A method and system for eliminating a need for coins in cash transactions in most currencies includes a comparison of a sum of a fractional dollar amount of an original transaction amount of a cash transaction between a merchant and a consumer plus a beginning value of a consumer storage device to a value of either 1.00 or 2.00. The amount of the value depends on whether a sum of credits and debits incurred by the merchant is greater or less than or equal to a sum of per transaction fees. The original transaction amount is decreased or increased to the next whole dollar amount, thereby providing a new transaction amount, if it is determined that the sum of the fractional dollar amount of the original transaction amount plus the beginning value of the consumer storage device is greater or less than, respectively, the value assigned.

It is known that the United States Mint produced over nine billion coins (excluding the $1.00 coin) from Jan. 1, 2009 to Dec. 31, 2010. However, most consumers who still prefer to use cash do not carry coins with them, and instead will pay for purchases with paper currency. These consumers receive the change in coins. A majority of these coins are then accumulated in vehicles or at home, for example, in a change jar. Eventually the consumers will cash in the coins, often paying a fee to do so, or the coins go out-of-circulation.
The total value of the coins that are out-of-circulation at any given time is unknown, but the estimates are in the tens of millions of dollars. Many of the solutions that have been documented to account for the large number of out-of-circulation coins involve banking institutions, clearing houses, and the transmittal of data back and forth, and the related accounting procedures. These systems are all too complex and costly, especially when considering that the transaction amount could be one penny. One of the other disadvantages is the requirement for consumers to be identified by a storage card or device, further exposing them to identity theft or electronic fraud.
The use of fractional dollar value coins in a monetary system is inefficient, an unnecessary use of natural resources, detrimental to the environment, and a natural conduit for germs and diseases. Many attempts have been made to solve the coin problem but all have come up short; as evidenced by the continued use of coins having fractional dollar, or other currency, values.
A known system and method for conducting coinless transactions is described in U.S. Pat. No. 5,869,826 to Eleftheriou. The system of Eleftheriou uses a magnetic stripe data card to store a value of change with a maximum value of 0.99 of a whole dollar. The system either increases or decreases the value of the storage device depending on the fractional amount of the transaction and the current value of the storage device. The Eleftheriou method undesirably causes the merchants to experience unpredictable imbalances in their cash drawers. The amount of the imbalance will depend on the quantity and value of the coinless transactions, but is inevitable. The method of Eleftheriou also gives no consideration to the accounting of the change that is processed, and the merchant has no way of balancing their cash drawer.
There is a continuing need for a method and system that addresses the problems of the prior art by tracking a preset fee per transaction and a resettable cash balance, and setting parameters to control the direction of the credits and debits. Desirably, the method and system allows the merchant to balance their cash drawer and, barring any human error, the cash balance will exactly match the amount in the cash drawer when it is reconciled.

System for eliminating coins from cash transactions


Novel crop grain filling genes (GIF1) and the applications thereof are presented in the invention. The GIF1 genes can be applied to control grain filling, enhance crop yield or quality, or improve disease resistance or storage stability of crop grains. A method for improving crops is also presented in the invention. The GIF1 genes shows valuable potentials in controlling crop yield, quality, storage, and resistance to diseases.

Currently, investigations concerning the improvement of crop yield are mainly focused on the following aspects: 1. increasing crop sources, viz. improving crop photosynthesis; 2. elevating the sink volume; and, 3. enhancing the transport ability of photosynthate from source to sink. Among them, elevation in the sink volume and enhancement of transport ability of photosynthate from source to sink are effective breeding approaches.
Several approaches have been adopted to enhance crop yield and modify the crops. However, there still lacks effective means. With respect to rice, the major cereal crops of China, grain incomplete filling is present in many high yield varieties, especially in super hybrid rice and rice varieties with large ear and large grain, and greatly affects the improvement in the rice yield. In addition to rice, wheat and maize (Zea mays) have been grown worldwide as an important grain crops. Together, they constitute the world's major staple food crops. Grain incomplete filling also impacts wheat, maize, and other crops.
Therefore, it is desirable to search for an effective approach in the field to solve the problem of grain incomplete filling, thus further modifying the crops and enhancing the crop yield as well as crop quality.

Crop grain filling gene (GIF1) and the applications thereof

Shanghai Institutes for Biological Sciences, Chinese Academy of Sciences


A method of producing wettable fillets in electronic packages. A matrix of unsingulated lead frames is provided, each including a plurality of lead elements and a chip pad. Chips are attached to the chip pads and terminals on the chips are electrically connected to lead portions of the lead elements. The top portion of the package is encapsulated. Masking is applied to the bottom surface of the lead elements and the chip pads, but at least one of the lead elements has a portion of its surfaced remaining exposed. The exposed lead element surface is etched to create a fillet. The fillets, lead elements and bottom surface of the chip pads are plated, and the packages then singulated, producing packages with wettable flanks.

Various methods and configurations of electronic packages have been previously detailed. For instance, U.S. Pat. Nos. 7,790,500, 7,799,611, 7,129,116, 6,812,552, each entitled "Partially Patterned Lead Frames and Methods of Making and Using the Same in Semiconductor Packaging" and filed Oct. 24, 2007, Oct. 26, 2006, Aug. 10, 2004 and Apr. 29, 2002, respectively, are directed to near-chip scale packages. The disclosures of U.S. Pat. Nos. 7,790,500, 7,799,611, 7,129,116, 6,812,552 are incorporated by reference herein in their entirety.
In making electronic packages that use lead frames, there are several process steps that subject the lead frames to mechanical and thermal stresses. The finer geometries of current lead frames and the ever-increasing integration of circuits on semiconductor chips have resulted in processing that places even greater stress on the lead frames. Finely configured lead frames often resemble very delicate embroidery, or stencil-like metal structures that tend to bend, break, disfigure and deform easily. Many conventional lead frames are used in the industry to create a variety of chip packages, including wire bonded and flip-chip (FC) packages.
Conventional lead frames often lack structural rigidity. The finger-like portions of lead frames can be quite flimsy and difficult to hold in position. This leads to handling flaws, damage and distortion in assembly processes and complicated wire bonding situations. Consequently, bond parameters have to be optimized to compensate for lead frame bouncing during the bonding process. A failure to optimize the bonding parameters to compensate for the mechanical instability of the lead frame can result in poor bond adhesion, and hence poor quality and poor reliability of the bond.
The large metal plate portions of a typical lead frame extend from a central portion, known as the chip receiving area, also known as a chip-pad. The chip is usually attached to the receiving area with the backside down, and the side of the chip with electronically conductive circuit traces positioned face up with terminals located peripherally on the perimeter of the chip, or over the surface of the chip in the form of an array. The receiving area typically has dimensions of about 5 mm×5 mm, and the leads extending outwardly from the chip-pad area have typical dimensions of about 10 mm long×1 mm wide×0.2 mm thick. The lead frame is typically held down by a vacuum chuck and mechanical clamps. The chuck and clamps must be refitted for lead frames of different sizes and shapes.
Quad flat no-lead (QFN) packages, whose lead surfaces are often electronically connected to printed circuit boards via solder balls, may have these connections severed when subjected to rigorous stress in certain applications, such as in automobiles. Furthermore, inspection and verification of the quality of such connections may be difficult to verify visually and without physically stressing the connections.
The subject matter of the present disclosure is directed to overcoming, or at least reducing the effects of, one or more of the problems set forth above.


The present disclosure relates to a process for the hydrodealkylation of aromatic rich hydrocarbon streams to produce benzene, toluene and mixed xylenes (BTX), with high selectivity towards high value xylenes. The process uses catalysts containing a framework-substituted zirconium and/or titanium and/or hafnium-modified ultra-stable Y (USY) type zeolite.

Catalytic reforming is a widely used process for refining hydrocarbon mixtures, resulting in reformate, an aromatic-rich gasoline blending fraction useful for aromatics production. The reformate from a catalytic reforming unit is sent to an aromatic complex in order to recover high value products, e.g., xylenes and benzene, and to convert lower value products, e.g., toluene, into higher value products. For example, toluene is typically recovered as a separate fraction and undergoes disproportionation to produce benzene and xylenes or is hydrodealkylated to produce benzene.
The aromatic complex produces a reject stream or bottoms that is very heavy (boiling in the range 100-450° C.), containing C9+ alkylated aromatics with alkyl groups containing 3 or more carbon number. The heavy bottoms fraction is not suitable as a gasoline blending component since it deteriorates the gasoline quality and in the long run negatively impacts engine performance. Moreover, blending is becoming more difficult due to more stringent regulations on the aromatics content in gasoline.
Para-xylene is experiencing a market grown rate of demand Consequently, the conversion of heavy aromatics to p-xylene provides a valuable product stream. It is therefore desirable to utilize the heavy reformate fraction to obtain BTX rich in xylenes via dealkylation of alkylated aromatics.

Modified ultra-stable Y (USY) zeolite catalyst for dealkylation of aromatics


The invention relates to a method of determining the texture of food material, comprising the steps of applying a vibrational impact with a predetermined frequency to the food material, measuring the vibrational response of the food material to the vibrational impact, and comparing the vibratiorial response with at least one reference value, determined prior to the measurement. The food material is in a liquid or a semi-solid state and/or contained within a container body (16), such as a pipe. In a second aspect, the invention relates to an apparatus (10) for determining the texture of food material, wherein the apparatus comprises a device (12) for generating a vibrational impact, such as a piezo actuator, a device (14) for measuring vibrations, such as a vibrometer, a holding mechanism, comprising a container body (16) for containing the food material therein or a string to attach the food material thereto, and an analyser for comparing measured vibrations with at least one reference value, determined prior to the measurement.

It is known in the art to use vibration measurement techniques to determine the mass flow of a gas or a liquid. When a tube through which fluid material flows is made to oscillate in a direction perpendicular to that of the flow, Coriolis forces will act on the tube. Measurement of the tube displacement due to these forces then allows for the mass flow to be quantified. A mass flow meter based on this Coriolis principle is disclosed for example in WO 89/04463. The apparatus described therein comprises a throughflow device, such as a tube or a pipe, an exciter device and a plurality of sensor elements, arranged at different positions on the throughflow device. When there is fluid flow through the apparatus, the exciter device is used to oscillate the throughflow device and the oscillations are monitored with the sensor elements. The Coriolis forces occurring due to the material flow cause a phase shift between the oscillations at different locations on the throughflow device. The magnitude of this phase shift is determined using two sensor elements placed at different positions and provides a direct measure of the mass flow through the device. In addition, such mass flow meters may also be used to quantify the density of a fluid in flow, since the resonance frequency of the throughflow device is dependent on the mass of the flowing material. However, the above described method is limited to gaseous or liquid materials and does not offer any information on material texture.
In Applied Rheology 17, 25111-1-25111-7 (2007), the method of laser Doppler forced vibrology applied to soft agricultural products is described. In this measurement technique, a solid food product, such as a melon, is placed on a vibration generator, e.g., a vibrating table, and thus caused to oscillate. The oscillations of the product induced in this way are investigated by measuring its surface motion with a laser Doppler vibrometer. Analysis of the resonance peak frequencies yields the modulus of elasticity of the product which may be helpful to evaluate the product quality, maturity or firmness.
In Measurement Science and Technology 14 (2003) 451-462, a Theological measurement set-up comprising a tube section with a pair of magnets attached to it and a pair of coils fitted on a supporting frame is used to investigate the flow properties of liquids. The tube section containing the flowing liquid is electromagnetically driven to torsionally oscillate, using the magnet/coil pair as an actuator and the oscillatory response of the tube is subsequently picked up by the same magnet/coil pair. The phase shift between the driving signal and the response signal is measured and used to determine the resonant frequency and the damping of the liquid sample. Subsequently, the complex viscosity of the liquid is determined from these latter two parameters with the help of a theoretical model.

Method of determining the texture of food material and apparatus for use in this method


An optical connector package includes a substrate and a casing positioned on the substrate and comprising a positioning pin. The casing and the substrate cooperatively define a receiving space. The positioning pin defines a vent functioning as a sole channel communicating the receiving space with the outside of the casing. The vent is sealed after the optical connector package subjects to all required heating processes.

1. Technical Field
The present disclosure relates to optical connectors and, particularly, to an optical connector package and an optical connector.
2. Description of Related Art
Optical connectors include an optical connector package and an outer casing. The optical connector package includes a substrate, a laser diode, a photo detector, and a casing. The laser diode and the photo detector are positioned on and electrically connected to the substrate. The casing includes a top plate and a sidewall extending downward from a periphery of the top plate. The top plate forms two lenses and the sidewall forms two positioning pins. The casing is positioned on the substrate. The laser diode and the photo detector are packaged and thus protected in a sealed space formed between the substrate, the sidewall, and the top plate, and align with the respective lenses for emitting and receiving light via the respective lenses. The positioning pins engage with the outer casing and thus position the optical connector package in the outer casing. However, in assembling, the optical connector may subject to a heating process and thus a pressure in the sealed space may increase past an endurable range of the laser diode and/or the photo detector and may damage the laser diode and/or the photo detector.
Therefore, it is desirable to provide an optical connector package and an optical connector, which can overcome the above-mentioned shortcomings.

Optical connector package and optical connector


Embodiments relate to integrated sensor and magnetic concentrator devices and methods. In one embodiment, an integrated sensor and magnetic field concentrator device comprises a sensor device comprising at least two xMR sensor elements spaced apart from each other on a surface of a die to define a first gap of about 5 millimeters (mm) or less; and a magnetic field concentrator disposed in the first gap and configured to guide magnetic flux from an external source in a direction perpendicular to the at least two xMR sensor elements.

To detect the speed and direction of a rotating wheel or other object, it is common practice to attach a magnetically polarized ring to the wheel and position a magnetic field sensor nearby. As the alternating magnetic poles (north, south, north, south, etc.) pass by during rotation, the field sensor detects and converts the pole-sequence into a pulsed output voltage. The rotational speed of the wheel can then be derived by counting the pulses per second.
In order to obtain fine resolution, many poles on the ring are desired. Unfortunately, the magnetic field of the poles does not extend far beyond the ring itself; in fact, it decreases exponentially with the distance from the ring. The field typically disappears almost entirely at a distance that is about two to three pole-pitches away from the ring, where the pole-pitch is the distance between the centers of two adjacent poles on the ring.
Because of assembly tolerances, the distance between the field sensor and the pole-ring may vary. Thus, there is a need for a magnetic field sensor system that is compatible with both small (e.g., about 0.5 mm) and large distances (e.g., up to about several millimeters), in other words a magnetic field sensor that is sensitive to small magnetic fields.

This patent is subject to a terminal disclaimer.

Integrated sensor and magnetic field concentrator devices


Packaging for retaining an article to be personalized in a predetermined position relative to the packaging may include a first container defining an interior cavity and an insert designed to retain the article in a predetermined position and orientation relative to the insert. The insert may be positioned within the interior cavity so that the article retained by the insert is within the interior cavity. At least one of the first container may define an opening designed to provide access to a personalization system for personalizing a predetermined surface of the article while the article is retained by the insert and the insert and article are positioned within the interior cavity so that the predetermined surface can be personalized based on the position of the first container relative to the personalization system.

Personalization of garments and accessories is becoming more popular through various personalization systems, including, but not limited to, embroidery systems, direct to garment (DTG) printing systems, engraving systems, laser etching/cutting systems, robotic pen marking and sticker/decal application systems. Personalization of articles is currently a labor-intensive process that requires precision positioning and orienting of articles relative to a personalization system. Due to different shapes and sizes of articles, personalization of multiple articles may require each article to be positioned and oriented differently when being loaded onto a personalization system, otherwise the location of the personalization may be performed on the desired surface.
Accordingly, there is a need for a means for articles to be personalized while reducing or eliminating the skill labor and time required to load a personalization system in order for the personalization to be performed precisely on the desired surface.

Packaging for retaining articles to be personalized


A non-transitory computer-readable storage medium stores a process for causing a computer to execute a method including the steps of acquiring optical transfer function information corresponding to an image pickup condition of a picked-up image (S102), generating a restoration image using correction optical transfer function information that is obtained by correcting the optical transfer function information using a correction value (S106-S108), and setting a settable range of the correction value based on an inverse characteristic of the optical transfer function information (S103, S104).

1. Field of the Invention
The present invention relates to an image processing of a picked-up image, and, in particular, relates to a technology that corrects a deterioration of the picked-up image due to an image pickup optical system with high accuracy.
2. Description of the Related Art
An object captured by an image pickup optical system has a minute extension because light generated from one point cannot be concentrated and has a minute extension, due to the influence of diffraction, aberration or the like, which are caused in the image pickup optical system. Such a distribution with minute extension is referred to as "PSF" (Point Spread Function). The picked-up image is formed as PSF is convoluted with an image because of the influence of the image pickup optical system, and the image blurs and the resolution is deteriorated.
Recently, it has become more common to hold the picked-up image as electronic data, and a technology to correct image deterioration due to an optical system by an image processing is well-known. Hereinafter, such image deterioration correction technology is referred to as "image restoration", and a traditional and general method will be described.
When, on a real space (x, y), an image before the deterioration due to the optical system is represented as f(x, y), PSF is represented as h(x, y), and a deteriorated image is represented as g(x, y), these can be described by the following expressions (1).g(x, y)=∫∫f(X, Y)*h(x−X, y−Y)dXdY  (1)
When the above expression (1) is converted from the real space (x, y) into a frequency space (u, v) by performing a Fourier transformation to the above expression (1), it can be described as the following expression (2).G(u, v)=F(u, v)*H(u, v)  (2)
F(u, v) denotes a Fourier transform of f(x, y), G(u, v) denotes a Fourier transform of g(x, y), and H(u, v) denotes a Fourier transform of h(x, y).
Further, when the above expression (2) is transformed, the following expression (3) is derived.F(u, v)=G(u, v)/H(u, v)  (3)
This denotes that F(u, V), which is a Fourier transform of f(x, y) being the image before the deterioration, can be obtained by dividing G(u, v), which is a Fourier transform of g(x, y) being the deteriorated image, by H(u, v), which is a Fourier transform of h(x, y) being the PSF. Accordingly, if an inverse Fourier transformation is performed on F(u, v), f(x, y) being the image before the deterioration can be obtained.
However, when such a processing is actually performed to obtain the image before the deterioration, a noise that may be caused by an image pickup element is greatly amplified and a good image cannot be obtained. In this case, it is known to use a Wiener filter which is represented as the following expression (4), as an image restoration method for suppressing the amplification of the noise. H(u, v) denotes OTF (Optical Transfer Function), and Γ denotes a constant for reducing the amplified amount of the noise.W(u, v)=1/H(u, v)*|H(u, v)|2/(|H(u, v)|2+Γ)  (4)
When the above expression (4) is multiplied to the Fourier transform G(u, v) of the deteriorated image g(x, y), a good image can be obtained with high resolution by setting to 0 a phase component of a PSF generated by the diffraction or the aberration of the optical system and by amplifying a frequency characteristic of an amplitude component. Therefore, when frequency space information of an image restored by an image restoration processing using the Wiener filter is defined as R(u, v), the following expression is obtained.R(u, v)=G(u, v)*W(u, v)  (5)
As a result, a relationship of |W(u, v)|≦1/|H(u, v)| can be derived from the expression (4). In other words, the maximum value of the frequency characteristic that is amplifiable using the image restoration filter is 1/|H(u, v)|, and it equals to an inverse of an absolute value of OTF, that is to say, a characteristic of an inverse filter.
For example, when, for an image picked-up by a general camera or the like, the image restoration processing is performed by a processing using the Wiener filter of the expression (4), a correction value of the restoration processing can be controlled from 0 to 1/|H(u, v)| by controlling the value of Γ in the expression. Moreover, even if the Wiener filter is variously changed, the correction value of the restoration processing can be controlled with a range from 0 to 1/|H(u, v)|. In this embodiment, the range from 0 to 1/|H(u, v)| is defined as a correctable range (hereinafter also referred to as "settable range").
When a computer where an image processing apparatus, an image pickup apparatus, or software is installed performs the processing using a correction value set by an instruction of a user, it is preferred to select or change a correction value according to a desired restoration level.
For example, Japanese Patent No. 3840032 discloses an invention that changes a range of a correction level of a correction value, such an edge emphasis, in a field of an image processing or the like. Moreover, Japanese Patent Laid-Open No. 2011-22868 discloses an invention that detects a restoration limit based on an image and a frequency characteristic of an image output device and performs an image restoration processing.
However, the prior arts disclosed in Japanese Patent No. 3840032 and Japanese Patent Laid-Open No. 2011-22868 do not describe a method for determining a concrete range of a level of the correction value in a system capable of combining various conditions. An image restoration processing used in digital cameras is greatly different from a general edge emphasis processing or a sharpness processing, and changes a correctable range with each combination of image pickup conditions, such an identification information of an image pickup optical system, a focal length, an F-number, an image pickup distance, an image height, and an pixel size of an image pickup element. Even if the image restoration processing is performed using a correction value beyond the correctable range, the user cannot experience the restoration effect.
Further, in another problem, when the correctable range is displayed on a display part, the maximum value of the correctable range when the restoration effect can be obtained is not displayed so that the user can recognize it, and therefore it is inconvenient when the correction value of the restoration processing is determined.

Image processing program, image processing method, image processing apparatus, and image pickup apparatus


A circulating magazine including a housing (1) in which mutually articulated parallel ammunition containers (5;5') are disposed so as to accommodate ammunition (6,6') in an endless, two-layer transporting belt (4) driven by a drive (13;13'). To realize a quasi three-layer arrangement, guides (11,12; 11',12') for the ammunition containers (5;5') are provided in oppositely disposed container walls (2,3; 2',3') such that the ammunition containers (5,5') of one of the two layers are folded in an essentially zigzag nested arrangement.

The present invention relates to a circulating ammunition magazine including a housing in which parallel arranged ammunition containers for accommodating ammunition are provided and are articulated together to form a rotatingly driven endless, two-layer transporting belt.
Such a circulating magazine is disclosed for example in Federal Republic of Germany Laid-Open patent application DE-OS 3,825,282 corresponding to U.S. Pat. No. 4,939,980. In this magazine, a plurality of ammunition containers are combined into a two-layer transporting belt. With a view toward the available space, there often remains unused space in such an arrangement which, however, is usually insufficient for a further two-layer rotating belt.
Federal Republic of Germany Laid-Open patent application DE-OS 3,936,469 corresponding to U.S. Pat. No. 4,873,911 discloses a circulating magazine in which tubular ammunition containers in two separate adjacent layers are arranged in an essentially zigzag offset so that the total height taken up by the ammunition containers is correspondingly less than four times the diameter of the container. This is accomplished by arranging the ammunition containers in the form of an inner continuous transporting belt and an outer continuous transporting belt, with the outer belt simultaneously serving to drive the inner belt. However, an essentially three-layer magazine cannot be realized in this manner.


An axle disconnect apparatus having a cam cylinder including a ramp disposed in a radially outer surface thereof. A first clutch element disposed at least partially inside the cam cylinder and an intermediate shaft disposed at least partially within the first clutch element. The intermediate shaft includes a splined portion in constant mesh with the first clutch element. A half shaft may be disposed coaxially with the intermediate shaft, and a second clutch element may be coupled with the half shaft. The first clutch element selectively engages the second clutch element. The axle disconnect apparatus further comprises a latching mechanism whereby the cam cylinder maintains an axial position. The latching mechanism including a radial depression in the cam cylinder ramp, and a cam follower selectively disposed at least partially in the radial depression.

The present disclosure relates to a vehicle driveline; particularly to a driveline rapid disconnect apparatus. In an all-wheel drive ("AWD") vehicle, a primary wheel-set may be continually connected to the vehicle's power source while a secondary wheel-set is selectively connected to the vehicle's power source via a disconnect apparatus.
Traditionally, an AWD vehicle was disadvantaged by lower fuel efficiency, as compared to two-wheel-drive vehicles. Even when the secondary wheel-set was not drivingly engaged with the power source, traditional drivelines required continuous rotation of a secondary drive axle at road speed. Consequently, traditional AWD vehicles would lose energy and experience decreased fuel efficiency as compared to vehicles having only a single drive axle.
Typical disconnect apparatuses are utilized to disconnect many of the driveline components of the secondary wheel-set, thereby improving the fuel efficiency of the AWD vehicle. However, typical driveline apparatuses are deficient in their ability to rapidly connect and disconnect the driveline components of the secondary wheel-set.
The disclosure herein describes an apparatus and system that efficiently connects and disconnects the components of a secondary driveline.

Bi-stable latching mechanism and the driveline rapid disconnect apparatus made therewith


A device for adjusting two parts (2, 3) relative to one another, other than for a displacing device which is provided displacing a camshaft. The adjusting device is smooth and easy to operate, is self-locking, and ensures a backlash-free, continuous displacement of the two parts with a high degree of efficiency. The device includes a first part (2) having webs (2.3, 22.3) which are spaced apart in the circumferential direction and between which chambers (2.4) are provided, a second part (3) having an internal toothing (3.2, 13.2), and several teeth (7, 27) that are disposed at a distance from each other in the circumferential direction within the chambers and have an inner contact area (7.4) for resting against an eccentric drive member (6) as well as an outer contact area (7.5) for engagement with the internal toothing (3.2, 13.2). Rotary movements can be performed by the teeth (7, 27) located within the chambers (2.4) about axes of rotation that extend parallel to the axis of rotation (A) of the parts (2, 3) when an input shaft is rotated.

The invention relates to an adjusting device for adjusting two components. Such adjusting devices are amongst other things used for adjusting of round parts and as reduction gear unit.
Amongst other things, stepper motors, which enable self-locking and an exact, but merely discrete, i.e. non-continuous adjustment, can be used as adjusting devices. Furthermore, for achieving self-locking and a high gear reduction, a worm gear pair can be used. However, for a relatively large amount of friction, worm gear pairs exhibit low efficiency and require materials that are resistant to wear and heat.
DE 195 08 328 A1 presents a self-locking adjusting device for rotating two bracing parts relative to each other. One of the two bracing parts comprises internal gearing, into which locking bars or teeth can be inserted in a straight-line radial direction. The teeth are guided in chambers between webs of the other bracing part, such that the radially inwards and outwards movement is precisely enabled. The teeth are supported inwards on a control surface, which is formed as an outer surface of an egg-shaped control element. When the control element rotates, the teeth are thus periodically pushed outwards in the radial direction, wherein a few of the teeth engage in the teeth gaps. The outer end sections of the teeth and the recesses or teeth gaps of the internal gearing taper outwards, so that the teeth transfer torque between the webs of the second bracing part and the internal gearing of the first bracing part for eccentric insertion into a recess.
However, a disadvantage in this adjusting device is first that only partial self-locking is achieved. When torque acts upon the bracing part with internal gearing, only the one or two teeth, which are pressed against the eccentric region of the control element by the teeth of the internal gearing, contribute to the self-locking effect, depending on he engagement situation of the teeth. The opposing teeth likewise contribute minimally to the self-locking, like those teeth, which are in the radially outer position, i.e., positive-fit in the recess, and those teeth, which are in the radially inner position, i.e., not engaged in the teeth gaps of the internal gearing. However, the possibly only one tooth, which is to contribute to the self-locking effect, can transfer a force not directed towards the rotational axis from the internal gearing to the control element between the point of application of the internal gearing at its outer contact surface and its inner contact surface contacting the control element, which thus leads to transmission of torque. In this way, especially for the use of only a few teeth, no positive-fit connection between the internal gearing and the webs and thus, at least for an unfavorable engagement situation of the teeth, also no complete self-locking can be achieved.
Furthermore, a play-free configuration of such an adjusting device is problematic. The teeth that can move linearly in the radial direction slide with their side surfaces on the side surfaces of the webs of the second bracing part. However, a play-free arrangement of the teeth between the webs is practically impossible; for achieving a low-friction guidance of the teeth between the webs, a certain overdimension is necessary. Finally, due to the manufacturing-specific tolerances, play between the control surface and the tooth remains even in the positive-fit engagement of a tooth in its radially outer position in a recess of the internal gearing.


A firearm holder of improved efficiency and design. The apparatus includes first and second movable gun support members. Each gun support member includes a lower end and an upper end. The upper ends of both members are spaced from each other to define a gun receiving zone therebetween. Positioned within the gun receiving zone and suspended between the first and second support members is a medial support member. Also included in an adjusting strap made of non-abrasive material designed to vary the distance between the first and second support members. In a preferred embodiment, the strap has a length sufficient to completely cover the first, second, and medial support members. In addition, the strap includes a free end which is slidably adjustable.

The present invention generally relates to firearm accessories, and more particularly to a firearm holder of improved efficiency and design.
Recreational and professional firearm users frequently experience fatigue after carrying their weapons for extended periods of time. For example, a high level of fatigue is encountered by hunters who often remain in a fixed position holding their weapons for long time intervals. This fatigue translates into back, shoulder, and neck pain. In addition, the level of fatigue is substantially increased when large and heavy guns (e.g. high powered rifles) are used. To eliminate this problem, the gun user must either put down his weapon at frequent intervals or attempt to endure the fatigue. Neither of these alternatives are acceptable for most gun users.
Accordingly, a need exists for an apparatus designed to relieve firearm users of fatigue and strain as described above. The present invention satisfies this need in a new and unique manner.


A method for locating a microseismic event in a subsurface formation, in some embodiments, comprises: receiving a microseismic signal at a detector; obtaining a velocity model representative of the subsurface formation, the velocity model comprising multiple velocity layers; estimating, for each of the multiple velocity layers in the subsurface formation, a microseismic event location and a microseismic event origin time; and selecting one of the estimated locations and times using a parameter of the microseismic signal received at the detector.

A technique known as "fracturing," or "fracking," is often used to increase the permeability of shale or other low-permeability formations so that hydrocarbons may be more easily extracted from the formation. Fracking typically involves perforating the casing of a wellbore (e.g., using a perforation gun) and injecting water or other fluid into the formation at very high pressures, thereby opening existing fractures and creating new ones in the formation. The fractures initially form in the general vicinity of the perforations and propagate outwardly from the well. The directional tendency of such fracture propagation can often be predicted based on an analysis of the composition and stress fields in the formation, yet the precise placement and extent of the resulting fractures remains unpredictable. Techniques that are commonly used to model or estimate the precise locations of fractures are computationally intensive and thus tedious and time-consuming. In some cases, they are inaccurate and, therefore, unreliable as a means for evaluating the effectiveness of the fracking job or tracking any kind of microseismic activity.

Layered linear inversion techniques for locating microseismic activity


A base connector includes an insulating base housing and a plurality of base contacts retained by the base housing. An anterior wall of the base housing includes a central convex portion which is formed at the center portion in a left-and-right direction of the anterior face of the anterior wall and projects forward, and a pair of concave portions formed on both sides sandwiching the central convex portion therebetween. At least a part of the upper face on the anterior wall including the upper face of the central convex portion is formed as a flat face. The upper face of the anterior wall is provided with a wide portion including the upper face of the central convex portion and being relatively wide in the front-and-rear direction, and a pair of narrow portions relatively narrow in the front-and-rear direction corresponding in position to the pair of concave portions. The wide portion is provided with a flat adsorbed face, which can be adsorbed by an adsorption member.

1. Field of the Invention
The present invention relates to a base connector, a socket connector, and a complex type connector.
2. Description of Related Arts
An electric connector, which electrically connects a circuit board and electronic or electrical equipment, includes that having a first connector fixed to the surface of the circuit board and a second connector provided on a lead wire extending from electronic or electrical equipment and also inserted into the first connector (for example, refer to Document 1).                Document 1: Japanese Unexamined Patent Publication No. 2005-26156 (published on Jan. 27, 2005)
The first connector includes a so-called side-type connector in which, as described in the above Document 1, an outlet is opened in a direction parallel to the surface of the circuit board, and a so-called top-type connector in which the outlet is opened so as to face above the circuit board.
There is a case where an adsorption nozzle is used for mounting the first connector on the circuit board. Specifically, the adsorption nozzle first adsorbs the upper face of the first connector. Then, in this state, the first connector is pulled out of a package box. Further, the first connector thus pulled out is carried to a predetermined arrangement place on the circuit board, and the adsorption nozzle is separated from the first connector in a state that the first connector is disposed at the predetermined arrangement place.
However, where the first connector is a top-type connector, a outlet is opened on the upper face of the first connector. As a result, the upper face is smaller in area, thereby making it difficult to secure a sufficient area for adsorption.
Therefore, it is conceived that a tape is attached to the entire upper face of the first connector in advance to adsorb the first connector while a sufficient area is secured for adsorption. However, in this case, troublesome work is required to attach the tape to the first connector and to remove it after mounting of the first connector on the circuit board. Further, the tape becomes waste.
The present invention has been made taking the above-described circumstances into account. The object of the present invention is to provide a base connector, a socket connector and a complex type connector which are capable of reducing the time and effort for mounting them on a circuit board and also decreasing waste, while securing a sufficient adsorption power by use of adsorption members.

Base connector, socket connector and complex type connector


A backlight assembly includes; a plurality of light source strings which receive a driving voltage to generate a light, a driving circuit including a channel terminal commonly connected to output terminals of the plurality of light source strings and which receives a feedback voltage through the channel terminal to control the driving voltage according to the feedback voltage, and a current detection circuit connected to the output terminals of the plurality of light source strings to receive currents from the plurality of light source strings and which turns off the driving circuit when at least one of the received currents is larger than a predetermined reference current.

1. Field of the Invention
The present invention relates to a backlight assembly capable of detecting an error caused by a current deviation between light source strings contained therein, and a display apparatus including the backlight assembly.
2. Description of the Related Art
A liquid crystal display ("LCD") includes a non-emissive LCD panel for displaying an image and a backlight assembly arranged under the LCD panel to supply light to the LCD panel. In general, the backlight assembly typically employs a cold cathode fluorescent lamp ("CCFL") as its light source. However, the CCFL may have drawbacks such as the use of a high voltage start-up voltage, a limited color reproducibility and the use of mercury (Hg) in its manufacturing.
However, an environmentally-friendly light emitting diode ("LED") that has low power consumption and superior color reproducibility is spotlighted as a light source for a next-generation backlight assembly due to high energy prices and a recognition of the value of energy conservation.
When the LED is employed as a light source for a backlight assembly, the backlight assembly typically includes a plurality of light emitting groups connected to each other in parallel, and each group includes a plurality of LEDs connected to each other in series.

Backlight assembly having current detection circuit and display apparatus having the same


A projection system comprises a light source module and a light-guiding assembly. The light source module comprises a reflecting cover and a light source disposed in the reflecting cover to form a first beam with a first f-number. The light-guiding assembly comprises a body with an incident end and a lens disposed on the incident end. The first beam passes through the lens disposed on the incident end to form a second beam with a second f-number. The second f-number of the second beam is different from the first f-number of the first beam.

The invention relates to a projection system and a light-guiding assembly thereof, and in particular to a projection system and a light-guiding assembly having a lens capable of decreasing light leakage and increasing the contrast of a projected image.
F-number
  (            f      /      #        ≡          f      D        )represents the ability of light from an optical element to converge, i.e., the ratio of focus length (f) and diameter of incident pupil (D). In the formula of
      θ    ≅                  Sin                  -          1                                  1                  2                    F                      ,a convergent angle is in proportion to f-number. That is to say, the smaller of the convergent angle, the more light beam can converge and the slower the light path.
FIG. 1 is a schematic view of a conventional Digital Light Processing (DLP) system. A light beam 100a generated from a light source 10a is guided and output by a light pipe 12a. The light beam 100a, before entering the light pipe 12a and exiting therefrom, maintains the same f-number. The output light beam 100a is sequentially projected from a projecting lens 14a to a reflecting lens 16a, reflected from the reflecting lens 16a to a power mirror 18a, reflected from the power mirror 18a to a light valve 20a (e.g. Digital Micro-mirror Device, DMD). Finally, an image reflected from light valve 20a the light valve 20a can be projected to a screen by a projecting lens 22a.
The light valve 20a, a main device for the DMD projection system, comprises a ceramic substrate 19, a DMD chip 21 formed by a plurality of micromirrors, an aperture 22 and a window assembly 23. The window assembly 23 disposed on the ceramic substrate 19 is used to isolate the ceramic substrate 19, and the aperture 22 is disposed between the ceramic substrate 19 and the window assembly 23.
FIG. 4A is a schematic view showing distribution of light path of the conventional projection system of FIG. 1. The light beam is transmitted to the light valve 20a and reflected by the projecting lens 22a. A projected area by the light beam reflected from the projecting lens 22a is larger than the area of the DMD chip 21 if the reflected light beam is divergent. Scattered light formed by a light reflected by the window assembly 23, the aperture 22 and the ceramic substrate 19 enter the light processing system, cause light leakage and decrease the contrast of the projected image.
To adjust the contrast of the projection system, the number of lens assemblies must be added in the DLP system. However, the layout of the DLP system becomes complicated and the size of the DLP system must be increased.

Projection system and light-guiding assembly thereof


According to some embodiments, a system is provided for simulating a cluster of reflections. The system includes an array of antenna elements distributed in space over a solid angle having an angular spread. The solid angle is substantially less than a full sphere and each antenna element has a spatial orientation. The system also includes a variable path simulator connected to the antenna elements and configured to apply one of excitations to the antenna elements and weights to signals from the antenna elements. The variable path simulator enables simulation of a near field arising from a cluster of reflections of a multipath environment.

The advent of wireless technologies such as LTE and 802.11n, which take advantage of the multipath nature of radio propagation in the real world, have led to the development of test methods for evaluating the radiated performance of these devices in a controlled simulated environment. Current embodiments of these test systems generally evaluate the performance in a statistically uniform, highly multipath environment (reverberation chamber) or in a uniform azimuthal boundary array capable of simulating a wide variety of environments through the application of an appropriate channel model, where the device is rotated through the simulated environment to determine average performance. While the latter boundary array method can generally be expanded to provide full spherical environment simulation, the implementations are generally cost prohibitive. In addition, both methods generally provide average performance metrics without significant detail on the orientation specific impact of the device performance.

Methods and apparatus for evaluating radiated performance of MIMO wireless devices in three dimensions


A semiconductor processing system, such as a system for buffing or scrubbing both sides of a wafer at the same time, that includes a processing box for use with chemical solutions, a positioning device to position a semiconductor substrate, or other similar semiconductor material or device, and a placement device to place a buffing pad or scrubbing brush.

Chemical mechanical polishing (CMP) in the semiconductor industry is typically used to planarize the surface of a dielectric film or to remove excess metal film deposited on a substrate or previous film. To perform planarization, a relatively hard pad material is used such as polyurethane with special filler material. To provide global (within wafer) planarization, a softer under layer is generally used. The effectiveness of a planarization process strongly depends on the hardness of the polishing pad which removes the high spots of a dielectric film in the presence of a polishing slurry. Therefore, since the planarization is a primary objective for performing CMP, hard pads are generally used. This planarization step is referred to as the primary or first polishing step.
Unfortunately, a hard polishing pad is not favorable for achieving low defects on the polished surface. Therefore, a second platen (polishing table) is used with a softer polishing pad either to polish off small amount of material after the primary polishing step or to simply "clean" the surface of the wafer prior to the cleaning system. This "cleaning" step on the separate polishing table uses DI water and is often called buffing. The separate polishing table on the polishing machine adds complexity, reduces throughput and increases the footprint of the polishing tool. It is desirable to perform all wafer cleaning operations outside the polisher to avoid these disadvantages.
Regular wafer scrubbing systems can successfully remove loose slurry particles from the surface of the wafer and some scrubbing systems can remove metallic contamination from the wafer surface. Regular scrubbers are not effective in removing small slurry particles that are often embedded into the film. Normally buffing on the soft polishing pad removes the majority of such defects leaving the polished surface sufficiently clean and prepared for scrubbing.
It is therefore desirable to enhance scrubber performance and clean wafers after the primary CMP step to provide the same defect level as the two step CMIP process, specifically: primary polishing step plus the buffing step.
The prior art wafer scrubbing systems have not been adapted for buffing operation because the pressure and speed of the buffing media was significantly lower than it is required for buffing. Some of the scrubbing systems do not lend themselves to perform buffing because the wafer is being held by the edge and inducing the typical for buffing pressure may break the wafer.
The present invention provides an improved wafer cleaning system specifically designed to perform a buffing operation. The system allows wafers to be processed with a scrubber with significantly increased pressures and speeds broadening the range of applications. The apparatus also allows control and change of processing parameters to perform buffing or regular scrubbing in the same or separate stations when applying suitable chemicals.

Cleaning/buffer apparatus for use in a wafer processing device


Embodiments of this application provide a data processing method and apparatus. The method includes: parsing, by a user plane data processing network element, a received packet and determining first service type information of a data flow to which the packet belongs; obtaining, by the user plane data processing network element, second service type information of the data flow from a data analysis network element; and processing, by the user plane data processing network element, the data flow based on the first service type information and the second service type information. With the data processing method and apparatus disclosed herein, accuracy in identifying a service type of transmitted data can be improved.

In a communications network, a core network element obtains, from a terminal device or a data network, a service type of transmitted data, to implement differentiated processing on the transmitted data. For example, processing priorities of transmitted data of different service types are different. However, the terminal device or the data network may be attacked maliciously, and consequently, a service type obtained by the core network element is inaccurate. Waste of network resources may be further caused. For example, the network resources are wasted because the network resources cannot be allocated based on a correct priority of the transmitted data.


Methods and apparatus for centralized management of policies and access controls which provide for the storing and managing of business rules and elements of policy, and for implementing the rules and policy across heterogeneous business systems. Where rules and policies may conflict in certain cases, mechanisms for reconciling such conflicts may be provided.

1. Field of the Invention
The present invention relates to the field of risk management.
2. Prior Art
Many computer applications provide methods for controlling Access to Resources based on the identity of the account being used to perform said Access. Applications may also provide varying levels of Access (e.g. the ability to change data and/or others Access rights, view-only permissions, the ability to perform certain operations as well as the ability to completely deny Access). Applications typically provide mechanisms to set Access Controls.

Systems and methods for centralized management of policies and access controls


A method for producing a field-effect semiconductor device includes providing a semiconductor body with a first surface defining a vertical direction, defining an active area, forming a vertical trench from the first surface into the semiconductor body, forming a field dielectric layer at least on a side wall and a bottom wall of the vertical trench, depositing a conductive layer on the field dielectric layer, forming a closed cavity on the conductive layer in the vertical trench, and forming an insulated gate electrode on the closed cavity in the vertical trench.

Semiconductor transistors, in particular field-effect controlled switching devices such as a Metal Oxide Semiconductor Field-effect Transistor (MOSFET) or an Insulated Gate Bipolar Transistor (IGBT) have been used for various applications including but not limited to use as switches in power supplies and power converters, electric cars, air-conditioners, and even stereo systems. Particularly with regard to power devices capable of switching large currents and/or operating at higher voltages, low on-state resistance, which is in the following also referred to as on-resistance Ron, and high voltage blocking capability are often desired. Due to structural efficiency and low on-resistance Ron, vertical trench MOSFETs are widely used, in particular in power applications. The breakdown voltage of trench MOSFETs may be raised by optimizing the shape and depth of the trench and in particular by arranging an insulated field electrode in the vertical trench below the insulated gate electrode of the trench MOSFET. The field electrode is typically connected to source potential and insulated from drain potential by a field oxide. Accordingly, charges in the drift region between two neighboring vertical trenches are at least partially compensated and thus the blocking capability improved. Typically, the blocking capability of such a MOSFET increases with the vertical extension of the trench and the thickness of the field oxide. However, internal mechanical stress resulting from tensions at the corresponding semiconductor-insulator interfaces typically also increases with the vertical extension of the trench and the field oxide thickness, respectively. This may result in a bowing of the semiconductor substrate of the MOSFET, in particular during manufacturing on wafer level.
Another configuration of a vertical trench MOSFET is the so-called TEDFET (Trench Extended Drain Field-Effect Transistor) which allows for an improved decoupling of voltage blocking capability and on-resistance Ron compared to conventional MOSFETs by controlling the conductivity in the drift region by a drift control region which is separated from the drift region by an accumulation dielectric vertically extending along the drift region. Power TEDFETS of higher blocking capability utilize an accumulation dielectric that extends deeply into the semiconductor material and may result in mechanical stress levels that may have an impact on manufacturing.
To reduce wafer bowing during device manufacturing, the thickness of the wafer may be increased, for example by providing an additional epitaxial layer below the vertical trench. However, this increases costs and may increase on-resistance Ron. Alternatively, or in addition, pre-stressed layers may be applied on the back-side of the wafer during device manufacturing. However, this also increases costs. Furthermore, different compressive and tensile layers may be required during different process steps to compensate the bowing. Even further, compensating the wafer bowing typically increases mechanical stress in the wafer. Accordingly, risk of forming crystal defects during epitaxial processes increases. This may even have an impact on the device performance.
Accordingly, there is a need to provide mechanical stress reduced vertical MOSFETs and related manufacturing methods.

Method for forming a stress-reduced field-effect semiconductor device


The invention relates to compounds of formula (I) or (II), which are of interest especially for inhibition of polymerization of amyloid β peptide, as model substances for synthesis of amyloid β peptide-ligands, as tools for the identification of other organic compounds with similar functional properties and/or as ligands for detection of amyloid deposits using e.g., positron emission tomography (PET). Formula (II) is: R1-A′-Y′-Leu-X′-Z′-B′-R2 in which X′ means any group or amino acid imparting to the compound according to formula (I) the ability to bind to the KLVFF-sequence in amyloid β peptide, or two amino acids imparting the same ability, but with the proviso that one is not proline; Y′ means any amino acid; Z′ means any non-acidic amino acid; A′ means a direct bond or an α-amino acid bonded at the carboxyl terminal of the α-carboxy group or a di-, tri-, tetra- or pentapeptide bonded at the carboxyl terminal of the α-carboxy group; B′ means a direct bond or an α-amino acid bonded at the α-nitrogen or a di-, tri, tetra- or pentapeptide bonded at the α-nitrogen of the N-terminal α-amino acid; R1 is H or —CO—R3 bonded at the α-amino group of A′; R2 is H, —OR4 or NR5R6, all bonded to the α-carboxyl group of the α-carboxyterminal of B′; R3 and R4 are straight or branched carbon chain of 1-4 carbon atoms; R5 and R6 are independently H, alkyl, cycloalyl, aryl or substituted aryl or together are —(CH2)n— where n is 4-5; and R1 and R2 together can form a hydrocarbon ring or heterocyclic ring; all α-amino acids being either D- or L-isomers.

Amyloidosis is a condition which is characterized by the deposition of amyloid in organs or tissues of the human or animal body, either as a primary disease of unknown cause or secondary to chronic disease, such as tuberculosis or osteomyelitis. In addition, it has also been found that the pre-eminent neuropathological feature of Alzheimer's disease (AD), a chronic condition of brain atrophy, is the deposition of amyloid in the brain parenchyma and cerebrovasculature (D. J. Selkoe, Neuron 6, 487-498 (1991); D. J. Selkoe, Annu. Rev. Cell Biol. 10, 373-403 (1994)).
The basic component of such amyloid is a peptide termed amyloid β, or Aβ (G. C. Glenner, C. W. Wong, Biochem, Biophys. Res. Commun. 120, 885-890 (1984)). It is a 40 to 42 amino acids long proteolytic fragment of the Alzheimer amyloid precursor protein (APP), a protein expressed in most tissues (J. Kang, et al., Nature 325, 733-736 (1987)). Genetic and neuropathological studies provide strong evidence for a central role of Aβ in the pathogenesis of AD, but the pathophysiological consequences of the amyloid deposition are still unclear. However, it has been suggested that Aβ polymers and amyloid are toxic to neurons, either directly or indirectly, and hence cause neurodegeneration (C. Behl, J. B. Davis, R. Lesley, D. Schubert, Cell 77, 817-827 (1994); D. T. Loo, et al., ibid 90, 7951-7955 (1995)).
The amyloid associated with Alzheimer's disease (AD) consists of thin fibrils of polymerized Aβ. A rational pharmacological approach for the prevention of amyloidogenesis would therefore be to use drugs that specifically interfere with Aβ-Aβ interaction and polymerization. Previous studies showed that Aβ polymerization in vivo and in vitro is a highly specific process, which probably involves an interaction between binding sequences in the Aβ peptide (J. Näslund, et al., Proc. Natl. Acad. Sci. USA 91, 8378-8382 (1994); J. Näslund, et al., Biochem. Biophys. Res. Commun. 204, 790-787 (1994)).
Wood et al (S. J. Wood, R. Wetzel, J. D. Martin, M. R. Hurle, Biochemistry 34, 724-730 (1995)) suggest that amino acid residues within or close to Aβ-16-20 are important for the adoption of the correct β-pleated sheet structure of Aβ and show that amino acids 17-23 in the amyloid β peptide (Aβ) are essential for fibril formation and probably make up the β-sheet core of the fibrils. In addition, Wood et al. have investigated the ability of their peptides to form amyloid fibrils in a solution containing solely the mutated or the wild-type peptide. However, no method or principle which makes it possible to inhibit Aβ of wild type from forming amyloid fibrils is devised and no use of the peptides as medicaments is suggested.
WO 95/08999 relates to amelioration of amnesia in Alzheimer's disease caused by deposition of amyloid β protein. Three peptides are disclosed, which overcome the amnestic effects of β-12-28, a peptide homologous to Aβ. In addition, WO 95/08999 describes the screening of several other peptides, which were neither significantly amnestic nor memory enhancing, of which one is KLVFF, SEQ. NO. 15 of the sequence listing therein.
In EP 0 584 452, novel amyloid precursor proteins and the sequences thereof are disclosed. Peptide sequences that comprise KLVFF are revealed, However, neither binding to amyloid β peptide nor any inhibition of the polymerization thereof is suggested.

Peptide binding the KLVFF-sequence of amyloid-β


In one aspect, a headset may include at least one processor, at least two electrodes accessible to the at least one processor, an inertial measurement unit (IMU) accessible to the at least one processor, and storage accessible to the at least one processor. The storage may include instructions executable by the at least one processor to receive input from the at least two electrodes, receive input from the IMU, and normalize the input from the at least two electrodes based on the input from the IMU. The instructions may then be executable to perform eye tracking using electrooculography (EOG) based on the normalized input from the at least two electrodes.

As recognized herein, infrared (IR) eye tracking using IR cameras can require precise IR camera positioning that is often untenable in the form factors of lightweight head-mounted displays (HMDs) owing to their relatively lighter weight. Additionally, as also recognized herein, the processor burden and corresponding power consumption used for IR-based eye tracking can also be excessive, preventing effective execution of other complex tasks that the processor might attempt to execute in parallel and draining the device's battery too fast. For example, in at least some instances, host CPU utilization for IR-based eye tracking might be around fifty percent of one processor core per eye. There are currently no adequate solutions to the foregoing computer-related, technological problem.

Electrooculography-based eye tracking using normalized electrode input


The present disclosure provides a method for characterizing ohmic contact electrode performance of a semiconductor device. The method comprises: preparing two sets of testing patterns on a semiconductor device; testing resistance values of the two sets of testing patterns respectively; calculating a sheet resistance of an ohmic contact area according to the obtained resistance values; and evaluating the ohmic contact electrode performance of the semiconductor device according to the sheet resistance of the ohmic contact electrode.

The wide bandgap semiconductor materials represented by GaN have many advantages. It is a new type of semiconductor materials which have developed rapidly after the first generation of semiconductor materials represented by silicon (Si) and the second generation of semiconductor materials represented by GaAs. Gallium nitride material has superior physical properties, such as high electron drift velocity, wide bandgap, high thermal conductivity, high pressure resistance, high temperature resistance, radiation resistance, etc. Therefore, it is widely used in high-temperature and high-power devices, optoelectronics and high-frequency microwave devices, and has a large market. Due to the superior electrical performance of AlGaN/GaN HEMT devices and MIS-HEMT devices, they are considered to be the most promising candidates for high-voltage power switches. In recent years, related devices have become an international research hotspot.
In the manufacture process of the semiconductor devices such as GaN, the manufacture of ohmic electrodes is a critical step. To manufacture high-performance GaAs and GaN devices, good ohmic contact is particularly important. If the ohmic contact resistance is too large, the source and drain power dissipation will increase, and the output power and efficiency of the device will be affected. The ohmic contact resistance is an important indicator for judging the ohmic contact quality, and an accurate test of the sheet resistance of the ohmic contact area is the key to calculating the ohmic contact resistance. Therefore, the selection of a suitable method for accurately testing the sheet resistance of the ohmic contact area plays a very important role in the development and evaluation of the device.
Currently, the most common method for measuring ohmic contact resistance is the rectangular transmission line model (TLM) method and the circular transmission line model (CTLM) method.
The rectangular transmission line model (TLM) method is mainly to design a set of rectangular electrode testing patterns with unequal spacing, perform experimental tests, and combine the mathematical calculation, thereby to obtain a value of an active area sheet resistance, then to approximate the active area sheet resistance value Rsh as an ohmic area sheet resistance value Rshc. The method has the following drawbacks: firstly, since the ohmic contact area is formed by a complicated process including metal deposition, ion implantation or high temperature annealing on the active area, the sheet resistance of the active area and the ohmic contact area are not equal, even very different, and cannot be approximated; in addition, the rectangular transmission line patterns themselves need to be mesa-etched at the time of manufacture, which has an edge leakage effect, so the use of this model will make the final measurement result inaccurate.
The circular transmission line model (CTLM) method includes a circular dot transmission line model (CDTLM) method and a circular ring transmission line model (CRTLM) method. The CDTLM method is mainly to design multiple sets of circular dot electrode testing patterns, perform experimental tests and simple curve fitting, thereby to obtain the values of the active area resistance and the ohmic area sheet resistance. Compared with the rectangular transmission line model (TLM) method, the accuracy of this method is improved, but the required testing patterns generally need more than 5 sets, so the test sample has a large area. The CRTLM method is mainly to design three sets of circular ring testing patterns, perform experimental tests and complicated mathematical calculations, thereby to obtain a value of ohmic area sheet resistance. This method has the following drawbacks: first, the CTLM method ignores the sheet resistance of the metal layer during measurement, which will cause a certain calculation error; secondly, the formula for calculating the sheet resistance of the ohmic area is complicated, and the computer software-assisted simulation is needed to solve the Bessel function, which is computationally intensive, resulting in a longer total time for testing and computational analysis.
With the further development of semiconductor devices, the original measurement method for the sheet resistance of the ohmic contact area is more and more difficult to adapt to the requirements of high-performance semiconductor device development. Therefore, it is especially important to correct the original ohmic contact resistance measurement method.

Method for characterizing ohmic contact electrode performance of semiconductor device


The present invention relates generally to compositions of polyalkylene imine ("PAI"), particularly polyethylene imine ("PEI") and polyester polymer(s) (including copolymers and derivatives thereof); such compositions can be used in producing films or devices which are capable of scavenging unwanted aldehydes. More specifically, the preferred compositions of the present invention comprise a PAI substantially discontinuous phase and a polyester or copolyester substantially continuous phase in a weight ratio of PAI to polyester polymer of about 0.001-30:100 which optionally also includes a binding agent.

A co-inventor of the present invention is also a co-inventor to "Novel Packaging Compositions That Extend The Shelf Life Of Oil-Containing Foods", U.S. Ser. No. 07/724,421, filed Jul. 3, 1991, in which PEI is disclosed to have aldehyde scavenging capabilities (which can extend shelf life of oil-containing foods) when used as part of a packaging material. The present invention is an important improvement to U.S. Ser. No. 724,421.
U.S. Ser. No. 724,421 teaches the application of a thin coating of PEI as part of a multilayer composite film. However, the application of a thin coating of a material adds to the overall manufacturing complexity and creates an additional layer to be accomodated in a multilayer packaging structure.
PEI is a highly viscous liquid and is generally considered not to be pumpable. Furthermore, liquids generally do not pre-compound well with polymeric materials which are solid at room temperature, because the liquid will generally tend to bloom to the surface or otherwise migrate within the solid polymeric material; surface migration of PEI would generally cause the pre-compounded granules to stick to one another and inhibit flow into an extruder or the like.
The present invention overcomes or dramatically decreases the above described problems.

Aldehyde scavenging compositions and methods relating thereto


A file sharing system for managing both P2P type and C/S type shard files, wherein a management server accepts from each client a file registration request and a file access request for not only a P2P type shared file, but also a C/S type shared file, and each client executes a subsequent procedure for storing or accessing a shared file according to an acknowledgement response from the management server.

(1) Field of the Invention
The present invention relates to a file sharing system and client apparatus and, more particularly, to a file sharing system and client apparatus that can take the advantages of both a Client/Server (C/S) type and a Peer to Peer (P2P) type.
(2) Description of the Related Art
As conventional file sharing systems, C/S type and P2P type file sharing systems are known. In the following description, a system file denotes a file that is managed by a file sharing system and accessible to a plurality of users and a local file denotes a file for private use that is managed by a client apparatus.
A conventional C/S type file sharing system is comprised of a file server and a plurality of clients connected to a communication network. In the C/S type file sharing system, when a client user wishes to make one of the user's local files open as a shared file, the client sends a file upload request to the file server. When the file upload is successful, the uploaded file is stored as a system file in the file server and the file server sends a file upload confirmation message to the requester client. When the client receives the file upload confirmation message, the shared file registration sequence is completed.
When a client user in the C/S type file sharing system wishes to access any open shared file, the client sends the file server a file download request designating the file identifier. In reply to the download request, the file server sends back the specified file to the requester client. The downloaded file is stored as a local file in the client apparatus.
On the other hand, the P2P type file sharing system is comprised of a management server and a plurality of clients connected to a communication network. In the P2P type file sharing system, when a client user wishes to register one of the user's local files with the sharing system as a shared file, the client sends a file registration request message to the management server. When the client receives a file registration acknowledgement message in which the file identifier is specified from the management server, the client stores a copy of the local file to be registered as a shared file into its storage as a system file and sends the management server a message to notify that the file saving has been completed. The management server registers the file identifier designated in the notification message into a management table as a new shared file, and returns an ACK message to the client. When the client receives the ACK message, the shared file registration sequence is completed.
When a client user in the P2P type file sharing system wishes to access any open shared file, the client sends the management server a file download request message designating the file identifier. Upon receiving the request message, the management server judges whether the specified file can be downloaded. If the file download is permitted, the management sever sends back the requester client a response message indicating the address of a client where the requested file is located. The requester client sends a file down load request to the client identified from the response message to receive and store the downloaded file as a local file.
As for the P2P type file sharing system, a distributed file management type system is proposed, e.g., in Japanese Unexamined Patent Publication No. 2004-5491. This system is arranged such that the management server manages directory information and each client can register a file with the sharing system by linking a system file stored in its storage to any folder represented by the directory information.

File sharing system and client apparatus


In a sheet material (1), a bonding layer (2) is provided, and then a high-strength layer (3) is laminated on the bonding layer (2). The bonding layer (2) is made of an epoxy resin being a thermosetting material. The high-strength layer (3) is made of polyimide, which is not softened at a thermosetting temperature of the epoxy resin and has a tensile rupture strength higher than that of the cured thermosetting material. Moreover, the polyimide has a tensile rupture strength of 100 MPa or higher at 23° C. and a tensile rupture elongation of 10% or higher at 23° C. Assuming that a tensile rupture strength at −65° C. is a and a tensile rupture strength at 150° C. is b, a ratio (a/b) is 2.5 or less.

With the size reduction and the functionality multiplication of portable equipment and the sophistication of the Internet communication systems in the recent years, semiconductor elements used for them have an increasing number of terminals and a reduced pitch between terminals. With this tendency, a higher density and a finer wiring are required more than ever before, for a wiring board of a semiconductor package equipped with a semiconductor element.
As a wiring board including fine wirings at a high density, there exists a buildup printed wiring board including a buildup wiring layer, in which wirings are formed at a high density on an outer layer of a base core substrate.
FIG. 6 is a sectional view showing a conventional buildup printed wiring board. As shown in FIG. 6, a conventional buildup printed wiring board includes a base core substrate 73 made of glass epoxy. A through hole 71 is formed in the base core substrate 73 with a drill. A diameter of the through hole 71 is, for example, about 300 μm. Conductor wirings 72 are formed on both sides of the base core substrate 73. Interlayer insulating films 75 are formed so as to cover the conductor wirings 72, respectively. A via hole 74 for connection to the conductor wiring 72 is formed in each of the interlayer insulating films 75. A conductor wiring 76 for connection to the conductor wiring 72 through the via hole 74 is provided on the surface of the interlayer insulating film 75. A wiring board may sometimes be formed as a multilayered wiring board by repeatedly providing an interlayer insulating film including a via hole formed therein and conductor wirings on the conductor wiring 76 as needed.
As a wiring board with further improved operation speed, a thin wiring board at a high density without a core substrate has been proposed. This wiring board is obtained by first forming a wiring layer composed of wirings and an insulating film on a support member such as a metal plate. Thereafter, the support member is removed so that the wiring layer itself serves as a wiring board (for example, see Japanese Patent Laid-Open Publications Nos. 2001-177010, 2002-83893, and 2002-198462). The wiring board is obtained by removing a core substrate from a normal buildup printed wiring board so as to leave a buildup layer alone. Therefore, this wiring board is considered as a ultimate thin wiring board.
Since no through hole is provided in the above-described wiring board, it is not necessary to provide a land serving to connect a wiring to a through hole. Therefore, the control of an impedance is easy while a loop inductance is small. The entire wiring board has high operation speed. Accordingly, the use of the wiring board permits the design of a wiring operating at high speed. Moreover, since a metal plate having excellent evenness, a high elastic modulus, and excellent heat resistance is used as a support member, a fine wiring pattern at a high density with high form stability can be formed by using a high-temperature process.
The wiring board is mainly composed of metal wirings for electric connection and an insulating film for insulating the metal wirings from each other. As an insulating material used for an insulating film in a wiring board including fine wirings at a high density such as a buildup substrates the following materials are conventionally used.
An insulating material made of a thermosetting resin such as an epoxy resin is used for an insulating film of a wiring board fabricated by a semi-additive method or an additive method, that is, a wiring board including a metal wiring formed by electroless plating and/or electrolytic plating. The insulating material is laminated on a substrate in a semi-cured state. After the deposition, the insulating material is heated and cured to be an insulating film. Thereafter, after the formation of a via with a drill or a laser, a treatment such as desmearing is conducted. Then, a metal wiring is formed by electroless plating and/or electroplating.
An insulating material made of a thermosetting resin such as an epoxy resin is also used for an insulating film of a wiring board fabricated by a subtractive method, that is, a wiring board including a metal wiring formed by etching a copper foil. In the subtractive method, an insulating material is applied onto a copper foil to fabricate RCC (Resin Coated Copper foil) in a semi-cured state. The RCC is laminated on a substrate in a semi-cured state. After thermosetting, a via is formed. Thereafter, the copper foil layer is partially etched away, thereby forming a wiring pattern.
Furthermore, as an insulating material, the use of a material containing an inorganic filler in a thermosetting resin such as an epoxy resin and a glass-epoxy composite material obtained by impregnating a medium such as a glass cloth into a resin material such as an epoxy resin is also being examined.
Furthermore, a laminate composed of a plurality of layers is also disclosed as an insulating film of a wiring board. For example, a technique for providing a conductor layer at least on one surface of a polyimide film and providing a bonding layer made of an epoxy resin on the other surface has been disclosed (for example, see Japanese Patent Laid-Open Publication No. 2002-124751) Specifically, in this technique, a laminate composed of a polyimide layer and an epoxy layer is used as an insulating film.
However, the above-described conventional techniques have the following problems. A semiconductor package is normally formed by mounting a semiconductor element made of a semiconductor material such as silicon on a wiring board. The semiconductor element emits heat to have an elevated temperature in operation. When the operation is stopped, the semiconductor element stops emitting heat to have a lowered temperature. When an organic material is used as an insulating material of a wiring board, a thermal expansion coefficient of the organic material is generally several tens of ppm/° C., which is considerably larger than that of silicon (Si) (approximately 4 ppm/° C.). Therefore, with the operation of the semiconductor element, a thermal stress due to a difference in thermal expansion coefficient is generated between the semiconductor element and the wiring board. If the semiconductor element is repeatedly operated and stopped, a thermal stress is also repeatedly applied to the wiring board. As a result, a crack is generated in the insulating layer of the wiring board by the thermal stress. Moreover, if the semiconductor package is used as a vehicle-mounted component or the like, a change in temperature in the environment of use is added to a change in temperature caused with the operation of the semiconductor element because the change in temperature in the environment of use is large. As a result, since the thermal stress is further increased, a crack is more likely to be generated.
In particular, since a thermosetting resin has a small rupture elongation, that is, several % or less, a crack due to a thermal stress is likely to be generated in an insulating film made of a thermosetting resin. Among the thermosetting resins, a generated crack is more likely to expand to cut a metal wiring in an insulating film made of an epoxy resin. As a result, the wiring is broken to put the semiconductor package in an open state. Moreover, the thermal stress causes another problem that a junction interface between a land for connection to BGA and FC and a solder ball is broken. As a result, the metal wiring breakage, the land breakage and the like as described above cause a further problem that the semiconductor element on the wiring board does not normally function.
Moreover, if the insulating film is formed of an epoxy resin alone, it is difficult to treat the epoxy layer by itself because the epoxy resin is fragile with small expansion. Therefore, a film made of an epoxy resin is formed on PET (polyethylene terephthalate) serving as a support member. For use as an insulating film, the support member is peeled off from the epoxy resin film. Therefore, there arises a problem that the formation of a wiring board requires a step of peeling off the support member from the epoxy resin film.
Furthermore, for an insulating material obtained by an inorganic filler contained in a thermosetting resin, a thermal expansion coefficient: can be lowered by adding an inorganic filler in a thermosetting resin such as an epoxy resin to be closer to a thermal expansion coefficient of a semiconductor element so as to reduce a thermal stress because the inorganic material generally has a small thermal expansion coefficient. However, since the rupture elongation and the rupture strength of the entire insulating material are lowered by containing the inorganic filler, sufficient crack resistance cannot be still obtained.
Furthermore, in an insulating material obtained by impregnating the glass cloth material into an epoxy resin, a stress is absorbed by a glass cloth having high strength. However, a part of the insulating material, which does not include any glass fibers, is inevitably generated in terms of a structure of a woven cloth. A crack is generated and a wiring is broken in this part. Moreover, a method of using light (photovia) and a method of using a laser are generally used as a method of forming a via in a wiring board. However, if a wiring board contains glass fibers, the formation of a via with light is not possible. Moreover, for the formation of a via with a laser, the processability with a laser is poor because the melting point of glass is considerably higher than that of an organic material. Therefore, the obtained via is large with a diameter of 100 μm or more. Thus, it is difficult to use the insulating material for a high-density substrate requiring a fine wiring and a fine via. Moreover, since a glass cloth material serving as an inorganic material provide low adhesion with an epoxy resin serving as an organic material, migration is likely to occur through the interface between the glass cloth material and the epoxy resin. Furthermore, since the glass cloth material has a larger specific gravity than the epoxy resin, the glass cloth material is not suitable for a wiring board of equipment that is required to be reduced in weight such as portable equipment.
Furthermore, if the laminate obtained by laminating a bonding layer made of an epoxy resin or the like on a polyimide film disclosed in Japanese Patent Laid-Open Publication No. 2002-124751 is used, the effects of preventing the generation of a crack during the fabrication of a wiring board or at the early stage of a test can be obtained to a certain degree by reducing a linear expansion coefficient of the polyimide film. However, since the tensile rupture strength at a predetermined temperature or the like is not appropriately controlled, the mechanical characteristics of a wiring board gradually degrade to generate a crack if a thermal stress is repeatedly applied to the wiring board. Therefore, the wiring board does not offer long-term reliability.
The enlargement of size, the increase in number of pins and the reduction of a pitch with the higher operation speed and the higher integration of a semiconductor element are expected to rapidly proceed from now on. Thus, the wiring board, on which a semiconductor element is mounted, is required to have a higher density and a finer wiring. Therefore, it is believed that the problem of a crack generated in the insulating film becomes more noticeable from now on. In particular, metal wiring breakage due to a crack generated with a thermal stress becomes a particularly serious problem in a multilayered wiring board without a core substrate disclosed in the above-described Japanese Patent Laid-Open Publications Nos. 2001-177010, 2002-83893, and 2002-198462 because the multilayered wiring board does not include a core substrate for absorbing a generated stress.
The present invention is devised in view of the above problems, and has an object of providing a sheet material suitable as an insulating film of a wiring board such as a buildup wiring board used in a semiconductor package and a wiring board using the sheet material, which have excellent reliability with excellent crack resistance and high adhesion with a substrate or an underlying sheet material.