A humidifier for a fuel cell includes a connection hose part connected to an air inlet of a fuel cell stack. A humidifier port part is coupled to an inner peripheral surface of the connection hose part and connects the connection hose part to an air outlet of a humidifier housing. A condensate collection part is coupled to an upper portion of the humidifier port part so that a condensate collection space is defined between an outer peripheral surface of the condensate collection part and the inner peripheral surface of the connection hose part.

In general, it is necessary to humidify a polymer electrolyte membrane in a fuel cell stack when operating the fuel cell stack. Accordingly, separate membrane humidifiers have been used for exchanging moisture between exhaust gas as wet gas discharged from fuel cell stacks and dry gas supplied from outside air.
Such humidifiers can be classified into bubbler type humidifiers, injection type humidifiers, and adsorbent type humidifiers. However, since fuel cell vehicles have limited packaging spaces, membrane humidifiers, which have relatively small volumes and do not need special power, are generally used. In particular, hollow fiber membrane humidifiers have been used as membrane humidifiers for fuel cells.
Here, a humidifier is typically located at a lower end of a fuel cell stack, in which the humidifier is clamped and connected to the fuel cell stack using a rubber hose or the like.
When air is humidified by the humidifier and supplied to the fuel cell stack, vapor is condensed due to a temperature difference between the humidified air and outside air. In this case, the condensed vapor flows down along a wall surface of the rubber hose, and is accumulated in the humidifier located at the lower end of the fuel cell stack.
Accordingly, when the condensed water is temporarily supplied to the fuel cell stack, the channel passage in the fuel cell stack may be clogged. In addition, if the condensed water freezes during the winter season, the humidification membrane in the humidifier may be damaged due to the volume expansion of water.
The above information disclosed in this Background section is only for enhancement of understanding of the background of the invention, and therefore, it may contain information that does not form the prior art that is already known in this country to a person of ordinary skill in the art.


In an ink jet printing apparatus prints an image by employing a print head capable of ejecting ink from ejection ports, a suction unit draws ink from the ejection ports into an interior of the cap by applying a suction force to the interior of a cap that is covering the ejection ports. An atmosphere communication unit exposes to the atmosphere the interior of the cap that is covering the ejection ports, and a pressure increase unit increases a pressure in an internal of the print head. A control unit permits the suction unit to apply the suction force to the interior of the cap, and permits the pressure increase unit to increase the pressure in the internal of the print head before the atmosphere communication unit exposes the interior of the cap to the atmosphere in a state where the ejection ports is covered with the cap.

1. Field of the Invention
The present invention relates to an ink jet printing apparatus that performs a suction-based recovery operation for an ink ejection print head, and a print head recovery device and a print head recovery method that are employed to perform the suction-based recovery operation.
2. Description of the Related Art
For an ink jet printing apparatus that prints an image by employing a print head wherein ink can be ejected from ejection ports formed at nozzle tips, a suction-based recovery operation is well known as a recovery operation for maintaining an appropriate ink ejection state for the print head. The suction-based recovery operation is an operation wherein, while the ejection ports of the print head are covered with a cap (a capping state), a negative pressure is generated by a pump and is introduced into the cap to move, by suction, ink that does not contribute to the printing of an image from the ejection ports into the cap. When the suction-based operation is performed, bubbles generated in the nozzles, and viscous ink and foreign substances, such as dust, in the nozzles can be discharged to maintain an appropriate ink ejection state.
According to a printing apparatus described in Japanese Patent Laid-Open No. 2007-118508, after a suction-based recovery operation has been performed, and while the capping state of a print head is being maintained, a suction pump is halted to relax the pressure in the print head and in the cap, and thereafter, an atmosphere communication valve, for connecting the interior of the cap with the atmosphere, is opened. Sequentially, then, in the state wherein the atmosphere communication valve has been opened, the suction pump is restarted to introduce external air into the cap via the atmosphere communication valve, and this air stream is employed to clean an ejection port face of the print head, where the ejection ports are formed at the nozzle tips.
However, in the printing apparatus described in Japanese Patent Laid-Open No. 2007-118508, during a period following the suction-based recovery operation and lasting until the atmosphere communication valve has been opened, the suction pump is merely halted to relax the pressure in the print head and the pressure in the cap. Therefore, when the pressure in the two components is relaxed, the pressure in the cap will be slightly lower than the atmosphere, and in this state, the pressure in the print head and the pressure in the cap are evenly balanced, so that ink will not be discharged from the ejection ports into the cap. However, when in this state the atmosphere communication valve is opened, the pressure in the cap rises, and balance is lost between the pressure in the print head and the pressure in the cap. Thus, there is a possibility that air, introduced through the atmosphere communication valve, and foreign substances in the cap, such as dust and viscous ink, will enter the print head through the ejection ports.

Ink jet printing apparatus, print head recovery device and print head recovery method


Apparatus and process for applying a flowable substance to a substrate. A perforated cylinder feeds the flowable substance to the substrate with a counter-pressure roll adjacent. A lift-off roll assists in drawing the substrate off the cylinder in response to the degree of adhesion between substrate and cylinder. The distance between the axes of rotation of the counter-pressure roll and cylinder is less than the sum of radii of the roll and cylinder.

The invention relates to a process for the application of liquid, pasty or plastic substances, in particular of thermoplastics, to a substrate, the substance being melted, heated and applied to the substrate through a perforated cylinder, it adhering to the said substrate over a certain distance before it is drawn off, as well as an apparatus for this.
German Offenlegungsschrift 3,638,307 discloses such a process and such an apparatus, the nozzle mouth being followed inside the metal cylinder by an air nozzle, which forms a nozzle gap bounded by lips towards the metal cylinder. Furthermore, outside the metal cylinder there are arranged cooling and heating sections, before the substrate runs through a pair of calendar rolls. In this case it has been found in practice that, at different temperatures of the coating substance, a different tension has to be exerted on the substrate in order to lift the substrate off the perforated metal cylinder.
The object of the present invention is to improve substantially the temperature control for the coating substance and, furthermore, also to ensure an improvement in the application of the coating substance as well as in the handling of the coating head when the apparatus is switched off.

Process and apparatus for applying a flowable substance to a substrate


A mattress frame that occupies a small volume and can be used by a recipient without having to assemble the frame. The frame has four connected sides and is made of foam. The frame is rectangular in shape and has two longer sides and two shorter sides. The two shorter sides are folded in a U shape so that a bow-tie-shaped frame results. The bow-tie-shaped frame is rolled and packaged in a container. The frame can be rolled to form a spiral or an M-shape. A recipient of the rolled frame removes the frame from its packaging and the frame expands to its intended shape.

New types and forms of mattresses and mattress accessories continue to be developed for traditional bedroom use, as well as for such diverse uses as camping, boating and recreational vehicle traveling. For example, some mattresses provide support against weight using springs, some mattresses are filled with air, some mattresses are filled with water, whereas some mattresses are made of memory foam or have a layer of memory foam to provide support against weight.
When weight is applied against an edge of a mattress, the mattress deforms and does not provide support. Mattress deformation is particularly a problem for air mattresses. Rigid frames that surround the mattress are used to provide support at the edges of a mattress and provide support against weight placed at the edge of a mattress.
FIG. 1 (prior art) is a perspective view of a prior art frame structure used to support edges of a mattress. The frame attachment structure includes first side 10, second side 12, third side 14 and fourth side 16. First side 10 and third side 14 are substantially the same in size and second side 12 and fourth side 16 are substantially the same in size. The first side 10, second side 12, third side 14 and fourth side 16 are made of a foam material. A cloth 20 or other material such as plastic is affixed to each of first side 10, second side 12, third side 14 and fourth side 16 so that each side stays in place relative to other sides. The first side 10, second side 12, third side 14 and fourth side 16 provide a frame for a mattress. For example, the mattress would be placed underneath cloth 20 so that if no other cover is used, a person would contact cloth 20 when sitting on the mattress.
To package the frame structure of FIG. 1 for shipping, the sides are folded inward but maintain a connection with cloth 20. The resulting structure has both length and width larger than a size of the mattress it is to surround, which can consume too much space during transportation.
One drawback with this frame structure of FIG. 1 is that the frame is bulky and takes up more space than desired during transportation. It is desirable to minimize the size of goods during transportation in order to reduce costs and increase the amount of goods that can be transported. In addition, the process of mounting the sides to cloth 20 can be complicated, and gaps are present in the frame so that the evenness of support of edges of a mattress may not be acceptable to a user.
FIG. 2 (prior art) is a perspective view of another prior art frame structure. The frame structure includes first side 10, second side 12, third side 14 and fourth side 16. In this structure, however, four replicas of corner 24 are used so that sides are set in place. Each corner 24 has two inlets and each inlet receives a side so that sides are formed ninety (90) degrees from each other. The mattress is placed inside the boundaries of the sides.
To package the frame structure of FIG. 2 for transporting, the sides are disconnected from each corner 24 and the sides are placed together and separate from the corners. The resulting structure that is to be shipped has a length larger than a size of the mattress it is to surround, which can consume too much space during transportation.
One drawback with the frame structure of FIG. 2 is that it consumes too much space during transportation. In addition, the user of the frame has to construct the frame, which may dissuade customers from purchasing the frame. In addition, the frame does not provide uniform support to edges of a mattress because there are different widths of material used to surround a mattress.


An aircraft galley system is configured with a GAIN to GAIN network that allows for data exchange and communication between each GAIN on the system. By omitting reliance on a galley network controller for acquisition of GAIN data, the present system is simpler, lighter, and more cost-effective. Each GAIN may be polled for data by any other GAIN, such as via a data port, dedicated bus, or wireless connection. The data acquisition between the GAIN and a data collection and display device may be wired in network, wired out of network, or through a wireless link such as a Wi-Fi network.

The present invention relates generally to the field of aircraft data transfer, and more particularly relates to an adaptive data transfer network for managing and sharing information, and this sharing can eliminate the need for a galley network controller.
Present day commercial aircraft are traditionally configured with a food and beverage preparation area, commonly referred to as a galley. The galley can contain refrigeration units, heaters, and appliances for the preparation of food and beverages, such as ovens, beverage brewing machines, etc. In addition to the devices described above, galley equipment includes such devices as beverage dispensers, ovens, brewers, trash compactors, beverage carts, and the like. All of the galley's power consuming equipment can run off a single power source that services the network of devices.
In a typical galley power distribution system, GAlley INserts, or "GAINs," are power clients that request power in specific time intervals from a galley network controller. In the configuration of FIG. 1, the information pertaining to each GAIN has to be transmitted first to the GNC. As a result, a GNC is a necessary element of the system that contributes weight and complexity to the power system as well as costs. In addition, the system of FIG. 1 does not allow for information to be accessed directly from the individual GAINs, but rather all information must be obtained via the GNC. For example, an aircraft mechanic cannot obtain information contained in a particular GAIN installed in the galley by directly interrogating either the GAIN in question or one of the other GAINs. Rather, the aircraft mechanic must interface with the GNC to investigate what is happening with the individual GAINs. The system's inflexibility increases the amount of time that an aircraft mechanic or other personnel requires to obtain information from the individual GAINs in addition to making the system heavier and more expensive.

Gain to gain network for aircraft galley system


There is disclosed a method for preparing a honeycomb segment joined body in which a plurality of honeycomb segments are arranged in directions parallel to a first flat surface and a second flat surface of an installation reference jig to install the honeycomb segments in predetermined positions via a paste-like joining material on the installation reference jig by use of the installation reference jig having the first flat surface and the second flat surface forming a right angle therebetween, and then the joining material is dried and cured to join the plurality of honeycomb segments together. In the preparation method, in at least a part of a process of successively installing the plurality of honeycomb segments in the predetermined positions, when a new honeycomb segment is installed, at least a part of the installed honeycomb segments is pressurized and held in the predetermined positions so that the already installed honeycomb segments are not displaced.

A honeycomb structure has broadly been used as a filter for collecting dust from an exhaust gas, for example, a diesel particulate filter (DPF) for trapping and removing a particulate matter (particulates) such as soot included in the exhaust gas from a diesel engine or the like.
The honeycomb structure for use in such a purpose is exposed to the rapid temperature change of the exhaust gas or locally generated heat to easily generate a non-uniform temperature distribution in the structure, and this causes a problem that cracks are generated and the like. To solve such problems, a method has been suggested in which the honeycomb structure is constituted of a plurality of honeycomb segments, and the honeycomb segments are integrally joined together by use of a joining material constituted of an elastic material, whereby a thermal stress exerted on the honeycomb structure is relaxed (see Patent Document 1).
The honeycomb structure (a honeycomb segment joined body) constituted by joining the plurality of honeycomb segments together is usually prepared by arranging a plurality of honeycomb segments 30 in directions parallel to a first flat surface 21 and a second flat surface 22 of an installation reference jig 20 to install the segments in predetermined positions via a paste-like joining material 29 on the installation reference jig 20 by use of the jig having two flat surfaces (the first flat surface 21 and the second flat surface 22) forming a right angle therebetween as shown in FIG. 5, and then drying and curing the joining material 29. The first flat surface 21 and the second flat surface 22 are provided with pads 23 which come in contact with the honeycomb segments 30 if necessary. It is to be noted that in the example of FIG. 5, the first flat surface 21 of the installation reference jig 20 is parallel to a horizontal direction, and the second flat surface 22 is parallel to a vertical direction. However, as shown in FIG. 6, the installation reference jig is sometimes used so that each of the first flat surface 21 and the second flat surface 22 forms an angle of 45° with respect to a horizontal plane (e.g., see Patent Document 2).
FIG. 7 shows an ideal installation state after completely installing all the honeycomb segments in a case where 16 honeycomb segments 1 to 16 in total are installed in four rows along the direction parallel to the first flat surface 21 and four rows along the direction parallel to the second flat surface 22. The honeycomb segments 1 to 16 are thus arranged at equal intervals without being displaced, and the whole shape is adjusted in the ideal state. It is to be noted that the reference numerals 1 to 16 attached to the honeycomb segments in the drawing indicate an installation order. It is most general that the honeycomb segments are successively installed in a staircase pattern from the honeycomb segment 1 to be first installed to the honeycomb segment 16 to be last installed in this manner.
However, in a case where the honeycomb segments are actually installed by the above method, it is difficult to obtain the ideal installation state shown in FIG. 7, and a state is easily generated in which the honeycomb segments are displaced as shown in, for example, FIG. 8. This is because when a new honeycomb segment is installed in a predetermined position, the new honeycomb segment generates a pressurizing force with respect to the already installed honeycomb segment. That is, the joining material 29 present between the honeycomb segments finally dries and cures owing to a heating treatment or the like to firmly join the honeycomb segments together. However, during the installation of the honeycomb segments, the joining material is a paste-like material having fluidity, and the installed honeycomb segment has a floating state on the joining material 29, and is easily displaced owing to the fluidity of the joining material 29 at a time when an external force is applied.
As shown in an example of FIG. 8, the honeycomb segments 1 to 4, 6, 7 and 10 installed so as to come in contact with the pads 23 of the installation reference jig 20 are hardly displaced owing to frictional resistance to the pads 23, but the other honeycomb segments are easily displaced in a case where the new honeycomb segment is installed as described above. This displacement increases, as the number of the segments to be installed increases and the number of times when the already installed segment is pressurized by the newly installed segment increases.
For example, in FIG. 8, the honeycomb segment 13 is pressurized twice at a time when the honeycomb segment 15 is installed and a time when the honeycomb segment 16 is installed, so that considerably large displacement is easily generated. The honeycomb segment 15 is pressurized only once at a time when the honeycomb segment 16 is installed, and hence the displacement is smaller than that of the honeycomb segment 13. The honeycomb segment 11 is pressurized twice at a time when the honeycomb segment 14 is installed and a time when the honeycomb segment 16 is installed, so that the considerably large displacement is easily generated in the same manner as in the honeycomb segment 13.
Patent Document 1: JP 2000-279729 A
Patent Document 2: JP 2000-7455 A

Method of preparing honeycomb segment joined body


A battery, a thermal management device of the battery, and an unmanned aerial vehicle having the battery are provided. The thermal management device comprises a heat conducting housing having a receiving cavity and configured to divide the receiving cavity into a plurality of cell compartments for receiving cells, and a heat conducting shelf mounted within the receiving cavity and configured to be in contact with at least one of the cells to conduct heat generated by the at least one of the cells. The heat conducting shelf is thermally connected with an inner wall of the receiving cavity and configured to conduct heat in the heat conducting shelf to the heat conducting housing.

A power battery of a UAV when working may discharge at a high rate, generating a large amount of heat and leading to a significant temperature rise. In addition, the power battery of the UAV is often includes a plurality of cells connected in series and/or parallel. It is difficult for the heat inside the battery to dissipate. Further, the temperature within the battery is not uniform and the temperature at some locations can be very high, thereby further causing the battery to fade faster, shortening the life span thereof, and influencing safety performance thereof. Therefore, a thermal management device is needed to solve the problems of temperature rise and non-uniform temperature distribution in the cells.
A conventional power battery for UAV is generally made by directly stacking a plurality of cells, then cladding them using a thermal shrinkage gummed paper, and does not have a thermal management device.
At present, an automotive power battery has a thermal management device. For example, Tesla uses a liquid-cooled thermal management device, which includes a cooling pipeline arranged zigzag among the cells and uses a mixture of 50% water and 50% ethylene glycol as a cooling liquid. The cooling liquid flows within the pipeline to take away the heat generated by the battery.
A Volt car made by the General Motors also uses a similar liquid-cooled thermal management device. Metal heat sinks (with thickness of 1 mm) are arranged spaced apart between individual cells, with flow channel grooves engraved on the heat sinks. The cooling liquid may flow within the flow channel grooves and take the heat away.
A LEAF electric vehicle made by Nissan uses a passive battery thermal management device to reduce the amount of heat generated by the battery. For example, electrodes of the battery are optimized to reduce an internal impedance, a thickness of the battery is decreased (an individual cell has a thickness of 7.1 mm) to prevent the heat within the battery from accumulating.
However, a conventional power battery for UAV does not have a thermal management device. The liquid-cooled thermal management device for a conventional vehicle-mounted power battery comprises a cooling pipeline, a cooling liquid, and a management and control system, which are complex. A product cost and a maintenance cost are increased. For example, since the cooling liquid needs to be circulated, a power system needs to be equipped, increasing extra power consumption. Furthermore, the liquid-cooled thermal management device has a large weight and a large volume, increasing the power consumption and limiting an application thereof.
A conventional vehicle-mounted passive battery thermal management device has a high requirement on the battery, limiting the selection of the battery. Moreover, since a thin-body battery is used, whose electrodes have a small thickness, it leads to a poorer performance of magnification, and a higher cost of the whole thermal management device.

Battery and thermal management device thereof, and UAV having the battery


Herein described is a method and system for identifying buffer tubes in a cable by including at least one colored filling material within a transparent or translucent buffer tube.

Optical fiber cables have been a very popular medium for communications and data transmission due to their high speeds and suitability over long distances. The transmission medium of optical fiber cables consist of thin optical fibers protected from external forces and elements by precisely designed and manufactured cable structures. One common cable structure used is the loose-tube cable. The loose-tube cable contains one or more buffer tubes arranged around a central strength member. The buffer tubes loosely encase one or more optical fibers, either in bundles or ribbons, thereby providing sufficient room for the fiber(s) to move within the buffer tube in response to applied stresses. The space inside the buffer tubes between the fibers and the buffer tube is filled with a waterblocking filling material to protect the fibers from water penetration. The buffer tubes can then be wrapped with binders, tapes, or yarns to provide additional strength and protection. Finally, the cable assembly is encased within a cable jacket to provide mechanical strength and protection from the environment.
The loose-tube cable design permits easy drop-off of groups of fibers at intermediate points without interfering with other buffer tubes being routed to other locations. Since not all fibers, or groups of fibers, will always be routed to the same location or terminal application, it is necessary to be able to identify and distinguish among the various groups of fibers and among individual fibers. Because of the vast quantity of optical fibers that may be contained in an optical fiber cable, a color coding scheme is most commonly used to identify the buffer tubes and the individual optical fibers therein. This color-coding scheme generally consists of color-coding the buffer tubes and individual fibers. Usually the color-coding complies with EIA/TIA-598 color specifications.
Traditionally, individually colored buffer tubes are produced by adding and mixing a colorant in an extruder or other high pressure mixing device prior to extrusion of each individual tube. Coloring buffer tubes requires mixing the buffer tube material with a color concentrate, or colorant, in an extruder or other high temperature and high pressure mixing device prior to extrusion each time a different tube color is desired. This results in substantial delays and down times just to change the tube color. Tube colorants can also be quite expensive. These colorants typically contain a pigment, dye or other coloring concentrate carried in a base resin. The buffer tube material and the base resin for the color concentrate should be the same type of material because of material incompatibility. Since the buffer tube material generally comprises polybutylene terephthalate (PBT), polyester elastomer, nylon, fluoropolymer, acetal resin or polycarbonate, the colorants that can be used become quite expensive.
Finally, color-coding buffer tubes is not suitable for cables having a high number of buffer tubes. The buffer tubes of cables having more than twelve buffer tubes are marked by the placement of rings, bands, stripes or identification threads/tapes around or in the buffer tubes. These cables are expensive to produce, and require cutting away substantial portions of the outer jacket to locate any such marking.

In-color fiber optic cable identification method


A homogeneous catalytic reaction method and a catalyst for isomerization and hydroformylation of long-chain internal olefins are disclosed. A rhodium-ruthenium metal complex is used as a catalyst; and the ligands are tetradentate phosphine ligands. By means of the catalytic system, homogeneous internal olefin isomerization aid hydroformylation can be performed under a certain temperature and pressure to obtain aldehyde products having high normal to iso ratios. The present invention is applicable to not only long-chain internal olefins (≥C8) but also internal olefins having a carbon number less than 8.

The hydroformylation technique, also known as the "Oxo synthesis", has been one of the largest homogeneous reactions in the industrial sector since it was discovered by Often Roelen in 1938 (Chem. Abstr. 1944, 3631). Each year, various aldehydes and alcohols produced from Fe, Zn, Mn, Co, Cu, Ag, Ni, Pt, Pd, Rh, Ru and Ir based catalysts have been over 10 million tons. In these catalytic reactions, the ability to achieve high selectivity of linear products (i.e. high linear (normal) to branch (normal) ratio, or l/b) is extremely important for industrial applications. Although large-scale chemical companies and research institutes such as BASF, Dow, Shell, Eastman, LIKAT (Leibniz Institute for Catalysis) and etc. have reported and patented such catalytic reactions in a large amount, linear selectivity is still a practical problem to be solved. New theories and methods for controlling linear selectivity are crucial for hydroformylation reactions. In particular, catalysts with high linear selectivity can produce chemicals in a more environmentally friendly manner under mild conditions.
In industrial hydroformylation reactions, cobalt catalysts (e.g. HCo(CO)4) are in a dominant position until the advent of rhodium catalyst (e.g., HRh(CO)2(PPh3)3) in the 1970s. In 2004, it was estimated that approximately 75% of the hydroformylation reactions worldwide were based on a rhodium-triarylphosphine catalyst system. The efficient selectivity of linear aldehyde products is critical in hydroformylation and its related reactions. The aldehyde product is also an important intermediate in addition to chemicals such as perfumes. The further obtained aldehydes can be further hydrogenated, oxidized and animated to be converted into alcohols, carboxylic acids and amines, and used in bulk chemicals, plasticizers, detergents, surfactants, various solvents, lubricants, coatings and other optical materials, etc.
The HRh(CO)(PPh3)2 catalytic system (J. Org. Chem., 1969, 34, 327-330) invented by Pruett and Smith at Union Carbide coordinates rhodium with an excess amount of phosphine ligands, to form an active and selective hydroformylation species and successfully commercialized. The HRh(CO)(PPh3)2 catalytic system requires a large amount of phosphine ligand because the Rh-PPh3 complex is easily decomposed in the catalytic system, and triphenylphosphine (PPh3) lost from HRh(CO)(PPh3)2 will turn the complex into more active but less selective complexes: HRh(CO)2(PPh3) and HRh(CO)3. Therefore, taking 1-hexene as an example, in industrial process, it is necessary to use up to 820 times excess of PPh3 to Rh to ensure higher selectivity of linear to branched aldehyde products, wherein the selectivity is up to 17:1. In addition, the industrial reaction of propylene uses a 400 times excess of PPh3 to Rh, and the ratio of linear to branched aldehyde products is 8 to 9:1.
In the hydroformylation process, it is important to use less expensive starting materials as reactants. For example, 2-octene and 3-octene are ideal starting materials for the conversion of long-chain internal olefins to linear aldehydes. Raffinate II (a mixture of butenes and butane) or a mixture of 1-butene and 2-butenes are the starting material commonly used in industrial hydroformylation reactions. Furthermore, the hydroformylation reaction of an olefin with functional groups such as a hydroxyl group (—OH) and a carboxyl group (—COOH) is also extremely important. For example, the hydroformylation of propylene alcohol and the subsequent reduction can produce 1,4-butanediol, which is an important raw material for synthetic polymers and other derivatives. In addition, functionalized internal olefins can be used as another synthetic route for difunctionalized building blocks in polymer synthesis. For example, the product produced by the hydroformylation of methyl 3-pentenoate is a raw material in the synthesis of polyamides and polyesters. In isomerization and hydroformylation reactions, high isomerization rate combined with high selectivity to form terminal aldehyde is an ideal reaction process, which not only reduce unnecessary hydrogenation, but also reduce the probability of isomerization to other conjugated compounds.
Many hydroformylation processes still utilize PPh3 as ligands. Although the rhodium/triphenylphosphine system has been successfully implemented in factories all over the world, it limits the ratio of normal to isomeric (n/i) aldehyde products to about 10:1. In addition, the large amount of PPh3 is not only poorly selective in the hydroformylation reaction, but also difficult in separation and posttreatment. In order to tackle these problems, transition-metal-bisphosphorous chelate complexes have been reported and patented by research groups and companies throughout the world. For example 2,2,-bis((diphenylphosphino)methyl)1,1-biphenyl (Bisbi) invented by Eastman; 6,6′-[3,) 3′-di-tert-butyl-5,5′-dimethoxy-1,1′-diphenyl-2,2′-diyl)bis(oxy)]bis(dibenzo[D,F][1,3,2]diphophos) (Biphephos) by Union Carbide (Buckwald); 4,5,-bisdiphenylphosphino-9,9-dimethylxanthene (Xantphos) and bidentate Diphosphoramidite by van Leeuween; 2,2′-bis((diarylphosphino)methyl)-1,1-binaphthyl (Naphos) by Matthias Belter and etc. The structures of these bidentate phosphorus ligands are illustrated as follows:

Using the above bidentate phosphorous ligand, a 400 times excess of PPh3 can typically be reduced to only a 5 times excess of the chelated bidentate phosphorous ligand. This chelated bidentate phosphorous ligand has higher n/i (or l/b) ratio and catalytic activity in the hydroformylation reaction. For example, the n/i ratio of 1-hexene hydroformylation can be up to 70 to 120:1. Casey and van Leeuwen reported that the high selectivity with bisphosphorous ligand is due to the formation of a large bite angle (120 degree) between transition metal and ligand, i.e. The "Bite angle" theory, the structure is illustrated as follows:

Although there are many reports on the use of bidentate phosphorous ligands for hydroformylation reactions, the development of higher selectivity and activity phosphorous ligands has been a research hotspot in the field of hydroformylation. However, it is difficult to achieve high normal to iso products (n/i) ratio due to the detachment of phosphorus during the coordination process of Rh-phosphorous complex and carbon monoxide molecule. Therefore, the development of multidentate phosphorous ligand with multi-chelating and coordination abilities is of great importance.
In addition to high selectivity, high isomerization speed is also a very important factor for the hydroformylation of internal olefins. The isomerization catalyst used in the present invention: Carbonylchlorohydrido[6-(di-tert-butylphosphinomethyl)-2-(N,N-diethylaminomethyl)pyridine] ruthenium(II), also known as Milstein Catalyst, its synthesis method and route was reported by the David Milstein (J. Am. Chem. Soc., 2005, 127, 10840-10841). S. Perdriau et al. (Chem. Eur. J., 2014, 47, 15434-15442) reported the use of RuH(Cl)(PNN)(CO) catalysts for isomerization of terminal olefins to internal olefins. These are the few reports on the isomerization of olefins with RuH(Cl)(PNN)(CO) catalyst Besides, there are few literatures on isomerization and hydroformylation to prepare linear aldehydes with rhodium-ruthenium dual metals.
Taking the 2-octenes hydroformylation as example, the Xantphos type ligand reported by van Leeuwen has a normal to iso products (n/i) ratio of 9.5 (Angew. Chem. Int. Ed, 1999. 38, 336). Beller reported a normal to iso products (n/i) ratio up to 10.1 with Naphos-type ligand (Angew. Chem. Int. Ed., 2001, 40, 3408). The linear selectivity of ortho-phosphonate ligand in the octene mixture was 2.2 claimed by Börner (Angew. Chem. Int. Ed., 2001, 40, 1696). The phosphinate ligands of Union Carbide Corp. (now Dow) have a normal to iso products ratio of: n/i=19 and 17 for 2-hexene and 2-octene respectively (U.S. Pat. No. 4,769,498). All literatures and patents mention above used rhodium as single metal catalyst.
The biphenyl tetradentate phosphine ligand (Tetrabi) used in the present invention has multiple chelating modes owing to its coordination ability. The hydroformylation of internal olefins is carried out in multi-chelating coordination modes with Rh-Tetrabi complex. Phosphine ligands are less likely to decompose from the Rh-Tetrabi catalyst system, and the steric hindrance effect of phosphines inhibits the formation of the isomeric aldehyde product, so that a high normal to iso products ratio is easily obtained. Therefore, the present invention utilizes a dual rhodium-ruthenium transition dual metals and metal-biphenyl tetradentate phosphine ligand as a catalytic system to obtain an unprecedented high normal to iso products ratio in the isomerization and hydroformylation of long-chain internal olefins.

Hydroformylation method and catalyst using rhodium-ruthenium dual metal and tetradentate phosphine ligand


A carrier system for a vehicle having a pair of vacuum devices shaped and sized to mate and secure to a recreational article. Each vacuum device includes a pad shaped and sized to detachably seat with a vehicle to form a vacuum cavity. The frame is configured to detachably attach to a mounting surface, is generally arcuate, and has a front frame pivotally connected to a rear frame member to pivot between operating and storage positions.

The present disclosure relates to a system that detachably 10 installs to automotive vehicles for transporting articles without compromising, but instead maintaining the integrity of a mounting surface, and more particularly, to a carrier system that detachably installs to vehicles with a vacuum assembly for transporting articles.
Carriers or racks are commonly used with automotive vehicles to transport various recreational equipment, such as, bicycles, skis, snowboards, surfboards, and the like. Conventional carriers are mounted in one of these locations: to the roof, to the trunk, the rear window, to the truck bed, or to a trailer hitch. To withstand the large forces on the carrier and the supported articles while the vehicle is 20 moving, conventional carriers must securely attach to the vehicle. Either the carrier is permanently attached to the vehicle with fasteners, or removeably attached to the vehicle using brackets, straps, or latches. However, both methods have disadvantages.
Permanently installed carriers can be expensive to purchase and install, and typically require modifications to the vehicle. In addition, they cannot be removed. Detachable carriers are difficult and time-consuming to install and must be repeatedly installed and removed. Also, they are susceptible to damaging the vehicle during installation and use due to the plates and straps applied to the vehicle undertension which causes denting and scratching. If improperly installed, damage can occur to the vehicle and the articles being transported. Typically, conventional racks are designed for use with a specific make and model of vehicle. Therefore, consumers cannot use a single rack for multiple vehicles, at least not without adaptors or modifications. As a result, manufacturers must produce an increased number of parts, and retailers must provide an ever increasingly complex list of parts options lists to consumers, which also increases the cost.
There is a long felt need in the marketplace for a bike rack that is compatible with sports cars and other vehicles that have very limited space available for attachment. For example, convertible vehicles typically only have a small rear trunk area available for attachment. Therefore, a carrier that is easily and reliably installed and removed from a multiple vehicles including vehicles with small attachment footprints is needed that maintains the integrity of a mounting surface.
Corresponding reference numerals indicate corresponding parts throughout the several figures of the drawings.


A thermal type-infrared detection device improved in the sensitivity and the power of output signal without deterioration of strength of the diaphragm, which is provided with a silicon substrate with a concave, a diaphragm made of an insulation material substantially covering the concave of the silicon substrate, an infrared detecting section positioned on the diaphragm, and the silicon substrate is formed with a projection made of a thermal conductor for supporting the diaphragm away from the silicon substrate.

1. Field of the Invention
The present invention relates to a thermal type-infrared detection device used for non-contact measurement of temperature and prevention of crimes and disasters, a method for manufacturing such the detection device, and an array composed of such the thermal type-infrared detection.
2. Description of the Prior Art
Heretofore, an infrared detection device of thermopile type, pyroelectric type or a bolometer type has been used as the thermal type-infrared detection device as mentioned above, however, an infrared detection section is formed on a diaphragm composed so as to be thermally isolated from a semiconductor substrate for improving the sensitivity in any type of the devices.
Thus, in a case of the thermal type-infrared detection device of thermopile type as an example of the conventional thermal type-infrared detection device, the thermal type infrared detection device 101 has thermal isoplated structure formed through silicon micro-machining technique as shown in FIG. 7.
That is, the thermal type-infrared detection device 101 is provided with a silicon substrate 102 as a semiconductor substrate, a diaphragm 103 made of an insulating material, and an infrared detection section 104 positioned on the diaphragm 103. The silicon substrate 102 is formed with a concave 106 removed by etching the lower part of the diaphragm 103 with silicon etchant infiltrated through an etching aperture 105, accordingly the diaphragm 103 is thermally isolated from the silicon substrate 102 through this concave 106.
The infrared detection section 104 on the diaphragm 103 is provided with a thermopile 110 having a plurality of thermocouples 109 arranged in parallel and electrically connected in series which are composed of n-type semiconductor 107 (e.g. n-type polysilicon) and p-type semiconductor 108 (e.g. p-type polysilicon), and a heat absorption layer 112 stacked on the thermopile 110 through an insulation layer 111. The detection section 104 is so structured as to read an electric signal through lead wires 113 connected with both ends of the thermocouples 109 and made of aluminum or so, and high thermal resisting beam structure is used in order to try to improve the sensitivity of said device 101 in the example shown in the FIG. 7.
In this case, it is possible to apply the method based of surface micro-machining technique using a sacrifice layer, however in any method, the diaphragm 103 has a configuration that the lower part of a cold junction 109C of the thermocouples 109 is formed directly or through a frame-shaped layer on the silicon substrate 102.
Such the infrared detection device 101 forms an array 120 of thermal type-infrared detection device by arranging a plurality of them as shown in FIG. 8. In the thermal type infrared detection device array 120, wires 121 and a device-selection switching mechanism 122 are disposed on the great majority of the substrate area excepting the cold junctions 109C of the thermocouples 109.
However, in the conventional thermal infrared-type detection device as mentioned above, the lower part of the cold junction 109C of the thermocouples 109 is formed directly on the silicon substrate 102, or formed indirectly on the silicon substrate 102 through the frame-shaped layer. Accordingly, the lead wires 113, which are indispensable in the device 101, are distributed in the area of the cold junction 109C of the thermocouple 109 in the case of forming the diaphragm 103 directly on the silicon substrate 102 (the device-selection switching mechanism 122 is disposed in the thermal type infrared detection device array 120), thus, the lead wires 113 and the circuit zone are positioned on the outer peripheral portion of the device, and occupy the greater part of the area assigned for the device.
On the other side, although the wires 113 and the device-selection switching mechanism 122 are disposed at the lower part of the frame-shaped layer in the case of forming the diaphragm 103 on the silicon substrate 102 through the frame-shaped layer, an area out of contact with the cold junction 109C in the area of the frame-shaped layer becomes wider, therefore an area of the heat absorption layer 112, which exert influence directly on the signal of the infrared detection, becomes narrow relatively against the area assigned for the infrared detection device 101. Namely, there is a problem in that an opening rate (hereinafter referred to as xe2x80x9cfill factorxe2x80x9d) of the detection device becomes lower, consequently it may become hard to detect feeble infrared lays, and it is the subject to solve the above-mentioned problem of the conventional infrared detection device.
The present invention is made in view of the above-mentioned problem in the prior art, and it is an object to provide a thermal type-infrared detection device which is possible to enlarge the occupied area of the heat absorption layer by raising the fill factor and possible to improve the sensitivity and the output signal without lowering the strength of the diaphragm, and a production method of the device of this kind, in addition to an array of thermal type-infrared detection device.
The thermal type-infrared detection device according to this invention is characterized by comprising a semiconductor substrate having a concave, a diaphragm made of an insulating material and substantially covering the concave of the semiconductor substrate, and an infrared detecting section positioned on the diaphragm, the semiconductor substrate is provided with a projection made of a thermal conductor for supporting the diaphragm away from the semiconductor substrate. Such the configurations of the thermal type-infrared detection device serve as a means for solving the aforementioned problem of the prior art.
The thermal type-infrared detection device according to respective embodiments of this invention is characterized in that the thermal conductor is made of a silicon-polycrystalline material or a metallic material, or the device is any one of a thermopile type, a bolometer type, and a pyroelectric type.
Moreover, the production method according to this invention is characterized by comprising the steps of preparing a semiconductor substrate formed with a first insulation layer on the surface thereof, removing a part of the first insulation layer of the semiconductor substrate to form an aperture for anisotropic etching of the semiconductor substrate, stacking an etching sacrifice layer on a whole surface including the first insulation layer on the semiconductor substrate and the aperture of the first insulation layer, stacking a diaphragm and a second insulation layer on the etching sacrifice layer in order, infiltrating etchant into the etching sacrifice layer after taking a measure for making the etching sacrifice layer withstand the etchant at a position to be formed with the projection, etching and removing the etching sacrifice layer excepting the position corresponding to the projection, and removing a part of the semiconductor substrate to form the concave through anisotropic etching by infiltrating anisotropic etchant through the aperture of the first insulation layer on the semiconductor substrate at the time of producing the thermal type-infrared detection device according to this invention. Such the configurations of the production method of the infrared detection device serve as a means for solving the aforementioned problem of the prior art.
Furthermore, the array of thermal type-infrared detection device according to this invention is composed of a plurality of the thermal type-infrared detection devices according to this invention arranged with each other, and the array according to an embodiment of this invention is characterized in that projections adjacent to each other of the respective devices are formed in continuous one body.
In the thermal type-infrared detection device according to this invention, the lead wires of the cold junction area are distributed in the lower part of the infrared detection section, the cold junction area of the infrared detection section positioned on the diaphragm and the semiconductor substrate are thermally connected through the projection made of the thermal conductor in a wall or pillar-shape and disposed discontinuously, accordingly an usable area for the heat absorption layer becomes wider without harming mechanical strength of the diaphragm, and the fill factor is raised drastically, consequently heat absorption energy increases and the output signal becomes larger.
Particularly, it is possible to carry out the etching of the silicon sacrifice layer and the anisotropic etching of the semiconductor substrate at the same time with the same etchant, such as hydrazine for example, by forming the projection made of the thermal conductor in the discontinuous wall or pillar-shape with a silicon material, such as polysilicon, whereby the concave is formed below the diaphragm.
In the production method of the thermal type-infrared detection device according to this invention, the concave is formed by combining the etching for the sacrifice layer and the anisotropic etching for the silicon substrate, therefore the sticking phenomenon between diaphragm and semiconductor substrate is avoided, thereby minimizing the height of the projection thermally connecting the cold junction area and the semiconductor substrate. That is, it is possible to make thermal resistance of the thermal conductor of the projection small and make a temperature difference between cold junction and semiconductor substrate negligibly small.
In the array of thermal type-infrared detection device according to this invention, the switching mechanism for device selection is disposed in the lower part of the infrared detection section and the cold junction area positioned on the diaphragm and the semiconductor substrate are thermally connected through the projection made of the thermal conductor, whereby the diaphragm is form in the same height from the semiconductor substrate and the fill factor is drastically improved without damaging the mechanical strength of the diaphragm.
Moreover, in the array according to preferred embodiment of this invention, the projections adjacent to each other of the respective devices are formed in continuous one body, thereby reducing a useless area between devices and an occupied area of one pixel, and consequently decreasing the cost of the device array.

Thermal type-infrared detection device and method for manufacturing the same, and array of thermal type-infrared detection device


A computer-implemented method of conducting a jury selection training exercise for a user based on mock trial data. The method includes presenting juror data for an initial pool of potential jurors on a computer display and providing juror questionnaire response data. The user is allowed to strike members of the initial pool for cause using a computer input device and to make up to a predetermined permitted number of peremptory strikes of members of the initial pool. A probable jury is assembled through computer processing that includes members of the initial pool not struck for cause and not struck using a peremptory strike. A stricken jury is assembled through computer processing that includes members of the initial pool struck for cause or struck using a peremptory strike. Jury deliberation results are presented to the user, including a decision made by each juror of the probable and stricken juries.

1. Field of the Invention
This present invention relates to systems and methods, including computer systems and methods, for conducting jury research. More specifically, the present invention relates to processes for providing experiential voir dire training for trial attorneys; for generating research data and analytic tools that help prepare attorneys for more accurate decision making during the actual trial; and to computer systems and methods for simulating a jury selection exercise using real-world data.
2. Description of Related Art
Over the years, jury consultants have played an increasingly important role in developing strategies and tactics for both civil and criminal litigations. Speaking generally, jury consultants assist attorneys by identifying and applying information concerning the beliefs, attitudes and characteristics of potential jurors. Conventional services provided by jury consultants include focus groups, mock trials, opening statement consultations, community attitude surveys, graphics support, witness assessment preparation and the like. In essence, the jury consultant serves as an interface between the attorney and the jury pool, assisting the attorney by making recommendations for getting points across in a persuasive and effective manner.
Conventional methods employed by jury consultants tend to focus on strategy development, and statistical analysis that attempts to model juror types. For example, in a conventional mock trial exercise, the jury consultant attempts to construct a jury that is a random and representative sample of the overall jury pool in the relevant area (a "representative jury"). The construction of such a representative jury often begins with a telephone survey, in which a statistically significant sample of the community in which the case is to be tried is questioned, to determine its attitude patterns and demographic make-up. Depending on the specific nature of the case, the survey may focus on a variety of factors, including marital status, occupation, membership in community groups and the like, as well as other factors more specifically related to the particular case. The jury consultant then makes an effort to construct a representative jury that mirrors that community's profile.
A mock trial is then conducted before the representative jury, in which both the plaintiff's (or prosecutor's) and defendant's sides of the case are presented. Following the mock trial, the representative jury deliberates and renders a verdict. Each member of the representative jury is then polled and interviewed, to elicit his or her reactions to what was presented. The jury consultant compiles and analyzes that data from such interviews, and makes recommendations to the attorney concerning the manner in which the case may be most effectively presented. Data concerning biases and characteristics of jurors that may help or hurt the case is also analyzed.
For example, following an observation of the mock deliberations, the jury consultant may conclude that an aggressive cross-examination of a particular witness did not sit well with the jury, and in fact alienated the cross-examining attorney from its sympathies, and therefore recommend that a less aggressive approach to the cross be taken. By way of another example, the exercise outlined above may reveal that seventy percent of the representative jurors who were blue-collar workers found for the plaintiff, while eighty percent of the representative jurors who were white collar workers found for the defendant. From this data, the jury consultant may conclude that there are strong corresponding pro-plaintiff and pro-defendant biases in the subject case, and recommend to the attorney that his peremptory strikes (i.e., strikes as to which a showing of cause is not required) be used accordingly.
Over the long run, the statistical data obtained using the representative jury approach described above may prove useful, and conventional jury consultant have in fact provided valuable and necessary services to attorneys trying cases. However, even the strongest correlation between jurors' decision making and various aspects of their background, attitudes and experiences provides nothing more than probabilities, and falls short when tested against the complexity of decision making during voir dire. This drawback is even more acute when one considers that it is individuals who do not think like everyone else, and therefore do not conform to the probability data, who tend to become leaders in jury deliberations. These factors severely limit the usefulness of probability data in conducting a voir dire. In the end, no matter how much statistical data one has available, counsel are still required to rely on personal judgment, experience and so-called gut instincts when making actual jury selection determinations.
Despite these truisms, there has been very little qualitative research focused on the critical area of jury selection. Moreover, no systems or methods have been heretofore developed for effectively training an attorney to make jury selections in the specific case he will be trying, or for constructing a mock jury which mirrors the jury that will hear the case more accurately than the representative jury of the prior art. It has been suggested to conduct mock voir dires to generate the mock jury for a mock trial. See Jury Selection The Law, Art, and Science of Selecting a Jury, 2nd Ed., J. J. Gobert and W. E. Jordan (Shepard's/McGraw Hill 1990) at 130-131. However, no systematic approaches for conducting such mock voir dires, and for analyzing and utilizing the resultant data, have been heretofore developed. Moreover, such practices have been criticized as being time consuming. Id.
Also, an attorney training organization the National Institute for Trial Advocacy (NITA) has offered programs in which mock voir dires are conducted. At the NITA program, an attorney being trained conducts a mock voir dire before a trial advocacy instructor or a professional communicator, with the end product of the exercise being a a critique on the attorney's questions and presentation skills. The NITA programs, however, do not at all focus on the gathering and analysis of data from the mock voir dire process.
There is a need, therefore, for a system and method that fills these voids, and provides a trial attorney with formal voir dire training, while at the same time developing an ever more refined set of analytic and data gathering tools for improving voir dire practice.

This patent is subject to a terminal disclaimer.

Computer-implemented method for conducting a jury selection training exercise based on mock trial data


The abnormal power supply voltage detection device has a function of accurately detecting the abnormal voltage in accordance with the characteristics of the semiconductor element for each semiconductor chip. Circuit group for operating the adjustment function has a function of preventing the influence of the power supply voltage of the logic system such as control in the semiconductor product malfunctions becomes abnormal. Furthermore, it has a function of detecting the abnormal voltage of the various power supplies in the semiconductor product. It also has a function to test the abnormal voltage detection function in the normal power supply voltage range during use of semiconductor products.

The present invention relates to an abnormal power supply voltage detection device and a method for detecting the abnormal power supply voltage.
Functional safety of abnormal power supply voltage detection in semiconductor products, when the voltage of the plurality of power supplies used in a plurality of areas (functional blocks) in the semiconductor product is outside the operation guarantee voltage range, by detecting the power supply individually, functional safety measures can be performed. If the power supply voltage required for the operation of these circuits is abnormal, including circuits for functional safety applications (Safety Mechanism) in addition to normal operating circuits in semiconductor products, the operation (functions and performance) of the circuits cannot be guaranteed. Therefore, the abnormal power supply voltage in semiconductor products is indispensable and is one of the most critical requirements among functional safety applications (Safety Mechanism) to be implemented in semiconductor products.
There are disclosed techniques listed below.    [Patent Document 1] Japanese Unexamined Patent Application Publication No. 2008-151519    [Patent Document 2] Japanese Patent No. 3219019
Patent Document 1 discloses an abnormality detecting circuit for monitoring a change in the signal voltage in a range in which the operation is determined to be normal.
Patent Document 2 discloses the abnormal current detecting circuit for detecting an abnormal current by generating a reference value in the circuit by comparator circuit of the voltage, and comparing the differences.

Abnormal power supply voltage detection device and method for detecting abnormal power supply voltage


Provided are a light emitting device, a light emitting device package, and a lighting system. The light emitting device includes a substrate, a light emitting structure on the substrate, the light emitting structure comprising a first conductive type semiconductor layer, a second conductive type semiconductor layer on the first conductive type semiconductor layer, and an active layer between the first and second conductive type semiconductor layers; a first electrode on the light emitting structure; and a patterned phosphor layer on the light emitting structure, wherein the patterned phosphor layer converts light generated from the light emitting structure into light having a wavelength longer than that of the light generated from the light emitting structure, and wherein the pattern of the phosphor layer exposes the first electrode.

Embodiments relate to a light emitting device, a light emitting device package, and a lighting system.
In light emitting devices, P-N junction diodes having the properties of converting electrical energy into light energy may be formed by combining group III and V elements on the periodic table. Light emitting devices may implement various colors by controlling the composition ratio of compound semiconductors.
To form a white light emitting device package, light emitting devices of red, green and blue, which are the three primary colors of light, may be combined, or a yellow phosphor such as yttrium aluminum garnet (YAG) and terbium aluminum garnet (TAG) as a phosphor may be added to a blue light emitting device, or a (red/green/blue) three-colored phosphor as a phosphor may be added to a UV light emitting device.
A white light emitting device package including a phosphor may include a light emitting device on the bottom surface of a reflective cup of the package, and the reflective cup may be filled with an encapsulating material mixed with the phosphor. In this case, light having a first wavelength, which is emitted from the light emitting device may be mixed with light having a larger wavelength than the first wavelength, which collides with the phosphor, so as to form white light.
However, since the phosphor is mixed with encapsulating material to fill the reflective cup, it is necessary to provide the reflective cup to the package.
In addition, as the light emitting device comes closer to a phosphor layer, heat generated from the light emitting device is transferred to the phosphor layer to degrade wavelength conversion efficiency of the phosphor layer.
In addition, since phosphor particles sink during a process, concentration of phosphor may vary according to a process time.
In addition, color temperature deviation occurs according to a viewing angle.
In addition, since a yellow phosphor is applied on the outermost part of a blue LED, and light converted in the phosphor is naturally emitted, the light is emitted in all directions. At this point, light re-incident to a light emitting device is absorbed in the light emitting device to cause optical loss, thereby degrading light emitting efficiency.

Light emitting device, light emitting device package, and lighting system


A multi-layered liquid crystal display device formed by laminating liquid crystal display panels in which two sheets of polymer film substrates each having a transparent electrode on the inside are extended together with the transparent electrodes from a display area outwardly to form electrode lead-out portions wherein the electrode lead-out portions for respective liquid crystal display panels are lead-out in one identical direction, and each of the liquid crystal display panels is connected with an external driving circuit by inserting a predetermined external circuit substrate to the electrode lead-out portions.

Generally, liquid crystal display devices have been utilized in various fields, for example, in office automation equipments or measuring instruments as display devices small in size, reduced in weight and of low electric power consumption. Among these liquid crystal display devices, while those liquid crystal display devices for displaying graphs or letters have a great number of picture elements, those with relatively small number of picture elements have been made into products or studied in recent years for utilizing liquid crystals as the device for controlling the amount of transmission light such as sun visors for use in automobiles, protection spectacles for welding, protection spectacles for laser beam, helmet shields for use in autobicycles, goggles for use in skiing or autobicycles or liquid crystal shutters for use in three-dimensional television sets. Furthermore, those devices having laminated liquid crystal panels have been made into products or studied, for example, liquid crystal protection spectacles for welding, liquid crystal protection spectacles for laser beams and liquid crystal shutters for use in three-dimensional television sets particularly requiring relatively low transmittance and high contrast.
In a conventional multi-layered liquid crystal display device of this type, one end (upper end) of a substrate is extended than the other to form an electrode lead-out portion and a transparent electrodes are formed to the electrode lead-out portion. The transparent electrodes on one side are collectively disposed at the upper end of the substrate for concentrating the electrodes for applying electric fields to the liquid crystal panels and the situation is the same for the other transparent electrodes, in which two-layered liquid crystal display panels prepared by laminating liquid crystal panels are formed. In such two-layered liquid crystal display panel, a connector corresponding to the thickness of the electrode lead-out portions is fitted and electric fields from an external driving circuit are applied to the liquid crystal panels respectively.
However, the conventional multi-layered liquid crystal display panel of this kind, since a polymer film is used as the substrate and electrodes are formed to the substrate to fit the connector, the transparent electrodes on the substrate made of polymer film are poor to the friction as compared with the liquid crystal panel made of glass, there is a problem that the connection reliability is low.
The present inventor has made an earnest study on such a problem and, as a result, has found an effective countermeasure therefor based on a plurality of inventions regarding the liquid crystal display device that the applicant of the present invention has previously proposed.
One of them is a liquid crystal optical device (refer to Japanese Patent Application No. Sho 61-303207), which intends to prevent the intrusion of obstacles in the precutting step to improve the yield by PF-LCD with less number of picture elements (LCD made of polymer film, PF-Liquid Crystal display), and in which electrodes on upper and lower substrates of an identical configuration are extended in one identical direction and an external circuit substrate is inserted between them. According to this system, the electrodes are highly resistive to friction upon insertion of connectors to improve the reliability in the connection when using the electrodes on external circuit substrates, for example, copper electrodes of FPC (plated with solder, gold, nickel, etc.). The other is a liquid crystal display device (Japanese Patent Application No. Sho 62-15779), which intends to prevent the disconnection of the external circuit substrate by flexion, and in which a recess is disposed to electrode lead-out portions to constitute a connection portion with an external circuit substrate.
As another conventional embodiment, there has been a liquid crystal display device with the number of picture element of one, in which an upper transparent electrode and a lower transparent electrode are formed substantially over the entire surface of upper and lower substrates made of a pair of opposed polymer films respectively, and oriented films are formed by orientation treatment. A gap member is scattered between both of the substrates and both of the substrates are bonded by means of an annular seal member. Liquid crystal is sealed within a seal space defined with the seal member, both of the substrates, etc. and this seal range constitutes a display area. The upper substrate and the lower substrate are extended together with the upper and the lower transparent electrodes from the area to constitute upper and lower electrode lead-out portions.
An external circuit substrate is inserted between both of the electrode lead-out portions.
The external circuit substrate is extended and protruded in the direction in perpendicular to the direction of extending both of the electrode lead-out portions and an external driving circuit is electrically connected to the protrusion portion.
By the way, in such a constitution, it is desirable to reduce the thickness of the external circuit substrate.
That is, if the thickness of the external circuit substrate is reduced, the distance between the external circuit substrate and the seal material can be shortened within such a range as not causing the detachment of the seal material, thereby enabling to decrease the size of the device. In this case, the cell gap can not be made so large.
However, in such a constitution, since the thickness of the external circuit substrate is reduced and the external circuit substrate is supported only on one side, the external circuit substrate tends to be flexed at the end of the supported portion thereby possibly causing disconnection. By the way, it may be considered to reinforce the end of the support portion by disposing a coverlay film there. However, since the thickness is increased only in that portion by the disposition of the film and the thickness for the entire external circuit substrate is made uneven, heating and pressing become not uniform to bring about a problem in view of the accuracy for the hot-pressing.
By the way, the liquid crystal display panel is generally constituted with a gap from several microns to several tens microns and, accordingly, the seal member for sealing liquid crystal is formed with the same extent of thickness as that of the gap. Further, if the thickness of the upper and the lower substrates made of the polymer film is set to 0.1 mm, the thickness of the external circuit substrate including the upper external electrode and the lower external electrode, etc. is usually from about 0.1 to 0.2 mm. Accordingly, the thickness of the external circuit substrate is greater than the gap of the seal material and detachment of the seal material from the upper and the lower substrates is prevented by disposing the end of the external circuit substrate with 1 to 2 mm distance from the end of the seal material.
Such a constitution has a merit that the upper and the lower substrates of an identical shape can be used with no undesired effects on the liquid crystal portion, etc. as the constitution of electrode lead-out portions of liquid crystal display panels in which an external circuit substrate that is flexible printed substrate thicker than the gap of the seal material is bonded between two of upper and lower substrates by using heat seal connectors. However, the upper transparent electrode and the lower transparent electrode at the inside of the upper and the lower substrates of a hollow chamber between the seal member and the end of the external circuit substrate may cause short circuit due to the urging force from the outside or due to the deformation of the polymer films caused by the change in the circumstantial temperature and humidity.
For preparing a liquid crystal display device of the conventional example described above, a polymer film attached with a transparent electrode at first cut-into a work size. Then, an electrode pattern is formed, orientation agent is printed and rubbing treatment is applied. Then, cutting referred as pre-cutting is applied to the polymer film to form cutting lines for the upper substrate and cutting lines for the lower substrate. Then, a pair of polymer films formed with such upper and lower cutting lines are appended with each other and then applied with final cutting.
However, in such a conventional liquid crystal display device, since pre-cutting is applied before appending the upper and the lower electrode lead-out portions, film dusts are resulted upon cutting, which may deposit to the orientated films oriented to the upper and the lower transparent electrodes and incorporated as obstacles in the liquid crystals to worsen the performance of the product.
While on the other hand, the device as disclosed in Japanese Utility Model Application No. Sho 61-123537 is adapted such that an electroconductive film from a driving circuit is inserted between transparent electrode substrates, an electroconductive member is disposed between the film and both of the transparent electrode substrates, and the transparent electrode substrates and the driving circuit are electrically connected by way of the film.
However, in such a device, since the gap of the liquid crystal cell, that is, the gap between both of the transparent electrode substrates is several microns, the thickness of the electroconductive film to be inserted in the gap has also to be set to several microns and the actual use of such a thin electroconductive film causes a problem.
The first object of the present invention is to provide a multi-layered liquid crystal display device capable of improving the reliability upon connection with the connector in a simple structure.
The second object of the present invention is to provide a liquid crystal display device capable of preventing the disconnection in the external circuit substrate with no increase in the thickness of the substrate than usual.
The third object of the present invention is to provide means capable of preventing conduction between each of the transparent electrodes on the upper and the lower sides in the space chamber portion between the seal member and the external circuit substrate in a liquid crystal display device, in which upper and lower substrates made of polymer films are extended to constitute connection electrode portions with respect to the external circuit substrate.
The fourth object of the present invention is to provide a liquid crystal display device that can prevent the incorporation of obstacles in the display area, can be manufactured with ease and shows high reliability upon use.


A temporary or permanent shelter in kit form having extruded interlocking panels that easily clip together to create the general shape of a geodesic dome. The kits can be stored in a very small space when not assembled, and are primarily contemplated for use in emergencies and disaster relief. The sides of panels can be color-coded for fast and accurate assembly. Light-transmitting panels, reinforced panels, and entrance structures can also be used according to need. Furthermore, multiple kits can be can be transported at once by helicopter when roads are not available, they are easily and quickly constructed and disassembled, and are made from strong extruded and composite materials that do not mold or burn.

1. Field of the Invention
This invention relates to emergency and disaster relief shelters, specifically to temporary or permanent housing in the general form of a geodesic dome that can be easily transported by helicopter to an emergency or disaster relief site even when roads are not passable or available, can be easily and quickly constructed and disassembled, is made from materials that do not mold or burn, and can be stored in a very small space when not assembled.
2. Description of the Related Art
For family shelter during and after emergencies and disaster relief, the United States government currently uses trailers each costing between $50,000 and $100,000. Disadvantages of such trailers include their high cost, the large amount of storage space they require when not in use, and the fact that roads are needed to transport them to an emergency or disaster site. In contrast, the present invention is in the kit form and compactly stored when not in use. Approximately twenty-four 600-square-foot unassembled present invention geo shelter kits can be stored in the footprint of one U.S. government emergency trailer, such as an 8-foot by 32-foot travel trailer. Also, each present invention panel used to assemble one of the domes weighs approximately one-and-one-half pounds, allowing one Blackhawk helicopter to lift approximately nine present invention kits (each for the assembly of a 600-square foot present invention dome) at once for transport to a disaster site, and the cost for each present invention geodesic dome shaped shelter kit is only about twenty percent of that of a new U.S. government emergency trailer. As the present invention panels clip together, no tools are needed for assembly of the present invention temporary geo shelters. However, should a panel need to be removed for repair or replacement, a small tool may be used to pop open the clips holding it in place and release the panel in need of repair or replacement. In addition, the panels are made of composite and extruded materials that do not mold or burn, an advantage over the U.S. government trailers, and it only takes about two hours to open a present invention kit and use it to assemble a 600-square-foot shelter. Although present invention geodesic dome shaped shelters can be used as a source of temporary housing, they can also be constructed on (and anchored to) an appropriate foundation and used as permanent housing. No other temporary shelter for emergencies and disaster relief is known that functions in the same manner as the present invention, has the same structure disclosed herein, or provides all of its important advantages.


Method for detecting M. tuberculosis antigens, comprising: a) contacting a sample of a biological fluid with a solid support; b) adding an amount of a first antibody against at least one M. tuberculosis protein; c) screening for the presence of M. tuberculosis proteins in the biological fluid by adding an amount of a second antibody which binds to the first antibody, in a Miniblotter device.

Traditionally, direct diagnosis of tuberculosis relies on microbiological techniques such as microscopic examination (relatively fast but of low sensitivity) and on culture isolation which, in addition to being labor-intensive, requires an extended incubation period. Currently there exist new methods for a faster detection of mycobacteria but they are too expensive to be used in developing countries. In the field of Molecular Biology, the methods require a high-complexity laboratory as well as trained personnel. Further, detection of mycobacterial DNA does not allow for distinguishing metabolically active bacteria from dead bacteria. In addition, it is a test of limited diagnostic use not only because it is prone to contamination at a technical level, but also because its use is limited to smear-positive respiratory specimens.
Worldwide, tuberculosis is considered as a re-emerging disease that remains a serious public health problem in many high prevalence countries. According to the World Health Organization, an important part of the world population has been in contact with the tuberculous bacillus and could potentially suffer from the disease over the next years (World Health Organization, Report on the tuberculosis epidemia, Geneve, Switzerland, World Health Organization; 1996). It has been estimated that around 8 million people are infected each year, of which 3 million actually develop the disease.

Instituto Nacional de Tecnologia Agropecuaria (INTA)


Aspects of the present disclosure involve systems, methods, computer program products, and the like, for controlling a congestion window (CWND) value of a communication session of a CDN. In particular, a content server may analyze a request to determine or receive an indication of the type of content being requested. The content server may then set the initial CWND based on the type of content being requested. For example, the content server may set a relatively high CWND value for requested content that is not particularly large, such as image files or text, so that the data of the content is received at the client device quickly. For larger files or files that a have a determined smaller urgency, the initial CWND may be set at a lower value to ensure that providing the data of the content does not congest the link between the devices.

Telecommunication or other types of computer networks provide for the transmission of information across some distance through terrestrial, wireless or satellite communication networks. Such communications may involve voice, data or multimedia information, among others. Typically, such networks include several servers or other resources from which the content or network services can be supplied to a requesting end user. Once a content server of the content delivery network (CDN) is selected to provide the requested content to a client device, a communication session is established between the devices to provide the content to the client. The communication session may include the exchange of information and/or data included in packets that aid the devices in effective communication. One such information used by the devices includes a congestion window value (otherwise known as the "CWND"). In general, the CWND is a state variable that limits the amount of data that can be sent by the transmitting device at any one time. This variable is often used to address congestion on the link between the two communicating devices and increase the efficiency of the network.
Network congestion occurs when sent packets from the source (the server) exceed what the destination (the user) or an intermediate network device can handle. For example, the destination or client device may include buffers that store the incoming data or information as the destination device attempts to process the data. In some instances, such as when data is sent to the receiving device at a rate that the receiving device cannot process fast enough, the buffers may fill up at the destination device. This can lead to congestion and packet loss, retransmissions, reduced data throughput, performance degradation, and even network collapse in extreme cases. In another example, network congestion may occur as several devices attempt to communicate over the same link such that packets are lost or slow to arrive at the destination device.
In some instances, the destination device may provide an indication of the rate at which data may be received. With this information, the content server sets an initial CWND and begins providing data packets of the requested content to the client device. In response, the client device transmits acknowledgement messages back to the content server indicating that the transmitting data packets are received. Through an analysis of the acknowledgement messages, the content server may adjust the CWND, higher if all of the data packets are correctly received at the client device or lower if not all of the data packets are received (which indicates congestion on the path between the devices). In this manner, the communicating devices utilize the CWND to control the rate of transmitted data and information to the client device in response to the congestion of the communication session.
Typically, the CWND is set by the content server to an initial default value that is global to the server or to a specific route through the network. However, the default value may either cause congestion on the path or may not be an efficient transmission rate to provide the content. For example, a default initial CWND that is too high may overload or congest the path between the devices, particularly if several communication sessions are utilizing the same path. In another example, a default initial CWND may be too cautious in providing the content to the client device, resulting in slow start-up times or loading times of the content at the client device.

Systems and methods for adjusting a congestion window value of a content delivery network


A method, medium, and computer-program product are provided to isolate (sandbox) printer drivers from other systems. A print processor and printer driver are moved into a separate process. A spooler communicates with the print processor through a shim, proxy, and stub. A component activation manager (CAM) maintains a database of the printer drives installed on a computer system. A component activation interface (CAI) facilitates startup and shutdown of the sandbox process.

Current printer drivers and printing processes required to provide printing functionality can compromise a system's stability. A printer driver typically includes at least two components: a rendering driver and a print processor. GDI is a system Graphics Device Interface. A printer driver implements a Driver Device Interface (DDI), which is graphical, but not the GDI. The GDI receives requests from an application to draw graphic primitives and, in turn, passes them on to the printer driver. The printer driver then converts these primitives to a print-ready format such as PCL or Postscript.
The application uses GDI and the print driver to send graphics primitives to a file managed by the print spooler. The print processor, running in the print spooler, then retrieves the graphics primitives from the GDI or the printer driver in the application space. To produce the output for the printer, the print processor retrieves recorded primitives and drives them through the GDI and the printer driver again.
These and other current printer-driver models suffer from poor designs that can lead to the crippling of an entire system. Prior-art printer drivers can bring a system down if the driver becomes corrupt. Running with almost unrestricted privileges, current drivers are inherently insecure. Diagnosing problems stemming from faulty printer drivers is currently highly complex.
Currently, a printer driver runs with the full privileges of a print system. Thus, a poorly (or defectively) written printer driver can substantially damage both the print system and the operating system as a whole. Prior-art printer drivers can inadvertently modify the state of a print system because they share the same address space. Drivers can also modify each others' state. Further, bugs in the print system can result in the driver's state being changed. Determining a source of driver failure can be extremely difficult. Printer-system reliability and diagnostic ability are currently inadequate and there is no effective way to restrict privileges of driver code. Finally, flaws in a printer driver could be exploited to allow the system to be attacked.
The current state of the art could be improved by providing a better printer-driver system and method for implementing the same by sandboxing the printing process.

Method and system for sandboxing printer drivers


A post-W CMP cleaning solution consists of carboxylic acid and deionized water. The carboxylic acid may be selected from the group consisting of (1) monocarboxylic acids; (2) dicarboxylic acids; (3) tricarboxylic acids; (4) polycarboxylic acids; (5) hydroxycarboxylic acids; (6) salts of the above-described carboxylic acids; and (7) any combination thereof. The post-W CMP cleaning solution can work well without adding any other chemical additives such as surfactants, corrosion inhibitors, pH adjusting agents or chelating agents.

1. Field of the Invention
The embodiments herein relate generally to the field of post chemical-mechanical polishing (post-CMP) cleaning operations. More specifically, the embodiments relate to a composition of cleaning solution employed in the post-tungsten CMP (post-W CMP) cleaning process.
2. Description of the Prior Art
Modern integrated circuit manufacturing relies on chemical mechanical polishing (CMP) processes to smooth the dielectric layers that are used between conducting metal layers as electrical insulation. The CMP technique is also widely used in a damascene type process to fabricate metal interconnects such as copper or tungsten lines, and metal plugs such as tungsten plugs that serve as electrical connectors between metal layers.
The CMP processes involve holding and rotating a thin, flat substrate including semiconductor material against a wetted polishing surface under controlled chemical, abrasives, pressure and temperature conditions. As the term is used herein, "semiconductor substrate" refers to any construction comprising the semiconductor material, including, but not limited to, bulk semiconductive materials, such as a semiconductive wafer, and semiconductive material layers (either alone or in assemblies comprising other materials). The polishing surface is generally a surface of a polish pad comprising a porous polymer, such as an elastomer, for example, polyurethane. A polishing slurry contains a polishing agent, such as alumina or silica, which is used as the abrasive material. In addition, the polishing slurry may contain selected chemicals which react with various surfaces of the substrate during processing. The combination of mechanical and chemical removal of material during polishing results in superior planarization of the surface.
The CMP processes, however, may leave contamination on the surfaces of the semiconductor substrate. This contamination may be comprised of abrasive particles from the polishing slurry, which may include alumina or silica, along with reactive chemicals added to the polishing slurry. In addition, the contamination may comprise reaction products of the polishing slurry and the polished surfaces. Small debris from the polishing pad also has a tendency to adhere to the surfaces of the semiconductor substrate during polishing. The contamination may be removed prior to subsequent processing of the semiconductor substrate in order to increase device reliability and to avoid the introduction of defects that reduce the manufacturing process yield. Thus, post-CMP cleaning solutions have been developed to clean the substrate surface of CMP residuum.
Often, after the tungsten CMP polish is completed, the resulting wafer has at least two distinct surfaces to be cleaned. For example, the majority of the wafer surface may be the dielectric cap surface, such as a silicon carbide surface or a silicon oxide surface, while the remainder may be the freshly polished surface of the tungsten plug or the interconnects. Both surfaces may be contaminated with residual slurry and/or polymer to be cleaned in the subsequent post-W CMP cleaning process. It is known to use a mixture of tetramethylammonium hydroxide (TMAH) and hydrofluoric acid (HF) in the post-W CMP cleaning process. However, such cleaning solution exhibits poor cleaning efficiency on the silicon carbide (SiCx) surface. The slurry residues and/or polymer residues, which can be identified by Real-time Defect Analysis (RDA), are frequently observed on the polished silicon carbide surface even after treatment by a known TMAH/HF mixture.
Therefore, advancements may be warranted in post-W CMP cleaning solutions to effectively remove the slurry residues and/or polymer residues from the silicon carbide surface or any polished dielectric surface having surface characteristics similar to the silicon carbide surface.

Post-tungsten CMP cleaning solution and method of using the same


The present invention provides an apparatus and method for preventing damage to a system due to runaway current and provides for the reactivation of the system. The shutdown and reactivation method and apparatus includes a driving circuit which supplies an output current to a load. If a runaway current condition occurs in the system the shutdown and reactivation apparatus is activated by triggering a shutdown signal which deactivates the driving circuit such that the output current is no longer supplied to the load. The shutdown signal activates a charging circuit, which supplies a charging current to the load. A first monitoring circuit is coupled with the load, and configured to monitor an output voltage across the load when the shutdown and reactivation apparatus is in the active state. The first monitoring circuit signals the shutdown and reactivation apparatus to transition to a deactivated state when the output voltage is at least equal to a predefined voltage threshold, and further the first monitoring circuit signals the driving circuit to again begin to supply the output current to the load.

1. Technical Field
This invention pertains to a runaway current and thermal protection method and apparatus, and more particularly to a method and apparatus for reactivating a system once the cause of the runaway current and excessive heat is eliminated.
2. Background
It has long been known in the prior art to provide thermal shutdown for electronic systems and microchips to prevent the system or chip from generating an excess amount of heat which can damage the system or chip. The generation of excess heat, in one example, is caused when the output load driven by the system is short circuited to ground or low voltage potential which causes the output voltage across the load to drop to substantially zero or the low potential voltage and allow an excess of current to flow through short circuit. This excess current induces a high power dissipation in the system and causes the system to heat up. Protection mechanisms have been developed to prevent the system from continuing to supply the excessive current to the short circuit once the system has reached a predefined temperature. One technique for reactivating a system after thermal shutdown requires the entire system to be powered down and powered up again or re-enabled once the short circuit has been removed. This is time consuming and generally requires user interaction. An alternative technique powers down the system and begins to monitor the temperature of the system. Once the system has cooled below a predefined temperature, the system reactivates. However, if the short is still present, the system will quickly heat up again only to be shut off by the thermal shutdown mechanism of the system. The system will continue to transition on and off, utilizing large amounts of power and potentially damaging the system, until the short circuit is removed.
The present invention provides an apparatus and method for preventing damage to a system due to excessive heat or current and reactivating the system once the cause of the excess current and resulting heat is removed without requiring excessive amounts of power consumption or powering down the system. The apparatus and method is activated when a runaway current condition exists. In one embodiment the shutdown and reactivation apparatus includes a driving circuit which supplies an output current to a load. If the load is short circuited, the output current is greatly increased resulting in a runaway current condition causing the temperature of the system to increase due to high power dissipation. As a result of the increased temperature, the shutdown and reactivation apparatus is activated by triggering a shutdown signal which deactivates the driving circuit such that the output current is no longer supplied to the load. The shutdown signal activates a charging circuit, which supplies a charging current to the load. A first monitoring circuit is coupled with the load, and configured to monitor an output voltage across the load when the shutdown and reactivation apparatus is in the active state. When the short is removed, the charging current is applied to the load to charge a capacitive load. The first monitoring circuit signals the shutdown and reactivation apparatus to transition to a deactivated state when the output voltage across the capacitive load is at least equal to a predefined voltage threshold. The system is re-activated, the charging circuit is deactivated, and the driving circuit again begins to supply the load with the output current when the shutdown and reactivation apparatus is in the deactivated state.
In accordance with the teachings of this invention a novel method and structure is taught which provides the thermal protection of a system while further re-activating the system once the cause of the damaging effects is removed without requiring large power drains, without user interaction, and without requiring the system to be re-enabled or powered down.

Method and apparatus for providing thermal shutdown and current limiting protection