text:
|Numéro de publication
|Type de publication
|Numéro de demande
|Date de publication
|7 sept. 2010
|Date de dépôt
|26 avr. 2006
|Date de priorité
|16 aoűt 2004
|État de paiement des frais
|Autre référence de publication
|Numéro de publication
|Alan G. Wood, Kyle K. Kirby, Warren M. Farnworth, Salman Akram
|Cessionnaire d'origine
|Micron Technology, Inc.
|Exporter la citation
|BiBTeX, EndNote, RefMan
|Citations de brevets (34), Citations hors brevets (9), Référencé par (16), Classifications (10), Événements juridiques (4)
|Liens externes: USPTO, Cession USPTO, Espacenet
This application is a divisional of application Ser. No. 10/919,604, filed Aug. 16, 2004, now U.S. Pat. No. 7,645,635, issued Jan. 12, 2010.
1. Field of the Invention
The present invention relates to semiconductor devices, intermediate structures in the fabrication thereof and components and fabrication methods therefor. More particularly, the invention pertains to methods for fabricating packaged radiation sensing or emitting devices, cameras including same, and the like, intermediate structures at the wafer or bulk substrate level in the fabrication, frame structures for use in fabrication of the packages and methods of package fabrication.
2. State of the Art
Semiconductor die-based image sensors are well known to those having skill in the electronics/photonics art and, in a miniaturized configuration, are useful for capturing electromagnetic radiation (e.g., visual, IR or UV) information in digital cameras, personal digital assistants (PDA), internet appliances, cell phones, test equipment, and the like, for viewing, further processing or both. For commercial use in the aforementioned extremely competitive markets, image sensor packages must be very small. For some applications, a package of a size on the order of the semiconductor die or chip itself, or a so-called "chip scale" package, is desirable if not a requirement. In addition, the market demands that image sensors provide high quality images, be inexpensive and exhibit low failure rates while accommodating the rough treatment typical of general use, particularly in cameras and other hand-held devices. Unfortunately, the semiconductor industry has yet to achieve these goals in full. Currently available image sensor packages are relatively expensive to manufacture, are significantly larger than the image sensor semiconductor die, and exhibit a failure rate which is unacceptably high, limiting further market penetration through cost reduction.
While traditional semiconductor devices, such as processors and memory, are conventionally packaged in an opaque protective material, image sensors typically comprise a light wavelength frequency radiation-sensitive integrated circuit (also termed an "optically sensitive" circuit) fabricated on the active surface of a semiconductor die covered by a planar, optically transmissive element, wherein the image sensor is positioned to receive light radiation from an external source. Thus, one surface of the image sensor package conventionally comprises a transparent portion, which usually is a lid of light-transmitting glass or plastic. For photographic purposes, the chip is positioned to receive focused radiation from an optical lens associated therewith. The semiconductor circuit is typically one of a charge coupling device (CCD) or a complementary metal oxide semiconductor (CMOS), the latter exhibiting distinct advantages over the former and being the currently preferred sensor used in the image-sensing art.
Various factors are considered in the design and manufacture of image sensor packages. For example, the extent that the packages can be at least partially, if not completely, fabricated at the wafer level is a substantial cost consideration. Furthermore, if the package design or fabrication approach, even if conducted at the wafer level, necessitates that all of the image sensor semiconductor dice located thereon be packaged regardless of whether a significant number of the dice are defective, a substantial waste of materials results. Also, the package lids (e.g., windows) as well as one or more associated lenses (when included in an image sensor package) must be carefully positioned relative to the optically sensitive circuit on each of the dice to achieve uniformly high quality imaging while precluding entry of moisture and other contaminants into the chamber defined between the optically sensitive circuitry and the package lid. Other considerations include those which relate to die packaging in general, including the need for moisture resistance in the package as a whole and adequate physical protection of the integrated circuitry, as well as elimination of resin flash and outgassing problems. Further, the packaging must provide adequately robust connectors for effecting uniformly high quality electrical connections to higher-level packaging.
A conventional method for packaging a semiconductor element is depicted in U.S. Pat. No. 6,262,479 to Li-Kun Chou. As shown therein, a die "seat" is first mounted on a substrate, together with metal traces extending to the edge of the substrate, and over the edge surfaces. A thin liner of insulative material is then applied about the periphery of the upper surface of the substrate. A peripheral wall of molding compound is then applied over the liner. A semiconductor, such as an image sensor die, is then fixed to the substrate, and the bond pads thereof are wire-bonded to the metal conductors on the substrate. A cover glass is then adhesively attached over the peripheral wall to enclose the die.
As shown in U.S. Pat. No. 6,353,257 to Huang, an image sensor chip may be attached to a conductive lead frame, with its bond pads wire-bonded to the lead frame. The lead frame is then placed in a mold where a body is formed about the lead frame with a shouldered upper opening over the chip. A cover glass is then adhesively attached to the upper rim of the molded body.
In U.S. Pat. No. 6,727,487 to Yamaguchi et al., a CMOS image sensor is described wherein a sensor chip with peripheral bond pads is attached to a printed circuit board, and peripheral bond pads are wire-bonded to circuit board metallization. An array of flat color filters and microlens is placed over the active sensor area and nearly extends to opposing rows of peripheral bond pads. A lens mounted in a four-legged holder may then be placed directly on the microlens layer to maintain a uniform focusing distance between the active area and lens. Packaging of the device is not in view.
U.S. Pat. No. 6,713,857 to Tsai describes a stacked two-chip package in which a substrate is first formed with metal leads on each side, and has an opening therein. Adhesive tape is attached to the substrate to cover the opening, and a first chip is attached to the tape within the opening. A second chip, such as an image sensor chip, is then attached to the opposite side of the adhesive tape. The bond pads of each chip are wire-bonded to metallization on the respective surfaces of the substrate. Encapsulant is formed about the first chip and its wire bonds. An encapsulant is formed about the edges of the substrate, forming a wall enclosing the second chip. A cover is then attached to the wall, and may be optically conductive.
In U.S. Pat. No. 6,730,536 to Glenn et al., a method for forming an image sensor package is disclosed in which a central through-aperture is formed in a substrate. Electrically conductive traces are formed on the lower surface of the substrate, and include tabs projecting inwardly under the central aperture. An image sensor stall is flip-chip mounted to the tabs by bumps. A window is then mounted over the optically active portion of the image sensor chip. Holes through the substrate intersect the lower surface traces, and are filled with solder which projects upwardly from the substrate as solder balls.
In U.S. Pat. No. 6,649,991 to Chen et al., a method is disclosed for making an image sensor package with a vision chip mounted on a multi-layer resin-mask organic substrate. The chip's peripheral bond pads are wire-bonded to conductors on the substrate. A transparent window is mounted over a large portion of the vision chip, including the optically active area. The bond wires and adjacent areas are encapsulated in a wire shielding block, up to the window edges. A liquid encapsulant is then applied to cover the block and edges of the window to seal it in place.
In U.S. Pat. No. 6,503,780 to Glenn et al., a wafer scale image sensor package fabrication method is described, in which an image sensor is formed by placing a cover glass in a hardenable layer atop the active sensing area on the chip. The package is then molded about the die, sensing area, and cover glass.
Despite advances in the state of the art of image sensor packaging, there remains a need for a high-yield packaging technique which may be effected at a wafer level and provides robust, high quality image sensor packages.
The present invention comprises, in a number of embodiments, methods for packaging semiconductor dice having radiation-responsive or emissive, or other optically active properties in the integrated circuitry thereof requiring a disposition thereover of a cover transparent or otherwise sufficiently transmissive to radiation of a particular wavelength or range of wavelengths. For purposes of convenience, and without limitation of the present invention, such semiconductor dice may be referred to herein as "image sensor dice." The invention also includes, in a number of embodiments, packages including image sensor dice and, for purposes of convenience and without limitation of the present invention, semiconductor packages including image sensor dice may be referred to herein as "image sensor packages."
In one embodiment of this invention, a frame structure is preformed with a plurality of unsingulated frames, each unsingulated frame including an aperture therethrough including a plurality of steps and into each of which a singulated image sensor die is inserted.
In another embodiment, the frame structure is superimposed on, and attached to, an unsingulated wafer of image sensor dice, wherein each image sensor die location occupies an aperture of a frame, to form an intermediate structure which may be singulated into individual frames, each with an image sensor die carried thereby. In this embodiment, the frames may optionally include protrusions sized and configured to be received in kerfs cut into the active surface of the wafer. However, the frame structure may also be formed without the aforementioned protrusions, so as to reside on and be adhered to the active surface of an unkerfed wafer.
Each frame aperture may also be configured to receive and respectively retain in desired mutual relationship, a window or cover glass, optical lens(es), filters, and other components such as electrical conductors, or combinations of the foregoing, as dictated by the particular, intended use for the image sensor die. However, rather than inserting discrete, individual components into each frame, a window or cover glass, lenses, filters and other components may be fabricated in the form of bulk sheets or other bulk substrates including a plurality of the component in question corresponding to the number of frames in a frame structure, laid over and adhered to an upper surface of the frame structure and singulated in conjunction with singulation of the frames and dice. A spacer grid may be used between bulk substrates to provide vertical separation between components.
In each of the foregoing embodiments, the frame structure (as well as the underlying wafer, as applicable) is cut along the horizontal, X and Y axes and transverse to the plane of the frame structure between adjacent frames to singulate the individual image sensor packages. The present invention will be described with respect to the fabrication of image sensor packages, in which radiation is detected by an optically active region (image array) on the active surface of a semiconductor die, but is not so limited. The present invention may be applied to packaging of any type of semiconductor dice, as desired, and the present invention encompasses the packaging of same.
In accordance with the present invention, a frame structure defining a plurality of adjacent frame locations, each frame location including an aperture therethrough and separated by shared frame protrusions, is formed by any suitable method. For example, the frame structure may be formed of a polymer by injection molding, or from a silicon wafer by laser cutting or etching. The frame structure may also be formed of a ceramic by pressing and sintering, or a metal or alloy by stamping, pressing, casting or machining. Polymer frame structures may optionally be constructed using stereolithographic techniques employing a UV-sensitive photopolymer, or other processes as known in the art. For most applications, molded polymeric frame structures may be preferred because of cost considerations. The frame structure is configured so that each aperture is configured for sealed mounting of a completed, bare image sensor die in combination with an overlying window, such as a cover glass and, optionally, a light filter as well as other desired components disposed between the window and the active surface of the image sensor die. As previously mentioned, an aperture may be further configured to retain an optical lens (focusable, autofocusing or nonfocusing). The frame structure may also be configured to provide substantial or complete encapsulation of the lateral sides of the image sensor die extending at least below the integrated circuitry on the active surface, providing coverage of at least a portion of the lateral sides upon singulation of the individual image sensor packages.
The frames of the frame structure may each be configured to include electrical conductors in the form of conductive traces having contacts accessible from the aperture interior and extending to locations on the frame exterior, which may be exposed either before or after singulation of the frame structure for application of external electrical connections and the like. The use of flex circuit external connection structures applied to the frame structure at a wafer level or to individual singulated frames, each carrying a semiconductor die, is encompassed by the present invention. Thus, the image sensor package configuration may be that of a ball-grid array (BGA), a leadless chip carrier (LCC), a quad flat pack (QFP), quad flat no-lead (QFN) or other package types known in the art. The back side of the image sensor die may be encapsulated, which may be effected at the wafer level.
As noted above, the frame structure may be configured to be aligned with, and joined to, a wafer bearing a plurality of image sensor dice, wherein singulation of the combined frame structure and wafer results in a plurality of image sensor packages. Thus, the frame structure may be generally circular, with frames having apertures disposed in matching arrangement to a pattern of image sensor dice of the wafer. Where a prior test, such as a probe test or wafer level burn-in, of the image sensor dice on the wafer indicates that a particular image sensor is defective, installation of a cover glass, filters, lens, etc., in the aperture of the corresponding frame location is omitted, saving production costs. At the present state of the image sensor die fabrication art, where the percentage of good dice may be relatively low, the attendant savings in time and materials using this approach can be substantial. The combined frame structure and wafer with all image sensor package components installed is then singulated into image sensor packages, and frames with defective image sensor dice discarded.
In another embodiment, the image sensor dice may be first singulated from a wafer and then individually placed and bonded within frames of a frame structure. In this embodiment, the frame structure may be formed in a generally rectangular shape. Image sensor dice singulated from a wafer and, optionally, established as known good die (KGD) through burn-in testing are picked and inserted into each aperture of a frame of the frame structure, together with optical members and other desired components. The back side of the image sensor dice may be encapsulated, followed by singulation of the filled frame structure into a plurality of individual image sensor packages. In this embodiment, an individual semiconductor die may be inserted into an aperture from above or below the frame structure, the frames being respectively configured to accommodate one or the other approach to assembly.
The methods of the invention offer substantial advantages over conventional packaging techniques employed for optically active semiconductor devices. First, very small, substantially chip scale, packages may be formed with a minimum number of fabrication acts. The requirement for a separate carrier substrate to support the image sensor die, cover glass and other components is eliminated. The use of one or more precisely placed steps in the aperture walls enables precise positioning of the image sensor die as well as the cover glass and, if employed, other elements, such as filters and lenses, to ensure accurate relative positioning of each component relative to the others and to the radiation sensitive image array on the active surface of the image sensor die. If desired, the package may be formed so that the cover glass abuts the optically active region of the die. Use of a frame structure carrying a large plurality of frames and singulation of the frames with individual image sensor dice installed substantially increases production throughput, and completing assembly of image sensor packages using only known good image sensor dice, either presingulated or identified on a wafer, further saves assembly time as well as materials in the form of cover glasses, filters and lenses.
Other features and advantages of the present invention will become apparent to those of skill in the art through consideration of the ensuing description, the accompanying drawings, and the appended claims.
In the drawings, which depict exemplary embodiments of various features of the present invention, and in which various elements are not necessarily to scale:
Referring in general to the accompanying drawings, various aspects of the present invention are illustrated to show exemplary semiconductor package structures and methods for assembly of such package structures. Common elements of the illustrated embodiments are designated with like reference numerals. It should be understood that the figures presented are not meant to be illustrative of actual views of any particular portion of a particular semiconductor package structure, but are merely idealized schematic representations which are employed to more clearly and fully depict the invention.
In one embodiment of the present invention, illustrated in
It is noted that in this embodiment, a singulated semiconductor die 20 which has preferably been established as KGD is mounted in an aperture 40 of each frame 30 of the frame structure 50 using, for example, a pick-and-place machine (not shown), as is well known in the art. Each semiconductor die 20 may be adhesively attached and sealed to a surface 44 of an inverted step 42 in an aperture 40 as well as to other surfaces 44 within aperture 40. Inverted step 42 is formed about all four sides of aperture 40 to provide support and sealing completely around periphery of the active surface 11 of semiconductor die 20. As shown in this embodiment, without limitation thereby, semiconductor die 20 may have rows of bond pads 26 along one, two, three, or four peripheral edges of the active surface 11. The methods of the invention are also useful for packaging other devices, irrespective of the bond pad configuration.
The terms "upper," "lower," "top" and "bottom" are used for convenience only in this description of the invention in conjunction with the orientations of features depicted in the drawing figures. However, these terms are used generally to denote opposing directions and positions, and not in reference to gravity. For example, semiconductor package 10 may, in practice, be oriented in any suitable direction during fabrication or use.
An exemplary frame structure 50 of the invention as shown in
Window 12 (
The embodiment of
As shown in
The frame structure 50 may be formed by various methods, using various materials. For example, frame structure 50 may be formed from a semiconductive material, such as silicon. In this case, the apertures 40 may be formed by anisotropic etching with a dry or wet etchant, or alternatively by laser cutting, such methods being well known in the art. Frame structure 50 may also be formed of a ceramic by pressing and sintering, or by a metal or alloy by stamping, pressing, casting or machining, or a combination thereof. Further, frame structure 50 may be formed using known stereolithographic techniques from a UV-sensitive photopolymer.
The apertures 40 are formed to have a cross-sectional shape generally conforming to that of the semiconductor dice 20. For example, the die-retaining lower portion of the aperture 40 is intended to closely retain the die therein. However, the upper portions of apertures 40 including steps 42A and 42B, etc., may have a square cross-sectional shape, or other shape conforming, for example, to a shape of optically active region 14. Steps 42A and 42B may even have a circular shape, to be used with circular window(s) 12, filters 12A and lens 70.
For most applications, the frame structure 50 may be formed of a polymeric material, particularly in view of reduced cost as compared to that of semiconductor materials and processes used therefore, as well as of ceramics or metals. For example, the frame structure 50 may be formed of a polymeric material by injection molding or transfer molding. Methods and apparatus for injection molding such frame structures 50 are conventional and, thus, will not be further described. Polymeric materials such as, for example, liquid crystal polymers (LCP) obtainable from Quantum Leap Packaging Inc. of Wilmington, Mass. may be particularly suitable to fabricate frame structures 50 using injection molding. Rod-type polymers, such as are obtainable from HD Microsystems of Parlin, N.J., may also be utilized to fabricate frame structure 50. Other moldable polymers may, of course, be used. It may be preferred that the coefficient of thermal expansion (CTE) of the resulting frame structure 50 reasonably matches that of the semiconductor material from which semiconductor dice 20 are fabricated. Thus, thermal mismatch problems at temperatures and over temperature ranges encountered in fabrication, test and use of the semiconductor packages may be avoided.
The frame structure 50 may also be formed from photosensitive polymeric materials solidifiable by radiation, by using a stereolithographic process. In a general method of stereolithography, a precisely controlled radiation beam of UV wavelength radiation is directed upon the surface of a liquid polymer and used to solidify a thin layer of the photopolymer. With controlled radiation application following repeated disposition of liquid photopolymer level over existing layers, a plurality of at least partially superimposed solid polymer layers is formed in a precise pattern to create the desired solid structure. Methods, apparatus, and suitable photopolymers for automated stereolithographic fabrication of structures are known in the art, and will not be further described herein.
In the present invention, various components are attached to the frame structure 50. Where the frame structure 50 is formed of a semiconductor material such as silicon, the semiconductor die 20 may be attached to the frames 30 of frame structure 50 with a liquid or film adhesive(s) 16, 17 such as epoxy materials curable by exposure to ultraviolet (UV) radiation or by a thermal cure. The semiconductor material surfaces to be adhesively joined may be preoxidized where such action results in a bond of higher strength.
Attachment of a semiconductor die or glass to a semiconductor frame structure 50 may be also be accomplished utilizing anodic bonding and/or fusion bonding, as described in A. Berthold, et al., Low Temperature Wafer-To-Wafer Bonding for MEMS Applications, Proc. RISC/IEEE, 31-33, 1998 (ISBN 90-73461-15-4), the disclosure of which is incorporated by reference herein. Anodic bonding may be used to join silicon-to-silicon, silicon-to-glass and glass-to-glass, wherein a high voltage (800V) electric field induces adhesion at about 300° C. Alternatively, a lower temperature fusion bonding method may be used, including a first surface etching step, rinse, nitric acid treatment, rinse, prebonding of the components under force, and annealing at a somewhat elevated (120° C.) but generally lower temperature than is employed for anodic bonding.
Another approach suitable for bonding components of glass and semiconductor materials and particularly oxidized semiconductor materials is described in X. Ma, et al., Low Temperature Bonding for Wafer Scale Packaging and Assembly of Micromachined Sensors, Department of Electrical & Computer Engineering University of California, Davis, Calif. 95616, Final Report 1998-99 for MICRO Project 98-144, Industrial Sponsor(s): Kumetrix, Inc., the disclosure of which is incorporated by reference herein. The disclosed technique employs photopatternable polydimethylsiloxane (PDMS) using exposure to 420 nm UV with subsequent exposure to an O2 plasma to enable immediate, room temperature contact bonding.
For an exemplary semiconductor package 10 as shown in
A plurality of semiconductor dice 20, each having an optically active region 14 or the like on an active surface 11, are fabricated on a semiconductor wafer 60 (as seen in
A frame structure 50 is formed to include a plurality of frames 30, each having an aperture 40 passing between upper and lower surfaces 18, 19 of the frame structure 50, and configured with peripheral lower inverted step or ledge 42 for retaining a semiconductor die 20 by its active surface 11, an upper step 42A for retaining an upper window 12, and other steps 42B, etc., as desired to retain other optical components (including one or more lenses), provide support for electrical conductors, or for other purposes as required for the particular application.
A known good semiconductor die 20 is adhesively bonded to inverted step 42 in each aperture 40 to place the bond pads 26 of each semiconductor die 20 in communication with conductors 28. In the embodiment of
Other components may be placed on additional inverted steps 42 and bonded thereto, as depicted in
A pre-cut window 12 is then placed in aperture 40 on upper step 42A and bonded thereto using an adhesive material or other suitable method. Depending on the intended end use for semiconductor package 10, where a lens is to be mounted within the aperture 40, it may sometimes be advantageous to eliminate window 12 from the package. This is particularly true where one or more filters are used.
A layer of dielectric encapsulant 58 may be disposed over the back side 24 of each semiconductor die 20 and, depending on the encapsulation method employed and the relative dimensions of semiconductor die 20 and surrounding frame protrusions 34, over adjacent areas on the lower surface 19 of frame structure 50.
The individual semiconductor packages 10 are singulated from the frame structure 50 by severing the frame structure 50 between adjacent frames 30 surrounding apertures 40 in the X and Y axes.
External electrical connectors 36 or external connection structure 100, 200 may then be attached to or formed on the semiconductor package 10 (see
Another exemplary embodiment of a semiconductor package 10 formed in accordance with the invention as an image sensor is shown in
Alternatively, as shown in
The lens 70 installed in a frame 30 or in frame structure 50 may be any miniature lens of a focusable, auto-focusing, or non-focusing type which may be fitted into the frame structure 50. The program for auto-focusing may be included in a die circuit, if desired. For example, a miniature lens 70 of one or more elements focusable by a Helimorth actuator is offered by 1 Ltd. Another lens 70 which may be used is a microfluidic FluidFocus lens of Koninklijke Philips Electronics, N.V. This lens is formed of two immiscible liquids of differing refractive index. The liquids are in a tube configured for applying a variable voltage at the interface, changing the shape of the meniscus to change the focal length.
Another embodiment of a semiconductor package 10 comprising a singulated camera is illustrated in
As shown, the frame structure 50 is generally formed to have the same shape and size as the wafer 60, and has apertures 40 formed therein of a size and shape and at locations corresponding to the individual semiconductor dice 20 of the wafer 60. The frame structure 50 may be circular as depicted in
As depicted in the example of
Other methods may be used to join the wafer 60 and frame structure 50. For example, anodic or fusion type bonding may be used, or combinations of tape and epoxy adhesives may be used. As already described, a variety of adhesion methods may be used to install the window and other optical components on an inverted step 42, depending on the construction materials of the window and frame structure 50.
Final singulation of the wafer-and-frame structure combination along cut lines 52, 54 (see
The frame 30 used to fabricate semiconductor package 10 of
In another embodiment of the present invention, illustrated in
A singulated semiconductor die 20 which has preferably been established as KGD is mounted in an aperture 40 of each frame of the frame structure 50 using, for example, a pick-and-place machine (not shown), as is well known in the art. Each semiconductor die 20 may be adhesively attached and sealed to the surface of a upper step 42A in an aperture 40. Upper step 42A is formed about all four sides of aperture 40 to provide support and sealing completely around periphery of the back side 24 of semiconductor die 20. Semiconductor die 20 may have rows of bond pads 26 along one, two, three, or four peripheral edges of the active surface 11. The methods of the invention are also useful for packaging other devices, irrespective of the bond pad configuration thereof.
As before, a frame structure 50 comprises a plurality of frames 30, each frame with an aperture 40 formed therethrough. The aperture 40 is shown as having a generally rectangular, e.g., square, cross-section throughout, with steps (shelves) 42A and 42B extending about each side, as depicted in
Window 12, which may also be termed a cover glass, is shown as being generally rectangular, but (as noted above) is not limited to such shape and other polygonal shapes, as well as circular and nonplanar window shapes, may be employed. Window 12 may be formed of glass or other transparent or radiation-transmissive material such as a polymer. It may be formed of several layers and may be configured to selectively transmit radiation in a particular wavelength region, e.g., UV, infra-red, etc. Window 12 is preferably of high optical quality to provide uniform transmission therethrough of radiation over the entire usable field of the optically active region 14. Window 12 is mounted and sealed to intermediate step 42B, which lies above and laterally outward of upper step 42A carrying semiconductor die 20. If another component, such as, for example, a filter, is to be mounted between semiconductor die 20 and window 12, another, intervening step may, of course, be disposed between steps 42A and 42B.
It is contemplated that the present invention may employ, in a number of embodiments, connection structures similar to those disclosed and claimed in U.S. Pat. No. 6,368,896, assigned to the assignee of the present invention and the disclosure of which is incorporated herein by reference. Referring now to
Another external connection structure 200 is depicted in
As is evident from the descriptions, the methods of the present invention enable the construction of semiconductor packages 10 with windows 12 for passage of radiation to or from an optically active region 14 on a semiconductor die 20. The methods use a minimal number of construction acts, conserve materials, and enable production of devices having precise placement of optical components including lenses.
While the exemplary frame structures 50 of the above-described embodiments have been depicted as configured for receiving individual windows 12 seated within steps 42A, it is also possible that a single piece of window material may be attached over the entirety of a frame structure 50.
Although the foregoing description contains many specific structures and methods, these should not be construed as limiting the scope of the present invention, but merely as providing illustrations of some of the exemplary embodiments. Similarly, other embodiments of the invention may be devised which do not depart from the spirit or scope of the present invention. Moreover, features from different embodiments of the invention may be employed in combination. The scope of the invention is, therefore, indicated and limited only by the appended claims and their legal equivalents, rather than by the foregoing description. All additions, deletions, and modifications to the invention, as disclosed herein, which fall within the meaning and scope of the claims are to be embraced thereby.
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|"VisionPack(TM) LLC," Amkor Technology, , 2001, 2 pages.
|"VisionPack™ LLC," Amkor Technology, <www.amkor.com>, 2001, 2 pages.
|Berthold et al., "Low temperature wafer-to-wafer bonding for MEMS applications," STW, 1998 10 26-01:007, p. 31-33.
|Ma et al., "Low Temperature Bonding for Wafer Scale Packaging and Assembly of Micromachined Sensors," Dept. of Electrical & Computer Engineering, Univ. of CA, Final Report 1998-99 for Micro Project 98-144 (2 pages).
|Brevet citant
|Date de dépôt
|Date de publication
|19 janv. 2007
|3 mai 2011
|Tessera Technologies Ireland Limited
|Wafer level chip packaging
|3 juil. 2008
|8 nov. 2011
|Samsung Electro-Mechanics Co., Ltd.
|Camera module package
|10 janv. 2011
|7 mai 2013
|Apple Inc.
|Systems and methods for coupling a cover to an enclosure
|5 janv. 2007
|10 déc. 2013
|Invensas Corp.
|Microelectronic assembly with multi-layer support structure
|29 sept. 2008
|11 févr. 2014
|Lg Innotek Co., Ltd.
|Camera module comprising a lens assembly and a sensor assembly and manufacturing method thereof
|13 janv. 2010
|29 avr. 2014
|Jeng-Jye Shau
|Area reduction for surface mount package chips
|4 déc. 2013
|17 janv. 2017
|Invensas Corporation
|Microelectronic assembly with multi-layer support structure
|12 aoűt 2014
|13 juin 2017
|Sony Corporation
|Imaging apparatus and electronic apparatus
|5 janv. 2007
|10 juil. 2008
|Tessera, Inc.
|Microelectronic assembly with multi-layer support structure
|3 juil. 2008
|8 janv. 2009
|Samsung Electro-Mechanics Co., Ltd.
|Camera module package
|29 sept. 2008
|15 juil. 2010
|Chung Sang Ryu
|Camera module
|13 janv. 2010
|21 avr. 2011
|Uniram Technology Inc.
|Area reduction for surface mount package chips
|10 janv. 2011
|12 juil. 2012
|Apple Inc.
|Systems and methods for coupling a cover to an enclosure
|6 mai 2013
|6 nov. 2014
|Omnivision Technologies, Inc.
|Integrated circuit stack with low profile contacts
|12 aoűt 2014
|19 févr. 2015
|Sony Corporation
|Imaging apparatus and electronic apparatus
|18 mai 2017
|7 sept. 2017
|Sony Corporation
|Imaging apparatus and electronic apparatus
|Classification aux États-Unis
|Classification internationale
|Classification coopérative
|Classification européenne
|6 févr. 2014
|Fee payment
Year of fee payment: 4
|12 mai 2016
Owner name: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGEN
Free format text: SECURITY INTEREST;ASSIGNOR:MICRON TECHNOLOGY, INC.;REEL/FRAME:038669/0001
Effective date: 20160426
|2 juin 2016
Owner name: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL
Free format text: PATENT SECURITY AGREEMENT;ASSIGNOR:MICRON TECHNOLOGY, INC.;REEL/FRAME:038954/0001
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Owner name: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGEN
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Effective date: 20160426


text:
Ce jeu est un DLC et nécessite la version complète de Tanki X
Liste des prix Tanki X Mercenary Flamethrower - PC, WindowsVersion téléchargement uniquement - Edition Standard
Trailers, screenshots & informations de Tanki X Mercenary Flamethrower PC
A propos de ce jeu :Studio : AlternativaPlatform Editeur : AlternativaPlatform Site Web : http://tankix.com
Note! You can purchase only 1 Pack per 1 Tanki X account. Refund is not available if you purchase 2 different packs, which include the same weapons, hulls, and skins or you already have the items from the pack! The items will be granted to the account that you use to log into the game through Steam.
This DLC contains the following items:
This DLC contains the following items:
- Firebird
- Wasp
- Firebird Steel
- Inferno Paint
FirebirdThe Firebird is the key to urban warfare. It proved its effectiveness when Antaeus subdued the islands and metropolitan areas of the Pacific. This turret knows its stuff: set fire to your enemy's tank, and then move on. The burning napalm will devour enemy equipment without need for any outside support. Heavy tanks will have no chance. Does it seem like the weapon is taking too long to recharge? You can still shoot burning napalm at the enemy even from half-filled fuel tanks.
WaspThis hull was specifically designed to cater to the needs of private armies around the world. The Wasp makes short work of old-style tanks, and it is also a valuable tool to fighting modern wars. It can quickly cover distances, and it is easily able to escape enemy fire. It is designed to intercept and engage a cornered enemy in a Blitzkrieg-style battle. This hull poorly resists blows and can even flip over when hit by heavy shells. But it will faithfully serve those that can avoid enemy fire.
Steel SkinsThe unofficial skins have gained popularity and because of the value drop of the gold, the mercenaries have started to demand higher quality. This is how Steel was born — a new equipment modification tier.
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subset: commoncrawl


text:
We Do
Development Transformations (DT) supports the transition from conflict to sustainable peace, enhances host nation capacity to provide stable and effective governance, and strengthens local community-based organizations.
Working effectively in today's global environment of multi-faceted challenges requires development, diplomatic, and military professionals to have a broader understanding of interagency operations.
Development Transformations (DT) personnel include professionals with development, diplomatic, and military experience, providing a thorough understanding of the organizational cultures unique to each sector. For the military, DT provides strategic advice on how to better engage civilian populations and agencies, analyze civil information, identify root causes of conflict, and conduct effective population-centric operations. For civilian agencies and NGOs, DT provides services that include how to participate effectively in military planning and operations, conduct programming in areas where security forces are operating, and coordinate with the military while preserving mission principles.
DT's specific training programs with military and civilian sectors cover a range of topics including: U.S. foreign policy objectives in specific geographical regions, democracy promotion, humanitarian assistance, principles of development, working in a diplomatic community, civil society, media training, and conflict resolution. DT has partnered with Department of State, USAID, U.S. Institute of Peace, NGOs, academic institutions, and others to design and deliver up-to-date and tailored instruction. Our services can be designed as pre-deployment training for military and civilians or as professional development programs.
Stabilization and Countering Violent Extremism (CVE) processes are complex and require flexible approaches to address the specific challenges of the environment.
Effective stabilization activities focus on root causes of instability, thereby helping to mitigate the drivers of conflict and set the stage for long-term development to take place. Development Transformations (DT) has a team of experienced civilian and military stabilization practitioners who offer technical assistance, training, and hands-on mentoring to all entities engaged in security challenged environments. DT has years of experience designing, implementing, and monitoring and evaluating stabilization programming at both the tactical and strategic levels. Utilizing real-world case studies and simulations, our training programs provide examples of best practices and prepare practitioners for the complexities of fluid, insecure, and dynamic environments.
Countering Violent Extremism
The global spread of violent extremism across highly disparate geographies threatens local, regional, and international stability. By undermining the rule of law and capturing local resources, radical movements create alternative narratives and mobilize followers for reasons that vary widely from community to community. Understanding the drivers of radicalization at a local level is an essential first step to addressing its root causes and strengthening community level resiliencies to violent extremist activity.
Drawing on DT's extensive experience with the development and implementation of USAID's District Stability Framework, a community-level methodology for understanding conflict dynamics and sources of instability, we have developed an analytically rigorous and data-driven approach to creating successful CVE initiatives. Our Radicalization Assessment Framework™ is an innovative CVE methodology and toolkit that helps to identify the drivers of radicalization, target program implementation to address root causes at a hyper-local level, and enable more effective CVE program design and implementation.
A strong civil society and effective, representative government institutions are crucial for long-term democratic development.
Recognizing the importance of a strong and vibrant civil society, Development Transformations (DT) works with new and existing organizations to build capacity and encourage citizen participation in the political process. To increase the role of civil society, DT fosters links between these organizations and government.
Participating in grassroots civil society organizations allows citizens to contribute to the political process, thereby developing a more active, engaged, and representative citizenry. Civil society organizations, including both non-governmental organizations (NGOs) and ad hoc, informal groups, can provide a crucial link in connecting citizens with government officials, and are often the catalyst behind progressive development.
Establishing effective, trustworthy, and responsive public sector institutions is essential for a state to provide goods, services, and security to its people. DT works with all branches of government—from rural mayors and council members to national representatives and the executive office—to enhance the efficiency and operational structure of government institutions.
In order to create a government that is respected by its citizenry for its ability to deliver services, DT provides staff services and development, constituent relations, and overall accountability and transparency.
Effective research, analysis, monitoring, and evaluation are essential to successful programming in conflict and transition environments.
Using our extensive experience working around the world in the most challenging environments, Development Transformations (DT) offers a comprehensive set of research and evaluation capabilities. We believe it is vital to understand the cultural, political, social, governmental, security, and physical contexts in which our clients operate to deliver effective outcomes.
DT provides full reviews of existing development programs and detailed recommendations for programmatic changes. Seeking to measure impact rather than just outputs, we evaluate political development, civil society capacity, governance, and stabilization programming. We gather qualitative and quantitative data in challenging environments, using appropriate techniques to maintain the integrity of our data.
Our main focus is:
- Monitoring and evaluating the success of our clients' projects;
- Mapping the reach, depth and quality of governance;
- Understanding civil society and networks of influence that shape people's lives;
- Informing stability operations by making assessments of sources of conflict and identifying actionable grievances and reinforceable resiliencies.


text:
President Barack Obama's foreign policy dream — cordial relations with a Middle East tranquilized by "smart diplomacy" — is in a death grapple with reality. His rhetorical writhings illustrate the perils of loquacity. He has a glutton's rather than a gourmet's appetite for his own rhetorical cuisine, and has talked America to the precipice of a fourth military intervention in the crescent that extends from Libya to Afghanistan.
Characterizing the 2011 Libyan project with weirdly passive syntax ("It is our military that is being volunteered by others to carry out missions"), he explained his sashay into Libya's civil war as pre-emptive: "I refused to wait for the images of slaughter and mass graves before taking action."
With characteristic self-satisfaction, Obama embraced the doctrine "R2P" — responsibility to protect civilians — and Libya looked like an opportunity for an inexpensive morality gesture using high explosives.
Last August, R2P reappeared when he startled his staff by offhandedly saying of Syria's poison gas: "A red line for us is we start seeing a whole bunch of chemical weapons moving around or being utilized." The interesting metric "whole bunch" made his principle mostly a loophole and advertised his reluctance to intervene, a reluctance more sensible than his words last week: Syria's recidivism regarding gas is "going to require America's attention and hopefully the entire international community's attention." Regarding that entirety: If "community" connotes substantial shared values and objectives, what community would encompass Denmark, Congo, Canada, North Korea, Portugal, Cuba, Norway, Iran, Britain, Saudi Arabia, Poland and Yemen? Words, however, are so marvelously malleable in the Obama administration, the Oxford English Dictionary's definition of "coup" ("a change in the government carried out violently or illegally") somehow does not denote what happened in Egypt.
Section 508 of the Foreign Assistance Act forbids aid to "any country whose duly elected head of government is deposed by military coup" until the president determines that "a democratically elected government" has been restored. Secretary of State John Kerry was perhaps preparing to ignore this when he said something Egypt's generals have not had the effrontery to claim — that the coup amounted to "restoring democracy."
Perhaps Section 508 unwisely abridges presidential discretion in foreign policy, where presidents arguably deserve the almost unfettered discretion they, with increasing aggressiveness, assert everywhere.
But remember Libya. Since the War Powers Resolution was passed over Richard Nixon's veto in 1973, presidents have at least taken care to act "consistent with" its limits on unilateral presidential war-making. Regarding Libya, however, Obama was unprecedentedly cavalier, even though he had ample time to act consistent with the Constitution by involving a supportive Congress. As Yale Law School's Bruce Ackerman then argued:
"Obama has overstepped even the dubious precedent set when President Bill Clinton bombed Kosovo in 1999. Then, the Justice Department's Office of Legal Counsel asserted that Congress had given its consent by appropriating funds for the Kosovo campaign. It was a big stretch, given the actual facts — but Obama can't even take advantage of this same desperate expedient, since Congress has appropriated no funds for the Libyan war. The president is simply using money appropriated to the Pentagon for general purposes to conduct the current air campaign."
Obama is as dismissive of red lines he draws as he is of laws others enact. Last week, a State Department spokeswoman said his red line regarding chemical weapons was first crossed "a couple of months ago" and "the president took action" — presumably, announcing (nonlethal) aid to Syrian rebels — although "we're not going to outline the inventory of what we did."
The administration now would do well to do something that the head of it has an irresistible urge not to do: Stop talking.
If a fourth military intervention is coming, it will not be to decisively alter events, which we cannot do, in a nation vital to U.S. interests, which Syria is not. Rather, its purpose will be to rescue Obama from his words.
George Will is a syndicated columnist.


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text:
My genealogical research on the family names Martinkus and Sauka from Lithuania
Saturday, August 15, 2015
Luokė in Telšiai County, Lithuania Population 777
According to the 2001 census, the villiage of Luokė had a population of 777 people. I wonder if any of those people are related to my family?
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text:
Toyota of Puyallup
Review for Toyota of Puyallup
JOSEPH S. on 11/11/2014
"Headlamp replacement FAR too expensive!"
I bought a 9006 Halogen headlight for 8.97 at Wal-Mart but could not replace the bulb myself. I took it to the dealership and they could not use the bulb I bought. They charged 150.00 for a special bulb and 81.50 fir labor. With tax I spent over 250.00 to replace a burned out headlight!! Not at all happy about it!
Vehicle: TOYOTA PRIUS
Category: Service
Service Date: 11/10/2014
Review Created: 11/11/2014 08:50 PM


text:
The day of small things
Please reference as: Liz Stanley (2017) 'The day of small things' Whites Writing Whiteness www.whiteswritingwhiteness.ed.ac.uk/curiosities/day-of-small-things/ and also provide the paragraph number as appropriate when quoting.
1. There are just twenty letters written to the London Missionary Society by Gottlob Schreiner (1814-1876) over the period he was employed by the LMS, from 1838 to 1846. He was the father of the feminist writer and social theorist Olive Schreiner (1855-1920), whose circa 5000 extant letters have been published in a free-access form (www.oliveschreiner.org) and who was later a notable radical in 'race' terms. And while Gottlob Schreiner's letters are few in number, a number of interesting puzzles arise from them.
2. Gottlob Schreiner was from a poor background and had been a cobbler, then was educated and theologically trained by the Basle Mission Society. He experienced a 'call' to be a missionary, specifically to be so in Africa; and he received further theological training and then ordination in London. There he met and later married Rebecca Lyndall, whose father had been a well-known evangelical preacher and whose half-sister had earlier gone to South Africa under the aegis of the LMS to run schools for children. Gottlob, or more precisely the couple, were accepted by the LMS and sent to South Africa.
3. Puzzle: Small number of letters, humungously large collection, and how to relate the minute part to the considerable whole? There are 18 Gottlob Schreiner letters, and these are located within the 2,260 archive boxes of the LMS collection, which spans the years 1795 to 1973. The WWW project is concerned with changing epistolary representations of 'race' and Gottlob Schreiner enters the frame because others of his letters are small components of two very large family letters collections, the Findlay Family Papers, and the Schreiner-Hemming Letters. So, in this context, what does getting a good or sufficient analytical purchase on his LMS letters require in the way of understanding the collection as a whole, the large southern African part specifically? Gottlob Schreiner's LMS letters are different from his family letters, but his letters to various family members also differ depending on who they are addressed to, so wherein regarding the LMS ones does the difference lie? Does understanding require knowing the totality of everything, or can letters or other documents be treated in isolation from the collection which holds them, is these some point between these extremes that can be arrived at without knowing the whole?
4. Puzzle: How to understand variance in the numbers of letters different missionaries wrote to the Dirextors of the LMS, which employed them. Letters and their report-like communicative characteristics, and also annually their nearly 'pure report' variation, were the medium of exchange and grounded the accountability of the LMS missionaries for their endeavours 'in the field'. Comparing just the numbers and dates of Gottlob Schreiner's LMS letters with those of men/couples ordained and commencing work with the LMS at the same time, it is apparent that he wrote fewer more sporadic letters than they did and also there are gaps in his annual reports towards the end of his employment with the LMS. Is this variance to be seen as the product of the kind of placements he had (which were different from the 'a mission station of my own founding beyond the frontier' which most others had), or his often-stated lack of facility in English (often in fact stated eloquently by him), or perhaps something else, not yet pinpointed? One possibility here are some 'organisational troubles'.
5. Puzzle: How to read these twenty letters. Both Gottlob Schreiner's own and other related LMS letters show that Gottlob's time with the LMS was surrounded by 'troubles'. These surfaced as his inability to get on with fellow missionaries, his sometimes confrontational approach to church governance and the role of deacons and other lay involvements, his opaque way of handling money matters. They erupted in him resigning, with the stated reason a long-simmering objection to Episcopalian ordination (the appointment of Bishops and so a ruling church hierarchy) and his transfer of employment to the Wesleyan Mission Society. Various similar troubles continued and followed him from one Wesleyan placement to another and culminated in his employment being terminated because of breaking regulations about missionaries not 'trading with the natives'. However, while these many organisational troubles imply something deep-seated around a dislike for or an inability to handle a hierarchy that demoted 'the preacher' as accountable only to God, and a perhaps feckless or naïve rather than dishonest approach to money matters, it is by no means clear cut that these 'caused' the events and his representation of them in these letters.
6. Puzzle: Focusing less on the communicative aspects of the content of Gottlob Schreiner's LMS letters, and more on their rhetorical features and their structure, which comes into view is that these do not inscribe a moral order in which 'race' occupies an expected part of the framework. There is the preacher and the people under the hand and the will of God; 'the people' are those connected or perhaps associated with the preacher's mission; there are also Basutoes and Hottentots who in time do or do not become associated with it too; and their are Europeans, farmers, who occupy land and monopolise sources of water and otherwise intimidate and usurp so that the previous inhabitants move on to poorer pastures. Comparing this with the one LMS letter written by his wife, Rebecca Schreiner, some differences are clear. In her letter, the inhabitants and the landscape are barren and melancholy to a European eye; the Griqua and Hottentots are inferior, the Basutos are cleverer but addicted to lying, while subgroups are benighted heathen, and the Baramakale are addicted to cannibalism. Are these differences rhetorical ones located in Gottlob's sense of mission and Rebecca's experience of dislocation? Or might they have referential aspects too, and have played out in some way in social relationships, or regarding their personal relationship as well?
7. Puzzle: The Schreiners travelled to South Africa as part of an LMS group on the 'David Scott' ship. This involved Dr John Philip, an LMS Director who had responsibility for managing the southern African missions; John Reed senior, an LMS missionary with radical ideas about 'race' and who had married a San woman; his mixed-race son John Read junior, also to become an ordinated LMS missionary; Jan Tzatzoe, a Xhosa chief (and minor royalty) who had converted to Christianity as a child and been adopted by Read senior; and Andries Stoffels, a Griqua who was an elder in his local church. They were returning from having been called to give evidence to the Buxton Inquiry, which eventuated among other things in giving a large parcel of land back to Xhosa peoples in the Eastern Cape. What influence if any might spending a long period of time with these men, who were not so much his class, educational, social and intellectual equals as his superiors, have on the young, devout and emotional Gottlob – and also on the better educated and more steely, but also female and so to a large extent excluded, Rebecca?
8. These puzzles are all transferable ones; there is no easy resolution of them; but they are all good to think with. They concern:
- the specific object of research, a letter or other document, and its relationship to the larger archival whole to which it belongs;
- the number, frequency, duration of such letters or other documents and variations regarding different addresses;
- how specific letters/documents are related to other interconnected letters/documents and, where there are 'factual' differences, how best to understand and adjudicate these;
- the need to attend in close detail to the communicative content of a particular letter/document;
- while also recognising the rhetorical features and that letters/other documents do not have total referentiality; and
- the importance of the social, political and relational context in which a letter/document was written and had its original meaning and reference.
Last updated: 14 October 2017


text:
In Life, Social Media, Video
Kyle Reed
- Anonymous
Seth always blows me away. I'm buying what he's selling, have been for years. Even though I've heard him say/write most of these ideas before, it is always freshly inspiring to me.
- http://www.mecasually.com Matthew Erxleben
I'm with Sarah, Seth always blows me away. I read his blog everyday and walk away smarter.


text:
This is the situation as the National Treasury Employees Union picks its next president: Big federal budget cuts are a certainty, an unfavorable majority runs the House and the sting of a major defeat is painfully fresh.
No matter who wins, the victor has a losing hand.
Colleen M. Kelley, the incumbent, and Eddie Walker, the contender, apparently crave a challenge. Kelley is seeking her fourth four-year term, and Walker is trying for a second time to unseat her. The results should be known Tuesday evening after voting by delegates to the NTEU convention in Seattle.
The next NTEU president will be in office during times that are harsher for federal employees than they have been in many years. "I actually think federal unions are more relevant now than ever," Kelley said. "I think there are a lot of things we can do to take our story to the public, as well as members of Congress, about federal agencies, the missions they deliver on . . . to make sure they get the resources to fulfill those missions . . . and bring that story home to them about the real impact, the positive impact that federal employees and federal agencies have on the public every day."
"It is a time to stand stronger than ever."
Walker, who has been president of an NTEU chapter in Austin for five terms, tells members on his Web site, "This is the time . . . to choose a future that explodes with possibilities . . . that takes the best from our collective past and experience, and builds a strong, fighting force for the betterment of our members — and yet offers a strong vision of what unions can do for the benefit of the rest of the nation."
The future for federal employees will explode with possibilities, all right: possibilities of furloughs, additional pay freezes and smaller benefits. The unbalanced deal the White House made to raise the debt ceiling, a deal that cuts spending but raises no new money, will put the pinch even more on federal workers.
Even before the onerous debt-ceiling deal, there were proposals — from House Republicans and others — to extend the freeze another year or two or three, cut wages by making employees take two weeks' leave without pay, reduce federal retirement benefits and make workers pay more for them.
"As difficult as these times are, and they are, what we also know is, we have seen many administrations and many members of Congress come and go," Kelley said. "And we were here long before they were, and we will be here long after they are gone. And we have been and will continue to be relentless in our defense of the federal worker and what they do every day."
She cites her "background, experience, respect" and a long list of accomplishments. They include record membership numbers, efforts to organize Customs and Border Protection officers and successful efforts to eliminate the IRS's use of private tax collectors and to keep IRS and Food and Drug Administration facilities open.
"I'm very, very proud of what we've accomplished, and I stand on my record," she said.
In Walker's view, the issues facing federal employees mean "NTEU is in vital need of energetic, fresh leadership that can effectively represent all its membership. NTEU deserves to be more of a player on the national scene."
"I firmly believe that our union's potential for political activism has not been fully tapped," he said. "I will revamp our legislative program to make it more productive, and in order to strengthen our legislative influence, I will personally campaign among members to increase [political action committee] participation."
While the future for federal employees is uncertain, the immediate past for NTEU members is disheartening. The loss in June to the American Federation of Government Employees to represent transportation security officers was a huge buzzkill. The contest was the biggest federal labor organization campaign ever.
"It was a union-wide initiative. This was not something that involved only me," Kelley said. "Obviously, we are very disappointed that we lost the election."
It didn't have to be that way, said Walker.
"I think it's a major issue because there were so many missteps made along the way," he said in an interview. "If you're going to take on that kind of fight, you got to be ready to do it right . . . . We did not do that. We went down the wrong road."
An item on his Web site indicates the wrong road included "a top-down bias by our national staff which failed to respect and utilize the input and the experience" of NTEU Transportation Security Administration chapter leaders.
"Top-down" is a term Walker uses often to describe his main critique of Kelley's centralized leadership style. "You have to listen to people," he said. "You cannot have top-down leadership. It doesn't work in federal agencies, and it doesn't work in a union."
On losing the security officers' vote, Walker wrote that Kelley's "organizing plan concentrated on large airports and put off the fight for more modest-sized bargaining units, in the process ignoring the suffering of representation-hungry employees at smaller workplaces. That approach gave ammunition to our competitors, allowing a myth to arise, that NTEU was just in it to win it for the benefit of the organization, not for the employees."
Walker said Kelley diverted 40 percent of NTEU's field-office resources to the losing campaign, which left some union activities, such as processing grievances, lacking. To make up for that, he would rebate a portion of annual dues back to chapters to help build them and "to say thank you for the sacrifices" during the TSA campaign.
Regarding those sacrifices, Kelley said: "Everyone understood from the beginning that if we were in this campaign, we were in it to win it. That meant we were going to do whatever we needed to do." It was very important to use field-office staff to develop NTEU support among the security officers, she added, "and the chapter leaders agreed with that."
Of course, everyone probably would still agree with that had NTEU won. But it didn't.
Now Walker is counting on that loss to help fuel his victory.
Follow the Federal Diary on Twitter: @JoeDavidsonWP.


text:
"In the cup we find gala apple, bartlett pear, soft tangerine and subtle coconut in the finish. It's not a big coffee by any means though. The body is silky and smooth and the acidity is very balanced with the sweetness."
- Geoff Woodley,
Lead Roaster and Green Buyer
Gala Apple
Bartlett Pear
"I find it has a really nice quality of acidity. When we talk about acidity we talk about intensity and quality, and for a Kenyan coffee I don't think it's the most intense, but the quality is bang on. It's just a really pleasant, high quality acidity with a lot of sweetness."
- Ben Cram,
"This coffee is super sweet, mouth full of brown sugar sweetness, with flavors of rosemary and Coca-Cola. It was almost like drinking a cup of coffee-coke."
- Felix Cha
Brown Sugar


text:
Provider: Ingenta Connect
Database: Ingenta Connect
Content: application/x-research-info-systems
AU - Saxon, Edward
AU - Conrads, Paul
AU - Roehl
AU - Martello, William
JO - Proceedings of the Water Environment Federation
N2 - Bordered on the west by the Broad River and on the east by the Beaufort River, the Beaufort-Jasper Water & Sewer Authority provides wastewater service to all of the Beaufort and Port Royal area with the exception of the U.S. Marine Corps facilities. Permitted discharges of reclaimed
water to the Beaufort River total about 9 million gallons per day (mgd) with actual discharges averaging about 3.5 mgd and evenly split between municipal and military facilities. The discharged flows are anticipated to increase to 12 mgd over the next 20 years due to growth in the municipal
population.The Beaufort River is a complex estuarine river system that is home to shellfish grounds and fisheries nursery habitats. The River also serves as receiving water for treated wastewater from four significant water reclamation facilities. While not uncommon for coastal areas,
the river is on the South Carolina 303(d) list of impaired waters for low dissolved oxygen. The Clean Water Act stipulates that Total Maximum Daily Loads (TMDLs) must be determined for all waters on the 303(d) list. Critical to the development of defensible TMDLs is the linkage between the
impairment and the source of the impairment. For the Beaufort River, a regional approach was necessary to address its complex river system issues and protect the highly sensitive eco-systems.The BJWSA wastewater facilities are operating above 70% of permitted capacity and are scheduled
to be replaced by a regional Water Reclamation Facility in June 2006. In order to support the expedited NPDES permitting efforts needed to support the schedule for BJWSA's planned water reclamation facility, a new approach to develop a predictive dissolved oxygen model was required. The regional
wastewater management approach, planned for the Beaufort River, was developed and spearheaded by Dean Moss, General Manager of the BJW&SA. His vision called for consolidating the military and civilian wastewater discharges into a single, higher quality discharge. However, this plan required
extensive data collection and modeling to prove its validity. Toward that end, the coordinated efforts of the BJWSA, JJG, USGS, and ADM team led to the establishment of an extensive network of eight continuous monitoring stations in the Beaufort and Broad River Basins. From this monitoring
information, an empirical model of the system was developed that made accurate predictions of the response of in stream dissolved-oxygen concentrations due to changing hydrologic, meteorological, and point-source loading conditions. Sensitivities were performed for each treatment plant in
the system and the dissolved oxygen concentration impact at each monitoring station location. Potential wastewater management scenarios were evaluated for developing the optimal loading from the various dischargers, while simultaneously protecting the integrity of the Beaufort River. This
modeling effort confirmed the regional approach proposed by the BJW&SA was the best solution to protect the Beaufort River and its resources.For many years, data mining and artificial neural networks (ANN) have provided valuable forecasting information to marketing and financial institutions.
ANN differs from traditional water quality modeling methodologies because it does not use equations based on physics and biology when forecasting. This eliminates the inherent biases in the weight placed on physical and biological factors (and their interpretation) in traditional modeling.
Instead, ANN relies on a statistical model that is created from the detailed analysis of environmental information. For watershed management, the information is elicited from the extensive database of meteorological and water quality data.During the course of the model development, the
BJWSA spearheaded a partnership effort with the federal government (USGS and EPA) and state regulatory officials (SC DHEC), as well as its consulting firms. SC DHEC technical staff, as well as EPA Region IV, provided technical review of the project. Regulators were included in the project
process as participants to insure their full understanding of this innovative modeling approach and to confirm the technical validity of the model.The ANN technology applications for water quality modeling beyond forecasting the sensitivity of point-source loads on instream dissolved-oxygen
concentrations are extensive. The ANN approach can easily be applied to complex and dynamic water systems where traditional approaches have previously been employed, whether successfully or unsuccessfully. Now, the BJWSA is utilizing a cutting edge application of that existing technology.
The result – for the first time, ANN was being used as a water quality model that is more accurate, cost-efficient, and time-efficient than physics based models.Because the model is faster and less expensive to run, watershed managers will have a cost-effective decision-making tool
at their disposal that can produce more information in less time, and with greater accuracy than physics-based modeling. The speed and accuracy of the model using the ANN technology is impressive: Results that take hours to produce with physics-based modeling only takes minutes with the ANN
model. The accuracy of the results is significantly higher than typically seen with traditional modeling approaches. By using this modeling approach, a TMDL was established and BJWSA received a NPDES Permit for its new Water Reclamation Facility.
UR - http://www.ingentaconnect.com/content/wef/wefproc/2005/00002005/00000008/art00021
M3 - doi:10.2175/193864705783858477
UR - https://doi.org/10.2175/193864705783858477


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Luther Vandross: Live at Wembley Trailer (1988)
01 January 1988
Music & Musicals, Contemporary R&B, Urban & Dance - Grammy-winning R & B artist Luther Vandross shines on hits such as "A House Is Not a Home" and "For You to Love" in this memorable collection of performances, recorded live at London's Wembley Arena as part of his 1988-89 tour. Other set list selections include "Give Me the Reason," "She Won't Talk to Me," "Love Won't Let Me Wait," "Never Too Much," "Superstar," "Stop to Love," "Searching," "Any Love" and "Come Back."
Watch the official Luther Vandross: Live at Wembley 1988 trailer in HD below or find more Luther Vandross: Live at Wembley videos on Vidimovie.


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What is the Explorers' Club all about?
Explorers' Club is a hands on, creative program for children in prep to grade 2. Dive into independent learning through games, craft, collaborative play and activities that reward a love of reading and exploration.
(We support S.T.E.M initiatives- Science, Technology, Engineering, Maths- helping all children to discover their potential).
How can I join the Explorers' Club?
It's easy. Fill in this registration form, take it to the library and give it to staff. Start reading, record your books in the reading log and bring it along to the next Explorers' Club meeting.
Best of all..... .IT'S FREE!
Cranbourne, Endeavour Hills and Hampton Park Libraries
Wednesdays 4.00 - 5.00pm
27 September, 25 October, 22 November
Bunjil Place, Emerald and Pakenham
Thursdays 4.00 - 5.00pm
28 September, 26 October, 23 November
These dates can also be found on our events calendar.


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^ Call your rep & senators about Net Neutrality to stop the FCC ^
Moderators: Dr. X, ikensall, fredde
Warhead wrote:my head burns with War.
Warhead wrote:my head burns with War.
IVhorseman wrote:i love modular vehicles! bigger guns could easily be placed onto the vehicle with different modular bits.
although, as i'm famous for shouting, this is not a tank. assault vehicle yes, but no treads or 360 degree turret, as well as a non-armored cockpit.
Joetrillion wrote:Lol tank snob...
Warhead wrote:my head burns with War.
Users browsing this forum: Yahoo [Bot] and 3 guests


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Best things to do in Limassol and sightseeing in Limassol
Hotel Columbia Beach Resort Pissouri - Limassol
My Mall - Limassol
Kourion - Limassol
Chris Blue Beach - Limassol
Beautiful beach, probably one of the most sandy in Cyprus that you'll get. A lot of the beaches are just rocks, so be prepared. There are three nice restaurants on the beach and sunbeds for hire. You can see Kourion up on the cliff side behind you. I loved swimming in the Mediterranean sea!
Pissouri - Limassol
Omodos - Limassol
Troodos - Limassol
Standing tall amongst the Limassol Ranges are the Troodos Mountains. At the heart of the island of saints, culture and beauty- Cyprus is a region which has abundance to offer to a traveller like me. As I set foot in the south-east of this region, backpacking around Troodos, I discovered the unique picturesque scenery that surrounded these mountains. Exploring its much talked about dense forests and mines, I further delved my footsteps into the valleys encompassing beautiful vineyards and scenic panoramas. While I could clearly see how the Troodos valley was truly meant for all seasons, what amazed me the most were cultural treasure of the place. The archaic remains and monastery of kykkos, amongst other mountain views, added to the beauty that lay around and beyond Troodos. And my trip to Troodos came to a perfect end as I walked in serenity on the cobbled streets arched with blossoming orchards.


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UWS students present research in Madison
Submitted by Tom Hansen
Wisconsin-Superior University Relations
Seven University of Wisconsin- Superior students involved in the university's math and computer science, biology, psychology, business and economics, and transportation and logistics management programs were chosen to showcase their undergraduate research projects at the State Capitol in Madison.
The 11th annual Posters in the Rotunda: A Celebration of Undergraduate Research, was March 12. The event brought more than 150 students and faculty from University of Wisconsin system campuses to the State Capitol Rotunda to share findings from undergraduate research projects with state elected officials, government representatives and the public.
UWS student presenters include:
Alexei Bogdanov, a double major in economics and transportation and logistics from Angarsk, Russia, presented "The Economic and Environmental Impact of the Gogebic Taconite Mine in Northern Wisconsin." His faculty adviser is Zamira Simkins, professor of economics. The objective of this research project was to study the potential economic and environmental effects of the Gogebic Taconite iron ore mine proposed within the Penokee Range in Ashland and Iron counties of northern Wisconsin. He came to Superior because of the transportation and logistics program at UWS. He plans to pursue a graduate degree in transportation and hopes his empirical research experience will help him achieve that goal.
Kelly Bergstrom, a double major in biology and psychology from Superior, presented "The Effects of Distractors during a Sustained Attention Task." This is a cognitive study that looks at how distractors affect attention, measured by response time, throughout the duration of a task. Her faculty adviser is Eleni Pinnow, professor of psychology. She is set to graduate in May and hopes to eventually go on to study clinical psychology with a focus in neuropsychology. Her project gave her the opportunity to gain research skills that she will continue to build throughout graduate school and her career.
Bradley Roy, a transportation and logistics major from Geoffstown, N.H., presented "Improving the Efficiency of Snow Removal Operations in City of Duluth." Roy worked on a project to research the feasibility of improving the fuel efficiency of the snow removal operations in Duluth. In the process of research he found out specifically what types of vehicles Duluth used and how much area across which the city is required to complete snow removal operations. He also took into account where the city located its equipment and whether it could improve the locations. His faculty adviser is Mei Cao, professor of transportation and logistics. Roy is an eight-year Air Force veteran who came to UWS specifically for the transportation and logistics program.
Dara Fillmore, a public history major from Lake Nebagamon, presented "Creating Communities and Health through Gardens, an independent study in applied anthropology gauging interest in community gardens in Superior." The results of the survey showed an interest in the topic of community gardens. Members of community gardens already in existence were interviewed to learn about resources, choices and challenges. Meetings were held to learn about requirements for creating a community garden on the UWS campus. Fillmore's faculty adviser is Deborah Augsburger, professor in anthropology.
Josh Mutchler, a double-major in biology and broad-field science from Duluth, presented "Analyzing Known Watershed Data to Predict Potential Water Quality Degradation." Through this research Mutchler explored the potential environmental risks the GTAC mine could impose on adjacent watersheds and valuable ecosystems downstream from the mining site. His faculty adviser is Amy Eliot of the Lake Superior Research Institute. For the past two summers he worked with the LSRI and came to appreciate the many pristine watersheds within the Lake Superior Basin.
Sam Reiswig and Brentton Paulus, both graduates of Superior High School, presented "Creating a UW-Superior Weather Station." Together they worked on creating a weather sensor for the university. They were interested in this project because it allowed them to work with micro-controllers and other devices such as the CP2112. Their faculty adviser is Dr. Sergei Bezroukov, professor in mathematics and computer sciences. This current project contains a remote sensor that transmits to a receiver base. The receiver base sends the weather data to a server that can be accessed as a web page at cs2.uwsuper.edu/~weather/. They report that greater details about this project can be seen at mcs.uwsuper .edu/sb/Electronics/Weather/ind.php.
During the Posters in the Rotunda event, state leaders had the opportunity to view poster presentations of the research projects, speak with students and faculty members and learn more about how this experience enriches the educational experience. The students also had a chance to meet with several area state lawmakers about their research and inquire and learn more about government operations in Madison.


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Published: Thursday 30th April 2015 by The News Editor
Train travel on busy commuter routes has been plunged into chaos after a major power supply problem led to police and firefighters evacuating passengers stuck for hours in sweltering temperatures.
Water had to be handed out to stricken travellers, some of whom were still waiting to reach London more than five hours after boarding their train.
The problem, which was set to cause disruption throughout the day, was compounded by the fact that it affected Clapham Junction in south London – the UK's busiest interchange station.
One passenger had to be treated by ambulance staff on one of the stationary trains, while firefighters used a short-extension ladder to evacuate travellers from one held-up service.
British Transport Police (BTP) reported evacuating 904 passengers from one train, while travellers on another stricken service were waiting for a tow.
Passengers spoke of "nightmare" conditions at Clapham Junction.
No Southern train company trains were able to get in or out of London's Victoria station and there was no service on the Gatwick Express.
Passengers heading for London from southern England found they had to get off well short of their destination and travel in on other rail routes.
The unfortunate ones got stuck on trains unable to get through Clapham Junction.
One of the worst-affected trains was the 6.56am from Brighton which should have got into Victoria at 8.15am.
Shortly after noon the train was still stuck near Clapham.
One of its passengers student Hannah Phillips, 20, from Eastbourne, East Sussex, said: "I was lucky that I was carrying a bottle of water with me as it was getting very hot on the train.
"This is probably the worst train journey I've experienced."
Another passenger on the held-up Brighton train was Ben Goode.
He tweeted: "This is a shambles."
Also on the train was Anna Roberts, a Press Association journalist.
She said: "Police and paramedics boarded our train because there is no air conditioning.
"They said they were bringing water but not enough for everyone to have one bottle each.
"Eventually we got water in plastic containers which we are passing around the carriage.
"We were told that was all that was available.
"With the power off, it's like an oven in here.
"Police have said it's too dangerous to walk down the track."
The problem struck between Wandsworth Common and Clapham Junction in the middle of the morning rush hour.
FiniasFinn tweeted: "Clapham Junction is the worst station ever. I realise it's chaos but no staff helping and being arrogant is not a help."
Thomas Michael Jules wrote: "Avoid Clapham Junction today people! Mayhem!!"
A person called Precious tweeted: "Complete chaos at Clapham Junction this morning as trains are delayed left, right and centre. What a nightmare!"
A Network Rail spokesman said: "A major power supply problem between Clapham and Wandsworth Common has disrupted Southern train services into London Victoria this morning.
"Engineers are on site and we aim to resume services as quickly as possible.
"Tickets are valid on all other routes into London and Southern passengers are advised to avoid travelling through Clapham Junction, which is very busy.
"South West Trains services to and from Waterloo via Clapham Junction are unaffected."
Those on the stricken 6.56am train from Brighton were finally towed to Wandsworth in south London, arriving shortly before 1pm.
National Rail information said that problems with the conductor rail between Wandsworth Common and Clapham Junction had caused damage to a number of trains.
Once the trains had been moved repairs were likely to take up to three hours. Passengers were advised to avoid using Victoria station.
Shortly after 1pm Gatwick Express trains began running again but with delays.
Mick Cash, general secretary of the RMT rail union, said: "Chaos at major London railway stations is now a matter of course as the reality of trying to shove growing passenger numbers into an overstretched and understaffed network hits home.
"It is about time Network Rail properly valued those staff who are battling to keep services moving that are routinely running right on the edge.
"The hundreds of millions of pounds bled from our railways by privatisation would have gone a long way to building in the capacity and reliability that passengers rightly demand."
Published: Thursday 30th April 2015 by The News Editor


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text:
First, read this explanation of why you shouldn't buy the pills:
So what can parents give a child for a cold? Vitamin C may help and won't hurt if it's given in the form of fruit or juice. Chicken soup, or even better a good clear sugar-free, dairy-free homemade vegetable soup with celery and onion, feels soothing and may help.
Statins? The A.M.A. seems slow in reaching a conclusion. Some studies suggested that they increase the risk of a non-diabetic patient becoming diabetic. This hasn't been formally accorded the status of a fact yet, but a borderline diabetic friend of ours who used statins, became clinically diabetic, felt terrible, and is now being tested the cardiovascular symptoms that have become worse, thinks it's closer to being a fact than the theory of macroevolution is likely ever to come. Good old diet, exercise, and meditation are cheaper and safer and have fewer side effects than stations.
I'm not familiar with the name-brand medications discussed in the article, but for sinus relief I'd recommend just inhaling steam and mopping until relief is felt. (Some people who have more fortitude than I have try washing the germs out of the sinuses by snuffing saltwater. It seems to work for those who do it.)
For weight loss, especially that ugly belly fat...there may never be a substitute for diet and exercise, but a harmless, pleasant, and cheap way to supplement a diet and exercise regimen is laughing out loud from the diaphragm for half an hour a day, or more. This has been shown to provide natural pain relief, lower cortisol levels, and shake up the cellulite, at one delightful swoop.
Thursday, October 13, 2011
Alternatives to Some Pills You Might Not Want to Buy
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Re: John Morgan and Rachel Presley Marriage 1888 look-up please.
In reply to:
John Morgan and Rachel Presley Marriage 1888 look-up please.
Jeff Whitehead 9/14/11
Hi Jeff,
The 1901 census shows the family in ON
1901Clarence Russell, ON
John, age 43, labourer, born April 2, 1857, United States
Rachel, wife, age 33, born Jan. 25, 1867 ON
Anna, daughter age 11, born June 6, 1889 Quebec
Willie, son, age 9,born Sept. 5, 1890 Quebec
Olive, daughter, age 8, born Aug. 4, 1892 Quebec
Mary, daughter, born Feb. 3, 1898 ON
So perhaps as their first three children were born in Quebec you could look for their marriage there.
John, age 34, labourer, born US both parents born US
Ratchel (as indexed) age 23, wife, born Quebec, father born Quebec, mother born Ireland
Anna, age 1-8/12, daughter, born Quebec father born US mother born Quebec
William, age 7/12,son, born Quebec, father born US mother born Quebec
I found a baptism for John William Morgan in Quebec
Quebec Vital and Church Records (Drouin Collection), 1621-1967 about J W Morgan
Name: J W Morgan
Event Year: 1891
Event: Naissance (Birth)
Religion: Presbyterian
Place of Worship or Institution: Montréal, Pointe-St-Charles (Presbyterian Saint Mathew)
Province: Québec (Quebec)
Image says:
John William Morgan, born on second day of April 1857, was baptized by me this second day of October 1891.
W.D. Reid
It is also signed by Rachel Emeline Morgan
AND on same page of the record
Ann Jane, daughter of John William Morgan, labourer and of Rachel Emmeline Presley was born June 6, 1889 and baptized by me on this second day of October, 1891.
W.R. Cruickshank, Pastor
also signed by John William Morgan and rachel Emeline Morgan
William John, son of John William Morgan, labourer and of Rachel Emeline Presley was born September 5, 1890 and was baptized by me this second day of October 1891
W.R. Cruikshank
also signed by John William Morgan and Rachel Emeline Morgan
I thought I would find a marriage for John and Rachel here but did not so still a mystery.
I did not find baptism of Olive who was born after this - 1892
Also did not find baptism for daughter Mary born 1898 ON
I noticed that in all census Rachel consistently shows her mother born Ireland - not so for father - shows various places, but in 1881 Canada census there are only 3 possible Rachel Presley girls.
1. born 1867 ON - she is in Plantagenet North, Prescott with parents William, born ON and Ann Jane, born Ireland
2. born 1869 ON - she is also in Plantagenet with parents John born ON Mary Jane born ON
3. Rachel Prestly - born 1867 Quebec - living in Unorganized Territory, Ottawa district, Quebec - parents Joseph born Ireland and Chrisinie born ON
so the only one that really seems likely is the first family.
The only thing I can think of for you to know for sure would be to get her death cert which hopefully would have parents names on it.
Carolyn L
More Replies:
Re: John Morgan and Rachel Presley Marriage 1888 look-up please.
Jeff Whitehead 9/20/11