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|Rajon Rondo messes with reporters, admits time away from Celtics 'was difficult'
|12.04.12 at 3:58 pm ET
WALTHAM — Rajon Rondo said he really got away during his league-imposed two-game suspension for his role in the brawl last Wednesday with the Nets.
"I went to Mexico for a couple of days and watched the games," said Rondo, who was immediately asked if he was being serious. "It was cool."
Rondo, who practiced with the team on Monday and Tuesday, said he just wanted to give his body a chance to rest. Team officials had no knowledge of Rondo traveling outside the country, leading to the conclusion that Rondo was simply joking with reporters.
"Why not? Had days off, allow my body to get a chance to rest," Rondo said, insisting again that he went south of the border. "I wanted to be out there with my teammates but obviously a two-game suspension, and I was glued in front of the TV.
"Hopefully, I don't feel too winded [Wedensday]. I've been off for about a week. We'll see [Wednesday]."
The Celtics return to action on Wednesday night at 7:30, when they host Kevin Love and the Timberwolves at TD Garden. The Celtics went 1-1 without Rondo, beating Portland Friday easily before blowing a 17-point lead Saturday and losing in Milwaukee.
"We moved the ball very well without me," Rondo said. "Guys played great, guys stepped up. Courtney [Lee] played well. We got off to a great start in Milwaukee but our defense slipped in terms of our blitz pick-and-roll defense. Other than that, the guys did a great job."
Rondo said there was no lesson learned from the suspension. Read the rest of this entry »
|Irish Coffee: Why Atlantic Division matters to Celtics
|at 1:36 pm ET
The Celtics (9-8) are almost a quarter of a way through their season and rank fourth in the Atlantic Division.
The Knicks (12-4), Nets (11-5) and 76ers (10-7) all own better records. During the first four of their five consecutive Atlantic crowns, the Celtics owned no worse than a five-game lead through 20 games and seemingly had the division wrapped up by Christmas. Last year, the C's started 10-10, fell behind by four games and spent the season chasing the Sixers for a fifth straight title. And that was without either of the New York teams involved.
"When you look from top to bottom, it's a well-balanced division," said Paul Pierce. "So, each and every game is important. At the end of the day, our goal isn't to try to win the division; our goal is to win the championship. As far as the division is concerned, it's about as competitive as it's ever been since I've been a Boston Celtic."
Declaring they'd rather win an NBA title than the Atlantic Division sounds nice and all, but announcing their aim "isn't to try to win the division" is a mistake, since doing so gives them a better chance to reach that larger goal.
The Celtics need look no further than May as a prime example. If they hadn't caught the 76ers, a) the C's face the Bulls as the No. 7 seed on the road and likely lose in the first round if Derrick Rose doesn't tear his ACL; and/or b) they play Game 7 of the Eastern Conference semifinals in Philadelphia, where they lost 2-of-3 playoff games.
Can the Celtics win a sixth straight Atlantic Division crown and set themselves up for another date with the Heat in the conference finals? Of course, but it's going to be a lot tougher to chase down three teams rather than one.
|Paul Pierce: 'When we set the tone defensively, that's the Celtics I know'
|12.01.12 at 5:19 pm ET
Paul Pierce knows what the bread and butter is of a successful Celtics team.
It's great defense that will lead the way out of the dark and uncertain times the team is experiencing right now.
When the team plays defense like it did Friday night, holding Portland to 23 percent shooting in the first half, easy offense will follow, and so will rhythm. That was particularly important with Rajon Rondo not available this weekend.
'It made things easier on our offense to come out and play the way we did and cause turnovers," Pierce said of the Celtics D, which forced 22 turnovers on Friday. "Then we were able to get out in transition. Guys ran'¦got easy opportunities. When we come out and set the tone defensively like we did tonight, that's the kind of team that we are and that's the Celtics I know.'
Before Friday's game, Doc Rivers said the combination of Courtney Lee and Jason Terry would have to pick up the ball-handling slack in the backcourt. But as it turned out, the offense wound up running through the bigs starting with Pierce – a style the Celtics have employed in the past when they haven't had Rondo available.
'It's a combination of guys, so Doc wanted us to be aggressive," Pierce said. "He wanted us to move the ball and make the extra passes and I thought we did a good job of that most of the night. We could've toned down our turnovers, but I think we will be better tomorrow. It's tough, we're used to playing with Rondo and he makes a lot of our plays. We'll get better and better.'
'Courtney he really ran the floor well. Defensively he did a good job on his man, He's out there getting 4 or 5 assists tonight, he just shows you flashes of what he's capable of. Jeff [Green] is running the break, getting easy opportunities for himself. He's one of the fastest guys out there'¦when he's able to use that length.'
As for the motivation of Rivers calling the Celtics "soft" after Wednesday's loss, Pierce just shrugged his shoulders and generally discounted it.
"You know, I'm always a true believer that you just just be motivated to go out and play, regardless," Pierce said. "As an NBA competitor, you shouldn't need anybody else to go out and motivate you. Maybe some guys took it as motivation. I'm motivated for the opportunity to come out here night in and night out. Whatever is going to get guys going, hopefully they can build on on that, if that what it was, and continue to do it throughout the season."
|Kris Joseph sees Red Claws as Celtics opportunity
|at 11:00 am ET
For a guy who's played eight minutes in his career, Kris Joseph feels pretty comfortable in an NBA locker room.
Over a crowd of reporters, the second-round pick jokes to Courtney Lee about the wall of questions his veteran Celtics teammate faces after a good night. On his way out, Joseph tells a locker room attendant, "If you want to get me any early Christmas present, stock the fridge with a case of apple juice. I love apple juice."
In between, Joseph sits alone at his locker, the media walking past him to catch Jeff Green, the other hero in Friday night's 96-78 blowout of the Blazers. Still, he's pleased. After all, he just scored his first NBA points — a pair of fourth-quarter free throws in five garbage minutes — on the same day he was recalled from the Red Claws.
'It felt good," he said. "It was a great game overall. We played hard. We defended well. In turn, we were able to get a large lead and give me the opportunity to get in there in the fourth quarter. It was just a good overall feeling, finally getting in the books — two free throws — guys encouraging me, cheering me on, so it was a great feeling.'
In two games for the C's NBA Development League affiliate, Joseph averaged 25.5 points, 7.5 rebounds, 3.5 assists, 2.0 steals and 1.9 blocks in 39.0 minutes. Not bad for a couple weeks work.
"The experience in Maine was great," said Joseph. "It gave me a chance to play, just feel out the NBA-style game, spacing on the court, all types of things. It gave me the opportunity to just be aggressive and play my type of basketball — the type of basketball I've been wanting to play for a long time, so I think it was very useful."
Celtics head coach Doc Rivers said his team showed signs of getting back on the right track in a 96-78 win over the Trail Blazers Friday night at TD Garden. Rivers called his team soft after Wednesday night's loss to the Brooklyn Nets. Rivers said his team is showing signs of doing what it takes to turn things around.
'It was good," Rivers said. "Obviously it's one game and it was great. Our defense was fantastic. We did a couple things different, trapping, it was great. And then the ball movement was terrific as well in the first half. I thought, second half was, you know how that goes with the score, but overall I just like our focus and how we approached the game.'
And the answer for no Rajon Rondo?
'We just basically played through the bigs," Rivers said. "We took all the pressure off the guards; all they had to do is bring it up and then throw it to Kevin (Garnett) at the elbow or Jared (Sullinger) at the elbow and then cut and move. That way there's no dribbling; it was easier for them that way. And that's what I meant before the game when I said I told everybody he's going to be the point guard. Basically what I was saying: our bigs were the point guards today.'
Having Jeff Green lead the team with 19 points off the bench didn't hurt either.
'We've just got to keep doing it," Rivers said. "One game, it was great. What we're trying to get him to see is when he's at the three he's a power player; when he's at the four he's a speed player. And that's how he has to look at himself. And our guys did a good job of getting him the ball as well.'
There was no need to call his team soft after Friday night's game.
'Well, I didn't do anything," Rivers said. "I mean, we went pretty hard yesterday for short and we actually went hard today for the shoot-around. Because we've got to get our culture right in that way. And we've got a long way to go, but we're getting better. You can see it, for sure.'
As for the defense, Rivers said they mixed things up slightly.
'We trapped pick-and-rolls, which we don't do much anymore," he said. "We're bringing it back, because I think it's coming back. So we did that and our guys stayed with it. Usually we show and get out. We just decided, you know, (Damian) Lillard is terrific but he's a rookie and young, and probably hadn't seen a lot of traps that stayed with the ball. And basically that's what we did.'
Jeff Green might have scored 19 points and Jason Terry might have had 17 in 31 minutes but it was Courtney Lee who was the key player in Boston's 96-78 win over the Trail Blazers Friday night at TD Garden, as the Celtics played the first of two straight games without the suspended Rajon Rondo.
Lee said the team responded well to Doc Rivers calling them soft after a loss to the Brooklyn Nets Wednesday night at home.
"He can continue to call us soft," Lee said afterward. "If we're going to respond like this and play, I guess we need to be told that for us to wake up."
What really hit home with Lee was when Rivers rolled the film of Wednesday's game, showing the team how many easy baskets they were giving up.
"We got called soft the other day and we didn't like that," Lee said. "When you watch the tape, you see those guys [Nets] coming down, running their offense, setting hard screens, getting layups and dunks and wide open shots. We took that personally."
No shock that the turnaround began on the defensive end, where the Celtics held the Blazers to 23 percent shooting in the first half.
'Yeah, definitely after that loss last game, we wanted to come out and just focus on the defensive end make sure we got stops," Lee said. "Make sure we didn't give up any easy buckets and so I think we started off and threw the first punch.'
Rivers gave Lee credit for stepping up and showing his play-making ability in the absence of Rondo.
'Courtney was great," Rivers said. "You could see Courtney is getting better and better at what we're asking him to do. He's bought in completely, which you can see that. His shots will fall. I feel like him, with Avery (Avery Bradley) last year, where I kept telling you guys 'Avery can shoot' and you guys were looking at me like I was a Martian. And then he started making them. And Courtney is proving he can. He's getting wide open ones, and eventually they'll fall.'
"I mean that's what you gotta do," Lee said of his ball-handling skills. "Rondo is a great playmaker, the guy's gonna rack up a lot of assists, so we just have to play within the offense, move the ball around, and you see the assists were spread out throughout the whole team. Without him we had to move the ball a lot more.
'I mean it shows good character for our team. We got beat bad on our own court then we went to practice, had a real tough practice. Doc was on us the whole time so we wanted to come in and protect home court, because we cant keep letting teams come in and beat us on our home court. We wanted to bounce back and we did that today.'
|Kevin Garnett doesn't like to be called soft
|11.30.12 at 11:11 pm ET
After Wednesday's Rajon Rondo–Kris Humphries fiasco and the ensuing 95-83 loss to the Nets on their homecourt, Celtics coach Doc Rivers called his team soft.
'If I'm Brooklyn and the league, you've got to think we're pretty soft the way we're playing,' Rivers said in Wednesday's aftermath. 'We're a soft team right now; we have no toughness.'
Apparently, Kevin Garnett doesn't like to be called soft. Who knew?
'I don't know any man who likes to be called soft; maybe some women," he said after dropping a 10-5-4 in 23 efficient minutes of Friday's 96-78 blowout of the Blazers. "Where I'm from, not most men like that. I think collectively he's talking about our style. '¦ I don't think he's coming at us as men, but he's definitely talking about our style as a whole. Collectively, we all have to do that together; the onus falls on each and every last one of us, not just one or two guys. But, yeah, that was disturbing. Who likes to be called soft in anything, if you're a man?'
Count Courtney Lee among those men KG knows who don't like being called soft. He amassed 10 points, 7 rebounds, five assists and three steals in 37 minutes, starting in place of the suspended Rondo.
"He can continue to call us soft," said Lee following what might have been his best game of the season. "If we're going to respond like this and play, I guess we need to be told that for us to wake up. … We got called soft the other day, and we didn't like that. When you watch the tape, you see those guys [Nets] coming down, running their offense, setting hard screens, getting layups and dunks and wide open shots. We took that personally."
Rivers got the results he was looking for on Friday, but he hopes he lingers beyond just the one game.
"Well, I didn't do anything," the coach said postgame. "I mean, we went pretty hard [Thursday in practice] for short, and we actually went hard [Friday] for the shootaround, because we've got to get our culture right in that way. And we've got a long way to go, but we're getting better. You can see it, for sure."
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Seahawks Dominate Super Bowl XLVIII [PHOTOS]
Super Bowl 48 is in the books, and the Seattle Seahawks are the new champions of the NFL.
FOX News Radio's Jeff Monosso was at the game and has this wrap up:
Audio clip:
I don't even think Vegas predicted the game could have gone down like this– with the Seattle Seahawks and the 'legion of boom' — the number one defense, crushing Peyton Manning and the Broncos number one offense, 43 to 8.
Sherman: "It took the linebackers doing a great job droppin', it took the d-line doing a great job gettin' the rush. And it took us in the back end, holding up all day."
Seattle Cornerback Richard Sherman on FOX Sports.
While in the stands:
Fans: (cheering) "I can't believe this is happening."
Seattle fans waited decades and now have their very first Lombardi Trophy in franchise history.
In New York, Jeff Monosso, FOX News Radio.
Below is a photo gallery from Super Bowl XLVIII. Photos submitted by FNR's Jeff Monosso:


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Central Middlesex may be the hospital of the future, but it also has a surprisingly star-studded past. It was the hothouse that developed the talents of some of the NHS's most influential doctors and managers.
Health minister Lord Darzi got early career advancement when he was made a consultant at CMH in 1993 and contributed to the first stages of its radical reforms. With him now at the NHS top table are Mark Britnell, director general for commissioning, who was CMH's executive director from 1992 to 1995, and Sally Davies, a CMH consultant who became the Department of Health's director general of research.
The catalogue of its famous and influential alumni is of long standing: Sir Richard Doll established a statistical link between smoking and lung cancer while based at CMH in 1950.
So why does a small hospital in an unfashionable part of London attract so many winners? Doctors like working there because patients in the poor, ethnically diverse catchment area often present with "interesting" diseases.
But Vincent Mak, the hospital's director of emergency services, has another answer. He says: "The reason we have been successful at developing new things is that we have always been under threat. People had to be at the cutting edge to prove the worth of the hospital and keep it alive. Necessity was the mother of invention."


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[caption id="attachment_51987" align="aligncenter" width="640" caption="Photo: Loren Wohl for MTV Hive"][/caption]
Following Atoms for Peace surprise unveiling of their new single "Default" last Thursday, Thom Yorke and Nigel Godrich hosted the final PS1 Warm Up of the summer in Long Island City, Queens this past weekend. And for those lucky to attend, there were even more surprises, as they performed a few more new Atoms' cuts. Hive photographer Loren Wohl was on hand to document the scene, which included opener Rustie, a gaggle of good-looking people and of course, Thom and Nigel. Also flip through for shots of Thom and Nigel's playlist. Good to see that Yorke is digging the new Diplo album, too.


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Is the Nintendo Switch good for all the family? Parental controls, motion gaming and more explored
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Character Options might have stolen the London Toy Fair, at least where adults are concerned. It demonstrated a wearable wristband that prompts special effect noise and/or music as you move.The bands, which cost £49.99 for a pair and will be available... >>
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There was a video posted on the Blogotheque website recently, one of their Concerts a Emporter, in which musicians perform impromptu shows in unusual places. This time it was the Tallest Man on Earth, muddling around a vintage guitar shop in New York. He sings one of his own songs first, and then a cover of These Days, his voice rising up among the guitar bodies and the banjos and the cowbells. "I've been out walking," he draws his voice back and seems to catapult the line: "I don't do too much talking these days ..."
Jackson Browne wrote this song when he was 16. In those days, he called it I've Been Out Walking, but by the time it had been recorded and released by Nico in 1967, it had been retitled. There would be more covers over the years, by the Nitty Gritty Dirt Band and Tom Rush, Gator Creek and Iain Matthews, and then, in 1973, Greg Allman recorded the song for his first solo record. That is the one many view as the definitive version.
"It became musically a whole lot deeper thing when Greg Allman sung it," Browne told Paul Zollo in 1996. "He slowed it down, and I sort of copped his phrasing - the way I sing it now." Browne's own version was first released in the same year as Allman's, on his second album, For Everyman.
A few months back I became mildly infatuated with another version of this song, posted on YouTube last July by a woman named Sailor Sylvia, along with an explanation which seemed to sum up all the regret and loss contained within These Days: "Just sittin around with some vermouth and remembering the old days of when i was young and in love, we don't talk anymore ... not by choice, i just havent heard from you, babe, i feel so much like giving up."
Reading the comments on her post, full of lols and snide remarks, and several viewers questioning the wisdom of putting anything on the internet when you have a belly full of vermouth, the song's final line seemed to rise up all the louder: "Please don't confront me with my failures/ I have not forgotten them."
That line has always struck me as remarkable; words so dark and cold and embedded, the entire song seems to be rooted in them. In Allman's casting of the song, that line was redrawn slightly: "Please don't confront me with my failures/ I'm aware of them." I can't entirely approve of this; there is something in the not-forgetting that seems to ache a little more. In Browne's version, there is an air of the chided teenager about the line, a sense of burden and guilt, a weariness and disappointment at the world into which he is growing.
I like Nico's delivery of the line best. She brings something resigned to Browne's words, makes it a song sung later in life, as if looking back at how the years have shaped her. That haughty voice pushing against the brittle sweetness of the guitar, strings, flute - her version is full of the lonely resolve of a life-long dreamer, a late-night sweet vermouth-drinker, the sound of a woman who finally knows herself.
In that same interview with Zollo, Browne compared the art of songwriting to the craft of building guitars. I smiled at the comparison as I thought of the Tallest Man in that New York guitar shop, delivering his own beautiful version of These Days. "The metaphor is beautiful," Browne explained, "because a song is like an instrument in that it can be played by somebody else, and it can lay around for years and somebody can pick it up and play it again."


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Listen to the complete interview with Vikram Vij:
On Vision
"Entrepreneurial spirit should be like a river. It should always be flowing in different directions. You have obstacles in your path, but your final goal should be that 'I need to reach the ocean'."
Vikram Vij is the successful owner of a small food empire that all started in Vancouver 20 years ago. He joined Mike Eckford in the studio to talk about entrepreneurialism and his own journey to success.
He says his plan was to be a Bollywood actor, but when that failed he decided the next best thing was to be a chef, "because at 5:30 when the curtains are drawn, we are there performing".
Vij says at the time he never thought he'd be here today talking about his many projects, but 20 years ago he did have the VISION to bring awareness to the cuisine and the culture of his country.
On Entrepreneurship
He believes that entrepreneurial spirit lives in all of us, whether it be to build a big business or a small one.
"We all have that spirit that (says) "I want to dance to my own tune, to my own music"
When he started his first restaurant in Vancouver 20 years ago, Vij says it had 16 seats and a break even of $100. If he sold $100 a day he was going to survive. Some nights he only sold $96 dollars.
On Buiding a Business: It's Not a Straight Line
"It is a crooked line…one step at time, remaining focused, not selling out your soul. And on top of that, helping out other people who are around you."
On Putting People to Work:
"It is THE most crucial things to do, because they are , at the end of the day, your backbone. They are the ones who are going to be carrying your name, carrying your flag, and saying, 'We work for this organization'."
Vij says business owners must take care of the people they work with, and that equality is important. His staff can eat whatever they want at the end of the day, and have a glass of wine too. When talking about the various front of house roles, he says it's important not to have a hierarchy.
"Have it in your mind, but do not show it…I still welcome people into the restaurant by opening the doors for them. I still bring out appetizers for them. And I still clear plates and take orders."
Vij will be at Local Leaders, a monthly mixer hosted by Small Business BC, on April 2nd.


text:
|Publication number
|Publication type
|Publication date
|Sep 21, 1971
|Filing date
|Dec 26, 1967
|Priority date
|Dec 26, 1967
|Also published as
|Publication number
|Robert J Ryan
|Original Assignee
|Rca Corp
|Export Citation
|BiBTeX, EndNote, RefMan
|Referenced by (49), Classifications (28)
|External Links: USPTO, USPTO Assignment, Espacenet
' Sept. 21, 1971 Y N 3,606,677
MULTILAYER CIRCUIT BOARD TECHNIQUES C1012 10 I 10 )2, a @%m 4 14 1 44%s I 1p 18 1 18 10 I 6 Attorney Sept. 21, 1971 R. J. RYAN HUL'I'ILAYER CIRCUIT BOARD TECHNIQUES Filed Dec. 26. 1967 3 Sheets-Sheet 8 INVENTOR RaarJAm/v 14w! 5 9177;;
ATTORUEY United States Patent 01 3,606,677 Patented Sept. 21, 1971 lice 3,606,677 MULTILAYER CIRCUIT BOARD TECHNIQUES Robert J. Ryan, Trenton, N..I., assignor to RCA Corporation Filed Dec. 26, 1967, Ser. No. 693,672 Int. Cl. B41m 3/08 US. Cl. 29-625 7 Claims ABSTRACT OF THE DISCLOSURE BACKGROUND OF THE INVENTION 'The use of printed circuitry in the electronics industry dates back approximately twenty years. Over that period of time technical refinements have progressed to the point where the phrase printed circuits is now a household term familiar to the consumer. Furthermore, the advent of microelectronics during the past ten years has caused circuit technology to change drastically. To gain the advantage of integrated circuit technology, modern packaging concepts require that multilayer interconnection circuits be provided having fine line conductor patterns and controlled impedance circuits with close tolerances. Computer technology, for example, often demands tightly controlled printed circuit interconnections having multiple ground, voltage, and circuit planes containing 10:2 mil conductor lines separated by as little as five mils. Circuit to ground impedances often must be controlled to within tolerances of :6 percent. Future needs will demand even finer-line circuit patterns, greater reliability, and higher packaging densities. It may become necessary to interconnect several circuit elements which are made of different materials, mounted flush in a circuit board. Integration of laminated ferrite memories with drivers and sense amplifiers is one example of such a structure.
SUMMARY OF THE INVENTION This invention relates to a novel method of fabricating a multilayer composite which may be used for interconnecting systems requiring high density packaging such as computer systems which incorporate integrated circuits.
Basically, the method comprises the lamination of two or more circuit boards using a controlled fiow adhesive layer; the controlled-flow adhesive permitting through holes to remain open after lamination. Final interconnection is made by plating through the holes, thereby providing the requisite interconnections between surfaces.
Accordingly, it is an object of the present invention to provide a method of fabricating a multilayer circuit board wherein any dielectric material, or a combination thereof, can be used as circuit substrates.
An additional object is to provide such a method wherein circuit boards of different dielectric materials and thickness can be used to control electrical properties as in the case of strip line applications for computer circuits.
A further object is to provide a method of making a multilayer circuit board which utilizes single and/ or double sided circuit boards formed by either an additive or a subtractive process.
Another object of the present invention is to provide a multilayer circuit fabrication technique which can be accomplished with conventional processing equipment.
BRIEF DESCRIPTION OF THE DRAWING The foregoing objects, along with additional objects and applications, will become more readily apparent to those skilled in the art upon reading the specification which follows in conjunction with the accompanying FIGS. 1 through 4 which are representative of process steps associated with the present invention and include corresponding cross sectional views of the circuit substrates at the respective steps in accordance with preferred embodiments thereof.
DESCRIPTION OF PREFERRED EMBODIMENTS Two methods generally available for the fabrication of printed circuit boards are the subtractive-etch method and the additive-buildup method.
The majority of printed circuits produced for commercial use today are fabricated using the subtractive-etch method. This method generally comprises laying down a pattern on a resist coated copper clad board, utilizing either positive or negative artwork, and delineating the desired circuit pattern by etching away the surrounding copper.
Additive methods, wherein the coppr circuitry is added to a base substrate, have been less commonly used in the past. With the advent of double sided boards incorporating plated through holes however, the additive methods offer substantial advantages. As in the case of the subtractive-etch method, the additive method may be carried out utilizing positive or negative printing techniques. Accordingly, although the present invention should not be construed as being so limited, the preferred embodiments will be described in relation with an additive buildup method utilizing negative printing techniques.
Of the various additive methods available for building up conducting layers on nonconducting substrates, chemical and electro-chemical deposition offer the most versatile approach.
Chemical deposition is accomplished by controlled autocatalytic reduction of a metal ion from solution, and is commonly referred to as electroless deposition. Methods are well established for the electroless deposition of copper and nickel, and several systems are available with proven performance on the metallization of nonconductors. Electro-deposition of metals is also well proven in industry.
The electroless method consists of treating a dielectric substrate with a catalytic metal to render the substrate receptive to subsequent chemical reduction of a desired metal ion, thus effecting plating. In addition to copper and nickel, other metals such as gold and silver have proven readily adaptable to electroless deposition techniques. Palladium solutions are most commonly used as the activating metal. Typically, palladium salt solutions are reduced at active sites on the substrate by tin chloride. The palladium then acts as a catalytic surface for subsequent deposition of the metal; for example copper. The plating solutions normally consist of a metal salt, a complexing agent, and a reducing agent. Stability of the solution is controlled by the low concentration of free metal ions in equilibrium with the complex. Once reduction of the metal has occurred on the active palladium sites, the process becomes autocatalytic and the deposition proceeds across the surface of the substrate.
One advantage of the additive method is the availability of a variety of substrate materials which can be used. Plastics evaluated for electroless copper metallizing and additive buildup circuitry include polysulfane, polycarbonates, polyacetals, polyurethanes, acrylics, polyesters, fluorocarbons, phenolics, and epoxies. Other materials evaluated, in addition to plastics, include alumina and beryllia ceramics as well as glass and plastic coated metals. Generally, most untreated dielectric substrates produce a uniform, though weakly bonded, copper layer. Adhesion may be greatly improved by various surface treatments such as chemical etching, physical abrasion, or the addition of an adhesive primer film.
FIG. 1 traces a process for fabricating a double sided circuit board having plated through holes, utilizing an additive-buildup, negative pattern technique.
The dielectric substrate 10, shown therein, is punched, drilled or etched in accordance with the desired location of the plated through holes; punching being preferred over drilling, particularly for small holes, due to greater simplicity, better definition, and lower cost. The exposed surfaces of the substrate are then prepared by a cleaning step and a chemical or physical treatment to promote the adhesion of the circuitry. Typically, the treatment may involve acid etching of the surface, or vapor blasting to abrade the surface. This is followed by degreasing and cleaning. Other chemical promoters such as titanium esters and siloxanes are also useful. The substrate 10 is then sensitized for electroless deposition by coating the exposed surfaces with a catalytic material 12. Typical of the compounds which may be used are the salts of tin, titanium, silver, gold, platinum and palladium. A PdCl SnCl sensitizer has proven particularly effective. This treatment deposits a fine layer of metallic palladium 12 on the surface of the substrate 10 which acts as a nucleus for metal deposition during the subsequent electroless step. In some instances it may be possible to purchase the dielectric substrate already impregnated with a catalytic material, thereby eliminating the cleaning and sensitizing steps. Thereafter, all exposed surfaces of the substrate 10 are subjected to an electroless bath for a period of time suflicient to permit the formation of a conductive foundation 14 thereupon which will be receptive to subsequent electroplating; e.g., an initial layer of copper, approximately ten microinches in thickness, can be deposited in approximately ten minutes utilizing standard electroless baths. For some circuits, particularly where high currents are involved, a thin electroplated layer of .00005" to .0001" in thickness may be deposited over the electroless layer using a conventional plating bath. A negative mask pattern 16 of the desired circuitry is then printed on either side of the thinly plated substrate 10 using conventional printing methods. Any printing technique can be used including silk screening and hand blocking. However, since the additive process does not require the use of strong etch solutions for long periods of time, and permits the direct use of thin ink printing techniques, a dry or wet offset process has been found preferable for printing on flat substrates. Offset techniques permit high product output, excellent definition and resolution, and the utilization of standard printing equipment. The inks used for the negative circuit mask pattern 16 can be almost any conventional printing ink or other like material which completely covers the surface within the masked areas, is resistant to the plating solution, and is electrically insulating; commercially available acid resist offset inks have been found to produce excellent results. It is necessary to cover the thinly plated surface to isolate it from the electroplating solution to prevent buildup of the circuit where such buildup is not desired, during the electroplating step. Thereafter, the circuitry 18 is built up to the desired conductor thickness utilizing almost any electroplating technique available, the choice being determined by the substrate, the desired metal, and the circuit requirements. The negative masking pattern 16 is then removed by washing and rinsing in a suitable solvent. After removal of the masking pattern, any of the thin initial conductive layer 14 which is still exposed is removed by a flash etch.
Alternatively, if it be desirable to entirely eliminate any etching step, the initial electroless deposition 14 can be performed subsequent to the application of the negative mask pattern. In such case it is important that the ink be chosen so as not to be receptive to the deposition of metal by the subsequent plating steps.
In either event it should be noted that the desired circuitry is deposited on portions of the substrate which have not previously been obscured by either photoresist solutions or inks. This provides an added benefit in that it insures against circuit contamination which may occur in the event pre-existing layers of said materials are not completely removed prior to circuit deposition.
As previously discussed, multilayer circuitry has attained significant importance in the printed circuit field today primarily due to the major effort of the electronics industry in integrated circuit development. There are a variety of methods presently in use for fabricating multilayer circuit boards. Basically, these methods can be separated into two groups: (1) laminated multilayer boards, and (2) built-up multilayer boards. Of the two, boards fabricated by the built-up method are less common. These are fabricated by alternately building up conductor patterns by electro-deposition and screening on insulating layers, or by using a sequential lamination of individual cla'd circuit boards where the interconnections are plated down through blind holes, and the circuitry then defined upon the board by etching through a resist layer. In the case of multilayer boards using the laminated technique, all layers are laminated in one step.
In producing multilayer printed circuit boards by laminating together two or more individual circuit board substrates having open through holes, it has been found desirable to utilize an adhesive whose physical characteristics can be controlled during the laminating process. The adhesive should exhibit sufficient flow at the laminating pressure and temperature to provide the intimate contact between adjacent circuit board layers which is necessary for good bonding. At the same time, the adhesive should be sufficiently viscous so as not to flow into the through hole interconnection areas of the circuitboards. The I viscosity can be regulated by rigid control of the laminating cycle, i.e., temperature, pressure time, or through the i formulation of special adhesive blends. For example, by formulating a double resin adhesive system, wherein one resin reacts at a relatively low curing temperature to increase the viscosity of the adhesive and the other resin reacts at a relatively high temperature to effect the desired adhesive bond, controlled resin flow during the laminating process, which is carried out above the lower curing temperature, may be achieved.
More specifically, an adhesive containing a high temperature di-functional epoxy resin may be employed; alternately an adhesive mixture containing a high temperature di-functional epoxy resin and a relatively low temperature polyfunctional epoxidized novolak resin such as phenol formaldehyde condensate, may be used. Four examples of different formulations of this type are set forth in Table I.
Sample tests revealed that 8 mil glass epoxy may be coated with a 2 mil layer of adhesive, partially cured at 144 degrees centigrade and laminated at 170 degrees centigrade and a pressure of pounds per square inch with satisfactory results. The corresponding pre-cure characteristics are set forth in Table 11.
TABLE II Ratio of difunetioual to polyfunctional Minimum cure Glass epoxy samples laminated in the aforementioned manner exhibited good adhesive properties, and the adhesive did not flow into 40 mil through holes formed in the laminate.
The adhesives described and represented in Table I may be prepared by dissolving the DCD in DMAc and Carbitol acetate, adding the resins and stirring with a magnetic stirrer until all resin is in solution, at which time the BDMA is added.
An important advantage of these mixed resin systems is that cure of the more reactive poly-functional resin component without significant cure of the less reactive difunctional component provides a relatively non-critical cure cycle. Shelf life in the partially cured state is also extended. Formulations of mixed resin systems can be made to produce desired curing and laminating cycles. by varying the type and ratio of the resin components.
Other reactive components such as phenolics, polyamides, or polysulfides can be utilized to provide a controlled flow mixed resin system. Polyamides and polysulfides produce a more flexible system which can improve bond strength and provide other desirable properties. Thickening agents such as silica can also be added to the adhesive blends to aid in the control of resin flow without affecting cure or shelf life.
FIG. 2 depicts the steps in the formulation of a multilayer circuit board utilizing three double sided circuit boards 20 having plated through holes 22, fabricated in accordance with the method represented by FIG. 1, and laminated with adhesive coated dielectric substrates 30 wherein the adhesive is of the type described supra. The processing steps as illustrated in FIG. 2 entail the following:
The adhesive supporting substrates 30 are punched or drilled to form holes 32 which will register in the desired manner with the plated through interconnection holes 22 of the double sided boards 20. Alternately, the controlled flow adhesive may be applied directly to the planar surfaces of the double sided boards using roller coating or printing techniques. Care must be taken to insure that the through holes are left exposed.
The adhesive layers 30 are then sandwiched between the double sided boards 20, with all holes 22, 32 in proper registration, and laminated in a laminating press under controlled conditions of temperature, pressure, and time; these parameters varying as a function of the materials used. Thereafter the laminate is removed from the press and permitted to cool.
Final board interconnecting is achieved by plating across the adhesive-insulating layer separation in the through holes using electroless and/ or electroplating methods. This may be accomplished in any one of a number of ways. For example, the entire laminated structure could first be coated with a'sacrificial layer of electrolessly deposited copper; the outer substrate surfaces masked olf with a resist impervious to plating, leaving the through holes exposed; plating up the through holes utilizing electroplating techniques; stripping off the plating resist; and finally subjecting the entire assembly to a flash etch to remove the sacrificial layer previously deposited. Should it be found desirable, the conductive circuitry upon the exterior surfaces of the laminated assembly could be formed at the same time that the through holes are plated.
A more specific description of the method discussed in association with FIG. 2 is presented in Example 1 infra:
Example 1 Multilayer circuit board fabricated by the lamination of double sided circuit boards using a single resin controlled flow adhesive.
Board material:
Type GXXP Phenolic .015" thick coated with Shipley 200 TF primer;
Controlled flow adhesive #25456-69-11:
10 grams Bakelite ERRA-2011 epoxy resin (Union Carbide) (70% resin dissolved in Carbitol Acetate); 0.8 cc. dicyandiamide in dimethylformamide (.28 g. dicyandiamide); 0.022 g. benzyldimethylamine; 0.07 cc. siliane A-1100 (Union Carbide);
0.5 g. Cabosil.
(a) Two 0.15" XXXP sheets are coated on both sides with a layer .001 to .003" thick (dry film) of the above adhesive and partially cured at 121 C. for 50-60 minutes.
(b) The adhesive coated sheets plus three uncoated sheets of XXXP are punched with .040" holes in predetermined positions.
(d) Three double sided circuit boards having plated through holes are processed from the uncoated sheets using the method outlined in FIG. 1 and described previously.
(d) The double sided circuit boards are stacked alternately with the adhesive coated sheets, using a lamination jig with registration pins so that all through holes are in registration; the adhesive coated sheets being disposed within the stack. A thin sheet of silicone resin or other resilient material is placed in the jig to equalize pressure during lamination. The assembly is then laminated at -200 p.s.i. at 171 C. for 30-60 minutes in a heated platen laminating press and cooled to room temperature.
(e) The exterior surfaces of the laminated assembly, and the exposed surfaces of the holes, are sensitized as previously described and coated with a thin layer of electroless copper. A masting ink is then applied over the electroless layers leaving the interior of the through holes open. The holes are then electroplated to complete the connections between the double sided boards. The masking ink is then removed and the thin exposed electroless layer removed by flash etching.
While it will generally be desirable to us a dielectric substrate for supporting the adhesive, a conductive support may be used which can then serve as a ground plane or shield between layers.
FIG. 3 depicts the steps in the fabrication of a multilayer assembly utilizing one double sided board as a starting basis and building up therefrom on either side, utilizing a controlled flow adhesive, to form the completed multilayer assembly. The processing steps as illustrated in FIG. 3 entail the following:
Dielectric substrates 30, precoated on one side 31 with a controlled flow adhesive and pre-cure'd at proper temperature-time conditions, are ptunched or drilled to form holes 32 in registration with the plated through hole 22 gvithin the double sided board 20 and as otherwise desired The double-sided board 20 is then sandwiched between the adhesive surfaces 31 of the dielectric substrates 30 and laminated thereto.
Conductive circuitry 36, as desired, is then formed on the exposed surfaces of the dielectric substrate as described in the explanation of FIG. 1. At the same time exposed surfaces of any holes 38, be they through holes 22, 32 or restricted via holes 34 are plated up.
The foregoing steps may then be repeated as necessary to build up the board with the desired number of layers;
e.g., FIG. 3d-e. It should be noted that this process can be used to form buried layer interconnections as well as feed through connections. The burned interconnection provides for more than one separate interconnection per location on the board, thus providing greater packaging density. The feed through type connection builds up in metallic thickness toward the base layer as. adjacent layers are processed. All conductor circuits and interconnections are built up of continuous copper from layer to layer with good reliability. Each circuit layer and interconnection can be tested through the processing with easy repair or reprocessing possible. Etchants are applied for only short periods of time, and no plated etch resists are required. The method is not restricted to substrate composition or thickness, and dilferent materials and thicknesses can be easily used to control electrical and physical properties. The buried type of interconnection is much less critical than a through hole and does not require critical drilling or registration.
A more specific description of the method discussed in association with FIG. 3 is set forth in Example 2 infra:
EXAMPLE 2 Multilayer circuit board fabricated by the sequential lamination of preperforated dielectric layers over a double sided core layer using a double resin controlled flow adhesive and additive circuit processing.
Board Materials:
Type Eg-752 GEE-UC (.008" thick) glass reinforced epoxy (G- grade) Mica Corp.
Cont-rolled flow adhesive #26367-8241:
3 g. Bakelite ERR-0100 epoxy resin 27 g. Bakelite ERR-2010 epoxy resin 0.6 39 g. dicyandiamide 12 cc. dimethylformarnide 15 cc. Carbitol acetate 0.15 g. benzyldimethylamine 0.2 25 cc. linseed oil (a) The epoxy sheets are roughened mechanically to a fine matte finish by vapor blasting to improve adhesion of subsequent coatings.
(b) A double sided core layer is processed using the method outlined in FIG. 1 and described previously.
- (c) Epoxy sheets are coated with a continuous film of the the controlled flow adhesive, such that after drying the film thickness will be about .001".003" thick. The adhesive is then partially cured at 144 C. for minutes. The sheets are then punched or drilled with a 0.35" hole pattern to align with the circuit pattern of the core layer and laminated in a jig with registration pins at 100-200 p.s.i. for five minutes at 171 C. and allowed to cool to room temperature.
((1) Circuits are then fabricated on the outer layers using methods outlined in FIG. 1. Interconnections are through between layers in the open access holes and through holes during the circuit buildup.
(e) Processing is continued with the lamination of additional adhesive coated layers and circuit buildup as in Steps (c) and (d) above until the required number of layers are obtained. The final insulating layers are laminated at 171 C. and 100-200 p.s.i. pressure for 30-60 minutes to fully cure all adhesive layers. The board is completed with the fabrication of the outer circuit layers.
The multilayer circuit boards described previously in Examples 1 and 2 were fabricated using controlled flow adhesives coated directly onto the dielectric substrates. As an alternate method, thin unsupported controlled flow adhesive films or adhesive films coated on both sides of a thin insulating support film can be used in place of the adhesive coated sheets. An example of this method is given below.
Example 3 Multilayer circuit board fabricated by the lamination of double sided circuit boards using a controlled flow adhesive coated on both sides of a support film.
Board Material:
.010 thick polysulfone thermoplastic sheet Adhesive film:
Circuit Materials Co. Type CMCX626 .001" polyimide film coated on both sides with .001" of thermoset modified polyester).
(a) The polysulfone sheets are annealed in glycerine at 160 C. for three minutes and .010" diameter holes ther then punched in the required circuit interconnect positions. The punched polysulfone layers are next chemically treated to improve adhesion of subsequently plated copper. Supported adhesive films are also punched with the same hole pattern as above.
(b) Two double sided circuit boards are processed using the method outlined in FIG. 1. These boards include, for example, one having a circuit plane on one surface (which will form the outer layer of the multilayer board) and a voltage plane on the other surface (which will form the outer layer of the multilayer assembly). The other board may have a circuit plane on one surface and a ground plane on the other. All hole surfaces are coated with copper during the circuit buildup and connections provided to voltage or ground planes where required.
(0) The two double sided boards are then placed into a laminating jig with a supported, prepunched adhesive layer inbetween and positioned with registration pins to align all holes. A thin sheet of silicone resin is placed in the jig to equalize pressure and the assembly then laminated in a heated platen press at a temperature of 350 F. for seven minutes and a pressure of p.s.i. The jig is removed from the press and allowed to cool to room temperature before removing the laminated board.
(d) The entire board including the inner hole surfaces is then coated with a layer of copper .00005" thick and the outer surfaces coated with a masking ink by roller coating. The through holes are then electroplated to complete the connections between the double sided boards. The masking ink is then removed and the thin exposed layer of copper removed by flash etching.
In addition to multilayer circuit boards fabricated with organic insulating layers and organic adhesives, multilayer boards can be fabricated from single or double sided inorganic substrates using inorganic bonding materials. An example of this type of board is summarizedas follows:
Example 4 Materials:
High alumina ceramic substrates (AlSi Mag 614 American Lava Corp.) Glass frit bonding layer:
Vitta Corp, Cat. #61002 glass transfer tape.
(a) Perforated alumina substrates are formed having through holes in the required positions for interconnections and registration. Holes are normally punched in the green ceramic prior to firing, compensating for the shrinkage that will occur. 4
(b) Two double sided circuits are processed on the alumina substrates using the methodoutlined in FIG. 1.
(0) Holes are punched in the glass transfer bonding layer in positions toalign with holes of the double sided aluminia circuits. 7 V
(d) The two double sided boards are positioned in a laminating jig with the glass frit bondinglayer inbetween using registration pins. The assembly is then placedin a furnace and fired at a maximum temperature of up to 850 C. under sufficient pressure to bond the two .double sided layers together. The firing cycle and furnace atmosphere is controlled to burn off organic binder in the. glass frit and to prevent extensive oxidation of the circuitry at the higher temperatures. The assembly is then cooled to room temperature and the laminated board removed.
(e) The entire surface of the laminated board, including the through holes, is coated with a thin layer of metal by electroless and/or electrodeposition. The outer surfaces are covered with a plating mask ink and the through hole interconnections completed by electroplating. The masking ink is removed and the thin exposed metal layer removed by flash etching.
As an alternate approach to the above example, double layer circuits could be processed on preperforated alumina substrates using fired-on thick film circuitry (e.g., using screened Pd-Ag or Ag thick film conductor inks) and laminated as above. The final circuit interconnections would then be made as above using electroless and electroplating techniques.
FIG. 4 illustrates a method of making a multilayer board wherein solid interconnecting risers are formed by plating up the copper in the interconnecting holes prior to sensitizing. To fabricate the multilayer circuit depicted in FIG. 4 the interconnecting holes 42 are plated up to the surfaces 41 of the substrate 40 in which they are formed prior to sensitizing those surfaces 41. For best results the plated up risers require resurfacing flush with the surface of the board to be subsequently laminated, unless plating is restricted and controlled so as to stop slightly below the surface level. The process is continued in a manner similar to that described in the discussion associated with FIG. 3. No problems are encountered with the negative printing method in forming interconnections between the conductor lines and the solid metal risers. Interconnections with solid plated up risers have been made at plating current densities up to 46-0 ma./in. in a stirred bath with good results. The solid plated up riser provides a highly reliable interconnection between layers, though requiring a prolonged plating period.
In summation, the techniques disclosed for fabricating multilayer circuit boards provide significant advantages over those techniques previously used. Among them:
(a) An opportunity of performing circuit tests from layer to layer throughout processing, thereby permitting easy repair and insuring reliability and yield;
(b) It is not layer limited nor is it restricted to a small variety of substrate materials;
(c) Substrates of different thicknesses and electrical properties can 'be used either alone or in combination;
'(d) Solid, non-solid, buried, and feed through type interconnections can be made separately or in combination, thus offering maximum circuit design flexibility;
(e) Offset printing techniques can be readily utilized thereby offering the advantage of fine line resolution with good control and high productivity;
(f) Photoresist techniques are eliminated;
(g) Various metals can be used for the conductive circuitry;
(h) Prolonged etching steps are eliminated; and
(i) Conventional processing equipment can be utilized thus obviating the need for additional capital expenditures for equipment.
What is claimed is:
1. The method of manufacturing a multilayer composite having metallized through holes, comprising the steps of:
(a) providing at least two circuit boards formed with through holes;
(a1) metallizing the surface of each circuit board defining said through holes;
(b) aligning said boards to provide registration of said through holes as desired;
(c) interposing between said boards a layer of adhesive, said adhesive layer formed with holes in like registration, said adhesive comprising a two-resin component mixture, one of said resins reacting at a relatively low temperature to increase the viscosity of the mixture, the other of said resins reacting at a 1O relatively high temperature for bonding said circuit boards;
(cl) partially curing said adhesive layer at the temperature to cure said one resin;
(d) laminating said substrates and said partially cured adhesive layer to provide a multilayer composite having through holes unobstructed by said adhesive, said adhesive exhibiting sufiicient fiow at the laminating pressure and temperature to provide the intimate contact between adjacent substrates which is necessary for good bonding, while being sufficiently viscous so that said through holes remain unobstructed by said adhesi've after lamination; and
(e) metallizing the surfaces of said multilayer composite defining said through holes to provide a continuously metallized through connection.
2. The method as defined in claim 1 wherein step (c) more specifically comprises interposing between said boards a substrate coated on opposite surfaces thereof with said adhesive, said coated substrate formed with holes in like registration.
3. The method of manufacturing a multilayer composite as defined in claim 6 wherein step (c) more specifically comprises,
interposing between said boards a layer of an adhesive mixture comprising a first resin which reacts at a relatively low curing temperature, and
a second resin which reacts at a relatively high temperature,
said adhesive layer formed with holes in like registration.
4. The method of manufacturing a multilayer composite having metallized holes which serve to interconnect the circuitry upon the various layers thereof, comprising the steps of: 3
(a) providing a circuit board formed with holes;
(a1) metallizing the surface portions of the circuit board defining said holes;
(b) interposing said circuit board between two substrates,
each of said substrates formed with holes, at least one of said holes in each of said substrates being in axial alignment with one of said holes in said circuit board,
said substrates coated on the surfaces proximate said circuit board with adhesive;
(bl) partially curing the adhesive, said adhesive comprising a two-resin component mixture, one of said resins reacting at a relatively low temperature to increase the viscosity of the mixture, the other of said reslns reacting at a relatively high temperature for binding said circuit boards coated on said substrates at the temperature to cure said one resin;
(c) laminating the assembly to provide a multilayer composite at the temperature to effect bonding by said other resin, said adhesive exhibiting sufficient flow at the laminating pressure and temperature to provide the intimate contact between adjacent substrates which is necessary for good bonding, while being sufiiciently viscous so that said through holes remain unobstructed by said adhesive after lamination; and
(d) depositing conductive circuitry on the exterior surfaces of said structure and within the exposed peripheral surfaces of said holes.
5. The method as defined inclaim 4 wherein step (d) more specifically comprises plating conductive circuitry on the exterior surfaces of said structure and within the exposed surfaces of the assembly defining said holes.
6. The method of manufacturing a multilayer structure as defined in claim 4 wherein step (b) more specifically comprises,
coating said substrates with an adhesive mixture comprising a first resin which reacts in a relatively low curing temperature, and
a second resin which reacts at a relatively high temperature.
7. The method of manufacturing a multilayer structure as defined in claim 6 wherein,
said first resin comprises a relatively lowttemperature poly-functional epoxidized phenol formaldehyde condensate, and
said second resin comprises a relatively high temperature di-functional epoxy resin. 6
References Cited UNITED STATES PATENTS 2,456,006 12/1948 Hickler 156-90 15 2,992,954 7/1961 Nelson 6161 156330X 3,386,956 8/ 1968 Nawakowski -161Epoxy 3,102,213 8/1963 Bedson et al 29-626UX 3,340,607 8/1967 Shutt 29-625 20 3,356,786 12/1967 Helms '29625X 12 3,397,452 8/1968 Taraud 29-628X 3,265,664 8/1966 Fulmer et al. 156-313X 3,332,817 7/1967 Obenhaus 156313 FOREIGN PATENTS 569,037 6/1966 Canada 156-330 611,216 7/1946 England.
OTHER REFERENCES Epon Resins by 1Shell Co., p. 15, Nov, 9, 1950, in Paint, Oil & Chemical Re view.
- Electronic Packaging with Resins by Harper, published 1961, p. 62, relied upon. Plastic Engineers Handbook, 1961 ed., pp. 495-498.
JOHN F. CAMPBELL, Primary Examiner R. W. CHURCH, Assistant Examiner U.S. Cl. X.R.
UNITED STATES PATENT OFFICE CERTIFICATE OF CORRECTION Patent No. 3 606 677 Dated Inventor(s) Robert J. Ryan It is certified that error appears in the above-identified patent and that said Letters Patent are hereby corrected as shown below:
Column 2 line 29 "coppr" should be --copper--; Column 5 column 3 of Table II "114" should be --l44--; Column 6 line 10 "GXXP" should be --XXXP--; line 22 "0.15" should be --.0l5--; line 50 "us" should be --use--; Column 7 line 49 delete the first the"; line 52 "0.35" should read -vO35--; line 59 "are through between" should read -are "formed between--; Column 8 line 14 "ther" should read --are---; Column 10 line 6 after "adhesive layer" should be inserted -at the temperature to effect bonding by said other resin- Column 10 line 23 "Claim 6" should read Claim l--; Column 10 line 46 after "adhesive" should read -said adhesive comprising a two-resin component mixture, one of said resins reacting at a relatively low temperature to increase the viscosity of the mixture, the other of said resins reacting at a relatively high temperature for bonding said circuit boards--; Column 10 lines 47-52 should read to delete ",said adhesive comprising.
binding said circuit boards".
Signed and sealed this 28th day of March 1972.
(SEAL) Attest:
ROBERT GOTTSCHAIK HR JR EDWARD M FLE'TG m Commissioner of Patents Attesting Officer ORM PO-OSO (10-69) USCOMM-DC GUSTO-P69 u S. covEflNMim PRINTNG orrlcz (969 o-qmdsn
|Citing Patent
|Filing date
|Publication date
|Jun 15, 1972
|Mar 5, 1974
|Electrical interconnect structuring for laminate assemblies and fabricating methods therefor
|Aug 23, 1974
|Mar 16, 1976
|Nitto Electric Industrial Co., Ltd.
|Hollow cavity package electronic unit
|Feb 26, 1974
|Mar 23, 1976
|Method for manufacturing a connecting circuit for an integrated miniaturised wiring system
|Jan 30, 1978
|Jan 23, 1979
|General Dynamics Corporation
|One hundred percent pattern plating of plated through-hole circuit boards
|Dec 27, 1976
|Oct 7, 1980
|Bell Telephone Laboratories, Incorporated
|Method for bonding flexible printed circuitry to rigid support plane
|Feb 28, 1980
|Jul 14, 1981
|General Dynamics, Pomona Division
|Plug plating
|Nov 19, 1979
|Apr 27, 1982
|Shin-Kobe Electric Machinery Co., Ltd.
|Printed wiring board
|Oct 23, 1984
|Mar 24, 1987
|New West Technology Corporation
|Method for forming printed circuit board
|Mar 13, 1985
|Aug 11, 1987
|The Boeing Company
|Multi-layer circuit board bonding method utilizing noble metal coated surfaces
|Feb 17, 1987
|Apr 4, 1989
|U.S. Philips Corporation
|Method of manufacturing an electrically conductive adhesive bond
|Jun 27, 1988
|Aug 8, 1989
|Poly Circuits, Inc.
|Method of making multilayer pc board using polymer thick films
|Jun 15, 1989
|Feb 13, 1990
|Microelectronics And Computer Technology Corporation
|Method of fabricating a high density electrical interconnect
|Aug 4, 1989
|May 1, 1990
|Microelectronics And Computer Technology Corporation
|Method of making a multilevel electrical airbridge interconnect
|May 24, 1988
|Jun 19, 1990
|Tektronix, Inc.
|Method of fabricating a printed circuit board and the PCB produced
|Apr 27, 1990
|Dec 10, 1991
|Rogers Corporation
|Array connector
|Dec 29, 1989
|Jun 9, 1992
|International Business Machines Corporation
|Multi-level circuit structure utilizing conductive cores having conductive protrusions and cavities therein
|Jul 1, 1991
|Sep 15, 1992
|International Business Machines Corporation
|Manufacturing process of a high density substrate design
|Jun 1, 1992
|Apr 6, 1993
|International Business Machines Corporation
|Metal transfer layers for parallel processing
|Oct 29, 1991
|Aug 3, 1993
|International Business Machines Corporation
|Discrete fabrication of multi-layer thin film, wiring structures
|Oct 25, 1991
|Sep 21, 1993
|Circuit Components, Incorporated
|Array connector
|Jul 1, 1991
|Jan 18, 1994
|International Business Machines Corporation
|Chip attach and sealing method
|Dec 31, 1991
|Feb 1, 1994
|Tessera, Inc.
|Multi-layer circuit construction methods with customization features
|Nov 2, 1992
|May 10, 1994
|Hitachi Chemical Co., Ltd.
|Process for producing printed wiring board
|Dec 31, 1991
|Nov 29, 1994
|Tessera, Inc.
|Method of making a multi-layer circuit assembly
|Jul 21, 1994
|Sep 24, 1996
|Tessera, Inc.
|Multi-layer circuit structures, methods of making same and components for use therein
|Feb 21, 1995
|Nov 5, 1996
|Tessera, Inc.
|Multi-Layer circuit construction method and structure
|May 15, 1995
|Dec 10, 1996
|Tessera, Inc.
|Multi-layer circuit construction methods and structures with customization features and components for use therein
|Jun 7, 1995
|Jun 24, 1997
|Tessera, Inc.
|Method of making multi-layer circuit
|Aug 1, 1994
|Jul 28, 1998
|International Business Machines Corporation
|Multi-level circuit card structure
|Jul 1, 1998
|Aug 8, 2000
|International Business Machines Corporation
|Method of controlling the spread of an adhesive on a circuitized organic substrate
|Jun 6, 2000
|Aug 13, 2002
|International Business Machines Corporation
|Treatment solution for reducing adhesive resin bleed
|Sep 14, 2001
|Dec 31, 2002
|Tonoga, Ltd.
|Low signal loss bonding ply for multilayer circuit boards
|Jul 31, 2000
|Feb 25, 2003
|International Business Machines Corporation
|Method of controlling the spread of an adhesive on a circuitized organic substrate
|Feb 7, 2001
|Nov 25, 2003
|The Furukawa Electric Co., Ltd.
|Multilayer circuit board
|May 29, 2003
|Aug 31, 2004
|Tonoga, Inc.
|Low signal loss bonding ply for multilayer circuit boards
|Nov 7, 2002
|Mar 1, 2005
|Tonoga, Inc.
|Low signal loss bonding ply for multilayer circuit boards
|Nov 14, 2000
|Mar 24, 2009
|Freescale Semiconductor, Inc.
|Low profile integrated module interconnects and method of fabrication
|Dec 2, 2015
|Nov 22, 2016
|Honeywell Federal Manufacturing & Technologies, Llc
|Rapid PCB prototyping by selective adhesion
|Apr 18, 2014
|Feb 21, 2017
|Ibiden Co., Ltd.
|Printed wiring board having buildup layers and multilayer core substrate with double-sided board
|Mar 30, 2004
|Oct 14, 2004
|Tomoo Iijima
|Wiring circuit board, manufacturing method for the wiring circuit board, and circuit module
|Nov 16, 2004
|Mar 31, 2005
|Tonoga, Inc.
|Low signal loss bonding ply for multilayer circuit boards
|Feb 26, 2008
|Jun 19, 2008
|Murata Manufacturing Co., Ltd.
|Chip component
|Aug 29, 2007
|Jul 17, 2008
|Tessera Interconnect Materials, Inc.
|Structure and method of making interconnect element having metal traces embedded in surface of dielectric
|Feb 16, 2010
|Sep 30, 2010
|Tomoo Iijima
|Wiring circuit board, manufacturing method for the wiring circuit board, and circuit module
|Apr 18, 2014
|Oct 23, 2014
|Ibiden Co., Ltd.
|Printed wiring board and method for manufacturing multilayer core substrate
|Feb 20, 1986
|Aug 27, 1987
|Siemens Ag
|Multilayer printed circuit board
|Jul 13, 1988
|Jan 18, 1989
|Vaas-Lt GmbH
|Manufacturing method of printed circuit boards in rigid or rigid-flexible multilayer technique
|Dec 20, 1990
|Jul 3, 1991
|International Business Machines Corporation
|Multi-level circuit structure
|Jan 24, 2006
|Jul 27, 2006
|Tessera Interconnect Materials, Inc.
|Structure and method of making interconnect element having metal traces embedded in suface of dielectric
|U.S. Classification
|29/830, 174/264, 156/314, 174/259, 156/330, 29/846, 156/313
|International Classification
|Cooperative Classification
|European Classification


text:
City Hotel Dresden Radebeul
Select your stay dates to check availability at City Hotel Dresden Radebeul
City Hotel Dresden Radebeul
About the Hotel
Property Location
When you stay at City Hotel Dresden Radebeul in Radebeul, you'll be in the historical district and minutes from Lutherkirche Radebeul and Karl May Museum. This 4.5-star hotel is within close proximity of DDR Museum and Narrow Gauge Railway Museum.
Make yourself at home in one of the 126 air-conditioned rooms featuring flat-screen televisions. Wireless Internet access (surcharge) keeps you connected, and satellite programming is available for your entertainment. Bathrooms have shower/tub combinations and hair dryers. Conveniences include safes and desks, and housekeeping is provided daily.
Take advantage of recreation opportunities including a health club and an indoor pool. Additional amenities at this hotel include wireless Internet access (surcharge), babysitting/childcare (surcharge), and wedding services.
Quench your thirst with your favorite drink at a bar/lounge. Buffet breakfasts are available daily for a fee.
Business, Other Amenities
Featured amenities include a business center, express check-out, and dry cleaning/laundry services. Event facilities at this hotel consist of conference space and meeting rooms. A train station pick-up service is provided at no charge, and self parking (subject to charges) is available onsite.
Hotel Facilities
- Safe-deposit box at front desk
- Conference space
- Breakfast available (surcharge)
- WiFi (surcharge)
- Smoke-free property
- 24-hour front desk
- Indoor pool
- Free parking nearby
- Dry cleaning/laundry service
- Total number of rooms - 126
- Health club
- Babysitting or childcare (surcharge)
- Wedding services
- Self parking (surcharge)
- Meeting rooms
- Number of meeting rooms - 16
- Free train station pickup
- Garden
- Express check-out
- Number of buildings/towers - 4
- Multilingual staff
- Laundry facilities
- Tours/ticket assistance
- Terrace
- Business center
- Year Built 1994
- Bar/lounge
- Luggage storage
- Elevator/lift
Room Facilities
- Daily housekeeping
- Room service
- In-room childcare (surcharge)
- Hypo-allergenic bedding available
- Hair dryer
- WiFi (surcharge)
- Blackout drapes/curtains
- Private bathroom
- Rollaway/extra beds (surcharge)
- Air conditioning
- Shower/tub combination
- In-room safe
- Cribs/infant beds available
- Flat-panel TV
- Desk
- Satellite TV service
Hotel Policy
National Rating
Hotelstars Union assigns an official star rating for properties in Germany. This property is rated 4 star Superior and is displayed on this page as 4.5 stars.
Know Before You Go
- Children 11 years old and younger stay free when occupying the parent or guardian's room, using existing bedding.
The following fees and deposits are charged by the property at time of service, check-in, or check-out.
- Fee for buffet breakfast: EUR 18 for adults and EUR 9 for children (approximately)
- Fee for in-room wireless Internet: EUR 5 per 24-hour period (rates may vary)
- Fee for wireless Internet in public areas: EUR 5 per 24-hour period (rates may vary)
- Self parking fee: EUR 9.00 per day (in/out privileges)
- Pet fee: EUR 10 per pet, per night
- Rollaway bed fee: EUR 29 per night
- Facilities fee: EUR 10 per person, per day and includes use of:
- Spa tub
- Spa
- Swimming pool
The above list may not be comprehensive. Fees and deposits may not include tax and are subject to change.
Mandatory Fees and Taxes
A tax is imposed by the city and must be paid directly to the hotel. The tax amount is calculated based on the cost of the stay. For further details, please contact the property using the information contained in the confirmation received after booking.
Renovations and Closures
The following facilities will be closed from 03 January 2018 to 11 January 2018 (dates subject to change):
- Fitness facilities


text:
CURLYBREAK a little piece of paradise
Apartment, Manly Beach
Rated 4.5 out of 5 stars 11 reviews
Confirmation within 24hr
From $150 per night {{quote.pricing.message}} Total {{quote.pricing.price | format:'currency':'short'}} for
Min 3 - 7 nights stay
Curly Break - our garden apartment offers homey comfort in spacious style.
Curly Break at Curl Curl is a quiet retreat and only minutes away from the buzz of Manly. Regular bus service at the door.
There is just one house between Curly Break apartment and the best waves for boardies and body bashers alike Coastal walks, fishing, photography - whatever your passion, Curl Curl is a little piece of paradise.
If you are looking for a place to enjoy plenty of memory making moments, then we hope you will consider staying here at Curly Break. Your beds are freshly made up, there is a compendium full of local information, tours, walks, maps etc.and several local beaches are beckoning.
What type of accommodation will I find at Curly Break?
At Curly Break our garden apartment offers comfort in spacious style and ideal for families.
There is lots of room to move...don't be cramped up these holidays Park your car undercover, push open the wooden gate, through into your own private oasis. Proceed from the expansive lawns and garden where the children will love to play and up onto the al fresco entertaining terrace which is shaded by a magnificent frangipani tree. Through double glass sliding doors enter the apartment. Everything is fresh and clean, light and airy. The open plan living dining room is a comfortable relaxed and perfect space to chill out.The beds are super comfy and supportive to ensure a restful slumber. For economical food preparation the modern full size kitchen is well equipped oven, microwave, full size new fridge, new gas cooktop, granite benchtops, toaster, espresso pot, kettle, condiments olive oil coffee tea sugar milk are there for your convenience. Toilet paper washing detergent shampoo etc too. Please replace as you see fit. We have boardgames and a well stocked library.
Still dripping from the surf, wander into your own private garden passed your organic garden of tomatoes rocket spinach and herbs and onto your sunny terrace for a cool aperitif.
From the terrace watch your children play on the lawned area; or take them to the local well equipped playgrounds and playing fields and two beach pools and patrolled surf beaches across the road.
If you are a weary traveller, you may wish to have the refrigerator and pantry stocked with provisions. This can also be prearranged for your convenience.
What are the lifestyle features of Curly Break?
Have you checked out our location on the map? Convenience plus Curly is a quiet retreat and only minutes away from the buzz of Manly.
The northern beaches are 30 kms of pristine blue beaches, peppered with ocean bathes that are filled and refreshed each high tide with the currents of the Tasman Sea. The sandstone marbled cliffs are the backbone that wind along the coastline their ragged fingers stretching out on the headlands into the ocean protecting the beaches in their towering walls giving panoramic views as far as the eye can see.
There is one house between you and the blue Pacific so tuck your surfboard under your arm for the best waves the coast can offer. If fishing is more your thing then the beach gutter or rocks are sure to provide a bounty, particularly bream, salmon and flathead. Daylight saving provides ample opportunity to explore either by bicycle or stroll along pathways circumnavigating the picturesque Curl Curl Lagoon or endless kilometres of amazing coastal walks. Four superb golf courses and bowling greens are within 10 mins drive and the public are made very welcome. Park your car under cover and cycle or take the bus bus stop is just four doors away to the mall or Manly. The Manly-city ferry provides one of the best sightseeing tours in the world and particularly pleasant if you return after dinner to enjoy the spectacular contrast of City/Harbour Bridge/Opera House nightscape.
Sydney is renowned for its excellent fresh local produce and exciting ethnic diversity. Within a five kilometre radius there are amazing restaurants and cafes to suit all tastes and budgets. Farmers markets, supermarkets and delicatessens offer an array of goodies for home or picnic hamper.
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Have a question?
Feel free to send a message to the owner/manager if you have any specific needs, or if you require additional information before you can commit to a booking request.
Select request booking to access the quote calculator and to check availability.
Enter your check in and check out dates to see availability and a total price.
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Note: Pricing is subject to change, and a minimum stay period and other conditions may apply. You should confirm pricing with the property owner. Bookings paid through the Stayz online booking system incur a 2% Service Fee.
Prices listed based on 4 adults. Property has 3 beds and can sleep a maximum 4 people.
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text:
Robbie Williams and Jon Ronson Journey to the Other Side (Radio 4) had been so persistently trailed that I found myself noticing the familiarity of too many lines in the programme. You can't blame Radio 4 - Williams talking about his UFO obsession is a coup - but some of the best material lost impact when broadcast.
Still, there were other joys. You could hear Ronson's glee in every utterance, as if he still couldn't believe that Williams was being so peculiar with him in earshot. "I've grown a beard, and I'm going to Nevada to speak to people about UFOs," said Williams.
He took his girlfriend, Ida, and her annoying laugh, plus the quiet star of the show, Brandon, described by Ronson with understatement as "a lugubrious friend who seems anti-abductee".
People at a conference on the paranormal blamed technology ("she's only got a disposable camera") for the lack of documentary evidence. "Why don't you buy a better camera?" snarled Brandon. The best line was about a fight between two reptilian beings outside the conference hotel. "None of the delegates managed to photograph the aliens," we heard, "but apparently a vial of blood was collected."


text:
And if there has been a knowledge gap at the top of the Bank, it is Gordon Brown's fault. He it was who lay behind the decision to get rid of civil servants no longer wanted in Whitehall by shunting them off to the City to become Deputy Governors. Rachel Lomax and Sir John Gieve are both likeable enough, but they could never hope to understand the City as they would another department of state.
But in spite of this handicap, the regulators in the Financial Services Authority and the supervisors in the Bank have never had any problem knowing where the dangers lay. Their difficulty was in getting anyone to listen when those in positions to do something about it could make so much money by continuing to be irresponsible.
Though it was only Chuck Prince of Citigroup who was stupid enough to say out loud that as long as the music played his group would keep dancing, it was an attitude shared by all of the bankers. And these are the people the Chancellor now thinks should advise the Governor!
Those who think the regulators were not up to speed should do a bit of research. They could start with a speech that Sir Howard Davies delivered when he was still running the FSA (and he has been gone five years) in which he clearly and explicitly warned about the invention of collateralised loan obligations and credit default swaps and described them as toxic.
Nor did you have to attend the dinner to hear the speech. His remarks were reported in this column. Look, too, at the speeches of Alastair Clark, the Governor's eyes and ears throughout the period.
There was a lecture he delivered at Cass Business School at least three years ago that could not have been more explicit in warning of the dangers of mispricing risk and the loosening of lending standards. That was also reported here.
Or look at Mervyn King's own speech almost exactly 12 months ago at the Lord Mayor's Mansion House banquet, just weeks before the markets cracked where he told the bankers to their faces that they were hurtling towards the abyss. None of them changed their behaviour. They preferred not to listen - deafened by greed, possibly, caught up in the thrill of the chase certainly.
And look at the FSA's annual publication on the risks it sees to the financial system and the Bank's half-yearly Financial Stability Report. The insanity of the financial markets is chronicled there for all to see, and was regularly reported on throughout the period.
There is also a darker side to this. I once heard the head of one investment bank (who will no doubt be relieved to see that he is not identified) explain how he did not talk to the press because it did not matter what the public thought. If he wanted something, he talked direct to the Treasury. If the Treasury proposed something he did not like, he told them to drop it. As he had direct access to Whitehall, he did not care about anything else.
"Anything else" included warnings from the authorities. When challenged about this, Treasury officials protest their innocence. The problem, they say, is not the civil servants but the ministers, who are in turn either seduced by the City or terrified of it.
Either way, they are incapable of dealing with it rationally. On this analysis, it is the Government that needs financial advisers to tell it what is happening in the real world, not the Governor.
There is one further point. Imagine if you will that this committee had existed two years ago, and agreed with the Governor that the cheap and easy lending by banks to the private-equity industry had got quite out of hand, was a threat to stability and should be stopped - all of which is at least arguably true.
The protests would have brought the roof down, and if that failed, the private-equity industry would have threatened to move overseas, and if that failed they would have moved. The Government is so fond of saying that ownership does not matter, and is well aware that selling British companies to foreign buyers pays for its profligacy in other areas.
And most of the time, it does not matter. But it does mean Government has very little power to tell these foreignowned banks, brokers, fund managers and private-equity houses what they should and should not do.Reuse content


text:
Shenandoah, Virginia, USA
So rich are the leaves
Here, all roses and olive and gold.
Everything, it seems is peaceful,
No troubles to weigh down your soul
And tickle your fears.
No other time of year but October is so
Dramatic, so
Overtly contagious as this,
And you are alive in the forest,
Hot and cold and amazed all at the same time.
- Shenandoah, Virginia, USA.


text:
Flat with a garage in Molina de Segura. 72 m² comprising a lounge-dining room, kitchen, 2 bedrooms and 2 bathrooms. It has heating, air conditioning conduit pre-installation, built-in closets and laminate flooring in the rooms. Located in the town centre,
We can help you to get a mortgage on favourable terms. A residence permit can be obtained with the purchase of this property. Please ask our team for more information.


text:
Cabela's Boys' Realtree Flag Short-Sleeve Tee Shirt - $9.88
Realtree Flag Short-Sleeve Tee Shirt sports an all-American outdoor logo for your all-American outdoor boy. Crafted of 6.1-oz. preshrunk 100% cotton jersey with seamless double-needle-stitched collar for comfort and resilience. Taped neck and shoulders ensure long-lasting durability. Imported.Sizes: XS-XL.Color: Black. - $9.88


text:
BRAD Pitt was rejected from jury service for being too much of a distraction.
The 'Fury' actor was recently summoned to a courtroom in Los Angeles along with several other potential jurors, but was turned away because he was deemed too much of a disturbance for the legal proceedings because of his celebrity status, much to the dis-appointment of the 51-year-old star.
An attorney in the city, William R Lively, explained jurors are se-lected using a random process meaning their status as a celebrity is not picked up until they arrive at court.
He said: "Like any other po-tential juror, Brad would have received a jury summons that re-quired him to travel downtown and be interviewed by the judge or attorneys in what is called 'Voir dire'. This is a system of examina-tion whereby both the prosecution and defence have the opportunity to object to a particular juror.
"In most cases as soon as it's discovered that a potential juror is a major celebrity, that person is dismissed, but that is not always the case." – BANG!


text:
Guest reviews
Overall Rating
8.9 Excellent
Based on 65 reviews
staff to be very friendly."
Good to know
"Friendly service"
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Putting you in a great location within just a 10-minute walk of Ali Pasha's Mosque and Eternal Flame, Hotel Cosmopolit offers an airport shuttle (available 24 hours) for EUR 10.00 per person one-way. Free perks include WiFi, self parking, and buffet breakfast daily between 7 AM and 10 AM. LCD TVs, minibars, and room service are offered in all rooms.


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It was registered by LAKMAL RANASINGHE , who can be reached at . Registration details show that it was registered on 09 Jan 2016 through eNom and will expire on 09 Jan 2017.
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