An industrial PC-compatible computer system for telecommunications applications is described. The computer system includes a plurality of peripheral boards, each of which includes a peripheral processor. A computer telephony bus provides communications among the peripheral boards. The computer system also includes a plurality of system processors. A serial telecommunications bus arrangement provides communications between the plurality of peripheral boards and the plurality of system processors. The computer system arrangement providing for greater reliability in the event of a failure of a peripheral board, a system processor or of the communications therebetween.

The invention relates generally to the field of computers, and more particularly to the communication buses used for communications within a computer.
Communications within a computer take place along pathways known as buses. It can be appreciated that it is difficult, if not impossible, to design a bus that meets all the requirements that might be placed on it regardless of the type of computer with which it is associated. Some of these requirements include high speed, the ability to handle large amounts of data (typically produced by so called xe2x80x98multi-mediaxe2x80x99 devices), the ability to communicate with devices in remote locations, the ability to provide high reliability communications, compatibility with a large array of peripheral devices and be low cost. This list is by no means exhaustive but it indicates the types of competing, sometimes mutually exclusive requirements placed on buses.
The ISA (Industry Standard Architecture) bus was introduced by IBM in 1984. This 16-bit/8-MHz bus became the industry standard in computers. However, difficulties began to arise when 32 bit processors were introduced. Such processors along with the introduction of peripheral devices that generate large amounts of data made this a narrow and slow means of communication. The increasing requirements placed on buses required that a new, more flexible architecture be introduced.
U.S. Pat. No. 5,263,139, issued on Nov. 16, 1993 to Testa et. al., discloses a multiple bus architecture that allows flexible communications between a processor or processors and other systems. FIG. 1 of this application shows a block diagram representation of such a bus architecture. Multiple buses 106, 108 and 110 are connected to a main system interconnect bus 112. Bus 108 connects the processor(s) 100, bus 106 is, for example, a SCSI bus that connects external devices 102 and bus 110 provides communications for remote devices 104. The patent proposes bus 110 could be an ISDN connection. These buses provide specialized communications for the various systems allowing performance to be optimized for increased data throughput.
The speed of data transfer between the processor and subsystems can be increased by reducing the length of the transmission path i.e. the central processor and peripheral boards are located within a defined, short distance of one another, thereby limiting delays due to transmission length. This idea is the basis for xe2x80x98local busesxe2x80x99. The current standard in local buses, and buses in general, is the Peripheral Component Interconnect (PCI) bus. The PCI bus is a local bus that was introduced by Intel in 1991. The specifications of a PCI bus can be found in the Peripheral Component Interconnect (PCI) Local Bus Specification Revision 2.0, dated Apr. 30, 1993 (xe2x80x9cthe PCI Specificationxe2x80x9d) published by the PCI Special Interest Group.
FIG. 2 shows a simplified block diagram representation of an implementation of a PCI bus. The PCI bus 204 forms a one-to-many connection between the CPU 200 and the peripheral components 202, which are located in the same chassis.
The PCI bus is installed on most new desktop computers. It transmits 32 bits at a time in a 124-pin connection (the extra pins are for power supply and grounding) and 64 bits in a 188-pin connection in an expanded implementation. PCI buses use all active paths to transmit both address and data signals, sending the address on one clock cycle and data on the next. Burst data can be sent starting with an address on the first cycle and a sequence of data transmissions on a certain number of successive cycles.
PCI buses are often used for three purposes. First, they can be used to expand the capabilities of a computer""s motherboard. In this scenario expansion boards are inserted in slots on the motherboard that are connected to the PCI bus. The Central Processing Unit (CPU) of the motherboard can then access the circuitry of the expansion board. Second, the PCI bus can be used to add processing power to a computer system. In this scenario, the expansion boards that are inserted in the motherboard are equipped with at least one CPU. The PCI bus allows the CPU of the motherboard to communicate with the expansion CPU. Finally, it allows for a multi-CPU computer system, the PCI bus can be used by the CPUs to share resources such as memory devices.
The PCI bus has become widely implemented in computer systems. This is particularly true in the area of personal computers (PCs). This wide implementation implies that there are many components that are compliant with the PCI Specification. Computer systems that do not use these PCI compliant components are not as easy to implement.
There are some limitations of the PCI bus that while not being particularly troublesome for personal computers (PCs) are significant to industrial grade PCs used in more xe2x80x98criticalxe2x80x99 applications. These limitations include: latencies created by the continually increasing amounts of data that can be produced by today""s peripheral boards, bus reliability and susceptibility to xe2x80x98single pointxe2x80x99 failures, and the ability to locate the peripheral boards in remote locations with respect to the system processor.
First, the issue of bus latency has become more of a concern as peripheral boards transmit larger amounts of data. In particular, multi-media devices that handle audio or visual data transmit large amounts of data that requires real time processing. During times when data is being transferred from such data intensive peripheral boards the other devices on the bus are idled. The resulting bus latency can create undesirable degradations in performance. In these cases the PCI bus becomes the xe2x80x98bottleneckxe2x80x99 in the computer. U.S. Pat. No. 5,682,484, issued on Oct. 28, 1997 to Lambrecht, discloses the use of a separate, dedicated, multi-media bus for data intensive devices. In one scenario control information is transmitted on the PCI bus while real time data is transferred on the multi-media bus. In an alternative embodiment a separate serial bus is used for control signals. Thus, the use of a serial bus for control signals and a multimedia bus is known.
Second, PCI buses do not provide high reliability communications. The PCI bus is a single electrical connection between the central processor and every peripheral board connected to the bus. It is a one-to-many communication bus i.e. one central processing unit to many peripheral boards. Both address and data signals are transmitted on the PCI bus, sending the address on one clock cycle and data on the next. If there is a malfunction on a peripheral board that impairs communication on the bus, the central processing unit will be prevented from communicating with every other peripheral board due to the common electrical connection. This type of bus failure is known as a xe2x80x98single pointxe2x80x99 failure. Thus, a failure of an individual peripheral component can interrupt the communications between the system processor and other peripheral boards on the same PCI bus. Such a situation is quite undesirable in high reliability applications such as telephone switching. One approach for overcoming this problem is with the use of redundancy. The reliability requires a completely redundant system i.e. duplicate system processors, PCI buses and peripheral boards. The redundant system can be maintained as redundant or provide load sharing for the primary system. This solution consumes considerable space and is costly.
Finally, the speed of communications prescribed by the PCI Specification requires the use of a local bus. The maximum length of bus prescribed in the PCI Specification is several inches which prohibits communication with any peripheral boards that is in a remote location with respect to the central processor. U.S. Pat. No. 5,781,747 issued to Smith et. al. on Jul. 14, 1998, proposes a system for extending the distance over which communications can take place. Their proposal is schematically shown in FIG. 3. The CPU 300 and local peripheral components 302 are connected to a PCI bus 304. The patent uses xe2x80x9ccables or other transmission mediumxe2x80x9d 308 to connect a remote PCI bus to which peripheral components 306 are attached. This method requires hardware and software to convert the communications signals from PCI protocols to those that can be used in the cable network. This must be performed at each end of the cable. While this system extends the physical range of communication using a PCI protocol it is still susceptible to the other problems associated with a PCI bus.
The above discussion of bus architecture should now be brought into the context of industrial computers. The grouping of industrial computers comprises both PC- compatible systems that are designed for industrial applications and more specialized passive-backplane computers. This latter group often use rack based architectures that follow the Eurocard form factor as outlined in the CompactPCI Specification (PICMG 2.0 Revision 2.20) dated Jun. 17, 1997. Industrial computers can contain many peripheral boards that generate large amounts of data e.g. audio and telephony applications. Further, industrial computers are often used in telecommunications applications where high reliability is required. For example, a so called xe2x80x98carrier gradexe2x80x99 system has an availability of at least 99.999%. This is a common reliability requirement in the telecommunications industry. All of these requirements make the PCI bus a less than optimal solution for communication between the system processor and peripheral boards or between peripheral boards of an industrial computer system.
Therefore, there is a need for a bus architecture that provides high reliability communication between system processor(s) and peripheral boards of an industrial computer system. The bus architecture should not be susceptible to single point failures. The bus architecture should also address the difficulties associated with large amounts of low latency data such as digitized voice and allow the peripheral boards to be located remotely from the system processor. Finally, the bus architecture should be implementable within standard industrial PCs. A bus architecture that addresses these points is therefore desirable. The current invention addresses the above points by the use of established telecommunications protocols and systems in a novel architecture for communications between the system processor and peripheral boards.
In one embodiment of the invention an industrial PC-compatible computer system for telecommunications applications is provided. The computer system includes a plurality of peripheral boards, each of which includes a peripheral processor. A computer telephony bus provides communications among the peripheral boards. The computer system also includes a plurality of system processors. A serial telecommunications bus arrangement provides communications between the plurality of peripheral boards and the plurality of system processors.
In another embodiment of the invention a bus architecture for providing communications in an industrial PC-compatible computer system, including: a plurality of peripheral boards, with each peripheral board including a peripheral processor, a plurality of system processors and a plurality of telecommunications hubs, for telecommunications applications is provided. The bus architecture includes a computer telephony bus for providing communications among the plurality of peripheral boards and a serial telecommunications bus arrangement for providing communications between the plurality of peripheral boards and the plurality of system processors.

Bus architecture for high reliability communications in computer system


Disclosed are various embodiments for facilitating collaborative browsing of a network site by multiple users. A user interface is rendered in a computing device, and the user interface facilitates participation in a collaborative browsing session by multiple users including a master user and one or more other users. The user interface includes a browsing window that is configured to facilitate browsing of a network site by the master user. An indication of a status change of the browsing window is sent to another computing device when the computing device corresponds to a client in use by the master user. The indication of the status change excludes graphical screen capture data. The status change is replicated in the browsing window when the computing device corresponds to a client in use by the one or more other users.

Groups of friends may like to go shopping together in shopping malls, department stores, and/or in other brick-and-mortar retail stores. Each may want the opinions of the others regarding the products they are examining or trying on prior to purchasing the products. In the context of an online retail store, a customer may copy a uniform resource locator (URL) of a network page that describes a product and send the URL in an email to one or more friends. The friends may then pull up the network page referenced by the URL in a browser, view the product information, and give an opinion in a return email to the customer.

Collaborative browsing on a network site


A method is described for improving the mechanical stressability of ammunition bodies, particularly shaped charges, which are highly accelerated and/or subjected to shock waves by coating the contacting portion of the cavity. In a first step of the method, the charge liner is coated on its outer surface and the case is coated on its inner surface with a styrene-containing copolymer; in a further step of the method, the explosive charge is cast or compressed in a known manner. The method finds use particularly for the production of tandem shaped charge projectiles.

When ammunition bodies are used, particularly those with tandem shaped charges, the danger exists that the first, front cavity charge (also referred to as the "precursor charge"), upon being detonated, exerts an undesirable shock effect on the second, rear charge (the main charge). This can lead to interference with the formation or the symmetry of the jet or even to premature detonation of the main charge.
To eliminate in-bore explosions and/or premature detonations, thermal treatments of the ammunition bodies have been proposed. However, such solutions have been unable to eliminate the problem satisfactorily.

Method for improving the mechanical stressability of ammunition bodies with shaped charges

Schweizerische Eidgenossenschaft Vertreten Durch Die Eidg. Munitionsfabrik Altdorf Der Gruppe Fuer Ruestungsdienste


A direct memory access (DMA) buffer section configured to store data in a plurality of storage regions in units of DMA transfers, a buffer control section configured to output a first writing permission signal for permitting the DMA transfer on the basis of presence or absence of a free storage region, a smoothing buffer control section configured to output a second writing permission signal for permitting the DMA transfer within a predetermined period, a buffer writing control section configured to execute the DMA transfer according to the first writing permission signal and the DMA transfer according to the second writing permission signal and stored the data to the free storage region, and a buffer reading control section configured to sequentially read the data for each storage region, wherein a predetermined amount of data sequentially acquired by a plurality of DMA transfers is output as a transfer unit.

In an imaging device such as a still-image camera or a moving-image camera, various image processing is performed by an image processing device such as a mounted system LSI. In many image processing devices mounted on an imaging device, a plurality of functional blocks configured to perform image processing are provided and are connected to an internal data bus. Also, in the image processing device, for example, a dynamic random access memory (DRAM) which is a storage device configured to temporarily store image data to be subjected to image processing is connected. The DRAM is connected to a data bus inside the image processing device and shared by functional blocks connected to the data bus. In such an image processing device, each functional block operates as a data transfer device configured to perform the transfer of image data to and from the DRAM, i.e., the reading of image data to be subjected to image processing from the DRAM or the writing of image data to the DRAM after the image processing according to a direct memory access (DMA) transfer via the data bus.
In the image processing device, a bus arbiter for arbitrating the DMA transfer of each functional block (a data transfer device) to and from the DRAM is provided. The bus arbiter arbitrates an access request (hereinafter referred to as a "DMA request") based on the DMA transfer output from each functional block and controls access to the DRAM by the functional block receiving the DMA request. To maximize the efficiency of the DMA transfer, the arbitration of the DMA request by the bus arbiter reduces a loss time during which the DRAM cannot accept the access (for example, a bank loss time related to a bank, a reading/writing switching loss time related to switching between the reading of data and the writing of data, or the like) and is performed on the basis of a priority set for each functional block in accordance with a predetermined condition. That is, the bus arbiter arbitrates the DMA request from each functional block to preferentially receive a DMA request from a functional block with a high priority.
Each functional block (a data transfer device) provided in the image processing device is also configured to include a DMA buffer with a predetermined storage capacity in consideration of a case in which an output DMA request is not accepted by the bus arbiter. In a functional block having a configuration including the DMA buffer, a predetermined amount of image data to be subjected to image processing is acquired according to the DMA transfer (reading from the DRAM) and pre-stored in the DMA buffer, and image processing is performed while the image data stored in the DMA buffer is read at a timing when necessary thereafter. In the functional block including the DMA buffer, a subsequent DMA request is output in accordance with a free capacity of the DMA buffer. Thereby, in the functional block including the DMA buffer, the image data can be transferred at a desired transfer rate according to the DMA transfer, and the image processing can be completed during a predetermined period.
Meanwhile, in the functional block (the data transfer device) having the configuration including the above-described DMA buffer, there are a period during which the DMA transfer is frequently performed and a period during which the DMA transfer is seldom performed in the process of image processing. This is because the functional block having the configuration including the DMA buffer continues to successively output DMA requests from an initial timing at which the image processing starts until the storage capacity of the DMA buffer is in a full state and outputs the DMA request only when the storage capacity of the DMA buffer is in a free state if the storage capacity of the DMA buffer is in the full state. Here, in the functional block (the data transfer device) including the DMA buffer, a period during which the DMA request continues to be successively output until the storage capacity of the DMA buffer is in the full state is a period during which the DMA transfer is frequently performed and a period during which the DMA request is output only when the storage capacity of the DMA buffer is in the free state is a period during which the DMA transfer is seldom performed.
Thus, in a system including a functional block (a data transfer device) having a configuration including a DMA buffer as described above, a system operation, i.e., an operation of an image processing device or an imaging device equipped with the image processing device, may fail according to a priority preset for arbitrating the DMA request from each functional block. For example, when the priority is set for each functional block, the system operation may fail if a high priority is set for a functional block having a configuration including a DMA buffer in accordance with a period during which the DMA transfer is frequently performed. This is because, if a functional block having a configuration including a DMA buffer for which a high priority is set continues to successively output DMA requests during a period when the DMA transfer is frequently performed, i.e., if the DMA requests are output in a concentrated manner, the DMA request of another functional block with a low priority is not accepted and the functional block with the low priority cannot perform the DMA transfer. In contrast, for example, when the priority is set for a functional block having a configuration including a DMA buffer, if a low priority is set for a functional block of a configuration including a DMA buffer in accordance with a period during which the DMA transfer is seldom performed, i.e., if a high priority is set for another functional block, the DMA transfer cannot be performed during a period in which the functional block of the configuration including the DMA buffer frequently performs the DMA transfer and the system operation may fail as expected.
Therefore, a setting process for sequentially changing the priority in consideration of each of a period during which the DMA transfer is frequently performed and a period during which the DMA transfer is seldom performed in the functional block (the data transfer device) of the configuration including the DMA buffer is conceived. However, the number of functional blocks (data transfer devices) having the DMA buffer is not limited to one in the system, and a process when the priority is set for each functional block becomes more complex as the number of functional blocks with a configuration including the DMA buffer included in the system becomes larger. Also, if the temporarily determined setting of the priority is changed, i.e., if it is necessary to change a condition when the priority is set, the change in the condition can cause a failure of a system operation.
In this manner, in a system including a functional block (a data transfer device) having a configuration including a DMA buffer, even when a DMA request is arbitrated on the basis of a preset priority for each functional block, a system operation may fail according to a setting of a priority for each functional block.
Therefore, for example, as in Japanese Unexamined Patent Application, First Publication No. 2006-039672, technology for alleviating the concentration of DMA requests from a specific functional block (a bus master) has been disclosed. In Japanese Unexamined Patent Application, First Publication No. 2006-039672, a method of controlling the right to use a bus so that a bus master having a high priority does not exclusively occupy the right to use the bus is disclosed. More specifically, in Japanese Unexamined Patent Application, First Publication No. 2006-039672, technology in which an interval predetermined for each DMA request output by the bus master is available so that the DMA transfer in another functional block is not inhibited when a bus master with a high priority successively outputs DMA requests is disclosed. In other words, according to the technology disclosed in Japanese Unexamined Patent Application, First Publication No. 2006-039672, a functional block (a bus master) for which the output DMA request is accepted by the bus arbiter does not output the next DMA request until a predetermined time elapses and therefore DMA requests from functional blocks (bus masters) with the high priority are not concentrated. Thereby, a DMA request output during a period until a predetermined time elapses can also be accepted for a functional block (a bus master) having a low priority.

Data transfer device, image processing device, and imaging device


Described are a system, method and device to transmit data frames. A first port may transmit and receive data according to a packet based data transmission protocol at a first nominal data transmission rate and a second port may transmit and receive data according to a stream based data transmission protocol at a second nominal data transmission rate. The second port may forward received data frames to the first port for transmission according to the packet based data transmission protocol. A pause request frame generator may periodically insert a pause request frame among the forwarded data frames on a set period based, at least in part, on a difference between the first and second nominal data transmission rates.

1. Field:
The subject matter disclosed herein relates to data transmission systems. In particular, the subject matter disclosed herein relates to the transmission of data frames in data links.
2. Information:
Local area networks (LANs) have enabled enterprises to operate data communication networks enabling devices such as personal computers, printers, data servers and the like to exchange data over a locally maintained transmission medium. Data links to couple these devices in a LAN typically transmit data between devices according any one of several Ethernet protocols provided in versions of IEEE Std. 802.3. Wide area networks (WAN) have enabled enterprises to couple LANs at different geographical sites to communicate by coupling the LANs by one or more high-speed data links. Such high-speed data links may be provided by a data communication service provider such as a telecommunication service provider. These high speed data links are typically part of a network backbone and formed according to the "Synchronous Optical NETwork" (SONET) protocol as indicated in a set of standards provided by the American National Standards Institute (ANSI T 1.105.xx) or "Synchronous Digital Hierarchy" (SDH) protocol as indicated in a set of recommendations provided by the International Telecommunications Union (e.g., ITU-T G.707, G. 708, G.709, G.783 and G.784).
In transmitting data between LANs, SONET links may encapsulate Ethernet frames in SONET for transmission between access ports on respective LANs. For example, an access port on a LAN may be adapted to transmit and receive data frames at a data rate of about 10 gigabits per second according to the 10 Gigabit Ethernet standard as provided in IEEE Std. 802.3ae-2002. The access port may then be coupled to a SONET link provisioned to provide data rate of about OC-192 capable of transmitting the encapsulated data frames at a data rate of about 9.5 gigabits per second.
FIG. 1 shows schematic diagram of a prior art access port 10 to initiate transmission of a pause request frames to a data source in response to the contents of a transmit buffer 12. On a LAN side, media access controllers 18 control the transmission of Ethernet frames to a WAN. Coupled to the WAN are a data transmitter 14 to transmit Ethernet frames encapsulated in SONET frames and a data receiver 16 to receive Ethernet frames capsulated in SONET frames. The data transmitter 14 and data receiver 16 each comprise an Ethernet MAC and a WAN interface sublayer (WIS) to encapsulate Ethernet frames in and de-encapsulate Ethernet frames from SONET frames as provided in IEEE Std. 802.3ae-2002, clause 50.
To prevent egress traffic from the LAN from overrunning the WAN's capacity to transmit data, a transmit buffer 12 may store Ethernet frames for transmission to the WAN. A flow control device 22 may also transmit a pause frame request to the LAN to request suspending the transmission of Ethernet frames for a predetermined period in response to the transmit buffer being full. Such a pause frame request may be provided as provided in IEEE Std. 802.3-2000, Clause 30.

Network synchronization device, system and method


Methods, systems, and apparatuses are disclosed for a computer-implemented method for facilitating electronic data interchange (“EDI”) communication. An EDI document from a first trading partner is in a first format, with data in a plurality of fields. The fields are mapped to fields of an EDI standard. The data in the mapped fields are translated to an intermediate format to create an intermediate format file. Rules, which may be customized, may be applied to the intermediate format file. The rules may include business rules customized for the first trading partner, math rules and/or logic rules. The intermediate format file may be verified to determine whether it complies with the EDI standard and/or the business rules of the first trading partner. The data from the intermediate format to a second format compatible with a computer system of a second trading partner, to create a second format file.

Electronic data interchange (EDI) is a structured way of exchanging data electronically, directly between computer systems, according to particular standards. EDI standards set out the proper format, characters, and data elements to be used in EDI communication. There are several different standards currently being used throughout the world and others may be developed from time to time. EDI communications often occur between trading partners, such as individuals, businesses, government organizations, charities, and other organizations and entities which have a need to exchange data directly between computer systems. The relationship between trading partners may be that of buyer and seller, but may also be that of merchant and warehouse, merchant and shipper, supplier and third party supplier, collaborators of various sorts, or any other relationship for which the members find electronic transmission of data advantageous. EDI communications may also take place between computer systems owned by a single organization; that is, the EDI communications may include internal communications, as well as external communications.
While EDI communications are often used among businesses, EDI communications are not so limited. They may include, for example, scientific information, medical information, transportation information, engineering information, or any other communication where the exchange of data directly between computers is likely to be useful. The EDI transmission of the data commonly uses any convenient method and may include internet as well as non-internet transmission, either via hard wire or wireless methods.
Even using a common standard, implementation of EDI format differs among trading partners. While an invoice, for example, may contain several types of data as a minimum in order to comply with an EDI standard, the invoices of different entities may vary considerably according to their particular industry and needs. Thus, transmitting a first trading partner's EDI data to a second trading partner, and displaying the data correctly in the second trading partner's format, can be problematic.
In addition, while working out the difficulties of communication between just two trading partners might be a limited problem, large organizations may have not just one but dozens, hundreds, or even thousands of trading partners. And each of the dozens or hundreds of trading partners may themselves have one, two, dozens, hundreds, or thousands of trading partners. With each having slightly different arrangements of EDI documentation, EDI communication becomes more complex. The issue is also complex for using an EDI multi-tenant platform, which hosts and facilitates EDI communication among many trading partners.
One approach to this problem is described in the Wikipedia entry for "Electronic Data Interchange":                For an "inbound" document the EDI solution will receive the file (either via a Value Added Network or directly using protocols such as FTP or AS2), take the received EDI file (commonly referred to as a "mailbag"), validate that the trading partner who is sending the file is a valid trading partner, that the structure of the file meets the EDI standards and that the individual fields of information conforms to the agreed upon standards. Typically the translator will either create a file of either fixed length, variable length or XML tagged format or "print" the received EDI document (for non-integrated EDI environments). The next step is to convert/transform the file that the translator creates into a format that can be imported into a company's back-end business systems or ERP. This can be accomplished by using a custom program, an integrated proprietary "mapper" or to use integrated standards based graphical "mapper" using a standard data transformation language such as XSLT. The final step is to import the transformed file (or database) into the company's back-end enterprise resource planning (ERP) system.        For an "outbound" document the process for integrated EDI is to export a file (or read a database) from a company's back-end ERP, transform the file to the appropriate format for the translator. The translation software will then "validate" the EDI file sent to ensure that it meets the standard agreed upon by the trading partners, convert the file into "EDI" format (adding in the appropriate identifiers and control structures) and send the file to the trading partner (using the appropriate communications protocol).        In EDI terminology "inbound" and "outbound" refer to the direction of transmission of an EDI document in relation to a particular system, not the direction of merchandise, money or other things represented by the document. For example, an EDI document that tells a warehouse to perform an outbound shipment is an inbound document in relation to the warehouse computer system. It is an outbound document in relation to the manufacturer or dealer that transmitted the document."
But even using the approach disclosed above, for outgoing documents, the translator must understand what data to retrieve from locations within the database, or ERP file used by the transmitting trading partner, to transform it into a first EDI format used by the transmitting trading partner. For incoming documents, the translator must understand how to take incoming EDI data in the first EDI format used by the transmitting trading partner and convert it into a second EDI format used by a receiving trading partner. Both processes can be complex problems, requiring coding specific to the trading partner's format. If the translator retrieves data and formats it incorrectly, error can result.
As a part of or after translation from a first EDI format, many systems push the data into a database. When the data is translated into a second trading partner's version of EDI, the translator must know which data to retrieve from the database.
Alternatively, in some cases, such as with a first trading partner of significant size, the second trading partner will be forced to adopt the first trading partner's version of EDI, even if that version is a poor fit for the second trading partner's business.

Methods, systems and apparatuses for scalable electronic data interchange communications with smart web forms


A method and system are shown for protecting the threaded ends of tubular goods such as oil field tubulars from physical damage and corrosion due to environmental factors. A thread protector is formed of a polymeric body having cylindrical wall portions which engage the threaded ends of the tubular goods. Instead of relying upon a separate thread compound or corrosion inhibitor applied to the exposed threads, the polymeric body has incorporated therein a corrosion inhibiting compound, which is blended within the polymeric body as a part of the manufacturing process used to mold the polymeric body. The thread protector of the present disclosure includes a weather barrier to minimize exposure of the threaded ends of the tubular goods to moisture and other contaminants. The weather barrier includes a weather barrier ring and an air vent.

A. Field of the Invention:
The present invention relates to a method and system for protecting the threaded ends of pipes, such as oil field tubular goods, from physical damage and corrosion by providing a thread protecting end caps formed of a polymeric body having a corrosion inhibitor integrally molded therein and having a weather barrier system, and to a method for recycling used end protectors.
B. Description of the Prior Art
Drill pipe, tubing and casing—oil field tubular goods (OFTG)—for oil and gas drilling, completion, production and stimulation activities are typically held in a storage or pipe yard after they have been received from the fabricator or returned from downhole use. A major industry has developed in protection of such oil field tubular goods, also called "tubulars," to prevent them from corroding during periods of storage. The storage is not permanent, typically extending for a number of months or until a need arises for a specific size and grade of the tubular in question. The tubular goods are typically cleaned before storage in order to prepare them for shipment to the rig site at a future date. However, corrosion due to water and oxygen may quickly attack the precisely machined threads, which then cannot provide a satisfactory threaded connection. Pipe thread corrosion may be ordinary oxidation, or rust, or maybe aggravated by micro-organisms which feed on various materials on the surface of the thread, producing an acid which causes pitting of the threads.
The exposed threaded ends of tubular metal goods are conventionally protected by some sort of supplemental means in order to extend their storage life. For example, physical thread protectors in the form of plastic or elastomeric end caps or end caps made from metals such as steel, brass or copper have been placed on the threaded ends of tubular goods to provide protection from physical abuse and from corrosion. Chemical compositions which act as running compounds and/or corrosion inhibitors are also applied to the thread surface regions of the tubulars, which combined with thread protectors serve to function as a system to prevent impact and corrosion damage to the valuable and vital thread areas. For example, API (American Petroleum Institute) pipe dope (thread compound) is utilized, although it is generally low in corrosion inhibiting properties. Pipe dope is intended to be used as a running thread compound with lubricating and sealing properties. It is a thick grease based material which may contain lead, other heavy metals and filler materials to seal the thread passageways found in the threaded connection of oil field tubular goods. An example of a storage compound as opposed to a thread compound is a product sold under the trademark KENDEX that is a wax based material which is only applied to prevent or inhibit corrosion. Other lighter materials, such as a light oil might be utilized as well if the pipe is to be used within a day or two of the time it is threaded.
While in some cases the applied compounds and solids are captured and recycled, they are sometimes allowed to be discharged into the environment, presenting the problems of hazardous waste containment and removal. Once the tubulars are threaded the manufacturer must apply either a pipe dope or storage compound then apply a thread protector to prevent corrosion and/or impact damage. OFTG threads are frequently subjected to a series of inspections once shipped from the manufacturer. These inspections require the removal of the thread protector and the applied compound. The compound on the thread protector and the threaded ends must be treated as hazardous waste and therefore present an expensive containment and removal problem.
Pipe dope compositions are less than an optimum solution as a storage compound since these products do not offer sufficient anti-corrosion properties and often contain hazardous materials such as lead, copper, zinc, and hydrocarbons. Storage compounds cannot be used as an API thread running compound as they do not exhibit sufficient lubricity properties, sealing properties and must be cleaned from the threaded connection thoroughly before the API thread compound and sealant is employed.
The mechanical end caps or thread protectors have traditionally functioned primarily to protect the threads against impact damage if the pipe is accidentally dropped or bumped. Many of the prior art thread protectors are loose fitting "dust covers" and are of little value in preventing impact damage or the intrusion of moisture into the thread region. Certain of the prior art designs are "cup-shaped" and thus offer a tighter fit and incorporate moisture seals, such an O-rings, in an effort to improve corrosion protection.
The prior art end caps are generally removed near the well site and often are contaminated with immersed crude oil, pipe dope, drilling mud and accumulated tars and lighter oils that are found on the drill site. As a result, recycling the plastic or elastomeric polymers making up the prior art end caps has been economically unfeasible in many instances due to the cost of cleaning the waste polymer pieces for recycle processing.
A need exists for an improved end cap for protecting the threaded ends of oil field tubular goods from physical damage and corrosion which eliminates the need for pipe dopes, greases, heavy metal constituents, or hazardous materials used in the past.
A need also exists for such an end cap which has incorporated therein a corrosion inhibiting compound, the compound being integrally molded within the polymeric body.
A need also exists for an improved end protector composition which can be easily and economically recycled by eliminating the need of much of the cost of cleaning waste polymer pieces before recycle processing.

Thread protection system with weather barrier


A method for producing a fiber molded article comprising the step of transferring a fiber molded article 10 formed in a papermaking mold 2 composed of splits 20 and 20′ to a split 30′ of a drying mold 3, in which the papermaking mold 2 is once opened while attracting the fiber molded article 10 to the inner surface of the split 20′ by suction to separate the fiber molded article 10 from the inner surface of the split 20, the papermaking mold 2 is closed, the suction by the split 20′ is stopped, the papermaking mold 2 is opened again while attracting the fiber molded article 10 to the inner surface of the split 20 to separate the fiber molded article 10 from the split 20′, the split 20 is joined with the split 30′, the fiber molded article 10 is attracted to the inner surface of the split 30′ by suction, and the fiber molded article 10 is separated from the split 20.

Some methods of producing pulp molded articles involve a step of transferring a molded article having been formed and dewatered in a papermaking mold to a drying mold for drying the molded article. The technique described in JP-A-10-227000 is included under this type of methods.
According to the technique disclosed, a papermaking mold (upper mold) is immersed in a raw material slurry, and the slurry is sucked up to deposit the pulp component on the inner surface (a papermaking screen) of the papermaking mold. The papermaking mold is pulled out of the slurry, and the suction is continued to dewater the pulp component to obtain a molded article having a prescribed water content. The papermaking mold is joined with another mold (lower mold). The suction through the papermaking mold is stopped so that the molded article is transferred to the other mold by its own weight. The other mold is then joined with a drying mold (another upper mold) to dry the molded article.
However, the operation of transferring a pulp molded article from a papermaking mold to another mold sometimes fails because the molded article has been brought into intimate contact with the inner surface of the papermaking mold (papermaking screen) by the suction force exerted for dewatering. Where, in particular, a hollow bottle-shaped pulp molded article is formed and dewatered on a papermaking mold composed of a set of splits and then transferred to another mold by (i) opening the split papermaking mold with the molded article stuck to one of the splits and (ii) attracting the molded article to the other mold by suction, the papermaking screens provided on the inner surface of the splits leaves their mesh marks on the outer surface of the molded article during dewatering. The mesh marks cause a gap between the molded article and the other mold. As a result, the suction force exerted between the other mold and the molded article tends to be insufficient for stably transferring the molded article between the two molds.
Accordingly, an object of the present invention is to provide a method and an apparatus for producing a fiber molded article in which a fiber molded article formed in a papermaking mold can be transferred to another mold stably and securely.

Production method and device for fiber molding


An epoxy optical sheet comprising a hardened sheet of an epoxy resin and another resin layer formed on one side thereof. The sheet has a retardation of 5 nm or less, an average thickness of 500 xcexcm or less, a thickness accuracy of xc2x110% or less, a glass transition temperature of 170xc2x0 C. or above, and a smooth surface. The epoxy optical sheet is made by a continuous process which comprises: successively forming a strippable resin layer on a support having a smooth surface; successively spreading an epoxy resin coating solution comprising an epoxy resin, a hardener, a hardening accelerator, and a leveling agent, on the resin layer in the form of a sheet; followed by a hardening treatment, thereby forming a hardened sheet adhering to the resin layer; and, at the same time, recovering the hardened sheet together with the resin layer from the support.

This invention relates to an epoxy optical sheet excellent in optical properties and heat resistance, and a process for producing the epoxy optical sheets at high mass-productivity.
Conventional optical sheets made of epoxy resins are those obtained by pouring an epoxy resin into a space of a cast mold followed by hardening (JP-A-6-337408, JP-A-7-28043 and JP-A-7-120741; the term xe2x80x9cJP-Axe2x80x9d as used herein means an xe2x80x9cunexamined published Japanese patent applicationxe2x80x9d). However, it is difficult by this casting method to obtain a sheet having a thickness of 500 xcexcm or less and being free from any optical strain.
In a method wherein a hardened plate made of an epoxy resin is cut into a sheet, optical strain generates in cutting step when a thickness is 500 xcexcm or less. As a result, it was also difficult to obtain an optical strain-free sheet by this method. Thus, epoxy optical sheets having high thickness accuracy at a thickness of 500 xcexcm or less, small retardation and excellent heat resistance have not yet been provided, in spite of a demand therefor.
Moreover, the above-described method suffers from a disadvantage that the complicated steps such as casting and mold opening are required, and this results in poor production efficiency of epoxy optical sheets. Thus, a method is considered, which continuously produces epoxy optical sheets by, for example, a calender method using rolling rolls, a melt extrusion method with T-die or the like, or a flow casting method of a resin solution onto a support, according to the conventional resin sheet production.
However, the epoxy resin involves use as adhesives. Therefore, when the epoxy resin is molded into a sheet by these methods, the epoxy resin adheres to rolls, dies, supports, etc. As a result, it is impossible to easily separate and recover the molded sheets, resulting in breakage of the sheet in separation thereof. In addition, there arises another problem that the thus obtained sheets tend to have uneven surface and thus fail to achieve the required surface smoothness required in optical sheets.
Accordingly, one object of the present invention is to provide an epoxy optical sheet having a thickness of 500 xcexcm or less, an excellent thickness accuracy, a small retardation and a high heat resistance.
Another object of the present invention is to provide a process for producing the epoxy optical sheet at high efficiency.
The present invention provides an epoxy optical sheet comprising a hardened sheet comprising an epoxy resin, and another resin layer formed on one side thereof, wherein the sheet has a retardation of 5 nm or less, an average thickness of 500 xcexcm or less, a thickness accuracy of xc2x110% or less, a glass transition temperature of 170xc2x0 C. or above and a smooth surface.
The present invention further provides a process for continuously producing an epoxy optical sheet, which comprises successively forming a strippable resin layer on a support having a smooth surface, successively spreading an epoxy resin coating solution comprising an epoxy resin, a hardener, a hardening accelerator and a leveling agent onto the resin layer in the form of a sheet, followed by hardening treatment, thereby forming a hardened sheet adhering to the resin layer; and at the same time, recovering the hardened sheet together with the resin layer from the support.

Epoxy optical sheet and process for producing the same


A nonaqueous electrolyte secondary cell provided with (a) a negative electrode consisting essentially of a carrier for a negative electrode active material , said carrier being capable of being doped and dedoped with lithium, (b) a positive electrode comprising, as an essential positive electrode active material, Li.sub.1+x Mn.sub.2 O.sub.4, wherein x>0, obtained by doping a lithium-manganese complex oxide with lithium and (c) a nonaqueous electrolyte. The secondary cell has an increased cell capacity as well as a high energy density and an excellent charge-discharge characteristics .

Nonaqueous electrolyte cells using lithium as a negative electrode active material and a nonaqueous solvent such as an organic solvent as an electrolyte have advantages in that self-discharge is low, a nominal potential is high and storability is very excellent.
Typical examples of such nonaqueous electrolyte cells include lithium manganese dioxide primary cells and they are widely used as current sources for clocks and memory backup of electronic instruments because of their long-term reliability.
However, conventionally used nonaqueous electrolyte cells are primary cells which can be used only once. On the other hand, with recent wide spread of video cameras and small-sized audio instruments, there has been an increased need of secondary cells which can be use for long, conveniently and economically by repeated use. For this reason the research development of nonaqueous electrolyte secondary cells has been continued.
Of nonaqueous electrolyte secondary cells, a nonaqueous secondary cell which is provided with (a) a negative electrode consisting essentially of a carbonaceous material as a carrier for a negative electrode active material , said carrier being capable of being doped and dedoped with lithium and (b) a positive electrode comprising lithium manganese complex oxide as an essential positive electrode active material, has been proposed by one of the present inventors with other inventors in Japanese Patent Application No. Hei. 1-220216. This cell has a highly expected applicability because dendrite precipitation of lithium does not occur on the surface of the negative electrode, the pulverization of lithium is inhibited, the discharge characteristics are excellent and the energy density is high.
However, a nonaqueous electrolyte secondary cell such as described above has disadvantages in that the cell capacity is prove to decrease because lithium doped into the carbonaceous material used as a negative electrode active material cannot be efficiently dedoped upon discharge.
The cause of the decrease in cell capacity is explained below by reference to FIG. 6.
FIG. 6 shows one example of a charge-discharge curve of a nonaqueous electrolyte secondary cell such as described above and illustrates the changes of the charge and discharge potentials of the negative and positive electrodes and the changes of the cell charge and discharge voltages caused by charge and discharge, respectively.
The charge and discharge of the cell in FIG. 6 are effected at the same constant current density.
In the above-described nonaqueous electrolyte secondary cell it is necessary to charge the cell just after the assembling of the cell because the carbonaceous material as a carrier for the negative electrode active material has not been doped with lithium.
During a charge, lithium is dedoped from the positive electrode active material, lithium-manganese oxide LiMn.sub.2 O.sub.4 and the carbonaceous material as the carrier for the negative electrode active material is doped with the dedoped lithium.
Such reactions taking place at the positive electrode and negative electrode during a charge are shown by the following equations (1) and (2):
Positive electrode: EQU Li.sub.1.0 Mn.sub.2 O.sub.4 .fwdarw.Li.sub.1-y Mn.sub.2 O.sub.4 +y.multidot.Li.sup.+ +y.multidot.e.sup.- ( 1)
Negative electrode: EQU C+y.multidot.Li.sup.+ +y.multidot.e.sup.- .fwdarw.Li.sub.y C(2)
The change in the positive electrode charge potential during the reaction of equation (1) above is shown by the broken line in FIG. 6 and the change in the negative electrode charge potential is shown by the alternate dot and dash line in FIG. 6.
During discharge, lithium is dedoped from the negative electrode and the positive electrode is doped with the dedoped lithium.
Such reactions during discharge are shown by the following equations (3) and (4):
Negative electrode: EQU Li.sub.y C.fwdarw.Li.sub.y-z C+z.multidot.Li.sup.+ +z.multidot.e.sup.-( 3)
Positive electrode: EQU Li.sub.1-y Mn.sub.2 O.sub.4 +z.multidot.e.sup.- .fwdarw.Li.sub.1-y+z Mn.sub.2 O.sub.4 ( 4)
The change in the negative electrode discharge potential during the reaction of equation (3) above is shown by the alternate dot and dash line in FIG. 6 and the change in the positive electrode discharge potential during the reactions of equation (4) is shown by the broken line in FIG. 6.
In equation (3) above showing the discharge reaction of the negative electrode the amount Z of lithium dedoped from the carbonaceous material used as the carrier for the negative electrode active material is smaller than the amount y of lithium with which the carbonaceous material is doped during charge in accordance with equation (2) above (z<y). This can easily be understood by considering that in an embodiment shown in FIG. 6 the charge period of four hours corresponds to the amount y of lithium with which the carbonaceous material of the negative electrode is doped and the discharge period of about two hours forty minutes corresponds to the amount z of lithium dedoped from the carbonaceous material of the negative material.
Therefore, the above-described nonaqueous electrolyte secondary cell has a low charge-discharge efficiency (z/y.times.100) at the carbonaceous material of the negative electrode and the cell capacity , which is regulated by the negative electrode becomes small.


A rotatable connector device includes a rotator and a stator which are fit to each other so as to be rotatable with respect to each other. The rotator and the stator form an accommodation space. In a bottom part of the accommodation space, a retainer for axially supporting a plurality of rotatable rollers and a flat cable are accommodated. A guide unit for allowing a reversed part to be pressed thereon is fit and fixed to the retainer. In a vertical cross-section vertical to a planar surface of the retainer, a guide surface of the guide unit which faces the reversed part has a vertical cross-sectional shape which does not contact a prescribed range of the flat cable in a width direction of the flat cable.

A rotatable connector device which is mountable on a vehicle such as an automobile or the like includes a stator fixed to a vehicle body and a rotator attached to a steering wheel. The stator and the rotator are coaxially attached to each other so as to be rotatable with respect to each other. The rotatable connector device further includes flat cables located in an accommodation space formed by the stator and the rotator.
The flat cables electrically connect electric components such as a horn module, an airbag module, an audio control module and the like provided on the side of the steering wheel and a power supply on the side of the vehicle body to each other.
Patent Document 1 filed by the present applicant, for example, proposes a rotatable connector device including a retainer, located on a bottom surface of the accommodation space, for guiding the flat cables to rotate around an axis of the steering wheel.
Such a retainer includes a plurality of rotatable rollers and a guide unit (corresponding to a "guide wall" in Patent Document 1) projecting in the vicinity of one of the rotatable rollers. The retainer assists the flat cables in being rotated in the accommodation space in a winding or rewinding direction, so that the rotatable connector device can follow the steering operation to rotate smoothly.
This will be described in more detail. As shown in FIG. 11, flat cables C include, in the accommodation space S, an outside wound part Co wound along an inner circumferential surface of an outer cylindrical section 32 of the stator 30, a reversed part Cr which is wound along one of the plurality of rotatable rollers 45 axially supported by a retainer 40 and turned around in a U shape, and an inside wound part Ci wound along an outer circumferential surface of an inner cylindrical section 22 of the rotator 20.
In the rotatable connector device having such a structure, when the rotator 20 is rotated clockwise (X direction in FIG. 11), the reversed part Cr of the flat cables C is pressed on a guide unit 48, and the pressing force causes the retainer 40 to rotate in the clockwise direction. When the rotor is rotated in a counterclockwise direction (Y direction in FIG. 11), the reversed part Cr of the flat cables C is pulled counterclockwise along the rotatable roller 45, and thus the retainer 40 is rotated counterclockwise.
In such a structure, when the rotator 20 is rotated clockwise, the reversed part Cr of the flat cables C always receives a reaction force from the guide unit 48. Therefore, a laminate structure of the flat cables C on the guide unit 48 side may be abraded by the repeated rotation of the rotator 20, which may cause a fault.


An ultraviolet-curable ink composition for ink jet is for use in an ink jet recording method that includes irradiating the ultraviolet-curable ink composition for ink jet applied to a substrate with ultraviolet radiation that has a peak wavelength in the range of 380 to 405 nm from a semiconductor light source to obtain a cured coating. The product of the light transmissivity (%) of the cured coating at a wavelength of 395 nm and the irradiation energy of the ultraviolet radiation (mJ/cm2) is 2.0 or more. The ink composition contains a thioxanthone-based photopolymerization initiator and at least one of yellow coloring material and black coloring material. The OD of the cured coating made from the ink composition is 1.8 or more.

1. Technical Field
The present invention relates to an ultraviolet-curable ink composition for ink jet and an ink jet recording method.
2. Related Art
Ink jet recording methods, which allow the user to record high-definition images with relatively simple equipment, have been rapidly advancing in various fields. For example, JP-A-2012-188612 discloses an ultraviolet-curable ink composition for ink jet to provide an ultraviolet-curable ink composition for ink jet that has excellent curability and provides excellent abrasion resistance and stretchability to coatings cured therefrom. This ink composition contains a monofunctional (meth)acrylate monomer and a photopolymerization initiator. The molecular structure and the content of the monofunctional (meth)acrylate monomer and the Tg of the cured form of the monofunctional (meth)acrylate averaged by the number of moles are specified.
Furthermore, JP-A-2012-140583 discloses an ultraviolet-curable ink composition for ink jet to provide an ultraviolet-curable ink composition for ink jet that has excellent curability and prevents coatings cured therefrom from being colored soon after ink jet recording. This ink composition contains a selected monomer and a photopolymerization initiator that contains an acylphosphine-oxide-based photopolymerization initiator and a thioxanthone-based polymerization initiator. The total content of the acylphosphine-oxide-based photopolymerization initiator and the thioxanthone-based photopolymerization initiator is from 8% to 16% by mass based on the total mass of the ink composition.
This indicates that it has hitherto been believed that the use of a thioxanthone-based photopolymerization initiator, which is unlikely to be affected by oxygen inhibition, is an effective way to ensure the curability of an ink composition applied to a substrate. Research by the inventors, however, found that when a thioxanthone-based photopolymerization initiator is used, the curability of the ink composition is admittedly good near the surface of the ink composition but is not necessarily good in the ink composition.
More specifically, research by the inventors found that the use of a thioxanthone-based photopolymerization initiator, which exhibits a high percentage of light absorption at wavelengths around 395 nm, causes the ink composition to be lacking in curability inside, particularly in light curing with a semiconductor light source, such as an LED, as a result of inhibited transmission of light into the ink composition applied to a substrate. The research also revealed that this reduced internal curability leads to poor adhesion of the ink composition to the substrate. An ink composition that contains such a thioxanthone-based photopolymerization initiator and yellow coloring material and/or black coloring material, which both exhibit a low percentage of light absorption at wavelengths around 395 nm, in such a manner that coatings cured from the ink composition will have a predetermined OD (optical density) is less adhesive because of more severely inhibited inward transmission of light. An ultraviolet-curable ink composition for ink jet that contains yellow coloring material and/or black coloring material and exhibits excellent adhesiveness even when ultraviolet radiation with a peak wavelength in the range of 380 to 405 nm is used would become increasingly useful because UV ink jet printers, which use a low-cost semiconductor light source, such as an LED, to cure an ink composition, will be in demand.

Ultraviolet-curable ink composition for ink jet and ink jet recording method


The present invention relates to a device and method for automatically processing a carcass of a slaughtered animal suspended from the hind legs. The automatically processing is driven by automatically controlled drive means for handling a slaughtering processing tool. Such slaughtering tools are a rotatable cutting blade (20) which is partially shielded and which shielding (21) is provided with a protruding guide pin (22). A further slaughtering tool is a cleaving blade (23) to split the pubic bone of the carcass. The cleaving blade is attached to the shield that partially covers the rotatable cutting blade.

1. Field of the Invention
The invention relates to a device and a method for automatically processing a carcass of a slaughtered animal suspended from the hind legs.
2. Description of Related Art
Various solutions have been provided for automatically processing the carcasses of slaughtered animals. The carcasses are, normally in line and hanging from their hind legs, presented in its entirety to be processed to carcass halves in several steps. The automatic processing of the carcasses requires dedicated equipment for the different processing steps. These different process steps can vary in different process lines but may include among others: removing the front legs, removing the skull, splitting the pubic bone, separating the anus and the rectum from the carcass, opening the abdominal wall and sternum, removing the entrails, pizzle removing, visual inspection, and stamping. Among others a series of automatically controlled knives, braces, guides and detection means are required to process the carcasses of the slaughtered animal.
WO 93/01725 is a patent application from the same applicant as the present invention, which publication is incorporated hereby in reference. This document discloses a method and device for opening the carcass of a slaughtered animal. A cut is made in the belly wall (abdominal wall) close to the hind legs of the carcass and this cut is continued in a downward direction, whereas the intestines are kept clear of the belly wall. The cut may be continued further to also open the breast (sternum) of the carcass. The disclosed technique functions successfully in practise. Normally the equipment is embodied by an individual cutting machine that is part of a line of various processing machines that all provide a different operation on the carcasses.
A problem of the present equipment and methods of automatic processing of one or more steps in the processing of the carcasses of slaughtered animal is that it requires high volume flows of carcasses to recover the investments on the dedicated machinery required for such automation.
The present invention now has the object to provide a method and a device that enables further automation of the processing of carcasses of slaughtered animal with limited investments. Furthermore the object of the invention is to provide a method and a device that enables further flexibility in the processing of carcasses.

Method and device for opening a carcass of a slaughtered animal


A method includes identifying an initial solution to a quadratic programming (QP) problem associated with a process. The method also includes performing an iterative procedure having one or more iterations. Each iteration includes determining whether any constraint associated with the process is violated in the solution. Each iteration also includes selecting a violated constraint, determining a step direction and a step length associated with the selected violated constraint, and updating the solution based on the step direction and the step length. Determining the step direction and the step length includes using a Schur complement based on an active set of constraints associated with the solution. The Schur complement is nonsingular during all iterations of the iterative procedure except when the active set is empty.

Model predictive control (MPC) is a popular technique for controlling multi-input and multi-output processes, such as industrial manufacturing processes. MPC uses a model to predict how one or more controlled process variables are expected to behave in the future. Changes can then be made to one or more manipulated process variables in order to alter the controlled process variable(s). Ideally, each controlled process variable is thereby maintained within a desired range.
An MPC controller often implements an online quadratic programming (QP) solver for solving an optimization problem related to a controlled process. However, the efficient execution of an optimization routine often poses challenges in various circumstances. For example, process processes may involve hundreds of manipulated process variables and thousands of controlled process variables (many with active limits and rate constraints). Also, control intervals can be relatively short, such as ten to twenty seconds. While generic and custom QP solvers have been developed, they often suffer from various shortcomings.

Efficient quadratic programming (QP) solver for process control and optimization


An adjustable optical lens, a camera module and an aligning method thereof are disclosed. The adjustable optical lens includes at least one lens element and an optical structure element. Each of the lens elements is successively and overlappingly arranged in an photosensitive apparatus of the optical structure element, wherein at least one of the lens elements is configured as an adjustable lens element whose assemble position is adjustable. The optical structure element has at least one adjusting channel and at least one fixing channel for adjusting and fixing the adjustable lens element respectively.

Field of Invention
The present invention relates to optical apparatus, and more particularly to adjustable optical lens, camera module and aligning method thereof.
Description of Related Arts
In the technical field of optical camera modules, as the application fields of camera are expanded and the competition in the market of the camera modules become increasingly fierce, every manufacturer is developing its technology. Therefore, camera modules with a relatively low manufacturing cost, a relatively high production efficiency, and a relatively high image quality become pursuing aims of the manufacturers, as well as key factors which play important roles in the competitive market.
The conventional camera module for mobile phone generally has a problem of image blur because of tilting during assembling or the tilt of the optical components thereof. In order to solve such problem of image blur resulted from the tilting during assembling and the tile of the optical components, a method of adjusting a lens element or a set of lens elements of the camera lens is developed by the applicant of the present invention, the adjustable components of the camera lens are adjusted in at least one direction of the horizontal direction, the vertical direction, the incline direction, and the rotating direction during assembling, so that the adjustment of an optical path of the optical lens is achieved, and finally an optical axis of the optical lens is vertical to an image sensor or a deviance thereof is within an allowable range, so that the problem of the image blur is solved. However, how to conveniently adjust the lens elements and how to permanently fix in positions of the lens elements after the adjustment so as to ensure a good image quality while still maintain an easy assembling process of the camera modules as well as a relatively low lost have become an urgent issue of the field of the camera modules.

Adjustable optical lens and camera module and aligning method thereof


Fraud detection is facilitated by developing account cluster membership rules and converting them to database queries via an examination of clusters of linked accounts abstracted from the customer database. The cluster membership rules are based upon certain observed data patterns associated with potentially fraudulent activity. In one embodiment, account clusters are grouped around behavior patterns exhibited by imposters. The system then identifies those clusters exhibiting a high probability of fraud and builds cluster membership rules for identifying subsequent accounts that match those rules. The rules are designed to define the parameters of the identified clusters. When the rules are deployed in a transaction blocking system, when a rule pertaining to an identified fraudulent cluster is triggered, the transaction blocking system blocks the transaction with respect to new users who enter the website.

E-commerce systems exist where members of the general pubic, using an Internet accessible website, can obtain sensitive information pertaining to individuals. Such information, by way of example, takes the form of credit histories and other credit sensitive data. These types of websites are prone to users trying to obtain (by fraudulent means) private information about others. Often, such attempts are made by imposters who have some, but not all, of the identification needed to identify a target. These imposters are trying to steal the target's identity.
In a typical scenario, the fraudster has obtained some piece of the target's personal information. Typically, this would be the target's name and perhaps his/her address. The fraudster then obtains a (typically stolen) credit card belonging to someone other than the target. The object then for the fraudster is to steal the full identity of the target. To do this the fraudster will make use of a website that provides access to a full range of credit history data pertaining to individuals. The fraudster will issue a query in the form of a credit report request.
Using this scenario, the fraudster creates an account on the website and then attempts to purchase a credit report belonging to the target using the stolen credit card number. In this scenario the fraudster is trying to pass him/her self off as the target. In order to obtain the report, the fraudster must go through an identity authentication process administered by one of the credit bureaus. In this process the fraudster engages in a computer-generated interview where a small number of questions are posed about some of the items that the real target would know about the credit report. Since the fraudster usually does not yet have access to sufficient information about the target and past credit transactions, the fraudster often fails the interview. Fraudsters being what they are, don't give up at this point.
The foiled fraudster then creates another account and tries again. Often the fraudster will use similar (but not identical) information to create each new account. This similar information can be, for example, password, security answer, e-mail address, credit card number, and the like. Once in a while, the imposter will succeed and obtain a target's credit report containing sensitive data that then facilitates the imposter's desire to trade off of the credit of the target.
The occurrence of clusters of many accounts that are similar enough to have possibly been created by the same individual is a strong indicator of potential fraud. Currently, trying to identify collections of similar accounts is a laborious and time consuming process which involves repeatedly querying the database for information and patterns.

Systems and methods for fraud detection via interactive link analysis


A resonator includes an inductive element and a conductive cavity surrounding the inductive element. In particular, the conductive cavity surrounds the inductive element such that a capacitance is distributed between the inductive element and the conductive cavity. By distributing a capacitance between the inductive element and the conductive cavity, a high quality-factor resonator can be achieved by the resonator with a relatively small form factor.

Resonators are used in a variety of applications in mobile communications devices. In particular, resonators are often used in filters for mobile communications devices. Resonators for filters generally demand a high quality factor (Q) and selectivity. One conventional type of resonator is illustrated in FIG. 1. Specifically, FIG. 1 shows a cavity resonator 10. The cavity resonator 10 includes an input port 12, an output port 14, and a resonant cavity 16. Radio frequency (RF) signals provided at the input port 12 enter the resonant cavity 16. The RF signals bounce between the walls of the resonant cavity 16, forming standing waves at a resonant frequency that is determined by a diameter DC of the resonant cavity 16 and a height HC of the resonant cavity 16, among other factors that will be understood by those of ordinary skill in the art. The standing waves are then propagated to the output port 14. While the cavity resonator 10 provides a high quality factor, it is too large to fit into a mobile communications device. Further, the cavity resonator 10 is not tunable, as the resonant response thereof is fixed by the geometry of the device.
An additional type of conventional resonator is illustrated in FIG. 2 and FIG. 3. Specifically, FIG. 2 and FIG. 3 show an LC resonator 18. The LC resonator 18 includes an inductive element 20 and a capacitive element 22. A first parasitic resistance 24A and a second parasitic resistance 24B are also illustrated. A signal provided to the LC resonator 18 will oscillate between storage in the magnetic field of the inductive element 20 and the electric field of the capacitive element 22. The particular inductance and capacitance, respectively, of the inductive element 20 and the capacitive element 22 determine the speed at which this oscillation occurs, and thus the resonant frequency of the LC resonator 18. While the LC resonator 18 is significantly more compact than the cavity resonator 10 and may be tuned by altering the capacitance of the capacitive element 22, the quality factor of the LC resonator 18 is generally quite low due to the parasitic resistance 24 between the inductive element 20 and the capacitive element 22 and the internal resistive losses of the inductor element 20 and the capacitive element 22. In particular, FIG. 3 shows how the LC resonator 18 is normally fabricated, wherein the inductive element 20 is provided on a laminate 26, and connected to the capacitive element 22 on a separate chip 28 via a number of interconnects 30. The parasitic resistance 24 is generally due to the length and quality of the interconnects 30, as well as the internal resistance of the components themselves as discussed above. As energy is passed between the inductive element 20 and the capacitive element 22, the parasitic resistance 24 dissipates a part of this energy, thus damping the resonant response and lowering the quality factor of the LC resonator 18.
Specifically, Equation (1) illustrates the relationship between parasitic resistance and quality factor:
                    Q        =                                            1              R                                                                  L                C                                              =                                                    ω                0                                          L                        R                                              (        1        )            where Q is the quality factor of the LC resonator 18, R is the parasitic resistance of the first parasitic resistance 24A and the second parasitic resistance 24B, L is the inductance of the inductive element 20, C is the capacitance of the capacitive element 22, and ω0 is the resonant frequency of the LC resonator 18. As Equation (1) illustrates, the quality factor is inversely proportional to the parasitic resistance. Due to the length and quality of the interconnects 30 discussed above, the quality factor of the LC resonator 18 is limited.
Accordingly, there is a need for a resonator with a high quality factor and a small form factor.

Hybrid cavity and lumped filter architecture


A temperature protective circuit of the semiconductor integrated circuit unit of the present invention is configured such that the circuit includes a heat generation detecting section for detecting a monitored temperature and a limiting signal producing section for limiting continuously or stepwise the drive of a load (for example, the upper limit of drive current) according to the above-mentioned monitored temperature, after the above-mentioned monitored temperature exceeds a first threshold temperature, based on the detection results of the above-mentioned heat generation detecting section. With such a configuration, an abnormal heat generation of a subject of overheat monitoring can be previously limited to perform a more safely temperature protective operation.

1. Field of the Invention
The present invention relates to a semiconductor integrated circuit unit having a temperature protective circuit, and more particularly, to an improvement of the accuracy of the temperature protective function thereof.
2. Description of the Prior Art
Heretofore, many of semiconductor integrated-circuit units (hereinafter, called the IC (Integrated Circuit)) for driving a power transistor such as a power source device and a motor drive device are provided with a temperature protective circuit (so-called thermal shut-down circuit) as a means of preventing the IC from being broken due to an abnormal heat generation (especially, destruction of the power transistor generating the heat) (for example, refer to Japanese Laid-Open Patent No. 2004-253936 and Japanese Patent Publication No. H06-16540 by the applicant of the application).
Further, the conventional temperature protective circuit generally has been configured to produce a temperature protective signal by utilizing characteristics in that the Vf (forward dropping voltage) of a bipolar transistor or a diode fluctuates depending on the ambient temperature thereof
Further, the conventional temperature protective circuit generally has been of an automatic reset type having a hysteresis in threshold temperatures.
Other than above, as a conventional art in connection with the present invention, there have been disclosed and proposed a protective circuit in which a temperature protective circuit and an overcurrent protective circuit use a standard voltage generation section or an output section in common (refer to Japanese Laid-Open Patent No. H09-246876), and a semiconductor integrated-circuit for enhancing the drive current ability when a low temperature is detected (refer to Japanese Laid-Open Patent No. H07-161920).
Certainly, the conventional temperature protective circuit described above can detect and shut down an abnormal heat generation of the IC due to malfunction or overload, and thus prevent previously the breakage of the IC.
However, the conventional temperature protective circuit described above has a configuration such that the drive of a principal IC section is not stopped until the chip temperature reaches the threshold temperature, that is, an abnormal heat generation is detected, thus a preliminary temperature protective operation before the detection of abnormal heat generation being not particularly considered. For example, in the motor drive IC provided with the conventional temperature protective circuit, even if the indication of abnormal temperature rise is found, a torque control not different from regular operation is continuously performed unless the chip temperature reaches the threshold temperature. Hence, the conventional temperature protective circuit has a problem in that the circuit, even though finally can shut down the abnormal heat generation of the IC, cannot prevent the generation, thereby making the chip temperature easily increased.
Further, an IC provided with the conventional temperature protective circuit has a problem in that the output thereof is sharply turned off due to the shut-down operation at the abnormal heat generation, whereby various discrepant conditions (noise or serge generation) are apt to be introduced. For example, in a case where a subject of the IC to be driven is an L load having inductance components (such as motor coil), a counter-electromotive voltage developed in the L load concerned is jumped at the shut-down of the IC to exceed the withstand voltage thereof, whereby the IC can be broken.
Further, the conventional temperature protective circuit is often provided near a subject of overheat monitoring in order to improve the sensibility of the detection of abnormal heat generation. On the contrary, as a compensation, because the logic states (high level/low level) of the temperature protective signal are highly frequently repeated even though the threshold temperature is given the above-mentioned hysteresis, the automatic restart operation after shut-down can be in a state (logic oscillating state) in which the operation cannot be released from that state.

Semiconductor integrated-circuit unit with temperature protective circuit


An apparatus comprises a logic processor and at least one hardware device the processor being configured to orchestrate at least one virtual machine, wherein each device and virtual machine respectively forms an isolated execution environment, the processor being configured to: generate a unique ID associated with the request for the result; commit to the unique ID; transmit to the data source the request for data, to trigger the data source to generate and return the result and to generate an authenticity proof of the result by leveraging at least one software attestation technique or at least one hardware attestation technique; verify the authenticity proof; and transmit to the remote application the returned result and verified authenticity proof. This apparatus can be used to provably enforce the correct execution of a given process without relying on the security of a single isolated execution environment only.

Modern electronic platforms enable the efficient execution of a number of processes, whose steps are embodied in software components running on the electronic platforms themselves.
When processes are executed on behalf of a third party or when they involve stakes by third parties, it is important to prove their correct execution and to enable the auditability and verifiability of such proof.
An example of such process may be in the field of public tenders, specifically e-procurement. In such situations, the security guarantees provided by the existing platforms only refer to the origin and integrity of the submitted offers by leveraging digital signatures, while further guarantees on the confidentiality of the offers, which, by law, cannot be disclosed before the tender termination date is reached, would be needed to both improve the process as a whole and reduce the risk of any leaks.
Another example is providing to a third party a proof of reserve of a bank account: for example, simply taking a screenshot of the balance the bank website is not enough, since the image could be tampered with. Even recording the full HTTP traffic from the bank website would not be sufficient: although communications between the client and the bank server are protected with regards to confidentiality, origin and integrity by the Transport Security Layer (TLS) protocol, through the use of encryption and digital signatures, those properties are not transferable to a third party.
These limitations are especially important for blockchain applications and smart contracts, which cannot fetch external data by themselves and therefore require an actor connected both to the blockchain context and to the external context to send it. If their strong security model is to be maintained, then trusting an unknown external actor to send the correct, untampered data from the required data source is not viable.
Yet another example is the process of generating untampered random numbers, both in the traditional and online gambling industry.
Even in the cases where processes are self-executed, an auditable proof of such execution may be important: for example, in the case of system monitoring and logging a trail of the monitoring.
Currently, in most cases, the platform operator handling the process is completely trusted. Violations of the correct process execution, when and if are found, are resolved via legal means, with increased costs and a non-deterministic outcome of the dispute resolution.
In the best cases, the platform operator and the software embodying the process steps are audited and certified, but these certifications alone cannot guarantee a match between what was audited and what ultimately runs on the platform. If the operator of the platform turns malicious or if the platform security is compromised, the process execution could be tampered with.
It is to these problems, amongst others, that the invention attempts to offer a solution.

Apparatus and method for verificability /auditability of correct process execution on electronic platforms


Field emission devices are cascaded in multiple stages, such that certain structures function as electrodes for field emission devices of differing stages.

Solid state cold cathode field emission devices (FEDS) are known. Such devices typically have at least two, and generally three, electrodes (in the former, an anode and a cathode, and in the latter, an anode, cathode, and gate). In some prior art embodiments, these elements are configured in a non-planar orientation (for example, see Spindt, et al., U.S. Pat. No. 3,812,559). In another prior art embodiment, these elements are configured in a generally planar configuration with respect to one another (for example, see Lee et al., U.S. Pat. No. 4,827,177).
The prior art also teaches that such cold cathode field emission devices can be configured in an array with one another, for example, to support anticipated current carrying capacity requirements. In such arrays, the various electrodes of the device are configured in parallel with one another; for example, all of the cathode electrodes are electrically parallel to one another, and all of the anode electrodes are in parallel with one another.
To date, if one wished to construct a multistage device, such as an amplifier, using such devices, the various discrete FEDs of the multistage device would simply be appropriately coupled between one another to form and intercouple the desired stages.
Accordingly, a need exists for a better configuration for a multistage device that makes use of FEDs. Preferably, the various stages making up the device can be formed together in a single integrated structure.

Cascaded cold cathode field emission devices


An apparatus is provided for cutting pieces from laminar material wound in coil using a laser or plasma cutting machine. In one apparatus according to the invention, a cutting station includes at least one moveable cutting head arranged between the station's entrance and exit, and a means to position a portion of laminar material on a cutting plane. The positioning means includes three separate locking devices, each of which can lock on a portion of the laminar material as it passes through the cutting station. The three locking devices are arranged in succession: the first near the cutting station's entrance, the second near the exit, and the third between the first and second locking devices. At least the third locking device is movable, in the space between the other two devices, along a portion of laminar material while the material is kept under tension.

As is well known, in general, the cutting of pieces from laminar material wound in coil generates three types of components: the machined pieces; the machining swarf; and the residual laminar material, i.e. the laminar material emptied of the machined pieces and swarf. In the description provided hereinafter, the residual laminar material will be referred to more briefly as the "skeleton".
In the case wherein large pieces are produced that occupy the laminar material substantially throughout the transverse extension thereof, the cutting of the pieces does not generate a residue classifiable as a skeleton, but in fact only small and medium-sized swarf.
The separation of the machined pieces from the swarf and the skeleton may be done manually or be partially automated.
Apparatuses for laser or plasma cutting of pieces of laminar material M wound in coil B (in particular, metal sheets) are known in which during the cutting step the laminar material is placed on a movable support structure, consisting of a conveyor belt defined by rods transverse to the direction of advancement of the belt and spaced apart from each other. Each rod has a row of protruding spikes on which the laminar material rests. Such type of conveyor belt is called a "spike bed" conveyor and allows burns on the laminar material (due to the so-called back-flash phenomenon) to be reduced to only the areas of contact between the material and the spikes of the movable support. During the cutting step, the machining swarf slips into the empty spaces of the spike bed conveyor and is thus separated from the machined pieces and the skeleton already during the cutting step. The swarf is thus already collected in the area below the cutting area, while the machined pieces and skeleton (if present) continue to travel together on the spike bed conveyor to be transported to a collection station downstream, outside of the cutting area. Generally, the machined pieces are kept connected to the skeleton by micro-joints, which are then cut downstream.
To completely eliminate the risk of burns, apparatuses for the laser or plasma cutting of pieces of laminar material wound in coils have been proposed, which cut the laminar material while keeping it suspended in the air and therefore do not require the use of conveyor belts of the spike bed type. In such apparatuses, during the cutting step, the laminar material is kept taut in the air, without any lower support, by means of a handling device that slides along the direction of advancement of the laminar material. Such movable device is provided to move the laminar material and to tension it by cooperating with fixed means for locking the laminar material. In this way, any contact between the laminar material and the support during cutting is avoided, thus eliminating any risk of burning.
Operationally, the pieces are not fully cut, but rather micro-joints connecting to the skeleton remain. Once the suspended cutting step is over, the portion of pre-cut material (pieces connected to the skeleton by means of micro-joints) is separated from the not yet machined material (making a transverse cut at the tail portion) to then be extracted from the cutting station by means of the handling device, which grips the head portion of the pre-cut material. Before a transverse cut is made in the tail portion, a comb-type support is inserted underneath the portion of pre-cut material. Such comb support consists of a plurality of rods, parallel to the direction of advancement of the material and spaced transversely. Operationally, such comb support is slidably associated with the aforesaid handling device to move with respect thereto in the direction of advancement between a retracted position, wherein the comb support is not positioned below the pre-cut material, and an extracted position, wherein the comb support is positioned underneath the pre-cut material. Once the comb support is positioned underneath the pre-cut laminar material, the latter is cut at the tail portion and the pre-cut material is then extracted from the cutting area and taken to a downstream collection area. The extraction is carried out by taking the handling device beyond the collection area, so that it carries with it the pre-cut material and the associated comb support. Once this collection area is reached, the handling device releases its hold and the support element is then retracted, allowing the pre-cut material to lie in a collection plane arranged at a lower level than that defined by the movable support element and corresponding to the cutting plane. Such cutting apparatus is described in Italian patent 111409876.
As it is structured, the cutting apparatus described above does not allow the machining of pieces with a longitudinal extension (i.e. along the direction of advancement of the laminar material) greater than the longitudinal extension of the cutting station. Such cutting apparatus is, therefore, not very flexible in managing the format changes of the pieces to be cut, unless there is a cutting station sized in length to be able to process any type of format of pieces to be cut.
There is, therefore, in the sector a need for an apparatus for the laser or plasma cutting of pieces of laminar material wound in coil which, while cutting the laminar material in suspension, allows flexible management of format changes of the pieces to be cut and at the same time remains compact in size.

Apparatus for laser or plasma cutting of pieces of laminar material wound in coil


In a substrate, at least one lateral surface between one surface and another surface is a cut surface that is cut together with mold resin. The mold resin, which is cut together with the substrate, is provided with a surface that is flush with the cut surface. A portion of the mold resin constituting the surface flush with the cut surface has a surface that is joined to the surface flush with the cut surface and parallel to the one surface of the substrate; this portion is thinner than a portion that seals electronic parts. Consequently, the mold resin is cut with a dicing blade brought into contact with a surface parallel to the one surface of the substrate.

A method for manufacturing the above type of electronic device is conventionally proposed like in Patent Literature 1 as follows.
A multiple substrate is prepared by integrally coupling a plurality of substrates and zoned with dicing lines; then, electronic parts are mounted on one surface of each substrate of the multiple substrate. Mold resin is formed to seal the electronic parts and the one surface of the multiple substrate. Here, a groove is formed in a portion of the mold resin that is positioned over the dicing lines; the groove is tapered from its opening toward the direction of depth. That is, a groove having a V-shaped cross-section is formed in a portion of the mold resin that is positioned over the dicing lines. The multiple substrate on which the mold resin is disposed along the dicing lines (groove) is then cut with a dicing blade. This results in manufacturing an electronic device, which is mounted with the electronic parts on the one surface of each substrate while the electronic parts and the one surface of each substrate are sealed with the mold resin. When the multiple substrate is to be cut with the dicing blade, the direction of cutting is made parallel to the normal line to the one surface of the multiple substrate.
In marked contrast to a method in which the thickness of mold resin is fixed, the above manufacturing method reduces the amount of mold resin to be cut by a dicing blade, thereby shortening the time required for cutting.

Electronic device and method for manufacturing same