A cauterizing system having a cauterizer tool for performing cauterization procedures, a cauterizer cord for carrying power to the cauterizer tool, a plug and a power cord for carrying power from the plug to the cauterizer cord, and a housing in which is mounted a mechanism for retracting and extending the cauterizer cord and the power cord.

1. Field
The present disclosure generally relates to medical systems and methods for using the same and, more particularly, to cauterizing systems with one or more deployable cords.
2. Background Discussion
Electrocautery units (ECU) are used in surgery to cauterize tissue in order to control bleeding. A packaged ECU often includes a cautery pencil and a bound up cautery cord extending from the cautery pencil to a plug. Typically, the cautery cord is folded up (e.g., in an accordion type style) such that the cord has an unwanted folded configuration (i.e., a shape memory configuration) when the ECU is removed from its packaging. This makes it difficult to maneuver the ECU around surgical sites.
Clamps are used to mount the ECU on a sterile support in a sterile environment. Traditional clamps are cumbersome and difficult to use. After the ECU is mounted on a sterile field with the clamps, the cautery pencil is used to cauterize tissue. It may be difficult to comfortably maneuver cautery pencils throughout a long procedure because cautery pencils are often somewhat bulky and uncomfortable to hold. Cautery cords are not long enough to permit convenient maneuvering of the cautery pencil about many surgical sites. If there are multiple working surgical sites, for example, there may be an appreciable risk of pulling the ECU off of the sterile field, thereby disrupting the surgical procedure.
Because cautery pencils are connected to cords that are not readily visually distinguishable from the surrounding environment, difficulties can arise in avoiding interference with the cord. For example, if the cautery cord is blue, the cord may visually blend with blue surgical drapes that are often used in surgical rooms. Additionally, the cautery cord may have a similar appearance to other cords in proximity to the surgical sites and may cause confusion during a surgical procedure. Thus, it may be difficult to keep track of the cord during a surgical procedure or to see and avoid unwanted contact, pulling, tripping over, and the like.


A side handle baton and flashlight assembly as well as a kit for converting a conventional flashlight into a side handle baton and flashlight assembly. A conventional flashlight having an elongated handle section adapted to hold a plurality of dry cell batteries is separated from a conventional lamp section having a bulb assembly therein. An electrical contact assembly is provided for installation in an end of the handle section. A spacer is provided to connect the handle section to the lamp section. The spacer has an elongated tubular body with a electrically conductive insert therein. The insert has a first electrical contact at one end and a second electrical contact at the other end. A pair of conductive wires extend from the first contact to the second contact. The first electrical contact in the insert is in contact with the lightbulb assembly and the second electrical contact in the insert is in contact with the contact assembly in handle section. A side handle is provided for attachment the spacer, perpendicular to the handle. A selection of interchangeable tips are provided to attach to the striking end of the handle section.

This invention relates generally to a personal protective device, more particularly to combination side handle baton and flashlight assembly as well as a kit for converting a conventional flashlight to a side handled baton and flashlight.
Heavy duty flashlights that function as a baton or club and carried by a police officer or watchman are known to the art. A law enforcement officer can use the flashlight as an offensive weapon to strike or subdue a dangerous individual. Furthermore, the device can function as a conventional flashlight and is, therefore, more versatile than a simple baton. The combination eliminates the need for the police officer to carry both a flashlight and a baton or nightstick.
Heretofore, flashlight/baton combinations were generally limited to an elongated metal flashlight of sufficient length to function as a baton or nightstick. However, this combination has significant limitations when used a protective device. Such devices must be held and used in a conventional manner. That is, the flashlight is held at one end, like a club, and used to strike an aggressive or dangerous person. This particular design renders the baton/flashlight more of an offensive weapon than a defensive tool. Therefore, the elongated flashlight/baton is severely limited in its defensive capabilities.
Many law enforcement officers are trained or can be trained in the martial arts. One aspect of martial arts training is to teach the police officer to use empty handed fighting techniques, as well as traditional martial arts weapons, in a defensive manner. The arresting officer can use his or her martial arts training and weapons defensively while subduing a suspect. If necessary, the officer can use offensive tactics to disable an aggressor.
One traditional martial arts weapon that can be used by a police officer for defensive as well as offensive purposes is the side handle weapon known as a tonfa or tui-fa (wooden handle). The tonfa is derived from an ancient Okinawan hand-held agricultural tool and consists of an elongated wooden shaft with a shorter side handle that extends perpendicular to the shaft. The user grasps the side handle of the tonfa and manipulates the shaft section so as to strike an opponent or block a blow. The tonfa can be rotated so that the shaft extends out to strike or, rotated about the side handle so the shaft is parallel to the user's arm to deflect blows. The tonfa has the distinct advantage over a straight club or baton in that it can be quickly manipulated between an offensive position and a defensive position. Moreover, the side handle is grasped naturally by the user and is easier to hold than the shaft of a traditional baton or nightstick. The user can maintain a better grip and is less likely to drop the weapon or be stripped of the weapon during an altercation.
It is readily apparent that combining a side handle baton or tonfa with a flashlight is both useful and desirable. U.S. Pat. No. 4,479,171, to Mains, provides a side arm baton and flashlight combination. However, prior art batons have notable deficiencies. For example, such a baton is manufactured or provided in a standard length. The length can not be adjusted or varied to suit the user. Furthermore, the striking end of the baton, opposite the lamp end, is blunt and functions solely as a club and does not accommodate the attachment of a pointed tip to create a debilitating offensive weapon. Moreover, most law enforcement officers are issued heavy duty flashlights. It is not cost effective, therefore, to replace the officer's flashlight with a side handle baton flashlight. It would be practical and useful to convert an existing flashlight into a side handle baton and flashlight combination.
The use of a side handle flashlight/baton combination is not limited to police officers. Individuals, such as civilians trained in the use of martial art weapons, may wish to convert a flashlight into a side handled baton and flashlight combination for personal self-defense.

Side handled baton and flashlight assembly


A predictive image acquisition device is a predictive image acquisition device for associating an observation signal, the observation signal being a signal obtained from an original image serving as a decoding target image and being a lower dimensional signal than the original image, a first predictive image having a high correlation with the original image, and a second predictive image having a high correlation with the original image with each other to obtain a combined predictive image, and includes an interpolation factor acquisition unit configured to obtain an interpolation factor set for each pixel of the combined predictive image from the first predictive image, the second predictive image, and the observation signal, and a combined predictive image acquisition unit configured to combine the first predictive image and the second predictive image for each pixel using the interpolation factor to obtain the combined predictive image, and the pixels constituting the observation signal are expressed by a linear sum of the original image.

Compressed sensing is a sampling technique for originally generating an unknown original signal that is an acquisition target from an observation signal having a smaller number of elements acquired instead of the original signal (see Non Patent Literature 1). The observation signal is an M-dimensional (here, M<<N) vector generated by multiplying an original signal x that is an N-dimensional vector by an "M×N"-dimensional observation matrix Φ. In compressed sensing, it is assumed that the original signal that is a target is sparse. Further, the original signal itself may not be sparse, but may be transformed to be sparse through a certain linear transformation. Hereinafter, a process of obtaining the original image from the observation matrix Φ and the observation signal in compressed sensing is referred to as "restoration". The observation matrix Φ is defined in advance and is always treated as known.
Restoring an N-dimensional original signal from an M-dimensional observation signal is an ill-posed problem. That is, in general, a solution cannot be uniquely determined. In compressed sensing, it is assumed that an original signal is sparsely transformed using a certain transformation matrix such that the N-dimensional original signal is restored from the M-dimensional observation signal.
In a typical example of a method of restoring an original signal, it is assumed that the original signal can be transformed to a sparse transformation factor through certain transformation. An L1 norm (sum of absolute values) of a transformation factor is added as a regularization term to a formula, such that the original signal is restored as in Formula (1).
               [           Formula                     1          ]                                    x     =                          argmin                 x                   _                                                                                     𝓎          -                     Φ                                  x            ^                                                       2                   +             λ                                                  Ψ                               x           ^                                            1                                     (     1     )
Here, Ψ is a sparse transformation matrix such as a discrete cosine transform or a discrete wavelet transform. λ represents a weighting factor. It is generally known that, when an image signal is subjected to a discrete cosine transform, an absolute value of a transformation factor corresponding to a basis vector of a high frequency component becomes small, and Ψx can be assumed to be a sparse vector. In Formula (1), the compression efficiency is higher when M is smaller, but the restoration performance is lower when M is smaller. The restoration performance in compressed sensing is higher when (M/N) is closer to 1. The restoration performance in compressed sensing is higher when the transformation factor Ψx of the original signal is more sparse, that is, when the non-zero factor in the transformation factor Ψx is smaller. Therefore, when an original signal that is a restoration target has high sparsity, it is possible to restore the original image from the observation signal with high accuracy even when M is small. Further, for example, restoration using machine learning has been proposed, in addition to restoration using L1 regularization. For example, in restoration using a convolutional neural network, a transformation matrix Ψ is not clearly defined, and a convolutional neural network in which the observation signal is an input and the restored original signal is an output is constructed.
In moving image encoding using compressed sensing, a decoding device does not perform a restoration process in compressed sensing on an original image from an observation signal, and a prediction residual signal assumed to have higher sparsity than the original image itself is restored as in Formula (2) (see Non Patent Literature 2). This is based on the properties of compressed sensing that the restoration performance can be improved when a restoration target signal has a higher sparsity. Since the encoded data is generated from the observation signal, a code amount of the encoded data greatly depends on M. Therefore, improvement in restoration performance means improvement in encoding performance.
               [           Formula                     2          ]                                          x      r          =                          argmin                 x         ^                                                                            𝓎           r                    -                     Φ                                  x            ^                                                       2                   +             λ                                                  Ψ                               x           ^                                            1                                     (     2     )
Here, xr represents a restored prediction residual signal. yr represents an observation signal of the prediction residual signal. The observation signal yr of the prediction residual signal is expressed as "yr=y−Φp." This "p" represents a predictive signal.
A moving image encoding device using such compressed sensing may execute compression sampling for the original signal to generate an observation signal and encode the generated observation signal and does not have to generate a predictive signal (predictive image) for the original signal. The decoding device decodes the observation signal from transmitted encoded data. The decoding device generates the predictive signal from the decoded observation signal and a reference signal (a reference image). The decoding device generates an observation signal (yr=y−Φp) of the prediction residual signal through matrix multiplication and subtraction from the decoded observation signal and the predictive signal generated by the decoding device. The decoding device applies the restoration process in the compressed sensing to generate a prediction residual signal from the observation signal of the prediction residual. The decoding device obtains a sum of the restored prediction residual signal and the predictive signal to restore the original image, and outputs the restored original image from the decoding device.
In a general moving image encoding scheme such as H.265/High Efficiency Video Coding (HEVC) (see Non Patent Literature 3), an encoding device generates a predictive image using a decoded image. Therefore, it is essential for the encoding device to have a decoding device for generating a decoded image as a component. Due to this restriction, a calculation load of the encoding device is always larger than a calculation load of the decoding device. On the other hand, in the moving image encoding device using compressed sensing, since a predictive image is not generated, the encoding device does not have to include a decoding device, and an encoding device with a smaller calculation load than the decoding device can be realized.
A prediction process is a very important technology in moving image encoding using compressed sensing.
Generation of a prediction residual signal with high accuracy in moving image encoding using compressed sensing leads to a reduction in code amount. The decoding device restores the original signal from the observation signal on the basis of the sparsity of the prediction residual signal. Therefore, since the sparsity of the prediction residual signal is improved when prediction accuracy of the image signal is higher, the decoding device can generate the prediction residual signal with high accuracy.
In a general moving image encoding scheme such as H.265/HEVC, an encoding device generates a predictive signal and transfers prediction information necessary for a decoding device to generate the same predictive signal as such a predictive signal to a decoding device. Therefore, the prediction accuracy and a code amount of the prediction information have a trade-off relationship. Therefore, in general moving image encoding, a prediction method that requires a very large number of variables is not suitable. For example, the number of motion vectors that are prediction information necessary to generate a predictive signal in motion compensation prediction is generally one or two. When an encoding device generates a predictive signal using two or more motion vectors, an encoding device of the related art generates a predictive signal from each motion vector and simply averages the two or more generated predictive signals or adds two or more predictive signals using a weighting factor determined for each frame or block.
In moving image encoding using compressed sensing, the decoding device executes the prediction process, but the encoding device does not execute the prediction process. Therefore, since the prediction information is not included in the encoded data, the encoding device does not increase a data amount of the encoded data due to the predictive signal, and the decoding device can generate the predictive signal on the basis of a large number of variables.
Many methods of generating a predictive signal in moving image encoding using compressed sensing have been proposed. In moving image encoding using compressed sensing in units of blocks, the encoding device generates an image (hereinafter referred to as a "combined predictive image") obtained by combining a plurality of predictive images, through linear coupling (Non Patent Literature 4). A weighting factor w is determined in a closed form by using a Tikhonov regularization method. A combined predictive image p is expressed by Formula (3).[Formula 3]p=Hw  (3)
Here, the combined predictive image p is expressed in a format of an "N=B2"-dimensional column vector. B represents a block size. H represents a "B2×K" dimensional matrix. K represents the number of predictive images included in the predictive image candidates. Each column vector of H represents a block column of a search range in a reference image. The weighting factor w shown in Formula (3) is expressed by a K-dimensional column vector. Each element of the weighting factor w is a scalar value corresponding to the predictive image candidate that is each column vector of H.
Formula (3) is expressed as Formula (4).
               [           Formula                     4          ]                                    p     =                  ∑       j       K                           c        j                             h        j                                     (     4     )
Here, hj is an element (predictive image candidate) of a set RN, and represents a column vector of a j-th column of H. cj is an element of the set R, and represents an element of a j-th column of the weighting factor w shown in Formula (3). The combined predictive image p is generated by linearly coupling the predictive image candidates h1. An optimum weighting factor w is expressed as in Formula (5).
               [           Formula                     5          ]                                          w      ^          =                  argmin       w                                                  𝓎         -                   Φ                    Hw                                       2                              (     5     )
Here, Φ represents a matrix of observation signals (an observation matrix). A problem to solve this is an ill-posed problem. Therefore, a Tikhonov regularization term Γ is added to Formula (5), and a weighting factor wt,i is expressed in a closed form as in Formula (6).[Formula 6]ŵ=(ΦH)T(ΦH)+λ2ΓTΓ)−1(ΦH)Ty  (6)
In Non Patent Literature 5, elements other than a specific sub-block divided into four are 0. Predictive image candidates are generated in this way such that an optimal predictive image is generated in units of sub-blocks. A weighting factor in Non Patent Literature 5 is determined by Tikhonov regularization, as in NPL 4.

Prediction image acquisition apparatus, original signal acquisition apparatus, prediction image acquisition method and program

NIPPON TELEGRAPH AND TELEPHONE CORPORATION


A semiconductor optical device has a multilayer structure 30 including a first compound semiconductor layer 31, an active layer 33, and a second compound semiconductor layer 32. A second electrode 42 is formed on the second compound semiconductor layer 32 through a contact layer 34. The contact layer 34 has a thickness of four or less atomic layers. When an interface between the contact layer 34 and the second compound semiconductor layer 32 is an xy-plane, a lattice constant along an x-axis of crystals constituting an interface layer 32A which is a part of the second compound semiconductor layer in contact with the contact layer 34 is x2, a lattice constant along a z-axis is z2, a length along an x-axis in one unit of crystals constituting the contact layer 34 is xc′, and a length along the z-axis is zc′, (zc′/xc′)>(z2/x2) is satisfied.

The present disclosure relates to a semiconductor optical device.
For example, a semiconductor optical device represented by a semiconductor laser element or a light-emitting diode has a multilayer structure including a first compound semiconductor layer having a first conductivity type, an active layer, and a second compound semiconductor layer having a second conductivity type different from the first conductivity type. A second electrode is formed on the second compound semiconductor layer. The first compound semiconductor layer is electrically connected to a first electrode.
FIG. 5 (Source: Ishikawa et al., J. Appl. Phys. 81. 1315 (1997)) illustrates a relationship between a metal constituting a second electrode (p-side electrode) formed on a second compound semiconductor layer formed of p-type GaN and a resistance value. Incidentally, a black circle indicates a value before an annealing treatment, and a white circle indicates a value after an annealing treatment at 500° C. A metal having a larger work function value used as the second electrode with respect to the second compound semiconductor layer formed of p-type GaN has a lower Schottky barrier, and therefore tends to obtain a better contact characteristic. FIG. 5 indicates that a resistance value is reduced according to increase in a work function value of a metal. Therefore, in general, a platinum group metal such as Pd or Pt, Ni, Au, or the like having a work function value distributed in a range of 5 eV to 5.65 eV is used as an ohmic electrode with respect to the second compound semiconductor layer formed of p-type GaN.
For example, JP 10-242587 A discloses a nitride semiconductor element for reducing a driving voltage. This nitride semiconductor element includes a p-type electrode formed on a p-type nitride semiconductor layer through a p-type contact layer. In addition, the p-type contact layer is formed of a p-type nitride semiconductor having a smaller band gap energy than the p-type nitride semiconductor layer, and has a thickness of 50 nm or less.


A vehicle wheel comprises a wheel rim and a pneumatic tire fitted to the rim, particularly a tubeless tire wherein the wheel rim includes seats for the tire beads. The rim seats include an elevated ridge which is spaced from the rim flanges and the tire beads have a generally corresponding configuration. With the tire fitted to the rim, the bead cores of the tire are located between the rim flanges and the elevated ridge. According to the invention, the rim is a 15.degree. rim with a 15.degree. seat surface between the rim flange and the elevated ridge. The side of the elevated ridge remote from the rim flanges extends at an angle of 15.degree.-40.degree. essentially in a straight line from the crown of the elevated ridge in a direction inwards towards the rim center. The invention also relates to a wheel rim having rim seats and elevated ridges of the same configuration.

Field of the Invention
The present invention relates to a vehicle wheel, i.e. a pneumatic tire and wheel rim assembly, and also to a wheel rim for such a vehicle wheel.
It is known to configure a rim seating with a "hump", i.e. an elevated ridge which is spaced from the rim shoulder or flange so that, when the tire is fitted to the rim, the bead cores of the tire will be located between the elevated ridge and the rim flange. The purpose of these elevated ridges, or humps, is to enhance the firmness in which the tire is held on the rim, so that the tire is able to withstand natural forces to which it is subjected when the vehicle is turned sharply or driven under off-road conditions. This construction is often used in low profile tires, particularly extremely low profiles such as broad off-road tires.


The invention relates to a rotor (10) for a turbo machine, in particular for an aircraft turbine, with rotating blades (12) that are joined to a basic rotor body (16), whereby at least one channel (22) extending between the high-pressure side (HD) and the low-pressure side (ND) of rotor (10) radially underneath a blade platform (18) of at least one rotating blade (12) is provided, whereby a slope of a principal axis of extension (H) of channel (22) relative to an axis of rotation (D) of rotor (10) has the same sign as a slope of a principal axis of extension (R) of a radially inner boundary of the flow channel of rotor 10. In addition, the invention relates to a turbo machine having a rotor (10) as well as to a method for manufacturing a rotor (10) for a turbo machine.

The invention relates to a rotor for a turbo machine, in particular for an aircraft turbine, a turbo machine with a rotor, as well as a method for manufacturing a rotor for a turbo machine.
In turbo machines, such as aircraft turbines, for example, which are used in a number of variants in aircraft, but also in different types of aircraft and in stationary applications, continually higher temperatures in internal combustion chamber(s) are targeted in order to obtain an improved efficiency. In the high-pressure part of the aircraft turbine that is connected downstream of the internal combustion chamber, all open surfaces of guide vanes and rotating blades as well as of other components that lay open are therefore subjected to temperatures that can lie partially in the region of the melting point of the materials used. In order to be able to operate an aircraft turbine at a temperature that is as high as possible, the components and particularly the vanes and blades subjected to the hot gas flow are thus cooled.
The rotating blades of currently used rotors usually have at least one blade shroud, which forms the radially inner boundary of the flow channel of an associated turbo machine. For example, a bladed rotor, which has a plurality of channels as well as a plurality of slots underneath blade platforms of its rotating blades, is known from EP 2 230 382 A2. Each slot essentially extends radially between one of the channels and a surface of the blade platform in question that is facing the flow channel. The slots have a non-linear course, whereby a radially inner first angle and a radially outer second angle are created relative to the axis of rotation of the rotor. The radially inner angle and the radially outer angle are thus basically selected as different from one another. In contrast to the slots, the channels run in an axis-parallel manner to the axis of rotation of the rotor. With this combination of channels and slots, the channels serve for relieving stress and prevent the slots from expanding in the rotor material.
Another rotor designed with an integral construction as a so-called bladed disk (BLISK) can be taken, for example, from US 2005/0232780 A1. During the operation of the rotor, the hot operating gases heat the blade shroud and correspondingly the region in which the disk-shaped or ring-shaped basic rotor body is joined to the rotating blade. This adversely affects the mechanical properties of the rotor and reduces its service life. In the region between the blade feet of the rotating blades and the blade shroud. Radially beneath the blade shroud, the rotating blades parallel to the axis of rotation of the rotor have running channels that extend between a high-pressure side and a low-pressure side of the rotor and particularly serve for providing cooling air to the rotating blades.
Viewed as a disadvantage in the known rotor is thus the circumstance that this rotor requires a relatively large radial structural space. In addition, the rigidity of the rotor can be increased only by introducing additional mass, which leads to an axial widening of the rotor, however, and introduces strong geometric restrictions.


The present invention relates to a machine for digging a trench and making a wall in said trench, the machine being suitable for advancing along a path and having rear and front portions relative to the direction of advance of the machine, together with excavator means disposed in the front portion of the machine and defining a substantially vertical cutting front; wall-forming means situated in the rear portion of the machine; and propulsion means suitable for causing the machine to advance along said path. The machine also has a central portion, controllable brake means for slowing advance or blocking at least one portion of the machine, and controllable connection and disconnection means for connecting and disconnecting the central portion respectively with the front and rear portions of the machine, thereby enabling the type of excavator means and the type of wall-forming means to be changed.

Machines of this type and suitable for forming walls are already known.
For example, U.S. Pat. No. 3,893,302 describes a machine and method for excavating trenches and constructing walls in the excavated trenches.
That machine comprises a cutter tool located in the front portion of the machine, in the form of an endless chain of excavation buckets.
The rear portion of the machine has a vertical duct for delivering concrete from a container situated outside the trench to the rear of the machine in order to fill the trench that has just been dug.
Pumping concrete into the trench creates hydrostatic pressure on the rear portion of the machine, thereby exerting driving thrust in the excavation direction.
However, that machine is subjected to the hydrostatic pressure of the concrete and, in any event, no means are provided for controlling either the thrust force created by the pressure of the concrete on the excavator means, or the speed of advance of the machine.
It is known that the thrust force and the speed of advance of the cutter tool need to be controlled, regardless of the nature of the terrain being excavated.
In particular, the force created by the hydraulic pressure is usually greater than the force needed for applying pressure to the cutter tools.
It will therefore be understood that it is necessary to control the speed of advance of the machine and also the thrust force on the cutter tools.
In addition, in that document, it is not possible to adapt the cutter tools to the nature of the terrain to be excavated.
In the event of it being desirable to change the cutter tool, it is necessary to change the machine, which leads to a loss of time that might paralyze progress on a building site.
Finally, the machine described in that document is capable solely of forming diaphragm type walls, whereas in certain situations it can be advantageous to place prefabricated wall elements in the trench, and to do so without needing to change the excavator machine or the cutter tool.

Machine for digging a trench and making a wall in said trench


The present disclosure provides a multi-media data editing system for editing a multi-media data. The multi-media data editing system includes a sample memory and a processor. The sample memory stores a plurality of undesired voice samples. The processor includes a voice obtaining module, a voice comparing module, and a voice editing module. The voice obtaining module is configured for obtaining an audio data from the multi-media data. The voice comparing module is configured for comparing the obtained audio data with the plurality of undesired voice samples looking for a match. The voice editing module is configured for editing the audio data during the audio data matched with undesired voice samples. The present disclosure also provides a multi-media data editing method. And the present disclosure provides an electronic device using the multi-media data editing system.

1. Technical Field
The present disclosure relates to electronic devices and, particularly, to an electronic device with a multi-media data editing system which can automatically edit audio and video data according to predetermined parameters.
2. Description of Related Art
A conventional digital video camera is customarily adapted for recording both video and audio data simultaneously via a recording medium such as a compact disc. Should some undesirable phrases and/or actions be recorded, then users may have to use some complicated means to edit the recording.
What is needed, therefore, is a multi-media data editing system and a method used in an electronic device capable of automatically editing audio data to overcome or at least alleviate the above-described problem.

Multi-media data editing system, method and electronic device using same


A method deposits an epitaxial layer on a front side of a semiconductor wafer having monocrystalline material. The method includes: providing the semiconductor wafer; arranging the semiconductor wafer on a susceptor; heating the semiconductor wafer to a deposition temperature using thermal radiation directed to the front side and to the rear side of the semiconductor wafer; conducting a deposition gas over the front side of the semiconductor wafer; and selectively reducing an intensity of a portion of the thermal radiation that is directed to the rear side of the semiconductor wafer, as a result of which first partial regions at an edge of the semiconductor wafer, in the first partial regions a growth rate of the epitaxial layer is greater than in adjacent second partial regions given uniform temperature of the semiconductor wafer owing to an orientation of the monocrystalline material, are heated more weakly.

The deposition of an epitaxial layer on the front side of a semiconductor wafer is usually carried out by means of CVD (chemical vapor deposition) in a CVD reactor, often in a single-wafer reactor. By way of example, US 2014/0 251 208 A1 shall be mentioned, in which such a CVD reactor is described. A single-wafer reactor provides a reaction chamber between an upper and a lower cover (dome), in which reaction chamber a susceptor is held by susceptor carrying arms of a susceptor carrying shaft on susceptor supporting pins. The susceptor and a semiconductor wafer placed thereon are heated by means of thermal radiation by lamp arrays arranged above and below the covers, while a deposition gas is conducted over the front side of the semiconductor wafer facing the upper cover.
US 2008/0118712 A1 describes a susceptor, including a susceptor ring and a susceptor base. The susceptor ring has a ledge for placing a semiconductor wafer in the edge region of the rear side of the semiconductor wafer. In order to deposit a layer on the front side of the semiconductor wafer, the susceptor ring is placed on the susceptor base.
US 2007/0227441 A1 draws attention to periodic fluctuations of the thickness in the edge region of epitaxially coated semiconductor wafers composed of silicon. The reason is different growth rates at which the epitaxial layer grows. The different growth rates are related to the crystal orientation of the front side of the semiconductor wafer. The front side of the semiconductor wafer is that side surface of the semiconductor wafer on which the epitaxial layer is deposited. In order to make the thickness of the epitaxial layer uniform in the edge region, US 2007/0227441 A1 proposes altering the structure of the susceptor with the period of the thickness fluctuations.
With the same objective, US 2015/0184314 A1 proposes limiting the width of the edge region of the semiconductor wafer.

Method for depositing an epitaxial layer on a front side of a semiconductor wafer and device for carrying out the method


A map database stores map data in multiple levels having different levels of details. In displaying a three-dimensional map, the map data having a higher level of details is used for a close view area near the viewpoint to a predetermined distance, and the map data having a lower level of details is used for a distant view area farther from the predetermined distance. The distant view area is first drawn by a perspective projection, and then, after clearing a depth buffer that stores depth information, the close view area is drawn, such that an undesirable hidden line removal process based on the depth information is not performed between the projected image in the distant view area and that in the close view area, thereby avoiding an unnatural phenomenon in which part of the close view image is hidden by the distant view image.

1. Field of the Invention
The present invention relates to a three-dimensional map display system that concurrently uses a plurality of map data to display a three-dimensional map.
2. Description of the Related Art
An electronic map displayed on the screen of, for example, a navigation system or a computer may be a three-dimensional map that expresses features such as buildings three-dimensionally. The three-dimensional map is generally displayed by drawing three-dimensional models by, for example, perspective projection.
The three-dimensional map includes a large number of features, and the ground surfaces are also expressed by polygons. This results in a large number of three-dimensional models and may significantly increase the processing load for drawing a three-dimensional map. Especially in the case of drawing a birds eye view from the high viewpoint, the display range of the map covers a wide area, so that the processing load for the display may have a remarkable increase.
In order to reduce such processing load, a plurality of map data having different levels of details are used concurrently in the case of displaying a three-dimensional map and more specifically a birds eye view map. For example, Japanese Patent Nos. JP 4422125B and JP 3362533B disclose techniques both applied to display of a three-dimensional bird's eye view map, which vertically divide the map display range into two parts, use detailed map data to display a lower area close to the viewpoint and use wide-area map data having the lower level of details to display an upper area distant away from the viewpoint.


A mechanism (20) for connecting the coupling nut (14) and barrel (12) of an electrical or optical connector to resist but not prevent their relative rotation, includes a clicker ring (22) that has forward-projecting teeth (36) and that fits into a circular recess (32) at the rear of the coupling nut to engage rearward-projecting nut teeth (34). The clicker ring also has slots (40) that receive radially-outward projections (42) on the barrel, to prevent clicker ring turning.

One type of signal connector, which may be an electrical or optical connector, includes a barrel that holds a body with passages that receive electrical contacts or optical termini. A coupling nut that lies around the barrel, can be turned to threadably connect the barrel to a mating connector. A mechanism is used to allow the coupling nut to turn in a direction to mate, while resisting turning in the opposite direction to unmate. Present mechanisms include a radial gear ratchet which takes up considerable radial space. Sufficient radial space can be provided without increasing the overall diameter of the connector by using thinner coupling nut walls, except that the walls then are too thin when the coupling nut is formed of plastic. A mechanism that allowed the coupling nut to turn more freely in mating than unmating and which took up little radial space would be of value.


Embodiments of the present disclosure provide systems, apparatuses and methods for the use of deep vacuum for the regeneration of desiccant in compressed gas desiccant dryers. Through the use of a vacuum pump operably coupled to a gas dryer, the systems and methods described herein allow for a gas dryer system to reach a deep vacuum pressure, inducing liquid within the desiccant in a gas dryer tower to reach a boiling point induced by the low pressure and lower boiling point of water or liquid, allowing the water or liquid to change from a liquid to a gas. This phase change allows the liquid to separate from the desiccant. The vacuum pump is then able to remove or pull the vapor that has been released from the desiccant from the system.

Various forms of compressed gas are widely used around the world for a number of industries. The presence of water vapor in compressed gas is often an unwanted constituent that can result in an array of problems or unwanted characteristics. Various methods exist to dry the gas in a compressed gas system. One such method uses an adsorption process where an adsorbent material or desiccant is used to adsorb water vapor from the compressed gas. The desiccant, once saturated with water, must then be dried or regenerated so that it can be reused. There are three common methods for the regeneration of desiccant, the first is the use of heatless "pressure-swing" drying. This method, in a two-tower system, uses part of the dry compressed air from a second tower in the system to dry the desiccant in a first tower. The second method is the use of a heated dryer. This method uses hot air from a blower to dry the air. The third and final method is the use of heat of compression.
The foregoing examples of related art and limitations related therewith are intended to be illustrative and not exclusive, and they do not imply any limitations on the inventions described herein. Other limitations of the related art will become apparent to those skilled in the art upon a reading of the specification and a study of the drawings.

Deep vacuum regeneration of adsorbent media


A semiconductor integrated circuit device including first and second transmission leads formed on both sides of a resin film on which a semiconductor integrated circuit chip is mounted. These leads are connected at portions immediately close to the high-speed input terminals of the chip by through-hole leads. This chip-to-lead configuration according to the present invention is significantly effective for a GaAs logic integrated circuit or the like that processes high-speed input signals.

1. Field of the Invention
This invention relates generally to a semiconductor integrated circuit devices, and more particularly to the chip-to-lead configuration of a high-speed performance integrated circuit such as a GaAs (Gallium Arsenide) logic integrated circuit.
2. Description of the Prior Art
There has recently been significant development in the use of compound semiconductor integrated circuits that perform high-speed logic operations at frequencies in GHz. range. For example, an integrated circuit having MESFETs (Metal Semiconductor Field Effect Transistor) integrated on a GaAs substrate has been developed that achieves a high switching-speed on the order of 100 p sec. Furthermore, elements such as a HEMT (High Electron Mobility Transistor) and a HBT (Hetro-Bipolar Transistor) that perform at higher speeds have been steadily developing.
However, there have been problems in that when an integrated circuit chip which performs such a high speed operation is sealed in a package, high-speed performance is inhibited by the package. The degradation of such high-speed performance is caused at least in part by mismatched impedances of termination lead portions that receive high-speed input signals.
When high-speed input signals are fed through the signal leads into MESFETs disposed on the signal receiving sections of a GaAs logic integrated circuit, the signals are reflected at the gates of the MESFETs due to the high input impedances thereof. This reflection causes distortion of the signal waveform, and this distortion interferes with the normal logic operations. To prevent this, matching resistors are provided so as to make proper termination. For example, a GaAs logic integrated circuit chip is sealed in a conventional package and matching terminal resistors are disposed at the ends of leads which are signal input terminals.
FIG. 5 shows an equivalent circuit with such terminal resistors disposed at the end of a lead as a termination impedance. The overall arrangement includes a package 51, an integrated circuit chip 52 incorporated within the package, an inner lead 53, a MESFET 54 which is the input section of the integrated circuit chip, and a terminal resistor 55. However, in the case of a high speed integrated circuit having a switching speed on the order of 100 p sec or faster, the signal reflection problem cannot be completely solved by the use of such a matching terminal resistor disposed outside the package 51.
The configuration effectively acts like an "open stub" because the terminal resistor 55 is disposed at a point A faraway from a point B which is the gate of MESFET 54 within the package 51. Signal reflection causes ringing of input signals which results from the existence of such an open stub. To avoid this open stub, it would be necessary to incorporate the terminal resistor 55 within the package 51 in close proximity to the integrated circuit chip 52. There is contemplated an arrangement in which terminal resistors are disposed by thick-film printing within the package, or an arrangement in which chip resistors are provided. However, the inside of the package is usually not flat but stepwise, thus, it is difficult to form resistors by thick-film printing. Moreover, when a chip resistor is incorporated within the package, this requires a larger space therein. Thus such a solution is not practical.
FIG. 6 shows another so-called "feed-through" arrangement in which a terminal resistor is disposed in a manner different from that shown in FIG. 5. In FIG. 5, a first signal lead 63a from an input terminal point A of a package 61 is led through a gate terminal point B of a MESFET 64 so as to be connected through a second signal lead 63b to another terminal point C of the package 61. Namely, first and second signal leads are folded at the gate terminal point B. A terminal resistor 65 is disposed at the input terminal pint C. In this arrangement, the length of open stub becomes shorter compared to that in the FIG. 5 arrangement. However, the number of input signal leads is doubled. Therefore, as the density of integrated circuits becomes greater the number of input terminals increases and bonding pads become more dense, resulting in difficulty in connecting leads within the package. Further, in the vicinity of an input point B of folded first and second leads 63a and 63b, a branching portion 66 must be provided. The impedance branching portion 66 causes a problem in the transmission of high-speed signal waveforms.
The arrangements of both FIGS. 5 and 6 have a wire-bonding problem. When the wire-bonding is made between leads within the package and terminals on the chip of integrated circuit, the wire is usually connected in an arc. This arc-shaped bonding wire also appears to be an open stub to an integrated circuit that processes high-speed signals on the other of gigabits/sec. Thus, the length of such bonding wire cannot be ignored, and variation in length renders the characteristics of the integrated circuit non-uniform. When the density of integrated circuits becomes greater thereby causing the bonding pads to be more densely formed, the following problems also arise. First, a tool used for bonding inevitably contacts with neighboring wires such that bonding operations become impossible. Second, the size and pitch of bonding pads cannot be reduced smaller than some extent, thus the reduction in size of the integrated circuit is inevitably limited. Consequently, the length of signal leads on the chip cannot be reduced.
In order to solve the above-described problems in wire bonding, there has been provided a TAB (Tape Automated Bonding) method in which the integrated circuit chips are united on a flexible resin film. FIGS. 7a and 7b are diagrams illustrating a conventional base film for use in TAB method. FIG. 7a is a plan view of an essential portion of the base film, and FIG. 7b is a cross-sectional view thereof. In FIG. 7a, on an insulating polyamide film 71, leads 72 are formed substantially radially from a chip-mounting portion. In the chip-mounting portion, an opening is made in which an integrated circuit chip 73 is mounted. The thus mounted chip 73 has in its periphery a plurality of pads to which each end of leads 72 is respectively connected through bump electrodes. The film 71 is usually a lengthy tape on which a number of integrated circuit chip are mounted. The respective chips are separated for use by cutting off the film along the dot-and-dash line shown in FIGS. 7a and 7b. This TAB method is also called a film carrier method.
In the TAB method, the chip and leads are connected at bump electrodes, so that the inductance thereof are smaller than that in the wire-bonding method. However, in such a conventional TAB method, the signal transmission of the above-described high-speed logic integrated circuit has not been considered. Specifically, the characteristic impedance of leads on the TAB substrate is not taken into consideration, thus the reflection of signals arises due to mismatched impedance. Further, in the vicinity of the integrated circuit chip, lead pitch becomes extremely small, thus, crosstalk between leads increases. For these reasons, the high-speed signals of integrated circuit cannot be transferred with signal fidelity. This causes erroneous operations of the integrated circuit.
As described above, in the conventional chip-to-lead configuration of semiconductor integrated circuits, there have been problems such that high-speed performance cannot be fully extracted from a high-speed integrated circuit chip such as a GaAs logic integrated circuit chip.

Semiconductor integrated circuit apparatus


A creeper for car repair which belongs to the technical field of basic hand tools, includes a creeper body and an object scraper mechanism which is pivotally connected with one end of the creeper body. The technical solution provided by the present invention is equipped to an object scraper mechanism which is pivotally connected with one end of the creeper body for unfolding from the creeper body and being perpendicular to the service creeper body when the operator is standing upright and heavy objects are carried, as well as laying against the back of the service creeper body when the scraper mechanism is not being used and is folded, thus facilitating the object transportation and reducing the work intensity for the operators.

1. Field
The invention relates to the technical field of basic hand tools and particularly relates to a service creeper for car repair providing an operator of the service creeper with a transport mechanism that provides lie-down operational support and a scraper mechanism that assists, when upright, in conveniently moving objects, similar to that of a dolly or a forklift.
2. Description of Related Art
Disclosed Chinese Patent Documentation presents many forms of a creeper for use in car repair. For example, a utility model patent with patent publication number CN2552778Y provides a dismountable creeper for car repair, which can integrate all parts (e.g. the cushions and the framework which is equipped with rollers) without welding or riveting. In the process of transportation, the creeper is in a dismounting state to save both the packaging and space, therefore reducing the cost of warehouse and transportation. Another example, the creeper for car repairing recommended by CN2546284Y is provided with a folding function, which saves space to facilitate with minimal warehouse storage and easy transportation. Another example, a creeper disclosed by CN2685025Y, wherein, the creeper adjusts to the height of the bolster as needed through the setting of a bolster regulating mechanism, thus improving the comfort of the operator. Compared with the creeper for car repair of CN2685025Y, the creeper for car repair disclosed by CN2767077Y achieves the height adjustment through the setting of a headrest regulating mechanism without a regulating handle which may be an interference to the operators. For another example, a service creeper for car repair disclosed by CN2759717Y is provided with a convenient effect of dismounting front and rear bedsteads.
In addition to the creepers for use in car repair as listed above, other related art also has respective technical effects, however they all lack the multifunction of also providing upright assistance in moving heavy objects.
As those who routinely conduct operation of car repair would realize, the need to obtain accessories and/or relatively large and heavy tools is necessary in the process of repairing a vehicle. Therefore, a creeper for car repair that is equipped with a function for lie-down operational support and upright assistance in conveniently moving objects as needed, would improve the operation performance, reduce the labor intensity, and reduce manpower input of the operators. The technical solution introduced below is generated for this purpose.

Changshu Tongrun Auto Accessory Co., Ltd.


A boat steering assembly (10) having a substantially circular rotary gear (12) engaging an output gear such that the leverage is varied between the output gear (16, 16') and the steering wheel (32). The steering wheel (32) has a shaft gear (28) engaging in idler gear (22) which eccentrically rotates the circular gear (12) about the first axis (14). The eccentrically rotating circular gear (12) engages the output gear (16, 16') having a partially sinusoidal profile thereby automatically varying the distance (i.e., leverage) between the first axis (14) and a point of contact (52) between the circular (12) and output (16, 16') gears.

Mechanical marine steering systems are frequently of the rack and pinion gear type. Such steering systems usually include a rotary gear (i.e., pinion gear) rotatably engaging an output gear (i.e., rack gear) in response to rotation from a steering wheel. The output gear typically includes a cable attached thereto as attached to a rudder or an outdrive of a marine engine for remotely controlling the movement thereof. The rudder or outdrive usually pivots about a vertical axis for directing the flow of water thereby.
As the rudder or outdrive rotation increases, the flow supplied by the passing water increases to likewise increase the required steering input force. In other words, as the rudder increasingly becomes transverse to the water flow, the force (i.e., drag) placed on the rudder by the passing water increases. This, in turn, increases the torque necessary to rotate the steering wheel.
In known prior art steering systems, the increasing rudder forces are overcome by providing a plurality of gearing mechanism, most of which require manual shifting between gears by the operator.
The U.S. Pat. No. 3,225,620 issued to Dubin discloses a multiple ratio steering system including a steering shaft with a beveled gear attached on the end thereof. The beveled gear engages with a second beveled gear connected to a shaft which, in turn, rotates a pair of spur gears. The spur gears are slideable along the shaft by means of a key connected to an adjustment rod. The first spur gear is engaged with a first pinion gear, or the second spur gear is engaged with a second pinion gear, depending on the desired steering ratio. The rotation of both pinion gears is about a second shaft having a screw gear attached thereon. The screw gear rotation is translated to an output shaft gear, thus causing rotation of an output shaft. A major deficiency in this system is that the variable ratio depends on the manual selection of four different gears mounted concentrically on two different shafts.
The U.S. Pat. No. 4,244,316 to Kulischenko discloses an input shaft connected to a steering wheel having a key thereon. The input shaft can be locked in either one or two different positions by engaging pins. In the first position, the input shaft having the key thereon engages the driver pulley causing a driven pulley to rotate by virtue of a timing belt operatively engaged therebetween. The driven pulley is provided with a smaller diameter than the driver pulley and thus, a single revolution of driver pulley will produce a plurality of revolutions of the driven pulley. The driven pulley rotates about the same shaft as a second driver pulley. The second driver pulley causes a second driven pulley to rotate therewith by virtue of a second timing belt operatively engaged therebetween. Similarly, a single revolution of the second driver pulley will produce a plurality of revolutions of the second driven pulley. Thus, the Kulischenko patent discloses six revolutions of the second driven pulley with one revolution of the steering wheel. With the input shaft in the first position, the operator is given a mechanical advantage through a plurality of pulley-belt systems. In addition, when the input shaft is in the second position, the key is disengaged from the pulley-belt system thereby directly rotating the output shaft. The Kulischenko system, however, has the similar deficiency of requiring the operator to manually select between a plurality of gearing mechanisms to selectively increase or decrease the mechanical advantage.


The disclosure relates to an electroless or electrolytic process for treating metallic surfaces. The process employs a medium comprising at least one oxygen containing water soluble compound (e.g., stannates, molybdates, vanadates and hydrated cerium compounds) having a controlled and predetermined concentration, temperature and pH wherein the metallic surface is at least partially corroded or solubilized.

The instant invention relates to a process for forming a deposit on the surface of a metallic or conductive surface. The process employs a process to deposit, for example, a mineral containing coating or film upon a metallic, metal containing or an electrically conductive surface.
Silicates have been used in electro cleaning operations to clean steel, tin, among other surfaces. Electro cleaning is typically employed as a cleaning step prior to an electroplating operation. Usage of silicates as cleaners is described in xe2x80x9cSilicates As Cleaners In The Production of Tinplatexe2x80x9d is described by L. J. Brown in February 1966 edition of Plating; European Patent No. 00536832/EP B1 (Metallgesellschaft A G); U.S. Pat. Nos. 5,902,415, 5,352,296 and 4,492,616.
Processes for electrolytically forming a protective layer or film by using an anodic method are disclosed by U.S. Pat. No. 3,658,662 (Casson, Jr. et al.), and United Kingdom Patent No. 498,485.
U.S. Pat. No. 5,352,342 to Riffe, which issued on Oct. 4, 1994 and is entitled xe2x80x9cMethod And Apparatus For Preventing Corrosion Of Metal Structuresxe2x80x9d that describes using electromotive forces upon a zinc solvent containing paint; hereby incorporated by reference. U.S. Pat. Nos. 5,700,523, and 5,451,431; and German Patent No. 93115628 describes a processes for using alkaline metasilicates to treat metallic surfaces.
The disclosure of each of the previously identified references is hereby incorporated by reference.
The instant invention solves problems associated with conventional practices by providing an electroless or electrolytic process for treating metallic surfaces. The process employs a medium comprising at least one oxygen containing water soluble compound having a controlled and predetermined concentration, temperature and pH wherein the metallic surface is at least partially corroded or solubilized. As a result, the medium interacts with the metallic surface to form a new or modified surface having one or more improved properties.
The inventive process can form a surface comprising a mineral layer comprising an amorphous matrix surrounding or incorporating crystals upon the substrate. The characteristics of the mineral layer are described in greater detail in the copending and commonly assigned patent applications listed below.
A metallic surface that is treated (e.g., forming the mineral layer) by the inventive process can possess improved corrosion resistance, increased electrical resistance, heat resistance, flexibility, resistance to stress crack corrosion, adhesion to sealer, paints and topcoats, among other properties. The improved heat resistance broadens the range of processes that can be performed subsequent to forming the inventive layer, e.g., heat cured topcoatings, stamping/shaping, riveting, among other processes. The corrosion resistance can be improved by adding a dopant to the silicate medium, using a rinse and/or applying at least one sealer/topcoating.
The inventive process is a marked improvement over conventional methods by obviating the need for solvents or solvent containing systems to form a corrosion resistant layer, e.g., a mineral layer. In contrast, to conventional methods the inventive process can be substantially solvent free. By xe2x80x9csubstantially solvent freexe2x80x9d it is meant that less than about 5 wt. %, and normally less than about 1 wt. % volatile organic compounds (V.O.C.s) are present in the electrolytic environment.
The inventive process is also a marked improvement over conventional methods by reducing, if not eliminating, chromate and/or phosphate containing compounds (and issues attendant with using these compounds such as waste disposal, worker exposure, among other undesirable environmental impacts). While the inventive process can be employed to enhance chromated or phosphated surfaces, the inventive process can replace these surfaces with a more environmentally desirable surface. The inventive process, therefore, can be xe2x80x9csubstantially chromate freexe2x80x9d and xe2x80x9csubstantially phosphate freexe2x80x9d and in turn produce articles that are also substantially chromate (hexavalent and trivalent) free and substantially phosphate free. The inventive process can also be substantially free of heavy metals such as chromium, lead, cadmium, barium, among others. By substantially chromate free, substantially phosphate free and substantially heavy metal free it is meant that less than 5 wt. % and normally about 0 wt. % chromates, phosphates and/or heavy metals are present in a process for producing an article or the resultant article.
The instant invention relates to a process for depositing or forming a beneficial surface (e.g., a mineral containing coating or film) upon a metallic surface. The process contacts at least a portion of a metal surface with a medium comprising at least one oxygen containing water soluble compound, e.g., containing soluble mineral components or precursors thereof, having controlled concentration, temperature and pH wherein the metal surface is at least partially corroded or solubilized. By xe2x80x9coxygen containing water soluble compoundxe2x80x9d it is meant to refer to at least one member selected from the group of borates, aluminates, zironcates, titanates, molybdates, tungstenates, stannates, nitrates, sulfates, vanadates, cerium hydrates, water soluble manganese and magnesium compounds, nickel compounds, cobalt compounds, among other oxygenated water soluble compounds capable of interacting with a metal surface. By xe2x80x9cmineral containing coatingxe2x80x9d, xe2x80x9cmineralized filmxe2x80x9d or xe2x80x9cmineralxe2x80x9d it is meant to refer to a relatively thin coating or film which is formed upon a metal surface wherein at least a portion of the coating or film comprises at least one metal containing mineral, e.g., an amorphous phase or matrix surrounding or incorporating crystals comprising a zinc disilicate. Mineral and Mineral Containing are defined in the previously identified Copending and Commonly Assigned Patents and Patent Applications; incorporated by reference.
By xe2x80x9cmetal containingxe2x80x9d, xe2x80x9cmetalxe2x80x9d, or xe2x80x9cmetallicxe2x80x9d, it is meant to refer to sheets, shaped articles, fibers, rods, particles, continuous lengths such as coil and wire, metallized surfaces, among other configurations that are based upon at least one of metals and alloys including a metal having a naturally occurring, or chemically, mechanically or thermally modified surface. Typically a naturally occurring surface upon a metal will comprise a thin film or layer comprising at least one oxide, hydroxides, carbonates, sulfates, chlorides, among others. The naturally occurring surface can be removed or modified by using the inventive process.
The metal containing surface refers to a metal article or body as well as a non-metallic member having an adhered metal or conductive layer. While any suitable surface can be treated by the inventive process, examples of suitable metal surfaces comprise at least one member selected from the group consisting of galvanized surfaces, sheradized surfaces, zinc, iron, steel, brass, copper, nickel, tin, aluminum, lead, cadmium, magnesium, alloys thereof such as zinc-nickel alloys, tin-zinc alloys, zinc-cobalt alloys, zinc-iron alloys, among others. If desired, the mineral layer can be formed on a non-conductive substrate having at least one surface coated with a metal, e.g., a metallized polymeric article or sheet, ceramic materials coated or encapsulated within a metal, among others. Examples of metallized polymer comprise at least one member selected from the group of polycarbonate, acrylonitrile butadiene styrene (ABS), rubber, silicone, phenolic, nylon, PVC, polyimide, melamine, polyethylene, polyproplyene, acrylic, fluorocarbon, polysulfone, polyphenyene, polyacetate, polystyrene, epoxy, among others. Conductive surfaces can also include carbon or graphite as well as conductive polymers (polyaniline for example).
The metal surface can possess a wide range of sizes and configurations, e.g., fibers, coils, sheets including perforated acoustic panels, chopped wires, drawn wires or wire strand/rope, rods, couplers (e.g., hydraulic hose couplings), fibers, particles, fasteners (including industrial and residential hardware), brackets, nuts, bolts, rivets, washers, cooling fins, stamped articles, powdered metal articles, among others. The limiting characteristic of the inventive process to treat a metal surface is dependent upon the ability of the surface to be contacted with the inventive medium.
The inventive process can be operated on a batch or continuous basis. The type of process will depend upon the configuration of the metal being treated. The contact time within the medium ranges from about 10 seconds to about 50 minutes and normally about 1 to about 15 minutes. The inventive process can be practiced in any suitable apparatus. Examples of suitable apparatus comprise a conventional barrel dip apparatus.
The medium can be a fluid bath, gel, spray, among other methods for contacting the substrate with the medium. Examples of the medium comprise a bath containing at least one oxygen containing water soluble compound, and a thickener, among others. The bath can comprise any suitable polar carrier such as water, alcohol, ethers, among others. Normally, the bath comprises at least one water-soluble compound and de-ionized water and optionally at least one dopant (e.g. a chloride). Typically, the at least one dopant is water soluble or dispersible within an aqueous medium.
The medium typically has a basic pH. Normally, the pH will range from greater than about 9 to about 13 and typically, about 10 to about 11. The pH of the medium can be monitored and maintained by using conventional detection methods. Alternatively, the medium can have an acidic pH. The selected pH will depend upon whether the metal surface is at least partially dissolved (or solubilized). That is, the inventive process employs a medium that is at least somewhat corrosive to the metal surface in order to enhance an interaction between the medium and the metal.
The medium is normally aqueous and can comprise at least one water soluble or dispersible compound in an amount from greater than about 0 to about 40 wt. %, usually, about 3 to 15 wt. % and typically about 10 wt. %. The medium is also normally substantially free of heavy metals, chromates and/or phosphates.
The temperature of the medium can be controlled to optimize the interaction between the medium and a metal surface. Normally, the temperature will range from about 50 C to at least about 100 C and typically about 80 to 100 C. This temperature can be maintained by using conventional heaters and related control systems.
The chemical and/or physical properties of the medium can be affected by exposing the medium to a source of electrical or magnetic energy. For example, the bath can be exposed to a source of energy such as the electrical current described in copending and commonly assigned U.S. Ser. No. 09/824,641; hereby incorporated by reference. Such exposure can improve the interaction between the medium and the metal surface, partially polymerize the medium, modify the metal to oxygen ratio, concentrate the medium, among other desirable properties.
The medium can be modified by adding water/polar carrier dispersible or soluble polymers. If utilized, the amount of polymer or water dispersible materials normally ranges from about 0 wt. % to about 10 wt. %. Examples of polymers or water dispersible materials that can be employed in the medium comprise at least one member selected from the group of acrylic copolymers (supplied commercially as Carbopol(copyright)), hydroxyethyl cellulose, clays such as bentonite, fumed silica, among others.
In an aspect of the invention, the medium is modified to include at least one dopant material. The dopants can be useful for building additional thickness of the deposited layer. The amount of dopant can vary depending upon the properties of the dopant and desired results. Typically, the amount of dopant will range from about 0.001 wt. % to about 5 wt. % (or greater so long as the deposition rate is not adversely affected). Examples of suitable dopants comprise at least one member selected from the group of water soluble salts, oxides and precursors of tungsten, molybdenum, titanium (titatantes), zircon, vanadium, phosphorus, aluminum (aluminates), iron (e.g., iron chloride), boron (borates), bismuth, gallium, tellurium, germanium, antimony, niobium (also known as columbium), magnesium and manganese, sulfur, zirconium (zirconates) mixtures thereof, among others, and usually, salts and oxides of aluminum and iron, and other water soluble or dispersible monovalent species. The dopant can comprise at least one of molybdenic acid, fluorotitanic acid and salts thereof such as titanium hydrofluoride, ammonium fluorotitanate, ammonium fluorosilicate and sodium fluorotitanate; fluorozirconic acid and salts thereof such as H2ZrF6, (NH4)2ZrF6 and Na2ZrF6; among others. Alternatively, dopants can comprise at least one substantially water insoluble material such as electropheritic transportable polymers, PTFE, boron nitride, silica, silicon carbide, silicon nitride, aluminum nitride, titanium carbide, diamond, titanium diboride, tungsten carbide, metal oxides such as cerium oxide, powdered metals and metallic precursors such as zinc, among others.
The aforementioned dopants can be employed for enhancing mineral layer formation rate, modifying the chemistry and/or physical properties of the resultant layer, as a diluent for the medium, among others. Examples of such dopants are iron salts (ferrous chloride, sulfate, nitrate), aluminum fluoride, fluorosilicates (e.g., K2SiF6), fluoroaluminates (e.g., potassium fluoroaluminate such as K2AlF5-H2O), mixtures thereof, among other sources of metals and halogens. The dopant materials can be introduced to the metal surface in pretreatment steps, in post treatment steps (e.g., rinse), and/or by alternating exposing the metal surface to solutions of dopants and solutions of the medium. The presence of dopants in the medium can be employed to form tailored surfaces upon the metal, e.g., an aqueous solution containing aluminate can be employed to form a layer comprising oxides of boron and aluminum. That is, at least one dopant (e.g., zinc) can be co-deposited along with at least one water soluble species (e.g., a mineral) upon the substrate.
The medium can also be modified by adding at least one diluent. Examples of suitable diluent comprise at least one member selected from the group of sodium sulphate, surfactants, de-foamers, colorants/dyes, conductivity modifiers, among others. The diluent (e.g., sodium sulfate) can be employed for reducing the affects of contaminants entering the medium, reducing bath foam, among others. When the diluent is employed as a defoamer, the amount normally comprises less than about 5 wt. % of the medium, e.g., about 1 to about 2 wt. %.
In some cases the effectiveness of the deposition can be improved by introducing an electrical current into the medium. The metal surface can be employed as either the anode or cathode (e.g., as described in aforementioned U.S. patent application Ser. No. 09/814,641). Typically, when the medium is acidic the metal surface comprises the anode whereas for basic mediums the metal surface comprises the cathode. The current and voltage can be varied but normally the conditions are such that hydrogen evolves from the cathode and oxygen from the anode.
Contact with the inventive medium can be preceded by and/or followed with conventional pre-treatments and/or post-treatments known in this art such as cleaning or rinsing, e.g., immersion/spray within the treatment, sonic cleaning, double counter-current cascading flow; alkali or acid treatments, among other treatments. By employing a suitable post- or pre-treatment the solubility, corrosion resistance (e.g., reduced white rust formation when treating zinc containing surfaces), sealer and/or topcoat adhesion, among other properties of surface of the substrate formed by the inventive method can be improved. If desired, the post-treated surface can be sealed, rinsed and/or topcoated, e.g., silane, epoxy, latex, fluoropolymer, acrylic, among other coatings.
In one aspect of the invention, a pre-treatment comprises exposing the substrate to be treated to at least one of an acid, oxidizer, a basic solution (e.g., zinc and sodium hydroxide) among other compounds. The pre-treatment can be employed for removing excess oxides or scale, equipotentialize the surface for subsequent mineralization treatments, convert the surface into a mineral precursor, among other benefits. Conventional methods for acid cleaning metal surfaces are described in ASM, Vol. 5, Surface Engineering (1994), and U.S. Pat. No. 6,096,650; hereby incorporated by reference.
In one aspect of the invention, the metal surface is pre-treated or cleaned electrolytically by being exposed to an anodic environment. That is, the metal surface is exposed to the medium wherein the metal surface is the anode and a current is introduced into the medium. By using the metal as the anode in a DC cell and maintaining a current of about 10A/ft2 to about 150A/ft 2, the process can generate oxygen gas. The oxygen gas agitates the surface of the workpiece while oxidizing the substrate""s surface. The surface can also be agitated mechanically by using conventional vibrating equipment. If desired, the amount of oxygen or other gas present during formation of the mineral layer can be increased by physically introducing such gas, e.g., bubbling, pumping, among other means for adding gases.
If desired, the inventive method can include a thermal post-treatment. The metal surface can be removed from the silicate medium, dried (e.g., at about 120 to about 150 C for about 2.5 to about 10 minutes), rinsed in deionized water and then dried. The dried surface may be processed further as desired; e.g. contacted with a sealer, rinse or topcoat. In an aspect of the invention, the thermal post treatment comprises heating the surface. Typically the amount of heating is sufficient to consolidate or densify the inventive surface without adversely affecting the physical properties of the underlying metal substrate. Heating can occur under atmospheric conditions, within a nitrogen containing environment, among other gases. Alternatively, heating can occur in a vacuum. The surface may be heated to any temperature within the stability limits of the surface coating and the surface material. Typically, surfaces are heated from about 75xc2x0 C. to about 250xc2x0 C., more typically from about 120xc2x0 C. to about 200xc2x0 C. If desired, the heat treated component can be rinsed in water to remove any residual water soluble species and then dried again (e.g., dried at a temperature and time sufficient to remove water).
In one aspect of the invention, a post treatment comprises exposing the substrate to a source of at least one carbonate or precursors thereof. Examples of carbonate comprise at least one member from the group of gaseous carbon dioxide, lithium carbonate, lithium bicarbonate, sodium carbonate, sodium bicarbonate, potassium carbonate, potassium bicarbonate, rubidium carbonate, rubidium bicarbonate, rubidium acid carbonate, cesium carbonate, ammonium carbonate, ammonium bicarbonate, ammonium carbamate and ammonium zirconyl carbonate. Normally, the carbonate source will be water soluble. In the case of a carbonate precursor such as carbon dioxide, the precursor can be passed through a liquid (including the medium) and the substrate immersed in the liquid. One specific example of a suitable postreatment is disclosed in U.S. Pat. No. 2,462,763; hereby incorporated by reference. Another specific example of a post treatment comprises exposing a treated surface to a solution obtained by diluting ammonium zirconyl carbonate (1:4) in distilled water (e.g., Bacote(copyright) 20 supplied by Magnesium Elektron Corp). If desired, the surface treated by the inventive process is dried and, then, post-treated with a carbonate (e.g., zirconyl ammonium carbonate). Further in some case, a carbonate post treated surface can be topcoated (e.g., aqueous or water borne topcoats).
In another aspect of the invention, the post treatment comprises heating the surface. Typically the amount of heating is sufficient to densify the inventive surface without adversely affecting the physical properties of the underlying metal substrate. Heating can occur under atmospheric conditions, within a nitrogen containing environment, among other gases. If desired, prior to heating the inventive surface can be contacted with a solution containing a material that interacts with the surface at elevated temperatures, e.g., a eutectic formed between the metal surface and at least one of silica, alumina, B203, iron oxide, MgO, among other compounds. Normally, the heating will be sufficient to cause sintering or a desirable interaction without adversely affecting the underlying metal.
In another aspect of the invention, the post treatment comprises exposing the substrate to a source comprising at least one acid source or precursors thereof. Examples of suitable acid sources comprise at least one member chosen from the group of phosphoric acid, hydrochloric acid, molybdic acid, silicic acid, acetic acid, citric acid, nitric acid, hydroxyl substituted carboxylic acid, glycolic acid, lactic acid, malic acid, tartaric acid, ammonium hydrogen citrate, ammonium bifluoride, fluoboric acid, fluorosilicic acid, among other acid sources effective at improving at least one property of the treated metal surface. The Ph of the acid post treatment may be modified by employing at least one member selected from the group consisting of ammonium citrate dibasic (available commercially as Citrosol(copyright) #503 and Multiprep(copyright)), fluoride salts such as ammonium bifluoride, fluoboric acid, fluorosilicic acid, among others. The acid post treatment can serve to activate the surface thereby improving the effectiveness of rinses, sealers and/or topcoatings (e.g., surface activation prior to contacting with a sealer can improve cohesion between the surface and the sealer thereby improving the corrosion resistance of the treated substrate). Normally, the acid source will be water soluble and employed in amounts of up to about 15 wt. % and typically, about 1 to about 5 wt. % and have a Ph of less than about 5.5.
In another aspect of the invention, the post treatment comprises contacting a surface treated by the inventive process with a rinse. By xe2x80x9crinsexe2x80x9d it is meant that an article or a treated surface is sprayed, dipped, immersed or other wise exposed to the rinse in order to affect the properties of the treated surface. For example, a surface treated by the inventive process is immersed in a bath comprising at least one rinse. In some cases, the rinse can interact or react with at least a portion of the treated surface. Further the rinsed surfaced can be modified by multiple rinses, heating, topcoating, adding dyes, lubricants and waxes, among other processes. Examples of suitable compounds for use in rinses comprise at least one member selected from the group of titanates, titanium chloride, tin chloride, zirconates, zirconium acetate, zirconium oxychloride, fluorides such as calcium fluoride, tin fluoride, titanium fluoride, zirconium fluoride; coppurous compounds, ammonium fluorosilicate, metal treated silicas (e.g., Ludox(copyright)), nitrates such as aluminum nitrate; sulphates such as magnesium sulphate, sodium sulphate, zinc sulphate, and copper sulphate; lithium compounds such as lithium acetate, lithium bicarbonate, lithium citrate, lithium metaborate, lithium vanadate, lithium tungstate, among others. The rinse can further comprise at least one organic compound such as vinyl acrylics, fluorosurfactancts, polyethylene wax, among others. Examples of commercially available sealers, rinses and topcoats comprise at least one member selected from the group of Aqualac(copyright) (urethane containing aqueous solution), W86(copyright), W87(copyright), B37(copyright), T01(copyright), E10(copyright), B17, B18 among others (a heat cured coating supplied by the Magni(copyright) Group), JS2030S (sodium silicate containing rinse supplied by MacDermid Incorporated), JS20401 (a molybdenum containing rinse also supplied by MacDermid Incorporated), EnSeal(copyright) C-23 (an acrylic based coating supplied by Enthone), EnSeal(copyright) C-26, Enthone(copyright) C-40 (a pigmented coating supplied Enthone), Microseal(copyright), Paraclene(copyright) 99 (a chromate containing rinse), EcoTri(copyright) (a silicate/polymer rinse), MCI Plus OS (supplied by Metal Coatings International), silanes (e.g., Dow Corning Z-6040, Gelest SIA 0610.0, among others), ammonium zirconyl carbonate (e.g., Bacote 20), urethanes (e.g., Agate L18), among others. One specific rinse comprises water, water dispersible urethane, and at least one silicate, e.g., refer to commonly assigned U.S. Pat. No. 5,871,668; hereby incorporated by reference. While the rinse can be employed neat, normally the rinse will be dissolved, diluted or dispersed within another medium such as water, organic solvents, among others. While the amount of rinse employed depends upon the desired results, normally the rinse comprises about 0.1 wt % to about 50 wt. % of the rinse medium. The rinse can be employed as multiple applications and, if desired, heated. Moreover, the aforementioned rinses can be modified by incorporating at least one dopant, e.g. the aforementioned dopants. The dopant can employed for interacting or reacting with the treated surface. If desired, the dopant can be dispersed in a suitable medium such as water and employed as a rinse.
The inventive process can create a flexible surface that can survive secondary processes, e.g., metal deformation for riveting, sweging, crimping, among other processes, and continue to provide corrosion protection. Such is in contrast to typical corrosion inhibitors such as chromates that tend to crack when the underlying surface is shaped. If desired, the surface formed by the inventive process can be topcoated (e.g, with a heat cured epoxy), prior to secondary processing. Articles treated in accordance with the inventive process, topcoated and exposed to a secondary process retain their desirable corrosion resistance, coating adhesion, component functionality, among properties.
The inventive process can provide a surface (e.g., mineral coating) that can enhance the surface characteristics of the metal or conductive surface such as resistance to corrosion, protect carbon (fibers for example) from oxidation, stress crack corrosion (e.g., stainless steel), hardness, thermal resistance, improve bonding strength in composite materials, provide dielectric layers, improve corrosion resistance of printed circuit/wiring boards and decorative metal finishes, and reduce the conductivity of conductive polymer surfaces including application in sandwich type materials.
The mineral coating can also affect the electrical and magnetic properties of the surface. That is, the mineral coating can impart electrical resistance or insulative properties to the treated surface. By having an electrically non-conductive surface, articles having the inventive layer can reduce, if not eliminate, electro-galvanic corrosion in fixtures wherein current flow is associated with corrosion, e.g., bridges, pipelines, among other articles.
Depending upon the intended usage of the workpiece treated by the inventive method, the workpiece can be coated with a secondary coating or layer. Alternatively, the treated workpiece can be rinsed (as described above) and then coated with a secondary coating or layer. Examples of such secondary coatings or layers comprise one or more members of acrylic coatings (e.g., IRILAC(copyright)), e-coats, silanes including those having amine, acrylic and aliphatic epoxy functional groups, latex, urethane, epoxies, silicones, alkyds, phenoxy resins (powdered and liquid forms), radiation curable coatings (e.g., UV curable coatings), lacquer, shellac, linseed oil, among others. Secondary coatings can be solvent or water borne systems. The secondary coatings can be applied by using any suitable conventional method such as immersing, dip-spin, spraying, among other methods. The secondary coatings can be cured by any suitable method such as UV exposure, heating, allowed to dry under ambient conditions, among other methods. An example of UV curable coating is described in U.S. Pat. Nos. 6,174,932 and 6,057,382; hereby incorporated by reference. Normally, the surface formed by the inventive process will be rinsed, e.g., with at least one of deionized water, silane or a carbonate, prior to applying a topcoat. The secondary coatings can be employed for imparting a wide range of properties such as improved corrosion resistance to the underlying mineral layer, reduce torque tension, a temporary coating for shipping the treated workpiece, decorative finish, static dissipation, electronic shielding, hydrogen and/or atomic oxygen barrier, among other utilities. The mineral coated metal, with or without the secondary coating, can be used as a finished product or a component to fabricate another article.
The thickness of the rinse, sealer and/or topcoat can range from about 0.00001 inch to about 0.025 inch. The selected thickness varies depending upon the end use of the coated article. In the case of articles having close dimensional tolerances, e.g., threaded fasteners, normally the thickness is less than about 0.00005 inch.
In another aspect, the treated metal surface is contacted with a secondary coating. Examples of such secondary coatings and methods that can be complimentary to the instant invention are described in U.S. Pat. Nos. 5,759,629; 5,750,197; 5,539,031; 5,498,481; 5,478,655; 5,455,080; and 5,433,976. The disclosure of each of these U.S. patents is hereby incorporated by reference. For example, improved corrosion resistance of a metal substrate can be achieved by using a secondary coating comprising at least one suitable silane (e.g., in the medium, rinse, sealer and/or topcoat) in combination with a mineralized surface. Examples of suitable silanes comprise at least one members selected from the group consisting of tetra-ortho-ethyl-silicate (TEOS), bis-1,2-(triethoxysilyl) ethane (BSTE), vinyl silane or aminopropyl silane, epoxy silanes, vinyltriactosilane, alkoxysilanes, among other organo functional silanes. The silane can bond with the mineralized surface and then the silane can cure thereby providing a protective top coat, or a surface for receiving an outer coating or layer. In some cases, it is desirable to sequentially apply the silanes. For example, a steel substrate, e.g., a fastener, can be treated by the inventive process to form a mineral layer, allowed to dry, rinsed in deionized water, coated with a 5% BSTE solution, coated again with a 5% vinyl silane solution, and powder coated with a thermoset epoxy paint (Corvel 10-1002 by Morton) at a thickness of 2 mils.
The inventive process forms a surface that may have improved adhesion to outer coatings or layers, e.g., secondary coatings. Examples of suitable outer coatings comprise at least one member selected from the group consisting of acrylics, epoxies, e-coats, latex, urethanes, silanes (e.g., TEOS, MEOS, among others), fluoropolymers, alkyds, silicones, polyesters, oils, gels, grease, among others. An example of a suitable epoxy comprises a coating supplied by The Magni(copyright) Group as B17 or B18 top coats, e.g, a galvanized article that has been treated in accordance with the inventive method and contacted with at least one silane and/or ammonium zirconium carbonate and top coated with a heat cured epoxy (Magni(copyright) B18) thereby providing a chromate free corrosion resistant article. By selecting appropriate rinses, secondary and outer coatings for application upon the mineral, a corrosion resistant article can be obtained without chromating or phosphating. Such a selection can also reduce usage of zinc to galvanize iron containing surfaces, e.g., a steel surface is mineralized, coated with a silane containing coating and with an outer coating comprising an epoxy.
Without wishing to be bound by any theory or explanation, it is believed that the inventive process forms a surface that can release or provide water or related moieties. These moieties can participate in a hydrolysis or condensation reaction that can occur when an overlying rinse, seal or topcoating cures. Such participation improves the cohesive bond strength between the surface and overlying cured coating.
The surface formed by the inventive process can also be employed as an intermediate or tie-layer for glass coatings, glass to metal seals, hermetic sealing, among other applications wherein it is desirable to have a joint or bond between a metallic substrate and a glass layer or article. The inventive surface can serve to receive molten fluids (e.g., zinc, aluminum, steel, borosilicate, aluminosilicate, phosphate, among other glasses), while protecting the underlying metallic substrate and forming a seal.
The inventive process can provide a surface that improves adhesion between a treated substrate and an adhesive. Examples of adhesives comprise at least one member selected from the group consisting of hot melts such as at least one member selected from the group of polyamides, polyimides, butyls, acrylic modified compounds, maleic anhydride modified ethyl vinyl acetates, maleic anhydride modified polyethylenes, hydroxyl terminated ethyl vinyl acetates, carboxyl terminated ethyl vinyl acetates, acid terpolymer ethyl vinyl acetates, ethylene acrylates, single phase systems such as dicyanimide cure epoxies, polyamide cure systems, lewis acid cure systems, polysulfides, moisture cure urethanes, two phase systems such as epoxies, activated acrylates polysulfides, polyurethanes, among others. Two metal substrates having surfaces treated in accordance with the inventive process can be joined together by using an adhesive. Alternatively one substrate having the inventive surface can be adhered to another material, e.g., joining treated metals to plastics, ceramics, glass, among other surfaces. In one specific aspect, the substrate comprises an automotive hem joint wherein the adhesive is located within the hem.
The improved cohesive and adhesive characteristics between a surface formed by the inventive process and polymeric materials can permit forming acoustical and mechanical dampeners, e.g., constraint layer dampers such as described in U.S. Pat. No. 5,678,826 hereby incorporated by reference, motor mounts, bridge/building bearings, HVAC silencers, highway/airport sound barriers, among other articles. The ability to improve the bond between vistoelastomeric materials sandwiched between metal panels in dampers reduces sound transmission, improves formability of such panels, reduces process variability, among other improvements. The metal panels can comprise any suitable metal such as 304 steel, stainless steel, aluminum, cold rolled steel, zinc alloys, hot dipped zinc or electrogalvanized, among other materials. Examples of polymers that can be bonded to the inventive surface and in turn to an underlying metal substrate comprise any suitable material such as neoprene, EPDM, SBR, EPDM, among others. The inventive surface can also provide elastomer to metal bonds described in U.S. Pat. No. 5,942,333; hereby incorporated by reference.
The inventive process can employ dopants, rinses, sealers and/or topcoats for providing a surface having improved thermal and wear resistance. Such surfaces can be employed in gears (e.g., transmission), powdered metal articles, exhaust systems including manifolds, metal flooring/grates, heating elements, among other applications wherein it is desirable to improve the resistance of metallic surfaces.
In another aspect of the invention, the inventive process can be used to produce a surface that reduces, if not eliminates, molten metal adhesion (e.g., by reducing intermetallic formation). Without wishing to be bound by any theory or explanation, it is believed that the inventive process provides an ablative and/or a reactive film or coating upon an article or a member that can interact or react with molten metal thereby reducing adhesion to the bulk article. For example, the inventive process can provide an inorganic iron or a zinc containing film or layer upon a substrate in order to shield or isolate the substrate from molten metal contact (e.g., molten aluminum or magnesium). The effectiveness of the film or layer can be improved by applying an additional coating comprising silica (e.g., to function as an ablative when exposed to molten metal). The ability to prevent molten metal adhesion is desirable when die casting aluminum or magnesium over zinc cores, die casting aluminum for electronic components, among other uses. The molten metal adhesion can be reduced further by applying one of the aforementioned topcoatings, e.g. Magni(copyright) B18, acrylics, polyesters, among others. The topcoatings can be modified (e.g., to be more heat resistant) by adding a heat resistant material such as colloidal silica (e.g., Ludox(copyright) which can also be added to the medium and rinse).
While the above description places particular emphasis upon forming a mineral containing layer upon a metal surface, the inventive process can be combined with or replace conventional metal pre or post treatment and/or finishing practices. Conventional post coating baking methods can be employed for modifying the physical characteristics of the mineral layer, remove water and/or hydrogen, among other modifications. The inventive mineral layer can be employed to protect a metal finish from corrosion thereby replacing conventional phosphating process, e.g., in the case of automotive metal finishing the inventive process could be utilized instead of phosphates and chromates and prior to coating application e.g., E-Coat. The inventive process can be employed for imparting enhanced corrosion resistance to electronic components. The inventive process can also be employed in a virtually unlimited array of end-uses such as in conventional plating operations as well as being adaptable to field service. For example, the inventive mineral containing coating can be employed to fabricate corrosion resistant metal products that conventionally utilize zinc as a protective coating, e.g., automotive bodies and components, grain silos, bridges, among many other end-uses. Moreover, depending upon the dopants and concentration thereof present in the mineral deposition solution, the inventive process can produce microelectronic films, e.g., on metal or conductive surfaces in order to impart enhanced electrical/magnetic (e.g., EMI shielding, reduced electrical connector fretting, reduce corrosion caused by dissimilar metal contact, among others), and corrosion resistance, or to resist ultraviolet light and monotomic oxygen containing environments such as outer space.
The following Examples are provided to illustrate certain aspects of the invention and it is understood that such an Example does not limit the scope of the invention.

Electrolytic and electroless process for treating metallic surfaces and products formed thereby