Settling response characteristics after change-over from a speed controller to a position controller is attained. Fluctuations in a time taken until change-over is made from the speed controller to the position controller are reduced to stabilize a moving time and to shorten an access time. To this end, a position controller generates a drive signal of a linear or primary function of time in such a manner that a position deviation signal responds to it with a ternary-order function of time which becomes zero in a desired finite settling time. Further, a feedforward signal generator is provided to reduce a follow-up error to a target position signal as an output of a target position signal generator. Furthermore, a switching judger is provided to start its judging operation after the position deviation signal reaches a predetermine position deviation and to perform switching operation from the speed controller to the position controller when the position deviation signal is not larger than a value corresponding to a proportional multiple of a speed signal.

The present invention relates to devices for controlling positioning of an information recording and reproducing device and more particularly, to a device for controlling positioning of a magnetic disk device, an optical disk device or the like.
In an information recording and reproducing device such as a magnetic disk device or an optical disk device, its challenge is to realize a shortened access time by quickly positioning a head position to a target track position.
The access time in the disk device is determined by a time required for a speed control system to perform speed control for movement to the vicinity of the target track and by a time after change-over from-a speed control mode to a positioning control mode until the head is set at the target track position. The position control system immediately after the change-over from the speed control system to a position control system is controlled usually by a feedback compensator such as a PID compensator or a lead-lag compensator.
In a position control system disclosed in JP-A-3-23571, for the purpose of improving response characteristics by reducing an overshoot at a position after change-over from a speed control mode to a position follow-up control mode, a target position signal which exponentially approaches gradually a target track position, is added to a position deviation signal to follow up the position deviation signal to the exponentially-attenuating target position signal, thus improving response characteristics.
And the change-over from the speed control system to the position control system is carried out at a time point that a position deviation becomes a constant value or less.
The background art mentioned above has had a problem that, since the target position signal varies exponentially, only a lapse of an infinite time enables the target position signal to become zero, which results in that there is no guarantee that settling is completed in a finite settling time.
The background art has had another problem that, even when feedback compensation is tried to cause the position signal to follow up a change in the target position signal, a follow-up lag causes a follow-up error, with the result that the settling time cannot be made small.
In such a system that change-over is carried out from a speed control system to a position control system at a time point that a position deviation is a constant value or less, there is further a problem that the change-over is possible in the vicinity of a desired position deviation, but a strong decelerating action in the speed control system causes a head speed to be decelerated too much down to a stall state, thus resulting in an increase of a time taken for the head to reach the target track position, with a prolonged access time.
In accordance with an aspect of the present invention, there is provided a means for causing a position controller to generate a drive signal of a linear or primary function of time when the a position deviation signal becomes zero at a desired finite settling time in such a manner that, immediately after a switching judger changes over from a speed controller to the position controller as a positioning compensator, the position deviation signal responds to it in the form of a ternary-order function of time when the position deviation signal becomes zero at the desired finite settling time; or there is provided a means for causing the position controller to generate a drive signal of an (m+1)-order function of time when the position deviation signal becomes zero at a desired finite settling time in such a manner that the position deviation signal responds to it in the form of an (m+3)-order function (where, m being a natural number) when the position deviation signal becomes zero at a desired finite settling time, whereby the infinite settling time can be made zero.
In the aspect of the present invention, there is provided a recording and reproducing device which includes a target position signal generator for calculating and outputting a target position signal of a ternary-order function of time when a position deviation signal becomes zero in a desired settling time with an inverted value of the position deviation signal as an initial value immediately after change-over to a position controller; a feedforward signal generator for calculating and outputting a feedforward signal of a linear function of time when the position deviation signal becomes zero in the desired settling time with a proportional value of the position deviation signal immediately after change-over to a positioning controller as an initial value; a first adder for adding a target position signal to the position deviation signal and outputting it as a new position deviation signal; a second adder for adding the feedforward signal to a drive signal as an output of a positioning compensator and outputting it as a new drive signal; and an initial value setter for causing state variables of the positioning compensator to be cleared to zeros before the positioning compensator receives the position deviation signal. In this case, since a means is provided for causing feedforward compensation to improve a follow-up performance to the target position signal, a follow-up error to the target position signal can be reduced and a settling time can be shortened.
The target position signal of the ternary-order function and the feedforward signal of the linear function may be replaced by higher-order functions which follow. When the higher-order functions are employed, there is provided a means for calculating and outputting a target position signal of an (m+3)-order function (where, m being a natural number) of time when the position deviation signal becomes zero in the settling time with an inverted value of the position deviation signal immediately after change-over to the position controller as an initial value, and for calculating and outputting a feedforward signal of an (m+1)-order function of time when the feedforward signal becomes zero in a settling time with a proportional value of the position deviation signal immediately after change-over to the positioning controller as an initial value.
Further, a switching judger in the present invention starts its judging operation after the position deviation signal reaches its predetermined position deviation level, performs its switching operation from the speed controller to the position controller when the position deviation signal becomes a value corresponding to a proportional multiple of that of a speed signal, whereby a speed control system prevents an increase of the settling time caused by stall of a head speed and thus variations in a time taken for change-over from the speed controller to the position controller can be stabilized. As a result, a change-over time from the speed controller to the position controller can be stabilized.

Disk storage device and head positioning method


A semiconductor device manufacturing method having a copper wiring, comprises the steps of forming a second insulating film for covering the wiring on a first insulating film, forming a third insulating film which is made of material different from the second insulating film on the second insulating film, coating a resist on the third insulating film and then forming an opening over the wiring by exposing and developing the resist, forming a hole or groove in the third insulating film by etching the third insulating film via the opening, removing the resist by placing the semiconductor substrate in a plasma atmosphere containing oxygen in a chamber and simultaneously removing a part of the second insulating film via the hole or groove to expose the wiring via the hole or groove, and forming a metal film in the hole or groove.

1. Field of the Invention
The present invention relates to a semiconductor device manufacturing method and, more particularly, a method of manufacturing a semiconductor device to which copper wirings are provided.
2. Description of the Prior Art
In case a copper wiring is formed on the semiconductor device, a damascene method of embedding copper in a groove or hole formed in an insulating film is employed.
As a method of embedding the copper in the groove or hole, there are a method of forming a copper film in the groove (or hole) by sputter, a method of removing an unnecessary copper film by polishing after the copper film is grown on the insulating film and in the groove (or hole) by plating method or chemical vapor deposition, etc.
Then, an example of a method of embedding the copper in the hole will be explained with reference to FIGS. 1A to 1D hereinbelow.
As shown in FIG. 1A, first a insulating film 102 is formed on a silicon substrate 101, then a second insulating film 103 is formed on the insulating film 102, then a groove 104 is formed in the second insulating film 103, then a copper film is formed in the groove 104, and then the unnecessary copper film is removed by polishing, whereby the copper film remained in the groove 104 can be employed as a wiring 105.
After this, a silicon nitride film 106 is formed on the second insulating film 103 and the wiring 105, and then an interlayer insulating film 107 made of silicon oxide is formed on the silicon nitride film 106. Then, the interlayer insulating film 107 is patterned by the photolithography, so that a via hole 108 is formed over the wiring 105.
As the etching method of the via hole 108, for example, the interlayer insulating film 107 made of silicon oxide is selectively etched by the high density plasma by using the ICP (Inductive Coupled Plasma) equipment to reach the silicon nitride film 106. In other words, under the condition that the silicon nitride film 106 can function as the etching stopper, a part of the interlayer insulating film 107 is etched.
Then, as shown in FIG. 1B, the silicon nitride film 106 exposed from the via hole 108 is selectively etched, whereby a part of the wiring 105 is exposed from the via hole 108.
Then, as shown in FIG. 1C, a titanium nitride (TiN) barrier layer 109 is formed on the interlayer insulating film 107 and an inner surface of the via hole 108 by sputtering.
In turn, as shown in FIG. 1D, a copper film 110 is formed on the TiN barrier layer 109 by the electrolytic plating method while using the TiN barrier layer 109 as an electrode.
In this case, the first insulating film 102 is a local oxidation of silicon (LOCOS) film employed for device isolation, for example, and the second insulating film 103 is the interlayer insulating film for covering a semiconductor device formed on the silicon substrate 101.
However, if the TiN barrier layer 109 is formed by sputtering, the TiN barrier layer 109 is overhung over the via hole 108, as shown in FIG. 1C, to thus narrow a diameter of an opening of the via hole 108. As a result, a void 111 is caused in a copper film (plug) 110 in the via hole 108 shown in FIG. 1D, so that electric resistance of the copper film 110 in the via hole 108 is enhanced.
In order to eliminate such overhang, as shown in FIG. 2A, for example, there has been known the method in which the interlayer insulating film 107 is placed in the argon plasma atmosphere before the TiN barrier layer 109 is formed, to form an inclined surface on an upper peripheral edge of the via hole 108.
According to this method, as shown in FIG. 2B, since a surface of the wiring 105 is attacked by argon, copper constituting the wiring 105 is spread out to stick onto a side wall of the via hole 108, so that the copper is diffused into the interlayer insulating film 107. Therefore, resistance of copper diffusion portions is lowered to thus cause short-circuit of the wirings.
The interlayer insulating film 107 is etched by the ICP plasma etching equipment in forming the via hole 108. However, in order to prevent etching of the silicon nitride film 106, a carbon compound gas is employed as the etching gas. In this case, since the ICP plasma etching equipment can generate the high density plasma, polymer is stuck onto the inside of the chamber because of reaction of the carbon compound gas. As a result, shortening of the cleaning cycle of the chamber is caused.

Semiconductor device manufacturing method


An inductor includes a plurality of stacked core parts having aligned central openings, at least one spacer separating the core parts from one another, and a winding comprising a plurality turns wound around the stack of core parts through central openings of the core parts. The at least one spacer may include respective groups of spacers disposed between respective pairs of the core parts. In some embodiments, the at least one spacer may include a plurality of spacers disposed between first and second ones of the core parts and radially distributed in a circular pattern aligned with the first and second core parts.

The inventive subject matter relates to electric circuit components and, more particularly, to inductors.
Wide bandgap power semiconductors have enabled high frequency switching operations of power electronic devices. These high switching frequencies can create high frequency ripple currents that need to be controlled (minimized, attenuated, reduced). Power inductors are frequently used to reduce these ripple currents. One challenge frequently encountered by high-frequency filter inductors with high power ratings is high losses. As a result, the core and winding temperatures can be very high.
A very common inductor topology is a toroid core with evenly distributed winding turns. The core is usually made of powdered materials with distributed gaps to store energy. Other magnetic materials and air gaps can also be used. The conductor can be round wires or Litz wires. Recently, vertical winding using flat wire has been used to reduce winding temperature, reduce skin effect, reduce turn-to-turn stray capacitance, and improve electromagnetic compatibility. But the core temperature can still be high when using such inductors in high-frequency, high-power applications.
There are several solutions to reduce core temperature. One solution is to use larger cores to reduce magnetic flux density, but this can increase inductor cost. A second solution is to use low-loss powder cores, but these cores often have low saturation flux density and low DC bias performance and tend to be more expensive, so the result again can be a larger and more expensive core. A third solution is the use of advanced cooling configurations, but this solution may require more cooling power and cooling space.

Inductors with core structure supporting multiple air flow modes


A method for application processing, a storage medium, and an electronic device are provided. The method includes: obtaining historical operation information of the electronic device; obtaining triggering probability values of a plurality of applications in an application platform installed in the electronic device based on the historical operation information; selecting an application with a triggering probability value greater than a first preset probability value as a target application; downloading resource files of the target application; buffering the resource files into a storage area corresponding to the application platform; and loading the resource files stored in the storage area and corresponding to the target application, in response to detecting a triggering operation on the target application.

Presently, with the rapid development of terminal technologies, such as smart phones are getting deeper into people's lives, a variety of applications may be installed in the smart phones, such as a photo capturing application, a game application, and a map application, for a user to use.
However, as functions of the applications become more and more powerful, a storage space occupied by each application is also increasing, which may affect a normal operation of a smart phone system.

Method for application processing, storage medium, and electronic device

GUANGDONG OPPO MOBILE TELECOMMUNICATIONS CORP., LTD.


A sequential access memory (“SAM”) device, system and method is provided that includes a memory array configured to store a group of bytes on each of a plurality of rows. A plurality of bit-lines transfer each of the group of bytes into and out of the memory array, and a pre-charging unit is configured to pre-charge the plurality of bit-lines once per each transfer of one of the group of bytes into or out of one of the plurality of rows. The device operates by accessing a memory array in a SAM device by activating a selected row in the memory array, pre-charging a plurality of bit-lines that provide access to the memory array, and accessing the memory array before the plurality of bit-lines are pre-charged a second time.

An important consideration in the design of complementary metal oxide semiconductor ("CMOS") devices or charge-coupled devices ("CCD") used for imaging applications, such as digital cameras or camcorders, is the efficient use of power. Limiting the power consumption of such CMOS devices or CCDs can result in increased battery life. Limited power consumption can also aid in the reduced generation of heat, a factor especially important in limiting dark current in imaging devices. Dark current, a type of noise that occurs in light-sensitive detectors, may be lessened by operation at low temperatures.
One significant source of power consumption in an imaging device is the pre-charging of bit-lines. Many imaging devices utilize static random access memory ("SRAM") arrays to which data may be written or from which data may be read. Data is often written to or read from the arrays in eight- to ten-bit bytes. However, prior to the read/write operation, the bit-lines i.e., the lines on which the bits are posted, are pre-charged, for example, to a high state, thus removing any residual signal on the bit-lines and fully preparing the bit-lines for the read/write operation. The pre-charge transitions require power to charge and discharge the capacitance associated with each bit-line. Because pre-charging is typically done before any read/write operations involving the SRAM, pre-charging occurs frequently, thus resulting in significant power consumption.
Generally, imaging CMOS devices and CCDs have used random access memory ("RAM") to store the data bytes. However, sequential access memory ("SAM") devices may also be used. SAM devices function by reading and writing data in a sequential manner—the memory array is linearly searched from a set start point until the desired memory address is found. A major limitation of SAM devices, however, is the fact that data read/write times are dependent on the location of the memory address along the linear search path. An audio tape provides a good example of this limitation. Assuming the tape is at its beginning, one can readily listen to the first part of the tape. However, the tape will need to be fast-forwarded to listen to later portions of the tape. This fast-forward process can become very inefficient, especially if the most accessed memory is not near the start point. On the other hand, read/write operations near the start point can be performed very quickly.
FIG. 1 comprises a block diagram of a conventional SAM device 34. The SAM device 34 is comprised of a memory block 10 and an address block 12. In FIG. 1, the memory block 10 consists of an "m by n" array of memory cells 14, each capable of storing one k-bit word or byte. The address block 12 consists of a row address pointer 16 and a column address pointer 18. The row address pointer 16 and the column address pointer 18 each contain a logic block 20, 21 to direct data through an appropriate registrar 22, 23 to or from the specified memory cell 14 in the memory block 10. A write-data bus 24 carries data to the SAM device 34. Data on the write-data bus 24 is parsed into k-bit words by a de-multiplexer 26 and then directed via a bit-line 28 to the appropriate memory cell 14 by both the row address pointer 16 and the column address pointer 18. Similarly, data leaves the SAM device 34 by traveling on the respective bit-lines 28 through a multiplexer 30 which assimilates the data for transmission on a read-data bus 32.
In contrast to SAM, RAM searches in multiple dimensions for a desired memory address. As a result, the time needed to access data is independent of the data's location on the memory array. For many devices, RAM is preferred over SAM for its increased flexibility and overall faster search times. However, SAM is still used when read/write operations can predictably benefit from the sequential search method.
One example of a class of devices that benefits from the SAM technology is digital signal processing devices. Most notably, digital cameras and camcorders, TV receivers, facsimile devices and copiers all may require the reading and writing of a fixed number of data bytes. Additionally, data bytes may be written and read in a sequential order, thus avoiding the potential limitations of SAM devices.
FIG. 2 illustrates how both SAM and RAM devices conventionally require an initializing pre-charge of the device bit-lines. FIG. 2 shows four related timing diagrams 36, namely diagrams depicting a clock signal 44, a pre-charge signal 46, a read-data signal 48, and a write-data signal 50. As shown, a pre-charge pulse 38 which acts to charge the device bit-lines occurs prior to every read operation 40 or write operation 42. Each pre-charge pulse 38 and subsequent read operation 40 or write operation 42 corresponds with a pulse of the clock signal 44. It should be noted that, although the read-data signal 48 and the write-data signal 50 are both shown on FIG. 2 for comparison purposes, the read-data signal 48 and write-data signal 50 do not necessarily occur at the same time.
The present invention addresses the mitigation of the negative effects of frequent pre-charging in an imaging CMOS or CCD application that utilizes some of the advantages of SAM devices over RAM devices.

Sequential access memory with system and method


An apparatus and method for reordering data at a data destination is provided. The apparatus and method provides dynamic, adaptive management of receive buffers in a host channel adapter while recovering on the fly the order of data sent over a medium that does not preserve order. In an exemplary embodiment, the method and apparatus provides a method and apparatus of reordering data of a data transmission received from a source device. The method and apparatus receives, in a data transfer buffer, a data packet transmitted over a connection associated with the source device and determines if the connection requires reordering of data packets. If the connection requires reordering of data packets, the data packet is transferred from the data transfer buffer to a reorder buffer and a reorder state cache is updated to reflect the transfer of the data packet to the reorder buffer. In response to receipt of a request to transfer data from the reorder buffer to the host memory, a next data packet sequence number is fetched from the reorder state cache and a position in the reorder buffer of the data associated with the next data packet sequence number entry is identified. The data is at this identified position is then transferred to the host memory.

1. Technical Field
The present invention generally relates to communication protocols between a host computer and an input/output (I/O) device. More specifically, the present invention provides a method by which data that has taken different paths through a network and, as a result arrives in a different order than which it was sent, can be efficiently reordered at the destination.
2. Description of Related Art
In an Internet Protocol (IP) Network, the software provides a message passing mechanism that can be used to communicate with Input/Output devices, general purpose computers (host), and special purpose computers. The message passing mechanism consists of a transport protocol, an upper level protocol, and an application programming interface. The key standard transport protocols used on IP networks today are the Transmission Control Protocol (TCP) and the User Datagram Protocol (UDP). TCP provides a reliable service and UDP provides an unreliable service. In the future the Stream Control Transmission Protocol (SCTP) will also be used to provide a reliable service. Processes executing on devices or computers access the IP network through Upper Level Protocols, such as Sockets, iSCSI, and Direct Access File System (DAFS).
Unfortunately the TCP/IP software consumes a considerable amount of processor and memory resources. This problem has been covered extensively in the literature (see J. Kay, J. Pasquale, xe2x80x9cProfiling and reducing processing overheads in TCP/IPxe2x80x9d, IEEE/ACM Transactions on Networking, Vol. 4, No. 6, pp. 817-828, Dec. 1996; and D. D. Clark, V. Jacobson, J. Romkey, H. Salwen, xe2x80x9cAn analysis of TCP processing overheadxe2x80x9d, IEEE Communications Magazine, volume: 27, Issue: 6, June 1989, pp. 23-29). In the future the network stack will continue to consume excessive resources for several reasons, including: increased use of networking by applications; use of network security protocols; and the underlying fabric bandwidths are increasing at a higher rate than microprocessor and memory bandwidths. To address this problem the industry is offloading the network stack processing to an IP Suite Offload Engine (IPSOE).
There are two offload approaches being taken in the industry. The first approach uses the existing TCP/IP network stack, without adding any additional protocols. To remove the need for copies, the industry is pursuing two different approaches. One approach consists of adding Framing, Direct Data Placement (DDP), and Remote Direct Memory Access (RDMA) over the TCP and SCTP protocols. The IP Suite Offload Engine (IPSOE) required to support these two approaches is similar, the key difference being that in the second approach the hardware must support the additional protocols.
A second approach involves providing a significant amount of buffering on the network adapter, and having the hardware provide the copy of data received on the network as opposed to copying the data using software. At least for multi-threaded host applications, the hardware based copy operation can eliminate the overhead associated with the copy operation from the host CPU""s. Even without multi-threading, the hardware can handle reordering issues before the CPU reaches the point where the copy operation would be performed, thereby streamlining the copying process. Beyond that, programming API""s that support asynchronous communication can benefit from the copy off-load, even when there is no multi-threading.
For these reasons, and for backward compatibility, having a certain amount of buffering on the network adapter will be desirable for sometime to come. As more connection support DDP and RDMA, the amount of buffering required would presumably decrease. However, higher link bandwidths will offset this trend to some extent. Hence, the need for efficient buffering and reordering of inbound network traffic will remain relevant for a long time to come.
The present invention provides a mechanism for reordering data at a data destination in a higher performance network. The present invention provides dynamic, adaptive management of receive buffers in a host channel adapter while recovering on the fly the order of data sent over a medium that does not preserve order. The present invention operates for a number of important communication mediums, and without requiring searches of any type.
In an exemplary embodiment, the present invention includes a Reorder Memory Access Controller (RMAC) which is a unit that can be implemented for networks that do not support in-order delivery on a connection or virtual lane basis, or which have upper layer protocols that do not require pre-posted host receive buffers. The RMAC buffers incoming data and recovers the transmit order on the fly.
To buffer incoming data the RMAC supports a large reorder buffer, e.g., up to 4 Gigabytes (GB) of Double Data Rate (DDR) Synchronous Dynamic Random Access Memory (SDRAM). Although not strictly required, best performance is achieved if there is also a DDR/quad data rate (QDR) SRAM control store, where state information on buffers allocated to currently active connections is maintained.
RMAC interfaces include several request/response and data ports. A request/response port is provided for a Protocol Engine (PE), through which the PE accesses information required for protocol processing, and to issue RMAC state update commands. The actual transfer of protocol information occurs over another port to an Arrays Interface unit. A request/response port is provided for a Pre-Load Engine (PLE), which directs the RMAC where to place incoming data in the reorder buffer, and to issue RMAC state update commands. A port to the Control Memory Access Controller (CMAC) is provided for the RMAC to retrieve or update state information in control store needed to manage the reorder buffer. In addition, a port is provided for the Direct Memory Access Controller (DMAC) which is used by the DMAC to transfer data from the reorder buffer to host memory. Data coming from the network is staged on chip through a Data Transfer Buffer (DTB), and read from there by the RMAC on a dedicated port.
In an exemplary embodiment, the present invention provides a method and apparatus of reordering data of a data transmission received from a source device. The method and apparatus receives, in a data transfer buffer, a data packet transmitted over a connection associated with the source device and determines if the connection requires reordering of data packets. If the connection requires reordering of data packets, the data packet is transferred from the data transfer buffer to a reorder buffer and a reorder state cache is updated to reflect the transfer of the data packet to the reorder buffer. In response to receipt of a request to transfer data from the reorder buffer to the host memory, a next data packet sequence number is fetched from the reorder state cache and a position in the reorder buffer of the data associated with the next data packet sequence number entry is identified. The data is at this identified position is then transferred to the host memory.
These and other features of the present invention will be described in, or will become apparent to those of ordinary skill in the art in view of, the following detailed description of the preferred embodiments.

Data reordering mechanism for high performance networks

International Business Machines Corporation


An arrangement for determining the magnitudes of selected physical quantities at a multitude of spaced locations includes an elongated optical fiber having a multitude of separate longitudinally spaced Bragg sensing gratings of substantially identical initial periodicity situated at such locations. Light pulses are launched into the core for propagation longitudinally thereof and for return from any of the sensing gratings of a detectable light echo at a central wavelength determined by the instantaneous value of the periodicity of the respective sensing grating that depends on the longitudinal stress applied to such grating as a result of the action of the physical quantity being monitored at the location of such grating. The light echoes are detected and allocated to the respective sensing gratings on the basis of time intervals elapsed between the issuance of the respective light pulses and the arrival of the echoes responsive thereto, and to the respective longitudinal stresses applied to the respective sensing gratings on the basis of the respective wavelengths of the echoes returned from the respective gratings.

There are already known various constructions of sensing arrangements, among them such capable of sensing stresses within a structure. So, for instance, it is known from the commonly owned U.S. Pat. No. 4,806,012, issued on Feb. 21, 1989 and entitled "Distributed, Spatially Resolving Optical Fiber Strain Gauge", to embed in the structure the stresses of which are to be determined an optical fiber containing a plurality of periodic Bragg gratings of different original periodicities and thus each reflecting light in a narrow range around a central wavelength that is determined by the respective periodicity. These gratings are disposed at different regions of the structure so as to be subjected to different stresses, temperatures and strains depending on their locations in the structure, with attendant strain-related changes in their periodicities and hence in their central wavelengths of reflection. During the use of this known sensing arrangement, light is launched into the optical fiber in a such a wavelength range as to embrace the wavelengths of interest with respect to all of the Bragg gratings under all conditions. Then, either the light returned back to the launching end of the fiber is examined for the presence, or that reaching the other end for the absence or diminished intensity, of light around the respective central wavelengths of the gratings as altered by the stresses existing at the respective locations of the structure, thereby to determine the magnitude of such stresses.
The individual Bragg gratings are provided in the optical fiber core, prior to its installation in the structure, by exposing the optical fiber core through the cladding to an interference pattern of two ultraviolet light beams the light frequency and/or orientation of which relative to the optical fiber longitudinal axis is such, for each of the gratings, that the interference pattern maxima and minima extend through the fiber in directions normal to the longitudinal axis and that the periodicity (e.g. the distance between two consecutive maxima) is that desired for the particular grating.
As advantageous as this approach is for use in many applications in which the number of locations along the optical fiber to be monitored for stresses in the structure is relatively small, it has an important drawback in that each of the gratings has to have assigned to it a considerable amount of the available spectrum (i.e. not only its relatively narrow wavelength or frequency band but also the separation from the adjacent wavelength or frequency band assigned to another grating by an amount sufficient to avoid overlapping of or crosstalk between the adjacent channels under all circumstances, that is, even when the central wavelengths of the adjacent channels have moved, as a result of the stresses applied at the locations of the associated gratings, toward one another to the maximum extent), thus severely limiting the number of grating sensors that can be employed within each sensing optical fiber. For example, if a solid state device, such as an edge emitting diode or a laser diode were used as the light source, which would be highly desirable because of the relatively low cost and reliability of such device, it would only cover a wavelength range of 20 to 30 nm. On the other hand, each of the optical strain sensors of the above type would require up to 5 nm of bandwidth to cover 10,000 microstrain, so that only 4 to 6 sensors could be associated with each diode source.
Accordingly, it is a general object of the present invention to avoid the disadvantages of the prior art.
More particularly, it is an object of the present invention to provide a distributed optical fiber Bragg grating sensor arrangement which does not possess the disadvantages of the known arrangements of this kind.
Still another object of the present invention is so to develop the distributed sensor arrangement of the type here under consideration as to significantly increase the number of locations stresses from which data indicative of the quantity being monitored can be reliably collected using a single optical fiber containing a multitude of embedded Bragg gratings.
It is yet another object of the present invention to devise an arrangement of the above type which renders it possible to utilize a relatively inexpensive laser with limited bandwidth as a light source for launching light into the optical fiber for examination of the various Bragg gratings.
A concomitant object of the present invention is to design the sensing arrangement of the above type in such a manner as to be relatively simple in construction, inexpensive to manufacture, easy to use, and yet reliable in operation.

Distributed multiplexed optical fiber Bragg grating sensor arrangeement


The present invention relates to a stereophonic service apparatus, its method of driving, and a computer readable recording medium. The stereophonic sound service apparatus according to an embodiment of the present invention may include the storage unit which matches and stores HRTF data related to a physical characteristic of a user and the sound source environment 3D data related to the sound source environment; and the control unit that extracts an HRTF candidate group from HRTF data stored based on a test result of a user for sound matching and setting at least one of data having a similarity value equal to or higher than a reference value as individualized data for each user.

The sound technology that started in monaural is now evolving from stereo (2D) to stereophonic (3D) technology that sounds as it is actually heard in the field. 3D sound technology has long been used in the film industry. It is also being used as a tool to increase immersion in the field of computers such as in computer games. It is an important factor that multiplies the reality of 3D information included in images and videos.
Stereophonic technology is a technology that allows a listener, located in a space which is not the space where the sound source occurs, to perceive the same senses of direction, distance, and space as in the space where the sound source occurs. Using stereophonic technology, the listener can feel as if he or she is listening in the actual field. Stereophonic technology has been studied for decades to provide the listener with a 3-dimensional sense of space and direction. However, as digital processors have been speeding up, and various sound devices have been dramatically developed in the 21st century, stereophonic technology has been getting more and more popular.
Research on these 3-dimensional audio technologies has been carried out continuously. Among them, researchers have found that processing audio signals using an "individualized head-related transfer function (HRTF)" can play the most realistic audio. In an audio signal processing method using a conventional head-related transfer function, a microphone is put into the ear of a human or a human model (for example, torso), and an audio signal is recorded to obtain an impulse response and, when it is applied to an audio signal, the position of the audio signal in the 3 dimensional space can be sensed. Here, the head-related transfer function represents a transfer function that occurs between a sound source and a human ear, which not only varies according to the azimuth and altitude of the sound source, but also varies depending on physical characteristics such as the human head shape/size, and ear shape. That is, each person has a unique head-related transfer function. However, there is a problem that it is difficult to provide the same 3-dimensional sound effect to those who have different physical characteristics, since, until now, only the head-related transfer function (that is, the HRTF which is not individualized), measured through various kinds of models (for example, a dummy head), has been used for 3 dimensional audio signal processing.
An additional problem is that a user cannot be provided with a realistic 3-dimensional audio signal optimized for that user because the conventional multimedia reproduction system does not have a module that can apply a head-related transfer function to each user's own body to fit the user's body characteristics.

Stereophonic service apparatus, operation method of the device, and computer readable recording medium


A computer apparatus provides control for automatically switching the apparatus between various operating modes requiring varying levels of power consumption. An embedded controller determines whether or not the computer apparatus is in motion (vibration, acceleration, rotation, etc.) on the basis of acceleration information obtained through an accelerometer provided in the computer apparatus. If the computer apparatus is in motion, the embedded controller provides control so as to prevent switching between system operating modes in order to protect certain components of the apparatus from damage which might be caused by switching operating modes while in motion.

1. Field of the Invention
The present invention relates to the control of power modes for computer systems, and more particularly to control for switching between operating modes to protect various devices such as a hard disk drive.
2. Background
One of power saving schemes for a personal computer is switching it between operating states (hereinafter referred to as system operating modes). That is, when the personal computer is not used for a certain amount of time, the unnecessary operation of peripheral devices or internal components that are not employed is suspended to shut off their power needs and thus reduce the power consumption of the system. Such system operating modes typically include modes referred to as standby (suspend) mode and hibernation mode.
FIG. 7 is a schematic diagram of the hardware configuration of a typical personal computer. In FIG. 7, a CPU 701 performs various arithmetical and other operations under the control of a program such as an operating system (not shown). A main memory 702 is an internal storage from or into which data is directly read or written by the CPU 701, and which stores programs for controlling the CPU 701 or data for arithmetical operation. Generally, the main memory 702 is a volatile memory such as DRAM. An HDD 703 is a hard disk unit (Hard Disk Drive) employed as an external storage unit. A monitor 704 is an output unit for displaying the processed results by the CPU 701, and connected to the CPU 701 via a graphics display mechanism having a video memory (not shown). The monitor 704 may be a CRT display or an LCD (Liquid Crystal Display), for example. The personal computer system may include, or be connected to, various other peripheral devices according to the needs and desires of a user (not shown).
Among the system operating modes for power saving, in the standby mode, the power of the HDD 703 and monitor 704 is shut off, and other peripheral devices are placed in a least power consumption operation. However, in order to maintain the data residing in the main memory 702, it is necessary to continue to supply power to the main memory 702.
In contrast, in the hibernation mode, all the information including the contents of the main memory 702 and the contexts of various peripheral devices are written into the HDD 703 and all unnecessary power is shut off. Accordingly, no power is supplied to the main memory 702 while the system is in the hibernation mode. But, even when the power of the system is fully shut off, the system can be restored to its previous state by reading the saved data from the HDD 703 when the system power is next turned on.
In transitioning from any system operating mode to the hibernation mode, it is necessary to write a large amount of data into the HDD 703 in a certain time (20 seconds or more). On the other hand, it takes a much shorter time (usually 5 seconds or less) to transition to the standby mode, which is much simpler due to the lessened need for data transfer. Therefore, it is typical that when the system is not used for a short amount of time, the system transitions to the standby mode, and only when a certain amount of time has passed in the standby mode will the system automatically transition to the hibernation mode. For example, in the Windows® XP operating system from Microsoft Corporation, USA, power management is enabled on the basis of the ACPI (Advanced Configuration and Power Interface). For example, if a "max battery" power scheme is selected in the power options in the control panel, the control is provided such that the system enters the "standby mode" if the system is not employed for two minutes and the system only transitions to the hibernation mode after one hour of non-use. Other settings may be available in this and other operating systems which specify differing timeframes for the transition to each of these and other operating modes which may be available. Systems and operating systems may also be available which offer different or additional operating modes providing for other, varying degrees of power savings.
In controlling a system to transition to the hibernation mode after the elapse of a certain time in the standby mode, the system automatically starts the operation to write data into the HDD when the specified time has passed.
However, in a portable computer such as a notebook personal computer or PDA (Personal Digital Assistant), it sometimes occurs that the computer apparatus is in violent movement such as vibration, acceleration or rotation. If the operation of transitioning to the hybernation mode is started at this time, there is the possibility that the HDD may be damaged, along with other peripherals or components subject to damage if operated while moving. In this case, the worst-case scenario is that the HDD is disabled and the data in the HDD lost.
In particular, it is noted that a user typically takes care not to apply a severe vibration or shock to a computer apparatus under normal use, but a user may treat a computer in the standby mode as if it were in a power OFF state. Therefore, while in standby mode, there is a heightened possibility that the user may be relatively careless in handling the computer apparatus, increasing the chance of damage to the HDD upon transitioning to the hibernation mode.
To avoid some of the above problems and disadvantages, the system may be prepared for hibernation mode when transitioning to the standby mode (see U.S. Pat. No. 5,551,043, for example). That is, in the standby mode, the memory contents are written into the HDD, making the system ready for transitioning to the hibernation mode at any time. And if the conditions such as the elapse of a fixed time and a voltage drop of the battery are met, the power is shut off and the system enters the hibernation mode.
However, using this method, transitioning to the standby mode takes just as much time as entering the hibernation mode, resulting in lower availability of the system.
The same disadvantages may occur when the HDD is automatically accessed, such as when the system not only transitions to the hibernation mode, but also returns from the standby mode or hibernation mode under timer control.
Thus, in the light of the above-mentioned problems, it is an object of the present invention to protect components of a computer apparatus against a physical shock by controlling switching between system operating modes on the basis of the presence or absence of the physical motion of the computer apparatus such as vibration, acceleration and rotation.

Method and apparatus for preventing the transitioning of computer system power modes while the system is in motion

International Business Machines Corporation


An end unit for a fuel cell stack is provided. The end unit includes a main body having a cavity and a substantially impermeable barrier disposed thereon to militate against heat transfer within the end unit and minimize a cost of insulating the end unit. A fuel cell system and a method of fabricating the end unit for use in a fuel cell system are also provided.

A fuel cell has been proposed as a clean, efficient and environmentally responsible power source for electric vehicles and various other applications. Individual fuel cells can be stacked together in series to form a fuel cell stack. The fuel cell stack is capable of supplying electricity sufficient to power a vehicle. In particular, the fuel cell stack has been identified as a potential alternative for the traditional internal-combustion engine used in modern automobiles.
One type of fuel cell is the polymer electrolyte membrane (PEM) fuel cell. The PEM fuel cell includes three basic components: a pair of electrodes, including a cathode and an anode; and an electrolyte membrane. The electrolyte membrane is sandwiched between the electrodes to form a membrane-electrode-assembly (MEA). The MEA is typically disposed between porous diffusion media, such as carbon fiber paper, which facilitates a delivery of reactants such as hydrogen to the anode and oxygen to the cathode. In the electrochemical reaction of the fuel cell, the hydrogen is catalytically oxidized in the anode to generate free protons and electrons. The protons pass through the electrolyte to the cathode. The electrons from the anode cannot pass through the electrolyte membrane, and are instead directed to the cathode through an electrical load, such as an electric motor. The protons react with the oxygen and the electrons in the cathode to generate water.
The fuel cell stack including a plurality of individual fuel cells may be disposed adjacent an end unit. The end unit may include a plurality of main bodies secured together through the use of any conventional method such as fastening or adhesion. Alternately, the end unit may include a single main body. The main body may house fuel cell subsystems and related devices that aid in the preconditioning and operation of the fuel cell stack. As nonlimiting examples, the fuel cell subsystems and related devices housed within the main body can include end plates, fluid passages, e.g. hydrogen fuel and oxidant (O2/air) passages, coolant pumps, recirculation pumps, drainage valves, fans, compressors, valves, electrical connections, reformers, humidifiers, water vapor transfer units, heat exchangers, and related instrumentation. It should be recognized that additional fuel cell subsystems and related devices used in support of the fuel cell system can also be housed in the main body.
The fuel cell subsystems and related devices housed within the main body may contain a plurality of cavities within the fuel cell subsystems and related devices. The cavities may be a result of manufacturing processes, weight reduction, or a desired arrangement of the fuel cell subsystems and devices. While the cavities greatly decrease the thermal mass of the end unit, the cavities significantly increase an internal surface area of the end unit, promoting excessive heat transfer around and between the fuel cell subsystems and related devices within the end unit. Excessive heat transfer to an operating environment of the end unit may also occur. Excessive heat transfer occurs when an external surface area of the end unit is at a higher temperature than the operating environment. A vehicle compartment is a nonlimiting example of the operating environment. Heat transfer may result in the loss of large amounts of heat energy from the end unit. When the end unit is at a temperature below an optimal starting temperature for a fuel cell stack, heat energy lost to the thermal mass of the end unit may increase the time required for the fuel cell stack to reach a full operating potential.
Insulating the end units of the fuel cell stack is known as a method of reducing energy losses. Insulating wraps have been used to insulate the fuel cell stack end unit. While effective at militating against excessive heat energy loss, the insulating wraps are not without disadvantages.
The insulating wraps added to the end unit of the fuel cell stack increase an overall size of the end unit. The fuel cell stack having a compact size is a desired quality, and in vehicle applications, space is at a premium. A method of insulating the end unit of the fuel cell stack without increasing the overall size of the end unit nay be very desirable to a vehicle manufacturer.
The fuel cell stack may require maintenance with repeated use. For the maintenance to be conducted, the fuel cell stack may need to be disassembled to provide access to the individual fuel cells or the fuel cell subsystems and related devices. Prior to end unit removal, the insulating wraps may need to be removed. The insulating wraps, which may be fragile and prone to excessive wear, may fragment with repeated removal and application. An insulation for the end unit of the fuel cell stack that does not need to be removed provides for faster and less costly repairs of the fuel cell stack.
The insulating wraps added to the end unit of the fuel cell stack do not militate against heat transfer within the end unit. A first portion of the cavities may be located on a first mating surface of the main body. The main body may be disposed against a second mating surface of another one of the main bodies, having a second portion of the cavities. The first portion and the second portion of the cavities may overlap when the main bodies are disposed against each other. An overlap of the cavities allow heat transfer from one of the main bodies to another one of the main bodies. Heat transfer during one of operation, startup, and restart of the fuel cell stack may result in a decrease in the efficiency of the fuel cell stack or an increase in time required for the fuel cell stack to reach the full operating potential. An insulation for the fuel cell stack that militates against heat transfer within the end unit may be desirable to increase the efficiency of the fuel cell stack and to decrease starting time
The insulating wraps added to the end unit of the fuel cell stack increase a manufacturing cost of the fuel cell stack and a vehicle into which the fuel cell stack is incorporated. The insulating wraps consume valuable space in vehicle applications. Additionally, a cost of manufacturing and shipping the insulating wraps is high when compared to the benefit the insulating wraps provide. A cost effective insulation may provide a desirable solution to an excessive cost of manufacturing and incorporating the insulating wraps.
There is a continuing need for an insulation for the end unit of the fuel cell stack that is compact and does not need to be removed for fuel cell stack repair. Desirably, insulation for the end unit of the fuel cell stack may also militate against heat transfer within the end unit and reduce the cost of insulating the end unit of the fuel cell stack.

Low cost thermal insulation for a fuel cell stack integrated end unit


A polymer endoprosthesis is fabricated by a combination of injection molding and blow molding which form a tubular substrate of polymer material, followed by laser cutting, crimping and sterilization. After the injection and blow molding processes, a subtractive process is performed on the tubular substrate to transform it into a stent having a network of stent struts. The tubular substrate can be made in an injection mold and blow mold which are attached to each other. The transition from injection molding and blow molding can be performed while the injection molded substrate remains at a temperature at or above Tg of the polymer material.

An endoprosthesis is an artificial device that is placed inside a human or animal body. An anatomical lumen is a cavity of a tubular organ such as a blood vessel. Stents are generally cylindrically shaped devices, which function to hold open and sometimes expand a segment of a blood vessel or other anatomical lumen such as urinary tracts and bile ducts. Stents are often used in the treatment of atherosclerotic stenosis in blood vessels. In such treatments, stents reinforce blood vessels and prevent restenosis following angioplasty in the vascular system.
Stents are relatively small, as they are often required to be passed through tight confines of anatomical lumens. A stent must often have great longitudinal flexibility to allow it to pass through tortuous curves of anatomical lumens. Stents typically comprise a fine network of struts which form a tubular scaffold. The tubular scaffold must often be capable of being crimped onto a delivery device, such as a balloon, to reduce its size to allow passage through anatomical lumens, and then forcibly expanded by the balloon to an enlarged, deployed state at the desired location within the body. For some stents, the tubular scaffold must be capable of self-expanding from its crimped state at the desired location within the body. After implantation and deployment, the tubular scaffold must have sufficient strength to support surrounding anatomical structures. Thus it will be appreciated that stents present unique design challenges.
Stents have in the past been made of metals, such as nickel-titanium alloys having shape memory and superelastic properties. The advent of polymer stents have presented further design challenges. The design of a polymer stent must take into account that, as compared to metal stents of the same dimensions, polymer stents typically have less radial strength and rigidity and less fracture toughness. Thus, there is a continuing need for a method and system for manufacturing polymer stents that (a) increase uniformity from stent to stent, (b) allow for tight control of design parameters, such as the thickness and dimension of individual stent struts, and/or (c) increase manufacturing efficiency.

Method and system for manufacturing a polymer endoprosthesis by injection molding and blow molding


Various systems and methods are described for analyzing multiple money transfer routing schemes. Each of these multiple money transfer routing schemes may comprise a route to transmit funds from the source for the money transfer transaction to the destination for the money transfer transaction. An internal money transfer routing scheme may refer to a money transfer routing scheme that utilizes a direct money transfer arrangement between the destination of the money transfer transaction and the money transfer network. An external money transfer routing scheme may refer to a money transfer routing scheme that utilizes at least one third party money transfer network between the destination of the money transfer transaction and the money transfer network. The multiple money transfer routing schemes may be analyzed and the preferable money transfer routing scheme at least partially based on the predefined criterion from among the multiple money transfer routing schemes may be identified.

It may be possible to transmit money to an account held at a financial institution from some other financial institution whether or not the two financial institutions have a pre-existing relationship. If the financial institutions do not have a pre-existing relationship (or have only a limited pre-existing relationship), the funds may be transmitted via a third-party financial network. If the financial institutions do have a pre-existing relationship, it may be possible to transmit the funds directly between the financial institutions.


A magnetic flowmeter system provides a volumetric flow rate output and has a coil receiving a magnetic field producing coil current from the current supply circuitry. The current supply circuitry includes an H-bridge transistor circuit having first and second switches which couple one of the first and second coil wires to a supply conductor. Third and fourth switches of the bridge circuit couple the other of the first and second coil wires to a second supply conductor. A control circuit periodically alternates conduction of the first, second, third and fourth switches to reverse the polarity of the coil current. A coil current control circuit generates a non-alternating output representing the sensed alternating coil current amplitude. The control circuit modulates the conduction duty cycle of the third and fourth switches as a function of the non-alternating output to regulate the coil current amplitude to a selected level.

The present invention relates generally to magnetic flowmeters. More specifically, the present invention relates to an improved H-bridge constant current driver design for a magnetic flowmeter.
A magnetic flowmeter measures the volumetric flow rate of a conductive fluid by detecting the velocity of the fluid passing through a magnetic field. Magnetic flowmeter systems typically include a flowtube assembly and a transmitter assembly. The flowtube assembly is installed in a process piping line, either vertically or horizontally, and includes a pipe section, a coil section, and electrodes. The coils are located on opposite sides of a cross section of the pipe. The coils, energized by a coil drive current from the transmitter, develop a magnetic field along the cross-section of the pipe. Two electrodes are located across the pipe from each other along a line which is perpendicular to the magnetic field. Fluid passing through the pipe is electrically conductive. As a result of the conductor movement through the magnetic field, an electric potential or electromotive force (EMF) is induced in the fluid which is detected by the electrodes. Operation is thus based on Faraday's law of electromagnetic induction.
Magnetic flowmeters are often used in applications where mixtures run through the flowtube. For example, in the paper industry, pulp, various chemicals and water run through the flowtube. In applications such as this, as the consistency of the fluid moving through the flowtube increases from a nominal value of 3% or 4% to a higher consistency of 10% to 15%, the paper pulp moving through the tube causes process noise to increase. As process noise increases, the signal-to-noise ratio decreases, which decreases the accuracy of the magnetic flowmeter output. To reduce the effects of process noise, attempts have been made to increase the magnetic field strength by increasing the coil drive current, which correspondingly increases the EMF induced in the fluid. Increasing the EMF induced in the fluid results in an increased signal-to-noise ratio and measurement accuracy.
Because the power dissipated in the magnetic flowmeter current driver and flowtube coils depends on the square of the current produced by the current driver, improving the signal-to-noise ratio by increasing the current results in substantially increased power dissipation. The increased power dissipation is a difficult design limitation. Therefore, an energy efficient AC current driver is needed to drive the flowtube coils at the increased current level.

Bridge pulse controlled constant current driver for magnetic flowmeter


The present invention provides a method for producing a unilocular adipocyte including inducing differentiation into unilocular adipocytes of mesenchymal cells having differentiation potency into adipocytes by culturing the mesenchymal cells in suspension in a liquid medium composition capable of culturing cells or tissues in suspension, wherein the liquid medium composition contains a polymer compound having an anionic functional group that binds via a divalent metal cation to form a structure capable of suspending cells or tissues, and the method wherein the polymer compound is polysaccharide, preferably polysaccharide containing a glucuronic acid moiety, more preferably deacylated gellan gum, diutan gum or xanthan gum or a salt thereof.

In recent years, in the field of life sciences, research of culturing pluripotent stem cells such as iPS cells and ES cells, mesenchymal stem cells and the like to induce differentiation into organ cells of interest and transplanting the obtained cells has been actively performed. Transplantation of adipocytes has also been studied. Transplantation of adipocytes has been studied in various ways, such as breast re-formation after breast cancer treatment, reduction of wrinkles for beauty care, and the like. Recently, studies have also begun on a method for incorporating a gene vector capable of producing a normal gene product into a precursor-adipocyte and transplanting same to gene mutated patients as a gene therapy. As the background, there are advantages that the transplantation of adipocytes is less likely to cause cancer because the adipocytes themselves have low proliferation potential as compared to pluripotent stem cells such as iPS cell, ES cell and the like, and transplantation surgery is easily performed since adipocytes are transplanted subcutaneously. Therefore, the hurdle for adipocyte transplantation is considered to be lower than that for other cell therapies.
On the other hand, it has been drawing attention from the recent studies that adipocytes not only contain a large amount of lipids such as triglyceride and the like but also have a role as an endocrine organ important for the body. For example, leptin that suppresses appetite, adiponectin that has an anti-diabetic action, TNF-alpha that controls inflammation and the like can be recited as examples of factors secreted by adipocytes. Therefore, adipocytes are often used for researches on metabolic syndrome, drug discovery studies for diabetes and lipids, development of health foods and the like. Recently, the studies of not only white adipocytes that store lipids, but also beige adipocytes that efficiently convert excess nutrients in the body into heat by production of heat by the adipocytes themselves are attracting attention. Beige adipocytes are considered to exist in the body due to changes from white adipocytes or differentiation from precursors-adipocyte. Researches on the beige adipocytes have recently been receiving particular attention, and researches on medicaments and health foods that promote induction of differentiation into beige adipocytes have been actively performed. Furthermore, attempts have been studied to treat metabolic diseases such as diabetes and obesity by industrially producing the beige adipocytes and using same for transplantation treatments.
In such a case, adipocytes that have been experimentally used so far have been produced by a method including culturing human adipocyte precursors and 3T3-L1 cells in a monolayer in a petri dish or a plate, changing the medium to a differentiation induction medium, and further culturing the cells to cause differentiation into adipocyte-like cells. The cells differentiated by this method are in a state of being attached to a petri dish or a plate and show a spindle-like shape. They also show a multilocular morphology in which many small lipid droplets accumulate in the cells. On the other hand, the adipocytes separated from the body have a spherical shape, are unilocular containing one large lipid droplet in single cell, and have the property of floating in a medium. Therefore, adipocytes differentiated in vitro and adipocytes derived from the body are clearly different in various points, which form a major obstacle to the development of the above-mentioned researches.
Furthermore, this limitation in monolayer culture inhibits not only the preparation of white adipocytes like those in the body but also the preparation, research and production of beige adipocytes.
The present inventors have successfully developed a medium composition capable of culturing cells and tissues while keeping the suspended state, without substantially increasing the viscosity of the liquid medium (patent documents 1, 2). In addition, a production method of erythrocytes using the medium composition (patent document 3), a culture method of vascular smooth muscle cells (patent document 4), a method of producing tumor-bearing mammalian model (patent document 5), a method of coculturing cancer cells and cells surrounding the cancer cells (patent document 6) and the like have been reported. Furthermore, a medium composition with improved cell recovery has been reported (patent document 7).

Method for inducing differentiation into and producing beige and white adipocytes


This invention relates to a chemical composition for chemical mechanical polishing (CMP) of substrates that are widely used in the semiconductor industry. The inventive chemical composition contains additives that are capable of improving consistency of the polishing performance and extending the lifetime of a polishing pad.

Chemical mechanical polishing (CMP—also referred to as chemical mechanical planarization or chemical mechanical etching) is a well-known technology used in fabricating advanced photonic, microelectromechanical (MEM), and microelectronic devices, such as semiconductor wafers. See e.g. Chemical-Mechanical Processing (Springer Series in Materials Science), Michael R. Oliver, Springer Publ., (Mar. 24, 2006); Microchip Fabrication, Peter Van Zant, McGraw-Hill (2004); Chemical Mechanical Polishing in Silicon Processing, Volume 63 (Semiconductors and Semimetals), Eds. Shin Hwa Li and Robert O. Miller, Academic Press (1999); Chemical Mechanical Planarization of Microelectronic Materials, Steigerwald et al., John Wiley & Sons (1997).
In the field of semiconductor fabrication, chemical mechanical polishing is used to planarize metal and/or oxide substrates. CMP uses both chemical and mechanical action to obtain the desired planarity of the surface to be polished. Chemical action is provided by a mixture of chemicals which is termed as "slurry" usually consisting of abrasives and various additive compounds which include family of chelating agents, passivating agents, oxidizing agents, accelerators etc., Mechanical action is provided by pressing to-be-polished substrate onto the surface of a polishing pad adhered to a moving platen. Movement of platen is typically linear, rotational or orbital.
In a typical chemical mechanical polishing process, a rotating wafer holder brings the wafer to be in contact with a polishing pad or CMP pad. One of the key consumables in conventional CMP processes is the CMP pad or polishing pad. The CMP pad is mounted on a rotating platen. A polishing medium, such as an abrasive slurry, is applied between the wafer and the pad.
Suitable polishing pads made of polymer which include, but not limited to polyvinyl chloride, polyvinyl fluoride, nylon, fluorocarbon, polycarbonate, polyester, polyacrylate, polyether, polyethylene, polyamide, polyurethane, polystyrene, polypropylene, conformed products thereof, and mixtures thereof.
The useable lifetime of the polishing pad is typically determined by observing detrimental decrease in the removal rate (RR), increase in non-uniformity, and/or an increase in surface defects. The deterioration of the pad performance can be traced to a wide range of physical changes in pad such as significant reduction in pad groove depth, porosity, modulus strength, etc. The sources of these physical changes are usually attributed to mechanical stress such as polishing down force, conditioning, temperature, etc.
In addition, the performance decrease over the course of time of polishing can be attributed to an effect called glazing. The pad glazing is often a result of pad debris covering the asperities and pores of the pad thereby leading to a lower material removal rate. These aspects of the physical change have been well documented and studied. See for example, Chen et al., Operational aspects of chemical mechanical polishing, Journal of The Electrochemical Society, 147 (10) 3922-3930 (2000); Ul-hasan et al., Spectroscopic and topographic investigations of nanoparticle abrasive retention in polyurethane CMP pads for Cu CMP, Mater. Res. Soc. Symp. Proc. Vol. 991 (2007); Tregub et al., Pad degradation during CMP process: Effect of soak in slurry and water on thermal and mechanical properties of the CMP pads, Mater. Res. Soc. Symp. Proc. Vol. 767 (2003); Moy et al., Polyurethane pad degradation and wear due to tungsten and oxide CMP, Mater. Res. Soc. Symp. Proc. Vol. 671 (2001).
Other factors that could significantly alter the physical changes of the pad include chemical reactions such as hydrolysis and oxidation. There has been much less documentation in the art which addresses this aspect of changes in pad lifetime.
Specifically, a CMP slurry can interact with the polishing pad surface and cause chemical reactions within. For example, under extreme acidic and alkaline conditions, —COC— and —COOC— groups in polyurethane elastomers can hydrolyze over time at an accelerated rate. A chemical change in pad materials may lead to a significant alteration of pad surface properties such as surface tension or hydrophibicity, which in turn may lead to enhanced or suppressed removal rates based on its surface property of the pad. A chemical alteration at this level cannot be easily remediated by physical means such as pad conditioning.
As such, a problem remains in the art with respect to maintaining sufficient lifetime for polishing pads and also for maintaining adequate removal rates and selectivity during the lifetime of the polishing pad.
Surprisingly, these problems in the art can be overcome with the addition of environmentally benign agents that provide a buffer mechanism to reduce the impact of the chemical attacks on the polishing pads. More specifically, as disclosed by this invention, a set of hydrophobic amino acids is found to be effective in reducing the effect of chemical attack by strong acids on polishing pads.

Chemical mechanical polishing (CMP) polishing solution with enhanced performance


A light emitting diode (LED) device may include an LED die having a first surface on a substrate. A first phosphor layer may be formed on a second surface and sides of the LED die. The second surface may be opposite the first surface. A second phosphor layer may be formed on the first phosphor layer. The second phosphor layer may have a peak emission wavelength (Lpk2) located between a peak emission wavelength of the LED die (LpkD) and a peak emission wavelength of the first phosphor layer (Lpk2).

Phosphor converted white LED light emitting diode (LED) devices typically use a blue LED that is covered with a layer of luminescent materials that partially absorb the blue LED light and emit green, yellow, and red light. The luminescent materials typically contain a mixed powder of inorganic materials. For high color quality, defined by the Commission on Illumination (CIE) as color rendering indices (CRI), the spectral power distribution (SPD) of light emitted from the LED has to follow closely the SPD of a white reference light. If the light emitted from the LED is used in combination with camera systems (e.g., as a flash), it may be particularly important to avoid sharp peeks and minima in the SPD.

Phosphor converted LED with high color quality


Electroplating methods and systems employing ultrasonic energy to enhance electroplating processes. The electroplating methods involve sweeping a plating surface with ultrasonic energy having an area of maximum ultrasonic energy density while simultaneously performing electroplating. The systems include movement apparatus providing relative movement between an ultrasonic energy source and a cathode while the ultrasonic energy source and the cathode are located within a plating tank.

The present invention relates to the field of electroplating. More particularly, the present invention provides ultrasonically-enhanced electroplating apparatus and methods.
Plating a deep hole, channel, or other high aspect ratio structures, can pose challenging problems. During the plating of high aspect ratio structures, both mass transfer and electrochemical processes may be unfavorable, particularly at the deepest points in the structures. For example, it may be difficult for the bubbles generated during plating to be released from the high aspect ratio structures; metal ions may be depleted rapidly inside the structure and not be replenished properly; and undesirable decomposition products may not be easy to remove from the vicinity of the cathode. Further, the plating process tends to deposit thicker on the mouths of holes or the upper edges of channels, which can have a more significant impact on high aspect ratio plating. All these factors can introduce defects into the plating process.
Various methods have been developed for the high aspect ratio plating. In some LIGA (Lithographie, Galvanoformung and Abformung) processes, high aspect ratio structures have been plated with conventional plating process but with slower plating rate. The plating is usually on relatively small substrates, such as wafers. It is well recognized that traditional plating is both troublesome and time consuming. Plating of a high aspect ratio structure was conducted with a special designed instrument (Ariel G. Schrodt and Nick N. Issaev, xe2x80x9cEnhanced Microelectroforming Technology and Development of an Automated Microelectroforming Workstation,xe2x80x9d HARMST ""97 Worldwide LIGA Forum, June, 1997, Madison, Wis., Book of Abstracts). In this method, the part is plated while applying vacuum and thermal gradients. The plating can reach a high speed but can only plate small format with expensive instrument. Another approach to plating high aspect ratio structures involves pulse plating for filling recess of not more than about 1 micron in depth and width (U.S. Pat. No. 5,705,230).
Ultrasonic energy has been used in plating processes, most often as a cleaning aid. U.S. Pat. No. 5,705,230 does, however, use ultrasonic energy while plating a shallow recess. U.S. Pat. No. 4,842,699 describes using ultrasonic energy during via-hole plating to ensure sufficient electrolyte transport in the via-hole. U.S. Pat. No. 5,695,621 discloses the use of a resonating electroplating anode when plating inner surfaces of steam generator tubing. GB 2 313 605 discloses a chromium plating process employing ultrasonic energy to encourage release of bubbles. JP 1 294 888 A describes placing an ultrasonic vibrator inside of a cup for promoting gas bubble release. JP 51138538 discloses plating of a printed circuit board while using ultrasonic energy.
Although ultrasonic energy can enhance the mass transfer and removal of gas bubbles during plating, it can also have negative impacts on plating. In an electroforming process, inappropriate exposure to ultrasonic energy during electroforming can increase the residual stresses in the electroformed parts. The use of ultrasonic energy during electroplating can also cause adhesion problems between the deposited material and substrate, especially when a polymer or other non-conductive substrate is used.
Most electroplating processes are performed in plating tanks containing an electroplating bath. Another problem with the use of ultrasonic energy in a plating tank is that the energy distribution within the tank, especially on the cathode, is not uniform. The ultrasonic transducers are mounted in fixed locations on the side or bottom of the plating tanks, resulting with uneven ultrasonic energy distribution over the cathode because the ultrasonic energy is attenuated with distance. This problem becomes more acute when plating large surfaces because of the increased variations in energy distribution over the surface of the larger parts.
The present invention provides electroplating methods and systems employing ultrasonic energy to enhance electroplating processes. The electroplating methods involve locating an ultrasonic energy source between the anode and the cathode and sweeping a plating surface with ultrasonic energy having an area of maximum ultrasonic energy density. As a result, each portion of the plating surface receives varying amounts of ultrasonic energy during electroplating, with the maximum ultrasonic energy density being received intermittently by the plating surface.
The apparatus and methods of the present invention may provide particular advantages where the plating surface includes one or move cavities in which electroplating is desired. If the cavities, either holes formed through the cathode or wells formed in a surface of the cathode, have a relatively high aspect ratio, it may be difficult to electroplate the surfaces within the cavities. In some situations, the propagation axis of the ultrasonic energy (i.e., the direction of travel of the ultrasonic energy) may be aligned with the cavities such that the ultrasonic energy reaches throughout the cavities, thereby enhancing plating in the innermost portions of the cavities.
Another potential advantage of the methods and systems of the present invention is a reduction in the amount of ultrasonic energy needed to enhance electroplating. The amount of ultrasonic energy may be reduced because each part of the plating surface is intermittently exposed to the maximum ultrasonic energy density as the ultrasonic energy is swept across the plating surface.
Still another advantage of the present invention is that sweeping of the ultrasonic energy across the plating surface may reduce the problems associated with the use of ultrasonic energy during plating as discussed in the background, e.g., residual stresses, adhesion problems, etc. In addition, the sweeping nature of the ultrasonic energy may improve uniformity in the plated material.
A further advantage of the methods and systems of the present invention is that the ultrasonic energy impinges directly on the plating surface while movement of the ultrasonic energy source reduces or prevents problems associated with shielding or masking that can be caused by locating structures between the anode and the cathode. In those systems in which an ultrasonic energy source is moved between the anode and cathode during electroplating, the intermittent shielding of the cathode by the moving ultrasonic energy source may provide electroplating advantages similar to pulse plating processes (where the current density is intentionally varied).
Although the present invention may provide particular advantages when used in electroforming on high aspect ratio cavities, it may also be advantageous when used in connection with electroplating on any surface, whether or not that surface includes high aspect ratio cavities. Unless explicitly stated otherwise, the present invention is not to be limited to methods and/or systems for electroforming on high aspect ratio cavities.
In one aspect, the present invention provides an electroplating method that includes providing a tank containing a plating solution; providing an anode and a cathode within the plating solution, wherein the cathode has a plating surface; locating an ultrasonic energy source directly between the anode and the plating surface of the cathode; plating the plating surface of the cathode; and sweeping the plating surface with ultrasonic energy emitted by the ultrasonic energy source during the plating, wherein the sweeping includes moving an area of maximum ultrasonic energy density across the plating surface.
In another aspect, the present invention provides a method electroplating that includes providing a tank containing a plating solution; providing an anode and a cathode within the plating solution, wherein the cathode has a plating surface that includes a plurality of cavities, wherein each cavity of the plurality of cavities has a central axis and an aspect ratio of at least about 1:1 or higher; plating the plating surface of the cathode; locating an ultrasonic energy source directly between the anode and the plating surface of the cathode, wherein ultrasonic energy emitted by the ultrasonic energy source has a propagation axis; and sweeping the plating surface with ultrasonic energy emitted from the ultrasonic energy source during the plating.
The sweeping includes moving an area of maximum ultrasonic energy density across the plating surface with an area of maximum ultrasonic energy density; moving the plating surface and the ultrasonic energy source relative to each other while emitting ultrasonic energy from the ultrasonic energy source; and aligning the propagation axis of the ultrasonic energy with the central axis of each cavity of the plurality of cavities.
In another aspect, the present invention provides an electroplating apparatus with a tank having a tank volume; an anode located within the tank volume; a cathode located within the tank volume, wherein the cathode includes a plating surface; an ultrasonic energy source located within the tank volume, the ultrasonic energy source located directly between the anode and the cathode and oriented to emit ultrasonic energy at the plating surface; and movement apparatus providing relative movement between the ultrasonic energy source and the cathode while the ultrasonic energy source and the cathode are located within the tank volume.
These and other features and advantages of the present invention may be described below in connection with various illustrative embodiments of the methods and systems of the present invention.

Ultrasonically-enhanced electroplating apparatus and methods


Briefly described, embodiments of this disclosure include perylenetetracarboxylic diimide charge-transport materials, methods of forming perylenetetracarboxylic diimide charge-transport materials, and methods of using the perylenetetracarboxylic diimide charge-transport materials.

Charge-transport molecular and polymeric materials are semiconducting materials in which charges can migrate under the influence of an electric field. These charges may be present due to doping with oxidizing or reducing agents, so that some fraction of the transport molecules or polymer repeat units is present as radical cations or anions. More usually, charges are introduced by injection from another material under the influence of an electric field. Charge-transport materials may be classified into hole- and electron-transport materials. In a hole-transport material, electrons are removed, either by doping or injection, from a filled manifold of orbitals to give positively charged molecules or polymer repeat units. Transport takes place by electron-transfer between a molecule or polymer repeat unit and the corresponding radical cation; this can be regarded as movement of a positive charge (hole) in the opposite direction to this electronic motion. In an electron-transport material, extra electrons are added, either by doping or injection; here the transport process includes electron-transfer from the radical anion of a molecule or polymer repeat unit to the corresponding neutral species. In addition, some material—ambi-polar materials—may transport both holes and electrons.

Perylene charge-transport materials, methods of fabrication thereof, and methods of use thereof


A system creates an electronic version of a document from page-images of the document, wherein the electronic version replicates both the logical content and the physical appearance of the original document. During operation, the system receives the page-images for the document. Next, the system extracts character images from the page-images, and generates a synthetic font for the document from the extracted character images. Finally, the system constructs the electronic version of the document by, using the synthetic font to represent text regions of the document, and by using image-segments extracted from the pages-images to represent non-text regions of the document.

1. Field of the Invention
The present invention relates to methods for representing documents within a computer system. More specifically, the present invention relates to a method and an apparatus for generating a synthetic font to facilitate creation of an electronic document from scanned page-images, wherein the resulting electronic document reproduces both the logical content and the physical appearance of the original document.
2. Related Art
As businesses and other organizations become increasingly more computerized, they are beginning to store and maintain electronic versions of paper documents on computer systems. The process of storing paper documents on a computer system typically involves a "document imaging" process, which converts the paper documents into electronic documents. This document imaging process typically begins with an imaging step, wherein document page-images are generated using a scanner, a copier, or a camera. These page-images are typically analyzed and enhanced using a computer program before being assembled into a document container, such as an Adobe® Portable Document Format (PDF) file.
A number of formats are presently used for document imaging. These formats include: (1) plain image, (2) searchable image (SI), and (3) formatted text and graphics (FT&G). The "plain-image" format provides a bitmap representation of the image, which is quite useful for archival applications, such as check processing.
The searchable image (SI) format uses scanned images for document display (e.g., in a document viewer), and uses invisible text derived from the scanned images for document search and retrieval. There are two common flavors of searchable image: (1) SI (exact); and SI (compact). SI (exact) maintains a bit-for-bit copy of the scanned pages, whereas SI (compact) applies lossy compression to the original page-images to produce smaller but nearly identical "perceptually lossless" page-images for document display.
Formatted text and graphics (FT&G) uses, formatted text, graphical lines, and placed images to construct representations of the original page-images. FT&G can be "uncorrected," which means it includes suspects (word images+hidden text) in place of formatted text for low-confidence optical character recognition (OCR) results. Alternatively, FT&G can be "corrected" by manually converting suspects to formatted text. (Note that the term "OCR" refers to the process of programmatically converting scanned blobs into corresponding ASCII characters.)
When determining which document imaging format to use, a user typically considers a number of attributes of interest. For example, the attributes of interest can include the following:                (1) Display fidelity—Does the display version of the electronic document look exactly like the original scan?        (2) Display quality—Is the display version of the electronic document easy to read?        (3) Display performance—Does poor display performance (e.g., page display speed) detract from viewer satisfaction?        (4) Searchability—Can relevant text be found within a document collection and within individual documents?        (5) Production cost—How much does the document imaging process cost        (both in equipment cost and manual labor)?        (6) Reflow—Will document reflow be possible to enable viewing on mobile device?        (7) Accessibility—Is the document accessible by vision-impaired users?        (8) File size—How big is the file (smaller is better)?
With respect to these attributes, the above-described image formats generally perform as follows:                (1) Display fidelity—SI (exact) is best; SI (compact) is OK; FT&G (corrected) is good; FT&G (uncorrected) is fair.        (2) Display quality—FT&G (corrected) is best; FT&G (uncorrected) is good; SI formats are poor.        (3) Display performance—FT&G formats are best; SI formats are fair.        (4) Searchability—FT&G (corrected) is best; others are good.        (5) Production cost—FT&G (uncorrected) and SI formats are best (i.e., cheapest); FT&G (corrected) is worst.        (6) Reflow—FT&G (corrected) is best; FT&G (uncorrected) is fair; SI formats are worst (i.e., not reflowable).        (7) Accessibility—FT&G (corrected) is best; FT&G (uncorrected) is poor; SI formats are worst (i.e., not accessible).        (8) File size—FT&G (corrected) is best (i.e., smallest); FT&G (uncorrected) is good; SI (compact) is fair; SI (exact) is poor.
As can be seen from the list above, each of these document imaging formats has unique advantages compared to the other formats. Hence, when a user has to choose one of the document imaging formats, the user typically has to forego advantages that the user would like to have from the other formats.
Hence, what is needed is a method and an apparatus for obtaining the advantages of all of the existing document imaging formats within a single document imaging format.

Reconstructing high-fidelity electronic documents from images via generation of synthetic fonts