text:
'Ibrahimovic could win Ballon d'Or'
Paris Saint-Germain boss Laurent Blanc has stated his admiration for Zlatan Ibrahimovic and believes the striker is the one current player at the club who could win the Ballon d'Or.
• Cavani enjoying wide role
• Johnson: PSG need glamour tie in UCL
Ibrahimovic, 32, finished fourth in the vote for the 2013 prize after plundering 41 goals in 50 appearances in PSG's Ligue 1 title-winning season and helping his club into the last eight of the Champions League.
Though he has never managed to even get into the top three in the vote for the planet's best player, Blanc told Yahoo! Sports that the Sweden international could yet pick up the honour.
The PSG coach said: "He's a guy who, contrary to what people might believe, is very open. He really loves football. It's true that, from time to time, he has his bad moments during which you shouldn't bother him too much. But I've known players more difficult to handle than him.
"He likes to know what you're asking him to do, and once he's understood that, he puts in the necessary motivation and concentration.
"He's always there an hour before everyone else, working in a professional manner. In my team, the one who could be the Ballon d'Or is Ibra. He astonishes me with the speed of his movement and his balance, which is in keeping with that of a guy who measures 1.75 metres."
Meanwhile, PSG's super-rich Qatari owners have promised each player an unprecedented one million euro bonus should they win this season's Champions League, L'Equipe reported on Thursday.
Ibrahimovic is reported to have negotiated the bonus on behalf of the players with club president Nasser Al Khelaifi. The sum dwarfs the 240,000 each PSG player received for reaching the quarterfinals last season.
It is also in excess of the reported 450,000 euros the Chelsea squad received for becoming European champions in 2012, while Bayern Munich players each received only 800,000 for their treble last season. Real Madrid are said to have promised their players half-a-million euros each should they lift the club's 10th European title this season.
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subset: commoncrawl


text:
A teacher from the Austin area surrendered to Fort Worth police on Monday amid allegations of an improper relationship with a student.
According to the affidavit, Christina McCann, 39, had oral sex and intercourse with an 18-year-old male student while on a field trip to Fort Worth last February.
Over the weekend of Feb. 26, McCann and five students drove to Fort Worth to take part in a DECA event, a marketing and business competition.
While at their hotel, the affidavit said the students and teacher began drinking beer brought by the teacher. After that, McCann and the student retired to another room where the alleged incidents took place.
Administration at Lake Travis High School began investigating after hearing that McCann brought beer on the trip for the students. During that investigation, they learned of the alleged inappropriate relationship between the educator and student.
When investigators in the Travis County Sheriff's Department learned the alleged incident took place in Fort Worth, the Fort Worth Police Department was brought in conduct a follow-up investigation.
McCann posted a $10,000 bond Monday and was released.


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The CHRS is a professional organization of Canada's heart rhythm specialists and allied health professionals. It carries out its work through research, advocacy, education and development of best practices in the field of heart rhythm disorders.
Governance Structure
The CHRS is governed by a Board of directors who meet via teleconference on a monthly basis as well as face to face during the CHRS Annual Meeting, the Canadian Cardiovascular Congress (CCC) and Heart Rhythm Society (HRS) meetings. The Board runs the business of the society and delegates certain duties to other committees and working groups. The CHRS is also an official Affiliate of the Canadian Cardiovascular Society (CCS) who helps with the administration, management and coordination of their committees, finances and membership.
CHRS Committees
Volunteer committees are the foundation of the Society; the role and mandate of the committees vary depending on their purpose.
Ablation Committee: provides a structure for the analysis and communication of ablation issues
Annual Meeting Planning Committee: provides a structure to engage the members and assess the needs of the community to create a relevant and educational meeting for the members of the society.
Education Committee: provides a structure for the administration of the various teaching activities within CHRS and coordinates with members regarding activities in conjunction with HRS, CCC, the Annual Colloquium and other relevant meetings.
Device Committee: provides a structure for the analysis and communication with manufacturers of heart rhythm devices and provide updates on advisories.
Research Committee: promotes, fosters, and facilitates high quality research so as to improve the care of patients with heart rhythm disorders through creation of knowledge and its translation into best practices.
Nomination & Award Committee: prepares a slate of candidates for vacant Board positions & proposes a nominee to the CHRS Board for the CHRS Annual Achievement Award.
Click here to view a list of Electrophysiology (EP) Program Directors


text: Johannesburg - Cosatu remains intent on protesting on Johannesburg freeways, the trade union federation's Gauteng secretary Dumisani Dakile said on Friday. He said the South Gauteng High Court in Johannesburg had ruled it was unconstitutional not to be permitted to protest. "We will go back to Johannesburg to protest on its freeways," he said. The Johannesburg metro police and the SA Police Service had blocked the federation's earlier plans to protest a week ago. Dakile was speaking during a drive-slow protest on East Rand freeways by the Congress of SA Trade Unions against the planned e-tolling of Gauteng's freeways. The protest began with fewer than 30 cars in the morning. This number had risen to about 300 cars by noon, Dakile said. Father Mike Deeb, co-ordinator of the justice and peace department of the Southern African Catholic Bishops' Conference, said the fight against e-tolls was growing. "I think it started slow because permission came late last night, we had so much support on the roads," Deeb said. "Even if there weren't (big) crowds, awareness is growing and courage to think that we can overcome (the fight against) e-tolls and tell the government that e-tolls must be thought over."


text:
Watch Sardaarji 2 (2016) Punjabi Full Movie Online Starring – Diljit Dosanjh, Sonam Bajwa, Monica Gill, Yashpal Sahrma, Jaswinder Bhalla Director – Rohit Jugraj Genre – Comedy Country – India…
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Watch HD Movies Online For Free and Download the latest movies. For everybody, everywhere, everydevice, and everything ;)
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Artist description:
My first drawing, a pink heart cookie for you :)
Flash Draw Created Oct 20, 2009 470 x 338px Unless noted Copyright 2009 Flxx.
We encourage you to submit a comment and let the artist know what you think of this drawing. Please log in or join to post a comment.
Post a comment
Egoist Dec 23, 2010
my first drawing sucks ... ;] well done
blueberry120 Feb 21, 2010
whoa!!awesome first drawing!!!
Page 1


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Conducting boat charters; Conducting diving charters; Conducting power boat charters; Yacht and boat charter services
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Courtesy: Youtube
Make the most of your media library with the WD TV Live Wi-Fi Media Player. Enjoy home videos, photographs and your music collection on your HDTV. The player gives you the chance to enjoy stunning picture quality at 1080p high-definition. Through WD TV Live media player, you can easily connect your digital camera or camcorder and view photos and videos directly on your HDTV. The player is compatible with all digital imaging devices that support Picture Transfer Protocol. The player is not just for watching movies and browsing photographs, you can also enjoy various games in HD quality on your big TV. Have fun with popular games such as Rockswap, Texas Hold'Em, or Sudoku.
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Control your WD TV experience with the swipe of a finger using the WD TV Remote™ app. Great for text input when logging into a service and searching for a movie or video. One-touch access to your favorite online services. Download the free app from the Apple® iTunes store or the Android™ Market.
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The images represent actual product though color of the image and product may slightly differ.


text:
Vacancies for 2017
noticias on Mayo 13th, 2010 Comentarios desactivados
There are limited vacancies
Once the vacancies are filled up, we will not receive more applications; try to make your reservation as soon as possible. The Selection Committee will meet shortly every two weeks if needed.
More information in the requirement section


text:
Article on Ranking and Citation
I just saw that Chee Chow (San Diego State, Accounting) et al. have posted How Well Can Publication of an Article in a Top Accounting Journal Be Used as a Proxy for its Contribution? on SSRN. From the abstract:
The study investigates the appropriateness of using publication of an article in a top (specifically, top three) accounting journal as a proxy for its quality, as reflected by its impact on others' research. This investigation is motivated by an apparent increase in pressures to publish in top journals, with attendant effects on the allocation of faculty and institutional resources and more broadly, the health of accounting knowledge advancement.
Following related prior studies, SSCI citation counts are used as the primary metric for gauging impact. Over eight-year event windows for articles published in nine accounting journals in 1992, 1994 and 1996, articles published in the journals most often considered to be the top three (Journal of Accounting and Economics, Journal of Accounting Research, and The Accounting Review) do tend to be cited significantly more often than ones published in the other journals, though some of the non-top-three journals are not far behind. Far more important, across three different criteria for placing articles into top vs. non-top categories, there were substantial errors from using a top-three journal ranking as a proxy for quality. Many top accounting articles are published in non-top-three journals, at the same time that substantial numbers of non-top articles make it into the top three. Citations from a Google-based Internet search exhibited somewhat different patterns, but did not change these fundamental results. Together, these findings strongly support the need to evaluate each article on its own merit, rather than abdicating this responsibility by using journal ranking as a key proxy for quality.
The results of this study aren't all that surprising, but it does seem circular to use citations as a quality proxy, in an article that recommends evaluating pieces on "merit". The authors acknowledge this oddness, especially at pgs. 7, 18-19. Their defense of the measure is that qualitative measures of merit across many articles is a project whose "enormous scope" renders it impractical. And they remind us that institutions might not care as much about quality as a naive academic might think. It is, indeed, "possible" that schools might seek to promote placement in "top" journals because of their "circulation, visibility, and perceived statute," not quality signalling. (18)


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ALPHARETTA, Ga. — Those of us who live and work up here in the North Fulton area already know about all of the advantages the area offers to businesses looking for a place to set up shop.
But our suspicions were confirmed recently when the Atlanta Journal-Constitution ran a feature article in the Sunday Business section a couple of weeks ago under the headline "The big money still heads to Alpharetta."
About 30 years ago, the article notes, Alpharetta city leaders set out to attract executives to the area with estate homes, private golf courses and country clubs and other high-end amenities. Of course, all this was in addition to the natural attractions of the region: lots of green space and parks, beautiful horse farms and a general high quality of life.
Three decades later, the effort has succeeded even beyond the city leaders' wildest dreams. A number of Fortune 100 companies have established regional corporate offices and call and data centers in Alpharetta, including Coca-Cola, Motorola, Philips, Comcast, McKesson Provider Technologies and Lexis-Nexis.
These and dozens of other corporate heavyweights are providing a wide range of jobs for North Fulton and Forsyth county residents—from CEOs and other high-level executives to employees at virtually all staff levels. In 2009, Alpharetta landed at the top of Forbes magazine's "reloville" list.
In addition to its natural beauty, a great lifestyle, a wide range of housing options and some of the best schools in the state, corporations are attracted to competitive office rental rates that are up to 10-15 percent lower than rival office markets like Central Perimeter, the AJC article notes.
The area's miles of underground fiber-optic cable and data lines and a world-class broadband network make it an especially attractive location for all kinds of technology companies—900 of which now have a presence in Alpharetta. This includes seven of metro Atlanta's top 25 technology companies, such as Verizon, E-Trade Financial and AT&T, all of which have moved up Ga. 400 from the Central Perimeter area to build campuses in North Fulton.
The migration of tech giants like these is helping stem some of the area's bleeding from the loss of so many financial service and real estate companies that failed during the Great Recession. It will help fuel economic growth and provide stabilization for the market for years to come, a real estate strategist noted in the AJC article.
Of course, the Alpharetta region has its share of challenges, with transportation at the top of most lists. While getting from point A to point B within the region is fairly manageable, getting to and from North Fulton from throughout metro Atlanta remains a challenge.
In fact, many community leaders point to the lack of a rail system as the biggest challenge the area is facing, and the biggest potential impediment to future growth. Some say they'd like to eventually see a MARTA stop near North Point Mall, noting that the Central Perimeter area has four MARTA stops compared to none here.
The North Fulton Community Improvement District's COO Ann Hanlon said in the AJC article that her organization is studying transit options, while trying to demonstrate to authorities that the region is "ready for transit and make the business case for it and that we can't live without it anymore."
Brian Patton, CCIM is a real estate broker, author and instructor. His brokerage firm is based in the Alpharetta area. He can be reached via his website: www.CommercialPropertyGuy.com or at 770-634-4848.


text:
From the White House Dossier:
Arizona Secretary of State Ken Bennett is threatening to keep President Obama's name off the state's ballot in November unless he receives confirmation from Hawaii that it has a valid birth certificate on file for him.
Bennett, who spoke to Arizona radio host Mike Broomhead Thursday, said he requested the confirmation eight weeks ago and has not gotten it. Hawaii, he said, does not have to supply a certified copy of the birth certificate, merely send him an email confirming that it has one.
Asked by Broomhead if he would remove Obama's name from the ballot if Hawaii fails to comply, Bennett said: "That's possible. Or the other option would be that I would ask all the candidates, including the president, to submit a certified copy of their birth certificate."
Bennett said Hawaii law permits government officials to request verification of possession of a birth certificate in lieu of a certified copy.
"They could say yes tomorrow and the whole thing goes away," Bennett said. "If they can't say yes to that simple question, then it makes me wonder if we have to take it to another level. One way or another, we have to have some simple verification that people are qualified for the office if they're going to be on the ballot here in Arizona."


text:
Reader Gerald Stewart of Vista reminded me of a home-economics class basic: "The best tip I have is to cook as much as you can when you do cook, then put single servings into zip-lock sandwich bags, put a bunch of those into gallon zip-lock bags and then freeze. I can usually get 15 to 30 meals with only one batch of dirty dishes." This is an excellent reminder that the freezer is our friend! If you can find the time to cook, it pays to make double or triple batches of dishes your family enjoys, portion the food accordingly and freeze it for later microwaving or oven reheating.
Gerald points out that this works especially well with full-size turkeys (or roasts, if you prefer) when they're on sale. A 12-pound turkey he recently roasted yielded 15 zip-lock bag portions of sliced turkey and gravy. "With canned corn or beets and a quick salad from store-bought prepared lettuce," he writes, "the turkey and gravy becomes a quick meal. … I have my own 'TV dinners,' but I have controlled the fat, salt and cholesterol." Gerald, you are so right. Prepared foods can be very high in salts, fats and sugars, and it's great to be able to control these substances.
Cooking a turkey isn't a speedy undertaking, but it is a project that pays dividends if you can do it over the course of a weekend. Of course, you have to know how to take a turkey apart, but the only way to learn is to get in there and do it. (Trust me, that's how we all learned!)
Gerald adds that the turkey carcass, once you've removed most (not all) of the meat, can make a good soup or casserole base. Put the bones in your slow cooker with a couple of bay leaves and chopped cloves of garlic (or your favorite soup seasoning) and water to cover, and let them simmer. Then strain the broth. (I put mine in the fridge for a day to be able to scoop off the solidified fat that rises to the top after chilling.) Pack the broth into containers, freeze it, and on a busy night, defrost the broth, bring it to a boil, and add your favorite frozen (or fresh, if you have time to prep them) veggies and some noodles or tiny pasta. If you prefer a casserole-like dish, add enough pasta to absorb all the broth. If you'd rather have soup, add just a small amount of pasta.
Now, if you don't have time to cook a turkey, this fast recipe is from Marilyn Holst of Vista. Chicken Piccata is one of my favorite restaurant dishes, but I had no idea it was so easy to make at home. Chicken breasts and cutlets are one of those kitchen staples that should always be kept on hand, because they lend themselves to many recipes and to speedy cooking. Thanks, Marilyn!
Chicken Piccata
8 chicken cutlets (See note)
3 tablespoons vegetable oil
1/2 cup dry white wine
1 garlic clove
3/4 cup low-sodium chicken broth
3 tablespoons fresh lemon juice
2 tablespoons capers, drained
3 tablespoons unsalted butter
Fresh lemon slices
Chopped fresh parsley
Season cutlets with salt and pepper, then dust with flour. Spray a saute pan with nonstick spray; add vegetable oil and heat over medium-high heat.
Saute cutlets for 2-3 minutes on one side. Turn cutlets over and saute the other side for 1-2 minutes with pan covered. Transfer cutlets to a warm plate; pour fat from the pan.
Deglaze pan by adding wine and minced garlic. Cook until garlic is slightly brown and wine has nearly evaporated, about 2 minutes.
Add broth, lemon juice and capers. Return cutlets to pan and cook on each side 1 minute. Transfer cutlets to a warm plate.
Add butter and lemon slices to pan. Cook until butter melts, stirring often. Pour sauce over cutlets and garnish with chopped parsley. Serves 4.
Note: Cutlets are whole chicken breasts that are sliced in half horizontally to make two thinner pieces.)
Reader Rescues: Ree Jarrett of Vista is still looking for unusual candy recipes. And Linda Murphy of Vista is looking for a recipe for a breakfast bar made with coconut and cranberries. If you have a recipe to share or a question, send it to the address below. Thanks!
Laura Groch is the Features editor of the North County Times.Send items to Bites and Pieces, North County Times, 207 E.Pennsylvania Ave., Escondido, CA 92025 or e-mail to email@example.com .


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|January 8, 2013, 11:53 PM
Join Date: October 24, 2011
Posts: 50
I think I saw something very interesting on an ABC special with Diane Sawyer
I was running out on an errand and missed the show, however I caught a few minutes of it. And just a few minutes left me speechless...
Apparently the gun used in the recent middle school shooting in Connecticut is capable of, "firing 6 rounds per second" according to Gabrielle Giffords...
And there was an older man there, an astronaut. Who said that he believes that criminals will not be able to acquire weapons illegally...
Was that not disproved by the Conn shooter?
Another thing, Diane Sawyer mentioned worldwide, 5,000 children died due to gun violence worldwide last year; (forgot the exact wording) and that 85% of those shootings happened in America
Any comments?
Did anyone see the rest of the show?
Again, I missed most of the show, just wondering if anyone saw it and had comments
here's a link to an article I found if it helps (or I am supposed to link you all)
|January 9, 2013, 12:19 AM
Senior Member
Join Date: March 31, 2010
Location: Communist State of IL.
Posts: 1,564
The astronaut is her hubby. I hate when people argue things They lack knowledge of. I can shoot pretty fast but I would not hit much.
NRA Life Member, SAF Member
|January 9, 2013, 12:21 AM
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Join Date: October 26, 2012
Location: Los Angeles, CA
Posts: 779
Our news corporations are definitely "influenced" by big government.
I told the new me,
"Meet me at the bus station and hold a sign that reads: 'Today is the first day of the rest of your life.'"
But the old me met me with a sign that read: "Welcome back."
Who you are is not a function of where you are. -Off Minor
|January 9, 2013, 12:21 AM
Senior Member
Join Date: September 25, 2008
Location: CONUS
Posts: 9,779
The (former) astronaut is Gabby Giffords' husband, Mark Kelly. Dunno what he was before his wife got shot, but in recent memory he has been an ardent and vocal gun grabber. The fact that he knows nothing about gun laws doesn't appear to bother him. Why should it? He knows he's right -- just ask him.
The theoretical maximum rate of fire for a full-auto M16 is 800 rounds per minute, which works out to 13.3 rounds per second. A more realistic rate of fire, again on full auto, is 650 to 750 rounds per minute, which is 10.8 to 12.5 rounds per second.
On semi-auto ... which, of course, is the only mode available on a civilian Bushmaster ... the rate of fire is solely dependent on how fast the shooter can pull the trigger. I think six rounds per second is probably not realistic, and certainly not for a sustained burst. But even if someone can do 6 rounds per second -- he has a 30-round magazine. 5 seconds and he's empty. Gotta reload.
As to Sandy Hook, ALL the survivor accounts reported hearing a "pop ... pop ... pop" sound. Individual shots. Six rounds per second is 360 rounds per minute, which is a bit short of M2 .50 caliber "Ma Deuce" rate of fire. Nobody (whose report I have read) has mentioned anything sounding like a machine gun. Also, the Connecticut State Police have now revealed that the shooter didn't empty ANY of his magazines. Most, in fact, were only have used. The official speculation is that he was so accustomed to combat games and doing "tactical" reloads when transiting between rooms that he did the same thing in the school. (They also reported that he was wearing ear plugs.)
Beware of that statistic. That 5,000 "children" killed by gun homicides very likely includes felons up to the age of 18 who were killed by police officers in the line of duty. Remember ... ANY death by human agency is a "homicide," but not all homicides are "murders."
Last edited by Aguila Blanca; January 9, 2013 at 12:27 AM.
|January 9, 2013, 12:46 AM
Join Date: September 27, 2008
Location: Foothills of the Appalachians
Posts: 12,158
A note about Giffords: the lady was shot in the head by a deranged gunman. She had to go through a long and undoubtedly arduous recovery process. We can attack the message, but let's be respectful to the messenger.
Sometimes it's nice not to destroy the world for a change.
--Randall Munroe
|January 9, 2013, 09:26 AM
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Join Date: October 25, 2004
Location: Vinita, OK
Posts: 2,546
The Giffords also get to claim additional credibility by saying that she supported gun rights before she was shot. And the part that REALLY bugs me, they are trying to sell themselves as "typical gun owners" because "we own a couple of guns locked up in a safe back home." I'm sorry, but that doesn't mean you speak for me. Or that I even consider you "real gun people." Two guns? Locked in a safe somewhere else? You might as well tell me you are a serious reader because you own two books. Locked in a safe somewhere!
|January 9, 2013, 09:41 AM
Senior Member
Join Date: December 11, 2008
Location: Upper Michigan, above the Mackinac Bridge
Posts: 563
On one of the threads recently, I read a long article through a link that talked about why/why not we should have more/less gun control. Fabulous article and the statistic that really jumped out at me was that we have had more accidental drownings already in this year, than we have had murdered by mass shootings in the past (I don't remember the time frame but it was rather large, like a decade). But yet, no one wants to ban swimming pools. The other number that stuck out to me was 170 million. The number of people who have been slaughtered worldwide by their governments [B]after[B] confiscation of guns. They didn't believe or follow the governemnt and were rounded up and exterminated. That one was put out there by Dr. Ignatius Piazza from Front Sight.
Last edited by Qtiphky; January 10, 2013 at 07:35 AM.
|January 9, 2013, 09:44 AM
Senior Member
Join Date: June 19, 2012
Location: East Texas
Posts: 407
The cyclic rate of fire of a fully automatic AR-15 is six or seven hundred rounds a minute. That would work out to ten or so rounds a second. If he had said ten per second, I would say he was warping the time it takes to cycle the action - around a tenth of a second - into a cyclic rate of fire for a weapon that doesn't really have one. But I don't get six per second.
|January 9, 2013, 09:55 AM
Senior Member
Join Date: March 16, 2007
Location: Southern Arizona
Posts: 3,777
Giffords and her husband are both gun owners. They are supporting some additional gun control but not nearly as radical anti gun as Sarah Brady or Carolyn McCarthy. From what I've seen on the local TV she's pushing for a magazine size limit and closure of the so called gun show loop holes.
Not necessary, but certainly not as much as most oof the other anti gunners seem to want.
|January 9, 2013, 11:15 AM
Join Date: November 17, 2000
Posts: 18,794
Isn't idiotic to design a gun purity test? If you don't own more than two guns you are unworthy?
Give that up. A person who buys a Glock 19 for self protection and practices with it is just fine in my book.
I can claim you are not a gun person if you just shoot paper and haven't trained as extensively as some. Just shooting at cans with Gramps - well, gosh darn - you ain't a gun person.
If you disagree with her on the content of her argument, that's fine. But we don''t need some purity standard.
NRA, TSRA, IDPA, NTI, Polite Soc. - Aux Armes, Citoyens
Being an Academic Shooter
Being an Active Shooter
|January 9, 2013, 11:41 AM
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Join Date: September 25, 2008
Location: CONUS
Posts: 9,779
I think we need to be clear that this is not Gabby Giffords' campaign, this is her husband's campaign. Gabby Giffords has come a long way, but she has NOT recovered. Her "speech" is pretty much limited to one-word responses. We can only speculate as to the extent to which her internal mental processes have returned, or may have been damaged. We also don't know if it is only her speech that is affected. For example, while she can only speak single words, can she write coherent, full and complete sentences?
|January 9, 2013, 11:45 AM
Senior Member
Join Date: April 26, 2012
Posts: 185
Last year Mexico had 20,000 gun homicides, and a large proportion of them were children. That would make her statement a very sneaky untruth.
|January 9, 2013, 11:55 AM
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I agree with Glenn that we don't need to have a purity test, i.e. number of guns owned, but we also should cry foul when someone who has a .410 and a Marlin .22 in the closet presumes to be an expert on ARs, AKs, Glocks, etc. Seeing one once does not an expert make.
I toured the Space Shuttle once, and flew in an airplane a few times, a helicopter once. Should they interview me as an aviation expert the next time a plane crashes? Of course not.
'Merica: Back to back World War Champs
|January 9, 2013, 12:14 PM
Join Date: November 17, 2000
Posts: 18,794
That's the point - expertise on criminological, psychological, constitutional or whatever issues doesn't come from owning a set number of guns or shooting paper or birdies.
The skeet shooter with a rack of shotguns isn't a criminologist.
The actual ignorance of facts in this debate is astounding. However, ignorance is a characteristic of most legislators of both parties.
NRA, TSRA, IDPA, NTI, Polite Soc. - Aux Armes, Citoyens
Being an Academic Shooter
Being an Active Shooter
|January 9, 2013, 01:27 PM
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Posts: 1,185
This is more in the realm of strategy. I can impart the knowledge that a 223 hits harder than the 30.06/7mm used on bambi (Offense) faster than you can counter it (Defense). Most of what you see or hear has less to do with the competence or incompetence of the speaker but the determination of what has impact on a disinterested audience.
We are seeing 2 actors in play to advance gun control this time around
1. "Ban all guns" guy
2. "I/We own guns but are responsible gun owners who believe in safety and reasonable restrictions."
Giffords et al is representing type (2) here. Coincidentally, both types happen to support the same restrictions, a ban on mags and AR15s.
Going by the degree to which the type (2) gunowner is being touted in the media, one may see a pattern that does not match reality. The same way that going by CNN most people with NRA membership are cutting them up in disgunt, and that their membership is currently dropping.
|January 9, 2013, 02:26 PM
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Gen. McCrystal's comments reflect his lack of understanding 2A, why it is what it is and what it means, not an unfamiliarity with all kinds of arms. He is as in the dark as other media commentators, such as the gentleman who thinks there are no gun laws in Chicago, promoting the carnage there. Or that British fellow...
Favoring "gun-control" is now "hip". Victor Davis Hansen wrote a great article about it (being "hip" and its ironies) today. Like with many fads and other "hip" causes, reality isn't the issue.
Loyalty to petrified opinions never yet broke a chain or freed a human soul in this world — and never will.
— Mark Twain
|January 9, 2013, 03:30 PM
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I wouldn't discount the impact of this man's campaign. If you recall, the spouse of another injured politician used his sad situation to curtail some of our firearms freedoms before, a Mrs. Brady i believe she was.
|January 9, 2013, 03:31 PM
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Join Date: December 2, 2007
Posts: 1,073
The comments about 85% of the children killed around the world are here in the US is pure unadulterated BS. The media will just throw numbers around and expect people to believe them, and ironically, a lot of people do. Just remember when Katie Couric said on the "news" that 800 guns a day were crossing the border into Mexico. That was pure BS. Where she got the number from I never found out.
As to Mrs. Gifford, I truly feel bad about her circumstances and how she got where she is, but the same could just as easily have happened to any one of us on the forum. I don't consider one person's life any more valuable than another's, regardless of who they are, what they do, or how much money they have. The press is eager to circulate anything that goes along with their twisted "progressive" ideas. I can guarantee that, had they stood up for gun rights, she and her husband would have gotten exactly zero air time, except for a few lines in some of the conservative circles.
|January 9, 2013, 11:28 PM
Join Date: October 24, 2011
Posts: 50
Don't get me wrong, no disrespect for Giffords or Kelly...and I found what I was looking for:
video link included for all you
I do not agree with their stances on high-capacity magazines, etc...but here is the source so that you all can judge for yourselves
Kelly: "I bought a gun at Walmart recently, and I went through a background check...why can't we just make it more difficult?"
Diane: "But the NRA would say that they (criminals, shooters, etc) can get them (firearms) illegally"
Kelly: "I don't agree with that, the Gun Lobby even opposes a gun purchaser being checked against the terrorist watch list."
This is something I do not like to hear...
When they use a "fact" that a six-rounds-fired-per-second gun was used at the Sandy Hook Elementary School incident, why don't they bring up the FACT that the guns used in said crime were illegally obtained by the shooter?
We all know that the media is a big part of people's everyday lives, and that the media groups cater to their backers...and not always the truth.
However; we also know that it reaches a lot of people that may be on the fence about gun-control issues. Those are the true swing voters, the ones that need a bit of gentle education...I feel like they may be the truly decisive factor in all this present storm of anti-gun vs gun.
In regards to upcoming legislature and elections we need to be encouraging and in many situations, patient towards those on the fence.
I know this message put out by ABC and Diane Sawyer reached many ears the other night. Let us be tactful as well as patient and we can use this as a good bridge of conversation to our friends and family that are on-the-fencers.
I am surprised by the quantity of responses here, keep up the good conversation. Let us steer this towards regarding the video source and possible ways to reach other people.
Again, let me encourage everyone to not use this opportunity to bash or throw mud at the opposition. That only worsens our uphill climb and discredits ourselves in the upcoming days/months/years.
Emotions are powerful motivators, just watch the video. It is tragic and very sad about what happened to Giffords however; I personally feel like she is being used as an emotional crutch in support of more legislature. And that may be the most sobering aspect of all.
Keep up the good work!
Last edited by nocturnal; January 9, 2013 at 11:47 PM.
|January 10, 2013, 08:31 AM
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Location: Cowtown of course!
Posts: 1,728
NRA Chief Range Safety Officer, Home Firearms Safety, Pistol and Rifle Instructor
"There are three classes of people: those who see, those who see when they are shown, those who do not see."
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|N·mero de publicaci¾n
|Tipo de publicaci¾n
|N·mero de solicitud
|Fecha de publicaci¾n
|29 Ago 2000
|Fecha de presentaci¾n
|17 Mar 1998
|Fecha de prioridad
|17 Mar 1998
|Tambiķn publicado como
|N·mero de publicaci¾n
|Anilkumar Chinuprasad Bhatt, Thomas Richard Miller, Allen Frederick Moring, James Paul Walsh
|Cesionario original
|International Business Machines Corporation
|Exportar cita
|BiBTeX, EndNote, RefMan
|Citas de patentes (21), Citada por (10), Clasificaciones (55), Eventos legales (6)
|Enlaces externos: USPTO, Cesi¾n de USPTO, Espacenet
The invention pertains generally to circuitized substrates and particularly to chip carriers for integrated circuits (semiconductor chips).
In Ser. No. (S.N.) 08/495,248, now U.S. Pat. No. 5,599,747, entitled "Method Of Making Circuitized Substrate" and filed Jun. 27, 1995, there is defined a process for making a circuitized substrate wherein a temporary support portion is formed and removed, leaving at least of the formed cavity's sidewalls not including metallization thereon following the removal.
In Ser. No. 08/359,491, now U.S. Pat. No. 5,542,175, entitled "Method Of Laminating And Circuitizing Substrates Having Openings Therein" and filed Dec. 20, 1994, there is defined a method of laminating two substrates and circuitizing at least one of these. A plug is provided and shaped to fit within an opening defined in the structure, and then removed following lamination and circuitization.
In Ser. No. 08/390,344, entitled "Organic Chip Carriers For Wire Bond-Type Chips", filed Feb. 15, 1995, there is defined a chip carrier having a single-tiered cavity within a dual layered (of organic material) substrate and a semiconductor chip located in the cavity. The chip is wire bonded to circuitry on the substrate.
In Ser. No. 08/470,389, now U.S. Pat. No. 5,566,448, entitled "Method Of Construction Of Multi-Tiered Cavities Used In Laminate Carriers", filed Jun. 6, 1995, there is defined a method of forming a chip module wherein a rigid cap and substrate are used, the cap and substrate laminated together with bond pads connected to circuitry disposed in a bottomed cavity of the cap. Following cap circuitization, part of the cap (that over the cavity) is removed and a semiconductor chip coupled to the circuitry.
In Ser. No. 08/820,995, filed Mar. 20, 1997 and entitled "Method Of Making A Circuitized Substrate", there is defined a method of making a circuitized substrate using a removable film layer. It is understood that the presently claimed invention represents an alternative, enhanced version of the method in Ser. No. 08/820,995.
The above pending application and patents are assigned to the same assignee as the present invention. The teachings of these documents are incorporated herein by reference.
It is known that integrated circuit devices (hereinafter referred to as semiconductor chips) are typically electronically packaged by mounting one or more chips onto a dielectric, e.g., alumina, circuitized substrate (referred to as a chip carrier), with wire bonds used to electrically connect I/O (input/output) contact pads on each chip to corresponding contact pads (and therefore to corresponding fan-out circuitry) on the circuitized chip carrier substrate. Wire bonding is a well known process in the art and further description is not believed necessary. The resulting chip carrier is then typically mounted on a printed circuit board (PCB) and, using circuitry on the PCB, electrically coupled to other such chip carriers and/or other electronic components mounted on the PCB.
Ceramic chip carrier structures have proven extremely useful in the electronic packaging field. However, the use of ceramic as the dielectric material of the substrate does present certain limitations and drawbacks. For example, the speed of propagation of an electrical signal through a conductive wire located on a dielectric layer (or between two dielectric layers for that matter) is proportional to the inverse of the square root of the dielectric constant of the dielectric material layer or layers. As is known, the dielectric constants of most ceramics are relatively large, e.g., the dielectric constant of alumina (the primary constituent of ceramic materials used in these substrates) is relatively high, which results in ceramic chip carriers exhibiting relatively low signal propagation speeds in comparison to substrates of other (e.g., organic) materials, such as fiberglass-reinforced epoxy resin, polytetrafluoroethylene, etc.
Ceramic chip carrier usage also presents certain input/output (I/O) constraints. For example, a single-layer ceramic chip carrier substrate includes but a single layer of fan-out circuitry on the upper surface of the ceramic substrate, extending to contact pads around the outer periphery of the substrate. A lead frame, having inner leads connected to these peripheral contact pads, is typically used to electrically connect such a ceramic chip carrier to a printed circuit board (PCB). As the number of chip I/Os has increased (in response to more recent enhanced design requirements), it has been necessary to increase the wiring density, sometimes to the point where undesirable cross-talk between adjacent wires may occur. Further, it has become increasingly difficult to form a correspondingly large number of contact pads around the outer periphery of the ceramic substrate. Accordingly, it is understood that single-layer ceramic chip carrier substrates are limited in the ability thereof to accommodate semiconductor chips with significantly increased I/O counts as required in today's packaging designs.
Efforts to accommodate semiconductor chips having relatively large numbers of I/O pads have led to the use of multilayer ceramic chip carrier substrates utilizing what are referred to as "ball grid arrays" (BGAs) in lieu of lead frames. Such multilayer types of ceramic chip carrier substrates differ from single-layer ceramic chip carrier substrates in that these include two or more layers of fan-out circuitry on two or more ceramic layers. Significantly, these layers of fan-out circuitry are electrically interconnected by mechanically drilled holes (called "vias"), which are plated and/or filled, with electrically conductive material (e.g., copper). In addition, a certain number of such holes extend from the layers of fan-out circuitry to respective lands on the chip carrier substrates, on which are mounted solder balls (formed in grid arrays, hence the term "ball grid array"). These solder balls are intended to be mechanically and electrically connected to corresponding solderable contact pads on a receiving substrate, e.g., PCB. Unfortunately, the mechanically drilled holes electrically interconnecting the layers of fan-out circuitry have relatively large diameters, requiring the spacing between the fan-out wires to be relatively large. This relatively large spacing between fan-out wire understandably limits the number of chip I/O pads which can be accommodated.
Additional efforts to package chips having a relatively large number of chip I/O pads have led to the use of multi-tiered cavities in multi-layered ceramic substrates. When using such a packaging configuration, a chip is mounted face-up (its I/O pads facing upwardly) at the bottom of a multi-tiered cavity. Wire bonds (e.g., using fine gold wire) are extended from the I/O contact pads on the exposed upper surface of the chip to respective contact pads on the exposed upper surfaces of the different layers of the multi-layered ceramic substrate. While this configuration does make it possible to accommodate a relatively large number of chip I/O pads, it unfortunately typically mandates usage of multiple manufacturing set-up operations to accommodate the different tier height for the relatively long wire bonds extending from the chip to the spaced tiers.
Typically, ceramic chip carrier substrates are also limited in heat dissipation capabilities. For example, in the case of a multilayer ceramic chip carrier having a chip positioned at the bottom of a multi-tiered cavity, heat dissipation is typically achieved by providing a heat sink directly beneath the cavity. This implies, however, that the heat generated by the chip must necessarily be conducted through the ceramic layer at the bottom of the cavity before reaching the heat sink. As a consequence, effective heat dissipation is hampered.
The present invention, as defined herein, teaches an improved method for making a circuitized substrate capable of overcoming the aforementioned drawbacks of other such products. This method is uniquely adaptable for use with many existing manufacturing apparatus (e.g., wire bond and photoimaging equipment) without extensive alteration thereof and can thus be used on a mass production basis to enjoy the benefits thereof.
Different methods for making circuitized substrates are described in U.S. Pat. Nos. 5,022,960 (Takeyama et al), 5,142,448 (Kober et al), 5,144,534 (Kober) and 5,288,542 (Cibulsky et al). In U.S. Pat. No. 5,022,960, a laser beam is used to remove a selected portion of a substrate (12) which eventually accommodates a semiconductor chip (20) positioned on a metal layer (11) also attached to the substrate. In U.S. Pat. No. 5,142,448, there is described the step of compression molding several dielectric layers to form a laminate. Flexibility of certain parts of the board is attained by the provision of slots, and a "plug" is located for occupying the defined flexible region. In U.S. Pat. No. 5,144,534, a method of making rigid-flexible circuit boards is described in which a removable plug is used in the PCB during processing and then removed. And, in U.S. Pat. No. 5,288,542 (assigned to the same assignee as the present Application), another method is described for making a rigid-flexible circuit board in which a release layer (6) is used during processing and subsequently removed.
The above four patents fail to particularly overcome many of the aforementioned difficulties regarding known processes while assuring the higher densities mandated in today's technology.
It is believed, therefore, that a method of making a circuitized substrate which overcomes the above disadvantages and which can be performed in a facile and relatively inexpensive manner would represent a significant advancement in the art. It is further believed that providing such a method which will further enhance one or more of the unique processes defined in the foregoing cited patent applications will also represent a significant art advancement.
As defined herein, such a method will result in a circuitized substrate capable of: (1) exhibiting relatively high electrical signal propagation speeds; (2) accommodating relatively high I/O chips; (3) exhibiting relatively short "time of flight" electrical signal speeds; and (4) exhibiting a relatively high rate of heat dissipation.
It is, therefore, an object of this invention to provide a method of making a circuitized substrate capable of being used as a chip carrier assembly which can be performed in a facile and relatively inexpensive manner in comparison to existing carrier manufacturing processes.
It is a more particular object of the invention to provide such a process which is readily adaptable to existing manufacturing equipment without extensive modification thereof.
In accordance with one aspect of this invention, there is defined a method of making a circuitized substrate comprising providing an electrically insulative base member having first and second opposing surfaces, depositing a first layer of metallization onto at least one of the first and second opposing surfaces, positioning a photoimageable member onto the first layer of metallization, the photoimageable member including a layer of photoimaging material and a sacrificial dielectric layer thereon, exposing selected portions of the photoimaging material through the sacrificial dielectric layer to provide a pattern within the photoimaging material, removing a selected portion of the base member to form an open cavity therein having sidewalls, depositing a second layer of metallization onto the sidewalls of the open cavity, removing the sacrificial dielectric layer, removing selected portions of the photoimaging material corresponding to the pattern, depositing a third layer of metallization onto the first and second layers of metallization, removing the selected portions of the photoimaging material corresponding to the pattern to expose selected parts of the first layer of metallization and removing the selected parts of the first layer of metallization.
In accordance with another aspect of the invention, there is defined a method of making a circuitized substrate which comprises the steps of providing an electrically insulative base member having first and second opposing surfaces, depositing a first layer of metallization onto at least one of the first and second opposing surfaces, positioning a photoimageable member onto the first layer of metallization, the photoimageable member including a layer of photoimaging material and a sacrificial dielectric layer thereon, removing a selected portion of the base member and the photoimageable member to form an open cavity therein having sidewalls, depositing a second layer of metallization onto the sidewalls of the open cavity, removing the sacrificial dielectric layer, exposing selected portions of the photoimaging material to provide a pattern within the photoimaging material, removing first selected portions of the photoimaging material corresponding to the pattern, depositing a third layer of metallization onto the first and second layers of metallization, removing remaining portions of the photoimaging material to expose selected parts of the first layer of metallization, and removing the selected parts of the first layer of metallization.
FIGS. 1-13 represent the various steps of making a circuitized substrate in accordance with a preferred embodiment of the invention.
For a better understanding of the present invention, together with other and further objects, advantages and capabilities thereof, reference is made to the following disclosure and appended claims in connection with the above-described drawings.
As understood from the following, the invention defines a method of making a circuitized substrate and resulting chip carrier wherein the resulting chip carrier is particularly designed to accommodate wire bond-type chips. The carrier produced in accordance with the teachings herein is capable of: (1) exhibiting relatively high electrical signal propagation speeds; (2) accommodating relatively high I/O chips; (3) avoiding the need for multiple manufacturing set-up operations heretofore associated with multi-tiered wire bond packages (as well as achieving a relatively short "time of flight" for electrical signals propagating through the wire bonds); and (4) assuring a relatively high rate of heat dissipation. In particular, the chip carrier produced in accordance with the preferred method taught herein achieves relatively high electrical propagation speeds because it employs organic materials, such as fiberglass-reinforced epoxy resins (in the trade also referred to as "FR4"), polytetrafluorethylene (e.g., Teflon), etc. in lieu of ceramic materials. (Teflon is a trademark of E. I. duPont deNemours and Company.) The resulting chip carrier also accommodates relatively high I/O count chips because it uses at least one organic photoimageable dielectric layer in which photo-vias may be formed to electrically interconnect two (or more) layers of fan-out circuitry. The resulting chip carrier achieves a relatively short "time of flight" for electrical signals propagating through the wire bonds. The invention may further provide enhanced heat sinking for such a structure through the attachment of a sound heat conductor (e.g., copper sheet) to one side of the substrate and placement of the chip (or chips) in thermal contact therewith.
In FIG. 1, there is shown an electrically insulative base member 13 which may be used in the present invention to produce a chip carrier product (described below). It is understood that the invention is not limited to the particular configuration shown in FIG. 1, as others are readily possible. Base member 13 includes first and second dielectric layers 15 and 17 which sandwich therebetween a conductive layer 19. In a preferred embodiment, each of the two dielectric layers is comprised of fiberglass reinforced epoxy resin (often referred to in the industry simply as "FR4") and each possess a thickness of from about 2 mils (thousandths) to about 20 mils. Thicknesses less than about 2 mils for this particular material may be undesirable because the resulting structure may be flimsy and difficult to handle during subsequent manufacturing processes. Thicknesses greater than about 20 mils may be undesirable because such thick dielectric layers, in addition to requiring relatively large conductor line widths and thicknesses, also may prevent optimum package electrical performance.
Sandwiched between dielectric layers 15 and 17 is at least one conductive layer 19, preferably of copper or other well-known conductive material and possessing a thickness of preferably within the range of about 0.125 mils to about 2.5 mils. The thicknesses for layer 19 of less than 0.125 mils may prove undesirable should the resulting structure be subjected to relatively high temperatures. Additionally, thicknesses greater than 2.5 mils may prove undesirable because of the additional time necessary to form such layers using conventional plating techniques and associated difficulties with line width control.
The resulting structure shown in FIG. 1 thus preferably possesses a thickness within the range of only about 4.125 mils to about 42.5 mils. More preferably, a thickness of about 24 mils is used.
Dielectric layers 15 and 17 are bonded to the conductive layer 19 using a lamination process, such a process known in the art and further description is not believed necessary.
Base member 13 is thus shown to include at least two opposing surfaces 21 and 23. Although two dielectric layers are shown for base member 13, it is understood that the invention is not limited thereto. Specifically, it is only necessary to provide one such layer while still attaining the advantageous results taught herein. At least two layers are used when it is desired to incorporate an internal conductive (e.g., power, ground or signal) plane 19 as part of the final structure. Understandably, several dielectric layers and corresponding internal conductive layers may be utilized, depending on operational requirements for the finished product.
In FIG. 2 (a plan view of the base member 13 of FIG. 1 but on a smaller scale for illustration purposes), a pair of L-shaped slots 25 and 25' are formed within member 13. As understood, these slots serve to substantially define the ultimate boundaries of an opening (described below) to be provided in member 13 such that the member can accommodate a semiconductor chip positioned within this opening and electrically coupled to circuitry (described below) of member 13. As seen in FIG. 2, these slots 25 and 25' define a substantially rectangular (e.g., preferably square) portion 27 within base member 13, which hereinafter will be referred to as a temporary support portion.
Although a substantially rectangular shape is shown for temporary support portion 27 in the plan view of FIG. 2, other shapes are readily possible, depending on the ultimate chip configuration and the method of coupling this chip to the final product's electrical circuitry. In one example, the resulting opening (51, FIGS. 9-16) of this support portion possessed (when removed) width and length dimensions each within the range of about 500 to about 700 mils, with each of the slots 25 and 25' possessing an average width ("W" in FIG. 2) of only about 60 mils.
In the broader aspects of the invention, it is possible to provide only a singular slot within member 13 (e.g., to define a substantially cylindrical support portion) thereby allowing only one non-removed segment.
The preferred means for providing slots 25 and 25' is to use a routing process using conventional routing equipment, further description thus not believed necessary. In one embodiment, the two non-removed parts 28 each possessed a width ("W2" in FIG. 2) of only about 40 mils. (Notably, the slots 25 and 25' are shown in larger scale in FIGS. 1, 3 and 4, again for illustration purposes.)
In the next step (FIG. 3), it is preferred to provide a metallized, thin seed layer on the surfaces 21 and 23 of base member 13, and also on the internal surfaces of individual slots 25 and 25'. As seen in FIG. 3, this thin seed layer (29) material extends through the entire thickness of member 13. The preferred material for seed layer 29 is palladium-tin. Understandably, the described seed layer serves to enhance subsequent positioning of the invention's conductive circuitry (described below). By the term "thin" as used herein is meant a thickness for seed layer 29 within the range of about 40 to 60 angstroms.
As mentioned above, a key attribute of the present invention is its adaptability to many existing technologies, e.g., those used in mass production, by allowing the invention as defined herein to benefit from the several advantages thereof. One particular process involves what is referred to as a dry film resist operation in which the photoresists used are applied in dry film form (as opposed to liquid film application, another known process). Typically, such films are removed from supply rollers and aligned with respective surfaces of the substrates being treated. Such a process has become widely accepted in the field, and further description is not believed necessary.
In FIG. 4, two photoimaging members 31 and 31', each comprising a layer of dry film photoimaging (photoresist) material 32 and thin layer 32' of dielectric film material (e.g., Mylar) are shown as being positioned on the respective opposing surfaces of member 13. In one example, each layer of photoresist material possessed a thickness of only from about 0.6 mils to about 2.0 mils. A preferred material is a negative-acting photoresist, various examples being known in the art, including Photoresist 3120 and Photoresist T168, both available from E. I. duPont deNemours and Company under these product names. Negative-acting photoresists, when applied and exposed through a suitable photomask, undergo a physical and chemical change in the exposed areas that render these areas insoluble to the subsequent developing solution which is to be applied thereto. The thin removable film layer 32' forms part of these members and functions as a sacrificial member as defined hereinbelow. Provision of such a layer also facilitates photoresist handling. A critical aspect of this invention is that the film layer is not removed after the exposure step, but instead remains on the member throughout at least the next few processing steps.
FIG. 4 also illustrates that the photoimaging material 32 and 32' functions as a spacer between the substrate's outer surfaces and the photoimageable member's sacrificial layers 32'.
In FIG. 5, base member 13 is shown following the removal of the temporary support portion 27 (FIG. 2) using preferably a punching operation. Alternatively, routing may be used. In both processes, corresponding parts of the two-layered photoimageable member is also removed. A much larger cavity 34 results, including two (one shown) thin strips 35 of metallization which covers the part of the sidewalls previously occupied by parts 28 (FIG. 2).
In FIG. 6, a second thin metallization (seed) layer 36 is applied to all surfaces in a, non-ultraviolet (e.g., yellow room) environment. This thin seed layer is preferably of the same or similar material as the first metallization layer applied in the step of FIG. 3. Thin seed layer 36 provides metallization on all of the cavity's sidewalls.
In FIG. 7, the thin film 32' (e.g., Mylar) has been removed, preferably by peeling. Very significantly, such removal in turn removes the second thin seed metallization layer 36 on surfaces previously covered by the film, but leaves the thin seed layer 36 on the cavity's sidewalls.
With attention again to FIG. 4, the photoimageable members 31 and 31' are each applied across the entire outer, opposing surfaces of member 13, including over the 60 mil wide slots 25 and 25' (FIG. 2) and the upper and lower surfaces of temporary support portion 27. The two layers of each member bridge the L-shaped slots 25 and 25' without bowing or otherwise extending within the slots. Heretofore, when larger openings (e.g., 500 milsū500 mils) were provided in the base member 13, such dry film photoresists were incapable of spanning ("tenting") the relatively large widths of such openings. The undesirable result was a sagging or similar disfiguration of the photoresist, rendering subsequent processing extremely difficult and often impossible. Further, the use of such a large spanning structure resulted in what may be described as "doubling over" of the resist when subjected to the subsequent developing operations in which various relatively high spray pressures of the developer are used, spraying being the preferred technique for providing such developer. As a result, inadequate development processes resulted with photoresist residues occasionally remaining on the parts to in turn result in unacceptable product yield rates. Previous attempts to minimize this problem through the adjustment of the exposure pattern for the photoresist or to reduce these pressures in the development step proved unsuccessful in providing consistent improvement. The layers 32 and 32' of each of the invention's photoimageable members are shown as easily bridging (spanning) the respective slots 25 and 25' in FIG. 4, such that the aforementioned problems are eliminated.
As mentioned, although a negative-acting photoresist procedure has been described, the invention is not limited thereto. It is also possible to instead use positive-acting photoresists in which the exposed areas thereof under the photomask, when immersed in the developing solution, are removed. Such photoresists may also be applied in film (sheetlike) form, as are negative-acting photoresists. It is thus seen that the present invention is adaptable to more than one accepted technology. Exposure of the photoresist layers 32 now occurs using standard photolithographic equipment and steps. Significantly, such exposure may occur either before removal of the sacrificial thin Mylar layer 32', or shortly thereafter (as described immediately above). If the former, exposure is possible through the transparent Mylar, thus allowing the Mylar to remain and protect the photoresist (e.g., during subsequent handling, processing, etc.).
Following exposure, the resist-coated base member 13 is immersed in an appropriate developing solution (e.g., sodium carbonate, propylene carbonate), which allows the unexposed areas to be removed without excessive impact on the hardened, exposed area. Baking or other processes may be used at this stage to further harden the remaining, exposed portions, if desired.
In FIG. 8, base member 13 is shown following the partial (developed) photoresist removal operation. As such, only portions of photoresist layers 32 and 32' remain, these portions defining a pattern which will eventually represent the end product's circuitry. These remaining portions are represented by the numerals 33 (those on the upper surface) and 33' (those on the lower surface). It is understood that the removed portions of the photoresist in turn result in openings (35) which, in turn, expose preselected areas on the respective adjacent surfaces on which circuitization is to eventually occur to form the product's circuitry. Thus a predetermined pattern on both surfaces is provided.
In FIG. 9, member 13 has been subjected to a metallization process in which a third layer of metallization (e.g., copper or similarly conductive metal) 41 is deposited in the exposed portions (e.g., in openings 35) remaining following development and removal of the desired portions of photoresist 32 and 32'. In a preferred embodiment, this metallization (which will form at least part of the circuitry for member 13) is deposited using a plating process, and more preferably an additive plating process. Additive plating is well known in the art and further description is not believed necessary. This process may also be referred to in the art as a wet copper plating process. Other plating and/or photolithographic techniques may of course be utilized in place of that mentioned above. For example, positive acting photoresists (as mentioned above) and negative acting photoresists used in conventional subtractive circuitization processes may be used. It is understood that either electroplating or electroless plating may be used to form the circuitry in accordance with the teachings of the present invention. In one embodiment, the deposited copper 41 on the upper and lower surfaces of member 13 and on the sidewalls of 25' may possess a thickness of only from about 0.5 mils to about 2.0 mils. The aforementioned palladium-tin seed layer 29 is, understandably, covered by metallization 41. It is understood, however, that this layer is present and has remained on the exposed surfaces of member 13.
Significantly, in FIG. 9, the exposed upper surfaces defining the conductor channels are plated to the same height (thickness) as the adjacent, remaining photoresist portions 33. Equally important, the plating of the cavity sidewalls is also of uniform thickness adjacent the two dielectric layers 15 and 17, and the internal conductive plane 19. Industry requirements may vary for final plating height (e.g., from 0.5 mil to 2.0 mil) and is generally limited by the thickness of the photomask being used to define the circuitization. For an additive process, the thickness in the conductor channels and cavity sidewalls will be similar and limited by the photoresist thickness and the ability of the plating process to uniformly deposit metal on the surface, in the plated through holes and cavity. For a process that plates at 100% throwing power (plating on surface is the same as in the PTH's or sidewalls), this invention provides the ability to plate a uniform copper thickness on all exposed surfaces.
In FIG. 10, the remaining portions 33 and 33' of photoresist are removed. A preferred step for doing so is to use a solution similar to the developing solution (e.g., sodium carbonate, propylene carbonate, benzyl alcohol) but at an elevated temperature compared to the prior developing operation. Such removal leaves exposed portions of the first layer 29 of metallization between the respective conductors 41 formed by the foregoing metallizations. These conductors may be in the form of extended signal lines, small size diameter conductor pads, etc. In the embodiment of FIG. 10, such electrically conductive elements are understandably electrically connected by this initial metallization layer 29, which, of course, would be unacceptable for subsequent product operation.
Consequently, in FIG. 10A, these remaining exposed portions of metallization 29 are removed (except for under the overlying conductors 41). A preferred process for effecting such removal is to use a solution that preferentially complexes with the palladium/tin. One method well known in the industry is to use a solution containing a cyanide salt at a concentration high enough to complex the available palladium/tin. The result is a plurality of conductive elements 41 in the form of lines and/or pads (as described) on the outermost, external (upper and lower) surfaces of member 13, these elements substantially surrounding the internal positioned opening (now referenced as numeral 51) which, as understood, is entirely conductive. In one embodiment of the invention, these conductive elements may possess a width of only about 0.5 to 5.00 mils, while it is possible to provide corresponding conductive lines having a length of at least 0.25 mil to 100 mils.
At this point, it may also be desirable to selectively apply a fourth layer 53 of metallization in the form of a precious metal (e.g., gold) 53 (FIG. 11) to various parts of the respective conductive elements formed on the upper and lower surfaces of member 13. Other metals for this purpose may include palladium, cobalt, nickel or combinations thereof (with gold). A desired thickness for this fourth metal is within the range of only from about 0.04 to about 0.25 mils. Such application is preferably performed by an additive plating process such as described above, a preferred process being electroless plating. Electrolytic plating is also possible. Such additional plating is particularly desired for those surfaces of the circuitry designed to receive the highly conductive, fine wires (described below) which will eventually couple a semiconductor chip (also described below) to this circuitry. Using suitable masking, it is possible to only selectively plate the invention's outer conductors and thereby exclude plating the relatively large internal opening 51. Although all surfaces are shown in FIGS. 11-13 as having such metal thereon, preferably (for cost reasons) only the upper surfaces of each conductive member 41 designated to have such a wire bonded thereto are covered.
In the event that it is desired to provide a heat sinking and/or stiffening member, such a member, represented by the numeral 61 in FIG. 12, may be simply bonded to the bottom surface (including the respective conductors 41 if present) of member 13. In one embodiment, this member 61 was comprised of a 14 mil thick copper sheet which was secured to member 13 using an epoxy-based adhesive represented by the numeral 63. Several adhesives are possible, as are several different metals (e.g., aluminum) for member 61.
(Although a second, bottom electrically conductive layer is shown in the embodiments depicted herein, it is understood that, in its broadest aspects, the invention may only utilize a singular (e.g., upper) conductive layer. Should this be the situation, the heat sink and/or stiffener 61 would understandably be directly attached to the lower surface of the bottom dielectric layer 17.)
The member 13 in FIG. 12 is now ready to receive an integrated circuit (semiconductor) chip, such as shown in FIG. 13 (the chip represented by the numeral 71). Preferably, chip 71 is bonded to the heat sinking and/or stiffening member 61 using a second adhesive 73, a preferred adhesive being of the thermally conducting type which, in a preferred embodiment, is a commercially available silver-impregnated epoxy sold under the trade designation Ablebond 9651-L by Ablestick Corporation. Adhesive 63 is also shown in FIGS. 12 and 13 and can also be used to bond chip 71 in place. Chip 71 is thus thermally coupled to member 61 to assure enhanced heat removal from the final package structure as produced in accordance with the teachings herein. Bond wires 75 (e.g., gold) may now be provided to electrically couple contact sites 77 on the chip's upper surface 78 to corresponding respective ones of the external conductive members 41 which form the upper layer of circuitry for member 13. As seen in FIG. 13, these wires extend from the chip outwardly to this circuitry. The wires 75 are preferably provided using a wirebond process, well known in the art.
If desired, an encapsulant material (not shown) may be provided over the wires and associated pads to provide protection from the occasionally harsh environment to which the product produced by the invention may be exposed. One suitable encapsulant is an epoxy molding material sold by the Dexter-Hysol Company under the trade name Hysol 4450.
FIG. 13 thus illustrates a chip carrier structure which is now capable of being electrically coupled to additional circuit structures (e.g., printed circuit boards) which form part of a larger information handling system (computer) for which the product produced by the invention is particularly suited. One such form of coupling may include solder ball attach in which solder balls (e.g., 90:10 tin:lead) are used to couple respective parts of member 13's circuitry to the circuitry on one/more of such additional circuit structures. Other techniques are of course readily possible for achieving this end.
Thus there has been shown and described a facile method for producing a circuitized substrate for use as part of a chip carrier assembly which is capable of being readily performed using many established processes of the art. The invention thus represents a relatively inexpensive yet effective process for producing chip carrier structures on a mass scale. While the invention has been described with respect to organic dielectric materials, this is not meant to limit the invention in that even inorganic (e.g., ceramic) may be utilized to provide the dielectric function. As stated above, it is also readily possible to utilize alternative procedures (e.g., subtractive circuitization) which are also known in the art, to accomplish the invention.
While there have been shown and described what are at present considered the preferred embodiments of the invention, it will be obvious to those skilled in the art that various changes and modifications may be made therein without departing from the scope of the invention as defined by the appended claims.
|Patente citada
|Fecha de presentaci¾n
|Fecha de publicaci¾n
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|Patente citante
|Fecha de presentaci¾n
|Fecha de publicaci¾n
|13 Ene 2000
|1 May 2001
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|Method of making an enhanced organic chip carrier package
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|Chong-Ren Maa
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|Clasificaci¾n de EE.UU.
|Clasificaci¾n internacional
|Clasificaci¾n cooperativa
|Clasificaci¾n europea
|16 Mar 1998
Owner name: INTERNATIONAL BUSINESS MACHINES CORPORATION, NEW Y
Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:BHATT, ANIL C.;MILLER, THOMAS R.;MORING, ALLEN F.;AND OTHERS;REEL/FRAME:009069/0069;SIGNING DATES FROM 19980313 TO 19980316
|18 Dic 2001
|Certificate of correction
|25 Sep 2003
|Fee payment
Year of fee payment: 4
|10 Mar 2008
|Maintenance fee reminder mailed
|29 Ago 2008
|Lapse for failure to pay maintenance fees
|21 Oct 2008
|Expired due to failure to pay maintenance fee
Effective date: 20080829


text:
Stephane Lafortune
Meet the Faculty Video
Professor, Electrical Engineering and Computer Science
Website: https://wiki.eecs.umich.edu/stephane/
Division: ECE & CSE
Address: 4415 EECS
Phone: (734) 763-0591
Research Interests: System and control theory; Discrete event systems; Application to computer and communication systems
Research Areas: Control Systems; Languages, Compilers, and Runtime Systems.
Areas of Specialty: Discrete Event and Hybrid Systems; Cyber-Physical Systems.
EECS "L" Faculty
|Short List
Stephane Lafortune
Gholamhassan R. Lahiji
LEO Lecturer III
Division: ECE
Address: 3213 EECS
Phone: (734) 763-1156
Research Interests: Solid-state integrated circuits, MEMs and sensors, solid-state devices and technology.
John E. Laird
John L. Tishman Professor of Engineering
Professor, Electrical Engineering and Computer Science
Website: http://ai.eecs.umich.edu/people/laird/index.html
Division: CSE
Address: 3753 Beyster Bldg.
Phone: (734) 647-1761
Research Interests: Artificial Intelligence, Cognitive Architectures, Machine Learning, and Computer Games.
Research Areas: Artificial Intelligence; Robotics in CSE.
Areas of Specialty: Cognitive Architectures & Computational Cognitive Science; Machine Learning; Robotics.
Walter Lasecki
Assistant Professor, Electrical Engineering and Computer Science
Assistant Professor, School of Information
Website: http://web.eecs.umich.edu/~wlasecki/
Division: CSE
Address: 2636 Beyster
Phone: 734-764-4259
Research Interests: Combining human and machine computation to create intelligent systems that can solve problems ranging from accessibility needs for uses with disabilities to rapid analysis of large data sets.
Research Areas: Artificial Intelligence; Human-Computer Interaction.
Areas of Specialty: Assistive Technology; Collaborative and Social Computing; Human Computation and Crowdsourcing; Crowdsourcing and Human Computation.
Michael Laurenzano
Research Fellow, Computer Science & Engineering
Website: http://www.gozano.com/
Division: CSE
Address: 2753 Beyster
Phone: 734-763-6469
Research Interests: Scalable Systems, Architectures and Compilers
Kevin Leach
Research Fellow
Division: CSE
Address: 2909 Beyster
Phone: 734-763-6665
Honglak Lee
Associate Professor, Electrical Engineering and Computer Science
Website: http://www.eecs.umich.edu/~honglak
Division: CSE
Address: 3773 Beyster Bldg.
Phone: (734) 764-3726
Research Interests: Machine Learning, Deep Learning, Artificial Intelligence, Computer Vision
Research Areas: Artificial Intelligence; Signal & Image Processing and Machine Learning; Computer Vision; Databases and Data Mining.
Areas of Specialty: Machine Learning; Statistical Estimation and Learning; Healthcare Computing; Computer Vision.
In Hee Lee
Assistant Research Scientist
Division: ECE
Address: 2431 EECS
Phone: 734-615-2886
Research Interests: Miniature sensing systems; Low-power circuit design for energy harvesters, power management units, and sensor interfaces.
Somin Eunice Lee
Assistant Professor, Electrical Engineering and Computer Science
Assistant Professor (courtesy), Biomedical Engineering
Website: http://bioplasmonics.org
Division: ECE
Address: 2243 EECS
Phone: 734-764-7054
Research Interests: Use of nanoscale-dependent properties to enable unique spatial and temporal capabilities needed for quantification in bioscience and medicine; Areas of expertise include plasmonics, nanophotonics, bionanotechnologies.
Research Areas: Applied Electromagnetics and RF Circuits; Optics and Photonics; Solid-State Devices and Nanotechnology.
Areas of Specialty: Nanophotonics; Biophotonics; Nanotechnology and Nanofabrication.
Tao Li
Associate Research Scientist
Division: ECE
Address: 2408 EECS
Phone: (734) 615-7983
Research Interests: Microsensors; Microactuators; analog and digital interfaces for MEMS devices; Micromachining technologies, such as micro electro-discharge machining (micro-EDM) and micro ultrasonic machining (micro-USM), and their applications
Research Areas: MEMS and Microsystems; Integrated Circuits and VLSI.
Areas of Specialty: Implantable Devices; Environmental Sensors; MEMS Technology and Packaging; Power Sources and Energy Harvesting; Sensing systems.
Yongxi Li
Research Fellow
Division: ECE
Address: 2225 EECS
Phone: (734) 647-5809
Valdis V. Liepa
Research Scientist
Website: http://web.eecs.umich.edu/faculty/liepa/
Division: ECE
Address: 3225 EECS
Phone: (734) 647-1792
Research Interests: Electromagnetic scattering and diffraction, measurements of electromagnetic fields, numerical techniques
John Lipor
Research Fellow
Website: http://web.eecs.umich.edu/~lipor/
Division: ECE
Address: 4303 EECS
Phone: (734) 763-9030
Research Interests: Design and analysis of machine learning and signal processing algorithms, with an emphasis on environmental applications, active learning, and low-rank models.
Research Areas: Signal & Image Processing and Machine Learning.
Mingyan Liu
Meet the Faculty Video
Professor, Electrical Engineering and Computer Science
Website: http://www.eecs.umich.edu/~mingyan
Division: ECE & CSE
Address: 4427 EECS
Phone: (734) 764-9546
Research Interests: Resource allocation, performance analysis, and energy efficient design of wireless, mobile ad hoc, and sensor networks.
Research Areas: Communications; Signal & Image Processing and Machine Learning; Engineering Education Research.
Areas of Specialty: Communication Networks and Multi-Agent Systems; Random Processes; Wireless Communication Systems; Data Science.
Sijia Liu
Research Fellow
Website: http://sliu17.mysite.syr.edu/
Division: ECE
Address: 4234A EECS
Phone: 734-763-5022
Research Interests: Statistical signal processing, convex/nonconvex optimization, machine learning and big data analytics.
Research Areas: Signal & Image Processing and Machine Learning.
Ronald J. Lomax
Professor Emeritus, Electrical Engineering and Computer Science
Website: http://www-personal.engin.umich.edu/~rjl
Division: ECE
Address: 3111 EECS
Phone: (734) 936-2972
Research Interests: Digital circuits and VLSI
Wei Lu
Meet the Faculty Video
Professor, Electrical Engineering and Computer Science
Professor (courtesy), Applied Physics
Director, Lurie Nanofabrication Facility
Website: http://www-personal.umich.edu/~wluee
Division: ECE
Address: 2242 EECS
Phone: (734) 615-2306
Research Interests: Nanoelectronic devices; Non-volatile memory; Reconfigurable circuits and neuromorphic systems; Semiconductor nanowires
Research Areas: Solid-State Devices and Nanotechnology.
Areas of Specialty: Nanotechnology and Nanofabrication; Materials for Solid State Electronic and Optoelectronic Devices.
Jerome P. Lynch
Professor and Chair, Civil and Environmental Engineering
Professor (courtesy), Electrical Engineering and Computer Science
Website: http://www-personal.engin.umich.edu/~jerlynch/index.html
Division: ECE
Address: 2328 GG Brown
Phone: (734) 615-5290
Research Interests: Wireless sensor networks, distributed computing, decentralized control theory, microsensors, microactuators, microelectromechanical systems (MEMS),carbon nanotube composites and sensors
Research Areas: MEMS and Microsystems; Signal & Image Processing and Machine Learning.
Total Listed: 18


text:
Rip Wan Winkle (Default) - Hellsing Ultimate
|GUYS! I TOTALY LOVE RIP VAN WINKLE! She's awesome, I love her costume and really want to cosplay as her. I remember this woman from europe on youtube who collected Sailor Moon items and she cosplayed as Rip Van Winkle, I totaly adore her cosplay of her and Its an ispirtation!
Ok guys her uniform seems pretty straight falward so I may make it otherwise if all else fails i'll end up buying it :( I wish I could do better...Much better!
I will buy a wig, like all my other cosplays who don't have my hair colour and style. Is her hair black or navy, I can't tell. I think its black so I'll get that colour since I'm doing a Sailor Mars cosplay and also an Ai Enma HellGirl cosplay too.
Her personality is awesome, She is very straightfalward I think and Is determind to win against Alucard when they meet. Its sad when -SPOILER- She gets killed, although she probably was bad to begin with...
No comments received.


text:
Avail Cheap Flights to Kabul and Antigua Only at the Website of Flights Masters
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So don't waste a minute and avail the latest offers from the website of the one and only budget travel website Flights Masters. If you are still not convinced about the latest offers and services of the website, the customers of the company have written encouraging and positive reviews about the website, which are posted on the website and other public platforms.
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Tel: 0203 5989 938
Categories: Travel, Personal Travel
Tags: Cheap Flights to Antigua, Cheap Flights to Kabul, flights to Dubai


text:
Pump prices may hit $4 a gallon by early May as U.S. supplies tightened after a series refinery outages reduced gasoline output this week.
The national average rose 2 cents today to about $3.91 for a gallon of regular, according to AAA, Wright Express and Oil Price Information Service. That's 6 cents more than it was a week ago and more than $1 higher than a year ago.
While gas may hit $4 a gallon across the country within a week or two, many analysts believe it will begin to fall, perhaps by Memorial Day, as more gas becomes available.
But you can take steps to stepmeasures to cona
Kroger and Bi-Lo offer fuel rewards programs.
Kroger's fuel program lets customers get discounts on fuel at Kroger and participating Shell stations. For each increment of 100 points redeemed at the pump, shoppers get 10 cents off per gallon on a single fill-up.
When shopping with their Kroger Plus Card, customers can earn points three ways: grocery purchases ($100 in groceries equals 100 points), nonfederally funded prescriptions (two prescriptions equals 100 points) and double gift card points ($50 in gift cards equals 100 points), according to Kroger's Web site.
Through May 7, Kroger is offering a special promotion that allows customers purchasing $100 in qualifying gift cards to receive quadruple fuel points, said community affairs manager Glynn Jenkins.
Gift cards included in the promotion include Macy's, iTunes, T.G.I. Friday's, Spa Finder and Master Card. For instance, a customer that purchases a $100 Macy's gift card will receive 400 fuel points for this purchase.
For details about how Kroger's fuel rewards program works at Shell, visit www.kroger.com. Look under the "In Store" tab at the top and click on "Save on Fuel." Then, click on the name of the closest city on the right.
Bi-Lo customers can earn Fuelperks points by shopping with their Bi-Lo Bonuscard. For every $50 shoppers spend at Bi-Lo, they will save 5 cents per gallon for up to 20 gallons of gasoline. For purchases of $200, shoppers will receive 20 cents off per gallon, up to 20 gallons.
At Bi-Lo, rewards can only be redeemed at participating stations. For a complete list, visit bi-lo.com/fuelperks/redeem.
There are no limits to how many points can be earned at Kroger and Bi-Lo, but customers must redeem their points by a certain date. At Kroger, points earned in a given month are available for use through the end of the next month.
At Bi-Lo, rewards are redeemable for the entire month in which customers earn them, plus an additional three months. For example, if someone earns rewards on Oct. 1, the points are good through Jan. 31.
Earlier this year, Publix offered a coupon for a BP gas card valued at $50, available to customers for only $40, a savings of 20 percent.
The grocery store will continue to offer these periodically throughout the year, said Brenda Reid, media and community relations manager.
Gas stations, such as Shell, have their own cards that allow customers to save. The Shell Drive for Five Card provides a discount at the pump.
Private label cards such as the Shell Saver Card, which acts like a debit card by linking directly to a checking account, lets cardholders save at the pump without incurring fees. Through Saturday, customers can earn 10 cents per gallon on every Shell fuel purchase with the Shell Saver Card. Starting Sunday, they will earn 2 cents per gallon on every fuel purchase at Shell, according to a release.
At Sam's Club fuel stations, members can purchase fuel at 5 to 10 cents per gallon cheaper than other gas stations in a five-mile radius, said Emily Isaacs, membership manager in Augusta. The savings also apply to diesel fuel.
Consumers can also save at the pump with cash-versus-credit retailers, said Jessica Brady, the spokeswoman for AAA Auto Club South.
"What we're seeing more and more of, at least here in Florida ... it's starting to pop up in different markets," she said.
When customers pay cash, the station saves money.
"Anytime you use a credit card to pay for gas, the retailers are charged up to a 7 to 9 percent fee," Brady said.
In some cases, customers with cash can save from 5 to 10 cents per gallon, Brady said.
There are mobile apps to help consumers find the best gas prices. The AAA TripTik Mobile iPhone App provides a list of gas stations by proximity and gives their price for a gallon of gas. The free app can be downloaded at aaa.com/mobile, Brady said. The Android app should be available by mid-May. Other apps include:
- GasBuddy: For Android, iPhone and Windows. Relies on its 5 million users to post gas prices in their area.
- Gas Cubby: iPhone app alerts users of possible problems with a vehicle by analyzing its fuel economy.
- MapQuest: Android and iPhone app helps consumers avoid heavy traffic by giving them the option to see traffic conditions on their planned routes.
- Route4Me: iPhone app specializes in mapping out routes for multiple stops so consumers don't waste gas traveling across town.
- Waze: For select Windows, BlackBerries, Android, iPhone, Nokia. It collects traffic information through its users.
- Poynt: Free app uses phone's GPS and cell site location to know where you are. It directs consumers to the nearest and/or cheapest options to fuel up.