text:
National Australia Bank's head of retail banking Gavin Slater says "competition for us has never been more intense", but he insists that NAB will not move up the risk curve to lift market share.
"Consumers are spoiled for choice around price," he said. "I think from a risk point of view though, we are very comfortable with where we are because you do need to look through the cycle, and I wouldn't want to grow market share today and then be regretting that in a few years' time because of poor risk decisions."
Mr Slater made the comment in an interview last week before Australian Prudential Regulation Authority chairman Wayne Byres was asked about competitive dynamics among the big banks after a speech in Sydney on Friday.
"We are watching [lending standards] very, very carefully, and stress testing is one of the many things we are doing at present to focus on this," Mr Byres said, speaking of the sector generally.
"It is very rare for a bank to assume our management is the most reckless or most aggressive - but someone always is. The Council of Financial Regulators is watching very carefully lending standards at present. We have expressed our concerns."
Mr Byres said on Friday that all banks aspired to grow at above system and the regulator was focused on how banks respond when they are not achieving targets. "The danger is, of course, someone says the only way I can do that is subtly turn up the risk dial and take away some of my good underwriting standards to achieve that. That is at the heart of what we are watching for at present."
In the month of September, NAB grew its market share in mortgages at 1.23 times system, delivering it a 15.45 per cent of the market. Mr Slater said expanding risk appetite is not part of NAB's strategy to grow market share. He pointed to interest-only loans for inner city apartment developments as not forming a significant part of NAB's lending activity "because I look at that and say the prices look toppish, and you look to the future and ask where's the capital growth going to come from? We are mindful of that and are building a buffer."
NAB's recent stress tests had made some "pretty radical assumptions" with double-digit inflation, interest rates and unemployment and determined NAB is at appropriate levels of capital, he said. "I believe we are, NAB and the industry, well capitalised."
Nevertheless, Mr Slater reckons David Murray's inquiry will lift capital and he said NAB is ready to react. "I think the general consensus is it's inevitable that something regarding additional capital will come out of the Murray inquiry and I guess our view is we'll kind of wait to see exactly what form that takes and then we'll respond."
On the prospect of new macro-prudential tools being wheeled out to put a lid on property prices in Sydney and Melbourne, Mr Slater said: "Our take [on new macro-prudential tools] is I think it's healthy to continue to challenge and be open to different forms of action, and then as it plays out, we'll respond as we need to."
The introduction by NAB chief executive Andrew Thorburn of new incentive structures based on Bain & Co's "net promoter score", had increased the focus on customer satisfaction, he said. (NAB is currently ranked third out of the big four on the Roy Morgan survey). "We're setting a higher standard around how the whole organisation orientates towards our customers".
Mr Slater said NAB will also chase more mortgages through the broker market, where close to 50 per cent of mortgages now originate, as NAB benefits from the rebranding of HomeSide to NAB and the introduction of a new trailing commission. "We're participating in [the broker market] actively, and that's where a lot of our out-performance is coming from," Mr Slater said.
NAB was continuing to recruit brokers to its Plan, Choice and Fast platforms and will push more "white label" mortgage products through its brokers, he said.


text:
What is JotForm?
JotForm is a free online form builder which helps you create online forms without writing a single line of code. No sign-up required.
At JotForm, we want to make sure that you're getting the online form builder help that you need. Our friendly customer support team is available 24/7.
We believe that if one user has a question, there could be more users who may have the same question. This is why many of our support forum threads are public and available to be searched and viewed. If you'd like help immediately, feel free to search for a similar question, or submit your question or concern.
Coupon field not showing up on mobile devices (iPhone)Asked by dallisonlee on April 04, 2014 at 02:23 PM
Hi there,
I have a form with a coupon code field that only shows up on tablets and desktop...but not on mobile (iPhone). Note: the form shows up just fine ... it's the coupon field that's missing. "My products" is visible, but that's it.
Advice for how I can fix this?
Thanks for your help!
I was able to reproduce the issue. It seems that the height of the form is not enough that's why the products and the coupon code fields do not appear. So, to resolve that issue please try changing the "Scrolling" attribute of the iframe code from no to yes. This is just an example:
<iframe allowtransparency="true" src="//form.jotformeu.com/form/2288772660123456frameborder="0" style="width:100%; height:4740px; border:none;" scrolling="yes"></iframe>
I hope this helpsl. Please inform us if you need further assistance with this inquiry.

subset: commoncrawl


text:
On Saturday, the Wyoming Cowboys, tied for the lead in the Mountain Division of the Mountain West Conference, will host the San Diego State Aztecs, who have clinched the West Division of the MW. Saturday's match-up of Wyoming and San Diego State will feature the No. 1 ranked scoring offense in the Mountain West against the No. 1 scoring defense. Wyoming leads the league and ranks No. 17 in the nation in scoring offense, averaging 38.9 points per game. San Diego State leads the league and ranks No. 7 in the nation in scoring defense, allowing opponents only 15.2 points per game.
Saturday's game is scheduled to kick off at 1:30 p.m., M.T. and tickets are still available. Fans may purchase tickets online at GoWyo.com/tickets, by emailing firstname.lastname@example.com, by calling (307) 766-7220 or by stopping by the UW Athletics Ticket Office on the west side of the Arena-Auditorium during the week or purchasing them on the east side of War Memorial Stadium on game day.
The Cowboys enter the game 7-3 overall and 5-1 in the MW and are tied with Boise State and New Mexico for the Mountain Division lead. The Aztecs are 9-1 and 6-0 in the MW and have already earned a spot in the 2016 MW Championship Game.
Wyoming will face its second Top 25 ranked opponent of 2016 in San Diego State. Wyoming is 1-0 this season versus Top 25 ranked teams having defeated then No. 13 ranked Boise State, 30-28, in Laramie on Oct. 29. SDSU broke into the Top 25 this week at No. 24 in the Associated Press poll and No. 25 in the Amway Coaches poll.
SDSU and Wyoming will be playing for the 36th time in history. It has been an extremely close series with the Cowboys holding a one-game advantage with 18 wins to 17 wins for San Diego State. The Aztecs have won the last two meetings in 2015 (38-3) and in 2012 (42-28). The last 10 games between the two longtime conference opponents have been split evenly at five wins each.
Wyoming and San Diego State share four common opponents this season. Both UW and SDSU defeated Northern Illinois, Nevada and Utah State. The Aztecs also defeated UNLV, while Wyoming fell to the Rebels 66-69 in triple overtime last Saturday.
Fans will have an opportunity to watch two of the nation's premier running backs on Saturday. Wyoming's Brian Hill and SDSU's Donnel Pumphrey are ranked No. 3 and No. 1 in the nation in total rushing yards entering this week. Hill ranks No. 3 in the nation in total rushing yards, with 1,417 yards for the 2016 season. Pumphrey is No. 1 in the nation in total rushing yards (1,779).
Hill has rushed for 1,417 yards this season. He is 214 yards away from his own single-season school record of 1,631 yards that he set last season. Hill has rushed for 3,844 career yards. He ranks No. 3 in MW history in career rushing yards.
Pumphrey has 6,051 career rushing yards. He ranks No. 1 in Mountain West history, and is 346 yards away from tying the NCAA record for career rushing yards of 6,397 set by Ron Dayne of Wisconsin.
This season, Hill's 1,000-yard season marks only the 12th time in school history that a Cowboy has rushed for 1,000 yards.
A more balanced offense was something the Wyoming Cowboys were striving for entering the 2016 season, and through 10 games the Cowboy Offense couldn't be much more balanced. Wyoming is averaging 220.9 yards rushing and 222.2 yards passing per game for 443.1 yards of total offense per game.
The Wyoming Cowboys still control their own destiny in terms of capturing first place in the Mountain Division of the Mountain West Conference and earning a spot in the 2016 Mountain West Championship Game. There are various scenarios for Wyoming to win the Mountain Division. The simplest of those scenarios is Wyoming will capture the Mountain Division if it wins its remaining two regular-season games versus San Diego State on Saturday and at New Mexico on Saturday, Nov. 26.
The Cowboys don't, however, have to win both of their remaining games to win the division, depending on what Boise State and New Mexico do in the final two weeks of the regular season.
The Wyoming Cowboys have won their last six consecutive home games and captured seven of their last eight home games.
The last time the Cowboys won six consecutive home games began midway in the 2006 season through midway into the 2007 season.
The last time the Cowboys won seven consecutive home games were the last two home games of the 1997 season and first five home games of the '98 season.
Current Wyoming senior middle linebacker Lucas Wacha had a personal best 16 tackles versus UNLV last Saturday, to move into 10th place on the Wyoming career tackle list. Wacha enters this week with 317 career tackles. Among all active Football Bowl Subdivision (FBS) players, he currently ranks No. 9 in career tackles. He is averaging 8.1 tackles per game this season to rank No. 10 in the Mountain West and No. 72 in the nation.
Current Wyoming sophomore free safety Andrew Wingard enters this week with 99 tackles for the 2016 season. As a true freshman in 2015, Wingard made 122 tackles. That was the 15th best single-season total in school history, and made him the first freshman in Wyoming history to record 100 tackles in a single season. He now has a chance to become only the 12th player in school history to have 100 tackles in multiple seasons as a Cowboy. Those other 11 Cowboys to record multiple 100-tackle seasons include John Salley, FS, 1980, '81 and '82 and Jim Talich, LB, 1995, '96 and '97, who are the only two Cowboys to accomplish that in three different seasons. The other nine to post two 100-tackle seasons are: Brian Brown, LB, 1996 and '97; Al Duyn, S, 1972 and '73; Ken Fantetti, LB, 1977 and '78; Tyler Gottschalk, LB, 2002 and '03; Brian Hendricks, LB, 2009 and '11; Bruce Mowry, LB, 1983 and '84; Chris Prosinski, FS, 2009 and '10; Mike Schenbeck, LB, 1986 and '87; and Galand Thaxton, LB, 1986 and '87.
Wingard leads the Mountain West in tackles this season and ranks No. 14 in the nation, averaging 9.9 tackles per game. Among all active FBS players, he ranks No. 1 in the nation in career tackles per game, averaging 10.05 for his career, and he ranks No. 1 in the nation in solo tackles per game, averaging 6.36 for his career. His sophomore running mate at safety, Marcus Epps, ranks No. 14 among active FBS players in career tackles (7.76 per game) and ranks No. 5 in career solo tackles (5.33 per game).
Saturday will mark the final regular-season home game for a great group of seniors, who have helped bring Cowboy Football back to contention in the Mountain West Conference. The seniors will be recognized on the field prior to the start of the game.
The Wyoming-San Diego State game will be televised live on CBS College Sports Network, and will be broadcast live on radio over the 25 affiliate stations of the Cowboy Sports Network. The radio broadcast will begin one hour prior to kick off.


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Sesame Salmon with Shiitake Mushrooms and Pea Shoots
A combination of ginger, soy sauce, and sesame oil creates a flavor that's reminiscent of teriyaki sauce but more delicious and nuanced.
- Prep:
- Total Time:
- Servings: 4
Source: Martha Stewart Living, March 2011
- 2 tablespoons reduced-sodium soy sauce
- 1 tablespoon plus 1 teaspoon finely grated peeled fresh ginger
- 1 tablespoon plus 1 teaspoon fresh lemon juice
- 4 cups thinly sliced shiitake mushrooms (8 ounces)
- 4 boneless, skinless salmon fillets, preferably wild sockeye (5 ounces each; 1 inch thick)
- Coarse salt
- 2 teaspoons toasted-sesame oil
- 1 teaspoon black sesame seeds
- 1 1/3 cups fresh pea shoots (2 ounces)
Preheat oven to 400 degrees. Cut out four 12-by-17-inch pieces of parchment; fold each in half crosswise to form a crease, then open.
Combine soy sauce, ginger, and lemon juice, and toss with mushrooms. Divide evenly among 4 parchment pieces, arranging mixture on 1 side of each crease. Lay 1 salmon fillet on top of each pile. Season each with 1/8 teaspoon salt and the sesame oil. Fold parchment over ingredients; make overlapping pleats to seal.
Bake on 2 baking sheets (2 packets per sheet) for 10 to 11 minutes for medium-rare or 12 minutes for medium. Unwrap; sprinkle with sesame seeds. Top with pea shoots.
Reviews Add a comment
Juliehocherman27 MAR, 2014I just made this for husband and me. Wow it was so good and so easy. I already had all the ingredients. I added some zucchini, and rice as well on the side.Reply
WeekendCarnival25 JUL, 2012Recipe very good - husband was very satisfied with the dish. I used regular sesame seeds because I didn't have black sesame. Used a squirt of lemon to brighten up the dish after cooking.Reply
BluMysteriousEys3 JAN, 2012YUM this was very very good. Left out the pea shoots, just didn't have any. Served with Brown rice and sauteed zucchini.Reply


text:
Disclaimer: I don't own No. 6 or any of the characters. I only own the two doctors, Mr. Koth and the children of Shion and Nezumi, not Chibi Shion.
Author Note: This is my first FanFiction story. I changed the ending from the original story to fit my story plot. The characters may start becoming OOC. Sorry for any grammar and/or spelling mistakes. This is the last chapter sorry for the late update.
Warning: Boy/Boy so don't like don't read.
Epilogue –Five Years Later-
Nezumi looked out the school window where he currently worked at. There was a festival going on and the students where all over the place. He knew that his children were most likey causing trouble. He sighed and noticed outside, a white hair child in a tree. Nezumi opened the window and yelled.
"Shizumi, how times do we have to tell you not to climb trees?"
"But I wanted a good view from up here." She flashed a smile like Shion's. She still wore his scarf and he never asked for it back. Her hair was down to her mid-back but kept it in a ponytail.
"Well get down before you get in trouble with your teachers, again." He said and she climb down, "You better no have ruined your dress for your class project." He watched her climb down and head for the gym. Nezumi sighed and headed down to the ground floor.
There were stands on the playground where kids sold things that they made during class. He walked around until he got to a food stand that Chibi was working at. Nezumi smiled and walked over to him. Chibi grew taller in the five years and looked like Shion when he first saw him.
"Hey Nezumi." Chibi said and then handed him five take-out containers of the food they were serving in a bag. Nezumi gave him the money and smiled at him.
"Hey Chibi, make sure you and your sister eat something later okay?" He said and then he left without hearing an answer since he knew that Chibi would do as he asked. He walked towards the grade school area. He walked trough some halls and got to the third grade rooms. He entered one only to be attacked you two smaller bodies.
"Dad, did you bring lunch?" A boy with brown hair and eyes looked up at him.
"Dad, did you see our work that we made in class?" A girl with brown hair, in two ponytails, and brown eyes questioned.
"Shin, Saki did you clean up?" He asked and they both nodded. He then handed them two of the five containers. If he didn't know any better, the both of them could have passed of as identical twins instead of fraternal. The only thing that was really different about them was their gender. They also both inherited how Shion looked before he had the wasp inside of him, which made Karen happy.
Of course Saki had inherited Nezumi's talent in acting and could get out of anything with her charm. Shin got Shion's ability to daydream and remember anything told to him. Teachers often scolded him but they could never really punish him if he got good grades on his tests.
They walked over to a shady spot underneath a tree. Karen, Rikiga and InuKashi, who came with one dog, who looked like Aoi's mother. Karen was holding a toddler in her arms, reading a simple book. The toddler had Nezumi's hair color and red eyes like Shion.
"William has be a good boy while papa was gone." Karen said. William gave a smile at him and Nezumi set the food down. He then picked up his youngest child and held him close.
"That's good. At least one of them will be well-behaved." Nezumi joked and then felt a rolled up paper hit the back of his head.
"Daddy!" William smiled at the figure behind Nezumi.
After the birth of the twins, Nezumi was worried about having more children due to Shion allergic reaction to one of the medications they gave him during the surgery. The medicine that was supposed to take some pain away had almost killed him.
William birth was a lot easier with not complications to worry about. Shion opted out on the painkillers, which made Nezumi happy. During his pregnancy with William he wanted lots of sweets and Nezumi had to limit on how much he ate. He didn't eat anything sour and the rest of the children waited patiently for their new sibling. They even made bets on which gender it was going to be. Shizumi was the only one that one.
"All of our kids turned out pretty well, if I do say so myself." Shion glared at him. "I just got word from Shizumi's teacher on what she wants to be when she grows up. You know the paper Shion and her had to write. Well Shion said he wanted to be a veterinarian. Shizumi on the other hand wrote in her paper that she wants to be the ruler of No. 6." Nezumi burst out laughing at this and Karen chuckled.
"Sounds like the kid made a big job for herself." InuKashi said taking a bite of food. "You put to much influence on them Nezumi. Calling them 'Your Highnesses.'"
"I don't want to hear this form a person who still will not reveal their gender." Nezumi shot back. The dog next to InuKashi growled low, but Shion spoke up.
"Anyway her other goal is to become a writer. I am hoping she will be more drawn to that. "Besides I wouldn't call William well-behaved as well. He sleeps in class and still gets good grades."
"Well. All of our kids are unique." Nezumi said, "I got you some lunch." He handed Shion one of the trays he got from Chibi Shion. "I got to say that Chibi is improving on his cooking as well."
"Well he hangs out with his grandma al the time so he is bound to pick up something's." Karen smiled. "I am planning on teaching him how to make some deserts next."
"Oh, before I forget. Our daughter was up in a tree again." Nezumi added and Shion sighed.
"Why is so she intent on climbing trees? The teachers have to yell at her not to do that on her breaks." He said.
After lunch, they walked around the school. William had a blast with all the games they had. He won a goldfish from one of the games that Shion held so it wouldn't get dropped.
It was evening when things started to get quiet. Karen, Rikage and InuKashi had to leave first but the promised to visit soon. Nezumi was holding a sleeping William in his arms and they waited for their kids. First to come was the twins, who each were holding some sort of food. Next was Chibi Shion, who was still wearing his work clothes. They waited five minutes and then they looked for Shizumi.
They found her on the school roof, looking out onto the scenery of the west block. She was not wearing the dress she had on earlier and she was in her normal clothes with Cravat, Tsukiyo and Hamlet. She was holding was looked like a notebook.
"What would No. 6 be like if you dad and papa hadn't fixed it?" She asked and turned to face her family. "I decided to write a book about what happened since the two of you met." She handed the notebook to Shion who opened it.
"It all started when my parents first saw each other on my dad's twelfth birthday during a hurricane …" He started to read.
Authors Note: I am again sorry for the late update. I got writers block and then into a slump since I lost my job. This is planned last chapter and I may start working on another story for Katekyo Hitman Reborn. Not 100% sure on that but it will be a few chapters in before I post anything on FanFiction. Plus my Internet on this computer doesn't like to stay connected Thank you very much for all the reviews, followers, and favorites among others.
For anyone who wants to read the novel, which is finished at
. . I read this and I noticed the manga is more based on this then the anime and I did not help at translating of that work.


text:
|Publication number
|Publication type
|Application number
|Publication date
|Aug 5, 1986
|Filing date
|May 10, 1984
|Priority date
|Jun 9, 1983
|Fee status
|Also published as
|Publication number
|Michael A. De Luca, John F. McCormack
|Original Assignee
|Kollmorgen Technologies Corporation
|Export Citation
|BiBTeX, EndNote, RefMan
|Patent Citations (20), Non-Patent Citations (6), Referenced by (43), Classifications (41), Legal Events (8)
|External Links: USPTO, USPTO Assignment, Espacenet
This application is a continuation-in-part of U.S. application, Ser. No. 502,748 filed June 9, 1983, now abandoned.
1. Field of the Invention
This invention relates to metallized ceramic articles and to a metallized conductor pattern directly and adherently bonded onto a surface of a ceramic substrate, and an improved process for producing the same. More particularly, this invention relates to a printed circuit pattern directly and adherently bonded onto a surface of a ceramic substrate, and an improved process for producing the same employing material in solution to promote adsorption of a catalyst for metal deposition.
2. Description of the Prior Art
Metallized conductor patterns on ceramic substrates have been widely used in the electronic industry. For many years, ceramics have been metallized by high cost processes such as fused metal-glass pastes and thin film vacuum deposition techniques. Attempts to reproducibly make circuit patterns by direct electroless deposition have not been successful due to poor adhesion of the metal films to the substrate and non-reproducible and non-uniform surface coverage.
Printed circuits on ceramics, including alumina, were described as early as 1947. See "Printed Circuit Techniques", National Bureau of Standards, Circular 468 (1947) and National Bureau of Standards, Misc. Pub. 192 (1948). One type, known as a thin film circuit, consists of a thin film of metal deposited on a ceramic substrate by one of the vacuum plating techniques. In these techniques, a chromium or molybdenum film, having a thickness of about 0.02 microns, acts as a bonding agent for copper or gold conductors. Photolithography is used to produce high resolution patterns etched from the thin metal film. Such conductive patterns may be electroplated up to 7 microns thick. Due to their high cost, thin film circuits have been limited to specialized applications such as high frequency applications and military applications where a high pattern resolution is vital.
Another type of printed circuit, known as a thick film circuit, consists of a metal and glass film fired on a ceramic substrate. Typically, the film has a thickness of about 15 microns. Thick film circuits have been widely used. Thick films are produced by screen printing in a circuit pattern with a paste containing a conductive metal powder and a glass frit in an organic carrier. After printing, the ceramic parts are fired in a furnace to burn off the carrier and sinter the conductive metal particles and fuse the glass, thereby forming glass-metal particle conductors. These conductors are firmly bonded to the ceramic by the glass and thus components may be attached to the conductors by soldering, wire bonding and the like.
Conductors in thick film circuits have only 30-60 percent of the conductivity of the pure metal. The high conductivity of pure metal is needed to provide interconnections for high speed logic circuits. Because conductors in thick film circuits do not have such high conductivity, they do not provide optimum interconnections for high speed logic circuits.
The minimum conductor width and the minimum space between conductors which can be obtained by screen printing and firing under special high quality procedures is 125 and 200 microns, respectively. However, under normal production conditions, these minima are 200 and 250 microns, respectively. For ceramic circuits requiring higher interconnection density, i.e., higher connectivity, multilayer techniques are used.
In the thick film multilayer process, a first layer of metal powder and glass frit is printed on a ceramic substrate and fired, typically at 850� C, in a furnace. Then, an insulating dielectric layer is screened over the conductor pattern, leaving exposed only the points at which contact is made to the next layer of metallization. This dielectric pattern also is fired at 850� C. Then, a second dielectric layer is printed and fired. Two layers of dielectric must be printed and fired to ensure that there are no pinholes. After the two layers of dielectric have been printed and fired, the next conductor layer is printed and fired making contact to the lower conductor layer as necessary through the openings left in the dielectric layers.
Typical multilayer ceramic packages contain two to six layers of metallization. Eight layers are not uncommon. For two layers of metallization, the substrate will be printed four times and fired at 850� C. for four times. For three layers of metallization, the substrate will be repetitively printed and fired at 850� C. seven times, and for four layer, thick film, multilayer ceramic, ten times. By the processes of the present invention, the same connectivity as a three or four layer film multilayer ceramic can be achieved by a two-sided, plated through hole, conductor pattern.
Attempts have been made to directly bond pure metal conductors to ceramic substrates including alumina in order to achieve higher conductivity for ceramic based circuit patterns (see U.S. Pat. No. 3,744,120, to Burgess et al. and U.S. Pat. No. 3,766,634 to Babcock et al.). Solid State Technology 18/5, 42 (1975) and U.S. Pat. No. 3,994,430, to Cusano et al., disclose a method for bonding copper sheets to alumina by heating the copper in air to form an oxide film on its surface. The copper sheet then is bonded through this film to alumina at a temperature between 1065� C. and 1075� C. in a nitrogen furnace. In order to obtain well adhered copper foil without blisters: (1) the copper foil must be carefully oxidized to a block surface; (2) the copper oxide thickness must be carefully controlled; (3) the amount of oxygen in the copper foil must be controlled; (4) the oxygen content of the nitrogen furnace must be maintained at a controlled level to maintain a very moderately oxidizing atmosphere; and (5) the temperature must be controlled within one percent. This extreme high temperature operation is difficult and expensive to tool, to operate and to control. If the aforementioned extremely stringent controls are not maintained, blisters and other adhesion failures in the copper foil to subblisters are apparent. In spite of the difficult operating conditions, the process of Cusano et al. is being introduced into commercial application because of the need for the metallized product.
Although the above described systems are commercially used, the need for direct, simple metallization of ceramics with a pure metal conductor, such as copper, has prompted a continuous series of patents and proposed procosses. See for example Apfelbach et al., Deutsches Patentschrift (DPS) No. 2,004,133,; Jostan, DPS No. 2,453,192 and DPS No. 2,453,277; and Steiner DPS No. 2,533,524. See also U.S. Pat. No. 3,296,012 to Statnecker which disclosed a method of producing a microporous surface for electrolessly plating alumina. Attempts to simply apply electroless metallization directly to ceramic substrates, have continually been tried and never been commercially successful. Even such toxic and corrosive materials as hydrogen fluoride were tried to allow the direct bonding of electroless metal to ceramics without extreme firing temperatures, Ameen et al., J. Electrochem. Soc., 120, 1518 (1973). However, the hydrofluoric etch gave poor strength due to excessive attack on the surface of the ceramic.
Another attempt, disclosed in U.S. Pat. No. 3,690,921 to Elmore, involved the use of molten sodium hydroxide to first etch a ceramic surface before sensitizing the surface with stannous chloride sensitizer, activating the surface in palladium chloride, and electrolessly plating the surface. Although the sodium hydroxide etch provided a metal film circuit with good bond strength, nonetheless, it did not achieve commercial production. The problem was poor surface coverage by the electrolessly deposited metal. Although the metal deposit usually covered 90% of the surface area or even better, this was insufficient. Any imperfection in a metal film can result in an open circuit, that is, a complete operating failure, if the imperfection occurs in a fine line conductor pattern.
U.S. Pat. No. 4,428,986 to Schachameyer discloses a method for direct autocatalytic plating of a metal film on beryllia. The method comprises uniformly roughening the surface of the beryllia by immersing the beryllia in a 50% sodium hydroxide solution at 250� C. for 7 to 20 minutes, rinsing with water, etching the beryllia substrate with fluoroboric acid for 5 to 20 minutes, rinsing with water, immersing the beryllia in a solution of 5 g/l stannous chloride and 3N hydrochloric acid, rinsing with water, treating the beryllia with 0.1 g/l palladium chloride solution, rinsing with water, and then electrolessly plating nickel on the beryllia. However, the etching step removes the silica and magnesium from the grain boundaries of the beryllia, thereby weakening the beryllia surface. As a result, the method of Schachameyer was able to achieve only 250 psi (1.7 MPa) bond strength before the beryllia substrate broke. This bond strength is low, being approximately a third of the bond strength normal in thick film type circuits.
Other methods of forming printed circuit patterns on ceramic substrates are disclosed in U.S. Pat. Nos. 3,772,056, 3,772,078, 3,907,621, 3,925,578, 3,930,963, 3,959,547, 3,993,802 and 3,994,727. However, there is no teaching in these patents of how to solve the problem of poor surface coverage and inadequate bond strength to ceramic.
Ceramic packages have been widely used to protect microelectronic circuits such as integrated and hybrid circuits from contamination by the outside environment. A hermetic seal is required between the ceramic base of the package and its cover to exclude the outside environment. Heretofore hermetic seals have been provided by the following methods for ceramic dual-in-line packages utilized in the microelectronics industry. In one method, a refractory metal paste, usually moly-manganese, is applied to a ceramic base. The paste and the ceramic base are fired at 1500�-1800� C. in an inert or a reducing atmosphere in order to fuse the moly-manganese alloy to the ceramic surface. The refractory metal alloy then is plated with gold, or nickel and gold. A microelectronic circuit is inserted within a cavity of the ceramic base through an opening in the base. The microelectronic circuit is connected to feed throughs provided in the base. The opening in the ceramic base is hermetically sealed by covering it with a cover which is soldered in place around the periphery of the opening. Gold plated Kovar lids or ceramic lids provided with gold plated moly-manganese surfaces are used as covers. Soldering takes place in a nitrogen atmosphere using gold-tin solders or tin-silver-antimony solders. This process, while capable of producing good hermetic seals, is characterized by very high cost because of the difficulty of plating refractory metals and the very high firing temperatures.
Epoxy adhesives also have been used to provide seals between a ceramic package and a lid for the package. This method is unsatisfactory because organic vapors from the epoxy sealant may contaminate the microelectronic circuit.
Still another method of forming hermetic seals for a ceramic package is to use a low melting glass which is applied as a glass paste with a carrier solvent. The glass paste is applied to the sealing surface of the ceramic package and then is fused in a furnace. This method is unsatisfactory because it may seal solvents from the glass paste inside the package along with some of the glass itself. The high reliability of the circuit can be destroyed by contamination due to the solvent trapped in the glass interlayer.
An object of the present invention is to provide a method of applying a metal film to a ceramic substrate and obtaining excellent surface coverage and a bond strength of at least 3 MPa, preferably at least 5 MPa.
An object of the invention is to produce a metal plated ceramic substrate which may be used for fine line circuit applications with highly pure metal conductors.
An object of the invention is to provide an electrolessly deposited, direct bonded conductor having excellent adhesion to a ceramic substrate and a process for producing the metal coated ceramic substrate.
An object of the invention is to provide a plated ceramic substrate which has conductors suitable for interconnection for high speed logic circuits and a process for producing the plated substrate.
An object of the invention is to provide a two-sided plated ceramic substrate with a through hole conductor pattern and a conductor density comparable to a three or four layer thick film multilayer ceramic.
It is also an object of the invention to provide a method of joining ceramic articles or other metallized ceramics by soldering, brazing or welding.
An object of the invention is to provide a hermetic seal for ceramic articles.
Additional objects and advantages of the invention will be set forth in part in the description, or may be realized by practice of the invention, the objects and advantages being realized and attained by means of the methods, processes, instrumentalities and combinations particularly pointed out in the appended claims.
The present invention is directed to a method of producing metal films on ceramic substrates including alumina, which have excellent surface coverage and bond strength (i.e., at least 3 MPa preferably at least 5 MPa) as measured by the "dot pull test" described herein below. The present invention also includes ceramic substrates having printed circuit patterns formed from such films. The process of this invention may be used to treat ceramic substrates for electroless or electrolytic metal deposition. Metal deposits on the ceramic substrate are obtained having a thickness of a least 0.2 microns, preferrably at least 2 microns and conductor features typically with a width as low as 25 microns, preferably 50 microns.
The process of this invention comprises the steps of: (a) treating or adhesion promoting the surface of the ceramic with at least one molten inorganic compound; (b) contacting the adhesion promoted surface with a solution capable of promoting adsorption of catalyst on the treated surface; (c) sensitizing or catalyzing the treated surface for plating; and (d) depositing metal on the ceramic surface.
In another embodiment, the process of this invention also includes joining the metallized ceramic substrate to a metal or to another metallized ceramic substrate by soldering, brazing or welding.
Any metal film may be deposited on the surface of a ceramic substrate in accordance with the present invention. Typically, copper, nickel, silver or cobalt metal films are electrolessly deposited.
The ceramic surface first is treated at high temperature with a substance which will provide an etched surface necessary to create a strong bond between the metal layer deposited and the ceramic substrate. The preferred materials for this purpose are at least one alkali metal compound in the molten state. The preferred alkali metal compounds include sodium hydroxide, potassium hydroxide, sodium carbonate and potassium nitrate, and potassium hydrogen sulfate.
Suggested procedures for etching with molten alkali are described in U.S. Pat. No. 3,690,921 to Elmore and in Ameen et al., supra. Both of these disclosures described procedures in which sodium hydroxide is heated to a temperature of 450� C. Many alkali metal compounds are suitable for adhesion promotion, e.g., etching of ceramics. It is preferred to use compounds with lower melting points. Alternatively, the melting points of the alkali metal compound(s) may be depressed by dissolving up to about 50% by weight, preferably up to 20% by weight of low melting materials or even liquids in the alkali metal compound. Examples of such melting point depressants are believed to include stannous chloride, nitric acid, water, sodium and potassium formates, potassium acetate, Rochelle salts, borax, and the hydrates of lithium bromide, iodide and phosphate, and potassium pyrophosphate.
Sometimes, it may be preferable to avoid hydroxides for safety reasons and for ease of neutralization. Typical alkali metal compounds suitable for use in this invention and their melting points as reported in Lange's Handbook of Chemistry, Eleventh Edition (1972) are as follows:
______________________________________Melting Points �C.AnionAlkali HydrogenMetal Hydroxide Nitrate Carbonate Sulfate______________________________________Lithium 445 261 618 171Sodium 328 308 851 >315Potassium 360 334 891 214Rubidium 300 310 837 --Cesium 272 414 -- --______________________________________
Eutectic mixtures such as a mixture of potassium hydroxide and sodium hydroxide or a mixture of sodium carbonate and potassium nitrate also may be used to etch the substrate. The former type of mixture preferably has a percent by weight ratio of 59:41 of KOH to NaOH with a melting point of 170� C.
Typical of the ceramic substrates etched by the molten compounds employed herein are aluminas, silicates, beryllias, titanates, forsterite, mullite, steatite, porcelains and mixtures of the foregoing.
Typical of the metal deposition solutions used are electroless plating solutions such as nickel, cobalt, gold, and copper; see U.S. Pat. Nos. 3,485,643 and 3,607,317, 3,589,916 and the like. Electrolytic deposition solutions also may be used in the practice of this invention.
In the processes described by Elmore, sodium hydroxide is rinsed from the ceramic surface with water, and then the ceramic surface is neutralized with dilute sulfuric acid and rinsed again before sensitizing the surface with stannous chloride, rinsing and seeding with palladium chloride to catalyze for electroless metal plating.
These processes are unreliable and frequently result in incomplete surface coverage with electrolessly formed metal deposits. This condition is completely unsatisfactory for production. With prolonged immersion in both the stannous chloride sensitizer solution and the palladium chloride seeder solution as well as incomplete rinsing steps, it sometimes may be possible to get complete surface coverage with metal. These steps, however, are not practical in production. Prolonged immersion in the sensitizer prevents economical throughput of work, and incomplete rinsing after the stannous chloride leads to loosely adhering precipitate particles forming in the seeder and in the electroless plating solutions and to the rapid decomposition of these solutions.
The use of unitary catalyst solutions prepared from both stannous chloride and palladium chloride is well known in the printed circuit and plating-on-plastic arts. Typical catalyst solutions are in U.S. Pat. No. 4,187,198 to Zeblisky and U.S. Pat. No. 3,961,109 to Kremer et al. Such catalyst solutions may be advantageously used in plating on ceramics over the two step sensitizing and seeding solutions as described by Elmore.
Applicants have discovered that adsorption of the species rendering the surface receptive to metal deposition, i.e., sensitizer, seeder or catalysts, and eventually surface coverage of the metal deposit is greatly enhanced by treatment of the etched ceramic surface with a compound that is adsorbed on such ceramic surface and promotes adsorption of the sensitizing species over the whole surface, and surprisingly, provides complete coverage. Among the compounds that can be adsorbed and promote adsorption of the sensitizer are simple chlorides, bromides and iodides, and complexes of chloride bromides and iodides. The invention will be further illustrated by describing the use of acidic chloride, bromide and iodide solutions greater than 0.5 molar in the halide to promote uniform adsorption on ceramic surfaces. These acidic halide solutions do not attack the glassy phase of the ceramic substrate.
The acidic chloride, bromide or iodide solution can be used as a pretreatment or predip solution for the ceramic substrate after adhesion promotion, rinsing, neutralizing and rinsing again; and before treating with, e.g., stannous chloride sensitizer. It has been found that after such pretreatment sensitizer is quickly adsorbed on the etched ceramic substrate. Immersion in the sensitizing solution need not be unduly prolonged. In addition, the tin species is so securely adsorbed that it is not inadvertently removed in a conventional rinsing step.
The acidic chloride, bromide or iodide predip or pretreatment solution preferably is greater than 2 molar in halide ion, and more preferably is greater than 3 molar in halide ion. The acidity of the halide solution preferably is greater than 0.001 molar in hydrogen ion, more preferably is greater than 0.01 molar in hydrogen ion, and most preferrably between 0.1 and 12 molar in hydrogen ion.
Alternatively, applicants have found that the chloride, bromide, or iodide concentration of the sensitizer solution may be increased to accomplish the same desired effect, i.e, more strongly adsorbed sensitizer on the ceramic substrate. High acidity inhibits adsorption of tin sensitizers. The ratio of the halide to acid in a stannous ion sensitizer solution is preferably at least 15 to 1. It is possible to use halide to acid ratios as low as 2 to 1 but these are not preferred because higher tin concentrations, i.e., one molar tin are required.
Although we do not wish to be bound by theory, it is believed that in case of tin comprising solutions, the tin species which is adsorbed on the alumina is the tetrahalostannate (II) moiety. For example, high chloride ion concentration relative to acidity favors the formation of the tetrachlorostannate (II), while high acid concentration favor the formation of trichloro and dichloro stannate (II) complexes. See for example Stability Constants of Metal Ion Complexes, Spec. Pub. 17, Sillen and Martell, The Chemical Society, London (1964), pp. 296-7.
When using a unitary catalyst solution comprising a chloride, bromide or iodide of palladium, tin and the halide acid or alkali metal halide salt without an acidic halide predip solution, the halide concentration may be varied over a range from 0.5 to 6 moles per liter, preferably greater than 1.5 moles per liter and preferably less than 4 moles per liter. The acidity may be varied from 0.03 to 6 moles per liter, preferably greater than 0.3 moles per liter and preferably less than 4 moles per liter.
For greater processing latitude and to minimize processing errors, the acidic halide pretreatments may be halide and acid concentrations according to this invention.
Furthermore, the acidic halide predip also may be used with a unitary catalyst solution.
By using an acidic halide predip, other catalytic precious or semiprecious metals may be adsorbed onto the ceramic surface amongst which are the Group IA metals, silver and gold and the other Group VIII precious metals.
Numerous processes are employed in the manufacture of printed circuit boards. As will be understood by those skilled in the art, these printed circuit manufacturing processes may be used in conjunction with the adhesion promoting step of this invention and with the step of rendering the ceramic surface receptive to metallization, in order to produce metallized ceramic printed circuit boards.
According to this invention, there are produced articles and methods which provide a hermetic seal of a metal layer to a ceramic substrate. This invention provides a hermetically sealed ceramic package for microcircuits and other applications. Furthermore, the processes of this invention provide a method of applying an adherent metal film to a ceramic surface which film can be used to join metallized ceramic surfaces or to join metallized ceramic surfaces to metal articles by standard metal joining techniques such as soldering, brazing and welding.
By "hermetic seal" as used throughout this specification, is meant one which passes the fine leak tests of MIL-STD-883B, Method 1014.3 (May 16, 1979), incorporated herein by reference.
As will be well understood by those skilled in the art, these hermetic seals are suitable for hybrid packages, chip carriers, integrated circuit packages, flat packs, dual-in-line packages and optoelectronic packages. In forming a hermetic seal to a ceramic substrate by the processes of this invention, a surface of the ceramic substrate is first provided with a metal layer, by the procedures described above. The metal layer on the ceramic surface then is joined to a metal or to another metallized ceramic substrate by standard metal joining techniques, typically soldering.
Other modes of operating this invention are, inter alia, disclosed in the examples.
This example shows how a chloride or bromide containing predip gives uniform surface coverage.
Flat black ceramic substrates, 0.5 mm thick, containing 90% alumina (balance other oxides), were adhesion promoted by immersion in an alkaline cleaning solution (Altrex, commercially available from BASF-Wyandotte, Wyandotte, MI) for 10 minutes at a temperature of 60� C. The substrates then were water rinsed for 1 minute at 25� C., dipped in a solution of sodium hydroxide (760 g/l), removed, and allowed to drain. The resulting wet ceramic substrates were placed on edge in a support fixture. The substrates then were dried for 10 minutes at 175� C. to remove the water in the sodium hydroxide film on the substrate, followed by heating in a furnace for 15 minutes at 450� C. to fuse the sodium hydroxide and roughen and adhesion promote the surface. After cooling for 5 minutes, the ceramic substrates were rinsed in water, rinsed in 20% sulfuric acid at 25� C. for 2 minutes and subsequently rinsed in deionized water for 2 minutes at 25� C.
After this adhesion promotion procedure, the ceramic substrates were electrolessly plated with an adherent copper film by the following procedure.
(a) Immerse in a chloride or bromide predip solution as shown in Table I for 2 minutes at room temperature.
(b) Immerse for 10 minutes at room temperature in a sensitizer solution consisting of 59 grams of stannous chloride dissolved in a liter of 0.12 molar hydrochloric acid solution.
(c) Rinse in deionized water at room temperature.
(d) Immerse for 2 minutes at room temperature in a activator solution of 0.1 grams palladium chloride dissolved in a liter of 0.012 molar hydrochloric acid.
(e) Plate for 30 minutes at room temperature in an electroless copper bath consisting of:
______________________________________Copper sulfate 10 g/lEthylenediamine tetra- 17 g/l2-hydroxypropanolFormaldehyde 6 g/lBlock copolymer wetting agent 10 mg/lSodium cyanide 10 mg/lSodium hydroxide To pH 13______________________________________
The effect of the halide predip on the surface coverage of the ceramic substrate is shown in Table I.
TABLE I______________________________________Halide Predip Solution Surface coverage with Metal______________________________________ 1. None Unacceptable-some bare spots 2. 1.2 M HCl Unacceptable-some bare spots 3. 4 M HCl Complete metal film 4. 6 M HCl Complete metal film 5. 9 M HCl Complete metal film 6. 12 M HCl Complete metal film 7. 1 M NaCl Unacceptable-some bare spots pH < 1 8. 3.4 M NaCl Good-complete metal film pH < 1 9. 5 M NaBr Good-complete metal film pH < 110. 3.8 M NaCl Good-complete metal film 0.1 M HCl 0.25 M SnCl2______________________________________
Unacceptable coverage means a copper deposit with good color and adhesion but some skip plating or bare spots. Complete metal film means a copper film of good color and adhesion and complete coverage without bare spots or skip plating.
In all cases, even when there was incomplete surface coverage, adhesion of metal to the ceramic was excellent.
This example shows the effect of the pH of the halide predip solution.
The procedures of example I were repeated except that the halide predip solutions and the results obtained were as shown in Table II.
TABLE II______________________________________Halide Predip Solution Surface Coverage with Metal______________________________________1. 3.8 M NaCl Good-complete metal film pH < 12. 3.8 M NaCl Unacceptable-some bare spots pH = 53. 3.8 M NaCl Unacceptable-less than 75% coverage pH = 8______________________________________
The procedure of Example I was repeated except that the halide predip was eliminated, and the sensitizer solution in step (d) was modified by the addition of sodium chloride. The sensitizer solution was:
______________________________________stannous chloride 50 g/lhydrochloric acid 8 ml/lsodium chloride 180 g/l______________________________________
After plating the ceramic substrate in the electroless copper bath of Example 1, it had a complete copper film over the ceramic substrate which was free of voids or the like. Thus, by increasing chloride concentration in the sensitizer solution compared to Example I, complete coverage of the ceramic substrate with a copper film is achieved without the use of a separate halide predip solution step.
This example further illustrates the importance of the halide concentration in the pretreatment step of ceramic substrates before electroless plating.
The ceramic substrates were adhesion promoted by the procedures as in Example I.
A catalyst concentrate was prepared according to the procedure disclosed in U.S. Pat. No. 3,961,109 to Kremer et al. An aqueous solution comprising palladium chloride, stannous chloride, sodium chloride, hydrochloric acid and resorcinol was prepared and heated. After cooling, the solution was diluted with additional sodium chloride, stannous chloride and hydrochloric acid to obtain a standard concentrate catalyst solution. Thirty-one milliliters of this concentrate were diluted to one liter to obtain the working catalyst solutions. For a high chloride catalyst solution, the 31 ml of concentrate was diluted with a solution of 3.8 molar sodium chloride, 0.11 molar hydrochloric acid and 0.025 molar stannous chloride. For a low chloride catalyst solution, the 31 ml of concentrate was diluted with a 0.18 molar solution of sulfuric acid. Two catalyst solutions with intermediate chloride concentrations were prepared by diluting 31 ml of the concentrate with 0.36 molar hydrochloric acid solution, and with a 0.36 molar hydrochloric acid solution 1 molar in sodium chloride, respectively. These four catalyst solutions had the compositions shown below.
______________________________________ Catalyst Composition - grams/liter Chloride High Intermediate Low______________________________________Palladium 0.15 0.15 0.15 0.15Stannous Chloride 23 18 18 18Sodium Chloride 226 63.8 5.6 5.6Hydrogen Chloride 4.6 11.7 11.7 0.6Resorcinol 1.2 1.2 1.2 1.2Sulfuric Acid 0 0 0 18Total Chloride 150 56 21 10______________________________________
These catalyst solutions are stable, active catalysts and are widely used in the plating on plastics industry and for making plated-through-hole printed circuits on epoxy resin laminates.
The etched ceramic substrates were metallized by the following procedure.
(1) Immerse the substrates in the catalyst for 5 minutes at room temperature.
(2) Rinse in deionized water.
(3) Immerse in an accelerator solution comprising 3% fluoroboric acid in water.
(4) Rinse in deionized water.
After the electroless metal plating, the substrates contacted with the high halide catalyst and the intermediate catalyst containing 56 grams/liter chloride were completely covered with a uniform film of metal while the ceramic substrates contacted with the low halide catalyst and the intermediate catalyst containing only 21 grams chloride per liter had skip plating, i.e., small areas of the ceramic without copper plating.
Adhesion of electrolessly deposited metal to the ceramic substrate was tested by the "dot pull test".
Instead of plating the substrates in the room temperature electroless copper solution of Example I, the substrates were plated in an electroless copper solution of the following composition for 21/2 hours to deposit copper 10 micrometers thick on the substrates.
______________________________________Ethylenedinitrilotetra-2-propanol 18 g/lCopper Sulfate Pentahydrate 10 g/lFormaldehyde 1.6 g/lWetting Agent* 0.01 g/lSodium Cyanide 25 mg/l2-Mercaptobenzothiazole 0.01 mg/lSodium Hydroxide to pH 12.8Temperature 52� C.______________________________________ *Nonyl phenoxy polyglycidol phosphate ester commercially available from GAF Corp. as Gafac RE610. The substrates were adhesion promoted by the procedures as described in Example I.?
The adhesion promoted ceramic substrates were metallized by the following procedure:
(1) Immerse for 2 minutes in a room temperature aqueous halide predip solution of 3.8 moles sodium chloride, 0.1 moles hydrochloric acid and 0.025 moles stannous chloride per liter.
(2) Immerse at room temperature for 15 minutes in the high chloride catalyst solution of Example IV.
(3) Rinse in deionized water.
(4) Immerse in the accelerator solution of Example IV.
(5) Rinse in deionized water.
(6) Plate in electroless copper deposition solution.
(7) Rinse and dry.
The substrates then were imaged and etched by conventional photolithographic techniques thus producing copper dots 2.5 mm in diameter. Wires were attached to the copper dots with solder and an average bond strength of 10.8 MPa was measured as the dots were pulled away from the ceramic surfaces.
Ceramic substrates were adhesion promoted by the method of Example I, immersed for 10 minutes in a 3 Molar hydrochloric acid solution, rinsed in deionized water for 1 minute, immersed in a 0.1 Molar silver nitrate solution, rinsed in deionized water, and immersed for 30 minutes in the electroless metal deposition solution of Example I. The substrate was completely and uniformly covered with an adherent copper metal film.
The procedure was repeated except that after immersion in 3 Molar hydrochloric acid and rinsing, the substrate was immersed for 2 minutes in a 0.9 Molar nitric acid solution before the immersion in the 0.1 Molar silver nitrate solution. When the ceramic substrate then was rinsed and immersed in the electroless copper deposition solution, no copper deposition occurred. The 0.9 Molar nitric acid solution was tested for the presence of chloride by adding silver nitrate dropwise. A white precipitate formed. This shows the halide of this invention is necessary on the ceramic surface to form catalytic silver sites which initiate electroless copper deposition, and furthermore that the halide on the ceramic surface easily can be removed by improper processing.
This also shows that insoluble AgCl, because it is less easily rinsed away than SnCl2, can operate with lower chloride ion concentration on the surface, i.e., with a water rinse between the halide predip and the AgCl catalyst.
A white ceramic substrate was adhesion promoted by the method of Example I; immersed for 10 minutes in 3 Molar hydrochloric acid solution, rinsed in deionized water for 1 minute, immersed in a 0.1 Molar silver nitrate solution, rinsed in deionized water and dried. The ceramic substrate then was exposed to light. The surface darkened indicating that the adsorbed silver chloride was reduced to metallic silver sites by the light. Alternately, the silver chloride is reduced to metal with a reducing agent.
The procedures of Example I were repeated except that white ceramic substrates, 0.4 mm thick which were 96% alumina were substituted for the black substrates of 90% alumina. The similar results were obtained.
A white 96% alumina substrate, 30 mm�30 mm and 0.4 mm thick was adhesion promoted by the procedure of Example I. It then was coated with copper by the following procedure.
(1) Immerse for 5 minutes in an aqueous conditioner solution containing a amphoteric surfactant (tallow betaine surfactant) a nonionic surfactant (nonylphenoxy polyethoxyethanol) and ethanolamine, the solution adjusted to pH 2.
(2) Rinse in water.
(3) Immerse for 2 minutes in the halide predip solution of example V.
(4) Immerse for 5 minutes in the catalyst solution of example V.
(5) Rinse in water.
(6) Electrolessly deposit copper by the electroless copper plating solution of Example I.
A uniform coating of copper was obtained free of voids and skip plating. The copper clad ceramic was coated with a polyvinylcinnamate polymer (KPR, commercially available from Eastman Kodak Company), exposed, and developed with KPR Developer Solution to produce the negative resist image of a chip carrier on the copper clad substrate. The exposed copper surface, which was the desired chip carrier pattern, was electroplated in a copper plating solution (Copper Gleam PC commercially available from Lea Ronal, Inc., Freeport, NY) to a copper thickness of 0.01 mm. The resist then was removed with solvents, and the electroless copper film, outside the chip carrier image pattern, was removed by immersion in a solution of sodium persulfate, thus producing a finished chip carrier with 132 conductors on 0.14 mm pitch fanning out to 0.36 mm pitch.
The procedure of Example IX was repeated on both 90% and 96% alumina substrates using 0.4 mm thick substrates 75 mm by 75 mm. Instead of a chip carrier conductor pattern, eight copies of a copper conductor pattern for a hybrid circuit A/D (analog to digital) converter were produced on each substrate. The hybrid circuit conductor patterns have 125 micrometer wide pure copper conductors, input and output connections and all the interconnections for six integrated circuits and associated chip capacitors and resistors. After the circuit patterns were completed by removing the electroless copper film in the background, the individual hybrid circuits were cut out of the 75 mm by 75 mm wafer by a laser. Alternately, the individual circuit patterns are laser cut after the integrated circuits and chip resistors and capacitors are emplaced.
Example X was repeated except that the hybrid circuit conductor patterns were electroplated with nickel and gold over the electroplated copper. This produced a circuit with a clean smooth pure gold surface which is superior for wire bonding over screened gold paste thick film circuits.
A 64 pin chip carrier was produced on alumina substrate. The substrate was provided with laser drilled holes 0.4 mm in diameter and the chip carrier was produced by the method of Example IX except that the conductor pattern was plated through the holes and onto the reverse side.
Additive hybrid circuit conductor patterns are produced by adhesion promotion of ceramic substrates and treating with a conditioner, catalyst and rinsing after the catalyst solution as in Example V. Next the substrates are dried and a polymeric dry film photo resist (Riston 1401 commercially available from E. I. Dupont de Nemours & Co.) is applied to substrate, exposed to ultraviolet light, and developed by conventional means to produce the image of the hybrid circuit conductor patterns. The substrate then is immersed in the electroless copper plating solution of Example V for 21/2 hours thus depositing a pure copper conductor pattern 10 micrometers thick. To complete the circuit, the background resist is removed with solvent.
The procedure of Example V is repeated except that instead of an etched the dot pattern, a hybrid circuit conductor pattern is produced by photolithography.
A ceramic substrate, 96% alumina, was adhesion promoted by the following procedure.
(a) Immerse in an alkaline cleaning solution at 60� C.
(b) Rinse in water.
(c) Dry in a hot air oven at 160� C.
(d) Immerse the substrate in a molten sodium and potassium hydroxide eutectic solution of 205 grams sodium hydroxide and 295 grams potassium hydroxide at 210� C. for 10 minutes.
(e) After cooling rinse in water at room temperature for 5 minutes.
(f) Neutralize in 3 Molar hydrochloric acid solution for 2 minutes.
(g) Rinse in deionized water.
The adhesion promoted substrate then was plated with an adherent copper film by the procedures of Example IX, steps 1 through 6. A uniform, adherent coating of copper was obtained free of voids, blisters, bubbles and skip plating.
A ceramic substrate, 90% alumina, is adhesion promoted by: (1) immersing in a hot alkaline cleaning solution, (2) rinsing in water, (3) dipping in an aqueous 2.8 molar solution of potassium hydrogen sulfate, (4) drying the ceramic substrate in a oven at 160� C. and (5) fusing the potassium hydrogen sulfate on the surface of substrate at 450� C. Then the substrate is washed with water and immersed in a 10% sulfuric acid solution and washed again.
The adhesion promoted substrate then is metallized by the procedure of Example XV. A uniform, adherent coating of copper is obtained, free of blisters, voids and skip plating.
Four grams of sodium carbonate was ground together with one gram potassium nitrate. These dry, mixed powders were poured onto a black ceramic substrate, 90% alumina, (commercially available as BA-912 from NTK Technical Ceramic Division of NGK Spark Plug Co., Ltd. Mizuho, Nagoya, Japan). The substrate, covered with powder, was placed in an oven and heated to 700� C. for twenty minutes fusing the powder. After cooling, the substrate was rinsed with water, immersed in a 10% solution of nitric acid and rinsed again in water. The adhesion promoted substrate then was metallized as in Example XVI. A uniform, adherent coating of copper was obtained, free of blisters, toids and skip plating.
A ceramic substrate comprising silicon carbide and beryllia was provided with an adherent hybrid circuit pattern of pure copper conductors by the procedures of Example XIII. This produced a strongly adherent copper circuit pattern on a high beryllia substrate with excellent heat transfer characteristics.
The procedure of Example III is repeated except that an electroless nickel plating bath is substituted for the electroless copper plating bath. Electroless nickel plating baths are well known. The electroless nickel plating bath (commercially available from Allied- Kelite Div. of the Richardson Co., 2400 E. Devon Ave., Des Plaines, IL 60018 as Niklad 794) comprises nickel salts, sodium hypophosphite, ammonium hydroxide with a pH 4.5-5.2 (measured at 25� C.) and is operated at 90� C. After 30 minutes immersion in the electroless nickel plating bath, the ceramic substrate is removed. It is completely covered with no skip plating, by a uniform adherent deposit of nickel, 10 micrometers thick.
A ceramic substrate (96% alumina) was adhesion promoted by the procedure of Example I. It was provided with a conductive border by painting the edges with silver paint. The substrate was (1) immersed for 5 minutes in the aqueous conditioner solution of example IX; (2) rinsed in water; (3) immersed for 5 minutes in the halide predip solution of Example V; (4) immersed for 10 minutes at 40� C. in the catalyst solution of example V; (5) rinsed in water; (6) dipped for 5 seconds in an aqueous solution 3.5% fluoroboric acid and 0.4% hydroxyethylethylenedinitrilotriacetic acid; (7) electroplated with copper in an aqueous solution 75 g/l copper sulfate, 190 g/l sulfuric acid, 50 mg/l chloride ion and 1 g/l Pluronic F-127 (a block copolymer of polyoxyethylene and polyoxypropylene commercially available from BASF - Wyandotte Corp, Wyandotte, MI). The current density was 0.35 mA/mm2.
A ceramic lid made to fit over the opening in a hybrid circuit package was adhesion promoted by the procedure of Example I. The ceramic lid was then metallized with copper by the following procedure:
(a) Immerse for 2 minutes in a room temperature aqueous chloride predip solution of 3.8 moles sodium chloride, 0.1 moles by hydrochloric acid and 0.025 moles stannous chloride per liter.
(b) Immerse for 15 minutes in the high chloride catalyst solution of Example IV.
(c) Rinse in water.
(d) Immerse in the accelerator solution of Example IV.
(e) Rinse in water.
(f) Plate with copper from the electroless copper deposition solution of Example V.
(g) Rinse and dry.
The metallized ceramic lid was electroplated with a tin-lead (solder) alloy from a conventional tin-lead fluoroborate electroplating solution. The tin-lead alloy deposit was of the eutectic composition. The electrodeposited solder was reflowed with heat. The metallized ceramic lid was positioned on top of the opening in the hybrid circuit package to close the package. The periphery of the opening had a metallized layer covered with solder. A force was applied with a weight on the top of the ceramic lid. The metallized ceramic lid was hermetically sealed to the hybrid circuit package by passing the package and lid, under nitrogen atmosphere, through a belt furnace maintained at 20� C. above the eutectic melting point of the solder alloy. The assembly was cooled to room temperature and the weight was removed.
The seal of the hybrid circuit package to the lid was tested and was a hermetic seal as defined by MIL-STD-883.
|Cited Patent
|Filing date
|Publication date
|Apr 30, 1965
|Jan 3, 1967
|Corning Glass Works
|Electroless copper plating on ceramic material
|Nov 3, 1964
|Mar 21, 1967
|Bendix Corp
|Attaching leads to semiconductors
|Mar 5, 1970
|Dec 21, 1971
|Frederick W Schneble Jr
|Plated through hole printed circuit boards
|Dec 19, 1969
|Jun 27, 1972
|Day Co Nv
|Metallization of insulating substrates
|Dec 7, 1970
|Sep 12, 1972
|Method for strongly adhering a metal film on ceramic substrates
|Apr 20, 1972
|Jul 10, 1973
|Gen Electric
|Direct bonding of metals with a metal-gas eutectic
|Apr 20, 1972
|Oct 23, 1973
|Gen Electric
|Method of direct bonding metals to non-metallic substrates
|Jul 29, 1971
|Nov 13, 1973
|Kollmorgen Photocircuits
|Sensitized substrates for chemical metallization
|Jul 29, 1971
|Nov 13, 1973
|Kollmorgen Photocircuits
|Process for the formation of real images and products produced thereby
|Feb 18, 1972
|Sep 23, 1975
|Photocircuits Corp
|Method of sensitizing substrates for chemical metallization
|Aug 13, 1973
|Dec 9, 1975
|Kollmorgen Photocircuits
|Sensitized substrates for chemical metallization
|Feb 11, 1972
|Jan 6, 1976
|Photocircuits Division Of Kollmorgen Corporation
|Method for the production of radiant energy imaged printed circuit boards
|Aug 13, 1973
|May 25, 1976
|Photocircuits Division Of Kollmorgen Corporation
|Process for the formation of real images and products produced thereby
|Jul 11, 1974
|Nov 23, 1976
|Photocircuits Division Of Kollmorgen Corporation
|Processes and products for making articles for electroless plating
|Jul 30, 1975
|Nov 30, 1976
|General Electric Company
|Direct bonding of metals to ceramics and metals
|Jul 11, 1974
|Nov 30, 1976
|Photocircuits Divison Of Kollmorgen Corporation
|Formation of metal images using reducible non-noble metal salts and light sensitive reducing agents
|Nov 18, 1982
|Jan 31, 1984
|Eaton Corporation
|Method of preparing a beryllia substrate for subsequent autocatalytic deposition of a metallized film directly thereon
|Aug 28, 1980
|Apr 1, 1982
|Siemens Ag
|Zirconium (alloys) pretreatments - by pickling and deposition of thin copper film, so that dense and adherent chemical or electroplated metal coatings can be deposited
|Title not available
|Title not available
|Ameen et al, "Etching of High Alumina Ceramics to Promote Copper Adhesion," J. Electrochem. Soc., vol. 120, pp. 1518-1522, Nov. 1973.
|Ameen et al, Etching of High Alumina Ceramics to Promote Copper Adhesion, J. Electrochem. Soc., vol. 120, pp. 1518 1522, Nov. 1973.
|Bandrand, "Cleaning & Preparation of Ceramics and Metallized Ceramic Materials for Plating," Plating & Surface Finishing, pp. 72-75, Oct. 1984.
|Bandrand, Cleaning & Preparation of Ceramics and Metallized Ceramic Materials for Plating, Plating & Surface Finishing, pp. 72 75, Oct. 1984.
|Jorgensen et al, "Copper Plating Process for Metallizing Alumina," pp. 347-352, Sep. 1984.
|Jorgensen et al, Copper Plating Process for Metallizing Alumina, pp. 347 352, Sep. 1984.
|Citing Patent
|Filing date
|Publication date
|Dec 20, 1985
|Sep 29, 1987
|Olin Corporation
|Hybrid and multi-layer circuitry
|Jul 7, 1986
|May 23, 1989
|Licentia Patent-Verwaltungs-Gmbh
|Process for chemically metallizing an inorganic substrate
|Nov 16, 1987
|Oct 3, 1989
|Stemcor Corporation
|Silicon carbide-to-metal joint and method of making same
|May 6, 1987
|Jun 5, 1990
|Coors Porcelain Company
|Dome and window for missiles and launch tubes with high ultraviolet transmittance
|Sep 2, 1988
|Jun 12, 1990
|Eric F. Harnden
|Sensitizing activator composition for chemical plating
|Apr 22, 1988
|Jan 8, 1991
|Coors Porcelain Company
|Application of transparent polycrystalline body with high ultraviolet transmittance
|Apr 23, 1990
|Oct 22, 1991
|Zsamboky Kalman F
|Metallized ceramic substrate and method therefor
|Nov 21, 1989
|Dec 10, 1991
|Solution Technology Systems
|Method for directly electroplating a dielectric substrate and plated substrate so produced
|Aug 15, 1989
|Jan 7, 1992
|Hoechst Ceramtec Aktiengesellschaft
|Process for electrolessly depositing nickel
|Apr 22, 1988
|Jan 21, 1992
|Coors Porcelain Company
|Metallized spinel with high transmittance and process for producing
|Dec 23, 1991
|Dec 1, 1992
|International Business Machines Corporation
|Method of forming an adherent layer of metallurgy on a ceramic substrate
|May 6, 1987
|Sep 14, 1993
|Coors Porcelain Company
|Method for producing transparent polycrystalline body with high ultraviolet transmittance
|Dec 12, 1991
|Nov 16, 1993
|Eric F. Harnden
|Simplified method for direct electroplating of dielectric substrates
|Jan 31, 1992
|Dec 7, 1993
|Eric F. Harnden
|Simplified method for direct electroplating of acrylic or epoxy containing dielectric substrates
|Oct 30, 1992
|Aug 30, 1994
|Eric F. Harnden
|Method for electroplating metal onto a non-conductive substrate treated with basic accelerating solutions for metal plating
|May 17, 1993
|Feb 14, 1995
|Rohm And Haas Company
|Processes and compositions for electroless metallization
|Dec 18, 1995
|Nov 4, 1997
|Lucent Technologies Inc.
|Method of forming vias
|Sep 15, 1999
|Nov 13, 2001
|Seagate Technology Llc
|Electroless plating process for alternative memory disk substrates
|Apr 11, 2001
|May 21, 2002
|Yamatoya & Co., Ltd.
|Cu plated ceramic substrate and a method of manufacturing the same
|Feb 22, 2000
|Feb 3, 2004
|Seagate Technology Llc
|Nodule-free electroless nip plating
|Oct 14, 2005
|Nov 20, 2007
|Alps Electric Co., Ltd.
|Plating substrate, electroless plating method, and circuit forming method using the same
|Aug 6, 2004
|Apr 15, 2008
|Rohm And Haas Electronic Materials Llc
|Electroplating composite substrates
|Aug 11, 2008
|Dec 28, 2010
|Rohm And Haas Electronic Materials Llc
|Copper plating process
|Nov 20, 2012
|Dec 2, 2014
|University Of South Carolina
|Pretreatment method for reduction and/or elimination of basal plane dislocations close to epilayer/substrate interface in growth of SiC epitaxial films
|Sep 28, 2012
|Oct 13, 2015
|Kyocera Corporation
|Circuit board and electronic apparatus provided with the same
|Dec 2, 2014
|May 9, 2017
|University Of South Carolina
|Pretreatment method for reduction and/or elimination of basal plane dislocations close to epilayer/substrate interface in growth of SiC epitaxial films
|Dec 2, 2014
|May 9, 2017
|University Of South Carolina
|Pretreatment method for reduction and/or elimination of basal plane dislocations close to epilayer/substrate interface in growth of SiC epitaxial films
|Aug 6, 2004
|Sep 15, 2005
|Rohm And Haas Electronics Materials, L.L.C.
|Electroplating composite substrates
|May 22, 2003
|Jan 19, 2006
|Ku Ja-Nam
|Compression bonding method
|Oct 14, 2005
|Apr 27, 2006
|Alps Electric Co., Ltd.
|Plating substrate, electroless plating method, and circuit forming method using the same
|Jul 28, 2005
|Nov 22, 2007
|Helmut Gruss
|Pad Metallisation Process
|Oct 9, 2007
|Feb 7, 2008
|Alps Electric Co., Ltd.
|Plating substrate, electroless plating method, and circuit forming method using the same
|Aug 11, 2008
|Feb 12, 2009
|Rohm And Haas Electronic Materials Llc
|Copper plating process
|Nov 20, 2012
|Jun 6, 2013
|University Of South Carolina
|Pretreatment Method for Reduction and/or Elimination of Basal Plane Dislocations Close to Epilayer/Substrate Interface in Growth of SiC Epitaxial
|Dec 20, 2010
|Jan 23, 2014
|Ocean's King Lighting Science & Technology Co., Ltd.
|Light emitting device and manufacturing method thereof
|Sep 28, 2012
|Sep 25, 2014
|Kyocera Corporation
|Circuit board and electronic apparatus provided with same
|Dec 20, 2010
|Jun 5, 2013
|Light emitting device and manufacturing method thereof
|Dec 20, 2010
|Nov 25, 2015
|Nov 6, 1987
|May 19, 1988
|Matsushita Electric Works Ltd
|Verfahren zum rauhen von oberflaechen eines keramischen substrats und verfahren zur herstellung einer leiterplatte unter verwendung des an der oberflaeche gerauhten keramischen substrats
|Nov 6, 1987
|Nov 8, 1990
|Matsushita Electric Works, Ltd., Kadoma, Osaka, Jp
|Ceramic substrates with chemically roughened surfaces
|Nov 7, 1990
|May 30, 1991
|Harnden, Eric, F.
|Method for directly electroplating a dielectric substrate and plated substrate so produced
|Dec 10, 1992
|Jun 24, 1993
|Harnden, Eric, F.
|Simplified method for direct electroplating of dielectric substrates
|Jul 28, 2005
|Feb 16, 2006
|Vetco Gray Controls Limited
|Pad metallisation process
|U.S. Classification
|427/98.5, 427/98.8, 427/404, 427/99.1, 427/304, 427/99.5, 427/443.1, 427/309, 427/305
|International Classification
|Cooperative Classification
|European Classification
|May 10, 1984
Owner name: KOLLMORGEN TECHNOLOGIES CORPORATION 717 NORTH HARW
Free format text: ASSIGNMENT OF ASSIGNORS INTEREST.;ASSIGNORS:DE LUCA, MICHAEL A.;MC CORMACK, JOHN F.;REEL/FRAME:004258/0784
Effective date: 19840509
|Nov 8, 1988
|Certificate of correction
|Jan 29, 1990
|Fee payment
Year of fee payment: 4
|Jun 18, 1990
Owner name: KOLLMORGEN CORPORATION, A CORP. OF NY, CONNECTICUT
Free format text: ASSIGNMENT OF ASSIGNORS INTEREST.;ASSIGNOR:KOLLMORGEN TECHNOLOGIES CORPORATION, A TX CORP.;REEL/FRAME:005356/0276
Effective date: 19900615
|Oct 28, 1991
Owner name: AMP-AKZO CORPORATION, A CORP. OF DE, DELAWARE
Free format text: ASSIGNMENT OF ASSIGNORS INTEREST.;ASSIGNOR:KOLLMORGEN CORPORATION;REEL/FRAME:005889/0477
Effective date: 19911018
|Mar 15, 1994
|Maintenance fee reminder mailed
|Aug 7, 1994
|Lapse for failure to pay maintenance fees
|Oct 18, 1994
|Expired due to failure to pay maintenance fee
Effective date: 19940810


text:
Winchester Model 9422, .22 Shorts, Longs, and Long Rifle
Guns International #: 100843593 Seller's Inventory #: 5500618
Category: Winchester Rifles - Model 9422 - Winchester Rifles - Rimfire
Seller's Information
When emailing or calling sellers direct, please mention that you saw their listing on GunsInternational.com
Seller: Cabelas Richfield
Company: Cabela's
Member Since: 3/19/07
First Name: Ivan
Last Name: Gehl
State: Wisconsin
Zip: 53076
Country: United States
Phone: (262) 628-5724
Fax: (262) 628-5745
Seller: FFL Dealer
Return Policy: 3 day inspection and return policy on used guns.
3 days
Payment Types Accepted:
Price: $999.99
Metal Condition: Very Good Conditiion w/some very light dings on the left side of receiver.
Wood Condition: Near Mint
Bore Condition: Mint
Barrels: 20 Inch Barrel
Stock: Walnut Smooth Straight Grip Stock.
Stock Dimensions:
LOP 13 5/8 nch
Fore End: Walnut Forearm w/Barrel Band
Butt Pad: Winchester Buttplate
Weight: 6 lbs 4 oz.
Sights: Buckhorn Sights
Item Location: Richfield, WI


text: What's on News All Happy Birthday Queen Mary I February 2016 | Fiona Karn-Smith On this day 500 years ago Queen Mary I was born at the Palace of Placentia in Greenwich (now home to the ORNC). She was the only child born to Henry VIII and Catherine of Aragon to survive childhood, however had she been born a boy, it is likely that the whole of English history would have been different! Mary's life dramatically changed when Henry VIII divorced Catherine and Married Anne Boleyn who bore Henry another daughter named Elizabeth, Mary was then stripped of her title of princess and was forbidden to access her parents. Henry VIII passed away in 1547 when his son Edward reached the tender age of 10 years old! This meant Edward became King, under the protectorate of the Duke of Northumberland, however things took a turn for the worst when it was declared that Edward was dying and the Duke was making plans for his daughter-in-law Lady Jane Grey to take over the throne… Edward died in 1553 and Lady Jane briefly became queen, but not for long… Mary was very popular and within days she was on the throne. She was determined to re-impose the Catholicism and even marry Philip II of Spain. In 1554, Mary crushed a rebellion led by Sir Thomas Wyatt. Making the most of her advantage, she married Philip, pressed on with the restoration of Catholicism and revived the laws against heresy. Over the next three years she became very unpopular. She ordered hundreds of Protestants be burned at the stake, there was a war against France where she lost Calais, England's last Possession in France and then she was deserted by Philip. She died on 17 November in 1558 and her hopes of a Catholic England died with her. In celebration of Queen Mary's life, our Volunteer Explainers are offering free talks throughout the week. Find out more Plan your visit Our History Painted Hall Download a map of the ORNC >


text:
Seth's Gang is a Red Dead Redemption posse.
About the posse
Seth, upon discovering the truth about his treasure, lost the tiny bit of sanity left in him and had gathered a gang to roam the lands, targeting robbers and treasure hunters alike. Hello all, Seth's Gang is a new posse in Red Dead Redemption meant to gather polite players that follow free roam rules rather than just shoot everything that moves. NO KILLING INNOCENT PLAYERS IN FREE ROAM is the golden code, and players who dis-obey will be tied up and fed to the cannibals. If you like playing team-work with a touch of insanity (inherited from our leader, Seth) than this is the Posse for you! Some requirements-
1. Xbox version of the game
2. When in the possse, never harming another member without stating a reason.
3. Never killing ANOTHER player unless he draws gun at you.
4. No insulting within the gang.
5. Helping out posse members in need.
6. Mic is not a necessity but is recommended. The posse is open for all levels!
The posse will plan hunting, gang-hideout, challanges and free roam meetings in convinient days, so be sure to check our post on http://www.facebook.com/home.php?#!/topic.php?uid=100975796807&topic=14658. Our main page is http://www.facebook.com/pages/Seths-Gang/118794978162553?v=wall#!/pages/Seths-Gang/118794978162553?ref=ts
Members do not have to show up to any meeting, but some support is always nice. If any players needs anything done he can contact me and i will arrange a meeting.
Joining the posse
As the leader, my gamertag is assassin8me, so if you have questions, contact me. Or, in Red Dead Redemption Official Facebook Page, under discussions, find the posse discussion and contact me.
== Members==
Leaders get to plan events and votes, and can decide about ties in votes and are responsible that everyone in the posse is pleased.
Right Hands help plan events and votes, and can vote on justice bringers being upgraded. They advise the leaders about events and votes.
Justice Bringers are normal players that can only participate in votes or suggest new posse hideouts.
Cowboys are guests that are not expected to attend events at all, and are just chilled, not commited
Smooth Pancakes
Lfc Dan
Wicked Man 25
Trozky kvickers


text:
A Michigan mom is heartbroken.
Stacey Feeley walked into the bathroom to see her daughter standing on the toilet. At first she thought it was a joke and started laughing. When her 3-year-old explained what she was doing, Feeley burst into tears.
Feeley says her daughter was practicing a lock-down drill, hiding from a potential attacker.
She posted the photo on Facebook where it has gone viral.
"Politicians – take a look. This is your child, your children, your grandchildren, your great grand children and future generations to come. They will live their lives and grow up in this world based on your decisions. They are barely 3 and they will hide in bathroom stalls standing on top of toilet seats. I do not know what will be harder for them? Trying to remain quiet for an extended amount of time or trying to keep their balance without letting a foot slip below the stall door?"
One user wrote, "This is truly heartbreaking" while another said the post made her cry.


text:
|Office Girl
|First appearance
|14th March 1977
|Number of appearances
|Played by
|Angela Catherall
The unnamed Office Girl worked for Mike Baldwin at Baldwin's Casuals and he sent her to the Rovers with a note for Hilda Ogden as he knew she would be cleaning there in the mornings. Hilda asked what the note contained but the girl replied that she only worked for him and he didn't take her into his confidence. The note contained the key to 5 Coronation Street which Mike owned and where Bet Lynch had been employed as his "housekeeper". After falling out with Mike after discovering that he had a common-law wife, Anne Woodley, Bet refused to move out of the house and Mike instructed Hilda to clean it as part of his war of nerves with Bet.


text:
July 26, 2013 was a gloomy day for the Maasai community who live in Narasha in Naivasha, Kenya. By day break, hundreds of hired goons accompanied by armed police officers stormed the settlement and burned over 61 homesteads. During the raids 500 lambs, 200 calves and food that was in stores were burnt. During the ensuing melee 2 men were shot and wounded and are currently receiving treatment. Over 2000 people were left homeless and are currently living in the cold without food or shelter.
Narasha has been home for the Maasai but a land deal perpetrated by the former government regime has perpetually been bent on grabbing the Land. The land in question has allegedly been sold to KenGen for the production of geothermal power with funding from the World Bank.
- Cross-posted from Cultural Survival
IC Magazine is 100% reader funded Join us & make sure all indigenous voices can be heard
- July 26, 2013 at 11:25 pm
Welcome to the "Green Economy". Brought to you by the complicit non-profit industrial complex and the corporate psychopaths that fund them via their foundations.?
- July 26, 2013 at 11:29 pm
Clarification: That was a statement (above) not a question. Not certain where the question mark came from.


text:
Silverfish appear frequently in homes, but the temperature they enjoy depends on the type of silverfish insect in particular. All versions and varieties can cause damage --- typically to paper products and wood. However, the environments they prefer vary. Understanding how each breed grows in its ideal set of conditions can help with eradication.
The firebrat is a high-temperature variety of the silverfish. This type of insect prefers areas with significant heat --- as much as 90 degrees Fahrenheit or warmer. Preferring to function and live near sources of strong ambient heat (not burning), firebrats can appear near heaters and related piping and ovens, as well as the surrounding furniture or nooks adjacent to a well-used fireplace. Even hot-water pipes will trigger notice for the bugs if the plumbing runs frequently. Locale-wise, firebrats are common in the lower, warmer states such as Arizona. While they do avoid light, they migrate toward heat emanation in the dark.
Four-Lined Silverfish
This type of silverfish functions in both temperature modes. Formally known as the Ctenolepisma lineata, this variety of silverfish has a hardier body and longer legs. In terms of temperature, the four-lined silverfish can be found in either cold or hot climate. While the insect will migrate toward warmth given the option, it's not the type of insect that simply dies in cold winter.
Traditional Silverfish
The common silverfish many see zipping from uncovered locations resembling itty-bitty silver slivers with antennae prefer damp, cool locations. Basements make ideal environments with their cool, slightly moist surfaces. Sinks and drains or bathtub bottoms will be likely locations due to the silverfish's interest in moisture, but you may also find them near books and cardboard when the general area is damp.
Seasonal Migration
Different varieties of silverfish will migrate throughout a house, depending on the season. Those silverfish that like warmth will move up to attics in the winter, while those that prefer cool environments will move closer to moisture. The opposite movement occurs when summer arrives. While pesticides and chemicals will kill both, sometimes it's better to use their temperature sensitivity against them by changing the internal environment enough that the silverfish just leave the house altogether.
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text:
Men's 8.0mm Celtic Wedding Band in 14K White Gold
Item# 18181198
The Peoples Difference
Why shop Peoples?
The centre of this 14K white gold 8.0mm wedding band has an embossed Celtic design. View product details.
Special Offers
FREE SHIPPING with Ship-to-Store
Typographic errors are subject to correction. Merchandise enlarged to show detail and may not always be exactly as pictured. Promotions, prices, styles and availability may vary by store and online.


text:
Lonely Women - MGTOW MP3
Today's video is brought to you by a donation from James. He didn't give me a specific topic so I'll talk about female nature and the lonely woman of the twentieth ...
NEW MIXTAPE: http://www.hotnewhiphop.com/delanotv-my-decision-mixtape.93994.html ITUNES: ...
Session Americana and Guests- When Women Are Lonely MP3
Peter Wolf and Duke Levine join Session Americana for a special night. The Lizard Lounge Cambridge, MA 03/01/11.
Janis Joplin - A Woman Left Lonely MP3
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When Women Are Lonely - Peter Wolf MP3
China's "Leftover" Women Stay Single, Feel Lonely MP3
Statistics show that there are 800000 unmarried 30-plus-year-old women in China. They have a lot of things in common: good looking, good education and high ...
Rihanna - Only Girl (In The World) MP3
Music video by Rihanna performing Only Girl (In The World). (C) 2010 The Island Def Jam Music Group #VEVOCertified on February 16, 2011.
Only Girl (In The World)
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When Women Are Lonely MP3
Provided to YouTube by Universal Music Group North America When Women Are Lonely · Peter Wolf Up To No Good ℗ 1990 MCA Records Inc. Auto-generated ...
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text:
Posted by 7pm status on Wednesday, January 20, 2016
(Highlighting an incident happened few months ago cause of the similar incidents being repeated)
A Veda teacher brutally beats up and abuses a boy with a fractured arm!!!!!
The incident occured in a school in mangalapuram near vittal. The video reports show that this teacher abused the boy at a Veda camp asking him if he was whether a 'Brahmana' or a 'Kshatriya'. Sources say that the boy got into some mischief for which he was punished.
The right hand of the boy was already fractured and he was beaten without any consideration.
The incident came into attention when a complaint was filed by B K Sesappa, leader of Dalit Seva Samiti in the police station.
In the complaint, Sesappa has urged the Vittal police inspector to investigate and take strict action against Shyam Sunder
Shastri who is seen beating and abusing the boy. A complaint has also been given to women and children welfare department.
The scene of the boy with broken limbs being beaten up with no mercy is indeed a pathetic sight. Being a Veda teacher who was meant to inculcate moral values into the mind of students,resorting to such abusive actions should be condemned.


text:
Mr. Patrick Bolger
Ruislip, Middlesex - United Kingdom
No approved endorsements
About Mr. Patrick Bolger
Patrick Bolger joined Hornbill in 1998 as Sales & Marketing Director. In 2008 he was appointed as the Chief Marketing Officer. Patrick heads the companies marketing function globally, taking overall ownership and responsibility for the organizations strategic and, product marketing activities. Through his involvement and experience in the industry, he helps shape the direction of Hornbill's Service Management products.
Before joining Hornbill, Patrick was Technical Services Director for Integrated Digital Systems (IDS), where he was responsible for systems integration and technical consulting. Prior to this, Patrick was a director of Digitel, a specialist consulting organisation.
Patrick is involved with a number of strategic partnerships and groups that influence the Service Management industry, including the Service Desk Institute (SDI), Federation Against Software Theft (FAST), Service Futures Group and the IT Service Management Forum (itSMF). He is a popular speaker at international events and contributes opinion and editorial pieces to a number of industry publications.
Patrick has a keen interest in motorcycling and is a Senior Observer with the Institute of Advanced Motorists. He also enjoys kickboxing and although he no longer competes, he continues to participate by judging at international tournaments.
If you notice offensive or incorrect information, please contact us.


text:
|Message view
|« Date » · « Thread »
|« Date » · « Thread »
|Re: cvs commit: httpd-2.0/server core.c Makefile.in connection.c
|Sun, 04 Mar 2001 19:24:20 GMT
On Sun, 4 Mar 2001, Rodent of Unusual Size wrote: > email@example.com wrote: > > > > Who said I was delaying a beta? > > I do. I take a great deal of offense to this. Nobody in the group has worked as hard on this project as I have over the last two years. That isn't a value judegment, it is a matter of fact. I find it very distasteful that you would decide that the things I care about currently are not important to the project. That is not to say they are more important than what anybody else cares about, but they are no less important. > > I have no desire to tackle those problems, so I am working on > > what I do care about. I am working quite hard to ensure that > > I don't break the build, although since I am creating new files, > > the windows build is undoubtable broken (I tried to keep it > > working, but I have no place to test it). > > You mean that out of all of the multitudinous areas you care > about, there is not even *one* that does not require such massive > changes and high probability of breaking the build? That you > could work on without disrupting other people's efforts? Please do not tell me how much/and what I care about. I believe you would be very surprised about what interests me these days when it comes to this code. The last I checked, Roy was completely revamping the build system. I moved a bit of code from one location to another. I didn't modify ANY code at all, I just moved it. I do not believe that I have disrupted other people's work, although I am close to making it possible for people who want to work on protocol modules to be able to do so without needing to have the http module. > You just delivered up a quarter-megabyte of diffs. That is > a lot to digest, and you admit yourself that it broke the > build on other platforms, including but possibly not limited to > Windows. Which means other people have to stop working on > what *they* care about, possibly some of those beta-delaying > issues you mentioned, in order to clean up after *you*. The cleanup is adding *1* file to the build. That's it. If that takes longer than a few minutes, then there is something wrong. If somebody who understands the build system on Windows will post step-by-step instructions for adding files to Windows, then I will ensure that Windows will continue to build. If this broke other platforms, then it is because they too use a build system that I can't test, I am not currently aware of any other system like this. BTW, I just saw Will's post that says I didn't even break Windows. > That is either inconsiderate, thoughtless, or selfish. Or is > there another explanation? Yes, there is another explanation. I believe that this is important work, and it is what I care most about. I posted a few weeks ago that I would be doing this, and nobody stood up to object. Greg even said it was important work, and that he had tried to do it. I do not consider it inconsiderate, thoughtless, or selfish to clean-up a bunch of code so that more people can work on it. Explain to me how it makes sense to put the DocumentRoot directive in the HTTP module. I believe that what I am doing is good for the code, feel free to veto the changes, feel free to back them out. But do not question my motives. I have worked too hard too help this project succeed to allow my motiives to be questioned. Ryan _______________________________________________________________________________ Ryan Bloom email@example.com 406 29th St. San Francisco, CA 94131 -------------------------------------------------------------------------------
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