A method for controlling a vapour compression system having an ejector includes, in the case that a pressure difference between a pressure prevailing in the receiver and a pressure of refrigerant leaving the evaporator decreases below a first lower threshold value, the pressure of refrigerant leaving the heat rejecting heat exchanger is kept at a level which is slightly higher than the pressure level providing optimal coefficient of performance.

In some vapour compression systems an ejector is arranged in a refrigerant path, at a position downstream relative to a heat rejecting heat exchanger. Thereby refrigerant leaving the heat rejecting heat exchanger is supplied to a primary inlet of the ejector. Refrigerant leaving an evaporator of the vapour compression system may be supplied to a secondary inlet of the ejector.
An ejector is a type of pump which uses the Venturi effect to increase the pressure energy of fluid at a suction inlet (or secondary inlet) of the ejector by means of a motive fluid supplied to a motive inlet (or primary inlet) of the ejector. Thereby, arranging an ejector in the refrigerant path as described above will cause the refrigerant to perform work, and thereby the power consumption of the vapour compression system is reduced as compared to the situation where no ejector is provided.
An outlet of the ejector is normally connected to a receiver, in which liquid refrigerant is separated from gaseous refrigerant. The liquid part of the refrigerant is supplied to the evaporator, via an expansion device, and the gaseous part of the refrigerant may be supplied to a compressor unit. It is desirable to operate the vapour compression system in such a manner that as large a portion as possible of the refrigerant leaving the evaporator is supplied to the secondary inlet of the ejector, and the refrigerant supply to the compressor unit is primarily provided from the gaseous outlet of the receiver, because this is the most energy efficient way of operating the vapour compression system.
At high ambient temperatures, such as during the summer period, the temperature as well as the pressure of the refrigerant leaving the heat rejecting heat exchanger is relatively high. In this case the ejector performs well, and it is advantageous to supply all of the refrigerant leaving the evaporator to the secondary inlet of the ejector, and to supply gaseous refrigerant to the compressor unit from the receiver only, as described above. When the vapour compression system is operated in this manner, it is sometimes referred to as 'summer mode'.
On the other hand, at low ambient temperatures, such as during the winter period, the temperature as well as the pressure of the refrigerant leaving the heat rejecting heat exchanger is relatively low. In this case the ejector is not performing well, and refrigerant leaving the evaporator is therefore often supplied to the compressor unit instead of to the secondary inlet of the ejector. When the vapour compression system is operated in this manner, it is sometimes referred to as 'winter mode'. As described above, this is a less energy efficient way of operating the vapour compression system, and it is therefore desirable to operate the vapour compression system in the 'summer mode', i.e. with the ejector operating, at as low ambient temperatures as possible.
US 2012/0167601 A1 discloses an ejector cycle. A heat rejecting heat exchanger is coupled to a compressor to receive compressed refrigerant. An ejector has a primary inlet coupled to the heat rejecting heat exchanger, a secondary inlet and an outlet. A separator has an inlet coupled to the outlet of the ejector, a gas outlet and a liquid outlet. The system can be switched between first and second modes. In the first mode refrigerant leaving the heat absorbing heat exchanger is supplied to the secondary inlet of the ejector. In the second mode refrigerant leaving the heat absorbing heat exchanger is supplied to the compressor.

Method for controlling a vapour compression system in ejector mode for a prolonged time


A housing for a computer system which can be opened at at least one first housing wall for access into the housing and an opening for an external connecting plug is disposed at a second housing wall and where 1) the housing has a locking device to lock the first housing wall and prevent opening of the housing, the locking device is disposed at the opening for an external connecting plug and is actuatable via an external connecting plug so that the first housing wall is locked when an external connecting plug is inserted into the opening and the first housing wall is unlocked if no external connecting plug is inserted into the opening.

Computer systems have electronic components that are current conducting and/or on which an electric voltage is present. When a housing of a computer system is opened, there is, with improper operation, the danger of an electric shock (so-called "power hazard" or danger of an electric accident). Improper operation is given, for example, by the fact that the computer system is connected to an external current or voltage source via an external connecting plug when the housing is open. This can take place, for example, via a current supplying unit (like a power supply) connected to the supply network (power grid).
High (input) voltages are present in electronic components in the housing, in particular in computer systems in which the power supply for converting the grid-side alternating voltage to a supply voltage is disposed within the housing of the computer system.
It could nonetheless be helpful to provide a safer computer system with respect to improper operation so that the power hazard for a user is considerably reduced or prevented.

Housing for a computer system and a computer system with such a housing

Fujitsu Technology Solutions Intellectual Property GmbH


An interconnecting apparatus employing a lossy power distribution network to reduce power plane resonances. In one embodiment, a printed circuit board includes a lossy power distribution network formed by a pair of parallel planar conductors separated by a dielectric layer.

1. Field of the Invention
This invention relates to electronic systems, and more particularly to power distribution networks embodied within printed circuit boards and semiconductor device packages having continuous planar conductors.
2. Description of the Related Art
Electronic systems typically employ several different types of electrical interconnecting apparatus having planar layers of electrically conductive material (i.e., planar conductors) separated by dielectric layers. A portion of the conductive layers may be patterned to form electrically conductive signal lines or xe2x80x9ctracesxe2x80x9d. Conductive traces in different layers (i.e., on different levels) are typically connected using contact structures formed in openings in the dielectric layers (i.e., vias). For example, printed circuit boards typically have several layers of conductive traces separated by dielectric layers. The conductive traces are used to electrically interconnect terminals of electronic devices mounted upon the PCB. Similarly, semiconductor device packages often have several layers of conductive traces separated by dielectric layers to electronically connect bonding pads of an integrated circuit to terminals (e.g., pins or leads) of the device package.
Signals in digital electronic systems typically carry information by alternating between two voltage levels (i.e., a low voltage level and a high voltage level). A digital signal cannot transition instantaneously from the low voltage level to the high voltage level, or vice versa. The finite amount of time during which a digital signal transitions from the low voltage level to the high voltage level is called the rise time of the signal. Similarly, the finite amount of time during which a digital signal transitions from the high voltage level to the low voltage level is called the fall time of the signal.
Digital electronic systems are continually being produced which operate at higher signal frequencies (i.e., higher speeds). In order for the digital signals within such systems to remain stable for appreciable periods of time between transitions, the rise and fall times of the signals must decrease as signal frequencies increase. This decrease in signal transition times (i.e., rise and fall times) creates several problems within digital electronic systems, including signal degradation due to reflections, power supply xe2x80x9cdroopxe2x80x9d, ground xe2x80x9cbouncexe2x80x9d, and increased electromagnetic emissions.
A signal driven upon (i.e., launched) from a source end of a conductive trace suffers degradation when a portion of the signal reflected from a load end of the trace arrives at the source end after the transition is complete (i.e., after the rise time or fall time of the signal). A portion of the signal is reflected back from the load end of the trace when the input impedance of the load does not match the characteristic impedance of the trace. When the length of a conductive trace is greater than the signal transition time (i.e., the rise or fall time) divided by about 20 times the delay per unit length along the trace, the effects of reflections upon signal integrity (i.e., transmission line effects) should be considered. If necessary, steps should be taken to minimize the degradations of signals conveyed upon the trace due to reflections. The act of altering impedances at the source or load ends of the trace in order to reduce signal reflections is referred to as xe2x80x9cterminatingxe2x80x9d the trace. For example, the input impedance of the load may be altered to match the characteristic impedance of the trace in order to prevent signal reflection. As the transition time (i.e., the rise or fall time) of the signal decreases, so does the length of trace which must be terminated in order to reduce signal degradation.
A digital signal alternating between the high and low voltage levels includes contributions from a fundamental sinusoidal frequency (i.e., a first harmonic) and integer multiples of the first harmonic. As the rise and fall times of a digital signal decrease, the magnitudes of a greater number of the integer multiples of the first harmonic become significant. As a general rule, the frequency content of a digital signal extends to a frequency equal to the reciprocal of xcfx80 times the transition time (i.e., rise or fall time) of the signal. For example, a digital signal with a 1 nanosecond transition time has a frequency content extending up to about 318 MHz.
All conductors have a certain amount of inductance. The voltage across the inductance of a conductor is directly proportional to the rate of change of current through the conductor. At the high frequencies present in conductors carrying digital signals having short transition times, a significant voltage drop occurs across a conductor having even a small inductance. A power supply conductor connects one terminal of an electrical power supply to a power supply terminal of a device, and a ground conductor connects a ground terminal of the power supply to a ground terminal of the device. When the device generates a digital signal having short transition times, high frequency transient load currents flow in the power supply and ground conductors. Power supply droop is the term used to describe the decrease in voltage at the power supply terminal of the device due to the flow of transient load current through the inductance of the power supply conductor. Similarly, ground bounce is the term used to describe the increase in voltage at the ground terminal of the device due to the flow of transient load current through the inductance of the ground conductor. When the device generates several digital signals having short transition times simultaneously, the power supply droop and ground bounce effects are additive. Sufficient power supply droop and ground bounce can cause the device to fail to function correctly.
Power supply droop is commonly reduced by arranging power supply conductors to form a crisscross network of intersecting power supply conductors (i.e., a power supply grid). Such a grid network has a lower inductance, hence power supply droop is reduced. A continuous power supply plane may also be provided which has an even lower inductance than a grid network. Placing a xe2x80x9cbypassxe2x80x9d capacitor near the power supply terminal of the device is also used to reduce power supply droop. The bypass capacitor supplies a substantial amount of the transient load current, thereby reducing the amount of transient load current flowing through the power supply conductor. Ground bounce is reduced by using a low inductance ground conductor grid network, or a continuous ground plane having an even lower amount of inductance. Power supply and ground grids or planes are commonly placed in close proximity to one another in order to further reduce the inductances of the grids or planes.
Electromagnetic interference (EMI) is the term used to describe unwanted interference energies either conducted as currents or radiated as electromagnetic fields. High frequency components present within circuits producing digital signals having short transition times may be coupled into nearby electronic systems (e.g., radio and television circuits), disrupting proper operation of these systems. The United States Federal Communication Commission has established upper limits for the amounts of EMI products for sale in the United States may generate.
Signal circuits form current loops which radiate magnetic fields in a differential mode. Differential mode EMI is usually reduced by reducing the areas proscribed by the circuits and the magnitudes of the signal currents. Impedances of power and ground conductors create voltage drops along the conductors, causing the conductors to radiate electric fields in a common mode. Common mode EMI is typically reduced by reducing the impedances of the power and ground conductors. Reducing the impedances of the power and ground conductors thus reduces EMI as well as power supply droop and ground bounce.
Within the wide frequency range present within electronic systems with digital signals having short transition times, the electrical impedance between any two parallel conductive planes (e.g., adjacent power and ground planes) may vary widely. The parallel conductive planes may exhibit multiple electrical resonances, resulting in alternating high and low impedance values. Parallel conductive planes tend to radiate a significant amount of differential mode EMI at their boundaries (i.e., from their edges). The magnitude of differential mode EMI radiated from the edges of the parallel conductive planes varies with frequency and is directly proportional to the electrical impedance between the planes.
FIG. 1 is a perspective view of a pair of 10 in.xc3x9710 in. square conductive planes separated by a fiberglass-epoxy composite dielectric layer. Each conductive plane is made of copper and is 0.0014 in. (1.4 mils) thick. The fiberglass-epoxy composite layer separating the planes has a dielectric constant of 4.0 and is 0.004 in. (4 mils) thick. FIG. 2 is a graph of the magnitude of the simulated electrical impedance between the pair of rectangular conductive planes of FIG. 1 (log10 scale) versus the frequency of a voltage between the planes (log10 scale). The graph was created by modeling each square inch of the pair of conductive planes as a matrix of transmission line segments. The impedance value was computed by simulating the application of a 1 ampere constant current between the centers of the rectangular planes, varying the frequency of the current, and determining the magnitude of the steady state voltage between the centers of the rectangular planes.
As shown in FIG. 2, the magnitude of the electrical impedance between the parallel conductive planes of FIG. 1 varies widely at frequencies above about 20 MHz. The parallel conductive planes exhibit multiple electrical resonances at frequencies between 100 MHz and 1 GHz, resulting in alternating high and low impedance values. The parallel conductive planes of FIG. 1 tend to radiate substantial amounts of EMI at frequencies where the electrical impedance between the planes anywhere near their peripheries is high.
It would thus be desirable to provide a power distribution network wherein the electrical impedance between parallel conductive planes may be stabilized. Such a network would reduce power supply droop, ground bounce, and the amount of electromagnetic energy radiated from the edges of the planes. Such impedance stabilization may also reduce the need for bypass capacitors.
The problems outlined above are in large part solved by an interconnecting apparatus employing a lossy power distribution network to reduce power plane resonances. In one embodiment, a printed circuit board includes a lossy power distribution network formed by a pair of parallel planar conductors separated by a dielectric layer. The pair of parallel planar conductors includes a first power supply plane suitable for use, for example, as a ground plane and a second power supply plane suitable for use, for example, as a power plane (e.g., VCC). The dielectric layer has a loss tangent value of at least 0.2, and preferably of at least 0.3. In one embodiment, the dielectric material between the power planes could have a frequency dependent loss tangent, such that a loss tangent value of 0.3 is achieved at and above the lowest resonance frequency of the planes. Due to the relatively large loss tangent characteristic of the dielectric layer separating the power supply planes, the electrical impedance characteristics associated with the power planes may be stabilized, and power plane resonances may be reduced. The printed circuit board may also include one or more signal layers separated from the power planes by respective dielectric layers. The dielectric layers separating the signal layers from the power planes or other signal layers may be associated with much lower loss tangent values, such as in the range of 0-0.05. In this manner, high frequency losses associated with the signal traces may be kept relatively low.
In another embodiment, power plane resonances are suppressed by decreasing the thickness of the dielectric material between the power supply planes to less than 0.5 mils. For example, in one embodiment, the plane separation is preferably reduced to less than 0.2 mils such as, for example, 0.1 mils. In embodiments where the plane separation approaches 0.1 mils or less, plane resonances may be substantially suppressed.
In various embodiments, the power distribution network of a printed circuit board or a semiconductor package interconnect may require relatively large currents. For example, it is not uncommon for systems implemented on printed circuit boards to reach DC current requirements of 100 amps or more. Thus, relatively heavy copper or other conductor layers may be required to handle the large currents. Since a structure that includes very heavy conductive layers on a very thin dielectric layer may be associated with manufacturing and handling problems, a power distribution network may be provided within a printed circuit board or package interconnect in which numerous, relatively thin conductive layers are separated by relatively thin dielectric layers. For example, rather than employing a single pair of relatively thick (e.g., 1-2 mils) conductor layers separated by a relatively thick (e.g., 1-2 mils) dielectric layer in the power distribution network of a printed circuit board, a relatively large number of relatively thin (e.g., 0.05-0.3 mils) dielectric layers with relatively thin (e.g., 0.1-0.2 mils) conductor layers on each side. Alternating conductive layers in the stack up are connected by vias, every second of them connecting to one polarity (e.g., ground) and every other connecting to the other polarity (e.g., VCC). In this manner, the power distribution network may have a relatively low DC resistance to support relatively high currents, while attaining a relatively low high frequency impedance without resonances.
In yet another embodiment, a relatively thin conductive layer is provided between a pair of relatively thick conductive layers. A first relatively thick dielectric layer is provided between one of the thick conductive layers and the thin conductive layer, while a relatively thin dielectric layer is provided between the other relatively thick copper conductive layer and the thin conductive layer. A PCB core constructed according to this embodiment may be associated with relatively good mechanical strength and stability and may be capable of supporting relatively high currents. The structure may further be associated with a relatively low high-frequency impedance without resonances. The thin conductive layer may further be formed in a uniform pattern to create fuses which open if a short occurs through a portion of the thin dielectric.

Printed circuit board employing lossy power distribution network to reduce power plane resonances


A device is provided for use in performing an exercise involving at least one lower extremity of a human subject. The device may include a base including at least one moveable receiver adapted for engaging the at least one lower extremity. At least one stimulator is provided for applying electrical stimulation at a first level to at least one muscle for causing movement of the at least one lower extremity. A controller is also provided for adjusting the stimulator to apply stimulation to the at least one muscle at a second level based on a volitional movement by the human subject.

Facilitating exercise using externally applied, transcutaneous stimulation, including by sending electrical pulses to contract or otherwise activate the targeted or involved muscles, is known in the art. Typically, the electrical pulses applied are generated by an external stimulator, and travel through associated wires to one or more electrode pairs placed on the skin adjacent the muscle(s) to be contracted. The electricity passing through the skin causes the targeted muscle fibers to activate or contract, even without voluntary control by the subject. Accordingly, such stimulation is frequently used in situations where the subject is incapacitated or otherwise unable to control function of the muscles, such as in the event of an injury to the brain or associated portion of the nervous system.
Despite the widespread past use of electrical stimulation for exercising muscles, certain limitations in the application of this technology and the results produced remain. Specifically, the application of the stimulation is often based on "ramp and hold" type patterns that are externally applied based on timing. The application of such a pre-determined level of stimulation at a fixed interval is usually divorced from any volitional movement of the subject, and instead is applied by the clinician in an attempted synchronization with the exercise movement. Aside from being extremely unnatural, the benefit afforded by such an approach is not maximized in terms of encouraging the subject to make volitional contributions to the exercise.
Accordingly, a need is identified for a manner in which to apply an electrical stimulation to a subject based on a volitional exercise motion by that subject. Further, a need is identified for a manner in which to combine the benefits achieved through such a coordinated electrical stimulation based on volitional movement in a stepping exercise.

Exercise device with stimulation based on volitional contribution and related methods


A polarized light reflecting element includes a plurality of stacked cholesteric liquid crystal layers. Each cholesteric liquid crystal layer is polymerized and has a helical liquid crystal molecule array and a helical axis that extends substantially in the normal direction. The in-plane mean value xcex1 of the respective helix angles of liquid crystal molecules is nearly nxcfx80 (n=1, 2, 3, . . . ). The cholesteric liquid crystal layers have their liquid crystal molecules continuously oriented on the interfaces between them, and form one smooth helical structure as a whole.

This application is based upon and claims the benefit of priority from the prior Japanese Patent Application No. 2000-368691, filed Dec. 4, 2000, the entire contents of which are incorporated herein by reference.
1. Field of the Invention
The present invention relates to a polarized light reflecting element, a liquid crystal display element including the polarized light reflecting element, and a method of manufacturing the polarized light reflecting element.
2. Description of the Related Art
It is generally known that a cholesteric or chiral-nematic liquid crystal film that has a helical molecule array and a helical axis extending substantially in the normal direction exhibits circular-polarization dichromatism. The term xe2x80x9ccircular-polarization dichromatismxe2x80x9d means the character of the film that reflects those circularly polarized light components of incident light which have a specific wavelength and a specific direction and transmits circularly polarized light components in a direction opposite to the direction of the reflected light components.
The reflection and transmission characteristics for the circular-polarization dichromatism are settled depending on the helical structure of the liquid crystal used. Thus, the direction of the circularly polarized light to be reflected is coincident with the direction of helixes of the liquid crystal, and its wavelength depends on the pitch of the helixes. Further, the reflectance and transmittance change according to the thickness of the liquid crystal film. The thicker the film, the higher the reflectance is.
Polarized light reflecting elements with various polarized light reflection characteristics can be obtained by controlling the direction and pitch of the helixes of the liquid crystal film and the film thickness, taking advantage of the aforesaid characters. The polarized light reflecting elements can be applied to transmission- or half-transmission-type liquid crystal display elements that utilize circularly polarized light for display, and serve as useful luminance improving films for improving the utilization factor of a light source.
The degree of circular polarization of reflected and transmitted light is essential to the polarized light reflecting elements used for this purpose. Thus, if circularly polarized light in a direction opposite to a desired direction is mixed in the reflected and transmitted light, the resulting leakage light lowers the functions of the polarized light reflecting elements.
In the conventional polarized light reflecting elements, however, the degree of circular polarization of reflected and transmitted light is not high enough. If one such polarized light reflecting element is applied to a liquid crystal display element, therefore, leakage light increases to lower the contrast, so that the quality level of display of the display element lowers. If the reflecting element is used as a luminance improving film, moreover, the light utilization factor lowers inevitably. Thus, the function of the polarized light reflecting element cannot be used efficiently.
The present invention has been contrived in consideration of these circumstances, and its object is to provide a polarized light reflecting element for improving the degree of circular polarization of reflected and transmitted light, thereby ensuring a high light utilization factor, a liquid crystal display element using the polarized light reflecting element, and a manufacturing method for the polarized light reflecting element.
In order to achieve the above object, a polarized light reflecting element according to an aspect of the present invention comprises at least one polymerized liquid crystal layer, cholesteric, chiral-nematic, or chiral, having a helical liquid crystal molecule array and a helical axis extending substantially in the normal direction, the in-plane mean value xcex1 of the respective helix angles of the liquid crystal molecules being given by
nxcfx80xe2x88x920.05xcfx80xe2x89xa6xcex1xe2x89xa6nxcfx80+0.05xcfx80 (n=1, 2, 3, . . . ).
According to the polarized light reflecting element constructed in this manner, the degree of circular polarization of reflected and transmitted light can be drastically improved to ensure a high light utilization factor.
A half-transmission-type liquid crystal display element according to another aspect of the invention comprises a first polarization plate, a liquid crystal cell, a second polarization plate, and the polarized light reflecting element located between the first and second polarization plates.
Further, a liquid crystal display element according to still another aspect of the invention comprises a first polarization plate, a liquid crystal cell, a second polarization plate, a backlight source, the polarized light reflecting element located between the second polarization plate and the backlight source, and a xcex/4-wavelength plate located between the second polarization plate and the polarized light reflecting element.
According to the liquid crystal display element constructed in this manner, high-contrast display characteristics can be obtained with use of the polarized light reflecting element that enjoys the high light utilization factor.
A method of manufacturing a polarized light reflecting element according to a further aspect of the invention comprises a process for forming an oriented film on a substrate, a process for orienting the oriented film so that liquid crystal molecules are controlled in one in-plane direction, a process for forming a liquid crystal layer having a helical structure on the oriented film, and a process for orienting and solidifying the liquid crystal molecules in the top portion of the liquid crystal layer in substantially the same direction as the direction of orientation of the oriented film.
Further, a method of manufacturing a polarized light reflecting element according to another aspect of the invention comprises a process for forming a first oriented film on a substrate, a process for orienting the first oriented film so that liquid crystal molecules are controlled in one in-plane direction, a process for forming a first liquid crystal layer having a helical structure on the first oriented film, a process for orienting and solidifying the top portion of the first liquid crystal layer in substantially the same direction as the direction of orientation of the first oriented film, a process for forming a second oriented film on the first liquid crystal layer, a process for orienting the second oriented film in substantially the same direction as the direction of orientation of the first oriented film, a process for forming a second liquid crystal layer on the second oriented film, and a process for orienting and solidifying the top portion of the second liquid crystal layer in substantially the same direction as the direction of orientation of the first oriented film.
Additional objects and advantages of the invention will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. The objects and advantages of the invention may be realized and obtained by means of the instrumentalities and combinations particularly pointed out hereinafter.

Polarized light reflecting element, liquid crystal display element using the same, and method of manufacturing polarized light reflecting element


The present invention provides a method of inputting characters into a handheld device, comprising steps of: reading handwriting information; recognizing said handwriting information in one active recognition mode and at least one inactive recognition mode; displaying at least one character candidate obtained in said active recognition mode and at least one character candidate obtained in said at least one inactive recognition mode; and inputting into said handheld device a desired character candidate selected by a user among said character candidates being displayed. The present invention also provides a corresponding apparatus for inputting characters into a handheld device, and a related handheld device. A user no longer needs to designate handwriting recognition modes, and recognition accuracy is greatly improved.

1. Field of the Invention
The present invention relates to the utilization of handwriting recognition (HWR) techniques in electronic devices, and particularly relates to methods of and apparatuses for inputting characters into handheld devices, handheld devices with such apparatuses, and storage media encoded with machine-readable computer program codes for implementing such methods.
2. Description of the Related Art
Nowadays, more and more electronic devices have been developed and used in people's daily lives. These electronic devices, for example, include personal computers (PC), personal digital assistants (PDA), mobile phones, electronic dictionaries, receipt printers, etc. Based on the portability and other considerations, electronic devices may be classified into handheld devices and non-handheld devices. For some electronic devices, and especially for the handheld devices, the ability of receiving and processing text information is important.
In order to input text information or characters into electronic devices, various mechanisms have been invented. Handwriting recognition is a mature technology by which ideographic characters, digits, Latin alphabets, special characters or other text may be recognized from the user's handwriting.
In early days, different kinds of characters, such ideographic characters, digits, Latin alphabets, and special characters had to be recognized in the same recognition mode. Without considering the peculiarities of different kinds of characters, these early handwriting recognition technologies cannot recognize characters accurately. Since then, technicians have been struggling to improve the accuracy of handwriting recognition technology.
At present, handwriting recognition systems operate in different recognition modes for recognizing different kinds of characters. For example, these recognition modes may include ideographic character mode (such as simplified Chinese character mode, traditional Chinese character mode, Japanese character mode, and so on), digit mode, Latin alphabet mode, special character mode, etc. But in all prior handwriting systems, before a user can write characters on the graphic writing pad, the user has to first designate an active recognition mode. Only in the active recognition mode, can the handwriting recognition system recognize what is being written on the graphic writing pad. In other words, no matter what character the user writes on the graphic writing pad, the handwriting recognition system always recognizes the handwriting as characters particularly corresponding to the active recognition mode. For example, if the active recognition mode is Chinese character mode, the handwriting recognition system recognizes whatever is written on the graphic writing pad as Chinese characters. The handwriting recognition systems operating in different recognition modes for recognizing different kinds of characters are referred to as mode-based handwriting recognition systems hereinafter.
The mode-based handwriting recognition systems have several drawbacks. The requirement of first designating a corresponding recognition mode before actually writing is very different from the natural process of writing on paper. In the case of writing contents which include different kinds of characters, a user usually mainly concentrates too much on the contents and forgets to switch the handwriting recognition modes for different kinds of characters. The need to stop while writing, find a correct recognition mode, switch to it and write previous contents once again greatly hinders the natural process of thinking and writing.
Even worse, sometimes it is not clear to the user which recognition mode is correct for some characters. For example, the inventor has noticed that in the usability test users were sometimes confused about whether punctuation marks such as comma and full stop are available in Chinese character mode or special character mode. Judging the correct recognition mode is also a burden for users using mode-based handwriting recognition systems.
To reduce users' burden of judging and switching the handwriting recognition modes, some handwriting recognition engines may work in a mixed-mode, in which the handwriting recognition engines try to find the best matches to the users' writing in all other modes, so that the users do not have to manually switch the mode. However, the intelligence of such engines is so limited that the accuracy of handwriting recognition is rather low. Also, the candidate list is messy, which makes it difficult for users to select a desired character. This is due to the fact that characters from different modes are mixed together while being displayed, and that some candidate characters for a given writing resemble very much. For example, Chinese character "one" and a dash (a straight horizontal line) are similar. So are English letter "1" and digit "1".

Handwriting recognition in electronic devices


The invention relates to filtration media having nanocrystals of metal oxides, encapsulated in or impregnated into a binder matrix, which binds together particles of activated carbon. The filtration media can be compressed into a filtration block, has low pressure drop, and has excellent microbial removal properties.

1. Field of the Invention
The invention relates to a filtration media containing nanocrystals made of metal oxide dispersed in a binder matrix for the removal of microorganisms and other contaminants from water.
2. Description of Related Art
Drinking water, in some locations world-wide, contains bacteria and viruses that are harmful to humans, in many cases, rendering the water unfit for consumption. There are a variety of different techniques and equipment that can reduce bacteria and viruses to certain acceptable performance levels, such as ceramic filters, sub-micron filters, ion exchange resins, ultra-violet lights, ozonators, distillation equipment, and other apparatus. Microfiltration generally presents significant drawbacks because of the large pressure drops involved and because of the limited capacity of the microfilters. With bacteria having sizes of around 0.1 micron, such as B. Diminuta, the performance of microfilters is generally very poor, and clogging takes place in a short time. Consumers who use these filters to reduce bacteria generally must rely on increased pressure drop as the only indication that it is time to replace the microfilter. There is no reliable method to determine whether the filter will last 10, 50, 100 or 1000 gallons, or what the remaining capacity of a filter in use might be. Turbidity and the presence of other contaminants than microorganisms can affect the surface of the microfilter, which creates some limitations on the use of the filter. Ultra-violet lights are affected by scale buildup on the lamp sites and frequency changes that may affect their performance in bacteria reduction, and UV wavelength sensors are very expensive.
Filtration media are often assigned a "rating" based upon the size of particulates that can be removed from water using these filters. Typical testing to establish these ratings includes NSF Class 1 Particulate and NSF 53 AC Dust testing. Reducing the ratings (desirable, because it indicates that smaller particles can be produced) generally requires the use of specialized particles having very small pore sizes. These particles become difficult and expensive to produce, so that decreasing the nominal rating of the filtration media is limited by the expense of the particles necessary to include in the media. In addition, filters that have submicron ratings, and which function by occlusion, have very short lifetimes. For example, a 0.2 micron rated filter of approximately 3 in. diameter and 10 in. length filtering New York City water at 1 gpm will suffer reduced capacity and significantly increased pressure drop after filtering only 100 gallons of water.
Recent advances in "hybrid" materials, i.e., nanostructured materials that contain both organic and inorganic components or moieties, has led to the development of filtration materials capable of achieving submicron level removal of particulates as well as removal of microorganisms, but that are capable of operating at high flow rates and for extended periods of time without substantial degradation of performance. The invention described herein is one such material.

This patent is subject to a terminal disclaimer.


An exhaust gas purification filter 100 includes: a honeycomb structure 10 having partition walls 12, plugging portions 13, and a surface trapping layer 14 having an average pore size of 0.1 μm or more and 5 μm or less, a porosity of 50% or more and 80% or less, and a thickness of 1 μm or more and 50 μm or less. The partition walls 12 have a thickness of 0.05 mm or more and 0.18 mm or less and an average pore size of 10 or more and 18 μm or less, and the proportion of the volume of the pores having a size of twice the average pore size or more in the entire pore volume in a pore size distribution of the partition walls 12 is 5% or more and 40% or less.

1. Field of the Invention
The present invention relates to an exhaust gas purification filter. More specifically, the present invention relates to an exhaust gas purification filter suitably used for removing particulate matter contained in exhaust gas discharged from an engine.
In recent years, there has been demanded reduction in fuel consumption of an automobile from the viewpoints of influences on the global environment and resource saving. Therefore, internal combustion engines having good thermal efficiency, such as a diesel engine and a direct gasoline-injection engine tend to be used as a powder source for an automobile.
On the other hand, in these internal combustion engines, soot generation upon combustion is a problem. There is required a countermeasure to inhibit particulate matter such as the aforementioned soot from being released from the viewpoint of the air environment.
As a measure for inhibiting the aforementioned particulate matter from being released in the air, there has been proposed removal of the particulate matter in the exhaust gas by the use of an exhaust gas purification filter. As an example of the exhaust gas purification filter, there is a wall flow type exhaust gas purification filter provided with a honeycomb structure and plugging portions. The honeycomb structure has porous partition walls separating and forming a plurality of cells functioning as exhaust gas passages and extending from one end portion to the other end portion. The plugging portions are disposed so as to alternately plug the one side end portions and the other side end portions of the cells of the aforementioned honeycomb structure.
In such an exhaust gas purification filter, when exhaust gas is allowed to flow into the cells having open end portions on one side of the honeycomb structure, particulate matter in the exhaust gas is trapped by the partition walls when the exhaust gas passes through the partition walls. Then, the purified gas from which the particulate matter is removed flows out from the cells having open end portions on the other side.
However, in the case of disposing such an exhaust gas purification filter in an exhaust system of an engine of an internal combustion engine or the like, increase of pressure loss in the exhaust system is caused. As a result, the decrease of engine output may exceed the allowable range as the engine.
In addition, in a conventional diesel engine filter having a very high discharge concentration of particulate matter in exhaust gas, the particulate matter in the exhaust gas is deposited in layers on the surface of the partition walls of the honeycomb structure constituting the exhaust gas purification filter. The aforementioned "layers of the particulate matter" function as a trapping filter. Hereinbelow, particulate matter may be referred to as "PM" or "particulates". In addition, the "layers of the particulate matter" may be referred to as "PM layers". Therefore, in a conventional diesel engine filter, high trapping efficiency of the particulate matter can be maintained. On the other hand, in the case that the concentration of particulate matter in exhaust gas is decreased in comparison with a conventional diesel engine by improvement in combustion in a diesel engine, the formation of the aforementioned PM layers can not be expected, and the trapping efficiency of the exhaust gas purification filter cannot be maintained sufficiently. That is, a conventional diesel engine exhaust gas purification filter is produced on the assumption that the concentration of particulate matter in exhaust gas is high. Therefore, when the concentration of particulate matter in exhaust gas is decreased due to the combustion improvement in a diesel engine itself, it is difficult to sufficiently remove particulate matter by a conventional exhaust gas purification filter even if the amount of the particulate matter is small.
Even in a direct gasoline-injection engine, which has a small amount of particulate matter in comparison with a diesel engine, it is becoming necessary to purify exhaust gas by an exhaust gas purification filter for trapping particulate matter. Even in such an exhaust gas purification filter, formation of the PM layers is not expected like the aforementioned diesel engine having the combustion improved, and the trapping efficiency of the exhaust gas purification filter cannot sufficiently be maintained. In addition, also in a natural gas compression ignition type engine or the like, it has a problem similar to that of the aforementioned direct gasoline-injection engine.
Thus, a direct gasoline-injection engine, a natural gas compression ignition type engine, and an advanced technological diesel engine (e.g., diesel engine having improved combustion) has a small amount of particulate matter in exhaust gas in comparison with a conventional general diesel engine. Therefore, in the direct gasoline-injection engine or the like, the absolute amount of particulate matter which should be trapped by an exhaust gas purification filter is small. However, in a conventional exhaust gas purification filter, the exhaust gas discharged from the aforementioned direct gasoline-injection engine or the like cannot be purified sufficiently.
In addition, in order to improve particulate matter-trapping efficiency, it can be considered to reduce the pore size of the partition walls of the honeycomb structure. However, in the case of simply reducing the pore size of the partition walls, the pressure loss of the exhaust gas purification filter is increased.
2. Description of Related Art
As a means to solve the trade-off problem of raising the trapping efficiency of the particulate matter and suppressing the pressure loss when the particulate matter deposits on the partition walls, the following technique has been proposed. That is, in an exhaust gas purification filter for a conventional diesel engine having a very high particulate matter discharge concentration, a technique of sharpening the pore size distribution of the partition wall has been proposed (see Japanese Patent No. 3272746).
In a conventional diesel engine, since the amount of particulate matter in exhaust gas discharged from the engine is large, the required trapping efficiency of a filter necessary to clear the exhaust gas regulation is set to a high level. For example, in the case of the exhaust gas regulation depending on the number of particulates in exhaust gas, the required trapping efficiency of the filter is 99% or more.
In contrast, in a direct gasoline-injection engine and a natural gas compression ignition type engine (i.e., engines having a reduced particulate matter amount), the amount of particulate matter in exhaust gas discharged from the engine is small in comparison with a conventional diesel engine. Therefore, in a filter used for such an engine, the required trapping efficiency is set to be low in comparison with the case of the aforementioned diesel engine. For example, in the case of an engine having a reduced particulate matter amount, the required trapping efficiency of the filter is about 70%.
As described above, there is a difference in the required trapping efficiency between an exhaust gas purification filter used for an engine having a reduced particulate matter amount and the exhaust gas purification filter developed for a conventional diesel engine (e.g. , a conventional diesel particulate filter). Therefore, there is a difference in the configuration of the filter for performing good purification between an exhaust gas purification filter used for an engine having a reduced particulate matter amount and a conventional diesel particulate filter. For example, the best pore size diameter of the partition wall from the viewpoint of satisfying both the reduction in pressure loss and the improvement in trapping efficiency is different between a conventional diesel engine filter and a filter for an engine having a reduced particulate matter amount. Therefore, there is a problem of impossible application of the technique described in Japanese Patent No. 3272746, which is most suitable for a conventional diesel engine, as it is to an engine having a reduced particulate matter amount.
In a direct gasoline-injection engine, a natural gas compression ignition type engine, and an advanced diesel engine adopting measures such as raising the fuel injection pressure or reducing the diameter of a fuel injection nozzle hole (i.e., a diesel engine having a small amount of particulate matter), particulate matter such as soot is oxidized by the high temperature exhaust gas discharged from the engine and the nitrogen oxide (NOx) contained in the exhaust gas, thereby removing the particulate matter in the exhaust gas. Therefore, in an exhaust gas purification filter used for such an engine, it is important to reduce the pressure loss in a state that no particulate matter deposits on the partition walls. This point is also different from a conventional diesel engine filter, and it is suitably used for an engine having a smaller amount of particulate matter. There is a demand for a development of an exhaust gas purification filter having low pressure loss and appropriate purification performance.


A screw includes a positioning member defined on inclined cutting planes of a drilling portion of the screw for stably allowing a cutting edge constructed at a convergence of the cutting planes to cut efficiently. A threaded section formed on a shank of the screw is extended toward the cutting edge and connected with one end of the cutting edge. The positioning member helps the screw fixedly stand on an object. The cutting edge and the cutting planes allow cutting debris to be swiftly and smoothly extruded therefrom into the threaded section for avoiding the piling of the considerable cutting debris. Thereby, the screwing torque is reduced and the drilling speed is promoted. Preferably, the fastened screw is sunken in the object, and the fastening operation is completed successfully.

1. Field of the Invention
The present invention relates to a fastener design, particularly to a screw.
2. Description of the Related Art
Referring to FIG. 1, a conventional screw 1 comprises a shank portion 11, a head portion 12 disposed at one end of the shank portion 11, a drilling portion 13 disposed at the other end of the shank portion 11, and a plurality of threaded units 14 spirally disposed around the shank portion 11. Wherein, the drilling portion 13 is formed into a tapered end. Thus, the screw 1 directly enters an object 2 via the tapered drilling portion 13, and the following threaded units 14 continue entering the object 2 so as to achieve a fastening effect.
Afore screw 1 might be smoothly fastened into the object 2 by means of the drilling portion 13 piercing the object 2. However, in practice, the object 2 is forcedly pierced by the tapered drilling portion 13. Thus, fibers contained in the object 2 are difficult to be severed efficiently. That is to say, the fibers are just simply pushed and thrust by the tapered drilling portion 13, so the screw 1 would be easily impeded by debris resulted from the object 2 in time of drilling. As a result, the debris can not be timely expelled, and the heaped debris incurs an increasing resistance on the screw 1. Thereby, the operation of fastening the screw 1 is influenced.
Referring to FIG. 2, the upright screw 1 in the object 2 might be subject to rustiness since water might pile on the head portion 12. Therefore, in the practical application, the screw 1 is disposed tilting in the object 2. Herein, if the cutting debris can not be timely expelled, the head portion 12 easily bulges out of the object 2 after screwing. Such abnormal operation is unbeneficial for further fastening. Therefore, the screw 1 needs improvements.

Biomate Medical Devices Technology Co., Ltd.


Embodiments in accordance with the present invention encompass compositions encompassing components A and B which respectively contain a procatalyst and an activator along with one or more monomers which undergo vinyl addition polymerization when both components are mixed together to form a substantially transparent film. The monomers employed therein have a range of refractive index from 1.4 to 1.8 and thus these compositions can be tailored to form transparent films of varied refractive indices. Accordingly, compositions of this invention are useful in various opto-electronic applications, including as coatings, encapsulants, fillers, leveling agents, among others.

Field of the Invention
Embodiments in accordance with the present invention relate generally to mass polymerizable polycycloolefin monomer compositions having high optical transparency and exhibiting suitable refractive index that match the refractive index of layers in optical devices, such as optical sensors, light emitting diodes (LEDs), organic light emitting diode (OLED), among other devices. More specifically, this invention relates to compositions encompassing norbornene (NB) based olefinic monomers, which undergo mass polymerization to form optical layers having utility in a variety of opto-electronic applications including as encapsulants, coatings, and fillers.
Description of the Art
Organic light emitting diodes (OLEDs) are gaining importance in a variety of applications, including flat panel televisions and other flexible displays, among other applications. However, conventional OLEDs, particularly, bottom emitting OLEDs suffer from a drawback in that only about half of the generated photons are emitted into the glass substrate out of which 25% are extracted into air. The other half of the photons are wave-guided and dissipated in the OLED stack. This loss of photons is primarily attributed to the refractive index (n) mismatch between the organic layers (n=1.7-1.9) and the glass substrate (n=1.5). By matching the refractive index of the substrate (n=1.8) and organic layers and augmenting the distance of the emission zone to the cathode to suppress plasmonic losses light extraction into the substrate can be increased to 80-90%. See, for example, G. Gaertner et al., Proc. of SPIE, Vol. 6999, 69992T pp 1-12 (2008).
In addition, OLEDs also pose other challenges; in that OLEDs being organic materials, they are generally sensitive to moisture, oxygen, temperature, and other harsh conditions. Thus, it is imperative that OLEDs are protected from such harsh atmospheric conditions. See for example, U. S. Patent Application Publication No. US2012/0009393 A1.
In order to address some of the issues faced by the art, U.S. Pat. No. 8,263,235 discloses use of a light emitting layer formed from at least one organic light emitting material and an aliphatic compound not having an aromatic ring, and a refractive index of the light emitting from 1.4 to 1.6. The aliphatic compounds described therein are generally a variety of polyalkyl ethers, and the like, which are known to be unstable at high temperatures, see for example, Rodriguez et al., I & EC Product Research and Development, Vol. 1, No. 3, 206-210 (1962).
Accordingly, there is still a need for organic filler materials that complement the refractive index of OLEDs and yet exhibit high transparence and high thermal properties, among other desirable properties.
Thus, it is an object of this invention to provide organic materials that overcome the gaps faced by the art. More specifically, it is an object of this invention to provide two component materials that will mass polymerize under the conditions of the fabrications of an OLED devices.
Other objects and further scope of the applicability of the present invention will become apparent from the detailed description that follows.

Polycycloolefin polymer compositions as optical materials


Active carbon filters and systems that are operative to detect active carbon filter degradations are provided. The active carbon filter can include a carbon filter comprising activated carbon and defining a filter surface; a first piezoelectric wafer active sensor on the filter surface that is electrically isolated from the carbon filter; and a second piezoelectric wafer active sensor on the filter surface that is electrically connected to the filter surface; and an impedance monitoring device electrically connected to the first piezoelectric wafer active sensor and the second piezoelectric wafer active sensor. Methods are also disclosed for determining if any degradation has occurred in an active carbon filter.

Impregnated activated carbon, such as, but not limited to, ASZM-TEDA (Activated Carbon, Impregnated with Copper, Silver, Zinc, Molybdenum, and/or Triethlyenediamine), is used as filter media in individual and collective protection systems used by the military. The high-surface area activated carbon possesses excellent adsorption capacity for physically adsorbing chemical warfare gases. Although the impregnated activated carbon provides excellent initial protection against vapors and acidic/acid-forming gases, the capacity of activated carbon degrades over time from exposure to contaminants, such as SO2 and water condensation. Mechanical integrity defect formation in the carbon filter, such as flow channeling or filter settling, can also impair the filtration performance.
Active carbon filter degradation detection and residual life prediction has been studied by many researchers. Hori et al. used a semiconductor gas sensor to detect breakthrough of organic vapors (Hori et al. 2003); Bernard et al. patented a method using fiber optic chemical sensor for indicating the end of service life of a respirator cartridge (Bernard et al. 2002); Rubel, et al. used electrochemical impedance spectroscopy to detect SO2 and humidity in impregnated active carbon (Rubel et al. 2009).
These methods provide approaches to detect specific chemical presence or sense chemical concentration in the carbon filters. However, current sensing technologies are lacking of the capability of detecting mechanical changes, such as carbon packing, settling flow channeling, etc. Furthermore, the sensors and related measurement device are cumbersome and often has high power requirement, which limited their use in respirator cartridges.
As such, a need exists for methods to detect the degradation of impregnated active carbon filters.

Methods and sensors for the detection of active carbon filters degradation with EMIS-ECIS PWAS


Disclosed are a system and a method for collecting and returning luggage at public transportation systems. The method includes storing characteristic features and metadata corresponding to a luggage and its individual owner, and associating a color while collecting the luggage at a luggage submitting terminal. The luggage may be easily identified at a luggage providing terminal, using an identification tag attached to the luggage and the associated metadata (including the associated colour). Upon an end of journey, the individual may be allowed to pick the luggage upon providing a handshake signal. In case the handshake signal is not provided and the individual owner's metadata is not matched, security agencies may be alerted about picking of the luggage by another individual.

Today, millions of individuals traverse through using the major transportation means, such as trains and air planes. Such individuals carry luggage with them that is generally submitted at luggage counters, such as at airports, before beginning of the journey. Immediately after end of the journey, while the luggage is to be collected, all the travelling individuals gather at a baggage collection belt. Within such big crowd of people, one cannot easily track placement of their luggage on the baggage collection belt, and it becomes difficult to identify one's own luggage. Moreover, the luggage is placed on the baggage collection belt in a random order (sometimes only business class passenger's luggage is placed first). A luggage's owners may be close to the belt, ready to pick them up, or standing far back in a queue, or may be busy in some other activities, such as talking or using their cell phones, because of which they may not be able to pay attention to their luggage. In such conditions, the baggage owners may not be able to pick up their luggage in time, resulting in overall delay in their journey. Further, there also remains the threat of theft of the luggage or someone picking another individual's luggage by mistake due to similar appearance of the luggage.
Thus, such orderless movement and collection of luggage on the luggage collection areas need to be organized, through which the above mentioned problems could be overcome.

System and method for collecting and returning luggage at public transportation systems


Techniques for remote interfacing with one or more computing devices may be provided. For example, a computing node may be communicatively coupled with the one or more computing devices. Each of the one or more computing devices may be associated with a device-specific interface for interacting with the corresponding computing device. The computing node may host the one or more device-specific interfaces. The computing node may also host an agent. The agent may be configured to at least provide a common interface to interact with the one or more device-specific interfaces. As such, status information of the one or more computing devices may be monitored based at least in part on utilizing the common interface. The status information may also be provided for presentation.

Computing devices are used to access various types of services. Many of these services may be facilitated by different applications hosted on the computing devices. For example, a user may operate a browser of a smart phone to access a web page. In another example, a user may operate a shopping application of a tablet to access an electronic marketplace over a network and browse and purchase offered items. The browser and the shopping application are only two examples of a large number of available applications. Likewise, a smartphone and a tablet are only two examples of a large number of computing devices.
As the number of applications and types of computing devices increase, the available services to users may also increase. In certain situations, availability of a service may depend on an application or a computing device. For example, if the application is updated or if a new application becomes available, the service may be available if the updated or new application properly operates on the computing device. Similarly, if the computing device is updated (e.g., a new version of an operating system is loaded) or if a new computing device becomes available, the service may be also available if the update or new computing device properly executes the application.

Remote device interface for testing computing devices


An electrical contact having a center leg and a pair of beams connected to the center leg. Each beam has a metal-coated end which may mate and unmate with electrical interfaces in a wiping movement. A plurality of electrical contacts are received in a plurality of spaced-apart retention openings in a contact module in a manner compatible with automatic insertion.

The means for interconnection of electronic components is an important consideration in the design of modern equipment. Some applications require sophisticated systems to permit data flow through the connector at high frequencies and at high speeds. Such connectors are disclosed in U.S. Pat. No. 4,699,593, Grabbe et al and U.S. Pat. No. 4,927,369, Grabbe et al and application Ser. No. 07/996,751 filed Dec. 24, 1992, Mroczkowski et al. In these documents, two electronic components such as two printed wiring boards are interconnected by a system of contacts, referred to as a land grid array. In this array, an interposer is sandwiched between the electronic components such that as the contact surfaces of the electronic components are moved towards one another, contact is made with the opposing surfaces of the interposer. The interposer, as disclosed in the known art, has contact elements in the form of loop-shaped contact springs in mirror image symmetry connected by a bight portion. The spring portions of the contact elements provide a contact force at the interface between the interposer and the electronic component. The configuration of the contact spring and the interposer module has necessitated that the interposer be hand assembled which has resulted in a device which cannot be produced rapidly or economically.
The applicants have recognized that there is a need for an interposer which can be assembled by automated means and which can withstand multiple mating/unmating cycles for use with different devices or for reuse in the same device.

Duplex plated epsilon compliant beam contact and interposer


A semiconductor structure comprises a semiconductor substrate, and a multi-layer patterning material film stack formed on the semiconductor substrate. The patterning material film stack comprises at least a hard mask layer and a resist layer formed over the hard mask layer. The hard mask layer is configured to support selective deposition of a metal-containing layer on a developed pattern of the resist layer through inclusion in the hard mask layer of one or more materials inhibiting deposition of the metal-containing layer on portions of the hard mask layer corresponding to respective openings in the resist layer. The hard mask layer illustratively comprises, for example, at least one of a grafted self-assembled monolayer configured to inhibit deposition of the metal-containing layer, and a grafted polymer brush material configured to inhibit deposition of the metal-containing layer.

The present application relates to manufacturing of semiconductor integrated circuits, and more particularly to patterning of semiconductor integrated circuit features using lithography processes. As part of the ongoing world-wide effort to shrink integrated circuit device dimensions, a variety of single-pattern and multiple-pattern lithography processes based on deep ultraviolet (DUV) radiation wavelengths such as 193 nanometers (193 nm) have come into widespread use, although further extension of such arrangements to the patterning of features at production nodes below 10 nm may be problematic. Recent development of extreme ultraviolet (EUV) lithography processes using wavelengths such as 13.5 nm are expected to facilitate the accurate patterning of features at sub-10 nm production nodes, but there remain significant difficulties in the practical implementation of EUV processes. For example, conventional techniques in some cases fail to provide a resist layer that exhibits sufficient etch selectivity relative to an underlying hard mask layer. This can lead to pattern transfer defects such as line breaks due to resist thinning during an etching process. Additionally, elimination of line bridge defects caused by scumming of EUV resist between lines generally requires a resist descum process after lithographic pattern development which further reduces resist thickness available for hard mask etch.

Patterning material film stack with hard mask layer configured to support selective deposition on patterned resist layer

International Business Machines Corporation


A polishing-rate distribution of a target film is compared with a desired post-polishing film-thickness distribution of the target film, thereby obtaining a pre-polishing film-thickness distribution of the target film by a reverse calculation, so that film growing conditions can be controlled in advance so as to allow the target film to have, after polishing, a film-thickness distribution that is the same as the desired film-thickness distribution. Therefore, even if there is a possibility that variation in the step height of the wafer surface might be produced by polishing, the finally obtained target film's film-thickness distribution can be the desired film-thickness distribution. Accordingly, semiconductors in which device-to-device variation in characteristic is reduced can be provided.

The present invention relates to semiconductor device fabrication methods, and more particularly relates to planarization in semiconductor device fabrication process.
LOCOS (local oxidation of silicon) isolation techniques have been conventionally used to electrically isolate transistors. However, as transistors have been downsized drastically, the LOCOS isolation techniques have met with problems such as decrease in transistor regions due to bird's beaks and hence decrease in the breakdown voltage of transistors surrounded by isolations. In view of this, a technique for isolating devices using shallow trench isolations called STI has been developed as a new device isolation technique (for example, B. Davari et al., IEDM Tech. Digest, 92, (1988).)
In recent years, as the scale of integration of semiconductor devices has been increased, more and more devices and wiring have been downsized and multi-layered. Along with this, problems caused by roughness (step height) on substrate surfaces, which were not so much problematic in the past, have become noticeable. Such problems include, for example, size variation in resist masks formed by patterning of resists in a lithography process, and short circuits in wiring caused in step height portions. Step heights in a substrate surface, as well as, e.g., the performance of a semiconductor device fabrication system (such as an exposure system and an etching system), has a profound effect on size control in forming resist masks, wiring and the like. Therefore, a high degree of planarization of substrate surfaces has been strongly required in recent semiconductor fabrication processes.
In general, chemical mechanical polishing (CMP) is widely used to planarize substrate surfaces. A CMP process, which is used for device isolation, planarization of an insulating film between wires, formation of buried Cu wiring, and various other purposes, is indispensable in fabricating semiconductor devices.
In particular, step heights in a substrate surface due to STIs formed between MIS transistors greatly affect size control in forming gate electrodes of the MIS transistors. Thus, techniques for planarizing substrate surfaces with STIs formed therein have been developed actively for commercial use.
Hereinafter, a conventional technique for planarizing, using a CMP technique, a substrate surface, in which STIs are formed, will be described with reference to FIG. 9.
First, in a step shown in FIG. 9A, a silicon oxide film 2 and a silicon nitride film 3 are formed in sequence on a semiconductor substrate (a silicon substrate in this embodiment) 1. A resist 7 is then applied onto the silicon nitride film 3 and patterned by lithography, thereby forming openings 7a in the resist 7.
Next, in a step shown in FIG. 9B, with the resist 7 used as a mask, a dry-etching process is performed to remove the silicon nitride film 3, the silicon oxide film 2, and the silicon substrate 1 where they are located under the openings 7a, thereby forming trenches 4.
Subsequently, in a step shown in FIG. 9C, a silicon oxide film 5 is formed on the surfaces of the trenches 4, after which an insulating film 6 is formed to completely fill the trenches 4 and cover the silicon nitride film 3. In this step, a TEOS film or a silicon oxide film formed by a CVD process is used as the insulating film 6.
Then, in a step shown in FIG. 9D, the insulating film 6 is annealed and then polished by CMP until the silicon nitride film 3 is exposed. Finally, the silicon nitride film 3 is selectively removed by phosphoric acid, thereby forming STIs 8.
However, in any CMP systems, distribution of polishing rate (hereinafter referred to as polishing-rate distribution) of a target film being polished changes irregularly with time. Such changes with time in the target film's polishing-rate distribution produce in an STI formation process step for example, variations after polishing in the film thickness of a silicon nitride film that is a polishing stopper in CMP between where the silicon nitride film is in the central portion of the wafer and where it is in the peripheral portion thereof. As a result, variations occur in the step height of the device isolation region.
The variations in the step height of the substrate surface then cause variations in the size of gates formed later by lithography, for example. Consequently, semiconductor devices formed in the central and peripheral portions of the wafer might differ in characteristic.
As a method to solve such variations in the step height of a substrate surface resulting from variations in a film-thickness distribution in a wafer, a method is disclosed in Japanese Laid-Open Publication No. 2002-134466. In the method disclosed in the publication, part of a target film having large thickness in a wafer is subjected to a wet-etching process so that the target film is planarized to some extent, after which a planarization process by CMP is performed, thereby decreasing post-polishing variation in the step height of the wafer surface.

Semiconductor device fabrication method and semiconductor device fabrication system for minimizing film-thickness variations

Matsushita Electric Industrial Co., Ltd.


A distributed stream processing system including a plurality of storage devices, at least one of which is configured to process at least one segment of a data stream, thereby producing a changed segment of the data stream, and provide output of at least the changed segment of the data stream, and a server configured to accept the output of the storage devices and combine the output into a transport stream. A method for combining a plurality of data streams including using one or more storage devices for processing at least one segment of a data stream, thereby producing a changed segment of the data stream, and providing output of at least the changed segment of the data stream, and combining the output of the storage devices into a combined data stream. Related apparatus and methods are also described.

The present invention, in some embodiments thereof, relates to a digital video server and, more particularly, but not exclusively, to a digital video server for video-on-demand services.
Digital video is often distributed as streams of digital data. One well known protocol for video data is MPEG.
Video streams, such as MPEG streams, typically have a Variable Bit Rate (VBR). The video streams are typically compressed, and the amount of compression depends on complexity of the scene, and on the amount of changes between scenes.
The MPEG video compression protocols compress video by reducing pixel data redundancy within an image, and also redundancy between neighboring images. MPEG video compression groups several consecutive images into a Group Of Pictures (GOP), and defines most of the pictures, also termed video frames, by their difference from a neighboring picture, which is also in the GOP.
A GOP contains X amount of data for N video frames, which need to be played out at a rate of R frames per second, thereby having a bit rate proportional to X*R/N. If there is need to lower the bit rate of a video stream, pictures in a GOP need to be changed together, since the pictures depend on each other for reconstruction.
In cases where video streams are distributed to customers, several video streams are sometimes combined in one transport stream, termed a Multiple Program Transport Stream (MPTS). In some cases a transport stream contains only one program. Such transport streams are termed Single Program Transport Streams (SPTS).
One example of video distribution, which is becoming more and more common nowadays, is distribution of Video On Demand (VOD). Customers request to receive specific videos, and VOD suppliers transmit each video requested by the customers. For example, the VOD supplier transmits several MPEG streams, some of different videos, and some of the same videos started at different times.
A transport stream often has a Constant Bit Rate (CBR). The bit rate of the transport stream is often a physical upper limit of some device in the transmission path. In other cases the transport stream has a bit rate assigned to it by a service provider which performs the transmission. A VOD supplier may purchase one or more units of such and such bandwidth, to use for supplying video on demand.
Combining VBR streams into a CBR transport stream can be done. Care must be taken that the total bit rate of the combination of VBR streams never exceeds the CBR limit, otherwise the CBR transport stream may well crash, or be cut off by the service provider which performs the transmission. Sometimes, the combining combines the streams by taking each of the constituent VBR streams into account as if it constantly has a maximum bit rate, and whenever the total bit rate of the combined VBR streams falls below the CBR of the transport stream, padding is added.
Lowering a bit rate of a video stream can be done. It is a computation intensive task. MPEG streams, for example, are compressed for ease of decompression, having a relatively computationally simple decompression, and a relatively computation intensive compression. Therefore bit rate lowering of MPEG streams, which involves decompression (easy) and subsequent compression (hard) is computationally intensive.


The present invention provides a semiconductor device, which includes a substrate, a first gate electrode, a second gate electrode, a source region and a drain region, wherein the first gate electrode and the second gate electrode are embedded in the substrate respectively; the source region is formed in the substrate, and at least a portion of the source region is disposed between the first gate electrode and the second gate electrode; and the drain region is formed in the substrate, and at least a portion of the drain region is disposed between the first gate electrode and the second gate electrode.

1. Field of the Invention
The present invention relates to a semiconductor device, and more particularly, to a field effect transistor with multiple gates.
2. Description of the Prior Art
For pursuing higher density of device, better specification and lower manufacturing costs, such as fin-like field effect transistor, a three dimensions structure design, so called FinFET hereinafter, is used in advance semiconductor process to achieve these goals, however, field effect transistor (FET) based on this advance process can't support high voltage generally and price of masks is much higher, so it needs special device design like increasing area of transistor to support high voltage.

Semiconductor device and multiple gate field effect transistor


A method of enforcing web security, by: (a) receiving an incoming request; (b) applying a plurality of XML customized schemas to the incoming request, and thereby: (c) simultaneously validating the incoming request and determining whether the incoming request is authorized; and then, (d) (i) processing the incoming request if the incoming request is both valid and authorized, (ii) sending the incoming request to an authenticator if the incoming request is valid but not authorized, or (iii) ceasing operation on the incoming request if the incoming request is not valid.

Computer systems can be attacked and crashed when they receive malicious code. A common attack is to send the computer system code that can't be executed or processed (such as code that causes the computer processing to fall into an infinite loop, or code that is otherwise provided in an invalid format).
Traditionally, computer systems look to see whether the code they receive in incoming requests is: (i) "authentic" and (ii) "authorized". Determining whether the code is "authentic" involves determining whether the code is sent from a recognized source (i.e. determining who is sending the incoming request). Determining whether the code is "authorized" involves determining whether the person or entity sending the request is actually permitted to make this request of the system.
Traditionally, internet security has been accomplished by making sure that an incoming request is both authentic and authorized. (i.e.: determining who is sending this request and whether they are authorized to ask for what they're asking for). But one major weakness remains. If the code/request that is initially received is in an invalid format, the computer system can be crashed prior to the system even analyzing whether the request is authentic or authorized. Security systems do exist that validate code (i.e.: determine if it is in a proper format for processing prior to actually processing it). However, this validation step simply adds a third step onto the front end of the system as the code must be separately validated and then authenticated and then authorized. This third (validation) step expends considerable computer resources.
What is instead desired is a system in which validation, authentication and authorization could all be achieved, but not as three computationally separate steps that each separately consume valuable computer resources.
To date, standard "cloud" computing is simply separating application processing into separate remote locations. What is instead desired is "green" computing in which the total amount of energy used in actually processing a software (or hardware) application is reduced. This reduction in energy is best achieved by reducing the total amount of calculations performed in carrying out the software applications. As will be explained herein, the present invention advantageously reduces the total amount of calculations performed in carrying out software applications. In addition, the present invention avoids the problem of application specific servers sitting powered up and idle waiting to process incoming user requests. As will be explained, this is done in part by using servers that are not application specific. Thus, the present invention permits true "green" (i.e.: energy saving) computing.

Enforcing web services security through user specific XML schemas


There is disclosed a dual compartment solid phase extraction cartridge comprising a container divided into a top volume and a bottom volume by a porous filter or frit, the top and bottom volumes having a quantity of sorbent. The cartridge is useful in the separation of components of a liquid and solid mixture.

Liquid chromatography provides a means for separating the contents of a liquid sample based upon the polarity, solubility and mobility of the individual components. Within the past twenty years, high performance liquid chromatography (HPLC) has revolutionized the world of analytical chemistry by providing highly efficient columns and packing materials which allow for the separation of very closely related components of a liquid sample.
One drawback to either conventional liquid chromatography or HPLC has been that all samples must be completely dissolved before being applied to the column for separation. Any particulate material which reaches the sorbent or solid phase packing material may adversely effect the flow rate through the column and separation power of the packing and ultimately result in repacking the column or in the case of HPLC, disposal of the column and packing.
To prevent the inadvertent destruction of the packing material, filters or frits or guard columns have been placed at the head of the column which are designed to trap particulate matter which may inadvertently be injected. However, these filters and guard columns are known to clog necessitating extensive cleaning procedures or replacement. Thus, samples which contain partially dissolved material such as cell residue, mycelia, tissue homogenate, debris, etc., must be clarified before being placed on the column.
Several attempts have been made to circumvent the problems presented by the presence of particulate matter in a sample.
For example, simple filtration is often effective if the components of interest can be completely dissolved in the solvent used to prepare the sample. However, simple filtration is not an option when the analyte cannot be completely dissolved away from insoluble materials, such as biological samples where cell fragments may retain some of the material of interest.
In order to overcome this problem, techniques have been developed which involve multiple extraction of the samples and subsequent evaporation of the extract to dryness, followed by redissolution of the sample and finally separation of the resultant particle free solution using a solid phase extraction cartridge or by direct injection onto a chromatography column. The vigorous pre-treatment of the sample, to assure that any undissolved matter is first removed, is time consuming and costly.
A standard solid phase extraction cartridge, such as those manufactured and sold commercially by Applied Separations, Inc., Diazem.TM. Corporation, EM Science (a division of EM Industries, Inc.), Keystone Scientific, Inc., United Chemical Technologies, Inc., Waters Corporation, Whatman.RTM. Inc., Worldwide Monitoring.RTM., YMC, Inc. and many others is commonly used in this procedure. These devices consist of a column having a porous frit or filter which divides the column into a top and bottom section, where the bottom section contains a sorbent such as silica particles which are chemically reacted so that their surface contains various organic functional groups such as phenyl, octyl, octadecyl, or organic or inorganic polymers. When using these cartridges, a solubilized sample substantially free from particulate matters that could clog the top frit is added to the top section of the column and the liquid is allowed to flow either by gravity, under vacuum or by externally applied gas pressure, through the porous frit and then through the sorbent. As the sample passes through the sorbent, certain solutes are either absorbed or adsorbed onto the sorbent and retained. Various solvents are then used to elute the sorbed material in a sequential manner such that separation based upon polarity, solubility and mobility of the various compounds may be effected. The eluted samples may often be applied to an HPLC column or examined with other analytical techniques with or without further concentration.
While the combined use of the liquid extraction/redissolution technique and solid phase extraction cartridges is effective, it suffers from three major problems. First, the sample applied to the column must be substantially free from particulate matter capable of clogging the frit. Second, there is no assurance that all material in the original sample has been fully extracted from the insoluble matter by means of batchwise extraction methods. Third, the extractions, evaporation and redissolution of the sample introduces several inherent errors which must be considered when interpreting the final results.
Thus, what is needed is a simple economic device and procedure which provides for the separation of components, based on their polarity, solubility and mobility extracted from the original biological sample, according to the principles of counter-current extraction wherein the entire contents of the sample, both liquid and solid, can be treated directly, without clogging the column and with minimum inherent error.

Dual compartment solid phase extraction cartridge


Flexibilized vinyl halide polymers and copolymers having improved flame retarding and smoke suppressing as well as physical and electrical properties are described. The compositions are characterized by an unusual combination of ingredients comprising a base polymer flexibilized with chlorinated polyethylene, flame and/or smoke suppressants, stabilizers and plasticizers. The compositions exhibit improved flame and smoke suppression and low brittleness temperature over that of conventional fire and smoke suppressed PVC.

1. Technical Field
This invention is directed to polymeric compositions having improved resistance to flame spread and smoke evolution as well as improved physical properties. Such compositions are useful in forming primary insulation and protective jacketing for electrical conductors such as wire and cable, and are also suitable for buffering optical fiber. More particularly, this invention relates to flame and smoke resistant vinyl halide polymers having reduced rates of heat and smoke release and improved low temperature impact properties and dynamic thermal stabilities.
2. State of the Art
Because of today's need for the instantaneous transmission of data and information, reliance upon computer, word processing, electronic data transmission, sensor and telecommunications equipment is increasing at a phenomenal pace. The advent of technology is making it possible to interface and network this equipment, leading to the development of integrated communications systems. Such systems are increasingly installed in confined areas such as in high rise buildings, watercraft, aircraft, trains, drilling platforms and in mines. In order to link these electronic components, it is necessary to install thousands of feet of wire and cable throughout these structures and areas. Typically, it is a convenient practice to install the wire and cable through air handling plenums and wire and cable raceways. Because plenums and raceways are continuous throughout these installations, it is essential for safety that the insulation and jacketing materials have low flame spreading and smoke evolving properties as well as diverse physical properties for performance under a variety of hostile environmental conditions.
Polyvinyl chloride (PVC) has traditionally been the material of choice for wire and cable insulation because of its inherent flame resistant properties. PVC is well-known to be one of the least ignitable of the polymeric materials and once ignited it is one of the least flammable. Other desirable attributes include mechanical toughness, resistance to chemical corrosion, and good dielectric properties. Additionally, PVC is relatively low in cost. A drawback, however, is that PVC is a rigid thermoplastic that lacks flexibility. Upon exposure to temperature extremes, PVC loses its resistance to high heat distortion and low temperature brittleness. Another disadvantage is that PVC is highly viscous at processing temperatures without the use of plasticizing additives, and is therefore difficult to compound and process. Accordingly, plasticizers are added to PVC during processing to improve the processing characteristics and the flexibility of the end product. However, the use of plasticizers in wire and cable insulation applications is limited in that, plasticizers reduce the flame resistance, increase smoke evolution and impair the dielectric properties of the insulating material.
In order to overcome some of these disadvantages, it is known to blend PVC with chlorinated polyolefins and more particularly chlorinated polyethylene (CPE). For example, U.S. Pat. No. 3,845,166 discloses a wire and cable insulation composition comprising PVC, a chlorinated polyolefin, polyethylene and a crosslinking agent. This thermosetting composition may additionally contain various additives such as pigments, antioxidants, stabilizers and the like.
U.S. Pat. No. 4,129,535 discloses fire retardant PVC film compositions. The films comprise a blend of PVC, chlorinated polyethylene, a phosphate ester plasticizer, a magnesium hydroxide filler as well as zinc borate and antimony trioxide fire retardants.
In U.S. Pat. No. 4,280,940 there is disclosed a thermoplastic composition comprising PVC and a mixture of two differently chlorinated polyethylenes. The composition may additionally contain additives such as heat and light stabilizers, UV absorbers, lubricants, plasticizers, pigments and antistatic agents.
U.S. Pat. No. 4,556,694 discloses a method for improving the low temperature properties of PVC by adding a chlorosulfonated polyethylene and a chlorinated polyethylene. This patent teaches a synergistic effect between the CPE and chlorosulfonated polyethylene is necessary to achieve improved low temperature brittleness properties.
However, these compositions are lacking in that a combination of superior flame and smoke suppression and good low temperature performance, e.g., brittleness temperature, are not achieved. In addition, dynamic thermal stability (DTS) at medium and high shear rates is poor for the aforementioned compositions.
Another method being utilized to provide fire resistance to insulated wire and cable involves surrounding the insulated primary conductors with fire retardant jacketing materials. U.S. Pat. No. 4,401,845 discloses a cable comprised of a bundle of conductors which are insulated with a coating of poly (vinylidene fluoride)(PVDF), a sheath of poly (tetrafluoroethylene) (PTFE) impregnated glass wrap surrounding the bundle of insulated conductors and an outer protective jacket of PVDF. Although fluoropolymers have good resistance to flame and smoke spread, the inherently high dielectric constant of PVDF renders it unsuitable for many applications, such as, for example, in primary insulation for wire used in telecommunications cable. Moreover, fluoropolymers are relatively expensive.
Some of the disadvantages of prior fluoropolymer cable insulation construction have been overcome with the advent of PVC/PTFE/PVDF insulated cable construction. In U.S. Pat. No. 4,605,818 there is disclosed a cable construction comprising at least one conductor which is insulated with PVC coating, a sheath of woven glass impregnated with PTFE, and an outer protective jacket of PVDF. Although this cable construction provides good dielectric, flame and smoke resistant properties, there still is a need for wire and cable insulation with improved flame and smoke resistance.
As more stringent fire and safety standards are enacted, wire and cable insulation will require enormously improved fire and smoke performance while maintaining superior physical properties. There is therefore a need for a low cost wire and cable insulation composition having improved flame spread and smoke evolution characteristics while simultaneously having superior physical properties.

Flame and smoke retardant cable insulation and jacketing compositions


Methods are provided for obtaining a sample of β cells from an isolated donor pancreas or isolated pancreatic islets and analyzing the sample using flow cytometry to determine the percentage of β cells in the sample that express detectable levels of ALDH1 A3. If the percentage of ALDH1 A3-expressing β cells in the sample is about 3% or lower, then it is possible to determine that the pancreas or islets are healthy enough for implantation into a subject, and implanting the pancreas or islets. If the percentage of ALDH1 A3-expressing cells is above about 5%, then it is determined that the pancreas or islets are not suitable for implantation into the subject and discarding the pancreas or islets. Isolated non-insulin-producing or low-insulin-producing pancreatic beta cells are also provided.

Type 2 diabetes is associated with (and possibly caused by) defects in pancreatic β-cell mass and function. β cells of diabetics show a blunted and mistimed response to a glucose challenge. Moreover, unlike insulin resistance, which appears to remain relatively constant during the development of diabetes, β-cell function steeply deteriorates with time in a manner that is impervious to, and possibly worsened by, existing treatments. This occurs despite the fact that reversal of hyperglycemia can partly restore β-cell function, even in patients with advanced disease, hence the clinical conundrum of what is to be done to treat β-cell dysfunction. Treatments range from preserving β-cell function by reducing the metabolic demand on the β cells, to increasing β-cell performance and mass to meet the increased metabolic demand. Despite these efforts, it is still unclear whether the two primary components of β-cell failure, impaired insulin secretion and reduced β-cell mass, are mechanistically linked. Thus, understanding the mechanism linking these twin abnormalities can provide clues as to the best therapeutic approach to β-cell failure. Many cellular biological mechanisms and potential drug targets have been identified and postulated to play a role, either central or supportive, in β-cell dysfunction. Recently, in studies of FOXO1-deficient β cells, Applicant reported that β-cell dedifferentiation, rather than apoptosis, is a mechanism of β-cell dysfunction that can lead to new ways to intervene in the treatment of diabetes.

Use of aldehyde dehydrogenase as biomarker for beta-cell dysfunction and loss

The Trustees of Columbia University in the City of New York