The invention provides a novel Exendin variant and the Exendin variant conjugate conjugating polymer thereon, the pharmaceutical composition comprising them and use of them for treating diseases such as reducing blood glucose, treating diabetes, especially Type II diabetes. The invention also provides the use of Exendin conjugate for lowering body weight.

With social development, prolongation of life expectation and change of lifestyle, diabetes mellitus has been one of the leading healthcare problems around the world. Both in developed countries and developing countries, morbidity of diabetes mellitus is rapidly growing. In 2007, there are around 246 million diabetes patients in the world, and one diabetes patient dies every 10 seconds around the world. It is estimated that the population of diabetes patients in the world will reach 333 million till 2025. China has been a severe region for diabetes. In China, the population of diabetes patients is currently 40 million, which is the second largest number in the world (the first is India), with the morbidity of around 5%. Diabetes mellitus comprises two types: one is insulin-dependent diabetes mellitus (Type 1 diabetes) and the other is non-insulin-dependent diabetes mellitus (Type 2 diabetes). Among them, Type 2 diabetes contributes to more than 90% of diabetes. Type 2 diabetes is characterized by uncontrolled insulin secretion or function as well as dysfunction of β-cell, resulting in disorder of lipid, carbohydrate and protein metabolism. It may lead to chronic hyperglycemia and eventually induce complications occur in microvasculature, macrovasculature and various organs. At present, there are two classes of medication for controlling diabetes mellitus: 1) insulin-secretion promoters, such as sulfonylureas, meglitinides, and dipeptidyl peptidase inhibitors, GLP-1 analogs; and 2) non-insulin-secretion promoters, such as insulin, α-glucosidase inhibitors, biguanides, thiazolidinediones, and insulin analogs. Currently, most anti-diabetic medications commonly used in clinic is less efficient for Type 2 diabetes. They fail to stop progressive damage of pancreas β-cell, to reduce blood level of HbA1c, and to prevent complications of diabetes, such as heart disease and kidney failure. In addition, they have, to some extent, toxic side effects. Accordingly, there is a need to study new medication for treatment of Type 2 diabetes.
In 1985, an intestinal hormone, Glucagon-like peptide-1 (GLP-1), was discovered. GLP-1 is expressed by proglucagons gene after eating, and mainly secreted by L-cells in intestinal mucosa. GLP-1 stimulates pancreas islet β-cell to secret insulin (J Med Chem, 47, 4128-4134, 2004), and play an important role in stabilizing blood glucose level. Administering GLP-1 may control blood glucose at normal level in Type 2 diabetes patients (Diabetes Care, 15, 270-276, 1992; Lancet, 359, 824-830, 2002; Endoer. Rev, 16, 390-410, 1996; Diabetologia, 28, 565-573, 1985). GLP-1 has functions as follows: glucose-dependent action on pancreas islet β-cell so as to promote the transcription of insulin gene, and increase biosynthesis and secretion of insulin; stimulating the proliferation and differentiation of β-cell and inhibiting apoptosis of β-cell so as to increase the amount of pancreas islet β-cells; inhibiting secretion of glucagons; increasing sensitivity of insulin receptors in peripheral cells; decreasing HbA1c level; suppressing appetite and eating; delaying gastric emptying (Diabetic Med, 18, 144-149, 2001; Diabetes, 51, 1443-1452, 2002; Diabetologia, 45, 1263-1273, 2002; Diabetes, 50, 525-529, 2001; Diabetes, 50, 725, 2001; Diabetes, 52, 365-371, 2003; Recent Prog. Hormne Res. 56, 377-399, 2001; Disbetologia, 39, 1546-1553, 1996; Am. J. Physicl Endocrinol. Metab, 281, E242-247, 2001; U.S. Pat. Nos. 4,779,67, 4,780,17, 4,784,25; Diabetes Care, 22, 403-408, 1999; J. Clin. Endocrinology and Metabolism, 88, 3082-3089, 2003; Diabetes, 44, 1295, 1995). However, GLP-1 is easily degraded by dipeptidyl peptidase (DPP IV) in the body, and has a half life of less than 2 minutes, and thus GLP-1 cannot be used as an effective anti-diabetic drug.
Exendin-4 is a polypeptide which is found in the saliva of the Gila monster, a poisonous lizard that lives in Arizona and New Mexico of the United States (J. Biol. Chem., 265, 20259-20262, 1990; J. Biol. Chem., 267, 7402-7405, 1992). Exendin-4 is highly homologous with GLP-1 (7-36) (53%). It is reported that Exendin-4 may bind to GLP-1 receptor and exhibits pharmacological agonistic effect similar to that of GLP-1, for example, increasing the synthesis of insulin, promoting insulin secretion in a glucose-dependent manner; stimulating proliferation and regeneration of β-cells and inhibiting apoptosis of β-cells so as to increase the amount of β-cells; inhibiting the secretion of glucagons; inhibiting generation of glycogen without inducing severe hypoglycemia; inhibiting gastrointestinal motility and secretion after eating; decreasing appetite and decreasing food uptake; protecting nerve cells (Nat. Biotech, 23, 857-861, 2005; J. Biol. Chem., 266, 2897-2902, 1991; J. Biol. Chem., 266, 21432-21437, 1992; Diabetes, 44, 16-19, 1995; Nature, 379, 69-72, 1996). The effect of Exendin-4 to promote the secretion of insulin and to inhibit the secretion of glucagon after eating is dependent on blood glucose, which is advantageous compared with currently used sulfonylureas, and in particular, Exendin-4 is less susceptible to induce hypoglycemia, and it greatly decreases the frequency of blood glucose monitoring and also lowers the body weight. A b.i.d. formulation of Exendin-4 (Exenatide, marketed as Byetta), co-developed by Amylin and Eli Lilly, is approved for market in U.S. and Europe (U.S. Pat. Nos. 5,424,286, 6,858,576, 6,872,700, 6,902,744, 6,956,026, 7,297,761). As such, this type of medication has been widely used in the treatment of diabetes and obesity around the world.
Pharmaceutical polypeptides requires multiple injections daily, since these pharmaceuticals have short half life in the body and poor physical and chemical stability, and they are susceptible to the degradation by various proteases. Exenatide is used b.i.d as an s.c. injection, which brings to patients a heavy burden in body, psychology and economy, and thus compliance of patients is limited. Accordingly, current studies of anti-diabetic drugs focus on structurally modifying Exendin-4 and developing new dosage form, in order to prolong plasma half life of Exendin-4 and increase systemic drug exposure.
Polymer modification technique is a potent modification technique which was developed since 1970s, in which PEGylation is a typical technique. This technique is to chemically conjugate PEG to a pharmaceutical protein, in order to modify the surface of the protein. Upon PEG modification, molecular weight of proteins is increased and clearance rate in kidney is decreased. In addition, a conjugated PEG chain results in steric hindrance on the modified protein molecule, leading to reduction of protein hydrolysis by proteases in blood. Thus, it efficiently prolongs the residence of proteins in circulation, and leads to prolongation of plasma half life and systemic drug exposure, resulting in improved efficacy.
At present, PEGylation has progressed into its second generation, site specific PEGylation. Site specific PEGylation can be used to specifically modify certain amino acids in proteins, and thereby prevent random modification. As such, the structure of active center in proteins is less influenced and certain antigenic sites are selectively intervened, resulting in reducing disadvantages such as reduced biological activity and increased heterogeneity due to non-site-specific PEGylation.
Scientists have carried out some studies on polymer modification of Exendin-4. Young and Prickett (CN1372570A) proved that Exendin-4 is mainly metabolized by renal clearance. Thus they modified Exendin-4 using PEG with a molecular weight ranging from 500 to 20,000 Dalton (Da). Wenchao Bao, Hongjing Xu, Gang Yu, Yajun Zuo (CN101125207A) performed amino modification in Exendin-4 using PEG with a molecular weight ranging from 20 kDa to 50 kDa.
However, there are disadvantages in existing Exendin-4 or variants thereof and various modified forms, including high administration frequency, which brings to patients heavy physical, psychological and economical burden. Thus compliance of patients is limited, and these drugs cannot be widely used. Accordingly, there still need new Exendin-4 variants and the variants modified by polymer.


A testing apparatus for measuring the material properties of solder balls includes a frame and a chuck base moveable in X, Y, Z dimensions, relative to the frame. A probe tip is fixed to the frame. A measuring device is mounted to the frame and maintains a spacing with relationship to the probe tip and which has an initial, known height above the chuck base.

It is important to characterize hardness of solder bumps in order to evaluate the feasibility of testing chips with non-compliant wafer test probes because they rely on compression of the solder bump to overcome non-planarity of the solder bumps. Lead free solders can be significantly harder than the lead tin solder bumps. Thus, lead free testing may require forces that are beyond the capability of existing test equipment and the structural strength of the chip dielectric layers. Also, known tools for characterizing solder bump hardness do not deform the solder ball in the same manner as the non-compliant wafer probes. Accordingly, there is no practical way to characterize the hardness of individual lead free solder bumps.
Accordingly, there exists a need in the art to overcome the deficiencies and limitations described hereinabove.

Solder bump testing apparatus and methods of use

International Business Machines Corporation


A system for plugging an oil well after a blowout comprises a hollow drill string. A connecting device is loosely situated around the string. The connecting device has an upper surface, a side surface and a lower surface having a recess. An inflatable bladder comprises an impermeable material. A skirt has a plurality of rods, each of which are pivotally connected to the lower surface. The first fastening ring is configured to selectively allow the bladder to transition from an unfilled state to a filled state. A second fastening ring is configured to selectively allow the skirt to transition from a closed position to an open position. A stop having a beveled edge is secured to the drill string. The recess is configured to allow the connecting device to mate with the stop beveled edge.

Drilling a well for the production of oil is an involved process, and different types of drill strings may be used to effectuate the drilling. A drill string is a column or string of drill pipe, and the term drill string is loosely applied to the assembled collection of the drill pipe, drill collars, and a drill bit. Drill collars are thick walled pipes that, by virtue of their heavy weight, aid the drill bit in the drilling process. Drilling fluid, which is also known as "mud" by those versed in the art and which consists of carefully tailored solids and chemicals, is pumped down the inside of the hollow drill string. The mud cools the drill bit as it drills, stabilizes the rock in the well walls, and lifts the rock cuttings generated by the drilling up to the surface. The mud can then be recycled and re-used. Instead of a rigid drill pipe, the drill string may comprise flexible coiled tubing. A drill string with a rigid drill pipe generally has to be assembled joint by joint, the successive sections being added with increasing depth of the well; a coiled tubing drilling string, on the other hand, comprises flexible tubing instead of the rigid drill pipe, and need not be assembled joint by joint. A coiled tubing drilling string, therefore, can be tripped in and out of the well at a much faster speed than a drill string with a rigid drill pipe. Similarly, hybrid drill strings, which combine the rigidity of the drill pipe but reduce, if not eliminate, the need to assemble the pipe in parts, may also be employed. Coiled tubing drill strings and hybrid coiled tubing drill strings are known in the art.
Once an oil well is drilled, it may be plugged and abandoned as a dry hole. If, however, oil is to be produced from the well, the well must generally undergo a process referred to as "well completion." To complete the well, the hole of the well may be cased. Casing involves aligning the wall of the well with hollow pipes made of steel or other suitable materials. Generally, these pipes are of different diameters, which are joined together to make a continuous hollow tube. The diameters of these pipes are dependent upon the depth or level of the well, and are selected under a program referred to as a "casing program."
FIG. 1 depicts a conventional casing program, and shows how the pipes decrease in diameter with increasing well depth. A conductor pipe 10 has the greatest diameter, and is connected to surface casing 12. The surface casing 12 is in-turn connected to an intermediate casing 14, which is adjoined to a production casing 16. As can be seen, the surface casing 12 has a greater diameter than the intermediate casing 14, and the intermediate casing 14 has a greater diameter than the production casing 16. Casing is integral for the production of oil from a well, as without the casing, the well may collapse and close. Moreover, casing protects the well stream from outside incumbents, such as water or sand, et cetera. The casing is cemented to the walls of the well, which helps to permanently position the casing within the well. Cement slurry, which consists of cement and certain additives, is pumped into the well. The cement slurry displaces the existing mud in the well, and seals the outside of the different casings to the well hole walls.
The well-completion may be of different types. Open-hole completion refers to a well that is drilled to the top of the hydrocarbon reservoir where it is not cased. Open-hole completions are generally used for reservoirs that are well-known and defined. On the other hand, cased-hole completions require the casing to be run into the reservoir. After the cement slurry dries, perforations 18 are created in the sides of the well by a perforation gun. These perforations 18 perforate through the production casing 16 and the cement, and allow the hydrocarbons outside the well hole to enter into the well stream. Tubing 20 may then be used to bring the oil up to the surface. A wellhead and a Christmas tree are generally installed at the surface of the well, and include tubing heads, casing heads, valve controls, et cetera, to provide surface control of the subsurface conditions of the well.
Sometimes, because of a miscalculation, malfunction, unexpected subsurface conditions, et cetera, a blowout occurs. A blowout is the uncontrolled release of crude oil and/or natural gas from an oil well or gas well after pressure control systems have failed. Often, to remedy the situation, a relief well is drilled close to the production well. Drilling a relief well that attempts to penetrate the rather narrow pipe of the blowout well that is buried in sea-bed many thousands of feet below the sea floor is a complex and timely process, which does not have a very high probability of success. The relief well trajectory has to be guided with electromagnetic signals, and the drilling bit for the relief well must be directed until it is running adjacent and parallel to the blowout well in preparation for penetrating the casing of the blowout well. Next, the relief well must inject the blowout well with drilling mud and cement in an attempt to stem the flow of oil and gas under very high pressure. As manifested by recent spills, the development and implementation of plans for such an effort may take many months, and have not always been successful for various reasons, including for example, insufficient density of the drilling mud.

Apparatus and method for plugging blowouts


An integrated safety discharge module for providing a high voltage high current pulse to a load includes a capacitor and a bleed resistor, The capacitor is connected to the bleed resistor by such means as to form a structure which ensures that failure of either the capacitor or the bleed resistor will preclude charging of the capacitor and/or the delivery of energy to the load, The unit may also include a circuit for providing visual indication of a threshold charge on the capacitor.

This invention relates, in general, to the field of high voltage, high energy capacitor discharge devices and, more particularly, to their use with electronic safe and arming devices.
Capacitor discharge devices have been employed in various electronic devices including safe and arm devices, laser firing systems and plasma generators. While the present invention will be described in the environment of a detonator for safe and arm system explosive, it will be understood that the invention is suitable for use in any application in which a high power capacitor discharge device is desired. In electronic safe and arm devices a capacitor is utilized to provide a high energy pulse to a load, e.g. a foil or film detonator. The energy pulse when coupled with a foil detonator, vaporizes the foil to initiate an explosion and one such system is described in U.S. Pat. No. 4,602,565 ('565 patent). In a typical prior art capacitor discharge system, such as in the '565 patent, the capacitor is in a circuit with the foil detonator and a normally open switch, and the capacitor is normally in an uncharged state. When it is desired to arm the system, the capacitor is charged, e.g., to 3000 volts; when it is desired to initiate the explosion, the switch is closed and the capacitor discharges very quickly (in nanoseconds) to vaporize the foil and initiate the explosion. A high resistance bleed resistor connected across the capacitor is used to bleed off the charge on the capacitor in the event that the latter is charged (i.e., armed) but then not discharged into the load if a decision is made not to "fire" a system after it has been "armed". The voltage drops across the bleed resistors is monitored to determine whether the system is armed or safe. Prior art structures for connecting the capacitor and bleed resistor together included conventional devices such as a flexible or rigid printed wire board. A problem with such prior art structures is that occasionally the bleed resistor may become electrically disconnected from the circuit. This problem is particularly serious when such a disconnection occurs while the capacitor is charged. In that structure the voltage drop across the bleed resistor is zero, indicating a safe system when, in fact, the capacitor may be charged and in an armed state. That is a very dangerous situation in that the system appears to be safe, but it is not. Closure of the switch in this situation will lead to the catastrophic result of an unintended firing of the system (explosive charge, bomb, etc.).
Another problem with prior art system is that after a failure in the connection between the bleed resistor and the capacitor, a safe (i.e., uncharged) capacitor can still be charged (i.e., armed), and the system can be fired by closure of the switch. This is a second unsafe and very dangerous condition.


A power module includes a substrate with a power semiconductor device mounted thereon, a case having an interior in which the substrate is disposed, a cooling fin having a surface on which the substrate and the case are placed, and a smoothing capacitor disposed on an opposite surface of the cooling fin from the surface on which the substrate is placed, the smoothing capacitor being electrically connected to the power semiconductor device for smoothing a voltage to be externally supplied to the power semiconductor device.

1. Field of the Invention
The present invention relates to a power module structure and, more particularly, to a power module structure including a smoothing capacitor for smoothing a DC supply voltage to be externally applied to a power semiconductor device such as an IGBT.
2. Description of the Background Art
FIG. 28 is a schematic top plan view of a structure of a background art power module body portion 100. Output terminals 111U, 111V and 111W are arranged along a first side of a top surface of a case frame 106, and a P-terminal 108P and an N-terminal 108N are arranged along a second side of the top surface of the case frame 106 which is parallel to the first side.
FIG. 29 is a cross-sectional view showing a cross-sectional structure taken along the line X100xe2x80x94X100 of FIG. 28. The case frame 106 made of resin is disposed on a base plate 101 made of metal. A case lid 116 made of resin is disposed on the case frame 106. An insulating substrate 102 made of ceramic is soldered, as shown at 103, onto the base plate 101. A plurality of power semiconductor devices 105 such as IGBTs are soldered, as shown at 104, onto the insulating substrate 102. Circuit elements (not shown) such as switching elements are mounted on the top surface of the insulating substrate 102, and a predetermined circuit pattern (not shown) is formed on the top surface of the insulating substrate 102.
A control substrate 114 formed with a control circuit for controlling the power semiconductor devices 105 is disposed within the case frame 106. The control substrate 114 is soldered to first ends of respective interconnection electrodes 112. Second ends of the respective interconnection electrodes 112 are connected through aluminum wires 109 to the power semiconductor devices 105. An anti-noise shield plate 113 is disposed between the control substrate 114 and the insulating substrate 102 within the case frame 106. An interior space of the case frame 106 below the shield plate 113 is filled with a silicone gel 115.
The N-terminal 108N is disposed on the top surface of the case frame 106. The N-terminal 108N is connected to a first end of an N-electrode 107N. A second end of the N-electrode 107N is connected through the aluminum wires 109 to the power semiconductor devices 105. The P-terminal 108P (not shown in FIG. 29) is also disposed on the top surface of the case frame 106. The P-terminal 108P is connected to a first end of a P-electrode 107P. A second end of the P-electrode 107P is connected to the power semiconductor devices 105 through the aluminum wires 109 and the circuit pattern formed on the insulating substrate 102. The output terminal 111V is disposed on the top surface of the case frame 106. The output terminal 111V is connected to a first end of an output electrode 110. A second end of the output electrode 110 is connected through the aluminum wires 109 to the power semiconductor devices 105.
FIG. 30 is a schematic cross-sectional view showing the overall construction of a background power module, as viewed in side elevation. A smoothing capacitor 120 for smoothing a DC supply voltage to be externally applied to the power semiconductor devices 150 is disposed over the power module body portion 100. An N-electrode 121N and a P-electrode 121P (both designated by the reference numeral 121 in FIG. 30) of the smoothing capacitor 120, and the N-terminal 108N and the P-terminal 108P (both designated by the reference numeral 108 in FIG. 30) of the power module body portion 100 are connected to each other through a connecting conductor 124. The connecting conductor 124 has conductor plates 122N and 122P opposed to each other, with an insulation plate 123 there between. The conductor plates 122N, 122P and the N- and P-terminals 108N, 108P are fastened to each other with respective screws 125.
FIG. 31 is a schematic cross-sectional view showing a structure of connections between the smoothing capacitors 120 and the connecting conductor 124, as viewed in top plan. The conductor plate 122N is in contact with the N-electrodes 121N, and the conductor plate 122P is in contact with the P-electrodes 121P. The conductor plate 122N has openings 126 provided partially to avoid contact with the P-electrodes 121P, and the conductor plate 122P has openings 127 provided partially to avoid contact with the N-electrodes 121N.
However, the above-mentioned background art power module requires the connecting conductor 124 including the conductor plates 122N, 122P and the insulation plate 123 for connection between the N- and P-electrodes 121N, 121P of the smoothing capacitors 120 and the N- and P-terminals 108N, 108P of the power module body portion 100. This presents problems in the large number of parts and in complicated assembly.
Another problem is an increased circuit inductance because of a long wiring path between the smoothing capacitors 120 and the power semiconductor devices 105. In the operation of the power module, the high-speed switching of the power semiconductor devices 105 causes a large pulse-shaped current proportional to the amount of current change (di/dt) to flow between the smoothing capacitors 120 and the power semiconductor devices 105, thereby to develop a voltage proportional to the circuit inductance, which in turn is applied as noise to the power semiconductor devices 105. Further, the increase in circuit inductance requires the increase in electrostatic capacitance of the smoothing capacitors 120 for suppression of ripple voltage. This results in the increase in the size of the smoothing capacitors 120 and accordingly the increase in the size of the power module itself. Therefore, the circuit inductance is preferably low.
Furthermore, the background art power module which comprises the large-sized smoothing capacitors 120 disposed over the power module body portion 100 is too low in resistance to vibration for use as a vehicle-mounted power module, for example.
According to a first aspect of the present invention, a power module comprises: a substrate with a power semiconductor device mounted thereon; a case having an interior in which the substrate is disposed; an N-terminal and a P-terminal arranged along a first side of a main surface of the case and electrically connected to the power semiconductor device; and a smoothing capacitor having a first electrode connected to the N-terminal and a second electrode connected to the P-terminal for smoothing a voltage to be externally supplied to the power semiconductor device, wherein the smoothing capacitor has a main surface level with the main surface of the case, and is disposed in contact with a side surface of the case including the first side of the main surface of the case, and wherein the first electrode and the second electrode are disposed on the main surface of the smoothing capacitor and in proximity to the N-terminal and the P-terminal, respectively.
Preferably, according to a second aspect of the present invention, in the power module of the first aspect, the smoothing capacitor comprises: an enclosure; a plurality of capacitor elements disposed in the enclosure, each of the plurality of capacitor elements having a first electrode abutting against the first electrode of the smoothing capacitor and a second electrode abutting against the second electrode of the smoothing capacitor; and a hold-down plate for pressing the plurality of capacitor elements against the enclosure to fix the plurality of capacitor elements in the enclosure.
Preferably, according to a third aspect of the present invention, in the power module of the second aspect, the enclosure has a single heat sink for dissipating heat generated by the plurality of capacitor elements.
Preferably, according to a fourth aspect of the present invention, in the power module of the second or third aspect, at least one of the first and second electrodes of the smoothing capacitor has elasticity.
According to a fifth aspect of the present invention, a power module comprises: a substrate with a power semiconductor device mounted thereon; a case having an interior in which the substrate is disposed, the case including a predetermined recess in an outer surface thereof; an N-terminal and a P-terminal disposed on side walls of the recess and electrically connected to the power semiconductor device; and a smoothing capacitor fitted in the recess and having a first electrode positioned to correspond to the N-terminal and a second electrode positioned to correspond to the P-terminal for smoothing a voltage to be externally supplied to the power semiconductor device.
Preferably, according to a sixth aspect of the present invention, in the power module of the fifth aspect, there is provided at least one of a first electrically conductive elastic member between the first electrode and the N-terminal and a second electrically conductive elastic member between the second electrode and the P-terminal.
According to a seventh aspect of the present invention, a power module comprises: a first substrate with a power semiconductor device mounted thereon; a second substrate with a control circuit for controlling the power semiconductor device formed thereon; a smoothing capacitor electrically connected to the power semiconductor device for smoothing a voltage to be externally supplied to the power semiconductor device; and a case including a case frame and a case lid, the case having an interior in which the first substrate, the second substrate and the smoothing capacitor are disposed.
Preferably, according to an eighth aspect of the present invention, in the power module of the seventh aspect, the smoothing capacitor is disposed on the case lid.
Preferably, according to a ninth aspect of the present invention, the power module of the seventh aspect further comprises a shield plate disposed between the first substrate and the second substrate and fixed to the case frame, wherein the smoothing capacitor is disposed on the shield plate.
Preferably, according to a tenth aspect of the present invention, the power module of the ninth aspect further comprises a thermally conductive sheet formed between the shield plate and the smoothing capacitor.
Preferably, according to an eleventh aspect of the present invention, in the power module of the ninth aspect, the shield plate is a metal shield plate.
Preferably, according to a twelfth aspect of the present invention, in the power module of the seventh aspect, the smoothing capacitor is disposed on the first substrate.
Preferably, according to a thirteenth aspect of the present invention, in the power module of the twelfth aspect, the first substrate and the smoothing capacitor are made of the same material.
Preferably, according to a fourteenth aspect of the present invention, the power module of the seventh aspect further comprises a heat sink for dissipating heat generated from the first substrate, the first substrate and the case frame being placed on the heat sink, wherein the smoothing capacitor is disposed on the heat sink.
According to a fifteenth aspect of the present invention, a power module comprises: a substrate with a power semiconductor device mounted thereon; a case having an interior in which the substrate is disposed; a cooling fin having a surface on which the substrate and the case are placed; and a smoothing capacitor disposed on an opposite surface of the cooling fin from the surface on which the substrate is placed, the smoothing capacitor being electrically connected to the power semiconductor device for smoothing a voltage to be externally supplied to the power semiconductor device.
Preferably, according to a sixteenth aspect of the present invention, in the power module of any one of the first to fifteenth aspects, the smoothing capacitor is a ceramic capacitor.
The power module according to the first aspect of the present invention can shorten the wiring path between the smoothing capacitor and the power semiconductor device to reduce a circuit inductance. The contacting relationship between a side surface of the smoothing capacitor and the side surface of the case increases resistance to vibration.
In the power module according to the second aspect of the present invention, the hold-down plate collectively fixes the plurality of capacitor elements in the enclosure. This facilitates the step of mounting the plurality of capacitor elements.
The power module according to the third aspect of the present invention enhances the uniformity of the effect of cooling the plurality of capacitor elements.
The power module according to the fourth aspect of the present invention can prevent breakage of the capacitor elements resulting from the pressing force of the hold-down plate or the thermal stress associated with heat generated by the capacitor elements. Additionally, the power module according to the fourth aspect of the present invention can ensure the contact between the first electrode of the smoothing capacitor and the first electrodes of the respective capacitor elements and between the second electrode of the smoothing capacitor and the second electrodes of the respective capacitor elements.
The power module according to the fifth aspect of the present invention can shorten the wiring path between the smoothing capacitor and the power semiconductor device to reduce the circuit inductance. The provision of the smoothing capacitor fitted in the recess of the case reduces the size of the power module.
The power module according to the sixth aspect of the present invention can prevent breakage of the smoothing capacitor resulting from the pressing force exerted when the smoothing capacitor is inserted into the recess or the thermal stress associated with the heat generated by the smoothing capacitor. Additionally, the power module according to the sixth aspect of the present invention can ensure the contact between the N-terminal and the first electrode of the smoothing capacitor and between the P-terminal and the second electrode of the smoothing capacitor.
The power module according to the seventh aspect of the present invention can improve environmental resistance since the smoothing capacitor is isolated from an environment external to the case.
The power module according to the eighth aspect of the present invention can dissipate the heat generated by the smoothing capacitor through the case lid to the outside.
The power module according to the ninth aspect of the present invention has a shorter wiring path between the smoothing capacitor and the power semiconductor device than that of the power module according to the eighth aspect, to further reduce the circuit inductance.
The power module according to the tenth aspect of the present invention can effectively dissipate the heat generated by the smoothing capacitor through the thermally conductive sheet and the case frame to the outside, and alleviate the stress associated with the heat generated by the smoothing capacitor.
The power module according to the eleventh aspect of the present invention can effectively dissipate the heat generated by the smoothing capacitor through the shield plate and the case frame to the outside.
The power module according to the twelfth aspect of the present invention can significantly shorten the wiring path between the smoothing capacitor and the power semiconductor device to greatly reduce the circuit inductance.
The power module according to the thirteenth aspect of the present invention can make the smoothing capacitor and the insulating substrate equal in thermal expansion coefficient, to avoid various disadvantages resulting from the difference in thermal expansion coefficient, thereby enhancing the reliability of the power module.
The power module according to the fourteenth aspect of the present invention can effectively dissipate the heat generated by the smoothing capacitor through the heat sink to the outside.
In the power module according to the fifteenth aspect of the present invention, the cooling fin can effectively cool down the smoothing capacitor to enhance the reliability of the power module.
In the power module according to the sixteenth aspect of the present invention, the use of the ceramic capacitor having good charging and discharging properties increases the operating speed of the power module.
It is therefore an object of the present invention to provide a power module which can reduce a circuit inductance and which is small in size, light in weight and high in resistance to vibration.
These and other objects, features, aspects and advantages of the present invention will become more apparent from the following detailed description of the present invention when taken in conjunction with the accompanying drawings.

Ryoden Semiconductor System Engineering Corporation


A hitch assembly is mounted on a frame of an agricultural tractor. The hitch assembly includes a pair of draft links pivotally mounted on the frame, a drawbar support fixed to the frame between the draft links, and a pair of sway blocks fixed to opposite sides of the frame. Each sway block has an upper end fixed to a side of the frame and extends generally downwardly to a lower free end. The lower free end of each sway block is positioned below a plane defined by a bottom surface of the drawbar support. Each sway block is preferably tapered from a wider front side to a narrower rear side to form an inner surface which faces inwardly and rearwardly. A wedge plate is mounted beneath the drawbar support. The plate extends generally laterally from a left end surface to a right end surface, and each end surface is slanted in order to matingly engage the inner surface of a corresponding one of the sway blocks. The wedge plate is longer than the drawbar support, and projects laterally out from the left and right ends of the drawbar support. As a result, the wedge plate end surfaces engage the inner surfaces of the corresponding inner sway blocks and supports them against side forces applied by the draft links.

The present invention relates to a hitch assembly for an agricultural tractor.
Current production agricultural tractors have implement hitches which have pivotal draft links for coupling to an implement or to a quick coupler. Such draft links are subject to side loads and will swing laterally when the tractor turns while an attached implement is still in the ground. U.S. Pat. No. 4,216,975, issued Aug. 12 1980 describes a tractor hitch assembly with left and right sway links which can be positioned to lock or to permit lateral sway of the draft links. It is also known to use frame-mounted sway blocks to limit lateral motion of the hitch draft links. It is also known to taper conventional sway blocks in the vertical direction to permit maximum sway when the hitch is lowered and to permit no sway when the hitch is in a raised transport position. However, as the tires used on agricultural tractors become larger, the draft links have to be lower relative to the frame of the tractor to maintain the required height off of the ground. If, to limit lateral motion of the hitch, the sway blocks are extended down below the tractor frame, hitch side loads can then damage the unsupported lower portion of such sway blocks. It would be desirable to have a hitch assembly for such tractors with large tires wherein the sway blocks are protected from damage by side forces on the hitch links.
Accordingly, an object of this invention is to provide a hitch assembly for tractors with large tires.
A further object of the invention is to provide such a hitch assembly sway blocks which will limit and not be damaged by lateral motion of the hitch.
These and other objects are achieved by the present invention, wherein a hitch assembly is mounted on a frame of an agricultural tractor. The hitch assembly includes a pair of draft links pivotally mounted on the frame, a drawbar support fixed to the frame between the draft links, and a pair of sway blocks fixed to opposite sides of the frame. Each sway block has an upper end fixed to a side of the frame and extends generally downwardly to a lower free end. The lower free end of each sway block is positioned below a plane defined by a bottom surface of the drawbar support. Each sway block is preferably tapered from a wider front side to a narrower rear side to form an inner surface which faces inwardly and rearwardly. A wedge plate is mounted beneath the drawbar support. The plate extends generally laterally from a left end surface to a right end surface, and each end surface is slanted in order to matingly engage the inner surface of a corresponding one of the sway blocks. The wedge plate is longer than the drawbar support, and projects laterally out from the left and right ends of the drawbar support. As a result, the wedge plate end surfaces engage the inner surfaces of the corresponding inner sway blocks and supports them against side forces applied by the draft links.


A novel enhancer, known as the K3'-enhancer, has been identified in the mouse immunoglobulin K locus, downstream of C.sub.K. The K3'-enhancer is B cell specific, is some sevenfold stronger than the K-intron enhancer and the region of the enhancer shows striking sequence homologies to the lymphotopic papovavirus, IgH and K-intron enhancers. The novel enhancer allows high level expression both in transfected cell lines and in transgenic mice, and may thus be used to enhance expression of genes in host cells, in vivo and in vitro. The novel enhancer is also found to increase somatic mutation of antibody genes in transgenic mice. The novel enhancer can also be use in gene therapy. Functionally equivalent enhancers are to be expected to occur downstream of C.sub.K of the immunoglobulin K locus of other species.

Enhancers are DNA sequences which play an important role in the transcription of proteins. A number of different enhancer sequences have been identified from different sources, including enhancers of vital origin, e.g. from the SV40 virus, and of cellular origin. As regards the immunoglobulin (Ig) genes, enhancer elements have been identified in the major introns of both the heavy chain (IgH) (Banerji et al., 1983; Gillies et al., 1983; Neuberger, 1983) and kappa (identified herein as "K") light chain (Picard and Schaffner, 1984; Queen and Stafford, 1984) loci.
The present invention is based on the identification of a novel enhancer in the mouse immunoglobulin K locus, downstream of C.sub.K, in addition to the K-intron enhancer. Functionally equivalent enhancers are to be expected to occur downstrem of C.sub.K of the immunoglobin K locus of other species.


A shield that protects high-value input resistors in a power meter against unwanted effects due to electromagnetic interference from a nearby power supply and/or due to crosstalk from adjacent phases. The shield includes multiple printed circuit board shields that are arranged between each of the input resistors on a main printed circuit board in the power meter. Each PCB shield has a conductive layer that provides the shielding against unwanted energy. The resistors are arranged in a diagonal or parallel manner between each pair of PCB shields to prevent the resistor from movement, which prevents pin fatigue and fixes the value of the parasitic capacitance that is produced in the resistor-PCB-shield combination. In another configuration, the PCB shield is made of a flexible material, and snakes between and over the top or around the side ends of each resistor in a serpentine fashion, protecting the resistors from unwanted energies from both the top and the sides. The PCB shields disclosed herein eliminate variations in the percent error of the measurement phases, which contributes to achieving a highly accurate meter with an overall accuracy of less than 0.1%.

In a compact power meter, the power supply components include large capacitors, transformers, and other electronic components for converting the high-power inputs to the power meter into smaller voltages sufficient to power the sensitive electronics within the power meter. These power supply components can generate a significant amount of interference in the form of electromagnetic energy. This electromagnetic interference or EMI can adversely affect the performance of other circuits located near the power supply. Moreover, in power meters that receive multiple phases of voltage or current, the inputs are typically located right next to each other and are susceptible to crosstalk interference, where current flowing through one conductor carrying one phase of electricity can create electric and/or magnetic fields that interfere with signals passing through an adjacent conductor carrying a different phase. The overall effect of EMI interference and crosstalk interference is a degradation in the quality of the signals that are converted into corresponding digital values, resulting in a less accurate power meter. The more these original signals are degraded by interference, the less accurate the meter readings will be. The overall accuracy of a meter is expressed in terms of percent error, which is the minimum acceptable deviation by a measured voltage from the original voltage. Existing meters are typically designed to meet or exceed a percent error of 0.2% or less, but there is a need for a meter having a percent error of 0.1% or less. Aspects of the present disclosure are intended to satisfy this and other needs.

Resistor shield to minimize crosstalk and power supply interference


A system for transferring heat from an electrical enclosure is provided. An electrical enclosure defines a housing area in which one or more electrical devices are housed. A heat pump extends through the electrical enclosure, the heat pump defining a channel configured to communicate fluid for transferring heat from the one or more electrical devices. The electrical enclosure is substantially sealed from the heat pump channel and from other areas outside the electrical enclosure.

Electrical devices, e.g., conductors, combiners, switches, controllers, fuses, fuse holders, power distribution blocks, and terminal blocks, generate heat that must be dissipated to regulate the temperature of such devices and surrounding components or structures. Electrical devices may be housed in various types of housings or enclosures. Some electrical device housings have at least one open face, or significant openings for allowing heat to be removed from the electrical devices by air flow through the housings and across the surfaces of the electrical devices. Other electrical device housings are significantly enclosed, and in some cases sealed from the surrounding environment. For example, electrical components of a high voltage, high current (DC current) solar power system may be housed in a sealed enclosure, e.g., an enclosure with a NEMA 4× rating, to provide water resistance or waterproofing. Removing heat from such enclosures is relatively difficult, as they do not include openings for permitting air flow over the heat-producing components.

Mechanical heat pump for an electrical housing


A semiconductor device includes first and second electrodes. A first-type layer is between the first and second electrodes. A pair of first gate electrodes is between the first and second electrodes and each is surrounded by a gate insulating film. Second gate electrodes are disposed between the pair of first gate electrodes. A second-type layer is on the first-type layer in a first region between a first gate electrode and one of the second gate electrodes. Another first-type layer is on the second-type layer. This other first-type layer is directly adjacent to the gate insulating film. Another second-type layer is on the other second-type layer. A width of the first-type layer between adjacent second gate electrodes is less than a length of the first-type layer in the region between adjacent second gate electrodes.

Insulated gate bipolar transistors (IGBTs) are widely used as power semiconductor devices that control a large current and have a high breakdown voltage. The IGBT is generally used as a switching element. In an IGBT being used as a power semiconductor device, it is desirable that switching loss is small.

Semiconductor device and semiconductor module

TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION


A firefighter's helmet having improved heat resistance and protective qualities while being also relatively light in weight having a protective outer shell composed of at least one layer of a fabric of a mixture of polybenzimidazole and high modulus aramid materials and a complementary layer of a very fine glass cloth adjacent at least one side of the polybenzimidazole-aramid layer, impregnated with and molded in a desired shape within a polyester resin material containing a small percentage of a coupling agent. The outer shell may also consist of additional layers of fibrous reinforcing materials molded within the resin material.

One of the major problems encountered by a firefighter is stress. One of the major causes of stress in a firefighter pertains to the weight of the garments worn by the firefighter. One of the garments worn by a firefighter is a helmet.
Conventionally, a firefighter's helmet comprises a rigid outer layer or shell which covers a resilient, deformable intermediate layer surrounding an inner molded plastic impact cap. The principal purpose of the shell is to provide strength and resistance to impact and resistance to penetrating forces and objects, while that of the intermediate layer is to absorb shock.
To achieve the desired strength and impact resistance qualities, the shell of the firefighter's helmet is conventionally made of a composite, fiber-reinforced plastics material, such as a glass fiber reinforced polyester resin. Fiber materials are positioned within molded polyester resin materials. The fiber materials may be in the form of glass type single fibers mixed into the resin or a mat of glass fibers impregnated with resin and/or woven glass cloth impregnated with resin. The shell may have only one type of reinforcement materials or a combinaton of two or more types of reinforcement materials.
The strength and impact resistant qualities of the shell are directly related to the reinforcement materials within the resin of the shell. The resin, which is the heaviest material in the shell, provides no strength or impact or penetration qualities to the shell. Such qualities relate only to fiber material within the resin material.
It is equally important, however, that the shell be able to withstand and retard the transmission of heat, not only for the maintenance of its own integrity in highly heated environments but also for the protection of the intermediate layer which is conventionally composed of a urethane foam material. If the shell does not resist the heat properly, the heat will penetrate the shell and cause partial disintegration of the urethane foam of the intermediate layer. When this occurs the helmet loses its shock absorbing capability.
The mass created by the polyester resin has a definite effect in this critical area. That is, the less mass in the polyester resin, the greater the heat penetration through the helmet and thus the less effective heat protection in the helmet.
A problem exists in regard to reducing the weight of a firefighter's helmet by reducing the mass of the polyester resin, without reducing the heat resistant qualities of the outer shell.
It is therefore an object of this invention to provide a firefighter's helmet which has minimum weight while also providing good thermal protection.
It is another object of this invention to provide such a firefighter's helmet which has excellent impact resistant and shock absorbing qualities under both high heat and low heat conditions.
Other objects and advantages of this invention reside in the construction of parts, the combination thereof, the method of production and the mode of use, as will become more apparent from the following description.


A sound processing apparatus includes a sound input unit configured to input a sound signal, a signal processor having a band-limiting filter for limiting a passing band of the sound signal, and being configured to apply a predetermined signal processing on a sound signal output from the band-limiting filter, and a controller configured to control a band width of the passing band of the band-limiting filter. The controller changes the band width of the passing band according to a level of the sound signal, and makes a speed at the time of expanding the band width faster than a speed at the time of narrowing the band width.

1. Technical Field
The technical field relates to an audio processing apparatus for processing an input sound, a sound pickup apparatus and an imaging apparatus having the audio processing apparatus.
2. Related Art
In recent years, a digital camera that can record not only a still image but also a moving image is spreading. At the time of recording a moving image, a sound as well as an image should be recorded, and thus a microphone for collecting sounds is provided to such a digital camera. A digital camera tends to be miniaturized, which causes a microphone for collecting sounds to be also miniaturized. The miniaturization of the microphone deteriorates sensitivity of the microphone, thereby reducing an S/N ratio.
A sound processing apparatus for executing various filter processes in order to improve a S/N ratio with respect to a sound signal is generally known. For example, JP04-119708A discloses a configuration which increases attenuation in a low frequency region when an input signal is small, and decreases attenuation in a low frequency region when the input signal is large, to result in a flat frequency characteristic. According to the audio processing apparatus described in JP04-119708A, a gain in a frequency region determined by a characteristic of a filter circuit changes according to a change in an input signal even at a signal level of which temporal variation is great, so that noises can be repressed without causing a time delay.
In a technique of JP04-119708A, a passing band characteristic of a filter is changed according to an input signal level. However, a user occasionally feels a sense of discomfort in audibility depending on a way of changing a passing band characteristic.
To solve the above problem, an audio processing apparatus is provided that can reduce a user's sense of discomfort in audibility and can simultaneously improve an S/N ratio of an input sound signal, and a sound pickup apparatus and an imaging apparatus having the voice processing apparatus are also provided.

Audio processing apparatus, sound pickup apparatus and imaging apparatus


The present invention provides a large transport ship in which the shape of a ship bottom 1a from a bow 1h to a stern 1t, when viewed on a cross-section perpendicular to the longitudinal direction of the ship bottom 1a, is tapered towards the center CL of the ship bottom in the widthwise direction. Consequently, it is possible to resolve problems associated with changes in the draft corresponding to the state of the load, without using ballast water.

1. Field of the Invention
The present invention relates to a large transport ship such as a tanker, and relates particularly to a large transport ship which does not require ballast.
2. Description of the Background Art
In conventional large transport ships such as tankers, bulk carriers, container ships, LNG carriers and car carriers, a construction is used wherein ballast is loaded onto the ship in order to prevent problems associated with a shallow draft in the case of an empty load, and in order to control the center of gravity.
In other words, if the draft is shallow, problems occur in that; (1) the degree of hogging during navigation is large, and the shearing force and longitudinal bending moment applied to the hull are also large, (2) during navigation, the ship is exposed to the impact of waves striking the ship bottom (so called xe2x80x9cslammingxe2x80x9d), (3) the propeller cannot be immersed fully, and emerges from the water, which causes a decrease in the propulsion performance, and an increase in the load fluctuation on the propeller and the main engine (causing so called xe2x80x9cpropeller racingxe2x80x9d), and (4) the rudder cannot be submerged sufficiently, causing maneuverability to worsen. In order to resolve these problems, ballast is loaded onto the ship to lower the draft.
Moreover, in this type of large transport ship, in order to ensure a large freight capacity and reduce construction costs, it is standard for the ship bottom to be a flat planar shape.
Furthermore, in a ship hull for which the center of gravity tends to be high, because it is necessary to lower the center of gravity to improve the stabilizing capabilities of the hull, the center of gravity is adjusted by loading ballast into the ship bottom, and conversely, in a ship hull for which the center of gravity tends to be too low in an unloaded state, the center of gravity is adjusted by loading ballast at a high position, to raise the center of gravity of the ship. Furthermore, if the ship heels during loading, it is possible to control the balance of the ship by temporarily loading ballast as a counterweight.
As described above, by loading ballast it is possible to both resolve the above problems associated with a shallow draft, and also appropriately control the center of gravity
However, the conventional large transport ships described above suffer from the problems described below.
Namely, in general sea water is used as the ballast, but if the large transport ship takes on this sea water in a loading area, travels to another area of sea, and then dumps the sea water ballast into the sea so that cargo can be loaded at this other site, it is possible that marine species from the sea area in which the ballast was loaded can enter the sea at the other area, potentially changing the ecosystem. Ideas such as replacing the ballast while on the open sea, or sterilizing the ballast water before dumping, have been proposed as solutions to this problem, but these measures are insufficient to resolve this problem completely.
Furthermore, the amount of ballast water depends on the type of ship, but is generally approximately 30% of the displacement of the ship, meaning that the ship carries an unnecessary and unpaid load when in an unloaded state. Consequently, fuel is wasted, which is also a problem from the viewpoint of energy conservation.
In consideration of the above circumstances, an object of the present invention is to provide a large transport ship which can resolve the problems associated with changes in the draft corresponding to the state of the load, without using ballast water.
A large transport ship according to a first aspect of the present invention comprises a bow, a stern, and a ship bottom, and the shape of the ship bottom from the bow to the stern, when viewed on a cross-section perpendicular to a longitudinal direction of the ship bottom, is tapered towards a center of the ship bottom in a widthwise direction thereof
According to the large transport ship of this first aspect, by using a tapered shape for the shape of the ship bottom, the ship can be submerged deeper than a conventional ship with a flat bottom, by an amount equivalent to the reduction in volume achieved by cutting away the edges of the flat bottom.
Consequently, the variety of problems which occur when the draft is shallow (including the increase in the shearing force and longitudinal bending moment applied to the ship due to hogging, slamming, propeller racing, and poor maneuverability and the like) can be avoided.
Furthermore, according to this construction in which the shape of the ship bottom is a tapered shape, because the draft can be deepened without using the conventional ballast water, concern about the effects on an ecosystem of the dumping of ballast water can be eliminated.
In a similar manner, because it is possible to navigate in an unloaded state without loading ballast water, excess fuel is not consumed, which contributes to the move towards more energy efficient transport.
The ship bottom, when viewed in the cross section, may be a V shape formed from straight lines which extend from the center to both edges thereof
In this case, because the main section of the ship bottom is formed from two simple planar inclined faces, the construction of the ship bottom is simpler than the case in which the ship bottom is a curved surface.
Either one of a parallel section and a center section of the ship bottom, when viewed in the cross section, may display an angle between inclined faces on each side of the center within a range from 60xc2x0 to 170xc2x0.
Problems may occur if the angle between the two inclined faces on each side of the center exceeds 170xc2x0, as the draft cannot be deepened sufficiently, or if the angle is smaller than 60xc2x0, as the required displacement cannot be ensured. Consequently, an angle within the range from 60xc2x0 to 170xc2x0 is preferable.
A large transport ship according to a second aspect of the present invention comprises a bow, a stern, and a ship bottom, wherein a displacement volume from a center position in a longitudinal direction to the stern is greater than a displacement volume from the center position to the bow.
According to the large transport ship of this second aspect, the front half of the ship, from the center in a longitudinal direction to the bow, can be submerged more deeply than with conventional hulls. Consequently, it is possible to avoid the problems which occur when the draft of the front half of the ship including the bow is shallow (such as the problem of an increase in the shearing force and longitudinal bending moment applied to the ship due to hogging, and the problem of slamming). In addition, in this construction, because the draft can be deepened without using the conventional ballast water, concern about the effects on an ecosystem of the dumping of ballast water can be eliminated. In a similar manner, because it is possible to navigate in an unloaded state without loading ballast water, excess fuel is not consumed, which contributes to the move towards more energy efficient transport.
Furthermore, by ensuring that the displacement of the rear half of the ship from the center in the longitudinal direction to the stern is greater than that of the front half, it is possible to ensure approximately the same total displacement as a conventional ship.
In the first aspect, the large transport ship, a displacement volume from a center position in a longitudinal direction to the stern may be greater than a displacement volume from the center position to the bow.
In this case, the front half of the ship, from the center in a longitudinal direction to the bow, can be submerged more deeply than with conventional hulls. Consequently, it is possible to avoid the problems which occur when the draft of the front half of the ship including the bow is shallow (such as the problem of an increase in the shearing force and longitudinal bending moment applied to the ship due to hogging, and the problem of slamming). In addition, in this construction, because the draft can be deepened without using the conventional ballast water, concern about the effects on an ecosystem of the dumping of ballast water can be eliminated. In a similar manner, because it is possible to navigate in an unloaded state without loading ballast water, excess fuel is not consumed, which contributes to the move towards more energy efficient transport.
Furthermore, by ensuring that the displacement of the rear half of the ship from the center in the longitudinal direction to the stern is greater than that of the front half, it is possible to ensure approximately the same total displacement as a conventional ship.
A large transport ship according to a third aspect of the present invention comprises a bow, a stern, and a ship bottom, and the stern comprises a propulsion mechanism and an elevator which raises and lowers the propulsion mechanism in a vertical direction.
According to the large transport ship of this third aspect, when the draft is comparatively shallow when the ship is in an unloaded state, by lowering the propulsion mechanism, it is possible to fully submerge the propulsion mechanism, and thereby avoid the problem of propeller racing with greater certainty. Conversely, when the draft is comparatively deep when the ship is fully loaded, by raising the propulsion mechanism, the propulsion mechanism can be moved away from the sea floor sufficiently to allow navigation in shallow water. Furthermore, an added benefit of moving the propeller away from the hull by lowering the propulsion mechanism is that the effects of vibration on the hull caused by the propeller can be reduced.
In the first or second aspect, the stern may comprise a propulsion mechanism and an elevator which raises and lowers the propulsion mechanism in a vertical direction.
In this case, in the same manner as the third aspect, when the draft is comparatively shallow when the ship is in an unloaded state, by lowering the propulsion mechanism, it is possible to fully submerge the propulsion mechanism, and thereby avoid the problem of propeller racing with greater certainty. Conversely, when the draft is comparatively deep when the ship is fully loaded, by raising the propulsion mechanism, the propulsion mechanism can be moved away from the sea floor sufficiently to allow navigation in shallow water. Furthermore, an added benefit of moving the propeller away from the hull by lowering the propulsion mechanism is that the effects of vibration on the hull caused by the propeller can be reduced.
A large transport ship according to a fourth aspect of the present invention, either one of a ship bottom, and a ship bottom together with lower side sections of the ship, comprises a buoyancy generator which can be filled with gas.
According to the large transport ship of the fourth aspect, when the ship is in a fully loaded state, it is possible to ensure sufficient buoyancy by filling the buoyancy generator with gas, and furthermore, when the ship is in an unloaded state, by employing a construction in which sea water can flow freely through the buoyancy generator without stagnating, the buoyancy can be decreased and the draft further deepened, and furthermore, marine species are not transported to other sea areas. Consequently, it is possible to control the draft with a greater degree of flexibility according to the state of the load, for example whether the ship is fully loaded or empty, while also preventing the transportation of marine species.
In the large transport ship according to the first, second, or third aspect, either one of the ship bottom, and the ship bottom together with lower side sections of the ship, comprise a buoyancy generator which can be filled with gas.
In this case, in the same manner as the fourth aspect, when the ship is in a fully loaded state, it is possible to ensure sufficient buoyancy by filling the buoyancy generator with gas, and furthermore, when the ship is in an unloaded state, by employing a construction in which sea water can flow freely through the buoyancy generator without stagnating, the buoyancy can be decreased and the draft further deepened, and moreover, marine species are not transported to other sea areas. Consequently, it is possible to control the water level with a greater degree of flexibility according to the state of the load, for example whether the ship is fully loaded or empty, while also preventing the transportation of marine species.


An optical element includes a crystal of LiTa.sub.X Nb.sub.1-X O.sub.3 which has one of an x-surface and a y-surface, where X denotes an atomic fraction and 0.ltoreq.X.ltoreq.1. Proton-exchanged layers periodically extend on one of the x-surface and the y-surface of the crystal. Grooves extend in said one of the x-surface and the y-surface of the crystal, and have bottoms which are defined by surfaces of the proton-exchanged layers. Ordinary light which has passed through the proton-exchanged layers and the grooves is out of phase with respect to ordinary light which has passed through a region of the crystal outside the proton-exchanged layers and the grooves by a quantity of (2n+1).pi., where n denotes an arbitrary integer. Extraordinary light which has passed through the proton-exchanged layers and the grooves is out of phase with respect to extraordinary light which has passed through a region of the crystal outside the proton-exchanged layers and the grooves by a quantity of 2 m.pi., where m denotes an arbitrary integer.

1. Field of the Invention
This invention relates to an optical element such as a polarization separating element or a polarization anisotropic hologram element. This invention also relates to a method of fabricating an optical element. This invention further relates to an optical information processing apparatus.
2. Description of the Prior Art
Japanese published unexamined patent application 63-314502 discloses a polarization separating element usable in an optical communication system. The polarization separating element of Japanese patent application 63-314502 includes a substrate of lithium niobate, proton-exchanged layers, and dielectric films. The proton-exchanged layers are periodically formed on a surface of the substrate at intervals. The dielectric films are formed on and aligned with the proton-exchanged layers respectively. In the polarization separating element of Japanese patent application 63-314502, lithium-niobate substrate portions covered with the proton-exchanged layers and the dielectric films alternate with lithium-niobate substrate portions uncovered therefrom. In the following description, the substrate portions covered with the proton-exchanged layers and the dielectric films will also be referred to as the covered substrate portions, while the substrate portions uncovered therefrom will also be referred to as the uncovered substrate portions.
The relation or ratio in refractive index between the lithium-niobate substrate and the proton-exchanged layer varies in accordance with which of an ordinary ray of light and an extraordinary ray of light is applied thereto.
The polarization separating element of Japanese patent application 63-314502 operates as follows. In the case of an extraordinary ray of light, the part of the light which has passed through the covered substrate portions is delayed in phase relative to the part of the light which has passed through the uncovered substrate portions. The phase delay is caused by the difference in refractive index between the dielectric film and air, and the difference in refractive index between the proton-exchanged layer and the lithium niobate substrate. As a result of the phase delay, the extraordinary ray is diffracted by the polarization separating element. In the case of an ordinary ray of light, the dielectric films compensate for a phase difference which might be caused between the part of the light which passes through the covered substrate portions and the part of the light which passes through the uncovered substrate portions. Specifically, the difference in refractive index between the dielectric film and air, and the difference in refractive index between the proton-exchanged layer and the lithium-niobate substrate cancel the phase difference. Thus, the ordinary ray is un-diffracted by the polarization separating element.
During the fabrication of the polarization separating element of Japanese patent application 63-314502, the formation of the dielectric films and the alignment between the dielectric films and the proton-exchanged layers necessitate troublesome and laborious steps.

Optical element and method of fabricating the same

Matsushita Electric Industrial Co., Ltd.


A mechanism is provided for temporarily allocating dedicated processors to a shared processor pool. A virtual machine monitor determines whether a temporary allocation associated with an identified dedicated processor is long-term or short-term. Responsive to the temporary allocation being long-term, the virtual machine monitor determines whether an operating frequency of the identified dedicated processor is within a predetermined threshold of an operating frequency of one or more operating systems utilizing the shared processor pool. Responsive to the operating frequency of the identified dedicated processor failing to be within the predetermined threshold, the virtual machine monitor either increases or decreases the frequency of the identified dedicated processor to be within the predetermined threshold of the operating frequency of the one or more operating systems utilizing the shared processor pool and temporarily allocates the identified dedicated processor to the shared processor pool.

The present application relates generally to an improved data processing apparatus and method and more specifically to mechanisms for preserving dedicated temporary allocation virtualization functions in a power management environment.
There is an emerging customer requirement for better power and thermal management in server systems. Customers increasingly expect systems to behave in such a way as to be power-efficient. Customers also want the ability to set policies that trade off power and performance in order to meet their particular objectives. For example, customers want to be able to over-provision their installations relative to the nominal maximum power and temperature values of the systems that they install but be able to take advantage of the variability in workloads and utilization to ensure that the systems operate correctly and within the limits of the available power and cooling.
IBM®'s EnergyScale™ controls the power and temperature of running systems in a performance-aware manner under the direction of a set of policies and objectives specified through EnergyScale™'s user interfaces. To do so, EnergyScale™ implements detailed, periodic measurement of processor core power and temperature, measurement of the power consumed by the entire system board as well as any plugged-in processor cards and measurement of the memory power and temperature to the system. EnergyScale™ uses the results of these measurements to adjust the system's operation and configuration to meet specified objectives for power, temperature, and performance by using closed-loop feedback control operating in real time.
One of the tools used by EnergyScale™ to control power is to adjust the frequency and voltage of the processor chips and cores in the system to control the power dissipation as a function of the user specified energy scale policy. Early EnergyScale™ designs required that the voltage and frequency of all central processing units (CPUs) in the system maintained at the same value. As the EnergyScale™ design and implementation became more sophisticated, it became possible to have cores in a system running at different frequencies and voltages and allowed the implementation of more sophisticated power savings algorithms.
However, many multi-threaded applications are written assuming that all CPUs that the application runs on are running at the same frequencies and such applications may not function properly when running on processors at different frequencies. To avoid such application problems, one possible design is to run the processors of a logical partition at the same frequency. This design also requires that all processors in the shared pool run at the same frequency, because it is not possible with currently known technologies to monitor the work and change frequencies at the rate at which micro-partitions are dispatched.

Preserving a dedicated temporary allocation virtualization function in a power management environment


According to the embodiment, an automatic document feeder includes a first transport unit which transports a document fed from a document tray to a reading portion in a first direction after turning over the document, and a second transport unit which transports the document fed from the document tray to the reading portion in a second direction and transports the document passed through the reading portion to the reading portion in the first direction after turning over the document. When an image on one side of the document is read, the document is sorted to be transported to the first transport unit, and when images on both sides of the document are read, the document is sorted to be transported to the second transport unit.

Conventionally, an image forming apparatus such as an MFP includes a scanner unit and a printer unit. The scanner unit reads a document, and image data read by the scanner unit is processed so as to be printed by the printer unit.
In addition, the image forming apparatus is provided with an automatic document feeder (ADF), and the scanner unit reads the document transported by the ADF or a document placed on a platen. Moreover, the ADF transports the document so that both sides of the document can be read.
When both sides of the document are read, the document loaded on a document tray is fed to the scanner unit from the uppermost page of the document in order, and the front side of the document is read. Thereafter, the document is switched back so as to be reversed, and the back side of the document is read. After the back side is read, the document is idly reversed by means of a reversing mechanism and discharged from a paper discharge port, whereby the document is discharged to a paper discharge tray with the front side down in the same page order as before the document is fed.
In conventional automatic document feeders, when both sides of the document are read, the document needs to be switched back so as to be reversed, or the idle reverse needs to be performed when the document is discharged. Accordingly, there is a problem of a decrease in productivity.

Automatic document feeder, method of transporting document, and image reading apparatus


A pre-crystalline intraocular implant adapted to be implanted between the front face of the crystalline lens and the iris. It comprises an optical part (31) and a haptic part. The haptic part comprises a haptic ring (32) surrounding the optical part (31), a peripheral band (34) and branches (33) linking the haptic ring (32) and the peripheral band (34). The rear face of the implant comprises a central portion with spherical surface having a first radius, a second annular spherical portion having a radius greater that the first radius and a third concentric portion with spherical surface having a radius greater than the second radius. The invention is useful for correcting ametropia of a phakic eye.

The present invention relates to a precrystalline intraocular implant.
It relates generally to posterior chamber intraocular implants for a phakic eye, in particular for correcting ametropias of a young patient with a clear crystalline lens.
This kind of intraocular implant is implanted between the anterior face of the crystalline lens and the iris.
The narrowness and the environment of the space between the iris and the crystalline lens give rise to problems in the successful use of this type of implant. Too strong a contact with the posterior face of the iris can lead to depigmentation thereof and rubbing on the crystalloid can cause a cataract of the crystalline lens.
Similarly, this kind of implant is affected by anterior-posterior movements of the center of the crystalline lens during accommodation for near vision, which causes problems with stabilizing and centering this kind of implant.
The posterior surface of the optic of precrystalline implants is spherical, and has a particular radius, typically 10.5 mm. This choice is advantageous from the fabrication point of view, but the anterior face of the crystalline lens when relaxed does not have a single spherical surface, but in reality an aspherical surface, with an infinite number of successive spherical surfaces.
Obviously an implant whose posterior spherical surface has only one radius is not able to espouse the anterior surface of the crystalline lens.
Similarly, the position relative to the anterior surface of the crystalline lens of precrystalline implants in which the posterior surface of the optic has a single radius of curvature is somewhat hit and miss. This results in some instability of the position of the implant relative to the crystalline lens.
Furthermore, most precrystalline implants are spaced apart from the anterior face of the crystalline lens and therefore avoid any contact with it.
WO-98/17205 describes an intraocular lens for a phakic eye adapted to be implanted between the anterior face of the crystalline lens and the iris, comprising an optical part formed on a central body and a haptic part, the posterior face of the lens having a central spherical first portion having a first radius and an annular spherical second surface portion having a second radius greater than the first radius. The radius of curvature of the central spherical first portion is much smaller than the radius of curvature of the anterior face of the crystalline lens, to reduce the probability of contact with the crystalline lens at the center. The diameter of the circumference of the haptic part is smaller than the diameter of the corresponding ciliary sulcus and the contact of the anterior face with the iris in order for the lens to be self-centering.
To this end, the present invention provides a precrystalline intraocular implant adapted to be implanted between the anterior face of the crystalline lens and the iris, the implant comprising an optical part formed on a central body without impeding accommodation and a haptic part.
According to a first aspect of the invention, the posterior face of the body includes a central spherical surface portion having a first radius, an annular spherical second surface portion having a second radius greater than the first radius, and a concentric spherical third surface portion surrounding the second portion and having a third radius greater than the second radius.
In a preferred embodiment of this aspect of the invention, the outside diameter of the peripheral ring is less than or equal to the diameter of the anterior face of the crystalline lens, and the peripheral ring therefore does not bear in the sulcus. In this case, a centered and stable position is ensured by the complementary shapes of the spherical surfaces of the posterior face of the body and the corresponding areas of the anterior face of the crystalline lens. In this embodiment, the haptic part of the concentric spherical third surface portion matches the corresponding part of the crystalline lens when relaxed. Large apertures in the haptic part protect the metabolism of the crystalline lens.
This preferred embodiment has an important advantage at the time of implantation. The implant must be released into the posterior chamber in front of the crystalline lens without worrying about placing the peripheral part in the ciliary sulcus, which the surgeon cannot see. Furthermore, because of the small thickness of this kind of implant and its small diameter, which is approximately 10 mm, the implant can be inserted through a 2 mm self-healing corneal or sclerotic-corneal incision. Finally, in this embodiment, the posterior surface of the implant espouses the interior face of the crystalline lens when relaxed in three areas with different radii, from the smallest at the center to the largest at the periphery.
According to another aspect of the invention, the peripheral ring of the haptic part is adapted to bear in the ciliary sulcus. The presence of this peripheral ring prohibits any decentering of the precrystalline intraocular implant in the posterior chamber. For this kind of implant, it is sufficient for the posterior face of the body to include a spherical central surface portion with a first radius and a spherical annular surface portion having a second radius greater than the first radius.
The haptic part preferably includes at least four radial arms of constant width and inclined toward the rear at an angle of 10xc2x0.
Thanks to the configuration of the posterior surface of the central body, the latter perfectly matches the convex shape of the surface of the anterior face of the crystalline lens, which minimizes the overall size and at the same time increases the actual surface area of contact between the posterior face of the central body and the crystalline lens.
With implants in accordance with either aspect of the invention, the radius of curvature of the anterior face of the central body, or each of the radii of curvature thereof, is calculated as a function of the ametropia to be corrected.
In one embodiment of the invention it is the whole of the body that constitutes the optical part, for example a monofocal optical part, and the anterior face of the body has a spherical central surface having a first radius and a spherical annular surface having a second radius. This kind of embodiment is particularly suitable for a convergent meniscus optic for correcting hypermetropia.
In another embodiment, it is only the central part of the body that defines the optical part, the body having a nonrefractive ring around this central part. With this kind of body, the anterior surface can advantageously be spherical with a single radius of curvature in the case of a divergent optic for correcting myopia (i.e. concave or divergent meniscus optic).
Despite the resulting close contact between the posterior face of the central body of the implant and the anterior face of the crystal lens when relaxed, aqueous humor continues to circulate between these two surfaces, in particular because of anterior-posterior movements of the center of the crystalline lens on the occasion of accommodation, which modifies the radius of curvature of the central zone of the anterior face of the crystalline lens, and aqueous humor is aspirated into the space formed in this way between the body and the crystalline lens.
To enable the implant to be inserted through a small incision, the material of which the implant is made is flexible and highly hydrophilic and has a high refractive index. This kind of implant can have a minimum thickness close to 30 xcexcm at the center of the optic for negative diopter implants for correcting myopias and 30 xcexcm at the edge of the optic for positive diopter implants for correcting hypermetropias. For the contact with the iris and the crystalloid to have no physiological effect, the surface of the implant is made as smooth as possible, for example polished to a finish of 2 to 3 nm.
According to a preferred feature of the invention, the haptic part includes a peripheral ring and arms connecting the peripheral edge of the central body to the peripheral ring.
According to another preferred feature of the invention, the haptic part incorporates large diameter apertures delimited by a pair of arms, the edge of the body and the peripheral ring. These apertures in the haptic part of the intraocular implant, situated at the periphery of the crystalline lens, facilitate good contact of the aqueous humor with the anterior face of the equatorial region of the crystalline lens, despite the presence of the precrystalline intraocular implant on the anterior face of the crystalline lens.
This is because the metabolically active areas of the crystalline lens are on the anterior face of the crystalline lens, and more particularly at its equator, where cellular multiplication occurs and crystalline fibers are synthesized.
Other features and advantages of the invention will become more apparent in the course of the following description.


A magnetron plasma processing apparatus including a vacuum chamber storing an object to be etched, a first electrode provided in the vacuum chamber to hold the object, a second electrode disposed to one side of the first electrode, where the first and second electrodes are in parallel with each other, a gas-supply unit feeding etching gas to the vacuum chamber, a magnetic-field generating means including a magnetic block disposed outside the chamber on the opposite side of the second electrode and rotatable about an axis normal to the object held by the first electrode, and a power-supply unit which feeds power to either of the first and second electrodes and generates discharge between these parallel electrodes. The magnetic block has end surfaces provided with magnetic poles having polarity inverse from each other, and in addition, a plane recess opposite from the second electrode is provided between the magnetic poles.

1. Field of the Invention
The present invention relates to a magnetron plasma processing apparatus and a method of processing magnetron plasma available for the production of semiconductor integrated circuits.
2. Description of the Related Art
Conventional magnetron plasma etching or dry etching apparata generate an electric field between parallel plane electrodes and a magnetic field orthogonally intersecting the electric field. Such a conventional magnetron plasma etching apparatus executes an etching process against a semiconductor refer by generating plasma with etching gas to process this wafer mounted on one of those plane electrodes.
Normally, in order to promote anisotropy as the typical etching characteristic, such a conventional magnetron plasma etching apparatus cited above executes an etching process by maintaining the internal pressure of vacuum chamber very low like 3.5 m Torr, or 7 m Torr, or 9 m Torr, for example.
Although anisotropy is securely promoted in the course of etching the semiconductor wafer by holding the internal pressure of the vacuum chamber very low as cited above, the etching rate can hardly be maintained at a constant level on the semiconductor wafer. Inventors of the present invention detected that application of such low internal pressure to the etching process of a semiconductor wafer resulted in the generation of a faulty wafer shape, in the form of a bent or gouged configuration. After exploration of the cause of these faulty symptoms, the inventors confirmed that, when such low pressure was applied, due to least probability of generating collision between ions, the plasma remained in low density, and thus resulted in the generation of a comparatively thick plasma sheath (in other words, a dark sphere of plasma) in the neighborhood of the semiconductor wafer.
Based on this discovery, the inventors further detected that, after being released from the semiconductor wafer as a result of generating collision between electrons, secondary electrons performed cyclonic movement according to the relationship between the electric field and magnetic field, and then, even when the secondary electrons were supposed to traverse the plasma, the secondary electrons shifted themselves to one side without hitting against gas seeds, but instead, the secondary electrons moved themselves into the comparatively thick plasma sheath without traversing the plasma at all, and finally, accumulated on the peripheral edges of the semiconductor wafer.
Taking these symptoms into account, the inventors finally confirmed that the plasma could not maintain uniform density in the neighborhood of the semiconductor wafer, and yet, accumulated electrons adversely affected the etching characteristic.
Such a conventional magnetron plasma etching system has another technical problem to solve. Concretely, due to uneven intensity and direction of magnetic field, the etching process cannot properly be executed at minimum etching speed, and in addition, ions cannot hold own their directivity constant, but these ions are obliged to obliquely enter into the wafer substrate, thus eventually making it difficult to properly execute the etching process with satisfactory anisotropy.
Although not strictly being defined, a variety of physical reasons are assumed to adversely affect the etching process to result in the poor formation of the semiconductor wafer. More particularly, the line of magnetic force formed in the peripheral edges of the semiconductor wafer cannot be formed in parallel with the upper surface of the semiconductor wafer, but instead, it turns into a loop. Since the electric field remains comparatively less in the plasma, electrons are subject to intense influence of magnetic field, and as a result, electrons respectively perform spiral movement with a circle of about 2 mm across by way of surrounding the line of magnetic force. As a result, when the line of magnetic force intersects the semiconductor wafer, electrons obliquely enter into the wafer along the line of magnetic force.
On the other hand, those ions directly being applied to the etching process respectively contain substantial mass, and thus, these ions are rarely subject to deviation of their moving direction otherwise caused by direct influence of magnetic field. Nevertheless, when electrons obliquely enter into the semiconductor wafer substrate during the process, these electrons merely collide with one-side wall of the substrate to result in the uneven accumulation of charge on both-side walls, which in turn generates uneven and asymmetrically distributed charge. In consequence, a new electric field is generated on both sides of the semiconductor wafer substrate, which then affects ions so that ions are obliged to move in deviant directions. This eventually results in degraded anisotropy in the formation of semiconductor wafers.
To solve this problem, if a plurality of permanent magnets were provided on both ends of parallel plane electrodes consisting of substrate electrodes and opposite electrodes, the upper surface of the semiconductor wafer will be provided with a specific magnetic field which is approximately parallel. In this case, the conventional magnetron plasma processing apparatus can generate such a semiconductor wafer having satisfactory anisotropy. On the other hand, when disposing a plurality of permanent magnets on both sides of parallel plane electrodes, because of the positionwise relationship, it is extremely difficult for the system to rotate those permanent magnets. Furthermore, no art can materialize uniform etching effect without rotating those permanent magnets. Furthermore, in order to generate uniform magnetic field on the semiconductor wafer based on the structure cited above, the system needs to provide large size permanent magnets.
There is such a proposed conventional apparatus which disposes coil-like electrodes in the periphery of the vacuum chamber in place of those permanent magnets mentioned above. The proposed apparatus is characteristically capable of rotating the direction of magnetic field by feeding alternate current having phases 90.degree. apart from each other to the two pairs of coils orthogonally intersecting each other.
On the other hand, in order to uniformly feed magnetic field to the whole surface of the semiconductor wafer, these coils must respectively have substantial diameter in proportion to the dimension of the vacuum chamber. In other words, the greater the dimension of the semiconductive wafer, the greater the dimension needed for the coils. This in turn requires the power supply source to increase the power supply capacity. Furthermore, since the magnetic field intensely affects both the interior and exterior of the chamber including a possibly unwanted domain, the proposed magnetron plasma processing system cannot practically use such electronic elements which are extremely sensitive to magnetism, and yet, the proposed system needs to have an effective means to prevent magnetism from leaking out of the apparatus

Magnetron plasma processing apparatus and processing method


A method for manufacturing a coating rod, comprising the steps of preparing a rod material, disposing a pair of form rolling dies having a plurality of helical convex threads, so that the closure angle of a main axis of each of the form rolling dies in the horizontal direction of the main axis is substantially 0.25° or larger but not larger than 0.35° with respect to an axial direction of the rod material, and form-rolling the rod material by feeding the rod material along the axial direction thereof and rotating the pair of form rolling dies around the main axes thereof, while clamping the rod material with the pair of form rolling dies.

1. Field of the Invention
The present invention relates to a method for manufacturing a coating rod for coating various types of liquid materials (coating liquids) on a continuously traveling sheet-like or belt-like substrate (hereinafter referred to as a web), such as a thin metal sheet, paper or film, and smoothing the liquid material after coating.
2. Description of the Related Art
As coating apparatuses for coating various types of coating liquids on a web, such as a thin metal sheet, paper, or a plastic film, there is known a variety of apparatus, including a roll coater, an air knife coater, a coater using dies, and a rod coater.
Of these coating apparatuses, the rod coater is a simple coating apparatus capable of coating various types of coating liquids on various types of webs, and therefore, is widely utilized. The rod coater includes a type which scrapes off excess amounts of coating liquid coated on the web with a coating rod (also referred to as a coating bar), and a type which performs both coating on the web and adjustment of the amount of coating liquid with one coating rod. In either type of rod coater, a multitude of grooves is formed on a surface of the coating rod in the circumferential direction thereof. By adjusting the depth and width of these grooves, the amount of coating liquid coated on the web and the amount of coating liquid to be scraped off are adjusted.
As a method for forming grooves on the surface of the coating rod, there is known a method of groove formation by means of form rolling. In this method, a rod material is held between two form rolling dies in which grooves are formed. The rod material is advanced in the axial direction thereof, while rotating the form rolling dies, thereby forming grooves on a surface of the rod material. This method has the problem, however, that if the depth of grooves formed on the rod material is non-uniform due to uneven form rolling, the highest portion of the rod material locally has contact with the web, thus producing scratches.
In order to solve this problem, Japanese Patent No. 4460257 discloses a method for grinding surfaces (ridges) of a coating rod after form rolling, so that 99.5% or more of the cross sections of ridges orthogonal to the axial direction of the coating rod are flush with one another.
In the method disclosed in Japanese Patent No. 4460257, however, ridges are ground after form rolling out of consideration of the shape of valleys. Accordingly, the cross-sectional area of each groove may change due to grinding, thus causing uneven coating in some cases.
The present invention has been accomplished in view of such circumstances, and an object of the invention is to provide a method for manufacturing a coating rod capable of eliminating scratches and uneven coating on a web.