A device and method for improving the identification, localization, and dosimetry of brachytherapy seeds. The device is a brachytherapy seed comprising a therapeutic isotope and a marker isotope having an activity that is a fraction of the activity produced by the therapeutic isotope. The marker isotope emits positrons and/or photons capable of being imaged using radiation detection devices (e.g., positron emission tomography (PET), single-photon emission computed tomography (SPECT), gamma camera, computed tomography (CT)). The radiation dose of the marker isotope delivered beyond the immediate vicinity of the brachytherapy seed is low because the marker isotope is adapted to have an activity of at least one to two orders of magnitude lower than the activity of the therapeutic isotope. Thus, the presence of the marker isotope will not alter the therapeutic characteristics of the brachytherapy seed.

This invention pertains to the treatment of tumors, more particularly to a method for identifying, localizing, and measuring the dose delivered by brachytherapy seeds using imaging techniques.
Brachytherapy is a form of radiation treatment in which tiny pellets, commonly referred to as seeds, containing a radioactive material such as iodine-125 or palladium-103, are implanted within a tumor-containing tissue or organ. Brachytherapy allows the delivery of high doses of radiation to targeted tissues and organs, while limiting the radiation dose to neighboring normal (non-cancerous) tissues and organs.
Over the last few years, the use of permanent interstitial implants for treating carcinoma of the prostate has sharply increased, especially in early stages of the disease. When using permanent interstitial implants, the delivered dose of radiation and dose distribution within the target and neighboring organs depends on the accuracy of the brachytherapy source positioning. Often, implanted seed positions deviate from the optimal pattern developed in the treatment planning, primarily due to source positioning errors caused by inaccurate needle placement (depth and position), prostate motion, and seed splaying. See P. L. Roberson et al., xe2x80x9cSource placement error for permanent implant of the prostate.xe2x80x9d Medical Physics, vol. 24(2), pp. 251-257 (1997).
Postoperative assessment of patient outcome and dosimetric descriptions of implants have relied on seed localization using computed tomography (CT), fluoroscopic images, magnetic resonance imaging (MRI), ultrasound imaging, or scanned radiographs. See J. Willins et al., xe2x80x9cCT-based Dosimetry for Transperineal I-125 Prostate Brachytherapy,xe2x80x9d Int. J. Radiat. Oncol. Biol. Phy., vol. 39(2), pp.347-53 (1997). Once imaging is complete, seed positioning and orientation are extracted from these images and used for three-dimensional reconstruction of the treatment area. Seed placement errors, doses, and dose volume histograms are determined post-operatively and correlated with pre-implant calculations. However, the resolution of these imaging methods and the resolution of subsequent seed localization are limited to approximately 5 mm. Problems include artifacts in the images, and the difficulties associated with localizing seeds across multiple CT planar images. See W. S. Bice et al., xe2x80x9cSource localization from axial image sets by iterative relaxation of the nearest neighbor criterion.xe2x80x9d Med. Phys., vol. 26(9), pp. 1919-1924 (1999). Furthermore, no existing method can provide implanted seed dosimetry without the prior localization of individual seeds.
Evaluating seed positions and resulting dose distributions is also encumbered by difficulties in target identification, and by volume changes in the implant area after implantation. See Willins et al. (1997). Some algorithms have been developed in the last decade (e.g., orthogonal film reconstruction, iterative relaxation, etc.) to automate seed identification and localization, based on various imaging methods (e.g., CT, fluoroscopic images, ultrasound images, MRI, etc.). However, despite increasingly sophisticated mathematical methods, algorithmic predictions have retained a high level of uncertainty. For example, a phantom study found that orthogonal film reconstruction techniques were able to locate only 66% of seeds within 5 mm of their actual location, while iterative relaxation methods in clinical studies had only a 72% success rate. See Bice et al. (1999).
The uncertainty in localizing low energy photon emitters (e.g., Pd-103), results in an unacceptable error when calculating doses from a brachytherapy seed to targeted or normal tissues. This error arises because the dose rapidly decreases within a few centimeters of the seed. See R. Nath et al., xe2x80x9cDosimetry of interstitial brachytherapy sources: Recommendations of the AAPM Radiation Therapy Committee Task Group No.43.xe2x80x9d Med. Phys., vol.22(2), pp.209-234 (1995). For instance, for Pd-103 the dose fall-off along the radial transverse axis of the seed is approximately 25% for each 5 mm distance from the source. By comparison, I-125 has a dose fall-off rate of approximately 10% per 5 mm.
U.S. Pat. No. 6,187,037 describes a pre-calibrated, integral radiation device for vascular implantation that delivers site-specific therapy to prevent restenosis. The device comprises a tubular structure formed of bio-compatible metal that can be activated by irradiation or neutron bombardment, or by a proton or electron beam.
WO 99/33063 describes un-encapsulated palladium-103 brachytherapy sources produced by irradiating pre-formed rhodium metal or rhodium alloy seeds with protons from a charged particle accelerator.
U.S. Pat. No. 6,163,947 and WO 97/19724 describe a brachytherapy device for radiotherapy of interstitial malignant neoplasms or other radiation-treatable diseases. The device comprises a hollow tubular support having a hollow tube-shaped seed-substrate. Radioactive source material is deposited as a layer on the external surface of the device. In one embodiment, the radiation-emitting layer of the device may be prepared by plating the seed-substrate with a suitable non-radioactive isotope that may be transmuted in situ by neutron bombardment.
An unfilled need exists for a cost-effective device and method for improving cancer treatment by increasing the level of accuracy and convenience in dose determinations, and in identifying and localizing brachytherapy seeds.
We have discovered a reliable and inexpensive device and method to improve the dosimetry, identification, and localization of brachytherapy seeds. The novel brachytherapy source may be adapted, for example, to produce positron emissions. In one embodiment, a positron or gamma emitter is embedded as a marker in a brachytherapy seed and is then imaged using external radiation detection devices (e.g., positron emission tomography (PET), single-photon emission computed tomography (SPECT), gamma camera, etc., resulting in a new type of seed definition and localization, and direct dosimetry from the dose-volume data produced by radiological imaging software.
In another embodiment, the novel device and method provides a means for irradiating titanium seed capsules using protons, either before or after encapsulation, to produce V-48, which is a positron emitter. Irradiation after encapsulation also provides a means for producing both Pd-103 and V-48 in one step, avoiding the need for xe2x80x9chot-loading.xe2x80x9d (xe2x80x9cHot-loadingxe2x80x9d is the use of radioactive components during the manufacturing of brachytherapy seeds, which is more difficult and costly than using stable components during initial manufacturing.) Seeds produced with both Pd-103 and V-48 together in one step may have different dosimetric characteristics from those produced with a minute quantity of V-48 prepared separately from Pd-103. Such a situation may result if the contribution of the V-48 isotope to the total dose is non-negligible as compared to the contribution of Pd-103. The method described also provides a means for producing seeds with varying activity of positron emissions.

Embedded radiation emitter for the localization and dosimetry of brachytherapy seed implants

Board of Supervisors of Louisiana State University and Agricultural and Mechanical College


A boiler comprises a shell for fluid to be treated and divided into first and second heat exhange zones by at least one baffle, the zones being in communication with one another beneath a lower end of the baffle. Exhaust gases from a combustion source are supplied to a plurality of heat exchange tubes extending through each zone in heat exchange relationship with the fluid in the shell and being arranged in passes sequentially connected to one another whereby the exhaust gases pass sequentially through the first and second zones. The fluid to be heated is fed to an upper region of the second zone such that the temperature of gases passing through at least some of the tubes in the second zone falls to below the dew points of combustion products therein, the tubes in which condensation occurs being orientated such that condensates flow therefrom for disposal.

This invention relates to boilers.
Boilers which have a pressure shell for containing fluid, such as water or other thermal liquid, are known. Typically, a furnace tube in which fuel is burnt extends at least partly through the shell and is connected at its exhaust end via a smoke or reversal chamber to the first of a plurality of groups or passes of tubes which extend through the shell in heat exchange relationship with the fluid contained therein.
Usually such boilers are operated so that the exhaust gases passed to the stack are still above the dew point of the products of combustion contained in said gases. Consequently, corrosion problems from condensation of acidic combustion products are avoided, and relatively inexpensive materials can be used in the manufacture of the boilers.
The operation of such boilers in that mode means that some of the recoverable heat within the exhaust gases is lost, the heat contained in the exhaust gases being in the form of both sensible heat of the gases and the heat of vaporisation of the condensable combustion products. However, with the recent emphasis on energy conservation, it can be desirable to maximise the recovery of heat even at the expense of higher initial capital outlay.


A toilet has an electronic flush assembly operable in either a short or long flush sequence selectable by a user. The long flush sequence includes a pre-rinse cycle and a rinse cycle in which the a supply valve and a flush valve are both opened and closed twice, once each first during the pre-rinse cycle and again during a subsequent rinse cycle. The rim supply valve and the flush valve are opened during the pre-rinse and rinse cycles but are closed at the start and end of each cycle. An electronic control controls operation of the valves as well as water supply control components. Level sensors can also be included to provide feedback to the controller, for example, to prevent overflow conditions.

The present invention relates to plumbing fixtures such as toilets. In particular, the present invention relates to the flush assembly and flush sequencing for toilets.
Conventional toilets utilize a single mechanical flush sequence to evacuate waste from the toilet bowl, rinse the bowl, and possibly to refill a water tank. Simple mechanical components such as gravity operated flapper valves and float controlled fill valves are normally used to control the passage of water through the bowl and the filling of the tank. The trade-off for such a simple mechanical flush assembly is wasted water consumption in low waste conditions and inadequate or inconsistent rinsing of the bowl in high waste conditions.
Over time there have been numerous revisions and improvements made to the conventional toilet. For example, several toilets have been devised with electronically controllable flush, rinse and fill components, see e.g., U.S. Pat. Nos. 5,548,850 and 6,332,229. These patents also disclose toilets with alternate flush sequences. And, more forceful rinsing action has been achieved using jet components, such as disclosed by U.S. Pat. No. 2,715,228. However, as of yet the flush control components and sequencing of conventional toilets has often been insufficient to achieve an efficient and adequate flush in varied waste load conditions.
There is thus a need for toilets with advanced flush assemblies and sequencing to better address problems with known toilets.


A device for measuring and cutting soft materials, wherein the device has a lower section and an upper section, the lower section having a bottom surface and a top surface, and at least one opening extending from the top surface to the lower surface. Bendable means on the upper section, and at least one piercing object carried by the bendable means, wherein the bendable means bends in response to a downward force applied to it, causing the piercing means to move through the opening and engage the soft material, said bendable means being self-retracting so that it returns to a natural resting position when the force ceases to exist, causing the piercing object to disengage from the soft material.

The activity of quilting is very popular. People from many different nations do it on a regular basis for leisure and business alike. It involves creating a patchwork and stitching it in a pattern called a quilt with another piece of fabric, usually including additional filing material between the patchwork and the fabric.
People began creating patchworks as long as thousands of years ago when they would use leftover pieces of leather to make clothing, bedding, and even armor. Commonly, the patchwork is an essential part of a quilted product such as bed covers, blankets, cushions, etc.
To create a handmade patchwork, a person sews together several relatively small pieces of fabric of many different shapes, sizes and colors, which involves using rulers and cutting tools such as rotary cutters to cut a large number of pieces of fabric.
Therefore, the activity of creating a patchwork is somewhat confined to individuals since the great variety in shapes and sizes of patches does not provide an easy method of mass production. This means that a person will have to manually measure and cut a large number of relatively small pieces of fabric.
Quilting rulers, used for making many small pieces or patches of material, should slide easily on top of fabrics so the user can position the ruler quickly and easily on the right place to cut the fabric, which will be a repeated action in order to create many patches of fabric. However, this can become a problem since it is very important that the ruler does not move from the desired place and angle when making a cut.
Therefore, to ensure a proper cut, the person using conventional rulers must make quite an effort and press hard on the ruler against the fabric in order to keep the ruler from moving while cutting the fabric. This problem becomes even more acute when the person, in order to save time, desires to cut several layers of fabric in one single cut. Keeping the ruler from moving while making this kind of cut makes the cut even more difficult, especially for an inexperienced user.
In summary, there are two problems to be considered:                The ruler should move easily on top of fabric when the person is choosing the place to cut the fabric, and        The ruler should not move at all when the person is doing the action of cutting the fabric.This is where designers and manufactures of quilting rulers and tools have failed to solve the problem properly, since they have not realized the need for retractable means.
Even though the manufacturing industry of quilting tools and accessories is quite large, there has not been a significant improvement in rulers to solve the problems mentioned above.
Some attempts include a sticker-like patch, which adheres to the bottom of the ruler and increases the friction coefficient between the ruler and the fabric, making it somewhat easier for the person to hold the ruler in the right place. However, the ruler can still move undesirably, so the person still has to press the ruler hard against the fabric while cutting the fabric.
Moreover, even though the "sticker" is removable, it cannot be engaged and retracted at will in an instant, but instead stays attached to the ruler. Therefore, the ruler does not slide easily on top of the fabric, which makes it more difficult to position the ruler in the precise place for the next cut.
Other manufactures have decided to permanently cover the bottom of the ruler with a coating of a material with higher friction coefficient; however, this approach does not solve the problems mention below:                The friction coefficient is not high enough to absolutely prevent the ruler from moving undesirably when making a cut, and again;        With a coating permanently on the underside of the ruler, the ruler does not slide easily on top of the fabric, making it more difficult for the person to place the ruler precisely on the right spot for the next cut.
Therefore, with these approaches the user must sacrifice a portion of one benefit to obtain just a portion of the other benefit.
Even though the industry has invested quite heavily in research and development, up to now it has failed in finding a real solution to this problem. In other words, modern rulers constantly move and slide undesirably as the user is making a cut, resulting in wasted time, effort and materials.

Non-slip ruler for measuring, marking and/or cutting fabrics and other soft materials and method thereof


According to one embodiment, a permanent-magnet type electric rotating machine has a stator, a magnetizing coil, a rotor and a case. The stator has an armature coil configured to form a magnetic circuit for driving. The magnetizing coil is configured to form a magnetic circuit for magnetizing. The rotor has a constant magnetized magnet, a rotor core and a variable magnetized magnet. The rotor core holds the constant magnetized magnet. The constant magnetized magnet is arranged closer to the magnetic circuit for driving than the variable magnetized magnet. The variable magnetized magnet is arranged closer to the magnetic circuit for magnetizing than the constant magnetized magnet.

Carbon dioxide and energy consumption are increasing all over the world, in not only in the developed countries, but also the developing counties. The energy saving in various systems is effective in reducing the worldwide energy consumption. In electric cars, electric trains, elevators and household electrical appliances, for example, permanent magnets are used to acquire high efficiency. The electric car, for example, needs to drive (operate or run) in various modes, ranging a low-speed, high-torque mode to a high-speed, low-torque mode. In a medium- or high-speed mode, the permanent-magnet motor of the car inevitably works at a low efficiency while the car is driving at a low speed, a high speed or a light load. In view of this, attention is now paid to variable magnetomotive force motors, such as variable magnetomotive force memory motor, magnetic-field coil motor and winding-switching motor, in which the magnetic force of each permanent magnet can be directly changed in accordance with the driving condition.
In the variable magnetomotive force memory motor, the rotor holds constant magnetized magnets that do not change in magnetic force or magnetization (magnetizing) direction, and variable magnetized magnets that change in magnetic force or magnetization direction. The magnets of the two types cooperate, generating a magnetic field. If the magnetic force of the variable magnetized magnets greatly changes, the linkage flux at the armature coil will change due to all magnets used. The magnetic force and magnetization direction in the rotor are changed by the magnetic field generated by the magnetizing coil arranged around the stator as magnetizing pulse current flows in the magnetizing coil for an extremely short time.
The magnetizing coil, if arranged around the stator, must be clamped in the stator core. The stator is therefore longer than otherwise in its axial direction, by the size of the magnetizing coil. Consequently, the permanent-magnet type electric rotating machine is massive, and its assembling is complex.
An object of this invention is to provide a permanent-magnet type electric rotating machine that can be easily assembled with no need to increase the size.

Permanent-magnet type electric rotating machine


After detection of contact between respective solder bumps of an electronic component, sucked and held by a suction nozzle of a head tool, and respective solder portions of a circuit board, the solder bumps and the solder portions are melted by heating. Releasing of the electronic component from suction and holding by the suction nozzle of the head tool is performed, not at a time during solder melting, but at a time after the solder is melted, cooled and solidified. Thus, an electronic component mounting method and apparatus capable of mounting high-end electronic components having narrow-pitched bumps are provided.

The present invention relates to a method and apparatus for mounting electronic components onto a circuit board. More particularly, the invention relates to an electronic component mounting method and apparatus that makes it possible to mount such electronic components as IC chips having narrow pitched bumps onto a circuit board by performing a flip chip bonding method.
As electronic component mounting methods of this type, there have conventionally been known various methods. As an example of a conventional electronic component mounting method corresponding to the flip chip bonding method, is a method including steps of temporarily bonding a plurality of electronic components onto a circuit board and thereafter subjecting the electronic components collectively to reflow soldering, thus achieving electronic component mounting, (hereinafter, described as a collective reflow mounting method) as shown FIGS. 22A-22D.
As shown in FIG. 22A, solder paste is fed by printing or the like onto pads 84a, which are a plurality of electrodes on a top surface of a plate-like circuit board 84, so that solder portions 82 are formed on the pads 84a of the circuit board 84, respectively.
Next, in FIG. 22B, an electronic component 81, to which solder bumps 81b are bonded at a plurality of electrodes 81a provided on a bonding surface of the electronic component 81, is sucked and held at its rear surface, which has no electrodes 81a thereon, by a tool 83. After a positional alignment that makes the solder bumps 81b of the electronic component 81 bondable with the solder portions 82 on the circuit board 84, respectively, the solder bumps 81b of the electronic component 81 are pressed against the solder portions 82 of the circuit board 84, respectively, thereby achieving their temporary bonding. For mounting of a plurality of electronic components 81 onto the circuit board 84, these working steps are iteratively performed so that respective electronic components 81 are mounted onto the circuit board 84. It is noted here that the terms, "temporary bonding," refer to a bonding process such that the electronic component 81 and the circuit board 84 are releasable from their bonding by applying external force to the electronic component 81 or the circuit board 84 without breaking the electronic component 81 or the circuit board 84.
Thereafter, the circuit board 84, to which the electronic components 81 have been temporarily bonded, is conveyed to a reflow soldering working section. As shown in FIG. 22C, the electronic components 81 and the circuit board 84 are heated by a heat source in the reflow soldering working section, by which the solder portions 82 and the solder bumps 81b are melted. In a case where a plurality of electronic components 81 are temporarily bonded to the circuit board 84, those electronic components 81 are collectively subjected to heat so as to melt the solder in this reflow soldering working section.
Thereafter, as shown in FIG. 22D, with the circuit board 84 removed from the reflow soldering working section, molten solder is cooled and solidified, thereby achieving primary bonding of the electrodes 81a of each electronic component 81 to the pads 84a of the circuit board 84, respectively, via the solder, by which the electronic components 81 are collectively mounted onto the circuit board 84. It is noted here that the terms, "primary bonding," refer to a bonding process that is performed by melting the solder with heat applied to the temporarily bonded electronic component 81 and circuit board 84, and by thereafter solidifying the solder, and this makes it hard to release a resulting bonded state by applying external force to the electronic component 81 or the circuit board 84.
In such a collective reflow mounting method, a multiplicity of electronic components 81, after their temporary bonding, can be subjected to collective melting of solder, by which the electronic components 81 can be finally bonded and thereby mounted to the circuit board 84. This allows for electronic-component mounting operations to be efficiently achieved. As a result, it has been a case in that costs of mounting the electronic components 81 onto the circuit board 84 can be reduced.
However, for such a method, which includes steps for temporarily bonding of the electronic components 81 to the circuit board 84, and thereafter performing their primary bonding by melting the solder, there is a need for conveying the circuit board 84, to which the electronic components 81 have been temporarily bonded, to the reflow soldering working section. During this conveyance, a bonding position of each electronic component 81 relative to the circuit board 84 might be shifted due to vibrations or the like caused by the conveyance, in which case reflowing of the solder in such a shifted state might result in defective bonding of the electronic components 81 to the circuit board 84. Such shifts of the bonding positions as would occur in the collective reflow mounting method would not matter for electronic components to which high precision for their bonding positions is not required, such as general-purpose electronic components. However, for some electronic components, such as IC chips, to which particularly high precision for their bonding positions is required, this would matter.
As an example of a conventional electronic component mounting method corresponding to a flip chip bonding method intended to solve such issues of the collective reflow mounting method as described above, a method including the step of simultaneously heating and pressing electronic components onto a circuit board to thereby subject the electronic components individually to reflow soldering, thus achieving electronic component mounting, (hereinafter, described as a conventional local reflow mounting method) is shown FIGS. 23A-23D.
As shown in FIG. 23A, solder paste is fed by printing or the like onto pads 94a, which are a plurality of electrodes on a top surface of a plate-like circuit board 94, so that solder portions 92 are formed on the pads 94a of the circuit board 94, respectively.
Next, as shown in FIG. 23B, an electronic component 91 to which solder bumps 91b are bonded at a plurality of electrodes 91a provided on a bonding surface of the electronic component 91, is sucked and held at its rear surface, which has no electrodes 91a thereon, by a tool 93. After performing a positional alignment that makes the solder bumps 91b of the electronic component 91 bondable with the solder portions 92 on the circuit board 94, respectively, the solder bumps 91b of the electronic component 91 are, while heated, pressed against the solder portions 92 of the circuit board 94, respectively, by which the solder portions 92 and the solder bumps 911b are melted.
Next, as shown in FIG. 23C, while solder is maintained in a molten state, suction and holding of the electronic component 91 by the tool 93 is released. As a result of this, a self alignment effect by surface tension of the molten solder is obtained.
Thereafter, as shown in FIG. 23D, by solidifying the molten solder, the electrodes 91a of the electronic component 91 are bonded to the pads 94a of the circuit board 94, respectively, via the solder, by which the electronic component 91 is individually mounted onto the circuit board 94. In addition, for mounting of a plurality of electronic components 91 onto the circuit board 94, these working steps are iteratively performed so that respective electronic components 91 are mounted onto the circuit board 94, individually.
In such a local reflow mounting method, the electronic component 91 is sucked and held by the tool 93, the solder bumps 91b of the electronic component 91 are pressed against the solder portions 92 of the circuit board 94 while the solder bumps 91b and the solder portions 92 are heated, respectively, by the tool 93, and thereafter suction and holding of the electronic component 91 by the tool 93 is released while the solder is in the molten state. As a result, a self alignment effect by the surface tension of the molten solder is obtained. Thus, even with more or less poor precision of a bonding position of the electronic component 91 by the tool 93, a precision of a bonding position that would not result in defective bonding eventually could be obtained by the self alignment effect.
However, in a case of high-end electronic components of narrowed bump pitches, from among such electronic components as IC chips, with their bump pitch being as narrow as, for example, not more than 150 μm, it is required for electronic components having bumps of such narrow pitches to meet a high precision for a bonding position of, for example, ±5 μm, which would concern a bonding-position shift amount of an electronic component due to a vacuum break blow occurring at releasing of the suction and holding of the electronic component during solder melting, more than the self alignment effect would be concerned in the local reflow mounting method. Therefore, the above-described electronic component mounting performed by the local reflow mounting method, in which suction and holding of an electronic component by the tool is released during a solder's molten state, has had an issue of incapability of mounting high-end electronic components which have bumps of such narrow pitches as shown above and to which high precision for a bonding position is required.
Accordingly, an object of the present invention is to solve the above-described issues and provide an electronic-component mounting method and apparatus which are capable of mounting high-end electronic components having narrow-pitch bumps, and moreover, which are intended for mounting of electronic components onto a circuit board on which general-purpose electronic components and high-end electronic components are to be mixedly mounted. The method and apparatus allow both productivity and quality to be satisfied by changing a method to be used for individual electronic components depending on precision of a bonding position required for individual electronic components.

Apparatus and method for mounting electronic components

Matsushita Electric Industrial Co., Ltd.


This invention aims at providing (2,4-dimethylpentadienyl)-(ethylcyclopentadienyl)ruthenium which may contain its related structure compound, from which a ruthenium-containing thin film can be produced; a method of producing the same; a method of producing the ruthenium-containing thin film using the same; the ruthenium-containing thin film; and the like. The invention relates to producing the thin film using, as a precursor, (2,4-dimethylpentadienyl)(ethylcyclopentadienyl)ruthenium containing the related structure compound in an amount not more than 5% by weight, which can be obtained by separating the related structure compound from (2,4-dimethylpentadienyl)(ethylcyclopentadienyl)ruthenium containing the related structure compound.

Scale down of memory cells is proceeding with the trend toward higher degrees of integration in semiconductor memory devices, and noble metals such as ruthenium, iridium, and platinum are being investigated as electrode materials for memory devices. For DRAM devices, among memory devices, ruthenium is regarded as a promising electrode material because oxides thereof also have electrical conductivity and because ruthenium has excellent suitability for processing for scale down. An optimal method for producing a ruthenium-containing thin film for use in highly integrated memory devices is a CVD (chemical vapor deposition) method from the standpoint of the excellent step coverage thereof.
Organometallic compounds are thought to be suitable as precursors for forming a thin film therefrom by a CVD method, because the compounds are easy to handle. At present, (2,4-dimethylpentadienyl)(ethylcyclopentadienyl)ruthenium (hereinafter referred to as DER) and the like are known as organometallic compounds for forming a thin ruthenium film or a thin ruthenium oxide film therefrom (see, for example, patent document 1 and non-patent documents 1 to 8).
It is generally known that, of a precursor fed to the step of thin-film formation in a CVD method, the amount of the precursor which is actually used for thin-film formation is 10% or less, and that most of the precursor which was fed is discarded without being utilized. It is desired to recover and reuse the precursor which is being discarded.
The present inventors have found that the precursor recovered after the step of thin-film formation using DER as a precursor contains, besides DER, DER related structure compounds which were generated from the DER by the heating conducted during the step of thin-film formation and that the precursor, as recovered, cannot be reused.
The DER related structure compounds differ from DER in property concerning thin-film formation and, hence, the same thin-film formation as from DER cannot be attained. Because of this, there are the cases where the DER which contains DER related structure compounds also cannot be used to conduct the same thin-film formation as from DER.

Ruthenium compound, method of producing the same, method of producing ruthenium-containing thin film using the same, and ruthenium-containing thin film


A plasma processing apparatus includes a process chamber, a platen positioned in the process chamber for supporting a workpiece, a source configured to generate a plasma in the process chamber, and a monitoring system including an ion mobility spectrometer configured to monitor a condition of the plasma. A monitoring method including generating a plasma in a process chamber of a plasma processing apparatus, supporting a workpiece on a platen in the process chamber, and monitoring a condition of the plasma with an ion mobility spectrometer is also provided.

Plasma processes are widely used, for example, in semiconductor manufacturing to implant wafers with various dopants, to deposit or to etch. In order to achieve predictable and repeatable process results, it is critical to closely monitor and control the plasma characteristics. For example, plasma processes inherently produce ionic and neutral species. In a plasma doping (PLAD) process, such ionic and neutral species may react and deposit on surfaces such as the walls of the process chamber and the workpiece to be treated. Such ionic and neutral species may also react and etch such surfaces. In addition, studies of PLAD processes have shown that ion composition of a plasma may be a critical piece of information that determines dopant species, dopant depth profiles, process-related contamination, etc. The ion composition changes with PLAD process parameters such as gas ratio, total gas pressure, and discharge power. The ion composition can also change significantly depending on the conditioning status of a plasma chamber. Therefore, it is important to know the ion composition during a PLAD process, preferably in situ and in real-time, in order to achieve repeatable and predictable process results.
One conventional method of monitoring plasma conditions includes optical diagnostic techniques such as optical emission spectroscopy to monitor plasma constituents. However, a drawback with such optical diagnostic techniques is that they require transparent optical input and viewing ports. The transparency of these ports tends to degrade over time as deposits build up on the same. Another conventional method of monitoring plasma conditions includes residual gas analyzers (RGA) and mass spectrometers such as a time-of-flight mass spectrometer to monitor the plasma. However, a drawback to RGAs and mass spectrometers is that they typically require two to three orders magnitude of a lower vacuum environment than the pressure in a typical plasma processing chamber. This would then require differential pumping to achieve the desired pressure and the possibility of reactions between the ions and neutrals before they are analyzed can degrade the monitored results. In addition, the mass spectrometers tend to be bulky and may therefore perturb plasma under measurement which could distort process results. The bulkiness of mass spectrometers may also limit their deployment locations in a semiconductor process tool. In addition, a time-of-flight mass spectrometer does not ionize neutral particles so it does not monitor the same. Furthermore, a time-of-flight sensor can also not distinguish between two ions having the same mass which can further degrade the monitored results.
Accordingly, it would be desirable to provide a technique for monitoring a plasma process with an ion mobility spectrometer which overcomes the above-described inadequacies and shortcomings.

Technique for monitoring and controlling a plasma process with an ion mobility spectrometer

Varian Semiconductor Equipment Associates, Inc.


A data bit stream is segmented into 4-bit data words and successively shifted two bits at a time. For each 4-bit data word a corresponding 3-bit code word is detected in a conversion table. Two higher significant bits of each data word is converted to the detected code word and two lower significant bits of the data word is then converted as two higher significant bits of a subsequent data word to a corresponding code word, so that a channel bit stream formed by a series of such code words has no consecutive 1's. A digital sum value of the channel bit stream is determined and a search is made for a code word “010” which is consecutive with a code word “000”. The detected code word “010” is replaced with a substitute code word “000” if the replacement results in the digital sum value approaching zero.

1. Field of the Invention
The present invention relates generally to recording of digital signals on optical or magnetic discs and more specifically to a data modulation method and apparatus for converting a data bit stream to a channel bit stream having a small d.c. content (or digital sum value).
2. Description of the Related Art
Prior to recording on an optical or magnetic disc, the format of a digital signal is converted, or modulated into a format appropriate for the characteristics of the disc. DC content is a concern in digital signals, which alternate between "1" and "0" irregularly. If there is an imbalance between the total number of ones or zeros, the imbalance will result in a signal having a d.c. content. DC content is a concern with magnetic recording heads. If the magnetic polarity is switched more to one direction than the other, this polarity imbalance will remain in the head and cause a d.c. offset in its ability to play back digital signals. DC content is also a concern with a laser mechanism which reads pits and lands on the surface of an optical disc. In a digital system, the d.c. content is termed digital sum value (DSV), which is the difference between the total number of ones and the total number of zeros. If NRZI waveform is used for recording, the DSV is a total sum of +1 for a bit "1" and −1 for a bit "0", starting from the beginning of a channel bit stream. The pits and lands are read by a system of lasers that are controlled by a servo actuator. The actuator must maintain precise alignment with the tracks on the disc and with the transition boundaries between pit and land areas. The transitions in the signal, represented by the ones, enable the servo actuator to maintain correct alignment with the track. Thus, a signal having a d.c. content will result in the servo actuator drifting out of proper alignment with the track.
In DVD (Digital Versatile Disc) recording systems, the 8-16 modulation scheme is employed to convert 8-bit data words of a data bit stream to 16-bit code words to form a channel bit stream so that the run length of the channel bit stream is constrained to (2, 10), i.e., the number of 0's that exist between any two 1's is a minimum of two and a maximum of ten. The 8-16 modulation has the ability to reduce the d.c. content of a signal by selecting a particular code word from a set of tables based on the DSV of the signal.
The 8-16 modulation has a coding rate 1/2. The coding rate is of a concern to the design of a recording system because higher the coding rate a longer time is allowed to detect a "1" bit from the channel bit stream. The (1, 7) modulation is another coding scheme known in the art as having a run length of a minimum of one "0" and a maximum of seven 0's and a coding rate 2/3. Because of its higher coding rate, the (1, 7) modulation is suitable for high-density digital recording. However, its d.c. content is high, which results in a degraded jitter performance if an a.c.-coupled circuit is used in a playback system and results in a decision threshold varying randomly about the correct level.
Japanese Patent Publication 1998-340543 discloses a d.c.-content reduction method for the (1, 7) modulation codes by introducing a 6-bit DSV control code of 3 replacement bits and 3 redundant bits into a data bit stream at regular intervals prior to conversion to a channel bit stream. However, the use of the extra 3-bit redundant bits results in a lowering of the coding rate.
Another concern to the design of a recording system is a bit pattern in which bits "1" occur at minimum intervals 2T (where T is the channel bit length) such as "010101010". The (1, 7) modulation generates such 2T-bit patterns frequently as compared to other modulation schemes. Because of the closely spaced bits "1", inter-symbol interference occurs, making it difficult to extract clock information from playback signals. Furthermore, noise is introduced to the decision threshold, resulting in a timing error which causes a delayed detection of a full 2T bit pattern by the length of a single bit.


An apparatus for producing soft ice cream has a storage container (1) for receiving soft ice cream raw material in liquid form and a refrigeration chamber (4) with a mechanical mixing device (5) installed therein in which the soft ice cream raw material is mixed with air and thus prepared to form soft ice cream. The storage container (1) is a bag (8) which can be inserted into the apparatus, with an integrated single use pump (9) with an opening device (19) for the bag.

The invention relates to an apparatus for producing soft ice cream.
The invention relates in particular to an apparatus for producing soft ice cream, said apparatus having a storage container for receiving the soft ice cream raw material in liquid form, a refrigeration chamber with a mechanical mixing device installed therein in which the soft ice cream raw material is mixed with air and is thus prepared to form soft ice cream, wherein the storage container communicates with the refrigeration chamber by means of a supply channel, and a dispensing device for the dosed output of soft ice cream from the refrigeration chamber. Ice creams, yoghurt ice creams and similar products are able to be produced using apparatuses of this type and the term soft ice cream in this case includes a plurality of possible end products.
Apparatuses for producing soft ice cream with said basic design have been known for a long time. Thus, EP-0818151, DE-2139917 and U.S. Pat. No. 4,850,205, to name but a few as an example, show apparatuses of this type.
It is also adequately known that apparatuses for producing soft ice cream or ice cream machines always have to be cleaned and maintained very carefully in order to ensure that untainted and sterile soft ice cream is produced and dispensed. Said set of problems is exacerbated because, as a rule, not only do contamination-sensitive raw materials have to be used but because the devices additionally also have to be operated for the most part in warm and contamination-inducing environments.
Various auxiliary devices and methods to improve the cleaning process have naturally been made known over time.
For example, there are washing additives for apparatuses for producing soft ice cream which can be connected directly to water taps or water lines and by way of which rinsing water is able to be introduced directly into the storage container for receiving the soft ice cream raw material in order to rinse through and clean said storage container. There are also appliances with integrated self-cleaning devices which can be operated by the touch of a button and by way of which automatic washing and cleaning operations are able to be triggered. However, practically all known popular apparatuses for producing soft ice cream, even those that comprise a high degree of automation, nevertheless require all the parts that are susceptible to contamination periodically to be broken down and thoroughly cleaned because the routine—type cleaning operations which are associated with normal operation are not effective enough or are simply not reliable enough over longer periods in the majority of cases. Self-cleaning devices can consequently certainly save the servicing personnel a considerable amount of time because the appliances do not need to be taken apart for thorough cleaning as often, however they do not make thorough cleaning operations by breaking down the machine parts that are susceptible to contamination completely unnecessary.
Typically, popular appliances for producing soft ice cream have to be taken apart and cleaned thoroughly either daily or at least twice a week for the reasons mentioned. Obviously, the frequency of said through cleaning operations also depends at least in part on the actual use of the devices as well as also on local official regulations concerning the procedure with these types of contamination-susceptible devices. However, because said thorough cleaning operations are always relatively expensive in time and money, solutions to reduce the necessary number of thorough cleaning operations, whilst safety for consumers remains at least the same or is even improved, are naturally highly desirable.


A computer-assisted method is provided for verifying identifying data of a customer of a financial institution. The method includes receiving the identifying data of the customer in a customer processing system of a customer identification program; applying at least one of a customer matrix or a scenario matrix to the customer identifying data for determining applicability of the customer identification program to the customer; searching at least one record of the customer identifying data with at least one government list function; and, communicating at least one record of the customer identifying data to at least one verification vendor.

Historically, mutual funds have not possessed specific information about the identities of their individual customers, nor have they verified the identities of their customers. Mutual funds typically do not interact directly with their customers, often instead employing transfer agents to receive, review and process documents such as applications for new accounts. It can be appreciated that this way of doing business in the financial industry has created a high degree of anonymity between mutual funds and their customers.
In association with enactment of the USA PATRIOT Act ("Patriot Act"), the Treasury Department and the Securities and Exchange Commission were directed to develop rules and regulations for implementing customer identification programs ("UP") to address the need to verify the identities of customers of financial institutions such as mutual funds. To satisfy the requirements of the Patriot Act, mutual funds and other financial entities have been mandated to establish and execute such CIPs in their business operations. A properly administered CIP requires financial institutions to undertake "reasonable procedures" for verifying the identities of their customers, to maintain customer verification records, and to compare customer information against certain government lists (e.g., government lists of known terrorists). It can be seen that enactment of the Patriot Act has forced a fundamental change in the nature of the relationship between mutual funds and their customers and how mutual funds must conduct business.
In view of the compliance issues arising from this regulatory environment, effective and efficient processes are needed for obtaining, processing and storing identifying information for customers of financial institutions, including mutual funds.


Optical signal to noise ratios that more accurately characterize optical link noise are determined. As noise induced by an optical receiver does not generally vary with an input optical signal power, a power of an incoming optical signal is varied at the receiver. A resulting variation in noise measure represents a variation in link noise and does not include any variation caused by receiver noise, as receiver noise does not generally vary with optical signal power. Thus, the contribution of optical link noise can be discerned from other noise induced by the receiver itself. A more accurate characterization of optical link performance is thus provided.

Optical signal-to-noise ratio (OSNR) is a measure used to quantify the amount of optical noise interference in optical signals. This value is used as a figure of merit to describe the quality of an optical channel, and thus serves as an indicator of the performance of an optical communication system. The OSNR is also used to debug or otherwise isolate issues between an optical receiver and an optical network.

Optical link and coherent receiver noise characterization


A packet communication device autonomously selects an appropriate operation mode according to a connection environment to an external device before a service of the device is started. When the device is connected to the external buses, connection interface units notify an external device discrimination unit of connection of the device. The external device discrimination unit issues a polling packet to the connected device, discriminates the connected external device on the basis of the response packet, and notifies an operation mode switching unit. The operation mode switching unit selects an operation mode conforming to a connection environment of the packet communication device to the external device and switches the operation mode of the device to the mode. The selection of the operation modes is completed before the entire device or a portion of the device which is influenced by the selection of the operation mode starts a service to the external device to which the packet communication device is connected.

1. Field of the Invention
The present invention relates to a packet communication device, a packet communication method, and a recording medium on which a packet communication program is recorded, and particularly, a packet communication device which autonomously set an operation mode, a packet communication method, and a packet communication program.
This application is based upon and claims the benefit of priority from Japanese patent application No. 2007-005863, filed on Jan. 15, 2007, the disclosure of which is incorporated herein in its entirety by reference.
2. Description of Related Art
A packet communication device of this type is connected to buses, selects an appropriate operation mode of the device according to a connection environment to the outside, and operates to conform an operation of the device to the connection environment. An example of the packet communication device is described in Japanese Patent Application Laid-Open No. 2000-66992 (JP-A 2000-66992). The packet communication device is shown in FIG. 7.
A packet communication device 73 described in JP-A 2000-66992 shown in FIG. 7 sets a connection between structural units inside a device in accordance with a connection environment to the outside. In this case, the connection environment corresponds to case in which a primary side and a secondary side are set to two external buses connected by the packet communication device 73 and the primary interface and the secondary interface must be connected to the primary external bus and the secondary external bus, respectively. The packet communication device 73 includes a connection control unit 731, a primary interface 732, a secondary interface 733, a connection control unit 734, and an operation mode control unit 735. The connection control unit 731 is connected an external bus 71 and switches connection paths to an internal block depending on whether the external bus 71 is on the primary side or the secondary side. The connection control unit 734 is connected an external bus 74 and switches connection paths to the internal block depending on whether the external bus 74 to be connected is on the primary side or the secondary side. The primary interface 732 is connected to the primary external bus and the secondary interface 733 is connected to the secondary external bus. The operation mode control unit 735 controls a connection between the connection control unit 731 and the connection control unit 734 by a designation of the control bus 72.
The operation mode control unit 735 receives a control signal from the control bus 72. The control signal notifies that the external bus 71 or the external bus 74 is the primary bus. By using the information, the connection control unit 731 is connected to one of the primary interface 732 and the secondary interface 733, and the connection control unit 734 is connected to the other of primary interface 733 and secondary interface 732. According to this setting, the primary interface 732 is connected to the primary bus, and the secondary interface 733 is connected to the secondary bus.
A first disadvantage of the packet communication device is that a system administrator or management software must set an appropriate operation mode of the packet communication device according to connection environment to the outside of the device.
A second disadvantage of the packet communication device is that a physical device or dedicated software to set an operation mode of a packet communication device is necessary.

Packet communication device which selects an appropriate operation mode


The present invention provides a phthalate-free plasticizer for polymer resins. The phthalate-free plasticizer according to the invention includes a mixture of different triesters of glycerin, at least one of which meets the formula:

1. Field of Invention
The present invention provides a plasticizer for polymer resins, and more particularly, a phthalate-free plasticizer for polymer resins comprising a mixture of different triesters of glycerin, and a method of making the same.
2. Description of Related Art
Plasticizers are compounds or mixtures of compounds that are added to polymer resins to impart softness and flexibility. Phthalic acid diesters, which are also called phthalates, are the primary plasticizers for most flexible polymer products, especially polymer products formed from polyvinyl chloride (PVC) and other vinyl polymers. Examples of common phthalate plasticizers include, for example, di-isononyl phthalate (DINP), diallyl phthalate (DAP), and di-2-ethylhexyl-phthalate (DEHP).
Although phthalate plasticizers have been tested for more than 40 years and are among the most studied and best understood compounds in the world from a health and environmental perspective, phthalate plasticizers have recently come under intense scrutiny by public interest groups that are concerned about the potential of adverse health effects in children exposed to these chemicals. Consequently, there is a demand for phthalate-free plasticizers that provide the same properties when added to polymer resins such as, for example, vinyl polymers, rubbers, polyurethanes, and acrylics.
The present invention provides a phthalate-free plasticizer for polymer resins and a method of making the same. A phthalate-free plasticizer according to the present invention comprises a mixture of different triesters of glycerin, at least one of which meets the formula:
xe2x80x83CH2(OOR1)CH(OOR2)CH2(OOR3)
wherein at least two of R1, R2, and R3 are different alkyl or aryl groups. In a preferred embodiment, R1, R2, and R3 each contain up to about 11 carbon atoms, and more preferably from about 2 to about 11 carbon atoms each.
The phthalate-free plasticizer according to the present invention is very compatible with a wide variety of polymers including vinyl polymers, rubbers, polyurethanes, and acrylics. In addition, the phthalate-free plasticizer according to the invention has superb thermostability and low volatility.
The phthalate-free plasticizer according to the invention can be made by heating glycerin and a mixture of at least two different acids in the presence of a catalyst to form a mixture of different triesters of glycerin, at least one of which meets the formula:
CH2(OOR1)CH(OOR2)CH2(OOR3)
wherein at least two of R1, R2, and R3 are different alkyl or aryl groups. In a preferred embodiment, the glycerin and mixture of acids are heated while under a partial vacuum to assist in the removal of water.
The foregoing and other features of the invention are hereinafter more fully described and particularly pointed out in the claims, the following description setting forth in detail certain illustrative embodiments of the invention, these being indicative, however, of but a few of the various ways in which the principles of the present invention may be employed.
The present invention provides a phthalate-free plasticizer for polymer resins. As used in the instant specification in the appended claims, the term xe2x80x9cphthalate-freexe2x80x9d means that the plasticizer does not contain any phthalate diesters, which are also known in the art simply as phthalates.
A phthalate-free plasticizer according to the invention comprises a mixture of different triesters of glycerin, at least one of which meets the formula:
CH2(OOR1)CH(OOR2)CH2(OOR3)
wherein at least two of R1, R2, and R3 are different alkyl or aryl groups. In other words, R1 and R2 can be the same but R3 must be different, or R1 and R3 can be the same but R2 must be different, or R2 and R3 can be the same but R1 must be different. Preferably, R1, R2, and R3 each contain up to about 11 carbon atoms, and more preferably from about 2 to about 9 carbon atoms each.
A phthalate-free plasticizer according to the invention can be formed by the process of esterifying glycerin with a mixture comprising at least two different acids to form a mixture of different triesters of glycerin. The acids comprising the mixture are preferably a mixture of alkyl acids and aryl acids.
The alkyl carboxylic acids used in the mixture can (but need not) be halogenated. Such acids can be linear, branched, or have cyclic moieties. Preferably, the alkyl carboxylic acids contain up to about 11 carbon atoms, or from about 2 to about 11 carbon atoms, or more preferably from about 4 to about 9 carbon atoms. Suitable alkyl acids include, for example, acetic acid, bromoacetic acid, propanoic acid, 2-chloropropanoic acid, 3-chloropropanoic acid, butanoic acid, 2-methylpropanoic acid, 2-ethylpropanoic acid, pentanoic acid, 2-methylbutanoic acid, 3-methylbutanoic acid, 2-ethylbutanoic acid, 2,2-dimethylbutanoic acid, 2,3-dimethylbutanoic acid, 3,3-dimethylbutanoic acid, 2-methylpentanoic acid, 3-methylpentanoic acid, 4-methylpentanoic acid, hexanoic, cyclopentyl acetic acid, cyclopentyl propanoic acid, cyclopentyl hexanoic acid, cyclohexane carboxylic acid, cyclohexane acetic acid, 2-ethylhexanoic acid, nonadecafluorodecanoic acid, decanoic acid, and undecanoic acid.
The aryl carboxylic acids used in the mixture have one are more aromatic rings. Such acids can (but need not) be substituted, with one or more aromatic hydrogens being replaced by alkyl, halogen, ether, and/or ketone substituent groups. Suitable aryl acids include, for example, benzoic acid, 2-methylbenzoic acid, 3-methylbenzoic acid, 4-methylbenzoic acid, 2-ethylbenzoic acid, 3-ethylbenzoic acid, 4-ethylbenzoic acid, 4-isopropylbenzoic acid, 4-tertiary butylbenzoic acid, 4-(1-methylpropyl)benzoic acid, 2-ethoxybenzoic acid, 3,4-dimethoxybenzoic acid, 4-methoxy-2-methylbenzoic acid, 4-acetylbenzoic acid, acetylmandelic acid, 2-chlorobenzoic acid, 3-chlorobenzoic acid, 4-chlorobenzoic acid, 2,3-dibromobenzoic acid, 2,4-di-iodobenzoic acid, 2,6-dibrombenzoic acid, 3,4-dibromobenzoic acid, 3,5-dichlorobenzoic acid, 2,3,5-tribromobenzoic acid, 2,4,6-trichlorobenzoic acid, 2,3,4,5,6-pentabromobenzoic acid, 1-naphthoic acid, 2-naphthoic acid, 4-biphenyl carboxylic acid, 2-biphenyl carboxylic acid, 4-biphenyl acetic acid, furfuryl carboxylic acid, and 3-pyridinecarboxylic acid.
In order to fully esterify one mole of gylcerin, three moles of acids are needed. In the preferred embodiment of the invention, for every mole of gylcerin that is esterified, a three mole mixture of different acids is used. Preferably, the three mole mixture of different acids comprises from about 0.5 to about 2.5 moles of an alkyl acid and from about 0.5 to about 2.5 moles of an aryl acid. It will be appreciated that in excess of three moles of different acids can be charged to the reactor for every mole of glycerin to be esterified, but only three moles of acids per mole of glycerin will actually participate in the reaction. A particularly preferable mixture of acids comprises 1.25 moles an alkyl acid (e.g., butanoic acid) and 1.75 moles of an aryl acid (e.g., benzoic acid) per mole of gylcerin esterified.
It will be appreciated that when the mixture of acids comprises a blend of only two different acids (e.g., R1OOH and R2OOH), as many as six different glycerin triesters may be present in the resulting product: (e.g., CH2(OOR1)CH(OOR1)CH2(OOR1); CH2(OOR1)CH(OOR1)CH2(OOR2); CH2(OOR1)CH(OOR2)CH2(OOR1); CH2(OOR2)CH(OOR2)CH2(OOR1); CH2(OOR2)CH(OOR1)CH2(OOR2); and CH2(OOR2)CH(OOR2)CH2(OOR2). And, when the mixture of acids comprises a blend of three different acids (e.g., R1OOH, R2OOH, and R3OOH), as many as eighteen different glycerin triesters may be present in the resulting product: (e.g., CH2(OOR1)CH(OOR1)CH2(OOR1); CH2(OOR1)CH(OOR1)CH2(OOR2); CH2(OOR1)CH(OOR2)CH2(OOR1); CH2(OOR2)CH(OOR2)CH2(OOR1); CH2(OOR2)CH(OOR1)CH2(OOR2); CH2(OOR2)CH(OOR2)CH2(OOR2); CH2(OOR1)CH(OOR1)CH2(OOR3); CH2(OOR1)CH(OOR3)CH2(OOR1); CH2(OOR3)CH(OOR3)CH2(OOR1); CH2(OOR3)CH(OOR1)CH2(OOR3); CH2(OOR3)CH(OOR3)CH2(OOR3); CH2(OOR2)CH(OOR2)CH2(OOR3); CH2(OOR2)CH(OOR3)CH2(OOR2); CH2(OOR3)CH(OOR3)CH2(OOR2); CH2(OOR3)CH(OOR2)CH2(OOR3); CH2(OOR1)CH(OOR2)CH2(OOR3); CH2(OOR1)CH(OOR3)CH2(OOR2); and CH2(OOR2)CH(OOR1)CH2(OOR3). Including a greater the number of different acids in the mixture of acids substantially increases the number of different triesters of glycerin present in the resulting product.
In order to obtain a plasticizer that is compatible with polymer resins, it is critical that the plasticizer comprise a mixture of different triesters of glycerin, with at least one of such triesters of glycerin meeting the formula:
CH2(OOR1)CH(OOR2)CH2(OOR3)
wherein at least two of R1, R2, and R3 are different alkyl or aryl groups. Throughout the specification and in the appended claims, a plasticizer is considered to be compatible if it obtains an average grading of less than 1 in five trials conducted in accordance with the ASTM D 3291-97 standard.
For example, glyceryl tribenzoate (CAS No: 614-33-5) and glyceryl tributyrate (CAS No: 60-01-5) are commercially available triesters of glycerin that have been used as ink additives, in cosmetic formulations, and in the detergent industry. Glyceryl tribenzoate is not used as a primary plasticizer in vinyl polymers such as PVC because it is known to be relatively incompatible and/or inefficient. Glyceryl tributyrate has been used as a plasticizer in a biodegradable lactic-acid based polymer (see, e.g., Grandjean, U.S. Pat. No. 5,296,229), but it has not been used as a primary plasticizer in other resins, most probably due to its high volatility. Surprisingly, however, when these two commercially available triesters of glycerin are included as part of a mixture of different triesters of glycerin meeting the formula CH2(OOR1)CH(OOR2)CH2(OOR3), wherein at least two of R1, R2, and R3 are different alkyl or aryl groups (i.e., the mixture includes glyceryl tribenzoate, glyceryl tributyrate, and glyceryl [1,2] bisbutanoate benzoate, glyceryl [1,3] bisbutanoate benzoate, glyceryl [1,2] bisbenzoate butanoate, and glyceryl [1,3] bisbenzoate butanoate), the mixture of different triesters of glycerin is very compatible with vinyl polymers including PVC, and provides other desirable properties required of a plasticizer, such as good thermostability, fast rate of fusion, low volatility, and low viscosity.
Phthalate-free plasticizers according to the present invention are preferably formed by heating glycerin and the mixture of different acids under a partial vacuum in the presence of a catalyst to form the mixture of different triesters. Suitable catalysts include, for example, acid catalysts such as benzene sulfonic acid and toluene sulfonic acid, metal oxide catalysts such as zinc oxide and titanium oxide, and zirconium-based catalysts such as zirconium acetate and zirconium oxide. Zirconium acetate is the presently most preferred catalyst for use in the invention. A small excess amount of acid provides reflux for continuous water removal. At the end of the reaction, excess acids can be vacuum stripped from the resulting crude mixture of gylcerin triesters, and the crude mixture of glycerin triesters can be further refined to remove color producing species, excess acid, and catalyst.
The relative amount of each of the species of different triesters of glycerin in the resulting product (i.e., product distribution) is dependent upon factors including temperature, reaction time, initial concentration of starting materials, and steric hindrance of starting materials. In the presently most preferred embodiment of the invention, a plasticizer comprises from about 5% to about 20% by weight glyceryl tribenzoate, from about 5% to about 20% by weight glyceryl [1,2] bisbutanoate benzoate, from about 15% to about 40% by weight glyceryl [1,3] bisbutanoate benzoate, from about 15% to about 40% by weight glyceryl [1,2] bisbenzoate butanoate, from about 5% to about 25% by weight glyceryl [1,3] bisbenzoate butanoate, and from about 5% to about 20% by weight glyceryl tributanoate.
Phthalate-free plasticizers according to the present invention can be used in a wide variety of polymer resins. For example, the plasticizers according to the invention can be used in vinyl polymers such as, for example, PVC, polyvinyl acetate, and polyvinyl butryal. They can also be used in rubbers such as, for example, nitrile and styrene-butadiene rubber (SBR), polyurethanes, and in thermoplastics such as acrylics. Other applications include polysulfides and cellulose.
The following examples are intended only to illustrate the invention and should not be construed as imposing limitations upon the claims.

Abstract: wherein at least two of R1, R2, and R3 are different alkyl or aryl groups. Phthalate-free plasticizers according to the invention can be made by esterifying glycerin with a mixture of acids in the presence of a catalyst. In the presently most preferred embodiment of the invention, the mixture of acids includes benzoic acid and butanoic acid. The plasticizer according to the invention can be used to modify the properties of a wide variety of polymers including vinyl polymers, rubbers, polyurethanes, and acrylics, and has superb thermostability and low volatility.


A first torque determining unit determines a value of a torque input to a transmission on the basis of a load acting on a start clutch (12), and a second torque determining unit determines a value of a torque input to the transmission on the basis of a manipulated amount of an accelerator pedal. After the accelerator pedal is manipulated while the start clutch (12) is in a released state, as long as the torque determined by the first torque determining unit (31a1) is less than the torque determined by the second torque determining unit (31a2), the torque input to the transmission is limited to the torque determined by the first torque determining unit (31a1).

Hitherto, as a control device for controlling an output torque of a driving source at the startup of a vehicle, there has been disclosed a control device in the following Patent document 1, for example. According thereto, when a start clutch is in a released state, by limiting the output torque of an engine of the vehicle, the revolution number of the engine is prevented from becoming too great.


Processes for producing valve metal are described, in which valve metal oxide is converted to valve metal using a vapor-phase transport agent to form a gaseous valve metal species in the presence of a solid getter material. Also described is the valve metal so produced, and anodes prepared from the valve metal, as well as electrolytic capacitors using the anodes.

The present invention relates to valve metals and electrolytic capacitors using the valve metals, and methods of making the valve metals and the capacitors. More particularly, the present invention relates to processes for converting valve metal oxide to valve metal, and articles such as capacitors made from the valve metal.
Valve metals, e.g., tantalum and niobium, are generally extracted from ores and formed into powders. Tantalum powders, for example, which are suitable for use in high performance capacitors, can be produced by chemical reduction, such as the sodium reduction of potassium fluorotantalate. In conventional processes, the potassium fluorotantalate is recovered from processed ore in the form of a dry crystalline powder. The potassium fluorotantalate is dissolved in a molten salt bath and reduced to tantalum metal powder by sodium reduction. The tantalum powder formed is then washed and acid leached, as described, for example, in U.S. Pat. Nos. 6,312,642, and 5,993,513, which are incorporated in their entireties herein by reference. The tantalum is then dried, producing what is known as a basic lot powder.
The basic lot powder can include various contaminants, including oxygen, that are undesirable and/or should be removed by further processing of the basic lot powder to produce capacitor-grade valve metal powder. Oxidation of valve metal powder can occur at various stages in the production or processing of the valve metal material made by various active or passive processes. For example, the valve metal can gain an oxide layer due to surface reaction with air under ambient or other conditions. Accordingly, the basic lot powder is typically subjected to one or more decontaminating techniques, such as deoxidizing, to produce a capacitor grade metal powder.
Accordingly, a need exists for processes for producing capacitor-grade valve metal having high purity which are less time consuming and less resource-intensive than conventional methods for producing a valve metal.


A method and an apparatus for estimating likelihood values for signals of a sequence of signals transmitted from a transmitter through a channel to a receiver. The method employs a plurality of particles, each particle having a postulated transmitted signal history, and includes initializing a set of particles, evolving the set of particles over time to generate a succession of evolved sets of particles, tracing a plurality of paths through the succession of evolved sets of particles backwards in time, and determining a sequence of likelihood values for the transmitted sequence of signals using the paths. Communication systems in which a receiver receives signals from a transmitter with a plurality of transmit antennas, such as MIMO (Multiple-Input Multiple-Output) systems are able to use this method.

All digital communication receivers are faced with the task of estimating the transmitted signal with the greatest degree of accuracy, while performing the operation as rapidly and simply as possible. In practice, there is an inevitable trade-off between decoding accuracy and speed of processing.
It is possible to exhaustively search all of the possible signal combinations that, when modified by the channel, could have resulted in the received signal. Unfortunately, this process, of considering every conceivable signal combination that could have generated a specific signal is extremely complex. The problem is compounded for high data rate systems that employ multiple element transmit and receive antennas.
A particular problem arises in a communications links where a transmitter with more than one transmit antenna is employed since signals received from different transmit antennas interfere with one another. This results in so-called multi-stream interference (MSI) and causes decoding difficulties. The potential advantage, however, is greatly increased throughput (that is, a higher bit rate) for such a communications link. In this type of MIMO (Multiple-input Multiple-output) communication link the "input" (to a matrix channel) is provided by the transmitter's plurality of transmit antennas and the "output" (from a matrix channel) is provided by a plurality of receive antennas. Thus each receive antenna receives a linear combination of signals from all the transmitter's transmit antennas and the separate signals sent from each transmit antenna must be extracted from this combination.
A typical wireless network comprises a plurality of mobile terminals (MT) each in radio communication with an access point (AP) or base station of the network. The access points are also in communication with a central controller (CC) which in turn may have a link to other networks, for example a fixed Ethernet-type network. Until recently considerable effort was put into designing systems so as to mitigate for the perceived detrimental effects of multipath propagation, especially prevalent in wireless LAN (local area network) and other mobile communications environments. However it has been recognised that multipath propagation can be used to an advantage, as in effect, this uniquely affects or labels a spatial path, facilitating the separation of the superposition of signals at the receiver. Work G. J. Foschini and M. J. Gans, "On limits of wireless communications in a fading environment when using multiple antennas" Wireless Personal Communications vol. 6, no.3, pp. 311-335, 1998 has shown that by utilising multiple antenna architectures at both the transmitter and receiver (a so-called multiple-input multiple-output (MIMO) architecture) increased channel capacities are possible (in effect, spatial multiplexing). Attention has also turned to the adoption of space-time coding techniques (in OFDM, space-frequency coding) for wideband channels. Typically channel state information (CSI) for maximum likelihood detection of such coding is acquired via training sequences and the resulting CSI estimates are then fed to a Viterbi decoder.
Another technique for space-time code detection in a MIMO system based upon the use of periodic pilot sequences and interpolation filters is described in A. Naguib, V. Tarokh, N Seshadri and A. Calderbank "A space-time coding based model for high data rate wireless communications" IEEE J-SAC vol. 16, pp. 1459-1478. Octocber 1998. However this is a diversity technique which does not directly increase the bit rate.
FIG. 1 shows a simple example of MIMO communication system 100 in which an information source 102 provides information symbols s(t) at time t which are transmitted simultaneously, that is, spatially multiplexed, from transmit antennas 104. These symbols can be interrelated through coding. A plurality M of receive antennas 106 receives respectively signals r1(t), . . . rm(t) which are input to receiver 108. The receiver 108 provides on output 110 an estimate ŝ(t) of the transmitted symbol ŝ (t). There is a plurality of channels between the transmit and receive antennas, for example all channels with two transmit antennas and two receive antennas. Periodic pilot sequences in the transmitted signal may be used to estimate the time varying responses of these channels.
Third generation mobile phone networks use CDMA (Code Division Multiple Access) spread spectrum signals for communicating across the radio interface between a mobile station and a base station. These 3G networks are encompassed by the International Mobile Telecommunications IMT-2000 standard (www.ituint) and the UMTS (Universal Mobile Telecommunications System) system is the subject of standards produced by the Third Generation Partnership Project (3GPP, 3GPP2), technical specifications for which can be found at www.3gpp.org. Fourth generation mobile phone networks and other communications systems, although not yet defined, may employ MIMO-based techniques.
In practical data communication systems multipath propagation within a channel results in intersymbol interference (ISI), which is often corrected with a combination of equalisation and forward error correction (FEC) coding. For example a linear equaliser effectively deconvolves the received data from the channel impulse to produce data estimates with ISI substantially removed. Alternatively OFDM may be employed to effectively define a series of narrowband channels and avoid ISI by the use of a guard interval and cyclic prefix. An optimal equaliser may employ maximum likelihood (ML) sequence estimation or maximum a priori estimation (MAP), for example using a Viterbi algorithm. Where data has been protected with a convolutional code a soft input Viterbi decoder may be employed, usually together with data interleaving to reduce the effects of burst errors. Such approaches provide optimal equalisation but become impractical as the symbol alphabet size and sequence length (or equivalently channel impulse response length) increases.
Turbo equalisation achieves results which are close to optimal but with substantially reduced complexity compared to non-iterative joint channel equalisation and decoding. Broadly speaking turbo equalisation refers to an iterative process in which soft (likelihood) information is exchanged between an equaliser and a decoder until a consensus is reached. The effect of the channel response on the data symbols is treated similarly to an error correction code and typically a soft output Viterbi algorithm (SOVA) is used for both. Again, however, such techniques are impractically complex for large delay spreads and symbol alphabets, particularly as several processing iterations may be needed to achieve convergence for a single data block. These difficulties are significantly exacerbated where signals from more than one transmit antenna must be disentangled and equalised, with a different channel response for each transmit antenna or transmit-receive antenna pair.
The exhaustive search described above, grows exponentially in complexity with the number of channel taps, the size of the constellation and the number of MIMO sub-channels. For practical MIMO systems this optimum solution imposes far too heavy a burden on the processor of the receiver.
An alternative detection method to exhaustive searching is to use computationally simpler linear filtering, which performs decoding based on minimisation of some error metric, such as minimum mean square error (MMSE). Unfortunately, these methods have relatively poor performance for MIMO systems.
Outside the context of telecommunications systems, where different problems are encountered, a particle filtering-based statistical technique has been used for speech processing (see W. Fong, S. J. Godsill, A. Doucet, and M. West, "Monte Carlo smoothing with applications to audio signal enhancements", IEEE Trans Signal Proc, vol 50, no 2 pp 438-488, 2002).
There is therefore a need for reduced computational complexity equalisation and decoding methods and apparatus, for example, for applications in MIMO systems.


The present invention provides a switching circuit to regulate an output voltage and a maximum output current at the primary side of a resonant power converter. The switching circuit includes a pair of switching devices and a controller. The controller is coupled to a transformer to sample a voltage signal thereof and generates switching signals to control the switching devices. The switching frequency of the switching signals is increased in response to the decrease of the output voltage. The increase of the switching frequency of the switching signals decreases the power delivered to the output of the resonant power converter. The output current is therefore regulated.

1. Field of the Invention
The present invention relates generally to power converters, and more particularly, to a switching circuit for a primary-side regulated resonant power converter.
2. Description of the Related Art
Recently, most prior-art technologies are developed on flyback switching topology, such as "Switching Control Circuit for Primary-side Controlled Power Converters" U.S. Pat. No. 7,362,592, and "Primary-side Controlled Switching Regulator" U.S. Pat. No. 7,352,595, etc.
In resonant switching power converters, the inherent soft-switching characteristic thereof is advantageous to reduce the EMI (Electro-Magnetic Interference). However, in conventional arts, a secondary feedback circuit is still required for providing the information of an output voltage of the resonant power converter. The device counts of the secondary feedback circuit dominate the main cost and lower the conversion efficiency of the resonant power converter.
As a result, there is a need to provide a primary-side regulated resonant power converter with lower cost and higher power conversion efficiency.

Switching circuit for primary-side regulated resonant power converters


A through silicon via (TSV) structure including a semiconductor substrate; a first inter-metal dielectric (IMD) layer on the semiconductor substrate; a cap layer overlying the IMD layer; a conductive layer extending through the cap layer, the first IMD layer and into the semiconductor substrate; a tungsten film capping a top surface of the conductive layer; a second IMD layer overlying the cap layer and covering the tungsten film; and an interconnect feature in the second IMD layer.

1. Field of the Invention
The present invention relates generally to semiconductor technology, and more particularly to a through-silicon via (TSV) for connection of stacked chips and a method for forming the same.
2. Description of the Prior Art
Packaging technology for an integrated circuit has continuously been developed to meet the demand toward miniaturization and mounting reliability. As known in the art, stack package is a vertical stand or pile of at least two chips or packages, one atop the other. By using a stack, in the case of a memory device for example, it is possible to produce a product having a memory capacity which is two times greater than that obtainable through semiconductor integration processes.
A stack package provides advantages not only through an increase in memory capacity but also in view of a mounting density and mounting area utilization efficiency. As an example of a stack package, a through-silicon via (TSV) has been disclosed in the art. The stack package using a TSV has a structure in which the TSV is formed in a chip so that chips are physically and electrically connected with each other through the TSV.
Through silicon via (TSV) is typically fabricated to provide the through-via filled with a conducting material that pass completely through the silicon layer to contact and connect with the other TSVs and conductors of the bonded layers. For example, a vertical hole is defined through a predetermined portion of each chip at a wafer level. An insulation layer is formed on the surface of the vertical hole. With a seed metal layer formed on the insulation layer, a metal is filled into the vertical hole through an electroplating process to form a TSV. Then, the TSV is exposed through back-grinding of the backside of a wafer. After the wafer is sawed and is separated into individual chips, at least two chips can be vertically stacked, one atop the other, on one of the substrates using one or more of the TSV. Thereupon, the upper surface of the substrate including the stacked chips is molded, and solder balls are mounted on the lower surface of the substrate.

Through-silicon via and fabrication method thereof


An electronic circuit, an RF signal power amplifier circuit, and an integrated circuit provide for combining two radio frequency signals. These circuits include, among other things, capacitors (276, 282) that provide an elliptic section. This elliptic section simultaneously allows for filtering and reduction in required values for first and second inductors (248, 272), respectively. For example, the filtering provided by the capacitors (276, 282) allows for the harmonic of the combining frequency to be filtered out. This allows a designer to compensate for additional loss experienced by the circuit (200) by reducing filtering from sections that follow the circuit (200).

A combiner is an electrical circuit that can combine a plurality of signals into a single signal. Within wireless communication technologies a combiner can be used to combine two or more radio frequency ("RF") signals into a signal. However, conventional RF combiners have various problems and disadvantages when used within modern wireless communication technologies. For example, when combining RF signals at Very High Frequencies ("VHF"), conventional RF combiners require components with large values. For example, wireless communication technologies use inductors of values around 72 nH for VHF applications. Large inductances are difficult to implement if the circuits are to be low loss. Higher component values result in higher turns and greater losses. These values are too large to be implemented into modern wireless communication system components which more and more require miniaturization to accommodate consumer demands for smaller products.
Therefore a need exists to overcome the problems with the prior art as discussed above.


A system and method for transmitting and for detecting a transmission power level of a carrier of aggregated carrier signals is configured to generate a plurality of carrier signals as a carrier aggregated signal and to generate an outgoing radio frequency (RF) signal based on the carrier aggregated signal and to produce a feedback signal based the outgoing RF signal. The system process the feedback signal by down converting a first carrier signal within the feedback signal from RF, canceling a down converted harmonically-related signal or an ADC Fs related signal of a second carrier of the carrier aggregated signal and producing a signal representative of the output power of the first carrier of the carrier aggregated signal within the feedback signal.

A mobile telecommunication device such as a user equipment (UE) or a base station may use carrier aggregation to increase data transmission rates. The network through which the communications occur are part of a large group of cellular base stations and UEs. At times, various communications may interfere with other communications by creating interference from signal power and frequency conflicts. As such, it is often desirable to control outgoing power levels. In the case of a carrier aggregated signal, however, a typical control scheme includes controlling the outgoing power level for each of the carriers. To do this, however, it is often necessary to get an accurate outgoing power transmission level for each of the carriers. In some devices, a feedback signal is converted to a digital form for evaluation of the power level of each carrier. Unfortunately, however, in a multiple carrier embodiment, one carrier transmission may affect a power reading of another carrier. As such, erroneous power level readings for a given carrier affects the operation and control of the associated outgoing transmission power level. It is desirable, therefore, to improve the accuracy of the measurements for the individual carriers of an outgoing carrier aggregated transmission in a way that reduces circuitry.


This invention is directed to an electrical distribution terminal block and modularly couplable electrical receptacles wherein the terminal block is formed by a plurality of stackable wafers. Each wafer has upper channels formed therein that radiate from a common upper interior intersection point to an outer surface thereof, and lower channels formed therein that radiate from a common lower interior intersection point to an outer surface thereof. When the wafers are vertically stacked, the upper channels of one wafer complementally form ducts with the lower channels of another wafer, each duct having an outlet or port in communication with the exterior of the terminal block. An electrical terminal, formed in a configuration adapted to be received in the upper or lower channels, is disposed in each formed duct and includes connectors for coupling to incoming and outgoing wires of a polarity including neutral, and for coupling that polarity or neutral to a terminal of the receptacle. Each electrical receptacle includes projections that house outlet terminals, the projections received in the appropriate ports of the ducts.

1. Field of the Invention
The present invention relates to electrical receptacles and, more particularly, to an electrical terminal block and couplable electrical receptacles.
2. Description of the Related Art
Electrical receptacles or outlets are well known as a means for providing an interface between a supply or source of electricity and an appliance, took equipment, or the like. Such receptacles come in a variety of plug configurations, most of which are standardized according to the type of use. For instance, most people are familiar with the standard household receptacle which has a two slots and a round or D-shaped ground opening.
Because of the proliferation of electrical equipment, electrical outlets or receptacles must be provided almost everywhere. This is especially true in the workplace, where computers, printers, facsimile machines, telephones, and the like must be connected to an electrical outlet. Also, the workplace has evolved to where there is more than just the conventional type of furniture. Now there are modular units, cubicles and the like which may be located away from walls and other structures where electrical receptacles/outlets are traditionally located. In this type of office furniture, electrical receptacles are typically located along the bottom or side rails of the support structures.
However, since there needs to be plenty of electrical receptacles to handle the myriad of office equipment needing electricity, wiring is a problem. Further, there is a need for greater flexibility in locating and configuring the needed electrical receptacles. As well, accessibility of the outlets is a concern.
The present invention is a terminal block for the distribution of electricity to electrical receptacles or outlets.
In one form the present invention is a stackable terminal block for the distribution of electricity to electrical receptacles. The terminal block is formed by a plurality of stackable wafers. The wafers retain terminals therebetween that distribute the electricity. Each terminal accommodates one wire of the electrical cable, which also couples to one portion of the electrical receptacle/outlet. Several receptacles may be modularly coupled to the terminal block.
Essentially each wafer has upper channels formed therein that radiate from a common upper interior intersection point to an outer surface thereof, and lower channels formed therein that radiate from a common lower interior intersection point to an outer surface thereof. When the wafers are vertically stacked, the upper channels of one wafer complementally form ducts with the lower channels of another wafer, each duct having an outlet or port in communication with the exterior of the terminal block. An electrical terminal, formed in a configuration adapted to be received in the upper or lower channels, is disposed in each formed duct and includes connectors for incoming and outgoing wires of a certain polarity, and for coupling to a terminal of an electrical receptacle. Each electrical receptacle includes projections that house outlet terminals, the projections received in the appropriate ports of the ducts.
According to an aspect of the present invention, the modular electrical receptacles can be plugged into the terminal block in any number, and can have terminals configured in any manner to accommodate the wiring of the terminal block.
It is an advantage of the present invention that the configuration of the terminal block may be varied.
It is another advantage of the present invention that several terminal blocks may be electrically coupled, generally in a vertical relationship, for a plurality of electrical receptacles along a column or post.
It is yet another advantage of the present invention that the terminal block may be adapted for one or a plurality of electrical receptacles.
It is further an advantage of the present invention that building blocks or wafers of the terminal block may be varied for any number of wires and/or outlets.
It is still further an advantage of the present invention that the terminal block can accommodate or be interchangeable for any configuration of line polarity including neutral for any terminal.

Electrical terminal block and receptacles


An improved seating system that includes a seat back assembly (10) that is fabricated to include a seat back (12) with a first panel portion (14) that is optionally secured to a second panel portion (16) with one or more fasteners such as welds, adhesives, tack-offs, steel brackets or otherwise. The first panel portion (14), the second panel portion (16) or both preferably are plastic. The seat back assembly (10) may include one or more integrated reinforcement structures (20).

The present invention relates to an improved seating system, and more particularly to an improved system for automotive vehicle seating. The present invention also relates to improved automotive vehicle interior systems.
There is an ever-growing need for improved seating systems in automotive vehicles. The surge in popularity of hatchbacks, sport utility vehicles and minivans, has posed unique design challenges, in view of the need for seating to be adjustable and in many instances to restrain cargo carried toward the rear of the vehicle. In light of the increased consumer usage of these vehicles for stowage and transport of cargo along with passengers (particularly passengers in rear seats), manufacturers have turned their attention to improving the ability of the seating systems to withstand large loads.
One approach has been to develop improved systems for transmitting loads to the seat tracks of vehicle seating assemblies. A growing number of applications, however, employ attachment of seating components directly to the vehicle body in white for load distribution to the body in white. For the improved seat track technology to be viable in the latter applications, it would require substantial modification, which is believed would unduly complicate the manufacturing procedures, require the development of expensive new processing techniques, or add substantial weight to the vehicles. Accordingly, there is a need for an improved, readily manufactured seating system that is capable of meeting vehicle manufacturer design criteria and government standards for vehicles, and which can be efficiently and conveniently adapted for use in a variety of applications including those involving seat track load distribution, body in white load distribution or both.
In addition to having load bearing characteristics, it may be desirable for seating systems to include one or more additional functional features, ordinarily packaged elsewhere (e.g., in other locations of a vehicle). Examples of such features include ducts, vents, motors, electronic devices, entertainment devices, communications devices, other comfort, convenience or utilitarian features and the like. Accommodation of these features in conventional seats often poses difficulties given the limited packaging space available. Thus, there is also a need for a seating system that can integrate one or more comfort, convenience or other utilitarian features.
Examples of advantageous improved systems for seating are disclosed in commonly-owned and co-pending U.S. application Ser. No. 09/766,792 (filed Jan. 22, 2001), and No. 60/312,874 (filed Aug. 15, 2001), and No. 60/335,430 (filed Oct. 31, 2001), the teachings of which are hereby expressly incorporated by reference herein for all purposes.
The needs in the art are met by the automotive vehicle seating system of the present invention, which includes a plastic seat back having a first panel portion and an opposing second panel portion, optionally made separately from the first panel portion, and secured (e.g, with attachments such as welds, adhesives, mechanical joints, fasteners, tack-offs or the like) to the the first panel portion. In a preferred embodiment, one or both of the first and second panels portions include one or more integrated reinforcement structures for providing strength to the seat back when assembled. Optionally, the invention also includes an assembly for receiving the seat back and securing it to the vehicle body in white. Advantageously, the seating system displays no fragmentation upon rapid acceleration up to about 20 to about 30 g, with at least a 36 kg mass placed behind the seat back. The system is easy to manufacture and will not add substantial weight to the vehicle as compared with other commercial seating systems.