A method for making a layered structure without any defects, including a first support layer, a second support layer, and an adhesive intermediate layer interposed between the first layer and the second layer which is adapted to fix the layers on each other. The intermediate layer embeds operatively at least a three-dimensional macroscopic element being made of crystal glass or precious stones, and the intermediate layer is made of a thermoplastic resin having a melting temperature.

Layered structures such as for example layered or multilayer glass, that comprise at least two layers of glass, or other material, and an adhesive intermediate layer interposed between said two layers, are well-known in the prior art.
Typically, layered glass is made by inserting the adhesive intermediate layer between the two layers of glass under the combined action of heat and pressure for the purpose of fixing the surfaces of the intermediate layer to the glass layers. Specifically, the adhesive intermediate layer is generally made with a transparent thermoplastic resin, also having appropriate characteristics of adhesiveness.
When formed, layered glass has a "sandwich" structure, that is, it behaves like a single whole and, generally, has the transparent appearance of common glass; alternatively, the appearance is semi-transparent or opaque, depending on the characteristics of the glass layers and of the intermediate layer.
Moreover, by modifying the number of layers and their thickness it is possible to obtain various types of layered glass. In fact, the intermediate layer provides appropriate characteristics to the layered glass, that is, it contributes particular further characteristics compared to those of plain glass sheets. For example, the intermediate layer is adapted to increase the mechanical properties of glass for vehicles so as to improve its safety in case of breakage.
In recent years, layered glasses are used to make elements in various fields, such as for example walls or windows in the building industry, support shelves, partition elements or walls in the furniture field, and the like. Alternatively, layered glasses are used to make equipment covers such as, for example, lighting devices, or projection screens. Moreover, in accordance with the development of the applications, standardized regulations have been defined with the purpose of characterizing the mechanical properties of layered glass, such as for example EN 12600:2004 for the building industry.
As the number of applications increases there is a consequent increase in the number of characteristics required of the layered glass, such as for example decorative characteristics and/or functional characteristics, guaranteeing at the same time mechanical properties in accordance with the regulatory requirements for the field of application.
In fact, in some applications it may be desirable that the layered glass, having appropriate mechanical properties, is also provided with a decoration, a decorative pattern, an image, a colour or the like.
Layered glass provided with a colour motif is known, and is generally obtained by means of a coloration of the intermediate layer and/or of the glass sheets.
Alternatively, layered glass provided with decorations or images is generally obtained by applying on a surface of the intermediate layer a film/web having an appropriate decoration/print which, therefore, is interposed between the layers forming the "sandwich". In other words, layered glass obtained in this manner is provided with a film/web of substantially bidimensional structure, that is, provided with a bidimensional element.
In this state, the layered glass may fail to guarantee appropriate decorative, optical or functional characteristics since the bidimensional element could be not perceptible when the layered glass is seen from angles that are flush with its surface.
Moreover, a bidimensional element may not act appropriately with a light used to illuminate the layered glass, that is, it does not reflect or scatter the light in an appropriate manner to provide depth to the visual effect, which could be an important aspect of the decorative, optical or functional characteristic of layered glass.
Specifically, this case occurs when it is necessary to combine the characteristics of the layered glass with additional characteristics, such as reflectivity, transmittance, the refraction index, luminescence, colour, etc., which are associated with one or more surfaces of a three-dimensional element, preferably macroscopic, that is embedded in the intermediate layer.
For example, it may be desirable to make a layered glass, provided with one or more three-dimensional macroscopic elements made of crystal glass or precious stones, having decorative optical or functional characteristics provided by the configuration, the dimensions, the material or the function of the three-dimensional macroscopic elements.
However, making layered glass embedding three-dimensional macroscopic elements proves to be complex when conventional methods are used.
Generally, layered glass is made with a conventional process in which, first of all, glass sheets are cleaned to eliminate the risk of low adhesiveness of the layers in the product.
Subsequently, one or more bidimensional elements, for example decorative ones, and a layer of transparent adhesive resin, that is, an intermediate layer, are arranged between the glass layers. If necessary, using suitable equipment, the excess parts of the intermediate layer with respect to the dimension of the product are removed.
Then, the "sandwich" or "multilayer", is subjected to heating and calendering processes to force the layers to adhere to each other and activate the adhesive properties of the thermoplastic resin of the intermediate layer so as to make the layers integral to each other.
This process, which is suitable for making layered glass embedding bidimensional elements, has however drawbacks during making layered glass embedding three-dimensional macroscopic elements.
In fact, the product made with the traditional processes contains cavities, such as air inclusions, embedded both within the intermediate layer and at the surface separating the three-dimensional macroscopic element and the intermediate layer, resulting in a layered glass that contains defects and is not in accordance with requirements.
These cavities are generated during the heating phases of the intermediate layer since the spatial configuration and the dimensions of the three-dimensional macroscopic element favour the inclusion of air during the heating phases of the forming process.
In fact, when bidimensional elements are used, they are arranged so that their surface area is completely in contact with the surfaces of the layers that form the layered glass. However, this does not occur when three-dimensional macroscopic elements are used since, before a heating phase, the intermediate layer is in contact only with one portion of the whole surface area of each three-dimensional element, leaving gaps that are relatively extensive and therefore tend to include air during the forming process.
Moreover, this drawback is particularly evident when, with a need to embed relatively large three-dimensional macroscopic elements, it is necessary to form an intermediate layer having a relatively large thickness obtained by superimposing a plurality of distinct intermediate layers, and thus increasing as a consequence the probability of forming gaps tending to include air during the forming process.
In fact, typically, the intermediate adhesive layers are marketed in the form of sheets, or rolls, having preset thicknesses and not adapted to embed relatively large three-dimensional macroscopic elements. For example, the intermediate adhesive layers are marketed as sheets having a thickness of 0.3 mm, and the three-dimensional macroscopic elements have preferably dimensions greater than 1 mm.
Note that in layered glass the cavities, that is the air inclusions, are the cause of defects since they define a discontinuity that is visible to the naked eye and that deteriorates the decorative, optical and functional characteristics of the product. Specifically, the presence of cavities modifies both the degree of transparency of the intermediate layer and the decorative, optical or functional characteristics of the three-dimensional macroscopic elements embedded in it. In addition, the cavities generate zones of weakness in the structure, reducing the degree of adhesiveness of the intermediate layer to the glass layers and, consequently, deteriorating the mechanical properties of the layered glass.
Moreover, especially in the forming phases in which pressures are applied, the presence of three-dimensional macroscopic elements induces tensioning stresses that can cause a breakage of the glass layers. In fact, the configuration and the spatial dimensions of the three-dimensional macroscopic element generate, during the forming process, force gradients that remain in the structure of the layered glass and cause its breakage in the forming phase or in moments subsequent thereof.
This drawback is particularly evident when, having to embed relatively large three-dimensional macroscopic elements, it is necessary to form a relatively thick intermediate layer. In fact, without wanting to be bound to any theory, in this case there is an increased probability of generating, during heating and cooling in the forming process, a lack of temperature homogeneity in the structure of the layered glass that generates force gradients which cause, in turn, tensioning stresses.
Moreover, the three-dimensional macroscopic elements are arranged within the layered glass to form an appropriate preset pattern, that is, according to a design, so as to form a geometrical shape, an inscription, a drawing, or are randomly arranged within a determined interval.
However, during the forming phase, the three-dimensional macroscopic elements do not maintain their position with respect to the position established in the design phase. In other words, without wanting to be bound by any theory, the forces applied on the three-dimensional macroscopic elements during the forming process induce displacements of the same with respect to the arrangement provided by design due to the presence of the separation gaps from the intermediate layer, and to the relatively high thickness of the intermediate layer itself. This drawback is not present when bidimensional elements are used since, in this case, their surface area is completely in contact with the layer on which they rest and with the intermediate layer and, therefore, they are maintained in a fixed position during the forming process by means of friction.
Consequently, there is the necessity of developing a method with which can be made a layered structure, such as for example a layered glass, which overcomes the previously described drawbacks. Specifically, there is the necessity of developing a method for making a layered structure embedding three-dimensional macroscopic elements made of crystal glass or precious stones that overcomes the previously described drawbacks.

Method for making a layered structure embedding three-dimensional elements made of crystal glass or precious stones


A connector 110 is provided with a plurality of ferrites 114 and a housing 116 including a plurality of accommodating portions 139 capable of individually accommodating the plurality of ferrites 114 from a first direction. The plurality of accommodating portions 139 are disposed side by side in a second direction intersecting the first direction. Two intermediate walls 138 are disposed between the accommodating portions 139 adjacent in the second direction with a space S defined therebetween in a third direction intersecting the first and second directions.

A connector described in Patent Document 1 below is known as an example of a conventional connector. This connector includes a housing provided with a plurality of connector fitting portions to be respectively fit to a plurality of mating connectors, a plurality of terminals mounted in the housing to project into the respective connector fitting portions, and a noise removing means constituted by a plurality of ferrites provided in the respective connector fitting portions.
The housing is provided with a plurality of frames, and the plurality of ferrites are located in the respective frames of the housing and held in the housing by a pair of biasing arms provided on the housing. Four corners of the ferrites are held by two projecting portions provided on the pair of biasing arms.


Improved techniques for quantifying proximity effects during fabrication of integrated circuits are disclosed. The improved techniques use active features formed on a semiconductor wafer to quantify proximity effects. According to the improved techniques, a device performance quantity for an active feature is measured, and then a feature length for the active feature is determined in accordance with the measured device performance quantity. The fabrication processing can then be evaluated and/or compensated based on the determined feature length. In one example, the active feature can be a metal-oxide semiconductor (MOS) transistor and the device performance quantity can be current.

1. Field of the Invention
The present invention relates to semiconductor fabrication and, more particularly, to compensation for proximity effects that result during fabricating integrated circuits.
2. Description of the Related Art
Photolithography is an important part of fabricating integrated circuits. In photolithography, a light opaque pattern imprinted on a mask or reticle interposed between a radiation source and a photosensitive resist (photoresist) layer on a semiconductor wafer. If the photoresist polarity is positive, the exposed portions of the photoresist with respect to the radiation source are easily dissolved or otherwise removed in a subsequent development step. The unexposed portions of the positive photoresist remain polymerized and will not be removed during the development step. After the exposed portions of the photoresist are dissolved and removed, the resulting wafer uses the remaining patterned photoresist layer as a protective layer to, for example, block the deposition of dopants or to prevent etching of one or more layers underlying the remaining photoresist.
One type of projection photolithographic process uses a mask (containing the entire wafer pattern) which is spaced close to the wafer. In this process, no lens system is required to focus the mask image onto the wafer surface. Another type of projection photolithographic process uses a mask spaced away from the wafer, wherein a lens system interposed between the mask and wafer is used to focus the pattern of the mask onto the entire wafer.
An improved type of projection photolithographic process uses a reticle, which contains a pattern for a single die or a relatively small portion of the wafer. This process uses a stepper, wherein the reticle is mounted typically 50 centimeters to 1 meter from the wafer, and a lens system focuses the reticle pattern on a small portion of the wafer to expose the photoresist. The wafer is then slightly shifted relative to the reticle image, and the exposure process is repeated until substantially the entire wafer has been exposed by the same reticle in a repeated pattern.
As is well known, a major limiting factor in image resolution when using any photolithographic process is the diffraction of light, where light bends around the mask or reticle pattern. Due to diffraction, the mask or reticle pattern is slightly distorted when the pattern image is projected onto the wafer surface. This distortion is often referred to as the proximity effect.
With conventional projection photolithographic methods using conventional masks and reticles, line widths of lines within a dense pattern of lines formed on a wafer surface are narrower than line widths of isolated lines, even though all line widths on the mask or reticle are identical. Such is the case where a positive photoresist is used and the opaque portions of the mask or reticle correspond to the lines and other features to be formed on the wafer surface. Where a negative photoresist is used, causing the clear portions of the mask or reticle to correspond to the lines and other features formed on the wafer surface, the effect would be the opposite.
Thus, the resulting wafer contains feature sizes that are dependent upon whether a feature is isolated or within a dense pattern. This results in unpredictable feature sizes. One skilled in the art of integrated circuit design will be aware of the various problems which may result from unpredictable feature sizes, such as differing electrical characteristics. In any case, the change in feature size due to the impact of other nearby features is known as the proximity effect. Although the following discussion assumes the features are lines, the features can have any geometric shape and are not limited to lines.
FIGS. 1A and 1B are diagrams that illustrate the proximity effect with respect to a simple metalization process. In FIG. 1A, a wafer 10 has an unpatterned layer of silicon dioxide 12 formed on its surface. A metal layer 14, typically aluminum, is then deposited on the surface of wafer 10 over the silicon dioxide 12 using conventional techniques. A layer of positive photoresist is then spun onto the surface of the wafer 10 to completely coat the surface of the wafer. Using well-known techniques, the wafer surface is then selectively exposed to radiation through a reticle in accordance with a reticle pattern. The reticle pattern is represented by light blocking portions 16 and 18, which block light (radiation) from a lamp that is used to expose the photoresist. Downward arrows represent partially coherent radiation 20 from the lamp. A lens 22 focuses the image of the reticle onto the surface of wafer 10. The x-axis of the graph in FIG. 1A represents the distance along the wafer 10 surface, and the y-axis of the graph represents the resulting light intensity on the wafer 10 surface.
As seen by the intensity of light impinging upon the wafer surface, a certain low level of light intensity exists under light blocking portions 16 and 18 due to the diffraction of light, whereby the light waves traveling in straight paths bend around light blocking portions 16 and 18. Thus, additional area of the photoresist is exposed to light due to the diffraction of light. As a result of the diffraction, the light waves from radiation 20 have constructively and destructively interfered with one another as a result of the diffraction of light. Hence, where the light intensity is increased due to constructive interference, the photoresist will be even more exposed. The extent of diffraction is a function of light coherency, numerical aperture of the lens used, and other factors, as known in the art.
It is assumed for purposes of illustration that any photoresist exposed to light above a threshold intensity level L.sub.TH will be dissolved away during development of the photoresist. This threshold light intensity level L.sub.TH is represented on the y-axis of the graph in FIG. 1A.
After the wafer 10 is sufficiently exposed to the light pattern and after the exposed photoresist has been removed, the photoresist portions 24 remain. In this example, the width of photoresist portions 24 is 0.74 microns. Next, the exposed metal layer 14 is anisotropically etched, using well-known techniques, and photoresist portions 24 are thereafter removed with a photoresist stripper. The remaining oxide 12 may then be removed as desired. What remains is a metal pattern including parallel metal lines 26 and 28, whose geometrics are dictated by the geometries of light blocking portions 16 and 18 and by the spaces between the light blocking portions. The width of light blocking portions 16 and 18 corresponds to metal line widths of 0.74 microns. In this example, the pitch or distance between the centers of metal lines 26 and 28 is three microns. Hence, in this example, the pitch of three microns for parallel metal lines 26 and 28 is large enough so that the diffraction from light blocking portion 16 does not influence the shape of metal line 28 and the diffraction from light blocking 18 does not influence the shape of metal line 26.
FIG. 1B illustrates a similar example where metal lines 30, 31 and 32 being patterned have a smaller pitch (i.e., greater density) than did the metal lines 26 and 28 of FIG. 1A. Here, the pitch between metal lines 30, 31 and 32 is 1.5 microns. As illustrated, the resulting lengths of metal lines 30, 31 and 32 are less than 0.74 microns, even though the widths of light blocking portions 40-42 of the reticle are identical to the widths of light blocking portions 16 and 18 in FIG. 1A. This is because light blocking portions 40-42 are situated sufficiently close to one another such that the diffraction from light blocking portions 40 and 42 cause a greater amount of photoresist under the center light blocking portion 41 to be exposed above the threshold intensity L.sub.TH. Also, the diffraction effects from light blocking portion 41 cause a greater amount of photoresist under light blocking portions 40 and 42 to be exposed above the threshold intensity L.sub.TH. Consequently, the metal line 31 is narrower than metal lines 30 and 32, since the length of the metal line 31 is reduced on both sides by the diffraction due to the light blocking portions 40 and 42.
The undesirable consequences of the proximity effect discussed above with reference to FIGS. 1A and 1B are for a representative example. However, it should be understood that the proximity effect is inherent in photolithographic processing regardless of feature geometries or materials.
Additionally, etching features on a semiconductor wafer also leads to undesirable proximity effects. Here, the proximity effect is due not to diffraction of light, but instead due residue polymer or transport of removed material from the surface of the semiconductor surface, for example. In any case, the proximity effect causes the etching process to yield different etch rates depending on whether a feature being etched is isolated from or within a dense pattern of other features. For example, when the features are formed in a dense pattern, the resulting etch rate is higher, whereas when the features are somewhat isolated from one another, the resulting etch rate is lower.
Accordingly, when lithographic and etch processing are utilized in fabricating integrated circuits, the impact of the proximity effect should be monitored and corrected. The monitoring of the proximity effect is conventionally by measuring the lengths of the resulting features that are formed by the lithographic and etch processing. Conventionally, the lengths of the resulting features from the lithography and etch processing are measured by a resistance approach or an electron microscope. The electron microscope can be used to accurately measure lengths but is expensive, time consuming and destructive to the integrated circuit, and thus is often not a practical solution. With the resistance approach, the sheet resistance of the formed features is measured. The sheet resistances are then used to compute the lengths of the formed features. Thereafter, these measured lengths are compared to the intended lengths for the features, and when the deviation is beyond a tolerance level, Optical Proximity Correction (OPC) is performed to alter the mask or reticle to compensate for the proximity effect.
One problem with the conventional resistive approach for measuring the lengths of the features is that in many cases the resistance measured does not accurately correspond to the length of the feature being measured. When this occurs, the lengths that are computed from the measured resistances have a loss of accuracy. As a result, the proximity effect is not able to be accurately quantified.
Thus, there is a need for improved techniques for measuring lengths of features formed on a wafer so that proximity effects can be accurately quantified.

Method for quantifying proximity effect by measuring device performance


A device for securing pieces of luggage in a luggage compartment of a car has a frame having an adjustable size and placeable on a luggage compartment floor, and a floor mat which is impermeable to liquid and is mounted on the frame.

The invention relates to a device for securing pieces of luggage in the luggage compartment of a car.
Devices of this type are known in the art. DE 41 32 954 A1 discloses such a device. This known device has a frame composed of comer pieces. Limbs of the corner pieces are connected to each other in a manner allowing them to be telescoped and fixed in position, so that the size of the frame can be adjusted. The frame can be adapted to the dimensions of the luggage compartment, so that it does not slide out of position during the journey even if it is merely placed onto a luggage compartment floor. Pieces of luggage can be secured to the frame so that they cannot slide out of position or fall over in the luggage compartment. The known device has the disadvantage that it does not protect the luggage compartment against soiling from unintentionally shed loose gods or spilled liquid.

Device for securing pieces of luggage in car luggage compartment

Fischerwerke Artur Fischer GmbH & Co. KG


A system used for alignment of a vehicle suspension and axle includes a pear-shaped cam that is rotatable relative to one of two spaced plates of a hanger bracket. An aperture and nose in the cam plate is aligned with an elongated opening in the bracket plate. The cam further includes a pin that is configured for insertion and movement within an arcuate aperture in the bracket plate. A fastener extends through the aperture and the nose of the cam, through the elongated openings in the bracket plates, and through the suspension control arm. Rotation of the cam causes a corresponding movement of the pin along the arcuate-shaped aperture of the bracket and of the fastener along the elongated openings of the bracket.

1. Field of the Invention
This invention relates to vehicle suspensions and, in particular, to a system used for alignment of a vehicle suspension and axle.
2. Disclosure of Related Art
In a conventional vehicle suspension system, a suspension control arm has a first end rigidly connected to an axle of the vehicle and a second end pivotally connected to a bracket descending from the vehicle frame. The second end of the control arm may terminate in a bushing. The bracket generally includes first and second spaced walls that receive the bushing therebetween. A fastener extends through the first wall of the bracket, through the bushing, and through the second wall of the bracket. The fastener may also extend through one or more washers disposed on either side of the bushing between the first and second walls of the bracket. A nut is used to secure the fastener in place relative to the bracket and the control arm pivots about the fastener.
Conventional suspension systems must be aligned in a fore-aft direction to adjust the fore-aft position of the axle relative to the vehicle frame and thereby align the wheels that are supported on the axle. Improper alignment may lead to premature tire wear among other problems. In most conventional suspension systems, alignment is achieved by moving the control arm relative to the bracket descending from the frame. Each of the spaced walls of the bracket generally includes an elongated slot having a major axis that is parallel to the longitudinal direction of the vehicle. The fastener upon which the control arm pivots is moved within these slots to cause corresponding movement in the suspension control arm and axle. In some conventional suspension systems, a weld collar is disposed about the fastener and the position of the collar is adjusted to move the fastener. The collar is then welded to the frame bracket once proper alignment is achieved. These conventional systems are disadvantageous because realignment of the suspension and axle requires removal of the existing welds and the installation of new welds—a process that requires a relatively large amount of time. In other conventional suspension systems, an eccentric cam is disposed about the fastener and the cam is guided by one or more guides on the frame bracket. Rotation of the cam causes displacement of the fastener within the slots of the frame bracket and thereby adjusts the alignment of the suspension and axle. Although these latter systems enable the suspension to be realigned in a relatively short period of time, the systems require additional components and machining of existing suspension components thereby increasing the cost, weight, and complexity of the suspension. These alignment systems may also have a relatively low load capacity that discourages their use with trailers and other high load vehicles.
The inventors herein have recognized a need for a vehicle suspension that will minimize or eliminate one or more of the above-mentioned deficiencies.


Present invention provides a toner for developing static charge images to the surface of which is adhered powder of aluminum oxide in the amount of 0.01% to 5% by weight. This aluminum oxide has a specific surface area of not less than 80 m.sup.2 /g as measured by BET method, and absorptional CO.sub.2 gas pieces of not more than 4.0 pieces/nm.sup.2.

1. Field of the Invention
The present invention relates to a toner for developing static charge images in an electrophotographic method, an electrostatic-printing recording method, and the like.
2. Description of Related Arts
In general, a toner having a negative charge property for developing static charge images, used in an electrophotographic method, is necessary for good fluidity. Therefore, on its surface, one or more agents for the fluidization is adhered. Further, the toner is used together with an iron powder or a ferrite carrier for developing static charge images so as to have optimal charge which is necessary to develop the images.
It has been known that powders of silica, titanium oxide, etc. are used as agents for the fluidization of the toner. When silica is used, the toner has a good fluidity. However, in this case, a decline of the image concentrations often occurs extended usage due to increased charge quantity. Further, the dependency of the humidity becomes stronger. Accordingly, in the condition of low humidity, a decline of the image concentrations particularly occurs due to marked increase of the charge quantity.
Alternatively, when titanium oxide is used, it can be suppressed to increase the charge quantity in the condition of low humidity, but the decrease in charge quantity, in the condition of high humidity, causes various problems, for example an increase in fog density and splashing of the toner.
In a color toner having a positive charged property for developing static charge images, a colloidal silica is generally used as the agent for the fluidization.
However, colloidal silica has essentially a strong negative charge property. Accordingly, during mixing with the carrier in the developing machine, the original charge quantity of the toner decreases, so that a toner using colloidal silica encounters various problems such as increase in fog density, splashing of the toner, and shortening of the developer's life due to lie the fluidizing agent in the developer.
In particular, the charging property of the color toner which includes a quaternary ammonium salt or a polyamine resin, is easily affected by the negative charge property of colloidal silica, and thus fogging and splashing of the toner during the development occurs frequently.
Further, when the color toner, on the surface of which the colloidal silica is adhered, is developed in the condition of high temperature and high humidity, the charge quantity of the toner decreases due to the moisture adsorption of the colloidal silica, causing various problems such as an increase of fog density. Additionally, in the condition of low temperature and low humidity, other various problems occur such as the decrease of the image concentrations due to increase of the charge quantity.

Toner for developing static charge images


Systems, methods, and devices for humidifying a breathing gas are presented. The system includes a source of pressurized breathing gas, a vapor transfer unit external to the source of pressurized breathing gas, a first gas tube connecting the source of pressurized breathing gas to the gas inlet of the vapor transfer unit and having a first length, a liquid supply having a heater that heats liquid, a first liquid tube coupling the liquid supply to the liquid inlet of the vapor transfer unit, and a second gas tube having a second length and connecting the gas outlet to a patient interface. The first length is greater than the second length. The vapor transfer unit includes a gas passage, a liquid passage, and a membrane separating the gas passage and the liquid passage. The membrane is positioned to transfer vapor from the liquid passage to the gas passage.

Patients with respiratory ailments are often treated with respiratory assist devices that deliver supplemental breathing gas to the patient. Such devices may deliver gas to the patient using high flow therapy (HFT). HFT devices deliver breathing gas at a high flow rate via an interface such as a nasal cannula to increase the patient's fraction of inspired oxygen (FiO2), decrease the patient's work of breathing, or do both. That helps the patient recover from respiratory ailments, such as respiratory distress or bronchospasms. Some HFT devices heat and humidify the delivered breathing gas for medical reasons (e.g., to maintain the pliability of the tissues of surfactant-deficient patients, or to preserve mucosal integrity) or to reduce patient discomfort.
A challenge associated with delivering breathing gas via a high-flow system is managing heated and humidified gas that is carried to the patient. During transport of heated and humidified breathing gas, moisture from the heated and humidified breathing gas can condense and form liquid droplets. Condensation in a ventilation circuit presents both clinical and mechanical challenges. The condensate can accumulate in the gas circuit and thus limit flow through the system. Movement of accumulated condensate liquid in the gas circuit into the patient can present a risk of aspiration. Additionally, the condensate can collect and stagnate, posing a biohazard.
One solution is to heat the tube carrying the humidified breathing gas from a supply unit to a patient interface. The heating can be done using a heated water jacket or using a heated wire disposed within the tube. Tubes with heated water jackets can be heavy due to the weight of the water in the tubes. Additionally, tubes with heated water jackets require a pump capable of circulating the heated water through the tube, which increases the overall complexity and cost of the respiratory therapy system. Additionally, tubes having heated wires require a connection to an electrical power source which adds to the complexity and cost of the respiratory therapy system. Heated wires present in a tube may also pose a safety hazard if the wires overheat.

This patent is subject to a terminal disclaimer.

Systems and methods for patient-proximate vapor transfer for respiratory therapy


The present invention relates to the use of DNA methylation profiles of patient samples for the diagnosis, prognosis and/or therapy monitoring of a heart disease in a patient, wherein the DNA methylation profile of the patient sample is compared with the DNA methylation profile of a control sample, and wherein a difference in the DNA methylation profile of the patient sample compared to the control sample is indicative of a heart disease or of the risk for developing a heart disease or for a prediction of therapy effects or therapy outcome. The present invention further relates to methods for the diagnosis, prognosis and/or therapy monitoring of a heart disease in a patient, comprising determining the DNA methylation profile in a patient sample comprising genomic DNA from heart cells, heart tissue or peripheral blood; and comparing the DNA methylation profile in the patient sample with the DNA methylation profile from a normal subject not having a heart disease or having a normal heart function. The present invention furthermore relates to kits that are suitable for the methods and uses of the invention. The present invention furthermore relates to the use of ADORA2A, ERBB3, LY75, HOXB13, GF11, CLDN4, FDX1, ID4, NAT1, PPARGC1A, SULF2, TFF1, TKT, ATP2C, CCDC59, GSTM5m, SLC9A6 and TDG as marker for the diagnosis, prognosis and/or therapy monitoring of a heart disease in a patient.

Cardiomyopathy is the deterioration of the function of the myocardium for any reason. People with cardiomyopathy are at risk of heart failure, arrhythmia and/or sudden cardiac death. Cardiomyopathy can often go undetected, making it especially dangerous to carriers of the disease. Cardiomyopathies can be categorized as extrinsic or intrinsic. An extrinsic cardiomyopathy is a cardiomyopathy where the primary pathology is outside the myocardium itself. Most cardiomyopathies are extrinsic, because by far the most common cause of a cardiomyopathy is ischemia. The World Health Organization calls these specific cardiomyopathies. An intrinsic cardiomyopathy is defined as weakness in the muscle of the heart that is not due to an identifiable external cause. This definition was used to categorize previously idiopathic cardiomyopathies although specific external causes have since been identified for many. The intrinsic cardiomyopathies consist of a variety of disease states, each with their own causes. Many intrinsic cardiomyopathies now have identifiable external causes including ischemia, drug and alcohol toxicity, viral infections and various genetic and idiopathic causes.
Dilated cardiomyopathy is one of the most frequent heart muscle diseases with an estimated prevalence of 1:2500. The progressive nature of this disorder is responsible for about 30-40% of all heart failure cases and is the main cause for heart transplantation in young adults. In the last decades, it was recognized that DCM has a substantial genetic contribution. It is estimated that about 30-40% of all DCM cases have a familial aggregation and until now more than 40 different genes were found to cause monogenetic DCM. However, since the course of the disease is highly variable and only a fraction of patients suffer a causal mutation, genetic modifiers are thought to play an important role (Friedrichs et al., 2009; Villard et al., 2011). Accordingly, several studies have now identified common genetic polymorphisms, which are associated with DCM or heart failure (Friedrichs et al., 2009; Villard et al., 2011). But even then, the existence of such modifiers also does not completely explain the high variability in phenotypic expression and unexplained cases of DCM.
Epigenetic mechanisms play important roles during normal development, aging and a variety of disease conditions. Numerous studies have implicated aberrant methylation in the etiology of human diseases, including cancer, MS and diabetes. Hypermethylation of CpG islands located in promoter regions of tumor suppressor genes is firmly established as the most frequent mechanism for gene activation in cancers.
Briefly, methylation of the 5′ carbon of cytosine is a form of epigenetic modification that does not affect the primary DNA sequence, but affects secondary interactions that play a critical role in the regulation of gene expression. Aberrant DNA methylation may suppress transcription and subsequently gene expression.
Disease modification through epigenetic alterations has been convincingly demonstrated for different diseases (Jones and Baylin, 2002; Feinberg and Tycko, 2004). In the cardiovascular system, histone modifications and chromatin remodelling are thought to direct adaptive as well as maladaptive molecular pathways in cardiac hypertrophy and failure (Montgomery et al., 2007) and DNA methylation was found to be responsible for the hypermutability of distinct cardiac genes (Meurs and Kuan, 2011). Furthermore, recent studies have highlighted the potential interplay between environmental factors and the disease phenotype by epigenetic mechanisms (Jirtle and Skinner, 2007; Herceg and Vaissiere, 2011). However, the knowledge about the impact of epigenetic alterations on the disease phenotype in human patients is still very limited.
Thus, epigenetic mechanisms are increasingly recognized as contributors to human disease. Surprisingly, most studies conducted so far have focused on cancer and only few have investigated the role of epigenetic mechanisms, especially DNA methylation in cardiovascular disease (Movassagh et al., 2011). However, epigenetic mechanisms are thought to control key processes such as cardiac hypertrophy, fibrosis and failure (Backs et al., 2006; Backs et al., 2008).
Furthermore, the decision to initiate or escalate therapies (drugs, devices, surgical interventions) is currently based on assumptions and supported only by few diagnostic measures (Bielecka-Dabrowa et al., 2008).
There is a need for diagnostic means and methods that not only allow the detection of a heart disease but also allow to draw conclusions about the further development of an existing heart disease or whether a heart disease will develop in a patient.

Epigenetic signatures as marker for cardiomyopathies and myocardial insufficiencies


Disclosed herein are zirconium-based alloys and methods of fabricating nuclear reactor components, particularly fuel cladding tubes, from such alloys that exhibit improved corrosion resistance in aggressive coolant compositions. The fabrication steps include a late-stage β-treatment on the outer region of the tubes. The zirconium-based alloys will include between about 1.30 and 1.60 wt % tin; between about 0.06 and 0.15 wt % chromium; between about 0.16 and 0.24 wt % iron, and between 0.05 and 0.08 wt % nickel, with the total content of the iron, chromium and nickel comprising above about 0.31 wt % of the alloy and will be characterized by second phase precipitates having an average size typically less than about 40 nm. The final finished cladding will have a surface roughness of less than about 0.50 μm Ra and preferably less then about 0.10 μm Ra.

1. Field of the Invention
The present invention relates to zirconium alloys, particularly, to zirconium alloys for use in fuel cladding and structural applications within nuclear reactor vessels, and, more particularly, to zirconium alloys having improved corrosion resistance in aggressive water chemistry environments during the operation of boiling water reactors (BWR) and may have some utility in pressurized water reactors (PWR).
2. Background Art
Nuclear reactors are used in electric power generation, research and propulsion. A reactor pressure vessel contains the reactor coolant, i.e., water, which removes heat from the nuclear core. Piping circuits are used to carry the heated water or steam from the pressure vessel to the steam generators or turbines and to return or supply circulated water or feedwater to the pressure vessel. Typical operating pressures and temperatures for the reactor pressure vessels can be about 7 MPa and 288° C. for BWRs and about 15 MPa and 320° C. for PWRs. The materials used in these respective environments must, in turn, be formulated and/or manufactured to withstand various loading, environmental (high-temperature water, oxidizing species, radicals, etc.) and radiation conditions to which they will be subjected during extended operation of the reactor.
BWR and PWR typically include nuclear fuel sealed in cladding comprising one or more layers of metal or metal alloys to isolate the nuclear fuel from the moderator/coolant system, i.e., water in PWRs and steam and/or water in BWRs. The cladding typically includes at least one layer of a zirconium-based alloy including one or more alloying element and include layers of both a zirconium alloy and unalloyed zirconium. Cladding may also utilize a composite system having an inner lining of sponge zirconium or dilute zirconium alloy containing minor amounts, less than about 0.5 wt % of iron or other elements, as alloying metals. Typically, the cladding will be configured as a tube in which pellets of the nuclear fuel are stacked to fill substantially the entire length of the cladding tube. The tubes will then be arranged in bundles, with a plurality of bundles being arranged to define the reactor core.
Under normal operating conditions, zirconium-based alloys are useful as a nuclear fuel cladding material due to their relatively low neutron absorption cross sections and, at temperatures below about 398° C., their strength, ductility, stability, and lack of reactivity in the presence of demineralized water or steam. "Zircaloys" are a widely used family of commercially-available, corrosion-resistant, zirconium-based alloy cladding materials that include 97-99% by weight zirconium, with the balance being a mixture of tin, iron, chromium, nickel and oxygen. Two particular alloy compositions, specifically Zircaloy-2 and Zircaloy-4, are widely used for manufacturing cladding although Zircaloy-2 is the more commonly utilized composition for BWR applications.
In addition to zirconium, Zircaloy-2 includes about 1.2-1.7 wt % Sn; 0.07-0.20 wt % Fe; 0.05-0.15 wt % Cr, and 0.03-0.08 wt % Ni. Zircaloy-4, on the other hand, although including similar quantities of the other alloying elements present in Zircaloy-2, is substantially free of nickel and has an Fe concentration of about 0.18-0.24 wt %.
The presence of these alloying elements, which are relatively insoluble in zirconium under normal conditions, will generally result in the formation of Second Phase Particle (SPP) "precipitates" in an α-phase zirconium matrix. Under equilibrium conditions, the alloy matrix will be a single phase with the alloying elements present at concentrations at or near their respective solubility limits. The formation of precipitates results from the presence of alloying elements in concentrations above their solubility limits. For example, the precipitates most commonly found in Zircaloys may be generally represented by the chemical formulas Zr(Fe,Cr)2 and Zr2(Fe,Ni).
Cladding corrosion occurs in both BWRs and PWRs with the corrosion typically occurring in nodular or uniform forms. Corrosion in nodular form is generally more prevalent in BWRs. Nodular corrosion is usually a porous near-stoichiometric zirconium oxide forming on the surface of the cladding. It can rapidly cover the entire surface of the Zircaloys in small, localized patches (referred to as "nodules" or "pustules") with thinner uniform corrosion in between. Uniform corrosion tends to be more prevalent in PWRs, and typically consists of a uniform layer of zirconium oxide forming on the surface of the cladding. The uniform layer typically contains a small excess of zirconium, appears as a black or gray film and exhibits semiconductive properties.
Normally the degree of uniform or nodular corrosion is acceptable and does not limit nuclear reactor operations. In some low frequency abnormal circumstances the degree of corrosion can become excessive and lead to through-wall cladding penetration and thus release highly radioactive species to the coolant and limit reactor operation.
Some corrosion failure mechanisms are now understood well enough to limit their occurrence. One such mechanism that occurs in BWRs is known as Crud Induced Localized Corrosion ("CILC"). The CILC mechanism involves a combination of cladding susceptible to nodular corrosion and a high concentration of copper in the coolant. The primary source of copper is from corrosion dissolution of brass materials used in steam condenser construction. Copper infiltrates the nodular oxide layer and creates a localized region that has low thermal conductivity thus leading to localized overheating and accelerated corrosion.
The problem of CILC has been addressed by controlling the coolant purity and minimizing cladding nodular corrosion. To control the coolant purity, steam condensers have been replaced with non-copper bearing materials, filtering systems optimized for copper removal are available, and monitoring for copper levels has been established. To minimize cladding nodular corrosion, processes that produce a fine SPP size (i.e., use of β or α+β heat treatments followed by low thermal input to prevent Ostwald ripening) have been implemented and preferable elemental compositions within the ASTM Zircaloy specification have been defined.
As will be appreciated, corrosion control and prevention is extremely important for the safe operation of nuclear reactors and corrosion-induced component failures have the potential for causing serious injury, reactor downtime and reduced efficiency. The physical, chemical and electrochemical interactions between the reactor components and the aqueous environment to which they are exposed during reactor operations are, understandably, significant factors for understanding and controlling corrosion. Accordingly, both the composition and surface conditioning of the reactor components and the composition and purity of the coolant water must be considered and an appropriate combination utilized to provide improved corrosion control.
Indeed, unacceptable levels of corrosion have been attributed to the presence of aggressive water chemistry conditions and its deleterious effect on fuel cladding materials. It is also believed that temporary excursions from the preferred reactor operating conditions can result in greatly accelerated corrosion rates. Thus, although the fuel cladding utilized in a reactor may have been processed in accord with the best practices recognized in the prior art for controlling corrosion, the use of such materials in aggressive water chemistry conditions and/or its exposure to periodic excursions may result in unacceptable corrosion rates, thereby increasing the risk of corrosion failures and the maintenance cost. The prior art knowledge includes alloy compositions within the ASTM specification for Zircaloy-2 as well as other Zr-based alloys such as that described in U.S. Pat. No. 4,664,727, a late stage solution heat treatment as outlined by U.S. Pat. Nos. 4,450,016, 4,576,654, and 5,437,747, restricted thermal input subsequent to the solution heat treatment as outlined by Japanese Patent Publications No. 3172731/2001. Despite the knowledge and development efforts represented by these prior art references, corrosion and the risk of corrosion failures is a continuing problem in the nuclear industry that past experience, design specifications and controls have not been able to eliminate completely. Further improvements toward preventing or suppressing corrosion remain necessary to achieve the goal of 100% fuel reliability desired for improved nuclear reactor operation and reduced maintenance costs, particularly in reactor systems that are, or may be, exposed to aggressive water chemistry conditions, whether the result of intentional addition of water conditioning packages, local conditions and/or episodic excursions from the desired water chemistry. As a result, there remains a need for improved cladding materials that can increase the operating margin of a reactor system by providing improved resistance to aggressive water chemistry environments.
Unfortunately, the particular chemistry and/or the particular condition that produce an aggressive water condition within the reactor water environment is often not well characterized, particularly in the event of excursions from standard operating conditions, such that variations in Zircaloy corrosion performance can occur between BWRs that operate with similar nominal reactor water chemistry. Transient aggressive environments, where one or more chemical species, known or unknown, are inadvertently introduced to the reactor coolant over a short period of time are, by their nature, difficult to detect and quantify. Robust cladding that can tolerate aggressive water chemistry environments without incurring unacceptable corrosion rates and increased risk of failure is highly desirable.
Impurities may be unintentionally introduced into the reactor water by various means such as spilling of cutting, cleaning, or hydraulic fluids, leaking of steam condenser tubes that carry impure secondary cooling water, incomplete cleaning following piping chemical decontamination operations, and/or compromised filtering equipment. Impurities from such sources may be in such low concentration that they go undetected and yet may still trigger accelerated cladding corrosion.
The corrosion kinetics of zirconium alloys typically exhibit two stages, for alloys such as the Zircaloys that contain SPPs of relatively insoluble transition metals such as Fe, Cr, Ni, V, etc. The initial corrosion typically comprises the diffusion-limited growth of a thin oxide film on the metal surfaces. Once this oxide film exceeds a thickness of about 2 μm, the film formation can begin to break down and may transition to an approximately linear growth phase with the multiple stages of diffusion-limited growth and breakdown occurring over extended exposure periods.
Previous approaches for controlling corrosion have included various modifications to the concentrations of alloying elements (particularly iron and nickel) in Zircaloy alloys to reduce the severity of nodular corrosion by increasing the availability of aliovalent ions that, in turn, improves the uniformity of the oxide.
The SPPs play an important role in the corrosion behavior of the alloy(s) in which they are formed with the precipitate composition, average precipitate size and the precipitate distribution (i.e., the interparticle spacing) affecting, perhaps significantly, the corrosion properties of the particular alloy. An approach commonly pursued in parallel with alloy chemistry control involves controlling the size and distribution of the SPPs, particularly within the surface regions of the reactor fuel assembly components. As a result of the difference in corrosion mechanisms acting in BWRs and PWRs, conventional Zircaloy cladding compositions are prepared differently with those intended for use in PWR applications being subjected to higher temperature anneals and slow quenches (less than 5° C./second) to produce relatively larger precipitate sizing. Conversely, cladding compositions intended for use in BWR applications utilizing lower temperature anneals and with fast quenches (greater than 5° C./second and more typically greater than 20° C./second) to produce relatively smaller precipitate sizing.
To improve the intergranular and intragranular distribution of SPPs within Zr—Sn—Fe alloys of the present invention, the alloy may be heated into the β-phase temperature range, e.g., above about 1000° C., to form a solid solution that is substantially free of SPPs. The β-phase alloy can then be rapidly quenched to produce a substantially diffusionless martensitic transformation, particularly in the surface regions exposed to the quenching composition. By cooling the alloy rapidly, i.e., a rate greater than about 500° C./second, through the α+β-phase temperature range, approximately 825-965° C., and into the α-phase range, typically below about 800° C., the alloying elements will tend to remain in a supersaturated metastable solution in the zirconium matrix. At slower cooling rates, however, the alloying elements will tend to nucleate and grow SPPs whose final size depends on the cooling rate, with slower quench rates resulting in relatively larger SPPs. Subsequent heat treatments in the α-phase after the rapid quench will allow Zr(Fe, Cr)2 and Zr2(Fe, Ni) SPPs to grow, or to nucleate and grow from the metastable solid solution. Although the size and distribution of SPPs can be controlled to some extent by thermal-mechanical processing, in order to prevent excessive growth of the SPPs it is necessary to limit the subsequent thermal exposure of a Zircaloy component after an initial heat treatment to dissolve the SPPs.
Accordingly, zirconium alloys are now extensively used as fuel cladding materials and fuel assembly materials in BWRs, PWRs and other nuclear applications. As noted above, two of the most common zirconium alloys in use are Zircaloy-2 and Zircaloy-4. Additional details regarding the specific alloys corresponding to Zircaloy-2 and Zircaloy-4, are provided in U.S. Pat. Nos. 2,772,964 and 3,148,055, the disclosures of which are hereby incorporated by reference in their entirety.
In addition to the basic composition of the alloy, conventional techniques for reducing or preventing nodular corrosion include heat treatment methods in which an alloy is heated, for a short period of time, to a temperature at which the alloy exists in α+β or β phase, after which the alloy is rapidly quenched, to control the microstructure. Such a process is described in Japanese Patent Publications Nos. 45699/1986 and 58223/1988 and the application of such a method in connection with a particular alloy composition is detailed in Japanese Laid-Open Patent Publications Nos. 43450/1985 and 228442/1987. Similarly, another approach for providing improved nodular corrosion resistance involves applying a heat treatment to only the outer region of the cladding tube as detailed in U.S. Pat. No. 4,576,654.
In order to continue improving the cladding performance and reactor efficiency, there continues to be a need to develop zirconium alloys that have increased corrosion resistance in adverse water chemistry conditions and can be manufactured efficiently and economically.

Zirconium alloy fuel cladding for operation in aggressive water chemistry


Embodiments of apparatuses, methods, and systems for guests to access memory mapped devices are disclosed. In one embodiment, an apparatus includes evaluation logic and exit logic. The evaluation logic is to determine, in response to an attempt of a guest to access a device using a memory address mapped to the device and based on an access type, whether the access is allowed. The exit logic is to transfer control to a host if the evaluation logic determines that the access is not allowed.

1. Field
The present disclosure pertains to the field of information processing, and more particularly, to the field of virtualizing resources in information processing systems.
2. Description of Related Art
Generally, the concept of virtualization of resources in information processing systems allows multiple instances of one or more operating systems (each, an "OS") to run on a single information processing system, even though each OS is designed to have complete, direct control over the system and its resources. Virtualization is typically implemented by using software (e.g., a virtual machine monitor, or a "VMM") to present to each OS a "virtual machine" ("VM") having virtual resources that the OS may completely and directly control, while the VMM maintains a system environment for implementing virtualization policies such as sharing and/or allocating the physical resources among the VMs (the "virtualization environment"). Each OS, and any other software, that runs on a VM is referred to as a "guest" or as "guest software," while a "host" or "host software" is software, such as a VMM, that runs outside of, and may or may not be aware of, the virtualization environment.
A processor in an information processing system may support virtualization, for example, by supporting an instruction to enter a virtualization environment to run a guest on a VM. In the virtualization environment, certain events, operations, and situations, such as external interrupts or attempts to access privileged registers or resources, may be "intercepted," i.e., cause the processor to exit the virtualization environment so that a VMM may operate, for example, to implement virtualization policies. A processor may also support other instructions for maintaining a virtualization environment, and may include register bits that indicate or control virtualization capabilities of the processor.
The system's privileged resources may include input/output ("I/O") devices that may be accessed through I/O transactions and/or through memory transactions where the I/O device has been mapped to a memory address (a "memory mapped device"). I/O transactions may be intercepted to prevent a guest from directly accessing an I/O device. Memory transactions to memory-mapped I/O devices may be intercepted in a page-based memory management architecture by marking pages to which an I/O device has been mapped as not present or not writable, thereby causing a page fault intercept if a guest attempts to access the memory mapped device.

Method and apparatus for a guest to access a memory mapped device


A system and machine-implemented method for handling an unexpected error associated with an application are disclosed. The subject disclosure provides for sending, from a client running a client application, an instruction to an application server hosting a server application associated with the client application, detecting an unexpected error in response to the sent instruction, automatically requesting, from the application server, an updated version of application code for the client application in response to the detected unexpected error, receiving the updated version of application code and updating the client application using the updated version of application code.

When application upgrades are created that change communication protocols or other aspects of an application, outdated client applications can malfunction and cause a degraded user experience. In conventional systems, an error or crash can be analyzed by a back-end application server, another application, or a third party server. Based on the analysis of the error or crash, a pre-selected patch corresponding to the analyzed error can be selected for the malfunctioning application to fix the problem. However, the cause of the error or crash is frequently misdiagnosed, and, while the error is being evaluated and a proper patch selected, the user's access to the application may be interrupted or restricted for extended periods of time.
It is, therefore, desirable to improve the currently available options to provide an improved process for handling application errors and crashes.

Automated application update checks based on unexpected errors and crashes


A photomultiplier tube having an electron multiplier comprising a dynode with an attachment lip (10) which is introduced into a slot (20) which is formed in a supporting board (30), the said slot (20) comprising, on the one hand, two outer supporting points (21a, 21b) against which the said attachment lip (10) bears with a first surface (11), and which supporting points have rounded end portions (22a, 22b) and, in addition, at least one central supporting point (23) on which the said attachment lip (10) abuts via a second face (12), which slot (20) comprises holes (24a, 24b, 25) which are located opposite the said outer supporting points (21a, 21b) and the central supporting point (23).

The invention relates to a photomultiplier tube comprising an electron multiplier assembly having supports provided with a plurality of slots and a plurality of electrodes attached to the supports by means of attachment lips which are each disposed inside a respective slot.
The invention can be very advantageously used, for example, in the field of photomultiplier tubes when electrodes, called dynodes, are to be kept in slots formed in insulating supports which are also used as spacers.
Various supports for holding dynodes, as described in the opening paragraph, are known, for example, a supporting board having narrow slots and a dynode with an attachment lip whose end portion is bent after insertion into the slot. Another interesting support however, comprises wide slots which cooperate with a protrusion formed on the attachment lip whose end portion may alternatively be bent.
The present state-of-the-art photomultiplier tubes having supporting boards, however, all have drawbacks. The manufacture of a supporting board having narrow slots is a difficult and costly operation; moreover, its application is difficult because introducing anattachment lip into a narrow slot is a delicate operation for the person entrusted therewith. On the other hand, it is much simpler to produce a wide slot because of the larger tolerances, however, a special shape will nevertheless have to be imparted to the attachment lip, such as the formation of a protrusion, which increases the cost of the holding device. In addition, in the two examples described above, the bending of the end portion of the attachment lip after its insertion renders the use of the photomultiplier tube more complex and hence more costly.

Photomultiplier tube with electrode supports


An apparatus and method for encoding quantized frequency represented data wherein the data comprised zero and non-zero represented data. For zero represented data, a zero run length is determined. A Golomb parameter is determined as a function of the zero run length. A quotient is encoded as a function of the zero run length, and the Golomb parameter. A remainder is encoded as a function of the zero run length, the Golomb parameter and the quotient. The coded quotient and the coded remainder are concatenated. For non-zero represented data, the nonzero data is encoded as a function of the non-zero data value and the sign of the non-zero data value.

I. Field of the Invention
The present invention relates to image processing and compression. More specifically, the present invention relates to a coding of DCT coefficients using Golomb-Rice.
II. Description of the Related Art
Digital picture processing has a prominent position in the general discipline of digital signal processing. The importance of human visual perception has encouraged tremendous interest and advances in the art and science of digital picture processing. In the field of transmission and reception of video signals, such as those used for projecting films or movies, various improvements are being made to image compression techniques. Many of the current and proposed video systems make use of digital encoding techniques. Aspects of this field include image coding, image restoration, and image feature selection. Image coding represents the attempts to transmit pictures of digital communication channels in an efficient manner, making use of as few bits as possible to minimize the band width required, while at the same time, maintaining distortions within certain limits. Image restoration represents efforts to recover the true image of the object. The coded image being transmitted over a communication channel may have been distorted by various factors. Source of degradation may have arisen originally in creating the image from the object. Feature selection refers to the selection of certain attributes of the picture. Such attributes may be required in the recognition, classification, and decision in a wider context.
Digital encoding of video, such as that in digital cinema, is an area that benefits from improved image compression techniques. Digital image compression may be generally classified into two categories: loss-less and lossy methods. A loss-less image is recovered without any loss of information. A lossy method involves an irrecoverable loss of some information, depending upon the compression ratio, the quality of the compression algorithm, and the implementation of the algorithm. Generally, lossy compression approaches are considered to obtain the compression ratios desired for a cost-effective digital cinema approach. To achieve digital cinema quality levels, the compression approach should provide a visually loss-less level of performance. As such, although there is a mathematical loss of information as a result of the compression process, the image distortion caused by this loss should be imperceptible to a viewer under normal viewing conditions.
Existing digital image compression technologies have been developed for other applications, namely for television systems. Such technologies have made design compromises appropriate for the intended application, but do not meet the quality requirements needed for cinema presentation.
Digital cinema compression technology should provide the visual quality that a moviegoer has previously experienced. Ideally, the visual quality of digital cinema should attempt to exceed that of a high-quality release print film. At the same time, the compression technique should have high coding efficiency to be practical. As defined herein, coding efficiency refers to the bit rate needed for the compressed image quality to meet a certain qualitative level. Moreover, the system and coding technique should have built-in flexibility to accommodate different formats and should be cost effective; that is, a small-sized and efficient decoder or encoder process.
Many compression techniques available offer significant levels of compression, but result in a degradation of the quality of the video signal. Typically, techniques for transferring compressed information require the compressed information to be transferred at a constant bit rate.
One compression technique capable of offering significant levels of compression while preserving the desired level of quality for video signals utilizes adaptively sized blocks and sub-blocks of encoded Discrete Cosine Transform (DCT) coefficient data. This technique will hereinafter be referred to as the Adaptive Block Size Discrete Cosine Transform (ABSDCT) method. This technique is disclosed in U.S. Pat. No. 5,021,891, entitled xe2x80x9cAdaptive Block Size Image Compression Method And System,xe2x80x9d assigned to the assignee of the present invention and incorporated herein by reference.
DCT techniques are also disclosed in U.S. Pat. No. 5,107,345, entitled xe2x80x9cAdaptive Block Size Image Compression Method And System,xe2x80x9d assigned to the assignee of the present invention and incorporated herein by reference. Further, the use of the ABSDCT technique in combination with a Differential Quadtree Transform technique is discussed in U.S. Pat. No. 5,452,104, entitled xe2x80x9cAdaptive Block Size Image Compression Method And System,xe2x80x9d also assigned to the assignee of the present invention and incorporated herein by reference. The systems disclosed in these patents utilize what is referred to as xe2x80x9cintra-framexe2x80x9d encoding, where each frame of image data is encoded without regard to the content of any other frame. Using the ABSDCT technique, the achievable data rate may be reduced from around 1.5 billion bits per second to approximately 50 million bits per second without discernible degradation of the image quality.
The ABSDCT technique may be used to compress either a black and white or a color image or signal representing the image. The color input signal may be in a YIQ format, with Y being the luminance, or brightness, sample, and I and Q being the chrominance, or color, samples for each 4:4:4 or alternate format. Other known formats such as the YUV, YCbCr or RGB formats may also be used. Because of the low spatial sensitivity of the eye to color, most research has shown that a sub-sample of the color components by a factor of four in the horizontal and vertical directions is reasonable. Accordingly, a video signal may be represented by four luminance components and two chrominance components.
Using ABSDCT, a video signal will generally be segmented into blocks of pixels for processing. For each block, the luminance and chrominance components are passed to a block interleaver. For example, a 16xc3x9716 (pixel) block may be presented to the block interleaver, which orders or organizes the image samples within each 16xc3x9716 block to produce blocks and composite sub-blocks of data for discrete cosine transform (DCT) analysis. The DCT operator is one method of converting a time and spatial sampled signal to a frequency representation of the same signal. By converting to a frequency representation, the DCT techniques have been shown to allow for very high levels of compression, as quantizers can be designed to take advantage of the frequency distribution characteristics of an image. In a preferred embodiment, one 16xc3x9716 DCT is applied to a first ordering, four 8xc3x978 DCTs are applied to a second ordering, 16 4xc3x974 DCTs are applied to a third ordering, and 64 2xc3x972 DCTs are applied to a fourth ordering.
The DCT operation reduces the spatial redundancy inherent in the video source. After the DCT is performed, most of the video signal energy tends to be concentrated in a few DCT coefficients. An additional transform, the Differential Quad-Tree Transform (DQT), may be used to reduce the redundancy among the DCT coefficients.
For the 16xc3x9716 block and each sub-block, the DCT coefficient values and the DQT value (if the DQT is used) are analyzed to determine the number of bits required to encode the block or sub-block. Then, the block or the combination of sub-blocks that requires the least number of bits to encode is chosen to represent the image segment. For example, two 8xc3x978 sub-blocks, six 4xc3x974 sub-blocks, and eight 2xc3x972 sub-blocks may be chosen to represent the image segment.
The chosen block or combination of sub-blocks is then properly arranged in order into a 16xc3x9716 block. The DCT/DQT coefficient values may then undergo frequency weighting, quantization, and coding (such as variable length coding) in preparation for transmission. Although the ABSDCT technique described above performs remarkably well, it is computationally intensive. Thus, compact hardware implementation of the technique may be difficult.
Variable length coding has been accomplished in the form of run length and size. Other compression methods, such as Joint Photographic Experts Group (JPEG) or Moving Picture Experts Group (MPEG-2), use a standard zig-zag scanning method over the entire processed block size. Using ABSDCT, however, different block sizes are generated, based on the variance within blocks of data. Some coding methods, such as Huffman codes, consist of a run of zeros followed by a non-zero coefficient. Huffman codes, however, are more optimal when the probabilities of the source symbols are negative powers of two. However, in the case of the run-length/size pairs, the symbol probabilities are seldom negative powers of two.
Further, Huffman coding requires a code book of pre-computed code words to be stored. The size of the code book can be prohibitively large. Also, the longest code word may be prohibitively long. Hence, use of Huffman coding for the run-length/size pair symbols is not very efficient.
An apparatus and method to encode the run-lengths and amplitude of the quantized DCT coefficients in a lossless manner to achieve compression is described. Specifically, Golomb-Rice coding is used to encode both zero runs and non-zero amplitudes of the DCT coefficients after quantization. It is found that the use of a scheme taking advantage of an exponential distribution of data, such as Golomb-Rice coding, allows for higher coding efficiencies than alternate schemes.
The present invention is a quality based system and method of image compression that utilizes adaptively sized blocks and sub-blocks of Discrete Cosine Transform coefficient data and a quality based quantization scale factor. A block of pixel data is input to an encoder. The encoder comprises a block size assignment (BSA) element, which segments the input block of pixels for processing. The block size assignment is based on the variances of the input block and further subdivided blocks. In general, areas with larger variances are subdivided into smaller blocks, and areas with smaller variances are not be subdivided, provided the block and sub-block mean values fall into different predetermined ranges. Thus, first the variance threshold of a block is modified from its nominal value depending on its mean value, and then the variance of the block is compared with a threshold, and if the variance is greater than the threshold, then the block is subdivided.
The block size assignment is provided to a transform element, which transforms the pixel data into frequency domain data. The transform is performed only on the block and sub-blocks selected through block size assignment. The transform data then undergoes scaling through quantization and serialization. Quantization of the transform data is quantized based on an image quality metric, such as a scale factor that adjusts with respect to contrast, coefficient count, rate distortion, density of the block size assignments, and/or past scale factors. Serialization, such as zig-zag scanning, is based on creating the longest possible run lengths of the same value. The stream of data is then coded by a variable length coder in preparation for transmission. Coding based on an exponential distribution, such as Golomb-Rice encoding, is utilized. Specifically, for zero represented data, a zero run length is determined. A Golomb parameter is determined as a function of the zero run length. A quotient is encoded as a function of the zero run length and the Golomb parameter. A remainder is encoded as a function of the zero run length, the Golomb parameter and the quotient. The coded quotient and the coded remainder are concatenated. For non-zero represented data, the nonzero data is encoded as a function of the non-zero data value and the sign of the non-zero data value. The encoded data is sent through a transmission channel to a decoder, where the pixel data is reconstructed in preparation for display.
Accordingly, it is an aspect of an embodiment to not require apriori code generation.
It is another aspect of an embodiment to not require the use of an extensive code book to be stored.
It is another aspect of an embodiment to reduce the size needed for hardware implementation.
It is another aspect of an embodiment to achieve a high coding efficiency.
It is another aspect of an embodiment to take advantage of the exponential distribution of DCT data.

DCT compression using Golomb-Rice coding


Technologies for scrambling functions in a column-addressable memory architecture includes a device having a memory and a circuitry. The memory includes a matrix storing individually addressable bit data, and the matrix is formed by rows and columns. The circuitry is to receive a request to perform a write operation of one or more bit values to one of the columns. The circuitry is further to determine a scrambler state at each location of the column, the location corresponding to a respective row and column index. The scrambler state is indicative of a function used to determine a value at the respective column location. Each of the bit values is scrambled as a function of the scrambler state for the respective column location and written thereto.

Scrambling is a preprocessing function that memory architectures use to write data to a device. Similarly, in such a scheme, memory architectures apply a descrambling function on the data prior to outputting data in response to a read request. In bit-addressable memory architectures, these techniques are useful in ensuring that the amount of 0's and 1's written to memory is relatively even, and that the amount of bits that flip on each write operation is also relatively even. Doing so results in even power consumption and heating on the device and provides for relatively even wear on individual bit locations over time.
However, typical scrambling schemes often default to a row-based scrambling. That is, a given row is associated with a given scrambler state, such that I/O operations are scrambled (or descrambled) according to that state. This presents a challenge for memory architectures adapting column-based I/O operations because each location in the column is associated with a different scrambler state from one another.

Technologies for performing column architecture-aware scrambling


A clutch device has a counter-pressure plate and a contact plate which is movable to a limited extent in an axial direction of the clutch device by at least one lever element to clamp a clutch plate frictionally between the counter-pressure plate and the contact plate, wherein the counter-pressure plate has at least one strap segment extending essentially in an axial direction, to which a cover component is connected.

The present invention relates to a clutch device, in particular for a drivetrain of a motor vehicle.
From DE 44 20 251 A1 a clutch device is known, having a counter-pressure plate and a contact plate that is axially movable to a limited extent in an axial direction of the clutch device by a diaphragm spring, to frictionally clamp a clutch plate between the counter-pressure plate and the contact plate. A clutch cover has a plurality of strap segments, whereby the cup spring is attached tiltably to the clutch cover with two wire rings interposed.
It is the object of the present invention to specify an adequately rigid clutch device which can be produced at a reasonable cost.

Clutch device having interconnected plates