text:
|Publication number
|Publication type
|Application number
|Publication date
|Oct 19, 2004
|Filing date
|Jun 24, 2003
|Priority date
|Jul 8, 1996
|Fee status
|Also published as
|Publication number
|Ernst Hendrik August Granneman, Frank Hunssen
|Original Assignee
|Asm International, N.V.
|Export Citation
|BiBTeX, EndNote, RefMan
|Patent Citations (54), Non-Patent Citations (6), Referenced by (14), Classifications (26), Legal Events (4)
|External Links: USPTO, USPTO Assignment, Espacenet
This application is a continuation of U.S. application Ser. No. 09/717,702, filed Nov. 20, 2000 now U.S. Pat. No. 6,613,685, which is a continuation of U.S. application Ser. No. 09/227,564, filed Jan. 8, 1999 (U.S. Pat. No. 6,183,565, issued Feb. 6, 2001), which is a continuation-in-part of International Application No. PCT/NL97/00398, filed Jul. 8, 1997, which claims priority from Netherlands Patent Appln. No. 1003538, filed Jul. 8, 1996.
The present invention relates to a method for contactless treatment of a substrate such as a semiconductor wafer, comprising enclosing the wafer in an apparatus and applying two gas streams, in opposing directions, from first and second side sections located opposite on another, to the two opposing planar sides or surfaces of the wafers.
A method of this general type is disclosed in Netherlands Laid Open Application 8402410, in which furthermore, reference is made to Netherlands laid Open Applications 8103979, 8200753 and 8203318.
From these publications it is known to position a wafer such that it is floating between the two side sections. If the gas flow is suitably chosen, it has been found that a highly accurate definition of the position of the wafer with respect to the side sections is possible and this position is relatively fixed, that is to say little variation occurs in the position of the wafer with respect to the side sections. In the patent publications concerned it is described that the wafer is subjected to a wet treatment and is then possibly dried. For the purposes of drying, the gas which holds the wafer in place is heated to about 100� C. and is moved over the surface of the wafer, as a result of which the moisture present is automatically removed.
Heating to much higher temperatures in the range of 200�-1200� C. is frequently necessary when treating semiconductor substrates. Heating can involve annealing or raising the temperature to make deposition or other processes possible. In the prior art, wafers are to this end placed in furnaces and then heated. Although this method is adequate, it has at least two disadvantages. Firstly, a method of this type is usually not completely contactless, that is to say certain points of the wafer are supported. Secondly, it takes a relatively long time to heat a wafer. This is due not so much to the thermal capacity of the wafer itself as to the relatively slow heat transfer between the furnace and the wafers and to the fact that in order to achieve a controlled, deformation free heating of the wafers, the wafers need to be heated inside the furnace together with the furnace itself
In order to solve this problem single wafer systems have been disclosed with which rapid heating was achieved with the aid of high power lamps (50-80 Kw). Such a method is particularly expensive and difficult to control.
U.S. Pat. No. 4,622,918 discloses an apparatus wherein a wafer is fed through between a number of columns located some distance apart. Sets of columns located opposite one another, between which the wafer moves, are likewise some distance apart. In the gap between the sets of columns, heating is effected by means of a lamp some distance away. This apparatus has the drawback that due to the presence of many metal parts with complicated constructions in close proximity to the wafer, only heating to limited temperatures is possible. Furthermore, in this apparatus a wafer is supported by a plurality of columns of air streams with gaps in between the columns. Due to the succession of columns, where the wafer is supported, and gaps between the columns where the wafer is exposed to the heat radiation of the lamps, both the support of the wafer and the heating are not homogeneous.
It has been found that only limited heating can take place effectively by heating the gases, as is described in the above-mentioned Netherlands applications.
The aim of the present invention is to provide a method with which contactless heating of semiconductor substrates to relatively high temperature within a relatively short time is possible.
This aim is achieved by enclosing a wafer between relatively massive side sections of an apparatus and applying gas streams to opposite planar sides of a wafer. Preferably the side sections include plates having a minimum thickness of about 10 mm with the spacing between each of the side sections and the wafer to be at most about 1.0 mm Further, at least one of the side sections is heated to a temperature higher than 200� C.
Surprisingly, it has been found that if the spacing between the side sections, or between side section and wafer, is set to be relatively small, particularly rapid heat transfer can take place. It is possible to achieve heating to far about 1000� C. within a few seconds. Because with this arrangement the wafer, in principle, does not have to be supported, but is held accurately and definitively in its place by the gas streams, the wafer will also not be subjected to stresses generated by local temperature differences and distortion will be prevented as far as possible. Incidentally, it is pointed out that if a slight degree of distortion does take place, the stabilizing effect of the gas streams in opposing directions is such that the wafer is pressed straight in a 'gentle' manner without damage.
Therefore, it is now possible to keep the apparatus at the process temperature and load the wafer while the side sections are at process temperature without damage for the wafer. As a consequence, a particularly small peak power is needed to achieve such rapid heating of wafer because the energy required to heat the wafer is withdrawn from the side sections. It will be understood that the method described above is outstandingly suitable for processes in which wafers are treated one-by-one ('single wafer processing'). However, it is also possible to treat large numbers of wafers one after the other or parallel to one another in the manner described above.
Introduction of the wafer into the enclosing apparatus described above can be effected in any way known from the prior art. A particularly simple method is that in which the side sections can be moved apart. The wafer can be placed between the side sections when the latter have been apart. Supporting means can optionally be present to fix the wafer in such a position. The side sections then move towards one another and the function of the supporting means can be taken over by the gas stream moving out of the side sections concerned. As a result, the wafer moves away from the supporting means.
Apart from heating the semiconductor substrate in this way it is also possible to carry out treatments on the substrate, such as oxidation etching or the deposition of layers. to this end it is possible to mix a gaseous medium with the gas which holds the wafer in its place. Of course, it is also possible to position the wafer using process gas only. This is in contrast to what is described and suggested in the above-mentioned Netherlands Applications, where only wet treatment of the related substrate takes place. This process gas can be supplied, uniformly distributed, from one of the side sections, such that a uniform distribution over the related wafer surface takes place.
One of the problems encountered in the prior art when supplying process gas at elevated temperature and more particularly when depositing layers is that the apparatus and more particularly when depositing layers is that the apparatus used to supply the process gas becomes contaminated by deposition of the material concerned from the process gas. This means that apparatuses of this type have to be cleaned regularly and that major problems arise with regard to clogging.
With the method according to the invention it is possible to prevent these problems. This is because, according to a further embodiment of this method, a temperature difference is applied over the wafer. One of the side sections is heated to a relatively high temperature, whilst the other of the side sections is heated to a relatively low temperature. It has been found that, as a result of the thermal behavior of the enclosing apparatus, the wafer will assume a temperature which is dependent on the position of the wafer with respect to the two heated side sections. If the two side sections are equidistant from the wafer and the same gas is present on both sides, the temperature will fairly accurately be the average of the values of the temperatures of each of the side sections.
If, by controlling one or both gas streams, the wafer is not located centrally between the two side sections, the temperature will change correspondingly.
If different types of gas are used, that is to say gases having different thermal conduction properties, a change in temperature will likewise take place. For example, when argon is used on one side and hydrogen is used on the other side it has been found that transfer between the relevant side section and the wafer is ten times between on the side where hydrogen is supplied.
Consequently, by means of a suitable choice of the temperatures concerned, it is possible to provide the side section from which the process gas is emitted with a temperature such that no deposition takes place on such side section, whilst the wafer is at a temperature which is so much higher that deposition does take place on such wafer.
It has been found that the rate of deposition of, for example, polysilicon from silane on a substrate is lower by a factor of 350 at 700 K and a partial pressure of 0.4 torr than at 900 K. This means that by controlling the temperature, deposition is negligible on the side section from which the process gas is supplied and which is at low temperature.
With this arrangement it is possible, in the starting position, to place the wafer with the 'device side' of the wafer towards the side section which is at the lowest temperature, through which side section the process gas is subsequently supplied. As a result of supplying the reactive gases, the wafer is moved towards the side section at the higher temperature and, on assuming the higher temperature, deposition accordingly, takes place. The reverse set-up is also possible. That is to say, the side section from which the gas emanates is at a higher temperature than the opposite side section. In this case, the 'device side' of the wafer faces the side section which is at the lower temperature and the Bernoulli principle can be used by allowing the correct gas stream to flow against the top of the wafer. With this arrangement a reduced pressure is created beneath the wafer, which reduced pressure ensures that the wafer will float (in a stable manner) beneath the top side section. The hot (bottom) side section is then raised until the process situation is achieved.
It has been found that appreciable temperature differences between the related side section and the wafer are possible using the construction described above. A value of at least 150� C. and more particularly 200� C. may be mentioned by way of example.
With the method according to the invention, these values can be set very accurately. After all, it has been found that these values are mainly dependent on the position of the wafer in the enclosing apparatus. As already indicated above, the position of the wafer in the tunnel-like apparatus is accurately related to the quantity and type of gas supplied from the related side sections.
The invention also relates to an apparatus with which the above method can be carried out in all its alternative embodiments. In this apparatus at least one of the side sections is provided with heating means for heating the section(s) to above 250� C. It has been found that relatively small peak power is needed to achieve relatively fast heating of a wafer. It is in particular the high thermal capacity of the side section concerned, which is of importance for the stability of the process.
The related side section can be provided with a number of spaced gas feed channels in order to provide uniform metering of the gas and more particularly process gas.
In a simple embodiment which is particularly suitable for deposition purposes, a very large number of injection points must be present. A construction of this type can, for example, be achieved by providing porous plates.
The invention will be explained below with reference to an illustrative embodiment shown in the drawing. In the drawing:
FIG. 1 shows diagrammatically, an apparatus according to the invention in the position in which the semiconductor substrate is introduced.
FIG. 2 shows part of the apparatus after introduction of the semiconductor substrate; and
FIG. 3 shows a graph in which the rate of heating of the semiconductor substrate is shown for the apparatus according to FIGS. 1 and 2.
In FIG. 1, the apparatus according to the invention is indicated in its entirety by 1. This apparatus is provided with an inlet 4, which can be connected, in a manner not shown in more detail, to a 'load lock' or a cluster system for further treatment of semiconductor substrates.
The actual apparatus according to the invention, consisting of top and bottom or first and second side sections 6 and 7, respectively, is accommodated in a pressure vessel 2 for carrying out a process in a specific environment or under elevated or reduced pressure.
The first side section 6 is joined rigidly to the pressure vessel 2. A heating coil 8, which is connected to a control 5, is mounted inside the first side section. A gas supply line 12 is also present, which gas supply line is connected to the gas feeds 10 which comprise a number of uniformly distributed passages.
It must be understood that in practice a very much larger number of passages will generally be used, which passages are each very much smaller than is shown. For the sake of clarity, the various features have been shown in exaggerated form in the drawing. It is desirable that there be at least 20 holes for a 200 mm diameter wafer and preferably there would be about 64. With a larger wafer there should of course be more passages. The hole diameter should be no greater than about 2 mm, and preferably is about 25 mm.
Side section 6 is provided at its periphery with centering chamfers 13. As can be seen from FIG. 2, these serve for enclosure of a semiconductor substrate or wafer 3 by extending beyond the periphery of the wafer.
Second side section 7 is constructed correspondingly. Supporting pins 11 for supporting the semiconductor substrate extend through the second side section 7.
As can be seen from FIG. 2, the various features are so dimensioned that when the two side sections are in the closed position, that is to say in the position in which the spacing between each of the sections and the wafer is set to be at most about 1 mm, the semiconductor substrate 3 is no longer supported by the supporting pins 11 but by the gas streams which flow through the holes 10 towards the semiconductor substrate 3 from both side sections.
It will be understood that the various features are dependent on the application concerned.
Gas passages 10 in the second side section 7 are connected to a gas supply line 14, which is connected to a source 15.
The apparatus described above functions as follows:
Starting from the situation shown in FIG. 1, the wafer 3 is placed on the supporting pins 11, as is also shown in FIG. 2. The second side Section 7 is then moved up and the situation as shown in FIG. 2 is obtained. The wafer 3 is accurately positioned in the center between the two side sections 6 and 7 by the gas streams issuing from the passages 10 in the two side sections. Deviation in the position is possible by means of adjusting the gas flow.
The side sections are preferably formed by relatively massive plates so as to have high heat capacity. Plates should have a minimum thickness of about 10 mm, and preferably about 60 mm. The side sections are heated by the heating elements 8 and 9, and it has been found that this heat is transferred to the wafer with negligible loss. In practice, it has been found that almost immediately after it enters the gap between the side sections 6 and 7 the wafer assumes the temperature thereof. This is in a situation in which the temperature of the side sections 6 and 7 is identical. Such an example is shown in FIG. 3. In this case both side sections have been heated to a temperature of approximately 1200� C. It has been found that the wafer 3 has the same temperature within four seconds. Because the wafer 3 is not supported and is heated uniformly, no thermal stresses will be produced as a result of which there is no question of distortion.
At such an elevated temperature it is possible to anneal the wafer or to carry out an oxidizing reducing treatment. In the latter case the relevant gases are supplied as process gases through the passages.
Apart from furnaces, radiation lamps are also used in the prior art, the wafer being positioned on, a bearing surface. Apart from the above-mentioned risk of distortion as a result of non-uniform heating caused by removal of heat to the support point, the heating rate is relatively slow. Values of 5-10�/s are not uncommon if the wafer is on a susceptor. In all other cases,m values of 50-100�/s have been found.
In certain cases it is, however, desirable to subject the wafer to a deposition treatment. The case in which a process gas, from which material has to deposit on the wafer, is present in source 15 is chosen as an example here. To prevent the passages 10 in the second side section 7 from becoming clogged by premature deposition of material from the process gas concerned, it is proposed to bring the first side section 6 to a relatively high temperature and the second side section 7 to a relatively low temperature with the aid of control 5.
If, for example, for polysilicon the deposition temperature of material from the silane gas issuing from source 15 is 625� C. (900 K), it is proposed to heat the first side section 6 to a temperature of 1100 K and the second side section 7 to a temperature of approximately 700 K. At 700 K virtually no deposition of material from the gas will take place, so that the passages 10 concerned will not clog. However the wafer is found accurately to assume a temperature which is midway between that of the first side section 6 and that of the second side section 7, this being the desired temperature of 900 K. As a result of the flow of the gases shown (FIG. 2), it is largely precluded that gas issuing from the second side section 7 will enter the first hot side section 6 and deposit there. In any event it has not been found that passages 10 in the first side section 6 clog.
In the case of a deposition treatment of this type it is not uncommon first to supply an inert gas and then to supply the treatment gas. This is represented symbolically by showing a number of gas bottles at 15 and the quantity or mixing ratio or type of gas supplied to the line 12 or 14 can be controlled by means of control means, which are not shown in more detail.
Close to the end sections of the side sections, the upper side section is provided with a large number of gas passages, whilst this it not the case for side section 7. In this way an accurately controlled gas purge flowing radially outwards can be provided and deposition on section 6 prevented.
If the side section 7 is at a lower temperature, it is not necessary to use the pins described above. The wafer can be placed directly on side section 7. In such a case it is not even desirable to use pins, because in a set up of this type the 'device side' faces downwards.
It has been found that a very small amount of gas is needed with the method described above. An amount of between 0.1 and 25 liters per second under standard conditions under a pressure in the vessel which is between 1 torr and 1 atom may be mentioned here as an example. The various aspects are wholly dependent on the process conditions.
When the treatment is compete, the side sections can be moved away from one another again and the wafer removed. Cooling takes place equally as rapidly as heating without any damage over the entire extent of the wafer.
It must be understood that the relative sizes shown in the figures are incorrect and have been introduced for the sake of clarity. Thus, the diameter of a typical wafer is approximately 150-200 mm and the thickness approximately 0.7 mm. The distance between a wafer and the surface of the relevant side sections from which gases issue is of the order of magnitude of one or a few tenths of millimeters.
It is possible to impose a rotary movement on the wafer, as a result of which an even more uniform treatment is provided.
Such a rotation can, for example, be achieved by positioning one or more of the channels 10 at an angle with respect to the vertical, as a result of which a spiral gas flow is generated.
These and further variants are obvious to a person skilled in the art after reading the above description and fall within the scope of the appended claims.
|Cited Patent
|Filing date
|Publication date
|Dec 19, 1973
|Dec 17, 1974
|Intel Corp
|Gas reactor for depositing thin films
|Mar 21, 1974
|Mar 30, 1976
|Lasch Jr Cecil A
|Fluid bearing transfer and heat treating apparatus and method
|Aug 25, 1982
|Jan 22, 1985
|Edward Bok
|Method for deposition of fluid and gaseous media on substrates for their transport
|Feb 21, 1983
|Dec 24, 1985
|Edward Bok
|Method for applying a coating on a substrate
|Dec 30, 1983
|Mar 4, 1986
|At&T Bell Laboratories
|Deposition technique
|Aug 23, 1983
|Mar 11, 1986
|Edward Bok
|Method for floating transport of substrates
|Feb 3, 1984
|Nov 18, 1986
|Integrated Automation Limited
|Module for high vacuum processing
|Jul 31, 1985
|May 5, 1987
|Integrated Automation, Limited
|Method of double floating transport and processing of wafers within a confined passageway
|Sep 27, 1984
|Apr 19, 1988
|Fujitsu Limited
|Plasma processor and method for IC fabrication
|Mar 16, 1987
|Aug 29, 1989
|U.S. Philips Corporation
|Device comprising a flat susceptor rotating parallel to a reference surface about a shift perpendicular to this surface
|Nov 9, 1988
|Feb 27, 1990
|Sez Semiconductor-Equipment Zubehoer Fuer die Halbleiterfertigung Gesellschaft m.b.H
|Support for slice-shaped articles and device for etching silicon wafers with such a support
|Oct 26, 1988
|Feb 27, 1990
|Balzers Aktiengesellschaft
|Method and apparatus for the transmission heat to or from plate like object
|Jun 27, 1989
|Sep 18, 1990
|Tokyo Electron Limited
|Method and apparatus for heat-treating a substrate
|May 7, 1990
|Jul 23, 1991
|Balzers Aktiengesellschaft
|Workpiece carrier for a disk-shaped workpiece as well as a vacuum process space
|Sep 4, 1990
|Feb 25, 1992
|Balzers Aktiengesellschaft
|Workpiece support for vacuum chamber
|May 2, 1991
|Jan 19, 1993
|Balzers Aktiengesellschaft
|Workpiece carrier with suction slot for a disk-shaped workpiece
|Jul 18, 1991
|Jun 22, 1993
|Tokyo Electron Limited
|Support table for plate-like body and processing apparatus using the table
|May 18, 1993
|Jun 7, 1994
|United States Of America As Represented By The Secretary Of The Navy
|Substrate temperature control apparatus and technique for CVD reactors
|Jan 28, 1993
|Oct 4, 1994
|White John M
|Alignment of a shadow frame and large flat substrates on a support
|Jun 15, 1992
|Oct 18, 1994
|Materials Research Corporation
|Semiconductor wafer processing method and apparatus with heat and gas flow control
|Dec 17, 1993
|Jan 17, 1995
|Tokyo Electron Limited
|Stage having electrostatic chuck and plasma processing apparatus using same
|Mar 30, 1994
|Jul 11, 1995
|Fsi International, Inc.
|Vertical multi-process bake/chill apparatus
|Oct 29, 1993
|Sep 5, 1995
|Brooks Automation, Inc.
|Low-gas temperature stabilization system
|Aug 30, 1995
|May 28, 1996
|Brooks Automation, Inc.
|Low-gas temperature stabilization system
|Feb 14, 1994
|Aug 6, 1996
|Tokyo Electron Kabushiki Kaisha
|Plasma treatment apparatus
|Jun 5, 1995
|Apr 14, 1998
|Nikon Corporation
|Substrate holding apparatus
|Jan 25, 1996
|Jun 30, 1998
|Kokusai Electric Co, Ltd.
|Substrate processing apparatus
|May 28, 1996
|Jul 14, 1998
|Brooks Automation Inc.
|Method for heating or cooling wafers
|Dec 20, 1995
|Mar 9, 1999
|Sematech, Inc.
|Heater and temperature sensor array for rapid thermal processing thermal core
|Apr 17, 1997
|Jul 27, 1999
|Dainippon Screen Mfg. Co., Ltd.
|Processing system hot plate construction substrate
|Sep 15, 1997
|Aug 17, 1999
|Siemens Aktiengesellschaft
|Semiconductor wafer temperature measurement and control thereof using gas temperature measurement
|Oct 14, 1997
|Sep 28, 1999
|Kokusai Electric Co., Ltd.
|Heat treatment of semiconductor wafers where upper heater directly heats upper wafer in its entirety and lower heater directly heats lower wafer in its entirety
|Oct 11, 1996
|Dec 7, 1999
|Advanced Semiconductor Materials America, Inc.
|Semiconductor processing system with gas curtain
|Mar 4, 1996
|Dec 14, 1999
|Maruyama; Mitsuhiro
|Crystal producing method and apparatus therefor
|Aug 30, 1996
|Apr 25, 2000
|Asm America, Inc.
|Wafer support system
|May 21, 1997
|Aug 8, 2000
|Ipec Precision, Inc.
|Non-contact holder for wafer-like articles
|Jan 8, 1999
|Feb 6, 2001
|Asm International N.V
|Method and apparatus for supporting a semiconductor wafer during processing
|Jan 11, 2000
|Mar 20, 2001
|Asm America, Inc.
|Wafer support system
|May 8, 2000
|Sep 3, 2002
|Memc Electronic Materials, Inc.
|Modified susceptor for use in chemical vapor deposition process
|Dec 29, 2000
|Nov 8, 2001
|Ries Michael J.
|Epitaxial silicon wafer free from autodoping and backside halo and a method and apparatus for the preparation thereof
|Nov 11, 1994
|Jun 14, 1995
|Semiconductor Systems, Inc.
|Method and apparatus for baking and cooling semiconductor wafers and the like
|Title not available
|Title not available
|Title not available
|Title not available
|Title not available
|Title not available
|Title not available
|Title not available
|Title not available
|Title not available
|Apr 16, 1990
|Nov 15, 1990
|Chiron Corporation
|Improved amplified nucleic acid hybridization assays for hbv
|Dec 15, 1994
|Jun 22, 1995
|Brooks Automation, Inc.
|Apparatus for heating or cooling wafers
|Jul 8, 1997
|Jan 15, 1998
|Advanced Semiconductor Materials International N.V.
|Method and apparatus for contactless treatment of a semiconductor substrate in wafer form
|Chemical Properties Handbook (access via www.knovel.com) McGraw-Hill Companies, 1999.
|CRC Hand Book of Chemistry and Physics 3<rd >electronic edition, CRC Press Inc. publish 2000, p. 6-175.
|CRC Hand Book of Chemistry and Physics 3rd electronic edition, CRC Press Inc. publish 2000, p. 6-175.
|Japan-Patent Abstracts of Japan; vol. 9, No. 85 (E-308), Apr 13, 1984 & JP 59 212 5718 A (Kokusal Denki KK) Dec. 5, 1984; Publication No. 59215718; Publication date May. 12, 1984.
|Japan—Patent Abstracts of Japan; vol. 9, No. 85 (E-308), Apr 13, 1984 & JP 59 212 5718 A (Kokusal Denki KK) Dec. 5, 1984; Publication No. 59215718; Publication date May. 12, 1984.
|Yoo et al., "Low-temperature annealing system for 300 mm thermal processing," Solid State Technolgy, Jun. 2001, pp. 152-160.
|Citing Patent
|Filing date
|Publication date
|May 8, 2000
|May 23, 2006
|Asm International N.V.
|Apparatus for transferring wafer and ring
|Feb 15, 2005
|Dec 12, 2006
|Asm America, Inc.
|Non-contact cool-down station for wafers
|Feb 13, 2015
|Nov 22, 2016
|Eastman Kodak Company
|Coating substrate using bernoulli atomic-layer deposition
|Feb 13, 2015
|Nov 22, 2016
|Eastman Kodak Company
|Atomic layer deposition apparatus
|Feb 13, 2015
|Nov 29, 2016
|Eastman Kodak Company
|Atomic-layer deposition apparatus using compound gas jet
|Feb 13, 2015
|Dec 27, 2016
|Eastman Kodak Company
|Atomic-layer deposition method using compound gas jet
|Jul 30, 2015
|Oct 3, 2017
|Corning Incorporated
|Highly strengthened glass article
|Jul 30, 2015
|Oct 10, 2017
|Corning Incorporated
|Thin dicing glass article
|Jul 30, 2015
|Oct 31, 2017
|Corning Incorporated
|Fictive temperature in damage-resistant glass having improved mechanical characteristics
|Sep 2, 2004
|Feb 17, 2005
|Granneman Ernst Hendrik August
|Method and apparatus for supporting a semiconductor wafer during processing
|Feb 15, 2005
|Jul 7, 2005
|Ravinder Aggarwal
|Non-contact cool-down station for wafers
|Jan 8, 2007
|May 21, 2009
|Levy David H
|Deposition system and method using a delivery head separated from a substrate by gas pressure
|Sep 25, 2009
|Jan 21, 2010
|Gerhard Karl Strauch
|Process And Apparatus For Depositing Semiconductor Layers Using Two Process Gases, One Of Which is Preconditioned
|Oct 27, 2009
|Apr 28, 2011
|Levy David H
|Conveyance system including opposed fluid distribution manifolds
|U.S. Classification
|118/725, 156/345.51, 156/345.52, 118/728, 118/724
|International Classification
|Cooperative Classification
|European Classification
|Nov 29, 2005
|Certificate of correction
|Nov 2, 2007
|Fee payment
Year of fee payment: 4
|Apr 4, 2012
|Fee payment
Year of fee payment: 8
|Apr 6, 2016
|Fee payment
Year of fee payment: 12


text:
Written on: 21/07/2013
I've looked at other sites but find laterooms to be the easiest & best to understand & use. The price you see (per room not per person) is the price you pay & there are no extra charges for paying by credit card. If you're looking to spend a few days away, I thoroughly recommend that you use "laterooms" to compare what is available & you can read customer comments, see the overall ratings & see photographs to help make your choice. The booking system is also very easy to use & you receive instant confirmation.

subset: commoncrawl


text:
select Compare (0)
Compare Products
You have no items to compare.
The Ametek HD20-15 housing is not available. See Replacements for more information on replacement filters and parts.
- Genuine OEM Product
- Ametek Kleen-Plus HD20-15-HFPP Whole House Water Filter System:
- Select one of the 20" L x 4.5" W water filters for the Ametek HD20-15 system. The following 3 filters are the most popular filters for this system.
- 1) The R30-20BB water filter is a 30 micron pleated sediment water filter that fits the HD20-15 system. This filter should not be used with non-chlorinated water.
- 2) The DGD-5005-20 water filter is a 5 micron polypropylene sediment water filter that fits the HD20-15 system. This filter can be used on chlorinated or non-chlorinated water supplies.
- 3) The GAC-20BB water filter is a granular activated carbon water filter that fits the HD20-15 system. Carbon filters improve taste and odor and reduce chlorine taste and odor.
- If you need to replace the entire housing, the 20-BB-15 whole house filter housing can be purchased here.
- Ametek HD20-15-HFPP Filter System Parts & Accessories:
- O-Ring: The OR-100 oring seals the cap to the bottom sump of the housing to prevent leaks. The OR-100 o-ring should be replaced approximately every two to three filter changes.
- O-Ring Lubricant: Use o-ring lubricant to lubricate the OR-100 O-Ring.
- Wrench: Use the SW-4 wrench to loosen the filter housing.
- Ametek HD20-15 Water Filter Housing Also Known As:
- Ametek HD-2015 Whole House Housing
- Ametek HD20-15-HFPP Whole House Housing
- Ametek HD2015HFPP Whole House Housing
- Ametek HD2015 Whole House Housing
- Ametek HD20-15HFPP Whole House Housing


text:
Testing For Kids In Idaho Panhandle's Silver Valley Encouraged
COEUR D'ALENE, Idaho (AP) — The Panhandle Health District in northern Idaho is offering incentives...
< No More Gender Discrimination In Idaho
Apr 26, 2013 06:59
Category: General News
Category: General News
Teacher Saves Student's Life
BATTLE GROUND, Wash. (AP) — The mother of a 6-year-old Battle Ground boy says her son's kindergarten teacher is his "guardian angel" after performing the Heimlich maneuver on him yesterday. Hunter Schofield went up to teacher Toni Brammer with a red face yesterday and when she asked if he was choking, he nodded yes. She did the maneuver; out popped a fruit snack.


text:
Department Store Frames
So pretty generally big box store and other lesser bikes get a bad rep for having low quality parts. A number of no-name brand bikes use Hi-Ten steel frames, which in combination with cheap parts usually gives them the verdict of not worth it completely, or not worth the price even if it's relatively low.
But what about these "low end" bike frames? Is it worthwhile to get, say, a 250USD or 300USD bike from someone like Schwinn or the other mass produced labels and, over time, upgrade the parts to something more proper? Is there something about the frames that are unsuitable? Every moving part's going to wear out eventually, so is getting one of these lower dollar bikes with upgrades in mind a good approach or not? What are principals of good frames?
After all, the bones of a bike is the frame, so I think it's something worth scrutinizing - it'll be around longer than anything else.
This is less for, say, $80 Huffey POS MTB's and more for the high-end-low-end stuff, that usually seems to start somewhere around $200. I'm kind of tempted to get this $300 single speed "Roadster" style I've seen that has an Alu frame, as a hold over until one day owning an Opa, or something similar.
As an aside, why is Hi-Ten steel frames specifically bad, while I've seen other steel frame bikes get good marks? Same question goes for "gas pipe" frames. I get they are bad, so I have no hope for them, but I think it's good to get the Why so I can explain to others.
Generally, the drawback to cheap steel frames is weight. Then, too, a lot of bikes at that price point are one-size-filts-all, so if you don't fit that "average" size frame, you're out of luck.
You might check into some of Nashbar's frames, some of them get pretty cheap.
If you buy a bike as a package, you'll generally have better pricing than if you bought all those same components and assembled them.
Crap material for one, also crap parts.. most are also missing industry standard dropout locations and stuff that higher end bikes have. Some dep store bikes don't even have dropout hangers. To most, steel is steel and aluminum is aluminum, but that's not always the case. The alloy composition, thickness, geometry all have an effect on the end feel of the ride. There's a reason there are have hundreds of bike manufacturers that all use the same Shimano/SRAM/etc groupsets and usually differ only by frame and fork.
To put it in an analogy, you could buy a Honda Civic and spend thousands do get the performance and handling of a Ferrari on paper, but nobody will ever agree that it meets the overall feel, fit and finish of the Ferrari..
I was going to say Kia/Hyundai but they are making decent cars now too.
You Still have the Slavic translations of the Fiat 124,127, to pick on, .. Lada And Yugo..
1 Attachment(s)
Another example, note the turkey wing/suicide brakes on my Racer, Dura-Ace. They work perfectly every time, which hardly the norm.
Hi-ten forks are particularly nice at smoothing out road chatter. Late '70s early '80s there Japanese imports with cr-mo frames and hi-ten forks -> that was a great combination but for the additional weight penalty. So, if I found a quality designed/built frame made out of hi-ten I would not turn my nose up at it. Not sure you are going to see any of these at Wal-Mart.
Frankly, same issue with Al frames. There is very good and there is crap.
If you make a bicycle frame from a low strength grade of steel, you have to use more of it (thicker walled tubes) to make the frame strong enough. That's going to make it heavier. As you move up the steel alloy food chain, it becomes possible to make a bicycle frame that is not only impressively light in weight, but also has an indescribably improved ride quality that many experienced riders prize. Creating such a bike frame requires more exotic production methods that increase it's cost.
Every buyer gets to choose their own cost/benefit point.
I've bought two cheap "department" store bikes and changed the bits I really
didn't like - seat, tyres, pedals and one of them the crankset. However don't
buy a cheap bike to upgrade it, it is a waste of money. Simply buy a more
expensive bike with better bits, it will be far cheaper in the long run.
Hi-ten frames are not bad, they are good and cost effective, but not light.
Gaspipe frames are not much cheaper, and much heavier, not a good idea.
That cheap bikes use shoddy materials etc is largely a myth, though some
are very bad - its not difficult to spot a sound budget bike that will also
sell well in markets much less rich than the west.
What they don't have is quality control and somebody taking the time to go
through the whole bike and adjust it, fettle it, to work as well as it could.
rgds, sreten.
|All times are GMT -6. The time now is 01:19 AM.


text: Received my Mav ET732 a couple weeks ago and finally got to use it last night. Got some friends coming into town and decided at the last second to do a shoulder over night. Tried smoking with Oak and Bourbon barrel but it wasn't putting out smoke like I wanted it to so I nixed that and through the tried and true pitmaster blend in the AMNPS. I think I had my MES bbq temp set a little high as I was reading about 250* on bbq temp the two times I checked it. I know I had a 15* difference with my MES and actual so I accounted for that and kinda misjudged. Woke up to a 8.6lb shoulder sitting at 181* IT after 8hours. I assumed it would be alot longer to get to that temp. So I adjusted the temp down a little to get the bbq temp to 235*. I decided to smoke this one in a pan to catch all the drippings. I am thinking I will remove and foil for the last few hours or so. I will also put all the drippings in the fridge for later to add back in after removing the fat. I did the mustard and applewood dry rub, also added in some Mrs Dash Carribean seasoning to the mix. Didn't have any paparika which I wanted to try. I'm hoping this thing stalls for a bit as fam won't be in till about noon and this shoulder is supposed to be for DINNER I'll add pics later. Oh and BTW, the Maverick ET732 is a MUST have for over nighters. Set my alarms and slept like a baby not having to worry about the temps.


text:
Tips for rebuilding this amp?
I have an little single ended amp which uses half a 12AX7 to feed a 6BQ5 output tube. The amp runs, but some of the component values have drifted with age. I'm going to gut it and replace the resistors and capacitors with new ones.
Not knowing any better, I intend to simply replace everything with same spec parts. I have a little sketch of the circuit, and I thought I might ask for advice before I start ordering parts. My drawing only shows one channel, but be aware this is a stereo amp. Both channels draw power from the same 6CA4 driven power supply.
I've already taken some liberties with the circuit. The original volume control was a scratchy 1 meg-ohm system, which I replaced with a 10K ohm audio taper pot. (It's what I had on hand.) There was a 860K ohm pot between the signal grids of the two output tubes. Its wiper was connected to ground, and I believe it functioned as a balance control / grid charge leak-off. I removed it, and replaced it with the 470K ohm resistor shown in my diagram. Finally, there were bass and treble controls in between the 12AX7 and the 6BQ5. I removed those completely.
Without further ado, here's my sketch. I'll keenly entertain any suggestions.
There is no need to replace old parts with new ones, unless they are faulty. Some old components are evan said to have good sound properties.
I would rather suggest making changes that have an intended purpose. here are some suggestions to consider:
- the input cap does not seem to have any purpose, other than (possibly) to limit LF extension for the benefit of the OPT (if it is a smallish one).
- you may want to look at the operating point and load-line for the 12AX7. A little more current and higher voltages may be beneficial.
- the common cathode resistor for the 6BQ5 could be replaced with separate ones, with double value.
- the 25uF cathode decoupling cap could be replaced with a larger value, at least 100uF, and maybe a "boutique" brand.
BTW: How does it sound, what would you like to improve ?
Rolling infrasonic noise off at the I/P of an amp that employs loop NFB is a good thing. The O/P trafo core is protected against saturation. How small is the O/P "iron"?
Is the 'X7 grid leak resistor really 6.9 MegOhms? 100 KOhms follows the 1:10 rule. Replace the 10 nF. cap with 56 nF., if you use a 100 KOhm grid leak resistor. That puts the 3 dB. down point at approx. 28 Hz.
If a CDP is the source, a 'X7 section provides too much gain. I'd like to see the 'X7 replaced by a 5965 for its high gm, but the power trafo filament winding could get overloaded. The next logical choice is a 12AY7 (mu = 40), which is similar in terms of Rp to the 'X7.
I've heard others suggest the common cathode resistor for the output tubes might be replaced with separate ones. I agree that is a good idea. It has also been recommended to me that I increase the cathode decoupling cap there while I am at it.
I double checked the grid resistor on the 12AX7. According to the schematic I have, they are supposed to by 6.9M. Mine are colored 6.8M. I measured them around 6.45M/6.35M (left/right). Wouldn't the Fmin work out to around 25 Hz for these values?
Yes, I do recall the gain was a bit much when I first started playing with this amp. I think it became a bit more manageable when I took out the original 1M volume control and replaced it with a 10K audio taper pot. I don't believe this reduces the overall gain, but it lets me turn the knob to a point where the input signal is low enough to work.
I don't know the 1:10 rule. I'll assume it's the ratio of the grid resistor to...? Should I be looking at the relationship between the 12AX7 plate resistor and the 6BQ5 grid resistor? I thought they weren't supposed to be so close in value to each other. Should I be concerned about the coupling cap between the 'X7 and the 6BQ5? It seems small... is the Fmin around 340 Hz? I'd imagine there'd be no bass at all if that were true.
I'd start by replacing the coupling caps to the 6BQ5, one of them is undoubtedly faulty based on your description.
Other mod ideas sound good done a little at a time so you can assess their effectiveness. (i.e. whether you like the resulting changes in the sound) Good way to learn about the design tradeoffs in this particular amplifier design and in tube amplifier design in general.
I would not get too carried away with lowering the LF -3dB point, depending on the available opt primary inductance you may find yourself with a lot more distortion and not much more bass.
Eventually a 12AU7A with some minor component value tweaks would lower the open loop gain by some 14 dB or so and allow you to adjust the values of the feedback resistances for lower gain.. (Note that there might be some stability issues to be resolved with this change, but perhaps not.) I'd get some decent used euro made 12AU7A/ECC82/E82CC for this application.. (eBay)
It takes a remarkably small amount of leakage in a coupling cap to cause problems. You might not see anything amiss, other than huge distortion readings. Or, you might have glowing plates :hot:
I use polyester (Mylar) caps, but a case can be made for various types, depending on what you want to achieve.
I've had the worst luck with old multi-section filter caps. Be sure those 40 uF caps are all good. Old carbon resistors in tube amps can be non-linear with voltage. Depending on their age and condition, I'd replace them with RN-60 or RN-70 metal films, depending on the voltage they see- remember that resistors have both a voltage and power limit. If the construction method relies on ground lugs riveted to the chassis, be sure they aren't corroded and have near zero resistance.
In the small signal situation, a minimum ratio of 1:10 is in order between the impedances of a driving entity and a driven entity. A 10 KOhm volume control needs at least a 100 KOhm grid leak resistor. Use a 56 nF. cap. between the wiper of the 10 K pot. and a 100K grid leak resistor (metal film for low noise).
The coupling cap. between voltage gain triode and EL84 should be 100 nF. The 10 nF. cap puts the pole at 34 Hz. and that causes a large LF NFB error correction signal, which can saturate the O/P trafo core, to be generated. :( The same thinking applies to the cathode resistor bypass cap. That pole too should be <= 5 Hz. 470 muF. seems (SIC) correct.
2 Attachment(s)
If you are going to gut it, i can recommend converting it to an RH84. There is a thread here with extensive info and the original project can be found here.
I am running a variation of these now. I'd guess one of he reasons for its excellent performance is the substitution of the global feedback to a much shorter loop that does not include the OPT.
Well, I replaced the .01 mfd coupling caps on the glowing channel with some Sprague 715P caps of the same value. I know it will be good to increase the capacitance of the coupling between the 'X7 and the EL84, but I just happened to have these parts on hand. The original caps were ceramic discs, if you can believe that. I seems someone had already replaced the caps on one channel, but didn't bother with the other.
The new caps made no difference in the glowing tube. To be honest, the glow is extremely faint. You need to turn off the lights in the room to see it. It's the one on the left, in case you can't tell.
I think my next step is to separate the cathode bias resistor that is shared between the output tubes. Maybe then I can figure out whether or not the odd tube is pulling more current than the other. Right now I think it is, but I'm guessing one is idling at about 40 ma and the other at 52. I think that is a relatively safe current for these tubes.
I checked the voltages in the circuit while I had it on the table. Most voltages seem a bit higher than the last time I checked it. The drawing I attached in my original post shows the old voltages. Today the outputs are showing 319V/316V at the plate, 298V at the screen, and 8.7V at the cathode. The driver tube is showing 99V/91V at the plate, and 0.25V/0.25V at the cathode. I don't know where the old numbers came from. Maybe I had a bad meter day?
Thanks to everyone who has offered there suggestions so far. Here's my last photo, where you can see her in the light.
|All times are GMT. The time now is 10:25 AM.
Search Engine Optimisation provided by DragonByte SEO (Pro) - vBulletin Mods & Addons Copyright © 2017 DragonByte Technologies Ltd.
Resources saved on this page: MySQL 18.75%
vBulletin Optimisation provided by vB Optimise (Pro) - vBulletin Mods & Addons Copyright © 2017 DragonByte Technologies Ltd.
Copyright ©1999-2017 diyAudio


text:
Having sailed through Black Friday and Buy Nothing Saturday with my savings untouched and my conscience untroubled, I wake to something called Cyber Monday.
The friendly UPS guy who delivers a mid-morning package tells me it's the day everybody makes their online Christmas present purchases. How difficult that makes his working life is between him and his osteopath, but his parting words as he hands over a slim volume wrapped in Amazonian cardboard - "I wish they were all as easy as that one" - tells me the next week could be a testing one.
I suppose, then, that his will be one of the voices issuing forth Hallelujahs! a few hours later as the entire British banking system goes down the pan. Or that part of it which is operated by the Royal Bank of Scotland, anyway. An estimated 750,000 customers of RBS, NatWest and Ulster Bank are unable to use their credit cards for three hours, resulting in red faces and promises that anyone left out of pocket will be compensated.
Loading article content
In a scene that could have come straight from a film about the zombie apocalypse, shopping trolleys full of food and drink are simply abandoned in supermarkets. One man fills his car with petrol, finds himself unable to pay and simply zooms off - after leaving an IOU stuck to the pump. How very British.
The beaks at the Scottish Football Association have come down heavily against flares at football matches. That's not to be confused with flair, which was banished from the domestic game a generation ago, or flares, which were worn by fans, players and the odd manager in the 1970s and usually came in shades of municipal pitch rust (brown) and goalmouth green (also brown).
No, these flares are the ones that release smoke and - if you happen to be watching Hearts play Dinamo Zagreb and the away fans light one in a stairwell, as I once witnessed - the sort of firework display you wouldn't want in your back garden. Or your neighbour's. Or your neighbour's neighbour's.
"Och, it brings a bit of theatre to the game," say some.
Maybe. But isn't that what the Romans said when the Christians got drawn against the Lions in the Cup?
As part of its never-ending attempt to make Edinburghers feel good about the transport infrastructure in their city - and we'll get on to the trams in a minute - the local paper dispatches a reporter to investigate the Santa Train currently plying its trade in Princes Street Gardens. Turns out it costs more per mile than the Orient Express. Someone's making a killing, and it isn't Agatha Christie.
Sticking with mythical rolling stock, late-night revellers on Princes Street report seeing a ghostly shape progressing very slowly in an easterly direction along the middle of the road.
Have they been timewarped back to 1956 and the moment the last Edinburgh tram ran?
No, it's another of the council's funeral cortege-style tests of the gazillion-pound white elephant. In fact, the tram arrives in York Place ahead of schedule - not a phrase we're used to hearing in connection with this unloved project.
I Brave the high winds and horizontal sleet to visit what used to be called the Dean Gallery but is now known by the lofty and bracket-bothering title of Scottish National Gallery of Modern Art (Modern 2). The reason is the press view of an exhibition devoted to the Scottish Colourist painter John Duncan Fergusson, a Leither with an eye for the ladies and a penchant for green ties. He lived in Paris, except when there were world wars on, then ended up in Glasgow, where he would no doubt have been a regular at The Ubiquitous Chip had it opened a couple of decades earlier than it did.
No Santa Trains in Fergusson's time either, which is a shame because in his younger days in the capital he was in the habit of drawing and painting in Princes Street Gardens. He could easily have dashed off a quick post-Impressionist daub of the thing as it trundled along at £27.35 a mile. He could even have titled it Ho! Ho! Ho! or Laughing All The Way To The Grotto and blessed it in the name of the Holy Green Tie in the hope that it would one day be displayed in the Scottish National Gallery of Modern Art (Modern 2). He didn't, though, and it isn't. The exhibition is worth seeing, regardless.
As they should be, the papers and the airwaves are dominated today by tributes to Nelson Mandela. If, as seems likely, it becomes one of those "where were you when you heard?" moments, my answer will be: on the sofa watching Stacey Dooley Investigates on BBC Three. It was as the feisty cockney reporter was interviewing a Ukrainian drug dealer in a Darth Vader mask that the black-trimmed "Important News On BBC One" banner began appearing on all BBC channels.
Things were even weirder for a young couple in London who had booked a babysitter and set off for a rare night at the cinema only to end up having cameras and microphones shoved in their faces as they emerged blinking into the light. They were the Duke and Duchess of Cambridge and they had joined Nelson Mandela's daughter Zindzi and actors Idris Elba and Naomie Harris at the Leicester Square premiere of Mandela, a new biopic about the heroic South African leader.
The audience only learned of Mandela's death after the end credits rolled.
I end the week as I start it, with my mind occupied by online retailing. And I'm delighted to learn a new phrase in that regard: "fulfilment centre". At first sight it looks like either a good name for a church or a terrible name for a chippie. In fact, it's the term given to those enormous warehouses where your "one click" online orders are picked, packed and posted. Fulfilment implies happiness and contentment, of course. Neither word could be applied to the people who do the picking, packing and posting, though. In an essay for American magazine Mother Jones titled (deep breath) I Was A Warehouse Wage Slave: My Brief, Backbreaking, Rage-Inducing, Low-Paying, Dildo-Packing Time Inside The Online-Shipping Machine, reporter Mac McClelland writes about working in one of these places and the conditions that prevail. It's worth a read. Shop until you drop is one thing - shop until someone else drops is a different matter entirely. Merry Christmas.


text: Self-taught visual artist; UNESCO-Good Will Ambassador. Waste Land, a documentary about his work, nominated by the Academy Award as best feature documentary in 2011. Has works in major museums, including MoMA, NY, Tate Gallery, Daros Collection. Speaker: TED Conference; Harvard University; Yale University; MIT Residency Program; The Economist Forum. Ambassador, Rio+20 United Nations Conference on Sustainable Development. Interests: visual arts, education, media theory, science.


text:
Northwest Voices | Letters to the Editor
Welcome to The Seattle Times' online letters to the editor, a sampling of readers' opinions. Join the conversation by commenting on these letters or send your own letter of up to 200 words email@example.com.
From partisan politics to bargaining
Optimism is vital
Since this presidential election is now over, I sure hope some compromise is found between both parties ["Capitol Hill swiftly shifts to bargaining," News, Nov. 8].Our country needs to get away from the divisiveness that has been dominating politics over the last few years because that is the only way true change will come.
Solutions for our nation's many problems will only come when true compromise is made. Optimism for this is vitally important, because sometimes hope and optimism is all we have left.
— Jeff Swanson, Everrett
Need to tackle health-care issues
The election is over and question now will be if the stalemate in Washington, D.C., can be changed. The fiscal cliff is looming, and one way to solve it, per economist Joseph Stiglitz, would be to enact Medicare for all. The deficit and problem with the greatest entitlement, solved. Public insurance and market-based health delivery is that cost effective vs. private insurance.
Coverage would be based on medical necessity and not tiered with bronze, silver, gold and platinum plans. Who needs the choice and headaches of all these plans rather than free choice of medical providers.
It would be affordable for all as it would be based on income and easy to implement.
Recently I have talked with and heard about numerous people who would retire right away if they had Medicare coverage and coverage severed from employment.
Imagine what that would do for the job numbers.
The arithmetic proves this and it's a win-win solution. I'm afraid most of Congress would rather cut entitlements to prevent the cliff.
— Ruth Knagenhjelm, Normandy Park
Feb 21 - 7:00 AM Sen. Patty Murray plans to reintroduce Wild Olympics bill
Feb 21 - 7:00 AM Gun bill allows for police inspection
Feb 21 - 7:00 AM President Obama's early childhood education expansion proposal
Feb 21 - 7:00 AM Don't restrict public's right to access information
Feb 20 - 4:00 PM Lake Burien: public, but private


text:
Hand Injuries (cont.)
Soft Tissue Injuries, Amputations, Infections, Burns, Cold, and High Pressure Injuries Medical Treatment
Soft tissue injuries and amputations
These injuries can be devastating to the hand and the patient. Reattaching (replantation) is difficult, and even if successful may, cause long-term complications with pain and infection. Situations when a surgeon may attempt replantation are amputation involving a child, thumb amputation, or amputation of multiple fingers or the entire hand.
Crush or tear injuries and prolonged delay before evaluation may make successful replantation impossible. Each injury requires an immediate evaluation because each person's circumstances warrant all possibilities to be considered. The type, location, extent, person's wishes, and time of injury all contribute to the treatment plan. Some injuries will require immediate surgery for replantation. Others will require little medical intervention beyond cleansing, bandaging, and allowing the injury to heal. In some locations, the doctors and facilities needed for replantation do not exist.
Fingertip and nail infections may be treated in the clinic or emergency department with incision and drainage (if indicated), antibiotics, and close follow-up. A major consideration for an infection in the hand is the presence of a fluid collection or an abscess. If the infection is isolated to the skin, known as cellulitis, treatment involves antibiotics and close follow-up. However, an abscess requires drainage (sometimes known as "lancing"). If the abscess is large or near nerves, arteries, ligaments, or tendons surgery may be necessary for treatment. Hand infections have the potential for rapid progression leading to severe loss of function.
Serious burn injuries to the hand may require an evaluation by a hand or burn surgeon. Hospital admission may be required for treatment. Multiple operations including skin grafting may be needed in order to ensure the best outcome.
First-degree burn
Second-degree burn
Third-degree burn and deep second-degree burns
Chemical burns
Electrical burns
Cold injuries
High pressure injuries
Medically Reviewed by a Doctor on 11/17/2017
Medical Author:
Chad Tarr, MD
Medical Editor:
Next Page:
(Page 5 of 7)
Must Read Articles Related to Hand Injuries
Boxer's Fracture A boxer's fracture is a break through th...learn more >>
Broken Hand Broken hand (fractures) are caused by learn more >>
Finger Injuries Finger injuries can vary from:
Joint Problems Resources
Featured Centers
Health Solutions From Our Sponsors
Read What Your Physician is Reading on Medscape
Hand Injury, Soft Tissue »
Hand injuries are common and account for 5-10% of emergency department (ED) visits nationwide.


text:
Codham Mill, Shalford, Braintree, Essex
"Lying approximately 4 miles north of Braintree is this historical watermill and miller's house with the River Plant flowing beneath. Operated most recently by the Ashby Family from 1903 till 1956, this watermill is reputed to be the best preserved watermill in Essex. Millers House" It does not look well preserved today but I may be wrong. Listed grade 2 full details here.
It is located in a magical area although the building sits on a very sharp bend. Once this building is restored it will be a great place to live.
© Lionel Callow 2016


text: agisler 156 Report post Posted April 3, 2012 Hello, So i have made a game using C# synchronous sockets and have noticed it is really causing a huge drop in my frame rate. I am using UDP with non-blocking. I don't understand why its effecting my frame rate so much? I know asynchronous is the preferred method with c# but I don't quite understand how that can work in a game environment. Asynchronous makes sense to me in a event driven application as i have seen many examples of this done, just never for games. this is a sample of my code. Any input on this would be appreciated. [code] public override Packet UDPReceive() { byte[] data = new byte[1024]; try { int result = UDPSocket.ReceiveFrom(data, ref epSender); Packet receivedPacket = new Packet(data); return receivedPacket; } catch (Exception ex) { return null; } } [/code] Many thanks 0 Share this post Link to post Share on other sites


text:
Juventus show Celtic the exit with a 5-0 aggregate whipping
Juventus 2 – Celtic 0 (Agg. 5-0) (Champions League, March 6, 2013) (Extended highlights, More highlights) Juve killed the tie midway through the first half when Alessandro Matri tapped home a spilled shot from Forster. Gary Hooper failed to convert Samaras' cross in Celtic's chance of the first half. Fabio Quagliarella extened Juve's lead to 5-0 on aggregate with a simple tap in the 65th.
GIF: Alessandro Matri fires Juve 1-up v Celtic.
GIF: Fabio Quagliarella taps in Juve's 5th of the tie v Celtic.
Quality. A Celtic fan and Juventus fan swap scarfs over the fence.


text:
Home / Registration & Costs / Tuition & Fees
Summer Quarter at University of Washington is open to all – both matriculated and nonmatriculated students.
Matriculated students are those currently seeking a degree at the University of Washington.
Nonmatriculated students are those taking courses at the UW but not seeking a degree.
On the first tab below is tuition information for nonmatriculated students at the UW Seattle campus. The second tab has tuition information for matriculated students.
Tuition information for students at other UW campuses is available here:
Besides tuition, Summer Quarter students also pay a number of
required fees,
including the services and activities fee and the
U-PASS fee.
Nonmatriculated students taking only undergraduate courses pay undergraduate tuition. Students who take one or more graduate courses
(500-level or above) pay a higher tuition for all courses,
regardless of course level. See the second table below for more details on graduate-level course tuition.
Matriculated students pay tuition based on their classification as undergraduate, graduate or professional.
For tuition for matriculated graduate and professional students, see the UW Seattle Summer Quarter Per-Credit Rates table.
Enrollment Services
Phone: 800-506-1325
Email: email@example.com
Brought to you in partnership with UW Continuum College.
© University of Washington / Privacy / Terms


text:
Lexus redesigned its midsize luxury sedan for 2013, bringing more attractive styling inside and out. A new hybrid model joins the lineup this year. Cars.com reviewer Kelsey Mays takes a look at the ES 350, which he says is not just a gussied-up Toyota. Built on a larger platform than the outgoing generation, the new ES offers a spacious cabin, better driving experience and sporty styling. But will a confused transmission, inconsistent interior quality and lack of competitive features scare off car shoppers?
Cars.com Reviews the 2013 Lexus ES
Lexus Announces Pricing for 2013 ES Models
Research the 2013 Lexus ES 350


text:
All the accused of molestation arrested
Suri (WB), Jan 20 (PTI) All the three accused involved in molesting a girl and assault of her father were arrested today from different localities in Suri town of Birbhum district. "The accused were absconding after the incident. The police were busy collecting information from different sources which led to their arrest," Superintendent of Police Muralidhar said. The people of the town erupted in anger on January 7 following the molestation of the girl on the road near the main market of the town. The girl was going to take tuition with her father. The locals caught one miscreant after which a gang of youths raided the area and had beaten those who caught the culprit, the police said. An FIR were lodged against three accused, Muralidhar said. PTI COR AMD PS


text:
You are here > Home
> Hampers
All Gifts
Days Out
Unique Gifts
Gift Vouchers
All Prices
£0 - £25
£25 - £50
£50 - £75
£75 - £100
£100 - £150
£150 - £250
£250 +
We have a great selection of both sweet and savoury hampers, guaranteed to tempt any taste buds! Also, no matter what your budget, we'll have something for you - we have top end, luxury hampers if you're looking for an extravagant gift as well as hampers suited to smaller budgets, which contain delicious, great value products.
Of course, if you're looking for something a little bit different then why not consider one of our retro sweet hampers, featuring all the flying saucers, drumsticks and fried eggs you can eat! From Haribo hampers to luxury chocolates, there's something for every sweet tooth! It doesn't stop there either, we don't just offer food but also pamper hampers, where yummy smelling bath and body products are beautifully presented to recipients who are in need of some rest and relaxation!
If food isn't your thing, we also have some lovely wine hampers - a great gift for any connoisseur - a treat of some of South Africa's finest wines.
Not only are our hampers a winning gift, they make for convenient shopping too - you don't need to worry about wrapping them and they can be delivered straight to your loved one, which makes for a lovely surprise!


text:
Loading Prices..
A-Z of Bahamas Heritage (Macmillan Caribbean a-Z)
Designed as a lively encyclopedia, this includes all the elements that constitute the heritage of modern Bahamians: historical, geographical, economic, political, social and cultural. Key events, institutions, customs and personalities are not just described but evaluated. Yet, as even a dipping will show, this A-Z is far from being entirely strait-laced. Apart from heroes and high-fliers there are plenty of eccentrics and even a few villains. Compiled by the premier historian of "The Bahamas" and four years in the making, this sparkling reference book is the distillation of research and analysis spread over half a century. Printed in colour and beautifully illustrated, it is aimed at both fact-seekers and browsers. It will interest and profit Bahamians, visitors and armchair travellers alike."Macmillan Caribbean A-Zs" are a comprehensive series of reference books that provide an invaluable and entertaining source of information to the countries that comprise the Caribbean region. Highly illustrated and in full-colour throughout, they are a unique 'one-stop' resource to the cultural heritage of a fascinating and richly diverse part of the world.
- Dewey Decimal: 917
Book Details
- Physical Description: 7.7"x10.3"x1.0"; 2.9 lb; 416 pages
- Edition Info: Paperback; 2007-09-11
- History -- Americas -- Caribbean & West Indies -- Bahamas
- History -- Americas -- Caribbean & West Indies -- General
- History -- Americas -- Caribbean & West Indies -- General AAS
- History -- Historical Study -- Reference
- Nonfiction -- Education -- General
- Nonfiction -- Education -- General AAS
- Nonfiction -- Social Sciences -- Sociology -- Culture
- Reference -- Encyclopedias -- Antiques & Collectibles
- Reference -- Encyclopedias -- History
- Reference -- General
- Reference -- General AAS
- Travel -- Caribbean -- Bahamas
- Travel -- Caribbean -- General
- Travel -- Caribbean -- General AAS
- Travel -- Reference & Tips -- Guidebooks
- Travel -- Reference & Tips -- Reference
- Travel -- General
- Travel -- General AAS
Buying This Book
We query many merchants so that you can instantly compare prices and availability. You can even check historic prices and subscribe for notifications. For a manual check, clicking on a link will open a new window with a search for this book on the merchant's site of your choice.
- Amazon.com by title or by ISBN - widest selection, reliable service, good prices
- Abebooks.com by title or by ISBN - good source for rare and out-of-print books
- Textbooks.com by title or by ISBN - large inventory of new & used textbooks
- Alibris.com by title or by ISBN - their slogan is "books you thought you'd never find"
- eCampus.com by title or by ISBN - they specialize in textbooks, used and new
- BN.com by title or by ISBN - Barnes & Noble has a wide selection of new and used books


text:
Your cart is empty.
Army Black Knights Autographed Cards
8 total items
|Best Match Lowest Price Highest Price Name (A-Z)
- ~ DOC BLANCHARD 3 x 5 Index Card ~ JSA Certified Autograph ~ 1945 Heisman Army
Free Shipping
- 1955 Topps All American Football #59 Doc Blanchard Signed AUTO JSA SGC AUTHENTIC
Free Shipping
- Doc Blanchard Heisman College Fb Hof Signed Psa/dna 3x5 Autograph Authentic
Free Shipping
- Doc" Blanchard 1991 Heisman Signed Autographed Card #11 Sgc Authentic
Free Shipping
About Army Black Knights Autographed Cards
There is nothing more rewarding than getting the collections of Army Black Knights. This team already received multiple awards. If you want to get their memorabilia items, you don't have to follow complex procedures. At first, you need to look for the best and reliable shop. If you find it hard in searching for an ideal shop, don't miss to read several reviews online. These reviews serve as your guide in getting what you really want.
After choosing the best shop online, you have to know how the shop works. Among the different shops, sportsmemorabilia.com is the best. This site allows you to collect both simple and sophisticated types. If you are planning to deal with this site, you need to visit its multiple categories. Since you have lots of options to choose from, you shouldn't miss to get the Army Black Knights signed college cards. These items have genuine signs of the team. They also come in distinct types and forms. If you want to collect more stuff, get these Army Black Knights game used items. You can also get the stuff of every team member. The most in demand collections you can get are the Doc Blanchard autographed jerseys and a lot more.
After choosing the best collections, you have to order the items via online. For the best buying scheme, start adding the items in your shopping cart. Then, within a few days, the shop will deliver your desired items. With your knowledge on how to get these items, you will surely have a chance to collect the different memorabilia items of the team. So, start checking this site now!


text:
You are probably connecting with WinSCP to a server on Windows. SFTP, FTP, WebDAV and SCP protocols use Unix concept on one-directory-root. It collides with multiple roots (=drives) on Windows.
Each server solves the problem in different way.
/) as a virtual subdirectories (
/X or
/X:, where
X is the drive letter).
/cygdrive/X, where
X is the drive letter.
/X:, where
X is the drive letter.
X:/, where
X is the drive letter.
If you usually use one drive only with WinSCP, you would probably want to bookmark it, not to type it again all the time. Or use it as initial remote directory.
Site design by Black Gate


text:
Riches don't make a man rich; they only make him busier.
– Christopher Columbus
I celebrated Monday's Columbus Day by trying to discover something. I looked through my closet to see whether there was anything I didn't need and could give away.
I discovered I have six pair of black pants.
"You can wait tables in restaurants during your retirement," my wife said encouragingly.
I looked through the bathroom closet and found a new towel we got last month before company came.
"I really like that thick, white towel you got," I told my bride. "It feels super absorbent."
"That's a terry bath mat," she said without looking up.
Finally, I looked through the armrest console on her SUV, the one I rarely get to drive. I found about $3.50 in quarters and assorted spare change.
Sometimes, it pays to discover.
Why do "fat chance" and "slim chance" mean the same thing?
Why do we sing "Take me out to the ball game" when we are already there?
Why are they called "stands" when they are made for sitting?
Why is it called "after dark" when it really is "after light"?
Why is "phonics" not spelled the way it sounds?
Why do we put suits in garment bags and garments in a suitcase?
How come abbreviated is such a long word?
And, if love is blind, why is lingerie so popular?
PARKINSON WEEKEND EVENT: I represented Augusta's Parkinson's disease fight with a T-shirt during the July 4 Peachtree Road Race. Now you can help, too.
Saturday at the Wilson Family Y track, 3570 Wheeler Road, will be the annual Moving Day fundraiser – a collaborative effort of the National Parkinson Foundation and the National Parkinson Foundation Central Savannah River Area chapter.
Between 9 a.m. and 1 p.m., there will plenty of wonderful activities, entertainment and information to enjoy.
Last fall, Augusta's Moving Day raised $37,500 and had more than 300 participants, including people with Parkinson's disease, family, friends and co-workers. Let's do even better this year.
TODAY'S JOKE: Father O'Malley answers the phone.
"Hello, is this Father O'Malley?"
"It is!"
"This is the IRS. Can you help us?"
"I can!"
"Do you know a Ted Houlihan?"
"I do!"
"Is he a member of your congregation?"
"He is!"
"Did he donate $10,000 to the church?"
"He will."


text:
* Prices may differ from that shown
I got a medium sized tube of Burt's Bees Ultimate Care Body Lotion as part of a gift set at Christmas. Obviously there were other things in the set and one by one I used them up all fairly quickly. I have used Burt's Bees products before, with quite mixed results and this one wasn't really anything too special but I Am still pleased that I tried it out.
The main ingredients in this lotion are Baobab Oil, Extract of Green Tea and Pumpkin seed Oil. It is suitable for all skin types and though my skin is not particularly sensitive it has been known to react to the odd product. This lotion was fine though and I got no adverse reaction at all.
The cream is thick in consistency and very creamy. It has almost a whipped feel to it and it feels nice when it is applied. IT does take a little bit longer to be absorbed by the skin, however, though once it has sunk in there is no greasy feeling or residue. It is designed for use all over the body and I have used it everywhere bar my face. I have also used it as a hand cream but I found that it probably worked best on the drier parts of my ankles such as my skins and ankles.
The tube didn't last long at all even though I didn't use a great deal of it. I managed to get a few good applications and it worked well under fake tan and stopped it from streaking.
I don't think I'd go out to buy myself another tube of this however, as cheaper lotions work just as well.
I don't get it. I work with people who love the bones of this brand and are very loyal. I must admit I was a late starter with this and feel I haven't missed out on anything.
I made my purchases in Waitrose after much reading in magazines and reviews and still I don't relly see what the hype is about.
The ingredient hit list is quite something:
This is natural skin care to the claim of 90% and is even meant to be fine for sensitive skin, which I found it is. I, gratefully, didn't develop any skin issues
My concern with this product is that I felt no real results, even after a long period of time using it.
I would say this is a very thick and rich cream, it smells nice but not delightful in my personal opinion.
I found this took ages to sink into my skin and as claimed I didn't feel that all day moisturization.
I would recommend before you buy this, I paid £10 to try to get hold of a sample.
Overall I was disappointed but not every cream is going to work for everybody. I just found no matter how much I used, it did not benefit my skin and I can't personally recommend it.
It's not terrible, but my skin didn't feel nourished or protected against dry skin at all.
This is an all over body lotion and not to waste it I gave it to a friend, yes a positive is this is long lasting!
Burt's Bees Ultimate Care Body Lotion is a quick absorbing body lotion that has been formulated with Baobab Oil and nutrient-rich Pumpkin Seed Oil that will gently moisturise even the driest skin / '


text:
yeah, not exactly sure how to describe this... not exactly anime, but not anything else either... its just mah style of anime x3 YES I AM ALIVE MWA HAHA I haven't submitted a tut in like months ;A; but since then i have only gotten awesomer :D u didn't think it was possible did u? well IT IS! sooo here is my first tutorial in infinity ^^ enjoyy!
DragoArt members upload artwork and drawing tutorials! They are also allowed to leave comments on tutorials, profiles, etc. Many more features, as well; it's way better than just being a boring guest! Register Now!


text:
Below are poems written by poet
Theresa T. Click the Next or Previous links below the poem to navigate between poems. Remember, Poetrysoup is an environment of encouragement and growth. Thank you.
List of ALL
T poems
Theresa T
The poem(s) are below...
There have not been very many days in my life
well in fact, this is the only one,
on which I could say "I rode on a donkey cart today."
Sitting quietly on the porch of my mother-in-law's home,
typing away on my laptop, a knock came at the gate
and my name was hollered over the fence, an invitation for a ride.
I don't think there is anything quite like the dirt flying in your face with the wind blowing in your hair,
and the way the world—(mainly your poems and your laptop)—
is being swiftly left behind you, with the methodical whack of a donkey's back with a big heavy stick.
Copyright © Theresa T | Year Posted 2012


text:
Jil Sander's Uniqlo Collection to Launch Oct. 1 in the U.S. and U.K. and Oct. 2 in Asia.
Hong Kong-based sourcing giant Li & Fung Ltd. posted double-digit profit growth in the first half despite weak market conditions.
Escada has officially filed for insolvency at the Munich district court Thursday.
Specialty apparel retailers reported small sales gains, but department stores struggled.
Wal-Mart, Kohl's, Nordstrom, American Apparel and Urban Outfitters all turned in better-than-expected second-quarter profits.
The Estée Lauder Cos Inc. turned in a fourth-quarter loss in Q4, but remained profitable for the fiscal year.
Elizabeth Arden incurred a $3.6 million loss, and revenues came in at $212.6 million for the quarter.
Executives at Wet 'n' Wild know 2010 will be a crucial year for the beauty brand.
TheFairest.com is hoping to be the fairest of them all — all the private sale choices for beauty, that is.
Skin Authority, a skin care company that makes professional-grade products that are sold by doctors and used at spas, is looking for growth.
As part of its plan to open as many as 1,000 stores in China before 2012, New Balance will unveil its first Experience Store in Beijing on Saturday.
Pop singer Mariah Carey says her new women's scent "Forever" captures this moment in time in her life.
Nanette Lepore's style is about to hit a runway of a different sort: specialty store fragrance counters.
Vapour Organic Beauty is a new prestige beauty company, billed as the next generation of mineral makeup.
Drew Barrymore appears in the Cover Girl LashBlast Length mascara ad.
Hard Candy has traveled in many circles: Fred Segal, Sephora, Space NK and Duty Free shops across the world.
H20 Plus is turning over a new leaf with its first all-natural collection of face and body products.
Dermatologist-headed skin care brand kaplanMD and Studio BeautyMix, have partnered on a facial spa that opened last week in the Fred Segal store.
Giorgio Armani collaborated with "Inglourious Basterds" costume designer to create a dinner jacket for Brad Pitt's character.
Seoul installation now showcases "Turn Into Me," a selection of works by Swedish artist Nathalie Djurberg.
The retailer Brooks Brothers opened its smallest store in Manhattan's Rockefeller Center on Thursday.
Niche fragrance marketer Bond No. 9 creates Andy Warhol Success is a Job in New York perfume.
A five-year-old skin care brand, called Prescribed-solutions, has been acquired by Biopelle Inc., a subsidiary of the Ferndale Pharma Group.
The day's gainers and losers.
Moody's downgraded Claiborne's corporate family and probability of default ratings two notches on weak results.
S&P Retail Index picked up 0.3 percent despite poor retail sales data.
Parfums Lolita Lempicka is introducing its first spicy floral women's scent, Si Lolita, starting this summer.
After seven years of research, Sisley is launching a $750 night cream called Supremÿa.
Harrods is feeling the pinch just like every other retailer — partially thanks to some capital spending at the famed London department store.
Copenhagen Fashion Week presented its largest runway schedule yet with a record 42 shows, made up mainly of Danish designer-driven labels.
Buyers picked up easy sells at Designers & Agents, Brighte Companies and the many showrooms in Los Angeles.
Jon Hamm was bumped from the cover of Vanity Fair, but the extended Annie Leibovitz shoot made it in.
Bloomingdale's rebuilds the entire main floor of the Manhattan flagship for an estimated $45M to $55M.
David Meister will launch a signature label of red-carpet-ready eveningwear looks at Bergdorf Goodman later this month.


text:
Near new pair of Future glass k2 keels. Only used for two sessions. Looking to trade for a larger template thruster set, also glass and also Futures. If anybody wants to trade, shoot me a pm.
-Justin in SENC
Results 1 to 2 of 2
Thread: Fin Trade
Apr 28, 2014, 05:03 PM #1
Fin Trade
Apr 28, 2014, 05:04 PM #2
Or feel free to text a pic and your username to 252-five nine nine-1561


text:
No products
Check out
Display all pictures
Warning: Last items in stock!
Availability date:
Tweet Share Google+ Pinterest
BIOTULIN et SKINROLLER
Recipient :
Name of your friend * :
E-mail address of your friend * :
* Required fields
Send or Cancel
59,99 €
The minimum purchase order quantity for the product is 1
Add to cart
Be the first to write your review !
* Required fields