A method of curing an organic dielectric layer, such as polyimide, used in a multichip module is disclosed. The method comprises heating the uncured polyimide layer to a temperature above its glass transition temperature, and irradiating the layer with a uniform flux of electrons, as in an e-beam apparatus. The process reduces deterioration at the interface between the dielectric films and the metal layers which when high temperature thermal curing is utilized, and reduces the stress of the resulting film. Multiple dielectric layers can be applied in this manner.

Thin films of organic dielectric materials, such as polyimides, have found widespread use in the electronics industry in a variety of applications. One area in which thin films of polyimide and organic dielectric materials have found extensive use is in the fabrication of packaging modules for carrying one or more integrated circuit ("IC") chips. A plurality of individual IC chips may be disposed upon a so-called multichip module comprising a substrate upon which the chips are mounted. The substrate will typically contain various signal, power and ground lines for connection to the IC chips mounted thereon. The substrate may also comprise passive components such as bypass capacitors and terminal resistors.
In order to include the necessary power, signal and ground lines, (and to include, if applicable, passive components), the substrates used in multichip modules generally comprise a plurality of metal layers separated by dielectric material. Initially, most multichip modules were made of co-fired ceramic materials. In the last several years, thin-film packaging technologies have become more significant for fabricating multichip modules, particularly so-called copper/polyimide based modules. Thin film IC packages of this type typically comprise alternating layers of thin films of patterned copper and polyimide materials, usually on a thick base support substrate. Most recently, multichip modules combining both ceramic and thin-film technologies have been developed. A general discussion of both types of technologies may be found in Chapters 7 and 9 of Microelectronics Packaging Handbook, R. Tummala, et al. (eds.), (1989, van Nostrand Reinhold, New York).
The term polyimide, although sometimes used in a context which suggests a particular compound, actually describes a class of ring-chain resin polymers containing imide fragments. Polyimides are particularly useful because they have high temperature tolerance, good mechanical and chemical properties, low dielectric constant, and are relatively easily formed into a film which is highly uniform in thickness. While polyimides are the most commonly used class of dielectric materials used in thin film packages, other organic materials may also be used. Other organic materials that have been used or proposed for use in multichip modules include bensocyclobutenes, polyphenylquinoxalines, and various oligomers. The curing and polymerization processes for such materials are similar to the process used with polyimides.
Typically, a layer of the desired organic dielectric material (or its precursor) is applied to the base substrate (upon which other layers may have already been formed) in the liquid state. The layer is then hardened (polymerized or immidized) by using a curing process. The curing process normally involves two aspects, removal of the solvent carrier and imidization or cross-linking of the remaining material. The most common method of curing polyimides, and other thin film organic dielectric layers, is by heating them at an elevated temperature for a relatively long time. Provided that the curing temperature is sufficiently high, the heat curing process fulfills both aspects of the process, i.e., the solvent base is removed by volatilization at high temperature, and the immidization process also occurs at high temperature. As is well-known in the art, for temperature-induced immidization to occur, the curing temperature must be above the glass transition temperature of the polyimide material being used. As is also well-known in the art, the glass transition temperature increases with the degree of curing. For example, the initial glass transition temperature of a solvent-free uncured polyimide film may be approximately 150.degree. C., while the glass transition temperature of the same film rises to above 300.degree. C. after the film is cured.
Thus, a typical polyimide, as applied, may consist of a polyamic acid or polyamic ester dissolved in a solvent of N-Methyl-2-pyrrolidone. The latter has a boiling point of about 202.degree. C. After solvent removal, the uncured polymeric material has a glass transition temperature of approximately 150.degree.-250.degree. C. However, for the reasons described below, the polymerization reaction must, typically be conducted at above 350.degree. C., which is the glass transition temperature of the cured film.
As noted, the heat-curing technique generally in use in connection with thin films of organic dielectric materials used in multichip modules involves heating the layer to a high temperature, typically about 400.degree. C., for a relatively long period of time (one to four hours per layer). This process limits the maximum number of organic film layers that can be used due to the degradation of the polymer/metal interfaces caused by the high temperature curing.
Another problem with high temperature curing of polyimide and other organic layers arises from the mismatch between the thermal coefficients of expansion (TCEs) of the organic layers and the interposed metal layers and the base substrate. If the system is cured at a temperature greater than the final glass transition temperature of the organic film, the stress at the interface between the film and the metal layer will be zero at the final glass transition temperature, i.e., the film will be fully relaxed at the glass transition temperature. As the layers are cooled down below this temperature, stress builds up due to the mismatch between the TCEs of the layers, causing bowing of the substrate. This effect limits the size of the multichip module and choice of materials used to create it.
In addition, if the polyimide or other organic material layer is used in connection with active devices, such devices may be damaged or destroyed by the high temperatures used in the curing process.
U.S. Pat. No. 5,024,969, entitled Hybrid Circuit Structure Fabrication Methods Using High Energy Electron Beam Curing, issued Jun. 18, 1991 to Reche, discloses a technique for curing polyimide layers in a multichip module using e-beam irradiation of the uncured layer. Under the preferred process described in the '969 patent, the polyimide film is cured at room temperature. In an alternate embodiment, the curing may be conducted at the anticipated operating temperature of the multichip module, so long as the curing temperature is lower than the glass transition temperature of the uncured polyimide layer. However, the '969 patent recognizes that the quality of a polyimide layer cured at room temperature is poor due to inferior adhesion to the metal layers. It is also believed that films cured in this manner have poor chemical resistance. To solve the problem of poor adhesion, the '969 patent suggests a post-cure bake of the overall multichip module at a temperature less than the transition temperature of the polyimide. It is assumed that the problem of poor adhesion arises from the failure, when curing at room temperature, to drive off the solvent used to carry the polyimide, and that the baking step is used to complete the solvent removal. While the process described in the '969 patent is, in some respects, an improvement over the temperature curing technique, it is believed that the quality of the resulting films is still low, and that the post-cure bake step adds unnecessary complexity and added fabrication time.

Method of curing thin films of organic dielectric material


Tube connectors and tube connector systems are provided. An exemplary system includes a first sleeve, a second sleeve, and radially compressible ring. A tube fits radially inside of the ring and the first and second sleeves. As the first and second sleeves are coupled and brought closer together, inner surfaces of the sleeves exert a radial force onto the ring, causing the ring to radially compress onto the tube.

Transport of materials such as liquids, gases, and solids frequently requires connection of tubes to fittings, pipes, or other hollow cylinders. If the connection is loose or allows leaking of the material, the transport can quickly become inefficient and the leaks can cause damage in the surrounding environment. This problem is prevalent in high pressure hose or tube, such as automobile radiator hose, connections. This problem is also especially dangerous in connections in lines or tubes used to transport hazardous or flammable liquids, such as, for example, fuel lines.
A need, therefore, exists in the art for a connector that provides a fluid tight connection. A further need exists for a connector that is simple and inexpensive to manufacture, or can be easily installed or uninstalled.


A bar on which a plurality of LEDs are mounted. The bar has a first side surface having a plurality of grooves and a second side surface having a plurality of grooves, wherein the plurality of first grooves formed at the first side surface and the plurality of second grooves formed at the second side surface intersect each other such that the bar can be easily bent in a widthwise direction.

As electronic components are reduced in size and designs of electronic products are gradually diversified, the forms of modules mounted with the electronic components are diversified. For example, in the field of advertisement or illumination, for achieving illumination of desired letters or patterns, there are more and more needs to arrange a plurality of LEDs on a plane module(it can be hardly bent) in the same form as relevant letters or relevant patterns.
By the way, the bar used in the field of illumination or advertisement can be relatively well bent in up-and-down direction of the bar, as illustrated in FIG. 6 (refer to FIG. 6 (a), however, can be hardly bent in a width direction of the bar(refer to FIG. 6 (b)), therefore, in order to arrange the plurality of LEDs in a desired form, a plurality of bars mounted with LEDs have to be connected one by one or the bars have to be specially fabricated so as to conform to required form, thus there is disadvantage that work is troublesome and much cost and time are consumed.

LED mount bar capable of freely forming curved surfaces thereon


An acoustic waveguide in accordance with one or more embodiments of the present technology that comprises a housing having a proximal end with an inlet aperture and a distal end with an outlet aperture, and a mounting flange positioned at the proximal end and configured to acoustically couple a driver to inlet aperture. A plurality of sound channels extend through the housing and acoustically couple the inlet aperture to the outlet aperture. Each sound channel at least partially defining a sound path has an acoustic length, wherein at least one of the sound paths of the plurality of sound channels has a bend angle that exceeds 180 degrees.

In audio speakers, one factor that determines the sound quality is the sound pressure level (SPL), which generally depends in part on the speaker size relative to the distance between the speaker and the listener. Generally, a larger distance requires a larger speaker size. There is, however, a practical limit on the size of a large speaker. One solution is to use an array of smaller sized speakers to achieve similar acoustic results, because sound waves from the individual smaller speakers may combine to yield a combined sound wave that behaves similar to that emanating from a single large speaker. It is generally accepted that the spacing between two neighboring speakers needs to be smaller than the wavelength of the sound wave in question. The wavelength of a wave is determined as wave velocity divided by wave frequency. The wave velocity of sound in room temperature air is approximately 1130 ft/sec. For a low frequency audio sound having a frequency of 200 Hz, as an example, the corresponding wavelength is approximately 68 inches. Similarly, a midrange audio sound with a frequency of 2000 Hz, the corresponding wavelength is approximately 6.8 inches. A high frequency audio sound with an exemplary frequency of 20000 Hz has a wavelength is approximately 0.68 inches. It is difficult to achieve this small distance between speakers for high frequency sounds. This relatively small wavelength poses a problem for providing the desired spacing between high frequency speakers.
Acoustic waveguides have been developed to provide improved sound distribution from selected high-frequency drivers. Examples of such improved waveguides include the waveguides and associated technology set forth in U.S. Pat. Nos. 7,177,437, 7,953,238, 8,718,310, 8,824,717, and 9,204,212, and U.S. Patent Application Publication No. US2019-0215602, each of which is incorporated herein in its entirety by reference. While these waveguides provide substantial improvements particularly transmitting for high frequency audio sounds, there is still a need to distribute the emanation of the sound waves across the front of the speaker, producing a planar or cylindrical wavefront.


A semiconductor integrated circuit device has a negative voltage generation circuit provided at each power supply circuit unit for six memory macros. Therefore, the response with respect to variation in a negative voltage is increased. In a standby mode, a negative voltage supply line for the six memory macros is connected by a switch circuit, and only a negative voltage generation circuit of one power supply circuit unit among six negative voltage generation circuits of the six power supply circuit units is rendered active. Thus, increase in standby current can be prevented.

1. Field of the Invention
The present invention relates to semiconductor devices, particularly a semiconductor device including an internal voltage generation circuit.
2. Description of the Background Art
In a general DRAM (Dynamic Random Access Memory), an N channel MOS transistor is used as a transfer gate of a memory cell. A positive voltage is employed as the voltage for selection, applied to a word line, when a memory cell is rendered active. A negative voltage generation circuit generating a negative voltage lower than the ground voltage is incorporated in this DRAM. The negative voltage is used as a substrate bias voltage to control the substrate effect of a transistor.
In this context, variation in the level of the negative voltage is suppressed due to the large capacitance of the substrate. Further, high-speed response at the negative voltage generation circuit formed of a negative voltage detection circuit and a negative charge supply circuit is not required. Since high-speed response at the negative voltage generation circuit is not required even for a chip that incorporates a plurality of memories, only one negative voltage generation circuit having a performance level just required to charge the substrate when the external power supply is turned on is disposed at one site.
In a DRAM using a P channel MOS transistor as the transfer gate of a memory cell, a negative voltage is used as the voltage for selection, applied to a word line, when a memory cell is rendered active. In this type of DRAM, it is required to write a signal of ground level into a memory cell in a write operation mode, and output a signal voltage of sufficient amplitude from a memory cell in a readout operation mode. Therefore, the voltage to select a word line must be set sufficiently low.
In this context, high-speed response at the negative voltage generation circuit is required since the substrate capacitance is not large as in a conventional DRAM and the current consumption related to negative voltage is increased. Thus, there is a problem that variation in the negative voltage becomes great in a chip that has one negative voltage generation circuit incorporated for a plurality of memories.
A possible consideration is to increase the through current (standby current) flowing to the negative voltage detection circuit in the negative voltage generation circuit to allow higher speed in response. However, the standby current cannot be increased in the field of battery-driven portable equipment in which this type of DRAM is incorporated, since there is a demand for lower power consumption by reduction in operating voltage and consumed current.
This type of DRAM also poses the problem of increase in circuit failure caused by excessive stress applied to the transistor during a burn-in test mode.
Further, this type of DRAM poses the problem that the operation speed is reduced due to the reduction in power supply voltage and/or increase in ground voltage in a circuit operation mode.
In addition, this type of DRAM is easily affected by noise.
Moreover, there was a problem that a semiconductor integrated circuit device including a plurality of such DRAMs exhibited unstable circuit operation due to the reduction in power supply voltage and/or increase in ground voltage.

Semiconductor device including internal voltage generation circuit


An improved head, neck and shoulder apparatus is provided which can be utilized for exercise and/or therapy of the cervical spine and/or muscles associated with the cervical spine. The machine includes a head frame which receives a person's head, and a main frame which can receive a person in a seated position. A ball joint is provided for allowing relative movement of the head frame with respect to the main frame, with the ball joint positionable such that it can be located adjacent a desired location along the person's cervical spine, preferably at the cervico thoracic junction. Various aspects of the invention are also applicable to exercise machines designed for conditioning other muscles and/or muscle groups.

1. Field of the Invention
The invention relates to exercise machines which can be utilized for therapeutic reasons, or simply to improve the conditioning of the user. In particular, the present invention provides an improved head, neck and shoulder exercise machine which provides muscle conditioning for all normal head/neck movements.
2. Discussion of Background
Often, it is desirable to improve the strength and/or conditioning of muscles associated with movement of the human head, neck and shoulders. Conditioning these muscles can be particularly important in avoiding injuries in both professional and weekend athletes. Effective exercise also provides increased endurance, strength and range of motion. In addition, exercise is an important component in recovering from injuries which can result from participation in athletics, or from automobile accidents. Recently, conditioning of head, neck and shoulder muscles has been increasingly recognized as important in improving posture, relieving stress, and in reducing or alleviating head and neck pain including headaches which can result from poorly conditioned or atrophied shoulder and neck muscles. Exercise and conditioning of head, neck and shoulder muscles can alleviate or subside numerous conditions including pain, spasm, contractures, myofacial trigger points, swelling, abnormal tone or abnormal sensations. Head, neck and shoulder exercise can also be beneficial therapy in improving or correcting dizziness, blurred vision, loss of balance and vasomotor phenomenon.
Unlike many other structural/muscle groups of the human body, the head and neck can move in multiple different directions, and cannot be conveniently exercised with conventional free weights or weight machines. Head and neck movement is accomplished by a number of muscles or muscle groups cooperating primarily with the cervical vertebrae up to the first thoracic vertebrae. Some of the muscles associated with head and neck movement include the trapezius muscle, the sternocleidomastoid muscle, obliqus and rectus group, splenius capitis, splenius cervicis, the posterior cervical muscles, suboccipital, as well as the levator scapulae and scalene muscles. There are three basic movements of the head and neck including: (1) rotation in which the head rotates or turns from side to side; (2) forward and backward flexure and extension in which the head moves forward (e.g. to look downward) or backward (to look upward); and (3) lateral flexure in which the head moves laterally such that the person's ear is moving toward their shoulder.
Although the importance in exercising muscles in the neck region has been recognized, a satisfactory exercise device has not been available. Although a number of neck/shoulder machines are available, they suffer from a number of shortcomings. For example, many machines do not provide for proper isolation of the head, neck and shoulder movements, and do not provide for proper stabilizing and fixing of the torso or other portions of the body of the user. In addition, if the user is not properly positioned in the apparatus, abnormal movement can result, and pain or injury can result. In accordance with one shortcoming of conventionally available exercise machines, I have recognized a particularly widespread deficiency in that the exercise machines do not simulate the true movement of the human head and neck. This primarily results from the fact that conventional machines do not provide a joint which is aligned with the natural axis and movement of the cervical spine.
Accordingly, an exercise machine is desired which can improve the conditioning of muscles associated with movement of a person's head and neck. Such a machine should be capable of movement with a user's head and neck, and should be capable of movement in all directions for which a head is movable. In addition, the machine should provide resistance in opposition to neck movement of the user, thereby improving the strength of the muscles associated with head and neck movement. Most desirably, the machine should be able to simulate the natural movement of the human head and neck, and should include a joint arrangement which is substantially aligned with or synchronous with a person's neck when they are positioned in the machine, with movement of the machine about the joint simulating all normal types of movement of the human head and neck.

Head, neck, and shoulder exercise machine


Execution of a set of instructions within a transaction is prevented. A processor identifies a first set of instructions in an instruction stream of a transaction. The first set of instructions incurs a first memory access that is not visible to the transaction and will cause the transaction to abort. The processor generates a second set of instructions that incurs a second memory access that is visible to the transaction. The second set of instructions is generated based on the first memory access and first set of instructions. The processor executes, within the transaction, the second set of instructions instead of the first set of instructions.

The present invention relates generally to the field of computer memory management, and more specifically to techniques for improving the efficiency of transactional memory operations.
Many computer systems employ cache memory to speed data retrieval operations. Cache memory stores copies of data found in frequently used main memory locations. Accessing data from cache memory speeds processing because cache memory can typically be accessed faster than main memory. If requested data is found in cache memory, then it is accessed from cache memory. However, if requested data is not found in cache memory, then the data is first copied into cache memory and then accessed from the cache memory.
Multi-level cache is a structure in which there are multiple cache memories. For example, a computing system may have three levels, i.e. an L1 cache, an L2 cache, and an L3 cache. Typically, in a multi-level cache configuration, L1 is the smallest and with a short access time. If requested data is not found in L1 cache, the system searches the L2 cache, which is usually physically further away than the L1 cache, thus, with a greater access time. In a similar fashion, if the data is not found in the L2 cache, the L3 cache is searched. Main memory is only accessed if the requested data is not in the L1, L2, or L3 caches. There are many different implementations of cache memory.
A transactional memory operation is a type of memory operation that groups one or more load and store operations performed by a processor into a single transaction that is visible to other processors as a single operation when the transaction completes. The effects (e.g., the data) of multiple store operations participating in the single transaction are not made visible to other processors until the transaction is complete. A transactional load is a load that accesses and buffers data until a transaction completes, after which the data is forwarded to the processor that requested it. If the data from a transactional load is changed (i.e., its location in memory is written to) after the load occurs and before the transaction completes, the transaction is aborted. A transactional write is a write whose data is not seen by other processors until the transaction completes. A read from or a write to a location that is the target of a transactional write in a transaction aborts the transaction. Transactional memory is often helpful in synchronizing work that is performed in parallel on multiple CPUs (by enabling atomic operations on an arbitrary set of memory locations) and when multiple writes must not be interrupted, for example writes to control registers in a coprocessor. Since writes that participate in a transaction are not visible until the transaction completes, a read from a location that is going to be written by a write in the transaction aborts the transaction.
To enhance performance, a computer system often includes special hardware, known as accelerators that have structures that are optimized for executing a particular task. Media processors (e.g., video or audio), graphics processing units (GPU), string processing units, vector units, etc. are some examples. A central processor unit (CPU) often sets up an accelerator by writing control data into control registers in the accelerator that tell the accelerator what to, where to go for the data it operates on, and where to write its results, among other things. After its control registers are set up, an accelerator usually performs operations that include direct accesses of main memory for some data, without involving a cache structure that the CPU accesses, operates on the data, often returns results to main memory, and informs the CPU that the task that it was given has been completed (usually via an interrupt). A transactional memory system is usually integrated into a level in a cache structure that is accessed by the CPU. The integration facilitates the process of making the writes in a memory transaction visible to other CPUs in a system all at once if the transaction successfully completes. Because an accelerator usually accesses data directly from memory, the memory locations that it accesses are not usually visible to all levels of the cache structure and therefore not visible to the integrated transactional memory system (to check for address conflicts)—so if an accelerator is accessed by a CPU during a transaction, the transaction is aborted because an undetected address conflict can occur. Aborting transactional memory operations can cause performance to decrease. Techniques to prevent aborting a transactional memory operation are an active area of research.

Instruction stream modification for memory transaction protection

International Business Machines Corporation


A socket (10) has a base member (20), a cover member (30) which is mounted for alternating motion toward and away from base member (20), a plurality of contacts (40) having an end fixed to the base member (20), a contact regulating member (50) that regulates the position of the movable ends (42, 92) of the contact and an adaptor (60) having a seating surface, the adaptor which is mounted for alternating motion toward and away from the contact regulating member (50). When adaptor (60) is removed from the contact regulating member, the movable ends of the contacts do not protrude through the seating surface and when adaptor (60) has been moved toward the contact regulating member (50), the movable ends of the contacts protrude from each through-hole (65) of adaptor (60) for engagement with the solder balls of a BGA device (11), placed on the adaptor (60). The cover member is linked to the base member and latches (70) having a BGA device pressing tip (72) are rotatable with movement of the cover. The latches have a first fulcrum (75) for a first segment of motion and a second different fulcrum (71) for a second segment of motion.

This invention relates generally to a socket for mounting an electronic device such as a semiconductor device, or the like, and more particularly to a socket which is to be used in burn-in tests for such devices.
Defects in a semiconductor device are initially checked by subjecting the semiconductor device (which may be referred to as an IC device or an IC package) to a burn-in test. In connection with a burn-in test, the semiconductor device is mounted on or in a socket. According to sockets of the pop-up type which are widely used, a cover member of the socket engages in alternating motion in a direction toward and away from the main base thereof. This type of straight-line movement of the cover member is suitable for automatic loading of a semiconductor device.
The surface-loading type semiconductor devices in which a plurality of terminals are arranged in an X-Y matrix as in the case of BGA (ball grid array) or CSP (Chip Sized Package) are increasing in number, and sockets which can be used for these are being developed. In the case where a BGA package or a CSP package is mounted on a circuit substrate, there may be problems of defective soldering stemming from irregularities in the height of the balls or the deformation of one or more balls. It is desirable that the lower surface (the loading side) of the ball be free of damage. In the case where the ball is made of a low melting point substance such as solder, etc., there are cases where it tends to be softened in the high temperature state at the time of a burn-in test, with the solder balls becoming deformed.
In order to avoid such a problem, as shown in U.S. Pat. No. 6,083,013, issued Jul. 4, 2000, one approach provides a contact terminal which regulates the amount of contact protrusion from a floating member which seats an IC device at the end of the contacts, thereby leveling the protrusion heights of the solder balls.
Nevertheless, there is the following problem in this approach: With reference to FIG. 12, a floating member 2, capable of vertical movement relative to the main socket body 1, is provided with a stop mechanism for regulating the amount of protrusion of the contact end. Because of this, contact terminals 6 protrude from floating member 2 at all times including the time of loading of IC package 4, with solder balls 3 of the IC package 4 being in contact with the contact terminals 6. As a result, solder balls 3 can be caught by the contact terminals 6 thereby interfering with loading of the IC package. Further, it is impossible for the IC package to be loaded in the socket without a possibility that at least some solder balls 3 are scraped during the loading procedure.
An object of the present invention is the provision of a socket which overcomes the above noted prior art limitation and which properly loads semiconductor devices of the surface loading type such as BGA or CSP.
Another object of the invention is the provision of a socket which is capable of controlling any deformation of a protrusion-like or a bump-shaped terminal of a semiconductor device to be loaded. Still another object is the provision of a socket in which the amount of deformation of the terminals of semiconductor devices of the surface loading type can be adjusted.
Yet another object of the invention is the provision of a socket having a latch mechanism having improved operability, is economical and which is suitable for automatic loading of semiconductor devices.
According to the invention, contact regulating means for the regulation of the position of the movable ends of a plurality of contacts is provided in a socket comprising a base member, a cover which is mounted for alternating motion toward and away from the base member, a plurality of contacts that have been fixed to the base member body and an adaptor for seating the electronic device. The contact regulating means is provided on the base member and the adaptor is movably mounted on the contact regulating means. A plurality of through-holes are formed in the adaptor in conformity with the plurality of contacts and, when the adaptor has been moved toward the contact regulating means, the movable ends of the contacts protrude from the through-holes of the adaptor. Since the movable ends of the contacts are regulated to a certain fixed protrusion height by the contact regulating means, the protrusion height of the movable ends of the contacts that protrude from the adaptor is also regulated. When the adaptor touches the contact regulating means, the amount of protrusion of the movable ends of the contacts from the seating surface of the adaptor is maximized. When the adaptor is disposed at a position which is removed from the contact regulating means, the plurality of free ends of the contacts are positioned inside the through-holes without protruding from the seating surface of the adaptor.
Preferably, the contact regulating means has a plurality of slots at locations corresponding to the plurality of contacts, with a stop surface being formed in each slot to engage with or near the movable end of the contacts, thereby making it possible to regulate the protrusion height of the movable ends of the contacts.
Preferably, the adaptor can be removed from the socket and replaced with another adaptor so that the amount of protrusion of the free movable end of the contacts can be varied. In addition, the seating surface of the adaptor may include an offset surface for supporting the electronic device, and a surface which includes the plurality of through-holes at a location which is lower than the offset surface. The electronic device is a semiconductor device having a plurality of terminals arranged on one side in an X-Y matrix, such as BGA or CSP types.
Moreover, the socket made according to this invention may include a latch member that moves in linkage with the cover member. The latch member is linked to the cover member through a linkage mechanism and, when the cover member is separated from the base member, the electronic device (semiconductor device) is pressed down, thereby causing the adaptor to be pushed down. When the adaptor has been pushed down more than a certain amount, the movable end of the contacts protrude from the through-holes of the adaptor (seating surface of the adaptor), effecting contact with the terminals.
According to a feature of the invention, the latch member is rotated using first and second fulcrums changing the radius of rotation or straight-line distance between the center of the rotation and the pressing part of the latch member. The arrangement provides a rapid movement of the latch member to its retracted location using one fulcrum when the cover member has been pushed down and when the cover is allowed to ascend, back to a position where the latch engages a semiconductor device loaded in the socket. From this location, using the other fulcrum, more gradual movement is effected as the cover member is pushed up, thereby gradually increasing the pressing force that is given to the semiconductor device. As a result of this, it becomes possible to prevent any damage or deformation, particularly to thin semiconductor devices.

Socket for mounting an electronic device


In some examples, a system is configured to mount on an ownship vehicle and includes a phased-array radar device configured to transmit radar signals and receive returned radar signals. In some examples, the system also includes a surveillance transponder configured to receive surveillance signals from another vehicle. In some examples, the system further includes processing circuitry configured to detect an object based on the returned radar signals and determine a position of the other vehicle and a velocity vector of the other vehicle based on the received surveillance signals. In some examples, the system includes common signal and data processing circuitry that processes both data from the phased-array radar device and data from the surveillance transponder.

A Frequency Modulated Continuous Wave (FMCW) phased-array radar device may include an antenna array, where each antenna is configured to transmit or receive electromagnetic signals. The FMCW phased-array radar device may control the direction of a beam of electromagnetic signals that is transmitted by the antenna array. The direction of the beam may be based on the phase relationship (i.e., phase shift) of the electromagnetic signals transmitted from each element of the antenna array. Each element of the antenna array may include a separate transmitter and/or receiver to generate a digitally generated phase shift. The digitally generated phase shift is achieved at low intermediate frequencies and does not occur at the carrier frequency of the radar. This radar is therefore known as a Digital Active Phased Array Radar (DAPA).
An FMCW phased-array radar device may include electronic scanning rather than or in addition to mechanical scanning. The electronic scanning may include generating a digitally generated phase shift in the electromagnetic signals transmitted by the antenna array to control the direction of a beam. The electronic scanning may also include determining a digitally generated phase shift in electromagnetic signals received by the antenna array. In some examples, an FMCW phased-array radar device may include a mechanical scanning apparatus for moving, tilting, and/or rotating the antenna array in one plane.


A system and method for determining information for system components includes a database, an interchanger subsystem, and a product selection subsystem. The database includes information concerning components. An interchanger subsystem receives product parameters from a selected one of the plurality of users. The product parameters specify features of a component. The interchanger subsystem determines a list of interchangeable substitute components from the information in the database. The product selection subsystem receives component information from a selected one of the plurality of users and determines a range of product offerings from the information in the database.

In many types of businesses, the interface that customers use to obtain and compare product information, and order products is an important concern. Current processes and tools do not support ordering and comparing products at a level of sophistication that is desired by customers. One example of a product line where current systems and methods fall short of achieving desired results is the industrial product field and the power transmission component product line.
Power transmission components are used in many applications. For example, AC and DC motors may be used in industrial manufacturing equipment and processes. Gear couplings may be used to readily transmit mechanical power in applications such as pumps, compressors, air conditioning and refrigeration equipment, fans and blowers, and other rotating machinery. Clutches may be used in the drive trains of printing presses, conveyors, and pumps to prevent damage due to excessive torque generated by overloads and/or jamming.
In other examples of power transmission components, mounted and unmounted bearings may be used in various types of industrial equipment. Belt drives may also be used in various applications.
Previously, customers of power transmission products may have relied upon printed catalogs. The catalogs may include a variety of types of information. For example, the dimensions of a component may be included in the catalog description. In another example, the catalog may include the operating characteristics or tolerances of a power transmission component.
Customers of power transmission products may have also relied on human operators to supply the customer with further information concerning a component. In one example, suppliers of power transmission components may establish a toll-free telephone line that customers may use to obtain further information concerning power transmission components. The human operator may manually communicate information to a customer concerning a power transmission component, for instance, by looking at a catalog and communicating the information to the customer over the telephone. The human operator may also take an order of the customer for a component.
Both of the above-mentioned methods have drawbacks. For example, printed catalogs may be large and cumbersome for the customer to read. In addition, verbal comments from human operators may be unreliable and, in some cases, difficult to obtain during non-business hours.
The Internet has changed business practices around the world making online communications important to strengthening the distribution channels for an organization. This is important to not only a manufacturer, but to the partners of the manufacturer. However, the automated ordering and sophisticated comparison of components is not supported by current systems and processes at a level desired by customers. Accordingly, it is desirable to automate, facilitate, and integrate the ordering and comparison of products and the provisioning of engineered solutions that overcomes the problems associated with prior systems.

Method and apparatus for automated information retrieval and component ordering

Emerson Power Transmission Manufacturing LP


An underwater light having a sealed polymer housing includes a rear housing component formed at least in part from a thermally conductive and electrically insulative material, an electronic assembly having at least one light-emitting element mounted thereto, the electronic assembly in thermal communication with the rear housing component, and a lens mounted to the rear housing component and forming a watertight seal therebetween, the lens and the rear housing component enclosing the electronic assembly. At least a portion of the rear housing component conducts heat away from the electronic assembly to cool the electronic assembly.

Technical Field
The present disclosure relates to the field of underwater lighting for pools and spas. More specifically, the present disclosure relates to an underwater light having a sealed polymer housing, and a method of manufacture therefor.
Related Art
In the underwater lighting field, submersible luminaires are known and commonly used. These devices are conventionally made from a combination of metal, plastic, and glass. Furthermore, the various electrical components within luminaires require adequate heat dissipation through the use of heat sinks. The heat sinks draw heat away from the electrical components and dissipate it, thereby preventing any damage to the electrical components or luminaire. Metal components are often utilized as heat sinks due to their high thermal conductivity compared to plastics, glass, and other materials. However, metal heat sinks are also electrically conductive.
In submersible luminaires, the exposed metal portions of the luminaire, as well as components external to the luminaire housing (e.g., the luminair cord and a niche), require safe electrical grounding. This requires significant design efforts and expense to assure the safety of the device. Indeed, a critical interface must be provided between the metal components of the luminaire and the niche into which the luminaire is installed, to allow for adequate grounding. Such an interface facilitates the safe grounding and bonding of the metal components. Due to the complexity of such interfaces and the necessity for a luminaire and niche to create a safe interface, Underwriter's Laboratories has required that luminaires and niches be from the same manufacturer. As a result of the foregoing, it would be desirable to provide a submersible luminaire housing constructed of a material which is thermally conductive yet electrically insulative.
Thermally conductive and electrically insulative polymer materials are known. These materials allow for the dissipation of heat while restricting the conduction of electricity therethrough, making them ideal for a situation in which thermal energy must be transferred yet electrical energy must be insulated.

Underwater light having a sealed polymer housing and method of manufacture therefor


A package for a cryopreservation container including at least an adhesive fluoropolymer film. The package for a cryopreservation container makes it possible to store blood, rare cells and vital tissues in a very low temperature environment without any damage to the container. Further, the sealing strength resulting from heat sealing after placing a cryopreservation container in the packages is very good. Therefore, liquid nitrogen can be inhibited from entering the inside and thus contamination with bacteria, viruses or the like contained in liquid nitrogen can be avoided and the package can be prevented from being broken by expansion of intruder liquid nitrogen on the occasion of thawing. Also disclosed is a method for packaging a cryopreservation container and a method of producing a package for a cryopreservation container.

Blood, rare cells and vital tissues are generally stored at very low temperatures, namely at about −80 to −196° C. In particular, bone marrow cells, hematopoietic stem cells and like rare cells are effectively used in the treatment of intractable diseases such as leukemia, and a technology of storing them for a long period of time has been demanded. For the storage at such very low temperatures, blood, rare cells and vital tissues are generally stored in tightly closed containers therefor immersed mainly in liquid nitrogen.
As for the cryopreservation containers for such storage, vials made of polypropylene, for instance, are commercially available for use on the laboratory level; they are inexpensive and convenient from the handling viewpoint.
With the recent development of cord blood banks, bag-like containers excellent in low-temperature resistance and flexibility have been proposed. For example, containers made of a laminated film composed of a polyimide film and fluorinated ethylene-propylene polymer film (Patent Document 1) and containers made of a tetrafluoroethylene-ethylene copolymer film (Patent Document 2) have been proposed. Further, Patent Document 3 discloses cryopreservation containers molded from an electron beam-irradiated, biaxially stretched ethylene-vinyl acetate copolymer film. Patent Document 4 discloses cryopreservation containers molded from a biaxially stretched, crosslinked polyethylene film.
On the other hand, the present inventors developed cryopreservation containers which are constituted of a laminated film consisting of an ultrahigh molecular weight polyethylene layer and a thermoplastic resin layer compatible with the ultrahigh molecular weight polyethylene layer and are superior to the cryopreservation containers disclosed in Patent Documents 1 to 4, and applied for a patent for the same (Patent Document 5).
When blood, rare cells and vital tissues are preserved in the cryopreservation containers mentioned above in liquid nitrogen, the cryopreservation containers are further packaged so that the contents may be protected in case of damage of the containers and liquid nitrogen may be prevented from entering the cryopreservation containers. For packaging them, packages made of a perfluoroethylene-propene copolymer, among others, are generally used.
However, such packages are fluororesin-made ones and therefore the molding or processing for manufacturing them must be carried out at elevated temperatures. In spite of this, their heat seal strength is not so high but the sealed portions are possibly in danger of peeling away. After packaging of a cryopreservation container in a package, the mouth portion of the package is heat sealed for tight closure. This mouth portion is also susceptible to peeling and there is the possibility that liquid nitrogen may enter the inside. This work is carried out in medical institutions such as cord blood banks and heat sealing under severe conditions is a burden on workers. Further, when polypropylene vials for cryopreservation or cryopreservation containers described in Patent Documents 1 to 4 are packaged, there is the possibility that when the packages are damaged and liquid nitrogen enters the inside, the cryopreservation containers may also be damaged.
Ultrahigh molecular weight polyethylene films are formed by cutting processing and are relatively thick. When they are used as materials for packages, the conduction of heat to the contents may possibly be affected.
Known as materials for packages for cryopreservation containers are polytetrafluoroethylene, polychlorotrifluoroethylene, tetrafluoroethylene/hexafluoropropylene copolymers, tetrafluoroethylene/ethylene copolymers and polyimides, among others (cf. e.g. Patent Document 6 and Patent Document 7). However, those fluororesins which are used in preparing the conventional packages require elevated temperatures for sealing and their sealability is insufficient in some cases.    Patent Document 1: Japanese Patent Publication S49-008079    Patent Document 2: Utility Model Publication S55-055069    Patent Document 3: Japanese Patent Publication S55-044977    Patent Document 4: Japanese Patent Publication S62-057351    Patent Document 5: Japanese Kokai Publication H08-173505    Patent Document 6: Japanese Kokai Publication H11-139459    Patent Document 7: Japanese Kokai Publication 2003-267471

Package of freeze storage container and process for producing the same


A storage unit stores data of a first image associated with a contrast-enhanced cardiac region. A specification unit specifies a specific region included in the cardiac region on the basis of a distribution of pixel values of the data of the first image. A setting unit contracts the specified specific region, and set an ROI to the contracted specific region. A calculation unit calculates an index concerning the set ROI. The index is associated with a function of the specific region.

1. Field of the Invention
The present invention relates to an image processing apparatus and image processing method which calculate indexes associated with the cardiac function of an subject to be examined, more specifically, indexes associated with the blood flow function.
2. Description of the Related Art
In X-ray CT examination, cardiac function analysis is performed. More specifically, blood flow analysis is performed on a left ventricular myocardial region. In blood flow analysis, an ROI (region of interest) (typically a left ventricular myocardial region) as an analysis target is set, and the change amount of contrast medium concentration in the set ROI is calculated. Various indexes associated with hemodynamics are then calculated on the basis of the calculated value. A typical blood flow analysis technique requires the data of the change amount of contrast medium concentration at a plurality of times.
As a technique of setting a myocardial region, the level set method disclosed in, for example, Japanese Patent No. 3902765 is known. According to such a conventional technique, any myocardial region cannot be specified in volume data at a time when no contrast medium is present, because the cardiac muscle is equal in pixel value to the lumen. In volume data with sufficient contrast based on a contrast medium, the contour of the myocardial region is faithfully specified, and an ROI is set to the specified myocardial region. For this reason, owing to the pulsation of the heart or a partial volume effect, the pixel values in the myocardial region are influenced by a contrast medium in a region other than the myocardial region, e.g., the left ventricular lumen and the pixel values in the papillary muscle region, lung region, or the like, and hence the accuracy of blood flow analysis decreases. Furthermore, when a plurality of ROIs are to be set in time-series volume data, since each ROI is set by repeating similar processing for the volume data, the amount of computation becomes enormous.

Image processing apparatus and image processing method


Apparatuses and methods for manipulating droplets are disclosed. In one embodiment, an apparatus for manipulating droplets is provided, the apparatus including a substrate, multiple arrays of electrodes disposed on the substrate, wherein corresponding electrodes in each array are connected to a common electrical signal, and a dielectric layer disposed on the substrate first side surface and patterned to cover the electrodes.

1. Technical Field
The presently disclosed subject matter relates generally to apparatuses and methods for manipulating droplets. More particularly, the presently the use of apparatuses comprising multiple arrays of electrodes disposed on a substrate wherein corresponding electrodes in each array are connected to a common electrical signal.
2. Background
Microfluidics is a rapidly advancing field which deals with the study of sub-microliter fluids. Microfluidic devices are increasingly finding application and acceptance in many fields of biology, chemistry, medicine, environmental monitoring, drug discovery, and consumer electronics. Miniaturization of traditional devices, particularly analytical devices, is expected to lead to many benefits including reduced consumption (and cost) of reagents and samples, higher throughput and automation, faster analysis times, and more reliable, inexpensive, and portable instrumentation. As more functionality becomes embedded within these devices, fully integrated micro-total-analysis systems (μTAS) or labs-on-a-chip are becoming a reality and increasingly important.
Lab-on-a-chip is an emerging paradigm which aims to miniaturize and integrate fluid-handling onto a chip. A lab-on-a-chip should enable fluid dispensing, transport, mixing, incubation, detection/separation, and waste disposal for it to be a truly self-contained unit. Microfluidic lab-on-a-chip systems can be broadly categorized into continuous-flow and discrete-flow systems. A continuous-flow system is self-descriptive and in discrete-flow systems the fluid is discretized into droplets. A common limitation of continuous flow systems is that fluid transport is physically confined to fixed channels, whereas droplet-based (or discrete-flow) systems can be either confined to physical channels or operate on planar and channel-less systems. The transport mechanisms generally used in continuous-flow systems are pressure-driven by external pumps or electrokinetically-driven by high-voltages. Continuous-flow systems can involve complex channeling and require large supporting instruments in the form of external valves or power supplies. In another approach to channel-based systems, centrifugal forces drive the fluids to flow uni-directionally in channels. The continuous-flow microfluidics paradigm has limitations in versatility, making it difficult to achieve high degrees of functional integration and control.
Discrete-flow or droplet-based microfluidic systems have been progressing steadily to fulfill the promise of the lab-on-a-chip concept to handle all steps of analysis, including sampling, sample preparation, sample-processing including transport, mixing, and incubation, detection, and waste handling. These steps have been designed to be performed on-chip without significant off-chip support systems. A few discrete-flow approaches have been recently developed for manipulating droplets based on multilayer soft lithography, hydrodynamic multiphase flows, continuous electrowetting, electrowetting-on-dielectric (EWOD), dielectrophoresis, electrostatics, and surface acoustic waves. Some of the above techniques manipulate droplets or slugs in physically confined channels while other techniques allow manipulation of droplets on planar surfaces without any physically defined channels. The channel-less droplet-based approaches have been referred to as "digital microfluidics" because the liquid is discretized and programmably manipulated.
Droplet-based protocols are very similar to bench-scale biochemical protocols which are also generally executed on discrete volumes of fluids. Therefore, established protocols can be easily adapted to digital microfluidic format. Some of the distinguishing features of digital microfluidic systems include: reconfigurability (droplet operations and pathways are selected through a software control panel to enable users to create any combination of microfluidic operations on-the-fly); software programmability also results in design flexibility where one generic microfluidic processor chip can be designed and reprogrammed for different applications; conditional execution steps can be implemented as each microfluidic operation can be performed under direct computer control to permit maximum operational flexibility; multidirectional droplet transport since the channels only exist in the virtual sense and can be instantly reconfigured through software; small droplet volumes (<1 μL); completely electronic operation without using external pumps or valves; simultaneous and independent control of many droplets; and channel-less operation (where no priming is required).
Many current lab-on-a-chip technologies (including both continuous-flow and discrete-flow devices) are relatively inflexible and designed to perform only a single assay or a small set of very similar assays. Due to the fixed layouts of current microfluidic chips, a new chip design is required for each application, making it expensive to develop new applications. Furthermore, many of these devices are fabricated using expensive microfabrication techniques derived from semiconductor integrated circuit manufacturing. As a result, applications for microfluidic devices are expanding relatively slowly due to the cost and effort required to develop new devices for each specific application. Although batch fabrication allows microfabricated devices to be inexpensive when mass-produced, the development of new devices can be prohibitively expensive and time consuming due to high prototyping costs and long turn-around time associated with standard semiconductor microfabrication techniques. In order to broaden the range of applications and impact of microfluidics in medicine, drug discovery, environmental and food monitoring, and other areas including consumer electronics, there is a long-felt need both for microfluidic approaches which provide more reconfigurable, flexible, integrated devices, as well as techniques for more inexpensively and rapidly developing and manufacturing these chips.
Over the past several years there have been advances utilizing different approaches to microfluidics based upon manipulation of individual nanoliter-sized droplets through direct electrical control. Examples of such systems can be found in U.S. Pat. No. 6,911,132 and U.S. Patent Application Publication No. 2004/0058450, both to Pamula et al. (and commonly assigned to the Assignee of the present subject matter), the disclosures of which are incorporated herein by reference. These techniques offer many advantages in the implementation of the digital microfluidics paradigm as described above but current fabrication techniques to produce these microfluidic chips still depend on rather complex and expensive manufacturing techniques. These microfluidic chips are currently produced in microfabrication foundries utilizing expensive processing steps based on semiconductor processing techniques routinely used in the integrated circuit (IC) fabrication industry. In addition to higher cost for semiconductor manufacturing techniques, semiconductor foundries are not easily accessible and typically do not offer fabrication or prototyping turn-around times of as quick as 24 hours.
Microfluidic chips are generally fabricated using custom processes based on traditional semiconductor microfabrication procedures. Devices are fabricated on glass substrates through repeated steps of thin film deposition and patterning using standard photolithographic techniques. Typically, at least two metal layers (one for electrodes and one for wiring) are required in addition to two or three insulator layers, as well as layers for forming the standoff between the top and bottom plates. Due to the high cost of photomask fabrication and chip manufacturing, a single prototyping run producing up to 100 devices can cost as much as $10,000 and require three months to complete depending on the number of photolithographic levels. Furthermore, since the process flow is not standardized, device yields tend to be very low during the first several attempts to fabricate any new design.
The expense and time required for prototyping has been a serious impediment to the development and optimization of droplet-based microfluidics. Furthermore, the high chip costs and inability to rapidly customize or improve device designs is expected to dampen the commercial prospects of this versatile technology. In the short term, a more rapid, reliable and low cost fabrication technology is required to accelerate development and user acceptance of these devices. Since microfluidic structures tend to be relatively large and rarely test the limits of semiconductor manufacturing techniques, lower resolution, lower cost batch fabrication methods should be considered.
In particular, printed circuit board (PCB) technology offers many capabilities and materials similar to traditional semiconductor microfabrication though at much lower resolution. Layers of conductors and insulators are deposited and photolithographically patterned and stacked together to create intricate multi-level structures. For the fabrication of digital microfluidic systems, it is believed that PCB technology offers an excellent compromise in terms of resolution, availability, cost and ease of manufacture. It is further believed that an additional advantage of using a PCB as a substrate is that electronics for sensing, controlling or analyzing the device can be easily integrated at very low cost.
Typically, the copper line width and line spacing is measured in mils (25.4 μm) in a PCB process, which is orders of magnitude higher than the sub-micron features generally achieved in a semiconductor fab. Typically, PCB processing does not require an expensive ultra-clean environment as is required for semiconductor IC fabrication. The boards are also generally made out of reinforced plastic, glass fiber epoxy, TEFLON®, polyimide, etc. as compared to silicon or glass which are used as substrates for microfluidic devices microfabricated in a semiconductor fab. Also, in place of a semiconductor mask aligner, alignment can usually be performed manually for PCB processing. Inexpensive masks made out of transparencies or MYLAR sheets are used in place of expensive chrome-on glass photomasks used in semiconductor fabs. In PCB processing, via holes are drilled either mechanically or with a laser and then electroplated instead of etching and vapor deposition used in semiconductor processing which necessitates vacuum processing. Multiple wiring layers are generally obtained by bonding individually patterned single boards together as opposed to using a single substrate and building up the multiple layers or bonding wafers in a semiconductor fab. Broadly, these are the main differences between a PCB fabrication process and a semiconductor fabrication process even though high-end PCB processes are moving towards adopting some of the semiconductor processes (such as physical vapor deposition).
In today's highly competitive commercial environment, it is imperative that products reach the marketplace quickly and cost-effectively, particularly in consumer electronics and medical diagnostics businesses. The present subject matter is related to utilizing printed circuit board (PCB) manufacturing techniques which are widely available, reliable, inexpensive and well-defined. By fabricating reconfigurable microfluidic platforms with a reliable, easily accessible, and low-cost manufacturing technology, the development and acceptance of lab-on-a-chip devices for many potential applications in biomedicine and in other areas will be more widespread and rapid.
The attractiveness of PCB technology as an inexpensive, well-established, flexible and easily accessible manufacturing process for the development of microfluidic systems has already been recognized by researchers working with more traditional continuous-flow microfluidic systems. For example, researchers have previously demonstrated a number of continuous-flow microfluidic devices based on PCB technology including a bubble detector, a pH regulation system, a micropump, and a capacitive pressure sensor. More recently, PCB devices for the manipulation and analysis of single cells by dielectrophoresis have also been reported, as have hybrid approaches in which a PCB is used to monolithically integrate silicon-based microfluidic devices. However, there remains a long-felt need for an inexpensive, flexible, and reconfigurable system for discrete-flow manipulation of droplets.

This patent is subject to a terminal disclaimer.


An upright vacuum cleaner includes a nozzle assembly and a canister assembly pivotally connected to the nozzle assembly. A suction generator is carried on one of the nozzle assembly or the canister assembly. The upright vacuum cleaner also includes a telescoping handle assembly including an elongated handle received in a slot for sliding movement relative to the canister assembly, a projecting guide pin carried on the elongated handle, a cooperating guide channel in the canister assembly for receiving the guide pin and a latch carried on the canister assembly for selectively engaging any one of the longitudinally spaced apertures formed in the elongated handle.

The present invention relates generally to the vacuum cleaner field, and, more particularly, to a telescoping handle for an upright vacuum cleaner and an upright vacuum cleaner incorporating such a telescoping handle.
Upright vacuum cleaners in all of their designs and permutations have become increasingly popular over the years. The upright vacuum cleaners generally incorporate a nozzle assembly and a canister assembly pivotally connected to the nozzle assembly. Together, the two assemblies ride on wheels over the floor surface to be cleaned.
The canister assembly includes an operating handle that is manipulated by the user to move the vacuum cleaner to and fro across the floor. The canister assembly also includes either a bag-like filter or a cyclonic separation chamber and filter combination that traps dirt and debris while substantially clean air is exhausted by a fan that is driven by an onboard electric motor. It is this fan and motor arrangement that generates the drop in air pressure necessary to provide the desired cleaning action. In most upright vacuum cleaners sold today, a rotary agitator is also provided in the nozzle assembly. The rotary agitator includes tufts of bristles, brushes, beater bars or the like to beat dirt and debris from the nap of a carpet being cleaned while the pressure drop or vacuum is used to force air entrained with this dirt and debris into the nozzle of the vacuum cleaner.
In order for the operator to be able to comfortably manipulate and easily control the movement of the vacuum cleaner back and forth across the floor, it is important for the control handle to be a particular height or length. That height or length varies depending upon the height of the operator. Accordingly, the best upright vacuum cleaners incorporate a control handle that is adjustable in length. Such a handle may also be fully retracted when the vacuum cleaner is in the upright storage position. This allows more convenient storage of the vacuum cleaner in a closet or the like when not in use. The present invention relates to a simple and inexpensive telescoping handle design that provides user-friendly and reliable performance over a long service life.
In accordance with the purposes of the present invention as described herein, an improved upright vacuum cleaner is provided. That upright vacuum cleaner includes a nozzle assembly and a canister assembly pivotally connected to the nozzle assembly. Additionally, a suction generator is carried on the nozzle assembly or the canister assembly.
The upright vacuum cleaner also includes a telescoping handle assembly. The telescoping handle assembly includes an elongated handle received in a slot in the canister assembly for sliding movement relative to the canister assembly. The elongated handle also includes a series of longitudinally spaced adjustment apertures. The telescoping handle assembly still further includes a projecting guide pin carried on the elongated handle and a cooperating guide channel on the canister assembly for receiving the projecting guide pin. Additionally, the telescoping handle assembly includes a latch carried on the canister assembly for selectively engaging any one of the longitudinally spaced adjustment apertures.
Still more specifically describing the invention, the elongated handle includes a lumen and a guide pin receiving aperture. A spring clip is secured to the projecting guide pin. The spring clip is received in the lumen to hold the projecting guide pin in place in the guide pin receiving aperture.
The latch is pivotally mounted to the canister assembly. A compression spring biases a pin on the latch into selective engagement with any one of the longitudinally spaced adjustment apertures. The latch may be L-shaped. Additionally, a hand grip may be provided on the control handle to allow easier manipulation of the vacuum cleaner and more user friendly operation.
In the following description there is shown and described one possible embodiment of this invention, simply by way of illustration of one of the modes best suited to carry out the invention. As it will be realized, the invention is capable of other different embodiments, and its several details are capable of modification in various, obvious aspects all without departing from the invention. Accordingly, the drawings and descriptions will be regarded as illustrative in nature and not as restrictive.

Telescoping handle for upright vacuum cleaner

Matsushita Electric Corporation of America


Systems and methods and disclosed for alerting improper inhibition of alerts of aircraft warning systems. In some examples, a method may include: determining whether an inhibition of a safety alert of a warning system of an aircraft is activated; upon determining that the inhibition is activated, determining whether the inhibition is improper under current or upcoming operating conditions of the aircraft, the current or upcoming operating conditions including a current or projected position of the aircraft and a weather condition at the current or projected position; and upon determining that the inhibition is improper under the current or upcoming operating conditions, alerting an operator of the aircraft to deactivate the inhibition.

Warning systems may be used on aircraft to issue alerts when the aircraft encounters conditions hazardous to safety. For example, a terrain awareness and warning system (TAWS) may be used to decrease the risk of controlled flight into terrain (CFIT) accidents by issuing alerts when a hazardous terrain situation is detected. Warning systems may be equipped with features that permit pilots to inhibit alerts. For example, a TAWS system may have a terrain inhibit switch that permits a pilot to inhibit TAWS alerts. Such a switch may be useful to avoid nuisance from alerts when deliberately operating near terrain.
Once an alert of a warning system has been inhibited, it may be appropriate for the pilot to un-inhibit the alert when flight conditions change, such as when the aircraft is flying into instrument meteorological conditions (IMC) from visual meteorological conditions (VMC). However, remembering to un-inhibit the alert may require the pilot to adequately monitor the situation and perform the action at the appropriate time. Pilots may forget to perform the action due to multitasking, distraction, task interruption, absence of cues, or other factors.
Therefore, there is a need for systems and methods for preventing alerts from warning systems from remaining inhibited if the pilot does not un-inhibit them when it is appropriate to do so. The present disclosure is directed to addressing one or more of these above-referenced challenges. The background description provided herein is for the purpose of generally presenting the context of the disclosure. Unless otherwise indicated herein, the materials described in this section are not prior art to the claims in this application and are not admitted to be prior art, or suggestions of the prior art, by inclusion in this section.

Systems and methods for alerting improper inhibition of warning systems


An electronic storage device for connecting with a host system includes a flash memory including a number of memory segments, and a controller including an error correction segment capable of generating a first correction code and a second correction code according to a written data received by the controller. The written data, the first correction code and the second correction code are written into a memory segment of the flash memory by the controller. The first correction code is used for checking whether there is an error bit in the written data, and the second correction code is used for checking and correcting said error bit in the written data.

1. Field of the Invention
The present invention relates to an electronic storage device and the control method thereof, more particularly to a non-volatile electronic storage device and the control method thereof.
2. Description of Related Art
NAND-type flash memory is widely used in consuming products to be served as storage media because of rapid access speed and high reliability. Conventional data storage devices are Solid-Stage Drive (SSD), USB Flash Drive (UFD), memory cards etc. In particular, NAND-Type Flash Memory is mainly served as storage media. With the rapid improvement achieved in semi-conductor process, the memory density of the flash memory becomes higher and higher, bytes capable of being stored in a memory cell become more and more, thus causing the data storage capacity of the flash memory becoming bigger and bigger. However, with the enlargement of the capacity of the flash memory, the content of data in each management unit also becomes different.
Conventional capacity of each memory unit page of a flash memory is 2 KB (Byte) plus redundancy bits, as shown in FIGS. 1A and 1B. In FIG. 1A, the memory page contains four 512-byte memory segments S0, S1, S2, and S3, with data D0, D1, D2, and D3 respectively stored in the memory segments S0, 51, S2 and S3. Error Correcting Codes (ECC) E0, E1, E2, and E3 generated according to the data D0, D1, D2 and D3 are respectively stored in the redundancy bits. In FIG. 1B, the memory page also contains four 512-byte memory segments S0, S1, S2 and S3 with data D0, D1, D2 and D3 respectively stored therein. Error Correcting Codes (ECC) E0, E1, E2 and E3 generated according to the data D0, D1, D2 and D3 are respectively recorded after corresponding memory segments S0, S1, S2 and S3.
When accessing data, such as accessing data D0, then the ECC E0 also should be accessed for error detection and correction to the data D0 to assure the right data access. For the same theory, the access to D1, D2 and D3 also should read E1, E2, and E3 for error detection and correction to error bits, thus, assuring the right data access. That means that utilizing E0, E1, E2, and E3 to assure the right access of D0, D1, D2 and D3.
Please refer to FIG. 2, the capacity of a memory page of a large-capacity flash memory is 4 KB plus redundancy bits. Each memory segment S0, S1, S2 or S3 contains 1024 bytes, that is double as 512 bytes. Each 1024-byte memory segment provides several bits of ECC for error detection and correction to the data. In FIG. 2, the data in memory segment S0 is D0 and D1 which is protected by an ECC E01. Data in memory segment S1 is D2 and D3 which is protected by an ECC E23.
However, the capacity of each memory segment of a conventional host system is still 512 bytes, not like 1024 bytes defined by a large-capacity flash memory. Therefore, when the conventional host system requests accessing 512-byte data from a large-capacity flash memory, a controller of the flash memory still needs to read out 1024 bytes and related ECC codes from the flash memory for checking error in the 1024 bytes. If there is an error, the error will be corrected and the correct requested 512-byte data will be accessed.
For example, in FIG. 2, when the host system requests accessing data D0, data in memory segment S0 (D0+D1) and the ECC code E01 generated by D0 and D1 will be all read out, that means that data D0 cannot be accessed directly. So, the additional action of reading the whole memory segment S0 and the related E01 lengthens the error detection and correction time, thus, influencing the data process efficiency of the flash memory.

Electronic storage device and control method thereof


An exhaust device 10, which is arranged on the upper surface of the main unit frame 11 of an electronic copying machine, a printer, or the like, is constructed with a louver 15 having a section in an approximately spherical shape, with an air exhaust fan 18 arranged in the space under the louver 15. Moreover, the louver 15 mentioned above is provided with a large number of slits 16 formed along its arc-shaped structure, and, with these slits 16, the exhaust device can secure an exhaust port even when another object is placed on the louver 15 mentioned above because the slits 16 will not be obstructed completely even in such a case.

1. Field of the Invention
The present invention relates to an exhaust device for discharging dust, heat, and the like generated inside a picture image forming apparatus, such as an electronic copying machine or a printer, and, more particularly, to such an exhaust device which is constructed in a manner so that the exhaust device is capable of exhausting dust, heat, etc., under conditions even when the exhaust device is positioned in proximity to an outside obstacle or the like.
2. Description of the Related Art
In picture image forming apparatus exemplified by electronic copying machines and printers, recorded paper bearing picture images are produced by an electrophotographic process in which an electrostatic latent image is formed by projecting a beam of picture image light onto a photosensitive material drum and feeding toner from a developing unit to form a picture image in toner on the drum in accordance with the latent image. Thereafter, the toner image is transferred onto printing paper by a picture image transfer device and the toner image bearing printing paper is passed through a fixing device which fixes the toner picture image on the paper and to produce image recorded paper. Apparatus of this type is prone to the development of interior dust and heat and is therefore provided with an exhaust device for discharging the dust and the heat to the exterior of the apparatus.
The dust generated inside the picture image forming apparatus is mainly paper dust from the paper transport system and clouds of toner from the circumference of the photosensitive material drum. In addition to such dust, large amounts of heat and steam, for example, are generated by the fixing device. Also, ozone and NOX (nitrogen oxide) are generated by a charging corotron and a transferring and separating corotron provided in positions facing the photosensitive material drum. The presence of such materials inside the apparatus cause deterioration of parts in the apparatus or otherwise interfere with maintenance-free operation of the apparatus. Moreover, unless the heat generated inside of the apparatus is discharged, the inside of the apparatus will reach high temperatures at which toner deteriorates. Additionally, the heat adversely influences other members, causing impediments to their operation.
Picture image forming apparatus conventionally employ an exhaust system for discharging the heat, dust, or ozone generated from within the apparatus. Dust and ozone filters are usually included to collect the dust and ozone, respectively. Such an exhaust system is disclosed, for example, in Japanese Patent Application Laid Open No. 37574-1985 (Showa 60). In the copying machine described, an exhaust system is arranged for each of upper and lower areas as divided from each other by a paper path in the main unit of the apparatus. These individual exhaust systems respectively discharge the heat generated from lamps and the like provided in the upper part of the apparatus and the heat generated from a power source, for example, in the lower part of the apparatus. These exhaust systems are constructed in such a manner to be capable of performing the exhausting function under favorable conditions, the timing for driving these exhaust systems being set up in accordance with the operating condition of the copying machine.
Conventional exhaust systems for apparatus of the type described employ a louvered register means for discharging the dust and heat through a side wall area of the main frame of a machine. However, the exhaust opening thus provided in a side wall area of a copying machine is often obstructed sufficiently to interfere with effective exhausting operation if the copying machine happens to be placed in a position close to another apparatus, for example, or close to a wall or the like. In order to prevent the occurrence of this problem, it is necessary to set the copying machine in a position spaced from other equipment. However, it is difficult in many cases to secure sufficient space for desks and other items in an office, particularly where a small sized copying machine may be used.
Moreover, it has been proposed, as illustrated in FIG. 9, that a louver 12 should be formed so as to project from a main unit frame 11 in a conventional copying machine like the example given above. The projecting louver 12 shown in FIG. 9 is provided with an exhaust port 13 formed on the upper surface of the projecting part, so that this construction, which clearly indicates the position of the exhaust device 10d to the operator, can prevent another object from being placed in a position close to the exhaust device. Yet, even with an exhaust device 10d so constructed, it will occasionally happen that the exhaust port of the projecting louver is obstructed if the copying machine is positioned close to a wall or the like. In some cases, such as compact printers, the exhaust port is arranged on the upper part of the apparatus. However, a problem with this construction is that the exhaust device is eventually obstructed with documents or the like placed on the upper area of the printer, which tends to happen in a small office space.

Exhaust device for picture image forming apparatus


Embodiments herein relate to a composite material including about 10 to 80 wt. % of a polymer phase, the polymer phase comprising a thermoplastic polymer with a density of less than about 1.9 g-m−3; and about 20 to 90 wt. % of a dispersed mixed particulate phase, the dispersed mixed particulate phase comprising a mixed particulate and about 0.005 to 8 wt. % of a coating of at least one interfacial modifier. The mixed particulate including a portion of a reinforcing fiber and a portion of a particle. The composite material having a Young's modulus of greater than 700 MPa. In various embodiments, structural building components made from the composite are included as well as additive manufacturing components made from the composite. Other embodiments are also included herein.

Substantial attention has been paid to the creation of composite materials with unique properties. Included in this class of materials are materials with improved viscoelastic character, varying densities, varying surface characteristics and other properties which may be used to construct a composition with improved properties. Composite materials have been made in the past by combining generally two dissimilar components to obtain beneficial properties from both components. A true composite is unique because the interaction and engineered combination of the components provides the best properties and characteristics from both components.
Many types of composite materials are known. Generally, the art recognizes that combining metals of certain types and proportions to form an alloy that provides unique properties in the metal/metal alloy materials with different properties than the metals alone. Metal/ceramic composites have been made typically involving combining metal powder or fiber with clay materials that can be sintered into a metal/ceramic composite.
Combining typically a thermoplastic or a thermosetting polymer phase with a reinforcing powder or fiber produces a range of filled materials and, under the correct processing conditions, can form a true polymer composite. In contrast, a filled polymer, with the additive as filler, cannot display composite properties. A filler material typically is comprised of inorganic materials that act as either pigments or replacement for the polymer component. Fillers are often a substitution for a more expensive component in the composition. A vast variety of fiber-reinforced composites have been made typically to obtain fiber reinforcement properties used to modify only the mechanical properties of the polymer in a specific composite.
Polymer materials have been combined with cellulosic fiber to make extruded materials. However, such materials have not successfully been used in the form of a structural member that is a direct replacement for wood or other materials, such as aluminum and concrete, for temporary structures that are useful for military, commercial or building material applications. Such materials can be in the form of a decorative or structural material or member. Common extruded thermoplastic composite materials cannot provide thermal and structural properties similar to wood or other structural materials. These extruded materials fail to have sufficient modulus, compressive strength, and coefficient of thermal expansion that matches wood to produce a direct replacement material. Further, many prior art extruded composites must be milled after extrusion to a final useful shape. One class of composite, a polyvinyl chloride/wood flour material, poses the added problem that wood dust, which can accumulate during manufacture, tends to be explosive at certain concentrations of very fine, airborne, wood dust or powder.
Many of these materials containing polymer and particulate are admixtures of separate components and are not true composites. Admixtures are relatively easily separable into the constituent parts and, once separated, the component parts display the individual properties of the components. A true composite resists separation and displays enhanced and often different properties of the input materials whereas the individual input materials often do not display the enhanced properties. A true composite does not display the properties of the individual components but displays the unique character of the composite as a whole.

Polymer composite comprising an interfacially modified fiber and particle


The present invention is directed to a reinflatable external casing packer which is operable in three modes, including: a filling mode of operation, a locking mode of operation, and a reinflation mode of operation. A valve system is provided which allows for selective filling and reinflation of the external casing packer in response to suspected or detected loss of pressure within the inflation chamber. The present invention may also be characterized as a method of placing a wellbore.

1. Field of the Invention
This invention relates generally to inflatable wellbore packers, and specifically to external casing packers as well as a method of casing an openhole wellbore.
2. Description of the Prior Art
External casing packers are wellbore packing devices which are coupled into a string of casing. Preferably, the external casing packer includes a mandrel which defines a central bore which is substantially similar in internal diameter to that of the central bore of the casing string. A packing element is disposed radially outward from the mandrel, and serves to grippingly and sealingly engage a wellbore surface, such as an openhole wellbore wall.
External casing packers are used in conjunction with casing cement as a means for securing the casing string in a desired position within the wellbore, but can also be used in lieu of cement in certain applications. In such applications, the external casing packer is intended to remain in an inflated setting position for the uses life of the oil and gas well, which can be substantial periods of time.
One type of external casing packer includes an annular inflatable wall disposed about the mandrel of the external casing packer, which in-part defines an inflation chamber. Pressurized wellbore fluid is directed into the inflation chamber, which serves to receive pressurized fluid which outwardly radially expands the annular inflatable wall from an uninflated running mode of operation to an inflated setting mode of operation.
The prior art external casing packers are susceptible to two problems, each of which could result in catastrophic loss within the wellbore. The first problem is that the annular inflatable wall which is radially expanded outward in response to pressurized wellbore fluid is usually at least in-part composed of rubber. Typically, the annular gamble wall includes an inner annular elastomeric sleeve which is covered on its exterior surface by protective material to prevent puncture of the elastomeric sleeve. After setting, the material which comprises the elastomeric sleeve is susceptible to "cold flowing". This could cause a change in pressure exerted against the annular inflatable wall, which could cause the external casing packer to release from gripping and sealing engagement with the wellbore wall, resulting in shifting of the casing string within the openhole wellbore or creation of a leak path around the packer. The second problem is that the inflation chamber of the external casing packer may include tiny leak paths which, over time, result in a loss of pressure from the inflation chamber, and corresponding loss of sealing engagement between the external easing packer and the openhole wellbore wall, also resulting in shifting of the casing string or creation of a leak path around the packer.

Reinflatable external casting packer and method of casing


In an aligning device, in plan view, a first recess of a first transfer jig allows an entire region of a second recess of the first transfer jig to be situated within the first recess of the first transfer jig by a predetermined interval. When the first transfer jig and the second transfer jig overlap each other, the first recess of the second transfer jig allows the entire region of the second recess of the first transfer jig to be situated within the first recess of the second transfer jig by a predetermined interval. With the alignment object being transferred into a cavity of the first transfer jig, by causing the first transfer jig and the second transfer jig to overlap each other, the alignment object is transferred from the cavity of the first transfer jig to a cavity of the second transfer jig.

1. Field of the Invention
The present invention relates to an aligning device that is used in aligning alignment objects, such as electronic component elements, in, for example, a process for producing an electronic component, such as a multilayer chip ceramic capacitor or a chip inductor, and also relates to a method for producing an electronic component using the aligning device.
2. Description of the Related Art
In recent years, there has been a strong demand for reducing the size, in particular, the thickness (the height) of an electronic chip component. As aligning devices for aligning thin electronic components, for example, an aligning device such as that described in Japanese Unexamined Patent Application Publication No. 2010-278153 is proposed.
That is, Japanese Unexamined Patent Application Publication No. 2010-278153 describes a component aligning device including a component aligning jig that is one including a plurality of accommodation recesses formed in a surface thereof. When a target electronic component has a rectangular parallelepiped shape having a length L, a width W, and a thickness T, among outside surfaces of the electronic component, a surface extending along a lengthwise direction and a widthwise direction is defined as a WL surface, a surface extending along the widthwise direction and a thickness direction is defined as a WT surface, and a surface extending along the lengthwise direction and the thickness direction is defined as an LT surface, the component aligning device is configured as follows. That is, in order for one electronic component to be held in the accommodation recess with one of its WT surfaces being a top surface and with part of the electronic component protruding upward from the accommodation recess, an accommodation recess depth Z is less than the length L of the electronic component; and, in seeing the accommodation recess in plan view, if a shortest distance (which is a distance that is between opposing inner peripheral surfaces of the accommodation recess, that is greater than the thickness T, and that is the narrowest interval) is S, the condition W>S>T is satisfied. Refer to, for example, Claim 1 of Japanese Unexamined Patent Application Publication No. 2010-278153.
In Japanese Unexamined Patent Application Publication No. 2010-278153, in the accommodation recesses of the component aligning jig, in order to form a first stripe-like space and a second stripe-like space that intersect each other when seen in plan view, a plurality of protrusions that protrude towards the inside of the accommodation recesses from inner side surfaces facing the accommodation recesses of the aligning jig are formed. In addition, when the width of the first stripe-like space and the second stripe-like space is X, the relationship W>X>T is satisfied; and when the length of each stripe-like space is Y, the condition Y>W is satisfied. Refer to, for example, paragraph 0015 of Japanese Unexamined Patent Application Publication No. 2010-278153.
However, in the component aligning device in Japanese Unexamined Patent Application Publication No. 2010-278153, when an electronic chip component and a gap between an accommodation recess (in which the electronic chip component is accommodated) and the electronic chip component are increased, not only does positional displacement of the electronic chip component tend to occur, but also the electronic chip component tends to tilt. In contrast, when the gap becomes smaller, the electronic chip component cannot be efficiently transferred into the accommodation recess.
Further, as schematically shown in FIG. 13, when, as a result of entry of foreign material 52 into an accommodation recess 51 of a component aligning jig 50, an accommodated electronic chip component 60 protrudes by a large amount and is considerably tilted, a top end portion 60a of the electronic chip component 60 accommodated in the accommodation recess 51 contacts an inner peripheral surface of a through hole 71 of a guide plate 70 disposed at an upper side of the component aligning jig 50. As a result, for example, cracking and chipping tend to occur.

Aligning device and method for producing electronic component using the aligning device


A fountain roll and assembly for a can decorating apparatus wherein a pan holding a supply of ink is adjustably mounted on a fixed frame so that the level of the supply of ink is generally in a horizontal plane and a fountain roll rotatably mounted in the fixed frame and located so that the lower portion of its outer peripheral surface as it rotates is immersed in the supply of ink and wherein the fountain roll is rotated so that it enters the supply of ink in a generally downward direction and leaves the supply of ink in a generally upward direction. A plurality of doctor blades in a side-by-side contacting relationship are located to remove an excess amount of ink on the outer peripheral surface and to return such excess amount to the supply of ink. The doctor blades are mounted in a unit which is laterally and pivotally adjustable. Also, the doctor blades are individually adjustable in linear directions toward or away from the outer peripheral surface of the fountain roll.

A can decorating apparatus is described and illustrated in U.S. Pat. No. 4,741,266 the disclosure of which is incorporated herein by reference. As illustrated in FIG. 1 of the U.S. Pat. No. 4,741,266, there are a plurality of circumferentially spaced ink transfer roll and fountain stations for supplying ink to separate individual blanket segment means through an equal number of plate cylinder means at six separate inking stations during rotation of the blanket means. Each of these stations has a fountain roll and assembly for receiving and transferring the ink to be used in the can decorating apparatus wherein a fountain roll rotates through a housing having a supply of ink in an upper portion thereof The fountain roll moves through the housing from the upper portion thereof to the lower portion thereof. An adjustable doctor blade is mounted in the lower portion of the housing to remove excess ink from the fountain roll just prior to its exiting the housing. Throughout many years, various problems have been associated with such fountain rolls and assemblies, such as leaking of the ink out of the housing, uneven amounts of ink on the fountain roll and generation of heat which is detrimental to the ink. While many attempts have been made to solve these problems, there exists a need for a good solution.

Fountain roll and assembly for can decorating apparatus