text:
|Publication number
|Publication type
|Application number
|Publication date
|Nov 18, 1997
|Filing date
|Aug 24, 1995
|Priority date
|Aug 24, 1995
|Fee status
|Also published as
|Publication number
|Gary W. Jones, Steven M. Zimmerman, Susan K. Schwartz Jones, Michael J. Costa, Jeffrey A. Silvernail
|Original Assignee
|Fed Corporation
|Export Citation
|BiBTeX, EndNote, RefMan
|Patent Citations (62), Non-Patent Citations (2), Referenced by (24), Classifications (8), Legal Events (16)
|External Links: USPTO, USPTO Assignment, Espacenet
The present invention relates to field emission structures and devices, including field emission-based flat panel displays, as well as to methods of manufacture and use of such structures and devices.
In the technology of field emission structures and devices, a microelectronic emission element, or a plurality (array) of such elements, is employed to emit a flux of electrons from one or more field emitters. The field emitter, which often is referred to as a "tip", is specifically shaped to facilitate effective emission of electrons, and may for example be conical-, pyramidal-, or ridge-shaped in surface profile.
Field emitter structures have wide potential and actual utility in microelectronics applications, including electron guns, display devices comprising the field emitter structure in combination with photoluminescent material on which the emitted electrons are selectively impinged, and vacuum integrated circuits comprising assemblies of emitter tips coupled with associated control electrodes.
In typical prior art devices, a field emission tip is characteristically arranged in electrical contact with an emitter conductor and in spaced relationship to an extraction electrode, thereby forming an electron emission gap. With a voltage imposed between the emitter tip and extraction electrode, the field emitter tip discharges a flux of electrons. The tip or tip array may be formed on a suitable substrate such as silicon or other semiconductor material, and associated electrodes may be formed on and/or in the substrate by well-known planar techniques to yield practical microelectronic devices.
Two general field emitter types are known in the art, horizontal and vertical, the direction of electron beam emission relative to the substrate determining the orientational type. Horizontal field emitters utilize horizontally arranged emitters and electrodes to generate electron beam emission parallel to the (horizontally aligned) substrate. Correspondingly, vertical field emitters employ vertically arranged emitters and electrodes to generate electron beam emission perpendicular to the substrate.
Examples of horizontal field emitters are disclosed in Lambe U.S. Pat. No. 4,728,851 and Lee et al U.S. Pat. No. 4,827,177. The Lambe and Lee et al structures are formed as a single horizontal layer on a substrate. An improved horizontal field emitter is disclosed in Jones et al U.S. Pat. No. 5,144,191.
Examples of vertical field emitters are disclosed in Levine U.S. Pat. No. 3,921,022; Smith et al U.S. Pat. No. 3,970,887; Fukase et al. U.S. Pat. No. 3,998,678; Yuito et al U.S. Pat. No. 4,008,412; Hoeberechts U.S. Pat. No. 4,095,133; Shelton U.S. Pat. No. 4,163,949; Gray et al. U.S. Pat. No. 4,307,507; Greene et al U.S. Pat. No. 4,513,308; Gray et al U.S. Pat. No. 4,578,614; Christensen U.S. Pat. No. 4,663,559; Brodie U.S. Pat. No. 4,721,885; Baptist et al U.S. Pat. No. 4,835,438; Borel et al U.S. Pat. No. 4,940,916; Gray et al. U.S. Pat. No. 4,964,946; Simms et al. U.S. Pat. No. 4,990,766; and Gray U.S. Pat. No. 5,030,895.
As further examples, Tomii et al U.S. Pat. No. 5,053,673 discloses the fabrication of vertical field emission structures by forming elongate parallel layers of cathode material on a substrate, followed by attachment of a second substrate so that the cathode material layers are sandwiched therebetween in a block matrix. Alternatively, the cathode material layer can be encased in a layer of electrically insulative material sandwiched in such type of block matrix. The block then is sectioned to form elements having exposed cathode material on at least one face thereof. In the embodiment wherein the cathode material is encased in an insulative material, the sliced members may be processed so that the cathode material protrudes above the insulator casing. The exposed cathode material in either embodiment then is shaped into emitter tips (microtip cathodes).
Spindt et al U.S. Pat. No. 3,665,241 discloses vertical field emission cathode/field ionizer structures in which "needle-like" elements such as conical or pyramidal tips are formed on a (typically conductive or semiconductive) substrate. Above this tip array, a foraminous electrode member, such as a screen or mesh, is arranged with its openings vertically aligned with associated tip elements. In one embodiment disclosed in the patent, the needle-like elements comprise a cylindrical lower pedestal section and an upper conical extremity, wherein the pedestal section has a higher resistivity than either the foraminous electrode or the upper conical extremity, and an insulator may be arranged between the conical tip electrodes and the foraminous electrode member. The structures of this patent may be formed by metal deposition through a foraminous member (which may be left in place as a counter-electrode, or replaced with another foraminous member) to yield a regular array of metal points.
Jones et al U.S. Pat. No. 5,371,431 discloses a vertical column emitter structure in which the columns include a conductive top portion and a resistive bottom portion, and upwardly vertically extend from a horizontal substrate. By this arrangement, an emitter tip surface is provided at the upper extremity of the column and the tip is separated from the substrate by the elongate column. An insulating layer is formed on the substrate between the columns. An emitter electrode may be formed at the base of the column and an extraction electrode may be formed adjacent the top of the column.
As described in Jones et al U.S. Pat. No. 5,371,431, the vertical column emitter structure may be fabricated by forming the tips on the face of the substrate, followed by forming trenches in the substrate around the tips to form columns having the tips at their uppermost extremities. Alternatively, the vertical column emitter structure of U.S. Pat. No. 5,371,431 is described as being fabricatable by forming trenches in the substrate to define columns, followed by forming tips on top of the columns. In either method, the trenches may be filled with a dielectric and a conductor layer may be formed on the dielectric to provide extraction electrodes.
Further improvements in vertical field emitter structures and fabrication methods are disclosed in Jones U.S. patent application Ser. No. 029,880, filed Mar. 11, 1993, entitled "Emitter Tip Structure and Field Emission Device Comprising Same, and Method of Making Same,", now abandoned, and in corresponding International Application Number PCT/US94/02669, published on 15 Sep. 1994 as International Publication WO 94/20975.
By the present invention, a number of structures are provided which enhance the performance and reliability of field emitter devices, particularly field emitter displays. The invention additionally provides methods for fabricating the structures.
More particularly, the invention provides various improved structures and methods for step coverage of the emitter lines, known as planarization, which is important to the performance of field emitter displays.
FIG. 1 is a cross-sectional drawing of a flat panel display including a field emitter representing a typical environment for the planarizing structures of the invention;
FIG. 2 represents a general planarization technique employing a glass frit;
FIG. 3 represents an alternative device structure including self-aligned trenches facilitating planarization;
FIGS. 4 and 5 depict a fill-in planarization process;
FIG. 6 depicts another fill-in planarization process and structure;
FIG. 7 depicts yet another fill-in planarization process and structure;
FIGS. 8 and 9 depict a pop-top planarization technique;
FIGS. 10 and 11 depict a planarization technique which minimizes the required step height;
FIGS. 12 and 13 depicts the use of a conductive additive to an organic or inorganic spin-on oxide;
FIGS. 14 and 15 depict a process wherein spin-on planarization material is deposited after formation of etch block caps;
FIGS. 16, 17 and 18 depict initial steps in a process for planarization whereby a smoothed surface is used for an emitter patterning step;
FIGS. 19, 20 and 21 depict alternative initial steps in a process for planarization whereby a smoothed surface is used for an emitter patterning step;
FIGS. 22, 23 and 24 show an etched emitter tip process which may be employed after either the initial steps of the process of FIGS. 16-18 or the initial steps of the process of FIGS. 19-21; and
FIGS. 25-27 depict an evaporated type emitter process which may be employed after either the initial steps of the process of FIGS. 16-18, or the initial steps of the process of FIGS. 19-21.
Referring first to the general representation of FIG. 1, a typical environment in which the planarizing structures of the invention may be employed is a flat panel display device 50, which includes a simplified representation of a vertical "tip" field emitter structure such as is disclosed in the above-identified Jones et al. U.S. Pat. No. 5,371,431. The device 50 has an evacuated space 52, and a transparent panel 54 for viewing. On the underside of the panel 54 is a thin transparent anode electrode 56, supporting electroluminescent material 58. During operation the anode 56 is connected to a suitable positive supply voltage, schematically represented at 60.
A vertical tip emitter 62 comprises a column or pedestal 64 of current limiter material supporting an emitter electrode 66 having an emitter tip 68. Suitable current limiters are disclosed in concurrently-filed U.S. patent application Ser. No. 08/518,745, Attorney Docket 3131-120! filed in the names of Gary W. Jones, Steven M. Zimmerman, Susan K. Schwartz Jones, Michael J. Costa, and Jeffrey A. Silvernail, and entitled "PEDESTAL EDGE EMITTER AND NON-LINEAR CURRENT LIMITER FOR FIELD EMITTER DISPLAYS AND OTHER ELECTRON SOURCE APPLICATIONS", the entire disclosure of which is hereby expressly incorporated herein by reference.
The pedestal 64 of current limiter material is formed on a lower cathode conductor layer 74, likewise patterned. During operation the conductor 74 is connected to a supply voltage source represented at 76, which is negative with reference to the anode supply 60. The conductor 74 is formed over a suitable substrate 78, such as a glass substrate.
To complete the FIG. 1 flat panel display 50, a gate electrode 80 is fabricated surounding the emitter 62, and separated from the emitter by a gap. The gate electrode 80 is supported on an insulating stack 82, and schematically connected to a gate (G) terminal 84. During operation the gate terminal (G) 84 is appropriately biased to control electron current flow between the emitter 66 and the anode 56, and thus the illumination from the electroluminescent layer 58.
Structures like that of FIG. 1 may be formed in either a point-in-circle pattern, or in a linear knife edge in slot pattern. Point-in-circle patterns are preferred in most display applications.
Step coverage of emitter lines is important to the performance of field emitter displays. As is illustrated in FIG. 2, one general planarization technique in accordance with the invention involves the use of a low temperature glass frit 300 smoothed onto the substrate 302 between emitter conductors 304.
In a glass frit deposition technique, a slurry of small particle material (high content of <10 micron glass particles) with a removable binder (e.g., nitrocellulose, polyvinyl alcohol, or even suspensions of compounds containing glass precursors such as polysiloxane or tetraethylorthosilicate) is employed. The frit slurry is applied across the surface of the display precursor using a squeegee. This material is optimally dispensed on the surface of the display precursor at the point in the process flow where the planarization is required. As an example, this point may be just after formation of the current limiter material structure, or optionally after conductor 304 formation. Multiple deposition passes may be used with subsequently finer or lower viscosity slurries. Low temperature baking (e.g., 150� C./30 min) should be used to dry the surface between depositions. A final bake is used to remove the binder, liquefy the frit, and thus planarize the surface During the baking, some shrinkage occurs, and multiple applications may be used if full planarization is required, although smoothing as is depicted in FIG. 2 is usually adequate. An etch back is preferably used to remove any trace residual glass (RIE such as with CF4+O2 etchant or by a wet oxide etch such as with a buffered oxide etchant).
A variation, applicable when the display device being manufactured is a field emitter array-based display with a transparent substrate such as glass, is to add in a photo- active sensitizer to the slurry. A sensitizer such as ammonium dichromate in polyvinyl alcohol may be used. The slurry may be applied by spin-on using this technique.
The frit slurry is then exposed to high intensity light or UV light through the back side of the substrate. The metal conductors 304 block the light from exposing frit slurry on the top of the conductors 304, while permitting exposure and polymer cross linking between the conductor lines 304. After exposure, the device precursor is developed thereby removing the un-exposed material on top of the conductors 304, but leaving slurry between the conductors 304.
The device precursors are then baked in air to remove the organic material. For example, a slow ramp to 450� C. for one hour, with an intermediate dwell cycle of one hour at 300� C.
This process permits the region between the conductors 304 to be filled with glass while leaving the top of the conductors 304 clear. This is a very important capability since it leaves the conductors 304 ready for building emitters on the substrate with minimal step coverage risk.
Another variation for glass frit planarization is a laser ablation technique wherein a high intensity CO2, argon, or excimer laser is employed to scan the surface of the conductors 304 prior to densifying and reflowing the frit. The frit can be removed selectively over the conductors 304 because organic material in the frit causes the frit to "pop-off" where it is reflected back in to the film (and where it is thinnest on top of the steps).
The laser ablation technique may even more effectively be utilized if the laser is selectively scanned to open only specific areas, thereby reducing process variation sensitivity at the expense of a more complex laser system.
Referring now to FIG. 3, an alternative device structure 320 has emitter conductors 322 recessed into trenches 324 in a substrate 326, which serves as a planarizing layer. Thus, the planarizing technique represented in FIG. 3 involves a change in device structure. The device structure 320 includes current limiter columns 328 and tip emitters 330, with gate electrodes 332 over insulating stacks 334.
The FIG. 3 device structure 320 features self-aligned trenches 324 filled with evaporated conductors 322 and then planarized using a resistive layer 334 with primarily vertically conducting materials (electron tunneling). This resistive layer material is ideally a material with electron tunneling characteristics, such as SiO doped with chromium (e.g., 5%-40%), and may be sputtered or evaporated from a mixed source. Diamond-like carbon undoped or doped with N, P, or B also may be used, as well as alternating layers of N and P type material. The SiO material is generally preferred and has a unique characteristic of high surface mobility and an ability to smooth the surface. CVD may also be used to deposit a resistor or current limiter material.
Spin-on current limiter materials also may be employed. An example material is tetraethylorthosilicate doped with ammonium chromate or boric acid.
This technique differs from other trench planarizations employed in the semiconductor industry in that the planarization material is a resistor or non-linear current limiter which becomes part of the device.
The emitter may be built on top of the surface of the current limiter or resistor after the planarization process is complete.
By way of example, a process for fabrication of a planarized current limiting field emitter array like that of FIG. 3 includes the following process steps:
1. Deposit optional underlayer (e.g. SiO, 2 mm).
2. Anneal substrate (e.g., 2 hours at 450� C. plus heat and cool cycles to prevent glass warpage).
3. Pattern the substrate for the trenches 324 and emitter conductors 322 using a liftoff profile resist (e.g., negative novolac photoresist).
4. RIE 400 nm using CF4+O2 to form trenches 324.
5. Deposit metal for the emitter conductors 322 using evaporation, e.g., either Al (400 nm) or sublayers of SiO2 (20 nm), Cr (20 nm), Cu (300 nm), Cr (40 nm).
6. Solvent strip resist and liftoff metal (e.g., NMP at 90� C., rinse in isopropyl alcohol (IPA), then water), leaving conductors 322 in trenches 324.
7. Ion beam clean, then deposit the non-linear current limiter layer 334 (e.g., SiO+Cr) by evaporation or sputtering (5-40% Cr by weight depending upon the emission current level required). CVD or spin on of other materials exhibiting preferential vertical conduction may also be used. An optional step prior to this deposition is spin on oxide (tetraethyl orthosilicate in IPA) to partially fill the gap between the conductor lines 322 and the insulator trench 324.
8. Deposit emitter 330 layer(s). Examples: silicon, gold and antimony doped silicon, SiO -50% Cr (20-80% Cr), SiO2+(20-30%) Cr, diamond-like carbon, or other conductor material with reasonably low electron-vacuum emission work function.
9. Pattern emitters 330, e.g., a thin chromium (100 nm) layer under photoresist.
10. Etch emitters 330 first isotropically (wet chemical or PIE) to preshape points, and then anisotropically to form base (RIE) for tall low capacitance gate-emitter lines.
11. Deposit the gate-emitter dielectric (e.g., SiO2) by directional evaporation or ion beam technique.
12. Photoresist pattern the gate lines for liftoff.
13. Evaporate the gate metal, for example Cr (50 nm), Nb (400 nm), Cr (100 mm), SiOx (200 nm). SiO used to protect devices from anode-gate flashover the oxygen content of SiOx should be controlled to permit slow etchability.
14. Liftoff gate metal in solvent (90� C. NMP) and rinse.
15. Optional follow-on processing may be used to coat the emitters or add other layers of field dielectric isolation.
Illustrating another embodiment, FIG. 4 depicts a structure 350 prior to planarization, and FIG. 5 depicts the planarized structure 350'. In FIGS. 4 and 5, emitter conductors 352 and current limiters 354 are formed over a substrate 356. Shown as alternatives in FIG. 5 are a filled in insulator 358 and a stress-relief insulator fill-in 360.
The processes represented in FIGS. 4 and 5 more particularly is as follows:
1. Spin on ICI polysiloxane material - 2,000 Angstroms thickness
2. Bake at 450� C. for two hours in N2 with one hour temperature ramp up and down
3. PIE to clear tops CF4+O2 (form insulator cusps at edges of steps)
4. Deposit SiO2+SiO 50% (although other mixtures work), via sputter, CVD, or evaporation. >1.5 micron thick. (The use of SiO+SiO2 mixtures to tailor etch rate is preferred, but a wide range of 0 to 100% SiO in SiO2 is possible.)
5. Spin on planarization coating ˜1.5 micron; the planarization coating may be a material such as BCB spin on coating material (Dow Chemical Company, Midland, Mich.), PC1 or PC2-1500 (Furorrex, Inc., Newton, N.J.), or a suitable polyimide material
6. Bake coating 200� C 30 minutes or on hot plate
7. RIE etch bake to clear tops CF4+O2
8. Deposit doped silicon, SiO+50% Cr, Nb or other emitter material, via sputter, CVD, or evaporation techniques.
Yet another fill-in planarization process and structure 370 is depicted in FIG. 6. As above, emitter conductors 372 and current limiters 374 are formed over a substrate 376. Filled-in insulator is designated 378.
The process represented in FIG. 6 more particularly is as follows:
1. Deposit SiO2+SiO 50% - 1.8 micron
2. Spin on PCI
3. Bake PCI
4. RIE to clear tops and remove PCI (oxygen ash at end of process one minute). (The planarization etch may remove part of the current limiter 374 with minimal current limiter uniformity loss, but this can be eliminated by depositing an etch stop with an identifiable gas chromatograph emission signature in the plasma such as germanium (100 nm) over gold (50 nm) which can also act as a hole injector into the current limiter).
5. Deposit doped silicon (Nb, Au, Ag) at a thickness of for example of about 9,000 A.
Another related fill-in planarization process and structure 380 is depicted in FIG. 7. As above, emitter conductors 382 and current limiters 384 are formed over a substrate 386. Stress relief insulator fill-in/planarization is designated 388.
The process represented in FIG. 7 more particularly is as follows:
1. Spin on polysiloxane, silicate, or other inorganic planarization material 2,000 A
2. Bake at 200� C. for 30 minutes
3. Spin on ICI 2,000 A
4. Bake at 450� C. for two hours in N2 with one hour temperature ramp up and down
5. RIE etch bake in clear tops CF4+O2. (The planarization etch may remove part of the current limiter with minimal current limiter uniformity loss, but this can be eliminated by depositing an etch stop with an identifiable gas chromatograph emission signature in the plasma such a germanium +10% gold (100 nm) over gold (50 nm) which can also act as a hole injector into the current limiter).
Another aspect of the invention is a pop-top planarization technique for fabrication of a field emitter array (FEA) With reference to FIGS. 8 and 9, the steps are as follows:
1. On a substrate 390, build an emitter conductor 392 and current limiter structure 394 using liftoff lithographic processing. Prior to solvent liftoff of the photoresist, deposit a "pop-top" layer 396 such as copper (or a layer of copper over a layer such as titanium or chromium to improve adhesion during pre "pop-off" processing). Then deposit a non-conformal insulator layer 398 such as evaporated or sputtered SiO2, resulting in the structure of FIG. 8.
2. Etch back the insulator layer 398 to expose the "pop-top" layer 396 by RIE (e.g., CF4+O2) or buffered oxide etch (BOE-ammonium bifluoride+HF+water, ˜5% HF, e.g., ˜60% ammonium fluoride).
3. Etch off the "pop-top" layer 396 to expose the top surface, resulting in the structure of FIG. 9.
4. If a layer was added as part of the adhesion sandwich it may be removed. This particular layer may also remain and act as the hole injector for the current limiter (e.g., a Ti - 10% Au alloy, Au, or boron-doped silicon). This layer may be patterned to self align with the emitter tips by etching into the layer after the emitter tip etch process.
With reference to FIGS. 10 and 11, another embodiment of the invention is a planarization version which minimizes the required step height. Thus, if the design of a particular display is such that the vertical current conduction through the current limiter is very large relative to the lateral current conduction between leads, then the planarization process may be modified to an alternative simple form.
In particular, formed on a substrate 410 are emitter conductors 412, for example of Al+4% Cu; 20 nm Cr, 300 nm Cu, 60 nm Cr, 10 nm Al. The edges 414 of the conductors 412 are sloped by controlled etching (e.g., undercut etching of Al+4% Cu by phosphoric-nitric-acetic aluminum etchant) or by commercially available spin-on oxide deposition and RIE etch back (or both). A current limiter 416 (e.g., SiO+25% Cr, 2000 Angstroms) is sputtered or evaporated on top of the conductors 412.
Since the distance between conductors 412 is large relative to the current limiter 416 film thickness for most video display applications (e.g.,>20:1), the current limiter 416 material acts as a resistor without appreciable electric field assisted conductance enhancement. This internal resistance is large due to the high bulk resistance nature of the current limiter films desired for most display related field emitter applications (typically over 100 KW-cm). This small leakage current penalty is acceptable for many video display applications because of the fewer and simpler processing requirements.
An optional fillet insulator 418 of spin-on oxide may be formed to effect partial planarization and stress relief. The fillet 418 is not required in the event the conductor 412 edges 414 slope sufficiently for acceptable step coverage.
With reference to FIG. 11, a technique for further reducing lateral conductivity is illustrated. In particular, after an emitter tip 420 is formed, the current limiter material 416 is partially etched, leaving a portion 422 under the emitter tip.
With reference to FIG. 12 and 13, another version of the planarization process is the addition of a conductive additive to an organic or inorganic spin-on oxide to produce a resistive layer having a bulk resistance comparable to that of the current limiter when conducting. This permits a less accurate, lower cost etch back process to be implemented since a small amount of residual spin-on material will have minimal impact on the device characteristics.
More particularly, in FIG. 12 formed on a substrate 430 are emitter conductors 432 and current limiters 434, with residual spin on oxide planarizing material 436 over the current limiters 434. Insulator fillets 438 provide partial planarization for stress relief.
Further, as shown in FIG. 13, during the etch back using a spin-on planarizing material, the corners of the current limiter material 434 may be etched off in-situ as depicted at 440 to aid in the planarization of the device.
With reference to FIGS. 14 and 15, the emitter process sequence may be modified for an additional planarizing process whereby the spin-on material is deposited "after" formation of the caps. Thus in FIG. 14 current limiters 450 and emitter conductors 452 are formed on a substrate 454. A layer 456 of emitter material (e.g., Si+Nb+Au+SG) is applied, followed by a patterned inorganic cap 458 for etch block to subsequently define the actual emitter locations. Spin-on planarization material 460 (e.g., SOG, commercially available from AlliedSignal, Inc., Morristown, N.J.) is then applied, completing the FIG. 14 structure prior to etch back.
Then, an RIE etch process (CF4+O2) similar to that used for etching the emitters is then used for both the planarization and the emitter etch. FIG. 15 shows the structure after etchback. In FIG. 15, remaining portions 462 of the FIG. 14 emitter material layer 456 comprise the emitter columns. As in the embodiment of FIG. 13, corners of the current limiter material 450 may be etched off in-situ as depicted at 464 to aid in planarization. Also in FIG. 15, residual emitter material 456 may remain form the etch back step at 466.
The process of FIGS. 14 and 15 advantageously results in a short process flow, but requires good control of the etch parameters.
As another aspect of the invention, planarization techniques are provided which permit a smoothed surface to be used for the emitter patterning step; and wherein the resultant structure uses spin-on planarized silicon dioxide as part of an insulator structure.
With reference to FIGS. 16, 17 and 18, an exemplary process is as follows:
1. Over a glass substrate 500 deposit etch stop layer 502 (e.g., SiO or Al2O3) for example 0.1 to 2 micron thickness, then deposit SiO2 layer 504 over the etch stop layer 502 to approximately the combined thicknesses of the planned emitter conductor and current limiter layers (e.g., 1 micron).
2. Pattern with photoresist 506 and etch trenches 508 through the SiO2 layer 504 down to the SiO etch stop layer 502 (RIE, plasma, or buffered oxide etch or a combination of these etches). Overetch sufficiently to remove SiO2 at the base so as to accurately set height. The etch stop 502 thus advantageously is employed to accurately set trench depth when a wet etch is used to finish the trench 508. The structure of FIG. 16 results.
3. Deposit emitter conductor 510 and then current limiter 512 by sputtering or evaporation, including bottom 514 or top 516 layers of, for example, 200 Å thickness of injector materials such as aluminum or gold depending upon the desired characteristics. An Au--(SiO+Cr)--Au film is shown in FIG. 17 for a peak current vs voltage device. The top layer 516 may be a combination of etch stop and/or carrier injector layers. The current limiter layer 512 may be masked off the ends of the emitter conductor 510 to facilitate future connection of the display to electronics.
4. Remove resist with solvent and liftoff deposited layers, resulting in the structure of FIG. 17.
5. As shown in FIG. 18, spin-on planarizing oxide 518 (e.g., Allied SOG) 0.5 to 2 microns thick, and bake 1 hour at 450� C. after slow temperature ramp (3 degrees per minute) to cure. The spin on material 518 may be deposited in multiple coats with intermediate baking steps.
An alternative to the process of FIGS. 16-18 which results in nearly the same structure is represented in FIGS. 19-21.
1. An initial step, shown in FIG. 19, is coating and pattering resist 530 on a clean glass substrate 532 with an optional pure coating 534 of silicon dioxide or SiO.
2. Next, as shown in FIG. 20, deposit emitter conductor metal 536 and current limiter 538 with optional injector layers (e.g., SiO+20% Cr.) Then liftoff the FIG. 19 resist 530 (in solvent such as NMP with an IPA rinse) along with the excess metal.
3. Coat with ˜2 micron positive resist, bake, expose the resist from the backside using a light source (e.g., Hg lamp), with the rows or columns of the device as a mask for light passing through the transparent or translucent substrate, develop in suitable basic developer and bake (120 degrees C, 30 min).
4. As shown in FIG. 21, deposit insulator 540 onto the front side of the plate (e.g., SiO2) at the same thickness as the combined current limiter and emitter metal thickness, and then liftoff the resist with the excess insulator in solvent such as NMP with an IPA rinse.
5. Spin-on-oxide and bake as described above with reference to FIG. 18 to achieve a similar structure.
Continuing on from the structure of FIG. 18, whether achieved by the process of FIGS. 16-18, or by the process of FIGS. 19-22, various process options may be performed. An etched emitter tip process is described hereinbelow with reference to FIGS. 22-24, and an evaporated type emitter process is described hereinbelow with reference to FIGS. 25-27.
Considering the etched emitter tip process of FIGS. 22-24 in detail, the steps are as follows:
1. Etch back or polish the FIG. 18 spin on oxide 518 to expose the top of the current limiter material 512 or the surface of the injector layer 516.
2. Optionally deposit injector layer 516 if not done in a preceding step unless the emitter material adequately serves this purpose (e.g., silicon with gold doping serves this purpose). Then, deposit the emitter material 540 such as silicon or molybdenum.
3. Liftoff pattern and deposit etch resistant caps 542 (e.g., 50 nm to 2,000 nm).
4. Etch the emitter material 542 first isotropically then anisotropically to form emitters 544 as shown in FIG. 23.
5. As shown in FIG. 24, deposit the gate insulator layers 546 (e.g., SiO and SiO2) and then pattern the gate lines for deposition of conductor and liftoff or etch of the gate conductor 548. An optional additional insulator layer 551 may be utilized to enhance the electrical isolation of the gate coductor in the final product article. Etch the emitter material to sharpen the points 549 and liftoff the caps to complete the emitter array.
The evaporated type emitter process of FIGS. 25-27 is as follows: pattern the top surface of the dielectric 518 with a photoresist pattern, then deposit a conductor layer 550 (e.g., chromium) and a liftoff layer 552 (e.g., copper) by sputtering or evaporation. An optional second layer 553 of dielectric such as SiO, SiO2, or a mixture of such oxides may be employed. Use solvents to liftoff the dots of photoresist and metal on top the dots, leaving an array of holes in the metal and liftoff layer film. Deposition, pattern, and etch process sequences can create similar structures, but are not shown in this example. Groups of pixels may be patterned using conventional lithography with steppers, scanners, or holography.
The patterns may be exposed in the photoresist using interfered laser beams since the substrate is free of surface roughness. The exposure may be performed by exposing a line and space interference pattern from a krypton (wavelength=˜416 nm) or argon laser (wavelength=˜351 nm), rotating the substrate 90 degrees, and then exposing again. A laser interference feedback development system is required. An antireflective layer such as polyimide is recommended. Self-alignment of pixels can be used where emitter leads and gates overlap even if a coverall dot array pattern is used. The resist may thus be employed over an antireflective layer, and with the resist being used to block deposition of emitter material from the gate edge during fabrication.
A lithographic mask pattern in addition to the emitter dots may be used to shape arrays of dots into groups. This mask also be used to create large dot or line patterns which do not close up during the later emitter depositions, thereby enhancing the speed of emitter liftoff.
An optional second layer of dielectric may be deposited after curing of the spin-on dielectric (second layer of dielectric can be SiO, SiO2, SiO+SiO2 mixture, or other materials).
With reference to FIG. 26, etch holes 560 in the dielectric 518 using RIE (e.g., CF4), wet processing such as BOE, or a combination thereof. A wet etch is optimally used to finish the etch to ensure a clean etch stop on the current limiter material/injector layer. Etch back the conductor to recess the edge of the gate away from the deposition path of the subsequent emitter material deposition.
With reference to FIG. 27, deposit the emitter 564 material down into the holes 560 (e.g., silicon, SiO+50% Cr by evaporation) at low pressure (<10-5 torr) until the holes close off, thereby forming a point in a manner known in the art (e.g., see Spindt et al. U.S. Pat. No. 3,665,241). The liftoff layer may now be removed (nitric acid may be used to release the excess emitter material if a copper liftoff layer is used).
An emitter coating may now be applied to reduce the work function if a high work function material was used as the emitter (e.g., SiO+Cr, a diamond like film). A sidewall cleanup is generally required after such a deposition to reduce gate to emitter electrical leakage.
The emitter lines are then lithographically patterned and etched (e.g., using potassium permanganate solution to etch chromium following an etch of any low work function coating layer). Other etchants are usefully employed for other conductor metals, as known in the art.
While specific embodiments of the invention have been illustrated and described herein, it is realized that numerous modifications and changes will occur to those skilled in the art. It is therefore to be understood that the appended claims are intended to cover all such modifications and changes as fall within the true spirit and scope of the invention.
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|U.S. Classification
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|European Classification
|Mar 6, 1996
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text:
TOKYO (WP-BLOOM) — Plates small enough to fit in the palm of an adult's hand can be used in a versatile manner at the dining table.
And with interesting motifs, these plates, called mamezara (tiny plates) in Japanese, can become conversation pieces for diners.
The plates, even those produced by artists, also may be quite reasonably priced.
Although they may be regarded as Japanese tableware, many have interesting motifs and shapes suited for Western and Chinese cuisines, too.
They can be used for individual servings, to serve soy sauce, salt or pickled vegetables, or even as chopstick rests.
"If you choose tableware by yourself, you feel that the joy of dining has already begun before you eat. It's fulfilling," tableware coordinator Fumika Endo said.
Endo suggests using these plates in a book, titled "Mamezara no Aru Kurashi" (Life with mamezara plates), recently published by Takarajimasha, Inc.
The book features about 500 plates with examples of how to place food on them and includes such information as the names of their producers and shops that sell them.
Mamezara plates are usually six to nine centimetres in diameter, but Endo's book covers larger ones, too, up to 13 centimetres in diameter.
"I hope this book will help if you usually eat prepared food that you buy at stores straight from their containers or when you have no idea how to arrange food on plates," Endo said.
In addition to tips on how to use the plates on the dining table, her book also suggests various other uses, such as to hold aromatherapy substances, accessories or flowers.
The book also includes information about major pottery fairs and antique fairs, where visitors can buy the plates.
Endo has provided many suggestions on how to coordinate tableware, tablecloths and other dining-related accessories to her customers.
She learned about tableware and other dining accessories when she was a cooking school student, and felt the work of tableware coordinators was more interesting than cooking.
After graduating from the school, she began introducing tableware for cooking books, magazines and advertisements.
Later, she began publishing books to help people enjoy dining more.

subset: commoncrawl


text: I am looking for a certified copy of Windows 7 SP1 that someone does not need. I am currently unemployed, otherwise I would buy it myself. The copy has to be a legitimate product, with an original product key, and should have at least 1 install remaining on its license. I need to upgrade my Windows Vista SP2 to Windows 7 so I can use more recent versions of Computer Science and Mechanical Engineering related freeware and trial software from around the Internet. Thank's Jack Army veteran


text:
Happy Hour: The Grill on the Alley
The Vibe: Whether you're closing a deal at a late power lunch, needing a drink after a long shopping bender or just bending the elbow before catching a movie, this L.A.-based steak and seafood house fits the bill. Open less than a year and modeled after pre-War New York grills, TGOTA has quickly built up a roster of regulars with its marble bar tops, images of '60s icons hanging from the walls and Sinatra on the stereo. Oh yeah, the food ain't bad either.
Prices/Deals: You like half-price? You've got half-price. The drink specials at the Grill are nearly unheard of for a steakhouse. Beers for $3.50. Wine at a reduced price. And $7 cocktails. But the real value? It's the food. Everything's under $5, including lump crab cakes, macaroni and cheese and ahi tuna sashimi. And unlike a lot of places, happy hour is in actuality happy evening – and weekend. The specials run 4 p.m. – 8 p.m. Monday through Friday, and 11:30 a.m. – 6 p.m. on Saturday and Sunday.
Scene: For the better part of 25 years, Hollywood insiders have conducted business at the original Grill in Beverly Hills. Among its patrons: Spielberg, Geffen, Diller and Katzenberg, to name a few. While Aventura doesn't quite have that cache, Hollywood types have been known to drop by the East Coast version while in town. Local moguls like real estate king Steven Posner, who essentially runs his empire from a barstool, have followed L.A.'s lead. Dress nice.
The Grill on the Alley, 19575 Biscayne Blvd., Aventura; (305) 466-7195


text:
This year for me has been a series of rather unfortunate events. With a few MAJOR highlights.
I found the man I am meant to marry, and will be marrying him soon.
I started my own business and love what I do.
I met and fell in love with a bunch of rascally teens, who welcomed me into their hearts and made me a believer in my own abilities as a leader.
I discovered that my family, will always be there for me.
And I try to focus on those good things, when it all gets dark. When the walls move in, and the floor gives out, there is no ceiling to speak of and soon enough you are Sandra Bullock spinning perpetually out of control in zero gravity and using up all your oxygen because you just can't chill out!
Yea. I've been there.
I'm there.
You may have to experience the very worst before you are delivered, but you will be delivered! God may keep you waiting, but he will always remember His promise and will appear in time to fulfill His sacred Word that cannot be broken. ~ F.B. Meyer
If there is anything I've learned about trials, it's that I'm scrappy, and I'm strong, and God made me that way. I pray to Him for peace, and understanding, and sometimes all I get is peace.
God in His providence has a thousand keys to open a thousand different doors in order to deliver His own, no matter how desperate the situation may have become. May we be faithful to do our part, which is simply to suffer for Him, and to place Christ's part on Him and then leave it there. ~ George MacDonald.


text:
Nope. They think they're 'taking one for the team'. Instead, the 'Rats are trying to blow them out of the water over this.
As I've posted before I believe that McCain/Palin have done somewhat of a rope-a-dope by getting on record all the talking points by the Dems and had to wait to see what the final bill in the bailout would be. Presuming this bill is a done deal (with some key changes thanks to the Pubbie House and McCain) McCain can now commence a campaign to impune the very Dems (Pelosi, Reid, Frank, Dodd, Obama etc.) that created the mess in the first place and then opposed any repair to a skewed system in 1999, 2003 and 2005.) The opening shot will hopefully be during the VP debate and then the two debates thereafter plus heavy ad buys. Obama has now laid claim to being, in essence, the key negotiator for the bill and thus owns it and all it's pittfalls.


text:
Discussion in 'Off-topic Zone' started by Signals, Jan 3, 2011.
What remains undone that you have wanted to get done for years?
World domination.
Have a wife and kids. A family.
Sell the eBay stuff crammed in my closet.
Home renovations
Just don't have the money to get it all done in a timely manner. I've had to piecemeal my projects.
A complete portfolio of paintings.
Get back into singing, maybe do some gigs or join a wedding band.
Build my old man a bike...or an old Impala.
I have a 72 Mercury Cougar XR-7 that is way cool, and needs to be restored. Been wanting to get around to it for at least 5 years. Maybe next year


text:
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text:
Nurse in California doesn't administer CPR
Woman should have been resuscitated Death shakes people to the core. It makes us question our sense of self and place in the world and is a scaring experience. The most painful type of death for a family are those that are preventable. One such example is the death of Lorraine Bayless, who was denied help…More
Comments | More in Health care | Topics: CPR, Medicine, seniors


text:
After first 100 days, Canada PM Trudeau takes Twitter queries
By David Ljunggren
OTTAWA (Reuters) - Canadian Prime Minister Justin Trudeau, who never skips a chance to reach out to voters, marked 100 days in office on Friday by fielding Twitter questions on topics from Star Wars to economics to what he had for lunch.
Critics were already complaining that Trudeau is more style than substance, but he shows no sign of ditching an intensely personal style of governing, which often involves stopping for selfies with well-wishers.
Trudeau, 44, led his Liberals to a surprise election win last October on the back of a promise to change politics. He named a cabinet with an equal number of men and women and dominates the media in a way few of his predecessors did.
His tastes sometimes run to the informal. On Friday he took questions on Twitter for 45 minutes, including one about whether a hot dog was a sandwich.
"Yes. That way, when asked what you had for lunch, you can say 'a sandwich'. Sounds waaaay healthier," he replied.
Other subjects included Arctic security, gay rights, taxes, national security and youth unemployment. He also found time to comment on a toy moose that someone had covered in newspaper pictures of the prime minister.
Trudeau will face a tougher challenge next month when his government releases a budget designed to boost a slack economy. He conceded this week he would run a larger deficit than initially promised.
Perhaps mindful of criticism that he talks a lot without achieving much, Trudeau released a list of what he said his government had done since taking office in November. Continued...


text:
Finished top for my first mystery quilt through Quilters Club of America. Fun project. Fabrics were purchased several years ago for a specific project, which I later decided to not do.
This turned out really nice Ginny. I like Wendy's version.
Oooh! Pretty!
Love the choice of colours Just lovely


text:
All team members are expected to attend every practice. Everyone must show up at least 30 minutes early for warm-up. If a team member is unable to make it to practice, he/she must inform the team captain and/or coach at least 24 hours before the scheduled practice. This is very important as space is limited, and this will allow a teammate to fill in the missing spot. Outdoor Summer Training 2016 To be determined.
Dragon Boat racing is a water sport involving a 40 feet long boat, a drummer, a steersperson and 20 paddlers. The drummer (in the front of the boat) sets the pace and making sure that all 20 paddlers in the boat are moving in a synchronized manner. The steersperson (at the back of the boat) calls all the shots and is in charge of navigating the boat, making sure the boat stays in its assigned lane, and steering the boat in different directions when needed. Attached to the end and front of the boat, is a dragon's head and tail, while ...
We are currently recruiting male and female paddlers. Paddling experience is not necessary. Requirements: An ideal team member should have the following qualities: Strong work ethic; must be willing to train hard, learn from constructive criticism Commitment; must be able to attend all practices and competitions Team player We generally look for people who are in shape, and who have a solid base of strength and fitness. We also recruit non-fit people, as long as they are willing to train hard; not only during team practices, but in the gym as well. To join us, you may send an email to Captain Jimmy Chan at firstname.lastname@example.com.
In 1996, the Montreal Chan Dragon Boat Sports Club was founded and organized by Jimmy Chan. At that time, he joined forces with the Gee How Tong and Chan Wings Chun Tong Associations, and became an independent men's team called Dragon Knights in late 90's. Dragon Knights (men's team) Our men's team, Dragon Knights has been around ever since dragon boating was introduced in Montreal. The name of this team comes from a great historical mysterious legend of thousands of years: Long ago, a knight was sent to conquer a powerful dragon. After defeating the dragon, the knight became its master, ...
Jul 16
5th Place – 500m Division 3 Mixed Final C
5th Place out of 16! – 2000m Division 3 Mixed Final B
Jul 15
3rd Place – Division 3 Mixed Final B
Jul 14
5th Place – Community Final C 500m
2nd Place – Community Final B 2000m
Dec 13
We had a great time at our annual team Christmas party!
4th Place – Community Final C 500m
3rd Place – Community Final B 2000m
Jun 13
1st Place – Final B Division
May 13
This H20 Open competition was much more challenging this year due to the increasing amount of competitive teams participating to qualify for the 2014 world championship in Italy. It was a great experience, especially for our new recruits!
9th Place Overall – Mixed Community Division
We had our annual team fundraiser at the Comedy Nest, organized by captain Jimmy Chan! A huge thanks to the comedians for their great performances, and a big thanks to everyone who showed up to support us!
Click here to view the photo album for this event.
Nov 12
We had an awesome night at Wok Cafe for our annual team dinner, to celebrate another successful dragon boat season!
Sep 12
Like last year, we combined forces with team Isshin, as well as some members from other various teams!
200m: 2nd place
500m: 2nd place
2000m: 9th place
Web Design by: Matthew Chan


text:
Premiers Best Character Bauble makes a great Christmas Gift, or even a Stocking Filler! This special Tree Decoration not only displays a loving message towards your Loved One but is also decorated with a cheeky ceramic Christmas Character sat on top of a metallic Bauble. This Bauble is also Shatterproof!
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|Publication number
|Publication type
|Application number
|Publication date
|Jul 31, 2007
|Filing date
|Jan 7, 2005
|Priority date
|Jan 7, 2005
|Fee status
|Also published as
|Publication number
|Melissa C. Yale, Hollan A. Tsuda, Glenn Klecker, Benjamin C. Rivera
|Original Assignee
|Leatherman Tool Group, Inc.
|Export Citation
|BiBTeX, EndNote, RefMan
|Patent Citations (95), Non-Patent Citations (9), Referenced by (18), Classifications (10), Legal Events (3)
|External Links: USPTO, USPTO Assignment, Espacenet
The present invention relates to folding multipurpose hand tools, and in particular relates to such a tool including provision for exchanging tool blades and to such a tool including folding scissors.
Various arrangements are known by which blades and tool bits can be exchanged or replaced in hand tools. In particular, Basham, U.S. Pat. No. 2,439,071, Copeman, U.S. Pat. No. 1,361,201, Gilbert, U.S. Pat. No. 4,073,057, Sizemore, et al., U.S. Pat. No. 4,391,043, and Frazer, U.S. Pat. No. 6,282,997 all disclose hand tools permitting exchange of blades or bits such as screwdriver bits, but the mechanisms for engaging replaceable blades or bits in the prior art have not been well adapted to use in mounting blades or bits so that they can easily be folded into a handle for stowage in a compact folded configuration of the tool.
Many different types of small folding scissors are known and are incorporated in various folding multipurpose hand tools. Many of such scissors include springs to open the handles, and thus open the blades, apart from each other, but folding such previously known scissors to permit stowage in a tool handle has typically required either that the spring be flexed and remain under load when the scissors are folded and stowed, or has required the handles to be pivoted wide apart from each other into opposing positions. These requirements have thus significantly limited the size, and thus the practical utility, of such scissors in the past. For example, in the scissors disclosed in Rivera, et al., U.S. Pat. No. 6,389,625, while there is an adequate spring to open the handles and blades apart from each other after a cutting stroke of the scissors, the handles and the blades must be separated into opposing positions to permit the scissors to be folded into the handle of the tool for stowage without the movable blade's handle having to engage and flex the spring.
What is needed, then, are an improved mechanism for securely mounting and releasing selected tool blades so that they can be extended for use or folded into a stowage configuration with respect to a handle of multipurpose tool, and an improved folding scissors that can be larger in size than previously available folding scissors, yet can be placed into a folded configuration free of tension in a spring, so that the scissors can be stowed in a small cavity in a tool handle.
The present invention provides various aspects of hand tool construction to satisfy the aforementioned needs, among others, as defined by the claims appended hereto.
In particular, according to one aspect of the present invention, a tool holder is provided by which various tool blades or bits such as saw blades, knives, files, or other tools can be mounted securely in the tool holder and can be selectively removed and replaced from the tool holder. When mounted in the tool holder such tool blades are held securely in a manner permitting the mounted tool blades to be folded into a tool handle for stowage when not being used.
In one embodiment of that aspect of the invention the tool holder includes a carrier defining a tool base receptacle into which the base portion of a tool blade can be inserted laterally, where the tool base is then held securely by a tool retainer that moves pivotally with respect to the tool carrier to a position obstructing the lateral opening of the tool base receptacle.
In one preferred embodiment of this aspect of the invention the tool retainer has the form of a channel with a pair of opposite sides. The retainer is movable to a position in which each side of the channel extends closely along a respective side of the body of the tool carrier, preventing a tool blade base portion from being removed laterally from the tool base receptacle.
According to another aspect of the invention a folding scissors-action tool includes a main tool member handle for a first tool member. The main tool member handle is mounted so as to be movable about a pivot shaft, between an extended, operative, position and a stowed position in a tool handle. A spring located alongside the main tool member handle is arranged to engage a handle of a second tool member so as to urge the handles apart from each other when the scissors-action tool is in its extended, operative, position, but leaves the tool member handles free to move together so as to permit the scissors-action tool to be folded and stowed in a compact configuration within the tool handle.
In a preferred embodiment of this aspect of the invention the spring is free to move away from its position of engagement with the handle of the second tool member as long as the main scissors handle is not located substantially in the extended, operative position with respect to the tool handle.
According to yet a further aspect of the invention a handle of a multipurpose folding tool has a grip portion in which a grip member includes resilient grip bodies exposed through holes in a handle shell member so as to present easily grasped, comfortable, and slip-resistant outer surfaces of the grip bodies on outer sides of the tool handle.
The foregoing and other objectives, features and advantages of the invention will be more readily understood upon consideration of the following detailed description, taken in conjunction with the accompanying drawings.
Referring now to the drawings which form a part of the disclosure herein, and referring first to
At an outer, or rear end 52 of the handle 36 a foldable tool holder 54, in which a saw blade 56 is removably held, is shown in its extended, operative position with respect to the handle 36. It should be understood that while the tool holder 54 is shown herein associated with a two-handled multipurpose tool, it is equally useful in a one-handled folding tool.
As shown in
The tool holder 54 is attached to the handle 36 by a transversely extending pivot pin 68 mounted in the side members 64 and 66, but the tool holder 54 is prevented from rotation about the pivot pin 68 by engagement of the latch bar 60 in a latching notch 70, which holds the tool holder 54 in an extended position with respect to the handle 36 so the saw blade 56 can be used effectively. The latch lever 58 is attached to the handle 36 by a pair of trunnions 72 mounted in bearings defined respectively in the sides 64 and 66, and a spring 74 acting on the latch lever 58 urges the latch bar 60 into engagement in the notches 62 and 70 to keep the tool holder 54, or any selected one of various other folding tools 71 which may be carried in the handle 36, in its extended, operable position.
A cavity 76 defined inside the handle 36, between its side members 64 and 66, is long enough to receive the tool holder 54, together with the saw blade 56 mounted therein, when the latch bar 60 is removed from the latching notch 70 and the tool holder 54 is rotated about the pivot pin 68.
The saw blade 56, or another tool blade or bits held in the tool holder 54, may be released from the tool holder 54, as when a dulled saw blade must be replaced with a sharp one, or when it is desired to mount another tool, such as a file, in place of the saw blade 56 in the tool holder 54. This is accomplished, as shown best in
A rear, or base portion 89 of the tool carrier 86 is mounted pivotally on the pivot shaft 68, so the tool holder 54 can be rotated about an axis defined by the pivot pin 68 between its extended, operative position shown in
The body 84 of the tool carrier 86 preferably has a pair of planar parallel opposite lateral side 85 and 87 and includes an upper fork arm 88, and a lower fork arm 90, the pair of fork arms 88 and 90 together defining the blade base receptacle 82. In the tool carrier 86 as shown herein the blade base receptacle 82 extends entirely through the body 84 and is open on each lateral side 85 and 87 of the carrier body 84, as shown in
A rear end 106 of such a conventional blade base portion 80 fits matingly against a rear inner surface 108 of the blade base receptacle 82, so the blade base receptacle 82 prevents longitudinal movement of the blade base 80 in the direction of the arrow 110 during use of a tool blade such as the saw blade 56. Inwardly facing opposing surfaces 112, 114, bear against top and bottom surfaces of the narrow part of the blade base portion 80 of the saw blade 56 to hold it snugly against up and down wiggling during use. Other top and bottom margin surfaces of the blade base portion 80 spaced rearwardly further apart from the surfaces 100 and 102 of the tip portions 92 and 94 also may bear against interior surfaces of the blade base receptacle 82. The blade base receptacle 82 has a height 115 greater than the front end height 98, between the upper fork arm 88 and the lower fork arm 90, at a location within the blade base receptacle 82 rearward from the inwardly facing rear surfaces 100 and 102, to accommodate a wider portion such as the cross arm 104 of the base portion 80 of a tool blade.
The surfaces 100, 102, 108, 112, and 114, defining the interior of the blade base receptacle 82, all preferably extend generally normal to the plane defined generally by the tool carrier body 84. With such construction of the tool carrier 86 the tool blade base portion 80 is held securely in the body 84, between the upper fork arm 88 and the lower fork arm 90, minimizing movement in a longitudinal direction as indicated by the arrow 110, or in any other direction parallel with the plane defined generally by the body 84 of the tool carrier 86.
The tool retainer 78, in the preferred embodiment of the tool holder 54 shown in
The width of the channel base 120 is at least equal to and preferably slightly greater than the thickness 124 of the body 84 of the carrier 86, which may be 0.070 inch (1.78 mm). As a result, the sides 116 and 118 fit closely alongside the opposite lateral sides 85 and 87 of the body 84, covering openings of the blade base receptacle 82 on each lateral side of the body 84 and obstructing lateral movement of the blade base portion 80 of the saw blade 56 or other tool from the blade base receptacle 82. The material of the tool retainer 78 is preferably bent along the margins of the channel base 120 to bias the side members 116 and 118 toward each other so that they fit snugly alongside, and are urged into contact with, the opposite lateral sides 85 and 87 of the body 84 of the tool carrier 86 to retain the tool blade base portion 80 firmly within the blade base receptacle 82.
Preferably, a detent 126 is provided in the tool retainer 78 to keep the tool retainer 78 in its tool securing position with respect to the tool carrier 86, as shown in
A notch 70′ is provided in the rear, or base portion of each side 116 and 118 of the tool retainer 78, and is aligned with the notch 70 in the base portion 89 of the tool carrier 86 and engaged by the latching bar 60 when the tool retainer 78 is in the tool securing position and the tool holder 54 is in the extended position shown in
Projecting ears 130 are provided on the front corners of the sides 116 and 118 of the tool retainer 78, where they can be engaged by one's finger nail to remove the tool holder 54 and any tool blade engaged therein from a stowed, or folded, position within the cavity 76 in the tool handle 36. A small projection 132 is provided on the lower fork arm 90, to keep the tool holder 54 from being moved to deeply into the cavity 76 in the tool handle 36, in order to protect a sharp edge of a tool held in the tool holder 54.
It will be understood that the tool retainer 78 could take other forms, such as separate pieces corresponding to the two sides 116 and 118, or that the tool retainer 78 could be attached pivotally to the body 84 of the tool carrier 86 by a separate pin or other fastener rather than being mounted on the pivot pin 68, if desired. It will also be understood that the blade base receptacle 82 might be formed as a cavity in the body 84 of the tool carrier 86, and open to only one side, with the other side of the body 84 remaining as a solid wall defining the blade base receptacle 82. With such a blade base receptacle 82 a tool retainer 78 with only a single side 116 or 118 moveable with respect to the body of 84 would be sufficient to selectively provide or obstruct access to the blade base receptacle 82.
Referring to
The tool holder 156 includes a tool carrier 158 and a tool retainer 160. The tool carrier 158 is similar to the tool carrier 86 except that it has a much smaller projection 162 instead of the larger projection 132 from its lower fork arm 90′, and the base of the tool carrier 158 has no latch receptacle notch 70, but is instead shaped to cooperate with a latch mechanism of the type commonly called a liner lock, located in a side of the tool handle 144. This latch mechanism includes a spring 164 arranged to urge the latching member 165 laterally outwardly from an inner wall 174 of the side trough 148 to engage the base of the tool carrier 158 when the tool is in its extended position with respect to the handle 144.
As seen best in
The pivot shaft 170 is mounted in and extends laterally from the center channel portion of the handle 144, which includes the inner wall 174 of the side trough 148. The tool holder 156 is kept in the extended, operative position by the action of the engaged latching member 165 of the latch mechanism on the rear of the tool carrier 158, while the rear face 166 of the projection on the upper arm 88′ of the tool carrier 158 bears on the abutment face 168 of the end of the handle 144, keeping the tool carrier 158 from being moved outward beyond the fully extended position of the tool holder 156. The tool retainer 160 is not engaged by the latching member 165, and so the detent 126 keeps the tool retainer 160 engaged with the tool carrier 158 in the tool securing position of the tool retainer 160.
When it is desired to disengage the tool retainer 160 from the tool carrier 158 or to disengage the tool retainer 78 from the tool carrier 86, the ears 130 can be pushed to overcome and disengage the detent 126, and thereafter the tool retainer 160 or 78 can be rotated with respect to the tool carrier 158 or 86 to a position clear of the blade base receptacle 82 to allow the base portion of the tool blade to be removed laterally from the blade base receptacle 82.
A respective flange 172 extends laterally outward from each side wall 174 of the center channel at the outer end of each handle 142 and 144 and continues therefrom to the front end of each side wing 152 and 154. The flange 172 includes the abutment face 168,
Referring again to
A pair of mirror opposite grip members 190 are installed in the handle frame shell 180. One grip member 190 is mated with each side 182 and 184, although only one grip member 190 is shown in
An outer face of each grip body 192, 194, defines a shallow, longitudinally-extending, trough-like depression 198 shaped to receive at least one finger tip comfortably, and a respective flange 200 surrounds and extends radially outward from a central part of the grip body 192 or 194 which defines the depression 198. The flange 200 thus extends closely along the outer surface of the respective side 182 or 184 of the handle shell 180. The back portion 196 fits closely alongside the inner surface of the handle shell 180 between the openings 186 and 198, with parts of the back portion 196 extending as flanges around the openings 186, 188 on the inner surface of the respective side 182 or 184 of the handle shell 180.
As may be seen best in
Additional, or differently-shaped, openings and corresponding grip bodies could be used instead of the two openings 186 and 188 and the grip bodies 192 and 194, with each such grip body preferably connected to at least one other by a back portion 196, so that each grip body helps to retain another from being removed outwardly from the handle.
A support member 210, as shown in
The grip members are 190 installed in the handle shell 180 by squeezing each of the grip bodies 192, 194 in turn, to pass its flange 200 through the respective opening 186 or 188, and then allowing it to return its original shape, so that the respective flange 200 extends outward around the opening 186 or 188 on the outer side of the handle shell side 182 or 184 and the back portion 196 rests against the inner surface of the handle shell 180. Thereafter, the support member 210 is placed against the inner face 202 of the grip member 190, receiving the grip member 190 in the cavity 212. The support member 210 extends around the grip member 190 and rests against the inner surface of the handle shell side 182 or 184, with its projecting retainer body 213 in the hole 201. A respective inwardly directed rim 214 or 216 of the handle shell side 182 or 184 rests against and protects a longitudinal margin of each support member 210.
If it is desired to provide only a single opening in place of the two openings 186 and 188 the associated grip member (not known) would preferably include a back portion extending in both directions from grip body, with a hole in the back portion for a projecting retainer body 213 near each end of the grip body.
A pair of mirror opposite support members 210 are used respectively for the opposite sides 182 and 184. A spacer body 218 at one end of each support member 210 is used to centrally locate the respective tang 44 or 48 of the jaws 38 and 40 of the pliers 32, as seen best in
Referring next to
A longer scissors handle, or main tool member handle 224, of the scissors 222 is mounted pivotally on a tool pivot shaft 171 of the handle 142, about which the main tool member handle 224 is moveable from the extended position shown in
A second tool member 228 is connected with the main tool member handle 224 at a scissors pivot joint 230. A blade member 232, mounted on the main tool member handle 224, extends forward from the scissors pivot joint 230, and a blade member 234 of the second tool member 228 and a handle 236 of the second tool member 228 extend respectively forward and rearwardly from the scissors pivot joint 230. As shown herein the blade members 232 and 234 are scissor blades, but in other versions of the folding scissors-action tool they could be other tool blades, such as pliers jaw or clipper blades, for example. In a preferred embodiment of the scissors action tool the handle 236 includes a comfortable handle grip portion 238 of a suitable molded thermoplastics material engaged, as by a sonic staking method, with the handle 236.
When the main tool member handle 224 is held in the extended position by the liner lock mechanism, as shown in
The base 246 of the spring 242 is attached to the base of the main scissors handle 224 by a pivot pin 248 engaged in mating bores defined respectively in the base portion 246 of the spring 242 and in the base of the main tool member handle 224 as can be seen in
As shown best in
That is, when the shoulder 244 is not in contact with and supported by the flange 172 the spring 242 is free to be moved far enough about the pin 248 so that its tip 240 no longer urges the handle 236 away from the handle 224, and the handles 236 and 224 can be moved to positions alongside each other. Thus, as soon as the liner lock mechanism has been disengaged from the base of the main handle 224 and the main handle 224 has been pivoted about the pivot shaft 171 through at least a small angle away from the fully extended position shown in
The ability to fold a scissors-action tool such as the scissors 222 with the blade portions 232 and 234 together makes use of such a tool more intuitive and safer than a folding scissors in which the blades must be separated to fold the scissors into a tool handle. That is, the scissors blade points and edges are not exposed alongside the opposite handles and thus are not as likely to cut a user in the process of unfolding the tool from stowage in the tool handle 142.
Another desirable result of this configuration is that the scissors 222 or other scissors-action tool can be freely moved away from the stowed position shown in
In a similar folding scissors-action tool such as the scissors 258 shown in
As with the scissors 222, the scissors 258 can be moved from its fully extended position upon release of the liner lock latching member 165.
As shown best in
Because the wire cutter 268 is located rearward of the pliers jaw pivot joint 42 it can in some situations be located closer to the pivot axis of the pliers pivot joint 42 than a wire cutter included in the pliers jaws 38 and 40 of a folding multipurpose tool, where the additional material needed for jaw strength requires wire cutter portions of the jaws to be located further from the pivot axis of the pliers pivot joint 42. As a result, in such a situation a greater shearing force can be applied to a wire for a given force applied to the folding handles 34 and 36, using the wire cutter 268 instead of one associated with the jaws 38 and 40. In any case, however, the location of the wire cutter 268 between the tangs 44 and 48 permits an additional, different, cutter or other tool requiring significant force to be located at the roots of the jaws 38 and 40.
Located immediately rearward from the wire cutter 268 and thus the spaced slightly further apart from the pivot axis of the pliers pivot joint 42, the crimping tool 270 includes opposing crimping members having narrow centrally located pressing faces 284 and 286. The crimping members are aligned normal to the pivot axis of the pliers pivot joint 42 and opposite each other, in position to approach each other closely once the wire cutter blades 272 and 274 have passed by each other and the pliers jaws 38 and 40 have moved to a fully closed position, although in use the pressing faces 284 and 286 would be separated by a article being crimped. A space 288 is provided along each side of each pressing face, so the pressure of the crimping tool is concentrated as required over a small area of an article such as a solderless electrical connector or a terminal being fastened to a bared wire by being crimped in place using the crimping tool 270.
An abutment block 294 is provided on each of the tangs 44 and 48, to be engaged by the back, or channel-base portion of the respective one of the handles 34 and 36 so that force can be exerted by the handles 34 and 36 on the tangs 44 and 48 to operate the pliers 32 and the wire cutter 268 and crimping tool 270 carried on the tangs 44 and 48.
As shown in
The terms and expressions which have been employed in the foregoing specification are used therein as terms of description and not of limitation, and there is no intention, in the use of such terms and expressions, of excluding equivalents of the features shown and described or portions thereof, it being recognized that the scope of the invention is defined and limited only by the claims which follow.
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|Publication date
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|Leatherman Tool Group, Inc.
|Multipurpose folding tool with tool bit holder and blade lock
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|Leatherman Tool Group, Inc.
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|Personal Protective Equipment, Llc
|Compact Foldable Firearm with Survival Tools
|U.S. Classification
|7/128, 30/156
|International Classification
|Cooperative Classification
|European Classification
|Jan 7, 2005
Owner name: LEATHERMAN TOOL GROUP, INC., OREGON
Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:YALE, MELISSA C.;TSUDA, HOLLAN A.;KLECKER, GLENN;AND OTHERS;REEL/FRAME:016161/0894
Effective date: 20050106
|Dec 17, 2010
|Fee payment
Year of fee payment: 4
|Dec 31, 2014
|Fee payment
Year of fee payment: 8