A shaft sealing system for a steam turbine includes at the high-pressure inlet end an outer air seal (40 ) and an outer steam seal (42 ) each comprised of segmented circumferential seals and a plurality of labyrinth seals (44, 46, 48). The low-pressure end of the turbine is provided with a segmented circumferential seal (60) substantially precluding ingress of air past the seal. The steam leaking past the inner two labyrinth seals (46 and 48) is returned to a stage of the turbine by a first leak-off pipe system (50). Air leaking past the air seal and steam leaking outwardly past the outer steam seal (42) is piped to the main condenser (58). High-pressure steam between the outer steam seal (42) and the outermost labyrinth seal (44) is piped via a second leak-off path (56) to a turbine stage downstream from the first-mentioned turbine stage.

The pressure boundary of a steam turbine casing is penetrated by a rotating turbine shaft in order to transmit power outside of the steam environment. Consequently, the shaft must be sealed at the points of penetration to prevent the escape of steam from the casing at locations where 'the casing pressure exceeds ambient press tire and to prevent leakage of air into the casing at locations where the casing pressure is below ambient.
Many sealing systems have been employed in the past for this purpose. For example, labyrinth-type seals have been employed about the shaft. Because the teeth of the meshing but non-contacting labyrinth seals inherently form leakage paths past the seal, labyrinth sealing systems require elaborate steam seal and vent piping subsystems normally including a steam seal regulator, a gland exhauster and a gland condenser. Typically, labyrinth seals provided at the high-pressure end of the turbine prevent high-pressure steam from escaping the turbine. At the opposite end of the turbine, labyrinth seals prevent the entry of air into the turbine low pressure or vacuum region. At turbine start-up, the labyrinth seal at the steam inlet end of the turbine functions as a vacuum seal in view of the vacuum which exists throughout the turbine. As well understood, the labyrinth seals are thus used to restrict the flow of steam and/or air along the shaft.
Even with the small clearances between the teeth of the labyrinth seals, it is necessary to control the pressure differential across the labyrinth at the high pressure end of the turbine with a stream seal regulator and gland exhauster. Thus, a seal header is conventionally maintained at a predetermined positive pressure and will either supply steam to the annulus between the seals or dump steam from the annulus, depending the pressure differential across the labyrinth seals defining the annulus. Similarly, steam under positive pressure must be supplied the shaft seals adjacent the flow outlet of the turbine, such that the labyrinth seals can effectively preclude entry of air into the turbine. Further, there is some difficulty in matching the steam's temperature supplied to the labyrinth seals to the needs of the metal at those locations.
From the foregoing, it will be appreciated that use of labyrinth seals alone for sealing turbine shafts requires extensive piping subsystems with attendant design and installation problems. The cost of such piping and its ancillary controls, valves, gland exhaustera and the like, as well as the maintenance required for that equipment indicates a need for improved shaft sealing for turbines.


A weft knitted double jersey fabric is knitted with a textured continuous filament synthetic yarn on a knitting machine having a gauge of 10 to 14 to give, in the relaxed state of the fabric, from 4 to 6 wales per cm and from 10.5 to 22 courses per cm. The yarn used preferably has a count of 550 to 850 decitex, especially 680 to 750 decitex and may be an air textured polyester yarn. The fabrics produced are dense, heavyweight fabrics with a weight of at least 380 gms/square meter. They have superior abrasion and snag resistance and are suitable for use as upholstery fabrics particularly for vehicle seat covers.

This invention relates to a knitted fabric suitable for use as an upholstery fabric, for example for covering seats in vehicles, particularly automobiles.
Hitherto, woven fabrics and some warp knitted fabrics have been used for covering automobile seats. Weft knitted fabrics, however, have not been used for this purpose because their known properties particularly their susceptibility to abrasion and snagging suggest that they will not be suitable.


A mixer for a plural component spray gun is presented. The mixer has a mixer body comprising a mixing chamber with an outlet. The mixer also has a first fluid component inlet, coupled to a first fluid conduit, configured to introduce a first fluid component into the mixing chamber. The mixer also has a second fluid component inlet, coupled to a second fluid conduit, configured to introduce a second fluid component into the mixing chamber. The first and second fluid component inlets are offset with respect to a centerline of the mixing chamber and positioned such that a first fluid flow from the first inlet is directed toward the outlet, and a second fluid flow from the second inlet is directed toward the outlet.

Plural component systems mix two or more fluids and apply the mixture to an application site. Plural component systems are often used to spray two components that, when mixed, react and cure on a surface. One particular usage for plural component systems is to generate a foam through the reaction of an A component and a B component that, when sprayed, react and cure quickly. Proper foam generation requires sufficient fluid delivery, sufficient chemical mixing, and sufficient fluid dispersal.
A plural component spray gun has three main components: a coupling block, a gun block, and a gun handle. The coupling block facilitates the two plural components entering a mixer, for example through an A-chemical or and a B-chemical port. The gun block includes filters, side seals, the mixer, and a fluid spray tip. The gun handle includes an air purge supply, a trigger mechanism, and an attachment to the gun block.

Mixer design for a plural component system


A locking device provided with: a striker-contact member (201) which is positioned on a hook (157) and is abutted against a striker being entered the groove (157a) of the hook (157) so as to sandwich the striker in cooperation with the groove (157a) of the hook (157); and a spring (hook-biasing member) (171) that urges the hook (157) in the unlocked position direction via the striker-contact member (201) and that urges the striker-contact member (201) in a direction a direction to be abutted against the striker.

An example of a background locking device is described with reference to FIGS. 9 and 10. FIG. 9 is a view for explaining an unlocked state of the background locking device. FIG. 10 is a view for explaining a locked state of the background locking device.
The locking device is attached to each of a moving-side member and a fixed-side member. In these figures, the moving-side member is, for example, a seat, a door, a trunk lid or an engine hood, which is provided to be rotatable relative to a floor of a vehicle. The fixed-side member is, for example, a vehicle body. The locking device is a device that is capable of preventing the relative movement between the moving-side member and the fixed-side member (e.g., see Patent Literature 1).
The locking device includes a base 1 and a striker 3. The base 1 is provided in one of the moving-side member and the fixed-side member, and the striker 3 is provided in the other one.
A shaft 2 is provided on the right portion of the base 1, and a hook 7 is rotatably provided on the shaft 2. A shaft 4 is rotatably provided on the left portion of the base 1, and a pawl 9 is provided on the shaft 4. A groove 1a is provided between the left portion and the right portion of the base 1.
The hook 7 is formed with a groove 7a into which the striker 3 is capable of entering. The hook 7 is formed with a concave portion 7b. The pawl 9 is formed with a convex portion 9a which is engageable with the concave portion 7b of the hook 7.
A spring 11 is caused to exert a force on the hook 7 and the pawl 9. One end of the spring 11 is locked to the hook 7 and the other end thereof is locked to the pawl 9. The spring 11 urges the hook 7 in an unlocked position direction (in the drawing, a direction of an arrow UL) and urges the pawl 9 in a direction (in the drawing, a direction of an arrow K) in which the convex portion 9a is engaged with the concave portion 7b of the hook 7.
A striker-contact member 13 is rotatably provided on the shaft 2 of the hook 7. One end of a spring 15 is locked to the base 1, and the other end thereof is locked to the striker-contact member 13. The spring 15 urges the striker-contact member 13 in the same direction as the unlock direction (in the drawing, the direction of the arrow UL) of the hook 7. The striker-contact member 13 is formed with a cam hole 13a.
The pawl 9 is provided with a pin 17 which is fitted into the cam hole 13a of the striker-contact member 13.
As shown in FIG. 10, a stopper portion 13b is formed in the cam hole 13a of the striker-contact member 13, and the pin 17 of the pawl 9 is capable of abutting against the stopper portion 13b.
The striker-contact member 13 is formed with a contact portion 13c, which is abutted against the striker 3 so as to sandwich the striker 3 in cooperation with a wall surface of the groove 7a of the hook 7 and a wall surface of the groove 1a of the base 1.
Next, an operation of the locking device configured as described above is described.
In the unlocked state shown in FIG. 9, the stopper portion 13b of the cam hole 13a of the striker-contact member 13 is abutted against the pin 17 of the pawl 9, and thus the striker-contact member 13 is prohibited from being further rotated in the direction of the arrow UL.
When a surface in the vicinity of an opening of the groove 7a of the hook 7 is pressed by the striker 3, the hook 7 is rotated in a locked position direction against an urging force of the spring 11. Then, the concave portion 7b of the hook 7 is engaged with the convex portion 9a of the pawl 9, so that the hook 7 is prohibited from being rotated in the unlock direction. In this way, the striker 3 becomes the locked state shown in FIG. 10, in which the striker 3 cannot be detached from the groove 7a of the hook 7.
When the convex portion 9a of the pawl 9 is engaged with the concave portion 7b of the hook 7, the pawl 9 is rotated in a direction of an arrow K. In this way, the abutment between the pin 17 of the pawl 9 and the stopper portion 13b of the cam hole 13a of the striker-contact member 13 is released. Further, the striker-contact member 13 is rotated in the direction of the arrow UL by an urging force of the spring 15. Then, the contact portion 13c of the striker-contact member 13 sandwiches the striker 3 in cooperation with the wall surface of the groove 7a of the hook 7 and the wall surface of the groove 1a of the base 1. In this way, the rattling between the striker 3 and the groove 7a of the hook 7 is eliminated.
On the contrary, in order to unlock the locked state shown in FIG. 10, the pawl 9 is rotated in a direction opposite to the direction of the arrow K against the urging force of the spring 11 and the spring 15. Then, the engagement between the convex portion 9a of the pawl 9 and the concave portion 7b of the hook 7 is released and the urging force of the spring 11 causes the hook 7 to be rotated to the unlocked position where the striker 3 is capable of entering the groove 7a. When a rotation operating force to the pawl 9 is released in this state, the convex portion 9a of the pawl 9 becomes the unlocked state shown in FIG. 9 by being abutted against the portion of the hook 7 other than the concave portion 7a.
The pin 17 is also moved by the movement of the pawl 9, and the stopper portion 13b of the cam hole 13a of the striker-contact member 13 comes to push the pin 17.


Disclosed are a smart learning system using a device social relation and a method thereof. The smart learning system includes a first device that generates a device social relation and shares learning content, and at least one second device that executes an event related to the learning content by acquiring the shared learning content when is included in the device social relation.

1. Field of the Invention
The present invention relates to a smart learning system, and more particularly, to a smart learning system using a device social relation and a method thereof.
2. Discussion of Related Art
In recent years, according to the development of digital technologies, electronic terminals capable of processing communication and personal information while moving such as mobile communication terminals, personal digital assistants (PDAs), electronic organizers, smartphones, tablet personal computers (PCs), and the like have been variously released.
Through rapid technological developments, the electronic terminals may have various functions such as video call function, electronic organizer function, document function, e-mail function, Internet function, social network service (SNS) function, and the like in addition to initial simple voice call and short message service (SMS) transmission function.
In particular, various functions of such electronic terminals have been used in learning by many people, and a smart learning method using a smart device in learning has been recognized as a significantly convenient learning method due to its temporal and spatial efficiency.
Specifically, smart learning and classes that utilize the electronic terminals in learning may provide utilization of various digital contents and a sharing function via a network, and therefore effective learning may be achieved compared to traditional learning using learning tools such as black boards, notes, and the like.
However, terminals of conventional smart learning or classes are connected to each other while each terminal performs a fixed role. Because of this, when mutual linkage among devices is required, familiarity with the usage of terminals that link with each other should be required.
As the types of the terminals become more diversified and functions of the terminals are gradually increased, familiarity with the usage of the terminals that link with each other may impose a lot of burdens to users.
In addition, in a case in which electronic constitution participating in learning is variable due to its portability or a case in which learning in various spaces rather than learning in a fixed space is needed, an existing learning terminal linkage method is subjected to a complex setting process or connection process at the time of connection or interaction among devices, and therefore a natural learning process of the traditional learning method level is difficult to be achieved, resulting in deterioration in learning efficiency.

Smart learning system using device social relation and method thereof

ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE


A semiconductor assembly includes plural chips stacked one above the other. One or more of the chips is a magnetic random access memory (MRAM). Use of MRAM alleviates problems caused by heat dissipation in the stack.

Semiconductor chips are commonly provided in packages which physically protect the semiconductor chip itself and which facilitate mounting of the chip to a circuit panel. Significant development has occurred in such packages, so as to reduce the size of the package relative to the size of the chip itself, and to provide packages which are compatible with modern circuit panel assembly techniques such as surface-mounting.
Semiconductor chips ordinarily are generally planar, thin elements having a front surface with contacts thereon connected to the internal semiconductor elements of the chips, an opposite, rear surface and edges extending between these front and rear surfaces. As used herein with reference to a semiconductor chip, the term "area" refers to the area of the front or rear surface of the chip. Certain chips, commonly referred to as "chip size packages" occupy an area of the circuit panel equal to the area of the chip itself, or only slightly larger than the area of the chip itself. Certain semiconductor chips have been provided heretofore in stacked arrangements so that the chips are superposed on one another, with the front or rear surface of one chip facing toward the front or rear surface of another chip. In many cases, the chips are functionally related to one another, so that they must be interconnected to one another. Such a stacked assembly can incorporate some or all of the required interconnections between the chips and, in some cases, can be prefabricated so that the stacked assembly may be handled, stocked and assembled to a larger circuit panel as a unit.
Stacking chips in this manner reduces the aggregate area of the circuit panel occupied by the chips. However, stacked chip arrangements suffer from some drawbacks with respect to heat dissipation. All else being equal, two chips mounted in a stacked arrangement will normally have higher internal temperatures than two individual chips mounted on separate portions of the circuit board. In some cases, this drawback precludes the use of stacked chips or requires expensive special cooling measures.
It is particularly desirable to provide a logic chip such as a processor or, particularly, a field programmable gate array ("FPGA") in a stacked package with memory used in conjunction with the logic chip. FPGAs typically are used with external memory chips. In some cases, the FPGA incorporates a small internal memory adequate for some applications, but not adequate for all applications. In other cases, the FPGA incorporates no internal memory at all. Because the FPGA exchanges large amounts of data at frequent intervals with the external memory, it is important to minimize signal propagation delays between the FPGA and the external memory chip. Also, numerous signal lines are required for this data interchange. If the FPGA and the external memory chip are both mounted separately on a circuit panel, the circuit panel must accommodate all of these signal lines, which may require a complex circuit panel with numerous layers of conductive traces. This, in turn, significantly increases the costs and reduces the reliability of the overall assembly.


A machine tool having a tool holder for exchangeably holding a tool is provided, the machine tool including: a machine tool housing; a spindle rotatably mounted in the machine tool housing a drive end being connected to a drive for rotating the spindle about an axis of rotation and a holding end being coupled to the tool holder; and a locking device arranged in the machine tool housing and which has a locking element reversibly movable between a release position and a locking position, a locking end of the locking element having an interlocking connector and the spindle having a mating interlocking connector, the interlocking connector being disengaged from the mating interlocking connector in the release position to enable rotational motion of the spindle, and the interlocking connector being engaged with the mating interlocking connector in the locking position to prevent rotational motion of the spindle and to enable an exchange of the tool of the tool holder, the locking device also including an electrically insulating mounting device for mounting the locking element in the machine tool housing to electrically insulate the locking element from the machine tool housing.

During use of a machine tool, for example a drywall cut-out tool, it is possible for the tool to encounter a current-carrying line.
In order to protect an operator in such a situation from electric shock when handling the machine tool, the machine tool housing is electrically shielded from the spindle at least in the regions which are touched or at least can be touched by an operator while using the machine tool. This electrical insulation can be achieved by supporting the spindle using electrically insulated mountings.
When exchanging the tool, however, the spindle has to be fixed by the operator, because otherwise the tool cannot be decoupled from the spindle. In order to fix the spindle, a locking device is provided which is to be actuated by the operator and comprises a locking element. In a machine tool of the type mentioned above, the locking element is usually made of metal for stability reasons and is therefore electrically conductive.
If the tool is still in contact with the electrical line and at the same time the locking device is actuated, the locking element comes into contact with the now electrically charged spindle, as a result of which the electrically insulating mounting of the spindle is bypassed by the machine tool housing. Since the locking device is mounted in the machine tool housing, the machine tool housing can also be electrically charged via the locking element and the spindle. There is then a risk of electric shock to the operator. A situation of this kind can arise when, for example, the tool comes into contact with a current-carrying line during machining of a wall and the rotating tool becomes so tightly entangled with the power line that releasing (e.g. pulling the tool out from the wall) is no longer possible. In this case, it is not impossible for an operator, as described above, to actuate the locking device with the intention of releasing the machine tool from the stuck tool.


Methods, systems and devices for evaluating a product sampling event. The disclosed methods, systems and devices receive from a user a user identification specific to the user and compare the user identification to a user data set stored on a computer-readable medium. A sample is then delivered based on a predetermined condition, and a product value is changed after the step of causing delivery of the sample of the product. It can then be determined whether the user purchased the product after delivery of the sample of the product and, based on that determination, a sampling event value can be assigned. The user's preferences can also be used to provide a more custom sample with a user's order for example, with online or home delivery shopping.

Consumer packaged goods manufacturers introduce many product innovations each year. A favorite marketing activity for introducing these new products to consumers in the market is conducting sampling events. Promotional events, including such product demonstrations and distribution of free samples, have become a valuable tool for emerging companies and existing companies introducing new brands into the already-saturated marketplace. While present methods of implementing product sampling events provide a consumer the ability to participate in a free trial prior to purchase, thereby reducing the risk of purchasing a product they may not enjoy, obvious disadvantages do exist. One such disadvantage of product sampling events is the inability to definitively measure whether the sampling activity caused a shopper to ultimately purchase the product sampled. Another disadvantage of current sampling activity relates to the ability to sample products consistently at hundreds or thousands of locations during a small time period window—such as close to large product launches—given the fact that current sampling activities rely upon scheduling and educating many human product samplers.
A third disadvantage to current sampling activity is the ability to conveniently (in terms of store operations) merchandise a volume of saleable product in close proximity to the sampling activity, thereby causing a shopper to search for the product if they are interested in purchasing after a product sample has been consumed. Finally, a potential situation even more unpleasant and damaging to a brand image, results from unsanitary conditions due to human interaction with and preparation of the product sample before distribution to the consumer. Particularly in instances where a product must be maintained at cool or warm temperatures, deviation from a consumable range may permanently disincline a consumer from purchasing that product, or any product in the brand, in the future.
In addition to product sampling events, shoppers are similarly familiar with enrollment and participation in customer loyalty card programs entitling members to special promotions, coupons, free trial items, discounts, with the expectation on behalf of both the retailer and the manufacturer that such benefits will bolster loyalties and effect shopping trends. While particular manufacturers may form economic relationships with retailers to have their products included in such customer loyalty card programs, the feedback provided to the manufacturer pertaining to its participation in the program may be confounded by concurrent in-store promotions or consumer incentives. More valuable trends, such as whether a customer has permanently switched from one brand to another because of a promotional event, is limited due to the retailer's divided attentions in serving customers, manufacturers, distributors, advertisers, franchisers, and other interests. Additionally, traditional product sampling events are not closely tied to customer loyalty programs, despite such a relationship having the potential to provide valuable information and services to all involved.
Data aggregation pertaining to consumer preferences with regard to product samples to this point has not existed. As is readily apparent, the grand potential for any of these activities —product demonstrations, customer loyalty card activity, and valuable and reliable data aggregation—had yet to be realized to truly derive the data-collection and brand development benefits to provide sampling to consumers and feedback to manufacturers in an effective and unobtrusive manner.

This patent is subject to a terminal disclaimer.

Method for measuring effectiveness of sampling activity and providing pre-market product feedback


A method for measuring dielectric constant of body endermic tissues and body impedance based on the method of frequency digital sampling and for evaluating body composition is provided, inputting the method through the I/O interface of a microprocessor the measured body weight frequency signals, oscillating frequency signals related to dielectric constant of body endermic tissues and body impedance signals corresponding to non-fixed different frequencies, and calculating through the software of the microprocessor the body fat content, total body water, ratio between intracellular water and total body water. The body weight, body fat content, total body water and ratio between intracellular water and total body water are displayed on the display. A body composition monitor based on the above method, which includes a weighing sensor, a weighing signal processing circuit, and a display unit.

Body composition refers to the total contents consisting of every tissue and organ of a human's body, its total weight is namely body weight, which is composed of two parts: fat and non-fat content. The former mass is called body fat mass, the ratio between it and body mass is called percent body fat (Fat %) in human body. The latter includes the weight of water, viscera, bones, muscle, mineral salts and so on, and is also called lean body mass or fat free mass, among which water content accounts for most of the mass. 70% fat content is mainly distributed in and below the region of the waist.
Body composition indicates the rates of lean body mass (LBM) and body fat. Different tissue body structure contents result in different body functions and activity, and in order to maintain the body's normal functions, it is required that all contents adjust to one another at certain rates. Once the maladjusted rates destroy the normal physiological functions and activity, the normal growth and health of the body will be affected. Body composition can also indicate physical attributes, body shape characteristic and body stature, and fat content can indicate body fitness. So body composition is significant to make the fitness standard and body shape assessment and so on.
There are already some methods for measuring body fat content alone, such as isotope dilution method, underwater weighing method, height and weight empirical algorithms, ultrasound measurement, infrared measurement and so on. All these methods have the shortcomings of complicated equipment and inconvenient operation.
There are three indices for measuring body water content: total body water (TBW), intracellular water (ICW) and extracellular water (ECW). TBW equals the sum of ICW and ECW, and these three indices are significant to assess the physical attributes and the balance status of intracellular and extracellular liquid. There are also corresponding methods for measuring body water. The method often used is drug dilution method. For example, to take certain doses of antibilin or D2O, after these medical substances disperse uniformly to global body, to extract some sample of blood and urine for testing. Also there is a method called multiple-factor isotope dilution, which can measure multiple body contents including water content from microcosmic aspect. None of these methods presented above can meet the demand of fast and integrated monitoring of body weight, fat and water content. Especially some methods of medical substance dilution, can only be done in hospitals, have long time period, cost much and can not be done as often as needed.
The method of bioelectrical impedance analysis (BIA) is considered to be the simplest method for measuring human body composition (such as fat content). This method is based upon the principle that body tissue conductivity of bio electricity in different areas of the body stimulated by outside electricity is different. For example, the conductivity of muscle is high and then the impedance is small because of its high rate of water content, while the conductivity of fat tissue, bone tissue and lung tissue filled with air is very low and the impedance is relatively great. So body composition can be estimated according to tissue's impedance. Up to now, though those open patents on measuring body composition based on bioelectrical impedance analysis (BIA) adopt different circuits, arithmetic, apparatus structures and different output methods, they have three common characteristic in nature. The first is to obtain bioelectric impedance by measuring voltage or voltage difference then transforming to digital value through A/D, the second is to use at least more than three electrodes (groups), among which two electrodes is certain to apply high frequency small current to human body in order to stimulate bio electricity and the other two electrodes collect stimulated voltage signal indicating bioelectrical impedance, if unite two of four electrodes to be used as reference electrodes, then there are 3 electrodes, the third is that the different frequency signals applied to human body must be signals with determined frequencies. As disclosed in U.S. Pat. No. 6,151,523, bioelectrical impedance can be measured by placing electrodes at a person's toes and heels, and by inputting the weight and height of the subject, percent body fat can also be estimated. The shortcomings of the above methods are: first, the methods have limitation if body fat and water content are determined based on bioelectrical impedance alone, second, because of the great diversity of human bodies, if only one or multiple determined frequencies are applied to human body, the results can not indicate body status accurately, and third, there are large errors in such low-cost apparatus when using voltage measurement to determine body impedance.

Apparatus and method for monitoring body composition by measuring body dielectric constant and body impedance based on the method of frequency digital sampling

Research Institute of Tsinghua University


Nitrogen-free thickeners in aqueous surfactant solutions comprising polyethoxylates of mono- and/or polyunsaturated C.sub.12 -C.sub.22 fatty alcohols having an average degree of ethoxylation of 2 to 5, which also contain 1 to 2 terminal propylene oxide groups attached by condensation instead of the corresponding number of ethylene oxide groups. The products may also be used in admixture with dissolved inorganic electroltye salts and with polyethoxylates of saturated fatty alcohols. These surfactant solutions are useful in the formulation of personal hygiene preparations such as hair shampoos, foam baths, shower baths, handwashing pastes and the like.

1. Field of the Invention
This invention relates to thickened aqueous surfactant solutions as well as the use of such solutions in cosmetic preparations of the type used in the field of personal hygiene such as hair shampoos, foam baths, shower baths, handwashing pastes and the like.
2. Statement of the Related Art
Surfactant solution mixtures generally are formulated to contain anionic surfactants, such as alkyl ether sulfates, as the principal surfactant component. Thickeners are normally added to such solutions to stabilize the clear or disperse systems and to improve the handling properties. Many compounds are known as agents for increasing the viscosity of formulations containing anionic surfactants. The most simple and inexpensive means for regulating the viscosity of solutions containing anionic surfactants is to add sodium chloride or other inorganic water-soluble electrolyte salts. In addition to or instead of these inorganic components, it is also known to add soluble organic compounds having a thickening effect. Thus, it is known that fatty acid alkanolamides, such as coconut oil fatty acid monoethanolamide, lauric acid monoethanolamide, oleic acid diethanolamide and coconut oil fatty acid diethanolamide, have a thickening effect on many surfactant systems and increase the foam stability of the systems in the presence of fats. In addition, it is known that polyethylene glycol difatty acid esters and many water soluble polymers also have a thickening effect on aqueous surfactant solutions.
However, many thickeners such as recited above are attended by numerous disadvantages. Solutions thickened with polyethylene glycol fatty acid diester often show inadequate viscosity stability during storage and water-soluble polymers are often difficult to dissolve and may give rise to unwanted, slimy flow behavior with a tendency towards "stringing", which is highly undesirable in cosmetic preparations. Derivatives of diethanolamine such as fatty acid alkanolamides are increasingly undesirable in cosmetic preparations because they often contain a small content of free alkanolamine as a byproduct or impurity, which can give rise to the formation of nitrosamines.

Thickended aqueous surfactant solutions and their use in cosmetic preparations


A method and apparatus to implement a virtual management controller to coordinate processing blade management in a blade server environment. A management mode of operation of a processing blade of a blade server is activated. During the management mode of operation, a chassis management module is interacted with to manage operation of the processing blade. Thereafter, the management mode of operation of the processing blade is deactivated.

Blade server architecture is an evolving technology that conveniently packages a server on a single board called a processing blade and houses a plurality of similar processing blades in a chassis. The processing blades can be easily installed or removed as desired and share common resources, such as input/output ("I/O" ports), a compact disc read only memory ("CD-ROM") drive, a floppy drive, a digital versatile disc ("DVD") drive, one or more network connections, etc. The ease with which the processing power can be scaled by adding or removing processing blades is a key feature driving the development and use of blade server technology. This scalable feature makes blade servers ideal candidates for performing tasks such as data and webpage hosting.
Processing blades typically are complete processing systems including one or more processors, firmware, system memory, one or more hard disks, one or more network interface cards ("NICs"), and the like. Known processing blades also generally include a baseboard management controller ("BMC") and an associated BMC firmware unit. A BMC is usually a coprocessor or service processor, separate from the one or more main processors. The BMC communicates with a chassis management module ("CMM"), typically mounted on the chassis of the blade server, to coordinate and to manage operation of the individual processing blade.
In general, a blade server will house a plurality of processing blades, each having its own BMC and BMC firmware unit, which all coordinate with the CMM. The inclusion of the BMC and the BMC firmware unit in each processing blade substantially increases build of material ("BOM") costs. In addition, the BMCs and the BMC firmware units consume valuable real estate on the surface of the processing blades. These two adverse consequences of the BMCs and the BMC firmware units directly conflict with two key goals associated with the development and implementation of blade server technology—providing a high density and economical processing solution.

Virtual management controller to coordinate processing blade management in a blade server environment


An infrared sensor operable without cooling and thus usable at room temperature comprises a substrate supporting thin films of pyroelectric material and switched capacitor control circuitry. The control circuitry compares the absolute capacitance of a reference thin film to that of a sensor thin film, thereby sensing infrared radiation without the use of a chopper device. The reference thin film is thermally coupled to the substrate, and the sensor thin film is thermally insulated form the substrate. To increase the fill factor, the sensor thin film is placed directly above the control circuitry. In another apsect, the sensor is adpated to sense visible and infrared light by adding a CCD sensor and appropriate control circuitry to the substrate.

This invention relates to optical sensors, and particularly to room temperature infrared sensors especially applicable to miniature robots ("gnat robots").
To operate properly, a robot most often requires sensing of its proximity. Therefore, known robot designs use sonar rangefinders, active near-infrared proximity sensors or laser light-striper imaging systems to endow them the capability of roaming freely through their environments, avoiding obstacles, and searching for specified landmarks or goals. These proximity sensors are active--they emit energy to the environment.
Known passive cameras are made from solid-state charge coupled devices. These devices are sensitive to visible light, and are commonly used by vision researchers to develop algorithms for image understanding. In robotics, visible light vision systems have had success, but have not achieved full image recognition owing to the incredible complexity of everyday visible-light scenes where objects have shadows, are obscured by other objects, and may blend into the background. Human eyesight is clearly our most complex sense, requiring close to half of our actual brain volume to function. Furthermore, our eyes require high bandwidth to the brain even after greatly preprocessing the visual information in the retina. Instilling human level perception into a robot is a very difficult task.
Infrared imaging, on the other hand, promises much better image recognition for certain objects while requiring only a fraction of the computing power of visible light vision. Edges in an infrared image will be primarily outlines of a single body, free from any extraneous edges due to texture or optical patterns. Most objects, and especially animate objects, tend to have a characteristic temperature which is invariant and distinct from the background temperature in nearly all conditions. Imaging systems that are sensitive to temperature can thus easily spot these objects and recognize them from their temperature.
Typical silicon infrared imagers, such as charge coupled device sensors designed for long wavelength electromagnetic energy, need to be cooled to the temperature of liquid nitrogen. This is because long wavelength photons have less energy than visible light, and the signals detected from these photons are below the CCD noise floor unless the sensor is cooled.
Pyroelectric substances have a polarized crystalline structure in which changes magnitude (inducing charge) when exposed to heat (i.e. infrared radiation). Pyroelectric sensors, therefore, can detect infrared radiation. Silicon sensors, by contrast, create charge carriers when hit by long wavelength photons. The main advantage of a pyroelectric sensor is that it does not need to be cooled.
Of the thirty-two different crystal classes, twenty-one have lattice formations with an inherent asymmetry. Twenty of those twenty-one crystals exhibit piezoelectric properties, which means that application of a voltage across the material causes a mechanical deformation and, conversely, stressing the material produces an electrical signal.
Of the twenty substances that have piezoelectric attributes, ten contain an electric dipole moment in the unstrained condition, which leads to pyroelectric characteristics. A pyroelectric material creates an electrical signal when the crystal is exposed to a change in temperature. Some of the ten pyroelectric materials also display ferroelectric traits. A ferroelectric material can have its polarization dipole reoriented in direction through the application of a strong electric field. After the electric field is removed, the crystal retains the polarization direction, effectively acting as a solid-state switch. Ferroelectrics, then, being a subset of pyroelectrics and piezoelectrics, contain all the attributes of all three. In addition, ferroelectric materials are characterized by having very high dielectric constants.
Because of their heat sensitivity, pyroelectric or ferroelectric materials may be used to sense infrared energy. Pyroelectric infrared imaging array cameras are commercially available, but are expensive. The cost of these cameras stems from a complex manufacturing technique The ceramic crystals for the pyroelectric arrays are assembled by hand, ground down manually to 20 .mu.m thickness, diced into small cells, and bump-mounted onto a hybrid substrate.
Typical pyroelectric camera readout circuitry senses the current (the change in charge) produced by the ceramic crystals. However, in a pyroelectric, a change in charge is produced by change in temperature, hence a pyroelectric camera needs relative motion of the infrared image to produce any signal. To solve this problem, a mechanical chopper is placed in front of the pyroelectric sensor to artificially produce temperature changes in static images.

Infrared sensor operable without cooling


A touch detection apparatus is provided, in which a touch panel is implemented with four surrounding edges. Three of the edges are embedded with retro-reflection materials. Light sources and pinholes are deployed on both corners of the touch panel, allowing reflections from the three edges to be projected on light sensors through the pinhole. The images projected on the light sensors are analyzed to determine coordinates of one or more contact points on the touch panel.

1. Field of the Invention
The disclosed embodiments relate to a touch screen, and more particularly to an apparatus and methods for sensing touch points by collecting reflection lights via a pinhole structure.
2. Description of the Related Art
Touch interfaces are broadly used in various electronic devices, such as handheld mobile apparatus or display panels. In current technologies, locations of points of contact are detected by using a resistive or capacitive sensor array, which may be stacked on an operation interface for detecting the contact points. However, as far as large display panels as concerned, the fabrication of sensor arrays has a high cost. In addition, some traditional touch interfaces adapt image sensing methods using photography equipment to determine whether the surface of a touch interface is touched. However, photography equipment requires light sensor components and lens costs. Moreover, in a multi-point touch situation, several sets of light sensor components and lenses must be installed and operated simultaneously to distinguishing the location of each contact point. Therefore, manufacturing cost for traditional touch detection is prohibitively expensive.

Touch detection apparatus and touch point detection method


A multi-edge snowboard includes multiple boards with attached bindings. A pivot mechanism that connects the bindings to the boards rotates each board, so that each board can provide an active edge that engages the snow during turning or stopping. The increase in the number of active edges relative to a conventional snowboard improves the performance of the multi-edge snowboard, while the binding structure retains the feel of a conventional snowboard.

Snowboarding has several advantages and disadvantages relative to skiing. For example, snowboarding has the advantages of being easier to learn, being easier on leg joints, providing better control in powder conditions, and having a general motion similar to surfing. However, snowboarders seem to be involved in a disproportionate share of collisions. There are several reasons that could explain the higher collision rate for snowboards, but one reason that is particularly instructive on the technical shortcomings of conventional snowboards is that snowboarders have less chance of avoiding collisions since the snowboards generally require wider turns and longer stopping distances when compared to skis. The reduced ability to avoid accidents when compared to skis may result because snowboards have only one short edge cutting into the snow compared to the two long edges that skis provide. Accordingly, a snowboard that provides improved turning and stopping abilities could improve safety. Further, the improved maneuverability can greatly enhance the sport of snowboarding by making snowboards more dynamic and responsive.


A discharge lamp system includes an AC power source, a rectifier, a power factor correction (PFC) circuit, a half-bridge circuit, and a controller. The AC power source provides an AC power. The rectifier converts the AC power into a DC power. The PFC circuit is electrically coupled to the rectifier and is configured for generating an output voltage. The half-bridge circuit is electrically coupled to the PFC circuit and a discharge lamp, and is configured for converting the output voltage into a voltage required by the discharge lamp. The controller is electrically coupled to the PFC circuit and the half-bridge circuit, and includes a timer for counting time, in which the controller controls the output voltage of the PFC circuit in accordance with a time period counted by the timer.

1. Technical Field
The present disclosure relates generally to a discharge lamp system, and more particularly to a discharge lamp system controlled by an output voltage of a power factor correction circuit and a controlling method thereof.
2. Description of Related Art
Conventionally, high intensity discharge (HID) lamps have relatively high efficiency, good color rendering, and a long service life, such that HID lamps are widely used in many applications.
Usually, in an HID lamp, a relatively low voltage of 220 V has to be increased to a relatively high voltage rapidly by a ballast, in order to excite a material in a quartz tube for radiating in arc. The high intensity white arc generated by the HID lamp resembles the sunlight during the day. The HID lamp does not have a filament, and therefore, a situation in which a filament is broken to thereby render a lamp inoperable will not occur. In addition, compared to a typical halogen lamp, the HID lamp not only has a longer service life but also has improved penetration, improved illumination and lower power consumption for saving electrical energy. Therefore, the HID lamp has been widely researched and developed with the aim of replacing conventional light sources.
However, when the HID lamp is ignited, the relatively low voltage of 220 V has to be increased rapidly to the relatively high voltage required by the HID lamp. Therefore, the HID lamp cannot be operated alone. That is, a specific power supply circuit is necessary to enable the HID lamp to be ignited and radiate light stably. The conventional power supply circuit for the HID lamp includes a power factor correction (PFC) circuit and an inverter connected to the PFC circuit, where the inverter can be a full-bridge inverter or a half-bridge inverter. The half-bridge inverter has the advantage of relatively low cost, and is therefore frequently selected for use in the HID lamp. However, the HID lamp has a special characteristic. Namely a maximum voltage (i.e., open circuit voltage, OCV) provided to the HID lamp by the half-bridge circuit is only half of the output voltage of the PFC circuit. For example, if the output voltage of the PFC circuit is 400 V, the OCV of the half-bridge circuit is thus 200 V, while the OCV required to ignite the HID lamp is usually in the range of about 250 V to 350 V. Thus, if the typical output voltage of 400 V for the PFC circuit is used in combination with the half-bridge inverter structure, problems will be encountered with respect to the ignition of the HID lamp.

Discharge lamp system and controlling method of the same


There are provided a TFT substrate for an LCD apparatus and a method of manufacturing the same. A substrate (10), a diffusion barrier layer (11) and a copper alloy layer (12) are formed on the TFT substrate, consecutively. The copper alloy includes a material from about 0.5 at % to about 15 at % to form a gate wiring layer. The material is used to form the diffusion barrier layer (11). A compound that comprises a material such as Zr, Ti, Hf, V, Ta, Ni, Cr, Nb, Co, Mn, Mo, W, Rh, Pd, Pt, etc. is deposited on the diffusion barrier layer (11) to a thickness from about 50 Å to about 5,000 Å. The deposited compound is then heat treated to convert the deposited compound into a silicide compound (11b). The transistor substrate has low resistance and high conductance. Also, etching process is simplified, and a mutual diffusion is prevented by means of the thin diffusion barrier layer.

A display apparatus is an electric optical apparatus converting an electric signal into an optical image so that a user recognizes information. A liquid crystal display (hereinafter, referred to as LCD) apparatus of the display apparatus supplies electrical field to transform an arrangement of liquid crystal molecules by means of an optical characteristics of the liquid crystal.
A TFT of a large display substrate needs a low gate resistance to prevent signal delay and flickering of an image. Metals such as copper or aluminum have low resistance and high conductivity. However, the metals are improper for manufacturing an LCD apparatus. The copper has the lowest resistivity among the metals, but the copper has low adhesiveness to a silicon-containing substrate. The copper is also oxidized easily. The copper may be prevented from diffusing into the silicon containing substrate, and sufficient adhesiveness may be necessary so as to use the copper wiring in the TFT process.
The diffusion of the copper into the silicon-containing substrate deteriorates ohmic contact characteristics of elements, and the low adhesiveness causes lift-off of a thin film and abrasion of the thin film. The lift-off and the abrasion cause problems in manufacturing process.

TFT substrate for liquid crystal display apparatus and method of manufacturing the same


A dielectric isolation substrate comprises a first semiconductor wafer, a second semiconductor wafer bonded on the first semiconductor wafer with a first insulating layer interposed therebetween, a semiconductor layer formed on the second semiconductor wafer, a first groove formed in the semiconductor layer and the second semiconductor wafer so as to reach the first insulating layer, thereby isolating the semiconductor layer and the second semiconductor wafer, and a second insulating layer formed on the side face of the first groove or embedded in the first groove. In this dielectric isolation substrate, a high breakdown voltage element and a low breakdown voltage element are formed in a region isolated by the first groove.

1. Field of the Invention
The present invention relates generally to a dielectric isolation technique, and more particularly to a dielectrically isolated semiconductor substrate wherein two semiconductor wafers are bonded to each other with an insulating layer interposed therebetween, and to a method of manufacturing the same.
2. Description of the Related Art
There is conventionally known a direct bonding technique for bonding two semiconductor wafers thereby to attain dielectric isolation of a semiconductor device. According to this technique, as shown in FIG. 1, an insulating layer 103 is formed on the surface of a first wafer 101 and/or the surface of a second wafer 102. The insulating layer 103 is interposed and bonded between the first and second wafers 101 and 102. After reducing the thickness of the second silicon wafer 102, a v-shaped groove 105 is formed in the second silicon wafer 102, and oxide layers 106 are formed on the side faces of the groove 105. Thus, a portion 102' of the second silicon wafer 2 is dielectrically isolated, in an island shape, from the other part of the wafer 102.
In the structure shown in FIG. 1, when a CMOS device is used as a logic circuit, many CMOS logic circuits can be formed in a single island region. However, when a bipolar device is used as a logic circuit, it becomes necessary to isolate each logic circuit by means of the v-shaped groove. Consequently, the number of v-shaped grooves increases, and a large area is occupied by the grooves. Thus, the area for forming the devices is reduced. The structure shown in FIG. 1 is therefore unsuitable.
Also, when both a low breakdown voltage device (e.g. a bipolar device) and a high breakdown voltage device (e.g. a DMOS device) are formed in the dielectrically isolated semiconductor substrate shown in FIG. 1, the following problem occurs. Namely, in forming the DMOS device, the thickness of the substrate needs to be increased to a relatively high value in order to obtain a high breakdown voltage. On the other hand, in forming the bipolar device, it is necessary to decrease the thickness of the substrate in order to achieve a high speed operation. It is therefore difficult to attain the thickness of the substrate which is desirable both for the bipolar device and the DMOS device.

Dielectrically isolated high and low voltage substrate regions


A semiconductor substrate of a first conduction type is provided for serving as a common drain to a plurality of power MISFET cells. A middle semiconductor layer is formed on the semiconductor substrate and has a lower impurity concentration than that of the semiconductor substrate. Pillar regions are formed on the middle semiconductor layer and include semiconductor regions of the first conduction type having a lower impurity concentration than that of the middle semiconductor layer.

1. Field of the Invention
The present invention relates to a semiconductor device including a plurality of vertical power MISFET cells and method of manufacturing the same.
2. Description of the Related Art
Development of a semiconductor device has been proceeded to achieve both a higher breakdown voltage and a lower on-resistance in a power MOSFET at the same time.
For example, a semiconductor device called Super Junction structure has been proposed by Deboy, G., et al. in "A New Generation of High Voltage MOSFETs Breaks the Limit of Silicon", IEDM Tech. Dig. (1998), P683-686. The device with such the structure causes a problem, however, because a large number of process steps are required for production and fine patterning of the size is difficult in the lateral direction or along the channel length.
In consideration of such the situation, the Applicant has proposed a semiconductor device including a power MOSFET and method of manufacturing the same, for example, in JP-A 2002-170955 (FIG. 7). The semiconductor device has a triple-layered pillar (such as NPN layers) formed to substantially serve the same role as the Super Junction structure to achieve both a lower on-resistance and a higher breakdown voltage at the same time. This semiconductor device can be produced, without invitation of a great increase in the number of process steps, in a smaller lateral size with a greatly lowered price.
The semiconductor device with the triple-layered pillar structure, however, causes a serge voltage when the power MOSFET transits the state from conductive to non-conductive. As a result, an avalanche current flows through drain-source. The maximum acceptable intensity of the avalanche current (avalanche withstand capability) is a very important subject matter in the power MOSFET. When the power MOSFET is kept non-conductive, a depletion layer is formed into a strip at a p-n junction between an n-type pillar layer and a p-type pillar layer, and a high electric field is placed across the depletion layer. If a serge voltage arises in such the condition, it causes local current crowding at the depletion layer. When the extent of the current crowding exceeds an acceptable value (avalanche withstand capability), it leads to device destruction at a high possibility.

Semiconductor device and method of manufacturing the same


The invention relates to a node, an optical/electrical path integrated network using this node, and a program which controls the node. The node according to the invention is suited to use in an optical/electrical path integrated network constructed from a plurality of electrical sub-networks comprising nodes which are interconnected by electrical paths in which routing is performed based on packet header information and a photonic core network comprising nodes which are interconnected by optical paths, the photonic core network and the plurality of electrical sub-networks being interconnected by optical paths, wherein the node comprises a device which outputs to other nodes, a traffic quantity between the node to which it belongs and other nodes.

1. Field of the Invention
The present invention relates to optical/electrical path integrated networks, and relates specifically to a technique for notifying about information relating to traffic quantity between sub-networks, and a technique for dynamically establishing and releasing optical paths according to the traffic quantity between sub-networks.
This application is based on patent application No. 2002-045092 and No. 2002-054247 filed in Japan, the contents of which are incorporated herein by reference.
2. Description of the Related Art
Research and development is proceeding in the field of optical/electrical path integrated networks, as a technology for building high capacity networks. In an optical/electrical path integrated network, the transmission/reception endpoints are connected by optical paths. An electrical sub-network comprising a node which performs routing based on packet header information is connected to each of the transmission/reception endpoints. A first conventional example of an optical/electrical path integrated network is shown in FIG. 6.
The optical/electrical path integrated network comprises a photonic core network C and electrical sub-networks S1 to S4. The electrical sub-networks S1 to S4 must be connected by optical paths for communication to occur.
The photonic core network C comprises photonic border nodes and a photonic core node. The electrical sub-networks S1 to S4 comprise electrical border nodes and electrical core nodes. The electrical core nodes and the photonic core node are contiguous at the boundary of the electrical sub-networks S1 to S4 and the photonic core network C, and are interconnected by optical fiber links.
Optical paths are established over the photonic core network C, so as to interconnect the electrical border nodes provided in the different electrical sub-networks S1 to S4. Information is transferred transparently between the electrical border nodes over the optical paths.
When four optical paths are established as in FIG. 6, the view of the electrical sub-networks S1 to S4 is as shown in FIG. 7. FIG. 7 shows a view of a network topology comprising nodes which are capable of performing packet processing, in which the topology of the photonic core network C is hidden. FIG. 8 is a combined view of the electrical sub-networks S1 to S4 and the photonic core network C.
The electrical sub-networks must be interconnected. However, it is not necessary for all of the electrical sub-networks to be directly connected to each other by optical paths, and multiple hop routing may be used.
FIG. 9 shows an example of the connection of the four electrical sub-networks S1 to S4 in FIG. 6. The electrical sub-network S1 is connected to the electrical sub-networks S2 and S3 by a direct optical path, the electrical sub-network S2 is connected to the electrical sub-networks S1 and S4, the electrical sub-network S3 is connected to the electrical sub-networks S1 and S4, and the electrical sub-network S4 is connected to the electrical sub-networks S2 and S3, each by direct optical paths.
To transmit a packet from the electrical sub-network S1 to the electrical sub-network S4, the packet can travel from the electrical sub-network S1 to the electrical sub-network S4 via the electrical sub-network S2, or from the electrical sub-network S1 to the electrical sub-network S4 via the electrical sub-network S3, by multi-hop routing. In the same manner as FIG. 9, FIG. 10 shows an example of the connection of the four electrical sub-networks S1 to S4 in FIG. 6. Diagonal optical paths are established between the electrical sub-networks S1 and S4, and between the electrical sub-networks S2 and S3.
In both FIG. 9 and FIG. 10, the electrical border router of each electrical sub-network S1 to S4 has two electrical packet transmission/reception ports connected to the photonic core network C. How the two electrical packet transmission/reception ports provided in each of the electrical border routers should be directly connected by optical paths is determined by the traffic quantity between the electrical sub-networks S1 to S4. FIG. 9 is favorable when the traffic quantity over the diagonal paths is small, and conversely FIG. 10 is favorable when such traffic is high.
If the optical paths are established without taking the traffic quantity into consideration, then for example electrical sub-networks which exchange a high quantity of traffic may not be directly connected by an optical path, making it necessary to transfer packets by multi-hop routing, which causes a problem of congestion of the optical paths.
Furthermore, an optical/electrical path integrated network is shown in FIG. 23 as a second conventional example. This optical/electrical path integrated network is constructed from the photonic core network C and the electrical sub-networks S1 to S4. The optical/electrical path integrated network in FIG. 23 is a multi-layer network, in which optical paths are established over the photonic core network C. In this manner, the group of electrical sub-networks S1 to S4, connected by optical paths, constitutes the entire electrical network.
The photonic core network C comprises photonic border nodes 1A to 6A and a photonic core node 7A. The electrical sub-networks S1 to S4 comprise electrical border nodes 11A, 12A, 21A, 22A, 30A, 32A and 40A, and electrical core nodes 10A, 20A, 31A, 41A and 42A. The electrical border nodes 11A, 12A, 21A, 22A, 30A, 32A, 40A and the photonic border nodes 1A to 6A are contiguous at the boundary between the electrical sub-networks S1 to S4 and the photonic core network C, and are interconnected by optical fiber links. The optical paths are established over the photonic core network C, to interconnect the electrical border nodes 11A, 12A, 21A, 22A, 30A, 32A, 40A in the different electrical sub-networks S1 to S4. Information is transmitted between the electrical border nodes 11A, 12A, 21A, 22A, 30A, 32A and 40A transparently over the optical paths.
The topology of the electrical network can be virtually changed, depending on which of the electrical sub-networks S1 to S4 are connected. FIG. 24 shows how two different electrical network topologies can be realized when a single optical path network topology is applied. Furthermore, FIG. 24 describes the hierarchy of the optical paths and the electrical paths. In FIG. 24, O-LSP (Optical-Label Switched Path) indicates an optical path, and E-LSP (Electric-Label Switched Path) indicates an electrical path.
The E-LSP is routed over the electrical network, comprising the electrical sub-networks S1 to S4 which are interconnected by O-LSPS. In the connection mode #1 on the right side of FIG. 24, the E-LSP is connected by multi-hop routing. In other words, two electrical sub-networks are connected via two O-LSPs. On the other hand, in the connection mode #2 on the left side of FIG. 24, the E-LSP is connected by a single hop. In other words, two electrical sub-networks are connected via a single O-LSP.
In the terminology of graph theory, the entire electrical network must be "connected". In other words, the electrical sub-networks S1 to S4 must be interconnected by O-LSPs. However, it is not necessary for every one of the electrical sub-networks S1 to S4 to be connected to every other by an O-LSP, and multi-hop routing may also be used. FIG. 25 shows a connected electrical network and an unconnected electrical network. In the connected electrical network, all four of the electrical sub-networks S1 to S4 can communicate via O-LSPs, but in the unconnected electrical network only three of the electrical sub-networks are connected by O-LSPs, and one of the electrical sub-networks cannot communicate with the other three electrical sub-networks via an O-LSP.
FIG. 16 shows an example in which the four electrical sub-networks S1 to S4 in FIG. 25 are connected. The electrical sub-network S1 is connected to the electrical sub-networks S2 and S3 by direct optical paths, the electrical sub-network S2 is connected to the electrical sub-networks S1 and S4, the electrical sub-network S3 is connected to the electrical sub-networks S1 and S4, and the electrical sub-network S4 is connected to the electrical sub-networks S2 and S3, each by direct optical paths. In order to transmit a packet from the electrical sub-network S1 to the electrical sub-network S4, the packet can be transferred from the electrical sub-network S1 to the electrical sub-network S4 via the electrical sub-network S2, or from the electrical sub-network S1 to the electrical sub-network S4 via the electrical sub-network S3, by multi-hop routing.
In the same manner as FIG. 16, FIG. 17 shows an example in which the four electrical sub-networks S1 to S4 in FIG. 25 are connected. Diagonal optical paths are established between the electrical sub-networks S1 and S4, and between the electrical sub-networks S2 and S3.
In FIG. 16 and FIG. 17, the electrical border nodes 11A, 12A, 21A, 22A, 30A, 32A and 40A in the electrical sub-networks S1 to S4 have two electrical packet transmission/reception ports connected to the photonic core network C. How the two electrical packet transmission/reception ports provided in the respective electrical border nodes 11A, 12A, 21A, 22A, 30A, 32A and 40A should be directly connected by optical paths is determined by the traffic quantity between the electrical sub-networks S1 to S4. FIG. 16 is favorable when the traffic quantity over the diagonal paths is small, and conversely FIG. 17 is favorable when such traffic is high.
In the same manner as the first conventional example, if in this second conventional example the optical paths are established without taking the traffic quantity into consideration, then for example electrical sub-networks which exchange a high quantity of traffic may not be directly connected by an optical path, making it necessary to transfer packets by multi-hop routing, which causes a problem of congestion of the optical paths.
Traffic quantity varies temporally, and as such even once the optical paths are established, it can be necessary to dynamically reconfigure the optical paths according to the conditions. Requiring a network administrator to manually reconfigure the optical paths in this manner according to variations in traffic increases the amount of work required for maintenance, which is undesirable.

Node, an optical/electrical path integrated network using the node, and a program which controls the node

Nippon Telegraph and Telephone Corporation


The invention provides a surface acoustic wave device and a manufacturing method thereof which enhances reliability and yield. A surface acoustic wave device having a surface acoustic wave element and an electronic component that drive controls the surface acoustic wave element is provided with a first substrate, which has a first connecting terminal having a first hollow component formed therewith including an opening that accommodates an electronic component and electrically connecting to the electronic component formed in the first hollow component, and a second connecting terminal formed in the vicinity of the opening and electrically connecting to the first connecting terminal, a second substrate where one face side is joined to the opening of the first substrate and the surface acoustic wave element is electrically connected to the second connecting terminal on the other face side, and a cap which is joined to the first substrate and has a second hollow component that hermetically seals the surface acoustic wave element.

1. Field of Invention
The present invention relates to a surface acoustic wave device in which a surface acoustic wave element and an electronic component that drive controls the surface acoustic wave element are packaged.
2. Description of Related Art
Recently, surface acoustic wave devices (hereinafter referred to as xe2x80x9cSAW (surface acoustic wave) devicesxe2x80x9d) have been used as resonators or bandpass filters, etc. in electronic components and communication components of mobile telephones and TV receivers, etc.
FIG. 8 is a schematic showing an example of a related art SAW device 1. The SAW device 1 is described with reference to FIG. 8.
The SAW device 1 of FIG. 8 has a substrate 2, a cover 3, an electronic component 5 formed of IC chips, etc. and a SAW element 6, and other elements. A hollow component 2a is formed in the substrate 2. The electronic component 5 and the SAW element 6 are mounted in the hollow component 2a, e.g., with an epoxy adhesive. The cover 3 is arranged on the opening of the hollow component 2a and is joined to the substrate 2 with a sealant or by seam welding. Therefore, the electronic component 5 and the SAW element 6 are in a hermetically sealed state via the substrate 2 and the cover 3.
The SAW element 6 and the electronic component 5, such as semiconductor chips that drive control the SAW element, are arranged side by side in the hollow component 2a. Printed wirings 4 of a predetermined pattern are formed at the bottom of the substrate 2, and the electronic component 5 and the SAW element 6 are electrically connected to the printed wirings 4, e.g., by wire bonding, etc. respectively, thereby electrically connecting the electronic component 5 and the SAW element 6.
FIGS. 9(A)-9(E) are perspective views showing steps of an exemplary related art manufacturing method of a SAW device. The manufacturing method of the SAW device is described with reference to FIG. 9.
First, as shown in FIG. 9(A), printed wirings 4 are formed in a predetermined pattern at the bottom of a hollow component 2a in a substrate 2.
Then, as shown in FIG. 9(B), an electronic component 5 is mounted at the bottom and electrically connected to the printed wirings 4, e.g., by wire bonding, etc.
Subsequently, as shown in FIG. 9(C), a SAW element 6 is mounted at the bottom and electrically connected to the printed wirings 4, e.g., by wire bonding, etc.
Next, as shown in FIG. 9(D), the frequency adjustment of the SAW element 6 is performed. More specifically, a plasma, for example, and the like are irradiated from the opening 2b of the substrate 2 onto the SAW element 6, and a piezoelectric substrate or electrodes formed on a piezoelectric substrate of the SAW element 6 are etched. This frequency adjustment is performed while the SAW element 6 is driven by the electronic component 5. Then, the operation is performed until a desirable frequency characteristic of the SAW element 6 is obtained.
Subsequently, as shown in FIG. 9(E), a cover 3 is arranged on the opening of the substrate 2, and the substrate 2 and the cover 3 are joined with a sealant, thereby hermetically sealing the inside of the hollow component 2a to complete a SAW device 1.
In the related art SAW device 1 of FIG. 8, the electronic component 5 and the SAW element 6 are arranged side by side. Namely, the electronic component 5 and the SAW element 6 are arranged in the same space, i.e., within the hollow component 2a.
In this instance, if the SAW device 1 is actuated, the electronic component 5 emits heat. The heat emitted from the electronic component 5 is directly transmitted to the SAW element 6 via the atmosphere and the bottom in the hollow component 2a of the substrate 2. The heat greatly affects the temperature characteristics of the SAW element 6 and causes a problem, i.e., that the SAW element 6 cannot display a desirable frequency characteristic.
On the other hand, a so-called two-stage superposed package structure has been proposed as a method for mounting an electronic component 5 and a SAW element 6 in different spaces. When frequency adjustment is performed in a state in which the SAW element 6 is driven by the electronic component 5, however, the process of mounting the electronic component 5 and the SAW element 6 on the packages, respectively, and the process for adhesion and conduction of respective packages must be performed, thereby complicating the manufacturing process.
Accordingly, the present invention addresses the problem referred to above, and provides a SAW device and a manufacturing method thereof which enhances reliability and yield.
The invention in accordance with a first aspect of the invention provides a surface acoustic wave device having a surface acoustic wave element and an electronic component that drive controls the surface acoustic wave element, provided with a first substrate, which has a first connecting terminal having a first hollow component formed therewith, including an opening that accommodates the electronic component and electrically connected to the electronic component formed in the first hollow component, and a second connecting terminal formed in the vicinity of the opening and electrically connected to the first connecting terminal, and a second substrate, which is mounted so that one face side is joined to the opening of the first substrate, and the other face side allows the surface acoustic wave element to be electrically connected to the second connecting terminal, and a cap which is joined to the first substrate and has a second hollow component that hermetically seals the surface acoustic wave element.
In accordance with the structure of the first aspect of the invention, the first hollow component is formed in the first substrate, and the electronic component is mounted in this hollow component. On the other hand, the second substrate has a structure such that one face side is joined to the first substrate, and the surface acoustic wave element is mounted to the other face side. Then, the cap, that seals the surface acoustic wave device in the second hollow component is joined to the first substrate.
Thus, only the electronic component is mounted in the hollow component of the first substrate, and the surface acoustic wave element is mounted on the other face side of the second substrate. Namely, the surface acoustic wave element and the electronic component are arranged in separate spaces partitioned by the first substrate and the second substrate. Therefore, for example, when a plasma is irradiated on the surface acoustic wave element, the electronic component is not exposed to the plasma during the frequency adjustment of the surface acoustic wave device. Moreover, the influence of the heat and electromagnetic wave generated when the electronic component is actuated on the surface acoustic wave element can be suppressed to the minimum.
The invention in accordance with a second aspect of the invention provides a surface acoustic wave device in which the first substrate and the second substrate are joined with a sealant on the lateral face side of the second substrate in the structure of the first aspect of the invention.
In accordance with the structure of the second aspect of the invention, the first substrate and the second substrate are in a state in which they are joined with a sealant applied on the lateral face side of the second substrate, thereby surely hermetically sealing the first hollow component of the first substrate.
The invention in accordance with a third aspect of the invention provides a surface acoustic wave device in which the second substrate and the cap are joined to the first substrate with same sealant, respectively in the structure of either of the first or second aspects.
In accordance with the structure of the third aspect of the invention, with the joint of the first substrate and the second substrate and the joint of the first substrate and the cap, hermetic sealing of the first hollow component and the second hollow component can be simultaneously performed under the same treatment conditions by using the same sealant.
The invention in accordance with a fourth aspect of the invention provides a surface acoustic wave device in which the sealant is made of a conductive brazing metal or a conductive adhesive in the structure of any of the first to third aspects.
In accordance with the structure of the fourth aspect, a shielding effect on electromagnetic wave can be obtained if a conductive brazing metal or a conductive adhesive is used as the sealant.
The invention in accordance with a fifth aspect of the invention provides a surface acoustic wave device in which the sealant is made of a glassy material in the structure of any of the first to third aspects.
In accordance with the structure of the fifth aspect, a cost reduction can be sought by using a glassy material as the sealant.
The invention in accordance with a sixth aspect of the invention provides a surface acoustic wave device in which the grounding electrode is formed on one face side of the second substrate in any of the structures of the first to fifth aspects.
In accordance with the structure of the sixth aspect, the grounding electrode is formed on one face side of the second substrate and is in a state that it is placed between the electronic component and the surface acoustic wave element. Therefore, an electromagnetic wave generated when the electronic component is actuated is shielded by the grounding electrode, thereby reducing its influence on the surface acoustic wave element. Particularly, if a conductive brazing metal or a conductive adhesive is used as the sealant, the shielding effect of the grounding electrode can be further enhanced.
The invention in accordance with a seventh aspect of the invention provides a surface acoustic wave device in which the second substrate includes a ceramic single plate in any of the structures of the first to sixth aspects.
In accordance with the structure of the seventh aspect, back lowering of the entire surface acoustic wave device can be sought by using the ceramic single plate as the second substrate. The thermal expansion coefficients can be made consistent by forming the first substrate and the second substrate from the same material.
The invention in accordance with an eighth aspect of the invention provides a surface acoustic wave device in which the electronic component are flip-chip mounted to the first substrate in any of the structures of the first to seventh aspects.
In accordance with the structure of the eighth aspect, back lowering of the entire surface acoustic wave device can be sought by flip-chip mounting the electronic component to the first substrate.
The invention in accordance with a ninth aspect of the invention provides a surface acoustic wave device in which the surface acoustic wave element is mounted to the second substrate with an adhesive and the electronic component is mounted to the first substrate with the same adhesive as that used in mounting the surface acoustic wave element in any of the structures of the first to eighth aspects.
In accordance with the structure of the ninth aspect, simplification of the manufacturing processes of the surface acoustic wave device can be sought by using the same adhesive.
The invention in accordance with a tenth aspect of the invention provides a manufacturing method of the surface acoustic wave device having a surface acoustic wave element and an electronic component that drive controls the surface acoustic wave element, in which the electronic component is mounted in the first hollow component of the first substrate with an opening, the second substrate with the surface acoustic wave element mounted is aligned in the opening of the first substrate as well as the electronic component and the surface acoustic wave element are electrically connected, the frequency adjustment of the surface acoustic wave element is performed, the cap with the second hollow component is arranged on the first substrate so as to accommodate the surface acoustic wave element in the second hollow component, and the first substrate and the second substrate, and the first substrate and the cap are joined with a sealant, respectively, to seal the electronic component and the surface acoustic wave element.
In accordance with the structure of the tenth aspect, the electronic component is mounted to the first hollow component of the first substrate from the opening, and the second substrate with the surface acoustic wave element mounted in this opening is aligned. Then, the frequency adjustment is performed by irradiating, e.g., a plasma, etc. on the surface acoustic wave element in a state wherein the surface acoustic wave element is drive controlled by the electronic component. Subsequently, the cap is arranged on the surface acoustic wave device, and the first substrate and the second substrate, and the first substrate and the cap are joined with a sealant, respectively.
Thus, when frequency adjustment is performed, the electronic component is in a state such that it is accommodated in the first hollow component and the first hollow component is closed by the second substrate. Therefore, the plasma, etc. are irradiated only on the surface acoustic wave element, but not on the electronic component in the frequency adjustment step. Moreover, inconvenience caused by irradiating the plasma to the electronic component in the frequency adjustment step can be reduced, minimized or prevented.
The invention in accordance with an eleventh aspect of the invention provides a manufacturing method of the surface acoustic wave device in which the second substrate is arranged in the opening of the first substrate in a state such that the sealant is applied on the lateral face side of the second substrate in the structure of the tenth aspect.
In accordance with the structure of the eleventh aspect, the first substrate and the second substrate are joined with a sealant applied on the lateral face side of the second substrate. This enables surely isolating the first hollow component and the second hollow component of the first substrate.
The invention in accordance with a twelfth aspect of the invention provides a manufacturing method of the surface acoustic wave device in which the grounding electrode made of a conducting material is formed on the joint face with the first substrate at the second substrate in the structure of either of the tenth or eleventh aspects.
In accordance with the structure of the twelfth aspect, a grounding electrode is formed on one face side of the second substrate, and is in a state such that it is placed between the electronic component and the surface acoustic wave element. Therefore, an electromagnetic wave, generated when the electronic component is actuated, is shielded by the grounding electrode, thereby reducing its influence on the surface acoustic wave element.
The invention in accordance with a thirteenth aspect of the invention provides a manufacturing method of the surface acoustic wave device in which the same sealant is used as the sealant that joins the first substrate and the second substrate and the sealant that joins the first substrate and the cap in any of the structures of the tenth to twelfth aspects.
In accordance with the thirteenth aspect of the invention, when the first substrate and the second substrate are joined and the first substrate and the cap are joined, hermetic sealing of the first hollow component and the second hollow component can be simultaneously performed under the same treatment conditions by using the same sealant.
The invention in accordance with a fourteenth aspect of the invention provides a manufacturing method of the surface acoustic wave device in which the brazing metal or the conductive adhesive is used as the sealant in any of the structures of the tenth to thirteenth aspects.
In accordance with the structure of the fourteenth aspect, if the brazing metal or the conductive adhesive is used as the sealant, the shielding effect on the electromagnetic wave can be obtained.
The invention in accordance with a fifteenth aspect of the invention provides a manufacturing method of the surface acoustic wave device in which the sealant is made of a glassy material in any of the structures of the tenth to thirteenth aspects.
In accordance with the structure of the fifteenth aspect, if the glassy material is used as the sealant, a cost reduction can be obtained.
The invention in accordance with a sixteenth aspect of the invention provides a manufacturing method of the surface acoustic wave device in which, when the electronic component is mounted to the first substrate, the mounting is performed by flip-chip bonding in any of the structures of the tenth to fifteenth aspects.
In accordance with the structure of the sixteenth aspect, back lowering of the entire surface acoustic wave device can be sought by flip-chip mounting the electronic component to the first substrate.

Surface acoustic wave device and manufacturing method thereof


An optical lens including a first lens group and a second lens group is provided. The first lens group is arranged between a magnified side and a minified side. The first lens group includes three lenses. A surface of a second lens facing to the minified side is a convex aspherical surface. The second lens group includes three lenses. Each of the first lens group and the second lens group includes at least one aspherical lens.

Field of the Invention
The invention relates to an optical device, and particularly relates to an optical lens.
Description of Related Art
Along with development of modern video technology, image devices such as digital video cameras (DVC) and digital cameras (DC) are widely used, and are widely applied in various domains. A core element of these image devices is a lens, which is used for clearly imaging an image on a screen or a charge coupled device (CCD). Moreover, smart home surveillance cameras are quickly developed in recent years, and people have increasingly high demands on thinning appearance and optical performance thereof. In order to satisfy the above demands, the lens is required to have characteristics of a wide field of view (FOV), miniaturization, a thinning appearance, a high resolution, a large aperture, a low distortion, day and night co-focal, etc.
Therefore, how to fabricate a lens having the aforementioned characteristics and capable of providing good optical quality is an important issue for those technicians of the field.


Methods and devices are disclosed to reduce the tissue trauma that occurs when a physician retracts or otherwise deforms a patient's tissues for surgery or other medical procedures. In one part, methods and devices are disclosed for cooling the tissue around the incision. In another part, methods and devices are disclosed that elute drugs into the tissues of the tissue margin. In another part, methods and devices are disclosed to engage tissues during retraction to cushion, to sense tissue state, and to modulate tissue state.

Deformation of tissues is commonly performed during surgery or other medical procedures either to achieve surgical access or to specifically alter the dimensions of one part of the anatomy. Examples of deformations of tissue for surgical access include spreading ribs during a thoracotomy, spreading a bisected sternum during sternotomy, and separating the vertebrae of the spine for surgery on the intervertebral disk. Examples of deformation of tissues to alter the dimensions of the tissue include distraction to adjust the position of vertebrae. Such deformations will collectively be referred to as "retraction" here.
Spreaders, retractors, distractors, and even trocars (collectively called "retractors") can impose significant forces on surrounding tissues during retraction. The resulting strain on these tissues, and on associated tissues, such as the ligaments attaching ribs to vertebrae for example, can be large, leading to damage of these tissues, including the fracture of ribs and the rupture or irreversible deformation of ligaments and other fibrous tissues.
Retraction occurs in two different phases—deforming the tissue in a first retraction phase and holding the tissue at that deformation in a second retraction phase. Both are usually done with the same instrument. For example, a rib spreader is used both to force the ribs apart during a thoracotomy (first phase of retraction) and to hold the ribs apart during the surgical procedure (second phase of retraction). In the medical literature, both phases are frequently referred to as retraction.
Both phases of retraction traumatize tissue. Trauma from the first phase of retraction can include the rending and tearing of tissues; bones bend and break; muscles stretch beyond normal limits; ligaments and other connective tissues stretch and tear; nerves are stretched. Trauma from the second phase of retraction can include trauma arising from the force of the retraction device holding the tissue open and can include ischemia of the tissue due to elevated tissue pressure, blockage of nerves, and blockage of blood vessels causing ischemia in tissues distant from retraction.
Tissue trauma and ensuing complications resulting from both phases of retraction can be greater than the trauma resulting from the medical procedure that required the retraction. For example, thoracotomies are extremely traumatic, and can result in post-surgical pain and respiratory complications that exceed that of the thoracic procedure, such as a lung segmentectomy.
There is, therefore, need for improved devices, systems, and methods to perform one or both phases of retraction.

Methods and devices to decrease tissue trauma during surgery


A vertically aligned liquid crystal display (VA-LCD) according to one embodiment has liquid crystal cells in which liquid crystals with a negative dielectric anisotropy are filled and which is provided between a first polarizer and a second polarizer, whose absorption axes are perpendicular to each other. The VA-LCD includes a sheet of +A plate and a sheet of −C plate, disposed between the first polarizer and the liquid crystal cells, and a sheet of +A plate disposed between the second polarizer and the liquid crystal cells, where an optical axis of the +A plate near the first polarizer is perpendicular to the absorption axis of the first polarizer, and an optical axis of the +A plate near the second polarizer is parallel with the absorption axis of the second polarizer, and where a thickness retardation value of the −C plate is in the range of −500 nm to −30 nm for a wavelength of 550 nm.

1. Field of the Invention
The present invention relates to a vertically aligned liquid crystal display (hereinafter, referred as "VA-LCD"). More particularly, the present invention relates to a VA-LCD in which contrast ratio in the front viewing direction and tilt viewing directions is improved by using a viewing angle compensation film.
2. Description of the Related Art
There are two primary reasons of degradation of a viewing angle of VA-LCDs: first one is the viewing angle dependence of a perpendicular polarizer and second one is the viewing angle dependence of birefringence of a VA-LCD panel.
U.S. Pat. No. 4,889,412 disclosed a VA-LCD using a −C plate compensation film as a viewing angle compensation film. The main function of the −C plate is to compensate the black state of a VA-LCD when a voltage is not applied. However, a VA-LCD with −C plate compensation film has a problem that leakage of light is caused at a tilt angle because the −C plate can not completely compensate the black state.
In order to solve the problem above, U.S. Pat. No. 6,141,075 disclosed a VA-LCD with two compensation films, a −C plate and a +A plate compensation films. The device can compensate the black state on which a voltage is not applied more well compared to the device with the −C plate only, but the minimum contrast at a tilt viewing angle of 70 degrees is 20:1 at most. Accordingly, there is still need to improve contrast at both of the right angle and tilt angles.
Accordingly, the inventors of the present application reached this invention, feeling that a sheet +A plate and a sheet of −C plate have a limit in compensating the viewing angle.

Vertically aligned liquid crystal display


A stent is disclosed, which is formed in a cylindrical shape and has a cavity portion, and is freely switched between an expanded state and a contracted state where the stent contracts to a central axis (O) side from the expanded state. The stent has an anchor portion which protrudes to a central axis (O) side relative to an inner surface surrounding the cavity portion in the contracted state, and which is displaced to the inner surface side in the expanded state relative to a protruded position in the contracted state.

In order to treat a lesion area appearing in a living body lumen such as blood vessels, biliary ducts, bronchial tubes, esophagi, and urethrae, stent treatment has been performed in which a stent is caused to indwell in the living body lumen by delivering the stent using a stent delivery device.
For example, JP-T-2008-507376 discloses a stent which is interposed between a sheath (cover) and a shaft (holder) in a contracted state of the sheath when the stent is delivered into the living body lumen, and which self-expands when the stent is exposed in a lesion by the sheath moving rearward. A rivet is attached to an end portion of the stent so that the stent does not follow the rearward movement of the sheath when the stent is exposed. The rivet is attached so as to protrude relative to an inner surface and an outer surface of the stent, and is locked by a ridge portion of the shaft. In this manner, a restriction (position stopping) on the stent moving along the shaft is imposed.
Incidentally, since the rivet protrudes beyond the inner side of the stent, interference with the flow of a body fluid after the stent indwells in the living body lumen can occur. For this reason, it can be desirable to set a protruded amount of the rivet to be as little as possible. However, in this case, the rivet is easily unlocked by the ridge portion, thereby leading to a disadvantage in that the stent is forced to follow the movement of the sheath.
In addition, although not disclosed in JP-T-2008-507376, the above-stent is exposed, thereby causing a possibility of poor indwelling of the stent. Accordingly, in a case of the stent treatment, if the stent is misaligned when exposed, the sheath is switched from the rearward movement to the forward movement so as to perform an operation for returning the stent into the sheath again. Therefore, it is desirable to adopt a configuration in which the stent does not follow bidirectional (rearward and forward) movement of the sheath.