A first relay server transmits, to an access management apparatus that manages an access right to a second relay server, an access request with respect to the second relay server. The access management apparatus confirms that the access right to the second relay server is set in the first relay server, and then requests the second relay server to permit an access by the first relay server. In a case where the second relay server permits the access from the first relay server, the access management apparatus notifies the first relay server of such access permission. Based on the notice from the access management apparatus, the first relay server establishes a routing session with the second relay server. By using the routing session, the first relay server starts the communication with a general server that serves as a maintenance target.

1. Field of the Invention
The present invention relates to a relay communication system that enables computers connected to two different local area networks (LANs) to make communication with each other beyond a wide area network (WAN).
2. Description of the Related Art
Conventionally, a remote maintenance system, which performs, from a remote location, monitoring and maintenance for an electronic instrument installed at home, office or the like, has been put into practical use. By using the remote maintenance system, a service technician at a maintenance company can perform maintenance work for the electronic instrument without visiting the actual location where the electronic instrument is installed. There is a merit that the maintenance company can reduce costs by using the remote maintenance system. Even in the case where a problem with the electronic instrument occurs, the service technician can operate the electronic instrument remotely, thus quickly solving the problem that has occurred. In this way, there is a merit also for a user of the electronic instrument that uses the remote maintenance system.
Japanese Patent Laid-Open Publication No. 2003-223521 discloses a technique for monitoring, from a remote location, an operation control device that controls an air conditioner. The maintenance company of the air conditioner purchases a recording medium, in which monitoring software, a password for accessing the operation control device, and the like are recorded, from the manufacturer of the air conditioner in order to acquire monitoring data of the air conditioner from the operation control device.
The maintenance company accesses the operation control device by using the password recorded in the recording medium, and acquires the monitoring data from the operation control device by using the monitoring software. In the case where abnormalities are found in the operation control device when analyzing the monitoring data, the maintenance company performs remote maintenance for the operation control device.
However, timing at which an access right to the operation control device can be set for the maintenance company is limited to the time when the maintenance company purchases the recording medium. Even in the case where the maintenance company is replaced, there is a concern that the previous maintenance company may illegally access the operation control device by using the password recorded in the recording medium.
Moreover, in the case where the maintenance company continuously accesses the operation control device for a long time, there is a concern that a third party other than the service technician may access the operation control device.
Furthermore, the maintenance company cannot confirm the abnormalities that have occurred in the operation control device, until the monitoring data is analyzed. Therefore, it has been difficult to quickly deal with the abnormalities that have occurred in the operation control device.

Relay communication system and access management apparatus


A new method is provided for introducing nitrogen concentrations into oxide layers. The first embodiment of the invention teaches a NO/N.sub.2 O pre-oxidation anneal followed by a re-oxidation followed by a NO/N.sub.2 O/NH.sub.3 anneal. The second embodiment of the invention teaches the formation of a layer of sacrificial oxide, followed by a nitrogen implantation followed by the removal of the sacrificial oxide followed by the gate oxide formation followed by a NO/N.sub.2 O/NH.sub.3 anneal.

(1) Field of the Invention
The invention relates to the fabrication of integrated circuit devices, and more particularly, to a method of forming a gate oxide layer.
(2) Description of the Prior Art
In the formation of Integrated Circuits on the surface of a semiconductor substrate, a layer of silicon oxide is typically grown over the surface of a monocrystalline substrate. The formation of this layer of stoichiometric and non-stoichiometric oxide is generally well known in the art. The layer of oxide can be grown either by means of deposition or by thermal oxidation techniques. Thermal oxidation is generally preferred for areas where electrical performance is critical. In the formation of for instance MOSFET devices, a polysilicon layer is deposited over the layer of oxide and patterned to form the polysilicon gate electrode of the MOSFET device.
The creation of high quality gate oxide is of critical importance in the fabrication of semiconductor devices; gate oxide quality has a direct effect on device yield, reliability and performance. Problems such as surface roughness, layer impurity and particles can be caused by cleaning technology parameters and aspects such as concentration of the cleaning solution, chemicals used during the cleaning process, the cleaning equipment, the cleaning recipe and others. Oxidation problems can be caused by oxidation process control parameters such as time, temperature, pressure, oxidation agents or gasses used and others. Silicon wafer technology can introduce problems of initial substrate defects and impurities. Atomic flatness needs to be achieved for the surface of the substrate in order to allow the deposition of a high quality oxide layer on its surface. Well known methods are available in the art to reduce substrate micro-roughness such as the choice of the cleaning temperature, the etchant to be used and the time that is required to establish the desired substrate surface quality.
For a number of applications, such as the creation of the thin layer of tunnel oxide for Electrically Erasable Programmable Read-Only Memory (EEPROM) devices, the oxide layer is grown over heavily doped regions. These oxide layers are typically thinner (less than 100 Angstrom thick) than gate oxides (in order to readily achieve programmability of the device) and are generally considered to be of lower quality than oxides grown over lightly doped regions. The channel region of MOS devices generally is created using lightly doped regions, the gate oxide created over this region therefore tends to be of relatively high quality.
Thermally grown oxides provide good adherence between the oxide layer and the underlying silicon substrate while also providing a good mask against ion implantation used for the formation of the gate electrode source/drain regions. Irregularities in thermally grown oxide may result from irregularities on the silicon surface over which the layer of oxide is grown. Such irregularities can take on many different forms and can be classified as precipitates, dislocations, defects, contaminants, improper bonds, etc. These surface irregularities may be compounded by irregularities that occur in the created layer of oxide. The accumulation of irregularities that are further amplified during the process of the creation of the oxide layer may lead to the formation of "trap sides" where charged ions or minority carrier may accumulate.
The gate oxide forms the interface between the underlying (doped) channel regions of MOS devices and the overlying gate electrodes of the MOS transistor. Increased emphasis on smaller device dimensions leads to thinner gate oxide layers. This however places further requirements on the quality of the gate oxide layer. In the MOS transistor, the gate dielectric must support the voltage difference between the gate electrode and the substrate in an environment where ions and electrons from the gate and substrate enter the gate electrode. For very small-scale MOS devices, the effective gate length can be less than 1 micron. U.S. Pat. No. 5,464,792 teaches that, at such small gate length, electrons can be injected into the dielectric layer during periods when the transistor is switched on and off. This injection can, over time, cause a shift in the threshold voltage of the dielectric, which may effect the switching ability of the device.
Decreasing the thickness of the oxide layer leads to increasing of the electro-magnetic field that is present inside and at the boundaries of the oxide layer. This leads to the creation of hot-carriers within this field that are injected into the gate dielectric. This leads to an increase of the density of charge carriers in the interface region resulting in a shift of the electrical characteristics of the device. This leads to serious problems of deterioration of operational margins of the device. These effects are to be avoided meaning that requirements must be placed on the fabrication of the gate dielectric that result in an electrically stable interface.
From the above it is clear that functionality and reliability problems can occur in advanced Metal Oxide Semiconductor Field Effect Transistors (MOSFETs) that employ polysilicon or polycide (polysilicon/metal silicide stack) gate electrodes in contact with thin gate oxide layers. These problems are caused by the diffusion of dopant impurities and/or other impurities from the polysilicon or polycide gate electrode into and/or through the underlying thin gate oxide layer. It is, for example, known that boron and/or phosphorus dopant impurities employed in doping polysilicon can diffuse through an underlying thin gate oxide layer and diffuse into a device channel region. Fluorine impurities may also diffuse through or from the polysilicon layer of a polysilicon or polycide gate electrode and cause an apparent increase in an underlying thin gate electrode oxide layer thickness. Fluorine impurities may originate from either boron difluoride impurity doping of a polysilicon layer or from tungsten hexafluoride based CVD tungsten silicide employed in forming the upper layer of a gate electrode. This increase in thin gate oxide layer thickness may compromise the operating parameters of a MOSFET device.
From the above it is further clear the gate dielectric must not be prone to an excessive amount of charge build-up within the layer or at the dielectric to underlying substrate interface while the dielectric breakdown of the layer must be adequately high. The interface layer must exhibit good resistance to hot carrier penetration and subsequent damage while diffusion and penetration of the oxide layer by dopants and other charge carrying impurities is well understood and controlled.
U.S. Pat. No. 5,650,344 teaches that the use of re-oxidized nitride oxide material for gate oxides is a frequently applied practice. It has been shown that the use of re-oxidized nitrided gate oxides (ONO gates) provides a significant improvement in gate oxide quality with respect to gate degradation due to high field strength and radiation, further retarding boron diffusion from boron doped polysilicon gates and providing resistance against hot electrons in both p and n MOSFET devices. In addition, the high positive fixed charge at the edge of the polysilicon gates (that results from the use of ONO gates) increases the punch through voltage for p-type MOSFET.
U.S. Pat. No. 5,650,344 further teaches that these benefits have not all be derived from the use of the ONO gate but can also be attributed to the nitrogen region that forms in the substrate and in the gate oxide along their interface. The nitrogen region forms in both the substrate and in any overlying nitrided oxide material along the interface of the substrate and the overlying nitrided oxide, which may include all or part of the gate oxide. In Prior Art devices, this nitrogen region is uniform along the interface of the gate oxide and the underlying substrate and typically has nitrogen concentration levels of 10-20% by atomic weight.
U.S. Pat. No. 5,650,344 further teaches a disadvantage of the use of ONO gates and the accompanying underlying nitrogen regions. A uniform fixed-charge density region develops along the common interface and over the entire width of the gate oxide. The presence of the fixed-charge density regions under the center of the ONO gate increases electric charge scattering and thus degrades electric charge mobility between the gate oxide and the substrate.
Nitrogen concentrations must because of this effect be kept below about 4% whereby this level or slightly less of Nitrogen concentrations provides adequate protection against boron penetration from a polysilicon gate into the substrate. It is further known that a nitrogen concentration of about 10% or more is required under the periphery of the gate oxide to provide a high enough positive fixed charge density to sufficiently increase the punch-through voltage for p-type MOSFET.
Improved semiconductor devices may therefore be formed by exposing the gate electrode to a nitride environment after the polysilicon gate electrode has been formed on the surface of the substrate. The gate structure may serve as total or partial shield during this exposure, which may result in a reduction of the concentration of the re-oxidized nitrided material over the width of the gate electrode. The shielding by the gate electrode also reduces the concentration of nitride underlying the gate electrode.
FIGS. 1 through 3 shows Prior Art formation of nitrogen concentrations within an oxide layer.
FIG. 1 shows a cross section of a semiconductor substrate 10 over which a layer 12 of oxide has been deposited. The method includes oxidizing a silicon-based surface in an oxidizing atmosphere in a first temperature to form an oxidized silicon-based surface. The oxidized silicon-based surface is then heated in an inert atmosphere to a second temperature that is higher than the first temperature to anneal the oxidized silicon-based surface 14, FIG. 2. The inert atmosphere can contain NO or N.sub.2 O or NH.sub.3 and is any atmosphere that grows minimal oxide on or within a silicon-bases surface. While maintaining the second temperature, the inert atmosphere receives or is replaced with a nitrided oxide gas to form the nitrogen atmosphere. The nitride of the nitrided oxide gas penetrates the surface of the oxidized silicon-based surface and forms a concentration 16 of nitride that has accumulated at the interface between the annealed layer of oxide and the underlying substrate, FIG. 3. Thereafter, the oxidized silicon-based surface is cooled in the presence of both oxygen and the inert gas. The oxidizing atmosphere can contain, in addition with oxygen, also ozone, hydrogen, hydrogen peroxide, silicon dioxide or hydrogen and chlorine.
U.S. Pat. No. 5,851,892 (Lojek et al.) shows a post oxide N.sub.2 anneal.
U.S. Pat. No. 5,605,848 (Ngaoaram) shows a dual N I/I process for a gate oxide.
U.S. Pat. No. 5,403,786 (Hori) discloses an oxide growth, a nitriding process and an anneal for a gate oxide.
U.S. Pat. No. 5,672,521 (Barsan et al.) shows an N I/I into the substrate to grow gate oxides of different thicknesses.
U.S. Pat. No. 5,296,411 (Gardner et al.) discloses a N2 anneal for a gate oxide.
U.S. Pat. No. 5,650,344 (Ito et al.) recites a reoxidized nitrided oxide layer.
U.S. Pat. No. 5,464,792 (Tseng et al.) shows an anneal to create N buildup in an oxide layer.

Method of generating two nitrogen concentration peak profiles in gate oxide

Taiwan Semiconductor Manufacturing Company


A composite, supported microporous medium is provided which includes a fluoropolymeric microporous membrane having secured directly to at least one surface thereof a fluoropolymeric web of microfibers. A method of forming a composite, supported microporous medium is also provided which includes contacting a fluoropolymeric microporous membrane with a fluoropolymeric web of microfibers and subjecting said fluoropolymeric membrane and web of microfibers to sufficient heat and pressure to effect bonding therebetween. The composite, supported microporous medium may be employed for separation of a particulate material from a particulate-containing fluid. The composite medium also finds use in analytical procedures.

Many analytical and filtration applications that involve gaseous or liquid fluids require the use of chemically inert media which are capable of removing particles in the micron and submicron ranges. Microporous media employed for such purposes are typically relatively delicate structures which are not capable of holding a fixed shape and which are also easily damaged. For example, U.S. Pat. No. 4,431,545 describes a hydrophilic, microporous filter system having ultrafiltration capability, i.e., the ability to remove particles as fine as about 0.001 to about 10.mu.. A preferred filter medium for use in the system described in U.S. Pat. No. 4,431,545 is a thin (typically, only a few mils thick) microporous polyamide membrane. This membrane is difficult to work with because of its limited strength and its lack of internal rigidity.
Some of the most chemically inert materials available for use as microporous membranes include those polymeric materials known as Teflon.RTM.. This term represents fluorocarbon resins such as polyperfluorinated olefins formed from monomers containing 2 and 3 carbon atoms, such as polymers formed from tetrafluoroethylene (TFE), fluorinated ethylene-propylene (FEP) and copolymers thereof. It is the chemical inertness of these materials which makes them desirable for analytical and many filtration applications. In addition, polytetrafluoroethylene (PTFE) membranes provide the desirable properties, when used for analytical purposes, of generally having a white background and being translucent when wet. In the forms suitable for use as filtration or analytical media, microporous membranes of PTFE are thin, relatively delicate structures with little internal rigidity, having very low flexural moduli. That is, they do not retain their shape when unsupported, typically hanging limply in loose folds, much as a piece of thin cloth drapes when unsupported. These drawbacks create difficulties in working with such membranes. Thus, corrugating such media to increase the surface area available in a filter element or even using as simple planar filters subjects such media to easily being torn or, because of static electrical charges, to adhering to itself. The lack of commercial availability of PTFE membranes in the form of flat disks of thin, fine pored media, a highly desirable filtration material for many applications, provides an additional indication of the difficulty of handling and working with such delicate materials. Besides having a low flexural modulus and limited strength, PTFE and similar membrane materials tend to become electrostatically charged. Such a material sticks to itself and makes it difficult to maintain in a flat or planar disk form. Furthermore, because of the low flexural modulus and the difficulty in sealing PTFE membranes to support materials, such as polypropylene housings, it is difficult to manufacture filter structures which incorporate this type of membrane in such housing. For example, in biomedical applications particularly, it is frequently desirable to insert a precut flat or planar filter piece into a preformed support structure and to tightly seal the periphery of the filter piece to the support structure. Unsupported PTFE, because of its low flexural modulus, cannot be readily used in such a manner, since accurate placement becomes difficult as does sealing the membrane to the support structure.
Currently, available from Pallflex Products Corporation is a supported PTFE membrane. The PTFE membrane is mounted on an annular polyolefin or polyester frame member which serves to prevent significant flexing of the membrane. The outer and inner diameters of the frame member are 47 and 37 mm, respectively. While such an arrangement is effective for PTFE membranes of about this size, it is not particularly effective for larger PTFE membranes or for non-circular shapes.
Finding suitable materials and structures to support the flimsy films of Teflon.RTM. has presented some difficulties. Thus, because of its chemical inertness, Teflon.RTM. does not easily adhere to other materials even when heat-bonding is attempted. In addition, in certain analytical procedures, including analyses where translucent Teflon.RTM. is critical, the presence of any sort of non-Teflon.RTM. material, such as a material used as an adhesive, potentially introduces a foreign contaminant, due either to leaching or to degradation. Such contamination frequently adversely affects those media used in analysis. This tends to be particularly true when materials such as polypropylene are used.
To provide suitable strength and greater rigidity, an approach used with other polymeric membranes having similar structural and physical properties has been to incorporate a substrate, such as a fibrous web or mat, permanently into the membrane structure. This both enhances the strength and the flexural modulus of the membrane. While such internally supported membranes are more easily handled and resist tearing, which would be disastrous for a filtration material in most applications, the shortcoming of such media is their greater resistance to fluid flow. That is, such materials frequently show a several fold increase in pressure drop across a membrane compared to unsupported membranes. In addition, some of the materials used for the supporting web may contribute to a reduced chemical compatibility; that is, the medium may have insufficient chemical or physical resistance to chemical reagents, solvents and the like.
Currently, many filtration procedures are also limited by the physical properties, other than those discussed above, of the filtration media employed. For example, many of the currently used filtration media cannot be used in high temperature applications because the materials show a tendency to either pyrolyze, otherwise decompose, sinter or fuse. Were a medium to exist which overcame the aforementioned problems and could also be used in applications which require higher temperatures, the additional versatility would result in much greater commercial utility of such a medium.


Process for manufacturing a frozen aerated confection and comprising the steps 5 of                producing a premix comprising                    milk/dairy or vegetable fat 1 to 15% (w/w), preferably 3 to 12%            milk solids non fat 0 to 20% (w/w), preferably 3 to 12%            sugar and other sweeteners 0.01 to 35% (w/w)            vegetable proteins 0 to 5% (w/w)            flavors 0 to 5% (w/w)            water 30 to 85% (w/w)            0.25 to 15% by weight (expressed as dry plasma over the wet premix) of an enriched plasma fraction is added to the premixfreezing and aerating the premix to an overrun of 20 to 150%.

It is known that the presence of a fine microstructure is critical to produce an ice cream that has a creamy texture and has good meltdown properties.
However the microstructure produced in a conventional ice cream freezer (e.g. a scraped surface heat exchanger) has been found to be unstable and both ice crystals and gas bubbles coarsen significantly in the time taken to harden the product to typical storage temperatures of −25 C. An important step to maintain the desired microstructure is to stabilise the gas bubbles during hardening. This is achieved by generating a partial network of fat aggregates adsorbed onto the air interface to provide a steric barrier to gas cell coalescence. To generate this fat network, a proportion of the oil droplets need to partially coalesce as a consequence of the shear regime encountered within the ice cream freezer. In order to control this process of fat destabilisation, so called destabilising emulsifiers are often used to displace milk protein at the oil:water interface and generate higher levels of fat destabilisation. Thus, the presence of a destabilised fat network prevents excessive gas bubble coarsening and helps maintain the desired fine microstructure.
Up to now, this has been achieved by using chemical products which are more and more perceived by consumers as being negative and/or detrimental to the environment or to human health. There is therefore a need for finding and using destabilising emulsifiers which could be used with an "all natural" composition.
It has now been found that such destabilising emulsifiers exist in eggs and can be extracted by centrifugation.

Frozen aerated confection and its manufacturing process


A photovoltaic device includes: a p-type diffusion layer (11) and a n-type diffusion layer (12) on a back face of a semiconductor substrate (1); electrodes (4 to 6); and a wiring board (8). The electrodes (4, 6) are disposed on the p-type diffusion layer (11), and the electrodes (5) are disposed on the n-type diffusion layer (12). The wiring board (8) has wires (82) connected to the electrodes (4, 6) by conductive adhesive layers (7) and wires (83) connected to the electrodes (5) by the conductive adhesive layers (7). The electrodes (6) are disposed, on both ends of the n-type diffusion layer (12) with respect to the x-axis direction, between an end region of the n-type diffusion layer (12) and an edge of the semiconductor substrate (1).

PCT International Application Publication No. WO2016/132902 discloses a back-contact solar cell as a photovoltaic device. The photovoltaic device includes a photovoltaic element, a wiring sheet, a first semiconductor film disposed on a first face of a semiconductor substrate, a second semiconductor film disposed on the first face of the semiconductor substrate, a first electrode disposed on the first semiconductor film, and a second electrode disposed on the second semiconductor film. The first electrode surrounds the second electrode with a distance between the first electrode and the second electrode. The wiring sheet has a first wire connected electrically to the first electrode and a second wire connected electrically to the second electrode.

Photovoltaic device, solar cell string of photovoltaic devices, and solar cell module including either photovoltaic device or solar cell string


A portable stop determining device 10 includes an acceleration sensor 115 and a state grasp unit 143 in order to detect that a vehicle such as a train stops, with an adequate degree of accuracy, even when position information of a user and time information are not available. The state grasp unit 143 outputs an alarm signal when detecting deceleration in a direction of travel of the vehicle based on a measured value from the acceleration sensor, and detecting that posture of the portable stop determining device carried by a person riding on the vehicle inclines in the direction of travel and then returns to a basic state.

Services of notifying, based on position information and/or time information, that a vehicle such as a train or a bus arrives at a destination are being provided. For example, in one of such services being provided, a current position of a user is acquired by using a global positioning system (GPS) sensor of a smartphone carried by the user. When the smartphone enters a vicinity of a destination specified by the user, the user is notified that the smartphone is approaching the destination. Herein, the vicinity of the destination refers to an area, for example, within a "radius of 100 meters" from the destination. Further, in another of such services, when a vehicle such as a train or a bus for which a timetable is provided is used, the current time is compared with a scheduled arrival time, and a user is notified, several minutes ahead of the time of arrival, that the vehicle will arrive in several minutes.
PTL 1 discloses a program for preventing a user from missing his/her stop on a train or the like by using position information of the user.

Portable stop determining device, stop determining system, and stop determining method


An optical module includes a substrate, an optical device including a surface-emitting or -receiving element mounted on a surface of the substrate with a light-emitting or -receiving portion, an optical fiber disposed parallel to the surface of the substrate and in a longitudinal direction of the substrate, a damming member provided between the optical device and the substrate to extend in a width direction of the substrate and dividing a gap between the optical device and the substrate in the longitudinal direction of the substrate into a first portion and a second portion, and a mirror provided at one side surface of the damming member a tip of the optical fiber. The first portion provided on an opposite side to the optical fiber is filled with an underfill resin, and the second portion provided on a side close to the optical fiber is filled with an optical fiber fixing resin.

1. Field of the Invention
The present invention relates to an optical module using an optical device comprising a surface-emitting element or a surface-receiving element. It also relates to a method for producing the optical module.
2. Description of the Related Art
In an optical module using an optical device comprising a surface-emitting element or a surface-receiving element, when the optical device is mounted on a substrate, an optical axis of the optical device is perpendicular to a surface of the substrate. Therefore, in order to optically connect an optical fiber disposed parallel to the surface of the substrate and the optical device together, a mirror is used to rotate the optical axis through 90 degrees.
As this type of optical module, there is conventionally known one in which the optical fiber and the optical device are optically connected together via an optical waveguide with a mirror formed by forming the optical waveguide on the substrate, and forming in the optical waveguide the mirror inclined at 45 degrees to the surface of the substrate (see e.g. JP-A-2010-10254 listed below).
Refer to JP-A-2010-10254, JP-A-2008-122721, JP-A-2009-145817, JP-A-2006-292852, and JP-A-2003-14946, for example.

This patent is subject to a terminal disclaimer.

Optical module and method for producing the same


By hot pressing a cold rolled xcex2 type titanium alloy which has not been subjected to solution heat treatment into a predetermined shape, it is possible to obtain a part with a cold rolled metallurgical texture in its approximately central portion in the thickness direction, and a solution heat treatment metallurgical texture in its other portions, and a golf club head is manufactured using this part as a face member.

1. Field of the Invention
The present invention relates to a golf club head and a method of manufacturing the same, and more specifically, it relates to a golf club head which can provide high durability and an excellent feel on striking the ball (the feeling on impact with the ball), and a method of manufacturing the same.
This application is based on Patent Application No. 2000-32602, filed in Japan, the contents of which are incorporated herein by reference.
2. Description of the Related Art
Hitherto, golf club heads using face members made by pressing a xcex2 type titanium alloy which has been subjected to solution heat treatment have been known.
However, in such prior art golf club heads, in terms of the material properties, the face portion has elasticity, but does not have sufficient strength, which is somewhat disadvantageous from the viewpoint of durability.
Further, golf club heads provided with face members which are made by cold pressing a cold rolled xcex2 type titanium alloy which has not been subjected to solution heat treatment are also known. Compared to the above-mentioned golf club heads which are provided with face members which have been subjected to solution heat treatment, the face portions of these golf club heads have higher strength, but since they are not solution heat treated, there is a large amount of residual stress in the interior of the metal, and because their elasticity is also small, there are the disadvantages that the face portion is easily cracked, the feel on striking the ball is stiff, and a good feel on striking the ball cannot be obtained.
The present invention was made in order to overcome these disadvantages, and it is an object of the present invention to provide a golf club head with increased strength and at the same time, improved durability, and which can further provide a good feel on striking the ball.
In order to achieve the above goals, the present invention employs a method wherein parts formed into a predetermined shape by hot pressing a cold rolled xcex2 type titanium alloy which has not been subjected to solution heat treatment are used for at least the face member. As a result of using this method, it is possible to obtain approximately the same degree of strength as for a golf club head made of a cold pressed xcex2 type titanium alloy which has not been subjected to solution heat treatment, with a surface which does not easily crack, with greatly improved durability, and which also has a mild feel on striking the ball.
According to the present invention, the durability, of the face member is increased, and therefore, it becomes possible to make the face member thinner. When making the face member thinner, the remaining weight can be placed around the periphery or on the sole of the head, and the head can be designed so that the moment of inertia can be increased, and/or the center of gravity can be made lower and/or deeper, and as a result of these effects, further increases in the flight distance and the directional stability can be expected.

Golf club head and method of manufacturing the same


Apparatus and methods are disclosed for wireless communications using a hearing aid, or other suitable receiver. According to one embodiment, a mobile phone device comprises an LCD display having a substantially planar top viewing surface, a transmitter for outputting an electromagnetic signal to an inductively-coupled hearing aid telecoil receiver, and a layer of austenitic stainless steel forming a support frame for the LCD display. A portion of the transmitter and the layer of austenitic stainless steel are positioned underneath the LCD display, thus providing a compact mobile phone design with negligible impact, or even improvement, of the output electromagnetic signal.

The Federal Communications Commission (FCC) initiated work on developing standards for compatibility between wireless communications devices and hearing aids in 1995. An early standard, ANSI C63.19-2001, entitled "American National Standard for Methods of Measurement of Compatibility between Wireless Communications Devices and Hearing Aids," was published by an FCC committee in 2001, and several versions have followed.
The ANSI C63.19 standards apply to both wireless communications devices and hearing aids, and set forth standardized methods for measurement and parametric requirements for ensuring operational compatibility and accessibility of hearing aids used with wireless communications devices, including cordless, cellular, personal communications service (PCS), and Voice over Internet Protocol (VoIP) phones, operating in frequency bands ranging from 800 MHz to 3 GHz.
In particular, the standards describe operating parameters for hearing aids operating in either an acoustic coupling mode or a telecoil (T-Coil) coupling mode mode. The standards includes techniques for measuring the following for wireless communications devices: RF electric-field emissions, RF magnetic-field emissions, T-coil mode magnetic-signal strength in the audio band, T-coil mode magnetic-signal frequency response through the audio band, and T-coil mode magnetic-signal and noise articulation index.
Electromagnetic emissions from wireless communication devices can interfere with hearing aid reception of a telecoil signal. A telecoil signal is typically transmitted via inductive coupling from a loop transmitter or a speaker to a telecoil (T-coil) designed to receive such inductive signals in an audio frequency band (e.g., a frequency band ranging from 300 to 3400 Hz). The standards also provide tests that can be used to assess the electromagnetic characteristics of hearing aids and wireless communications devices.
In telecoil mode, a hearing aid or other device detects a varying magnetic-field emitted by a speaker coil or specialized telecoil transmitter coupled to a wireless communications device. Using inductive coupling to transmit a signal is in contrast to earlier hearing aid devices, which simply amplify a received acoustic signal. Hearing aids operating in acoustic mode have performance issues, especially when operating in loud, crowded environments. Some hearing aids are able to operate in both an acoustic coupling mode and a T-coil mode, where the mode used is selected by a user (e.g., by pressing a switch or button on the hearing aid) or selected automatically (by detection of a suitable signal with a T-coil). By using a T-coil receiver, reception issues associated with amplifying an acoustic signal received using a microphone (e.g., audio feedback) can be minimized or avoided.
Several parameters can vary the amount of current, signal quality, and transmission distance achieved using a T-coil transmitter. For example, length of the coil, diameter of the coil, and the number of windings affect these performance parameters. For designs incorporating a speaker voice coil as the T-coil transmitter, aspects of the design of the nearby speaker magnet (e.g., magnet geometry or iron content) impact the shielding of the T-coil transmitter by the speaker magnet. In addition, the distance between a T-coil transmitter and receiver, as well as interference from nearby electrical systems (e.g., noise from internal signals in a smartphone or transmitted signals in an RF band, such as TDMA or GSM bands), also have an effect on the intensity and quality of the received electromagnetic field strength.
FIGS. 1A and 1B are a top view 100 and side view 130 of a wireless communication device (a cell phone 102) indicating various locations of telecoil receivers during experimental testing according to the ANSI C63.19-2007 standard. The cell phone 102 includes a liquid crystal display (LCD) 105, a microphone 109, and several holes in the cell phone housing that form an acoustic speaker port 108. An ear coupling cup 109 surrounds the speaker port 108. Not visible inside the housing of the cell phone 102 are a speaker 110 and a telecoil transmitter 112, whose locations are indicated by dashed circles. Magnetic field intensity (H-field) measurements are made by a telecoil receiver at the measurement reference point 120 indicated by an "x." Also shown are several test positions for a telecoil receiver, including an axial position 122, and two radial test positions 124 and 125. A telecoil receiver axis 140 used while the telecoil is in the radial test positions 124 and 125 is also shown. The measurement reference point 120 is at the intersection of a reference plane 142, which is located 10 mm above an outermost portion of the ear coupling cup 109 and the telecoil receiver axis 140. Notably, the telecoil transmitter 112 is placed at a distance above the LCD 105, in order to avoid the LCD from interfering with the inductive signal transmitted by the transmitter along the telecoil receiver axis 140.
FIGS. 2A and 2B are charts 200 and 250 that show the telecoil frequency response specified by ANSI C63.19-2007. The chart 200 in FIG. 2A is for wireless devices having a field strength attenuation of less than −15 dB A/m at 1 kHz. The X-axis is a log scale axis, showing frequency response over a range from 100 Hz to 10 kHz. The Y-axis indicates the magnetic field frequency response, in dB relative to the value at 1 kHz, ranging from −20 to +20 dB. A series of line segments 210 indicates the upper bound of the acceptable range, and the second series of line segments 211 indicates the lower bound of the acceptable range. Thus, the field intensity of the desired signal is measured at the center of an audio band (1 kHz), and subsequent measurements of the received field intensity are desirably located within the upper and lower bounds indicated across an audio band of 300 to 3400 Hz.
Similarly, FIG. 2B is a chart 250 of the frequency response specified by ANSI C63.19 for wireless devices having a field strength attenuation of greater than −15 dB A/m at 1 kHz. As shown, a first series of line segments 260 indicates the upper bound of the acceptable region, and a second series of line segments 261 indicates the lower bound of the acceptable region. The scales of the X- and Y-axes are the same as those in FIG. 2A. Similarly as in FIG. 2A, the field intensity of the desired signal is measured at the center of an audio band (1 kHz), and subsequent measurements of the received field intensity are desirably located within the upper and lower bounds indicated across an audio band of 300 through 3400 Hz.
FIGS. 3A and 3B are charts 300 and 350 for the cellphone 102 shown in FIGS. 1A and 1B. The measured magnetic field strength is plotted along the Y-axis over the corresponding applied transducer voltage, which is shown along the X-axis. The chart 300 in FIG. 3A indicates measured magnetic field strength for a telecoil receiver oriented in a radial position as shown in FIGS. 1A-1B. A line 310 indicates the minimum measured field strength as defined by the HAC ANSI C63.19-2007 specification. As shown, a line 320 corresponds to a telecoil receiver in a radial position (e.g., at radial position 124) at a distance of 11 mm from the reference plane 142. A line 321 corresponds to a radially-positioned telecoil at a distance of 13 mm. Finally, a line 322 corresponds a radially-positioned telecoil at a distance of 13 mm. As shown, the measured magnetic field strength decreases as the distance between the telecoil receiver and the telecoil transmitter 112 increases.
The chart 350 in FIG. 3B indicates a measured magnetic field strength for a telecoil receiver oriented in an axial position 122 as shown in FIGS. 1A-1B. A line 360 indicates the minimum measured field strength as defined by the HAC ANSI C63.19-2007 specification. As shown, a line 370 corresponds to a telecoil receiver in an axial position 122 at a distance of 11 mm from the reference plane 142. A line 371 corresponds to a radially-positioned telecoil at a distance of 13 mm. Finally, a line 372 corresponds a radially-positioned telecoil at a distance of 13 mm. As shown, the measured magnetic field strength decreases as the distance between the axial-positioned telecoil receiver and the telecoil transmitter 112 increases.
As wireless communications device form factors shrink and the number of features and functions incorporated in these devices increases, developing wireless devices that deliver a desired form factor and functionality while also complying with hearing aid compatibility standards is increasingly difficult. Therefore, there exists ample opportunity for improvement in technologies to realize wireless devices having desirable form factors, functionality, and HAC compatibility.

Hearing aid-compatible apparatus for wireless communication devices


A primary object of the present invention is to extract a difference in shading of a blood vessel image in a picked up image as information to be used for authentication, and to acquire a larger number of pieces of biometric information from one image. An individual authentication device to be used to authenticate an individual using feature information of a vascular pattern acquired from a living body includes an imaging unit that images a region of the living body serving as an object of authentication, and an arithmetic unit that acquires the picked up image as an authentication image. The arithmetic unit extracts a vascular pattern from the authentication image, and acquires a degree of shading of the vascular pattern as the feature information.

(1) Field of the Invention
The present invention relates to a device and method for identifying an individual by utilizing biometric information on a human being, or more particularly, a finger vein pattern.
(2) Description of the Related Art
While an interest in a security technology for safely managing personal information and property has grown, biometrics authentication that uses biometric information on a human being has attracted attention. As an existing biometrics authentication technology, an authentication method that employs a fingerprint, the iris, voice, a face, a vein in the palm, or a finger vein is known. In particular, a vein authentication technology that utilizes absorption of infrared light, which is irradiated to a living body, by hemoglobin in blood has the advantage of a low psychological resistance owing to the capability to achieve authentication merely by irradiating light to a finger, and the advantage of excellent forgery-proof performance due to utilization of internal information on a living body.
Vein authentication is expected to be applied to various fields. In the field of management of people who join or leave a company or management of employees on whether they work hard or not, there is an increasing need for large-scale 1-to-N authentication involving plural sites. In a financial field, for example, usage in empty-handed settlement allowing a user to do shopping merely by placing a finger without the necessity of presenting any card is attracting attention. In this kind of usage, it is necessary to accurately discriminate several ten thousands to several millions of users from one another. High precision exceeding the level of precision guaranteed by existing finger vein authentication is requested.
Japanese Patent Application Laid-Open Publication No. 2010-35560 has disclosed a method for, compared with a case where one finger is required, improving precision in authentication by increasing the number of fingers employed in authentication. Japanese Patent Application Laid-Open Publication No. 2010-39534 has disclosed that a three-dimensional structure of a blood vessel appearing in an image picked up by plural lenses is used for authentication.

Biometrics authentication device and method


The present disclosure provides a display panel and a driving method thereof, and a display apparatus. The display panel includes: a plurality of sub-pixels arranged in an array, a plurality of data lines, and a plurality of compensation detection lines, wherein each data line is coupled with sub-pixels in one column; sub-pixels in every three columns serve as one first sub-pixel group, and each first sub-pixel group corresponds to two compensation detection lines which include a first detection line and a second detection line; and in each first sub-pixel group, sub-pixels in the first column are coupled with the first detection line, sub-pixels in the third column are coupled with the second detection line, and sub-pixels in the second column are alternatively coupled with the first detection line and the second detection line.

An Organic Light Emitting Diode (OLED) display has the advantages of light self-emission, low energy consumption and the like, and is one of hot spots in the field of application research of a display panel at present.
Currently, the OLED display generally belongs to a current driven type, a stable current is required for driving the OLED display to emit light, and in the OLED display, a pixel circuit is adopted to drive OLEDs to emit light. However, as service time is increased, a drive transistor in the pixel circuit may generate cases of aging and the like, resulting in drift of a threshold voltage and mobility of the drive transistor, so that a display brightness difference can be caused.

Display panel and driving method thereof, and display apparatus

Hefei Xinsheng Optoelectronics Technology Co., Ltd


The present invention provides a conjugate containing a therapeutic agent linked to a homing molecule that selectively homes to tumor vasculature and selectively binds collagen such as non-helical collagen or collagen IV. In one embodiment, the conjugate contains a homing peptide or peptidomimetic that includes the amino acid sequence CREKA (SEQ ID NO: 1) or a conservative variant or peptidomimetic thereof.

1. Field of the Invention
The present invention relates generally to the fields of molecular medicine and cancer biology and, more specifically, to collagen-binding molecules that selectively home to tumor vasculature.
2. Background Information
A major hurdle to advances in treating cancer is the relative lack of agents that can selectively target the cancer while sparing normal tissue. For example, radiation therapy and surgery, which generally are localized treatments, can cause substantial damage to normal tissue in the treatment field, resulting in scarring and loss of normal tissue. Chemotherapy, in comparison, which generally is administered systemically, can cause substantial damage to organs such as the bone marrow, mucosae, skin and small intestine, which undergo rapid cell turnover and continuous cell division. As a result, undesirable side effects such as nausea, loss of hair and drop in blood cell count often occur when a cancer patient is treated intravenously with a chemotherapeutic drug. Such undesirable side effects can limit the amount of a drug that can be safely administered, thereby hampering survival rate and impacting the quality of patient life.
Thus, there is a need for new therapeutic strategies for selectively targeting tumors and reducing the side effects associated with systemic therapy. The present invention satisfies this need by providing molecules that selectively home to tumor vasculature and which are suitable for selectively targeting chemotherapeutic drugs, gene therapy vectors or other agents to the tumor vasculature. Related advantages also are provided.

Collagen-binding molecules that selectively home to tumor vasculature and methods of using same


The present disclosure is generally directed to a lens clip that defines at least one mounting surface for coupling to and supporting an array of optical components, e.g., a laser diode and associated components, and an optical lens slot to receive and securely hold an array of optical lenses at a predetermined position relative to the optical components to ensure nominal optical coupling. The optical lens slot includes dimensions that permit insertion of each optical lens into the same and restrict travel along one or more axis. Accordingly, disposing an optical lens within the lens slot ensures correct alignment along at least two axis, e.g., Z and X, with the third axis (e.g., Y) extending parallel along the slot to permit lateral adjustment of each lens.

Optical transceivers are used to transmit and receive optical signals for various applications including, without limitation, internet data center, cable TV broadband, and fiber to the home (FTTH) applications. Optical transceivers provide higher speeds and bandwidth over longer distances, for example, as compared to transmission over copper cables. The desire to provide higher transmit/receive speeds in increasingly space-constrained optical transceiver modules has presented challenges, for instance, with respect to establishing and maintaining proper orientation and alignment of optical components during manufacturing.
Optical transceiver modules generally include one or more transmitter optical subassemblies (TOSAs) for transmitting optical signals. TOSAs can include one or more lasers to emit one or more channel wavelengths and associated passive and/or active supporting components. Such supporting components include, for example, laser diode drivers (LDDs), focusing lenses, and multiplexing devices (e.g., arrayed waveguide grating (AWG)). Each component may be securely attached to a housing/substrate at predefined positions relative to each other to assemble a TOSA. For instance, components such as a laser diode and AWG may be die bonded adjacent one or more laser diodes. On the other hand, components such as focusing lenses may be attached using adhesives such as UV-curing optical adhesives. However, such adhesives can cause misalignment of components, which is known as post-annealing shift, which results from the structural changes to an adhesive as it cures/hardens. Also, in the context of multi-channel optical subassemblies, a plurality of focus lenses can be utilized. This can require keeping each focus lens within a relatively narrow tolerance that ensures nominal optical power. During active alignment, this can require multiple iterations of shifting focus lens position/orientation and then re-testing.

Lens clip for coupling and optical alignment of an optical lens array and an optical subassembly module implementing same


According to an exemplary embodiment of the invention, a system for simultaneous longitudinal shifting of several selected seats or seat rows in an aircraft is stated, in which system a drive device for shifting the seats is provided, wherein shifting the seats takes place according to a change in seat configuration planning.

An aircraft has a particular seat configuration or seat layout that is to be considered as being fixed and that is divided into 1, 2 or 3 classes.
Any reconfiguration involves rearranging this layout, for example in order to have more seats of a particular class available or in order to create more useable cabin space. The classes can differ from each other by various types of seats, or merely by their seat pitch.
If a flight is only partly booked it is still not possible to offer passengers greater comfort in the form of more space. Nor is it possible to implement short-term adaptation to the percentage distribution of the classes depending on passenger numbers. Likewise, at present it is not possible to implement a short-term adaptation to greater seating comfort in line with passenger's readiness to pay more.

Variable seat separation adjustment in an airplane


A method of testing optical fibers includes: providing at least two optical fibers; transmitting a light at a first end of the at least two optical fibers; measuring a light transmission time for each of the at least two optical fibers; determining a difference in the light transmission times for the at least two optical fibers; and determining whether the difference in light transmission times is above a predetermined value.

The present invention relates generally to optical fibers and, more specifically, to the testing of skew in optical fibers.
Data, such as Voice Data, Image Data or the like are typically handled using computers that transfer the relevant information in a digitized form through electric cables, fiber optic cables, radio frequency transmission or the like. Increasing demand for digitally transferred information has driven research in the area of fiber optics. Throughput of digital data in optical fibers depends on the speed of the signal, the number of signals that can be simultaneously transferred using different wavelengths (i.e., the bandwidth), and the frequency of the individual signals. Since optical fibers use light pulses to form digital signals, the signal speed is already at a maximum (i.e., the speed of light). While the transmission of multiple simultaneous signals having different wavelengths through a single optical fiber is possible, the high cost of light emitters capable of sending out such signals currently makes this approach uneconomical. Accordingly, digital data throughput in optical fibers has been increased by increasing the frequency of individual signals.
However, as signal frequency increases, errors caused by the skew in fiber optic cables has become a concern. In fiber optic cables including at least two optical fibers, differences in light transmission times between individual optical fibers, also referred to as skew, can occur. For computers having sufficiently fast processing speeds, skew can result in errors in the interpretation of transmitted digital data.
In an attempt to prevent excessive skew in fiber optic cables, it is common to select individual optical fibers having a desired light transmission time and to bundle the appropriate optical fibers together to form a fiber optic cable. Unfortunately, this method of forming fiber optic cables has the drawback that skew can be introduced into the fiber optic cable during the process of assembling the individual optical fibers into a fiber optic cable. Thus, even when starting with individual optical fibers having acceptable light transmission times, the resulting fiber optic cable can have excessive skew, i.e., can have optical fibers which exhibit too great a difference in their respective light transmission times. Another drawback is the manufacturing inefficiency resulting from having to select each individual optical fiber for use in a single fiber optic cable prior to assembling the fiber optic cable.
What is needed, but is not provided by the conventional art, is a method of testing and adjusting the skew of a fiber optic cable, or a group of optical fibers, that allows greater manufacturing efficiency when producing fiber optic cables.
Briefly stated, one embodiment of the present invention is directed to a method of testing optical fibers. The method includes: providing at least two optical fibers; transmitting a light at a first end of the at least two optical fibers; measuring a light transmission time for each of the at least two optical fibers; determining a difference in the light transmission times for the at least two optical fibers; determining whether the difference in light transmission times is above a predetermined value; and if the difference in the light transmission times is above the predetermined value, adjusting an amount of optical material forming at least one of the at least two optical fibers to reduce the difference in the light transmission times.
Another embodiment of the present invention is directed to a method of testing a fiber optic cable. The method includes: providing a fiber optic cable having a first and second end, the fiber optic cable including at least two optical fibers; transmitting light at the first end of the fiber optic cable; measuring the light transmission time for the light to travel through each of the at least two optical fibers of the fiber optic cable; determining the difference in the light transmission times for the at least two optical fibers of the fiber optic cable; and determining whether the difference in the light transmission times is above a predetermined value.


The beta crystalline modification of 2,2',2"-nitrilo[triethyl-tris-(3,3',5,5'-tetra-tert-butyl-1,1'-biphenyl-2, 2'-diyl) phosphite] is obtained by crystallizing said compound from the melt at elevated temperatures.. The beta crystalline form is an effective process stabilizer for polyolefins, particularly polypropylene.

2,2',2"-Nitrilo[triethyl-tris-(3,3',5,5'-tetra-tert-butyl-1,1'-biphenyl-2,2 '-diyl) phosphite] is a compound having the formula I ##STR1##
This compound of formula I is useful as a processing stabilizer for organic polymers as taught in U.S. Pat. Nos. 4,318,845 and 4,374,219. The compound of formula I is disclosed as being a white powder melting at 121.degree.-134.degree. C. As such, the powdery product has defects in terms of handling and apparent density, and exhibiting poor flowability, diffusibility into polymers, meterability, storage stability and hydrolytic stability.
It has now been found that the compound of formula I can be obtained in a different crystalline modification as purified crystalline particles which exhibit acceptable properties in respect to handling, apparent density, flowability, meterability, storage stability, hydrolytic stability and better migration into polymeric substrates.
The new beta modification is characterized by a triclinic crystalline form, melting in the range of 200.degree.-207.degree. C. as given by the peak temperature of the endotherm recorded by differential scanning calorimetry (DSC); and by an X-ray diffraction pattern obtained using Cu-K.alpha. which exhibits diffraction angles (2.THETA.) of very high intensity at 8.4 and 17; lines of high intensity at 9.9, 10.6, 11.4, 17.5, 19.1, 20.2; lines of medium intensity at 4.6, 4.9, 7.1, 12.7, 13.2, 13.6, 15.3, 15.8, 16.4, 16.7, 18.4, 19.7, 21.7, 23.4; and lines of weak intensity at 7.8, 8.8, 9.4, 12, 14.1, 14.6, 21, 22.3, 22.8, 23.9, 24.7, 25.3, 25.5, 26.4, 27.27.7, 28.4 and a relative absolute configuration of the three stereo axes of the dibenzo[d,f][1,3,2]dloxaphosphepin rings of R*,R*,S*.
R* and S* follow the customary convention when the absolute configuration of a molecule is unknown. The nomenclature adopted here is based on recent Chemical Abstracts Service practice as described by L. C. Cross and W. Kylne, Pure Appl. Chem. 45, 11-30 (1976).
The instant invention also relates to processes for the preparation of this novel beta crystalline modification of the compound of formula I.
The instant invention also pertains to a composition stabilized against thermal, oxidative and actinic induced degradation which comprises
(a) an organic material subject to thermal, oxidative or actinic induced degradation, and
(b) an effective stabilizing mount of the beta, triclinic crystalline form of 2,2',2"-nitrilo[triethyl-tris-(3,3',5,5'-tetra-tert-butyl-1,1'-biphenyl-2, 2'-diyl) phosphite], characterized by melting in the range of 200.degree.-207.degree. C. and by an X-ray diffraction pattern exhibiting lines of very high intensity at 8.4 and 17; lines of high intensity at 9.9, 10.6, 11.4, 17.5, 19.1, 20.2; lines of medium intensity at4.6, 4.9, 7.1, 12.7, 13.2, 13.6, 15.3, 15.8, 16.4, 16.7, 18.4, 19.7, 21.7, 23.4; and lines of weak intensity at 7.8, 8.8, 9.4, 12, 14.1, 14.6, 21, 22.3, 22.8, 23.9, 24.7, 25.3, 25.5, 26.4, 27.27.7, 28.4 and a relative absolute configuration of the three stereo axes of the dibenzo[d,f][1,3,2]dioxaphosphepin rings of R*,R*,S*.
The organic material is preferably a polymer processed at elevated temperatures. Particularly preferred organic polymers are the polyolefins, especially polypropylene and polyethylene, and polyamides. Most particularly the organic polymer is polypropylene.
The compounds of this invention are very effective processing stabilizers for polyolefins than the prior art compounds both in preventing molecular weight changes as well as preventing discoloration.
In general polymers which can be stabilized include
1. Polymers of monoolefins and diolefins, for example polypropylene, polyisobutylene, polybut-1-ene, poly-4-methylpent-1-ene, polyisoprene or polybutadiene, as well as polymers of cycloolefins, for instance of cyclopentene or norbornene, polyethylene (which optionally can be crosslinked), for example high density polyethylene (HI)PE), low density polyethylene (LDPE), linear low density polyethylene (LLDPE), branched low density polyethylene (BLDPE). PA0 Polyolefins, i.e. the polymers of monoolefins exemplified in the preceding paragraph, preferably polyethylene and polypropylene, can be prepared by different, and especially by the following, methods: PA0 a) radical polymerisation (normally under high pressure and at elevated temperature). PA0 b) catalytic polymerisation using a catalyst that normally contains one or more than one metal of groups IVb, Vb, VIb or VIII of the Periodic Table. These metals usually have one or more than one ligand, typically oxides, halides, alcoholates, esters, ethers, amines, alkyls, alkenyls and/or aryls that may be either .pi.- or .sigma.-coordinated. These metal complexes may be in the free form or fixed on substrates, typically on activated magnesium chloride, titanium(III) chloride, alumina or silicon oxide. These catalysts may be soluble or insoluble in the polymerisation medium. The catalysts can be used by themselves in the polymerisation or further activators may be used, typically metal alkyls, metal hydrides, metal alkyl halides, metal alkyl oxides or metal alkyloxanes, said metals being elements of groups la, Ha and/or IIIa of the Periodic Table. The activators may be modified conveniently with further ester, ether, mine or silyl ether groups. These catalyst systems are usually termed Phillips, Standard Oil Indiana, Ziegler (-Natta), TNZ (DuPont), metallocene or single site catalysts (SSC). PA0 2. Mixtures of the polymers mentioned under 1), for example mixtures of polypropylene with polyisobutylene, polypropylene with polyethylene (for example PP/HDPE, PP/LDPE) and mixtures of different types of polyethylene (for example LDPE/HDPE). PA0 3. Copolymers of monoolefins and diolefins with each other or with other vinyl monomers, for example ethylene/propylene copolymers, linear low density polyethylene (LLDPE) and mixtures thereof with low density polyethylene (LDPE), propylene/but-1-ene copolymers, propylene/isobutylene copolymers, ethylene/but-1-ene copolymers, ethylene/hexene copolymers, ethylene/methylpentene copolymers, ethylene/heptene copolymers, ethylene/octene copolymers, propylene/butadiene copolymers, isobutylene/isoprene copolymers, ethylene/alkyl acrylate copolymers, ethylene/alkyl methacrylate copolymers, ethylene/vinyl acetate copolymers and their copolymers with carbon monoxide or ethylene/acrylic acid copolymers and their salts (ionomers) as well as terpolymers of ethylene with propylene and a diene such as hexadiene, dicyclopentadiene or ethylidene-norbornene; and mixtures of such copolymers with one another and with polymers mentioned in 1 ) above, for example polypropylene/ethylene-propylene copolymers, LDPE/ethylene-vinyl acetate copolymers (EVA), LDPE/ethylene-acrylic acid copolymers (EAA), LLDPE/EVA, LLDPE/EAA and alternating or random polyalkylene/carbon monoxide copolymers and mixtures thereof with other polymers, for example polyamides. PA0 4. Hydrocarbon resins (for example C.sub.5 -C.sub.9) including hydrogenated modifications thereof (e.g. tackdriers) and mixtures of polyalkylenes and starch. PA0 5. Polystyrene, poly(p-methylstyrene), poly(.alpha.-methylstyrene). PA0 6. Copolymers of styrene or .alpha.-methylstyrene with dienes or acrylic derivatives, for example styrene/butadiene, styrene/acrylonitrile, styrene/alkyl methacrylate, styrene/butadiene/alkyl acrylate, styrenefoutadiene/alkyl methacrylate, styrene/maleic anhydride, styrene/acrylonitrile/methyl acrylate; mixtures of high impact strength of styrene copolymers and another polymer, for example a polyacrylate, a diene polymer or an ethylene/propylene/diene terpolymer, and block copolymers of styrene such as styrene/butadiene/styrene, styrene/isoprene/styrene, styrene/ethylene/butylene/styrene or styrene/ethylene/propylene/styrene. PA0 7. Graft copolymers of styrene or .alpha.-methylstyrene, for example styrene on polybutadiene, styrene on polybutadiene-styrene or polybutadiene-acrylonitrile copolymers; styrene and acrylonitrile (or methacrylonitrile) on polybutadiene; styrene, acrylonitrile and methyl methacrylate on polybutadiene; styrene and maleic anhydride on polybutadiene; styrene, acrylonitrile and maleic anhydride or maleimide on polybutadiene; styrene and maleimide on polybutadiene; styrene and alkyl acrylates or methacrylates on polybutadiene; styrene and acrylonitrile on ethylene/propylene/diene terpolymers; styrene and acrylonitrile on polyalkyl acrylates or polyalkyl methacrylates, styrene and acrylonitrile on acrylate/butadiene copolymers, as well as mixtures thereof with the copolymers listed under 6), for example the copolymer mixtures known as ABS, MBS, ASA or AES polymers. PA0 8. Halogen-containing polymers such as polychloroprene, chlorinated rubbers, chlorinated or sulfochlorinated polyethylene, copolymers of ethylene and chlorinated ethylene, epichlorohydrin homo- and copolymers, especially polymers of halogen-containing vinyl compounds, for example polyvinyl chloride, polyvinylidene chloride, polyvinyl fluoride, polyvinylidene fluoride, as well as copolymers thereof such as vinyl chloride/vinylidene chloride, vinyl chloride/vinyl acetate or vinylidene chloride/vinyl acetate copolymers. PA0 9. Polymers derived from .alpha.,.beta.-unsaturated acids and derivatives thereof such as polyacrylates and polymethacrylates; polymethyl methacrylates, polyacrylamides and polyacrylonitriles, impact-modified with butyl acrylate. PA0 10. Copolymers of the monomers mentioned under 9) with each other or with other unsaturated monomers, for example acrylonitrile/butadiene copolymers, acrylonitrile/alkyl acrylate copolymers, acrylonitrile/alkoxyalkyl acrylate or acrylonitrile/vinyl halide copolymers or acrylonitrile/alkyl methacrylate/butadiene terpolymers. PA0 11. Polymers derived from unsaturated alcohols and amines or the acyl derivatives or acetals thereof, for example polyvinyl alcohol, polyvinyl acetate, polyvinyl stearate, polyvinyl benzoate, polyvinyl maleate, polyvinyl butyral, polyallyl phthalate or polyallyl melamine; as well as their copolymers with olefins mentioned in 1) above. PA0 12. Homopolymers and copolymers of cyclic ethers such as polyalkylene glycols, polyethylene oxide, polypropylene oxide or copolymers thereof with bisglycidyl ethers. PA0 13. Polyacetals such as polyoxymethylene and those polyoxymethylenes which contain ethylene oxide as a comonomer, polyacetals modified with thermoplastic polyurethanes, acrylates or MBS. PA0 14. Polyphenylene oxides and sulfides, and mixtures of polyphenylene oxides with styrene polymers or polyamides. PA0 15. Polyurethanes derived from hydroxyl-terminated polyethers, polyesters or polybutadienes on the one hand and aliphatic or aromatic polyisocyanates on the other, as well as precursors thereof. PA0 16. Polyamides and copolyamides derived from diamines and dicarboxylic acids and/or from aminocarboxylic acids or the corresponding lactams, for example polyamide 4, polyamide 6, polyamide 6/6, 6/10, 6/9, 6/12, 4/6, 12/12, polyamide 11, polyamide 12, aromatic polyamides starting from m-xylene diamine and adipic acid; polyamides prepared from hexamethylenediamine and isophthalic or/and terephthalic acid and with or without an elastomer as modifier, for example poly-2,4,4,-trimethylhexamethylene terephthalamide or poly-m-phenylene isophthalamide; and also block copolymers of the aforementioned polyamides with polyolefins, olefin copolymers, ionomers or chemically bonded or grafted elastomers; or with polyethers, e.g. with polyethylene glycol, polypropylene glycol or polytetramethylene glycol; as well as polyamides or copolyamides modified with EPDM or ABS; and polyamides condensed during processing (RIM polyamide systems). PA0 17. Polyureas, polyimides, polyamide-imides and polybenzimidazoles. PA0 18. Polyesters derived from dicarboxylic acids and diols and/or from hydroxycarboxylic acids or the corresponding lactones, for example polyethylene terephthalate, polybutylene terephthalate, poly-1,4-dimethylolcyclohexane terephthalate and polyhydroxybenzoates, as well as block copolyether esters derived from hydroxyl-terminated polyethers; and also polyesters modified with polycarbonates or MBS. PA0 19. Polycarbonates and polyester carbonates. PA0 20. Polysulfones, polyether sulfones and polyether ketones. PA0 21. Crosslinked polymers derived from aldehydes on the one hand and phenols, ureas and melamines on the other hand, such as phenol/formaldehyde resins, urea/formaldehyde resins and melamine/formaldehyde resins. PA0 22. Drying and non-drying alkyd resins. PA0 23. Unsaturated polyester resins derived from copolyesters of saturated and unsaturated dicarboxylic acids with polyhydric alcohols and vinyl compounds as crosslinking agents, and also halogen-containing modifications thereof of low flammability. PA0 24. Crosslinkable acrylic resins derived from substituted acrylates, for example epoxy acrylates, urethane acrylates or polyester acrylates. PA0 25. Alkyd resins, polyester resins and acrylate resins crosslinked with melamine resins, urea resins, polyisocyanates or epoxy resins. PA0 26. Crosslinked epoxy resins derived from polyepoxides, for example from bisglycidyl ethers or from cycloaliphatic diepoxides. PA0 27. Natural polymers such as cellulose, rubber, gelatin and chemically modified homologous derivatives thereof, for example cellulose acetates, cellulose propionates and cellulose butyrates, or the cellulose ethers such as methyl cellulose; as well as rosins and their derivatives. PA0 28. Blends of the aforementioned polymers (polyblends), for example PP/EPDM, Polyamide/EPDM or ABS, PVC/EVA, PVC/ABS, PVC/MBS, PC/ABS, PBTP/ABS, PC/ASA, PC/PBT, PVC/CPE, PVC/acrylates, POM/thermoplastic PUR, PC/thermoplastic PUR, POM/acrylate, POM/MBS, PPO/HIPS, PPO/PA 6.6 and copolymers, PA/HDPE, PA/PP, PA/PPO. PA0 29. Naturally occurring and synthetic organic materials which are pure monomeric compounds or mixes of such compounds, for example mineral oils, animal and vegetable fats, oil and waxes, or oils, fats and waxes based on synthetic esters (e.g. phthalates, adipates, phosphates or trimellitates) and also mixes of synthetic esters with mineral oils in any weight ratios, typically those used as spinning compositions, as well as aqueous emulsions of such materials. PA0 30. Aqueous emulsions of natural or synthetic rubber, e.g. natural latex or latices of carboxylated styrene/butadiene copolymers. PA0 31. Polysiloxanes such as the soft, hydrophilic polysiloxanes described, for example, in U.S. Pat. No. 4,259,467; and the hard polyorganosiloxanes described, for example, in U.S. Pat. No. 4,355,147. PA0 32. Polyketimines in combination with unsaturated acrylic polyacetoacetate resins or with unsaturated acrylic resins. The unsaturated acrylic resins include the urethane acrylates, polyether acrylates, vinyl or acryl copolymers with pendant unsaturated groups and the acrylated melamines. The polyketimines are prepared from polyamines and ketones in the presence of an acid catalyst. PA0 33. Radiation curable compositions containing ethylenically unsaturated monomers or oligomers and a polyunsaturated aliphatic oligomer. PA0 34. Epoxymelamine resins such as light-stable epoxy resins crosslinked by an epoxy functional coetherified high solids melamine resin such as LSE-4103 (Monsanto). PA0 1.1. Alkylated monophenols, for example, PA0 2,6-di-tert-butyl-4-methylphenol PA0 2- tert- butyl-4,6- dimethylphenol PA0 2,6-di-tert-butyl-4-ethylphenol PA0 2,6-di-tert-butyl-4-n-butylphenol PA0 2,6-di-tert-butyl-4-i-butylphenol PA0 2,6-di-cyclopentyl-4-methylphenol PA0 2- (.alpha.-methhylcyclohexyl)-4,6-dimethylphenol PA0 2,6-di-octadecyl-4-methylphenol PA0 2,4,6-tri-cyclohexylphenol PA0 2,6-di-tert-butyl-4-methoxymethylphenol PA0 1.2. Alkylated hydroquinones, for example, PA0 2,6-di-tert-butyl-4-methoxyphenol PA0 2,5-di-tert-butyl-hydroquinone PA0 2,5-di-tert-amyl-hydroquinone PA0 2,6-diphenyl-4-octadecyloxyphenol PA0 1.3. Hydroxylated thiodiphenyl ethers, for example, PA0 2,2'-thio-bis-(6-tert-butyl-4-methylphenol) PA0 2,2'-thio-bis-(4-octylphenol) PA0 4,4'-thio-bis-(6-tert-butyl-3-methylphenol) PA0 4,4'-thio-bis-(6-tert-butyl-2-methylphenol) PA0 1.4. Alkylidene-bisphenols, for example, PA0 2,2'-methylene-bis-(6-tert-butyl-4-methylphenol) PA0 2,2'-methylene-bis-(6-tert-butyl-4-ethylphenol) PA0 2,2'-methylene-bis-[4-methyl-6-(.alpha.-methylcyclohexyl)-phenol] PA0 2,2'-methylene-bis-(4-methyl-6-cyclohexylphenol) PA0 2,2'-methylene-bis-(6-nonyl-4-methylphenol) PA0 2,2'-methylene-bis-[6-(.alpha.-methylbenzyl)-4-nonylphenol] PA0 2,2'-methylene-bis-[6-(.alpha.,.alpha.-dimethylbenzyl)-4-nonylphenol] PA0 2,2'-methylene-bis-(4,6-di-tert-butylphenol) PA0 2,2'-ethylidene-bis-(4,6-di-tert-butylphenol) PA0 2,2'-ethylidene-bis-(6-tert-butyl-4-isobutylphenol) PA0 4,4'-methylene-bis-(2,6-di-tert-butylphenol) PA0 4,4'-methylene-bis-(6-tert-butyl-2-methylphenol) PA0 1,1-bis-(5-tert-butyl-4-hydroxy-2-methylphenyl)-butane PA0 2,6-di-(3-tert-butyl-5-methyl-2-hydroxybenzyl)-4-methylphenol PA0 1,1,3-tris-(5-tert-butyl-4-hydroxy-2-methylphenyl)-butane PA0 1,1-bis-(5-tert-butyl-4-hydroxy-2-methylphenyl)-3-n-dodecylmercaptobutane PA0 ethyleneglycol bis-[3,3-bis-(3'-tert-butyl-4'-hydroxyphenyl)-butyrate] PA0 di-(3-tert-butyl-4-hydroxy-5-methylphenyl)-dicyclopentadiene PA0 di-[2-(3'-tert-butyl-2'-hydroxy-5'-methyl-benzyl)-6-tert-butyl-4-methylphen yl] terephthalate. PA0 1.5. Benzyl compounds, for example, PA0 1,3,5-tri-(3,5-di-tert-butyl-4-hydroxybenzyl)-2,4,6-trimethylbenzene PA0 di-(3,5-di-tert-butyl-4-hydroxybenzyl) sulfide PA0 3,5-di-tert-butyl-4-hydroxybenzyl-mercapto-acetic acid isooctyl ester PA0 bis-(4-tert-butyl-3-hydroxy-2,6-dimethylbenzyl)dithiol terephthalate PA0 1,3,5-tris-(3,5-di-tert-butyl-4-hydroxybenzyl) isocyanurate PA0 1,3,5-tris-(4-tert-butyl-3-hydroxy-2,6-dimethylbenzyl) isocyanurate PA0 3,5-di-tert-butyl-4-hydroxybenzyl-phosphoric acid dioctadecyl ester PA0 3,5-di-tert-butyl-4-hydroxybenzyl-phosphoric acid monoethyl ester, calcium-salt PA0 1.6. Acylaminophenols, for example, PA0 4-hydroxy-lauric acid anilide PA0 4-hydroxy-stearic acid anilide PA0 2,4-bis-octylmercapto-6-(3,5-tert-butyl-4-hydroxyanilino)-s-triazine PA0 octyl-N-(3,5-di-tert-butyl-4-hydroxyphenyl)-carbamate PA0 1.7. Esters of .beta.-(3,5-di-tert-butyl-4-hydroxyphenyl)-propionic acid with monohydric or polyhydric alcohols, for example, PA0 1.8. Esters of .beta.-(5-tert-butyl-4-hydroxy-3-methylphenyl)-propionic acid with monohydride or polyhydric alcohols, for example, PA0 1.9. Amides of .beta.-(3,5-di-tert-butyl-4-hydroxyphenyl)-propionic acid for example, PA0 N,N'-di-(3,5-di-tert-butyl-4-hydroxyphenylpropionyl)-hexamethylenediamine PA0 N,N'-di-(3,5-di-tert-butyl-4-hydroxyphenylpropionyl)-trimethylenediamine PA0 N,N'-di-(3,5-di-tert-butyl-4-hydroxyphenylpropionyl)-hydrazine PA0 1.10 Diarylamines, for example, diphenylamine, N-phenyl-1-naphthylamine, N-(4-tert-octylphenyl)-1-naphthylamine, 4,4'-di-tert-octyl-diphenylamine, reaction product of N-phenylbenzylamine and 2,4,4-trimethylpentane, reaction product of diphenylamine and 2,4,4-trimethylpentene, reaction product of N-phenyl-1-naphthylamine and 2,4,4-trimethylpentene. PA0 2.1.2-(2'-Hydroxyphenyl)-benzotriazoles, for example, the 5'-methyl-, 3',5'-di-tert-butyl-, 5'-tert-butyl-, 5'-(1,1,3,3-tetramethylbutyl)-, 5-chloro-3',5'-di-tert-butyl-, 5-chloro-3'-tert-butyl-5'-methyl-, 3'-sec-butyl-5'-tert-butyl-, 4'-octoxy, 3',5'-di-tert-amyl-, 3',5'-bis-(.alpha.,.alpha.-dimethylbenzyl), 3'-tert-butyl-5'-(2-(omega-hydroxy-octa-(ethyleneoxy)carbonyl-ethyl)-, 3'-dodecyl-5'-methyl-, and 3'-tert-butyl-5'-(2-octyloxycarbonyl)ethyl-, and dodecylated-5'-methyl derivatives. PA0 2.2. 2-Hydroxy-benzophenones, for example, the 4-hydroxy-, 4-methoxy-, 4-octoxy, 4-decyloxy-, 4-dodecyloxy-, 4-benzyloxy, 4,2',4'-trihydroxy- and 2'-hydroxy-4,4'-dimethoxy derivatives. PA0 2.3. Esters of optionally substituted benzoic acids for example, phenyl salicylate, 4-tert-butylphenyl salicylate, octylphenyl salicylate, dibenzoylresorcinol, bis-(4-tert-butylbenzoyl)-resorcinol, benzoylresorcinol, 3,5-di-tert-butyl-4-hydroxybenzoic acid 2,4-di-tert-butylphenyl ester and 3,5-di-tert-butyl-4-hydroxybenzoic acid hexadecyl ester. PA0 2.4. Acrylates, for example, .alpha.-cyano-.beta.,.beta.-diphenylacrylic acid ethyl ester or isooctyl ester, .alpha.-carbomethoxy-cinnamic acid methyl ester, .alpha.-cyano-.beta.-methyl-p-methoxy-cinnamic acid methyl ester or butyl ester, .alpha.-carbomethoxy-p-methoxy-cinnamic acid methyl ester, N-(.beta.-carbomethoxy-.beta.-cyanovinyl)-2-methyl-indoline. PA0 2.5. Nickel compounds, for example, nickel complexes of 2,2'-thio-bis-[4-(1,1,3,3-tetramethylbutyl)-phenol], such as the 1: 1 or 1:2 complex, optionally with additional ligands such as n-butylamine, triethanolamine or N-cyclohexyl-diethanolamine, nickel dibutyldithiocarbamate, nickel salts of 4-hydroxy-3,5-di-tert-butylbenzylphosphonic acid monoalkyl esters, such as of the methyl, ethyl or butyl ester, nickel complexes of ketoximes such as of 2-hydroxy-4-methyl-phenyl undecyl ketoxime, nickel complexes of 1-phenyl-4-1auroyl-5-hydroxy-pyrazole, optionally with additional ligands. PA0 2.6. Sterically hindered mines, for example bis-(2,2,6,6-tetramethylpiperidyl) sebacate, bis-(1,2,2,6,6-pentamethylpiperidyl) sebacate, n-butyl-3,5-di-tert.butyl-4-hydroxybenzyl malonic acid bis-(1,2,2,6,6-pentanemethylpiperidyl)ester, condensation product of 1-hydroxyethyl-2,2,6,6-tetramethyl-4-hydroxypiperidine and succinic acid, condensation product of N,N'-(2,2,6,6-tetramethylpiperidyl)-hexamethylenediamine and 4-tert-octylarnino-2,6-dichloro-s-triazine, tris-(2,2,6,6-tetramethylpiperidyl)-nitrilotriacetate, tetrakis-(2,2,6,6-tetramethyl-4-piperidyl) 1,2,3,4-butanetetracarboxylate, 1,1'(1,2-ethanediyl)-bis-(3,3,5,5-tetramethylpiperazinone), bis(1-octyloxy-2,2,6,6-tetramethylpiperidin-4-yl) sebacate. PA0 2.7. Oxalic acid dimides, for example, 4,4'-di-octyloxy-oxanilide, 2,2'-di-octyloxy-5,5'-di-tert-butyl-oxanilide, 2,2'-di-dodecyloxy-5,5'-di-tert-butyl-oxanilide, 2-ethoxy-2'-ethyl-oxanilide, N,N'-bis (3-dimethylarninopropyl)-oxalamide, 2-ethoxy-5-tert-butyl-2'-ethyloxanilide and its mixture with 2-ethoxy-2'-ethyl-5,4'-di-tert-butyloxanilide and mixtures of ortho- and para-methoxy- as well as of o- and p-ethoxy-disubstituted oxanilides. PA0 2.8. Hydroxyphenyl-s-triazines, for example 2,6-bis-(2,4-dimethylphenyl)-4-(2-hydroxy-4-octyloxyphenyl)-s-triazine; 2,6-bis-(2,4-dimethylphenyl)-4-(2,4-dihydroxyphenyl)-s-triazine; 2,4-bis(2,4-dihydroxyphenyl)-6-(4-chlorophenyl)-s-triazine; 2,4-bis[2-hydroxy-4-(2-hydroxy-4-(2-hydroxyethoxy)phenyl]-6-(4-chloropheny l)-s-triazine; 2,4-bis[2-hydroxy-4-(2-hydroxy-4-(2-hydroxyethoxy)phenyl]-6-(2,4-dimethylp henyl)-s-triazine; 2,4-bis[2-hydroxy-4-(2-hydroxyethoxy)phenyl]-6-(4-bromophenyl)-s-triazine; 2,4-bis[2-hydroxy-4-(2-acetoxyethoxy)phenyl]-6-(4-chloro-phenyl)-s-triazin e, 2,4-bis(2,4-dihydroxyphenyl)-6-(2,4-dimethylphenyl)-s-triazine. PA0 3. Metal deactivators, for example, N,N'-diphenyloxalic acid diamide, N-salicylal-N'-salicyloylhydrazine, N,N'-bis-salicyloylhydrazine, N,N'-bis-(3,5-di-tert-butyl-4-hydroxyphenylpropionyl)-hydrazine, 3-salicyloylamino- 1,2,4-triazole, bis-benzylidene-oxalic acid dihydrazide. PA0 4. Phosphites and phosphonites, for example, triphenyl phosphite, diphenylalkyl phosphites, phenyldialkyl phosphites, tri-(nonylphenyl) phosphite, trilauryl phosphite, trioctadecyl phosphite, di-stearyl-pentaerythritol diphosphite, tris-(2,4-di-tert-butylphenyl) phosphite, di-isedecyl-pentaerythritol diphosphite, di-(2,4-di-tert-butylphenyl)pentaerythritol diphosphite, tristearylsorbitol triphosphite, tetrakis-(2,4-di-tert-butylphenyl) 4,4'-diphenylylenediphosphonite. PA0 5. Compounds which destroy peroxide, for example, esters of .beta.-thiodipropionic acid, for example the lauryl, stearyl, myristyl or tridecyl esters, mercapto-benzimidazole or the zinc salt of 2-mercaptobenzimidazole, zinc dibutyl-dithiocarbamate, dioctadecyl disulfide, pentaerythritol tetrakis-(.beta.-dodecylmercapto)-propionate. PA0 6. Hydroxylamines, for example, N,N-dibenzylhydroxylamine, N,N-diethylhydroxylamine, N,N-dioctylhydroxylamine, N,N-dilaurylhydroxylamine, N,N-ditetradecylhydroxylamine, N,N-dihexadecylhydroxylamine, N,N-dioctadecylhydroxylamine, N-hexadecyl-N-octadecylhydroxylamine, N-heptadecyl-N-octadecylhydroxylamine, N,N-dialkylhydroxylamine derived from hydrogenated tallow amine. PA0 7. Nitrones, for example, N-benzyl-alpha-phenyl nitrone, N-ethyl-alpha-methyl nitrone, N-octyl-alpha-heptyl nitrone, N-lauryl-alpha-undecyl nitrone, N-tetradecyl-alpha-tridecyl nitrone, N-hexadecyl-alpha-pentadecyl nitrone, N-octadecyl-alpha-heptadecylnitrone, N-hexadecyl-alpha-heptadecyl nitrone, N-octadecyl-alpha-pentadecyl nitrone, N-heptadecyl-alpha-heptadecyl nitrone, N-octadecyl-alpha-hexadecyl nitrone, nitrone derived from N,N-dialkylhydroxylamine derived from hydrogenated tallow amine. PA0 8. Polyamide stabilizers, for example copper salts in combination with iodides and/or phosphorus compounds and salts of divalent manganese. PA0 9. Basic co-stabilizers, for example, melamine, polyvinylpyrrolidone, dicyandiamide, triallyl cyanurate, urea derivatives, hydrazine derivatives, amines, polyamides, polyurethanes, alkali metal salts and alkaline earth metal salts of higher fatty acids for example Ca stearate, Zn stearate, Mg stearate, Na ricinoleate and K palmitate, antimony pyrocatecholate or zinc pyrocatecholate. PA0 10. Nucleating agents, for example, 4-tert-butyl-benzoic acid, adipic acid, diphenylacetic acid. PA0 11. Fillers and reinforcing agents, for example, calcium carbonate, silicates, glass fibers, asbestos, talc, kaolin, mica, barium sulfate, metal oxides and hydroxides, carbon black, graphite. PA0 12. Other additives, for example, plasticizers, lubricants, emulsifiers, pigments, optical brighteners, flameproofing agents, anti-static agents, blowing agents and thiosynergists such as dilauryl thiodipropionate or distearyl thiodipropionate. PA0 13. Benzofuranones and indolinones, for example those disclosed in US-A-4 325 863, U.S. Pat. No. 4,338,244 or U.S. Pat. No. 5,175,312, or 3-[4-(2-acetoxyethoxy)phenyl]-5,7-di-tert-butyl-benzofuran-2-one, 5,7-di-tert-butyl-3-[4-(2-stearoyloxyethoxy)phenyl]benzofuran-2-one, 3,3'-bis[5,7-di-tert-butyl-3-(4-[2-hydroxyethoxy]phenyl)benzofurran-2-one] , 5,7-di-tert-butyl-3-(4-ethoxyphenyl)-benzofuran-2-one, 3-(4-acetoxy-3,5-dimethylphenyl)-5,7-di-ten-butyl-benzofuran-2-one, 3-(3,5-dimethyl-4-pivaloyloxyphenyl)-5,7-di-tert-butyl-benzofuran-2-one. PA0 1. Alkylated Monophenols PA0 2,6-Di-tert-butyl-4-methylphenol, 2,6-di-tert-butylphenol, 2-tert-butyl-4,6-dimethylphenol,2,6-di-tert-butyl-4-ethyl-phenol, 2,6-di-tert-butyl-4-n-butylphenol, 2,6-di-tert-butyl-4-i-butylphenol, 2,6-di-cyclopentyl-4-methylphenol, 2-(.beta.-methylcyclohexyl)-4,6-dimethylphenol, 2,6-di-octa-decyl-4-methylphenol, 2,4,6-tri-cyclohexylphenol, 2,6-di-tert-butyl-4-methoxymethylphenol, o-tert-butylphenol. PA0 2. Alkylated Hydroquinones PA0 2,6-Di-tert-butyl-4-methoxyphenol, 2,5-di-tert-butyl-hydroquinone, 2,5-di-tert-amyl-hydroquinone, 2,6-diphenyl-4-octa-decyloxyphenol. PA0 3. Hydroxylated Thiodiphenylethers PA0 2,2'-Thio-bis-(6-tert-butyl-4-methylphenol), 2,2'-thio-bis-(4-octyl-phenyl), 4,4'-thio-bis-(6-tert-butyl-3-methylphenol ), 4,4'-thio-bis-(6-tert-butyl-2-methylphenol). PA0 4. AlkyIidene-Bisphenols PA0 2,2'-Methylene-bis-(6-tert-butyl-4-methylphenol), 2,2'-methylene-bis-(6-tert-butyl-4-ethylphenol), 2,2 '-methylene-bis-(4-methyl-6-(.alpha.-methyl-cyclohexyl)-phenol), 2,2'-methylene-bis-(4-methyl-6-cyclohexylphenol), 2,2'-methylene-bis-(6-nonyl-4-methylphenol), 2,2'-methylene-bis-(4,6-di-tert-butylphenol), 2,2'-ethylidene-bis-(4,6-di-tert-butylphenol), 2,2'-ethylidene-bis-(6-tert-butyl-4- or -5-isobutylphenol), 2,2'-methylene-bis-(6-(.alpha.-methylbenzyl-4-nonylphenol), 2,2'-methylene-bis-(6-(.alpha.,.alpha.-di-methylbenzyl)-4-nonylphenol), 4,4'-methylene-bis-(2,6-di-tert-butyl-phenol), 4,4'-methylene-bis-(6-tert-butyl-2-methylphenol), 1,1-bis-(5-tert-butyl-4-hydroxy-2methyl-phenol)-butane, 2,6-di-(3-tert-butyl-5-methyl-2-hydroxy-benzyl)-4-methyl-phenol, 1,1,3-tris-(5-tert-butyl-4-hydroxy-2-methylphenyl)-3-n-dodecyl)-mercaptobu tane, ethyleneglycol-bis-[3,3-bis-(3'-tert-butyl-4'-hydroxyphenyl)-butyrate], bis-(3-tert-butyl-4hydroxy-5-methylphenyl)-dicyclopentadiene, bis-[2-(3'-tert-butyl-2'-hydroxy-5'-methyl-benzyl)-6-tert-butyl-4-methyl-p henyl]-terephthalate. PA0 5. Benzyl Compounds PA0 1,3,5-Tri-(3,5-di-tert-butyl-4-hydroxybenzyl)-2,4,6-trimethyl-benzene, bis(3,5-di-tert-butyl-4-hydroxybenzyl)-sulfide, 3,5-di-tert-butyl-4-hydroxybenzyl-mercaptoacetic acid-isooctylester, bis-(4-tert-butyl-3-hydroxy-2,6-dimethyl-benzyl)dithiolterephthalate, 1,3,5-tris-(3,5-di-tert-butyl-4-hydroxybenzyl)-isocyanurate, 1,3,5-tris-(4-tert-butyl-3-hydroxy-2,6-dimethylbenzyl)-isocyanurate, 3,5-di-tert-butyl-4-hydroxybenzyl-phosphonic acid-dioctadecylester, 3,5-di-tert-butyl-4-hydroxybenzyl-phosphonic acid-monoethylester, calcium-salt. PA0 6. Acylaminophenols PA0 4-Hydroxy-lauric acid anilide, 4-hydroxy-stearic acid anilide, 2,4-bis-octyl-mercapto-6- (3,5-di-tert-butyl-4-hydroxyanilino)-s-triazine, N-(3,5-di-tert-butyl-4-hydroxyphenyl)-carbamic acid octyl ester. PA0 7. Esters of [5-(3,5-Di-tert-butyl-4-hydroxypheny1)-propionic acid with mono- or polyhydric alcohols, for example with methanol, isooctyl alcohol, 2-ethylhexanol, diethylene glycol, octadecanol, triethylene glycol, 1,6-hexanediol, pentaerythritol, neopentyl glycol, tris-hydroxyethyl isocyanurate, thiodiethylene glycol, bis-hydroxyethyl-oxalic acid diamide. PA0 8. Esters of .beta.-(5-tert-butyl-4-hydroxy-3-methylphenyl)-propionic acid with mono- or polyhydric alcohols, for example with methanol, isooctyl alcohol, 2-ethylhexanol, diethylene glycol, octadecanol, triethylene glycol, 1,6-hexanediol, pentaerythritol, neopentyl glycol, tris-hydroxyethyl isocyanurate,thiodiethylene glycol, di-hydroxyethyl-oxalic acid diamide. PA0 9. Amides of .beta.-(3,5-Di-tert-butyl-4-hydroxyphenyl)-propionic acid for example N,N'-Bis-(3,5-di-tert-butyl-4-hydroxyphenylpropionyl)-hexamethylene-diamin e, N,N'-bis-(3,5-di-tert-butyl-4-hydroxy-phenylpropionyl)-trimethylene-diamin e, N,N'-bis(3,5-di-tert-butyl-4-hydroxyphenylpropionyl)-hydrazine. PA0 N,N'-Di-isopropyl-p-phenylenediamine, N,N'-di-sec.-butyl-p-phenylenediamine, N,N'-bis(1,4-dimethyl-pentyl)-p-phe nylenediamine, N,N'-bis(1 -ethyl-3-methyl-pentyl)-p-phenylenediamine, N,N'-bis(1-methyl-heptyl)-p-phenylenediamine, N,N'-dicyclohexyl-p-phenylenediamine, N,N'-diphenyl-p-phenylenediamine, N,N'-di-(naphthyl-2-)-p-phenylenediamine, N-isopropyl-N'-phenyl-p-phenylenediamine, N-(1,3-dimethylbutyl)-N'-phenyl-p-phenylenediamine, N-(1-methyl-heptyl)-N'-phenyl-p-phenylene-diamine, N-cyclohexyl-N'-phenyl-p-phenylenediamine, 4-(p-toluene-sulfonamido)-diphenylamine, N,N'-dimethyl-N,N'-di-sec-butyl-p-phenylenediamine, di-phenylamine, N-allyldiphenylamine, 4-isopropoxy-diphenylamine, N-phenyl-1-naphthylamine, N-phenyl-2-naphthylamine, octylated diphenylamine, e.g. p,p'-di-tert-octyldiphenylamine, 4-n-butylaminophenol, 4-butyrylamino-phenol, 4-nonanoylamino-phenol, 4-dodecanoyl-amino-phenol, 4-octadecanoyl-amino-phenol, di-(4-methoxy-phenyl)-amine, 2,6-di-tert-butyl-4-dimethyl-amino-methyl-phenol, 2,4'-diamino-diphenylmethane, 4,4'-diamino-diphenyl-methane, N,N,N',N'-tetramethyl-4,4'-diamino-diphenylmethane, 1,2-di-(phenyl-amino)-ethane, 1,2-di-[2-methyl-phenyl)-amino]-ethane, 1,3-di-(phenylamino)-propane, (o-tolyl)-biguanide, di-[4-1',3'-dimethyl-butyl)-phenyl]amine, tert-octylated N-phenyl-1-naphthylamine, mixture of mono- and dialkylated tert-butyl-/tert-octyldiphenylamines, 2,3-dihydro-3,3-dimethyl-4H-1,4-benzothiazine, phenothiazine, N-allylphenothiazine, tert-octylated phenothiazine, 3,7-di-tert-octylphenothiazine. PA0 Examples of metal passivators, for example for copper, are: PA0 Triazoles, benzotriazoles and derivatives thereof, tolutriazole and derivatives thereof, e.g. di(2-ethylhexyl)-arninomethyltolutriazole, 2-mercaptobenzothiazole, 5,5'-methylene-bis-benzotriazole, 4,5,6,7-tetrahydrobenzo-triazole, salicyclidene-propylene-diamine and salicyclamino-guanidine and salts thereof, 1,2,4-triazole and N,N'-disubstituted aminomethyl triazoles of formula ##STR12## in which R.sub.8 and R.sub.9 are, independently, e.g. alkyl, alkenyl, or hydroxyethyl, obtained by reacting 1,2,4-triazole with formaldehyde and an amine, HNR.sub.8 R.sub.9, as disclosed in European Patent Application No. 160620; and the Mannich reaction products derived from benzotriazole or tolutriazole, formaldehyde and an amine HNR.sub.8 R.sub.9. PA0 a) Organic acids, their esters, metal salts and anhydrides, e.g. N-oleoyl-sarcosine, sorbitan-mono-oleate, lead-naphthenate, alkenyl-succinic acids and -anhydrides, e.g. dodecenyl-succinic acid anhydride, succinic acid partial esters and amines, 4-nonyl-phenoxy-acetic acid. PA0 b) Nitrogen-containing compounds, e.g. PA0 I. Primary, secondary or tertiary aliphatic or cycloaliphatic amines and amine-salts of organic and inorganic acids, e.g. oil-soluble alkyl-ammonium carboxylates PA0 II. Heterocyclic compounds, e.g. substituted imidazolines and oxazolines. PA0 c) Phosphorus-containing compounds, e.g. amine salts of phosphonic acid or phosphoric acid partial esters, zinc dialkyldithio phosphates. PA0 d) Sulfur-containing compounds, e.g. barium-dinonylnaphthalene-n-sulfonates, calcium petroleum sulfonates. PA0 e) Derivatives of gamma-alkoxypropylamines described in Japanese Patent Publication No. 15783/1973; and PA0 f) Salts having the formula Y--NH.sub.3 --R.sub.10 CO.sub.2 -- in which Y is a group R.sub.11 X.sub.1 CH.sub.2 CH(OH)CH.sub.2 in which R.sub.10 and R.sub.11, independently, are e.g. alkyl and X.sub.1 is O, CO.sub.2, NH, N(alkyl), N(alkenyl) or S, these salts being prepared by mixing an amine Y--NH.sub.2 with an acid R.sub.10 CO.sub.2 H, as disclosed in DE-OS 3437 876 (German Offenlegungsschrift). PA0 g) Compounds having the formula EQU R.sub.12 --X.sub.2 --CH.sub.2 --CH(OH)--CH.sub.2 NR.sub.13 R.sub.14 PA0 h) Compounds having the formula: ##STR13## in which R.sub.15, R.sub.16, R.sub.17 are, independently, hydrogen, C.sub.1 -C.sub.15 alkyl, C.sub.5 -C.sub.12 cycloalkyl, C.sub.6 -C.sub.15 aryl or C.sub.7 -C.sub.12 aralkyl and R.sub.18 and R.sub.19, independently, are hydrogen, 2-hydroxyethyl or 2-hydroxypropyl, provided that R.sub.18 and R.sub.19 are not simultaneously hydrogen and, when R.sub.18 and R.sub.19 are each --CH.sub.2 CH.sub.2 OH, R.sub.15 and R.sub.16 are not simultaneously hydrogen and R.sub.17 is not pentyl. These compounds are described in EP Patent specification 0 252 007. PA0 Examples of viscosity-index improvers are: PA0 Polyacrylates, polymethacrylates, vinylpyrrolidone/methacrylate-copolymers, polyvinylpyrrolidones, polybutanes, olefin-copolymers, styrene/-acrylate-copolymers, polyethers. PA0 Examples of pour-point depressants are: PA0 Polymethacrylates, alkylated naphthalene derivatives. PA0 Examples of dispersants/detergents are: PA0 Polybutenylsuccinic acid-amides or -imides, polybutenyl-phosphonic acid derivatives, basic magnesium-, calcium-, and baxiumsulfonates and -phenolates. PA0 Examples of anti-wear additives and extreme pressure additives are: PA0 Sulphur- and/or phosphorus- and/or halogen-containing compounds e.g. sulphurised vegetable oils, zinc dialkyldithiophosphates, tritolylphosphate, chlorinated paraffins, alkyl- and aryldi- and trisulphides, triphenylphosphorothionate. PA0 One process for the preparation of the instant beta crystalline modification comprises heating a melt of the compound of formula I at a temperature in the range of 170 to 200.degree. C until the novel beta crystalline modification forms or optionally seed the melt with the novel beta crystalline form in order to increase the rate and efficiency of the melt crystallization. The melt crystallization is optionally carried out under reduced pressure of from 400 mm Hg to 0. 1 mm Hg. The melt crystallization can also be carried out in an extruder or kneader as described in U.S. Pat. No. 4,683,326, the relevant parts of which are herein incorporated by reference.
In general, the compounds of the present invention are employed in from about 0.01 to about 5% by weight of the stabilized composition, although this will vary with the particular substrate and application. An advantageous range is from about 0.05 to about 3%, and especially 0.05 to about 1%.
The stabilizers of the instant invention may readily be incorporated into the organic polymers by conventional techniques, at any convenient stage prior to the manufacture of shaped articles therefrom. For example, the stabilizer may be mixed with the polymer in dry powder form, or a suspension or emulsion of the stabilizer may be mixed with a solution, suspension, or emulsion of the polymer. The resulting stabilized polymer compositions of the invention may optionally also contain from about 0.01 to about 5%, preferably from about 0.025 to about 2%, and especially from about 0.1 to about 1% by weight of various conventional additives, such as the materials listed below, or mixtures thereof.

Beta crystalline modification of 2,2',2"-nitrilo[triethyl-tris-(3,3',5,5'-tetra-tert-butyl-1,1'-biphenyl- 2,2'-diyl) phosphite]