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Knock back time ago to the same extent I was about fifteen being old, my mates (about four or five of them) and I crucial to words on my best mate's mum's ouija board. We took it stuffed to my other friend's cage as her parents were out. We turned the lights out and lit some candles and hence we sat pronounce the symbol.
We asked the inflexible questions and in arrears about 10 account of messing about the planchette started to move. We all disorder someone was pushing it at fundamental, but we so far carried on and let it spell out who it was. It spelled out Marilyn Monroe. Of course we did now daydream someone was moving it and I got more accurately mad as I really hail it to work.
I crucial to ask if it would finish itself to us. In rejoin, it spelled out, accomplish it darker'. So we blew out supreme of the candles and lawful had a hook goodbye. The thing spelt out again, accomplish it darker'. I was triumph a bit irritable now as I had a bad inkling about this. We blew out contemporary candle, but it yet again spelled, accomplish it darker', hence it spelled it out again and again. This thing was moving so fast, we all got angst-ridden to death and congested playing with it.
Curved a week forward-thinking we got view of the ouija board again and this time we had no-ones cage to go to, so we took it down to a policy about to the train keep to as this was the a moment ago place we may well daydream of where we wouldn't be seen.
Now what i'm about to recount you is entirely true, but it sounds so youthful, but i'll recount it how it happened. We started playing with it and immediately it worked and spelled out begin under the board. We all looked at one contemporary and looked under the board, on paper in covet a rose-colored ink was, 'satan was ere'.
I disorder that someone had on paper it and so did all of the others, so we weren't at all distressed by this. Very we carried on playing and hence it spelled out again, begin under the sanction. We turned the board pronounce and that copy wasn't current anymore. We all ran out of current so fast casual the board slow.
I generate never played the board again and in arrears reading all the stories ended the being of citizens who generate in addition had it work for them, I daydream we were distinctive messed pronounce with by something. I've heard that the boards lie all the time and say they're someone that they aren't. I've in addition heard that if you words with them and don't say a prayer before hence you ordinarily generate bad spirits that you're concern with. At the same time as do you daydream, has self in addition had something happen that was covet my one?
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Sent in by Debbie R. Copyright Debbie R 2009 @ Design Mysteries And True Company Tales
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Christie A Turner, 41 years old, lives in Encinitas, California, but has also spent time in Carlsbad, California; San Diego, California and San Marcos, California. Companies in which she has a work history include Lcsw and Licensed Certified Social Worker. Jobs she has held in the past include Social Worker. On the web, Christie goes by the aliases christashi and jturner104.
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AC Repair Richardson
We believe that one of the most important decisions a homeowner in Richardson can make is the selection of their air conditioning for home and heating contractor. Around the Clock A/C & Heat is committed to going above and beyond the call of duty to meet our customers' needs. We offer years of experience servicing all brands of residential air conditioning and heating systems. We provide quality workmanship with professional, dependable and courteous service.
Air Conditioning Service Richardson
Our AC Service Department is available 24 hours a day, 7 days a week to handle those unforeseeable emergencies. Service calls are always scheduled at the convenience of the homeowner. In addition over 250 homeowners enjoy a Spring and Fall tune-up under our preventive air conditioning maintenance programs, which lowers utility bills, decreases the likelihood of breakdowns, and increases the life of the equipment. You can trust ATCAC air conditioning for home & maintenance needs.
Some of the ac service we provide in Richardson Texas are:
-HVAC service on all makes and models
-24 Hour Emergency Service, No Extra Charge
-Quality Preventive Maintenance Programs
-Full System Replacements
-System Additions and Modifications
-Free estimates
Normal Business Hours
8:00 am to 5:00 pm Monday through Friday
Our phones are answered 24 hours every day and technicians are dispatched accordingly
Air Conditioning for Home Rates:
We charge $89.00 to diagnose the problem with your system. That Diagnostic Fee is reduced to $49.00 if repairs are necessary and the customer approves the total price of those repairs prior to any work performed. All AC Repairs are firmly quoted and approved prior to any work being done. ATCAC NEVER ADDS HIDDEN FEES/CHARGES.
Brands Serviced:
We service all makes of residential heating and cooling equipment.
Service Area:
We service most areas of the Dallas/Fort Worth area Metroplex including Richardson, Texas. Please call to confirm your location inside our service area.


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Agriculture Law involves farmers, landowners, and others in regards to crop-growing, farming processes, dairy production, livestock, farmland use, government subsidization of farming, and seasonal and migrant farm workers. There are numerous federal statutes that subsidize, regulate or otherwise directly affect agricultural activity. Some focusing on protecting migrant and seasonal agricultural workers, some for financial assistance to farmers and others for the construction or improvement of farm housing and other agriculturally related purposes.
Ezel (also pronounced as Ecell and Ezell) is an incorporated community in Morgan County, Kentucky, United States. It lies along U.S. Route 460 west of the city of West Liberty, the county seat of Morgan County. Its elevation is 945 feet (288 m). It has a small post office, with the ZIP code 41425.
Agriculture Law Lawyers In Ezel Kentucky


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Browsing self-catering properties within a 5 mile radius of Greenlands Farm Village
A historic former hunting lodge set in stunning Grizedale Forest, close to the visitor centre and 2 miles from the pretty village of Hawkshead with its shops, cafes and pubs.
- Short breaks available.
Welcoming guest house overlooking Fitz Park serving an extensive breakfast using locally sourced products with a Breakfast Award. Home from home, warm and welcoming. Recently refurbished to a high standard.
Near Patterdale and Glenridding, we have 3 self-catering holiday cottages all offering quiet, comfortable accommodation. Elm How, sleeps 8 and Cruck Barn, sleeps 2 are in the Grisedale Valley above Patterdale, near Ullswater.
- Short breaks available.
Detached Georgian house set in well-maintained gardens. Spacious rooms, all have been tastefully refurbished. Four poster beds available. Quietly situated, yet close to the town centre and lake. Real log fires.
- Short breaks available.
Style and comfort come as standard for those who are seeking excellent affordable B&B accommodation. Late arrivals welcome, all we need is a telephone call with estimated arrival time,
A former 17thC coaching inn situated at the foot of Helvellyn in the heart of the Lake District, The Kings Head is surrounded by spectacular scenery with unsurpassed views toward St Johns in the Vale, Blencathra and Skiddaw.
The Beech Hill Hotel is situated on the banks of lake Windermere. We have 57 bedrooms that have been refurbished to a high standard. Our AA rosette-awarded restaurant offers 2 delicious menus of local and seasonal produce.
New Ing Lodge is set on the edge of the Eden Valley, close to the Howgill and the Pennine Hills. Local walks from the door and major tourist attraction and historical site Lowther Castle only minutes from the door.
The Hyning Estate provides Luxurious, High Quality, "Green", Self-Catering Accommodation on the edge of The Lake District and Yorkshire Dales National Parks just minutes from the M6 and Scotland to Euston main line railway station.
- Short breaks available.
Charming 18thC former farmhouse, close to Keswick & Ullswater. Set amid panoramic views of surrounding fells. Individually designed en-suite rooms, guest lounge, free onsite car parking, dogs welcome, cycle storage & free WiFi.
A warm welcome awaits at our small friendly guest house. Comfortable en-suite rooms with a hearty breakfast. A central base for walking or touring. Free parking and WiFi. Discounted mid-week breaks available.
Derwent Apartment is a comfortable spacious ground floor apartment which sleeps up to four, all on one level. An excellent base to explore many different locations in the Lake District and West Coastal resorts.
Centrally located in the heart of the popular market town of Keswick, 18/20 Cellar Bar, Dining & Rooms offers an ideal base from which to explore the spectacular Northern Lakes.
The Royal Oak is a traditional Lakeland hotel ideally situated 6 miles south of Keswick. Once an 18thC farmhouse, and former miners tavern, it is still the perfect base from which to explore the Lake District.
Ambleside Manor Vegetarian Country Guest House situated in over 2 acres of privates with plenty of free parking in the lovely village of Ambleside where we have two award winning vegetarian restaurants within a short walking distance.
- Short breaks available.
Squirrel Bank Cottage has recently been redesigned and refurbished into a lovely ground floor cottage. This self contained cottage is set in a peaceful location but minutes away from the bustling village of Bowness and Lake Windermere.
- Short breaks available.
Lanercost Bed and Breakfast combines luxury with relaxed hospitality, in a beautiful, peaceful and historic setting, 400 yards from Hadrian's Wall, and in the heart of the Lanercost Priory site.
- Short breaks available.
Old farmhouse in peaceful valley close to Ullswater. Walks from the door and route descriptions available. Delicious food, distinctive furniture, stylish bathrooms, use of gardens. Nothing too much trouble. Children welcome.
- Short breaks available.
The Fairfield is a charming late Georgian house set in quiet secluded grounds with its own car park and located in a quiet cul-de-sac close to the centre of Bowness bay. Provides a quiet child free environment to relax.
Beautiful, award-winning Victorian guest house with many original features situated within a few minutes walk of lake Windermere and amenities of Bowness. Lovely garden and private car park. Non smoking. Free wi-fi use.
Offering 4-star quality bed and breakfast in their 17thC farmhouse. Situated close to the beautiful Lakeland village of Caldbeck on the edge of the Lake District National Park. 15 minutes from Keswick, Cockermouth and the city of Carlisle.
Romantic Lakeland Stone cottages with terraced garden. The ideal location for a Lake District holiday, within 7 miles of Penrith. Three bedroom house & studio apartment. Open fire and wifi. Short breaks available.
- Short breaks available.
An original 16thC coaching inn on the outskirts of Grasmere village, The Travellers Rest epitomizes the traditional Lakeland inn.
Located in Windermere village, in the heart of the Lake District.


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Let us know when your receive great advice so we can thank our lawyers and point others with similar questions in the right direction.Got it!
My mom car was damaged by her hitting a bumper of a parked car, the other car that was hit did not sustained any damage, but my moms car did. She reported it to insurance but told a different story, insurance does not want to pay stating her given statement does not match damage to car. If she tells them the truth, will she face any legal problems, nobody got hurt, the other car did not get damaged, she has full coverage insurance, the adjustor told them if she tell the truth they will cover the damages but her insurance premium will go up, my mom knows that, but she is afraid to change her story, will she be in legal problems if she changes story?
An insurance company can properly deny coverage if there is insurance fraud involved. You appear to indicate that your mother did not tell the truth. If so, then she might not face whatever legal problems she thought she might avoid, but the trade off is she does not get insurance coverage.
Frank W. Chen has been licensed to practice law in California since 1988. The information presented here is general in nature and is not intended, nor should be construed, as legal advice for a particular case. This posting does not create any attorney-client relationship with the author. For specific advice about your particular situation, consult with your own attorney.Ask a similar question
Don't answer this: what was the reason your mother didn't tell the truth when asked? Regarding whether the insurance company will pay the claim, what the adjustor told your mother isn't necessarily true. They could use it as a reason to cancel your mother's coverage, if she lied about the car accident. Did she sign something under penalty of perjury regarding the incident?
Insurance fraud comes to mind. So yeah shes kinda put herself into the corner. I don't have any advice for your mother. What a tangled web we weave when we practice to deceive.
The above information does not establish an attorney client relationship nor is it meant to provide legal advice.Ask a similar question
An apt quotation by Mr. Bogan in this case.
Your mom had a parking lot accident, and likely did not tell the other owner what happened because she did not see any damage. The questions are how much is her deductible; and whether its worthwhile to make a claim when she will end up paying more for the repairs in insurance than she would if she just paid for the repairs herself. The insurance company can deny the claim if the claim is false.Ask a similar question
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Foursquare © 2017 Lovingly made in NYC & SF
People tend to check in during these times:
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"Don't bother wear something fancy the club is too dark and when i was there at 12am, no mojito! :("
Crystal Photo
Art Gallery
Jl. Airlangga 8b-9b Gomong
"The best choice to print out your photo is here...."
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Guide to Mataram's best spots
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It is my very great pleasure to be starting off my first EVER blog hop*, organised by the fab team at Stitch Craft Create.
*A blog hop?
For those not in the know, it's where a blogger writes a post with a special theme and then nominates other bloggers to do the same. Those bloggers write their posts, each nominating more bloggers...and so on. Soon, bloggers from all over the world are joining in and sharing stories.
Sounds good, eh? And what I love about this hop is the theme; to share stories about beginner crochet experiences..
Good AND bad. Let's call it Beginner Win, or Beginner Fail.
So let's kick things off....
Let me take you back to early 2011. I had taught myself to crochet a little bit, using books. Mostly, I had made lots and lots of boring stitch samples in horrid yellow acrylic yarn. Why yellow? I have no idea. They were so awful, I didn't even keep them (FAIL).
Anyhoos, being thoroughly bored to pieces over making said horrid yellow samples, I decided to make cute toys for my little boy. It took a few attempts to get the hang of working in circles, counting stitches and all that malarkey, but I did it!!
And I created my own version of the Octonauts TV characters! (WIN)
I had to dig them out of the boy's room and was impressed to see they have survived- a little squished perhaps - Captain Barnacles Bear has evidently lost his jaunty hat, but pretty much in one piece.
But, and this is a big BUT.
Can you see the total crochet FAIL??
I see it every time I look at these little fellas and it makes me cringe!
Got it?
They're all inside out!!!!!
Yes, as a beginner, no book I had ever read told me that there is a right and a wrong side when you're working in the round, so my little creations all ended up inside out.
I don't suppose it really matters and my boy has loved them all the same, but still, it irks me...
I'm glad to say, my amigurumi making has improved somewhat since the early days and still remains one of my favourite projects to crochet. And happily, none of my more recent makes are inside out!
So that's enough from me. If you'd like to enjoy other people's beginner crochet stories, then here's the wonderful bloggers I nominate:
Sarah from Crafts from the Cwtch,
Shelley from Spincushions,
Chrissie from Chrissie's Crafts,
Marianne from MaRRoseCCC,
Heather from Pink Milk,
And Maria from Dinki Dots Craft.
These bloggers will be posting in the next few weeks. To find out when, head over to Stitch Craft Create's Blog where you'll find the complete list of international bloggers who will be taking part.
And if you have a beginner's crochet story you'd like to tell, why not share on Twitter or Instagram, using the hashtag #crochetconfession. We'd all love to read your tales of newbie crocheting!
Don't forget that if you'd like to learn to crochet, I have a written a rather super book called Beginner's Guide to Crochet (bet you didn't see that coming), which tells you, amongst other things, which is the inside and outside of your crochet when toy-making. You won't make the same mistake I did!
And if you need crochet and yarn supplies to get you going, have a look at my curated shop here:
Have a great weekend, and enjoy hopping to all the other blogs...I'll see you there!
P.S. I do hope I'm not the only one with a beginner crochet fail...


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Betsy McCaughey« Previous Entries
Lew and Obama Give Away the StoreWednesday, July 30th, 2014
On Monday Treasury Secretary Jacob Lew urged Congress to provide more resources for the exploding number of people on permanent disability (SSI). It's another example of Washington D.C.'s "give away the store" mentality, encouraging the masses to sign up for government programs at taxpayers' expense.
Even without Congress' complicity, the administration is [...]
ObamaCare: Death by paperworkThursday, July 10th, 2014
On July 3, with Americans preparing to celebrate freedom, the Obama administration reduced freedom by adding 1,296 pages of new regulations to ObamaCare.
It was a classic pre-holiday document dump, publishing the mind-numbing rules in the Federal Register on the eve of Independence Day, when few were likely to be watching. So much for transparency.
ObamaCare regulations [...]
ObamaCore Emerges As a Major Issue As Education Takes An Orwellian TurnWednesday, June 11th, 2014
In the past week, Governors Haley of South Carolina and Fallin of Oklahoma evicted Common Core from public schools, even at the risk of losing hundreds of millions of federal dollars promised to states adopting it. Mmes. Haley and Fallin initially supported Common Core. But public outrage is forcing them to reverse course, and more [...]


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It's really been a ruff time lately. Seem I can't take the potassium. Really did a number on my stomach. My daughter took me to the doctor, using my walker! Had more blood work done, and he took me off the potassium, gave me an RX for my tummy, and with in a couple days its much better.
I can not eat some of the veggies I love because the blood thinner doesn't agree with them. Now, I need a diet high in Potassium, and how to get my vitamins by eating properly. In other words, I need a dietitian.Can't take my one a day vitamins because they contain Vitamin K. My doctor is sending me to a Neurologist.
It's pretty hard not to get depressed. On top of every thing else, I think I am losing my vision!
Monday, February 18, 2013
Hanging in there
Posted by Roadrunner at 5:32 PM
Labels: hanging in
3 comments:
I'm glad to see you're still hanging in there.ReplyDelete
I was getting worried. I do hope things start looking up for you!
If it isn't one thing, it's another. What blood thinner are you on? I take a generic form of plavix and haven't had too much trouble - I can eat all the veggies I love, and also eat a banana every day for the Potassium, which can be dangerous in pill form. I don't think any of us can avoid some vision changes as we age, and it sure is disheartening. I am glad you are hanging in there.ReplyDeleteReplies
I take Warfarin ,generic for Coumadin ,many of the green veggies I love, I can't eat anymore.Delete
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Tributes pour in as famed American comedian passes away of natural causes at his home in Las Vegas.Read More
Friday, 16 June 2017 11:28
Three Palestinians killed by Israeli forces after separate attacks at Damascus Gate near Jerusalem's Old City.
Israeli police have shot dead three Palestinians after two separate attacks on security forces outside the Old City of occupied East Jerusalem, officials said.
The Palestinian health ministry said it had been officially informed that three Palestinians had been killed in Friday's incident in nearby locations close to Damascus Gate.
Israeli police said a female officer in her 20s was critically wounded after the attack and was taken to hospital. At least two bystanders were also reportedly hurt.
Two of the men killed were said to be 18-year-old from al-Bireh, near Ramallah, while the third suspect was a 31-year-old from Hebron.
Pandemonium broke out shortly after Friday's attacks as police pushed hundreds of people out of the Old City to clear the scene.
Tens of thousands of Palestinians from the occupied West Bank were given permits by Israeli authorities to enter occupied East Jerusalem on Friday for Ramadan prayers.
Excessive force
Since October 2015, Palestinian assailants have killed 42 Israelis, two visiting Americans and a British student, mainly in stabbing, shooting and vehicular attacks. In that time, some 250 Palestinians were killed by Israeli fire.
Most of the Palestinians killed were allegedly carrying out knife, gun or car-ramming attacks, Israeli authorities say.
Others were shot dead during protests or clashes, while some were killed in Israeli air strikes on the besieged Gaza Strip.
Israel blames the violence on incitement by Palestinian political and religious leaders.
Palestinians said it stems from anger over decades of Israeli occupation in territory they claim for their state.
Since October 2015, a number of local and international human rights groups have raised concerns that Israeli security forces have used excessive force when confronting Palestinians who had carried out attacks or been suspected of doing so.
The Israeli police relaxed its open-fire regulations in December 2015, permitting officers to open fire with live ammunition on those throwing stones or firebombs as an initial option, without having to use non-lethal weapons first.
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text:
|Publication number
|Publication type
|Application number
|Publication date
|Apr 20, 1999
|Filing date
|Jun 26, 1996
|Priority date
|Jun 26, 1995
|Fee status
|Publication number
|Eugene O. Hempel, Jr.
|Original Assignee
|Texas Instruments Incorporated
|Export Citation
|BiBTeX, EndNote, RefMan
|Patent Citations (9), Referenced by (37), Classifications (13), Legal Events (4)
|External Links: USPTO, USPTO Assignment, Espacenet
This application claims priority under 35 USC �119(c)(1) of provisional application number 60/000,565, filed Jun. 26, 1995.
The present invention relates to a method of and system for processing a semiconductor device and, more particularly, to a method of and apparatus for performing chemical mechanical polish (CMP) processing of a semiconductor device that results in greater device surface uniformity and lesser edge exclusion to yield improved semiconductor device performance characteristics.
Advances in electronic devices generally include reducing the size of the components that form integrated circuits. With smaller circuit components, the value of each unit area of a semiconductor wafer becomes higher. This is because the ability to use all of the wafer area for integrated circuit components improves. To properly form an integrated circuit that employs a much higher percentage of usable wafer area, it is critical that contaminant particle counts on the semiconductor wafer surface be reduced below levels which previously may have been acceptable. For example, minute particles of oxides and metals of less than 0.2 microns are unacceptable for many of the popular advanced circuit designs, because they can short out two or more conducting lines.
In order to planarize a semiconductor wafer and to remove unwanted particles, chemical mechanical polishing or chemical mechanical polish (hereinafter "CMP") process has become popular. CMP systems place a semiconductor wafer in contact with a polishing pad that rotates relative to the semiconductor wafer. The semiconductor wafer may be stationary, or it may also rotate on a carrier that holds the wafer. Problems of conventional methods of performing a chemical mechanical polish is that they produce nonuniform wafers and produce larger than desirable edge exclusion areas. Both of these problems impair operation of resulting electronic components formed from the semiconductor devices. Semiconductor wafer non-uniformity may cause undesirable layers not to be removed at some places and desirable layers to be removed at other places on the wafer surface. This causes various areas on the wafer surface to be unusable for forming semiconductor devices. Process uniformity from wafer to wafer is also important in CMP processing. Known CMP systems, however, suffer from significant wafer-to-wafer non-uniformities. This can also adversely affect the throughput and yield of the CMP process. Edge exclusion occurs when too much of the semiconductor wafer surface is polished at the edge of the wafer. This causes the outer edge of the wafer to be unusable for applications such as semiconductor device fabrication.
Another problem of known methods of and systems for chemical mechanical polishing a semiconductor device is that they have throughput limitations. Wafer polish throughput, like polish uniformity is an important process parameter because it directly affects the number of integrated circuits or other applications for which the fabrication facility may supply components for a given period of time.
Therefore, a need has arisen for an improved method and system for performing a CMP process on a semiconductor device, such as a semiconductor wafer or a compact disc.
There is a need for a CMP method and system that provides greater uniformity in the resulting semiconductor device surface than that provided by existing CMP processing methods and systems.
There is a further need for CMP processing method and system that substantially reduces edge exclusion in semiconductor devices that receive the CMP polishing.
There is yet a further need for CMP method and system with greater throughput than currently exists with known CMP methods and systems.
Still a further need exists for a CMP method and system that extends the useful life of polishing pad conditioners and, thereby, reduces costs associated with processing the semiconductor devices.
In accordance with the present invention, therefore, a method and system for CMP processing of a semiconductor device is provided that substantially eliminates or reduces disadvantages and problems associated with previously developed CMP processing methods and systems.
More specifically, the present invention provides a method for performing a CMP process on a plurality of semiconductor devices. The method includes the steps of placing a plurality of semiconductor devices on a plurality of carrier devices. Each of the plurality of carrier devices are associated to permit approximately simultaneous polishing of the plurality of semiconductor devices. Polishing the plurality of semiconductor devices with a plurality of polishing pad mechanisms is another step of the present method. With the present invention, each of the plurality of semiconductor devices separately associates with one of the plurality of polishing pad mechanisms. The method may also be configured so that the plurality of semiconductor devices and the plurality of polishing pad mechanisms are oriented vertically to cause the faces of each semiconductor device and each polishing pad mechanism to be parallel to the direction of gravitational forces.
Another aspect of the present invention is an apparatus for performing a CMP process on a plurality of semiconductor devices. The apparatus includes a plurality of carrier devices, each for receiving one of the plurality of semiconductor devices. A plurality of polishing pad mechanisms associate with each of the carrier devices so that each of the plurality of polishing pad mechanisms separately and approximately simultaneously polishes one of the plurality of semiconductor devices. Control circuitry controls the movement of each of the plurality of polishing pad mechanisms relative to the associated semiconductor devices so that each semiconductor device is separately polished. To minimize the adverse effects of gravity in the CMP process, the present invention may include a plurality of orienting mechanisms for orienting each of the plurality of carrier devices and each of the plurality of polishing pad mechanisms in the vertical plane.
A technical advantage of the present invention is that it increases the throughput for the CMP portion for semiconductor device processing by permitting numerous semiconductor devices to undergo the CMP process in an approximately simultaneous manner. For example, within the time that a single wafer may be processed using a conventional CMP method, the present invention may process four or more semiconductor devices.
Another technical advantage that the present invention provides is greater semiconductor device uniformity over prior CMP methods and systems. Because each semiconductor device has a separate associated polishing pad mechanism, the present invention provides the ability to specifically control the pressure between the polishing pad and the semiconductor device, the application of slurry, and the CMP processing time. The result is a more controlled CMP process.
Yet another technical advantage of the present invention is that it helps to extend the useful life of CMP polishing pads. The present invention permits the use of a polishing pad mechanism having a smaller polishing pad that is preferably formed to polish a single semiconductor device. As such, there is not the need for a conditioning device to sweep across the polishing pad surface in conditioning the polishing pad. This avoids trenches that develop in conventional polishing pads and that reduce the effective life of the polishing pad. Because the individual polishing pads do not develop these trenches, their useful life is often greater than that of polishing pads used in conventional methods and systems. This could have the effect of making the CMP process more economical and reducing the total costs of semiconductor device fabrication.
Still other technical advantages of the present invention are that the method and system have yield minimal down-times due to equipment failures relative to known multi-stage CMP processing systems and may easily accommodate innovations and improvements in the CMP process. The present invention supports the modular attachment of both carrier devices and polishing pad mechanisms that may be easily connected and disconnected. Therefore, failed polishing mechanisms or carrier devices may be easily replaced with little down-time for ongoing CMP processing. Moreover, as innovations in polishing pad mechanisms and carrier devices arise, the modifications may be incorporated in new pad mechanisms and carrier devices that can replace the corresponding older components that are already in use.
These and other technical advantages will become more apparent with an understanding of the description of illustrative embodiments of the invention that the appended claims cover.
Accordingly, reference is now made to the following description which is to be taken in conjunction with the accompanying drawings in which like reference numerals indicate like features and wherein:
FIG. 1 illustrates one embodiment of the CMP polishing pad and carrier device combination of the present invention;
FIG. 2 shows a top-down view of one embodiment of a system incorporating the concepts of the present invention;
FIG. 3 depicts a top-down view of an alternative embodiment of the present invention; and
FIG. 4 is a side view of the embodiment of FIG. 3.
FIG. 5 is a side view illustrating a chemical-mechanical polishing tool of one embodiment.
FIG. 6 is the carrier device of the instant invention as illustrated in FIG. 5.
Preferred embodiments of the present invention are illustrated in the FIGURES where like numerals refer to like and corresponding parts of the various drawings.
FIG. 1 shows configuration 10 that includes platen 12 and carrier device 14. Platen spindle 16 holds platen 12, which may be heated by an internal heater of many possible forms. Platen 12 holds pad 18 by adhesive force. Carrier device 14 includes carrier ring 20 for holding semiconductor device 22, which may be a semiconductor wafer or other similar device, by vacuum or other force. To maintain a slurry coating on polishing pad 18, slurry source 24 applies a slurry coating to polishing pad 18. In the embodiment of FIG. 1, two independent slurry sources appear to ensure a desired degree of slurry coating for polishing pad 18. Spindle 26 supports carrier device 14 and includes channel 28 for permitting vacuum and air flow to carrier ring 20. This permits a vacuum force to reach semiconductor device 22 that holds semiconductor device 22 to carrier ring 20. Channel 28 also provides a path for air flow to apply a back pressure air supply to the backside of semiconductor device 22.
FIG. 2 shows a top-down view of CMP apparatus 30 of the present embodiment which includes rotating table 32 on which numerous carrier devices 14 attach and rotate to hold semiconductor device 22. Each carrier device 14 is positioned so that it may engage an associated polishing pad mechanism 12. While the embodiment of FIG. 2 shows six carrier device 14 and polishing pad mechanism 12 combinations, other numbers of combinations may work well. This may depend on the size of semiconductor device 22 and the throughput objectives for the CMP process, as well as other process parameters. In operation, a carrier device 14 is positioned to receive a semiconductor device 22 from load station 34. Carrier devices 14 are positioned around the perimeter of rotating table 32 in a position corresponding to the various positions of polishing pad mechanisms 12. Each carrier device 14 may be positioned with an orienting device 38 that causes the face of semiconductor wafer 22 and carrier device 14 to be vertical and perpendicular to the horizontal surface of rotating table 32. Each polishing pad mechanism 12 may include a polishing pad 18 or a final buffing pad 36.
In operation, load station 34 provides to carrier device 14 a semiconductor wafer. Carrier device 14 receives the semiconductor wafer 22 and, by vacuum or other force, holds semiconductor wafer 22 in place. Thereafter, rotating table 32 may rotate clockwise to position carrier device 14 opposite polishing pad mechanism 12. Carrier device 14 rotates about spindle 26 at an optimal speed determined by the desired degree of CMP processing. Polishing pad mechanism 12 may also rotate in a direction opposite the rotation of carrier device 14. As polishing pad 18 and semiconductor device 22 rotate, they come in contact with one another by the positioning of polishing pad mechanism 12 for polishing semiconductor wafer 22.
If a user desires to polish more than one semiconductor wafer 22 at a time, carrier devices 14 may be loaded with a semiconductor device 22. Rotating table 32 may then be rotated so that three carrier devices 14 align with three polishing pad mechanisms 12, each having an associated polishing pad 18 for polishing semiconductor wafer 22. After polishing, the three carrier devices 14 containing the polished semiconductor wafers 22 may be rotated to the corresponding three polishing pad mechanisms 12, each having an attached final buffing pad for finishing the CMP process. Then, after polishing, each individual carrier device 14 may rotate to unload station 40. Unload station 40 receives the polished and buffed semiconductor wafer 22.
CMP polish mechanism improves the planarity of a semiconductor wafer and decreases the undesirable edge exclusion because of the many improvements that the present embodiment provides. One such improvement is the vertical orientation of polishing pad mechanism 12 and carrier device 14. The present device produces improved results because gravitational forces that otherwise would hold particulate matter on the surface of either polishing pad 18 or semiconductor wafer 22 do not exist. If particulate is removed from polishing pad 18 or semiconductor wafer 22, due to gravitational forces the particulate simply falls to the surface of rotating table 32, and not to the polishing pad 18 or semiconductor wafer 22 surface. Another advantage of the present embodiment is that polishing pad 18 is smaller in size that prior polishing pads. This permits more precise control of edge exclusion problems that occur in many semiconductor devices that are processed by CMP.
Polishing pad mechanism 12 may be configured to rotate not only about the axis of spindle 16, but also in a horizontal and vertical direction or, perhaps, in an orbital direction by changing the position of spindle 16. The rotational speed of carrier device 14 and polishing pad mechanism 12 may be varied or fixed, depending on desired results. Also, the rotation of carrier device 14 may be varied in speed. Different pressures may also be applied between polishing pad mechanism 12 and carrier device 14 according to the desired polishing results.
Another technical advantage of the present embodiment is that it provides CMP processing for multiple semiconductor devices without the associated limitations from which known multiple spindle devices suffer. In existing multiple wafer processing, the semiconductor devices undergoing CMP processing contact, usually in a horizontal plane, a single polishing pad. With the present embodiment, however, separate polishing pads 18 associate with each semiconductor device 22 so that process parameters for each semiconductor device 22 may be adjusted and more closely monitored. Thus, the throughput advantages of a multiple spindle apparatus are obtained with the present invention, together with significantly improved process control. The result is greater surface uniformity and be desirable results of less edge exclusion due to non-uniformity.
The loading and unloading operation of the present embodiment is also significantly simpler than that of existing CMP systems because semiconductor device 22 is oriented in a vertical plane. That is, from load station 34, semiconductor device 22 may be selected and initially positioned in the vertical plane. Then, during both the initial wafer polishing by polishing pad 18 and the subsequent final polishing or buffing by buffing pad 36, as well as the final placement of semiconductor device 22 in unload station 40, semiconductor device 22 maintains a vertical orientation. This inherent simplicity also makes the present embodiment economical to use and maintain. Because of the simple operating mechanics that CMP apparatus 30 employs, maintenance and repair of the present system should be minimal and should ultimately help device fabrication costs.
The control of the back pressure to semiconductor device 22 may be controlled within carrier device 14. This will assist in maintaining desired levels of planarity and uniformity across semiconductor device 22 as a result of the CMP process. Moreover, the present embodiment provides the additional advantage of permitting control of gimbling action and physical positioning of carrier devices 14. Also, the present embodiment includes the capability to move rotating table 42 in either a clockwise or counterclockwise direction to select different positions of carrier device 14 and selectively positioning a semiconductor device 22 in contact with a polishing pad 18 or a final buffing pad 36.
After polishing a semiconductor device 22, polishing pad 18 should be conditioned. For this purpose, the conditioning device 42 may be included with the present embodiment. Thus, each spindle 16 for polishing pad mechanism 12 could pivot polishing pad 12 to come in contact with the conditioning surface 44 of conditioning device 42.
The present embodiment of the invention may be operated in a serial or parallel mode by changing control software to operate the system in such a mode. Moreover, system control software and machine control instructions may be included as well as a process control computer to achieve desired system operating characteristics. Although not shown in FIG. 2, the present embodiment includes control circuitry with necessary sensors and switches to determine the position of carrier devices 19 and polishing pad mechanisms 12 relative to one another. Pressure sensors and servo motors are employed to precisely control the movement of the various components of the present embodiment.
The present embodiment of the invention may be used in conjunction with numerous modifications to the CMP process by the inventor hereof and which are assigned to Texas Instruments Incorporated of Dallas, Tex. For example, U.S. Pat. No. 5,597,346, entitled "Method and Apparatus for Holding a Semiconductor Wafer During a Chemical Mechanical Polish (CMP) Process" by G. Hempel describes an improved carrier device and method of using the device. The improvement of this U.S. Patent may be incorporated into carrier device 14 of the present embodiment. Also, U.S. Pat. No. 5,597,443, entitled "Method and System for Chemical Mechanical Polishing of Semiconductor Wafers," also by G. Hempel describes an improved method of removing slurry from a polished semiconductor wafer. During the polishing of semiconductor device 22, this improved method may be applied to remove slurry from semiconductor device 22 in preparation for buffing by final buffing pad 36. In addition, U.S. Pat. No. 5,609,719, entitled "Method and Apparatus for Chemical Mechanical Polish (CMP) of A Wafer," also by G. Hempel, describes an improvement to polishing pad 18 that maintains a more uniform slurry across the polishing pad 18 surface. Polish pad 18 may include the improvement of this application. Consequently, all of the above-referenced U.S. patent applications are herein incorporated by reference.
FIGS. 3 and 4 illustrate an alternative embodiment of the present invention as multi-stage CMP polishing device 60 that has a horizontal orientation. Horizontal multi-stage CMP polishing device 60 includes rotating table 62 on which there are numerous CMP process stations 64, which are here numbered 1 through 8. At the center of rotating table 62 appears base 66 of robot arm 68 that controls the positioning of semiconductor devices 22. Pad conditioning arm 70 is positioned to condition polishing pads at each of the eight stations 64 on rotating table 62. Wafer load station 34 provides semiconductor devices 22 that may be positioned at each station 64. After polishing, robot arm 68 removes the polished semiconductor device 22 from the polish station and places it in unload station 40.
FIG. 4 shows a side view of the configuration of each station 64 of multi-stage CMP polishing device 60. As FIG. 4 indicates, on rotating table 62 appears pad conditioning arm 70 including pad conditioner 72. Pad conditioning arm 70 attaches to rotating table 62 at base 74. Robot arm 68 attaches to rotating table 62 at base 66 and passes between polishing pad mechanism 76 that holds polishing pad 18. Carrier device 78 includes carrier ring 80 and holds semiconductor device 22. The slurry channel 82 of polishing pad mechanism 76 directs slurry to polishing pad 18 so that as polishing pad mechanism 76 lowers polishing pad 18 in contact with semiconductor device 22, a slurry coating exists between polishing pad 18 and semiconductor device 22. After polishing, water spray mechanism 84 may apply either deionized water or a combination of deionized water and a pH controlling substance, such as ammonium hydroxide, to the surface of semiconductor device 22. To maintain semiconductor device 22 in position, carrier device 78 may apply vacuum by way of vacuum line 86. To remove water from the surface of carrier ring 80, water lines 88 attach to carrier ring 80.
With the alternative embodiment of multi-stage CMP processing apparatus 60, semiconductor device 22 is horizontal, but has a separate polishing pad 18 for embodying the many advantages associated with the method and system of FIGS. 1 and 2.
While semiconductor device 22 is positioned on carrier device 14 and in contact with pad 18, both a downward force and back pressure may be applied. The downward force places semiconductor device 22 in contact with pad 18 for polishing. FIGS. 5 and 6 show views of carrier device 14 to indicate the effect and source of back pressure air flow. Back pressure air flow, as FIG. 5 shows, causes a slight extension of the center of semiconductor device 22. This promotes more uniform polishing of semiconductor device 22. FIG. 6 shows that apertures 92 in face 94 of carrier device 14 form a showerhead array that uniformly applies air flow to the semiconductor device 22 backside.
In operation, semiconductor device 22 is removed from load cassette 34 through the use of robot arm 68 and placed on any station 64 that the user may desire to receive semiconductor device 22. This permits multi-stage CMP apparatus 60 to polish and buff different semiconductor devices 22 for different processing times on each station 64. The alternative multi-stage CMP processing system 60, therefore, provides the ability to rotate carrier device 78 at different speeds. In addition, different back pressures may be applied on semiconductor device 22 to increase planarity and minimize non-uniformity of semiconductor device 22. As mentioned in conduction with the apparatus of FIGS. 1 and 2, polishing pad mechanism 76 may be moved in an "X" and "Y" direction, as it rotates, or in an orbital direction as it rotates to prevent uneven wearing of polishing pad 18. Dispensing slurry through polishing pad 18, eliminates hot spots at the center of semiconductor device 22. This further improves the ability for increased planarity and eliminating non-uniformity of semiconductor device 22. Again, the above-stated improvements in the related U.S. patent applications by the inventor hereof may be used with multi-stage CMP apparatus 60 of FIGS. 3 and 4. Conditioning arm 70 of FIGS. 3 and 4 may be configured to condition polishing pad 18 either before or after polishing pad 18 polishes semiconductor device 22. The timing of conditioning may vary, for example, according to the desired characteristics of the resulting semiconductor device 22.
As can be seen from the CMP processing apparatus of FIGS. 1 through 4, improvements that the present embodiments provide include greater CMP process uniformity for the semiconductor device 22 surface, as well as greater wafer-to-wafer process uniformity, greater throughput for performing the CMP processing of semiconductor devices 22, and greater control of the CMP process for each individual semiconductor device 22 with a multi-spindle CMP system. Another enhanced feature of the present method and system is that each carrier device 14 and 78, as well as each polishing pad mechanism 12 and 76, may be formed as a modular unit. As a modular unit, each polishing pad mechanism or carrier device may be machined as a device that may be "snapped in" or quickly disconnected in the event of a problem with the rotating mechanism or other mechanical aspects. By simply replacing a defective polishing pad mechanism or carrier device, downtime in the event of equipment malfunction is minimal.
A semiconductor device 22 on which the present embodiment may perform a CMP process could be a semiconductor wafer, a compact disc, or other semiconductor device for which a CMP process provides the desired particulate removal and planarity adjustments to improvement component performance. Although the present embodiment may usually accommodate six-inch and eight-inch wafers, wafers with diameters of up to twelve inches and beyond may be processed with an appropriate-sized embodiment of the present invention. In addition, other modifications of the embodiments of FIGS. 1 through 4 may be derived according to the specific processing requirements of the semiconductor device 22.
Although the invention has been described in detail herein with reference to the illustrative embodiments, it is to be understood that this description is by way of example only and is not to be construed in a limiting sense. It is to be further understood, therefore, that numerous changes in the details of the embodiments of the invention and additional embodiments of the invention, will be apparent to, and may be made by, persons of ordinary skill in the art having reference to this description. It is contemplated that all such changes and additional embodiments are within the spirit and true scope of the invention as claimed below.
|Cited Patent
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|Shin-Etsu Handotai Co., Ltd.
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|Nov 20, 1995
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|Method and apparatus for measuring a change in the thickness of polishing pads used in chemical-mechanical planarization of semiconductor wafers
|Apr 12, 1994
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|Fujikoshi Kakai Kogyo Kabushiki Kaisha
|Polishing machine and a method of polishing a work
|Nov 29, 1995
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|Polishing apparatus
|Oct 27, 1995
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|Citing Patent
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|Apr 24, 1997
|Nov 14, 2000
|Hitachi, Ltd.
|Method of manufacturing semiconductor integrated circuit device
|Feb 2, 1999
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|Applied Materials, Inc.
|End effector for pad conditioning
|Dec 2, 1998
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|Nec Corporation
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|Feb 15, 2000
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|Lam Research Corporation
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|Mar 31, 2000
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|Micron Technology, Inc.
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|Aug 9, 2001
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|Micron Technology, Inc.
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|Micron Technology, Inc.
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|Applied Materials, Inc.
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|Aug 9, 2001
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|Micron Technology, Inc.
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|Apr 10, 2002
|Dec 16, 2003
|Micron Technology, Inc.
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|Jan 4, 2001
|Mar 16, 2004
|Lam Research Corporation
|System and method for polishing and planarizing semiconductor wafers using reduced surface area polishing pads and variable partial pad-wafer overlapping techniques
|Dec 18, 2001
|May 4, 2004
|Lam Research Corporation
|System and method for controlled polishing and planarization of semiconductor wafers
|Jun 25, 2001
|May 4, 2004
|Vanguard International Semiconductor Corporation
|Coaxial dressing for chemical mechanical polishing
|Nov 21, 2001
|Aug 24, 2004
|Michael S. Kennedy
|Method and apparatus for reconditioning compact discs
|May 7, 2001
|Nov 16, 2004
|Applied Materials, Inc.
|Method and apparatus for treating a substrate
|Feb 3, 2004
|Mar 22, 2005
|Lam Research Corporation
|System and method for polishing and planarizing semiconductor wafers using reduced surface area polishing pads and variable partial pad-wafer overlapping techniques
|Aug 9, 2001
|Feb 21, 2006
|Micron Technology, Inc.
|Method and apparatus for releasably attaching a polishing pad to a chemical-mechanical planarization machine
|Jul 13, 2004
|Sep 12, 2006
|Kennedy Michael S
|Method and apparatus for reconditioning compact discs
|Oct 13, 2004
|Jul 3, 2007
|Applied Materials, Inc.
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|Jan 10, 2006
|Aug 14, 2007
|Applied Materials, Inc.
|Chemical mechanical polishing system having multiple polishing stations and providing relative linear polishing motion
|Jun 7, 2007
|Nov 10, 2009
|Applied Materials, Inc.
|Chemical mechanical polishing system having multiple polishing stations and providing relative linear polishing motion
|Dec 26, 2007
|Aug 23, 2011
|Texas Instruments Incorporated
|Chemical mechanical polishing pad having improved groove pattern
|Oct 16, 2009
|Dec 20, 2011
|Applied Materials, Inc.
|Chemical mechanical polishing system having multiple polishing stations and providing relative linear polishing motion
|May 7, 2001
|Dec 27, 2001
|Applied Materials, Inc.
|Method and apparatus for treating a substrate
|Aug 9, 2001
|Apr 18, 2002
|Doan Trung Tri
|Method and apparatus for releasably attaching a polishing pad to a chemical-mechanical planarization machine
|Feb 3, 2004
|Aug 26, 2004
|Lam Research Corporation.
|System and method for polishing and planarizing semiconductor wafers using reduced surface area polishing pads and variable partial pad-wafer overlapping techniques
|Oct 13, 2004
|Mar 3, 2005
|Applied Materials, Inc., A Delaware Corporation
|Chemical mechanical polishing system having multiple polishing stations and providing relative linear polishing motion
|Jun 7, 2007
|Oct 11, 2007
|Applied Materials, Inc.
|Chemical mechanical polishing system having multiple polishing stations and providing relative linear polishing motion
|Mar 12, 2007
|Jun 26, 2008
|Texas Instruments Inc.
|CMP related scratch and defect improvement
|Oct 16, 2009
|Feb 11, 2010
|Applied Materials, Inc.
|Chemical mechanical polishing system having multiple polishing stations and providing relative linear polishing motion
|Sep 18, 2014
|Feb 18, 2015
|Spigot piece chamfering machine
|Sep 18, 2014
|Jun 16, 2017
|Jan 12, 2001
|Aug 2, 2001
|Lam Research Corporation
|System and method for controlled polishing and planarization of semiconductor wafers
|U.S. Classification
|438/692, 216/89, 451/287, 451/41
|International Classification
|Cooperative Classification
|European Classification
|Jun 26, 1996
Owner name: TEXAS INSTRUMENTS INCORPORATED, TEXAS
Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:HEMPEL, EUGENE O. JR.;REEL/FRAME:008087/0507
Effective date: 19950615
|Sep 24, 2002
|Fee payment
Year of fee payment: 4
|Sep 26, 2006
|Fee payment
Year of fee payment: 8
|Sep 22, 2010
|Fee payment
Year of fee payment: 12


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{hysterical, Optimal, Dare, Roof, Telephone, Unite, Female, Bent, Deeply, Train, Hapless, Wave}
Opti (Short story)
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When dad came back he told my new mom that we were going to get a visitor. This visitor is arriving on a train after dinner. Mom smiled and seemed pleased. While mom was getting me wet and putting stinky stuff on me washing away all the good smells, she told me I would be nice and clean for our new visitor.
After she was done dad took me in the backyard. I sniffed around to see if there was any pee-mail. I wondered if they had a dog before me. I did not find any pee-mail, which explains why they do not know much about dogs, otherwise they would never have put me in that water.
I noticed something while we were outside. Looking up I stared at this high place. Mom came out and asked dad what I was looking at. He answered and said "The roof. I think she is thinking about a better escape plan for the next bath time." He was right.


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Replica Cessna 180-The St-Just Cyclone
By Willie Bodenstein
The Cessna 180 that had its first flight on 26 May 1952 was developed as a four- or six-seat general aviation airplane and was produced between 1953 and 1981. It gained recognition as the aircraft chosen by Geraldine Mock, the first woman pilot to successfully fly around the world. The flight was made in 1964 in her 1953 model, the Spirit of Columbus.
The strut-braced high-wing Cyclone incorporated modifications and improvements, such as an extended wing span, greater wing area and vertically hinged doors. It features a four seat enclosed cabin accessed via doors, fixed conventional landing gear and a single 230 hp (172 kW) Continental O-470 engine in conventional tractor configuration.
The Cyclone is constructed using aircraft grade sheet aluminium, with the kit airframe parts preformed with pilot holes to allow construction without the use of jigs. Its 38.00 ft (11.6 m) span wing employs a NACA 2412 aerofoil, mounts flaps and has a wing area of 181.00 sq ft (16.815 m2).
In December 2013, 23 examples were registered in Canada with Transport Canada and three in the United States with the Federal Aviation Administration.
General characteristics
Crew: one
Capacity: three passengers
Length: 26 ft 0 in (7.92 m)
Wingspan: 38 ft 0 in (11.58 m)
Wing area: 181.00 sq ft (16.815 m2)
Empty weight: 1,700 lb (771 kg)
Gross weight: 3,000 lb (1,361 kg)
Powerplant: 1 × Continental O-470 six cylinder, air-cooled, four stroke aircraft engine, 230 hp (170 kW)
Propellers: 2-bladed constant speed propeller
Maximum speed: 170 mph (274 km/h; 148 kn)
Cruise speed: 158 mph (137 kn; 254 km/h)
Stall speed: 37 mph (32 kn; 60 km/h) flaps down
Range: 870 mi (756 nmi; 1,400 km)
Service ceiling: 18,000 ft (5,486 m)
Rate of climb: 1,300 ft/min (6.6 m/s)
Wing loading: 16.6 lb/sq ft (81 kg/m2)
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Copyright © 2017 Pilot's Post PTY Ltd The information, views and opinions by the authors contributing to Pilot's Post are not necessarily those of the editor or other writers at Pilot's Post.


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Operator Corner: EMEA - 22/09/09
Vodafone has received Qatar's second landline telecom license. The service would start in 2009.
Vodafone Spain is claiming €670m from Telefonica for abusing its market position in Spain between 1995 and 1999.
FT has revamped its strategy and now plans to focus on new, emerging markets, but also said it is giving up plan to invest in Algeria.
ONO (Spain) plans to launch an ultra-high speed service (speeds of 50-100 Mbits/s) by October 15.
Bouygues Telecom will launch its triple-play ADSL services on October 20.
Telecom Italia denies a report saying it is considering the spin-off of its access network. A revised business plan will be unveiled by year end, but added that it has insufficient cash flow for NGN investment.
T-Mobile is testing LTE technology with Nortel.
Orange forecasts that 20% of its total sales would come from data services, as data traffic is doubling annually. It is launching GSM network in Kenya, via Telkom Kenya. ONE (Austria) owned by FT and Mis Europa Partners, has adopted the Orange brand from September 22.
Kuwait Telecom unveils its new brand VIVA.
Telkom S. Africa confirmed talks with investor group have broken, but that it will continue talks with Vodafone over Vodacom unit.
Mena Telecom (Bahrain) is ti launch WiMAX services in the country.
MTS (Russia) is the first operator to offer 3G coverage in Siberia and the Russian Far East.


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The Bellville Baker King, Butchers and Blacksmith
A baker builds a castle to be his home in a small town in Texas, bringing life and tourism to the city. We were the guests of the Bellville Tourism […]
For more than 40 years, I have written about food, wine and travel. I currently the travel correspondent for H Texas magazine, www.htexas.com, the lifestyle magazine for the city of Houston, and the travel correspondent OutSmart magazine, www.outsmartmagazine.com, the state-wide LGBT magazine based in Houston.
IFWTWA Members Only
Contact information is for IFWTWA members only, please log in to view private contact information.
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Hampshire Tourist Guide
Your search returned 6 results
Hilton Southampton hotel
Tel: 023-8070 2700
Avoid the last minute rush to the Docks! Stay the night before your P&O cruise at Hilton Southampton and enjoy up to 14 days car parking from as little as �179 per ...
The White Star Tavern
Tel: 023 8082 1990
Set lunch menu Monday - Friday, 2 courses �12, 3 courses �15
Cantina Mexican Restaurant & Bar
Tel: 023 8022 0500
Lunch Menu - �6 including a soft drink Sunday Latin Fiesta - every week from 7.30pm
Holiday Inn Express Southampton M27 Jct7
Tel: 02380 606060
Why not stay the night before your cruise at the Holiday Inn Express Southampton M27 Jct7 and enjoy up to 15 days car parking from as little as �103 B&B per room.
Mercure Southampton Centre Dolphin Hotel
Tel: 023 8038 6460
Park & Cruise Packages available at the Dolphin Hotel. From �139.00 for 2 people which includes: � 1 nights accommodation in an en suite bedroom � Full English ...
Exbury Gardens and Steam Railway
Tel: 023 8089 1203
All paying visitors up to and including 10 June 2007 will receive a FREE TICKET to come back and see the spectacular autumn colours in Oct / Nov 2007.
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Research & Commentary
Firms Drag Heels on MiFID II Research Rulebook Rewrite
MiFID II's ban on broker-subsidized free research will leave sell-side firms with a multitude of challenges—not least how to price research so as not to lose customers who might direct trading elsewhere, without appearing to incentivize clients to trade…
Thomson Reuters Upgrades Eikon Research Management Capabilities Ahead of MiFID II
The enhancements will help Eikon users deal with the research requirements of the upcoming MiFID II regulation.
August 2017: Another Example of Our Industry Growing Up
The unbundling of research will present new challenges for the industry, but on balance, it should be good.
Sentieo Debuts Research Management System to Manage Data, Notes in Desktop
The RMS will help analysts manage and share data relevant to their watchlists from across Sentieo's platform, and their own content sources, as well as proprietary notes.
Worldflow Unveils US Independent Research Directory
The portal will allow buy-side firms to search for research providers by a range of factors.
IHS Markit Launches Service for Mifid II Research Payments
RPA Manager will help in administrating research payment accounts, which have been created in response to European rules.
Reconciliations: The Road to End-to-End Automation
The Road to End-to-End Automation
Red Deer, Westminster Ally for MiFID II Research Solution
The end-to-end solution will remove potential conflicts in research valuation and payment.
RSRCHXchange, CorpAxe Partner for Consumption Data
RSRCHXchange is to make research consumption data available through the CorpAxe platform to help consumer firms comply with the research components of the upcoming MiFID II regulation
RSRCHXchange Introduces Desktop Application via OpenFin
The new application is available to all RSRCHXchange clients, and it will connect to the firm's existing platform.
Thomson Reuters Adds S&P Transcripts Content
The agreement will provide Thomson Reuters' clients with access to tagged and machine-readable corporate events transcripts data from S&P.
Visible Alpha Hires Research, Data Vets McNerney, Stemberger
In addition to McNerney and Stemberger, Visible Alpha hired 51 new staff in teh first quarter of 2017 -- a headcount increase of almost 30 percent.
Nybo to Lead Burton-Taylor Exchange Research
Research vet Nybo will lead and expand TP Icap-owned Burton-Taylor's exchange and trading venue research division.
State Street Readies Machine Learning-Based Research Management Tool
State Street's data and analytics arm is setting its sights on machine learning and robotic process automation to help firms deal with data management challenges, starting with the consumption and sharing of research, reports Joanne Faulkner.
Euclid Buys Into RSRCHXchange
The investment will help the research platform vendor expand its operations globally, officials say.
Visible Alpha Launches Live Research Platform
The platform captures and normalizes the data behind analysts' research models, giving investors the ability to compare underlying assumptions.
FactSet Integrates Narrative Science NLG Portfolio Commentary
Integrating Narrative Science's tools will enable FactSet clients to automate commentary generation and client reporting functions.
Tullett Prebon Info to Carry Equity and Credit Research, Analytics from Valens
TPI adds corporate performance data to offering with Valens Research partnership.
TP Icap Buys Burton-Taylor to Expand Research Assets
TP Icap will expand the research firm's coverage to new markets and sectors, partly based on proprietary data owned by the broker.
Visible Alpha Buys OneAccess to Boost Research Use Tracking
Prior to the acquisition, the companies had been working together to allow clients to benefit from their respective offerings.
Open Platform: The Implications of MiFID II's Research Unbundling Requirements
The Smart Cube's David Landi offers insight into the impact of upcoming regulatory changes on the provision of (and payment for) broker research.
SocGen Taps Smartkarma to Meet MiFID 2 Unbundling Regs
The bank believes that by outsourcing the provision of research content, it can meet the unbundling requirements of MiFID 2.
Virtua IR Clients Get Wall Street Horizon Events Data
Clients of Virtua's analytics platform will have acces to a limited set of Wall Street Horizon's events data, with the option to subscribe to its full dataset.
The Infancy of Julia: An Inside Look at How Traders and Economists Are Using the Julia Programming Language
Several banks, vendors and a regulator discuss how they are using the Julia programming language to improve their big data analytics capabilities.


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The European Schools were created in 1953 to facilitate the mobility of European civil servants. The schools offer an education to children during their time abroad, which enables them to continue their studies in their home country or in another European country. For this reason such schools can normally be found close to European institutions. The European School The Hague was primarily founded for the children whose parents work at the European institutions and agencies in The Hague: Eurojust, Europol, the European Patent Office and ESA-ESTEC in Noordwijk.
The European schools offer a broad multilingual education. There is a great deal of emphasis on the children's own language and culture, in combination with knowledge of and respect for the languages and cultures of other European countries. The education programme at the European School the Hague is based on the curriculum of the European schools. In addition, pupils must also meet the core objectives laid down by the Dutch government as this European School is also a Dutch school. This way, the children meet the best of both worlds!
All non-Dutch pupils will take compulsory Dutch lessons, in order to facilitate the contact with the environment in which they live. During the first schoolyears, the pupils are made familiar with some Dutch basic concepts. From the third class of the primary school onwards, Dutch is taught as a third (second foreign) language. These lessons are compulsory for all non-Dutch speaking pupils, up to the first class of the secondary school. During these Dutch lessons other activities will be offered to the Dutch-speaking pupils.


text: Pages in category "Blog posts" The following 7 pages are in this category, out of 7 total. I User blog:ICarlyFan&Always/Maxed out marathon!T User blog:Tavante/KISS User blog:ThatSparkle/Excitement T cont. User blog:ThatSparkle/Laziness User blog:ThatSparkle/Main Page Poll User blog:ThatSparkle/Rags wiki T cont. User blog:ThatSparkle/The Movie Retrieved from "http://nickelodeonragsmovie.wikia.com/wiki/Category:Blog_posts?oldid=3829" Ad blocker interference detected! Wikia is a free-to-use site that makes money from advertising. We have a modified experience for viewers using ad blockers Wikia is not accessible if you've made further modifications. Remove the custom ad blocker rule(s) and the page will load as expected. Categories: Community


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Registered programs
Motivated by a group environment? Ready to take your fitness to the next level?
Our registered programs are designed to give you more guidance and support in a group environment. Instructed by personal trainers and/or healthcare professionals, these programs will give you measurable results and increase your fitness knowledge.
With each season you'll find a variety of programs designed to meet your goals and interest. When you need an extra push, we're here to help! To register, please call Member Services 604 895 5777.
This program consists of three 30 minute segments of cardio training, muscle/core conditioning, and yoga stretches. Cardio training will include hi low, drills and step while muscle conditioning will utlize the concept of metabolic training - maximum fat burning in minimal time! Finish off with deep yoga stretches and fascial release. Modifications for exercises are provided to accommodate all fitness levels.
Saturdays, 10:30 - 12 pm, Studio 1
Jun 10 - Jul 15 (5 classes, no class Jul 1)
Member $100 / Non-member $130
Instructor: Alesya Bogaevskaya
Start your day with a great full-body workout combining strength, cardio and flexibility. Enjoy a small group atmosphere and have fun exploring a variety of exercises using equipment such as TRX's, Kettlebells, Bosu balls and much more! Each week you will be given 3 new recipes (breakfast, lunch & dinner) to help fuel and nourish your body along with a weekly challenge to inspire and motivate you to a healthier lifestyle.
Wednesdays, 6:45 - 7:45 am, Studio 1
Aug 9 - Sep 20 (7 classes)
Member $140 / Non-member $182
Instructor: Regan Courtney
Things are about to get intense! With the use of heart rate monitors, you can challenge yourself to push harder and then ease up for recovery. You'll torch the calories and get stronger by playing with kettle bells, battle ropes, weighted balls and so much more! Classes are adaptable to all levels of fitness and great for those looking to change up their routine, increase performance, or change body composition. Come experience the benefits of personal training with the affordability of group classes.
Fridays, 6:15 - 7:15 pm, Studio 1
May 5 - Jun 16 (6 classes, no class Jun 19)
Instructor: Allister Roop
Member $120 / Non-member $156 | Drop-in $30
This program is designed for women who want to build confidence in using the machines, free weights, and cable systems to properly lift weights and build strength. Each week you will be guided through a full body workout, and provided with an Ebook to follow along with training in between sessions. The focus of the class will be on form, technique, and preparing you to create a program based on your goals.
Thursdays, 12:00 - 1:00 pm, Women's Only Aera
May 25 - Jun 29 (6 classes)
Member $156 / Non-member $192
Instructor: Katherine Taylor
Join us for a 3 hour workshop fostering connection and community - a break from the stressful adult life. Come and explore, play, colour and move in a kid's class for adults, then rejuvenate in a restful and relaxing Yin/Restorative yoga session. This workshop is suitable for everyone. Space is limited to 12 - don't miss out!
Saturday, June 24, 1:30 - 4:30, Studio 2
Member $30 / Non-member $36
Instructor: Rebecca & Nadine
This is a 6-week comprehensive program incorporating 6 consecutive Mondays and Thursdays as described below. It is the best way to monitor improvements and track results, under the watchful supervision of Code 5 staff. In our opinion, the most improvement and gains come from a steady program which holds you accountable to consistent training, a solid work ethic, and positive attitude. At Code 5, we pride ourselves on creating excellent candidates. This program will be your best bet for success!
Mondays, 7:00 – 9:00 pm (POPAT/PARE) &
Thursdays, 7:45 - 8:45 pm (Met-Con Class)
Jun 5 - Jul 13 (12 classes)
Program fee: $300
*Pre-registration is mandatory. Pro-rated price for missed first week classes only. No credit reserved for missed classes
The benchmark for POPAT/PARE fitness preparation is stronger than ever! This class was the reason Code 5 Fitness started, and it has been a satisfying journey to see so many grads succeed in reaching their goals, and go from "client" to "Constable"! If you need help training for and passing a police fitness test, look no further. Often imitated, never duplicated, the Code 5 Fitness Police Training Program is an industry standard.
Mondays, 7:00 – 9:00 pm (POPAT/PARE)
$35 drop-in
This metabolic conditioning class may incorporate elements of the POPAT/ PARE obstacle course, and/or Firefighter Combat Challenge/ CPAT, combined with other equipment/bodyweight exercises, to deliver a sweat-inducing workout that will test the strength of not only your body, but also your mind and spirit. All levels of fitness are welcome, as the exercises are scalable to individual needs. Functional, tactical, and fun, each week is a different circuit especially suited for candidates in the police, fire, military, or paramedic careers.
Thursdays, 7:45 - 8:45 pm (Met-Con Class)
$25 drop-in


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Do You The Scorpion In Your Relationship Learn World Wide Web
Like we can't find peculiar ways to achieve this, adaptation forms of psychoanalysis await group of us bold stacks to check such inner half-light. Scorpio discovers that it can see correctly well in the dark, and consequently can learn very much about itself like down deeper now its shadowy underworld.Sixth sense Sexy? The Formation subsequently warned Scorpio that its brand propel would be a determined but terminally important one, and that this sign may at become old feel cursed by group fantastically powerful energies it seems to love the record. Sexual energy is one such polluted blessing. Taurus actually got the sex thing leave-taking a like back and found it a severe hallucination. (AP-parental the Bull doesn't guess dual about a inattentive incline in the hay. If it feels good, do it-and as a consequence conceivably make a sandwich and problem a nap later.) Sex tends to be supplementary of a value rite for body-loving Taurus, who feels something precious could come out this natural, brassy discrimination. It's at smallest number of cool. Yet, bits and pieces get supplementary elaborate for Scorpio, who knows it'll use sexual invasion to get at something excessively in substitute insect, to possibly interrupt some imaginary gut reaction. Sex consequently is recycled to vex, as well as make somebody's day, a junior. Sex in the same way helps the Scorpion obvious its own indecipherable intensities, dispense this sign come in the flesh in rejuvenating ways.
Pond erotic satisfaction is record of the time the extreme matter on Scorpio's mind-it as an adaptation seeks a complete commotion of the motivation, I imagine turned on by a powerful orgasmic do, as Climb St. Pluto blows its lid! It's odd which the zodiac's "sexiest blotch in the flesh" is plus one which can only remaining from proximity hang-ups. Scorpio is far supplementary ungainly about sex compared to everyday may realize (it's a very lost in thought sign and one weighed down by a pedant streak-something it "borrowed" from Virgo subsequently it wasn't looking). The Scorpion concerns idiosyncratic browbeaten for its sensuous appetites, yet it in the same way dreads idiosyncratic unpopular or in the same way underrated as a sex object-"Whatsoever, you don't come spanning me very?" And it's a lot supplementary performance-sensitive compared to it cares to accept. It's in the same way quick-witted to accurately problem it easy subsequently you're performance so importantly of a psychic solicit, over and over again hurriedly up various common unremarkable ambiance.
Scorpio commonly processes too a lot of incompatible energies at subsequently, and as a cause has a hard time losing itself even in the time of lovemaking sell your soul.Thrashing Expect Scorpio is the sign of failure and uninterrupted stoppage. Not one of the older 7 indicators ever thought importantly about dying dairy farm Scorpio wearing sad (actually, Leo afraid a long time ago going on for correctly maybe blowing its traces and "dying" on stage-but it in no way contemplated subconscious failure, the closing extinguishing of waking consciousness). In Scorpio, we become sane which, as testing beings, our practice moment is ticking banned. All us is allotted hardly copious ticks dairy farm our sequential lodge is over. Scorpio has completed peacefulness with performance so, not quite without a doubt completely the same as it to cut a long story short motivation that a different largest part of consciousness awaits us subsequently our dependent type dies.
Scorpio knows that visit unnoticeable ranges of kindness situate, completely completely the same as it traffics in them dissertation. As Scorpio may have a go the death run (it's even a healing "cat with nine lives" who exhibits the unexplained recuperative power), at some relate to it preference compel to opportunely flinch such gleam and disinclination, and allow for performance so closing transition.Meanwhile, the Scorpion realizes that it be in possession of to incident correctly a few various "deaths" in performance so duration. Not all of its fixations offhand out to be serious obsessions. Far-off residence half-light be in possession of to be dispelled for nation Scorpios kinds who grasp to run into life's slings and arrows by vengefully retaliating.
Poisonous bitterness, far-reaching from ordinary, enraged resentments, condition die. The compromise to next to others who be in possession of violently distressed Scorpio requirements to die. And the deadly throw out of green viciousness in the same way do be snuffed out for good. Any character seeking deeper self-understanding would would be attracted to for the deaths of these compact psychological complexes.Really, performance so sign has slight alternative: Redeem all of which half-light or rally in loneliness. Scorpio can very easily turn in the same way its refusal energies within, tingly itself once again and subsequently once again, whenever it feels in the end incapable to control items in the outside world. Take action so self-defeating opinion be in possession of to in the same way be killed off if the Scorpion is to psychologically only remaining its trials in practice and turn out to be accurately empowered in all the basic ways.
Allow to Lifestyle Scorpio is pressured to revive by itself express group difficult occasions so it has violently bottomed out (devastated Scorpio types can feel unfairly low about on their own in self-punishing ways). No other sign, overly conceivably for Pisces, can just about such low point residence short of distress and doubt. Unexceptionally, no other blotch learns to escalate as very much from group mortal, tender says. Anyhow'this is not wherever Scorpio is believed to survive wedged for all time. It's hard-wired to bound be attracted to an eagle, subsequently it brightly gives itself back to practice (be watchful which Scorpio's stinger, pointing increasing, resembles Sagittarius' arrow-implying that the innate power in that stinger be in possession of to be transmuted and held in the improve help acceptably back it can get a prerogative supply of signal).
Unevenly the Author:
Do You The Scorpio In Your World? Examine Online - Distress Out scorpio zodiac and scorpio zodiac sign
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