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Tealridge Retirement Community
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Reviews of Tealridge Retirement Community
Caring102990450 April 07, 2015
I visited this facility
I appreciated Tealridge here in Edmond because of its location and its availability. It is near my family. The staff treated us very nicely, and they are very helpful. It is just very nicely laid out. It is clean, bright, homey, and cheerful.
Caring102621250 February 22, 2015
I am a friend or relative of a resident
My mom has been at Tealridge Retirement since 2008. I am very satisfied with the very congenial facility. The staff is very caring. They are not accepting new residents as they are converting it to senior housing. The rooms are a little bit on the small side. It's one of the older facilities, but I don't say it's rundown.
nmccoin February 21, 2015
I am a friend or relative of resident
My mother is a current resident at Tealridge Assisted Living Center. Our family could not be happier with the care she is receiving. The staff is always accomodating, cheerful, kind and are very knowledgeable about the needs of the elderly. The meals are great. Also, the monthly rent is all inclusive with the exception of phone and salon costs. Thumbs up!
Caring91457350 August 27, 2014
I am a friend or relative of a resident
My mom is very happy at Tealridge Retirement. They are doing a great job, and we are very pleased. The staff is just great. They are very attentive and very good natured, and she feels very comfortable with them. The food looks really, really good. At 97, not much of anything tastes good very often, but she eats well and is doing really well. They have her eat more often than she really wants to, but she goes and eats what she wants and is very comfortable with it. We just think it is an excellent place. I have been to others, and I really like this one.
Lisa70368650 December 25, 2013
I am a friend or relative of a resident
My father stayed at Tealridge Assisted Living. We liked that it was a Christian-based facility and they had Bible study. The staff were very good and they were nice to him. They provided three meals a day and gave his medicines. He had a microwave and refrigerator in his room, there was no kitchen. The carpet though was not that great. He complained that the food was not always hot when they brought it and they did not have enough activities for people that could not see like him. It needed some improvement especially with the activities for the blind. But if he was not blind, I thought he would enjoy it. Overall, I thought that he liked the place.
caring0627513 July 26, 2013
I visited this facility
Me and my wife made a decision to choose Tealridge and we are in the process of making the move. There were so many advantages of the place. One, it's a Christian community and we were pleased with the relationship that it has with the University there which is right next to the campus. We totally enjoyed the people that were there.
Caring2810 June 26, 2013
I visited this facility
My mother-in-law has just moved in to TealRidge assisted Living. It seems like a nice facility and their staff seems terrific and knowledgeable
caring010620 June 25, 2013
I visited this facility
I liked Tealridge. They don't charge extra for nursing care. There is a flat fee and you know exactly what you're going to pay. Their rooms were nice and a decent size. However, they couldn't accommodate my dad. My dad has bladder cancer and he needs a catheter. They couldn't accommodate certain things like catheters. Also, if you have any bowel problems, they couldn't accommodate you. That was a disappointment.
caring9632 May 16, 2013
I am/was a resident of this facility
My husband and I are in the Tealridge assisted living, and we like it here. We chose this place because it is convenient for us; we know the neighborhood, and a lot of people here. We have a one-bedroom apartment that has plenty of room for two people. They could have more entertainment, but we are happy and we're going to stay here.
BarbaraB December 08, 2012
I am a current client of this provider
My parents are both in Teal Ridge Retirement Community. It's been wonderful. The staff is very, very accommodating. The food is wonderful; it doesn't look like institutional food at all. The facility is really nice. They have a nice floor-to-ceiling bay window that looks out over trees and a pond. It's a homey environment.
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About Tealridge Retirement Community
Tealridge Retirement Community is an assisted living facility in Edmond, OK that offers residents independent living options and daily support services. Contact Tealridge Retirement Community for more details on housing, services, and rates.
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Last name, first name & patronymic of the General Director
List of founders
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Authorized capital
NEOKOR, ZAO (Kemerovo Oblast; INN 4205026550) was registered on 13 Nov 2002. The company's authorized capital as of July 1, 2012 was 4100000 rub.
Type of ownership of NEOKOR, ZAO - Closed joint-stock companies.
Form of ownership of NEOKOR, ZAO - Private property.
Principal activities of NEOKOR, ZAO: manufacture of medical and surgical equipment and orthopedic appliances (33.10), wholesale of medical devices and orthopaedic products (51.46.2), retail trade of medical and orthopaedic goods (52.32).
Net profit (RAS) of NEOKOR, ZAO dropped in 2014 by 16.67% to 4.67 million RUB from 5.60 million RUB over the same period in 2013, the company informed.
Revenue increased in the accounting period by 33.91% to 54.97 million RUB from 41.05 million RUB over 2013; cost of goods sold grew by 30.17% to 36.95 million RUB from 28.38 million RUB; sales profit went up 1.55 times to 9.07 million RUB from 5.84 million RUB.
Net profit (RAS) of NEOKOR, ZAO grew over 2013 3.22 times to 5.61 million RUB from 1.74 million RUB over 2012, the company informed.
Revenue increased in the accounting period by 18.67% to 41.05 million RUB from 34.59 million RUB over 2012; cost of goods sold grew by 32.14% to 28.38 million RUB from 21.48 million RUB; sales profit went up by 31.79% to 5.84 million RUB from 4.43 million RUB.
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About This Activity
This is for PAYMENT ONLY for THREE TIMES A WEEK class. Registrants must ALSO CALL the Instructional Support Office to reserve a day for class either Mondays, Tuesday, Wednesdays OR Thursdays. Organize and jumpstart your homework in a quiet and structured environment with First Presbyterian Day School teachers. Learn good work habits, develop organizational skills, and get individual help as you need it. Participants can choose to drop in for one day or can sign up for multiple. Homework Heroes is only available for when school is in session for full days. Class is not available on half-days or school holidays. If a student needs more individualized one- on-one tutoring please contact the instructional support teachers. Instructors: Carol Sawyer and Beth Martin Location: Center for Student Success, Clark Fine Arts Center
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|Publication number
|Publication type
|Application number
|Publication date
|Nov 25, 2003
|Filing date
|Jun 28, 2002
|Priority date
|Mar 25, 1998
|Fee status
|Also published as
|Publication number
|Kia Silverbrook
|Original Assignee
|Silverbrook Research Pty Ltd
|Export Citation
|BiBTeX, EndNote, RefMan
|Patent Citations (7), Referenced by (19), Classifications (32), Legal Events (8)
|External Links: USPTO, USPTO Assignment, Espacenet
This is a C-I-P application of U.S. Ser. No. 09/112,767 filed on Jul. 10, 1998, now U.S. Pat. No. 6,416,167.
The field of the invention relates to the field of inkjet printing devices and, in particular, discloses an ink jet nozzle assembly that includes a displaceable ink pusher.
Many different types of printing have been invented, a large number of which are presently in use. The known forms of printing have a variety of methods for marking the print media with a relevant marking media. Commonly used forms of printing include offset printing, laser printing and copying devices, dot matrix type impact printers, thermal paper printers, film recorders, thermal wax printers, dye sublimation printers and ink jet printers both of the drop on demand and continuous flow type. Each type of printer has its own advantages and problems when considering cost, speed, quality, reliability, simplicity of construction and operation etc.
In recent years, the field of ink jet printing, wherein each individual pixel of ink is derived from one or more ink nozzles has become increasingly popular primarily due to its inexpensive and versatile nature.
Many different techniques on ink jet printing have been invented. For a survey of the field, reference is made to an article by J Moore, "Non-Impact Printing: Introduction and Historical Perspective", Output Hard Copy Devices, Editors R Dubeck and S Sherr, pages 207-220 (1988).
Ink Jet printers themselves come in many different types. The utilisation of a continuous stream of ink in ink jet printing appears to date back to at least 1929 wherein U.S. Pat. No. 1,941,001 by Hansell discloses a simple form of continuous stream electro-static ink jet printing.
U.S. Pat. No. 3,596,275 by Sweet also discloses a process of a continuous ink jet printing including the step wherein the ink jet stream is modulated by a high frequency electrostatic field so as to cause drop separation. This technique is still utilized by several manufacturers including Elmjet and Scitex
(see also U.S. Pat. No. 3,373,437 by Sweet et al).
Piezoelectric ink jet printers are also one form of commonly utilized ink jet printing device. Piezoelectric systems are disclosed by Kyser et. al. in U.S. Pat. No. 3,946,398 (1970) which utilizes a diaphragm mode of operation, by Zolten in U.S. Pat. No. 3,683,212 (1970) which discloses a squeeze mode of operation of a piezoelectric crystal, Stemme in U.S. Pat. No. 3,747,120 (1972) discloses a bend mode of piezoelectric operation, Howkins in U.S. Pat. No. 4,459,601 discloses a piezoelectric push mode actuation of the ink jet stream and Fischbeck in U.S. Pat. No. 4,584,590 which discloses a shear mode type of piezoelectric transducer element.
Recently, thermal inkjet printing has become an extremely popular form of inkjet printing. The ink jet printing techniques include those disclosed by Endo et al in GB 2007162 (1979) and Vaught et al in U.S. Pat. No. 4,490,728. Both the aforementioned references disclose ink jet printing techniques that rely upon the activation of an electro-thermal actuator which results in the creation of a bubble in a constricted space, such as a nozzle, which thereby causes the ejection of ink from an aperture connected to the confined space onto a relevant print media. Manufacturers such as Canon and Hewlett Packard manufacture printing devices utilizing the electro-thermal actuator.
A particular problem associated with thermal printers is that they are not suitable for pagewidth printheads capable of high definition printing. Such printheads require a very large number of densely packed nozzle arrangements that span a print medium. Applicant submits that operation of a required number of electro-thermal actuators would generate an unacceptable level of heat. This is the primary reason why the Applicant has developed MEMS-based printing technology. Such systems can be fabricated to define printhead chips having a large number of densely packed nozzle arrangements. In particular, Applicant has developed page width printheads that are capable of color printing over 20 pages per minute at resolution finer than 1200 dpi. Applicant has carried out many thousands of simulations in order to achieve an optimal design. In this work, Applicant has found that the ink pusher should move at least 1 micron in order to achieve effective drop ejection. Applicant has also found that certain problems arise with fabrication when an ink pusher is designed to move more than 5 microns. It follows that movement between 1 and 5 microns is most preferable.
As set out above, piezo-electric systems have been developed that act physically on the ink to eject the ink from the nozzle arrangements. In order to achieve ink drop ejection, the ink pusher is required to move through a particular range. Piezo-electric systems that use an ink pusher rely on the deflection of a plate or the like as a result of a force exerted in a direction that is generally at right angles to the direction of drop ejection. Applicant has found that a deflection of at least one micron would require a plate having a cross sectional area in excess of 100 square microns. This requirement precludes the fabrication of a printhead chip having the requisite number and density of nozzle arrangements.
A further problem with piezo-electric systems is that it is difficult to achieve an ink pusher that is capable of more than 100 nanometers of movement. This is largely due to the fact that such systems rely on buckling or deflection to achieve the necessary movement.
When creating a large number of inkjet nozzles which together form a printhead, it is necessary or desirable to ensure that the printhead is of a compact form so as to ensure that the printhead takes up as small a space as possible. Further, it is desirable that any construction of a printhead is as simple as possible and preferably; the number of steps in construction is extremely low, therefore ensuring simplicity of manufacture. Further, preferably each ink ejection nozzle is of a standard size and the ink forces associates with the ejection are regular across the nozzle.
Further, where the ink ejection mechanism is of a mechanical type attached to an actuator device, it is important to ensure that a substantial clearance is provided between an ink ejection nozzle and the surface of the paddle. Unless a large clearance is provided (of the order of 10 microns in the case of a 40 micron nozzle) a number of consequential problems may arise. For example, if a mechanical paddle ejection surface and nozzle chamber walls are too close, insufficient ink will be acted on by the paddle actuator so as to form a drop to be ejected. Further, high pressures and drag is likely to occur where movement of a paddle occurs close to nozzle chamber walls. Further, if the paddle is too close to the nozzle, there is a danger that an unwanted meniscus shape may occur after ejection of an ink drop with the ink meniscus surface attaching to the surface of the paddle.
Further, should the ink ejection mechanism be formed on a silicon wafer type device utilizing standard wafer processing techniques, it is desirable to minimize the thickness of any layer of material when forming the system. Due to differential thermal expansions, it is desirable to ensure each layer is of minimal thickness so as to reduce the likelihood of faults occurring during the fabrication of a printhead system due to thermal stress. Hence, it is desirable to construct a printhead system utilizing thin layers in the construction process.
This invention is based on the fact that the Applicant has achieved a generic MEMS structure that facilitates a particular range of movement of an ink pusher, which can be in the form of a paddle. The advantage of this is set out above.
According to a first aspect of the invention, there is provided an ink jet printhead chip that comprises
a substrate;
drive circuitry positioned in the substrate; and
a plurality of nozzle arrangements positioned on the substrate, each nozzle arrangement comprising
nozzle chamber walls and a roof wall that define a nozzle chamber and an ink ejection port in the roof wall in fluid communication with the nozzle chamber;
an ink pusher that is operatively positioned with respect to the nozzle chamber and is displaceable through a range of between 1 micron and 5 microns to eject ink from the ink ejection port; and
an actuator that is connected to the drive circuitry and the ink pusher to displace the ink pusher on receipt of an electrical signal from the drive circuitry.
Preferably, each ink pusher is displaceable through a range of between 1.5 microns and 3 microns.
The ink jet printhead chip may be the product of a MEMS fabrication technique.
Each ink pusher may be in the form of a paddle member that is positioned in the nozzle chamber to span the nozzle chamber.
Each actuator may include an actuator arm that is fast with the substrate at one end and attached to the paddle member at an opposed end. The actuator arm may incorporate a thermal bend mechanism that is configured to deflect when heated by said electrical signal from the drive circuitry to displace the paddle member. Each thermal bend mechanism may include a portion of the actuator arm that is of a material having a coefficient of thermal expansion which is such that the material is capable of thermal expansion to an extent sufficient to perform work and an electrical heating circuit positioned on said portion of the actuator arm to heat a side of said portion so that said portion experiences differential thermal expansion resulting in deflection of the actuator arm and the displacement of the paddle member.
Alternatively, the roof wall may define the ink pusher. Each actuator may include an actuator arm that is fast with the substrate at one end and attached to the roof wall at an opposed end. The actuator arm may incorporate a thermal bend mechanism that is configured to deflect when heated by said electrical signal from the drive circuitry to displace the roof wall towards the substrate.
The actuator arm may be of a conductive material having a coefficient of thermal expansion that is such that the material is capable of thermal expansion to an extent sufficient to perform work. A portion of the actuator arm may define a heating circuit which is configured to expand thermally on receipt of said electrical signal, said portion of the actuator arm being positioned so that the actuator arm is deflected towards the substrate upon such deflection.
There is disclosed herein an ink jet nozzle assembly including a nozzle chamber containing ink to be ejected and a fluidic seal comprising a meniscus formed by said ink between two solid surfaces of said assembly that move relative to one another when the assembly is activated in use, and wherein at least one of said surfaces has a thin lip adjacent said fluidic seal to hinder wicking of said ink along said at least one surface.
Preferably said lip is less than or equal to about 1 micrometer thick.
There is further disclosed herein an ink jet nozzle assembly including:
a nozzle chamber having an inlet in fluid communication with an ink reservoir and a nozzle in fluid communication with a surrounding atmosphere;
the chamber including a fixed portion, a movable portion and a clearance space therebetween, relative movement between the fixed portion and the movable portion in an ejection phase reducing an effective volume of the chamber, and alternate relative movement in a refill phase enlarging the effective volume of the chamber;
the clearance space containing an ink/air interface, surface tension in ink across a meniscus at the interface forming a fluidic seal between the chamber and the atmosphere; wherein:
the clearance space, the nozzle and the inlet are dimensioned relative to one another such that ink is ejected preferentially form the chamber through the nozzle in droplet form in the ejection phase, and ink is alternately drawn preferentially into the chamber from the reservoir through the inlet in the refill phase without said fluidic seal breaking.
Preferably the chamber incorporates a rim extending outwardly adjacent at least a portion of the fluidic seal and is disposed to minimise wicking of ink from the chamber across the seal.
Preferably the movable portion includes the nozzle and the fixed portion is mounted on a substrate.
Preferably the fixed portion includes the nozzle mounted on a substrate and the movable portion includes an actuator.
Preferably a largest distance between the fixed portion and the movable portion across the clearance space is less than approximately 5 micrometers.
Preferably said distance is less than approximately 3 micrometers. Preferably said distance is less than approximately 1 micrometer.
Preferably said rim extends substantially around a periphery of the fluidic seal, immediately adjacent the clearance space.
Preferably a lower section of the rim includes a ledge portion overhanging a recess adapted to collect any residual ink wicking across the seal.
Preferably an outwardly protruding lip extends around the nozzle to minimise wicking of ink across an outer surface of the nozzle chamber.
Preferably at least one surface adjacent the clearance space includes a hydrophobic coating to enhance performance of the fluidic seal.
Preferably the hydrophobic coating is formed substantially from polytetrafluoroethylene (PTFE).
Preferably the ink jet nozzle assembly is manufactured using micro-electro-mechanical-systems (MEMS) techniques.
Notwithstanding any other forms, which may fall within the scope of the present invention, preferred forms of the invention will now be described, by way of example only, with reference to the accompanying drawings in which:
FIGS. 1-3 are schematic illustrations of the operational principles of the preferred embodiment.
FIG. 4 illustrates a perspective view, partly in section of a single inkjet nozzle of the preferred embodiment.
FIG. 5 is a side perspective view of a single ink jet nozzle of the preferred embodiment.
FIGS. 6-15 illustrate the various manufacturing processing steps in the construction of the preferred embodiment.
FIG. 16 illustrates a portion of an array view of a printhead having a large number of nozzles, each constructed in accordance with the principles of the present invention.
FIG. 17 provides a legend of the materials indicated in FIGS. 18 to 28.
FIG. 18 to FIG. 28 illustrate sectional views of the manufacturing steps in one form of construction of an ink jet printhead nozzle.
FIG. 29 shows a three dimensional, schematic view of a nozzle assembly for an ink jet printhead in accordance with the invention.
FIGS. 30 to 32 show a three dimensional, schematic illustration of an operation of the nozzle assembly of FIG. 29.
FIG. 33 shows a three dimensional view of a nozzle array constituting an ink jet printhead.
FIG. 34 shows, on an enlarged scale, part of the array of FIG. 33.
FIG. 35 shows a three dimensional view of an ink jet printhead including a nozzle guard.
FIGS. 36a to 36 r show three-dimensional views of steps in the manufacture of a nozzle assembly of an ink jet printhead.
FIGS. 37a to 37 r show sectional side views of the manufacturing steps.
FIGS. 38a to 38 k show layouts of masks used in various steps in the manufacturing process.
FIGS. 39a to 39 c show three-dimensional views of an operation of the nozzle assembly manufactured according to the method of FIGS. 36 and 37.
FIGS. 40a to 40 c show sectional side views of an operation of the nozzle assembly manufactured according to the method of FIGS. 36 and 37.
In the preferred embodiment, an inkjet printing system is provided having an ink ejection nozzle arrangement such that a paddle actuator type device is utilized to eject ink from a refillable nozzle chamber. As a result of the construction processes utilized, the paddle is generally of a "cupped" shape. The cup shape provides for the alleviation of a number of the aforementioned problems. The paddle is interconnected to a thermal actuator device, which is thermally actuated by means of passing a current through a portion of the thermal actuator, so as to cause the ejection of ink therefrom. Further, the cupped paddle allows for a suitable construction process that does not require the formation of thick surface layers during the process of construction. This means that thermal stresses across a series of devices constructed on a single wafer are minimized.
Still further, the construction processes are such that the cupped paddle has a range of movement of between 1.5 microns and 3 microns. This ensures efficient drop ejection and an optimum use of chip real estate.
Turning initially to FIGS. 1-3, there will now be explained the operational principles of the preferred embodiment. In FIG. 1 there is illustrated an inkjet nozzle arrangement 1 having a nozzle chamber 2 which is normally filled with ink from a supply channel 3 such that a meniscus 4 forms across the ink ejection aperture of the nozzle arrangement. Inside the nozzle arrangement, a cupped paddle actuator 5 is provided and interconnected to an actuator arm 6 which, when in a quiescent position, is bent downwards. The lower surface of the actuator arm 6 includes a heater element 8 that is constructed of material having a high "bend efficiency".
Preferably, the heater element has a high bend efficiency wherein the bend efficiency is defined as:
A suitable material can be a copper nickel alloy of 60% copper and 40% nickel, hereinafter called (cupronickel) which can be formed below a glass layer so as to bend the glass layer.
In its quiescent position, the arm 6 is bent down by the element 8. When it is desired to eject a droplet of ink from the nozzle chamber 2, a current is passed through the actuator arm 8 by means of an interconnection provided by a post 9. The heater element 8 is heated and expands with a high bend efficiency thereby causing the arm 6 to move upwards as indicated in FIG. 2 an extent of between 1.5 microns and 3 microns. The upward movement of the actuator arm 6 causes the cupped paddle 5 to also move up which results in a general increase in pressure within the nozzle chamber 2 in the area surrounding the meniscus 4. This results in a general outflow of ink and a bulging of the meniscus 4. Next, as indicated in FIG. 3, the heater element 8 is turned off which results in the general return of the arm 6 to its quiescent position which further results in a downward movement of the cupped paddle 5. This results in a general sucking back 11 of the ink within the nozzle chamber 2. The forward momentum of the ink surrounding the meniscus and the backward momentum of the ink results in a general necking of the meniscus and the formation of a drop 12 that proceeds to the surface of the page. Subsequently, the shape of the meniscus 4 results in a subsequent inflow of ink via the inlet channel 3 that results in a refilling of the nozzle chamber 2. Eventually, the state returns to that indicated by FIG. 1.
Turning now to FIG. 4, there is illustrated a side perspective view partly in section of one form of construction, a single nozzle arrangement 1 in greater detail. The nozzle arrangement 1 includes a nozzle chamber 2 that is normally filled with ink. Inside the nozzle chamber 2 is a paddle actuator 5 which divides the nozzle chamber from an ink refill supply channel 3 which supplies ink from a back surface of a silicon wafer 14.
Outside of the nozzle chamber 2 is located an actuator arm 6 which includes a glass core portion and an external cupronickel portion 8. The actuator arm 6 interconnects with the paddle 5 by means of a slot 19 located in one wall of the nozzle chamber 2. The slot 19 is of small dimensions such that surface tension characteristics retain the ink within the nozzle chamber 2. Preferably, the external portions of the arrangement 1 are further treated so as to be strongly hydrophobic. Additionally, a pit 21 is provided around the slot 19. The pit 21 includes a ledge 22 with the pit 21 and ledge 22 interacting so as to minimize the opportunities for "wicking" along the actuator arm 6. Further, to assist of minimizing of wicking, the arm 6 includes a thinned portion 24 adjacent to the nozzle chamber 2 in addition to a right-angled wall 25.
The surface of the paddle actuator 5 includes a slot 12. The slot 12 aids in allowing for the flow of ink from the back surface of paddle actuator 5 to a front surface. This is especially the case when initially the arrangement is filled with air and a liquid is injected into the refill channel 3. The dimensions of the slot are such that, during operation of the paddle for ejecting drops, minimal flow of fluid occurs through the slot 11.
The paddle actuator 5 is housed within the nozzle chamber and is actuated so as to eject ink from the nozzle 27 that in turn includes a rim 28. The rim 28 assists in minimizing wicking across the top of the nozzle chamber 2.
The cupronickel element 8 is interconnected through a post portion 9 to a lower CMOS layer 15 that provides for the electrical control of the actuator element.
Each nozzle arrangement 1 can be constructed as part of an array of nozzles on a silicon wafer device and can be constructed from the utilizing semiconductor processing techniques in addition to micro machining and micro fabrication process technology (MEMS) and a full familiarity with these technologies is hereinafter assumed.
For a general introduction to a micro-electro mechanical system (MEMS) reference is made to standard proceedings in this field including the proceeding of the SPIE (International Society for Optical Engineering) including volumes 2642 and 2882 that contain the proceedings of recent advances and conferences in this field.
Turning initially to FIGS. 6a and 6 b, in FIG. 6b there is shown an initial processing step that utilizes a mask having a region as specified in FIG. 6a. The initial starting material is preferably a silicon wafer 14 having a standard 0.25 micrometer CMOS layer 15 that includes drive electronics (not shown), the structure of the drive on electronics being readily apparent to those skilled in the art of CMOS integrated circuit designs.
The first step in the construction of a single nozzle is to pattern and etch a pit 28 to a depth of 13 micrometers using the mask pattern having regions specified 29 as illustrated in FIG. 6a.
Next, as illustrated in FIG. 7b, a 3 micrometer layer of the sacrificial material 30 is deposited. The sacrificial material can comprise aluminum. The sacrificial material 30 is then etched utilizing a mask pattern having portions 31 and 32 as indicated at FIG. 7a.
Next, as shown in FIG. 8b a very thin 0.1 micrometer layer of a corrosion barrier material (not shown) (for example, silicon nitride) is deposited and subsequently etched so as to form the heater element 35. The etch utilizes a third mask having mask regions specified as 36 and 37 in FIG. 8a.
Next, as shown intended in FIG. 9b, a 1.1 micrometer layer of heater material 39 which can comprise a 60% copper 40% nickel alloy is deposited utilizing a mask having a resultant mask region 40 as illustrated in FIG. 9a.
Next, a 0.1 micrometer corrosion layer is deposited over the surface. The corrosion barrier can again comprise silicon nitride.
Next, as illustrated in FIG. 10b, a 3.4 micrometer layer of glass 42 is deposited. The glass and nitride can then be etched utilizing a mask as specified 43 in FIG. 10a. The glass layer 42 includes, as part of the deposition process, a portion 44 that is a result of the deposition process following the lower surface profile.
Next, a 6 micrometer layer of sacrificial material 45 such as aluminum is deposited as indicated in FIG. 11b. This layer is planarized to approximately 4 micrometer minimum thickness utilizing a Chemical Mechanical Planarization (CMP) process. Next, the sacrificial material layer is etched utilizing a mask having regions 48, 49 as illustrated in FIG. 11a so as to form portions of the nozzle wall and post.
Next, as illustrated in FIG. 12b, a 3 micrometer layer of glass 50 is deposited. The 3 micrometer layer is patterned and etched to a depth of 1 micrometer using a mask having a region specified 51 as illustrated in FIG. 12b so as to form a nozzle rim.
Next, as illustrated in FIG. 13b the glass layer is etched utilizing a further mask as illustrated in FIG. 12a, which leaves glass portions e.g. 53 to form the nozzle chamber wall and post portion 54.
Next, as illustrated in FIG. 14b, the backside of the wafer is patterned and etched so as to form an ink supply channel 3. The mask utilized can have regions 56 as specified in FIG. 14a. The etch through the backside of the wafer can preferably utilize a high quality deep anisotropic etching system such as that available from Silicon Technology Systems of the United Kingdom. Preferably, the etching process also results in the dicing of the wafer into its separate printheads at the same time.
Next, as illustrated in FIG. 15, the sacrificial material can be etched away so as to release the actuator structure. Upon release, the actuator 6 bends downwards due to its release from thermal stresses built up during deposition. The printhead can then be cleaned and mounted in a moulded ink supply system for the supply of ink to the back surface of the wafer. A TAB film for supplying electric control to an edge of the printhead can then be bonded utilizing normal TAB bonding techniques. The surface area can then be hydrophobically treated and finally the ink supply channel and nozzle chamber filled with ink for testing.
Hence, as illustrated in FIG. 16, a pagewidth printhead having a repetitive structure 60 can be constructed for full color printing. FIG. 16 shows a portion of the final printhead structure and includes three separate groupings 61-63 with one grouping for each color and each grouping e.g. 63 in turn consisting of two separate rows of inkjet nozzles 65, 66 which are spaced apart in an interleaved pattern. The nozzle 65, 66 are fired at predetermined times so as to form an output image as would be readily understood by those skilled in the art of construction of inkjet printhead. Each nozzle e.g. 68 includes its own actuator arm 69 which, in order to form an extremely compact arrangement, is preferably formed so as to be generally bent with respect to the line perpendicular to the row of nozzles. Preferably, a three color arrangement is provided which has one of the groups 61-63 dedicated to cyan, magenta and another yellow color printing. Obviously, four-color printing arrangements can be constructed if required.
Preferably, at one side a series of bond pads e.g. 71 are formed along the side for the insertion of a tape automated bonding (TAB) strip which can be aligned by means of alignment rail e.g. 72 which is constructed along one edge of the printhead specifically for this purpose.
One form of detailed manufacturing process which can be used to fabricate monolithic ink jet print heads operating in accordance with the principles taught by the present embodiment can proceed utilizing the following steps:
1. Using a double sided polished wafer 14, complete drive transistors, data distribution, and timing circuits using a 0.5 micron, one poly, 2 metal CMOS process 15. This step is shown in FIG. 18. For clarity, these diagrams may not be to scale, and may not represent a cross section though any single plane of the nozzle. FIG. 17 is a key to representations of various materials in these manufacturing diagrams, and those of other cross-referenced ink jet configurations.
2. Etch oxide down to silicon or aluminum using Mask 1. This mask defines the pit underneath the paddle, as well as the edges of the printheads chip.
3. Etch silicon to a depth of 8 microns 80 using etched oxide as a mask. The sidewall slope of this etch is not critical (60 to 90 degrees is acceptable), so standard trench etchers can be used. This step is shown in FIG. 19.
4. Deposit 3 microns of sacrificial material 81 (e.g. aluminum or polyimide)
5. Etch the sacrificial layer using Mask 3, defining heater vias 82 and nozzle chamber walls 83. This step is shown in FIG. 20.
6. Deposit 0.2 microns of heater material 84, e.g. TiN.
7. Etch the heater material using Mask 3, defining the heater shape. This step is shown in FIG. 21.
8. Wafer probe. All electrical connections are complete at this point, bond pads are accessible, and the chips are not yet separated.
9. Deposit 3 microns of PECVD glass 85.
10. Etch glass layer using Mask 4. This mask defines the nozzle chamber wall, the paddle, and the actuator arm. This step is shown in FIG. 22.
11. Deposit 6 microns of sacrificial material 86.
12. Etch the sacrificial material using Mask 5. This mask defines the nozzle chamber wall. This step is shown in FIG. 23.
13. Deposit 3 microns of PECVD glass 87.
14. Etch to a depth of (approx.) 1 micron using Mask 6. This mask defines the nozzle rim 28. This step is shown in FIG. 24.
15. Etch down to the sacrificial layer using Mask 7. This mask defines the roof of the nozzle chamber, and the nozzle 27 itself. This step is shown in FIG. 25.
16. Back-etch completely through the silicon wafer (with, for example, an ASE Advanced Silicon Etcher from Surface Technology Systems) using Mask 8. This mask defines the ink inlets 3 which are etched through the wafer. The wafer is also diced by this etch. This step is shown in FIG. 26.
17. Etch the sacrificial material. The nozzle chambers are cleared, the actuators freed, and the chips are separated by this etch. This step is shown in FIG. 27.
18. Mount the printheads in their packaging, which may be a molded plastic former incorporating ink channels, which supply the appropriate color ink to the ink inlets at the back of the wafer.
19. Connect the printheads to their interconnect systems. For a low profile connection with minimum disruption of airflow, TAB may be used. Wire bonding may also be used if the printer is to be operated with sufficient clearance to the paper.
20. Hydrophobize the front surface of the printheads.
21. Fill the completed printheads with ink 88 and test them. A filled nozzle is shown in FIG. 28.
Referring now to FIG. 29 of the drawings, a nozzle assembly, in accordance with a further embodiment of the invention is designated generally by the reference numeral 110. An ink jet printhead has a plurality of nozzle assemblies 110 arranged in an array 114 (FIGS. 33 and 34) on a silicon substrate 116. The array 114 will be described in greater detail below.
The assembly 110 includes a silicon substrate or wafer 116 on which a dielectric layer 118 is deposited. A CMOS passivation layer 120 is deposited on the dielectric layer 118.
Each nozzle assembly 110 includes a nozzle 122 defining a nozzle opening 124, a connecting member in the form of a lever arm 126 and an actuator 128. The lever arm 126 connects the actuator 128 to the nozzle 122.
As shown in greater detail in FIGS. 30 to 32 of the drawings, the nozzle 122 comprises a crown portion 130 with a skirt portion 132 depending from the crown portion 130. The skirt portion 132 forms part of a peripheral wall of a nozzle chamber 134 (FIGS. 30 to 32 of the drawings). The nozzle opening 124 is in fluid communication with the nozzle chamber 134. It is to be noted that the nozzle opening 124 is surrounded by a raised rim 136 that "pins" a meniscus 138 (FIG. 30) of a body of ink 140 in the nozzle chamber 134.
An ink inlet aperture 142 (shown most clearly in FIG. 34) is defined in a floor 146 of the nozzle chamber 134. The aperture 142 is in fluid communication with an ink inlet channel 148 defined through the substrate 116.
A wall portion 150 bounds the aperture 142 and extends upwardly from the floor portion 146. The skirt portion 132, as indicated above, of the nozzle 122 defines a first part of a peripheral wall of the nozzle chamber 134 and the wall portion 150 defines a second part of the peripheral wall of the nozzle chamber 134.
The wall 150 has an inwardly directed lip 152 at its free end that serves as a fluidic seal that inhibits the escape of ink when the nozzle 122 is displaced, as will be described in greater detail below. It will be appreciated that, due to the viscosity of the ink 140 and the small dimensions of the spacing between the lip 152 and the skirt portion 132, the inwardly directed lip 152 and surface tension function as a seal for inhibiting the escape of ink from the nozzle chamber 134.
The actuator 128 is a thermal bend actuator and is connected to an anchor 154 extending upwardly from the substrate 116 or, more particularly, from the CMOS passivation layer 120. The anchor 154 is mounted on conductive pads 156 which form an electrical connection with the actuator 128.
The actuator 128 comprises a first, active beam 158 arranged above a second, passive beam 160. In a preferred embodiment, both beams 158 and 160 are of, or include, a conductive ceramic material such as titanium nitride (TiN).
Both beams 158 and 160 have their first ends anchored to the anchor 154 and their opposed ends connected to the arm 126. When a current is caused to flow through the active beam 158 thermal expansion of the beam 158 results. As the passive beam 160, through which there is no current flow, does not expand at the same rate, a bending moment is created causing the arm 126 and, hence, the nozzle 122 to be displaced downwardly through between 1.5 and 3 microns towards the substrate 116 as shown in FIG. 31 of the drawings. This causes an ejection of ink through the nozzle opening 124 as shown at 162 in FIG. 31 of the drawings. When the source of heat is removed from the active beam 158, i.e. by stopping current flow, the nozzle 122 returns to its quiescent position as shown in FIG. 32 of the drawings. When the nozzle 122 returns to its quiescent position, an ink droplet 164 is formed as a result of the breaking of an ink droplet neck as illustrated at 166 in FIG. 32 of the drawings. The ink droplet 164 then travels on to the print media such as a sheet of paper. As a result of the formation of the ink droplet 164, a "negative" meniscus is formed as shown at 168 in FIG. 32 of the drawings. This "negative" meniscus 168 results in an inflow of ink 140 into the nozzle chamber 134 such that a new meniscus 138 (FIG. 30) is formed in readiness for the next ink drop ejection from the nozzle assembly 110.
Referring now to FIGS. 33 and 34 of the drawings, the nozzle array 114 is described in greater detail. The array 114 is for a four-color printhead. Accordingly, the array 114 includes four groups 170 of nozzle assemblies, one for each color. Each group 170 has its nozzle assemblies 110 arranged in two rows 172 and 174. One of the groups 170 is shown in greater detail in FIG. 34 of the drawings.
To facilitate close packing of the nozzle assemblies 110 in the rows 172 and 174, the nozzle assemblies 110 in the row 174 are offset or staggered with respect to the nozzle assemblies 110 in the row 172. Also, the nozzle assemblies 110 in the row 172 are spaced apart sufficiently far from each other to enable the lever arms 126 of the nozzle assemblies 110 in the row 174 to pass between adjacent nozzles 122 of the assemblies 110 in the row 172. It is to be noted that each nozzle assembly 110 is substantially dumbbell shaped so that the nozzles 122 in the row 172 nest between the nozzles 122 and the actuators 128 of adjacent nozzle assemblies 110 in the row 174.
Further, to facilitate close packing of the nozzles 122 in the rows 172 and 174, each nozzle 122 is substantially hexagonally shaped.
It will be appreciated by those skilled in the art that, when the nozzles 122 are displaced towards the substrate 116, in use, due to the nozzle opening 124 being at a slight angle with respect to the nozzle chamber 134 ink is ejected slightly off the perpendicular. It is an advantage of the arrangement shown in FIGS. 33 and 34 of the drawings that the actuators 128 of the nozzle assemblies 110 in the rows 172 and 174 extend in the same direction to one side of the rows 172 and 174. Hence, the ink droplets ejected from the nozzles 122 in the row 172 and the ink droplets ejected from the nozzles 122 in the row 174 are parallel to one another resulting in an improved print quality.
Also, as shown in FIG. 33 of the drawings, the substrate 116 has bond pads 176 arranged thereon which provide the electrical connections, via the pads 156, to the actuators 128 of the nozzle assemblies 110. These electrical connections are formed via the CMOS layer (not shown).
Referring to FIG. 35 of the drawings, a development of the invention is shown. With reference to the previous drawings, like reference numerals refer to like parts, unless otherwise specified.
In this development, a nozzle guard 180 is mounted on the substrate 116 of the array 114. The nozzle guard 180 includes a body member 182 having a plurality of passages 184 defined therethrough. The passages 184 are in register with the nozzle openings 124 of the nozzle assemblies 110 of the array 114 such that, when ink is ejected from any one of the nozzle openings 124, the ink passes through the associated passage 184 before striking the print media.
The body member 182 is mounted in spaced relationship relative to the nozzle assemblies 110 by limbs or struts 186. One of the struts 186 has air inlet openings 188 defined therein.
In use, when the array 114 is in operation, air is charged through the inlet openings 188 to be forced through the passages 184 together with ink travelling through the passages 184.
The ink is not entrained in the air as the air is charged through the passages 184 at a different velocity from that of the ink droplets 164. For example, the ink droplets 164 are ejected from the nozzles 122 at a velocity of approximately 3 m/s. The air is charged through the passages 184 at a velocity of approximately 1 m/s.
The purpose of the air is to maintain the passages 184 clear of foreign particles. A danger exists that these foreign particles, such as dust particles, could fall onto the nozzle assemblies 110 adversely affecting their operation. With the provision of the air inlet openings 88 in the nozzle guard 180 this problem is, to a large extent, obviated.
Referring now to FIGS. 36 to 38 of the drawings, a process for manufacturing the nozzle assemblies 110 is described.
Starting with the silicon substrate or wafer 116, the dielectric layer 118 is deposited on a surface of the wafer 116. The dielectric layer 118 is in the form of approximately 1.5 microns of CVD oxide. Resist is spun on to the layer 118 and the layer 118 is exposed to mask 200 and is subsequently developed.
After being developed, the layer 118 is plasma etched down to the silicon layer 116. The resist is then stripped and the layer 118 is cleaned. This step defines the ink inlet aperture 142.
In FIG. 36b of the drawings, approximately 0.8 microns of aluminum 202 is deposited on the layer 118. Resist is spun on and the aluminum 202 is exposed to mask 204 and developed. The aluminum 202 is plasma etched down to the oxide layer 118, the resist is stripped and the device is cleaned. This step provides the bond pads and interconnects to the ink jet actuator 128. This interconnect is to an NMOS drive transistor and a power plane with connections made in the CMOS layer (not shown).
Approximately 0.5 microns of PECVD nitride is deposited as the CMOS passivation layer 120. Resist is spun on and the layer 120 is exposed to mask 206 whereafter it is developed. After development, the nitride is plasma etched down to the aluminum layer 202 and the silicon layer 116 in the region of the inlet aperture 142. The resist is stripped and the device cleaned.
A layer 208 of a sacrificial material is spun on to the layer 120. The layer 208 is 6 microns of photosensitive polyimide or approximately 4 microns of high temperature resist. The layer 208 is softbaked and is then exposed to mask 210 whereafter it is developed. The layer 208 is then hardbaked at 400� C. for one hour where the layer 208 is comprised of polyimide or at greater than 300� C. where the layer 208 is high temperature resist. It is to be noted in the drawings that the pattern-dependent distortion of the polyimide layer 208 caused by shrinkage is taken into account in the design of the mask 210.
In the next step, shown in FIG. 36e of the drawings, a second sacrificial layer 212 is applied. The layer 212 is either 2 microns of photosensitive polyimide that is spun on or approximately 1.3 microns of high temperature resist. The layer 212 is softbaked and exposed to mask 214. After exposure to the mask 214, the layer 212 is developed. In the case of the layer 212 being polyimide, the layer 212 is hardbaked at 400� C. for approximately one hour. Where the layer 212 is resist, it is hardbaked at greater than 300� C. for approximately one hour.
A 0.2 micron multi-layer metal layer 216 is then deposited. Part of this layer 216 forms the passive beam 160 of the actuator 128.
The layer 216 is formed by sputtering 1,000 Angstroms of titanium nitride (TiN) at around 300� C. followed by sputtering 50 Angstroms of tantalum nitride (TaN). A further 1,000 Angstroms of TiN is sputtered on followed by 50 Angstroms of TaN and a further 1,000 Angstroms of TiN.
Other materials that can be used instead of TiN are TiB2, MoSi2 or (Ti, Al)N.
The layer 216 is then exposed to mask 218, developed and plasma etched down to the layer 212 whereafter resist, applied for the layer 216, is wet stripped taking care not to remove the cured layers 208 or 212.
A third sacrificial layer 220 is applied by spinning on 4 microns of photosensitive polyimide or approximately 2.6 microns high temperature resist. The layer 220 is softbaked whereafter it is exposed to mask 222. The exposed layer is then developed followed by hardbaking. In the case of polyimide, the layer 220 is hardbaked at 400� C. for approximately one hour or at greater than 300� C. where the layer 220 comprises resist.
A second multi-layer metal layer 224 is applied to the layer 220. The constituents of the layer 224 are the same as the layer 216 and are applied in the same manner. It will be appreciated that both layers 216 and 224 are electrically conductive layers.
The layer 224 is exposed to mask 226 and is then developed. The layer 224 is plasma etched down to the polyimide or resist layer 220 whereafter resist applied for the layer 224 is wet stripped taking care not to remove the cured layers 208, 212 or 220. It will be noted that the remaining part of the layer 224 defines the active beam 158 of the actuator 128.
A fourth sacrificial layer 228 is applied by spinning on 4 microns of photosensitive polyimide or approximately 2.6 microns of high temperature resist. The layer 228 is softbaked, exposed to the mask 230 and is then developed to leave the island portions as shown in FIG. 9k of the drawings. The remaining portions of the layer 228 are hardbaked at 400� C. for approximately one hour in the case of polyimide or at greater than 300� C. for resist.
As shown in FIG. 361 of the drawing a high Young's modulus dielectric layer 232 is deposited. The layer 232 is constituted by approximately 1 micron of silicon nitride or aluminum oxide. The layer 232 is deposited at a temperature below the hardbaked temperature of the sacrificial layers 208, 212, 220, 228. The primary characteristics required for this dielectric layer 232 are a high elastic modulus, chemical inertness and good adhesion to TiN.
A fifth sacrificial layer 234 is applied by spinning on 2 microns of photosensitive polyimide or approximately 1.3 microns of high temperature resist. The layer 234 is softbaked, exposed to mask 236 and developed. The remaining portion of the layer 234 is then hardbaked at 400� C. for one hour in the case of the polyimide or at greater than 300� C. for the resist.
The dielectric layer 232 is plasma etched down to the sacrificial layer 228 taking care not to remove any of the sacrificial layer 234.
This step defines the nozzle opening 124, the lever arm 126 and the anchor 154 of the nozzle assembly 110.
A high Young's modulus dielectric layer 238 is deposited. This layer 238 is formed by depositing 0.2 microns of silicon nitride or aluminum nitride at a temperature below the hardbaked temperature of the sacrificial layers 208, 212, 220 and 228.
Then, as shown in FIG. 36p of the drawings, the layer 238 is anisotropically plasma etched to a depth of 0.35 microns. This etch is intended to clear the dielectric from the entire surface except the side walls of the dielectric layer 232 and the sacrificial layer 234. This step creates the nozzle rim 136 around the nozzle opening 124 that "pins" the meniscus of ink, as described above.
An ultraviolet (UV) release tape 240 is applied. 4 microns of resist is spun on to a rear of the silicon wafer 116. The wafer 116 is exposed to mask 242 to back etch the wafer 116 to define the ink inlet channel 148. The resist is then stripped from the wafer 116.
A further UV release tape (not shown) is applied to a rear of the wafer 16 and the tape 240 is removed. The sacrificial layers 208, 212, 220, 228 and 234 are stripped in oxygen plasma to provide the final nozzle assembly 110 as shown in FIGS. 36r and 37 r of the drawings. For ease of reference, the reference numerals illustrated in these two drawings are the same as those in FIG. 29 of the drawings to indicate the relevant parts of the nozzle assembly 110. FIGS. 39 and 40 show the operation of the nozzle assembly 110, manufactured in accordance with the process described above with reference to FIGS. 36 and 37, and these figures correspond to FIGS. 29 to 32 of the drawings.
The presently disclosed ink jet printing technology is potentially suited to a wide range of printing system including: color and monochrome office printers, short run digital printers, high speed digital printers, offset press supplemental printers, low cost scanning printers high speed pagewidth printers, notebook computers with inbuilt pagewidth printers, portable color and monochrome printers, color and monochrome copiers, color and monochrome facsimile machines, combined printer, facsimile and copying machines, label printers, large format plotters, photograph copiers, printers for digital photographic "minilabs", video printers, portable printers for PDAs, wallpaper printers, indoor sign printers, billboard printers, fabric printers, camera printers and fault tolerant commercial printer arrays.
The fully formed printhead being able to be utilized in a wide range of printing systems.
It would be appreciated by a person skilled in the art that numerous variations and/or modifications may be made to the present invention as shown in the specific embodiment without departing from the spirit or scope of the invention as broadly described. The present embodiment is, therefore, to be considered in all respects to be illustrative and not restrictive.
|Cited Patent
|Filing date
|Publication date
|Mar 31, 1995
|Nov 4, 1997
|Sharp Kabushiki Kaisha
|Ink jet head with buckling structure body
|Jul 22, 1996
|Sep 22, 1998
|Eastman Kodak Company
|Ink printing apparatus with improved heater
|Jul 23, 1999
|Jan 16, 2001
|Canon Kabushiki Kaisha
|Liquid ejection head with a heat generating surface that is substantially flush and/or smoothly continuous with a surface upstream thereto
|Jul 10, 1998
|Apr 17, 2001
|Silverbrook Research Pty Ltd
|Single bend actuator cupped paddle ink jet printing mechanism
|May 31, 2000
|Oct 2, 2001
|Minolta Co., Ltd.
|Light controlling apparatus
|Nov 8, 2000
|Mar 5, 2002
|Eastman Kodak Company
|Assisted drop-on-demand inkjet printer using deformable micro-acuator
|Feb 11, 2000
|Aug 24, 2000
|Silverbrook Research Pty Ltd
|Thermal bend actuator and paddle structure for ink jet nozzle
|Citing Patent
|Filing date
|Publication date
|Apr 29, 2004
|Nov 13, 2007
|Hewlett-Packard Development Company, L.P.
|Method for manufacturing a fluid ejection device
|Apr 4, 2005
|Jun 17, 2008
|Hewlett-Packard Development Company, L.P.
|Microfluidic architecture
|Aug 21, 2002
|Aug 5, 2008
|Silverbrook Research Pty Ltd
|Ink jet nozzle assembly including displaceable ink pusher
|Sep 29, 2007
|Jun 9, 2009
|Hewlett-Packard Development Company, L.P.
|Fluid ejection device
|May 1, 2006
|May 4, 2010
|Warsaw Orthopedic, Inc.
|Expandable intervertebral spacers and methods of use
|Jun 30, 2008
|Jul 13, 2010
|Silverbrook Research Pty Ltd
|Inkjet printhead having nozzle arrangements with hydrophobically treated actuators and nozzles
|Apr 27, 2006
|Sep 14, 2010
|Wasaw Orthopedic, Inc.
|Expandable intervertebral spacers and methods of use
|Apr 24, 2008
|Sep 21, 2010
|Hewlett-Packard Development Company, L.P.
|Microfluidic architecture
|Apr 29, 2004
|Nov 3, 2005
|Hewlett-Packard Development Company, L.P.
|Fluid ejection device and manufacturing method
|Apr 4, 2005
|Nov 3, 2005
|Shaarawi Mohammed S
|Microfluidic architecture
|Aug 21, 2002
|Mar 2, 2006
|Kia Silverbrook
|Ink jet nozzle assembly including displaceable ink pusher
|Apr 24, 2006
|Oct 25, 2007
|Sdgi Holdings, Inc.
|Expandable intervertebral devices and methods of use
|Apr 27, 2006
|Nov 1, 2007
|Sdgi Holdings, Inc.
|Expandable intervertebral spacers and methods of use
|May 1, 2006
|Nov 1, 2007
|Sdgi Holdings, Inc.
|Expandable intervertebral spacers and methods of use
|Apr 24, 2006
|Nov 22, 2007
|Sdgi Holdings, Inc.
|Extendable anchor in a vertebral implant and methods of use
|Apr 27, 2006
|Nov 22, 2007
|Sdgi Holdings, Inc.
|Expandable vertebral implant and methods of use
|Sep 29, 2007
|Jan 31, 2008
|Shaarawi Mohammed S
|Fluid ejection device
|Apr 24, 2008
|Aug 21, 2008
|Mohammed Shaarawi
|Microfluidic Architecture
|Jun 30, 2008
|Oct 23, 2008
|Silverbrook Research Pty Ltd
|Inkjet printhead having nozzle arrangements with hydrophobically treated actuators and nozzles
|U.S. Classification
|347/54, 347/20, 347/48
|International Classification
|Cooperative Classification
|European Classification
|Jul 9, 2002
Owner name: SILVERBROOK RESEARCH PTY. LTD, AUSTRALIA
Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:SILVERBROOK, KIA;REEL/FRAME:013052/0901
Effective date: 20020626
|Apr 30, 2007
|Fee payment
Year of fee payment: 4
|May 16, 2011
|Fee payment
Year of fee payment: 8
|Jul 12, 2012
Owner name: ZAMTEC LIMITED, IRELAND
Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:SILVERBROOK RESEARCH PTY. LIMITED AND CLAMATE PTY LIMITED;REEL/FRAME:028538/0455
Effective date: 20120503
|Jun 25, 2014
Owner name: MEMJET TECHNOLOGY LIMITED, IRELAND
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Effective date: 20140609
|Jul 2, 2015
|Maintenance fee reminder mailed
|Nov 25, 2015
|Lapse for failure to pay maintenance fees
|Jan 12, 2016
|Expired due to failure to pay maintenance fee
Effective date: 20151125


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The Byke Old Anchor Beach Resort, Goa - Cavelossim
This hotel has its own restaurant serving breakfast, lunch and dinner where you'll find a selection of items to try. If you want low-key dining options, you will be pleased to find barbecue grills and a picnic area. Go for a dip in the outdoor pool and enjoy the lazy river. Guests will also have plenty of options in terms of bars as there is a beach bar, a poolside bar and a bar/lounge so guests can sip a refreshing drink in the sun or in the shade before eating at the restaurant.
A fitness center, a steam room, an outdoor tennis court, an indoor tennis court and spa services are among the leisure facilities on offer. Free WiFi is provided.
The Byke Old Anchor Beach Resort, Goa - Cavelossim
Hotel Info: 1-877-214-4288from $51
- Standard Room
- Deluxe Suite, 1 Bedroom
- Deluxe Room
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Also popular with travelers from the USA
At a glance
Key facts
Hotel size
- This hotel has 196 rooms
- This hotel is arranged over 1 floor
- Check-in time noon-noon
- Check-out time is 10 AM
- Express check-in/out
Airport shuttle service is available on request during limited hours. Contact the property in advance to make arrangements. To register at this property, guests who are Indian citizens must provide a valid photo identity card issued by the Government of India; guests who are foreign nationals must present a valid passport and visa.
Required at check in
- Credit card or cash deposit required
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Travelling with others
- No cribs (infant beds)
- No pets or service animals allowed
- Free WiFi in public areas
- WiFi in rooms *
- Airport shuttle (available on request) *
- Train station pickup *
- Cruise terminal shuttle *
- Ferry terminal shuttle *
- Free self parking (limited)
- Area shuttle *
- Shopping center shuttle *
- Casino shuttle *
- Theme park shuttle *
Other information
- Resort fee included
In the hotel
- Free buffet breakfast daily
- Restaurant
- Bar/lounge
- Coffee shop/café
- Beach bar
- Poolside bar
- Room service (during limited hours)
- Coffee/tea in a common area
- Barbecue grills
- Outdoor pool
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- Fitness facilities
- Indoor tennis court
- Spa services on site
- Steam room
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- Parasailing nearby
- Nightclub
- Lazy river
- Outdoor tennis court
- Arcade/game room
- Billiards or pool table
- Business center
- Number of meeting rooms - 2
- Conference space
- Meeting rooms
- Conference space size (feet) - 1400
- Conference space size (meters) - 130
- Conference center
- 24-hour front desk
- Tours/ticket assistance
- Limo or Town Car service available
- Dry cleaning/laundry service
- Laundry facilities
- Free newspapers in lobby
- Luggage storage
- Wedding services
- Porter/bellhop
- Number of buildings/towers - 10
- Year Built 1988
- Safe-deposit box at front desk
- Garden
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- Library
- Accessible bathroom
In the room
- Air conditioning
- Ceiling fan
- Coffee/tea maker
- Iron/ironing board (on request)
- Blackout drapes/curtains
- Sofa bed
- Memory foam mattress
- Individually furnished
- Private bathroom
- Shower only
- 21-inch TV
- Satellite TV channels
- Desk
- WiFi (surcharge)
- Phone
- Refrigerator
- Daily housekeeping
Special features
DiningRancho - This restaurant specializes in vegetarian cuisine and serves breakfast, lunch, and dinner. Guests can enjoy drinks at the bar.
Adega Goana - This restaurant specializes in vegetarian cuisine. Guests can enjoy drinks at the bar.
Beach Shack - This beach theme restaurant serves lunch and dinner.
The Byke Old Anchor Beach Resort, Goa - Cavelossim's small print
Also known as
- Anchor Goa
- Byke Old Anchor
- Byke Old Anchor Goa
- Byke Old Anchor Goa Cavelossim
- Byke Old Anchor Goa Hotel
- Byke Old Anchor Goa Hotel Cavelossim
- Old Byke Anchor
- Old Byke Anchor Goa
Only registered guests are allowed in the guestrooms.
Children under 5 years old are not allowed in the swimming pool without adult supervision.
For transfers, guests must contact the property before arrival at the number on the booking confirmation.
Mandatory fees
You'll be asked to pay the following charges at check in or check out:
- New Year's Eve (31 December) Gala Dinner per adult: INR 3000.00
- New Year's Eve (31 December) Gala Dinner per child: INR 1500.00 (from 5 to 12 years old)
The charges below are included in the total price displayed:
- Resort fee
Optional extras
Rollaway beds are available for INR 1000 per night
Airport shuttle service is offered for an extra charge of INR 1500 per vehicle (one way)
Airport shuttle for children between the ages of 3 and 18 costs INR 1500 (one-way)
WiFi is available in guestrooms for INR 50 per hour (rates may vary)
Cruise ship terminal shuttle, ferry terminal shuttle, and train station pick-up service is offered for an extra charge
Area shuttle service to the casino, shopping center, and theme park is offered for an extra charge
We have included all charges provided to us by this hotel. However, charges can vary, for example, based on length of stay or the room you book.


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Plan a Guided Bus Tour featuring Underground Railroad, Erie Canal, Women's Rights and History, Shopping, Wine Tasting and much more ...experience the 200th anniversary of the Erie Canal and the 100th anniversary of Women's Right to Vote!
Romulus, NY - the heart of the Finger Lakes
Romulus, NY is located between the largest two Finger Lakes of central NY State (Cayuga Lake and Seneca Lake). South of Geneva and Seneca Falls, and North of Watkins Glen and Ithaca Romulas is a very rural area with many Wineries and outdoor attractions to choose from. In addition, this area holds the past Seneca Army Depot (10,000 plus acres) along with a unique white deer herd, and other wildlife including brown deer, turkeys, and geese. The Romulus area is a scenic area with many great lake views and waterfalls in the region. Both, Cayuga Lake and Seneca Lake, offer extensive wine tour trails adding to your Get-A-Way options! ...learn more>>
Discover New York State | discovernys.com | Contacts


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Student (15% discount): $1955
Private Departure (1-4 pax): $2990
Private Departure (5-10 pax): $2300
Single Supplement Fee: n/a
*Please note: Single rooms will be guaranteed in Kathmandu and Pokhara. Single rooms will be requested on trail but travelers may be asked to share a room with another solo traveler of the same sex.
Day 1: Arrive to Kathmandu
Day 2: Bike Shivapuri National Park
Day 3: Travel to Pokhara
Day 4: Fly to Jomsom and bike to Muktinath
Day 5: Bike to Marpha
Day 6: Bike to Tatopani
Day 7: Bike to Beni and return to Pokhara
Day 8: Rest day in Pokhara
Day 9: Return to Kathmandu
Day 10: International departures
|Arrival Date
|End Date
|September 9, 2016
|September 18, 2016
|September 23, 2016
|October 2, 2016
|October 14, 2016
|October 23, 2016
|February 17, 2017
|February 26, 2017
|March 24, 2017
|April 2, 2017
|April 21, 2017
|April 30, 2017
|September 8, 2017
|September 17, 2017
|September 22, 2017
|October 1, 2017
|October 13, 2017
|October 22, 2017
- medical/evacuation insurance for all participants confirmed 30 days or more prior to their expedition start date
- 3 nights accommodation in Kathmandu
- 3 nights accommodation in Pokhara
- all accommodations on trek (double occupancy w/ shared bathroom)
- breakfast, lunch and dinner on the trek
- mountain bike (Giant Anthem, Giant Trance, Giant XTC or ATX Models)*
- trekking permits and entry fees
- farewell dinner
- guide and porter services
- baggage transport (limited to 22lbs/10kg)
- all ground transportation in Nepal
- guided bike excursion to Bhudanilkhanta
- one-way air transportation to Jomsom
*Client is responsible for all damages to bike (up to $2300 for full replacement) due to any non-mechanical reasons
- personal items (laundry, clothing, snacks, etc.)
- trip cancellation insurance (offered as an option)
- international airfare and meals during travel
- snacks during trek
- beverages outside of designated meals
Day 1: Kathmandu (4,593ft/1400m). We pick you up at the airport. Arrive in Kathmandu and check into our OneSeed partner lodge in the heart of the ancient city of Patan. Catch up on some much needed sleep and venture out for some dinner on your own.
Inclusions: Private airport transfer; accommodations
Day 2: Kathmandu (4,593ft/1400m). Your biking adventure begins! Head to Shivapuri National Park to ride 23 miles on single track and jeep trails in the jungle. Return to Kathmandu for the night.
Inclusions: Breakfast, lunch, welcome dinner (Choice of 2 options including vegetarian, coffee, tea, water, juice, soft drinks); transportation to and from Bhudanilkhanta; bike hire; mountain bike guides; national park entry; accommodations
Day 3: Kathmandu to Pokhara (2,900ft/884m). Take a bus to the beautiful city of Pokhara, where you will have time to walk and explore. Meet in the evening for a group briefing and gear check.
Inclusions: Breakfast, Lunch (Choice of 2 options including vegetarian, coffee, tea, water). Other options available for guest purchase); transportation to Pokhara; accommodations
Day 4: Pokhara to Muktinath (12,464ft/3800m). Take a stunning morning flight to Jomsom before hopping on your bikes to head to the mountain towns of Kagbeni and Muktinath. Visit the sacred temple with 108 spouts of waters and soak in the beautiful views of the valley. After the 17-mile bike ride with an elevation gain of almost 4000ft, retire to the teahouse for the night.
Inclusions: Breakfast, Lunch, Dinner (Choice of 2 options including vegetarian, coffee, tea, water. Other options available for guest purchase); domestic flight; airport tax and excess baggage charge for bikes; biking guides; mountain bikes; porter services; double occupancy accommodations
Day 5: Muktinath to Marpha (8,789ft/2679m). Leave Muktinath for the 21-mile bike ride to Marpha. The route has two options: a jeep track for intermediate riders and a single track for advanced riders. The ride is mostly downhill so enjoy the breeze as you rush down through the valley. Retire for the night in Marpha, a town famous for its Mustang apples and apple brandy.
Inclusions: Breakfast, Lunch, Dinner (Choice of 2 options including vegetarian, coffee, tea, water. Other options available for guest purchase); biking guides; porter services for luggage; mountain bikes; porter services; double occupancy accommodations
Day 6: Marpha to Tatopani (4,002ft/1220m). Continue the descent by following the river on jeep or single track trails. Today's ride is 30 miles but you will stop midday for lunch at the beautiful waterfall in Rupse Chartra. Once in Tatopani, enjoy the hot springs before heading to bed.
Inclusions: Breakfast, Lunch, Dinner (Choice of 2 options including vegetarian, coffee, tea, water. Other options available for guest purchase); biking guides; mountain bikes; porter services; double occupancy accommodations
Day 7: Tatopani to Pokhara (2,900ft/884m). In the morning, bike 14 miles to Beni, where you will take a Jeep to Naudhadha. From there, hop back on your bike and enjoy the beautiful views of Pokhara and its surrounding lakes as you descent 7 more miles into the town. Head out to explore the beautiful city of Pokhara in the evening.
Inclusions: Breakfast, Lunch (Choice of 2 options including vegetarian, coffee, tea, water. Other options available for guest purchase); biking guides; mountain bikes; Jeep transfer; porter services; accommodations
Day 8: Pokhara (2,900ft/884m). Rest your biking legs in Pokhara. Spend the day by the lake, taking in the views and enjoying a hot shower!
Inclusions: Breakfast (Choice of 2 options including vegetarian, coffee, tea, water. Other options available for guest purchase); accommodations
Day 9: Pokhara to Kathmandu (4,593ft/1400m). Travel by van or jeep to Kathmandu. Join the rest of your group for a farewell banquet in Kathmandu.
Inclusions: Breakfast, lunch, farewell dinner (Choice of 2 options including vegetarian, coffee, tea, water. Other options available for guest purchase); transportation; accommodations
Day 10: Kathmandu (4,593ft/1400m). International flights depart.
Inclusions: Breakfast (Choice of 2 options including vegetarian, coffee, tea, water. Other options available for guest purchase); airport transfer
All itineraries are subject to change based on local conditions and the judgment of the guide. We reserve the right to modify the itinerary due to medical considerations or the ability of participants as judged by the guide. For complete terms and conditions, see here .
You are responsible only for personal clothing and gear listed below. We'll take care of everything else. A gear check will be completed before you depart for the trail. This list does not include additional clothing/items you may want for travel or for your time off the trail. Any luggage not needed on the trail can be left in storage during your expedition.
See current weather conditions for Annapurna Sanctuary here.
See current weather conditions in Kathmandu, Nepal here.
Packing System: This expedition includes bag transport. You are only responsible for carrying a daypack. We recommend packing your items in a large backpack or a durable duffle bag.
Carried Bag Weight Limit: 22lbs/10kg
Rentals Available:
- Sleeping Bag - $42 USD
- Must be confirmed no later than 1 week prior to expedition start date - rent gear here!
Documents and Logistics
- International flights booked and confirmed to Kathmandu
- Flight information submitted
- Passport valid through end of trip
- Photocopy of passport
- Four (4) passport-sized photos for arrival visa and trekking permits
- US Currency for 15 or 30-day Nepali Tourist Visa (available upon arrival for US citizens)
- Medical insurance card
- Cash for tipping guides, buying souvenirs, incidental costs, etc.
Expedition Gear
- Change of clothes for Kathmandu - to be kept in storage during expedition
- Medium/Heavyweight down jacket
- Fleece jacket or vest (1)
- Rain Jacket
- Synthetic long underwear (top and bottom)
- Synthetic Biking T-shirt
- Wool or synthetic hat
- Gloves
- Waterproof shoes to be used for biking
- Nylon-wool blend socks (2-3)
- Sandals/Crocs/Old sneakers (for walking around the lodges/restrooms in the evening)
- Day pack
- Water bottle
- Headlamp
- Sunscreen
- Sunglasses
- Quick-dry towel
- Personal toiletries and medicine
- Sleeping bag w/ 15-20ºF rating
- Toilet paper in ziplock bag
- Ditty Bag and extra ziplock baggies for toilet paper waste on the trail
- Hand sanitizer
- Padded biking shorts
- Biking gloves
- Knee and elbow pads
Other (optional)
- Reading material for the trail
- OTC medications (Advil, Imodium, Pepto-bismol etc.)
- Hotel reservations for extended time in Nepal (if applicable)
- Guidebooks
- Camera
- Trekking poles
- Bandana (for dust and wind)
- Energy bars
- Yaktrax (especially useful for late fall and early spring trips)
- Outlet adapter (available to purchase in Kathmandu)
- Zip-lock bags for waterproofing passport and other valuables
Peak season to travel to the Annapurna region falls between September and November and then again between February and April. The weather on the trail will vary at different altitudes, but in the town of Ghorepani, which is located at 9,393 feet; June is the hottest month of the year with averages as high as 68°F. Winter months like January can get a cold as 25°F.
The monsoon season falls during the summer months of June, July, and August, when rainfall can be as high as 5.5 inches per month. The rest of the year is relatively dry with only 1 inch of rain.
Annapurna Region Weather
Himalayan Downhill Reviews
Read more Oneseed reviews
If you cancel 60 days or more prior to your scheduled departure for this adventure then you will be able to reschedule or be reimbursed the full cost of this adventure net the non-refundable deposit of $1000.00. If any cancellation is made less than 60 days prior to your scheduled departure for this adventure then you will lose the complete value of your experience.
If your expedition must be canceled by OneSeed due to circumstances outside of your control (e.g. natural disasters, weather, etc.), we will work with you to reschedule at no extra cost. If rescheduling is not possible, you will be reimbursed the total amount of your purchase less 20% of trip cost.
All discounted and promotional offers made through third-party partners are 100% non-refundable and non-transferable.
OneSeed provides optional cancellation and interruption insurance for all expeditions. Please review the OneSeed Cancellation and Refund Policy before purchasing any expedition. Travelex Cancellation and Interruption Insurance covers unforeseen events that may prevent you from participating in your scheduled expedition.


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Problems or diseases of the hands can cause a large amount of concern, as use of the hands are a large part of carrying out daily tasks. Even a small degree of discomfort or a mild deformity can cause serious consequences. At the beginning of the 19th century, major advances were being made in the realm of general surgery, but there was little attention placed on the hand. Since that time, great progress has been made in understanding and treating problems with the hand. Plastic surgeons perform surgery on the hand with an interest in improving not only the function of the hand, but also the appearance of the hand.
Many different types of hand surgery require the clinical and surgical expertise of a plastic surgeon. Listed in the directory below are some, for which we have provided a brief overview.
Overview of Hand Surgery
Anatomy of the Hand
Diagnosing Hand Conditions
Type of Hand Conditions
Carpal Tunnel Syndrome
Congenital Hand Deformities
Dupuytren's Contracture
Rheumatoid Arthritis
Management After Surgery
For Blue Cross Blue Shield of Massachusetts members
Find a Doctor & Estimate Costs
Health & Wellness
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Review Claims
Attend a Seminar
Medicare Plans
Request a Call
Manage Your Account
Plans & Products
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Office Resources
Provider News
Annual Report
Contact Us
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Diversity Leadership
Blue Cross Blue Shield of Massachusetts is an Independent Licensee of the Blue Cross and Blue Shield Association.® Registered Marks of the Blue Cross and Blue Shield Association.© 101 Huntington Avenue, Suite 1300, Boston, MA 02199-7611 | 1-800-262-BLUE (2583)
About Blue Cross Blue Shield of Massachusetts
Terms of Use, Privacy & Security
Nondiscrimination and Translation Resources
Blue Cross Blue Shield of Massachusetts is a leading provider of quality health insurance for residents of Massachusetts. Our main goal is to make health care cost-effective by offering health insurance solutions for individuals, families, and large and small businesses at affordable rates.
Our Vision — Making Quality Health Care AffordableOur Promise — To Always Put Our Members First
To learn more about our Massachusetts health plans, please visit our Plans & Products page, where you can compare Massachusetts health insurance plans, buy health plans online, and get Mass health insurance quotes.
Blue Cross Blue Shield of Massachusetts also offers insurance, pharmacy coverage, and Medicare Plans for seniors; life and disability insurance through Indigo Insurance Services (a wholly owned subsidiary); and insurance for individuals aged 18-26 years. Learn more about our other insurance plans and Medicare plans, or contact a sales representative today.
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smileyA smiley is often used in text communications to convey an emotion with a message. Smilies are used in text messages in the same way voice changes and facial expressions are used in face-to-face or telephone conversation. For example, if you were joking with someone and send a text message of "Idiot!" the person receiving your message may think you are making a rude comment to them. If you send the same message with a "happy smiley" : ) following, the person would then understand you were "smiling" - or joking when you said that, and not misinterpret your intent. To create a smiley you use your standard keyboard characters and punctuation marks. When viewing text smilies they are all sideways. Smilies are often used in online chat rooms, game rooms, instant messaging, and in e-mail.
A smiley can also be called an emoticon.
See also Text Messaging Abbreviations & Smilies in Webopedia's Quick Reference section.
Stay up to date on the latest developments in Internet terminology with a free weekly newsletter from Webopedia. Join to subscribe now.
Webopedia's student apps roundup will help you to better organize your class schedule and stay on top of assignments and homework. Read More »List of Free Shorten URL Services
A URL shortener is a way to make a long Web address shorter. Try this list of free services. Read More »Top 10 Tech Terms of 2015
The most popular Webopedia definitions of 2015. Read More »
Java is a high-level programming language. This guide describes the basics of Java, providing an overview of syntax, variables, data types and... Read More »Java Basics, Part 2
This second Study Guide describes the basics of Java, providing an overview of operators, modifiers and control Structures. Read More »The 7 Layers of the OSI Model
The Open System Interconnection (OSI) model defines a networking framework to implement protocols in seven layers. Use this handy guide to compare... Read More »


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What you need to know about Fayetteville, GA
Fayetteville is located in Fayette County, Georgia. The population is 54% White, 33% Black, 7% Asian and 0% Native American or Native Hawaiian. 1% identify as another race or ethnicity, or two or more races. 5% of residents are of Hispanic or Latino origin. The median income is $63,750 and the median home value is $191,800. For more on schools, real estate, business and health care in Fayetteville, see each of the tabs above.
Up by 9.38%
Up by 9.38%
Nearby Cities
Homes Owned 72.68%
72.68% Complete
Homes Rented 27.32%
27.32% Complete
Real Estate
In Fayetteville, Georgia
Ready to move to Fayetteville? There are a variety of housing options in the area. Click below to learn about the recent trends, average home values and even a few current real estate listings in Fayetteville.
Median Home Price
Higher than the state average
Higher than the state average
In Fayetteville, Georgia
The quality of a school district is often a top factor for parents considering where to live. Strong school systems attract new residents and help their cities prosper. See how Fayetteville rates.
Median Household Income
Higher than the national average
Higher than the national average
In Fayetteville, Georgia
Being a great place to live and being a great place to work often go hand-in-hand. Here's what the business and employment climate is like in Fayetteville.
Most residents are
5-17 Years old
5-17 Years old
In Fayetteville, Georgia
Access to quality hospitals, doctors and health-care providers is just part of what makes a healthy community. Here's how to get and stay healthy in Fayetteville.
Bachelor's Degree 41%
41% Complete
Graduated High School 93%
93% Complete


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Belgo - Holborn
Fancy food and beer in a bank vault? That's what the Belgo in Holborn is offering as a converted former Lloyds bank, with the bank vault having been transformed into a Belgian beer cellar! Despite the building's history, the decor is contemporary and relaxing, but it's the beer list which is truly eye-catching, with over 250 beverages to choose from. The food is typically Belgian, offering treats such as Belgian Sausages, mussels and frites with mayonnaise, and a wide range of meat and vegetarian dishes. There are many fantastic, money-saving special offers throughout the year, but with even a three-course meal served at a reasonable price, this is one gastronomic experience that won't break the bank - even if it's in one.
This content has been supplied by Belgo - Holborn
Venue Details & Map
Belgo - Holborn
- Address
67 KingswayLondonGreater LondonWC2B 6TD
- Telephone:
- +44 20 7242 7469
On a busy night, without a reservation they were able to find us a table. Hooray!
The staff were great & the food was agreeable & the portions very large.
I had mussels, my husband the chicken. Fabulous selection of beer.
The restaurant/ bar was VERY noisy. The noisiest place I have ever been. It was difficult to have any conversation. Everyone seemed to be having a grande time.
I wish they...more
There are a few Belgo locations throughout the city but this has to be my favourite. Only partially because I am always near it.
This location can be less busy that others during the day, but does get quite crowded during the evenings. The crowd varies, it is close to the major uni's so sometimes it is full of younger students, and other times not.
The menu recently changed, which in my...more
Came here with a few friends for an event. There were six of us and we all agreed that the food, service, and beer list was a hit. The reason I can't award the 5th star is because the mussels were just ok. If they matched the outstanding beer selection and service it would be 5 stars all the way. Still, a cool place to go especially if you enjoy Belgium beer and a fun embiance.more
I miss the old Belgos menu. It seems more 'Americanised ', now, with burgers and barbecue sauces, also the menu on the mussels had changed offering a more Asian influence on the pot of mussels menu.
to tell you the truth I was confused by the Menu and a little disappointed but what I had, the half Lobster, was clean fresh and nice enough.
The drinks menu with its endless list of beers,...more
Nice venue, they have quite a big selection of Belgian beers (with traditional glasses of course) including the famous Kwak. But, the beers are a bit on the pricey side. Saying that, I would go back. If you're a fan of mussels, they also serve 'moules et frittes'.more


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$47,000 needed to run all season
by Tom Cullen
The Lake Improvement Commission will have to receive $8,500 more per year from the Lake Preservation Association or another source to keep the dredge operational for the full year, according to Commission Administrator Jim Patrick.
Dredge America to take over operations Aug. 30
The Lake Improvement Commission met Monday at 4 p.m. to approve a contract between the commission and Dredge America to remove spoil in Storm Lake at $1.50 per cubic yard.
Storm Lake City Manager Jim Patrick said dredge crews may resume work Aug. 30 and have the possibility of selling dredge equipment near the end of dredging by 2020.
Storm Lake's tremendous dredging program would not be as far along as it is were it not for the locally organized work crew and infrastructure. As we have noted before, City Infrastructure Director Pat Kelly volunteered to ramrod the operation and the city council agreed. That pledge led to the creation of the Lake Improvement Commission, an authority formed by Storm Lake, Buena Vista County, Lakeside and the Lake Preservation Association with advisory support from the Iowa Department of Natural Resources.
Contract will last two years
By Tom Cullen
The Lake Improvement Commission directed City Administrator Jim Patrick to begin contract negotiations with Dredge America for administration of dredging operations of the city at its meeting Monday.
The city accepted four bids for administration of the dredge from VEIT, Great Lakes, JTB and Dredge America since the commission sent out a May 26 letter soliciting bids to take over dredging operations.
Also: IDNR to restore islands as soon as '16
By ART CULLEN and WHITNEY ROBINSON
Storm Lake could go crystal clear virtually overnight if scientists can figure out the right chemistry.
Dredging will not start immediately
By WHITNEY ROBINSON
Water is going over the outlet dam, meaning that Storm Lake is full, said Julie Sievers of the Iowa Department of Natural Resources.
Chemical treatment could make silt drop to bottom, stay there
By ART CULLEN
The Lake Improvement Commission agreed Monday to hire an engineering firm for $250,000 to find ways to clarify Storm Lake's water beyond dredging.
Dr. Clayton Williams of Iowa State University provided a fascinating report Tuesday on how adding one or more islands to Storm Lake could reduce wind roiling the bottom sediment and improve water clarity. Adding three islands about the size of the Big Island would dramatically improve water quality and reduce turbidity (suspended sediment in the water) to meet federal clean water goals.
Repair old islands? Build a new island? Find out Tuesday at LPA picnic
ISU scientists will reveal their results
By JOEY AGUIRRE
With spring's typical bugs worked out, 10,000 cubic yards pumped in 2 weeks; LPA picnic set for June 17
Dredging operations started on May 14 and by next week the city should have two full crews to work two shifts.
Copyright 2013-2014 | The Storm Lake Times | All Rights Reserved
220 W Railroad St
PO Box 487
Storm Lake, IA 50588
712.732.4991 | 1.800.732.4992
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Nihil est--in vita priore ego imperator Romanus fui.
Nihil est--in vita priore ego imperator Romanus fui.
Si Hoc Legere Scis Nimium Eruditionis Habes.
Originally Posted by jmichiel
Ha ha...knowledge is power????
Roughly... if you can read this, you're over educated....
Res ipsa loquitur, sed quid in infernos dicit?
Two for Manny...
Braccae tuae hiant
Melita, domi adsum.
Chuck Willard
The Willard of Oz
"Don't be afraid to see what you see."
Ronald Reagan
First for jimi:
EGO non tutela si a vir tenere viridis spiritus quod puniceus tergum quoad is posso sus.
Well, that's not quite it... had to throw a little Italian to make it close.
Aw, shucks... thanks.
Music isn't a career, it's a way of life.
My thoughts exactly... Manny, expect a witty comeback sometime in early January when I have time to translate your reply.Originally Posted by MahlerBrass
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text: By Chesney Hearst, Senior Contributing Reporter RIO DE JANEIRO, BRAZIL – Explosives brought a one kilometer section of Rio's Elevado da Perimetral in five seconds on the morning of Sunday, November 24th. Located in Rio's Port Zone, the section of the important highway was demolished by the city government at 7AM. Explosives brought Rio's Perimetral down in five seconds on Sunday, November 24th, press image/Mayor's Office of Rio de Janeiro. Approximately 1,200 pounds of explosives were used to destroy the section of road in order to make way for construction in preparation for the 2016 Rio Olympics. Rio de Janeiro mayor Eduardo Paes personally detonated the series of explosions. "The sun will come up and never leave the Rodrigues Alves," Paes said of the avenue that ran underneath the Perimetral and for years had been covered by the now-destroyed highway. "There is still more to do in January and February. We will arrive at 2016 having made many transformations." The implosion brought down 232 steel beams, weighing more than five tons onto over 2,000 sand-filled tires placed under the overpass to cushion the falling debris. A cloud of dust replaced what had once been the Perimetral, one of Rio's most important arteries, after only five seconds. Paes said that the debris will be reused in future construction projects and the clean-up process should take approximately ninety days. The stretch was removed in order to open the area for the construction of an expressway which will link the South Zone's Aterro do Flamengo (Flamengo Park), Avenida Brasil and the Rio-Niterói Bridge. "We are creating important road alternatives, but more than that , it is high priority transport capacity," Paes affirmed. "The VLT [Light Rail] is already being constructed, we will have a BRT [Bus Rapid Transit] coming and the improvements of the superhighway and subway. Improvements are coming to downtown Rio. We will face difficulty, a more difficult period. We ask locals to use public transportation. The car is not very well-liked in this project. We prioritize people walking the sidewalks." The remaining sections of the Perimetral are loosely scheduled to be demolished in January or February 2014. Read more (in Portuguese). * The Rio Times Daily Updates feature is offered to help keep you up-to-date with important news as it happens. 8 Responses to "Rio's Perimetral Highway Overpass Demolished: Daily" Ubiraci Augusto November 25, 2013 at 10:24 AM Brazilian government keeps asking us to use public transport, but what happens is that Brazilian people prefer to use their cars because our public transportation is really bad. The buses are always full, delayed, and it takes them more than it should to get to their destination. The municipal, state and federal governments should be ashamed of the quality of roads and streets we have in this country. We pay our taxes, more than they should be, since the road conditions are terribly maintained. They say we have to use public transport, but they go to work in their very expensive cars. Give us a break! Improve the quality of the highways first. WillA November 26, 2013 at 8:53 PM Ubiraci's comments are totally correct. The situation with the transport in this city is a joke. Buses are badly maintained, dangerous and pay no respect to the rules of the road. Intersection blocking is totally ignored and the roads are in such a state as they risk causing serious accidents. The city doesn't like cars? The city doesn't care for commuters full stop. Alternative forms of transport seem restricted to the buses (dangerous) and vans (even more so). Try cycling in this city and you will risk your life. The metro is overcrowded and features two lines and if trams exist in any borough I don't know about them. The removing of perimetral is visual, it already was a superhighway linking Aterro to the Niteroi bridge. But the best quote above is "We prioritize people walking the sidewalks", walking the sidewalks around Gamboa, particularly at night would get you into a lot of trouble. Rio de Janeiro is a beautiful city that has been left to rot for the past 30 years, its current local government continue to let it decay, these projects are for the Olympics and they are just show. Pingback: Opinion: The Curmudgeon on Downtown Centro Traffic in Rio | The Rio Times | Brazil News Pingback: Roadway Changes in Centro Adds to Rio Traffic | The Rio Times | Brazil News Pingback: Sergio Castro International » Roadway Changes in Centro Adds to Rio Traffic Pingback: More Perimetral Highway to be Demolished in Rio: Daily Update | The Rio Times | Brazil News Pingback: Freeways without a Future: Rio's Elevado da Perimetral | Price Tags Pingback: Praça Mauá Reopened After Four Years in the Port Zone of Rio | The Rio Times | Brazil News Leave a Reply Cancel Reply Your email address will not be published. Please enter an answer in digits:five × 4 =