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We are told in the Qur'an that the messengers of Allah and others who, like them, called on people to abide by religious moral values, were slandered and accused of such things as self-interest, madness, arrogance and magic. However, devout Muslims have always exhibited exemplary patience and submission in the face of the slanders to which they have been subjected, and have continued to call people to live by the moral precepts commanded by Allah and to invite them to the true path, despite all the pressure placed on them by unbelievers. In some verses of the Qur'an the situation encountered by messengers are described as follows:
Alas for My servants! No messenger comes to them without their mocking him. (Surah Ya Sin, 30)
How shall they be reminded when a clear messenger has already come to them? But then they turned away from him and said, "He is an instructed madman!" (Surat ad-Dukhan, 13-14)
Equally, no messenger came to those before them without their saying, "A magician or a madman!" Did they bequeath this to each other? Indeed they are an unbridled people. (Surat adh-Dhariyat, 52-53)
Remember when Moses said to his people, "My people, why do you mistreat me when you know that I am the messenger of Allah to you?" So when they deviated, Allah made their hearts deviate. Allah does not guide people who are deviators. (Surat as-Saff, 5)
As revealed in these verses, some people turned their backs on the messengers who called on them to believe in Allah, despite their having seen evident proof and miracles, and joined forces against them. It is stated in the Qur'an that this is a law of Allah, and that all Muslims may be tested with similar difficulties, be subjected to slanders of one kind or another, and be subjected to psychological pressure to make them turn away from the moral values of the Qur'an. Allah has revealed this in another verse: "Or did you suppose that you would enter the Garden without facing the same as those who came before you?..." (Surat al-Baqara, 214) In another verse of the Qur'an He describes how believers will be exposed to various forms of pressure from unbelievers:
You will be tested in your wealth and in yourselves and you will hear many abusive words from those given the Book before you and from those who are idolaters. But if you are steadfast and guard against evil, that is the most resolute course to take. (Surah Al 'Imran, 186)
Again as a requirement of the law of Allah revealed in the Qur'an, every snare laid for believers was defeated right from the outset, and every slander turned out to be empty. In the Qur'an, Allah has revealed that such measures will always end in favor of believers. Allah also reveals that these people who unjustly oppressed His messengers and devout believers will receive a humiliating punishment in the Hereafter:
As for those who abuse Allah and His Messenger, Allah's curse is on them in this world and the Hereafter. He has prepared a humiliating punishment for them. And those who abuse men and women who are believers, when they have not merited it, bear the weight of slander and clear wrongdoing. (Surat al-Ahzab, 57-58)
Unbelievers and idolaters opposed true believers because they thought that the message communicated by the messengers would damage the order under which they had furthered their own interests for so many years. This is a method that unbelievers have implemented for hundreds of years in order to prevent people believing in Allah and to neutralize the message of His messengers. In his hadiths our Prophet (saas) revealed that all the messengers and saintly personages who would come after him would be subjected to various difficulties in communicating and spreading their message. In one hadith our Prophet (saas) reveals that those descended from his line will be confronted by great many troubles and difficulties:
... We are such a household that Allah has preferred the Hereafter to the world for us. The Family of my House will surely suffer tribulations, be kidnapped, and exiled after me. The Family of my House will encounter trials and tribulations and be exposed to violence. (Al-Muttaqi al-Hindi, Al-Burhan fi Alamat al-Mahdi Akhir az-Zaman, p. 14)
As our Prophet (saas) has stated in several hadiths, Hazrat Mahdi (as) will also be descended from the Prophet's (saas) household, in other words he will be one of his line. One such hadith states:
Hazrat Mahdi (as) is one of us, one of the Ahl al-Bayt. (As-Suyuti, Al-Hawi Lil-Fatawi, 2/24)
It is also revealed in hadiths that, like other saintly personages and messengers, Hazrat Mahdi (as) will also be subjected to all kinds of injustice and harsh accusations:
... He prays two rakaat. When he returns from the prayer he says: "People! The Community of Muhammad and especially his Ahl al-Bayt have undergone many troubles and we have been subjected to distress and injustice …" (Al-Muttaqi al-Hindi, Al-Burhan fi Alamat al-Mahdi Akhir az-Zaman, p. 55)
In another account, we are told that pressure will be applied by the supporters of the antichrist against Hazrat Mahdi (as) and the Prophet Jesus (as), who will wage a great intellectual struggle against the antichrist during the End Times. According to the indications in the hadith, the antichrist and his supporters will set various traps to hinder, arrest, exile or kill Hazrat Mahdi (as) and the Prophet Jesus (as) in their intellectual struggle against the former.
It can be seen from all these hadiths of our Prophet (saas) that Hazrat Mahdi (as) and his community will have to combat an intensive campaign of character assassination and slander. Since the period concerned is the End Times, the profound skepticism, insecurity, impatience and disloyalty that prevail over a large part of mankind will lead most people to pay heed to these slanders, and not to trust true Muslims.
Bediuzzaman describes this period in the following extract:
... And being under destructive and violent oppression for twenty years it has suffered such moral degeneration and lost such fortitude and loyalty that perhaps one in twenty is not to be trusted… (Bediuzzaman Said Nursi, Kastamonu Addendum, p. 86)
As Bediuzzaman says, because of the moral degeneration in the End Times people will harbor doubts about Hazrat Mahdi (as) and the Prophet Jesus (as), will fail to appreciate the importance of their activities aimed at spreading the moral values of the religion of Allah, and will even seek to hinder these worthy individuals' service. According to Bediuzzaman, that is why the Great Mujaddid so excitedly awaited by the whole Islamic world will not be popularly known by the title of Hazrat Mahdi (as) for many years. On the contrary, a large part of society will issue groundless slanders against him, as has been experienced by all Muslims in history, accusing him of corrupting their religion, perversion, falsehood and much more. However, as indicated in the hadiths, Hazrat Mahdi (as) will respond to all this character assassination and slander with a most superior fortitude and submission. He will make no concessions when it comes to his determination to live according to the moral values of the religion and preaching His message.
Our Prophet (saas) has referred to this superior moral virtue of Hazrat Mahdi (as) in his hadiths:
He will continue his struggle until people return to the truth. (Ibn Hajar al-Haythami, Al-Qawl al-Mukhtasar fi `Alamat al-Mahdi al-Muntadhar , p. 23)
Days and nights will not come to an end until my Ahl al-Bayt has a member [Hazrat Mahdi (as)] who will not find it difficult to prevent fitnah and who cannot be dissuaded by killing him. (Al-Muttaqi al-Hindi, Al-Burhan fi Alamat al-Mahdi Akhir az-Zaman, p. 12)
In another hadith our Prophet (saas) has indicated that all this pressure and these attacks will further strengthen Hazrat Mahdi (as):
When that Muslim personage [Hazrat Mahdi (as)] sees the antichrist, he says: "People! This is the antichrist of whom the Prophet (saas) mentioned." The antichrist gives his order about him right away and that person is laid upon his stomach and then it is said: "Take him and beat him." Then that person's back and stomach is broadened by beating. This time he [the antichrist] grabs him by his two hands and two feet and hurls him. People assume the antichrist throws him into a fire. But in fact he is thrown away into a Garden. (Ibrahim Suleymanoglu, Mehdilik ve Imamiye [Mahdism and Imamate], p. 40)
This metaphorical term employed in the hadith may be indicating that all the traps set for him will further strengthen Hazrat Mahdi (as) and further increase the effect of his message. (Allah knows the truth.)
It is also indicated in the hadith that every verbal or written onslaught by the antichrist and his supporters, every slander and character assassination issued to damage the prestige of Muslims in the public eye, will still work in favor of the community of Hazrat Mahdi (as). All these activities intended against Hazrat Mahdi (as) may be means whereby true believers come to be better known the world over, whereby the virtues of believers emerge more fully, whereby their faith in Allah deepens, and whereby, by Allah's leave, their degrees in Paradise are enhanced. (Allah knows the truth.)


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A few weeks ago, I wrote that the twists and turns in the eurozone crisis had, in the early months of 2012, lost the power to shock global asset prices. The reason given was that the prophylactic provided by the use of the ECB's balance sheet essentially trumped the deteriorating economic fundamentals in several countries, notably in Spain. This view has since been severely challenged, but it has just about remained intact; after all, American and Asian equities are still 6-7 per cent up so far this year.
However, the crisis which surrounds political events in Greece threatens to change all that. This is the first major revolt by any electorate against the eurozone's austerity policies, and it is those policies which have underpinned the willingness of the ECB to use its balance sheet to rescue the banking system. Furthermore, Greece is just the tip of the iceberg. The swing against austerity by voters in the eurozone is manifesting itself in many different places. I have been wondering whether this is good or bad news for the resolution of the crisis. Read more

subset: commoncrawl


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KOSE Milano
For its handmade porcelain designs, Kose Milano employs ancient artisanal techniques to realize pure, modern forms. Started by former fashion designer Rosaria Rattin in 1999, the company produces oversized vases, jugs, lamps, trays and bowls in unusual shapes and 20 or so different colors. Kose Milano, based in Milan, sells its line through 30 US stores.


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2008 Mercedes-Benz C Class
Sport Sedan 4D C350
CPO Pricing
Certified Pre-Owned (CPO) pricing for vehicles passing the Mercedes-Benz certification processPrint
CPO Pricing data is not currently available for the 2008 Mercedes-Benz C Class Sport Sedan 4D C350.
Search car listings and find the right car for you. Click here for '2008 Mercedes-Benz C-Class' local listings >>


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COMSOL, Inc.
1 New England Executive Park, Ste 350
Burlington, MA 01803
Tel: 781-273-3322
Fax: 781-293-6603
Web: www.comsol.com
E-mail: firstname.lastname@example.com
COMSOL Contact:
Valerio Marra, Technical Marketing Manager
Note to editors: Hi-res images of COMSOL Multiphysics are available for download at http://www.comsol.com/press/gallery.
COMSOL Multiphysics 4.3a Released
Version 4.3a introduces new LiveLink™ products for Microsoft® Excel® 2010 for Windows® and Solid Edge®, Amazon EC2™ cloud computing support, and ECAD file import. New Fatigue Module expands the mechanical simulation capabilities to calculate high- and low-cycle fatigue. All 30+ extension modules have been upgraded.
LiveLink™ for Excel® adds a dedicated COMSOL® tab to the Excel 2010 for Windows® ribbon bar, providing easy access to COMSOL's parameters, variables, functions, geometry, mesh, solvers, and results. Here, LiveLink™ for Excel® was used for a parameterized high-power direct current COMSOL Multiphysics® simulation of a bus bar. The parameters controlling the geometric dimensions as well as the applied voltage were edited in an Excel spreadsheet. Those changes made in Excel were then synchronized to the COMSOL model.
BURLINGTON, MA (October 1, 2012) — Continuing its tradition of innovation that users have come to expect, COMSOL today introduces Version 4.3a of COMSOL Multiphysics®, its flagship software for modeling and simulating physics-based systems. With version 4.3a and in response to user requests, COMSOL introduces LiveLink™ for Excel® to connect multiphysics results with spreadsheets. Version 4.3a also further extends the ability of engineers, scientists, and researchers to leverage multiphysics to design and optimize breakthrough products and technologies anywhere from the desktop to the cloud with new support for cluster computing on the Amazon Elastic Compute Cloud™ (Amazon EC2™). New modules for analyzing fatigue and for importing ECAD files make their debut in Version 4.3a as does the new LiveLink for Solid Edge®, a CAD software from Siemens PLM Software. Additionally, every one of the more than 30 application-specific COMSOL add-on modules for mechanical, electrical, fluid, and chemical modeling and simulation sees major new upgrades. COMSOL Multiphysics 4.3a will be available for download starting October 8.
Multiphysics Simulations and Excel Spreadsheets Linked
Version 4.3a's new LiveLink product for Microsoft Excel 2010 for Windows® enables users to run COMSOL Multiphysics directly within Excel, significantly simplifying the workflow of simulation.
"LiveLink™ for Excel® is a game changer that brings multiphysics to engineers and scientists everywhere," says Lars Gregersen, Technical Product Manager at COMSOL. "With LiveLink™ for Excel® as well as the new tools and extension modules in Version 4.3a, not only have we expanded the COMSOL simulation platform, we have further strengthened the role of multiphysics simulation in the product design tool chain."
LiveLink™ for Excel® works by adding a COMSOL tab to the new ribbon toolbar in Excel. From this tab users can control a COMSOL model. Parameters and variables used in the COMSOL Multiphysics model are available for editing in Excel instantly, and any edits to those parameters and variables in Excel can then be synchronized with the COMSOL model with a click of a button.
"Users of LiveLink™ for Excel®l will appreciate the new ribbon toolbar in Excel," says Gregersen. "It's a whole new user-experience that provides a fresh new way for users to control a multiphysics model. From within Excel you can now access parameters, variables, geometry model, meshes, visualizations, and results."
LiveLink™ for Excel® also allows users to save and load Excel spreadsheet files of experimental, validation, calibration, and other data related to a simulation from within COMSOL. Additionally, in a separate window, LiveLink™ for Excel® presents simulation results through interactive 3D plots. Users can then insert these plots into an Excel worksheet with just a single mouse-click.
"LiveLink™ for Excel® offers huge benefits for companies just now adding multiphysics-capable simulation tools throughout their design teams," adds Gregersen. "Through the new LiveLink™ for Excel® connection and our interfaces with major CAD packages, COMSOL fits right into their workflow."
Users with current COMSOL subscription as of October 1st, 2012, will receive LiveLink™ for Excel® free of charge. LiveLink™ for Excel currently requires Microsoft Excel 2010 for Windows®. Subscription is optional, fees will apply going forward.
Cluster Sweep in the Cloud Boosts Simulation Speed
Adding a completely new dimension to the COMSOL modeling and simulation experience, Version 4.3a extends its support for cloud computing to Amazon's Elastic Compute Cloud (Amazon EC2). Amazon EC2 delivers a scalable, pay-per-use compute capacity that can save users the expenses associated with purchasing and maintaining high-end workstations or in-house cluster networks, both of which are often underutilized.
Executing a complex multiphysics analysis on Amazon EC2's high-end hardware is easy too. Users with a floating network license simply upload their COMSOL executable and their model to Amazon EC2. To run their models and simulations, users can leverage cloud computing on Amazon EC2 in three ways: as a virtual machine, as a cluster computing environment for large distributed problems, and as a platform to run massively parallel parametric studies.
Using Amazon EC2 as a single virtual machine means that engineers have access to as much RAM as needed whenever they run large simulations. By employing COMSOL's cluster computing capabilities with Amazon EC2, users can solve very large distributed models on multiple computer resources (nodes) that might not be available locally as well as save valuable time to solution.
The recently introduced Cluster Sweep feature is engineered for compute-intensive jobs such as parametric studies and frequency sweeps. Cluster Sweep can significantly shorten the time to solution by enabling users to deploy in parallel as many CPUs as needed to solve their problem. Leveraging Cluster Sweep on a compute cluster such as Amazon EC2 lets users run multiple parallel processes with each individual process dedicated to a single parameter set of the same problem.
Fatigue Module Computes Structural Fatigue Life
Although structural analyses can result in a design that's well within the limits of its materials yield-stress limits, the same design's structure can fail when subjected to repeated load-cycles. The new Fatigue Module leverages the strength of the Structural Mechanics Module and the versatility of the COMSOL Multiphysics environment to help users determine how many load-cycles a structure can withstand.
The Fatigue Module provides both high-cycle and low-cycle – stress and strain, respectively – fatigue analysis methods. When also combined with the Nonlinear Structural Materials Module, users can perform full elastoplastic fatigue evaluations. Results include visualization of fatigue life based on the number of cycles until failure as well as fatigue usage factor. The Fatigue Module is offered as an add-on to the Structural Mechanics Module.
Low-cycle fatigue (LCF) analysis of an elastoplastic component subjected to multi-axial cyclic loading. Multiple load cycles are applied in order to get a representative load cycle. This fully documented model is available from the COMSOL Model Library.
ECAD Import Module
With the debut of the ECAD Import Module, electrical engineers can now import their electrical CAD files into COMSOL easily, and then simulate the physics of their electronic circuit components and circuit layouts using any COMSOL application-specific module. Among the applications that will benefit by taking advantage of the ECAD Import Module are determining the performance of RF components under thermal or mechanical load and analyses of power electronics devices, solder creep, and PCB vibration.
The ECAD Import Module's import capabilities include the GDS II, NETEX-G, and ODB++ file formats, and the Module offers the ability to create a 3D geometry model during the import operation automatically. The ECAD Import Module also provides new tools that make it easy to select and import subsets of cells, nets, and layers as well as edit layer thickness, control the geometric representation of bond wires, and specify dielectric regions. Users can store associated layer thickness data for repeated use.
Capacitance and inductance extraction for a planar transformer model imported as an ECAD file. This type of device is used in power supplies and DC/DC converters where a slim high-power design is crucial. The entire layout, including the footprint of the transformer ferrite core, was imported from an ODB++(X) file. The new ECAD Import Module read the layout and automatically created a 3D geometry model of the PCB and the ferrite core in COMSOL Multiphysics. Once the geometry was imported into COMSOL, the user could run any simulation such as thermal and mechanical analysis.
LiveLink for Solid Edge
Joining the family of COMSOL interfacing products, LiveLink for Solid Edge provides an associative, bidirectional link that expands the CAD user's engineering ability. By establishing an integrated link, any changes to a Solid Edge design feature automatically update the geometry in COMSOL Multiphysics, while retaining model settings. LiveLink for Solid Edge also provides the user with powerful repair and defeaturing tools for preparing the CAD model for simulation.
"Users of Siemens PLM Solid Edge are important members of the CAE community, which COMSOL and its products complement well," says Phil Kinnane, COMSOL's VP of Business Development. "Combining COMSOL Multiphysics simulations with Solid Edge designs will increase the understanding of how a process or physical phenomenon operates in the real world, which allows for rapid conceptual design and short time-to-market."
Parameter Optimization
Version 4.3a of the Optimization Module has been expanded with three new optimization methods – Nelder-Mead, Coordinate Search, and Monte Carlo – that users can apply to any COMSOL Multiphysics model and use with every application-specific module. Users can optimize one or more geometric dimensions for a CAD model created directly with COMSOL Multiphysics or linked through any of the LiveLink products. While optimization control parameters typically are geometric dimensions, they can represent any other parameter used as an input to the analysis such as total power of a heater, material properties, or applied force. The optimization objective function, which can be either minimized or maximized, can be any scalar quantity derived from the simulation results.
Tunable MEMS capacitors are used in tunable filters and tunable mobile antennas in wireless devices, including multiple-band cell phones. In this model a target capacitance of 0.1 pF was found by optimizing the distance between the capacitor plates. Shown here are three configurations for different offset distances of the lower capacitor plate. An optimal distance of 12.5 µm was computed.
CFD Meshing and Solvers
COMSOL's CFD (Computational Fluid Dynamics) capabilities see major upgrades in Version 4.3a, including expanded techniques for solving FSI (Fluid-Structure Interaction) problems and several new automatic meshing tools.
For solving FSI applications efficiently, earlier releases of COMSOL offered bidirectional coupling for FSI problems where a strong coupling between fluid and solid existed. Version 4.3a extends COMSOL's versatility with the introduction of new methodologies for one-way coupled stationary and transient applications in which there is no coupling from the solid back on the fluid.
CFD users will also benefit from new solver features that reduce memory requirements for large models and provide automatic solver tuning. With Version 4.3a COMSOL now automatically adapts the type of solver used to the number of finite elements in a model. Stationary flow and FSI applications now use a pseudo-time stepping method that enables robust convergence towards a steady-state solution.
Several automatic meshing tools for CFD assignments debut in Version 4.3a. For example, the meshing algorithm now finds and refines the mesh at reentrant corners automatically, and creating boundary-layer meshes has been enhanced with new techniques for handling sharp corners. Additionally, boundary layer meshing is tightly integrated with new CFD solver features and now applies to membranes or shells represented as interior boundaries.
This picture shows the finite element mesh of a heat sink. The automatically applied boundary layer mesh combined with automatic corner refinement and new handling of sharp edges enable robust convergence of the CFD and heat transfer simulation. A selection of the fluid bulk and boundary layer mesh is shown where color represents element quality.
Geometry Selection
In keeping with the COMSOL tradition of constantly improving the user experience, Version 4.3a adds new selection tools that make using the software friendlier. One handy tool allows the user to select a single face and include all adjacent boundaries with continuous tangents. Another is the new cylinder selection, which makes it possible to use a coordinate-based cylinder for selecting objects in a geometry model. Both of these new features not only make boundary selection easier but they reduce the number of required mouse clicks.
In COMSOL Version 4.3a selecting boundaries in geometry models such as this exhaust manifold is easy with the new continuous tangent selection tool.
Design and Optimization from the Desktop to the Cloud
COMSOL Multiphysics Version 4.3a continues the COMSOL tradition of empowering its users with tools designed to inspire innovation through exceptional usability and the power to deliver highly optimized products quickly. Version 4.3a represents a significant step toward the integration of the simulation, design, and optimization processes for engineers everywhere. By extending interfaces to more design and engineering tools, opening up greater access to cloud computing, delivering new tools to analyze real-world physics problems, and increasing overall performance, COMSOL Multiphysics Version 4.3a promises huge benefits for its users now and well into the future.
Major News in COMSOL Multiphysics Version 4.3a At a Glance
- LiveLink™ for Excel®
- Run COMSOL simulations from within Microsoft Excel 2010 for Windows®.
- Load Excel files into COMSOL.
- Fatigue Module
- Mechanical fatigue based on stress or strain evaluations.
- ECAD Import Module
- Import of ECAD layouts with new functionality for filtering of cells, nets, and layers.
- LiveLink™ for Solid Edge®
- Bidirectional associativity with files created with the Solid Edge CAD software from Siemens PLM Software.
- Cloud Computing
- Support for cloud computing with Amazon Elastic Compute Cloud™ (Amazon EC2™).
- Parameter Optimization
- Optimize designs based on geometry model dimensions or other parameters.
- More Efficient CFD Solvers
- Optimized solvers for flow simulations and new methods for solving for fluid structure interactions.
- Accelerated parallel computing.
- For detailed information on COMSOL Multiphysics version 4.3a please visit www.comsol.com/products/4.3a/
About COMSOL
COMSOL provides simulation software for product design and research to technical enterprises, research labs, and universities through over 17 offices and a distributor network all over the world. Its flagship product, COMSOL Multiphysics®, is a software environment for modeling and simulating any physics-based system. A particular strength is its ability to account for coupled or multiphysics phenomena. Add-on products expand the simulation platform for electrical, mechanical, fluid flow, and chemical applications. Interfacing tools enable the integration of COMSOL Multiphysics simulation with all major technical computing and CAD tools on the CAE market.
COMSOL and COMSOL Multiphysics are registered trademarks of COMSOL AB.
Other product or brand names are trademarks or registered trademarks of their respective holder


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When the thermometer drops below 20 degrees, it's time to break out the Dutch Oven and make soup for dinner. Since I'm on my January healthy kick, Ellie Krieger's Tuscan Vegetable Soup recipe was a great option fill up with hearty vegetables instead of empty calories.
Since I'm not a huge fan of onions I decided to caramelize them a bit before adding in the rest of the vegetables.
While the recipe calls for zucchini, it's prime season is during the summer months, so I used green squash with my carrots and celery instead.
While the vegetables, garlic, thyme and sage cooked, it smelled like the holidays all over again (think: stuffing).
I added the vegetable broth and canned diced tomatoes and then stirred in dried cannelini beans instead of the canned variety. Canned beans are definitely quicker but I had time before putting dinner on the table so I used the dried variety to cut down on my sodium intake. If you're going to go this route, the soup will need to simmer for at least 1-2 hours while the beans cook.
Right before I was ready to eat (and salivating from the amazing aroma) I added chopped fresh spinach. It only needs a few minutes to cook.
Once all the vegetables and beans are cooked, you might want to add a bit more broth depending on how thick you want your soup.
Top with Parmesan for a taste that feels like you ordered from a classic Italian restaurant.
Get the recipe: Tuscan Vegetable Soup
More Dinner Ideas:
Healthy Soup, Chili and Stew Recipes
Healthy Weeknight Dinners
Healthy Chicken Dinner Recipes
Drop 5 Lbs. with Cooking Channel:
Get Started
Eat a Better Breakfast
Pack a Healthy Lunch
Lighten Up Your Favorite Comfort Foods
Eat More Fruits & Vegetables
Skip the Takeout: Healthy Asian Fare
And Don't Forget Dessert!


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text: Was on business travel in Pittsburgh and had to stop by Primanti Bros. You may have seen them on shows on the Food Network or Man v. Food. They make these huge sandwiches where they put the cole slaw and the fries right on the sandwich. Although hard to see the meat, this is Capicola and Provolone. So good and I highly recommend.


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JOHN Jackson continued to maintain hopes of Great Britain's first Olympic bobsleigh medal since 1998 as he topped the standings on the second day of official training on Thursday.
Jackson, who lives with British women's number one Paula Walker in Paxcroft Mead, finished 0.02 seconds behind Russia's two-man gold medallist Alexander Zubkov in the first heat of the day and improved to pip Zubkov by 0.01secs in the second.
Jackson had placed seventh and third on the opening day of official training on Wednesday.
Although a number of four-man teams use official training runs to test runners and lines, and some – including American pilot Steven Holcomb – often do not push, Jackson's times raise genuine hopes that he will be in the hunt for a medal when competition gets under way on Saturday.
Jackson admits he is still battling his fitness – but insists it's no pain, no gain in his pursuit of glory.
Jackson defied medics to compete this season after a ruptured Achilles last summer, which required pioneering surgery never before attempted on an elite athlete.
He is looking to upgrade his fifth place at last year's World Championships in Sochi, where he clearly likes the track, finishing fifth again at last year's test event.
"I wouldn't say I am fully fit, I am progressing still day by day by day," said Jackson, who also claimed a first career World Cup podium with a silver last December and is competing at his second Games.
"I am in the best shape I can be but I would love to be running three or four tenths quicker over a sprint. I am now sprinting faster than I was before I did my Achilles, so I can't complain.
"We are coming into the Olympics as the best prepared team that we can be. There is pain sometimes, even just walking around, it hurts walking up and down hills, it still hurts when I get to the bottom of the bobsleigh track.
"It is part of the life of being an elite athlete. We have just got to get on with it, it doesn't hurt when I am pushing so that is the main thing."
Jackson admits he thinks about the twists and turns of the Sanki Sliding Centre in his sleep and will have had 40 practice runs down the track when he lines up for race day on Saturday.
"I think it is a great track to drive. It suits our equipment, it suits us as a team at the start and we will see what happens in the race," he added.
"It does pay to be quite mentally strong but in terms of expectations we have had a relatively good season in terms of results. We have done a lot of moving and changing things around some of which has worked, some of which hasn't."


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Peyton perfect, yet an underdog?
Manning is 24-2 at home in the regular season since joining the Denver Broncos four years ago. One of those losses was to Houston, 31-25, and his current coach, Gary Kubiak, in 2012 when the Broncos were 1-point underdogs.
That was the only time odds-makers made Manning a home dog in the Rocky Mountains until this weekend, when they installed the Green Bay Packers (6-0) as a field-goal favorite.
"I think we should definitely not be an underdog, really. We're at home, undefeated," retorted cornerback Chris Harris Jr. "I guess they're just going off the offensive struggles the first half of the season. So, you kind of understand that. But we feel like we should never be an underdog, ever."
RJ Bell, founder and CEO of Pregame.com, said it's not just that the Broncos are 29th in offense or than Manning is the NFL's 31st-ranked passer, but that Green Bay has Aaron Rodgers and the league's best scoring defense at 101 points.
The Broncos are next at 102, although Denver's wrecking-crew defense actually is responsible for only 82 of those points as 20 have come off Manning's trio of pick-6s.
Nevertheless, Manning is an underdog for just the fourth time in a Broncos uniform, home or away.
The last time Manning was this big a home underdog was the season finale on Dec. 28, 2008, when the Titans were 3-point favorites at Indianapolis and Manning made a cameo appearance in the Colts' 23-0 win.
Despite their dominant defense and stout special teams, the Broncos have outscored their opponents by just 37 points, the lowest differential for a 6-0 team since the 1933 Chicago Bears, who were plus-34.
That's actually a good thing, Anderson argued.
The last few years, "we were blowing some people out and when we got into some tough situations it was hard to overcome," he said. "This year, we're just overcoming tough situations. Because we've just adapted to it."
He figures all those clutch drives and close calls will pay dividends down the road, maybe even at home Sunday night.


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A Levels are academic qualifications you can study post 16. They are very well regarded by universites and employers.
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Qualcomm's New Snapdragon S4: MSM8960 & Krait Architecture Exploredby Brian Klug & Anand Lal Shimpi on 10/7/2011 12:35 PM EST
- Posted in
- Snapdragon
- Qualcomm
- Smartphones
- Krait
- Mobile
- SoC
108 Comments
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dagamer34 - Friday, October 07, 2011 - linkGreat stuff to look forward to. Some comments:
1) I wasn't aware that Microsoft released DirectX 9.3. Perhaps you meant 9.0c or 9.1?
2) Why is nVidia still using a single LPDDR2 channel when everyone else has gone to dual channel memory?
I do look forward to seeing what the next generation of GPUs will provide. Seems like we've stayed in this console generation too long with cell phones having graphics nearly on par with their 200W cousins. Reply
A5 - Friday, October 07, 2011 - linkRe: DX 9.3, you beat me to it.
Ilomilo is pretty, but it's not exactly Gears or Battlefield, you know? Reply
Ryan Smith - Friday, October 07, 2011 - linkIt's actually more complex than that. When it comes to programming for Direct3D11, there are a number of different GPU feature level targets. The idea is that developers will write their application in DX11, and then have customized render backends to target each feature level they want to hit.
As it stands there are 6 feature levels: 11, 10_1, 10, 9_3, 9_2, and 9_1. Unfortunately everyone has been lax in their naming standards; DirectX and Direct3D often get thrown around interchangeably, as do periods and underscores in the feature levels (since prior to D3D 11, we'd simply refer to the version of D3D). This is how you end up with DirectX 9.3 and all permutations thereof. The article has been corrected to be more technically accurate to clear this up.
In any case, 9_1 is effectively identical to Direct3D 9.0. 9_3 is somewhere between D3D 9.0b and 9.0c; it implements a bunch of extra features like multiple render targets, but the shader language is 2.x (Vertex Shader 2.0a, Pixel Shader 2.0b) rather than 3.0 Reply
partylikeits1999 - Saturday, October 08, 2011 - linkMicrosoft made such a mess out of its DirectX nomenclature in the DX9 timeframe that the rest of the industry started to ignore it and invent their own. Hardly anybody even bothers to distinguish between Direct3D and DirectX anymore...they're used interchangeably, even though the former is a subset of the latter.
Windows 8 requires Shader Model 3.0 to be supported by the hardware. Whether you call that 10Level9_3 or 9_3, or DX9.3, or D3D9.3, who cares...from a graphics perspective, it is all just Shader Model 3.0 in the end, whatever you want to call it. All of the Windows 8 launch chipsets from nVidia, TI and Qualcomm, including this MSM8960 will all support Shader Model 3.0 as far as I can tell. Reply
ET - Sunday, October 09, 2011 - linkFeature level 9_3 isn't the same as Shader Model 3 support. The Qualcomm docs say DX9.3 though, which is quite confusing since it doesn't exist. That said, I agree with your assessment that it means Shader Model 3, and not feature level 9_3. Reply
felixyang - Saturday, October 08, 2011 - link2) I believe dual channels don't give any advantage due to tegra's system bus. Reply
metafor - Friday, October 07, 2011 - linkMSM8260 and MSM8660 only have single-channel 32-bit LP-DDR2 memory, not dual. Reply
z0mb13n3d - Friday, October 07, 2011 - linkPlease read:
Although Scorpion featured a dual-channel LPDDR2 memory controller, in a PoP configuration only one channel was available to any stacked DRAM. In order to get access to both 32-bit memory channels the OEM had to implement a DRAM on-package as well as an external DRAM on the PCB. Memory requests could be interleaved between the two DRAM, however Qualcomm seemed to prefer load balancing between the two with CPU/GPU accesses being directed to the lower latency PoP DRAM. Very few OEMs seemed to populate both channels and thus Scorpion based designs were effectively single-channel offerings.
I can tell you with a modicum of confidence that this is true, at least partially.
Aren't you the same person who went on (ranting, obviously) about Krait using HKMG and hitting 2.5GHz next year, in another article? Reply
ArunDemeure - Friday, October 07, 2011 - linkI suggest you stop embarassing yourself. metafor knows what he's talking about, and you clearly don't. I read that previous thread - he was pretty much spot on for everything, as you would expect. I honestly don't know why he even bothers here given the reception he's getting...
Anyway unlike what the article says, the MSM8x60 indeed only has single-channel 32-bit LPDDR2. However there's a twist: Qualcomm offers it in a PoP (Package-on-Package) configuration at up to 266MHz or an 'ISM' (i.e. SiP or System-in-Package) at up to 333MHz. I wouldn't be surprised if many OEMs used the PoP for cost reasons.
I think the confusion might come from another (older) Qualcomm SoC working like the article described iirc, but this does not apply to the MSM8x60 AFAIK. Reply
Anand Lal Shimpi - Friday, October 07, 2011 - linkArun,
This information does come from Qualcomm, although the odd PoP + external DRAM configuration (that no one seems to use) basically means that MSM8x60 is a single-channel architecture (which is why I starred it in the table above). I will ask Qualcomm once more for confirmation that this applies to MSM8x60 as well as the older single core variants.
Take care,
Anand Reply
metafor - Friday, October 07, 2011 - linkScorpion does support dual-channel, however, the 8x60 series does not have two controllers. The 8x55/7x30 does, however and in most cases, are used in the configuration you described in the article. Reply
ArunDemeure - Friday, October 07, 2011 - linkI knew MSM7x30/8x55 was dual-channel but I thought it was also available as a 64-bit LPDDR2 PoP solution? While it makes sense for most people to use it as single-channel LPDDR2 as opposed to dual-channel LPDDR1 these days, why would anyone ever have used both PoP and non-PoP DRAM at the same time? Maybe that old leaked presentation on Baidu listing all the MSM7x30/8x55 packages is wrong though. Reply
metafor - Friday, October 07, 2011 - linkA single Scorpion and Adreno 205 just didn't need both channels. It makes more sense for a lot of OEM's to use single 32-bit LPDDR2. Reply
ArunDemeure - Friday, October 07, 2011 - linkHmm, that would certainly be news to me, it's possible but you'd still need a second memory controller and PHY so it makes very little sense. I can see a few possibilities:
- The LPDDR2 and DDR2 subsystems aren't shared so in theory for tablets you could do 32-bit SiP LPDDR2+32-bit off-chip DDR2. Seems weird but not impossible.
- You can do 32-bit ISM+32-bit PoP. Once again, why do this? Were they limited by package pins with a 0.4mm pitch? Seems unlikely with a 14x14 package but who knows.
- You can genuinely do 32-bit PoP+32-bit on the PCB. Still seems really weird to me.
The MSM7200(A) had a separate small LPDDR1 chip (16-bit bus with SiP) reserved mostly for the baseband while the primary OS-accessible DRAM was off-chip. This was obviously rather expensive (fwiw Qualcomm only 'won' that generation on software and weak competition IMO) and removed it to reduce cost (making the chip's memory arbitrage more complex) on the MSM7227. I'm not sure about the QSD8650, maybe it still optionally had that extra memory bus (SiP-only) but it was more flexible and never used, it's hard to find that kind of info.
Arun Reply
mythun.chandra - Friday, October 07, 2011 - linkAnand,
Isn't this what I had pinged you about earlier? Reply
z0mb13n3d - Friday, October 07, 2011 - linkI suggest you look into the facts before passing such statements.
I don't know where you or the OP are getting your information from (3GHz A15's, quad 2.5GHz Kraits hitting next year, Kraits using HKMG etc.), but that's been pretty inaccurate. All you're doing is speculating based on bits and pieces floating around in PDF's and slides. I still remember one of his claims from the previous thread '2x A15's > 4xA9's' . While no one in their right sense of mind would argue that a the wider, deeper, single A15 is better than a single A9, to make such an uninformed, blanket statement (and to back it up with useless DMIPS numbers!) just doesn't bode very well. Reply
ArunDemeure - Friday, October 07, 2011 - linkST-Ericsson has publicly indicated the A9600's A15s can run at up to 2.5GHz, and GlobalFoundries has publicly said that the A9600 uses their 28nm SLP process which uses High-K but not SiGe strain. Is it really hard to believe a 28HPM or 28HP A15 could easily reach 3GHz? I'm not sure anyone will do that in the phone/tablet market, but remember ARM also wants A15 to target slightly larger Windows 8 notebooks and (I'm not as optimistic about this) servers.
As for Krait, Qualcomm's initial PR mentioned 2.5GHz (not just random slides) and APQ8064 is on TSMC 28HPM which uses High-K. If you don't trust either me or metafor on that, Qualcomm has also publicly stated that most of their chips will run on SiON but that they were considering High-K for chips running at 2GHz or above: http://semimd.com/blog/2011/02/07/qualcomm-shies-a...
As for 2xA15 vs 4xA9, metafor's point is that most applications are still not sufficiently multithreaded. It has very little to do with DMIPS which is a worthless outdated benchmark (not that Coremark is perfect mind you - where oh where is my SPECInt for handhelds? Development platforms could support enough RAM to run it by now). Unlike him I think 4xA9 should be relatively competitive even if clearly inferior in some important cases, and as you imply it's a difficult and even fairly subjective topic, but I don't think metafor's opinion is unreasonable. Reply
z0mb13n3d - Friday, October 07, 2011 - linkThat is the point I'm trying to make! Semiconductor companies, by virtue of the fact that they have to sign OEM/ODM deals before they really even have working products almost always posture about how much their designs can go 'up to' or 'indicate' ratings and numbers. My beef with the earlier thread was that statements were being passed on as facts based purely on stuff posted in press releases. I can tell you, for a fact, that no 2.5GHz Krait (dual or quad) based product will be shipping in '12. I can also tell you for a fact that you will not see anything more than 1.8-2.2GHz (optimistic) in shipping A15's for mobile devices. I understand the A15 architecture is capable of much more, but to try and draw comparisons between a near-shipping mobile-spec quad-core A9 and an on-paper 3GHz A15 powering servers is not correct!
If you did follow the previous thread closely, you will see that this was the only point I was trying to get across, in vain. No matter how you slice and dice it, the 2xA15 > 4xA9 argument is wrong. This is very similar to what we're seeing in the x86 market with Intel and AMD where the older, tri and quad core AMD's are still able to keep-up with or beat dual-core Intel's in threaded situations. Now it is an entirely different argument as to whether or not Google/MS/whoever else makes effective use of multi-core CPU's in their current mobile platforms and their relatively crude/simple kernels (as compared to desktop operating systems), but come Windows 8, I am willing to bet that quad core (or multi-core in general) SoC's will prove their worth. Reply
ArunDemeure - Friday, October 07, 2011 - linkST-E could underdeliver on the A9600, sure, but they've got a better process than OMAP5 and enough clever power saving tricks up their sleeve (some of which still aren't public) that I feel it's quite likely they won't. Remember 2.5GHz is only their peak frequency when a single core is on - they have not disclosed their throttling algorithms (which will certainly be more aggressive for everyone in the 28nm generation, especially on smartphone SKUs as opposed to tablets where higher TDPs are acceptable).
Also multiple companies will be making A15s on 28HPM eventually. TSMC has indicated they have a lot of interest in HPM, and that should certainly clock at least 25% higher than GF's Gate-First Non-SiGe 28SLP. However the problem is that the A15 is quite power hungry, so I expect people will use that frequency headroom to undervolt and reduce power although a few might expose it with a TurboBoost-like mechanism. On the other hand, exposing the full 3GHz for Windows 8 on ARM mini-notebooks should be a breeze, and I don't see why you'd expect that to be a problem.
As for 2.5GHz Quad-Core Krait in 2012 - I think they're still on schedule for tablets in late 2012, but then again NVIDIA was still on schedule for tablets in August 2011 back in February, so it's impossible to predict these things. Delays happen, and it'd be foolish not to take metafor seriously simply because he is unable to predict the unpredictable.
Finally, 2xA15 vs 4xA9... metafor's point is that given the lower maturity of multithreading on handheld devices, it's more like high-end quad-core Intel CPUs beating eight-core AMD CPUs in the real world. As I said I'm not sure I agree, but it's fairly reasonable. Reply
dagamer34 - Saturday, October 08, 2011 - linkI doubt it was a delay as much as nVidia being boastful. They've quite known for that. Reply
metafor - Friday, October 07, 2011 - linkI believe the comparison was simple: dual-Krait compared to 4xA9. I claimed Krait would be much closer to A15 level than A9 -- I was right.
I claimed that 2xA15 (and 2xKrait) will be far better than 4xA9. I hold to that but some may disagree. I can understand that point.
I claimed that both Krait and A15 were set to target similar frequencies (~2.5GHz) according to release -- I was right.
I claimed that Krait will initially be ~1.4-1.7GHz on 28LP and is planned to reach 2.5GHz on HKM -- I was right.
On every point, you disagreed with me -- and stated "I know for a fact that such and such". Did Krait turn out to be "a modified A9" as you claimed? No.
Is its projected performance and clockspeeds far closer to A15-class than A9? Yes.
Also, how often do you think that quad-core on your desktop actually gets utilized? Are you under the impression that multithreading is some kind of magical pixie dust that you sprinkle on to an OS kernel and all of a sudden, your applications will run faster?
Hint: Android is fully multithread capable -- 3.0 even includes a great pthread library implementation. That doesn't mean individual applications can actually be threaded or that they even can be. This should be common knowledge by now: only certain workloads are highly parallelizable. Reply
FunBunny2 - Saturday, October 08, 2011 - link-- This should be common knowledge by now: only certain workloads are highly parallelizable.
Too many folks have never heard of Amdahl or his law. Reply
metafor - Friday, October 07, 2011 - linkOn top of that -- as we've discussed previously -- there is a very small subset of computationally intensive, highly thread-scalable applications out there. Specifically: compression, video transcoding and image processing (which will likely be the biggest performance-demanding app for the CPU on tablets what with the Photoshop Touch series).
So yes, on 4xA9, that could potentially scale to all 4 cores. But here's the thing: those are all very NEON/FPU intensive applications.
And guess what subsystem was substantially improved in A15 compared to A9?
Double the data path width, unified load-store, fully out-of-order VFP + NEON and lower integer execution latency on top of that (which, IIRC, is what most image processing algorithms use).
Even assuming A15 runs at the same clockspeed as an A9, it would still be 2-3x faster in typical arithmetic-intensive workloads. Reply
partylikeits1999 - Saturday, October 08, 2011 - linkAnybody who thinks that application performance can be predicted by simply by CPU clock speeds alone, is a fool who has no business posting on sites like this. Let it go. Reply
baritz - Friday, October 07, 2011 - linkIn the Power vs. Temperature plot on page two, have the axis labels been reversed accidentally?
The way I read the graph as it is, 40nm transistors can handle more power without getting hot, while 28nm transistors get hot very quickly with only a small increase in power. Reply
metafor - Friday, October 07, 2011 - linkIt seems pretty clear. As temperature increases (right on the X axis), 40G transistors consume more power (up in the Y axis). The power increase vs temperature increase curve of 28LP doesn't grow as fast.
This, of course, has more to do with it being an LP process. 40LP transistors would have a similar curve. Reply
Haserath - Saturday, October 08, 2011 - linkMetafor is right about the curve having to do with the process. His explanation kinda makes it seem like a temp increase causes the power increase though. It's the power increase that causes the temp increase, and "G" transistors are designed to handle more power without wasted heat(temperature increase) compared to "LP" transistors. There's also a second reason why 28nm is hotter than 40nm.
If you have a certain amount of heat energy being produced at a certain power level, the 40nm transistors will be a certain temperature.
Now take that same amount of heat energy being produced, and shrink the transistors to half their size. This increases their temperature within the same power envelope.
Of course they labeled a thermal limit on the power side, because the holder of whatever phone this chip goes into is going to feel the heat coming from the chip due to how much power it's using(how much heat energy is put out), not just due to the temperature of the transistors Reply
metafor - Saturday, October 08, 2011 - linkIt's actually both :)
This is a problem in a lot of circuit design. Power dissipation (both due to scattering and increase in resistance of the charge channel) increases with temperature. But temperature also increases as more power is dissipated. It's a positive feedback loop that just gets hotter and hotter.
When simulating a circuit, this problem has to be taken into account but simulating the heat dissipation is difficult so one can never be sure that a circuit wouldn't overheat under its own operation.
It's an on-going research area in academics of how to simulate such a situation beforehand and avoid it. Reply
Haserath - Sunday, October 09, 2011 - linkWell, that is true.
Basically, it's increasing the power of the chip, which increases heat energy output, that increases the temperature. And with that increase in temperature, comes an increase in power.
Heat dissipation is the only way for the chip to keep itself from burning up. It's just impossible to really tell how much can be dissipated under even certain conditions due to heat exchange kinetically between atoms, and most likely the radiation amount differs between atoms.
It's basically impossible to simulate an exact scenario for this exchange. Reply
jjj - Friday, October 07, 2011 - linkThe minute a company gives you a bit of attention,you forget about objectivity.
"The key is this: other than TI's OMAP 5 in the second half of 2012 and Qualcomm's Krait, no one else has announced plans to release a new microarchitecture in the near term"
"Qualcomm remains the only active player in the smartphone/tablet space that uses its architecture license to put out custom designs."
Both statements are false,and you know that very well. Reply
introiboad - Friday, October 07, 2011 - linkReally? I wasn't aware of anyone else in the industry not using ARM's RTL and designing their cores from scratch. Reply
z0mb13n3d - Friday, October 07, 2011 - linkWell then, perhaps you haven't heard of Marvell and their Armada line of SoC's? Reply
introiboad - Friday, October 07, 2011 - linkYes, I have heard of Marvell and Armada, isn't that what's left of XScale? Honestly I thought they had given up on what was XScale and licensed the RTL like everyone else instead, but it looks like I was wrong. Reply
metafor - Friday, October 07, 2011 - linkWhich is probably why Anand specified tablet/smartphones. Marvell is, for all practical purposes, not a major or even relevant player in tablet/smartphones.
It is worthy to note that both nVidia and (thus believed) Apple are utilizing their architectural licenses and are cooking up their own cores currently. But none will likely launch in 2012. Reply
Anand Lal Shimpi - Friday, October 07, 2011 - linkThe qualification there was "in the smartphone/tablet space". Marvell hasn't had any significant design wins in the high end Android, iOS, Windows Phone or QNX OS space that we cover.
Is there another company you are referring to?
Take care,
Anand Reply
Mike1111 - Friday, October 07, 2011 - linkWhat about the ST-Ericsson Nova A9600?
It's a 28nm dual-core Cortex-A15 (up to 2.5 GHz) with an Imagination Rogue GPU (Series 6, 210 GFLOPS). Taped out and set to ship in 2012:
And I'm sure we will see an Apple A6 in the next 12 months (IMHO could be quite similar to the Nova A9600 in terms of CPU and GPU). Reply
Anand Lal Shimpi - Friday, October 07, 2011 - linkNeither of those options are custom designs using the ARM ISA, they are full IP licenses.
You are correct on ST-E's announcement though, I simply haven't been factoring them into discussions lately as they have been pretty much not present in the high-end smartphone space as of late.
Take care,
Anand Reply
partylikeits1999 - Saturday, October 08, 2011 - linkI'm hearing that this one has slipped, and now the ST-Ericsson chipset with Rogue won't sample to OEMs until the first half of next year and therefore won't be in commercial products until the very end of 2012 if at all, whereas the MSM8960 is already sampling to OEMs according to Qualcomm. In other words, schedule-wise, you're probably comparing apples to oranges. I do agree with you though that we'll likely see A6 from Apple, in some form, by this time next year, but I think it'll be higher spec'd and will blow the doors off anything from STE. The more interesting question is whether the quad core 8064 that Qualcomm has mentioned for next year, can keep up with A6, both from a CPU and a GPU standpoint. Reply
ArunDemeure - Friday, October 07, 2011 - linkMarvell indeed hasn't had much luck in the high-end so far, but the same latest PJ4 core has been fairly successful both as the HSPA Pantheon 920 at BlackBerry (including some new BlackBerry 7 devices) and the TD-SCDMA Pantheon 910 for various China Mobile-specific phones. So I'm not sure it's a good idea to exclude them completely although they're certainly not in the same league as Qualcomm so I really don't blame you. Reply
macs - Friday, October 07, 2011 - linkAre you really sure that the upcoming Nexus Prime will use OMAP 4?
Seems unlikely to me... A SGX 540 to power a 720p display when Samsung as their own better SOC with Mali 400?? And the rival iPhone 4S use a GPU that is 7/8 times faster than SGX540.
Sounds really stupid... I can't believe that OMAP 4 is the reference SOC for Android ICS Reply
metafor - Friday, October 07, 2011 - linkThe SGX540 in the OMAP4460 is clocked significantly higher than (something TI is great at). So, while it isn't a powerhouse compared to Exynos or A5, it's more than sufficient. Google has never traditionally been top-of-the-line in terms of processors with their Nexus series. So it isn't out of the question they wouldn't be this time around either. Reply
dagamer34 - Saturday, October 08, 2011 - linkTechnically, the Hummingbird SoC used in the Nexus S was top of the line at the time it was released (although it was eclipsed by dual-coe phones after 1-2 months). Also the Nexus One was the first major phone I can remember that had 512MB of RAM.
However, it should be said that Google doesn't think about getting the best SoCs available for their product, but instead seeks to get the best deal on it's components from bidding against vendors. It's very possible that Samsung knows they had the most powerful SoC outside of the A5 and wanted Google to pay it for the value it would provide. Google instead apparently went with TI, likely because TI is selling it's chips cheaper in order to be the reference platform for Ice Cream Sandwich. Reply
DanD85 - Friday, October 07, 2011 - linkFunny I saw Adreno 225 having 8 SIMDS and 5 MADS per SIMDS that should be equal to 40 total MADS right? Why it's 80? Am I missing sth? Reply
cptcolo - Friday, October 07, 2011 - linkLooking at the chart on "The Adreno 225 GPU" an comparing to the frame rates in the iPad 2 review (http://www.anandtech.com/show/4216/apple-ipad-2-gp... It looks like the PowerVR SGX543MP2 in the iPhone 4S will be about 33% faster. This is a very approximate estimate. Reply
cptcolo - Friday, October 07, 2011 - link"Qualcomm claims that MSM8960 will be able to outperform Apple's A5 in GLBenchmark 2.x at qHD resolutions. We'll have to wait until we have shipping devices in hand to really put that claim to the test, but if true it's good news for Krait as the A5 continues to be the high end benchmark for mobile GPU performance." Reply
ssvb - Friday, October 07, 2011 - linkPlease correct your CPU features comparison table (and in the previous articles too). ARM11 has a *pipelined* VFP, which actually makes it a lot faster than Cortex-A8 for double precision floating point workloads. You can have a look at the instruction cycle timings to get a better idea:
ARM11 VFP - http://infocenter.arm.com/help/topic/com.arm.doc.d...
Cortex-A8 VFP - http://infocenter.arm.com/help/topic/com.arm.doc.d...
Thanks. Reply
Anand Lal Shimpi - Friday, October 07, 2011 - linkThank you! Fixed :)
Take care,
Anand Reply
icrf - Friday, October 07, 2011 - linkAn ARM Cortext A9 has an 8 stage pipeline, not 9: http://www.arm.com/files/pdf/ARMCortexA-9Processor... Reply
Anand Lal Shimpi - Friday, October 07, 2011 - linkThanks :)
Take care,
Anand Reply
Blaster1618 - Friday, October 07, 2011 - linkMaybe a noob, but I did not know that L0 memory could operate at GHz clock rate (5-10 times that of SD Ram clock rate. Good stuff, keep it coming. B-) Reply
DanNeely - Friday, October 07, 2011 - linkStatic ram (the kind used in CPU caches) has always been much faster than the dynamic ram used for main system memory.
SRAM uses a block of a half dozen transistors to store a bit as a stable logic state; as a result it can operate as fast as any other transistor based device in an IC. The number of clock cycles a cache bank needs to complete an access operation is primarily a factor of its size, both because it takes more work to select a specific part and because signalling delays due to the speed of electric signals through the chip become significant at gigahertz speeds. Size isn't the only speed factor in how fast a cpu cache operators; higher associativity levels can improve worst case behavior (by reducing misses due to pathalogical memory access patterns) significantly at the cost of slowing all operations slightly.
DRAM has a significantly different design, it only uses a single transistor per bit and stores the data in a paired capacitor. This allows for much higher memory capacities in a single chip and much lower costs/GB as a result. The catch is that reading the capacitors charge level and then recharging it after the check takes significantly longer. The actual memory cells in a DDR3-1600 chip are only operating at 200mhz (up from 100-133mhz a decade ago); other parts of the chips operate much faster as they access large numbers of memory cells in parallel to keep the much faster memory bus fed. Reply
Blaster1618 - Saturday, October 08, 2011 - linkThank you for such a clear and thorough response. Reply
MonkeyPaw - Friday, October 07, 2011 - linkIsn't it amazing how these low-power architectures are surpassing Atom in both power and performance? Atom isn't even an OoO architecture. Windows 8 and OS X Lion will be allow these architectures in netbooks and ultrabooks before we know it, and Intel's value-stripping at the low-end will finally die a terrible death. Reply
partylikeits1999 - Saturday, October 08, 2011 - linkIntel will be in very big trouble unless FinFet can get Atom's power down in the same sub 4W range as this next round of quad core chipsets from nVidia, Qualcomm and TI. Reply
Wilco1 - Saturday, October 08, 2011 - linkEven with FinFet it's impossible Atom will run at 4GHz which it needs to get comparable performance as an A15 or Krait at 2.5GHz. And in less than 2W. Atom has been dead in the water for a while now - it cannot keep up with ARM out-of-order cores on performance, power consumption or integration despite Intel's process advantage. Reply
Tomasthanes - Friday, October 07, 2011 - linkYes, I could go to Google. It's just better journalism to define acronyms (even common ones) as you use them. Reply
Baron Fel - Friday, October 07, 2011 - linksystem on a chip. At this point for Anand it would be like writing CPU as central processing unit. Reply
bjacobson - Saturday, October 08, 2011 - linksilly me been saying silicon on chip in my head all these years never stopped to think it through >.< Reply
bjacobson - Friday, October 07, 2011 - linkvery exciting. Soon I won't have any need of a dedicated desktop except for gaming or a laptop except for business. Reply
Zingam - Saturday, October 08, 2011 - linkSo you basically need a desktop and a laptop? Reply
Zingam - Saturday, October 08, 2011 - linkAnd in that case you don't really need a tablet. Tablets would be very useful if they could deliver some kind of alternative user input and display. For instance: holographic displays (like in sci-fi movies) and voice control and input. That would actually make these mobile devices truly useful. The current generation and the coming generations would be nothing more than mobile browser and mp3/mp4 player. Reply
FunBunny2 - Saturday, October 08, 2011 - linkAnd, if it could work at all, how well would voice control work outside of an anechoic chamber (with a lone user talking to it)? But, I agree, tablets (used for decades in warehouses, by the way) will soft keyboards and the like are just a cheap and dirty way around the I/O issue. Reply
bjacobson - Saturday, October 08, 2011 - linkwow not sure what happened there.
What I mean is we'll get a quad core phone with 4GB of RAM and all we'll need is a tablet to dock it to. The tablet will have the other connectivity options-- HDMI, USB, etc which will let the non-gamers replace their desktops and the people not needing Windows for business, replace their laptops. Reply
dagamer34 - Saturday, October 08, 2011 - linkThe dedicated gaming desktop will largely be obsolete in a few years. Games are much more GPU dependent than CPU dependent. What we will see is the era of external graphics cards which you can hook up to your laptop to play on your monitor @ 1080p with all the special effects turned up. Then you "undock" and rely on the integrated GPU to get longer battery life.
Best of both worlds! Reply
Death666Angel - Friday, October 07, 2011 - linkThanks for the write up, pretty interesting stuff to come next year. Hopefully developers will embrace the new power, so that I can make fuller use of my Galaxy S2. I don't think I'll upgrade that soon though, pretty content with Galaxy S2 and it was expensive enough for now. I'll see what Christmas 2012 brings. :D Reply
cnxsoft - Friday, October 07, 2011 - linkBack in February, Qualcomm also announced the quad-core Snapdragon APQ8064 would be ready in 2012. Any news on that ? Reply
HighTech4US - Friday, October 07, 2011 - linkNvidia's roadmap clearly shows Kal-El+ as mid 2012 and 28nm Wayne at the end of 2012
http://www.androidcentral.com/nvidias-tegra-roadma... Reply
BoyBawang - Saturday, October 08, 2011 - linkDoes it mean all Krait cores will be manufactured in LP like the Companion CPU of Kal-EL for energy efficiency that's why it won't go beyond 2ghz even at 28mm? Reply
skydrome1 - Saturday, October 08, 2011 - linkI know this article's on the Krait architecture, but in your comparison of the 2011/2012 SoC roadmap, I think you left out one very promising competitor: the ST Ericsson Nova A9600.
Could this be included? And will there be any updates on this upcoming SoC?
On the whole, the 2012 roadmap looks really good. But I personally am looking forward to PowerVR's Series 6, the Cortex A15 MP and NVIDIA's Wayne the most. Reply
Zingam - Saturday, October 08, 2011 - linkHollyday season 2013 Reply
skydrome1 - Monday, October 10, 2011 - linkI'm pretty sure they said it would sample by the end of this year and ship late 2012. If they were to delay it any more, they would be in serious trouble. ST Ericsson has quite a lot against them recently, and if they can't keep to their promises, TI is going to beat them quite badly. I'd estimate the Rogue to show up in an OMAP 5 in H2 2012 or H1 2013.
All in all I'm just really excited by the PowerVR Rogue. Seeing the specifications of the Nova A9600 and what the Rogue can do is quite amazing. It's almost on par with the PS3.
Could an article on that be done once information is available?
I would love to have a portable gaming console :) Reply
Haserath - Saturday, October 08, 2011 - linkMetafor is right about the curve having to do with the process. His explanation kinda makes it seem like a temp increase causes the power increase though. It's the power increase that causes the temp increase, and "G" transistors are designed to handle more power without wasted heat(temperature increase) compared to "LP" transistors. There's also a second reason why 28nm is hotter than 40nm.
If you have a certain amount of heat energy being produced at a certain power level, the 40nm transistors will be a certain temperature.
Now take that same amount of heat energy being produced, and shrink the transistors to half their size. This increases their temperature within the same power envelope.
Of course they labeled a thermal limit on the power side, because the holder of whatever phone this chip goes into is going to feel the heat coming from the chip due to how much power it's using(how much heat energy is put out), not just due to the temperature of the transistors. Reply
ViRGE - Saturday, October 08, 2011 - linkThe graph is conceptually correct. While it's true that consuming more power produces more heat, the inverse is also true. The temperature of a transistor affects its leakage characteristics because resistance increases with heat. So at higher temperatures a CPU is going to consume more power to maintain its performance, compared to the same CPU at a lower temperature.
You're basically looking at the principles of a superconductor applied in reverse. Reply
JohnWH - Saturday, October 08, 2011 - linkThe number of MADs per 4 way SIMD is 4 not 8 as stated (plus 1 for scalar channel), so total flops per clock is (4+1) * 2 * 8 = 80 flops/clock or 16GFLOPs/s @ 200MHz and 24GFlops/s @ 300MHz. Reply
Zingam - Saturday, October 08, 2011 - linkAccording to this article we'll have to wait for at least another 3 years or maybe more until we get tablets with enough power and good battery life that would be actually useful.
Yeah, maybe at 14nm and with tri-gate transistors somewhen in 2016 we'll be able to enjoy true mobile computing all day long (at least 16 hours without a recharge).
Yeah, progress is good but way to slow sometimes. Too bad I was hoping for a ultracool and powerful e-book reader that delivers more tablet like experience rather than what currently is available. Reply
dagamer34 - Saturday, October 08, 2011 - linkDefine "useful". I'd argue that a lot of CPU cycles are wasted doing meaningless background tasks in apps that you can't see when it would be better to just pause and resume them later when the user brings them back into focus (aka Windows 8). Reply
bengildenstein - Saturday, October 08, 2011 - linkI'm trying to post a relevant comment but it's being flagged as spam. Can anyone offer any insight into why this may be the case? Reply
bengildenstein - Saturday, October 08, 2011 - linkThe post centers around a siggraph 2011 talk that touches on Adreno 205's fragment shader performance.
The gist is that the Adreno 205 (xperia play) showed faster performance with complex shaders than the SGX543MP2 (ipad2).
It seems I cannot post a link to the paper, but you can find it titled "Fast Mobile Shaders" at: aras-p [dot] info Reply
Ryan Smith - Saturday, October 08, 2011 - linkThe spam filter is pretty aggressive against links.
http://www.aras-p.info/texts/files/FastMobileShade... Reply
s44 - Saturday, October 08, 2011 - linkYou sure it's the same Mali? I couldn't find it specified in any of Samsung's press releases. Reply
Blaster1618 - Saturday, October 08, 2011 - linkWhile Single instruction multiple data whether short or long vector is a great idea, sadly under utilized except in graphics processing, compressible signals and cryptography. Does the NEON technology just an additional graphics/compression engine? Does it require special Neon programming/compiling or does it enhance normal MIMD programming? Reply
happy medium - Sunday, October 09, 2011 - linkI thought the new tegra 3 was 5 cores? Reply
ET - Monday, October 10, 2011 - linkThanks to Anandtech for covering mobile chips. I find it pretty exciting to read about these low power combinations of CPU and GPU. Reply
tech360 - Monday, October 10, 2011 - linkExcellent analysis. I guess x86 will have an uphill battle against ARM for years in bridging the gap in low power.
Just wondering what are your thoughts on the integrated WiFi/GPS/BT/FM in S4? Does it have potential to integrate away the currently separate combo-chips?
Thanks. Reply
The0ne - Monday, October 10, 2011 - linkI'm a fan of efficient coding and design and hope that Qualcomm is following that path. I think there's been too much "just get it done no matter what" in the programming business for far too long. That's not to say there aren't very good free open source apps out there by astounding programmers but the mainstream seems to have forgotten or don't care.
This is good news because mobile is still in the early phases and if efficiency is priority things can only get better if not easier to debug, code, change, etc.
The bad is of course increasing speeds, any speeds like in the PC industry of yester-years. Sure we want more powerful hardware but lets not make it because of shotty code and design architectures. Again, in the mobile industry I believe these two points should be highly consider by anyone. Reply
broccauley - Monday, October 10, 2011 - linkYou need to add the ST-Ericsson Thor / NovaThor series of SoCs to your table.
Also, of the SoCs in your table only the Qualcomm ones are true telecom SoCs - the others are mere application engines without telecom features. Reply
ssiu - Tuesday, October 11, 2011 - linkNothing about Apple A6? (I guess reliable info is hard to come by, but surely it would be out by December 2010 and should be included in the comparison table?) Reply
ssiu - Tuesday, October 11, 2011 - link... December 2012 (where is the Edit button ...) Reply
sarge78 - Wednesday, October 12, 2011 - linkYou could add the ZiiLabs ZMS-20 (and quad core ZMS-40) to the table. That'll probably see action in a Creative Android tablet/PMP and other OEMs might pick up the Jaguar reference tablet. (Could make a good review piece?)
Or how about Marvell's 628 ARMADA tri-core SoC? Marvell are getting pushed out by Qualcomm but it could get some design wins next year (It has two 1.5GHz cores and a low power 624 MHz core, similar to Tegra 3)
http://www.marvell.com/company/news/pressDetail.do... Reply
lancedal - Thursday, October 13, 2011 - linkWouldn't the use of L0 impact performance?
If L1 is shut-down, there will be penalty on a L0 miss. Powering up L1 on a L0 miss would cost thousand of cycles at 1.5GHz.
If L1 is on, then what is the point? Reply
Hunt3rj2 - Saturday, October 22, 2011 - linkHopefully Qualcomm amps up their SoC to 2 GHz levels to stay competitive with Cortex A15.
Qualcomm has a track record of starting strong, but then they just sputter out and can't keep up with the reference ARM Cortex SoCs. Reply
SydneyBlue120d - Sunday, October 23, 2011 - linkHi, thanks for your great article.
You may want to add to the list the Samsung Exynos 5250, that should be the A15 version of the Exynos SOC, running ARM Mali-T604 GPU, don't know if single or multicore. Let's hope it will be used in Samsung Galaxy S3 :) Reply
ilkhan - Sunday, November 06, 2011 - linkAny thoughts on when we'll see Krait/Adreno3xx SoCs in the hands of consumers? Holiday 2012 or will it be later than that?
Holiday 2012 would make it ideal for the next Nexus SoC. Reply
shaky153 - Monday, December 12, 2011 - linkHey guys, Im a dev from xda forum
recently new adreno drivers have been tested and improve 3d performance by 50%, so things are looking very good for the new gpu, itll perform much better than current devices Reply
french toast - Monday, December 12, 2011 - linkre shaky153.
''Hey guys, Im a dev from xda forum
recently new adreno drivers have been tested and improve 3d performance by 50%, so things are looking very good for the new gpu, itll perform much better than current devices ''
Brilliant, so does that mean that the adreno gpus do have a lot of underutilised power as anand attested in this article?... if so will the adreno 220 get much closer to the a5 in benchmarks? (taking into consideration we dont know a5 gpu clocks and 2x tmu's)
A reply would be appreciated. Reply
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Thank you in advance. Reply


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Spearheading a rally of more than 2,000 general aviation workers in Wichita in March, Transportation Secretary Ray LaHood lauded the importance of general aviation manufacturing to the state of Kansas and the U.S. industrial base, and promised a visit to "the air capital of the world" from the President next year.
"The general aviation industry already supports 1.2 million jobs across America and contributes more than $150 billion to the nation's economy," LaHood said. "And I believe the industry's efforts are crucial to President Obama's goal of doubling exports within five years–just as they're essential to keeping America on a trajectory toward economic recovery."
And although the event in a Cessna Aircraft hangar was rife with federal, state and local politicians, it was General Aviation Manufacturers Association (GAMA) president and CEO Pete Bunce who elicited the loudest cheers when he told the crowd, "The only very important people in here today are you. This rally is about you."
Cessna president, CEO and chairman Jack Pelton echoed that thought, when he noted, "The secretary came here not to see our buildings or our machinery, but to see our workforce that is the envy of the world."
Pointing to the enormous overhead banners reading "Kansas is #1 in U.S. General Aviation Exports" and "General Aviation Equals Kansas Jobs", the Cessna chief explained why the messages were facing that way: so the secretary can see the message the industry wants carried back to Washington.
Even following two years of plunging sales and shriveling backlogs, exacerbated by workforce cuts numbering in the thousands, GA still generates one of the few positive trade balances of any U.S. industry. "Even in a down cycle, you still create $4.9 billion in exports," said LaHood. "That's extraordinary. We are in your debt for the very professional way you do what you do."
David Coleal, v-p and general manager of Bombardier Learjet, continued the former Congressman's theme, noting that 60 percent of the billings for GA aircraft manufactured in 2010 were for exported aircraft.
Bill Brown, executive v-p of Hawker Beechcraft, added that the industry creates 1.2 million jobs with a combined payroll of $53 billion; 17,000 aviation employees alone live in Kansas. And 40 percent of the world's GA aircraft are produced in Wichita, which refers to itself as the air capital of the world.
Kansas Gov. Sam Brownback urged the Washington legislators in attendance to support fair trade laws and to ensure a fair playing field for GA manufacturers. "I'm not going to…stand around and let China or Germany or any other country take over the United States' position as a global leader," the former U.S. senator said. "We'll compete against anybody on a level playing field."
"For America to compete and win in the 21st century's global economy, our businesses need to out-innovate and out-build the rest of the world," LaHood acknowledged. "That's exactly what is happening here in Wichita, where thousands of aviation workers are designing the next generation of aircraft."
In conclusion, Bunce said, "The Kansas rally today served as a tremendous opportunity to showcase our industry to the Administration. This industry is an economic engine of growth and needs to be promoted and nurtured by our elected officials at every opportunity." o