Aqueous-based thermally developable emulsions and photothermographic imaging materials include photosensitive silver halide core-shell grains that comprise at least 20 mol % iodide based on total silver, an amount of iodide in the core of the grains that can be up to the iodide saturation limit in silver iodobromide, and an amount of iodide in the shell of the grains that is at least 2 mol % less than the amount of iodide present in the core, and further provided that the total amount of silver in the shell is from about 10 to about 80 mol % of total silver in the grains. These materials provide desired Dmax and reduced image xe2x80x9cprint outxe2x80x9d.

This invention relates to aqueous-based photosensitive thermally developable emulsions and photothermographic materials that include silver halide core-shell grains containing high amounts of silver iodide. It also relates to methods of imaging the photothermographic materials.
Silver-containing photothermographic imaging materials that are developed with heat and without liquid development have been known in the art for many years. Such materials are used in a recording process wherein an image is formed by imagewise exposure of the photothermographic material to specific electromagnetic radiation (for example, visible, ultraviolet, or infrared radiation) and developed by the use of thermal energy. These materials, also known as xe2x80x9cdry silverxe2x80x9d materials, generally comprise a support having coated thereon: (a) a photosensitive catalyst (such as silver halide) that upon such exposure provides a latent image in exposed grains that are capable of acting as a catalyst for the subsequent formation of a silver image in a development step, (b) a relatively or completely non-photosensitive source of reducible silver ions, (c) a reducing composition (usually including a developer) for the reducible silver ions, and (d) a hydrophilic or hydrophobic binder. The latent image is then developed by application of thermal energy.
In such materials, the photosensitive catalyst is generally a photographic type photosensitive silver halide that is considered to be in catalytic proximity to the non-photosensitive source of reducible silver ions. Catalytic proximity requires close physical association of these two components either prior to or during the thermal image development process so that when silver atoms, (Ag0)n, also known as silver specks, clusters, nuclei, or latent image, arc generated by irradiation or light exposure of the photosensitive silver halide, those silver atoms are able to catalyze the reduction of the reducible silver ions within a catalytic sphere of influence around the silver atoms [Kilosterboer, Imaging Processes and Materials (Neblette""s Eighth Edition), Sturge, Walworth and Shepp (Eds.), Van Nostrand-Reinhold, New York, Chapter 9, pp. 279-291, 1989]. It has long been understood that silver atoms act as a catalyst for the reduction of silver ions, and that the photosensitive silver halide can be placed in catalytic proximity with the non-photosensitive source of reducible silver ions in a number of different ways (see, for example, Research Disclosure, June 1978, item 17029). Other photosensitive materials, such as titanium dioxide, cadmium sulfide, and zinc oxide, have also been reported to be useful in place of silver halide as the photocatalyst in photothermographic materials [see for example, Shepard, J. Appl. Photog. Eng. 1982, 8(5), 210-212, Shigeo et al., Nippon Kagaku Kaishi, 1994, 11, 992-997, and FR 2,254,047 (Robillard)].
The photosensitive silver halide may be made xe2x80x9cin situ,xe2x80x9d for example, by mixing an organic or inorganic halide-containing source with a source of reducible silver ions to achieve partial metathesis and thus causing the in situ formation of silver halide (AgX) grains throughout the silver source [see, for example, U.S. Pat. No. 3,457,075 (Morgan et al.)]. In addition, photosensitive silver halides and sources of reducible silver ions can be co-precipitated [see Usanov et al., J. Imag. Sci. Tech. 40, 104 (1996)]. Alternatively, a portion of the reducible silver ions can be completely converted to silver halide, and that portion can be added back to the source of reducible silver ions (see Usanov et al., International Conference on Imaging Science, 7-11 Sept. 1998).
The silver halide may also be xe2x80x9cpreformedxe2x80x9d and prepared by an xe2x80x9cex situxe2x80x9d process whereby the silver halide (AgX) grains are prepared and grown separately. With this technique, one has the possibility of controlling the grain size, grain size distribution, dopant levels, and composition much more precisely, so that one can impart more specific properties to both the silver halide grains and the photothermographic material. The preformed silver halide grains may be introduced prior to, and be present during, the formation of the source of reducible silver ions. Co-precipitation of the silver halide and the source of reducible silver ions provides a more intimate mixture of the two materials [see for example, U.S. Pat. No. 3,839,049 (Simons)]. Alternatively, the preformed silver halide grains may be added to and physically mixed with the source of reducible silver ions.
The non-photosensitive source of reducible silver ions is a material that contains reducible silver ions. Typically, the preferred non-photosensitive source of reducible silver ions is a silver salt of a long chain aliphatic carboxylic acid having from 10 to 30 carbon atoms, or mixtures of such salts. Such acids are also known as xe2x80x9cfatty acidsxe2x80x9d or xe2x80x9cfatty carboxylic acidsxe2x80x9d. Silver salts of other organic acids or other organic compounds, such as silver imidazoles, silver tetrazoles, silver benzotriazoles, silver benzotetrazoles, silver benzothiazoles and silver acetylides have also been proposed. U.S. Pat. No. 4,260,677 (Winslow et al.) discloses the use of complexes of various inorganic or organic silver salts.
In photothermographic materials, exposure of the photographic silver halide to light produces small clusters containing silver atoms (Ag0)n. The imagewise distribution of these clusters, known in the art as a latent image, is generally not visible by ordinary means. Thus, the photosensitive material must be further developed to produce a visible image. This is accomplished by the reduction of silver ions that are in catalytic proximity to silver halide grains bearing the silver-containing clusters of the latent image. This produces a black-and-white image. The non-photosensitive silver source is catalytically reduced to form the visible black-and-white negative image while much of the silver halide, generally, remains as silver halide and is not reduced.
In photothermographic materials, the reducing agent for the reducible silver ions, often referred to as a xe2x80x9cdeveloper,xe2x80x9d may be any compound that, in the presence of the latent image, can reduce silver ion to metallic silver and is preferably of relatively low activity until it is heated to a temperature sufficient to cause the reaction. A wide variety of classes of compounds have been disclosed in the literature that function as developers for photothermographic materials. At elevated temperatures, the reducible silver ions are reduced by the reducing agent for silver ion. In photothermographic materials, upon heating, this reaction occurs preferentially in the regions surrounding the latent image. This reaction produces a negative image of metallic silver having a color that ranges from yellow to deep black depending upon the presence of toning agents and other components in the imaging layer(s).
The various distinctions between photothermographic and photographic materials are described in Imaging Processes and Materials (Neblette""s Eighth Edition), noted above, Unconventional Imaging Processes, E. Brinckman et al. (Eds.), The Focal Press, London and New York, 1978, pp. 74-75, in Zou et al., J. Imaging Sci. Technol. 1996, 40, 94-103, and in M. R. V. Sahyun, J. Imaging Sci. Technol. 1998, 42, 23.
Most common photothermographic materials are prepared using organic solvents for layer formulation and coating, and are therefore often identified as xe2x80x9csolvent-basedxe2x80x9d or xe2x80x9cnon-aqueousxe2x80x9d materials. The various chemical components required for such materials are generally soluble in the organic solvents and insoluble in water.
However, photothermographic materials that can be formulated and coated out of water (xe2x80x9caqueous-basedxe2x80x9d materials) would have a number of manufacturing, environmental, and cost advantages. Use of the same chemical components that are present in solvent-based materials is not always possible in aqueous environments without the use of expensive or tedious solubilizing or dispersing techniques. The water-insoluble chemical components tend to precipitate and cause variability in photosensitive response and coating defects when used in aqueous formulations even with adequate dispersion.
One major effort in the development of aqueous-based photothermographic materials has been to increase image density (Dmax). One way to do this is to increase the amount of silver in the imaging environment (or emulsion). However, increasing the silver coverage may increase image xe2x80x9cprint-outxe2x80x9d or an increase in Dmin over time. This effect diminishes the usefulness and accuracy of the image. Very-high surface iodide containing silver halide emulsions have not been of much interest in photographic films because they are difficult to chemically and spectrally sensitize and have relatively slow developing and fixing speeds. Making emulsions with core-shell structures in which the shell has a lower iodide content than the core has reduced or eliminated these problems. Core-shell emulsions are described for example in U.S. Pat. No. 4,728,602 (Shibahara et al.).
The use of core-shell emulsions in heat-developing photographic film is described in U.S. Pat. No. 5,064,753 (Sohei et al.). The silver halide itself is the primary component reduced to silver metal during development and this material is primarily used for color applications. The print-out properties of the preferred formulations are not addressed. High-surface-iodide grains are said to cause enhanced thermal fog.
In photothermographic materials relaying on a non-photosensitive reducible source of silver and coated using a non-aqueous binder, the light-sensitive silver halide core-shell emulsion preferably has a total iodide level of less than 10 mole % as described in U.S. Pat. No. 5,434,043 (Zou et al.) and less than 4 mole % as described U.S. Pat. No. 5,382,504 (Shor et al.).
There is an advantage in cost and to the environment in coating photothermographic materials as an aqueous-based (hydrophilic) system. However, the use of hydrophilic binders may result in rapid high humidity print-out of processed film. Hence, there is a need for improved aqueous-based (hydrophilic) photothermographic materials that exhibit desired high Dmax while image xe2x80x9cprint-outxe2x80x9d is reduced.
The present invention provides a thermally developable emulsion comprising:
a) core-shell grains of a photosensitive silver halide,
b) a non-photosensitive source of reducible silver ions,
c) a hydrophilic binder,
d) a reducing agent composition for the reducible silver ions, and
e) a cyclic imide, benzoxazine dione, benzthiazine dione, triazole thione, quinazoline dione, or phthalazinone as a development promoter,
wherein predominantly all of the core-shell photosensitive silver halide grains comprise at least 20 mol % iodide based on total silver, an amount of iodide in the core of the grains that can be up to the iodide saturation limit in silver iodobromide, and an amount of iodide in the shell of the grains that is at least 2 mol % less than the amount of iodide present in the core, and
further provided that the total amount of silver in the shell is from about 10 to about 80 mol % of total silver in the grains.
This invention also provides a photothermographic material comprising a support having thereon at least one imaging layer comprising a hydrophilic binder, and having in reactive association:
a) core-shell grains of a photosensitive silver halide,
b) a non-photosensitive source of reducible silver ions,
c) a reducing agent composition for the reducible silver ions, and
d) a cyclic imide, benzoxazine dione, benzthiazine dione, triazole thione, quinazoline dione, or phthalazinone as a development promoter,
wherein predominantly all of the core-shell photosensitive silver halide grains comprise at least 20 mol % iodide based on total silver, an amount of iodide in the core of the grains that can be up to the iodide saturation limit in silver iodobromide, and an amount of iodide in the shell of the grains that is at least 2 mol % less than the amount of iodide present in the core, and
further provided that the total amount of silver in the shell is from about 10 to about 80 mol % of total silver in the grains.
In preferred embodiments the photothermographic materials of this invention comprise a transparent support having thereon an aqueous-based imaging layer comprising gelatin or a gelatin derivative as binder,
an aqueous-based surface protective overcoat over the imaging layer, and an aqueous-based antihalation layer on the backside of the support, and
the imaging layer having in reactive association:
a) core-shell grains of photosensitive silver iodobromide,
b) a non-photosensitive source of reducible silver ions that comprises one or more silver carboxylates provided as an aqueous nanoparticulate dispersion, at least one of which silver carboxylates is silver behenate,
c) a reducing agent composition for the reducible silver ions that includes one or more hindered phenols,
d) one or more antifoggants or spectral sensitizing dyes, and
e) succinimide, 2H-1,3-benzoxazine-2,4-(3H)-dione, or phthalazinone as a development promoter,
wherein said cores of the grains comprise iodide in an amount of from about 25 to about 37 mol %, based on total silver in the grain cores, the shells of the grains comprise an amount of iodide that is at least 10 mol % less than the amount of iodide present in the core, and
further provided that the total amount of silver in the shell is from about 10 to about 40 mol % of total silver in the grains, and the amount of total silver from silver halide is from about 0.02 to about 1 g/m2.
In addition, this invention provides a method of forming a visible image comprising:
A) imagewise exposing the photothermographic material of this invention to electromagnetic radiation at a wavelength greater than 400 nm to form a latent image,
B) simultaneously or sequentially, heating the exposed photothermographic material to develop the latent image into a visible image.
In some embodiments, the photothermographic material comprises a transparent support, and the image-forming method further comprises:
C) positioning the exposed and heat-developed photothermographic material having the visible image therein between a source of imaging radiation and an imageable material that is sensitive to the imaging radiation, and
D) thereafter exposing the imageable material to the imaging radiation through the visible image in the exposed and heat-developed photothermographic material to provide a visible image in the imageable material grains.
The photosensitive and thermally sensitive emulsions and materials of this invention provide better incubation keeping (that is, reduced incubation fog), acceptable image density (Dmax) and the resulting images exhibit reduced image xe2x80x9cprintoutxe2x80x9d. These advantages provide latitude in how much silver is used in the emulsion. Other sensitometric properties are maintained at acceptable values. These advantages are achieved by using core-shell photosensitive silver halide grains that include a higher than normal amount of iodide and a specific amount of iodide in the shells in relation to the amount of iodide in the cores of the grains.

Photothermographic materials containing high iodide core-shell emulsions


A method and system for performing failure analysis on a silicon on insulator (SOI) semiconductor device is disclosed. The SOI device includes a plurality of conductive structures in a silicon region. The silicon resides on a box insulator, which resides on a silicon substrate. The method and system include providing a cross-section of the SOI semiconductor device. The cross-section of the SOI semiconductor device includes a portion of the plurality of conductive structures. The method and system also include staining the cross-section of the SOI semiconductor device using a stain. The stain etches the silicon region in the SOI semiconductor device without etching a remaining portion of the SOI semiconductor device not composed of silicon.

The present invention relates to semiconductor devices, and more particularly to a method and system for improving the staining of conductive structures, such as those made of copper, on silicon on insulator semiconductor devices.
Silicon on insulator (SOI) semiconductor devices are increasingly utilized. A SOI semiconductor device includes a semiconductor substrate, or bulk silicon. On the semiconductor substrate is an insulating layer, typically silicon dioxide. The insulating layer is known as the box layer. On the box layer is silicon that is typically p-doped. The devices, such as memory cells, transistors, and junctions, are formed on the silicon. Conductive structures, such as interconnects and contacts, electrically connect devices within the SOI semiconductor device. Typically, the conductive structures are composed of copper.
Often, the circuits in SOI semiconductor devices include one or more faults. In particular, one or more of the conductive structures may have a fault such as a short or an open circuit. In order to investigate the nature of the faults, the SOI semiconductor device is deprocessed. Conventional methods for failure analysis include exposing the conductive structures in cross sections for investigation. Once cross sections are prepared from the SOI semiconductor device, the cross sections are stained, or etched. Staining typically involves treating the cross section with a conventional stain, or selectively etchant. Portions of the SOI semiconductor device are removed by the conventional stain. Staining is used to allow the experimenter to more clearly view the conductive structures. In particular, removal of the silicon
Although conventional cross-section preparation and staining can allow investigation of the conductive structures in an SOI semiconductor device, one of ordinary skill in the art will readily recognize that conventional stains do not simplify distinguishing the conductive structures from the remainder of the SOI semiconductor device. In particular, conventional stains tend to stain unwanted portions of the SOI semiconductor device. For example, most conventional stains attack structures formed of silicides and silicon nitride, such as silicon nitride spacers. Staining of both the conductive structures and other portions of the SOI semiconductor device makes the conductive structures difficult to distinguish. As a result, an investigator may be unable to detect failures in the conductive structures. For example, the presence of open circuits in interconnects or short circuits between interconnects may be overlooked. As a result, it may be difficult or impossible to adequately perform failure analysis.
Accordingly, what is needed is a system and method for improving failure analysis of conductive structures on a SOI device. The present invention addresses such a need.
The present invention provides a method and system for performing failure analysis on a SOI semiconductor device. The SOI device includes a plurality of conductive structures in a silicon region. The silicon resides on a box insulator, which resides on a silicon substrate. The method and system comprise providing a cross-section of the SOI semiconductor device. The cross-section of the SOI semiconductor device includes a portion of the plurality of conductive structures. The method and system also comprise staining the cross-section of the SOI semiconductor device using a stain. The stain etches the silicon region in the SOI semiconductor device without etching a remaining portion of the SOI semiconductor device not composed of silicon.
According to the system and method disclosed herein, the present invention provides a method and system for performing failure analysis on the conductive structures in an SOI device.

Method and system for using TMAH for staining copper silicon on insulator semiconductor device cross sections


The present invention is directed to an improved ball and socket joint for connecting two mailbox post segments together, and improved mailbox post comprising a ball and socket joint, and a method for repairing a leaning mailbox post.

Mailboxes are typically mounted horizontally on vertical posts. A vertical post and horizontal mailbox are desirable for ease of installation, safety, stability, durability, aesthetics and for functionality of the mailbox. Mailboxes are designed to function best when the bottom of the mailbox is horizontal. Therefore, it is important to maintain the mailbox post in a vertical orientation so that the mailbox remains in a horizontal orientation.
According to United States Postal Service (USPS) guidelines, the best curbside mailbox supports are stable but bend or fall away if hit by a car. The Federal Highway Administration (FHA) also recommends that mailbox posts should not be unyielding and that posts should be buried no more than 24″ deep in the ground. Such laudable emphasis on safety may admit for a higher incidence of posts losing verticality over time.
A post may lose vertical alignment by various causes such as by a lateral force of an object hitting the post or by movement of the ground in which the post is erected. To restore a leaning post to vertical, one typically would adjust, repair or replace the base of the post to reestablish verticality of the entire post. Such a repair may require significant time, effort, expense, skills, tools, and materials that people do not have or wish to expend.
There is a need for better way to adjust the alignment of a post without having to adjust the base of the post.
The present invention is directed to an improved means for adjusting the orientation of the upper elevations of a post without having to adjust the orientation of the lower elevations of the post.
The present invention is directed to an improved joint for adjustably connecting two post segments together. The adjustable joint of the present invention allows one to adjust the orientation of upper elevations of a misaligned post without adjusting the orientation of the base of the post. Instead of adjusting the base of the post, one may sever the post into two segments then reconnect the base segment with the upper segment with the adjustable joint. The joint may be manipulated to adjust the orientation of the upper segment without having to adjust the orientation of the base segment. Once the upper segment is in its desired orientation, the joint may be releasably tightened to releasably fix it in that orientation. Thus, there is no need to repair, replace or adjust the foundation of the post.
If there is further movement of the base after the initial repair, or if the upper post segment otherwise needs to be re-oriented, the joint may be loosened, re-adjusted and re-tightened to releasably fix the upper post segment in the desired new orientation.
A new post may be provided with an adjustable joint of the present invention in anticipation of future misalignment so that the post may be realigned with a simple adjustment of the joint. The adjustable joint may be integral to an uninstalled new post.


When measurement data collected with a specific sampling cycle by MCs from measuring instrument units are stored into a data storage apparatus, a sampling controller adjusts the sampling cycle to a longer setting if the apparatus state is other than a substrate processing execution state (e.g., an idling state) compared to the sampling cycle set in the substrate processing execution state, so as to minimize the volume of data stored into the data storage apparatus.

Various types of substrate processing apparatuses are employed in semiconductor production to execute specific types of processing on target substrates undergoing the processing (hereafter may be simply referred to as "substrates"), such as semiconductor wafers and FPD (flat-panel display) substrates. For instance, a plasma processing apparatus is utilized to execute etching, film formation processing or the like with plasma generated over a substrate placed on a stage inside a processing chamber by raising a process gas supplied into the processing chamber to plasma as high-frequency power is applied to an electrode disposed inside the processing chamber.
Various parameters are set in such a processing apparatus so as to control or monitor its operating conditions. Various types of processing are executed in the processing apparatus under optimal conditions by controlling or monitoring the parameters. Such parameters include control data used to control the processing chamber internal temperature, the electrode temperature, the processing chamber internal pressure and the process gas flow rate, optical data used to ascertain the plasma state and electrical data provided from a matcher that matches the impedance at the electrode with the impedance at the high-frequency power source. During the substrate processing, the substrate processing apparatus is controlled by monitoring the individual parameters with corresponding measuring instruments so as to assure that the optimal processing is executed at all times.
Patent reference Japanese Laid Open Patent Publication No. H11-87323 (literature 1) and Japanese Laid Open Patent Publication No. 2004-39952 (literature 2) listed below disclose technologies whereby a plurality of process parameters are analyzed, any changes in the process characteristics or the system characteristics are detected by statistically correlating these parameters as analysis data and the analysis data are corrected based upon the extent to which the detection value fluctuates. There is also a method disclosed in the related art through which the plurality of parameters are compiled into several types of statistical data to be used as analysis data by adopting the method of principal component analysis, which is a type of multivariate analysis method, and the operating conditions of the processing apparatus are monitored and evaluated based upon the statistical data.
A substrate processing apparatus such as that described above may assume any of various apparatus states during substrate processing. For instance, the substrate processing apparatus engaged in continuous processing through which a plurality of substrates are continuously processed in a batch, may assume a substrate processing execution state during which the plurality of substrates are being continuously processed or an idling state waiting for the start of the continuous processing to be executed on the next batch of substrates after the completion of the continuous processing on the preceding batch. The other states that may be assumed in the substrate processing apparatus include a startup state following the apparatus assembly, a replacement-imminent state, in which a part in the substrate processing apparatus needs to be replaced soon, and an error state in which an abnormality has occurred in the apparatus.
As many as several tens of types of parameters are set and thus, the volume of the parameter data provided by the measuring instruments in the substrate processing apparatus is very large. Another factor resulting in the very large data volume in the related art is that since the parameter data corresponding to the various parameters are collected from the individual measuring instruments over fixed sampling cycles (e.g., 0.1 sec) regardless of the specific state the apparatus is currently in. A problem thus arises in that the storage capacity of the data storage means (e.g., a hard disk) where these data are saved becomes quickly depleted.
In addition, the data that must be analyzed in the event of an error in the substrate processing apparatus are mainly those collected while executing substrate processing. The presence of a large volume of data having been collected while the substrate processing apparatus was not engaged in the substrate processing, e.g., while the substrate processing apparatus was in the idling state, saved in the data storage means, leads to another concern that the data needed for the error analysis cannot be retrieved quickly. Furthermore, since no substrate is actually processed while the substrate processing apparatus is in the idling state, it is not necessary to collect a large volume of data in the idling state as long as no error has occurred in the substrate processing apparatus.
The storage capacity in the data storage means may be used more efficiently by lengthening the sampling cycle with which the data are obtained from the measuring instruments and thus reducing the volume of sampled data. However, if the sampling cycle is shortened regardless of the apparatus state, the volume of data collected while, for instance, the substrate processing is in progress will also be reduced. When it becomes necessary to analyze such data, the data analysis accuracy may be compromised. There is another factor to be considered in that it is more desirable to use a data storage means with a smallest possible storage capacity so as to minimize the manufacturing cost.

Data collection method, substrate processing apparatus, and substrate processing system


A fiber Cerenkov-type optical wavelength converter module includes an optical wavelength converter device comprising an optical fiber including a cladding having a first refractive index and a core of a nonlinear optical material disposed in the cladding, said core having a second refractive index higher than the first refractive index, whereby the optical fiber converts the wavelength of a fundamental wave introduced into the core and radiates a wavelength-converted wave into the cladding. A laser beam is emitted from a semiconductor laser and applied as the fundamental wave to the optical wavelength converter device. The temperature of the optical wavelength converter device, or the temperatures of the optical wavelength converter device and the semiconductor laser, are regulated such that the tolerances specified for the length of the optical fiber, the diameter of the core, and other dimensions can be increased. Therefore, the optical wavelength converter device and the optical wavelength converter module can be fabricated with greater ease.

1. Field of the Invention
The present invention relates to a fiber type optical wavelength converter device, which converts a fundamental wave into a second harmonic having a wavelength which is 1/2 of that of the fundamental wave, and an optical wavelength converter module employing such an optical wavelength converter device.
2. Description of the Prior Art
Various attempts have heretofore been made to convert the wavelength of a laser beam into a second harmonic, e.g., shortening the wavelength of a laser beam, or using a nonlinear optical material. One well known example of an optical wavelength converter device for effecting such laser wavelength conversion is a bulk crystal type converter device as disclosed, for example, in Introduction to Optical Electronics, pages 20.about.204, written by A. Yariv and translated by Kunio Tada and Takeshi Kamiya (published by Maruzen K.K.). This optical wavelength converter device relies upon the birefringence of a crystal in order to meet phase matching conditions. Therefore, any material which does not exhibit birefringence or exhibits only small birefringence cannot be employed, even if it has high nonlinearity.
To solve the above problem, there has been proposed a fiber-type optical wavelength converter device. An optical wavelength converter device of this type is in the form of an optical fiber comprising a core made of a nonlinear optical material and surrounded by a cladding. One example of such an optical fiber is shown in Vol. 3, No. 2, pages 2818 32, of the Bulletin of the Microoptics Research Group of a gathering of the Applied Physics Society. Recently, much effort has been directed to the study of a fiber-type optical wavelength converter device since it can easily achieve phase matching between a guided mode, in which a fundamental is guided through the core, and a radiated mode, in which a second harmonic is radiated into the cladding (for so-called Cerenkov radiation).
The wavelength-converted wave produced by the fiber-type optical wavelength converter device is emitted from the output end of the cladding and utilized in various applications. In many applications, the wavelength-converted wave is converged into a small spot. When a wavelength-converted wave is used to record optical signals, for example, the wavelength-converted wave is focused into a very small spot so that higher recording density can be achieved.
However, it has been recognized that the wavelength-converted wave emitted from the fiber Cerenkov-type optical wavelength converter device cannot be converged into a small spot even if the emitted wave is passed through a general spherical lens. In view of this drawback, the inventors of the present application have proposed an optical wavelength converter device capable of converging a wavelength-converted wave into a small spot and an optical wavelength converter module employing such an optical wavelength converter device (see U.S. patent application Ser. No. 384,532). The proposed optical wavelength converter device comprises a fiber Cerenkov-type optical wavelength converter device which includes a cladding having an exit end for emitting a wavelength-converted wave. The exit end of the cladding may have a conical shape for converting the conical wavefront of the wavelength converted wave into a plane wavefront; alternatively it may be shaped like an aspherical lens for converting the conical wavefront into a spherical wavefront, or it may support a grating composed of concentric patterns for converting the conical wavefront into a plane or spherical wavefront.
The proposed optical wavelength converter module comprises a fiber Cerenkov optical wavelength converter device of the type described above and an optical device disposed such that it receives a wavelength-converted wave emitted from the exit end of the cladding of the optical wavelength converter device and converts the conical wavefront of the received wavelength-converted wave into a plane or spherical wavefront.
If the wavefront of a wavelength-converted wave can be converted into a plane wavefront by the above optical device, by a conically-shaped exit end of the cladding, or by a concentric pattern grating on the exit end of the cladding, then the wavelength-converted wave can be focused into a small spot by being passed through an ordinary spherical lens.
If the wavefront of a wavelength-converted wave can be converted into a convergent spherical wavefront by the above optical device, by an exit end of the cladding shaped like an aspherical lens, or by a concentric pattern grating on the exit end of the cladding, then the wavelength-converted wave can be focused into a small spot. Even if the wavefront of a wavelength-converted wave is converged into a divergent spherical wavefront, the wavelength-converted wave can be focused into a small spot by being passed through an ordinary spherical lens.
In order for the wavelength-converted wave to focus well, the length of the fiber, the diameter of the core, and the distance between the optical wavelength converter device and the optical device must be strictly set to certain values corresponding to the wavelength of the fundamental. Therefore, when the optical wavelength converter devices and the optical wavelength converter modules are fabricated, the tolerances for the fiber length, the core diameter, and other dimensions are very small. Therefore, optical wavelength converter devices and modules of the above type are manufactured with a low yield and hence are expensive. When an optical wavelength converter device or module is employed, the light source, such as a semiconductor laser used in combination therewith as a fundamental wave generator, should not produce large variations or fluctuations in the wavelength. Consequently, a system which employs the optical wavelength converter device or module is also expensive.
With the present optical fiber fabricating technology, it is highly difficult or even impossible to produce a core, for example, such that any error in its diameter will be held within the specified limited tolerance.
There are certain instances in applications which do not involve wavefront conversion as described above where the tolerances specified for the length of a fiber, the diameter of a core, and other dimensions are also extremely small. In such cases, the optical wavelength converter device or module is costly or even impossible to fabricate due to limits in the capabilities of the fabricating technology.

Optical wavelength converter device and optical wavelength converter module


A system and method for retrieving enhanced subscriber services from at least one database and delivering those services to the subscribers of a telecommunications network without requiring the expensive upgrading of local switches (LSs) to operate with the Transaction Capabilities Application Part/Advanced Intelligent Network (TCAP/AIN) communications protocol. The system comprises a plurality of LSs which are connected to an Advanced Intelligent Network (AIN) and provide the subscribers with access to the network. The system also includes at least one virtual service switching point (ViSSP) within the AIN for storing the database of enhanced subscriber services. LSs or tandem switches may retrieve enhanced subscriber services from the ViSSP utilizing the Integrated Services Digital Network User Part (ISUP) call-setup protocol.

l. Field of the Invention
This invention relates to telephone switching and, more particularly, to a telecommunications system having local telephone switches capable of retrieving and deploying enhanced subscriber services from an Advanced Intelligent Network (AIN) using a call-setup protocol.
2. History of the Prior Art
Modern telecommunications systems offer subscribers a large number of enhanced subscriber services. These services may include the provision of an 800 Services Database, a Credit Card Verification Database, Geographic Call Routing, Incoming Call Routing, Multi-location Extension Dialing, Network Automatic Call Distribution, Flexible Call Routing, Flexible Carrier Selection, CLASS Calling Name Delivery Database, and others. Some telephone service providers are currently analyzing the use of a system known as the Advanced Intelligent Network (AIN) to provide these services.
FIG. 1 is a simplified block diagram of a typical telecommunications system 11 using an Advanced Intelligent Network (AIN) 12 to provide enhanced subscriber services. The AIN 12 and its associated Signaling System Number 7 (SS7) protocol are described in the industry standard, "TR-NWT-000246, Bell Communications Research Specification of Signaling System Number 7," which is hereby incorporated by reference. A large number of Local Switches (LSs) 13a-n may be connected to a Service Switching Point/Tandem (SSP/T) 14 via multi-frequency (MF) links 15. "tandem", as used herein, may be a local, LATA, or access tandem. The LSs 13a-n provide connections for subscribers 16a-n into the telecommunications system 11. The AIN 12 uses a system of high speed telecommunications links known as a Common Channel Signaling (CCS) network which employs the standard SS7 signaling protocol to link all of the components of the AIN 12. Standard telephony diagrams, and all figures herein, indicate links utilizing the SS7 signaling protocol as dotted lines and MF trunks as solid lines.
The components of the AIN 12 may include the SSP/T 14, one or more Signal Transfer Points (STPs) 18a-n which act as intermediate switching nodes, and one or more Service Control Points (SCPs) 19a-n. The SCPs 19 each contain a database of enhanced subscriber services which are accessed and controlled by a Service Logic Program (SLP). The SCP 19 currently utilizes a standardized protocol known as Transaction Capabilities Application Part (TCAP) for coordination of functions. The current version of the protocol required for communication with the SCP 19 is TCAP/AIN Release 0.1. The SCP 19 is described in the Bellcore standard, "TA-NWT-001280, Advanced Intelligent Network (AIN) Service Control Point (SCP) Generic Requirements," which is hereby incorporated by reference. The SCP 19 acts as a repository for enhanced subscriber services which may be accessed by any one of the LSs 13a-n. In the past, each LS had to be individually upgraded with enhanced subscriber services. With the implementation of the AIN 12, and the required communications capabilities in the LSs, new enhanced services need only be added to the SCP 19.
LSs 13 which have been upgraded to communicate utilizing the SS7 signaling protocol, and the latest release of the TCAP/AIN communications protocol, may communicate directly with an STP 18 and from there with an SCP 19 or other SSP/Ts, utilizing the high speed CCS network. LSs 13 which have not been upgraded with SS7 signaling capability, or with the TCAP/AIN communications protocol, must communicate over lower speed MF trunks 15 with the SSP/T 14 which, in turn, utilizes the SS7 signaling protocol, the TCAP/AIN communications protocol, and the CCS network to communicate with the STPs 18 and the SCPs 19. Dependence on MF trunks for access to the AIN 12 can substantially lengthen the time required to retrieve subscriber services, and ties up an expensive MF trunk which remains open and occupied during the retrieval period. The message flow utilized to retrieve an enhanced subscriber is described in more detail in conjunction with FIG. 4 below.
Another transaction often carried out utilizing the CCS network is call setup. Call-setup messages utilize a call-setup protocol known as the Integrated Services Digital Network (ISDN) User Part (ISUP) call-setup protocol. The ISUP call-setup protocol is described in the Bellcore standards, "TR-NWT-000317. Switching System Generic Requirements for Call Control Using the Integrated Services Digital Network User Part (ISDNUP)", "TR-NWT000394, Switching System Generic Requirements for Interexchange Carrier Interconnection Using the Integrated Services Digital Network User Part (ISDNUP)", and "TR-NWT000444, Switching System Requirements Supporting ISDN Access Using the ISDN User Part", which are hereby incorporated by reference.
FIG. 2 is a simplified block diagram illustrating a typical message flow utilized for call setup between two local telephone switches (LSs) 13 and 23 which have not been upgraded to utilize the ISUP call-setup protocol. Each non-I SUP LS is typically connected through a MF trunk 15 to an associated SSP/T. Thereafter, a series of ISUP messages is sent back and forth between an originating SSP/T 14, associated with a calling subscriber 16, and a destination SSP/T 24, associated with the called subscriber 21. The ISUP messages during call setup include an Initial Address Message (IAM) 22, an Address Complete Message (ACM) 25, an Answer Message (ANM) 26, a Release Message (REL) 27, and a Release Complete Message (RLC) 28. The ISUP messages are routed via the STP 18.
Many LSs in use today have been upgraded to utilize the ISUP call-setup protocol. FIG. 2a is a simplified block diagram illustrating a typical message flow utilized for call setup between two local telephone switches (LSs) 13 and 23 which have been upgraded to utilize the ISUP call-setup protocol. This upgrade allows ISUP-capable LSs to bypass the MF trunk link to the SSP/T, and communicate directly through the STP 18. Thus, the LS may perform call setup entirely over the CCS high speed telecommunications network. The CCS network is capable of transmitting at much higher data rates than multi-frequency (MF) trunks, and call setup can be completed over the CCS network much faster and more efficiently than in the past.
When utilizing the SS7 signaling protocol and the ISUP call-setup protocol for call setup, out-of-band signaling messages replace Multi -frequency (MF) and other in-band interoffice signaling mechanisms on selected circuits. The out-of-band messages are used to report circuit seizure and to transport address information, answer supervision, circuit release, etc. Thus, the network use of the SS7 signaling protocol for circuit-switched call connection and release differs fundamentally from traditional in-band circuit signaling. Instead of sending information on the facilities used for subscriber-to-subscriber communication, the switching system sends signaling information via a separate signaling network. The SS7 signaling protocol thereby allows switching systems to exchange information related to a circuit-switched connection even when the circuit is in the conversation mode.
FIG. 3 is a flow chart illustrating the typical manner in which a call is set up via the ISUP call-setup protocol, for both non-ISUP LSs and ISUP-capable LSs. At step 101, a calling subscriber 16 (FIGS. 2 and 2a) dials the telephone number of a distant subscriber 21. At step 102, if the LSs are not ISUP-capable, the call is routed over MF trunks to an originating SSP/T 14 at step 103. At step 104, ISUP call setup is invoked in the SSP/T 14 which then recognizes the dialed number as a number which requires ISUP routing, and seizes an ISUP trunk at 105. At 106, the originating SSP/T 14 then utilizes the ISUP call-setup protocol to send an Initial Address Message (IAM) 22, via the STP 18, to a destination SSP/T 24, asking for the status of the dialed subscriber's phone 21. At step 107, the destination SSP/T 24 queries the destination LS 23 about the status of the called subscriber's phone 21. The destination LS 23 determines the status of the called subscriber's phone 21, i.e., busy, idle, forwarded, out of service, etc. , at step 108, and returns this status to the destination SSP/T 24. At 109, the destination SSP/T 24 returns, via the STP 18, an Address Complete Message (ACM) 25 to the originating SSP/T 14, containing the status of the called subscriber's phone 21. The originating SSP/T 14 receives the ACM 25 and at step 110, the destination SSP/T 24 returns, via the STP 18, an Answer Message (ANM) 26 to the originating SSP/T 14 indicating that a MF trunk should be set up between the two SSP/Ts 14 and 24. At step 111, the MF trunk 15 between the originating SSP/T 14 and the destination SSP/T 24 is connected thereby providing speech capability between the calling subscriber 16 and the called subscriber 21. Once the call is terminated at step 112, a Release Message (REL) 27 is sent from the switch serving the first subscriber to hang up, to the switch serving the other subscriber. In response, a Release Complete Message (RLC) 28 i s returned.
If, however, at step 102 it was determined that the LSs are ISUP-capable, then the message flow moves to step 113 where ISUP call setup is invoked in the originating LS 13. The originating LS 13 recognizes the dialed number as a number which requires I SUP routing and seizes an ISUP trunk at 114, and at 115 sends an I AM 22 to the destination LS 23 via the STP 18 requesting the status of the dialed subscriber's phone 21. At 116, the destination LS 23 determines the status of the dialed subscriber's phone and returns an ACM 25 to the originating LS 13 containing the status. At step 117, the originating LS 13 returns an ANM 26 indicating that a MF trunk should be set up between the two SSP/Ts 14 and 24. At step 118, the MF trunk 15 between the originating SSP/T 14 and the destination SSP/T 24 is connected thereby providing speech capability between the calling subscriber 16 and the called subscriber 21. Once the call is terminated at step 119, a REL 27 is sent from the switch serving the first subscriber to hang up, to the switch serving the other subscriber. In response, a Release Complete Message (RLC) 28 i s returned.
FIG. 3a is a message flow diagram illustrating the flow of messages from a non-ISUP LS 13 to an ISUP-capable LS 23 during call setup and call release. At 201, the non-ISUP LS 13 seizes an MF trunk to the SSP/T 14. At 202, the SSP/T 14 sends an Initial Address Message (IAM) to the STP 18 which forwards it to the SSP/T 24 serving the called subscriber 21. At 204, the IAM is sent to the ISUP-capable LS 23 serving the called subscriber 21.
An Address Complete Message (ACM) is returned to the SSP/T 24 at 205. At 206, the ACM is sent to the STP 18 where it is forwarded to the SSP/T 14 at 207. An Answer message (ANM) is returned from the LS 23 to the SSP/T 24 at 208. At 209, the ANM is sent to the STP 18 where it is forwarded to the SSP/T 14 at 211. At 212, an answer signal is sent over the MF trunk to the non-I SUP LS 13.
Termination of the call is begun after the first subscriber hangs up (in this example, subscriber 16a). At 213, a release signal is sent over the MF trunk from the non-I SUP LS 13 to the SSP/T 14. A Release message (REL) is sent from the SSP/T 14 to the STP 18 at 214 which forwards the REL to the SSP/T 24 at 215. At 216, the REL is received by the LS 23 which returns a Release Complete Message (RLC) to the SSP/T 24 at 217. At 218, the SSP/T 24 sends the RLC to the STP which forwards the RLC to the SSP/T 14 at 219. At 221, a release complete signal over the MF trunk results in the disconnection of the call.
Referring again to FIG. 1, it can be seen that LSs 13a-n may access the AIN 12 either through MF trunks 15 and the SSP/T 14, or directly through SS7 links 17 to the STP 18. The message flows involved in determining the type of access, and in the method of service retrieval from the database in the SCPs 19, is shown in the flow diagram of FIG. 4. At step 121, a calling subscriber 16a (FIG. 1) dials the telephone number of a called subscriber 16n. At 122, it is determined whether or not the originating LS 13a has been upgraded to utilize the SS7 signaling protocol. If not, then the LS cannot directly access the AIN 12, and the signal is routed, at step 123, to the associated telephone Service Switching Point/Tandem (SSP/T) 14 via a low speed MF trunk 15. At step 124, AIN service is invoked in the SSP/T 14 which recognizes the dialed number as an AIN subscriber at 125. At step 126, the SSP/T 14 sends a Query message via the STP 18 to the SCP 19 requesting call processing instructions. The SCP performs a database lookup on the called subscriber's service that is being invoked at step 127, and then returns routing instructions to the SSP/T 14 at step 128. This response contains all of the information that is necessary to route the call (i.e., routing number, carrier, billing number, etc.). The SSP/T 14 receives the routing instructions from the SCP 19, and completes the call at step 129 by setting a MF trunk 15 between the calling subscriber 16a and the called subscriber 16n.
If, however, at step 122 it is determined that the LS is SS7-capable, then the message flow moves to step 131 where it is determined whether or not the LS has been upgraded with the latest release of the TCAP/AIN communications protocol. If not, then the flow again moves to step 123 where the signal is routed to the associated SSP/T 14 via MF trunk 15. Steps 124 through 129 are then utilized to retrieve the enhanced subscriber service.
If, at step 131, it is determined that the LS has been upgraded with the latest release of the TCAP/AIN communications protocol, then the LS may directly access the AIN 12. At step 132, AIN service is invoked in the LS which recognizes the dialed number as an AIN subscriber at 133. At step 134, the LS sends a Query message via the STP 18 to the SCP 19 requesting call processing instructions. The SCP performs a database lookup on the called subscriber's service that is being invoked at step 135, and then returns routing instructions to the LS 13 at step 136. This response contains all of the information that is necessary to route the call (i.e., routing number, carrier, billing number, etc.). The LS 13 receives the routing instructions from the SCP 19, and completes the call at step 137 by setting a MF trunk 15 between the calling subscriber 16a and the called subscriber 16n.
A major problem with the full implementation of enhanced subscriber services through the AIN 12 is the extremely high cost of the system to the service providers. The major factor in the expense of implementing an AIN is that each of the hundreds of LSs must be hardware/software upgraded to be able to communicate with the SCP 19 in order to access each of the stored subscriber services. The current interface requirements for the SCP 19 are described in the Bellcore standard, "TR-NWT001285 Advanced Intelligent Network (AIN) 0.1 Switch-Service Control Point (SCP) Application Protocol Interfaces Generic Requirements," which is hereby incorporated by reference. The upgrade to the LSs includes the implementation of the most recent version of the TCAP/AIN communications protocol (currently Release 0.1) in the LSs. Telephone service providers typically have hundreds of LSs, and although the cost for each provider will vary, each provider may, for example, be faced with an expense in excess of $500 million to upgrade its LSs to operate with the current release of the TCAP/AIN protocol.
Another problem is encountered by LSs which are SS7 and ISUP-capable, but are not AIN-capable and have not been upgraded to access a particular subscriber services such as 800 service, which currently requires its own communications protocol. As shown in FIG. 4, these LSs 13 (FIG. 1) must set up low data rate MF trunks to the SSP/T 14 in order to access the AIN and the SCP 19 which stores the 800 service. Thereafter, the SSP/T 14 communicates via the high speed CCS network and SS7 signaling protocol with the SCP 19 in order to retrieve the requested service. Modern industry regulations and service expectations are requiring LSs to provide enhanced services at faster connection times than are achievable with MF trunks.
It would be a distinct advantage to have a system which provides a database of enhanced subscriber services which may be accessed by LSs utilizing the high speed CCS network, but does not require the expensive upgrading of LSs to operate with the TCAP/AIN communications protocol. It would be another advantage to have a system which enables all LSs to connect directly into the AIN via the SS7 signaling protocol rather than using slower MF trunks through the SSP/T. The present invention provides such a system.

System for providing enhanced subscriber services using ISUP call-setup protocol


In an ion implantation apparatus which is for use in injecting an ion beam (11) onto a wafer (12) in a predetermined direction and which comprises an electric conductor tube (14) divided into a first tube section (17) and a second tube section (18) along the predetermined direction with an insulator interposed therebetween. The first tube section is located in proximity of the wafer and is grounded while the second tube section is remote from the wafer to be used as a target section which is bombarded by primary electrons to generate secondary electrons directed to the wafer. Undesired electrons are trapped by the first tube section and flow through the ground.. The electric conductor tube may further comprise a third tube section (21) which is electrically insulated from the second tube section and which is remote from the wafer in comparison with the second tube section in the predetermined direction. The first and the third tube sections are controlled so as to adjust their diameters in dependency upon a diameter of the ion beam.

This invention relates to an ion implantation apparatus for injecting an ion beam into a substrate.
On injecting an ion beam into a substrate or a wafer, the substrate is positioned on a disk section and is directed to the ion beam. When the ion beam is irradiated onto the substrate, a positive electric charge may be electrified on a surface of the substrate. Therefore, it is necessary to remove the positive electric charge from the substrate.
A conventional ion implantation apparatus is disclosed in Japanese Unexamined Patent Publication No. 10563/1989 (Tokkai Hei 1-10563) filed by the present assignee. In the conventional ion implantation apparatus, an ion beam is irradiated onto a substrate along a predetermined direction which may be called an irradiating direction hereinafter. Specifically, the conventional ion implantation apparatus comprises an electric conductor tube which is extended towards the irradiating direction and which has an inner wall. The inner wall is used as a target section for emitting electrons. An electron supplying section supplies primary electrons towards the target section to make the target section emit secondary electrons.
The secondary electrons are transferred in the form of an electron beam to the substrate through the electric conductor tube. As a result, it is possible to remove the positive electric charge from the substrate.
By the way, a secondary current is generated in the electric conductor tube when the secondary electrons are emitted from the target section. An amount of the secondary current is proportional to that of the secondary electrons. In addition, the amount of the secondary electrons is proportional to that of the primary electrons sent from the electron supplying section. This shows that the secondary current has to depend on the amount of the primary electrons. Therefore, it may be possible for the electron supplying section to substantially control the amount of the secondary electrons by detecting the amount of the secondary current.
However, undesired electrons are practically emitted from the substrate when the ion beam is irradiated to the substrate. The undesired electrons collide with an inner wall surface of the electric conductor tube. Such collision of the undesired electrons brings about a drastic change of the secondary current. As a result, it is practically difficult to suitably control the amount of the secondary electrons when a change of the secondary current is considered. In other words, the electron supplying section can not accurately control the amount of the secondary electrons. Therefore, it is difficult to avoid electrification of the substrate.

Ion implantation apparatus capable of avoiding electrification of a substrate


To provide a fishing rod having a flexible tip rod less prone to breakage, and desired degrees of the flexibility and strength can be obtained at a required portion of the tip rod. A fishing rod includes a tip rod made of a fiber-reinforced resin material. The tip rod is formed of a short-fiber reinforced resin material in which short fibers are dispersed in a matrix resin material, the average fiber diameter of the short fibers is 3 to 15 μm, the average fiber length of the short fibers is 0.5 to 10 mm, and the content of the short fibers is 3 to 50 wt %, and a periphery of the short-fiber reinforced resin material is at least partially covered with a prepreg sheet in which reinforced fibers are aligned and extended in one direction and impregnated with a synthetic resin.

A common fishing rod has a prepreg wound around the body of the rod. The prepreg is reinforced fibers extended in a specific direction and impregnated with a synthetic resin. The fishing rod has a tubular structure in order to reduce the weight of the rod. However, a tip of the rod may be made solid to obtain flexibility and to prevent damage thereon when the tip portion of the rod is largely bent by fish bites.
Japanese Patent Application Publication Nos. S54-80372 and H9-248103 disclose a solid tip made of a so-called fiber-reinforced resin material formed from a reinforced fiber (a carbon fiber, a glass fiber or the like) impregnated with a synthetic resin. The fiber-reinforced resin material is typically formed by pultrusion and disposed continuously from a proximal end to a distal end of the tip rod.
The above-described prior-art tip is formed from a material in which reinforced fibers are arranged continuously from the proximal end to the distal end (a continuous fiber solid body), therefore elongation of the material is dictated by the material of the selected reinforced fiber. For example, the elongation of the above mentioned carbon fiber and glass fiber is about 1.5% to 2.7% of the original total length, this means that the fiber itself does not stretch so much. Because of a low elongation of such reinforced fibers, a rigidity of the tip is relatively high and has a limited flexibility when the tip is bent. It is preferable that a tip of a rod be flexible enough to sense and see subtle fish bites and have a high strength (especially a bending strength). Some solid tip rods made of the above-described fiber-reinforced resin material require more flexibility depending on target fish types and types of fishing. More flexible tip rod made of the continuous fiber can be obtained by reducing the outer diameter of the tip rod.
A certain degree of the flexibility and strength of the tip rod is required for realize, for example, various types of actions of the tip rod. The degrees of the flexibility and strength and the positions where such flexibility and strength are imparted vary depending on a type of the action. Particularly when a proximal end of the tip rod is connected to a tubular tip-holding pole, a prescribed degree of strength is required at the connecting portion in order to enhance continuity of the action. However, if the tip rod is made too flexible, the strength is likely reduced at the connecting portion. The tip rod should have appropriate flexibility and strength (bending rigidity, torsional rigidity and the like) as described above, the above-mentioned prior art tip rod cannot satisfy this requirement.


A catheter for introduction into the vascular system of an animal is disclosed comprising: a tubular member with a proximal and distal end and an inner and outer surface, the outer surface provided with an inflatable steering means, the inner surface defining a passage, the passage provided with a guide wire; and a control means operably linked to the inflatable steering means for selectively inflating same, said control means inflating said inflatable steering means to align said tubular member toward a selected branch of the vascular system, said guide wire being directed through the passage into said selected branch of said vascular system and said tubular member being advanced over the guide wire into said selected branch of the vascular system.

1. Field of the Invention
The present application relates to catheters, cannulae, endoscopes, and fiberoptic delivery systems of various forms of light, including laser, and particularly to a guidance system for directing such devices through the vascular system from a position external to the body.
2. Description of the Background Art
Many commerically available catheters and endoscopes exist for introducing into the vasuclar system a variety of surgical tools and materials, such as radiographic contrast materials, angioplasty baloons, fiberoptic cameras and lights, laser light, and a wide array of cutting instruments. These catheters and endoscopes are constructed to have good torque and rotational control in addition to advance and withdraw capabilities.
However, these catheters and endoscopes lack the ability to negotiate a tortuous course, i.e., trackability or steerability. Such catheters and endoscopes lack the ability to control vertical and horizontal movement of the tip of the device. For convenience of description, the term catheter will be used hereinafter. To overcome this problem, a series of catheters having different tip shapes, sizes, and stiffness are introduced on a flexible guide wire in order to appropriately deflect the tip in the proper direction.
Other attempts have been made in the past to provide catheters having distal ends which, when inserted into a body, are manipulatable to advance the catheter through body cavities. Catheters have been developed to include permanent magnets and employ magnetic fields to bend the distal end of the catheter. However, these devices are quite difficult to control and manipulate. Other catheters include fluid conduits to expand the distal end, but not to guide the distal end of the catheter.
Some work has been done to produce catheters which are readily insertable while being effectively anchorable in a body cavity. For example, the distal end of a catheter may be formed into a desired shape by using a material exhibiting mechanical memory that is triggered by heat. By heating the mechanical memory material, the distal end of the catheter is shaped to anchor the catheter within the body. However, the change of the shape or other movement of the distal end in these prior devices is limited to a single direction. Once the memory material has been heated causing the distal end to move in said single direction to assume its characteristic anchoring shape, it becomes necessary to deform the distal end manually at a temperature below the transition temperature of the mechanical memory material in order to change the shape of the distal end. The need for manual manipulation of a catheter once it is inserted into a body limits the steerability and aimability of the catheter.
U.S. Pat. Nos. 4,543,090, 4,601,705, and 4,758,222, all to McCoy, teach a catheter including an elongated tubular member having a proximal end and a distal end for insertion into the body and a plurality of temperature-activated memory elements in the distal end of the tubular member. Each memory element assumes a first shape when heated to a predetermined temperature. Each memory element is coupled to at least one other memory element so that movement of one element results in movement of the other element. Each memory element is moved to a second shape when the memory element coupled thereto is heated to the predetermined temperature. A control system adjacent the proximal end of the tubular member allows an operator to selectively control the temperature of each temperature-activated element to deflect the distal end of the tubular member so as to direct the course of the tubular member toward an organ or tissue within the body. The control system includes a power supply source, electrical connections between the power supply source and the memory elements in the distal end of the tubular member, and a control device for selectively applying power to heat the memory elements to their predetermined temperatures to deflect the distal end of the tubular member so as to steer the tubular member or aim the distal end of the tubular member within the body.
U.S. Pat. No. 4,636,195 to Wolinsky teaches a catheter having distal and proximate balloon segments expansible to produce a chamber around arterial plaque and a conduit for delivering solubilizing liquid into the chamber. The catheter may also contain a central expansible balloon to assist in forcing the liquid into the plaque and to compress the plaque. Several solubilizing liquids are described.
Technology exists for manufacturing small catheters having multiple lumens or channels. In addition, technology exists for the delivery of fluids to small inflatable balloons located at the end of a catheter to achieve angioplasty.
Manufacturers of gastrointestinal fiberoptic endoscopes have developed extremely sophisticated mechanical means involving cables and wheels to achieve tip mobility in their endoscopes. To date, no one has been able to transfer this technology to a vascular catheter because of the catheter's inherently small size, the extreme flexibility required to negotiate the vascular system, and the extreme length required to reach the coronary arteries from peripheral location such as the femoral artery in the groin.
Thus, there is a need for an aimable and steerable guidance system for a vascular catheter that may be less than 1 mm in diameter, extremely flexible, and very long.

Guidance system for vascular catheter or the like


A fluorescent luminaire lens frame is described wherein the frame is formed from a U shaped element, and a cross bar. Each of the two elements are formed from single piece sheet metal blanks. The frame includes hinge elements on the free ends of the U extending beyond the cross bar that may be coupled to a luminaire housing. The frame joints are also structured with abutting and capturing structures to prevent rotation of the sides away from about a right angle.

It is common practice to make recessed fluorescent luminaires from several components. A housing may be commonly formed from two separate ends, four separate frame sides, two hinges, two latches, and numerous fasteners. These parts are manually assembled into a complete luminaire using screws, rivets or other fasteners. Since assembly costs rise with the number of components, there is a need for a luminaire with a minimum number of components.
It is also common practice, to make luminaires with at least two different housings forms. One form is for recessed ceiling mounting, while a second is for recessed dry wall mounting. The application of a single or a three lamp version in place of the more common two lamp and four lamp versions usually requires additional different housing forms.
The disadvantages of the present common practice is the necessity to manufacture many parts and the need to assemble these parts together in various steps and the need to fasten the parts together by using mechanical fasteners, all of which is time consuming and expensive. There is then a need for a lamp fixture incorporating fewer parts to be assembled together for both the luminaire housing and frame.
There is also a need for a luminaire wherein a small change or addition of a component in the same housing may eliminate the need for a special housing thus providing flexibility for use.
Examples of the prior art are shown in U.S. Pat. Nos. 4,171,535; 4,403,275; 4,536,830. U.S. Pat. No. 4,171,535 shows a recessed, multiple piece fluorescent lamp luminaire having side walls designed to coact with a suspended ceiling structure. U.S. Pat. No. 4,403,275 shows recessed fluorescent lamp luminaire with an internal reflector structure to enhance light radiation. U.S. Pat. No. 4,536,830 shows a fluorescent lamp with an internal reflector structure to enhance illumination.


Disclosed is a transfilling device (1) for transfilling a liquid drug from a cartridge (3) to a flexible reservoir (4). The transfilling device (1) includes a support unit (111) and a plunger (113), the support unit (111) configured to receive the cartridge (3), the plunger (113) being insertable into the cartridge (3), wherein the plunger (113) is displaceable relative to the support unit (111) along an advancement direction (2) between a plunger retracted position, where the plunger (113) is in a most distal position relative to the support unit (111), and a plunger advanced position, where the plunger (113) is in a most proximal position relative to the support unit (111), wherein the plunger (113) is configured to push a piston (32) of the cartridge (3) from a piston retracted position to a piston advanced position by displacing the plunger (113). The transfilling device (1) further includes a transfer cannula (12, 12′), wherein the transfer cannula (12, 12′) is configured to penetrate a flexible reservoir septum (41) with a cannula outlet end (122) and to penetrate a cartridge septum (31) with a cannula inlet end (121) and thereby to fluidly couple the flexible reservoir (4) with the cartridge (3). The transfilling device further includes a reservoir locking unit (13), wherein the reservoir locking unit ( ) is configured to releasably mechanically couple the support unit (111) to the flexible reservoir (4) and wherein the coupling of the reservoir locking unit (13) is designed such that the coupling is released in the plunger advanced position.

The need for transfilling liquid drugs exists in various medical fields. Particularly, a considerable and increasing number of persons with diabetes (PwD) rely on Continuous Subcutaneous Insulin Infusion (CSII) via miniaturized and computer-controlled infusion pumps to supply insulin to the body in a continuous way night and day. In classic systems of this type, a generally cylindrical insulin glass or plastic cartridge is emptied by displacing a piston via a plunger rod in a controlled way (syringe-driver pump). In recent times, however, a number of alternative approaches have and are being proposed and developed which use flexible or semi-flexible insulin reservoirs, such as bags or pouches rather than rigid containers. Examples for such flexible or semi-flexible containers are disclosed, for example, in the EP2179755 B1. Typical filling volumes for such insulin reservoirs lay in a range of, for example, 1 ml to 4 ml. This amount of insulin is sufficient for a number of days of therapy for most PwDs. Mainly for safety and regulatory reasons, the reservoirs are generally one-way products that are discarded and replaced after a single use.


A SGT MOSFET having ESD diode and a method of manufacturing the same are disclosed. The SGT trench MOSFET according to the present invention, has n+ doped shielded electrode in an N channel device and requires only two poly-silicon layers, making the device can be shrunk with reducing shielded gate width for Rds reduction without increasing switching loss and having dynamic switching instability.

Please refer to FIG. 1A for a shielded gate trench MOSFET (SGT) of prior art disclosed in U.S. Pat. No. 7,855,415. Compared to a conventional trench MOSFET having single trenched gate, a shielded gate trench MOSFET as shown in FIG. 1A is more attractive due to its reduced Cgd (capacitance between gate and drain) in accordance with reduced Qgd (charge between gate and drain), and increased breakdown voltage of the trench MOSFET, making an excellent choice for power switching applications such as inverter and DC to DC power supply circuits. Moreover, the SGT has a shielded gate as a built-in RC snubber which is important for suppressing EMI (electromagnetic interface). Furthermore, in this prior art, an ESD (Electrostatic Discharge) protection diode is integrated with the SGT as shown in FIG. 1B for enhancing ESD capability.
However, the SGT MOSFET in FIG. 1B requires three poly-silicon layers (one poly-silicon layer for the shielded electrode, another for trenched gate and the other for ESD diode) and two mask layers for the shielded gate and the ESD diode, respectively resulting in a complicated manufacture process and causing a high fabrication cost.
Please refer to FIG. 2 for another SGT with ESD diode of prior art disclosed in U.S. Pat. No. 9,963,969 which requires only two poly-silicon layers, because the poly-silicon layer used for shielded gate is also used for ESD diode, therefore, one poly-silicon layer is saved. Meanwhile, in the manufacturing process, the mask used to define shielded gate is also used to define the ESD diode, therefore, one mask is saved.
However, since the prior art has p type doped shielded gate (as shown in FIG. 2) resulting in high shielded gate resistance when shrinking device by reducing shielded gate width for lower on-resistance. The high shielded gate resistance will induce dynamic avalanching instability and more switching loss due to the shielded gate served as the snubber.
Therefore, there is still a need in the art of the semiconductor device design and fabrication, particularly for SGT trench MOSFET design and fabrication, to provide a novel cell structure, device configuration and manufacture process that making a SGT trench MOSFET having ESD diode and a simpler manufacture method to improve the performance of the trench MOSFET and to further cut down manufacturing cost.

Shielded gate trench MOSFET with ESD diode manufactured using two poly-silicon layers process


The invention relates to an electrical filter element (1) for filtering alternating voltage interference. The electrical filter element (1) comprises two dielectric circuit board substrates (11, 12) having a magnetic core (13) arranged between the circuit board substrates. The magnetic core (13) has a material-free inner region (13a), in which electrical connection elements (21-24) are provided between the two dielectric circuit board substrates (11, 12). Furthermore, electrical connection elements (31, 32) can also be provided between the two dielectric circuit board substrates (11, 12) in an outer region of the magnetic core (13).

The present invention relates to an electrical filter element and an electrical power converter having an electrical filter element of this type.
Electrical power converters, in particular inverters, are used in numerous technical fields. For example, inverters of this type are used in electrical drive systems of electric vehicles or hybrid vehicles. The inverters used in this case, in particular clocked inverters such as pulse-controlled inverters (PCI), for example, naturally electrically generate common-mode interferences and differential mode interferences. In order to minimize these interferences, suitable filter apparatuses must typically be provided which reduce the emission of interference variables in the direction of a supply network, such as the high-voltage network of an electric vehicle, for example. There already exist numerous guidelines and regulations for this purpose, which specify a maximum permissible emission of interferences.
Printed document DE 10 2010 054 005 A1 discloses an electrical apparatus with an inverter and an EMC filter. The EMC filter comprises interference suppression capacitors and a common-mode suppression choke with a magnetically active core. The common-mode connections of the inverter are connected to power supply connections via the common-mode suppression choke and connected to a ground connection via the interference suppression capacitors.

Electrical filter element and electrical power converter


A cast grid array (CGA) package comprises shaped solder posts which may be reflowed and connected directly to a circuit board, such as mother board, or remain in a solid state with the shape allowing them to be secured within a CGA socket which, in turn, may be connected to the a board. Embodiments of the CGA allows for a lower cost socket and package combination by using solder post to interface the socket and not requiring a loading mechanism on every socket.

Semiconductor manufacturers currently employ two primary technologies for central processing unit (CPU) packages. The first is referred to as pin grid array (PGA) sockets and the second is commonly referred to as land grid array (LGA) sockets.
Pin Grid Array sockets use high strength pin grid arrays attached the bottom of the package which are then engaged into a pin grid array socket. The pins are loaded laterally within the socket which adds height, cost and complexity to the socket. The pins also add cost to the package. PGA packages typically have a greater assembly and material cost due to the pins. In addition, there are limitations on the pin pitch and number of pins that can realistically be manufactured.
LGA packages may be less costly since there may be no holes, rather, pins on the LGA touch contact points on the underside of the CPU and are retained in the socket by either an integral loading scheme such as the direct socket loading (DSL) for socket T or an independent loading mechanism (ILM) with a back plate as adopted for socket B. Socket T and Socket B refer to two types of currently used socket variations. LGA use lands on the bottom of the package but the contacts need a relatively high normal force throughout the life of the socket to maintain electrical continuity. The high normal force usually requires a relatively expensive loading solution for each socket and historically a load spreader or integrated heat spreader has been used to distribute the enabling load across the array of the contacts. The load/heat spreaders add cost to the package and the socket loading mechanisms add cost the socket/platform.
Thus, semiconductor manufacturers are constantly striving to find affordable new ways to secure a CPU reliably in a confined area.

Cast grid array (CGA) package and socket


A system for protecting devices operating on 64-bit editions of operating systems by retrieving the file path by which the process was run and not the actual file path from where the process is running and scanning this retrieved file path for viruses.

Typically, a computer system which is basically hardware is only functional after it is tied up with an operating system. One such widely used operating system is the Microsoft developed Windows system.
A 64-bit version of Windows system is one wherein all the core components and peripheral components are adapted to transmit, receive and work on 64-bit data. This version allows execution of 32-bit application. This is achieved by using a subsystem which executes the application viz., WOW64 which stands for Windows on Windows 64-bit. More appropriately, it can be put as 32-bit Windows subsystem on 64-bit Windows.
Dynamic-link library (DLL) is an implementation of the shared library concept in the Microsoft Windows and OS/2 operating systems. A 32-bit process cannot load a 64-bit DLL and, similarly, a 64-bit process cannot load a 32-bit DLL. As the Windows system folder contains both the installed applications and their DLLs, it must be separated into a native system folder for the 64-bit applications (%windir%\system32) and a WOW64 folder for the 32-bit applications (%windir%\syswow64). Here %windir% is the Windows folder or more specifically Windows installation folder.
Developers often hard code the system folder path name in their application. Therefore, to preserve application compatibility, the 64-bit system folder is still called system32. To enable 32-bit applications that have hard-coded paths to transparently access the WOW64 system directory, the WOW64 layer provides a File System Redirector feature which redirects the 32-bit application's attempts to access (%windir%\system32) to the new WOW64 system directory (%windir%\syswow64).
A device may get infected by a virus through many sources including:                Floppy/CD/DVD drives: The virus, typically, spreads through boot sector of these drives.        Pen drives: The virus spreads through autorun feature of this drive.        Network: The virus spreads through network shares.        Internet: The virus spreads when infected websites are browsed.
A memory scanner should detect virus which may have spread through any of the above mentioned media or scenario.
All accesses made by a WOW64 (32-bit) process to the %windir%\system32 directory are redirected to the %windir%\syswow64 directory. Therefore, with file system redirection enabled, a 32-bit application accesses the same contents for both the system32 and syswow64 directories. File system redirection is enabled for all WOW64 applications by default.
A windows system includes a core loading means (folder) which includes applications and processes that run on 32-bit operating systems.
Assuming c:\windows is the Windows folder, Launch.exe is a 32-bit application that will launch the target.exe. Target.exe which can be 32-bit or 64-bit application will be launched from c:\windows\syswow64\. Launch.exe launches target.exe by using the path c:\windows\system32\target.exe. Since launch.exe is a 32-bit application it will run under WOW64 and the path c:\windows\system32\target.exe will get redirected to c:\windows\syswow64\target.exe and the target.exe will run.
Typically, an Anti-Virus system having memory scanning function has a memory scanning means comprising:                enumerating means adapted to enumerate running processes;        defining means adapted to define the file path of the enumerated running processes; and        scanning means adapted to scan file obtained at the defined path.
The main issue in the Anti-virus systems of the prior art deals with the defining means (typically, GetModuleFileNameEx in Windows system). The defining means gets the file path of the running processes, by which the process was run and not the actual file path from where the process is running. Hence, in the above example, it fetches the file path c:\windows\system32\target.exe (the file path which was used to run the process) instead of c:\windows\syswow64\target.exe (the actual file path from where the file is running).
Therefore, the 64-bit memory scanning means will scan c:\windows\system32\target.exe instead of c:\windows\syswow64\target.exe and hence skip the actual file. If target.exe is a virus file, then that won't be detected by the memory scanner means. This problem doesn't occur with 32-bit memory scanner means because when it tries to scan c:\windows\system32\target.exe it is automatically redirected to c:\windows\syswow64\target.exe thereby scanning the actual file.
A detailed flow of events in an Anti-Virus system of the prior art is illustrated in FIG. 1 and described herein below.
In accordance with a system of the prior art, an Anti-Virus system comprises:                an invoking means IVM that invokes a memory scan feature using a user interface;        an enumerating means EM that enumerates all running processes and the result of the enumeration is returned in the form of a list of the Process Identifiers or ProcessIds;        a selection means SLM that selects a ProcessId from the list generated by the enumeration means EM;        a handling means HM that provides a handle for opening the selected process;        a retrieving means RM that retrieves and defines the file path of the selected process in MS DOS path format;        a scanning means SCM that scans the file obtained at the defined path using the virus database which stores a plurality of virus signatures;        an iteration means ITM that continues the steps starting from selecting a ProcessId from the list generated by the enumeration means EM upto scanning until each and every ProcessId has been selected at least once.
The retrieving means RM used in the Anti-virus systems known in the art use the GetModuleFileNameEx function for retrieving the file path. Thus the file path retrieved is the file path that is used to run the process and not the actual file path of the running process.
Several attempts have been made to make the Anti-virus systems known in the art more efficient. For instance, U.S. Pat. No. 6,802,028 discloses an interface that provides a first access path to the storage medium and a detector that provides a second access path to the storage medium and an analyzing step that detects a virus by identifying an inconsistency between storage locations accessed using the two paths and removing means to remove the virus from the computer system.
Furthermore, US Patent Application 2006/0265749 discloses a method to scan and remove viruses present in thread areas. It searches a list of threads, associated with the infected process and scanning and disinfecting the searched file wherein scanning of infection and the disinfection procedure is carried out for thread areas of the memory.
Again, US Patent Application 2009/0038011 discloses a method which comprises the steps of storing the executable file with the stored information, determining via the detection module whether there is any difference between the executable file and the stored information and replacing the removal executable file with the copy of the malware free executable file.
Although attempts including those mentioned herein above have improved the working of Anti-Virus systems, there is still a need for a system that can provide accurate protection for systems with 64-bit editions of operating systems.

System for protecting devices against virus attacks


An individualized imaging method, comprising the following steps: scanning an imaging subject mold; conducting calibration, rectification and optimization on the imaging system according to the information obtained after mold imaging: scanning the imaging subject with the calibrated, rectified and optimized imaging system; optimizing information obtained by scanning the imaging subject and the mold thereof to obtain higher quality imaging results and data analysis result; and applying the higher quality imaging results and data analysis results to optimize the mold for use in the next imaging.

As shown in FIGS. 1-4, in the conventional medical imaging technology, the priori knowledge of an object to be imaged is not fully utilized in order to obtain higher diagnosis accuracy, less radiation injury and lower cost. Such as, a cylinder used as a prosthesis is imaged to obtain image data information Img0 when PET imaging is performed. The image data information Img0 is utilized for system calibration and system correction. Then a body is imaged by the calibrated and corrected imaging system to obtain image data information Img1. This process which uses a cylinder as a prosthesis to calibrate and correct the imaging system is rough. The image system itself is not optimized.
Besides, for some combined imaging systems, such as a PET-CT combined imaging system, patients may experience CT before experiencing PET-CT. But, when the PET-CT is performed, they have to experience CT imaging in the PET-CT once again to correct the attenuation. Generally speaking, the CT in the PET-CT has low performance and great radiation. In the diagnoses of some diseases, such as physical examination, the result of the CT is not needed, which adds the amount of radiation to the patients and is harmful to health of the patients.
Thus, it is necessary to provide a new individualized imaging method to overcome the problems existed in the conventional technology. This method fully utilizes the priori knowledge of human. By establishing a mould for an individual, using the mould to calibrate, correct and optimize the system and utilizing the information of the mould to optimize the imaging result, imaging result and data analysis result with a higher quality may be achieved.

Imaging subject mould manufacturing method, and individualized imaging method


Provided is an engagement position storage device capable of detecting a clutch engagement position of a vehicle finely and a brake system including such a device. In an engagement position storage device 2b that stores an engagement position of a clutch to engage and disengage power of a vehicle, when the vehicle becomes a traveling state in predetermined duration after acceleration in a front-back direction of the vehicle changes, the engagement position storage device 2b stores a clutch engagement position based on a clutch position detected when the acceleration changes. A brake system 1 includes a wheel latching mechanism 5 that latches wheels of a vehicle by driving a propelling member 5a by driving devices 3 and 4; and a controller 2 that controls driving of the propelling member 5a of the wheel latching mechanism 5 based on a clutch engagement position stored in the engagement position storage device 2b.

Field of the Invention
The present invention relates to an engagement position storage device that stores an engagement position of a clutch, and a brake system including the same.
Background Art
Conventionally known hydraulic disk brakes to be installed in a vehicle such as an automobile include a disk brake equipped with a parking brake mechanism.
Such a disk brake for use as a usual brake propels a piston in a cylinder by hydraulic pressure and presses a brake pad against a disk rotor, thus generating a braking force. For use as a parking brake, the disk brake rotates a rotating member of a ball-and-ramp mechanism (rotation-linear motion conversion mechanism) by an electric motor via a reducing mechanism to linearly move a linear motion member and move a piston forward, and so press a brake pad against a disk rotor, thus generating a braking force.
Such a hydraulic disk brake equipped with a parking brake mechanism has been requested to deactivate the parking brake promptly and so start a vehicle smoothly.
Japanese Laid-Open Patent Publication No. 2011-214647 (Patent Document 1) discloses a technique of releasing a parking brake promptly, including: determining the presence or not of a parking brake release request by a parking brake switch and the necessity or not of parking brake release by pressing down on an accelerator pedal; and in the case of the presence of a parking brake release request or the detection of pressing-down of an accelerator pedal of a certain amount or more, rotating a rotating member in the same direction as in the parking brake operation by an electric driving mechanism, thus directly moving a ball from a shallowest part of a beveled groove to an adjacent deepest part of the beveled groove.
This technique, however, has a problem of, for automatic release of the parking brake in response to the confirmed starting operation such as activation of an accelerator pedal by a driver, especially for rapid starting of a vehicle equipped with a manual transmission, it takes time to remove a braking force completely after starting of the releasing of the parking brake, and so it has difficulty to release the parking brake completely at a sufficient speed necessary for smooth starting of the vehicle.
To solve such a problem, Japanese Laid-Open Patent Publication No. 2006-528581 (Patent Document 2) discloses a technique of releasing a brake device equipped with an electric parking brake mechanism in response to a confirmed staring operation, in which the releasing timing thereof is specified depending on at least one measured parameter of a clutch engagement operation.
According to the technique disclosed in Patent Document 2, the operating timing of the clutch is confirmed by the engine speed or by the detection of a change in engine torque or a change in acceleration of the vehicle, whereby in the case of rapid starting of a vehicle equipped with a manual transmission as well, the releasing of the electric parking brake can be controlled finely for smooth starting of the vehicle.
The acceleration of a vehicle, however, may change due to factors other than the starting of the vehicle by a clutch engagement operation, such as vibrations induced internally or externally of the vehicle or inclination of the road surface. As such, the technique disclosed in Patent Document 2 may erroneously determine, as a clutch engagement position, the clutch position where acceleration changes due to a factor other than the starting of the vehicle by a clutch engagement operation, and so fail to detect the clutch engagement position of the vehicle finely. Automatic releasing of the braking force based on such a clutch engagement position performed at a position immediately before the clutch engagement position may erroneously release the braking force at a position away from the actual clutch engagement position, thus failing in smooth starting of the vehicle.