A method for automated, in-line measurement of a differentiated surface cleanliness, in terms of carbon, of a continuously-moving metal sheet or strip, having a level of surface carbon pollution lower than 100 mg/m2, includes: generating a radiation beam using a source; focusing the radiation beam using a focusing device such that an energy density deposited on the metal strip or sheet is sufficient to create a plasma and generate CN radicals in the plasma if carbon and nitrogen are present; creating a nitrogen atmosphere around the plasma using a sweeping system with a flow rate that prevents any presence of oxygen from air in the plasma; analyzing light emitted by the plasma using an optical collection device, and redirecting the light toward a spectrometer or device for separating wavelengths of the emitted light; measuring an intensity of an intense vibration line of the CN radical.

When steel sheets are manufactured, the cold rolling process essentially generates two types of impurities on the surface of the sheets: on the one hand, surface carbon, which comes from the breakdown of the rolling oils, and on the other hand, iron fines, the origin of which lies in the interactions with the cylinders used for rolling.
This surface pollution is bothersome, since it requires more frequent cleaning of the cylinders and the stripping baths are polluted more quickly. This obviously incurs additional costs. The dirty sheets must also be annealed for a longer time, which is also more expensive. Furthermore, in the later galvanizing or painting steps, these deposits result in adherence defects that have consequences on the corrosion resistance of the finished products. Lastly, in the annealing furnaces, in particular before galvanizing, the carbonaceous pollution generates soot over time that is deposited on the walls of the furnace, which requires more frequent cleaning. Likewise, the iron fines may accumulate over time on the rollers of the furnace, which may cause flaws on the sheet.
The in-line measurement of this pollution has been subject to several developments in recent years. Presently, the three main methods are:                a relatively recent method is based on infrared radiation absorption. It is essentially influenced by the surface carbon and fairly little by the iron fines. The sensitivity is limited and there isn't much industrial distance yet (see Krauth P. J., "Contrôle de la propreté des surfaces d'acier", La Revue de Métallurgie—CIT, June 2002);        another method is based on the analysis of the brightness intensity of a plasma generated on the surface of the sheet by a focused laser beam. Initially, the device was measuring the noise generated by the plasma ("A real time method for surface cleanliness measurement", G. M. Bilmes et al., Appl. Phys. B 82, 643-648, 2006). However, the current system rather measures the overall brightness intensity of the plasma ("Practical Experiences with Novel Non-Contact, Online, Surface Cleanliness Measurement System", E. Almquist, U. Crossa, Proceedings Galvatech 2015). The system is essentially sensitive to the iron fines and relatively little to the carbon pollution;        lastly, to the knowledge of the inventors, the only device currently allowing in-line measurement of iron fines and surface carbon simultaneously and independently is based on the LIBS method and has been developed by the Applicant in the context of a European research project (Lowwear Project, RFCS Contract No RFSR-CT-2006-00010—1 Jul. 2006 to 31 Dec. 2009). This method, applied to the output of the cold rolling line, measures the level of iron fines by comparing the intensity of two iron lines with different energies. Indeed, the more fine particles there are to supply the plasma, the easier vaporization is and the more energy remains in the laser pulse to excite the atoms of the plasma to a high energy level. To measure the surface carbon, an intense carbon line is used, typically the line at 193 nm. The drawback of this measurement is that the wavelength of this line is in the distant UV and therefore it is absorbed by the oxygen from the air, which reduces the useful intensity during remote measurement. Another sensitive line exists at 247.8 nm, which is not absorbed much, but which is superimposed on an iron line, which makes it difficult to use.
Furthermore, in the modern production of high-quality steels, it is important to guarantee a very high level of surface cleanliness, in particular before galvanizing. To guarantee this, it is typical to clean the surface in degreasing baths in which a chemical solution removes the grime, essentially organic in nature, while one or several brushes allow to rid the sheet of solid pollutants such as iron fines. An in-line analysis method that clearly differentiates the carbon from the iron fines would therefore be interesting, since it would allow not only to evaluate the effectiveness of the degreasing, but also to determine whether a lack of cleanliness is related to a defectiveness of the brushing or to that of the composition of the cleaning solution.
The method proposed by the Applicant (see above) is effective after cold rolling, where the level of carbon pollution is around several milligrams of carbon per square meter. Conversely, after degreasing, this level drops to less than a few several tens of milligrams per square meter and the use of a carbon line partially absorbed by the oxygen from the air is insufficient to guarantee a precise measurement at these cleanliness levels.
Furthermore, it is known from the literature that the carbon present in organic compounds may advantageously be measured by its reaction in a plasma with the atomic nitrogen coming from the air or a gaseous nitrogen atmosphere surrounding the plasma.
This technique has in particular been used to analyze thin deposits of carbon nitrides ("CN emission spectroscopy study of carbon plasma in nitrogen environment", S. Abdelli-Messaci et al., Spectrochimica Acta Part B 60 (2005) 955-959) and for the differentiation of explosives ("New challenges and insights in the detection and spectral identification of organic explosives by laser induced breakdown spectroscopy", P. Lucena et al., Spectrochimica Acta Part B 66 (2011) 12-20).
Furthermore, some studies on organic materials allowed to explain the mechanisms for forming the CN radical in the plasma and to determine the energy densities required to create this type of radical ("Vibrational emission analysis of the CN molecules in laser-induced breakdown spectroscopy of organic compounds", Ángel Fernández-Bravo et al., Spectrochimica Acta Part B 89 (2013) 77-83).
In Aguilera J. A. et al., "Determination of carbon content in steel using laser-induced breakdown spectroscopy", Applied Spectroscopy, vol. 46, no. 9 (1992), pages 1382-1387, it is demonstrated that the LIBS method can be used to determine the carbon content in a steel, with a precision and a detection limit that are comparable to those obtained by atom emission spectroscopy. This document further shows that it is necessary to work under a nitrogen or argon atmosphere to prevent the measurement of the C from being influenced by the decomposition of the atmospheric CO2. The calibration curves were obtained by using the ratio of the C line at 193 nm and the Fe line at 201 nm (this Fe line does not interfere with the other lines). It is not possible to use the C line at 248 nm because it interferes with the Fe line at this same wavelength.
Lastly, document WO 2009/138262 A1 provides an in-line and automated method for measuring the cleanliness of a steel strip, consisting of image processing in order to analyze an oxidized ring created on the surface of the strip by a laser or electron beam.

Method and device for increasing the sensitivity of an in-line measurement of the surface cleanliness of steel strips

CENTRE DE RECHERCHES METALLURGIQUES ASBL


Systems and methods for operating a vehicle that includes a manual transmission are presented. In one example, a controller enters and exits a vehicle drive mode that is included in a plurality of vehicle drive modes in response to a clutch pedal being applied or released by a human vehicle operator. The vehicle drive modes include series hybrid, parallel hybrid, and electric vehicle only mode.

Hybrid vehicles may include a single ratio gear box or a step ratio automatic transmission. A controller of the hybrid vehicle typically selects a gear of the automatic transmission that is engaged and adjusts output of powertrain torque sources (e.g., internal combustion engine and/or electric machine) to improve vehicle efficiency. However, some human drivers prefer manual transmissions because manual transmissions allow the driver to have control over transmission gear shifting. To shift the manual transmission the driver depresses a clutch pedal and adjusts a position of a manual shift lever while the clutch pedal is depressed (e.g., applied). The clutch pedal opens a single clutch that disconnects an input shaft of the transmission from an engine crankshaft. Once the clutch is open, the driver may change a position of a shift lever to engage one of the transmission's gears. Once the gear is engaged, the clutch may be released to mechanically couple the engine's crankshaft to the vehicle's wheels. However, incorporating a manual transmission into a hybrid vehicle presents challenges. In particular, because the human driver is responsible for gear shifting, a gear shift may occur at nearly any time. A gear shift may disturb flow of power through the vehicle's powertrain and make it difficult or impracticable to carry on operation in a particular hybrid powertrain operating mode (e.g., series hybrid mode, parallel hybrid mode, electric vehicle only mode). Therefore, it may be desirable to provide a way of smoothly operating a hybrid vehicle that includes a manual transmission.
The inventor herein has recognized the above-mentioned disadvantages and has developed a method for operating a vehicle, comprising: operating a powertrain in an electric vehicle only drive mode; and starting combustion in an engine and adjusting engine rotational speed to a rotational speed of a transmission input shaft to exit the electric vehicle only drive mode in response to a human driver manually disengaging a clutch via a clutch pedal.
By starting an internal combustion engine and accelerating the engine to an input speed of a transmission input shaft, it may be possible to smoothly exit an electric vehicle only powertrain mode and enter a series or parallel hybrid powertrain operating mode. In particular, when the human driver depresses or applies a clutch pedal of a manual transmission while the vehicle is operating in an electric vehicle only hybrid powertrain operating mode, the internal combustion engine may be started (e.g., combusting fuel) so that engine torque may be available when the human driver releases the clutch pedal. If the human driver leaves the clutch pedal depressed while the engine is combusting fuel, then a battery may be charged to provide useful work from the engine. However, if the human driver released the clutch pedal and increases a driver demand torque, the engine power may be delivered to the vehicle's wheels. In this way, the human driver's operation of the clutch may be one of several conditions taken into consideration for switching between vehicle powertrain operating modes.
The present description may provide several advantages. In particular, the approach may allow a human driver to connect with a vehicle and provide smooth transitions between powertrain operating modes. Further, the approach may improve a human driver's confidence level when shifting a manual transmission. Additionally, the approach allows a human driver to change vehicle powertrain operating modes via a manual shift lever and operation of a clutch pedal.
The above advantages and other advantages, and features of the present description will be readily apparent from the following Detailed Description when taken alone or in connection with the accompanying drawings.
It should be understood that the summary above is provided to introduce in simplified form a selection of concepts that are further described in the detailed description. It is not meant to identify key or essential features of the claimed subject matter, the scope of which is defined uniquely by the claims that follow the detailed description. Furthermore, the claimed subject matter is not limited to implementations that solve any disadvantages noted above or in any part of this disclosure.

Systems and methods for a hybrid vehicle with a manual shift transmission


A heat exchanger includes flat tubes, a header, and a refrigerant inlet. The header has a first plate, a second plate, and a third plate. The first plate has a ridge portion defining a tank space. The second plate has a first flow passage and a second flow passage. The first flow passage extends in such a manner that an area of the first flow passage coincides with an area of the tank space. The second flow passage extends in such a manner that an area of the second flow passage does not coincide with the area of the tank space. An upper portion of the first flow passage and an upper portion of the second flow passage are connected to each other via a first connecting flow passage. A lower portion of the first flow passage and a lower portion of the second flow passage are connected to each other via a second connecting flow passage. The third plate has a communicating hole that allows the first flow passage and each of the flat tubes to communicate with each other.

Patent Literature 1 describes a heat exchanger. The heat exchanger includes a plurality of flat tubes aligned in an up-down direction and extending parallel to each other in a horizontal direction, and a pair of header tanks extending in the up-down direction and each connected to a corresponding one of both ends of each of the flat tubes. The header tank is composed of a joining plate having elongated holes into which the flat tubes are inserted to join the flat tubes to the joining plate, a communicating plate having communicating holes whose positions correspond to the positions of the respective elongated holes of the joining plate, and a tank plate in which a refrigerant passage having a semicylindrical shape is formed.

Heat exchanger and refrigeration cycle apparatus


An actuator device for a pressurized container incorporating an internal back flow prevention valve. The actuator may include a ball and socket check valve with a resilient component to maintain the ball in a condition to operate as a check valve even when upside-down.

Actuators are used to control the outflow of gas or fluid products from pressurized containers—such as aerosol cans. The actuator is designed to facilitate the gas or fluid flow from the pressurized container to a second location. The actuator may be designed to release the pressurized gas or fluid from an attached container when the actuator is depressed. Accordingly, when a user presses on the actuator, the gas or fluid is released and directed to the second location by the actuator.
In some systems, the secondary location is also a pressurized environment. For example, a vehicle air conditioning system may use a pressurized system containing refrigerant. A pressurized canister of refrigerant may be used to add refrigerant to the vehicle air conditioning system when needed. When a canister is connected to a secondary pressurized source, the secondary pressurized source will provide back pressure into the connections, tubing, and/or actuator components between the pressurized canister and the secondary pressurized source. This back pressure may cause operational problems. For example, the back pressure may cause the actuator to disconnect from the canister. For another example, the back pressure may cause refrigerant to leak through the connection between the canister and the actuator.


This application provides example methods for establishing a service path in a transport network and example systems. One example method includes, obtaining, by an automatically switched optical network (ASON) first node, a service path computation result path. The service path includes the ASON first node, an ASON last node, and at least one first edge network node. The method also includes sending, by the ASON first node, a path establishment request message to a downstream node. The path establishment request message carries cross-connection configuration information of the ASON last node and the at least one first edge network node. The method further includes receiving, by the ASON first node, a path establishment response message of the downstream node. The path establishment response message indicates that cross-connection configuration for the ASON last node and the at least one first edge network node is complete.

An automatically switched optical network (ASON) function has been implemented in a metropolitan area network and a core backbone network. In the metropolitan area network and the core backbone network, because a transport device has a strong hardware capability, a generalized multi-protocol label switching (GMPLS) protocol can normally start and run on a device, and an end-to-end service path can be automatically established by using resource reservation protocol-traffic engineering (RSVP-TE) of the GMPLS protocol.
However, in an edge network, a hardware capability of an edge network device is relatively weak, and hardware resources such as a central processing unit (CPU) and a memory cannot meet a requirement of a protocol such as GMPLS. Therefore, a service path of the edge network device cannot be automatically configured by using the GMPLS protocol, and can only be manually configured by using a network management system. FIG. 1 shows a network architecture across an edge network and a metropolitan area/core network (ASON). As shown in FIG. 1, when a service path from an edge network node A to an edge network node L is to be created, the service path needs to pass through three sections: a path A-B-D in an edge network 1, a path D-E-F-I in a metropolitan area/core network 2, and a path I-J-L in an edge network 3. For the path D-E-F-I in the metropolitan area/core network 2, a network management system delivers a command for creating a service D-I to a first node D. The first node D may establish cross-connections along the service path D-E-F-I hop by hop by using RSVP-TE signaling, and automatically establish an end-to-end service path. For the path A-B-D in the edge network 1 and the path I-J-L in the edge network 2, because the edge network device does not support the GMPLS protocol, cross-connections of a service path can only be configured node by node by using the network management system. The service path of the edge network is manually configured by using the network management system. This is inefficient and is prone to errors, resulting in low service provisioning efficiency.

Method for establishing service path, network device, and system


The invention concerns a dispensing apparatus (1) with high refrigerating power, for delivering to users refrigerating elements (10) capable of diffusing frigories over a relatively great lapse of time so as to avoid interrupting the cold chain, comprising an input and disinfecting module (2) arranged above the refrigerating and storage module (6). The input (4) and output (7) orifices of the refrigerating and storage module are located substantially in the same plane and in the upper part of the docule which further includes third transfer mechanism (9) designed to lift the refrigerating elements towards the output orifice.

The present invention concerns an apparatus for dispensing rechargeable refrigerating elements, especially plates or packets containing a substance formulated to accumulate frigories, comprising at least:
an input and disinfection module for said refrigerating elements provided with an input opening, an output opening, and a first means for transferring said elements between the two orifices; and
a refrigeration and storage module for said refrigerating elements provided with an insulated case, a cold generating device for charging said refrigerating elements with frigories, an input orifice corresponding to the output orifice of said input and disinfection module, and an output orifice, said orifices traversing a wall of said insulated case; and with a second transfer means using gravity to transport said refrigeration elements for recycling inside said refrigeration and storage module.
It is well known that a regard for maintaining the temperature of frozen products is essential, since health threatening micro-organisms can develop very rapidly. In practice, with sensitive products such as ground beef there should be virtually no health threatening toxins or micro-organisms present, not even in minute amounts. At xe2x88x9210xc2x0 C., bacteria stops multiplying completely. The risk of finding bacteria and pathogenic toxins is non-existent up to +3xc2x0 C. Above that level, dangerous salmonella (+5xc2x0 C.) and staphylococcus aureus (+6xc2x0 C.) can multiply rapidly. Only scrupulously maintaining the cold chain eliminates these risks.
In order to maintain the cold chain on the way home over a substantial period of time, even during extreme summer heat, a consumer can currently place one or more refrigerating elements in an insulated container which holds fresh or frozen products just purchased. One or more of these refrigerating elements charged with frigories at xe2x88x9218xc2x0 C. diffuses frigories throughput the insulated container. This maintains the temperature of the products without disrupting the cold chain. In order for the consumer to buy or obtain a refrigerating element charged with frigories, a dispensing device as defined above and known through Publication No. F.R.-A-2 745 933 is provided at the point of service. It dispenses and recycles these refrigerating elements. This dispensing device is found principally in large stores near the shelves of frozen products. In the realm of this application, a refrigeration temperature of xe2x88x9218xc2x0 C. is sufficient.
This particularly simple, economical and non-polluting technology can be used prior to distribution, specifically to eliminate the use of dry ice when transporting frozen products. This application requires refrigerating elements of larger volume as well as a higher charge of frigories. For this purpose, the refrigeration temperature inside the refrigeration and storage module should be as low as xe2x88x9235xc2x0 C., for example.
The dispensing apparatus known in the art does not achieve this objective, primarily because of cold escaping at the outlet orifice located on the lower portion of the dispenser.
The present invention proposes overcoming this disadvantage with a dispenser for high capacity refrigerating elements which dispenses and recycles refrigerating elements that can be placed in containers for transporting frozen products and which maintains the cold chain from the dispenser to the consumer""s home.
To achieve this, the invention concerns an apparatus for dispensing refrigerating elements such as that described in the preamble, characterized:
in that the inlet and disinfection module is located above said refrigeration and storage module,
in that the input and output orifices of said refrigeration and storage module are located in the upper portion of said module,
and in that the refrigeration and storage module comprises a third transfer means for lifting the refrigerating elements to the input orifice.
Preferably the input and output orifices of the refrigeration and storage module are located in essentially the same plane.
In a preferred embodiment of the invention, the first transfer means comprises an inclined ramp which uses gravity to transfer the refrigerating elements from said input orifice to said output orifice.
The input and disinfection module may advantageously comprise a cleaning device comprising two circular brushes arranged symmetrically relative to said inclined ramp along the path of the refrigerating elements, each brush being attached to a motor drive rotating plate.
The input orifice may also comprise a presence detector designed to transmit a signal to the motorized element of the cleaning device when a refrigerating element is detected, said presence detector comprising an articulated angled finger subjected to a recall spring designed so that its free extremity is located at the rear of said input orifice on the trajectory of the refrigerating elements, and at least one micro switch.
Preferably, the input orifice of the refrigeration and storage module comprises a sealed door consisting of a flexible spline which opens under the weight of a refrigerating element.
In the preferred embodiment, the second transfer means consists of a helicoidal rail extending inside the case from the input orifice at the upper portion to the lower portion, the purpose of said rail being to receive said refrigeration elements which are generally vertical and in overlapping arrangement on its upper generatrix. In this case the input orifice of the storage and refrigeration module is located along an essentially vertical axis and the inclined ramp of the first transfer means forms an acute angle with the axis of said input orifice.
According to the preferred embodiment, the third transfer means comprises a guide tube extending inside the case from the lower portion thereof to its output orifice at the upper portion, and which receives the superimposed, vertical refrigerating elements with the lower portion of this guide tube comprising a window located opposite the lower extremity of the rail, as well as a lifting device for lifting the superimposed refrigerating elements inside said guide tube in order to accommodate a new refrigerating element arriving from the helicoidal rail; the lower extremity of the helicoidal rail is rectilinear and essentially perpendicular to the window in said guide tube.
The lifting device may comprise a retractable projecting element articulated to the extremity of a runner located in a support that is parallel to and behind the guide tube, said runner moving in a back-and-forth translational motion alternating between a lowered position and a raised position, with the projecting element moving between two positions, an exit position where it extends inside the guide tube while moving forward, and a returned position where it is retracted inside the support; and the lifting device comprises a stop which limits rotation by the articulated projecting element in its projecting position.
In the preferred embodiment, the articulated projecting element is essentially triangular in shape such that when it is extended, its upper surface is essentially horizontal, and when it retracts its lower surface is essentially vertical; the two surfaces together form an acute angle.
Advantageously, the outlet orifice comprises a sealed door designed to open when pushed by a refrigerating element stored in the guide tube, said sealed door sliding within an inclined support located outside said sealed case and comprising, at the extremity that blocks said output orifice, a bisected surface that generates a backward motion when pushed by said refrigerating element. In this case the output orifice is preferable disposed on a vertical axis and the inclined support forms an acute angle with the axis of this output orifice.

Apparatus dispensing rechargeable refrigerating elements

Internova International Innovation Company B.V.


A system and method for rapid detection of viable microorganisms (e.g., pathogens) in liquid media suspensions utilizes at least two electrodes in electrical communication with a suspension (e.g., liquid media possibly containing microorganisms). Electrical response to an electrical pulse in a short initial time window (e.g., no longer than a time required to attain 95% (or another threshold percentage) of a steady state electrical response value after a change in state of the pulse) permits bulk electrical response of the suspension between the electrodes to be determined before electrical response signals are dominated by double layer formation at surfaces of the electrodes. Pulse application and detection of electrical response to a change in state of a pulse may be repeated over time, with changes in such response being useful to detect microorganism proliferation in a bulk suspension.

Microorganisms or pathogens, such as bacteria, viruses, fungi, yeasts, and molds, can readily proliferate in various media. Contexts in which it may be valuable to rapidly detect the presence of viable microorganisms include infectious disease diagnosis in mammalian fluid samples and treatment as well as quality testing of consumable items such as food, beverages (including water), and pharmaceuticals.
Bloodstream infections (septicemia) and the systemic inflammation they produce (sepsis) represent serious healthcare concerns. Sepsis is most frequently caused by bacterial infections, but it may also be attributable to viral, fungal, or yeast infections. An infection can begin anywhere bacteria or other infectious agents enter the body, such as via an abrasion or wound site, or as a byproduct of a more serious medical problem such as appendicitis, pneumonia, meningitis, or a urinary tract infection. Because sepsis can begin in different parts of the body, it can have different symptoms.
Prompt identification and treatment of the primary cause (or causes) of infection are essential to control of sepsis. When faced with a patient exhibiting symptoms that may suggest sepsis, medical personnel may administer broad-spectrum antibiotics (to kill or reduce proliferation of many types of bacteria, such as both gram-positive and gram-negative varieties), and initiate processes to confirm the existence of a bloodstream infection as well as identify the responsible pathogen. Existence of an infection may be confirmed by culturing and analyzing one or more body fluids (e.g., blood, but possibly also including urine, sputum, etc.), which traditionally has required 12-72 hours to obtain a positive result and up to 120 hours for a result to be deemed negative. For certain pathogenic infections (such as Tuberculosis), the time to obtain a positive result can be even longer. A common treatment regimen involves initial administration of broad-spectrum antibiotics to reduce proliferation of many types of bacteria (e.g., both gram-positive and gram-negative varieties) before culture results and antimicrobial susceptibility are known. For positive cultures, bacteria may be identified by various methods (e.g., biochemical tests or PCR-based DNA analysis, requiring additional time but less than the initial culture step) before targeted antibiotics are administered. For every hour of delay before targeted antibiotic therapy is initiated, the risk of death for a patient afflicted with sepsis may increase significantly (e.g., approximately 7%). Accordingly, reducing the time required to positively determine the presence of a bloodstream infection is expected to significantly reduce mortality attributable to sepsis.
Application of alternating current (AC) electrical signals to liquid suspensions provides a basis for detecting the presence of microorganisms, as disclosed in U.S. Pat. No. 8,635,028 to Sengupta et al. ("the Sengupta patent"). The underlying principle is that in the presence of an AC electric field, a viable (intact) bacterial cell membrane becomes polarized, leading to the buildup of charges across the membrane such that viable microbial cells behave like electrical capacitors. An increase in the number of bacteria due to proliferation results in a corresponding increase in bulk capacitance of the bacteria-containing suspension, due to an increase in the total amount of charge stored by the microorganisms. This increase in total amount of charge cannot be directly measured, however, since the capacitance at each solid-liquid interface (i.e., forming a "double layer") between an electrode and the suspension is dramatically larger (e.g., ˜1000 times larger) than the bulk capacitance of the bacteria-containing suspension. The double layer formed on each electrode includes a first layer of surface charge composed of ions attracted to the electrode surface (e.g., due to chemical interactions), and a second layer of ions attracted to the surface charge (e.g., via the coulomb force) and serving to electrically screen the first layer. The second layer is made of free ions that move in the fluid under the influence of electrical attraction and thermal motion, and may be referred to as the "diffuse layer."
FIG. 1A is a schematic diagram of an impedance detection system 10 utilizing a channel 11 containing first and second electrodes 12, 14 arranged to contact a bulk liquid suspension 20 containing microorganisms 22. The electrodes 12, 14 are coupled between a variable power (e.g., current) source 16 configured to generate an alternating current (AC) signal and a voltmeter 18. Upon application of an electrical potential between the electrodes 12, 14, a double layer 12A, 14A is formed at each electrode 12, 14. FIG. 1B provides an equivalent circuit diagram for the electrodes 12, 14 and bulk liquid suspension 20 of FIG. 1A. FIG. 10 provides an equation for determining impedance utilizing the impedance detection system 10 of FIG. 1A. Other electrode configurations are also possible, as are other channel or well configurations.
To address the difficulty of determining capacitance of a bulk liquid suspension in view of its value being screened by capacitance of a double layer, the Sengupta patent discloses the use of an Agilent 4294A Impedance Analyzer instrument to measure the electrical impedance between two electrodes wetted with a bacteria-containing liquid suspension at multiple (>500) frequencies from 1 kHz to 100 MHz. The instrument measured the magnitude and phase of the AC current that flows through the suspension upon the application of a sinusoidal AC voltage that flows through the suspension of 500 mV (peak-to-peak), and calculated the impedance (i.e., resistance and reactance) from the measurements. Since the current is not in-phase with the applied sinusoidal voltage, the impedance (which can be considered as the AC analog of DC resistance) has both an in-phase component called the resistance (R), and an out-of-phase component called the reactance (X). The instrument measured R and X values for each sample, over the frequency range of 1 kHz to 100 MHz, and generated an impedance data set containing the values of R and X for each of the multiple frequencies. By measuring values indicative of impedance at multiple predetermined frequencies (i.e., frequency domain impedance sensing), the value of a parameter in a theoretical circuit model reflecting the amount of capacitive charge stored in the interior bulk of a suspension can be determined—and by repeating this step after predetermined intervals of time to reflect changes in bulk capacitance of a suspension, the presence or absence of viable bacteria in the suspension can be determined.
One drawback of the system and method described by the Sengupta patent is that it involves a significant amount of manual labor (i.e., to draw aliquots from an incubated sample every hour for analysis, taking impedance measurements at multiple frequencies, and analyzing the results offline). Additional limitations of the system and method described by the Sengupta patent relate to analysis speed, cost, and complexity. Even if sample handling steps were automated, gathering data while sweeping over a wide range of frequencies (e.g., at hundreds of frequencies within the range of 1 kHz to 100 MHz) is believed to entail at least about two (2) minutes per sample. Additionally, the (analog) instrumentation required to apply AC signals over a wide range of frequencies and to analyze the resulting signals may be complex and relatively expensive.
The art continues to seek improved systems and methods for rapid detection of viable microorganisms in liquid media.

System and method for rapid detection of viable microorganisms in liquid media


A semiconductor device has a heat dissipating base; a patterned insulating substrate attached to the heat dissipating base with a solder therebetween; a semiconductor chip attached to a conductive pattern of the patterned insulating substrate with a solder therebetween; a first conductor attached to the semiconductor chip with a solder therebetween; a resin case attached to the heat dissipating base with an adhesive; and a second conductor attached to the first conductor by laser welding. The second conductor formed by rolling has stripe-shaped rolling traces formed on a surface thereof in a rolling direction and is disposed on the first conductor such that the rolling traces are arranged in a same direction.

With the recent reduction in size and increase in capacity of a power semiconductor module, a power semiconductor chip in a power semiconductor module (e.g., an insulated gate bipolar transistor (IGBT)) is therefore operated at high current density. The crucial problem with such power semiconductor module, therefore, is how to dissipate heat generated therein.
Specifically, while an upper limit of the guaranteed temperature is set for a joint temperature Tj of a semiconductor chip in a power semiconductor device such as an IGBT, in a one-sided cooling system in which a semiconductor chip is mounted on a heat dissipating base (copper base plate) with a patterned insulating substrate therebetween, heat dissipation from the upper surface of the semiconductor chip is hardly expected because the upper surface of the semiconductor chip is sealed with sealing resin filling the package. As the heat density increases due to the reduction in size and increase in current of the semiconductor chip, the conventional wiring structure in which an aluminum wire is used as a wiring lead to be connected to an upper surface electrode of the chip for bonding cannot easily reduce the joint temperature of the chip to the upper limit guaranteed temperature or lower. Moreover, combined with Joule heating from the aluminum wire, wire fusing may occur, which brings concern that the power cycle resistance of the semiconductor chip becomes low.
As the means to improve heat dissipation of the upper surface of the semiconductor chip, a lead frame, for example, can be used in place of the aluminum wire. In this case, a lower lead frame is soldered and attached to an upper surface main electrode of the semiconductor chip, and an upper lead frame is disposed on this attached lower lead frame in such a manner as to be superimposed on the ends thereof. A module structure is known in which an upper lead frame and a lower lead frame are laser-welded and attached to each other and used as a heat transfer path to release heat of the semiconductor chip from the upper surface thereof.
FIGS. 11 to 13 are configuration diagrams of a conventional power semiconductor module. FIG. 11 is a plan view showing substantial parts of the conventional power semiconductor module, FIG. 12 is an enlarged view of a section A shown in FIG. 11, and FIG. 13 is a schematic cross-sectional view of substantial parts, taken from line X-X of FIG. 11. FIG. 13 also shows a laser beam.
A power semiconductor module 500 is configured by a heat dissipating base 51, a patterned insulating substrate 56 attached onto the heat dissipating base 51, with a solder 52 therebetween, and a semiconductor chip 58 attached onto a conductive pattern 55 of the patterned insulating substrate 56, with a solder 57 therebetween. In the patterned insulating substrate 56, a conductive film 53 is formed on a rear surface of an insulating substrate 54 and the conductive pattern 55 on a front surface of the same.
The power semiconductor module 500 is also configured by a lower lead frame 60 attached to an upper surface electrode of the semiconductor chip 58 with a solder 59 therebetween, an upper lead frame 61 laser-welded and attached to the lower lead frame 60, a resin case 62 that is attached to the heat dissipating base 51 by a silicone adhesive 62a and fixed, in a penetrating manner, to the lower lead frame 60 serving as an external terminal, and gel, not shown, which fills the resin case 62. The lead frames 60 and 61 are disposed randomly without specifying a direction D of rolling traces 69 (a rolling direction) formed on the lead frames 60 and 61.
The upper lead frame 61 and the lower lead frame 60 are laser-welded and attached to each other as described above, and the attached portions therebetween are electrically connected to configure current paths.
When laser-welding the lower lead frame 60 and the upper lead frame 61 to each other, a laser beam 64 is radiated from a laser emitting unit 63 onto the upper lead frame 61, to melt and solidify the upper and lower lead frames 60 and 61.
The laser beam 64 is radiated at an angle θ of approximately 10° to 15° with respect to a vertical line 66 on the irradiated surface of the upper lead frame 61.
Further, attached portions 65 (laser-welded sections) to be obtained as a result of the radiation of the laser beam 64 are specified by a camera and a light source, not shown, which are installed in the laser emitting unit 63 and a monitor, also not shown, which is installed outside the laser emitting unit 63. Visible light is emitted from the light source. Resultant reflected light from the irradiated surface is captured by the camera installed in the laser emitting unit 63, and the camera transmits a signal corresponding to the reflected light, to the monitor. Through the image displayed on the monitor, the irradiation section can be specified. Because the optical axis of this visible light coincides with an optical axis 67 of the laser beam, the visible light, too, is radiated at an angle θ of approximately 10° to 15° with respect to the vertical line 66 on the irradiated surface.
The number of joining points and joining areas corresponding to the attached portions 65 between the upper lead frame 61 and the lower lead frame 60 are determined in consideration of the conditions under which the power semiconductor module 500 is used (heat generation due to electrification, joint strength in relation to the reliability).
Extra points between the upper lead frame 61 and the lower lead frame 60 are laser-welded in consideration of inconsistent laser welding occurring therebetween.
Patent Documents 1 and 2 disclose the technologies for laser-welding a plurality of lead frames.
Patent Document 3 describes a method of manufacturing a semiconductor device in which a lead frame is roughened for the purpose of reducing the laser welding inconsistency.    Patent Document 1: Japanese Patent Application Publication No. 2008-98585    Patent Document 2: Japanese Patent Application Publication No. 2008-42039    Patent Document 3: Japanese Patent Application Publication No. 2008-28286
FIGS. 14(a)-14(c) show a method of forming a lead frame and FIGS. 14(a) to 14(c) are process diagrams showing respective steps in sequence. First of all, a thick copper plate 72a is rolled with a roll 71 into a copper plate 72 of a predetermined thickness, as shown in FIG. 14(a). Next, a desired lead frame 61 is punched out of the copper plate 72 of the predetermined thickness, as shown in FIG. 14(b) (the upper lead frame is shown in this diagram). Thereafter, the lead frame 61 is removed from the copper plate 72, and a predetermined section of the lead frame 61 is bent (not shown), as shown in FIG. 14(c). As a result of rolling the copper plate 72a, stripe-shaped rolling traces 69 are formed on the surface of the lead frame 61. Because these rolling traces 69 are formed in the rolling direction D, the direction D of the formed rolling traces 69 is same as the direction D in which the rolling is performed (the rolling direction).
As shown in FIG. 12, the direction D of the rolling traces 69 of the upper lead frame 61 lies in a random direction (diagram shows the rolling traces 69 formed in perpendicular and parallel directions) when the upper lead frame 61 is disposed. When radiating visible light to the upper lead frame 61 in order to detect the sections to be laser-welded, the fact that the direction D of the rolling traces 69 of the upper lead frame 61 lies in a random direction intensifies the fluctuations of the intensity of the visible light reflecting off of the irradiated surface. As a result, the visibility of the camera drops, erroneously detecting the sections to be welded.
An Ni-plated layer having a thickness of approximately 10 μm, for example, is formed on the surface of the lead frame 61 (Cu) in order to increase its absorption rate of the laser beam 64.
None of Patent Documents 1 to 3 mentions that the rolling traces of the plurality of lead frames are arranged in the same direction (the rolling direction) to perform laser welding.

Semiconductor device with specific lead frame for a power semiconductor module


A method of ensuring the integrity of read-only components in deployed mixed-mode applications that includes generating a digital fingerprint prior to the deployment of a mixed-mode application is discussed. The digital fingerprint is based on a read-only component in the mixed-mode application and uniquely identifies the read-only component. The method also deploys the mixed-mode application and the digital fingerprint. Additionally, the method verifies, at execution time by using the digital fingerprint, that the read-only component in the mixed-mode deployed application that served as the basis for the digital fingerprint is identical to the same read-only component originally packaged with the mixed-mode application.

Deployable applications include a mixture of executable code and optional data files. The executable code is derived from human readable source code and is usually generated in a non-human readable format (referred to herein as "executable machine code"). A "mixed-mode" application includes both executable machine code components suitable for direct execution by computer hardware and a combination of human-readable source code and (typically) non-human-readable pseudo-code suitable for indirect execution in conjunction with a virtual machine (e.g. Java bytecode, .NET MSIL code, MATLAB M-code, MATLAB P-code, etc). It should be specifically noted that the term "pseudo-code" is used herein to refer to code executable by a virtual machine rather than the alternative meaning of informally written program code. When mixed-mode applications contain human-readable source code, the source code is typically translated to pseudo-code before execution by the virtual machine. Although the executable machine code is generated in a non-human readable format, each executable machine code component is accessible through a well-defined interface which can be revealed through the use of commonly available tools. Other read only components of the deployed application may be similarly vulnerable. For example, data stored in industry-standard format is easily modified by a malicious entity.
Unfortunately, the fact that the executable machine code components are accessible through well-defined interfaces presents a security issue. Malicious entities may replace executable machine code components with other units using the same interfaces. One possible approach to this security vulnerability is to encrypt the executable machine code as part of the deployment of the mixed-mode application. However, the additional computational overhead associated with the encryption and decryption process for the machine executable code frequently represents an unacceptable reduction in application performance or increased security risk since an encrypted executable machine code component can't be loaded by the operating system until it is decrypted and that exposes it to attack. Although the source code and pseudo-code may also be accessed through interfaces, the access does not present the same security problem as does the access to the executable machine code since the pseudo-code runs in a virtual machine, and is free to have a format independent of the hardware-specific format required of "true" executable code, thus allowing it to be stored in an encrypted or otherwise secure form. Since the virtual machine which executes the pseudo-code has complete control over the process of loading and executing the source code and pseudo-code, there is no requirement that source code or pseudo-code be decrypted on disk before being loaded. Thus, entire source code and pseudo-code files or functions may be encrypted without the vulnerabilities associated with the encryption of executable machine code components. Furthermore, source code and pseudo-code files are often much smaller than executable machine code components, greatly reducing the computational effort required to encrypt and decrypt them. Note, however, that the techniques of this invention could equally well be applied to source code or pseudo-code files or functions, should such application produce computational benefits. Accordingly, because of these security issues with deploying native executable machine code components, it would be desirable to have a mechanism through which vendors of virtual machines can verify that the native executable machine code components in a mixed-mode application have not been tampered with by an outside entity and is in its original deployed condition prior to being executed in the virtual machine.

System and method for verifying the integrity of read-only components in deployed mixed-mode applications


A proximity to terrain warning system for aircraft utilizes a first set of warning criteria to generate a warning in the event of insufficient terrain clearance after take off. A different set of criteria are employed to generate warnings when the aircraft in in a cruise or approach phase of flight or on a tactical mission. Mode switching is provided to select the appropriate criteria and to select an excessive descent after take-off set of warning criteria in addition to the first set of criteria when appropriate.

Ground proximity warning systems that have a terrain clearance mode which provides a pilot with a warning in the event that the aircraft should descend below a predetermined altitude above the ground are known. Examples of such systems are described in U.S. Pat. Nos. 3,946,358, 3,944,968 and 4,030,065. Such terrain clearance warning systems are generally not used alone, but rather are used in conjunction with other warning criteria to warn the pilot of other hazardous conditions, such as excessive closure rate with terrain, excessive sink rate, excessive descent after take off, excessive descent below the glide slope and descent below a preset minimum altitude to form a ground proximity warning system. These different warning criteria are often referred to as modes of operation. Not all of the modes of operation are generally enabled simultaneously, and mode switching is provided to switch to the appropriate mode or modes associated with a particular phase of flight.
A ground proximity warning system employing multiple warning modes is described in U.S. Pat. No. 3,946,358. The aforementioned patent discusses a negative climb after take-off mode, which is activated upon take off and generates a warning if the aircraft should descend excessively before reaching seven hundred feet of radio altitude. Also described is mode switching circuitry for switching between the negative climb after take-off mode and the terrain clearance modes. Other patents that disclose various warning modes and mode switching circuitry are U.S. Pat. Nos. 3,947,810; 4,319,218 and 4,433,323.
The above-described systems are designed for transport aircraft and utilize signals representative of landing gear and flap position to alter the warning criteria and effect mode switching. However, not all aircraft are operated as are transport aircraft, and consequently, flap and gear position may not be a reliable indicator of the phase of flight, particularly, in the case of military aircraft, such as, for example, the Lockheed S3-A. In addition, military aircraft have different flight and operational characteristics than transport aircraft, and additional sets of warning criteria must be provided to accommodate such aircraft and the ways in which they are operated.

Aircraft terrain warning system with configuration modified warning and improved mode switching


A microfluidic device may include a first fluid chamber, a second fluid chamber, a first microfluidic passage extending between the first fluid chamber and the second fluid chamber, a second microfluidic passage extending from the second fluid chamber, a first fluid actuator adjacent the first microfluidic passage and proximate the first fluid chamber to inertially pump fluid away from the first fluid chamber and a second fluid actuator adjacent the first microfluidic passage and proximate the second fluid chamber to menially pump fluid towards the first fluid chamber.

Microfabrication involves the formation of structures and various components on a substrate (e.g., silicon chip, ceramic chip, glass chip, etc.). Examples of microfabricated devices include microfluidic devices. Microfluidic devices include structures and components for conveying, processing, and/or analyzing fluids as well as the chemical and/or biochemical reactions involving such fluids.
Throughout the drawings, identical reference numbers designate similar, but not necessarily identical, elements. The figures are not necessarily to scale, and the size of some parts may be exaggerated to more clearly illustrate the example shown. Moreover, the drawings provide examples and/or implementations consistent with the description; however, the description is not limited to the examples and/or implementations provided in the drawings. The schematic diagrams are not drawn to scale.

Hewlett-Packard Development Company, L.P.


A software framework provides building blocks for developing event handlers (typically XML-based or data object based) and a mechanism for dynamically deploying and managing them within an online community having roles and places defined for users and groups. The complex data to be sent/received among users and applications can be described in XML or actual Java(trademark) objects. The software framework is composed of the following principal components: Awarelet base, Awarelet Container, Awarelet Application Adapter, Awarelet Event, Awarelet Configuration, and Awarelet Repository. Awarelet Technology is designed to enhanced the prior art of Instant Messaging in order to facilitate more robust interactions between members of the online community. This invention considers not only users as members, but in addition, business applications and processes as well. The present invention aims to solve the problems stemming from lack of support for business related collaborations in the prior art, as well as enhance the ability to send and receive complex informational events. This Awarelet Technology allows for the creation of real-time business related collaborations in order for the members of an online community to exchange business events and context. Awarelet Technology brings the notion of context and structure to the members of online communities and can be used to construct powerful real-time business related collaborations.

1. Field of the Invention
The present invention generally relates to real-time collaboration and, more particularly, to handling events which can be either XML (eXtensible Markup Language) based or data object based, using xe2x80x9cAwareletsxe2x80x9d that are either visual or non-visual event handlers. The invention provides a mechanism, realized in software, for building and deploying Awarelets.
2. Background Description
Many e-business and e-commerce solutions seek real-time collaboration capabilities to support on-line communities and collaborative business processes. The real-time collaboration in such solutions must be manifested through an awareness of the xe2x80x9cpoint-of-presencexe2x80x9d (client side) of the participants and the ability to channel services of interest to the participants.
When a user is considered to be xe2x80x9conlinexe2x80x9d, that end user has a client application which represents the end user""s point of presence connection to an online community server, or awareness server (server side) which manages a community of users. The end user interacts with other end users, typically by sending and receiving simple text messages in real time, via the point of presence connection to the server.
A common scenario today is where users are connected to the Internet via Web browsers. In this scenario, the user must xe2x80x9cpullxe2x80x9d (request) the information; sites cannot xe2x80x9cpushxe2x80x9d (send unsolicited) information. There are exceptions to this, such as instant messaging, but most involve an explicit agreement by the user to accept unsolicited data.
The ability to pass data between users in a community without explicitly requesting each piece of data is part of the concept of real-time collaboration. More broadly, collaboration is the real time sharing of information among a set of users who define a community. There is a large amount of software that currently provides collaboration in one form or another. The following set of examples is by no means inclusive or particularly representative; they merely demonstrate some of the currently available products.
Instant Messaging infrastructures like those provided by America Online (AOL), Lotus(copyright) Sametime, ICQ, Microsoft(copyright) MSN Messenger and others are the prior art targeted for improvement by this invention. The prior art typically provides instant messaging and primarily allows for simple real-time adhoc collaborations within an online community by passing simple text messages between the users. In addition, Instant Messaging infrastructures, as provided by AOL, provide for a notion of user groups, sometimes called buddy lists, which are users that a user typically interacts with. In essence, AOL Instant Messenger provides the capability of generating ad hoc private chat rooms. These simple groupings are managed by the user, and are not really part of the underlying system.
Traditionally, business driven collaborations involve more complex interactions and the exchange of more complex messages between multiple role players, as well as business applications and processes. The lack of ability to pass complex messages, in the prior art, between the users limits the potential of creating more complex interactions or collaborations between the users. The prior art typically does not address such complex collaborations, primarily due to three fundamental factors. First of all, the simple text messages passed between users are not sophisticated enough to allow for complex message processing. Second, the notion of buddies and groups does not support a more powerful notion of role players. Third, the members of the online community in the prior art consist of end users only, and applications or processes are not engaged during these simple adhoc collaborations.
The systems of the prior art only allow end users to interact with each other by sending and receiving simple text messages in a chat room-like environment. Sometimes there is a mechanism to allow end users to share applications and transfer files as well, but application sharing and file transfer are not addressed in this disclosure.
It is therefore an object of the invention to solve the real-time collaboration problem through xe2x80x9cAwareletsxe2x80x9d that are either visual or non-visual event handlers. Events can be XML (eXtensible Markup Language) based or data object based. The invention provides a mechanism, realized in software, for building and deploying Awarelets. Solution and application developers will be able to customize and integrate Awarelets to realize real-time collaborative solutions using an open standard such as XML to define the real-time events of interest.
It is another object of this invention to provide a framework to handle more complex types of data exchange that are handled by the Awarelets, as described below. The present invention enhances the notion of exchanging messages by allowing more complex messages to be sent and received by end users and applications.
Awarelet Technology is designed to enhance the prior art of Instant Messaging in order to facilitate more robust interactions between members of the online community. The members of the online community are typically just end users in the prior art; however, this invention considers not only users as members, but in addition, business applications and processes as well.
The present invention aims to solve the problems stemming from lack of support for business related collaborations in the prior art. Awarelet Technology allows for the creation of real-time business related collaborations in order for the members of an online community to exchange business events and context. Awarelet Technology brings the notion of context and structure to the members of online communities and can be used to construct powerful real-time business related collaborations.
Awarelet Technology leverages the prior art by reusing the communication infrastructure provided by the prior art. Awarelet Technology extends the prior art in order to facilitate more robust collaborations between the members of the online community by allowing complex data objects or XML based events to be exchanged, processed, and rendered within the online community.
According to the invention, a software framework provides building blocks for developing XML-based or data object based event handlers and a mechanism for dynamically deploying and managing them. The complex data to be sent/received among users and applications can be described in XML or actual Java objects. It should be understood that while the description below primarily discusses XML based events, these can always be replaced by data object based events. One skilled in the art would understand how to represent this complex data in other formats, as they become available with new languages and technologies. The software framework is composed of the following principal components:
Awarelet Base,
Awarelet Container,
Awarelet Application Adapter,
Awarelet Event,
Awarelet Configuration, and
Awarelet Repository.
This rich collaboration potential between members of an online community can be realized by developers who will use this general purpose framework to derive Awarelets from the Awarelet Base, which will ultimately be manifesting the behavior of the desired collaboration. A developer will design and implement Awarelets at build time, and then deploy and configure the Awarelets into a runtime instantiation of one of the prior art awareness engines like, AOL instant messaging, Lotus(copyright) Sametime, Microsoft(copyright) MSN Messenger, ICQ, etc. Since a framework will be in place to support the building and deployment of Awarelets, developers of new Awarelets should be able to easily build and deploy these new Awarelets.
A framework provided by this invention allows Awarelets, i.e., message/event handlers for point of presence awareness applications, to be developed. The Awarelets subscribe to specific events, e.g., Awarelet events, process and perhaps render the complex event type to the end user. The end user can also interact with the rendered event and resolve the event depending on the customized event handling designed into the Awarelet, residing in an Awarelet Container, by the Awarelet developer. Further, the Awarelets developed and added to an Awarelet Repository can be configured to be dynamically deployed to members of the online community, based on user, role or place. This allows the distribution of Awarelets to members of the community to be driven by a centralized management scheme via the Awarelet Repository and Awarelet Configuration.
In the preferred embodiment, the Awarelet Container uses the Java(trademark) InfoBus as an information bus. The InfoBus provides the ability to pass information among objects without the objects having direct communication with one another. Information is placed on or removed from the InfoBus without the accessing object necessarily knowing where the information came from. This is attractive since all objects need only know one central object rather than requiring a complex communications network.
The Awarelet Application Adapter is the base class for bi-directional mediation between the underlying communication mechanisms and the derived Awarelets. The developer derives a customized derived Awarelet Application Adapter to act as mediator for a specific collaboration infrastructure as an instantiation of the mediation means. The mediator, e.g., derived Awarelet Application Adapter, extracts events from the communication mechanism and delivers the events to derived Awarelets via the Awarelet Container. The derived Awarelets process the events in a desired manner based on the designed behavior of the derived Awarelet.

Mechanism for developing and dynamically deploying awarelets

International Business Machines Corporation


A sheet bending brake comprising a first longitudinally extending member having a clamping surface, a clamping member having a member movable toward and away from the clamping surface for holding a workpiece in position for bending and a second member extending longitudinally with respect to said first member. Each of the first and second members have substantially the entire length of the longitudinal edges thereof formed with longitudinally spaced intermeshing integral projections, the projections on the second member having a plurality of aligned openings and the projections on the first member having a plurality of aligned openings comprising slots extending axially with respect to the longitudinal axis of said member. A hinge pin extends through the openings of the second member and the slots of the first member. The second member has a workpiece contacting portion spaced from the projections. The slots have a configuration such that as the second member is moved relative to said first member to bend a workpiece, the hinge pin is guided along said slots such that the contacting portion of said second member remains substantially in the same position relative to the workpiece. A handle member for manipulating the anvil member is constructed to minimize the stresses thereon. The clamping member is constructed to maximize the strength thereof. A stabilizing assembly is associated with the legs on which the clamping brake is mounted.

In recent years, various structures have been provided to form a portable sheet bending brake for bending metal or plastic sheets such as are used in siding on homes and buildings. Typical patents comprise U.S. Pat. Nos. 3,161,223, 3,481,173, 3,482,427, 3,559,444, 3,817,075, 3,872,755 and 4,321,817.
Such brakes comprise a fixed member on which the sheet is clamped and a movable bending member for bending the sheet. A major problem with respect to such sheet bending brakes is the tendency of the bending member to move relative to the portion of the sheet being bent and thereby mar the surface of the sheet.
In U.S. Pat. No. 3,161,223, the tendency to mar the surface of the sheet material was minimized by having the intermeshing integral projection between the fixed member and bending member which extend longitudinally and define the hinge that connects the bending member with the fixed member having the clamping surface, positioned so that all portions of the projections do not extend above the plane of the surface of the members when the surfaces are substantially aligned.
U.S. Pat. Nos. 3,481,174 and 3,482,427 were directed to an arrangement which included a floatable compensator on the bending member which engages the sheet material and as the bending member is swung to bend the sheet pivots so that the contact with the sheet material is maintained.
Accordingly among the objectives of the present invention and to provide a sheet metal bending brake which is relatively light in weight, portable and less costly.
In accordance with the invention, each of the fixed and movable bending members have substantially the entire length of the longitudinal edges thereof formed with longitudinally spaced intermeshing integral projections. The projections on the bending member having a plurality of aligned openings and the projections on the fixed member have a plurality of aligned openings comprising slots extending axially with respect to the longitudinal axis of said member. A hinge pin extends through the openings of said bending member and the slots of the fixed member. The slots have a configuration such that as the bending member is moved relative to the fixed member to bend a workpiece, the hinge pin is guided along said slots such that the contacting portion of the bending member remains substantially in the same position relative to the workpiece. In accordance with the invention, a handle member for manipulating the anvil member is constructed to minimize the stresses thereon. The clamping member is constructed to maximize the strength thereof. A stabilizing assembly is associated with the legs on which the clamping brake is mounted.


A wafer container with a latch mechanism that provides sealing for large wafer containers, such as for 450 mm wafers, accomplishes secure door closing and latching with reduced torque requirements for rotating the central rotatable cam plate. In various embodiments, a camming slot formed in the rotatable cammed plate is arcuate and defined by opposing cam surfaces which are selectively engaged by a cam follower, such as a roller, attached to a proximal end of a latch arm. The roller can include unitary axle portions that snap into the proximal end of the latch arm and is supported at both axial ends of the roller. The proximal end of the latch arm can include parallel extensions separated by a gap, and have guide in surfaces to deflect the extensions as the axle portions of the roller are forced into position thereby seating the roller at both axial ends.

Processing of semi-conductor wafers into finished electronic components typically requires many processing steps where the wafers must be handled and processed. The wafers are very valuable, are extremely delicate, and are easily damaged by physical and electrical shocks. In addition, successful processing requires the utmost in cleanliness, free of particulates and other contaminants. As a result, specialized containers or carriers have been developed for use during processing, handling and transport of wafers. These containers protect the wafers from physical and electrical hazards, and are sealable to protect the wafers from contaminants. It is important that the containers remain sealed when in use to prevent damage to the wafers from contaminants. It is also important from a process efficiency standpoint that carriers be easily useable and cleanable.
Also, assembly processes should be as simple as possible and involve as few components as possible. Moreover it is desirable to eliminate or minimize any metallic components in the carriers and in particular the components of the latching mechanism.
The size of wafers being processed is increasing. Although processing of J 50 mm wafers and smaller is still implemented, there is now a significant presence of fabrication facilities that handle 300 mm wafers. The 300 mm wafer containers deal with problems unforeseen in the containers for smaller wafers. An entire new genre of wafer containers were developed for handling the 300 mm wafers, see for example: U.S. Pat. Nos. 8,276,759; RE38221; RE42402; RE40513; 7,422,107; 7,677,393; and 6,464,081, all of which are owned by the applicant and all hereby incorporated by reference herein except for express definitions and patent claims contained therein. The basic configuration is a front opening container that has a door that fits into a door frame defining the door opening. In an x-y-z coordinate system (FIG. 1), the wafers are inserted and removed in along the y coordinate, upward and downward are along the z coordinate, and left and right are along the x coordinate. The door is inserted in a y direction and has latch tips that move along the y coordinate and then the z coordinate to both latch and pull in the door toward the container portion to constrain wafers and provide sealing between the door and container portion.
Presently, 450 mm fabrication facilities are being developed and the containers for same are also proceeding with further and different performance and functionality enhancements beyond prior art containers. Such containers can have a similar configuration of the front opening door.
Wafer containers for 150 mm and 300 mm provide various configurations of door enclosures and latching mechanisms. Many or most known latching mechanisms for 300 mm wafer containers use rotary members with robotic interfaces for actuating the latch. Typically rotatable plates include cam surfaces and a link or links with a cam follower to engage the rotatable plate. The opposite ends of the links will have or be connected to latching tips that engage with the door frames in the container portions. Latching mechanisms with components that engage and rub against other components can generate particles which are inimical to wafer processing.
In containers for larger wafers, particularly 450 mm wafers, forces are required to secure the wafers in place (i.e., forces are exerted on the forward and rear wafer cushions or restraints positioned on the door and rear of the containers are required to provide greater securement forces). Moreover, substantially more gasket length is associated with the door on the 450 mm compared to the 300 mm door. The gasket has to be compressed for sealing and the greater length directly correlates with increased closure force requirements. With these greater forces, door latching becomes more difficult. In addition to securing the door in the door frame, the latching mechanism moves the door towards the interior of the container capturing and resiliently restraining the wafers between the resilient cushions on the inside surface of the door and the rearward wafer engagement and compressing the gasket. Such capturing and sealing requires deflection of the resilient wafer cushions and compression of the gasket. The doors accomplish latching typically by automated robotic means turning robotic latch keys in key holes in the latch plates.
The required increased wafer restraint forces and gasket sealing forces with bigger doors generates higher stresses on components as well as greater frictional forces between engaged rubbing components. All this causes greater torque requirements to actuate the door closings and associated greater particulation issues between rubbing or sliding components. Industry standards and/or customer requirements dictate the forces available to accomplish the rotation for latching doors. Conventionally configured latches used for 300 mm containers and smaller do not appear to be ideally suited for the use in the larger 450 mm containers due to the additional demands discussed above.
A rotatable latching member that pivots at the periphery of the door is known such as by U.S. Pat. No. 6,457,598 as well as a single internal slot connected to latch arm. Such arrangements as illustrated are not believed provide the reduced torque requirements as needed for 450 mm wafer containers.
Conventional rotatable plates have used slots with cam followers that have sliding surfaces that engage a slot in the plate to move the linkage to accomplish the required two dimensional motion of the latch tips. It is desirable in the mechanisms to have motions that are well defined and smooth operating to prevent jams or rough operations which can lead to particle generation or ineffective or inconsistent performance. Peripheral edge engagement of a cam plate by a roller cam follower in a wafer container door mechanism is known but requires a spring to maintain engagement between the roller and cam surface of the cammed plate. It is also highly desirable to have mechanisms of minimal numbers of components, easily assembled with no or minimal tools, or robotically, and that are readily cleaned.

Wafer container with latching mechanism for large diameter wafers


A product and process for producing heat-transfers having a contrasting-color 3D appearance comprising a printed layer of woven fabric substrate adhered to a colorfast textile substrate. The woven fabric substrate includes a top substrate printed with a design logo. The underlying substrate is a solid color. The design logo/is engraved away in patterned designs using a galvanometric laser to reveal the contrasting substrate in desired areas, giving a layered embroidery 3D visual effect. These heat activated appliqués of the present invention are particularly suitable for use in forming decorations for apparel, bags and home furnishings. Their soft tactile hand feel does not cause discomfort to the wearer. The resulting product has superior care and durability characteristics, is more wash fast and can be ironed, and has superior appearance characteristics to other types of heat transfer appliqués. The heat transfer capability of the appliquéallows for fast customization of finished garments.

1. Field of the Invention
The present invention relates to heat activated transfers and appliqués that are used to apply a variety of different indicia onto a variety of different substrates. The particular indicia has a contrasting two-color effect achieved by laser engraving, and can be used for decorative appliqué text, logo graphics, numbers or other indicia.
2. Description of the Background
Fashion, "basic" and performance apparel, uniform, swimwear and intimate apparel and accessory manufacturers use various methods to apply decoration and identification to stretchable garments and textiles. They tend to use silk-screening, screen-printing, sonic welding, direct embroidery and heat activated transfers as their primary methods for decorating and identification.
Silk-screening of logos or emblems is commonly used, but this process does not result in a product that withstands repeated stretching, and is complex and time-consuming. In addition, the designs created by silk-screening are flat, lack texture, and do not withstand repeated stretching or industrial or home washings. Consequently, many companies prefer embroidery as their primary method for applying decoration and identification.
Sonic welding is another method used to apply decoration and identification to garments and textiles. This process requires the creation of unique, expensive special dies for any design to be applied. The quick-change requirements associated with the performance apparel industry make this process slow and relatively expensive. Sonic welding allows texturing, but also requires chemical compounds that some companies find unacceptable, and that can result in a product that does not stand stretching or repeated home and industrial laundering. Indeed, this process typically is not used by the uniform industry for these reasons. Embroidery has instead become the primary method for applying decoration and identification.
Embroidery is typically performed by a machine that applies stitching of various colors and styles to fabric to create a design. Embroidered designs have a much greater aesthetic value, and stands repeated home and industrial launderings. Yet this too is a complex, time-consuming process.
There have been a few attempts at providing a textile appliqué with a three dimensional appearance without utilizing embroidery. U.S. Pat. No. 5,009,943 to Stahl discloses a method for producing a multi-colored emblem that may be ironed-on to garments to provide an embroidered appearance. This method entails laminating a material blank, cutting the laminated material to a specific design, embroidering about the periphery of the cut design, laminating the assembly onto a second material blank, and coating the underside with a thermal adhesive layer. The emblem can then be heat-sealed to a garment. Despite the ability to give a realistic embroidered look, emblems produced using Stahls' method are relatively large, bulky and inflexible.
There are other transfer emblems that may be applied to various cloth surfaces without embroidery. For example, U.S. Pat. No. 5,635,001 to Mahn, Jr. issued Jun. 3, 1997 shows cloth transfers that include a cloth layer coated with a plastic layer which is, in turn, coated with a pressure sensitive adhesive layer.
U.S. Pat. No. 5,914,176 to Myers issued Jun. 22, 1999 shows a composite design for attachment to another fabric article, comprising an underlying layer of twill fabric on one side of which an design is printed and heat cured. The twill is cut into a desired shape so that the twill and the ink portion form the composite design. Methods of making and attaching the composite design are disclosed.
It is known to deboss such appliqués to provide surface characteristics. These surface characteristics can increase the embroidery-likeness by simulating stitching, fabric weave, etc. PCT (International) Application No. WO9508419 by Mahn, John (Specialty Adhesives) published Mar. 30, 1995 shows a heat activated applique (11) for providing in particular numbers and letters for sports jerseys including an upper colored thermoplastic elastomer layer (14) bonded to a cloth substrate (15) by a thermoplastic adhesive (12). The thermoplastic elastomer layer (14) is debossed to provide surface characteristics. However, this kind of debossing does not alter color characteristics.
U.S. Pat. No. 6,007,929 to Robertson et al. issued Dec. 28, 1999 shows selective laser ablasion of an article that has been painted with two contrasting coats of paint, a topcoat and a basecoat. The topcoat, while still wet, can be ablated by the beam of a laser while the basecoat, while wet, dry or tacky, is refractory to the beam of the laser. The laser, thus, can generate alphanumeric and graphic characters (product identification indicia) on the workpiece by ablating the topcoat to reveal the basecoat to generate the characters by dint of the visible contrast between the two coats of paint. Robertson is focused on a base coat and a top coat of paint that are sequentially processed, and then laser ablation to remove the top coat and reveals the bottom coat of paint.
Laser etching produces a pattern or design on a material by eating into the material's surface. Laser etching is the practice of using lasers to engrave or mark an object to cut figures, letters, or designs. It would be desirable to use a laser-engraving concept that attaches a pre-printed textile surface layer to a substrate layer, followed by laser-engraving of the surface layer exposing the underlying substrate layer to produce a three-dimensional effect on a textile appliqué.

Appliqué, having dual color effect by laser engraving


A power supply voltage drop detection circuit has first and second N-channel field-effect-transistors. The drain of the first N-channel FET is connected to a power supply voltage line and its gate to ground. The drain of the second N-channel FET connected to the source of the first N-channel FET and its source is connected to the ground. A control voltage to the gate of the second N-channel FET maintains the second N-channel FET conducting. A P-channel field-effect-transistor has its source connected to the power supply voltage line and its gate connected to a connection node between the first and second N-channel field-effect-transistors. A third N-channel FET has its drain connected to the drain of the P-channel FET and its source connected to the ground. The gate of the third N-channel FET receives a controlled gate voltage which maintains the third N-channel FET conducting. An inverter has its input connected to a node between the P-channel FET and the third N-channel FET. The inverter output generates a signal indicative of the power supply voltage drop.

1. Field of the Invention
The present invention relates to a circuit for detecting a drop of a power supply voltage, and more specifically to such a detecting circuit which is mainly composed of insulated-gate field-effect-transistors (called "IGFETs" in the specification) and which is used for an electrically erasable programmable memory (called "EEPROM" in the specification).
2. Description of Related Art
Since EEPROMs are electrically erasable and electrically programmable, the EEPROMs can be set to various modes shown in the following table by applying a high level signal or a low level signal to external input terminals labelled for example CE, WE and OE under a condition in which the EEPROMs is assembled in an actual apparatus or system.
TABLE 1 ______________________________________ TERMINAL MODE ##STR1## ##STR2## ##STR3## ##STR4## ______________________________________ READ L H L DATA OUTPUT WRITE L L H DATA INPUT STANDBY H X X HIGH IMPEDANCE WRITE INHIBIT X X H -- X H X ______________________________________
where "H" indicates a high level, "L" indicates a low level, and "X" indicates a high level or a low level.
Therefore, if a power supply is shut down or a power supply voltage drops down below a tolerable level due to a trouble of a system incorporating the EEPROM therein, a memory cell in the EEPROM is erroneously written or erased. In the above table, for example, when the EEPROM is in the standby mode in which the CE and OE terminals are at a high level and, the WE terminal is at a low level, if the power supply voltage drops, a voltage applied to the CE terminal is brought from the high level to a low level and a voltage applied to the OE terminal is also brought from the high level to a low level. At this time, assuming that a capacitive load of the OE terminal is ten times a capacitive load of the CE terminal, a voltage drop of the CE terminal is faster than that of the OE terminal. As a result, the EEPROM is instantly put in the write mode, and therefore, data appearing on the input/output (I/O) terminal of the EEPROM (in this case, the data is indefinite since the I/O terminal is in the high impedance condition) is erroneously written to a memory cell of a certain address of the EEPROM.
Therefore, in order to avoid the above mentioned erroneous writing caused due to the power supply voltage drop, the EEPROM has generally incorporated therein a circuit for detecting the power supply voltage drop, and has been designed to inhibit the writing when a power supply voltage drop is detected by the power supply voltage drop detection circuit.
Specifically, the power supply voltage drop detection circuit is to detect whether or not a power supply voltage Vcc drops not greater than a predetermined detection level Vcc(INV). For example, the power supply voltage drop detection circuit outputs a high level signal when Vcc>Vcc(INV), and a low level signal when Vcc.ltoreq.Vcc(INV). The detection level Vcc(INV) is previously determined to be smaller than a tolerable level of the power supply voltage, in order to ensure that the EEPROM is never put in the write inhibit status under an ordinary use condition. In addition, the detection level Vcc(INV) is desired to be as stable as possible independently of a temperature of environment of the EEPROM and variation of device parameters caused at the stage of manufacturing. If the detection level Vcc(INV) becomes higher than the tolerable level, the EEPROM can no longer be written under the ordinary use condition. On the other hand, if the detection level Vcc(INV) is too low, the power supply voltage drop detection circuit may not accurately detect a power supply voltage drop, so that an erroneous writing would often occur due to the power supply voltage drop.
One typical conventional power supply voltage drop detection circuit has included a voltage divider circuit composed of three N-channel IGFETs series-connected between a power supply voltage line and ground, each of the N-channel IGFETs being connected in the form of an active load. A connection node between the N-channel IGFET having a source connected to the ground and another N-channel IGFET having a source connected to a drain of the source grounded N-channel IGFET is connected to a first inverter, which is cascaded to a second inverter.
With this arrangement, assuming that the three N-channel IGFETs have the same threshold Vth, if Vcc>3 Vth, the voltage on the connection node concerned is higher than Vth, and therefore, the second inverter outputs a high level signal. On the other hand, if Vcc.ltoreq.3 Vth, the voltage on the connection node drops, and therefore, the second inverter outputs a low level signal. Therefore, in the power supply voltage drop detection circuit mentioned above, it can be said that the detection level Vcc(INV).congruent.3 Vth. In addition, as mentioned hereinbefore, it is desired that even if the temperature changes, Vcc(INV) (namely, 3 Vth) is as stable as possible. However, in fact, the threshold Vth has an apparently perceivable temperature dependency, and therefore, the temperature dependency of the detection level Vcc(INV).congruent.3 Vth is three times that of a single N-channel IGFET. As a result, in some example, Vcc(INV) is 3.42 V at 25.degree. C. and 2.85 V at 100.degree. C. Namely, Vcc(INV) will change by 0.57 V with a temperature variation of 75.degree. C.
As mentioned above, the conventional power supply voltage drop detection circuit is such that the detection level Vcc(INV) is set three times the threshold Vth of each N-channel IGFET. Therefore, if the threshold Vth of each N-channel IGFET changes from the rated value of 25.degree. C. by .DELTA.Vth because of a temperature variation, the detection level Vcc(INV) greatly changes by 3.DELTA.Vth. In other words, if the temperature lowers, the detection level Vcc(INV) increases, and therefore approaches a tolerable level of the power supply voltage (for example, 4.5 V or 5.5 V). On the other hand, if the temperature elevates, the detection level Vcc(INV) decreases, and therefore, the power supply voltage drop detection circuit is brought into a condition of not accurately detecting a power supply voltage drop.
Therefore, the conventional power supply voltage drop detection circuit has to have been designed to determine the detection level Vcc(INV) taking the temperature dependency of Vth into consideration, in order to ensure that the detection level Vcc(INV) at a low temperature exceeds the tolerable level of the power supply voltage. This has made it difficult to design the power supply voltage drop detection circuit. On the other hand, since the detection level Vcc(INV) becomes too low at an elevated temperature, it is not possible to prevent a malfunction of the EEPROM caused due to the power supply voltage drop, over a wide range of temperature. As a result, the range of use temperature of the system has to have been limited.

Power supply voltage drop detection circuit for use in EEPROM memory


An extended reach inspection apparatus may include a scanner device and a robotic manipulator arm. The robotic manipulator arm may include a plurality of arm segments including a distal end arm segment and a proximal end arm segment. A movable joint may couple the distal end arm segment to the robotic manipulator arm. A telescoping extension mechanism may be coupled to the distal end arm segment. The scanner device is mounted to the telescoping extension mechanism for moving the scanner device between a retracted position proximate the robotic manipulator arm and an extended position at a distance from the robotic manipulator arm. A control handle may be coupled to the proximal end arm segment of the plurality of arm segments for manipulating the robotic manipulator arm.

Increases in the complexity of aerospace structures have made NDI/NDE, which terms are used interchangeably herein, more and more difficult to apply successfully and cost-effectively. Often, a region of a particular structure requires inspection, but is inaccessible for the application of conventional NDE methods. In some cases, inspection requirements of regions with limited access have prompted part removal to improve access, or expensive redesigns altogether. Conventional tools include extenders and manipulation arms to reach into limited access areas and to aid probe placement on or near limited access areas of aircraft. Such areas may be cavities or obstructed areas, and include, for example, the interior of aircraft wings.
When in operation, certain sensors for detection of defects in a surface are preferably seated on the surface, or at least require maintaining no more than a maximum clearance from the surface. When a sensor, for example an eddy current sensor, is not completely seated on the surface, which may be referred to as "lift-off," the result may be a reduced sensitivity to small cracks.
A sensor may be applied to a surface that is not completely flat and require movement of the probe along the surface, or may be mounted to a rotating end of a probe for NDE in limited access areas. Either case may result in lift-off. For the rotating application, if the probe end is not exactly perpendicular to the surface to be inspected, the rotating path of the sensor will be eccentric; although the sensor may be flush with the surface at one point along the path, at an opposite point on the path (or some other location) there will be lift-off. Accordingly, an apparatus is needed that addresses lift-off to provide adequate sensitivity for detection of defects over the full range of motion of the sensor.


The present disclosure relates to pressure sensors. In one illustrative embodiment, the pressure sensor may include a pressure sensor assembly having pressure ports on opposite sides of the pressure sensor assembly. The pressure sensor may include a protective housing including a first housing member and a second housing member defining a cavity for securely housing the pressure sensor assembly. The protective housing may include a first port coupled to one of the pressure ports of the pressure sensor assembly and a second port coupled to the other pressure port of the pressure sensor assembly. In some cases, the protective housing may include one or more aligning features, one or more positioning features, and a boss, which can include two or more bumps, on each side of the cavity around the pressure ports.

Pressure sensors are utilized in a wide variety of applications, including, for example, commercial, automotive, aerospace, industrial, and medical applications, to sense and/or monitor a pressure. In many applications, the operational environments in which pressure sensors are required to operate with high accuracy and repeatability can be very demanding. There is a need for new and improved pressure sensors and/or pressure sensor enclosures for operating in various environments and in various applications.

This patent is subject to a terminal disclaimer.