text:
Sound Fields: Winter
By Alexander Zolotov
Open iTunes to buy and download apps.
~ App for kids and their parents ~
~ Special version with winter music & graphics ~
Do you have a good ear for music? Can you play a musical instrument?
It is not important anymore, because with this tool ANYBODY can play great music without any skills!
It is easy! Just select some background track and synth you like. And that's it. Touch the screen and feel the sound!
Sound Fields is also available for Android.
Please try my other apps:
* PixiTracker;
* SunVox;
* PixelWave;
* SpectrumGen.
Code & Music by NightRadio (Alexander Zolotov).
Background tracks composed in SunVox.
- Category: Music
- Released: 22 November 2011
- Version: 1.0
- Size: 2.0 MB
- Language: English
- Developer: Alexander Zolotov
- © Alexander Zolotov
Compatibility: Requires iOS 3.0 or later. Compatible with iPhone, iPad and iPod touch.


text:
Rocky Walton
Board Certified
- Since 1995, Roger "Rocky" Walton has been a board certified specialist in the area of Personal Injury Trial Law by the Texas Board of Legal Specialization. Only 2.2% of Texas attorneys are certified in this area. To be board certified in the program created and sponsored by the Supreme Court of Texas, Attorneys are required to demonstrate special competence by passing rigorous requirements pertaining to character, legal knowledge and experience. Attorneys must also receive the approval of judges and their peers.
Attention Lawyers - sign up here to join the directory.

subset: commoncrawl


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Product Spotlight
Featured Research
Quick Stats
You are here
Retailers Give Back Locally with Food
Chevron donates to California food bank, while the AFPD provides 2,400 turkeys.
BAK, Calif. and FARMINGTON HILLS, Mich. -- It's that thankful time of year when retailers' charitable actions revolve around food, and despite a down economy, this year is no exception.
Chevron presented a check for more than $26,500 to the Golden Empire Gleaners, a local, volunteer food bank that serves nearly 500,000 people in Kern County, Calif., every year.
Of that amount, more than $11,500 was raised entirely through Chevron San Joaquin Valley employee donations during this summer's annual "Oil Can Do It" food drive. The employees raised money in a variety of ways, from hosting barbecues to rolling ice cream carts down the office halls for contributions, Turnto23.com reported.
The local program falls under a broader Chevron U.S. effort launched in 2008, Chevron Humankind, which gives employees the opportunity to engage with non-profit community partners to make their communities better. Chevron's vision for the program is to be the global energy company most admired for people, partnerships and performance.
Chevron also contributed $15,000 to the food bank to sponsor its senior sack program that targets low-income seniors in Kern County as recipients of food, the report stated.
In other charity news, the Associated Food & Petroleum Dealers (AFPD) will provide 2,400 families in the metro Detroit area with free turkeys for their Thanksgiving dinners, which equals approximately 28,800 meals (at 12 servings per turkey).
As the trade organization for the food, beverage and petroleum industries in Michigan and Ohio, the AFPD is in its 29th year of providing needy families with turkeys for the holidays. Since 1980, the AFPD program has donated more than 48,000 turkeys for a total of approximately 576,000 meals, according to the organization.
"This is one way our local independent retailers work together with the community to provide local needy families with a holiday meal," stated Jane Shallal, AFPD president and CEO. "Many retailers and other local businesses have given generously to this program."
Related News:
ExxonMobil, Valero Give to Charity
Wawa's Gobbler Returns to Stores


text: Today it was announced that Nick have put Sam & Cat forward, and that filming would commence in January. Who is looking forward to it? Sam & Cat Looking forward to it 10 Will watch the pilot 7 Not going to watch it 0 The poll was created at 00:54 on December 1, 2012, and so far 17 people voted. Please wait, submitting your vote... Retrieved from "http://icarly.wikia.com/wiki/User_blog:King_Henney_VII/Sam_%26_Cat?oldid=802057" Ad blocker interference detected! Wikia is a free-to-use site that makes money from advertising. We have a modified experience for viewers using ad blockers Wikia is not accessible if you've made further modifications. Remove the custom ad blocker rule(s) and the page will load as expected. Category: Blog posts


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text:
Anti-cuts march: Tens of thousands at London protest
More than 250,000 people have attended a march and rally in central London against public spending cuts.
Labour leader Ed Miliband addressed crowds in Hyde Park and the main march organised by the Trades Union Congress passed off peacefully.
But small groups attacked shops and banks with a stand-off in Piccadilly. There have been 214 arrests and 66 people injured, including 13 police.
Ministers say the cuts are necessary to get the public finances in order.
In the largest public protest since the Iraq war rally in 2003, marchers from across the UK set off from Victoria Embankment to Hyde Park, where TUC general secretary Brendan Barber was first in a line of speakers.
"We are here to send a message to the government that we are strong and united," he said.
"We will fight the savage cuts and we will not let them destroy peoples' services, jobs and lives."
At the scene in Oxford St
A very small group of protesters, maybe three to four hundred people, stopped outside Topshop.
The police are being careful to communicate with people on the ground using social media, knowing many are young. One update is that there are no kettles so far.
Protesters are very worried they will get caught within police cordons - so there is a bit of a game of cat and mouse.
Lots of these protests are very fast-moving. We walk miles with these protesters as they try to keep out of police cordons.
We saw some scuffles with police. Watching all the time are shoppers - this is Saturday afternoon. It is not a violent atmosphere, but it's certainly a lively atmosphere.
Mr Barber was followed by Mr Miliband, who said: "The Tories said I should not come and speak today. But I am proud to stand with you. There is an alternative."
The march began at 1200 GMT and it took more than four hours for the protesters to file past the Houses of Parliament on their way to the park.
The TUC, which organised the event, said more than 250,000 people had taken part, and the Metropolitan Police confirmed the numbers.
BBC political reporter Brian Wheeler, in central London, said there were lots of families and older people, and the atmosphere was good-natured but the anger was real.
"The noise in Whitehall was deafening as thousands of protesters banged drums, blew whistles and shouted anti-cut slogans, slowly making their way towards Trafalgar Square.
"The crowds were booing as they went past Number 10, but the demonstration was good-natured and friendly.
"There are hundreds of trade union banners, but we have also spoken to public sector workers who have come to make their voices heard."
One of those protesting was Peter Keats, 54, from Lowestoft, Suffolk, who works for Jobcentre Plus.
He said: "Personally, I think it's wrong the way we are hitting the poor.
"I'm not so much worried about myself but the customers I deal with are vulnerable and I'm worried about them and I'm worried about the kids of this country."
Demonstrator Christine Nugent, a university research fellow, said: "The size and scale of it, and the range of people here, is great."
The veteran of anti-Margaret Thatcher demonstrations in the 1980s said protesters came from all walks of life, adding: "There are a lot of trade unionists here, but it's not just the usual suspects."
There have been separate incidents involving a number of protesters, some with their faces covered by scarves, away from the main march:
- A sit-in organised by the campaign group UK Uncut took place at Fortnum & Mason department store in Piccadilly. The group has previously mounted protests against tax avoidance measures by big businesses
- A bonfire was lit by protesters at Oxford Circus, where earlier police said light bulbs containing ammonia were thrown at officers
- Topshop on Oxford Street had its windows smashed and was doused with paint
- Missiles were thrown at the Ritz Hotel, Piccadilly
- Bank branches including the Royal Bank of Scotland were attacked with paint and had windows broken, while branches of HSBC and Santander were broken into.
Scotland Yard said there had been 202 arrests for public order offences, criminal damage, aggravated trespass and violent disorder.
"Start Quote
End Quote Bonnie, Tunbridge Wells
I agree with the protesters, they are fighting for the future. "
Commander Bob Broadhurst said: "The main TUC march has been going well. We have had more than a quarter of a million people with hardly any problems.
"Unfortunately we have had a group of approximately 500 criminals committing some disorder including throwing paint at Topshop in Oxford Street and at the police, and scaring the public who are trying to shop."
Policing minister Nick Herbert said the government was "committed to supporting peaceful protest" and blamed the violence on "a small minority of individuals".
Mr Miliband condemned the violence, saying: "There is no excuse for it. It is unlawful and wrong."
Civil rights group Liberty said the march had been "infiltrated by violent elements" who attacked buildings before "melting into the demonstration once more".
Earlier, the largest union involved, Unite, said so many of its members had wanted to take part that it could not find enough coaches or trains to ferry them to London.
Its general secretary Len McCluskey said the scale of the deficit had been exaggerated.
Outlining his economic plan to the BBC, he said: "Our alternative is to concentrate on economic growth through tax fairness so, for example, if the government was brave enough, it would tackle the tax avoidance that robs the British taxpayer of a minimum of £25bn a year."
Education Secretary Michael Gove said he could understand the disquiet and anger.
"But the difficulty that we have as the government inheriting a terrible economic mess is that we have to take steps to bring the public finances back into balance," he said.
Mr Miliband is attending the march but is yet to sketch out an alternative, he added.
Matthew Sinclair, director of the Taxpayers' Alliance which lobbies for lower taxes and greater government efficiency, said: "It's understandable that people feel upset...
"But in the end it's not valid and what politicians should be doing is not encouraging this rally but saying look, you've got to be more realistic about the options facing this country."
Did you take part in the march? What is your reaction to Saturday's events? You can send us your views and experiences using the form below.
Send your pictures and videos to email@example.com or text them to 61124 (UK) or +44 7725 100 100 (International). If you have a large file you can upload here.
Here are a selection of your comments so far:
I am a 21-year-old student from Goldsmiths and I was in Topshop when it was attacked. I just wanted to say how pathetic the protesters are and how bitter they are. These guys don't have a clue, making all those people scared and upset because they don't know a thing about money - they just want to rebel for the sake of it. Luke Hyland, London
I won't be there, as I am one of the many disabled people concerned by the impact of cuts in money and services but unable to cope with a march. I hope our 'virtual march' will be added to the numbers of protesters. T Williams, Sheffield
How many times is the BBC News Channel going to allow this Taxpayers Alliance representative to go unchallenged? The deficit is the fault of public sector pensions. It is the direct consequence of the banking crisis. Paul Krishnamurty, Somerset
My godchildren aged between six and 14 are attending the marches with their mother. It shows that the people involved are genuine, concerned citizens protecting not only the welfare of themselves but the welfare of the future as well. These protesters are real and must be heard. Daniel Kent, Camberwell
I have just seen on the BBC news the protests in London today. The police were pelted with lightbulbs filled with ammonia. What type of disgusting human beings would attack the police like that? The police are as angry as the protesters regarding the cuts being made by the government, but they have to protect what they're told to! Jane Simpson, Manchester
While I agree in freedom of expression, the vicious attack on Topshop should be condemned - we live in turbulent times and I feel compelled to show immediate support for the proven business acumen of individuals such as Sir Philip Green and any advice they may be able to offer to help the UK out of this recession. Lisa Abbate, London
I was not able to join the march today, but am totally supportive of the marchers. The current government is demolishing so much of what has been built up over time in the public sector for no clear reason, other than ideology. The young and the old, in particular, are already suffering. There are alternatives. Annie Feltham, Brighton
The sheer hypocrisy of Labour leaders to even show their faces at this event, let alone champion themselves as protectors of the public sector is quite frankly shocking. Lest we forget they're the ones who ran the public sector into the ground by growing it into a bloated, inefficient mess and throwing money at it that we simply didn't have - especially in the dying days of their last government, in a feeble attempt to win a few votes. The coalition is simply trying to sort out the mess of the country's finances left by Labour. Ian, St Albans


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Much of Jerry Garcia's Discography Now Available on Apple Music and Other Streaming Services
Want some Jerry? Now you can stream a lot of his music.
Want some Jerry? Now you can stream a lot of his music.
On this day, 13 years ago, Jerry Garcia passed away.
Remember Jerry. He brought music to the world.
Buy from: Amazon.com | Amazon UK | Amazon FR | Amazon DE 1973 was a pivotal year for Jerry Garcia and the Grateful Dead. Pigpen died in March, and Jerry Garcia and Merl Saunders had settled into a regular routine of playing at the Keystone Korner in San Francisco. While they had been playing together […]
I got a care package from the Grateful Dead store today, containing two discs by the Jerry Garcia Acoustic Band (Almost Acoustic and Ragged but Right), together with a live Dead recording from May, 1969. So far, I've listened to the first two. These discs were recorded live during some acoustic/electric shows that Garcia did […]


text:
BMW Championship: Jim Furyk celebrates sixth 59 in PGA Tour history
Jim Furyk reflected on the best round of his career after becoming only the sixth man to card a 59 on the PGA Tour.
Last Updated: 15/09/13 7:16am
The American veteran was in a class of his own in the second round of the BMW Championship at Conway Farms, defying blustery conditions to ink his name into the history books.
His astonishing 12-under card was six shots better than the next lowest score of the day and earned him a share of the halfway lead with Brant Snedeker on 11 under par.
"It was a little hectic down the stretch," said Furyk, who held his nerve to knock a 103-yard wedge to three feet before rolling in his 11th birdie putt of the day at the ninth - his last. "I had a three-putt bogey at five and you could see the nerves at the sixth, leaving the putt short.
"I got myself back on track at seven, then I was kind of between clubs at eight with a pretty good chance to make my birdie.
"I told myself at nine, 'how many chances are you going to have in your life to do this again?'. Got to take advantage of it. Knock it in there tight and make it as easy on yourself as you can.
Asked if this was his best, as well as his lowest, round, he nodded before adding: "I've played a couple of good ones. I remember a 62 at Doral where the next best was something like 67. I think that defines the real good rounds - a guy shoots four or five shots better than the rest of the field.
"It's a very cool card, there's not much I could have improved on. I guess the moment kind of struck me the most at nine when I hit it the wedge shot in there close, and the crowd erupted.
"It just hit me how many people had come over to see the finish and how excited the crowd was. It was kind of like winning a golf tournament to be honest with you. It made it that much more fun."
Snedeker had been satisfied with his three-under 68, and he admitted afterwards that he was stunned at Furyk's achievement given the tough conditions.
"The greens were really firm, they were really fast and crusty," Snedeker said. "The winds were real inconsistent on direction. That's just an unbelievable round of golf.
"I saw on 18 that he needed a birdie on the last hole to shoot 59, and I thought, 'What the heck, are you serious? There's no way.'
"And it's a par 71, so that's even more impressive. And on a day like this when the wind is blowing 20 miles an hour out of the north, I don't think anybody out here saw that score coming.
"That makes me feel depressed about my round. I was actually feeling pretty good about it walking up here."


text:
Delta Toronto Hotel
Standing at 46 storeys, Delta Toronto is the most connected hotel in the city, with direct access to the PATH, Metro Toronto Convention Centre, Union Station, Union Pearson Express and the two office towers of Southcore Financial Centre.
The hotel was designed to meet the evolving expectations and needs of today's modern business and pleasure traveler and offers:
- 567 guest rooms with unbeatable views of Lake Ontario, the CN Tower, the Billy Bishop Island Airport and downtown
- Spacious 4-piece bathrooms with free-standing tub and shower
- Latest in sustainable design and features
- Technologically advanced, wired from top to bottom
- Health and wellness facilities, including gym, whirl pool and indoor pool
- 17,000 square feet of high-tech conference and meeting space
- 6,000 square foot ballroom with floor-to-ceiling windows offering views of the CN tower
- 4,000 square foot terrace for outdoor event space
Sustainable features of the Delta Toronto include:
- Heat recovery ventilation
- Low flow fixtures
- Smartcards controlling room lighting and air based on suite occupancy
- Green roofs throughout the building
- Urban forest creating a unique green space with forested walkway and gardens connecting the hotel to the 2 office towers
The hotel also features SOCO Kitchen + Bar – a 200-seat restaurant and patio that is the perfect combination of food, right atmosphere and people. SOCO is a local experience with fresh ingredients, cooked simply.
Also featured is the exclusive Canadian Char No.5 Whisky bar – the first of its kind in Toronto!
To find out more or book your next stay or meeting, visit the Delta Toronto hotel website.


text:
Mr. Scot Nattrass
Austin, Texas - USA
No approved endorsements
About Mr. Scot Nattrass
Builder, Developer, Technology Executive, Solar Visionary.
Scot seeks to build beautiful structures that maximize beauty, ergonomics, utility, and efficiency and make them "Net-Zero" or in other words, produce as much power as they use in a given year. His current projects include luxury homes in Horseshoe Bay, Texas, and Student Condo's in Austin, Texas.
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text: I don't get one thing, in the conversation between Smoker and Dragon, both in the manga and anime, Smoker said, "the government wants your head" So how do we know that Dragon is the most wanted man? In all other references nothing of his bounty has been said, only that he is the most dangerous person, but most dangerous is not exactly the same as most wanted. Please enlighten me.


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It only takes a minute to get started. Fill out our simple sign up form and login to the site.
This step is voluntary but will dramatically boost your chances of people actually reading your profile and contacting you. Write a few sentences about yourself, your pasttimes and upload some good photos of yourself.
Use our website's sophisticated search to uncover members who fulfill your criteria. Or just leaf through listings and uncover people that you like.
Discovered someone who you're attracted to? Send them a message or just a wink and see if they're interested. With a little luck you'll be on your way to discovering your perfect date.
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The white Gerbera top will reveal a confident woman who knows how to let her body speak for itself. Revamp your style and wardrobe, this party season by wearing this trendy top with a pair of pants and high heels. The figure accentuating top looks like a vest from the front, but the criss-cross styling at the back is so stylish that it changes the whole perception of glamorous. A fresh face of makeup, brushed hair, high heels and a mini skirt are all you need to rock the party season.
- Women's fashion top made with knit cotton spandex
- Strings at back
- Unlined
- Cotton Jersey
- Stretch
- Knitted
Model Statistics: Model wears size XS, Height: 5'8", 173 cmNote: The increase in price for plus sizes is due to an increase in material consumption


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Voyeur : April 2009
HISTORIC HOTELS ? DESTINATION_ all that flashy stainless steel and fancy booze fromEurope. In fact, where I'm from, we don't put much stock in that kind of clobber. This is the New South Wales outback, and a cold beer and a friendly yarn will dome just fine. Ever since Mad Max II was filmed in the area in 1981, I've hosted a tribe ofmovie-star big wigs, but I reckonmy favourite would have to be Bryan Brown. He was out this way working on Dirty Deeds in 2001, and a top bloke he is too. Sometimes he'd come in with Toni Collette – she's a sweetheart – and a bunch ofmovie people after a hard day of lookin' pretty. Other days he'd be just as keen to shoot the breeze with the local shearers. He reckons he was set to become a shearer himself before he started all thismovie malarky. I don't know what the boys think, but I reckon he'd have done alright. We still get a lot of tourists stopping by to check out all of our movie memorabilia, but we've always had a loyal local following too – nomore so thanMisty the horse. She'd wander into the pub for a beer at the bar. Misty was a pub horse. You've heard of pub dogs, of course. Well, Misty was a pub horse. She belonged to one ofmy previous owners and she was always hanging around out the front. But when the heat got too much for her, she'd wander on into the pub for a quick beer at the bar. I was always happy to have her around, of course, and I'm not ashamed to say that I shed a tear when she passed away a few years back. She's buried out the back in the beer garden, next to our old three-legged cattle dog, Jake. But then, that's a whole different story." "DUDE, WHEN I TURNED 130 WE TOTALLY ROCKED THE HOUSE… You should have seen it. For my big birthday bash last year, we had 300 bands perform in 30 days down here at The Espy – that's, like, almost 10 a day. It was totally off the freakin' chart, but how often do you turn 130? Don't get me wrong, I wouldn't recommend that level of partying to everyone. It's taken me a long time to build up that kind of tolerance. :: SILVERTON HOTEL, NSW Where and when: Layard street, Silverton. Silverton is a 25-minute drive north- west of Broken Hill. Open whenever you're thirsty. Fly to: Adelaide, then take the seven-hour drive to Broken Hill. Contact: For details, call +61 8 8088 5313. There's no horsing around at actor Bryan Brown's favourite outback pub, the Silverton Hotel – just good beer and friendly locals. APRILVOYEUR 057
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Hotel Lake City
Call us 1800-300-2400-1 (Toll Free) and Get additional Discount upto 50% for this Hotel.
You are getting lowest possible rate for this hotel
- About Hotel
- Reviews
About Hotel Lake City
Hotel Lake City is a budget accommodation in Udaipur that offers breakfast to its guests. The property is reachable from the Udaipur City Bus Station (0.5 km) and the Gulabh Bagh (1 km). There are 12 rooms spread across 4 floors in this hotel. The rooms are equipped with in-room amenities, such as cable TVs and telephones. Each room also has an attached washroom with hot and cold running water.
No of floors: 4 | No of rooms: 12
Checkin Time: 1200 pm
Checkout Time: 1200 pm
Hotel Amenities
- Luggage Storage
- Medical Services
- Room Service
- Breakfast Services
- Parking
- Airport Transportation
- Laundry Facilities
- Front Desk
- Multi-line Phone
- Sofabed
- Premium TV Channels
- Television-Room


text:
Reliance Industries Ltd (RIL) and Myanma Oil & Gas Enterprise (MOGE), an enterprise of the Government of Myanmar, have signed production sharing contracts for two offshore blocks (M17 and M18).
RIL won both the offshore blocks after its bids in Myanmar Offshore Block Bidding Round – 2013 were declared successful by The Ministry of Energy (MOE) of the Republic of the Union of Myanmar.
RIL will be the operator of the blocks with a 96 per cent participating interest. United National Resources Development Services Co. Ltd. (UNRD), a Myanmar company, will hold the remaining interest in the block.
Both the blocks are located offshore in the Tanintharyi basin of Myanmar in water depths upto 3000 ft. and together encompass total area of 27,600 sq. kms.
Reliance Industries Limited
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Tom Piantadosi of RE/MAX Town & Country is committed to the practice of doing business with a true sense of purpose. He is open, honest, and fair in every facet of our business, turning his knowledge and experience into a distinct, competitive advantage for clients. Tom will look beyond the mere real estate transaction to see how he can help our clients better achieve their goals and objectives.
Tom's office is fully equipped with an integrated network of computers and communication systems. I have instant access to all of the regional Multiple Listing Services, Public Record Searches, and other tools and services that our agents need in order to better serve you.
Tom Piantadosi has been in the business since 1986. That's 30 YEARS of Real Estate experience! He is already a member of the Re/max Hall of Fame. He holds his license in Rhode Island and Massachusetts.
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celeb crushes
Girl Talk: I Care Too Much About Whether My Celeb Crush Is Single
It started when I was 11 years old. I was flipping through the very first Seventeen magazine my mom ever let me have (June 1996 — Liv Tyler was on…
You'll Never Guess Martha Stewart's Celebrity Crush
"I have lots of crushes, I love having crushes. But lately I think it's Christian Bale. I just watched 'American Psycho,' where he looks really good. And then I watched…
Jennifer Love Hewitt Embarrassed Over Publicizing Adam Levine Crush
Jennifer Love Hewitt just learned a valuable lesson: Don't reveal your private crushes in public!
"The moment when you make a comment about something or someone and the…


text:
Rihanna Thug Life Tattoo
January 25, 2012 by staff
Rihanna Thug Life Tattoo, Rihanna has paid homage to rapper Tupac Shakur by getting the same tattoo as him. The We Found Love hitmaker has had Thug Life etched on her hands, the same inking that the slain rapper – who was killed in a drive-by shooting in 1996 – had on his stomach.
She tweeted a picture with the caption "? All these b****es screaming that 2pac back ? #THUGLIFE (sic)."
She also posted a separate message – reportedly in reference to Drake's single Free Spirit which mentions Tupac's girlfriend Kidada Jones, who used to have a tattoo of his face on her arm.
She wrote: "Tat my f***in name on u girl so I know its real!!! #MINE (sic)."
The 23-year-old is a huge fan of tattoos, with approximately 14 visible inkings including a musical note, a Pisces, the word 'love', a trail of stars and the French saying 'Rebelle Fleur' – which means rebellious flower.
Rihanna also appears to have gotten a new tattoo on her back. She posted a picture on the micro-blogging site of her posing on a table drinking a bottle of beer while the tattoo artist Mark Mahoney worked on her body art.
Please feel free to send if you have any questions regarding this post , you can contact on
Disclaimer: The views expressed on this site are that of the authors and not necessarily that of U.S.S.POST.


text:
North American Fisherman has visited Titusville, Florida on several occasions to chase redfish.
This one was different as the space shuttle was flying, and NASA had put the prime redfish waters out of bounds for Capt. Larry Fowler, who advised we either go after black drum or go home. We chose the former, and it proved to be a worthwhile day chasing a less-than-sought-after species of fish.
After all, even a bad day of fishing beats a good day of work, and for our crew it's actually both at the same time, and it wound up being a hoot after all.


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Watch below as USA TODAY's Nate Davis and Sean Leahy review the NFL draft:
For additional video recaps of the NFL Draft, watch studio highlights from NFL Network via NFL.com.
Nate Davis is a reporter, blogger and editor who's been at USA TODAY since 2000. He has covered the NFL since 2005. No, he did not play quarterback for Ball State. Davis' succession of our esteemed colleague Sean Leahy at The Huddle is considered a Brady-for-Bledsoe swap by most "insiders."More about Nate


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text:
|Publication number
|Publication type
|Application number
|Publication date
|Oct 20, 1992
|Filing date
|Oct 26, 1989
|Priority date
|Oct 26, 1989
|Fee status
|Also published as
|Publication number
|Randall L. Schlesinger, Ralph W. Doe, Richard D. Gates, Dennis P. Goddard, Shih C. Hsu
|Original Assignee
|Digtial Equipment Corporation
|Export Citation
|BiBTeX, EndNote, RefMan
|Patent Citations (27), Referenced by (23), Classifications (27), Legal Events (6)
|External Links: USPTO, USPTO Assignment, Espacenet
This invention relates generally to the field of packaging for integrated circuit chips and more particularly to a method of manufacturing tape automated bonding packages.
Packaging is one of the final steps in the process of manufacturing integrated semiconductor circuit components or chips. In packaging, a fabricated semiconductor chip is mounted in a protective housing. After packaging, the assembled component is subjected to final testing and ultimately then connected into an electronic circuit.
Currently, many semiconductor chips are contained in plastic packages. These packages are provided with reinforced metal leads for electrically connecting the chip to the printed circuit board which contains the circuit in which the chip is to be included. Within the package, one end of each lead is connected to a specific bonding point on the chip, usually by an intermediate lead. The other end of the lead, which extends outside of the package, is attached to a connection on the printing circuit board.
Advances in semiconductor manufacturing technology have made the fabrication of Very Large Scale Integration (VLSI) chips possible. A VLSI chip comprises a large number of individual circuit components that are fabricated together on a single, small chip. VLSI chips are able to perform a large number of electrical functions, and perform them more rapidly, than was previously possible.
To date, it has been difficult to provide suitable packaging for VLSI chips. In part, this is because each chip requires a large number of connections to external circuit elements. Many VLSI chips have over 300 bonding points, each of which must be connected to a lead for connection to external circuit elements.
Another consideration in the use of a VLSI chip is the need to provide common voltages to a number of different locations on the chip. For instance, in a chip that comprises a number of individual C-MOS transistors, such a chip may require a common drain voltage and a common source voltage for the transistor provided by an external power supply. Typically, the drain voltage is positive with respect to a common reference or ground voltage and the source voltage is typically at the same level as the ground voltage.
Normally, common voltages are supplied to the components on the chip by providing sets of leads. Each set of leads carries the same voltage to different bond points on the chip. To date, providing a VLSI chip with a common voltage at a number of locations has been a difficult task. In a VLSI package, the leads which are connected to the chip are spaced closely together. Moreover, some of the leads supply signal voltages that fluctuate rapidly as electronic functions are performed by the chip and the other circuit components. This causes the magnetic fields normally developed around these leads to vary which in turn causes inductive currents to flow in adjacent leads. Whenever a sufficiently large inductive current is developed in a common voltage lead, the voltage on the lead changes. This problem may be intensified because in a VLSI chip voltages may fluctuate rapidly. This rapid change also intensifies the development of a magnetic field and the associated inductive current flow. As a result, the voltage supplied to one or more components on the VLSI chip may vary so greatly as to cause the chip to malfunction.
There are prior VLSI chip packages that are designed to minimize the problems associated with the development of inductive current flow. One such package is a multi-layered ceramic package. This package includes layers of conductors separated by layers of dielectric ceramic. A cavity is formed in the ceramic layers and the chip is mounted in the cavity. Wire bonds connect the bond points on the chip to the individual conductors on the top layer of conductors. Individual wire bonds or reinforced metal leads provide an electrical connection to the printed circuit board to which the chip is attached. Selected top-layer conductors, which carry common voltages, are connected to common intermediate-layer conductors. The intermediate-layer conductors function as reference voltage planes which insure that the common voltages supplied through the top-layer conductors attached thereto does not appreciably vary.
However, there are a number of limitations associated with multi-layer ceramic packages. The size of these packages tends to be overly large in order to accommodate the interconnections needed between the conductor layers. Moreover, a ceramic package designed to contain a VLSI chip is expensive to manufacture. In some instances, the cost of the multi-layered ceramic package may significantly exceed the cost of fabricating the chip.
There have also been some attempts at providing packages for semiconductor chips wherein a single lead, bonded to the package, extends out from the package and has an outer lead portion that is used for subsequent bonding to a printed circuit conductor or other circuit elements. These packages have been formed from leads that extend from a section of metal tape. They can be used to provide only a relatively limited number of leads and thus do not provide the number of required interconnections needed for VLSI chips and the like. Moreover, to prevent environmental exposure of the packaged chip, which may cause the chip's degradation and malfunction, the package is often filled with an encapsulation material so as to entirely cover the chip and the leads thereto. The encapsulation is a difficult and time consuming process that adds to the overall expense of packaging the chip. Furthermore, there are some difficulties associated with removing the encapsulating material in order to access the packaged chip.
This invention makes use of a process known as tape automated bonding (TAB). TAB consists of using a tape section with electrical leads therein to electrically connect a semiconductor chip to a pad on a printed wire board. Typically, a tape automated bonding section (TAB section) consists of a central aperture for receiving a semiconductor chip and a plurality of electrical conductors extending from the outer perimeter of the central aperture to a plurality of test pads on the outer perimeter of the TAB section. Specifically, each electrical conductor within the TAB section has an inner lead located around the perimeter of the central aperture, an outer lead distally located from the inner lead, and a test pad located on the outer perimeter of the TAB section. After the semiconductor chip has been mounted into the central aperture, the chip and the inner leads are encapsulated within a housing member.
In brief summary, the manufacture of a TAB section with a semiconductor package involves the mounting of an individual TAB section within a carrier frame. A semiconductor chip is arranged within the central aperture so that each contact pad on the semiconductor chip is aligned with and then bonded to a specific inner lead in the TAB section. A housing member mounted on opposite faces of the TAB section encloses the semiconductor chip and the inner leads therebetween. Next, a nickel material and then a solder coat is applied to the outer leads. The solder coat on the outer leads ensures a good solder joint between the outer lead and a pad on a printed wire board while the nickel provides a barrier between the solder coat and the gold plated copper wire, since it is commonly known that the intermixing of gold and solder produces a tin that has poor electrical conductivity and low shearing strength. Finally, the entire TAB section is tested and then excised from the frame.
This invention involves the selective plating of the outer leads of the TAB section. As stated above, the TAB section has a plurality of test pads located around the outer perimeter of the TAB section. Each of these test pads is electrically connected to a "debus" area in the TAB section and each "debus" area is electrically connected to a common plane conductor. Initially, an inner and an outer gasket are mounted over, respectively, an inner and an outer portion of the outer leads and then a voltage is applied to the common plane conductor. A barrier material, usually nickel, is applied to the outer leads protruding between the inner and the outer leads and then solder is applied over the nickel layer. Finally, the debus areas are excised from the TAB section and the TAB section is ready for final test, inspection, and excising.
Another feature of the invention involves the curing process for the adhesive on the housing member. A force is applied to a surface of the housing member that does not have adhesive on it and then the entire TAB section is heated to a sufficient temperature and for a sufficient duration to cure the adhesive. The applied force, coupled with the heat, squeezes a portion of the adhesive out from between the TAB section and the housing member and onto an inner portion of the outer leads before the adhesive cures. This embeds the inner portion of the outer leads with adhesive so that they are retained in alignment with and electrically isolated from each other.
The manner in which the force is applied to the housing member during the curing process is also a novel feature of the invention. When the force is applied to the housing member, the TAB section within the carrier frame is placed on a pedestal in a mounting fixture so that the housing member mounted lies within a housing member seating space within the pedestal. A compressor block is then disposed against the opposite surface of the TAB section. A compressor bar clamped over the compressor block and to the mounting fixture urges the compressor block against the TAB section. This also causes a centrally-located spring loaded plunger within the compressor block to push against the semiconductor chip but with a reduced force. This reduced force presses the chip against a housing member recess so that a silver epoxy mounted in the recess can evenly disperse over the semiconductor chip.
FIG. 1 is a top-view of a section of tape automated bonding section including the leads and the polyimide carrier underneath them, used in the manufacture of the tab semiconductor package of this invention.
FIGS. 2a and 3b are cross-section views of the tab semiconductor package of this invention attached to a printed wire board.
FIG. 3a is a cross-section view of a section of tape automated bonding section supported by a carrier.
FIG. 3b is an exploded view of a dye and film-to-package mounting assembly according to this invention.
FIG. 3c is a cross-section view showing the base section of a package according to this invention, with adhesive thereon, held in a mounting fixture.
FIG. 3d is a cross-section view of the assembly of FIG. 3a being secured to the base assembly of FIG. 3c.
FIG. 3e is a cross-section view of a partial package assembly of FIG. 3d.
FIG. 3f is a cross-section view of a partial package assembly, as in FIG. 3e, showing the outer lead portions of the package receiving a coating so as to adapt same for soldering.
FIG. 3g is a cross-section view of a partial package assembly, as in FIG. 3f, showing the debus area around the perimeter of the film being removed.
FIG. 1 illustrates a tape automated bonding section 2 (TAB section) used in the manufacturing of a tape automated bonding (TAB) semiconductor package (not shown). The TAB section 2 has a central aperture 4 for receiving a semiconductor chip (not shown) and mounting it to the electrical conductors 6. The electrical conductors 6 extend from the perimeter of the central aperture 4, under a dielectric film 8, under a tie down bar 10, over a tape carrier portion 12, and terminates a test pad 14 located around the perimeter of the TAB section 2. Each electrical conductor 6 has inner lead 16 that extends into the central aperture 4 and an outer lead 18 that extends from the dielectric film layer 8 to the tape carrier portion 12. As will be explained later in this specification, a housing member will be mounted on the film layer 8 between the inner leads 16 and the outer leads 18 which will enclose the semiconductor chip (not shown) and the inner leads 16 therebetween. The TAB section 2 also has a plurality of debus areas 20 which connect a plurality of test pads 14 to a common plane conductor 22. The debus areas 20 is an open area with no dielectric film beneath the electrical conductor interconnects. The common plane conductor 22, as will be explained latter in this specification, has a voltage applied to it during the electroplating process.
Referring now to FIG. 2, it shows a completed TAB semiconductor package 24 constructed according to this invention. Outer leads 18 bond the TAB semiconductor package 24 to a plurality of contact pads (not shown) on the printed circuit board 26. Likewise, inner leads 16 bond the TAB section 2 (FIG. 1) to a plurality of contact pads 28 on a semiconductor chip 30. These inner and outer leads 16 and 18, respectively, are manufactured out of a gold-plated copper to insure good electrical conductivity. The tie down bar 10 over the outer portion of the outer leads 18 further helps maintain the outer leads 18 in registration with the contact pads on the board 26 during lead to contact pad bonding process.
A base 32 and a lid 34 together encapsulate the chip 30 while adhesive layers 36 secures the base 32 and the lid 34 to the TAB section. The base 32 and the lid 34 are manufactured out of a electrically insulating and thermally conductive material such as plastic or ceramic. The base 32 has a rim 38 around the outer perimeter thereof in which the semiconductor chip 30 is mounted. Together, the base 32, the lid 34, and the layers 36 protect the chip 30 and the inner leads 16 from exposure to environmental contaminants. In this respect, an inward spacing of the dielectric film 8, usually a polyimide film, from the outer edges of the rim 38 so that the adhesive layers 36 merge around the inner portion of the outer leads 18 also further enhances this protection. The layers 36 are non-conductive and resist decomposition or other breakdown through a wide range of temperatures which far exceed the normal operating temperature of the chip 8. A good material for such layers is an epoxy for example an epoxy amine such as Ablestick 564.
An adhesive layer 40 secures the chip 30 to the base 32. In the preferred embodiment of the invention, this layer is a thermally conductive adhesive, for example a silvered epoxy, that provides an efficient exhaust path for the heat generated by the chip 30. Moreover, when the adhesive layer 40 mounts the chip 30 to base 32, this allows a heat sink (not illustrated) to be mounted to the flat surface of the base 32 because the adhesive layer will efficiently transfer to the base the heat generated by the chip.
This package 24 provides numerous advantages. It provides complete mechanical protection for the chip 30 and for the inner leads 16. It also offers a convenient chip-to-TAB and tape-to-printed wiring board interconnect system with environmental and mechanical protection for the chip. Furthermore, since the TAB section can readily be provided with a large number of leads for interconnection, the package is especially suited for protecting VLSI and other chips that have a large number of interconnections.
FIGS. 3a through 3g illustrate the method of manufacturing the semiconductor package 24. As illustrated in FIG. 3a, the TAB section 2 of FIG. 1 is mounted in a carrier frame 42. This carrier frame 42 comprises an inner frame member 44 and an outer frame member 46 that clamp to the TAB section 2. This frame 42 prevents the warping of the TAB section 2 during the manufacturing process and also determines the pin locations of the electrical conductors within TAB section. Moreover, the frame 42 permits handling of the TAB section 2 without damaging the frail leads. Each contact pad (not shown) on the chip 30 is aligned with and then bonded to the corresponding correct inner leads 16 of the TAB section 2 using known bonding practices. A small amount of epoxy overcoat (not shown), typically to a thickness of about 0.003 inches, is then placed over the chip surface containing the chip circuitry and the chip bond points. This overcoat covers the entire surface of the chip, the chip-to-inner lead bonds, and the inner portion of the inner leads which are in registration with the surface of the chip. This overcoat serves as an environmental protection for both the chip 30, the chip-to-inner lead bonds, and the inner leads 16.
A compressor unit 48 in FIG. 3b mounts the base 32 and the lid 34 (shown in FIG. 2) onto the chip-and-TAB section 100 (shown in FIG. 3a). This unit 48 disclosed in FIG. 3b, has a mounting fixture 50 upon which a pedestal 52 projects therefrom. The pedestal 52 contains a base seating space 54 in which the base 32, as explained below in describing FIG. 3d, is held during this assembly process. A hole 56 is located within the pedestal 52 for the removal of the chip-and-TAB section. Moreover, two mounting blocks 58 are mounted on two opposite sides of the fixture 50, each block 58 having an outwardly extending coupling pin 60 for the application of force onto the chip-and-TAB assembly 100 (FIG. 3a) by a compressor bar 62. The compressor bar 62 has on each side a clamping assembly 64 for securing the bar 62 to the mounting fixture 50. Each clamping assembly 64 includes a C-shaped clamp 66 dimensioned to receive the coupling pin 60 and attached to a pin 68 that extends through the compressor bar 62. Springs 70 between the bar 62 and collars 72 attach to the top of the pins and bias the clamps so that when the compressor bar 62 is coupled to the mounting fixture 50 it is urged against the pedestal 52.
A compressor block 74 lies directly under the compressor bar 62. The compressor block 74 has a central bore 76 in which a plunger 78 is disposed. A plunger spring 80, shown in FIG. 3d positioned between the top of the plunger 78 and a metal band 82 secured to the top of the compressor block 74 by screws 84, urges the plunger 78 against the semiconductor chip 30 as described below in the discussion of FIG. 3d. The compressor block 74 and the associated plunger 78 both being formed of Teflon or another material that will not react with the adhesive layers 36 (FIG. 2) during assembly or curing.
Referring now to FIG. 3c, the base 32 is mounted in the base seating space 54 in the pedestal 52 of the mounting fixture 50. The adhesive 36, in the form of a B-staged partially cured epoxy, is applied onto the rim 38 of the base 32.
Referring now to FIG. 3d, the chip-and-TAB section 100 (from FIG. 3a) is then mounted on the prepared base 32 between the inner leads and the outer leads and the remaining members of the compressor unit 48 (from FIG. 3b) are assembled over the mounting fixture 50. Specifically, the compressor block 74 is mounted over the chip-and-TAB section 100 (FIG. 3a) and the compressor bar 62 is mounted over the compressor block 74. The C-shaped clamps 66 grapples the coupling pins 60 on the mounting fixture 50 which in turn compresses the springs 70 between the compressor bar 62 and the collars 72. The springs 70 urges the compressor bar 62 downward with a force equalling the spring constant of the springs 70 and the distance the springs 70 are compressed. In turn, the compressor bar 62 urges the compressor block 74 against the chip-and-TAB section 100 (FIG. 3a) with a force that causes a fraction of the partially cured adhesive layers 36 between the dielectric film 8 and the base rim 38 to ooze out from and rise between and around the exposed portions of the outer leads 18 that are disposed around the outer perimeter of the base rim 38.
Inside the compressor block 74, plunger 78, independently downwardly biased by spring 80, urges the chip 30 against the thermally conductive adhesive layer 40 so as to ensure that the chip 30 is securely fastened inside a recess 86 within the base 32. To ensure that the epoxy in the adhesive layer 36 properly flows out between the dielectric film 8 and the base rim 38, it may be generally necessary to heat the subassembly.
After the adhesive layer 36 on the base 32 has been properly cured, the subassembly is removed from the compressor unit 48 (FIG. 3b). The lid 34 (FIG. 2), which has been coated with adhesive, is then attached to the subassembly. The subassembly is then subject to a final cure with adhesive on the lid 34 forming a seal between the base 32 and the lid 34. With the particular epoxy described, during the final cure, the subassembly is heated to approximately 150� C. for approximately 2 hours. FIG. 3e shows the subassembly after the base 32 and the lid 34 have been mounted. It should be noted that the base 32 and the lid 34 are mounted onto the subassembly on the dielectric film that exists between the inner leads and the outer leads.
In FIG. 3f, after the subassembly has been cured, the outer leads 18 are coated with a barrier material and a solder layer so that they can be readily solder bonded to their appropriate contact pads on a printed wiring board. An intermediate coating of nickel serves as a barrier to prevent the gold on the copper leads 18 from reacting with the solder while an outer coating of solder, typically a tin-lead alloy, serves as the solder for the outer lead bonding. Both coatings are applied with an electroplating device 88. The electroplating device 88 has a number of electrodes 90 that apply an electromotive potential to the common plane conductor 22 (FIG. 1) located around outer perimeter of the carrier portion 12 of the TAB section 2 (FIG. 1). The electroplating device 88 has a number of jets 92 adapted to apply first the barrier material solution and then a solder to the exposed outer leads 18. The electroplating device 88 also has an inner and outer gasket 94 and 96, respectively, that prevent the applied barrier and solder solutions from flowing over the lid 34 or beyond the portions of the leads that extend beyond the tie-down bars 10.
After plating has been completed and now referring once again to FIG. 1, the debus areas 20 are removed from the TAB section 2 so that the TAB section 2 is subject to final testing. A laser 98 (shown in FIG. 3g) selectively burns the debus areas 20 from the TAB section 2. Socket pins (not shown) are applied to test pads 14 located inside the outer perimeter of the TAB section 2 and then the assembled package is subject to final test. Finally, the tested package (not shown) is excised from the frame (42 in FIG. 3a) between the tie-down bars 10 and a polyimide carrier portion 12. The outer leads 18 are formed into a gull-wing or other profile suitable for making an interconnection.
Again referring to FIG. 1, the electroplating process of this method, described above, provides a convenient method of applying solder to the outer leads 18 of the TAB section 2 prior to outer lead bonding. This process also insures that only the outer leads 18, the only portions of the electrical conductors 6 that need to be coated with solder, are so coated. This process also prevents the gold plating on the test pads 14 from being coated with solder which can subsequently degrade the required electrode-to-test pad conductivity needed for proper extended burn-in testing of the packaged chip.
With the foregoing method of assembly, the electrical connections required by the package can be performed economically and rapidly by automated equipment. Also, the assembly process provides an economical way to apply solder to the outer leads 18 of the package so that those leads can be readily bonded to their associated printed circuit board contact pads. A further advantage of the process is that the TAB section 2 can be affixed to the frame 42 with essentially no warping of the TAB section. In other words, after assembly the TAB tape is essentially planar in the frame. With no warp or damage to the assembled package, it can be assembled flat on the printed wiring board. This also simplifies the attachment of a heat sink to the top of the TAB section 2, i.e., the base 32, since automated equipment can be used to make the attachment to an essentially warp-free package.
The foregoing description has been limited to a specific embodiment of this invention. It will be apparent, however, that variations and modifications may be made to the invention, with the attainment of some or all of the advantages of the invention. Therefore, it is the object of the appended claims to cover all such variations and modifications as come within the true spirit and scope of the invention.
|Cited Patent
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|Methode Electronics Inc
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|Sep 21, 1976
|Amdahl Corporation
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|Jan 3, 1978
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|Mar 31, 1981
|Shinko Electric Industries Co., Ltd.
|Method of making a take-carrier for manufacturing IC elements
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|Sep 15, 1981
|Plessey Incorporated
|Integrated circuit package and lead frame
|Jan 13, 1983
|Feb 5, 1985
|Olin Corporation
|Copper alloys for suppressing growth of Cu-Al intermetallic compounds
|Sep 30, 1982
|Mar 12, 1985
|Storage Technology Partners
|Test fixture for providing electrical access to each I/O pin of a VLSI chip having a large number of I/O pins
|Feb 9, 1984
|Apr 9, 1985
|Mesa Technology
|Testable tape for bonding leads to semiconductor die and process for manufacturing same
|Aug 25, 1986
|Aug 16, 1988
|Nec Corporation
|Method of manufacturing semiconductor device
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|Nov 8, 1988
|Hughes Aircraft Company
|Test connector for electrical devices
|Apr 28, 1988
|Oct 17, 1989
|Texas Instruments Incorporated
|Process of packaging a semiconductor device with reduced stress forces
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|Apr 3, 1990
|Digital Equipment Corporation
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|Dec 18, 1989
|Dec 4, 1990
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|Test probe assembly for testing integrated circuit devices
|Nov 7, 1989
|Dec 25, 1990
|Digital Equipment Corporation
|Outer lead tape automated bonding system
|Oct 11, 1988
|Apr 16, 1991
|Hewlett-Packard Company
|TAB frame and process of testing same
|Aug 26, 1987
|Mar 9, 1988
|Digital Equipment Corporation
|Outer lead tape automated bonding system
|Dec 13, 1988
|Jul 19, 1989
|International Business Machines Corporation
|Tape automated bonding package for a semiconductor chip with decoupling
|Title not available
|Title not available
|Title not available
|Title not available
|Title not available
|Title not available
|Citing Patent
|Filing date
|Publication date
|Sep 17, 1991
|Nov 1, 1994
|International Business Machines Corporation
|Flex tape protective coating
|Sep 30, 1993
|Nov 29, 1994
|Atmel Corporation
|TAB testing of area array interconnected chips
|Jun 29, 1993
|Mar 14, 1995
|Texas Instruments Inc.
|Method for packaging an integrated circuit
|Feb 19, 1993
|Apr 25, 1995
|Lsi Logic Corporation
|Method and apparatus for controlling adhesive spreading when attaching an integrated circuit die
|Nov 23, 1993
|Oct 3, 1995
|Hughes Aircraft Company
|Test apparatus for integrated circuit die
|Aug 12, 1994
|Mar 18, 1997
|Atmel Corporation
|Tab test device for area array interconnected chips
|May 15, 1995
|May 20, 1997
|Poly-Flex Circuits, Inc.
|Method for connecting a die to electrically conductive traces on a flexible lead-frame
|Oct 7, 1998
|May 1, 2001
|Micron Technology, Inc.
|Method for reducing warpage during application and curing of encapsulant materials on a printed circuit board
|Feb 8, 1999
|Jul 3, 2001
|Advanced Micro Devices
|Test arrangement and method for thinned flip chip IC
|Mar 21, 2000
|Dec 17, 2002
|Intel Corporation
|Interleaving a bondwire between two bondwires coupled to a same terminal
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|Micron Technology, Inc.
|Method for reducing warpage during application and curing of encapsulant materials on a printed circuit board
|May 24, 2000
|Jul 15, 2003
|Micron Technology, Inc.
|Apparatus for reducing warpage during application and curing of encapsulant materials on a printed circuit board
|Sep 19, 2000
|May 18, 2004
|Micron Technology, Inc.
|Thermally conductive adhesive tape for semiconductor devices and method for using the same
|Jul 14, 2003
|Jul 20, 2004
|Micron Technology, Inc.
|Method and apparatus for reducing warpage during application and curing of encapsulant materials on a printed circuit board
|Feb 5, 2003
|Dec 14, 2004
|Micron Technology, Inc.
|Method for reducing warpage during application and curing of encapsulant materials on a printed circuit board
|Feb 18, 2004
|Sep 5, 2006
|Cardiac Pacemakers, Inc.
|Method for preparing integrated circuit modules for attachment to printed circuit substrates
|Dec 13, 2004
|Jan 23, 2007
|Micron Technology, Inc.
|Method for reducing warpage during application and curing of encapsulant materials on a printed circuit board
|Jun 20, 2003
|May 6, 2004
|Maute Robert E.
|Conductive fluid logging sensor and method
|Dec 13, 2004
|Apr 28, 2005
|Gochnour Derek J.
|Method for reducing warpage during application and curing of encapsulant materials on a printed circuit board
|Mar 24, 2003
|Jul 14, 2005
|Sumitomo Electric Wintec, Incorporated
|Bonding wire and an integrated circuit device using the same
|Feb 18, 2004
|Aug 18, 2005
|Cardiac Pacemakers, Inc.
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|Aug 21, 2007
|Feb 28, 2008
|Nobuyuki Ashida
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|Tab testing of area array interconnected chips
|U.S. Classification
|International Classification
|Cooperative Classification
|European Classification
|Oct 26, 1989
Owner name: DIGITAL EQUIPMENT CORPORATION, MASSACHUSETTS
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Advantages Of Courting An Escort
Advantages Of Courting An Escort
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Fabrication Services
BRD's wealth of experience in racing car design and manufacture positions it uniquely to provide specialist fabrication services to the motor racing industry. From end to end design and construction of your project, through to manufacturing components to your design or recreating parts that are out of production and/or not readily available, BRD has the capacity to support you in getting your car on track!
BRD has jigs to manufacture Van Dieman parts from 1986 onwards, as well as any parts unique to your car.
DAYTONA Sports Cars
In the late 1990's, MoTeC founding director Richard Bendell began work on the development of a road going sports car inspired by the mid sixties Ford Cobra Daytona Coupe. Borland Racing Developments Pty Ltd was commissioned to build the prototype and develop the chassis for production.
BRD continues to provide fabrication services to the project, with the assembly carried out by each car's owner, under supervision at Daytona Sports Cars' Dromana factory. Information can be found at www.daytonasportscars.com.au or by phoning +61 (0)3 5987 0960.
BRD has the capacity to repair and manufacture components for many sports and racing cars. One of the more famous marques in sports car racing is Ferrari and BRD has manufactured a range of components including fabricated uprights, exhaust system parts, steering hubs and quick release couplings, assorted machined clevises and various fabricated brackets.
Clubman Sports Car
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Chassis Fabrication
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Shock Absorber Service
As an evolution of its ongoing shock absorber development program for the Spectrum Formula Ford, BRD has in house shock absorber dyno and rebuild capability. BRD can assist with development, servicing and rebuilding of a range of shock absorbers to suit your racing requirements.
Historic Restoration
The growing popularity of historic racing has seen some truly remarkable cars being brought back into competition. Many of these cars have not seen light of day for a number of years and have required significant restorative work prior to being race worthy. Others require remedial attention as a result of heated battle. In either case, BRD has the knowledge, skills and passion to restore these wonderful cars to their former glory and manufacture various components as required.
Lola T330
Purchased by Peter Brennan, Lola T330 HV 18 came to BRD for a new tub and various fabrication services.
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While BRD got to work on repairing and reskinning the tub, Derek located new body panels and rewired the car. The rewiring was a blast from the past for Derek, who had subcontracted to TIGA Cars in England as an auto electrician when the factory built their Le Mans racing cars.
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The Elfin 620 Formula Ford is from the first few years of the category's introduction to Australia. Given the strong association that Borland Racing Developments has with Formula Ford in the modern era, it was a great pleasure to be entrusted with the restoration of Bob Morrow's car in the late 1990s.
March 77B
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The Fortress was a building placed in the city of Arcopolis by one of the factions in an intergalactic war. It housed a weapon capable of not only destroying its target, but all evidence that the target had existed and anyone who knew about the target. This meant that anything destroyed by the weapon would effectively vanish. People destroyed by the weapon returned as ghost-like beings who pulled anything they touched out of reality. The weapon was cylindrical and was activated by touch. It was later revealed that the weapon did not function properly.
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Great deal on a well bred palomino TB. Don't miss this opportunity to buy this special filly. she is correct and tall with a nice disposition. Superior…SOLD
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Courtesy of 422race.com
Dr. Lanza to 422race.com on Kubica's situation
Dr. Francesco Lanza, director of Orthopaedics at Santa Corona Hospital in Pietra Ligure, who executed the four operations on Robert Kubica, explains to 422race.com the decision of letting him leave the hospital.
Prof. Lanza, first of all let me ask you how is Robert?
"I'd say he is definitely fine, generally the situation is very satisfying."
And what about his mood?
"The mood as well. Moreover, as far as I know him, he's a person of great character and grit. I'd say definitely the mood is very high."
What made you decide about letting him leave the hospital?
"It was already scheduled, because you can't stay for six-seven months in a hospital. After two months and a half, you should expect that. He needed to start his daily life again. I think that nobody wants to stay in a hospital. It was an agreed decision, but a hypotesis that we have been working on for some time. We were waiting for him to move in autonomy: he was limited by some fractures on which he couldn't put any load and by the shoulder that didn't let him use sticks or crutches. When he gained his autonomy, it was clear that he wanted to go home."
So, we can say everything is going according to plans?
"Definitely. Everything went quite smoothly, luckily."
What are the plans in the next few months?
In the next few months he will have to undergo some checks
"In the next few months he will have to undergo some checks to monitor the healing of the fractures, while he will go on with physioterapy in closet locations to his home. Then he will come back to us to check the evolution."
How often?
"More or less monthly. Then, for the rehabilitation of the hand, for example, he's still working with some physioterapist that were curing him. With us, the rehabilitation is less specific and partly already done: at the shoulder, for example. The rest will be done by others as well, as his doctor, who has a dedicated center for agonistic activity (dr. Ceccarelli)."
As far as his comeback in the car is concerned, what's your opinion at the moment?
"You can't do any prevision, in neither sense. I'd say the perspectives are definitely much better than when we started and this is very important. We can't commit ourselves, but we can't either dismiss anything. His functional recovery surprised us as well: if this will let him do something very specific as driving a Formula One car, it's still very difficult to say. But we have the necessari conditions, even higher than we expected. We can sincerely say we are optimistic that this person could recover a good function of the limb. With the will and the grit he has shown, we can't dismiss anything."
Remind that the bigger injuries were at the nerves, which have long times to heal: at least six months
Did you set a deadline, together with the team and his doctors, to take a decision on that?
"Remind that the bigger injuries were at the nerves, which have long times to heal: at least six months. But we already have encouraging signs of recovery. I think a first stock of the situation has to be done six months after the accident."
So in the summer?
I guess that this surprising recovery was also due to the fact that he has a trained body.
"A trained body and a mental shape with a lot of grit. Even from a psychic point of view, he's very motivated. Maybe because of his job, he's used to have grit in the car and he shows it in all the aspects of life, as well. "
Source: 422race.com


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