[Problem] To provide a novel optical network which can be used as an in-vehicle optical backbone network and exhibits high capacity, low delay, low power consumption, low noise and low cost. [Solution] An optical network system, wherein: a signal processing unit 13 controls a light source 11, and generates an optical signal which includes an information portion to be read by one of the gateway units 5a, and a continuous light portion to be written thereby; a network control unit 15 generates an electrical signal which designates a gate y unit 5a and pertains to whether the information incorporated into the optical signal is to be read or written; and when designated by the electrical signal, each of the gateway units 5a transfers information to and from an electronic control unit 7, and reads information included in the corresponding optical signal or writes information in the continuous light portion, on the basis of the information included in the electrical signal about whether to read or write information.

Currently, an automobile technology is entering a technological innovation era once every 100 years, and rapid digitization is underway. Until now, in-vehicle NWs (such as CAN, LIN, FlexRay, and MOST) optimized in different schemes have been developed for various functions (such as a safety system, a control system, an information system, and a body system) required for automobiles, and they were functioning independently without being connected.
Studies have been made for the automobile technology for the further future such as a connected technology for connecting all things and cars using a 5G high-speed wireless technology, an autonomous automatic driving technology accompanied with an AI technology and a sensing technology, and an infotainment technology for enjoying various types of information such as a 4 k/8 k video in a car. However, it is considered that, in order to realize such technologies, the number of electronic control units (ECUs) for controlling each part of a vehicle will increase remarkably (from about 100 at present to about 1000 in the future). In addition, a large-capacity backbone network becomes indispensable for controlling the entire vehicle by integrating multiple networks that have existed independently for each function. FIG. 1 is a conceptual diagram illustrating an in-vehicle network.
Currently, for its realization, studies are being actively made for in-vehicle backbone networks based on the Ethernet (registered trademark) technology, which is established in the field of communication and where inexpensive parts are available. However, in an electric wiring network using inexpensive UTP cables, it is difficult to obtain a high speed and a large capacity. In addition, the electric wiring network faces many problems such as an increased delay time, a power consumption, a harness weight, and an electromagnetic interference noise.
Introduction of the optical network technology based on optical fibers is expected as a solution to these various problems, and various studies are underway. By replacing electric cables with optical fibers, it is possible to easily realize a high speed and a large capacity, which is very effective in reduction of the harness weight and the electromagnetic interference noise.
However, such a method applies the conventional optical communication technology to the in-vehicle network as it is. Therefore, it is difficult to solve the power consumption and the delay time and reduce the cost.
In this regard, it is desirable to provide an in-vehicle optical backbone network having a large capacity, a low delay, a low power consumption, a low noise, and a low cost by using a new optical communication method.
A basic network configuration obtained by replacing electric cables with optical fibers is illustrated in FIG. 2 (Non-Patent Document 1). FIG. 2 is a conceptual diagram illustrating an example of an in-vehicle optical network using an electrical switch. FIG. 2(a) illustrates a star type, and FIG. 2(b) illustrates a ring type. Between a master device and an electrical switch and between a gateway device (hereinafter, referred to as "GW") and an electrical switch, data is transmitted via an optical fiber after being converted from an electrical signal to an optical signal by an optical transceiver. Although this method enables high-speed data transfer by using the optical fiber, a large number of optical transceivers are necessary. Furthermore, it is necessary to continuously transmit a dummy signal even when there is no data to transmit in order to prevent clock signals from stopping in the receiver side. Therefore, power is significantly uselessly consumed. In addition, the electrical switch performs tasks such as address recognition, buffering for collision avoidance, and route switching. However, since inexpensive switches are slow, it is difficult to solve the delay time problem.
Next, a method using on an optical splitter or an optical switch instead of the electrical switch is illustrated in FIG. 3 (Non-Patent Document 2). FIG. 3 is a conceptual diagram illustrating an example of an all-optical type in-vehicle optical network. FIG. 3(a) illustrates an example using an optical splitter, and FIG. 3(b) illustrates an example using an optical switch. In the methods based on these optical network technologies, the optical signals can be transmitted between the master and the GW as light. Therefore, it is possible to remarkably reduce delay and reduce the number of optical transceivers by half.
The method using the optical splitter in FIG. 3(a) is based on the PON technique of the access network. When data is transmitted from the master to the GW, the optical signal is divided by the optical splitter and distributed to all the GWs. In this case, signals matching the GW address are received, but all the mismatching signals are discarded. Conversely, when data is transmitted from the GW to the master, the data is transmitted in order from the GW such that the optical signals from the GW do not collide with each other. In this case, the optical signal is transmitted in the form of burst-mode optical packet instead of a continuous signal. Therefore, the receiving side of the master is necessary to have an expensive optical burst-mode receiver capable of instantly reproducing clocks.
In the method using the optical switch illustrated in FIG. 3(b), it is necessary to separately prepare an address recognizer embedded in the electrical switch. In addition, since it is also necessary to transmit the data in the form of a burst-mode optical packet, an expensive burst-mode receiver is indispensable in the receiving side, which causes a remarkable cost increase. Furthermore, since it is necessary to segment some optical signals and transmit them to the address recognizer, an optical amplifier for compensating for a large optical loss is required in the case of the ring-type network form as illustrated in the drawing.
In addition, a method using a wavelength routing technique for switching an optical path using an optical wavelength was also proposed (Non-patent Document 3). However, it is necessary to equip a large number of lasers having different wavelengths or a high-speed tunable laser, which causes a significant cost increase.

NATIONAL INSTITUTE OF INFORMATION AND COMMUNICATIONS TECHNOLOGY


The emery wheel grinding machine with adjustable drill bit chuck disclosed herein has an adjustable chuck in which is provided with a T-bushing having an outer flange formed at one end thereof. The outer flange is provided with several pairs of stop traps along its circumference, whereas the number of stop traps are determined according to the number of cutter blades to be shaved. Several stop pins are formed on the surface of the outer flange to control the turning angle of the drill bit or the cutter. The T-bushing further has a taper hole in it. When the chuck head which holds the drill bit or the cutter is inserted into the taper hole, the cutter blade can be in contact with the emery wheel with a certain tilted angle thereby allowing the cutter blades of various length and number to be effectively shaved, ground and finished.

1. Field of the Invention
The present invention relates to emery wheel grinding machine with an adjustable chuck, and more particularly, to an emery wheel grinding machine equipped with an adjustable drill bit chuck suitable for shaving the drill bit or a cutter of a two or more faced and variously lengthed blade of a hobbing cutter other than a single blade one.
2. Description of the Related Art
A conventional portable grinding machine, as it was disclosed and published by Taiwan Pat. No. 286610, 155338, is composed of a housing, a cap covered at one end thereof, a transmission gearing equipped in the housing, a emery wheel and guiding members. When it is to be used, the whole unit is set on an electric motor with the grinding machine coupled with the main shaft of the electrical drill so as to impart the rotational power of the electrical drill to the emery wheel with transmission gearing for running. At the same time, a drill bit or cutter to be shaved is affixed to the machine unit with the guiding members so as to shave and grind the drill bit or cutter blade to a desired extent.
With the grinding machine described above, the grinding or shaving effect can only reach to the very small part surrounding the central pointed drill head without reaching further to the portion of the blade edge at the recessed clearance, that greatly degrades the effect of finishing drill bit.
For an improvement, the applicator invented an innovative Portable Drill Bit Grinding Machine which was patented by Taiwan Pat. No. 547228. As shown in FIG. 1, this newly developed apparatus is essentially composed of an emery wheel 20 driven by a power source associated with a work fixture and a drill bit fixing means 30 for operation. The work fixture is cooperated with a first grinding base 40 for the purpose of affixing the blade of the drill bit in such a manner that its clearance angle is closely fitted to the tilted grinding surface 21 of the emery wheel 20. Then, the work fixture is cooperated with a second grinding base 50 for the purpose of affixing the blade of the drill bit in such a manner that its spiral angle to be closely fitted to the tilted grinding surface 21 of the emery wheel 20.
As shown in FIG. 1, the drill bit fixing means 30 comprises a work fixture fastening base 31 for setting the work fixture, and a drill bit fastening jig 32. The work fixture fastening base 31 is provided with a mounting hole that allows the work fixture to be engaged in, and a rotation limiting post with a prescribed angle provided at the circumference of the mounting hole.
The first grinding base 40 is engaged to a machine housing 10 in front of the emery wheel 20 aligned in the same center line, and is kept a distance with the emery wheel 20 equal to that between the work fixture fastening base 31 and the drill bit fastening jig 32. The first grinding base 40 is approximately configured in L shape with an arcuate sliding slot 41 formed at the base surface thereof. By fastening the arcuate sliding slot 41 with a bolt 42, the first grinding base 40 can practically keep a relevant angle with the emery wheel 20 so as to grind and shave a variety of drills such as standard drill, rugged drill, or ebonite drill having the blades of different clearance angles and recesses.
The first grinding base 40 has a vertical wall 46 on which being provided with a mounting hole 43 for engaging the work fixture therein, and two rotation limiting posts 44, 45 with a prescribed angle and distance are formed at the circumference of the mounting hole 43. The mounting hole 43 is upwardly inclined with an angle about 10˜25° in order to fit the direction of the blade of the drill bit to be shaved.
The second grinding base 50 is engaged to the machine housing 10 with a bolt 51 above the emery wheel 20 keeping a distance with the latter equal to that between the work fixture fastening base 31 and the drill bit fastening jig 32. The second grinding base 50 has a mounting hole 52 for engaging the work fixture therein and a rotation limiting post 53 with a prescribed angle standing on the circumference of the mounting hole 52.
However, the improved portable grinding machine patented by No. 547,228 described above is still having a limited use for grinding conventional drill or cutter only, it is inapplicable to a particular drill or cutter with two or more blades.
For these defects noticeable on the prior art, further improvement is seriously required. The inventor has dedicated great efforts for years to studying and improving these defects and came up with the present invention to be disclosed herein.

Emery wheel grinding machine with adjustable drill bit chuck


A method and apparatus for speed dialing in a mobile communication system are provided. In the method, a speed dial code is input and transmitted to a SIM card. A dialing number corresponding to the speed dial code is detected from the SIM card. The detected dialing number is transmitted to a User Equipment (UE) through a mechanism of Call Control by SIM.

1. Field of the Invention
The present invention relates to a method and apparatus for speed dialing in a mobile communication system. More particularly, the present invention relates to a method and apparatus for performing a speed dial function in the event of receiving an international roaming service or changing a service network by using a speed dial applet that manages speed dialing classified by countries or networks.
2. Description of the Related Art
With development of mobile communication technologies, mobile communication terminals have become greatly popular and are an important if not essential accessory to most people. One convenient feature of a mobile communication terminal is its ability to store information, especially telephone numbers of friends, acquaintances, frequented restaurants and the like. That is, a user is able to store telephone numbers in a memory of a mobile communication terminal in order to more conveniently use the mobile communication terminal by not having to remember so many important numbers. Furthermore, the mobile communication terminal may be provided with a speed dial function. With the speed dial function, the user maps a telephone number, used frequently among the stored telephone numbers, to a speed dial number or code. By having the frequently called telephone number mapped to a speed dial number, the user is able to merely input the speed dial number to place a phone call to the telephone number mapped to the speed dial number. Thus, the user can save time by not having to remember and dial the desired telephone number.
A Subscriber Identity Module (SIM) card is detachably installed in a mobile communication terminal that is based on the Global System for Mobile communications (GSM). Certain information about the user is stored in the SIM card. Therefore, if the SIM card is installed in another mobile communication terminal, for example a mobile terminal that is not owned by the user, the user can still be provided a communication service through the other mobile communication terminal by means of his own telephone number.
A SIM Application Toolkit (SAT) is used to provide an interface between the mobile communication terminal and the SIM card. More specifically, an SAT provides a mechanism for admission of applications and supports a standard SIM toolkit mechanism necessary by the application to enable an interaction with the mobile communication terminal.
FIG. 1 is a diagram illustrating an example of a conventional SIM toolkit mechanism.
Referring to FIG. 1, an SAT is used to allow a SIM card to send commands to the terminal. Through these commands, a user may provide an input and obtain a menu display or an SMS message transmission function. In actuality, a mobile communication terminal operates as a master and a SIM card operates as a slave that receives function requests from the terminal. A corresponding application is stored in the SIM card.
For example, it is assumed that a terminal can connect to a SIM card by a SIM toolkit and the SIM card has a SIM toolkit application installed.
The terminal waits for a command from the SIM card. The SIM card displays a corresponding application list to be selected by a user of the terminal. For example, the SIM card may display information about the weather, information about sports, information about bank businesses, etc. and the terminal's user selects a corresponding application.
Herein, commands operating an SAT are based on the contents specified in the 3GPP TS 11.14 standard which is the specification of the SIM Application Toolkit for the Subscriber Identity Module-Mobile Equipment (SIM-ME) interface. Commands transmitted from the SIM card to the terminal are called proactive commands and commands transmitted from the terminal to the SIM card are called envelope commands. By a combination of such commands, service providers develop their unique services, such as transmission/reception of SMS messages providing specific services and connection of calls by specific service numbers, to provide SIM applications.
As described above, in the case of a conventional SAT function, a service provider implements the SAT function for a specific service in a SIM (i.e., a built-in SAT service), and a user selects an SAT menu to receive a specific service, for example a request for weather information, traffic information and the like, by dialing or by transmitting a text message.
In the case of a conventional speed dial function set in a terminal, a speed dial must be reset in the event of a change to another terminal and only one dialing number (or application) can be registered in one speed dial number.
Also, in the event of an international roaming mode, a speed dial used in a home network cannot be used in a foreign network and must be registered again.
Also, when Global System for Mobile communications (GSM)/Universal Mobile Telecommunications System (UMTS)/Wideband Code Division Multiple Access (WCDMA) schemes are used by multi-mode terminals and various network SIM cards, if a Service Dial Number (SDN) of a specific service network is registered in a speed dial, a corresponding speed dial does not operate in the event of a change to another network.

Method and apparatus for speed dialing by mobile country code/mobile network code in mobile communication system


A semiconductor device includes a memory cell array that is divided into a plurality of memory cell mats by a plurality of sense amplifier arrays. Each of the plurality of memory cell mats includes a plurality of word lines and a test circuit for performing a test control to activate, at one time, a plurality of word lines included in each of a plurality of selected memory cell mats that are not disposed adjacent each other in the plurality of memory cell mats. The memory cell mats with the plurality of activated word lines are distributed. Therefore, the load applied to a driver circuit for driving word lines and the load applied to a power supply circuit for supplying an operation voltage to the driver circuit are reduced.

1. Field of the Invention
The present invention relates to a semiconductor device, and more particularly, to a semiconductor device capable of performing a stress test in which a plurality of word lines are activated at a time.
2. Description of Related Art
Various operation tests are performed during manufacturing stages of semiconductor devices such as a DRAM (Dynamic Random Access Memory). For example, in a wafer state, a test is performed to detect defective addresses, and after packaging, a screening test is performed to exclude chips that do not operate properly. One of such operation tests includes a stress test. The stress test mainly performed in the wafer state. In the stress test, test data are written to each memory cell, and electrical stress is given to each memory cell. Then, a determination is made as to whether the test data subsequently read have been changed or not.
In the stress test, a method for shortening a test time is known, in which the stress is given at the same time by a plurality of word lines activated at a time. For example, Japanese Patent Application Laid-Open No. 2001-143497 discloses "all word line activation test mode". The stress test can be performed in a shorter time by increasing the number of word lines activated at a time, but a driver circuit for driving the word lines and a power supply circuit for supplying an operation voltage to the driver circuit are designed for normal operation, and therefore it is difficult to activate so many word lines at a time.

Semiconductor device performing stress test


A system for providing a data storage service, comprises: a service provider site configured to provide a data storage service; and a user site coupled by a wide area network (WAN) to the service provider site, the user site comprising a local storage having a virtual storage, the virtual storage having a synchronous volume and an asynchronous volume, the local storage configured to immediately transmit to the service provider site data that is written in the synchronous volume, to transmit at a predetermined schedule to the service provider site data that is written in the asynchronous volume, and to read data from the service provider site if the data is not stored in the local storage.

The present invention relates to data storage systems, and relates more particularly to a system and method for providing a virtual volume data storage in a user site.
Managing a large data storage system is very difficult. Typically, a data storage service provider provides a storage-related service such as providing storage volumes, data backup, and the like. From a user site, if a user connects to this storage via the storage service provider""s directory, then the user must use a long distance connection to connect to this storage. This process causes more delays than if a user is connecting to a local storage.
The World Wide Web (WWW) effectively acts as a storage system in a wide area. The user may deploy a proxy server in the user site. As known to those skilled in the art, a proxy server is a server that sits between a client application (such as a web browser) and a remote server. The proxy server provides a cache of items that are available on the remote servers. The proxy server intercepts all requests that are made to the remote server so that the proxy server can determine if it can instead fulfill the request. If the proxy server is unable to fulfill the request, then the proxy server will forward the request to the remote server for processing. A proxy server can just only read cache data from the remote server or site, and it does not support a write procedure to the remote server or site. Additionally, the proxy server can not provide a service that depends on the data feature. As a result, the proxy server causes an ineffective usage of resources, and the use of a proxy server also causes more delays than the use of a local storage.
U.S. Pat. No. 5,155,835 discloses a multilevel, hierarchical, dynamically mapped data storage subsystem. This patent reference does not disclose storage systems between wide area networks (WANs) and ignores data features such as access interface type (block or file, and the like), purpose (user data or system file or backup file and the like). Thus, the subsystem disclosed in this reference is inefficient.
The Internet protocol small computer system interface (iSCSI) uses the Internet Protocol (IP) networking infrastructure to quickly transport large amounts of block storage (SCSI) data over existing local area and/or wide area networks. With the potential to support all major networking protocols, iSCSI (IP SAN) can unify network architecture across an entire enterprise, thereby reducing the overall network cost and complexity. To ensure reliability, iSCSI can use known network management tools and utilities that have been developed for IP networks. The iSCSI protocol is discussed, for example, at the website, http://www.ece.cmu.edu/xcx9cips/index.html) in the IP Storage section, http://www.ece.cmu.edu/xcx9cips/Docs/docs.html.
The working group of Internet Engineering Task Force (IETF) at http://www.ietf.org provides a network file system (NFS) version 3 (rfc1813 of IETF) and a common Internet File system (CIFS) protocol (http://www.cifs.org).
The NFS is an open operating system that allows all network users to access shared files that are stored in different types of computers. NFS provides access to shared files through an interface called Virtual File System (VFS) which runs on top of the Transmission Control Protocol/Internet Protocol (TCP/IP). With NFS, computers connected to a network can operate as clients while accessing remote files and as servers while providing remote users access to local shared files.
The CIFS protocol defines a standard for remote file access using millions of computers at a time. With CIFS, users with different platforms and computers can share files without having to install new software. CIFS runs over TCP/IP, but uses the Server Message Block (SMB) protocol found in Microsoft Windows for file and printer access. Therefore, CIFS will allow all applications (including Web browsers) to open and share files across the Internet.
The websites http://www.cnt.com and http://www.san.com describe wide area network (WAN) connections to a storage or storage area networks (SANs). The WAN connection may be an asynchronous transfer mode (ATM), synchronous optical network SONET), and the like.
The above references do not disclose methods for providing hierarchical management techniques between storage systems and host devices.
There is a need for a system and method that will overcome the above-mentioned deficiencies of conventional methods and systems. There is also a need for a system and method that will permit an access service provider to have a reliable storage system and that will permit a user to quickly access the storage system. There is also a need for a system and method that will permit an access service provider to be able to tune a local storage system based upon user statistic data and user log data.
The present invention may advantageously provide a reliable virtual local storage in a user site. The present invention may also advantageously provide a virtual local storage that permits faster access for a user. The present invention may also advantageously permit a service provider to tune up the local storage by using user statistics data and user log data that are tracked by the local storage, and the service provider may then charge the user for these tuning services.
In one embodiment, the present invention permits a service provider to provide a data storage service via a wide area network. A virtual volume storage is deployed at the user site. The virtual volume storage allows a host(s) at the user site to access the service provider storage located at the service provider site. The virtual volume storage advantageously permits the user to avoid having to access each time the wide area network coupled between the user site and the service provider site.
In one embodiment, the present invention broadly provides a system for providing a data storage service, comprising: a service provider site configured to provide a data storage service; and a user site coupled by a wide area network (WAN) to the service provider site, the user site comprising a local storage having a virtual storage, the virtual storage having a synchronous volume and an asynchronous volume, the local storage configured to immediately transmit to the service provider site data that is written in the synchronous volume, to transmit at a predetermined schedule to the service provider site data that is written in the asynchronous volume, and to read data from the service provider site if the data is not stored in the local storage.
In another embodiment, the present invention provides a method of managing data in a local storage based on the data feature. The virtual volume storage in the local storage determines if the data is static or cached, and synchronous or asynchronous. The virtual volume storage can also manage data not only by storage volume, but also by directory, file, cylinder, and/or block address.
In another embodiment, the present invention provides a method of tracing the access activities of a user in the user site. The user access activities are recorded to permit the service provider to analyze patterns in the user access activities. Based on this analysis, the service provider can tune the virtual volume storage in the user site.


A method for dicing a wafer including first and second layers is provided. A front surface of the first layer contacts a backside surface of the second layer. The method includes: forming a sealing film on the second layer; cutting the first layer from a backside surface along with a cutting line to form a notch; removing the sealing film; irradiating a laser beam on the front surface of the second layer along with the cutting line to form a reforming region in the second layer by a multi photon absorption effect; and dividing the wafer along with the cutting line from the reforming region as a starting point of dividing.

A laser dicing method for cutting an object such as a wafer into multiple chips by using a laser beam has been developed. For example, a focus of the laser beam is adjusted at an inside of the object, and the laser beam is irradiated on the object so that a reforming region is formed in the object. The reforming region is formed by a multi-photon absorption effect, and includes, for example, a crack, a melting region, or a region having a refraction index different from the object. The reforming region provides a starting point of cutting. The reforming region is formed along with a cutting line of the object such that the reforming region is disposed inside of the object by a predetermined distance from a surface of the object as an incident surface of the laser beam. The object is cut along with the reforming region so that the object is cut into multiple chips. This method is disclosed in, for example, US Patent Application Publication No. 2006-0160331.
Another method for forming multiple reforming regions is disclosed in JP-A-2002-205180. Specifically, a focus point of a laser beam is adjusted at an inside of an object. Then, the laser beam is irradiated on the object, so that the reforming region is formed at the inside of the object along with a cutting line. Further, the focus point in an incident beam direction of the laser beam is changed so that multiple reforming regions are formed along with the incident beam direction, which is perpendicular to the surface of the object. In this case, since multiple reforming regions are arranged along with the incident beam direction, the number of staring points of cutting increases. Thus, even when the object has a large thickness, the object is easily cut.
Further another method for cutting an object by using a laser beam is disclosed in US Patent Application Publication No. 2006-0011593. In this method, the object has a plate shape, and includes a substrate or the like. An expansible film is formed on one side of the object, and the laser beam is irradiated on the other side of the object so that the other side provides an incidence surface of the laser beam. A focus point of the laser beam is adjusted at an inside of the object, and then, the laser beam is irradiated on the object. Thus a reforming region is formed at the inside of the object by a multi photon absorption effect. In this case, the reforming region includes a melting process region. The reforming region provides a starting point of cutting along with a cutting line, and is disposed inside of the object by a predetermined distance from the other side of the object. Then, the expansible film is expanded so that the object is cut into multiple parts along with the starting point of cutting. In this case, the parts are separated one another. In this case, after the reforming regions are formed at the inside of the object, the expansible film is expanded. Thus, a tensile stress is applied to the reforming regions appropriately, so that the object is accurately and easily cut from the staring point of cutting with a comparatively small force.
On the other hand, a blade dicing method is used for cutting and separating a wafer by rotating a dicing blade having a diamond abrasive grain. In this case, a process time for cutting the wafer is comparatively short. Therefore, a throughput (i.e., productivity per an unit time) is high, and the blade dicing method is suitable for mass production.
However, the blade dicing method has the following difficulties.
(1) It is necessary for the blade dicing method to have a margin for a thickness of the dicing blade. Thus, the number of chips cut from the wafer is reduced by the margin. Thus, a product yield of the chips is limited.
(2) When the wafer is cut by the dicing blade, abrasive heat and cutting scrap are generated. Accordingly, it is necessary to cool and wash a cutting portion of the wafer. Specifically, cooling and washing water is introduced to the cutting portion of the wafer.
In this case, when the chip includes a construction having a movable portion, movable performance of the chip may be reduced in a case where the cutting scrap and/or the cooling water penetrates into the construction. Here, the construction having the movable portion is, for example, a sensor such as a pressure sensor, an acceleration sensor and an ultrasonic sensor having a piezo electric element or a capacitor or a micro machine, which is formed by using a MEMS (i.e., micro electro mechanical system) technique.
To protect the construction from introducing the cutting scrap and the cooling water thereinto, a protection layer is stacked on a semiconductor layer, so that a semiconductor substrate has a double-layer structure. In this case, if a clearance is formed between the protection layer and the semiconductor layer, the cutting scrap and/or the cooling water may penetrate into the clearance. Thus, the performance of the movable portion is reduced. Here, a technique for forming a multi-layer substrate is, for example, a bonding method with using a silicon series bonding member, a bonding method with a low melting point glass, a direct bonding method, and an anodic bonding method.
FIGS. 11-13 show a wafer 10 and a chip 11 according to a related art of the present disclosure. Specifically, the wafer 10 includes multiple chips 11, and each chip 11 has a construction 12 formed by a MEMS technique.
The wafer 10 has a thin disk shape, and multiple chips 11 having the same construction are formed on one side 10b of the wafer 10. The chips 11 are arranged on the wafer 10 to be a grid shape. A cutting line K is formed between the chips 11. The wafer 10 is to be cut along with the cutting line K.
The wafer 10 has a SOI structure, which is prepared by bonding together. Specifically, a silicon substrate layer 19 made of silicon single crystal, a buried oxide layer 18 (i.e., BOX layer), and a SOI layer 13 made of silicon single crystal are stacked in this order from a bottom to a top of the wafer 10. The BOX layer 18 as an insulation layer is formed on the SOI layer 13 so that the SOI structure is provided.
The wafer 10 having the SOI structure is formed such that two wafers having an oxide film on one surface thereof are bonded each other with the oxide film therebetween, and then, one of wafers is ground so as to have a predetermined thickness. The one surface of each wafer is defined as a bonding surface and is a mirror finished surface. The ground wafer provides the SOI layer 13, the other wafer provides the silicon substrate layer 19, and the oxide film provides the BOX layer 18.
Each semiconductor chip 11 in the wafer 10 includes a construction 12, an electrode pad 14, a trench 15, a cap portion 16, a seal member 17 and the like, which are formed by using a MEMS technique.
The construction 12 having a movable portion such as a sensor element and a micro machine is formed in the SOI layer 13, in which an impurity is diffused with high concentration.
The electrode pad 14 is made of a metallic film disposed on a surface of the SOI layer 13, and led from the construction 12. The metallic film is formed by a PVD (i.e., physical vapor deposition) method, a printing method or the like.
A trench 15 is formed around a part of the SOI layer 13 under the electrode pad 14 and around another part of the SOI layer 13 providing the construction 12. The trench 15 electrically separates a wiring in the SOI layer 13 and other parts of the wafer 10. This separation is defined as element separation. Thus, each part constituting the construction 12 is movably independent from each other.
The cap portion 16 made of bulk silicon such as poly crystal silicon, amorphous silicon and single crystal silicon protects and covers the construction 12. The cap portion 16 is bonded to the surface 10b of the wafer 10 with a bonding member 20 such as a silicon series bonding member and a polyimide series bonding member. Here, to improve movement of the movable portion in the construction 12, a clearance 30 is formed between the inner wall of the cap portion 16 and the construction 12.
The cap portion 16 formed in each chip 11 is integrated continuously on a whole surface of the wafer 10. Thus, only a part is exposed on the surface 10b of the wafer 10, the part not covered with the cap portion 16. Specifically, the part is disposed around the electrode pad 14.
An outer periphery 10h of the wafer 10 on the surface 10b is covered with the cap portion 16.
The cap portion 16 is stacked on the surface 10b of the wafer 10 so that the wafer 10 has double-layered structure. The wafer 10 with the cap portion 16 is separated and cut in a stacking direction (i.e., a thickness direction of the wafer 10) so that multiple chips 11 are obtained.
The seal member 17 is embedded in the trench 15, and the seal member 17 made of plastic material having insulation property is connected to the cap portion 16. The seal member 17 seals the cap portion 16.
When the wafer 10 is cut and separated into multiple chips 11 by the blade dicing method, cooling and washing water is introduced to the cutting portion of the wafer 10 for cooling and washing the cutting portion. In this case, the water and a cutting scrap of the wafer 10 and/or the cap portion 16 may penetrate into the construction 12 through the clearance 30 between the seal member 17 and the trench 15 or the cap portion 16.
When the cutting scrap and/or the water penetrate into the construction 12, performance of the construction 12 is reduced. Thus, yielding ratio and quality of the chips 11 separated from the wafer 10 are reduced.
It is considered that sealing with the seal member 17 is improved, i.e., tightened for preventing the water and the cutting scrap from penetrating into the construction 12. However, in this case, a manufacturing cost may increase.
Further, even when the sealing with the seal member 17 is improved, it is difficult to prevent the water and the cutting scrap completely from penetrating into the construction 12.
In the laser dicing method described above, it is not necessary for the wafer 10 to have a margin for a thickness of the dicing blade, and no water is used in the laser dicing method. Thus, the above difficulties of (1) and (2) are avoidable.
When the wafer are made of a single layer substrate, or when the wafer has no construction formed by the MEMS technique, the wafer is easily and accurately cut and separated by the laser dicing method.
However, it is difficult for the wafer 10 having the cap portion or a wafer having a double-layered structure to form the reforming region in the wafer 10 and the cap portion 16 preferably.
This is because optical properties among the wafer 10, the cap portion 16 and the bonding member 20 are different from one another. Specifically, refraction indexes of the wafer 10, the cap portion 16 and the bonding member 20 in relation to the laser beam L are different from one another. Accordingly, a part of the laser beam L is reflected by a boundary between the wafer 10 and the bonding member 20 or a boundary between the bonding member 20 and the cap portion 16. Thus, the reflected laser beam and the incident laser beam interfere with each other so that they are cancelled each other. The energy of the laser beam L is much attenuated at a deep place apart from the incident surface of the laser beam L. At the deep place, the energy of the laser beam L is insufficient for generating the multi-photon absorption effect, and therefore, it is difficult to form the reforming region sufficiently.
Here, the bonding member 20 bonds the cap portion 16 and the wafer 10, and may not be disposed on the cutting line K in some case. In this case, the bonding member 20 is disposed outside of the construction 12, and further disposed inside of the cap portion 16. In this case, since optical properties among air between the cap portion 16 and the wafer 10, the cap portion 16 and the wafer 10 are different, so that refraction indexes among the air, the wafer 10 and the cap portion 16 in relation to the laser beam L are different from one another. Thus, a part of the laser beam L is reflected by a boundary between the wafer 10 and the air or a boundary between the air and the cap portion 16. Therefore, it is difficult to form the reforming region in the wafer 10 and the cap portion 16 sufficiently.
Further when the wafer 10 has the double-layered structure, optical properties among layers are different, so that refraction indexes among the layers are different from each other. Thus, a part of the laser beam L is reflected by a boundary between the layers. Therefore, it is difficult to form the reforming region sufficiently.
When the reforming region is not formed sufficiently in the wafer 10, an unwanted crack may be generated in the wafer 10 in case of cutting and separating. Thus, it is difficult for the wafer 10 to cut and separate along with the cutting line K. Thus, the yielding ratio and quality of the chips 11 are reduced.
Further, it takes a long time to form the reforming region in the wafer 10 having the cap portion 16 or the wafer having the double-layered structure by using the laser dicing method. Thus, the throughput of the chips 11 with the laser dicing method is lower than that with the blade dicing method. Accordingly, the laser dicing method is not suitable for mass production.
Thus, it is required to provide a method for cutting a wafer with high throughput and low cost, the method providing to prevent foreign substance such as cutting scrap from penetrating into a chip. Further, it is required to provide a wafer or a chip with high throughput and low cost, the wafer or the chip having no foreign substance.

Chip and method for dicing wafer into chips


A heavy-duty flat wiper blade assembly has a wiper element and an extruded metallic frame. The frame has a bottom channel with a slot traversing its length in which the wiper element is maintained. The wiper element extends through the slot and outwardly from the bottom channel to make contact with a surface to be wiped. The frame has a closed upper channel that may include a fluid inlet opening for receiving wiper fluid into the channel and a fluid outlet opening for discharging the wiper fluid from the upper channel onto a surface to be wiped.

1. Technical Field
This invention relates generally to heavy-duty flat wiper blade assemblies.
2. Related Art
Heavy-duty flat wiper blade assemblies are known having a straight body mounting a rubber wiper element. In one known construction, the body is extruded from a plastic which is, in turn, reinforced by a metal stiffener to provide sufficient structural rigidity to the body, as shown in U.S. Pat. No. 3,107,384. In another known construction, the body is fabricated from a strip of steel which is bent into a generally U-shaped profile in cross-section and crimped along its length to the rubber wiper element to secure the wiper element. In this case, the flat steel body component is cut to length along with the wiper element prior to folding the flat steel over the wiper element.
Both such constructions are costly to manufacture and are limited in the features and advantages they can offer.
Heavy-duty flat wiper blade assemblies constructed according to the present invention overcome or greatly minimize the foregoing limitations of prior wiper blade assemblies.
A heavy-duty flat wiper blade assembly has a wiper element and an extruded metallic frame. The frame has a bottom channel with a slot and an upper channel separate from the bottom channel. The wiper element is disposed in the bottom channel and extends through the slot to make contact with a surface to be wiped. The upper channel is closed and may optionally be provided with a fluid inlet opening for receiving wiper fluid into the channel and a fluid outlet opening for discharging the wiper fluid from the upper channel and onto a surface to be wiped.
Additionally, a method for manufacturing a wiper blade is provided wherein a wiper element is slidably inserted into a bottom channel of an extruded metallic frame. The wiper element depends from the bottom channel and through a slot in the bottom channel to make wiping contact with a surface to be wiped. A wall of the bottom channel is then staked to fix the wiper element within the bottom channel. An optional method eliminates the staking step and installs a pair of end plugs into each end of the frame to releasably maintain the wiper element within the bottom channel.
Some advantages of the invention include providing for increased efficiencies in the manufacture and assembly of a heavy-duty wiper blade assembly by reducing the number of operations required to produce the wiper blade assembly, by reducing the scrap, by improving the handling of the wiper blade components during assembly and by reducing the time required for assembly, thus reducing the total costs of producing the wiper blade assembly.
Another advantage of the invention is the ability to utilize the closed upper channel as a passage for conveying wiper fluid from which the fluid may be dispensed directly on the surface to be wiped.
Another advantage of the invention is a reduction in the amount of material used in the wiper element.


Two-layer lighting control network systems and methods are disclosed. Embodiments include client lighting devices having a first type of radio for receiving wireless control signals, a lighting controller including a second type of radio, and a hub lighting device having a second type of radio for wireless communication with the lighting controller and a first type of radio for communicating with the client lighting devices. The first wireless network includes the first type of radio of hub lighting devices and the first type of radio of client lighting devices, and the second wireless network includes the second type of radio of the lighting controller and the second type of radio of the hub lighting devices. In at least one embodiment, client lighting devices are lamps having the first type of radio. In other embodiments, hub lighting devices are light fixtures having the first and second types of radios.

Light fixtures are oftentimes installed in large quantities, such as by the hundreds or thousands. Upgrading such an installation to a "smart" lighting system generally requires a central lighting controller that wirelessly communicates with each of the individual light fixtures for ON/OFF and optionally dimming control and other control. Adding to each light fixture a wireless radio that can communicate with a central lighting controller, for example, a local gateway, can be costly, particularly when controlling light fixtures over a large area; therefore, a method of minimizing the per-fixture cost is needed. Lamps (e.g. light bulbs) can be replaced at a lower cost than replacing light fixtures in an existing installation, so one cost savings measure that has been introduced is to replace existing lamps with "smart lamps," which are lamps that feature wireless connectivity. However, this solution does not solve the problem of the higher per-fixture cost for wireless radios that are effective over a large area or for high complexity radios that support a mesh network for covering a larger area. Additionally, when large quantities of light fixtures are controlled simultaneously by a single central lighting controller, the high quantity of resulting wireless transmissions can cause excess latency, lost transmissions, and other obstacles to proper lighting system function.
As such, it was realized by the inventors of the current disclosure that improvements are needed to wirelessly control a multitude of light fixtures at lower costs and with reduced wireless network congestion.


A resistance welding device is provided with a moving distance measuring section for measuring distances between conductors to be joined before and after joining and evaluating joining quality based on the distances, and a projection including a base and a projecting surface is provided to the conductor to be connected in order to easily secure a distance between the conductors after the joining.

Used in the related art is resistance welding devices that weld conductors such as a metal plate by using, for example, a projection welding or a spot welding.
These welding devices carry out the joining by applying a current between objects to be joined for welding, concentrating the current at a joining area of the objects to be joined, and increasing a temperature of the joining area above a joinable temperature with Joule heat generated by the concentration of the current in that manner.
In such a welding device, the objects to be joined are good conductors such as metals from necessity to apply a current for the joining, and a shape such as a projection is provided at the joining area of the objects to be joined in order to concentrate the current.
For example, in Patent Document 1 (Japanese Published Unexamined Patent Application No. H5-283139 A), a resistance welding method of dissimilar metal terminals is disclosed.
A method in Patent Document 1 is described as a resistance welding method of dissimilar metal terminals for reliably welding normal flat plate-type dissimilar metal terminals, and carries out the joining by forming a projection for projection welding on a low-melting-point metal terminal small in heat capacity and radiating heat of the projection during the welding toward a high-melting-point metal plate large in heat capacity. More specifically, when a large current is applied instantaneously by using a capacitor-type direct current resistance welder, heat is lost (radiated) toward the high-melting-point metal plate large in heat capacity, which prevents an excess heat generation of the projection on the low-melting-point metal terminal small in heat capacity for the welding.
Another example of welding using a projection for projection welding is disclosed in Patent Document 2 (Japanese Published Unexamined Patent Application No. 2010-510641 W).
This aims for an effect to solve problems caused in a welding process, to improve productivity, and to reduce possibilities of defects by replacing low price competitive nickel, in a method for connecting to batteries by changing a plurality of battery connecting members from an expensive nickel plate member to a copper alloy plate member and further applying a corrosion prevention coating layer in order to prevent copper from oxidizing in air. More specifically, the copper does not generate a sufficient heat during the resistance welding due to high conductivity. Therefore, it is of great difficulty to carry out a welding process for connecting the copper to an electrode terminal, but formation of an embossed structure at one end of a connecting member causes a supplied current to concentrate at a projecting portion with the embossed structure. As a result, a resistance value increases on the projecting portion, from which heat is intensively generated. This leads a temperature of the projecting portion to a melting temperature. Thus, at this time, the welding is carried out by applying a physical pressure to the connecting member. The temperature of the projecting portion reaches the melting temperature faster than a temperature of a dent facing the projecting portion, which prevents the connecting member from adhering to a welding rod.
A technique relating to a printed wiring board is disclosed in Patent Document 3 (Japanese Published Unexamined Patent Application No. H6-36852 A). The technique disclosed in Patent Document 3 is described as a method for connecting a terminal to a printed wiring board, wherein a projecting part is joined to a conductor circuit with metal diffusion by providing a projecting part on a connecting surface of a tip part of the terminal and applying an ultrasonic vibration while fitting closely and pressurizing the projecting part of the terminal on a surface of the conductor circuit on a printed wiring board. In terms of the effects, it is described that the welding pressure and the ultrasonic vibration can be intensively and efficiently applied to the projecting part in joining to the conductor circuit with the metal diffusion.

Resistance welding device and resistance welding method


The invention relates to a method for providing a probe device for scanning probe microscopy, in particular for atomic force microscopy, wherein a scanning probe microscope is used for measuring a sample by means of a tip which is arranged on a cantilever of the probe device and which has a tip geometry. According to the invention, in a step upstream of the manufacturing process producing the tip, the tip geometry is optimized based on a selected tip basic form with regard to defined, required measurement properties, by computer simulating and evaluating the tip geometry, and modifying the tip geometry according to the evaluation with regard to these measurement properties. The invention further relates to a probe device for scanning probe microscopy, in particular for atomic force microscopy, having a cantilever and a tip formed on the cantilever in the nanometer range, with which samples to be measured can be scanned.

Scanning probe microscopy and/or atomic force microscopy can be used, for example, to scan semiconductor components and structures arranged therein for quality assurance. The structures can include, for example, trenches and/or holes in the semiconductor component, which can have a width and/or a diameter of a few tens of nanometers and a depth of a several hundred nanometers. For example, in order to be able to measure the straightness and/or parallelism of the walls of the trenches and/or a depth of the trenches and/or of holes, the tip is inserted into the trenches or the holes. Of course, it must be commensurately thin. In addition, the tip must have a certain length in order to also be able to scan the bottom of the trenches or the holes. However, the measurement result can be distorted due to interactions between the tip and the walls of the trenches. This can be due in particular to the fact that the tip is deflected when the walls are scanned. The tip can be pulled towards the walls by van der Waals interactions, for example. For example, the tip may bend toward the wall. Reliable measurement is, of course, very difficult. To keep the tip deflection as low as possible, a relatively thick tip can be used. On the other hand, the length of the tip can also be kept as short as possible in order to reduce the deflection of the tip. However, if thicker tips are used for measurement, the measurement resolution may decrease. In general, attempts may be made to make the tip stiffness as high as possible to minimize tip deflection and/or deflection.
DE 10 2006 008 858 A1 discloses a probe device for scanning probe microscopy comprising a cantilever and a tip in the nanometer range which is formed on the cantilever and is produced by means of additive methods, by means of which samples to be measured can be scanned. The disadvantage of this is that the geometry of the tip is predetermined, so that scanning the sample with such tips is not optimal.

Method for providing a probe device for scanning probe microscopy


A microcomputer comprises: a memory which stores a predetermined program; a CPU which reads the program stored in the memory based on a predetermined instruction to perform a predetermined calculation; and a read controller which controls reading of the program from the memory, and the microcomputer further comprises: a plurality of memory areas disposed in the memory and having distinction bits; distinction unit for distinguishing the memory areas using the different distinction bits; and read access controller for prohibiting the reading from the memory area in which another program is stored based on a distinction result of the distinction unit.

The present invention relates to microcomputers each comprising a microprocessor and a program storage memory, particularly to microcomputers capable of holding security among users in installing different programs by a plurality of users.
In recent years, situations have increased in which a plurality of programs are installed in memories beforehand and provided in manufacturing and shipping microcomputers. Since copyrights of the programs installed beforehand in this situation are held by a plurality of different software sellers, it is a problem whether or not the securities of the programs can be secured in successively installing the microcomputers via a plurality of program users.
In Japanese Patent Application Laid-Open No. 7-200413, a microcomputer has been described in which the program memories can be additionally disposed in the outside and in which reading from a built-in address is prohibited in a case where an address for fetching an instruction does not exist in a built-in address space.
In Japanese Patent Application Laid-Open No. 8-272625, a multi-program execution control device and method have been described comprising: setting means for setting at least one of a prohibiting area in which accesses from other programs are prohibited, and a permitting area in which the accesses from the other programs are permitted in each program.
In Japanese Patent Application Laid-Open No. 2000-181898, a microcomputer has been described comprising: a flash memory comprising a first programmable region and a second region to designate whether or not programming is possible with respect to the first region; and a microprocessor which refers to the second region of the flash memory to judge whether or not the programming of the first region can be executed at a time when there is a request for programming from the outside.
In Japanese Patent Application Laid-Open No. 2002-7214, an information processing apparatus has been described comprising: rewrite control means, started by a CPU with generation of an interruption signal, for prohibiting a nonvolatile storage device from being rewritten in a case where an access by software is unjust.
All of these documents Japanese Patent Application Laid-Open Nos. 7-200413, 8-272625, 2000-181898, and 2002-7214 describe the microcomputer provided with a program security function. In the microcomputer, judgment means is disposed for judging whether or not a storage place of an instruction code is a specific memory area with respect to the instruction code for executing the access, and it has been judged whether or not data can be read from the memory using the judgment means at an instruction execution time.
That is, a conventional microcomputer 1 shown in FIG. 13 comprises: a memory 2 to store a predetermined program; a central processing unit (hereinafter referred to as the CPU) 3 which executes a predetermined calculation based on input of a predetermined instruction code; a debug program memory 4 which supplies a debug program to the CPU 1 via an instruction bus; a distinction bit 5a and an instruction code 5b processed in the CPU 3; an address decoder 6 which manages an address of the program stored in the memory 2; and a read controller 7 which controls the reading of the program from the memory based on a read enable signal from the CPU 3.
The microcomputer 1 further comprises: a direct memory access (hereinafter referred to as the DMA) controller 8 which controls a direct access into an internal memory from a memory outside a system; and a chip external bus interface 9 which enables the access to the outside of a chip.
In the conventional microcomputer 1, the distinction bit 5a for distinguishing a memory area of the memory 2 corresponding to the storage place of the instruction code is applied to the instruction code 5b for executing the access, supplied to the CPU 3 via the instruction bus. When the distinction bit 5a is disposed as distinction unit of this instruction code storage place, the program or data stored in an internal memory of a computer system can be protected, and the program security function has been tentatively performed.
However, in the conventional microcomputer, only one memory area to store the program is disposed in the memory. Only one distinction bit is disposed as the distinction unit of the instruction code storage place. Therefore, even when a plurality of program providers install a plurality of programs with respect to one memory, one memory area is accessed to install the program into the internal memory making full use of one distinction bit.
Therefore, when the distinction bit is matched, and the access to the memory is permitted, the program stored by another program provider can be read, and a basic program security function is secured with respect to the internal memory in the computer system. However, there has been a problem that the program security function cannot be secured with respect to the already installed specific program.
That is, in recent years, a memory capacity has increased, and functions have been multiplied by enhancement of a performance. On the other hand, it has been very important to shorten a development period because of a speed of a product cycle. Therefore, a situation in which each core technique has to be entrusted to each technical expert has increased in mounting a plurality of sophisticated core technique in a short development period. In this situation, each of software has to be successively programmed into the memory. However, to hold mutual secrecy of software, in the case of the microcomputer having only one distinction bit as in a conventional example, there has been a problem that there is not any method other than a method of controlling the access by mutual communication using a plurality of microcomputers, or using an operating system (OS).
In this situation, even though each software should be programmed or installed into the memory, in the case where only one distinction bit is used, when the previous seller installs a specific program into a memory, and the next seller receives the memory, is permitted to access the memory by the same distinction bit, and installs a different program, there has been a problem that contents of the already stored program are read by a different program seller.
To that end, there has been a general technique to protect secrecy of software, either by controlling accesses of a plurality of microcomputers each of which has only one distinction bit same as the prior art through mutual communications, or by using the operating system (OS).
Therefore, there is desired a microcomputer capable of securing the security between programs even in a case where different storing persons install a plurality of different programs in the memory.

Microcomputer with a security function for accessing a program storage memory


A method for generating a health indicator for at least one person of a group of people, the method comprising: receiving, at a processor, captured sound, where the captured sound is sound captured from the group of people; comparing the captured sound to a plurality of sound models to detect at least one non-speech sound event in the captured sound, each of the plurality of sound models associated with a respective health-related sound type; determining metadata associated with the at least one non-speech sound event; assigning the at least one non-speech sound event and the metadata to at least one person of the group of people; and outputting a message identifying the at least one non-speech event and the metadata to a health indicator generator module to generate a health indicator for the at least one person to whom the at least one non-speech sound event is assigned.

Background information on sound identification systems and methods can be found in the applicant's PCT application WO2010/070314, which is hereby incorporated by reference in its entirety.
The papers "A Cough-Based Algorithm for Automatic Diagnosis of Pertussis" (Pramono et al.) and 'Cough Detection in Spoken Dialogue System for Home Health Care' (Takahashi et al., 8th International Conference on Spoken Language Processing ICC Jeju, Oct. 4-8, 2004; www.isca⋅speech.org/archive) are directed to detecting non-speech sound events originating from a single person that are related to the person's health.


Embodiments of the present invention relate to apparatus and method for improve uniformity of a polishing process. Embodiments of the present invention provide a heating mechanism configured to apply thermal energy to a perimeter of a substrate during polishing, or a cooling mechanism configured to cool a central region of the substrate during polishing, or a biased heating mechanism configured to create a temperature step differential on a given radius of a polishing pad.

1. Field of the Invention
Embodiments of the present invention generally relate to an apparatus and a method for polishing semiconductor substrates. More particularly, embodiments of the present invention provide apparatus and method for temperature control when polishing semiconductor substrates to improve uniformity.
2. Description of the Related Art
During fabrication of a semiconductor device, various layers, such as oxides, and copper, require planarization to remove steps or undulations prior to formation of subsequent layers. Planarization is typically performed mechanically, chemically, and/or electrically using processes such as chemical mechanical polishing (CMP), and electro-chemical mechanical polishing (ECMP).
Chemical mechanical polishing typically includes mechanically abrading a substrate in a slurry that contains a chemically reactive agent. During chemical mechanical polishing, the slurry is delivered on a polishing pad and the substrate is typically pressed against the polishing pad by a carrier head. The carrier head may also rotate and move the substrate relative to the polishing pad. As a result of the motion between the carrier head and the polishing pads and chemicals included in the slurry, the non-planar substrate surface is planarized by chemical mechanical polishing.
However, various factors of CMP process can lead to non-uniformity causing non-planar artifacts on the substrate surface. For example, during processing, different regions on the substrate may have different speeds relative to the polishing pad and different accessibility to the slurry resulting in temperature variation within different regions of the substrate. Substrate surface temperature is one of the factors that affect removal rate. Consequently, temperature variations within the substrate may lead to non-uniformity, such as non-planar surface, within the substrate.
For example, FIG. 1 illustrates a prior art polishing result with non-uniformity. Plot 10 in FIG. 1 is a profile of a substrate after polishing. The x-axis indicates a distance from a center of the substrate and the y-axis indicates the thickness of the substrate. As shown by the curve 11, there are pumps 12, 13 near the edge of the substrate.
Therefore, there is a need for apparatus and method for improving uniformity in polishing.

Apparatus and method for temperature control during polishing


A method for managing the operation of an AC power distribution network to which connect a plurality of electric vehicles, at random times and at random locations to receive electrical energy for charging. The AC power distribution network is characterized by a dynamic state of balance between power generation and load, and it has an operating reserve which is a supplemental power generation capacity available to the AC power distribution network. The method includes the step of forecasting a power-supply contribution that would be available to the AC power distribution network from the electric vehicles connected to the AC power distribution network in the event the AC power distribution network experiences a state of imbalance resulting from a power-generation deficit. The method further includes adjusting the magnitude of the operating reserve on the basis of the forecasting.

An electric vehicle has an electric supply capability, which is used for propulsion. The main battery of the electric vehicle constitutes the electric supply capability. Alternatively, an electrical generator that is driven by an internal combustion engine to supply electrical energy to the drive motor of the vehicle, either alone or in combination with the main battery, can provide supplemental electrical supply capability. A fuel cell is yet another example of an electrical supply capability option.
The main battery has a storage capacity that typically ranges from a few kWh to over a hundredth of kWh. The capacity is such that it can meet the electrical power consumption needs of a single family home for many hours even days. In addition, the electrical supply capability can be used to supply the AC power distribution network when the network requires it, namely when it is overloaded or experiences frequency instability.
In light of the above, there is a need to improve the interaction between an electric vehicle and the electrical distribution system of the dwelling when the vehicle supplies electrical energy to the dwelling or between the electric vehicle and the AC power distribution network when the electric vehicle assists the AC power distribution network in the case of high demand or a sudden imbalance between power generation and load.
In addition there is also a need to for techniques to allow an AC power distribution network to determine how much supply of electrical energy is available from electric vehicles that are currently connected to the AC power distribution network at any given time and on which the AC power distribution network can rely in case of overload or a power generation deficit.
Yet, there is a need for management of credits to electrical vehicle owners when they provide services to the AC power distribution network to support the network in the case of overload or a power generation deficit.

Method and apparatus for controlling the power supply from an electric vehicle to a dwelling or to an AC power distribution network


A layered photoreceptor is composed of a substrate, an extrinsic pigment layer that has been sensitized disposed over the substrate, and a charge transport polymer in contact with the pigment layer. A method for producing a photoreceptor comprises depositing a layer of sensitizing electron donor material in a polymer binder on a substrate. An extrinsic pigment layer is deposited on the layer of sensitizing electron donor material. A charge transport layer is deposited on the pigment layer.

Tile formation and development of electrostatic latent images on surfaces of photoconductive imaging members, commonly referred to in the art as photoreceptors, is well known. In these systems, and in particular in xerography, the xerographic plate (or drum or belt) containing a photoconductive insulating member is imaged by uniformly electrostatically charging its surface, followed by exposure to a pattern of activating electromagnetic radiation, such as light, which selectively dissipates the charge in illuminated areas of the photoconductive layer causing a latent electrostatic image to be formed. The latent electrostatic image can then be developed with developer compositions containing, for example, toner particles, optionally combined with carrier liquid or particles. This is followed by transferring the image to a suitable substrate such as paper. This process requires the photoconductive member to photogenerate and transport charge, thereby neutralizing the charge on the surface.
Examples of photoconductive members include members comprised of inorganic materials and organic materials, layered devices of inorganic or organic materials, composite layered devices containing photoconductive substances dispersed in other materials, and the like. Current layered organic photoreceptors have a substrate layer and two active layers: (1) a thin charge generating layer containing a light-absorbing pigment, and (2) a thicker charge transport layer containing electron donor molecules in a polymer binder. The electron donor molecules (e.g., triaryl diamines) provide hole or charge transport properties, while the electrically inactive polymer binder provides mechanical properties. The charge transport layer can alternatively be made from a charge transporting polymer such as poly(N-vinylcarbazole), polysilylene or polyether carbonate, wherein the charge transport properties are incorporated in the mechanically strong polymer. These photoconductive members can optimally include a charge blocking and/or adhesive layer between the charge generating and the conductive layers. Additionally, they may contain protective overcoatings and the substrate may comprise a nonconductive and a conductive layer. Additional layers to provide special functions such as incoherent reflection of laser light, dot patterns for pictorial imaging or subbing layers to provide chemical sealing and/or a smooth coating surface may also be employed.
In a preferred photoreceptor, the photoreceptor surface is charged to a negative polarity by a corona device and discharged by visible or infrared light or radiation to form a charge pattern or image. The light is primarily absorbed by the pigment in the charge generating layer which photogenerates the charge carriers. The positive charges in this pigment or charge generating layer are injected into the charge transport layer and transported to the surface of the charge transport layer, thereby discharging the layers.
Generally, pigments used in the charge generating layer can be classified into two classes on the basis of their photogeneration mechanisms: (1) intrinsic and (2) extrinsic. In intrinsic pigments, the positive and negative charges are separated directly and transported internally, without the assistance of a charge transporting species, to the surface of the charge generating layer. Selenium, selenium tellurium alloys, and arsenic selenium are examples of intrinsic inorganic pigments. Examples of organic intrinsic pigments are phthalocyanines.
With extrinsic pigments, charges are not readily separated but require charge transporting material or molecules in the vicinity of the photogeneration process for charge separation. Hence by themselves extrinsic pigments are very insensitive to photogeneration. Examples of extrinsic organic pigments are perylene diamine pigments. Extrinsic inorganic pigments include cadmium sulphate and zinc oxide.
U.S. Pat. No. 3,904,407 to Regensburger et. al. discloses multilayer electrophotographic elements including a perylene pigment charge generating layer, a transport layer and a conductive substrate. These perylene pigments can be vacuum-deposited to form high sensitivity charge generation layer. U.S. Pat. Nos. 3,871,882, 4,419,427, 4,578,333, 4,578,334, 4,587,189 and 5,019,473 disclose multilayer imaging members incorporating a perylene-3,4,8,10-tetracarboxylic acid imide derivative pigment charge generation layers wherein the pigment is dispersed in a polymeric binder or vacuum deposited. In all these disclosures, claiming high sensitivity perylene pigment charge generation layers, the charge transport layer consists of solutions or dispersions of arylamine electron donor molecules in a polymer binder.
The sensitivity of a layered device depends on several factors: (1) the fraction of the light absorbed, (2) the efficiency of charge photogeneration within the pigment crystals, (3) the efficiency of injection of photogenerated charge carriers into the transport layer and (4) the distance the injected charge carrier travels in the transport layer in the time between the exposure and development steps. The fraction of the light absorbed can be maximized by increasing the thickness of the generator layer and/or the concentration of pigment in the generator layer. The distance the charge carrier travels in the transport layer can be optimized by the selection of the charge transporting material and by the concentration of the charge transporting active molecular sites. However, the efficiency of photogeneration and injection can be interactive in that both processes depend on both the pigment and the transport material. The photogeneration efficiency with some pigments depends upon the presence of charge transporting material on the surface of and therefore in contact with the pigment. These pigments are extrinsic as distinguished from intrinsic pigments whose photogeneration efficiency is high even in the absence of such transport material.
The layered devices fabricated from extrinsic pigments may be less sensitive in the following situations: (1) A two layer device in which the charge generator consists of pigment loading in high enough concentration to assure particle contact in an inactive binder and the transport layer is fabricated from a dispersion of charge transporting molecules in an inactive binder. The charge transporting molecules of the transport layer may not be soluble in the binder used for the generator layer. If the generator layer pigment is extrinsic, only that part of the generator layer in contact with the transport molecule is sensitive to light. This would be the pigment located in a very narrow region in the very top part of the generator layer. The exposure or erase light absorbed in the pigment located below this region of the generator layer is essentially wasted. (2) A two layer device whose generator layer is fabricated by sublimation of the extrinsic pigment and whose transport layer is fabricated from a dispersion of charge transporting molecules in an inactive binder which does not penetrate the generator layer. A thin pigment layer located in the very top part of the generator layer is in contact with the charge transporting molecules and the light absorbed in this portion of the generator layer produces free carriers with high efficiency. The exposure or erase light absorbed in the pigment located below this region of the generator layer is essentially wasted. (3) A two layer device containing a generator layer either fabricated from extrinsic pigments in a binder or fabricated from sublimed extrinsic pigments and a transport layer containing a charge transporting polymer that cannot readily diffuse into the generator layer.
There is no certainty that a pigment that seems sensitive in a device employing a charge transport layer containing a solid state solution of charge transport molecules in a polymer binder will have good sensitivity when employed in conjunction with a charge transporting polymer. One of the architectural advantages of multilayered organic photoreceptors is that when fabricated on semitransparent substrates, the erase light can be incident from the substrate side. This option is not easily available for conventional multilayered devices employing extrinsic pigments, as the erase lamp intensity has to be extremely high.
As discussed, the photogeneration efficiency of extrinsic pigments such as benzimidazole perylene by itself is very low (0.01 charge carriers per absorbed photon). A proposed explanation for this is that the absorbed photons produce bound charge pairs (excitons) that recombine or relax to the ground state with very inefficient production of free charge carriers. The presence of electron donor molecules such as those in the charge transport layer enables the excitons at the pigment molecule interface to dissociate by electron transfer from the electron donor molecules, increasing photogeneration efficiency. Thus, the photogeneration efficiency of benzimidazole perylene pigment in the presence of a triphenyl diamine such as N,N'-diphenyl-N,N'-bis (3 methylphenyl)-1,1'-bisphenyl-4,4'diamine, is very high (e.g., 0.3 to 0.6 charge carriers per absorbed photon).
The photogeneration efficiency of a benzimidazole perylene charge generation layer used in conjunction with a charge transport layer composed of a charge transporting polymer such as poly (N-vinylcarbazole), polysilylenes, polyarylamines and others including those described in U.S. Pat. Nos. 4,618,551, 4,806,443, 4,806,444, 4,818,650, 4,935,487, and 4,956,440, is very low when compared to a triphenyldiamine solution charge transport layer used in conjunction with a benzimidazole perylene. This is thought to be because the electron donor moieties in the poly(N-vinylcarbazole) polymer cannot and therefore do not penetrate into the charge generating layer as do the small molecules of triphenyldiamine.
This therefore places a new requirement on the properties of charge transport layer materials. With the use of extrinsic pigments like perylene diamines, a transport polymer material such as poly(N-vinylcarbazole) cannot be employed if it does not meet the aforementioned photogeneration requirements. This produces a particular problem in situations where polymeric charge transport layer materials such as poly(N-vinylcarbazole) are preferred over two phase charge transport layers formed by molecular solutions or dispersions of electron donor molecules in a binder. An example of such a situation are in photoreceptors subject to inks with liquid carriers such as Isopar.RTM. which attack two phase charge transport layers.

Photoconductors employing sensitized extrinsic photogenerating pigments


The present invention generally relates to web applications, and, more particularly, to a distributed virtual control system (VCS) configured to track changes by users to web applications. For this purpose, a system includes a user device configured to access a web server, which includes a web application stored in the web server, wherein the web application is accessible by another user device to make changes to the web application, which changes are stored in a historical collection of versions of the web application in an original repository. The user device is configured to allow the user device to access the historical collection of versions of the web application in the original repository, and to store the changes to the web application made by the other user device in the historical collection of versions of the web application in a first local repository in the user device.

The present invention generally relates to web applications, and, more particularly, to a distributed version control system (VCS) configured to track changes by users in web applications.
Many systems are based on web applications. In many cases, a number of users have the ability to make changes to the web application, while other users are barred from making changes, but still have access to use the web application. The tools used for building web applications include pipeline steps and parameters that are described by lists of forms, scripts, commands, etc. Web applications include web based tools to control database systems or virtually any Software as a Service software (SaaS).

Distributed version control for tracking changes in web applications

INTERNATIONAL BUSINESS MACHINES CORPORATION


A method of handling handover message decoding for a mobile device in a wireless communication system is disclosed. The method includes via a first radio access technology (RAT), receiving a handover message associated with a handover from the first RAT to a second RAT supporting services of a packet switched (PS) domain and a circuit switched (CS) domain, wherein the handover message comprises type information and an inter-RAT message generated based on the second RAT, and determining a switched domain type of the inter-RAT message according to the type information.

1. Field of the Invention
A method and related communication device for a wireless communication system is disclosed, and more particularly to, a method and related communication device for handling message decoding associated with a handover in a wireless communication system.
2. Description of the Prior Art
A handover procedure can transfer a mobile device from a communication state to another communication state. The communication state change can correspond to a telecommunication system, a cell, or a frequency layer scale, and corresponding handover is known as an inter-radio access technology (RAT), an inter/intra-cell or an inter-frequency handover.
For the inter-RAT handover, an X RAT can use an X handover procedure to hand over a mobile device, known as UE (User Equipment) or MS (Mobile Station), to a Y RAT by sending an X handover message including Y RAT configuration information. The mobile device configures itself to fit system requirements of the Y RAT according to the received Y RAT configuration information. Mostly, the Y RAT configuration information is formed as a message conforming to the specification of the Y RAT and includes mobility management, signaling connection, security, and capability information. Common RATs include UMTS (Universal Mobile Telecommunications System), GSM (Global System for Mobile communications)/GPRS (General Packet Radio Service), GERAN (GSM/EDEG radio access network) Iu mode system, CDMA (Code Division Multiple Access) 2000, and LTE (Long Term Evolution) systems.
HANDOVER COMMAND, PS (Packet-Switched) HANDOVER COMMAND and DTM (DUAL TRANSFER MODE) HANDOVER COMMAND messages are provided to initiate an inter-RAT handover to the GSM/GPRS mode system for CS (Circuit-Switched) or PS type connection transfer. The HANDOVER COMMAND message is a GSM RR (Radio Resource) message seen as a CS-type message, and the PS HANDOVER COMMAND and DTM HANDOVER COMMAND messages are GPRS (General Packet Radio Service) RLC/MAC (Radio Link Control/Medium Access Control) control messages seen as PS-type messages. The UE is equipped with a GSM RR message decoder for decoding the HANDOVER COMMAND message and a GPRS RLC/MAC control message decoder for decoding the PS HANDOVER COMMAND and DTM HANDOVER COMMAND messages.
For the inter-RAT handover from the UMTS to the GSM/GPRS system, a HANDOVER FROM UTRAN COMMAND message for initiating the inter-RAT handover can include one of the HANDOVER COMMAND, PS HANDOVER COMMAND and DTM HANDOVER COMMAND messages. A UE with CS and PS services in a UTRAN (UMTS Terrestrial Radio Access Network) receives a HANDOVER FROM UTRAN COMMAND message when a handover attempt for the UE is made by the UTRAN. However, the UE cannot know which GSM message is included in the received HANDOVER FROM UTRAN COMMAND message. Since the UE has no way to know a switched type (the CS or PS type) of the GSM message, errors in decoding the GSM message occur if the UE uses a wrong decoder. For example, if the UE uses the GSM RR message decoder to decode a GPRS RLC/MAC control message, the decoding error occurs. In this situation, the UE determines that the HANDOVER FROM UTRAN COMMAND message is invalid and then sends a HANDOVER FROM UTRAN FAILURE message to the UTRAN. Thus, lack of knowing the identity of the GSM message can cause the handover failure.
The inter-RAT handover from the LTE to the GSM/GPRS system has similar problem. When a UE in an E-UTRAN has a voice service (VoIP call) on going, the E-UTRAN can perform a PS handover to the GPRS/GERAN Iu mode system to continue the voice service or perform a SRVCC (Single Radio Voice Call Continuity) handover to the GSM/GERAN Iu mode system so that the UE can reuse the CS system. For initiation of the handover, the E-UTRAN sends to the UE a MobilityFromEUTRACommand message that may include either PS HANDOVER COMMAND or HANDOVER COMMAND message. However, the UE cannot know which of GSM or GPRS RLC/MAC message is included. The decoding errors can occur and thereby causes failure of the handover.

Method of handling handover message decoding and related communication device


A vehicle seating assembly includes a seatback and a seat base including a first section and a second section where the first and second sections independently pivot between a raised position and a lowered position. An internal storage compartment is defined between the first and second sections of the seat base. An interior bin is coupled to the second section of the internal storage compartment where the interior bin independently pivots between the raised and lowered positions. A partition is coupled to a first section of the internal storage compartment.

Vehicle operators and consumers express a desire for additional and versatile storage space in their motor vehicles. The need and desire for this additional space and versatility is important as guidance to maximize the space provided in motor vehicles where space is limited and secure storage may be desired for a variety of tools, packages, and the like. Creatively developing and engineering alternative options to store a consumer's materials could likely improve the utility of any vehicle.

Integrated under seat cushion configurable storage


A door forming a part of a closure assembly is attached to the frame of the closure assembly by engaging bifurcated branches of a pivot arm with a pivot shaft. One of the branches is extended to engage a curved leaf spring which is deformed as the door and the extension is pivoted about the shaft. The deformation of the spring is instrumental in exerting a force on the extension to detent the door in the closed position and the extension may disengage from the spring surface when in the open position. To further stabilize the door, a stabilizer is formed on the back of the door and it engages the end of a recessed channel in the assembly, at a point coincident with the pivot axis of the door.

In the design of electronic components for use in desktop computer systems, the openings to the disk drives must be accessible to the operator. It is desirable to shield those openings from view for aesthetic reasons while at the same time providing a movable device, such as a door, whereby access to the devices may be re-established at any time the operator desires.
By placing a door over the openings to the disk drives or other devices within the frame of the electronic device, the devices are shielded from view but readily accessible.
It is necessary to hold the door in a fully closed position in order to maintain a pleasant appearance as well as to permit the door to open fully to provide free access to the components behind the door.
Therefore, it is an object of the invention to detent the door in a fully closed position and to then permit the door of the closure assembly to open to the fully open position and to remain in either of the positions without being held by the operator.
It is another object of the invention to detent the door in at least the closed position.


A method, computer system, and computer program product for using sensor data to modify navigation commands. The method may include predicting a user's navigational action and modifying a navigation command based on comparing the user's predicted navigational action to a recommended navigational action. The modifying the navigation command may include communicating a navigation command to a user based on the user's predicted navigational action deviating from a predetermined navigational action. The modifying the navigation command may include suppressing a queued navigation command to a user based on the user's predicted navigational action conforming to a predetermined navigational action. Predicting the user's navigational action may be based on information received from one or more sensors embedded in a vehicle. The modifying the navigation command may include increasing a frequency of communicating a queued navigation command to a user or decreasing a frequency of communicating a queued navigation command to the user.

Embodiments of the present invention relate generally to a method, system and computer program for using sensor data to modify navigation commands.
Oftentimes, when traveling to a destination, a user may use a navigation system in order to get navigation directions to reach that destination. The navigation system may provide visual and auditory cues respecting which roads to take and where to turn.

International Business Machines Corporation