Methods and systems for automating execution of a workflow by integrating security applications of a distributed system into the workflow are provided. In embodiments, a system includes an application server in a first cloud, configured to receive a trigger to execute the workflow. The workflow includes tasks to be executed in a device of a second cloud. The application server sends a request to process the task to a task queue module. The task queue module places the task request in a queue, and a worker hosted in the device of the second cloud retrieves the task request from the queue and processes the task request by invoking a plugin. The plugin interacts with a security application of the device of the second cloud to execute the task, which yields task results. The task results are provided to the application server, via the worker and the task queue module.

Information security (IS) is an essential item in today's wholly computerized world. Enterprises must be able to respond to cybersecurity threats in order to protect their data and resources. However, enterprises are struggling to keep up with the current cybersecurity threat landscape. In particular, current IS systems are plagued with a massive shortage of security professionals, resulting in a lack of resourcing and skills needed to respond to IS incidents. In addition, there are an incredibly large number of security products available, which coupled to the large number of IS incidents that occur, create a suffocating volume of tasks that must be performed in order to detect and remediate these IS incidents. One factor contributing to the situation is that a lot of current IS processes are manual. For example, when responding to an incident, an analyst manually executes a process which may include processing and analyzing data using any number of IS tools.
Moreover, modern security infrastructures are generally distributed across multiple platforms, which may be geographically dispersed, and may include a large number of resources that need to be protected. For example, modern infrastructures may include multiple clouds, internal private clouds, data centers, and/or any combination thereof.
Some solutions have been proposed to address the increasing number of cyber-attacks and the lack of trained personnel. These solutions provide customizable platforms for creating automated workflows. However, these solutions are not robust enough to protect modern infrastructures. In particular, these solutions are focused on traditional data centers, and provide tools that are designed to function on single servers. As such, these solutions are unable to load-balance across multiple servers because of the interdependencies of the different modules of the tool, such as the database, the user interface, the business logic processing unit, among others, and may suffer from under-utilization because scaling such a solution may require reconfiguring a box with more capacity, which is by design under-utilized. In addition, scaling these solutions requires large, tedious, and expensive reconfigurations, which limits rapid scalability of these solutions in response to IS incidents.

Systems and method for automating security workflows in a distributed system using encrypted task requests


A process for treating spent potlining from the electrolytic smelting of aluminum in cryolite includes incinerating the potlining to combust carbonaceous material to form an ash at a temperature low enough to maintain low fluorine vapor pressures, admixing siliceous material with the potlining either before of after the ash-forming stage, and heating the ash and siliceous material to form a glassy residue.. The residue formed by the process of the present invention produces a spent potlining suitable for landfill characterized by a low leachability of fluorine in water.

This invention relates to the disposal of spent potlining by incineration and glassification for landfill disposal.
Aluminum is produced commercially by the electrolytic smelting of alumina in an electrolytic bath of fused cryolite. Relatively pure alumina is reduced in the cryolite (3NaF--AlF.sub.3) in an electrolytic cell (named Hall-Heroult cell after the earliest developers of the electrolytic process for producing aluminum). The reaction is carried out in the Hall-Heroult cell process in an aluminum reduction pot in which alumina is dissolved in the molten cryolite bath. The alumina in solution in the molten cryolite is electrolyzed to form metallic aluminum. Aluminum produced in the reaction is heavier than the electrolyte and forms a molten layer at the bottom of the reduction pot which serves as the cathode of the cell. Carbon anodes extend into the bath, and oxygen liberated at the anode oxidizes carbon on the electrode.
The electrolyte composition is an important factor in the aluminum production process. The electrolyte contains cryolite and fluorspar (calcium fluoride, CaF.sub.2). Excess aluminum fluoride is present with dissolved alumina in the electrolyte to reduce the liquidus temperature to the point where the cell can be operated in the range of about 940.degree.-980.degree. C.
Gases are emitted by the batteries of reduction pots in the Hall-Heroult cell process. The emitted gases include carbon dioxide, volatilized fluorides, and gaseous hydrogen fluoride. Particulate solids, including fine alumina, cryolite, carbon, and inorganic compounds are elutriated from the electrolytic bath with the gases. Small amounts of lithium, calcium, silica, iron, sodium sulfate, and magnesium are present also in the gas streams as solid particles.
The reduction cells in the commercial electrolytic potlines are lined with a carbonaceous material. During the life of the cells, the carbonaceous material linings are degraded gradually by penetration of bath materials into the lining, e.g., such as by penetration by metallic aluminum, cryolite, and alumina. In the high temperatures of the electrolytic reduction process, the carbonaceous material ages gradually and degrades over time. Eventually, the unusable or "spent" potlining must be removed and discarded.
It is known that spent potlining from aluminum reduction cell linings contains a significant quantity of carbonaceous material, a mixture of fluoride salts, some low levels of cyanide, and alumina (Al.sub.2 O.sub.3).
The Environmental Protection Agency is considering classifying spent potlining from the Hall-Heroult cell as a solid waste hazardous material because of the hazardous and solid waste amendments of 1984. Most spent potlining cannot be landfilled because of cyanide content (approximately 1,000 parts per million) and because of its high content of leachable fluoride (3,000 to 8,000 parts per million) from an approximately 18% total fluoride in the spent potlining.
Several methods already have been recommended for the recovery of fluoride salts and alumina content of the spent potlining material. One method involves the pyrohydrolysis of the spent cell material or potlining in a fluidized bed reactor. Pyrohydrolysis involves contacting a fluidized bed of spent potlining with water or steam to react with the fluorine compounds to form hydrogen fluoride. Sodium fluoride and other sodium compounds in the potlining react to form sodium fluoride and sodium oxide vapors. The sodium fluoride and sodium oxide vapors are produced in the pyrohydrolysis reactions.
It is known to use limestone, calcium carbonate, to react with fluoride in the spent potlining at about 700.degree.-780.degree. C. to form a calcium fluoride. However, the final product still has a high level of leachable fluoride. An article in Light Metals, 1981, entitled "Recovery of Fluoride and Fluorine Balance of Aluminum Smelting Plant" describes a process of spent potlining wherein the potlining is crushed, incinerated, and introduced into a crusher for pulverizing and extraction of the fluorides into water. After filtration, the material is introduced into a mixing tank, and sulfuric acid and calcium carbonate are added to produce calcium fluoride. The slurry is desiccated, and the sludge sent to a disposal site. The fluoride-containing filtrate is used as the scrubbing solution in a wet scrubber.
U.S. Pat. No. 4,113,832 discloses a process wherein spent potlining is leached with a caustic solution followed by a precipitation of sodium fluoride by saturating the leach liquor with a compound to suppress the solubility of the sodium fluoride in the leach liquor. The preferred compound is ammonia. The precipitated sodium fluoride is removed, and the leach solution saturated with ammonia is processed to remove the ammonia.
U.S. Pat. No. 4,444,740 discloses a process for removing and recovering fluoride values from spent potlining by leaching with a dilute caustic. The leachate is treated with a calcium compound to precipitate calcium fluoride.
The conventional methods for removing and recovering fluorides from spent potlining are impractical ways to avoid the problem of spent potlining disposal with fluorides and cyanides present. Prior methods adopt the approach of removing and recovering the fluoride. These prior art methods are impractical by reason of the raw material costs assigned to the process and also by reason of the process steps which must be carried out to remove and recover the fluorides.
U.S. Pat. No. 4,735,784 to Davis et al (currently assigned to the Morrison-Knudsen Company, Inc.) discloses a process for treating solid, substantially non-volatile waste contaminated with a heat-sensitive contaminant by decomposing or evolving the contaminants from the melt as a gas. Davis et al disclose a molten slag subjected to cooling, the contaminating compounds bound or encapsulated into a solid glassy slag, and suitable as such for handling fluoride and cyanide contaminated aluminum smelting wastes such as spent potliner material. Silica can be added to such wastes. The Davis et al process produces significant volumes of fluoride emissions. The patent covers a pyrohydrolysis process, disclosed and claimed. The process forms a slag in the presence of sufficient water for pyrohydrolysis conditions resulting in the volatilization of substantially all of the fluoride contaminants, mostly in the form of hydrogen fluoride.
The Davis et al process includes a single heating step in which the mixture of spent potlining and silicates is heated to 1000.degree.-1700.degree. C. Davis et al heat the mixture to the temperature range of 1000.degree.-1700.degree. C. to volatilize substantially all the fluoride in the spent potlining. Steam is used in the process to provide hydrogen to combine with the fluoride to produce hydrogen fluoride. Davis et al trap some fluoride in the glass residue, but only a minor portion of the total fluoride from the spent potlining. As stated in Column 3, lines 30-33, and in the claims of Davis et al, substantially all the fluoride contaminants are volatilized.
It is an object of the present invention to provide a process for eliminating the problem of disposal of spent potlining containing fluorides in such a way to reduce gaseous emissions of fluorine or fluoride in any form.
It is an object of the present invention to provide a practical method for eliminating the problem of disposal of spent potlining containing fluorides.
It is another object of the present invention to provide a practical method for the disposal of spent potlining which reduces degradation of the environment.
These and other objects of the present invention will become apparent from the detailed description which follows.

Stabilization of fluorides of spent potlining by chemical dispersion


A storage device for holding a drain plug for a boat is disclosed. The storage device provides a place to store the drain plug when it is removed from a drain hole for the boat. The storage device includes a reminder system using an emergency stop lanyard (ESL) present on nearly all powerboats. The storage device holds both the ESL and the drain plug. The storage device is designed so that the ESL cannot be removed without first removing the drain plug. Thus, an operator cannot start a boat's engine without first removing the drain plug from the storage device to gain access to the ESL, allowing the ESL to be refitted onto an operating system for the boat's engine. The act of handling the drain plug reminds the operator to re-install the drain plug into the drain hole.

Most boats have a drain hole located at a low point in a boat's hull to allow for the drainage of bilge water when the boat is removed from the water. Draining bilge water has long been viewed as a useful way to prevent damage that standing water can cause to a boat's interior. More recently, draining bilge water has come to be seen as an important way to limit the spread of aquatic invasive species (AIS) from infested to uninfested bodies of water. Driven by a concern to limit the spread of AIS, some laws have recently been enacted that require the drain plug to be removed from the boat whenever the boat is trailered on a public roadway.
Removing the drain plug when the boat is out of water has, therefore, long been a good idea, but now in some regions such removal is a legal requirement. But removing the drain plug creates challenges for a boat operator. First, a question arises of where the boat operator should store the drain plug when it is not in use. Second, the boat operator must remember to re-install the drain plug when the boat is re-launched to prevent the boat from taking on water, and possibly sinking.
The prior art includes some other boat drain plug storage devices, but these are generally not designed to remind the boat operator to reinstall the boat drain plug before launching the boat. The prior art also includes several devices designed to remind the boat operator to reinstall the drain plug before launching the boat, but these are generally somewhat complicated electrical and mechanical devices that are relatively costly and prone to malfunction.

Boat drain plug storage and reminder device


A nitride read only memory (NROM) cell has a nitride layer that is not located under the center of the transistor. The gate insulator layer, with the nitride layer, is comprised of two sections that each have structurally defined and separated charge trapping regions. A charge is stored on a particular trapping region in response to the direction that the transistor is operated. The two sections of the gate insulator separate outer regions of the polysilicon gate structure from the middle region.

Memory devices are typically provided as internal, semiconductor, integrated circuits in computers or other electronic devices. There are many different types of memory including random-access memory (RAM), read only memory (ROM), dynamic random access memory (DRAM), synchronous dynamic random access memory (SDRAM), and flash memory.
Flash memory devices have developed into a popular source of non-volatile memory for a wide range of electronic applications. Flash memory devices typically use a one-transistor memory cell that allows for high memory densities, high reliability, and low power consumption. Common uses for flash memory include personal computers, personal digital assistants (PDAs), digital cameras, and cellular telephones. Program code and system data such as a basic input/output system (BIOS) are typically stored in flash memory devices for use in personal computer systems.
One type of flash memory is a nitride read only memory (NROM). NROM has some of the characteristics of flash memory but does not require the special fabrication processes of flash memory. NROM integrated circuits can be implemented using a standard CMOS process.
FIG. 1 illustrates a cross-sectional view of a typical prior art NROM memory cell with a channel length, L, that is greater than 100 nm. This cell is comprised of a control gate 100 formed on top of an oxide-nitride-oxide (ONO) layer. This layer is comprised of an oxide layer 101 on top of a nitride 103 layer upon which the charge is stored for the various states of the cell. In one embodiment, the cell has trapping areas 105 and 106 for storing two bits of data on the nitride layer 103. The nitride layer 103 is deposited on another oxide layer 104 that is on the substrate.
Two source/drain regions 109 and 111 are at either end of the gate 100. The source/drain regions 109 and 111 are connected by a channel area 110 between the two source/drain regions 109 and 111. The function of each source/drain region 109 or 111 (i.e., whether source or drain) depends upon which bit area 105 or 106 is being read or written. For example, in a read operation, if the carrier is input at the left side source/drain region 111 and output from the right side region 109, the left side is the source 111 and the right side is the drain 109 and the data bit charge is stored on the nitride 103 at the source end 111 for bit area 106.
As IC manufacturers try to increase memory density of NROM devices, the channel length is reduced. FIG. 2 illustrates a typical prior art planar NROM device that has a channel length that is less than 100 nm. In this case, the channel length is so short that the bit trapping areas 205 and 206 overlap. The overlap may cause data write and read errors.
For the reasons stated above, and for other reasons stated below which will become apparent to those skilled in the art upon reading and understanding the present specification, there is a need in the art for a smaller multiple-bit NROM device without trapping area overlap.

NROM flash memory with self-aligned structural charge separation


This invention provides a sign image by projecting light through a replaceable pivotable image forming apparatus onto an adjacent surface. The apparatus is contained within a telescoping tube of three locking sections with overlap indicators. The tube is pivotably mounted within a wall or ceiling. The pivotable tube and stencil permits projecting the sign image onto an adjacent inclined surface. The first section has a light source at its outer end and image forming apparatus which provides the sign message. The other two sections each contain a lens for respective image size and focus adjustment by changing the sections overlaps.

1. Field of the Invention
This invention relates in general to sign apparatus, and relates in particular to emergency sign apparatus within a building required by law to indicate an exit.
2. Description of the Related Art
There are a variety of signs used in buildings to provide emergency exit signs. These signs are made of a variety of materials, including various metals and plastics, which are mounted on a building ceiling or wall. There are a number of objections to this arrangement. A sign mounted on a wall is subject to damage from a variety of sources, which can even include vandalism. Further, architects consider these signs to be objectionable in appearance. These signs are produced in many different directional arrow configurations that require excessive production of various configurations and can result in potential mistakes in shipping. The proper configuration for any information could be solved by a universal field modified sign adaptable to any configuration. It would be desirable if an exit sign could be concealed completely within a wall or ceiling and still provide the required information, since such an arrangement would eliminate all of the above objections.
This invention provides a sign, which is mounted completely within the surface of a wall or ceiling, which projects the desired message on an adjacent surface including a wall, the ceiling or a suspended surface.
The sign information is displayed by projecting the desired message on the surface. The projected message is obtained by directing a light source through image forming apparatus. Typical image forming apparatus can include replaceable image lens or stencil. The projection apparatus is mounted within a telescoping tube having three sections. The outer end of the first section mounts the light source and an adjacent image forming apparatus. The second center section, and the third section each mount a lens at the light entrance end. The lenses are arranged such that changing the overlap of the first and second section will change the size of the resulting projected image, and changing the overlap of the second and third section will change the focus of the resulting projected image. The second and third sections have indices along their exterior to respectively indicate the overlap of the first and second sections and the overlap of the second and third sections. Both the overlapped first and second section, and the overlapped second and third section can be locked together at various amounts of overlap.
When the image forming apparatus is a stencil, the stencil is pivotably mounted across the tube cross-section. Opposed projections from the stencil apparatus extends through opposed slots in the tube. A scale around one of the slots and the relationship of the projections to the slots indicates the angular relationship of the stencil to a perpendicular pair of axis which are contained in a plane perpendicular to the tube axis. This information assists in orienting the projected image relative to the receiving surface, which will be described further later.
The adjacent planar surfaces receiving the image are normally inclined with respect to the projection apparatus. The adjacent surfaces can be a wall, the ceiling or a suspended surface. The mounting apparatus for the tube mounts the tube within a circular opening at an angle with respect to the surface of a wall or ceiling. An outwardly extending flange, which has a central opening, is the only part of the mounting apparatus which is external to the opening.
The mounting apparatus is symmetrical about the mounting hole, which permits the apparatus to be mounted at any angle around a line perpendicular to the flange opening. This permits the tube to be mounted with the projected image directed to either the right or left side, upward or downward, or at any angle in between. This permits directing the projected image on an adjacent side wall, the ceiling, or on a suspended surface. Because of the circular dimensions, only a single, relatively small size, circular hole is required to mount both the bracket and projection apparatus.
The first section has a light source located at its outer end, with the image forming apparatus mounted adjacent to the light source. The second and third section each have a lens mounted across their respective light entrance ends. Although any image forming means can be used, as indicated above it can be a stencil. The tube is installed at an angle with respect to the wall opening to permit projecting an image upon an inclined adjacent wall, ceiling or suspended surface.
In use, the mounting apparatus is oriented and the tube angle adjusted such that the projected image is directed onto the desired adjacent surface. The lenses are then adjusted by changing the relationship between the tube sections to focus the image upon this surface with the required size and the tube sections are locked relative to each other to maintain this desired relationship.
Since this apparatus is primarily intended to be used to indicate an exit, it is important that a power line failure not interrupt the projection of the image. The following two back-up power supply arrangements, among other similar arrangements, could be provided to essentially eliminate the possibility of a power interruption. Both would provide direct current power to the light source.
One power supply arrangement could use both a trickle charger and battery combination and a separate battery charger, with both being powered by a conventional alternating power source. The battery charger would provide direct current power to the light source and the trickle charger would maintain the battery at full charge. In the event of a power failure a relay could be used to open the battery charger circuit, disconnect the trickle charger from the battery and connect the battery to the light source to provide continuous direct current power for operation.
Another power supply arrangement could use a conventional alternating current power source and a back-up alternating current power source. Here the back-up could be either an engine-generator combination, or a battery-inverter combination with either providing alternating current of the same frequency and voltage as the conventional source, and arranged to turn on automatically upon failure of the conventional power source. A relay would switch from the conventional power source to the back-up source upon power failure, such that either of the above back-up power source arrangements would provide system power. A battery charger, which would normally be connected to the conventional power source, upon failure of the conventional power system, would be switched by a relay to the back-up source, such that either active source would provide direct current power to the light source.
Providing a back-up power supply arrangement similar to either of those described above, would insure that the projected message would probably never be interrupted.
Since the message is provided by projection, it can be made any desired size. Further, since a back-up power source arranged as those described above, could be provided for the event of a power line failure, it is extremely unlikely that there will ever be a failure in displaying the message. The total concealment of the sign apparatus, with only the exception of the flange, eliminates the problems with previous signs as to their vulnerability to damage and their appearance.


A method and system for determining stress associated with a communication device, e.g., an optical fiber, and associated structures are disclosed. An exemplary method includes transmitting an initiated signal through a communication device, and comparing a reflected signal reflected by the communication device with the initiated signal. The method may further include determining a stress associated with the device from at least the comparison of the initiated signal and the reflected signal.

Communication media such as optical media have historically been fragile and susceptible to significant signal transmission loss when the media is bent, pinched, twisted, or subjected to environmental factors such as heat, moisture, etc. Accordingly, communication systems have generally been designed with these drawbacks in mind, minimizing sharp bends or exposure to environmental factors.
In recent years many significant advances have been made in the durability of these communication media. For example, various types of bend-insensitive fibers that are capable of low transmission losses even when severely bent or pinched are now employed in communication systems. Accordingly, the durability of communication systems is correspondingly greater as compared with previous systems that relied upon fibers or media that is more sensitive to bending.
Now that communication media can resist further bending without significant signal degradation, it is difficult to determine when the communication media are experiencing significant stress in the field short of total signal loss. Often the first indication that a communication media is under increasing duress is a total loss of the signal upon breakage of the media. By comparison, bend-sensitive fibers generally provide a more gradual attenuation in the transmitted signal that can be more easily detected by system monitors before any significant damage to the media occurs.
Accordingly, there is a need for an improved system stress monitoring system and method that maintains the durability benefits of bend-insensitive fiber while providing an indication of stress issues in the media prior to complete failure or breakage of the media.


Aspects of the subject disclosure may include, for example, monitoring a user in a showroom to generate shopping parameters of the user, determining that the user is seeking to purchase a product in the showroom according to the shopping parameters, obtaining user data of the user in response to the determining that the user is seeking to purchase the product, analyzing the user data, selecting interaction data from among a group of interaction data according to the analyzing of the user data, and providing the interaction data to a computing device of a sales agent to enable the sales agent to transact with the user for the purchase of the product. Other embodiments are disclosed.

Purchases can be made online or can be made in a store or showroom. Often, users desire to see the product in person before making a purchase. AN inability to see the product can create a lack of confidence in understanding the product during the online purchasing experience. Further, users often desire to review information regarding the product at a time of purchase which can add to the lack of confidence in understanding the product during the showroom purchasing experience.

Method and apparatus for facilitating purchase transactions associated with a showroom


An integrated circuit module having microscopic self-alignment features comprises: 1) an integrated circuit chip having a plurality of input/output pads in a pattern on a surface thereof; 2) an interconnect member having a surface which includes input/output pads in a pattern that matches the pattern of pads on the integrated circuit chip; and, 3) one of the surfaces has a predetermined number of holes of one-half to fifty mils deep and the other surface has a predetermined number of protrusions of one-half to fifty mils high which are shaped to fit into the holes and prevent the surfaces from sliding on each other when the input/output pads on both of the surfaces are aligned.

This invention relates to integrated circuit modules of the type in which one or more integrated circuit chips are mounted on an interconnect member such that multiple input/output pads on each chip are connected to corresponding input/output pads on the interconnect member.
In the above type of integrated circuit module of the prior art, the interconnect member has included a substrate which holds a single chip or which holds multiple chips. This substrate can be made of ceramic or silicon or epoxy glass. Thousands of patterned conductive signal lines are provided within and/or on top of the substrate; and, those signal lines include input/output pads which are arranged in a pattern that matches the input/output pads on each chip. One example of such a prior art interconnect member is described in U.S. Pat. No. 4,721,831 entitled "Module for Packaging and Electrically Interconnecting Integrated Circuit Chips on a Porous Substrate, and Method of Fabricating Same" by H. Vora issued Jan. 26, 1988. There, in FIG. 1, reference numeral 10 identifies the interconnect module and reference numeral 12 identifies the chips; and in FIG. 2, reference numeral 21 identifies the input/output pads on the interconnect module.
Now, a technical problem which somehow needs to be solved when fabricating integrated circuit modules of the above type is how to align the input/output pads on each chip with the corresponding input/output pads on the interconnect module while the chips are being attached to the interconnect module. This is a difficult problem because the input/output pads typically have small dimensions (e.g.-ten mils), are large in total number (e.g.-one hundred), and are blocked from view by the chip when the chip is placed on top of the interconnect member. However, if the input/output pads on a chip get misaligned with the corresponding input/output pads on the module, all electrical signals (including data signals, control signals, power and ground signals) will be misrouted to and from the chip; and, the resulting structure will be completely inoperable.
In the prior art, this problem of how to align the input/output pads on a chip to the input/output pads on an interconnect module was overcome by using specialized alignment machines. But, those machines are very complex and thus are very expensive. One such machine, for example, called a "M-9" from the Research Devices Division of the American Optical Corporation, provides an infrared light beam to "see" through the chip and thereby view when the input/output pads on the chip and the interconnect module are in line. But, this machine costs over $100,000. Another machine, called a MRSI-503M from Micro Robotics Systems, Inc. provides an optical probe with dual optical paths which fits between the chip and the substrate as they are positioned over each other so that their input/output pads can be viewed and lined up. But, this machine also costs over $100,000. Further, the above costs are for manually operated versions of both machines; automated versions cost over $200,000.
Accordingly, a primary object of the present invention is to provide an improved integrated circuit module that includes novel microscopic physical features on the chips and on the interconnect module which enable their input/output pads to be self-aligned without any alignment equipment.

Method of fabricating integrated circuit module


An apparatus for supporting a device, comprising a base assembly, a plurality of carrier columns extending from the base unit, and a plurality of vertical support plates, each vertically movable along a respective carrier column and including a pivotal device mounting bracket. A pneumatic unit including a piston rod is associated with each vertical support plate such that vertical motion of the piston rod controls vertical motion of the respective vertical support plate.

In the manufacture of integrated circuits (ICs) and other electronic devices, testing with automatic test equipment (ATE) is performed at one or more stages of the overall process. Special handling apparatus is used which places the device to be tested into position for testing. In some cases, the special handling apparatus may also bring the device to be tested to the proper temperature and/or maintain it at the proper temperature as it is being tested. The special handling apparatus is of various types including "probers" for testing unpackaged devices on a wafer and "device handlers" or "package handlers" for testing packaged parts; herein, "handling apparatus," "test peripheral," or simply "peripheral" will be used to refer to all types of such peripheral apparatus. The electronic testing itself is provided by a large and expensive ATE system which includes a test head which is required to connect to and dock with the handling apparatus. The Device Under Test ("DUT" or "dut") requires precision, high-speed signals for effective testing; accordingly, the "test electronics" within the ATE, which are used to test the DUT, are typically located in the test head, which must be positioned as close as possible to the DUT. The test head is extremely heavy, and as DUTs become increasingly complex with increasing numbers of electrical connections, the size and weight of test heads have grown from a few hundred pounds to presently as much as two or three thousand pounds. The test head is typically connected to the ATE's stationary mainframe by means of a cable, which provides conductive paths for signals, grounds, and electrical power. In addition, the test head may require coolant to be supplied to it by way of flexible tubing, which is often bundled within the cable.
In testing complex devices, hundreds or thousands of electrical connections have to be established between the test head and the DUT. These connections are accomplished with delicate, densely spaced contacts. In testing unpackaged devices on a wafer, the actual connection to the DUT is typically achieved with needle-like probes mounted on a probe card. In testing packaged devices, it is typical to use a test socket mounted on a "DUT board." In either case, the probe card or DUT board is usually fixed appropriately to the handling apparatus, which brings each of a number of DUTs in turn into position for testing. In either case the probe card or DUT board also provides connection points with which the test head can make corresponding electrical connections. The test head is typically equipped with an interface unit that includes contact elements to achieve the connections with the probe card or DUT board. Typically, the contact elements are spring loaded "pogo pins." Overall, the contacts are very fragile and delicate, and they must be protected from damage.
Test head manipulators may be used to maneuver the test head with respect to the handling apparatus. Such maneuvering may be over relatively substantial distances on the order of one meter or more. The goal is to be able to quickly change from one handling apparatus to another or to move the test head away from the present handling apparatus for service and/or for changing interface components. When the test head is held in a position with respect to the handling apparatus such that all of the connections between the test head and probe card or DUT board have been achieved, the test head is said to be "docked" to the handling apparatus. In order for successful docking to occur, the test head must be precisely positioned in six degrees of freedom with respect to a Cartesian coordinate system. Most often, a test head manipulator is used to maneuver the test head into a first position of coarse alignment within approximately a few centimeters of the docked position, and a "docking apparatus" is then used to achieve the final precise positioning. Typically, a portion of the docking apparatus is disposed on the test head and the rest of it is disposed on the handling apparatus. Because one test head may serve a number of handling apparatuses, it is usually preferred to put the more expensive portions of the docking apparatus on the test head. The docking apparatus may include an actuator mechanism which draws the two segments of the dock together, thus docking the test head; this is referred to as "actuator driven" docking. The docking apparatus, or "dock" has numerous important functions, including: (1) alignment of the test head with the handling apparatus, (2) pulling together, and later separating, the test head and the handling apparatus, (3) providing pre-alignment protection for electrical contacts, and (4) latching or holding the test head and the handling apparatus together.
According to the in TEST Handbook (5th Edition© 1996, in TEST Corporation), "Test head positioning" refers to the easy movement of a test head to a handling apparatus combined with the precise alignment to the handling apparatus required for successful docking and undocking. A test head manipulator may also be referred to as a test head positioner. A test head manipulator combined with an appropriate docking means performs test head positioning. This technology is described, for example, in the aforementioned in TEST Handbook. This technology is also described, for example, in U.S. Pat. Nos. 5,608,334, 5,450,766, 5,030,869, 4,893,074, 4,715,574, and 4,589,815, which are all incorporated by reference for their teachings in the field of test head positioning systems. The foregoing patents relate primarily to actuator driven docking. Test head positioning systems are also known where a single apparatus provides both relatively large distance maneuvering of the test head and final precise docking. For example, U.S. Pat. No. 6,057,695, Holt et al., and U.S. Pat. Nos. 5,900,737 and 5,600,258, Graham et al., which are all incorporated by reference, describe a positioning system where docking is "manipulator driven" rather than actuator driven. However, actuator driven systems are the most widely used, and the present invention is directed towards them.
In the typical actuator driven positioning system, an operator controls the movement of the manipulator to maneuver the test head from one location to another. This may be accomplished manually by the operator exerting force directly on the test head in systems where the test head is fully balanced in its motion axes, or it may be accomplished through the use of actuators directly controlled by the operator. In several contemporary systems, the test head is maneuvered by a combination of direct manual force in some axes and by actuators in other axes.
In order to dock the test head with the handling apparatus, the operator must first maneuver the test head to a "ready to dock" position, which is close to and in approximate alignment with its final docked position. The test head is further maneuvered until it is in a "ready to actuate" position where the docking actuator can take over control of the test head's motion. The actuator can then draw the test head into its final, fully docked position. In doing so, various alignment features provide final alignment of the test head. A dock may use two or more sets of alignment features of different types to provide different stages of alignment, from initial to final. It is generally preferred that the test head be aligned in five degrees of freedom before the fragile electrical contacts make mechanical contact. The test head may then be urged along a straight line, which corresponds to the sixth degree of freedom, that is normal to the plane of the interface (typically the plane of the probe card or DUT board); and the contacts will make connection without any sideways scrubbing or forces which can be damaging to them.
As the docking actuator is operating, the test head is typically free to move compliantly in several if not all of its axes to allow final alignment and positioning. For manipulator axes which are appropriately balanced and not actuator driven, this is generally not a problem. However, actuator driven axes generally require that compliance mechanisms be built into them. Some typical examples are described in U.S. Pat. Nos. 5,931,048 to Slocum et al and 5,949,002 to Alden. Often compliance mechanisms, particularly for non-horizontal unbalanced axes, involve spring-like mechanisms, which in addition to compliance add a certain amount of resilience or "bounce back." Further, the cable connecting the test head with the ATE mainframe is also resilient. As the operator is attempting to maneuver the test head into approximate alignment and into a position where it can be captured by the docking mechanism, he or she must overcome the resilience of the system, which can often be difficult in the case of very large and heavy test heads. Also, if the operator releases the force applied to the test head before the docking mechanism is appropriately engaged, the resilience of the compliance mechanisms may cause the test head to move away from the dock. This is sometimes referred to as a bounce back effect.
An exemplary positioner system utilizing motor driven, six degrees of freedom adjustment is illustrated in U.S. Pat. No. 7,235,964, which is incorporated herein by reference.


A system for and method of targeting a broadcast message to a subset of potential electronic receivers in a broadcast network is presented. The system and method may comprise collecting identifying information associated with designated electronic receivers of a targeted broadcast message, generating, using a computer processor, a data set structure using the identifying information, associating the data set structure with the targeted broadcast message, and broadcasting the targeted broadcast message and the data set structure to a plurality of electronic receivers, wherein the data set structure provides information allowing at least one of the plurality of electronic receivers to determine whether the targeted broadcast message is targeted to the at least one electronic receiver.

In various networking contexts, it is often necessary to send messages from one node to a designated subset of other connected nodes. Two methods of messaging commonly used are point-to-point (a.k.a. unicast) and broadcast.
Point-to-point messaging assumes every node is addressable via a unique identifier and the sender node addresses and sends a copy of a message to each designated receiver node. It is the most common method of delivering messages in Internet Protocol (IP) networks. Point-to-point messaging is expensive in terms of resources when the number of designated receivers is large since a given message may be duplicated and sent over many different paths.
Broadcast messaging involves sending a single message simultaneously to all receivers. Examples are over-the-air (broadcast) television and cable and satellite content delivery. In broadcast messaging, there is not a built-in mechanism for limiting a message to a subset of designated receivers.

System for and method of targeting broadcast messages


In one embodiment, an electronic package includes a substrate having a plurality of lands embedded within an insulating layer. Conductive patterns are disposed on at least a portion of a respective land top surface. An electronic device is electrically connected to the conductive patterns and a package body encapsulating the top surface of the insulating material and the electronic device, wherein the bottom land surfaces are exposed to the outside. In another embodiment, the top land surfaces and the top surface of the insulating layer are substantially co-planar and the conductive patterns further overlap portions of the top surface of the insulating layer.

The present invention relates, in general, to electronics, and more particularly, to semiconductor packages, structures thereof, and methods of forming semiconductor packages.
Electronic devices, such as semiconductor dies are conventionally enclosed in plastic packages that protect the semiconductor die from hostile environments and that enable electrical interconnection between the semiconductor die and a next level of assembly, such as a printed circuit board (PCB) or motherboard. The elements of a typical electronic package include a conductive leadframe or substrate, an integrated circuit or semiconductor die, conductive structures, such as bond wires or solder balls that electrically connect pads on the semiconductor die to individual leads of the leadframe or substrate; and a hard plastic encapsulant material that covers the other components and forms an exterior of the semiconductor package commonly referred to as the package body. Portions of the individual leads can be exposed to electrically connect the package to the next level assembly.
There is a class of semiconductor packages referred to as near chip scale packages (CSP) that include very thin, fine pitch, and small area substrates that approximate the size of the semiconductor chip. Such features can make this type of substrate difficult to manufacture on a consistent basis particularly with ongoing industry demands to support more functionality within smaller packaged devices.
Accordingly, it is desirable to have a structure and method for forming small area substrates and associated electronic packages, which are easier to manufacture and support industry demands for more functionality and smaller devices. It is further desirable for the structure and method to be cost effective and to support alternative conductive interconnect structures.
For simplicity and clarity of illustration, elements in the figures are not necessarily drawn to scale, and the same reference numbers in different figures denote generally the same elements. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items. In addition, the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the disclosure. As used herein, the singular forms are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms "comprises," "comprising," "includes," and/or "including," when used in this specification, specify the presence of stated features, numbers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, numbers, steps, operations, elements, components, and/or groups thereof. It will be understood that, although the terms first, second, etc. may be used herein to describe various members, elements, regions, layers and/or sections, these members, elements, regions, layers and/or sections should not be limited by these terms. These terms are only used to distinguish one member, element, region, layer and/or section from another. Thus, for example, a first member, a first element, a first region, a first layer and/or a first section discussed below could be termed a second member, a second element, a second region, a second layer and/or a second section without departing from the teachings of the present disclosure. Additionally, descriptions and details of well-known steps and elements are omitted for simplicity of the description. It will be appreciated by those skilled in the art that words, during, while, and when as used herein related to circuit operation are not exact terms that mean an action takes place instantly upon an initiating action but that there may be some small but reasonable delay, such as propagation delay, between the reaction that is initiated by the initial action. Additionally, the term while means a certain action occurs at least within some portion of a duration of the initiating action. The use of word about, approximately or substantially means a value of an element is expected to be close to a state value or position. However, as is well known in the art there are always minor variances preventing values or positions from being exactly stated. Unless specified otherwise, as used herein the word over or on includes orientations, placements, or relations where the specified elements can be in direct or indirect physical contact. Unless specified otherwise, as used herein the word overlapping includes orientations, placements, or relations where the specified elements can at least partly coincide or align in the same or different planes. It is further understood that the embodiments illustrated and described hereinafter suitably may have embodiments and/or may be practiced in the absence of any element that is not specifically disclosed herein.

Electronic package structure having insulated substrate with lands and conductive patterns


A circuit having an array of Analog-to-Digital Converters (ADCs); a sampling order selector configured to select a sampling order of the ADCs and output corresponding sampling order control words; sampling pulse generators coupled between the sampling order selector and the respective ADCs, and configured to output respective sampling pulses based on the respective sampling order control words, wherein the ADCs are configured to sample and convert analog data into digital data in response to the sampling pulses; and a single clock generator configured to distribute a delay-matched clock to each of the ADCs in parallel, to each of the sampling pulse generators in parallel, and to the sampling order selector.

An Analog-to-Digital Converter (ADC) array is configured to convert analog data into digital data. Conventional ADC arrays route a plurality of evenly distributed clock phases to the individual ADCs, initiating time-interleaved sampling and conversion. The sampling clock for the individual ADCs is generated with a delay chain or a central Delay Locked Loop (DLL), and the individual sampling clock phases are distributed to the individual ADCs. These conventional ADC arrays suffer from delay buffer mismatch, clock routing mismatch, high routing for the large number of delay matched clock lines, and scrambling difficulties.


The modular shelving system with highly flexible use has at least one first module having supporting feet of a bottom shelf and a top shelf connected to one another by uprights, said feet comprising adjustment means for the perfectly horizontal arrangement of said bottom shelf and said top shelf so that each of said uprights is loaded with a peak or axial load so as to obtain a capacity of said shelving system that is substantially equal to the nominal design load thereof.

Plastic modular shelving has been available on the market for some time comprising plastic shelves and plastic uprights and modular metal shelving comprising sheet metal shelves and uprights and other sheet metal components.
Such modular shelving systems have usually a plurality of modules having bottom shelves, middle shelves and top shelves that can be assembled in various configurations.
The advantage provided by a modular shelving system lies in the fact that the user can assemble the modules of the shelving system as they prefer and particularly according to the available space where the shelving system must be placed. Therefore, the modules can be assembled on top of one another so as to make a shelving system with a vertical extension especially in a room with a very high ceiling or the modules can be placed alongside one another to make a shelving system with a horizontal extension.
In the event that a shelving system is made with modules alongside one another, the user can decide on the number of shelves that each module can have. Therefore, a shelving system can be made having for example a first module with three shelves (a bottom shelf, a middle shelf and a top one), supported by the relative uprights, alongside a second module with only two shelves (a bottom one and a top one).
In this configuration, the top shelf of the first module and the top shelf of the second module are not coplanar with one another but are staggered in height by an amount equal to the thickness of the middle shelf interposed between two adjacent lengths of the uprights.
The two modules therefore have different heights and are aesthetically unpleasing and functionally the presence of a step between one module and the other is a drawback.
The task of the present invention is, therefore, that of eliminating the drawbacks complained of in the prior art.

Modular shelving system with highly flexible use


The invention is a novel circuit wherein maximum shove is achieved yet the transducer's height profile is minimized. The profile is minimized by using mated beveled surfaces on an annular magnet and the top plate which prevents the top plate from reaching saturation and reduces the reluctance f the magnetic flux path. A novel anti-fringe geometry to reduce flux leakage and net saturation in the center post improves the magnetic reluctance of the circuit. An external housing assembly is provided with integral suspension elements for radial stiffness and axial compliance and for aligning the circuit within the housing to prevent cocking and resulting distortion.

1. Field of the Invention
The present invention relates generally to electrodynamic, moving voice coil actuators capable of converting energy between electrical and mechanical form and, more particularly, to a diaphragm loudspeaker and momentum or inertial type voice coil actuators that utilize a high energy axially polarized biasing magnet and a multi-component suspension for alignment of the moving coil.
2. Background of Invention
Loudspeakers and momentum type transducers historically have utilized two basic electrodynamic structures based upon a magnetic circuit described in U.S. Pat. No. 2,698,917 (A. T. Van Urk, et al) which describes the use of a ferromagnet having a substantially flat, thin permanent magnet, where the smallest dimension of the magnet is parallel with the direction of magnetization. Of the two most basic descriptions of the substantially flat magnet, the most common is the use of an annular magnet adjacent to a bottom plate with a center post to form one magnetic pole and a top plate with a central hole, creating an annular air gap with the center post to form the second magnetic pole. The second basic description is a disk shaped magnet without a central aperture that has a first pole defined as a top plate having the same as or larger diameter than the magnet, and a second pole formed by a pot type structure where the magnet is centrally aligned with the pot and an annular airgap is formed between the upper edge of the pot and the magnetic top plate.
The annular magnet type electrodynamic motor structure has found a very wide use because the magnet material is inexpensive, and because of the fact that assembly and magnetization are simple to accomplish. However, this design has significant drawbacks. The magnetic leakage flux at the outer edge of the magnetic assembly is strong. When this structure is placed near a CRT or Plasma type video display, the display equipment is degraded. Further, the low magnetic flux output of the ferromagnetic material requires substantial cross-sectional area of the magnet system (transversely to the axis of symmetry). The resulting requisite large physical dimensions are problematic for many new product design considerations.
The pot type magnetic structure gained significant commercial viability with the introduction of rare earth magnets, primarily those containing Neodymium, Iron and Boron. U.S. Pat. No. 5,390,257 (Oslac, et al) describes a system which is based on an axially magnetized, coin or disk-shaped magnet, usually of NdFeB material. The high flux capacity of the NdFeB magnet enables reasonable efficiency with the magnet contained within the voice coil dimension. However, since the area of the magnet is limited by the coil diameter, it is also limited how large magnetic flux can be obtained. Further, it is common to add an axial hole centrally through the assembly to obtain ventilation and this addition will reduce the magnetic flux, overall efficiency, and bandwidth. On the positive side, the system has a moderate depth and cross-sectional area in relation to the coil diameter, something which is very advantageous in some applications.
As is well known in the art, the force generated by an electrodynamic transducer is a product of the current, I, length of coil wire, L and flux density, B so that F=iL{circle around (x)}B. The length of the coil wire that is within the annular magnetic gap is defined as the length, L. This force is what creates the movement of the coil and subsequently generates sound. Building on this concept, inertial voice coil actuators have been used to acoustically stimulate semi-rigid structures to radiate sound. In this application, voice coil actuators have been attached to structures that are relatively large to act as a soundboard e.g. a wall in a room. The wall of the room, when acoustically driven, radiates sound. As is well known in the art, the force generated by an electrodynamic transducer is a product of the current, I, length of coil wire, L and flux density, B so that F=iL{circle around (x)}B. The length of the coil wire that is within the annular magnetic gap is defined as the length, L. This force is what creates the movement of the coil and subsequently generates sound.
A number of inventions for voice coil actuators have been patented among them U.S. Pat. No. 2,341,275 to Holland for Sound Reproducing Instrument; U.S. Pat. No. 3,609,253 for Loudspeaker with Improved Voice Coil Suspension; U.S. Pat. No. 3,728,497 to Komatsu for Dynamic Loudspeaker Using Wall as Diaphragm; U.S. Pat. No. 4,297,537 to Babb for Dynamic Loudspeaker; U.S. Pat. No. 4,951,270 for Audio Transducer Apparatus; U.S. Pat. No. 5,335,284 to Lemons for Coneless, No-Moving-Parts Speaker; and U.S. Pat. No. 5,473,700 Fenner, Jr. for High Gain Transducer and U.S. Pat. No. 3,524,027 to Thurston, et al.
It is known to employ a compliant suspension structure formed in the base wall of a momentum type transducer that is in closest proximity to the soundboard. At the centerline of the base wall is either a threaded insert or protruding threaded bolt. The momentum transducer is then cantilevered off a threaded rod which is mechanically attached to the soundboard. Two problems arise with this design; it significantly increases the transducer's standoff height and profile and, further, forces acting normal to the protruding threaded element are amplified such that they may cause structural failure in the mechanical attachment.
In practice, the annular magnet, magnetizable plates, external housing and structural attachment point as presently known in the art, comprise a system that is large and heavy relative to the total dynamic force the actuator is capable of generating. If the external housing is mounted on a vertical facing surface such as a wall, large bending moments will be placed on the structural attachment point which may be translated to the coil. In sum, the present state of the art provides electrodynamic transducers that are plagued with well known problems of low power handling, limited frequency response, high levels of sound distortion, substantial size and mass, mechanical complexity and high production costs.
Recent innovations include magnetic materials that have produced magnets with substantially greater magnetic energy than ceramic magnets. These magnets have necessitated the redesign of the magnetic circuit to take advantage of the higher magnetizing flux while reducing the volume of the magnet material consumed, thus reducing its size while simultaneously increasing its force density per unit volume. However, these prior art voice coil actuators are not typically designed with suspension systems adequate for actuators driving relatively large structures such as walls and their application in those contexts results in some of the same short falls as was previously known, especially relative to sound quality and distortions.

Magnetic circuit for electrodynamic moving voice coil actuators


A method for manufacturing a part includes fabricating an object in an additive fabrication stage, the object including a solid mold forming a cavity in the shape of a part with uncured or incompletely cured build material disposed therein. The build material in the cavity is cured in a curing stage that occurs at least partially after the additive fabrication stage. The build material undergoes a phase change mechanism occurring during the additive fabrication stage and a distinct polymerization mechanism occurring during the curing stage and at least partly after the additive fabrication stage of the object and cures the build material by a polymerization process.

This invention relates to a manufacturing process with a delayed curing step.
Some manufacturing techniques use molds to fabricate parts. A mold generally has a predefined shape and is filled with a build material (e.g., a molten material such as a molten metal or plastic). The build material solidifies, yielding the part. The part can then be removed, for example, by destroying or otherwise removing the mold.
Molds are often fabricated from metallic material (e.g., steel or aluminum) and are precision-machined to form the features of a desired part. When designing parts for molding, care must be taken to ensure that the parts are compatible with the molding process. For example, the material used for the part, the desired shape and features of the part, the material of the mold, and the properties of the molding machine must all be taken into account when designing a part.


A device is provided for inspecting the inner surface of a hollow body, such as a metal container with a cylindrical standing wall and a bottom. Initially, the hollow body and a light source are placed at chosen positions relative to each other, such that the light source can light the inner surface approximately uniformly. A video camera for inspecting the inner surface is positioned such that the direction of lighting and the direction of inspection of each portion of the inner surface approximately coincide.

The invention relates to the inspection of the inside of a body, for example the inner surface of a metal container such as a preserves can.
For the inspection of the bottom of such a can a video camera can be placed above the can for inspection and the interior of the can may be lighted more or less diffusely by means of a continuously or stroboscopically operating light source.
For the standing inner wall of a preserves can such a method of inspection is sometimes less suitable. The purpose of the invention is to cause the inspection to be performed such that detection of faults can take place with the greatest possible reliability and with simple means.

Device for inspecting the inner wall of a body


The invention relates to a pivoting device for a cover (7) by means of which an insertion opening (3) of a cassette holder of a magnetic-tape-cassette apparatus can be closed, which cover can be pivoted into an open position by a magnetic-tape cassette (5) during insertion thereof, in order to expose the insertion opening (3), after which it returns into its closed position, and which cover is again pivoted into the open position by the magnetic-tape cassette (5) during the outward movement thereof until the removal of the magnetic-tape cassette (5) from the cassette holder, the strip-shaped cover (7) being secured to a pivoting spindle (9) by one of its long edges (7b), which cassette holder can be lowered into a play position with the magnetic-tape cassette inserted. A sensing lever (11) is pivotable about a sensing-lever spindle (13) parallel to the pivoting spindle (9), carries a sensing element (17) to sense the upper main wall (21a) of the magnetic-tape cassette (5), and between the sensing-lever spindle (13) and the sensing element (17) carries a toothed rack meshing with a toothed wheel (25) carried by the pivoting spindle (9).

The invention relates to a pivoting device for a cover by means of which an insertion opening of a cassette holder of a magnetic-tape-cassette apparatus can be closed, which cover can be pivoted into an open position by a magnetic-tape cassette during insertion thereof, in order to expose the insertion opening, after which it returns into its closed position, and which cover is again pivoted into the open position by the magnetic-tape cassette during the outward movement thereof until the removal of the magnetic-tape cassette from the cassette holder, the strip-shaped cover being secured to a pivoting spindle by one of its long edges, which cassette holder can be lowered into a play position with the magnetic-tape cassette inserted.
Such a pivoting device for a cover is known from EP 156 443 B1. The cover is strip-shaped and has substantially the same dimensions as the insertion opening of the cassette holder of a magnetic-tape-cassette deck; it serves for closing the insertion opening in order to avoid the undesirable visual impression presented by an open hole and to inhibit undesirable access. Moreover, such a cover protects the interior of the deck against the ingress of dust and other contaminants. The cover is arranged on supporting arms which project substantially perpendicularly from the cover into the apparatus. The free ends of the supporting arms have lugs engaging with pins of the deck frame. The pivotal axis thus defined extends parallel to the upper edge of the cover. The supporting arms and the pivots constitute a pivoting device which is actuated by guide pins of the cassette holder. The cover is opened to insert a cassette. At the end of the insertion movement as the cassette holder is lowered the guide pins, which act upon elastic tongues, pull the cover into a closed position. When the magnetic-tape cassette is ejected the guide pins lift and pivot the cover into the open position.
U.S. Pat. No. 3,800,328 describes a pivoting device for a cover of the insertion opening of the cassette holder of a magnetic-tape-cassette apparatus in which the strip-shaped cover is secured to a pivoting spindle at one of its long edges. This pivoting spindle has two parts and the two interengaging parts are each spring-loaded to swing the cover before the insertion opening first from one side and then from the other side. During insertion of a cassette the front wall of the cassette pushes the cover aside, thereby tensioning a spring which enables the spring-assisted return into the initial position. Once the cassette has been inserted fully the cassette liberates the cover and said spring swings the cover back into the initial position. When the cassette is slid out of the apparatus it also swings the cover aside, this time in the opposite direction, and the second spring is tensioned to ensure that after removal of the cassette the cover returns into its initial position in which it covers the insertion opening.

Pivoting device for a cover of the cassette holder of a magnetic-tape cassette apparatus


The disclosure concerns a semiconductor memory device that includes memory cells that store data by accumulating or discharging an electric charge; memory cell arrays having a plurality of the memory cells disposed in a matrix; a plurality of word lines connected to the memory cells arrayed in rows of the memory cell arrays; a plurality of bit lines connected to the memory cells arrayed in columns of the memory cell arrays; a plurality of dummy cells arrayed in a row direction of the memory cell arrays and are connected to the bit lines; sense amplifiers detecting data within the memory cells by using an average value of electric characteristics of the dummy cells that store mutually different digital data as a reference signal; and a plurality of switching elements electrically connecting four or more of the bit lines in order to generate the reference signal.

1. Field of the Invention
The present invention relates to a semiconductor memory device.
2. Background Art
Semiconductor memory devices such as a dynamic random access memory (DRAM), a floating body cell (FBC), and a ferroelectric memory detect data "0" or "1", which is stored in a memory cell, by using a reference signal corresponding to an intermediate value between data "0" and data "1". An intermediate voltage or an intermediate resistance between data "0" and data "1" is used as the reference signal.
There is a method of providing a reference generating circuit that generates a reference signal. According to this method, the reference generating circuit supplies a reference signal which is common to a certain memory cell array. In this case, provision of one reference generating circuit is sufficient for a certain memory cell or for a plurality of memory cell arrays. Therefore, the area of the semiconductor memory device can be made relatively small.
However, because a predetermined reference signal is used in common for memory cell arrays, this has a possibility of a difficulty in identifying data when a threshold value or a resistance of memory cells varies due to changes in temperature and depending on manufacturing processes.
On the other hand, a method of providing a dummy cell in each bit line is available for generating a reference signal. According to this method, a dummy cell that stores data "0" is connected with a dummy cell that stores data "1", thereby generating an intermediate value between data "0" and data "1".
For example, a voltage, which is based on a sum of a cell current in a dummy cell that stores data "0" and a cell current in a dummy cell that stores data "1", is generated as a reference voltage. Further, a voltage based on a current, which is two times a cell current flowing through a memory cell to be detected, is compared with a reference voltage. With this arrangement, the semiconductor memory device can detect data "0" or "1" stored in the memory cell. Because a dummy cell is provided for each bit line, a variation in a threshold value or a resistance of a memory cell causes a variation in a threshold value or resistance of the dummy cell. Therefore, the method using a dummy cell makes it easier to identify data than the method using a reference generating circuit.
However, because the two dummy cells that store data "0" and data "1" respectively are used to generate reference signals, the reference signals have a large variation among them due to changes in temperature and depending on manufacturing processes. It is generally known that when reference signals have a large variation, data detection sensitivity in memory cells is deteriorated. Therefore, in order to further improve the data detection sensitivity, the variation of reference signals needs to be minimized (See Japanese Patent Application Laid-open No. 2003-100080 Publication).


A system and method are provided to organize updates on a mobile device. The organization of the updates can be controlled according to something detectable on the mobile device which can be correlated to something detectable in the updates. For example, updates to be displayed on the mobile device can be organized based on context provided by the mobile device, such that more relevant updates are distinguishable from those that may be less relevant. In this way, all updates are accessible to the user, but those that are deemed to be particularly relevant may be more visible and more easily accessed to avoid the need to sort through or scroll through large lists of new updates.

Mobile communication devices are often used to communicate via several different media. For example, a smart phone or personal digital assistant (PDA) having wireless communication capabilities may be used to participate in cellular telephone conversations, to exchange email, to exchange SMS or multimedia messaging service (MMS) messages, to participate in instant messaging (IM) or other conversational type message exchanges, to post or receive social networking updates, receive data from web-based services, etc.
Often new incoming messages, data, or other events trigger or have associated therewith an update that is provided on the device to indicate to the user that something has happened. For example, a social media application may provide an update to the device when a friend has posted something to their account.

System and method for controlling updates on a mobile device


A multilayer compensator includes one or more polymeric first layers and one or more polymeric second layers. The first layers comprise a polymer having an out-of-plane (Δnth) birefringence not more negative than −0.01 and not more positive than +0.01. The second layers comprise an amorphous polymer having an out-of-plane birefringence more negative than −0.01 or more positive than +0.01. An overall in-plane retardation (Rin) of the multilayer compensator is greater than 20 nm and the out-of-plane retardation (Rth) of the multilayer compensator is more negative than −20 nm or more positive than +20 nm. The in-plane retardation (Rin) of the one or more first layers is 30% or less of the overall in-plane retardation (Rin) of the multilayer compensator.

Liquid crystals are widely used for electronic displays. In these display systems, a liquid crystal cell is typically situated between a pair of polarizer and analyzers. An incident light polarized by the polarizer passes through a liquid crystal cell and is affected by the molecular orientation of the liquid crystal, which can be altered by the application of a voltage across the cell. The altered light goes into the analyzer. By employing this principle, the transmission of light from an external source including ambient light, can be controlled. The energy required to achieve this control is generally much less than required for the luminescent materials used in other display types such as cathode ray tubes (CRT). Accordingly, liquid crystal technology is used for a number of electronic imaging devices, including but not limited to digital watches, calculators, portable computers, and electronic games for which light-weight, low-power consumption and long-operating life are important features.
Contrast, color reproduction, and stable gray scale intensities are important quality attributes for electronic displays, which employ liquid crystal technology. The primary factor limiting the contrast of a liquid crystal display (LCD) is the propensity for light to "leak" through liquid crystal elements or cells, which are in the dark or "black" pixel state. Furthermore, the leakage and hence contrast of a liquid crystal display are also dependent on the direction from which the display screen is viewed. Typically the optimum contrast is observed only within a narrow viewing angle range centered about the normal incidence to the display and falls off rapidly as the viewing direction deviates from the display normal. In color displays, the leakage problem not only degrades the contrast but also causes color or hue shifts with an associated degradation of color reproduction.
LCDs are quickly replacing CRTs as monitors for desktop computers and other office or household appliances. It is also expected that the number of LCD television sets with a larger screen size will sharply increase in the near future. However, unless problems of viewing angle dependence such as hue shift, degradation in contrast, and an inversion of brightness are solved, LCD's application as a replacement of the traditional CRT will be limited.
A Vertically-Aligned liquid crystal display (VA-LCD) offers an extremely high contrast ratio for normal incident light. FIG. 2A and FIG. 2B are the schematics of VA liquid crystal cell in OFF 201 and ON 203 states. In its OFF state, the liquid crystal optic axis 205 is almost perpendicular to the substrate 207, FIG. 2A. With an applied voltage, the optic axis 205 is tilted away from the cell normal, FIG. 2B. In the OFF state, light does not see the birefringence in the normal direction 209, giving the dark state that is close to that of orthogonally crossed polarizers. However, obliquely propagated light 211 picks up retardation giving light leakage. This results in a poor contrast ratio in some viewing angle range.
A bend aligned nematic liquid crystal display, also referred as an Optically Compensated Bend Liquid Crystal Display (OCB-LCD) uses a nematic liquid crystal cell based on the symmetric bend state. In its actual operation, the brightness of the display using the bend aligned nematic liquid crystal cell is controlled by an applied voltage or field that leads to a different degree in the bend orientation within the cell as shown in FIG. 3A (OFF) 301 and FIG. 3B (ON) 303. In both states, the liquid crystal optic axis 305 takes symmetric bend state around the cell middle plane 307. In the On state, the optic axis becomes substantially perpendicular to the cell plane except near the cell substrates 309. OCB mode offers faster response speed that is suitable to the liquid crystal display television (LCD-TV) application. It also has advantages in viewing angle characteristic (VAC) over conventional displays, such as Twisted Nematic liquid crystal display (TN-LCD)
The above-mentioned two modes, due to their superiority over the conventional TN-LCD, are expected to dominate the high-end application such as LCD-TV. However, practical applications of both OCB and VA-LCDs require optical compensating means to optimize the VAC. In both modes, due to the birefringence of liquid crystal and crossed polarizer, VAC suffers deterioration in contrast when the displays are viewed from oblique angles. Use of biaxial films have been suggested to compensate the OCB (U.S. Pat. No. 6,108,058) and VA (JP1999-95208) LCDs. In both modes, liquid crystals align sufficiently perpendicular to the plane of the cell in ON (OCB) or OFF (VA) states. This state gives positive Rth, thus the compensation films have to have sufficiently large negative Rth for satisfactory optical compensation. The need for a biaxial film with a large Rth is also common for Super Twisted Nematic Liquid Crystal Display (STN-LCD).
Several methods of manufacturing biaxial films with sufficient negative value of Rth suitable for compensating LCD modes such as OCB, VA and STN have been suggested.
US 2001/0026338 discloses a use of retardation increasing agent in combination with triacetylcellulose (TAC). The retardation-increasing agent is chosen from aromatic compounds having at least two benzene rings. By stretching agent doped TAC, one can generate both Rth and Rin. The problems with this method is that the amount of the doping agent. To generate the desired effects of increasing Rth and Rin, the necessary amount of agent can be high enough to cause unwanted coloration, or movement (diffusion) of the agent into other layers in the LCD with a resulting loss of Rth and Rin and undesired chemistry in these adjacent layers. With this method, it is difficult to control the values of Rth and Rin independently.
Sasaki et al. proposes (US 2003/0086033) the use of cholesteric liquid crystal disposed on the positively birefringent thermoplastic substrate. The pitch of the cholesteric liquid crystal (CHLC) is shorter than the wavelength of the visible light, thus properly aligned CHLC exhibits form birefringence giving negative Rth. Rin is controlled by adjusting the stretching amount of the thermoplastic substrate. The method enables one to adjust Rth and Rin separately. However, the use of short pitch CHLC not only makes the manufacturing cost high but also complicates the processing due to the alignment procedure.
JP2002-210766 discloses the use of propionyl or butyryl substituted TAC. They show higher birefringence than ordinary TAC. Thus, by biaxially stretching the substituted TAC film, one generates Rin and Rth. The method does not require any additional coating or layer but it suffers a difficulty of independent control of Rin and Rth.
Thus, it is a problem to be solved to provide a multilayer optical compensator with independently controlled Rth and Rin that can be readily manufactured.

This patent is subject to a terminal disclaimer.

Multilayer optical compensator, liquid crystal display, and process


A turbine engine assembly includes: a fan assembly; a turbine coupled to the fan assembly through a gearbox; a stationary component; and an assembly extending between the gearbox and the stationary component to couple the gearbox to the stationary component, wherein the assembly includes at least one vibration-reducing mechanism configured to isolate a vibratory response of the gearbox from the stationary component.

The present disclosure relates generally to speed-reducing gearbox assemblies for use with turbine engines and, more specifically, to systems and methods of reducing vibratory responses induced into at least one of an engine and an airframe from a gearbox assembly.
At least some known gas turbine engines, such as turbofans, include a fan, a core engine, and a power turbine. The core engine includes at least one compressor, a combustor, and a high-pressure turbine coupled together in a serial flow relationship. More specifically, the compressor and high-pressure turbine are coupled through a shaft to form a high-pressure rotor assembly. Air entering the core engine is mixed with fuel and ignited to form a high energy gas stream. The high energy gas stream flows through the high-pressure turbine to rotatably drive the high-pressure turbine such that the shaft rotatably drives the compressor. The gas stream expands as it flows through a power or low-pressure turbine positioned aft of the high-pressure turbine. The low-pressure turbine includes a rotor assembly having a fan coupled to a drive shaft. The low-pressure turbine rotatably drives the fan through the drive shaft, and turbine engine performance is enhanced when the low-pressure turbine operates at a relatively high rotational speed and when the fan operates at a relatively low rotational speed and with a low pressure ratio.
Many modern commercial turbofans are manufactured with increasingly large bypass ratios to facilitate improving engine efficiency. However, increasing the bypass ratio of the turbofan results in an increased fan size and fan tip speed, which must be controlled to maintain the efficiency of the turbofan. As such, at least some known turbofans include a speed-reducing gearbox coupled along the drive shaft between the low-pressure turbine and the fan, such that the fan rotates at a different speed than the low-pressure turbine. However, speed-reducing gearboxes generally increase the weight and the complexity of the turbofan, induce vibrations to the propulsion system or the airframe of an associated aircraft, and increase noise in a passenger cabin of the aircraft. Therefore, it is desired to have a turbofan that induces less vibration and noise to the associated aircraft.

Turbine engine assembly and method of manufacturing thereof


In a production method of a micromachine having a space between first and second electrodes, a first electrode is formed on a substrate, and then a stopper film is formed on its surface. Next, a second insulating film is formed as to cover the stopper film. The thickness of the second insulating film is larger than a total thickness of the first electrode and stopper film. Then, second insulating film is polished. By this polishing, the stopper film is exposed to the outside to the outside, and is planarized. After forming an opening in the stopper film, a sacrifice film is burred in the opening. Surfaces of the sacrifice film and second insulating film are planarized, and a second electrode is formed on the second insulating film as to cross the sacrifice film. A space is formed between the first and second electrodes by removing the sacrifice film.

1. Field of the Invention
The present invention relates to a micromachine production method, and more particularly, to a micromachine having a frequency filter function and being capable of integrating into a semiconductor device, and a production method thereof.
2. Description of the Related Art
A microvibrator fabricated using a semiconductor process technology has features to ensure that an area occupied by each element is of small size, high quality factors (Q factors) are available and integration with other semiconductor devices is possible. Research organizations including University of Michigan have proposed to use the microvibrator as radio communication devices such as IF filters and RF filters, for instance. See Non-patent document 1, for instance.
A conventional technology of a high frequency filter for radio communication is now described with reference to FIG. 1. As shown in FIG. 1, a microvibrator 101 has a configuration as described below. A vibrator electrode 113 is arranged, through a space 121, above an output electrode 112 provided on a substrate 111. An input electrode 114 is connected to the vibrator electrode 113.
Next, operations of the microvibrator 101 are described below. When a specific frequency voltage is applied to the input electrode 114, a beam (a vibration part) 113A of the vibrator electrode 113 arranged above the output electrode 112 through the space 121 vibrates at a natural vibration frequency. A capacitance of a capacitor formed by the space 121 between the output electrode 112 and the beam (the vibration part) 113A is changed by the vibrations of the beam 113A, and this is outputted from the output electrode 112 as a voltage (See the Non-patent document 1, for instance). A high frequency filter comprising the microvibrator 101 having the above configuration enables higher Q factors to be obtained, as compared with a high frequency filter utilizing Surface Acoustic Wave (which will be hereinafter referred to as SAW) or Film Bulk Acoustic Resonator (which will be hereinafter referred to as FBAR).
A method of producing the above-described microvibrator is exemplified with reference to FIGS. 2A to 2E.
As shown in FIG. 2A, a silicon oxide film 212, a silicon nitride film 213 and a silicon oxide film 214 are sequentially formed at a silicon substrate 211. Next, a trench 215 that is to form an output electrode is formed at the silicon oxide film 214 using ordinary lithography and etching technologies.
Next, as shown in FIG. 2B, a polysilicon film 216 that works as the output electrode is formed at the silicon oxide film 214 so as to fill up the trench 215. Thereafter, the polysilicon film 216 on the silicon oxide film 214 is polished using Chemical Mechanical Planarization (CMP) to be an output electrode 217 that is obtained with the polysilicon film 216 left only in the trench 215, as shown in FIG. 2C.
Next, as shown in FIG. 2D, a silicon nitride film 218 that covers the output electrode 217 is formed on the silicon oxide film 214. Then, an opening 219 is formed in the silicon nitride film 218 on the output electrode 217 using the lithography and etching technologies. In addition, a sacrifice film 220 comprising a silicon oxide film is formed so as to fill up the opening 219. At this time, planarization of the sacrifice film 220 is carried out using polishing or the like so that the sacrifice film 220 may have the same surface as that of the silicon nitride film 218. Thereafter, a vibrator electrode 221 is formed so as to cross the sacrifice film 220.
Next, as shown in FIG. 2E, the sacrifice film 220 (refer to FIG. 2D described above) is removed selectively by etching to form a space 222 between the vibrator electrode 221 and the output electrode 217. Thereafter, an input electrode (not shown) that is to be connected to the vibrator electrode 221 is formed. In this manner, a microvibrator 201 is fabricated.
[Non-patent document 1]
C. T. -C. Nguyen, "Micromechanical components for miniaturized low-power communications (invited plenary)," proceedings, 1999 IEEE MTT-S International Microwave Symposium RF MEMS Workshop, Jun. 18, 1999, P.48-77.
However, in the above-described conventional production method, when forming the output electrode, removal of the polysilicon film on the silicon oxide film is carried out using polishing, after the polysilicon film has been buried in the trench. In this process, ideally, surface planarization is attained to permit a flat output electrode to be formed. However, practically, large dishing arises so that an output electrode of a desired shape is not obtainable. More specifically, as shown in FIG. 3, the dishing that causes the surface of the polysilicon film 216 to be largely shaved arises. The above dishing also causes the silicon oxide film 214 around the trench 215 to be shaved. When the above dishing arises, a space to be formed between the output electrode and the vibrator electrode is hardly formed according to a design value, and as a result, desired frequency characteristics are not obtainable. Particularly, when forming an output electrode having a width of several μm or more, the polysilicon film 216 is not allowed to remain as it is in a condition where the trench 215 is completely filled up with the polysilicon film 216. The above-described dishing problem is further growing particularly with an increase in a wide output electrode.
Alternatively, to suppress the dishing of the polysilicon film, there may be used a different production method, wherein before or after formation of a trench that is to form an output electrode, a polishing stopper film comprising a silicon nitride film is formed on a silicon oxide film, and a polysilicon film that works as the output electrode is then buried in the trench. However, as shown in FIG. 4, even if a polishing stopper film 231 comprising the silicon nitride film is formed on the silicon oxide film 214, the dishing also arises at the time when the polysilicon film 216 is polished.
An extent of dishing of the polysilicon film in the presence of the polishing stopper film 231 is more reduced than that of the polysilicon film in the absence of the polishing stopper film 231 shown in FIG. 3. However, the above polishing stopper film is not sufficient to suppress the dishing, the space to be formed between the output electrode and the vibrator electrode is thus hardly formed according to the design value, and as a result, desired frequency characteristics are not obtainable.
Even if over-polishing has not been applied to remove the polysilicon film on the silicon oxide film completely, it was difficult to suppress the dishing in terms of characteristics of a pad or slurry used in polysilicon polishing.


A treatment instrument including a heat transmitter that includes a treating surface and an installation surface, a substrate attached to the installation surface, and a heat generator formed on a surface of the substrate. The substrate surface and heat generator together form an uneven surface. First and second adhesion layers formed of a material having thermal conductivity and electrical insulation are provided between the installation surface and the substrate. The first adhesion layer is in close contact with the installation surface, and the second adhesion layer is in close contact with the heat generator and the substrate surface. The second adhesion layer is inserted into a recess in the uneven surface formed by the heat generator on substrate surface so as to increase the contact area between the second adhesion layer and the uneven surface.

There are treatment instruments in which a pair of grasping pieces can be opened and closed. In such treatment instruments, electric energy can be transferred to treatment surfaces of the grasping pieces to treat a treatment target grasped between the pair of grasping pieces. For example, a high-frequency current may flow between the grasping pieces through the treatment target held by the grasping pieces. When the electric energy is properly transmitted to the treatment surfaces, the treatment target may be appropriately treated.

Treatment instrument and manufacturing method of treatment instrument


A relay device transfers a plurality of original data fragments corresponding to a plurality of secret sharing values of original data to a plurality of secure computation devices, transfers, to each of the secure computation devices, a request to send a result fragment based on a secure computation result corresponding to any one of the original data fragments, and transfers the result fragment. The relay device controls timing with which the original data fragments are transferred and timing with which the request to send is transferred.

In the existing secure computation technology (see, for example, Non-patent Literature 1 and so forth), a data holder sends a plurality of fragments obtained by performing secret sharing on original data to a plurality of secure computation devices, the secure computation devices each execute processing by secure computation in a concealed state in response to an analysis request from an analyzer, and the analyzer obtains an analysis result by using responses from the plurality of secure computation devices.

Secure computation system and relay device, and method, program, and recording medium thereof

NIPPON TELEGRAPH AND TELEPHONE CORPORATION


A floor switch mounted on an elevator shaft wall has a housing from which a shaft extends. An arm has one end attached to the shaft and an opposite end attached to a roller. The roller is engaged by a switching vane mounted on an elevator car during up and down travel of the car in the shaft. As the car passes the switch, the vane rotates the arm and the shaft to move a lever which is coupled to actuate switch contacts in the housing. To avoid the engagement of the roller by the vane, a magnetic switch is mounted in the housing and is responsive to a magnet mounted on the car. The magnet mounted on the car passes the magnetic switch shortly before the vane is to engage the roller and the magnetic switch connects a coil in the housing to electrical power. The coil retracts an armature which is coupled to the lever to move the roller out of the path of travel of the vane.

The present invention relates generally to a mechanically actuated switch and, in particular, to an elevator shaft mounted switch actuated by a passing elevator car.
The German patent document DE 747 641 shows a floor switch mounted at each floor in an elevator shaft which switches control a function in the elevator car such as enabling the car doors to be opened when the elevator car enters a levelling zone at a floor. A switching vane mounted on the elevator car actuates the floor switch during passage of the elevator car. The floor switch includes a lever pivoted on the floor switch having a roller which is engaged by the switching vane. As the lever is moved by the switching vane from one position to another, a stud on the lever shifts a contact lever from a first contact onto a second contact thereby actuating the floor switch.
A disadvantage of this device is that every floor switch is actuated by the switching vane each time that the elevator car passes. The engagement of the switching vane with the floor switch roller produces unpleasant noises in the elevator car.