A loudspeaker enclosure accommodates at least one speaker in the front wall of the enclosure. The interior of the enclosure is divided into two smaller chambers by means of a partition inclined with respect to the front and rear walls. One such chamber is adjacent to the speaker, while the second or rear chamber is separated from the front chamber by the partition. Below the speaker is a vent or port in communication with the rear chamber. Sound waves emanating from the rear of the speaker are reflected by the inclined partition and reflected upwardly toward the top of the speaker enclosure. The partition does not extend to the top wall of the enclosure, thereby allowing sound waves to reflect off of the top wall and enter the rear chamber. The sound waves then exit the enclosure through the port below the speaker. The rear waves are thus delayed with respect to the front waves from the speaker to achieve the desired tuning of the speaker system. Furthermore, the arrangement of the interior partition causes the rear waves to be compressed at two locations thereby increasing the effective delay and further improving low frequency response.

A bass loudspeaker, or woofer, radiates sound both in the forward and rearward directions. One of the purposes of a speaker enclosure is to prevent the cancellation effect of the rear wave of the woofer upon the waves radiated from the front by isolating the forward wave from the rearward wave. Several kinds of enclosures are known in the art:
(a) Infinite Baffle (Air Suspension): An air suspension enclosure is a completely sealed box in which the rear wave is prevented from cancelling the front wave. In addition, air trapped inside the sealed enclosure results in a springing effect which helps to stabilize the woofer cone. Since the resonant frequency of the enclosure determines the bass response, the smaller the enclosure, the higher the resulting resonant frequency. Air suspension designs are generally less efficient because the rear wave of the speaker is not being utilized to augment the low frequency output in any way.
(b) Bass Reflex: The bass reflex design utilizes a portion of the rear wave of the woofer to augment the front wave. A precisely determined hole (vent) in the enclosure or a port tube or other such device is provided through which the rear wave from the woofer is permitted to exit the enclosure. The vent is designed to delay the rear wave so that when it emerges at the front of the enclosure, it is in phase with the front wave at the frequency the designer wishes to reinforce. As a result of such reinforcement, the bass reflex design offers increased efficiency. However, a disadvantage of this design is that the frequency response falls off very rapidly when the speaker system is called upon to reproduce frequencies below its system resonance.
(c) Horn Enclosure: In this design, a horn acts as an acoustical transformer that matches the high mechanical impedance of the vibrating diaphragm to the relatively low acoustical impedance of the air at the large mouth of the horn. By virtue of this transformer action, the comparatively small area of the diaphragm finds it easy to "grab hold" of a large quantity of air by easy small steps through the gradually expanding cross sectional area of the horn through which the sound travels outward. Because of this effect, the horn provides more efficient coupling between the speaker enclosure and the air, and the efficiency of the horn enclosure is the highest of any known design. Horn enclosures may take many different shapes such as folded horns, corner horns, exponential horns, but the principles of operation are the same for all such shapes. A significant disadvantage of the horn design is that the length of the horn must be extremely long in order to obtain good bass response at low frequencies. This design is not practical in a compact speaker design, and no known expressions of this designs exist in compact form.
(d) Acoustical Labyrinth: This design channels the rear wave from the woofer through a folded passageway so that when the sound finally emerges it is delayed as much as possible and, therefore, reinforces the woofer at the lowest possible frequency. Like the horn enclosure, this design is not practical for compact speakers due to the length of the passage required.
In the design of commercially practical compact speaker enclosures, the two most viable designs are bass relex and air suspension. In both of those designs, in order to obtain a deeper bass response, with all other factors equal, a larger enclosure volume is required. Enclosure volume is determined by the height, width and depth of the box. The current trend in loudspeaker design is towards smaller speaker enclosures because they intrude less in a room. Furthermore, a deeper enclosure is generally more compatable with aesthetic considerations than is a wider or taller enclosure. However, with a deep enclosure, the quality of the bass suffers. This is caused by the excessive depth of the enclosure. The sound wave which emanates from the back of the woofer travels to the rear wall of the enclosure and is reflected back towards the woofer. Because of the increased depth, when the wave returns to the woofer, it is out of phase with the woofer at a lower frequency where it causes cancellation and degrades the speaker's response. The result, in non-technical terms can be called "boomy" or "muddy." In a speaker enclosure that has a smaller depth dimension, there is less of a distance to travel. Therefore, cancellation occurs at a higher frequency. Usually this frequency of cancellation is above the sound range that the woofer is asked to reproduce and no degradation in performance is observed.
Numerous variations on the basic speaker designs discussed above have been tried in an effort to improve speaker performance. For example, U.S. Pat. No. 4,064,966 describes a loudspeaker system in which a pair of speakers are arranged in back-to-back relationship on opposite sides of a sealed enclosure. One speaker faces the listener while the opposite speaker faces into an acoustic labyrinth adjoining the rear of the sealed enclosure. The path-length of the labyrinth is such that the phase of the rear facing speaker's output is reversed, and therefore reinforces the output of the front facing speaker at a desired frequency. In this system, a pair of speakers are required to achieve the desired augmentation. Furthermore, the acoustic labyrinth comprises parallel walls that create standing waves. Such standing waves have the effect of increasing the output at certain unwanted frequencies and diminishing other frequencies and, in addition, tend to minimize the effective volume of the enclosure.
U.S. Pat. No. 2,205,804 describes a cabinet for a loudspeaker in which the speaker is disposed in a partition that divides the cabinet into two chambers. Inclined reflectors in each chamber direct sound from the front and rear of the speaker towards openings in the respective chambers. This effectively increases the length of the air path between the front and rear of the speaker, thus decreasing cancellation of the front and back waves at low frequencies. In this design, both the front and rear waves from the speaker are directed into the interior of the cabinet, thereby reducing the overall efficiency of the speaker system. Furthermore, the length of the air path between the front and rear of the speaker is a direct function of the height of of the speaker cabinet, and thus a tall cabinet is required to improve low frequency response.
U.S. Pat. No. 2,766,839 describes a vented enclosure for a loudspeaker. The top wall of the speaker enclosure incorporates a plurality of vents or ports. An inclined partition is provided inside the enclosure also having a plurality of ports. The purpose of this partition is to minimize the amplitude of the upper resonance peak that is inherent in a ported enclosure design. Other approaches to improving the bass response of a loudspeaker system are described in U.S. Pat. Nos. 3,186,509; 3,912,866; 4,122,302 and 4,266,092.
The present invention represents an improvement over prior art loudspeaker systems such as those discussed above. One of the objects of the present invention is to provide a speaker system that yields a lower or deeper response from a given-sized enclosure over conventional methods of tuning. Another object of the present invention is the elimination of various unwanted side effects of conventional turning methods. For example, the loudspeaker enclosure described herein avoids the introduction of parallel surfaces inside the speaker enclosure. As discussed above, parallel walls cause standing waves which degrade the speaker's performance.


A method of manufacturing a hollow cone having an open side and a cone tip. The method utilizing the steps of introducing a viscous material in a first mold portion, introducing a second mold portion and contacting the viscous material therewith, providing a force in an escape space so as to prevent the viscous material from flowing into the escape space, forming the open side of the hollow cone while preventing the viscous material from entering the escape space and causing the viscous material to enter the escape space to form the cone tip.

A method and a device suitable for manufacturing a cone are known from German Patent DE-C2 2734773.
During the manufacture of a cone, a parison or gob of material is introduced into a first mould part and then pressed into a desired shape by means of a second mould part. The first mould part has a funnel shape and the parison is introduced into a comparatively narrow portion of the funnel shape. The cone tip is formed in the narrowest portion of the funnel shape during moulding. The required wall thickness in the vicinity of the cone tip of the cone to be shaped is comparatively small compared with the rest of the cone. During moulding, the material is pressed into the narrowest portion of the first mould part, from which a portion of the material is pressed toward the wider portion of the first mould part through interspacings between the first and second mould parts. During moulding, the distance between the first and second mould parts becomes increasingly smaller, so that the material is forced to flow through ever narrower interspacings toward the wider portion of the funnel shape. Furthermore, a thin skin of cooled material is formed against the mould parts during moulding. This renders the interspacings through which material can flow even narrower. Comparatively high compression forces are necessary for forcing the material through these narrow interspacings. It is possible for the cone tip to break off from the rest of the cone with these high compression forces. This breaking of the cone tip is the result of the excessive pressure on the material which has already cooled down.
A solution proposed for this problem in the known device is a better temperature control in that the wall thickness of the mould parts in the vicinity of the cone tip to be formed is at least twice as thin as the wall thickness of the remaining portions of the mould parts.
A disadvantage of the known device is that the determination of the required wall thicknesses is inconvenient because new mould parts are to be manufactured each time for changing the wall thicknesses.

Method of pressing two mold portions together and controlling an internal gas pressure so as to create a hollow cone for receiving excess molding material


A fuel injection valve for internal combustion engines, having a valve body that tapers toward the combustion chamber, forming an annular heel, and merges with a valve shaft protruding as far as the inside of the combustion chamber. The fuel injection valve is disposed in a receiving bore, and the diameter of the receiving bore decreases toward the combustion chamber, forming a stop face. In the installed position, the annular heel is pressed against the stop face with the interposition of a sealing disk, and on the side toward the valve retaining body, the sealing disk has an annular rib encompassing it or interrupted at at least one point, and this annular rib surrounds the annular heel and engages an undercut, formed on the outside jacket face of the annular heel, and is thereby joined in captive fashion to the valve body.

1. Field of the Invention
The invention is directed to an improved fuel injection valve for internal combustion engines.
2. Description of the Prior Art
One fuel injection valve of the type with which this invention is concerned is, known from German Published, Nonexamined Patent Application DE 196 05 956, and has an extensively rotationally symmetrical valve base body, which tapers toward the combustion chamber, forming an annular shoulder and thus merges with a valve body shaft that protrudes as far as the inside of the combustion chamber. The valve base body is braced axially against a valve retaining body by means of a lock nut that engages the annular shoulder. The fuel injection valve is disposed in a receiving bore formed in the housing of an internal combustion engine, and the inside diameter of the receiving bore decreases toward the combustion chamber, forming a stop face. In the installed state of the fuel injection valve, the lock nut comes to rest on the stop face of the receiving bore. By a suitable tightening device, the fuel injection valve is pressed into the receiving bore toward the combustion chamber and is thus pressed with the lock nut against the stop face. The sealing off from the combustion chamber is assured by a sealing disk in the form of an annular disk, disposed between the stop face and the lock nut. A sealing disk of this kind, known from German Application DE 196 05 956, is thrust into the receiving bore over the valve body shaft before the fuel injection valve is installed, and is retained on the valve body shaft by radial bracing.
When the fuel injection valve is disassembled from the receiving bore and then reinstalled, the sealing disk has to be replaced to assure reliable sealing from the combustion chamber. In the fuel injection valves, the disadvantage then arises that the sealing disk can stay behind in the receiving bore when the fuel injection valve is dismantled. From there, the sealing disk can be removed only with major effort, possibly requiring special tools.
Since the fuel injection valve is usually manufactured as an outside vendor part, the known sealing disks also have the disadvantage that the sealing disk can loosen during shipping and be lost. Reinstalling the sealing disk when the internal combustion engine is equipped requires a further operation and entails additional costs.
Another difficulty arises in the known sealing disks because of the radial bracing of the sealing disk on the valve shaft. Inside the valve shaft, a valve member is guided in a bore, and both the valve member and the bore are manufactured extremely precisely and with only very close tolerances. Hence it cannot be precluded that some impairment of this guidance will occur from the radial forces exerted on the valve shaft. Imprecise guidance of the valve member can cause inexact injection performance and can finally lead to failure of the fuel injection valve.
The fuel injection valve of the invention for internal combustion engines[, as defined by the characteristics of the body of claim 1,] has the advantage over the prior art that the sealing disk is joined in captive fashion to the lock nut, and no forces are exerted on the valve body shaft.
According to our embodiment, the undercut of the outside wall of the annular heel is formed in a simple way by means of a conical design. Accordingly, in the non-installed state, the outside jacket face of the sealing disk is likewise embodied at least approximately conically, so that after the annular rib has been wedged into the undercut of the annular heel, the outside jacket face of the sealing disk is virtually cylindrical. The cone angle for both the annular heel and the sealing disk is from 4 to 10xc2x0, preferably approximately 5xc2x0.
After the fuel injection valve has been removed, a new sealing disk must be placed on the annular heel of the lock nut and wedged against it with a pulling tool. In an auto repair facility, however, such a tool may not necessarily be available. In a further advantageous feature, a further, encompassing lower annular rib is therefore formed on the side of the sealing disk toward the combustion chamber, and this annular rib is located substantially opposite the first annular rib, the one remote from the combustion chamber. When the fuel injection valve is braced against the stop face formed in the receiving bore, the lower annular rib is pressed toward the valve retaining body and as a result presses the first annular rib inward into the undercut, so that the sealing disk is solidly connected to the lock nut without requiring any additional tool. The next time the fuel injection valve is dismantled, the sealing disk, as in the case of assembly with the aid of a pulling tool, is removed along with the fuel injection valve from the receiving bore.
In a further advantageous feature, the sealing disk has a smaller diameter than the lock nut. This makes it possible with a screwing tool, such as a screwing nut to reach past the sealing disk and thus screw the lock nut against the valve retaining body. The installation of the sealing disk can be done either before or after the lock nut is screwed to the valve retaining body.
According to our embodiment, the sealing disk is made from a metal that is soft in comparison to the material of the valve body, so that durable deformation without major effort is possible even at room temperature. For this purpose, copper, a copper alloy, soft iron or an aluminum alloy is suitable.

Fuel injection valve for internal combustion engines


A fuel or fluid level measurement arrangement for a spacecraft includes one or more electromagnetic transmission lines extending into the reservoir. The presence of fuel adjacent the transmission line changes the dielectric constant or loss characteristics of the transmission line(s) in a measurable manner. In one embodiment, strip transmission lines extend parallel to the fluid surface at various degrees of ullage, and the fuel level can be established to within the spacing between the transmission lines.

This invention relates to liquid sensing arrangements, and more particularly to such arrangements using electromagnetic sensors.
In many situations, it is much more important to accurately know the amount of liquid in a container when the container is near empty than when it is near full. The problem is particularly acute where an undesirable event accompanies the exhaustion of the liquid and/or where contentional measuring techniques, such as a narrow bottom portion of a container in which the remaining liquid pools, do not work.
One example of where all the foregoing exist is in a satellite attitude control system employing gas jets or thrusters. Gas for the jets or fuel for the thrusters is usually stored in liquid form in containers or tanks on the satellite. When the gas or fuel is used up, most satellites become inoperative, or at least suffer significantly degraded capability. Moreover, without gravity to pool the liquid in the tank it tends to distribute itself in response to other forces. Fuel is generally used herein to denote the fluid contents of the container, whether or not the liquid would strictly be considered fuel.
The length of time that a particular load of fuel will provide stationkeeping for a satellite cannot be predicted exactly, because it depends upon environmental conditions, such as solar wind pressure and magnetic fluctuations. Furthermore, the exact amount of fuel used during each maneuver also depends upon the exact characteristics of controllers, which may vary slightly with time and environment. Thus, the exact amount of fuel remaining in a spacecraft becomes less well known as time progresses, unless a suitable measurement scheme is used.
At the end of life of a geostationary satellite, for example, the remaining fuel is used to remove it from its assigned orbital position so that a replacement satellite may be inserted into that orbital position. So long as the old satellite is given enough velocity to vacate the regions of interest, it is irrelevant how much additional velocity it is given. If the amount of fuel remaining in the tanks at the time it is ejected from its orbital position exceeds that necessary, the excess fuel could have been used for additional useful time in orbit. Because the amount of fuel required for stationkeeping is very small, months of potential stationkeeping time could be wasted if the ejection from orbital position occurs too early. On the other hand, if the decision is made too late, there may be insufficient fuel to cause the satellite to be removed from its orbital position, and the orbital position it occupies may not be usable for a replacement satellite.
Communication satellite weight is tightly controlled in order to provide the largest possible load of fuel for stationkeeping, thereby obtaining the longest possible useful life. For a satellite with 24 transponders which are polarization-multiplexed to provide 48 effective communication channels, the value of additional usable fuel may be several million dollars per additional month of useful life.
Thus, it is very advantageous to be able to determine the amount of remaining fuel. The measurement, however, is rendered complex because under weightless conditions, the fuel spreads through the tank. In order to prevent the fuel from forming into balls spread throughout the tank, the tanks include one or more thin circumferential bands near the inner surface of the tank. These bands capture the central bubble which tends to form, holding the remaining fuel against the outer walls and the bands.
Since the remaining fuel near the end of life has a relatively small volume compared with the volume of the tank, measurement methods which compare volume lack sensitivity near the end of spacecraft life, when the tank approaches empty, which is when the accuracy is most needed. Similarly, methods which depend on the mass of fuel lack sensitivity because of the increasing effect of the mass of the tank and surrounding objects. The extremely irregular shape of the fuel as it adheres by surface tension to the tank and the circumferential bands further complicates the problem. Yet further, the size and weight of a fuel sensor should not be so great that the additional fuel which it displaces from the spacecraft exceeds the additional amount of fuel rendered usable by knowledge of the actual amount of remaining fuel.

Liquid sensor with high sensitivity near empty


A transistor and a method for forming the transistor are provided. The transistor can be formed over a substrate including a first region and second regions on opposite sides of the first region. On the substrate, a first SiGe layer can be formed, followed by forming a first silicon layer on the first SiGe layer and forming a second SiGe layer on the first silicon layer. The second SiGe layer and the first silicon layer within the second regions are removed. The first silicon layer within the first region is removed to form a cavity such that the second SiGe layer is floated. An isolating layer is formed in the cavity. Second silicon layers are formed in the second regions. A gate structure is formed on the second SiGe layer within the first region and the second silicon layers are doped to form a source and a drain.

With continuous development of semiconductor technology, semiconductor devices are desired to have high device density with high degree of integration in order to obtain a high operation speed, large data storage and more functions. Gate lengths of transistors are thus becoming narrower and shorter than ever. As a result, short channel effect is more likely to occur.
Currently, there are several solutions for suppressing the short channel effect. One of the solutions is to increase the resistance between the source and drain by forming lightly doped regions in the source and drain or using a semiconductor on insulator (SOI) substrate. Another solution is to reduce carrier mobility in the channel region between the source and the drain, by overly doping ions with opposite conductivity type into channel regions, pocket regions and/or halo regions.
SiGe on insulator (SGOI) substrate is a typical SOI substrate. A SGOI substrate may include a strained SiGe layer on an insulation layer. The SiGe layer of the substrate often provides high carrier mobility and low contact capacitance. For this reason, when the SGOI substrate is used as a substrate to form transistors, the short channel effect may be suppressed and transistor performance may be improved.
However, SGOI wafers are generally expensive due to complexity of their formation processes. Further, transistors formed on SGOI substrates are difficult to be integrated with semiconductor devices formed on silicon substrates.
Therefore, there is a need to provide a transistor and a method for forming the transistor with suppressed short channel effect.

Transistor and method for forming the same

Semiconductor Manufacturing International Corp.


A method of manufacturing a semiconductor device comprises steps of: (a) providing a semiconductor substrate comprising an upper, tensilely strained lattice semiconductor layer and a lower, unstressed semiconductor layer; and (b) forming at least one MOS transistor on or within the tensilely strained lattice semiconductor layer, wherein the forming comprises a step of regulating the drive current of the at least one MOS transistor by adjusting the thickness of the tensilely strained lattice semiconductor layer. Embodiments include CMOS devices formed in substrates including a strained Si layer lattice-matched to a graded composition Sixe2x80x94Ge layer, wherein the thickness of the strained Si layer of each of the PMOS and NMOS transistors is adjusted to provide each transistor type with maximum drive current.

The present invention relates to methods of manufacturing improved performance, narrow width, high operating speed, CMOS devices comprised of one or more of each of NMOS and PMOS transistors, on strained lattice semiconductor substrates, and to improved CMOS devices obtained thereby. More specifically, the present invention relates to methods for fabricating such devices wherein the stress level within the strained lattice semiconductor layer of the NMOS and PMOS portions of the device is differentially adjusted to maximize the respective drive currents.
The escalating requirements for high density and performance associated with ultra-large-scale integration (ULSI) semiconductor devices require design features of 0.18 xcexcm and below, e.g., such as 0.15 xcexcm and 0.12 xcexcm, increased transistor and circuit speeds, high reliability, and increased manufacturing throughput for economic competitiveness. The reduction of design features to 0.18 xcexcm and below challenges the limitations of conventional semiconductor materials and manufacturing techniques.
A conventional approach for forming a plurality of active devices in or on a common semiconductor substrate, e.g., as in the case of forming CMOS devices comprising at least a pair of PMOS and NMOS transistors in spaced adjacency, involves division of a starting material, i.e., a semiconductor substrate of suitable characteristics, into active regions where the transistors are to be formed, and field dielectric regions that electrically isolate adjacent active regions.
According to current technology utilizing conventional crystalline semiconductor wafers as substrates, the starting material may, for example, comprise a lightly p-doped epitaxial (xe2x80x9cepixe2x80x9d) layer of silicon (Si) grown on a heavily-doped, crystalline Si substrate. The low resistance of the heavily-doped substrate is necessary for minimizing susceptibility to latch-up, whereas the light doping of the epi layer permits independent tailoring of the doping profiles of both the p-type and n-type wells formed therein as part of the fabrication sequence, thereby resulting in optimal PMOS and NMOS transistor performance.
The use of the very thin epi layers, i.e., several xcexcm thick, is made possible by performing the isolation processing by means of shallow trench isolation (xe2x80x9cSTIxe2x80x9d) techniques rather than by high temperature local oxidation of silicon (xe2x80x9cLOCOSxe2x80x9d) technology. The STI technique advantageously minimizes up-diffusion of p-type dopant(s) from the more heavily-doped substrate into the lightly-doped epi layer. In addition, and critical for fabrication of devices with design rule of 0.25 xcexcm and below, STI allows for closer spacing of adjacent active areas by avoiding the xe2x80x9cbird""s beakxe2x80x9d formed at the edge of each LOCOS isolation structure. STI also provides better isolation by creating a more abrupt structure, reduces the vertical step from active area to isolation to improve gate lithography control, eliminates the high temperature field oxidation step that can cause problems with large diameter, i.e., 8 inch, wafers, and is scalable to future logic technology generations.
Recently, there has been much interest in various approaches with the aim or goal of developing new semiconductor materials which provide increased speeds of electron and hole flow therethrough, thereby permitting fabrication of semiconductor devices, such as integrated circuit (IC) devices with higher operating speeds, enhanced performance characteristics, and lower power consumption. One such material which shows promise in attaining the goal of higher device operating speeds is termed xe2x80x9cstrained siliconxe2x80x9d.
According to this approach, a very thin, tensilely strained, crystalline silicon (Si) layer is grown on a relaxed, graded composition Sixe2x80x94Ge buffer layer several microns thick, which Sixe2x80x94Ge buffer layer in turn is formed on a suitable crystalline substrate, e.g., a Si wafer or a silicon-on-insulator (SOI) wafer. Strained Si technology is based upon the tendency of the Si atoms, when deposited on the Sixe2x80x94Ge buffer layer, to align with the greater lattice constant (spacing) of the Si and Ge atoms therein (relative to pure Si). As a consequence of the Si atoms being deposited on a substrate (Sixe2x80x94Ge) comprised of atoms which are spaced further apart, they xe2x80x9cstretchxe2x80x9d to align with the underlying Si and Ge atoms, thereby xe2x80x9cstretchingxe2x80x9d or tensilely straining the deposited Si layer. Electrons and holes in such strained Si layers have greater mobility than in conventional, relaxed Si layers with smaller inter-atom spacings, i.e., there is less resistance to electron and/or hole flow. For example, electron flow in strained Si may be up to about 70% faster compared to electron flow in conventional Si. Transistors and IC devices formed with such strained Si layers can exhibit operating speeds up to about 35% faster than those of equivalent devices formed with conventional Si, without necessity for reduction in transistor size.
However, a problem exists with respect to the design and fabrication of optimal performance CMOS devices comprised of at least one pair of narrow-width (W) PMOS and NMOS transistors less than about 1 xcexcm wide utilizing strained lattice semiconductor substrates. Specifically, it has heretofore been difficult to manufacture narrow-width CMOS devices based on strained lattice semiconductor substrates wherein the drive currents of the PMOS and NMOS transistor components thereof are simultaneously maximized. Consider the following apparent competing characteristics or tendencies of narrow-width PMOS and NMOS transistors:
(1) when PMOS and NMOS transistors are fabricated with narrow widths (i.e.,  less than 1 xcexcm) utilizing STI methodology for segmentation of the substrate into active regions where the transistors are to be formed, a compressive stress is exerted on the upper stratum or layer of the adjacent active device regions of the segmented semiconductor substrate spaced apart by the STI region, arising from the insulative material, typically a silicon oxide, filling the STI trench. As a consequence, the drive current of a narrow width PMOS transistor fabricated on or within an active device area subject to such compressive stress is increased, relative to a similar-dimensioned PMOS transistor formed on or within an unstressed semiconductor substrate, whereas the drive current of a narrow width NMOS transistors fabricated on or within the active device area subject to such compressive stress is decreased, relative to a similar-dimensioned NMOS transistors formed on or within an unstressed semiconductor substrate; and
(2) the drive current of a PMOS transistor fabricated on or within a tensilely stressed active device area formed in a strained lattice semiconductor substrate, e.g., strained Si on Sixe2x80x94Ge, is decreased, relative to a similar dimensioned PMOS transistor formed on or within an unstressed semiconductor substrate, whereas the drive current of an NMOS transistor fabricated on or within a tensilely stressed active device area is increased, relative to a similar-dimensioned NMOS transistor formed on or within an unstressed semiconductor substrate.
Accordingly, and in view of the above-described apparent competing characteristics or tendencies of PMOS and NMOS transistors, there exists a need for improved semiconductor design and manufacturing methodology for fabricating CMOS devices on strained lattice semiconductor substrates comprised of narrow-width constituent PMOS and NMOS transistors, which methodology recognizes the above competing effects on the PMOS and NMOS drive currents. Moreover, there exists a need for improved methodology for CMOS device fabrication on strained lattice semiconductor substrates which is fully compatible with conventional process flow for automated manufacturing at rates consistent with the requirements for economic competitiveness.
The present invention, wherein the level of tensile stress in the strained semiconductor layer segments forming active regions for PMOS and NMOS transistors are differentially adjusted (i.e., maximized or minimized) by thickness variation thereof, to maximize the drive currents of both transistor types, effectively eliminates, or at least minimizes, disadvantageous unbalanced drive current performance of the PMOS and NMOS transistors arising from the above-described apparent competing characteristics or tendencies. As a consequence, the inventive methodology facilitates design and manufacture of high speed, high performance, reduced power consumption CMOS devices utilizing strained semiconductor technology. Further, the methodology afforded by the present invention enjoys diverse utility in the manufacture of numerous and various MOSFET-based semiconductor devices and/or components which require use of strained semiconductor technology for enhancement of device speed and reduced power consumption.
An advantage of the present invention is an improved method for manufacturing a semiconductor device comprising a strained lattice semiconductor layer.
Another advantage of the present invention is an improved method for manufacturing a MOS transistor device comprising a strained lattice semiconductor layer.
Yet another advantage of the present invention is an improved method for manufacturing a CMOS device comprising a strained lattice semiconductor layer, wherein the drive currents of the component PMOS and NMOS transistors are maximized.
Still another advantage of the present invention is an improved semiconductor device comprising a strained lattice semiconductor layer.
A further advantage of the present invention is an improved MOS transistor device comprising a strained lattice semiconductor layer.
A still further advantage of the present invention is an improved CMOS device comprising a strained lattice semiconductor layer, wherein the drive currents of the component PMOS and NMOS transistors are maximized.
Additional advantages and other aspects and features of the present invention will be set forth in the description which follows and in part will become apparent to those having ordinary skill in the art upon examination of the following or may be learned from the practice of the present invention. The advantages of the present invention may be realized and obtained as particularly pointed out in the appended claims.
According to the invention, the foregoing and other advantages are obtained in part by a method of manufacturing a semiconductor device, comprising steps of:
(a) providing a semiconductor substrate comprising an upper, tensilely strained lattice semiconductor layer and a lower, unstressed semiconductor layer, and
(b) forming at least one MOS transistor on or within the tensilely strained lattice semiconductor layer, wherein the forming comprises a step of regulating the drive current of the at least one MOS transistor by adjusting the thickness of the tensilely strained lattice semiconductor layer.
According to embodiments of the present invention, step (b) comprises forming the at least one MOS transistor as a PMOS transistor or an NMOS transistor having a narrow width less than about 1 xcexcm; and according to certain embodiments of the invention, step (a) comprises providing a semiconductor substrate wherein the upper, tensilely strained lattice semiconductor layer has a pre-selected initial thickness; and step (b) comprises forming the at least one MOS transistor on or within the tensilely strained lattice semiconductor layer as a PMOS transistor, wherein the forming comprises a step of regulating the drive current of the PMOS transistor by reducing the thickness of the tensilely strained lattice semiconductor layer from the pre-selected initial thickness to a pre-selected final thickness, or step (a) comprises providing a semiconductor substrate wherein the upper, tensilely strained lattice semiconductor layer has a pre-selected initial thickness; and step (b) comprises forming the at least one MOS transistor on or within the tensilely strained lattice semiconductor layer as an NMOS transistor, wherein the forming comprises a step of regulating the drive current of the NMOS transistor by increasing the thickness of the tensilely strained lattice semiconductor layer from the pre-selected initial thickness to a pre-selected final thickness.
In accordance with a particular embodiment of the present invention:
step (a) comprises providing a semiconductor substrate wherein the upper, tensilely strained lattice semiconductor layer has a pre-selected initial thickness; and
step (b) comprises steps of:
(b1) segmenting the substrate into at least one pair of adjacent active device areas separated by isolating means; and
(b2) forming a CMOS device comprising at least one pair of PMOS and NMOS transistors in the at least one pair of adjacent active device areas; wherein the drive current of the PMOS transistor is maximized by reducing the thickness of the tensilely strained lattice semiconductor layer of the respective active device area from the pre-selected initial thickness to a pre-selected final thickness, and the drive current of the NMOS transistor is maximized by increasing the thickness of the tensilely strained lattice semiconductor layer of the respective active device area from the pre-selected initial thickness to a pre-selected final thickness or by maintaining the thickness of the tensilely strained lattice semiconductor layer of the respective active device area at the pre-selected initial thickness.
According to embodiments of the present invention, step (a) comprises segmenting the substrate into the at least one pair of adjacent active device areas separated by shallow trench isolation (STI) means; and step (b) comprises reducing or increasing the thickness of the tensilely strained lattice semiconductor layer of the respective active device areas from the pre-selected initial thickness to the pre-selected final thickness by means of a semiconductor material removal or deposition process which, by itself, does not affect the tensile stress of the tensilely strained lattice semiconductor layer, whereby obtainment of device performance enhancements attributed to the tensilely strained lattice semiconductor layer is not compromised.
In accordance with certain embodiments of the present invention, step (a) comprises providing a semiconductor substrate including an upper, tensilely strained, crystalline silicon (Si) semiconductor layer lattice-matched to a lower, unstressed, crystalline silicon-germanium (Sixe2x80x94Ge) layer; and step (a) may further comprises providing the semiconductor substrate with a crystalline Si layer or wafer beneath the lower, unstressed, crystalline silicon-germanium (Sixe2x80x94Ge) layer.
Another aspect of the present invention is a semiconductor device, comprising:
(a) a semiconductor substrate including an upper, tensilely strained lattice semiconductor layer and a lower, unstressed semiconductor layer; and
(b) at least one MOS transistor formed on or within the tensilely strained lattice semiconductor layer, wherein the drive current of the at least one MOS transistor is regulated to a pre-selected value by adjustment of the thickness of the tensilely strained lattice semiconductor layer.
According to certain embodiments of the present invention, the at least one MOS transistor is a PMOS transistor or an NMOS transistor having a narrow width less than about 1 xcexcm; and according to particular embodiments, the at least one MOS transistor is a PMOS transistor and the drive current thereof is regulated to the pre-selected value by reducing the thickness of the tensilely strained lattice semiconductor layer from a pre-selected initial thickness to a pre-selected final thickness, or the at least one MOS transistor is an MMOS transistor and the drive current thereof is regulated to the pre-selected value by increasing the thickness of the tensilely strained lattice semiconductor layer from a pre-selected initial thickness to a pre-selected final thickness.
In accordance with further embodiments of the present invention, the semiconductor substrate is segmented into at least one pair of adjacent active device areas separated by isolating means; and the semiconductor device is a CMOS device comprising at least one pair of PMOS and NMOS transistors formed in the at least one pair of adjacent active device areas; wherein the drive current of the PMOS transistor is maximized by reducing the thickness of the tensilely strained lattice semiconductor layer of the respective active device area from a pre-selected initial thickness to a pre-selected final thickness, and the drive current of the NMOS transistor is maximized by increasing the thickness of the tensilely strained lattice semiconductor layer of the respective active device area from a pre-selected initial thickness to a pre-selected final thickness or by maintaining the thickness of the tensilely strained lattice semiconductor layer of the respective active device area at a pre-selected initial thickness.
According to particular embodiments of the present invention, the substrate is segmented into the at least one pair of adjacent active device areas by shallow trench isolation (STI) means, and the thickness of the tensilely strained lattice semiconductor layer of the respective active device areas is reduced or increased from the pre-selected initial thickness to the pre-selected final thickness by means of a semiconductor material removal or deposition process which, by itself, does not affect the tensile stress of the tensilely strained lattice semiconductor layer, whereby obtainment of device performance enhancements attributed to the tensilely strained lattice semiconductor layer is not compromised.
In accordance with certain embodiments of the present invention, the semiconductor substrate includes an upper, tensilely strained, crystalline silicon (Si) semiconductor layer lattice-matched to a lower, unstressed, crystalline silicon-germanium (Sixe2x80x94Ge) layer; and the semiconductor substrate further includes a crystalline Si layer or wafer beneath the lower, unstressed, crystalline silicon-germanium (Sixe2x80x94Ge) layer.
Additional advantages and aspects of the present invention will become readily apparent to those skilled in the art from the following detailed description, wherein embodiments of the present invention are shown and described, simply by way of illustration of the best mode contemplated for practicing the present invention. As will be described, the present invention is capable of other and different embodiments, and its several details are susceptible of modification in various obvious respects, all without departing from the spirit of the present invention. Accordingly, the drawings and description are to be regarded as illustrative in nature, and not as limitative.

Narrow width CMOS devices fabricated on strained lattice semiconductor substrates with maximized NMOS and PMOS drive currents


A magnetized hearing-aid earpiece inductive coupling system includes a hearing-aid earpiece including a magnetized assembly with an inductive coil. The earpiece also includes an earpiece controller that is communicatively coupled with the inductive coil and that controls adjustable settings of the earpiece. A hearing-aid programming device includes a magnetized coupler with a second inductive coil. The magnetized assembly and the magnetized coupler are configured to magnetically hold the two inductive coils in proximity to one another, such that the inductive coils inductively communicatively couple the earpiece controller with the hearing-aid programming device. The hearing-aid programming device is thereby enabled to instruct the earpiece controller to adjust the earpiece's adjustable settings.

Before the invention of modern electronics, hearing loss was mitigated with passive funnel-like amplification cones known as ear trumpets or ear horns. Today, many hearing aids are electro-acoustic devices that are designed to actively amplify and modulate sounds for a wearer. For example, a hearing aid may simply amplify all received sound or may selectively amplify certain frequencies of sound.
Hearing aids can be various shapes and sizes and may be present in various configurations can include portions that are held in and around the ear. Some hearing aids are designed to reside within the ear canal or even be anchored to bone. Regardless of configuration, hearing aids typically comprise a microphone, a speaker (receiver), a battery, and electronic circuitry. Audio processing may be digital or analog and control circuitry may be adjustable or programmable.
Examples of such devices include U.S. Pat. No. 2,017,358, entitled "Hearing Aid Apparatus and Amplifier"; U.S. Pat. No. 4,025,721 entitled "Method of and means for adaptively filtering near-stationary noise from speech"; and U.S. Pat. No. 4,548,082, entitled "Hearing aids, signal supplying apparatus, systems for compensating hearing deficiencies, and methods"
Because users prefer unobtrusive devices, hearing aids are typically small units, which likewise have tiny controls and coupling points. Unfortunately, this makes adjustment and programming of these devices difficult. For example, some hearing aids have small physical adjustment or programming interfaces such as knobs or switches. These interfaces are difficult to use because of their small size, which is especially problematic for users with disabilities or advanced age.
Some hearing aids can be programmed by a connection to a computer or other device, which is typically achieved via a wire. Such programming systems are also deficient because many users will have difficulty connecting such a device to their hearing aid because the connection points are so small. Moreover, such physical connections are dangerous because programming occurs while the hearing aid is being worn, and users can accidently pull a hearing aid out of their ear while it is attached coupled to a wire, or even damage the wire or wire coupling if the wire is pulled.
To remedy the problems associated with wired connections, some hearing aids are operable to be programmed wirelessly. However, hearing aids that are capable of wireless communication are typically heavier and bulkier than hearing aids that utilize wired connections. Additionally, wireless-enabled hearing aids also tend to be more expensive than other types of hearing aids. Lastly, wireless-enabled hearing aids consume battery power at a higher rate, meaning the frequency of battery replacement is increased, and the usable continuous time of the hearing aid is reduced.
Regardless of how an earpiece is programmed, a user is typically not able to program a hearing aid themselves because of the deficiencies discussed above relating to wire coupling or manipulation of small controls. Moreover, many hearing aids are not even designed to be programmed by a user because of these very issues. Accordingly, an audiologist is usually required to program hearing aids along with associated direct or indirect labor costs. Naturally, having to engage an audiologist in hearing aid programming is cumbersome for users, and makes it difficult to address hearing aid issues immediately. For example, audiologists have limited working hours and availability and are therefore unable to adjust a user's hearing aid during non-business hours or may not have open appointments that suit a user's schedule.


An internal signal test device tests a cycle of a specific internal signal by distinguishing a high level period and a low level period of the internal signal, at a wafer and package state by using an external test equipment. The internal signal test device comprises a refresh cycle generating unit, an input/output selecting control unit and an output buffer. The refresh cycle generating unit generates a refresh cycle signal having a predetermined cycle at entry of a refresh mode. The input/output selecting control unit selectively outputs the refresh cycle signal and a data signal in response to a test mode signal. The output control unit outputs an output signal from the input/output selecting control unit to an external output pin in response to an output clock signal controlled by the test mode signal.

1. Field of the Invention
The present invention generally relates to an internal signal test device and a method thereof, and more specifically, to a technology of testing a cycle of an internal signal by distinguishing a high level period and a low level period of the internal signal, at a wafer and package state by using an external test equipment.
2. Description of the Prior Art
Generally, a semiconductor memory device outputs an internal signal such as a refresh signal. Here, since the cycle of the internal signal is easily varied depending on changes of a process and a temperature, the cycle of the internal signal is required to be tested in order to sense the changes.
However, there are no methods for testing an internal signal at a wafer or package state. In the prior art, the internal signal is observed by naked eyes in oscilloscope using a pico probe.
The observation by naked eyes is not precise, and although changes in the cycle of other internal signals depending on changes of the process and the temperature are sensed, economical and temporal consumption becomes larger to compensate the changes.

Internal signal test device and method thereof


A machine for labeling containers, especially bottles or the like, with a stationary machine rack on which a rotary table for conveying containers is supported, and at least one labeling module, arranged to be interchangeable at or on a machine rack, for labeling the containers being guided past the labeling module by the rotary table wherein its own motor is assigned respectively to the rotary table and at least one labeling module. In order to simplify a change or replacement of a labeling module, the motor is located on the machine rack and remains there.

Such labeling machines are known from DE19741476, for example. In the labeling machine described there a rotary table is supported upon a table top arranged on a under-rack. On the circumference of the rotary table labeling sets are arranged that serve to fasten labels on containers transported on the rotary table. Each labeling set has its own motor by which it forms a spatially self-contained unit. This unit is arranged on the rotary table.
Thanks to the labeling sets, it is possible to adapt the labeling machine to various equipment variants and/or types of containers, for example varying types of bottles. Thereupon, the sets can be removed from the table top by their respective motors and replaced by new sets with their own motors appropriate to the changed containers.
WO2005/068302 shows a similar labeling machine. In this the sets with their motors are not supported on a table but on a machine rack. Here free-standing labeling sets are used that are arranged on the machine rack such that the containers can be appropriately labeled on the rotary table. With these labeling machines the sets with their motors can be exchanged as well, so there is the advantage that the sets can be easily and simply positioned thanks to a set's respective carrying rack.
With these labeling machines known from prior art, a separate motor is assigned to each labeling set in order to reduce the use of gear wheels, chains, toothed belts, cardan shafts or the like, that are necessary with the use of a single central drive motor, thereby controlling high production and mounting cost. In addition these labeling machines run more quietly.
However, as a disadvantage with these labeling machines, it has turned out that these relatively large sets require lots of room when they are not being used and can be exchanged or replaced only under complicated conditions because of their large mass. Further the labeling sets are very expensive due to the large number of different construction parts. As a labeling machine is used often for various types of containers and equipment variants, by force a large number of labeling sets remain idle in the meantime.


An electronic mail receiving apparatus used in a system including an electronic mail transmitting apparatus, the electronic mail receiving apparatus, and an electronic mail server, includes: a communicating unit executes a first-kind electronic mail communication performed via the electronic mail server, and a second-kind electronic mail communication performed not via the electronic mail server; and a mail output controller configured to control an outputting unit configured to output an electronic mail received from the electronic mail transmitting apparatus. The communicating unit includes: a first information transmitting unit configured to, if a first-kind electronic mail is received by executing the first-kind electronic mail communication, transmit, to the electronic mail transmitting apparatus, reception information; and a second information transmitting unit configured to, if a second-kind electronic mail is received by executing the second-kind electronic mail communication, transmit, to the electronic mail transmitting apparatus, reception information by the communication session.

The present disclosure discloses an art which is used in a system including a plurality of electronic mail communication apparatuses and an electronic mail server.
A related facsimile multifunction apparatus has a function of executing an electronic mail communication via an individual mail server, and a function (the so-called direct SMTP) of executing an electronic mail communication in accordance with the SMTP (Simple Mail Transform Protocol) and not via an individual mail server.
In the case where a facsimile multifunction apparatus is to transmit an electronic mail to a terminal device by using the direct SMTP, the facsimile multifunction apparatus and the terminal device establish a communication session. Usually, the terminal device transmits reception information indicative of reception of the electronic mail, to the facsimile multifunction apparatus by using the communication session which is used for receiving the electronic mail. Therefore, the facsimile multifunction apparatus can know that the terminal device receives the electronic mail.
On the other hand, in the case where the facsimile multifunction apparatus is to transmit an electronic mail to a terminal device via an individual mail server, the facsimile multifunction apparatus transmits the electronic mail to the individual mail server. The terminal device receives the electronic mail which is transmitted from the facsimile multifunction apparatus, and which is stored in the individual mail server, from the individual mail server. Namely, the terminal device receives the electronic mail transmitted from the facsimile multifunction apparatus, without establishing a communication session with the facsimile multifunction apparatus. In the electronic mail communication via the individual mail server, therefore, the facsimile multifunction apparatus cannot receive reception information from the terminal device in the same manner as the electronic mail communication using the direct SMTP.
In the disclosure, an art is provided in which, both in the case where the electronic mail communication is executed via the electronic mail server, and in the case where the electronic mail communication is executed not via the electronic mail server, the electronic mail communication apparatus which is the transmission source of the electronic mail can know that the electronic mail is received by the electronic mail communication apparatus which is the transmission destination of the electronic mail.
According to an aspect of the disclosure, the following arrangements are provided.
An electronic mail receiving apparatus that is to be used in a system including an electronic mail transmitting apparatus, the electronic mail receiving apparatus, and an electronic mail server which is configured separately from the electronic mail transmitting apparatus and the electronic mail receiving apparatus, the electronic mail receiving apparatus comprising:
a communicating unit configured to execute a first-kind electronic mail communication performed via the electronic mail server, and a second-kind electronic mail communication performed not via the electronic mail server, the second-kind electronic mail communication using a communication session established between the electronic mail transmitting apparatus and the electronic mail receiving apparatus; and
a mail output controller configured to control an outputting unit to output an electronic mail received from the electronic mail transmitting apparatus by the communicating unit,
wherein the communicating unit includes:
a first information transmitting portion configured to, in a first case where a first-kind electronic mail from the electronic mail transmitting apparatus is received by executing the first-kind electronic mail communication, transmit, to the electronic mail transmitting apparatus, first reception information indicating that the first-kind electronic mail is received before the first-kind electronic mail is output by the outputting unit; and
a second information transmitting portion configured to, in a second case where a second-kind electronic mail from the electronic mail transmitting apparatus is received by executing the second-kind electronic mail communication by using the communication session, transmit, to the electronic mail transmitting apparatus, second reception information indicating that the second-kind electronic mail is received by using the communication session.
An electronic mail transmitting apparatus that is to be used in a system including the electronic mail transmitting apparatus, an electronic mail receiving apparatus and an electronic mail server which is configured separately from the electronic mail transmitting apparatus and the electronic mail receiving apparatus, the electronic mail transmitting apparatus comprising:
a communicating unit configured to execute a first-kind electronic mail communication performed via the electronic mail server, and a second-kind electronic mail communication performed not via the electronic mail server, the second-kind electronic mail communication using a communication session established between the electronic mail transmitting apparatus and the electronic mail receiving apparatus,
wherein the communicating unit includes:
a first information receiving portion configured to, in a first case where a first-kind electronic mail is transmitted to the electronic mail receiving apparatus by executing the first-kind electronic mail communication, receive first reception information indicating that a first-kind electronic mail is received, from the electronic mail receiving apparatus, and
a second information receiving portion configured to, in a second case where a second-kind electronic mail is transmitted to the electronic mail receiving apparatus by executing the second-kind electronic mail communication by using the communication session, receive second reception information indicating that the second-kind electronic mail is received, from the electronic mail receiving apparatus by using the communication session, and
wherein the first reception information is transmitted from the electronic mail receiving apparatus before the first-kind electronic mail is output by an outputting unit of the electronic mail receiving apparatus.
A network system comprising:
an electronic mail transmitting apparatus;
an electronic mail receiving apparatus; and
an electronic mail server which is configured separately from the electronic mail transmitting apparatus and the electronic mail receiving apparatus,
wherein the electronic mail transmitting apparatus includes:                a first communicating unit configured to execute a first-kind electronic mail communication performed via the electronic mail server to transmit a first-kind electronic mail, and a second-kind electronic mail communication performed not via the electronic mail server to transmit a second-kind electronic mail, the second-kind electronic mail communication using a communication session established between the electronic mail transmitting apparatus and the electronic mail receiving apparatus,
wherein the electronic mail receiving apparatus includes:                a second communicating unit configured to execute a third-kind electronic mail communication to receive the first-kind electronic mail from the first communicating unit, and the second-kind electronic mail communication to receive the second-kind electronic mail; and
a mail output controller configured to control an outputting unit to output one of the first-kind and second-kind electronic mail received from the electronic mail transmitting apparatus by the second communicating unit,
wherein the second communicating portion includes:                a first information transmitting portion configured to, in a case where the second communicating unit receives the first-kind electronic mail from the first communicating unit, transmit, to the electronic mail transmitting apparatus, first reception information indicating that the first-kind electronic mail is received before the first-kind electronic mail is output by the outputting unit; and        a second information transmitting unit configured to, in a case where the second communicating unit receives the second-kind electronic mail from the first communicating unit, transmit, to the electronic mail transmitting apparatus, second reception information indicating that the second-kind electronic mail is received by using the communication session, and
wherein the first communicating unit includes:
a first information receiving portion configured to receive the first reception information from the first information transmitting unit, and
a second information receiving portion configured to receive the second reception information from the second information transmitting unit by using the communication session.


The subject invention relates to a system and/or methodology that facilitate navigation and monitoring of one or more processes. Within each process, one or more activities or events can be monitored. In particular, navigation through a process can be improved by employing a parameter-based magnification tool. The invention provides for a magnification component that can navigate through aggregations of activities as they relate to one or more processes according to a parameter or metric unit. As a result, a user can view a business process or scheme, for instance, from multiple perspectives at the same time or individually to observe its state or status, trends or patterns, locate problems areas, inefficiencies, or efficiencies within the process, and/or optimize the process or a sub-part thereof.

In conventional computing environments, there are limited viewing, searching, browsing, and management techniques available to users and business users, in particular. For example, existing applications have largely adopted a tree structure folder format for organizing and displaying various types of information. Though some relationships between different types of information can be viewed in this manner, such relationships are limited in scope and are primarily dependent upon explicit user input. In addition, many traditional search and filter user interfaces (UIs) tend to be peripheral to a user's focus and fail to provide an adequate scope of the desired information within a manageable computing environment.
Furthermore, viewing or navigating between vast amounts of information at multiple levels can be problematic and nearly impracticable due to screen space constraints. Thus, user interaction among multiple active objects is not feasible under current practices. Overall, conventional information management systems and techniques merely provide disparate views of various parts of the information, thereby requiring more user time and resources to view, process, and/or manage the information as a whole in a cohesive manner.

This patent is subject to a terminal disclaimer.

Systems and methods that facilitate process monitoring, navigation, and parameter-based magnification


A screening device for a heat exchanger which is arranged in an air duct of a vehicle and the air exit area of which is covered partially by an air duct cross-section tapered downstream of the heat exchanger and partially by an air duct wall subjected to dynamic pressure. The screening device consists exclusively of a flap-type blind, the screening area of which extends only over the partial area of the heat exchanger lying opposite the tapered cross-section of the air duct and by the lateral terminating flap of which an overflow channel between the duct wall and the flap-type blind is also screened off.

The invention relates to a screening device for a heat exchanger of a vehicle.
German Patent 3,631,785 discloses a screening device for dividing an air duct into two subducts: one through which air flows and one through which water flows. With the screening device opened, cooling air can flow through the entire cross-section of the radiator. However, when the vehicle is operated on land, with the screening device completely closed, the flow of cooling air through the radiator is completely closed off. In this mode of operation, one of the subducts is blocked directly by a flap-type blind, which is arranged in front of the radiator, and abuts a partition wall. The flow through the second subduct, on the other hand, is blocked indirectly; that is, by a back pressure space bounded by the partition wall, a duct wall and a separate flap which screens off an overflow opening lying behind the radiator, between the partition wall and the duct wall.
The known division of the air duct is relatively expensive since the partition wall must pass straight through the radiator, and the additional flap requires its own drive and control. In addition, the overall arrangement of the screening device in the air duct requires a considerable amount of installation space, which is frequently unavailable.
Another, screening device of the generic type, which is arranged in a particularly compact air duct, is disclosed in German Offenlegungsschrift 3,836,374. This screening device consists of a single flap-type blind situated in a space-saving manner between a radiator and a fan. Since this flap-type blind completely covers the radiator, the flow of cooling air is completely blocked when the radiator blind is closed. In addition, in the open condition the flaps of the radiator blind, which lie opposite a fan cowl duct wall running obliquely towards the fan aperture, are oriented obliquely towards the fan aperture. As a result, the oblique flaps act as baffle surfaces and require only a small overall depth. However, because the duct wall runs a short distance behind the screening plane of the flap-type blind, the resistance of the radiator to through flow in the region of the oblique flaps is increased considerably. Despite the reduced overall depth of the oblique flaps, that heat-exchanger area of the radiator which is affected by them cannot be fully utilized, particularly during the flow of relative wind through it. If, on the other hand, the distance of the duct wall from the rear edges of the oblique flaps were increased, an undesired enlargement of the fan cowl would also result.
The object of the present invention is to provide a screening device of the generic type for a heat exchanger of a vehicle which is less expensive to construct, and at the same time is suitable for arrangement in a compact air duct.
This and other objects and advantages are achieved according to the invention, in which a flap type blind extends only to that portion of the air flow path adjacent the fan aperture, with a specially shaped lateral terminating flap which seals off air flow in the remainder of the air flow path. Since, according to the invention, all flaps belong to the screening device of the flap-type blind, a drive and a control are required only for the flap-type blind itself. In addition, because the flap-type blind must now only cover that region of the area of the heat exchanger through which air flows virtually in a straight line, only a minimum number of flaps is required.
For a common drive of all flaps of the flap-type blind, it is expedient if their rotational axes lie in a single plan. If the special flap forming the lateral termination of the flap-type blind is mounted on a rotational axis near its rear edge, the sealing wing of the adjacent flap can come to rest against the rear edge of the special flap, which is moved in the same direction but offset at an angle.
If, with the flap-type blind opened, the special flap lies obliquely to the inflow direction of the relative wind, it can have a rotating angle corresponding to that of the remaining flaps, a common drive thereby being further simplified. Moreover, optimum utilization of the construction space is possible if, with the flap-type blind in the open position, the leading edge of the special flap lies in the same plane with the leading edges of the remaining flaps. In this arrangement, the leading edges can extend almost as far as the exit are of the heat exchanger.
In order for the special flap to overlap with the adjacent flap (which corresponds to the remaining flaps), the special flap can be provided with an angled wing. The length of this wing, however, should be restricted to the dimension of the flap overlap since, with the flap-type blind opened, the leg protrudes into the overflow opening.
Because of its compact construction, the screening device according to the invention is highly suitable for arrangement as a radiator blind in cramped fan cowls of motor vehicles.
In addition, use on heat exchangers, such as those which are common in motor vehicles for heating or air conditioning, would however also be conceivable.
Other objects, advantages and novel features of the present invention will become apparent from the following detailed description of the invention when considered in conjunction with the accompanying drawings.

Screening device for a heat exchanger of a vehicle


This invention provides a padfolio, portfolio, case, bag or other business accessory that carries, on an exterior surface, a pocket flap that is typically open at the top edge and joined at a bottom edge. It has a size sufficient to completely cover a predetermined range of conventional documents (or other items), and in one embodiment, has side walls that taper from a wider bottom that may be longer than the predetermined documents to a narrower top that is typically shorter than the predetermined documents so that the side edges of the predetermined documents are at least partially visible to evidence their presence in the pocket. A narrow elastic strip joins each of the opposing side edges to the exterior surface at a location along the exterior surface that is outboard of opposing edges of the predetermined documents so that they may slide into the pocket free of interference for the joint between the elastic strips and the exterior surface. The tension generated by the strips is, however, sufficient to maintain holding friction, via the pocket flap on the documents, but enables expansion of the flap to admit thicker items when desired, including machinery for providing decoration to the flap. In an illustrative embodiment, the strips may be less than one half the total length of the side edges.

1. Field of the Invention
This invention relates to padfolios, portfolios, cases bags and other business accessories with outer pockets.
2. Background Information
Padfolios, portfolios, cases, bags and other business accessories are widely used and a variety of shapes and styles are available. These items carry a wide range of sleeves and pockets along their interior and exterior surfaces. Outer pockets are particularly useful for often-used papers, or those that must be put-away or retrieved rapidly without resorting to the potentially more-time-consuming task of accessing the item's interior. Exterior pockets may contain zippered closures for added security and to pre-vent inadvertent loss of documents, etc. However, the more secure a pocket, typically the harder it is to retrieve documents therefrom—and the more difficult it becomes to identify whether the documents are even present in the pocket. Overlying all these concerns in pocket design is the fundamental desire for a stylish look for both the pocket and overall item.

Padfolio with tapered elastic outer pocket


This invention relates to novel indane acetic acid derivatives which are useful in the treatment of diseases such as diabetes, obesity, hyperlipidemia, and atherosclerotic diseases and to pharmaceutical compositions containing these compounds.

Non-insulin dependent diabetes mellitus (NIDDM), or Type II diabetes, is the more common form of diabetes, with 90-95% of hyperglycemic patients experiencing this form of the disease. In Type II diabetes, there appears to be a reduction in the pancreatic β-cell mass, several distinct defects in insulin secretion, or a decrease in tissue sensitivity to insulin. The symptoms of this form of diabetes include fatigue, frequent urination, thirst, blurred vision, frequent infections and slow healing of sores, diabetic nerve damage, retinopathy, micro and macro blood vessel damage, and heart and renal disease.
Resistance to the metabolic actions of insulin is one of the key features of Type II diabetes. Insulin resistance is characterized by impaired uptake and utilization of glucose in insulin-sensitive target organs, for example, adipocytes and skeletal muscle, and by impaired inhibition of hepatic glucose output. Functional insulin deficiency, insulin resistance in the periphery, and the failure of insulin to suppress hepatic glucose output results in fasting hyperglycemia. Pancreatic β-cells compensate for the insulin resistance by secreting increased levels of insulin. However, the β-cells are unable to maintain this high output of insulin, and eventually, the glucose-induced insulin secretion falls, leading to the deterioration of glucose homeostasis and to the subsequent development of overt diabetes. Hyperinsulinemia is also linked to insulin resistance, hypertriglyceridemia, low high-density lipoprotein (HDL) cholesterol, and increased plasma concentration of low-density lipoproteins (LDL). The association of insulin resistance and hyperinsulinemia with these metabolic disorders has been termed "Syndrome X," and has been strongly linked to an increased risk of hypertension and coronary artery disease.
Obesity is an excessive accumulation of adipose tissue. Excess adipose tissue is associated with the development of serious medical conditions, for example, Type II diabetes, hypertension, coronary artery disease, hyperlipidemia, obesity, and certain malignancies. The adipocyte may also influence glucose homeostasis through the production of tumor necrosis factor α (TNFα) and other molecules.
Atherosclerotic disease is known to be caused by a number of factors, for example, hypertension, diabetes, low levels of high-density lipoprotein (HDL), and high levels of low-density lipoprotein (LDL). Atherosclerotic diseases include cardiovascular disease, coronary heart disease (CHD), cerebrovascular disease, and peripheral vessel disease. Coronary heart disease includes CHD death, myocardial infarction, and coronary revascularization. Cerebrovascular disease includes ischemic or hemorrhagic stroke, and transient ischemic attacks.
Accordingly, despite the presence of some pharmaceuticals that are used to treat these diseases, there remains a need for new pharmaceuticals that are both safe and effective agents for the treatment of disease, and for useful methods to prepare them.
The present invention relates to compounds which are useful in the treatment of diabetes and related disorders such as Syndrome X, impaired glucose tolerance, impaired fasting glucose, and hyperinsulinemia; obesity; atherosclerotic disease and related disorders such as hypertriglyceridemia and hypercholesteremia; cardiovascular disease; and cerebrovascular disease.

Indane acetic acid derivatives and their use as pharmaceutical agents


A method for translating transaction messages includes receiving, by a server from an acquirer, an inbound transaction message that is associated with a transaction and pursuant to a first message format supported by the acquirer. The server translates the inbound transaction message from the first message format to a second message format supported by the server when the first and second message formats are different. The server processes the inbound transaction message having the second message format and generates an outbound transaction message having the second message format. The server translates the outbound transaction message from the second message format to a third message format supported by an issuer that corresponds to the transaction when the second and third message formats are different, and transmits the translated outbound transaction to the issuer for processing the transaction. Thus, the method allows the server to translate transaction messages between different message formats.

Financial institutions, such as acquirers and issuers, interact with each other by transmitting and receiving transaction messages via payment networks. These transaction messages pertain to authorization, clearing, and settlement of transactions. The transaction messages transmitted and received by a financial institution have a specific format supported by the financial institution. For example, major payment networks, such as Mastercard®, RuPay®, and Diners Club®, support a standard message format (such as ISO8583). Similarly, there are many acquirers and issuers that support the standard message format.
However, certain financial institutions, such as local financial institutions of a country, support a domestic message format of the corresponding country and do not support the standard message format. Hence, when such local financial institutions engage in cross-country transactions or when they wish to avail services of a major payment networks, transaction messages from these financial institutions are routed to third-party vendors that translate the transaction messages having the domestic message formats to the standard message format and vice-versa.
A third-party vendor, typically, caters to a single country, translating transaction messages between the standard message format and a domestic message format associated with the corresponding country. Therefore, cross-country transactions between these local financial institutions involve multiple third-party vendors. Involvement of the third-party vendors in transactions may introduce security risks, since transaction messages often involve sensitive financial data. The involvement of multiple third-party vendors also causes delays in transmission and reception of the transaction messages, thereby causing delays in transaction processing.
In light of the foregoing, there exists a need for a solution that solves the aforementioned problems and eliminates the involvement of third-party vendors in transaction processing.

Method and system for translating transaction messages


A base station apparatus for operation as part of an access network of a mobile telecommunications network includes; a housing; a radio interface unit and a core network interface unit in the housing; a network line section between the radio interface unit and the core network interface unit; and a measuring apparatus, operatively connected to the network line section. The measuring apparatus is configured to detect at least one line parameter of the network line section, the at least one line parameter including a line parameter from the group of line parameters consisting of: the input impedance of the network line section; the insulation value of the network line section; the capacitance of the network line section; and the inductance of the network line section.

Various conventional methods for ensuring the security of user data in cellular mobile radio networks exist. For example, the various mobile radio standards provide a number of functionalities for encrypting, and ensuring the integrity of, both user data and signaling data.
In current mobile radio systems such as UMTS (Universal Mobile Telecommunications System) and LTE (Long Term Evolution), there are a number of different encryption approaches which are typically used in all mobile radio networks. These include, inter alia, the mutual authentication of the terminal, that is to say the telecommunications terminal, with respect to the mobile radio network and of the mobile radio network with respect to the telecommunications terminal. These methods are also referred to using the keyword authentication. Encryption of the radio data transmission is provided between the telecommunications terminal (also referred to as the terminal below) and the radio network controller RNC for the case of a UMTS network and between the telecommunications terminal and the LTE base station (eNodeB). This encryption of the radio data transmission is also referred to using the keyword ciphering. Integrity of the radio data transmission is ensured between the telecommunications terminal and the radio network controller (RNC) and between the telecommunications terminal and the LTE base station (eNB). This is also referred to using the keyword integrity protection.
In conventional mobile radio systems such as the GSM system (Global System for Mobile Telecommunications) and UMTS, the radio protection (that is to say the encryption or guarantee of integrity) typically terminates in those network elements which are set up at a location which is not accessible to third parties, namely the base station system (BSS, Base Station Subsystem) or the radio network controller (RNC), in particular. This termination of the protection at locations which are not accessible to third parties is not the case according to the LTE standard because there the radio protection (that is to say the implementation of encryption and a guarantee of integrity) ends in the LTE base station, that is to say in the eNodeB, which need not necessarily be at a location which is inaccessible to third parties.
On account of a trend for making mobile radio network elements smaller and smaller, in particular using so-called femtocells or picocells, there is a tendency to install network elements at end customers. This does not ensure that third parties do not have physical access to such network elements, with the result that the risk of attacks on the data transmission is increased.

Base station apparatus for operation as part of an access network of a telecommunications network


A robotic vacuum cleaner having a nozzle inlet facing a surface to be cleaned, and a rotatable side brush. The rotatable side brush has bristles extending substantially in parallel with the surface to be cleaned, and the nozzle inlet includes a frame structure forming an opening, the opening being arranged in fluid communication with a debris receptacle. The bristles extend over a side portion of the nozzle inlet. The frame structure has a base portion extending substantially in parallel with the surface to be cleaned. The base portion extends at a first level. The frame structure at the side portion extends substantially in parallel with the surface to be cleaned at a second level. The first level is arranged closer to the surface to be cleaned than the second level.

A robotic vacuum cleaner forms of a self-propelling unit provided with a drive arrangement comprising a control system configured to control a movement of the robotic vacuum cleaner along a surface to be cleaned. The control system may comprise one or more sensors providing input to assist in controlling the movement of the robotic vacuum cleaner. A vacuum producing unit of the robotic vacuum cleaner is arranged in fluid communication with an opening of a nozzle inlet facing the surface to be cleaned. Debris sucked or otherwise propelled into the opening is directed into a debris receptacle of the robotic vacuum cleaner. The debris receptacle is emptied, or replaced, when filled with debris to a certain degree.
Since a robotic vacuum cleaner is to move freely about a surface to be cleaned it would be limited in its movements by an electric cord. Thus, a robotic vacuum cleaner is battery powered and the cleaning capability of a robotic vacuum cleaner has to be designed with the capacity of the on-board battery in mind. Accordingly, the drive arrangement, the capacity of the vacuum producing unit, the use of various rotating brushes, etc. affect consumption of electric power and thus, the design of a robotic vacuum cleaner.
Some robotic vacuum cleaners are provided with a rotatable side brush extending beyond a housing of the robotic vacuum cleaner. The rotatable side brush is arranged to brush debris from an area beside the housing and the nozzle inlet to the nozzle inlet, or at least within reach of a suction produced around the nozzle inlet by the vacuum producing unit.
Such a rotatable side brush should not impede the movement of the robotic vacuum cleaner. Thus, in a robotic vacuum cleaner comprising a rotatable side brush, design considerations include selecting a position of the rotatable side brush to not hinder the movement of the robotic vacuum cleaner, and selecting a clearance to the surface to be cleaned to permit the rotatable side brush to rotate more or less freely underneath the housing of the robotic vacuum cleaner. Accordingly, the position of the rotatable side brush and the clearance to the surface to be cleaned may not be optimal from a cleaning efficiency perspective. Moreover, use of a rotatable side brush may influence other design measures affecting the cleaning capacity of the robotic vacuum cleaner, or the battery capacity of the robotic vacuum cleaner.


In certain aspects, a semiconductor die includes a power rail, a first gate, and a second gate. The semiconductor die also includes a first gate contact electrically coupled to the first gate, wherein the first gate contact is formed from a first middle of line (MOL) metal layer, and a second gate contact electrically coupled to the second gate, wherein the second gate contact is formed from the first MOL metal layer. The semiconductor die further includes an interconnect formed from a second MOL metal layer, wherein the interconnect is electrically coupled to the first and second gate contacts, and at least a portion of the interconnect is underneath the power rail.

Field
Aspects of the present disclosure relate generally to routing on a die, and more particularly, to middle of line (MOL) routing on a die.
Background
A semiconductor die may include many semiconductor devices (e.g., transistors). The semiconductor devices may be interconnected by one or more metal layers to form integrated circuits. As the dimensions of devices scale down, routing congestion on a die increases, making it more difficult to interconnect devices on the die.

Power rail inbound middle of line (MOL) routing


A compressible package having pair of scored sidewalls, which facilitate compression of the package into a wedge shape for storage in narrow recesses. Optionally, the compressible package may include a scored bottom flap wherein the bottom portion of the sidewalls and the bottom flap are shaped such that when the carton is compressed by a user the resulting shape of the bottom flap complements the shape of the sidewalls, maintaining a substantially closed carton. Preferably the compressible package is a carton for storing and dispensing tissue and the carton assumes a wedge shape, which allows the carton to be fit into tight spaces, such as between the seat and the center console of the automobile while maintaining a substantially closed carton.

Increasingly, producers of consumer product dispensers, such as facial tissue cartons, are interested in alternative shapes besides the typical parallelepiped shapes generally offered. A parallelepiped (rectangular prism) can offer several advantages such as efficient packing of the product, efficient distribution of the product, and efficient board utilization to make the carton. However, consumers have grown accustomed to such shapes and there is little differentiation from one product to another. Graphical treatments can help, but the basic dispenser shapes are still largely the same for all manufacturers.
While well adapted to the storage and dispersal of tissue, such shaped dispensers are typically not sized or shaped for efficient use outside of the home. Alternative shaped dispensers have been proposed, however, they do not satisfy all of the consumer's out of home tissue dispensing needs and often consist of shapes and sizes that significantly increase product distribution costs, which are passed on to customers, making potential alternative dispenser shapes more expensive for retailers and consumers alike and therefore potentially less desirable.
One particular out-of-home location where traditional dispensers are inefficient is the automobile. Traditional dispensers do not fit into convenient locations within the driver's reach, such as map pockets, dash pockets or console compartments. Consequently tissue packages are usually placed on the front or back seat, the floor, the rear window shelf or glove compartments which may be hard to reach. Placement in these locations also means the packages often get stepped on, sat upon or smashed when something is accidentally placed on top of them, often resulting in damage to the dispensing feature of the carton where the opening is torn or bent, thus causing the tissues to tear while dispensing. Another problem is that the packages move around and can't be found. They slide along the seat, the floor, or under the seat. Packages may become located under the driver's feet or near the car foot pedals, which may create a safety hazard. The fact that the facial tissue packages are often not held securely in place and are difficult to find can also be hazardous if the driver becomes distracted in searching for the tissue package and is unable to use both hands for driving.
Therefore, a need exists for dispenser shapes that are significantly differentiated from the typical parallelepiped shape, yet, at the same time, can be readily used out of home and particularly in automobiles. Accordingly, the present invention provides a collapsible carton that overcomes the limitations of prior art tissue containers.