When an electrode component is inserted into a through hole from one side and then rotated, parts of a conductive film are cut by a cutting blade. Another electrode component including a chip component whose one terminal is connected to an electrode of this electrode component is inserted into the through hole from the other side. When compression bonding is applied to the both electrode components so as to be joined together, an electrode of the former electrode component and the electrode of the latter electrode component are spread within the through hole with the pressure. The spread electrode of the former electrode component contacts a portion of the conductive film that is electrically connected to a front surface wiring, and the spread electrode of the latter electrode component contacts another portion of the conductive film that is electrically connected to a back surface wiring.

1. Field of the Invention
The present invention relates to a through hole insertion type electronic component which is to be inserted into a through hole of a printed wiring board, and to a method of packaging the same.
2. Description of the Related Art
As one method of high density packaging, a method of inserting a component ink a through hole of a circuit board having printed wirings formed on both surfaces thereof, is disclosed in Unexamined Japanese Patent Application KOKAI Publication No. S63-119213.
The packaging method disclosed in this publication will be explained below with reference to FIGS. 12A to 12C.
As illustrated in a cross section in FIG. 12A, a chip component 54 is placed in a through hole 53 of a wiring board 51. An upper electrode 55 and lower electrode 56 of the chip component 54 are made of an elastic material having conductivity, and respectively have radial connector terminals 58 and 59 as shown in plan views in FIG. 12B and FIG. 12C.
The radial connector terminal 58 of the upper electrode 55 is electrically connected to a conductive pattern 52 formed on one surface of the wiring board 51, by solder dip 57. The radial connector terminal 59 of the lower electrode 56 is electrically connected to the conductive pattern 52 formed on the other surface of the wiring board 51, by the solder dip 57. The chip component 54 is held in the through hole by the elasticity of the upper electrode 55 and the lower electrode 56.
The above conventional packaging technique has the following problems.
(1) The radial connector terminals 58 and 59 of the electrodes of the chip component 54 need to be connected to the conductive pattern 52 of the double side multi-layer wiring board by solder. However, it is difficult to connect the elastic radial connector terminals 58 and 59 to the conductive pattern 52 of the wiring board 51 by solder. Thus, a lot of time and efforts are required in the soldering process.
(2) A chip component having two electrodes can be packaged with ease, However, packaging of a chip component having three electrodes is structurally difficult.
The present invention has been made in consideration of the problems of the prior art, and an object of the present invention is to provide a through hole insertion type electronic component which is easy to package, and a method of packaging the same.
Another object of the present invention is to provide a through hole insertion type electronic component suitable for high density packaging with the use of an electronic component having three or more electrodes, and a method of packaging the same.
To solve the above described problems, a through hole insertion type electronic component according to a first aspect of the present invention is an electronic component to be inserted into a through hole of a multi-layer wiring board which comprises: the through hole; a through hole conductive film formed on an internal surface of the through hole; and n (n is an integer equal to or greater than 2) number of wiring patterns which are provided on different layers and connected to the through hole conductive film, the electronic component comprising:
n number of electrodes each of which is to be connected to a corresponding one of n number of electrodes of a chip component which is arranged in the through hole, and each of which contacts a corresponding position of the through hole conductive film; and
at least one blade which separates the through hole conductive film into n number of portions each of which is connected to a corresponding one of the n number of wiring patterns and to a corresponding one of the n number of electrodes.
The integer n may represent 2.
The electronic component may comprise: a first electrode component to be packaged on one surface of the multi-layer wiring board; and a second electrode component to be packaged on the other surface of the multi-layer wiring board.
The n number of electrodes may include; a first electrode which is provided to the first electrode component, and is electrically connected to a first electrode of the chip component arranged in the through hole and also contacts the through hole conductive film so as to electrically connect the first electrode of the chip component and the through hole conductive film to each other; and a second electrode which is provided to the second electrode component, and is electrically connected to a second electrode of the chip component arranged in the through hole and also contacts the through hole conductive film so as to electrically connect the second electrode of the chip component and the through hole conductive film to each other.
The blade may be provided to at least one of the first and second electrode components, and may separate the through hole conductive film into: a portion which is electrically connected to the first electrode and a first wiring pattern; and a portion which is electrically connected to the second electrode and a second wiring pattern.
The integer n may represent 3.
The electronic component may comprise: a first electrode component to be packaged on one surface of the multi-layer wiring board; and a second electrode component to be packaged on the other surface of the multi-layer wiring board.
The n number of electrodes may include: a first electrode which is provided to the first electrode component, and is electrically connected to a first electrode of the chip component arranged in the through hole and also contacts the through hole conductive film so as to electrically connect the first electrode of the chip component and the through hole conductive film to each other; a second electrode which is provided to the second electrode component, and is electrically connected to a second electrode of the chip component arranged in the through hole and also contacts the through hole conductive film so as to electrically connect the second electrode of the chip component and the through hole conductive film to each other; and a third electrode which is provided to one of the first electrode component and the second electrode component, and is electrically connected to a third electrode of the chip component arranged in the through hole and also contacts the through hole conductive film so as to electrically connect the third electrode of the chip component and the through hole conductive film to each other.
The blade may be provided to at least one of the first and second electrode components, and may separate the through hole conductive film into: a portion which is electrically connected to the first electrode and a first wiring pattern; a portion which is electrically connected to the second electrode and a second wiring pattern; and a portion which is electrically connected to the third electrode and a third wiring pattern.
The integer n may represent 4,
The electronic component may comprise: a first electrode component to be packaged on one surface of the multi-layer wiring board; and a second electrode component to be packaged on the other surface of the multilayer wiring board.
The n number of electrodes may include: a first electrode which is provided to the first electrode component, and is electrically connected to a first electrode of the chip component arranged in the through hole and also contacts the through hole conductive film so as to electrically connect the first electrode of the chip component and the through hole conductive film to each other; a second electrode which is electrically connected to a second electrode of the chip component arranged in the through hole and also contacts the through hole conductive film so as to electrically connect the second electrode of the chip component and the through hole conductive firm to each other; a third electrode which is provided to the second electrode component, and is electrically connected to a third electrode of the chip component arranged in the through hole and also contacts the through hole conductive film so as to electrically connect the third electrode of the chip component and the through hole conductive film to each other; and a fourth electrode which is electrically connected to a fourth electrode of the chip component arranged in the through hole and also contacts the through hole conductive film so as to electrically connect the fourth electrode of the chip component and the through hole conductive film to each other.
The blade may be provided to at least one of the first and second electrode components, and may separate the through hole conductive film into: a portion which is electrically connected to the first electrode and a first wiring pattern; a portion which is electrically connected to the second electrode and a second wiring pattern; a portion which is electrically connected to the third electrode and a third wiring pattern; and a portion which is electrically connected to the fourth electrode and a fourth wiring pattern.
The through hole insertion type electronic component may further comprise a supporting portion which can be inserted into the through hole, and supports the chip component arranged in the through hole, when it is inserted in the through hole.
The integer n may represent 2.
The electronic component may comprise: a first electrode component to be packaged on one surface of the multi-layer wiring board; and a second electrode component to be packaged on the other surface of the multi-layer wiring board.
The supporting portion may include: a first supporting portion which is formed in the first electrode component and supports one end of the chip component; and a second supporting portion which is formed in the second electrode component and supports the other end of the chip component.
The n number of electrodes may include: a first electrode which is provided to the first electrode component, and is electrically connected to a first electrode of the chip component arranged in the through hole and also contacts the through hole conductive film so as to electrically connect the first electrode of the chip component and the through hole conductive film to each other; and a second electrode which is provided to the second electrode component, and is electrically connected to a second electrode of the chip component arranged in the through hole and also contacts the through bole conductive film so as to electrically connect the second electrode of the chip component and the through hole conductive film to each other.
The blade may be provided to at least one of the first and second electrode components, and may separate the through hole conductive film into: a portion which is electrically connected to the first electrode and a first wiring pattern; and a portion which is electrically connected to the second electrode and a second wiring pattern.
The integer n may represent 3.
The electronic component may comprise: a first electrode component to be packaged on one surface of the multi-layer wiring board; and a second electrode component to be packaged on the other surface of the multi-layer wiring board.
The supporting portion may include: a first supporting portion which is formed in the first electrode component and supports one end of the chip component; and a second supporting portion which is formed in the second electrode component and supports the other end of the chip component.
The n number of electrodes may include: a first electrode which is provided to the first electrode component, and is electrically connected to a first electrode of the chip component arranged in the through hole and also contacts the through hole conductive film so as to electrically connect the first electrode of the chip component and the through hole conductive film to each other; a second electrode which is provided to the second electrode component, and is electrically connected to a second electrode or the chip component arranged in the through hole and also contacts the through hole conductive film so as to electrically connect the second electrode of the chip component and the through hole conductive film to each other; and a third electrode which is provided to one of the first electrode component and the second electrode component, and is electrically connected to a third electrode of the chip component arranged in the through hole and also contacts the through hole conductive film so as to electrically connect the third electrode of the chip component and the through hole conductive film to each other.
The blade may be provided to at least one of the first and second electrode components, and may separate the through hole conductive film into: a portion which is electrically connected to the first electrode and a fist wiring pattern; a portion which is electrically connected to the second electrode and a second wiring pattern; and a portion which is electrically connected to the third electrode and a third wiring pattern.
The integer n may represent 4.
The electronic component may comprise: a first electrode component to be packaged on one surface of the multi-layer wiring board; and a second electrode component to be packaged on the other surface of the multi-layer wiring board.
The supporting portion may include: a first supporting portion which is formed in the first electrode component and supports one end of the chip component; and a second supporting portion which is formed in the second electrode component and supports the other end of the chip component.
The n number of electrodes may include: a first electrode which is provided to the first electrode component, and is electrically connected to a first electrode of the chip component arranged in the through hole and also contacts the through hole conductive film so as to electrically connect the first electrode of the chip component and the through hole conductive film to each other; a second electrode which is electrically connected to a second electrode of the chip component arranged in the through hole and also contacts the through hole conductive film so as to electrically connect the second electrode of the chip component and the through hole conductive film to each other; a third electrode which is provided to the second electrode component, and is electrically connected to a third electrode of the chip component arranged in the through hole and also contacts the through hole conductive film so as to electrically connect the third electrode of the chip component and the through hole conductive film to each other; and a fourth electrode which is electrically connected to a fourth electrode of the chip component arranged in the through hole and also contacts the through hole conductive film so as to electrically connect the fourth electrode of the chip component and the through hole conductive film to each other.
The blade may be provided to at least one of the first and second electrode components, and may separate the through hole conductive film into: a portion which is electrically connected to the first electrode and a first wiring pattern: a portion which is electrically connected to the second electrode and a second wiring pattern; a portion which is electrically connected to the third electrode and a third wiring pattern; and a portion which is electrically connected to the fourth electrode and a fourth wiring pattern.
The electronic component may comprise: a first electrode component to be packaged on one surface of the multi-layer wiring board; and a second electrode component to be packaged on the other surface of the multi-layer wiring board.
The first electrode component and the second electrode component may be pressed against each other, when they are inserted into the through hole.
Each of the n number of electrodes may be provided to one of the first electrode component and the second electrode component, and at least one of the n number of electrodes may become spread to contact the through hole conductive film, when a pressure is applied thereto.
The blade may be rotated with a rotation centering on a portion of the through hole insertion type electronic component that is inserted in the through hole, and thereby to cut the through hole conductive film on the internal surface of the through hole.
The blade may be made of an insulation material.
The n number of electrodes each provided to either one of the first electrode component and the second electrode component may be respectively formed of a plurality of metal pieces having plasticity arranged like a circle.
The n number of electrodes each provided to either one of the first electrode component and the second electrode component may be made of a mixed resin which has plasticity and into which conductive particles are mixed.
The through hole insertion type electronic component may further comprise fixers for fixing the chip component to the through hole insertion type electronic component
To solve the above described problems, a through hole insertion type electronic component according to a second aspect of the present invention comprises:
electrodes which are to be inserted into a through hole of a multi-layer wiring board thereby to be connected to electrodes of a chip component arranged in the through hole and also to be connected to a conductive film formed on an internal surface of the through hole; and
a blade which cuts the conductive film thereby to separate the conductive film into portions which contact the electrodes and a portion other than those portions.
To solve the above described problems, a through hole insertion type electronic component according to a third aspect of the present invention comprises a first and second electrode components, wherein:
the first electrode component has a first electrode which is to be inserted into a through hole of a multi-layer wiring board thereby to be connected to a first electrode of a chip component arranged in the through hole and also to be connected to a conductive film formed on an internal surface of the through hole, and the second electrode component has a second electrode which is to be inserted into the through hole of the multi-layer wiring board from a side counter to a side from which the first electrode component is inserted and thereby to be connected to a second electrode of the chip component arranged in the through hole and also to be connected to the conductive film formed on the internal surface of the through hole; and
at least one of the first and second electrode components has a separator which separates the conductive film into at least a portion which is connected to the first electrode and a portion which is connected to the second electrode.
To solve the above described problems, a method of packaging a through hole insertion type electronic component according to a fourth aspect of the present invention comprises:
preparing a multi-layer wiring board which comprises a through hole, a through hole conductive film formed on an internal surface of the through hole, and n (n is an integer equal to or greater than 2) number of wiring patterns which are provided on different layers and connected to the through hole conductive film;
arranging a chip component comprising n number of externally connecting electrodes, in the through hole;
connecting the n number of electrodes of the chip component arranged in the through hole to corresponding positions of the through hole conductive film; and
separating the through hole conductive film into n number of portions each of which is connected to a corresponding one of the n number of wiring patterns and to a corresponding one of the n number of electrodes.
The separating comprises separating the through hole conductive film into at least n number of portions by cutting the through hole conductive film with a blade.

Through hole insertion type electronic component and method of packaging same


A door panel opening and closing device for a casing includes a face panel, a door panel, and a resilient member. The face panel includes a base wall and a first post disposed on the base wall. The door panel includes a pivot arm pivoted to the base wall and having a second post. A pivot juncture between the pivot arm and the base wall is defined as a turning axis. The door panel is turnable about the turning axis between closed and open positions. The resilient member is an extension spring having two ends hooked to the first and second posts, respectively. When the door panel is turned from the closed position past a specific angular position, the door panel will automatically spring to the open position by virtue of a directional change of a component of tension force of the resilient member to an outward direction.

1. Field of the Invention
The invention relates to a door panel opening and closing device for a casing, more particularly to a door panel opening and closing device for a casing which can automatically turn to an open position or a closed position after being turned past a specific angular position.
2. Description of the Related Art
A conventional casing for holding a storage device for storing a hard disk, or a server generally includes a casing body and a door panel connected pivotally to a front side of the casing body. The door panel is turnable between a closed position where the door panel shields the front side of the casing body, and an open position where the front side of the casing body is accessible. One such casing for an electronic device is disclosed in Taiwanese Utility Model No. M344006.
However, the turning of the door panel from the closed position to the open position or vice versa requires manual turning of the door panel by a user. Therefore, to devise a structure with a door panel that will automatically turn to a desired open or closed position after being turned past a specific angular position is the subject of improvement of this invention.

Door panel opening and closing device for a casing


A system for de-icing aircraft in a de-icing area includes a first recessed storage area located substantially below ground level on a first side of the de-icing area. A first spraying boom, having at least one boom section, is used to apply de-icing solution to surfaces of aircraft. A first spray nozzle, for applying de-icing solution to surfaces of aircraft, is supported by the first spraying boom. The first spraying boom may be raised out of the first recessed storage area when an aircraft needs de-icing and lowered into the first recessed storage area for storage when aircraft de-icing is complete.

The present invention relates to systems for de-icing aircraft. In particular, the present invention relates to an aircraft de-icing system which utilizes booms, retractable into boom storage compartments located substantially below ground level on the taxiway, to automatically de-ice an aircraft.
It is well known that accumulation of snow, ice or frost on the surfaces of an aircraft can have an adverse effect on the aircraft's performance, particularly during take-off. Unless accumulations of these elements are removed from the surfaces of the aircraft prior to take-off, the safety of the passengers and crew will be jeopardized.
A common problem in the de-icing of aircraft is the re-accumulation of snow, ice or frost on the surfaces of an aircraft during the delay period between de-icing and take-off. Because of this problem, it is advantageous to reduce the delay period so that there is not sufficient time for snow, ice or frost to re-accumulate on the surfaces of the aircraft. One method of reducing the delay period between de-icing and take-off is to position the de-icing station on a taxiway bypass close to the take-off runway so that de-iced aircraft do not have to travel a long distance between the de-icing station and the runway.
An example of a de-icing system which is positioned on a taxiway bypass near the take-off runway is shown in Vice et al., U.S. Pat. No. 5,161,753, entitled "AIRPLANE PROTECTIVE AND MAINTENANCE SYSTEM." The system disclosed in Vice et al. includes a portable structure which may be shuttled between a location on taxiway bypass adjacent the take-off runway during cold weather and a remote location away from the take-off runway during warm weather. Although the de-icing structure disclosed in Vice et al. is located near the take-off runway, reducing the delay period between de-icing and take-off, it still has several disadvantages. First, even though the structure is located on a taxiway bypass which is near the take-off runway, a de-iced aircraft will still have to travel a significant distance from the de-icing station to the take-off runway, and may have to wait in line behind other aircraft before take-off. During the travel time and waiting period, snow, ice or frost may re-accumulate on the surfaces of the aircraft.
A second disadvantage of systems like the one disclosed in Vice et al. is that it can be unsafe to have rigid structures positioned close to runways for any significant period of time. Even though the structure disclosed in Vice et al. can be shuttled to a remote location during warm weather, its semi-permanent location near the runway creates increased risks to airport traffic. A third disadvantage of systems like those disclosed in Vice et al. is that large permanent or semi-permanent structures take up a considerable amount of space. This is especially disadvantageous at airports where the efficient use of space is critical.
Another common problem in the de-icing of aircraft is incomplete or improper de-icing as a result of operator error. If the operator of a de-icing station forgets to de-ice a portion of the aircraft, or does not de-ice portions of the aircraft thoroughly enough, the flight characteristics of the aircraft may be adversely affected to the point that the safety of the passengers and crew is jeopardized.


The concepts and technologies disclosed herein are directed to intelligent continuous authentication (“ICA”) for digital rights management (“DRM”). A user device can receive a notification that a media content playback device has requested playback of a media file that is protected by an ICA engine (“ICAE”) instance. The user device can request a unique code from the media content playback device. The user device can provide the unique code to an ICAE central management system associated with a media content provider that provides media content encompassed in the media file. The user device can determine, based upon a result provided by the ICAE central management system, whether the unique code is valid or invalid. The user device can instruct the ICAE instance to enable or disable the media file based upon whether the unique code is valid or invalid.

In recent years, the use of video and music streaming services has increased dramatically. Streaming service providers typically offer a variety of plans to meet the needs of their customers in terms of cost, the number of devices that can stream at the same time, the number of devices that can download content (e.g., for use offline), the amount of content that can be streamed, and the quality of the streamed content. Some customers may decide to bypass certain account restrictions and share their login credentials (e.g., username and password) with other individuals. This practice, commonly referred to as password or account sharing, has resulted in substantial revenue losses for many streaming service providers. Other forms of illegal streaming and content capturing (e.g., unauthorized download) result in additional revenue losses. Unfortunately, due to the proliferation of account misuse such as by password sharing, streaming service providers must employ additional security mechanisms to mitigate revenue losses and to fulfill contractual obligations with media content owners. While these security mechanisms are necessary, implementing them can lead to frustration among good customers.
In addition to account restrictions, many streaming service providers implement some form of digital rights management ("DRM") to prevent unauthorized access to content. DRM broadly encompasses technologies that control access to digital content such as music, movies, television shows, video games, and the like. Streaming service providers may be required to implement DRM to ensure compliance with license agreements with content owners. Implementations of DRM should balance providing a consistent user experience that avoids unnecessary interruptions and upholding any license agreements that are in place.

Intelligent continuous authentication for digital rights management


Described are tetravalent, bispecific EGFR/CD16A antigen-binding proteins for engaging NK-cells towards EGFR-positive cells. EGFR/CD16A antigen-binding proteins with different pharmacokinetic (PK) properties are described. Further described is the use of bispecific EGFR/CD16A antigen-binding proteins for the treatment of an EGFR-positive malignancy, such as EGFR-positive tumors.

The epidermal growth factor receptor (EGFR) is a validated target for the treatment of several solid tumors. Current EGFR-targeting monoclonal antibodies (mAbs) and tyrosine kinase inhibitors (TKI) function mainly through blocking of signal-transduction. Moreover, treatment efficacy with these agents is either dependent on the receptor's or signaling pathway's mutational status such as the T790M gatekeeper mutation in the tyrosine kinase domain or mutations downstream in the signal transduction cascade (e.g. RAS or RAF), which may cause treatment intrinsic or acquired resistance in a large number of patients. In addition, EGFR-targeting therapies have been associated with side effects considered to impact prescription rates. The epidermal growth factor receptor (EGFR) is a member of the HER family of receptor tyrosine kinases and consists of four members: EGFR (ErbB1/HER1), HER2/neu (ErbB2), HER3 (ErbB3) and HER4 (ErbB4). Stimulation of the receptor through ligand binding (e.g. EGF, TGFa, HB-EGF, neuregulins, betacellulin, amphiregulin) activates the intrinsic receptor tyrosine kinase through tyrosine phosphorylation and promotes receptor homo- or heterodimerization with HER family members. These phospho-tyrosines serve as docking sites for various adaptor proteins or enzymes including MAPK and PI(3)K/Akt, which simultaneously initiate many signaling cascades that influence cell proliferation, angiogenesis, apoptosis resistance, invasion and metastasis.
The epidermal growth factor receptor (EGFR) family of receptor tyrosine kinases has been described as a driving factor in the development and growth of a wide range of pathophysiological states such as malignant tumors and the aberrant expression or activity of EGFR is identified in many human epithelial cancers. Specifically, the EGFR gene has been described to be amplified in many cancers and a number of kinase-activating mutations in EGFR have been described and well characterized. EGFRvIII is an extracellular domain mutant of EGFR resulting from in-frame deletion of base pairs spanning exons 2-7 of the EGFR coding sequence and renders the mutant incapable of binding to a ligand. EGFR signaling in EGFRvIII mutated tumors has been reported to be constitutively active thereby driving tumor progression. Also, the ligands binding to and activating HER family members including EGFR have been documented to be overexpressed or implicated in autocrine stimulation loops. Furthermore, HER2 has been described to be gene-amplified in many cancers resulting in auto-phosphorylated HER2 receptors (homodimerization) or constitutively activated heterodimers (e.g. EGFR/HER2).
TKIs specific to EGFR have been developed and are marketed in a number of cancers but, similar to other cancer drugs, have shown severe side effects. The reason for these side effects is a coincident inhibition of EGFR activity and that of downstream molecules such as MAPK in tissues that depend on EGFR signaling for normal function. The most common tissue affected by these drugs is the skin. The side effects include an acne-like rash, dry skin, itching, nail changes and hair changes. Because of the importance of EGFR signaling in skin, dermatological toxicities have frequently been described with TKIs. The resultant significant physical and psycho-social discomfort might lead to interruption or dose modification of anticancer agents.
In more detail, inhibition of EGFR activity at these sites can result in abnormal proliferation, migration and/or differentiation of normal EGFR-positive cells such as keratinocytes, and disruption of the integrity of the skin with the recruitment of inflammatory cells. A pharmacologically- or therapeutically mediated blockade of EGFR signaling results in growth arrest and apoptosis of normal cells that are dependent on EGFR for survival. The skin is composed of three layers: the epidermis is the most superficial layer, which overlies the dermis (providing support and tensile strength) and the hypodermis (adipose tissue). The epidermis is composed primarily of keratinocytes (approximately 90% of cells), which express the highest numbers of EGFR (epidermal growth factor receptor) in the basal and suprabasal layers. The basal layer and the bulge of the hair follicle contain proliferating stem cells, which give rise to terminally differentiating keratinocytes that migrate outwards and form the stratum corneum, in which anucleate cells form a protective barrier. The outer root sheath of the hair follicle is contiguous with the basal layer, sharing biochemical properties and high EGFR expression. It is widely accepted that TKIs affect basal keratinocytes, leading to the development of cutaneous side effects. During therapy with an EGFR-targeting inhibitor, the phosphorylation level of EGFR has been shown to be decreased or abolished in epidermal cells and the level of this dephosphorylation correlates with the degree of skin toxicity. Inhibition of EGFR in basal keratinocytes leads to growth arrest and premature differentiation. Subsequently, inhibition of the EGFR signal transduction affects EGFR-expressing cells such as keratinocytes by inducing growth arrest and apoptosis, decreasing cell migration, increasing cell attachment and differentiation, and stimulating inflammation, all of which result in distinctive cutaneous manifestations such as severe skin rash. Although inflammation is responsible for many of the signs and symptoms that are associated with the rash, the primary event seems to be drug-induced, antibody-induced or TKI-induced altered EGFR signaling.
In clinical studies, efficacy has been linked to skin toxicity, mostly in the form of rash. This applies both to EGFR-targeting mAbs, like cetuximab and panitumumab, and to TKIs. Overall, many phase II and III clinical trials using EGFR-targeting agents have shown an association between rash incidence, severity and survival.
Cetuximab was dosed weekly in a pivotal repeat dose toxicity study in monkeys at 7.5, 24 and 75 mg/kg after an initial higher loading dose. The onset of skin toxicity was observed for cetuximab after 15, 22 and 64 days in high, mid and low dose group respectively. Further, skin toxicity was observed after administration of panitumumab within 7-14 days (i.e. after two or three doses).
The clinical experience with the monoclonal antibody nimotuzumab suggests that clinical efficacy may also be accompanied by a low toxicity profile. The typical severe dermatologic toxicities associated with other EGFR-targeting monoclonal antibodies have not been observed with nimotuzumab and may be due to binding that is restricted to cells expressing moderate to high levels of EGFR. An alternative approach to eliminate EGFR+ tumor cells was the use of bispecific T cell engager such as BiTE constructs described in Lutterbüse et al. (PNAS 2010, 107(28), p 12605). However, this type of approach showed that the simple change of the mode of action from the receptor blockade toward an elimination of target cells via recruitment of immune cells and thereby killing the target cells was not successful to avoid severe side effects since already after administration of relatively low doses in μg/kg/d range experiments with cynomolgus monkeys had to be terminated because of the observation of severe liver and kidney toxicity.

Bispecific EGFR/CD16 antigen-binding protein


Disclosed is a method for fabricating a spherical concave mirror in an optical waveguide based on ultraviolet (UV) grayscale lithography. A key component is a specially designed mask pattern composed of a rectangle as well as a semicircle adjacent to the rectangle, where a rectangular area has no grayscale distribution, and UV light penetrating through different portions of the rectangular area has the same intensity; a semicircular area has the grayscale distribution, and the UV light penetrating through the semicircular area with the grayscale distribution is changed in intensity from the center of a circle in the radius direction according to a special function distribution law; an interlayer photoresist in the rectangular area is irradiated by the UV light penetrating through a mask plate and is developed to form an optical waveguide core.

In recent years, an optical backplane interconnection technology has become a hotspot in researching the information interconnection of high-end devices. It will be widely used in the fields of wideband communication, supercomputers, big data centers, etc. by virtue of its big bandwidth, low energy consumption, low cost, and other advantages.
As one of key technologies in the fields of optical backplane interconnections, an efficient vertical coupling for optical fibers and optical waveguides has the advantages of full use of device space, high design flexibility, easy integration of photoelectric devices, and the like. The efficiency of vertical coupling between the optical fibers and the optical waveguides is mainly improved by means of convergence of concave mirrors, in this way, light beams can be converged to improve the match of numerical apertures (NA) between coupled devices, and the mode field diameter of incident light can be decreased to improve the match of mode field coupling. Up to now, many methods for fabricating concave mirrors are put forward, such as a chemical etching method (Patent Publication No.: CN 1272182A), a fabrication method based on non-invasive water molecules (Patent Publication No.: CN103395739A), an annular laser etching method (Patent Application No.: 201710076388.7), and a deep proton writing (DPW) method (document: Design and fabrication of embedded micro-mirror inserts for out-of-plane coupling in PCB level optical interconnections). However, the chemical etching method has low accuracy, complex processes, difficulty in controls over concave shapes, and the like; the fabrication method based on non-invasive water molecules, which obtains concave surfaces by means of compactness of materials with a liquid drop as a mold, has complex processes, low accuracy, difficulty in obtaining the concave surfaces in optical backplanes; the annular laser etching method as a laser "cold" processing method, which obtains concave mirrors by means of laser etching after optical backplanes are fabricated, has high roughness of the obtained concave surfaces and certain influence on transmission performance of optical waveguides and needs to lower the roughness by means of postprocessing; and the DPW method which processes concave mirrors when optical waveguides are fabricated has extremely complex processes, and difficulty in accuracy controls or mass production. As shown in FIG. 1(a) to FIG. 1(f) in FIG. 1, a common process for fabricating optical waveguides by means of UV lithography mainly includes: a substrate 1 is cleaned; a lower cladding photoresist 2 is spin-coated; an interlayer photoresist 3 is spin-coated; UV exposure 4 is performed by means of a mask plate 5; an optical waveguide core 6 is formed after developing; and an upper cladding photoresist 7 is spin-coated. Light penetrating through the mask plate 5 generally without grayscale distributions has the same intensity, and consequentially, the interlayer photoresist cannot form a concave structure. To obtain the concave structure, other supplementary means are needed, in this case, additional steps for fabricating concave mirrors are required, and the complexity of the process is increased. In view of this, it is urgent to provide a method which is simpler, more effective, feasible, and suitable for fabricating concave mirrors on a large scale.

Method for fabricating spherical concave mirror in optical waveguide based on ultraviolet grayscale lithography


Fiber optic cables and assemblies useful for distribution of the optical fibers to a network are disclosed. The fiber optic cables include a first strength component and a second strength component with a cable jacket generally surrounding the first and second strength components. One or more compartments are defined between the first and second strength components for housing one or more optical fibers. The optical fibers of the fiber optic cable are easily accessible by the craft for distribution to the network, thereby allowing the construction of assemblies that are suitable for distribution of the optical fibers to the network.

With the recent development of "Fiber-to-the-Premises" ("FTTP") networks, it is often desirable to access and terminate pre-selected optical fibers at predetermined locations along the length of a fiber optic cable, thus providing one or more access locations for distributing the optical fibers. For instance, access locations provide a distribution point from the fiber optic cable leading to another distribution point, or a drop point from the fiber optic cable leading toward to the subscriber, thereby extending the reach of the optical communications network towards the subscriber or user. Based on the large number of access locations needed in an optical network, it would be desirable to employ fiber optic cables within those networks whose cable design facilitates accessing optical fibers for distribution at desired access locations.
Conventional fiber optic cables, however, can include undesirable structural features that make optical fiber access difficult. One example of a conventional fiber optic cable is a stranded loose tube design. While the stranded loose tube design has certain advantages such as a round cable shape which aids in installation and favorable compression and tensile windows, there are disadvantages with respect to accessing optical fibers at a predetermined access locations. More specifically, accessing optical fibers of a stranded loose tube cable design using a conventional method requires the following steps: (1) Penetrating and removing a substantial length of the cable jacket in order to expose the underlying strength elements and buffer tubes; (2) Cutting the strength elements in the cable; (3) Accessing the appropriate buffer tube at a first access point; (4) Separating the optical fibers to be accessed; (5) Severing the pre-selected optical fibers at the first access point; (6) Removing the severed optical fibers through a second access point that is upstream from the first; (7) Splicing or otherwise terminating the removed optical fibers; and (8) closing and/or protecting the accessed buffer tube and the exposed section of the cable. Thereafter, the accessed optical fibers are then typically spliced or otherwise optically connected to optical fibers of a tether or drop cable for distribution toward the subscriber. These steps for access are not only time consuming to perform, but must often be accomplished by a highly-skilled technician because of the difficulty and/or danger of damaging optical fibers. Additionally, closing and/or protecting the cable breach at the access location can result in a relatively large or stiff portion of the cable that does not fit through pulleys, sheaves, or the like.
Accordingly, there is a specific and unresolved need for fiber optic cable designs that facilitate the easy access of optical fibers at predetermined access locations along the length of the fiber optic cable. It would also be desirable to provide a fiber optic cable that avoided the steps and difficulties associated with stranded loose tube cable designs.

Fiber optic cables and assemblies suitable for distribution


A marine geophysical survey cable retriever system. At least some of the illustrative embodiments are methods including causing a submerged survey cable to surface. In some cases, causing the submerged survey cable to surface includes: shedding ballast weights when the survey cable reaches or exceeds a first predetermined depth; and inflating a lifting bag when the survey cable reaches or exceeds a second predetermined depth.

Marine survey systems are used to acquire data (e.g., seismic, electromagnetic) regarding Earth formations below a body of water such as a lake or ocean. The marine survey systems typically use a plurality of sensor streamers which contain one or more sensors disposed within an outer jacket.
In some situations, one or more sensor streamers may be disconnected from the survey system, the disconnection possibly caused by failure of a coupling mechanism or in some situations the sensor streamer may be severed (e.g., by the propeller of a passing vessel). In some failure scenarios, particularly with sensor streamers filled with alcohol or oil, the sensor streamer becomes negatively buoyant, thus tending to sink. In order to avoid complete loss of the sensor streamer, an inflatable balloon system may trigger, which causes the sensor streamer to surface. However, balloon systems are large and bulky, and create noise in the signals received by some sensor streamers (e.g., sensor streamers comprising hydrophones).

Method and system of a marine geophysical survey cable retriever


A light engine (9) for a projection display is provided which employs: 1) at least one light source (25), 2) at least one TIR prism assembly (13), and 3) at least one digital micromirror device (15), wherein: (a) the illumination path (55) between the light source (25) and the prism assembly (13) is unfolded, i.e., the illumination path is free of fold mirrors; and (b) the angle xcex3 between the illumination path (55) and the device""s horizontal axis (53) is preferably less than or equal to about 20xc2x0.

This invention relates to micro-display projection systems and, in particular, to micro-display projection systems that use a digital micromirror device (DMD) and a TIR prism.
A. Prior Art Projection Displays Employing DMDs
As known in the art, a digital micromirror device (DMD) comprises a panel which selectively reflects illumination light to produce image light, said panel comprising a plurality of selectively adjustable reflecting elements arranged in a common plane, said elements being adjustable between at least a first position and a second position.
A typical projection display using a DMD (e.g., a DMD from TEXAS INSTRUMENTS) has illumination from a light source (e.g., a high pressure mercury arc lamp), a color wheel for field sequential color, and an illumination path that has an integrator and relay optics. The illumination light from the light source strikes the imager display and is modulated by the micro-mirrors at each pixel. Each flipping mirror can direct the illumination reflected from its surface so that it goes towards the projection lens and screen or off into a reject state where it is blocked from getting to the screen.
There are a number of ways to keep the incident illumination bundle of light separated from the outgoing imaging light, i.e., the light that gets to the screen. The first uses physical separation of the illumination bundle and the imaging bundle. The pupil in the projection lens is then located so as to accept light from pixels that are turned xe2x80x9conxe2x80x9d and reject light from any other direction.
The second method uses a TIR prism to separate the illumination light from the imaging light reflected from the DMD imager. A TIR prism has a face that is close to the critical angle of reflection, i.e., it has a face at which light at some angles undergoes total internal reflection and light at other angles passes through the face. The original disclosure of the use of a TIR prism with a DMD imager was in commonly-assigned U.S. Pat. No. 5,552,922 to Simon Magarill. Other patents in which TIR prisms are used with DMD imagers include: Magarill, U.S. Pat. No. 5,604,624; Peterson et al., U.S. Pat. No. 6,185,047; Poradish et al., U.S. Pat. No. 6,249,387; Fielding et al., U.S. Pat. No. 6,250,763; Okamori et al., U.S. Pat. No. 6,349,006; and Magarill, U.S. Pat. No. 6,461,000.
In what has now become the standard configuration for TIR prisms used with DMD imagers, the illumination light comes in at an angle that xe2x80x9ctotally reflectsxe2x80x9d, while in the imaging path, the light that goes to the screen passes through the TIR surface without any reflections. Again, the pupil in the projection lens is located so as to accept light from pixels that are turned xe2x80x9conxe2x80x9d and reject light, if any, from other directions.
FIGS. 1A and 1B are side and front views, respectively, showing a DMD projection system 9 inside a rear-projection cabinet 11. FIG. 2 is an isometric close-up of the same elements, without the cabinet. These two figures represent the elements that one would find in the cabinet of a rear projection television which uses a DMD and a TIR prism assembly typical of the prior art.
As shown in these figures, prism assembly 13 sits in front of DMD imager 15. Projection lens 17 selects the imaging light and sends it to fold mirrors 19, 21 and then to screen 23. All the parts of a prior art Illumination system can be seen in the figures, namely, a light source 25 (e.g., a high pressure mercury arc lamp), a color wheel 27 with motor 33, an integrating tunnel 29, relay lenses 31, a fold mirror 35, and a further relay lens 37.
B. Operation and Orientation of Illumination Light, Imaging Light, and TIR Surface in the Prior Art
On all DMD imagers produced to date, the square pixel micro-mirrors tilt about their corners. This means that the illumination light needs to come at the device at 45 degrees to the device""s horizontal (see discussion below).
FIG. 3 is a front view of a DMD imager which illustrates how the 45 degree requirement has been achieved in the prior art. In this figure, 39 is a single micro-mirror pixel, 41 shows the mirror flipping axis (axis of motion), 43 illustrates the TIR surface reflection, 45 shows the illumination direction, 47 shows an xe2x80x9cundesirablexe2x80x9d light source orientation (see discussion below), 49 shows the illumination-path fold mirror used in the prior art, and 51 shows the xe2x80x9cdesirablexe2x80x9d light source orientation achieved in the prior art through the use of the illumination-path fold mirror (see discussion below).
To interact properly with the micro-mirrors, the illumination light has to come in perpendicular to flipping axis 41. As a result, illumination direction 45 ends up being at 45xc2x0 to the horizontal axis 53 of the imager 15, i.e., the horizontal axis defined by the imager""s horizontal edges. In a system that uses a TIR prism, the air gap surface is inclined across this same imager axis.
Without fold mirror 49, the illumination axis 45 will go all the way back to the start of the illumination, i.e., to light source 47 in its xe2x80x9cundesirablexe2x80x9d orientation in FIG. 3. For many light sources and, in particular, for light sources which employ an arc burner (e.g., high pressure mercury arc lamps), operation of the source is impaired if the arc burner is not substantially horizontal. It is for this reasons that the orientation of light source 47 in FIG. 3 is considered xe2x80x9cundesirable.xe2x80x9d
As shown in FIG. 3, in the prior art, the need for a substantially horizontal orientation for the light source""s axis was achieved by the use of an illumination-path fold mirror 49. This mirror allowed the light source 51 to have an orientation such that the angle of the source""s axis relative to the horizontal axis 53 of imager 15 was acceptable.
FIG. 4 is a further illustration of the use of TIR prisms in the prior art, in this case, an isometric view of just one of the prisms 13a making up prism assembly 13, with DMD imager 15 being shown below the prism in this figure. In actual use, the DMD imager 15 and the prism assembly will typically be located vertically.
FIG. 4 shows the illumination axis 55 coming into the prism 13a and reflecting down to the device at the TIR surface 57. For illustration, a projection 59 of the illumination axis on the plane of the device is shown as a dashed line in FIG. 4. Note that that the projection is at 45 degrees to the horizontal axis 53 of the imager. FIG. 4 also shows flipping axis 41 which again is at 45 degrees to the horizontal axis 53 of the imager. If the positive direction of the horizontal axis is to the right in FIG. 4, then the flipping axis is at +45xc2x0, while the projection 59 of the illumination axis is at xe2x88x9245xc2x0.
FIGS. 5A, 5B, and 5C illustrate light paths through various TIR prism assemblies used in the prior art, where in each figure a single micro-mirror 67 in its xe2x80x9conxe2x80x9d state (+10 degrees) is shown.
FIG. 5A shows the case where illumination light 61 reflects from TIR surface 57 and imaging light 63 passes through the TIR surface. For a prism composed of acrylic (n=1.493) and for a DMD device with a 10 degree mirror tilt and a F/3.0 light cone, the prism angle is about 35 degrees.
FIG. 5B shows the case where illumination light 61 passes through TIR surface 57 and imaging light 63 reflects from the TIR surface. The mirrors of the imaging device operate in the same manner for this approach as for the approach of FIG. 5A. Thus, the illumination still has to come in at an angle for the tilted xe2x80x9con-statexe2x80x9d mirrors and the imaging (on-state) light still comes straight up off the device (normal to the device plane). To satisfy these conditions, the prisms making up the prism assembly have different configurations for the FIG. 5B approach than for the FIG. 5A approach.
In particular, for the FIG. 5B approach, the prism angle is different from that of the FIG. 5A approach because the imaging light coming straight up needs to be totally reflected at the TIR surface. For example, for an acrylic prism and a DMD device with a 10 degree mirror tilt and a F/3.0 light cone, the TIR prism face for the FIG. 5B approach is at a simple 45 degrees to the device plane, rather than at 35 degrees as in the FIG. 5A approach.
FIG. 5C shows a further approach where the optical paths for both the illumination light and the imaging light undergo total internal reflection. In this case, total internal reflection occurs at both surface 57 and surface 65. Otherwise, this approach is like that of FIG. 5B. In particular, as shown in Peterson et al., U.S. Pat. No. 6,185,047, the approach of FIG. 5C, like the approach of FIG. 5B (and FIG. 5A), has employed a fold mirror in the illumination path.
From the foregoing, it can be seen that in the prior art, DMD projection displays which have employed TIR prism assemblies have included a fold mirror in the illumination path. The present invention addresses this deficiency in the art and provides a projection display which employs: 1) at least one light source, 2) at least one TIR prism assembly, and 3) at least one digital micromirror device, wherein the illumination path between the light source and the prism assembly is unfolded, i.e., the illumination path is free of fold mirrors.
Such an unfolded light path not only simplifies the illumination path but also reduces its length. The reduction in length, in turn, allows smaller and/or fewer relay lenses to be used in the illumination path. This reduces the cost, complexity, and weight of the illumination portion of the system and thus ultimately of the entire projection display.
As discussed in detail below, in accordance with the invention, an unfolded illumination path is achieved for a prism assembly in which illumination light reflects from and image light passes through the assembly""s TIR surface by employing in the assembly a prism having 1) an light input face and 2) a TIR face, both of which have (a) two edges which intersect at an angle greater than 90xc2x0 and (b) two edges which intersect at an angle less than 90xc2x0.
FIG. 13 illustrates such a prism where 69 is the light input face and 71 is the TIR face. The edges of the light input face which meet at an angle greater than 90xc2x0 are edges 73 and 75, while the edges which meet at an angle less than 90xc2x0 are edges 75 and 77. The edges of the TIR face which meet at an angle greater than 90xc2x0 are edges 75 and 81, and the edges which meet at an angle less than 90xc2x0 are edges 75 and 83.
For this embodiment, the TIR fold works on the illumination path which leaves the imaging path free to exit straight off the device and then pass through the TIR surface. This has the advantage of requiring the shortest possible back focal length from the projection lens, which makes the projection lens, which typically has a telecentric or near telecentric pupil, easier to design. It also allows the imager device to be in roughly the same orientation as the screen, which is an advantage for rear projection type displays.
With this configuration, the illumination path in the TIR prism needs to see a compound angle to set up proper illumination. As discussed in detail below, there are more constraints on this type of prism in that it must satisfy both the reflection criteria for the illumination and must remain properly oriented to fully transmit the entire light cone of the imaging path.
Additional features of the invention are set forth in the detailed description which follows, and in part will be readily apparent to those skilled in the art from that description or recognized by practicing the invention as described herein.
It is to be understood that both the foregoing general description and the following detailed description are merely exemplary of the invention, and are intended to provide an overview or framework for understanding the nature and character of the invention as it is claimed.
The accompanying drawings are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification. The drawings illustrate various embodiments of the invention, and together with the description serve to explain the principles and operation of the invention.


A composition including a high temperature thermoplastic polymer and a filler material is disclosed. A method for forming a coating upon a wellbore tool includes forming a powder composition comprising a thermoplastic polymer and a filler material and applying the composition on the body surface. Wellbore tools having components coated with such compositions are also disclosed.

Wellbores are formed in subterranean formations for various purposes including, for example, extraction of oil and gas from the subterranean formation and extraction of geothennal heat from the subterranean formation. Wellbores may be formed in a subterranean formation using a drill bit such as, for example, an earth-boring rotary drill bit. Different types of earth-boring rotary drill bits are known in the art including, for example, fixed-cutter bits (which are often referred to in the art as "drag" bits), rolling-cutter bits (which are often referred to in the art as "rock" bits), diamond-impregnated bits, and hybrid bits (which may include, for example, both fixed cutters and rolling cutters). The drill bit is rotated and advanced into the subterranean formation. As the drill bit rotates, the cutters or abrasive structures thereof cut, crush, shear, and/or abrade away the formation material to form the wellbore. A diameter of the wellbore drilled by the drill bit may be defined by the cutting structures disposed at the largest outer diameter of the drill bit.
The drill bit is coupled, either directly or indirectly, to an end of what is referred to in the art as a "drill string," which comprises a series of elongated tubular segments connected end-to-end that extends into the wellbore from the surface of the formation. Various tools and components, including the drill bit, may be coupled at the distal end of the drill string at the bottom of the wellbore being drilled. This assembly of tools and components is referred to in the art as a "bottom hole assembly" (BHA).
Wirelines can also be used in a wellbore as part of drilling operations or during post-drilling operations. A "wireline" or "slickline," both terms used in the art, comprises a long wire or cable used to lower and raise downhole tools used in oil and gas wells for various purposes. Conductors for providing power and transmitting data may be incorporated in wirelines.
Coiled tubing, which comprises a thin-walled, highly flexible, continuous metal conduit that is transported to a well site and fed into a well bore from a reel, may be used in lieu of wireline for the same, and addition purposes.
A drill string, wireline, coiled tubing and/or a BHA may be used to deploy, or may include, a number of components in addition to the aforementioned components, including without limitation drill pipe, drill collars, stabilizers, measuring-while-drilling (MWD) equipment, logging-while-drilling (LWD) equipment, downhole communication modules, detectors, and other components. MWD/LWD and other wellbore tools may be disposed in an existing wellbore for, among other operations, completing, testing, stimulating, producing, and remediating hydrocarbon-bearing formations.
MWD/LWD tools are typically designed to determine or monitor downhole conditions or parameters. These tools may be configured to determine formation parameters, including, among other things, the resistivity, porosity, and permeability of the rock formation surrounding the wellbore drilled for recovering hydrocarbons. MWD/LWD tools may also be configured to measure the diameter of the borehole or the temperature, pressure, and humidity in the wellbore.
Because of the prolonged contact of wellbore tools with pressurized, solids-laden fluids and debris, and with the wall of the wellbore, in addition to the generally harsh conditions of a downhole location in terms of temperature and often-corrosive fluids, when drilling, completing, testing, stimulating, producing or remediating a wellbore, surfaces of drill bits, drill strings, tool strings, wirelines, MWD/LWD tools, and components thereof become damaged due to erosion, abrasion, and/or corrosion. Damage may occur on interior and/or exterior surfaces of such components. Damage may lead to premature failure of components and to additional costs associated with removal and repair or replacement of damaged components. Coatings are often provided on wellbore tools to protect the tools from the harsh environments in which they are used.

Methods of forming coatings upon wellbore tools


A power transmission device includes a housing, a differential assembly having a case and a bearing assembly rotatably supporting the case within the housing. A preload is applied to the bearing assembly along a load path. A shim is positioned in the load path with the bearing assembly. The shim is constructed at least in part from a material having a predetermined coefficient of thermal expansion such that the shim is operable to compensate for different rates of thermal expansion in the components within the load path to maintain a desired bearing preload or a range of operating temperatures.

The invention relates to power transmission devices and, more particularly, to a device operable to maintain a desired preload on a bearing in an axle assembly.
It is known to rotatably support a differential case in an axle assembly housing using a pair of bearing assemblies. The bearing assemblies are typically constructed to have an inner race, an outer race and a plurality of rollers positioned between the inner race and the outer race. To achieve long bearing life during vehicle operation, it has been found that an axial preload positively affects bearing life.
Some axle assemblies include adjustment mechanisms operable to apply a desired preload to a bearing assembly. During axle assembly, an adjustment nut is typically rotated until a desired preload is met and then the adjustment nut is fixed at that rotational position. Alternately, portions of the axle housing may be separated by application of an external force while the differential assembly and bearings are installed within the axle housing. After installation of the bearings and differential assembly, the force applied to the axle housing is released to provide an axial load to the bearing assemblies.
While these methods have functioned well in the past to provide a desired bearing preload, improvements may be made. Specifically, a concern regarding maintaining the desired bearing preload exists when the axle assembly is constructed using a variety of materials having different coefficients of thermal expansion. Specifically, some axle assembly housings are created using aluminum while the differential case may be constructed from cast iron or steel. As the operating temperature of the axle assembly varies, specific components expand and contract at different rates. As such, the bearing preload set at a specific temperature varies as the temperature deviates from the initial build condition.

This patent is subject to a terminal disclaimer.

Power transmission device with thermally compensating bearing preload mechanism


An article including: a porous substrate that includes a fibrous material; and a release coating disposed on the fibrous material of the porous substrate; wherein the release coating includes a thermoplastic silicone-containing polymer. A method of making an article, which method includes: providing a porous backing having a first major surface and a second major surface; applying a pressure sensitive adhesive to the first major surface of the porous backing; and applying an aqueous dispersion including a thermoplastic silicone-containing polymer to the second major surface of the porous backing to form a low adhesion backsize.

Normally tacky and pressure sensitive adhesive (PSA) materials have been used for well over half a century. Products of this type, which take the form of tapes, labels, and other types of adhesive coated sheets, must be protected from unintended adhesion to other surfaces. Hence, tapes are typically wound into a roll on their own backing and labels are typically laminated to a release sheet to prevent their accidental adhesion to other surfaces and also to prevent their contamination with air-borne dust and other contaminants.
In order to allow a roll of tape to be unwound without the undesirable transfer of adhesive to the tape baking, it is customary to provide the tape backing with a low adhesion backsize (LAB). Similarly, the release sheet or liner, to which the adhesive coated label is typically laminated, is supplied with a release coating to permit the easy removal of the liner from the label. This LAB or release coating is expected to reproducibly provide an appropriate level of release to the adhesive of interest, to not deleteriously affect the adhesive, and to be resistant to aging so that the release level remains relatively predictable with time.
Various polymers having low critical surface tension such as silicones, fluorine-containing polymers, and long alkyl chain branched polymers are useful as release coatings (e.g., LABs). Long alkyl chain branched polymers are waxy compounds that can be used to prepare release coatings of medium release value which are especially desirable for PSA tapes. Release coating patents also describe the use of silicone polyureas. Suitable silicone polyurea polymers typically include random blocks of polydimethyl siloxane, soft segments of polyethylene oxide or polypropylene oxide, and hard segments of a low molecular weight diamine/diisocyanate product. These can be water-borne or solvent-borne polymers and are typically applied to nonporous films.
There is a need, however, for low adhesion backsize coatings that can be applied to porous backings, such as nonwoven polypropylene backings.

Release coating containing thermoplastic silicone-containing polymer


A signal processing device is designed to automatically calculate a transfer characteristic representing sound-box resonance of a guitar due to acoustic excitation of vibration which may occur due to white noise. White noise emitted toward the guitar causes vibration propagating via strings so as to produce an audio signal via a pickup. A transfer characteristic is calculated based on an audio signal and a white-noise signal. A filter performs convolution, using the transfer characteristic, on audio data representing user's playing sound of the guitar, thus reproducing sound-box resonance indicating distinctive peaks which may appear in a low-frequency range of guitar's sound. It is possible to store a plurality of transfer characteristics in memory, whereby any user may be allowed to select a desired transfer characteristic among transfer functions stored in memory or to utilize a transfer characteristic actually calculated by the signal processing device.

1. Field of the Invention
The present invention relates to a signal processing device which processes audio signals based on resonance components of resonators, such as sound boxes, shells, and sound boards of musical instruments.
The present application claims priority on Japanese Patent Application No. 2011-270035, the content of which is incorporated herein by reference.
2. Description of the Related Art
It is known that stringed instruments such as guitars can be equipped with electronic configurations which convert vibration propagating through strings into electric signals by use of pickups configured of piezoelectric elements. Electric signals may be amplified and then reproduced via speakers, thus producing sound (e.g. guitar sound) at a high volume. Sound reproduced based on electric signals detected by pickups may not substantially include resonance components which occur in sound boxes of guitars. For this reason, sound directly reproduced based on electric signals may convey an impression, in which the reproduced sound is heard differently from sound actually produced by an acoustic guitar, to listeners. To overcome this drawback, Patent Literatures 1 and 2 disclose a signal processing device which carries out convolution using an FIR (Finite Impulse Response) filter on electric signals, thus applying sound-box resonance of a guitar to reproduced sound.
The technology of Patent Literatures 1 and 2 is designed to carry out convolution so as to apply electric signals, corresponding to vibration propagating through strings of a stringed instrument with sound-box resonance sound of another stringed instrument, thus improving reproducibility of sound-box resonance sound. This technology needs a preliminary operation for analyzing impulse response using an impulse hammer in order to determine a transfer function representing a parameter for use in convolution in advance. Additionally, this technology needs an additional configuration such as a microphone for detecting sound. It is possible to improve convenience for users if a resonance component of a stringed instrument can be obtained without implementing a preliminary operation and an additional configuration.


A display device includes a display panel including first to fourth pixels in a first direction, wherein each of the first to fourth pixels has a first width in the first direction and a length more than the width and in a second direction; and a backlight unit including first and second line light regions supplying light to the display panel to display three-dimensional images, wherein the first and second line light regions have a slanted angle with respect to the second direction, wherein light from the first line light region comes to right and left eyes of a viewer through the first and second pixels, respectively, and light from the second light region comes to the right and left eyes through the third and fourth pixels, respectively, wherein the display device has K view points.

1. Field of the Invention
The invention relates to a three-dimensional display device, and in particular, an integral photography type three-dimensional display device.
2. Discussion of the Related Art
A two-dimensional display device is generally used. Recently, because of wideband communication networks, a three-dimensional display device has been researched and developed.
There are various types of three-dimensional image displays, for example, a holographic image type, a stereographic type, a volumetric type and the like.
The holographic type is used for a holographic image using a laser or a white ray.
The stereographic type display device displays a three-dimensional image using binocular parallax. The stereographic type display device includes a display device that uses specific glasses and a display device without glasses. The stereoscopic display devices without glasses are divided into a parallax barrier type, a lenticular type, and the like.
The volumetric type is used for three-dimensional computer graphics or an I-MAX movie. Of volumetric types, an integral photography type has advantage of identically reproducing optical properties, such as light distribution and brightness, of a real three-dimensional object and displaying a three-dimensional image perceived as the real three-dimensional object.
FIGS. 1A and 1B are views illustrating a principle of displaying a three-dimensional image in an integral photography type three-dimensional display device.
Referring to FIG. 1A, when there is a real three-dimensional object 50, the object 10 is perceived through rays 10a to 10f emitted from a surface of the object 10. In other words, external rays reflecting on the object 10 or rays radiating at the object 10 itself are emitted as the rays 10a to 10f from the object 10, and a viewer combines the rays 10a to 10f and perceives the object 10.
Referring to FIG. 1B, if a three-dimensional display device emits rays 20a to 20f which have the same light distribution and brightness as the rays 10a to 10f emitted from the surface of the object 10, the viewer combines the rays 20a to 20f from the display device and perceives a virtual object 20 as the object 10.
FIG. 2A is a view illustrating an image-taking device, and FIG. 2B is a view illustrating an integral photography type three-dimensional display device according to the related art.
Referring to FIG. 2A, the image-taking device 60 includes an image-taking lens array 62 and an image-taking panel 64. The image-taking lens array 62 includes a plurality of convex lens in a matrix form. The image-taking panel 64 has a plurality of pixels. The image-taking panel 64 uses a photograph for static images, and a CCD (charge-coupled device) for moving images.
An object 50 emits a plurality of rays 50a toward the image-taking lens array 62, and the rays 50a is condensed through the image-taking lens array 62 and recorded in the pixels of the image-taking panel 64.
The plurality of pixels of the image-taking panel 64 records a plurality of images 52 of the object viewed through the plurality of convex lens of the lens array 62, respectively. Accordingly, the image-taking device 60 takes image data for the object 50 viewed in various directions in space.
The image data are displayed by the integral photography type three-dimensional display device of FIG. 2B and combined by a viewer, and a three-dimensional image is perceived.
Referring to FIG. 2B, the integral photography type three-dimensional display device 70 includes a display panel 72 and a display lens array 74. The display panel 72 includes a plurality of pixels. The display panel 72 uses a photograph for static images, and a flat display panel for moving images. The display lens array 74 includes a plurality of convex lens in a matrix form in similar to the image-taking lens array 62.
The display panel 72 is supplied with the image data recorded by the image-taking device 60. The plurality of pixels of the display panel 72 display the plurality of images 52 of the object 50, respectively, using the image data. A plurality of rays 74 emitted from the plurality of pixels of the display panel 72 are condensed through the plurality of convex lens of the display lens array 74. The condensed plurality of rays 80a form a plurality of voxels (volume pixels). A plurality of partial images displayed at the plurality of voxels are integrated at a point and form an image 80 corresponding to the object 50 at a certain position in space.
Through these processes, the integral photography type three-dimensional display device 70 displays the three-dimensional image 80 identical to the object 50, and the viewer perceives as if the object 50 existed.
Because the integral photography type three-dimensional display device forms three-dimensional images in space, the integral photography type three-dimensional display device supplies continuous horizontal and vertical parallax, and single or multiple viewers view the three-dimensional images without specific glasses. However, because position of the voxels formed in space through the lens array is fixed, a depth range given to the displayed image is limited. This limitation is because the lens array of a passive lens type is used.
In other words, the lens array is fixed in the related art integral photography type three-dimensional display device, and position and property of the convex lens of the lens array is fixed. Accordingly, condensing direction and condensed position by the lens array is not actively control, and thus the depth range given to the displayed image is limited.

Integral photography type three-dimensional display device


2-pattern photonic crystal and the associated photonic devices are described here. A 2-pattern photonic crystal has a large, complete photonic band gap. It includes a TM sub-structure providing a large TM photonic band gap superimposed on a TE sub-structure providing a large TE photonic band gap. The resulting 2-pattern photonic crystals have complete photonic band gaps larger than 15%. By altering the respective sub-structures, optical devices for different polarizations (TE, TM or both) can be readily designed, and those optical devices can be integrated on the same plane.

This invention relates to photonic band gap materials and more particularly to 2-pattern photonic crystals that have a large, complete photonic band gap (PBG) [1, 2]. Numbers in brackets refer to the list of references included herewith. The contents of these references are incorporated herein by reference.
Two-dimensional (2D) photonic crystal devices have wide applications in slow light devices [3-5], optical chip components [6, 7], spontaneous emission control devices [8, 9], quantum information devices [10], waveguides [11-14], lasers [15-17], light emitting diodes [18-22] and optical communications [23-25]. For the above applications, the optical wave is classified to two modes according to its polarization: transverse electronic (TE) and transverse magnetic (TM). To date, one of the challenges for photonics is that there is no general method to integrate multiple optical wave control devices for different polarizations onto the same plane at the scale of the wavelength. To solve this problem, we invented a novel set of PBG structures with large, complete PBG and an approach to design on chip devices. The PBG structures, called 2-pattern photonic crystals, do not belong to any know photonic crystal category and have the largest complete PBG reported so far. They come from the superposition of two sub-photonic crystals: one contributes the TM PGB and the other contributes the TE PBG. We demonstrate the unique advantages of the 2-pattern crystals to efficiently and freely mold both TM and TE waves for polarization specific waveguides, crossed waveguide, a wavelength scale polarizer, and a high quality resonator for both polarizations. The 2-pattern photonic crystal and the associated device design are general liable and intuitive. They have the potential to be standard tools for future optical chip devices.

2-pattern compound photonic crystals with a large, complete photonic band gap


A fire extinguishing system valve (1), in particular wet alarm valve, dry alarm valve or spray water valve, having a housing (3) which has a fluid inlet chamber (9), a fluid outlet chamber (11) and a closing body (13) which can move back and forth between a blocking state and a release state, wherein the fluid inlet chamber (9) and the fluid outlet chamber (11) communicate directly with one another in a fluid-conducting manner in the release state, and the closing body (13) prevents the direct communication between the fluid inlet chamber (9) and the fluid outlet chamber (11) in the blocking state. The housing (3) has a dedicated discharge duct (30) which has at least one inlet (30a, b) connected to the fluid outlet chamber (11) and an outlet (30c) leading out of the housing (3) of the fire extinguishing system valve (1), and which is integrated into the housing (3).

Fire extinguishing system valves of the above-described type are generally known. What is to be understood by fire extinguishing system valves within the context of the present invention is the category including both passive and active alarm valves for use in fire extinguishing systems, specifically fire extinguishing systems having water-based extinguishing agents (for example water, water with additives, and the like). The most prominent representatives of these valve types are wet and dry alarm valves and spray water valves. What is to be understood by a passive alarm valve is a valve which opens automatically when predetermined pressure differences between the inlet side and outlet side are exceeded. An alarm is triggered even as a rule by the valve in response to the detection of the opening state, for example by means of a pressure switch which is arranged in an external alarm line and via which an alarm means, such as, for instance, an electrically operated alarm horn is then controlled, and/or directly by steering the extinguishing agent flow toward a hydraulically operated alarm means, such as, for instance, a water-operated alarm bell, fluidically connected to the alarm valve. Instead of or in addition to hydraulically operated alarm bells, optical indicators are also sometimes arranged in the region of the alarm valves in order, when there are a plurality of alarm valves arranged in parallel, to be able to better distinguish which of the alarm valves has been opened.
What is to be understood by an active alarm valve is a valve which, after an input of a corresponding signal from external fire detection means, or as a function of external control interventions, actively releases a fluid flow from the fluid inlet chamber into the fluid outlet chamber by means of opening the closing body and triggers an alarm. What is common to the two aforementioned valve types is that the alarm valves are often installed over long time periods in fire extinguishing systems without having to be used and it must be ensured that these valves function reliably in an emergency.
In the blocking state, fire extinguishing system valves are typically connected on the inlet side to a water supply which has a substantially constant supply pressure, provided for example by a pump system. However, pressure fluctuations can sometimes occur in the water supply, in particular if the fire extinguishing system is directly connected to the drinking water network. Fire extinguishing system valves, in particular wet alarm valves, are typically connected on the outlet side to a pipe network in which sprinklers or nozzles are provided. On the outlet side, too, pressure fluctuations arise as a result of temperature fluctuations, for example.
Given the long idle times of the fire extinguishing systems, there is a need, at certain time intervals, to check the operability of the alarm means and/or the operability of the fire extinguishing system valve itself. What has happened in the prior art in the past for this purpose is to provide, inter alia, external piping at the valve station in order that extinguishing agent can be discharged, from the outlet side of the extinguishing system valve, past the closing body so as to simulate an extinguishing operation. The pressure drop, associated with the discharge of the extinguishing agent, in the line on the outlet side as viewed from the fire extinguishing system valve thus allowed opening of the valve to be brought about and an alarm test to be performed.
The structural complexity required for realizing these functions and the time period required for mounting the necessary apparatus are generally perceived as disadvantageous. Against this background, the object on which the invention is based was to develop a fire extinguishing system valve of the type described at the outset to the effect that a time- and cost-efficient mounting is made possible in an optimal manner while realizing the above-described functions.
The invention achieves the object on which it is based in a first aspect such that the housing has a dedicated discharge duct which has at least one inlet connected to the fluid outlet chamber and an outlet leading out of the housing of the fire extinguishing system valve, and which is integrated into the housing, and in that the fire extinguishing system valve is designed to selectively release the dedicated discharge duct in a discharge position in the direction of its outlet or, in a blocking position, to close it fluid-tight in the direction of its outlet, and, in an alarm testing position, to remove extinguishing fluid from the fluid outlet chamber via a duct portion having a cross section which is smaller than the smallest cross section of the dedicated discharge duct.
The invention is based on the finding that an integration of the dedicated discharge duct connected to the fluid outlet side into the housing of the fire extinguishing system valve, despite a perceived increase in the component complexity of the housing, is surprisingly contrasted by a considerable simplification of the entire structural and apparatus requirement for realizing a direct discharge function or alarm testing function from the pipeline connected to the fire extinguishing system valve on the outlet side.
The invention is advantageously developed in that the housing has a housing basic body in which the fluid inlet chamber and the fluid outlet chamber are formed and the closing body is arranged, and further has a control module which is reversibly releasably connected to the housing basic body, wherein the dedicated discharge duct is formed in the control module.
A shut-off member is preferably arranged in the dedicated discharge duct and can be selectively switched into the blocking position or into the discharge position.
Depending on the dimensioning of the discharge duct, it is possible, when switching the shut-off member in the discharge duct into its release position, for water to be discharged quickly from the outlet-side pipeline of the fire extinguishing system with the fire extinguishing system valve installed.
In a preferred development of the invention, the fire extinguishing system valve has, in addition to the dedicated discharge duct, a further discharge duct which is connected in a fluid-conducting manner to the fluid outlet chamber, is integrated into the housing and leads out of the housing, wherein one of the discharge ducts is designed as an alarm testing duct and has a cross section which is smaller at least in certain portions than the smallest cross section of the other discharge duct. This second discharge duct is also preferably formed in the control module. The second discharge duct, or alarm testing duct, can preferably also be selectively blocked or released by means of a shut-off member.
In a preferred alternative embodiment of the invention which manages with only one dedicated discharge duct, the shut-off member can preferably additionally be switched into the alarm testing position in which the discharge duct is released in the direction of its outlet with the cross section reduced relative to the discharge position.
Preferably here, as viewed from the shut-off member, the discharge duct is provided, on the inlet side, with a first and a second branch duct which are each connected in a fluid-conducting manner to the fluid outlet chamber, wherein at least the first branch duct and the outlet of the discharge duct communicate with one another in a fluid-conducting manner in the discharge position of the shut-off member, exclusively the second branch duct communicates in a fluid-conducting manner with the outlet of the discharge duct in the alarm testing position of the shut-off member, and neither the first nor the second branch duct communicates with the outlet of the discharge duct in the blocking position of the shut-off member. The advantage of a single discharge duct having an inlet-side first and second branch duct lies in the further reduction in the required installation space.
There is preferably arranged in the second branch duct an additional blocking member by means of which an alarm test can be initiated in the alarm testing position. The shut-off member in the discharge duct preferably has a ball-shaped valve body which has a first passage which extends completely through the valve body and a second passage which is oriented at an angle to the first passage, and preferably opens into the first passage.
In one embodiment with only one discharge duct, the cross-sectional reduction is preferably formed in the discharge duct and/or in the shut-off member.
The cross-sectional reduction, either in the second discharge duct or in the above-described reduced cross-sectional region of the discharge duct or shut-off member, is preferably dimensioned in such a way that the flow resistance produced by the cross-sectional reduction at least approximates to that of a typical sprinkler or spray water valve, in other words a sprinkler or spray water valve assigned to the fire extinguishing system valve in the installed state. What is to be understood by the assignment is a downstream arrangement in the fire extinguishing system that is in communication with the fire extinguishing system valve in a fluid-conducting manner. What is to be understood by the approximation is that the flow resistance which is achieved by the cross-sectional reduction deviates by less than 50% from the flow resistance of a typical or assigned sprinkler or spray water valve. The flow resistances of sprinklers and spray water valves are typically standardized. In the case of sprinklers, the flow resistance is expressed by the so-called K-factor, which represents a nozzle constant at a certain volumetric flow of the sprinkler or of the nozzle and is calculated by means of the formulaK=Q/√p with
K as the nozzle constant,
Q as the volumetric flow (l/min), and
p as pressure at the nozzle/sprinkler (in bar).
A volumetric flow of 171 liters per minute under an operating pressure of 9 bar would result, for example, in a K-factor of K=57. The K-factors of the sprinklers are generally assigned in design sizes of the sprinklers, classified by the sprinkler connection thread; thus, for example, the above-specified K-factor of K=57 would be assigned to a sprinkler connection thread of ⅜″ DN10.
In the case of a typical sprinkler, the K-factor is preferably in a region of K=85 or less, particularly preferably K=57 or less. Accordingly, the cross-sectional reduction in preferred embodiments preferably has a K-factor of 85 or less, particularly preferably of 57 or less.
In a further preferred embodiment, a bypass duct is formed in the housing, in particular in the control module, and connects the fluid inlet chamber and the fluid outlet chamber to one another in a fluid-conducting manner, wherein a shut-off member for selectively blocking or releasing the bypass duct is preferably provided in the bypass duct. The bypass duct integrated into the housing makes it possible for extinguishing agent to be transported from the fluid inlet side to the fluid outlet side without opening the closing body in the housing of the fire extinguishing system valve in order, for instance, to compensate for pressure fluctuations which result on account of temperature changes.
In a further preferred embodiment, a direct alarm duct is provided in the housing, in particular in the control module, and, on the inlet side, is connected directly in a fluid-conducting manner to the fluid inlet chamber and has an outlet which leads out of the housing, in particular control module, and which is designed for connection to an external alarm line, in particular an alarm bell line, wherein a shut-off member is preferably arranged in the direct alarm duct and can be selectively switched into a blocking position or a release position. In the blocking position of the shut-off member at the direct alarm duct, the direct alarm duct is closed. In the release position, the fluid inlet chamber is connected in a fluid-conducting manner to the direct alarm duct outlet.
The direct alarm duct makes it possible, without external apparatus on the fire extinguishing system valve or the valve station, to carry out a direct alarm, by which is to be understood, as already explained at the outset, a triggering of the alarm means without prior opening of the closing body of the fire extinguishing system valve.
In a further preferred embodiment, an alarm duct is arranged in the housing, preferably in the housing basic body and/or the control module, wherein the alarm duct is arranged and formed in such a way that it is also blocked in the blocking state of the closing body, namely particularly preferably by the closing body itself, and is flooded with the closing body opened, wherein the alarm duct extends through the housing, in particular through the control module, and has an outlet which leads out of the housing, in particular control module, and which is designed for connection to an external alarm line, in particular an alarm bell line.
The invention has been described above on the basis of a first aspect with reference to the fire extinguishing system valve itself.
However, the invention relates in a further aspect also to a control module for a fire extinguishing system valve, in particular wet alarm valve, dry alarm valve or spray water valve.
The invention achieves the object specified at the outset on which it is based in that the control module is provided for a housing basic body of the housing of the fire extinguishing system valve according to one of the above-described preferred embodiments. The control module has fastening means for reversibly releasable connection to corresponding fastening means of a housing basic body of the fire extinguishing system valve, and a dedicated discharge duct which has at least one inlet and one outlet, and is integrated into the control module, wherein the at least one inlet and the outlet are arranged in such a way that, with the housing basic body connected to the control module, the at least one inlet is connected to a fluid outlet chamber of the fire extinguishing system valve, and is designed to selectively release the dedicated discharge duct in a discharge position in the direction of its outlet or, in a blocking position, to close it fluid-tight in the direction of its outlet, and, in an alarm testing position, to remove extinguishing fluid from the fluid outlet chamber via a duct portion having a cross section which is smaller than the smallest cross section of the dedicated discharge duct.
The control module according to the invention utilizes the advantages and preferred embodiments of the fire extinguishing system valve according to the invention. The preferred embodiments and developments of the fire extinguishing system valve are therefore simultaneously preferred embodiments and developments of the control module, and therefore reference is made in this respect to the above statements.
In a further aspect, the invention relates to a fire extinguishing system, in particular to sprinkler systems, comprising one or more fluid lines in which a fire extinguishing system valve for blocking or releasing the fluid line is arranged. The invention achieves the object on which it is based in such a fire extinguishing system in that it has a fire extinguishing system valve according to one of the above-described preferred embodiments.
Just like the control module, the fire extinguishing system according to the invention utilizes the advantages and preferred embodiments and developments of the fire extinguishing system valve according to the invention, with the result that preferred embodiments and developments of the fire extinguishing system valve are simultaneously preferred embodiments and developments of the fire extinguishing system. Reference is made again in this respect to the above statements.

Fire extinguishing system valve, in particular wet alarm valve, dry alarm valve or spray water valve and control module for the same and fire extinguishing system utilizing the same