes a switching mode power supply (SMPS) and a method of supplying power by using the same. An SMPS that may be used in an image forming apparatus can include a transformation unit to transform an alternating-current (AC) voltage input to the SMPS, into at least one direct-current (DC) voltage by using a transformer, a first output voltage output unit to output the transformed DC voltage as a first output voltage of the SMPS, a first switching unit to prevent output of the second output voltage, and a second switching unit to prevent output of the second output voltage.

1. Field of the General Inventive Concept
The present general inventive concept relates to a switching mode power supply (SMPS) and a method of supplying power by using the same.
2. Description of the Related Art
As a power supply to supply power to an electronic product, a switching mode power supply (SMPS) may be used. An SMPS transforms an input alternating-current (AC) voltage and outputs a constant voltage to operate an electronic product. If an electronic product is in a standby mode for a predetermined period of time, the electronic product enters a power saving mode. Since some functions of the electronic product have to be ensured even in the power saving mode, a power supply operation is not stopped completely. Currently, restraints on standby power of electronic products are getting strong to globally reduce generation of carbon dioxide, and thus a solution to reduce power consumption of a power supply in a power saving mode is required. Also, if an inrush current is generated by a power supply, the security of a system may not be ensured.

Switching mode power supply of image forming apparatus and method of supplying power according to state of image forming apparatus by using the same