A multilayered substrate for a semiconductor device, which has a multilayered substrate body formed of a plurality sets of a conductor layer and an insulation layer, and having a face for mounting a semiconductor element thereon and another face for external connection terminals, the face for mounting a semiconductor device being provided with pads through which the substrate is connected to a semiconductor element to be mounted thereon, and the face for external connection terminals being provided with pads through which the substrate is connected to an external electrical circuit, wherein a reinforcing sheet is respectively joined to the face for mounting a semiconductor element thereon and the face for external connection terminals of the multilayered substrate body.

1. Field of the Invention
The present invention relates to a multilayered substrate for a semiconductor device, and more particularly, to a multilayered substrate for a semiconductor device, which has a multilayered substrate body formed of a plurality of sets of a conductor layer and an insulation layer, i.e., a laminate of alternate conductor and insulation layers, and having a face for mounting semiconductor element thereon and another face for external connection terminals, the face for mounting semiconductor device being provided with pads through which the substrate is connected to a semiconductor element to be mounted thereon, and the face for external connection terminals being provided with pads through which the substrate is connected to an external electrical circuit.
2. Description of the Related Art
A multilayered substrate for a semiconductor device as shown in FIG. 10 is proposed in Japanese Unexamined Patent Publication No. 2000-323613 (corresponding to U.S. Pat. No. 6,418,615). Multilayered substrate body 105 is included in multilayered substrate 100 for a semiconductor device shown in FIG. 10 that is composed by arranging conductor wiring 102 in multiple layers stacked with insulation layers 104 composed of a polyimide resin or a resin such as polyphenylene ether. One side of this multilayered substrate body 105 is a face for mounting semiconductor elements on which is formed semiconductor element pads 120a that are connected to electrode terminals 108 of semiconductor element 106 that is mounted thereon, while the other side of multilayered substrate body 105 is a face for external connection terminals on which is formed external connection terminal pads 124 that are attached to solder balls 122 as external connection terminals. The face for mounting semiconductor devices and the face for external connection terminals of this multilayered substrate body 105 are covered with solder resist 126 with the exception of semiconductor element pads 120a and external connection terminal pads 124.
In this type of multilayered substrate body 105, the conductor wiring 102 and/or pads formed on both sides of each insulation layer 104 (pads 120 for connecting two wiring layers to each other, pads 124 for external connection terminals or pads 120a for electrode terminals of semiconductor element) are electrically connected by vias 128 formed passing through insulation layers 104. These vias 128 are formed in openings 130 which are opened in the side of insulation layer 104 having the face for external connection terminals, and have the bottom formed by the faces of conductor wiring 102 or pads 120 and 120a formed on the side of the same insulation layer 104 having the face for mounting semiconductor elements. Moreover, a metal frame 117 having a prescribed strength can be joined to the periphery of multilayered substrate body 105 in order to improve handling ease, etc. during transport and so forth of multilayered substrate 100 for a semiconductor device.
As shown in FIGS. 11A through 11F, multilayered substrate 100 for a semiconductor device shown in FIG. 10 can be produced by alternately forming conductor wiring and insulation layers from a semiconductor element mounting layer having a face for mounting semiconductor elements in the direction of an external connection terminal attachment layer having a face for external connection terminals.
To begin with, seed layer 142 is formed on one side of a metal sheet in the form of copper sheet 140 (FIG. 11A). This seed layer 142 is composed of chromium (Cr) layer 141a, which is in direct contact with the face of copper sheet 140, and copper (Cu) layer 141b formed on chromium (Cr) layer 141a as shown in FIG. 12, which is an enlarged view of the section indicated with circle A in FIG. 11A.
Semiconductor element pads 120a, to which electrode terminals 108 of semiconductor element 106 are later connected and which are composed of copper, are formed by forming a photoresist pattern (not shown) on seed layer 142 formed on one side of copper sheet 140, exposing seed layer 142 at the sections where semiconductor element pads 120a are formed, and then performing electrolytic plating using seed layer 142, and particularly copper layer 141b, as the power supply layer (FIG. 11B).
Insulation layer 104 is formed by coating a thermosetting resin in the form of a polyimide resin by printing and so forth followed by curing so as to cover semiconductor element pads 120a formed in this manner (FIG. 1C). Continuing, openings 130 for forming vias are formed in insulation layer 104 by laser light such as YAG laser light or carbon dioxide laser light (FIG. 1D).
Seed layer 142xe2x80x2, composed of a chromium (Cr) layer and copper (Cu) layer, is formed over the entire surface of insulation layer 104, including the inner walls of formed openings 130 (FIG. 1E). Next, sections corresponding to vias 128 and conductor wiring 102 (FIG. 10) are formed by electrolytic copper plating using the resist pattern (not shown) formed on seed layer 142xe2x80x2 as a mask, and seed layer 142xe2x80x2 as a power supply layer.
Next, vias 128 and conductor wiring 102 are formed in the surface of insulation layer 104 as shown in FIG. 11F by removing seed layer 142xe2x80x2, except for those sections corresponding to vias 128 and conductor wiring 102, by etching.
Continuing, conductor wiring and insulation layers are sequentially formed from the side of the semiconductor element mounting layer having a face for mounting semiconductor elements in the direction of the external connection terminal attachment layer having a face for external connection terminals by repeating the steps of FIGS. 11C through 11F, thereby allowing the obtaining of intermediate 100a shown in FIG. 13. On one side of multilayered substrate body 105 of the resulting intermediate 100a, copper sheet 140 is joined via seed layer 142 to the face for mounting semiconductor element on which semiconductor mounting pads 120a are formed, and on the other side of multilayered substrate body 105, external connection terminal pads 124 are formed. Copper sheet 140 fulfills the role of a reinforcing sheet of multilayered substrate body 105, and facilitates handling of intermediate 100a during transport and so forth.
Finally, it is necessary to remove copper sheet 140 from intermediate 100a by etching in order to obtain multilayered substrate 100 for a semiconductor device shown in FIG. 10. By forming chromium (Cr) layer 141a, which is not etched by the etching solution of copper sheet 140, as a portion of seed layer 142, the progress of the etching can be inhibited when etching has reached chromium (Cr) layer 141a of seed layer 142 during etching of copper sheet 140, and etching of copper sheet 140 ends at the point the entire surface of chromium (Cr) layer 141a of seed layer 142 is exposed. Next, by removing chromium (Cr) layer 141a and copper (Cu) layer 141b by etching, the surface of semiconductor element pads 120a is exposed, thereby allowing the obtaining of multilayered substrate 100 for a semiconductor device shown in FIG. 10.
Multilayered substrate 100 for a semiconductor device shown in FIG. 10 can be produced so that the face on which semiconductor elements are mounted is as flat as possible and the thickness of the substrate is as thin as possible. However, the inventors of the present invention found that, even if multilayered substrate 100 for a semiconductor device shown in FIG. 10 is reinforced by joining a metal frame 117 on the face for mounting semiconductor elements of multilayered substrate body 105, warping occurs easily caused by a difference in the coefficients of thermal expansion between metal frame 117 and multilayered substrate body 105 composed mainly of a resin, and that warping also occurs easily in intermediate 100a (FIG. 13) during its production process caused by a difference in the coefficients of thermal expansion between copper sheet 140 and multilayered substrate body 105 composed mainly of a resin.
If a thick metal frame 117 is used to prevent the occurrence of this warping, the characteristics of a thin and lightweight multilayered substrate 100 for a semiconductor device are lost.
The object of the present invention is to provide a multilayered substrate for a semiconductor device in which the face on which semiconductor elements are mounted can be as flat as possible and its thickness can be as thin as possible, and which can prevent warping caused by a difference in the coefficients of thermal expansion between the element members.
In order to achieve the above object, the present inventors thought that it would be effective to juxtaposition a multilayered substrate body composed mainly of resin between a metal frame and a metal sheet, and as a result of conducting studies on this, were able to achieve the present invention.
The present invention is a multilayered substrate for a semiconductor device, which has a multilayered substrate body formed of a plurality of sets of a conductor layer and an insulation layer, i.e., a laminate of alternate conductor and insulation layers, and having a face for mounting semiconductor element thereon and another face for external connection terminals, the face for mounting semiconductor device being provided with pads through which the substrate is connected to a semiconductor element to be mounted thereon, and the face for external connection terminals being provided with pads through which the substrate is connected to an external electrical circuit, wherein a reinforcing sheet is respectively joined to the face for external connection terminals and the face for mounting semiconductor element thereon.
A metal sheet having through holes formed so as to correspond to each external connection terminal pad, and the entire surface of which, including the inner wall surfaces of these through holes, has been insulation treated, is preferable for the reinforcing sheet joined to the face for external connection terminals. In particular, an aluminum sheet in which a plurality of through holes are formed, and the entire surface of which, including the inner wall surfaces of each of the above through holes, is anodized can be used preferably.
As the reinforcing sheet joined to the face for external connection terminals, a sheet of ceramic or resin, which has a strength and a coefficient of thermal expansion corresponding to those of the reinforcing sheet jointed to the face for mounting semiconductor elements, may be used.
When adhering said insulation treated metal sheet to the face for external connection terminals of the multilayered substrate body, by using an adhesive containing particles of a diameter that is able to maintain a prescribed gap between the above insulation treated metal sheet and face for external connection terminals such that adhesive is not extruded into the through holes of the above insulation treated metal sheet when the insulation treated metal sheet and face for external connection terminals are pressed together, attachment of external connection terminals can be carried out easily.
A metal frame is preferable for the reinforcing sheet joined to the face for mounting semiconductor elements. In particular, a portion of a metal sheet on which a multilayered substrate body is formed on one side can be used as such a frame, whereby the occurrence of warping of the multilayered substrate for a semiconductor device in the production process can be prevented. In this case, a frame that functions as a reinforcing sheet can be formed by etching a metal sheet on which a multilayered substrate body is formed on one side and removing only the metal material in the region where a semiconductor element is mounted.
In the multilayered substrate for a semiconductor device of the present invention, pads formed into the shape of bumps so that their tips protrude from the face for mounting a semiconductor element of the multilayered substrate body may be used as the pads for mounting semiconductor elements on the multilayered substrate. As a result of using such bump-shaped pads, even a semiconductor element provided with electrode terminals having flat tips can be easily joined to the multilayered substrate of the present invention by means of these bump-shaped pads.
According to the present invention, a multilayered substrate body in which a plurality of conductor wiring are formed in multiple layers with insulation layers between them allows the face on which semiconductor elements are mounted to be made as flat as possible, and its thickness can be made to be as thin as possible.
Moreover, since a multilayered substrate body composed mainly of insulating resin is juxtapositioned between an insulation treated metal sheet and metal frame, the multilayered substrate for a semiconductor device can be prevented from warping, even if there is a difference in the coefficients of thermal expansion between the multilayered substrate body and these metal members.
Moreover, since a multilayered substrate body is juxtapositioned between an insulation treated metal sheet and metal frame having rigidity, handling of a multilayered substrate for a semiconductor device can be made to be easier during transport and so forth.

Multilayered substrate for semiconductor device


The disclosed computer-implemented method for forwarding network traffic using minimal Forwarding Information Bases (FIBS) may include (1) identifying a Routing Information Base (RIB) that includes a set of routes that define paths to destinations both inside and outside a network and then (2) creating a FIB that includes a subset of active routes whose size is below a size threshold by (A) importing, from the set of routes within the RIB, (I) internal routes that define paths to destinations inside the network, (II) high-traffic external routes that define paths to destinations outside the network, and (III) a default route that defines a path to a default node that facilitates resolution of traffic that does not match any of the internal or high-traffic external routes and (B) excluding, from the FIB, low-traffic external routes that define paths to destinations outside the network. Various other methods, systems, and apparatuses are also disclosed.

Network traffic is often forwarded from one router to another. These routers may include a Routing Information Base (RIB) that stores a set of routes that facilitate network traffic to all of the Internet. For example, a router may include a RIB that stores approximately 575,000 Internet Protocol version 4 (IPv4) routes. In addition, this router may include a Forwarding Information Base (FIB) that imports copies of most of the approximately 575,000 IPv4 routes from the RIB. These copies stored in the FIB may represent and/or constitute the active routes used by the router to forward all Internet traffic.
In many cases, only a small fraction of these IPv4 routes may be needed to carry the vast majority of Internet traffic. For example, 90% of Internet traffic may traverse approximately 3,150 IPv4 routes, and 99% of Internet traffic may traverse approximately 25,900 IPv4 routes. Accordingly, the remaining approximately 549,100 IPv4 routes may be used to carry only 1% of Internet traffic. As a result, the FIB may be able to facilitate 90% of Internet traffic by importing only 0.5% of the IPv4 routes from the RIB or 99% of Internet traffic by importing only 4.5% of the IPv4 routes from the RIB.
In view of the above observation, the FIB may, in theory, be able to operate successfully using far less memory than the RIB. Moreover, because FIB memory is often much more expensive than RIB memory, routing equipment vendors may be able to significantly reduce manufacturing costs by decreasing the amount of FIB memory included in their routers and making efficient use of that decreased FIB memory. The instant disclosure, therefore, identifies and addresses a need for additional and improved methods, systems, and apparatuses for forwarding network traffic using minimal FIBS.

Method, system, and apparatus for forwarding network traffic using minimal forwarding information bases


A glucose monitoring system comprising a readhead positioned a predetermined distance from a sample aperture. The readhead comprises first and second LEDs adapted to emit intersecting paths of light. A beam splitter is positioned at the intersection of the light paths. The beam splitter comprises a band pass filter for controlling the center wavelength of a resulting coaxial emitted light for illuminating a sample on the sample aperture. The readhead further comprises a detector which comprises a detector aperture and a molded lens over the detector aperture. A light-scattering section upstream of the lens comprises a plurality of steps having angles greater than 90 degrees to reduce internal stray light.

It is often necessary to quickly obtain a sample of blood and perform an analysis of the blood sample. One example in which there is a need for obtaining a sample of blood is in connection with a blood glucose monitoring system where a user must frequently use the system to monitor the user's blood glucose level.
Those who have irregular blood glucose concentration levels are medically required to regularly self-monitor their blood glucose concentration level. An irregular blood glucose level can be brought on by a variety of reasons including illness such as diabetes. The purpose of monitoring the blood glucose concentration level is to determine the blood glucose concentration level and then to take corrective action, based upon whether the level is too high or too low, to bring the level back within a normal range. The failure to take corrective action can have serious implications. When blood glucose levels drop too low—a condition known as hypoglycemia—a person can become nervous, shaky and confused. That person's judgment may become impaired and that person may eventually pass out. A person can also become very ill if his blood glucose level becomes too high—a condition known as hyperglycemia. Both conditions, hypoglycemia and hyperglycemia, are potentially life-threatening emergencies. Therefore obtaining accurate test results is highly important.
One method of monitoring a person's blood glucose level is by portable hand-held blood glucose testing devices. The portable nature of these devices enables the user to conveniently test his blood glucose level wherever the user may be. To check the blood glucose level a drop of blood is obtained from him, for example from the fingertip, using a separate lancing device. Once the requisite amount of blood is produced on the fingertip, the blood is harvested using the blood glucose-testing device. The blood is drawn inside the testing device, which then determined the concentration of glucose in the blood. The results of the test are communicated to the user by a display on the testing device. More detail concerning lancing devices is set forth in U.S. Pat. No. 6,152,942, which is commonly assigned and incorporated herein by reference in its entirety.
Drawbacks associated with optical instruments for reading calorimetric reactions include size, low signal throughput and accuracy errors which are due, in part, to mechanical alignment (or mis-alignment) sensitivity of the optical components. These problems are further compounded when the optical instruments require readings at more than one wavelength or at multiple wavelengths. Providing multiple wavelengths compound these problems because prior art devices produce light of each wavelength with a different light element such as a light emitting diode. Each of the light emitting diodes can not be linearly aligned, or identically aligned, with the sample. This results in the light from each of the light emitting diodes having a different intensity and different intensity distribution across the sample.
Many glucose-monitoring systems determine a concentration of glucose in the blood sample by measuring the diffused reflectance from a reagent. The reagent has a color change that is proportional to the concentration of glucose in the blood sample. Generally, diffused reflectance is the preferred method of reading the change in color of the reagent. Additional background concerning calorimetric testing and diffuse light reflectance is found in U.S. Pat. Nos. 5,723,284; 6,181,417B1; 5,518,689; 5,611,999, all of which are incorporated herein by reference in their entirety.
Current methods of reading diffuse reflectance use LEDs as a monochromatic source of illumination. The problem with using an LED is that a typical center wavelength tolerance of plus or minus 20 nm causes a variation in the diffused reflectance. The variation in wavelength around the center wavelength will cause the reagent color to vary around a reflectance corresponding to the center wavelength of the LED. This reflectance variation translates into an error in glucose concentration. An error in glucose concentration level can lead the user to take too much medicine or avoid taking enough medicine, thereby resulting in a potential seizure, coma, or even death. Thus obtaining accurate glucose concentration levels in a blood sample is critical.
One category of diffuse reflectance is two-wavelength diffuse reflectance. Current designs of two-wavelength diffuse reflectance readheads use coaxial sample illumination from LEDs at two different wavelengths. The coaxial illumination of the sample by the two LEDs is traditionally done with a beam splitter. Another method is to illuminate the sample with both LEDs tilted 15 degrees off the sample's normal optical axis.
One method for reducing the reflectance variation due to tolerance of the LED is to sort the LEDs according to tight center wavelength tolerances to reduce the spectral errors. Such sorting processes can increase the cost of LEDs by up to 15 times their nominal cost. A low cost alternative to reducing the spectral errors caused by LED center wavelength variation is taught herein. A method of coaxially illuminating the sample to be analyzed is also taught herein. Additional advantages concerning illumination, detection and blood monitoring, generally, will be apparent to those of ordinary skill in the art from the teachings herein.

This patent is subject to a terminal disclaimer.


A switching circuit connected to an I/O device having a plurality of functions, the switching circuit comprising: a processing unit that includes tables, each of which corresponds to one of the function of the I/O device, when the processing unit receives a packet that instructs to add a function to the I/O device, configured to select the table that contains a bus number of a destination of the received packet, and configured to notify a number of the selected table; and a filter configured to change a function number of the destination of the received packet to the number of the table notified from the processing unit.

Hitherto, for PCI buses with I/O slots or standard I/O buses such as a PCI Express (PCIe), a hot plug has been standardized which allows online insertion and removal of an I/O device (such as a network interface card (NIC)). A hot plug in the past is provided for an I/O slot. When an I/O device is inserted or removed online to or from an I/O slot, a hot plug controller issues an interrupt to an OS. The OS refers to the state of the hot plug controller and determines whether the I/O device has been inserted to the I/O slot or removed from the I/O slot. In accordance with the determination result, the OS enables or disables the corresponding device driver.
FIG. 1 is a schematic configuration diagram of a server and an I/O device. Referring to FIG. 1, a server 100 includes a CPU (Central Processing Unit) 111, a memory 112, a root complex 113, a PCI Express switch (hereinafter, called a PCIe switch) 114 and I/O slots 120 and 121. The memory 112 stores control programs for implementing a virtual machine, including a hypervisor 104, and a BIOS (Basic Input/Output System) 106. The hypervisor 104 may control one or more virtual machines (sometimes called VMs). The hypervisor 104 includes drivers 105A to 105C which control functions 122-0 to 122-3 and 123-0, which will be described below. The CPU 111 executes the hypervisor 104 within the memory 112 to implement virtual machines (VMs) 101, 102, and 103. The CPU 111 reads and executes the BIOS 106 stored in the memory 112. The root complex 113 is a core device of a PCIe system and internally contains a host bridge and is connected to the CPU 111. The PCIe switch 114 is a device for increasing the number of I/O slots to be connected to I/O devices. The I/O slots 120 and 121 are mechanisms for connecting the I/O devices 122 and 123, respectively.
The PCIe switch 114 includes an upstream PCI-to-PCI bridge (hereinafter, called a P2P bridge) 115, and downstream P2P bridges 116 and 118. The CPU 111 side will be called an upstream, and the side having the I/O devices 122 and 123 will be called a downstream. The upstream P2P bridge 115 and downstream P2P bridges 116 and 118 connect an upstream bus (or primary bus), not illustrated, and a downstream bus (or secondary bus), not illustrated, and transfer packets between the two buses. The downstream P2P bridges 116 and 118 include hot plug controllers 117 and 119, respectively. The hot plug controllers 117 and 119 detect the I/O device to be inserted or removed online to or from the I/O slots and use an interrupt signal to notify the hypervisor 104 of the insertion or removal of the I/O device.
The I/O device 122 includes a plurality of functions 122-0 and 122-1. The I/O device 123 also includes a function 123-0. In a PCIe system, the I/O devices 122 and 123 positioned at the most downstream parts may sometimes be called end points. Each of the functions 122-0 and 122-1 is a unit which provides a set of functions within the I/O device 122 to the hypervisor 104 or BIOS 106. The characteristic that a plurality of functions are provided within one I/O device is called multifunction. For example, when the I/O device 122 is a dual port NIC having two ports, the I/O device 122 has two functions. The hypervisor 104 may assign a function to be used to a virtual machine. For example, the hypervisor 104 assigns the function 122-0 to a virtual machine 101 and assigns the function 122-1 to the virtual machine 102.
Under the PCIe standard, the BIOS 106 when the server 100 is started assigns a set of a bus number, a device number and a function number to the functions within the root complex 113, upstream P2P bridge 115, downstream P2P bridges 116 and 118, and I/O devices 122 and 123. For example, the BIOS 106, as in the logically connected state illustrated in FIG. 2, sets a set of a bus number, a device number and a function number to the functions within the root complex 113, upstream P2P bridge 115, downstream P2P bridge 116 and I/O device 122. FIG. 3 is a block diagram illustrating a configuration of the PCIe switch 114.
The PCIe switch 114 includes the upstream P2P bridge 115, downstream P2P bridges 116 and 118, upstream port 130, switch 131, and downstream ports 132 and 133. Notably, the downstream port 132 corresponds to the I/O slot 120 in FIG. 1, and the downstream port 133 corresponds to the I/O slot 121 in FIG. 1.
The upstream port 130 provides a physical link for connecting to the root complex 113 in FIG. 1. The downstream ports 132 and 133 provide physical links for connecting to the I/O devices 122 and 123, respectively, in FIG. 1. The upstream P2P bridge 115 has a configuration table 115A and uses the configuration table 115A to control the transfer of a packet received from the hypervisor 104 or I/O devices 122 and 123. The switch 131 changes the internal destination (which may be the downstream P2P bridge 116 or 118) of a packet.
The downstream P2P bridge 116 includes a bridge control unit 142, a configuration processing unit 143 and a configuration table 144. The bridge control unit 142 refers to the configuration table 144 to control the packet transfer. The configuration table 144 stores information to be referred or set as a configuration space by the hypervisor 104 or BIOS 106. The configuration table 144 stores information on the state of the I/O slot 120 including whether the I/O device 122 has been connected or not. The configuration table 144 stores information for providing a function of the hot plug controller 117 in FIG. 1. The configuration processing unit 143 has a function of the hot plug controller 117.
Next, there will be described an operation by the server 100 when the I/O device 122 is connected to the server 100 and an operation by the server 100 when the I/O device 122 is removed from the server 100. FIG. 4A is a flowchart illustrating operations by the server 100 when the I/O device 122 is connected to the server 100. FIG. 4B is a flowchart illustrating operations by the server 100 when the I/O device 122 is removed from the server 100.
Referring to FIG. 4A, a circuit (not illustrated) on the I/O slot 120 detects the existence of the I/O device 122 and notifies the existence of the I/O device 122 to the hot plug controller 117 (step S201). The hot plug controller 117 updates the information on the state of the I/O slot 120 within the configuration table 144 with the information describing that the I/O device 122 has been connected (step S202). After that, the hot plug controller 117 issues an interrupt signal to the hypervisor 104 (step S203).
The hypervisor 104 refers to the updated information on the state of the I/O slot 120 within the configuration table 144 and detects the existence of the I/O device 122 (step S204). The hypervisor 104 instructs the hot plug controller 117 to enable the I/O slot 120 (step S205). More specifically, the hypervisor 104 rewrites a flag indicating power supply from the I/O slot 120 to the I/O device 122 within the configuration table 144 to "enable". Thus, the I/O slot 120 supplies power to the I/O device 122.
Next, the hypervisor 104 scans for the bus corresponding to the I/O slot 120 and detects the functions 122-0 and 122-1 within the I/O device 122 (step S206). More specifically, the hypervisor 104 scans the bus number corresponding to the I/O slot 120 downstream of the downstream P2P bridge 116 illustrated in the logically connected state in FIG. 2. Since the bus number corresponding to the I/O slot 120 downstream of the downstream P2P bridge 116 is "3" which is given to the functions, the hypervisor 104 scans for the bus number "3". Here, under the PCIe standard, one of the device numbers "0 to 31" is assigned to a device, and one of the function numbers "0 to 7" is assigned to a device. The hypervisor 104 therefore attempts access 256 times (=32×8 times) for the bus number "3". In the example in FIG. 2, the hypervisor 104 receives responses from the functions 122-0 and 122-1 (or (bus number, device number, function number)=(3,0,0), (3,0,1)) and detects the functions 122-0 and 122-1. On the other hand, the hypervisor 104 receives an error status from the I/O device 122 as a response to an access attempt excluding access to those functions.
The hypervisor 104 assigns address spaces of the hypervisor 104 to the functions 122-0 and 122-1 and reads the corresponding drivers 105A and 105B onto the memory 112 (step S207). The drivers 105A and 105B initialize the functions 122-0 and 122-1 (step S208). The operation by the server 100 ends.
Referring to FIG. 4B, a circuit (not illustrated) on the I/O slot 120 detects the removal of the I/O device 122 and notifies the removal of the I/O device 122 to the hot plug controller 117 (step S211). The hot plug controller 117 updates information on the state of the I/O slot 120 within the configuration table 144 with the information describing that the I/O device 122 has been removed (step S212). After that, the hot plug controller 117 issues an interrupt signal to the hypervisor 104 (step S213).
The hypervisor 104 refers to the update information on the state of the I/O slot 120 within the configuration table 144 and detects the removal of the I/O device 122 (step S204). The hypervisor 104 instructs the hot plug controller 117 to disable the I/O slot 120 (step S215). More specifically, the hypervisor 104 rewrites a flag indicating power supply from the I/O slot 120 to the I/O device 122 within the configuration table 144 to "disable". Thus, the I/O slot 120 no longer supplies power to the I/O device 122. After that, the hypervisor 104 deletes the drivers 105A and 105B corresponding to the functions 122-0 and 122-1 present on the memory 112 (step S216). The operation by the server 100 ends.
In this way, when the I/O device 122 is connected to the server 100, the hypervisor 104 instructs the hot plug controller 117 to enable the I/O slot 120, and power is supplied to the I/O device 122. As the result, the functions 122-0 and 122-1 within the I/O device 122 are collectively enabled. When the I/O device 122 is removed from the server 100, the hypervisor 104 instructs the hot plug controller 117 to disable the I/O slot 120. The power to be supplied to the I/O device 122 is blocked. As the result, the functions 122-0 and 122-1 within the I/O device 122 are collectively disabled.
Hitherto, a computer system has been known which includes a plurality of virtual computers constructed by a control program provided in a computer and having independent OSs (Operating Systems) running thereon and an I/O device having a single port which is connected to a PCI (Peripheral Component Interconnect) bus of the computer. Another technology has been known in which one set of functions is constructed from an arbitrary combination of a plurality of PCI agents and the functions are controlled from a BIOS (Basic Input/Output System) and/or a driver as one unit.
Japanese Laid-open Patent Publication Nos. 2004-252591 and 9-237246 are examples of related art.
In the server 100, the functions 122-0 and 122-1 within the I/O device 122 are collectively enabled or disabled. It may be difficult for the hypervisor 104 to enable a function within the I/O device 122 independently even when a manager requests to enable the function 122-0 only for assigning the function 122-0 to the virtual machine 101, for example.

Switching circuit connected to an I/O device, and switching circuit connected to an I/O device control method


A large number of keys arranged in a matrix are provided on the keyboard (KB) of a host computer. Of these keys, keys (K10, . . . , K15, . . . ), located at positions corresponding to Learning terminals in a classroom, are assigned to the respective learning terminals.

In recent years, much attention has been given to a CAI (Computer-Aided Instruction) system which can provide, in an interactive manner, instructions corresponding to individual learning levels, as well as multitudinous instructions, using a computer. In the basic CAI system, a plurality of learning terminals provided in a classroom are connected to a host computer. Instructions corresponding to individual learning levels are provided such that the entire progress of a class is managed using the computer, while problems are posed to the respective terminals and answers are received therefrom, in an interactive manner. In this CAI system, a key-operation console for specifying which of the learning terminals is/are to be used is provided at a teacher's side, so that various instructions and information are supplied from the teacher to students utilizing the learning terminals, via the key-operation console, or a teacher can selectively communicate with the students.
The conventional CAI system described above is designed in accordance with the layout of a classroom, and a special-purpose key-operation console is designed and manufactured in accordance with the arrangement of learning terminals in the classroom. However, there are various classroom layouts; for example, 20 students (4 rows.times.5 columns), 24 students (4 rows.times.6 columns), 48 students (6 rows.times.8 columns), 40 students (8 rows.times.5 columns). Therefore, if the key-operation console is designed and manufactured in accordance with a specific classroom layout this results in high equipment cost. In addition, if key-operation consoles corresponding to specific classroom layouts are individually manufactured, this results in poor maintainability.
It is proposed to combine a predetermined number of keys to constitute a module key, and to combine a plurality of such module keys to arrange, at low cost, a key-operation console corresponding to the desired classroom layout. However, as is shown in FIG. 1, when key modules, each consisting of five keys, are used to realize a key-operation console for a classroom where 24 learning terminals T1 to T24 are arranged in a 6 (rows).times.4 (columns) matrix, this presents the following drawback:
In this case, since the necessary number of keys is 24, five key modules are prepared. Five key modules KM1 to KM5 are arranged, to realize a key-operation console, as is shown in FIG. 2. For this reason, the key matrix differs from the learning terminal matrix in the classroom. As a result, the correspondence between the keys and the learning terminals is rendered unclear, thus resulting in poor operability of the key-operation console.


Disclosed herein is a powder actuated setting tool piston retainer arrangement which includes a housing and firing mechanism and a piston having a piston retaining ring in operable communication with the housing and firing mechanism. Further the arrangement includes a barrel within which the piston is slidably disposable. A cantilevered retainer is disposed at the barrel, the retainer being pivotally articulated with the barrel such that the retaining ring is contactable thereby to retain the piston in a selected position.

Powder actuated setting tools all utilize among other things, a powder charge to set in motion a piston which travels within a barrel. The barrel in one way or another houses a fastener to be forcefully ejected from the setting tool by the piston moving within the barrel. The piston is accelerated by expanding gas in a chamber, that expanding gas being occasioned by the burning of the powder charge. In order for the setting tool to function as intended, the piston must be maintained in a position appropriate to being driven by the expanding gas in the chamber of the setting tool. Effectively, the foregoing means that the piston needs to be held "up" when the setting tool is compressed to a firing position. As is familiar to one of ordinary skill in this art, setting tools of this type generally require compression of the setting tool against work surface before the tool will ignite the powder charge.
The cycle that is relevant to the current disclosure begins after firing the setting tool, the piston being in a "forward" position relative to the setting tool. Upon release of the compressive force applied to the setting tool by an operator thereof, a spring urges the setting tool away from the work surface. As this occurs, the piston is drawn back to a firing position, rearward of the setting tool. The piston must be maintained in this rearward position during the ignition of powder in order to develop the desired linear force due to gas expansion.
The problem arises when the setting tool is again compressed toward a work surface to dispense another fastener. Upon compression, in many of these tools, the components of the tool that hold the piston rearward of the tool are moved and do not support the piston in the desired rearward position. In such condition, the piston moves forward under gravity and linear force generated by expanding gas of burning powder is reduced. This is of course an undesirable result.
To remedy the forgoing problem, manufacturers have utilized different friction creating devices to hold the piston rearward. To date however, such devices have either been overly complex or have not worked reliably. Therefore the art is still in need of a simple yet effective and reliable configuration capable of maintaining the piston rearward of the setting tool until it is forcefully propelled forwardly of the setting tool pursuant to the ignition of the powder charge.

Powder activated setting tool piston retainer arrangement and method

Abstract: Further disclosed herein is a method for retaining a piston of a powder actuated setting tool in position. The method includes urging a cantilevered retainer radially inwardly of a barrel of the setting tool for the purpose of contacting a retaining ring of the piston of the setting tool. Such contact frictionally retains the piston in a selected position.


A receiver includes a first mixer configured to provide an in-phase (I) component of a radio frequency (RF) signal to an I channel by down-converting the RF signal, a second mixer configured to provide a quadrature (Q) component of the RF signal to a Q channel by down-converting the RF signal, amplification means, arranged on the I and Q channels, configured to amplify the I and Q components, a mismatch estimator configured to convert the amplified I and Q components into a frequency domain, and estimate a gain mismatch value and a phase mismatch value on the basis of the converted components, and a mismatch compensator configured to compensate for mismatch of the received signal on the basis of the estimated gain and phase mismatch values.

1. Field of the Invention
The present invention relates to a radio receiver for estimating and compensating for in-phase/quadrature (IQ) mismatch.
2. Discussion of Related Art
In recent communication systems, a direct conversion reception method capable of reducing the number of components and having low complexity and low power consumption has been preferred. The direct conversion reception method converts a signal of a radio frequency (RF) band into a baseband by use of one mixer without involving an intermediate frequency. The mixer receives the RF signal and outputs signals of an in-phase (I) component and a quadrature (Q) component. Each signal is input to an analog-to-digital (A/D) converter through an amplifier and an analog filter. In this process, mismatch occurs in the signals of the I and Q components due to an analog circuit including a local oscillator, a mixer, an amplifier, and an analog filter. This mismatch reduces a signal to noise ratio of a received signal, thereby increasing a bit error rate (BER) and degrading the performance of a wireless communication receiver. To reduce the mismatch, errors of the I and Q components should be minimized when the analog circuit is designed. Also, when the analog circuit is designed, more precision is required and cost of the analog circuit increases.
To avoid these disadvantages, methods of estimating and compensating for the mismatch in a digital stage have been proposed. For example, there is a method using a pilot signal in an orthogonal frequency division multiplexing (OFDM) system or a method using a known signal in a system including a transmitter and a receiver. The method of estimating the mismatch by use of a specific pilot signal in a system supporting the OFDM scheme cannot be applied to a system with no pilot signal. There is a disadvantage in that the performance of estimating the mismatch is degraded due to a pilot signal estimation error. In the method proposed in a transceiver structure including both of the transmitter and the receiver, mismatch of the receiver is estimated by generating a specific signal through the transmitter and receiving the specific signal by the receiver in an RF stage. This method additionally requires a signal generator in a system only having a receiver such as a mobile broadcast receiver, and has a disadvantage in that the mismatch is not compensated for in real time during communication. Mismatch compensation methods proposed in the related art have a disadvantage in that time mismatch occurring due to a group delay difference of an analog filter between I and Q components or a circuit length difference in a broadband system having a high sampling frequency is not processed.

Receiver for estimating and compensating for in-phase/quadrature mismatch


A semiconductor device includes a semiconductor body, a first electrode, a control electrode and a control interconnection electrically connected to the control electrode. The first electrode, the control electrode, and the control interconnection are provided on a front surface side of the semiconductor body. The control electrode is shaped as one body in a trench. The control electrode includes a first portion, a second portion, a first end portion and a second end portion that are arranged in a direction along the front surface of the semiconductor body. The first and second portions are positioned between the first and second end portions. The first portion is positioned between the first electrode and the semiconductor body, and the second portion is positioned between the control interconnection and the semiconductor body. The control interconnection crosses the second portion of the control electrode, and is electrically connected thereto.

A semiconductor device often has a trench gate structure in which a gate end is positioned in a high impurity concentration region. Thereby, it is possible to mitigate an electric field concentration at the gate end and enlarge the static breakdown voltage. However, there may be a case where the avalanche resistance is lowered by a current concentration due to impact ionizations during a turn-off period at the high impurity concentration region that protrudes into a drift region.

TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION


The prepay telecommunications system (60) includes a prepay call management platform (50) which is directly coupled to a telecommunications carrier switch (24). A customer database (116) is coupled to the prepay call management platform (50) for storing prepay customer data, and a plurality of customer interface facilities (62, 64, 66, 68, 80) are provided for accepting customer prepayment and immediately updating the customer database (116). The prepay calls are recognized by the mobile identification number and is routed to the prepay call management platform (50) coupled to and co-located with the telecommunications carrier switch (24). The customer account balance associated with the prepay call is looked up in a customer database (116), and the maximum allowable call duration in response to the customer account balance is computed. The prepay call is then released to the telecommunications carrier switch (24) for line termination. At the same time, a call duration timer is started. The call is disconnected in response to the call duration timer reaching the maximum allowable call duration. The prepay telecommunications system is applicable to both wireless and non-wireless telecommunications systems.

The world of wireless telecommunications is entering a new era with the advent of personal communications services (PCS). The constant trend toward lower and lower subscriber acquisition costs and higher market penetration is creating a demand for more effective ways to offer the wireless service to broader segments of the population. However, a large percentage of applicants are normally turned away from wireless carriers due to poor or insufficient credit, although many of these applicants do possess the ability to pay for the service. Accordingly, a growing segment within the wireless telecommunications market is the prepaid wireless service.
The typical wireless service requires its subscriber caller to deposit a certain amount of funds, by cash, credit card, and/or other means, into an account. As the caller uses the wireless service, the account balance is deducted. As long as there are funds in the account, the caller may continue to use the wireless service. Additional deposits may be made to replenish the account balance.
There are however, several disadvantages associated with traditional prepaid wireless accounts. First, the caller may be required to enter an additional authorization code or personal identification number (PIN) in order to place each call. Some debit cards or debit systems may require the customer to enter as many as 31 additional digits. Second, the traditional prepaid wireless services lack the ability to disconnect a call during the call when the account balance is fully depleted. Third, there is substantial lag time between the time of the call and the time the amount of funds expended by a call is posted to the account. Therefore, it may be seen that the wireless service provider experiences credit exposure with post call billing and the inability to disconnect calls as soon as the accounts are depleted of funds. While these problems are most acute in the wireless industry, they are also a problem in other telecommunications systems.


An inkjet recording apparatus includes a heating unit configured to produce thermal energy for discharging ink, and two electrodes which electrically connect with each other through the ink. Voltage is applied between the two electrodes, and a current value flowing through the ink is measured. Whether the ink is discharged or not is determined by determining whether the current changes when the heating unit is driven.

1. Field of the Invention
The present invention relates to an inkjet recording apparatus for performing recording on a recording medium by discharging ink and a control method of the inkjet recording apparatus.
2. Description of the Related Art
An inkjet recording method is a method for performing recording by discharging liquid (for example, ink) from discharge ports of an inkjet recording head so that the liquid adheres onto a recording medium such as paper. The inkjet recording method can perform high image quality and high-speed recording by using bubbles of the liquid caused by thermal energy produced in a heating unit and discharging the liquid.
Generally, the inkjet recording head includes a plurality of inkjet discharge ports, an ink flow path communicating with the ink discharge ports, and a heating unit producing thermal energy for discharging the ink. To the ink flow path, the ink is supplied from an ink tank, and the supplied ink is reserved in the vicinity of the ink discharge ports. In such a state, if the heating unit is driven and thermal energy is produced, the ink in the vicinity of the ink discharge ports is heated by the thermal energy and bubbles are formed. By pressure caused by the bubbling, the ink is discharged.
In such a mechanism, an ink contact portion (heat affected portion) of the heating unit that is heated by the heating unit is subjected to a multiple effect including cavitation impact due to bubbling or contraction of the ink and chemical functioning by the ink while being exposed to high temperatures when the ink is discharged. Generally, in order to reduce the cavitation impact or the influence of the chemical functioning due to the ink, a protective layer including a metallic material is provided to the heat affected portion. The temperature of the surface of the protective layer may increase to around 700° C., and the surface comes in contact with the ink. Accordingly, for the material used for the protective layer, it is required to have excellent heat resistance, mechanical characteristics, chemical stability, alkaline resistance, and the like.
At the same time, if color materials, added substances, and the like contained in the ink are decomposed by high temperature heating, the materials may change into low solubility materials (hereinafter, such materials are also referred to as a burnt deposit). If the materials adhere to the heat affected portion of the protective layer, the heat is not uniformly conducted from the heating unit to the ink, and results in unstable bubbling. Then, the ink may not be discharged. To solve this issue, in the inkjet recording apparatuses, the burnt deposit needs to be removed from the heat affected portion of the inkjet recording head at appropriate timing.
Japanese Patent Application Laid-Open No. 2008-105364 discusses an inkjet recording apparatus in which cleaning of an inkjet recording head is performed when the number of times of ink discharge exceeds a predetermined value in order to remove the burnt deposit.
However, an adhesion state of the burnt deposit onto the heating unit of the inkjet recording head varies depending on the type of the ink or the recording method. Accordingly, it is necessary to correctly determine whether the burnt deposit adheres to the heat affected portion.

Inkjet recording apparatus and control method of the inkjet recording apparatus which determines current value changes of current flow through the ink


In a data recording method and a data recording apparatus relating to the present invention, ECC blocks using 36 product codes are recorded on 12 tracks through scanning operations performed three times. First of all, first sync-blocks each constituted by adding a C1 parity to the data string of video data constituting an internal encoding calculation data stream are sequentially recorded. When the first sync-blocks are completely recorded, second sync-blocks each constituted by adding the C1 parity to the data string of C2 parity constituting the internal encoding calculation data stream are sequentially recorded. By recording the C2 parity at one time in a later stage, the system delay can be minimized.

1. Field of the Invention
The present invention relates to a data recording method and a data recording apparatus preferably for use in a digital video tape recorder and the like, and particularly relates to a data recording method and a data recording apparatus wherein input data is subjected to error correction encoding and the error correction-encoded data is recorded on a recording medium.
2. Description of Related Art
Conventionally, a digital video tape recorder has been proposed in which every group of input video data is subjected to error correction encoding using a product code according to one or a plurality of encoding units. Thus, the error correction-encoded data in one or a plurality of encoding units is recorded on a recording medium, such as on one or a plurality of inclined tracks of a magnetic tape.
As described above, in the digital video tape recorder in which input video data is subjected to error correction encoding using a product code for each encoding unit to record the video data, portions of C2 parities, i.e., external encoding parities are respectively located and recorded on an internal portion and an end portion of each inclined track as shown in FIG. 1, for example. FIG. 1 shows an example where video data of one field is recorded on twelve inclined tracks. In this case, four tracks are simultaneously scanned by four heads at one time, and thus, all of the twelve tracks are scanned through three scanning operations.
When the data is recorded with the portions of C2 parities located at the initial and end portions of each inclined track, a sync-block, constituted by adding a C1 parity, i.e., and internal encoding parity to a data string of the C2 parity which constitutes a C1 calculation data stream, is sequentially recorded on each of the initial and end portions of each inclined track. On the other hand, a sync-block, constituted by adding a C1 parity to a data string of the video data which constitutes a C1 calculation data stream, is sequentially recorded on the center portion of each inclined track.
In this case, it is required that the calculation of the C2 parity has been completed before the portion of this C2 parity is recorded for the first time. For this reason, as a consequence, recording of data on the inclined tracks can be started only after a group of input video data is entirely captured, the C2 parity is calculated, and then the calculation of the C2 parity is completed.
For example, when a group of input video data is one field as described above, on an assumption that time T1 of one field is spent for capturing the entire group of input video data and time T2 is further spent for calculating a part of the C2 parity, the system delay Ta in an error correction code (ECC) encoder is T1+T2, which is a long system delay.
FIG. 2 shows a system delay Ta in a conventional EEC encoder. In FIG. 2, a solid line 1a shows an input processing of video data, whereas a broken line 1b shows an output processing of C2 parity and video data.
If the system delay Ta is long in the ECC encoder as described above, the time required from the initiation of the input of the input data to the initiation of the recording of this input data is also accordingly longer. As a result, the following problems arise.
1) When the video data is reproduced for confirmation immediately after the video data is recorded, the images reproduced by the reproduction video data have a large time deviation from the images produced by the input video data, which causes a user trouble in confirming the images; and
2) In order to execute a pre-read editing operation, the recording and the reproduction heads are attached at largely different heights from each other, which causes the effective track length to be shortened, resulting in deterioration in the signal to noise (S/N).
Herein, the pre-read editing operation means an editing operation in which video data of a specific frame recorded on a specific portion of a tape is reproduced, processing such as insertion of telop data into this video data of specific frame is performed, and then this video data of the specific frame is recorded again on the above-described specific portion of the tape.
FIG. 3 shows an exemplary pre-read editing system. A reproduction head Hp reproduces video data of a specific frame recorded on a specific portion of a tape 301. In this case, a reproduction amplifier 302 amplifies the reproduction signal reproduced on the reproduction head Hp, and an equalization circuit 303 has waveform-equalized the reproduction signal before a decoding circuit 304 receives it. The decoding circuit 304 decodes the waveform-equalized reproduction signal utilizing a Viterbi algorithm, for example.
An error correction code (ECC) decoder 305 receives the video data from the decoding circuit 304. The ECC decoder 305 performs error correction by use of the parities added to the video data. A video expansion circuit 306 receives the error-corrected video data from the ECC decoder 305 and expands the video data.
The video data Va output from the video expansion circuit 306 is supplied to a fixed terminal 307a of a switch circuit SW. On the other hand, telop data St to be inserted to the video data Va is supplied to a fixed terminal 307 b of the switch circuit SW, for example. In this case, the switch circuit SW is connected to the fixed terminal 307b during a period when the telop data ST is supplied, whereas the switch circuit SW is connected to the fixed terminal 307a during the other periods. Thus, the switch circuit SW outputs video data Vb into which the telop data St has been inserted.
A video compression circuit 308 then receives the video data Vb from the switch circuit SW and performs data compression thereto. In this case, for example, the video data Vb is divided into a two-dimensional blocks of 8×8 pixels, and is data-compressed by use of block encoding such as discrete cosine transform (DCT). Although not described above, the video expansion circuit 306 performs processing reversal of this data compression.
An ECC encoder 309 receives the compression-encoded data from the data compression circuit 308. The ECC encoder 309 performs error correction encoding to the compression-encoded data for each encoding unit using a product code. The video data output from the ECC encoder 309 is supplied via a recording amplifier 310 to a recording head Hr that records the reproduction signal corresponding to the video data on the portion of the tape 301 from which the reproduction head Hp has reproduced this video data.
here, during the time "t" from the point where the video data is reproduced by the reproduction head Hp to the point where the video data is recorded by the recording head Hr, the tape 301 travels a distance "d" proportional to the time "t". For this reason, as shown in FIG. 4, the recording head Hr is attached at a position distanced from the reproduction head Hp by a difference (difference in heights between attached positions) "h" in order that, when the tape 301 travels the distance "d", the recording head Hr scans the same portion which the reproduction head Hp scanned time "t" ago.
In this case, the recording head Hr is arranged to be in contact with the tape 301 within a range ARr. Specifically, in order to prevent the tape 301 from being cut by the recording head Hr coming into contact with the end portion of the tape 301, the recording head Hr is arranged to be in contact with the tape 301 at a position inward of the end portion of the tape 301 by a specific distance. Because of this arrangement, the reproduction head Hp comes into contact with the tape 301 within a range ARp. Therefore, this range ARp is an effective track length.
As described above, if the system delay Ta in the ECC encoder is long, the time "t" is long and the distance d is accordingly large. As a result, the step "h" is also large, resulting in a short effective track length ARp. When the effective track length ARp is short as in this case, the recording wavelength is shortened in order to ensure the same capacity of recording data as that of the case where the effective track length ARp is long. However, when the recording wavelength is short, the S/N is degraded.

Data recording method and data recording apparatus


Entropy obtained from a series of key generation exchanges may be combined with entropy from a strong entropy source to allow the strong entropy to be stretched to generate a larger number of keys for use on a communication network, without requiring additional information from the group members and without requiring the entropy source to be increased in size or in number. In one embodiment, nonces exchanged during an initial key exchange are used to generate additional key material that is then fed, together with a fresh random secret, to another pseudo-random function to generate an additional key stream. The fresh ransom secret may be generated at the GCKS from a physical entropy source or other entropy source, and may be changed at will by the GCKS to further increase the strength of the keys. The methods are particularly useful for group key management where a large number of keys are required to be generated in a short time frame.

1. Field
This application relates to communication networks and, more particularly, to a method and apparatus for generating large numbers of encryption keys for use on a communication network.
2. Description of the Related Art
Data communication networks may include various computers, servers, nodes, routers, switches, hubs, proxies, and other devices coupled to and configured to pass data to one another. These devices will be referred to herein as "network elements," and may provide a variety of network resources and services on the network. Conventionally, data has been communicated through data communication networks by passing protocol data units (such as packets, cells, frames, or segments) between the network elements by utilizing one or more communication links extending between the network elements. A particular protocol data unit may be handled by multiple network elements and cross multiple communication links as it travels between its source and its destination over the network.
To allow communications to take place in a secure manner on the communication network, it has become common to encrypt the communications, generally using encryption keys. Encryption keys are random strings of numbers that may have any number of characters. The longer the character string, and the more unpredictable the characters in the string, the stronger the key is said to be. As keys become stronger, the communications they encrypt become safer because it is harder to guess or infer the key that was used to encrypt the communication.
Since the strength of an encryption key depends in large part on the unpredictability of the characters in the key, generation of strong encryption keys requires the key generation program or network element to have access to a source of random numbers, referred to herein as an entropy source. If the entropy source is predictable, the values created by the entropy source will be easier to guess, and the strength of the keys created by the entropy source will be reduced accordingly.
Physical entropy sources may be used to generate random numbers for use in creating encryption keys, and may be considered somewhat superior to software entropy sources due to the unpredictability of the random information created. A few physical entropy sources include thermal noise, radioactive decay, oscillators, and disc drives, although other physical entropy sources exist as well. While physical entropy sources are able to generate truly random information, and hence may be used to create very strong encryption keys, they generally tend to be relatively slow. For example, the rotational speed of the disc in a computer disc drive may be used to generate random information. However, since the speed may not vary considerably in a short period of time, a disc drive-based physical entropy source may only generate sufficient random information to generate up to a few keys per second. As the keys become larger, the rate at which they may be generated is concomitantly reduced.
As networks have become larger, and the number of entities encrypting traffic on the networks has risen, the need for a source of strong encryption keys has increased. One driving force behind this need for encryption keys is the proliferation of Virtual Private Networks (VPNs). VPNs allow private traffic to be shared between VPN sites over a public network by securing the traffic in such a manner that other users of the communication network are not able to see the private traffic. There are several ways to do this, many of which involve encrypting the traffic before transmitting the traffic onto the communication network.
As VPNs increase in size and number, generation of keys by the group members has been replaced by centralized key management systems, referred to herein as Group Control Key Servers (GCKSs). A GCKS may provide many services on the network as well as key generation and management. While a large GCKS on the network may be required to generate thousands or tens of thousands of encryption keys for use by members of one or more Virtual Private Networks. Unfortunately, physical entropy sources are generally unable to provide a sufficient number of random values to generate strong keys for use in this environment, and software entropy sources may be too predictable to provide sufficiently strong encryption keys.

Method and apparatus for generating large numbers of encryption keys


An aircraft includes a wing and a wing box. The wing is joined to the wing box at a side of body joint. The wing and the wing box each includes lower skin and a plurality of stringers on the skin. Ends of at least some of the stringers at the side of body joint have a web cutout and a base that is spanwise tapered to a knife edge at the skin.

A wing assembly of an aircraft may include a central wing box and wings cantilevered from sides of the central wing box. The central wing box carries bending loads applied by each wing during flight.
A "side of body joint" refers to that portion where a wing is joined to the central wing box. A typical side of body joint provides a chordwise splice of the wing to the central wing box, and it provides primary attachment of the wing to the aircraft's fuselage.
Due to the importance of this joint, and due to complex loading on it during flight, a robust design is highly desirable.


A control device for a hybrid motor constituted by an internal combustion engine and an electric motor, which are connected via a clutch, stops the internal combustion engine when a predetermined deceleration condition is established, and prohibits stoppage of the internal combustion engine when the temperature of an exhaust gas purification catalyst interposed in an exhaust system of the internal combustion engine is higher than a first predetermined temperature, which is higher than an activity start temperature of the exhaust gas purification catalyst, even if the predetermined deceleration condition is established.

A technique of preventing the temperature of an exhaust gas purification catalyst from decreasing to or below an active temperature by disengaging an engine from a drive shaft and halting a fuel supply to stop the engine from rotating when the temperature of the catalyst reaches or exceeds a predetermined temperature is known in the related art (see JP2004-112995A). According to this technique, exhaust emissions can be prevented from deteriorating when the engine is restarted.

Control method and device for hybrid motor


A positioner (20) for a disk drive (10) that includes a magnet assembly (52), a conductor assembly (54), and a control system (22) is provided herein. The magnet assembly (52) includes a pair of magnet arrays (56A) (56B) and a pair of spaced apart flux return plates (75A) (75B). The conductor assembly (54) includes at least a first coil array (80) and a second coil array (82) that are substantially co-planar. The control system (22) directs current to electrically excite the coil arrays (80) (82) to maintain a data transducer (50) on a target track (32) of a storage disk (28).

The present invention relates generally to disk drives for storing and retrieving data. More specifically, the present invention relates to a positioner for a disk drive that precisely positions and maintains a data transducer on a target track of a storage disk. Further, the positioner is uniquely designed to minimize wear on an E-block and thereby decrease the likelihood of track mis-registration.
Disk drives are widely used in computers and data processing systems for storing information in digital form. These disk drives commonly use one or more rotating storage disks to store data in digital form. Each storage disk typically includes a data storage surface on each side of the storage disk. These storage surfaces are divided into a plurality of narrow, annular regions of different radii, commonly referred to as xe2x80x9ctracksxe2x80x9d. Typically, a head stack assembly having a positioner and an E-block is used to position a data transducer of a transducer assembly proximate each data storage surface of each storage disk. The data transducer transfers information to and from the storage disk when precisely positioned on the appropriate track of the storage surface. The transducer assembly also includes a load beam and a suspension for supporting the data transducer.
The need for increased storage capacity and compact construction of the disk drive has led to the use of disks having increased track density or decreased track pitch, i.e., more tracks per inch. As the tracks per inch increase, the ability to maintain the data transducer on a target track becomes more difficult. More specifically, as track density increases, it is necessary to reduce positioning error of the data transducer proportionally. With these systems, the accurate and stable positioning of the data transducer proximate the appropriate track is critical to the accurate transfer and/or retrieval of information from the rotating storage disks.
One attempt to improve positioning accuracy includes increasing the servo bandwidth of the positioner. Unfortunately, as the bandwidth of the positioner is increased, it approaches a resonant frequency of the head stack assembly and it becomes more difficult to keep the positioner stable.
Another attempt to raise servo bandwidth of the head stack assembly includes securing a pair of piezoelectric motors to the load beam of each transducer assembly. This configuration is known in the industry as a dual stage actuator. Unfortunately, existing dual actuators are not entirely satisfactory. For example, existing dual stage actuators typically add substantial cost to the disk drive because every transducer assembly includes a pair of piezoelectric motors. Further, the drive electronics for the dual stage actuator is more complex due to the need to generate positive and negative voltages well beyond the supply rails.
Yet another attempt to improve positioning accuracy includes utilizing a positioner having a pair of vertically offset coil arrays. This positioner design eliminates the major resonant frequency and allows for higher servo bandwidth by the positioner. Unfortunately, the vertically offset coil arrays generate a twisting moment on the E-block that can greatly influence the accuracy of positioning and can cause wear on the E-block.
In light of the above, it is an object of the present invention to significantly increase the servo bandwidth of the head stack assembly. Another object of the present invention is to provide a positioner that accurately positions the data transducers. Still another object of the present invention is to provide a positioner that prevents the exciting of the system mode at an E-block pivot center. Yet another object of the present invention is to increase servo bandwidth without the use of piezoelectric motors on each transducer assembly. Yet another object of the present invention is to reduce the cost of manufacturing a high density disk drive.
The present invention is directed to a positioner for a head stack assembly of a disk drive. The disk drive includes one or more storage disks. The head stack assembly also includes an E-block, and one or more data transducers. The positioner moves the E-block and the data transducers relative to the storage disks of the disk drive. More specifically, the positioner moves the E-block and the data transducer to a target track of the storage disk. Additionally, the positioner accurately maintains the data transducer on the target track of the storage disk.
As provided herein, the positioner includes a magnet assembly, a conductor assembly, and a control system. The conductor assembly includes a first coil array and a second coil array that are positioned near the magnet assembly. The control system electrically excites the coil arrays to interact with the magnet assembly. Uniquely, the first coil array and the second coil array are substantially coplanar. As a result of this design, the positioner avoids the exciting of the major system mode at an E-block pivot center and the servo bandwidth of the positioner can be increased. Further, the accuracy in which the positioner positions the data transducer is increased. Moreover, the coplanar coil arrays do not generate a twisting moment on the E-block that can influence the accuracy of the positioner.
As used herein, the term xe2x80x9cseek modexe2x80x9d refers to when the positioner is moving the E-block relative to the storage disks to position the data transducer onto the target track. Additionally, the term xe2x80x9con-track modexe2x80x9d refers to when the positioner is maintaining the data transducer on the target track.
A number of alternate embodiments of the positioner are provided herein. In a first embodiment, the first coil array encircles the second coil array. In this design, in seek mode, the control system electrically excites the first coil array to move the E-block, and the data transducer, relative to a storage disk to seek the target track on a storage disk. Subsequently, in the on-track mode, the control system electrically excites both the first coil array and the second coil array to generate opposed forces that maintain the data transducer on the target track of the storage disk. The opposed forces of the first and second coil arrays prevent exciting of the system mode of the head stack assembly.
In a second embodiment, the second coil array is positioned adjacent to and alongside of the first coil array. In this design, the first coil array is located closer to the E-block than the second coil array. In this design, in the seek mode, the control system electrically excites both coil arrays to move the data transducer to the target track. Alternately, in the on-track mode, the control system again electrically excites both the first coil array and the second coil array. In this mode, the coil arrays are electrically excited to generate substantially similar magnitude force but in opposite directions in order to maintain the data transducer on the target track.
In yet another embodiment, the positioner additionally includes a third coil array that is substantially co-planar with the first and second coil arrays. In this design, the first coil array encircles the second coil array and the third coil array. Further, the second coil array and the third coil array are positioned side by side. In this design, when the positioner is in xe2x80x9cseekxe2x80x9d mode, the control system electrically excites the first coil array to move the E-block so that the data transducer is positioned on the target track. Subsequently, in the xe2x80x9con-trackxe2x80x9d mode, the control system electrically excites the second coil array and the third coil array to maintain the data transducer on the target track.
The present invention is also directed to a disk drive and a method for retrieving data from a target track on a rotating storage disk of a disk drive.

Positioner for precisely moving an e-block of a disk drive


A method for manufacturing an array substrate, including: forming a semiconductor material film on a substrate, the method further including: forming a metal film covering the semiconductor material film; and performing a single patterning process on the metal film and the semiconductor material film to form an active layer, a semiconductor material remained pattern and a first electrode of a storage capacitor. The semiconductor material remained pattern is in a same layer as the active layer; and the first electrode of the storage capacitor is formed of the metal film and is on a side, away from the substrate, of the semiconductor material remained pattern. An array substrate and a display device are also provided.

An array substrate usually comprises a thin film transistor (TFT) and a storage capacitor. In the related art, in order to simplify the preparation process and reduce the number of patterning processes using a mask, a semiconductor pattern is usually formed in a region where a storage capacitor is required through the same patterning process while forming an active layer of a semiconductor material. And then, ion doping is performed on the semiconductor pattern so as to convert it from a semiconductor to a conductive material having a conductive property, thereby serving as one of the electrodes of the storage capacitor.
However, the electrode has a poor conductivity as it is formed of a semiconductor through ion doping, rather than being formed of metal material, and the performance of the storage capacitor is adversely affected.

Array substrate comprising transistor and capacitor, manufacturing method therefor, display device

HEFEI BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.


A system for managing message volume and timing, which permits messages from multiple sources to be spaced apart over time, with the pacing controlled in part by the type or priority of the message. The system permits the volume of messages to be reduced by aggregating messages according to a set of rules and by discarding or delaying messages that are sufficiently similar and sent too close together. In addition, the system allows message sources to be notified when a recipient has not received a message within a designated time period. The system can be implemented as a centralized pacing system or through use of a data storage system accessible by the message sources.

This invention relates to methods and systems for managing online and other communications.
With the growth of use of the Internet, more and more people have access to e-mail, and more and more entities use e-mail to communicate with customers, potential customers, or other people of interest. In, for example, a marketing context, companies periodically send e-mails to customers with new product information, special offers, company news, or other information.
As a result, recipients find themselves receiving more e-mails than they want to read. Recipients may get angry at the sender, may xe2x80x9copt-outxe2x80x9d of further mailings (if that option is available), or may simply stop reading the mailings. Thus, the benefits from sending mailings are reduced and recipients may not get information they otherwise would have found useful.
According to the present invention, message volume and timing is managed, preferably for both messages from a single message source and messages from multiple, independent message sources. In one embodiment, a centralized message pacing system is used, which regulates when messages are sent to recipients. In another embodiment, each message source uses a commonly-accessible data repository to determine when it sends messages, so that the timing of messages from each message source is coordinated.
The invention permits messages to be spaced at regular or other periods, depending on the type of message, its priority, or other factors. In addition, the invention permits messages to be combined in accordance with a set of rules, so as to reduce the number of separate messages that each recipient receives. Also, the invention permits the pacing of messages to be monitored, so that if a message is not sent to a recipient within a specified time period, one or more message sources are notified. Either the sender or the recipient can have control over the message pacing, both with respect to the timing of messages and the types of messages.
The invention is applicable generally to various types of communications channels. In a preferred embodiment, the invention is used in conjunction with a marketing system, such as the system described in commonly-assigned patent application Ser. No. 09/621,913, filed on the same day as this application, entitled xe2x80x9cMethod and System for Facilitating Marketing Dialogues,xe2x80x9d which is incorporated herein by reference.

Method and system for managing message pacing


A hybrid micromachined ultrasound transducer includes a piezoelectric micromachined transducer and a capacitive micromachined transducer. The capacitive micromachined transducer is vertically stacked with the piezoelectric micromachined transducer. The piezoelectric micromachined transducer and the capacitive micromachined transducer include a common shared electrode.

Ultrasound is used in a wide variety of applications. For example, ultrasound imaging is widely used to image internal structures in a variety of applications. Use of ultrasound in medical imaging is one common application. An ultrasound system typically includes a transceiver housed in a probe. An ultrasound probe usually includes an array of transducer elements. An electrical signal applied to a transducer element causes the element to produce an acoustic signal corresponding to the electrical signal. Similarly, an acoustic signal incident on the transducer element causes the element to produce an electrical signal representative of the incident acoustic signal.


A method and apparatus for management worn resistive memory cells are presented. A normal read mode or worn memory cell detecting mode are used depending on the wear state of a resistive memory cell. A detection reference point is changed upon wear indication to detect the resistance of the resistive memory cell. The resistance of the resistive memory cell is detected using the changed detection reference point to determine whether or not the resistive memory cell is worn by comparing the detected resistance to a wear reference level.

The inventive concept relates to semiconductor memory systems, and more particularly to semiconductor memory systems capable of managing worn memory cell(s) within a memory cell array. The inventive concept also relates to methods of operating a memory system.
Many different types of semiconductor memory are currently used to store data within telecommunication, consumer electronic, and household products. Semiconductor memory devices may be categorized as volatile and non-volatile in operative nature. In the absence of applied power data stored in a volatile memory device, such as a dynamic random access memory (DRAM), is lost. In contrast, stored data is retained in a non-volatile memory device even when applied power is interrupted.
Since non-volatile memory devices are generally capable of retaining stored data in the absence of applied power, operating with relatively low power consumption, and storing large quantities of data, they are commonly selected for use as a storage medium within mobile devices. Examples of non-volatile memory devices include a flash memory, a phase change random access memory (PRAM), a ferroelectric RAM (FeRAM), a magnetic RAM (MRAM), a resistive RAM (RRAM), and a spin-transfer torque-based MRAM (STT-RAM).

Method and apparatus managing worn cells in resistive memories


A switch control system for controlling an electrically conductive fluid supply to a tank, includes a detection circuit, a gate circuit, a control circuit and a switch circuit. The detection circuit detects a fluid level in the tank and outputs a voltage level signal. The gate circuit receives the voltage level signal and outputs control signals accordingly. The control circuit receives the control signals and outputs a first voltage and a second voltage accordingly. The switch circuit receives the first voltage and the second voltage and turns on and turns off the electrically conductive fluid supply to the tank in accordance with the first voltage and the second voltage.

1. Technical Field
The present disclosure relates to switch control systems, and particularly to a switch control system for controlling an electrically conductive fluid to a tank by means of a solenoid valve.
2. Description of Related Art
A solenoid valve is an electromechanical valve for use with liquid or gas. The valve is controlled by an electric current through the solenoid: in the case of a two-port valve the flow is switched on or off; in the case of a three-port valve, the outflow is switched between the two outlet ports. Solenoid valves are the most frequently used control elements for fluids. Their tasks are to shut off, release, dose, distribute or mix fluids. However, a typical solenoid valve is controlled by a single pole which has a deformable structure inside. The deformable structure tends to assume a naturally-deformed state over thousands of operations, which may cause the solenoid valve to fail or operate ineffectively.
Therefore there is a need for improvement in the art.

Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd.


A case for a battery includes a body including at least four side parts and a first bent part at an edge of at least one of the side parts, the four side parts being arranged to define a volumetric structure having two open ends, a bottom coupled to one of the open ends of the body, and a seal disposed in a space between the first bent part of the body and an edge of the bottom.

1. Field
Embodiments relate to a case for a battery and a secondary battery including the case.
2. Description of the Related Art
Secondary batteries are rechargeable batteries, i.e., batteries that are used many times. Such secondary batteries may be used in portable small devices, e.g., cellular phones, notebooks, computers, cameras, camcorders, etc., or may be used as a power source for driving a motor, e.g., of high output hybrid electric vehicles (HEV), electric vehicles (EV), electric scooters, etc. Such a secondary battery may include an electrode assembly, a case accommodating the electrode assembly, and a cap assembly coupled to an upper portion of the case.

Case for battery comprising bent edge and seal, and secondary battery including the case


The invention disclosed is a hydrogel-forming wound dressing or skin coating material suitable for household and veterinary use, consisting substantially entirely of wound-compatible and skin-compatible ingredients and comprising a first hydrophilic polymer, selected from polymers or copolymers of acrylic acid, polymers or copolymers of methacrylic acid, polymers or copolymers of itaconic acid, polymers or copolymers of maleic acid and polymers or copolymers of 3-butene-1,2,3-tricarboxylic acid, or combinations thereof, a second hydrophilic polymer which is capable of interacting with the first polymer to produce, upon drying, a hydrogel of improved water resistance and film forming properties relative to the first polymer alone and water. This material is film forming and substantially transparent but capable of being made opaque.

In order to allow the healing of lesions to take place at an appropriate rate and without undue pain, an appropriate coverage is placed over the affected area.
It is desirable that this coverage or dressing material constitute ingredients that are all compatible with human or animal skin, and provide, between the environment and the wound, an effective transmission of moisture, while specifically excluding microorganisms from the wound site.
It would be advantageous for such a preparation to be very quick drying, otherwise the home-user or clinician will not have the patience to use it, nor in many cases the opportunity, especially where children or animals are involved.
Another advantageous property of this dressing would be transparency, not only for cosmetic reasons but also to permit inspection of the healing process. Ideally, it should also be capable of being applied as very thin layers so that the resulting dressing would not be cumbersome.
It is also desired that such a dressing be easy to apply and remove, aesthetically pleasing, and non-odourous.
Although such a preparation encompassing all of the above advantages is not presently available, there is a genuine demand for it in many areas including the health care delivery area.
A wide variety of products are currently available on the market in the field of wound dressings. For example, sterile gauze-type dressings that are arranged in strips of various shapes and can be applied directly to the wound, are widely employed in the home for minor injuries. These dressings are mounted on plastic or fabric strips, with an adhesive coating for attachment to skin. Gauze pads are frequently covered with a perforated plastic strip to prevent adhesion of gauze to the wound surface.
U.S. Pat. No. 4,616,644, which issued to Johnson and Johnson Products, discloses a hemostatic adhesive bandage which comprises a pressure-sensitive adhesive-coated backing attached to an absorbent pad covered with a perforated plastic film wound release cover, the wound release cover having a thin coating of polyethylene oxide.
Despite their wide acceptance, the gauze-type dressings are not without their disadvantages. For instance, frequent and sometimes painful changes of such dressings are necessary in order to observe that the healing process is proceeding as desired, and to renew medication. These traditional dressings include two disposable strips called "release sheets" to protect the adhesive, which when removed, present a litter disposal problem. They are usually in strips which are difficult to scale to the size and shape of the individual wounds, especially between fingers and on joints. When applying these preparations to the fingers, it is often necessary to wrap the dressing around several times, so that despite the fact that they are semi-permeable, moisture may not be able to escape adequately leaving the wound site and healthy skin around the wound site swollen and lighter in colour. Moreover, wetting of these gauze-type dressings results in a retained water layer which favours microbial growth. Some manufacturers, such as Johnson and Johnson, have addressed this problem by incorporating an anti-microbial agent, such as benzalkonium chloride, into the gauze pad.
Hydrogels are apparently solid materials, which have some characteristics of animal skin and presumably would provide a good basis for wound dressings. According to Joseph D. Andrade in Hydrogels for Medical and Related Applications, A.C.S. Symposium Series 31, American Chemical Society, 1976, page xi, hydrogels "are three-dimensional networks of hydrophilic polymers, generally covalently or ionically cross-linked, which interact with aqueous solutions by swelling to some equilibrium value". It is known, in some instances, that complexing or interaction between polymer chains occurs by way of hydrogen bonding to form a hydrogel.
It is known to use hydrogel preparations for the clinical treatment of wounds, in particular severe burns. U.S. Pat. No. 4,572,906 discloses a selfsupporting film for use as a surgical dressing in the treatment of severe burns, comprising the hydrogel (15% water) blend of gelatin, chitosan and a compatible plasticizer. The dressing may be removed from the wound by soaking in physiological saline or water.
Canadian Pat. No. 1,176,932 also relates to a hydrogel-based wound adherent film for surgical application consisting of gelatin and a water soluble resin such as polyethylene oxide or polyethylene imine.
Canadian Pat. No. 1,180 622 discloses a hydrogel similar to Canadian Patent No. 1,176,932; however, the combination of gelatin and water soluble resin is in a liquid preparation to be poured by a skilled surgeon directly onto the wound as opposed to existing as a preformed film.
Although these hydrogel preparations provide good protection for wounds, allowing transmission of water vapour from the wound, generally cause less trauma of the skin surrounding the wound after removal (lightness of colour, swelling) compared to conventional dressings, and are transparent allowing the surgeon to monitor the progress of the healing, they do not lend themselves to household use. These hydrogel wound dressings contain, in some instances (Canadian Pat. Nos. 1,180,622 and 1,176,932) ingredients having systemic toxicity such as polyethylene imine. These dressings are therefore suitable for human use only when applied by or under the supervision of a professional for application to large areas of human tissue. For application to smaller areas, self-application may, in some instances, be possible. These preparations are also insufficiently quick-drying for household use.
Other dressings useful in surgical application include those of U.S. Pat. No. 4,524,064 and U.S. Pat. No. 4,243,656.
U.S. Pat. No. 4,524,064 to Nambu discloses a wound covering comprising polyvinyl alcohol, a water-soluble polyhydric alcohol and a high-viscosity water-soluble macromolecular substance. This latter ingredient provides high viscosity for the covering which interferes with migration of the covering components. It is recited in the disclosure of this patent that only high-viscosity macromolecular substances may be used, with the exception of polyvinyl alcohol and a list is given which includes polyacrylic acid. In this instance, polyacrylic acid is employed in a very small amount, and does not provide adhesion to the coating. It is merely added as a viscosity builder.
U.S. Pat. No. 4,243,656 to Walliczek discloses a paint-on liquid dressing for first and second degree burns consisting of acrylic polymer, gelatin, glycerol and water. The acrylic polymer is in the form of an emulsion and is not hydrogel-forming. Accordingly, although gelatin is hydrogel-forming, it merely acts to dilute the emulsion which, when applied to the skin, collapses due to evaporation of water. The emulsion, once collapsed, is not entirely hydrophobic, that is it will absorb some water although it is to such a small extent that it is outside the conventional recognized definition of a hydrogel.
It is known to utilize hydrogel wound dressings for the household treatment of wounds. Two alleged household wound dressings are disclosed in U.S. Pat. No. 3,419,006. These preparations, composed of hydrophilic, polymeric gels are almost entirely water (i.e. approximately 96% water), which leads to poor adhesion to the wound site. They must be reinforced with nylon mesh to prevent breakage. These preparations are primarily intended for use as shoe inserts to prevent chaffing against the skin.
It is an object of this invention to provide an inexpensive wound dressing material that contains only wound compatible ingredients to allow household and clinical use of such a preparation, allows effective transmission of water vapour from the wound site, and provides an effective barrier for the wound against exogenous microorganisms.
It is another object of this invention to provide an aesthetically pleasing, wound dressing material that is relatively quick-drying and transparent, although capable of being made opaque, and is easy to apply to allow self-application or application by an untrained person and similar easy removal.
It is another object of the present invention to provide a skin coating material.

Method of making a hydrogel-forming wound dressing or skin coating material