text:
Madison_Ba... Model
BeBe ReavesModel Female Memphis, Tennessee, US
My MM URL: http://www.modelmayhem.com/breaves123
Mayhem # 2266361
About MeHello Model Mayhem! I'm in the process of revamping my portfolio and only interested in working with individuals who can help take me to the next level. I have various ideas, concepts, themes that I would love to create much sooner than later. As of now my time is extremely limited so if you are interested in working with me please let me know ahead of time!
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Rupert Yen #1627989 and CCME Photography #1925184
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Rob Personalized Workz #610818
Monday Monday
Brian Anderson
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Tony Glass #129295 <------Still have not received photos from Aug 2012 shoot.
J Anthony
Gregory Lopez #2816252
Sean Richardson
Antoine Lever #2881220
Yolanda Web #2789270
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Wiley Brown Not on MM
L3 Media
Adrion Jones The ATJ Project
William Harrison
Kenny Stylz
and hopefully you..yes you!
Nikki T Fashion Show 2009-10
2011 Summer Explosion Fashion Show
Inspire Magazine #9 Featured Model
Soul Essence Magazine "Model of The Month" August/September Issue 2011
Fabulously Exclusive Clothing
E'lon Magazine Model May Issue 2013
Fashion Amandla Fashion Show
RAW Artist Fashion Show (Maggie Dandridge Designs)
RAW Artist Fashion Show (Victoria B Makeup Artist)
Luster's You Be Natural Model
8shotz "Summertime Vibe" Music Video
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A'Riel Labelle#2721484 ..It breaks my heart that you're gone and that we did not get a chance to shoot together, but I will post your MM on here for everyone to go enjoy your beauty. I love and miss you DEARLY babe.
Madison_Ba... Model
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text:
|Publication number
|Publication type
|Application number
|Publication date
|Sep 6, 2005
|Filing date
|Dec 29, 2000
|Priority date
|Dec 31, 1998
|Fee status
|Also published as
|Publication number
|Benjamin N. Eldridge, Igor Y. Khandros, David V. Pedersen, Ralph G. Whitten
|Original Assignee
|Formfactor, Inc.
|Export Citation
|BiBTeX, EndNote, RefMan
|Patent Citations (90), Non-Patent Citations (6), Referenced by (28), Classifications (26), Legal Events (6)
|External Links: USPTO, USPTO Assignment, Espacenet
This is a divisional application of Ser. No. 09/224,169, filed Dec. 31, 1998 now U.S. Pat. No. 6,456,099.
The present invention relates to integrated circuit (IC) semiconductor devices and, more particularly, to testing the devices.
Large numbers of identical integrated circuits such as microprocessors, memory devices, and digital signal processing devices are generally fabricated on a silicon wafer. Due to defects that may occur during fabrication, each IC (die) on the wafer is typically tested or sorted by test equipment such as automatic test equipment (ATE) machines and probe cards. The test signals are provided to each die through input or input/output (I/O) bond pads on each die, and the test results are monitored on output or I/O bond pads. The good die that pass the wafer-level test are then singulated and packaged typically by electrically connecting the bond pads to the package by means of bond wires, solder balls, or other contact structures. To accommodate the bonding wires or solder balls, the bond pads are generally very large relative to the circuit elements of the integrated circuit. Typical bond pad sizes are on the order of 100 μm (microns)�100 μm (4 mils�4 mils). The bond pads are also typically aligned in regular patterns such as peripherally along the outside perimeter of the die, in a grid pattern, or in a column or row generally through the center of the die (lead-on-center).
The bond pads allow each die as a whole to be functionally tested for specified timing parameters (AC parameters), DC parameters, and overall operation. The bonding pads may also be used to load test patterns and monitor test result from on chip test circuits such as SCAN circuitry and Built-In Self-Test (BIST) circuitry. The on-chip test circuits enhance the overall testing of a die by enabling individual testing of internal circuits or nodes. However, this comes at the expense of increasing the size of the die to accommodate the added test circuitry and additional bond pads needed to support the on-chip test circuitry.
If a die already has all of its peripheral, grid, or lead-on-center bond pad locations dedicated to a device function, then adding additional bond pads in the predetermined bond pad alignment to support the on-chip testing circuitry can result in a substantial increase in the size of the die. Generally, larger die are more prone to defects and consequently more expensive to manufacture. Additionally, on-chip testing circuitry can result in a significant increase in test time as many clock cycles may be required to load test input data and subsequently output test results from a few available bond pads. On-chip testing circuitry also does not allow for direct external access to internal circuit nodes. Test input data and test results must pass through the SCAN circuitry or BIST circuitry before it can be monitored. This introduces additional circuits that can mask failures in the circuit intended to be tested, or can introduce new failures caused by SCAN or BIST circuitry.
Additionally, many designs are I/O limited since only a limited number of leads (e.g., bond wires) may be accommodated in a given packaging scheme. Moreover, to test I/O functionality of a chip, these same lead locations must be used. It would be advantageous to access more points in a circuit, especially for testing. It would also be advantageous if the access points could be located with a high degree of positional freedom. Small size, large number, and arbitrary or selected positioning of the access points would also be advantageous.
One embodiment of the present invention concerns an integrated circuit that includes bond pads and special contact pads or points. The bond pads are for interfacing the integrated circuit as a whole with an external circuit, and are to be bonded to a package or circuit board. The bond pads are disposed on the die in a predetermined alignment such as a peripheral, grid, or lead-on-center alignment. The special contact pads are used to provide external test patterns to internal circuits and/or to externally monitor results from testing the internal circuits. The special contact pads may be advantageously located on the integrated circuit with a high degree of positional freedom. For one embodiment, the special contact pads may be disposed on the die at a location that is not in the same alignment as the bond pads. The special contact pads may be smaller than the bond pads so as not to increase the die size due to the special contact pads. The special contact points may also be used to externally program internal circuits (e.g., nonvolatile circuits) at the die or package level. The special contact points may also be used to select redundant circuits for faulty circuits.
Other objects, features, and advantages of the present invention will be apparent from the accompanying drawings and from the detailed description which follows below.
The features and advantages of the present invention are illustrated by way of example and are by no means intended to limit the scope of the present invention to the particular embodiments shown, and in which:
Special contact pads 112 provide a means for providing test input data to, and monitor signals from, internal circuits 102-106 without having to test the function of the entire integrated circuit. Special contact pads 112 also provide a means for testing internal circuits 102-106 when these circuits are not otherwise individually testable and/or accessible through bond pads 110. For one example, internal circuit 102 may be an embedded memory that is not directly accessible through bond pads 110. Address and input data signals may be provided over several of the special contact pads 112 to provide test patterns to the embedded memory, and another group of special contact pads 112 may receive data read from the memory. The external circuitry providing the test patterns for the embedded memory may provide any number of patterns to increase the fault coverage.
For another embodiment, internal circuit 102 may be a programmable circuit such as nonvolatile memory or programmable logic. Data can be programmed into the internal circuit through the special contact pads 112. For example, BIOS information, program code, and system software may be programmed or updated in programmable circuit 102 after fabrication of integrated circuit 100.
On-chip test circuitry such as SCAN and BIST circuitry may not be required in integrated circuit 100 as test stimuli for integrated circuits 102-106 may be provided directly to special contact pads 112. Additionally, test results may be output to special contact pads 112 rather than bond pads 110. The external test circuitry supplying the test stimuli may provide an increased number of tests without impacting the size of integrated circuit 100. Without SCAN or BIST circuitry included in a test input or output signal path, the likelihood of more accurately determining the location of a failure increases as there is no on-chip test circuitry to mask the failure or to introduce further failures. Additionally, speed parameters or the timing of signals into and out of a circuit block or a circuit node may be more accurately measured and monitored without introducing delays caused by intermediary on-chip test circuitry.
As shown in integrated circuit 100, special contact pads 112 may also work with BIST circuitry 108 (or other on-chip test circuitry) to monitor the response of internal circuit 106 to test stimuli provided by BIST 108. This can be accomplished without having to add additional bond pads 110, or to use existing bond pads 110 to communicate with BIST 108.
As shown in
Special contact pads 112 may also be interspersed between bond pads 110 (e.g., see FIG. 5), or be located outside the region surrounded by bond pads 110. For one embodiment in which special contact pads 112 are interspersed between bond pads 110, it may be advantageous for special contact pads 112 to be smaller than bond pads 110 so as not to increase the size of integrated circuit 100.
Special contact pads 112 may be any size including sizes smaller than bond pads 110. When special contacts 112 are smaller than bond pads 110, more special test pads may be disposed on integrated circuit 100 without increasing the size of the die over that defined by the peripheral bond pads 110. A larger number of special contact pads may increase the number and/or complexity of tests that can be provided to the internal circuit, and thus may increase the fault coverage and robustness of tests. For one embodiment, a bond pad 110 may be approximately 100 μm�100 μm, and a special contact pad may be approximately 5 to 10 μm per side. In other embodiments, the special contact pad may be less than 5 μm per side. For still other embodiments, the special contact pads may be manufactured to have different sizes to accommodate their different spatial locations on the die (e.g., between bond pads 110 vs. within the area surrounded by bond pads 110), to accommodate different dimensions of various probe tips, bond wires, or solder balls, or to accommodate different functions of the circuits under test (i.e., nodes driving output signals may required larger pads than pads for providing input signals, or vice versa). The lower limit for the size of the special contact pads may be limited by the accuracy of the probe-to-pad alignment and the size of the probe.
Special contact pads 112 may be formed into an approximately square shape, rectangular shape, or any other geometric shape. Special contact pad 112 may also have different heights than bond pads 110. Special contacts pads 112 may be fabricated using conventional photolithography processes that are typically used to create bond pads or other, relatively flat, conductive landings. For one embodiment, the special contact pads may be fabricated from one or more metal layers including aluminum, copper, gold, or other metals or conductive materials.
Integrated circuit 100 shows that special contact pads 112 are logically disposed about the circuit block which they test. In alternative embodiments, special contact pads 112 may be physically located at any other location in integrated circuit 100.
Special contact pads 112 may not be permanently bonded out to a integrated circuit package (e.g., typical plastic and ceramic chip packages), rather, the special contact pads may be used for receiving test input information (e.g., address, control, or data) or monitoring internal test nodes or signals. The special contact pads are large enough, however, to receive an electrical contact element (as will be described in more detail below). Given that special contact pads 112 are generally not bonded out to a package, special contacts pads 112 may require significantly less supporting circuitry than is typically required by bond pads 110. Typical bond pads generally include supporting circuitry that requires significant amounts of silicon die are. Examples of supporting circuitry include electrostatic-discharge (ESD) protection structures such as resistors, capacitors, and/or diodes, latch-up prevention circuits such as guard rings, buffers for driving circuits and signal lines external to the integrated device or for buffering internal signals received from external signal lines, logic or voltage translation circuits, and noise reduction circuitry. Special contact pads 112 may reduce the amount of supporting circuitry required. Little no ESD protection may be needed and little or no buffering may be required for an external probe to electrically contact a special contact pad and monitor a signal thereon. For one example, an I/O buffer 120 may be used between an internal test point 124 and a special contact pad 110 as shown in FIG. 3B. The I/O buffer may be controlled by a control signal 122. The I/O buffer 120 may be approximately 10 to 100 times weaker than that required for a bond pad having to drive heavy loads in a PCB environment. Additionally, little or no latch-up supporting circuitry or noise reduction circuitry may be required. For example, a weak pull-up resistor may be all that is required for each special contact pad for noise reduction circuitry. Generally, a special contact pad may require only 1 to 50 percent of the supporting circuitry typically required for a bond pad.
For an alternative embodiment, contact balls 504 need not be formed on bond pads 410.
The embodiments shown in
In response to the data read from memory 702, I/O interface 704 may format the data prior to providing it to I/O drivers 706. I/O interface 704 may receive control signals on special contact pads 714, or internal circuit nodes within I/O interface 704 may be monitored by special contact pads 714. The data output by I/O interface 704 to I/O drivers 706 may be monitored via special contact pads 715. I/O drivers 706 may then drive the data to bond pads 716.
Since special contact pads 713 and 715 and bond pads 716 may be used to monitor the output of each of memory 702, I/O interface 704, and I/O divers 706, respectively, such that incorrect data received at bond pads 716 can be isolated to the circuit which caused the failure. In conventional BIST techniques in which an address, for example, is provided to memory 702, the source of incorrect data received at bond pads 716 would be unknown.
While the embodiment shown in
Special contact pads may also be used to not only isolate failures, but to also enable redundant circuits to be used to replace faulty circuits.
The control signal on line 721 can be driven to the appropriate voltage level or logic state by switch 710. In response to a TOGGLE signal, either voltage V1 or V2 will be selected in response to monitoring the signals at the special contact pads 717 and 715. The TOGGLE signal can be controlled by another special contact pad (not shown).
As discussed above with respect to
Similarly, as shown in
For an alternative embodiment, one or both of pads 1212 may be special contact pads. This may provide for increased design flexibility in the location and use of SCAN circuitry. For example, this may enable multiple SCAN regions or circuits of varying size and complexity to test various different internal circuits or blocks of circuits.
When the special contact pads are available on a die of a wafer, test signals may be supplied to special contact pads, or signals may be monitored at the special contact pads by means of test or probe card assemblies. Probe card assemblies typically include a probe card that has a number of probe elements or contact structures to contact the special contact pads and bond pads. A host controller or other logic device typically communicates with the integrated circuit under test through the probe card.
System 1300 includes a test head 1304 and a probe card assembly 1313. Probe card assembly 1313 includes a load board or interconnection substrate 1306 and cantilevered or needle probe card 1310. Host 1302 communicates test signals with test head 1304. Any type of host may be used including a personal computer, or specialized machines such as Automatic Test Equipment (ATE) provided by LTX, Credence, Teradyne, and others. Test head 1304 typically includes drivers, receivers, and parametric measuring units (PMUs) that communicate signals with load board 1306 and probe card 1310. Load board 1306 is typically a PCB that provides the appropriate mechanical interconnection and load circuits for probe card 1310. In alternative embodiments, load board 1310 may be omitted. Load board 1310 may also include control logic such as logic 1308. Control logic 1308 may be an application-specific IC (ASIC) used to provide tests to die 1311 under the control of host 1302.
Probe card 1310 is a cantilevered or needle probe card that includes cantilevered probes 1318 and 1320 that provide signals to and receive signals from die 1311. Probes 1318 and 1320 may comprise any suitable conductive material including tungsten. As shown in the plan view of probe card 1310 in
Probes 1318 are provided in a predetermined alignment to contact bond pads 1314. As shown in
In another embodiment, probes 1318 may be arranged in a lead-on-center arrangement to align with lead-on-center bond pads on a die, and probes 1320 may be arranged outside the lead-on-center arrangement to align with corresponding special contact pads.
For an alternative embodiment, bond pads 1316 and special contact pads 1316 may be of different heights. For example, bond pads 1314 may be taller than special contact pads 1316 (or vice versa). For this embodiment, probes 1318 and 1320 may extend to different depths. That is, probes 1320 may extend lower than probes 1318 to make contact with special contact pads 1316.
System 1500 includes a test head 1504 and a probe card assembly 1513. Probe card assembly 1513 includes a load board or interconnection substrate 1506 and membrane probe card 1510. Like host 1302 of
Probe card 1510 is a membrane probe card that includes contact balls 1518 and 1520 that provide signals to and receive signals from die 1511. Contact balls or probes 1518 and 1520 may comprise any suitable conductive material including solder.
Probes 1518 are provided in a predetermined alignment to contact bond pads 1514. As shown in
For an alternative embodiment, bond pads 1516 and special contact pads 1516 may be of different heights. For example, bond pads 1514 may be taller than special contact pads 1516 (or vice versa). For this embodiment, probes 1518 and 1520 may have different heights. That is, probes 1520 may extend lower than probes 1518 to make contact with special contact pads 1516.
System 1800 includes a test head 1804 and a COBRA-style probe card assembly 1813. The COBRA-style probe card assembly is available from Wentworth Laboratories of Brookfield Conn. The COBRA-style probe card assembly includes a load board or interconnection substrate 1806, space transformer (either wired or ceramic) 1808, and head assembly 1807. Head assembly 1807 includes upper plate 1809, spacer 1810, lower plate 1811, and COBRA-style probes 1818 and 1820. Like host 1302 of
Probes 1818 are provided in a predetermined alignment to contact bond pads 1814. As shown in
For an alternative embodiment, bond pads 1816 and special contact pads 1816 may be of different heights. For example, bond pads 1814 may be taller than special contact pads 1816 (or vice versa). For this embodiment, probes 1818 and 1820 may extend to different depths (or have different heights). That is, probes 1820 may extend lower than probes 1818 to make contact with special contact pads 1816.
Apparatus 2100 includes a test head 2104 and a probe card assembly 2113 such as that provided by FormFactor, Inc. of Livermore, Calif. One embodiment of probe card assembly 2113 is disclosed in U.S. patent application Ser. No. 08/789,147 filed on Jan. 24, 1997, which is incorporated by reference herein. Probe card assembly 2113 generally includes probe card 2106, interposer 2108, space transformer 2108, and spring contact elements 1218 and 1220. Like host 1302 of
Spring contact elements 2118 are formed in a predetermined alignment to contact bond pads 2114. Probes 2118 may be arranged in a grid array to contact bond pads 2114 aligned in a corresponding grid array pattern. Spring contact elements 2120 may be arranged with the predetermined grid array, outside of the grid array pattern, or interspersed within the grid array pattern to align with corresponding special contact pads 2116 on die 2111. Alternatively, spring contact elements 2118 may be arranged in a peripheral pattern to contact bond pads 2114 arranged on die 2111 in a corresponding peripheral pattern. Spring contact elements 2120 may be aligned in the predetermined peripheral pattern, outside of the peripheral pattern, or within the peripheral pattern to align with corresponding special contact pads 2116 on die 2111. In yet another embodiment, spring contact elements 2118 may be arranged in a lead-on-center arrangement to align with lead-on-center bond pads on a die, and spring contact elements 2120 may be arranged within or outside of the lead-on-center arrangement to align with corresponding special contact pads.
For an alternative embodiment, bond pads 2116 and special contact pads 2116 may be of different heights. For example, as shown in
For an alternative embodiment, as shown in
Structure 2406 can be any shape.
Die 2711 includes bond pads 2714 and special contact pads 2716. Wafer 2712 includes die 2711 and may be disposed on a suitable support structure such as vacuum chuck 2726. Die 2711 may embody an integrated circuit such as integrated circuit 100 of
System 2700 includes a support chuck 2704 and a probe card assembly or test substrate. The probe card assembly includes an interconnection substrate (base plate) 2708, an active electronic component 2710, and spring contact elements 2718 an 2720. Component 2710 includes circuitry for applying test signals to an monitoring the test output from, die 2711. For one embodiment, component 2710 may be an application-specific integrated circuit (ASIC).
Like host 1302 of
System 2700 also includes guide pins 2722 disposed around the periphery of wafer 2712 and the probe card assembly to ensure accurate alignment when spring contact elements 2718 and 2720 are urged into contact with bond pads 2714 and special contact pads 2716, respectively. A compression stop (block ring) 2724, which may be suitably disposed on the face of wafer 2712, limits the amount of travel or distance that the tips of the spring contact elements 2718 and 2720 will deflect when urged against the pads of die 2711.
Spring contact elements 2718 are formed in a predetermined alignment to contact bond pads 2714. Probes 2718 may be arranged in a grid array to contact bond pads 2714 arranged on die 2711 in a corresponding grid array pattern. Spring contact elements 2720 may be aligned in the predetermined grid array, outside of the grid array pattern, or interspersed within the grid array pattern to align with corresponding special contact pads 2716. Alternatively, spring contact elements 2718 may be arranged in a peripheral pattern to contact bond pads 2714 arranged on die 2711 in a corresponding peripheral pattern. Spring contact elements 2720 may be arranged with the predetermined peripheral pattern, outside of the peripheral pattern, or within the peripheral pattern to align with corresponding special contact pads 2716. In yet another embodiment, spring contact elements 2718 may be arranged in a lead-on-center arrangement to align with lead-on-center bond pads on a die, and spring contact elements 2720 may be arranged within or outside of the lead-on-center arrangement to align with corresponding special contact pads.
For an alternative embodiment, bond pads 2716 and special contact pads 2716 may be of different heights. For example, bond pads 2714 may be taller than special contact pads 2716 (or vice versa). For this embodiment, probes 2718 and 2720 are extended to different depths (or have different heights). That is, probes 2720 may extend lower than probes 2718 to make contact with special contact pads 2716.
For an alternative embodiment, spring contact elements 2718 and 2720 may be attached to bond pads 2714 and special contact pads 2716 on die 2711. For this embodiment, component 2710 may include pads to make contact with the spring contact elements. For yet another embodiment, some of the spring contact elements 2718 or 2720 may be attached to component 2710 and some may be attached to die 2711.
As previously described above, special contact pads can be disposed on a die or on packages such as Land Grid Array (LGA) packages. When special contact pads are disposed on packages or on devices arranged in a C4 or flip-chip configuration, they can provide a means for supplying test signals or programming signals to the special contact pad of the die. This may be advantageous to allow, for example, field programming of packaged programmable logic device or nonvolatile devices without having to provide dedicated bonded out pins for the programming function. Additionally, embedded nonvolatile memory arrays that store program code, application software, or BIOS may be updated in the field. Special contact pads disposed on a package may also provide an advantageous means for testing a faulty device and programming redundant circuits to replace a faulty circuit as described above with respect to
PCB 2810 has a plurality of terminals or pads 2818, and package 2804 have a plurality of bond pads 2812 and special contact pads 2814. Socket 2800 provides a means for electrically interconnecting terminals 2818 with pads 2812 and 2814. Circuitry provided on PCB 2810, or in communication therewith, may provide signals to or monitor signals from pads 2812 and 2814 through socket 2800. For example, programmable circuitry within package 2804 may be programmed or monitored through spring contact elements 2816, special contact pads 2814 and/or pads 2812.
Socket 2800 includes a support substrate 2808 formed, for example, from a conventional PCB material. Support substrate 2808 includes spring contact elements 2816 formed on a top surface thereof, and pads 2822 formed on a bottom surface thereof. Spring contact elements 2816 are for contacting pads 2812 and 2814 of package 2804 when package 2804 is urged downward by a forced applied to the topside of package 2804 by retaining means 2802. Other contact elements besides spring contact elements may also be used. Support substrate 2808 also includes electrical conduits 2824 that provide an electrical interconnection between spring contact elements 2816 and pads 2822. For an alternative embodiment, spring contact elements 2816 may be connected directly to terminals 2818.
Contact balls (such as conventional solder balls) are disposed on the bottom surface of pads 2822. The contact balls 2822 serve as contact structures disposed on the bottom surface of the support substrate 2808 to contact corresponding pads or terminals 2818 on PCB 2810. Other electrical contact structures may also be used.
Socket 2800 also includes a frame 2806 that is attached to PCB 2802. Frame 2806 includes landings 2826 to support package 2804. Socket 2800 also includes retaining means 2802 that is disposed over frame 2826 and package 2804. Retaining means 2802 retains package 2804 on landings 2826 such that spring contact elements 2816 remain in electrical contact with pads 2812 and 2814. Any suitable mechanical means may be used for retaining means 2802 including, for example, a spring clip.
In the foregoing specification the invention has been described with reference to specific exemplary embodiments thereof. It will, however, be evident that various modifications and changes may be made thereto without departing from the broader spirit and scope of the invention. The specification and drawings are, accordingly, to be regarded in an illustrative rather than restrictive sense.
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|Semiconductor chip package
|Jan 23, 1995
|Oct 28, 1997
|Micron Technology, Inc.
|Repairable wafer scale integration system
|Sep 28, 1994
|Feb 3, 1998
|The Whitaker Corporation
|Integrated circuit socket for ball grid array and land grid array lead styles
|Jul 28, 1995
|Feb 3, 1998
|Sgs-Thomson Microelectronics, Inc.
|Low-profile removable ball-grid-array integrated circuit package
|Dec 1, 1995
|Mar 17, 1998
|Cascade Microtech, Inc.
|Low-current probe card with reduced triboelectric current generating cables
|Jun 17, 1996
|Apr 21, 1998
|Isaac; George L.
|Semiconductor test socket and contacts
|Dec 20, 1996
|Jun 9, 1998
|Probe Technology
|Dual contact probe assembly for testing integrated circuits
|Oct 18, 1995
|Jun 30, 1998
|Form Factor, Inc.
|Sockets for electronic components and methods of connecting to electronic components
|Oct 3, 1996
|Jul 21, 1998
|Micron Technology, Inc.
|Temporary semiconductor package having hard-metal, dense-array ball contacts and method of fabrication
|Apr 1, 1996
|Jul 28, 1998
|Mitel Semiconductor Limited
|Bare die testing
|Dec 14, 1995
|Aug 4, 1998
|International Business Machine Corporation
|Apparatus and method to test for known good die
|Jan 26, 1996
|Sep 15, 1998
|Texas Instruments Incorporated
|Test socket for detachable IC chip
|Nov 6, 1996
|Oct 27, 1998
|Cerprobe Corporation
|Probe card assembly for high density integrated circuits
|Dec 26, 1995
|Nov 17, 1998
|Lsi Logic Corporation
|Testing and exercising individual, unsingulated dies on a wafer
|Jul 1, 1997
|Jan 26, 1999
|International Business Machines Corporation
|Electronic package with compressible heatsink structure
|Nov 15, 1994
|Jun 29, 1999
|Formfactor, Inc.
|Flexible contact structure with an electrically conductive shell
|Apr 17, 1997
|Jul 13, 1999
|Cerprobe Corporation
|Probe assembly and method for switchable multi-DUT testing of integrated circuit wafers
|Feb 25, 1998
|Aug 3, 1999
|Mitsubishi Denki Kabushiki Kaisha
|Semiconductor device with test terminal and IC socket
|Nov 9, 1995
|Nov 2, 1999
|Formfactor, Inc.
|Method of planarizing tips of probe elements of a probe card assembly
|Apr 15, 1997
|Nov 16, 1999
|Formfactor, Inc.
|Method of temporarily, then permanently, connecting to a semiconductor device
|Apr 15, 1997
|Dec 7, 1999
|Form Factor, Inc.
|Method of testing semiconductor
|May 27, 1997
|Dec 7, 1999
|Formfactor, Inc.
|Stacking semiconductor devices, particularly memory chips
|May 23, 1995
|Dec 14, 1999
|Digital Equipment Corporation
|Socket including centrally distributed test tips for testing unpackaged singulated die
|Oct 10, 1997
|Dec 28, 1999
|Kabushiki Kaisha Toshiba
|Method of manufacturing semiconductor device having a test pad
|Dec 3, 1997
|Feb 8, 2000
|Micron Technology, Inc.
|Method for fabricating semiconductor interconnect having test structures for evaluating electrical characteristics of the interconnect
|Jun 30, 1998
|Feb 8, 2000
|Formfactor, Inc.
|Chip-scale carrier for semiconductor devices including mounted spring contacts
|Aug 27, 1998
|Feb 29, 2000
|Advantest Corp.
|High performance integrated circuit chip package
|Aug 28, 1997
|Apr 18, 2000
|Formfactor, Inc.
|Making discrete power connections to a space transformer of a probe card assembly
|Sep 12, 1997
|Apr 25, 2000
|Micron Technology, Inc.
|Methods and structures for pad reconfiguration to allow intermediate testing during manufacture of an integrated circuit
|Jan 15, 1997
|May 16, 2000
|Formfactor, Inc.
|Wafer-level burn-in and test
|Aug 16, 1995
|Jun 20, 2000
|Texas Instruments Incorporated
|ESD protection circuit for dual 3V/5V supply devices using single thickness gate oxides
|Jul 29, 1997
|Jun 27, 2000
|Fujitsu Limited
|Semiconductor device having tab-leads and a fabrication method thereof
|Sep 30, 1998
|Aug 22, 2000
|Micron Technology, Inc.
|Circuit and method for configuring a redundant bond pad for probing a semiconductor
|Feb 24, 1998
|Nov 21, 2000
|Circuit Line Spa
|Automatic adjustment method for elimination of the centering error during the electrical test on printed circuit boards
|Jul 17, 1997
|Mar 20, 2001
|International Business Machines Corporation
|Chip design process for wire bond and flip-chip package
|Feb 2, 1999
|Apr 3, 2001
|Lucent Technologies, Inc.
|Article for de-embedding parasitics in integrated circuits
|Apr 13, 1998
|Apr 10, 2001
|Qualcomm, Inc.
|Multi-layered shielded substrate antenna
|May 11, 1998
|Jun 12, 2001
|Micron Technology, Inc.
|Probe card having on-board multiplex circuitry for expanding tester resources
|Sep 24, 1998
|Apr 16, 2002
|International Business Machines Corporation
|Integrated circuit having wirebond pads suitable for probing
|Jun 6, 1997
|Sep 3, 2002
|Kabushiki Kaisha Toshiba
|Semiconductor device with flip-chip structure and method of manufacturing the same
|Dec 11, 2002
|Jan 8, 2004
|Formfactor, Inc.
|Test assembly including a test die for testing a semiconductor product die
|Title not available
|Title not available
|Title not available
|Aigner, "Embedded At-Speed Test Probe," Jul. 1997, International Test Conference, Paper 37.1, pp. 932-937.
|Mann, "Southwest Test Workshop," Jun. 9-12, 1996, 10 pages.
|Mentor Graphics, "Design-For-Test Data Sheet Catalog," 1997, 21 pages.
|Mentor Graphics, "Improved Design Quality Through Real Test Solutions," 1998, 31 pages.
|Singer, "VTS 97 Keynote: The Future of Test and DFT," Jul.-Sep. 1997, pp. 11-14.
|UPSYS Reaseau Eurisys, "COBRA Probe Advanced Test Probe Technology-Innovative Qualities Devoted to the Semiconductor Industry," 1996, 4 pages.
|Citing Patent
|Filing date
|Publication date
|Mar 18, 2004
|Jun 13, 2006
|Au Optronics Corporation
|Bump layout on silicon chip
|May 19, 2004
|Sep 5, 2006
|National Semiconductor Corporation
|Bilevel probe
|Jan 19, 2005
|Jul 15, 2008
|Nec Electronics Corporation
|Integrated circuit device with multiple chips in one package
|Feb 21, 2006
|Jan 13, 2009
|Samsung Electronics Co., Ltd.
|Semiconductor device including wire bonding pads and pad layout method
|Dec 30, 2004
|May 5, 2009
|Broadcom Corporation
|Multi-concentric pad arrangements for integrated circuit pads
|Nov 30, 2004
|Jul 7, 2009
|Formfactor, Inc.
|Test assembly including a test die for testing a semiconductor product die
|Nov 7, 2003
|Jan 5, 2010
|Intel Corporation
|Electronic component/interface interposer
|May 1, 2008
|Jun 1, 2010
|Silicon Storage Technology, Inc.
|Method of testing an integrated circuit die, and an integrated circuit die
|Mar 18, 2012
|Dec 31, 2013
|Novatek Microelectronics Corp.
|Integrated circuit device
|May 10, 2012
|Sep 16, 2014
|Intel Corporation
|Space and cost efficient incorporation of specialized input-output pins on integrated circuit substrates
|Feb 28, 2011
|Jan 6, 2015
|Panasonic Corporation
|Semiconductor device including external connection pads and test pads
|Jun 11, 2012
|Aug 18, 2015
|Intel Corporation
|Space and cost efficient incorporation of specialized input-output pins on integrated circuit substrates
|Dec 7, 2011
|Sep 8, 2015
|Taiwan Semiconductor Manufacturing Company, Ltd.
|Circuit probing structures and methods for probing the same
|Aug 3, 2015
|Aug 16, 2016
|Intel Corporation
|Space and cost efficient incorporation of specialized input-output pins on integrated circuit substrates
|Aug 27, 2015
|Aug 23, 2016
|Northrop Grumman Systems Corporation
|Yield enhancing vertical redundancy method for 3D wafer level packaged (WLP) integrated circuit systems
|Mar 18, 2004
|Sep 2, 2004
|Wen-Chih Yang
|[bump layout on silicon chip]
|Nov 7, 2003
|May 12, 2005
|Jeff Burgess
|Electronic component/interface interposer
|Dec 30, 2004
|May 26, 2005
|Broadcom Corporation
|Multi-concentric pad arrangements for integrated circuit pads
|Jan 19, 2005
|Jul 21, 2005
|Nec Electronics Corporation
|Integrated circuit device
|Jan 26, 2004
|Jul 28, 2005
|Renfro Tim A.
|Land grid array membrane
|Feb 21, 2006
|Nov 16, 2006
|Samsung Electronics Co. Ltd.
|Pad structure, pad layout structure, and pad layout method in semiconductor devices
|Sep 19, 2006
|Apr 3, 2008
|Lincoln Global, Inc.
|Non-linear adaptive control system and method for welding
|Dec 20, 2007
|Jun 25, 2009
|Anwar Ali
|Test pin reduction using package center ball grid array
|May 1, 2008
|Nov 5, 2009
|Silicon Storage Tech., Inc.
|Method Of Testing An Integrated Circuit Die, And An Integrated Circuit Die
|Feb 8, 2010
|Oct 21, 2010
|Chien-Pin Chen
|Semiconductor device having at least one bump without overlapping specific pad or directly contacting specific pad
|Feb 28, 2011
|Nov 24, 2011
|Panasonic Corporation
|Semiconductor device and method of manufacturing the same
|Mar 18, 2012
|Oct 4, 2012
|Novatek Microelectronics Corp.
|Integrated circuit device
|Dec 7, 2011
|Jun 13, 2013
|Taiwan Semiconductor Manufacturing Company, Ltd.
|Circuit Probing Structures and Methods for Probing the Same
|U.S. Classification
|International Classification
|Cooperative Classification
|European Classification
|Mar 6, 2009
|Fee payment
Year of fee payment: 4
|Apr 19, 2013
|Maintenance fee reminder mailed
|May 31, 2013
|Fee payment
Year of fee payment: 8
|May 31, 2013
|Surcharge for late payment
Year of fee payment: 7
|Jul 12, 2016
Owner name: HSBC BANK USA, NATIONAL ASSOCIATION, CALIFORNIA
Free format text: SECURITY INTEREST IN UNITED STATES PATENTS AND TRADEMARKS;ASSIGNORS:FORMFACTOR, INC.;ASTRIA SEMICONDUCTOR HOLDINGS, INC.;CASCADE MICROTECH, INC.;AND OTHERS;REEL/FRAME:039184/0280
Effective date: 20160624
|Apr 14, 2017
|Maintenance fee reminder mailed

subset: commoncrawl


text:
Tuesday 11 May 1909
It was Tuesday, under the sign of Taurus. The US president was William Howard Taft (Republican).
Famous people born on this day include Herbert Murrill and Ellis R Dungan.
Sherlock Holmes IV, directed by , was one of the most viewed movies released in 1909
But much more happened that day: find out below..
You can also have a look at the whole 1909 or at May 11 across the years.
Old Newspapers
Have a look at the old newspapers from 11 May 1909 and get them!
Which were the most popular movies released in the last months ?
Find out your future
Get a FREE Numerology report based on the digits of 11 May 1909!
Wish him/her..
Historical Events
Which were the important events of 11 May 1909 ?
- Saint Francis of Girolamo
- Saint Estella
- Holiday of the City of Miskolc (since 1992).
- Saint Odilo of Cluny
- Saint Majolus of Cluny
- Saint James Walworth
- Blessed John Rochester
- Saint Bertilla
- Saint Gengou Gangulphus
- Feast day of the following saints in the Roman Catholic Church: Saint Mamertus, first of the Ice Saints
- Roman Empire - Feast of the Lemures (See Larvae).
- Saint Gauthier of Esterp
Famous Birthdays:
- Herbert Murrill: English composer (d. 1952).
- Ellis R Dungan: American born Indian film director (d. 2001).
- Isaac Azofeifa: Costa Rican poet, politician and educator.
- René Bousquet: French government employee; appointed General Secretary of the Vichy police by Prime Minister Pierre Laval during WW II, 1942, a post he held until the end of the war in 1944.
- Jean Mollaret: Grenoble physician.
- Jean Tusques: Marseille physician
- Ellis Dungan: American director and producer (d. 2001)
- Kurt Großkurth: German actor and singer (d. 1975)
Music Charts
Which were the top hits in that special week of May 1909 ?
Top #2 songs in the USA
- I Wish I Had a Girl - Billy Murray
- To the End of the World With You - Manuel Romain
Search For Your Ancestors
Subscribe to our Newsletter
Don't miss our monthly news, no spam guarantee Click here to Subscribe
...and if 11 May 1909 was your Birth Date then Join our Birthday Club!
Make this date unforgettable
Genealogy: find out your family heritage
Magazine Covers
What news were making the headlines those days in May 1909?
Which were the most popular books released in the last weeks ?
Remember when
What videogames would you be playing back in the days ?


text:
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TrustFire C8 Cree XM-L T6 5 Modes 1000 Lumens LED Flashlight(1*18650)
Brand: TrustFire
Model: C8
LED Emitter Type: Cree XM-L T6
Luminous Flux: 1000-Lumen
Lamp Life: 100000 Hours
Power Source:1 x 18650 Battery (Not included)
Modes: 5 (Hi>Mid>Low>Strobe>SOS)
Input Voltage: 4.2V
Operate temperature: -20 ~ +50 degrees celsius
Switch: Tail cap Clicky/Clickie
Construction:Shakeproof and waterproof
Lens: Coated Glass Lens
Reflector: Aluminum Smooth/SMO Reflector
Current: Digital Regulated 2800mA Current Output (manufacturer rated)
Dimensions: 14.7cm(Length) x 4.5cm(Diameter)
Weight: 0.24 kg
Materal of Product: Aluminium Alloy
Flashlight processing technology:Aerospace Grade Aluminum Body with Anti Scratching Type III Hard Anodization
Had this for about 6 months now and I am impressed.
The settings can switch on u sometimes but I'm pretty rough with it.
Still holding up strong!
Very good product very strong beam . Thanks very much
This is the cheapest costing XML-T6 medium sized smooth reflector flash light I have found. This thing is brite!
I really like this light. It's well built, compact, and very bright. I don't know how they measured the '1000 Lumen' though... (My new Fenix TK-35 820 Lumen is much brighter.)
I really like this light. It's well built, compact, and very bright. I don't know how they measured the '1000 Lumen' though... (My new Fenix TK-35 820 Lumen is much brighter.)
A really good flashlight. The beam is very bright and has a well designed spread.
Bright enough to see quite a distance out but wide enough to see where you are going on a trail.
Regular Price: $11.40
Special Price: $6.99
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Regular Price: $42.00
Special Price: $29.99


text:
There are many cool programs broadcasted by the National Public Radio (NPR). One among our favorites is the TED Radio Hour. Every episode discusses a specific topic and provides excerpts
News & Trends
Most TED talks if not all are thought provoking. The one given by moral philosopher Peter Singer on effective altruism (see Video 1) at TED 2013 Longbeach (CA) is no
The idea of using a robotic dock for iPhone and iPod is not new. Back in 2009, a robot hobbyist has developed a humanoid robot named Robochan which head was
Our friends from Cause Ribbon were kind enough to make us two new ribbons: one for ROS the robotic middleware under a free software license, and the second for TED,
Boston Dynamics make awesome robots! And this new version of BigDog is no exception. As shown in Video 1 below, the new BigDog has what can be considered as a
Robots are tightly connected to our society. The word robot itself was introduced in Karel Čapek's seminal play R.U.R. to raise societal issues. This topic was addressed several time in
As we announced in a former post, the Collège de France hosted in Paris a two days seminar with 10 among the world's most prominent roboticists. For those who couldn't
The Anti-Counterfeiting Trade Agreement (ACTA) is currently discussed at the parliament of the European Union (EU). This treaty can seriously
Few weeks ago, we reported on Harvard's Takktile pressure sensor. This week we highlight a tactile sensor that does contain
We love projects taking different paths than mainstream. It often pays off to think outside the box. This week we
Among the news we highlight this week there is InMoov, a robotic hand with 5 fingers. It's not stronger nor
So many novelties this week! Harvard's Biorobotics Lab made TakkTile, a new tactile sensor, which will for sure have deep
This week, ICRA 2012 is still discussed as well as ROSCon 2012, the first conference on ROS. Among the many
When the Kinect came out, the community quickly found out that it can be used for robotics applications. One approach
This week we highlight the International Conference on Robotics and Automation (ICRA) that was held 14-18 May at St. Paul,
One of the hottest topics this week is funding programs in Europe. In the UK, £1.65 million (approx. $2.6 million)
This week, we highlight two news. On the area of service robotics Panasonic demoed its "shampoo-bot". This head care robot
We don't hear often about Russians in the robotics field. But, when they show up, they are impressive. About two


text:
Nasty Black Knob-Slobbers 2Favorites [+]
Pay-Per-Minute Viewing
You can now enjoy this movie on your iPhone®, iPad®, or compatible Smart TV & Android devices.
Purchase Options
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DRM-free downloads offer content that is not limited by standard Digital Rights Management (DRM) access technologies. These technologies allow hardware manufacturers, publishers, copyright holders and individuals to limit the usage of digital content.
When you purchase DRM-free downloadable content, that content is available for you to download on any computer and save to a disk whenever you like. You can also download to multiple computers. There is no timeframe associated with your purchase and the content will not expire.
Running Time: 91 minutes
Released: 05/2006
Studio Name: Alibi Entertainment
Series: Nasty Black Knob-Slobbers
Director: Rayne Man Shonn Black
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text:
Anti Islam group patrolling Dublin
AN anti-Islamic group who have started street patrols in several Irish towns in recent weeks say they are not thugs, but will defend themselves if necessary.
Soldiers of Odin (SoO)was formed in Finland last October, carrying out street patrols which they said were to protect people, particularly women, from attacks from immigrants.
Their founder, Mika Ranta, is a self-confessed neo-Nazi with a conviction for a racially-motivated assault.
An Irish branch of the group was set up this year and is led by a Portuguese man living in Carlow. They have posted pictures of themselves carrying out "patrols" in places including Dublin, Wexford, Laois and Kilkenny.
The group take pictures of themselves on patrol with their backs to the camera and are unwilling to show their faces. There are only around a dozen people in the pictures and it is understood several are immigrants to Ireland.
They also seem confused on where they stand on many issues, continuously contradicting themselves.
While online they boast about being "ready to rumble" with anti-racist groups, they told the Sunday World they were non-violent. They also say they want to protect women from sex attacks, but a leading member of the group posted online that he hoped a woman and her family were gang-raped.
They also seem confused about their stance on gay people. They attended the Gay Pride festival last weekend saying they were there to prevent anyone attacking it, but weeks earlier they attacked gay people online, calling them the "gaystapo" and warning "no homosex" would be tolerated
A spokesman for Soldiers of Odin Ireland told the Sunday World the aim of the group was to "highlight the evils of Islam and to start the debate on how followers of Islam demand that we respect and conform to their ways".
He said the group was non-violent, but added: "We will defend ourselves if necessary."
Asked why the group are unwilling to reveal their identities, he said: "People will immediately assume that you are some kind of thug. This is far from the truth. Even the media will portray us the same. This can lead to problems in work and family life."
He said the group was made up of many different nationalities and religions, but confirmed there were no black members.
Asked what the purpose of the patrols was, he said: "Patrols are carried out if we are told of problems in particular areas."
Following a recent visit by SoO to Monasterevin, in Co. Laois, another group called Anti-Fascist Action visited the town to distribute leaflets describing SoO as "violent far-right thugs".
An AFA spokesperson said: "We cannot allow racist thugs to create division in our communities, or attack people because of their nationality, colour or religion."
Shane O'Curry, Director of the European Network Against Racism, described SoO as a "very marginal group of sad individuals trying to make themselves relevant".
He added that the fact they hide their identities was not surprising.
"It's consistent with their level of engagement. They're cowards. They're clowns really."
After being unable to explain many of the contradictions, the SoO spokesman ended our conversation, saying "do not contact us again".


text:
I purchased this.
Today, I have an autumnal look using four eye shadows from Oslo Cosmetics--Andromeda, Volantis, Tuscana, and Carinae.
I had a little trouble blending out both Andromeda and Tuscana. It took a lot of extra work with those two shades to get them to blend out. I do like how they look in the end, though.
All pictures taken in indirect sunlight with flash fill.
What I Used:
Too Faced Shadow Insurance
Oslo Volantis on lid and beneath lower lash line
Oslo Andromeda in crease and beneath outer 1/3 of lower lash line
Oslo Tuscana above crease
Oslo Carinae to blend out Tuscana
MAC Blanc Type to highlight tear duct area and beneath brow
Hello Kitty Pen Pal Eyeliner in Chocolate Milk along upper lashes
Milani Shadow Eyez in Espresso Line on waterline (I am not happy with how this didn't stick!)
Chinovi Cosmetics brow powder in Dark Brown and Dark Auburn


text:
So you put your hard-earned cash down for the brightest of them all smartphones, the Samsung Galaxy Note 7. Not a bad choice at all- it got 5-star reviews from most if not all reviewers for its usability as a work and play device as well as being quite so easy on the eye.
However, it was not to be... Samsung's pride and joy started exploding whilst on charge and then just randomly. And the incident wasn't restricted to a couple of contries, it was a worldwide issue and led to Samsung announcing this week that they were going to stop production on the device, refund customers and put an end to this very sorry and financially ruining experience for them.
But what about you, the customer who shelled out over £729 for the latest and greatest and now have to contend with the Samsung S7 edge, even though it is a great phone?
From £499
Not only did the slim and stunning number pick up the gong for Most Innovative Device at the Mobile Choice Consumer Awards 2016, but it also blew us away with the pricing.
Lenovo have done modular design right and you can pick up mods that magnetically attach to the phone to give it extra features and options and even looks! You can pick from the Hasselblad Camera module to a battery pack module and even a Kate Spade designed battery cases… The only drawback? No 3.5mm headphone jack.
Winner of Phone of the Year at the Mobile Choice Consumer Awards 2016, you cannot go wrong with the sublime S7 edge. And if you have a Samsung Smart TV and smartwatch, more the merrier!
Heavily discounted by Samsung and with a range of delectable offers from networks, you are guaranteed a fantastic user experience and one of the best camera phones in the market. Premium looks, the grunt power to put most other phones to shame, this is the closest you can get to a Note 7 you can get!
Sony's latest flagship brings in the range of innovation and performance you would expect from one of the olderst names in the electronics business.
Powered by a 64-bit octa-core Snapdragon 820 processor with an Adreno 530 GPU and packing 3GB of RAM, the XZ is perfect for those looking for a handsome device with the internals to take you through a very long day of work and play. The 2,900 mAh battery comes with Battery Care, STAMINA mode, Qnovo Adaptive Charging and Qualcomm's Quick Charge and Sony have hit it out of the park with the 23-MP rear and 13-MP front cameras.
£599 (32GB) and £699 (128GB) and Pixel XL at £719 (32 GB) and £819 (128GB)
Launched on October 4, the Pixel is everything you would want from a top of the line Android-powered device. Android 7 without any unnecessary frills, great cameras and the might of Google behind it, including Google Allo, make it one of the best devices to launch this year.
The part-glass, part-metal body might not be to everybody's liking but it comes with 4GB RAM and Qualcomm's latest and greatest Snapdragon 821 processor. Unlimited storage on Google Photos is great news for selfie-addicts and will make sure you dont miss the lack of adoptive storage at all. Maybe just a little tiny bit.
A workhorse of a phone, partly down to Apple's best: the A10 chip, the iPhone 7 Plus towers over its competitors. Sleek, beautiful and utterly gorgeous, the improved battery life, aesthetics and the stunning screen make sure this is the true competitor to the Note 7 with all its productivity features.
Download all of Apple's productivity apps and switch seamlessly between your iPad, MacBook and phone with ease. There is a dual lens camera onboard and 4K video recording for when you want to step away from work and take pictures on holiday instead!


text:
By Jon Saraceno, USA TODAY
At first blush, Marion Jones seemed to utter, and blubber, all the right sentiments with her admission, whiplash-producing as it was for some naïve souls, that she is indeed an Olympic drug cheat who also lied to the government about using steroids.
She apologized to family, friends and nation, deploying hackneyed but highly emotive phrases like, "I betrayed your trust," and, "I have let my country down." The disgraced track and field diva spoke haltingly about the "pain and hurt" she caused, asked for forgiveness and then, just like that, was gone without answering questions, retired from the sport that, she said, "I deeply love."
Perhaps Jones, the once-charming and graceful athletic supernova, was auditioning for a new career: acting. If so, when the curtain of credibility is pulled back, I don't find much believability in her role of unwitting track and field marionette duped by rogue coaches and ex-lovers.
Then again, the poor woman — more on the poverty part — had little choice but to cast into the pool of public opinion in hopes of salvaging a shred of integrity and, perhaps, future income. After all, she is only 31, an unemployed athlete with a bleak economic situation, if you believe her.
In court documents, Jones claims to be all but financially busted. Makes you wonder what happened to all of those millions generated from Nike endorsements and other appearance fees. Where could it all disappear so fast … perhaps into an offshore account in the Caribbean? She is a citizen of the USA and Belize.
With her career and reputation in shambles, and cornered by the feds with nowhere to sprint but straight toward a plea agreement, Jones took her pathetic case Friday to a weary and, I hope, wary American public. She admitted guilt for making false statements to the government relating to using performance-stimulating drugs and for lying to federal agents regarding check fraud. A prison sentence of three to six months is likely to ensue.
But Jones also wants us to believe that she never knowingly used designer chemistry, that she was given a substance, "the clear," and told by her former coach, Trevor Graham, that it was flaxseed oil.
Does the fictional drama sound familiar?
In this instance, Jones wants an * beside her name. Poor thing, she had no idea.
Her story flunks the smell test. Again.
We're supposed to believe Graham gave her THG, told her to keep mum, then she was surprised to learn it was dope? There are other inconsistencies in her timeline and evidence of other illegal drugs.
Whatever Jones is trying to sell, including contrition and perhaps the rights to her life story, I'm not buying. She should:
Give back her Olympic medals.
Give young athletes the right message.
Give us the full story.
The International Olympic Committee plans to step up its probe of her five-medal sweep at Sydney in 2000. She could be stripped of all five, including three gold. If Jones has any sense of fair play, she will do the decent thing and return the medals (regardless if some of the competition was no athletically purer than she was).
During her mea culpa on the federal courthouse steps, Jones should have denounced steroids. She couldn't even bring herself to use the dirty eight-letter word.
"Making these false statements to federal agents was an incredibly stupid thing for me to do," she said.
She told us of her shame but not of a plan to rectify the wrong. That would have included an immediate strong public denouncement of steroid use by athletes. Of course, that would require Jones to first acknowledge that she knowingly and intentionally used them. Instead, she gave us an admission of being stupid by lying to the government, not a full doping disclosure.
In a letter leaked to The Washington Post, Jones told supporters she wanted to "shed much baggage that has been tearing me down for a long time."
"I want to share with you all my humanness," she wrote, further stating that she realized the "need to be up front and honest with you" because she had "tapped around the truth for too long."
"I hope that one day I will be able to share with you, and the world, my struggles with certain things in my life. And in addition use my story to help direct, motivate and possibly even inspire young people to make better decisions in their lives."
Sounds more like a desperate query letter to a book publisher to me. Still, that sort of touchy-feely stuff goes over well with the public, which is why Jones offered up her weepy "confession." She has only contempt for the system. Once the public realizes it, it will stop being conned by another one of our so-called American "heroes."
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I have been on my trip to the US and Canada and it should have been a trip of a lifetime, well it wasn't all that as it did have some issues and disappointments.
I won't go in to details, but thank you to a number of people that made the trip bearable and still enjoyable for a good part of the trip.
On the quilting front not much is happening at the moment and I am hoping to get in to sewing very soon.
While in Canada we were lucky to meet Linda Franz from Inklingo and what a lovely lady she is.
Go and check out her website as it will change your mind about hand piecing verses paper piecing.
I am going to give it a go and with her blessing will look in to teaching some classes soon.
The other thing I finally managed and yes don't laugh is hand quilting using a hoop, many of you know I teach lap quilting and have tried many many times to use a hoop and thimble.
After taking a one day class with Nadine Thompson the penny dropped, I won't stop lap quilting but I will now include quilting in a hoop. Yay for me and thank you Nadine.
Baltimore on the Prairie was wonderful, great tutors, great organisers, wonderful food and lovely accommodation. I would like to return if funds permit.
New York was interesting but to busy for my liking and the hotel was terrible. Yes it was central but did not feel safe or comfortable at all, nor was the accommodation in Omaha.
I guess paying the amount we did for the trip I would have thought all our accommodation would be of similar standard to what we had at Niagara Falls or Toronto.
I loved purl soho, a beautiful shop in New York and wonderful staff. Thanks to Glen we did find two lovely quilt shops in Omaha and also thanks to some lovely ladies at Baltimore on the Prairie for driving us Aussie to the Quilted Moose, great shop amazing choice of fabrics and yes we did send parcels home.
Washington DC was a great place to visit and I would go again with my husband, four of us got to the Dar museum only to be told they have just taking down a quilt exebition and that there are none for us to see.
I had met a lady at BOTP and she told me about quilts in the back room that are there to pull out, we pleaded with the young man setting up a new exebition. He got permission for us to go and have a look at them.
Well , they included the Mary Mannakee quilt and five other appliqué quilts, we could take pictures but are not allowed to show them here. Trust me they made the trip worth while.
Anyway that is enough from me for now, I will be back shortly with some picture.
Have a great day


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Moderator: Niels THØGERSEN, President of the ETTW
This panel will take the form of a question-and-answer session with the EU institutions. What is on their agenda, both for defending free movement rights and for promoting common policies on migration? What are the priorities as seen from the perspective of migrant and diaspora organisations?
Moderator: Andris GOBIŅŠ, member of the EESC
Questions for debate:
Moderator: Peteris ELFERTS, Ambassador at Large of the Ministry of Foreign Affairs of the Republic of Latvia
How can public support be increased for free movement on the one hand, and migration on the other? Is it a matter of finding a new discourse, or should it involve action on the ground? The panel will explore such questions, using examples of specific areas of tension over free movement, from Switzerland, Belgium and the UK.
What conclusions can we take from this event to the high level conference in Riga on 11-12 May 2015?
Participants can speak: German, English, French, Dutch and Latvian
Participants can listen to: English, French and Latvian
Only the persons registered can participate


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Cindy Hooks Morrison, M.S., CCC-SLP, CLC Did you know that when you snuggle your sweet baby in your arms and offer them a bottle that they are beginning a newborn feeding work out? In order for your baby to meet their nutritional needs, newborns need to be able to do three things during feedings. They need to suck, compress (provide pressure on a nipple) and coordinate their breathing to protect their tiny airways. As you feed your baby, … [Continue reading...]
Newborn Feeding Work Outs
End Mealtime Battles With Happy Eating Club
Today I had the pleasure of connecting with a wonderful mom, Kirsten, who participated in Happy Eating Club last year and still uses what she learned with her family. Kirsten and I discussed her experience in the program and where her family is now, almost a year later, in their feeding journey as they consistently utilize the information, strategies and resources she gained in Happy Eating Club. Happy Eating Club is a flexible 14-day program … [Continue reading...]
Are newborn reflexes causing your baby's bottle refusal?
Cindy Hooks Morrison, M.S., CCC-SLP, CLC Your baby was born with eight, innate, oral motor reflexes to help facilitate successful mealtimes. All of these reflexes have important roles, but two reflexes, rooting and sucking, are specifically helping you with every feeding during the first four months of your baby's life. The root reflex is activated when an infant's lips and mouth are lightly touched. This causes your baby's mouth to open. … [Continue reading...]
6 Questions To Ask Before Choosing A Picky Eating Course
Since the launch of Happy Eating Club in 2014, a variety of picky eating course pop-ups have emerged on-line. Some are being offered by licensed and credentialed health care professionals and some are being offered by popular, non-clinically experienced food bloggers selling meal plans. As new moms navigate through the marketing, it's becoming a bit more confusing to determine which course to choose. Here are six top questions to ask when … [Continue reading...]


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Earlier I stated to praise someone's looks even if not attractive. I forget who told this story, so I apologize about my old brain cells.
There was a Queen who'd gotten older. The King seldom called her into his bed, preferring much younger and riper ladies of the Court. She grew deeply sad, stopped caring about her looks, and declined in beauty.
Two passing gods noticed her sadness. They made a bet. One bet that she could make the Queen beautiful again. The other god picked who they would make fall in love with her.
A quiet minor treasury clerk was chosen to fall in love with the Queen. He was ignored by all the women of the court, and hardly handsome. When the spell was cast, he saw the Queen for who she could be. He was astounded by the difference. She was golden, sweet, caring, and lovely beyond compare.
It took his breath away. He could barely concentrate on his work. He began to make any excuse at all to be by her side. The slightest glance in his direct made his heart pound.
He wrote about it in his journal, but ached to tell her somehow. He began praising her in court to anyone who would listen. Some saw glimpses of her accomplishments, and word spread. The Queen heard murmurs, and felt flattered. She smiled more. She felt noticed. She held herself erect. She spoke with even more care, desiring more praise. She was careful about what she ate, since she she loved the complements of her Court.
The clerk grew bolder. He sent a tiny note, saying how much she meant to him. That she was his dream woman. That she was the perfect person for him.
The Queen grew curious. Her heart beat faster. Color filled her cheeks. She laughed. She stopped criticizing her court. She didn't know who wrote the note, but it was more precious than any gold or jewels. She couldn't bear to say a harsh word to someone who might have written the magical words.
By accident, she made the smallest complement to the clerk. His heart soared. He felt like a lion to be noticed, not a mouse to be stepped on. He wrote more notes. He risked saying what was in his heart.
The King could not help but notice his wife. What in the world had happened? She had always been beautiful. He'd loved her as a girl. Suddenly his old friend, comrade, and lover had returned.
The ladies of the Court grew concerned. Their praise and complements seemed more desperate and less sincere. They seemed to turn on each other, in their competition for the King.
The King praised the Queen. She was so different from her tired, run-down self. He praised her saying, "You've returned to the same sweet girl I fell in love with."
The clerk noticed the King's affections. He loved the Queen, but loved his King too. He was happy that she was happy. Somehow, by loving the Queen, he'd been transformed into a new man too. She became his Muse. She inspired him, and it made him want to be a better man.
The woman of the Court noticed him for this transformation. He never got over his love for the Queen, but he also felt admired for the first time. People talked about the clerk. The King and Queen heard praise about his work. They promoted him, and in doing so, helped him ensnare the heart of a lovely maiden.
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DaisyTrail Digikits - now with extended commercial rights!Posted: 26th February 2013 Category: DaisyTrail News By: jogaskin
Hi everyone,
Since 2008 when we first started creating digikits to go with our crafting software, we have often received queries regarding the commercial use of our kits.
DaisyTrail veterans will know that we have revised our License Agreement a couple of times to try and meet the needs of our customers, with the most recent version offering Angel Use for all our kits.
Well, further to this, I'm pleased to say that we have now decided to offer our customers extended commercial rights when using any DaisyTrail or CraftArtist branded digikits.
This excludes the free kits and any kits created by our third parties. DaisyTrail free kits are still covered by the Angel Policy.
In a nutshell, this means that:
• You may incorporate any of the digikit contents into an original work to publish, display, distribute and commercially exploit in any media.
• You may not sell the Digital Content available in any form detached from the Original Work.
To make these terms clear, we thought it might be an idea to answer some FAQ's that you can keep on file:
1. Can I create my own digikits to sell or give away for free using the CraftArtist or DaisyTrail kits?
As the creators of the graphics, Serif and DaisyTrail own the copyright for them and we do not permit the distribution of them as individual items in any form (this would include, for example, providing a download to an individual element on your website, or creating a page of stickers using the graphics to sell). You can, however, use the graphics as part of a design (original work) to sell or distribute in any form.
2. Can I use the digikits to create items like cards, templates or party crafts to sell?
Yes. You can now create an unlimited number of physical or digital items like cards to sell with our digikits. You may also get those items professionally printed if you wish. You cannot provide those designs as separate graphics to another person, however. For example, you could design a wedding invitation and have it professionally printed, but you cannot give the separate elements of the invitation to your client.
3. Can I use the digikits to create items such as leaflets, web banners or brochures for the promotion of my business?
Yes. You can use our digikits to promote your business in any form. You may also get those items professionally printed if you wish. However, you cannot use the graphics as part of your business branding or trademarks and you cannot distribute individual graphics to a third party. They must be part of an original work as a flattened image (e.g., a JPEG).
4. If I create something using the graphics from a digikit, does that mean I own the copyright for it?
No. We retain the copyright on all graphics created and sold by us as we are the original creator of them.
5. Can I use the graphics from a kit on my website or blog?
Yes. There are restrictions on this however: the graphics must be contained within a flattened image (for example, a JPEG), and they cannot be made available for download separately or sold.
6. Can I use the graphics to create my company logo or trademark?
No. You cannot use the graphics in any way to form part of your business branding.
As with all License Agreements, ours does contain more terms, so I would advise you read it fully before using the kits in a commercial sense.
Click here to view a PDF of our new End User License Agreement (EULA). This is accepted by you when installing any of our digikits. This new EULA applies to all our DaisyTrail or CraftArtist branded digikits from now on (including old kits which contain an older version of this agreement).
If there is anything you are not sure of, please contact our DaisyTrail support team for advice.
Win a subscription to a craft mag of your choice!Posted: 18th February 2013 Category: DaisyTrail News By: jogaskin
Happy Monday everyone
We've got an exciting competition for you to enter today. Our friends at Practical Publishing are giving you the chance to win a year's subscription to a craft magazine of your choice!
If you win, you can choose which one of these magazines you'd like a subscription for: Simply Homemade, Complete Cardmaking, Simply Cards & Papercraft and Crafty Magazine.
If you'd like to win one of these subscriptions, visit www.ppjump.co.uk/foursubs and fill in your details to be entered into the prize draw. You have until 29th March 2013.
Visit http://www.practicalpublishing.co.uk/our-publications for more information on the magazines.
Good luck!
WIN! Hobbycrafts tickets!Posted: 4th February 2013 Category: DaisyTrail News By: jogaskin
*This competition is to win tickets to a UK craft show - please do not enter if you cannot attend the show*
Hi everyone,
As you might have heard, we are exhibiting at the Hobbycrafts Show, Birmingham NEC, 21-24 March 2013.
At the show we will have our BIGGEST EVER CRAFTARTIST SALE - featuring digikits for just £1! We've also got 15 golden tickets to find at the show - each one making you an instant winner of amazing prizes like digital cameras, digikits and signed artwork!
So, if you are free to attend the show and would like to win a pair of tickets, all you have to do is:
- Design a 12 x 12 scrapbook
- Theme: nature
We will pick 6 winners on Monday 11th March at 9am GMT, so make sure you get your entry in before then!
The challenge can be found here. Enter your scrapbook by uploading your entry to DaisyTrail, then clicking the 'Share this project' link on the right hand side. You should then see 'Challenges' - choose the 'WIN! Hobbycrafts Tickets' challenge and click OK.
Good luck!
Winners of the Brannigan Bear challenge!Posted: 4th February 2013 Category: DaisyTrail News By: jogaskin
Morning everyone, and happy February :)
It's time to announce the winners of the Brannigan Bear competition!
So, in no particular order, our 3 winners are:
and SunnyD!
Congratulations to you all, you have each won a copy of the Brannigan Bear DVD. Please message me to claim your prize!


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Category: Online Business
How to Sell More Online: 40 Tips for the Small Online Entrepreneur
Want to succeed online and increase the sales of your online store? Check out our new book available in Amazon Kindle "How to Sell More Online: 40 Tips for the Small Online Entrepreneur"
How to Spy on Your Competitors Online
Understanding your web traffic is the first step to winning online. You also need to know what your competitors are doing to succeed on the Web today
The Risk of Your Website Not Earning Money
You've created your website for your online business, but alas, it is not earning money. Learn the steps you need to do to reverse the situation and get your website to start earning money.
Review of Amazon CPM Ads
Amazon has entered the online advertising space with its CPM Ads Program. Will Amazon CPM Ads program beat Adsense? Read a review of the Amazon CPM Ads
Amazon CPM Advertising Program Offers New Way for Publishers to Earn Money
Amazon CPM Advertising Program offers new way for online publishers to earn money from advertising. Learn about the new CPM advertising program from Amazon, and whether this is a right program for you.
The Risk of Getting Penalized by a Google Algorithm Change
Imagine that you lost 60-80% of your Google traffic? Here are things you need to do to recover from a Google algorithm change resulting in a sharp drop-from-a-precipice traffic loss.
The Risk of Getting Infected with Malware
Malware is a serious problem on the Web. While you may initially think that malware is not a problem that will affect your website, think again. Learn how to protect your website from malware.
The Risk of Displeasing Google
Whether you agree or not, Google is the lord and master of the Web. Understand the risk of displeasing Google, where you start losing your organic search engine traffic.
The Risk of Getting your Website Hacked
Hackers are not just after the big businesses, government and the military. Even websites owned by small businesses are at risk for hacking and other malicious attacks. Learn how to minimize the risk of getting your website hacked.


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Download the Game Design and Indie Game Marketing Freebook 07/19/17GameDev.net and CRC Press have teamed up to bring a free ebook of content curated from top titles published by CRC Press. The freebook, Practices of Game Design & Indie Game Marketing, includes chapters from The Art of Game Design: A Book of Lenses, A Practical Guide to Indie Game Marketing, and An Architectural Approach to Level Design. The GameDev.net FreeBook is relevant to game designers, developers, and those interested in learning more about the challenges in game development. We know game development can be a tough discipline and business, so we picked several chapters from CRC Press titles that we thought would be of interest to you, the GameDev.net audience, in your journey to design, develop, and market your next game. The free ebook is available through CRC Press by clicking here. The Curated Books The Art of Game Design: A Book of Lenses, Second Edition, by Jesse Schell Presents 100+ sets of questions, or different lenses, for viewing a game's design, encompassing diverse fields such as psychology, architecture, music, film, software engineering, theme park design, mathematics, anthropology, and more. Written by one of the world's top game designers, this book describes the deepest and most fundamental principles of game design, demonstrating how tactics used in board, card, and athletic games also work in video games. It provides practical instruction on creating world-class games that will be played again and again. View it here. A Practical Guide to Indie Game Marketing, by Joel Dreskin Marketing is an essential but too frequently overlooked or minimized component of the release plan for indie games. A Practical Guide to Indie Game Marketing provides you with the tools needed to build visibility and sell your indie games. With special focus on those developers with small budgets and limited staff and resources, this book is packed with tangible recommendations and techniques that you can put to use immediately. As a seasoned professional of the indie game arena, author Joel Dreskin gives you insight into practical, real-world experiences of marketing numerous successful games and also provides stories of the failures. View it here. An Architectural Approach to Level Design This is one of the first books to integrate architectural and spatial design theory with the field of level design. The book presents architectural techniques and theories for level designers to use in their own work. It connects architecture and level design in different ways that address the practical elements of how designers construct space and the experiential elements of how and why humans interact with this space. Throughout the text, readers learn skills for spatial layout, evoking emotion through gamespaces, and creating better levels through architectural theory. View it here. Learn more and download the ebook by clicking here. Did you know? GameDev.net and CRC Press also recently teamed up to bring GDNet+ Members up to a 20% discount on all CRC Press books. Learn more about this and other benefits here.
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[quote name='sunandshadow' timestamp='1339101762' post='4947182'] Personally I prefer roleplaying communities where there are a variety of worlds to play within at any given time. I mean, some days you wanna be a dragon, other days you wanna be a spaceship pilot, other days you wanna be a tribal warrior, right? And some people like a more cheerful world, while others like a more gritty one. [/quote] There are lots of post-by-play forums that span genres, universes, fanfic-doms and such already. I think my desire is to weave one tale with many stories centered in it. To make real world that can stand up on its own, alongside other players and writers. I have different things I want to do on a day by day basis as well, but (to me) that is what my bookmark bar is for [quote name='Stormynature' timestamp='1339099454' post='4947172'] You might look at it from the perspective of a team of writers as used in television shows etc. An overarching set of guidelines for development are established and then individual episodes are farmed out to individual writers (or smaller teams within the larger team) to bring out about the required guideline's immediate needs as well as create their own story within that "universe". [/quote] That strikes a chord with the feeling I get when I think about this project ^^ Perhaps it's just a matter of finding the right writers.
I ran a roleplaying board with a small team of administrators for five years. It was good fun, but after a while, story lines become recycled if you don't have a moderation team that is dedicated to throwing prompts out to people and such. I'd never considered the idea of a matchmaking system before -- though I do really want to make good use of user profiles so that they're actually used for current In-Character information and not as an afterthought. I've got the premise and name of this open world already hashed out and reserved, as it were...Ideally, main draw to this 'game' would be interacting with the world, though a gallery and commission area would be very helpful! Maybe some things I've previously written will help better communicate what I'd like this thing to offer: [quote][b]Social Roleplay[/b] The Play that many RP sites offer is highly social and focused on relationships. Etherwyrld is no different, in that relationships are vital to the life of the board. [b]Progressive Roleplay[/b] This element of Play separates Etherwyrld from some other boards because the character you create can indeed grow and become stronger than they were when they started. This is usually achieved through quests and threads similar to them. [i]Character Progression:[/i] An individualistic level of progression that allows for different characters to grow themselves via skills, (levels) and the sort. [i]Plot Progression:[/i] An individual/group level of progression that explores differing plotlines. This can be thought of much like a scavanger hunt or an easter egg hunt. During a plot, more information about the Wyrld will be revealed. [i]Board Progression:[/i] As different plots progress, the board itself will change. Board-wide changes entail moving forward in the Wyrld's history and watching how things have progressed. Board-wide changes (called Chapters) will only happen once all the plots for that 'time period' have been exhausted. [b]IRC Events[/b] The Wyrld can also be accessed over Internet Relay Chat as well as on the forums! We host certain real-time RP events for the whole community. It is always open for members who want RP in a semi-free-form and quick way. Chat logs are usually cleaned and posted to the forums after a scene or a plot has finished.[/quote] I'm not even sure this is viable to maintain as a writer -- to guide a collaborative plot line that spans an entire world or even how to really manage it. I think that is where I keep getting snagged. What does guiding a collaborative plot look like? Maybe the key really is in pen-and-paper table top GMing.
I don't actually want to make a table-top RPG xD (Though I will definitely look over those sites.) It's more that I want to make an interactive RPG community that mixes text, artwork and roleplaying in an open world to make a story in which players actions make a difference in the long-term story of this world Akin to what Elder Scrolls MMO is doing with some of their ideas on questing and such...but in a completely different setting with completely different lore (and absolutely no big budget).
viriesque posted a topic in Writing for Games[b]Preface:[/b] Back before consoles and computers, there were games. I'm sure plenty of us have made character sheets and played Dungeons & Dragons, where imagination and interaction with others are keys to making the game a fun experience. Even after computers became household objects, imagination was important -- in games like Zork, or other text-only adventures, writing was all the user had to interact with. Now, I'm not suggesting that everything should be text-only. So don't jump to any conclusions -- just setting up the point. Something I've wanted to do for a long time, now, is make a community for role-playing that employs a sort of 'prompt-and-response' and 'simplified rulebook/character sheet' formula for users to interact with an open world. I believe that concept art is helpful in setting a tone for how this world looks and feels, but for the most part, text only would be used. There would need to be a world-wide story arc, regional story arcs, and then more specific arcs to have outlined out...but that's not what would make this fun and unique. The point would be to create an open world that players could actively make an impact on. A game in which someone's character would not only be someone of their own design, but would be able to truly rise from a nobody to the leader of an entire nation. [b]The Topic:[/b] To make something like this a reality, some sort of sustainable system would need to be in place. How would such a thing become long term? How would users be able to become active and important in how this world grows and develops? Would this thing really need to be a text-only venture? I've got some ideas of my own, but as this would be an RPG, I can think of no better place to ask for input than game-writers! Though...maybe this thread is better placed in the Game Design forum...?
Stormy - Thanks for the insight I'll lurk about there and see if I can't help to melt the glacier a bit~ Tom - I've been reading through them and will continue to do so
viriesque replied to MRECKS's topic in Writing for GamesIt seems that a flowchart would be a good way to organize this information and begin to develop the ideas you have. Starting at the beginning, actually go through the key decision points you have built up in your head. My advice would be not to even worry about this being a game series and instead, focus on the story itself. Once the key decisions have been plotted out, you can begin to chart out the other decisions that lead up to the big ones.
Thanks for the information, Tom! (That puts me more at ease.) I wasn't really sure where to put this thread, so thanks for giving me more of an idea on what 'For Beginners' and 'Breaking In' are actually for Honestly, I was just wanting to get some feedback from folks who are already making games to get a sense of how someone with my skill set would be used in a team so that I can really make my portfolio and resume communicate what I can do. As I have experience with both art direction and plot/dialogue/lore writing, it feels like I've got a very not-advertised skill set. Not really sure how to show what it is I can offer. However, as a creative thinker, I'm sure I can keep working some ideas out and hope that generous souls ahead of me will give me some feedback, now and again. [I think I should also mention that I don't have any interest in getting a job with some big developer. Ideally, I'd like to just make games with people who just want to make games in a team where we all compliment one another's strengths and weaknesses. This is NOT an advertisement for myself. I just wanted to make my stance clear so there's no confusion.]
Oh, I didn't imagine anyone would much care to work on MY ideas. At least, not without having something invested in them. It's just that storytelling is what I'm good at. I'd love to help other flesh out their own stories and ideas. I've been writing for over ten years, now...but I suppose the proof is in the pudding, right? Perhaps the best way to show I'm able to tell a story is to have samples for others to read? Though, reading a novella or a selected few short stories and playing a game are two very different types of interacting with fiction... And I thank you for your advice, Radikalizm, you've confirmed suspicions I've had for quite some time. It seems a little sad, though, having to force yourself to learn how to program a game when you've no talent for it, especially since whatever I would be able to produce would likely seem lacking. Though, perhaps some sort of simple interactive novel would be enough...
viriesque posted a topic in Games Career DevelopmentObviously, I'm a beginner. I'm not a coder and I'm not a 3D model maker. I suppose I'm able to illustrate well enough, but there are lots of people out there who are far better. I'm really no good with composing music. As I join this forum and begin to browse around, I find that 'independent' games are much more literal than I'd imagined...it seems that there are a lot of people working on projects by themselves. Or, conversely, talented individuals are posting for paid work. This isn't a bad thing, but none-the-less, I'm feeling a little lost. I'm no one-woman show and I'm definitely not able to hire talent. I'm a lore weaver. A world builder...a writer. In college, I spent a lot of time with art direction and creating cohesion between different elements in a system. I know my strengths and weaknesses, and I know that both storytelling and art direction are important in game-making -- I'm just not entirely certain where I fit in. More than anything, I'd love to be a part of a team. I believe that a group of people are greater than the sum of their individual parts. A team of people who are passionate about making games and growing together as artists and developers. Is this the sort of place to find others of a like mind?


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I will be visiting Napa in late October with my boyfriend and I'm looking for a romantic restaurant with great food. Nothing too pricey (no more than $30 a plate) and we love all types of food. I've read the posts and there's just so many options. I've narrowed it down to these and hope you can help me choose:
Go Fish
Tra Vigne
Don Giovanni
Also, recommendations would be helpful as well!


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Prices at the Pump Continue to Plummet in Sacramento Region
Gas prices continue to fall in the Sacramento area, where the average retail price comes in at $3.90 -- 11 cents lower than a month ago.
Nationally, prices are down about 9 cents from last week.
Alalyst Trilby Lundberg says it's because of stable supplies from refineries.
"They have been running at very high rates, building inventories," she said.
Lundberg says we could see a drop of another few cents if crude oil prices don't rise.
San Francisco has the nation's highest-priced gas at $4.03 a gallon and Tulsa the lowest, at $3.23.