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Bookmaking in Asia
The Asian subcontinent is famous for the high number of bookies and punters that are present. Most of the punters and gamblers are interested in straight betting and the more complex forms of betting aren't usually a popular option for the local people. From India to Pakistan to Nepal or any other country that comes to mind, all the bookmakers are connected to each other over the phone and in almost every country.
Bookmaking in Asia has also been shaped by the advent of the internet. Nowadays, punters can wager on almost any sport or event they are interested in. Even if you live in Australia and want to place a bet in Australia, it is possible from your home or office – online.
A decentralized sort of an environment is created. By the heavy use of the telephone during the entire bookmaking business and certain sports are covered which are of high importance for the expatriate community of the Asian countries. The hub of most of the gambling industry in Asia can be traced back to Karachi, Dubai and Bombay which are the most famous places where bookmaking is being conducted. Other than these three cities, the bookmakers are connected to the entire subcontinent and far away and bets can be made by calling the local deals.
These local dealers are situated in small hidden locations as gambling is not allowed in most of the countries. These local dealers open the channels and odds are discussed over the phone – the local dealer on behalf of his local customer then places the bets to the regional dealer. These regional dealers have been hired directly by the main bookmakers who are either sitting in the three cities across the Asian subcontinent. This is how odds are places and bets are made and the bookmaking business in Asia is quite different to what is followed in most parts of the world. Then there is the sport on which the bookmaking business is usually conducted.
Certain sports are important
For most parts of the subcontinent at least, it is the rivalry between the three countries, India, Pakistan and Sri Lanka which generates the most amount of interest from the public and cricket is the main activity which has a total viewership of more than 1.5 billion people and many more across the world. So such is the attraction of the sport of cricket that more and more advertisers, bookmakers, punters and other stakeholders have been trying to promote the sport in one way or the other.
Simply watching the game of cricket between the most famous rivalry between India and Pakistan cannot be accepted by the fans and they need more. More and more money is being pumped into any competition which takes places between India and Pakistan – be it in hockey, cricket, kabaddi, almost every sport generates the same amount of interest from the viewing audiences. Due to the intensity of the events which are held in Asia, be it a football match being held between Manchester United and AC Milan, the local fans go crazy and they need to quench their thirst of watching competitive matches by going to the bookmakers in Asia.
Phone versus Online bookmakers
All the money is finalised over the phone and the bookmakers work on the basis of trust. Each of the local dealers is well known among the gambling public and interactions continue through out the day. They trust the local dealer and the local dealer invests his trust by giving those concessions and hints as to where to place the bet and who to bet on.
But slowly and steadily online bookmaking is making its marks in the Asia as well with economies such as India and China unable to cope with the high number of consumers and users of telephone betting – thus the advent of bookmakers over the text messages or over the internet. Other options are also available such as the cable television centres which have been used quite often to place their bets.
One can use the remotes to place their bets through the cable television operator and he forwards the total bets for and against the team to the main dealer in the region. This is how methods are being evolved and newer methods are being developed. But there have been problems in the past when the bookmakers and local dealers have been caught by the police.
In Asia, the possibility of being arrested does exist but now proper systems are in place and it is least likely for the bookmaker to get arrested. Softwares are being used which are a safe way of doing business while many more novel ways have been developed so that no problems are encountered by the audiences. There are also many new online gambling websites which are slowly and steadily coming into force as many of these phone bookmakers are struggling to retain their market share.
People need quick access to what the odds are rather than waiting for a few hours before the bookmaker can help him out. The exchange of money over the internet is also safe and secure and there are usually no hassles encountered in dealing over the internet. Thus more and more new ways are leading to the development of the industry in Asia because it remains the biggest gambling market of the world with countries like China and India who thrive on the prospect of gambling on a sport.
Thus the emergence of online bookmakers is a pleasant surprise for the people in Asia who tend to bet on western sports such as the Premier League or the NFL which can not be done over the phone. Another problem with phone betting is that they do not have all the range of sports as do online bookmakers.
Phone bookies are unable to support a punter if they want to play the NFL or the Premier League – they can only help one out in regional sports and that's it. But the presence of both types of bookmakers also gives the punter open options to go for the phone bookies or over the internet. Competition between the phone bookies and the online bookmakers also helps to keep the odds at a reasonable rate so that everyone can enjoy the pleasures of gambling in the Asian subcontinent.


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Autumn Beeswax Candle Rolling Kit
They can create candles to fit their decor or party theme with this set of colorful sheets of beeswax that are easy to cut and roll into festive and even whimsical decorator pieces.

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Matt Reyes has been sifting through some old photos he took that haven't been published… like this one of Boothby hoping the rail @ the Island in SF. We look forward to seeing more oldies but goodies.
Matt Reyes has been sifting through some old photos he took that haven't been published… like this one of Boothby hoping the rail @ the Island in SF. We look forward to seeing more oldies but goodies.
When The 5th Floor came out with their white Championship Pocket t-shirt… it was gone in a blink of an eye. Now, here's your chance to swoop on the black version which will be available this Sunday on their webstore.
Received an email from Oli at Morvélo on their huge new collection. "Morvélo have almost passed out with the effort of not just launching one range, but three. There is the new mens range (once every six months as always) but accompanying this a brand…
Just when you thought the Red Hook Criterium hype was over… Dosnoventa shares their coverage.
Tim's LOW which features the Death Spray Custom Team Fork looks on point! See more @ The North Race.
Last Friday, BLAQ officially opened their doors to their new storefront off Divison St. There in the process of still moving in, but the shop is set up nicely with a welcoming ambiance. More to come from my next visit.
Golden Saddle Cyclery introduces their second hat in a two part series based on old Blackburn saddle bags. Swoop it HERE!
Patrick Seabase going where no man has gone before… Photo credit: Gian Paul Lozza
"Platform pedals come in all shapes and sizes and range from a traditional BMX style platform pedal to high end sealed bearing alloy pedals. These pedals continue to be a popular option as they offer a nice wide platform for many styles of riding and…
Last weekend Chrome Industries put on a event, The Subfloor Circuit. This video showcases the hard work that Amanda, Sean and all of their friends put in to make this event happen. Good job you guys and I can not wait for the next event!…
"Here's an edit that Jeff & I filmed in the hour we spent riding at the local school in our neighborhood. All shot on location in Gilroy California moments before we ate our Thanksgiving dinners." – Wheel Talk


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Black Abolitionist Archive
Subtitle: Rev. Josiah Henson and the Church.
Title: Voice of the Fugitive - September 23, 1852
Speaker or author: editor
Newspaper or publication: Voice of the Fugitive (1851 - 1852)
The writer responds to an article regarding a speech by Josiah Henson published in another newspaper. The article complained that Rev. Henson's comments regarding prejudice in the "white Church" were unwarranted.
Description of file(s): two scanned, two columned, newspaper pages
Subtitle: Letter from Edinburgh.
Title: Weekly Anglo-African - July 14, 1860
Speaker or author: editor
Newspaper or publication: Weekly Anglo-African (1859 - 1862)
The writer comments on a letter published in another newspaper. He believes the intention of the author of this letter is to communicate with well-known Black Abolitionists through newspaper publication. The letter seems to him to draw a comparison between the current state of American slavery and Scottish Reformation.
Description of file(s): one scanned, three columned, newspaper page
Title: William C. Nell
Speaker or author: Nell, William C. (William Cooper), 1816-1874.
Newspaper or publication: Liberator
Speech given at Marlboro Chapel to commemorate the arrival in Boston from England of William Lloyd Garrison and N. P. Rogers. An invitation for the event was issued reading: "all abolitionists of Boston and vicinity, irrespective of complexion, respectfully requested to unite in this public reception of our esteemed friends and co-adjutors in the cause of universal emancipation."
Description of file(s): PDF one page, 203 word document (text and images)
Title: William Craft
Speaker or author: Craft, William
Newspaper or publication: Northern Warder [Dundee]
Speech denouncing the Fugitive Slave Bill, and stressing the horrors and cruelties of slavery in the U.S.
Description of file(s): PDF 3 page, 843 word document (text and images)


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Tourist signs
Tourist traffic signs are provided to guide visitors along the most appropriate route for the latter stages of their journey, especially where destinations are difficult to find.
Tourist signs on motorways and trunk roads, such as the A1(M), A19(T), A64(T) and A64(T), are the responsibility of the Highways Agency. We are responsible for tourist signs on all A, B and C class roads and most unclassified roads.
Applicants should check that their tourist destination satisfies the criteria in the following areas:
The application fee is £165 and is non-refundable. Signs are provided at your own expense, including the cost of design, installation, and the repair or replacement signs as a result of theft, vehicle damage or general wear and tear in the future.
Tourist signs will normally be provided:
- If the road network to and from the tourist destination can safely accommodate the traffic likely to be generated;
- At a maximum distance of three miles from tourist destination and usually only from the nearest A or B road, or from the nearest settlement; and
- On a single sign bearing the details of both tourist destinations where there is more than one tourist destination approved for tourist signs at a junction.
Tourist signs are not normally permitted if:
- Premises are located on, and accessible from, a main A or B road and visible to passing traffic;
- Existing signs are sufficient to guide visitors to your premises;
- There is private advertisement sign relating to your facility;
- The destination is part of a larger attraction which already has tourism signs;
- The destination approach already has the maximum number of tourist destination signs; or
- There are unauthorised direction or advertising signs to the destination.


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Last Updated: June 20, 2013 at 10:18 am
Our answer is simple. Carefully chosen words so perfectly portray the connection of two lovers... and how it powerfully overflows to touch everyone around them.
Photo by Erich McVey Photography
Design & Florals by Petalos
Venue: Historic Deepwood Estate
Dress by Lazaro
Chair and Table Rentals by WestCoast Event Production
Models Nicole and Kamyar from Option Model & Media
Hair and Makeup by Christine Shields Makeup Aristry


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|Publication number
|Publication type
|Application number
|Publication date
|Feb 29, 2000
|Filing date
|Jun 4, 1997
|Priority date
|Jun 7, 1995
|Fee status
|Publication number
|Paul E. Grandmont, Clifford D. Fung
|Original Assignee
|Grandmont; Paul E., Fung; Clifford D.
|Export Citation
|BiBTeX, EndNote, RefMan
|Patent Citations (24), Referenced by (34), Classifications (11), Legal Events (8)
|External Links: USPTO, USPTO Assignment, Espacenet
This application is a divisional application of Ser. No. 08/481,969 filed on Jun. 7, 1995, abandoned. The contents of all of the aforementioned application(s) are hereby incorporated by reference.
The present invention relates to the fabrication of micromechanical structures, and more particularly to fabrication of such structures by techniques derived from semiconductor fabrication processes, or techniques applicable to the production of hybrid semiconductor/mechanical devices such as sensors.
In the last decade or so a number of techniques have been developed for forming mechanical structures of extremely small size by depositing a film, and masking, etching or otherwise patterning such film to produce a diaphragm, force responsive beam or wall, resonant structure, diffusion tunnel or other miniature structure or mechanical element. When produced on semiconductor grade crystalline wafers, these structures can not only enjoy the mechanical strength of single crystal structures, but may include signal conditioning or sensing circuitry integrally fabricated on the wafer. The submicrometer-level pattern forming techniques developed for semiconductor fabrication allow the construction of many such structures or devices on a single wafer, which may then be scored and divided into individual units, and packaged.
As representative of such sensing structures, one may consider oscillating plate type structures, such as shown in U.S. Pat. No. 4,699,006, or more static mechanical elements such as shown in U.S. Pat. No. 4,744,863. The last-mentioned patent shows a diaphragm formed over a closed chamber, with electrical sensing elements fabricated on the diaphragm. Such diaphragms may be of small overall area so that despite their thinness they can withstand high pressures. While such a structure provides an effective pressure sensor mechanism, it would be desirable to provide two-sided protection to protect the diaphragm against pressure spikes when used in a high pressure environment, in a pressure spikes when used in a high pressure environment, in a manner similar to the pressure stops commonly provided in larger mechanical construction of push-pull differential pressure sensors. In general, however, microlithographic techniques are suitable only for forming relatively thin elements on the wafer surface.
To provide a mechanically strong overpressure stop above the diaphragm requires fabricating a metal structure that is considerably thicker than the micrometer-scale thicknesses characteristic of circuit or diaphragm type structures, and the resist-masking techniques that have proven effective for formation of microelectronic elements are inadequate for the much thicker architecture of forming frames, posts, stops and housings, or for fabricating small machine elements such as gears having a thickness of over ten or twenty microns. Thus, at these greater thicknesses considered necessary to provide sufficient stiffness for pressure stops, gears or the like, there is a need for development of thick microstructure fabrication techniques.
In accordance with the principles of this invention, a differential pressure sensor has been developed comprising a silicon substrate having a cavity formed into the top surface of the substrate wherein the floor of the cavity defines a forward pressure stop. A deformable diaphragm covers the cavity and responds to the application of fluid pressure by deflecting. Deflection in the forward direction is limited by the forward pressure stop. The pressure sensor also comprises a reverse pressure stop formed of electrodeposited metal attached to the substrate and spaced over the diaphragm. The reverse pressure stop is of sufficient thickness such that deflection of the diaphragm in response to pressure supplied to the underside of the diaphragm is limited by the reverse pressure stop.
In accordance with the above, the differential pressure sensor includes means for applying a first fluid pressure to the top side of the diaphragm and a second fluid pressure to the underside of the diaphragm as well as electrical means for detecting the relative deflection of the diaphragm due to the pressure differential between the first and second fluid pressures exerted across the diaphragm.
In the preferred embodiment of the invention, a precisely defined spacer is positioned between the reverse pressure stop and the diaphragm. Further, the reverse pressure stop comprises a metal layer having a low thermal coefficient of expansion. The metal is preferably chromium or a nickel alloy. The sensing means for the diaphragm is preferably piezoresistive elements positioned to sense movements of the diaphragm in response to pressure changes.
Also in accordance with the present invention a method is provided for fabricating the overrange protected pressure sensor defined above. The sensor is fabricated by depositing a layer of semiconductor type material to form a spacer adjacent to the sensing diaphragm, a metalization layer is then applied to the silicon substrate and spacer. Next, a layer of resist is deposited upon the metalization layer and patterned to provide a layer of cured and uncured resist. The uncured resist is removed to partially expose the underlying metalization layer whereupon the metalization layer is used as an electrode to electrodeposit a thick metal layer upon the exposed sections of the metalization layer. This metal layer forms the mechanical overpressure stop once the remaining resist and the spacer have been removed.
In the preferred embodiment of the invention, the resist layer has a thickness substantially greater than 10 micrometers and is developed and exposed in substantially uniform vertical sections so that the resist can be removed selectively in a defined pattern. A preferred resist is a dry film photo-resist deposited in layers of less than 25 micrometers. The initial resist layer, however, may be spun-on resist. In order to cure the resist in the preselected pattern to the preferred depth a thermal gradient may be provided between the top and bottom of the resist layer in order to enhance the sensitivity of the resist to curing radiation at the bottom of the layer.
In accordance with the present invention micromechanical elements of relatively great size, yet having precision dimensions or positioning are fabricated by lithography of patterned films over approximately fifty microns, and up to several hundred microns, thick. The films are formed of photosensitive polymer material of a type commonly used for semiconductor lithography, and are exposed according to the invention and developed to great depth with faithful pattern delineation. The patterns formed by development of the exposed resist are then metallized, preferably by electroplating, to form structural or mechanical elements. Conventional thin film resists are patterned to form spacers or shims in regions where precise height or offset is required, and the spacers are removed after fabricating the mechanical element.
According to one aspect of the invention, film patterning is achieved by laying down successive layers of a dry resist, e.g., dry film, which are exposed after each layer is deposited. Development may be performed in stages, once after each layer is deposited, or may be performed only after several or all layers have been deposited and exposed.
According to another aspect of the invention a thick layer of polymer resist material is laid down, and is patterned by exposure to radiation along several different exposure axes to create a conical region of partially exposed polymer around pattern boundaries that resists undercutting of edges during development.
According to still a third aspect of the invention, the substrate is mounted on a heated stage and heat is applied to introduce a thermal gradient in the resist during the course of exposure. Optionally a cooling fluid is circulated over the top surface, enhancing a thermal gradient which counteracts the drop-off of sensitivity, as a function of depth, occurring in exposure or development of the film. The thermal gradient may be a non-equilibrium state established by heat pulses, and the exposure performed in intervals synchronized with the pulses.
These and other features of the invention will be understood by reference to the drawings and related description of processes according to the invention and an exemplary structure produced by the processes, wherein
FIG. 1 is a perspective view of a wafer having a plurality patterned electromechanical elements formed thereon;
FIG. 2 is a partial cross-sectional view through the wafer of FIG. 1 at the position indicated by section lines II--II;
FIGS. 3A-3F show steps in fabrication of a metal mechanical stop and complete structure in accordance with the present invention;
FIGS. 4-4E show details of one aspect of the coating and exposure for forming thick mechanical elements according to the present invention;
FIG. 5 illustrates another aspect of wafer exposure for forming thick mechanical elements according to the principles of this invention;
FIGS. 6A-6C illustrate process steps for forming the structure of FIG. 3 according to the principles of the invention; and
FIG. 7 shows a detail of a diaphragm stop formed in accordance with the aspect illustrated in FIG. 6C.
The invention is best understood by considering the steps involved in fabricating a mechanical element according to the present invention on a semi-completed wafer having various conventional electromechanical elements or structures present thereon.
Such a semi-completed sensor wafer 1 is illustrated in perspective in FIG. 1, and contains on its surface a number of diaphragm regions 10a, 10b, 10c which illustratively are of several different sizes, e.g., having a cross-dimension of 30, 100, or 500 micrometers. Each diaphragm is formed by thin film techniques and is positioned over a hollowed-out chamber, that may be vacuum-sealed as shown in U.S. Pat. No. 4,744,863, mentioned above, or may communicate with a pressure port on its underside.
Sensing elements 12 are formed on each diaphragm, and respond either to motion of the diaphragm itself, or to stresses induced by such motion, to generate or alter electrical signals. For example, the elements 12 may be piezoresistive elements, or may consist of electrical or optical pick-offs of various types. For purposes of this discussion, the elements will be assumed to be polysilicon piezoresistive elements, which may, for example, be arranged away from nodes along regions of maximum stress, in a bridge configuration to cancel noise, so as to faithfully respond to the magnitude of diaphragm displacement. Electrical connections 15 extend from the sensor elements 12 to lands metalized pads 16, 18 which allow connection of the device to appropriate circuitry.
An individual unit may consist of a sensor assembly having a single diaphragm, several like-size diaphragm regions (to achieve redundancy for high chip yield, long lifetime or multiplicity of simultaneous measurements), or a collection of different-size diaphragm regions to provide a sensor covering a plurality of different measurement ranges of the pressure or vacuum spectrum.
FIG. 2 shows one diaphragm structure 10 of the wafer 1 in sectional view. As illustrated, a polysilicon diaphragm 10 is positioned over a cavity 20 that has been formed with sacrificial material on the wafer and then opened and emptied by a back-side etch through the wafer 1 to create an access port 25 for connection to a pressure sensing environment. For simplicity, the section does not show sensor elements 12, although it will be appreciated that these elements will generally be formed as thin film elements (e.g., polysilicon elements in the case of one type of piezoresistive sensor) that extend slightly above the diaphragm top surface.
The cavity 20 may be defined by various steps of forming etch stops, masking and then oxidizing the region where a cavity is to be located, depositing epitaxial surface material over the oxide region to form the diaphragm 10, and then etching through to remove the oxide, so that the cavity floor 22 is located at a very precise distance from the deposited diaphragm and keeps it from traveling beyond its limit of elastic extension in the direction of cavity 20. The cavity depth is selected to cause the diaphragm to bottom out on the cavity floor 20a after a displacement between about (0.5) and (2.0) micrometers. The diaphragm itself may be one to four micrometers thick, and is subject to failure if it should undergo excessive deflection. The cavity floor 20a therefore acts as an overpressure stop to prevent diaphragm failure in the event excessive pressure is applied to the top surface of the diaphragm 10
The discussion below will describe the formation of a purely micromechanical element located above the diaphragm of FIG. 2 and having a comparable degree of precision in its location, yet of a thickness many times greater so that it has the mechanical strength to serve as a structural overpressure stop to protect the diaphragm against excessive flexing in a direction opposed to the cavity floor 20a due to pressure applied through port 25.
By way of technical exposition of the ends to be attained by the illustrative embodiment of the present invention, the primary objective is to fabricate a strong, relatively stiff and well adhered cap with a precision gap between itself and the diaphragm. Calculations to evaluate the forces and deflection of the stop under over-range conditions and determine the thickness needed for the stop for different overall dimensions or different materials are summarized below. The calculations assume the size of the largest diaphragm to be 250 mm�250 mm (0.010 in)2, and assume a maximum over-range pressure of six kpsi, with the length and width L and B of the plated portion each extending 0.001" beyond the edge of diaphragm, i.e., with an over-range stop geometry: B=0.012 in., L=0.012 in., as shown in FIG. 3A, in which the overall form of the thick mechanical stop 30 to be formed over the diaphragm is shown. For the above diaphragm, the following representative mechanical characteristics of a thick film cap structure 30 were calculated. ##EQU1##
Evaluating the stress for different stop thicknesses:
for H=0.002 in. Stress=112 kpsi
H=0.003 in. Stress=50 kpsi
H=0.004 in. Stress=28 kpsi
Thus, a stop thickness of 0.004 in. will keep stress levels during a 6 kpsi over-range pulse below 30 kpsi., which is considered a safe maximum level.
4. Max. Deflection=WL3 /192 EI
or Dmax=WL3 /16EBH3, where I=BH3 /12, and where E is the elastic modulus of the stop material.
For a given stop geometry and maximum over-range pressure, the deflection varies with the modulus of elasticity of the material used to fabricate the stop. In the case of the above defined stop geometry and applied force conditions, we have the following: ##EQU2##
If the maximum allowable deflection of the stop at over-range is 0.01 mm, we have Emin=214.3 kpsi. This is a very low modulus of elasticity for most plated metals, so the requirements for the stop can be realized with plated metal fabrication, so long as their modulus of elasticity >>220 kpsi and tensile strength >>30 kpsi.
Two other significant sources of stress should be considered. These are (1) temperature dependent stress due to mismatches in the coefficient of thermal expansion (TCE) of the stop and substrate material, and (2) internal stress within the stop material deposit itself that develops during the plating operation. These effects are analyzed separately below.
The temperature dependent stress is preferably kept low by ensuring that the TCE of the stop material be close to the TCE of the substrate silicon wafer. For the case of a polysilicon pressure transducer, the working temperature range is desired to be -40� C. to +120� C., or �80� C. range centered at approx. 40� C. Temperature dependent stress is proportional to the net mismatch in TCE, the maximum temperature swing, and the moduli of elasticity of the stop and substrate materials.
ΔTCE (ppm/� C.)�Tmax(� C.)=max. strain at temperature limits, and
strain�modulus of elasticity=stress.
Some of the temperature-induced stress will be transferred to the substrate/diaphragm. The amount of stress shared between the substrate and the stop depends upon the relative thicknesses and the relative moduli of elasticity of the substrate and the stop. Stress of this nature can cause span shift errors as well as sensitivity errors in the measurements made with the sensing unit, and thus is desirably to be avoided or minimized. It also has an effect on the adhesion of the stop to the substrate due to generation of shear forces.
For a silicon wafer material, the average coefficient of thermal expansion over the temperature range of 50� C. to 150� C. in the wafer plane (the x-y plane of the wafers used to fabricate polysilicon pressure transducers) is 3.16 ppm/� C. This is an extremely low coefficient of expansion compared to most plated metals, so applicant has selected only low-TCE metals as suitable for forming a plated pressure stop.
Table I is a list of electrodepositable pure metals that have relatively low TCEs (i.e, less than 7.0-8.0 ppm/� C.). Electroplated alloys with a low TCE may also be used, but published TCE data for electrodeposited alloys is limited, and in general TCE data varies widely from source to source even for all of the materials listed in Table I.
TABLE I______________________________________Pure Metal TCE (ppm/�C.) Known & Possible Low TCE Alloys______________________________________Osmium 2.6 Fe-NiRuthenium 5.0 Ni-P (>40% P)Chromium 6.2 Ni-B (>10% B)Rhenium 6.7 Ni-P-B (high P, B)Iridium 6.8 Ni-W Cr-Mo______________________________________
alloy is electroplated in one or two proprietary processes. Electroless Ni--P and Ni--B processes are also common, but the boron and phosphorus contents of reported processes are far too low in these deposits to obtain the necessary low TCE property. Most of the other materials have been electrodeposited experimentally, but are not in wide, or possibly any, commercial use.
Applicant considers iron-nickel alloy a less desirable alternative because it rusts readily, especially with the high iron content alloy needed to achieve a low TCE. It also has undesirably high internal tensile stress as it is deposited.
Chromium therefore appears to be the best choice for a number of reasons. It is strong and very stiff, as well as very corrosion resistant. It can be electrodeposited with near zero internal stress. A multitude of commercial bath formulations and information exists on electrodeposition of chromium, as well as considerable expertise in the specific area of crack-free, low internal stress deposits for this metal. Most of these processes involve the technique-of pulse-electroplating, where current is applied to the cathode (substrate) as a square wave, interrupted DC condition to allow buildup to proceed to thick deposits with low hydrogen inclusion.
For chromium metal, the TCE is 6.2 ppm/� C., compared to 3.16 ppm/� C. for silicon for a net mismatch of 3.04 ppm/� C. Chromium is strong and very stiff, with an elastic modulus 25% higher than silicon. High quality, crack-free, low internal stress electrodeposited chromium has been reported in the literature, with tensile strength >100 kpsi, and an elastic modulus of 30 mpsi.
For the case of a chromium stop we have the following: 3.04 ppm/� C.�80� C.=243 ppm strain at temperature limits 2.43�10-4 �3.0�107 psi=7.29 kpsi stress max. This stress level occurs at the maximum temperature limits, and linearly decreases to near zero if the deposition temperature is near 40� C., the temperature swing midpoint. This is not a very high level of stress for the stop itself, but the effect of this on the diaphragm must be evaluated. Because both silicon and electrodeposited chromium exhibit virtually no elongation or compressibility, forces of this nature would presumably cause bending of the substrate/diaphragm, as well as applying shear forces on the interfacial adhesion.
Calculations were performed to determine the magnitude of this effect upon the diaphragm, and show that membrane strain and bending strain are fairly low, and that the bend radius at the maximum temperature swing is quite large. The deflection of the silicon (and its attached diaphragm) is calculated to be very small, about 0.3 angstroms at the maximum temperature swing. Although the stress that the silicon substrate can have is fairly high, the virtual incompressibility and lack of elongation of the substrate make transfer of the stress to the diaphragm unlikely except in the form of bending strain.
As regards internal stress, the stress within the deposit is presumed to cause similar effects as above. Stress in electrodeposited chromium as reported in the literature spans a wide range, from--113,000 psi (compressive) to over 157,000 psi in tension. Stress is influenced by thickness, plating bath temperature, current density during plating and other factors.
In general, thin deposits (<3 mm) from low temperature (30-46� C.) baths exhibit high tensile stress, above 70,000 psi. Stress in thicker deposits usually decreases with thickness, reaching an equilibrium value when plated to above 50 mm in thickness. The reduction in stress with thickness is a result of stress relief by cracking.
Even moderate stress levels within the deposit can be disastrous for this particular application, and a cracked deposit is probably useless for this application since cracks would reduce its tensile strength to under 20,000 psi. Annealing to relieve stress in chromium deposited over silicon elements is considered impractical, as the annealing temperatures of 1100-1200� C., are too high for the finished pressure transducer chip with its interconnections and bond pads. These factors would at first glance appear to rule out fabrication by electrodeposition of chromium. However, by depositing the chromium using a pulse-plating process, a thick chromium deposit can be laid down as a crack-free layer with close to zero internal stress as deposited.
Another suitable metal/deposition process is pulse-electrodeposition of low stress, crack-free Cr--Mo alloy, which applicant expects to have a somewhat lower TCE than that of pure chromium. This process has been developed by the Pratt and Whitney Company, and is capable of commercial application.
The foregoing discussion of mechanical properties and constraints for a representative mechanical element is intended to provide guidance for the practice of the present invention in fabricating diverse devices, in the manner now to be described more completely for formation of a diaphragm overpressure stop.
FIG. 3A illustrates a general form of the desired thick metal structure 30, which is to be firmly and preferably conductively anchored by posts, feet or sills at its periphery, and having precisely-located edge positions and the lower surface height "h" above the diaphragm. This lower surface is to be formed with extreme precision. This is achieved in accordance with a basic process of the present invention as follows, starting from a semi-completed micromechanical diaphragm structure of or similar to the type shown in FIG. 2 and as more fully described in U.S. Pat. No. 5,220,838 to Fung et al.
First, as shown in FIGS. 3B and 3C, a precision spacer element 40 is formed over the diaphragm and a peripheral band thereabouts. By way of scale, spacer 40 has a thickness equal to the intended gap "h" between the diaphragm and the overpressure stop, which, as described above, will be between approximately one-half and two micrometers, depending on the diaphragm span, its thickness, and the maximum intended surge pressure operating environment. Spacer 40 may be formed by depositing a semiconductor-type photolithography layer of the desired thickness over the wafer, and exposing and developing the resist to leave a localized blanket of the desired thickness over the diaphragm. Virtually any resist that can be applied with uniformity in a layer of the desired depth may be employed. The only compatibility constraint is that the spacer not be dissolved during the various steps involved in fabricating the cap, as described below. When, as illustrated in FIG. 1, the diaphragm is to have elements such as sensors 12 extending above its surface, it may be desirable to employ a two layer resist for this spacer layer, wherein a planarizing sublayer formed of carbon or the like is first applied to smooth the surface topography. On the other hand, when the sensing elements or other such surface features extend a significant distance across the intended gap, it may be preferable to use a single, and more viscous resist formulation that allows the resist to follow the underlying topography, thereby creating a spacer 40 having a bumpy top surface, so as to define recesses in the later-formed cap to accommodate the protruding diaphragm sensor structures. At all events, the layer is applied and patterned to leave a precision spacer 40 (FIG. 3B).
Following the formation of spacer 40, a thin metalization layer 80 is applied to the entire surface of the wafer as shown in FIG. 3C. This layer allows current to be applied to the exposed areas of the wafer surface for electroplating and also provides a base or transition layer that promotes adhesion of electrodeposited metal in the peripheral region about the diaphragm. The adhesion layer 80 is preferably deposited by a relatively energetic process, such as sputtering, and is applied in a sufficient thickness to provide the high level of ohmic conductivity necessary for the cathode in a current pulse deposition electroplating process. This layer is preferably formed of sputtered chromium, which adheres well to silicon, and has a well-matched coefficient of expansion, or is formed alternatively of titanium.
Next, a layer of resist or masking material 60 is applied over the whole wafer, and is patterned in the region overlying the diaphragm to create a cavity 70 as shown in FIG. 3D in which the cap is to be formed. As described in the discussion of mechanical properties above, this cap structure 30 (FIG. 3A) is to stand on supporting legs or walls anchored in a peripheral region 71 slightly outside the diaphragm.
By way of scale, layer 60 is substantially thicker than the spacer 40, for example, approximately 100 micrometers thick, its thickness corresponding to the necessary structural thickness of the metal cap. It may also include some margin of error to allow for etching away a portion of the electrodeposited layer in a finishing or material removal step, as described further below.
As discussed above, the location of edges of the pattern-defining cavity 70 will in general require a high degree of precision, e.g., under ten micrometers and preferably almost an order of magnitude less, since it defines the position of a conductive cap member located between electrical and mechanical elements having characteristic dimensions of that scale. In general, accurate feature definition and positioning on this scale would not be expected from a thick resist-like layer 60, because exposure and development in thick layers are non-uniform processes, and can introduce poorly-controlled shrinkage or swelling effects when the thickness is disproportionately large compared the scale of pattern resolution.
Accordingly, applicant has developed a number of specific processes for the formation of the pattern cavity 70 with sufficient precision to define such a plated overpressure cap. These processes are discussed further below, with reference to FIGS. 4-7. For present purposes, however, it suffices to note that the cavity 70 is formed in the shape of an open-faced mold in which the cap member 30 (FIG. 3A) is to be deposited.
Following the formation of cavity 70, the wafer is electroplated, preferably by a pulse electroplating process as indicated above, to lay down a thick metal layer 90 of at least 30-50 micrometers and preferably 100 micrometers thick, filling cavity 70, as shown in FIG. 3E, thus forming the desired cap structure 30 (FIG. 3A).
Preferably, this electroplated layer is chromium. The current density required for chromium electroplating is believed to be between about four amperes and one hundred amperes per square inch, with a multi-sensor wafer typically requiring approximately one square inch total area of plated cap structures. A variable square wave switching system using a high current rectifier allows the plating of low stress crack free films.
After the thick film metalization, the thick masking layer 60 is then removed, e.g., by solvent dissolution, in a straightforward manner. Once layer 60 has been removed, exposed portions of the pre-metalization layer 80 are etched away. No masking is necessary as the thickness of this background metalization is well below several micrometers, and it is readily etched away without cleaning off more than one percent of the thickness of the deposited metal cap structure 30 formed from layer 90.
It should be noted that the cap structure 30 does not entirely enclose the diaphragm, but rather is supported above the diaphragm by peripheral posts or feet 31 (FIGS. 3A and 3F) leaving open sides, so that once layer 60 has been eroded down to within a distance "h" of the diaphragm, the first-deposited spacer element 40 may-be dissolved, thus opening the precision gap "h" between the diaphragm 10 and the cap 30.
This final operation to complete the finished structure of FIGS. 3A and 3F consists of dissolving the sacrificial spacer 40 and is accomplished using a solvent such as acetone that is compatible with, i.e., does not damage, the structures on the diaphragm or the structures and circuit elements on the wafer. Since the gap "h" is typically about one micrometer, and the cap 30 may span a several hundred micrometer square, this removal will take considerable time. To expedite this step of the process, applicant contemplates in an alternative embodiment forming the cap as a windowed or perforated structure, allowing greater solvent access during the spacer removal step. A perforated step may additionally provide a better forward pressure port for the fill fluid of the sensor during operation. The backside etch required to open port 25 may also be preferably delayed until the final steps of this process before or after removal of sacrificial spacer 40.
In the above described steps, variations are possible, both in the nature of the deposited patterns and materials, and in their ordering. For example, the pre-metalization layer 80 may be deposited in the desired locations by conventional thin-film lithography patterning techniques prior to deposition of the thick resist layer 60, or may be deposited by other metalization techniques, such as laser or ion beam assisted patterned CVD or by focused ion beam deposition or the like.
However, as noted above, a principal achievement of this process is the formation of thick mechanical structures defined by thick film lithography, namely lithography of layer 60, and this step merits more detailed discussion. FIGS. 4-6 discuss details of exposure and development techniques for achieving a sufficiently well defined pattern in a film this thick.
By way of general background, exposure with a suitable high-definition source of radiation, for example FIB, e-beam or UV, entails a substantial level of absorption of the exposure radiation, that results in underexposure of the lower portions of resist. The absorption coefficient can be quite high, with the illumination level experiencing a substantial drop-off below one micrometer that increases exponentially with depth. For example, at various particular wavelengths in the ultraviolet, different resists may entirely extinguish the exposure radiation within a depth of five to ten micrometers.
When a resist is inadequately exposed or hardened, wet development or baking of the resist can result in substantial swelling or shrinkage that misaligns features, vertically skews the pattern with in-plane shear forces, or cracks the resist.
These problems and others in patterning thick films, whether initially caused or first physically manifested during exposure or during development of the exposed pattern, are greatly reduced by the present invention.
As shown in FIGS. 4A-4D, these problems are addressed in one aspect of the present invention, by a process of building up a thick film pattern by laying down and patterning successive layers of a thinner dry film resist 93a, 93b on a structure similar to FIG. 3B. This metalization layer 80 is not shown in these views for reasons of clarity.
A first layer 93a is deposited and is exposed to delineate the intended masking portions 91a and cavity portions 92a. Then a second layer 93b is placed over layer 93a and it in turn is patterned to form the next layer of masks 91b and cavity 92b (FIG. 4C). After a sufficient number of layers 93a, 93b . . . 93n are deposited and patterned, the resist is developed, removing the unexposed regions 92a, 92b . . . 92n. Alternatively as shown in FIG. 4E, each dry film layer may be developed immediately after it is exposed, so that each successive layer 93i is draped over the pre-existing cavity formed by patterning and partial removal of the previously developed layers 93a . . . 93i. Using this latter approach, the initial stage of which is illustrated in FIG. 4E, the already patterned and developed regions may serve as dimensionally stable anchor regions that limit the ability of succeeding layers to shift under the swelling or shrinking that occurs in patterning each later layer. FIG. 4E is a view corresponding to the stage shown in FIG. 4C, wherein a second film layer has been applied and exposed, but not developed, over an already exposed and developed first film layer.
Using either of these sequences, the final multi-layer film is a fully developed film 95 (FIG. 4D) of great thickness comparable to resist step 60 of FIG. 3D, developed throughout its depth and patterned with micrometer-scale definition.
In accordance with another implementation of the invention, a thick cap structure 30 is formed with similar resolution and fidelity by imposing a thermal gradient during one or more of the patterning steps extending through the thickness dimension of a thick resist film.
FIG. 5 shows one apparatus for patterning according the this aspect of the invention. The wafer 1, on which a thick, e.g., fifty to one hundred fifty micrometer thick, resist film has been applied, is placed on a stage 100 through which a heating device 110 applies heat to raise the temperature thereof non-uniformly, by applying heat to one side of the substrate.
Optionally, cooling means, indicated in phantom by 120 is applied in contact with the top surface of the wafer to cause an enhanced thermal gradient to exist between the top and bottom of the resist. Once the thermal gradient is established, the exposure source 130 is energized to expose the wafer in the desired pattern.
By way of example, the cooling may be implemented by circulating a cooling fluid over the surface of the wafer, or, if for example an x-ray type contact mask is used for exposure, by placing a radiation-transparent cooled cell over the wafer and mask.
Alternatively, the gradient may be introduced as a transient phenomenon by intermittently energizing for a short pulse of a few milliseconds or less a heater, such as a ribbon heater, that raises the temperature at the bottom of the wafer by a substantial amount, e.g 50� C. or more. This creates a thermal pulse that travels toward the surface of the film. After the heater is actuated, and when the depths of the film experience a substantial thermal rise, the exposure source is energized, so that exposure illumination reaches the lower region of the resist layer at a time when that region is appreciably hotter than the surface, causing a many-fold increase in exposure activity, compared to the effect at the still-cool surface region. Once the wafer has returned to an equilibrium temperature, additional synchronized heating and exposure pulses are applied to yield a full exposure dose at all levels of the film.
FIGS. 6A-6C show exposure apparatus for yet another their practice of the invention, wherein patterning of a thick film is carried out to alter the exposure at depth in such a way as to faithfully reproduce a deeply patterned topography.
In this aspect, wafer 1 is mounted on a stage 100 and the resist is exposed preferably through a pattern-defining mask 104 to a source of radiation 130. FIG. 6A illustrates an exposed region 1a of the resist and non-exposed regions 1b, the varying density of shading in the region 1a indicating a drop-off in exposure intensity with depth. This situation corresponds to the prior art exposure configuration, if it were applied to a thick resist, and illustrates the non-uniformity of exposure characteristic of that approach.
However, in accordance with this aspect of the invention, the exposure angle is changed to carry out the additional exposure as shown in FIG. 6B. The additional exposure is effected by non-normal illumination, e.g., by relative positioning of the substrate and exposure source 130 offset from each other, or exposing with oblique light rays.
In FIG. 6B this is shown by illustrating in phantom different exposure sources 130a, 130b, or the same source at different locations denoted by 130a, 130b at two different times. Such exposure may be obtained, for example, by rotating the source about an axis normal to the plane of the wafer. With this off-axis illumination, each opening in the mask is imaged as an oblique or conical column, so the source throws a penumbra-shaped flare region at the edges of the column below each surface opening of the mask. The result is an exposed wafer wherein exposure extends downwardly from the surface in a conical volume of partially-exposed resist so that the cross-section of the exposed area increases with depth precisely as the intensity of exposure becomes less. The Figure illustrates the form of the exposed region for a simple pattern opening.
This pattern, when developed, retains a sharper delineation below the surface pattern edge and resists undercutting or erosion with depth.
The penumbral or conical illumination pattern may also be obtained by rotating an obliquely oriented exposure beam apparatus about the wafer, or by putting the wafer on a stage that is slanted with respect to the axis of the exposure beam and rotating the stage. Alternatively, an annular lamp centered over the wafer, or a continuous region extended exposure source may be used for exposure.
Another way to achieve such a conical semi-exposed volume in the patterned resist is to provide a plurality of point illumination sources 131a, 131b . . . 131n at fixed locations as illustrated in FIG. 6C to illuminate obliquely through the pattern openings. In any of these exposure set ups, the essential result is to expose a deep film to a pattern from a plurality of different exposure directions to create a conical region of decreasing exposure and increasing size with depth such that it develops to a well defined pattern. Thus, the invention contemplates a large area of partially-exposed resist, that is partially-developed, with the competing hardening and solvation or etch processes yielding deep patterns of enhanced precision.
With this latter embodiment, a vertical pattern edge is not generally achieved, since that would require precisely balancing effects of the highly unrelated illumination and exposure reactions and the etch or solvent mechanics of the development steps. Advantageously, however, this form of exposure readily produces a metallized cap structure of enhanced form, e.g., having a downwardly-thickening wall as shown in detail 31a of FIG. 7. Compared with the straight pattern structure illustrated in FIG. 3A, this embodiment wherein the support posts widen out toward their periphery, produces a better-anchored thick metal structure of enhanced resistance to peel-off under extreme overpressure conditions.
This completes a description of the thick film lithography of the present invention for forming a macrostructural element in a representative device. It will be understood that such description is intended as illustrative, and the invention may take other forms without departing from the spirit and scope of the practice described herein. Variations and modifications will occur to those skilled in the art, and all such variations and modifications are considered to be within the scope of the invention, as defined by the claims to follow.
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|U.S. Classification
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|International Classification
|Cooperative Classification
|European Classification
|Jun 27, 2003
|Fee payment
Year of fee payment: 4
|Apr 5, 2004
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The Egyptian authorities have just sentenced Kamal Abbas, the highly-respected labour leader to six months in prison for "insulting a public officer".
Sign the LabourStart appeal calling on the Egyptian Authorities to drop the sentence.
TUC General Secretary Brendan Barber has just written to the Egyptian Ambassador to the UK protesting against this gross breach of freedom of expression.
(Kamal Abbas General Co-ordinator of the CTUWS addressing the FBU Conference in Southport in 2011. Photo by Rob Bremner.)
2 March 2012
HE Mr Hatem Seif El Nasr
Embassy of the Arab Republic of Egypt
Dear Ambassador
Sentencing of Kamal Abbas
I was alarmed to hear that Kamal Abbas, the General Coordinator of the Center for Trade Union and Worker Services (CTUWS) has just been sentenced to six months imprisonment for comments he made at the International Labour Organisation (ILO) last year. This is a gross breach of his freedom of expression, and an attempt to silence one of Egypt's most respected labour rights activists. I call on the Egyptian authorities to immediately drop this sentence.
Mr Abbas was sentenced in absentia by a court in Helwan on 26 February 2012 for the supposed crime of 'insulting a public officer'. Mr Abbas had made critical remarks against Ismail Fahmy of the old state-controlled Egyptian Trade Union Federation (ETUF) during his speech at the ILO in June 2011. To jail someone for speaking up on labour rights - and in the ILO no less - would be completely against the spirit of the Arab Spring and will most probably see Egypt return to the ILO's notorious and so-called 'black-list'.
Kamal Abbas is a widely respected labour leader internationally and a close friend of the British trade union movement. Last year he was a guest of honour at the Fire Brigades Union conference in Southport. The TUC, its 55 member unions and the 6 million workers they represent will campaign until this sentence against him is dropped.
I also call on the Egyptian authorities to pass the draft law on trade union freedoms that would guarantee freedom of association and collective bargaining and finally bring Egypt in line with the core conventions of the ILO.
I hope that you can raise these issues as a matter of urgency and I look forward to your reply.
Yours sincerely
General Secretary
Sign the LabourStart appeal calling on the Egyptian Authorities to drop the sentence.
For more information see:
Kamal Abbas, CTUWS general coordinator sentenced to six months imprisonment
Issued: 2 March, 2012


text:
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text:
07 Jul 2014
Banks from the European Union are advised to avoid accounts in virtual currencies such as Bitcoin until a legal framework is in place, according to the European Banking Authority (EBA).
An EBA report says that the risks outweigh the advantages of using virtual currencies.
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The EBA says a regulatory body is required to mitigate these risks, especially since peer-to-peer decentralized virtual currencies such as Bitcoins can be created and decrypted anonymously, with no IT protection for customers.
Until a regime is set up by the European Commission, the EBA "advises national supervisory authorities to discourage credit institutions, payment institutions and e-money institutions from buying, holding, or selling virtual currencies."
As Europe debates risks and threats to the financial system, Canada became the first country to pass legislation on bitcoin usage.


text:
Hi guys!
I made this software to resize images. You can find some algorithms as Lanczos, Catmull-Rom, B-spline, Mitchel-Netravali and GBLS.
GBLS is my own algorithm which works, in my opinion, very good for upsize of 250% or more.
You can find a Demo version and further information at:
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Question about installing new vinyl flooring
Hello forum,
I have a few summer projects that I'm trying to get started on, one of which is replacing the hideous press-on flooring in my kitchen:
As you can see, it's ugly, yellowing, poorly aligned, and cheap. I was planning on replacing it with the Trafficmaster Allure-brand tile I used to do my bathroom floor last fall, because it looks much better, is relatively easy to install, and is in my budget range. I know I could technically just put down the Trafficmaster tiles over this floor, but it would unsettle me to know that this cheap tile was lurking just below the surface of my new floor. Also, it would mess up the alignment with the floors in my bedroom and living room. So I've been pulling up this cheap tile, revealing the original 70's linoleum underneath:
Which, depending on your preference, may or may not be even more garish than the tile covering it. I never knew so many shades of puke green/yellow/brown existed! But anyways. At least it looks like a more uniform and stable surface for the Trafficmaster tile. I've been pulling up the press-on tile and using Goo-Gone to wipe up the layer of sticky adhesive it leaves behind - though this might not be necessary. Anyways, when I was getting near a doorway and pulling up the press-on tile, the entire sheet of old linoleum lifted up too:
There's this black rubbery surface that the original linoleum is resting on, and there doesn't seem to be any glue between that surface and the linoleum above. In case you're wondering, there's no mold or anything there - just dirt between the linoleum and the bottom layer. So I guess after this long buildup, my questions would be this:
1 - Should I put the Trafficmaster tile down over the old linoleum, or the surface beneath it?
2 - If I should install the Trafficmaster tile over the linoleum, do I have to remove all the adhesive covering the surface of the linoleum first? I can, but it's kind of a hassle, which is why I thought I would ask someone first.
Thanks in advance for your help!
Leave the adhesive on top. You could cut/slice the linoleum into manageable strips using a utility knife and peel it up accordingly.:)
If you are worried about the "allure" sticking to the adhesive, sprinkle talc-based baby powder on it. It will kill the sticky. Don't used the corn starch type, it will draw bugs.
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Five Arrested in Orleans County on Drug Charges
There are 79 comments on the RochesterHomepage.net story from Apr 3, 2012, titled Five Arrested in Orleans County on Drug Charges. In it, RochesterHomepage.net reports that:
Five were arrested in Orleans County today after a two month investigation into the sale and distribution of prescription narcotics in the village of Medina.
Join the discussion below, or Read more at RochesterHomepage.net.
#1 Apr 16, 2012
The only reason these people got caught is cause Chris Doxey snitched them out
#2 Apr 16, 2012
What are you some little high school kid complaining that somebody "snitched?" What an ass, drug dealers should be snitched on you punk piece of garbage.
#3 Apr 16, 2012
Your momma needs to be snitched on... for scraping her teeth fággot
#4 Apr 17, 2012
HAHA! The "snitch" is the bad guy here? I don't think so. These people put their children out on the street to sell their pills. And they did it with their grandbabies in the house. As far as I'm concerned Mr & Mrs W should be locked up for a very long time. But they won't be. And they'll be right back at it because God forbid they get jobs. I feel sorry for their kids cuz with parents like that they never had a chance. TIME FOR THE TRUTH....."Chris Doxey" is a HERO.
#5 Apr 17, 2012
Chris R.- You should snitch out you ex-mother-in-law for the illegal activity she is invoved in. Yeah- That is Dale L. S.
Since: Sep 08
Location hidden
#6 Apr 17, 2012
Agreed - these morons put their kids' lives on the line for the sake of money. Hope they enjoy at least a few months getting spanked in prison.
On the other hand, it smells like Time For The Truth lost his 24 hr drug connection. Poor thing is going to have to go back to licking empty crack and weed baggies at the park.
#7 Apr 24, 2012
I hope the whole family goes to jail forever!
#8 Apr 24, 2012
Looks like MPD Officer Scott Merritt will be joining them according to WHAM 1180 today. Seemed like a nice kid to bad his DNA is the same as his lame a$$ father Charles "Candyman" Chuck EZ Merritt. He too was a disgrace to the MPD and police. Guess their will be another lanwmowning boy to add to the business.
#9 Apr 24, 2012
It's a orleans county thing, the chief needs to be replaced to. To many under his watch have gone to the dogs. Poor leadership can only be the blame.
#10 Apr 24, 2012
My name is Elmer Fudd, millionare, I own a mansion and a yacht.
United States
#11 Apr 25, 2012
The blind partizan comments, and un-adulterated visions you people are having is consciously so sickening its not even funny. Firstly, in a country and county filled with corruption, and fraudulent activity, all people who agree to tax increases, and dumping money into a war that never will be won, to me, is not only "putting our childrens lives at stake", but is destroying any progress that actually can be made. If your job didnt revolve around bringing drug addicts down, then you would feel different. What sickens me more, is i see in the paper that a man gets his bail set at 5,000 dollars who beat his wife into a bloody oblivion, yet people who indulge drugs into their own personal body, which constitutionally is their own sacred and personal property, get bail for 10,000 and 50,000 dollars for what actually is a self inflicting health issue. You say that these drugs harm people? Well go to the top. Its the Federal GOVERNMENT which is releasing these drugs and controlling them to the public. If you make pain medication thats opium based, PEOPLE KNOW WHAT
OPIUM IS, OFCOURSE their is going to be a market for is. Secondly, once you take the pills off the streets, THE JUNKIES ARE JUST going to move to HEROIN, a substance not sinthetic, which can be cut with anything. THE PEOPLE WONT EVEN KNOW WHAT THEIR PUTTING INTO THEIR BODY. All the little pill dealers who are in the fabric of nothingness in the grand pyramid scheme of society, have been taking the little crums in a society based off of social and economic enslavement, and class driven warfare, AWAY FROM TERRORISTS who are making the HEROIN in the middle east. You have such blind ego maniacle logic when addressing drug users. You dont even realize the "Pain medication" that your aknowledging, probably HALF or more of all the people you know obtain them LEGALLY, does that make them a Junkie? Also, what about people who because jobs are almost non existant in a economically depressed area like this, that cannot afford health insurance premiums because of how high they are sky rocketing, that actually need the medicine, but have to illegally obtain it to self medicate? If you knew the network of people who legally obtained these drugs and used them that were your friends, you would realize that the pain of being alive in itself, realizing that every minute your alive your dying, in a system were our freedoms and the very self respect of a people is being taken away, would make ANYONE want to induce some sort of feeling to make them NOT think about it for even 5 minutes. The founders of this Nation would be rolling in their grave if they seen what it had become, and just how much the government has infiltrated our lifes, and through socio economic manupulation, indoctrinated a whole generation into its own self enslavement, and created the division of people based off of skin color, your wage, your family name, your location, if you use drugs, how old you are, and many other things which are completely and 100% true. If we all were on the same page, and if the government would Leave us alone, we would go back to the founding principles. I leave you off with this. WHAT DID PROHIBITION CREATE???!??!? It literally created and manifested organized crime. DEATH, DESTRUCTION, and EVIL is the manifestation of prohibiting anything. What happened when prohibition stopped? THE MOBS HOLD and the gansters hold on everything collapsed, and the government made a killing in profits off taxing alcohol. I rest my case.
#12 Apr 25, 2012
Try to remember that Scott has two little boys that will be affected by this forever, and they are innocent in all of this. He made horrible choices and decisions, but to bash him and his dad when all the facts have not come out yet seems a little messed up to me. What happen innocent until proven guilty........
#13 Apr 25, 2012
Perhaps Scott should have thought about his little boys before doing his dirty deed. Cant feel sorry for him. My two little girls lives were ransacked by a Corrupt District Attorney and a couple of rouge State troopers in Orleans County and we did nothing to deserve it. Im just waiting for one of these cops that get busted to turn the tables on the rest of the corrupt ones.
#14 Apr 25, 2012
I STRONGLY believe that the district attorney is corrupt!!!! Medina is not known for very "good" cops that is for sure, but like I said before, this is all hear say at this time and the Media loves to create stories.......just saying when all of this is said and done, I think alot of people will owe him an apology!
#15 Apr 25, 2012
I know the Orleans County DA is corrupt.
#16 Apr 25, 2012
When all of this is said and done he might be in even more trouble. I wish I didn't know for a fact that he really did do this, but I do know it for a fact.
#17 Apr 25, 2012
Please post your proof. Right here. On this forum. Today.
#18 Apr 25, 2012
Gee do ya think? Joe Cardone will have to be buried in a pretzel shaped coffin because he is that crooked. Amazing that a known felon can commit crimes that they are caught for and walk away with nothing to speak of. Said felon had enough against them to get 3 to 6 years had Cardone done his job. The case was watered down and given to the local jurisdiction instead of being held in county court. After all the legal asskissing and handjobbing was done the sentence was 4 weekends in jail with 3 suspended for time served at the time of arrest. The puke arrested is also on the state sex offender registry and a dope dealer that sells pain pills. This fine upstanding human is well known to the cops in several counties but seems to have their way around the courts as they are a snitch for bigger fish.
#19 Apr 25, 2012
To Sam talking shit about Scott and his dad, your better off just stop talking because that's rude, no matter what you know or heard.Chuck and Scott are both good guys, everyone makes mistakes. Thats none of your bussiness,You guys will all see what really happened when this is all done with, His kids are to young to even know whats going on right now.People sit there and run their mouth not knowing the story, well the story is scott was a close friend of the girl in the house anything we talked about stayed between him and her and not the family. If he would have warned Shawn(which is being accused of), he wouldnt have been there the morning it all happened! You guys think he did wrong, well it's just like you guys having a cop friend but having a family member in trouble and not saying anything because he was close with someone in that family.. He was a good person and so is his dad so if you dont know what really happened you should close your mouth till you find out, and chris doxie was NOT invovled in anything. He hasnt been around the family in 5 years, His name is daniel cooke.I'm sorry for jumping in i'm just letting you guys know whats really going on. But Sam you should'nt be talking about Scott nor his father the way you judt did, it will catch up to you. It's also veryy rude.
#20 Apr 25, 2012
The people who know him and have had dealings with him know how corrupt he is. Its the old "apples dont fall to far from the tree syndrome" with him. Instead of me proving that he and half the cops in this county are corrupt, just tell him to sue me if Im wrong. I've been very vocal for years about him and his buddies. I even sat with him and one of his buddies last month and neither of them were man enough to admit any wrong doing.
Or heres another choice... email me and lets meet up. I'll show ya what I got. Of course we both know that wont happen....
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Prosecutor looks at explicit details of Carmel case
Sandra Chapman/Eyewitness News
Carmel - A new prosecutor has a new look at explicit details in the investigation of Carmel High School basketball players. Some of the specifics of what allegedly happened on a school bus after a basketball game are very detailed and not appropriate for children.
In announcing the misdemeanor indictments against four Carmel basketball players last May, Hamilton County Prosecutor Sonja Leerkamp made it clear at least two of the charges would fall under a different jurisdiction.
"So the Class B misdemeanors will be transferred to Hendricks County. That's where the proper venue is," Leerkamp told a room full of reporters.
For five months, the Carmel bus assault charges sat dormant in Hamilton County. Finally, last Thursday, the ball was passed to Hendricks County Prosecutor Pat Baldwin's court.
The big question now, will she rubber stamp the grand jury misdemeanor indictments as she indicated back in May?
"Prosecutors certainly have the option of doing whatever, they don't necessarily have to follow the grand jury. I intend to," Baldwin said at that time, in response to questions about increasing the charges to felonies.
But Baldwin tells 13 Investigates there's still work to be done and it may be next week before she makes her move, one she knows could stir the court of public opinion. She was there when 57 witnesses testified and has seen the time-stamped bus video where Robert Kitzinger and Brandon Hoge are accused of holding down and assaulting a freshman on the back of a team bus as it drove through Hendricks County.
"When a school bus is traveling down the road in the middle of the night, it's dark," Baldwin said when the initial charges were filed in Hamilton County.
But 13 Investigates has since learned from a report from Child Protective Services that at least one of the suspects is seen in the act. That CPS report, released by the victim's parents, provided explicit details about what happened that night.
A family case manager conducting the investigation writes, "It was reported that Brandon Hoge is seen, in the video, sticking his fingers inside (the victim's) buttocks. DCS is awaiting a hard copy of the video for the file."
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Brandon Hoge was never interviewed. According to the report, his attorney declined, even though he knew a determination would be made without a word from Hoge.
The CPS investigation concluded "CRIMINAL DEVIATE CONDUCT...SUBSTANTIATED..." against all four Carmel basketball players.
Hoge, Kitzinger, Oscar Falodun and Scott Laskowski all face misdemeanor charges in Hamilton County in connection with locker room assaults. The release of that explicit CPS report prompted a judge to limit public comment by attorneys on the case.


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I've spent a lot of time recently playing with expensive digital SLRs and high-end luxury compacts, so today I thought I'd take a look at the other end of the market, with a budget camera costing under £90. The Casio Exilim EX-Z33 is a new 10.1-megapixel ultra-compact with a 3x zoom lens and a 2.5-inch 230k LCD monitor. It has a pretty basic spec with minimal features, but if you're on a tight budget (and aren't we all these days?) it's enough for basic snapshots.
Most of the big manufacturers produce cameras in a range of prices and differing levels of sophistication and quality, which means that one model has to be the bottom of the range, and the Z33 is at the bottom of Casio's. Casio is one of the longest-established digital camera makers, launching its first model in 1996, and currently makes some excellent ultra-compact cameras, such as the EX-S12 and the EX-H10, as well as some advanced high-speed cameras, including the EX-F1 and EX-FH20 super-zoom models, and the EX-FC100 advanced ultra-compact. The EX-Z33 is may be at the other end of the scale from these cameras, but it still shares one or two features with its more high-tech siblings.
Casio has not tried to make the Z33 look like something it's not. The body design is as basic as the specification, a plain plastic case with an aluminium fascia and very simple controls. It's a very light camera weighing just 122g including battery and memory card, and measuring only 94.1 x 56.1 x 18.1mm it's slim enough to slip into a shirt pocket. Although it lacks any frills the build quality is good and the camera feels surprisingly solid considering its weight. The Z33 is available in a range of colours including silver, black, blue and two shades of pink.
Casio Exilim EX-Z33 10.1mp Digital Camera$24.00 View Item
Casio EXILIM ZOOM EX-Z33 10.1 MP Digital Camera~Black~Battery~256MB Memory Card$19.99 View Item
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More information -
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On of the great things about being a Digital Communications blogger is that there's always something new to write about. I'd like to say that the "Basics" never change in communications, and maybe they don't. But, things change quickly in this field, and what was a new concept maybe a year ago, is now simply a requirement of keeping up with this world. Here's a few examples:
OLD BASIC – You've Got To Have a Website
That's very true. Websites are a given now. In fact in the United States, many people simply don't think of you as being legit without one. But, the kind of website you have makes a difference too. Having some sort of Blog component that is updated regularly is also essential for a couple of reasons. The first is fresh content will keep folks coming back to your site to see what's new. But secondly and more importantly, fresh, relative content also helps with SEO (you know that Google/Bing/Yahoo thing) that will keep your site relevant in web searches.
OLD BASIC – A Picture is Worth A Thousand Words
As a writer, I can say this is 100% true. As a Digital Communications Specialist however, I'm here to tell you that pictures are not enough. First, let's talk Meta Data. Did you know that the Internet is blind? That's right. It can only see what you tell it to see, and the way it does that is through Meta Data. Meta Data is the background information that you add to media, you know, pictures and videos. It usually consists of the file name, a title, a description and maybe a caption. If you do not tell the, ever so wise, Internet what you're putting out there, it will have no idea, and thus your media will not be findable.
Now, besides the Meta Data, actual content is not a crime. Now I know in this age of all things pictures thanks to sites like Instagram and Pinterest, it's easy to think that the picture is enough. But, if you are trying to reach a wider audience, always be sure to write a caption or some sort of description to go with your images. Ultimately what you want is a hook that will entice the view to want to know more, click the pic, and go to your website.
OLD BASIC – Everyone is on Facebook
It does seem that way, doesn't it? In a matter of 5 short years, Facebook is as ubiquitous as the internet itself. So, yes having a Facebook page is super important. But even more important is keeping it updated. Once a day is great if you can hack it, but do more than simply posting a pic. Use Facebook as an opportunity to tell an ongoing story. The whole point of Facebook, besides massive data collection, is to share things with your friends. If you are using Facebook for a business or project think of that audience as your friends as well. Keep them up to date with what you are working on, what excites you about your work, about the process. A friend of mine who recently started a flower business does a great job of this. Take a look at what she is doing and see how that might work for you.
OLD BASIC – You Must Be on Social Media
Of course you must be on Social Media, but maybe not all of it. There area literally thousands upon thousands of options for your Social Media time investment. While Facebook, I'm sorry to say, is a given, choose your other Social Media outlets wisely. Consider who your audience is and where they spend their time. Then cross post. If you have a Pinterest, cross post some items to Facebook, to let people know you're there. The same can be said for Tumblr or Instagram and don't forget your Meta Data here too!
There's more to all of this of course: message, engagement, and the all important click count. This is just a start of things I will discuss here that are simply now the New Basics.


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SANTA CRUZ >> Police arrested a 27-year-old Watsonville man Friday afternoon after he allegedly broke into the home of a woman he had been dating, beat her and threatened to kill her with a kitchen knife, Santa Cruz police said.
Friday morning, Alberto Scalant broke into the home of a 26-year-old Santa Cruz resident while she slept, Lt. Dan Flippo said.
When the victim questioned why Scalant was in her home, he assaulted her and prevented her from leaving the home for about an hour, Flippo said.
The man was upset because the victim was in the process of breaking off their relationship, Flippo said.
During the attack, Scalant allegedly threatened to kill the victim with a kitchen knife, Flippo said. The victim was able to convince Scalant to stop the assault and he left.
Scalant was arrested at his work later Friday on suspicion of domestic violence, false imprisonment and death threats, all felonies. He was booked into Santa Cruz County Jail and is being held in lieu of $300,000 bail.
While the victim suffered multiple bruises, she did not need medical care, Flippo said.
Santa Cruz police urge anyone affected by domestic violence to visit the police department's website, www.santacruzpolice.com, for resources.