A fixture is used to secure a substrate and to allow movement of a pin relative ot the fixture. The substrate fixture includes a holding table adapted to receive the substrate and a probe pin assembly underneath the table. The substrate is mounted on a table which can move in one-dimension, while the probe pin is moveable relative to the table in another dimension perpendicular to movement of the table. Moving the substrate retaining table and the pin retainer allows for alignment of the probe pin with a backside terminal of a trace conductor of the substrate. The assembly also has vertical height translational mechanism for contacting the probe pin with the backside terminal. Furthermore, the frontside terminal of the trace conductor is accessible to an external probe. A testing device can be connected to the external probe and the probe pin to measure the electrical continuity of the trace conductor.

1. Field of the Invention
This invention relates to electronic testing and, more particularly, to testing of packaged integrated circuit subsystems.
2. Description of the Related Art
The following descriptions and examples are not admitted to be prior art by virtue of their inclusion within this section.
Until recently, the ongoing quest of the semiconductor industry was to improve the performance of integrated circuits (xe2x80x9cICsxe2x80x9d) either before or after the integrated circuit was placed in a package and hermetically sealed from the elements. However, advancements in the performance in integrated circuits are now being limited by the technology by which the circuits are packaged. Efficient packaging of integrated circuits involves increasing the package density (i.e., pin-out) and package performance (i.e., electrical conductance and signal speed).
There are several packaging technologies developed to connect integrated circuits to a substrate. For example, the circuit can be coupled using through-hole wire bonding or soldering. Alternatively, the circuit can be bonded using surface mount technology, tape automated bonding, and flip-chip bonding. The drive for more densely configured integrated circuits has lead to an increased pin-out of input/output pads per circuit area. Flip-chip package technologies such as chip scale packaging and direct chip attach have evolved to handle the higher density pad configuring by arranging the pads in an array across the surface topography. The pads can be placed nearing the core logic of the circuit and/or whatever subsystem that involves their use to minimize capacitive coupling and thereby flip chip technology adds to the overall performance of the circuit.
The array of bonding pads are arranged in a two-dimensional array of rows and columns upon a frontside surface of the circuit. Attachment of the array of pads to an underlying board, using the flip chip configuration, involves inverting the circuit so that the frontside surface with the bonding pads faces downward onto a package substrate, which has corresponding set of bonding pads. The circuit and/or board is then heated and a solder connection is formed at the interface between the integrated circuit bonding pads and the bonding pads of the board. When the solder cools and hardens, the I/O pads of the circuit are electrically and mechanically coupled to the bonding pads of the printed circuit board. The printed circuit board, or xe2x80x9cboard,xe2x80x9d includes printed conductors extending across the upper, lower or buried surfaces of the board. One or more trace conductors can extend upward from a plane on which multiple trace conductors are formed through vias which contact with the bonding pads. To minimize the mechanical strain on the solder bump attachments due to the coefficient of thermal expansion mismatch between the substrate material of the board and the integrated circuit, an underfill material, which is typically a thermosetting polymer (e.g., an epoxy resin) may be dispensed in liquid form between the IC and the substrate which subsequently hardens and securely encapsulates the solder bumps which form at the interface of the integrated circuit bonding pads and the substrate bonding pads.
A well-suited package substrate for a flip-chip application is a ball grid array (xe2x80x9cBGAxe2x80x9d) substrate. A BGA package substrate may be made of, for example, fiberglass-epoxy printed circuit board material or a ceramic material (e.g., aluminum oxide, alumina, Al2O3, or aluminum nitride, AlN), and it may be a single layer or a multi-layer fabricated substrate. In a flip-chip design application, the substrate includes two sets of bonding pads: a first set adjacent to the chip and a second set on a surface of the substrate opposite the first set. Accordingly, both sets are arranged in a two-dimensional array across the upper and lower surface of the device package. The substrate may include multiple layers of a patterned conductive material forming electrical conductors. Interlayer vias may be formed by precise drilling for electrical and thermal routing through the substrate. The configuration of interlayer vias and intra-layer patterned electrical conductors results in trace conductors that electrically connect members of the first and second sets of bonding pads. Members of the first set of bonding pads on the upper surface can be solder bump attached to corresponding I/O bonding pads of the inverted integrated circuit, i.e., xe2x80x9cflip chip.xe2x80x9d Members of the second set of bonding pads function as device package terminals, and are coated with solder. The second set of bonding pads of overcoated solder on the underside of the BGA device package allow the substrate (and trace conductors contained therein connected to corresponding I/O bonding pads) to be surface mounted to a larger printed circuit board (e.g., a motherboard). During board assembly, the BGA package is attached to the corresponding bonding pads on the board using standard reflow techniques.
Device failure or performance impairment can occur in these packaged devices if a trace conductor or a group of trace conductors are not properly conducting electrical signals to or from the attached chip. A large electrical resistance measured across a trace conductor may indicate that there is an open or break in the conductive pathway of the trace conductors. There are several ways that this can occur either at the terminal sites or along the length of the trace conductor. The solder balls or solder bumps could have been improperly attached, or experienced critical mechanical strain due to the coefficient of thermal expansion or package mishandling. There could be micro-cracks or other breaks in the terminals or in the trace conductors inside the substrate. There could be manufacturing defects such as, incomplete vias, missing vias, or misaligned vias between the substrate layers. Further, electromigration could cause cracks to form in the solder joints or in the trace conductor line inside the substrate, etc.
To test and locate the exact source of a break in the electrical continuity of a trace conductor requires the destructive dismantling of the package and is typically a final step in failure analysis of such devices. A trace conductor or group of trace conductors will first be pinpointed as a source of an electrical pathway conductivity problem from prior failure analysis tests. A current method for testing the electrical continuity of the trace conductors of the BGA flip-chip package substrates involves first removing the semiconductor chip so as to expose the solder bumps encapsulated in the underfill material beneath the inverted integrated circuit. An electrical testing device such as a multi-meter can then be used to measured the resistance of the trace conductor by connecting the two probe wires of the meter on either end of the trace conductor. Typically, a probe wire is soldered to the trace conductor solder ball terminal on the underneath side of the board. The other probe wire may have a probe needle attached for making electrical contact with the exposed solder bump at the upper surface of the board.
If the resistance measured is defect-level high (a value that is dependent on substrate design), then typically a subsequent upper layer of the substrate is removed by a parallel lapping process, which may be performed by a polishing grinding wheel. Removing the upper layer of the substrate entails removing the solder bumps that lie just beneath the removed integrated circuit. Another resistance probe measurement would be taken. Again if the resistance measured is high, another upper layer can be removed and the measuring procedure repeated on the lower layers until the layer having the defect is found. However, problems can arise using this testing method. The defect may be heat-cured during the solder attachment of the probe wire to the solder ball if the defect is physically located at or in proximity of the solder ball. The subsequent removal of upper substrate layers during the parallel lapping process can put undue tension on the bottom soldered probe wire and thus pull the attached solder ball from the substrate or simply cause the wire or joint to break.
It would be beneficial to provide a mechanism for probing electrical continuity of BGA package substrate trace conductors with a probe that does not requiring heating to form a strong electrical contact between the probe wire and the solder ball terminals. It would be desirable to accomplish such testing using a probe fixture where a probe is attached to the fixture and could be aligned with an underneath solder ball terminal and further adjusted by form superior registry with the terminal. It would be further desirable that the substrate could be easily attached to and unattached from the desirous testing fixture. This would allow for easy manipulation of the substrate for substrate layer removal steps, in which preferably the substrate is first removed away from the probe fixture. In this scenario the probe point solder ball would then not be subjected to any undue external forces during the lapping, or layer removal procedure.
The problems outlined above may be in large part addressed by a semiconductor package substrate test fixture that includes a moveable holding table adapted to hold a semiconductor package substrate. The substrate can be any single or multi-layered package, and may also be a BGA package designed to receive an inverted integrated circuit, using flip chip connection techniques. The package is readied for testing by removing the overlying, inverted integrated circuit to expose the attachment solder bumps configured within the partially lapped underfill material. The substrate may be a multi-layer substrate, where subsequent upper layers may also be removed, if desired. The substrate is held onto the table with the use of a sliding push plate, where the plate is moveable and can be secured to the table by a thumbscrew secure pin. The plate retains the package on the table by applying mechanical contact and support to an outer portion of the substrate while other opposing portions of the substrate are abutted against retainer walls. The holding table is further adapted so that a backside surface of the substrate is presented to an electrically conductive probe pin. The probe pin extends upward from a probe pin retainer assembly attached to the fixture underneath the table. In an embodiment, the mechanism for alignment of the probe pin with an electrical terminal of a trace conductor on the backside surface of the substrate may be such that the probe pin assembly and the table are arranged onto two separate perpendicular sets of two slide rails. The table is arranged on one set of the two slides rails and is translatable in one independent horizontal direction by the operation of a lead screw coupled to the table. And the assembly is arranged on the other set of two slide rails and is translatable in the other independent horizontal direction by the operation of another lead screw coupled to the assembly. The electrical terminal is preferably a solder ball. An electrical outlet socket on an outer surface of the fixture is electrically connected to the probe pin.
A test device is electrically coupled to the electrical terminal and also to a corresponding electrical terminus of the trace conductor, where the electrical terminus would preferably be either a residual attachment solder bump or the upper end of an exposed trace conductor after subsequent layer removal. The test device is preferably a multi-meter for measuring the electrical continuity of the trace conductor. The probe pin is preferably a pogo pin, which contains a compressible spring for making a strong but non-destructive contact to a single solder ball on the underneath surface of the substrate.
In addition to the test fixture discussed above, a method for testing a package substrate is contemplated herein. The method for testing a semiconductor package may include removing an upper layer of the package, where the first layer removed is at least a portion of the integrated circuit attached to the substrate. An initial test may be conducted before said removing, where the testing includes transmitting an electrical pulse along a trace conductor, measuring a time delay of the reflected pulse, and determining from the delay time a defect location of a defect-level high resistance in the trace conductor as either residing inside or outside the substrate. The package is preferably a flip-chip design BGA package, so that the removing of the entire die will then expose the solder bump flip-chip attachments. The package substrate is then held in place by a sliding push plate on a moveable table on the upper surface of a test fixture. The table is adapted for exposing a backside surface of the substrate to a moveable probe pin attached to a lower part of the fixture. The aligning of the probe pin with an electrical terminal of a trace conductor on the backside surface of the substrate is achieved by moving the package on the table along one independent horizontal direction via a lead screw, where the table is adapted to slide on a pair of parallel rails. The aligning is further accomplished by moving the probe pin, which housed in probe pin assembly, along the other independent horizontal direction via another lead screw to situate the probe pin directly underneath the electrical terminal, where the assembly is adapted to slide on a pair of parallel rails.
Contacting the electrical terminal by the probe pin and the corresponding electrical terminus of the trace conductor on a frontside surface of the substrate by a probe needle is accomplished by first mechanically and electrically contacting the terminal with the probe pin by a thumbscrew vertical height adjusting mechanism, which is coupled to the probe pin for moving the probe pin in the vertical direction. Contacting the terminus with the probe needle may be achieved using a magnifying lens. A test device is connected between the probe pin and the probe needle and may be used for testing the trace conductor electrical properties. The test device is preferably a multi-meter, where the testing measures the electrical resistance of the trace conductor. In an embodiment, if testing measures a defect-level high resistance, then an additional testing step is required, which includes removing an upper layer of the package, holding the substrate on the test fixture, and contacting the probe pin with the electrical terminal and a probe needle with the electrical terminus, connecting the test device between the probe pin and the probe needle, and testing trace conductor electrical properties. It should be noted that aligning may be omitted for this embodiment, since the probe pin should be already substantially aligned with the electrical terminal.

Semiconductor device package substrate probe fixture


The present application relates to a method and system for labeling one or more products such as packages transported along a conveyer, and more specifically to applying a label on a respective package by way of a vertically adjustable assembly positioned above the conveyor. The adjustable assembly includes at least a label printer and an applicator for printing and applying the label on a surface of the package on the conveyor.

Package labeling for warehouse and distribution applications, have a configuration where the printer and label applicator are in a fixed positioned over the conveyor line and the applicator pad travels (by servo, stepper, or pneumatic drive) down to the product to be labeled and then must return the full distance to the fixed position of the print engine in order to receive the next label and repeat the process. These conventional features are illustrated in the FIG. 14. The labeler assembly consists of a roll of linered die cut labels 1, a label printer 2, a label peel blade 6 that removes the label from the liner and a liner take up roller 8 to accumulate the scrap liner material. This entire labeler assembly is mounted above the tallest package plus the conveyer, which makes it difficult to load the labels or service the assembly. The applicator pad 12 shown in the position to apply a label to the shortest package must return to the home position 4 to pick up the next label. Significant time is required to move the applicator the distance of the stroke 10, a distance dependent on application requirements, each time a package is labeled. The extra time to move the applicator results in a significant reduction in throughput. Hence a need exists for a labeling assembly that can be repositioned only when necessary and thereby utilizing less stroke distance for each label resulting in higher throughput.

Method to print and apply labels to products


A device that uses homomorphic encryption is disclosed. The device obtains a first encrypted polynomial, a second encrypted polynomial, a first encrypted weight, and a second encrypted weight by respectively encrypting a first polynomial, a second polynomial, a first weight, and a second weight by using a homomorphic encryption scheme, and obtains an encrypted secure distance corresponding to encryption of a secure distance.

As the importance of protecting personal information and confidential information increases, a market of services using these information has been currently expanding. Examples of such services include a service utilizing position information of an individual user, which can be obtained with a smartphone. Accordingly, attention is paid on confidentiality techniques that can utilize data of protected personal information and confidential information unchanged. Confidentiality techniques include techniques using an encryption technique and a statistical technique according to a data type and a service requirement.
Confidentiality techniques using an encryption technique include a homomorphic encryption technique. The homomorphic encryption technique is one of public key cryptosystems using a pair of different keys for encryption and decryption, and has a function of enabling an operation of encrypted data unchanged.
By using the homomorphic encryption scheme, encrypted text resultant from an addition or multiplication operation can be obtained by performing an arithmetic operation such as an addition or a multiplication without decoding the encrypted text. Expectations have been rising for the use of this property of the homomorphic encryption in electronic voting and electronic cash fields and a recent cloud coMPUting field. RSA encryption scheme that enables only a multiplication, and Additive ElGamal encryption that enables only an addition are known as homomorphic encryption scheme for an addition and a multiplication. Assuming that encrypted texts of plaintexts (messages) a and b are E(a) and E(b), an encrypted text E(a·b) of a product a·b of the plaintexts can be calculated from E(a) and E(b) with multiplicative homomorphic encryption. Moreover, assuming that encrypted texts of plaintexts (messages) a and b are E(a) and E(b), an encrypted text E(a+b) of a sum a+b of the plaintexts can be calculated from E(a) and E(b) with additive hohomorphic encryption. By using the homomorphic encryption scheme, an encrypted text resultant from an arithmetic operation such as an addition or a multiplication can be obtained with an addition or a multiplication of encrypted texts without decrypting the encrypted texts. Expectations have been growing for the use of this property of homomorphic encryption in electronic voting and electronic cash fields, and a recent cloud coMPUting field.
Fully homomorphic encryption has been recently known as encryption having homomorphism for both an addition and a multiplication. If an addition and a multiplication can be performed for encrypted texts unchanged, an arithmetic operation such as an exclusive OR, a logical AND, or a negation can be performed for the encrypted texts unchanged. Namely, fully homomorphic encryption is encryption having homomorphism for arithmetic operations performed by all logic circuits. At first, only logical implementation methods were announced and practical configuration methods were not disclosed. However, not only specific configuration examples of key generation methods but encryption schemes that expand types of data that can be encrypted have been proposed. Moreover, somewhat homomorphic encryption that can perform both an addition and a multiplication by a limited number of times is present. Since this encryption scheme needs far less encryption size and processing performance than those of fully homomorphic encryption, more practical operations are expected.
Generally, an encryption technique is used in a system for verifying similarity between two information. Examples of such a system include a biometric authentication system and a tag search system.    [Patent Document 1] Japanese Laid-open Patent Publication No. 2011-145512    [Non-patent Document 1] C. Gentry, "Fully Homomorphic encryption using ideal lattices", STOC2009, pp. 169-178, 2009    [Non-patent Document 2] C. Gentry and S. Halevi, "Implementing Gentry's Fully Homomorphic Encryption Scheme", EUROCRYPT 2011, LNCS 6632, pp. 129-148, 2011    [Non-Patent Document 3] Yasuda, Yajima, Shimoyama, and Kogure, "Cloud secure summation of purchase history data possessed by a plurality of enterprises", SCIS 2012

Encryption processing apparatus and method


Architecture of future open wireless architecture (OWA) radio system supporting full integration of multi-bands, multi-standards wireless and mobile communication technologies with computer technology based on future open architecture platforms.

1. Field of the Invention
This invention relates to an open architecture of future radio system supporting multi-bands, multi-standards wireless and mobile communications and enabling extensibility and upgradeability of the system modules including, but not limited to, radio frequency transceiver, data converter and base-band processing core, wherein the open system platforms are based on the open wireless architecture (OWA) BIOS (basic input/output system) and framework definitions. This OWA system platform is an optimal integration of future computer architecture with the next generation wireless and mobile communications technology.
2. Description of the Related Art
With the proliferation of wireless standards in television, radio and mobile communications, compatibility issues have emerged in wireless networks and systems. Inconsistency between wireless standards is causing problems to subscribers, wireless network operators and equipment vendors. Subscribers are forced to change their handsets whenever the latest breed of standards is introduced. Network operators face the dilemma during the upgrade of a network from one generation to another due to the presence of a large number of subscribers using legacy handsets incompatible with newer generations of standards. Equipment vendors face difficulty in airing new technology because of short time-to-market requirements. Inconsistency between wireless standards is inhibiting deployment of global roaming facilities and causing problems in introducing new features and services. Users are expecting more from their mobile terminals in terms of quality of service and multimedia applications. Traditional wireless systems, with their capabilities hard-coded in them, are no longer able to keep step with this brisk growth rate.
Open Wireless Architecture (OWA) technology is the solution to the issues mentioned here. The term OWA refers to the open broadband platform, both in radio frequency (RF), base-band, network and application, that can support diverse communication standards and can integrate multiple wireless networks and systems into one common platform. To achieve this flexibility and extensibility, OWA focuses on all aspects of a communication system such as RF section, baseband processing and application domains. The flexibility and adaptability required for the converged wireless platform can be achieved by implementing the radio functionality as software modules running on a generic platform or by using extensible hardware modules.
OWA helps in realizing global roaming facilities. It allows the network operators and subscribers to use third party solutions on their systems and to customize their systems according to their liking. Using OWA we can build systems which support multiple standards, multiple bands, multiple modes and offer diverse services to its user.
However, OWA is much different from Software Defined Radio (SDR) because OWA has the following important features:                a) Different parts from different vendors, and encourage third-party vendors to develop add-on products,        b) Allow users to upgrade the hardware in all of the OWA hardware and components,        c) The system is based on open interfaces so that users can easily develop their own products and applications upon the OWA platform,        d) The application hardware modules are "plug and play", independent with the basic OWA infrastructure.
In a word, OWA is different from SDR because OWA basically maps various wireless standards into open interface parameters and maintain the system platform including RF, baseband, networks and applications an open architecture. Hence, in OWA systems, different modules (both hardware and software) can be from different vendors which are similar to the open computer architecture in personal computer system and open network architecture in packet router system.
However, SDR is only a radio in which the operating parameters including inter alia frequency range, modulation type, and/or output power limitations can be set or altered by software. Though SDR has been improved a lot to support re-configurability and flexibility, it is only a closed architecture in coupling different radios into one broadband transceiver. In other words, SDR consumes much more power and spectrum in exchange of the system flexibility. From the business point of view, SDR is not a cost-effective solution in commercial wireless communications.
Cognitive Radio is also different from OWA because the cognitive radio is a radio which has the capability of sensing and adapting to the environment and spectrum automatically and intelligently. However, cognitive radio is not an open system from the architecture point of view, and does not meet the requirements of the open system definition.
With this OWA architecture, the key system units including RF transceiver, CPU (central processing unit) platform and base-band processing core are fully open and extensible, especially the open RF transceiver can be operable in either statically allocated spectrum bands, or in dynamically optimized spectrum bands based on spectrum sharing and spectrum recycling techniques which maximize the spectrum utilization.
With this OWA architecture, many system modules including, but not limited to, the RF front-end module, Digital controlled oscillator module, Build-In Self-Test module, Data converter module and Base-band core module can be replaced, extended and upgraded by the users, and developed by the third-party vendors.
In conclusion, as I said in Stanford University in June 2004, the future radio is first, a Computer, then an open wireless architecture (OWA) terminal.


In a braking performance evaluation method including the steps of acquiring a tire ground contact pressure distribution, acquiring a sliding friction coefficient table, and calculating a friction force of an entire tire using a brush model having a function representing the tire ground contact pressure distribution and the sliding friction coefficient table, the step of acquiring the tire ground contact pressure distribution includes the step of acquiring a first ground contact pressure distribution on a road surface on which no water film is present via actual measurement or calculation and the step of acquiring a second ground contact pressure distribution by applying reduction in a ground contact pressure due to a water film intruded between the tire and the road surface to the first ground contact pressure distribution and using the second ground contact pressure distribution as the tire ground contact pressure distribution used for the calculating.

Although the braking performance on a WET road surface (that is, a wet road surface) of tires attached to an actual vehicle has been conventionally evaluated by attaching actual tires to the vehicle and traveling the vehicle, this evaluation method has a problem in that the test cost is expensive.
Accordingly, there are methods as described in PTL 1 and PTL 2 that construct a tire model, a road surface model, and a fluid model in which a water film between tires and the road surface is modeled and perform simulation using these models. However, since the calculation costs of these methods are high, they are not suited for analysis combined with a vehicle model.
In addition, there is a known method as described in PTL 3 and PTL 4 that acquires a μ-S curve representing the relationship between a friction coefficient μ and a slip ratio S of a tire by using a tire model (brush model) in which a brush-like elastic element corresponding to a tread rubber is radially pasted to the outer periphery of a cylindrical belt.
PTL 1: JP-A-2002-14011
PTL 2: JP-A-2004-338660
PTL 3: JP-A-2007-203809
PTL 4: JP-A-2003-57134

Braking performance evaluation method and braking performance evaluation device


An automotive driveline disconnect assembly includes a first clutch part and a second clutch part, and is designed and constructed to preclude an occupant-audible noise from being made between components of the disconnect assembly. The preclusion of the occupant-audible noise can be effected via one or more dampers, a non-flat tooth profile, or a combination of these measures. The disconnect assembly can be equipped in a larger automotive driveline component such as a power transfer unit (PTU), a final drive unit (FDU), a rear drive module (RDM), or an electronic differential locker (EDL).

In general, automotive drivelines transmit torque from an engine and eventually to a set of wheels. Automotive drivelines, such as all-wheel drive (AWD) drivelines, sometimes include power transfer units (PTUs), final drive units (FDUs), rear drive modules (RDMs), electronic differential lockers (EDLs), disconnecting differentials and other types of differentials, or a combination of these components to transmit the torque. The exact components in a particular automotive driveline often depends on the architecture of the overall driveline and on the arrangement of the accompanying engine and transmission.
Furthermore, the PTUs, FDUs, RDMs, EDLs, and differentials can be equipped with disconnect and re-connect capabilities in which disconnected components are no longer driven to transmit torque between them. The capabilities preclude driven torque in regions of the automotive drivelines not needing torque at a particular time. For instance, on-demand AWD drivelines do not always transmit torque among all of its shafts at all times. Disconnect and re-connect capabilities have been shown to enhance fuel efficiency, reduce emissions, and provide yet additional performance improvements.

Automotive driveline disconnect assembly


Disclosed are a mobile terminal and a shooting method thereof. The shooting method comprises the steps of: collecting, by a camera, image data continuously; conducting an addition operation on the current image data and the past image data, so as to generate a synthetic image; and displaying the synthetic image in real time. Thus, an image superposition technique is adopted to simulate long-time exposure, which adds a light painting function to a mobile terminal, so that a user can use the light painting function of the mobile terminal to conduct artistic creation, and can preview the creation effect in real time, thereby improving the user experience.

Along with continuous improvement of camera shooting hardware of mobile terminals such as mobile phones, tablets and the like, shooting functions of mobile terminals become more and more diversified and shooting requirements of users on mobile terminals also increase. A current mobile terminal has shooting function which is dependent on a related processing, algorithm provided by camera shooting hardware equipment and a chip provider, and only has fixed shooting modes such as focusing, white balance and the like.
In recent years, a shooting mode of light painting photography rises, which may be used by a user to carry out artistic creation. Light painting photography refers to a shooting mode of performing long-time exposure and creating a special image by virtue of a change of a light source in an exposure process. Corresponding photosensitive hardware is required to support long-time exposure, but photosensitive hardware capable of supporting long-time exposure is expensive, so that only a professional camera shooting device such as a single lens reflex has a light painting photography function. Therefore, existing mobile terminals do not have the light painting photography function under limits of camera shooting hardware, and may not meet requirements of users on utilization of the light painting photography function for artistic creation. In addition, when a professional camera shooting device is utilized for light painting photography shooting, a user may not preview a creation result in real time, so that an error may not be corrected timely, and creation efficiency is low.

Mobile terminal and shooting method thereof


A method and system for cleaning opposed surfaces of a semiconductor wafer having particulate matter thereon. The method includes generating relative movement between a fluid and the substrate. The relative movement is in a direction that is transverse to a normal to one of the opposed surfaces and creates two spaced-apart flows. Each of the flows is adjacent to one of the opposed surfaces that is different from the opposed surface that is adjacent to the remaining flow of the plurality of flows. The fluid has coupling elements entrained therein, and the relative movement is established to impart sufficient drag upon a subset of the coupling elements to create movement of the coupling elements of the subset within the fluid. In this manner, a quantity of the drag is imparted upon the particulate matter to cause the particulate matter to move with respect to the substrate.

There exists a desire to reduce critical dimensions of features in electronic substrate products. As the features decrease in size, the impact of contaminants during processing of the features increases, which may produce defects. Exemplary contaminants are particulates that include polysilicon slivers, photoresist particles, metal oxide particles, metal particles, slurry residue, dust, dirt, as well as various molecules containing atoms such as carbon, hydrogen, and/or oxygen. Particulates frequently adhere to a substrate surface by weak covalent bonds, electrostatic forces, van der Waals forces, hydrogen bonding, coulombic forces, or dipole-dipole interactions, making removal of the particulates difficult.
Historically, particulate contaminants have been removed by a combination of chemical and mechanical processes. These processes employ cleaning tools and agents that have a probability of introducing additional contaminants during a cleaning process.
Another technique for cleaning a substrate surface omits the use of chemical agents by exposing the surface to high heat to vaporize contaminants present thereon. The vapors are removed by evacuating a chamber in which the substrate surface is present. The high temperatures required for this process limits its application to post deposition processes not involving material having a structure that varies at temperatures proximate to the vaporization temperature of the contaminants.
Another cleaning technique is disclosed in U.S. Pat. No. 6,881,687 and employs a laser-clean yield-enabling system. The system incorporates a laser cleaning operation working in conjunction with a defect inspection operation cooperating to feed information regarding the root cause of remaining defects back to earlier process stages, for correction of the root causes, with resultant improvement in yield. In a simplest configuration, the particles remaining after a laser cleaning would be characterized as to their types, sizes, shapes, densities, locations, and chemical compositions in order to deduce the root causes of the presence of those particular particles. This information is used to improve the yield of subsequent product wafers being processed so that their yields are higher than the wafers characterized. It is desired, however, to provide a more robust cleaning process that avoids the presence of particulate contaminants remaining on the surface that has been subjected to a cleaning process.
Therefore, a need exists to provide improved techniques to clean substrate surfaces.

Substrate cleaning technique employing multi-phase solution


Systems and methods of managing published content of a shared storage medium can include rendering client-side script of published content at a client device. When rendering the client-side script, information from which a partition name can be computed can be transmitted to a server. The server can compute the partition name and identify a partition of the shared storage medium corresponding to the partition name. If a partition corresponds to the partition name, the server transmits data stored in that partition to the client device. If a partition does not correspond to the partition name, the server creates the partition. The server can also create message queue associated with the partition and the client device to place messages corresponding to updates to the partition. In response to a data update operation of the client-side script, the server transmits the updates in the message queue to the client device.

When accessing content over the World Wide Web, a client-side device typically retrieves the content from a web-based server associated with a content provider. The client-side device renders the content to display the web content. For example, the client-side device can have a browser application stored thereon which is executable by a processor of the client-side device to communicate with a web-based name server that translates a website address into an IP Address. The browser then forms a connection to the server associated with that IP address. The browser can then send a request to the server for the content (for example, the HTML file), and the server can send the requested web content to the client-side device for rendering by the browser. The next time the browser requests the content from the same IP address, the browser can synchronize the content it retrieved from the previous request to update the content with any new information or revised content associated with the IP address or the browser can download the content again to replace the content previously retrieved from the IP address.
With respect to synchronizing and updating the content, a conventional client-side computer can locally store the content at a client-side database, which resides in the client browser. In such client-side database, data stored will be on a per browser basis. For example, if a user switches between web browser applications, different client-based databases will be utilized. With the client-based database, data stored therein will remain in the client-based database, even after the browser is closed. Therefore, the next time the browser is launched and the content is retrieved, the content can be retrieved from the client-side database and synchronized or updated with any new information or revised content from the web-based server associated with the content provider of the content. The content also can be stored in a database server. For example, the database server can be the back-end system of a database application using client/server architecture. The database server can perform tasks such as data analysis, storage, data manipulation, archiving, and other non-user specific tasks. When the client device attempts to retrieve content from the web-based server of the content provider, the content can be retrieved from a database server associated with the client device and the web-based server. The database development, determination of whether the content has been modified, and synchronization of content between the client-side device and the various servers and databases associated with the content provider can be cumbersome and can become more complicated with more complex content.

Managing and retrieving content from a shared storage


A seismic cable (1) including a plurality of electrical/optical elements (5) which are arranged to be interconnected with a number of seismic sensor devices (24) arranged at intervals along the cable and installed in a housing (15) integrated in the cable (1). The sensor housing (15) is centrally arranged in the cable (1) and interconnected with a central strength element (2). The electrical/optical elements (5) are arranged over and around the central element (2) and over the housing (15).

The present invention relates to seismic cables in general and in particular to seabed laid seismic cables. Such cables are arranged to be installed in arrays to cover a certain area on the seabed. The seismic cables are designed to detect sound wave signals reflected from subsea oil and gas reservoirs when air guns are detonated in the sea.
The seismic cables include a number of sensor devices which are powered from a surface vessel. The array of seabed seismic cables may also include electronic units for signal processing. The cables therefore also include power conductors for the electronic units and for the sensors, as well as signal conductors for interconnections and transmitting processed signals detected by the sensors to the vessel.
The object of the present invention is to provide an improved seabed laid seismic cable which can be manufactured in long lengths. The main features of the invention are defined in the accompanying claims. With this invention we have obtained a type of seismic cable which is suitable for installation on the seabed and which can be connected in arrays.

Seismic cables and a method for manufacturing such


Disclosed is a process for reacting carbon dioxide with hydrogen. In the process a catalyst having carbon dioxide adsorbed thereto is contacted with hydrogen at an elevated temperature. The catalyst can be regenerated by contacting depleted catalyst with a carbon dioxide source, for example a flue gas of a power plant. In a preferred embodiment carbon dioxide is reacted by in situ hydrolysis of water.

1. Field of the Invention
The invention relates generally to the conversion of carbon dioxide to hydrocarbons and more particularly to a catalytic process for the conversion of carbon dioxide to hydrocarbons.
2. Description of the Related Art
Processes have been proposed for the conversion of carbon dioxide to hydrocarbons. The prior art processes generally comprise a number of reaction steps.
DE 101 56 975 A1 discloses a four-step process. In the first step carbon dioxide is isolated from the earth's atmosphere. In the second step water is dissociated by electrolysis into hydrogen and oxygen. In the third step the carbon dioxide is reacted with the hydrogen to form carbon monoxide and water. In the fourth step a mixture of the carbon monoxide and additional hydrogen is converted to hydrocarbons and water.
DE 203 20 020 U1 discloses an integrated plant for the production of cement and hydrocarbons. Electric energy from a nuclear plant is used to dissociate water to form hydrogen. Carbon dioxide is reacted with hydrogen in a reverse water gas shift reactor to form carbon monoxide, which in turn is reacted in a Fischer-Tropsch reactor to form hydrocarbons.
A similar process (reverse water gas shift reaction of carbon dioxide and hydrogen, followed by a Fischer-Tropsch reaction) is disclosed in US 2005/0232833.
GB 2 418 430 A discloses a process in which carbon dioxide is enriched from the atmosphere, or a carbon dioxide rich flue gas is used. Carbon dioxide is reacted with hydrogen to hydrocarbons in a Fischer-Tropsch reaction. The document does not disclose how the carbon dioxide/hydrogen mixture is converted to the syngas feedstock required for the Fischer-Tropsch reaction.
GB 2 459 430 A discloses a process wherein carbon dioxide is extracted from the atmosphere by chemical and physical extraction. The carbon dioxide is subjected to catalytic hydrogenation in the presence of hydrogen obtained from electrolysis of water. In one embodiment carbon dioxide is reacted with hydrogen to methanol; in turn, methanol is converted to hydrocarbons in a Fischer-Tropsch process. In a second embodiment carbon dioxide is reacted to octane using two catalysts, a salt in addition to a nickel hydrogenation catalyst.
U.S. Pat. No. 4,339,547 discloses a process in which carbon dioxide is extracted from the atmosphere, for example using NaOH to form Na2CO3. Hydrogen is produced by electrolysis. Carbon dioxide is reacted with hydrogen over a copper catalyst to form methanol. Methanol is converted to hydrocarbons over a zeolite catalyst.
WO 00/25380 discloses a process for storing solar energy. In the process solar energy is converted to electric energy using photovoltaic cells. The electric energy is used in electrolysis to form hydrogen. The hydrogen is reacted with carbon dioxide to form methanol, which is used as a fuel in a methanol fuel cell to generate electric energy.
WO 99/20713 discloses an intricate process in which carbon dioxide generated in the combustion of a fossil fuel, such as methane, is reacted with hydrogen in a Sabatier reactor over a nickel catalyst.
WO 2007/108014 discloses a process in which carbon dioxide from an industrial combustion process is reacted with hydrogen from water electrolysis to form methanol. The methanol is converted to hydrocarbons in the Mobil methanol-to-gasoline (MTG) process.
Thus, there is a particular need for an improved catalytic process in which carbon dioxide sequestration is combined with its catalytic conversion. There is a particular need for such a process that uses a renewable energy resource for the production of hydrogen.

Catalytic process for reacting carbon dioxide with hydrogen


An autotensioner comprises a cup-shaped stationary member, an arm rotatably attached to an opening of the stationary member. An axial bore is formed in the bottom of the stationary member. A rocking wall extending to the bottom is provided at the arm. A first friction member is provided between the rocking wall and the inner wall of the opening. The first friction member is gripped between the rocking wall and the inner wall. A rocking shaft extending to the bottom is provided at the center of a lid portion of the arm. The rocking shaft is inserted in the axial bore. A second friction member is provided between the rocking shaft and the axial bore. The first friction member and the second friction member are formed of a synthetic resin mainly comprised of PPS, exhibit high limited PV factors, and exhibit low coefficients of friction.

1. Field of the Invention
The present invention relates to an autotensioner used in a belt system for transmitting drive power of, for example, an automobile engine to a driven pulley by a transmission belt.
2. Description of the Related Art
Conventionally, there is known an autotensioner, which is provided in a driven apparatus for transmitting drive power of an automobile engine to a plurality of equipments through a transmission belt, to reliably transmit the drive power to each of the equipments by imparting tension to the transmission belt. Such an autotensioner is provided with a stationary member so that it can be fixed to an engine block, for example, an arm rocking with respect to the stationary member, and a pulley attached rotatably to the arm. A torsion coil spring, for example, is housed in the stationary member so as to give tension to the transmission belt through the pulley.
In such an autotensioner, when the transmission belt vibrates, the arm rocks and a load acts between the arm and stationary member. To counter this load and attenuate the vibration of the belt and to prevent damage caused by contact between the arm and the stationary member, a friction member formed from a synthetic resin, for example, is fixed to the arm, and slides against the stationary member when the arm rocks. For the engagement of the friction member, it is known to use a C-spring biasing the friction member from the inside thereof by a substantially constant pressure. For example, this configuration is disclosed in Japanese Unexamined Patent Publication (Kokai) No. 8-338487.
However, a C-spring has to be set in material and shape in accordance with the required pressure. Further, it is necessary to provide a structure for engaging the C-spring with the friction member. Thus, when using a C-spring, there are the problems of a complicated configuration and increased manufacturing cost.
Therefore, an object of the present invention is to provide an autotensioner in which a friction member is fixed by a simple structure without using a C-spring to generate the required damping force.
According to the present invention, there is provided a cup-shaped stationary member, an arm, a pulley, and a first friction member.
The cup-shaped stationary member has an opening and a bottom, in which an axial bore is formed. The arm is attached to the opening. The arm has a rocking shaft, which extends to the bottom and is inserted into the axial bore, so that the arm rocks about the rocking shaft. The arm has a stub shaft offset from the rocking shaft and extending in the opposite direction to the rocking shaft. The pulley rotates about the stub shaft and gives a tension to a transmission belt. The first friction member is provided between an annular wall of the stationary member, which is positioned close to the opening, and a rocking wall formed on the arm, to generate a first frictional resistance by rocking of the arm.
By the simple structure in which the friction member is gripped between the circumferential wall and the rocking wall, a damping force is generated.
The autotensioner may be provided with a second friction member interposed between the axial bore and the rocking shaft to generate a second frictional resistance by rocking of the arm. By providing this second friction member, along with the first friction member, the rocking of the arm is attenuated.
Preferably, the first friction member has a friction surface generating the first frictional resistance with the rocking wall by rocking of the arm, and the area of the friction surface is set to a size in accordance with a maximum load acting on the first friction member.
The area of the friction surface of the first friction member may be determined by the following formula:
A={(a+b)/a}xc3x97F/P
wherein A is the area of the friction surface of the first friction member, a is the distance from a first peak position where a maximum load acts on the second friction member to a second peak position where a maximum load acts on the first friction member, b is the distance from the second peak position to a third peak position where a maximum load acts on the pulley, F is a maximum load acting on the pulley, and P is a withstand pressure of the first friction member.
Preferably, the first friction member is made of a synthetic resin mainly comprised of polyphenyl sulfone, and the synthetic resin exhibits a limited PV factor substantially exceeding 2.0 MPaxc2x7m/sec when sliding against the arm at a speed of substantially 0.5 m/sec. By making the first friction member of a material with a high limited PV factor, a sufficient durability can be exhibited against rocking of the arm.
The rocking wall and the annular wall may face each other and be substantially parallel, and the first friction member may have a bearing portion formed in a tubular shape between the rocking wall and the annular wall. Such a first friction member is easy to form.
The rocking wall may face the annular wall at a slant, and the first friction member may have a bearing portion formed in a taper between the rocking wall and the annular wall. Such a first friction member can exhibit a high durability with respect to the radial load by adjusting the thickness of the shaft member in accordance with the distribution of the load acting on the bearing portion.
Preferably, a normal-rotation damping force, acting on the arm when the arm moves in a first direction in which the transmission belt slacks, is greater than a reverse-rotation damping force, acting on the arm when the arm moves in a second direction in which the transmission belt is tensioned.
Further, preferably, a dynamic damping force acting on the arm is greater than a static damping force acting on the arm. In this case, the dynamic damping force is more than two times the static damping force.


A computer implemented method is provided to expand a limited amount of input to conditional probability data filling a Bayesian Belief network based decision support apparatus. The conditional probability data defines conditional probabilities of states of a particular network node as a function of vectors of state values of a set of parent nodes of the particular network node in the Bayesian Belief network. The computer implemented method comprises receiving elicited conditional probability data that defines the conditional probabilities of the state values of the particular network node for a subset of all possible vectors of combinations of state values of the parent nodes. Conditional probability data defining the conditional probabilities of the state values of the particular network node for further possible vectors of state values of the parent nodes is interpolated from the elicited conditional probability data. The influence factors are determined.

Computer based decision support based on Bayesian belief networks (BBNs) has been performed ever since the introduction of BBNs in the 1980s by Kim and Pearl (1983), and has found widespread use in the support of decision making.
A BBN is a known data structure to represent and reason with uncertainty in decision making processes. A BBN represents a directed a-cyclic graph (the network) consisting of nodes and arcs. The nodes represent variables Xc and the arcs the dependencies between the variables. An arc from a node A to a node B means that the probability of occurrence of the states of node B depends on the state of node A. In this case A is referred to as predecessor or parent of node B, and B in its turn as descendent or child of node A. The BBN makes it possible to compute the joint probability distribution for all the variables (nodes) in the belief network. This is done by determining for each variable Xc its conditional probability distribution, where the conditioning variables—if any—are the variables of its parent nodes. These variables may be denoted with pa(Xc). The full joint probability distribution for all the variables in the network, P(X1, . . . , Xn), can then be derived as
      P              (                        X          1                ,        …                                          ,                  X          n                    )        =            ∏              c        =        1            n                                            P                          (                                    X              c                        ❘                          pa                                            (                                  X                  c                                )                                              )                    .
Before it can be used, the BBN has to be constructed. This means that the variables of the belief network and their discrete states (the values that these variables may assume) must be defined, as well as the dependencies between the variables and the conditional probabilities. Known methods involve posing questions to experts to determine these parameters. The process of posing questions to experts to collect data is referred to as elicitation.
The elicitation task is considered a major obstacle in the use of BBNs. For a BNN of a realistic problem, quantification of its probabilities requires a formidable amount of work from experts. The number of probabilities that need to be specified for a node can grow large very easily. For a node with three states that has a parent node with also three states, 6 probabilities need to be specified to determine its conditional probability table (CPT). An additional second and third parent node with three states would consequently require a table of 18 and 54 probabilities, and so on with exponential growth. For many applications these probabilities need to be specified subjectively by experts. Apart from the huge amounts of time it would take to assess all the probabilities for large CPTs, it can also be questioned to what extent assessors can be expected to coherently provide the probabilities at the level of detail required.
In order to reduce this obstacle it is desirable to provide for a separation of elicitation in steps with expert involvement and automated steps that can be performed by a machine without expert involvement. In this case the obstacle is formed by the steps that require expert involvement. By improving the machine steps this obstacle can be reduced.
Tang and McCabe (2007) disclose an approach to reduce the number of assessments to be made by experts. In this approach it is assumed that each state variable can assume only two values, which may be called positive and negative. Tang and McCabe (2007) propose to identify "dominant" state values of parent nodes. When a parent node has a dominant state value, the probability of the child node is not affected by the state values of the other parent nodes. This identification enabled the elimination of about half the elicitation task, but left a substantial amount of expert involvement for cases when there was no dominant state value or the state of the relevant parent node did assume its dominant state value.
Absent a dominant state value, Tang and McCabe proposed to use interpolation to supply part of the conditional probabilities without expert input. The expert is asked to identify a set of "most favorable" state values of the parent nodes of a current node that results in a highest probability of a positive state value of the current node. The expert is also asked to supply a value of the probability in this case and a probability in the case wherein the variables of all parent nodes assume the opposite of the most favorable state values. Subsequently, the conditional probabilities for other sets of state values of the parent nodes are determined by interpolation between these probabilities, using the number of parent nodes that have most favorable state values to determine the relative weights of these probabilities in the interpolation.
Furthermore, Tang and McCabe propose a refinement of this method, wherein the experts are asked to provide additional conditional probabilities for a limited number of selected sets of state values of the parent nodes with different numbers of parent nodes that have most favorable state values. In this case piecewise linear interpolation between these additional conditional probabilities is used. In a further refinement, it is detected whether significant discrepancies occur between conditional probabilities provided by experts for selected sets of state values of the parent nodes with the same numbers of parent nodes that have most favorable state values. In this case, the experts are asked to provide more conditional probabilities.
However, the methods of Tang and McCabe work only in the case of binary variables. In the case of two possible state values for a node, the probability of one state value is simply one minus the probability of the other. Tang and McCabe do not account for the distribution of probability over more state values. Also Tang and McCabe assume that the state value of a parent node is either favorable or unfavorable. They do not account for more refined differences of the effect when a parent node can have one of more than two possible state values.
US patent application 2006020568 describes a software tool that provides the functionality to construct a BBN (i.e. to define nodes and their states and the dependencies between these nodes), to quantify the network (i.e. to input the necessary conditional probabilities), and to perform inference on the network. This tool only provides an input module for the conditional probabilities needed without giving guidance and support in how to gather these probabilities, especially in the case when the probabilities are obtained via expert judgement elicitation.
Other solutions have been proposed for relieving the elicitation task for discrete BBNs. One solution is to make it easier for the assessors to provide the probabilistic assessments required. Van der Gaag, Renooij, Witteman, Aleman and Taal (1999) aim to achieve this by transcribing the conditional probabilities and using a scale containing both numerical and verbal anchors. But the effort needed to assess a full CPT using this method, though reduced, is still exponential in the number of conditioning variables.
Another option for relieving the elicitation burden is to reduce the number of probabilistic assessments to be made. This can of course be achieved by reducing the number of conditions (parent nodes) or the number of states of the variables, but such reductions will often be undesirable (e.g. leading to loss of detail needed to inform a decision).

Automated filling of conditional probability data in a decision support apparatus that uses a Bayesian belief network

Nederlandse Organisatie voor Toegepast-Natuurwetenschappelijk Onderzoek Tno


This application describes how Session Description Protocol (SDP) preconditions signaling can be enhanced to support lead role negotiation, precondition capability exchange, premature precondition attempts and concatenated preconditions processing. The application describes the use of send and receive tags in an SDP message for a given media line. In a given message, a success or failure tag may be associated with a send or receive tag in addition to an optional or mandatory condition indicator tag. A lead role indicator may also be associated with a send or receive tag to indicate a desired preference with regard to the sender or receiver taking the lead role. These additions lead to a greater chance of successful session set-up completion, reduce the number of signaling exchanges in general, and enable precondition attempts to be started earlier and to be executed in parallel.

Many applications require a minimum amount of resource to be useful. One example is traditional voice telephony that below either a target minimum bandwidth or above a maximum delay becomes unusable. During call set-up in traditional fixed telecom networks (e.g., the PSTN), a signaling channel first checks that sufficient resources exist between the caller and callee before admitting the call and ringing the callee in the case of voice. If there is insufficient resource then the call is refused with a network busy signal. The resource availability is a precondition for the session to be set-up. This model has continued into the Internet world to ensure that Voice over IP applications can offer an equivalent user-experience to the PSTN, and so that VoIP can successfully interwork with the PSTN. However, many IP multimedia sessions would not require such a strict model.
A SIP Working Group Internet Draft Document: <draft-ietf-sip-manyfolks-resource-02> dated August 2001, hereinafter "the Draft" describes known art on the support of preconditions in the Internet signaling plane. The Draft may be obtained from the Internet Engineering Task Force (IETF) which can be contacted at www.ietf.org. This patent application is to be read and understood in the context of this existing Draft. The Draft describes how the Session Initiation Protocol (SIP) (session set-up signaling) can be used to carry the Session Description Protocol (SDP) (description of the session to be set-up) between Internet endpoints. The Draft specifically describes SDP preconditions whereby both SIP and SDP are extended to enable the two ends to negotiate and agree on the preconditions for the session. In addition, the signaling also establishes the order in which the two ends will attempt to meet those preconditions. The preconditions are direction specific in that they apply to the two endpoints A (the caller) and B (the callee) in the form of a precondition for resources and/or security from A to B, from B to A or for both directions. The preconditions attempt order can be B only, A then B or B then A then B (for example). The attempt order is determined through the exchange of confirm requests during the SDP exchanges. The results of each attempt on a precondition are then communicated to the other endpoint in a new SIP message defined in the Draft named the COMET (confirmation). An example of a typical SIP signaling flow is shown in FIG. 1.
The major problems with the existing model are as follows;                i) They have been designed specifically with the heavyweight VoIP requirement which leads to a large amount of signaling messages even for the simplest of preconditioned sessions.        ii) The capabilities of the endpoints for meeting offered preconditions are not fully exchanged so it is possible that excess signalling and set-up delay can be generated chasing unavailable options.        iii) The lead roles for the endpoints in meeting preconditions (first attempts) is not always agreed and so first attempts cannot necessarily execute in parallel. Parallel execution would reduce set-up times and would only be extended if the lead endpoint failed to meet a precondition due to probabilistic events (in which case the next endpoint would retry following a COMET). In addition, many lead role options are not available due to them not being fully negotiable as a result of the signalling design.        iv) Preconditions cannot generally start to be attempted until the pre-ring (pre-SIP 180 response) signaling has completed. This is a VoIP requirement (phone doesn't ring until resources are in place) but not typical across all IP applications and sessions. This enforces all sessions to incur the cost of multiple signaling messages and associated signaling delay even when both ends already have all preconditions in place (preconfigured resources or security associations).        v) Preconditions are negotiated only by endpoints and the Draft makes arguments as to why this is reasonable. However, the arguments are specific to the CableLabs DOCSIS DqoS architecture which provides QoS (Quality of Service) and security signaling between the hosts end to end to enable them alone to meet the preconditions. However, end to end QoS signaling is expensive and slow and not necessary in a large number of deployment scenarios. A more general model for preconditions signaling is therefore required.

This patent is subject to a terminal disclaimer.

Methods for enhancing SDP preconditions signalling for IP multimedia sessions


A sense-amp transistor for a semiconductor device and a method for manufacturing the same are disclosed. A sense-amp transistor for a semiconductor device includes a recess array formed in a gate region of a sense-amp, a plurality of buried gates formed in each recess of the recess array so as to form a vertical channel region, and an upper gate configured to form a horizontal channel region in an active region between the buried gates. As a result, the number of additional processes is minimized, and the sensing margin of the sense-amp is guaranteed.

Embodiments of the present invention relate to a sense-amp transistor of a semiconductor device, and more particularly to a sense-amp transistor of a semiconductor device and a method for manufacturing the same, which can minimize the number of additional processes by improving a gate structure of the sense-amp transistor, thus increasing a sensing margin.
A sense amplifier (hereinafter referred to as a sense-amp) of a semiconductor device includes a pull-up element using a PMOS transistor and a pull-down element using an NMOS transistor, such that it amplifies a data voltage loaded on a bit line (BL) and a bit line bar (/BL) and outputs the amplified result to a data bus.
FIG. 1 is a circuit diagram illustrating a pull-up element and a pull-down element of a sense-amp for use in a semiconductor device.
Referring to FIG. 1, the sense-amp of the semiconductor device includes PMOS transistors (P1, P2) and NMOS transistors (N1, N2), that are complementarily coupled to one another in the form of a cross-coupled latch between a pull-up voltage (RTO) and a pull-down voltage (SB). A gate of the PMOS transistor P1 and a gate of the NMOS transistor N1 are coupled to a bit line (BL), and a commonly connected drain of the PMOS and NMOS transistors P1 and N1 is coupled to a bit line bar (/BL). A gate of the PMOS transistor P2 and a gate of the NMOS transistor N2 are coupled to the bit line bar (/BL), and a commonly connected drain of the PMOS and NMOS transistors P2 and N2 is coupled to the bit line (BL).
FIG. 2 is a plan view illustrating a sense-amp shown in FIG. 1.
Referring to FIG. 2, an active region 10, in which four transistors are to be formed, is formed in a square shape, and a gate of each transistor constructing the sense-amp is in a ring shape in the active region 10.
Transistors constructing the sense-amp shown in FIG. 2 have been designed to use a recess gate structure to increase a current.
However, recently, as the integration degree of semiconductor devices increase and cell size gradually shrinks, the sense-amp area also shrinks.
However, since a conventional sense-amp allows a gate of each transistor to be configured in the form of a recess gate, and uses a ring-type gate structure as the recess gate, it is difficult to shrink the sense-amp area.
In addition, in the conventional sense-amp a channel was formed only in a recessed channel region, so that it may be difficult to guarantee the sensing margin when the size of the semiconductor device is reduced.

Sense-amp transistor of semiconductor device and method for manufacturing the same


An inverter control for an N phase inverter includes a single memory which stores a plurality of bytes, circuitry coupled to the memory for developing a series of memory addresses for each phase output of the inverter, each series of memory addresses defining a phase output waveform to be produced and circuitry coupled to the developing circuitry for accessing the memory with a memory address from each series thereof during each of a number of accessing cycles so that N bytes are provided at an output of the memory during each accessing cycle. A demultiplexer is coupled to the memory for deriving gating signals for switches in the inverter from the bytes provided at the output of the memory.

Inverters for converting DC power into AC power for AC loads typically include one or more inverter legs, each leg in turn having a pair of controllable switches connected in series across the terminals of a DC power source. The inverter switches, which may be bipolar transistors, insulated gate bipolar transistors (IGBT's) or the like, are operated by an inverter control circuit to produce a PWM output waveform. For a three-phase inverter, the outputs of three inverter legs are typically displaced 120.degree. with respect to one another.
Prior inverter controls have been developed which utilize PWM patterns that are stored in a memory and which are retrieved in accordance with a voltage magnitude command signal and a frequency command signal. Examples of such types of inverter controls are disclosed in Ito, U.S. Pat. No. 4,672,285 and Ito et al., U.S. Pat. No. 4,654,773. In at least the case of the Ito '285 patent, all of the control signals for the inverter legs are derived from a single voltage pattern provided at the output of a read only memory, and hence independent phase voltage regulation is apparently not possible.
Other types of inverter controls have been designed wherein a separate memory is provided for each inverter phase and wherein the memories are separately accessed to allow individual phase voltage regulation. An example of such a control is disclosed in Parro II, U.S. Pat. No. 4,595,976, assigned to the assignee of the instant application and the disclosure of which is expressly incorporated by reference thereto. The Parro inverter control includes 3 memories, each of which stores a plurality of half-cycle PWM waveform patterns. The memories are individually addressed so that appropriate half-cycle PWM control waveforms are obtained for each phase. The half-cycle waveforms are used in conjunction with half-cycle signals to derive the switch control signals required to reproduce an entire cycle of an inverter phase output.
Other types of inverter controls are disclosed in Shekhawat et al., U.S. Pat. No. 4,635,177, Glennon, U.S. Pat. No. 4,527,226 (both of which are assigned to the assignee of instant application), Japanese Patent No. 60-74969 to Tomita and Japanese Patent No. 57-55775 to Maekawa.

Inverter control with individual phase regulation


To control precoding of a terminal in a serving base station, a first codeword that maximizes transmission power of the serving base station is determined by a codebook, and an index of a second codeword that minimizes interference to the neighboring base station is transmitted from the neighboring base station. The serving base station transmits an index of the first codeword, an index of the second codeword, and a combination ratio of a precoding matrix corresponding to the index of the first codeword and a precoding matrix corresponding to the index of the second codeword to the terminal.

(a) Field of the Invention
The present invention relates to a precoding apparatus and method, and a precoding control apparatus and method in a communication system.
(b) Description of the Related Art
Among communication systems, a multi-input multi-output (MIMO) communication system uses antennas that enable multi-input and multi-output. A base station and/or a terminal transmit data through multiple paths by using multiple antennas and detect signals received through multiple paths.
A direction for transmitting data can be controlled if a beam is formed according to a precoding matrix when the multiple antennas are used. However, the formed beam may cause inter-cell interference.

Precoding method and apparatus, and precoding control method and apparatus

Electronics and Telecommunications Research Institute


An apparatus and method thereof for communicating a scramble key (for descrambling scrambled digital signals) and service information (used in an electronic programming guide) to an intelligent transceiver (e.g., a set-top box) using a bi-directional digital broadcast system. The intelligent transceiver includes an in-band tuner adapted to receive from the digital broadcast system in-band digital signals comprising audio content and video content. The intelligent transceiver also includes a second tuner adapted to send and receive a scramble key over the World Wide Web via a cable modem. In one embodiment, the in-band digital signals received by the in-band tuner also contain service information. In another embodiment, the digital signals received by the second tuner via the cable modem also contain service information. Thus, the scramble key is sent over the World Wide Web and is received by the intelligent transceiver using a cable modem. The service information is sent either with the in-band signal or over the World Wide Web, and is received via the in-band tuner or the cable modem, respectively. Therefore, the broadcast system does not need to use out-of-band signals. Accordingly, the intelligent transceiver does not require an out-of-band tuner and demodulator to receive the scramble key and service information, and so these devices can be omitted from the intelligent transceiver, thereby simplifying the transceiver and reducing costs.

1. Field of the Invention
The present invention relates to the field of intelligent transceivers such as set-top boxes, in particular bi-directional set-top boxes. More specifically, the present invention pertains to a modular set-top box architecture in which the devices needed for bi-directional communication are substantially located in a single functional block.
2. Background Art
Digital broadcast systems include direct broadcast digital satellite systems, interactive World Wide Web access systems, and digital cable systems. Digital broadcasting provides a number of advantages to subscribers, such as variety and flexibility of programming, useful and comprehensive support services (such as detailed electronic programming guides), and superior audio and video quality. Subscribers receive broadcast digital signals via set-top boxes or other similar consumer electronic equipment (generally, a xe2x80x9ctransceiverxe2x80x9d) located in the subscriber""s home. In an intelligent set-top box, information and instructions associated with receiving and processing digital broadcast signals are stored in a memory unit of the set-top box and executed by a processor. With a bi-directional set-top box, in addition to receiving broadcast signals, a subscriber can transmit messages to the digital broadcast system operator (also referred to as a Multiple System Operator, MSO).
Using a bi-directional set-top box, a subscriber can select a premium service offered by the MSO, such as a pay-per-view event or movie, and the subscriber""s selection as well as information needed for billing purposes are transmitted to the MSO. In a common implementation, a xe2x80x9csmart cardxe2x80x9d stores the information needed for billing, and on a periodic basis (perhaps once per month) an automatic connection is made between the transceiver and the MSO so that the billing information can be transmitted to the MSO. To prevent unauthorized use, MSOs typically broadcast a scrambled signal. The signal is descrambled in the transceiver using a xe2x80x9cscramble keyxe2x80x9d provided by the MSO.
A set-top box performs a number of functions associated with processing a broadcast digital signal. In a typical prior art embodiment, the digital signal received by the set-top box is scrambled, and the signal is descrambled by the set-top box before further processing occurs. The descrambled signal is then encrypted within the set-top box in order to prevent unauthorized duplication and use (xe2x80x9cpiratingxe2x80x9d) of the descrambled signal. Once the encrypted signal is at a more secure location within the set-top box, it is decrypted for further processing. The digital signal is typically in a compressed data format such as MPEG (Moving Picture Experts Group) for video signals and/or Dolby AC3 for audio signals, and so the decrypted signal is decoded (uncompressed) by the set-top box. After decoding, the audio content and video content contained in the digital signal are processed so that it can be viewed and/or listened to by the subscriber using, for example, a television set.
Prior Art FIG. 1 is an illustration of the various frequencies associated with different types of broadcast signals. The frequencies in the range of approximately 5-42 MHz are known as xe2x80x9cupstreamxe2x80x9d signals, and the frequencies in the range of approximately 54-860 MHz are known as xe2x80x9cdownstreamxe2x80x9d signals. From the perspective of a set-top box, an upstream signal is transmitted and a downstream signal is received.
Within the upstream range, the range of frequencies from approximately 5-26 MHz are known as xe2x80x9cout-of-band (OOB) upstream,xe2x80x9d and the range of signals from approximately 26-42 MHz are known as xe2x80x9ccable modem upstream.xe2x80x9d Within the downstream range, the range of frequencies from approximately 70-130 MHz are known as xe2x80x9cout-of-band downstream.xe2x80x9d
The OOB upstream range is used by the set-top box to send billing information, for example, to the broadcast system operator or MSO. The cable modem upstream range is used by the set-top box for communicating with the World Wide Web, for sending e-mail, and the like. The in-band downstream range is used by the set-top box for receiving audio and video content. The OOB downstream range is used by the set-top box for receiving service information (e.g., electronic programming guide information, EPG) and for receiving the scramble key used by the set-top box to descramble a scrambled broadcast digital signal. An EPG typically provides information such as the names of programs, the time and channel associated with each program, and extended text tables with information regarding the subject matter of the program, actors names, and the like. An EPG generally is formatted as a table, with channels along one axis of the table, times along the other axis, and the name of the program at the intersection of the time and channel.
Current broadcast systems typically need to support both analog and digital television, and so the in-band downstream range is used for carrying both analog and digital audio and video (A/V) content. However, the bandwidth of the in-band downstream range is too narrow to accommodate the service information and scramble key in addition to the analog and digital A/V content. As a result, the OOB downstream range is used to carry the service information and scramble key.
Prior Art FIG. 2 is a block diagram showing the architecture of a typical broadcast system 200. A/V content for broadcast system 200 is provided by A/V content provider 230. The A/V content is provided in the in-band downstream range to the many set-top boxes in broadcast system 200 (e.g., set-top boxes 250a, 250b, 250c, 250d and 250e). Depending on the type of system, broadcast system 200 may utilize a terrestrial broadcast (e.g., a wireless broadcast) or a terrestrial line (e.g., cable).
EPG server 210 provides the service information and scramble key for broadcast system 200, although there may be a different source for this information in other implementations. The service information and scramble key are forwarded to out-of-band modulator 220 and then broadcast in the OOB downstream range to set-top boxes 250a, 250b, 250c, 250d and 250e.
Set-top boxes 250a, 250b, 250c, 250d and 250e may also be communicatively coupled to the Internet via Internet router 240. Communication with the Internet typically uses Internet Protocol (IP).
Prior Art FIG. 3 is a block diagram illustrating an exemplary embodiment of an intelligent transceiver (e.g., set-top box 250a) used in broadcast system 200 of FIG. 2. Central processing unit (CPU) 330 contains a processor and memory (not shown) for processing information and instructions used by set-top box 250a.
With reference to FIG. 2 and FIG. 3, set-top box 250a includes an in-band tuner 305 for receiving the in-band downstream signals from A/V content provider 230. In-band tuner 305 typically receives fixed frequency broadcast channels. The in-band downstream signal is demodulated by demodulator 310, then forwarded to A/V decoder 315 for decoding, as described above. From A/V decoder 315, the decoded signal is sent to a graphics block (not shown) for processing so that it can be displayed and/or listened to.
Continuing with reference to FIG. 2 and FIG. 3, set-top box 250a also includes an out-of-band tuner 320 for receiving the out-of-band downstream signal containing the scramble key and service information (SI). The out-of-band downstream signal is demodulated by modulator/demodulator 325. The scramble key can be applied to the in-band downstream signal to descramble that signal and retrieve the A/V content (when the in-band downstream signal is scrambled, e.g., for a pay-per-view movie or event). The service information (if compressed) is decoded by A/V decoder 315, then sent to a graphics block for processing so that the electronic programming guide can be displayed. Messages from set-top box 250a, such as a selection of a pay-per-view movie or event and the associated billing information, is modulated using modulator/demodulator 325 and sent to the MSO in the out-of-band upstream range.
Set-top box 250a further includes cable modem 340 to receive the IP data signals (e.g., data packets) retrieved from the Internet and also to send IP data signals to the Internet, including electronic mail. Cable modem 340 typically can also receive in-band signals for non-broadcast information (e.g., variable frequency broadcast channels controlled by the MSO).
A disadvantage of broadcast system 200 is that it requires the use of in-band signals, out-of-band signals, and IP signals in order to send A/V content, service information, a scramble key, electronic mail, etc. Accordingly, it is necessary for a set-top box (e.g., set-top box 250) to include an in-band tuner 305, an out-of-band tuner 320, and a cable modem 340. As a result, additional complexity is introduced into broadcast system 200 and set-top box 250. Consequently, manufacturers of set-top boxes face increased development and fabrication costs, and MSOs face higher costs associated with running and maintaining a broadcast system. These costs are reflected in the prices charged to consumers. Clearly, for the benefit of the manufacturer and the MSO as well as the consumer, it is desirable to minimize these costs.
Accordingly, what is needed is an apparatus and/or method that can reduce the costs of a set-top box and a broadcast system, in particular with regard to supporting the use of in-band signals, out-of-band signals and Internet Protocol (IP) data packets. What is also needed is an apparatus and/or method that can address the above need and that can continue to provide the audio/video content, service information, scramble key, and Internet access currently provided by the in-band signals, out-of-band signals and Internet Protocol data packets.
The present invention includes an apparatus and method thereof that satisfy the above needs. These and other advantages of the present invention not specifically mentioned above will become clear within discussions of the present invention presented herein.
The present invention pertains to an apparatus and method thereof for communicating a scramble key (for descrambling scrambled digital signals) and service information (such as that used in an electronic programming guide) to an intelligent transceiver (e.g., a set-top box) using a bi-directional digital broadcasting system (e.g., satellite systems, interactive World Wide Web access systems, and digital cable systems). The intelligent transceiver includes an in-band tuner adapted to receive from the digital broadcast system in-band digital signals comprising audio content and video content. The intelligent transceiver also includes a second tuner adapted to receive a scramble key over the World Wide Web via a cable modem.
In one embodiment, the in-band digital signals received by the in-band tuner also contain service information (including electronic programming guide information). In another embodiment, the digital signals received by the second tuner via the cable modem also contain service information (including electronic programming guide information). Thus, the scramble key is sent over the World Wide Web and is received by the intelligent transceiver using a cable modem. The service information (including electronic programming guide information) is sent either with the in-band signal or over the World Wide Web and is received via the in-band tuner or the cable modem, respectively.
In one embodiment, the digital signals sent over the World Wide Web are communicated using Internet Protocol.
In another embodiment, an authentication signal is sent via the cable modem to indicate that a valid intelligent transceiver authorized to receive the scramble key is connected to the digital broadcast system.
In yet another embodiment, billing information (pertaining to a subscriber""s use of a premium service such as a pay-per-view movie or event, for example) is sent via the cable modem to the digital broadcast system operator. The cable modem can also be used for Internet access and to send and receive electronic mail.
Therefore, in accordance with the present invention, it is not necessary for the broadcast system to use out-of-band signals to send service information and a scramble key. Consequently, the intelligent transceiver does not require an out-of-band tuner and demodulator to receive the service information and scramble key, and so these devices can be omitted from the intelligent transceiver. As a result, broadcast systems can be simplified, thereby reducing costs. In addition, the manufacture of the intelligent transceiver is facilitated and the cost of the intelligent transceiver can be reduced.

Internet set-top box having an in-band tuner and cable modem


A transparent conductive film. The film comprises a transparent polymer comprising fused latex polymer particles. A plurality of nanowires comprising silver are partially dispersed in the transparent polymer. Devices employing the transparent conductive film and methods of making the devices are also disclosed.

Transparent conductors are widely used in many applications, such as touch panel displays, organic LED lighting, organic photovoltaic devices and dye-sensitized solar cells. Today, the most commonly used transparent conductors are transparent conducting oxides, such as indium-tin oxide (ITO). Because of the fragility and lack of flexibility of ITO films, as well as the limited supply of indium and high cost of vacuum processing employed to make the ITO films, alternatives are being actively sought. Such alternatives include silver nanowires, metal mesh, carbon nanotubes, graphene and conductive polymers.
Among the ITO alternatives, carbon nanotube technology requires the separating of metallic tubes from semiconducting tubes; graphene is very difficult to synthesize and usually offers low transparency; and conductive polymers exhibit high sheet resistance. Given the problems with other alternatives, silver nanowire technology may be the most promising approach due to its relatively high conductivity, high transparency, and solution processability. However, current silver nanowire technology suffers from instability in terms of poor film robustness and/or poor adhesion. New formulations to improve the adhesion of silver nanowire on substrates, without trade off of the conductivity and transparency, are urgently needed.

Transparent conductive film comprising silver nanowires


A method for providing multiple authenticator support when responding to RADIUS Access Request messages is disclosed. The method for providing multiple authenticator support when responding to RADIUS Access Request messages includes receiving a RADIUS Access Request message, retrieving customer authentication information having a first and second authenticator value; attempting authentication against the first authenticator value, and in the event that a failure to authenticate occurs, then attempting authentication against the second authenticator value. In the event of a successful authentication against either the first or second authenticator value, a RADIUS Access Accept message is provided. Examples of first and second authenticator values include a UserName and a MAC address. The method for providing multiple authenticator support when responding to RADIUS Access Request messages provides advantages over single authenticator value systems known in the art.

The RADIUS (Remote Authentication Dial-In User Service) protocol is widely used as a telecommunications standard protocol for the purposes of an AAA (Authentication, Authorization and Accounting) system. Among other uses, the protocol is used for performing mobile subscriber authentication for mobile Internet services, authorization verification and accounting information management. In operation, the RADIUS protocol uses a UDP (User Datagram Protocol) with a transport layer and conforms to a request/response scheme based on a client-server structure.
When employing the RADIUS protocol, some Internet Service Providers require end users to be authenticated by using the Media Access Control (MAC) address. Alternatively, Internet Service Providers may require end users to be authenticated by a UserName.
Using the standard RADIUS protocol as the primary authentication, end users can be authenticated only on MAC or alternatively on a UserName attribute, but cannot use both in the same authentication policy.

Radius policy multiple authenticator support


A new and distinct Ilex plant named ‘FarrowSK6’, characterized by its upright and narrowly pyramidal plant habit; freely branching habit; dense and bushy growth habit; small, glossy dark green-colored leaves; and good garden performance.

The present Invention relates to a new and distinct Ilex plant, botanically known as Ilex crenata and hereinafter referred to by the name 'FarrowSK6'.
The new Ilex plant originated from an open-pollination during the spring of 1999 of Ilex crenata 'Sky Pencil', not patented, as the female, or seed, parent with an unknown selection of Ilex crenata, as the male, or pollen, parent. The new Ilex plant was discovered and selected by the Inventor during the summer of 2002 as a single plant within the progeny of the stated open-pollination in a controlled environment in Earleville, Md.
Asexual reproduction of the new Ilex plant by hardwood cuttings in Earleville, Md. since the autumn of 2002 has shown that the unique features of the new Ilex plant are stable and reproduced true to type in successive generations of asexual reproduction.