A denitrification catalyst regeneration method comprises heat-treating a used denitrification catalyst, then cleaning the denitrification catalyst with an aqueous solution of oxalic acid, and then finish washing the denitrification catalyst with water to regenerate the denitrification catalyst.

1. Field of the Invention
This invention relates to a method for regenerating a denitrification catalyst for removing nitrogen oxides from a combustion exhaust gas from a boiler or the like.
2. Description of the Related Art
A method, put to practical use, for removing nitrogen oxides (NOx) contained in a combustion exhaust gas from a boiler or the like is an ammonia catalytic reduction process which decomposes NOx into nitrogen and water, both harmless substances, by use of ammonia (NH3) as a reducing agent in the presence of a nitrogen oxide removal catalyst (hereinafter referred to as "denitrification catalyst").
In the treatment of an exhaust gas from a boiler using fuel oil C with a high sulfur content or the like as a fuel, a high concentration of sulfur dioxide (SO2) is present in a treated gas. Thus, the oxidation of SO2 into sulfur trioxide (SO3), which occurs simultaneously with the NOx reduction and removal reaction, generates a high concentration of SO3. The high concentration SO3 easily binds to the unreacted portion of NH3, which has been used as the reducing agent, in a low temperature region, thereby forming acidic ammonium sulfate and other compounds. These by-products cause clogging or partial obstruction to the interior and piping of various devices such as a downstream heat exchanger, etc, thereby increasing a pressure loss. Thus, it is necessary to take measures, such as upgrading of a dust collector.
As a catalyst showing excellent denitrification performance and low property of oxidizing SO2 (hereinafter referred to as low SO2-oxidizing property), a denitrification catalyst is available which has a tungsten oxide or a vanadium-tungsten oxide carried on titania.
However, dust, which contains heavy metals, such as vanadium, nickel and iron, and an alkali salt such as Glauber's salt, is present, in addition to SO2, in a combustion exhaust gas of a heavy oil with a high sulfur content. If the above denitrification catalyst is exposed to this exhaust gas for a long period of time, dust components are deposited and accumulated on the honeycomb-shaped wall surface of the denitrification catalyst, thereby inducing a decline in the denitrification performance and the enhancement of the SO2 oxidizing property. Thus, there is need to perform treatment for restoring the denitrification performance and the low SO2-oxidizing property of the denitrification catalyst.
The decline in the denitrification performance is mainly attributable to the fact that alkali components, such as Na and K, which are contained in the dust in the exhaust gas, are accumulated in the denitrification catalyst. The enhancement of the SO2 oxidizing property is mainly ascribable to the accumulation, in the denitrification catalyst, of vanadium which is contained in the dust in the exhaust gas.
Hence, the inventors proposed methods which comprise washing a used vanadium-tungsten-titanium based denitrification catalyst with water or an aqueous solution of a dilute inorganic acid, then cleaning the washed catalyst with a 0.1 to 5 wt. % aqueous solution of oxalic acid, and then further washing the cleaned catalyst with water to remove oxalic acid remaining on the catalyst, thereby removing the vanadium compound, the cause of the enhancement of the SO2 oxidizing property, so that the catalyst is regenerated (see Japanese Patent Application Laid-Open No. 1995-222924 (hereinafter referred to as Patent Document 1), No. 1998-156192, and No. 1998-337483).
Ultraheavy oils, such as ORIMULSION (a trade name of Mitsubishi Corporation for an oil-in-water type emulsion produced by mixing Orinoco tar, which is an ultraheavy oil collected in Orinoco State, Venezuela, with water and a surfactant for easy handling at the ordinary temperature), asphalt, and vacuum residual oil (VOR), contain 2 to 3 times as much sulfur, and 5 to 7 times as much vanadium as in fuel oil C, as shown in Table 1. Moreover, the SO2 concentration in the combustion exhaust gas of such ultraheavy oils is very high. When such ultraheavy oils are used as fuels for a boiler, therefore, a compound containing an alkali component, such as magnesium, is added to lessen corrosion in the boiler.
Hence, an exhaust gas from a boiler using an ultraheavy oil, such as ORIMULSION, asphalt, or VOR (hereinafter referred to as "ORIMULSION-fired Boiler"), as a fuel is by far higher in SO2 concentration and dust concentration than an exhaust gas from a boiler using fuel oil C as a fuel (hereinafter referred to as "fuel oil C-fired boiler").
TABLE 1Measured itemORIMULSIONOrinoco oilFuel oil C.Specific gravity—0.9760.889(80° C./4° C.)Viscosity—152834.8(cSt) (80° C.)N (wt. %)0.480.630.22S (wt. %)2.783.790.97Moisture (wt. %)28-30<0.1<0.1Higher heatingca. 29400ca. 4200043680value (kJ/kg)[ca. 7000][ca. 10000][10400][kcal/kg]Ash (wt. %)0.080.130.01Residual carbon11.8917.48.0(wt. %)V (ppm)280-350400-500≦50Na (ppm)40-70 60-100—(Source: The journal "The Thermal and Nuclear Power", No. 465, June 1995)
Thus, the ORIMULSION-fired boiler is much higher than the fuel oil C-fired boiler in the rate of deposition of dust on the surface of the denitrification catalyst. That is, dust fusion occurs under the action of sulfuric acid and liquid acidic ammonium sulfate which are formed when the temperature of the exhaust gas drops at boiler shutdown or the like. As a result, the amount of increase, per unit time, of the deposition on an upstream end portion of the denitrification catalyst in its exhaust gas flow direction, and on its surface in contact with the gas is so large that gas passage holes tend to be clogged and obstructed early.
In the event of an increase in a pressure loss due to clogging with dust, a decline in denitrification performance and enhancement of SO2 oxidizing property due to deposition and accumulation of dust on the surface and interior of the denitrification catalyst, oxalic acid cleaning as proposed by the aforementioned Patent Document 1 is performed to regenerate the denitrification catalyst.
No problem arises in regenerating the denitrification catalyst of the fuel oil C-fired boiler by the oxalic acid cleaning proposed by the Patent Document I. However, if it is attempted to regenerate the denitrification catalyst of the ORIMULSION-fired boiler by the oxalic acid cleaning proposed by the Patent Document 1, dust deposited and accumulated in the denitrification catalyst is minimally removable, and the denitrification performance and the low SO2 oxidizing property can be recovered only to a certain degree.

Denitrification catalyst regeneration method


Embodiments of a radio frequency (RF) amplification are disclosed. The RF amplification device includes a first RF amplification circuit, a second RF amplification circuit, and power control circuitry operable in a first power mode and a second power mode. The first RF amplification circuit has a cascode amplifier stage configured to amplify an RF signal. The cascode amplifier stage has an input transistor and a cascode output transistor that are stacked in cascode. The second RF amplification circuit is configured to amplify the RF signal. The power control circuitry is configured to bias the first cascode output transistor so that the first cascode output transistor operates in a saturation region in the first power mode and bias the first cascode output transistor so that the first cascode output transistor operates in a triode region in the second power mode. The second RF amplification circuit is assisted without introducing additional loading.

Various communication standards require power amplifiers to have multiple power modes to obtain the best power efficiency in each mode and to decrease power consumption in power modes that require less power. A common technique for providing amplification in different power modes is to use multiple amplifiers. However, current techniques that employ multiple amplifiers often result in performance degradations since the different amplifiers tend to load one another. Alternatively, a single amplifier can be used with a DC/DC converter to dynamically adjust the amplifier supply voltage. Unfortunately, this is an expensive solution that adds significant size and cost.
Thus, inexpensive multi-power mode amplifiers are needed that do not suffer significantly from additional loading.

RF amplifier operational in different power modes


An annular body (2) having a spherical outside surface is fixed coaxially on an annular rubber cushion (3) which in turn is fixed coaxially on a mounting rod (10). A guiding ring (4) is supported inside a case (1) and has a spherical inside surface which cooperates with the spherical outside surface of the annular body to permit rotational movement. The case has axial abutments (6,7) which limit rotational movement and serve as fixing points for bellows which protect the joint.

The invention relates to a pivot bearing including a spherical body held in a case and with which a mounting rod is associated in a substantially central manner.
A pivot bearing of this kind is disclosed in U.S. Pat. No. 4,883,263, which is incorporated herein by reference. The pivot bearing is configured as a bearing for axle supports, steering gear or the like in motor vehicles, and has a spherical body which rigidly surrounds a link pin circumferentially. Between the case and the link pin is a sleeve-like link body of elastomeric material under radial bias. At both ends of the elastomeric link body there are supporting rings by which it is held in the case and which simultaneously provide a limit for the deflection movements. The dynamic characteristics of this pivot bearing are not very satisfactory; swiveling angles of more than 10.degree. and low-force swiveling movement cannot be achieved. Furthermore, due to the configuration of the rubber cushion the properties of isolating vibrations produced in operation are not very satisfactory.


A bright surface structure formed on a member made from metal or resin. A first structure includes: (a) a resin film coated on the member, and (b) a thin metal film formed on the resin film. The thin metal film is made from any one of stainless steel, titanium alloy and nickel alloy. A second structure further includes (c) a clear protective film coated on the thin metal film. A third structure includes: (bxe2x80x2) a thin metal film formed on the resin film of (a), and (cxe2x80x2) a clear colored protective film coated on the thin metal film of (bxe2x80x2). The thin metal film of (bxe2x80x2) is made from any one of stainless steel, titanium alloy, nickel alloy, aluminum, titanium and chromium.

This application is based on and claims priority from Japanese Patent Application Nos. H11-264172 filed on Sep. 17, 1999 and H11-270072 filed on Sep. 24, 1999, the contents of which are incorporated herein by reference.
1. Field of the Invention
The present invention relates to a bright surface structure formed on a member made from metal or resin and having a good ductility and corrosion resistance, and a method for manufacturing thereof.
2. Description of Related Art
To brighten a surface of a metal or a resin member, conventionally an electro plating, such as an electro chromium plating is used. By this method, a high reflectivity, a gloss of a high degree having an appearance of deepness, a good wearing resistance and a good corrosion resistance are obtained. This surface brightening treatment is applied to a metal member such as an aluminum wheel of an automobile, and a resin member such as a front grille, a garnish and an emblem of an automobile for lightening the member.
Since the electro plating needs an environmental countermeasure, recently various methods replacing the electro plating have been investigated. As one substituting method, with the aluminum wheel of an automobile, a surface of the wheel is ground to a smooth surface. However, the grinding is not only accompanied by an increase in manufacturing cost but also inapplicable to an inside surface of ventilation holes of the wheel.
Japanese Patent Publications H04-131232 and H10-130822 propose the following improving methods replacing the grinding method:
(1) Japanese Patent Publication H04-131232
After a metal member is surface-treated, the member is coated with an under coat, then a thin chromium film formed by sputtering, and then a top coat. A surface of the thin chromium film operates as a reflective surface. In the surface treatment, the surface of the member is shot-blasted and coated with a clear resin by powder coating. As the under coat, a clear resin film is formed. The chromium film is formed using chromium. The top coat is a clear coat that protects bright surface of the chromium film.
However, the method described in Japanese Patent Publication H04-131232 presents a problem of the thin chromium film cracking, though thin chromium film presents an external appearance similar to electro chromium plating. Because the residual stress of the chromium film is large, cracking is caused during sputtering and after the top coat is coated, or after the top coat is coated on the chromium film and dried. When the thickness of the chromium film is equal to or greater than 0.04 xcexcm, the crack initiation is severe. The residual stress is so significant that when a stress generated in the top coat during abrasion test and weather resistance test is transmitted to the chromium film, cracking easily occurs in the chromium film. Further, when a solvent penetrates the chromium film during coating and/or drying the top coat, cracking easily occurs in the chromium film.
If the chromium film is reduced in thickness in order to suppress generation of the cracks in the chromium film, the external appearance similar to electro chromium plating cannot be obtained any longer because an under wheel surface is seen through the thin chromium coat and the brightness of chromium film is reduced.
(2) Japanese Patent Publication H10-130822
After a powder coating is applied to an aluminum forging part, an under coat, then a thin aluminum film formed by sputtering, and then a top coat are formed. A surface of the thin aluminum film operates as a reflective surface.
However, the method described in Japanese Patent Publication H10-130822 presents a problem that corrosion resistance is relatively low, though no cracks occur even if the aluminum film has a thickness of about 0.08 xcexcm, since aluminum film has a high ductility. Though the top resin coat formed on the aluminum film protects the aluminum film, once the top coat is damaged during lifetime of an automobile, corrosion propagates from the damaged top coat. When the aluminum film is removed due to the corrosion, the brightness is gone.
The present invention provides for a bright surface structure formed on a metal or resin member having an external surface similar to an electro chromium plating, and a good ductility and corrosion resistance, and a method for manufacturing thereof.

Bright surface structure and a manufacturing method thereof


The present invention relates generally to a method of manufacturing far-infrared radiation thermal wire and far-infrared radiation thermal wire thereby, more particularly, a method of manufacturing far-infrared radiation thermal wire and far-infrared radiation thermal wire manufactured thereby, in which electric power is supplied with a predetermined resistance value.

As Korea is one of many with limited natural resources, energy conservation is an essential assignment, and future of energy conservation is becoming a greater issue.
To conserve energy, an inefficient structure must primarily improve, and by improving the energy inefficient structure, the field where energy is consumed to produce heat benefits the most from the energy conserving effect.
To surely obtain such energy conservation effect to its full extent, method of heating (method of generating and delivering heat), which is used to obtain heat at heat-needed places, must be changed to a high efficient method of heating that conserves energy.
Of all, the field of generating heat consumes the most energy. The particularly important technology of energy conservation must come from a revolutionary shift in the paradigm of generating and delivering heat.
In current drying facilities, residential construction culture and industrial fields all over the world, the method of generating and transmitting heat still depends on the method of heat conduction or convection.
That is because, of all heating methods of convection, conduction, and radiation, conduction and convection heating methods share similar heating efficiency compared to its energy consumption and low energy efficiency and radiant heating method via far-infrared radiation directly transfers heat and, thus, has high energy efficiency compared to its energy consumption.
As inferred in winter, where sunlight feels warm at 20° C. because of such energy efficient characteristic but conduction heat of water at 20° C. does not feel warm, the heating method via heat radiation of far-infrared radiation, such as the sunlight, is much more effectively applied to the sensation of heat that our bodies feel.
Accordingly, radiant heating via far-infrared radiation is high in heat efficiency compared to heating via conduction or convection, the most high effective heat transfer method technology, and the technology that will lead a revolutionary shift in paradigm of the heat market for the future humanity to conserve most energy in heat generation and consumption.
However, as overall industry uses traditional heating element and methods of convection and conduction to heat, why is the high energy efficient technology of radiant heating via far-infrared radiation not being utilized?
The reason is that there isn't a technology that could materialize actual radiant heating (highly efficient energy conserving heating) via true far-infrared radiation, like the one from sunlight.
In order to materialize actual radiant heating (highly efficient energy conserving heating) via true far-infrared radiation, far-infrared radiation that is emitted from heating of electric heating element, like the far-infrared radiation of the sun, must travel a long distance, have good absorbance (transmittance rate), and have a good heat conversion rate via resonance after being absorbed.
However, current radiant heating element that supposedly emits heat radiation and supplies far-infrared radiation (i.e. heating element that contains carbon) has a short travel distance (within 1.5 m) of radiant heating via far-infrared radiation, a minimal transmittance rate (absorbance rate) that cannot even transmit over a sheet of standard fabric, and a weak heat conversion rate after being absorbed.
Accordingly, actual radiant heating (highly efficient energy conserving heating) cannot be materialized.
For example, another important factor in places, where it is necessary to uniformly heat the entirety of a large space, such as industrial drying facilities, is that heating must be sufficient regardless of the size that needs to be heated, and it should be able to uniformly heat the whole space.
However, conventional heating technologies have made heating in large spaces almost impossible.
In other words, in a space with a large area, only the surrounding area of the heater (conductive heat) is hot, but a little distant area is cold. There is a limitation even with blowing hot air (convection heat) when blowing the entirety of a large space.
Also, the heating condition was not uniform in the entire space.
In other words, the area of the heater is hot but distant area is cold and, the area where the hot wind reaches is hot but cold in area where it does not reach.
For example, in a drying facility that dries seafood, while there should be a larger area for dried seafood than for the heating equipment, if only the drying compartment near the heating equipment is warmly heated and afar from the heating equipment is not heated and kept cold, only the nearby seafood will dry, Further, the seafood in immediate proximity will have too less moisture and be in a poor quality as a product. The seafood faraway will not dry well or have too much moisture even if a little dries and be in a poor quality as a product.
In general, current heating technology of heating elements that heat by conduction or convection or recently supplied heating technology of claimed-to-be far-infrared radiation is too inefficient and consumes high in energy that it is difficult to outcompete fossil fuels in obtaining the heat for drying in drying facilities. As it is not economical to utilize as an electric heating element to generate various kinds of heat and to be in various facilities, equipments, or machines, the area of application was very limited.

Method for manufacturing far infrared heating wire and far infrared heating wire manufactured thereby

Abstract: According to an embodiment of the present invention, a method of manufacturing far-infrared radiation thermal wire comprise steps of: making microfine wire that emits far-infrared radiation as it generates heat according to the resistance value when electricity is flowed in; making one strand of thermal wire by bundling many strands of the microfine wire that are in contact of each other; and making two or more groups each of the groups having different resistance value and comprising one or more microfine wires that have identical resistance value in order to make the bundle into an effective geometric structure that well radiates electric dipole radiation while emitting far-infrared radiation.


The present invention is a wireless communication system for establishing wireless communication between a wireless base station installed at the upper part of a communication area in a moving vehicle and a wireless terminal in the communication area, comprising a space surrounded by wall surfaces rising vertically in the communication area, wherein the space has an opening opened by specified width in a plane direction, and the wireless base station is installed in a region extended from the opening of the space by specified width outwardly of the wall surface.

Recently, wireless communication systems such as IEEE802, 11a/b/g are widely employed. These are communication systems having an equivalent wireless function substituted for Ethernet (registered trademark) that is called wireless LAN (Local Area Network) system and used for cable LAN system.
A wireless LAN system was initially used for a pocket or portable personal computer and a portable wireless terminal device. After that, the range of use expanded to various fields, and for example, in order to eliminate the complication of wiring cables, a wireless LAN system has been proposed for terminal devices whose using place is fixed.
As an example of its application, conventionally proposed is a technology of using a wireless LAN system for video and audio contents distribution service in aircrafts (for example, refer to Patent document 1).
In this example, a wireless LAN system is installed in an aircraft, and contents data is delivered to a wireless terminal device mounted in each passenger seat, thereby realizing information distribution service for which the wireless LAN system is used. Such a distribution system is configured in that contents data offered to users is accumulated in a server of the system, and a plurality of wireless access points (hereinafter called access points) serving as wireless base station equipment connected to the server are installed in the aircraft. Also, a wireless terminal device is installed in each seat, and the position of each access point is set so that one access point covers a plurality of wireless terminal devices. As an access point setting method, the interior space of the aircraft is divided into a plurality of small areas, and the access points are respectively allocated to the service areas in the aircraft so that one access point corresponds to one small area. In this example, each small area is partitioned by using a working area as a boundary such as a kitchen that is called a galley where cabin crews offer services. Many of the galley walls are made by using a material such as metal or carbon composite material that is an obstacle to radio wave propagation, forming an electromagnetic shield structure. Also, a toilet or the like having walls made by using the above-mentioned material is often disposed in the vicinity of the gallery or as a part of the galley. Therefore, structures having an electromagnetic shield structure such as a galley and toilet are generally called galley in the following description.
As a countermeasure for interference between wireless terminal devices, a directional antenna is disposed at each access point so that radio waves are radiated without giving interference or disturbance to other small areas as much as possible, and it is set for wireless communication with each wireless terminal device within its area by using a predetermined channel. It is configured in that communication is established between one access point and each wireless terminal device within its small area through time division of frequency band of the channel, and thereby, it is possible to individually provide information distribution service to a plurality of wireless terminal devices by using one channel.
As for wireless communication, there are conventionally disclosed methods such as a method of making radio waves reflected from wall surfaces between wireless base station and wireless terminal and a method of enhancing communication efficiency and antenna efficiency by dividing electromagnetic wave components such as vertically polarized wave and horizontally polarized wave to be used (for example, refer to Patent documents 2 to 4).
However, in the case of communication between a cabin crew and a passenger or between cabin crews in an aircraft, the cabin crew is moving in the aircraft or working in the galley in many cases. In case the cabin crew is moving, it is possible for the crew to make communication by using a portable wireless terminal device because of an access point that covers a wide area. However, when the crew is in a galley or the like, it is difficult to establish stable wireless communication because the outer surfaces of the galley reflect the radio waves. Accordingly, the conventional method is such that a cabin crew uses a plurality of cable communication terminals installed at fixed portions to make communication with other cabin crew or passenger. As a result, there arises a problem that it is necessary for the cabin crew each time to move for communication to a place where a cable communication terminal is installed, and it is rather troublesome and also results in being late in contacting in case of emergency.

Wireless communication system for establishing communication between a base station in a moving vehicle and a wireless terminal


An exerciser includes a weighted base, a frame member, a resistance assembly mounted in the frame member, and a lifting bar mechanism. The lifting bar mechanism includes an axle rotatably mounted in the frame member, a gear securely mounted on the axle, a lifting bar connected to the axle to rotate therewith, a clutch seat mounted on the axle surrounding and receiving the gear and having a cutout in a periphery thereof, a rocker arm extending outward from an outer periphery of the clutch seat, a cable having a first end attached to the rocker arm and a second end attached to the resistance assembly, and a clutch assembly with a pawl member for releasably engaging with the gear under the control of a clutch lever thereof. When the clutch lever is pressed, the user may adjust the lowermost position of the lifting bar.

The present invention relates to multi-purpose exercisers which allow the user to practice weight lifting, hands and legs pulling, horizontal bar exercise, sit ups, and boxing.
For modern people who do not have much time and space to exercise, exercisers provide an excellent means therefor. A conventional exerciser usually includes a weight lifting means in which the user lies on a mat and pushes a lifting bar connected to a resistance means. The user, however, might be injured if he does not have enough arm strength to slowly put down the lifting bar or the lifting bar does not align with the supporting seat on which it should rest. Another disadvantage of conventional exercisers is that the mat is not foldable and thus occupies a certain space. A further disadvantage of conventional exercisers is that the lifting bar is not adjustable in height. The present invention provides an improved multi-purpose exerciser to mitigate and/or obviate the problems in the conventional exercisers.

Multi-purpose exerciser having a clutch means


A system and method of feeding rolled bales of hay to livestock while simultaneously storing the hay off of the ground. The hay is presented in such a way that the livestock can graze on the hay bales at will, much as they would graze in a grass field. The system of storing and offering the hay bales is modular, and may be added to or subtracted from depending upon the size of the herd of livestock. Additionally, the invention is designed to be placed along an existing fence-line for simple access to the feeding system. This allows the system to act as a simple pass-through for hay bales for feeding purposes, as opposed to requiring that bales be physically picked up and placed on a feeder for each individual feeding. A trough for water or other types of feed may also be built directly into the system.

1. Field of the Invention
The present invention relates generally to a system and method for providing baled hay feed to livestock, and more specifically to a modular system capable of receiving round hay bales and a method of feeding livestock thereby.
2. Description of the Related Art
The feeding of livestock presents several challenges to farmers or ranchers. Feeding is both costly and time consuming Several options for feed are available to owners of livestock, including the use of baled hay. Baled hay is a pre-cut dried fodder used to feed livestock when field grazing is impossible, either due to location or climate. Hay may be baled in block shapes or cylindrical rolls. Traditionally, the bales would be broken down prior to feeding; however, this adds an additional time consuming step to the feeding process.
In order to avoid the step of breaking down the bales of hay, farmers and ranchers often simply place a block of hay into a pen or stable containing the livestock. This process, however, leads to significant waste of hay. The hay may be trampled or otherwise made inedible during the feeding process.
Most animals are fed hay in two daily feedings, morning and evening. However, this schedule is more for the convenience of humans, as most grazing animals on pasture naturally consume fodder in multiple feedings throughout the day. Some animals, especially those being raised for meat, may be given enough hay that they simply are able to eat all day. The proper amount of hay and the type of hay required varies somewhat between different species. An ideal feeding situation would allow the animal to graze on the hay as they would graze in a field.
Some attempts to provide hay feeders utilizing hay bales in block shapes have been attempted, but none have implemented a modular livestock feeder utilizing round rolled hay bales in the manner of the present invention.
Another issue with hay for feeding livestock is storage. Storing hay is not a problem if you are buying only a few weeks' worth at a time, but storage over several months requires more protection to avoid spoilage. Regardless of storage time, you will need a way to keep it from getting wet or drawing moisture from the ground. Placing hay bales directly on the ground for feeding leads to faster spoilage and is therefore an inadequate method of feeding. An ideal hay feeder would store the hay in such a way as to maximize its useful life.
Heretofore there has not been available a hay feeding system or method with the advantages and features of the present invention.

Modular baled hay feeding system and method for livestock


Disclosed is a connector for integrated circuit packages. The connector generally includes a cover assembly having a metal framework for fixedly securing the integrated circuit package without projecting pin elements of the package from the backside of the cover assembly in order to prevent the pin element from the damage and a socket assembly for mounting contact elements to connect with the pin elements. The framework is hinged to the cover assembly at one of the side edges thereof. The cover assembly can be combined with the socket assembly by means of the first engage portion of the cover assembly and the second engage portion of the socket assembly at the side edge opposed to the hinged side edge. After combination the hinged side edge of the cover assembly can be pressed against the socket assembly so as to connect the pin elements with the corresponding contact elements from the side edge having the engage portion towards the hinged side edge of the socket assembly one by one.

1. Field of the Invention
This invention relates to electrical connectors and more particularly to a connector for integrated circuit packages.
2. Description of the Prior Art:
A semiconductor integrated circuit is formed from a base of semiconductor material and active devices or components such as transistors and passive components mounted on the base. A plurality of pin contact elements are used for connecting the components on the base with conductors arranged in a printed circuit board by means of a connector. The number of the pin contact elements will increase proportionally to the number of components. To minimize the scale of the package, a hundred of pin contact elements are arranged in the backside of the base thereof in the form of grid. This type of the package is commonly called as "Pin Grid Array type IC or PGA type IC".
In order to increase the number of the pin contact elements to be mounted on the substrate or base of the package, it is necessary to reduce the physical size or dimension of the pin contact element. It will bring results that the pin connector element is not strong enough for connecting with the contact element of the connector.
In view of the foregoing, the need exists for a new and improved connector for a PGA type integrated circuit package which overcomes some of the problems of the prior art.

Connector for integrated circuit packages

Japan Aviation Electronics Industry, Ltd.


A plurality of monitors are linked with a communication network and other communications devices (e.g., cellular phones, satellite phones, Voice-Over Internet Protocol (VoIP) phones, personal digital assistants (PDAs), and any communications device having a digital signal processor (DSP)). The communications network provides access to one or more databases that contain information related to an identification tag attached to an object, information about the object, and/or policies for tracking and communicating information about the object. When combined with a network tracking system, the policies can also set parameters for permissible areas in which the objects can be disposed and for tracking of the objects across the network.

U.S. Pat. No. 3,689,855 teaches an interrogator responder arrangement that is capable of handling random orientations between the interrogator and the responder for use in applications such as the tracking of guards, watchmen and executives in industrial plants wherein each person carries a small, inexpensive non-radiative passive responder. Interrogators are positianed at various fixed locations throughout the plant. In addition, this interrogator and passive responder arrangement could be used for the handling of luggage and cargo in airport terminals and freight terminals. In addition to a responder tag that is attached to each individual piece of luggage at the check-in station or at the ticket collection station at an airport terminal, a second responder tag having a code generation capability that provides the same code as the first responder, or bears a known correspondence to that one, is given to the passenger, and the passenger can insert the second tag into the baggage request station automatic handling equipment to detect the paticular code on the tag and locate the passenger's luggage.
Other applications are directed to the use of tag and reader systems for the handling and tracking of livestock. U.S. Pat. No. 4,262,632 teaches an electronic livestock identification system containing a capsule or pill having an electronic transmitter which is uniquely coded to broadcast a series of electronic pulses from each animal in which it is internally implanted. An associated interrogator receiver unit, which is preferably situated externally of the animal, may be used for sensing and appropriately utilizing the electronic pulses to identify the animal. Although the capsule may include a power supply, it is preferably a passive storage element to which power may be induced from the interrogator.
International Application Number PCT/US87/00415 is directed to a syringe implantable identification transponder which is syringe implantable into an animal and provides identification of the specific animal when the transponder is interrogated. This transponder has particular application to the identification and monitoring of migratory waterfowl and other small animals such as fish.
Given the limitations and relatively high costs of these tracking and locating systems, an improved method for tracking and locating objects that is less expensive is desired. Suitable methods would permit a consumer to easily tag desired objects, to identify the importance of those objects, and to assign any necessary information related to those objects. In addition, it is desired to be able to track those objects across greater volumes of space and not to confine the locating and tracking of those items to fixed areas where scanners are located.

This patent is subject to a terminal disclaimer.

Instantaneous mobile access to all pertinent life events


For the purpose of transmitting digital audio signals from recording studios to the various broadcasting stations of a broadcasting network, the data flow of the digital audio signals to be transmitted is initially reduced in accordance with a technique which utilizes the psychoacoustic phenomena of the human ear. Then groups of these data-reduced digital audio signals are respectively encoded in a baseband in accordance with a DS1-technique and combined to form respective DS1/M-signals. Finally, the thus produced DS1/M-signals are transmitted in accordance with the DSR technique by use of a wide-band transmission system to the individual broadcasting stations of the broadcasting network.

1. Field of the Invention
The present invention relates to a method for transmitting digital audio signals from recording studios to various master stations of a broadcasting network.
2. Description of the Prior Art
For projected future digital broadcasting systems it will be necessary to transmit a multiplicity of individual programs from the various recording studios of the broadcasting corporations to the individual master stations of these broadcasting networks, which are planned on a country-wide basis.
The so-called DAB network (Digital Audio Broadcasting, described in "Digital Audio Broadcasting" ITU-COM 89, Geneva, October 1989, and in "Kunftige Systeme der digitalen Horfunkubertragung", Bayerischer Rundfunk, November 1990, both incorporated herein by reference) provides, for example, simultaneous broadcasting networks in which every DAB station transmits a plurality of digital audio signals, e.g. 6 stereo signals, in clock-synchronous and word-synchronous, i.e. bit-synchronous fashion, in a so-called COFDM signal (Coded Orthogonal Frequency Division and Multiplexing). Since a country may have a plurality of separate radio service areas, there results a large number of programs which must be fed to the DAB network of the service area or country, respectively. Assuming that there are four frequencies which are provided for simultaneous broadcasting networks, and further assuming that a big country comprises 10 networks each comprising six programs, this already totals 60 programs. Even if the known and technically mature so-called DS1/DSR satellite transmission were used for distributing the audio signals from the recording studios to the various master stations of the broadcasting network, the transmission would be limited to only 16 programs for each DSR channel, which would be insufficient for modern country-wide broadcasting networks with regional service.
With the so-called DS1 technique (Digital Sound 1 Mbit/s), two audio signals or, respectively, a stereo signal and additional information, are transmitted in a serial stream. A scale factor is introduced for data reduction (European Patent Application 0 133 697 and paper "Audio-Coder DCA fur den digitalen Horfunk" in "Neues yon Rohde & Schwarz", No. 114, summer of 1986, pages 13-10, both incorporated herein by reference). 16 of these DS1 audio signals generated by a DS1-coder are then interlaced through a data multiplexer on the basis of the so-called DSR technique (Digital Satellite Radio), and are supplied in a 4-PSK-modulator for instance to a satellite earth station ("Neues yon Rohde & Schwarz", No. 114, page 14). The satellite transmitter transmits for example at 18 GHz to the satellite which in turn transmits at 12 GHz to the individual consumer satellite receivers. From the 4-PSK-demodulated digital stream the desired audio signals can be selected from a total of up to 16 digital audio signals through a demultiplexer/decoder, and can be made audible after digital-to-analog conversion.
For transmitting the digital audio signals from the recording studios to the master stations of a broadcasting network it has already been proposed to make use of the satellite transmission technique (Rohde & Schwarz study on "Program and Data Lines to VHF-FM-Transmitters", October 1990). But even a combination of the above-described DS1-DSR broadcasting techniques, which is quite common today, with such a satellite transmission technique would again result in a maximum of 16 programs per each DSR channel being transmitted from the recording studios to the various master stations of the broadcasting network, which is quite insufficient as has been explained above.

Method and system for transmitting digital audio signals from recording studios to the various master stations of a broadcasting network


A method for making moldable material comprises the initial step of providing a composite material comprised in part of an epoxy. A high performance strand is then distributed in the composite material to form a moldable material. Lastly, the moldable material is heated sufficiently to cause the composite material and the high performance strand to stick at least slightly together without melting the epoxy.

The present invention generally relates to moldable materials and, more particularly, relates to a method for making a moldable material. Most particularly, the invention relates to a method for efficiently making a cost-effective pliable moldable material having a high tensile strength and high modulus.
It is well known to form a strand from a collection of fibers. This can be achieved, for example, by passing molten material (e.g., molten glass) through a plurality of orifices in a tip plate of a fiber forming bushing. Fibers formed by the fiber forming bushing are linearly pulled and gathered together to form one or more strands. The strands are typically wound on a collet to form packages, which subsequently can be used to produce various products. For example, a roving can be formed from a single strand (i.e., a single end roving) or a plurality of strands that are linearly pulled and gathered together (i.e., a multi-end roving). A plurality of rovings can be wound on a wrap wheel and then cut to form a hank, which can be used as a charge of material for making or molding a laminate or final composite part. A composite part formed from fibrous materials are preferred in applications where it is desirable to minimize the weight of the composite part.
A broad range of composite parts is produced from fibrous materials. Such composite parts differ in their requirement for tensile strength (i.e., how strong a material is when pulled upon) and modulus (i.e., how well a material resists deformation). Some composite parts require a high tensile strength and a high modulus. For example, lightweight composite leaf springs having a high tensile strength and a high modulus are preferred in high-performance motor vehicles. Conventionally, such leaf springs are molded from a charge of material formed from glass fiber strands impregnated with an epoxy resin. The glass fiber strands are impregnated by passing the glass fiber strands through a bath of epoxy resin. As a result of the impregnation, the charge of material has good wet out, (i.e., the glass fibers and epoxy resin are in close contact and the resin to glass ratio is appropriate, about 70% glass by weight and about 30% resin by weight). In a subsequent filament winding process, heat and pressure are used to cure and form the charge into a leaf spring. The filament winding process is well known in the art and works quite well but it does have its limitations. Often, the impregnated glass fiber strand is quite sticky and excess resin usually comes off the glass fiber strand and thus is wasted. In addition, the incorporation of other fibers with glass epoxy is very difficult because every type of fiber has its own unique set of processing characteristics.
What is needed is a lightweight, cost-effective charge of moldable material that is dry and easily processable and can very easily accept other fibers into the composite to modify and improve the composite part.
The present invention is directed toward a method for making moldable material comprising the initial step of providing a composite material comprised in part of an epoxy. A high performance strand is then distributed in the composite material to form a moldable material. Lastly, the moldable material is heated sufficiently to cause the composite material and the high performance strand to stick at least slightly together without melting the epoxy.
Various objects and advantages of this invention will become apparent to those skilled in the art from the following detailed description of the preferred embodiment, when read in light of the accompanying drawings.

Method for making a charge of moldable material

Owens Corning Fiberglas Technology, Inc.


A thermally insulated building brick (1) and a method for production thereof, wherein the brick comprises a structural body (2) with at least one cavity (8) and an insulating filling (3) arranged in the cavity. To provide a brick with high insulation value suited for mass production, the insulating filling comprises an insulating material arranged in a leading-in sheath.

Although new building materials and building methods have been introduced in the past decades, traditional building bricks are still used and valued. A disadvantage of ordinary building bricks is however that the insulating value is mediocre, which with increasing cost of energy and focus on environment is a major disadvantage. Different attempts have been made to improve the insulation value of building bricks.
At present there are several types of insulated building bricks available on the market. One of these bricks is the Unipor Coriso, which is a brick filled with mineral granulate, and an example of a mineral wool filled brick is known under the trade name MZ8 from Mein Ziegelhaus. Other examples include bricks with a filling of perlite (e.g. Poroton-T8/-T9 from Wienerberger).
Patent literature does also include different concepts for insulated building bricks. One example can be found in GB Patent No. 461,314, which relates to a brick filled with an insulating filling, such as glass wool. This is a traditional building brick filled with traditional insulation materials at the time of filing of this patent more than 80 years ago, and this brick does not meet the demands for modern building bricks in terms of insulation properties and is not suited for mass production.
A more modern example is the building brick according to EP 1 752 593 A2. This building brick has a substantially cubic body comprising a plurality of cavities divided by walls and filled with insulating filling. This prior art building brick does provide state of the art insulation properties, but cannot meet future demands on insulation properties, and further is not perfectly suited for mass production.
DE 20 2007 013 074 U1 discloses vacuum insulation panels having very high insulation value. The vacuum insulation panel comprises a micro-porous core material e.g. a silica-aerogel, possibly with reinforcing fibres, such as inorganic fibres e.g. mineral wool fibres. The core material is arranged in a wrapping, evacuated and provided with an air-tight metal casing, such as an aluminium foil. It is mentioned, but not otherwise supported that the panels can be mounted in cavities of a hollow brick. The resulting brick has a high insulation value, but it is, however, an expensive solution and not suited for mass production. Further the vacuum insulation panel is fragile and subject to damage during mounting in the relatively narrow cavities of a hollow brick. The wrapping and film could for example easily be scratched, whereby the vacuum would be lost and the insulation properties reduced. Such likely damages to the insulation panel will destroy or reduce the insulation properties of the brick. Conventionally such vacuum insulation panels are filled with aerogel for the aerogel to function as an air-absorbent, which will, however, reduce the insulation value of the panel over time.


The present invention relates to a combination of ivermectin and brimonidine for use in the treatment and/or the prevention of moderate to severe rosacea, preferably by topical administration of a 1% ivermectin cream and 0.33% brimonidine gel.

The invention relates to a combination of compounds for treating moderate to severe rosacea.
Rosacea is a common chronic and progressive inflammatory dermatosis related to vascular relaxation. It mainly affects the central part of the face and is characterized by a reddening of the face or hot flushes, facial erythema, papules, pustules, telangiectasia and sometimes ocular lesions called ocular rosacea. In serious cases, particularly in men, the soft tissue of the nose can swell and produce a bulbous swelling called rhinophyma.
Rosacea generally occurs between the ages of 25 and 70, and it is much more common in people with a fair complexion. It affects more particularly women, although this disease is generally more severe in men. Rosacea is chronic and persists for years with periods of exacerbation and remission.
The pathogenesis of rosacea is poorly understood. Many factors may be involved without necessarily inducing this disease. They are, for example, psychological factors, gastrointestinal disorders, environmental factors (exposure to the sun, temperature, humidity), emotional factors (stress), food-related factors (alcohol, spices), hormonal factors, vascular factors, or even an infection with Helicobacter pilori.
Papulopustular rosacea (PPR) is a chronic inflammatory disorder characterized by facial papules, pustules, and persistent erythema. In addition to neurovascular dysregulation, the facial skin of patients with rosacea is affected by augmented proinflammatory immune responses. The principal active cathelicidin peptide (LL-37) is highly concentrated in skin affected by rosacea and can contribute to acute inflammation. Moreover, PPR is characterized by the presence of inflammatory infiltrates that accompany flares, along with a heightened immune response involving neutrophilic infiltration and increased gene expression of IL-8.5 In addition to exogenous factors (including UV light, heat and alcohol), it may be triggered by Demodex folliculorum mites. Some studies of PPR observed higher mite densities compared to controls. Therefore, a multitude of factors can activate neurovascular and/or immune responses, and consequential inflammation leading to flares of rosacea.

Use of ivermectin and brimonidine in the treatment and/or prevention of moderate to severe rosacea


An organic wastewater treatment method that includes a raw sludge removal step, a raw sludge concentration step, a biological treatment step, an excess sludge separation step, an excess sludge concentration step, a sludge mixing step, and a methane fermentation treatment step. The treatment method further includes a sterilization step for heating and sterilizing the concentrated excess sludge upstream of the sludge mixing step. At least one among: (1) the temperature to which the concentrated excess sludge is heated during sterilization, (2) the concentration of concentrated raw sludge and/or the concentration of the concentrated excess sludge, and (3) the mixture ratio between the concentrated raw sludge and the concentrated excess sludge is adjusted according to the fluctuation in the amount of raw sludge generated and the amount of the excess sludge generated, and the temperature of the mixed sludge is controlled to a temperature suited for methane fermentation.

One example of a method for treating organic wastewater such as sewage involves removing the raw sludge (primary sludge) from the organic wastewater followed by a biological treatment such as an activated sludge treatment, thereafter removing excess sludge from the biologically treated organic wastewater while the solution being discharged, the raw sludge and the excess sludge is mixed and subjected to methane fermentation treatment, so as to reduce the volume of the sludge.
Due to containing more easily degradable organic matter than excess sludge does, raw sludge is more adaptable to methane fermentation in aspects of digestive efficiency, amount of digestion gas generated, digestion speed, etc. able to yield a higher energy recovery effect. Conversely, excess sludge is a kind of substrate rich in hard-to-degrade cellulose and proteins derived from such as microbial cells, which requires time to get decomposed. Therefore it has a lower energy recovery effect than raw sludge does. Because of that when a mixture of raw sludge and excess sludge is subjected to methane fermentation, the performance of methane fermentation gets worse, resulting in poor energy recovery efficiency and larger methane fermentation tanks in order to obtain long hydraulic retention time.
In order to improve the property of such excess sludge, technologies for example solubilization treatment were developed. Patent document 1 discloses a method for treating organic wastewater, which includes a primary sludge removal step, an activated sludge treatment step, an excess sludge removal step, and a methane fermentation treatment step with the primary sludge and the excess sludge, where the excess sludge being subjected to a solubilization treatment at 60-90° C., heat from the solubilization-treated excess sludge was utilized to heat the primary sludge, the heated primary sludge was subjected to an acid fermentation treatment for 3-4 days at 30-40° C., and then mixed with the solubilization-treated excess sludge for methane fermentation treatment.

Organic wastewater treatment method and organic wastewater treatment device


An apparatus and method for connecting simulator instruments to a simulator host computer includes a plurality of panel modules, a data bus having a connection to each panel module, and a control computer connected to the data bus and to the host computer. Each panel module further comprises at least one simulated instrument and a local computer. The local computer runs a computer program adapted to the instrument or instruments controlled by that panel module, so that the local computer communicates with the data bus for bi-directional communication between the instrument and the control computer. Each panel module has a unique address on the data bus.

The present invention relates to simulator systems; in particular to an apparatus and method for connecting the various instruments and controls in a simulated aircraft cockpit or other simulated vehicle to the simulator control system.
Aircraft flight simulators train pilots to operate an airplane in a simulated environment. Simulators for other vehicles or human-controlled machines are also known. For example, simulators may be used to train pilots, drivers, or operators of such diverse systems as military vehicles, tanks, and artillery systems; and also trucks, trains, and construction equipment. One class of simulator digitally generates the functions of a real control panel as it would appear in an airplane (or other vehicle) under way, and displays a virtual control panel on a computer monitor. The other kind of simulator, to which the present invention is directed, provides the pilot with an exact working replica of the cockpit of a particular airplane or other machine, so the pilot can touch and operate a real control panel. The indications of the instruments on such a control panel are controlled to be consistent with the movement of the flight controls by the pilot, as well as the pilot""s selection of instrument settings. Although the invention disclosed here is primarily discussed in the context of aircraft simulators, the reader should understand that other embodiments of the invention are possible and desirable for other types of vehicles and machines, and the term xe2x80x9cpilotxe2x80x9d should be understood to include the human operator of such other vehicles and machines.
Realistic simulators typically have control panels constructed of modular parts. Each such modular part represents a particular instrument, switch, display, or control. Each module must accept commands to change its display consistent with the simulation program, and must also send data to a central control system to tell that system what is its current state. In modern simulators, the control system is a computer programmed to generate the necessary commands to the simulator""s instruments and controls. This method requires that many diverse devices communicate with this host computer. Moreover, this exchange of data and instructions must happen rapidly to keep the instruments realistically updated; typically 60 times per second.
In the prior art, the control panel modules and the host computer are connected with individual wires, via some sort of signal-conditioning interface between each panel module and the computer. Considering that each panel requires both power and data lines, the number of wires rapidly becomes bulky and unwieldy. There are two other main problems with this approach.
First, the large number of wires and connections creates a high probability of failure, and a corresponding difficulty in finding and fixing such faults. Second, modules of a given kind cannot readily be moved between different positions in the cockpit because the wiring associated with a particular module is fixed. Thus a new wiring harness is required. The same problem exists in moving instrument modules between simulators representing different models or configurations of the same aircraft or vehicle.
At least one prior-art patent, U.S. Pat. No. 5,017,141, to Relf, et al. attempts to solve this problem by moving the processing power from a central computer and distributing it among modules representing the major flight functions, such as engines, navigation, flight, and systems. The result is a complex distributed computer system involving a shared data bus, shared memory, multiple CPU""s within each module, and exchange of data between the modules. This approach may solve the wiring-interconnect problem, but it does so at the cost of considerable complication to the calculation of instrument updates and flight control.
What is needed is a simple solution to the wiring problem that removes complexity from the connections to the panel modules, while also retaining the simplicity of a central host computer.
We disclose an apparatus and method for connecting simulator instruments to a simulator host computer. The system includes a plurality of panel modules, a serial data bus (the data bus having a connection to each panel module), and a control computer connected to the data bus and to the host computer. Power wiring is preferably included in the same cable with the wiring for the serial data bus, thus allowing use of only one connector on the panel module.
Each panel module further comprises at least one instrument, where the xe2x80x9cinstrumentxe2x80x9d may be a control, a switch, or an indicator of some sort. Each panel module also has a local computer. This local computer is preferably a single-board computer further comprising a microprocessor, a read-only memory communicating with the microprocessor (for storing a computer program), and a signal-conditioning circuit connected to each instrument and the microprocessor. In each panel module, the computer program is adapted to the instrument or instruments controlled by that panel module.
The local computer communicates with the data bus for bi-directional communication between the instrument and the control computer. Each panel module has a unique address on the data bus.
The computer program running on the control computer has an input table associating each panel module address with data representing the current state of the instruments associated with that panel. It also has an output table associating data received from the host computer with each panel module address, and a process for detecting when instrument data is different from that previously stored in the output table for a given instrument. When the data is different, the instrument is commanded to update its reading by placing a message addressed to the particular panel module on the data bus.
Some instruments will not have indicators, but only states, such as switches, changed by the operator. In this case, the computer program running on the control computer receives state data from the panel modules and compiles a message to send to the host computer.
In the preferred embodiment a process for receiving a message from the control computer runs on the local computer. A process for determining if the message is addressed to the instrument also runs. If the control computer sends a message addressed to the instrument associated with the local computer, a process then runs for sending control signals from the local computer to the instrument to change the state of the instrument.
The local computer has a process for detecting a change in the state of the instrument, and a process for comparing the state of the instrument to its recorded state. If the current state and the recorded state differ, a process runs for sending a message to the control computer so that the control computer can update its input table entry for that instrument.

Apparatus and method for connecting simulator instruments to a control system


Disclosed is a method and apparatus for linearizing a power amplifier using a digital signal process (DSP), and particularly, is a method and apparatus for effectively linearizing an amplifier which has a plurality of distortion generating sources. To this end, there is a plurality of compensation methods and compensation units which can generate inverse distortion signals corresponding to the distortion components outputted by the plurality of distortion generating sources, thereby making it possible to provide superior linearity.

1. Field of the Invention
The present invention relates to a power amplifier linearization method and apparatus, and more particularly, to a method and apparatus for effectively linearizing a power amplifier having a plurality of distortion generating sources.
2. Description of the Related Art
Recently, a power amplifier in a mobile communication system has been required to amplify a signal with high efficiency and high linear characteristics. In addition, a next generation mobile communication system uses a complicated modulation scheme in order to transmit a large amount of data to the user in a short time.
Accordingly, the peak-to-average power ratio (PAPR) of the signal increases. Generally, in order to provide linear amplification, a power amplifier operates at a back off point equal to or greater than the peak-to-average power ratio of a signal.
However, at this point, the power amplifier exhibits a considerably low efficiency characteristic. This is because the stable operation of a transmitter is not ensured due to an increase of the heating value of the transmitter. Therefore, an additional cooling system is required.
In order to improve the efficiency of a power amplifier at a back-off point, a Doherty amplifier has recently received wide attention.
FIG. 1 is a block diagram illustrating the configuration of a conventional Doherty power amplifier.
Referring to FIG. 1, a Doherty amplifier 100 includes: a power divider 102; an input phase compensation unit 104; a carrier amplifier 106; a peaking amplifier 108; offset lines 110 and 112 configured to generate a high peaking output impedance when the peaking amplifier does not operate, and thus to allow the occurrence of a suitable load modulation phenomenon of the carrier amplifier; and a combiner 114.
The power divider 102 divides and outputs an input signal to the carrier amplifier 106 and the peaking amplifier 108. The carrier amplifier 106 uses relatively high input Direct Current (hereinafter, referred to as "DC") bias. The peaking amplifier 108 uses relatively low input DC bias. Each of the carrier amplifier 106 and peaking amplifier 108 amplifies the input signal according to a preset amplification gain and outputs the amplified input signal to the combiner 114. The combiner 114 combines the output signal of the carrier amplifier 110 and the output signal of the peaking amplifier 115. The input phase compensation unit 104 compensates for a phase difference which is caused by the offset lines 110 and 112 and the combiner 114.
FIG. 2a is a graph illustrating the fundamental current components of the carrier amplifier 106 and peaking amplifier 108 in ideal and real cases.
Referring to FIG. 2a, in the ideal case, it can be understood that the fundamental current components of the carrier amplifier 106 and peaking amplifier 108 have constant slopes according to the increase of an input voltage. However, in the real case, the carrier amplifier 106 and peaking amplifier 108 may be configured with a field effect transistor (FET), a high electron mobility transistor (HEMT), a bipolar junction transistor (BJT) or the like, which are semiconductor elements, wherein the current components of the FET, HEMT, and BJT increase in a square fashion or exponential fashion. When the current feature is applied to the peaking amplifier 108, the fundamental current components of the peaking amplifier 108 are the same as the real current feature in FIG. 2a.
FIG. 2b is a graph illustrating fundamental voltage components of the carrier amplifier 106 and peaking amplifier 108 in ideal and real cases.
Referring to FIG. 2b, it can be identified that the fundamental voltage components of the carrier amplifier 106 and peaking amplifier 108 in the real case are the same as in the ideal case. The fundamental voltage components are determined by the fundamental current components, the output matching impedance of the carrier amplifier 106 and the output matching impedance of the peaking amplifier 108, wherein the output matching impedances are as Equation 1 below:
                              Z          C                =                  {                                                                                Z                        T                        2                                                                    Z                        L                                                                                0                      ≤                                              V                        in                                            <                                              0.5                        ·                                                  V                                                      in                            ,                            Max                                                                                Z                        T                        2                                                                                Z                          L                                                ·                                                  [                                                      1                            +                                                                                I                                P                                                                                I                                C                                ′                                                                                ]                                                                                0.5                        ·                                                  V                                                      in                            ,                            Max                                                                                ≤                                              V                        in                                            ≤                                              V                                                  in                          ,                          Max                                                                                Z                P                                      =                          {                                                                                ∞                                                                                0                          ≤                                                      V                            in                                                    <                                                      0.5                            ·                                                          V                                                              in                                ,                                Max                                                                                Z                            L                                                    ·                                                      [                                                          1                              +                                                                                I                                  C                                  ′                                                                                I                                  P                                                                                ]                                                                                0.5                            ·                                                          V                                                              in                                ,                                Max                                                                                ≤                                                      V                            in                                                    ≤                                                      V                                                          in                              ,                              Max                                                                                I                    C                    ′                                                  =                                                                            I                      C                                        ·                                                                  Z                        T                                                                    Z                        L                                                                              -                                                            I                      P                                        .                                                                                (        1        )
In Equation 1, Vin represents an input voltage, ZC represents the output matching impedance of the carrier amplifier 106, ZP represents the output matching impedance of the peaking amplifier 108, ZL represents a matching impedance at a point where the power of the carrier amplifier 106 and the power of the peaking amplifier 108 are combined, and ZT represents the characteristic impedance of the quarter wave transmission line between the carrier amplifier 106 and the peaking amplifier 108 in the combiner 114. Generally, there is a relation of ZL=ZT/2. In addition, IC represents input current of the carrier amplifier 106, and IP represents input current of the peaking amplifier 108.
Referring to Equation 1, it can be identified that, although the fundamental current components of the peaking amplifier 108 in the real case are less than those in the ideal case, the fundamental voltage components in the real case are the same as those in the ideal case, as shown in FIG. 2b, because the amplitudes of the ZC and ZP increase.
FIG. 3 is a graph illustrating the input/output power of the Doherty amplifier 100 in the ideal and real cases.
Referring to FIG. 3, in the ideal case, the Doherty amplifier 100 has a linear relation between the input and output power. However, in the real case, since the fundamental current components of the peaking amplifier 108 decrease as shown in FIG. 2a, the Doherty amplifier 100 has an output power lower that in the ideal case, so that the output power of the Doherty amplifier 100 including the peaking amplifier 108 cannot have a linear relation, and thus has an undesired distortion characteristic.
FIG. 4 is a graph illustrating a memory effect in a real Doherty amplifier.
The memory effect means that the distortion component of an amplifier is influenced by not only the current input signal, but also by previous input signals. The memory effect in an amplifier can be identified through a non-linearity measurement using a two-tone signal. When applying a two-tone signal to an amplifier, and observing the fundamental wave components of the amplifier and a third-order distortion signal with respect to the same output power, it is possible to identify third-order distortion signals having different amplitudes and different phases depending on the bandwidths of two-tone signals. Through such a method, it is possible to measure a memory effect. Generally, a large memory effect occurs in an intermediate output power, while a large memory effect is not observed in a low output power because a distortion component caused by the amplifier itself is small in the low output power. In addition, in a high output power, since the distortion component caused by the power amplifier itself is large, it is impossible to recognize a memory effect.
Referring to FIG. 4, it can be understood that the Doherty amplifier shows a memory effect characteristic different from that of a general amplifier. This is because the Doherty amplifier is configured with a carrier amplifier and a peaking amplifier, and the carrier amplifier and peaking amplifier operate differently from each other and thus show mutually different distortion characteristics.
As described above, not only the Doherty amplifier but also the other power amplifiers generate a non-linear component to distort an output signal, thereby degrading the signal quality. Therefore, in order to satisfy the linearity required in communication systems, it is necessary to develop a separate linearization technique. Among linearization techniques, a digital predistorter processes signals in a digital band, and thus has an excellent economical efficiency and expansion possibility, as compared with the other linearization techniques.
FIG. 5 is a block diagram illustrating the configuration of a Doherty amplification system including a digital predistorter, to which the present invention is applied.
Referring to FIG. 5, a Doherty amplification system includes a Doherty amplifier 100, a digital predistorter 200, a digital predistorter controller 300, a digital-to-analog converter (DAC) 400, an analog-to-digital converter (ADC) 500, an up converter 600, and a down converter 700.
The operation of the Doherty amplification system illustrated in FIG. 5 is as follows.
At an initial operation, the digital predistorter 200 enters an initial mode.
The initial mode means an operation mode for measuring the non-linear characteristic and memory effect of the Doherty amplifier 100. In the initial mode, it is possible to use either a specified signal which makes it possible to identify the characteristics of the Doherty amplifier 100 in the entire operation region thereof, or a signal used in a real communication system during a predetermined time period. Signals used in the initial mode will be inclusively designated as a test signal.
First, a digital signal, which is a test signal, is inputted to the digital predistorter 200 and the digital predistorter controller 300. However, in the initial mode, the signal inputted to the digital predistorter 200 passes through the digital predistorter 200 without any predistortion. The signal which has passed through the digital predistorter 200 is converted into an analog signal through the DAC 400. The analog signal which has passed through the DAC 400 is inputted to the up converter 600 and is thus converted into a high-frequency analog signal. The high-frequency analog signal is inputted to the Doherty amplifier 100 and is amplified therein. The analog signal which has been amplified by the Doherty amplifier 100 is distorted and thus has a non-linear characteristic and a memory effect. Most of the signal which has been amplified by the Doherty amplifier 100 propagates over the air, and a part thereof is converted into a low-frequency signal by the down converter 700. The low-frequency analog signal which has passed through the down converter 700 is converted into a digital signal through the ADC 500. The digital signal which has passed through the ADC 500 is inputted to the digital predistorter controller 300.
The digital predistorter controller 300 compares the test signal with a signal distorted by the Doherty amplifier 100, and perceives a non-linear characteristic and a memory effect which are caused by the Doherty amplifier 100. Using the perceived information, the digital predistorter controller 300 calculates a configuration value of the digital predistorter 200 in order to compensate for the non-linear characteristic and memory effect caused by the Doherty amplifier 100.
For reference, for convenience of description of the present invention, the non-linear characteristic represents an amplitude modulation-to-amplitude modulation (AM-to-AM) characteristic in which the amplitude of an output signal varies non-linearly depending on the amplitude of an input signal, and an amplitude modulation-to-phase modulation (AM-to-PM) characteristic in which the phase of an output signal varies non-linearly depending on the amplitude of an input signal. The digital predistorter 200 is configured with a look-up table (LUT), a polynomial, or the like.
Therefore, the digital predistorter controller 300 provides an LUT configuration value or a coefficient of a polynomial of the digital predistorter 200.
FIG. 6 is a block diagram illustrating the inner configuration of the conventional digital predistorter 200.
Referring to FIG. 6, the conventional digital predistorter is configured with an amplifier compensator 210.
The amplifier compensator 210 compensates for only the non-linear characteristic of the Doherty amplifier 100, or compensates for both non-linear characteristic and memory effect. In addition, a signal which has passed through the amplifier compensator 210 is inputted to the DAC 400 shown in FIG. 5.
The amplifier compensator 210 may be configured with a polynomial, may be configured with an LUT, and may be configured with both polynomial and LUT. In addition, Volterra Series, a reduction model of Volterra Series, a Wiener model, an expansion model of the Wiener model, a Hammerstein model, an expansion model of the Hammerstein, etc. may be applied to the amplifier compensator 210.
Generally, if an amplifier has a plurality of distortion generating sources to be linearized, and the respective distortion generating sources generate the same non-linear characteristic and memory effect, the non-linear characteristic and memory effect can be sufficiently compensated through the amplifier compensator 210 shown in FIG. 6.
However, in the case of an amplifier, such as a Doherty amplifier, which includes distortion generating sources generating mutually different non-linear characteristics and memory effects, there is a limitation in a degree of linearization improvement when linearization according to the conventional linearization manner is performed as in the amplifier compensator 210.

Power amplifier linearization method and apparatus


A process for mounting a semiconductor device and a mounting apparatus whereby electrodes of a fine-pitch semiconductor device and a wiring board can be surely connected to each other. A process for mounting a semiconductor device by electrically connecting an electrode of the semiconductor device 4 to an electrode of a wiring board by using an anisotropic conductive adhesive film having conductive particles dispersed in an insulating adhesive, which process comprising: the step of tentatively thermocompression bonding a conductive particle-free filmy insulating adhesive onto a wiring board 22 to thereby form an insulating adhesive layer 23; the step of forming a concave 23a of a predetermined size in said insulating adhesive layer 23 by using a compression bonding head 2 provided with a pressing chip 21 at a predetermined position; the step of putting in the concave 23a of said insulating adhesive layer 23 an anisotropic conductive adhesive film of a predetermined size; and the step of mounting a predetermined IC chip 11 at a predetermined position of the compression bonding head 2 and then positioning said IC chip 11 and thermocompression bonding to said wiring board 22.

This invention relates to a process for mounting a semiconductor device on a wiring board. More particularly, it relates to a process for mounting a semiconductor device whereby a bare chip is directly mounted on a substrate by using an anisotropic conductive adhesive film.
To mount a bare chip directly on a wiring board such as a print wiring board, there has been known a process with the use of an anisotropic conductive adhesive film having conductive particles dispersed in a binder.
In this process for mounting a bare chip on a wiring board by using an anisotropic conductive adhesive film, it has been a practice to form protruding bump electrodes in the Semiconductor device side or in the wiring board side.
This is because, in case of bumpless connection without forming any bump, conductive particles sometimes come into contact with the scribe line at the edge of the Semiconductor device thereby causing a short-circuit.
In recent years, there has been required fine pitching between the electrodes of a wiring board of the above type. To satisfy this requirement for fine pitching, the connection electrode area between the wiring board and the Semiconductor device should be reduced.
To achieve fine pitching in practice in the conventional mounting process, it is necessary to surely provide conductive particles between the electrodes. To ensure the existence of the conductive particles, it is suggested, for example, that the conductive particle diameter is further reduced so that a larger number of conductive particles can be contained in the binder of the anisotropic conductive adhesive film.
However, an increase in the content of the conductive particles in the binder is accompanied by an increase in the viscosity of the anisotropic conductive adhesive film and, in its turn, a decrease in the fluidity of the conductive particles in the binder. As a result, it becomes difficult to uniformly disperse the conductive particles in the binder. At the same time, there arises another problem that the insulation properties of the anisotropic conductive adhesive film are deteriorated.
When the conductive particle diameter is reduced, on the other hand, the absolute deformation caused by crushed conductive particles in the step of the thermocompression bonding becomes smaller and thus the irregularity in the bump electrode height cannot be compensated thereby. In such a case, it is feared that some of the electrodes of the wiring board and the Semiconductor device undergo connection failure and thus the conduction reliability is lowered.
As discussed above, fine pitching cannot be sufficiently established in practice in the conventional mounting processes.
To solve these problems, there is pointed out a process which comprises tentatively thermocompression bonding a conductive particle-free insulating adhesive film to a wiring board, then forming a concave in the insulating adhesive film by using, for example, a press head almost as large as the outer size of an Semiconductor device, and then putting an anisotropic conductive adhesive film in the concave and thermocompression bonding the same.
By using this mounting process, conductive particles can be densely provided between the Semiconductor device and the wiring board and thus connection electrodes can be electrically connected to each other without fail while maintaining the content and diameter of the conductive particles at the levels comparable to the existing cases.
In this case, however, it is necessary to provide a press head for forming the concave in addition to a compression bonding head, which makes the constitution of the apparatus complicated.
In case of mounting Semiconductor devices of various sizes on a wiring board as in a multi chip module (MCM), it is necessary to prepare plural press heads corresponding to the outer shape of each Semiconductor device, which makes the apparatus constitution further complicated. In this case, there arise another problems that an apparatus of a larger size is needed and a longer time is consumed in replacing the press heads during the mounting operation.
An object of the present invention, which has been completed to solve these problems encountering in the conventional art, is to provide a process for mounting a semiconductor device and a mounting apparatus whereby electrodes of a fine-pitch semiconductor device and a wiring board can be surely connected to each other.
Another object of the present invention is to provide a process for mounting a semiconductor device and a mounting apparatus whereby the occurrence of a short-circuit between the semiconductor device and the wiring board can be prevented in a bumpless IC chip.
Another object of the present invention is to provide a process for mounting a semiconductor device and a mounting apparatus whereby semiconductor devices of various types can be easily and quickly mounted on a wiring board.
According to the present invention, which has been made to achieve the above-mentioned objects, provides a process for mounting a semiconductor device by electrically connecting an electrode of the semiconductor device to an electrode of a wiring board by using an anisotropic conductive adhesive film having conductive particles dispersed in an insulating adhesive, which process involves: the step of tentatively thermocompression bonding a conductive particle-free filmy insulating adhesive onto a wiring board to thereby form an insulating adhesive layer; the step of forming a concave of a predetermined size in the insulating adhesive layer by using a compression bonding head provided with a pressing chip at a predetermined position; the step of putting in the concave of the insulating adhesive layer an anisotropic conductive adhesive film of a predetermined size; and the step of mounting a predetermined semiconductor device at a predetermined position of the compression bonding head and then positioning the semiconductor device and thermocompression bonding to the wiring board.
In thermocompression bonding with the use of an anisotropic conductive adhesive film, it is generally observed that conductive particles tend to run off together with the insulating adhesive toward the edge of the Semiconductor device. In the case of the present invention, however, the conductive particles tending to run off along the Semiconductor device edge are blocked by the brim of the concave formed in the insulating adhesive layer. Thus, the conductive particles scarcely flow in the direction of the Semiconductor device edge.
According to the present invention, therefore, the conductive particles can be densely held between the semiconductor device and the wiring board. Thus, plural conductive particles can be provided on each electrode at an extremely high probability and connection electrodes can be surely electrically connected to each other without fail even in a case where connection electrodes are located at very small intervals.
According to the present invention, moreover, no conductive particle reaches the scribe line of the Semiconductor device edge and, therefore, there arises no short-circuit between the scribe line and the wiring board.
According to the present invention, furthermore, a concave is formed in the insulating adhesive layer by using a press head provided with a pressing chip of a predetermined size. Accordingly, it is unnecessary to use many press heads respectively depending on the outer shape of Semiconductor devices, even in case where Semiconductor devices of various types are to be mounted. Thus, the apparatus constitution can be simplified.
In this case, it is also effective in the present invention that the press head serves both as the compression bonding head in tentatively thermocompression bonding the insulating adhesive, forming the concave and thermocompression bonding the semiconductor device with anisotropic conductive adhesive film.
According to the present invention, the press head for forming the concave can be omitted, which contributes to the further simplification and down-sizing of the apparatus constitution.
On the other hand, the preset invention relates to an apparatus for mounting a semiconductor device on a wiring board provided with a compression bonding head for electrically connecting an electrode of the semiconductor device to an electrode of the wiring board, characterized by having a press head provided with holding means whereby a pressing chip for forming a concave of a predetermined size in the insulating adhesive layer in the wiring board side and the semiconductor device are held respectively.
According to the present invention, the above-described process of the present invention can be easily carried out.
In this case, the apparatus constitution of the present invention can be further simplified and down-sized by constructing the compression bonding head as serving both as the press head.
Moreover, the apparatus constitution of the present invention can be further simplified and down-sized by constructing the holding means as holding respectively the pressing chip and the semiconductor device in a removal manner.
As the holding means in this case, the apparatus of the present invention may be constructed as sucking the air via a suction hole formed in the compression bonding part of the compression bonding head, for example.
Owing to the above-described constitution, the pressing chip can be easily and quickly attached/removed by switching the air suction. In addition, it also becomes possible to mount members of various shapes onto the compression bonding head.
It is also effective that, in the present, the face of the pressing chip in contact with the insulating adhesive layer is releasable from the insulating adhesive.
According to the present invention, the releasable face of pressing chip prevent stripping the insulating adhesive layer from the wiring board caused by adhering to the pressing chip.

Process for mounting semiconductor device and mounting apparatus