text:
|Publication number
|Publication type
|Application number
|Publication date
|Nov 8, 2005
|Filing date
|Feb 13, 2002
|Priority date
|Mar 8, 2000
|Fee status
|Also published as
|Publication number
|Michael Featherby, Jennifer L. DeHaven
|Original Assignee
|Sony Corporation, Sony Electronics, Inc.
|Export Citation
|BiBTeX, EndNote, RefMan
|Patent Citations (90), Non-Patent Citations (7), Referenced by (21), Classifications (54), Legal Events (12)
|External Links: USPTO, USPTO Assignment, Espacenet
This application is a continuation of U.S. patent application Ser. No. 09/520,928, filed Mar. 8, 2000 now U.S. Pat. No. 6,368,899 entitled ELECTRONIC DEVICE PACKAGING, incorporated herein.
The present invention relates to electronic device packaging, and more particularly to hermetic packaging of electronic devices. Even more particularly, the present invention relates to multilayer hermetic coating in electronic device packaging.
Integrated semiconductor circuits are critical devices in most electronic systems today. These integrated semiconductor circuits have been broadly used in a variety of fields. Historically, two versions of many integrated semiconductor circuits were designed by manufacturers, one packaged in a non-hermetic plastic package (plastic packaged microelectronics (PEM) device), such as molded epoxy, silicone or phenolic; and another packaged in a hermetic ceramic package. The hermetic ceramic packages were typically used in very sensitive, harsh environment and/or high reliability applications, such as military applications, including weapon systems; space applications, such as for use on Earth space orbit satellites; aerospace applications; ruggedized commercial and medical applications; and transportation applications, such as automotive and avionics applications.
One problem heretofore addressed by hermetic ceramic packages was to prevent the invasion of moisture, ions and other impurities, including oxygen, into critical portions of the package, for example, wire bond sites, and into an integrated semiconductor circuit die. This invasion of impurities can cause oxidation and other erosion of the integrity of the affected structures thereby causing failure of the device. This invasion takes place readily in plastic package devices through cracks or gaps occurring in the molding and in some cases through diffusion through the plastic itself, both of which form paths from an outside environment to the packages contents.
Problematically, in recent years, device manufacturers, for economic reasons, have ceased production of ceramic package devices, thus leaving entities in need of high reliability devices for sensitive applications without a suitable device for their application. Microelectronics are highly susceptible to gases, chemicals and particulates that invade plastic package devices. Pitfalls associated with this sensitivity can include: moisture causing corrosion; chemicals destroying wire bonds, internal circuitry and other pertinent aspects of the device. Further, before a package is added to a device, particulates present in injection molded or otherwise manufactured packages are capable of scratching the surface of the integrated semiconductor circuit die, potentially breaking wire bonds and causing shorts/opens inside the device, and are capable of reacting with or corroding the wire bonds, wires, leads or integrated semiconductor circuit die.
Thus, hermetically sealed packages are required for many applications where contaminants can jeopardize the functional integrity of the device, or where long-term reliability and/or operation in extreme environments are required.
As mentioned above heretofore, the current solution to these issues has been to use ceramic package devices. Ceramic packaging technology provides the hermetic sealing and long-term reliability required by many entities. However, the downfall of these packages has been that they are more expensive than similar plastic packages, tend to weigh more, and require specialized manufacturing equipment to produce. Although, the ceramic package device does effectively address the issue of hermeticity, the ceramic package device frequently provides a level of reliability and ruggedness that exceeds the levels actually required for most applications.
In contrast, the main advantage of plastic package devices is their ability to be mass-produced more cheaply and more easily than other currently available technologies. However, unlike with ceramic package devices, the largest percentages of failures in plastic package devices can be directly or indirectly related to their inherent lack of hermeticity and to the manufacturing techniques employed. Current users of plastic package devices in high-reliability applications are either incurring higher costs for maintenance of inferior products or suffering from a lack of long-term reliability.
A further advantage of plastic package devices is their abilities to operate at higher frequencies due to the lower dielectric constant of plastic, as compared to ceramic. Also, smaller sizes achievable in plastic package devices enables components to be placed closer together, thereby reducing propagation delays. Further, copper leads in plastic package devices have better electrical and thermal conductivity than KOVAR alloy that is used in the leads of ceramic package devices.
Ceramic package devices perform more consistently at high frequency than plastic package devices because moisture in the plastic can vary, changing the dielectric constant of the package and altering the operating speed of the integrated semiconductor circuit die.
Flexibility in low stress plastic formulations is gained at the expense of increased permeability due to the addition of plasticizers.
An alternative to ceramic package devices employs "wafer-level" coating of the integrated semiconductor circuit die itself, which adds yet more complexity to the manufacturing process, and brings with it engineering challenges as well. The die level application of the coating increases the hermeticity of the integrated semiconductor circuit die as well as the structural reliability of the device at a lower cost and in a manner that can be integrated into current production facilities. Unfortunately, this process must be performed as a fabrication step, before the integrated semiconductor circuit die is cut from the wafer, and thus requires altering "fab" processes. Problematically, once the integrated semiconductor circuit die is cut from the water, edges of the integrated semiconductor circuit die remain exposed and susceptible to contaminants. Furthermore, bonding pads on the surface of the integrated semiconductor circuit die must be exposed (for wire bonding for example) and thus create a further point of susceptibility to contamination. And, disadvantageously, this approach does nothing to protect the wires or wire bonds, a common point of contamination-caused failure. U.S. Pat. No. 5,780,163, issued to Camilletti et al., provides an example of "water-level" coating.
Hermetic coatings have also been applied to the integrated semiconductor circuit die and wire bonds after the die is attached to a die attach substrate and the wires are wire bonded to the integrated semi-conductor circuit die and leads. These hermetic coatings use plasma chemical vapor deposition of silicon nitride to prevent moisture from contaminating the device. This process can also be done to deposit diamond like carbon, silicon oxide and other insulating materials. One example of this type of hermetic coating is shown in U.S. Pat. No. 5,096,851, issued to Yamazaki et al.
Single layer PARYLENE coatings (para-xylylene) have been applied to the integrated semiconductor circuit die and wire bonds prior to packaging for the purpose of allowing for distortion of the wire bonds without short circuiting and reducing the requirements for high tolerances associated with relatively short length wires. U.S. Pat. No. 5,824,568, issued to Zechmans describes single layer PARYLENE coatings.
Bi-layer and tri-layer coating technologies have also been developed to provide moisture and oxygen barriers using any of parylene/BCB (cyclotene�)/SiO2, parylene/A1203, and parylene/SiO2. In these approaches, a PARYLENE layer is first applied, and then one or more subsequent ceramic layers are applied.
The present invention advantageously provides an approach for hermetic packaging of integrated semiconductor circuits.
The present invention can be characterized in one embodiment as a hermetically coated device comprising an integrated semiconductor circuit die; a first layer comprising an inorganic material, the first layer enveloping the integrated semiconductor circuit die; and a second layer, the second layer enveloping the integrated semiconductor circuit die.
In a further embodiment, the present invention can be characterized as a method of making a hermetically coated device. The method comprises providing an integrated semiconductor circuit die; applying a first layer comprising an inorganic material, the first layer enveloping the integrated semiconductor circuit die; and applying a second layer, the second layer enveloping the integrated semiconductor circuit die.
The above and other aspects, features and advantages of the present invention will be more apparent from the following more particular description thereof, presented in conjunction with the following drawings wherein:
Corresponding reference characters indicate corresponding components throughout the several views of the drawings.
The following description of the presently contemplated best mode of practicing the invention is not to be taken in a limiting sense, but is made merely for the purpose of describing the general principles of the invention. The scope of the invention should be determined with reference to the claims.
Referring first to
Prior to encapsulation, the die 16 and die attach substrate 14 are positioned near a center of the lead frame, near the interior ends 24 of the leads 22, and the wire bonds 20 are formed in a conventional manner, such as by thermocompression, thermosonic ultrasonic bonding, between bond pads 26 on the integrated semiconductor circuit die 16, and the interior ends 24 of the leads 22. These wire bonds 20 are formed by bonding a first end of each of the wires 28 to a respective bond pad 26 on the die 16, and by bonding a second end 30 of each of the wires to a respective one of the interior ends 24 of the leads 22.
Once all of the wires 18 are bonded to the respective bond pads 26 and interior ends 24 of the leads 22, the resulting structure (such as is shown in
As will be appreciated by the skilled artisan, the above description of the assembly process for a plastic package system 10, or plastic package integrated circuit device, represents just one plastic package device known in the art, a dual in-line pin device. Many other examples, such as flip-chip devices, ball grid array devices, pin grid array devices, bottom chip carrier devices, leaded chip carrier devices, leadless chip carrier devices, quad-flat pack devices, thin quad-flat pack devices, chip carrier J-lead devices, single in-line pin devices, dual-in-line devices, very small peripheral array devices, chip scale packaging devices, and numerous similar devices, all benefit from the advantageous techniques described herein below. Thus, the plastic packed integrated semiconductor circuit of FIG., and the examples described below, should be appreciated as just that, examples.
Problematically, the above-described plastic packaged integrated semiconductor circuit is susceptible to the infusion and moisture and other contaminants, such as oxygen, which can cause the corrosion or oxidation of the wires, the wire bonds, and the integrated semiconductor circuit die. These contaminants enter the plastic package through cracks, such as may form between the plastic package and the exterior ends of the leads where the exterior ends of the leads exit the plastic package; and in some cases may enter by diffusing through the plastic package itself.
Referring to
One of the major paths for moisture ingress in all plastic package devices is where the leads exit the plastic package. The adhesion between the metal and plastic is not good, partly because of release agents added to the resin to ease in the removal of the cured parts from the transfer mold. The narrow gap caused by this metal/plastic separation results in high capillary forces that can draw moisture into the package, along the bond wires and finally to the die. Sealing this gap effectively has proven difficult since flexing the lead, or heating the lead during soldering can break this tenuous seal.
Referring next to
As can be seen, the wires are connected electrically between respective bonding pads on an upper surface of the integrated semiconductor circuit die and respective leads of the lead frame.
The bonding of the wires to the bonding pads and to the leads may be achieved in a conventional manner using, for example, thermocompression, theomosonic ultrasonic bonding techniques, as are well known in the art.
Referring next to
Encapsulation of the integrated semiconductor circuit die, the wires, the wire bonds and the leads with the first layer of the duplex coating, i.e., the inorganic ceramic like material, is preferably effected by non-line-of-sight processes such as CVD, PECVD, metalorganic chemical vapor deposition and sputtering at temperatures below approximately 300C. The preferred techniques use a low pressure chamber with the chemicals introduced in a vapor phase, although other approaches are contemplated, such as atmospheric pressure processes.
One process that can be used to encapsulate the integrated semiconductor circuit die (or the plastic package device, or both, as described further hereinbelow) is atomic layer deposition (ALD). This technique achieves an impermeable ceramic coating at low temperatures without the use of plasma, which may damage or destroy the integrated semiconductor circuit die. Corrosion is addressed by using phosphorus and halogen-free precursors. Pinholes, a problem with some other chemical vapor deposition methods, cannot be propagated by this technique. The atomic layer deposition has processing temperatures in the range of 150-250� C. and intrinsic precise layer thickness control at the atomic scale.
Atomic layer deposition (ALD) and atomic layer epitaxial (ALE), and their companion technique metalorganic chemical vapor deposition (MOCVD), are well suited to producing layered structures, either epitaxial or non-epitaxial. Metalorganic chemical vapor deposition can also deposit thicker monolithic layers. A large number of materials can be deposited by these techniques. Dielectrics which may be deposited by atomic layer epitaxial (ALE) in polycrystalline or amorphous form include, for example, aluminum nitride, silicon nitride, silicon carbide, alumina, titania, zirconia, hafnia, silica, magnesia, yttria, ceria, niobium oxide, tantalum oxide, lanthanum oxide, strontium titanate and barium titanate.
Thin-film technology makes it possible to deposit a very thin (down to a few atoms in thickness) layer of material on a substrate or surface. With proper system design, both metalorganic chemical vapor deposition and atomic layer epitaxial modes can be carried out in the same deposition system. The thin films grown by the metalorganic chemical vapor deposition technique are either textured polycrystalline or epitaxial single crystal depending on the substrates used.
Atomic layer epitaxy (ALE) is a special modification of the chemical vapor deposition technique for depositing thin films and related surface structures. The unique feature of atomic layer epitaxial is the self-limiting film growth mechanism which gives it a number of attractive properties, like accurate and simple film thickness control, sharp interfaces, uniformity over large areas, excellent conformality, good reproducibility, multilayer processing capability, and high film qualities at relatively low temperatures. Other than being able to deposit the particular preferred materials for the barrier layer, other aspects of the process justify its selection. Specifically, this process is able to uniformly deposit coatings over large areas with excellent conformity and good reproducibility. Thickness control is simple and precise since the deposition is 'pulsed' and each pulse deposits the same thickness increment. High quality films can be deposited at low temperatures. There is a downside, in that the deposition rate is low (less than 5000 A/hr) but the quality of the film may be so high that thinner layers are as effective as thick layers from 'cruder' processes. However, since this is a gaseous-based process, large volumes of materials can be uniformly coated at one time, so the throughput in terms of the number of parts coated per hour could be competitive or better than other techniques that are more difficult to scale up.
The metalorganic chemical vapor deposition technique uses liquid metalorganic precursors which vaporize in a carrier gas stream before reaching the substrate surface. The carrier gas can be either oxidizing (air, oxygen) or non-oxidizing such as hydrogen, nitrogen or argon. The formation of the desired compound occurs via the pyrolysis of the metalorganics and the subsequent recombination of the atomic or molecular species at or near the heated substrate. Liquid metalorganic precursors with relatively high vapor pressures are preferred if they are safe, especially if no toxic byproducts are produced. In metalorganic chemical vapor deposition, the deposition rates can be as high as 10 μm/h. The metalorganic chemical vapor deposition chamber can be optimized to deposit over large areas.
As a further alternative, open-atmosphere combustion chemical vapor deposition (CCVD) technology may be used. Advantages include an order-of-magnitude reduction in operating and capital costs, improved materials quality and performance characteristics, and the ability to tailor-make materials for specific applications (including multi-layered structures). In addition, combustion chemical vapor deposition's relative ease-of-use permits rapid development of new coating/substrate combinations.
The combustion chemical vapor deposition (CCVD) process has demonstrated its potential to address the aforementioned requirements. Combustion chemical vapor deposition technology has significant promise to overcome many of the shortcomings of traditional vapor deposition techniques while yielding equal and/or better quality coatings at a lower cost.
One advantage of the CCVD technology is its ability to deposit thin films in the open atmosphere using inexpensive precursor chemicals in solution. This obviates the need for costly furnaces, vacuum equipment, reaction chambers, and post-deposition treatment (e.g. annealing). As a result, capital requirements and operating costs are reduced at least tenfold when compared to competing vacuum-based technologies (e.g. sputtering and metalorganic chemical vapor deposition). The ability to deposit thin films in the open atmosphere enables continuous, production-line manufacturing. Consequently, throughput potential is far greater than with conventional thin-film technologies, most of which are generally restricted to batch processing.
In practice, precursors are dissolved in a solvent, which typically also acts as the combustible fuel. This solution is atomized to form submicron droplets by means of NANOMISER technology, owned by MicroCoating Technologies, Inc., of Georgia. The droplets are then convected by an oxygen stream to a flame where they are combusted. A substrate is coated by simply drawing it over the flame plasma. The heat from the flame provides the energy required to evaporate the droplets and for the precursors to react and to deposit on the substrates. Although flame temperatures can be in excess of 800� C., the substrate may dwell in the flame zone only briefly thus remaining cool (<100� C.). Alternatively, the substrate can be actively cooled. Substrate temperature is therefore an independent process parameter that can be varied to actively control the film's microstructure. The process generally takes no more than two hours from set-up to post-deposition cleaning.
Conventional chemical vapor deposition requires precursors with sufficiently high vapor pressures. This frequently necessitates the use of expensive materials and often produces toxic fumes which must be carefully treated ("scrubbed"). In contrast, the combustion chemical vapor deposition technique uses inexpensive, soluble precursors that do not need to have a high vapor pressure. Hence, precursors for the combustion chemical vapor deposition process tend to be between 10 and 100 times less expensive than those used in traditional chemical vapor deposition processes. Physical structure and chemical composition of the deposited films can be tailored to the specific application requirements.
The combustion chemical vapor deposition process is well-suited for high-rate deposition (up to 1 cm/min.) of dielectrics such as SiO2.
As yet a further alternative, diamond-like carbon (DLC) shows a great deal of promise. It can be deposited to present either a hydrophobic or a hydrophilic surface to the 'outside world'.
The exterior ends of the leads, where electrical contact will subsequently be made, are masked against coating or the coating can be mechanically removed from these areas afterwards.
Masking can be tedious and time consuming and will have to be done correctly since the proposed coating methods are capable of depositing on minute unmasked areas. GORE-TEX, a fluorocarbon foam tape, that conforms by flowing tightly around irregular surfaces (such as rectangular cross section leads on integrated semiconductor circuit die devices) when compressed may be used as a masking material. This material may be too expensive, however, unless it can be sufficiently reusable. Reusable cast rubber molds (commercially available to protect connectors during soldering operations) can provide a more cost effective alternative, as can polyimide tape, tape, organic maskants, metal masks, rubber masks, and plastic masks.
Mechanical or chemical stripping of the coating on the contacts is also an option. A UV laser may provide one mechanism for stripping the coating, by ablating the coating from the leads.
Any ceramic or glassy material is suitable as the first layer of the duplex coating. Preferably the material should be electrically insulating, e.g., greater than 108 ohm-meters; able to be deposited as a conformal film around all the constituent assembled parts of the device; able to be deposited as an essentially pin-hole-free coating, e.g., having a moisture permeability of less than 10−10 g/cm-sec-torr; able to be deposited at a temperature low enough to avoid detrimental effects to the device and constituents, e.g., at less than 300� C. for 0.1 hours, or equivalent energy input; adherent to the constituent parts of the device so as to resist or prevent delamination or blistering during use of the plastic package device in the presence of moisture, ions and thermal cycling; impervious to moisture, alkali metal ions and halogen ions; non-reactive and otherwise compatible (electrically, physically and mechanically) to the constituent parts of the device and to subsequent processing.
Preferred ceramic materials are oxide ceramics (including alumina, titania and zirconia) silicon-based ceramics (including silicon nitride, silicon oxide and silicon oxynitrides) and diamond-like carbons in amorphous or crystalline forms.
Any thickness able to reliably produce a coherent, essentially pin-hole-free film is satisfactory (typically in excess of 500-1000 Angstroms). Thicker films improve the degree of hermeticity (unless they self-destruct from internal stresses). 5000-10,000 Angstroms is a practical upper limit for economic reasons.
Referring next to
Encapsulation of the integrated semiconductor circuit die, the wires, the wire bonds, the leads and the first layer of the duplex coating with the second layer of the duplex coating, i.e., the organic overcoat is preferably effected by applying a layer of PARYLENE C, a form of para-xylylene.
PARYLENE C has many ideal properties for this part of the duplex coating. Other PARYLENE formulations may also be suitable in various embodiments. The thickness of the coating should preferably be optimized. Thicker coatings will increase the rigidity of the bond wires, be a better cushion against the abrasive and stress effects of the molding compound and provide better physical protection of the ceramic layer. However, thicker coatings are more expensive to apply and will reduce the heat dissipation of the die through the package when applied internally.
As an alternative, a new class of materials offers such an alternative, sol-gel hybrids (or sol-gel derivative materials, or fluoropolymer-silica hybrids), which differ significantly from conventional sol-gels. These materials may be applied thick enough to act as a compliant layer or external scratch resistant layer as an alternative to PARYLENE, since they should have a significantly lower permeability and be harder than PARYLENE. Sol-gel hybrid coatings can also be applied as a hard thin layer, one that may even qualify as a barrier layer, but also as a leveling layer, should one become necessary or desirable before application of the first layer. As a leveling layer, it should be far superior to FOx (flowable oxide) since it can be cured in minutes at 40 to 80� C. in air as opposed to hours at 250-450� C. or higher (in a nitrogen atmosphere) for the FOx coating.
The fluoropolymer-silica hybrids are a new generation of super-adherent coatings having the combined properties of the constituent coating materials: good chemical and excellent * water resistance, polymer flexibility, hydrophobicity (water repellency), low surface energy, low dielectric constant and thermal stability (above 200� C.), combined with high transparency, hardness and mechanical strength of the silica network
The exterior ends of the leads, where electrical contact will subsequently be made, are masked against coating or the coating can be mechanically removed from these areas afterwards. Masking techniques are described above in reference to the first layer and are substantially the same for the second layer.
Note that while in the figure shown herein the second layer extends beyond the first layer, such layers may not overlap in practice so that masking efficiency can be achieved, i.e., so that the mask does not have to be removed and repositioned between coatings.
The inorganic ceramic-like material of the first layer of the duplex coating serves as a primary barrier layer to moisture and ionic contamination. The organic overcoat of the second layer of the duplex coating also has some barrier properties but it also provides a physical protective layer for the thinner, more brittle inorganic ceramic-like material of the first layer of the duplex coating. Both layers are electrically insulating.
Any organic material is suitable as the organic overcoat of the second layer of the duplex coating. Preferably the material should be electrically insulating, e.g., greater than 108 ohm-m resistivity; able to be deposited as a conformal film around all the constituent assembled parts of the device without damage to the first layer; able to be deposited as an essentially pin-hole-free coating, e.g., less than 0.5 g-mil/100 in2 moisture barrier transmission rate; able to be deposited at a temperature low enough to avoid detrimental effects to the device and constituents; able to be readily built up into thicknesses to at least 0.5 mils, e.g., preferably between 1 and 3 mils; adherent to the first layer so as not to delaminate or bubble in the presence of moisture or ions; compliant and tear resistant, e.g., having an elongation ability of 10% or more; impervious to moisture, alkali metal ions and halogen ions; non-reactive and otherwise compatible (electrically, physically and mechanically) to the constituent parts of the device and to subsequent processing.
The second layer of the duplex layer is applied directly over the top of the first layer and, as mentioned above, is preferably PARYLENE C, other grades of PARYLENE, sol-gel hybrids, or other condensed or plasma polymerized organic films. PARYLENE C is an excellent moisture and ion barrier for an organic material, is an electrical insulator, is pinhole free in sub-micron thick films yet can easily be deposited in layers over 25-75 microns thick. Thick films over 25 microns thick provide rigidity to fragile bond wires during molding and its malleability provides protection from abrasive particles in the molding resin and decouples stresses between components and the molding compound.
While specific examples of materials for the first layer 300 and the second layer 400 are described, it will be appreciated by the skilled artisan that each layer serves a distinct and important purpose. The first layer is a barrier layer and has as its primary function the prevention of moisture and/or ion passage. The second layer is a compliant or protective layer and has as its primary function the protection of the more brittle first layer during handling and manufacture, such as injection molding.
As shown, the duplex coating is preferably applied to partially assembled lead frames containing attached dice and wire bonds, i.e. at the stage just prior to when the parts are transfer molded in standard commercial practices.
Referring next to
While the plastic package 12 is applied in a conventional manner is it noted that conventional additives, added to protect against moisture and ions may not be needed in plastic packages in accordance with which the present embodiment or other embodiments described herein are employed.
Thus, as can be seen, the duplex coating of the present embodiment provides a hermetic barrier that protects the integrated semiconductor circuit die, the wires, and the wire bonds from contaminants, such as water and oxygen that enter the plastic package. As will be appreciated, the present embodiment, thus provides a plastic packaged, yet hermetic integrated semiconductor circuit device, thereby achieving the economic advantages associated with plastic package devices, while achieving the high-reliability and long-life advantages of ceramic packaged devices.
Further the embodiments described herein provide much greater packaging flexibility than conventional ceramic packaging designs, while allowing operation in chemically sever environments.
It is noted that while, as shown, the first layer is in contact with the integrated semiconductor circuit die, such contact is not needed. As illustrated below, see
Referring next to PIG. 1 and
Referring to
Thus, first (
Referring next to
Referring next to
Referring next to
Referring to
While the invention herein disclosed has been described by means of specific embodiments and applications thereof, numerous modifications and variations could be made thereto by those skilled in the art without departing from the scope of the invention set forth in the claims.
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text:
Terms & Conditions
The terms and conditions provided by Central (UK) Vehicle Leasing Ltd, 1 Badhan Court, Castle Street, Hadley, Telford, Shropshire, TF1 5QX (referred to as "Central", "us", "our" or "we" in this statement) for the information of visitors (referred to as "you" or "your" in this statement) to our website.
By using Central's Website you are bound by these terms and conditions.
The prices quoted exclude VAT for business contracts and includes VAT for personal contracts unless otherwise stated. VAT is applicable at the current rate and should this change before delivery then the new rate will apply.
All vehicles include delivery by the dealership to a UK mainland destination, number plate and vehicle registration charge.
All vehicles are supplied with the Road Fund Licence for the full term (if applicable). All business contract purchases, personal contract purchases or any Operating Leases notably with Mercedes Finance only attract the Road Fund Licence (RFL) for the first year only. The hirer will be responsible for the RFL for any subsequent years.
Central reserves the right to change the price either before or after an order is accepted. Central will notify you of such a change and you have the right to cancel your order if the change is not acceptable.
Prices on our website are for information purposes only and do not constitute an offer by Central capable of an acceptance by you.
Some orders may attract a documentation fee by Central, the finance company or the manufacturer and any such fees will be disclosed at quotation stage. All vehicles funded through Mercedes Finance attract a £180 inclusive of VAT handling fee payable to Mercedes Finance and is non-negotiable.
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The rates, images, standard equipment, factory fitted options, colour and trim and technical data are supplied by the vehicle manufacturers to CAP and formatted for use and are for information purposes only and while every effort is made to verify and ensure the accuracy of the data, the information should only be used as a guideline and cannot be relied upon. All images on this website are for illustration purposes only.
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Information on delivery timescales are estimates only and do not constitute an obligation to supply. Delivery dates are subject to change by the manufacturer.
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Refers to cars available in the UK for delivery within 2-4 weeks. The vehicles may be physical at the dealership, within the dealer group or at the local UK port awaiting transportation to the dealership.
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Our website and these conditions are governed by English Law. Any disputes arising from this website shall be resolved by the English courts unless you can show you accessed our website from Scotland, in which case the Scottish courts may be used.
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Central (UK) Vehicle Leasing - Complaints Procedure (April 2011)
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Your complaint will be fully investigated and a response issued within 10 working days.
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Please contact us in any of the ways mentioned above or complete a comment card at our offices.

subset: commoncrawl


text:
This is the first proper story I ever wrote. I wrote it a few years ago and it's only three paragraphs long, but it's still pretty good.
It's about a man searching for his next fix, hense the name.
How you enjoy. Comment, rate and so forth.
He stumbled through the dark streets, the rain soaked pavements glistened in the light of the lamp posts. His mind was only on one thing. He needed his fix. The sounds of the traffic were faint and muffled, his vision was hazy. He wondered around corner after corner, helplessly searching for the only thing he needed. He knew it was wrong, his need was the causes of all his troubles, but in some ways it was also the solution. He has a vivid image of it in his head, his sweet addiction, his blessing, his curse. He needed his fix, no matter what it took.
He eventually stopped at a block of flats, bleak and depressing, the grey concrete covered in graffiti. He pressed the button and, after a short pause, he heard the familiar long buzzing sound and the large metal door was unlocked. After pushing his way through the entrance he saw that the lift was out of order, the doors dented as if they had been kicked with a great deal of force. He was frustrated, but didn't dwell on it, and climbed the many flights of stairs to the fifth floor, the anticipation to get to his fix taking his mind off how tired he was as he reached his destination. He walked through the narrow corridor, the paint on the walls chipped, a light bulb flickering in the distance, a damp, eerie smell filling his lungs. He walked up to the far end of the hallway to a brown door, Flat 4B. He knocked on it, urgently yet anxiously, his hand trembling. He was so close. On the other side of this door was what he needed. His fix. He longed for his fix with every fibre of his being, but he feared his fix because of what it was doing to him, transforming him into nothing more than a desperate junkie.
The door finally opened, creaking at its rusty hinges. His heart skipped several beats, as if he were having a pleasant heart attack, his eyes widened like a dear caught in the headlights of a vehicle, his throat became dry and he felt light headed. There she was, standing right in front of him in all her haunting beauty. His sweet addiction. His blessing. His curse. His fix.


text: WHITE PLAINS, N.Y., Aug. 29, 2011 /PRNewswire/ -- Drew Industries Incorporated (NYSE: DW), a leading supplier of components for recreational vehicles (RV) and manufactured homes, today announced that its wholly-owned subsidiary, Kinro, Inc., acquired the business and assets of Starquest Products, LLC and its affiliate, Qualitec Manufacturing, LLC (together "Starquest"). This is the Company's fourth acquisition of 2011, which together add more than $70 million in annualized sales. Starquest has annual sales of approximately $22 million, comprised primarily of windows for truck caps, which are fiberglass enclosures that fit over the bed of pick-up trucks, painted to automotive standards and designed to exact truck bed specifications. Starquest also manufactures windows and doors for horse trailers and buses. The purchase price of $22.6 million was funded with available cash and approximately $12 million of borrowings pursuant to Drew's $50 million line of credit. Drew expects the acquisition to be immediately accretive to earnings. "Starquest is a great company, and highly respected in its industries, with a 50 percent market share for windows for truck caps and an increasing share in the horse trailer market," said Fred Zinn, Drew's President and CEO. "This is an excellent opportunity to accelerate our diversification into related markets." The key managers of Starquest have entered into employment agreements with Kinro, and will continue to manage the business. "The Starquest team has developed strong relationships throughout their industries, and we expect to build on that strength," said Jason Lippert, CEO of Kinro, and its sister company, Lippert Components. "As in our all of our businesses, management's responsiveness to the needs of our customers is the key to success." "We are very pleased that the business we have seen thrive will continue to be managed by our outstanding team," said Kelly Rose, Chairman, and Mike Schoeffler, CEO, who were the two principals of Starquest. "With the financial and strategic support that Kinro and Lippert Components can provide, we are confident that the Starquest business will continue to grow." "Starquest's markets are right in the sweet spot of our on-going diversification efforts," said Scott Mereness, President of Kinro and Lippert Components. "We already manufacture certain components for use in buses and horse trailers, and we believe Kinro and Lippert can provide significant additional 'content' to these markets from our broad array of other components. Further, we expect to utilize our extensive purchasing power, manufacturing expertise, and engineering capabilities to improve operating efficiencies, enhance the Starquest product line, and provide value to our customers." "This year alone, we have invested nearly $50 million in acquisitions," said Joseph Giordano, Drew's CFO and Treasurer. "Through these acquisitions and the recent introduction of our new RV awning product line, we have significantly enhanced our growth opportunities. With more than $150 million of unused borrowing capacity, we have the financial strength to continue to pursue strategic expansion opportunities." About Drew Drew, through its wholly-owned subsidiaries, Kinro and Lippert Components, supplies a broad array of components for RVs and manufactured homes, including windows, doors, chassis, chassis parts, bath and shower units, axles, and upholstered furniture. In addition, Drew manufactures slide-out mechanisms for RVs, and trailers primarily for hauling boats. Currently, from 28 factories located throughout the United States, Drew serves most major national manufacturers of RVs and manufactured homes in an efficient and cost-effective manner. Additional information about Drew and its products can be found at www.drewindustries.com . Forward-Looking Statements This press release contains certain "forward-looking statements" within the meaning of the Private Securities Litigation Reform Act of 1995 with respect to financial condition, results of operations, business strategies, operating efficiencies or synergies, competitive position, growth opportunities for existing products, plans and objectives of management, markets for the Company's Common Stock and other matters. Statements in this press release that are not historical facts are "forward-looking statements" for the purpose of the safe harbor provided by Section 21E of the Securities Exchange Act of 1934 and Section 27A of the Securities Act of 1933.


text:
Whether it is cruising Desolation Sound with the family or fishing off the West Coast with the guys, you can do it with style and functionality in this well laid out and well maintained vessel from award winning and higher end manufacturer, Chaparral Boats. Super well built, the Signature 300 hull features a 20* deadrise for superior rough water performance. Viewing by appointment please as vessel is located off site.
Fuel: 153 Gallons-Aluminum
Fresh Water: 30 Gallons-Plastic
Holding: Yes w/Macerator Pump
1955 Swartz Bay Road
Sidney, BC V8L 3X9


text:
£244,950 Fixed price
We are delighted to bring to the market this lovely, three bedroom, detached villa in a popular location. Freshly decorated and ready to move into, this property would be a fantastic acquisition as its superb spot offers great commuting links, as well as being within a short distance to local amenities. The house has been well designed to maximise privacy and the natural available light to create a contemporary ambiance. The welcoming hall gives access to all apartments. The spacious lounge/dining room offers scope for various furniture configurations and is flooded with natural light. The modern kitchen has been fitted with a range of floor and wall mounted units. It boasts a gas hob, electric oven and ample worktops. Also located on the ground level you will discover a handy shower room Upstairs there are three good size bedrooms, the master with built in wardrobes and en-suite shower room. The large family bathroom is located on the upper level and consist of White three piece suite.The comfortable home has electric heating and double glazing. Externally, the back garden is beautifully landscaped and secure by fencing perfect for outdoor living and safe for children and pets. The front garden offers parking for several vehicles.This is an excellent opportunity to acquire this spacious family home quietly located in this desired residential development.
By appointment through McEwan Fraser Legal on 01333 400 400
McEwan Fraser Legal are open 7 days a week: 8am - Midnight Monday to Friday &9am - 10pm Saturday &Sunday to book your viewing appointment.Extras (included in the sale): Integrated appliances
This house description is based upon information supplied by the owner, or on behalf of the owner. These property particulars are produced in good faith and do not constitute or form part of any contract. s1homes do not take any responsibility for the accuracy of the information contained in this document.
If a property value displays '0', don't worry it just means no properties have been sold in that area during that time.
Sold house price data is supplied to us by the Registers of Scotland, a government department responsible for compiling and maintaining property registers, every month. There can be a delay of up to 3 months from when a property is sold to being recorded with Registers of Scotland. We provide house price data for your information only, we do not accept any liability for any errors. If you have noticed any incorrect information, please contact Registers of Scotland.


text:
Ballparks, Arenas and Stadiums
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Fenway Park Pt.4 - Boston, Massachusetts
Ballparks, Arenas and Stadiums
Fenway Park Pt.4 - Boston, Massachusetts
Music - Don't ever wanna lose ya and Explorer suite by New England
All these photos were shot in August of 2013 using digital.
Location - 4 Yawkey Way Boston, Massachusetts Bounded by Landsdowne St., Van Ness St., Ipswich St., Brookline Ave.
Fenway Park....the green monstah, Williamsburg, the Citgo sign, the Pesky pole, canvas alley, the Fisk pole, the triangle in centerfield, the belly in right, Duffy's cliff, all quirks of a living legend.
Located in the back bay section of Boston, Fenway has stood at the crossroads of Lansdowne Street, Brookline Avenue, Jersey Street (now known as Yawkey way), Van Ness Street and Ipswich Street since 1912. It was scheduled to open on April 18, 1912, but rain forced the postponement till April 20, 1912. Fenway opened the same day Tiger stadium opened, and 5 days after the Titanic sunk. Fenway was considered older than Tiger stadium (even though they opened the same day) because of the 1 hour time difference.
It has seen 3 all star games (1946, 1960 and 1999) and has been the site of 11 world series. The world series in 2004 ended the 86 year so called "curse of the bambino." IDIOT Red Sox owner Harry Frazee sold his best player, Babe Ruth, to the Yankees in 1919 for $100,000 to help finance his production of "No No Nanette." The so called curse FINALLY ended after 86 LONG years. The Red Sox came close to ending it 3 times, but ultimately lost the 7th game of the world series. In 2004 the Red Sox were down 3 games to 0 in the ALCS against their hated rival the New York Yankees. They were down to their last 3 outs. Dave Roberts pinch ran for Kevin Millar who walked, and stole second. He then scored on a Bill Mueller single to tie the game. Then in the bottom of the 12th, David Ortiz hit a 2 run home run off Paul Quantrill to send the Sox home winners, and propel them to 3 more victories and a birth in the World Series. The 2004 World Series was a 4 game sweep for the Red Sox. The victims were the St. Louis Cardinals. Fenway was also the site of arguably the greatest world series game ever played. It happened on October 21, 1975. The Red Sox were playing the Cincinnati Reds. It was a see saw game and the Reds had a 6-3 lead with 2 out in the bottom of the 8th inning. Bernie Carbo was pinch hitting for Roger Moret. He took one of the worst hacks at a pitch I have ever seen, fouling it off. The next pitch from Rawley Eastwick was sent rocketing into the centerfield bleachers for a game tying 3 run home run. The game went on into the 12th inning when Carlton Fisk sent a Pat Darcy fastball screaming towards the left field foul pole. He was seen running down first waiving the ball fair. After he touched home plate, the Fenway organist, John Kiley, started playing the Hallelujah chorus. Even though the Sox lost the series the next night, this game will last forever. It didn't take the Red Sox long to win another worlds championship. In 2007, the Red Sox swept the Angels in the ALDS, and came back from a 3 games to 1 situation to beat Cleveland to advance to the world series. Just like in 2004, the Red Sox swept their national league opponents. This time, they beat the Colorado Rockies who were in their first ever world series.
Fenway has had many oddities. First was Duffy's cliff, named after Red Sox outfielder Duffy Lewis. From 1912 thru the 1933 season, there was a 10 foot high incline in front of the then 25 foot high left field wall. Lewis mastered the incline so well that it ended up being known as Duffy's cliff. By far the best player ever to master all the angles and dead spots of the green monster was Carl Yastrzemski. Yaz knew every quirk of the 37 foot high wall. Fenway also has the manually operated scoreboard at the base of the monster. Between the out of town scores, there are the initials TAY and JRY displayed in Morse code. It is a memorial to former Red Sox owner Tom Yawkey and Jean Yawkey. The right field foul pole was officially named the "Pesky pole" on September 27, 2006. Johnny Pesky had a knack for hitting fly balls down the 302 foot right field line. On June 14, 2005, the left field foul pole was renamed the "Fisk pole" for former Red Sox catcher and hall of famer Carlton Fisk.
Two Red Sox legends never played for the Sox. The first was baritone PA announcer Sherm Feller. Unlike today where you get PA announcers SCREAMING their hometown player introductions (you should hear the one in San Francisco when Barry Bonds comes up), Feller calmly went about his business announcing the players. From 1967 to 1993, Sherm would welcome people to Fenway with his familiar "Ladies and gentlemen, boys and girls, welcome to Fenway Park." Sadly, the Red Sox golden voice passed away in 1994 at the age of 75. There will never be another one like him. John Kiley was another legend that never played an inning for the Sox. BUT he did play. The organ that is. He is the answer to a trivia question. Albeit a trick question. Who is the only guy to play for the Red Sox, Celtics, and Bruins? From 1953 - 1989 John Kiley played the organ at Fenway park. He did double duty at the old Boston Garden too. Kiley passed away in 1993.
Baseball was not the only sport played at Fenway. The old Boston Redskins (now the Washington Redskins) played at Fenway. The Boston Patriots called Fenway home from 1963 thru 1968.
Thru the 95 years now, Fenway has seen its share of greats. Smokey Joe Wood, Ernie Shore, Cy Young, Tris Speaker, Dutch Leonard, Babe Ruth, Jimmy Collins, Harry Hooper, Joe Cronin, Jimmy Foxx, Mel Parnell, Rick Ferrell, Lefty Grove, Dom DiMaggio, Bobby Doerr, Dick "the Monster" Radatz, Tony Conigliaro, Rico Petrocelli, Carlton Fisk, Fred Lynn, Jim Rice, Wade Boggs, Dwight Evans, Bernie Carbo, Mo Vaughn, Pedro Martinez, Manny Ramirez, David "big papi" Ortiz, YAZ, and the greatest hitter who ever lived, Ted Williams, all played at Fenway for the Red Sox.
The new ownership has made several great changes to the old girl, and lets hope that she will last another 100 years. LONG LIVE FENWAY PARK! Enjoy!
My nephew Evan on top of the Monstah..... 8/13


text:
GENEVA (AFP) – Switzerland's banking sector, facing the end of the secrecy that was once the bedrock of its business, is turning to China as it seeks new markets for the future.
"One of the first ports that the Swiss financial centre is steering for… is the port of China," Claude-Alain Margelisch, chief executive of the Swiss Bankers Association, told reporters in Geneva this week.
"Together with our member banks, we want to make Switzerland an international hub for the renminbi," also known as the yuan.
Switzerland will abandon its long-prized banking secrecy in 2017 when it starts automatically exchanging account details with other countries, and with it goes one of the main attractions of placing money in its banks.
For generations, investors have paid Swiss banks high fees to hide their money from tax authorities around the world, providing a lucrative stream of revenue for them.
But the global financial crisis prompted demands for a tougher regulatory environment. Switzerland was reluctantly forced to accept the new rules, leaving the banks facing an uncertain future.
Not only are private Swiss banks looking for new sources of revenue, but they have also faced probes and massive fines from countries accusing them of abetting tax dodging.
"The Swiss financial centre and the Swiss banks have recognised the need for action," said Margelisch.
"We have drawn the necessary conclusions from previous mistakes and introduced counter-measures."


text:
Contact us 24/7: +1 877 678 9627
View product details
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- - Fits true to size, take your normal size
- - Cut for a slightly loose fit
- - Model is 177cm/ 5'10" and is wearing a size XSmall
Burberry Brit looks to its heritage for inspiration - this soft gray wool and cashmere-blend sweater is emblazoned with a London taxi intarsia. Wear this fine-knit piece alone or layered over a camisole when the temperature cools.
Shown here with: Theory jacket, Eddie Borgo ring, Frame Denim jeans, Toga Pulla boots, Alexander Wang bag.
- - Gray fine-knit wool and cashmere-blend
- - Black taxi intarsia, ribbed trims
- - Slips on
- - 70% wool, 30% cashmere
- - Dry clean
Product Code: 379467
For alternative suggestions, contact our Fashion Consultants
Help & Advice
Product Code: 379467


text:
Pulse ClimbingOutdoor & Adventure Indoor Rock Climbing Centres
10/122 Garden Grove Pde, Adamstown, NSW 2289 20-30 km from Morisset
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10/122 Garden Grove Pde, Adamstown, NSW 2289 20-30 km from Morisset
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We started at Iplay some time ago when our youngest daughter wanted to learn drums. She's still doing drums but now both our daughters are learning to sing, I'm learning bass and my wife is learning ukelele. The staff at Iplay live for the music and always put the students first. It's a friendly, relaxed environment which makes learning easy and fun. Whether you're 6 or 60 Iplay can teach you. Don't sit back and wonder, get out there and learn, you won't regret it
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Date: Fri, 18 Nov 2011 14:28:21 -0600From: Christopher Rogers <firstname.lastname@example.com>Subject: Re: [Aroid-l] Colour Pictures in AroidianaTo: Discussion of aroids <firstname.lastname@example.com>Message-ID: <firstname.lastname@example.com>Content-Type: text/plain; charset="iso-8859-1"Hiyer!Speaking as an an editor of an international scientific journal and guesteditor for another, I
can answer that question (Derek, I hope you do notmind my jumping in here . . .). Colour is very nice, very pretty, but hasdrawbacks. There are actually a couple of reasons:1) Cost. In the journals where I publish my research, black and whiteimages are free for the author to publish. Colour plates usually run$300USD each. Do we pass that cost on to the authors? Well, yes, andAroidiana does just that. If you want to publish a colour picture, you mustbear the cost. If we require that all photograph submissions are in colour,do we increase the cost of the journal? Will we lose subscriptions? If thecost goes to the authors, will they then publish elsewhere, where the costsare lower? By making this a requirement, we could harm the journal and theIAS. And Aroidiana does publish colour on occasion (see volume 34) when theauthors will pay for it.2) Detail. When preparing a scientific account, such as a
speciesdescription, black & white photographs are often superior for the simplereason that in a black and white image more detail is apparent. This is whysome famous photographers (such as Ansel Adams) chose to use black & whitefilm. Obviously, this is not a concern on our articles that are not of aspecifically taxonomic nature.I hope that this is helpful. The role of the editor is not always obviousor transparent to the readers.Happy days,ChristopherOn Fri, Nov 18, 2011 at 12:19 AM, E.Vincent Morano <firstname.lastname@example.com>wrote:> I sure hope Aroideana starts using color images. The 60's are long gone> as should be black and whit photos with them. Ugh they are so ugly I mean,> we are entering the second year of the second decade of the
new millennium,> we should have nothing but hi definition color images now! Maybe even a few> holograms haha.> But seriously, my first book of Aroideana #34 was such a disappointment.> Why would anyone use black and white film in this day and age? beyond that> why would anyone even use film? Digital media is far superior. Aroideana> could be very enjoyable if it wasnt for the black and whit images.>> ------------------------------> *From:* Wilbert Hetterscheid <firstname.lastname@example.com>> *To:* 'Discussion of aroids' <email@example.com>> *Sent:* Wednesday, November 16, 2011 11:29 AM> *Subject:* Re: [Aroid-l] Amorphophallus ID
please. new species?>> This is a new species close to polyanthus. Will be published in next> Aroideana is the plan.>> ------------------------------> *Van:* firstname.lastname@example.com [mailto:> email@example.com] *Namens *E.Vincent Morano> *Verzonden:* woensdag 16 november 2011 3:04> *Aan:* Discussion of aroids> *Onderwerp:* [Aroid-l] Amorphophallus ID please. new species?>> This was found at UBONRATCHATHANI province near Laos Can anyone ID it?>>> _______________________________________________> Aroid-L mailing list> email@example.com> http://www.gizmoworks.com/mailman/listinfo/aroid-l>>>> _______________________________________________> Aroid-L mailing list> firstname.lastname@example.com> http://www.gizmoworks.com/mailman/listinfo/aroid-l>>-- D. Christopher Rogers((,///////////=======<785.864.1714Crustacean Taxonomist and EcologistKansas Biological SurveyKansas University, Higuchi Hall2101 Constant Avenue, Lawrence, KS 66047-3759 USAhttp://www.kbs.ku.edu/http://www.kbs.ku.edu/directory/d-christopher-rogers/Associate Editor, Journal of Crustacean Biologyhttp://www.thecrustaceansociety.org/Vice President, Southwest Association of Freshwater InvertebrateTaxonomists SAFIT.ORG <http://safit.org/>-------------- next part --------------An HTML attachment was scrubbed...URL: http://www.gizmoworks.com/mailman/private/aroid-l/attachments/20111118/98365778/attachment.htm ------------------------------
Aroid-L mailing list


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Welcome to Commuter Choice Challenge!
The 2016 Challenge starts on May 30 and ends September 30.
Friends of Pathways is excited to bring you a Summer Transportation Challenge. Participants have the opportunity to form teams or compete on their own, logging their non-recreational trips via walking, biking, carpooling or riding the START bus. Prizes are awarded throughout the summer as well as end of season Grand Prizes for the most miles logged, most trips, and more!
Here's how it works:
- Take 30 seconds to create your free account using the form on this page. If you want to participate on a team (typically your place of work) create a team together and log miles as a group.
- With your account, you can log the miles for any daily commuting you do, whether it's for work, running errands, or just to socialize.
- As you and other participants log your miles, we'll show you real-time stats: how many trips you've made, miles you've ridden, calories you've burned, gas money you've saved, and CO2 emissions you've eliminated.
- Not only will you be able to see your own stats, but you'll be able to compare and compete with other riders and teams (if that's your thing.)
June 27 – July 1: Most Trips Logged:
Terri Romanowski – Active trips
Savannah Wake and Milessa Ortiz – Alternative trips
July 18 – 22: Most CO2 Reduction:
Rob Watsabaugh – Active trips
Rick Howe – Alternative trips
August 8 – 12: Most Miles Logged:
Matt McGee – Active trips
Kathy Erickson – Alternative trips
September 5 – 9: Most Calories Burned:
Joe Petrick – Active trips
*Note – In order to reward as many people as possible, FOP has decided to not have repeat winners for the mini-challenges.*


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Chapter six-AlexMature
Well the door certainly wasn't budging anytime soon. My ankle throbbed after hours of kicking the metal bars…it was useless. I wanted to sit and think about my options, but I was too restless. I didn't know what time it was. The pack members didn't show their faces and I heard nothing from the girls. I was trapped. Playing into someone else game.
A few hours later the stair door opened as I leant against the metal bars of the cage. The blonde boy came down the stairs smirked at me then looked back up the stairs, the others followed down.
"Alex how are we doing?" The leader well…I was guessing the alpha came over to the cage.
"You're seriously asking me this?"
"Come on Alex lighten up a little." Raquel smiled. Raquel had long autumn hair, deep green eyes and pale skin.
"Who are you and what have you done to me?" I looked round the room, the other three two men and a woman kept to the shadows. There was a noise from upstairs making the alpha glance at one in the shadows he nodded and went off up the stairs.
"My name is Nathan, that's Lucas." The blonde guy nodded. "Other three are Baily, Kate and Slay." The two in the shadows stepped forward. "And this is Raquel."
"And what is it you're planning in doing?" My voice was low and I gripped the bars.
He opened his mouth but a loud crash from upstairs cut him off. "Kate, Slay go and see Baily with them." I blinked and they were gone. "Looks like you won't be alone anymore Alex."


text: I have Win 7 32 bit build 6.1.7100. I have installed all the updates from windows update except for all the language packs. I have all the drivers I could find for Windows 7, including ATI Catalyst for graphics. I could not find most of the drivers for my Mobo,k but everything seems to be working just fine. My guess is that Win7 already has generic drivers for this mobo. XP did not have the drivers. System: Motherboard: Gigabyte GA MA770 - UD3 CPU: AMD Phenom 9600 Agena (Black Edition) 2.3G RAM: 4G GSkill 1066 GPU: ATI Radeon HD4650 1024MB PSU: Demon 580w Black Chrome HDD: WDC WD1600JS-22MHB0 Serial ATA Now, for the problem(s). When I installed Windows 7, I couldn't do it from a my DVD with the ISO burned onto it. So I researched and learned how to do it from my USB drive. Now my DVD optical drive won't read very many cd's or DVD's, although it will read some. The biggest problem is BSOD's. At first, I got a couple while installing drivers, but I restarted, uninstalled the driver that caused the crash, then reinstalled and everything worked fine. After playing around with the features, I wanted to see how it handled games, so I installed COD4. I can play for about 20 mins, but then comes the BSOD. When I restart, I can play for about an hour, but then another BSOD comes. I am not OCing in any way, so that's not a problem. I am posting all the information I can about this problem, so any help will be appreciated. When recovering from a crash, this is the report Windows gives: Problem signature: Problem Event Name: BlueScreen OS Version: 6.1.7188.8.131.52.256.1 Locale ID: 1033 Additional information about the problem: BCCode: 124 BCP1: 00000000 BCP2: 85A7C01C BCP3: F6002000 BCP4: 28000135 OS Version: 6_1_7100 Service Pack: 0_0 Product: 256_1 Files that help describe the problem: C:\Windows\Minidump\062609-16754-01.dmp C:\Users\Mike\AppData\Local\Temp\WER-30872-0.sysdata.xml Read our privacy statement online: Windows 7 Pre-Release (Release Candidate) Privacy Statement Highlights If the online privacy statement is not available, please read our privacy statement offline: C:\Windows\system32\en-US\erofflps.txt I am also attaching the minidump file of the most recent crash. Thank you for any help you might be able to give!


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Mobile App
Asian Educational Institute-Asian School of ...
Total Students
Fees Range
How to reach
Asian Educational Institute-Asian School of Language & Literature is situated at Opp. Tricone City, 10th Milestone, Sirhind Road , Patiala 147001 in Patiala.
Courses Offered
- 3 Years
- Bachelor of Arts-B.A.
- Languages / Arts / Literature
- 2 Years
- Master of Arts-M.A.
- Languages / Arts / Literature
Asian Educational Institute-Asian School of Language & Literature - AEIASLL
It is of great pride for me to know that Asian Educational Institute, Patiala affiliated to Punjabi University, Patiala was set up with the objective of providing quality education in the field of Science, Computer Science, Commerce, Management, Economics, Mathematics, Statistics, Library Science, Languages and Literature to the students of the region in order to develop their overall personality. It is committed to the value based education and has made every possible endeavour to excel in academic and co-curricular activities, which act as a catalyst in the growth of the college enabling it to emerge as an Institution with distinction.As per the requirements of the area, the college is not only catering to the reachable but also providing the knowledge and skills to the unreachable. The college has developed into a centre of high quality education of practical relevance of our rapidly changing society. The dedicated hard work put in by the management and faculty members has earned the Institution a place of pride among the pioneering Institutions of the region.As per the guidelines given by the Punjabi University, the college has also conducted a successful seminar on the theme 'Female Foeticide'. The college earnestly convey my best wishes to the students and faculty for the ensuing session.
Why join Asian Educational Institute-Asian School of Language & Literature
This institution's rich nostalgic past, is a saga of dedication to the cause of education.
2 Type Courses Available
- 1 UG Courses
- 1 PG Courses
Asian Educational Institute-Asian School of Language & Literature Placements
Visiting Companies
Student Placement
This college is like an Oasis in the Desert. The teachers of this college are well reputed in their field and are pious mission to inoculate the air of dynamism among the students who are mostly from weaker section. Large numbers of alumna and alumnus from this college are working in the reputed fields in Government and Corporate sectors.
Try our extensive database of FAQs or submit your own question...
what is the average placement in JLJ Academy Harsh Vvvv Asked this 1 year, 11 months ago - India
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Thank you for visiting my website.
My name is Maeve Allison, and I am a qualified counsellor and EMDR therapist in Beccles (North Suffolk). I qualified as a counsellor in 2005, and as an EMDR therapist in 2012.
It is a big step to think about coming for counselling, and it is natural if you feel anxious or unsure. It's important to find a counsellor who you like and trust.
I am an accredited member of the British Association of Counselling and Psychotherapy (BACP), and I am on the BACP Register of Counsellors and Psychotherapists. I have a current CRB check.
My approach is integrative, which means that I bring together a variety of approaches to suit your unique needs. I specialise in working with the effects of trauma, whether from a single incident in your life or from chronic problems or abuse in childhood. I also offer counselling for:
- anxiety
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I believe that many of our current difficulties are rooted in past experiences, and find that EMDR is a powerful therapeutic technique which stimulates the natural healing abilities of the brain and body to resolve distressing memories of the past and develop a more optimistic outlook for the future. Please see my separate page about EMDR for more information.
Please feel free to find out more about me and my approach or contact me to book an appointment.


text:
Filter Results:
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Learn More
BACKGROUND Declining serum concentrations of 25-hydroxyvitamin D seen in the fall and winter as distance increases from the equator may be a factor in the seasonal increased prevalence of influenza and other viral infections. This study was done to determine if serum 25-hydroxyvitamin D concentrations correlated with the incidence of acute viral respiratory… (More)
- Paul M. Sethi, James R. Sabetta, +5 authors Seth R. Miller
- 2014
which permits the noncommercial use, distribution, and reproduction of the article in any medium, provided the original author and source are credited. You may not alter, transform, or build upon this article without the permission of the Author(s). For reprints and permission queries, please visit SAGE's Web site at Objectives: Accurate detection and… (More)
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|All Mountain
|Flex Index:
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|Buckle Layout:
|4 Buckle
|Buckle Material:
|Last Width:
|Walk Mode:
|Manufacturer Warranty:
|2 Year
The Atomic Hawx 110 has a slightly more forgiving flex than the 120 or 130, but it's still right up there in terms of all-mountain performance – the ideal custom ski boot for sporty resort skiers. The legendary Hawx medium fit comes with Memory Fit, so you can get a completely personalized shell, cuff and liner in minutes. With Power Shift you can adjust your forward lean and crank your flex index to 120 to fully suit you. Atomic''s revolutionary Sole Flex on the sole of the boot enhances your balance, underfoot feel and control. The light Gold liner features 3M™ Thinsulate™ Platinum Insulation to keep your feet warm and responsive in even the coldest, dampest conditions. Finished with a lighter build and optional WTR Grip Pads for easier walking, this ski boot is about skiing hard, but still in comfort.
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Tabitha Hale Model
Adam Rich PhotographyPhotographer Male Destin, Florida, US
My Website: Adam Rich PhotographyMy MM URL: http://www.modelmayhem.com/pineapplephotography
Mayhem # 1186447
About Me
I am currently only working with models who would like to do artistic nude, boudoir, erotic, or fetish sessions. I believe that the natural body is amazing, and will only work with models who think similarly. I have a portfolio of such work available for interested models, but I will not put them up here where I (and the subjects) lose control of the images. Discretion with your identity and photos is guaranteed.
I'm flexible with my shoots, as I encourage input and ideas from the model(s). My primary concern is the comfort and enthusiasm of the model, as I work to capture as closely as possible the personality and mood of the model.
I'm here strictly to meet with fellow artists and create beautiful images. This is not a dating site, and TF isn't the same as "free". Hopefully, everyone involved is getting something of value for their time. My TF work has an equal priority with my paid work.
I am very generous with what the model gets, image-wise. Even "unusable" shots are useful as learning tools.
My shoots are very interactive. I like to explain WHY I'm asking you to move a hand, a leg, whatever. I also like to keep it fun, while always being professional and respectful. Time is valuable, I won't waste yours or mine!
Also, please don't "friend" me unless you're in my area and would like to work together. I don't play the "Comment/list me and I'll comment/list you" game.
Feel free to contact any of my models for a reference. Also, if you'd like to work with one of my models that does not have a MM profile, let me know and I'll give her your contact information!
*** Note: You are always more than welcome to bring an unobtrustive friend/escort along. ***
Have you worked with Adam Rich Photography? Add Credits for Adam Rich Photography! >>
Miss Brit Brat
Worked together 1 times; Most recent: March 2016
Credit Notes
Credits are my endorsement of artists I've worked with. If they're here on this list, then I admire their work, attitude, and professionalism!
Jazzy C. #1168597
Irina Sarikova #1113319
Kat Powers #809989
Michelle G. #1764628
Madison Cee #1284043
Raychel Martinez #2590195
Britni Bombshell #2189285
Heather Elizabeth A. #2286807
Missy #2752875
SweetSam #2728486
Lindsey Michelle #2746181
Cait Lynn #842829
Deanna Beckham #2948283
Black Byrd #1740038
Dara D'Amato #2251755
Aria Rayne #3019853
Katherine Tate #2445439
Hayley Christina #2213695
Brianna Marie #2957345
Alyssa Dear #2960597
JessicaJoLake #3146549
Emma-Leigh Teagan #2101932
Brittnie Jade #3321804
Ashlee #831456
Vida #3568551
Ms Brit Brat #3102704
Trishabear #3728583
Tabitha Hale Model
Alyssa Grasso Model
Amanda Lynn Clark Model
Lolli Dolli Model
JazzyC Model
Mer Soleil Photography Photographer
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What Does the Undereducation of Overexercising Really Mean?
In our society, we are bombarded with messages about exercising and eating.
These messages come through many different outlets including television, radio,
magazines, and even through government sponsored campaigns. According to Let's
Move.gov, Michelle Obama recently launched a campaign called "Let's Move" to raise awareness of the importance of exercise and encourage children to exercise for an hour per day and adults to exercise for thirty minutes per day.


text:
Friendship SMS – Good friends…
Good friends are like quilts…
it never loses its warmth…
Similar SMS
Friendship SMS – True friends are…
True friends are rare to find.
True friends are always very kind.
True friends are ornaments so beautiful.
True friends always make us cheerful.
True friends are the work of perfection.
True friends give us right direction.
True friends always shine like moon.
True friends are the greatest boon.
Friendship SMS – Good FRIENDS CARE…
Good FRIENDS CARE for each Other..
CLOSE Friends UNDERSTAND each Other.
& TRUE Friends STAY forever
beyond words
beyond time…
Friendship SMS – friends may be…
friends may be old friends may be new.
real friends are very few.
so when ever you are rember one thing
that some one may be thing oo you…..
Friendship SMS – Choose your friends…
Choose your friends by their character and your socks by their color,
choosing your socks by their character makes no sense, and
choosing your friends by their color is unthinkable.
Friendship SMS – If friends were flowers…
If friends were flowers I would not pick you!
I'll let you grow in the garden &
cultivate you with love &
care so I can keep you as a friend forever!!
Friendship SMS – Best friends we are…
Best friends we are
Best friends we'll be
For always forever
You and Me
_/ /_ ._/ /_
Friendship SMS – True friends will not…
True friends will not have any reason for their friendship.
So it can never be broken when they don't find that reason.
Friendship SMS – Are we friends…
Are we friends or
Are we not?..
You told me once,
but i forgot..
so tell me 'now'
and tell me 'true'..
so i can say,
i am here for you..
of all the friends,
i have ever met
"u' are the one i
will never forget..
and if i die
before u do..
i will go to heaven
and wait for u..
Friendship SMS – Friends are like…
Friends are like mornings,
u may share with them
only a few hours of d day.
But u know that they will
always b there tomorrow,
the next day and the day after,
Friendship Quote: Friends are those…
"Friends are those rare people who ask how we are
and then wait to hear the answer."
-Ed Cunningham


text:
Three Pressures in Porous Media
- Cite this article as:
- Bennethum, L.S. & Weinstein, T. Transport in Porous Media (2004) 54: 1. doi:10.1023/A:1025701922798
- Citations
- 179 Downloads
In a thermodynamic setting for a single phase (usually fluid), the thermodynamically defined pressure, involving the change in energy with respect to volume, is often assumed to be equal to the physically measurable pressure, related to the trace of the stress tensor. This assumption holds under certain conditions such as a small rate of deformation tensor for a fluid. For a two-phase porous medium, an additional thermodynamic pressure has been previously defined for each phase, relating the change in energy with respect to volume fraction. Within the framework of Hybrid Mixture Theory and hence the Coleman and Noll technique of exploiting the entropy inequality, we show how these three macroscopic pressures (the two thermodynamically defined pressures and the pressure relating to the trace of the stress tensor) are related and discuss the physical interpretation of each of them. In the process, we show how one can convert directly between different combinations of independent variables without re-exploiting the entropy inequality. The physical interpretation of these three pressures is investigated by examining four media: a single solid phase, a porous solid saturated with a fluid which has negligible physico-chemical interaction with the solid phase, a swelling porous medium with a non-interacting solid phase, such as well-layered clay, and a swelling porous medium with an interacting solid phase such as swelling polymers.


text:
Please Login with your Account to access information about current events and your email. Faculty information for each department can be found at the program website.
- Annual Faculty Seminar 2016 will be held on Friday, December 2, 2016
- Compulsory Session (Seminar)
Time : 09:00 a.m. - 03:00 p.m.
Place : John XXIII Conference Center, Assumption University, Suvarnabhumi Campus
Dress Code : Smart Casual
- Optional Session (Trip)
Time : 06:00 p.m. - 08:30 p.m.
Place : The Grand Chaophraya Cruise, River City pier, Siphraya (Charoenkrung Soi 30)
Transportation Service : Coaches depart from Suvarnabhumi campus, Assumption University at 03:30 p.m. (Please be punctual)
- Compulsory Session (Seminar)


text:
Welcome to WebmasterWorld Guest from 220.127.116.11
Forum Moderators: not2easy
I don't see any space between the dash and "moz".Zoom the text very large - it's -[space]moz. Better, run the code through the validator which should catch it.
I tried putting z-index values to the elements, but that doewn't work eitherYes, not a case of z-indexing them all - just the ones that need to be manipulated. There's lots of technical detail behind positioning and stacking issues, but in summary, nested absolutes are not as simple as a first reading of the recommendations suggests. Especially when there are siblings involved because containing box and stacking context are different, which means borders/background and text are not painted as you might expect.
I think I should start trying out another wayIf so, consider using a list.


text:
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