Each light detecting unit includes a semiconductor region that outputs a carrier, and a surface electrode. In a photodiode array, a read wire is positioned between neighboring avalanche photodiodes. When a plane including a surface of the semiconductor region is set as a reference plane, a distance tb from the reference plane to the read wire is larger than a distance to from the reference plane to the surface electrode.

Conventional photodiode arrays are disclosed in Patent Literatures 1 and 2, for example. A photodiode array, such as SiPM (Silicon Photo Multiplier) or PPD (Pixelated Photon Detector), has a structure in which APDs (avalanche photodiodes) are arranged in a matrix shape, a plurality of APDs are connected in parallel, and a sum of outputs of the APD is read. When an APD is operated in the Geiger mode, a feeble light (photon) can be detected. That is, when a photon enters the APD, a carrier generated in the APD is output to the outside through a quenching resistor and a wiring pattern for reading a signal. Although electric current flows through a pixel in which an electron avalanche in an APD has occurred, a voltage drop occurs through a quenching resistor of about hundreds kΩ sequentially connected to the pixel. This voltage drop lowers the voltage applied to an amplification region of the APD, which terminates a multiplication effect by the electron avalanche. In this manner, one pulse signal is output from an APD in response to an incidence of one photon.    Patent Literature 1: European Patent Application Publication No. 1755171    Patent Literature 2: U.S. Patent Application Publication No. 2006/175529


An organic semiconductor device includes a substrate, a gate electrode formed directly on the substrate , gate insulating film formed directly on the gate electrode, a source electrode and a drain electrode formed directly on the gate insulating film, an organic semiconductor layer formed directly on the source electrode and the drain electrode, and a voltage control layer disposed directly between the gate insulating film and the organic semiconductor layer and directly contacting the source electrode and the drain electrode, wherein the voltage control layer gives an ambipolar characteristic to the organic semiconductor layer.

1. Technical Field
The present invention relates to an organic semiconductor film and an organic semiconductor device having the organic semiconductor film.
2. Related Art
Examples of semiconductor devices include thin film transistors (TFT) that have been put to practical use as switching elements in an active matrix liquid crystal display, for instance, and designed to use an amorphous or polycrystalline silicon semiconductor film.
As TFT semiconductor materials, organic semiconductor materials have drawn attention in recent years. Organic semiconductors can be easily processed into a thin film by a simple deposition method such as spin coating and vacuum deposition, and processed at lower temperatures than conventional TFT using amorphous or polycrystalline silicon. Lower processing temperatures permit the forming on a plastic substrate with low thermal resistance, and thereby having various expected effects including reduction in display weight and manufacturing cost and versatile applications utilizing the flexibility of a plastic substrate.
In developing TFT using conventional organic semiconductor materials, however, it is difficult to control the threshold voltage and channel conductivity by impurity doping, which is performed for TFT using amorphous or polycrystalline silicon. This has been one of the factors preventing its practical use. A technology reported by Jiyoul Lee et al (e.g. Applied Physics Letters, Vol. 80: 2925-27, 2002) relates to threshold voltage, but it is not intended to arbitrarily control threshold voltage.
As for the control of channel conductivity, it is necessary to select appropriate organic semiconductor materials to manufacture n-channel or p-channel thin film transistors.
A complementary metal-oxide semiconductor (CMOS) transistor which consists of an n-channel MOS (nMOS) transistor and a p-channel MOS (pMOS) transistor that are combined in an IC chip is widely known as a semiconductor device. The CMOS transistor has a basic structure in which enhancement-mode nMOS and PMOS transistors are coupled in series and has n-channel and p-channel regions.
However, impurity cannot be doped into an organic semiconductor material for producing the CMOS transistor. Therefore, it is necessary to produce semiconductor films for the n-channel and p-channel regions separately, which complicates the manufacturing process and reduce productivity.
In consideration of the above-described problem, the present invention aims to provide an organic semiconductor film and organic semiconductor device that are capable of producing n-channel and/or p-channel regions without changing materials for forming organic semiconductor thin films in particular, and also capable of controlling threshold voltage.

Organic semiconductor film and organic semiconductor device


A nonvolatile semiconductor memory comprises a pair of diffused layers formed in the surface area of a p-type silicon substrate, and a gate electrode (polysilicon film and tungsten silicide film formed on a gate oxide between the diffused layers over the p-type silicon substrate. Silicon nitride film is formed at both ends of the gate oxide so that the carrier trap characteristic may become high locally in areas near the pair of diffused layer. This configuration prevents carrier injection to other than the ends of the gate oxide, ensures reliable recording and storage, and increases reliability by preventing write and erase error.

The present invention relates to a semiconductor memory and a method of manufacture thereof and, more particularly, to a nonvolatile semiconductor memory capable of recording 2-bit information in one memory cell.
Recently, nonvolatile semiconductor memories capable of recording 2-bit information in one memory cell by changing a carrier injection position have been studied and developed. This nonvolatile semiconductor memory traps carriers in a charge trap film formed below the gate. The direction of a voltage applied between the source and the drain is reversed between write and read of information. Electrons are independently trapped in the charge trap film at positions corresponding to the two ends of the channel region. Two-bit information can be recorded depending on whether electrons are trapped at the two ends.
For example, WO 99/07000 discloses a nonvolatile semiconductor memory having the above structure. The structure and data write/read of the nonvolatile semiconductor memory disclosed in this reference will be briefly described with reference to FIG. 8.
As shown in FIG. 8, a nonvolatile semiconductor memory 100 is constituted by a pair of diffused layers 102 and 103 functioning as a source/drain formed in a surface area of a p-type silicon semiconductor substrate 101, a three-layered insulating film formed on the p-type silicon semiconductor substrate 101 between the diffused layers 102 and 103, and a gate electrode 107 formed on the three-layered insulating film. The three-layered insulating film is made up from a gate insulating film (silicon oxide film) 104, charge trap film (silicon nitride film) 105, and silicon oxide film 106.
The nonvolatile semiconductor memory 100 independently traps electrons at positions of the charge trap film that correspond to the two ends of the channel region. The nonvolatile semiconductor memory 100 can record a total of 2-bit information, one bit in RIGHT BIT and another bit LEFT BIT. Information is recorded by injecting electrons into the interface between the gate insulating film 104 and the charge trap film 105. To record information in RIGHT BIT, electrons are injected into an area 109 shown in FIG. 8. To record information in LEFT BIT, electrons are injected into an area 108.
To write information in RIGHT BIT, e.g., the source and drain are respectively set at 0 V and about 5 V, generating a potential difference between the source and the drain. A high voltage (about 10 V) is applied to the gate 107 to form a channel 110 between the source and the drain. In a range l2 where no channel 110 is formed, an electric field is generated by the potential difference between the source and the drain. In this range l2, channel hot electrons are generated, and electrons are trapped in the area 109.
To read out information from RIGHT BIT, a voltage opposite in direction to the write voltage is applied between the source and the drain. Since electrons are trapped in the area 109, no channel is formed from the diffused layer 103 to the diffused layer 102 below the area 109, and the threshold increases. Thus, no current flows between the source and the drain. When no electron is trapped in the area 109, a channel is formed between the source and the drain to flow a current. In this way, 1-bit information can be recorded in correspondence with whether electrons are trapped or not.
If a voltage in the same direction as that of the write voltage is applied in read while electrons are trapped in the area 109, a channel is formed between the source and the drain, flowing a current. To prevent this, a voltage opposite in direction to the write voltage must be applied between the source and the drain in reading information.
Information can also be written in or read out from LEFT BIT similarly to RIGHT BIT by applying voltages opposite in direction to application voltages for write and read of information in RIGHT BIT.
For example, in writing information in RIGHT BIT, the injection position of channel hot electrons generated to increase the threshold of a memory cell in write varies depending on a voltage applied between the drain 103 and the gate electrode 107. In the above-described conventional structure, electrons must be localized in the area 109, but they are undesirably trapped in the gate insulating film 104 at the cannel center where they should not be injected.
Hot holes injected to decrease the threshold of a memory cell (erase operation) in a high-threshold state (e.g., write state) exhibit a generation mechanism different from that of hot electrons mentioned above. Their injection positions do not always coincide with each other. By repetitive write/erase, either type of charges may remain in the silicon nitride film 105, resulting in a write/erase error.
This problem can be reduced by excessively injecting electrons to increase the threshold and excessively injecting holes to decrease the threshold. Excessive injection of carriers, however, decreases the write/erase speed and degrades the element performance. Excessive injection of carriers applies electrical stress more than necessary to an insulating film. This causes dielectric breakdown over time, which is undesirable in terms of element reliability.
Selecting a method of adjusting voltage application conditions in hole injection in relation to the distribution of the electron injection position does not optimize the hole generation efficiency. This also degrades element characteristics.
The present invention has been made to overcome these drawbacks, and has as its object to provide a semiconductor memory and a method of manufacture thereof that can reliably record and store 2-bit information, suppress generation of a write/erase error, and improve reliability in a semiconductor memory for recording 2-bit information by changing a carrier injection position.
According to the present invention, there is provided a semiconductor memory comprising a pair of diffused layers formed in a surface area of a semiconductor substrate, and a gate electrode formed on a gate insulating film on the semiconductor substrate between the pair of diffused layers, wherein carriers are trapped in the gate insulating film by applying a predetermined voltage to the gate electrode, and the gate insulating film is formed higher in carrier trap characteristic at positions near the pair of diffused layers than in a remaining area.
According to the present invention, a method of manufacture of a semiconductor memory comprises the first step of sequentially forming first and second insulating films on a semiconductor substrate, the second step of selectively removing and patterning the first and second insulating films, the third step of forming a third insulating film on the semiconductor substrate in a predetermined range from the naked semiconductor substrate to a layer below the second insulating film, the fourth step of introducing impurities into the semiconductor substrate by using the second insulating film as a mask, thereby forming a pair of independent diffused layers in a surface area of the semiconductor substrate at two sides of the second insulating film, the fifth step of leaving the third insulating film formed in the predetermined range below the second insulating layer, and removing the third insulating film in a remaining area to expose the semiconductor substrate, the sixth step of thermally oxidizing the naked semiconductor substrate to form an element isolation film, the seventh step of removing the first and second insulating films to expose the underlying semiconductor substrate and third insulating film, and causing the third insulating film to function as a charge trap film, the eighth step of thermally oxidizing the naked surface of the semiconductor substrate to form a fourth insulating film, and covering upper and lower surfaces of the charge trap film with the fourth insulating film, the ninth step of forming a conductive film on the fourth insulating film, and the 10th step of patterning the conductive film into a gate electrode shape.
According to the present invention, a method of manufacture of a semiconductor memory comprises the steps of forming a first insulating film on a semiconductor substrate, selectively removing the first insulating film to expose the underlying semiconductor substrate, introducing impurities into the naked semiconductor substrate by using the first insulating film as a mask, forming a pair of independent diffused layers in a surface area of the semiconductor substrate at two sides of the first insulating film, forming a second insulating film so as to cover the diffused layers and the first insulating film, removing the second insulating film on the first insulating film to expose the first insulating film, removing the first insulating film to expose the underlying semiconductor substrate, thereby causing an area to function as an active element area, forming a third insulating film on the semiconductor substrate in the active element area, forming a fourth insulating film on the third insulating film, forming a fifth insulating film so as to cover the fourth and second insulating films, removing the fifth insulating film so as to leave it only on two sides of the active element area, thereby forming a side wall of the fifth insulating film on a side wall of the second insulating film and exposing the semiconductor substrate in the active element area, forming a sixth insulating film on the naked semiconductor substrate, removing the side wall to expose the underlying fourth insulating film of the side wall, thereby causing the fourth insulating film to function as a charge trap film, forming a seventh insulating film on the charge trap film, and forming a conductive film so as to cover the sixth and seventh insulating films.
The present invention is realized by the above-described technique means. When hot electrons are generated in data write by applying a high voltage to the gate electrode, electrons are injected to an end having a high carrier trap characteristic more than the center of the channel width. Electrons can therefore be concentratedly trapped at the end of the gate insulating film below the gate electrode. Also in data erase, as hot holes can be concentratedly injected to the end of the gate insulating film, data can be stably erased.
According to the present invention, 2-bit information can be stably, reliably recorded and stored in a semiconductor memory for recording 2-bit information by changing the carrier injection position. Hence, the present invention can provide a semiconductor memory and a method of manufacture thereof that can suppress generation of a write/erase error and improve the reliability.

Two-bit semiconductor memory with enhanced carrier trapping


An arrangement for cooling an electric motor's stator winding coil is described. One area of a conductor insulation is removed to expose the copper conductor. The conductor is wound into a coil with bared, exposed conductor areas facing inward. The vertical edges of a slot or recess in an iron stator are lined with electrically insulating paper. A thermally conductive electrically insulating, ceramic substrate is bonded to the floor or base of the slot. The coil is inserted within the slot over the ceramic substrate with the exposed conductor facing and contacting the ceramic substrate. The coil is bonded to the ceramic substrate by thermally conductive and electrically insulative epoxy that fills the voids between the two. Heat flows from the conductor, through the bared copper surface, into the ceramic and the iron core stator with little resistance. A ceramic strip can be used alone or with copper traces bonded to the ceramic or conductor bared surface. Using a thermally conductive epoxy bond reduces resistance due to epoxy smear and reduces thermal resistance of the heat transfer path.

1. Field of the Invention
The invention is to cooling a coil by shaving off the insulation from an area on the conductor and contacting the bared conductor area with a thermally conductive electrically insulative ceramic to transfer heat away from the conductor and coil.
2. Description of Related Art
Large power motors generate proportionally large amounts of heat. Their conductors, usually copper, are insulated by thin electrically insulating coatings or tape. These coatings, while effective as electrical insulators, unfortunately are also thermally insulative, and obstruct free flow of heat out of the conductors. As a result, the conductors used in the prior art motors see a large rise in temperature. The situation is worsened further when the coil is made by packing a large number of conductors inside a coil window or iron slot. The conductors remote from the cooler window boundaries (those near the center of the coil window) are hotter than those close to the wall of the window. Such hotter conductors are referred to as hot spots.
Hot spot conductors are the first to fail because of thermal degradation of insulation. If the hot spot temperature exceeds the temperature rating of the insulation, it will start failing. The power rating of the motor is limited to ensure that the hot spot temperature never exceeds the thermal rating of the insulation coating. Methods that can reduce hot spots are needed in order to achieve higher power density and longer coil life. These methods are broadly grouped into those that reduce dissipated power and those that reduce thermal resistance.
In the prior art, several methods are used to reduce thermal resistance. These methods include the use of thinner material to reduce thermal gap, more thermally conductive materials that reduce thermal resistence, extended surfaces to increase heat transfer area, using thermally conductive potting compound, eliminating air voids by vacuum pressure impregnation, etc.
E. Sines (U.S. Pat. No. 6,777,835, issued Aug. 17, 2004) proposed inserting an electrically and thermally conductive strip between conductors such as a pitch-graphite composite strip. Its thermal conductivity is so high that it can redirect the heat along its narrow section. Its thermal conductivity is ˜600 w/mK which allows heat to flow in a thinner section without increasing resistance. However, this material is electrically conductive, and had to be covered by two electrically insulating layers. The heat has to overcome the resistance of the insulation layers. Thus, even though pitch composite has high thermal conductivity, its insulation layer will obstruct heat flow, increasing thermal resistance.
E. Jarczynski (U.S. Pat. No. 5,091,666, issued Feb. 25, 1992) proposed inserting bare copper strips between laminations to reduce the temperature rise in iron laminations. Such copper strips however are in the path of alternating fields and hence generate eddy losses.
Liebe et al (U.S. Pat. No. 3,965,378) proposed inserting bare copper strips that protrude out of the coil; cool air grazes over it to remove heat by free convection. However, it is well known that the boundary layer of free convective air is about 0.2 in. thick. Packing of copper protrusions at less than 0.25 in. spacing, as proposed by Liebe, will degrade cooling effectiveness.
Liang et al (U.S. Pat. No. 6,744,158, issued Jun. 1, 2004) teaches using conducting rings around the coils for cooling. T. Nilson (U.S. Pat. No. 6,798,105, issued Sep. 28, 2004) teaches insulated winding wires in contact with a cooling medium. R. Nygard (U.S. Pat. No. 5,886,434, issued Mar. 23, 1999) and P. Eckels (U.S. Pat. No. 4,282,450, issued Aug. 4, 1981) are examples of fluid cooling of electrical windings.


An optical fiber module is formed by storing an optical component and a connection portion of this optical component and an optical fiber into a package. The optical fiber module has the package, the optical component unfixedly stored into the package, and the optical fiber in which one end side of the optical fiber is connected to the optical component and the other end side is pulled out of the package to the package exterior. An optical fiber anchor member is arranged in the package in an extraction preventing state in an optical fiber pulling-out area of the package. The optical fiber is fixed to the optical fiber anchor member. The optical fiber anchor member and the package are set to be relatively moved in the optical fiber longitudinal direction.

Optical components having the functions of optical branching, an optical switching, wavelength multiplexing and demultiplexing, etc. are widely used in optical communication. The optical components are variously formed, but wide utilization in the future is expected from an integration property and mass productivity with respect to an optical component having an optical waveguide circuit in which the circuit of an optical waveguide is formed on a substrate among these optical components. The optical waveguide circuit was conventionally formed by arranging the circuit of the optical waveguide constructed by the material of a silica-base, etc. on the substrate of silicon, silica, etc. However, the optical waveguide circuit using the material of a polyimide-base in forming areas of the substrate and the optical waveguide is also recently formed.
The present invention provides an optical fiber module having various kinds of optical components as mentioned above. The optical fiber module in one aspect of the present invention comprises:
a package;
an optical component unfixedly stored into the package; and
at least one optical fiber in which one end side of the optical fiber is connected to the optical component and the other end side is inserted into the package in a non-fixing state and is pulled out to the package exterior;
wherein an optical fiber anchor member is arranged in the package in an extraction preventing state in an optical fiber pulling-out area of the package;
the optical fiber anchor member and the optical fiber are fixed; and
a relative movement range able to relatively move the optical fiber anchor member and the package in the optical fiber longitudinal direction is given between the optical fiber anchor member and the package.
Further, the optical fiber module in another aspect of the present invention comprises:
a package;
an optical component unfixedly stored into the package;
at least one first optical fiber in which one end side of the fiber is connected to one end side of the optical component, and the other end side of the fiber is inserted into one end side of the package in a non-fixing state and is pulled out to the package exterior; and
at least one second optical fiber in which one end side of this fiber is connected to the other end side of the optical component, and the other end side of this fiber is inserted into the other end side of the package in the non-fixing state and is pulled out to the package exterior;
wherein a first optical fiber anchor member is arranged in the package in an extraction preventing state in an optical fiber pulling-out area on one end side of the package;
a second optical fiber anchor member is arranged in the package in the extraction preventing state in the optical fiber pulling-out area on the other end side of the package;
the first optical fiber anchor member and the first optical fiber are fixed, and the second optical fiber anchor member and the second optical fiber are fixed; and
a relative movement range able to relatively move the first and second optical fiber anchor members and the package in the optical fiber longitudinal direction is given between the first and second optical fiber anchor members and the package.
The optical fiber module in still another aspect of the present invention comprises:
a package;
an optical component unfixedly stored into the package;
at least one first optical fiber in which one end side of the fiber is connected to one end side of the optical component, and the other end side of the fiber is inserted into one end side of the package in a non-fixing state and is pulled out to the package exterior; and
at least one second optical fiber in which one end side of this fiber is connected to the other end side of said optical component, and the other end side of this fiber is inserted into the other end side of the package in the non-fixing state and is pulled out to the package exterior;
wherein a first optical fiber anchor member is fixedly arranged in the first optical fiber in an extraction preventing state with respect to the package in an optical fiber pulling-out area on one end side of the package;
a second optical fiber anchor member is fixedly arranged in the second optical fiber in the extraction preventing state with respect to the package in the optical fiber pulling-out area on the other end side of the package;
each of the first and second optical fiber anchor members has first and second flange portions projected in a direction crossing the optical fiber longitudinal direction in positions spaced from each other in the optical fiber longitudinal direction;
the wall of the optical fiber pulling-out area of the package is nipped by these first and second flange portions from both sides through intervals;
the first flange portion is arranged in the package exterior and the second flange portion is arranged in the package interior; and
d1 greater than d3 and d4 greater than d2 are formed when the interval between the first flange portion of the first optical fiber anchor member and the package is set to d1, and the interval between the second flange portion of the first optical fiber anchor member and the package is set to d2, and the interval between the second flange portion of the second optical fiber anchor member and the package is set to d3, and the interval between the first flange portion of the second optical fiber anchor member and the package is set to d4.


A method of paying a merchant for a transaction associated with a program. The method including the steps of receiving a request from a merchant for a payment associated with a purchase, generating a payment identifier, generating a payment number having a predetermined limit amount and a predetermined expiration date, associating the payment identifier with the payment number and transmitting the payment number to the merchant for payment of the request.

Fraudulent charges on credit cards and overcharges are commonly experienced in the traditional credit card processing industry. It is not uncommon for a merchant to either unintentionally, or intentionally, over-charge a customer's credit card or present an unauthorized charge to the card. The fraudulent charge can be addressed with the credit card company issuing the card. However, the process is time consuming and does not provide a guarantee of reimbursement to the customer. Additionally, often times with a fraudulent dispute, the customer does not become aware of the fraudulent charge until reconciliation at the end of the statement period, resulting in an additional delay in reimbursement resolution. Overcharges present a different problem. Most companies have a high-end limit for overcharges. When charges are over the limit, the merchant is contacted and a reversal or adjustment is requested. This also happens at the end of the statement period, resulting in additional research into the charges due to the lapse of time.
In a typical overcharge scenario, a merchant neglects to charge a credit card administrator for a portion of a transaction, such as for towing a vehicle to a repair facility as part of a repair. To correct the oversight the credit card is run a second time for a sixty-five dollar towing fee. The second charge results in an overcharge condition that is not evident until the two individual charges are reconciled at the end of the statement period. In another scenario, an additional ten dollars is initially charged to the credit card because the merchant knows the ten dollars is not enough to elicit a dispute, resulting in a fraudulent overcharge to the credit card.
The largest expense that is incurred when using a credit card to settle payments, is the time consuming process of reconciling the credit card statement to the payments that were processed in this manner. In many large credit card administration organizations, there is an entire staff of individuals devoted to this task. Research indicates that it takes at least one person, one week a month to reconcile a statement with as few as three hundred charges. When a charge cannot be reconciled, additional personnel become involved, at an additional expense, to determine how to write off the net adjustments.
Purchasing cards are known in the art as a means of streamlining the traditional purchase order and payment processes for low value transactions. Users, typically corporations and government agencies, find a disproportionate number of small dollar payments, those less than $1,000, make up the majority of payments while representing a small percentage of the dollars spent. The transactional cost of making these payments using the traditional process is the same regardless of the dollar amount of the payment. Often the cost of making a payment exceeds the value of the item being acquired. A purchasing card simplifies the process and reduces the transactional cost.
A purchasing card can be used to track charges that have been executed by buying agents and are most widely used in large corporations to track buyer activity. The merchant card device recognizes that the card being processed is a purchasing card and requires a code to be entered after the card is run. This code can be provided on the billing statement to aide in reconciliation. However, purchasing cards are only effective for providing reconciliation enhancements when used at a merchant whose point of sale card system requests the purchasing code. Most point of sale card readers are not programmed for this functionality. Additionally, a purchasing card does not provide fraud or overcharge protection.
It is also known in the art to add an authorization code field to the claim record on the administrator's database. In this scenario, those individuals responsible for payment to the merchant or claims examiners supply the card number and authorized amount to the merchant and then wait for the merchant to run the card. When the purchase is completed and the authorization prints, the merchant reads the authorization code to the examiner and the examiner types the code into a data field associated with the payment. Reconciliation can be accomplished by matching the authorization codes from the credit card statement to the authorization codes on the payment file.
Although the incorporation of authorization codes has proven to be the most effective method of enhancing reconciliation to date, it is extremely time consuming. The credit card administrator spends three to five additional minutes per payment on the phone in this process result in increased labor and capital expenses. The incorporation of authorization codes does not provide guaranteed reconciliation. Even by incorporating this time consuming method into the credit card process, it is shown that at best 85% of the payments can be reconciled. Additionally, the incorporation of authorization codes does not provide fraud or overcharge protection.
In a specific example regarding an insurance claim, when an insured customer needs a repair or replacement product, many service institutions require the insurance company to provide a credit card so that immediate payment is made. While the insurance company might prefer to send a check, the delay in printing, delivering, depositing and clearing such funds are not attractive to the service provider. The benefit of receiving credit card information is the speed in which funds and payment can be guaranteed.
The insurance company might take several approaches when providing credit card information. The insurance company may fax the service institution the credit card number with the authorized amount or call the service institution and read the number over the telephone. Frequently, the service institution and insurance company may disagree on what each considers appropriate charges. For example, in the case of a vehicle breakdown, the insurance company may agree to pay for a new water pump for the car but not for the charge to tow the car to the service bay. Often, the service institution, once in possession of the credit card information, will charge for work not authorized by the insurance company. Alternatively, the service institution may undercharge the credit card in view of the amount authorized. The inconsistency and fraud perpetrated on the insurance company and the credit card institution that issued the card results in substantial losses, particularly in view of the substantial amounts involved in warranty claims.
When the insurance company receives the credit card bill, the information contained in the statement is severely limited for reconciliation purposes. A single insurance company credit card statement may have thousands of different claim charges. Matching each charge by service institution and amount is often cumbersome if not impossible. As noted above, service institutions may overcharge or undercharge the authorized amount. Thus, there are no matching transactions to reconcile. Furthermore, if the service institution is a franchise multiple claims may be charged under the same franchise name, making reconciliation even more difficult.
What is needed in the industry is an improved means through which customers can provide payments to a merchant that provides additional fraud and overcharge protection while eliminating the need for tracking authorization codes and purchasing codes. A method of payment is needed that provides swift payment to the merchant while still allowing the payment service administrator to reconcile the merchant payments to the merchants and to the corresponding transactions.

Method of providing secure payment and transaction reconciliation


A seating arrangement for a cabin of a passenger aircraft that includes 5-abreast passenger accommodation suites, each including a privacy wall and a seat movable between a seating position and a lie-flat bed position, and adapted to be laterally positioned in the aircraft cabin in respective adjacent outboard, middle and inboard positions. Three of the suites are adapted to be positioned in a longitudinally-offset position in relation to each other and defining respective ingress/egress paths to a cabin aisle extending along a longitudinal axis of the aircraft cabin adjacent the third suite. Two of the suites are positioned in a longitudinally-offset position in relation to each other and defining respective ingress/egress paths on the opposite side of the cabin aisle. At least some of the suites define an angular offset relative to the longitudinal axis of the cabin aisle.

The present invention relates generally to aircraft seating suites and more particularly to passenger suite arrangements that provide unimpeded aisle access for each passenger. The suite arrangements are particularly intended for narrow body, single aisle passenger aircraft, such as, for example, Boeing 737 and 757 aircraft and Airbus A319 and 320 aircraft. This general class of seating is referred to as "compressed business class." Embodiments of the invention permit enhanced business class seating in these and other narrow body aircraft, increasing passenger comfort while affording the aircraft operator the ability to charge a higher fare for a seat with greater comfort and additional amenities such as a privacy wall, lie-flat capable seat, ottoman, audio/video equipment, table, closet and charging station for portable electronic devices, among other amenities. Suites are most often found on wide-body aircraft where more space is available for accommodating the travel preferences of premium class passengers who can afford to pay higher fares for more space, privacy and conveniences. While the invention is described in relation to a 5-abreast passenger suite arrangement for a single aisle aircraft, similar suite arrangements can be used for wide-body aircraft having two aisles and therefore capable of accommodating a larger number of abreast seats, as described below.
In all seating classes, there is a need to arrange the seats to maximize density without compromising space and privacy. On current wide-body aircraft, passenger seat ingress and egress is accomplished directly from longitudinal aisles that extend through the passenger cabin. As such, each suite is positioned adjacent one of the aisles or in a non-aisle position requiring the seat occupant to ingress and egress through a laterally adjacent inboard aisle suite. This has the necessary effect of interrupting the privacy of the passenger seated in the inboard aisle suite as the outboard passenger passes through the seating area of the inboard aisle suite. Such arrangements also limit the number of suites that can be positioned abreast and may require that all of the suites be positioned at an angle to the longitudinal axis of the aircraft or with some facing forward and some aft.

Forward-facing aircraft passenger suite with all aisle access


A webbing drive apparatus for a seat belt system which is adapted to fasten a webbing, that is retained by a wire, around a seat occupant of a vehicle or cancelling the application thereof by taking up the wire onto an outer periphery of a rotating drum or paying out the wire from the outer periphery. A guide portion for accommodating and guiding the movement of the paid-out wire is provided in a cover for covering the drum. Accordingly, the wire, when paid out, is moved along the guide section.

1. Field of the Invention
The present invention relates to a webbing drive apparatus for a seat belt system which is adapted to drive a webbing for restricting a seat occupant of a vehicle so as to automatically fasten the webbing to the occupant or cancel the application thereof.
2. Description of the Related Art:
An automatic seat belt system in which the webbing is driven by a webbing drive apparatus for automatically applying a webbing to a seat occupant or cancelling the application thereof after the occupant is seated in a vehicle has been proposed.
A conventionally known webbing driving apparatus is arranged in such a manner that the webbing is driven in the longitudinal direction of the vehicle by means of a wire. In this type of webbing drive apparatus, a drum is rotated by the driving force of a motor to take up the wire onto the drum or pay out the same from the drum. The webbing is then guided by a guide means disposed in the longitudinal direction of the vehicle and is driven in the same direction.
With this drive apparatus, the drum onto which the wire is taken up is completely covered with a cover. The wire is stored inside the cover. This cover is provided with a wire passing port through which the wire, that is being taken up onto the drum or paid out therefrom, passes. The wire is thus adapted to be paid out from the drum or taken up onto it through this passing port.
Formed at the edge of the wire passage port provided in the cover is a projecting portion which projects in the direction in which the wire is paid out. The arrangement is such that the wire is paid out from this projecting portion, and is inserted into a guide means disposed in the longitudinal direction of the vehicle.
However, with the above-described webbing drive apparatus, there is a drawback in that when the wire is paid out from the drum, the wire being paid out is intermittently brought into contact with an inner wall of the cover and generates noise, thereby imparting discomfort to the occupant.
That is to say, at the time when the wire is taken up spirally onto the drum and a portion of the wire in the outermost layer thereof located at one end of the drum is paid out in the paying-out direction through the passage port of the cover, that portion of the wire separates from the outer periphery of the drum and is then driven in sliding contact with the inner wall surface of the cover before it is paid out through the passage port. However, the portion of the wire paid out from inside the cover is subjected to a compressive load by means of sliding resistance or the like caused by the guiding means. The result is that the wire can buckle inside the cover, becoming deformed in the same direction as the axial direction of the drum. If the wire is further paid out in this state in which buckling has occurred, the wire moves impulsively in the direction opposite to the direction in which it has become deformed by buckling. In consequence, the wire is brought into contact with the inner wall surface, particularly the inner wall surface opposing the end surface of the drum, and this results in the so-called spring-back phenomenon occurs which generates noises. When this spring-back phenomenon occurs intermittently as the wire is further paid out, the resulting intermittent noises impart discomfort to the vehicle occupant.

Webbing drive apparatus for a seat belt system


A louvered window assembly comprises a fixed window unit B fixedly fitted on a rear side within a window opening A, a louver unit C being slightly less in height and width than the window opening A and to be fitted on a front side within the window opening A, and means for releasably fitting the louver unit C within the window opening A. The louver-unit fitting means comprises a support bracket 31 fastened to the front side of the fixed window B, a hanger bracket 32 fastened to the rear side of the louver unit C and coming into engagement with the support bracket 31, a louver header 20 fastened to the front side of an upper inside surface A3 of the window opening A, a pair of louver jambs 22, 22 fastened one on the front side of each vertical inside surface A3, an upper horizontal clip 40 joined to the front side of the header 20 so as to cover the front side of an upper edge of the louver unit C; and a pair of vertical clip 45 joined one to the outside of each louver jamb so as to cover the outside of the lateral edge of the louver unit C.

1. Field of the Invention
The present invention relates to a louvered window assembly comprising a fixed window unit fixedly fitted on a rear side within a window opening and a louver unit releasably fitted on a front side within the window opening.
2. Prior Art
One typical example of conventional simple louver units is disclosed in U.S. Pat. No. 2,309,717. This conventional louver unit includes a frame having front flanges and on the respective sides thereof and top and bottom flanges and, the flanges being suitably united at the respective corners of the frame. A plurality of louver slats are located within the opening defined by the frame. A wood frame is nailed around an opening cut in a wood frame wall. For installing the louver unit, the frame is fitted into the opening and then securely held in place to the opening by either nailing or screwing the front flanges and top and bottom flanges and to the wood frame.
This type of conventional louver unit has suffered drawbacks. Nailing or screwing of all flanges of the louver unit frame to the wood frame is quite tedious and time-consuming. This would reflect tediousness on the user of this louver unit in replacement.
A louvered window assembly comprising a fixed window and a Venetian blind is shown in U.S. Pat. No. 2,115,935. In this conventional construction, a glass pane is fixedly mounted inside of a window opening. A pair of brackets are fastened at their upper legs to an upper surface of the window opening adjacent to the glass pane. A pivotal pin is fastened to the lower legs of the brackets. A blind unit comprises a pair of parallel upright support members and a plurality of parallel horizontal vanes fastened to the upright support members. The upright support members are hooked at their upper end and are pivotally mounted on the pivotal pin.
With such a construction, the blind unit may be readily and easily tilted relative to the inside window glass to permit the inside window glass to be washed with a tool. However, this type of conventional blind unit is disadvantageous in that, since being poor in strength to be attached to the window opening, the blind unit would be liable to unexpectedly swing or rattle under the force of the strong wind.
Besides, although being capable of turning of the pivotal pin, the blind unit cannot be detached from the window opening. Therefore, the blind unit must be held in a raised position throughout cleaning of the fixed window located inside.


The invention features a displacement and dispersion measuring interferometry system having a Helium-Neon laser light source. The light source can be a Helium-Neon laser that includes an intracavity doubling crystal and an intracavity etalon to generate two harmonically related, single-frequency wavelengths at sufficient powers for interferometric dispersion measurements. Alternatively, the light source can be a single-mode Helium-Neon laser that directs a single-frequency input beam into a resonant external cavity enclosing a doubling crystal to generate two harmonically related, single-frequency wavelengths at sufficient powers for interferometric dispersion measurements. In addition to dispersion measurements, the inherent wavelength stability of the Helium-Neon source permits high-accuracy displacement measurements. Thus, the Helium-Neon laser light source is sufficient for the interferometry system to simultaneously measure displacement and dispersion, and correct the displacement measurement for air-turbulence using the dispersion measurement.

This invention relates to a laser light source suitable for displacement and dispersion measuring interferometers, which can be used to measure displacements of high-performance stages, e.g., reticle and/or wafer stages, in a lithographic scanner or stepper systems and integrated circuit (IC) test equipment.
Displacement measuring interferometers monitor changes in the position of a measurement object relative to a reference object based on an optical interference signal. The interferometer generates the optical interference signal by overlapping and interfering a measurement beam reflected from the measurement object with a reference beam reflected from the reference object. The light source for many displacement measuring interferometers is a single-wavelength, frequency-stabilized laser, see, e.g., xe2x80x9cRecent advances in displacement measuring interferometryxe2x80x9d by N. Bobroff, Measurement Science and Technology 4, 907-926 (1993). The accuracy of the displacement measurement varies directly with the wavelength stability of the light source.
In many applications, the measurement and reference beams have orthogonal polarizations and frequencies separated by a heterodyne, split-frequency. The split-frequency can be produced, e.g., by Zeeman splitting, by acousto-optical modulation, or by positioning a birefringent element internal to the laser. A polarizing beam splitter directs the measurement beam along a measurement path contacting a reflective measurement object, directs the references beam along a reference path, and thereafter recombines the beams to form overlapping exit measurement and reference beams. The overlapping exit beams form an output beam that passes through a polarizer that mixes polarizations of the exit measurement and reference beams to form a mixed beam. Components of the exit measurement and reference beams in the mixed beam interfere with one another so that the intensity of the mixed beam varies with the relative phase of the exit measurement and reference beams. A detector measures the time-dependent intensity of the mixed beam and generates an electrical interference signal proportional to that intensity. Because the measurement and reference beams have different frequencies, the electrical interference signal includes a xe2x80x9cheterodynexe2x80x9d signal at the split frequency. When the measurement object is moving, e.g., by translating a reflective stage, the heterodyne signal is at a frequency equal to the split frequency plus a Doppler shift. The Doppler shift equals 2xcexdp, where xcexd is the relative velocity of the measurement and reference objects, xcex is the wavelength of the measurement and reference beams, and p is the number of passes to the reference and measurement objects. Changes in the optical path length to the measurement object correspond to changes in the phase of the measured interference signal, with a 2xcfx80 phase change substantially equal to an optical path length change nL of xcex/p, where n is the average refractive index of the medium through which the light beams travel, e.g., air or vacuum, and where L is a round-trip distance change, e.g., the change in distance to and from a stage that includes the measurement object.
For high performance applications such as IC manufacturing the quantity of interest is the geometrical length L and not the optical path length nL, which is what is A measured by the displacement measuring interferometer. In particular, changes in nL can be caused by changes in the refractive index n rather than by geometric changes in the relative position of the measurement object. For example, in lithography applications air turbulence, particularly in the region surrounding a moving wafer or reticle stage, can cause changes in n. Such changes need to be determined to obtain accurate geometric displacement measurements. If not corrected, the overlay performance and yield of a lithography tool used to manufacture ICs can be seriously limited. See, e.g., xe2x80x9cResidual errors in laser interferometry from air turbulence and non-linearity,xe2x80x9d by N. Bobroff, Appl. Opt. 26, 2676-2682 (1987).
Techniques based on dispersion interferometry have been used to compensate displacement measurements for air turbulence. In particular, interferometric displacement measurements are made at multiple optical wavelengths to determine the dispersion of the gas in the measurement path. The dispersion measurement can be used to convert an optical path length measured by a distance measuring interferometer into a geometric length. The conversion also requires knowledge of an intrinsic value for the refractivity of the gas. A suitable value is xcex93, which is the reciprocal dispersive power of the gas for the wavelengths used in the dispersion interferometry. In general, the sensitivity of the dispersion measurement to the consequences of air-turbulence correction increases as xcex93 decreases.
The invention features a displacement and dispersion measuring interferometry system having a Helium-Neon laser light source. The light source can be a Helium-Neon laser that includes an intracavity doubling crystal and an intracavity etalon to generate two harmonically related, single-frequency wavelengths at sufficient powers for interferometric dispersion measurements. Alternatively, the light source can be a single-mode Helium-Neon laser that directs a single-frequency input beam into a resonant external cavity enclosing a doubling crystal to generate two harmonically related, single-frequency wavelengths at sufficient powers for interferometric dispersion measurements. In addition to dispersion measurements, the inherent wavelength stability of the Helium-Neon source permits high-accuracy displacement measurements. Thus, the Helium-Neon laser light source is sufficient for the interferometry system to simultaneously measure displacement and dispersion, and correct the displacement measurement for air-turbulence using the dispersion measurement.
In general, in one aspect the invention features a Helium-Neon laser light source including: a Helium-Neon gain medium; a power source electrically coupled to the gain medium which during operation causes the gain medium to emit optical radiation at a first wavelength; a nonlinear optical crystal which during operation converts a portion of the optical radiation at the first wavelength into optical radiation at a second wavelength that is a harmonic of the first wavelength; an etalon; and at least two cavity mirrors enclosing the gain medium, the non-linear optical crystal, and the etalon to define a laser cavity, wherein during operation the etalon causes the cavity to lase at a single axial mode, and wherein at least one of the cavity mirrors couples the optical radiation at the first and second wavelengths into two harmonically related, single-frequency, output beams at the first and second wavelengths.
Embodiments of the laser light source can include any of the following features. A birefringent filter can be positioned within the cavity and oriented to select a particular Helium-Neon laser transition. The front and back faces of the crystal though which the optical radiation propagates can be parallel to one another to within 1 mrad. The at least two cavity mirrors can include two end mirrors and at least one fold mirror. The at least one fold mirror can have a coating that is less than 4% reflective at 3.39 microns.
Also, the laser light source can further include a detector and an intensity controller. During operation the detector measures an intensity of a portion of the output beam at the first wavelength and sends an intensity stabilization signal to the intensity controller indicative of the intensity of the output beam at the first wavelength. The intensity controller causes the power source-to adjust current flow through the gain medium based on the intensity stabilization signal.
Furthermore, the laser light source can include different embodiments for the Helium-Neon light source. For example, the Helium-Neon gain medium can include a vacuum tube filled with Helium and Neon gases, the tube having opposite ends with a Brewster window at one end and a bellows hermetically sealing the other end to one the cavity mirrors. Also, the Helium-Neon gain medium can include multiple vacuum tubes each filled with Helium and Neon gases and multiple fold mirrors folding the multiple tubes into the laser cavity. Furthermore, the Helium-Neon gain medium can include an enclosure of Helium and Neon gases, the enclosure having an elongate cross-section and being surrounded at opposite ends by mirrors that define multiple passes through the enclosure within the laser cavity.
In general, in another aspect, the invention features a Helium-Neon laser light source including: a single-mode Helium-Neon laser which during operation generates a single-frequency input beam at a first wavelength; a nonlinear optical crystal external to the laser which during operation converts a portion of the input beam at the first wavelength into optical radiation at a second wavelength that is a harmonic of the first wavelength; and a plurality of mirrors enclosing the nonlinear crystal to define a resonant external cavity, wherein one of the mirrors couples optical radiation at the first wavelength from the input beam into the external cavity and another one of the mirrors couples optical radiation at the first and second wavelengths out of the external cavity to produce two harmonically related, single-frequency, output beams at the first and second wavelengths.
Embodiments of either of the Helium-Neon laser light sources described above can include any of the following features. The two harmonically related, single-frequency, output beams can be coextensive. The intensity of each output beam can be greater than about 0.5 mW. The laser light sources can further include a transducer coupled to one of the cavity mirrors and a wavelength controller. During operation the wavelength controller causes the transducer to adjust the cavity length of the laser cavity or extra cavity, respectively, based on a wavelength stabilization signal derived from one of the output beams. For the laser cavity, for example, the wavelength stabilization signal can be generated by comparing the output frequency to the frequency produced by reference laser or a temperature-controlled Fabry-Perot cavity, or by analyzing the transmission of the output beam through a gas absorption cell having well-established absorption spectra. Alternatively, for the laser source having the external cavity, the cavity-length controller can cause the transducer to adjust the cavity length based on an error signal derived from input beam light not coupled into the external cavity.
Also, the laser light sources can her include first and second acousto-optical modulation systems positioned external to, the laser cavity or external cavity, respectively. During operation the first modulation system generates a frequency splitting between orthogonal polarization components of the output beam at the first wavelength and the second modulation system generates a frequency splitting between orthogonal polarization components of the output beam at the second wavelength.
Furthermore, the laser light sources can further include a heating element thermally coupled to the crystal and a temperature controller that causes the heating element to maintain a crystal temperature suitable for non-critical phase matching of the optical radiation at the first and second wavelengths. The non-linear optical crystal can have an optic axis oriented substantially perpendicular to the propagation direction of the optical radiation within the crystal. For example, the nonlinear optical crystal can be Rubidium Dihydrogen Phosphate (RDP). Alternatively, the nonlinear crystal can be oriented for critical phase matching of the optical radiation at the first and second wavelengths and can be, e.g., one of Lithium Triborate (LBO), Beta-Barium Borate (BBO), or Lithium Iodate (LiIO3).
In another aspect, the invention features an interferometry system including either of the Helium-Neon laser light sources described above and a dispersion interferometer, which during operation measures dispersion along a path to a measurement object using light derived from the two output beams.
In yet another aspect, the inventions features an interferometry system including either of the Helium-Neon laser light sources described above, an interferometer, and an optical analysis system. During operation the interferometer directs first and second measurement beams along a common path contacting a reflective measurement object, and combines the reflected first measurement beam with a first reference beam to form a first exit beam and the reflected second measurement beam with a second reference beam to form a second exit beam. The first measurement and reference beams are derived from the output beam from the laser light source having the first wavelength and the second measurement and reference beans are derived from the output beam from the laser light source having the second wavelength. The first and second exit beams are indicative of changes in the optical path length to the measurement object at the first and second wavelengths. During operation, the optical analysis system determines changes in the geometric path length to the measurement object based on the first and second exit beams.
In general, in yet another aspect, the invention features an interferometry system including: a Helium-Neon laser light source that generates two harmonically related, single-frequency output beams; and a dispersion interferometer which during operation measures dispersion along a path to a measurement object using light derived from the two output beams.
In general, in yet another aspect, the invention features an interferometry system including: a Helium-Neon laser light source that generates two harmonically related, single-frequency output beams; an interferometer; and an optical analysis system. During operation, the interferometer directs first and second measurement beams along a common path contacting a reflective measurement object, and combines the reflected first measurement beam with a first reference beam to form a first exit beam and the reflected second measurement beam with a second reference beam to form a second exit beam. The first measurement and reference beams are derived from the output beam from the laser light source having the first wavelength and the second measurement and reference beams are derived from the output beam from the laser light source having the second wavelength. The first and second exit beams are indicative of changes in the optical path length to the measurement object at the first and second wavelengths. During operation, the optical analysis system determines changes in the geometric path length to the measurement object based on the first and second exit beams.
In another aspect, the invention features a lithography system for use in fabricating integrated circuits on a wafer. The system includes: a stage for supporting the wafer, an illumination system for imaging spatially patterned radiation onto the wafer, a positioning system for adjusting the position of the stage relative to the imaged radiation; and at least one of the interferometry systems described above for measuring the position of the stage.
In yet another aspect, the invention features a lithography system for use in fabricating integrated circuits on a wafer. The system includes: a stage for supporting the wafer, and an illumination system including a radiation source, a mask, a positioning system, a lens assembly, and at least one of the interferometry systems described above. During operation, the source directs radiation through the mask to produce spatially patterned radiation, the positioning system adjusts the position of the mask relative to the radiation from the source, the lens assembly images the spatially patterned radiation onto the wafer, and the interferometry system measures the position of the mask relative to the radiation from the source.
In yet another aspect, the invention features a lithography system for fabricating integrated circuits including first and second components and at least one of the interferometry systems described above. The first and second components are movable relative to each other. The first component includes the measurement object, and the interferometry system measures the position of the first component relative to the second component.
In yet another aspect, the invention features a lithography system for fabricating integrated circuits including first and second components, and at least one of the interferometry systems described above. The first and second components are movable relative to each other. The first component includes the measurement object, the reference beams contact the second component prior to forming the exit beams, and the interferometry system measures the relative position of the first and second components.
In yet another aspect, the invention features a beam writing system for use in fabricating a lithography mask. The system includes: a source providing a write beam to pattern a substrate; a stage supporting the substrate; a beam directing assembly for delivering the write beam to the substrate; a positioning system for positioning the stage and beam directing assembly relative one another, and at least one of the interferometry systems described above for measuring the position of the stage relative to the beam directing assembly.
In general, in another aspect, the invention features an interferometry method including: providing two harmonically related, single-frequency output beams from a Helium-Neon laser light source; and measuring dispersion along a path to a measurement object using light derived from the two output beams.
In general, in yet another aspect, the invention features an interferometry method including: providing two harmonically related, single-frequency output beams from a Helium-Neon laser light source; and interferometrically measuring changes in a geometric path length to a measurement object using light derived from the two output beams.
In another aspect, the invention features a lithography method for use in fabricating integrated circuits on a wafer. The lithography method includes: supporting the wafer on a moveable stage; imaging spatially patterned radiation onto the wafer, adjusting the position of the stage; and measuring the position of the stage using any of the interferometry methods described above.
In yet another aspect, the invention features a lithography method for use in the fabrication of integrated circuits. The lithography method includes: directing input radiation through a mask to produce spatially patterned radiation; positioning the mask relative to the input radiation; measuring the position of the mask relative to the input radiation using any of the interferometry methods described above, wherein one of a stage supporting the mask and a illumination system providing the input radiation includes the measurement object; and imaging the spatially patterned radiation onto a wafer.
In yet another aspect, the invention features a lithography method for fabricating integrated circuits on a wafer including: positioning a first component of a lithography system relative to a second component of a lithography system to expose the wafer to spatially patterned radiation; and measuring the position of the first component relative to the second component using any of the interferometry methods described above, wherein the first component includes the measurement object.
In yet another aspect, the invention features a beam writing method for use in fabricating a lithography mask. The method includes: directing a write beam to a substrate to pattern the substrate; positioning the substrate relative to the write beam; and measuring the position of the substrate relative to the write beam using any of the interferometry methods described above.
The invention has many advantages. The Helium-Neon laser light source generates two harmonically related, single-frequency wavelengths (632.8 nm and 316.4 nm) at powers sufficient for dispersion interferometry, e.g., output powers greater than 1 mW. The intracavity etalon causes the laser to operate in a single axial mode to thereby generate the single-frequency wavelengths. In addition because the Helium-Neon gain medium has a relatively narrow emission curve (about 1.5 GHz at 632.8 nm), the wavelength stability of the single-frequency wavelengths is excellent (about 3 parts in 106). Routine feedback control of the laser cavity length can further enhance the wavelength stability to better than 1 part in 109. Moreover, the Helium-Neon light source is compact, robust, and long-lived relative to many lasers with other gain media.
Furthermore, in embodiments for which the doubling crystal is non-critically phase matched by temperature tuning, there is no lateral walk-off between the fundamental and frequency-doubled beams. As a result, the laser light source output beams can have substantially circular transverse profiles, and the doubling crystal can be longer, thereby enhancing conversion efficiency. In addition, for either critically or non-critically phase-matched embodiments, an additional control system can modulate the current intensity to the Helium-Neon discharge tube based on the intensity of the fundamental output beam to independently stabilize the intensity of the fundamental output beam. Moreover, embodiments in which multiple Helium-Neon gas tubes are folded into the cavity or in which the cavity defines multiple passes within a Helium-Neon gas slab both increase the compactness of the laser and its intensity output. Also, some embodiments produce multiple pairs of harmonically related, single-frequency output beams thereby increasing the overall power generated by the light source.
The properties of the Helium-Neon laser light source can be exploited in a displacement and dispersion measuring interferometry system. The two high-stability, harmonically related, single-frequency wavelengths permit the interferometry system to simultaneously measure displacement and dispersion using the Helium-Neon laser light source as the only light source. The dispersion measurement can be used to correct the displacement measurement for air turbulence. In addition, the wavelengths provided by the laser (632.8 nm and 316.4 nm) are especially useful for the dispersion measurement because they correspond to a relatively low value for the reciprocal dispersive power xcex93 as compared with other wavelengths such as those from the fundamental and doubled output of a frequency-doubled Nd:YAG laser (1064 nm and 532 nm). In particular, xcex93 equals about 21.4 for the Helium-Neon laser wavelengths and xcex93 equals about 64.7 for Nd:YAG laser wavelengths. As mentioned above, the sensitivity of the dispersion measurement increases inversely with xcex93. Furthermore, the Helium-Neon wavelengths are in range (greater than about 300 nm) where suitable optical components and coatings can be fabricated inexpensively. Moreover, in embodiments for which the doubling crystal is non-critically phase-matched by temperature tuning, the symmetrical spatial profiles of the fundamental and frequency-doubled output beams reduce phase front errors in the interferometry measurements.
More generally, because the interferometry system can measure both dispersion and displacement using the Helium Neon laser light source as the only light source, the interferometry system is simple and compact. In particular, no additional light sources are necessary. Moreover, because the dispersion and displacement measurements are made using only two wavelengths, suitable coatings for the interferometer optics can be more easily obtained.
Nonetheless, in other embodiments, the interferometry systems can include an additional light source such as a separate Helium-Neon, Argon, or diode laser producing a single-frequency beam at only a single wavelength. In such cases, the Helium-Neon laser light source described above only provides light for interferometric dispersion measurements, and the additional light source provides light for interferometric displacement measurements.
Because the displacement and distance measuring interferometry systems provide high-accuracy position measurements corrected for air turbulence, they can be incorporated into lithography tools used to fabricate integrated circuits (ICs). The robustness and long life of the Helium-Neon source in the interferometry systems make the systems especially suitable for the demands of IC fabrication.
Other features, aspects, and advantages of the invention follow.

Helium- Neon laser light source generating two harmonically related, single- frequency wavelengths for use in displacement and dispersion measuring interferometry


A development-oriented directory structure that can be used with an application server, and which solves a number of the problems associated with traditional Enterprise Archive (EAR) files. The directory structure comprises a source folder that stores source files for use with or as part of a software application; and an output folder that stores compiled files for use with or as part of the software application. The source folder and the output folder output folder form a split directory which is then used in deploying the software application.

The JAVA 2 ENTERPRISE EDITION (J2EE) specification defines the ENTERPRISE ARCHIVE (EAR) file as a standard structure for developing and packaging J2EE applications. EARs are useful for application development, in that the application may, for example, include both a Web application (Webapp) and an ENTERPRISE JAVABEAN (EJB), which will be packaged into the EAR. However, while this works well for completed applications, it isn't very convenient for application development.
In a typical application server development environment that uses EARs, a structure similar to that shown in FIG. 1 is often used. As shown in FIG. 1, the directories for the /myapp application include, for example, a /myejb subdirectory, for storing both ejb source files and XML descriptors. Similarly /myapp may include a /webapp directory, for storing JSPs, html files, and images, etc. All of this code is stored in the source control system for use by the developer in building the application.
To deploy the application, a number of steps must be performed, namely compiling the JAVA files, generating any servlets or container classes, and packaging the whole lot in an EAR. The EAR adheres to a format wherein the top level includes an EAR descriptor IMETA-INF/application.xml, and all of the other components are listed underneath. This approach works well when the application has been fully completed and ready for installation in the production environment. However it's less useful for application development.
A problem with the traditional approach is that the developer will have both source files and system-generated output in the same directory. This can be confusing. It's also hard to generate a clean build of the application since it's difficult to delete only the system-generated files. A mechanism that allows application development while maintaining some separation between the user-coded and system-generated files would be useful in addressing these problems.

System and method for using a split-directory structure for software development


Installation of an engine to a support structure includes temporarily attaching first and second alignment structures to the support structure and the engine. One of the alignment structures has a target pattern on its surface. The installation further includes using a machine vision system from the other of the mounting structures to indicate the relative position of the target pattern with respect to a reference. The relative position of the target pattern with respect to the reference provides information about relative position of an engine mounting element (e.g., bolt hole) with respect to a corresponding mounting element (e.g., bolt hole) in the support structure. The relative position of the target pattern with respect to the reference can be used to maneuver the engine in order to align the mounting elements.

The Boeing 787 Dreamliner™ airplane has two high bypass turbofan engines, one under each wing. The engines are very large. Each engine has a length of about 160 inches and a fan diameter of about 110 inches.
The engines are mounted to pylons on the wings. During installation of an engine, the engine is moved toward a pylon and maneuvered so mounting holes in its mounts are aligned with mounting holes in the pylon. With the mounting holes aligned, shear pins are engaged in the engine mounts. Once the shear pins are at full engagement, the engine is moved into its final position and fastened to the pylon with tension bolts.
Maneuvering the engine with respect to the pylon is challenging, especially while lining up the mounting holes for the shear pins. Because the engine is so large and because the mounting holes are at the top of the engine, visual sight lines to the mounting holes are poor.

Engine installation using machine vision for alignment


An integrated diagnostics system utilizes online and offline diagnostics techniques to evaluate control valves found in process plant environments. The integrated diagnostics system improves on existing diagnostic systems, which typically rely exclusively on online diagnostics or offline diagnostics.

Process control systems, such as those used in chemical, petroleum or other process plants, typically include one or more process controllers communicatively coupled to at least one host or operator workstation and to one or more field devices via analog, digital, or combined analog/digital communication links.
The process controllers receive signals indicative of process measurements made by sensors and/or field devices and/or other information pertaining to the field devices and execute a controller application that runs, for example, different control modules that make process control decisions, generate control signals based on the received information and coordinate with the control modules or blocks being performed in the field devices, such as HART®, Wireless HART®, and FOUNDATION® Fieldbus field devices. The control modules in the controller send the control signals over the communication lines or links to the field devices to thereby control the operation of at least a portion of the process plant or system.
The field devices, which may be, for example, valves, valve positioners, switches, and transmitters (e.g., temperature, pressure, level and flow rate sensors), are located within the process environment and generally perform physical or process control functions such as opening or closing valves, measuring process parameters, etc. to control one or more process executing within the process plant or system. Smart field devices, such as field devices conforming to the well-known Fieldbus protocol may also perform control calculations, alarming functions, and other control functions commonly implemented within the controller.
Information from the field devices and the controller is usually made available over a data highway to one or more other hardware devices, such as operator workstations, personal computers or computing devices, data historians, report generators, centralized databases, or other centralized administrative computing devices that are typically placed in control rooms or other locations away from the harsher plant environment. Each of these hardware devices typically is centralized across the process plant or across a portion of the process plant. These hardware devices run applications that may, for example, enable an operator to perform functions with respect to controlling a process and/or operating the process plant, such as changing settings of the process control routine, modifying the operation of the control modules within the controllers or the field devices, viewing the current state of the process, viewing alarms generated by field devices and controllers, simulating the operation of the process for the purpose of training personnel or testing the process control software, keeping and updating a configuration database, etc. The data highway utilized by the hardware devices, controllers and field devices may include a wired communication path, a wireless communication path, or a combination of wired and wireless communication paths.
A particular set of process control devices used to achieve a particular control objective (e.g., controlling an inlet valve to a tank based on one or more measured process parameters) may be referred to as a process control loop. Furthermore, each valve or other device may, in turn, include an inner loop wherein, for example, a valve positioner controls a valve actuator (which may be electric, pneumatic, or hydraulic in nature) to move a control element, such as a valve plug, in response to a control signal and obtains feedback from a sensor, such as a position sensor, to control movement of the valve plug. This inner loop is sometimes called a servo loop.
In the case of a hydraulic valve actuator, the control element may move in response to changing fluid pressure on an actuator such as a spring biased diaphragm, which may be caused by a valve positioner responding to a change in the command signal. For example, in one standard valve mechanism, a command signal with a magnitude varying in the range of 4 to 20 mA (milliamperes) causes the valve positioner to alter the amount of fluid and thus, the fluid pressure, within a pressure chamber in proportion to the magnitude of the command signal. Changing fluid pressure in the pressure chamber causes the actuator (i.e., the spring based diaphragm in this example) to move, which causes the control element (e.g., a valve plug) to move. Accurate and precise control depends on a known relationship between (i) a change in pressure exerted on the control element and (ii) the resulting travel of the control element (sometimes simply referred to as travel of the valve).
In some cases, the relationship between supplied pressure and control element travel changes due to wear and tear on the valve, changes in process conditions (e.g., temperature or pressure of material flowing through the valve itself), changes in atmospheric conditions, etc. In some circumstances, the relationship between supplied pressure and control element travel is dynamic over time, and thus must consistently be reevaluated to maintain high performance control.
Generally speaking, valves can be diagnosed using offline diagnostics or online data. Performing offline diagnostics typically involves stroking the valve through its entire range of travel while collecting diagnostics data (e.g., data indicative of the relationship between the supplied pressure and the travel of the valve). While offline diagnostics often provide a comprehensive picture of the overall behavior of a valve, these diagnostics may fail to capture valve behavior similar to what would be found in a commissioned, operating valve. This failure to capture "real world" valve behavior can be attributed to the fact that the conditions may vary greatly from on-line to off-line operation due to extreme temperature, pressure, or other conditions. Rather than moving in a manner similar to what one would expect to see in the field, the valve is typically taken through a full range of travel at a standardized, slow, and methodical pace. While this slow pace removes various dynamics from valve behavior and makes it easier to compare the valve to other similar valves for the purpose of identifying valve health metrics, it is not always helpful by itself in determining whether the health of an operating valve has deteriorated over time. Moreover, even if offline diagnostics more closely captured valve behavior similar to that expected in online operation, offline diagnostics require that the valve be taken out of service because it is not likely that the valve can be taken through a full range of travel while simultaneously maintaining control of a process. Consequently, the process must often be halted for offline diagnostic testing of a valve, which can be costly in terms of lost material and profit. As a result, offline diagnostics testing is infrequent, and control valves often go years without updating offline diagnostics, resulting in a situation where offline diagnostics results, which may be years old, fail to account for break-in and normal wear and tear.
Online diagnostics are typically considered less invasive than offline diagnostics, as online diagnostics can be utilized in-situ (i.e., while the valve is in service). In short, during online diagnostics, the valve operates in normal operating condition while diagnostics data is collected. This has an advantage of not only maintaining normal operation of the valve and process while diagnostics data is collected, but also of accounting for the effect process conditions (e.g., temperature, pressure, etc.) have on the performance of the valve. Unfortunately, online diagnostic methods may also provide limited benefits. Because diagnostics data is only collected during normal online operation, online diagnostics methods may fail to capture diagnostics data pertaining to rare or unexpected conditions. For example, many valves have a limited (e.g., 40%-60%) travel range during typical operation. As a result, online diagnostics may fail to capture diagnostics data regarding how the valve would respond to a command to adjust the valve to a position outside of this limited range.

Integration of online and offline control valve data


A stroller comprises a foldable stroller frame including two handle tubes, two front leg tubes connected respectively to lower ends of the handle tubes, and two rear leg tubes connected respectively and pivotally to the front leg tubes. Each of the handle tubes has upper and lower handle tube sections interconnected pivotally by a first joint. Each of the front leg tubes has upper and lower front leg tube sections interconnected pivotally by a second joint. Each of the lower handle tube sections is connected pivotally to the upper front leg tube section of the corresponding front leg tube and the corresponding rear leg tube by a third joint. Upon folding the stroller frame, an assembly of the handle tubes and the front leg tubes is folded in a Z-shaped manner.

1. Field of the Invention
This invention relates to foldable strollers, and more particularly to a foldable full-featured stroller that is capable of minimizing the folded size of the stroller.
2. Description of the Related Art
Currently available strollers are classified into lightweight type and all-featured type based on consumer's need. A lightweight type stroller is lightweight, and is able to be folded into a compact size. Therefore, the lightweight type stroller is convenient to carry while traveling. The lightweight type stroller, however, has only one function, i.e., to transport a baby or small child. A full-featured stroller has many functions. To perform the functions, the full-featured stroller may include a child tray disposed in front of a seat, a storage basket disposed under the seat, a parent tray disposed adjacent to handles. Typically, the full-featured stroller has a robust stroller frame that can provide a better protection to the child occupant. The full-featured stroller, however, is heavy in weight, and is bulky in volume, so that it is not convenient to carry while traveling. Thus, it is desirable to provide a foldable full-featured stroller that is capable of minimizing the folded size of the stroller.

Foldable full-featured stroller capable of minimizing the folded size of the stroller


Even in the case where input image data is binary data, dot arrangement appropriate for a printing apparatus is achieved to output a high quality image that suppresses an adverse influence such as density unevenness, stripes, or granular feeling. For this purpose, after the inputted binary data has been converted to multivalued data having lower resolution, a dot arrangement pattern that preliminarily specifies printing or non-printing for each of print pixels is set with being related to the multivalued data, and thereby new binary data is generated. At this time, the dot arrangement pattern is set to the dot arrangement appropriate for the printing apparatus, and therefore the high quality image that suppresses the adverse influence such as the density unevenness, stripes, or granular feeling can be outputted.

1. Field of the Invention
The present invention relates to an image processing apparatus and image processing method for representing inputted image data by printing and non-printing of dots. In particular, the present invention relates to an image processing method for, in the case where inputted image data is binary data, performing printing with binary data that achieves dot arrangement appropriate for a printing apparatus.
2. Description of the Related Art
In recent years, a printing apparatus such as an inkjet one is compatible with pieces of input image data in various formats. For example, in the case of outputting a photograph, a poster, or the like, multivalued data photographed by a digital camera, such as RGB data, serves as the input image data for the printing apparatus. On the other hand, in the case of using the printing apparatus for the purpose of proving a print or the like, screened Tiff data (binary data) having been subjected to RIP (Raster Image Processor) serves as the input image data.
In the case of inputting RGB multivalued data, an image processing apparatus performs color conversion of the multivalued data to multivalued data (e.g., CMYK data) corresponding to ink colors used by a printing apparatus, and then converts to binary data corresponding to resolution of the printing apparatus. In this case, a method that performs multivalued quantization to the multivalued data having a smaller number of gradations (e.g., 5-values) than that of the inputted multivalued data, and then with use of a dot arrangement pattern that specifies printing or non-printing for each of pixels corresponding to the resolution of the printing apparatus, converts to the binary data is used.
In such a dot arrangement pattern, dot arrangement convenient for the printing apparatus can be prepared. Also, for the same multivalued quantized value, a plurality of dot arrangement patterns among which positions of printed pixels (dots) are made different is prepared, and depending on any of various conditions, from among the plurality of dot arrangement patterns, one can also be selected. Specifically, for example, to prevent a bias from occurring among the numbers of times individual printing elements print dots, or between the numbers of times of printing during forward and backward scans, the plurality of dot arrangement patterns can be sequentially selected.
Japanese Patent Laid-Open No. 2000-141617 discloses a method that, by randomly selecting one of a plurality of dot arrangement patterns on the basis of a random number having a predetermined bit number, avoids unevenness, stripes, or pseudo contours of an image caused by characteristics of a printing apparatus main body.
On the other hand, Japanese Patent Laid-Open No. 2002-29097 discloses a dot arrangement pattern and a method for selecting the dot arrangement pattern that, in the case of printing an odd raster and an even raster by different nozzle arrays, or printing an odd column and an even column during different scans, prevents a bias in the number of printed dots from occurring between the scans or the rasters.
By employing the method disclosed in Japanese Patent Laid-Open No. 2000-141617 or Japanese Patent Laid-Open No. 2002-29097, even in the case where conveyance unevenness specific to a printing apparatus, or print position displacement specific to a print head is present, dot arrangement patterns that prevent such an adverse influence from being noticeable can be prepared and order of the patterns can be controlled.
However, in the case where the image data inputted to the printing apparatus is binary data, arrangement of printed dots is already specified by the binary data. Accordingly, dot arrangement that can deal with an adverse influence specific to a printing apparatus as disclosed in Japanese Patent Laid-Open No. 2000-141617 or 2002-29097 cannot be achieved on a print medium, and therefore an adverse influence on an image, such as density unevenness, stripes, or granular feeling may be caused.

Image processing apparatus and image processing method generating binary data specifying dot arrangement in a unit area of a print medium


A spot welding electrode is made of a copper base material such as copper, copper alloy, or alumina dispersion strengthened copper, and has a Sn coating layer formed at the part making contact with the material being welded. The formed Sn coating layer reduces electrode wear and prolongs electrode life.

A spot welding electrode must have high electrical conductivity, high thermal conductivity, and superior high temperature strength. Accordingly, various precipitation hardening type copper alloys, such as chromium copper, zirconium copper, and zirconium chromium copper, have been widely used. Recently, an electrode of alumina dispersion strengthened copper, which disperses fine grain alumina into the copper base, has been brought into practical use to significantly improve heat resistance and deposition durability.
The above described spot welding electrodes are applied to the spot welding of aluminum and aluminum alloys (referred to simply as "aluminum" hereafter). When these electrodes are applied to a recent highly automated, high speed progressive aluminum spot welding work, abrasion resistance at the tip of electrode and the strength of the spot-welded part often become problems.
To solve these problems, unexamined Japanese Patent publication 63-260684 provided an electrode forming a thin metallic film, such as W, having a high hardness and high melting point thereon at the area contacting with the material being welded. The electrode is, however, expensive and has insufficient workability, and still leaves the problem of practical application.
Unexamined Japanese Patent publication 63-30185 proposed electrodes coated by Co base alloy and Cr base alloy at the tip thereof, and examined Japanese Patent publication 60-48275 proposed an Al-coated electrode at the tip thereof. However, Co and Cr have problems in cost and electrode durability. As for the Al-coated electrode, sufficient preliminary treatment of aluminum members being welded to remove oxide film therefrom is necessary to assure prolonged electrode life and sufficient strength at the welded part. Such removal of oxide film takes time, and, in some cases, requires use of a wire-brush for perfect removal of the film.


Provided is a rectifier such as a detector in which a cutoff frequency may be increased in a view point different from the reduction in size of the structure. The rectifier includes: a Schottky barrier portion including a Schottky electrode; a barrier portion having a rectifying property with respect to a majority carrier in the Schottky barrier portion; and an ohmic electrode in electrical contact with the barrier portion having the rectifying property, in which each of the Schottky barrier portion and the barrier portion having the rectifying property has an asymmetrical band profile whose gradient on one side is larger than a gradient of another side, and the Schottky barrier portion and the barrier portion having the rectifying property are connected to each other so that the steep gradient side of the band profile is located on a side of the Schottky electrode.

Up to now, a thermal detection device and a quantum detection device have been known as electromagnetic wave detection devices for a frequency band ranging from a millimeter wave band to a terahertz wave band (equal to or more than 30 GHz and equal to or less than 30 THz). Examples of the thermal detection device include a microbolometer (a-S1 or VOX), a pyroelectric device (LiTaO3 or TGS), and a Golay cell. The above-mentioned thermal detection device converts, into heat, a change in property which is caused by an electromagnetic wave energy, and then converts a change in temperature into a thermoelectromotive force or a resistance to detect the change in property. The thermal detection device does not necessarily require cooling but has a relatively slow response because of heat exchange. Examples of the quantum detection device include an intrinsic semiconductor device (such as MCT(HgCdTe) photoconduction device) and an extrinsic semiconductor device. The quantum detection device captures an electromagnetic wave as a photon and detects a photoelectromotive force of a semiconductor having a small band gap or a change in resistance thereof. The quantum detection device has a relatively quick response but requires cooling because thermal energy at room temperature in the frequency range cannot be neglected.
In recent years, an electromagnetic wave detection device using a rectifier for the frequency band ranging from the millimeter wave band to the terahertz wave band (equal to or more than 30 GHz and equal to or less than 30 THz) has been developed as a detector which has a relatively quick response and does not require cooling. The detector captures an electromagnetic wave as a high-frequency electrical signal and detects the high-frequency electrical signal which is received from an antenna and rectified by the rectifier. According to such a system, as the frequency band becomes higher, the detection is normally more difficult. This is because, as the frequency band becomes higher, filter effects caused in all portions of the detector cannot be neglected. Therefore, in many cases, there is employed a system in which the antenna is directly coupled to a rectifier having a microstructure to suppress the filter effects.
Japanese Patent Application Laid-Open No. H09-162424 discloses the detector as described above. The rectifier is a Schottky barrier diode having a Schottky electrode area set to 0.0007 μm2 (0.03 μm in diameter) by micro-machining, which detect an electromagnetic wave of approximately 28 THz (10.6 μm in wavelength) by a CO2 laser. It is known that the Schottky barrier diode is provided with an Rc low-pass filter having a junction capacitance Cj in a Schottky barrier and a series resistance Rs. The junction capacitance Cj is proportional to the Schottky electrode area. Therefore, the simplest method of increasing a cutoff frequency fc (=(2π×RsCj)−1) may be a reduction in Schottky electrode area. Such a relationship of a typical Schottky barrier diode is calculated as follows. When the Schottky electrode area is set to 1 μm2 (approximately 1 μm in diameter) by micro-machining, fc is estimated to be approximately 300 GHz. When the Schottky electrode area is set to 0.1 μm2 (approximately 0.3 μm in diameter) which is 1/10 of above by micro-machining, fc is estimated to be approximately 3 THz. When the Schottky electrode area is set to 0.01 μm2 (approximately 0.1 μm in diameter) which is 1/10 of above by micro-machining, fc is estimated to be approximately 30 THz.

Detector having a Schottky barrier portion and a barrier portion having a rectifying property