Accurate measurement and monitoring of a computer room air conditioning unit's cooling production, distribution, and consumption is necessary to optimize effectiveness and efficiency and minimize redundancy. A mass air flow monitoring device comprises an array of sensor modules and a controller module with display, user interface, and I/O for third party connectivity. The device monitors temperature, pressure, water content, and quantity of airflow in a CRAC's supply air stream and return air stream and compares the two measurements to determine the amount of energy, or enthalpy, put into or taken out of the air. The result, displayed in watts, allows for the efficient control of production, distribution, and usage of supply air from the CRAC unit. Over or under provisioning can be quickly identified and corrected and, when used in conjunction with power consumption monitoring, a “watts of cooling for watts of power consumption” efficiency metric can be provided.

Historically, cooling a data center was a straight-forward matter. Data centers used to generate less power and, consequently, less heat per square foot than modern counterparts. As a result, a technician could simply offset the heat from the equipment by adding additional computer room air conditioning (CRAC) units inside the data center, and there was little need to develop or implement a complex system for monitoring and controlling data room cooling. However, the increase in computer room power consumption, density, and heat generation now requires a more scientific approach to monitoring and controlling computer room data center than ever before.
Because of the density of equipment in most data rooms, technicians have implemented a variety of techniques to improve cooling. For example, in many instances, data equipment is placed on raised floors, two tiles apart, with their air intakes facing each other to achieve the air circulation necessary to keep the computer room cool. In this configuration, CRAC units pump cool air through perforated floor tiles between the racks, the computers and racks intake the cool air and exhaust hot air into the opposing, hot aisle. Computer room air conditioning units on the floor then pull in the hot air exhausted into the hot aisles, and release it underneath the floor tiles, completing the cycle. In this way, a series of CRAC units can keep cool air running through the system and help keep a steady airflow through the environment.
Alternatively, technicians may turn the area above racks into a hot air plenum by placing ducts and more CRAC units in this space. In this case, hot air escapes into the plenum to be pushed back into the system, below the floor, where it can be cooled and released back into the computer room. There are also a variety of other techniques and technologies for cooling data centers. However, in each case careful monitoring and control are required to be effective, and current methods of monitoring and control are obsolete, inefficient and ineffective for several reasons.
First, most current methods of cooling capacity measurement consist of the use of a balometer capture hood with pitot and temperature, humidity, and pressure sensors. Multiple readings are taken with the single device at multiple locations within the sampling area. The readings are then used to manually calculate the cooling measurements. This method is labor intensive, evasive, time consuming, and often inaccurate since, for example, the person taking the measurements may block or divert airflow and affect the results. Also, because of the time involved to take multiple measurements and calculate the results, meaningful information is not available in real time. CRAC manufactures may also attempt to calculate cooling parameters using temperature, humidity, and fan speed. However, this method also suffers from the inability to provide real time data.
Second, current methods of determining effective CRAC unit utilization can be very imprecise. The common methodology is to compare temperature change through the CRAC unit and compare it to the amount of compressor or chill water valve and fan speed. This method does not take into account all of the components required to measure heat capacity—temperature, pressure, water content, and quantity of airflow—and, therefore, cannot fully provide meaningful information about cooling capacity.
In addition, there is currently no efficient method of measuring mass air flow cooling distribution at vents or perforated raised floor tiles used in data rooms. The closest methodology only measures velocity and/or volume of air by using a pinwheel or hot wire anemometer, or a flow hood balometer. The anemometer displays only velocity of air (feet per minute) requiring several sample readings to be taken, and then airflow must be calculated (cubic feet per minute) using the average readings to the sampling area. The flow hood balometer uses a pitot array to measure pressure differentiation and temperature in a specified sampling area to provide a volume of airflow. As will be appreciated by those skilled in the art, neither of these methods account for the four components of mass air flow and are, therefore, ineffective means of measurement. The metrics used (velocity and airflow volume) are not consistent with the requirements for measuring cooling capacity metric (tons or watts) or heat load.
The only way to measure heat load and cooling consumption is to monitor the metered power consumption. Typical data center computers are mounted in a rack or cabinet. Generally, the rack orientates the equipment in a front to rear position. Data center operational best practices promotes the inflow of cooling into the front of the equipment/racks and the exhaust air out of the rear. As a result, mass air flow detection of heat load does not exist in the data center operation methodology. Consequently, there is no effective method for measuring the mass air flow and enthalpy change of data center load.
There is a need, therefore, for a method and system that provides an effective measurement and metric for cooling infrastructure and, more specifically, that can compare actual cooling capacity production to cooling infrastructure power consumption. Such a comparison will present an efficiency metric watts of cooling per watts of power consumption (watts per watts).

Method and system for managing cooling distribution


An option card retainer (10) includes a first elongated leg member (14) and a second elongated leg member (15). The two leg members (14, 15) are aligned with their upper ends connected by a bridge structure (16). The first leg member (14) includes a first clip structure (18) at its lower end and the second leg member (15) includes a second clip structure (19) at its lower end. A biasing device (20) is located beneath the bridge structure (16) between the first and second leg members. The retainer (10) is fastened over an option card (11) with the biasing device (20) compressed between the bridge structure (16) and a top edge (26) of the option card with the clip structures (18, 19) in a gripping engagement with an underside of the option card connector (12).

Computer systems such as personal computers commonly include an expansion bus arrangement. PCI, ISA, and EISA are examples of expansion bus standards commonly used in personal computer systems. These expansion bus arrangements allow additional electrical components and circuitry to be added to the computer system to increase or enhance system capabilities. The additional circuitry is mounted on a printed circuit board commonly referred to as an option card (also known as an expansion card or add-on card). Option cards include a connector strip along one side of the printed circuit board. This connector strip is adapted to be received in a connector slot associated with the expansion bus. An expansion bus arrangement associated with a computer system commonly includes several option card connectors, each having a connector slot for receiving the connector strip edge of an option card.
When an option card is properly received in a slot-type option card connector, electrical pads mounted on the connector strip of the card make electrical contact with receiving elements mounted within the connector slot. The frictional engagement between the connector strip and receiving elements in the connector slot also holds the card in place. In most cases, the option card includes an additional mechanical connector at one end. This additional mechanical connector connects the option card to a frame in which the slot connector is mounted. The additional mechanical connection may be made with a screw or other fastening device, and is intended to help hold the option card in a properly connected position in the respective connector slot.
The connection between the option card connector strip and the connector slot is critical to the proper operation of the system. In the event that the connector strip becomes fully or partially dislodged from the connector slot, the option card and computer system cannot operate properly. An option card connector strip may become dislodged from its connector slot in any number of ways. In some cases, the connector strip comes loose from its connector slot as the computer system is transported or handled. Also, where the frame is misaligned with the system motherboard, mechanically connecting the option card to the frame may pull one end of the connector strip from the connector slot. Regardless of the manner in which an option card becomes dislodged, the resultant error in the computer system commonly results in a service call from the customer and may lead to customer dissatisfaction with the computer system.
Numerous devices have been developed for holding a computer system option card in place in its respective connector. A consistent shortcoming of these prior devices is that the devices required some modification to the computer system or some special structure associated with the computer system. Also, these prior option card retainer devices were cumbersome to install given the limited space available between option card connectors in the computer system.

Option card retainer and retaining method


A printer includes a feed unit; an image forming unit, which executes double-side printing; an acceptance unit, which accepts an execution command of either continuation printing and reprinting if double-side printing is stopped and a first recording medium with only a first side image printed thereon exists in the conveying path of the printer; and a control unit, which prints only the unprinted second side image, if a continuation printing command is entered and the control unit reprints the first side image on a second recording medium and also prints the unprinted second side image on the second recording medium, if a reprinting command is entered.

This invention relates to a printer and more particularly to a printer having a double-side print function.
Hitherto, a printer has been known that when an anomaly, such as a jam, etc., occurs during printing and the printing operation is stopped, the user opens a cover, etc., and removes the sheet remaining in a conveying passage and then the printer prints on a new sheet. Further, a printer has been known that when an anomaly occurs during double-side printing and the printing operation is stopped, if a sheet in a conveying passage has only been printed on one side, the printer coveys the sheet and prints on the other side after anomaly recovery (without allowing the user to remove the sheet from the conveying passage).

Printer which allows a user to select whether to reuse a sheet or to print on a new sheet after a jam has occurred


A packaged microchip has a stress sensitive microchip having a microchip coefficient of thermal expansion, a package having a package coefficient of thermal expansion, and an isolator having an isolator coefficient of thermal expansion. The isolator is connected between the stress sensitive microchip and the package. The microchip coefficient of thermal expansion illustratively is closer to the isolator coefficient of thermal expansion than it is to the package coefficient of thermal expansion.

The invention generally relates microchips and, more particularly, the invention relates packaging techniques for microchips
Microelectromechanical systems (xe2x80x9cMEMSxe2x80x9d) are used in a growing number of applications. For example, MEMS currently are implemented as gyroscopes to detect pitch angles of airplanes, and as accelerometers to selectively deploy air bags in automobiles. In simplified terms, such MEMS devices typically have a structure suspended above a substrate, and associated electronics that both senses movement of the suspended structure and delivers the sensed movement data to one or more external devices (e.g., an external computer). The external device processes the sensed data to calculate the property being measured (e.g., pitch angle or acceleration).
The associated electronics, substrate, and movable structure typically are formed on one or more dies (referred to herein simply as a xe2x80x9cdiexe2x80x9d) that are secured within a package. For example, the package, which typically hermetically seals the die, may be produced from ceramic or plastic. The package includes interconnects that permit the electronics to transmit the movement data to the external devices. To secure the die to the package interior, the bottom surface of the die commonly is bonded (e.g., with an adhesive or solder) to an internal surface (e.g., a die attach pad) of the package. Accordingly, substantially all of the area of the bottom die surface is bonded to the internal surface the package.
Problems can arise, however, when the temperatures of the two surfaces change. In particular, because both surfaces typically have different coefficients of thermal expansion, the package can apply a mechanical stress to the substrate of the die. This stress (referred to in the art as xe2x80x9clinear stress,xe2x80x9d which, in this case, is thermally induced) undesirably can bend or flex the substrate to an unknown curvature. Substrate bending or flexing consequently can affect movement of the die structures and the functioning of the electronics, thus causing the output data representing the property being measured (e.g., acceleration) to be erroneous. In a similar manner, mechanically induced linear or torsional stress applied to the package also can be translated to the die, thus causing the same undesirable effects.
In accordance with one aspect of the invention, a packaged microchip has a stress sensitive microchip having a microchip coefficient of thermal expansion, a package having a package coefficient of thermal expansion, and an isolator having an isolator coefficient of thermal expansion. The isolator is connected between the stress sensitive microchip and the package. In accordance with illustrative embodiments, the microchip coefficient of thermal expansion is closer to the isolator coefficient of thermal expansion than it is to the package coefficient of thermal expansion.
In some embodiments, the difference between the microchip coefficient of thermal expansion and the isolator coefficient of thermal expansion is smaller than the difference between the microchip coefficient of thermal expansion and the package coefficient of thermal expansion. Moreover, the stress sensitive microchip may be a MEMS device, where the stress sensitive microchip includes a movable structure suspended above a substrate having a substrate coefficient of thermal expansion. In such case, the microchip coefficient of thermal expansion may be a function of the substrate coefficient of thermal expansion.
The stress sensitive microchip illustratively has a microchip surface, while the isolator also has an isolator surface. The isolator surface may both face and be connected to the microchip surface. The isolator surface illustratively is connected to no more than a portion of the microchip surface. In other embodiments, the package has a package surface, and a portion of the package surface is connected the isolator. The package surface area is greater than the isolator surface area. Among other materials, the package comprises a ceramic material. The packaged microchip also may include a stress absorbing material that secures the isolator to the package.
In accordance with another aspect of the invention, a sensor has a die comprising a movable structure suspended from a substrate having a substrate coefficient of thermal expansion, an isolator having an isolator coefficient of thermal expansion, and a package forming an inner cavity that contains the die. The package also has a package coefficient of thermal expansion The isolator is connected between the substrate and the package. The substrate coefficient of thermal expansion illustratively is closer to the isolator coefficient of thermal expansion than it is to the package coefficient of thermal expansion.
In some embodiments, the sensor also has a lid that is secured to the package. The lid encloses the inner cavity. The sensor also may include a stress absorbing material that secures the isolator to the package. Moreover, the inner cavity of the package may have a cavity surface, while the substrate may have a substrate surface. The isolator thus forms a space between a portion of the substrate surface and a portion of the cavity surface. Among other things, the die may be one of a gyroscope, an accelerometer, or other type of MEMS device.


A composite waistband includes an elastic band which is stretchable in the longitudinal direction and a non-elastic draw cord secured to one surface of the elastic band. The draw cord is secured to the elastic band by forming a plurality of stitches which extend over the draw cord and are sewn into the elastic band on either side of the draw cord. The plurality of stitches collectively define a longitudinally extending channel through which the draw cord extends.

Many types of clothing, such as athletic shorts and sweat pants, use an elastic waistband in combination with a drawstring so that the garment can be worn by persons of different size. In most garments of this type, the elastic waistband and drawstring are incorporated into the garment in separate steps. First, the waistband is stretched and sewn to the garment. The second step involves forming a channel for the drawstring and then inserting the drawstring into the channel. The drawstring is inserted into the channel by inserting a flexible wire with a hook into the channel and pulling the drawstring through the channel. This technique is labor intensive and significantly increases production cost.
Recently, it has been proposed to form the drawstring as an integral part of the waistband in order to eliminate one step in the construction of garments. For example, U.S. Pat. No. 4,477,928 discloses an elastic band in which the draw cord is intermeshed with the thread of the elastic band. One disadvantage of this process is that it requires the knitting or weaving machine used to manufacture the bands to be specially set up before production of the composite waistband. Setting up the knitting and weaving machines can be a time-consuming process during which the machine is out of production. Once the knitting or weaving machine is properly set up to produce the composite waistband, the manufacturer will ordinarily produce a relatively large inventory of composite waistbands before switching production back to conventional elastic bands. Another disadvantage of this technique is that it requires the replacement of one or more elastomeric strands in the fabric and with the draw cord. This alters the elastic properties of the fabric band which may be undesirable.
U.S. Pat. No. 5,040,244, discloses a composite waistband and drawstring in which the drawstring is releasibly secured to the surface of the waistband by an adhesive. However, the manufacturer of this type of composite waistband requires the use of special manufacturing equipment to heat and cure the adhesive.


There are provided a vehicle-body frame member forming an opening portion for entrance at a vehicle side part and a front side door provided so as to open and close the opening portion. The vehicle-body frame member comprises a side sill, the front side door comprises a door panel portion provided with an inner lower portion which overlaps with the side sill in a vehicle wide view and reinforcement portions provided at two side-portions of a peripheral part of the door panel portion which are continuous and include the inner lower portion such that the reinforcement portions overlap with the vehicle-body frame member in a vehicle side view.

The present invention relates to a vehicle-body structure of a vehicle.
Conventionally, in a vehicle which comprises a frame member forming an opening portion for entrance at a vehicle side part and a side door provided so as to open and close the opening portion, a structure of the side door to cope with a vehicle side collision has been developed (see Japanese Patent Laid-Open Publication No. 2018-52138, for example).
The above-described patent document discloses a door for a vehicle which is provided with panel portions which are arranged on a cabin inward side and on a cabin outward side, a frame portion which is arranged between the panel portions, and a reinforcement portion which is arranged at the frame portion, wherein the frame portion comprises front and rear parts which respectively extend in a vertical direction at front-side and rear-side portions of the panel portions and a lower part which interconnects respective lower portions of the front and rear parts, and the reinforcement portion comprises a first reinforcement which interconnects the above-described front and rear parts and a second reinforcement which interconnects the first reinforcement and the above-described lower part.
Herein, a vehicle-body structure of the vehicle is required to suppress a center pillar from coming into a cabin as much as possible in the vehicle side collision. Recently, weight reduction of the vehicle (light-weight vehicle) is also required from viewpoints of the fuel economy and the like. Therefore, it is necessary to compatibly attain the further weight reduction of the vehicle and increasing of the amount of absorption of the collision load (the collision-load absorption performance) in the vehicle side collision. In the door disclosed in the above-described patent document, however, since it is necessary to provide both the frame portion and the reinforcement portion, the weight is so increased that it may be difficult to satisfy the above-described requirements.


A fire barrier operable to be placed within a gap formed between two surfaces. The fire barrier may generally include a first intumescent section, a first foam section coupled with the first intumescent section, and a second intumescent section coupled with the first foam section generally opposite the first intumescent section. In some embodiments, the fire barrier may include a plurality of intumescent sections and a plurality of foam sections with each foam section being positioned between at least two of the intumescent sections.

1. Field
Embodiments of the present invention relate to fire barriers. More particularly, various embodiments of the invention provide a fire barrier including a plurality of intumescent sections.
2. Description of the Related Art
It is often desirable to position fire-resistive materials such as intumescent sheets within joints formed between roof, wall, floor, and ceiling members. Unfortunately, prior art fire barriers often fail to properly orient intumescent sheets within joints and are susceptible to joint expansion and contraction.


Into an internal circuit to operate in a high-frequency band, there is incorporated a protective circuit of a multistage connection which is constructed to include a plurality of diode-connected transistors having a low parasitic capacity and free from a malfunction even when an input signal higher than the power supply voltage is applied. Into an internal circuit to operate in a low-frequency band, there is incorporated a protective circuit which is constructed to include one diode-connected transistor. The protective circuits include two lines of protective circuit, in which the directions of electric currents are so reversed as to protect the internal circuits against positive/negative static electricities.

The present invention relates to a semiconductor integrated circuit device and, more particularly, to a technique which is effective when applied, in a semiconductor integrated circuit device including circuits for processing signals from an intermediate-frequency band to a high-frequency band, to a protective technique for preventing the electrostatic breakdowns of circuit elements constructing the semiconductor integrated circuit device.
A wireless communication system (or a wireless communication mobile terminal device, as will be shortly called the "terminal device") such as a digital cellular system has its circuits of transmission line and reception line constructed to include many discrete ICs (semiconductor integrated circuit devices). A representative example of the terminal device, of which the transmission/reception line circuits are constructed of the discrete ICs, is shown in FIG. 9. The discrete ICs are serviced from semiconductor parts makers such as NEC or RF Micro Device.
On the other hand, the technique of integrating the transmission/reception units into one chip is described on pp. 17 to 20 of "Hitachi Review", Vol. 81, No. 10 (1999-10), issued by Hitachi Reviewer Co., Ltd.
On the other hand, the electrostatic breakdown protecting circuit of IC is disclosed in Japanese Patent Laid-Open No. 230266/1989, for example. In this Laid-Open, there is disclosed an electrostatic breakdown preventing circuit in which a plurality of diodes are connected in series between the terminal of an integrated circuit and a power supply line or a ground line.
In Japanese Patent Laid-Open No. 202583/1995, on the other hand, there is disclosed a CMOS protective circuit corresponding to the CMOS circuit in which a plurality of power supply voltages are mixed.
Here will be described the prior art with reference to the accompanying drawings. FIG. 9 is a schematic block diagram showing transmission/reception circuits or the like, which are packaged in the terminal device of the prior art. The ICs are individually made functionally discrete, and the portions, as individually enclosed by squares, are the discrete ICs.
In this block diagram, there are shown a transmission line and a reception line, which are connected with an antenna 1 through a duplexer 2. Both these transmission line and reception line are connected with the not-shown base band.
The reception line is constructed by connecting the antenna 1, a band-pass filter 3 packaged in the duplexer 2, a low-noise amplifier 4, a band-pass filter 5, a reception mixer 6, a band-pass filter 7, a variable-gain controlled amplifier 8 and a demodulator 9 sequentially in series. The demodulator 9 is connected with the not-shown base band.
The transmission line is constructed by connecting a modulator 11, a variable-gain controlled amplifier 12, a transmission mixer 13, a band-pass filter 14, a transmission preamplifier 15, a high-output amplifier 16, a band-pass filter 17 packaged in the duplexer 2, and the antenna 1 sequentially in series. The modulator 11 is connected with the not-shown base band. On the other hand, the demodulator 9 and the modulator 11 perform the frequency conversion in response to a station signal inputted from a VCO 18. The reception mixer 6 and the transmission mixer 13 also perform the frequency conversion in response to the station signal from a VCO 19.
The signals (in electric waves) 10, as received by the antenna 1, are sequentially processed by the individual circuits of the reception line and are sent to the base band. On the other hand, the signals, as sent from the base band, are sequentially processed by the individual circuits of the transmission line and are emitted as the electric waves 10 from the antenna 1.
The portions, as enclosed by the squares, are the discrete ICs, as has been described hereinbefore. On the other hand, the internal small squares are electrostatic breakdown protecting circuits 20 (as will be called the "protective circuits").
In the construction of the prior art thus far described, it is estimated from the handling notices described in the IC catalogue of each semiconductor parts maker that the variable-gain controlled amplifiers 8 and 12, the demodulator 9 and the modulator 11, or the intermediate-frequency band ICs of several hundreds MHz are provided with the protective circuits 20 for preventing the circuit breakdowns, as might otherwise be caused by the electrostatic charges from several tens to several hundreds V, to enhance the high breakdown voltages.
On the other hand, the high-frequency band ICs in the vicinity of 1 GHz such as the low-noise amplifier 4, the reception mixer 6, the transmission mixer 13, the transmission preamplifier 15 or the high-output amplifier 16 are described for the user to consider the static electricities, and it is also estimated that no protective circuit is included.
As one example of the protective circuit, there is known a protective circuit which is disclosed in Japanese Patent Laid-Open No. 202583/1995, as described hereinbefore. FIG. 10 is a schematic diagram in which a portion is added for easier illustration to the diagram of the protective circuit presented by the Laid-Open.
In FIG. 10, numeral 41 designates a protective circuit. Letter V designates an input or output signal to an integrated circuit, and this signal is inputted via a signal line 44 to an internal circuit 45 or outputted from the internal circuit 45. The protective circuit 41 is made of a diode-connected NMOS transistor 42 and an NMOS transistor 43. Specifically, the transistor 42 is connected at its shorted gate and drain with the signal line 44 and is connected at its source with a power supply voltage Vcc. On the other hand, the transistor 43 is connected at its drain with the signal line 44 and at its shorted gate and source with the ground.
On the other hand, one example of the protective circuit having diodes connected at multiple stages is disclosed in Japanese Patent Laid-Open No. 230266/1989, as has been described hereinbefore. FIGS. 11 and 12 are schematic diagrams in which a portion is added to the diagrams of the diodes for forming the protective circuit and the electrostatic breakdown preventing circuit of that Laid-Open, so as to facilitate the description.
As shown in FIG. 11, two diodes 51 and 52 are connected in series at two stages in the forward direction between the signal line 53 and the ground line 55 of an internal circuit 54. A signal is transmitted via the signal line 53 to the internal circuit 54. FIG. 11 omits the protective circuit on the power supply side, the action of which is identical to that shown in FIG. 10.
By the two-stage construction, a Von voltage is raised to suppress the electric current to flow through the protective circuit. FIG. 12 shows a sectional structure of the protective circuit elements constructed to have a two-stage connection. Over one face of a P-type substrate 61 forming an integrated circuit, there is formed an N-type epitaxial layer 62. On the surface side of this N-type epitaxial layer 62, there are formed a plurality of (or two, as shown) P-type diffusion layers 63 for wells. In the surface layer portion of the P-type diffusion layer 63, on the other hand, there is formed an N-type diffusion layer 64. Therefore, the P-type diffusion layer 63 and the N-type diffusion layer 64 form PN junction diodes (51 and 52).
Between the individual P-type diffusion layers 63, on the other hand, there is formed a P-type insulating diffusion layer 65 as a channel stopper. This P-type isolating diffusion layer 65 so extends all over in the thickness direction of the N-type epitaxial layer 62 as to reach the P-type substrate 61 at is lower end.
Over the surface on one side of the P-type substrate 61, on the other hand, there is formed a silicon dioxide film 66. This silicon dioxide film 66 is partially removed at its portion confronting the P-type diffusion layer 63 and the N-type diffusion layer 64, to form contact windows. Over the silicon dioxide film 66 including those contact windows, moreover, there is formed an aluminum deposited layer 67 in a predetermined pattern.
As a result, the two diodes 51 and 52 are connected in series in the forward direction by the aluminum deposited layer 67, and one diode 51 is connected at its cathode electrode 68 with the signal line 53 of the internal circuit whereas the other diode 52 is connected at its anode electrode 69 with the ground line 55.


A device for preliminary bonding superposed curved glass plates together through an interlayer between them by sandwiching and pressing the plates from both outside surfaces of the superposed plates. The device has an upper roll pressing means with plural independent upper rolls arranged in a row along a plate upper surface to press against the upper surface of the plate (G), a lower roll pressing means with plural independent lower rolls arranged in a row along a plate lower surface to press against the lower surface of the plate a curveable lower flexible roll contiguous with the top of each lower roll, and a drive (50) for rotating the lower flexible roll. The curved glass plates are press-bonded together by the upper rolls and the lower flexible roll by the lower roll pressing means pressing the lower flexible roll through the lower rolls against the lower surface of the plate.

In a related art technique, as a best-known and widely used laminated glass among laminated glasses formed by bonding a plurality of superposed glass plates, it could be a laminated glass formed by bonding the glass plates together through an interlayer, which is completed by inserting a resin sheet made of PVB (polyvinyl butyral) as the interlayer between the glass plates and arranging them in layers then heating and pressing these interlayer and glass plates.
In a process in which the glass plates are bonded, if air bubbles remain between the glass plates, even if the air bubbles are minute, not only light transmittance is deteriorated, but this brings about a decrease in adhesive strength of the bonded glass plates, then there arises a problem such as exfoliation. Therefore, it is essential that before a main bonding process in which the glass plates are bonded together by entirely melting an adhesive film by the application of heat under a constant pressurization condition in an autoclave, a preliminary bonding process that sufficiently carries out deaeration or degassing of the air bubbles between the glass plates through heating and pressurization should take place.
In particular, since the window glass of the vehicle has a three-dimensional shape that curves in two directions, in order to degas the air bubbles between the superposed two glass plates, an idea of uniformly pressing the glass plates from both surfaces is required.
For example, Japanese Patent Provisional Publication Tokkaisho No. JP61-169248 discloses a device for joining at least one sheet of glass and at least one film of plastic material by calendering. The device has a series of pressure rollers mounted side-by-side in a flexible manner and a series of counter pressure rollers mounted in a flexible manner and cooperating with the pressure rollers. The pressure rollers and the counter pressure rollers are each mounted at an extremity of a piston rod. The other extremity of the piston rod bears a pressure piston actuated by pneumatic pressure and moving in a pneumatic casing (Patent Document 1).
Further, Japanese Patent Provisional Publication Tokkaihei No. JP2-279544 discloses a preliminary bonding device that performs the preliminary bonding by passing a laminated member for a laminated glass between a plurality of pressurizing rolls which are arranged at upper and lower sides. The preliminary bonding device has a mechanism by which all of the pressurizing rolls can rotate in a surface substantially perpendicular to a passing direction of the laminated member of the laminated glass (Patent Document 2).
Furthermore, in Japanese Patent Provisional Publication Tokkosho No. JP47-2265, for the purpose of rolling out a spherically curved glass plate, which has a synthetic resin film of intermediate insertion, to a pre-complex, a rolling device has a revolution frame that is capable of turning on an axis substantially perpendicular to a rolling direction, and a number of pressure rolls that act on upper and lower glass plates by their respective springs are arranged in the revolution frame. The rolling device allows each pressure roll to be fixed to the revolution frame together with a structure part which supports the pressure roll and is secured to the revolution frame and together with the spring independently of the other pressure rolls. Also each pressure roll is combined with a pressure roll unit that can detach from the revolution frame independently. In addition, the pressure roll unit is secured to the revolution frame so as to be adjusted laterally in the rolling direction for coping with a different curvature of the pre-complex (Patent Document 3).
Moreover, Japanese Patent Provisional Publication Tokkohei No. JP3-21494 discloses a curved roll apparatus that has a pair of flexible rolls and a plurality of backup rolls that limit a relative position of each part of the flexible roll. At least a curved portion of each flexible roll is hollow inside, and the flexible roll has therein a spiral member (Patent Document 4).
In addition, Japanese Patent Provisional Publication Tokkai No. JP2002-167242 discloses a preliminary bonding device of a laminated glass which presses a carried-in/out curved laminated glass sandwiching an interlayer from both curved surfaces thereof by a plurality of roll units that are capable of adjustment of angle along a longitudinal cross section shape. The preliminary bonding device has a carrying-in carrying-out means that carries in/out the curved glass with an inclination angle changed and a pressing roll unit formed by an upper side roll unit and a lower side roll unit. The preliminary bonding device also has a roll pressing means having upper and lower pressing rolls disposed so as to pair in a normal direction of the curved glass surface, a pressing cylinder provided for each pressing roll to press the roll against the glass surface and a pressure control valve to keep a pressure in the pressing cylinder constant, an angle adjusting means which supports holding points of the upper and lower pressing cylinders so that positions of the holding points of the cylinders can shift within respective long holes provided in horizontally set upper and lower lateral frames to adjust a pressing angle against the curved glass, a rotating means which forms a rectangular main supporting frame by connecting both ends of the upper and lower lateral frames to longitudinal frames and allows a rotation of the main supporting frame on a supporting axis set at a substantially center part of each longitudinal frame, and a driving means that moves the curved glass between the upper and lower side pressing roll units with its moving speed adjusted. The upper and lower side pressing roll units are set in the normal direction of the curved glass surface in accordance with a carrying-in/out speed of the curved glass (Patent Document 5).

Device for preliminary bonding of laminated glass


A flossing device includes a housing that can be gripped as a handle. The housing has a hollow interior with first pawl teeth. A spool is placed inside the hollow interior and includes second and third pawl teeth disposed on opposite ends. The second pawl teeth, when engaged with the first pawl teeth with assistance from a spring, allow the spool to rotate in a first direction relative to the housing. The flossing device also includes a tail cap that has fourth teeth that engage the third pawl teeth to urge the spool in the first direction. The flossing device also includes a fork for suspending a length of floss received from the spool and used for flossing. The length of floss is tightened by rotation of the spool in the first direction. The length of floss can be replaced by rotation of the spool in a second direction opposite the first direction.

Flossing can help reduce both tooth cavities and gum diseases. Therefore, dentists suggest that people floss their teeth every day. To do so, some people stretch a strand of floss between two fingers and put their fingers into their mouth. Because it is hard to hold the floss in the limited space of the mouth, this method is not convenient. Alternatively, some people use disposable floss holders, e.g., a strand (or length) of floss attached between two plastic prongs that is discarded after use. These disposable floss holders can be used only once and therefore create unnecessary waste and pollution. There is a need for a versatile and easy-to-operate flossing device.


In a post-quantum asymmetric key generation method and system, a processing unit generates, based on a prime and an arithmetic function or a classical string, a prime vector which has an infinite number of components; generates a prime array based on the prime vector; generates an associated matrix based on the prime array; obtains, based on the associated matrix and a first reference prime, a first reference inverse prime array that serves as a private key; and obtains a public key that is paired with the private key based on a second reference inverse prime array. The second reference inverse prime array is obtained based on the associated matrix, the first reference prime, a second reference prime, and a randomization array.

Classical cryptosystems can be classified into two main categories: symmetric key algorithms and asymmetric key algorithms. The symmetric key algorithms, such as AES (advanced encryption standard), use shared key to perform encryption and decryption. The asymmetric key algorithms use different keys, namely, paired public key and private key, to perform encryption and decryption. For example, RSA is one of the first public-key cryptosystems and is widely used for secure data transmission; NTRU (number theory research unit) is another asymmetric key algorithm; and ECC (elliptic curve cryptography) is an approach to public key cryptography based on the algebraic structure of elliptic curves. Implementations of the symmetric key algorithms require a secure channel for key exchange between two parties. Although a secure channel is not necessary for implementations of the asymmetric key algorithms, the asymmetric key algorithms may require relatively large amount of computation for generation of the paired keys, encryption and decryption. In comparison to RSA, although ECC may provide better security, more time is required on encryption and decryption.
The classical cryptosystems may have the following drawbacks:
1. Protocols for current asymmetric key algorithms cannot send large amounts of data in a short amount of time, because encryption and decryption are done for one character at a time.
2. Current asymmetric key algorithms use a public key and a private key that have the same mathematical characteristics such as belonging to the same algebraic group, ring or vector space, and that are similar in nature, so they are prone to plaintext attack or brute force attack.
3. For current asymmetric key algorithms, if a user changes his/her public key for a new one, all the other users need to update their private keys to be paired with the new public key, otherwise any possible communication from a user who keeps on using the old private key would be invalid.
4. If a system setup requires everyone to make a key refresh, a centralized entity that indicates the key refresh time is needed.
5. The integer factorization-based algorithms (e.g., RSA, DSA) or the discrete logarithm problem based algorithms (e.g., SCC) are weak against Shor's and Grover's algorithms based post-quantum attacks.
6. Distributed key refresh does not exist in the networks using RSA, AES and NTRU because the distributed key refresh is not part of the fundamental definition of the protocols for these cryptosystems.
7. Classical public key cryptosystems have tightly coupled public-private keys (i.e., each public key is paired with only a unique private key). Attacks on one of the paired keys often reveal information of the other one.

Post-quantum asymmetric key cryptosystem with one-to-many distributed key management based on prime modulo double encapsulation


A breathable water-resistant fabric in which a surface of a fabric material is coated with a microporous layer of ETFE, and a process for making same. An ETFE dope containing a blend of ETFE and a binder polymer is cast or extruded into a film which is subsequently bonded or laminated to the fabric material. The binder is extracted to produce a microporous ETFE layer.

This invention relates to breathable water-resistant fabrics and a process for making same, especially fabrics laminated with a microporous fluoropolymer, e.g. a microporous poly[ethylene-tetrafluoroethylene] ("ETFE") layer.
ETFE is a copolymer containing approximately equal numbers of ethylenic and tetrafluoroethylenic repeating units primarily linked alternately: --C.sub.2 H.sub.4 --C.sub.2 F.sub.4 --C.sub.2 H.sub.4 --C.sub.2 F.sub.4 --. Its flow temperature is between about 200.degree. C. and about 280.degree. C., depending upon the exact proportion of ethylenic to tetrafluoroethylenic repeating units, and on the molecular weight and structure of the polymer. Commercially available ETFE resin includes HOSTAFLON.RTM. (Hoechst, A. G.).
A fabric that is both water-resistant and breathable (i.e., permits air and water vapor, but not liquid water, to pass through) has obvious advantages for use in clothes and other applications. Polytetrafluoroethylene ("PTFE") has been used to make fabrics of this type, e.g. in GORETEX.TM. products.
U.S. Pat. No. 3,962,153 issued to Gore describes porous films consisting of highly stretched PTFE; PTFE pellets are melt extruded into films and then the films are stretched. The stretching process imparts porosity to the polymer films, the resulting film structure characterized by having nodes interconnected by fibrils; these films are anisotropic.
U.S. Pat. Nos. 3,679,614 (Shah, et al.), 4,342,636 (Chang, et al.), and 3,661,645 (Strier, et al.) describe other processes for making porous PTFE films.
U.S. Pat. Nos. 4,910,106 and 4,997,603, both issued to Kafchinski, et al., describe the formation of halogenated polymeric microporous membranes having improved strength. These membranes have a very narrow pore size distribution and good temperature and chemical resistance. A polyhalogenated copolymer, such as ETFE, having a very small particle size is blended with a binder polymer using a binder solvent that is a non-solvent for the copolymer and then a film is formed from the blend; subsequent heat treatment causes the copolymer particles to form a relatively continuous matrix. When the binder is extracted, a microporous film results. The disclosures of these two patents are hereby incorporated by reference herein.
U.S. Pat. No. 3,929,950 issued to Nakamura, et al., describes a method for forming a porous synthetic resin film using a stretching technique. The resin may be, for example, ETFE, PTFE and the like.
U.S. Pat. Nos. 4,623,670 and 4,702,836 both issued to Mutoh, et al., describe a porous membrane made of a fluorinated polymeric resin such a ETFE having a uniform porous structure and good properties. A chlorotrifluoroethylene oligomer must be used with the polymeric resin to form a microporous film by the disclosed method.


A camera module for facilitating industrialized water assembly includes a lens driver, a holder, a printed circuit board, and at least two conductive adhesives. The lens driver includes at least one pin. The lens driver is mounted on the holder. The pin extends from the lens driver to the holder. The holder includes at least one conductive layer corresponding to the pin. The conductive layer includes a first end and a second end opposite to the first end. The holder is mounted on the printed circuit board. One conductive adhesive connects the pin to the first end of the conductive layer, the other one conductive adhesive connects the second end of the conductive layer to the printed circuit board, that makes the conductive layer electrically connect to the printed circuit board.

Camera modules are widely used in various types of camera devices. The camera module usually includes a printed circuit board, a holder disposed on the printed circuit board, a voice coil motor fixed to the holder, and a lens fixed to the holder. The printed circuit board is electrically connected to the voice coil motor by a soldering process. However, the soldering is performed at a relatively high temperature, such a soldering process may be difficult to incorporate in an industrialized production line.
Therefore, there is room for improvement in the art.

Camera module facilitating industrialized assembly line and electronic device with the same

TRIPLE WIN TECHNOLOGY(SHENZHEN) CO. LTD.


A mower includes a supporting structure that can be coupled to a tractor and bears a support beam to which there is articulated a cutter bar that can be brought from a work configuration into at least one transport configuration and vice versa using an unfolding and folding device. The unfolding and folding device includes a tilting element connected to the support beam and to the supporting structure, a link rod connected to the cutter bar, a double-acting jack positioned between the tilting element and the link rod.

1. Field of the Invention
The invention relates to the field of agricultural machinery, more particularly that of mowers.
2. Discussion of the Background
Mowers are known from several documents, especially patents EP 839 443, EP 809 928 or FR 2 635 433 in the name of the Applicant Company. These machines are fixed to the lift system of a tractor using a supporting structure with a three-point hitching frame for coupling.
In the transport configuration, the cutter bar is folded behind the tractor in order to occupy a minimum amount of space to allow the vehicle to move around on the road network.
In the work configuration, the cutter bar is deployed to the side of the tractor so as to mow the plants.
For reasons of maximum productivity, the use of bars supporting a great many cutting tools is desirable, that is to say a cutter bar that is as long as is technically feasible.
With long cutter bars, the problem of the size of the mower in transport configuration arises.
In an attempt to solve this problem, cutter bars that can be folded backwards have been proposed. This solution is suited to machines with cutter bars of medium size, but not for machines that have very long bars, because their center of gravity becomes so far away from the tractor.
For longer cutter bars, folding the bar upwards, vertically, has proved to be an attractive solution, although here again, the permissible size for transport has proved limiting and new solutions have been investigated.
Recently, patent DE 195 34 695 has proposed folding the cutter bar beyond the vertical, at an angle of 105° to 150°, this configuration allowing the cutting tool to be positioned diagonally with respect to the tractor and therefore allowing use of a longer cutter bar. In order to achieve this configuration, the machine described has two single-acting hydraulic jacks, one of them moving the bar into the vertical position and the other moving it beyond this position, slowing its descent.
The use of two single-acting jacks between the supporting structure and the cutter bar entails a bearing frame and a complex arrangement of jacks in order to effect the various movements of the cutter bar with the protector; this solution is expensive and not very functional.
The articulations that allow the cutter bar of mowers to be unfolded and folded additionally present safety problems in the various operating configurations. For example, it is desirable for the work configuration, that is to say when the cutting tools are activated, to be able to be moved away from the horizontal position quickly, in order to avoid an obstacle or to maneuver the tractor, for example, without the need to activate the transport configuration. In this so-called maneuvering configuration, safety measures need to be in place to prevent unwanted movements of the cutter bar.
There is therefore a problem as regards the functionality and the folding—unfolding of the cutter bar using articulations that are inexpensive but have the safety measures in place that are necessary for all the configurations: transport, work or maneuvering.

Mower with an unfolding and folding device that includes a tilting element, a link rod, and a hydraulic jack


A lightweight support for a bumper is formed by an extruded profile with a plurality of chambers. In order to provide a profile which, along with an extremely low weight, meets all the static requirements, is easy to bend and is suited to the properties of a light-metal alloy, the profile (1) comprises four walls (2, 3, 5, 6), which preferably form an isosceles trapezoid, and two webs (7, 8), which are arranged in the interior of the profile, parallel to the side walls (5, 6) and likewise symmetrically. The side walls (5, 6) of the support (1) have stiffening ribs (25) which are produced in the same operation as the support (1) is bent. A description is given of the associated process.

The invention relates to a lightweight support for bumpers of motor vehicles, formed by an extruded profile, with a plurality of chambers, made of a light metal. It is possible for the lightweight supports themselves to form bumpers or to support a bumper positioned in front of them or, more generally, the front part of a vehicle over the entire vehicle width. For this purpose, they are usually bent into the corresponding shape.
Such supports have to meet more and more stringent requirements in respect of economy, esthetics and safety. They are intended, on the one hand, to have the lowest weight possible and to be capable of being easily shaped as desired by the designers and, on the other hand, to meet the high strength-related requirements: bending strength, torsional strength as well as, in particular, energy absorption and deformation path in the event of a collision. In this case, for reasons of safety and of the repair costs for the various types of deformation, a reproducible transition at a certain collision speed and a certain time sequence for the deformation are sought. Moreover, connecting the support to the vehicle body via further deformable elements is intended to produce a favorable force flux.
U.S. Pat. No. 5,340,178 discloses such a support. The latter may consist of aluminum, magnesium or plastic material. Its profile is essentially rectangular, with two flattened edges and an S-shaped reinforcing rib. However, the profile, as a whole, is not particularly suitable for attachment to the vehicle body and for bending during production. The operation of bending the support into the desired shape has to take place under high internal pressure or with the use of a core because, otherwise, there is excessive deformation of the wall in the tension zone and of the S-shaped reinforcing rib.
In the aim of achieving a maximum level of energy absorption along with a minimum weight, magnesium or a magnesium alloy provides further advantages. The properties of the latter, however, differ vastly from those of aluminum or plastic. They have a smaller modulus of elasticity and a lower structural strength, on account of their hexagonal grid structure, and display different deformation behavior. In the case of deformation at room temperature (which is to be preferred for cost reasons alone), it is only possible for sliding to take place in three sliding directions in the base plane of the hexagonal basic grid. The profile described in U.S. Pat. No. 5,340,178 is not suited to the properties of magnesium alloys; the deformation in the non-supported tension zone would be too great in the case of said deformation behavior and would result in the support rupturing.
The object of the invention is to develop a support of the generic type which, along with an extremely low weight, meets all the static and dynamic requirements, is easy to bend during production and also allows for the particular properties of a magnesium alloy.
The object is achieved according to the invention wherein the profile comprises two transverse walls and side walls, which are essentially symmetrical in relation to an axis of symmetry, and two webs, which webs are arranged in the interior of the profile and parallel to the side walls.
The webs of the profile, which are symmetrical and parallel to the side walls, increase the energy absorption and support the transverse walls located in the tension and compression zones, without prematurely buckling or collapsing. This cannot be said of the S-shaped reinforcing rib according to the prior art. During the bending operation, it is then also the case that the support need not be protected by internal pressure against collapsing or subsequently calibrated. This reduces the production costs to a quite considerable extent. As a result, the profile according to the invention is also suitable for the use of a wrought magnesium alloy, and allows the advantages of this material to be utilized without it being necessary to accept the disadvantages thereof.
In a preferred configuration, the walls of the profile form essentially an isosceles trapezoid, and the webs are parallel to the side walls, which form the legs of the trapezoid. The trapezoidal shape aids the torsion of the support, in particular, if the longer of the parallel trapezoid sides is directly subjected to an impact. This improves the transmission of the forces to the vehicle body via the shorter of the parallel trapezoid sides. The inclination of the trapezoid legs and of the webs facilitates the buckling thereof, which starts at a certain impact energy, with maximum energy absorption. The webs, which are parallel to the legs of the trapezoid, support the longer of the parallel trapezoid sides under the action of the impact such that said longer side does not collapse either.
The angle of inclination of the webs in relation to the plane of symmetry of the isosceles trapezoid is preferably from 10 to 30, preferably 15 to 20, angular degrees, depending on the bending radius of the support in the plane of symmetry.
In a development of the idea of the invention for trapezoidal profiles, the webs form an accumulation of material at their transition to the shorter trapezoid side. This forms a junction which increases the buckling strength of the profile in the compression zone, increases the moment of inertia during bending by a force in the plane of symmetry, shifts the shear center further into the compression zone during torsional loading and, during extrusion, helps to even out the flow speeds.
In a particularly advantageous development of the invention in which the lightweight support is bent in the plane of symmetry, the side walls and the webs have stiffening ribs, which run transversely to the longitudinal extent of said lightweight support. These stiffening ribs further increase the strength and energy absorption of the support to an unexpectedly high extent, which has been established in tests. This allows a reduction in the wall thicknesses, and thus in the weight, to the limits of what is possible during extrusion. Thus, the wall thicknesses are preferably from 0.02 to 0.05 times the profile height along the axis of symmetry.
The support is preferably bent in the plane of symmetry, the shorter trapezoid side of the profile being on the concave side of the bent lightweight support. The profile according to the invention, however, also allows three-dimensional shaping, for example bending out of the plane of symmetry.
In certain applications, it is advantageous for the purpose of optimizing weight and deformation behavior if the webs have a lesser wall thickness than the walls forming the trapezoid and/or if at least one of the rounding radii in the interior of the profile is smaller than double the wall thickness of an adjacent wall. The latter, if the profile is regarded two-dimensionally, corresponds to less rigid clamping, with which the buckling load can be coordinated.
The invention, however, also relates to a process for producing the lightweight support according to the invention in the embodiment with the stiffening ribs. It has, surprisingly, been found that the latter are produced, in the case of the profile shape according to the invention, during bending, without a separate operation. In particular, the stiffening ribs, during bending in a die, become particularly effective and regular if the support has a trapezoidal profile. This may be explained by the oblique side walls being supported to an increasing extent on the die during the bending operation.

Magna Steyr Fahrzeugtechnik AG and Co. KG


A fixing member is composed of an upper washer and a lower washer; and a sensor substrate is sandwiched and held by the upper and lower washers. A strain-detecting element is disposed on the sensor substrate. A strain sensor as configured above is fixed onto a measurement target via the fixing member. Accordingly, the strain sensor does not generate an output signal when no external force is applied, demonstrating stable characteristics.

A conventional strain sensor is disclosed in Japanese Utility Model Unexamined Publication No. H5-57605, and is described below with reference to drawings.
FIG. 8 is a perspective view of the conventional strain sensor, and FIG. 9 is a side sectional view illustrating the conventional strain sensor fixed to its detection target. Metal sensor substrate 1 has fixing holes 2 and 3. Strain-detecting element 4, consisting of a strain gauge, is disposed on the top face of sensor substrate 1. Strain-detecting element 4 includes element portion 5, and lead 6 electrically coupled to element portion 5 and protruding outward.
The operation of the conventional strain sensor as configured above is described next with reference to FIG. 9. A pair of internal threads 7 is provided in advance on detection target 8. Sensor substrate 1 is fixed to detection target 8 by screwing external threads 9 into internal threads 7 with sensor substrate 1 therebetween. The inner diameter of fixing holes 2 and 3 is slightly greater than the outer diameter of internal threads 7. This is to ensure the reliable fixing of sensor substrate 1 onto detection target 8, considering variations in the pitch of internal threads 7 provided on detection target 8. In this state, when an external force is applied to detection target 8, detection target 8 distorts, and sensor substrate 1 deforms in response to this distortion. The deformation of sensor substrate 1 is output from lead 6 as a change in voltage caused by a change in resistance of strain-detecting element 4 provided on the top face of sensor substrate 1. Accordingly, the external force applied to detection target 8 is detectable.
However, in the above conventional structure, a twisting force acts on external threads 9 when sensor substrate 1 is fixed to detection target 8 by screwing external threads 9 into internal threads 7. This twisting force produces internal stress in sensor substrate 1. As a result, strain-detecting element 4 distorts, and an output signal is generated even when no external force is applied to sensor substrate 1. Consequently, output signals from the strain sensor become inaccurate.


A conveyor belt is formed by covering a belt core body with a cover rubber. The cover rubber has a fine ridged/grooved structure formed on at least a portion of a surface thereof, and has a surface roughness of 1 μm or more and 12 μm or less, a degree of sharpness of 2 or more and 9 or less, and a specular gloss at an angle of incidence of 60° of 0.1 or more and 10 or less due to the fine ridged/grooved structure. The surface roughness is preferably 2 μm or more and 5 μm or less, and the degree of sharpness is preferably 3 or more and 5 or less, and the specular gloss at an angle of incidence of 60° is preferably 0.1 or more and 3 or less. Such conveyor belt is less likely to have a poor appearance due to bloom.

In the related art, belt conveyor devices for transporting objects to be conveyed such as coal, ore, grit, and the like are widely used in mines, quarries, civil engineering construction sites, and the like.
For example, Patent Document 1 below discloses the manufacture of a conveyor belt that, while realizing an excellent appearance, has excellent running stability regardless of the usage environment and has excellent durability against bending deformation, which involves unvulcanized rubber molding bodies having a fabric layered on surfaces thereof corresponding to the conveying and non-conveying surfaces of the conveyor belt and being pressed with a pair of upper and lower hot plates in order to transfer the texture pattern of the fabric to each surface, and peeling the fabric from the conveyor belt formed after vulcanization.
In Patent Document 1 below, the surface roughness of the conveyor belt is described as being from 1 μm to 15 μm, and more preferably from 1 μm to 7 μm.


A correlation apparatus and method for frequency synchronization are provided. A frequency synchronization method of a receiver in a broadband wireless access communication system includes acquiring a highest correlation value by conducting a differential correlation of a variable interval between a received signal and a reference signal and performing a frequency synchronization according to the highest correlation value.

1. Field of the Invention
The present invention relates to a correlation apparatus and method for frequency synchronization in an Orthogonal Frequency Division Multiplexing (OFDM) system. More particularly, the present invention relates to a correlation apparatus and method for enhancing a frequency synchronization performance in a system that uses a Zadoff Chu (ZC) sequence or a Constant Amplitude Zero-AutoCorrelation (CAZAC) sequence as its reference signal.
2. Description of the Related Art
In an Orthogonal Frequency Division Multiplexing (OFDM) transmission scheme, subcarriers are transmitted having orthogonality to one another. In transmission, while the orthogonality between subcarriers should be sustained, a frequency interval between subcarriers is relatively small for the transmission band. Hence, compared to a single carrier transmission, the OFDM transmission is sensitive to the frequency offset caused by an oscillator mismatch between a transmitter and a receiver.
At an OFDM receiver, the frequency offset is estimated in two steps. First, a fine frequency offset smaller than the subcarrier interval is estimated. Secondly, the frequency offset is estimated per subcarrier interval.
In general, to accurately detect the frequency offset of the received signal in an OFDM transmission system, a reference signal such as a preamble is inserted in the head of a frame.
The reference signal is transmitted in a form that is agreed upon by the transmitter and the receiver. The receiver conducts the frequency synchronization using the received signal and the reference signal.
A Zadoff Chu (ZC) sequence, which is a conventional Constant Amplitude Zero-AutoCorrelation (CAZAC) sequence, features good Peak-to-Average Power Ratio (PAPR) and auto-correlation properties.
The ZC sequence is used as the synchronization reference signal in various systems including not only the OFDM transmission system but also Single Carrier-Frequency Domain Equalization (SC-FDE) systems and Ultra Wide Band (UWB) systems.
However, the ZC sequence disadvantageously degrades the correlation characteristic in the conventional coarse frequency offset detection.
That is, using the relative frequency offset, the detection performance of the coarse frequency offset corresponding to an integer part deteriorates.
Accordingly, there is a need for an apparatus and method for improved frequency synchronization in a broadband wireless access communication system

Correlation apparatus and method for frequency synchronization in broadband wireless access communication system

Sungkyunkwan University Foundation for Corporate Collaboration


The purpose of the invention is to properly determine the replacement time of a guard window of an arc sensor using an original function of the arc sensor.. The apparatus for monitoring a guard window of an arc sensor according to the present invention is provided with an arc sensor guard window (28) mounted on an arc sensor unit (20) and a standard reflecting plate (30) located at a position a determined distance from the front surface of the guard window (28). And the apparatus detects the reflected light (27) from the standard reflecting plate (30) when a laser beam (26) scans the standard reflecting plate (30), before the guard window (28) is used for an arc welding operation. The apparatus memorizes the quantity of detected light reception as the first quantity. The apparatus then detects the reflected light (27) from the standard reflecting plate (30) in the same way as before, after the guard window (28) is used for an arc welding operation. The apparatus memorizes the quantity of detected light reception as the second quantity of detected light reception as the second quantity. Based on the difference between the first quantity and the second quantity, the condition of the guard window (28) is checked and it is determined whether or not the guard window (28) should be replaced.

An arc sensor used for searching a welding line of an arc welding robot and otherwise, is mounted on a welding torch of the robot, and because of this, the arc sensor experiences internal structure damage or accumulates stains on the lens as a result of spatterings and lampblack generated during welding. Therefore the arc sensor is provided with a replaceable guard window to guard the internal structure from spatterings and lampblack.
However, this guard window is sometimes burned black by the spatterings and accumulates stains as a result of lampblack and etc. in proportion to the number of welding operations, so that an incident beam and a reflected beam of a laser beam cannot easily penetrate the window. When penetration of the incident beam and reflected beam through the window becomes difficult, the detecting capability of the arc sensor is reduced and the detecting accuracy of the same is also reduced. Therefore, the guard window is usually replaced at determined intervals or as required, or the stains on the window are wiped clean after discerning the accumulated stains on the window with the naked eye.
However, if the guard window is replaced at determined intervals, stains accumulate and replacement thereof is quite often too late, in the case of a large number of welding operations, and as a result, the detecting capability of the arc sensor is reduced. On the other hand, replacement thereof can be too early, and a window is unnecessarily replaced in the case of a small number of welding operations during the determined interval.
Replacement of the guard window as required is indiscriminate and unreliable depending on individual operators thereof, for instance, by discerning accumulated stains with the naked eye, thereby posing the same problem as the case when the windows are replaced at determined intervals.

Apparatus for monitoring a guard window of an arc sensor


According to one embodiment, a network system features a first virtual private cloud (VPC) network and a second VPC network. The first VPC network includes a first plurality of gateways. Each gateway of the first plurality of gateways is in communications with other gateways of the first plurality of gateways in accordance with a first tunnel protocol. Similarly, a second VPC network includes a second plurality of gateways. Each of the second plurality of gateways is communicatively coupled to the each of the first plurality of gateways in accordance with a second security protocol to provide redundant routing.

Over the past few years, cloud computing has provided an Infrastructure as a Service (IaaS), where resources are provided as part of a cloud computing platform (e.g., public cloud network) and made accessible to tenants as a service. One of these services allows tenants to run software components (e.g., virtual machines instances such as virtual servers) residing within the cloud computing platform. Hence, the migration of software functionality into cloud computing platforms has led to greater usage of virtual private cloud networks (VPCs).
A virtual private cloud network (VPC) is an on-demand, configurable pool of shared resources, which are allocated within the cloud computing platform and provide a certain level of isolation between the different organizations or other entities (hereinafter, "users") using the resources. The isolation between one VPC user from other users of the same cloud computing platform may be achieved through allocation of a private Internet Protocol (IP) subnet and a virtual communication construct (e.g., virtual local area network "VLAN" or other protected communications) per user. For example, Amazon® Web Services (AWS®) provides for the purchase of Amazon® Elastic Compute Cloud (EC2) services with dedicated data processing capabilities for a particular user.
Currently, certain cloud computing platforms provide connectivity between VPCs. This connectivity, sometimes referred to as "peering," constitutes an establishment of peer-to-peer communications between separate VPCs for the purpose of routing data traffic as requested. These peer-to-peer communications include a primary communication link and a high availability (HA) communication link. The HA communication link is operational in response to a "failover" condition. More specifically, the communications between a gateway deployed within a VPC and either (i) a gateway of another VPC or (ii) an on-premises computing device such as a router controlling communications within an on-premises network are accomplished by the primary communication link placed in an "active" state. The HA communication link is initially set to a "standby" (inactive) state, but is switched to an "active" state when the primary communication link fails. However, this VPC "failover" communication scheme suffers from a number of disadvantages.
One disadvantage associated with the conventional VPC failover communication scheme is that it requires deployment of complex failover logic within the controller to manage operability of the public cloud network. For example, the failover logic would need to continuously track the current state of the primary communication link and would need to conduct an update of a gateway routing table for the cloud computing network in response to failure of the primary communication link. Additionally, in response to failure of both the primary and HA communication links, the failover logic would need to reprogram the VPC routing table. The VPC routing table is relied upon for determining which gateway is targeted to receive downloaded data while the gateway routing table is relied upon for determining which communication link is used for transmission of the downloaded data. Another disadvantage with the active-standby failover scheme is the inefficient use of resources allocated for the standby communication link. These resources are never used until a failover event happens.
The updating of both of these routing tables is time consuming and disruptive to ongoing communications, especially the reprogramming of the VPC routing table. The convergence (stabilization) of the network and avoidance of disruption of data communications within or to the public cloud is necessary as more companies migrate their networking operations to the cloud.


A shoulder prosthesis kit includes a first metaglene component including (i) a first body defining an outer diameter, (ii) a first augment extending medially from the first body, and (iii) a first void defined by a portion of the first body and a portion of the first augment, and a plurality of bearing components, each of the plurality of bearing components defining a cavity configured to couple with the first body, and having a bearing surface that is sized differently from the size of another of the plurality of bearing components.

The present disclosure relates generally to shoulder prostheses, and more particularly to shoulder prostheses configured for use in rotator cuff deficient shoulders.
The rotator cuff is made up of a group of tendons and muscles which includes the deltoid, the supraspinatus, the infraspinatus, the infrascapular, and the smaller round. When massive rupture occurs of the rotator cuff, only the deltoid muscle remains functional which is insufficient to enable proper operation of the shoulder joint. Moreover, improper operation of the shoulder joint due to massive rotator cuff rupture when left untreated will cause erosion or other defects in the subchondral surface of the glenoid. Thus, it is common that a patient who is being treated for a rotator cuff deficiency will also have erosion or other defects of the subchondral surface of the glenoid.
Certain procedures have been used to treat rotator cuff deficient shoulders which have the above described glenoid erosion or defects. For example, the bone of the glenoid may be asymmetrically prepared to create an appropriately configured support to receive a typical metaglene component of a shoulder prosthesis. Asymmetric preparation of bone involves removing more bone from one side of the glenoid in comparison to another in order to create an even support surface for receipt of the metaglene component. In another example, a bone graft is utilized in conjunction with implantation of a standard metaglene component, the bone graft being configured to fill the eroded or defected area of the glenoid so that the implanted metaglene component is appropriately supported. Yet another example involves interposition shoulder arthroplasty in which new tissue is placed between the damaged surfaces of the joint. In interposition shoulder arthroplasty, a tissue-type graft is sutured over the eroded or defected area of the glenoid so as to ease the pain of the damaged joint while allowing the shoulder joint to retain some function. Interposition shoulder arthroplasty is typically a temporary solution to shoulder joint deficiency, and standard shoulder reconstruction will typically follow after several months.
Each of these treatments has significant drawbacks. For example, implanting a metaglene component in bone that has been asymmetrically prepared results in healthy bone stock being sacrificed. Use of a bone graft in conjunction with a metaglene component may have complications due to graft non-union and not all patients have adequate bone stock available for such a procedure. Interposition shoulder arthroplasty tends to be a short term solution that masks the shoulder joint deficiency, only to be followed some time later by more invasive conventional shoulder reconstruction in which humeral and glenoid components are implanted. This two step process results in more risk and inconvenience to the patient since two surgical procedures are involved.
What is needed therefore is an improved shoulder prosthesis for use in a rotator cuff deficient shoulder that involves glenoid erosion or defects. What is also needed is a shoulder prosthesis for use in a rotator cuff deficient shoulder that involves glenoid erosion or defects that conserves healthy bone stock. What is further needed is a shoulder prosthesis for use in a rotator cuff deficient shoulder that involves glenoid erosion or defects that does not necessitate a bone graft to be implanted in conjunction with the shoulder prosthesis. What is additionally needed is a shoulder prosthesis for use in a rotator cuff deficient shoulder that involves glenoid erosion or defects which does not promote a two stage surgical approach to restoring proper function of the shoulder joint.


This invention relates to a method and apparatus for recording of a panorama or large portion thereof in a manner for display or selective display of a portion thereof on a video display device. The method initially records the panorama in a manner not suitable for video display and thereafter projects the recorded image and records the projection of the panorama in a manner suitable for selective reproduction on a video display device. The method and apparatus are particularly suitable for recording of real time panoramas where the initial recording is time dependent and occurs quickly with sufficient accuracy for effective recording of the panorama, allowing the projecting step and second recording step to be independent of the initial demanding time restraint. Staging the recording of the panorama simplifies the recording and allow specialization of the steps to improve the quality of the final reproduction. The apparatus includes a panoramic lens in combination with a camera arrangement for producing an initial record of the panorama. A projecting arrangement produces an image of the panorama recorded on record, which image is recorded by a recording device in a manner suitable for video display.

Panoramic recording systems are known and have used moving imagers, fish-eye lenses, multiple cameras or panoramic lenses for recording of a panorama or a large portion thereof. Many of the known techniques are suitable for a still panorama, however, even in this case, changing light conditions or changes within the panorama can cause distortion and loss of accuracy.
The use of panoramic lenses or fish-eye lenses in recording of an image produce a distorted form of the image on a film record. The film record is basically a circular mapping of the panorama and are difficult to use in that format. It is known to take these film records and project them on a cylindrical screen for viewing. In the case of real time panoramic imaging, recording of the image in this particular form does provide good detail, but viewing in the circular form is not particularly satisfactory.
One example of a different method for recording a generally static panoramic image is disclosed in U.S. Pat. No. 4,125,862 which issued Nov. 14, 1978. This patent discloses a system where the panorama is scanned in a series of discreet segments and the information is recorded in a format suitable for use in displaying of portions of that panorama on a video display unit. The time interval to effectively scan the entire panorama renders this type of direct recording of the panorama only useful for generally static panoramas or ones in which real time imaging is not critical. With such a system, changing light conditions may also cause portions of the panorama to be less visible.
U.S. Pat. No. 3,240,113, which issued to Stechemesser et al Mar. 15, 1966, discloses a particular image gathering arrangement which utilizes panoramic lenses and results in recording of the panorama on a film record in a ring type shape. This patent also illustrates how the recorded images can be reprojected and shown on a cylindrical screen.
There remains a need to provide a simple method and apparatus for recording of a panorama in a record suitable for selective display on a video display device.


A method for analyzing gas concentration using doubly resonant photoacoustic spectroscopy, and a doubly resonant photaoacoustic gas detector comprising:                i) a continuous wave light beam whose wavelength coincides with an absorption wavelength of a gaseous analyte;        ii) a closed path optical cavity having at least two reflective surfaces;        iii) an acoustic resonator chamber contained within said optical cavity, and comprising an acoustic sensor for detecting sound waves generated by a gaseous analyte present within said chamber, the light beam passing sequentially into, through and out of said chamber, and being repeatedly reflected back and forth through said chamber, and being modulated at a frequency which is equal to or equal to one-half of an acoustic resonance frequency of said acoustic resonator chamber.

As semiconductor technology advances and device sizes shrink, the impact of contaminants in the gases used to fabricate these devices becomes increasingly important. Many specialty gases are used in the production of semiconductor devices. For example, a major source of contamination in the chip fabrication process is the presence in process gases of trace amounts e.g., on the order of tens of parts per billion by volume (ppbv) of water. While ultra pure (water and other contaminant free) gases are sometimes available, chemical reactions, phase changes, and other effects often result in the presence of moisture in the gas supply line in a semiconductor fabrication system. These facts make it very attractive to have moisture sensors that are small, efficient, have rapid response times, and are inexpensive enough to be placed in multiple locations in the system. These locations include each line of the gas box and also immediately before the reactor in a semiconductor fabrication system. Currently available sensors do not meet all the aforementioned requirements.
Semiconductor fabs require as many as fifty gases to process a wafer. Table 1 lists some of the gases associated with several different process steps. Contaminants in these gases can diminish yields and degrade chip reliability. One common contaminant is water vapor which may distort manufacturing processes and thereby compromise device performance. Process steps which are vulnerable to moisture contamination include epitaxial growth, sputtering, metal-organic vapor phase epitaxy, thermal etching, gas phase etching of tungsten films, plasma etching of silicon and polysilicon, and chemical vapor deposition of polysilicon, silicon dioxide, silicon nitride, and tungsten. The presence of water can accelerate or retard the chemical reactions which occur during deposition or etching, thereby altering the thickness and/or composition of critical layers. Moisture can create pitting, hazing, and stacking faults; cause resist patterns to fail; induce diodes and junctions to leak; and otherwise degrade the service lifetime of products which pass inspection and reach the marketplace. Purity requirements for process gases will likely become more strict as line widths continue to shrink.
The ambient atmosphere typically contains water vapor concentrations of up to, or even exceeding, approximately 1%. This is at least six orders of magnitude greater than the acceptable limits for process gases. As such, even very small leaks of ambient air into the gas distribution system may introduce significant moisture. Furthermore, even well-dried gas lines may contribute moisture to otherwise high-purity gas. After a gas distribution system is purged with an inert gas, some water molecules can remain in the lines due to strong binding to adsorption sites on metal and oxide surfaces. When polar gases, such as HBr and HCl, enter the lines, they tend to displace water molecules, which enter the gas stream. Additionally, surface oxides within the gas distribution system can interact with corrosive gases to create water molecules by chemical reactions such as the following:Fe2O3+6HCl  2FeCl3+3H2O   (1)Since even dry components within the distribution system can spontaneously create water, it seems clear that the semiconductor industry needs real time, in-line moisture monitors to protect wafer fabrication systems from moisture contamination.
TABLE 1Process Steps and Associated GasesProcess StepsGases (Inert Gases, Hydrides, and Corrosives)OxidationCarriersAr, N2ReactantsCl2, H2, HCl, O2PhotolithographyCarriersAr, N2,EtchingPlasma or ReactiveAr, BCl3, Cl2, CF2, CF4, C2F6,Ion EtchingHe, H2, N2, O2, C2F8, SiF4, SF6CarriersAr, H2, Ne, XeDiffusionCarriersAr, H2, N2, O2Dopant SourcesAsH3, BCl3, B2H6, PH3Chemical VaporOxidationCO2, N2, O2, H2SiCl2, SiH4DepositionDopingAsH3, B2H6, , PH3, SiH4NitrideN2O, SiCl4, NH3III-V LayersAsH3, H2, HCl, H2S, PH3Ion ImplantationAr, AsH3, BCl3, BF3, B11F3, Cl2, He, H2, H2S, N2,PH3, SiH4, P2F6, SiF4AnnealingAr, H2, N2MetallizationArBondingAr, H2, N2Crystal GrowthAr, He, H2EpitaxyCarriersAr, H2, N2Silicon SourcesSiH4, H2SiCl2, HSiCl3, SiCl4DopantsAsH3, B2H6, PH3EtchantHCl
Additionally, moisture will react with certain gases, yielding acids which corrode gas handling equipment. For example, aqueous hydrochloric acid attacks iron and other constituents of stainless steel. As corrosion advances, pipes, valves, mass flow meters, mass flow controllers, and other components can fail, causing equipment downtime. Furthermore, corroded pipes release particles which enter the gas stream. Gas-phase nucleation by particles and flaking of particles from gas lines onto wafers can reduce yield. According to one report, the gas distribution system accounts for 68% of all contamination in CMOS processes. Moisture in arsine and phosphine lines may also contaminate the ultra-high-vacuum chambers used for doping wafers. Water molecules in the chamber can make it impossible to draw a sufficiently high vacuum, forcing engineers to shut down the chamber and subject it to an extended bake.
Manufacturers of LED's and VCSELs generally deposit three to five epitaxial layers by organometallic vapor phase epitaxy, using ultra-high-purity anhydrous ammonia as a process gas. Trace oxygen in the epitaxial layers can limit device performance. The photoluminescence of LED's and VCSELs depend strongly on the moisture content of the ammonia used during production. In order to increase the efficiency, the amount of moisture needs to be accurately monitored during production.
Kermarrec and co-workers at ST Microelectronics and Air Liquide have studied the effect of moisture on SiGe devices. In their words, "A direct correlation between moisture impurity in process gases and atomic oxygen present in epitaxial SiGe layers was demonstrated, both qualitatively and quantitatively. The resulting incorporation of oxygen atoms can induce dislocations into the strained layers, which may degrade device performance and, subsequently, reliability." O.Kermarrec et.al., Solid Slate Techology, 45(3). Pp.55-60, 2002.
Moisture sensors (monitors) are often referred to as in-line or at-line. Generally, in-line refers to a monitor that is sits in the gas line such that the gas under test passes through the monitor without a need for tapping off the line. The term at-line is generally used for monitors that tap some flow off of the gas line. The flow that is tapped off is generally discarded. Both in-line and at-line monitors for semiconductor industry process gases should advantageously have several characteristics, which are not available with current technologies. The monitor should be sensitive enough to detect moisture in concentrations on the order of 10 ppbv (parts per billion volume) or even lower, be fast enough to react to transient changes in gas flows, compact, and inexpensive enough to be placed at multiple locations in the process train. Since none of the technologies available today can satisfy all of these criteria, it is not surprising that wafer fabs rarely deploy in-line moisture monitors. The present invention satisfies an unmet industry need by providing a system which meets all four requirements (sensitivity, speed, size, and price) and is suitable for both in-line and at-line sensors.
Photoacoustic Spectroscopy (PAS) transforms an optical event into an acoustic event. Gas molecules absorb light at specific, characteristic wavelengths and undergo quantized vibrational or rotational transitions. They gain kinetic energy in the form of heat, and collide with other molecules, creating a pressure wave. Since a pressure wave in a gaseous medium is sound, it can be detected by a microphone. The sensitivity of PAS is determined by the efficiency with which the molecular excitation energy produces a pressure wave and the efficiency with which the pressure wave is converted into an electrical signal.
Alexander Graham Bell discovered the photoacoustic effect in 1881. However, scientific and technological interest in the effect lay dormant for eighty years in the absence of suitable light sources and microphones. In the 1960's, lasers stimulated researchers to explore the photoacoustic effect for spectroscopy. In 1968, Kerr and Atwood detected low concentrations of pollutants in air by using lasers and phase-sensitive, lock-in acoustic detection techniques. (E. L. Kerr, and J. G. Atwood, "The laser illuminated absorptivity spectrophone: a method for measurement of weak absorptivity in gases at laser wavelengths," Applied Optics, No 7, p. 915-921, 1968. Kreuzer detected methane in nitrogen in 1971, using an intensity-modulated He-Ne laser (L.B. Kreuzer, "Ultralow gas concentration infrared absorption spectroscopy," J. Applied Physics, Vol. 42, p. 2934-2943, 1971.
In order to further elucidate the photoacoustic effects it is useful to consider the physical steps that result in a photoacoustic signal. The photoacoustic effect in a photoacoustic cell can be divided into four sequential events: 1) absorption of incident optical radiation by a target analyte gas; 2) localized heat release in the sample gas due to transformation of the absorbed light energy into molecular motion; 3) pressure wave generation due to heat induced expansion of the gas; and 4) detection of the pressure wave generated acoustic signal. spectroscopy, and also on optimization of the physical system used to carry out photoacoustic
There is a large body of work on both the theoretical fundamentals of photoacoustic spectroscopy, and also on optimization of the physical system used to carry out photoacoustic spectroscopy. Specifically, it is known that the configuration of the cell in which the gas is contained can influence the detection process. The first cells were simple cylinders with windows at each end which were substantially transparent to the optical excitation beam. An advance in sensitivity was made when it was realized that the optical signal entering the cell could be modulated to induce a pressure wave at an acoustic resonance frequency of the cell, thereby providing a forcing function. This pressure wave can be detected using a microphone attached to the wall of the cell. If the cell dimensions are picked randomly and/or the optical excitation beam has a high overlap with more than one acoustic mode, the result is typically the excitation of higher order modes and/or weak signal strength at the detector.
Today several companies sell PAS systems, which typically consist of a laser light source, an acoustic cell, a sonic transducer to convert a pressure pulse to a voltage pulse, and electronics for digitizing and storing the output signal from the transducer. The more sensitive systems employ large, high-power lasers. Prior art photoacoustic systems for detecting water generally use CO or CO2 lasers. These lasers are expensive, bulky, and require external cooling. Therefore, although existing systems generally meet the requirements of scientific users, they are clearly not suited for use in an industrial in-line or at-line gas sensor configuration.
In 1996, a group at the Hungarian Academy of Sciences reported using a photoacoustic cell placed inside the optical cavity of a diode laser to achieve an order of magnitude gain in detection efficiency compared to extracavity operation. (Z. Bozoki, et.al., Appl Phys., B 63, 399 (1966). The same group later described a PAS system which supplied optical power with a DFB laser (M. Szakáll, Z. Bozôki, A. Mohâcsi, A. Varga, and G. Szabô, "Diode Laser Based Photoacoustic Water Vapor Detection System for Atmospheric Research," Applied Spectroscopy, Volume 58, Number 7, 792-798, 2004). This system reportedly was able to detect moisture at levels of about 250 ppbv. The system would appear to have come within a factor of about twenty-five of the minimum required sensitivity for semiconductor gases, but did not meet the criteria for industrial use in terms of size or cost. Italian workers (A. Boschetti, et.al., Appl. Phys., B 74, 273-278 (2002), reported use of a pulsed laser for methane and ethylene detection. Additionally, they referred to the earlier Hungarian work and stated "Placing the resonant PA cell inside an external build-up cavity will provide a higher gain while maintaining the possibility of pressure control in the sampling cell." No further details were given so it is unclear what type of laser or detector configuration they were contemplating.
Clearly, methods and systems for increasing the sensitivity of photoacoustic spectroscopy units, while simultaneously reducing their size and the cost are essential if widespread industrial use is to be realized. Widely deployable systems for industrial use will require small and inexpensive light sources, such as the CW diode lasers heretofore developed for telecommunications use. These lasers are small, relatively inexpensive, and convert electrical energy into optical energy with high efficiency.

System and method for gas analysis using doubly resonant photoacoustic spectroscopy