A semiconductor package that can accommodate a larger semiconductor chip while keeping the foot print area afforded to a conventional semiconductor package. The semiconductor package of the present invention also has an improved locking strength between a chip paddle and an encapsulation material. Additionally, the semiconductor chip of the present invention exhibits an improved heat radiation of the semiconductor chip over conventional semiconductor packages. The package of the present invention comprises a semiconductor chip having a plurality of bond pads on its upper surface; a chip paddle bonded to the bottom surface of the semiconductor chip by an adhesive; a plurality of internal leads, each having an etched part at the end facing the chip paddle, which are formed at regular intervals along the perimeter of the chip paddle; conductive wires for electrically connecting the bond pads of the semiconductor chip to the internal leads; and a package body in which the semiconductor chip, the conductive wires, the chip paddle and the internal leads are encapsulated by an encapsulation material while the chip paddle and the internal leads are externally exposed at their side surfaces and bottom surfaces.

1. Field of the Invention
The present invention relates, in general, to semiconductor packages and, more particularly, but not by way of limitation, to a semiconductor package that can accommodate a larger semiconductor chip without increasing the foot print area afforded to a conventional semiconductor package. Additionally, the present invention relates to a semiconductor package having an increased moisture path.
2. History of Related Art
It is conventional in the electronic industry to encapsulate one or more semiconductor devices, such as integrated circuit dies, or chips, in a semiconductor package. These plastic packages protect a chip from environmental hazards, and provide a method of and apparatus for electrically and mechanically attaching the chip to an intended device. Recently, such semiconductor packages have included metal lead frames for supporting an integrated circuit chip which is bonded to a chip paddle region formed centrally therein. Bond wires which electrically connect pads on the integrated circuit chip to individual leads of the lead frame are then incorporated. A hard plastic encapsulating material, or encapsulate, which covers the bond wire, the integrated circuit chip and other components, forms the exterior of the package. A primary focus in this design is to provide the chip with adequate protection from the external environment in a reliable and effective manner.
As set forth above, the semiconductor package herein described incorporates a lead frame as the central supporting structure of such a package A portion of the lead frame completely surrounded by the plastic encapsulate is internal to the package Portions of the lead frame extend internally from the package and are then used to connect the package externally. More information relative to lead frame technology may be found in Chapter 8 of the book Micro Electronics Packaging Handbook, (1989), edited by R. Tummala and E. Rymaszewski, incorporated by reference herein. This book is published by Van Nostrand Reinhold, 115 Fifth Avenue, New York, N.Y.
Once the integrated circuit chips have been produced and encapsulated in semiconductor packages described above, they may be used in a wide variety of electronic appliances. The variety of electronic devices utilizing semiconductor packages has grown dramatically in recent years. These devices include cellular phones, portable computers, etc. Each of these devices typically include a motherboard on which a significant number of such semiconductor packages are secured to provide multiple electronic functions. These electronic appliances are typically manufactured in reduced sizes and at reduced costs, which results in increased consumer demand. Accordingly, not only are semiconductor chips highly integrated, but also semiconductor packages are highly miniaturized with an increased level of package mounting density.
According to such miniaturization tendencies, semiconductor packages, which transmit electrical signals from semiconductor chips to motherboards and support the semiconductor chips on the motherboards, have been designed to have a small size. By way of example only, such semiconductor packages may have a size on the order of 1xc3x971 mm to 10xc3x9710 mm. Examples of such semiconductor packages are referred to as MLF (micro leadframe) type semiconductor packages and MLP (micro leadframe package) type semiconductor packages. Both MLF type semiconductor packages and MLP type semiconductor packages are generally manufactured in the same manner.
A micro electronic circuit with a significant number of semiconductor chips is designed to conduct multiple functions in a minimal period of time. Additionally, semiconductor packages have become increasingly miniaturized with an increase in semiconductor package mounting density.
Demand for higher-speed, slimmer, and multi-functional electric appliances has lead to the development of semiconductor chips that have a high memory capacity without increasing thickness of the semiconductor chip. However, to achieve high memory capacity, the semiconductor chips must have an increased size. Therefore, to utilize slim semiconductor packages with multi-pins, there is a need for a technique of mounting the larger semiconductor packages.
A conventional small outline integrated circuit (SOIC) type semiconductor package is a surface-mounting type semiconductor package Other types include a small outline J-bend (SOJ) type, a small outline package (SOP) type, and a quad flat package (QFF) type semiconductor package. Similar in structure to the SOIC type, these semiconductor packages differ from one to another only in the bend shape.
An SOIC type semiconductor package comprises a semiconductor chip, which has a plurality of bond pads on its upper surface along its perimeter, and a chip paddle that is bonded to the bottom surface of the semiconductor chip via a conductive or non-conductive adhesive. A plurality of internal leads are arranged at regular intervals along the opposite sides of the semiconductor chip. External leads, which are bent in a seagull wing shape, are extended from the internal leads. Via conductive wires, such as gold or aluminum wires, bond pads of the semiconductor chip are electrically connected to the internal leads.
The semiconductor chip, the chip paddle, the conductive wires and the internal leads are encapsulated by an encapsulation material, such as an epoxy resin or resinous encapsulation material, to create a package body that has the function of preventing the internal components from being damaged by external factors, such as dust, heat, moisture, electrical and mechanical loads, etc. Typically, the chip paddle, the internal leads and the external leads are made of copper (Cu) or alloy, collectively composing a leadframe.
While an area of the upper surface of the internal lead is plated with copper (Cu) to improve the bonding strength with the conductive wires, an area of the external lead, which is to be fused onto a motherboard by soldering, is plated with nickel (Ni), tin (Sn), or palladium (Pd).
As described above, the conventional semiconductor package, in which the chip paddle occupies a larger space than does the semiconductor chip, has such a structure that results in difficulties with regard to securing a space for a large-size semiconductor chip. This is because the internal leads are spaced at regular intervals from each other and at a predetermined distance from the chip paddle.
Additionally, the internal leads formed in the semiconductor package are further extended over the package body from its front and rear sides or its front, rear, left and right sides. Thus, when such a semiconductor package is mounted on a motherboard, the semiconductor package occupies a significantly large space, which results in a decreased packaging density as well as adversely affecting design tolerance of electric patterns.
Further, when a large-size semiconductor chip is mounted in a semiconductor package of such a structure, the semiconductor package must be enlarged, which decreases packaging density as well as increasing the size of the motherboard to accommodate the larger semiconductor chip. Thus, the motherboard""s foot print area to which the external leads of the semiconductor package are fused must be re-designed.
A further drawback of conventional semiconductor chip design is that the semiconductor chip is completely encapsulated within a package body formed of a resinous material, which results in a very poor heat radiation ability.
The present invention relates to semiconductor packages that can accommodate a larger semiconductor chip. More particularly, one aspect of an embodiment of the present invention includes a semiconductor package comprising a semiconductor chip having a plurality of bond pads on its upper surface, a chip paddle bonded to the bottom surface of the semiconductor chip via an adhesive, and a plurality of leads, each having a lead etched part at the end facing the chip paddle. The leads are formed at regular intervals along the perimeter of the chip paddle. Conductive wires electrically connect the bond pads of the semiconductor chip to the leads. A package body houses the semiconductor chip, the conductive wires, the chip paddle and the leads, which are encapsulated by an encapsulation material while the chip paddle and the leads are externally exposed at their side surfaces and bottom surfaces. In one embodiment of the present invention, a lower side area of the chip paddle is etched to the extent that the resulting paddle etched part amounts to 10-90% of the total area of the lower side area with preference to a location at the inside of the lower side area of the chip paddle. While the chip paddle and the lower surfaces of the leads are preferably in a common plane, the chip paddle may be thicker than the leads.
In another aspect, the semiconductor package of the present invention has a noticeable advantage over conventional SOIC type semiconductor packages, in that the semiconductor of the present invention can use a 3.5 folds larger semiconductor chip with the same volume as that of the conventional type semiconductor packages. In addition, in the semiconductor package of the present invention, the bottom surface of the lead, i.e., the position at which lands are formed, may be the same position at which the external leads are fused to the motherboard, so that a conventional foot print area can be utilized Therefore, no design modification on the motherboard is required.
Moreover, the semiconductor package of the present invention shows excellent heat radiation due to its bottom surface being exposed to the outside. Further, the paddle etched part formed in the chip paddle brings about a remarkable improvement in the locking force between the chip paddle and the package body and in the fluidity of an encapsulation material during an encapsulation process. Additionally, the passage through which moisture permeates the semiconductor package is lengthened to minimize the influence of moisture on the semiconductor package. Typically, moisture permeates a semiconductor package at the interface between the encapsulate material and an exposed component, such as the chip paddle.

Encapsulated semiconductor package including chip paddle and leads


A domino SRAM array restore pulse generation system launches the work decode line by the same local clock as the restore pulse, thus eliminating any race issues with the word line select. This system allows the global bit select (or column select) to have fast activation by releasing the reset signal (with the earliest arriving array clock, ck1), while guaranteeing almost perfect tracking with the bit decode system. This allows for the widest possible write window; earliest release of the pre-charge in the global column select, and resetting only after the bit decode system is deactivated.

1. Field of the Invention
This invention relates to domino Static Random Access Memory (SRAM), and more particularly to an improved system for aligning the timing of the restore pulse on the local bit line pair with the timing of word and bit decode lines.
2. Description of Background
A static semiconductor memory typically includes six-transistor cell in which four transistors are configured as a cross-coupled latch for storing data. The remaining two transistors are used to obtain access to the memory cell. During a read access, differential data stored in the memory cell is transferred to the attached bit line pair. A sense amplifier senses the differential voltage that develops across the bit line pair. During a write access, data is written into the memory cell through the differential bit line pair. Typically, one side of the bit line pair is driven to a logic low level potential and the other side is driven to a high voltage level. The cells are arranged in an array that has a grid formed of bit lines and word lines, with the memory cells disposed at intersections of the bit lines and the word lines. The bit lines and the word lines are selectively asserted or negated to enable at least one cell to be read or written to.
As will be appreciated by those skilled in the art, in prior art domino SRAM design the cells are arranged into groups of cells, typically on the order of eight to sixteen cells per group. Each cell in a group is connected to a local bit line pair. The local bit line pair for each group of cells is coupled to a global bit line pair. Rather than use sense amplifier to detect a differential voltage when reading a cell, in a domino SRAM the local bit lines are pre-charged and discharged by the cell in a read operation, which discharge is detected and determines the state of the cell. The local bit line, the pre-charge means, and the detection means define a dynamic node of the domino SRAM. Domino SRAM of the type discussed here are explained in greater detail in U.S. Pat. Nos. 5,729,501, 6,058,065 and 6,657,886, which are incorporated herein by reference.
In domino SRAM array designs, the read or write operation is performed by initially pre-charging the bit lines and, after pre-charging, true and complement data is made available on the bit lines. In this scheme, the restore pulse to pre-charge the bit lines has to be very carefully aligned with the timing of the state of the word and bit decode lines in order to avoid a collision. The bit line restore pulse in a typical prior art design is generated by the local array clock signal. It does not have the same circuit delay as those in the word and bit decode paths. It is therefore difficult to line up the bit line restore pulse with the bit decode and word decode outputs to provide for a well synchronized operation.

Global bit line restore timing scheme and circuit

International Business Machines Corporation


An assembly for securing a component of a damper assembly includes a press movable along an axis from a retracted position to an extended position. The assembly includes a plurality of rollers rotatably supported at an end of the press. The rollers have an outer circumferential surface that includes a middle portion extending, in cross-section, transversely to the axis and linearly between an entry portion and a top portion of the outer circumferential surface.

Dampers are typically used in conjunction with automotive suspension systems or other suspension systems to control movement of wheels of a vehicle relative to a body of the vehicle. In order to control movement, dampers are generally connected between the sprung (body) and the unsprung (suspension/drivetrain) masses of the vehicle.


In the case of the method of setting the folding-nip width of a plurality of pairs of folding rollers which are provided on a folding machine, the two folding rollers (12 to 22) of the pairs of folding rollers are brought into contact with one another. A sheet is then guided through between the two folding rollers (12 to 22) of the pairs of folding rollers, as a result of which at least one of the two folding rollers (12 to 22) moves in relation to the other, with a folding nip being formed in the process, it being the case that, for each pair of folding rollers, a measured value corresponding to the folding-nip width is detected as the sheet is guided through. Finally, the folding-nip widths of the individual pairs of folding rollers are set by adjustment of the at least one moveable folding roller (14 to 22) by means of a drive (42), which is connected kinematically thereto, based on the corresponding measured values which have been detected.

1. Field of the Invention
The invention relates to a method of setting the folding-nip width of a plurality of pairs of folding rollers which are provided on a folding machine.
2. Description of the Related Art
DE 298 20 796 U1 discloses a folding machine which has a plurality of pairs of folding rollers which are arranged one behind the other in the sheet-passage direction and between which one sheet is guided through in each case. One folding roller of the first pair of folding rollers is arranged in a stationary manner, while the other folding roller is arranged in an adjustable manner in order to form a folding nip with the other folding roller of the corresponding pair of folding rollers. The adjustable folding rollers are prestressed in the direction of the stationary roller in each case by a prestressing device. Arranged on the feed table of the known folding machine is a thickness-measuring device, which measures the thickness of a first passing sheet which is fed to the first pair of folding rollers. The measured value determined is passed on to a process computer. There, with a respective folding layout being taken into account, the necessary folding-nip widths are calculated. Thereafter, the actuating drives are actuated, in order to adjust the adjustable folding rollers, until actual values of position indicators correspond to the desired values which have been calculated. Corrections may be carried out both via a keyboard and via manual spindle drives, which act in parallel with the motor drives and also act on the position indicators.
Determining the necessary folding-nip width by computer is problematic because, in addition to the sheet thickness and the tolerances thereof, the setting values also have to take account of air inclusions, the sheet compression, the roller wear and the roller contamination (applications of ink and powder).
In the case of a further apparatus, which is known from U.S. Pat. No. 4,125,254, first of all all the folding-nip widths are set to zero. Then, a sample sheet is guided through the folder, as a result of which the adjustable folding rollers are deflected and arrested in this deflected position. Corrections to the folding-nip width, however, are not possible in the case of this folding machine, with the result that the operation of setting the folding-roller nip is not practicable.
The object of the invention is to provide a method of setting the folding-nip width of a plurality of pairs of folding rollers by means of which the folding-nip width can be automatically set, and corrected, in a straightforward and precise manner.
This object is achieved according to the invention by a method of setting a folding-nip width of a plurality of pairs of folding rollers which are provided on a folding machine, each pair of folding rollers including at least one adjustable folding roller, comprising the following steps:
the two folding rollers of said pairs of folding rollers are brought into contact with one another,
a sheet is passed between said two folding rollers of said pairs of folding rollers, whereby said at least one adjustable folding roller moves in relation to the other, so that a folding nip is formed, a value corresponding to said folding-nip width being detected for each pair of folding rollers as said sheet is passed therebetween, and
said folding-nip widths of said pairs of folding rollers are set by adjustment of said at least one adjustable folding roller by means of a drive, which is connected kinematically thereto, based on the corresponding detected values which have been detected.
Since, in the case of the method according to the invention, the folding-nip width is measured on all the pairs of folding rollers as a sheet passes, and the folding-roller nip is then set by the associated drive at each pair of folding rollers in accordance with the measured values which have been detected, there is no need for any complicated calculation of the folding-nip widths in dependence on a thickness measurement, as is the case with the prior art known from DE-298 20 296. The method according to the invention operates without measuring the thickness of individual sheets and defective nip-width calculation. Moreover, it is possible to take account of air inclusions, the sheet compression, the roller wear and the roller contamination. Correction of the folding-nip widths is possible by the drives being activated correspondingly by a process control means, it being possible for the correction values to be entered from an operating terminal, e.g. a keyboard.
In the case of the method according to the invention, it is preferably possible for properties of a selected folding layout to be taken into account during the setting operation. Such folding layouts may be constituted, for example, by a zigzag fold or a parallel fold.
Furthermore, the measured values which have been detected may be compared with previously determined or measured reference values in order to determine roller wear or roller contamination.
The folding rollers are preferably brought into contact with one another by means of the drive, which is connected kinematically to an adjustable folding roller.
The method according to the invention can be used in a folding machine having
a plurality of pairs of folding rollers which are arranged one behind the other in a sheet-passage direction and comprise an adjustable folding roller and a stationary folding roller or two adjustable folding rollers,
each adjustable folding roller being associated a measuring device, which, as a sheet passes, detects a value corresponding to the width of the folding nip between said two folding rollers of a pair of folding rollers, and passes this value on to a process computer, and
connected kinematically to each adjustable folding roller is a drive which is controlled by said process computer on the basis of said values, detected during sheet passage, on the corresponding pair of folding rollers in order to set an optimum width of said folding nip.

Method of setting the folding-nip width of a plurality of pairs of folding rollers, and folding machine in which the method can be implemented

Maschinenbau Oppenweiler Binder GmbH and Co. KG


An apparatus is provided for stretching a circumcised foreskin of a penis. A tubular body provides an outer surface. An indented portion is included at one end of the body for accepting the tip of the penis, and a passage within the body interconnects the indented portion at the one end of the body with the other end of the body. In operation, with the tip of the penis inserted into the indented portion, and the foreskin drawn toward the tip to contact the outer surface for removable attachment thereto. The weight of the body exerts a tension force within the foreskin to stretch the foreskin. Additional weights may be attached at the other end of the body. In an alternate embodiment of the invention, the body is comprised of an outer portion including the outer surface, and an inner portion including the indented portion. The inner portion is slidably and axially engaged within the outer portion. A spring enclosed within the inner portion and the outer portion urges the portions apart in mutual linear translation. With the foreskin attached to the outer surface, and the tip of the penis inserted into the indented portion, such translation places a tension force within the foreskin for stretching the foreskin. In such an alternate embodiment of the invention, the passage may be a flexible tube, a coiled tube, or a telescoping tube.

Many advantages of circumcision have been cited over the years, and heretofore it has been a commonly held belief that circumcision has no disadvantageous effects. This is evidenced by the large number of male infants that undergo this procedure shortly after birth. However, some men have found themselves harbouring resentment at having such a procedure forced upon them without their consent or understanding at such an early age. Further, some men come to feel that circumcision is a disfigurement, and that, having undergone circumcision, they have been permenantly marred and are not whole or natural. Further, recent medical reports have indicated that circumcision results in an eventual decrease of sensitivity of the tip of the penis, or glans penis. For these reasons, many circumcised men have attempted to re-gain their foreskins, either through surgery or by stretching any remaining portion of foreskin towards the tip of the penis over a period of time. Such stretching can be accomplished typically within several months when a consistant stretching force is applied. Moreover, such stretching is permanent and results in a stretched foreskin that closely simulates an intact, original foreskin. Once a stretched or surgically attached foreskin has been restored, such men have experienced an increase in sensitivity and an overall increase in sexual enjoyment. Moreover, many men experience great psychological benefit by knowing that their foreskin has been restored.
Clear disadvantages are evident with the surgical method of foreskin restoration. Surgical technique requires cutting the skin, which then must heal. Not only does such a process cause discomfort, the possibility for infection is always prominent with any surgical procedure. Further, surgergy is dearly an expensive solution. However, there is also a distinct lack of prior art devices suitable for stretching or elongating the remaining foreskin of a circumcised penis in a gradual manner. One such device is a small dumb-bell shaped weight that is taped to the foreskin. The weight of the device, worn daily over a period of weeks or months, stretches the foreskin towards the tip of the penis. However, while using such a device the tip of the penis is forced into the convex surface of the spherical weight, causing discomfort and potential blood circulation problems. Moreover, when the user of such a device needs to urinate, the device must be completely removed. This is inconvenient and frequently results in non-use. Yet such a device must be used repeatidly over a period of several months for such a device to be effective. A further drawback of such a device is that its weight is not adjustable. Some men find the weight of such a device painfully uncomfortable, yet others find that the weight is insufficient to produce results fast enough.
Clearly, then, there is a need for a comfortable, easy-to-use, non-surgical foreskin stretching device. Such a needed device would allow the user to urinate without having to remove the device, and would properly shape the stretched foreskin into a natural, sheath-like truncated cone around the tip of the penis. Such a needed device would allow the stretching force to be adjustable, and could be easily removed if necessary. Moreover, such a needed device would be unobtrusive, allowing the user to wear such a device during the course of the day without attracting undo attention and without experiencing pain. Such a needed device would further be inexpensive, easy to use, and easy to clean. The present invention fulfills these needs and provides further related advantages.

Device for stretching the foreskin of the penis


There is provided an adhesive preparation containing 5-methyl-1-phenyl-2-(1H)-pyridone. The adhesive preparation is a 5-methyl-1-phenyl-2-(1H)-pyridone-containing adhesive preparation including an active medicinal ingredient-containing layer, characterized in that the active medicinal ingredient-containing layer contains an lipophilic base, a dissolving agent (except glycerin and a medium-chain aliphatic acid triglyceride), and 5-methyl-1-phenyl-2-(1H)-pyridone or medically acceptable salts thereof.

5-methyl-1-phenyl-2-(1H)-pyridone (hereinafter, expressed also as PFD) is known to be useful for prevention and remedy of fibrous diseases such as pulmonary fibrosis, fibrosis hypertrophy of prostate, and nephrosclerosis, and hitherto, there have been disclosed a tablet (see Patent Document 1) containing, as the main medicinal agent, 5-methyl-1-phenyl-2-(1H)-pyridone as a medicament for remedying pulmonary fibrosis, and a solution state medicament composition (see Patent Document 2) as a medicament in another dosage form for remedying a fibrous skin disease.
However, an adhesive preparation for prevention or remedy of skin diseases using, as an active medicinal ingredient, 5-methyl-1-phenyl-2-(1H)-pyridone or medically acceptable salts thereof is unknown.

This patent is subject to a terminal disclaimer.

Adhesive material containing 5-methyl-1-phenyl-2-(1H)-pyridone


According to one embodiment, a display device includes a display panel configured to perform display operation based on a pixel signal in a display period, a detector configured to perform touch detection operation in touch detection periods, and a driver configured to control frame operations. The driver is configured to control a first frame operation in a first frame periods including the display period, a first touch detection period and a first display adjustment period, and control a second frame operation in a second frame periods including the display period, a first touch detection period and a second display adjustment period. The second display adjustment period is longer than the first display adjustment period and includes the second touch detection period.

In recent years, electronic devices such as smartphones and tablet computers have become widespread. In the electronic devices, display devices having a touch detection function have been employed.
In a display device having a touch detection function in which a capacitive system is employed, for example, drive electrodes and detection electrodes formed in a stripe fashion are provided so as to intersect each other. When a finger is in contact with the screen of the display device having a touch detection function, the capacitance (value) changes in the portion in which the drive electrode intersects the detection electrode. In a capacitive system, contact with a finger on the screen can be detected by using the change in capacitance.
With respect to display devices having a touch detection function in which a capacitive system is employed, a technology for reducing the thickness of each device and improving the image quality by using electrodes (common electrodes) for image display in the pixels arrayed in a two-dimensional manner as the above drive electrodes is suggested.
In this technology, a display period in which display operation for image display is performed and a touch detection period in which touch detection operation for touch detection is performed are alternately provided in each period (frame period) for displaying the image of a single frame. Before and after each frame period, display adjustment periods called a perpendicular back porch period and a perpendicular front porch period are provided.
When the refresh rate (frame rate) of an image (video) in the normal driving of a display device having a touch detection function is, for example, 60 Hz, the display device may be driven at low speed with, for example, a refresh rate of 30 Hz, to reduce power consumption.
In this case, each frame period is longer than that in normal driving. However, low-speed driving may be realized by, for example, extending each display adjustment period without changing the above display period or touch detection period.
Since touch detection operation is not performed in each display adjustment period, the sensitivity for touch detection (report rate) is decreased when each display adjustment period is extended.

Display device having touch detection function and method


A method is described for treating a subterranean formation penetrated by a wellbore including injecting into the formation a treatment fluid including a rheological modifier; at least one viscoelastic surfactant (VES) at a concentration of between about 0.1 and about 10 percent by weight; and a formation-dissolving agent selected from the group consisting of hydrochloric acid, formic acid, acetic acid, lactic acid, glycolic acid, sulfamic acid, malic acid, citric acid, tartaric acid, maleic acid, methylsulfamic acid, chloroacetic acid, aminopolycarboxylic acids, 3-hydroxypropionic acid, polyaminopolycarboxylic acids, salts thereof and mixtures of said acids and salts.

The present disclosure generally relates to an acidic fluid that may increase in viscosity as it is pumped into a subterranean formation. More specifically, it relates to a fluid system containing a viscoelastic surfactant and a concentration of acid that does not allow the fluid to gel within a permeable subterranean formation. Most particularly it relates to a method of treating a subterranean formation with such a fluid system.

Methods of controlling viscosity of acids


A tubular, porous ceramic electrode structure (3) is made from the sintered admixture of doped lanthanum manganite and an additive containing cerium where a solid electrolyte (4), substantially surrounds the air electrode, and a porous outer fuel electrode (7) substantially surrounds the electrolyte, to form a fuel cell (1).

High temperature, solid oxide electrolyte fuel cell configurations are well known in the art, and are taught in U.S. Pat. No. 4,395,468 (Isenberg). The air electrode of the fuel cell can be comprised of doped or undoped oxides or mixtures of oxides in the Perovskite family, such as LaMnO.sub.3, CaMnO.sub.3, LaNiO.sub.3, LaCoO.sub.3, LaCrO.sub.3, and the like. Self supporting air electrodes are taught in U.S. Pat. No. 4,751,152 (Zymboly). The usual air electrode material is LaMnO.sub.3 doped with Ca or Sr, as a substitute for part of the La. In all cases, the air electrode must be porous, that is, have from 20% to 40% porosity (60% to 80% of theoretical density) in order to be operable in the fuel cell.
U.S. Pat. No. 4,562,124 (Ruka) taught that one difficulty in constructing fuel cells using modified lanthanum manganite air electrodes was, that when the air electrode was modified to have the highest electrical conductivity, it would have a higher coefficient of thermal expansion than some other materials typically used in making the fuel cell, such as those used in the stabilized zirconia electrolyte or the stabilized zirconia support tube. This patent taught a sintered, single phase, solid solution of a compound having the formula: EQU La.sub.1-X-.omega. (M.sub.L).sub.X (Ce).sub..omega. (M.sub.S).sub.1-y (M).sub.y O.sub.3,
where M.sub.L =Ca, Sr or Ba; M.sub.S =Mn or Cr; and M=Ni, Fe, Co, Ti, Al, In, Sn, Mg, Y, Nb or Ta and where .omega. is from about 0.05 to about 0.25, preferably 0.1 to 0.2; and y could be 0. Here, the oxide, carbonates or oxalates of all the metal components including Ce were homogeneously mixed and then sintered, to get the Perovskite-like crystal structure. Preferred compounds were La.sub.0.3 Ca.sub.0.5 Ce.sub.0.2 MnO.sub.3 and La.sub.0.3 Ca.sub.0.5 Ce.sub.0.2 CrO.sub.3.
It has subsequently been found that the amount of porosity in air electrode tubes made of La-Perovskite based air electrode materials may be difficult to control, where in many cases porosity drops to 10% to 15% due to uncontrolled sintering. What is needed is an air electrode made from a powder composition which will not only satisfy thermal coefficient matching problems, but also solve porosity control problems. It is one of the main objects of this invention to provide such powders.

Method of making an air electrode material having controlled sinterability


A stacked semiconductor package includes an upper unit package and a lower unit package. The lower unit package includes a substrate, a semiconductor chip disposed on an upper surface of the substrate, terminal pads arranged on an upper surface of the semiconductor chip, protrusions formed on the terminal pads, a protective layer formed on the substrate and covering the semiconductor chip and the protrusions, and openings formed in the protective layer and exposing the protrusions. The upper unit package includes a substrate, ball lands provided on a lower surface of the substrate, and solder balls formed on the ball lands. The solder balls of the upper unit package are inserted into the openings of the lower unit package to be connected to the protrusions of the lower unit package.

1. Field of the Invention
Example embodiments relate to a stacked semiconductor package, and more specifically, to the shape of a unit package to electrically connect an upper unit package to a lower unit package.
2. Description of the Related Art
Recently, as the miniaturization of semiconductor products accelerates, the miniaturization of semiconductor packages as well as high integration of semiconductor chips is becoming necessary. For the miniaturization of the semiconductor packages, a stacked semiconductor package in which a plurality of packages is stacked has been developed.
As a specific example of the stacked semiconductor package, there is provided a stacked semiconductor package having a ball grid array (BGA) package positioned at the lower part thereof and another BGA package stacked on the BGA package.
In such a package, solder balls of the upper BGA package are mounted on the lower BGA package so as to be electrically connected.
However, for the electrical connection between the upper BGA package and the lower BGA package, separate bump regions or solder ball regions, on which the solder balls of the upper BGA package are to be mounted, need to be formed on the lower BGA package.

Stacked semiconductor package having reduced height


An apparatus for gesture control and directional force on remote object based on smart wearable is provided. The apparatus includes a sensor configured to detect a user's gesture, a communication unit, and a controller configured to generate a command for a virtual leash based on the detected gesture, and to control the communication unit to transmit the command to a collar of a pet.

Mobile terminals are developed to provide wireless communication between users. As technology has advanced, mobile terminals now provide many additional features beyond simple telephone conversation. For example, mobile terminals are now able to provide additional functions such as an alarm, a Short Messaging Service (SMS), a Multimedia Message Service (MMS), E-mail, games, remote control of short range communication, an image capturing function using a mounted digital camera, a multimedia function for providing audio and video content, a scheduling function, and many more. With the plurality of features now provided, a mobile terminal has effectively become a necessity of daily life.
Mobile devices are also being adapted to be worn on the body. For example, several companies are developing smart watches, which are designed to be worn on the arm as a watch, and which provide many of the features typically associated with a mobile device, such as telephone, clock, and calendar programs. Many of these smart watches or wearable devices are designed to interface with a mobile device.
In the context of pets, many 'virtual fence' or pet tracking solutions are available. The pet tracking solutions typically include a GPS chip installed in a device attached to the pet, such as a collar. The collar also includes a communication unit that reports the pet's location to the user. Virtual fences use a collar capable of vibrating or applying an electric shock to the pet. The user sets up a perimeter for the virtual fence. When the pet moves to the edge of this perimeter, the device applies the vibration or shock to the pet in an attempt to inhibit the pet from moving beyond the perimeter which the user has set up.
However, these solutions, especially the virtual fence, can be considered inhumane. Deliberately shocking a pet can easily be considered an act of cruelty. This type of severe negative reinforcement is also not generally a good means of training a pet.

Gesture control and directional force on remote object based on smart wearable


Disclosed is a method of preparing a modified conjugated diene-based polymer, including (a) polymerizing a conjugated diene monomer, or a conjugated diene monomer and an aromatic vinyl monomer, using the compound represented by Chemical Formula 1 in the presence of a hydrocarbon solvent, thus forming an active polymer having an alkali metal end, and (b) coupling or reacting the active polymer with the compound represented by Chemical Formula 2.

With the recent trends in the vehicle industry, there is always the need for increased durability, stability and fuel economy, and continuous efforts to meet such needs have been made.
In particular, many attempts have been made to enhance the properties of rubber, which is the material for vehicle tires, especially tire treads, which are in contact with roads. The rubber composition for vehicle tires includes a conjugated diene-based polymer such as polybutadiene or a butadiene-styrene copolymer. To improve the performance of vehicle tires, research is currently ongoing into mixing a conjugated diene-based rubber composition with various enhancers.
The present inventors have proposed the present invention to develop, as a material for a tire tread, rubber having superior heat build-up, tensile strength, wear resistance, and wet skid resistance.

Modified conjugated diene polymer, method for preparing same, and rubber composition containing same


A solid electrolytic capacitor that includes an element laminate having a first end face and a second end face, a first external electrode on the first end face, and a second external electrode on the second end face. In the element laminate, a first layer and a second layer are stacked. The first layer has a valve-action metal substrate, a dielectric layer on a surface thereof, and a solid electrolyte layer on the dielectric layer. The second layer contains a metal foil. The first layer and the second layer are bonded by an adhesive layer containing a conductive adhesive layer and an insulating adhesive layer that surrounds an outer perimeter of the conductive adhesive layer. The adhesive layer includes a notched part that extends from the first end face or the second end face to the conductive adhesive layer.

A solid electrolytic capacitor is provided with a valve-action metal substrate having a porous part on the surface of a substrate containing a valve-action metal such as aluminum, a dielectric layer formed on the surface of the porous part, a solid electrolyte layer provided on the dielectric layer, and a conductor layer (also referred to as a current collector layer) provided on the solid electrolyte layer.
One method of making a solid electrolytic capacitor involves, for example, forming the porous part on the surface of a substrate containing a valve-action metal such as aluminum, then forming an oxide film on the surface of the porous part, followed by forming a solid electrolyte layer and also forming a carbon layer and a silver layer which act as cathode layers on the surface to make solid electrolytic capacitor elements, and bonding the cathode layers of the capacitor elements together with a conductive adhesive layer.
For example, as disclosed in Patent Literature 1 (JP 2006-324299A), to prevent a lowered ESR caused by the formation of cavities between layers due to gasification of an organic solvent during the heat curing of the conductive adhesive, a conductive sheet may be provided with grooves or notches for releasing gas.
Also, Patent Literature 2 (JP 2005-79463A) discloses bonding the solid electrolytic capacitor elements to each other through an insulating adhesive sheet having notches filled with a conductive adhesive.

Solid electrolytic capacitor and solid electrolytic capacitor manufacturing method


An advanced electric water heater control system that interfaces with a high temperature cut-off thermostat and an upper regulating thermostat. The system includes a control module that is electrically connected to the high-temperature cut-off thermostat and the upper regulating thermostat. The control module includes a switch to open or close the high-temperature cut-off thermostat and the upper regulating thermostat. The control module further includes circuitry configured to control said switch in response to a signal selected from the group of an autonomous signal, a communicated signal, and combinations thereof.

At least one definition of a "smart grid" describes a "smart grid" as a method for delivering electricity from suppliers to consumers using digital technology to control appliances at consumer's homes to save energy, reduce cost and increase reliability and transparency. Such a modernized electricity network is being promoted by many governments as a way of addressing energy independence, global warming and emergency resilience issues.
In one configuration, a "smart grid" operates by having devices that plug into an outlet, and in turn plugging appliances into this device. The device would then communicate and report to the electric companies at what time the appliance used energy and how much and use that to charge more for electricity used during peak hours of late afternoon and early evening. The electric company could offset that increase in price by giving discounts during the low demand hours (generally between midnight and 5 am).
One drawback of this approach is the cost of the device. Another drawback is that many appliances are not readily connected to such a device. Yet another drawback of this approach is that it fails to account for considerations other than the spot price of electricity. Yet another drawback is that many appliances, such as a hot water heater, operate independently using regulators, such as a thermostat. The present invention overcomes these and other drawbacks.


Provided is a communication method for improving the communication quality of multicast transmission. A grouping table storage section stores a grouping table in which Ack return order positions indicating priority orders of the reception terminals which each return an Ack, and addresses of the reception terminals are set. An Ack return order position notification frame creation section notifies each reception terminal of a corresponding Ack return order position based on the grouping table. An Ack return permission information determination section refers to the grouping table, determines the number of reception terminal that are to be permitted to return an Ack, and creates Ack return permission information in which information about the reception terminals that are to be permitted to return an Ack is set, based on the determined number of reception terminals. A multicast creation section creates a multicast containing the Ack return permission information and transmission data.

Recently, as one of broadband mobile communication systems for disaster countermeasures and rescues, it is desired that video of a disaster/rescue site is wirelessly distributed to emergency vehicles (ambulance, fire engine) near the site. With respect to such video distribution systems, it is considered that the number of emergency vehicles (ambulance, fire engine) is increased depending on the scale of the disaster. If video is transmitted by unicast (individual communication) to such emergency vehicles, a shortage of wireless bandwidth may occur. Therefore, such systems need to transmit data efficiently by multicast (broadcast communication).
A conventional communication method using multicast is, for example, art described in Patent Literature 1. In the art described in Patent Literature 1, a reception terminal that returns an arrival confirmation is designated for each multicast transmission cycle. FIG. 38A is a network diagram of the art described in Patent Literature 1. In FIG. 38A, a transmission terminal 200 is a terminal which transmits a multicast. Reception terminals 201 to 203 communicate via a wireless network and receive the multicast transmitted by the transmission terminal 200.
FIG. 38B shows a configuration of a frame of each packet transmitted/received between the transmission terminal 200 and a plurality of reception terminals 201 to 203 described in Patent Literature 1. In FIG. 38B, a multicast 301 includes arrival confirmation return permission identifiers which permit the reception terminal 201 and a reception terminal 202 to return arrival confirmations, respectively, and data blocks 1 to 3 provided as a unit of error correction.
In a first cycle, the transmission terminal 200 transmits the multicast 301 to the reception terminals 201 to 203. If the reception terminal 201 detects that the received multicast 301 contains an arrival confirmation return permission identifier destined to the reception terminal 201, the reception terminal 201 transmits an arrival confirmation frame 302 to the transmission terminal 200. If the reception terminal 202 detects that the received multicast 301 contains an arrival confirmation return permission identifier destined to the reception terminal 202, the reception terminal 202 transmits an arrival confirmation 303 to the transmission terminal 200. Since the received multicast 301 does not contain an arrival confirmation return permission identifier destined to the reception terminal 203, the reception terminal 203 waits without transmitting an arrival confirmation frame.
Here, since the reception terminal 201 has successfully received the blocks 1 to 3, the reception terminal 201 returns the arrival confirmation 302 indicating that there is no error. Meanwhile, since an error occurred in block 3, the reception terminal 202 returns an arrival confirmation frame 303 for requesting retransmission of the block 3.
In a second cycle, the transmission terminal 200 retransmits the block 3, the retransmission of which was requested in the preceding cycle and additionally transmits new blocks 4 to 6, in a multicast 304. In the multicast 304, arrival confirmation return permission identifiers which permit the reception terminal 203 and the reception terminal 201 to return arrival confirmation frames, respectively, are set. Although the reception terminal 203 has successfully received the multicast 304, but did not successfully received the block 2 of the multicast 301 in the first cycle, the reception terminal 203 requests retransmission of the block 2 by means of an arrival confirmation frame 305. Meanwhile, since the reception terminal 201 successfully received the blocks 4 to 6, the reception terminal 201 returns an arrival confirmation frame 306 indicating that there is no error.
In a third cycle, the transmission terminal 200 retransmits the block 2, the retransmission of which was requested in the preceding cycle and additionally transmits new block 7 to 9, in a multicast 307 in the same manner as in the second cycle. In the multicast 307, arrival confirmation return permission identifiers which permit the reception terminal 202 and the reception terminal 203 to return arrival confirmation frames, respectively, are set. Since the reception terminal 202 has successfully received both of the multicast 304 and the multicast 307, the reception terminal 202 returns an arrival confirmation frame 308 indicating that there is no error. Meanwhile, since the reception terminal 203 did not successfully received the block 8 of the multicast 307, the reception terminal 203 returns an arrival confirmation frame 309 for requesting retransmission of the block 8.
As described above, in Patent Literature 1, the transmission terminal 200 adds to a multicast the information of identifiers of reception terminals that the transmission terminal 200 permits to return arrival confirmation frames, thereby designating the reception terminals that return arrival confirmation frames. This has enabled prevention of collision between arrival confirmation frames, and reduction of time necessary for reception processing of the arrival confirmation frames at the transmission terminal, and thus realized improvement of the communication quality.
Another conventional communication method is, for example, art described in Patent Literature 2. In the art described in Patent Literature 2, destination information of a reception terminal (arrival confirmation return request) that has successfully received a multicast is removed from the multicast to be retransmitted, and the resultant multicast is retransmitted. FIG. 39 shows an example of a data transmission/reception sequence of the art described in Patent Literature 2. The communication system of the art described in Patent Literature 2 includes a transmission terminal 400 which transmits a multicast, and reception terminals 401 to 405 which each receive the multicast and transmit an Ack or a NAK as a response.
In FIG. 39, first, the transmission terminal 400 transmits a multicast 500 which includes destination information of a reception terminal 401 to a reception terminal 405. Since the reception terminals 402 and 405 have successfully received the multicast 500, the reception terminals 402 and 405 return Acks 502 and 505, respectively, each indicating that there is no error, to the transmission terminal 400. Meanwhile, since the reception terminals 401, 403, and 404 have not successfully received the multicast 500, the reception terminals 401, 403, and 404 return NAKs 501, 503, and 504, respectively, for requesting retransmission of the multicast 500.
Next, since the transmission terminal 400 has received the Acks from the reception terminals 402 and 405, the transmission terminal 400 transmits a retransmission multicast 500, which is the multicast 500 from which destinations of the reception terminals 402 and 405 has been removed. Since the reception terminal 403 has successfully received the retransmission multicast 500, the reception terminal 403 returns an Ack 513 indicating that there is no error. Meanwhile, the reception terminals 401 and 404 have not successfully received the retransmission multicast 500, the reception terminals 401 and 404 return NAKs 511 and 514 for requesting retransmission of the retransmission multicast 500.
Next, since the transmission terminal 400 has received the Ack from the reception terminal 403, the transmission terminal 400 transmits a retransmission multicast 500, which is the retransmission multicast 500 from which the destination of the reception terminal 403 has been removed. Since the reception terminal 404 has received the retransmission multicast 500 successfully, the reception terminal 404 returns an Ack 524 indicating that there is no error. Meanwhile, since the reception terminal 401 has not successfully received the retransmission multicast 500, the reception terminal 401 returns a NAK 521 for requesting retransmission of the retransmission multicast 500.
As described above, in the art described in Patent Literature 2, the destination information of the reception terminal that has successfully received a multicast is removed from the multicast and the resultant multicast is retransmitted, such that the reception terminal that has already successfully received the multicast does not return an Ack. Accordingly, the number of returns of unnecessary Acks has been reduced and the possibility of collision between the Acks (NAKs) has been reduced. In addition, the time necessary for reception processing of Acks (NAKs) at the transmission terminal has been shortened, and the communication quality has been improved. Further, in the art described in Patent Literature 2, a priority order is assigned to the arrival confirmation frame to be returned, in accordance with the order position set to each piece of destination information included in a multicast. Then, a reception terminal having the highest priority returns an Ack immediately, and the other reception terminals randomly determine the order of return Acks in accordance with the possibility determined by using their own priority orders. Accordingly, control in accordance with the priority of the reception terminals has been realized.


The toroidal-type continuously variable transmission comprises an input shaft rotatably supported, an input side disk, an output side disk, a plurality of trunnions, a plurality of power rollers, and a plurality of thrust rolling bearings 32, in which the mutually opposed inner surfaces of the input side and output side disks are respectively formed as concave surfaces each having an arc-shaped section, the peripheral surfaces of the power rollers are formed as spherical-shaped convex surfaces, and the peripheral surfaces of the power rollers are contacted with the inner surfaces of the input side and output side disks. In the thus structured toroidal-type continuously variable transmission, each of the thrust rolling bearings 32 is made of high carbon chromium bearing steel and is also carbonitrided.

The present invention relates to a toroidal-type continuously variable transmission for use as an automatic transmission for a vehicle and, particularly, to a toroidal-type continuously variable transmission in which the durability of component parts thereof, that is, disks and power rollers is enhanced.
Conventionally, as a toroidal-type continuously variable transmission, there is known a transmission which has such a structure as shown in FIG. 1.
Within a housing (not shown), an input side disk 1 and an output side disk 2 are disposed on an input shaft 3 which is rotatably supported in the interior of the housing, in such a manner that they are concentric with and opposed to each other. The input shaft 3 is penetrated through the axial core portion of a toroidal transmission part including the input side and output side disks 1 and 2. A loading cam 4 is disposed on one end of the input shaft 3. The loading cam 4 is structured such that it can transmit the power (rotational force) of the input shaft 3 to the input side disk 1 through a cam roller 5. The input side and output side disks 1 and 2 are concentric with each other with their respective inner surfaces opposed to each other. The input side and output side disks 1 and 2 have substantially the same shape, while these opposed surfaces are formed as toroidal surfaces which cooperate together in forming a substantially semicircle.
Within a toroidal cavity defined by the toroidal surfaces of the input side and output side disks 1 and 2, a pair of power roller bearings 6 and 7 are disposed in such a manner that they are contacted with the input side and output side disks 1 and 2. By the way, the power roller bearing 6 is composed of a power roller 6a (which corresponds to an inner ring forming the power roller bearing 6) which is allowed to roll on the toroidal surfaces of the input side and output side disks 1 and 2, an outer ring 6b, and a plurality of rolling bodies (steel balls) 6c. On the other hand, the power roller bearing 7 is composed of a power roller 7a (which corresponds to an inner ring forming the power roller bearing 7) which is allowed to roll on the toroidal surfaces of the input side and output side disks 1 and 2, an outer ring 7b, and a plurality of rolling bodies (steel balls) 7c.
That is, the power roller 6a serves also as an inner ring which is a component of the power roller bearing 6, while the power roller 7a serves also as an inner ring which is a component of the power roller bearing 7. In this structure, the power roller 6a is mounted pivotally and rotatably on a trunnion 10 through a pivot shaft 8, the outer ring 6b and the plurality of rolling bodies 6c on the trunnion 10 swinging about a support shaft 20 disposed at a position which is perpendicular to an axial line of the input shaft 3 and does not intersect the axial line thereof (hereinafter, this physical relationship is referred as xe2x80x3 a twisted position. The power roller 6a includes a peripheral surface which is formed as a spherical-shaped convex surface. The power roller 6a is supported in such a manner that it is able to inclinedly roll about shift shafts respectively supported on the trunnions and serving as the centers of the toroidal surfaces of the input side and output side disks 1 and 2. On the other hand, the power roller 7a is mounted pivotally and rotatably on a trunnion 11 through a pivot shaft 9, the outer ring 7b and the plurality of rolling bodies 7c, while the trunnion 11 can be oscillated about the pivot shaft 9 disposed at a twisted position with respect to the input shaft 3. The power roller 7a includes a peripheral surface which is formed as a spherical-shaped convex surface. The power roller 7a is supported in such a manner that it is able to roll inclinedly about shift shafts 0 respectively supported on the trunnions and serving as the centers of the toroidal surfaces of the input side and output side disks 1 and 2. And, to the contact surfaces of the input side and output side disks 1 and 2 with respect to the power rollers 6a and 7a, there is supplied lubricating oil which is large in viscous frictional resistance. Power input to the input side disk 1 can be transmitted to the output side disk 2 through the lubricating oil film, power roller 6a and power roller 7a.
By the way, the input side and output side disks 1 and 2 are set independent of the input shaft 3 through a needle roller 12 (that is, they are not influenced directly by the power of the rotary shaft or input shaft 3). On the output side disk 2, there is disposed an output shaft 14 which is not only arranged parallel to the input shaft 3 but also rotatably supported by the housing (not shown) through angular bearings 13. In this toroidal-type continuously variable transmission 20, the power of the input shaft 3 is transmitted to the loading cam 4. In case where the loading cam 4 is rotated due to such power transmission, the power of the loading cam 4 produced by the rotation thereof is transmitted through the cam roller 5 to the input side disk 1, thereby causing the input side disk 1 to rotate. Further, the power of the input side disk 1 produced by the rotation thereof is then transmitted through the power rollers 6a and 7a to the output side disk 2. As a result of this, the output side disk 2 is rotated integrally with the output shaft 14.
In the case of transmission, the trunnions 10 and 11 are moved by a slight distance in the directions of the shift shafts 0, respectively. That is, due to the movements of the trunnions 10 and 11 in the axial direction thereof, the intersection between the rotation axes of the power rollers 6a, 7a and the axes of the input side and output side disks 1 and 2 are shifted slightly from each other. As a result of this, the balance between the rotational peripheral speeds of the power rollers 6a, 7a and the rotational peripheral speed of the input side disk 1 is lost. In addition, due to the component of the rotation drive force of the input side disk 1, the power rollers 6a, 7a are inclinedly rotated around the shift shafts 0, respectively. Therefore, the power rollers 6a, 7a are inclinedly rotated on the curved surfaces of the input side and output side disks 1 and 2, with the result that the speed ratio is changed, thereby accelerating or decelerating the speed of the vehicle.
As a toroidal-type continuously variable transmission having the above structure, for example, there is known a conventional transmission which is disclosed in Japanese Utility Model Examined Publication No. Hei. 2-49411U. Also, as the examples of the above-mentioned input side disk, output side disk and power roller bearings, there are conventionally known disks and bearings which, as set forth in [NASA Technical note NASA ATN D-8362], use AISI52100 (JIS SUJ2 which corresponds to a high carbon chromium bearing). Further, disks and bearings which, as disclosed in Japanese Patent Unexamined Publication No. Hei. 9-79336, are produced by carbonitriding SCM420, that is, steel for machine-structural purposes containing Cr.
In the above-mentioned conventional toroidal-type continuously variable transmission, when it is driven, there are produced high contact pressures respectively between the input side disk and power roller bearings, between the output side disk and power roller bearings, and between the power roller inner and outer rings and rolling bodies. These high contact pressures give rise to the shortened rolling fatigue lives of the raceway surfaces. Also, an increase in the temperatures of the contact surfaces due to generation of heat in the lubricating oil (traction oil) flowing through between the input side and output side disks and power roller bearings as well as through between the power roller raceway surfaces and rolling bodies gives rise to the lowered surface hardness of the disks and bearings, thereby shortening the rolling fatigue lives of the disks and bearings.
In view of the above circumstances, for the purpose of enhancing the rolling fatigue lives of the disks and power roller bearings shortened due to the above-mentioned high contact pressures and high temperatures, conventionally, the input side and output side disks and the inner rings or outer rings of the power roller bearings are carburized or carbonitrided, to thereby prevent the reduction in the high temperature hardness of the surfaces thereof. To obtain sufficient surface hardness, it is necessary to enhance the carbon concentration and nitrogen concentration of the neighboring portions of the surfaces sufficiently. Further, in the above-mentioned conventional toroidal-type continuously variable transmission, there is a fear that there can be generated a high shearing stress in the interior portions of the rolling bodies and thus there can occur cracks at and from the neighboring portions of the maximum shearing stress positions, thereby causing the raceway surfaces to exfoliate. In view of this, in Japanese Patent Unexamined Publication No. Hei. 7-71555, there is provided an effective hardened layer having a depth in the range of 2.0 mm-4.0 mm, thereby obtaining a life extension effect.
Also, in Japanese Patent Unexamined Publication No. Hei. 9-79336, the material hardness at the maximum shearing stress position is set at Hv700 or more, thereby securing a life extension effect. To obtain the above life extension effects, it is necessary to enforce a carbonizing treatment or a carbonitriding treatment on the disks and bearings for a very long time but this raises a problem that the costs necessary for the thermal treatments are large. Further, to secure sufficient quenching hardness, it is necessary to use quenching oil which has a good quenching characteristic: that is, this arises a problem that the material is greatly deformed when it is quenched.
The present invention aims at eliminating the above drawbacks found in the conventional toroidal-type continuously variable transmissions. Accordingly, it is an object of the invention to provide a toroidal-type continuously variable transmission in which a thrust rolling bearing is made of high carbon chromium bearing steel and is carbonitrided in the surface thereof to thereby provide sufficient durability when compared with the conventional toroidal type continuously variable transmissions.
In attaining the above object, according to the invention, there is provided a toroidal-type continuously variable transmission, comprising: an input shaft rotatably supported; an input side disk rotatable together with the input shaft and including an inner surface formed as a concave surface having an arc-shaped section; an output side disk including an inner surface formed as a concave surface having an arc-shaped section, the output side disk being disposed concentrically with the input side disk with the inner surface thereof opposed to the inner surface of the input side disk; a plurality of trunnions respectively oscillatable about their associated pivot shafts disposed at twisted positions to the input shaft; a plurality of shift shafts respectively supported on the trunnions; a plurality of power rollers each including a peripheral surface formed as a spherical-shaped convex surface, the power rollers being rotatably supported on the peripheries of the shift shafts while they are disposed on the inner surfaces of the trunnions and also are interposed between and held by the input side and output side disks; and, a plurality of thrust rolling bearings respectively interposed between the outer peripheral surfaces of the power rollers and the inner surfaces of the trunnions for supporting thrust loads to be applied to the power rollers, wherein each of the thrust rolling bearings is made of high carbon chromium steel and is carbonitrided.
In the preferable embodiment of the present invention, each of the thrust rolling bearings may include:
an inner ring raceway formed in the outer peripheral surface of the power roller; and
an outer ring disposed inside the trunnion and having an outer ring raceway,
wherein the outer ring is made of high carbon chromium steel and is carbonitrided.
According to a second aspect of the invention, each thrust rolling bearing, preferably, may be structured such that the surface carbon concentration thereof is set in the range of 0.95-1.4% and the surface nitrogen concentration thereof is set in the range of 0.05-0.4%.
Also, according to a third aspect of the invention, each thrust rolling bearing, preferably, may be structured such that the surface hardness thereof is set at Hv650 or more.
Further, according to a fourth aspect of the invention, each thrust rolling bearing, preferably, may be structured such that the retained austenite is in the range of 20% to 45%.
Still further, according to a fifth aspect of the invention, each thrust rolling bearing, preferably, may be structured such that the surface residual compressive stress thereof is set in the range of xe2x88x92200 to xe2x88x921800 MPa.
Yet further, according to a sixth aspect of the invention, each power roller, preferably, may be made of steel for machine-structural purposes having a carbon concentration in the range of 0.15-0.5% and the present steel may be carbonized or carbonitrided.
With use of the above-mentioned thrust rolling bearings, not only there can be obtained a toroidal-type continuously variable transmission having sufficient durability, but also a bearing of a stable quality can be obtained at a lower cost than the conventional bearing.

Toroidal-type continuously variable transmission


Imidation-modified MMA (co)polymers, characteristically having a Tg from 20.degree. to 30.degree. C. higher than the Tg of the corresponding unmodified MMA (co)polymer, are produced by reacting an amine, e.g., methylamine or cyclohexylamine, with a suspension, in a hydrophobic nonsolvent reaction medium, of beads of such MMA polymer/copolymer.

1. Field of the Inventions
The present invention relates to the preparation of polymers or copolymers based on methyl methacrylate (MMA) which are modified by imidation, via reaction with an amine, of the ester functional groups comprising same, to improve various properties thereof.
This invention also relates to such imidationmodified polymers or copolymers based on MMA, per seo
2. Description of the Prior Art
It is known to this art to produce polymers based on MMA via imidation using an amine, for example by imidation:
(a) of molten polymer in an extruder,
(b) of polymer dissolved in a solvent, and
(c) of polymer in suspension in aqueous phase.
These processes present a number of disadvantages. Thus, the aforenoted processes for imidation in molten state present the disadvantage of poor control and heterogeneity of the imidation, by reason of a reaction between the highly viscous molten polymer and a gas (for example methylamine), a reaction which must be carried out in a very short time (3 to 5 min residence time in the extruder). They also present the disadvantage of heterogeneity of temperature within the molten polymer.
Homogeneous phase processes in a solvent medium present the disadvantage of requiring a costly devolatilization and, in addition, of producing polymers or copolymers containing higher proportions of carboxylic or anhydride functional groups.
Aqueous suspension processes present the disadvantage that the reaction proceeds through a stage of dissolution of the beads or pearls as a result of the formation of carboxylic functional groups, effecting a large increase in viscosity; the polymer reprecipitates only incompletely at the end of reaction. They also present the disadvantage of giving rise to high residual acid and amide contents and therefore producing a modified polymer or copolymer exhibiting poor optical and aging properties.

Preparation of imide-modified methyl methacrylate (MMA) polymer/copolymers


In accordance with embodiments of the present disclosure, an information provision device is presented. The information provision device may include an image searching unit configured to detect, from an image, a retro-reflective article and an article identification associated with the retro-reflective article. The device may also include a projecting unit configured to control projecting of an image pattern to the retro-reflective article. The device may further include a controller coupled with the image searching unit and the projecting control unit, wherein upon a determination that the retro-reflective article is relevant to a route, the controller is configured to generate the image pattern to be projected to the retro-reflective article.

Unless otherwise indicated herein, the approaches described in this section are not prior art to the claims in this application and are not admitted to be prior art by inclusion in this section.
A conventional navigation device may provide route guidance by finding the current location of the device using the Global Positioning System (GPS), and by determining a route from the current location to a destination based on maps stored in a storage device, such as a DVD or a disk drive. The current location and the route guidance may be displayed on the screen of the device. When a conventional navigation device is installed in a vehicle, the screen of the device may be placed in the control panel of the vehicle or attached to the windshield of the vehicle. A driver is often unable to look at the in-vehicle screen of the navigation device while still paying full attention to the road ahead.
A conventional navigation device may also employ a voice guidance system to inform a driver to turn at an intersection or exit a highway. When two roads or intersections are located very close to each other, the navigation device may not distinguish these roads or intersections, and the voice guidance may only provide ambiguous information such as "make a left turn soon." As a result, the driver may have to take his/her eyes off the road in order to further examine the map supported by the navigation device.

Information provision device using retro-reflecting article


A loudspeaker magnetic motor utilizes a voice coil with two or more wire coils that are connected in parallel and that are layered on top of one another. The motor utilizes, as a magnetic field source, a permanent magnet and, more particularly, a permanent magnet that includes a rare earth metal such as a neodymium boron iron magnet.

The invention relates to loudspeakers and to low-cost magnetic motors for use in loudspeakers. The invention has application, among other places, in cell phones, pagers, MP3 players, and other appliances where weight and size are factors.
A large percentage of loudspeakers are electrodynamic speakers. Such speakers employ a magnetic driver to produce movement of a diaphragm (typically cone or dome-shaped) which, in turn, causes sound. A typical loudspeaker includes a fixed magnet and voice coil. The magnet may be mounted to the rear of the frame behind the diaphragm. A magnetic "circuit" may be utilized to focus and, therefore, intensify the magnetic field in a region referred to as the "air gap". The voice coil is disposed adjacent the magnet and, preferably, within the air gap. The coil typically wire formed about a cylindrical support or "former" which, itself, is attached to the diaphragm.
In operation, electrical audio signals from an amplifier are applied to the voice coil producing a varying electromagnetic field around the coil. The electromagnetic field interacts with the magnetic field produced by the magnet. The magnet is securely fixed to the frame and the voice coil is movable, so the voice coil moves as the two fields interact. Because the voice coil is coupled to the diaphragm via the support, its movement causes the diaphragm to vibrate. The vibration of the diaphragm causes air around the speaker to pressurize and depressurize producing sound waves in the air.
The high energy density of rare earth materials such as neodymium boron iron is attractive for creating and miniaturizing shielded loudspeaker magnets. The magnet rings or discs can best be installed as cores on the inside of the transducers voice coil for easy manufacturing. The maximum storable and extractable energy is then limited by the voice coil diameter and can be increased only by the height of the neodymium slug.
An object of this invention is to provide improved loudspeakers and, more particularly, improved magnetic motors for loudspeakers.
A further object of the invention is to provide such motors that utilize rare earth magnets.
A still further object of the invention is to provide such motors as permit construction of lower impedance, higher B×L neodymium motors for driving loudspeakers.
Yet a still further object is to provide such motors as eliminate the need for multiple magnets and expensive edge winding and offers greater freedom in amplifier matching for best overall system value.
Still yet further objects of the invention are to provide such motors as permit the construction of low voltage sound systems for portable talking appliances like cell phones, note book and palm size computers, pagers, and other interactive wireless appliances.

Low cost motor design for rare-earth-magnet loudspeakers


A method of manufacturing a SOI high voltage power chip with trenches is disclosed. The method comprises: forming a cave and trenches at a SOI substrate; filling oxide in the cave; oxidizing the trenches, forming oxide isolation regions for separating low voltage devices at the same time; filling oxide in the oxidized trenches; and then forming drain regions, source regions and gate regions for a high voltage power device and low voltage devices. The process involves depositing an oxide layer overlapping the cave of the SOI substrate. A SOI high voltage power chip thus made will withstand at least above 700V voltage.

Power integrated circuit, or high voltage integrated circuit, is an important branch of modern electronics. It provides new type of circuits for various power converters and energy treatment device, capable of high speed, high integration density, low power consumption and radiation-hardness. Power integrated circuit is widely used in power control systems, automotive electronics, display drivers, communication devices, lighting industry, national defense, aerospace, and many other important areas. Because they are widely used, high voltage devices being the core of power integrated circuit are subject to strict requirements.
A power integrated circuit includes high voltage power transistors, conversion controllers, single-chip logic devices, etc. There high voltage power devices and low voltage logic devices have to be integrated on one chip. Silicon on insulator (SOI), being an ideal isolation material, can isolate high power modules from low power modules, and isolate high voltage devices from low voltage devices as well. Therefore, SOI eliminates electrical interference and simplifies device structures in a power IC. Furthermore, the surface of isolation regions in SOI is smaller than junction isolation regions, thus using SOI power IC can shrink chip area and reduce parasitic capacitance, making device scaling relatively easy.
IC products with SOI power devices operating at higher than 600V are widely used in fluorescent lamps, switching power supply controllers, and other devices. However, the vertical breakdown voltage of a conventional SOI high voltage device is lower than that for bulk silicon high voltage power devices, because the buried oxide layer (BOX) prevents the substrate to expand to the depletion layer). The SOI power IC devices designed for high voltage below 200V is usually easier than those products designed for high voltage above 600V.
The thickness of the top silicon film in SOI affects the maximum breakdown voltage. When the silicon film is thick, (typically greater than 1 micron), the vertical breakdown voltage increases with silicon film thickness. However, when the silicon film is thin (typically less than 1 micron), the vertical breakdown voltage increases as silicon film thickness decreases. Currently, the most effective techniques for manufacturing above 600V SOI power devices are: first using ultra-thin top silicon (0.2 to 0.5 microns thick) to shorten the ionization integration path to improve maximum vertical breakdown voltage, and second applying linear drift doping to achieve uniform distribution of lateral electric field.
However, due to existing process' limitations, the thickness of the top silicon film in SOI is usually greater than 1 micron. In order to achieve 0.2-0.5 micron thin silicon film, local oxidation of silicon (LOCOS) process is often adopted. But there are some problems with the LOCOS process which requires a long time to oxidize silicon locally for forming about a nearly 2 micron oxide layer, and the formed oxide layer is higher than the top silicon film of about 1 micron thick. In FIG. 1, the oxide layer fabricated 14 in the local region of a SOI substrate (including bottom silicon layer 11, BOX 12 and top silicon layer 13) is higher than the surface of SOI substrate. The higher part of the oxide layer will affect the precision of the follow-up photo-etching process, although the poly silicon gate can be extended on it to control the electric field of the drift region.
In addition, the SOI high voltage control chips usually include high voltage devices and low voltage devices, and the isolation structures between high voltage devices and between high voltage device and low voltage device utilize insulation trenches, while the isolation structures between low voltage devices utilize LOCOS structures.
Therefore, there is an urgent need to effectively combine the trench process and the LOCOS process on a single high voltage SOI chip.

Method for fabricating SOI high voltage power chip with trenches

Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences


An optical signal channel selection device which includes a plurality of first fixed optical signal channels for transmitting optical signals along a plurality of first parallel optical axes and a second fixed optical signal channel for transmitting optical signals along a second optical channel axis parallel to the first axes. A pair of reflective surfaces are fixed so as to be parallel to each other, the reflective surfaces being movable between the first optical channels and the second optical channel so that a first one of the reflective surfaces can be selectively positioned opposite selected ones of the first signal channels and the second reflective surface is positioned opposite the second signal channel. An input optical signal from a selected one of the first channels is incident on the first reflective surface and is directed toward the second reflective surfaces so as to be reflected therefrom in parallel with the input optical signal.

When using optical fibers to transmit optical signals, it is often necessary to direct optical signals between a plurality of optical fiber circuits or optical elements and a single optical fiber circuit or optical element, such as an optical signal detector. In order to do so, it is desirable to utilize an optical signal channel selection, or switching, device, sometimes referred to as an optical multiplexer. In one particular embodiment, for example, such a device can be arranged so as to interconnect a selected one of a plurality of transmitting optical fiber circuits to a single optical fiber circuit or optical element.
In one particular application, it is desirable to conduct light from a light source and wavelength selection portion of a spectroscopic analyzer through an optical fiber to a remote sensor and back through another optical fiber to the detector portion of the analyzer. When using heavy metal flouride glass (HMFG) optical fibers, it is advantageous to use single, small diameter fibers to connect the analyzer to the sensor because of the relatively high cost of such fibers. The use of such small diameter fibers, which carry less energy than larger diameter fibers, requires the use of a very sensitive analyzer, such as a Fourier Transform Infrared (FTIR) spectrometer which is relatively costly when compared with less sensitive analyzers. Accordingly, it is economically desirable to devise a technique for sharing a single analyzer among several sensors by using an optical signal channel selection device.
Other applications in which it is desirable to switch relatively easily and reliably from one optical signal channel, such as an optical fiber circuit, or optical element, to another occurs when switching is required between one or more circuits containing samples to be analyzed and a reference circuit, the use of such sample/reference circuitry often being required in many spectrometers in order to maintain the calibration accuracy necessary for the quantitative measurements being made.
In currently available optical fiber switches, or optical signal channel selection devices, the end of one optical fiber is physically transported so as to be aligned axially and in close proximity to the end of one of a plurality of optical fibers to which it is to be coupled. In such devices, the relative movement between the fibers is usually effected by using a stepping motor to cause an optical fiber to be physically transported in a linear motion into the desired positions for interfacial and axial alignment with each of the other fibers which are positioned in line along the direction of such linear motion.
Since the fiber cores which transmit the light are relatively small, in some cases the end of the fiber core having a diameter of less than 0.15 mm, the alignment of the end faces of the fibers must be very precisely controlled if light is to be effectively coupled between them. A lateral position error of 0.01 mm in such interface positional accuracy when using core diameters of 0.1 mm, for example, can produce about a 10% reduction in coupling efficiency. Moreover, if the angle that one fiber axis makes relative to the other fiber axis to which it is being coupled is out of alignment, the coupling efficiency is also reduced. In some applications, an axial mis-alignment of as little as 1.degree. may reduce the coupling efficiency to a level below a desired efficiency level. Such reductions can have an extremely adverse effect, particularly when providing precision quantitative spectroscopy measurements.
In addition, the techniques for moving fibers into close proximity with each other, as used in existing optical signal channel selection devices, make the small fiber core end areas quite vulnerable to changes in coupling efficiency which are caused by the presence of small particles, such as dust particles or other debris, which might lodge on the end face of one or both of the fibers. Moreover, such small diameter fibers are relatively fragile and repeated physical movement thereof may tend to subject the fibers to damage over a period of time.
It is desirable, therefore, to devise an optical signal channel selection device which will reliably and relatively easily permit selected ones of a plurality of optical fiber circuits, or elements, to be optically coupled to a single fiber circuit or optical element, for example, with a high degree of positional and axial accuracies, so as to provide high coupling efficiency, as when used for quantitative spectroscopic applications. It is further desirable that such a device avoid any vulnerability to the presence of dust, or other, particles on the fiber end faces and to avoid excessive repeated movement of the fibers so that damage which may tend to result therefrom can be avoided.


In a communications system having an authentication function, a relaying apparatus 3 is used. This relaying apparatus 3 has an authentication circuit 6 for checking whether reader/writers 2-1 to 2-n are authentic or not by detecting whether or not the authentication signals from the reader/writers 2-1 to 2-n have been subjected to a predetermined calculation operation within the reader/writers 2-1 to 2-n, a multiplexer 5 for switching the lines connecting between the reader/writers 2-1 to 2-n and, a PC 4 in accordance with the results of the authentication processes performed by the authentication circuit 6, and a calculation circuit 7 for performing a predetermined calculation operation on the authentication signals from the reader/writers 2-1 to 2-n and for feeding them back to the reader/writers 2-1 to 2-n.

1. Field of the Invention
The present invention relates to a communications system in which communications terminals for communicating with external communications apparatuses are managed in a concentrated manner by a computer functioning as a central control apparatus, and particularly to a communications system in which an authentication process is performed between such communications terminals and transponders that communicate therewith.
2. Description of the Prior Art
Conventionally, communications systems are in practical use that employ IC cards or magnetic cards as transponders to manage the lift facilities at a skiing ground, to sort pieces of baggage, to monitor people entering and leaving a room, and for other purposes. A communications system of this type consists basically of an interrogator portion and a transponder portion with which the interrogator portion communicates. Here, the interrogator portion is composed of, on the one hand, communications terminals, each provided with a reader/writer for communicating directly with a transponder and provided with a personal computer (hereinafter referred to simply as a xe2x80x9cPCxe2x80x9d) serving as a local control apparatus for analyzing the signal received from the transponder and producing a signal to be transmitted back to the transponder, and, on the other hand, another PC serving as a central control apparatus (i.e. a host computer) for managing in a centralized manner the above-mentioned PCs of the communications terminals as slave computers.
In a conventional communications system as described above, the interrogator portion, composed of a plurality of communications terminals and a central control apparatus, has a system configuration as shown in FIG. 8, which is a block diagram thereof. Specifically, a plurality of reader/writers 50-1 to 50-n, each capable of communicating with a transponder and having an authentication means, are connected individually to PCs 51-1 to 51-n so as to be controlled thereby, and these PCs 51-1 to 51-n are, as slave computers, connected to another PC 52 serving as their host computer so as to construct together a LAN (local area network).
How this communications system works will be described briefly below, taking as an example a case where it is applied to a system for monitoring people entering and leaving a room. When a person holding a magnetic card, on which personal information is recorded such as the time period in which the person is permitted in the room and the card ID (identification) number, inserts the magnetic card into one of the reader/writers 50-1 to 50-n, the person is requested to enter a secret number, and an authentication process is performed to determine whether to open a door or not to permit the person to enter or leave the room. Here, suppose that the magnetic card is inserted into the reader/writer 50-1. If, on the basis of the secret number entered by the person, the reader/writer 50-1 authenticates the magnetic card, communication is established between them, and the personal information recorded on the magnetic card is read.
This personal information is transmitted to the PC 51-1 that controls the reader/writer 50-1, and then the PC 51-1 determines whether to permit the person to enter or leave the room or not. If the PC 51-1 determines to permit the person in or out of the room, it responds by transmitting back a command signal requesting the door connected to the reader/writer 50-1 to be opened. Thereafter, the reader/writer 50-1 controls the door so that it will be unlocked, and also communicates with the magnetic card to record thereon the time at which the person entered or left the room. The information that this particular magnetic card holder entered or left the room is transmitted from the PC 51-1 to the PC 52 serving as the host computer, which thereby keeps track of where the magnetic card holder currently is. Moreover, from this PC 52, it is possible to manage faults occurring in the PCs 51-1 to 51-n that serve as slave computers.
In recent years, in a communications system of this type, IC cards have been taking the place of magnetic cards for their convenience. In such cases, to achieve higher security, both IC cards and reader/writers are provided individually with an authentication means that generates a rolling code to permit them to check, when communication is requested from a communication partner, whether the communication partner is authentic or not.
In this way, this conventional communications system, in which a plurality of reader/writers 50-1 to 50-n are connected individually to PCs 51-1 to 51-n so as to be controlled thereby and those PCs 51-1 to 51-n are connected to another PC 52 so as to construct together a LAN, requires PCs to be provided one for each of the communications terminals used therein, and thus inevitably has a complicated system configuration. Thus, a communications system of this type is expensive to introduce and maintain, and in addition troublesome to manage.
This system can be simplified, for example, by providing a hub serving as a relaying apparatus between the reader/writers and the PC serving as the host computer so that the reader/writers will be connected through the hub directly to the host PC so as to construct together a LAN. However, in this case, there is no security function performed between the reader/writers and the host PC such as the rolling codes and secret numbers exchanged between the reader/writers and the transponders. As a result, once a reader/writer erroneously authenticates an inauthentic transponder, there is a risk of the host PC being readily accessed by that transponder, allowing the inauthentic transponder to pretend to be an authentic transponder.
An object of the present invention is to provide a communications system that has a simpler system configuration in its interrogator portion including a plurality of communications terminals and that nevertheless offers higher security in communication.
To achieve the above object, according to the present invention, a communications system having an authentication function is provided with: a plurality of communications terminals for communicating individually with external communications apparatuses; a central control apparatus for controlling the communications terminals and for exchanging data related to the communications terminals and the external communications apparatuses with the communications terminals; and a relaying apparatus composed of a switching portion for selectively connecting one of the communications terminals to the central control apparatus and a central authentication circuit for checking whether the individual communications terminals are authentic or not.
In this communications system, whether the communications terminals are authentic or not is checked by the central authentication circuit provided in the relaying apparatus. If a communications terminal is found to be inauthentic by the central authentication circuit, the switching portion provided in the relaying apparatus prohibits it from being connected by way of a data transfer line to the central control apparatus. On the other hand, if a communications terminal is found to be authentic by the central authentication circuit, whenever it is accessed by an external communications apparatus requesting communication therewith, the switching portion provided in the relaying apparatus selects the communications terminal and connects it by way of a data transfer line to the central control apparatus to establish communication between them. Here, the authentication process performed by the communications terminal to check whether the external communications apparatus is authentic or not is performed independently of the authentication process performed by the relaying apparatus to check whether the communications terminal is authentic or not.

Communications system having an authentication function