An encased transformer that comprises a bobbin including a plastic-molded cylindrical portion and upper and lower collars formed respectively at upper and lower ends of the cylindrical portion, a magnetic element extending centrally through the cylindrical portion, primary and secondary coils wound round the outer periphery of the cylindrical portion, comb-shaped metals terminal formed on the pair of lower collars by insert molding, the comb-shaped portion of each metal terminal being bent at generally right angles, the metal terminals being further bent at right angles and outwardly horizontally at an end portion thereof so that the metal terminal is substantially Z-shaped, a straight portion of the metal terminal positioned midways of the Z-shaped being fixedly held in position between the inner wall of a case and a frame wall having recessed terminal grooves into which are individually fitted metal terminals provided in a plastic square bottom plate.

1. Field of the Invention
The present invention relates to an encased transformer for use in audio equipment, video equipment, and any other electrical equipment.
2. Description of the Prior Art
In order to explain the background of the present invention, reference will be made to FIGS. 1 to 7, which illustrate a typical conventional transformer:
As shown in FIGS. 1 and 2, the transformer includes a bobbin 4 having a cylindrical portion 1 with an upper collar 2 and a lower collar 3 at its upper and lower ends, respectively. The lower collar 3 is provided with outwardly laterally oriented metal plate terminals 5a to 5d which are formed in one piece with the lower collar 3 or alternatively attached thereto after they are made by molding. Lead wires 6a to 6d of primary and secondary coils 7, 8 wound round the bobbin 4 are bent at their lower portions at a desired angle, with portions of several millimeters left for the convenience of the connection to the metal plate terminals 5a to 5d as used by the user (hereinafter referred to as "user metal terminal"), and the top ends of the lead wires 6a to 6d are outwardly bent at a desired angle so that they are positioned at the same level with the underside 3' of the lower collar 3. The primary coil 7 is wound round the cylindrical portion 1 of the bobbin 4 of the above-described construction, a lead wire 6a at the leading end thereof being passed through a groove 9a provided in the lower collar 3 for winding round the base 5e of the user metal terminal 5a. A lead wire 6b at the trailing end of the coil is passed through a groove 9b for winding round the base 5f of the user metal terminal 5b. The secondary coil 8 is wound round the primary coil 7, a lead wire 6c at the leading end thereof being passed through a groove 9c provided in a lower collar 3b for winding round to the base 5g of the user metal terminal 5c. A lead wire at the trailing end is connection in similar manner. The lead wire 6 wound about the user metal terminal 5 are then soldered, thereafter an E-type magnetic element 10 is incorporated vertically into the cylindrical portion 1 of the bobbin 4 and fixed in position to form a magnetic path. This is a typical conventional method for constructing transformers.
Referring to FIG. 3, the construction of a conventional encased transformer will be described:
The encased transformer also includes a cylindrical portion 1 of a bobbin 4 with an upper collar 2 and a lower collar 3 provided respectively at its upper and lowed ends. User's metal terminals 5 are implanted in the lower collar 3. The cylindrical portion 1 of the bobbin 4 have primary and secondary coils 7, 8 wound round it, and lead wires 6 of the coils 7, 8 are connected to the metal terminals 5 in corresponding relation thereto by being wound about the latter. A magnetic element 10, such as a ferrite core, is vertically inserted and fixed in position to form a magnetic path. A transformer constructed in this way is inserted into an opening of a case 11, and resin material 12, such as silicon resin, is then poured into the case. Finally, a bottom plate 13 is fitted in the opening of the case 11. The amount of the resin material 12 is adjusted to cover a substantial portion of the magnetic element 10 of the transformer, and the resin is normally set by heating.
A conventional type of encased transformer used for flat mount will be described with reference to FIGS. 4 and 5.
FIG. 4 is a sectional view of the transformer. A cylindrical portion 1 of a bobbin 4 has an upper collar 2 and a lower collar 3 formed respectively at opposite ends thereof, the lower collar 3 having metal terminals 5 inserted. A primary coil 7 and a secondary coil 8 are wound round the cylindrical portion 1 of the bobbin 4, lead wires 6 of the coils being wound around metal terminals 14 (hereinafter referred to as "maker metal terminals"). A magnetic element 10, such as a ferrite core, is inserted and fixed in position. The assembly formed in this way is placed in the case 11 and then a bottom plate 13 is inserted in position to close the opening of the case 11. The opening of the case 11 is provided with a rib 15 extending along the inner circumference of the opening, and the bottom plate 13 has a stepped portion 16 extending along the outer circumference thereof. In assembling the transformer the bottom plate 13 is forced into the opening of the case 11, and after the stepped portion 16 of the bottom plate 13 is located inside of the rib 15, the expanded opening is allowed to narrow, thereby securing the joint between the bottom plate 13 and the case 11.
When an electric circuit is to be formed by using a transformer of the above described type, it is a common practice to employ a printed board. Such a circuit of the prior art will be described with reference to FIG. 6. A printed board 17 has a circuit pattern 18 printed with copper foil or the like. A transformer 19 includes various "passive elements 20", such as inductance L, capacitor C and resistance L. Active elements 21, such as transistors, are mounted in position on the printed board 17. These components are electrically connected by soldering to the printed board 17. In this way, it has been usual to have electronic parts mounted peripherally of the transformer 19 on the printed board 17. FIG. 7 is a circuit diagram showing an embodiment of FIG. 6.
Transformers of this type find many applications. For example, they are employed in electronic apparatus, such as video cameras, telephone sets, and liquid crystal TV sets. In these applications, the transformers are required to have a structure adapted for attachment on the surfaces of printed boards because of the trend toward sophisticated functions and increased versatilities of light weight and small size. On the other hand, the conditions under which transformers are used are becoming more severe than ever. For example, they are subjected to thermal stresses due to reflow soldering, and mechanical loads exerted by supersonic wave cleaning after soldering. These external stresses may break the lead wires of the transformer and/or crack the ferrite core, thus eventually breaking the transformer. This problem will be more particularly described with reference to FIG. 2:
The metal plate terminals 5a, 5b of the transformer are attached to the printed board 17. When any load is accidentally applied to the transformer in the vertical directions 22a and 22b, the transformer is actually subjected to a lift upward, that is, in the vertical direction 22a because the base portions thereof are secured to the printed board 17. In contrast, the bases 5e, 5f, 5g, 5h of the metal terminals 5a, 5b, 5c, 5d around which lead wires 6a, 6b, 6c, 6d are wound are subjected to a downward pressure together with the printed board 17 in the downward direction 22b. In this way, the lead wire 6a, 6b, are pulled both upward and downward, thereby causing the lead wires 6a and 6d to break. Likewise, when any load is applied laterally in the directions 23a and 23b, the breakage of the lead wires 6a to 6 d to occur.
Another problem is that the metal terminals 5 are easy to deform, even by a relatively light load applied to their front ends, thereby decreasing the dimensional precision. This problem derives from the fact that the entire length of each of the metal terminals 5a, 5b, is the sum of the length of each of the portions 5a, 5f, about which the lead wires 6 are wound, and the length of each of the bent potions.
A further problem derives from the reflow soldering. More specifically, when the resin cast transformer shown in FIG. 3 is to be reflow-soldered, the components are subjected to thermal stress. The problem arises during the stage of reflow soldering, in which the temperature within the reflow furnace reaches 230.degree. C. As is common with the reflow soldering process, preheating is carried out at 150.degree. C. for one to two minutes, and then the temperature of the furnace is maintained at more than 200.degree. C. for about 30 seconds. The components of the transformers are subjected to such a high temperature treatment, which unfavorably affects the transformers. For example, the primary and secondary coils 7, 8, the magnetic element 10, and the casting resin material 12 are elongated or expanded. However, since they have different coefficients of thermal expansion, the degree of expansion of the magnetic element 10, such as ferrite core, is different from that of the casting resin material 12. Generally, the casting resin material 12 has a hardness of 50 or more, and a greater expandability. Therefore, the problem is that the casting resin material 12 positioned between the bobbin 4 and the magnetic element 10, such as ferrite core, is likely to expand outwardly so that the expanding force breaks the magnetic element 10.
In a transformer of the type shown in FIG. 4, the bottom plate 13 is merely inserted in the case 11, thereby failing to achieve a strong joint therebetween. In addition, gaps are likely to be produced between the bottom of the metal terminals 5 and the bottom of the case 11 and/or the bottom of the bottom plate 13. It may happen that the metal terminals 5 are detrimentally raised relative to the bottom of the transformer. As shown in FIG. 5, the transformer having such a deficiency is mounted on the printed board 17, a gap T is created between the printed board 17 and the metal terminals 5 of the transformer, which prevents an improper soldering connection. The improper connection results in electrical conduction.
When circuits are to be constructed with the above-mentioned conventional transformer, the common practice is to mount the transformer 19 and other components on the printed board 17 as shown in FIG. 6. This practice has a drawback in that a space sufficient for mounting other components than the body of the transformer 19 is required, thereby preventing the achievement of compact-size apparatus.

Matsushita Electric Industrial Co., Ltd.


A repository receives metadata from databases associated with different service providers. The repository converts the received metadata to a common format, such as MPEG7, and stores the converted metadata in a central database. The repository can also receive a query from a client device. The repository retrieves metadata associated with the query from the central database and provides it to the requesting client device. The repository can also convert the provided metadata to an appropriate format for the requesting device. Because the metadata is stored at a common location in a common format, content from different providers can be efficiently identified.

A multimedia service provider makes available multimedia content from different content providers to a user via a data network. It is typically useful for the service provider to also provide metadata for the provided content. The service provider uses the metadata to develop content guides that identify the content that is available to the user. For example, metadata obtained from a video content provider can be used to develop an electronic program guide (EPG). However, different content providers can employ different metadata formats. This can make it difficult for the multimedia provider to efficiently develop the program content guides.
The use of the same reference symbols in different drawings indicates similar or identical items.


A downhole apparatus such as multi-cycle circulating subs used during downhole drilling operations includes a piston (42) slidably mounted in a body (4) between positions in which at least one aperture (40) in the body is opened and closed. Movement of the piston (42) is controlled by a pin (86) secured to one of the body and a control member, and a control groove (52) in which a portion of the pin is received formed in the other of the body and control member. An arrangement of elements (32,76) respectively connected to the control member and body is such that, as the control member moves axially, increasing lengths of the elements locate adjacent one another so as to provide resistance to relative rotation in at least one direction of the control member and body. The relative rotation is rotation which presses the control member against the control groove. The risk of damage to the control pin is thereby reduced.

1. Field of the Invention
The present invention relates to downhole apparatus and particularly, but not exclusively, to multi-cycle circulating subs used during downhole drilling operations.
2. The Prior Art
It is often necessary in downhole drilling operations to bleed the flow of wellbore fluid down the drill string into the wellbore annulus. For example, this may be necessary where the desired fluid flow rate to drive a drilling tool is insufficient to carry all the drilled material up the annulus to the surface. In these circumstances, a circulating sub may be used to allow the flow rate required to remove the drilled material to be pumped into the annulus whilst maintaining the lower flow rate required at the drilling tool.
It is known to provide a circulating sub with an axially movable piston for opening and closing vent apertures. The vent apertures are provided in a body of the sub and allow wellbore fluid pumped downhole through a central bore of the sub to pass into the surrounding wellbore annulus. Opening and closing of the vent apertures by means of the piston is controlled by a pin and groove arrangement. The pin is located in one of the piston and body and is received within the groove provided in the other of the piston and body. The profile of the groove is such that axial movement of the piston results in rotation of the piston within the body. Furthermore, the extent of axial piston movement is limited by the groove profile. Thus, the piston may be moved axially downhole by means of a predetermined fluid flow rate and returned uphole by means of a biasing spring so as to cycle the piston into a position wherein the control groove permits subsequent movement of the piston from a vent aperture closed position to a vent aperture open position.
A problem associated with the aforementioned prior art means for controlling the piston results from the helical compression spring generally used to bias the piston uphole. As the piston is pressed downhole by a fluid flow so as to compress the spring, there is a tendency for the spring to grip the piston and apply a rotational force thereto. This rotational force can often be in opposition to the control groove and pin. For example, in a movement of a piston from a vent aperture closed position to a vent aperture open position, a control groove will typically have a profile which is intended to allow for axial piston movement without any rotation of the piston relative to the body. In these circumstances, it is known for the rotational force applied by the spring to undesirably shear the control pin within the control groove.


A static random access memory (SRAM) cell includes a first load device, a first pull-down transistor, and a switch-box coupled between the first load device and the first pull-down transistor. The switch-box is configured to receive a switch control signal to turn off a first connection between the first load device and the first pull-down transistor during read operations of the SRAM cell and to turn on the first connection during write operations.

Static random access memory (SRAM) is commonly used in integrated circuits. SRAM cells have the advantageous feature of holding data without requiring a refresh. FIG. 1 illustrates an exemplary circuit diagram of a typical six-transistor SRAM cell, which includes pass-gate transistors PG0 and PG1, pull-up transistors PU0 and PU1, and pull-down transistors PD0 and PD1. The gates of pass-gate transistors PG0 and PG1 are controlled by a wordline WL that determines whether the current SRAM cell is selected. A latch formed of pull-up transistors PU0 and PU1 and pull-down transistors PD0 and PD1 stores a state. The stored state can be read through bitlines BL and bitline-bar BLB, which has a reversed phase from bitline BL.
Prior to the starting time of the read operation, pass-gate transistors PG0 and PG1 are off since the wordline voltage is low, for example, at 0V. In order to read the stored data, both bitlines BL and BLB are pre-charged to VDD. Assuming the previously stored data is 1, which means that node C is at a high voltage and node CB is at a low voltage, when wordline WL is activated, pass-gate transistors PG0 and PG1 are turned on. The data "0" stored in the node CB will cause the discharge (through a current Iread) of bitline BLB to "0" through transistor PG1. On the other hand, the high voltage on node C will keep bitline BL at "1". The differential signals on bitlines BL and BLB will then be detected and read out through an output buffer.
With the scaling of integrated circuits, read and write margins of the SRAM cells are reduced. Reduced read and write margins may cause errors in respective read and write operations due to static noises. The read noise induced on node CB may be high enough to cause the state of the SRAM cell to flip over, and thus the content of the SRAM cell is reversed. FIG. 2 illustrates simulated voltages on nodes C and CB during a read operation where no flip over has occurred. It is noted that voltages on nodes C and CB have glitches during the read operation. The voltages on nodes C and CB then return to the stored values. FIG. 3 illustrates simulated voltages on nodes C and CB during an erroneous read operation. It is noted that voltages on nodes C and CB are flipped over during the read operation. The results shown in FIG. 3 are typically caused by a read margin lower than the static noise. Other factors causing this type of error may include, for example, reduced VDD voltage and high threshold-voltage mismatch between pull-up transistors and pull-down transistors.
Accordingly, a new SRAM cell that is immune to the errors caused by static noise is needed.

Taiwan Semiconductor Manufacturing Company, Ltd.


A machine learning maneuver model can be programmed to generate maneuver data identifying a plurality of flight paths for maneuvering an aerial vehicle through an adverse weather condition and a flight path confidence score for each flight path of the plurality of flight paths based on at least weather sensor data characterizing the adverse weather condition. The flight path confidence score can be indicative of a probability of successfully maneuvering the aerial vehicle through the adverse weather condition according to a respective flight path. A maneuver decision engine can be programmed to evaluate each flight path confidence score for each flight path relative to a flight path confidence threshold to identify a given flight path of the plurality of flight paths through the adverse weather condition that poses a least amount of structural risk to the aerial vehicle.

Weather is a temporary condition that occurs in an atmosphere that surrounds a celestial body, such as Earth. Weather is generally characterized by the following factors: temperature, atmospheric pressure, wind, humidity, precipitation, and cloudiness. Because these weather factors are always changing, each unique combination describes a different type of meteorological condition. Adverse weather conditions such as thunderstorms pose a risk to aerial vehicles during flight. In general, aerial vehicles are maneuvered (e.g., flown) around thunderstorms, as wind shears can cause structural damage to the aerial vehicle, and in some examples, destroying the aerial vehicle.

Systems and methods for maneuvering an aerial vehicle during adverse weather conditions


Disclosed is a host cell for producing a recombinant peptide, polypeptide or protein of interest, wherein the host cell includes at least 2 copies of a nucleic acid sequence encoding a poison protein; and to the use thereof for producing peptides, polypeptides or proteins of interest.

Microorganisms are today widely used for protein or DNA production. Usually, these processes require the use of bacterial plasmids as vectors carrying the gene to be expressed. However, plasmid maintenance within microorganisms is limited, and plasmid instability thus represents a significant concern in recombinant protein production or in DNA production.
It has been demonstrated that the growth rate of plasmid-bearing cells is significantly reduced relative to that of a plasmid-free cell. One theory is that plasmid replication and transcription, as well as protein production, represent a significant burden on cellular metabolism. Hence, in a fermentation process, cells losing the plasmid exhibit a higher fitness than cells still bearing the plasmid, and the former rapidly overcome the latter in the bacterial population.
In order to limit plasmid loss in a cell population, and to avoid plasmid-free cells to survive and dominate the culture, selectable markers were inserted in plasmids.
The most common selectable markers used in fermentation procedures are antibiotic-resistance genes. However, contamination of the product or biomass by antibiotics (or genes encoding an antibiotic resistance) is unacceptable from a medical or regulatory perspective. Moreover, antibiotic-resistance genes may propagate in the environment, or be transferred to pathogenic strains. Moreover, recent studies demonstrated that using antibiotic-resistance genes for producing a recombinant protein strongly reduces the yield of protein production (Peubez et al., Microbial Cell factories, 2010, 9:65).
There is thus a need for other systems allowing plasmid maintenance, and free from drawbacks of antibiotic-resistance genes.
An alternative to the use of antibiotic-resistance genes is the complementation of an essential mutated chromosomal gene by a wild-type allele inserted into the plasmid. For example, systems were developed in which the mutant host is unable to synthesize an essential amino acid without a plasmid carrying out the gene that provides this function. However, this approach seriously restricts the possible choices in growth medium.
Another strategy developed is a system in which a plasmid-mediated repressor titration overcomes the repression of an essential chromosomal gene placed under the control of the lac operator. However, this procedure has the following limitations: (i) it makes the Lac promoter unavailable for other purposes such as protein expression, (ii) the system is limited to E. coli or other bacteria wherein the Lac promoter is functional, and (iii) medium containing lactose has to be avoided.
Another alternative system to the use of antibiotic-resistance genes is based on couples of poison proteins (i.e. molecules which are toxic for the host cell) combined to their antidotes. For example, the poison gene may be expressed by the host cell from a chromosomal copy, while the antidote is carried by the plasmid. Therefore, presence of the plasmid is required for the host cell survival. An example of couple poison/antidote is the ccdA (antidote)/ccdB (poison) system. CcdA and CcdB are the antidote and toxin proteins encoded by the E. coli F plasmid. Together, they ensure the death of daughter cells that do not receive a copy of F. Expression of the ccdB protein interferes with the rejoining step of DNA gyrase, causing the host cell chromosome to be cut to pieces. Other examples of antidote/poison couples include, but are not limited to, Kis/Kid proteins, Phd/Doc proteins, RelB/relE proteins, PasB (or PasC)/PasA proteins, mazF/maze proteins.
This antidote/poison system has been extensively used in cloning methods, as described for example in the U.S. Pat. No. 8,470,580: a host cell comprising the gene encoding a poison is used in combination with a plasmid comprising the gene encoding the corresponding antidote. This system thus allows the direct selection of cells having integrated a gene of interest, as only cells expressing the antidote gene survive.
This system is also used for protein production, as previously described by the inventors (Szpirer and Milinkovitch, BioTechniques, 2005, 38(5):775-781). Unexpectedly, an increase of three to five-fold of the recombinant protein production level was observed, demonstrating the great potential of this system for producing recombinant proteins.
However, the Inventors observed that, when this system is used for producing toxic proteins, some drawbacks may appear, such as, for example, mutations within the gene of interest, mutations in the antidote/poison system and the like. Willing to develop an improved plasmid stabilization system, they modified the classic system comprising one copy of the antidote gene combined with one copy of the poison gene. Surprisingly and unexpectedly, they showed that the insertion of an additional copy of the poison gene in the genome of the host cell increases the stability of the plasmid, but also increases the yield of protein production (in a non-correlate manner).


Provided is a method of manufacturing a semiconductor device including the steps of: forming a first insulating film on a silicon substrate; forming a capacitor in which a lower electrode, a capacitor dielectric film configured of ferroelectric material, and an upper electrode are laminated in this order on the first insulating film; forming a silicon nitride film by a catalytic CVD method as a first capacitor protect insulating film covering the capacitor and the first insulating film; and forming a second insulating film on the first capacitor protect insulating film.

1. Field of the Invention
The present invention relates to a method of manufacturing a semiconductor device.
2. Description of the Related Art
A flash memory and a ferroelectric memory are well-known as nonvolatile memories capable of storing information even after a power supply is turned off.
The flash memory includes a floating gate that is embedded in a gate insulating film of an insulated gate filled effect transistor (IGFET), and stores information by accumulating electric charges indicating recording information. However, there is a drawback in that the flash memory requires relatively high voltage because it is necessary to flow the tunnel current to the gate insulating film at the time of writing and erasing the information.
On the other hand, the ferroelectric memory, which is also referred to as FeRAM (Ferroelectric Random Access Memory), stores information by utilizing the hysteresis property of a ferroelectric film provided in a ferroelectric capacitor. The ferroelectric film causes polarization in response to the voltage applied between upper and lower electrodes of the capacitor, and spontaneous polarization remains even after the voltage is removed. When the polarity of the applied voltage is reversed, the polarity of the spontaneous polarization is also reversed. By bringing the direction of the polarity to correspond to "1" and "0", the information is written in the ferroelectric film. The voltage required for the FeRAM to carry out writing is lower than that for the flash memory to carry out writing. In addition, there is also an advantage in that the FeRAM is capable of writing at a higher rate than the flash memory.
In a process of manufacturing the FeRAM, a silane (SiH4) gas or a TEOS gas is used as a deposition gas at the time of forming an interlayer insulating film made of oxide silicon which is formed in the upper portion of the capacitor by a chemical vapor deposition (CVD) method. These gases release hydrogen to a deposition atmosphere by decomposition at the time of deposition. However, it is known that when the capacitor dielectric film comes in contact with reductant such as hydrogen, it causes shortage of oxygen because oxygen in the film is deoxidized, thereby causing the deterioration of ferroelectric property, such as residual amount of polarized electric charges, of capacitor dielectric film. For example, when the capacitor dielectric film is heated in an atmosphere with hydrogen having partial pressure of 40 Pa, the ferroelectricity of the capacitor dielectric film is substantially lost, thereby causing the remarkable deterioration of hysteresis curve.
In addition, even when the capacitor dielectric film is heated in a situation with water in the vicinity, the ferroelectricity is deteriorated because, similar to the above case, water serves as the reductant to deoxidize the capacitor dielectric film.
In this manner, the capacitor dielectric film is deteriorated under the circumstance that heat and reductant are co-existed.
Therefore, this type of FeRAM requires a protective film to protect the capacitor from a reducing atmosphere.
For example, as set forth in Japanese published unexamined application No . 1997-307074, a capacitor is covered by an oxide silicon film formed by a sputtering method in which water is hard to be involved, and the oxide silicon film is used as a protective film.
In addition, as set forth in Japanese published unexamined application No. 2003-273325, as shown in its FIG. 2, metal interconnects in the upper portion of the capacitor are covered by a protective film such as a titanium oxide film or an alumina film so that water can be prevented from coming in contact with the metal interconnects so as not to generate hydrogen.
On the other hand, as set forth in Japanese published unexamined application No. 2000-164817, as shown in its FIG. 3, in an iridium film or the like is formed so as to adjust stress of which a capacitor is received, and a protective film made of a silicon nitride film and a silicon oxynitride film is formed thereon.
As set forth in Japanese published unexamined application No. 1999-126883, as shown in its FIG. 1, a TaSiN film having a hydrogen gas blocking property is formed on the upper electrode of a capacitor so that the permeation of hydrogen into a capacitor dielectric film can be prevented.
Other than the above-described methods, by utilizing methods such as a DC sputtering method, an RF sputtering method, an ion beam deposition method, a plasma CVD method, or a sol-gel method, a titanium or aluminum nitride film or ferroelectric film can be formed, and these films can be a protective film to hydrogen.
It should be noted that the related art to the present invention are also set forth in Japanese published unexamined application No. 2004-95861 and "Preparation of SiNx Passivation Films for PZT Ferroelectric Capacitors by Catalytic Chemical Vapor Deposition" written by Toshiharu Minamikawa et al, which is available online on http://www.irii.go.jp/theme/h12/pdf/study02.pdf.

Method of manufacturing semiconductor device


A method, device, and system for selecting one or more devices and users to capture and share images of an event with other users includes establishing one or more ad-hoc groups with a resource management server. The resource management server communicates with one or more computing devices over a network to assign the computing devices to an ad-hoc group as a function of one or more users requesting to receive images captured at an event. For each ad-hoc group, the resource management server selects a device and a user to capture images of the event, which are distributed to the one or more users. Additionally, the computing devices may establish an ad-hoc group without the resource management server. A computing device of the ad-hoc group is selected to capture images of the event, which are distributed to users of the ad-hoc group through an ad-hoc network.

Digital photography has become an increasingly popular way to capture images of events and social gatherings. As such, it is not uncommon for multiple people at an event to capture similar images of the event using one or more digital cameras or computing devices having an integrated camera. For instance, it is not uncommon for multiple people at an event to capture an image of the same subject at a similar point in time using each of their various digital cameras. Additionally, due to varying factors such as, for example, the angle of capture, the lighting of the subject, the features and capabilities of the various digital cameras, the experience of the photographer, and/or other variables, an image captured by one person may differ greatly from an image captured by another person. As a result, an image captured by one person of a particular subject may be of a much higher quality than a corresponding image captured by another person.
In order to reduce the total number of separate images captured and, in some instances, to increase the quality and management of images captured at an event, family members and groups of friends often designate one person to capture images of the event. The person designated is typically either the family member or friend most experienced in capturing images or the family member or friend having the image capture device capable of capturing the highest quality of images. However, at the conclusion of the event, the designated person often forgets to share the captured images with their family or friends or decides not to follow through with sharing the captured images with one or more people. This becomes even more of an issue when a group of acquaintances (e.g., parents of a class of fifth graders acting in a play), or even a group of complete strangers (e.g., a group of people spotting a bear in Yellowstone), designate one person to capture images for the group.

Method, device, and system for AD-HOC resource selection


A signal tube connector which can be used with a number of signal tubes which includes a detonator receiving body and a retention member, wherein a signal tube locating space is formed between opposing surfaces of the body and the member and wherein the retention member is movable relative to the body and can be locked in place with a locking mechanism to retain signal tubes within the space.

This invention relates to a connector for interconnecting a plurality of signal tubes such as shock tubes.
In a typical shock tube detonating system use is made of connectors, as appropriate, to interconnect shock tubes to ensure that correct propagation of a blast signal from one shock tube to another is reliably achieved. A single failure in the propagation process can result in a blast not being produced according to design, and this can cause significant production losses or downtime.
Shock tube initiating systems are in widespread use in the mining industry, in underground and in open pit environments. Connectors which are used to interconnect the shock tubes vary according to the number of shock tubes which must be coupled together. A typical connector is made in an injection moulding process and is designed to hold a detonator which, when fired, initiates shock tubes which are fixed to the connector. Normally the shock tubes, at a location at which the shock tubes are coupled to the connector, are held so that they are perpendicularly disposed relative to an elongate axis of the detonator.
Each shock tube should be securely attached to the connector and should not be capable of becoming inadvertently separated from the connector. One problem in this respect is that, as the number of shock tubes which are directly coupled to a single connector increases, the likelihood that the shock tubes can become detached from the connector also increases. It should be borne in mind that the shock tubes can be subjected to substantial tensile forces, particularly when used in rough mining conditions. A limited retentive force is available from a typical connector and this retentive force may not be sufficient to retain a number of shock tubes firmly anchored to a connector while an explosive system is being established. Another factor is that a detonator which is engaged with the connector may be movable slightly in a longitudinal direction relative to the connector. This type of movement can create a small gap between one or more of the shock tubes and the detonator and this, in turn, may adversely affect the firing of the shock tubes when the detonator is ignited.
By way of background information reference is made, for example, to U.S. Pat. No. 5,703,319 which discloses a connector block in which is formed an arcuate line-retaining slot disposed transversely to a longitudinal axis of a detonator at an output end of the detonator. This type of arrangement can be used only with a limited number of shock tubes. A similar observation is made with respect to the connector block disclosed in the specification of U.S. Pat. No. 7,798,065.
U.S. Pat. No. 5,204,492 discloses an arrangement in which shock tubes, coupled to a connector, are disposed generally parallel to each other and to a longitudinal axis of a detonator in a circumferential array around the detonator. A number of different connector designs are described, but there is no disclosure of an arrangement in which a connector can be coupled to a large number of shock tubes, e.g. 10 or more.
An object of the present invention is to provide a signal tube connector which can be used with a significant number of shock tubes and which, at least to some extent, addresses the aforementioned operational requirements.


A display panel and a display device are provided. The display panel includes a light-emitting layer, a first insulation layer, a first metal layer, a second insulation layer, and a second metal layer. The first metal layer includes a bridging layer and a first floating pattern. The second metal layer includes a driving electrode and a sensing electrode disposed in a same layer. This prevents a fracture structure and improves display effects and product performance of the display device.

Currently, with continuous improvement and rapid development of touch and sensing technologies, touch panels have been widely used in various display devices.
In a touch display field, touch panels include touch structures such as external touch structures and embedded touch structures (in-cell type or on-cell type), and the on-cell structures are favored because of their high touch accuracy. For on-cell touch panels, they usually include a driving electrode and a sensing electrode. When the driving electrode and the sensing electrode are disposed, they are often disposed as metal grid structures in the prior art. Meanwhile, a fracture structure is disposed between the driving electrode and the sensing electrode. The driving electrode, the sensing electrode, and a floating block are isolated from each other by the fracture structure, ensuring touch functions while also ensuring consistency of optical effects of a display panel. However, when disposing the fracture structure, a fracture width is not easy to be controlled. If the fracture width is too narrow, it easily causes a short circuit between the electrodes and the floating block, thereby causing abnormal electrode channel capacitance. If the fracture width is too wide, it is not conducive to a design of the display panel, ultimately affecting a yield of products.
Therefore, it is necessary to propose solutions to problems of the prior art.

Display panel and display device for improving touch effects

WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD.


Disclosed is a pillow comprising a plurality of pocket springs each comprising a coil spring and a pocket. Each of the pockets comprise a top portion and a bottom portion. Each of the pockets are formed from a continuous top piece of fabric attached to a continuous bottom piece of fabric to form a bond having a plane perpendicular to the longitudinal axis of each coil spring. The pillow further comprises an attachment layer comprising a top portion comprising an inner and outer surface. The pillow further comprises a plurality of first cushion elements engaged with the outer surface of the top portion of the attachment layer. The inner surface of the top portion of the attachment element is engaged with the top portion of the pockets of the pocket springs such that each of the first cushion elements act only upon one of the pocket springs.

Pillows on the market today are built in one of several different ways. Firstly, the pillow can be made from a randomly oriented filling material. An example of this construction is a pillow that is composed of randomly oriented polyester fiber-fill. This construction is not limited to a randomly oriented polyester fiber, but can also include, but is not limited to, wool, cotton, or other fibers in which the material fibers are oriented in random orientations. It is also possible to construct a pillow from randomly oriented solid structures. This type of construction is consistent with pillows made from small foam blocks that are randomly dispersed inside the pillow casing. The foam elements can be made from, but not limited to, man-made foams such a poly foam or visco-elastic foam, to various types of natural foams such as latex foam. In addition to the random orientation of the foam elements, additionally the foam elements can consist of different sizes and shapes. It is also possible to mix different foam sizes and shapes inside of a single pillow covering to create an additional level of randomness.
A second type of pillow construction is made with one or more layers of sheet filling materials within a pillow casing. Examples of this type of pillow are layered poly foam pillows in which one or more types, as well as one or more layers of poly foam are stacked upon one another and then encased in a pillow cover. The layer(s) of foam material can be either man made, such as polyfoam or visco-elastic foam, or natural such a latex. In addition, the layers of sheet foam material can be cut into different contours to allow them to better fit into different body crevices or conforming contours. Also, part of this group of pillow construction is when one or more of the sheet foam layers are fabricated to have a non-uniform surface. A top layer of convoluted foam falls into this category. This type of non-uniform foam layers allows for increased airflow as against uniform surface sheet foam layer, and well as a more localized pressure reduction versus a standard sheet foam material. The advantage of the second type of pillow construction, the uniform sheet layer filled pillow, is that this type of pillow has a uniform resilience and will not flatten out. The problem with the sheet foam pillow construction centers around two principle areas. Firstly, the very nature of sheet foam tends to restrict airflow. Additionally, the continuous sheet nature of this style of pillow does not allow spot pressure reduction. For instance, if a sleeper buries the side of their face in the pillow, areas of the face that protrude will be subjected to higher localized pressures due to the underlying sheet cushioning material not allowing for localized pressure reductions. Along these same lines, the ability of a solid layer cushioning material pillow to mold to a sleeper's anatomy is significantly reduced and compromised.
A third type of pillow construction can be formed by the combination of types one and two (hybrid pillow). This type of pillow often encompasses, but is not limited to, a solid foam center surrounded by a randomly oriented fiberfill material. This type of construction has both the advantages and disadvantages of each respective pillow construction.
A fourth type of pillow construction, that is another variation on the third type of hybrid pillow, is constructed of a pocket spring pillow core that is covered by a sheet cushioning layer. The spring core is of a pocket spring construction like that used in pocket spring mattresses but scaled down to fit into a pillow. This type of spring hybrid pillow has the advantage of being more responsive and reactive than other style pillows because of the spring core. Sometimes a random fiber, or cutup foam, cushioning layer is placed over the spring unit to isolate the springs from the sleeper. In other instances, a solid foam sheet cushioning layer is utilized with a spring core to ensure that the springs will not be felt through the cushioning layer. If a random fill fiber or foam covering is used over the spring core, there is a high probability that the spring core of the pillow can become palpable to a sleeper. However, if the spring core is covered in a sheet foam cushioning material, this spring style hybrid pillow tends to also sleep hot. Additionally, spring core pillows tend not to be flexible and foldable, and not conformable to different sleepers different sleeping demands. Basically, this pillow lies flat and does not have the flexible and foldable pillow characteristics that many sleepers desire. The reason the pillow is not flexible is due to the fact that the pockets of the pocket spring are formed with a bond having a plane that is parallel to the central axis of the coil spring. As a result, any attempt to flex the pocket spring is met with resistance as the coil springs contact each other and resist movement. The advantage of the type four hybrid pocket spring core pillow is that the pillow is both responsive and molds to the individual features of a sleeper's head allowing spot pressure reduction. However, because the pillow is constructed of pocket springs that are bonded to one another along an axis that is parallel to the plane of the spring, the springs have very little freedom of movement relative to one another. This lack of spring movement relative to one another is beneficial in a mattress construction where rigidity is important, but are a negative when considering a pillow where flexibility and moldablility are very positive pillow traits. As a result of this type of hybrid pocket spring construction, these pillows are not very flexible or foldable. Consequently, the sleeper must maintain the pillow in a flat plane. At the same time, if the pillow is covered by a random fiber or foam cushion layer, the cushion layer will tend to flatten out and eventually move into an orientation where the sleeper will feel and be exposed to the actual pocket spring core. On the other hand, if the pocket spring core is covered by a sheet foam cushioning layer, the pillow will be even more inflexible while the sheet foam layer impedes airflow and causing the sleeper and pillow to sleep hot. Furthermore, the sheet foam will exhibit a hammock effect and reduce the benefits derived from using a pocket spring core, essentially reducing the moldable, spot pressure reduction, and responsive characteristics that make this pillow construction desirable.
In all of the aforementioned pillow construction methods several benefits and corresponding shortcomings are evident. In the case of type one, the random fiberfill pillow construction, the random orientation of the filling material fibers allows for an airflow to be able to exist within the fiber construction and hence within the pillow. This allows the sleeper to not overheat when sleeping in a single position over a long period of time since air can flow within the pillow structure and around the sleeper's head. At the same time, the random orientation of the fiber filling allows the sleeper to "mold" the pillow to suit their particular needs. However, the randomness of the fibers, in allowing the pillow to easily mold, also makes the pillows resilience, or bounce back, both unpredictable and potentially compromised. This also results in a pillow that tends to "flatten out" over the course of a night's sleep. Many a sleeper will have to "fluff up" the pillow, by manually attempting to re-randomize the fibers, in an attempt to un-flatten the pillow and restore some of the pillow's original resilience. With regards to the type of construction made from small foam blocks that are randomly dispersed inside the pillow casing similar advantages and disadvantages already discussed also occur. The very nature of random orientation of the foam elements makes the pillow unpredictable in terms of resilience and in term of potentially flattening out.

This patent is subject to a terminal disclaimer.


A sound pressure level calibrator, which is suitable for sound pressures to be measured in excess of 124 dB and which can be adapted to the installed sound pressure level sensor. This object is attained by a sound pressure level calibrator comprising a pistonphone and a high-pressure adapter connected to the output of the pistonphone. The high-pressure adapter acts as a resonator. With an expanded adapter opening the high-pressure adapter is connected in soundproof manner with the sound pressure level sensor, which is inserted into a structure. The invention can be used for a sound pressure level calibrator to calibrate a sound pressure level sensor, which is integrated into a structure.

This application claims the priority of German Application DE 199 47 6837, filed Oct. 5, 1999, and PCT/DE00/03478, filed Oct. 2, 2000, the disclosure of which is expressly incorporated by reference herein.
The invention relates to a sound pressure level calibrator. The calibration of sound pressure level sensors is generally carried out with commercially available sound pressure level calibrators that can produce a maximum sound pressure of 94 dB or 124 dB. To measure sound pressure levels, calibration must be conducted with levels that are nearly as high as the levels to be measured in order to achieve the required measuring accuracy and to be able to check the required dynamics of the recording device of the measuring chain, e.g., a tape recorder, for optimum level control of the recording device. The sound pressure level of commercially available sound pressure level calibrators, which is limited in height, cannot always meet these requirements.
Furthermore, the sound pressure level calibrators of the prior art require the removal for calibration of the sound pressure level sensor from its supporting structure to adapt it to the commercially available sound pressure level calibrators. In prolonged measuring tests with frequent calibration processes, this required removal is very time-consuming and labor intensive. The frequent installation and removal also involves the risk that the sensitive sound pressure level sensor may be damaged.
The object of the invention is to provide a sound pressure level calibrator that is suitable for sound levels to be measured in excess of 124 dB and that can be adapted to the installed sound pressure level sensor.
The solution according to the invention is based on a high-pressure adapter on a commercially available pistonphone, which advantageously acoustically amplifies the sound pressure emitted by the pistonphone to values >150 dB and permits the in situ calibration of the sound pressure level sensor.
This makes it possible to conduct calibration in situ immediately prior to the start of the measuring process on the entire measuring chain and to take measurements with relatively high accuracy even if the sound pressure levels are high. In addition, the adapter advantageously permits the calibration of different sound pressure level sensors through adaptation modules.
Other objects, advantages and novel features of the present invention will become apparent from the following detailed description of the invention when considered in conjunction with the accompanying drawings.


A substrate having a film to be etched is coated with a carbon film. The carbon film is then coated with an organic mask. The mask is then patterned to expose portions of the carbon film. Plasma etching is then utilized to remove portions of the carbon film not covered by the mask, followed by wet etching to form a predetermined pattern in the film on the substrate.

This invention concerns improvements relating to the etching of thin films.
Along with the development of ULSI devices, high precision patterning techonologies have been of great importance. There are two types of etching process for producing patterns. Dry etching is the method which is carried out with a gasesous etchant based largely on its physical attack to surfaces to be etched rather than corrosive attack. Wet etching is representatively based on chemical corrosion of surfaces to be etched, for example, by means of acid. Since the former tends to give rise to damage of the surface due to the bombardment of excited species, some kinds of thin films can not be treated by this method if the surface underlying the thin films is made of a material which is vulnerable to the attack of the bombardment. The wet etching in turn has a shortcoming in that, when the underlying film to be patterned is made of a material which is not easily attacked by chemicals but vulnerable to the bombardment, it is too difficult to select a corrosive etchant which is sufficiently corrosive to etch the film and a material for use in forming masks which has to endure the attack of the strong etchant.

Method of wet etching by use of plasma etched carbonaceous masks

Semiconductor Energy Laboratory Co., Ltd.


The present invention provides a simple suspension bridge type belt conveyor, which includes a simple suspension bridge body, a conveyor belt, a trough support roller apparatus and a circular support roller apparatus. There are multiple supporting pillars beneath the simple suspension bridge body. The trough support rollers apparatus and the circular support roller apparatus are fixed on the simple suspension bridge body. The conveyor conveys materials on the conveyor belt, which is moving through the trough support rollers apparatus and the circular support roller apparatus. By means of aforementioned way, the simple suspension bridge type belt conveyor with respect to the present invention, is able to make the conveyor belt pass over the pillars of simple suspension bridge without overstressing the conveyor belt, and has lower manufacturing cost and higher conveying efficiency.

The simple suspension bridge is a kind of suspension bridge where the bridge body is hung from steel cables or steel wireropes that are supported on pillars separated by a certain distance. The belt conveyor is a conveying machine of which a continuously cycling endless conveyor belt for carrying materials is supported by carry rollers separated by a certain distance. The belt conveyor is also called as the conveyor (hereinafter, simply called as conveyor), and applied to fields such as mining, ports, factories and other areas where material handling is needed. The conveyor has advantages like lower cost, less environmental impact and higher energy efficiency, comparing to material handling by motor vehicles.
The conveyor can be placed on the ground or elevated above the ground on support structures. Ground based conveyor occupies massive land areas along the conveying route and also blocks the traffic on either side of the conveyor. Mounting the conveyor on support structures higher than the ground can reduce land areas occupied by the conveyor, provide better traffic access, and enhance safety. Traditional support structure is either steel trestle or concrete gallery. The traditional support method has drawbacks like high cost, short pillar spacing, and difficult to implement in difficult terrain or crossing existing building structures.
The simple suspension bridge, suspension bridge and cable-stayed bridge are different bridge structures that can be used to support conveyors and achieve long pillar spacing. However, the suspension bridge and the cable-stayed bridge need huge pillars which tower above the bridge body significantly. With the steel ropes or steel cables suspended from the top of pillars, and the bridge body suspended underneath the steel ropes or steel cables, the cost is high. The simple suspension bridge does not need large high pillars. But its bridge body has a near-catenary curve. The slope of the curve is changed suddenly near the top of the pillar. This characteristic makes a conveyor unsuitable to be mounted on the simple suspension bridge directly.

Simple suspension bridge type belt conveyor


The invention relates to the data transfer method, the image processing method, the data transfer system and the image data processor for transferring digital data, especially for transferring image data. The invention has an object to provide the data transfer method, the image processing method, the data transfer system and the image data processor, wherein the compression ratio is changed corresponding to the transfer rate between connecting devices and the lack of image is avoided. The detecting means detects the data transfer capability of the transmission channel and the transfer end, and the control means changes the compression ratio of the digital data corresponding to the data transfer capability. Subsequently, the compressing means compresses the digital data based on the changed compression ratio and the transfer means transfers the compressed digital data to the transfer end.

1. Field of the Invention
This invention relates to a data transfer method, an image processing method, a data transfer system and an image processor for transferring digital data, especially image data.
2. Description of the Related Art
For instance, there is a case that image data, which is prepared by the image preparing means such as the scanner (the handy scanner, in particular), the digital camera and etc., are stored temporarily in a hard disk of the personal computer through a specific transmission channel (the bus) and then devoted to the printing or displaying.
In such case, if the capability of the data processing in the bus or the device at transfer end falls short of the transfer size, the image data is compressed in size corresponding to the capability of the bus or the device at transfer end and then transferred to the device.
Here explains about a conventional method capable of setting flexibly the relation between the picture quality and the compression ratio, it has been well known the method (Japanese laid-open publication No. 09-083809) of handling a block size (which will be described later) and the number of colors as a parameter. The processing method is explained according to FIG. 13.
In this method, the image data is divided into blocks including a plurality of pixels. The block is to be represented approximately by a specific number of colors. Accordingly, it is possible to change the compression ratio by changing the number of pixels (a block size) included in the block or by changing the number of colors.
In FIG. 13, in case of changing the block size and the number of approximate colors to be set by parameter setting means 91, the compression ratio determined uniquely by those parameters is set in compressing means 94. The compressing means 94 can determine the compression ratio so as to meet with the memory size of storage means 95. According to such configuration, the compressing means 94 extracts the approximate colors from each block prepared by input means 92 and then stores them per block in the storage means 95.
In the conventional image processing method described above, the compression ratio is arranged to be set based on the matching of the memory size in such way. In order to obtain a desired picture quality and the compression ratio, the block size and the number of approximate colors are set as parameters.
On the other hand, considering the case of transferring the data from a specific device to the other specific device (for example, in case where a handy scanner is connected with a personal computer and the data is transferred from the handy scanner to the personal computer), and the handy scanner has to be provided with a memory equipped with a buffer function. However, from the aspects of the measurement and the price, the handy scanner cannot be provided with a mass memory including the buffer function. Therefore, if the transfer rate cannot be ensured sufficiently, the buffer will be overflowed and the lack of data will occurs. Therefore, the compression ratio must be determined corresponding to the data transfer rate between devices.
In addition, the device for reading the original surface operating the image sensor manually, like the handy scanner, repeats the stop and acceleration of the scanning so that the data size to be transferred can be adjusted, thereby it is possible to prevent the lack of data that appears because the buffer memory is small in size. However, under such method, since the position of image to be read various widely and the reading speed is not stable, the picture quality deteriorates. And the great difference of the picture quality is caused by the insufficiency of the user's skill causes. In such case, though the operation speed can be adjusted by increasing the size of buffer memory, a problem of the cost-up still remains.

Data transfer method, image processing method, data transfer system and image processor

Matsushita Electric Industrial Co., Ltd.


An example computer-implemented method includes receiving a first value, a second value, a third value, and a fourth value, wherein the first value, the second value, the third value, and the fourth value are 16-bit or smaller precision floating-point numbers. The method further includes multiplying the first value and the second value to generate a first product, wherein the first product is a 32-bit floating-point number. The method further includes multiplying the third value and the fourth value to generate a second product, wherein the second product is a 32-bit floating-point number. The method further includes summing the first product and the second product to generate a summed value, wherein the summed value is a 32-bit floating-point number. The method further includes adding the summed value to an addend value to generate a result value, wherein the addend value and the result value are 32-bit floating-point numbers.

The present invention generally relates to data processing systems, and more specifically, to performing a mixed precision floating-point multiply-add operation.
Numerical support within a processor can include mathematical operations to increase computational efficiency and throughput. Some mathematical operation instructions implemented within a processor can include combined operations, such as multiply-and-accumulate (MAC) operations. In some examples, such operations are performed using float-point arithmetic. Such operations are useful, for example, for training deep neural networks (DNNs), which is a fast-growing workload and is applicable to the cognitive enterprise. Training DNNs can be very compute-resource intensive, whereas DNN inference is very latency-sensitive.

Mixed precision floating-point multiply-add operation

INTERNATIONAL BUSINESS MACHINES CORPORATION


A micromirror (5), a micro-oscillating mirror in particular, having an at least largely cantilevered mirror surface (10) which may be displaced from the rest position about at least one torsional axis (17) is described. The mirror surface (10) is linked to at least one support body (11, 12) by at least two torsion beams (13, 13xe2x80x2), which are arranged at least approximately parallel to each other. Also described is the displacement of the micrometer from its rest position by an electrostatic or magnetic interaction.

The invention relates to a micromirror, a micro-oscillating mirror in particular, according to the definition of the species of the main claim.
A micromirror and, in particular, a micro-oscillating mirror which is equipped with an electrostatic drive, has already been described in German Patent Application 198 57 946.2. A largely cantilevered mirror surface having two or possibly four spring connectors or torsion beams arranged opposite each other in pairs is linked to a surrounding support body.
In addition, a micromirror having a magnetic drive is already known from U.S. Pat. No. 5,748,172. A largely cantilevered membrane is also linked to a surrounding support body by two opposite torsion beams, printed conductors being located on the bottom of the mirror surface in the form of conductor loops or windings, through which an electric current may be routed so that when an external magnetic field is applied, a torque is exerted on the mirror surface.
The object of the present invention was to develop a novel mirror design with an increased mechanical load capacity, which, in particular, is also suitable for a magnetic drive. The increased mechanical load capacity is to be attained by designing the torsion beams or spring connectors linking the mirror surface to the support body to be stronger and more resistant to torsions and shocks.
In contrast to the related art, the micromirror according to the present invention has the advantage of a higher mechanical load capacity and higher fracture stability while at the same time relatively low electrical voltages are required to displace the mirror surface from the rest position or to excite it to torsional oscillation.
In addition, the design of the torsion beams according to the present invention advantageously results in higher motive forces overall being required to displace the mirror surface than in known micromirrors, which results in the cited increased stability.
Finally, the fact that, according to the present invention, the mirror surface is linked to the support body by at least two torsion beams arranged at least approximately parallel to each other with comparable bending strength results in reduced torsional stiffness compared to a single torsion beam which occupies the total width of the parallel torsion beams and the intermediate space between them. Consequently, a larger angle of displacement of the mirror surface is possible with an increased stability of the overall mirror design at the same time.
Advantageous refinements of the invention result from the measures cited in the dependent claims.
It is thus advantageous in particular if each of two opposite sides of the mirror surface is linked to the support body by two torsion beams spaced parallel to each other. In this manner, a printed conductor may be applied to the surface of each torsion beam, which may occupy the entire surface of the torsion beam so that the width of the torsion beam is optimally utilized with simultaneous insulation of the printed conductors from each other. It is, in particular, advantageously possible to route particularly high electric currents of, for example 10, mA to 1 A across the printed conductors located on the surface of the torsion beams.
In addition, the printed conductors routed on the surface of the torsion beams may now be made as wide as possible since the problem of electrically insulating them from each other is eliminated.
Overall, the widened printed conductors and the optimum utilization of the surface of the torsion beams thus result in a higher current carrying capacity, which results in higher magnetic forces or torques in the case of a magnetic drive. Therefore, the design of the micromirror according to the present invention now makes it possible to choose a more robust design of the torsion beams due to the greater forces that may be generated.
The total width of the two torsion beams spaced parallel to each other together with the width of the intermediate space between them is now greater than the width of a corresponding single torsion beam known from the related art.
In addition, the torsion stiffness of the spring design of the present invention is advantageously less than the torsion stiffness of a single torsion beam which occupies the total width of the two parallel torsion beams and the associated intermediate space.
Moreover, the spring design presented may also be advantageously transferred to micromirrors having two torsion axes perpendicular to each other.
It is further advantageous that the printed conductors on the surface of the torsion beams, the contact surfaces located on the support body in some areas and the printed conductors routed on the surface of the mirror surfaces may be produced in a simple manner by surface metallization methods which are known per se.
Moreover, the micromirror according to the present invention may be equipped with either an electrostatic or a magnetic drive.
Finally, providing the actual mirror surface with two loops attached symmetrically in the external area resulting in a distinct increase of the magnetic flux, enclosed by the printed conductors routed on the surface of the mirror surface, in an external magnetic field has the advantage that these loops can be used simultaneously as a stop for the mirror surface and consequently the mirror surface and also the torsion beams, in particular, are protected against shocks and overloads of short duration. For this purpose, in the event of excessively high torsion of the mirror surface, it is advantageously provided that the loops strike the upper or lower side of the housing or the support body and thus prevent the torsion beams from breaking.
These additional loops on the mirror surface are advantageous in particular if the micromirror according to the present invention is to be statically displaced and an air gap is provided to attain as little air cushioning as possible between the mirror surface and the surrounding support body.
In summary, the micromirror of the present invention has the advantage of high motive forces with simultaneous low driving voltages, resulting in an improved stability of the micromirror and an increased yield in manufacturing at the same time since the microstructures produced are more robust as a whole. In addition, the micromirror according to the present invention can be produced using manufacturing methods known per se so that no new procedure steps and manufacturing technologies are required in production.


A method of manufacturing an automotive interior component includes the steps of: providing a mold apparatus comprising a first mold component and a second mold component; providing a substrate; applying a first layer of a soft-touch material to the substrate; applying a second layer of a fabric to one of the first mold component and the second mold component of the mold apparatus; forming a self-skinning foam layer, wherein a first surface of the self-skinning foam layer is configured for bonding to the first layer and a second surface of the self-skinning foam layer is configured for bonding to the second layer; and fastening the substrate, the first layer, the second layer together. Additional methods of manufacturing automotive interior components and automotive interior components are also provided.

Automotive interior components are often produced in a variety of manufacturing sequences based on the assembly requirements set forth by a manufacturer, and are also produced to a variety of specifications based on the quality and fit expected by customers. In particular, customers expect the surfaces of the interior components of an automobile, such as the instrument panel, doors, center consoles, and other similar components, to have a soft feel. Customers also expect the coloration of the automobile interior components to be visually appealing, such as by having a two-toned appearance and similar visual effects.
The aforementioned automotive interior components typically include a hard substrate, an outer skin, and a polyurethane foam layer sandwiched therebetween. The hard substrate generally is molded to form the component, i.e. instrument panel, door, center console, etc. The outer skin is generally attached to the hard substrate to give the texture and appearance desired by customers, and the foam layer provides or enhances the softness of the component. Premium touch materials (e.g., soft-touch materials) may typically be added through corner sewing, edge wrap, trimming, or combinations thereof.
It may be desirable to provide a method of manufacturing an automotive interior component that eliminates the need for corner sewing, edge wrap, and/or trimming, while still being compatible with decorative sewing and still allowing features to be molded into a surface of the premium touch material in order to add an additional styling element.

Composite touch zone for automotive instrument panels, doors, and center consoles


The claimed material relates to a mixed silica and silicate fiber and polymer composite having enhanced modulus, viscoelastic and rheological properties.

Blended materials have been made for many years by combining generally two or more dis-similar materials to obtain beneficial properties from the combination. In a true composite, the interactions of the component materials provide the best properties and characteristics of both components. The use of a reinforcing fiber produces a range of materials and, under the correct conditions, can form a true polymer composite. In contrast, a simple filled polymer, following the rule of mixtures, with additive or filler, displays properties that are simply expected based on the nature of the materials. Fillers are often used as simple replacements for an expensive component to reduce costs in the composition. Strongly coupled materials, such as polymer to fiber or fiber to fiber, have minimal viscoelastic properties.
Substantial attention has been paid to the creation of composite materials with unique properties. Fiber and fabric reinforced polymer materials can include cellulosic fiber, high modulus polyolefin fiber, polybenzoxazole fiber, carbon fiber, aramid fiber, boron fiber, glass fiber and hybrid materials. The fiber can be used in reinforcing thermoplastics and thermosets. Epoxy and polyurethane thermosets are common. Polyolefin, polyvinyl chloride (PVC) and other thermoplastics and hybrids have been developed for a variety of end uses.
Developing thermoplastic composite materials have faced difficult barriers. To obtain significant thermal processing, tensile, modulus, impact and coefficient of thermal expansion (COTE) properties, a composite must control the degree of interaction between reinforcing fiber and polymer and the degree of fiber loading in the polymer matrix. Highly filled composite polymer materials, greater than 40 vol. %, cannot be easily made. Melt processing thermoplastics and fibers are not easily combined due to differences in the polymer with respect to fiber character such as uncoated fiber composition, density, surface energy, roughness and morphology. Excessive compounding processing that is needed to obtain a uniform composite can cause fiber damage and thermal depolymerization of the polymer with accompanying hazards of fire and toxic gasses. While fiber composites have been proposed with high fiber loadings, commercially, due to process limitations, products have typically achieved about 40 to 50 vol. % fiber.
While a substantial amount of work has been done regarding fiber reinforced thermoplastic polymer composite materials. A substantial need exists for a composite material that has a dispersed phase surface that is made more compatible and inert with respect to the polymer, improved fiber packing efficiency and with high fiber content, improved thermal compounding processing that maintains fiber integrity with improved rheology, and produce composites with improved structural properties at elevated use temperatures.

Silica and silicate blended fiber polymer composite


A worm gear for a worm gear mechanism of a motor vehicle steering system includes a carrier body and a multiplicity of teeth with tooth surfaces. The teeth point radially outward and the carrier body is formed from a plastic including reinforcement fibers and has a multiplicity of ribs with rib surfaces which point radially outward from a central encircling ring-shaped web of the worm gear. The teeth are applied to the ribs of the carrier body by injection molding, and the reinforcement fibers are oriented, wherein the multiplicity of reinforcement fibers, in terms of their orientation, follow the adjacent rib surfaces of the carrier body and/or the adjacent tooth surfaces of the teeth.

For the use of electromechanical power steering systems, there is a requirement, inter alia, for mechanisms which transmit an assistance torque from an electric motor to a steering shaft. Commonly, the electric motor drives a worm, which engages with a worm gear arranged rotationally conjointly on the steering shaft. For the transmission of forces, the worm gear must have a certain mechanical strength. Furthermore, it is sought to reduce noises generated owing to the engagement with the worm.
It is known to produce worm gears with fiber-filled plastics in the tooth region from a single-component plastic (1K) or a two-component plastic (2K).
The published application DE 101 19 235 A1 has disclosed a plastics toothed gear which has a main body portion composed of a synthetic resin comprising reinforcement fibers. A toothed portion arranged on the main body portion is produced from the same synthetic resin, with the difference that it comprises no reinforcement fibers. In the prior art, EP 1 083 112 B1 and EP 1 780 444 B1 disclose toothed gears produced from fiber-filled plastics, wherein the fibers have a defined aspect ratio. These solutions have proven to be disadvantageous because the fibers are oriented such that they depart from the surface of the teeth and thus cannot ensure the load capacity and durability of the toothed gear.
Thus a need exists for a plastics toothed gear for a worm gear mechanism of a motor vehicle steering system that exhibits improved mechanical strength and good durability and furthermore reduces running noises.

Worm gear for a worm gear mechanism of a motor vehicle steering system made from fibre reinforced plastic with a targeted orientation of the fibres


A system includes an electronic display to display a virtual keyboard and a processor communicatively coupled to the electronic display. In some embodiments, the virtual keyboard includes a plurality of keys. In certain embodiments, the electronic display receives a first string of erased characters and a second string of replacement characters. In certain embodiments, the processor compares the first string and the second string to determine a difference at corresponding character locations of the first string and the second string. In some embodiments, the processor increments a counter based on the comparison, the counter corresponding to a first character of the first string and a second character of the second string. In certain embodiments, the processor adjusts at least one of the plurality of keys of the virtual keyboard in response to the counter meeting a threshold.

The present disclosure relates generally to dynamically configuring a virtual keyboard.
This section is intended to introduce the reader to various aspects of art that may be related to various aspects of the present disclosure, which are described and/or claimed below. This discussion is believed to be helpful in providing the reader with background information to facilitate a better understanding of the various aspects of the present disclosure. Accordingly, it should be understood that these statements are to be read in this light, and not as admissions of prior art.
Virtual keyboards are typically displayed on an electronic display, and use a digital surface to receive input similar to a traditional keyboard. For example, a virtual keyboard can receive touch-based inputs corresponding to keys on the virtual keyboard. Due to differing physical characteristics of users, a standard size, shape, and/or placement of keys on the virtual keyboard may be difficult to use by different users. For example, users with smaller hands may find keys uncomfortably far apart while users with larger hands may frequently input incorrect keys due to inadequate spacing and/or size of keys. As a result, accuracy of typing, speed of typing, and comfort can be significantly diminished for certain users of a virtual keyboard.

Dynamic configuration of a virtual keyboard


An example method of making a component includes providing a digital model of a component to a software program, the software program operable to slice the digital model into digital layers and raster each digital layer into digital segments, the digital segments delineated by digital raster lines. The method further includes depositing a first layer of powdered material onto a platform, compacting the first layer of powered material into a first compacted layer, sintering the first compacted layer along lines corresponding to the digital raster lines using a laser, wherein the laser operates at a first power and a first scan speed, and sintering the first compacted layer along a perimeter of the first compacted layer using the laser to form a first unitary layer, wherein the laser operates at a second power and a second scan speed, wherein the ratio of the first power to the second power is less than about 3. An apparatus for making a component is also disclosed.

This disclosure relates to a method of additively manufacturing components, and more particularly, to additively manufacturing components with high fatigue and creep resistance strength requirements.
Certain components of gas turbine engines are operating at high temperatures and pressures and require high fatigue and creep resistance. To a large extent the microstructure of the material from which the component is formed controls the characteristics of the component. Often, however, there are process constraints and variables that may adversely influence the microstructure-properties relationship, especially in multi-phase, highly alloyed materials.

Method for additively manufacturing components


An element is arranged to cooperate with another part so as to form an encapsulation device for a component including the element at least partially coated with a metallization. The metallization includes at least one metal layer protected by an intermetallic compound which is coated by a non-diffused portion of a material whose melting point is lower than 250° C. A method of fabricating the encapsulation device is also disclosed.

Electronic components having a MEMS are generally formed by a hermetically closed case inside which the MEMS is mounted. The MEMS may be, for example, a piezoelectric resonator, such as a quartz resonator intended to be connected to an oscillator circuit. Most quartz resonators of small dimensions, which are used, for example, in electronic or electromechanical watches, are tuning fork resonators.
These quartz resonators are usually in vacuum sealed cases, in the case where low frequency signals are generated, delivered by the oscillator circuit, or in an inert gas atmosphere. Further, one portion of the cover may be transparent to a determined wavelength of a light beam so as to allow optical adjustment of the quartz resonator.
Generally, these resonators are mounted in cases, for example made of ceramic, which are relatively flat. These cases include a main hollow portion of parallelepiped shape inside which the resonator is mounted, and a rectangular cover fixed to the main portion.
In order to ensure the sealing between the cover and main portion, a sealing gasket is currently used, made of a eutectic gold and tin based metal alloy which is assembled between the two portions and the assembly is then heated so as to permanently seal the case in a controlled atmosphere.
These gold-tin based alloys have the drawback of using intrinsically expensive materials and having a relatively low melting point, i.e. of around 278° C. This latter feature limits the possible methods used during or after the connection of the case to its medium of use such as a printed circuit board, for example. Indeed, it is clear that no heat treatment higher than 280° C. can be carried out subsequent to the connection, otherwise the case is liable to become unsealed, which, even partially, would result in a loss of hermeticity of the device and thus a loss of resonator performance.

Method of manufacturing an encapsulation device


A system and method are disclosed for aiding a field engineer in the field such as at a remote service facility in analyzing a fault log of a malfunctioning machine such as a locomotive. The method includes obtaining data associated with operation of the malfunctioning machine from a user at a second computing unit coupled via a communications network such as the Internet to a first computing unit such as a centrally located server operable to provide data associated with analysis of the malfunctioning machine, and providing at the second computing unit at least one of a diagnosis of and a repair for the malfunctioning machine based on the data associated with the operation of the malfunctioning machine and the data associated with analysis of the malfunctioning machine.

The present invention relates generally to machine diagnostics, and more specifically, to methods and systems for analyzing a fault log of a malfunctioning machine and determining a diagnosis of and/or a repair for the malfunctioning machine.
A machine such as a locomotive includes elaborate controls and sensors for monitoring the operation of the locomotive. Anomalous operating conditions of the locomotive are detected by the sensors and trigger the generation of an entry in a fault log.
Each entry in the fault log typically includes the time and the date that the anomalous operating condition occurred, a fault code which corresponds to the detected anomalous operating condition (e.g., inverter failure or air conditioner compressor failure), and a data pack which contains additional information on the operating status of the locomotive (e.g., locomotive notch speed, engine speed, water temperature, and oil temperature) at the time that the anomalous operating condition occurred.
A field engineer will review the fault log of a malfunctioning locomotive and determine a recommended repair. If the fault log is complex, it is often difficult for the field engineer to recommend a repair for the malfunctioning locomotive. Computer implemented case based reasoning systems using a plurality of xe2x80x9cgold standardxe2x80x9d cases for comparison to a new fault log have been used for aiding a field engineer in analyzing fault logs of malfunctioning machines. Typically, large machine manufacturers have the resources for setting up and maintaining computer implemented case based reasoning systems as part of full service contracts for maintenance of machines purchased by customers.
There is a need for a system and method for distributing diagnostic knowledge to a field engineer at remotely located sites such as remotely located service facilities for aiding the field engineer in analyzing a fault log of a malfunctioning machine to determine a diagnosis of and/or a repair for the malfunctioning machine.
The present invention provides, in a first aspect, a method for analyzing a malfunctioning machine which includes obtaining data associated with operation of the malfunctioning machine from a user at a second computing unit coupled via a communications network to a first computing unit operable to provide data associated with analyzing the malfunctioning machine, and providing at the second computing unit at least one of a diagnosis of and a repair for the malfunctioning machine based on the data associated with analysis of the operation of the malfunctioning machine and the data associated with the malfunctioning machine.
In another aspect, a method for analyzing a malfunctioning machine includes obtaining at least one distinct fault associated with a fault log of the malfunctioning machine from a user at a second computing unit coupled via a communications network to a first computing unit operable to provide weighted repair and distinct fault cluster combinations associated with analysis of the malfunctioning machine, and providing at the second computing unit a repair for the malfunctioning machine based on the at least one distinct fault and the weighted repair and distinct fault cluster combinations associated with analysis of the malfunctioning machine.
System and computer program products corresponding to the above-summarized methods are also described and claimed herein.

Method, system, and program product for analyzing a fault log of a malfunctioning machine


Included is a light emitting unit, an optical deflector, a control unit, and a liquid crystal panel. The optical deflector includes a first optical deflector and a second optical deflector which are arranged side by side in a direction from a light incident side to a light emitting side. A maximum light deflection angle of the first optical deflector is smaller than a maximum light deflection angle of the second optical deflector, and a maximum light deflection speed of the first optical deflector is higher than a maximum light deflection speed of the second optical deflector. The first optical deflector includes a first optical deflection layer and a second optical deflection layer stacked in the direction from the light incident side to the light emitting side. Each of the first and second optical deflection layers includes the liquid crystal deflection elements arranged in the planar state.

Various optical deflectors which deflect incident light have conventionally been studied. Optical deflectors are devices indispensable to, for example, laser scanners used in laser printers or the like. Examples of conventional optical deflectors include polygon scanners, galvanometer scanners, and Micro Electro Mechanical System (MEMS) mirrors. However, since such polygon scanners, galvanometer scanners, MEMS mirrors, or the like include a mobile unit (mechanical mechanism) for moving parts, there is a problem in that a failure easily occurs. For this reason, there is demand for the development of optical deflectors capable of deflecting light without including a mobile unit.
In response to that demand, an optical deflector as disclosed in Patent Literature (PTL) 1 below has been proposed. This optical deflector does not include a mobile unit, and deflects light with use of the fact that the refractive indexes of liquid crystals are modulated by application of voltage. Through this, it is possible to reduce the occurrence of failures and achieve high reliability.
Furthermore, PTL 2 below discloses a liquid crystal display device capable of displaying three dimensional (3D) images using the above optical deflector. This liquid crystal display device deflects, at a predetermined timing, light incident on the optical deflector to be collected on a viewer's right eye viewing a liquid crystal panel. In synchronization with the timing, a right-eye image is displayed on the liquid crystal panel. After the predetermined timing, the light incident on the optical deflector is deflected to be collected on a viewer's left eye. In synchronization with the timing, a left-eye image is displayed on the liquid crystal panel. By alternately switching between a right-eye image and a left-eye image to be displayed on the liquid crystal panel at a predetermined cycle (for example, 8.3 msec: 120 Hz), the viewer perceives the images displayed on the liquid crystal panel as 3D images.

Liquid crystal display device comprising first and second optical deflectors wherein each of the first and second optical deflectors includes a plurality of liquid crystal deflection elements