A large pore (metallo)aluminophosphate molecular sieve is disclosed The material has an X-ray diffraction pattern including the lines listed in Table 4 and is synthesized in the presence of 4-dimethylaminopyridine as structure directing agent.

Crystalline molecular sieves have a 3-dimensional, four-connected framework structure of corner-sharing [TO4] tetrahedra, where T is any tetrahedrally coordinated cation. Among the known forms of molecular sieve are aluminosilicates, which contain a three-dimensional microporous crystal framework structure of [SiO4] and [AlO4] corner sharing tetrahedral units, aluminophosphates (ALPOs), in which the framework structure is composed of [AlO4] and [PO4] corner sharing tetrahedral units and silicoaluminophosphates (SAPOs), in which the framework structure is composed of [SiO4], [AlO4] and [PO4] corner sharing tetrahedral units.
Molecular sieves have been classified by the Structure Commission of the International Zeolite Association according to the rules of the IUPAC Commission on Zeolite Nomenclature. According to this classification, framework-type zeolite and zeolite-type molecular sieves, for which a structure has been established, are assigned a three letter code and are described in the Atlas of Zeolite Framework Types, 5th edition, Elsevier, London, England (2001), which is herein fully incorporated by reference.
Molecular sieves are typically described in terms of the size of the ring that defines a pore, where the size is based on the number of T atoms in the ring. Other framework-type characteristics include the arrangement of rings that form a cage, and when present, the dimension of channels, and the spaces between the cages. See van Bekkum, et al., Introduction to Zeolite Science and Practice, Second Completely Revised and Expanded Edition, Volume 137, pages 1-67, Elsevier Science, B. V., Amsterdam, Netherlands (2001).
In general, molecular sieves can be divided into small, medium and large pore materials. Thus small pore molecular sieves typically have pores defined by a ring of no more than 8 T atoms and have an average pore size less than about 0.5 nm (5 Å). Medium pore molecular sieves typically have pores defined by a ring of 10 T atoms and have an average pore size about 0.5 to 0.6 nm (5 to 6 Å), whereas large pore materials have pores defined by rings of 12 or more T atoms and a pore size greater than 0.6 nm (6 Å).
Crystalline molecular sieves, as exemplified by zeolites and (metallo)aluminophosphates, are commercially important materials for petroleum processing and petrochemical applications. Because each unique structure type offers new potential for applications in catalysis and separations, there has been sustained research effort, both in industry and academia, for their discovery.
Many molecular sieves are synthesized in the presence of an organic directing agent, such as an organic nitrogen compound. For example, it is known from, for example, U.S. Pat. No. 6,680,278 that a crystalline silicoaluminophosphate molecular sieve of the CHA framework type (a small pore material), can be synthesized in the presence of an organic directing agent mixture comprising tetraethylammonium cations and one or more dimethylamino moieties selected from one or more of N,N-dimethylethanolamine, N,N-dimethylpropanolamine, N,N-dimethylbutanolamine, N,N-dimethylheptanolamine, N,N-dimethylhexanolamine, N,N-dimethylethylenediamine, N,N-dimethylbutylenediamine, N,N-dimethylheptylenediamine, N,N-dimethylhexylenediamine 1-dimethylamino-2-propanol, N,N-dimethylethylamine, N,N-dimethylpropylamine, N,N-dimethylpentylamine, , N,N-dimethylhexylamine and N,N-dimethylheptylamine. Other organic directing agents that have been used in the synthesis of CHA framework type materials include isopropylamine or di-n-propylamine triethylamine, cyclohexylamine, 1-methylamidazole, morpholine, pyridine, piperidine, diethylethanolamine, and N,N,N′,N′-tetraethylethylene diamine.
It is also known to use fluoride-containing compounds, such as hydrogen fluoride, as mineralizing agents in molecular sieve synthesis. For example, EP-A-337,479 discloses the use of hydrogen fluoride in water at low pH to mineralize silica in glass for the synthesis of ZSM-5. In addition, U.S. Patent Application Publication No. 2003/0231999 published Dec. 18, 2003 and incorporated herein by reference, discloses that aluminophosphate or silicoaluminophosphate molecular sieves having the CHA framework type can be synthesized in the presence of fluoride ions using the dimethylamino compounds disclosed in U.S. Pat. No. 6,680,278 as directing agents. However, fluoride-based syntheses pose environmental problems in that they use hydrogen fluoride in the synthesis medium and/or produce hydrogen fluoride on calcination to remove the organic directing agent from the molecular sieve product.
Currently, an entirely rational approach that leads to the synthesis of unique framework materials is not available, due to the fact that all crystalline microporous materials are metastable phases and they are kinetic products. Their discovery is therefore often serendipitous.
Our research has led to two findings: that 4-DMAPy can direct the synthesis of low-silica SAPO-CHA in a low fluoride or fluoride-free medium and in the presence of colloidal SAPO-34 seeds; and, from parallel experiments, that without SAPO-34 seeds, use of the same directing agent under no- or low-fluoride , conditions unexpectedly led to the production of the present large pore aluminophosphate designated EMM-8.
According to an article in the Chemical Journal of Chinese Universities, Vol. 22, No. 10, pages 192-195, dated October 2001, DMAPy has been used as a template in the synthesis of NK-101, an aluminophosphate. However, FIG. 1 provides a comparison of the X-ray diffraction pattern of NK-, 101 with that of EMM-8 and it is apparent from this comparison that the material of the invention is different from NK-101. In particular, in the X-ray diffraction pattern of NK-101, the most prominent diffraction peaks are at 2-theta values of approximately 17° and 19°, whereas these peaks are not present in the X-ray diffraction pattern of EMM-8.
In an article entitled "SSZ-51—A New Aluminophosphate Zeotype: Synthesis, Crystal Structure, NMR, and Dehydration Properties", published on the Web by the American Chemical Society on Jun. 23, 2004, Morris et al. report that they have synthesized and solved the structure of a new aluminophosphate zeotype framework structure, SSZ-5 1, having the empirical formula Al4(PO4)4F.C7N2H11.0.5H2O. The synthesis employs 4-dimethylaminopyridine , as a structure directing agent and requires the presence of fluoride ion as a mineralizing agent. The structure of SSZ-51 is said to be closely related to that of SAPO-40, an AFR framework type material, and to contain intersecting channels defined by 8- and 12-membered ring windows. It appears that SSZ-51 is isostructural with EMM-8.
U.S. Patent Application Publication No. 2003/0232718 published Dec. 18, 2003 discloses the synthesis of silicoaluminophosphate molecular sieves using templates that contain at least one dimethylamino moeity. The use of such templates is said to result in good quality SAPO molecular sieves of CHA framework type.
EP-A-0 324 082 discloses the synthesis of non-zeolite molecular sieves by contacting alumina or silica-alumina bodies with a liquid reaction mixture containing a reactive source of phosphorus and an organic templating agent.

Aluminophosphate molecular sieve, its synthesis and use


In accordance with a security policy regarding a setting value of an information processing apparatus, restriction information indicating whether to restrict modification of the setting value of information processing apparatus stored in a first storage unit is generated and stored in a second storage unit different to the first storage unit. Based on the restriction information stored in the second storage unit, modification of the setting value of the information processing apparatus is restricted.

Field of the Invention
The present invention relates to an information processing apparatus that processes information relating to a security policy, an information processing method, and a storage medium storing a program.
Description of the Related Art
In recent years, in usage of a digitized document, the possibility of a problem of leakage of the electronic document occurring is increasing. It is desirable for a server device or a personal computer (PC) connected to a network for an office or the like to operate in accordance with an information security policy determined for each office. An information security policy is a basic strategy relating to information security for a company overall, and consolidates the strategy for using information and preventing an intrusion from the outside and information leakage.
As devices connected to a network for an office or the like, there are peripheral apparatuses such as multifunction peripherals, in addition to PCs and server devices. As functions of a multifunction peripheral in recent years, there are those that have functions of storing image data in the multifunction peripheral and providing a file service to a PC, in addition to transmitting or printing an image. Complying with an information security policy similarly to a server device is also required for such a multifunction peripheral.
When a security policy is set, specific setting values relating to the security policy are fixed values, and writing by editing or the like is restricted. In such a case, information for restricting writing is saved internally. In accordance with such information for restricting writing, even if a user tries to edit a setting value for which writing is restricted by the security policy, a writing operation is prohibited.
An image forming apparatus for which ROM capacity is high, such as a sophisticated image forming apparatus, saves the information for restricting writing in the ROM. At a time of activation, the information for restricting writing is read from the ROM, and it is determined whether writing is restricted for a specific setting value. However, in an image forming apparatus such as a low-price model, because ROM capacity is not sufficient, there is a need to reduce as much as possible information that is saved in the ROM. In addition, if information for restricting writing is saved in the ROM, the ROM capacity will be pressed. To solve such a problem, an apparatus needing a security policy at activation time actively obtains the security policy from a management apparatus at activation time. Using an obtained security policy to perform access control (writing control) has been proposed (Japanese Patent Laid-Open No. 2004-94401).
However, in the method of Japanese Patent Laid-Open No. 2004-94401, even if it becomes possible to reduce data saved in the ROM, access to a management server at activation time becomes necessary each time. For example, a management server becomes necessary for a low-price model image forming apparatus, and extra cost is incurred.

Information processing apparatus, information processing method, and storage medium storing program


A computer-implemented method for sensing streaming data comprises recursively sampling an input stream of data using overlapping windowing to obtain at least one previous measurement regarding the input data stream, and employing the at least one previous measurement for obtaining a subsequent measurement.

In the field of signal processing, the signals of interest can be represented sparsely by using few coefficients in an appropriately selected orthonormal basis. Exemplarily, the Fourier basis is used for band limited signals or wavelet bases for piecewise continuous signals, such as images. While a small number of coefficients in the respective bases are enough to represent such signals, the Nyquist/Shannon sampling theorem suggests a sampling rate that is at least twice the signal bandwidth. Such a sampling rate is known in the art as the Nyquist rate. In many cases, the indicated sampling rate is much higher than the sufficient number of coefficients.
Recently, the Compressed Sensing (CS) framework was introduced aiming at sampling the signals not according to their bandwidth, but rather in accordance with their information content, that is, the number of degrees of freedom of the signal. This paradigm for sampling suggests a lower sampling rate compared to the classical sampling theory for signals that have sparse representation in some given basis. Typical signals that arise naturally in astronomy and biomedical imaging fit this model.

Method for compressed sensing of streaming data and apparatus for performing the same


A gate assembly for a trailer which provides for the gate assembly to be moved between a closed position in which both a lower gate member and an upper gate member are stacked and extend upwardly one upon the other and an extension position in which the lower gate member extends forwardly from an end of the deck as an extension of the deck and the upper gate member extends upwardly from the end of the lower gate member.

Known front gate assemblies for trailers suffer the disadvantage that they do not provide for extension of the deck of the trailer forwardly or, if they do provide for extension of the deck forwardly, do not provide in an extended position a forward fence to prevent movement of loads forwardly of the deck in the extended position.
Known tail gate assemblies suffer one or more of the disadvantages that they do not provide a ramp for on and off loading, or if they provide a ramp for on and off loading, they do not provide ramps adjustable for different usages such as for four-wheel vehicles having different widths of tire spacings and for persons walking up or down the ramps. As well, many tail gate assemblies including ramps block the rearward vision through the tail gate assemblies which can be disadvantageous to persons driving vehicles.


A network-attached system, device, and method supports multiple storage tiers. Data may be migrated between storage tiers, for example, based on a data migration policy. A plurality of dedicated storage devices that provide a plurality of storage tiers having different characteristics are managed using a disk control protocol and data is migrated between storage tiers based on predetermined storage criteria.

In today's information age, computer and communication systems often require large amounts of data storage. More and more frequently, access to data storage is being provided over communication networks. Among other things, this makes data storage resources available to a number of data storage users.
FIG. 1 shows a conceptual view of a storage system 106 that is accessed by a number of users 102 over a communication network 104, such as an Ethernet local area network (LAN), as is known in the art. The users 102 represent various entities that access storage services provided by the storage system 106 over the communication network 104. The users 102 can be inside or outside of the storage system 106 (for example, as will be discussed below, a server within the storage system 106 may provide storage services as well as access storage services over the communication network 104).
There are generally two types of network-based data storage technologies that are used in the storage system 106, namely Storage Area Network (SAN) and Network-attached Storage (NAS). SAN is traditionally defined as the provision of raw block data using a Fibre Channel (FC) network. NAS typically provides file services over the LAN 104.
FIG. 2 shows a SAN-based storage system as is known in the art. The SAN-based storage system includes a number of storage devices 210 in communication with a number of servers 206 over a FC network 208. The FC network 208 and the storage devices 210 represent a SAN, and the servers 206 are essentially users of the SAN. Each of the servers 206 typically supports a particular application. For example, there may be separate servers for email and World Wide Web applications. The storage resources provided by the storage devices 210 are typically partitioned, and a separate portion of the storage resources is allotted to each server 206 for a particular application. Each of the servers 206 is only permitted to access that portion of the storage resources it is allotted. Each of the servers 206 is coupled to the LAN 104. Among other things, the LAN 104 allows for inter-server communication (for example, to allow for file sharing between different applications and for copying data from one application to another) and also for access to the servers 206 by the users 102.
FIG. 3 shows an exemplary NAS-based storage system as is known in the art. The NAS-based storage system includes a NAS server 306 in communication with a number of dedicated storage devices 310, for example, over a FC network 308. The NAS server 306 manages and controls the dedicated storage devices 310 so as to allow multiple applications to share the storage resources at a file level, rather than dedicating portions of the storage resources to specific applications, as in a SAN. Thus, the NAS server 306 provides multi-user access to storage resources at a file level and also provides for capacity sharing by making all storage resources available to all applications if needed or desired. The NAS server 306 is coupled to the LAN 104. Among other things, the LAN 104 allows for access to the NAS server 306 by the users 102.
SAN and NAS are not mutually exclusive technologies. For example, as shown in FIG. 3, the FC network 308 and the dedicated storage devices 310 are essentially a SAN that is managed and controlled by the NAS server 306. Also, as shown in FIG. 4, the storage system 106 may include both SAN and NAS technologies, with the servers 206 and the NAS server 306 coupled to the LAN 104.
One problem with the SAN-based storage system, as discussed with reference to FIG. 2 above, is that inter-server data transfers (such as file sharing between different applications and copying data from one application to another) are made over the LAN 104. This can have a serious impact on overall system performance, both by increasing the traffic load on the LAN 104 and by increasing the processing load on the servers 206. In a NAS-based storage system, such file sharing and data copying can be accomplished by the NAS server 306 without using the LAN 104, so such operations have little or no impact on overall system performance.

This patent is subject to a terminal disclaimer.

Network-attached storage system, device, and method with multiple storage tiers


The present invention relates a display device and a method for driving the same which can improve a picture quality. The display device can include a histogram generation/analysis unit for analyzing image data, generating a histogram of the image data to each of the frames, and analyzing the histograms, a gamma reference voltage generating unit for generating gamma reference voltages and adjusting magnitude of the gamma reference voltages according to a result of analysis and forwarding the gamma reference voltages adjusted, a timing controller for re-arranging the image data, controlling output timings of the image data re-arranged and forwarding the image data re-arranged, and a data driver for generating gamma gradient voltages by using the gamma reference voltages, converting the image data into analog image signals by using the gamma gradient voltages and supplying the analog image signals to a display panel.

1. Field of the Disclosure
The present invention relates to display devices, and more particularly to a display device and a method for driving the same which can improve a picture quality.
2. Discussion of the Related Art
A related art display device displays an image according to a gamma gradient curve having a fixed value always regardless of characteristics of the image. Therefore, the related art display device has a limitation in expressing a dynamic image or an image of an emphasized contrast.

Display device and method for driving the same


In at least one embodiment, a vehicle power module comprises a first printed circuit board (PCB) including a first plurality of electrical components for providing a first voltage and a second voltage. The vehicle power module further comprises a second PCB including a second plurality of electrical components, the second PCB being spaced away from the first printed circuit board and a first connector assembly being coupled to the first PCB and to the second PCB for providing the first voltage to the second PCB. The vehicle power module further comprises a second connector assembly being coupled to the first PCB and to the second PCB for providing the second voltage to the second PCB. The first connector assembly provides the first voltage of up to 14V and the second connector assembly provides the second voltage of 200V or greater.

Power converters (or other high power devices) employed in vehicle applications typically consist of discrete components and printed circuit boards (PCBs). In order to make compact packages, not all of the components are mounted to a single PCB. Two or more PCBs are commonly needed to make a complete power converter. Due to this architecture, connections between the PCBs may be needed to electrically couple the components on one PCB to components on another PCB. One method to electrically couple the PCBs to one another is to use wire with ring terminals and bolts for various high power connections and wired connectors for low power signals. A bolted connection between the PCBs may loosen over time due to vibration, thereby potentially causing a failure (due to overheating of the joint) in the device.
Within the power converters, high power transformer may be necessary to assist in the conversion of AC energy into DC energy such that DC based power is stored on one or more batteries in the vehicle. Such high power transformers may also be used in connection with inverter systems. These transformers may transfer DC energy as provided by the vehicle into AC energy for the purpose of providing AC power at a power outlet within the vehicle such that the vehicle operator may plug a laptop computer or other electric device thereto. These transformers are typically coupled to a PCB (within the high power device) via wires such that the high energy provided by the transformers are transferred to other high power electronics on the PCB. The process of coupling wires to the transformer and to various pads or through-hole connection points on the PCB may be complicated and may be prone to fail over time.

Printed circuit board connection assembly


A method and an apparatus for providing nanometer precision motion are provided. According to the invention, a parallel kinematic micromanipulator is formed using at least three kinematic links. The kinematic links may include a high resolution, non-contact encoder to provide position information. Movement of the micromanipulator is effected using piezoelectric linear actuators provided in connection with each of the kinematic links. The combination of a parallel kinematic structure and piezoelectric linear actuators provides a micromanipulator capable of positioning components or instruments with high accuracy or repeatability. In accordance with the present invention, kinematics of three and six degrees of freedom may be provided.

The present invention relates to a device for positioning components with high precision. In particular, the present invention relates to a parallel kinematic manipulator capable of positioning components with nanometer tolerances.
The precise positioning of components is increasingly important. For instance, optical communications systems require that the ends of optical fibers be precisely aligned with mating components or fibers to ensure minimal transmission losses. The precision alignment of components is also important in connection with the manufacture of semiconductor devices, and with devices having miniaturized components and/or fine tolerance requirements. As yet another example, precision surgery applications, including remote surgery, require the ability to precisely control the position and movement of instruments. However, previous attempts at providing for the precise positioning of a component or instrument have been incapable of providing high resolution positioning. In particular, previous attempts at providing devices capable of precisely positioning components and instruments have been incapable of providing a desired number of degrees of freedom in combination with a desired positioning tolerance.
Manipulators or positioners capable of providing a number of degrees of freedom are available. One such type of device is a manipulator having stacked stages. An example of a manipulator 100 incorporating stacked stages is illustrated in FIG. 1. The manipulator 100 includes first 104, second 108 and third 112 linear stages for providing linear movement of the mobile plate or tool plate 116 relative to the base plate 120. In particular, the linear stages 104, 108 and 112 provide movement of the mobile plate 116 with respect to the base plate 120 along the x, y and z axes. In addition, a first 124 and second 128 rotational stage are provided to rotate the mobile plate 116 with respect to two separate axes. The combination of three linear stages 104, 108 and 112 and two rotational stages 124 and 128 provides a manipulator 100 having five degrees of freedom.
Although the manipulator 100 is capable of providing five different movements for positioning a component or instrument interconnected to the mobile plate 116, the resolution or step size with which such positioning can be accomplished is limited. In particular, manipulators having stacked stages, such as the manipulator 100 illustrated in FIG. 1, suffer from additive positioning errors. Specifically, there are sine and cosine position errors associated with each movement, in addition to linear (or rotational) position errors. Errors associated with each stage can contribute additively to an overall positioning error associated with the manipulator. As a result, even if great efforts are made to accurately control the position of each stage, the overall positioning error remains relatively high. For example, if each linear actuator has an error of 50 nm, the overall positioning error of the manipulator is likely to be at least 150 nm. Adding in errors associated with the rotational stages, and sine and cosine errors, a high quality, 5 degree of freedom manipulator 100 having stacked stages is likely to have 250 nm or more of position error.
Parallel mechanisms provide a manipulator structure that avoids additive errors. In a parallel mechanism, such as the parallel mechanism 200 illustrated in FIG. 2, a base plate 204 is interconnected to a mobile plate 208 by a plurality of kinematic links 212. In the parallel mechanism 200 illustrated in FIG. 2, six kinematic links 212a-f are provided. As a result, the parallel mechanism manipulator 200, also known as a hexapod, is capable of moving the mobile plate (tool plate) 208 with six degrees of freedom (x, y, z, "PHgr", xcex8, "psgr"). Because the position error of a parallel mechanism is not additive, higher positioning tolerances are possible than with a stacked stage type device (e.g., manipulator 100 in FIG. 1). For example, if positioning resolutions of 50 nm are available with respect to each kinematic link, a parallel mechanism type manipulator such as the manipulator 200 illustrated in FIG. 2 might be capable of positioning the mobile plate 208 with a resolution that is also about equal to 50 nm. Although such resolution is acceptable in many cases, it is still too high for may applications, particularly aligning fiber optic cables. At the same time, it is also desirable to provide actuators capable of operating at high velocities, for example, to speed up production processes. Typical actuators include servo motors, linear motors and inch worm type ceramic actuators.
Servo motor type actuators may suffer from backlash associated with the screw-type jacking mechanisms often used to effect changes in the length of the kinematic link. In addition, servo and linear motor type actuators suffer from dithering, which involves high frequency, small amplitude movements of the motor as it searches for the correct position. Such dithering can result in vibrations that can interfere with intended positioning operations, even when changes in the lengths of the kinematic links are not being effected.
Inch worm-type piezoelectric motors generally include a pair of ceramic rings capable of selectively engaging a rod running through the rings. In particular, the ceramic rings can be electrically excited in such a way as to controllable move the rod with respect to the rings. Although such devices are capable of providing small changes in the length of a kinematic chain, they suffer from inaccuracies due to hysteresis. Therefore, it is difficult to accurately control the length of a kinematic chain utilizing an inch worm-type piezoelectric actuator. The operation of such devices is also relatively slow. In addition, the operation of inch worm-type piezoelectric actuators creates vibrations that can interfere with the intended positioning operations.
Therefore, there is a need for a method and apparatus capable of providing for the precise positioning of a component or instrument. In particular, there is a need for a method and apparatus for providing a manipulator capable of positioning a component or instrument with high repeatability, resolution, and speed, without dither.
In accordance with the present invention, a parallel kinematic micromanipulator is disclosed. Also disclosed is a method for precisely positioning a component or instrument. The method and apparatus of the present invention allows for the positioning of components and instruments with extremely high repeatability and allows multiple degrees of freedom in the movement of a component or instrument.
The inventor of the present invention has recognized that higher positioning resolutions than are available using prior art manipulators would require kinematic links capable of having their lengths controlled with greater precision. Furthermore, the inventor of the present invention has recognized that the inaccuracies encountered with respect to the position of individual kinematic links are in large part due to the inaccuracies inherent to the actuators used to control the length of the kinematic links. Such actuators have included servo motors, linear motors, and inch worm-type ceramic actuators. In contrast, the present invention comprises linear piezoelectric actuator assemblies capable of providing movement with resolutions that have not been available in connection with conventional manipulators. As can be appreciated by one of skill in the art, piezoelectric actuators take advantage of the piezoelectric effect exhibited by certain crystals, in which the application of an electric field causes the crystal to expand or contract in certain directions. Furthermore, the linear piezoelectric actuator assemblies utilized in connection with the present invention are capable of providing motion that is substantially continuous, as opposed to the intermittent, start-stop type motion provided by inch worm type piezoelectric devices.
In accordance with an embodiment of the present invention, a parallel mechanism comprising at least three kinematic links is provided. Each kinematic link comprises at least a first piezoelectric linear actuator capable of providing repeatable movement of its respective link with a resolution of no more than about 10 nm. Such a micromanipulator is capable of positioning components or devices with very high repeatability and resolution and can provide at least three degrees of freedom.
According to another embodiment of the present invention, a micromanipulator comprising a hexapod type parallel mechanism is provided. Furthermore, each of the six kinematic links of the hexapod comprises a piezoelectric linear actuator assembly. The combination of the parallel mechanism configuration with piezoelectric actuators results in a micromanipulator capable of providing movements having resolutions of 10 nm or less. In addition, such an embodiment of the present invention is capable of providing a micromanipulator having six degrees of freedom.
According to a further embodiment of the present invention, parallel mechanisms are provided comprising a plurality of kinematic links. Each kinematic link comprises a piezoelectric linear actuator assembly comprising at least two piezoelectric ceramic elements. According to still another embodiment of the present invention, the piezoelectric linear actuator assemblies each comprise at least a first rectangular piezoelectric ceramic element interconnected to a carrier member and having a plurality of electrodes that can be excited to produce controlled movement of a slide member. According to yet another embodiment of the present invention, the piezoelectric linear actuator assemblies comprise dual mode standing wave motors.
In accordance with another embodiment of the present invention, a method for precisely positioning components or instruments is provided. According to the method, a mobile plate is interconnected to a base plate by a plurality of kinematic links. Each of the kinematic links comprises at least a first piezoelectric linear actuator assembly. A first component or instrument is interconnected to the mobile plate, while a second component, assemblage or body is placed in a fixed position relative to the base plate. Electrical excitation is selectively provided to a plurality of the piezoelectric linear actuator assemblies to effect movement of the mobile plate with respect to the base plate. In particular, electrical excitation is selectively provided to the piezoelectric linear actuator assemblies to move the component or instrument interconnected to the mobile platform in any of a plurality of directions. In accordance with an embodiment of the present invention, movement may be provided along any one of three axes. According to still another embodiment of the present invention, translational movement may be provided with respect to three axes, and rotational movement may be provided about any of the three axes.
Based on the foregoing summary, a number of salient features of the present invention are readily discerned. A micromanipulator capable of controlled movement in a variety of directions is provided. The amount of movement may be controlled with a high degree of precision and repeatability. The present invention is well-suited for applications requiring the alignment of precision componentry, such as in connection with the alignment of optical fibers. In addition, the present invention is well suited to applications requiring precisely controlled movements, such as surgical applications.


A deposition method capable of forming an oxide film with a predetermined film thickness ratio using a deposition gas with which a small film thickness ratio is obtained and a deposition gas with which a large film thickness ratio is obtained. When forming an oxide film having a larger film thickness on the surface of a substrate than on the bottom surface of the hole so that the film thickness ratio of the oxide film formed on the surface of the substrate to the oxide film formed on the bottom surface of the hole becomes a predetermined ratio, plasma is generated from a gas mixture including tetraethoxysilane and oxygen to form an oxide film and then plasma is generated from a gas mixture including silane and nitrous oxide.

In the field of semiconductor devices, devices have been made more and more compact and thinner and thinner, and as such a semiconductor device, there is a device as shown in FIG. 5, for example. FIG. 5 shows an image sensor 80 as an example of a semiconductor device, and this image sensor 80 has a configuration in which the underside of a silicon substrate 81 and the top surface of a glass substrate 95 are bonded together by an adhesive 96.
The underside of the silicon substrate 81 has an image capturing section 82 and pad electrodes 83 electrically connected to the image capturing section 82 formed therein, and the surface thereof has connecting terminals 84 and wiring films 85 electrically connected to the connecting terminals 84 formed therein. Further, the silicon substrate 81 has through electrodes 86 formed therein, the through electrodes 86 connecting the pad electrodes 83 and the wiring films 85 electrically.
The through electrodes 86 are formed by filling holes 87, which are formed in the surface of the silicon substrate 81 so that the top surfaces of the pad electrodes 83 are exposed, with an electrically conductive material, and an oxide film (insulation film) 88 is formed between the inner peripheral surfaces of the holes 87 and the outer peripheral surfaces of the through electrodes 86 and on the surface of the substrate 81 excluding the portions of the holes 87. Further, on the oxide film 88, the wiring films 85 and a passivation film 89 are formed.
In this image sensor 80, a series of processings for forming the through electrodes 86 in the silicon substrate 81 include a processing of forming the holes 87 and the oxide film 88. The holes 87 and the oxide film 88 are conventionally formed in such a way as shown in FIG. 6, for example (see the Japanese Unexamined Patent Application Publication No. 2009-158862).
That is, initially, a first step of forming a resist film 90 having a mask pattern of a predetermined shape on the surface of the silicon substrate 81 (see FIG. 6(a)) is performed and then a second step of etching the surface of the silicon substrate 81 using the resist film 90 as mask (see FIG. 6(b)) is performed. In the second step, plasma is generated from an etching gas and the silicon substrate 81 is etched until the top surfaces of the pad electrodes 83 are exposed. Thereby, the holes 87 are formed in the surface of the silicon substrate 81.
Subsequently, a third step of removing the resist film 90 from the top surface of the silicon substrate 81 (see FIG. 6(c)) is performed and then a fourth step of forming the oxide film 88 on the surface of the silicon substrate 81 (see FIG. 6(d)) is performed. In the fourth step, plasma is generated from a deposition gas and the oxide film 88 is formed on the surface of the silicon substrate 81 including the side walls and the bottom surfaces of the holes 87 (the top surfaces of the pad electrodes 83).
Thereafter, a fifth step of forming a resist film 91 having a mask pattern of a predetermined shape on the oxide film 88 formed on the surface of the silicon substrate 81 excluding the portions of the holes 87 (hereinafter, referred to as "the top surface of the silicon substrate 81") (see FIG. 6(e)) is performed and then a sixth step of removing the oxide film 88 formed on the bottom surfaces of the holes 87 (the surfaces of the pad electrodes 83) by etching the oxide film 88 using the resist film 91 as mask (see FIG. 6(f)) is performed. In the sixth step, plasma is generated from an etching gas and the oxide film 88 is etched until the surfaces of the pad electrodes 83 are exposed.
Then, a seventh step of removing the resist film 91 from the surface of the oxide film 88 (see FIG. 6(g)) is performed. Thus, the holes 87 are formed in the silicon substrate 81 and the oxide film 88 is formed on the top surface of the silicon substrate 81 and on the side walls of the holes 87. Thereafter, the holes 87 are filled with an electrically conductive material and the wiring films 85 and the passivation film 89 are formed on the top surface of the oxide film 88, thereby forming the through electrodes 86.
However, forming the holes 87 and the oxide film 88 in this way causes the following problems. That is, in order to form the oxide film 88 on the top surface of the silicon substrate 81 and on the side walls of the holes 87, it is necessary to remove the oxide film 88 formed on the bottom surfaces of the holes 87 after temporarily forming the oxide film 88 on the entire surface of the silicon substrate 81 including the side walls and the bottom surfaces of the holes 87. However, performing the step of forming the resist film 91 for removing the oxide film 88 on the bottom surfaces of the holes 87 (the fifth step), the step of removing the oxide film 88 formed on the bottom surfaces of the holes 87 by etching (the sixth step) and the step of removing the resist film 91 (the seventh step) successively as described above for removing the oxide film 88 formed on the bottom surfaces requires many steps for removing the oxide film 88 formed on the bottom surfaces of the holes 87, which leads to high costs and lengthens the tact time in device production. Further, the increase of the number of steps can be a factor in the decline of the yield due to a trouble caused by the devices.
Therefore, there is taken a measure in which, when forming the oxide film 88 on the surface of the silicon substrate 81 including the side walls of the holes 87 and the bottom surfaces of the holes 87 (the surfaces of the pad electrodes 83) in the fourth step, as shown in FIG. 7(d), the oxide film 88 is formed so that it has a larger film thickness on the top surface of the silicon substrate 81 than on the bottom surfaces of the holes 87, and in the fifth step following this forth step, as shown in FIG. 7(e), the surface of the silicon substrate 81 (oxide film 88) is anisotropically etched so that the oxide film 88 formed on the bottom surfaces of the holes 87 is removed and the surfaces of the pad electrodes 83 are therefore exposed.
Forming the oxide film 88 so that it has a larger film thickness on the top surface of the silicon substrate 81 as described above makes it possible to remove the oxide film 88 formed on the bottom surfaces of the holes 87 with the oxide film 88 formed on the top surface of the silicon substrate 81 remaining at the time of anisotropic etching.
Therefore, since it is possible to omit the step of forming the resist film 91 for removing the oxide film 88 formed on the bottom surfaces of the holes 87 (the step shown in FIG. 6(e)) and the step of removing the resist film 91 (the step shown in FIG. 6(g)), which is performed after removing the oxide film 88 formed on the bottom surfaces of the holes 87, the oxide film 88 formed on the bottom surfaces of the holes 87 can be efficiently removed, and the reduction of costs can be achieved by the shortening of the process. Further, it is possible to eliminate the possibility that the yield declines due to a trouble caused by the devices. It is noted that the FIGS. 7(a) to 7(c) in FIG. 7 correspond to FIG. 6(a) (first step), FIG. 6(b) (second step) and FIG. 6(c) (third step), respectively.


A system for exchange and reconditioning of winding or rewinding multi-components shafts associated with a web handling device comprising an omni-directional mobile cart having a plurality of subassemblies thereon for receiving, storing and transfer of one or more clean and/or to-be-reconditioned shafts between the web handling device and a maintenance station wherein a shaft is mounted in similar manner to the mounting of the shaft on the web handling device for disassembly, cleaning, repairing reassembly and storage of the clean shaft on the cart in anticipation for subsequent exchange of such clean shaft for a to-be-reconditioned shaft mounted on the web handling device. In the system, the removal of the to-be-reconditioned shaft from the web handling device, storage of this shaft on the cart and installation of a clean shaft previously stored on the cart are all performed without modification or material repositioning of the cart from its initially established position relative to the web handling device. A method for shaft exchange is disclosed.

The present invention is particularly suited for repair and maintaining (hereinafter at times referred to as "reconditioning") winder shafts of slitter/winder devices designed to slit a relatively wide web into a plurality of more narrow webs, and collection of the slit webs on respective tubular cores carried on one or more rotating shafts. Commonly, such cores are of a paper or paperboard material. In such systems, it is highly desired that the collection of the slit webs be in a tightly wound roll having smooth planar opposite sides and be free of contamination associated with the passing of the web through the slitter/rewinder. Such precision commonly is dictated by the anticipated use of the slit rolls. Herein at times, the slitting and rewinding device in question may be referred to merely as a "slitter" for convenience purposes, rather than as a "slitter/rewinder" or as a "slitter/winder".
Commonly a plurality of relatively narrow webs derived from the slitting of a single web are collected onto respective paperboard cores mounted on rotating shafts disposed within the slitter. In at least one type slitter, the rewinding shaft employed to grasp and rotate the tubular cores comprises a plurality of individual annular collars disposed in side-by-side relationship along the length of the shaft. In this slitter, each collar is provided internally thereof with a plurality of detents which are loosely mounted in individual cavities defined in the outer circumferential wall of each collar. These detents are commonly round metal balls, a portion of each detent projecting beyond the outer circumferential surface of its respective collar to engage the inner wall of a core that surrounds the collar. These detents are biased radially outwardly of the collar by means of at least one air bladder that extends along the length of the shaft and internally of the collars.
In a typical slitter system, multiple paper-based cores are slid onto one end of a shaft and over the collars. In this action, the inner wall of a core is engaged by respective ones of the detents. In the course of operation of the slitter, the inner surface of each core "rubs" against the detents and/or the outboard rims of the cavities, creating minute dust particles comprising fibrous material of the cores. Dust also may be generated in the action of slitting a web into individual narrow webs. Such dust tends to migrate into the cavities in the collars, impeding the desired radial biasing of the detents for holding the core rigid with respect to the rotating shaft. Over time, such accumulations of dust may become dislodged and tend to be collected on the webs being rewound on the cores, thereby contaminating the web. Moreover, the presence of dust or the like on the slitter can have an adverse effect in connection with alignment of the cores with the output slit webs from the slitter.
Heretofore, reconditioning these shafts included removing the to-be-reconditioned shaft from the slitter, transporting it to a maintenance shop where it commonly was laid upon a work table, dissembled into its individual components, all of which are cleaned and re-lubricated as needed. As a part of this maintenance function, checking the air bladders for leaks can be a critical aspect of the reconditioning of a shaft. Specifically, when employing multiple winding shafts on a slitter, air is forced into each shaft to inflate the bladders of each such shafts to maintain the required pressure for maintaining the detents of the collars in proper frictional engagement with the core(s) mounted on the shaft so that the cores rotate properly for winding thereon of slit material onto the cores. If any one of the bladders leaks, the slitter operator must continually adjust the air pressure supplied from the slitter to leaking shaft to ensure proper rotation of the cores on such shaft. If the top shaft (for example) is leaking more severely than the bottom shaft, more pressure has to be applied to the top shaft than is supplied to the bottom shaft as required to ensure the same rotational speed of the cores on the two shafts which are simultaneously being fed slit material. Prior to the present invention there was no suitable means for efficiently checking for leaks in the bladders. Even new shafts direct from the manufacturer have been found to include a leaking bladder, indicating the absence in the art of bladder checking capability of the industry.
Following the cleaning in a typical prior shaft reconditioning procedure, the components of the shaft were reassembled and the reconditioned shaft was left on the table until needed for use as a change-over replacement shaft. When so stored, the shaft tended to collect dust or other contaminants associated with normal maintenance activities within the maintenance facility.
At all times, consideration is to be given to the relatively large cost of each of the shafts in question, the delicate nature of the components of the shaft, and the weight of a shaft which is not only a factor in lifting and handling a shaft, but the necessity of realignment of a heavy and cumbersome replacement shaft within the slitter itself.
Also, improper setup can be a source of many problems within the winding process of a slitter. Lack of proper setup can produce web breaks, excessive dusting, and, ultimately, increased waste and reduced product marketability. As a consequence, once a slitter/winder is properly setup for a given slitting/winding operation, desirably such setup is not altered until such operation is completed. The need for shaft maintenance can occur at any time during a given operation, thereby making it highly advantageous to carry out the shaft replacement without alteration of the setup of the slitter/winder. Even inadvertent alteration of the setup is to be minimized to the extent reasonably possible.
To minimize down time of the slitter, it is common practice to keep on hand an "extra" reconditioned shaft available for use as a replacement for the to-be-reconditioned shaft while such to-be-maintained shaft is being reconditioned and otherwise maintained in anticipation of its later reinstallation on the slitter.
Proper cleaning of dust from the winder shaft, of a slitter requires full removal of the shaft from the slitter, disassembly of the multiple collars, for example, from the shaft, cleaning of the shaft, cleaning of the collars, reassembly of the collars by threading the same onto a clean shaft, and reinstallation of the clean (reconditioned) shaft in proper precise alignment within the slitter proper.
Cleaning of the individual collars and their detents, etc. requires removal of the shaft from the slitter in that individual ones of the collars can be removed only by sliding them off an end of the shaft. Not uncommonly, each shaft and its collars may weigh more than 150 pounds and can require at least three workers as much as thirty minutes to disassemble the shaft from the slitter and replace it with a reconditioned shaft. Accordingly, the cost involved in manual handling of the shaft is significant and the shaft is subjected to potential damage during manual handling.
Typically slitters are provided with at least two shafts mounted parallel to one another and in vertically spaced apart relationship to one another. To minimize the down time of a slitter of this type, commonly, it is desired to replace both shafts with clean shafts during any given maintenance event.

Method and apparatus for carrying out maintenance of web handling shafts


A secondary battery including an electrode assembly; a terminal electrically connected to the electrode assembly; and a case accommodating the electrode assembly and the terminal, wherein the terminal includes a collecting plate connected to the electrode assembly; a collecting terminal connected to the collecting plate and protruding out of the case; a terminal plate outside of the case, the terminal plate including a terminal through hole at one side thereof and a reinforcement member recess at another side thereof, the collecting terminal passing through the terminal through hole, and a female screw thread being provided to the reinforcement member recess; and a reinforcement member in the reinforcement member recess.

1. Field
Embodiments relate to a secondary battery.
2. Description of the Related Art
Secondary batterers are rechargeable, unlike primary batteries. A low capacity secondary battery including a battery cell in the form of a pack may be used in small portable electronic devices e.g., cellular phones and camcorders. A high capacity secondary battery including tens of battery cells connected to one another may be used as a power source for, e.g., driving a motor of electric scooters, hybrid vehicles, or electric vehicles.
Secondary batteries may be manufactured in various shapes, e.g., a cylindrical shape and a prismatic shape. An electrolyte and an electrode assembly formed by interposing a separator as an insulator between a positive electrode plate and a negative electrode plate may be installed in a case; and a cap plate may be installed on the case, so as to form a secondary battery. The electrode assembly may be connected with a positive terminal and a negative terminal, which may protrude through the cap plate and may be exposed to an exterior of the electrode assembly.


An apparatus for controlling the Z axis position of a wafer prober includes a first sensor unit including a plurality of pressure sensors distributed and installed between a Z axis support plate, for supporting a Z axis transferring unit and a Z axis base. Actuators are distributed and installed between the Z axis support plate and the Z axis base, and lift up or lower the Z axis support plate. A driving unit drives the actuators. A control module controls the driving unit to drive the actuators in response to pieces of sensed data. The control module drives the actuators when a difference between the pieces of sensed data is greater than a preset difference limit value, thus enabling the chuck plate to be maintained in a horizontal state.

A wafer prober is a device for connecting a plurality of chips on a wafer to a tester. Such a tester is connected to the chips on the wafer through the wafer prober and is configured to provide electrical signals to the chips and inspect the results of provision, thus examining whether abnormalities or defects are present in each of the chips. The construction and operation of the wafer prober are described in brief with reference to FIG. 1. When a wafer 209 on which a plurality of chips is formed is loaded into a chuck plate 208 through a wafer transferring device 204, the chuck plate 208 is transferred in X, Y and Z directions so that a plurality of probes provided in a probe card 210 is aligned and put into contact with pads on the plurality of chips provided on the wafer through a chuck transferring device 206. Here, the X and Y directions denote a direction horizontal to the surface of the chuck plate, and the Z direction denotes a direction perpendicular to the surface of the chuck plate. When the plurality of probes comes into contact with the plurality of pads, respectively, a tester 100 provides test signals corresponding to a predetermined program to the chips through tester connection terminals and the probes, and the chips provide output signals corresponding to the test signals to the tester 100, thus testing each chip for electrical characteristics.
Hereinafter, with reference to FIG. 2, an embodiment of a mechanical component for vertically transferring the chuck plate 208 will be described below.
A wedge-shaped support 212, one surface of which is cut in an inclined shape, is installed on the bottom surface of the chuck plate 208, and a wedge-shaped Z axis transferring unit 216, one surface of which is cut in an inclined shape, is arranged at the location opposite the inclined surface of the support. A rolling bearing 214 is interposed between the support 212 and the Z axis transferring unit 216 to reduce friction therebetween. Here, the inclined surface of the Z axis transferring unit 216 is formed to have a shape corresponding to the inclined surface of the support 212. The inclined surface of the Z axis transferring unit and the inclined surface of the support are arranged opposite each other. A ball screw 218 is installed below the Z axis transferring unit 216, and is configured to move the Z axis transferring unit 216 in a laterally direction while rotating in association with a Z axis motor 220. As the Z axis transferring unit 216 is moved in the lateral direction, the height of the inclined surface of the support 212 facing the Z axis transferring unit 216 is changed. In this way, with the lateral movement of the Z axis transferring unit 216, the chuck plate 208 is vertically transferred. Further, a Z axis base 222 is installed below the Z axis transferring unit to support the bottom of the wafer prober. The Z axis transferring unit 216, the ball screw 218 and the Z axis motor 220 are arranged on the Z axis base 222. The motor 220 produces a predetermined torque used to transfer the Z axis transferring unit 216.
However, the motor may produce an excessive torque due to an unexpected disturbance. In this case, the chuck transferring device excessively transfers the chuck plate in a vertical direction, so that the wafer put on the chuck plate 208 may come into excessively close contact with the probe card, thus causing damage to the wafer and the probes of the probe card. Therefore, in the prior art, the development of technology for determining whether excessive pressure is being applied to the Z axis transferring unit 216 or the chuck plate, and discontinuing transferring the chuck plate in a vertical direction if it is determined that excessive pressure is being applied, is required.
Further, in order to bring the fine pads formed on the wafer into precise contact with the probes of the probe card 210, the control of the position of the chuck plate 208 is very precisely performed, and thus the chuck plate is precisely installed in consideration of a horizontal state. However, there is a problem in that the Z axis base 22 for supporting the Z axis transferring unit 216 may be tilted due to an unexpected disturbance during the use of the wafer prober, thus making it difficult to maintain the chuck plate in a horizontal state. As a result, the development of technology for detecting the tilting of the Z axis transferring unit 216 and correcting the tilting of the chuck plate is required in the prior art.

Method and apparatus for controlling position of Z-axis for wafer prober


An anti-skid device for vehicles comprising a plurality of chain strands fastened to a holder which can be set in a rotational movement by means of the wheel of a vehicle against which the holder can be moved an pressed by a carrier. To move the carrier, a drive unit is used which can be operated by compressed gas. The compressed gas is delivered by a gas reservoir formed by at least one exchangeable compressed-gas cartridge which can be opened and connected to a gas pipe leading to the drive unit by means of a device in the driver's cab of the vehicle comprising a lever and a plunger for actuating a hollow needle piercing through he seal of the compressed-gas cartridge.

The invention relates to an anti-skid device for motor vehicles, with a plurality of chain lines which are fastened to a holder capable of being set in rotational movement and of which the ends facing away from the holder, with the holder rotating in the operating position, are thrown away from the holder under the effect of centrifugal force into the region of the ground contact surface of a rotating vehicle tire, with a carrier mounted on the vehicle and intended for the holder, and with a drive unit which, from the driver's cab of the vehicle, can be subjected by way of a compressed-gas pipe to the pressure of a gaseous mediumhand by means of which the carrier can be moved out of a position of rest into the operating position.
There are known anti-skid devices of the foregoing type, of which the drive unit for the carrier usually designed as a pivotable jib arm can be subjected to compressed air from a compressed-air system present in the vehicle for braking purposes (EP 0,162,823 B1). It goes without saying that this possibility for actuating the drive unit is unavailable on vehicles without compressed-air braking systems, that is to say particularly on light lorries or small buses. In order, here too, to ensure that the anti-skid device can be operated from the driver's seat with similar ease to heavy-goods vehicles and omnibuses, it has already been suggested to equip the corresponding smaller vehicles with a separate compressed-air generating system in order to operate the anti-skid device. However, in practice, putting this idea into effect and using it widely have always been unsuccessful for reasons of cost, space and safety.

RUD-Kettenfabrik Rieger & Dietz GmbH. u. Co


The present invention provides an aqueous composition useful for polishing copper interconnects on a semiconductor wafer comprising by weight percent up to 25 oxidizer, 0.05 to 1 inhibitor for a nonferrous metal, 0.01 to 5 complexing agent for the nonferrous metal, 0.01 to 5 modified cellulose, and balance water, wherein the composition is free of polyacrylic acid, the amount of modified cellulose providing a copper removal function and a wafer clear of copper.

The invention relates to chemical mechanical planarization (CMP) of semiconductor wafer materials and, more particularly, to CMP compositions and methods for polishing copper interconnects from semiconductor wafers in the presence of dielectrics and barrier materials.
Typically, a semiconductor wafer is a wafer of silicon with a dielectric layer containing multiple trenches arranged to form a pattern for circuit interconnects within the dielectric layer. The pattern arrangements usually have a damascene structure or dual damascene structure. A barrier layer covers the patterned dielectric layer and a metal layer covers the barrier layer. The metal layer has at least sufficient thickness to fill the patterned trenches with metal to form circuit interconnects.
CMP processes often include multiple polishing steps. For example, a first step removes excess interconnect metals, such as copper at an initial high rate. After the first step removal, a second step polishing can remove remaining metal that remains on the barrier layer outside of the metal interconnects. Subsequent polishing removes the barrier from an underlying dielectric layer of a semiconductor wafer to provide a planar polished surface on the dielectric layer and the metal interconnects.
The metal in a trench or trough on the semiconductor substrate provides a metal line forming a metal circuit. One of the problems to be overcome is that the polishing operation tends to remove metal from each trench or trough, causing recessed dishing of such metal. Dishing is undesirable as it causes variations in the critical dimensions of the metal circuit. To reduce dishing, polishing is performed at a lower polishing pressure. However, merely reducing the polishing pressure would require that polishing continue for a lengthened duration. However, dishing would continue to be produced for the entire lengthened duration. What is needed is a method to reduce dishing of metal in trenches or troughs without lengthening the duration of the polishing operation. Polishing compositions that leave a surface clear of interconnect metal residue after a short second step polishing time are needed.
U.S. patent application Ser. No. 2003/0219982 A1 mentions in a general way that cellulose might be used as a protective film forming agent or a water soluble polymer in polishing compositions for use on metals. Specific concentrations and cellulose properties are not disclosed in this reference. There is a need for polishing compositions that provide low dishing while providing adequate metal residue clearing.

Compositions and methods for polishing copper

Rohm and Haas Electronic Materials CMP Holdings, Inc.


A voice control system and method for a multimedia device are provided. The system includes an image sensing module configured to collect a user action image; an image recognizing module configured to determine a type or a status of a control instruction according to the user action image; a voice recognition status managing module configured to activate or wake up the voice recognition program according to a type of a current control instruction; a pickup module configured to collect voice signal; a voice recognizing module configured to recognize the collected voice data to generate a control instruction; and a multimedia function module configured to execute the control instruction to provide a corresponding multimedia function to the user. An image recognition technology, a voice recognition technology, and a storage medium of a computer are combined in the illustrated embodiment, a free and convenient voice control which is not depended on a hand-held remote control unit and not limited to a close pickup device is achieved. The interference of the sound output by the multimedia device, the environment background noise, and a non-control instruction voice signal of the user to the control instruction voice recognition can be effectively avoided, the instruction of the user can be precisely recognized.

After a mobile phone is intellectualized, it is a trend that multimedia devices such as the TV, projector, game console will also be intellectualized. Currently, a multimedia device is often equipped with a high performance controlling chip, and has an open platform and an operating system. A user can install and uninstall apps, the apps have extended functions of the multimedia device. The multimedia device supports the SNS and information exploring. Take a smart TV as an example, the smart TV is not limited to a conventional function of playing programs. The smart TV can realize functions of sharing video and audio, playing interactive entertainment games. A conventional button type remote control unit cannot fulfill requirements of selecting and operating several multimedia functions.
In the prior art, intelligent controlling can be achieved through several human computer interaction programs such as touching controlling, voice controlling, gesture controlling, motion controlling etc. Because of limitations of a usage scenario and problems of a usage habit, the conventional intelligent controlling method cannot totally replace the button type remote control unit, the user can operate only by utilizing combinations of specific functional keys and digital keys on the button type remote control unit. For example, the touch controlling program needs to use a touch sensing module installed on the remote control unit. The gesture recognition program cannot switch a channel among the usually used channels quickly, if the user wants to change from current channel 1 to channel 55, the conventional button type control unit will change the channels much quicker than that of the gesture recognition program. The problem of motion controlling is similar as that of the gesture recognition program, usually, the motion controlling program needs to install a range image sensing module to achieve a precise motion controlling function. The problem of the conventional voice recognition program is: in order to collect the voice of the user clearly, a microphone is installed on the remote control unit, the conventional button type remote control unit is needed.
With the development of the voice recognition, the voice recognition and semantic recognition have reached the practical stage. With the popularity of cloud computing technology, a lot of service providers of the voice recognition based on cloud service combine the voice recognition and TV to get a TV controlled by voice. In the present solutions, a microphone pickup module is installed on the remote control unit to obtain the voice of the user, the voice is processed and sent to the cloud to recognize. Even a microphone array technology which can pick up a long-distance voice is used, a problem such as interference of the TV output sound and environment noise, and a problem such as that the non-control instruction voice of the user is recognized as a control instruction by mistake can affect the performance of the multimedia device.

Multimedia device voice control system and method, and computer storage medium


Host cells, comprising Kluveryomyces expressing heterologous cellulases produce ethanol from cellulose In addition, multiple host cells expressing different heterlogous cellulases can be co-cultured together and used to produce ethanol from cellulose The recombinant yeast strains and co-cultures of the yeast strains can be used to produce ethanol on their own, or can also be used in combination with externally added cellulases to increase the efficiency of sacchanfication and fermentation processes.

Lignocellulosic biomass is widely recognized as a promising source of raw material for production of renewable fuels and chemicals. The primary obstacle impeding the more widespread production of energy from biomass feedstocks is the general absence of low-cost technology for overcoming the recalcitrance of these materials to conversion into useful fuels. Lignocellulosic biomass contains carbohydrate fractions (e.g., cellulose and hemicellulose) that can be converted into ethanol. In order to convert these fractions, the cellulose and hemicellulose must ultimately be converted or hydrolyzed into monosaccharides; it is the hydrolysis that has historically proven to be problematic.
Biologically mediated processes are promising for energy conversion, in particular for the conversion of lignocellulosic biomass into fuels. Biomass processing schemes involving enzymatic or microbial hydrolysis commonly involve four biologically mediated transformations: (1) the production of saccharolytic enzymes (cellulases and hemicellulases); (2) the hydrolysis of carbohydrate components present in pretreated biomass to sugars; (3) the fermentation of hexose sugars (e.g., glucose, mannose, and galactose); and (4) the fermentation of pentose sugars (e.g., xylose and arabinose). These four transformations occur in a single step in a process configuration called consolidated bioprocessing (CBP), which is distinguished from other less highly integrated configurations in that it does not involve a dedicated process step for cellulase and/or hemicellulase production.
CBP offers the potential for lower cost and higher efficiency than processes featuring dedicated cellulase production. The benefits result in part from avoided capital costs, substrate and other raw materials, and utilities associated with cellulase production. In addition, several factors support the realization of higher rates of hydrolysis, and hence reduced reactor volume and capital investment using CBP, including enzyme-microbe synergy and the use of thermophilic organisms and/or complexed cellulase systems. Moreover, cellulose-adherent cellulolytic microorganisms are likely to compete successfully for products of cellulose hydrolysis with non-adhered microbes, e.g., contaminants, which could increase the stability of industrial processes based on microbial cellulose utilization. Progress in developing CBP-enabling microorganisms is being made through two strategies: engineering naturally occurring cellulolytic microorganisms to improve product-related properties, such as yield and titer, and engineering non-cellulolytic organisms that exhibit high product yields and titers to express a heterologous cellulase and hemicellulase system enabling cellulose and hemicellulose utilization.
Three major types of enzymatic activities are required for native cellulose degradation: The first type are endoglucanases (1,4-β-D-glucan 4-glucanohydrolases; EC 220.127.116.11). Endoglucanases cut at random in the cellulose polysaccharide chain of amorphous cellulose, generating oligosaccharides of varying lengths and consequently new chain ends. The second type are exoglucanases, including cellodextrinases (1,4-β-D-glucan glucanohydrolases; EC 184.108.40.206) and cellobiohydrolases (1,4-β-D-glucan cellobiohydrolases; EC 184.108.40.206). Exoglucanases act in a processive manner on the reducing or non-reducing ends of cellulose polysaccharide chains, liberating either glucose (glucanohydrolases) or cellobiose (cellobiohydrolase) as major products. Exoglucanases can also act on microcrystalline cellulose, presumably peeling cellulose chains from the microcrystalline structure. The third type are β-glucosidases (β-glucoside glucohydrolases; EC 18.104.22.168). β-Glucosidases hydrolyze soluble cellodextrins and cellobiose to glucose units.
Bakers' yeast (Saccharomyces cerevisiae) remains the preferred micro-organism for the production of ethanol (Hahn-Hägerdal, B., et al., Adv. Biochem. Eng. Biotechnol. 73, 53-84 (2001)). Favorable attributes of this microbe include (i) high productivity at close to theoretical yields (0.51 g ethanol produced/g glucose used), (ii) high osmo- and ethanol tolerance, (iii) natural robustness in industrial processes, and (iv) being generally regarded as safe (GRAS) due to its long association with wine and bread making, and beer brewing. Furthermore, S. cerevisiae exhibits tolerance to inhibitors commonly found in hydrolyzates resulting from biomass pretreatment.
One major shortcoming of S. cerevisiae is its inability to utilize complex polysaccharides such as cellulose, or its break-down products, such as cellobiose and cellodextrins. In attempt to address this problem, several heterologous cellulases from bacterial and fungal sources have been transferred to S. cerevisiae, enabling the degradation of cellulosic derivatives (Van Rensburg, P., et al., Yeast 14, 67-76 (1998)), or growth on cellobiose (Van Rooyen, R., et al., J. Biotech. 120, 284-295 (2005)); McBride, J. E., et al., Enzyme Microb. Techol. 37, 93-101 (2005)). However. current levels of expression and specific activity of cellulases heterologously expressed in yeast are still not sufficient to enable efficient growth and ethanol production by yeast on cellulosic substrates without externally added enzymes. There remains a significant need for improvement in the amount of cellulase activity in order to attain the goal of achieving a consolidated bioprocessing (CBP) system capable of efficiently and cost-effectively converting cellulosic substrates to ethanol.
Another major shortcoming of the use of S. cerevisiae is that externally produced cellulases function optimally at a higher temperature than the temperature at which S. cerevisiae function optimally. Thus, either the processing must be carried out in a two step process at two different temperatures or one temperature can be selected where both processes function to some extent, but at least one of the processes does not occur at optimal efficiency.
In order to address these limitations, the present invention provides for heterologous expression of wild-type and codon-optimized combinations of heterologous cellulases in yeast that allows efficient production of ethanol from cellulose sources. The invention also provides for expression of such heterologous cellulases in theromtolerant yeast and methods of using such transformed yeast for ethanol production.

Yeast expressing cellulases for simultaneous saccharification and fermentation using cellulose

Lallemand Hungary Liquidity Management LLC


A hydrogen generator includes a water storage container for storing water, a reaction container for receiving a solid fuel that is a mixture of a complex metal hydride and catalysts, and a water supplying source that is connected between the water storage container and the reaction container to supply the water to the reaction container.

(a) Field of the Invention
The present invention relates to a fuel cell system. More particularly, the present invention relates to a hydrogen generator that can generate hydrogen gas through a hydrolysis reaction of sodium borohydride (NaBH4).
(b) Description of the Related Art
As is well known, a fuel cell is an electric generator that can generate electrical energy using a fuel and oxidizing gas.
Fuel cells may be classified into polymer electrolyte membrane fuel cells and direct oxidation membrane fuel cells. The polymer electrolyte membrane fuel cell is configured to generate electrical energy through an electrochemical reaction between hydrogen gas and an oxidizing gas supplied separately.
It is well known that hydrogen gas is generated by a chemical reaction. For example, a hydrolysis reaction of a fuel such as sodium borohydride (NaBH4) has been widely used to generate the hydrogen gas.
A first conventional hydrogen generator for generating the hydrogen gas using the hydrolysis reaction of sodium borohydride (NaBH4) has a structure where catalysts are added to a fuel solution that is a mixture of sodium borohydride and water. A second conventional hydrogen generator has a structure wherein the fuel and water are supplied into a reaction container in which the catalysts are received. A third conventional hydrogen generator has a structure wherein a catalytic solution is supplied into a reaction container in which solid sodium borohydride is received.
In the first conventional hydrogen generator, since the catalysts are added to a fuel solution that is a mixture of sodium borohydride and water, byproducts such as sodium metaborate (NaBO2) having a relatively high viscosity are produced in the fuel solution. Therefore, the fuel utilization efficiency is lowered due to the byproducts. Further, it is difficult to control the hydrogen generation speed.
In the second and third conventional hydrogen generators, since the fuel and water are supplied into the reaction container in which the catalysts are received or the catalytic solution is supplied into the reaction container in which solid sodium borohydride is received, when the water discharged from the fuel cell is reused by being supplied to the reaction container, the concentration of the fuel or the concentration of the catalysts varies by the reused water as time passes.
The above information disclosed in this Background section is only for enhancement of understanding of the background of the invention and therefore it may contain information that does not form the prior art that is already known in this country to a person of ordinary skill in the art.

Hydrogen generator and fuel cell system with the same

Gongse-dong, Giheung-gu, Yongin-si, Gyeonggi-do


A method and system method for code testing in a video streaming network. A first broadcast stream including a first program containing video content is received by an ingest server of a live cluster of servers, wherein the live cluster of servers is deployed for providing streaming media programs to multiple user devices. The first broadcast stream is provided to one or more user devices. A copy of the first broadcast stream is provided to a device under test configured to test new code installed at the device under test via a processing of the first broadcast stream by the new code installed at the device under test. The device under test is a generic computer. Error performance of the device under test is monitored with respect to the installed new code's processing of the first broadcast stream.

Increased availability and use of internet technology is making it possible to distribute multimedia content to users using the internet and internet protocol (IP). Anyone with access to the internet can become a content provider by uploading digital audio or video to a streaming media service and make the uploaded content available to thousands of users. The operational details of providing access to the users to the uploaded content are then taken care of by the streaming media service platform.
A streaming media platform facilitates distribution of audio video programs, or media content, to users. The streaming media platform may store content on storage media; e.g., a magnetic hard drive that may be available locally or via a storage area network connection. Users may be able to browse through the available content and request transmission of a desired video program. The content may then be sent to the user's device using one of many possible transmission protocols.
In some implementations, a server-controlled protocol may be used for delivering media to user devices. In a server-controlled streaming protocol, a server may keep track of packets sent to a particular user device and may also manage the rate at which to send the media data to the user device and the amount to be sent each time. The Real Time Streaming Protocol (RTSP) is an example of a server-controlled protocol. The Flash Media Server (FMS) is a commercially available product by Adobe Systems, and is a popular streaming media server that is used by many providers of streaming media solutions. Deployment examples of FMS are used herein for illustrative purpose only and not as a limitation to the disclosed embodiments. Commercially available streaming media server platforms; e.g., FMS, are often available to streaming media service providers as a "black box" in that the streaming media service providers cannot alter the software but can only build solutions using application programming interfaces (APIs) provided by the streaming media server platforms.
Even with off-the-shelf streaming media servers being commercially available, content providers still have to overcome several technical challenges to be able to stream content to multiple users. This task becomes even more difficult because of prevailing use of many different video encoding and streaming standards, and implementations of these encoding and streaming standards by different vendors, resulting in many different variations of encoded video bitstreams, and corresponding multiple different versions of streaming media players that receive and display content on user devices.
As a result of such multiplicity of video encoder implementations and video player implementations, making code changes to the streaming media platform poses an extremely complex technical problem. Furthermore, the streaming media platform operator may be subject to additional complexity by having to test compatibility between the variations in streaming media formats, generated by different encoders and streaming media players, implemented by different vendors.

Proxy streams in a video streaming network

International Business Machines Corporation


A method for feeding an antistatic compound to a polymerization reactor, the method comprising the steps of: a) dispersing, under mixing conditions, a catalyst powder and an antistatic compound in a liquid medium, so as to form a suspension of the catalyst powder and of the antistatic compound in the liquid medium; b) transferring the obtained suspension to a polymerization reactor.

1. Field of the Invention
The present invention relates to a method for feeding an antistatic compound to a polymerization reactor. The invention also relates to a process for the polymerization of olefins carried out in the presence of an antistatic compound fed to the polymerization reactor with the method of the invention.
2. Description of the Related Art
In polymerization processes carried out in continuous, particularly in gas-phase processes for olefin polymerization, there is the need to face up to the formation of polymer agglomerates in the polymerization reactor. The polymer agglomerates involves many negative effects: for example, they can disrupt the discharge of polymer from the reactor by plugging the polymer discharge valves. Furthermore, the agglomerates may also partially cover the fluidization grid of the reactor with a loss in the fluidization efficiency.
It has been found that the presence of fine polymer particles in the polymerization medium favors the formation of polymer agglomerates: these fines may be present as a result of introducing fine catalyst particles or breakage of catalyst and polymer particles within the polymerization medium. The fines are believed to deposit onto and electrostatically adhere to the inner walls of the polymerization reactor and the equipment for recycling the gaseous stream such as, for example, the heat exchanger. If the fines remain active, then the particles will grow in size resulting in the formation of agglomerates, also caused by the partial melting of the polymer itself. These agglomerates when formed within the polymerization reactor tend to be in the form of sheets. Agglomerates can also partially plug the heat exchanger designed to remove the heat of polymerization reaction.
Several solutions have been proposed to resolve the problem of formation of agglomerates during a gas-phase polymerization process. These solutions include the deactivation of the fine polymer particles, the control of the catalyst activity and, above all, the reduction of the electrostatic charge by introducing antistatic agents inside the reactor.
EP 359444 describes the introduction into the polymerization reactor of small amounts of an activity retarder in order to keep substantially constant either the polymerization rate or the content of transition metal in the polymer produced. The process is said to produce a polymer without forming agglomerates.
U.S. Pat. No. 4,803,251 describes a process for reducing the polymer sheeting utilizing a group of chemical additives, which generate both positive and negative charges in the reactor, and which are fed to the reactor in an amount of from about 0.1 to about 25 ppm based on the monomer feed, preferably ethylene, in order to prevent the formation of undesired positive or negative charges.
EP 560035 discloses a polymerization process in which an anti-fouling compound is used to eliminate or reduce the build-up of polymer particles on the walls of a gas-phase polymerization reactor. This anti-fouling compound is preferably selected from alkydiethanolamines, which may be fed at any stage of the gas-phase polymerization process in an amount greater than 100 ppm by weight with respect to the produced (co)polymer. Said anti-fouling compound is capable to selectively inhibit the polymerization on polymer particles smaller than 850 μm, the latter being responsible for fouling problems and polymer sheeting.
It can be pointed out that, when polymerizing olefins by means of a fluidized bed reactor, the prior art literature mainly teaches to introduce antistatic or antifouling compounds directly inside the fluidized polymer bed. As an alternative, these additives are taught to be fed in correspondence of the gas recycle line of the polymerization reactor. Some chemical compounds having antistatic and/or antifouling properties are in a solid form at room temperature: examples of them are hydroxyesters, such as glyceryl monostearate (GMS) and glyceryl monopalmitate. Of course, the high temperatures existing inside a gas-phase polymerization reactor guarantee a quick melting of such solid additives, once they are introduced into the reactor. However, technical problems arise for feeding said solid additives to the reactor, because they cannot flow through the feed lines, as in case of liquid antistatic compounds. It is therefore necessary to arrange a heater device on each feed line, so as to melt the additive and to ensure its flowability through the feed lines. Generally, more lines for feeding an antistatic are present in a gas-phase polymerization plant, so that, notwithstanding the total amount of additive to be fed is low, the arrangement of more heaters on each feed line (jacketed pipes) increases the complexity of the polymerization plant and the energy consumption.
For the above reasons, it would be largely desirable to find an alternative method for introducing antistatic and/or antifouling compounds into a polymerization reactor.

Method for feeding an antistatic compound to a polymerization reactor


A card hopper for holding a stack of identification cards that are to be printed or in other ways processed has an outlet opening on one end through which the cards are fed. The outlet opening is adjustable in size to accommodate cards of different thicknesses by using a control gate that is slidably mounted relative to the hopper and can be adjusted through the use of a cam actuator to change the opening size of the outlet opening. Manual operation is shown using both rotating and sliding cams.

The present invention relates to a control gate for the outlet of a card or substrate storage hopper used with a card printer, which is adjustable to change the opening height for feeding cards of different thickness from the hopper. An actuator is used to drive a cam to adjust the position of the control gate.
Printers for ID cards and like substrates that will accept different cards or substrates have been advanced. The ability to adapt card feeders for different sizes and thicknesses of cards to reliably feed the cards into a printing station is needed. Problems can arise when feeders that are set for relatively thick cards are used for attempting to feed thin cards. At times more than one card will be fed to the printer. In addition, the ability for an operator to manually change the setting so that cards of a different thickness can be reliably fed is desired.
The present invention relates to a card hopper that has an adjustable gate for the exit or outlet opening of the hopper to permit adjusting the height of the outlet opening for cards or substrates of different thickness. The adjustable gate can be moved to insure reliable, one card at a time feeding from the card hopper. The card hopper and card feeder are used in connection with a card printer, or other processor where feeding one card at a time is essential to satisfactory operation.
The present invention includes a hopper for plastic cards or similar, fairly rigid substrates having an outlet opening covered by a gate that slides in a direction perpendicular to the plane of the card being fed, to permit adjusting the height of the opening. As shown, the gate is spring loaded in one direction toward a closed position. The gate position is changed by moving the gate against the spring load with a cam controlled by an actuator. A double acting cam or operator for positively moving the gate in both open and closed directions can be provided.
The actuator lever, as shown moves the cam so the gate is held in a desired position. An edge of the gate defines one edge of the outlet opening relative to an opposite edge of the outlet opening so the thickness of the card that will be fed is controlled. In one form of the invention, the cam is a linear ramp type cam, and in another form of the invention a rotary cam is used.
The cam may be manually operated as shown in most embodiments or a drive motor can be used as also illustrated. The motor can be controlled by a card thickness sensor or by a manual, operator selected input signal for each card thickness.
By having appropriate markings or actuator stops, the lever or other control can be used for quickly adjusting the gate so the opening matches the thickness of cards in a stack that is being fed to a printer or other processor.

Card thickness selection gate for a card feeder


A method of performing a system watchdog operation of a data processing system using a system watchdog timer includes creating an initial question, starting a timer of the system watchdog timer, receiving an initial answer and an initial data code, calculating an expected data code in response to the initial question, and comparing the initial data code to the expected data code. In response to a mismatch between the initial data code and the expected data code, a bus error signal is generated. In response to a match, the initial answer is compared to the initial question, and in response to a match between the initial answer and the initial question, the timer is reset and the initial data code is stored as a subsequent question, but in response to a mismatch, a remedial action of the data processing system is performed.

Watchdog timers monitor an operating condition of a system by counting using a timer. If the timer expires before the watchdog timer receives a reset signal, it detects an irregularity and the watchdog timer undertakes an action such as activating a reset signal to bring system to a safe state. A system watchdog timing function is implemented across a system, such as a processor connected to a separate watchdog timer via a system bus. System watchdog timers add redundancy to the watchdog operation as each part involved in the system watchdog timing function has to be operating properly.
One operating scheme of system watchdog timers is the question and answer (Q&A) watchdog timer. In conventional Q&A watchdog timers, the watchdog circuit sends a specific question to the processor and the processor responds with a unique answer. The watchdog timer performs a remedial action if it reaches a terminal count before it is reset by receiving a correct answer from the processor, and some watchdog timers perform the remedial action immediately upon receiving an incorrect answer. Existing Q&A watchdog timers require large die size, multiple bus transfers, and/or custom algorithms/software.
FIG. 2 illustrates a flow chart of a process 200 associated with the operation of a Q&A watchdog timer and processor known in the art. The processor and Q&A watchdog timer communicate via a system bus and the integrity of the data transmission is protected by an error code, labeled "PEC0". PEC0 could be, for example, a parity bit, CRC bits, or other error correction code bits. Process 200 begins at block 201, where the Q&A watchdog timer creates an initial question, labeled "Q0". The processor then performs action 202 by reading Q0 from the Q&A watchdog timer, and the process proceeds to block 203. At block 203 the processor calculates an answer, labeled "A0", and PEC0. The processor then subsequently performs action 204 by writing A0 and PEC0 to the Q&A watchdog timer, and the process proceeds to block 205. At block 205, the Q&A watchdog timer calculates an expected answer and compares it with the received A0. Also at block 205, the Q&A watchdog timer compares an expected PEC0 and the received PEC0. If the expected answer and A0 do not match, the Q&A watchdog does not reset its timer and performs a remedial action. If the expected answer and A0 do match, the Q&A watchdog resets its timer and creates a subsequent question, labeled "Q0". Process 200 continues by repeating subsequent read actions, calculations, and write actions until an error is detected or the system is shutdown. This operation performs Q&A watchdog timer functions; however, multiple bus transfers and custom calculations increase bus traffic and limit system compatibility.
Systems with many peripherals and/or devices that utilize buses for communication and data transfer can have heavy bus traffic. Known Q&A watchdog timers, such as those implementing the Q&A process 200 of FIG. 2, compete with other devices and peripherals due to the many bus transfers required to perform Q&A watchdog timer functions. In order to increase system performance, system watchdog timers need to reduce bus traffic while maintaining Q&A functionality.
The use of the same reference symbols in different drawings indicates similar or identical items. Unless otherwise noted, the word "coupled" and its associated verb forms include both direct connection and indirect electrical connection by means known in the art, and unless otherwise noted any description of direct connection implies alternate embodiments using suitable forms of indirect electrical connection as well.

System watchdog timer for a data processing system

SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC


A computing system includes: a gateway block configured to generate a modified operation for communicating a request operation issued by a host device to access a storage device; and wherein the gateway block includes: a conversion block configured to generate a converted interface for converting an interaction interface included in the request operation to the interaction interface executable by the storage device, and a translation block, coupled to the conversion block, configured to generate a translated representation for translating an object representation included in the request operation to the object representation utilized in the storage device.

Modern consumer and industrial electronics, such as computing systems, servers, appliances, televisions, cellular phones, automobiles, satellites, and combination devices, are providing increasing levels of functionality to support modern life. While the performance requirements can differ between consumer products and enterprise or commercial products, there is a common need for efficiently storing data.
Research and development in the existing technologies can take a myriad of different directions. Some homogeneously process data on disk-based storage. More specifically, many distributed storage systems runs on homogenous interfaces. Other distributed storage systems process data on cloud to store data.
Thus, a need still remains for a computing system with processing mechanisms for efficiently process data heterogeneously. In view of the ever-increasing commercial competitive pressures, along with growing consumer expectations and the diminishing opportunities for meaningful product differentiation in the marketplace, it is increasingly critical that answers be found to these problems. Additionally, the need to reduce costs, improve efficiencies and performance, and meet competitive pressures adds an even greater urgency to the critical necessity for finding answers to these problems. Solutions to these problems have been long sought but prior developments have not taught or suggested more efficient solutions and, thus, solutions to these problems have long eluded those skilled in the art.

Computing system with processing and method of operation thereof