A system, system, and program for facilitating navigation of voice data are provided. Tokens are added to voice data based on predefined content criteria. Then, bidirectional scanning of the voice data to a next token within the voice data is enabled, such that navigation to pertinent locations within the voice data during playback is facilitated. When adding tokens to voice data, the voice data may be scanned to detect pauses, changes in voice inflection, and other vocal characteristics. Based on the detected vocal characteristics, tokens identifying ends of sentences, separations between words, and other structures are marked. In addition, when adding tokens to voice data, the voice data may be first converted to text. The text is then scanned for keywords, phrases, and types of information. Tokens are added in the voice data at locations identified within the text as meeting the predefined content criteria.

1. Technical Field
The present invention relates in general to improved voice data management and in particular to improved navigation of voice data. Still more particularly, the present invention relates to tokenizing voice data to facilitate user navigation among the tokenized points within the voice data.
2. Description of the Related Art
The use of voice messaging and recording continues to proliferate in an age of automated call answering services and digital voice recording. For example, when a person places a call, that person is often redirected to a voice messaging service and instructed to leave a voice message. The intended recipient later accesses and listens to the voice message. In another example, conference calls may be recorded as a sound file that can then be distributed across a network or stored for reference.
Furthering the proliferation of voice messaging and recording are voice recognition systems that convert voice into text. Voice data files may be converted into text so that the smaller text document can be stored instead of the larger voice data file. In addition, once voice data is converted into text, the text is often more easily searchable for keywords or phrases.
With voice data, one of the issues that often arises is how to most efficiently control playback of the voice data. A voice message, for example, may contain a contact telephone number that the recipient needs, but that telephone number is positioned in the middle of a two minute voice message. If the listener is not able to write down the telephone number when listening to the voice message the first time, it is not advantageous for the listener to have to listen to the entire message again just to hear the telephone number again.
One method of controlling playback of messages allows a listener to request that the message jump forward three seconds, or some other fixed period of time. While allowing a listener to jump through a message does reduce the portion of the voice message a listener has to review, this method still requires that the listener locate the desired information within the message and does not provide for the listener to move back to a previous position in the message. As an alternative to requiring a listener to listen for a particular piece of information, another method exists for converting a voice message to text, locating a particular keyword or phrase within the text, and outputting just that keyword or phrase to the user. While it may be advantageous for a listener to just receive a particular piece of information from the message, like a telephone number, this method ignores the value of listening to a keyword or phrase in the context of the voice message. For example, after a speaker leaves a phone number, the speaker may further specify not to return the call after a particular hour; this type of context is lost when only the phone number is extracted from a voice message.
In view of the foregoing, it would be advantageous to provide a method, system, and program for facilitating listener navigation through voice data to quickly reach pertinent points of the voice data and to enabling listening to the context surrounding pertinent information. In particular, it would be advantageous to provide a method, system, and program for marking pertinent points within voice data and allowing a listener to jump forwards and backwards between the marked points while listening to the voice data.


A narrow-band oscillation excimer laser has optics which are excellent in durability and light quality, wherein an optical component is a fluoride component (7), and wherein a cleavage plane (20) of the fluoride component (7) is at least substantially parallel with at least one of (a) an incidence side plane (23), for a laser beam (3) entering the fluoride component(7), and (b) an exit side plane (23a), for the laser beam (3) exiting from the fluoride component (7). The fluoride component (7) is positioned in the excimer laser so that the cleavage plane (20) of the fluoride component (7) is at least substantially perpendicular to a light path of the laser beam (3) passing through the inside of the fluoride component (7). A visible mark (27) indicates a direction of the cleavage plane (20).

An excimer laser has been conventionally developed for commercial use as a light source of a reducing projection and exposure device (hereinafter referred to as a stepper) for a semiconductor manufacturing apparatus. This is because an excimer laser enables extremely precise work, since the wavelength of the excimer laser is in an ultraviolet region and is short, thereby permitting the concentration of the light into a smaller area by means of an external optical element, such as a lens, when conducting the work.
Light oscillating from the excimer laser has various wavelength components, and the central wavelength varies. As a result, if the light is in the as-is status, an aberration will occur when the light passes through an external optical element, such as a lens, thereby reducing the accuracy of the work. For this reason, there is a widely used art of making a narrow band, in which an excimer laser is equipped with a wavelength selecting element, such as a grating, to narrow the spectral width of the laser oscillation wavelength, which is called a line width, and to stabilize the central wavelength as a central value of the oscillation wavelength.
FIG. 8 shows an example of a prior art disclosed in Japanese Laid-open Patent No. 3-214680. Laser gas is sealed in a chamber 1, and energy is supplied as a result of an electrical discharge in a discharge electrode 2 portion, whereby the laser beam 3 oscillates. The oscillating laser beam 3 exits through a rear window 5, the beam size thereof is widened while passing through a first prism 7 and a second prism 8, and then the laser beam 3 enters a grating 10. In the grating 10, an angle relative to the light path of the laser beam 3 is controlled by an actuator (not illustrated), and only by oscillating a predetermined wavelength, which is selected, the aforesaid narrow band is achieved. Here, a group of optical components, which are the first prism 7, the second prism 8, and the grating 10, is collectively called the narrow-band optics 12. The laser beam 3, with the wavelength being controlled by the narrow-band optics 12, passes through a front window 13 and a front mirror 14, which is a partial reflecting mirror, and part of the laser beam 3 exits to the right, as shown in FIG. 8.
Synthetic fused silica (SiO.sub.2) is generally used as the material of the optical components for the aforesaid excimer laser, as disclosed in Japanese Laid-open Patent No. 3-214680. This is because synthetic fused silica has a lower absorption rate with respect to ultraviolet light exiting from the excimer laser, and is easily processed. The kinds of materials, having high transmittivity for the ultraviolet light of 248 nm, which is the wavelength of a KrF excimer laser, or of 193 nm, which is the wavelength of an ArF excimer laser, are limited; and fluorides such as CaF.sub.2, MgF.sub.2, and LiF, are presently known as suitable materials instead of the synthetic fused silica.
However, at the present time, the art of manufacturing and processing these fluorides is not as mature, compared with that of synthetic fused silica. For this reason, it is difficult to produce optical material which is equivalent to synthetic fused silica in size, quantity, and optical properties and which can be manufactured. Therefore, in many cases, synthetic fused silica is used as the optical material. Especially in the KrF excimer laser, which has a comparatively long oscillation wavelength, the optical components are less deteriorated; therefore, optical components made of synthetic fused silica can endure for extended periods of use. Consequently, synthetic fused silica is generally used for the optical components for the KrF excimer laser.
However, there are the following disadvantages in using synthetic fused silica as the material for the optics for an excimer laser.
In order to manufacture semiconductors efficiently in large quantities, it is necessary to improve the manufacturing performance of a stepper; and there has been a demand to increase the power of a laser by increasing the laser oscillation pulse numbers per unit time (also called the repetition frequency). However, the energy density is high in the resonator of the laser, and moreover, a laser beam reciprocates in the resonator and passes through the optical components many times. For this reason, as the power of a laser becomes higher, the optical components, made of synthetic fused silica and used for the KrF excimer laser, are deteriorated as a result of even a little distortion or unevenness inside the material, which results in a disadvantage. Even a little deterioration of the optical components exerts a great influence on the quality of the oscillating laser beam, and makes it difficult to use the laser as a light source of a stepper.
Thus, the optical components of synthetic fused silica are insufficient in durability when the power of an excimer laser is increased, and a highly accurate control of the wavelength of an excimer laser is difficult when these optical components are used.
A situation in which the optical components are deteriorated by oscillating laser beams will be explained with reference to FIGS. 9 and 10. FIG. 9 shows a normal condition of the first prism 7 and the laser beam 3 passing through it. As the repetition frequency is increased, the inner portion of the prism 7 is distorted by the energy of the laser beam 3. When the distortion becomes greater, the surface of the prism 7 is shrunk; and as shown in FIG. 10, a distortion 15 occurs on the surface. Thus, the beam size of the laser beam 3 and the sectional shape of the beam are varied, the wave front of the laser beam 3 is disturbed, and the wavelength and the polarized light condition are not normal. This occurrence results in a disadvantage. As a result of the distortion 15, it may happen that a nonreflective coating, applied on the surface of the prism 7, comes off, and the laser beam 3 concentrates thereon, thereby breaking the prism 7.
FIGS. 11 and 12 show the distribution of narrow-band laser oscillation wavelengths before and after the deterioration of an optical component. When the optical component is deteriorated, as shown in FIG. 12, the central wavelength .lambda.c varies between .lambda.c and .lambda.c', for example, or the line width .DELTA..lambda. is increased. Therefore, such a laser is difficult to use as a light source for a stepper.

Narrow-band oscillation excimer laser and optics thereof


A fuel cell system includes a fuel cell stack and a flow control device that controls a supply of a first phase fluid flowing through the fuel cell stack. A controller monitors at least one parameter of the fuel cell stack and controls the supply to generate pulses of reactant when the at least one parameter crosses a threshold to flush a second phase fluid from said fuel cell stack.

Fuel cells produce electricity through electrochemical reaction and have been used as power sources in many applications. Fuel cells can offer significant benefits over other sources of electrical energy, such as improved efficiency, reliability, durability, cost and environmental benefits. Fuel cells may, eventually be used in automobiles and trucks. Fuel cells may also power homes and businesses.
There are several different types of fuel cells, each having advantages that may make them particularly suited to given applications. One type is a proton exchange membrane (PEM) fuel cell, which has a membrane sandwiched between an anode and a cathode. The membrane and respective electrodes together in an assembly are referred to as a membrane electrode assembly (MEA). To produce electricity through an electrochemical reaction, hydrogen (H2) or hydrogen containing gas is supplied to the anode side half-cell via an anode flow field and air or oxygen (O2) is supplied to the cathode side half-cell via a cathode flow field.
In a first half-cell reaction, dissociation of the hydrogen (H2) at the anode generates hydrogen protons (H+) and electrons (e−). Because the membrane is proton conductive, the protons are transported through the membrane. The electrons flow through an electrical load that is connected across the electrodes. In a second half-cell reaction, oxygen (O2) at the cathode reacts with protons (H+) and electrons (e−) are taken up to form water (H2O). Parasitic heat is generated by the reactions and must be regulated to provide efficient operation of the fuel cell stack.
Fuel cell stacks include reactant flow fields and coolant flow fields. The reactant flow fields distribute anode and cathode reactant fluids across the individual cells of the fuel cell stack. The coolant flow fields distribute a heat transfer (coolant) fluid to regulate the operating temperature of the fuel cell stack. In the case of the reactant flow fields, the anode and cathode reactant fluids are distributed as gas phase fluids. In the case of the coolant flow fields, the heat transfer fluid is distributed as a liquid phase fluid.
Under certain operating conditions, a liquid phase fluid can form in the reactant flow fields. The liquid phase fluid impedes flow of the gas phase reactant fluids, which can result in unstable operation of the fuel cell stack. Such a situation typically occurs when consistently operating the fuel cell stack at a low load level. Traditionally, the stability issues are mitigated by applying higher anode and/or cathode stoichiometry to avoid unstable operation. This presents a significant disadvantage, however, in that a high percentage of the reactant is wasted. As a result, system efficiency is decreased.
Gas and/or vapor phase fluids can also form in the coolant flow fields. The gas phase fluid impedes flow of the liquid phase heat transfer fluid, which can result in localized temperature increases or hot spots within the fuel cell stack. These hot spots, reduce the durability of the fuel cell stack and can result in localized damage to the fuel cell stack. The presence of such hot spots in the stack or in a particular cell can be identified by some increase in temperature and/or in cell resistance, which leads to some decrease in cell voltage.

Fluid flow pulsing for increased stability in PEM fuel cell


A bumper for an automobile or a similar vehicle which includes a tailgate structure and a mounting arrangement which enables the tailgate structure to pivot about an axis generally transverse of the vehicle at the rear thereof and at the lower edge portion of the tailgate so that in the event of an impact occurring on the bumper, such as might occur when a trailing vehicle hits the bumper, the tailgate structure will pivot downwardly in a yieldable manner to cushion the shock of the impact, reduce the damage to the vehicles and enhance the safety aspects of bumper structures. The tailgate structure includes tailgate support arms of generally J-shaped configuration associated with a housing and bracket structure as well as as a spring device and control arrangements by which the tailgate is capable of yieldable movement for cushioning the impact shock.

1. Field of the Invention
The present invention generally relates to a bumper for an automobile or a similar vehicle which includes a tailgate structure and a mounting arrangement which enables the tailgate structure to pivot about an axis generally transverse of the vehicle at the rear thereof and at the lower edge portion of the tailgate so that in the event of an impact occurring on the bumper, such as might occur when a trailing vehicle hits the bumper, the tailgate structure will pivot downwardly in a yieldable manner to cushion the shock of the impact, reduce the damage to the vehicles and enhance the safety aspects of bumper structures. The tailgate structure includes tailgate support arms of generally J-shaped configuration associated with a housing and bracket structure as well as a spring device and control arrangements by which the tailgate is capable of yieldable movement for cushioning the impact shock.
2. Information Disclosure Statement
Vehicles have been provided with bumpers to reduce structural damage to the vehicle in the event the vehicle strikes an object or the vehicle is struck by another vehicle at either the forward or rearward ends thereof. Various efforts have been made to support bumpers in a manner that at least a portion of the impact is yieldably absorbed. However, developments of this type have not included a bumper and tailgate structure incorporated into a tailgate arrangement associated with an automobile in which the tailgate structure yieldably absorbs the impact shock and pivots downwardly when an impact contacts the bumper area of the tailgate structure which is located along the lower edge portion thereof.


Methods of lithography, methods for forming patterning tools, and patterning tools are described. One such patterning tool include an active region that forms a first diffraction image on a lens when in use, and an inactive region that forms a second diffraction image on a lens when in use. The inactive region includes a pattern of phase shifting features formed in a substantially transparent material of the patterning tool. Patterning tools and methods, as described, can be used to compensate for lens distortion from effects such as localized heating.

Photolithography is a fabrication technique that is employed for use in a number of industries, including the semiconductor processing industry. Specifically, photolithography exposes energy, such as ultraviolet (UV) light, x-ray wavelength, other wavelengths of radiation, etc. to selected regions of a surface. In one common technique, the surface includes a semiconductor wafer such as silicon that has been coated with a resist material. The resist material properties are locally changed when exposed to the energy source, which allows selected regions of the resist material to remain, while unwanted regions of the resist material are removed.
In one method of photolithography, a pattern of features is formed on a patterning tool, such as a reticle or mask, (a patterning tool is referred to hereinafter in the specification by example as a "reticle") and energy transmitted through the pattern on the reticle is focused onto a working surface to print functionally important features on the working surface using a lens that adjusts the scale of the pattern on the reticle to fit the working surface. In the semiconductor industry, there is an ever present pressure to reduce the size of features in the pattern to increase the density of printed features packed into the same semiconductor surface area. In one example industry, manufacturers of memory chips such as dynamic random access memory (DRAM) or flash memory strive to put more storage cells onto a single chip.
As feature size decreases, photolithography of smaller and smaller features becomes more and more difficult. Imaging fidelity can be degraded by some non-ideal properties of a lens, such as aberrations. During high volume manufacturing, a lens constantly receives energy and lens heating may cause optical aberrations. Methods and devices to reduce lens heating induced optical aberrations are needed to keep pace with ever increasing photolithography demands such as smaller feature sizes.

Lithography methods, methods for forming patterning tools and patterning tools


Systems and methods for monitoring quality of filters within a filtering system are disclosed. The system includes at least one pressure sensor which monitors a force applied by a filter on a filter housing. The system further includes a control system which provides notification to a user when the force measured by the at least one pressure sensor exceeds a predetermined threshold value.

Air filters are used in applications where air quality is important notably in building ventilation systems and in engines, as some examples. In traditional buildings, for example, a particulate air filter composed of fibrous materials is provided to remove solid particulates such as dust, pollen, mold, and bacteria from the air. A chemical air filter, on the other hand, consists of an absorbent or catalyst for the removal of airborne molecular contaminants such as volatile organic compounds or ozone.
Clean filters facilitate airflow, comfort and safety. Depending upon the type of filter installed, they normally are checked on a regular basis, e.g., monthly, as part of a preventive maintenance plan. These checks can even be more regular during heavy use periods. Of course, effectively working air filters collect dirt, dust, debris, and/or other particulate matter over time, which may eventually degrade the quality of the entire system such as, for example, restrict airflow.
Restricted airflow can have negative consequences such as, for example, strain the entire airflow system. That is, restricted airflow may impair the operations of the system by not allowing the system to reach desired operation levels, leading to lower efficiency and quicker degradation. This, in turn, may lead to higher power consumption, to meet the desired needs of the system. In addition, an unintended consequence of restricted airflow may be that incoming airflow may bypass the clogged filter, carrying dirt into the system potentially causing other undesirable consequences.
Accordingly, there exists a need in the art to overcome the deficiencies and limitations described hereinabove.

INTERNATIONAL BUSINESS MACHINES CORPORATION


A component built-in module including a core layer formed of an electric insulating material, and an electric insulating layer and a plurality of wiring patterns, which are formed on at least one surface of the core layer. The electric insulating material of the core layer is formed of a mixture including at least an inorganic filler and a thermosetting resin. At least one or more of active components and/or passive components are contained in an internal portion of the core layer. The core layer has a plurality of wiring patterns and a plurality of inner vias formed of a conductive resin. The electric insulating material formed of the mixture including at least an inorganic filler and a thermosetting resin of the core layer has a modulus of elasticity at room temperature in the range from 0.6 GPa to 10 GPa. Thus, it is possible to provide a thermal conductive component built-in module capable of filling the inorganic filler with high density; burying the active component such as a semiconductor etc. and the passive component such as a chip resistor, a chip capacitor, etc. in the internal portion of the substrate; and simply producing a multilayer wiring structure.

1. Field of the Invention
The present invention relates to a high-density mounted module containing an active component such as a semiconductor etc. and a passive component such as a resistor, a capacitor, etc.
2. Description of the Prior Art
Recently, with a demand for high performance and miniaturization of electronic equipment, high density and high performance of a semiconductor have been increasingly desired. This leads to a demand for a small size and high-density circuit substrate on which such a semiconductor is to be mounted. In order to meet such demands, a connection method using an inner via that can connect between wiring patterns of LSIs or components in the shortest distance has been developed in various fields in order to achieve higher density mounting.
However, there is a limitation in mounting components two-dimensionally with high density even with the above-mentioned methods. Furthermore, since these high-density mounted substrates having an inner-via structure are formed of a resin-based material, the thermal conductivity is low. Therefore, as the mounting density of components becomes higher, it is getting more difficult to release heat that has been generated by the components. In the near future, a clock frequency of a CPU is expected to be about 1 GHz. It is estimated that with the sophistication in the function of the CPU, its electric power consumption accordingly will reach 100 W to 150 W per chip. Furthermore, in accordance with high speed and high density, the effect of noise cannot be ignored. Therefore, there is an expectation for a module in which components are contained three-dimensionally, in addition to a circuit substrate with a high-density and high-performance, as well as an anti-noise property and a thermal radiation property.
In order to meet such demands, JP 2(1990)-121392A proposes a module in which a multilayer ceramic substrate is used as a substrate and a capacitor and a register are formed in an internal portion of the substrate. Such a ceramic multilayer substrate is obtained by processing a material that has a high dielectric property and can be fired simultaneously with a substrate material into a sheet and then firing the sheet sandwiched between the substrates. However, in the case where different kinds of materials are fired simultaneously, due to a lag in sintering timing or difference in the shrinkage at the time of sintering, the multilayer substrate may suffer some warping after being fired or an internal wiring may be peeled off. Therefore, it is necessary to control firing conditions precisely. Furthermore, the components involved in a ceramic substrate are based on simultaneous firing as mentioned above. Therefore, it is possible to include a capacitor, a resistor, or the like, but it is impossible to fire a semiconductor of silicon etc., which lacks in thermal resistant property, simultaneously, and thus the semiconductor cannot be contained.
On the other hand, a circuit substrate in which an active component such as a semiconductor etc. and a passive component such as a capacitor, a resistor etc. are contained at low temperatures is proposed. JP 3 (1991)-69191 A and JP11 (1999)-103147 A describe a method including the steps of: mounting electric components onto a copper wiring formed on a printed wiring board material; further coating the entire surface of the printed wiring board with resin so as to form a buried layer; and then adhering a plurality of layers by an adhesive. Furthermore, JP 9 (1997)-214092 A describes a method including the steps of: burying a material such as a dielectric material etc. in a through hole; forming a surface electrode and allowing a capacitor or a resistor to be included. In addition, there also is a method of adding a function of a capacitor etc. into a printed wiring board itself. JP 5 (1995)-7063 A (U.S. Pat. No. 3,019,541) describes a capacitor built-in substrate in which electrodes are formed on both surfaces of the dielectric substrate obtained by mixing dielectric powder and resin. Furthermore, JP11 (1999)-220262 A describes a method for allowing a semiconductor, a capacitor, or the like to be contained in an inner-via structure.
As mentioned above, a conventional three-dimensionally mounted module having an inner via structure capable of realizing a high-density wiring and containing components is classified into two types: a module using a ceramic substrate that is excellent in the thermal radiation property and the air tightness; and a module that can be cured at a low temperature. The ceramic substrate is excellent in the thermal radiation property and capable of containing a capacitor with high dielectric constant, but it is difficult to fire different kinds of materials simultaneously and it is impossible to include a semiconductor. Also, there is a problem from a viewpoint of cost. On the other hand, a printed wiring board that can be cured at low temperatures has a possibility of including a semiconductor and is advantageous from the viewpoint of cost, but it is difficult to obtain a high dielectric constant in the case of a composite material mixing a dielectric material, etc. and resin. This is apparent from an example of the capacitor formed in the through hole or a printed wiring board mixing dielectric powder. In general, the printed wiring board has a low thermal conductivity and inadequate in heat resistance property. Furthermore, the method of sealing a semiconductor or a capacitor, etc. mounted on the printed wiring board with resin to allow a plurality of layers to be contained has a problem in which individual components can be contained but the thickness of the module itself for the individual components to be buried becomes large, and thus it is difficult to reduce the module volume. Furthermore, due to the thermal stress due to the difference of the coefficient of thermal expansion between the contained components and the printed wiring board, steps for providing a buffer layer having a constant coefficient of thermal expansion between the component and the printed wiring board material, adjusting the coefficient of thermal expansion of the printed circuit materials, or the like, are taken. However, the coefficient of thermal expansion of the semiconductor is generally small, and it is extremely difficult to adjust the coefficient of thermal expansion only with a printed wiring board material in the range of operation temperatures.
With the foregoing in mind, it is an object of the present invention to provide a thermal conductive component built-in module in which an inorganic filler can be contained in a thermosetting resin at high density, an active component such as a semiconductor etc. and a passive component such as a chip resistor, a chip capacitor, etc. are buried in the internal portion thereof by a simple method, and a multilayer wiring structure can be formed simply. In the present invention, by selecting an inorganic filler and a thermosetting resin, it is possible to produce a module having a desired performance and to provide a component built-in module that is excellent in a thermal radiation property and a dielectric property.
In order to solve the above-mentioned problems, the component built-in module of the present invention includes a core layer formed of an electric insulating material; an electric insulating layer and a plurality of wiring patterns formed on at least one surface of the core layer. In the component built-in module, the electric insulating material of the core layer is formed of a mixture including at least an inorganic filler and a thermosetting resin; at least one or more of active components and/or passive components are contained in an internal portion of the core layer; the core layer has a plurality of wiring patterns and a plurality of inner vias formed of a conductive resin; and the electric insulating material formed of the mixture including at least an inorganic filler and a thermosetting resin of the core layer has a modulus of elasticity at room temperature in the range from 0.6 GPa to 10 GPa.
According to such a configuration, it is possible to provide a module allowing an active component such as a semiconductor etc. and a passive component such as a chip resistor, a chip capacitor, etc. to be buried with a simple technique, having a desired performance and a high reliability with respect to stress such as a thermal shock, by selecting a suitable inorganic filler and thermosetting resin. Namely, it is possible to adjust the coefficient of thermal expansion of the module in the in-plane direction to that of a semiconductor, or to provide the module with a thermal radiation property. In addition, by setting the modulus of elasticity of the electric insulating material at room temperature to be in the range from 0.6 GPa to 10 GPa, a component such as a semiconductor can be contained without stress. Therefore, it is possible to provide a module having a high-density mounting structure. Furthermore, since it is possible to form a multilayer high density wiring layer capable of re-wiring on the surface of the core layer in which a component is contained, an ultra-thin and high-density module can be realized. Furthermore, the problem of noise that may be caused in accordance with a future development of high frequency can be expected to be reduced by arranging the semiconductor and the chip capacitor extremely close to each other.
Furthermore, the component built-in module of the present invention has a configuration in which the electric insulating material formed of the mixture including at least an inorganic filler and a thermosetting resin of the core layer has a modulus of elasticity at room temperature in the range from 0.6 GPa to 10 GPa, and the thermosetting resin includes a plurality of thermosetting resins having different glass transition temperatures. According to such a configuration, it is possible to obtain a component built-in module that is strong with respect to a thermal stress by a thermal shock of the contained components, even if components with various coefficient of thermal expansion are present.
Furthermore, the component built-in module of the present invention has a configuration in which the electric insulating material formed of the mixture including at least an inorganic filler and a thermosetting resin of the core layer has a modulus of elasticity at room temperature in the range from 0.6 GPa to 10 GPa, and the thermosetting resin includes at least a thermosetting resin having a glass transition temperature in the range from xe2x88x9220xc2x0 C. to 60xc2x0 C. and a thermosetting resin having a glass transition temperature in the range from 70xc2x0 C. to 170xc2x0 C. According to such a configuration, it is possible to obtain a component built-in module that is further strengthened with respect to a thermal stress by a thermal shock of the contained components, even if components with various coefficient of thermal expansion are present.
Furthermore, it is preferable that the component built-in module of the present invention includes a through hole that extends through all of the core layer, the electric insulating layer and the wiring pattern.
Thus, in addition to the above-mentioned effects, since it is possible to use a usual process and equipment for producing a printed wiring board, a component built-in module can be realized extremely simply.
Furthermore, it is preferable that the component built-in module of the present invention includes a core layer formed of an electric insulating material; an electric insulating layer including an electric insulating material formed of a mixture including an inorganic filler and a thermosetting resin, which is formed on at least one surface of the core layer; and a plurality of wiring patterns formed of a copper foil; wherein the core layer has a plurality of wiring patterns formed of a copper foil and a plurality of inner vias formed of a conductive resin, and the wiring patterns are connected electrically to each other by the inner vias.
According to such a configuration, it is possible to provide a module that allows an active component such as a semiconductor etc. and a passive component such as a chip resistor, a chip capacitor, etc. to be buried with a simple technique, having a desired performance and a high reliability with respect to stress such as a thermal shock, by selecting a suitable inorganic filler and thermosetting resin. In other words, it is possible to adjust the coefficient of thermal expansion of the module in the in-plane direction to that of a semiconductor, or to provide the module with a thermal radiation property. Furthermore, since it is possible to form a multilayer high-density wiring layer capable of re-wiring on the surface of the core layer in which a component is contained in an inner via structure, it is possible to realize an ultra-thin and high-density module.
Furthermore, it is preferable that the component built-in module of the present invention includes a core layer formed of an electric insulating material; an electric insulating layer including an insulating material formed of a thermosetting resin, which is formed on at least one surface of the core layer; and a plurality of wiring patterns formed by copper-plating; wherein the core layer has a plurality of wiring patterns formed of a copper foil and a plurality of inner vias formed of a conductive resin, and the wiring patterns formed by the copper-plating are connected electrically to each other by the inner vias.
Thus, in addition to the above-mentioned effects, it is possible to use the existing plating technique as it is, and it is also possible to make the surface wiring layer and insulating layer to be thin. Therefore, a component built-in module with a smaller thickness can be realized.
Furthermore, it is preferable that the component built-in module of the present invention includes a core layer formed of an electric insulating material; an electric insulating layer formed of an organic film having a thermosetting resin on both surfaces, which is formed on at least one surface of the core layer; and a plurality of wiring patterns formed of a copper foil; wherein the core layer ha s a plurality of wiring patterns formed of a copper foil and a plurality of inner vias formed of a conductive resin, and the wiring patterns are connected electrically to each other by the inner vias.
Thus, a high-density and thin surface wiring layer can be formed, and a surface that has excellent surface smoothness can be achieved by the organic film. Similarly, since the excellent thickness precision can be achieved, an impedance control of the surface wiring layer can be carried out with high accuracy, and thus a component built-in module for high frequency can be realized.
Furthermore, it is preferable that the component built-in module of the present invention includes a core layer formed of an electric insulating material; and a ceramic substrate having a plurality of wiring patterns and inner vias adhered onto at least one surface of the core layer; wherein the core layer has a plurality of wiring patterns formed of a copper foil and a plurality of inner vias formed of a conductive resin.
Thus, it is possible to obtain a module that contains components, has an excellent thermal radiation property or air-tightness, and contains a capacitor having a high dielectric constant.
Furthermore, it is preferable that the component built-in module of the present invention includes a core layer formed of an electric insulating material; and a plurality of ceramic substrates having a plurality of wiring patterns and inner vias adhered onto at least one surface of the core layer; wherein the core layer has a plurality of wiring patterns formed of a copper foil and a plurality of inner vias formed of a conductive resin; and the plurality of ceramic substrates include dielectric materials having different dielectric constants.
Thus, it is possible to laminate different kinds of layers, that is, a ceramic capacitor with high dielectric constant and a ceramic substrate with low dielectric constant suitable for a high-speed circuit. In particular, for the high-speed wiring layer, a ceramic layer with a small transfer loss can be used, while for a portion requiring a bypass capacitor, a ceramic layer with high dielectric constant can be used.
Furthermore, in the component built-in module of the present invention, it is desirable that a film-shaped passive component is disposed between the wiring patterns formed on at least one surface of the core layer. Thus, it is possible to realize a three-dimensional module in which components are contained with higher density.
Furthermore, in the component built-in module of the present invention, it is desirable that the film-shaped passive component is at least one selected from the group consisting of a resistor, a capacitor and an inductor formed of a thin film or a mixture including an inorganic filler and a thermosetting resin. It is advantageous because a thin film can provide an excellent performance passive component. Furthermore, a film-shaped component including an inorganic filler and a thermosetting resin can be produced easily and is excellent in reliability.
Furthermore, in the component built-in module of the present invention, it is desirable that the film-shaped passive component is a solid electrolytic capacitor formed of at least an oxide layer of aluminum or tantalum and a conductive macromolecule.
Furthermore, a method for producing a component built-in module of the present invention includes: processing a mixture including at least an inorganic filler and an uncured state thermosetting resin into a sheet; providing the sheet material including an inorganic filler and an uncured state thermosetting resin with a through hole; filling the through hole with a conductive resin; mounting an active component and/or passive component on a copper foil; and superimposing the sheet material in which the through hole is filled with a conductive resin onto the surface of the copper foil on which the components are mounted. This is followed by superimposing a copper foil; burying the active and/or passive component in the sheet material, followed by heating and pressing the sheet material, thereby curing the thermosetting resin and the conductive resin in the sheet material; then processing the copper foil on the outermost layer into a wiring pattern, thereby forming a core layer; and providing a through hole to a sheet including an inorganic filler and an uncured state thermosetting resin or an organic film having adhesive layers on both surfaces. This is followed by superimposing the copper foil, and the sheet or the organic film in which the through hole is filled with a conductive resin onto at least one surface of the core layer, followed by heating and pressing thereof so as to be integrated onto each other; and processing the copper foil into a wiring pattern.
According to such a method, since it is possible to bury an active component such as a semiconductor etc. and a passive component such as a chip resistor, a chip capacitor, etc. in an internal portion and also to mount components onto the outer layer portion, an extremely high-density and small size module can be realized. Furthermore, since a wiring pattern can be formed also on the surface portion of the core layer, a further high-density module can be realized. Furthermore, since a material of the surface portion can be selected, the thermal conductivity, dielectric constant, coefficient of thermal expansion, etc. can be controlled.
Furthermore, in the method for producing the component built-in module of the present invention, it is preferable that a film-shaped component is formed beforehand on the copper foil that is to be superimposed onto the core layer.
Furthermore, the method for producing a component built-in module of the present invention includes: processing a mixture including at least an inorganic filler and an uncured state thermosetting resin into a sheet; providing a through hole to the sheet material including an inorganic filler and an uncured state thermosetting resin; filling the through hole with a conductive resin; forming a wiring pattern on one surface of a release carrier; and mounting an active component and/or passive component on the wiring pattern of the release carrier. This is followed by superimposing a sheet material in which the through hole is filled with a conductive resin onto the surface of the release carrier having a wiring pattern on which the component is mounted; burying and integrating the active component and/or passive component into the sheet material, followed by further heating and pressing thereof, thereby curing the thermosetting resin and the conductive resin in the sheet material; then peeling off the release carrier on the outermost portion, thereby forming a core layer; and providing a through hole to a sheet including an inorganic filler and an uncured state thermosetting resin or an organic film having adhesive layers on both surfaces. This is followed by superimposing the release carrier having a wiring pattern, and the sheet or the organic film in which the through hole is filled with the conductive resin onto at least one surface of the core layer, followed by heating and pressing thereof so as to be integrated into each other; and peeling off the release carrier.
According to such a method, since it is possible to bury an active component such as a semiconductor etc. and a passive component such as a chip resistor, a chip capacitor, etc. in an internal portion and also to mount further components onto the outer layer portion, an extremely high-density and small size module can be realized. Furthermore, since a wiring pattern can be formed on the surface portion by a transferring process, a treatment such as etching after the curing process is not necessary, thus making the method simple from an industrial viewpoint.
Furthermore, in the method for producing the component built-in module of the resent invention, it is preferable that a film-shaped component is formed on the wiring pattern formed beforehand on the release carrier on which the wiring pattern is formed to be superimposed onto the core layer.
Furthermore, in the method for producing the component built-in module of the resent invention, it is preferable that the film-shaped component is at least one selected from the group consisting of a resistor, a capacitor and an inductor, which is formed of a thin film or a mixture including an inorganic filler and a thermosetting resin; and the film-shaped component is formed by one method selected from the group consisting of vapor deposition method, MO-CVD method or a thick film printing method.
Furthermore, the method for producing a component built-in module of the present invention includes: processing a mixture including at least an inorganic filler and an uncured state thermosetting resin into a sheet; providing a through hole to the sheet material including an inorganic filler and an uncured state thermosetting resin; filling the through hole with a conductive resin; and mounting an active component and/or passive component on a copper foil. This is followed by superimposing the sheet material in which the through hole is filled with a conductive resin onto the surface of the copper foil on which the components are mounted; furthermore superimposing a copper foil; burying the active and/or passive component in the sheet material, followed by heating and pressing the sheet material, thereby curing the thermosetting resin and the conductive resin in the sheet material; then processing the copper foil on the outermost layer into a wiring pattern, thereby forming a core layer; and providing a through hole to a sheet including an inorganic filler and an uncured state thermosetting resin or an organic film having adhesive layers on both surfaces. This is followed by superimposing the copper foil, and the sheet or the organic film in which the through hole is filled with a conductive resin onto at least one surface of the core layer, followed by heating and pressing thereof so as to be cured; and then forming a through hole that extends through the core layer so as to form a through hole by copper-plating.
Thus, since this method can use a conventional through hole technique as it is, based on the core layer containing the components, it is advantageous in industrial viewpoint.
Furthermore, the method for producing a component built-in module of the present invention includes: processing a mixture including at least an inorganic filler and an uncured state thermosetting resin into a sheet; providing a through hole to the sheet material including an inorganic filler and an uncured state thermosetting resin; filling the through hole with a conductive resin; forming a wiring pattern on one surface of a release carrier; and mounting an active component and/or passive component on the wiring pattern of the release carrier. This is followed by superimposing a sheet material in which the through hole is filled with a conductive resin onto the surface of the release carrier having a wiring pattern on which the component is mounted; burying and integrating the active component and/or passive component into the sheet material, followed by further heating and pressing thereof, thereby curing the thermosetting resin and the conductive resin in the sheet material; then peeling off the release carrier on the outermost portion, thereby forming a core layer; and providing a through hole to a sheet including an inorganic filler and an uncured state thermosetting resin or an organic film having adhesive layers on both surfaces. This is followed by superimposing the release carrier having a wiring pattern on one surface, and the sheet or the organic film in which the through hole is filled with a conductive resin onto at least one surface of the core layer, followed by heating and pressing thereof so as to be cured; and then forming a hole that extends through the core layer and carrying out copper-plating thereof to form a through hole.
Thus, since this method can use a conventional through hole technique as it is, based on the core layer containing the components, it is advantageous in industrial viewpoint.
Furthermore, the method for producing a component built-in module of the present invention includes: processing a mixture including at least an inorganic filler and an uncured state thermosetting resin into a sheet; providing a through hole to the sheet material including an inorganic filler and an uncured state thermosetting resin; filling the through hole with a conductive resin; forming a wiring pattern on one surface of the release carrier; and mounting an active component and/or passive component on a wiring pattern of the release carrier. This is followed by superimposing the sheet material in which the through hole is filled with a conductive resin onto the surface of the release carrier having a wiring pattern on which the components are mounted; further superimposing a copper foil and heating and pressing in the temperature range in which the thermosetting resin is not cured; burying and integrating the active components and/or passive components into the sheet material, thereby forming a core layer; peeling off the release carrier from the core layer; and superimposing the ceramic substrate in which at least two or more of inner vias and wiring patterns are laminated onto at least one surface of the core layer from which the release carrier is peeled off, followed by pressing thereof, thereby curing the thermosetting resin in the core layer to be adhered to the ceramic substrate.
According to such a method, similar to the above, an extremely high-density and small size module can be realized. Furthermore, since it is possible to integrate an excellent ceramic substrate with various performances, a further high-performance module can be realized.
Furthermore, in the method for producing the component built-in module of the present invention, it is desirable that a plurality of ceramic substrates having a plurality of wiring patterns and the inner vias are laminated simultaneously via the core layer and the adhesive layer. Thus, various kinds of ceramic substrates can be laminated simultaneously, providing an extremely simple method.

Component built-in module and method for producing the same

Matsushita Electric Industrial Co., Ltd.


A helical antenna having a central axis defined between a base end and a distal end comprises a helical conductor wound about the central axis and having a feed line disposed at the base end and along the central axis, and may also include an elongated dielectric core about which the electrical conductor is wound.

One form of antenna widely used for communication and radar purposes is a helical (or helix) antenna. A helical antenna is an antenna that emits or responds to electromagnetic (EM) fields in a circular polarization. Maximum radiation or response is wanted along the axis of the helix, about which the helical coil is disposed. A set of helical antennas may be mounted together to form an array, or phased array, antenna. In customary applications, the spacing in an array is larger than half of a wavelength.
A helical antenna comprises an electrically conductive helical coil that can transmit or receive, or both, EM signals. The antenna properties of the helical coil are a function of several of its physical characteristics, including axial length, turn spacing and diameter (or radius) of the coil. The helical antenna extends orthogonally from a ground plane, at its base (or first) end, to its distal (or second) end. Typical helical antennas either have a uniform radius or they are axially tapered from the antenna's base to its distal end.
The helical coil includes, at its base, a feed line that connects the antenna, through the ground plane, to the receiver, transmitter, or transceiver—depending on the type of antenna. The feed line transfers radio-frequency (RF) energy from a transmitter to an antenna, and/or from an antenna to a receiver, but, if operating properly, the feed line typically does not radiate or intercept energy. In a typical helical antenna arrangement, the feed line is offset from the axis of the helical coil and typically coupled through the ground plane to an amplifier or filter.
Generally, there are three types of commonly used antenna feed lines, also called RF transmission mediums: coaxial line, waveguide and strip line/micro-strip line. These are typically used to transmit or receive RF signals to and from the helical coil. A coax cable is a shielded copper-core channel that carries the signal, surrounded by a concentric second channel cable that serves as ground and is covered by an outer sheathing. A waveguide is a hollow, metallic tube or pipe with a circular or rectangular cross section. The diameter of the waveguide is comparable to the wavelength of the EM field, typically. The EM field travels along the inside of the waveguide. The metal structure prevents EM fields inside the waveguide from escaping, and also prevents external EM fields from penetrating to the interior. Waveguides are used at microwave frequencies, that is, at 1 GHz and above. Strip line or micro-strip lines are planar transmission mediums used in, among other things, RF applications. Strip lines or micro-strip lines may be integral with, mounted on or etched into the ground plane.
A helical antenna is an "axial mode" antenna, meaning it preferably radiates or receives energy primarily along its axis. From an RF perspective, the helical antenna has two primary characteristics that are of importance. The first is amplitude, which is a measure of the magnitude of the RF signal. The amplitude should be at its maximum along the axis of the helical coil. For the most part, amplitude is independent of the rotation of the coil about the axis. The second characteristic is phase, which reflects the frequency characteristics of the signal. Unlike amplitude, the phase of the helical antenna is directly related to the rotational orientation of the helical coil about the axis. For example, a quarter turn of the coil effects a 90° change in phase, a half turn effects a 180° change in phase, and so forth. Thus, the rotational orientation of a helical antenna, particularly within an array of antennas, is important.
In order to achieve the desired radiation pattern for such a helical antenna, whether in an array or alone, a helical antenna may require rotation about its axis. Consequently, once the antenna is located, for example within an array, it may not be freely spun about its axis without adversely impacting antenna performance. For example, rotating such a helical antenna within an array could result in coupling with one or more adjacent helical antennas. Further, with an offset feed line, if the antenna is rotated, then the amplifier/filter typically connected to the feed line would need to be repositioned. This can be particularly time consuming and onerous
Thus, rotation of a helical antenna about its axis could require at least two compensating actions, one is EM related and the other more layout related. First, to eliminate or mitigate undesirable levels of coupling, the physical locations and spacing of the helical antennas within the array may need to be customized. And once placed, any rotation of a helical antenna within the array would likely require modification to the placement of that antenna within the array. Second, since each helical antenna is physically connected to an amplifier/filter module, rotation of the antenna would likely requirement movement or rewiring of the helical antenna to its amplifier/filter module. Thus, current helical antennas having off-set feed lines have limited flexibility.


A computer input device includes a magnetized fluid and an inertial body within the magnetized fluid. A signal converter provides angular acceleration information based on behavior of the inertial body. The computer input device can be attached to a Virtual Reality Suit, or can be used to control computer-generated graphical objects. The inertial body can be non-magnetic. The body can be solid or hollow. Electromagnets and/or permanent magnets can be used for magnetizing the fluid. Magnetic coils sense the changes in the magnetic flux lines. Signals from the magnetic coils are used by the signal converter to calculate the angular acceleration. A housing encloses the magnetized fluid and the inertial body.

Computer input devices for the input of coordinates and graphic information in a computer typically utilize a mouse and trackball. Such input devices contain a trackball that generates a signal which corresponds to a position angle and two covers. A positioner is typically located between the covers in a such manner that it is only partially raised behind the covers. One of the covers is hinged and is able to move between a closed and open position. A retainer is used to hold the covers in a position that ensures that the positioner is held against a flat surface. A second retainer is typically used to hold both covers in such location and manner that the surface of the positioner is supported by two surface and in contact with the flat surface.
The disadvantage of these devices is that it they are limited to controlling only two coordinates, X and Y. Additionally, the device typically requires a special work surface for the device movement, and the parts and assemblies for the device must be manufactured to precise mechanical specifications. Furthermore, the device may easily fail as a result of wear and dust accumulation on the moving parts.
Graphic positioners that provide input for 3 independent coordinates, X, Y, and Z, typically consist of a base with two perpendicular shafts rotating in sets of bearings and a third shaft that is mounted on a bezel in a bearing assembly. Each shaft is mated to a coder that translates the shaft rotation into code. The code is supplied through a cable to the computer in order to control a graphic object on a display.
This device is also limited to controlling one pair of coordinates at a time, (XY), or (XZ), or (YZ). Furthermore, the device typically provides an uncomfortable position for the operator's wrist and a rigidly limited area in which the operator's hand must be located during the manipulations (determined by the shaft's length, where shaft is fixed in a holder and on a base). In addition, the device contains of parts that are difficult to manufacture and are prone to excessive wear due to friction.
Another type of controller for providing three-dimensional input data is a device that has a coordinating handle. This controller typically contains a spheroid inside a stationary casing which freely rotates in all directions. Attached to the spheroid is a handle that can be rotated and moved in any direction. The device also contains inner and outer leverage plates that are attached by hinges to the casing. These leverage plates typically align at intersection planes and rotate simultaneously with the handle. Two angle converters are attached to the casing and driven by rotation of the plate. The rotational angle converter is also typically driven by the handle rotation. Depending on the axial movement of the handle, the rotational angle converter is typically connected or disconnected from the handle by a coupling clutch installed between them. The handle rotation produces electrical signals on the device's output.
The disadvantage of this type of controller is the complex design of the rotating handle. A large number of parts and assemblies require precision machining. Further, a large number of parts are susceptible to wear which will reduce the life of the device.
Another type of input device is a computer-input pen designed for input of handwritten information. The pen consists of a hollow casing with a writing element having acceleration and pressure sensors. Typically, the acceleration and pressure sensors are mutually perpendicular piezoelectric plates with inertial elements that are placed along the axis of the writing element in two rows. The upper row consists of inertial sensors attached to the lower edges of the piezoelectric plates. These piezoelectric plates are typically parallel to the axis of the writing element. One edge of the piezoelectric plates is rigidly attached to the casing while the other edge is attached to the writing element through the spring-loaded rod. This device only allows for two-dimensional coordinate input of information into computer.
There is a need for a data input device that is easy to manufacture can provide manipulations in six degrees of freedom, and is capable of gradual adjustment.

This patent is subject to a terminal disclaimer.


A combination enzyme product consisting of a glutamine specific endoprotease and a prolyl endopeptidase is provided. Both enzymes are active and stable in the stomach and can therefore be administered as lyophilized powders or simple capsules/tablets. A ratio of the two enzymes is used to maximize their synergy.

In 1953, it was first recognized that ingestion of gluten, a common dietary protein present in wheat, barley and rye causes a disease, now called Celiac sprue, in sensitive individuals. Gluten is a complex mixture of glutamine- and proline-rich glutenin and prolamine molecules, that appears to be responsible for disease induction. Ingestion of such proteins by sensitive individuals produces flattening of the normally luxurious, rug-like, epithelial lining of the small intestine known to be responsible for efficient and extensive terminal digestion of peptides and other nutrients. Clinical symptoms of Celiac sprue include fatigue, chronic diarrhea, malabsorption of nutrients, weight loss, abdominal distension, anemia, as well as a substantially enhanced risk for the development of osteoporosis and intestinal malignancies (lymphoma and carcinoma). The disease has an incidence of approximately 1 in 200 in European populations.
A related disease is dermatitis herpetiformis, which is a chronic eruption of the skin characterized by clusters of intensely pruritic vesicles, papules, and urticaria-like lesions. IgA deposits occur in almost all normal-appearing and perilesional skin of individuals with the disease. Asymptomatic gluten-sensitive enteropathy is found in 75 to 90% of patients and in some of their relatives. Onset is usually gradual. Itching and burning are severe, and scratching often obscures the primary lesions with eczematization of nearby skin, leading to an erroneous diagnosis of eczema. Strict adherence to a gluten-free diet for prolonged periods may control the disease in some patients, obviating or reducing the requirement for drug therapy. Dapsone, sulfapyridine and colchicines are sometimes prescribed for relief of itching.
Celiac sprue is generally considered to be an autoimmune disease, and the antibodies found in the serum of patients support a theory of an immunological nature of the disease. Antibodies to tissue transglutaminase (tTG) and gliadin appear in almost 100% of the patients with active Celiac sprue, and the presence of such antibodies, particularly of the IgA class, has been used in diagnosis of the disease.
The large majority of patients express the HLA-DQ2 [DQ(a1*0501, b1*02)] and/or DQ8 [DQ(a1*0301, b1*0302)] molecules. It is believed that intestinal damage is caused by interactions between specific gliadin oligopeptides and the HLA-DQ2 or DQ8 antigen, which in turn induce proliferation of T lymphocytes in the sub-epithelial layers. T helper 1 cells and cytokines apparently play a major role in a local inflammatory process leading to villus atrophy of the small intestine.
At the present time, there is no approved drug therapy for the disease, and the only "treatment" is to advise patients to avoid all foods containing gluten. Although gluten withdrawal has transformed the prognosis for children and substantially improved it for adults, some people still die of the disease, mainly adults who had severe disease at the time of diagnosis. An important cause of death is lymphoreticular disease (especially intestinal lymphoma). It is not known whether a gluten-free diet diminishes this risk. Apparent clinical remission is often associated with histologic relapse that is detected only by review biopsies or by increased EMA titers.
Gluten is so widely used, for example in commercial soups, sauces, ice creams, hot dogs, and other foods, that patients need detailed lists of foodstuffs to avoid and expert advice from a dietitian familiar with celiac disease (as Celiac sprue is sometimes called). Ingesting even small amounts of gluten may prevent remission or induce relapse. Supplementary vitamins, minerals, and hematinics may also be required, depending on deficiency. A few patients respond poorly or not at all to gluten withdrawal, either because the diagnosis is incorrect or because the disease is refractory. In the latter case, oral corticosteroids (e.g., prednisone 10 to 20 mg bid) may induce response.
In view of the serious and widespread nature of Celiac sprue, improved methods of treating or ameliorating the effects of the disease are needed. Recently, a promising new approach to the treatment of the disease has been described: the use of orally ingested proteases that degrade gluten before it can exert its toxic effects in Celiac sprue and dermatitis herpetiformis patients (see U.S. Pat. Nos. 7,303,871 and 7,320,788, each of which is incorporated herein by reference). To increase the efficacy of this approach, new protease preparations with increased ability to degrade gluten, relative to currently available protease preparations, are needed. The present invention addresses such needs.

Combination enzyme therapy for digestion of dietary gluten

The Board of Trustees of the Leland Stanford Junior University


In non-limiting examples of the present disclosure, systems, methods and devices for providing cross-device access to group features are presented. A facial image input may be received from a user. A determination may be made that the user is not associated with a group having access to one or more sets of features accessible from the device. An authorization request may be sent to an owner account associated with the device for adding the user to the group. A request to add the user to the group may be received via the authorization request. The user may be added to the group.

Facial recognition is becoming a common method of user authentication across software, devices, and services. Facial recognition has been implemented to identify users of various platforms. This functionality works well when authenticating individual users. However, a growing number of situations are resulting in a set of software services or devices being shared across a scoped group of individuals. This situation is encountered both in the enterprise and the consumer space.
It is with respect to this general technical environment that aspects of the present technology disclosed herein have been contemplated. Furthermore, although a general environment has been discussed, it should be understood that the examples described herein should not be limited to the general environment identified in the background.

Automated user identification for cross-platform group and device collaboration


In an apparatus for recognizing a lane partition line, a pre-branch section setting unit sets a pre-branch section of a road on which an own vehicle is traveling. The pre-branch section extends a section length from a start line that is positioned closer to the own vehicle than a branch location by an offset distance in a traveling direction of the own vehicle. A determination unit determines whether or not a geographical location of the own vehicle is within the pre-branch section. If it is determined that the geographical location of the own vehicle is within the pre-branch section, a recognition unit suppresses recognition of the lane partition line on an diverging road side of the road on which the own vehicle is traveling. The diverging road is another road branching off from the road on which the vehicle is traveling at the branch location.

Technical Field
The present invention relates to an apparatus for recognizing lane partition lines.
Related Art
Conventionally, techniques are known for providing driving assistance, such as a lane keep assist (LKA) or pre-crash safety system (PCS), based on recognized lane partition lines, such as white lines, in an image captured by a vehicle-mounted camera (see, for example, JP-A-H09-35198).
In the presence of a branch of a road on which an own vehicle is traveling, positioned forward of the own vehicle, such conventional techniques may mistakenly recognize a lane partition line of an diverging lane as a lane partition line of a lane continuing in a traveling direction of the own vehicle.
In consideration of the foregoing, exemplary embodiments of the present invention are directed to providing techniques for preventing such misrecognition that may be caused by the presence of a branch.

Apparatus for recognizing lane partition lines


In a disc changer in which any one is selected from a set of disc-shaped recording media (2) stored in a disc compartment (3) and signals are written and/or read to and/or from the selected disc-shaped recording medium (2), resin layers (192), (194) and (195), softer than the disc-shaped recording medium (2) in a recording and/or playback apparatus (6) are formed on a pair of disc holding members (89) holding the selected disc-shaped recording medium (2) rotatably while chucking the latter and a disc tray (193) on which each of the disc-shaped recording media stored in the disc compartment (3) is placed. The resin layers assure to prevent the disc-shaped recording medium (2) from being damaged due to contact with the disc holding members (89) and disc tray (193).

There has so far been available, as an in-vehicle audio device, a so-called disc changer in which a desired one is selected from a set of discs for playback.
The disc changer is designed to store a set of discs such as CD (compact disc) together in a magazine case which is entirely installed in the apparatus body. Generally, the body of the disc changer, relatively voluminous, is installed in any other space than the car interior, such as a trunk, while only a part of the disc changer, necessary for controlling the disc changer itself, is installed in the car interior. In this case, the disc cannot be replaced in the car interior, and for the disc replacement, the magazine case has to be removed out of the apparatus body, which is very troublesome.
To avoid such an inconvenience, there has been proposed a disc changer having a body designed to have a predetermined standard size called "1DIN size" and in which a set of six discs is stored together, for example.
The disc changer uses no aforementioned magazine case, and thus the apparatus body, designed to have the predetermined standard size, can be installed in a standardized storage space provided in the in-vehicle center panel. Therefore, the disc replacement can be done in the car interior and thus the disc changer can be used more conveniently.
Referring to FIG. 1, the conventional disc changer will be described below in further detail. The disc changer is generally indicated with a reference 200. As shown, the apparatus body 200 has provided therein a disc compartment 202 in which discs 201 are to be stored. The disc compartment 202 has a stack of trays 203, for example, a set of six trays 203. The apparatus body 200 has a disc insertion/ejection slot 204 provided at the front thereof. A disc 201 inserted through the disc insertion/ejection slot 204 will be placed on the tray 203.
The disc changer 200 includes also a pickup assembly 205 to play a selected one of the discs 201. The pickup assembly 205 includes a pair of chuck levers 206a and 206b to hold the selected disc 201 rotatably while chucking it, and a pickup unit 207 provided on the side, opposite to the disc 201, of the lower one (206a) of the pair of chuck levers.
In the disc changer, a sufficient space to receive the pair of chuck levers 206a and 206b is created above and below the disc 201 selected from those placed on the stacked trays 203. When the disc 201 is chucked by the pair of chuck levers 206a and 206b, it is rotated and the pickup unit 207 reads signals the disc 201 being rotated.
The above disc changer 200 is not advantageous in that when the pickup unit 207 reads signals from the disc 201 chucked between the pair of chuck levers 206a and 206b, the disc 201 will be caused to touch the chuck levers 206a and 206b due to an oscillation or vibration of the vehicle, and thus damaged.
In the conventional disc changer, to protect the disc 201 from being damaged, it has been proposed to attach a cushion member to a portion of each of the chuck levers 206a and 206b, which is likely to be in contact with the disc 201.
However, such a cushion member has to accurately be attached with an adhesive to a portion of each of the chuck levers 206a and 206b, which is likely be in contact with the disc 201, namely, to a limited portion. Since such a portion is limited, highly accurate attachment is very difficult, with the result of the cushion member being out of place.
It is extremely difficult to attain a high accuracy in attaching a cushion member of less than about 0.3 mm, for example, with an adhesive, and such attachment will increase the thickness of the pair of chuck levers 206a and 206b.
Further, some of the adhesives used for this attachment of the cushion member have not any sufficiently high thermal resistance. Such an adhesive cannot keep the cushion member securely attached on the chuck levers 206a and 206b or the adhesive itself will possibly melt away, when the ambient temperature or temperature of the apparatus is higher.
Also in the aforementioned disc changer, to prevent the disc 201 from being damaged due to contact with the tray 203 during insertion or ejection, it has been proposed to mold the tray 203 itself from a resin, form resin layers over the metallic substrate as the tray 203, or form resin layers on the metallic substrate, which will be in contact with the disc 201, by out-sert molding or bonding.
Since the resin-molded tray is interior in mechanical strength to a tray formed from a metallic substrate, however, it has to be formed thick for a sufficient strength. As a result, the height of the disc changer will be increased.
Also, in case of the tray having resin layers formed over a metallic substrate, a foreign matter is likely to get mixed in the resin going to be applied over the metallic substrate. The foreign matter will scratch the disc 201. Since the resin layer thus formed by coating is extremely thin, additional processing is required to prevent the disc from being damaged by the end face of the metallic substrate.
Also, in case of the tray having a resin layer out-sert molded on a part of the metallic substrate, it is difficult to form a resin layer as thin as 0.1 to 0.2 mm, for example, because of the characteristic of the out-sert molding. To prevent the resin layer from falling off from the tray, any processing has to be made of the substrate side, which will lead to increased costs of manufacturing.
Further, in case of the tray having a resin layer formed on a par of the metallic substrate, it is difficult to attach the thin layer with an adhesive. The attachment is likely to be out of place, and so will be difficult. Also, some of the adhesives used for this attachment of the cushion member have not any sufficiently high thermal resistance. Such an adhesive cannot keep the cushion member securely attached on the chuck levers 206a and 206b or the adhesive itself will possibly melt away, when the ambient temperature or temperature of the apparatus is higher.

Disk holding member, disk tray, recording and/or reproducing device, and disk changer


The present disclosure relates to an antenna assembly and a terminal. The antenna assembly includes: a metal protector of an image acquisition assembly, in which the metal protector includes a plurality of radiating slots which include a first radiating slot formed in a first direction and a second radiating slot formed in a second direction, and the first direction and the second direction are arranged at a first set angle; and a phase shift feed assembly configured to generate a first signal and a second signal having a phase difference of a second set angle, in which the first signal excites the first radiating slot, and the second signal excites the second radiating slot.

The way of life of human is changed with the popularization of positioning methods such as the Global Positioning System (GPS) and Beidou. Mobile phones, as the terminals with the highest frequency of access to the mobile Internet, install various location-based applications (APPs), which bring a revolutionary change to the transportation and travel methods of people. The positioning capacity of the mobile phone terminal is important, which largely depends on the signal receiving capacity of mobile phone antenna.
Electromagnetic waves of a satellite positioning antenna are circularly polarized. At present, considering the integrated body and the appearance of the mobile phone, the antenna is mostly built in the mobile phone. The common type of the positioning antenna in the mobile phone is Inverted-F Antenna (IFA). As shown in FIG. 1, a metal middle frame 10 of a terminal is combined with the antenna, a proper slot 11 is formed in a frame of an edge of the metal middle frame 10, and the metal frame serves as an antenna. Such an antenna form cannot control the polarization mode of the antenna, and are all linearly polarized, so that the polarization gain performance of the antenna is sacrificed. Moreover, for such an antenna form, the structural strength of the middle frame 10 is destroyed to a certain extent and the structural space of the middle frame is occupied, although the metal middle frame is effectively utilized.

Beijing Xiaomi Mobile Software Co., Ltd.


Systems and methods are provided for active cooling of a rechargeable energy storage system. A thermal conditioning system includes a cooling system configured to circulate a coolant to cool the RESS. A controller computes a generated heat amount of the RESS; computes a target temperature of the coolant based on the generated heat amount; and operates actuators of the thermal conditioning system to cool the coolant to the target temperature.

A rechargeable energy storage system (RESS), such as those that use batteries and/or other storage devices are in widespread use as electric power sources. In a number of RESS applications, heat generation has an effect on the capacity, performance and life of the batteries. In general, higher current flows result in greater heat generation. In applications such as electric vehicles, the system reaches high current levels during fast charging and when generating sufficient torque to accelerate the vehicle. Conventional cooling techniques rely on passive or forced convection to air, or on circulation of fluid through the battery pack. A common approach allows generated heat to build prior to initiating a cooling cycle, which leads to high peak-to-peak temperature excursions. Another approach is to circulate the air or fluid at rates that provide cooling in excess of the rate of heat generation under many typical operating conditions. These approaches lead to inefficiencies, including in operation of the cooling system itself.
Accordingly, it is desirable to provide improved methods for thermal cooling of a RESS, for example to improve energy efficiency and improve battery performance. It is also desirable to provide improved systems for thermal cooling of a RESS, and for vehicles that include such methods and systems. Furthermore, other desirable features and characteristics of the present invention will become apparent from the subsequent detailed description and the appended claims, taken in conjunction with the accompanying drawings and the foregoing technical field and background.

Proactive thermal conditioning system and method


Various methods and apparatuses are described for a power distribution structure. In an embodiment, an integrated circuit contains power gating cells that each contain Metal Oxide Semiconductor (MOS) device switches located relative in the power distribution structure to power up and down a block of logic containing a plurality of individual cells using these MOS device switches. The MOS device switches can be tuned to requirements of a target block of logic in order to meet its optimal voltage drop requirements during its active operational state while minimizing leakage current in its off state.

Controlling current leakage and power consumption through voltage drops (VD) across components can allow a designer to extended battery life for mobile computing devices as well as decrease heat generation in all devices. When using a Metal Oxide Semiconductor (MOS) device for gating power to a circuit, the device must be large enough that the voltage drop across the device in ON state does not impact the circuit performance. However, sometimes this comes at the expense of excess current leakage. Therefore, a device selected to be optimized to meet a target voltage drop requirement during active operation of one circuit is not optimal for all circuits. In designs of 65 nanometer spacing designs and smaller, current leakage can be a significant portion of an active power budget.

Structures and methods for optimizing power consumption in an integrated chip design


Receiver (105) for signals transmitted according to an orthogonal frequency division multiplexing technique with carriers distributed symmetrically around a centre frequency f.sub.e, said receiver comprising a frequency synchronizer (116) for the local oscillator (214). The synchronizer (116) utilizes the fact that part of the side carriers are not transmitted to ensure in the lock-on mode a frequency synchronization having a wide lock-on range. It may also be used in the permanent mode with very little jitter. The receiver can be used in digital television for receiving signals transmitted according to an orthogonal frequency division multiplexing technique.

The invention relates to a transmission system comprising a transmitter for transmitting signals in N carriers distributed symmetrically around a centre frequency f.sub.e, which signals have a spectrum comprised of a central part formed by N' transmitted carriers (N'<N) and a right-hand side part and a left-hand side part formed each by (N-N')/2 non-transmitted carders, this transmitter being connected to a receiver which comprises at least a frequency synchronizer which determines a synchronization correction signal, and a local oscillator controlled by said correction signal.
The invention likewise relates to a receiver for such a system.
Such a system has applications to the transmission of signals which have a symmetrical spectrum, such as different digital and analog signals. An example of such a signal is a signal transmitted according to an Orthogonal Frequency-Division Multiplexing technique, transmitted, more specifically, by way of Hertzian waves, by cable, by satellite, for example for applications to digital television.
The signals transmitted according to an N-frequency-division multiplexing technique will in the following be denoted by the simplified name of OFDM (Orthogonal Frequency-Division Multiplex) signals. The OFDM technique consists of dividing an information signal to be transmitted into fractions by distributing it over a large number of low-rate elementary channels. Thus, a highly selective wideband channel is transformed into a large number of non-selective elementary channels. Because they all form a wideband channel, it will be hardly likely that fading during transmission will simultaneously affect the whole channel. This technique makes it also possible to reduce intersymbol interference.
Each elementary channel thus corresponds to one frequency, all the frequencies being symmetrically distributed around a central carrier frequency. As it is hard to accept the use of selective filters at the receiving end, an overlapping of the spectra is preferably tolerated, but conditions as to orthogonality between the frequencies are then imposed to eliminate the intersymbol interference at the sampling instants. The whole spectrum of an OFDM signal thus tends towards a rectangular spectrum.
To avoid problems with spectrum overlapping at the receiving end due to the sampling of the received signal, the side carriers situated on the left and right of the frequency spectrum are not transmitted. In addition, the filtering at the receiving end can be performed with less steep edges.
At the receiving end the received signals are to be demodulated and then decoded to restore the original information signals. For this demodulation a local oscillator is used whose frequency is to be controlled by the transmitting frequency by means of a synchronization correction signal.
Such a system is known from the article entitled "Digital Sound Broadcasting to Mobile Receivers", by B. Le Floch et at, IEEE Transactions on Consumer Electronics, Volume 35, No. 3, August 1989. This article describes an automatic frequency control (AFC). This arrangement operates in that it detects the phase difference between the received signal and the estimated symbol of the constellation. It may thus detect a maximum frequency offset of .+-.1/8T between the local oscillator of the transmitter and the local oscillator of the receiver where T is the symbol duration. It may be deduced therefrom, that, for example, for a symbol duration T=160 .mu.s and a carrier frequency f.sub.e =500 MHz, the lock-on range is 781.25 Hz which requires a high-precision (.DELTA.f/f.sub.e)=1.56 p.p.m. and very stable local oscillator (for the receiver).
The disadvantage of such an arrangement is thus the necessity to have a high-precision, thus very costly, local oscillator, because the maximum acquisition range is .+-.1/8T. Thus, with such synchronizers, the acquisition range is very narrow and the receiver cannot be automatically locked-on to when there is considerable loss of synchronization.
The main object of the invention is thus to increase the acquisition range of the synchronizer. This is to be realised with a local oscillator which is not very precise and is thus less costly, for example, for mass production applications to digital television.

Transmission system and receiver for this system


A low current output driver for a gate array. The driver has first and second reference voltage sources, a first transistor of a first conductivity type, and a plurality of second transistors of a second conductivity type. The first transistor is connected between the first reference voltage source and the output. The second transistors are series connected between the first and second reference voltage sources. The control electrode of the first transistor is connected to a common point between two of the second transistors. At least one of the second transistors is diode connected to provide an intermediate voltage to the control electrode of the first transistor, thereby reducing the output current flow.

Conventional design of digital systems involves the selection and assembly of standard integrated circuits (ICs). However, it is often desirable to produce the digital system on a single large scale integrated circuit. If such large scale ICs are designed from scratch, they are referred to as custom chips. Custom chips are quite expensive to create and are usually only justified when the number of chips to be produced is quite large. Another approach is to utilize gate arrays which are sometimes referred to as semicustom chips. Gate arrays consist of a relatively large number of unconnected logic gates laid out in a prearranged pattern on a semiconductor substrate. Designs are implemented by individualizing the connection of these gates in the final metalization step.
Gate arrays have an advantage over custom chips in being relatively inexpensive to build. However, gate arrays typically only have a limited number of elements or cells from which to create a design. For example, many gate arrays have only a single size (fixed channel width and length) p channel transistor and a single size n channel transistor from which to select. Being restricted in the types of transistors available can create certain design problems.
A particular design problem that can arise is with drivers requiring higher or lower output current than available by selectively turning on or off a single transistor connected to a reference voltage. In the past, higher output current has been obtained by connecting a number of transistors in parallel. Similarly, lower current has been obtained by connecting the transistors in series. Series connection of transistors to reduce current can easily require dozens or even hundreds of transistors. This is inherently undesirable due to the large number of devices consumed.
One solution for avoiding series connected transistors is to simply accept higher than desired driver output current. This contributes to substantially increased chip power dissipation with no benefit to the design. An alternative solution is to make different size transistors available on the gate array. There are two ways this has been attempted in the past. One is by intermingling different size transistors in a predetermined layout pattern on the chip. This complicates the design process and can result in increased numbers of unused transistors. Another way is by providing dedicated areas on the chip for the layout of off size transistors. Another way is to provide such transistors in peripheral or pad areas of the gate array chip. This has the disadvantage of requiring the routing of relatively long wires which can waste layout space. It is also limited by the number and size of peripherally placed transistors, thereby reducing flexibility in the design of multiple drive current values.


A system and method for detecting a phase-to-ground fault in an AC electrical machine operates to receive measurements of three-phase voltages and currents provided to the AC electrical machine, compute at least one of a zero sequence component and a negative sequence component of voltage and current from the three-phase voltages and currents, and calculate a fault severity index (FSI) based on the zero or negative sequence component of voltage and current, so as to identify a phase-to-ground fault in the AC electrical machine. Calculating the FSI further includes determining a total value of the zero or negative sequence current, determining a noise-contributed value of the zero or negative sequence current included in the total value, determining a compensated value of the zero or negative sequence current based on the total value and the noise-contributed value, and calculating the FSI based on the compensated value.

The present invention relates generally to three-phase alternating current (AC) electrical machines or motors and, more particularly, to a system and method for detecting stator faults in such electrical machines.
In industrial facilities, electrical machines such as generators, AC motors, and/or transformers are used in various applications. As one example, induction motors are used for applications like pumping, cooling, material movement, and other applications where cost-efficient and robust motors are required. When these motors fail, the processes in/with which they are employed suffer downtime, which leads to costs associated with such downtime being incurred.
It is recognized that various factors can lead to failure of an electrical machine, including failures in the bearings, stator, and/or rotor of the machine with faults related to the stator attributing to 36% of all failures. Of these stator faults/failures, 76% of these faults/failures are considered stator winding faults, which generally refers to failures of the winding insulation that lead to inter-turn faults and phase-ground faults. With respect to the stator winding faults in the system, these faults may be caused by the gradual deterioration of winding insulation due to a combination of electromechanical-force-induced vibration, high dv/dt voltage surges, thermal overload, and/or contamination. If a stator winding fault occurs and the windings of the stator are shorted, a large circulating fault current is induced in the shorted turn, leading to localized thermal overloading. This localized thermal overloading can eventually result in motor breakdown due to ground-fault/phase-to-phase-insulation or open-circuit failure within a short period of time, if left undetected.
Traditionally, phase-ground faults due to stator winding failures are detected by measuring the currents flowing into the earth using a current transformer (CT) or by using the three-phase currents. However, various factors like system leakage currents, high-resistance grounding, supply harmonics, and/or unbalance in the CTs make it difficult to achieve very reliable detection of ground faults under varying system conditions and for various motor sizes. Additionally, the cost associated with the use of a dedicated CT for detecting ground faults may be prohibitive.
It would therefore be desirable to provide a system and method that is capable of detecting phase-ground faults in electrical machines for purposes of diagnosing stator faults. It would also be desirable for such a system and method to detect phase-ground faults without the use of a dedicated ground fault CT and in a manner that eliminates the effects of system leakage currents, high-resistance grounding, and/or supply harmonics, that might make it difficult to achieve reliable detection of a ground fault.

System and method for detecting stator faults in AC electrical machines