A magazine for storing and dispensing cartridges to a firearm. In one embodiment, the magazine includes a tubular body, a compression spring, and a two-piece follower including a first follower moveable within the magazine and a second follower disposed below the first follower. The second follower may be movable independently of the first follower and is engaged by the compression spring which applies a biasing force towards an open top end of the magazine. The second follower includes a base plate having an upward extending flange configured and dimensioned for slidable insertion through a slot formed in the first follower. The second follower is operable to project the flange through the slot to contact and assist with ejecting the last spent cartridge case in the magazine. In one embodiment, the firearm may be a pistol.

The present disclosure generally relates to firearms, and more particularly to an improved cartridge magazine for a firearm.
Auto-loading firearms generally utilize a magazine for storing and automatically feeding ammunition cartridges or rounds into the firing system. When such firearms are discharged, a cartridge held in the chamber at the rear of the barrel is struck by a firing pin or striker to detonate the charge and propel the bullet or slug down the muzzle. This causes the action to reciprocate rearwards wherein the spent cartridge case or casing is extracted from the chamber and ejected from the firearm. A new cartridge presented by the magazine is then stripped therefrom by return movement of the action and loaded into the chamber in preparation for the next firing cycle.
The last expended case ejection has been a problem since the beginning of auto-loading magazine fed firearm designs. High speed photography has shown that autoloaders consistently eject spent casings by impacting the next round in the magazine more so in some instances than the firearm's ejector mechanism. When no next round is present, such as in the case of an empty magazine, the expended and extracted case upon occasion may slip off the extractor and does not reach the ejector, thereby remaining in the firearm until the magazine is eventually removed for replenishment with new cartridges or is manually shaken out of the action by the user.
A magazine with improved cartridge feed system is desired.


A mold clamping device in an injection molding machine comprises a first platen for retaining a first mold therein and a second platen for retaining a second mold therein; a platen feeding mechanism for moving said first and second platens relative to each other on said table; electromagnetic coils arranged on the opposite surfaces of the first and second platens; and a control device for controlling the amount of the current supplied to the electromagnetic coils. The mold clamping operation is carried out using the magnetic attracting force generated by the electromagnetic coils.

In an injection molding machine, a die casting machine or the like, a pair of molds therein must be kept in a closed state when a molding product is being molded. In order to maintain the molds in the closed state, against a greater inner pressure produced within the molds, a mold clamping operation is necessary to press the pair of molds towards each other by strong forces from the opposite sides. For this reason, in a molding device in an injection molding machine or the like, a molds clamping device, for maintaining the molds in the closed state during the molding operation, is provided together with an injection device for injecting a raw molding material in a molten state.
These conventional known mold clamping devices include a direct pressure type mold clamping device having a hydraulic driving type mold clamping piston-cylinder mechanism by means of which a pair of molds are directly pressed, and a toggle type mold clamping device having a toggle mechanism by means of which a mold clamping force is retained. In these mold clamping devices, platens are provided to retain the number of the molds necessary for forming a cavity in which a molding product is formed, one of these platens being used as a stationary platen, and the other being used as a movable platen which is moved towards the stationary platen.
When clamping the molds, a greater pressing force is applied to the molds between the movable platen and the stationary platen by pressing the mold clamping piston constituting the mold clamping piston-cylinder mechanism directly or through the toggle mechanism against the back side of the movable platen.
In this case, in the conventional device, the stationary platen and the clamping cylinder constituting the mold clamping piston-cylinder mechanism are connected by a plurality of bars (usually four) parallel to each other, and these tie bars are used as a guide to move the movable platen.
These tie bars are arranged in positions so as to enclose the molds as a center and serve as a sliding guide for the movable platen. Furthermore, they have a function of forming a closed loop between the stationary platen and the clamping cylinder to retain interiorly the mold clamping force. This makes the tie bars indispensable elements for the mold clamping device using the conventional hydraulic driving type clamping piston-cylinder mechanism.
However, since the tie bars are made of costly special alloy steel to maintain the strength thereof, they bring about an increased cost in the clamping device and also an increased number of parts for the mold clamping device.
Furthermore, the existence of the tie bars in the outer periphery of the molds causes some interference with the tie bars in the exchanging operation of the molds, which results in reduced efficiency of operation. For this reason, an attempt was made to axially move one of the four tie bars to thereby facilitate the exchange of the molds (for example, refer to Utility Model Publication No.23656/1975 and Utility Model Publication No. 27966/1990); however such a method requires the special provision of a transfer mechanism for the tie bars, which makes the construction of the mold clamping device more complicated.
In addition, the provision of the hydraulic driving type cylinder-piston mechanism at the rear side of the movable platen makes the mold clamping device longer in the axial direction, which causes the longer longitudinal dimension of an injection molding machine, a die casting machine or the like. This, in turn, makes it necessary to provide a greater work space when the injection molding machine is installed in a factory, and therefore has a disadvantage in that the efficiency of the factory layout is decreased.
Moreover, the hydraulic driving type piston-cylinder mechanism is problematic in that it requires some countermeasures for preventing the deterioration of the work environment due to leakage of oil or oil catching on fire.
This invention has been made taking such points into consideration, and aims at providing a mold clamping device which enables the number of parts to be reduced and a smaller sized device to be produced.
A further object of the invention is to provide a mold clamping device which permits the exchanging operation of the molds to be easily carried out due to the fact that the tie bars are made unnecessary.
Another object of the invention is to provide a mold clamping device which permits the maintenance and control the device to be facilitated due to the fact that the hydraulic driving system is removed.
A further object of the invention is to provide a mold clamping device which enables the control of the mold clamping operation to be facilitated and the most suitable clamping operation to always be carried out.

Injection molding method and apparatus with magnetic mold clamping


An information processing apparatus includes a calculation unit and a determination unit. The calculation unit has a two-dimensional calculation mode configured to perform, when an operation device is placed on an operation surface and a user operates the operation device, calculation based on a detection value of a motion sensor corresponding to two-dimensional motion of the operation device, and has a three-dimensional calculation mode configured to perform, when the user operates the operation device in a three-dimensional space, calculation based on a detection value of the motion sensor corresponding to three-dimensional motion of the operation device. The determination unit is configured to determine which of the two-dimensional calculation mode and the three-dimensional calculation mode is used to perform the calculation with the calculation unit, based on the detection value of the motion sensor and at least one of information other than the detection value of the motion sensor.

The present disclosure relates to an input apparatus including an operation device having a sensor for use in detecting motion and also relates to an information processing apparatus and an information processing method that process information obtained by the sensor.
In recent years, a variety of space operation (three-dimensional operation) type operation apparatuses or input apparatuses have been proposed. For example, an input apparatus described in Japanese Unexamined Patent Application Publication No. Hei 6-501119 detects the motion of a six-dimensional mouse in a three-dimensional space. More specifically, the input apparatus includes an accelerometer that detects acceleration along three orthogonal axes and a rotational speed sensor that detects rotational speeds about the three orthogonal axes. A system including the input apparatus determines its position, posture, or the like based on the obtained acceleration and rotational speeds, and a computer such as a display apparatus causes a GUI (Graphical User Interface) to realize motion according to the motion of the input apparatus (see, for example, Japanese Unexamined Patent Application Publication No. Hei 6-501119).

Information processing apparatus, information processing method, and input apparatus


The present invention pertains to a night light assembly which plugs directly into an electrical wall receptacle to provide a beam of light that can be directed along different paths.

1. Field of the Invention
The present invention relates generally to lights that are used to provide low level illumination in a room or passageway during the night, and more particularly to a night light assembly which provides a focused bean of light from an incandescent bulb or an LED that can be easily and selectively oriented from a rotatable assembly to shine in different directions and to an improved power supply circuit for an LED.
2. Description of the Related Art
Night lights which can be plugged into wall receptacles are normally used to provide low level illumination in a dark room or hallway. When used in a bedroom, a night light can provide sufficient light to allow a person, upon waking, to move about the room without banging into furniture, a doorway or such and still provide an ideal environment for sleeping. Where the bedroom is a child's nursery, a minimum amount of light in usually desirable. Very young children are often fearful of complete darkness and, in addition, should a parent wish to check on the sleeping child without turning on the room light, a low intensity night light that is continuously on is most useful and desirable.
The conventional night light consists of an electrical assembly having an electrical socket integrated with a plug for insertion into a wall receptacle. A low wattage lamp is held in the socket and a small translucent shade is usually provided to shield the lamp from direct view. A night light of this type normally uses a low wattage incandescent lamp which provide low level illumination. Light from the shielded bulb is normally reflected off an adjacent wall surface into the room to provide localized illumination that is purely utilitarian in function. The light is neither focused nor directionally controllable.
The patent to Victor, U.S. Pat. No. 6,200,001 illustrates a night light assembly which allows light from a small wattage lamp within the fixture to pass through a lens into the room. The beam of light emitted from the assembly can be directed by grasping and rotating a member containing a lens.
In the foregoing patent, the night light assembly has a stationary lamp which is positioned traverse to the rotational axis of the rotatable lens and, therefore, the filament of the lamp is not centered with the lens. With this arrangement, the base of the lamp interferers with and blocks reflected light from passing through the lens. In addition, the stationary lamp is hard wired to a PCB board that in turn is mechanically fastened to the prongs of the plug which not only increases the cost of manufacture of the assembly, but prevents the bulb from rotating with the head member.
A rotatable night light assembly that can direct a focused beam of light in different directions from a lamp aligned along the rotational axis of the lens to provide increased illumination, that is of a simple design and can be manufactured and sold at a relatively low cost is clearly desirable.
LED's are becoming more popular in residential and commercial lighting. Recently LED's have been used in night lights. As LED's operate at low DC voltage and low current, the power supply circuit for an LED typically uses resistor current limiting circuitry. The use of a resistor in the power supply circuit has the disadvantage of generating heat and not being the most efficient. What is needed is a power supply circuit for an LED that produces less heat and is more efficient.

This patent is subject to a terminal disclaimer.

Nightlight, LED power supply circuit, and combination thereof


The present invention provides a process for the preparation of sorafenib tosylate, comprising contacting sorafenib free base with p-toluenesulphonic acid in water.

Sorafenib tosylate is the tosylate salt of 4-(4-{3-[4-chloro-3-(trifluoromethyl) phenyl]ureido}phenoxy)-N2-methylpyridine-2-carboxamide, having the structure as represented by Formula I.

Sorafenib tosylate is an inhibitor of the enzyme rafkinase. It is marketed in the United States under the brand name Nexavar® for the treatment of unresectable hepatocellular carcinoma and advanced renal cell carcinoma.
WO 2006/034796, which is incorporated herein by reference, describes a process for the preparation of sorafenib tosylate in polar solvents.
The use of water, without using any other solvent, for the preparation of sorafenib tosylate is not described in the literature.

Process for the preparation of sorafenib tosylate


An input device having a fingerprint detection function is provided with operating portions for carrying out operations of a host device. The input device includes a device body connected to the host device, a fingerprint detecting portion provided in an upper surface of the device body and serving to detect the fingerprint of the user, and an opening portion for exposing the fingerprint detecting portion to the exterior.

The present invention relates to an input device which can input operation signals to host equipment.
Electronic Data Interchanges (commercial dealings) carried out through a network such as the Internet, etc. are carried out by information processing apparatus such as personal computers, mobile telephones or PDAs (Personal Digital Assistants), etc. In Electronic Data Interchanges, in order to realize the safety of dealings, there are instances in which a fingerprint, which is one form of bio-identification information, is collated with fingerprints registered in advance to thereby carry out certification with respect to the opponents in the dealings. This fingerprint collation is carried out by ordinarily connecting a fingerprint collating device to an information processing apparatus.
Moreover, a mouse for specifying an operating position on a computer screen, a keyboard for inputting characters and/or symbols, etc., and a drive unit for loading an external memory device, such as a memory card, etc., are connected to the information processing apparatus as peripheral equipment.
However, since there ordinarily are only several connecting portions for connecting peripheral equipment provided in the information processing apparatus, there are instances where a fingerprint collating unit cannot be newly connected. Further, in order to connect a fingerprint collating device, it is difficult to carry out connection/exchange with respect to peripheral equipment already connected to the information processing apparatus. In addition, the peripheral equipment which has been detached from the information processing apparatus could not be used for that time.
Meanwhile, in general, fingerprint detection methods for realizing the fingerprint collation function include an optical detection method of picking up the image of a fingertip using an image pick-up device, and an electrostatic capacity detection method of forming a capacitor to detect differences in capacitance depending on the fingerprint. Further, in order to connect to the information processing apparatus as a peripheral device, the electrostatic capacity type is advantageous for the purpose of suppressing enlargement of the equipment. In the fingerprint detection method of the electrostatic capacity type, as shown in FIG. 12, a barrier metal 102 consisting of Ti, etc. is formed on a substrate 101 where there are formed elements such as transistors, etc. which constitute a fingerprint sensor 100. At the upper surface of the barrier metal 102, metallic wiring (Al wiring) 103 is formed. A passivation film 105 consisting of silicon nitride film or silicon oxide film is formed at the uppermost layer of the substrate 101.
At the fingerprint sensor 100, as the result of a finger touching the passivation film 105, a capacitor is formed between the Al wiring 103 and the finger. The distance d between each Al wire 103 and the finger changes in accordance with the uneven state of the finger resulting from the fingerprint. Accordingly, at respective capacitors constituting the fingerprint sensor 100, differences in capacitance occur in accordance with individual fingerprints. By detecting such differences, fingerprint recognition can be carried out.
However, when the finger of the user is charged with static electricity, the fingerprint sensor 100 cannot precisely detect differences in the capacitance of the respective capacitors produced by the presence or absence of the fingerprint, thus failing to precisely detect the fingerprint.
Further, when dust, etc. is deposited on the passivation film 105 of the fingerprint sensor 100, it is impossible to precisely detect the differences in capacitance of the respective capacitors, thus failing to precisely detect the fingerprint.
Also, in fingerprint detection by the optical detection method, when dust, etc. is deposited on the image pick-up unit, such as a CCD or line sensor, etc., it is impossible to precisely pick up the image of an upheaval (rising) line of a fingerprint, thus failing to precisely detect the fingerprint.

Input device with fingerprint recognition


The present invention is directed to a method for identifying ribosomal antimicrobial substances being selective for microbial but not for mitochondrial and/or cytosolic ribosomes. Specifically, said method is directed to an assay that compares the interaction of a candidate ribosomal antimicrobial substance (i) in a bacterial strain with microbial ribosomes, and (ii) in a bacterial strain with chimeric mitochondrial bacterial ribosomes, and/or (iii) in a bacterial strain with chimeric cytosolic bacterial ribosomes. In a further aspect the present invention also relates to the use of bacterial strains with microbial ribosomes, and bacterial strains with chimeric mitochondrial bacterial ribosomes, and/or bacterial strains with chimeric cytosolic bacterial ribosomes for identifying ribosomal antimicrobial substance being selective for microbial but not for mitochondrial and/or cytosolic ribosomes. Furthermore, one or more of the above bacterial strains (i) to (iii) may be substituted by a functionally equivalent cell-free biological system.

The present invention relates to the field of ribosomal antimicrobial substances. The microbial ribosome is the target for many important antimicrobial substances, e.g. antibiotics. These compounds interfere with essential steps of protein synthesis. Ribosomal antimicrobial substances interfere with the microrganism's protein synthesis in such a manner that its propagation is reduced or it is killed. Today, the term antimicrobial substance is understood to encompass all substances that are active against microorganisms of any origin such as bacteria, protozoa and fungi. Ribosomal antimicrobial substances, in particular ribosomal antibiotics comprise, for example, 2-deoxystreptamine aminoglycosides, compounds of the streptomycin family, macrolides, lincosamides and streptogramin B.
Microbial resistance is a common problem with antimicrobial therapy these days. Recent reports indicate that resistance may be the result of one or more mutation(s) within the ribosomal RNA. The investigation of these mutations has proven difficult because microorganisms, e.g. bacteria, generally have several gene copies of rDNA per genome. However, new mutational strategies employing bacteria with low rRNA operon copy numbers such as Mycobacterium smegmatis allow for the study of the molecular basis of antimicrobial substance resistance. (Sander et al. Introducing mutations into a chromosomal rRNA gene using a genetically modified eubacterial host with a single rRNA operon, Molecular Microbiology (1996) 22(5), 841-848).
For example, the following positions were identified to confer resistance to antimicrobial substances, e.g. antibiotics: 1408 (Sander, supra), and 1491 (Pfister at al. Mutagenesis of 16 S rRNA C1409-G1491 base-pair differentiates between 6′OH and 6′NH3+ aminoglycosides, J. Mol. Biol. (2005) 346: 467-475)) in 16sRNA and position 2058 in 23 S rRNA (Sander et al. Mol. Microbiol. 1997, 26: 469-484). Specifically, the mutations A1408G, G1491C(A) and A2058G confer resistance depending on the antimicrobial substance employed. All reference numbers indicating nucleotide positions are based on the numbering of E. coli.
The corresponding positions in eukaryotic cytosolic rRNA are 1408G, 1491A, and 2058G, while the same position in eukaryotic mitochondrial rRNA are 1408A, 1491C, and 2058G.
From the above it becomes evident, that cytosolic and mitochondrial ribosomes may be susceptible or resistant to antimicrobial activity depending on the drug and the rRNA composition.
It has been suggested (Böttger et al., Structural basis for selectivity and toxicity of ribosomal antibiotics, EMBO reports, (2001) Vol. 2:4, 318-323) that                "The in vitro and in vivo selection of drug resistant bacteria, mapping of resistance conferring mutations and comparison to eukaryotic (mitochondrial and cytoplasmic) ribosomal nucleic acid and protein sequences may offer an important strategy to predict the specificity and toxicity of future antibiotics targeting the bacterial ribosome."
At present, antimicrobial substances, in particular antibiotics are tested for antimicrobial activity and resistance by contacting microorganisms directly whereas toxicity is tested by contacting eukaryotic cells and animals.
It is the object of the present invention to provide a faster, more economical, and simpler method for determining the specificity and toxicity of candidate antimicrobial substances. This object is solved by providing a method for identifying ribosomal antimicrobial substances being selective for microbial but not for mitochondrial and/or cytosolic ribosomes, comprising the following steps:                a) providing                    (i) at least one bacterial strain with microbial ribosomes, and            (ii) at least one bacterial strain with chimeric mitochondrial bacterial ribosomes, and/or            (iii) at least one bacterial strain with chimeric cytosolic bacterial ribosomes;                        b) contacting a candidate ribosomal antimicrobial substance with each of the bacterial strains according to a);        c) determining an interaction of the candidate ribosomal antimicrobial substance with one or more of the ribosomes of each of the bacterial strains according to a).
It was found that microbial systems comprising (i) microbial, preferably bacterial, (ii) chimeric mitochondrial bacterial and/or (iii) chimeric cytosolic bacterial ribosomes are sufficient for determining the ribosomal specificity and, consequently, the toxicity of ribosomal antimicrobial substances. The method of the present invention relies completely on bacterial cells and avoids the eukaryotic cell systems and animal models that were employed until now for specificity and toxicity testing. Bacterial systems are much more economical from a point of costs, replication time, manipulation and handling than their eukaryotic counterparts. It was demonstrated that the results obtained with purely bacterial strains significantly coincide with the results obtained with eukaryotic cell systems and animals.
In a preferred embodiment of the method of the present invention at least one of the bacterial strains mentioned in sections (i) to (iii) above may be substituted by a functionally equivalent cell-free biological system. More preferably, at least two, most preferably all three bacterial strains mentioned in sections (i) to (iii) above are substituted by a functionally equivalent cell-free biological system. In this respect it is to be noted that the term "bacterial strain" is meant to encompass functionally equivalent cell-free biological systems. The term "cell-free system" is well understood by those skilled in the art and does not require any further comment. Also, methods for providing cell-free systems are common general knowledge in the art and are routinely practiced by those of average skill in the art. The term "functionally equivalent" in the above respect is meant to relate to cell-free systems that comprise at least a functional ribosomal system capable of translational activity for producing polypeptides from nucleotides.
The term "ribosomal antimicrobial substance" is meant to define compounds that specifically interact with microbial, preferably bacterial ribosomes and function as antimicrobial, preferably bacteriocidal and/or bacteriostatic agents.
Ribosomal antimicrobial substances selective for microbial, preferably bacterial ribosomes, according to the present invention are those that do not affect mitochondrial and/or cytosolic ribosomes, preferably those that do not affect mitochondrial and cytosolic ribosomes.
The term "microbial ribosome" includes wild-type and chimeric ribosomes of micro-organisms, such as fungal, bacterial and protozoic ribosomes.
Antibiotics have been shown to be effective ribosomal antimicrobial substances in various microbial organisms such as, e.g. the helminth Echinococcus multicularis (Mathis et al. Antimicrobial Agents and Chemotherapy, August 2005: 3251-3255) and the protozoan Acanthamoeba castellanii (Mathis et al. Molecular & Biochemical Parasitology, 135, 223-227, 2004). Hence, the method of the invention is suitable for identifying ribosomal antimicrobial substances, in particular antibiotics, selective for many, most or even all types of microbial organisms. For example, the method of the present invention is suitable for identifying antimicrobial substances that are selective for the parasites giving rise to leishmaniasis and trypanosomiasis.
The term "chimeric mitochondrial bacterial ribosome" and the term "chimeric cytosolic bacterial ribosome" are meant to define a ribosome which is derived from a bacterial ribosome, wherein one or more nucleotide(s) of the ribosomal RNA has/have been replaced by the corresponding nucleotide from a mitochondrial ribosome or a cytosolic ribosome, respectively.
Typically, the contacting in step b) of the method of the present invention is effected by adding at least one candidate antimicrobial substance, optionally in a solvent or solvent system, to the bacteria or the functionally equivalent cell-free biological system directly, e.g. placing it onto the surface of the bacteria or cell-free system, or indirectly, e.g. adding the antimicrobial substance to the liquid or solid medium (e.g. gel, beads) surrounding or underlying the bacterial strain(s) or cell-free system(s). The contacting step is non-limiting and may be effected in any suitable manner known to the person skilled in the art.
The selectivity of the candidate antimicrobial substance and, consequently, the toxicity with regard to mitochondrial or cytosolic ribosomes may be determined by routine methods, in particular by comparing the candidate antimicrobial substance' inhibitory activity on the growth of bacterial strains and/or functionally equivalent cell-free ribosomal biological systems comprising (i) microbial ribosomes, and (ii) chimeric mitochondrial bacterial ribosomes, and/or (iii) chimeric cytosolic bacterial ribosomes.
In a preferred embodiment the method of the invention is one for identifying ribosomal antimicrobial substances selective for bacterial, protozoic and/or fungal ribosomes, preferably selective for bacterial and/or protozoic ribosomes, more preferably selective for bacterial ribosomes. In a particularly preferred embodiment, the method of the present invention is suitable for identifying antimicrobial substances selective for the protozoa giving rise to leishmaniasis and/or trypanosomiasis.
In a more preferred embodiment of the method of the invention the at least one bacterial strain (or functionally equivalent cell-free system) with microbial ribosomes of step a) (i) comprises microbial ribosomes selected from the group consisting of natural or chimeric bacterial, protozoic and fungal ribosomes, preferably natural or chimeric bacterial and/or protozoic ribosomes, more preferably natural or chimeric bacterial ribosomes. The bacterial strain (or functionally equivalent cell-free system) comprises at least one of said microbial ribosomes and may comprise microbial ribosomes of more than one microorganism, e.g. fungal and bacterial, fungal and protozoic, protozoic and bacterial or protozoic, fungal and bacterial ribosomes.
Preferred candidate ribosomal antimicrobial substances are selected from the group consisting of aminoglycosides, macrolides, lincosamides, preferably aminoglycosides, more preferably 2-deoxystreptamines.
Although the microbial ribosomes may be any bacterial ribosomes when antimicrobial substances selective against bacteria, i.e. antibiotics, are desired, it is preferred that the microbial ribosomes for use in the method of the invention are bacterial ribosomes from Mycobacterium smegmatis.
For identifying ribosomal antimicrobial substances selective against fungi it is preferred that the microbial ribosomes are chimeric fungal ribosomes characterized in that they are derived from bacterial ribosomes comprising at least one mutation selected from the group consisting of 1408A, 1410G, 1490C, and 1491G of according to the numbering of E. coli.
For identifying ribosomal antimicrobial substances selective against protozoa it is preferred that the microbial ribosomes are chimeric protozoic ribosomes characterized in that they are derived from bacterial ribosomes comprising at least one mutation selected from the group consisting of 1408A, 1409U, 1409A, 1410G, 1410 A, 1490U, 1491G, 1491U and 2058A of according to the numbering of E. coli.
Preferred chimeric mitochondrial bacterial ribosomes for practicing the method of the present invention are characterized in that they are derived from bacterial ribosomes comprising at least the mutation of G1491C according to the numbering of E. coli, preferably having further mutations selected from the group consisting of G1410C, U1411C, C1412U, A1413C, U1414C, G1415U, A1416C, U1484G, U1485A, G1488A, A1489G and C1490A.
More preferably, the chimeric mitochondrial bacterial ribosomes comprise mutations G1410C, U1411C, C1412U, A1413C, U1414C, G1415U, A1416C, U1484G, U1485A, G1488A, A1489G and C1490A.
Most preferably, the chimeric mitochondrial bacterial ribosomes are further humanized by mutation(s), preferably by mutation(s) in the ribosomal decoding site.
Preferred chimeric cytosolic bacterial ribosomes for practicing the method of the present invention are characterized in that they are derived from bacterial ribosomes comprising at least the mutation(s) of A1408G and/or G1491A according to the numbering of E. coli, more preferably having further mutations selected from the group consisting of G1410U, U1411A, A1413U, U1414A, G1415C, A1416C, U1484G, U1485G, G1486A, G1487A, A1489U, and C1490A.
More preferably, the chimeric cytosolic bacterial ribosomes comprise mutations G1410U, U1411A, A1413U, U1414A, G1415C, A1416C, U1484G, U1485G, G1486A, G1487A, A1489U, and C1490A, and much more preferably further comprise A1408G and G1491A.
Most preferably, the chimeric cytosolic bacterial ribosomes are further humanized by mutation(s), preferably in the ribosomal decoding site.
It is noted that the method of the invention is not limited to microbial ribosomes featuring mutations in the 16S rRNA much less is it limited to mutations in the decoding site of 16S rRNA. The embodiments herein relating to mutations in the decoding site of 16S rRNA merely serve as examples for illustrating the present invention and are by no means meant to limit its scope. For example, the method of the present invention encompasses any manipulations of functionally relevant regions of 16S rRNA or 23S rRNA that have a natural sequence polymorphism that can serve as a mutational basis for the method of the invention.
While there are a number of standard methods for determining the interaction of ribosomal antimicrobial substances available to those skilled in the art, it is preferred that for practicing the method of the invention the interaction of the ribosomal antimicrobial substance is determined by calculating the minimal inhibitory concentration (MIC) of the antimicrobial substance in each of the bacterial strains and/or cell-free systems according to step a), preferably the MIC of the antimicrobial substance relative to the MIC of the bacterial strain and/or cell-free system (i).
In a preferred embodiment the candidate antimicrobial substance identified according to the present invention is selective for bacterial, fungal and/or protozoic but not for mitochondrial and cytosolic ribosomes. More preferred it is selective for bacterial ribosomes, i.e. a ribosomal antibiotic.
In order to avoid interference of the bacterial cell's (or cell-free system's) own naturally occurring ribosomes with the introduced at least partially heterologous, mitochondrial or cytosolic bacterial ribosomes, at least part of at least one gene encoding the naturally occurring ribosomes can be modified, replaced or deleted.
In a preferred embodiment the method according to the invention is one, wherein the                (i) at least one bacterial strain with microbial ribosomes, and/or        (ii) at least one bacterial strain with chimeric mitochondrial bacterial ribosomes, and/or        (iii) at least one bacterial strain with chimeric cytosolic bacterial ribosomes;is a bacterial strain, wherein at least part of at least one gene encoding the naturally occurring bacterial ribosomal RNA sequence has been deleted and replaced by at least part of at least one gene encoding a heterologous microbial (i), mitochondrial (ii) and/or cytosolic (iii) ribosomal RNA sequence, respectively. Again, instead of said bacterial strains equivalent cell-free biological systems can be employed.
More preferably, the bacterial strain for practicing the method is Mycobacterium smegmatis, wherein at least part of the rrnA and/or rrnB gene(s) has (have) been deleted and replaced by at least part of at least one gene encoding a heterologous microbial (i), mitochondrial (ii) and/or cytosolic (iii) ribosomal RNA sequence.
In another preferred embodiment the cell-free system for practicing the invention is a system comprising bacterial ribosomal components, preferably from Mycobacterium smegmatis, preferably comprising its ribosome(s), wherein at least part of the chromosomal rRNA, preferably rrnA and/or rrnB gene(s), has (have) been deleted and replaced by at least part of at least one gene encoding a heterologous microbial (i), mitochondrial (ii) and/or cytosolic (iii) ribosomal RNA sequence.
Another aspect of the present invention relates to the use of bacterial strains or functionally equivalent cell-free biological systems in a method according to the invention.
In a preferred embodiment of this aspect, the invention relates to the use of bacterial strains or functionally equivalent cell-free biological systems comprising chimeric fungal ribosomes characterized in that they are derived from bacterial ribosomes, wherein the ribosomes are characterized in that they are derived from bacterial ribosomes comprising at least one mutation selected from the group consisting of 1408A, 1410G, 1490C, and 1491G of according to the numbering of E. coli in a method according to the invention.
In another preferred embodiment of this aspect, the invention relates to the use of bacterial strains or functionally equivalent cell-free biological systems comprising chimeric protozoic ribosomes characterized in that they are derived from bacterial ribosomes, wherein the ribosomes are characterized in that they are derived from bacterial ribosomes comprising at least one mutation selected from the group consisting of 1408A, 1409U, 1409A, 1410G, 1410 A, 1490U, 1491G, 1491U and 2058A of according to the numbering of E. coli in a method according to the invention.
In another preferred embodiment of this aspect, the invention relates to the use of bacterial strains or functionally equivalent cell-free biological systems comprising chimeric mitochondrial bacterial ribosomes characterized in that they are derived from bacterial ribosomes comprising at least the mutation of G1491C according to the numbering of E. coli, preferably having further mutations selected from the group consisting of G1410C, U1411C, C1412U, A1413C, U1414C, G1415U, A1416C, U1484G, U1485A, G1488A, A1489G and C1490A in a method according to the invention.
More preferably, the chimeric mitochondrial bacterial ribosomes comprise mutations G1410C, U1411C, C1412U, A1413C, U1414C, G1415U, A1416C, U1484G, U1485A, G1488A, A1489G and C1490A.
Most preferably, the chimeric mitochondrial bacterial ribosomes are further humanized by mutation(s), preferably in the ribosomal decoding site.
In a further preferred embodiment of this aspect, the invention relates to the use of bacterial strains or functionally equivalent cell-free biological systems comprising chimeric cytosolic bacterial ribosomes characterized in that they are derived from bacterial ribosomes comprising at least the mutation of A1408G and/or G1491A according to the numbering of E. coli, more preferably having further mutations selected from the group consisting of G1410U, U1411A, A1413U, U1414A, G1415C, A1416C, U1484G, U1485G, G1486A, G1487A, A1489U, and C1490A in a method according to the invention.
More preferably, the chimeric cytosolic bacterial ribosomes comprise mutations G1410U, U1411A, A1413U, U1414A, G1415C, A1416C, U1484G, U1485G, G1486A, G1487A, A1489U, and C1490A, and more preferably further comprise mutations A1408G and G1491A.
Most preferably, the chimeric cytosolic bacterial ribosomes are further humanized by mutation(s), preferably in the ribosomal decoding site.
As mentioned before, in order to avoid interference of the bacterial cell's (or cell-free biological system's) own naturally occurring ribosomes with the introduced at least partially heterologous, mitochondrial or cytosolic bacterial ribosomes, at least part of at least one gene encoding the naturally occurring ribosomes can be modified, replaced or deleted.
Therefore, in another preferred embodiment the present invention relates to the use of a bacterial strain or functionally equivalent cell-free biological system, wherein at least part of at least one gene encoding the naturally occurring bacterial ribosomal RNA sequence has been deleted and replaced by at least part of at least one gene encoding a heterologous microbial (i), mitochondrial (ii) and/or cytosolic (iii) ribosomal RNA sequence in a method according to the invention.
More preferably, the present invention is directed to the use according to the invention, wherein the bacterial strain is Mycobacterium smegmatis or wherein the functionally equivalent cell-free biological system is derived from Mycobacterium smegmatis, wherein at least part of the rrnA and/or rrnB gene(s) has (have) been deleted and replaced by at least part of at least one gene encoding a heterologous microbial (i), mitochondrial (ii) and/or cytosolic (iii) ribosomal RNA sequence.
A further aspect of the present invention relates to a kit of parts comprising any one or more of the above bacterial strains or functionally equivalent cell-free biological systems or components thereof for use in the method of the present invention and optionally written instructions, buffer materials, bacterial nutrient(s), aqueous solvent(s), antimicrobial substance(s), etc.
In the following specific embodiments of the present invention will be described for the purpose of illustrating the present invention and for providing a best mode for carrying out the invention.

Screening assay for ribosomal antibiotics

Eidgenoessicsche Technische Hochschule Zurich eth Transfer


In an electroplating apparatus, an electrolytic agent is filled into the portion between an anode and a dummy cathode which is opposite substantially face to face and parallel to the anode, and an electric current is supplied to this portion, thereby suppressing changes in properties of a black film during the period in which plating to a substrate to be processed is stopped. In particular, by applying an electric current to the anode immediately before plating to the substrate is resumed, the film formation characteristics of plating to the substrate can be maximally stabilized. This can reduce the consumption power and dissolution of the anode. This apparatus is particularly effective in copper plating in which the formation of a black film is significant.

This application is based upon and claims the benefit of priority from the prior Japanese Patent Application No. 2000-150253, filed May 22, 2000, the entire contents of which are incorporated herein by reference.
The present invention relates to copper plating and, more particularly, to an electroplating apparatus and electroplating method of performing single wafer processing for semiconductor substrates and the like.
Electroplating of copper which has been often used in plating industries for a long time is recently attracting attention as a multilayered wiring process for semiconductors. This is so because copper having low resistivity is beginning to be used as a multilayered wiring material of semiconductors. In addition, film formation by plating is superior in step coverage and hence well matches a wiring formation process (damascene process). Also, film formation by plating is possible at higher speed and lower cost than film formation by, e.g., sputtering. These are other reasons of the introduction of the plating process.
In copper plating, however, caution should be exercised on a thin black film called a xe2x80x9cblack filmxe2x80x9d formed on the surface of an anode. This black film is presumably a compound of oxygen or chlorine contained in a plating liquid and copper or phosphorus contained in phosphorus containing copper as an anode material. When a substrate to be processed is plated, copper is formed on the substrate as a cathode and a black film is formed on an anode by application of electricity.
This black film is stable as long as electricity is supplied to a plating liquid. However, when electricity is turned off or the anode is pulled up from the plating liquid, the black film is lost as it is removed from the anode or dissolved in the plating liquid. If the black film is partly lost on the surface of the anode, the uniformity of film formation on the wafer as a substrate to be processed significantly lowers, or a precipitation is formed on the film surface.
In practice, therefore, if the time during which an electroplating apparatus is unused exceeds a predetermined time, electricity is applied by using a dummy wafer to intentionally form a black film. This is called xe2x80x9canode burn-inxe2x80x9d. This anode burn-in is indispensable to stably obtain performance (e.g., filling performance and film thickness uniformity) of copper plating.
Furthermore, even on an anode such as an indissoluble anode on which no black film is formed, oxidation of the anode occurs owing to application of an electric current. This makes the state of the anode surface when electricity is applied different from that when the anode is left to stand for a long time period. Therefore, anode burn-in is necessary regardless of the presence/absence of a black film.
Accordingly, after plating to a wafer to be processed is stopped for a predetermined time, anode burn-in to a dummy wafer must be performed prior to wafer plating in the next process. This significantly lowers the utilization efficiency of the electroplating apparatus.
An example of anode burn-in and its problem will be described below by taking a cup type electroplating apparatus most extensively used in the semiconductor industries as an example. FIG. 1 is a sectional view of the cup type electroplating apparatus whose main purpose is copper plating. As shown in FIG. 1, this apparatus comprises a plating liquid 2 filled and circulated in a cup 1, an anode 3 placed in the cup 1, an electrode 5 for giving a negative potential to the surface of a wafer 4 facing the anode 3, a seal 6 for preventing the plating liquid 2 from contacting the electrode 5, and a power supply 7 for supplying an electric current to the wafer 4 and the anode 3.
The plating liquid is usually an aqueous solution mixture of copper sulfate, sulfuric acid, and hydrochloric acid. When the wafer 4 is completely processed and retracted, no electric current flows to the anode 3 any longer. The anode 3 is exposed to the plating liquid 2 in this state. Alternatively, the anode 3 is exposed to the atmosphere if the plating liquid 2 is discharged from the cup 1. In either case, a black film formed on the surface of the anode 3 changes in properties with time. Hence, the manufacturer of the apparatus recommends maintenance, e.g., as shown in FIGS. 2 and 3.
As shown in FIGS. 2 and 3, when the electroplating apparatus is set in a standby state after plating is completed, a preparation time before plating becomes possible and is needed in order to resume plating. That is, the actual wafer processing of the electroplating apparatus is very wasteful in Large Scale Integration (LSI) factories, and this raises the LSI process cost. In particular, the multilayered wiring step is in the latter half of the LSI fabrication process. In a factory, therefore, predetermined numbers of wafers are anode but large numbers of wafers are intermittently supplied. Accordingly, anode burn-in explained above sometimes occupies nearly ⅓ of the operation time of the electroplating apparatus. This is a serious problem in the LSI fabrication process.
It is an object of the present invention to provide an electroplating apparatus and electroplating method capable of improving the throughput by reducing the anode burn-in time.
To achieve the above object, an electroplating apparatus according to the first aspect of the present invention comprises a holder configured to hold a substrate to be processed serving as a cathode, a dummy cathode placed in a position different from the holder, an anode capable of facing, substantially face to face, both a surface to be plated of the substrate held by the holder and the dummy cathode, a moving mechanism configured to move the anode between the substrate holder and the dummy electrode, and a power supply connected between the dummy cathode and the anode to supply an electric current between the anode and the dummy cathode via an electrolytic agent filled between the dummy cathode and the anode.
An electroplating apparatus according to the second aspect of the present invention comprises a cup to be filled with an electrolytic agent, an anode placed on a bottom of the cup, a holder for holding a substrate to be processed in an upper portion of the cup, such that a surface to be plated of the substrate faces the anode, a dummy cathode capable of moving, as needed, to a position between the anode and the substrate, a moving mechanism for retracting the dummy cathode when the substrate is to be plated, and opposing the dummy cathode substantially face to face to the anode when plating of the substrate is stopped, and a power supply connected between the dummy cathode and the anode.
An electroplating method according to the third aspect of the present invention comprises the steps of preparing a dummy cathode, opposing a plate-like anode substantially face to face and parallel to the dummy cathode via an electrolytic agent, with no electricity applied, supplying an electric current between the anode and the dummy cathode after the step of opposing the anode to the dummy cathode, and opposing a substrate to be processed serving as a cathode to the anode via an electrolytic agent and forming a plating film on the substrate, after the step of supplying an electric current between the anode and the dummy cathode.
In the present invention, changes in properties of a black film are suppressed by filling an electrolytic agent into a portion between an anode and a dummy cathode which is opposite substantially face to face and parallel to the anode, and supplying an electric current to this portion. Since extra anode burn-in is unnecessary, the throughput improves.
The effect of the present invention is large in copper plating in which the formation of a black film is significant. The consumption power and dissolution of the anode can be reduced by applying an electric current to the anode immediately before resumption of plating or by intermittently applying this electric current. In particular, the film formation characteristics of plating to a substrate to be processed can be maximally stabilized by applying the electric current to the anode immediately before the substrate is plated.
When both the dummy cathode and the anode are substantially flat plates and the apparatus comprises a mechanism capable of maintaining these cathode and anode parallel to each other, the density of an electric current flowing through the anode becomes uniform, so a uniform black film can be formed on the anode. This can realize a uniform plating film growth rate and uniform film formation characteristics over the entire surface of a substrate to be processed. When phosphorus containing copper is used as the anode, the formation of a black film occurs stably, and this makes the effect of the present invention remarkable.
Additional objects and advantages of the invention will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. The objects and advantages of the invention may be realized and obtained by means of the instrumentalities and combinations particularly pointed out hereinafter.

Electroplating apparatus and electroplating method


An example method of manufacturing a semiconductor device having a capacitor includes sequentially depositing a lower metal layer, an insulating layer and an upper metal layer on a semiconductor substrate, removing a first photoresist pattern by using O2/N2 plasma, and removing polymer existing on the lower metal layer by using H2O/CF4 plasma. According to one example, the capacitor may include a lower electrode film, the capacitor insulating film and the upper electrode film.

Recently, there has been a demand for a system large scale integrated circuit (LSI) that combines several LSIs into a single LSI. The demand has been driven by the desire for more compact and faster devices and products. Further, a hybrid LSI, combining an analog circuit and a digital circuit into a single LSI has been developed as communications technology progresses.
A capacitor having a highly precise and stable characteristics independent of voltage is required for the manufacture of analog circuits. Polysilicon insulator polysilicon (PIP) capacitors have been used in such applications. The PIP capacitor is composed of two impurity-doped electrodes and an ONO (oxide-nitride-oxide) film interposed therebetween.
The PIP capacitor has significant drawbacks in that PIP capacitor has large voltage and temperature coefficients, so that the capacitor suffers from a large voltage and temperature dependency. Further, the LSI may not be operated stably due to a large resistance of poly-Si.
As an alternative to solve such problems, therefore, the use of a metal insulator metal (MIM) capacitor has been proposed. The MIM capacitor, utilizing metal electrodes having a lower voltage coefficient and a lower electric resistance than poly-Si, can be formed in multiple wiring layers so that a parasitic capacitance can be also restrained. Particularly, such MIM capacitor is used in a high frequency semiconductor device. That is, a high-frequency device uses the MIM capacitor utilizing a metal of excellent electric characteristics because device characteristics thereof can be changed by RC delay.
FIGS. 1A, 1B, 1C and 1D are cross sectional views showing a structure of a known MIM capacitor and a known manufacturing process. As shown in FIG. 1A, a lower metal layer 102, an insulating layer 104 and an upper metal layer 106 are sequentially deposited on a semiconductor substrate 100. Subsequently, a first photoresist pattern 108 is formed on the upper metal layer 106. The lower metal layer 102 is typically formed by laminating an insulating film such as an oxide film, a Ti/TiN film serving as a first barrier metal film, a metal film made of aluminum or copper, and a Ti/TiN film serving as a second barrier metal film.
Next, an upper electrode film 106′ and a capacitor insulating film 104′ are formed by etching the upper metal layer 106 and the insulating layer 104, as shown in FIG. 1B, wherein the first photoresist pattern 108 and the lower metal layer 102 serve as a mask and an end point, respectively. Conventionally, etching of the upper metal layer 106 and the insulating layer 104 is done by metal RIE.
In a RIE process for etching the upper metal layer 106 and the insulating layer 104, polymer 110 is normally produced on the lower metal layer 102. Though a cleaning process is performed to remove the polymer 110 before performing next processes, the polymer 110 is not removed completely and a part thereof remains.
Next, as shown in FIG. 1C, the first photoresist pattern 108 is removed and then there is formed on the resultant structure a second photoresist pattern 112 for completely encapsulating the upper electrode film 106′ and the capacitor insulating film 104′ to pattern the lower metal layer 102.
Subsequently, as shown in FIG. 1D, a lower electrode film 102′ is formed by etching the lower metal layer 102 by using the second photoresist pattern 112 as a mask, and then the second photoresist pattern 112 is removed. Therefore, a MIM capacitor 114 including the lower electrode film 102′, the capacitor insulating film 104′ and the upper electrode film 106′ is obtained.
However, certain parts of the lower metal layer 102, e.g., an area shown in FIG. 1D at reference character A, may not be properly etched at the step of etching the lower metal layer 102 due to the polymer 110 remaining on the lower metal layer 102. Therefore, characteristics of the MIM capacitor are deteriorated and a production yield is also lowered.

Methods of manufacturing semiconductor devices having capacitors


A tantalum or tungsten target-backing plate assembly which comprises a tantalum or tungsten target and a copper alloy backing plate that are subject to diffusion bonding via an aluminum- or aluminum alloy-sheet insert material at least 0.5 mm thick, and which is provided with diffusion bonded interfaces between the respective materials, wherein the assembly suffers only a small deformation after diffusion bonding and is free from separation between the target and the backing plate or from cracking even when the target material and the backing plate differ greatly in thermal expansion, and can survive high power sputtering; and a production method therefor.

The present invention pertains to a tantalum or tungsten target-copper alloy backing plate assembly capable of enduring high power sputtering, and to a production method therefor. Moreover, tantalum or tungsten as described in this specification shall include alloy targets having such components as the principal components.
Diffusion bonding is an effective method as a bonding method of a sputtering target and backing plate capable of surviving high power sputtering, and the present applicants presented in Japanese Patent Laid-Open Publication No. H6-108246 a solid phase diffusion bond target assembly in which an insert material is inserted between the target and backing plate, and a production method thereof. The sputtering target assembly produced with this solid phase diffusion bonding has superior adhesiveness and strength.
Nevertheless, the sputtering target itself is being enlarged pursuant to the enlargement of the wafer aperture in recent years, and, in particular, the deformation after the diffusion bonding is becoming a serious problem in a case where the thermal expansion coefficients of the target material and the backing plate material differ greatly.
When the thermal expansion coefficient of the sputtering target is smaller in comparison to the backing plate (this is often the case in a target-backing plate assembly structure), with the target on top and the backing plate on bottom, such sputtering target will curve convexly upward when it is cooled from the temperature of the diffusion bonding to room temperature, and, when the diffusion bonding strength is weak, there are cases where such sputtering target will separate from the outer periphery of the bonding boundary.
Moreover, even if it did not separate, the amount of curvature would become large, and, in order to prescribe the thickness of the target, it is necessary to process (cut) the convex portion of a target previously thickened for the amount of curvature or to correct the curve at room temperature after the diffusion bonding. This would cause a problem of increasing the work process and ultimately increasing the cost.
In particular, with targets prepared with the powder metallurgical production method such as with tungsten, there would even be incidents where the target would crack if the amount of curve is too large.
As case examples having this kind of problem, it has been confirmed that this problem occurs frequently when tantalum or tungsten is used as the target material and aluminum or aluminum alloy is used as the backing plate.
Further, there were even cases where the coolant would leak as a result of the backing plate deforming due to the thermal influence of high power sputtering.
For example, upon diffusion bonding a tantalum target having a xcfx86 of 350 mm and a thickness of 10 mm with an aluminum alloy (A5052) backing plate in a vacuum, at 500xc2x0 C. and bearing of 15 kgf/mm2, the amount of curvature varied between 4 mm to 7 mm per lot, and in some cases the bonding boundary had separated.
And, upon processing a bonded assembly having a curvature of 4 mm into a shape of a target and performing sputtering thereto at a sputtering power of 20 KW, the target deformed and an accident of water leakage was observed.
An object of the present invention is to provide a tantalum or tungsten target-backing plate assembly which suffers only a small deformation after the diffusion bonding even when the target material and the backing plate differ greatly in the thermal expansion coefficient, is free from separation between the target and the backing plate or from cracking, and capable of surviving high power sputtering; and a production method therefor.
Thus, upon conducting an intense study in relation to the production of a tantalum or tungsten target diffusion bonded with a backing plate capable of surviving high power sputtering and having a minimal amount of curvature after the diffusion bonding, the present inventors have discovered that it is extremely effective to use copper alloy, which has a smaller thermal expansion coefficient than aluminum alloy, which is hard and difficult to deform, and which has favorable thermal conductivity, as the backing plate, and to use an aluminum- or aluminum alloy-sheet having a certain degree of thickness as the insert material. Based on the foregoing discovery, the present invention provides:
A tantalum or tungsten target-copper alloy backing plate assembly characterized in that a tantalum or tungsten target and a copper chrome alloy or copper zinc alloy backing plate are subject to diffusion bonding via an aluminum- or aluminum alloy-sheet insert material having a thickness between 2.0 mm or more and 6.0 mm or less, and which is provided with diffusion bonded interfaces between the respective materials, wherein the amount of curvature after bonding is 3 mm or less.
A production method of a tantalum or tungsten target-copper alloy backing plate assembly, characterized in that a tantalum or tungsten target and a copper chrome alloy or copper zinc alloy backing plate are subject to diffusion bonding via an aluminum- or aluminum alloy-sheet insert material having a thickness between 2.0 mm or more and 6.0 mm or less in a vacuum, at a temperature between 400xc2x0 C. and 548xc2x0 C., and under a pressure condition of 15 to 20 kg/mm2, wherein the amount of curvature after bonding is 3 mm or less.

Tantalum or tungsten target-copper alloy backing plate assembly and production method therefor


A method for preparing granulated alkaline earth metal carbonate, particularly barium carbonate or strontium carbonate, by adding a binding agent and optionally water; granulating the resulting mixture, preferably in the presence of water; drying the granular product; and optionally subjecting the granular product to a high-temperature treatment, in which the material to be granulated and the granulated material do not contact any inorganic refractory material during the granulation, during subsequent drying, and during any high-temperature treatment.

This invention relates to a method for preparing granulated alkaline earth metal carbonate, to granulated alkaline earth metal carbonate produced by the method of the invention, and to use of such granulated alkaline earth metal carbonate in the glass industry.
Alkaline earth metal carbonate, particularly barium carbonate and strontium carbonate, are used in the glass industry, for example in the manufacture of faceplates for television receivers. In this way X-rays from cathode ray tubes can be absorbed.
One method for producing very pure alkaline earth metal carbonates is the precipitation of alkaline earth metal hydroxides or alkaline earth metal sulfides with carbon dioxide or carbonates. In this process very fine powders are formed, which are difficult to handle. In the past, such powders have been granulated by sintering at about 800.degree. C. in rotary kilns which are lined with inorganic refractory materials, e.g., with amorphous silicon dioxide, aluminosilicates or fire clay. In such kiln granulation processes, it is absolutely impossible to prevent detritus of refractory material from contaminating the granules. Due to these impurities, a considerable proportion of the picture tubes produced have to be considered unusable and must be remelted.
Adams et al., U.S. Pat. No. 4,888,161 describes a method for decreasing the contamination of the carbonate by detritus of refractory material attributable to the high sintering temperature of 800.degree. C. In that process, a suspension of the carbonate in water initially is prepared, and an amount of a deflocculant sufficient to deflocculate the carbonate is added. Preferred deflocculants are alkali metal salts or ammonium salts of acrylic acid or methacrylic acid or of phosphoric acid or polyphosphoric acid. The fluid suspension is then dried in a spray dryer, and the resulting granular product is heated to 600.degree. to 700.degree. C. The type of heating used is described as not critical.
There remains a need for an improved method of producing granulated, high purity alkaline earth metal carbonate.

Preparation of granulated alkaline earth metal carbonate


According to one aspect, the subject application involves a method of controlling a transition of a gas turbine. The method includes receiving a request of the gas turbine to drive an increased load. The increased load is greater than a load being driven by the gas turbine when the request is received. The method further includes determining that a temperature of a fuel to be ignited within a combustor of the gas turbine is less than a target temperature of the fuel to be introduced into the combustor for driving the increased load. Responsive to this determination, the method also includes controlling introduction of an additive into the combustor of the gas turbine when the temperature of the fuel is less than the target temperature to establish a suitable Wobbe Index of a fuel combination to promote a substantially continuous transition of the gas turbine to drive the increased load, wherein the fuel combination includes the fuel and the additive.

1. Field of the Invention
This application relates generally to a method and apparatus for minimizing a startup time of a gas turbine, and more specifically to method and apparatus for controlling a Wobbe Index of a fuel supplied to the gas turbine to minimize delays in turbine loading to allow the fuel to be heated before being delivered to the gas turbine.
2. Description of Related Art
Industrial turbines are often gas-fired and are commonly employed to drive loads such as generators installed at electric power plants to produce electric energy. Such gas turbines are designed to burn a specific range of fuels, and to burn such fuels under specific conditions, such as fuel temperature. The fuel composition and temperature are used to calculate a term know as the Wobbe index which speaks to the heating value of the fuel on a volume basis. The range of fuel flow from no load to base load, as well as the Wobbe index, are used to determine the fuel staging, or modes, within the combustor and other details such as the nozzle sizing.
In order to achieve higher plant efficiency at loads where continuous operation is expected, the fuel may be heated to a specific temperature. The heating of the fuel lowers the Wobbe index as the higher temperature increases the volume of the fuel at the same pressure. Operation of the turbine at a Wobbe index outside the design range may generate undesirable acoustic resonances that can damage the turbine hardware or result in the loss of flame in the combustor. In these cases, the elevated fuel temperature becomes a control permissive to enter these combustion modes to assure that the fuel has the required Wobbe index. If the fuel temperature has not been raised within the required range, then the system must hold at a given load until the temperature permissive has been met.
Gas turbines are also frequently called upon to drive large loads such as generators soon after a request for operation of the gas turbine is made. The gas turbine is expected to respond rapidly to a request for operation and quickly transition from an idle, or off mode in which the gas turbine produces no output power to a full load mode in which the gas turbine is driving the complete load per the operator's request. However, many gas turbine installations rely on their own hot exhaust gases or steam from a bottoming cycle to warm the fuel to be delivered to the combustor. Since it takes time for the exhaust gases to rise to their standard operating temperature the fuel initially delivered to the combustor immediately after startup of the gas turbine is initiated is lower than a target temperature of the fuel for which the gas turbine was designed. Introducing fuel below the target temperature can result in a Wobbe Index outside the desired range, possibly leading to combustion dynamics that can damage the gas turbine. And if a rapid response is required of the gas turbine to quickly drive a large load from startup, there will not be enough time to adequately preheat the fuel to an acceptable temperature to satisfy the demands of that specific load. Thus, the gas turbine is forced to burn the fuel below its target temperature and risk damage or experience a delay during startup, which may not be an option depending on the load to be driven.
To avoid a scenario where the gas turbine burns insufficiently-heated fuel at startup some installations including gas turbines also include a separate, stand-alone boiler to heat the fuel before it is delivered to the gas turbine at startup. However, to meet the rapid response startup demands of a large load as mentioned above the auxiliary boiler must be maintained in an active, fired state, and on standby at all times, even when the gas turbine is not actively operating. Continuously maintaining such a boiler on standby at all times consumes significant amounts of energy, is costly, and wasteful.
Accordingly, there is a need in the art for a method and apparatus for minimizing the fuel effects during a transition of a gas turbine from a first loaded state to a second loaded state where the load being driven is greater than in the first loaded state. Such a method and apparatus can optionally adjust a Wobbe Index of a fuel, at least temporarily, until such time as the temperature of the fuel can be sufficiently elevated to satisfy a change in load on the gas turbine. The method and apparatus can optionally adjust the Wobbe Index of the fuel based on a composition of the fuel, and can optionally adjust the Wobbe Index in this manner in parallel with heating of the fuel.

Hybrid Wobbe control during rapid response startup


The present invention relates to a bidirectional 3 phase power meter for compensating reverse load flow and a method for metering thereby. According to the present invention, there is provided a bidirectional 3 phase power meter for compensating reverse load flow which allows calculating power receiving and power transmitting apparent power and power factor using the detected voltage/current and a method for metering thereby.

1. Technical Field
The present invention relates to a bidirectional 3 phase power meter for compensating reverse load flow and a method for metering thereby.
2. Background
Problems metering excessively or insufficiently have been caused due to a reverse load flow phenomenon in a power provider's system, regardless of used power by a user or generated power.
Here, the reverse load flow refers to a energy that flows from the load side to the source side, and is a ground source supplied through the neutral line in a Yg-Δ connection type. Generally, no reverse load flow occurs in a Δ-Y connection type a receiving transformer, but the Yg-Δ connection type is a common connection of an interconnection transformer of DGs(Distributed Power Generation).
Especially, such a reverse load flow phenomenon severely occurs in a transmission and distribution power system interconnected with distributed power occurrence such as photovoltaic power occurrence, wind power occurrence and the like, which causes an error therefore, regardless of accuracy of a power meter.
A power meter calculates the price based on maximum power, active power usage, and power factor. A calculation zone of a power meter is the region where a reactive power region is overlapping to an active power region.
In the reactive power region, there are various kinds of var-hour (reactive power) meters as 0 to 180° region is a lagging reactive power zone, 60 to −120° region is a lagging and leading reactive power zone, and 90 to −90° region is a lagging and leading zone. For example, a reactive power meter of the lagging zone of 0 to 180° does not meter the leading reactive power. However, the leading reactive power is metered during the power transmission and this causes an error when power factor is calculated. In the 60 to −120° region, the leading power and the lagging power are metered at the same time but the region above 60° cannot be metered. Therefore, it is the most apparent that the active power region and the reactive power region be overlapped as in the calculating zone.
In general, a power receiving consumer uses Δ-Y wiring method for an interconnection transformer and a power transmitting consumer uses Yg-Δ wiring method. A general load flow direction of a power receiving consumer is the direction from a power provider to a power user and a load flow direction of a power transmitting consumer is the direction from a power user to a power provider. When load flow per phase, unlike identical 3 phase load flow, is mixed in a direction from a power supply side to a load side or from a load side to a power supply side, a measurement error may occure because load unbalance in a power system occurs due to a wiring method of the interconnection transformer and a load flow direction of one phase among 3 phases is thus changed which is called as reverse load flow. This problem usually occurs in the power transmitting side but it sometimes occurs in the power receiving side due to a wiring system of the interconnection transformer.
A conventional power transmitting side installs a power receiving power meter and a power transmitting power meter and calculates amount of power receiving power and amount of power transmitting power, respectively. Here, in the power receiving state, a power receiving power meter operates and in the power transmitting state, a power transmitting power meter operates. However, in the reverse load flow state, since a reverse load flow is occurred in a power provider's system, a power receiving power meter and a power transmitting power meter cause extremes errors.
The power transmitting power meter has identical structure to the power receiving power meter and a bidirectional power meter measuring for both power transmitting and power receiving uses by combining two of a one way metering system.

Bidirectional 3 phase power meter for compensating reverse load flow and method for metering thereby


A method for controlling channel signaling between a UE and a wireless network access node is described. The method includes determining whether an examined sub-frame of a plurality of sub-frames in a first resource region is unused. The index of the examined sub-frame is a last index of the plurality of sub-frames allocated for use in a first channel. The plurality of sub-frames is organized in a reverse indexing manner such that a last indexed sub-frame is adjacent to a second resource region. The second resource region is allocated to a second channel. In response to determining that the examined sub-frame is unused, the examined sub-frame is re-allocated for temporary use in the second channel. The method also includes providing an indication of the allocation. Apparatus and computer readable media are also described.

This section is intended to provide a background or context to the invention that is recited in the claims. The description herein may include concepts that could be pursued, but are not necessarily ones that have been previously conceived or pursued. Therefore, unless otherwise indicated herein, what is described in this section is not prior art to the description and claims in this application and is not admitted to be prior art by inclusion in this section.
Various abbreviations that may appear in the specification and/or in the drawing figures are defined as follows:                3GPP third generation partnership project        ACK acknowledge        AN ACK/NACK        CCE control channel element        CQI channel quality indicator        DAI downlink activity indicator        DL downlink (eNB towards UE)        eNB EUTRAN Node B (evolved Node B)        EPC evolved packet core        EUTRAN evolved UTRAN (LTE)        FDD frequency division duplex        FDMA frequency division multiple access        HARQ hybrid automatic repeat request        LTE long term evolution        MAC medium access control        MM mobility management        MME mobility management entity        NACK not (negative) acknowledge        Node B base station        O&M operations and maintenance        OFDMA orthogonal frequency division multiple access        PCFICH physical control format indicator channel        PDCP packet data convergence protocol        PHY physical        PRB physical resource block (180 kHz)        PUCCH physical uplink control channel        PUSCH physical uplink shared channel        RB resource block        RLC radio link control        RRC radio resource control        RRM radio resource management        SC-FDMA single carrier, frequency division multiple access        S-GW serving gateway        TDD time division duplex        UE user equipment        UL uplink (UE towards eNB)        UTRAN universal terrestrial radio access network
A communication system known as evolved UTRAN (E-UTRAN, also referred to as UTRAN-LTE or as E-UTRA) is currently under development within the 3GPP. As presently specified the DL access technique will be OFDMA, and the UL access technique will be SC-FDMA.
One specification of interest is 3GPP TS 36.300, V8.4.0 (2008-03), 3rd Generation Partnership Project; Technical Specification Group Radio Access Network; Evolved Universal Terrestrial Radio Access (E-UTRA) and Evolved Universal Terrestrial Access Network (E-UTRAN); Overall description; Stage 2 (Release 8). One section of particular relevance to the ensuing discussion is Section 5.2, Uplink Transmission Scheme.
FIG. 1 reproduces FIG. 4.1 of 3GPP TS 36.300, and shows the overall architecture of the E-UTRAN system. The E-UTRAN system includes eNBs, providing the E-UTRA user plane (PDCP/RLC/MAC/PHY) and control plane (RRC) protocol terminations towards the UE (not shown). The eNBs are interconnected with each other by means of an X2 interface. The eNBs are also connected by means of an S1 interface to an EPC, more specifically to a MME (Mobility Management Entity) by means of a S1 MME interface and to a Serving Gateway (SGW) by means of a S1 interface. The S1 interface supports a many-to-many relationship between MMEs/S-GW and eNBs.
The eNB hosts the following functions:
functions for Radio Resource Management: Radio Bearer Control, Radio Admission Control, Connection Mobility Control, Dynamic allocation of resources to UEs in both uplink and downlink (scheduling);
IP header compression and encryption of user data stream;
selection of a MME at UE attachment;
routing of User Plane data towards Serving Gateway;
scheduling and transmission of paging messages (originated from the MME);
scheduling and transmission of broadcast information (originated from the MME or O&M); and
measurement and measurement reporting configuration for mobility and scheduling.
Also of interest herein are the Layer 1 (PHY) specifications, such as those found in 3GPP TS 36.211 V8.2.0 (2008-03), 3rd Generation Partnership Project; Technical Specification Group Radio Access Network; Evolved Universal Terrestrial Radio Access (E-UTRA); Physical Channels and Modulation (Release 8), as well as 3GPP TS 36.213 V8.3.0 (2008-05), 3rd Generation Partnership Project; Technical Specification Group Radio Access Network; Evolved Universal Terrestrial Radio Access (E-UTRA); Physical Layer Procedures (Release 8).
Two different approaches have been discussed in 3GPP regarding the ACK/NACK signaling in TDD mode. A first approach can be referred to as ACK/NACK bundling (bundled-AN), where ACK/NACK feedback related to multiple DL sub-frames is compressed into a single ACK/NACK feedback transmitted via a single ACK/NACK resource. A second approach can be referred to as multi-ACK/NACK (multi-AN), where each DL subframe is considered as a separate HARQ process, and where a separate ACK/NACK feedback is transmitted for each (granted) DL subframe.
Of particular interest herein is the ACK/NACK bundling approach.
In R1-081110, "Multiple ACK/NACK for TDD", Ericsson, Motorola, Nokia, Nokia Siemens Networks, Qualcomm, it was agreed that DL hybrid ARQ (HARQ) acknowledgments in TDD can be transmitted as a single ACK/NACK feedback, where ACK/NACKs from one or several DL subframes are combined ("bundled" by performing an AND operation of all ANs) to a single ACK/NACK report. The PUCCH formats already defined for LTE are reused (PUCCH Format 1a/1b). This ACK/NACK mode has been referred to as "ACK/NACK-bundling" or more simply as "AN-bundling".
In R1-082168 and R1-082100, "ACK/NACK Bundling for TDD: Way Forward", Motorola, CATT, CMCC, Ericsson, Huawei, LGE, Qualcomm, Samsung, Texas Instruments, it was agreed regarding AN bundling for UL/DL configurations (except configuration 5) that a 2-bit Downlink Assignment Index field is added to DCI formats 1, 1A, 1B, 2. The Downlink Assignment Index must be greater than or equal to the number of previously assigned subframes within the bundling window and must be less than or equal to the maximum number of dynamic assignments within the bundling window. It was also agreed that the UE uses the CCE index in a last received/detected dynamic DL assignment, as well as the subframe number, to check for missed DL assignments and to determine the UL ACK/NACK PUCCH index. It was also agreed that semi-persistent assignments are not counted in the Downlink Assignment Index.
In R1-082243, "CR for UL ACK/NACK procedure for TDD", Motorola, it was agreed that the UE determines the UL ACK/NACK PUCCH index based on the lowest CCE index and downlink subframe number of the last received/detected dynamic assignment (the exact formula to use when determining the UL ACK/NACK PUCCH index was left for future study).
AN bundling is used when there are more downlink subframes than uplink subframes per radio frame. With the agreements made thus far in 3GPP RAN1, each downlink subframe will have its unique PUCCH AN resources in association therewith, while the specified AN bundling feature will only require occupying a single PUCCH AN resource at a given time, regardless how many DL HARQ ANs have been "bundled" together. This implies that, for example, if the bundling window is 4 DL subframes, each UE will use only 1 out of the 4 reserved PUCCH AN resources, while the remaining 3 PUCCH AN resources will be unused. As can be appreciated, this approach is wasteful when UL resources are scarce. This is particularly true, given the fact that UL is already in short supply when AN-bundling is applied (DL subframes>UL subframes).
R1-081816, "CCE to bundled ACK/NACK index mapping in TDD", LG Electronics, and R1-081788, "Uplink ACK/NACK implicit mapping in TDD", Huawei, partially address the PUCCH resource usage, but not the over-reservation per UE issue.

Physical uplink control channel ACK/NACK indexing


Techniques described herein improve database security by reducing network attack surface area in conjunction with deep input validation. In an embodiment, a database session receives one or more network packets sent via a network, the database session including a database session state that specifies one or more database privileges. The database session reads said one or more network packets into one or more request-packet-buffers, wherein said one or more request-packet-buffers include an RPC op code for a database operation. Based on the one or more database privileges associated with the user associated with the database session, the database session determines whether the RPC op code may be executed. In response to determining that the RPC op code may be executed by said database session, the RPC op code is executed. In response to determining that the op code may not be executed by said database session, the execution of the RPC op code is prevented.

Database servers traditionally expose a lot of functionality available to clients from across the network. Such functionality is exercised by the clients by invoking remote procedure calls ("RPCs") corresponding to each functionality using a network protocol implemented by the data vendor.
For example, a database may expose remote procedure calls for Logon/Logoff, SQL, Cursor Management, Distributed Transactions, Large Binary/Character objects, Metadata, Queuing, Loading, Distributed databases, Object types, Replication, Backup, Administration calls, Session management, File transfer, Notifications and many others. Database servers typically need to support clients from multiple versions and each specific client version may issue a different flavor for any given remote procedure call.
However, installations of the database such as cloud deployments, backup databases etc., or a customer database may typically only use a small subset of all the functionality allowed by the database in conjunction with clients from a certain version or a subset of versions. In such a scenario, allowing the database to accept remote procedure calls corresponding to all the supported functionality implemented by the database for all supported versions of remote procedure calls needlessly increased the 'network attack surface area' without any functional benefit. Described here are techniques for minimizing the network attack surface area. Also described here are techniques for deep input validation for input parameters.
The approaches described in this section are approaches that could be pursued,
but not necessarily approaches that have been previously conceived or pursued.
Therefore, unless otherwise indicated, it should not be assumed that any of the approaches described in this section qualify as prior art merely by virtue of their inclusion in this section.

Reducing network attack surface area for a database using deep input validation


To provide an operation method for intuitively moving a viewpoint in a virtual space that is different from a method for inputting a moving direction by a button or stick operation. An image processing apparatus includes real position acquisition means that acquires a real position instructed by a user in a real space, representative position determination means that determines, on the basis of movement of the acquired real position during a predetermined input, a virtual representative position that is a position representing the user in a virtual space, and rendering means that renders a three-dimensional image based on the determined virtual representative position.

There exists a technology where when a user inputs a moving direction by operating a button or stick of a controller, the position of the user in a virtual space is moved in the inputted direction and a three-dimensional image viewed from the position of the user that has been moved is displayed.

Image processing apparatus, image processing method, and program


A household appliance including a cabinet having a frame and one or more force distributors structured to absorb forces that the cabinet receives during shipping and handling. The one or more force distributors may include a block portion having cut-out sections throughout that lead to a generally flat planar bottom portion. To reduce material costs, the cut-out sections may include a surface area of greater than fifty percent of the total surface area of the one or more force distributors. The invention also includes a method for attaching the one or more force distributors to the household appliance.

1. Field of the Invention
The present invention relates to a household appliance and more particularly, to a household appliance including one or more force distributors and a method thereof that is used to absorb forces during shipping and handling of the dishwasher.
2. Related Art
In the related art, household appliances, such as dishwashers, include mechanisms such as packaging and force distributors that are used to protect the household appliance during shipping and handling. However, in the related art, the force distributors often require the use of screws to attach them to the dishwasher. Further, the force distributors are often costly to produce, in part due to material costs.
The present invention introduces a household appliance with one of more force distributors that use up to fifty percent less material than related art force distributors and also eliminate the need for attachment screws. In exemplary embodiments of the invention, the force distributors use snap-fit mechanisms as well as press-fit mechanisms to attach the force distributors to a frame of the dishwasher.

Household appliance including force distributor


A tracking and tensioning device for a belt conveyor that provides a tracking assembly that is mounted to the conveyor frame. The tracking assembly is capable of sliding along the length of the conveyor frame. An idler roller is mounted to the tracking assembly that is held under constant tension by an adjustable tensioner. The adjustable tensioner provides take-up tensioning at the portion of the belt with the lowest operating tension.

Tracking and take-up tensioning are essential for efficiently driving an endless conveyor belt without excessive wear on the belt. Tracking refers to maintaining proper alignment of the moving belt with the rollers. When the belt is out of alignment, the belt can rub against the sidewall of the conveyor frame. This wear compromises the integrity of the belt, leading to costly and time-consuming maintenance to the conveyor. Tracking in existing conveyors is generally accomplished by adjusting the orientation of the rollers relative to the conveyor frame.
Take-up tensioning refers to maintaining the belt tension necessary to efficiently transfer power from the drive roller to the conveyor belt. Belt tension that is too low causes the drive roller to slip and reduce the energy transferred from the drive roller to the conveyor belt. Belt tension that is too great causes excessive force on the belt, increasing the likelihood that the conveyor belt will break. Tensioning in existing conveyors is generally accomplished by adjusting one or more rollers to stretch the semi-elastic conveyor belt around the end rollers. Alternatively, snub rollers and S-shape roller configurations are used to tension the conveyor belt.
During operation, portions of the conveyor belt are subjected to higher tension because of friction from the drive roller friction and weight from bearing the load of material. Over time, these high-tension areas result in the belt stretching thereby reducing the overall belt tension. Some existing solutions have incorporated a spring to apply tension to the conveyor belt. However, these system generally loop the belt around multiple rollers. Other systems for tensioning and tracking the belt are overly complex resulting in excessive maintenance.

Conveyor belt tracking and continuous take-up tensioning


A high voltage power source device which comprises an electric power source; a low voltage circuit constituted by an inverter circuit including a semiconductor switching element and a capacitor for converting an electric power from the electric power source into a high frequency electric power; a magnetron; a high voltage transformer for converting the high frequency electric power into a high voltage and supplying the high voltage to the magnetron; and a printed circuit board having an electric wiring system formed thereon for connection with and support thereon of the inverter circuit and a high voltage circuit for the voltage boosted by the high voltage transformer. The printed circuit board has separate areas defined therein, and the low and high voltage circuits are formed respectively on the separate areas of the printed circuit board. The printed circuit board includes a patterned grounding conductor formed at the boundary between the separate areas and also has either a plurality of openings defined therein so as to extend completely through a thickness of the printed circuit in alignment with the patterned grounding conductor, or a plurality of generally elongated electroconductive pieces each having opposite ends connected with the patterned grounding conductor.

1. Field of the Invention
The present invention relates to an inverter circuit for use in, for example, an electronic oven comprising a semiconductor switching element for converting an electric power available from a commercial power outlet into a high frequency electric power, and a high voltage power source device for use in the electronic oven for boosting such high frequency electric power and for supplying it to a magnetron.
2. Description of the Prior Art
An electronic oven employing such a high voltage power source device as shown in FIG. 8 of the accompanying drawings is disclosed in, for example, the Japanese Laid-open Patent Publication No. 62-190692, published in 1987. The prior art high voltage power source device shown in FIG. 8 comprises a printed circuit board 1 having only one of the opposite surfaces formed with a patterned grounding conductor 2 to avoid any possible leakage of electric power between a high voltage circuit and a low voltage circuit. However, since the patterned grounding conductor 2 is formed only on one surface of the printed circuit board 1, the patterned grounding conductor 2 does not work on the leakage of electric power occurring on the opposite surface of the same printed circuit board 1. Also, since this electric power converting device is used in an electronic oven, and since the printed circuit board 1 may often been contaminated by vapor originating from food material being heated within the oven and/or moisture component and dust afloat in a kitchen, there is a relatively high possibility that the high voltage circuit and the low voltage circuit are electrically shortcircuitted through deposits of those contaminants.
As hereinabove discussed, even though the patterned grounding conductor 2 is formed on one surface of the printed circuit board 1, a deposit of contaminants such as, for example, water droplets and/or dust tends to constitute a cause for an unwanted leakage of electric power from the opposite surface to the surface of the printed circuit board 1 on which the grounding conductor 2 is formed and, therefore, the formation of the patterned grounding conductor 2 only on such surface of the printed circuit board 1 is ineffective to eliminate the occurrence of a leakage of electric power between the opposite surfaces of the printed circuit board 1.

Matsushita Electric Industrial Co., Ltd.


A flood mitigation barrier comprising a line of central structures wrapped in a flexible heat shrinkable polymer material. The polymer material is configured such that when heat is applied to the material, shrinks to conform around the central structures.

Flood barriers for the protection of lives and property along water courses have been known since ancient times, sometime taking the form of permanent earthwork embankments, or more permanent stone wall constructions.
In modern times, temporary flood barriers have generally taken the form of assemblies of sandbags, often filled on or near the site of the expected flooding. Other forms of barriers have been proposed such as that disclosed in U.S. Pat. No. 6,334,736B1 or U.S. Pat. No. 5,645,373A, each of which rely on flexible or non-rigid material to form a fluid fillable or inflatable barrier. Barrier systems such as those of the cited prior art, rely on made-for-purpose structural elements, expensive in manufacture and storage between deployments.
Sandbags, while effective up to a point, become saturated and are liable to increasing seepage. As well they may become breached by fast flowing water dislodging a number of bags leading to sudden catastrophic failure of the barrier.
Other known flood barriers are in the form of fabricated sections comprising a framework usually triangular in cross section with metal cladding on the sloping side facing the expected flood water. The cladding is then covered with tarpaulin or other water proof material. Disadvantages of this arrangement include the expense of the tarpaulin material and the need to secure the material to the framework, for example with loops of heavy chain draped over the tarpaulin.
It is an object of the present invention to address or at least ameliorate some of the above disadvantages.
Notes
The term "comprising" (and grammatical variations thereof) is used in this specification in the inclusive sense of "having" or "including", and not in the exclusive sense of "consisting only of".
The above discussion of the prior art in the Background of the invention, is not an admission that any information discussed therein is citable prior art or part of the common general knowledge of persons skilled in the art in any country.