text:
|Publication number
|Publication type
|Application number
|Publication date
|Feb 28, 2012
|Filing date
|Mar 5, 2007
|Priority date
|Jan 9, 2002
|Fee status
|Also published as
|Publication number
|Teck Kheng Lee
|Original Assignee
|Micron Technology, Inc.
|Export Citation
|BiBTeX, EndNote, RefMan
|Patent Citations (184), Non-Patent Citations (23), Referenced by (10), Classifications (60), Legal Events (5)
|External Links: USPTO, USPTO Assignment, Espacenet
This application is a continuation of U.S. patent application Ser. No. 10/853,377, filed May 25, 2004, now U.S. Pat. No. 7,189,593, granted Mar. 13, 2007, which is a divisional of U.S. patent application Ser. No. 10/050,507, filed Jan. 16, 2002, now U.S. Pat. No. 7,129,584, granted Oct. 31, 2006.
This invention generally relates to assembling and packaging multiple semiconductor dies, and more particularly to a stacked multiple die device and methods for fabricating the device.
Chip-on-board and board-on-chip (BOC) techniques are used to attach semiconductor dies to an interposer or other carrier substrate such as a printed circuit board (PCB). Attachment can be achieved through flip chip attachment, wirebonding, or tape automated bonding ("TAB").
Flip chip attachment typically utilizes ball grid array (BGA) technology. The BGA component (die) includes conductive external contacts, typically in the form of solder balls or bumps, arranged in a grid pattern on the active surface of the die, which permit the die to be flip chip mounted to an interposer or other carrier substrate (e.g., PCB).
In a flip chip attachment, the balls of the BGA component are aligned with terminals on the carrier substrate, and connected by reflowing the solder balls. The solder balls can be replaced with a conductive polymer that is cured. A dielectric underfill is then interjected between the flip chip die and the surface of the carrier substance to embed the solder balls and mechanically couple the BGA component to the carrier substrate.
Wirebonding and TAB attachment generally involve attaching a die by its backside to the surface of a carrier substrate with an appropriate adhesive (e.g., epoxy) or tape. With wirebonding, bond wires are attached to each bond pad on the die and bonded to a corresponding terminal pad on the carrier substrate (e.g., interposer). With TAB, ends of metal leads carried on a flexible insulating tape such as a polyimide, are attached to the bond pads on the die and to the terminal pads on the carrier substrate. A dielectric (e.g., silicon or epoxy) is generally used to cover the bond wires or metal tape leads to prevent damage.
High performance, low cost, increased miniaturization of components, and greater packaging density of integrated circuits have long been goals of the computer industry. One method of increasing integrated circuit density while reducing package size and height is to stack dies vertically. Different approaches to packaging have been pursued to provide stacked die devices.
One such example of a stacked die to lower wire bond loop height is depicted in
Flip chip attachment has provided improved electrical performance and allowed greater packaging density. However, developments in ball grid array technology has produced arrays in which the balls are made smaller and with tighter pitches. As the balls become smaller and are set closer together, it poses problems for the mutual alignment of the conductive bumps 13 on the flip chip die 12 with the bond pads 28 on the bottom die 20, requiring a metal reroute or redistribution layer (RDL) 34 disposed as an intermediate layer on the surface of the bottom die 20. The RDL 34 effects an electrical interconnection (redistribution) between the bond pads 14 on the flip chip die 12 to the bond pads 28 on the bottom die 20 for die attachment and wire bonding to the substrate. If the bond pads 14 on the flip chip die 12 can be wafer bumped, for example, by stencil printing, electrolytic plating or electroless plating, an RDL on the flip chip die 12 may not be necessary, and the die 12 can be directly bonded to the bottom die 20 through an RDL 34 disposed on the surface of the bottom die 20, as schematically depicted in
Fabricating an FC-on-chip can also lead to high costs and process difficulties. For Example, a flip chip mounter is required to accurately align the top die 12 to the bottom die 20. Another drawback is that damage can occur to the active surface 18 of the bottom die 20 during an underfilling process onto the active surface 18, and a molding filler can fail to flow into voids between the dies if the gap is too small.
In view of these and other deficiencies in conventional methods for fabricating stacked die modules, improvements in fabrication methods are desirable.
The present invention provides a flexible film interposer for stacking a tape base flip chip onto a second (bottom) semiconductor die, and semiconductor devices and stacked die assemblies that incorporate the interposer, and methods of fabricating the devices and assemblies for increasing semiconductor device density. In particular, the present invention relates to a stacked multi-substrate device using a combination of flip chip and chip-on-board assemblies to achieve densely packaged semiconductor devices, without the need for a redistribution layer (RDL).
In one aspect, the invention provides a flexible film interposer structured for mounting thereon first and second semiconductor die in a stacked die assembly. In one embodiment, the flexible film interposer comprises a flexible substrate comprising a first surface, a second surface, and opposing sides; a plurality of spaced apart recesses having a base and extending through the flexible substrate for receiving conductive connecting members of a first semiconductor die therein; at least one slot formed through the substrate and disposed between the recesses and a side of the substrate; and a plurality of conductive traces disposed on the second surface of the substrate, each trace extending over the slot and at least one recess, each of the recesses having a trace disposed at the base thereof.
In another embodiment, the flexible film interposer comprises a flexible substrate comprising a first surface, a second surface, and opposing sides. The first surface of the substrate is structured for mounting thereon a first semiconductor die having a plurality of spaced apart conductive connecting members disposed on an active surface, and the second surface is structured for mounting thereon a second semiconductor die having a plurality of bond pads spaced along a periphery. The substrate comprises a plurality of spaced apart recesses having a base and extending through the substrate for receiving the plurality of conductive connecting members of the first semiconductor die therein. The substrate further comprises one or more slots extending therethrough and along a periphery of the substrate, wherein when the second semiconductor die is mounted onto the second surface of the substrate the bonding pads are exposed through the slots. The flexible film interposer can further comprise a plurality of conductive traces disposed on the second surface of the substrate, each trace extending over the slot and at least one recess, each of the recesses having a trace disposed at the base thereof.
The flexible film interposer preferably comprises a flexible polyimide film (e.g., a flex tape), having a thickness in the range of about 12.5 μm to about 200 μm. The slots are sized and configured to receive a bonding tool therethrough to contact bond pads of a semiconductor die mounted on the second surface of the interposer and exposed through the slots. An adhesive element such as a double-sided adhesive tape, can be disposed on the first and/or the second surface of the substrate to adhere the semiconductor die thereto.
In another aspect, the invention provides a semiconductor device. In one embodiment, the semiconductor device comprises a flexible film interposer according to the invention and a first semiconductor die mounted thereon, the die having a first active surface and a second surface, and the active surface comprising a plurality of spaced apart conductive connecting members. The first semiconductor die is mounted on the flexible film interposer such that a conductive connecting member of the die is received in a recess of the interposer in conductive contact with the trace at the base of the recess, and the slots on the first surface of the substrate are exposed. An underfill encapsulation material can be disposed between the active surface of the first semiconductor die and the first surface of the flexible film interposer. The semiconductor device can further include an adhesive element such as an adhesive paste or tape, disposed between the active surface of the semiconductor die and the flexible film interposer.
In another aspect, the invention provides a stacked die assembly. In one embodiment, the assembly comprises a flexible film interposer according to the invention having first and second semiconductor dies mounted on the first and second surfaces, respectively, of a flexible substrate. The first semiconductor die is mounted onto the first surface of the flexible film interposer using a conventional die attacher or a flip chip attacher such that each of a plurality of conductive connecting members of the die is received in each of a plurality of spaced apart recesses of the interposer in conductive contact with a trace at the base of the recess. The first (active) surface of the second semiconductor die is mounted onto the second surface of the flexible film interposer with bond pads on the active surface of the die exposed through the slot(s) of the flexible film interposer. An interposer substrate comprising terminal pads on a first surface, is mounted onto the second surface of the second semiconductor die with the terminal pads exposed. The traces exposed through the slots of the flexible film interposer and the underlying bond pads of the second semiconductor die are bonded to the terminal pads of the interposer substrate, for example, by wire bonding or TAB bonding. An underfill encapsulation material can be disposed between the active surface of the first semiconductor die and the first surface of the flexible film interposer. The interposer substrate can comprise a flexible material such as a polyimide substrate, or a non-flexible substrate such as bismaleimide triazine (BT) resin, FR4 fiberglass laminate, FR5 laminate, or ceramic. The interposer substrate can also comprise external contacts such as conductive solder balls, to form the stacked die assembly as a component that can be coupled to an external circuitry such as a testing apparatus. In another embodiment, the interposer substrate can comprise, for example, a PCB substrate, or a motherboard. The stacked die assembly can also be encapsulated to form a package.
In yet another aspect, the invention provides a semiconductor package. In one embodiment, the package comprises an encapsulated stacked die assembly, which comprises first and second semiconductor dies mounted on a flexible film interposer according to the invention, with the second (bottom) die being mounted on an interposer substrate.
In a further aspect, the invention provides a method of fabricating a semiconductor device. In one embodiment, the method comprises the steps of: providing a flexible film interposer, the interposer comprising a first surface and a second surface, at least one elongate slot formed through and along a peripheral edge of the interposer to expose bond pads on a second semiconductor die mounted onto the second surface of the interposer, a plurality of spaced recesses formed through the interposer and adjacent the slot, each recess having a base, and a plurality of conductive traces disposed on the second surface of the interposer, each trace extending across and exposed through the slot and the base of one or more adjacent recesses in a perpendicular orientation to the slot; and mounting a first semiconductor die on the first surface of the flexible film interposer, the first semiconductor die having an active surface comprising a plurality of spaced conductive connecting members, and mounted on the interposer such that a conductive connecting member of the die is received in a recess of the interposer in conductive contact with the trace at the base of the recess.
In another aspect, the invention provides a method of fabricating a stacked die assembly. In one embodiment, the method comprises the steps of: providing a flexible film interposer, according to the invention; mounting a first semiconductor die on the first surface of the flexible film interposer, the first semiconductor die having an active surface comprising a plurality of spaced conductive connecting members, and mounted on the interposer such that a conductive connecting member of the die is received in a recess of the interposer in conductive contact with the trace at the base of the recess; mounting a second conductor die on an interposer substrate, the second semiconductor die comprising a first active surface and a second surface, the active surface comprising a bond pad, and the interposer substrate comprising a first surface with terminal pads disposed thereon, and mounted onto the second surface of the second semiconductor die with the terminal pads exposed; mounting the second semiconductor die onto the second surface of the flexible film interposer with the bond pads of the second die exposed through the slot of the interposer; and bonding the traces of the flexible film interposer and the bond pads of the second semiconductor die to the terminal pads of the interposer substrate. Either or both of the steps of mounting the first and second semiconductor die on the flexible film interposer can further comprise applying an adhesive element to the surface of the flexible film interposer and/or the surface of the die. The step of bonding can comprise forming contacts in the slots of the flexible film interposer and over the traces and the bond pads of the second semiconductor die, and extending bonding wires from the solder ball contacts to the terminal pads on the interposer substrate. The method can further comprise the step of encapsulating the stacked die assembly to form a semiconductor package.
The invention advantageously improves the interconnection between a die component and a carrier substrate such as an interposer or PCB, and eliminate the need for a metal re-distribution layer (RDL). The invention also provides a package with a reduced total assembly height. The invention additionally eliminates problems associated with prior art underfilling and alignment processes.
Preferred embodiments of the invention are described below with reference to the following accompanying drawings, which are for illustrative purposes only. Throughout the following views, the reference numerals will be used in the drawings, and the same reference numerals will be used throughout the several views and in the description to indicate same or like parts.
The invention will be described generally with reference to the drawings for the purpose of illustrating embodiments only and not for purposes of limiting the same. The figures illustrate processing steps for use in fabricating semiconductor devices in accordance with the present invention. It should be readily apparent that the processing steps are only a portion of the entire fabrication process.
The invention provides a flexible film interposer for stacking a tape base flip chip onto a second (bottom) die. Recesses are fabricated in the flexible film interposer for the first level interconnect using conventional die mount equipment. The flexible film interposer includes features to interconnect to the second die without the need for an RDL on the second die.
Referring to
According to the invention, the flexible film interposer 36′ comprises slots or recesses 38′ to facilitate a first level interconnection to the bottom die (not shown) by means of TAB or conventional wire bonding. The interposer 36′ also includes multiple recesses or vias 40′ for first level interconnection of the top die in a flip chip attachment.
The recesses 38′, 40′ can be formed through a first (upper) surface 42′ of the flexible film interposer 36′ by a method known in the art and appropriate to the material employed for the flexible film interposer 36′, for example, patterning and utilizing a chemical wet etch or dry etch, mechanical drilling or punching, and laser ablation.
Each of the recesses 38′, 40′ extend to a bond pad 44′ in the form of a conductive trace formed on the second (lower) surface 46′ of the interposer 36′. Such traces 44′ can be formed by etching a conductive layer disposed on the lower surface 46′ of the interposer, or by printing traces onto the lower surface using conductive ink. Preferably, traces 44′ comprising copper or a copper alloy are utilized.
As shown in a bottom plan view in
The multiple recesses (vias) 40′ are formed in the flexible film interposer 36′ in a preselected pattern and having a predetermined size and shape to correspond with a bond pad configuration formed on an active surface of a semiconductor die intended to be attached thereto. The recesses 40′ can be formed with tapered sidewalls (
The spaced apart recesses 40′ are formed in the flexible film interposer 36′ in a preselected pattern to correspond with the bond pads and bump configuration of the die (flip chip) to be attached to the interposer 36′. For example,
Optionally, an adhesive element 50′, 52′ can be disposed, respectively, on the first (upper) surface 42′ and/or the second (lower) surface 46′ of the flexible film interposer 36′. The adhesive elements 50′, 52′ can be utilized to secure a top (flip chip) die and a bottom die, respectively, to the flexible film interposer 36′. The adhesive elements 50′, 52′ can comprise any suitable adhesive material known in the art, including contact adhesives, thermoplastic adhesives and thermosetting adhesives, for example, an adhesive gel or paste such as a conventional epoxy or polyimide die bonding adhesive, and/or a double-sided adhesive tape such as polyimide. Adhesive element 50′ can have a thickness such that it functions as a spacer to control the degree of insertion of conductive bumps carried on the top die into recesses 40′. Although not shown, adhesive element 52′ can extend onto the traces 44′. The flexible film interposer 36′ can be provided in a pre-taped form with an adhesive tape attached thereto, or the adhesive elements 50′, 52′ can be applied to the flexible film interposer 36′ during fabrication of a stacked die assembly or package. In another embodiment (not shown), the adhesive elements 50′, 52′ can be applied to the active surfaces of the semiconductor die to be attached to the flexible film interposer 36′. Many suitable adhesive application methods for liquid or gel adhesive application are known in the art, such as screen printing, roller applicator, spray, and transfer. Similarly, an adhesive tape may be applied from a dispenser and severed from a roll of tape, or applied from a transfer (carrier) film.
As depicted in
Instead of utilizing the above-described underfill process (
In another embodiment, as shown in
The flexible film interposer and top die assembly 62′ is then mounted onto a second (lower) die 68′ that has been mounted onto an interposer substrate 70′ in a chip-on-board (COB) assembly 72′ to form the stacked die assembly 74′. As shown in
A conventional assembly process can used to prepare the COB assembly 72′. As shown, an active surface 76′ of the second die 68′ includes bond pads 78′ along the periphery thereof. The interposer substrate 70′ includes terminal pads 80′ on the first (upper) surface 82′. The die 68′ has been surface mounted onto the first (upper) surface 82′ of the interposer substrate 70′ by means of an adhesive element 84′, which can comprise any suitable dielectric adhesive known in the art, and be of any suitable form, for example, with a tape adhesive or die attach paste, as described with respect to adhesive elements 50′, 52′.
In the illustrated embodiment in
In another embodiment, the interposer substrate 70′ can comprise a PCB substrate, motherboard, or other like substrate, whereby the top die/interposer assembly 62′ and bottom die 68′ are mounted directly thereon, and external contacts 88′ are omitted. This structure functions as a board level device such as a module or a motherboard.
Referring to
In the illustrated example in
Referring again to
The method can be utilized to fabricate an assembly comprising additional stacked die layers, such as the embodiment depicted in
The flexible film interposer of the invention functions to redistribute and connect the bond pads of the bottom die to bond pads of the upper (flip chip) die, advantageously replacing the RDL (34) required in a conventional flip chip attachment, as in
In addition, the present package achieves a desirably low package profile. The package design also utilizes conventional underfill processes that are carried out on the surface of the flexible interposer substrate rather than the active surface of the bottom die, thus reducing yield and process difficulties.
In compliance with the statute, the invention has been described in language more or less specific as to structural and methodical features. It is to be understood, however, that the invention is not limited to the specific features shown and described, since the means herein disclosed comprise preferred forms of putting the invention into effect. The invention is, therefore, claimed in any of its forms or modifications within the proper scope of the appended claims appropriately interpreted in accordance with the doctrine of equivalents.
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|Citing Patent
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|Micron Technology, Inc.
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|Jul 22, 2013
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|U.S. Classification
|257/686, 257/777, 257/698, 257/723, 257/773, 257/685, 257/737, 257/738, 257/778, 257/774
|International Classification
|Cooperative Classification
|European Classification
|May 8, 2012
|Certificate of correction
|Aug 12, 2015
|Fee payment
Year of fee payment: 4
|May 12, 2016
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Effective date: 20160426


text:
our mailing list. It's so wizard.
by Pizzo
7 July, 2010@4:26 pm
1 comments
7 July, 2010@4:26 pm
1 comments
This home cooked remix has been making the rounds the last few days…. Cookin Soul had this to say:
"It´s Summertime and we had to do somethin special, everybody knows the classic "Summer in the city" by Quincy Jones, we decided to take it to Brooklyn, mixin Jay-Z and Lil Wayne vocals from Hello Bk,
addin some new fantastic visuals based on typography and still images of Brooklyn. Production, SFX, animation and edit by Greg Solenström."
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1 Responses to "Jay-Z Ft. Lil Wayne – "Summer in Brooklyn (Quincy Jones Cookin Soul Remix)" (Video)"
Whoa An Acapella with a quincy jones beat, how long did that take to make.. 2 minutes!
it surprises me what makes it on this site, as for the video looks like a first year design student made it,mad props hiphopsite.com mad props
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subset: commoncrawl


text:
6,300 USC students potentially at risk of identity theft
Fri, 28 Jun 2013 20:47:31 GMT —
COLUMBIA (WACH)- Students at the University of South Carolina have been sent letters due to having their personal information on a stolen computer.
USC spokesperson, Wes Hickman, says the computer with student's full names and social security numbers was put into service in January of 2010.
"Every student that received a letter gets an individualized toll free number", says Hickman. "They can call that number to get counseling and guidance on how to proceed forward."
Thus far, according to Hickman, no one has been affected.
The laptop was reported missing in April, and used to generate and grade tests.


text:
The Beatles' "Let It Be" doesn't fit the stereotypically stuffy confines of a classical piano class.
One of Chopin's nocturnes or a snippet from Beethoven's Fifth Symphony might seem the more conservative selection.
But this isn't the traditional conservatory setting, as evidenced by the fleet of high-tech digital keyboards and the animated University of North Florida undergrads using them to pound out the harmony to Paul McCartney's ballad.
The school boasts the nation's first and only lab equipped with the newest run of Clavinovas, a digital keyboard line made by Yamaha that instructor Erin Bennett called the gold standard for piano instruction.
An introductory run of 25 pianos was donated through a collaboration between the university, Yamaha and Jacksonville's Keyboard Connection, and new models will be cycled through every year.
The three different models of the tech-friendly pianos cost several thousand dollars each. They have Ethernet ports to download sheet music, allow students to link up and collaborate remotely and contain synths and other sounds effects that mimic a full-fledged orchestra.
Mercedes Beckman, a freshman in jazz studies with a concentration in saxophone, said the Clavinova's catalogue of sounds is awe inspiring and even made her a little envious.
"I'm almost kind of jealous," Beckman said. "I'm a jazz saxophone student, but the sound effects sound better than I can do. It's saying a lot compared to the old pianos in the lab. The sax sounded like a duck."
Bennett agreed. She said students weren't so enthused by the equipment last semester. The previous instructional keyboards were purchased in 2001, and they were showing their age.
"The keyboards were, for lack of a better word, relics," Bennett said. "Eight or nine years is a long time for digital piano technology, and it made it difficult for the students. But these new keyboards have really opened up the class experience."
The scenery is vastly improved as well. The lab was relocated from a dinky facility that could barely accommodate 20 people to a much larger room that can easily hold all of the students and their new equipment.
The improvements have helped bolster UNF's already strong music department. The school is known as a jazz powerhouse, but the classical program has been booming since the Clavinova donation.
The number of piano majors is up to 20 — double what it was last year. And the department is now offering a piano pedagogy major for students who would rather teach than perform.
About 60 students have taken advantage of the new technology so far, and more classes are expected to try them out next semester.
Jack Melvin from Keyboard Connection said the collaboration between his business, UNF and Yamaha is beneficial to all parties. Yamaha and Keyboard Connection get to market the new Clavinovas with the backing of UNF, and the school gets to show off its new, one-of-a-kind lab. The real winner, though, is the student body.
"These are the best you can ask for in terms of practice," Melvin said. "They have all the necessities to make learning to play the piano a fun and rewarding experience. It was an easy sell to bring these keyboards here because UNF is one of the best and the students deserve the best equipment."
Bennett said the donation has had other unexpected side effects. She's started sensing a little occupational envy from her colleagues at other colleges.
"I posted about the Clavinovas on Facebook, and I think there was some jealousy going on," she said. "Everyone wants to get their hands on these. It's an honor to get to teach students the using top-of-the-line."
(904) 359-4654


text:
Accurate Powder features a large assortment of smokeless powders for serious loaders who want high impact for any type of firearm-including handguns, rifles, or shotguns. Accurate Powder carries a powder tailored for the type of shooting you do, whether it's full power powders for hunting or long range rifle shooting to reduced powders for cast bullets, cowboy action, handgun or target loads. If you want consistent loads that stay on target, get the advantage of Accurate! 4064: This short cut extruded propellant. It was originally designed for the .30-06 Springfield. It's a versatile powder that performs exceptionally well with calibers such as .22-250, .220 Swift, .243 WSM, 7x57 Mauser, 7mm-08 Rem, and the .325 WSM. 4064 has a large following among M1 Garand enthusiasts.
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text:
GUADALAJARA, Mexico – A couple of the usual American suspects in Latin America were not involved for their teams this weekend, but there were some important victories involving Yanks down south.
José Torres' Pachuca had gone four games without tasting victory, but got a last-minute goal to beat Atlante 3-2 on Saturday.
Torres put in a 64-minute shift in the center of Pachuca's midfield, but was hauled off to be replaced by striker Guillermo Franco after Atlante went down to 10 men and los Tuzos searched for the three points.
The win moved Pachuca into sixth place in the Mexican Primera División and on course for the playoffs with just six games left of the regular season.
A berth in the postseason for Michael Orozco Fiscal's San Luis may be a big ask, but the team's 1-0 road victory on Sunday over DaMarcus Beasley's Puebla was certainly welcome relief; it was the team's first win since Jan. 13.
Orozco Fiscal played the full 90 in the heart of the Gladiadores defense, getting booked for a mistimed tackle early in the game, but putting in another solid performance.
It was San Luis' second clean sheet in two games, both since Orozco Fiscal was reinstated into the starting XI.
The game at Estadio Cuauhtémoc wasn't rosy for Beasley, whose Puebla side is on the slide after five straight defeats. Beasley played the full game on the left wing for La Franja, but poor finishing means Puebla coach Juan Carlos Osorio's job could be on the line, according to various press reports.
In the Estadio Universitario on Saturday evening, only Edgar Castillo was involved for Club Tijuana in their 1-0 loss against defending champions Tigres UANL. Castillo again completed the full game, causing problems for the Tigres defense down the left flank.
Jonathan Bornstein didn't make the 18 for Tigres, nor did Greg Garza for los Xolos, while teammate Joe Corona is away with the US Under-23s.
Santos Laguna's in-form striker Herculez Gomez was left back in Torreón with three other regular starters for the team's 1-0 win against Cruz Azul on Saturday. The coaching staff decided to rest the players due to the busy schedule and with the CONCACAF Champions League semifinal series against Toronto FC coming up in a little more than a week.
Further south, Jeff Cunningham missed out on Comunicaciones' 2-0 win against Marquense, which takes them to the top of the Guatemalan league. Cunningham injured his right knee in training during the week but should be ready for Wednesday, when Comunicaciones play Municipal in Guatemala's clásico.
In Bolivia, Alejandro Meleán went 90 minutes for Oriente Petrolero's 2-2 tie with San José.
Tom Marshall covers Americans playing in Latin America. He can be reached via firstname.lastname@example.com


text:
Gateway Apartments
Select your stay dates to check availability at Gateway Apartments
Gateway Apartments
About the Hotel
Property Location
A stay at Gateway Apartments places you in the heart of Leeds, walking distance from Leeds Minster and West Yorkshire Playhouse. This apartment is within close proximity of Royal Armouries and The Tetley.
Make yourself at home in one of the 15 guestrooms, featuring kitchens with full-sized refrigerators/freezers and stovetops. Flat-screen televisions with digital programming provide entertainment, while complimentary wireless Internet access keeps you connected. Private bathrooms with shower/tub combinations feature deep soaking bathtubs and complimentary toiletries. Conveniences include microwaves and coffee/tea makers, and housekeeping is provided once per stay.
Rec, Spa, Premium Amenities
Make use of convenient amenities, which include complimentary wireless Internet access and tour/ticket assistance.
You can enjoy a meal at a restaurant serving the guests of Gateway Apartments, or find a snack in a coffee shop/café.
Business, Other Amenities
Self parking (subject to charges) is available onsite.
Hotel Facilities
- Elevator/lift
- Total number of rooms - 15
- Tours/ticket assistance
- Self parking (surcharge)
- Free WiFi
- Smoke-free property
- Number of buildings/towers - 1
- Restaurant
- Number of floors - 7
- Coffee shop or café
Room Facilities
- Free toiletries
- DVD player
- Private bathroom
- Dishwasher
- Coffee/tea maker
- Cookware, dishware, and utensils
- Rollaway/extra beds available
- Shower/tub combination
- Digital TV service
- Stovetop
- Microwave
- Free WiFi
- Flat-panel TV
- Housekeeping - once per stay
- Full-sized refrigerator/freezer
- Deep soaking bathtub
- Kitchen
- Cribs/infant beds (surcharge)
Hotel Policy
Know Before You Go
- No pets and no service animals are allowed at this property.
The following fees and deposits are charged by the property at time of service, check-in, or check-out.
- Self parking fee: GBP 12 per day
- Crib (infant bed) fee: GBP 25 per stay
- Rollaway beds are available for an additional fee
The above list may not be comprehensive. Fees and deposits may not include tax and are subject to change.
Mandatory Fees and Taxes
You'll be asked to pay the following charges at the hotel:
- Deposit: GBP 200 per stay
We have included all charges provided to us by the property. However, charges can vary, for example, based on length of stay or the room you book.Show all hotel policy Show less hotel policy


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To make reservations by phone, call 1-800-228-2800 in the USA and Canada (or any of our worldwide reservation telephone numbers).
Welcome to the Fairfield Inn & Suites Dover, located near Dover Downs and just one mile from the historic downtown Capitol of Delaware, off of Route 13.
Our hotel's combination of contemporary style and comfortable surroundings will put you at ease and help you stay productive or just relax.
Lobby Seating Area
Sit back and enjoy the bright, energetic décor in our lobby seating area while gathering with friends, family or co-workers.
King Guest Room
Our spacious and comfortable guest rooms and suites with one king-size bed feature luxury bedding, a 32-inch flat-panel HDTV with HBO, a well-lit work desk, and complimentary wireless high-speed Internet access.
Double/Double Guest Room
Our spacious and comfortable guest rooms with two double beds feature luxury bedding, a 32-inch flat-panel HDTV with HBO, a well-lit work desk, and complimentary high-speed Internet access.
Double/Double Suite
Stretch out and relax in one of our suites featuring two double beds and separate sitting area with pull-out sofa bed. Perfect for families or long stays, you'll find a mini-fridge, microwave, 32-inch flat screen TV and free high-speed Internet and Wi-Fi at your fingertips.
Suite Sitting Area
Whether you want to stay productive or just relax, our spacious suites offer the perfect environment with a well-lit work area, complimentary wireless high-speed Internet access, free local calls, and the comfort of Marriott's signature bedding. A separate living area features a sofa bed, microwave, mini-fridge and 32-inch flat screen TV.


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TouchPal Keyboard - TouchPal, the future of input!
**Old user please read our FAQ before updating**
Annoyed by typing errors on touchscreen?
Wanna try the new sliding instead of tapping?
Now you have a choice! TouchPal Keyboard, the most innovative and the best keyboard on Android! It's the Global Champion of GSMA Mobile Innovation Award.
Unique patented technologies of TouchPal Keyboard:
1. TouchPal Curve - the first predictive sliding in the world! Pause in the middle of sliding to get long words predicted.
2. Intelligent next-word prediction. It may save up to 80% keystrokes.
3. Magic mistyping correction on Full QWERTY layout. Blind typing is no longer a dream!
4. Mixed language input allows auto language detection. No need to switch languages.
5. Innovation of T+ dual-letter layout. Bigger keys than QWERTY.
Other features:
- Multi-lingual support (download language packs after installation)
- Voice input (Android 2.2+)
- Outstanding dictionary with online update
- Import contact list to your user dictionary
- Backup/restore user dictionary in SD card
- Slide down on keys to quickly input number and symbols
- Fantastic sliding experience
Installation Instruction:
After installation, you can choose our input method in the "Setting" => "Local & text
TouchPal Keyboard - TouchPal, the future of input!


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By WILLIAM E. GEIST
Published: July 6, 1986
Campers rose from their sleeping bags early yesterday at the intersection of the Long Island Expressway and the Grand Central Parkway, awakened by planes roaring out of La Guardia Airport.
''Same as Minnesota,'' remarked Scott Lohman, crawling out of his tent to wash his hair beneath a water spigot at the campsite. ''Up there it's the darned birds that wake you, here it's the airlines.''
Another urban camper, exaggerating - somewhat - his proximity to the roadway, said he could not sleep anyway, for fear a car would go off the shoulder and run over him.
Perhaps only in the effervescence of Liberty Weekend could the phenomenon of New York City camping have been born. To the amazement of Parks and Recreation Department officials, Mayor Koch exuberantly announced weeks ago that to handle the overflow crowds expected for Liberty Weekend, he was throwing open the parks to campers and recreational vehicles for the first time in the city's history.
Despite the dire warnings of folks back home that they would forever be considered crazy in their own hometowns and that at a minimum they would be mugged in New York, 1,119 campers from throughout the nation and several foreign countries took Mr. Koch up on his offer - 700 in recreational vehicles at South Beach on Staten Island, and 419 in tents at Flushing Meadows-Corona Park.
''Camping in New York?'' Joyce Wittrock recalls shrieking back at her television set in Fort Thomas, Ky. ''Nooooo!'' She and a friend had to drive up to see it - and the Liberty Weekend festivities, of course - for themselves.
Some of the campers said they considered purchasing additional gear -hand grenades, for example - for their New York camping experience, but several of them said yesterday that this camping trip was as enjoyable as their recent trips to the Smoky Mountains, Rocky Mountains and the Adirondacks.
''I have never felt safer,'' said Art Fournier, who rode his motorcycle 3,024 miles from Anacortes, Wash., for Liberty Weekend. The campsite, on the shore of Meadow Lake, was surrounded by a fence and a squadron of city policemen and park rangers.
''Me, either,'' said Beverly Croyle, a camper from Cleveland, who was heating some coffee over Sterno and hanging some wet towels on a clothesline stretched between two trees. ''And the scenery is spectacular,'' said Mrs. Croyle, who was faced not toward traffic on the Grand Central Parkway 50 feet behind her, but toward the waterfowl alighting on Meadow Lake. ''Not quite Grand Canyon, but close.''
''I admit I was very leery about coming to New York,'' Mrs. Croyle said. ''I could not imagine camping in the middle of New York City.''
''Are you sure we're actually in New York?'' asked her daughter, Michelle. It was a serious question.
''I think so,'' Mrs. Croyle answered, ''but it sure does not live up to its awful reputation. The subways have been great and the police here are cheerful.'' Mr. Lohman said a policeman had delivered a morning newspaper to his tent and had given him directions to the festivities.
When Mr. Lohman told the cabdriver who picked him up at the airport to take him to the New York City campground, the cabby pulled over and let him out on the expressway, thinking - in Mr. Lohman's own words - ''I was nuts.''
Mr. Lohman, of Moline, Ill., said it suddenly struck him that his friends had said they would meet him in New York for a weekend of camping, that he had believed them and that he was the target of an enormous practical joke.
''I like camping here a lot,'' he said. ''You don't have to keep your food up in the trees. The wildlife here is a little different.''
Another camper, Paul Carlass, of Watford, England, said, facetiously, that he came to New York because ''the camping is so bad in London.'' Mr. Carlass came to New York with his sleeping bag on Liberty Weekend, not knowing where he would stay. He spent Wednesday night in Battery Park, an unsanctioned camping area.
''It's like Live-Aid,'' said Mr. Carlass, who is to return home today, ''you have to go. It's a once-in-a-lifetime experience. It has been well worth the trip.''
Another camper, Ed Fletcher, hitchhiked to New York from Albuquerque, N.M., carrying an American flag and a four-foot-high Styrofoam cut-out of the Statue of Liberty, ''to appeal to the emotions of drivers.'' It worked. ''I would have to say New York camping is the ultimate,'' he said, without elaboration.
South Beach Parking Lot No. 4 on Staten Island was invaded by herds of recreational vehicles sporting license plates from throughout the country. Albert and Jeanette Stevens traveled 1,400 miles from Baton Rouge, La., in their Coachman motor home, equipped with air-conditioning and a king-size bed, for a weekend of camping in New York, despite being admonished at home that only camping in Beirut sounded worse.
Campers began checking in Thursday at noon and will check out today. Permits for the entire stay were $30 for recreational vehicles on Staten Island and $5 for the campsites in Queens. ''People back home will die when they hear we stayed for three nights in New York for five bucks,'' said Michelle Croyle.
''I think this country needs an urban camping program,'' Mrs. Croyle said. ''Young people should see the cities and they can't afford them.'' Parks Commissioner Henry J. Stern said things had gone so well he wanted to have urban camping again.
Mr. Fournier said his next stops were Yellowstone National Park and Mount Rushmore, but that frankly he did not expect them to be as nice as this.
''This is something we can all tell our children about,'' Mr. Lohman said, referring to the distinction of being a member of New York's first group of campers. Others in his camping group said they were not so sure it was a good idea to tell anybody.
Photo of a camper sleeping al fresco at Flushing Meadows-Corona Park in Queens (NYT/Joe Traver)


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Realms of Arkania - HD Remake Announced!
Thanks to Kordanor for letting us know that a HD remake of the Dark Eye Northland Trilogy is in the works. The three games were released internationally under the name Realms of Arkania ... Blade of Destiny, Star Trail and Shadows over Riva. Especially the middle part is widely regarded one of the best RPGs of all time.
The project is a cooperation between original developer Attic, publisher UIG and the Austrian developer Crafty Games.
At the moment the German and English PRs contradict each other. It remains unclear whether the game slated for a release in Q2/13 is the full trilogy or only the first game, Blade of Destiny HD. Here's the full English PR:
A legend reborn as Realms of Arkania - Blade of Destiny returns
2013-01-28 10:47
Developed by Austrian developer Crafty Games, Realms of Arkania – Blade of Destiny is a one-to-one remake of the 1992 original, adored by a generation of Role Players and one of the most successful German RPG's of the 1990's. Get ready to return to Thorwal, one of the oldest cities of Aventurien. Make sure your wits are sharpened before walking down the small alleys of Thorwal and Prem, and prepare to stop the Orcisch threat while creating a mighty alliance between nations. Featuring a complete visual reimagining along with a comprehensive overhaul of every aspect of the
gameplay, Realms of Arkania – Blade of Destiny is set to captivate a 21st century audience of new and old fans alike.


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The Independent 'i' by Beattie McGuinness Bungay
SectorMedia / Entertainment Brands and Newspapers
The Independent announces its new paper, i, with a new outdoor campaign.i, the UK's first quality daily newspaper to launch in almost 25 years, will go on sale nationwide on Tuesday October 26, 2010. Created by The Independent, i is designed for readers who want a concise, quality daily paper for just 20p.
Available on Mondays to Fridays, i will complement an improved Independent, which will have a distinctive new look and feel, and remain priced at £1.
i is specifically targeted at readers and lapsed readers of quality newspapers, and those of all ages who want a comprehensive digest of the news in printed form. i will combine intelligence with brevity, and depth with speed of reading, providing an essential daily briefing. The launch will be backed by a significant outdoor advertising campaign, created by Trevor Beattie of the BMB agency.


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Happy 2009!
It was 40 years ago (last week) that the crew of Apollo 11 snapped remarkable photos like this one, while orbiting the Moon and reading the first lines in Genesis. I found this oped piece to be quite profound, except it's a litlle iffy in hard science: Not-So-Lonely Planet Seems that life on this planet is a lot more resiliant than you think. Over the past 4 billion years we've been battered by meteors, asteroids (the Moon? Oh, that used to be a hunk of molten rock settled in what is now the Gulf of Mexico. Then it was splashed into space by an asteroid) and life on Earth has SURVIVED. Heck, human beings are a footnote in this story. It was only 25,000 years ago that we silly primates were given the gift of speech. From that evolved symbols and writing. I hate to break it to you, but 25,000 years is just a notch in the clock of that wondrous beauty, Mother Earth, that we call home. Not when you're at least 4,000,000,000 years old. Happy 2009 everyone!


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Manhattan School of Music's Charles Myers Recording Studio provides professional audio and video recording services to students, faculty, staff, alumni, and members of the community at large. The Studio features a state-of-the-art digital multitrack facility capable of recording events in all of the School's main performance spaces, including orchestra and jazz ensemble concerts, operas, master classes, and student and faculty recitals. The Studio is available for audio and video private recording sessions, creation of audition and competition recordings, CD duplication and audio media transfers. HD video recording capabilities for student recitals and private recording sessions are available in the William R. and Irene D. Miller Recital Hall and the Solomon Gadles Mikowsky Recital Hall. Live video streaming of student recitals is available for recitals that take place in Miller Recital Hall. Myers Recording Studio also provides live sound design for big band jazz ensemble performances and musical theater productions.
Manhattan School of Music performances, master classes and concerts that are recorded each year are available for listening purposes in the Peter Jay Sharp Library. In addition, all orchestra and opera performance recordings are streamed on the Library web site following each concert, giving students immediate access to recorded performances. Myers Recording Studio maintains the historical audio archive collection of the many Manhattan School of Music performances recorded over the years. Panel discussions and workshops on recording and recording-related topics such as How to Make the Most Out of Your Recordings and Introduction to Sound Recording for Musicians are offered on an ongoing basis.
MSM performances recorded by Myers Recording Studio are also broadcast regularly on various radio stations, including WQXR and WWFM. MSM's ongoing partnership with WWFM—the Classical Network—offers the opportunity for select student performances at MSM to be broadcast throughout the school year on their program, Celebrating Our Musical Future.
Myers Recording Studio regularly produces recordings for commercial release, including opera and jazz performance recordings released on Albany Records and Jazzheads respectively. In addition, Myers Recording Studio produces a commemorative compilation CD each year featuring outstanding performances from the MSM community.
Myers Recording Studio is part of the Distance Learning and Recording Arts Department at Manhattan School of Music. In addition to extensive recording services, this department produces interactive educational videoconference programs involving students and faculty members including masterclasses, clinics, coachings, private lessons, educational & community outreach, and professional development sessions with institutions of higher education, K-12 schools, and community organizations in 46 of the 50 states and 35 countries. Myers Recording Studio provides audio support for all MSM distance learning programs.
Find out more about Distance Learning >
Chris Shade
Recording Services Manager
917 493 4075
120 Claremont Avenue New York, NY 10027-4698 | Map | Main: 212 749 2802 | Box Office: 917 493 4428 | Contact
Copyright 2016 Manhattan School of Music


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-K, --kernel-module-only
Install a kernel module only, and do not uninstall the existing driver.
This is intended to be used to install kernel modules for additional ker-
nels (in cases where you might boot between several different kernels). To
use this option, you must already have a driver installed, and the version
of the installed driver must match the version of this kernel module.
1. Boot with the new kernel.
2. Then cd to the following directory : /lib/modules/OLDKERNELVERSION/kernel/drivers/video/
(replace OLDKERNELVERSION with your own specific version)
3. Make a copy of the old driver: "cp nvidia.(k)o nvidia.(k)o.old"
4. Run the Nvidia installer
(this will create the new driver in /lib/modules/CURRENTKERNELVERSION/kernel/drivers/video/)
5. In the same directory mentioned under 2 do a rename to the original name
"mv nvidia.(k)o.old nvidia.(k)o"


text:
Skip to Content
by Wayne Wood | Wednesday, Jan. 22, 2014, 8:43 AM
The beginning of this week saw spring like temperatures, and by the middle of the week we were shivering through another Arctic blast.
As this winter continues to take many parts of the country on a temperature roller coaster ride, many people find themselves using pain relievers or other remedies to deal with runny noses and other symptoms associated with sinus and allergy problems.
John Fahrenholz, M.D., medical director of the Vanderbilt Asthma, Sinus and Allergy Program, says that such changeable temperatures can be a real challenge for people who have allergies—and even for people who don't.
"People who know they have year-round allergies should make sure to take their allergy medications daily during such times," he said.
But even those of us who don't suffer from allergies can develop a runny nose when the temperature and humidity change rapidly. A congested, runny or itchy nose–what doctors call vasomotor rhinitis–can occur in the midst of rapidly changing weather.
Here are a few guidelines from Fahrenholz to help you—and your nose—through crazy weather changes:
Media Inquiries:
Wayne Wood, (615) 322-4747
releases, Reporter allergy, Asthma Sinus and Allergy Program, cold weather tips, Fahrenholz
There are lots of ways to keep up with Vanderbilt. Choose your preferred method:


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One to watch: Carlisle United goalkeeper Mark Gillespie
It was an emotional season for Carlisle United, and few players experienced the highs and lows like Mark Gillespie.
In October he was the hero when Carlisle took Liverpool to penalties in the League Cup at Anfield, saving from Philippe Coutinho and Adam Lallana and winning man of the match. But in December when floods hit Carlisle, Gillespie had to be rescued from the first floor window of his house as water closed in. Gillespie was then one of the Carlisle players who led the volunteering operation to repair the damage done.
It ended up as a disappointing season for Carlisle, who finished 10th in League Two despite early hopes of promotion. But through it all Gillespie was arguably their most consistent player, impressing with his agility, reflexes and distribution.
Carlisle stand out in League Two for their willingness to get the ball down and play. Gillespie told The Independent last year that manager Keith Curle has instituted a "very strict passing game" at Brunton Park, and it shows.
Gillespie has been working very hard on his kicking and how he is one of the best keepers with his feet in the lower leagues. He achieved an 81 per cent distribution success rate last season, better even than Jon McLaughlin, who won Leauge One goalkeeper of the year after impressing in Burton Albion's promotion campaign.
That is why Gillespie is thought to be ready for a step up into the higher divisions, and why Charlton Athletic are considering a £150,000 move for the 24-year-old. He started off at Newcastle United as a boy, he is from Throckley just outside the city, but was released at 16 for not being big enough.
His early years at Carlisle were disrupted by knee injuries, but having overcome those and established himself as a regular he is now one of the more impressive young English goalkeepers in the lower leagues.
- More about:
- Carlisle United
- Mark Gillespie


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(Excerpt from Dr. Judith Orloff's national bestseller The Power of Surrender: Let Go and Energize Your Relationships, Success, and Well-Being)
A soul mate relationship is based on trust, commitment, and a strong desire to be together.
Still, despite this powerful bond, it's also true that your hearts will be stretched in countless ways. The danger, especially during challenging times, is that you may be vulnerable to having an emotional affair. This can damage trust and stop you from surrendering to the growth needed for your relationship.
What is an emotional affair?
I describe it as when you turn to a friend or co-worker for emotional (not physical) intimacy. The seduction is that this person gives you what you feel your mate doesn't: support, ego boosts, empathy, playfulness, an undercurrent of flirting or attraction. Initially, this can seem innocent but you may begin to share more with this "safe" person than with your mate.


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[lin_video src=http://eplayer.clipsyndicate.com/embed/player.js?aspect_ratio=16×9&auto_next=1&auto_start=0&div_id=videoplayer-1374104867&height=480&page_count=5&pf_id=9624&show_title=1&va_id=4146329&width=640&windows=2 service=syndicaster width=640 height=480 div_id=videoplayer-1374104867 type=script]
HOOVER, Ala. (WIAT) — We've been told that nearly half of Hoover's students who can use school buses for transportation to and from school will not have that option in August of 2014.
Today, we heard that it could impact the jobs of 140-150 transportation employees according to Hoover City Schools spokesperson Jason Gaston.
About that many transportation employees met with the district's Assistant Superintendent and the Director of Transportation at Hoover High School Wednesday afternoon.
Some of the drivers were so outraged that they walked out of the meeting early. One bus driver who is entering her 12th year got a little emotional and had a message for students who don't have any other options, but bus transportation.
"Stability and education is the only way that they are going to make it in life and I've always been an advocate for children and I just want to tell them to hold on and to be strong and to go to school," said Lisa Chasteen, a Hoover bus driver.
She also criticized the decision to cut transportation and says there are other ways to save money, like rezoning to prevent unnecessary fuel expenses.
"You know they pass schools to go to their schools that they've been zoned for. Personally it's 20 miles a day extra to take those kids to schooL," said Chasteen.
Gaston says the district is willing to work with the employees to help them find other jobs, adding that some already have job offers and others are of retirement age.
Twenty-four-year veteran bus driver Maggie Fikes says her job is safe because she drives a special education bus and that service will not be impacted. Her thoughts are with her fellow drivers who may not be so lucky.
"The Hoover schools need transportation because of the way they built the schools… the way the roads are made…there's not sidewalks for people to walk," said Fikes.
Fikes adds that there are serious traffic problems on the horizon when thousands of additional vehicles hit the roads every morning and afternoon.
"And you're talking about late times? Whew! I hope they figure out a way to reroute the traffic," said Fikes. "You know how many buses we have and they are fully loaded, majority of them."


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Have you missed me? I know you have. I've missed myself…
Wait, that sounded totally wrong. I meant I've missed all of you!
My sincerest apologies for the lapse in baking goodness, but sometime life gets in the way of hobbies and sometimes people get a little burnt out (GASP! I know…). It's true; I can admit it: The Pint-Size Baker got a little burnt out. However, a couple of Sundays ago, I attended my first ever baking class run by a woman named Jamie who has her own cookbook (along with her partner Jill) and it reignited my passion!
Be sure to check Jamie and Jill out at Two Chicks from the Sticks, and stay tuned because the Pint-Size Baker is back!


text:
"Activism Now Terrorism?" - More On the Green Scare

From: <a href="http://www.greenisthenewred.com/blog/abby-martin-activists-targeted/6539... Is the New Red
"Activism Now Terrorism?" — TV Interview with Abby Martin
Huge thanks to Abby Martin for having me on her show this week to talk about grand juries <a href="http://www.greenisthenewred.com/blog/pacific-northwest-grand-jury-subpoe... anarchists and animal rights activists. We also looked at how this fits into the broader political climate and legislation like the Animal Enterprise Terrorism Act. Martin has been following these issues closely, and I think it made for a good discussion. Hope you like it too. Video after Read More		</...

Anonymous (not verified)
Sun, 11/04/2012 - 11:12
Its a shame that he had to
Its a shame that he had to appear on Russia Today to get more info out about this story. Russia Today is a state-owned tv station that is really into conspiracy theories.
Anonymous (not verified)
Sun, 11/04/2012 - 11:14
wait, so you actually have
wait, so you actually have more respect for say nbc than you do RT? hate to break it to yo but all channels are shit of one smell or another.
Anonymous (not verified)
Sun, 11/04/2012 - 11:17
who said anything about NBC?
who said anything about NBC?
Anonymous (not verified)
Sun, 11/04/2012 - 11:21
Does NBC have
Does NBC have "Anarcho-capitalists" making fun of Anarchists and promoting Ayn Rand/Ron Paul philosophy as the "REAL ANARCHISM" ?
NBC is just as bad as all mainstream media, but Russia Today is weird as hell.
Anonymous (not verified)
Sun, 11/04/2012 - 19:19
Russia Today is far worse
Russia Today is far worse than NBC, and only slightly better than Press TV.
Anonymous (not verified)
Sun, 11/04/2012 - 11:19
Russia Today=Conspiracy
Russia Today=Conspiracy Theory Headquarters
For folks that are into right wing conspiracies like 9/11 Truth, Federal Reserve Conspiracy, wacky chemtrails, Illuminati, etc. Alex Jones/Ron Paul type stuff. "Anarcho-capitalist" (also known as Nationalist Capitalists/Ayn Rand worshippers) Adam Kokesh had a comedy show on there.
" RT has provided a "disproportionate amount of time to covering Ron Paul, wondering aloud why the presidential candidate and his vision of the United States don't get more attention from the mainstream media."[61] RT cancelled Ron Paul supporter Adam Kokesh's show Adam vs. The Man soon after an FEC complaint was filed charging a political contribution had been made by a foreign corporation. Kokesh denies that was the reason his show was cancelled"
Anonymous (not verified)
Sun, 11/04/2012 - 12:09
So you just decided, as a
So you just decided, as a loyal State shill, to throw in the conspiracy theory basket anything that's not being covered by Western CORPORATE media for political reasons, that RT will cover?
Go to hell, Obamana cake! Caught with yo pants down.
Anonymous (not verified)
Sun, 11/04/2012 - 12:22
? I'm anti-state and
I'm anti-state and anti-capitalism, which doesn't make me an Obama person if you understand things well, which I assume you don't. Conspiracy theories are a right-wing idea that ultimately reenforce the idea of a State.
The state itself is a conspiracy.
Conspiracy theories serve as fictional narratives which move people away from confronting more tangible problems like the State and Capitalism.
Anonymous (not verified)
Sun, 11/04/2012 - 17:36
Good analysis. Never thought
Good analysis. Never thought of it so succinctly as that. Would buy you a beer or tea or something if this wasn't the stupid internet. cheers!
Anonymous (not verified)
Tue, 11/06/2012 - 20:02
Conspiracy theories are
Conspiracy theories are neither right wing nor left wing. And the way you use conspiracy theories derisively shows you know nothing about them. Many conspiracies are true, many are not. Calling something a conspiracy is a thought stopper.
Anonymous (not verified)
Mon, 11/05/2012 - 01:07
Is terrorism the new
Is terrorism the new activism?


text:
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I love taking advantage of Albuquerque's Bosque when I am shooting down in The Duke City! El Bosque (the forest) is by the Rio Grande and much more lush than a lot of places in Albuquerque. The cottonwoods are both new and old, and give us both needed shade and beautiful lines in the backgrounds of our photos.
I had a wonderful time "playing" down by the river, especially with these kids. The hike with this family (and their dog) was fun and adventurous, an outstanding day out of the office!
Springtime is a perfect time to call us to capture your children's smiling faces and Easter outfits! Usually at this time of year, we have some green buds on the trees and some kind of flowering tree that look beautiful in your photographs. Did you know that all of our photo sessions include an outfit change just in case you would like to get some photos that are a bit more casual and some photographs that are a bit more dressy?
About once a month, I drive to Albuquerque to take care of clients who are not able to make it up to Taos. Driving only an hour or two away can sometimes make a huge difference in the way of weather. While the leaves had been falling off of the trees for several weeks in Taos, the backgrounds in Albuquerque were still green!
This photo shoot was done at Los Poblanos Farms in Los Ranchos de Albuquerque. The mums add a perfect feeling of autumn and these kids were dressed in lovely fall colors as well.