A catalytic reactor is provided with one or more reaction zones each formed of set(s) of reaction tubes containing a catalyst to promote chemical reaction within a feed stream. The reaction tubes are of helical configuration and are arranged in a substantially coaxial relationship to form a coil-like structure. Heat exchangers and steam generators can be formed by similar tube arrangements. In such manner, the reaction zone(s) and hence, the reactor is compact and the pressure drop through components is minimized. The resultant compact form has improved heat transfer characteristics and is far easier to thermally insulate than prior art compact reactor designs. Various chemical reactions are contemplated within such coil-like structures such that as steam methane reforming followed by water-gas shift. The coil-like structures can be housed within annular chambers of a cylindrical housing that also provide flow paths for various heat exchange fluids to heat and cool components.

Various requirements have arisen for compact chemical reactors to be used in a variety of industrial and commercial settings. For instance, the need is rapidly arising to economically produce small amounts of hydrogen for the potential hydrogen fuel cell economy. For such purposes, it is desirable that hydrogen be produced by known catalytic reactions such as steam methane reforming followed by water-gas shift and that the reactor be as physically small as possible. The requirement that the reactor be compact is necessary to allow such reactor to be situated at existing automotive fuel stations where space is typically at a premium.
In the prior art, a variety of compact catalytic reactor designs have been proposed. For instance, U.S. Pat. No. 4,737,161 discloses a compact hydrogen generator in which a helical tube serving as the reaction zone is situated within a housing having an axial burner. Another similar device is disclosed in U.S. Pat. No. 3,357,916. In this patent a chemical reactor is disclosed. In one embodiment, a reactor shell or housing contains a length of helical tubing to serve as a reaction zone. The helical tube has a catalyst embedded on its inner surface to promote chemical reactions. A hydrocarbon feed can be passed through the helical tubing to be cracked in the presence of the embedded catalyst. Part of the cracked feed can be combusted within the reactor shell to generate heat to support the endothermic cracking reaction.
Other compact reactors utilize a series of concentric shells in which coiled tubes are used for heat exchange. For instance in U.S. Pat. No. 6,254,839 a reformer vessel is provided having a partial oxidation zone that is located beneath the steam reforming zone and that contains a steam reforming catalyst. The two zones are centrally and axially located within the reformer vessel. The partial oxidation zone and the catalytic reaction zone are surrounded by a helical tube and an oxygen containing source stream, or alternatively, fuel and steam, can be introduced into the helical tube to be preheated. Surrounding the helical tube is a shift region containing shift catalyst. A cooling zone, which can be helical tubing, is located within the shift region to receive cooling water to provide lower reaction temperatures that favor the shift reaction.
The reactor designs discussed above provide a compact arrangement for the catalytic reaction of the feed. However, the coiled tube design, while permitting the fabrication of a compact reactor, at the same time, is in and of itself a design limitation on the unit operation or operations to be conducted within the reactor. In this regard, the length of the tube limits the amount of reaction taking place within the reactor. As tube length is increased, the pressure drop within the tube also increases and therefore, energy must be expended at the feed end to overcome such irreversible loss. Additionally, as the spiral is made longer to accommodate a longer length of tubing, even heat transfer and thermal insulation can become problematical because of the greater length over which heat transfer takes place and/or thermal insulation is provided.
As will be discussed, the present invention provides a compact reactor that utilizes a helical tubular type configuration for reaction purposes and preferably, also, for heat transfer purposes but is superior to the prior art discussed above with respect to both its pressure drop and heat exchange characteristics.


A process for forming bumps on electrode pads for a wiring board including a substrate and a plurality of electrode pads. The process (a) forms a laminated two-layer film on the wiring board and forms a pattern of apertures at positions corresponding to the electrode pads, the laminated two-layer film including a lower layer containing an alkali-soluble radiation-nonsensitive resin composition and an upper layer containing a negative radiation-sensitive resin composition; (b) fills a low-melting metal in the aperture pattern; (c) reflows the low-melting metal by pressing or heating to form bumps; and (d) peels and removes the laminated two-layer film from the board. The laminated film including two layers with different properties permits high resolution and easy peeling.

Low-melting metal bumps such as solder bumps are used for the mounting of IC chips and the like. Formation of such bumps takes place on the IC chips or on the multilayer printed wiring board.
BGA (ball grid array) is a form of package in which the bumps are provided to an IC chip. This term generally refers to a package in which the IC chip is mounted on a package substrate.
WL-CSP (wafer level-chip size packaging) is a new technology for the high-density mounting. In the WL-CSP, a plurality of IC chip circuits is formed on one wafer and collectively subjected to electrode formation, packaging and burn-in test; thereafter the wafer is cut into IC chip packages.
Collective electrode formation in the WL-CSP may be performed by electrolytic deposition, filling a metal paste followed by reflowing, or placing metal balls followed by reflowing.
The increase of IC chip density has lead to higher density and miniaturization of bumps on the IC chip. Solder bumps have increasingly been studied and been in practical use in the WL-CSP mounting technology because they allow both connection reliability and reduction of processing cost. Specifically, the solder bumps are formed by electrolytic deposition using a mask that is produced by patterning a film of at least 50 μm thickness formed by application or lamination of a positive or negative liquid resist or dry film.
Meanwhile, when the solder bumps are provided to a multilayer printed wiring board, a solder resist layer is formed on the wiring board to prevent fusion bonding between the solder bumps. The solder resist layer is provided with apertures at positions corresponding to electrode pads. To form the solder bumps in the solder resist layer, mask printing of a solder paste is performed. The mask used in the mask printing has a pattern (pattern of apertures) that corresponds to the apertures of the solder resist layer. In carrying out the mask printing, the mask is placed on the solder resist layer so as to align the mask pattern and the apertures of the solder resist layer. The solder paste is then printed through the mask within the apertures of the solder resist layer on the electrode pads; subsequently, the solder paste is reflowed to form solder bumps on the electrode pads.
A variety of studies have been made to cope with reduction of solder bump pitches. For example, JP-A-H06-350230 discloses formation ofapeelable solder dam resist on a solder resist, and JP-A-2000-208911 discloses a method wherein a dry film is laminated on the solder resist layer, apertures are created at positions corresponding to electrode pads, a solder paste is applied followed by reflowing, and the dry film is peeled.
In the aforementioned process of bump formation, the positive resist, although easily peelable in general, causes difficult control of the aperture pattern configuration, often resulting in nonuniform bump size.
On the other hand, the negative resist permits relatively easy control of pattern shape, but is generally difficult to peel because of its photocrosslinking characteristics. In particular, when the solder bumps are formed by filling and reflowing the paste, the resist becomes even more difficult to peel from the board because the crosslinking in the negative resist proceeds to a further extent by the heat applied in the reflowing.
The resist film peeling is generally performed by spray method with an aqueous solution of sodium hydroxide or sodium carbonate. For the dry-film or liquid negative resist, dip method has been increasingly employed with use of a peeling solution that contains a highly polar solvent and an organic alkali. The former method, although inexpensive, often results in residual resist around the bumps having a high density, and causes deterioration of the bumps. The latter method has disadvantages that the peeling solution is expensive, and the metal surface of the bumps and the underlying board surface are corroded when the organic alkali concentration and the peeling solution temperature are increased for improving the peeling efficiency per amount of the peeling solution.

Method for forming bump on electrode pad with use of double-layered film


A p-type impurity layer is formed in an n-type semiconductor substrate. Since the p-type impurity layer has a low impurity concentration and a sufficiently shallow depth of 1.0 μm or less, the carrier injection coefficient can be reduced. In the p-type impurity layer, a p-type contact layer of a high impurity concentration is formed for reducing a contact resistance. Since the p-type contact layer has a sufficiently shallow depth of 0.2 μm or less, it does not influence the carrier injection coefficient. Further, a silicide layer is formed between the p-type contact layer and an electrode such that the contact-layer-side end of the silicide layer corresponds to that portion of the p-type contact layer, at which the concentration profile of the contact layer assumes a peak value. The silicide layer further reduces the contact resistance.

The present invention relates to an electrode contact section incorporated in a semiconductor device.
In the prior art, en electrode section incorporated in a semiconductor device is formed of an impurity layer provided in a semiconductor layer, and an electrode (made of, for example, a metal such as aluminum) that is in contact with the impurity layer. The impurity layer is often formed by ion implantation for the purpose of low cost.
In the electrode contact section, it is important to reduce the contact resistance of the electrode and the impurity layer. To reduce the contact resistance, the concentration of an impurity in the impurity layer is generally increased.
However, when forming an impurity layer by ion implantation, the concentration profile of the impurity layer shows a curved line with a peak. The impurity concentration of a surface portion of the semiconductor layer is lower than a peak concentration assumed at an inner portion thereof. In particular, in a longitudinal power device such as an IGBT, there is a case where a MOS structure is provided at one surface of a semiconductor layer, and an impurity layer is provided at the other surface thereof. In this case, the impurity layer at the other surface of the semiconductor layer cannot be annealed at a high temperature for a long time, with the result that the difference between the peak concentration and the surface concentration of the impurity layer is increased, and hence the contact resistance cannot sufficiently be reduced.
Further, in an IGBT (Insulated Gate Bipolar Transistor) as shown in FIG. 1, for example, it is necessary to reduce the contact resistance of an electrode contact section (a contact section between the impurity layer 2 and an anode layer 3), and also to quickly prevent carrier injection from an impurity layer (p+-type emitter layer) 2 to an n+-type base layer 1 when turning off the semiconductor device, in order to turn off the device at high speed.
However, to reduce the contact resistance at the electrode contact section, it is necessary to increase the impurity concentration of the impurity layer 2. On the other hand, to quickly turn off the semiconductor device, it is necessary to reduce the impurity concentration of the impurity layer 2, and also to make the impurity layer 2 shallow so as to reduce the coefficient of carrier injection from the impurity layer 2 to the n+-type base layer 1.
In other words, concerning the impurity concentration of the impurity layer 2 at the electrode contact section, a reduction of the contact resistance and an increase of the speed of the turn-off of the semiconductor device (i.e. a reduction of the carrier injection coefficient) is a tradeoff relationship. Accordingly, these two purposes cannot be satisfied simultaneously.

Electrode contact section of semiconductor device


In a method for manufacturing an FBAR device, the device includes a substrate having a certain size, at least one device functional portion performing a resonance function by responding to electrical signals applied from the outside, the device functional portion being formed along a center portion of the substrate while defining a certain air gap therein, plural external electrodes formed on an upper surface of the substrate substantially coming into contact with both opposite edges of the upper surface, the external electrodes being electrically connected to the device functional portion, and a cap bonded onto the substrate so as to function as a cover for covering a remaining portion of the substrate except for the plural external electrodes.

1. Field of the Invention
The present invention relates to a film bulk acoustic resonator (hereinafter, referred to as an FBAR), and more particularly to a method for manufacturing a wafer level package type FBAR device, which can achieve miniaturization and reduction of a manufacturing cost due to a simplified process.
2. Description of the Related Art
In recent years, wireless communication devices have tended to become much leaner, and enhanced and diversified in their quality and functions due to the development of the communication industry. This recent trend sincerely requires miniaturization and enhancement in quality related with various elements for use in the wireless communication devices. Nowadays, therefore, chip shaped elements have become increasingly commercialized.
The wireless communication devices essentially utilize a voltage controlled oscillator (VCO), a filter, a duplexer and other devices, and these devices basically contain at least one resonator. Such a resonator is used to induce a resonance effect due to the piezoelectric effect thereof. Currently, active development is targeting an FBAR, which is preferable for integration due to its thin film shape, and has good properties.
Typically, the FBAR is formed on a wafer with a piezoelectric layer through a vapor deposition and the like. At the upper and lower surfaces of the piezoelectric layer are provided upper and lower electrodes, respectively, for applying electricity to the piezoelectric layer so as to oscillate it. In addition to the upper and lower electrodes, a desired air gap is formed at the lower surface of the piezoelectric layer in order to improve a resonance property of the piezoelectric layer. The formed piezoelectric layer and upper and lower electrodes are packaged for the purpose of protection. In this case, a wafer level package (hereinafter, referred to as a WLP) technique may be adopted in order to facilitate mass production and achieve miniaturization due to a simplified packaging process. The WLP technique achieve the manufacture and packaging of the device simultaneously by bonding a cap wafer serving as an upper package, a lower package, and a substrate wafer to one another. The substrate performs a function of a device. FBAR devices manufactured by the WLP technique accompany increases of the number and function of external terminals provided at the outside due to the diversification of their functions, but also accompany a reduction in the size of the package thereof. This makes it difficult to design the shape, size and position of the external terminals.
FIGS. 1A and 1B and 2A and 2B illustrate different structures of conventional FBARs manufactured in accordance with a WLP technique, respectively.
Referring to FIGS. 1A and 1B, one of the conventional FBARs comprises a substrate 11, and a cap 12 disposed on the substrate 11. The substrate 11 is formed with an air gap 11a, a lower electrode 11b, a piezoelectric layer 11c, and an upper electrode lid. The cap 12, made of a wafer, is formed with an empty cavity 12a at a portion where a circuit element is located. The cap 12 is further formed with perforated bores at positions corresponding to the upper and lower electrodes lid and 11b. After bonding the cap 12 to the substrate 11, the perforated bores are filled with a printing metal material, and external electrodes 13 are printed onto the upper surface of the cap 12 through a printing technique so that the external electrodes 13 are electrically connected to the upper and lower electrodes lid and 11b on the substrate 11.
In this case, the formation of the external electrodes 13 requires a printing process of metal electrodes for use as the external electrodes. Further, since the perforated bores have to be formed in the cap 12 in order to achieve electrical connection between the external electrodes 13 and the upper and lower electrodes lid and 11b on the substrate 11, there is a considerable limitation in design of a cap wafer.
Referring to FIGS. 2A and 2B, the other conventional FBAR, which is similar in its basic configuration to that shown in FIG. 1A, comprises the substrate 11, and a cap 15 disposed on the substrate 11. The substrate 11 is formed with the air gap 11a, the lower electrode 11b, the piezoelectric layer 11c, and the upper electrode lid. The cap 15, made of a wafer, is formed with an empty cavity 15a at a portion where a circuit element is located, and further formed with perforated bores 16a at positions corresponding to the upper and lower electrodes lid and 11b. After bonding the cap 15 to the substrate 11, instead of filling a printing metal material into the perforated bores 16a, metal films are formed on the inner surfaces of the perforated bores 16a and on certain portions of the upper surface of the cap 15 adjacent to the perforated bores 16a by performing a metal deposition process in a state wherein the remaining portion of the upper surface of the cap 15, except for certain portions for forming external electrodes 16, is shield by the use of a mask made of a photoresist (PR), metal or glass materials. In this way, the upper and lower electrodes lid and 11b on the substrate 11 are electrically connected with the external electrodes 16, respectively.
In this case, similarly to the previously described case, the formation of the external electrodes 16 requires a perforated bore forming step and a metal deposition process, resulting in a considerable limitation in design of a cap wafer due to the perforated bores.
Although the structures of the conventional FBARs as stated above have been achieved according to most effective methods for miniaturization, due to the previously mentioned various processes including printing, metal deposition and formation of perforated holes, the conventional FBARs requires a relative complex process and have considerable limitations in design of the FBARs. This makes it difficult to secure a profit margin required for mass production and results in a high manufacturing cost.
In addition to the above problems, when it is desired to increase the number of external terminals in existing commercialized products, a photolithography technique has to be applied thus resulting in a further increase of manufacturing costs.

Method of manufacturing wafer level package type FBAR device


A method of fabricating an ink jet head and an ink jet head fabricated thereby. The method includes preparing a substrate having a flow path region, a flow path structure region to define the flow path region, and a pad region disposed at edge portions of the substrate. At least one pressure-generating element to eject ink is formed on the substrate of the flow path region. An inserting material layer is formed on an entire surface of the substrate having the at least one pressure-generating element. The inserting material layer is patterned to form an inserting layer on the flow path structure region. A mold layer is formed on the substrate having the inserting layer to cover the flow path region. Next, a nozzle material layer is formed on the entire surface of the substrate having the inserting layer and the mold layer. The nozzle material layer is patterned to form a nozzle layer covering the inserting layer and the mold layer and having at least one nozzle passing through the nozzle material layer on the mold layer to correspond to the at least one pressure-generating element.

1. Field of the Invention
The present general inventive concept relates to a method of fabricating an ink jet head and an ink jet head fabricated thereby and, more particularly, to a method of fabricating an ink jet head and an ink jet head fabricated thereby, provided with an inserting layer pattern to flatten a nozzle layer.
2. Description of the Related Art
An ink jet recording device functions to print an image by ejecting fine droplets of ink for printing to a desired position on a recording medium. Such an ink jet recording device has been widely used since its price is low and numerous kinds of colors may be printed at a high resolution. The ink jet recording device basically includes an ink jet head for actually ejecting the ink and an ink container in fluid communication with the ink jet head. The ink stored in the ink container is supplied into the ink jet head through an ink supply hole, and the ink jet head ejects the ink supplied from the ink container onto the recording medium to thereby complete the printing operation.
A process of fabricating the ink jet head may be classified into a hybrid type and a monolithic type depending upon a method of forming a chamber layer and a nozzle layer configuring the ink jet head. In the case of the hybrid type, a process of forming the chamber layer on a substrate having a pressure-generating element, such as a heat-generating unit, and a process of forming the nozzle layer having a nozzle for ejecting the ink are individually progressed. Next, the nozzle layer is adhered on the chamber layer to thereby complete the fabrication of the ink jet head. However, in the process of adhering the nozzle layer on the chamber layer, misalignment between the pressure-generating element and the nozzle is likely to occur. In addition, the process becomes complicated since the chamber layer and the nozzle layer are fabricated through different processes. To overcome these problems, a method fabricating the monolithic type ink jet head has been widely employed.
FIGS. 1 to 4 are cross-sectional views illustrating a method of fabricating a conventional monolithic type ink jet head.
Referring to FIG. 1, a heat-generating unit 102 for ink ejection is formed on a substrate 100. Next, a positive photoresist layer is formed on an entire surface of the substrate, and then the positive photoresist layer is exposed and developed to form a mold layer 104 on the substrate 100, for covering a region where a flow path is to be formed.
Referring to FIG. 2, a negative photoresist layer 106 is formed on the entire surface of the substrate 100 having the mold layer 104. As shown in FIG. 2, during the fabrication process, the negative photoresist layer 106 has an uneven thickness due to a step-difference formed between the substrate 100 and the mold layer 104. In particular, the thickness of the negative photoresist layer 106 becomes rapidly thinned at an upper portion of an edge portion E of the mold layer 104.
Referring to FIG. 3, the negative photoresist layer 106 is exposed by a photomask provided with a nozzle pattern, and patterned by a development process. As a result, as shown in FIG. 3, a flow path structure 106′ has at least one nozzle 108 for ejecting the ink formed at the upper portion thereof.
Referring to FIG. 4, the substrate 100 is etched to form an ink supply hole 110 passing through the substrate 100, and then the mold layer 104 is removed using an appropriate solvent. As a result, an ink chamber 112 and a restrictor 114 are formed at a region where the mold layer 104 was removed.
As described above, according to the conventional method, the mold layer 104 is previously formed at the region where the flow path including the ink chamber 112 and the restrictor 114 is to be formed, and then the negative photoresist layer 106 is formed. As a result, as shown in FIG. 4, the flow path structure 106′ fabricated by the process described above has an uneven height from the substrate 100. In particular, the flow path structure 106′ has an uneven thickness at an upper portion of the flow path including the ink chamber 112 and the restrictor 114. That is, the thickness of the flow path structure 106′ becomes thinner as it gets nearer to an edge of the flow path. As a result, when the nozzle 108 passing through the upper portion of the flow path structure 106′ is formed, the height of the nozzle may have an uneven distribution to deteriorate ink ejection properties. In addition, as the thickness of the flow path structure 106′ becomes rapidly thin at the edge portion E of the flow path, when pressure generated at the time the ink is ejected is repeatedly applied, the flow path structure 106′ on the edge portion E of the flow path may have mechanical defects.

Method of fabricating ink jet head and ink jet head fabricated thereby


Device and operational management using bi-directional communication can be performed by a system that includes a service requesting component that generates first metadata, and a service provider component that receives the first metadata and generates second metadata in response thereto for processing by the service requesting component. In other aspects, device and operational management can be performed by determining a status of a given management operation related to a given workflow relative to a given component, and communicating the status of the given management operation to another component that is downstream of the given component in the given workflow. This communication can prevent the other component from repeating the management operation, leading to erroneous results for the workflow.

Color management refers to the process of associating abstract representations of colors with actual representations of colors as they are displayed on various devices. For example, in an image file containing a digital representation of a given object, respective sequences of binary digits may be assigned to represent various colors appearing in the image. The number of bits in the binary digits that represent the colors determine how many colors can be represented in the image. For example, assuming eight bits are allocated to storing color data in a given image file, the file can represent 28, or 256 different colors. Further, the sequence 00h may represent a given shade of red, while the sequence 01h may represent a different shade of red, and so on.
In any event, the sequences are mere numbers devoid of any meaning, unless the numbers are mapped to corresponding color spaces by a color profile. Different devices or types of devices may be associated with different color spaces or color profiles. For example, display devices such as computer monitors or other cathode-ray tube (CRT) devices emit color as Red-Green-Blue (RGB) light, which is an additive color space. Printers or other devices that produced color output on inked paper typically use subtractive color spaces, such as Cyan-Magenta-Yellow-Black (CMYK) inks.
As an example, a color image file may be displayed on a CRT using an additive RGB color space. However, if that color image file is to be printed in a given color printer, the color printer would typically use a subtractive CMYK color space. Thus, it becomes appropriate to map the numerical values that define colors in the RGB color space for display on the CRT, to other colors in the CMYK color space for printing. This mapping or conversion process is one example of color management.

Management of document content processing using bi-directional communication


A method and system in a computerized health care environment for determining whether a consumable may be safely administered to a body site of a patient is provided. A patient identifier to identify a patient and a consumable identifier identifying a consumable are received. A body site identifier identifying a location on the body of the patient to which the attachment is to be placed is received. The patient identifier, consumable identifier and body site identifier are utilized to determined whether the consumable may be safely administered to the body site of the patient.

With the shortage of skilled caregivers and the growing complexity of the healthcare industry, the potential for devastating healthcare errors has increased. Mistakes are often made during the health care process due to the sheer number of constantly changing caregivers, the growing complexity of health care, and opportunities for error. In a hospital environment, post-surgical procedures can be the most dangerous segment of a patient's hospital stay.
A number of attachments are associated with a patient in the provision of modern healthcare, particularly in a critical care or intensive care setting. As the number of attachments and functions provided by these attachments increases, the potential for adverse and other atypical events increases. For instance, particular risks include associating attachments to the wrong body site location of a patient and determining where to associate attachments.
Other risks include dispensing of medications and other consumables to a patient in an institutional environment. For instance, a medication or other consumable may be administered via an attachment to the incorrect body site of a patient.
A solution is needed for managing healthcare that is both safe and efficient. The solution should decrease the efforts and steps required of caregivers in order to minimize the opportunity for error.

Computerized system and method for determining whether a consumable may be safely administered to a body site of a patient


A virtual private volume control system, wherein in a data frame of a command issued from an OS, an ID number for identifying the OS is attached to the command; inside the disk apparatus, exclusion/priority processing is controlled, based on the ID number; thereby enhancing the transaction processing performance of a complex of servers and the disk apparatus as a whole.

1. Field of the Invention
The present invention relates to server and storage techniques, and more particularly, relates to effective techniques for a complex of information processing machines and storage apparatus, as a system formed by interconnecting its components such as a plurality of storage units and CPUs and required to have the ability of providing high security, high response performance and numbers of transactions.
2. Description of Related Art
Combination of servers having a plurality of CPUs, memories and I/O adapters and disk apparatus with a large storage capacity now realizes environment allowing a plurality of users to share these resources. Consequently, protecting the security of individual users and efficiently using the resources have become requirements. To achieve logical volume exclusion control, conventional servers and disk apparatus complexes adopted a method that the I/O adapters installed in the servers are assigned their ID number and the storage side distinguishes them by ID number. An exemplary configuration of a conventional servers and disk apparatus complex is shown in FIG. 2. Here, a server #0 (110) and another server #1 (120) have a plurality of operating systems OS #0 (155) to OS #2 (120) installed in them respectively. These servers respectively have I/O adapters 118 and 128 and are connected to storage 170. When accessing the storage 170, the servers issue data frames 130, 135, and 140 from their I/O adapters 118 and 128. The descriptions contained in the data frames 130, 135, and 140 include World Wide Name (WWN) (205, 215, 225) to which a specific identification number per I/O adapter 118, 128 is assigned. On the other hand, the disk apparatus 170 has I/O adapters 173 and 174 and receives the above data frames 130, 135, and 140. In the disk apparatus 170, channel controllers 175 and 176 which perform internal control derive each WWN 205, 215, 225 which equals any ID number from the received data frames 130, 135, and 140. The channel controllers 175 and 176 perform exclusion/priority control for logical volumes 195 and 196 by checking each WWN 205, 215, 225 against Exclusion/Priority Control Tables 182 and 183 stored in advance in local memories 180 and 181, respectively. For example, it is assumed that logical volume #0 (195) is exclusively allocated for the OS #2 (150) of the server #0 (110) and logical volume #1 (196) is exclusively allocated for the OS #1 (160) of the server #1 (120). Now, if the OS #1 (160) erroneously accesses the logical volume #0 (195), the data frame 140 for this access includes the WWN 225 that contains ID number 001, and thus the channel controller 176 recognizes that access permission for the volume is granted only to ID number 000 by referring to the Exclusion/Priority Control Table 183. Then, the channel controller 176 notifies the OS #1 (160) that the access has been rejected. As for the art regarding disk apparatus provided with such logical volume exclusion/priority control, there is a "Storage Subsystem" disclosed in JP-A-20447/2000.
Meanwhile, if a plurality of resources exist in a server, there are techniques of allocating and using these resources among a plurality of OSs. Using these techniques, it is made possible to make efficient use of server's CPUs, memories and other resources. As one example of these techniques, there is LPAR (Logical PARTioning). If this LPAR is applied, a Hypervisor 430 exists as software for managing a plurality of OSs, whereby it becomes feasible that CPUs, memories, and I/O devices are dynamically allocated to the OSs. For, for example, the server #1 (120) shown in FIG. 2, there are four CPUs #10 to #13. By applying the LPAR, it is possible to allocate CPU #10 to the OS #0 (155) and CPUs #11, #12, and #13 to the OS #1 (160). As for the main memory 125, it is also possible to allocate its available space between the OS. #0 (155) and the OS #1 (160) at an appropriate ratio. If there are a plurality of I/O adapters, they can be allocated to the OS #0 (155) and the OS #1 (160). However, because there is only one adapter in this example, the I/O adapter 128 is shared by both OSs. As regards this kind of art, there is a "Virtual Machine System" disclosed in JP-A-301795/1998.
Furthermore, in JP-A-112804/2000, description is made that in a virtual machine system wherein a plurality of OSs operate, sharing files, I/O instructions with OS number attached thereto are issued to the disk apparatus to prevent one OS from accessing a data file for another OS. Furthermore, In JP-A-140844/1992, description is made that the disclosed invention includes an I/O analysis means for analyzing I/O instructions issued from the OSs and the I/O analysis means appends an OS identifier to each I/O instruction it received, whereby exclusion control is accomplished during concurrent operation of a plurality of OSs.
As described above, the disk apparatus 170 distinguishes each WWN 205, 215, 225, and thereby exclusion/priority control of the logical volumes 195 and 196 can be accomplished. Moreover, applying the LPAR makes it possible to efficiently allocate CPUs, memories, and I/O devices to a plurality of OSs in a server. However, generally, in comparison with the rate at which the number of CPUs in a server increases, the number of I/O devices does not increase so much, and in most cases, an I/O device is shared by the CPUs. This is because of cost saving and the physically large size of an I/O device having an interface to the external. If logical volume exclusion/priority control is performed under these conditions where an I/O device is shared, some problem making the exclusion/priority control impossible arises as below. For example, the OS #0 (155) and the OS #1 (160) exist in the same server shown in FIG. 2 and share the I/O adapter 128. However, the data frames issued from both OSs include either WWN 125 or 225, but these WWNs are assigned the same ID number "001" because both the OSs share the I/O adapter 128. Therefore, the disk apparatus 170 cannot perform exclusion/priority control for these two data frames. Consequently, even if the logical volume #0 (195) is exclusively allocated for the OS #0 (155) and access permission for this volume is not granted to other OSs, it becomes possible for the OS #1 (160) to access the logical volume #0 (195) for the above reason.
On the assumption that a plurality of OSs running on a server share an I/O device and a storage system, it is an primary object of the present invention to improve the technique of performing the exclusion/priority control of logical volumes, each of which is exclusively allocated for one of the OSs, by providing the server side with a means for attaching OS-specific ID information to a data frame of command and the disk apparatus side with a means for deriving the OS-specific ID information from the data frame.
It is another object of the present invention to provide a technique by which tables containing the descriptions of a plurality of exclusion/priority control methods are created on the disk apparatus, thereby allowing selection out of the plurality of exclusion/priority control methods when performing such control.
It is yet another object of the present invention to provide a technique by which a plurality of exclusion/priority control methods are made available as instructions that the server can issue to the disk apparatus.
To solve the above problem, a virtual private volume control method is provided wherein servers on which a plurality of OSs run communicate with disk apparatus in such a manner that, when one of the OSs on a server issues an access command, the server assigns an ID number for identifying the OS and sends the command with the assigned ID number attached thereto; the disk apparatus receives the sent command, derives the ID number, and returns a response that indicates whether to process or reject the access to a logical volume with the ID number attached thereto, depending on whether the logical volume is accessible to the derived ID number; and the server receives the response. Moreover, the server includes a means for coding the ID number per OS in a data frame that it sends to the disk apparatus when accessing the disk apparatus. The disk apparatus includes means for deriving the ID number per OS and performing the exclusion/priority control for the access, based on the ID number. Furthermore, the server includes a means for sending information about an accessible logical volume or exclusion/priority control per OS to the disk apparatus. Furthermore, the disk apparatus includes tables into which the information about an accessible logical volume or exclusion/priority control per OS is registered.
Hereupon, the plurality of OSs may be virtually different multiple OSs belonging to different users, though they may be same OS products (for example, OS #0 is Windows NT [a registered trademark of Microsoft Corp., US in the US and other countries: the same shall apply hereinafter] and OS #1 is also Windows NT or OS #0 is UNIX [a registered trademark of UNIX System laboratories in the US and other countries, licensed exclusively to X/Open Company Ltd.; the same shall apply hereinafter] and OS #1 is also UNIX).
Other and further objects, features and advantages of the invention will appear more fully from the following description.

Storage system controlling exclusion/priority for I/O access


A system and method for utilizing data stored in an EPG database for modifying advertisement information. In this way, a service provider and/or an advertiser can transmit a single advertisement to all the television stations regardless of their geographic location and other user specific information, and need not re-transmit the advertisement even if there is a change in the show's program description. When the advertisement is displayed, the correct updated information is retrieved from the EPG database and inserted into the advertisement.

The present invention relates to receiving and displaying advertisements in an Electronic Program Guide (EPG). More specifically, this invention is directed to a system and method for utilizing data stored in an EPG database for modifying advertisement information.
U.S. Pat. No. 6,177,931, issued on Jan. 23, 2001, the contents of which are hereby expressly incorporated by reference, discloses an electronic program guide (EPG) with panel ad windows and channel ad tiles for displaying advertisement information. Typically, the advertisement information relates to future-scheduled television programs. For example, NBC might present a panel or tile advertisement of its show "Friends," as being shown every Thursday night on the local NBC channel.
Certain information in the advertisement, however, may vary each time the advertisement is transmitted, or differ based on the location of the receiving television system. For instance, "Friends" might be shown at 8:00 pm in California, but at 7:00 pm in Chicago. Thus, an advertisement displayed on a television system in California might read: "Watch Friends every Thursday night at 8:00 pm," while the advertisement in Chicago might state the same information (text and/or graphics), except that the airing time of the show will be different. Thus, for each of the different time zones, a service provider must create and transmit a different advertisement with the appropriate time information.
In addition to the above, the program description of an episode of a series of programs might differ on a daily, weekly, or bi-weekly basis. In such an instance, the service provider must transmit a new advertisement with updated program description information each time there is a change in the program description. Also, portions of information related to other ads, such as promoting a product or service may vary according to time zone, geographical regions, user preferences, and the like. Therefor, in the case of product/service advertisements, the service provider must also transmit a new advertisement with updated information each time there is a change in the price, telephone number, web site address, dates of promotions, and the like.
When advertisement information is transmitted via vertical blanking interval (VBI) signals which is a limited commodity, it is desirable to minimize the amount of advertisement information transmitted. With less transmitted information, the television systems that receive the information will also expend less memory in storing the information.

System and method for utilizing EPG database for modifying advertisements

Abstract: In one aspect, the present invention describes a method for modifying an advertisement in an EPG comprising the steps of: storing television schedule information in a first database; storing advertisement information in a second database; incorporating a portion of the television schedule information into a portion of the advertisement information to form a modified advertisement; and displaying the modified advertisement on a screen.


The present invention relates to a method for detecting circulating tumor cells (CTCs) in body fluids, preferably in blood and lymph.

Nowadays, there is widespread agreement that the possibility of detecting and counting the CTCs can lead to important information in medical field.
In particular, this information can be used for defining a diagnosis, a treatment and a monitoring system of many forms of cancer.
Some known procedures for isolating and detecting the CTCs from blood include, for example, the use of magnetic beads coated with specific antibodies capable of recognizing specific cell-surface markers. Examples of commercial technologies based on an antibodies/surface markers interaction include the CellSearch System™ manufactured by Veridex.
However, the use of surface proteins as targets for isolating and detecting CTCs suffers from different problems which are, for example, a lack of unique biomarkers on CTCs, the exclusively isolation/detection of EpCAM+ epithelial cells and the impossibility to use the isolated cells for further analysis. Further problems linked to this approach are the slow speed (with CellSearch System™ only 8 analyses per day can be carried out) and high cost (about 350$ per analysis of materials only, 650$ including technical assistance in performing the analysis [Data by Istituto Oncologico Veneto, Padova]) due to the fact that purified antibodies are required for the isolation/detection.
Other known methods for detecting CTCs use physical properties (such as size or hardness) to discriminate tumour cells from non-tumour cells. These methods, however, has not been clinically validated.
Reviews of the current technology for detecting CTCs can be found in: "Circulating Tumour Cells: Liquid Biopsy of Cancer, C. Alix-Panabieres and K. Pantel, Clinical Chemistry 59: 1,110-118 (2013); and "Techniques for Label-Free Separation of Circulating Tumour Cells: from Historical Foundations to Recent Developments", C. Jin et al, Lab Chip, 2013, DOI:10.1039/C3LC50625H.
Therefore, there is a huge need of developing alternative approaches capable of improving the detection of Circulating Tumour Cells that allow to overcome the drawbacks of the methods described in the state of the art.

Method for detecting circulating tumour cells (CTCs)

Abstract: In particular, the method for detecting circulating tumor cells in a body fluid comprises a step of detecting a change in pH and/or in a concentration of at least one molecule selected from lactic acid, lactate ions and protons within an isolated volume of said body fluid in which a cell has been encapsulated.


A radiation-sensitive resin composition comprising (A) an acid-dissociable group-containing polysiloxane and (B) a photoacid generator containing trifluoromethane sulfonic acid or a compound which generates an acid of the following formula (I),

1. Field of the Invention
The present invention relates to a radiation-sensitive resin composition suitable for microprocessing using various types of radiation such as deep ultraviolet radiation, electron beams, and X-rays.
2. Description of Background Art
A recent strong demand for high density and highly integrated LSIs (large-scale integrated circuits) radically accelerates miniaturization of wiring patterns.
Using short wave rays in a lithographic process is one method for miniaturizing wiring patterns. In recent years, deep ultraviolet rays typified by a KrF excimer laser (wavelength: 248 nm) or an ArF excimer laser (wavelength: 193 nm), electron beams, X rays, and the like are being used in place of ultraviolet rays such as g-line (wavelength: 436 nm) and i-line (wavelength: 365 nm).
Novolac resins, poly(vinylphenol), and the like have been used as resin components for conventional resist compositions. However, since these resins exhibit strong absorbance at a wavelength of 193 nm due to inclusion of aromatic rings in the structure, a lithographic process by an ArF excimer laser using these resins cannot provide high accuracy corresponding to high photosensitivity, high resolution, and a high aspect ratio.
Therefore, a resin for use in a resist, transparent to a wavelength of 193 nm or less and exhibiting dry etching resistance equivalent to or more excellent than aromatic rings, has been desired. A siloxane polymer is one such resin. R. R. Kunz et al. of the MIT have reported their research results showing excellent transparency of a polysiloxane wat a wavelength of 193 nm or less, particularly at 157 nm, commenting on superiority of this polymer as a resist material in a lithographic process using radiation at a wavelength of 193 nm or less (J. Photopolym. Sci. Technol., Vol. 12, No. 4, 1999). Moreover, polysiloxanes are known to exhibit excellent dry etching resistance. In particular, a resist containing polyorganosilsesquioxane having a ladder structure is known to possess high plasma resistance.
Several resist materials using a siloxane polymer have also been reported. For example, Japanese Patent Application Laid-open No. 323611/1993 discloses a radiation-sensitive resin composition comprising a polysiloxane having an acid-dissociable group such as a carboxylic acid ester group, phenol ether group, etc., on the side chain, bonded to a silicon atom via one or more carbon atoms. Japanese Patent Application Laid-open No. 160623/1996 discloses a positive tone resist using a polymer in which the carboxyl group of poly(2-carboxyethylsiloxane) is protected with an acid-dissociable group such as a t-butyl group. Japanese Patent Application Laid-open No. 60733/1999 discloses a resist resin composition in which a polyorganosilsesquioxane having an acid-decomposable ester group is used.
However, conventional resist materials using a siloxane polymer have not been satisfactory, particularly in the resolution performance.
An object of the present invention relates to a radiation-sensitive resin composition comprising an acid-dissociable group-containing polysiloxane as a resin component and suitable for use particularly as a chemically-amplified resist with excellent resolution.

This patent is subject to a terminal disclaimer.

Abstract: wherein Rf individually represents a fluorine atom or a trifluoromethyl group, and Ra represents a hydrogen atom, a fluorine atom, a linear or branched alkyl group having 1-20 carbon atoms, or a linear or branched fluoroalkyl group having 1-20 carbon atoms, a substituted or unsubstituted monovalent cyclic hydrocarbon group having 3-20 carbon atoms, or a substituted or unsubstituted monovalent cyclic fluoro-hydrocarbon group having 3-20 carbon atoms. The radiation-sensitive resin composition of the present invention exhibits superior resolution, while maintaining high transparency to radiations and high dry etching resistance. The resin composition thus can greatly contribute to the lithography process that will become more and more minute in the future.


A method for providing backhaul dynamic link distance for backhaul is disclosed. In one embodiment, the method includes propagating, by a network owner, a configured link distance parameter as part of beacon; using, by a mesh node joining the network, the configured link distance parameter for backhaul to set slot-time and Acknowledgement (ACK)/Clear To Send (CTS) timeout values before joining the network; wherein the configured link distance parameter for backhaul is part of a backhaul network profile.

A wireless mesh network is a communications network made up of radio nodes organized in a mesh topology. Wireless mesh networks often consist of mesh clients, mesh routers and gateways. In current mesh networks, a link distance is part of network profile and the default link distance is set to 3000 meters. When the actual distance between mesh nodes is higher than 3000 meters, then the mesh node may fail to connect, due to various factors relating to the weakness of the radio frequency signaling between the two distant nodes.


The method has for its object to enhance the contrast of an image, more specifically a low-contrast infrared image. The method is used in a system for putting the method into effect, more specifically an infrared camera operating in real time. The output image is structured with the aid of a transformation function (FI) one part of which (RCI) transforms the contrast of the warm points; the output histogram (HSI) has a higher contrast than the input histogram (HE). The point GO is determined for each image as a function of the characteristics of the input histogram (HE).

The present invention has for its object to provide a digital method of modifying an image to obtain an output image on the basis of an input image, each image being defined by a set of picture elements, denoted pixels hereinafter, each pixel containing at least a digital value defining its grey level among a set of possible values, said method comprising: a first stage in which a histogram is established which is representative of the distribution in a percentage figure of the grey level of the pixels of said input image, a second stage in which, on the basis of the distribution characteristic of said histogram a correspondence function is established between the input and output grey levels, a third stage in which the output image is formed on the basis of the pixels of the input image and of said correspondence function,
said correspondence function consisting of clipping the pixels having extreme grey levels and of linearly re-distributing the grey levels of the remaining pixels.
The present invention also has for its object to provide a digital system arranged for putting the method into effect.
This method applies to low-contrast images, more specifically infra-red images whose weak dynamic on the brightness scale is well known. The histogram of allow-contrast digitized image occupies only a small portion of the available grey levels.
In order to enhance the contrast, a known method is to linearly re-distribute, after clipping of the extreme levels, the input grey levels over all the available grey levels; however, this method has at least two disadvantages, as it has been found that in the first place in the case in which the input histogram is sufficiently large there is however, a gain in contrast which is not useful and often detrimental, in the second place for certain images in which there are small warm objects on a grey background, clipping the extreme pixels by a predetermined percentage has for its result that these small objects disappear, which is contrary to the envisaged object.
The present invention has for its object to obviate these disadvantages.

Digital method of modifying an image contrast so as to retain imaging of small objects


A scanning method, applicable for a flatbed scanner with transparent scanning function. A plane light source with a distribution range covering the region to be scanned of a transparent document is provided. The distribution range of the plane light source is read by preview scanning, such that the position of the transparent document is captured.

1. Field of the Invention
The invention relates in general to a scanning method, and more particularly, to a method of extracting the position of a transmission document.
2. Related Art of the Invention
In recent years, the improvement in processing speed and data storage for processors and computer related products has greatly enhanced the graphics process. Consequently, image processing equipment such as optical scanners are being improved to comply with the requirement for high resolution and high-speed scan.
Currently, the flatbed scanner is one of the most commonly seen scanners in the market. The flatbed scanner has a document plane such as a glass flatbed for disposing a document or a picture. An optical scan module moving along such document plane is then used to scan the document or picture, so that the image of the document or picture can be extracted. The structure of the flatbed scanner is simple and highly expandable. Therefore, in addition to scanning the typical reflective document or picture, the flatbed applicable to scanning a transparent document or film is broadly used.
The conventional flatbed scanner with transparent scanning function is normally equipped with an external transparency adapter and an external film holder. Referring to FIG. 1, a conventional flatbed scanner with the transparent scanning function is shown. The scanner 100 includes an optical scan module 104, an original document plane 130, an external transparency adapter 120, and an external transparent film holder 110. A transparent document 102 is placed on the original document plane 130, the transparent film holder 110 is located over the original document plane 130, and the transparency adapter 120 over the original document plane 130 covers the scanning region of the transparent document 102. The optical scan module 104 scans the transparent document 102 along the original document plane 130.
Referring to FIG. 1 and FIG. 2 that illustrate the allocation of a transparency adapter for a conventional transparent scan and the transparent film holder, the transparent film holder 110 has a scan window 112, a calibration window 114, and four markers 116. While scanning the transparent document 102, the transparent film holder 110 is disposed on the original document plane 130 of the scanner 100. The transparent document 102 is then placed within the scan window 112. The external transparency adapter 120 is located over the markers 116 to cover both the scan window 112 and the calibration window 114.
In addition, the external transparency adapter 120 projects a plane light source onto the scan window 112 and the calibration window 114. The optical scan module then extracts the light beams transmitting through the scan window 112 and the calibration window 114, so as to discriminate the image of the transparent document 102. The calibration window 114 is used to read the signal of the light source in advance, such that the coverage of the scan window can be properly read.
The conventional transparent film holder provides the scanner the functions of scanning and positioning the transparent document. Once the transparent film holder is missing, the functions of correcting and reading the scan region are lost. The user cannot perform the scanning process for a transparent document anymore.
In addition, the scan window limits the size of the transparent document, and the transparent document has to be disposed within the scan window. This is very inconvenient for the users. Further, the correcting window occupies significant scan area. Therefore, the scanning range cannot be optimized.
Further, the external transparency adapter has to be aligned over the markers of the transparent film holder. Therefore, one cannot arbitrarily change the angle. The external transparency adapter is also an optional device that costs additional expense of the user.


A structure includes a substrate, a first layer formed on the substrate, and a second layer formed on the first layer. The first layer is comprised of self-assembled monolayer and contains 4-(6-hydroxyhexyloxy)-4′-methoxybiphenyl. The second layer is obtained by micro-phase separation of a block copolymer containing a hydrophilic polymer comprised of polyethylene oxide and a hydrophobic polymer comprised of polymethacrylic acid containing azobenzene at the side chain. The second layer contains a cylinder phase with its long axis being oriented perpendicular to the substrate. The thickness T of the second layer is within a range of A≦T≦50 nm, where A is a phase separation period length satisfying 5 nm≦A≦50 nm.

A fine pattern of 30 nm or less is required for microfabricated high-density recording media such as next-generation semiconductor devices or patterned media. It is difficult to form such a fine pattern by current lithography techniques. A method of forming a fine pattern at lower cost and high throughput is proposed (see, for example, Japanese Patent No. 3926360 and JP-A 2009-57519 (KOKAI)). In the method, a fine pattern is formed using a microphase-separated structure by self-assembly of a block copolymer containing a mesogenic group.
As the thickness of such a block copolymer film is smaller, defect numbers and size variations after pattern transfer to the substrate are reduced. Consequently, a thin film with a thickness of 50 nm or less is considered to be desirable. However, when the thickness is set to 50 nm or less, the arrangement becomes random and the microphase-separated structure cannot be obtained.


The invention provides nucleic acid segments, compositions and methods for the treatment of heart failure, vascular dysfunction, endothelial dysfunction, diabetes, [Ca2+]i regulation and NO synthase dysfunction. Adeno-associated and adenovirus are used as gene delivery vectors for the nucleic acid segments to product long term over-expression of S100A1, a small calcium sensing protein associated with the disclosed ailments and dysfunctions.

Cardiovascular disease remains a leading cause of mortality in the developed world1,2. In particular, chronic heart failure (HF) continues to represent an enormous clinical challenge since HF mortality and incidence continue to rise2,3. Although pharmacological therapy has considerably improved HF care over the last two decades, existing treatments are not ideal since they often fail to support myocardium and increase global cardiac function1-3. Therefore, novel therapeutic approaches to target the underlying molecular defects of ventricular dysfunction in HF are needed. One hallmark molecular defect in failing myocardium is dysfunctional intracellular calcium (Ca2+) handling and several Ca2+-cycling proteins have been identified as potential targets for reversing failing myocyte function4,5.
S100A1 is a low molecular weight (˜10 kDa) Ca2+-sensing protein of the EF-hand type known to modulate intracellular calcium [Ca2+]i-handling in various cell types such as neurons, skeletal muscle and cardiomyocytes.7,14,38-39 Several biological activities such as the regulation of myocardial- and skeletal muscle contractility, cytoskeleton-mediated interactions, apoptosis, regulation of metabolic enzymes, proliferation and cell differentiation are affected by S100A1 mediated alterations in [Ca2+]i.40-42 S100A1 is especially interesting with respect to cardiovascular diseases since cardiac S100A1 expression levels are significantly down-regulated in end-stage heart failure (HF). S100A1 is a positive inotropic regulator of myocardial function in vitro and in vivo6-10. This effect is mainly mediated by a significant gain in sarcoplasmic reticulum (SR) Ca2+-cycling.13,14 Consistent with S100A1 being a key player in cardiac contractile function, data generated from S100A1 knock-out mice demonstrate that the loss of S100A1 expression leads to an inability of the heart to adapt to acute or chronic hemodynamic stress in vivo11,12. Importantly, S100A1 mediated affects on cardiac contractile function do not interfere with basic regulatory mechanisms of myocardial contractility9 and have been found to be independent of β-adrenergic signaling7. Functional properties of S100A1 in cardiomyocytes are mainly caused by increased sarcoplasmic reticulum (SR) Ca2+-ATPase (SERCA2a) activity, diminished diastolic SR Ca2+-leak and augmented systolic open probability of the ryanodine receptor (RyR) causing an overall significant gain in SR Ca2+-cycling13-15. This demonstrates a potential distinct mechanism of action for S100A1 altering Ca2+-handling in both phases of SR function.
Recently S100A1 expression has been described in endothelial cells (EC).43 EC synthesize and release vasoactive mediators in response to neurohumoural and physical stimuli, thus playing an important role in the regulation of vascular function. A well characterized and critical regulator of endothelial function is nitric oxide (NO) which is generated by endothelial NO synthase (eNOS or NOS3).44 Importantly, activation of eNOS is classically dependent on increased [Ca2+]i which can be induced by agonists such as acetylcholine (ACh) or bradykinin.45,46 NO contributes to endothelium-dependent vascular relaxation and has additional functional roles such as anti-leukocyte adhesion, anti-proliferative and anti-apoptotic effects on the vascular wall.45,47 Loss of endothelial NO results in endothelial dysfunction which occurs in a variety of cardiovascular diseases and is associated with adverse effects such as vascular inflammation, impaired vascular function and long-term vascular remodeling.48 Moreover, recent data provide evidence that endothelial dysfunction in HF is also associated with an increased mortality risk in patients with both ischemic and non-ischemic HF.49
Since S100A1 play a significant role of in the regulation of [Ca2+]i-transients in various cell types7, 14, 38-39, and it being highly and preferentially expressed in the healthy heart while it is found to be significantly down-regulated in HF16, it would appear that S100A1 is important in HF. Accordingly, a method of chronic S100A1 gene delivery to failing myocardium can be used to improve SR Ca2+-signaling and to support contractile function in HF. However, before this potential target as well as others for HF gene therapy are realized17, safe, efficient and reproducible gene therapy vector systems must be established and tested. It is becoming increasingly clear that recombinant adeno-associated viral (rAAV) vectors have properties amenable to future human use and S100A1 delivered to myocardium using these vectors may indeed fulfill the currently unmet promise of HF gene therapy.


For reducing EMI and simplifying driving circuits, a plasma display panel includes a first substrate and a second substrate disposed facing each other, a plurality of barrier ribs disposed between the first and second substrates and forming a plurality of discharge cells, a phosphor layer formed in each of the discharge cells, a plurality of address electrodes formed on the second substrate, and a plurality of display electrodes formed on the first substrate in a direction crossing the plurality of address electrodes. Terminals of the plurality of display electrodes are located at a same side of the plasma display panel between the first substrate and the second substrate.

1. Field of the Invention
The present invention relates to a plasma display panel for displaying an image.
2. Description of the Related Art
Generally, a plasma display panel (PDP) is a display device which excites phosphors with vacuum ultraviolet (VUV) rays radiated from plasma obtained through gas discharging, and displays desired images by using visible light of red R, green G, and blue B colors generated by the excited phosphors. The PDP has been in the spotlight as a flat panel display for TV and industrial purposes with several advantages. The PDP can realize a very large screen size of 60″ (˜152.4 cm) or more with a thickness of 10 cm or less, and involves excellent color representation, without image distortion due to viewing angles, since it is a self emissive display, like a cathode ray tube (CRT). The PDP further involves high productivity and low production cost as it is made in a more simplified manner compared to an LCD.
An alternating current type PDP ("AC PDP") includes a rear substrate and a front substrate. Address electrodes are formed on the rear substrate and covered by a dielectric layer. Between the address electrodes, barrier ribs are disposed in a striped arrangement on the dielectric layer. A phosphor layer for generating visible light of red R, green G, or blue B color is formed between the barrier ribs. Display electrodes are formed on the front substrate facing the rear substrate. The display electrodes are arranged in pairs, and each display electrode includes a transparent electrode and a bus electrode. The display electrodes extend in a direction crossing the address electrodes. A dielectric layer and an MgO protective layer are consecutively formed on the front substrate, covering the display electrodes. A discharge cell is formed at each area where the address electrodes on the rear substrate cross a pair of display electrodes on the front substrate. Millions of discharge cells are arranged in the PDP in a matrix format. The discharge cells of an AC PDP arranged in a matrix format are driven by utilizing memory characteristics.
In more detail, in order to generate a discharge between X and Y electrodes that form a pair of display electrodes, a potential difference therebetween is required to be more than a specific voltage, which is called a discharge firing voltage Vf. In this case, a scan pulse and an address pulse Va of a discharge cell are respectively applied to the Y electrode and the address electrode, an address discharge is generated between the two electrodes, and thus the discharge cell is selected. Plasma is formed in such a selected discharge cell, and electrons and positive ions therein shift toward the electrode of opposite polarity.
Since the electrodes of the AC PDP are covered with dielectric layers, most of the shifted space charges (i.e., the above-mentioned electrons and ions) are accumulated thereon. Accordingly, the net space potential between the Y electrode and the address electrode becomes smaller than the originally applied address voltage Va so that the discharge becomes weak and finally vanishes.
In this case, a relatively small amount of electrons is accumulated on the X electrode, and a relatively large amount of ions is accumulated on the Y electrode. The charges accumulated on the dielectric layer covering the X and Y electrodes are called wall charges Qw, and the space voltage formed between the X and Y electrodes due to the wall charges is called a wall voltage Vw.
When a predetermined voltage (called a sustain voltage Vs) is subsequently applied between the X and Y electrodes, a discharge is generated in the discharge cell to produce VUV rays, in the case that the sum Vs+Vw of the sustain voltage Vs and the wall voltage Vw is higher than the discharge firing voltage Vf. The VUV rays excite the relevant phosphors, and visible rays produced thereby are emitted through the transparent front substrate
However, for a discharge cell that has not experienced such an address discharge between the Y electrode and the address electrode (i.e., a discharge cell to which the address voltage Va is not applied), wall charges are not accumulated on the X and Y electrodes, and consequently the wall voltage is not formed between the X and Y electrodes. In this case, only the sustain voltage Vs applied to the X and Y electrodes acts in the discharge cell. As the sustain voltage Vs is lower than the discharge firing voltage Vf, no discharge is caused in the gas space between the X and Y electrodes.
Terminals of the X and Y electrodes of the display electrodes are located at opposite sides of the PDP between the front and rear substrates. The terminals of the X electrodes are connected to a driving board (typically called an X board) for driving the X electrodes, through a flexible printed circuit (FPC). The terminals of the Y electrodes are connected to another driving board (typically called a Y board) disposed opposite to the X-board. The X and Y boards may be fabricated in the form of a printed circuit board assembly (PBA). Therefore, a path for applying the sustain voltage to the X and Y electrodes is elongated, and accordingly electromagnetic interference (EMI) is increased during the operation of the PDP. In addition, such a PDP requires separate X and Y boards, and accordingly driving circuits become complex.
The information disclosed in this Background of the Invention section is only for enhancement of understanding of the background of the invention, and therefore, unless explicitly described to the contrary, it should not be taken as an acknowledgement or any form of suggestion that this information forms the prior art that is already known in this country to a person of ordinary skill in the art.

Plasma display panel having display electrode terminals located on the same side, and plasma display device incorporating the same


The disclosed technology relates to log file processing techniques for root cause analysis of a network fabric. A system may be configured to identify a feature of interest in a log file and calculating an abnormal level for the feature of interest. The system is further configured to detect that a performance event has occurred during a time period, determine whether the feature of interest is at the abnormal level during the time period, and identify a correlation between the feature of interest and the performance event based on the determining.

A network administrator may be responsible for managing a large number of networked entities and resources distributed across one or more networks. These entities may be physical entities or logical entities. For example, the entities may include nodes, endpoints, machines, virtual machines, containers (an instance of container-based virtualization), tenants, endpoint groups, and applications. These entities may be organized and interact with one another to perform one or more functions, provide one or more services, and/or support one or more applications. These entities may also be grouped in various ways, located in different geographical locations, and/or serve different functions.
A thorough understanding of the networked entities and their configuration is critical for ensuring smooth operation, troubleshooting problems, detecting anomalous activity in the network environment (e.g., network attacks and misconfiguration), application and infrastructure security (e.g., preventing network breaches and reducing vulnerabilities), or asset management (e.g., monitoring, capacity planning, consolidation, migration, and continuity planning). Traditional approaches for managing large network infrastructures require comprehensive knowledge on the part of highly specialized human operators because of the complexities of the interrelationships among the entities. When confronted with a problem in the network, these human operators manually experiment with large datasets to tease out possible causes and eliminate them one by one until an actual cause is found.

Log file processing for root cause analysis of a network fabric


Various embodiments provide techniques for generating a virtual wardrobe in which wearing of items can be tracked through computer vision. In various embodiments, computer vision techniques can be used to identify individual clothing items from an image or video of a closet containing a collection of clothes, in which some of the items may be partially obscured, such as positioned behind other items, folded, at an odd viewing angle, shadowed, or the like. Through the present techniques, the clothing items may be automatically cataloged, and utilization of individual items can be tracked automatically based on additional image data of instances in which an item is worn. Various recommendations can then be made based on the attributes of the items in the virtual wardrobe or utilization of the items.

Advancements in electronic commerce (e-commerce) technology have made it more and more convenient for consumers to purchase apparel items. Not only has e-commerce enabled consumers to browse catalogs of an ever-increasing number of retailers, but it has also enabled peer-to-peer marketplaces, which allows users to post items for sale that can be purchased by other users. Such platforms are particularly popular for selling second-hand items. However, although technology has revolutionized the apparel industry, such technology-based advantages typically stop once the consumer receives the goods. For example, optimal organization and utilization of apparel items remains a challenge for consumers. Technology-based solutions have been attempted, such as applications for cataloging the apparel items owned by a user. However, such applications require a great amount of manual data entry by the user, which may be taxing and error prone.

Computer vision based tracking of item utilization


A method and apparatus is provided for the preparation of liquid dispersions comprising the uniform dispersion of a viscous liquid formed of strands, threads or columns, such as a silicone polymer in water.

Mechanically forced dispersion methods using colloid mills are known to be effective methods for generating microparticulate emulsified dispersions of viscous liquids, e.g., silicone polymers, and the like, in water. However, several problems arise with such dispersions prepared by forced dispersion in a colloid mill. Thus, while the viscous liquid can in fact be very finely broken up, the resulting particle diameters are widely scattered and a homogeneously dispersed state cannot be obtained. As a consequence, in order to homogenize the particles, it is necessary after colloid mill processing to carry out an additional supplementary treatment using a power device such as an homogenizer, and the like. This then causes a reduction in productivity as well as an increase in costs.

Method and apparatus for the preparation of a water based dispersion of a viscous liquid


When license information is transferred between a server machine and a client machine, an identifier which is unique to a series of communication sequences is provided. The identifier is sent when a communication is performed between the two machines, as well as when the license information is updated. Therefore, when a message for transferring the license information is received by the use of the same identifier, a response message is returned without updating the license information.

With the development in networks, there are many electronic commerce systems to conduct commercial transactions through networks. In such a commerce system, a certain sort of valuable information such as cash is exchanged between machines on both ends engaged in a communication. Meanwhile, in recent years, a content usage right exchanged between machines in a content distribution system in which contents other than cash are distributed electronically has been witnessed.
In such a license information exchange system between machines, processing to be performed in the event of communication failure is a problem to be tackled, for license information is not to be subjected to unauthorized duplication or loss.
As a conventional license information exchange system with robustness against communication failure, there is a method disclosed in the Mondex patent (U.S. Pat. No. 5,982,293) in which the contents of a communication carried out between machines is recorded as a log so as to restore the exchange procedure of license information in the event of communication failure. Effective when license information is exchanged between two electronic purses, this method has a serious problem when used for a server-client type license information exchange system in which a number of client machines are connected to a single server.
This is because the server needs to communicate with a number of client machines at a time, leading to a highly increased size of the log data, as well as because a server-client communication is far more vulnerable than a communication between electronic purses, which consequently results in a higher occurrence rate of communication failure.
In order to solve these problems, the present invention aims at providing a license information exchange system capable of exchanging license information correctly in a server-client communication for exchanging license information such as content usage license information, even if communication failure occurs in the middle of such communication.
The present invention further aims at providing a license information exchange system capable of reducing the processing load on a license information exchange communication by reducing the number of communications carried out between a server and a client machine, and the number of data writings to a storage device of a server/client machine.

Matsushita Electric Industrial Co., Ltd.


A system for projecting a pattern from a mask onto a substrate comprises a radiation source for emitting a light beam in the extreme ultraviolet wavelength range, a mask including absorbent and reflective structures forming the pattern, a collector mirror and an illumination optical system forming a first part of a beam path in order to direct the light beam onto the mask to produce a patterned light beam, a projection optical system including an arrangement of reflective mirrors forming a second part of the beam path in order to focus the reflected light beam from the mask onto the substrate, and an optical element arranged in the beam path and including at least two regions having different degrees of reflection or transmission. First and second of the regions are assigned to respective different first and second positions on the mask and/or collector mirror in accordance with the beam path.

On account of the progressive reduction of the feature sizes to be formed in semiconductor fabrication, a transition to so-called EUV lithography (EUV: extreme ultraviolet) should be expected in the near future, starting at a feature size of approximately 40 nm or less. EUV lithography makes use of light or radiation having wavelengths in the range of 11 to 14 nm in order to transfer the patterns formed beforehand on masks (EUV masks) onto a substrate (e.g., a semiconductor wafer). The EUV radiation is also referred to as soft X-ray radiation.
Besides the requisite conversion of the resist process, this transition from optical projection lithography used at the present time (deep ultraviolet DUV, 284 nm or 193 nm; far ultraviolet FUV, 157 nm) has the consequence that, owing to the nontransparency of lens systems of conventional materials with respect to the EUV radiation, only mirrors or reflection optical systems can be used in the corresponding exposure devices. Therefore, the beam paths of such devices change considerably. Furthermore, reflection masks should preferably be used in this technology since the conventional quartz masks as transmission masks are also nontransparent with respect to the EUV radiation.
The progressive development furthermore consists in providing materials for the components, such as mirrors, masks, etc., which exhibit no or only insignificant degradation with respect to the high-energy EUV radiation. As long as these degradations have a homogeneous effect over the image field in the case of the mirror components, a reduction of the degree of reflection (the reduction being caused for instance by removal on account of the source particles at the mirror surface) can be compensated for in the simple case by a higher intensity of the radiation source, for example, if the scattering effects that possibly accompany this as a result of the degraded mirror surface can be disregarded here.
Degradations may occur in an inhomogeneous manner, however, precisely at the mirror arranged closest to the radiation source, namely the collector mirror. On the one hand, the local radiation intensity is strongest here and, on the other hand, the collector mirror, since it has to couple out the radiation in a specific direction (e.g., as a parabolic mirror) has a form which necessitates different distances between its mirror surface and the radiation source. As a result, different positions at the mirror surface degrade to different extents, under certain circumstances.
The position of the collector in the beam path of the EUV exposure device is essentially conjugate with respect to the position of the mask. Consequently, inhomogeneities in the degree of reflection of the collector mirror also lead to a nonuniform illumination of the image field of the mask. Fluctuations of the line widths of structure elements that are imaged onto the substrate and are processed there in the resist may be the consequence.
Other components, in particular mirrors in the beam path, may be detrimentally affected and degrade over time, such that an inhomogeneous image field distribution may be the consequence. Previous solutions provide for cost-intensively exchanging the corresponding components upon establishing the cause (i.e., the degradation).
Fluctuations of the line widths on the substrate may also be caused, however, by variations of the widths of the corresponding lines or structure elements on the EUV mask which are present from the outset or arise only in the course of time and of the hard production conditions in the EUV exposure device.
In the case of the EUV masks, besides new production, it would also be possible to perform locally limited repairs on the mask. Large-area applications are ruled out here, however. Moreover, in the case of repair, it is necessary to consider the loss of time for returning the mask to the manufacturer and the suddenly occurring reconfiguration with a subsequent product for the exposure device if the degradation is ascertained only on the end product.
Therefore, there is a need to reduce the influence of degradations of the components in the EUV exposure device on the quality of the exposure process and furthermore to reduce the costs for maintaining quality in semiconductor fabrication via EUV lithography.

System and method for projecting a pattern from a mask onto a substrate


Systems and methods here may be used for automated capturing and analyzing spectrometer data of multiple sample gemstones on a stage, including mapping digital camera image data of samples, applying a Raman Probe to a first sample gemstone under evaluation on the stage, receiving spectrometer data of the sample gemstone from the probe, automatically moving the stage to a second sample, using the image data, and analyzing the other samples.

Raman/photoluminescence and absorption spectroscopies are tools used for gemstone identification and screening. For example, the systems and methods may be used for screening lab-grown diamonds and diamond simulants from natural diamonds as well as identifying the type of the mineral in a gemstone.
Unfortunately, spectroscopy measurement requires accurate sample alignment to overlap the tested sample with the focal spot of the optics. Failure to achieve the accurate alignment may result in weak signal level or even reception of signals from neighboring samples on a given piece of jewelry. And such alignment may be difficult due to use of a strong laser power and the reflected laser beam from polished gemstones. Further complicating the matter, the lasers which are strong enough to generate Raman/photoluminescence signal are far beyond exposure limits for eye safety, so the entire measurement system and the sample may be enclosed in order to meet proper human safety requirements. Traditionally, such human users rely on visually aligning the sample with a laser safety goggle and using the received signal as a reference to back and forth align the sample until maximized the signal. This limitation slows down the alignment process and eliminates automated screening efficiencies.
An alternative method is to couple the spectroscopy system into an optical microscope. Conventional microscope based Raman and absorption spectroscopies with a motorized stage can be used for sample alignment in a fully enclosed environment, however, an optical microscope has relatively small field of view. For example, a low magnification 4× objective lens may have only 2 mm horizontal field of view, which might be even smaller than the tested sample. When measuring multiple samples, such a small field of view may confine the eye sight of a user. In addition, jewelry identification does not need high spatial resolution (<10 μm) provided by the microscope. Each sample may only need one or a small amount of well-aligned measurements. Therefore, using a microscope does not provide the advantage for gemstone screening either. Nor does color get evaluated in such systems.
There is a need for an automated system that allows for efficient testing that is both accurate and able to be used in many different circumstances for multiple testing scenarios.

Imaging assisted scanning spectroscopy for gem identification

Gemological Institute of America, Inc. (GIA)


An alignment device (10) for a prosthetic limb (12) to provide angular movement of the prosthetic limb (12) in an anterior-posterior plane. The alignment device (10) includes a mounting mechanism (24) supported by a prosthetic socket (28), a prosthetic limb (12) operatively connected to the mounting mechanism (24), and an extendable and retractable positioning mechanism (84) operatively connected to the mounting mechanism (24) and the prosthetic limb (12). The prosthetic limb (12) is adapted to move angularly in the anterior-posterior plane upon extension or retraction of the positioning mechanism (84). A hinge connection (606, 610) may be provided between the prosthetic limb (12) and the mounting mechanism (602) to permit the prosthetic limb (12) to rotate about a hinge axis extending through the hinge connection (606, 610). Methods for aligning a prosthetic limb are also disclosed.

The present invention relates generally to prosthetic devices and, more particularly, to an alignment device for providing angular adjustment of a prosthetic limb in forward and rearward directions to obtain a customized fit for the wearer.
Various devices have been developed to provide alignment for prosthetic limbs, such as a prosthetic lower leg worn by a below-the-knee amputee. The limb is typically adjustably attached to a prosthetic knee socket for providing a rigid leg support. The alignment devices are designed to permit angular adjustment of the limb in a forward-rearward plane below the prosthetic knee socket to approximate the proper toe-to-heel pitch and gait for the wearer. Proper fit of the prosthetic limb is necessary for the full range of motion and activity of the wearer to avoid undesirable health risks, particularly in diabetic amputees that are susceptible to irritation in areas on and around the residual limb common to amputees. This irritation primarily results from improper loading on the rigid prosthetic knee socket that causes excessive pressure in areas of the residual limb.
In the past, alignment devices have been designed that mount between a lower end of a prosthetic socket and an upper end of a prosthetic limb. The prosthetic limb may include a leg portion and a leaf-spring foot portion. In general, the leg and foot portions of the prosthetic limb are rigid members, although some elastic energy absorbing members may be provided to help absorb shock as the wearer goes through conventional motions.
In one known alignment approach for prosthetic limbs, such as those of the laminated plate-type as disclosed in U.S. Pat. Nos. 4,547,913 and 4,822,363, the limb is attached to a mounting flange extending downwardly from the prosthetic knee socket. A prosthetist angularly aligns the limb in forward and rearward directions by inserting various angled wedge or shim adaptors between an upper end of the limb and a lower end of the mounting flange. Shim adaptors of varying angles are tested by the prosthetist until one providing the most favorable toe-to-heel pitch and gait for the wearer is identified.
In another known alignment approach, the prosthetic limb is connected to the prosthetic socket through a rotational joint, such as a rotatable socket adaptor or pair of sliding curved plates. During the custom fitting process, the prosthetist rotationally adjusts and aligns the prosthetic limb relative to the knee socket to the desired angular position for proper toe-to-heel pitch and gait. Typically, the alignment procedure requires multiple adjustments to the alignment device with adjustment tools.
In each of the alignment approaches described above, the wearer may be restricted to the toe-to-heel pitch set by the prosthetist after the custom fitting process, and the wearer may have limited ability to readily adjust the angular setting of the limb as may be desired, particularly when changing between shoes of different heel height. When the wearer does attempt to make an alignment adjustment, that adjustment may affect other adjustments already set on the prosthetic limb, thereby adding to the complexity of the adjustment process. To avoid making complex manual adjustments to the alignment device for accommodating shoes of different height, the wearer may insert padding, shims or other adjustment devices into the shoes which improves the fit but may not achieve the optimum toe-to-heel pitch and gait for the particular shoe. Alternatively, the wearer may simply decide to wear shoes of only one heel height.
Thus, there is a need for a prosthetic limb alignment device that is readily manually adjustable by the wearer to optimize the toe-to-heel pitch and gait of the wearer.
There is also a need for a prosthetic limb alignment device that is readily manually adjustable by the wearer to accommodate for shoes of different heel heights while providing the optimum toe-to-heel pitch and gait for the wearer.
There is yet another need for a prosthetic limb alignment device that may be readily manually adjusted by the wearer without requiring adjustment tools.
There is yet also a need for a prosthetic limb adjustment device that is readily manually adjustable without affecting other adjustments set on the prosthetic limb.
The present invention overcomes the foregoing and other shortcomings and drawbacks of alignment devices and methods heretofore known. While the invention will be described in connection with certain embodiments, it will be understood that the invention is not limited to these embodiments. On the contrary, the invention includes all alternatives, modifications and equivalents as may be included within the spirit and scope of the present invention.
In accordance with the principles of the present invention, an alignment device and method are provided for aligning a prosthetic limb worn by an amputee. The alignment device may be used in a below-the-knee amputation environment wherein it is mounted between a lower end of a prosthetic socket and an upper end of a prosthetic limb. The alignment device is particularly designed to provide angular alignment of the prosthetic limb in forward and rearward directions below the knee socket to optimize the toe-to-heel pitch and gait for the wearer as shoes of different height are worn. Other adjustments of the prosthetic limb relative to the prosthetic knee socket are also possible with the alignment device of the present invention.
The alignment device includes a mounting mechanism that is adapted to be affixed to a prosthetic knee socket, mechanical knee or other prosthetic device. A prosthetic limb is operatively connected to the mounting mechanism and is adapted to move in forward and rearward directions in an anterior-posterior plane upon adjustment of the alignment device. An extendable and retractable positioning mechanism is operatively connected to the mounting mechanism and the prosthetic limb. The prosthetic limb is angularly aligned in the anterior-posterior plane upon extension and retraction of the positioning mechanism. The positioning mechanism may include a manually adjustable turnbuckle assembly, hydraulic actuator, electric actuator or other adjustment device that is readily accessible on the alignment device to permit adjustments by the wearer.
The alignment device of the present invention is intended to give the wearer more control and adaptability over the types of shoes that may be worn. The alignment device of the present invention provides the ability to change the loading on the knee socket in such a way that it provides less irritation to areas on or around the residual limb common to amputees. Moreover, the alignment device of the present invention gives the wearer a readily adjustable heel-to-toe configuration without disturbing any other fixed adjustments on the prosthetic limb, and without requiring adjustment tools.
The above and other objects and advantages of the present invention shall be made apparent from the accompanying drawings and the description thereof.