A hybrid circuit within a full-duplex transceiver transmits an outgoing signal outward on a communication channel at the same time it receives an incoming signal arriving via the communication channel, and the outgoing and incoming signals sum to form a combined signal. The hybrid circuit generates both the outgoing signal and a replica of the outgoing signal in response to an input signal, and then subtracts the replica from the combined signal in producing a received signal. The received signal includes a component derived from the incoming signal and a residual echo component having peaks resulting from a phase difference between the outgoing signal and its replica. The transceiver adjustably delays the input signal so that the residual echo component peaks occur at times other then when the received signal is being digitized, thereby minimizing the influence of the echo component peaks on the data sequence.

1. Field of the Invention
The present invention relates in general to a transceiver for concurrently transmitting and receiving signals representing data sequences via the same communication channel, and in particular to a system for reducing effects of a residual echo of the transceiver's transmitted signal within the transceiver's received signal on data sequences the transceiver derives by processing its incoming signal.
2. Description of Related Art
FIG. 1 illustrates a conventional full duplex transceiver 10 for concurrently transmitting and receiving data via analog signals over the same bi-directional transmission line or other type of channel 12. Transceiver 10 converts an input data sequence tx(n) into an outgoing analog signal z(t) transmitted to a remote transceiver (not shown) via channel 12, and processes an analog incoming signal y(t) arriving on channel 12 from the remote transceiver to produce an output data sequence rx(n) matching a data sequence incoming signal y(t) represents.
Transceiver 10 includes an encoder 14 for encoding input data sequence tx(n) into another digital data sequence x(n) indicating the time-varying behavior outgoing signal z(t) must exhibit to represent sequence x(n). A digital-to-analog converter (DAC) 16 converts data sequence x(n) into an analog signal x(t), a line driver 18 amplifies the x(t) signal to produce a signal r0(t), and a hybrid circuit 20 for transmits the outgoing z(t) signal on channel 12 in response to the r0(t) signal.
Hybrid circuit 20 also generates an analog output signal r(t). A variable gain amplifier 21 amplifies the r(t) signal to produce an analog signal r′(t), a low-pass filter (LPF) 22 filters r′(t) to produce an analog "received" signal p(t), and an analog-to-digital converter 24 digitizes the p(t) signal to generate a digital waveform data sequence u(n) representing the behavior of the incoming signal y(t). A summer 26 subtracts a sequence v(n) produced by a digital echo cancellation circuit 27 from the u(n) sequence to produce a sequence w(n) supplied to an equalizer 28, which processes the w(n) sequence to generate a "soft decision" sequence s(n). Data elements of soft decision sequence s(n) represent approximately the same values as corresponding elements of the remote transceiver's x(n) sequence controlling behavior of incoming signal y(t) but with higher resolution. A slicer 30 reduces the resolution of soft decision sequence s(n) to produce a hard decision sequence h(n) matching the remote transceiver's x(n) sequence. A decoder 32 decodes hard decision sequence h(n) to produce the transceiver's output data sequence rx(n) which matches the remote transceiver's input tx(n) sequence.
Outgoing signal z(t) represents data sequences by periodically transitioning between a set of discrete voltage levels in an order controlled by the local transceiver's x(n) sequence. Since incoming signal y(t) is the remote transceiver's outgoing signal, it will also nominally transition between the same set of discrete voltage levels in an order specified by the remote transceiver's x(n) sequence. Since channel 12 attenuates incoming signal y(n), an automatic gain control circuit 31 monitors the u(n) sequence output of ADC 24 and adjusts the gain of amplifier 21 to compensate for the attenuation of the incoming signal. A timing recovery circuit 32 monitors soft and hard decision sequences s(n) and h(n) to determine how to control the phase and frequency of the ADC's sampling clock (CLOCK) so that ADC 24 periodically digitizes the p(t) signal at the appropriate times between its level transitions. Equalizer 28, suitably implemented by a finite impulse response filter, adjusts soft decision s(n) to compensate for inter symbol interference (ISI) distortion in the y(t) signal. An equalization adaptation circuit 34 monitors sequences h(n), s(n) and w(n) to determine how to adjust filter coefficients controlling equalizer 28 so that the equalizer correctly compensates for ISI distortion.
FIG. 2 illustrates line driver 18 and hybrid circuit 20 of FIG. 1 in more detailed block diagram form. Line driver 18 amplifies x(t) to produce the analog signal r0(t) and hybrid circuit 20 couples the r0(t) signal to channel 12 through a resistor R1 to produce outgoing signal z(t). Resistors R2 and R3 couple the inverting input of summing amplifier 40 between the output of line driver 18 and ground to produce a signal r2(t) at the inverting input that is a replica of outgoing signal z(t). Channel 12 is also connected to a non-inverting input of a summing amplifier 40 which generates the r(t) signal supplied to amplifier 21 of FIG. 1. A combined signal r1(t) appearing at the non-inverting input of summing amplifier 40 is of magnitude equal to the sum of magnitudes of outgoing signal z(t) and incoming signal y(t),r1(t)=z(t)+y(t)Ideally the replica signal r2(t) appearing at the inverting input of summing amplifier 40 will match the z(t) component of the r1(t) signal in both phase and amplitude so that when amplifier 40 offsets r1(t) with r2(t), summing amplifier 40 will remove all of the echo of both the outgoing signal z(t) and its replica r2(t) from the hybrid circuit's output signal r(t) so that r(t) will be an accurate representation of incoming signal y(t). Accordingly,when
                              r          2                                  (          t          )                    =                                    z                                      (              t              )                                                                                and                                                                                r              1                                                  (              t              )                                      =                              z                                      (              t              )                                +                      y                                      (              t              )                                                              then            r                    (        t        )              =                                        r            1                                          (            t            )                          -                              r            2                                          (            t            )                                                        =                                    [                                          z                                                  (                  t                  )                                            +                              y                                                  (                  t                  )                                                      ]                    -                      z                                      (              t              )                                                                        =                              y                                      (              t              )                                .                    Thus hybrid circuit 20 ideally cancels z(t) from r(t) to produce a received signal r(t) matching incoming signal y(t). However since the replica signal r2(t) will never exactly match the z(t) component of r1(t) either in amplitude or in phase, it will not entirely cancel the effects of outgoing signal z(t) on received signal r(t). Some amount of residual echo of outgoing signal z(t) will therefore appear as a component of the hybrid circuit's output signal r(t) and can affect the digital waveform data sequence u(n) output of ADC 24 of FIG. 1.
Digital echo cancellation circuit 27 of FIG. 1 processes the x(n) sequence controlling the z(t) sequence to generate a sequence v(n) approximating the residual echo appearing in the u(n) sequence so that when summer 26 subtracts the v(n) sequence from the u(n) sequence, it removes much of the residual echo from the resulting w(n) sequence. An adaptation circuit 36 monitors hard and soft decision sequences h(n) and s(n) to determine how to adjust filter coefficients controlling the manner in which echo cancellation circuit 27 estimates the residual echo.
While echo cancellation circuit 27 is able to adequately compensate for small amounts of residual echo in the u(n) sequence arising from differences in amplitude of outgoing signal z(t) and its replica signal r2(t), it is less adept at compensating for residual echo peaks in the u(n) sequence arising from phase differences between the z(t) and r2(t) signals. Phase differences between the z(t) component of r1(t) and its replica r2(t) arise due to differences in signal path delays from the output of line driver 18 to the inverting and non-inverting inputs of summing amplifier 40. The path delays are functions of path length and impedances and it is difficult to precisely match the delays of the two signal paths, particularly in high frequency applications where small differences in path impedances can result in relatively large phase differences.
FIG. 3 is a timing diagram illustrating an example of the manner in which various signals of FIGS. 1 and 2 may behave. Clock signals controlling operations of the local and remote transceivers are synchronized to the extent that level transitions in the x(t) and y(t) signal components of the r1(t) signal and the level transitions in replica signal r2(t) all occur with the same frequency, but they do not necessarily occur at the same time when viewed at the inputs of summing amplifier 40. In the example illustrated in FIG. 3, the r2(t) and z(t) signal components r1(t) have the same magnitude but differ in phase. The magnitude difference between r2(t) and z(t) peaks during times when r2(t) and z(t) transition and those peaks appear as residual echo components of the r(t) signal input to amplifier 21 of FIG. 1.
The "received" signal p(t) supplied as input to ADC 24 of FIG. 1 is an amplified and filtered version of r(t) and ideally should have an amplitude proportional to y(t). Timing recovery circuit 32 of FIG. 1 adjusts the phase and frequency of the CLOCK signal input to ADC 24 so that the ADC samples p(t) between its transitions. In this particular example, the residual noise peaks in p(t) resulting from the phase difference in between the r2(t) and z(t) signals happen to occur when received signal p(t) is being sampled, and in such case the residual noise due to the phase difference between r2(t) and z(t) has a substantial effect on the value of the u(n) sequence output of ADC 24.
It is possible to reduce the residual echo peaks by reducing differences in path delays between the output of driver 18 and the inverting and non-inverting inputs of summing amplifier 40 so as to reduce the phase difference between r2(t) and z(t). But adjusting signal paths delays to substantially eliminate such phase differences can be difficult, particularly in high frequency applications where very small differences in signal path lengths or impedances can substantially affect phase differences between the r2(t) and z(t) signals. Therefore what is needed is a way to reduce the effect on the output u(n) sequence of ADC 24 of residual echo peaks in the r(t) signal arising from a phase mismatch between the z(t) component of r1(t) and replica signal r2(t).

Residual echo reduction for a full duplex transceiver


The present invention concerns the development of a cell-based assay system having improved sensitivity to HCV NS3 protease activity when compared to known assays, which is useful for screening test compounds capable of modulating (particularly inhibiting) HCV NS3 protease activity. This system provides a first construct comprising a transactivator domain joined downstream of the NS3–5 domains of HCV under the control of a non-cytopathic viral promoter system. A second construct is also provided that comprises a reporter gene under the control of an operator sensitive to the binding of the transactivator. The NS3–5 domains encodes the NS3 polyprotein which comprises: the NS3 protease, followed by the NS4A co-factor, the NS4B and NS5A proteins (including any derivative, variant or fragment thereof), terminated by the NS5B protein (including any derivative, variant or fragment thereof) sufficient to constitute a NS5A/5B cleavage site. The transactivator, when expressed and released from the polyprotein initiates transcription and expression of the reporter gene that is measurable.

Hepatitis C virus (HCV) is the major etiological agent of post-transfusion and community-acquired non-A non-B hepatitis worldwide. It is estimated that over 100 million people worldwide are infected by the virus. A high percentage of carriers become chronically infected and many progress to chronic liver disease, so called chronic hepatitis C. This group is in turn at high risk for serious liver disease such as liver cirrhosis, hepatocellular carcinoma and terminal liver disease leading to death.
The mechanism by which HCV establishes viral persistence and causes a high rate of chronic liver disease has not been thoroughly elucidated. It is not known how HCV interacts with and evades the host immune system. In addition, the roles of cellular and humoral immune responses in protection against HCV infection and disease have yet to be established. Various clinical studies have been conducted with the goal of identifying pharmaceutical compounds capable of effectively treating HCV infection in patients afflicted with chronic hepatitis C. These studies have involved the use of interferon-alpha, alone and in combination with other antiviral agents such as ribavirin. Such studies have shown that a substantial number of the participants do not respond to these therapies, and of those that do respond favorably, a large proportion were found to relapse after termination of treatment. To date there are no broadly effective antiviral compounds for treatment of HCV infection. HCV is an enveloped positive strand RNA virus in the Flaviviridae family.
The single strand HCV RNA genome is approximately 9500 nucleotides in length and has a single open reading frame (ORF) encoding a single large polyprotein of about 3000 amino acids. In infected cells, this polyprotein is cleaved at multiple sites by cellular and viral proteases to produce structural and non-structural (NS) proteins. The structural proteins (C, E1, E2 and E2-p7) comprise polypeptides that constitute the virus particle. The non-structural proteins (NS2, NS3, NS4A, NS4B, NS5A, NS5B) encode for enzymes or accessory factors that catalyze and regulate the replication of the HCV RNA genome. Processing of the structural proteins is catalyzed by host cell proteases. The generation of the mature non-structural proteins is catalyzed by two virally encoded proteases. The first is the NS2–3 zinc-dependent metalloprotease which auto-catalyses the release of the NS3 protein from the polyprotein. The released NS3 contains a serine protease domain at the N-terminal and catalyzes the remaining cleavages from the polyprotein. The released NS4A protein has at least two roles. First, forming a stable complex with NS3 protein and assisting in the membrane localization of the NS3/NS4A complex (Kim et al., 1999) and second, acting as a cofactor for NS3 protease activity. This membrane-associated complex, in turn catalyzes the cleavage of the remaining sites on the polyprotein, thus effecting the release of NS4B, NS5A and NS5B. The C-terminal segment of the NS3 protein also harbors nucleoside triphosphatase and RNA helicase activity. NS5B is an RNA-dependent RNA polymerase that is involved in the replication of HCV.
The N-terminal 180 amino acids of the NS3 protein is a trypsin-like serine protease that mediates as a first step the auto-cleavage of NS3/4A. The membrane associated NS3/4A complex further cleaves NS4A/4B, NS4B/5A, and NS5A/NS5B junctions to release the viral enzymes considered essential for viral replication. The complexing of NS3/NS4A is an important step in the sequential downstream processing of the polyprotein. The NS3 protein is the most thoroughly characterized HCV protein. Kinetic parameters for cleavage of all the processing sites have been described. Both the N-terminal protease and C-terminal helicase domains have been independently crystallized and high resolution three-dimensional models exist for these structures.
NS3 protease activity is an attractive target for drug discovery. Enzymatic studies have shown that peptides based on the N-terminal product of the NS5A/5B cleavage site are competitive inhibitors of the enzyme. These peptides have served as a useful starting point in medicinal chemistry efforts to rationally design NS3 protease inhibitors as clinically effective anti-HCV compounds.
Due to the high incidence of HCV and the consequences of HCV infections, finding therapeutic compounds against HCV has become important. To that end, efforts to discover compounds against HCV have necessitated developing assay systems for screening and selecting anti-HCV compounds.
To date, a convenient cell culture replication system for the HCV virus is not available. This deficiency has restricted most of the HCV inhibitor screening to in-vitro enzymatic assays and indirect surrogate cell-based assay (Lohmann et al. (1999)). This has severely limited the evaluation of potential anti-HCV compounds in cell culture.
Hirowatari et al. (1995) describes the co-transfection of a first plasmid containing the NS2/NS3 domain fused to the NS5A/NS5B cleavage site (substrate for NS3) and the transactivator Tax 1, and a second plasmid containing a reporter gene whose expression is dependent on Tax 1 transactivation. The NS5A/5B site is cleaved by the expressed NS2 or NS3 protease activity thereby releasing Tax 1 to transactivate the reporter gene on the second plasmid. Thus, the amount of the expressed reporter gene is a measure of NS2 or NS3 proteolytic activity. One of the drawbacks is that this system does not distinguish between the activities of the NS2 metalloprotease and NS3 protease activity. In addition, this system does not allow the measure of protease activity of the NS3 protein when complexed with the NS4A domain, a complex that enhances the specificity of the protease. This assay also does not allow one to measure the protease activity in a system that is closest to the natural context of polyprotein processing. Finally, a further drawback resides in the fact that this system is semi-quantitative, therefore not suitable for quantitative high-throughput screening.
Overton, H. et al. (1995), teach a baculovirus-expressed HCV NS3 activity in insect cells. A series of baculovirus constructs designed to express NS3 protease activity and different substrates are described. Constructs encoding partial NS2/NS3 and NS3/NS4A/NS4B are transfected into an insect cell line. Additional viral constructs encoding NS3 to NS5A and NS5A/5B are transfected alone or together with one of the above constructs. The expressed and cleaved products are visualized immunologically by Western analysis. Some of the deficiencies in this system relate to the use of an insect instead of a mammalian cell line, as well as the requirement for viral infection, an event that may further disrupt the normal functions of the cell. This system also employs the T7 polymerase expression system, a system that is not necessary for the system of the present invention. In addition, the method for detection of the cleavage products is lengthy, difficult to quantify with precision and not amenable to high throughput scale.
Song et al., (1996) described a protease assay system utilizing a lexA-GAL4 fusion protein in yeast. The authors describe inserting the NS3 protease and a cleavage site between the lexA-DNA binding domain and the transcriptional activating domain of GAL4. Cleavage of that site by NS3 protease renders GAL4 transcriptionally inactive leading to the inability of the transformed yeast to synthesize β-galactosidase. This system lacks the NS4A and does not reproduce processing in the context of the HCV polyprotein.
Cho, Y. G. et al., (1997), teach an assay using the sindbis viral replication system. This hybrid virus construct encodes the HCV NS3/NS4A protease region linked to SIN core proteins by the NS4A/NS4B cleavage sequence. Assembly of viral particles in a mammalian cell line is dependent on the processing of the NS4A/4B cleavage site. One major drawback of this system resides in that the HCV protease activity produces chimeric virus that induce cytopathic morphological changes in cells. Measurement of the pH change of the media constitutes a semi-quantitative way of measuring these changes at best. A further drawback in this system is that the sindbis core protein contains a natural serine protease cleavage site similar to the NS3 site thus making this system of limited use for screening potential protease inhibitors. Cho, Y. G. et al., (1998), teach an expression vector encoding the NS3/NS4A region and the NS4A/4B cleavage site fused to the SEAP (secreted alkaline phosphatase) gene, transfected into a mammalian cell line. Cleavage of the NS4A/4B site by NS3 protease releases SEAP protein into the media. The amount of SEAP protein in the media is a measure of NS3 protease activity. One drawback of this system lies in the fact that the reporter molecule is directly fused to the substrate protein and may therefore affect the natural conformation of viral complex proteins (NS3/NS4A). A further major drawback resides in the fact that the amount of reporter protein secreted is in direct proportion to the amount of protein expressed and cleaved in the system (1 substrate molecule cleaved=1 reporter molecule secreted). Since the HCV polyprotein is a system that is expressed at very low levels (even in its natural context), the signal observed is too low to be carried out on a large screening scale.
WO 98/00548, describes hybrid viruses comprising a picornavirus, preferably poliovirus, HCV NS3 protease domain and a single NS3 protease target site. These chimeric viruses are engineered such that the proteolytic processing activity of HCV NS3 is essential for viral viability and proliferation. Various hybrids, each having a different NS3 cleavage site (NS5A/NS5B, NS4A/NS4B or NS4B/NS5A) are taught. Viability, is measured by the viral titer using the plaque assay on HeLa monolayer cells. Once again this system does not provide quantifiable means for screening large numbers of potential inhibitors in a high throughput fashion and does not provide for screening of NS3 protease activity in the natural context of the polyprotein segment.
U.S. Pat. No. 5,861,267 by Vertex discloses a method for assaying HCV NS3 protease that utilizes expression of the NS3/NS4A region and the NS4A/NS4B cleavage site fused to the secreted IL-1β reporter (interleukin-1β). Cleavage at the NS4A/4B site by the NS3 protease releases IL-1β into the medium which permits a direct measure of NS3 protease activity. This system examines inhibition of NS3 cleavage at a cleavage site adjacent to the NS3/NS4A complex, a situation that does not represent or replicate the authentic conditions of multiple sites of polyprotein processing present in infected cells. In addition, this system provides a reporter system where the signal measured is in direct proportion to the amount of protein expressed in the system and the amount of protein cleaved, once again giving rise to a signal too low to be carried out on a large screening scale.
WO 00/08469 by Agouron discloses a further system comprising a protease-reporter construct consisting of the NS2 metalloprotease, the NS3 protease, the NS4A co-factor and different variations of truncated NS4B and 5A, preceding the NS5A/5B cleavage site. This system however, does not disclose the importance of having a full polyprotein for optimizing the NS3 protease activity/specificity. In addition, this system requires infection by a vaccinia virus vector, a factor that mitigates the host cell integrity and may affect the mechanism of cis or trans protease cleavage during polyprotein processing events in the assay. A further drawback of using the vaccinia expression lies in the fact that the cells in the assay become necrotic after about 24 hours, thereby limiting the use of this assay for longer term kinetic assays.
WO 00/12727 by Vertex discloses a system having a fusion protein comprising a ligand binding domain, a DNA binding domain that can bind to a ligand-response element causing the VP16 activation domain to regulate expression of a reporter gene. A NS5A/5B cleavage site is inserted within that fusion protein and modulates the reporter gene expression upon cleavage by the NS3/4A protease which is expressed from a separate construct. Once again, this system does not disclose the importance of having a full polyprotein for optimizing the NS3 protease activity/specificity.
It has therefore become important to develop an assay for screening large numbers of anti-HCV compounds, with the capacity to scale up to a high throughput system. The present invention therefore provides an assay that is easy to perform, reliable, sensitive and reproducible on large scale.
It is therefore the purpose of this invention to provide a cell-based system and assay having improved sensitivity for measuring inhibition of the HCV NS3 protease activity, this assay being designed to concurrently test the protease activity in a construct that reproduces as much as possible the NS3 polyprotein processing events occurring in infected cells in the course of HCV disease.
The present application refers to a number of documents, the content of which is herein incorporated by reference.

Surrogate cell-based system and method for assaying the activity of hepatitis C virus NS3 protease


Finely divided aerated concrete is added as a stabilising additive to composite bituminous material for the production of cast and rolled asphalt. This additive, which is preferably applied in a quantity of 0.3% to 10% by weight, is not inferior to known additives, and is superior to many of them, but is inexpensive as compared with known additives.

A conventional road surface comprises three courses, namely the bottom base course, the middle binder course and the top wearing layer, which differ in their composition and thus in their pore contents. Whereas the wearing course has a pore content of about 2.5% to 3% by volume, the pore content of the binder course lies within the range from about 5% to 7% by volume, the base course having a pore content within the range from about 10% to 12% by volume. The wearing course essentially provides a seal and should accordingly be as far as possible dense and impervious to water. The base course is essentially for supporting axle loads and the binder course is mainly for bearing tangential stress generated by moving traffic. The binder course commonly comprises a high proportion of chippings within the range of about 65% to 75% by weight. The composite material for the wearing course has the highest binder content, about 5.7% to 9% by weight of bitumen and the lowest proportion of chippings, about 30% to 60% by weight. "Chippings" may be defined as having a particle size greater than about 2 mms. By comparison, sand has a particle size of about 0.09 to 2 mms. Finally, the charge or filler, commonly a fine rock powder, has a particle size smaller than 0.09 mm.
Stabilising additives such as organic and inorganic fibrous substances, with or without admixtures of inorganic materials, native asphalt, diatomaceous earth, fossil meal, trass or volcanic tuff, artificial and natural silicic acids, synthetic resins and polymer-modified bitumen (PmB), may be added to prevent track furrows and thereby to improve the stability of asphalt coatings, as referred to in "Complementary Technical Regulations and Directives for the Construction of Bituminous Roadway Surfaces"-ZTV to StB 84.
These additives in bituminous composition material for the production of cast and rolled asphalt stabilize, that is to say improve the resistance to deformation of, cast and rolled asphalt, and thus improve the reinforcement of the mortar contents. Such additives, which may be described as reinforcing agents, bind bitumen by virtue of their very large specific surface area and thereby greatly increase the "internal friction" between particles of inorganic substance and bitumen films.
The additives primarily used are disadvantageously costly.
An object of the invention is, therefore, to provide a stabilising additive for composite bituminous material for the production of cast and rolled asphalt, which is more economical than the additives referred to above, but which is equally, or indeed more, effective.


An optical fiber package (20) is provided by winding a plurality of convolutions in a plurality of layers on a bobbin. To each layer is applied an adhesive material (45) which in a preferred embodiment is a mixture comprising a relative silicone copolymer resin, a solvent system which includes an aromatic constituent, a catalyst and a wetting agent. The mixture has a modulus behavior which is relatively stable with respect to time throughout a relatively wide operating temperature. Inasmuch as the solvent system and the method of application of the mixture are effective to control the rate of precipitation and the rate of cure of the silicone constituent, the surface roughness of the convolutions is controlled. After the desired number of convolutions have been wound, the package is subjected to a heat treatment which relieves stresses in the wound fiber and which completes the cure of the adhesive material. The adhesive material is effective to hold the convolutions together sufficiently to allow transport and deployment and to allow the convolutions constantly to be payed off over a relatively wide temperature range and over a relatively wide range of payout speeds without the use of excessive force and without breakage.

After only a somewhat recent introduction, optical fiber has had a meteoric rise as the predominant means of transmission media in voice and data communications. Optical fiber is manufactured by drawing the fiber from a preform which is made by any of several well known processes. Afterwards, or as part of a tandem process, the drawn fiber is coated, cured, measured and taken up, desirably in an automatic takeup apparatus, on a spool to provide a package. Typically, an optical fiber has a diameter on the order of 125 microns, for example, and is covered with a coating material which increases the outer diameter of the coated fiber to about 250 microns, for example. Methods and apparatus for taking up optical fiber are disclosed and claimed in U.S. Pat. No. 4,798,346 which issued on Jan. 17, 1989 in the names of D. L. Myers and J. W. Wright.
An optical fiber package is used in operations such as ribboning, cabling, and rewinding and is used to ship optical fiber to other companies which further process the fiber. The optical fiber typically is used in voice and data communications systems, both commercial and military. For example, the package may be used in weapons systems in which it is used for guidance and for data communications. Such uses include communication lines between aircraft, between an aircraft and a ship, and between a projectile, such as a missile, and a control station at a launch site, for example. Optical fiber provides the advantages of increased data bandwidth, reduced weight and greater range than wire-guided systems of the prior art.
There are, however, certain disadvantages, not present in other forms of communication, in using optical fiber. Optical fiber is less robust than metallic conductors, rendering it subject to breakage. Aside from breakage, optical fiber communication performance may be degraded by microbends in the fiber which are generated by bending or by other stresses to which the fiber may be subjected. Such damage to an optical fiber not only reduces the long-term durability of the fiber, but also causes losses in the strength and in the content of the optical signal. Likewise, physical or optical integrity may be affected adversely by any sharp bends which are experienced as the fiber pays out from its packaged configuration.
A typical optical fiber application in a weapons systems involves the packaging of a continuous length of optical fiber on a bobbin which is positioned inside a vehicle. Such a vehicle commonly is referred to as a tethered vehicle. One end of the fiber is attached to operational devices in the vehicle, whereas the other end of the fiber is connected to a control or communications station at a launch site. During and after launch, two-way communication with the vehicle is conducted.
In order to use such an arrangement, there must be provided a reliable and compact package of the optical fiber which may be disposed within the vehicle and which will permit reliable deployment of the optical fiber during the flight of the vehicle. The use of metallic conductors for guidance or control of launched vehicles is known. Although the art teaches the use of bobbins on which a metallic conductor is wound, the fragility of optical fiber requires specialized treatment that facilitates the unwinding of the optical fiber from its bobbin at a relatively high rate of speed.
One problem is that extremely long lengths of fiber may be required. These may be obtained by splicing a plurality of lengths. Typically, the original coating material is removed from an end portion of each of the two coated fibers to be spliced. The removal is such that the end of the coating material remaining on the end portion is a surface which is normal to the axis of the fiber. The recoating material contacts the adjacent originally coated portions of the spliced fibers along those normal surfaces and along overlapping portions of the outer surface of the original coating material adjacent to the normal surfaces. The coating material is then cured to yield a recoated splice section with a transverse cross section which is larger than that of the optical fiber having the original coating material thereon.
For tethered vehicles, the winding of the optical fiber on the payoff device must be accomplished in a precise manner. Otherwise, payoff could be disrupted. It has been found that if the cross section of the recoated portion transverse of the longitudinal axis of the optical fiber is not the same as that of the optical fiber as originally coated, the winding pattern on the payoff device in all likelihood is not uniform. This will cause problems in fiber payoff following the launch of the tethered vehicle.
Another problem in the optical fiber guidance of tethered vehicles relates to the successful unwinding of the fiber from a bobbin as the bobbin is propelled along with the vehicle. In optical fiber packages for use in tethered vehicles, as many as at least thirty layers of optical fiber are wound on a guiding structure. The leading end of the optical fiber is connected to a guidance system for controlling the path of travel of the vehicle. It becomes important for the optical fiber to be payed off from the bobbin without the occurrence of snags, or tight bends, otherwise the fiber may break or the signal may be attenuated and the control system rendered inoperable. Contributing to the successful payout of the optical fiber is a precision wound package. Not only must the convolutions be wound with precision, they also must remain in place as wound during handling and during deployment. In other words, the optical fiber package must be a highly stable one.
An adhesive material between the optical fiber turns on the bobbin must function to hold the package together, forming a stable structure which is resistant to environmental extremes, shock and vibration. On the other hand, payout must occur easily without the necessity of high pulling forces to remove each convolution of fiber from the package. Desirably, the adhesive material which is used to hold together the convolutions must have a minimal impact on the optical performance of the wound fiber, and yet it must allow the optical fiber to be payed out with a controlled force at the peel-off point as each successive outermost turn is unwound at high speed. These requirements of stability and ease of payout present somewhat conflicting requirements for the adhesive system.
During storage and transport of the bobbin, mechanical stability is most important as the adhesive adds integrity to the wound package, thereby maintaining the package in a ready condition for deployment. During deployment, both mechanical and optical effects are significant. The adhesive system must provide tack which is sufficiently low to permit a helical pattern of payout at potentially high speeds, possibly approaching or exceeding Mach 1. Excessive tack threatens fiber integrity by forming an extreme bend at the peel-off point. On the other hand, not enough tack may result in failure through dynamic instability on the bobbin. With respect to optical performance, optical attenuation at the peel-off point may occur through localized macrobending, degrading the integrity of data and video transmission. Also, microbending in the layers of undeployed fiber on the bobbin during deployment can affect adversely optical performance.
It has been found that the adhesive material can contribute significantly to attenuation increases, especially at lower temperatures. Total permissible losses must be maintained within system limits set by the transmission opto-electronics over a specified operational temperature range, for example from -25.degree. to 60.degree. C. Typical initial optical fiber losses may comprise a portion of the attenuation budget, emphasizing the need to keep additional attenuation-inducing effects low for increased range.
The primary mechanism for adhesive-induced attenuation is believed to be the quality of the surface of the adhesive material which has been applied to the fiber layers. A rough surface, for example, causes microbends on the optical fiber in engagement with the rough surface because of the pressures developed during winding. These microbends are intensified as the adhesive material and the optical fiber coating stiffen with decreasing temperature.
Current techniques for providing a guided vehicle which includes such a stable package include the coating of each layer of fiber convolutions after they have been wound on the bobbin. In the prior art, at least one system includes a spraying apparatus. The apparatus is used to apply a liquid adhesive material to the optical fiber convolutions as they are wound on a bobbin. In the development of optical fiber use for tethered vehicles, a polychloroprene rubber cement adhesive material has been used. Problems have been encountered with that material insofar as aging characteristics and attenuation performance over a wide temperature are concerned.
What is needed and what has not been available in the prior art is a guided vehicle system which includes a bobbin of precision wound optical fiber in which the convolutions of fiber are held together by an adhesive material. The adhesive material should be such that it stabilizes the package yet permits payout at relatively high speeds. And, importantly, the surface portion of each convolution which is coated with the adhesive material must not be too rough, thereby avoiding microbending of the optical fiber.


A heat exchanger is provided with a cooling fin including a plurality of fin portions and a base portion supporting the fin portions, and a plurality of pins press-fitted into the fin portions. In the heat exchanger the pins each having a wider width than each space between the fin portions formed in advance in parallel straight shapes are press-fitted into the spaces in a direction from a top end of each fin portion toward the base portion. Accordingly, the fin portions are formed into corrugated shapes by plastic deformation, thereby fixing the pins between the fin portions in positions apart from the base portion. In each space the pins are arranged at intervals in a longitudinal direction of each space. The pins arranged in adjacent spaces are placed with a displacement in alternating pattern.

A power converter to be mounted in a hybrid electric vehicle, an electric vehicle, and others is conventionally arranged to include a semiconductor device and an electric component for power conversion. Since the semiconductor device and others generate a large amount of heat during operation, the converter is provided with a cooling device to ensure heat dissipation characteristics. Herein, the cooling device is configured to contain heat dissipating fins in a cooling case and cause a coolant (a cooling medium) to flow in the cooling case to dissipate the heat generated in the semiconductor device and others into the coolant through the heat dissipating fins. This type of heat dissipating fins is disclosed in for example Patent Literature 1 listed below in which a plurality of heat dissipating fins are formed in parallel to a heat dissipating base plate.
Herein, as a technique to enhance a cooling performance of the heat dissipating fins (the cooling fin) as mentioned above, the present applicant has proposed a new "cooling fin and a method of manufacturing the cooling fin" and already filed a patent application thereof (e.g., Japanese patent application No. 2007-322831). This cooling fin integrally consists of a plurality of fin portions arranged in rows and a base portion that supports the fin portions. The shape of each fin portion in the coolant flowing direction is designed so that a root portion continuous to the base portion is straight and an edge portion is wavy or corrugated. To manufacture this cooling fin, firstly, the fin portions and the base portion are integrally formed by extruding into a comb-teeth and straight shape. Secondly, the edge portions of the fin portions made in straight shapes by extrusion are bent by a jig (pins) in a direction perpendicular to the extruding direction. This bending work is performed by inserting the jig (pins) into spaces or clearances between the fin portions. By this bending, the edge portions of the fin portions are corrugated along the coolant flowing direction.

Heat exchanger and method of manufacturing the same


A transfer board includes an upper transfer surface, a lower surface, a first end and a second end. A hook extends from the first end and is removably securable around an interior rim of a toilet seat or bowl. A latch extends from the lower surface of the transfer board proximate the first end to assist in securing the transfer board to the toilet seat.

1. Field of the Invention
The present invention is directed to a transfer board. More particularly, the invention is directed to a transfer board that is adapted to be removably secured to a toilet or the like.
2. Reference to Related Art
It is sometimes necessary for physically handicapped individuals to utilize a device that assists them in carrying out daily tasks. One such device is the well-known wheelchair. Another such device is a transfer board. A transfer board, as the name implies, is used to create a bridge between two surfaces (e.g., between a bed and a wheelchair). Transfer boards are typically constructed to have a planar surface and a generally rectangular shape. However, the basic design has undergone a variety of modifications and improvements.
For example, U.S. Pat. No. 5,067,188 discloses a sliding transfer device that includes a lower support plate and an upper seat that is designed to slide across a top surface of the lower support plate. The lower support plate can be straight, curved or S-shaped.
Another reference is U.S. Pat. No. 4,287,619 that discloses a multipurpose chair for the partially disabled. The chair is adapted to be used over or as a toilet and includes armrests that may be utilized as transfer boards.
Still another reference is U.S. Pat. No. 6,036,216, which discloses a transfer board in combination with an armrest of a wheelchair. The combination of the armrest and transfer board allows unrestricted movement of the transfer board relative to the wheelchair while maintaining a linkage between the wheelchair and the transfer board.
Despite the variety and availability of transfer boards, the prior art does not disclose a transfer board that is designed to assist a physically handicapped person to transfer from a wheelchair, or other surface or device, over to a conventional toilet. Such a device would have the advantage of allowing the handicapped individual to utilize a conventional toilet facility without the need for a special chair or other outside aid.
The present invention concerns a transfer board having a body. The body of the transfer board includes an upper transfer surface, a lower surface, a first end and a second end. The body can be cast or molded in a number of shapes, such as a rectangle, bowed or arched or a v-shape. The upper transfer surface is smooth and can include a rib of a low friction material (e.g., ultra high density plastic).
A hook extends from the first end that is removably secureable to an interior rim of a toilet seat or bowl. The hook has an interior surface and can have a shape that is rounded or that of a squared bracket.
A latch extends from the lower surface of the body proximate the first end and can engage an exterior rim of the toilet seat or bowl such that it assists in securing the transfer board to the toilet seat or bowl. The latch can be constructed such that it is movable along a track and between first and second positions.
Finally, a biasing member that is adapted to engage an upper surface of a toilet seat or toilet bowl can be positioned on the interior surface of the hook.


According to an aspect of an embodiment, a method of controlling a first information apparatus connectable to a second information apparatus having a display, the second information apparatus being capable of reproducing video image based on video information obtained from a remote source independently from the first information apparatus, the method has storing command code information of the second information apparatus in association with identification information of the second information apparatus, receiving a command indicating a power-on operation of the second information apparatus while the second information apparatus is connected to the first information apparatus, executing a software program upon confirmation of the command indicating the power-on operation of the second information apparatus in reference to the command code information and outputting image data produced by the software program to the second information apparatus so as to display an image corresponding to the image data on the display.

The present art relates to an information apparatus for reproducing content,
There is an information apparatus for executing a software program for reproducing content. A user can view or listen to arbitrary content on a computer by running the application software on the computer and giving a content-reproduction instruction to a function realized by the application software.
By interconnecting an audio/video-signal output terminal of such a computer and an audio/video input terminal of a typical television apparatus, the user can also view/listen to, on the television apparatus, content that is reproduced on the computer by the application software.
However, when a television apparatus is used to view/listen to content reproduced on the computer by the application software, the user has to power on both the computer and the television apparatus and also has to perform an operation for launching the application software.
There are Japanese Laid-open Patent Publication No. 2006-268863, Japanese Laid-open Patent Publication No. 2005-136486, Japanese Laid-open Patent Publication No. 11-015590 and Japanese Laid-open Patent Publication No. 06-292266.

Method of controlling first information apparatus connectable to second information apparatus


A production functional test for hydraulic brake control and traction control units which utilizes compressed air as a test medium. Compressed air is applied to an external port of a hydraulic brake or traction control unit which includes valves, accumulators and a positive displacement pump driven by an electric motor connected by internal passageways. The air pressure at another external port is monitored while the various components are exercised according to a test sequence. The monitored pressure must be within predetermined limits at various points of the test to demonstrate that the brake control unit is functioning properly. Air flow rates and pump motor current are also measured at specific points in the test. The test method can identify incorrectly sized and installed components.

The present invention relates generally to testing of hydraulic components and, in particular, to air testing vehicle hydraulic brake components such as those found in vehicle anti-lock brake and/or traction control systems.
Anti-lock brake and traction control systems are becoming increasingly popular with purchasers of vehicles. Generally, anti-lock brake systems include sensors for monitoring the speed of the controlled wheels and a Central Control Unit (CCU) to determine when an impending wheel lock-up condition is present during vehicle braking. When a predetermined slippage has been detected at the controlled wheels, the CCU functions to control the application of hydraulic pressure to the associated brakes to prevent lock-up of the controlled wheels.
Typically, the Anti-lock Brake System (ABS) includes solenoid actuated valve means for cyclically relieving and reapplying hydraulic pressure to the associated brakes. The valve means operate to limit wheel slippage to a safe level, while continuing to produce adequate brake torque to decelerate the vehicle as desired by the driver. When reapplying pressure, the valve means are supplied pressurized hydraulic fluid from a positive displacement hydraulic pump or the brake system master cylinder. The ABS can also include hydraulic fluid storage reservoirs, or accumulators. Check valves can also be included to control the direction of flow of hydraulic fluid within the system. Traction Control Systems (TCS) typically include additional valves for applying braking force to reduce wheel spin upon a slippery surface and thereby redistribute the power being delivered between the driven wheels.
Typically, the solenoid valves, pump, accumulators and other components, or subassemblies, are assembled in an ABS and/or TCS Hydraulic Control Unit (HCU). The HCU includes internal passageways which provide communication between the different system components contained therein. External ports formed in the HCU allow connection of hydraulic lines for communication with a conventional brake master cylinder and the wheel brakes.
It is known in the art to functionally test assembled HCUs to confirm correct assembly thereof before shipping to vehicle manufacturers. The functional tests also are designed to assure that the HCUs conform to operational specifications. Such prior art tests typically consist of mounting an assembled HCU upon a test stand, filling the HCU with hydraulic fluid, connecting the HCU external ports to test equipment and electrically connecting the HCU to a CCU. The CCU exercises the HCU components to simulate anti-lock braking or traction control cycles while various hydraulic pressures are measured by the test equipment and compared to specified limits.
Functional tests utilizing hydraulic fluid as a test medium tend to be time consuming, requiring evacuation of all air from the HCU to assure accurate test results. It is necessary to control the hydraulic fluid temperature, avoid aeration of the hydraulic fluid and prevent fluid contamination with small particles of dirt or metal.
Functional testing using hydraulic fluid involves a closed test loop during which the fluid is recirculated within the HCU. Under these conditions, it has been found that the CCU can modify the performance of one component in the HCU to compensate for another slightly defective component. This can effectively mask a defect which potentially can develop into a more serious problem during operation of the HCU on a vehicle. In a similar manner, the CCU also has, under test conditions, compensated for incorrectly sized components that were mistakenly installed in the HCU. Furthermore, it has been found difficult to remove all hydraulic fluid from the HCU after testing for shipping the unit to the vehicle manufacturer. Residual fluid in the HCU will tend to cause evacuation and fluid fill problems at the customer's assembly plant.

Method for air testing hydraulic brake components


A method of fabricating a semiconductor package is provided, including: disposing a semiconductor element on a carrier; forming an encapsulant on the carrier to encapsulant the semiconductor element; forming at least one through hole penetrating the encapsulant; forming a hollow conductive through hole in the through hole and, at the same time, forming a circuit layer on an active surface of the semiconductor element and the encapsulant; forming an insulating layer on the circuit layer; and removing the carrier. By forming the conductive through hole and the circuit layer simultaneously, the invention eliminates the need to form a dielectric layer before forming the circuit layer and dispenses with the conventional chemical mechanical polishing (CMP) process, thus greatly improving the fabrication efficiency.

1. Field of the Invention
The present invention relates to semiconductor packages and methods of fabricating the same, and, more particularly, to a wafer-level semiconductor package used for 3D packaging and a method of fabricating the same.
2. Description of Related Art
Wafer level packaging (WLP) involves packaging and testing integrated circuits at a wafer level. After a WLP process, wafer dicing can be performed to obtain a plurality of WLP packages substantially of the same size as dies. Since having advantages of small size and good electrical performance, the WLP packages have been widely applied to meet the miniaturization requirement of electronic devices.
Generally, WLP packages have fan-in and fan-out structures that meet the requirement of I/O counts and ball pitches. Further, by using through silicon via (TSV) or plated through hole (PTH) technologies, 3D WLP packages have been developed to meet the continuously increased density of circuits and miniaturization of package sizes.
Referring to FIG. 1A, to fabricate a conventional semiconductor package 1, a plurality of through holes 120 are formed in an encapsulant 12 encapsulating a plurality of semiconductor elements 10.
Referring to FIG. 1B, a plurality of conductive through holes 15 are formed in the through holes 120 by electroplating.
Referring to FIG. 1C, a dielectric layer 16, a circuit layer 17 and an insulating layer 18 are sequentially formed on the encapsulant 12.
However, an overburden may occur on the encapsulant during formation of the conductive through holes, and a metal layer may be formed on exposed conductive pads of the semiconductor elements. As such, a chemical mechanical polishing (CMP) process must be performed to remove the metal layer on the conductive pads so as to prevent short circuits from occurring between the conductive pads, thereby increasing the fabrication cost. In addition, since a redistribution layer (RDL) requires forming a dielectric layer before forming a circuit layer, the fabrication cost is further increased.
Therefore, there is a need to provide a semiconductor package and a fabrication method thereof so as to overcome the above-described drawbacks.

Method of fabricating a semiconductor package

Siliconware Precision Industries Co., Ltd.


An isolated peptide of 12-20 amino acids in length comprising the amino acid sequence SEQ ID NO:1, wherein the serine residue (S) at position 8 of SEQ ID NO:1 is phosphorylated, is provided. Also provided is a human monophosphorylated alpha-enolase isoform wherein the serine residue (S) at position 419 of the human alpha-enolase amino acid sequence (SEQ ID NO:2) is phosphorylated and in which other post-translational modifications may be present. Further provided are antibodies capable of specifically binding the peptide and/or the isoform of the invention. The peptide, the isoform and the antibodies of the invention may be used in the diagnosis and/or amelioration and/or treatment of pancreatic adenocarcinoma.

PDAC is the most frequent pancreatic carcinoma and is the fourth cause of death in United States and Europe. Most of the patients die within twelve months and the survival percentage at five years from diagnosis is 2%. Pancreatectomy remains the main treatment for PDAC, but the benefits thereof are restricted to 20% of the cases in which diagnosis was made at an early stage. Despite the improvements occurred in medical and surgical treatments, including the use of monoclonal antibodies, vaccines and chemotherapy, very few biomarkers are hitherto available for PDAC diagnosis and prognosis, which on top of that are poorly reliable. The most used serological PDAC biomarker is the sialylated antigen from the Lewis blood group CA19.9, which is mainly used for monitoring the response to therapy. This antigen can effectively be present at high concentrations even in the serum of patients with benign pancreatic diseases, such as chronic pancreatitis and biliary obstruction, which results in false positives. Furthermore, this antigen is not expressed in 5-10% of the population and therefore is not suitable to be used in all PDAC patients.
For these reasons, alternative biomarkers for diagnosing PDAC are under examination. Identifying a biomarker that is reliable and usable in a high percentage of patients would allow to decrease the use of invasive procedures, such as biopsy collections and histopathologic examinations. A biomarker with these features could also be used for identifying and assessing novel drug candidates for PDAC treatment.
Large-scale analysis for protein and RNA expression is among the recently used technologies for identifying potential PDAC biomarkers. In particular, proteomic technologies have been used to identify antigens capable of inducing an antibody response in PDAC patients. This has been done by analysing protein profiles separated by two-dimensional electrophoresis (2-DE), recognised by serum from PDAC patients and subsequently identified by mass spectrometry. By characterising the B cell repertoire against antigens specifically expressed by tumour cells (the so-called Immunoma of human cancer), it may be possible to define specific targets that are involved in tumour immuno-survey and immuno-editing and understand the mechanisms responsible for uncontrolled cell proliferation and metastases.
Certain authors suggested that immunotherapy may be a practicable approach for pancreatic cancer. Actually, PDAC-specific protein lists have been generated on the basis of their high expression at the RNA level (WO2004/055519), or on the basis of large-scale proteomic or serological-proteomic analyses, by using sera from PDAC patients. However, as far as the inventors know, none of these proteins has been concretely proven useful as a specific diagnostic reagent for PDAC.
In the International Patent Application WO 2008037792, the existence of six different phosphorylated human alpha-enolase isoforms (ENOA1-6) is reported and the use of one of these isoforms, phosphorylated at least in three positions, is claimed for PDAC diagnosis. The description of WO2008037792 shows experimental data concerning the analysis of the phosphorylation of the ENOA3 isoform, but this isoform is actually not related to PDAC. By contrast, the isoforms ENOA1 and ENOA2—related to PDAC—have not been sufficiently characterised in structural terms and no unequivocal criterion is provided in order to distinguish them from non-PDAC related isoforms.
Therefore, a need remains to detect and characterise a biomarker that is specific and reliable for early PDAC diagnosis, designed to distinguish this serious tumour pathology from other pathologies.

Isolated monophosphorylated peptide derived from human alpha-enolase useful for diagnosis and treatment of pancreatic adenocarcinoma, antibodies directed against the said monophosphorylated peptide, and uses thereof


A method of reworking an electrical multilayer interconnect in which the electrical lines can be protected by an overcoat. The method includes removing a defective metallization layer from the top of an interconnect substrate, depositing an electrically conductive layer on the substrate, forming a base plating mask on the electrically conductive layer, plating a copper base into an opening in the base plating mask onto the electrically conductive layer, stripping the base plating mask, forming a pillar plating mask on top of the copper base, plating an electrically conductive metal pillar into an opening in the pillar plating mask onto the top of the copper base, stripping the plating mask, and stripping the electrically conductive layer below the stripped base plating mask. Additionally, a protective overcoat layer can be deposited on the exposed copper surfaces.

Advances in integrated circuits used in high performance systems have created a demand for higher density electrical interconnections to accommodate large numbers of inputs and outputs. Methods of manufacturing high density interconnects are known to those having skill in the art, as described in U.S. Pat. No. 4,810,332 which issued Mar. 7, 1989 and in Jensen et al., "Copper/Polyimide Materials for High Performance Packaging, IEEE Transactions on Components, Hybrids, and Mfg. Tech., vol. CHMT-7 #4, pp. 383-393 (December, 1984). Fabrication of such high density interconnects will invariably include a certain percentage of defective units, for instance from shortcircuited connections or from electrical openings. These defects are usually detected during manufacturing by mechanical, optical, or voltage contrast electron beam testing. Various options are available to rework defective interconnects. A short-circuit could be severed by a laser beam or an ion beam. An open line could be closed by laser deposition, laser chemical vapor deposition, chemical vapor deposition, or ink jet metal deposition.
Copper is the preferred conductor for such high density multilayer interconnects. One drawback of copper is that it is very subject to corrosion and oxidation. To fabricate and rework reliable multilayer copper interconnects, the copper can be protected by other materials.

Method of reworking an electrical multilayer interconnect

Microelectronics and Computer Technology Corporation


A system includes a first machine having a first bail member and a first push bar, at first end. The first bail member includes a first hydraulic cylinder. A first hook and second push bar, at second end. The second push bar includes a second hydraulic cylinder in fluid communication with first hydraulic accumulator. The second machine having second bail member and first push bar, at first end. The second bail member includes third hydraulic cylinder in fluid communication with second hydraulic accumulator. A second hook and second push bar, at second end. The second push bar includes fourth hydraulic cylinder. The first hook coupled to second bail member and second push bar of first machine is in mechanical contact with first push bar of second machine. The impact energy generated at beginning of push operation and pull operation is stored in first hydraulic accumulator and second hydraulic accumulator respectively.

Earth moving machines such as track type tractor, wheeled scraper etc. are employed in various industries, such as agriculture, construction, and mining. These machines are utilized for a variety of tasks such as for excavating, hauling, pushing material, and dumping excavated material, and are affected by working conditions of a work site. For example, when the machines are utilized for pushing materials such as heavy rocks then it may take long time for a machine to push materials, thus, leading to a decrease in productivity and/or efficiency of tasks.
In order to increase the productivity and/or the efficiency of the tasks, typically, another machine is used in collaboration with a first machine. For example, in a case, when the first machine is facing difficulty in pushing the materials such as heavy rocks, another machine is utilized which may either push the first machine by engaging at the rear of the first machine, or may pull the first machine by engaging at the front of the first machine. In order to fulfill the collaboration between two machines or among multiple machines, the coupling assembly (e.g. hitch, hook, bail or pushing pad) are installed on the earth moving machines. However, the contact between two machines, during collaboration, is difficult to control. The uncontrolled contact increases fatigue in machine components and decreases useful life of machines. Moreover, the unpredictable load condition during a loading process can also result in sudden uncontrolled contact between the machines working in collaboration. Currently, such uncontrolled contacts between the machines are controlled by various techniques such as by careful maneuvering of the two machines, or by the coupling assembly. But, such techniques do not eliminate the uncontrolled contacts between the machines which results in large impact force and affect the machine productivity. Therefore, the current techniques fail to control the impact force. Also, the impact energy, arising out of uncontrolled contacts, is wasted and results in fatigue of the machine components, and decreases the useful life of machines.
U.S. Pat. No. 8,170,756, hereinafter referred to as '756 reference, discloses an excavating system utilizing a machine-to-machine communication system for a fleet of machines, including at least two machines to effect controlled contact between at least a first machine and a second machine. The controlled contact is achieved by decreasing either the speed of the first machine or the speed of the second machine, and thus affects machine productivity. Moreover, the '756 reference discloses that high relative speed between two machines during push-pull operations leads to uncontrolled contact which results in large impact force. However, the '756 reference fails to disclose recovery of the impact energy during the push-pull operations. Therefore, there is a need for a system to control the impact force, and to recover the impact energy.


Evaporation and condensation of carbon is effected by arc discharge between an anode formed of a carbon electrode and a cathode disposed facing the carbon electrode 2 in an inert gas atmosphere, and at the same time, the generated carbon nanotubes are dispersed into an inert gas and transported along with the inert gas through a transporting tube, and a jet of the inert gas containing the carbon nanotubes is emitted from a nozzle, thereby forming carbon nanotubes on a target substrate. This provides a carbon nanotube manufacturing method wherein carbon nanotubes are generated with a simple process, and the CNT patterning process is simplified by forming a carbon nanotube film on a substrate, thereby reducing costs.

1. Field of the Invention
The present invention relates to a method and apparatus for continuously generating and forming carbon fiber (fibrous carbon) such as carbon nanotubes, graphite nanotubes, or the like.
2. Description of the Related Art
A carbon nanotube, which is a type of carbon fiber, is a material in the shape of a tube having a configuration wherein graphite structures are wound in the shape of a cylinder, and is a new material which is expected to be applied to various fields due to unique properties thereof. FIG. 2 illustrates a conventional method for generating carbon nanotubes employing the arc method disclosed in Japanese Patent Laid-Open No. 6-280116. As shown in FIG. 2, DC arc discharge in an inert gas with a carbon material, such as graphite or the like, being used as an anode 2, and a heat-resisting electroconductive material being used as a cathode 3, causes evaporation of the carbon material on the side of the anode 2 that reaches high temperature. Generally half of the evaporated carbon condenses in the gas phase, and soot, carbon nanotubes, and the like, are formed on the inner wall of the container. The other half of the evaporated carbon directly condenses at the tip of the cathode 3, and a hard carbonaceous deposited substance 16 is formed. Conventionally, the deposited substance 16 formed on the inner wall of the container and the tip of the cathode 3 is collected to manufacture carbon nanotubes. In FIG. 2, reference numeral 4 denotes an inert gas introducing port for introducing an inert gas into the container, and reference numeral 8 denotes a current supplying device for applying a voltage between the anode 2 and the cathode 3 so as to cause arc discharge.
The carbon nanotubes obtained with the above-described conventional arc discharge method are deposited on the inner wall of the container (the cathode 3). Accordingly, a collecting method is required, thus leading to an increase of process steps. Furthermore, with the conventional arc discharge method, since deposition of the carbon material occurs on the cathode 3, there is a need to perform arc discharge while adjusting the distance between the anode 2 and the cathode 3 corresponding to the deposition amount of the cathode deposited substance 16. Accordingly, the distance between the anode 2 and the cathode 3 cannot be fixed to be constant due to the growth of the cathode deposited substance 16, resulting in unstable discharge. Furthermore, the yield of the carbon nanotubes is low due to the generated cathode deposited substance 16 being exposed to arc discharge for a long time. Furthermore, while carbon nanotubes are contained in the deposited substance 16 generated by the arc discharge or the like, the generated carbon nanotubes tends to be aggregated (coagulated). Accordingly, in the event that carbon nanotubes are to be formed into a film on a substrate, there is a need to perform dispersion processing.
Furthermore, among methods for forming a film of carbon fibers such as carbon nanotubes on a substrate, a method is disclosed in Japanese Patent Laid-Open No. 2000-086216, whereby a catalytic metal film is formed, and is patterned so that the catalysis occurs at desired positions, and carbon nanotubes are formed by performing thermal processing by the CVD method, with the catalytic metal as a nucleus. Additionally another method is disclosed in Japanese Patent Laid-Open No. 2000-057934, whereby an auxiliary agent is applied to the substrate, and carbon nanotubes are formed at desired positions on the substrate by performing thermal processing with the electric field application plasma CVD method. However, with any of these methods, the number of process steps is great, leading to high costs.
With the conventional manufacturing methods, in a case of manufacturing carbon fibers such as carbon nanotubes or the like by the arc discharge method, for example, the carbon fiber is deposited on the inner wall, cathode, and the like, in the arc discharge container, and the deposited substance is collected for manufacturing a carbon material containing carbon fiber. As a result, the carbon fibers cannot be continuously manufactured, leading to an increase of process steps. Furthermore, the deposited substance containing carbon fibers formed on the inner wall of the container or the cathode tends to be aggregated (coagulated). Consequently, there was a need to perform dispersion processing.
Examples of the methods for forming a film of carbon fibers on a substrate include a method whereby dot-shaped patterning of a catalytic metal is performed at desired positions using resist so as to form a catalyst at desired positions for forming carbon fibers such as carbon nanotubes by performing thermal processing by the CVD method, with the catalytic metal as a nucleus, and a method wherein an auxiliary agent (catalysis) is applied to the substrate, and carbon fibers such as carbon nanotubes are formed at desired positions on the substrate with the electric field application plasma CVD method. However, any of these methods has a great number of process steps, leading to high costs.

Method and apparatus of fixing carbon fibers on a substrate using an aerosol deposition process


An electrical receptacle terminal is comprised of an outer spring member and an inner spring member. The inner spring member is axially movable within the outer spring member to compensate for vibration. A base wall of the upper spring portion is provided with a slot which defines spring strap portions which act as a secondary spring to the spring contact arms.

1. Field of the Invention
This invention relates to a receptacle for an electrical connector comprising a receiving portion for a pin-like or tab-like complementary contact of a complementary connector on a longitudinal end on a receiving side and a mounting portion on the other longitudinal end.
2. Summary of the Prior Art
Electrical connectors often are situated in an environment where they are exposed to mechanical load caused by shaking or oscillating movement or vibrations and/or stress due to thermal changes. Examples are electrical connectors used in machines or motor vehicles. If such connectors are situated in the engine compartment of a motor vehicle, not only does heavy mechanical load of the above-mentioned kind occur but also high differences in temperature occur especially during wintertime between the motor vehicle at standstill and being driven.
If the two connectors of a connector pair are attached to different parts or components moving relative to each other due to such mechanical and/or thermal stress, a corresponding relative motion between the connectors occurs, for example between contact pins or contact tabs of one connector and the receiving contacts, for example receiving sockets of the other connector of the connector pair. Such relative motion causes frictional corrosion leading to an impairment of the electrical contact between the pin contacts and the socket contacts.
An electrical receptacle is shown in EP Publication 0 492 479 which is movable longitudinally for use in high vibration atmospheres. This receptacle, as shown, is mainly for use on a printed circuit board where a mating pin can be inserted through the top of the receptacle, or through the bottom of the receptacle, through the board. For this reason, the contact arms are elongate, to centralize the pin contact point within the length of the receptacle. It is desirable to use a similar terminal for connection to a wire, for use in automotive applications.


A method for attaching a metal surface to a carrier is provided, the method including: forming a first polymer layer over the metal surface; forming a second polymer layer over a surface of the carrier; and bringing the first polymer layer into physical contact with the second polymer layer such that at least one of an interpenetrating polymer structure and an inter-diffusing polymer structure is formed between the first polymer layer and the second polymer layer.

The present invention relates generally to creating a reliable and stable connection between a chip and a chip carrier and maintaining a stable connection with a chip encapsulation layer. Many different methods for connecting a chip to a chip encapsulation layer are known, however, not many methods are known for connecting a chip to a chip carrier reliably. Up till now, attempts to improve the adhesion of a chip to a chip carrier have been carried out through the modification of the surface of the chip carrier. However, there still exists a problem with creating a stable chip connection particularly when adhesives, e.g. adhesives pastes or glues, are used.

Method for attaching a metal surface to a carrier, a method for attaching a chip to a chip carrier, a chip-packaging module and a packaging module


An internal voltage generating circuit includes a divided voltage generator configured to generate a divided voltage by dividing a feedback internal voltage level at a division ratio corresponding to an operation mode control signal, a voltage detector configured to detect a level of the divided voltage based on a reference voltage level, an internal voltage generator configured to receive a supply voltage as power source and generate the internal voltage in response to an output signal of the voltage detector, and an under-driving unit configured to under-drive an internal voltage terminal to a supply voltage in an under-driving operation region that is determined in response to the operation mode control signal.

The present invention relates to semiconductor design, and more particularly, to an internal voltage generating circuit of a phase change random access memory device and a method thereof.
In general, a phase change random access memory (PRAM) denotes a phase change memory. The PRAM is also referred to as an Ovonic unified memory (OUM).
Cells of the PRAM and the OUM are made of a phase change material that sustains one of two states when the phase change material is cooled down after being heated up. Also, the phase change material changes its state again when the material is heated up or cooled down again. For example, chalocogenide alloy is a representative phase change material of the PRAM or the OUM.
Two states of the phase change material are a crystalline state and an amorphous state. The phase change material included in the PRAM or the OUM has characteristics in which a resistance becomes low when the phase change material is in the crystalline state and the resistance becomes high when the phase change material is in the amorphous state.
Therefore, a logic value 0 or 1 is determined based on a resistance value of the phase change material included in the PRAM or the OUM. That is, the crystalline state of the phase change material corresponds to a logic value 0, and the amorphous state of the phase change material corresponds to a reset or a logic value 1.
In order to make the phase change material of the PRAM or the OUM to be in the amorphous state, the phase change material is quickly cooled down after being heated up to be higher than a temperature of a melting point through a resistance heat. On the contrary, in order to make the phase change material to be in the crystalline state, the phase change material is cooled down slowly after being heated up to be lower than a temperature of a melting point.
Meanwhile, it is difficult to apply a sufficient current to a phase change material using a supply voltage in a programming operation of a phase change memory device such as a PRAM or an OUM. Therefore, it is required to use a boost voltage having a higher voltage level than a level of the supply voltage in order to apply sufficient current to phase change memory cells to perform a programming operation.
If a driver for performing a programming operation receives a current from a supply voltage when the programming operation is performed on cells of a phase change memory such as a PRAM or an OUM, a necessary voltage to select phase change cells may become insufficient due to a voltage drop caused by a parasitic resistance formed between phase change memory cells.
Therefore, it may be necessary to use a boost voltage having a higher level than a supply voltage to perform a programming operation of a phase change memory device.
On the contrary, use of a boost voltage may be avoided in performing a read operation and a standby operation because it is not necessary to directly change a phase change material to an amorphous state or a crystalline state. The use of the boost voltage may be a factor to waste unnecessary current in the read operation and the standby operation of the phase change memory device.
Furthermore, if a high voltage such as a boost voltage continuously applied to internal circuits of a phase change memory, the lifespan thereof may be abruptly shortened. Therefore, it is preferable to reduce a time of exposing internal circuits of a phase change memory to a high voltage such as a boost voltage during a read operation and a standby operation except a programming operation mode that requires the boost voltage.

Internal voltage generating circuit of phase change random access memory device and method thereof


A data processing system includes a bus, a plurality of devices connected to the bus, and a unit for executing data transfer between at least two of the plurality of devices via the bus, using one of a first bus cycle mode that enables data transfer with handshaking operation therebetween and a second bus cycle mode that enables stream data transfer without handshaking operation therebetween.

This application is based upon and claims the benefit of priority from the prior Japanese Patent Application No. 2000-025475, filed Feb. 2, 2000, the entire contents of which are incorporated herein by reference.
The present invention relates to a data processing system and a bus cycle control method, and more particularly to a data processing system for handling various types of data, including audio/video data, other data, and programs, and a bus cycle control method used in the system.
With recent advances in computer technology, various digital information devices such as multimedia-compatible personal computers, set top boxes, digital TVs, and game machines have been developed. Digital information devices of this type are required to have the ability to handle various media such as broadcasting media, communication media, and storage media.
Therefore, personal computers are required to have not only the function of processing ordinary programs but also the function of dealing with AV (audio/video) stream data needing real-time processing. On the other hand, consumer AV devices such as set top boxes, digital TVs, and game machines are required to have the function of handling computer data, that is, programs and data other than A/V stream data, to implement interactive title playback using software control.
Since the bus cycle used in computers was designed to transfer the computer data exactly, it was unsuitable for the transfer of AV stream needing great band widths. For example, in a PCI (Peripheral Component Interconnect) bus, because the master and target operate while each monitoring the state of the ready signals (IRDY, TRDY) from the other party, they have to do handshaking in each clock cycle. One clock cycle on the PCI bus is about 30 ns (when the clock frequency is 33 MHz). In the handshaking operation, the master and target check the state of the ready signal from the other party and determine the operation in the next clock cycle. They are required to do such handshaking during one clock cycle.
Although the presence of such handshaking assures the reliability of the computer data, it might hinder the improvement of the band width of AV stream. The reason is that since AV data has almost no effect on the sense of sight and hearing of users because of its characteristics, even if part of the data has been lost, it is not required to have as high reliability as that of computer data.
Furthermore, in the PCI, resources (containing memory addresses, I/O addresses, or the like) of a CPU are used for addressing. Even when direct data exchange between the devices on the PCI bus is more efficient, the data is usually transferred via the CPU and memory. In the addressing method using the resources (containing memory addresses, I/O addresses, or the like) of the CPU, the register specifications and the like for the devices to be accessed are required to be clearly determined. Thus, the method is unsuitable for direct communication between devices differing in manufactures.
On the other hand, conventional AV devices were cascade-connected in the order in which the AV stream was processed, thereby physically making a peer-to-peer connection between devices handling the AV stream. Basically, the AV stream was not entered into the CPU. With the advent of titles into which the AV stream and interactive commands have fused, the CPU has recently been required to process the stream as the need arises. This makes it more difficult to make a physical peer-to-peer connection between devices as before. To overcome the difficulty, efforts have begun to be made to grope for a bus connection capable of implementing a flexible processing system.
Accordingly, it is an object of the present invention to provide a data processing system capable of transferring stream data efficiently on an existing bus such as a PCI bus, and a bus cycle control method.
According to one aspect of the present invention, there is provided a data processing system comprising: a bus; a plurality of devices connected to the bus; and means for executing data transfer between at least two of the plurality of devices via the bus, using one of a first bus cycle mode that enables data transfer with handshaking operation therebetween and a second bus cycle mode that enables stream data transfer without handshaking operation therebetween.
According to another aspect of the present invention, there is provided a data processing system comprising: a bus; a plurality of devices connected to the bus; a system memory; and means for executing data transfer between at least two of the plurality of devices via the bus, using one of a first bus cycle mode that enables data transfer through the system memory and a second bus cycle mode that enables stream data transfer without passing through the system memory.
According to still another aspect of the present invention, there is provided a bus cycle control method applied to a data processing system in which data is transferred between devices via a bus, bus cycle on the bus being constituted by an address phase that specifies a type of the bus cycle and an address, and one or more data phases following the address phase, the method comprising the steps of: outputting onto the bus in the address phase a command indicating execution of an expansion bus cycle mode that enables stream data transfer without handshaking operation between the devices; changing the bus cycle from an ordinary bus cycle mode that enables data transfer with handshaking operation between the devices to the expansion bus cycle mode; and executing stream data transfer between devices via the bus without handshaking operation therebetween by the expansion bus cycle mode.
Additional objects and advantages of the invention will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. The objects and advantages of the invention may be realized and obtained by means of the instrumentalities and combinations particularly pointed out hereinafter.

Data processing system and bus control method for stream data transfer


The present invention relates to a probe card that a probe of the probe card is movable only in a vertical direction using a trench to improve a electrical or a mechanical characteristic and to automatically limit the vertical movement thereof within a predetermined range. A pitch may be reduced so as to correspond to a decreasing distance between pads. A flatness of a probe tip may be maintained within a few micrometers using a semiconductor manufacturing process. 32 simultaneous parallel testing is possible contrary to a convention probe card. A wafer level testing is possible, and time and cost for a wafer testing are reduced.

1. Field of the Invention
The present invention relates to a probe card having a deeply recessed trench and a method for manufacturing the same, and more particularly to a probe card having a deeply recessed trench and a method for manufacturing the same wherein the probe card is manufactured using the single crystalline silicon substrate and an oxide film or a nitride film is used as an insulating film to facilitate a signal separation between the probes, wherein the probe is movable only in a vertical direction using a trench to improve a electrical or a mechanical characteristic and to automatically limit the vertical movement thereof within a predetermined range, and wherein a pitch may be reduced so as to correspond to a decreasing distance between pads, a flatness of a probe tip may be maintained within a few micrometers using a semiconductor manufacturing process, 32 simultaneous parallel testing is possible contrary to a convention probe card, a wafer level testing is possible, and time and cost for a wafer testing are reduced.
2. Background of the Invention
Generally, during a manufacturing process of a semiconductor integrated circuit such as a memory device, a non-memory device or a logic device, a test for determining defectiveness of each of chips is performed after manufacturing the chips on a wafer. The test is carried out by connecting the probe card to a probe testing device and applying a signal to the chip to be tested with probe tips of the probe card being in contact with pads of the chip to be tested.
Since a force of 1 gram force per tip is applied to between the probe tips of the probe testing device and testing wafer including the chip to be tested, the probe tip must withstand this force, and must have a reliability to endure about one million contacts with the wafer. Moreover, a contact resistance of the probe tip should be less than 1 ohm, and a pitch should be less than 45 μm to correspond to a miniaturized semiconductor chip design.
A detailed description of a conventional probe card is disclosed in Korean Patent Application No. 10-2002-0076050 filed on Dec. 2, 2002 by the applicant, titled "Cantilever-Type Probe Card and Method for manufacturing the Same Using Silicon Micromachining Technology".
As disclosed in Korean Patent Application No. 10-2002-0076050, the conventional probe card is disadvantageous in an aspect of carrying out mass testing of wafer. For example, in accordance with U.S. Pat. No. 6,087,840 which is referred to as a conventional art in Korean Patent Application No. 10-2002-0076050, a pitch of a pad cannot be reduced below 50 μm because a tungsten needle (probe needle) is manually mounted, and an entire wafer cannot be tested in a single test so that relatively more time and cost is required. Other conventional arts disclosed in Korean Patent Application No. 10-2002-0076050 are also disadvantageous in that the probe card is sensitive to external shock or a temperature change, the pitch cannot be reduced below 50 μm, and a parallel test is difficult. Moreover, a wafer level test wherein the entire wafer is tested at once cannot be carried out, and each chip should be tested separately, resulting in a long testing time and a high testing cost.
In order to solve such problem, Korean Patent Application No. 10-2002-0076050 discloses a cantilever type probe card and a method for manufacturing the same wherein a through-hole is formed at an edge portion of a silicon substrate such as SOI (Silicon On Insulator) substrate, the through-hole is filled up with a conductive layer, a spring and a tip are then formed at a center portion of the SOI substrate by a photo lithography and etching process, a metal line electrically connected to the conductive layer in the through-hole is formed, and the conductive layer in the through-hole is then bonded to, a metal line of a printed circuit board.
FIG. 1 is a cross-sectional view illustrating a configuration of a conventional probe card.
As shown, the cantilever type probe card in accordance with Korean Patent Application No. 10-2002-0076050 comprises a printed circuit board 110 and SOI substrate 120. A through-hole 125 is formed in the SOI substrate 120 to be connected to the printed circuit board 110, an end portion 130 of a tip and a spring 135 are formed, a conductive material 138 is formed so that an electrical signal may be applied from printed circuit board 110 to a pad 165 of a wafer the substrate 160 to be tested. The end portion 130 of the tip and the spring 135 are hereinafter referred to as a probe tip and a probe beam, respectively.
However, while a configuration of the cantilever type probe card in accordance with Korean Patent Application No. 10-2002-0076050 is advantageous in that a pitch between tips may be reduced and more than 32 parallel tests and a wafer level test are possible, a contact between the probe beams or a damage of the probe beam may occur due to a horizontal movement of the probe beams when a force is applied diagonally instead of vertically. Actually, when a pressure is applied to the probe beam, a possibility of the damage and malfunction of the probe tip is increased during an actual test because a lateral force as well as a completely vertical force exists.
In order to solve above-described problem, Korean Patent Application No. 10-2003-0022937, filed by Yulim Hitech Inc. on Apr. 11, 2003 and published on Oct. 10, 2004 titled "Needle Assembly of Probe Card" disclose a configuration wherein a horizontal movement of a probe tip due to a lateral force component is prevented by forming a needle moving hole.
FIG. 2 is a cross-sectional view illustrating a configuration of the probe card disclosed by Korean Patent Application No. 10-2003-0022937. As shown, in accordance with the probe card disclosed in Korean Patent Application No. 10-2003-0022937, a needle plate 220 is allowed to only move vertically through a movable gap 215 and a moving hole 210 even when the lateral force component with respect to the needle plate 220 exists to reduce the possibility of the damage and malfunction of the probe tip.
Particularly, in accordance with the configuration of the probe card disclosed by Korean Patent Application No. 10-2003-0022937, the needle plate 220 moves inside the moving hole 210, that is, in the vertical direction to solve an instability that may occur when a width of the probe beam is smaller than a thickness thereof as a distance between pads is reduced. Therefore, a probe having a stable configuration for corresponding to the reduced pitch is provided.
However, while the configuration of the probe card disclosed by Korean Patent Application No. 10-2003-0022937 reduces the possibility of the damage and malfunction of the probe, and the pitch, a metal line process cannot be carried out directly on the silicon substrate so that the metal line process should be carried out through the interface board 240 and a metal line for testing is formed between the interface board 240 and the printed circuit board (not shown) because of the moving hole 210 in the silicon substrate. Therefore, a configuration of the testing device is very complex.

Probe card having deeply recessed trench and method for manufacturing the same