text:
August 30, 2010
Jamal Crawford(notes) has one year left on his contract, one that will pay him $10.8 million this season before expiring next summer. And, if you really want to get uneasy with it, $10.8 million for Jamal Crawford in his prime is still way, way too much. He scores, yes, but does precious little else on the court besides getting hot from about 20 feet away from the hoop. Eight figures for a one dimensional player, even if he's quite good at his lone dimension? That's a lot of money.
But that shouldn't stop teams from trying to acquire Jamal Crawford. Nor should it stop the Atlanta Hawks from trying to trade him. And it shouldn't - and I can't believe I'm writing this - stop Crawford from trying to force a deal to another team.
You see, the Hawks have declined to offer last year's Sixth Man Award winner a contract extension, which I think they're right to do. Assuming they pass on trading Jamal, the Hawks would have traded for the best two years of Crawford's prime, while admittedly paying a hefty price (right at $20 million, over two years) for the rights to it. Extending this guy beyond 2010-11 at anything more than half of what he's making now would be a bit daft.
But Crawford, assuming he and his representatives start to do a better job of keeping their wishes under wraps, is well within his rights to try and push for a deal (or new deal, with the extension) before training camp hits. A full season with a new team would allow for that new team - provided some approximation of the current salary cap rules carry over to the next Collective Bargaining Agreement - to go over the salary cap limit to re-sign him after this deal expires. And Crawford - a one-dimensional player who would be 31 at the time of his free agency - doesn't want to be seeking out a new deal amongst what few teams have salary cap space next summer.
But despite the largesse of Crawford's Isiah Thomas-penned contract, and the way public trade demands make me uneasy, I can't blame the man for seeking out a new home.
Because Crawford has been trade bait in almost every season he's played since being drafted in 2000. He was traded the night he was drafted, to Chicago, and was involved in trade rumors in the days immediately following the deal that sent him to the Bulls. And when I say, "in the days immediately following," I mean "from June of 2000, to July of 2004," when he was traded to the New York Knicks.
More trade rumors and a deal to the Golden State Warriors followed. Then Don Nelson essentially told Crawford - who is as about right for Don Nelson's "offense" as any whippet-thin shooter that's ever taken a seat on Nellie's bench - that he had no use for him, and to consider opting out of his contract in 2009.
Think about that. Didn't trade him. Didn't work with him. Didn't play him. Just tried to make his life so untenable that Jamal would want to hand back that $20 million last summer, just so Nelson could make up for the mistakes he'd made in the past concerning Golden State's miserable payroll. Which meant Crawford, in his ostensible prime, would receive a needless DNP-CD in 10 of his last 16 games as a Warrior, while Nelson (supposedly charged with running the team) wanted to talk about Jamal's opt-out possibilities more as the season wound down, rather than a new way to beat the Hornets.
A week after 2008-09 ended - that is to say, months after 2008-09 ended for the Warriors - Jamal was traded for Speedy Claxton(notes), and Acie Law IV(notes). Acie went on to play 26 games for three different teams last season. Claxton didn't play a single minute.
Crawford went on to average 18 points in only 31.1 minutes per game with the Hawks. He made 38 percent of his threes, won several games for Atlanta, and was named the Sixth Man Award winner.
Now, before we start to treat Jamal as this league's ultimate martyr, understand that a whole lot of Crawford's 2010-11 run screamed "fluke." Sure, he was acting and playing as he always has, but his success rate at doing what he's always done was way, way higher that it's ever been in his 10-year career. Because the shots go in, and because he's working his way toward those shots in the same way you've seen him try it for a decade, it's hard to notice that these makes seem a bit disproportionate given his past.
So it's more than likely, at age 30 (and hitting 31 in March), that Jamal will slunk back down to earth slightly in 2010-11. The guy's been right around 41 percent shooting (35 percent from deep) his entire career, so for him to make 45 percent and 38 percent last year sends all sorts of warning signals to fans that know that shooting percentages, ahead of just about everything else, are the flukiest stats to behold. Beware the guys that see those numbers jump up for a year. And welcome, with open arms, those who saw their percentages dip unexpectedly the year before. Because they'll bounce back.
Jamal, likely, will bounce, uh, down in 2010-11. But I still think, even making nearly $11 million next season, that he'll be worth trading for. And I think the Hawks, who badly need someone to create shots for other people, need to seek out trying to find a palatable point guard in return for Crawford.
Because even at his typical, very average, rate, Crawford could still help a team looking to go over the top next season. Provided his shots are kept in check on most nights, this guy can really help a team if he's utilized properly, as the Hawks did last season. And even if he comes crashing back to earth beyond what we'd expect (JC returning to the ranks of the average), so what? He's an expiring contract.
If that's me sounding cold and dispassionate, understand that I'm also encouraging Jamal to make his own fortune and seek out a trade. I think there's room for understanding both sides, here.
What we also need to understand is that the Hawks should absolutely not give this guy an extension. For several reasons, spread out all over the things about his game that are a little worrying, and the specter of the impending new labor agreement.
Still a little summer left. Make it work.
Posted Jun 29 2012
Posted Jun 29 2012
Instant Analysis: Harrison Barnes
Posted Jun 28 2012
Edited By Doug Farrar
Edited By 'Duk
Edited By Kelly Dwyer
Edited By Greg Wyshynski
Edited By Matt Hinton
Edited By Jeff Eisenberg
Edited By Jay Busbee
Edited By Jay Busbee
Edited By Steve Cofield
Edited By Chris Chase
Edited By Chris Chase
Edited By Brooks Peck
Edited By Andy Behrens
Edited By Cameron Smith
Edited By Mark J. Miller


text:
|Publication number
|Publication type
|Application number
|Publication date
|Apr 3, 2001
|Filing date
|Feb 27, 1998
|Priority date
|Feb 27, 1998
|Fee status
|Also published as
|Publication number
|Kie Y. Ahn, Leonard Forbes
|Original Assignee
|Micron Technology, Inc.
|Export Citation
|BiBTeX, EndNote, RefMan
|Patent Citations (37), Non-Patent Citations (39), Referenced by (47), Classifications (14), Legal Events (7)
|External Links: USPTO, USPTO Assignment, Espacenet
The present invention concerns methods of semiconductor device or integrated circuit manufacturing, particularly methods of forming interconnects from copper and other metals.
Integrated circuits, the key components in thousands of electronic and computer products, are interconnected networks of electrical components fabricated on a common foundation, or substrate. Fabricators typically use various techniques, such as layering, doping, masking, and etching, to build thousands and even millions of microscopic resistors, transistors, and other electrical components on a silicon substrate, known as a wafer. The components are then "wired," or interconnected, together to define a specific electric circuit, such as a computer memory.
Interconnecting millions of microscopic components typically entails covering the components with an insulative layer, etching small holes in the insulative layer to expose portions of the components underneath, and digging trenches in the layer to define a wiring pattern. Then, through metallization, the holes and trenches are filled with metal to form line-like wires between the components. The wires are typically about one micron thick, or about 100 times thinner than a human hair.
Aluminum and its alloys with silicon and copper are the most common metals used for the wires, or interconnects. However, at sub-micron dimensions, that is, dimensions appreciable less than one micron, aluminum-based interconnections present not only higher electrical resistances which waste power and slows down the integrated circuit, but also poor electromigration resistance which lets the aluminum diffuse, or leach, into neighboring structures. This diffusion degrades performance of an integrated circuit, ultimately undermining its reliability. Thus, there is a need to form sub-micron interconnections from metals other than aluminum.
Copper appears, because of its lower electrical resistivity and higher electromigration resistance, to be a promising substitute for aluminum. However, conventional interconnection techniques have proven impractical for making sub-micron interconnects from copper, specifically for filling the quarter-micron-wide holes and trenches thought necessary for tomorrow's smaller, more densely-packed integrated circuits.
For example, when using the conventional metallization technique of sputtering to fill trenches with copper, copper atoms spray out widely (in comparison to the width of the trenches), stick to the sidewalls of the trenches, and then to each other, eventually building bridges, or closures, across a trench and ultimately leaving voids, or wormholes, in the resulting copper wire. Similarly, when sputter-filling small holes with copper, the resulting vias are riddled with voids. These voids not only reduce the physical integrity of the copper interconnects, but also increase their electrical resistance significantly.
One attempt at solving this problem is the Hirao technique disclosed by S. Hirao and his coworkers in their article "A Novel Copper Reflow Process Using Dual Wetting Layers" (Symposium on VLSI Technology, Digest of Technical Papers, pp. 57-58 (1997)). The Hirao technique forms a trench and two diffusion barriers, one inside the trench and the other outside the trench. The inside diffusion barrier consists of a high-wetting, titanium-tungsten, and the outside diffusion barrier consists of a low-wetting, silicon-nitride. Next, the Hirao technique conventionally sputter deposits copper over both the inside and outside diffusion barriers, and afterward executes a reflow step, which heats the copper to 450� C. for 5 minutes in a vacuum. During reflow, the copper flows off the low-wetting, outside diffusion barrier into the trench, where the high-wetting diffusion barrier, to which copper easily sticks, promotes voidless copper consolidation.
Unfortunately, the Hirao technique suffers from at least four drawbacks. First, the technique is time-consuming and inefficient, particularly during formation of the outside diffusion barrier. Forming the outside diffusion barrier entails depositing a sheet of silicon nitride on an insulative layer and then masking and etching through the barrier into the insulative layer to form the trench. This etching is especially time consuming because it must dissolve not only the silicon nitride but also the insulative layer. Second, the Hirao technique forms the inside diffusion barrier using conventional sputtering which fails to yield a lining that conforms accurately to the profile of the trench or hole, ultimately yielding a deformed copper conductor with a smaller cross-section and therefore greater resistance. Third, conventional sputtering deposits the inside barrier material both inside and outside the trench, necessitating an additional scrubbing or polishing step to remove the material outside the trench. Not only is this additional scrubbing step time consuming, but it very likely wears away some of the silicon nitride material forming the outside barrier layer, reducing its effectiveness. Fourth, to control wettability of the barrier layers, the Hirao technique describes an argon-plasma treatment, another time-consuming step that further impairs its practicality.
Accordingly, there remains a need for practical methods of making low-resistance, high-reliability copper interconnections.
To address these and other needs, the inventors have developed new methods of filling holes and trenches with copper or other desirable metals. Specifically, one embodiment of the invention entails forming a trench or hole, ionized-magnetron sputtering a first material inside the trench or hole, and then jet-vapor depositing a second material outside the trench or hole. Another step fills the trench or hole with copper or other suitable metal.
The preferred embodiment conducts the jet-vapor deposition at an acute incident angle, and uses ionized-magnetron sputtering to fill the trench or hole with copper. In addition, the preferred first material consists essentially of a high-wetting diffusion-barring material, such as tungsten (W), titanium-tungsten (TiW), or titanium nitride (TiN). The second material consists essentially of a low-wetting diffusion-barring material, such as a silicon nitride (SiN) or a zinc oxide (ZnO). Moreover, after filling the trench or hole with copper, the preferred method heats, or anneals, the copper-filled trench, thereby promoting voidless consolidation of the copper within the trench or hole.
The preferred embodiment provides at least two advantages over the Hirao and related techniques. First, in contrast to conventional magnetron sputtering, ionized-magnetron sputtering of the first material and the conductor metal forms a trench lining and a metal conductor that more accurately conforms to the trench profile, thus increasing cross-sectional area of the conductor and ultimately reducing its electrical resistance. Second, jet-vapor deposition at an acute incident angle prevents deposition of the second material into the trench or hole and therefore eliminates not only the time-consuming step of etching through the second material to form the trench or hole, but also the time-consuming step of scrubbing deposited material off areas outside the trench or hole.
FIG. 1 is a cross-sectional view of an integrated-circuit assembly;
FIG. 2A is a cross-sectional view of the FIG. 1 integrated-circuit assembly after formation of an insulative layer and a trench;
FIG. 2B is a top view of the FIG. 2A integrated-circuit assembly, showing relative position of the trench;
FIG. 2C is another cross-sectional view of the FIG. 2A integrated-circuit assembly, taken along line C—C to show depth and width of the trench;
FIG. 3 is a cross-sectional view of the FIG. 2A assembly after formation of two diffusion barriers;
FIG. 4 is a cross-sectional view of the FIG. 3 integrated-circuit assembly after formation of a metal layer;
FIG. 5 is a cross-sectional view of the FIG. 4 assembly after removal of a portion of the metal layer;
FIG. 6A is a cross-sectional view of the FIG. 5 assembly taken along line A—A after formation of an insulative layer and a via hole;
FIG. 6B is a top view of the FIG. 6A assembly, showing relative position of the via hole;
FIG. 7 is a cross-sectional view of the FIG. 6A assembly after formation of two diffusion barriers and another metal layer; and
FIG. 8 is a cross-sectional view of the FIG. 7 assembly after removing a portion of the metal layer.
The following detailed description, which references and incorporates FIGS. 1-8, describes and illustrates one or more specific embodiments of the invention. These embodiments, offered not to limit but only to exemplify and teach the invention, are shown and described in sufficient detail to enable those skilled in the art to practice the invention. Thus, where appropriate to avoid obscuring the invention, the description may omit certain information known to those of skill in the art.
FIGS. 1-8 show a number of preferred integrated-circuit assemblies, which taken collectively and sequentially, illustrate the preferred method of the present invention. The method, as shown in FIG. 1, begins with a known integrated-circuit assembly or structure 10, which can be within any integrated circuit, a dynamic-random-access memory, for example. Assembly 10 includes a substrate 12. The term "substrate," as used herein, encompasses a semiconductor wafer as well as structures having, one or more insulative, conductive, or semiconductive layers and materials. Thus, for example, the term embraces silicon-on-insulator, silicon-on-sapphire, and other advanced structures.
Substrate 12 supports a number of integrated elements 14, preferably transistors 14 a and 14 b. Transistors 14 a and 14 b are covered by an insulative layer 16, which preferably comprises silicon oxide, nitride, or oxynitride. Layer 16 includes two aluminum vias 16 a and 16 b electrically connected to respective transistors 14 a and 14 b. Although omitted from FIGS. 1-8 for clarity, assembly 10 preferably includes a titanium-nitride diffusion barrier between vias 16 a and 16 b and transistors 14 a and 14 b.
The first step, exemplified in FIG. 2A, entails forming a one-micron-thick insulative layer 18 atop layer 16 and then forming a trench 20 which will ultimately define a desired conductor for connecting vias 16 a and 16 b. Layer 18, which preferably comprises silicon oxide, may be made using any deposition method. Trench 20 may be made using any selective-material-removal technique, although reactive-ion etching is preferred.
FIG. 2B presents a top view of the assembly, showing the relative position of trench 20, and FIG. 2C presents a cross-section along line C—C, showing depth 20 d and width 20 w of trench 20. In the preferred embodiment, trench 20 is less than 0.25 microns wide and at least one micron deep. Other defining features of trench 20 include two substantially parallel longitudinal edges, or perimeter lines, 20 p and 20 q, which are spaced according to width 20 w, and terminal edges 20 a and 20 b, which determine length of trench 20. The preferred embodiment places terminal edges 20 a and 20 b over respective vias 16 a and 16 b.
The next step, shown in FIG. 3, a cross-section similar to FIG. 2C, entails lining, or coating, trench 20 with an inside diffusion-barrier 22. In the preferred embodiment, diffusion barrier 22 has a uniform thickness ranging between 50 to 100 nanometers, and comprises tungsten (W), titanium-tungsten (TiW), titanium nitride (TiN), or other high-wetting copper-diffusion-barring material. To conform the inside diffusion barrier to the bottom and sidewalls of trench 20, the preferred method forms diffusion barrier 22 through ionized-magnetron sputtering. Ionized-magnetron sputtering more accurately conforms to the profile of trench 20 than conventional sputtering techniques. This ultimately increases the cross section of the desired conductor, and thus reduces its actual electrical resistance.
The next step entails coating the shoulder or external regions of trench 20 with an outside (relative trench 20) diffusion barrier 24. In the preferred embodiment, outside diffusion barrier 24 comprises a silicon nitride (SiN) or a zinc oxide (ZnO) and is approximately 50 to 100 nanometers thick. Moreover, diffusion barrier 24 has edges adjacent longitudinal edges 20 p and 20 q and terminal edges 20 a and 20 b of trench 20. In the preferred embodiment, these edges are substantially even, or flush, with the trench edges to promote optimal reflow of metal into the trench during subsequent annealing steps. In contrast to previous techniques (such as the Hirao technique described in the background) that apply a material on a layer and afterward mask and etch through the material to form a trench (or hole) bordered by the material, the preferred embodiment uses jet-vapor deposition, a high-velocity gas flow technique, to form the outside diffusion barrier after forming the trench, thereby avoiding the time-consuming step of etching through the barrier material.
To achieve this time-savings, the method changes the deposition angle of incidence from the conventional perpendicular incident angle to a glancing incident angle of approximately 86-88 degrees relative the surface plane of layer 18. This is shown as angle 24 a in FIG. 3. In the preferred embodiment, the angular relationship is achieved by tilting the integrated-circuit assembly. While maintaining this relationship between the jet-vapor line of deposition and layer 18, the method rotates the integrated-circuit assembly within a horizontal plane using a rotatable substrate holder (not shown). (However, if desired, a jet-vapor output nozzle may itself be rotated about an axis of the stationary assembly.) This procedure forms diffusion barrier 24 outside and not inside trench 20.
For more information on jet-vapor deposition, refer to U.S. Pat. No. 4,788,082 to Schmitt entitled "Method and Apparatus for the Deposition of Solid Films of a Material from a Jet Stream Entraining the Gaseous Phase of said Material" and U.S. Pat. No. 5,256,205 to Schmitt, III et al. entitled "Microwave Plasma Assisted Supersonic Gas Jet Deposition of Thin Film Materials," both of which are incorporated herein by reference. An additional reference, also incorporated herein, is A. R. Srivatsa et al., "Jet Vapor Deposition: An Alternative to Electro-deposition," Institute of Materials (1994). Further information may also be obtained from the Jet Process Corporation of New Haven, Conn.
Next, to form a metal conductor, the method fills trench 20, as shown in FIG. 4, by depositing a metal layer 26 over the trench and surrounding areas, preferably using ionized-magnetron sputtering. For the one-micron deep trench of the preferred embodiment, a minimum 1.2-micron-thick copper layer is deposited. Preferred conditions for the ionized-magnetron sputtering operation are: target power range of 10-30 kilowatts for a 200-300 millimeter diameter wafer (or integrated-circuit assembly), RF coil power at 3-5 kilowatts, negative DC bias of 100-200 volts, sputtering argon gas pressurized at 1-35 millitorrs. Ionized-magnetron sputtering, which provides greater acceleration of the metal deposition material than conventional sputtering, forces the metal to more closely conform to the interior profiles of holes and trenches. This, in turn, reduces the subsequent annealing time and temperature necessary to achieve an effective reflow and consolidation of the metal into a conductor.
Following the metal deposition is an annealing step. In the preferred embodiment, annealing proceeds for about 5 minutes at approximately 400� C. or for about 30 minutes at approximately 320� C. in a hydrogen atmosphere. For more details on annealing in hydrogen, refer to T. Miyake et al., "Atomic Hydrogen Enhanced Reflow of Copper," Applied Physics Letters, Vol. 70, 1997, which is incorporated herein by reference. The integrated-circuit assembly is then planarized by chemical-mechanical polishing (CMP) to remove metal remaining outside the trench. FIG. 5 shows resulting metal conductor 26′, which electrically connects vias 16 a and 16 b and therefore connects transistors 14 a and 14 b. Formation of conductor 26′ completes the first level of metallization.
FIG. 6A, a cross-section taken along line A—A in FIG. 5, shows that the second level metallization starts with formation of a one-micron-thick dielectric layer 28 and an approximately quarter-micron-diameter (or larger) via hole 28 a. (However, the invention is not limited to particular dimensions.) To enhance performance, dielectric layer 28 should have a dielectric constant as low as possible. The preferred embodiment uses a porous silicon dioxide. (For details on forming this material, see U.S. Pat. No. 5,470,801 entitled "Low Dielectric Constant Insulation Layer for Integrated Circuit Structure and Method of Making Same" which is incorporated herein by reference.) Hole 28 a is preferably formed using reactive-ion etching. FIG. 6B shows the position of hole 28 a relative transistors 14 a and 14 b, vias 16 a and 16 b, and conductor 26′ from the first metallization level.
The next steps form an inside diffusion barrier 30 and an outside diffusion barrier 32, both according to the preferred procedures noted above for barriers 22 and 24. Accordingly, formation of inside diffusion barrier 30 entails ionized-magnetron sputtering, and formation of outside diffusion barrier entails jet-vapor deposition at an acute incident angle. Afterward, the preferred method forms a copper layer 34 over the inside and outside diffusion barriers using ionized-magnetron sputtering and then executes an annealing step. FIG. 8 shows that the resulting integrated-circuit assembly includes a copper via 34′ electrically connected to underlying conductor 26′ and thus also connected to transistors 14 a and 14 b. Subsequent metallizations would follow similarly.
With completion of the desired number of metallization levels, the preferred method ultimately concludes by heat-treating the integrated circuit for one to six hours at a temperature between 100 and 200� C. This heat treatment, which preferably occurs after packaging the integrated circuit in a protective housing, ensures that the metallic structures have minimum resistivity.
The present invention overcomes at least two significant shortcomings of previous interconnection techniques, particularly the Hirao method (described in the background.) First, instead of conventional sputtering to form an inside diffusion barriers, one embodiment of the invention uses ionized-magnetron sputtering to obtain superior sidewall coverage of small via holes and trenches and ultimately yields structures with larger cross sections and thus lower electrical resistance. Second, instead of using conventional techniques which require forming a barrier layer and then etching through it to form a trench, another embodiment uses a tilted jet-vapor deposition which prevents formation of the barrier within the trench and thus eliminates the need to etch through the barrier to form the trench. Moreover, one embodiment of the invention uses zinc oxide, instead of silicon nitride, as an outside diffusion barrier.
The embodiments described above are intended only to illustrate and teach one or more ways of practicing or implementing the present invention, not to restrict its breadth or scope. The actual scope of the invention, which encompasses all ways of practicing or implementing the invention, is defined only by the following claims and their equivalents.
|Cited Patent
|Filing date
|Publication date
|Aug 2, 1956
|Jul 8, 1958
|American Metal Climax Inc
|Copper-zirconium alloys
|Nov 11, 1974
|May 4, 1976
|Amp Incorporated
|Sensitized polyimides and circuit elements thereof
|Dec 24, 1981
|May 31, 1983
|International Business Machines Corporation
|Process for making multilayer integrated circuit substrate
|Jun 1, 1981
|Jan 3, 1984
|International Business Machines Corporation
|Method for forming dense multilevel interconnection metallurgy for semiconductor devices
|Nov 19, 1984
|Mar 4, 1986
|International Business Machines Corporation
|Selective deposition of copper
|Dec 12, 1985
|Nov 29, 1988
|Schmitt Jerome J
|Method and apparatus for the deposition of solid films of a material from a jet stream entraining the gaseous phase of said material
|Aug 25, 1988
|Jun 5, 1990
|Hitachi, Ltd.
|Process for producing semiconductor integrated circuit device having copper interconnections and/or wirings, and device produced
|Apr 14, 1989
|Oct 9, 1990
|International Business Machines Corporation
|Process for fabricating multi-level integrated circuit wiring structure from a single metal deposit
|Oct 13, 1988
|Feb 26, 1991
|Gould, Inc.
|Thin-film electrical connections for integrated circuits
|May 19, 1989
|May 28, 1991
|Nippon Telegraph And Telephone Corporation
|Process for selectively growing thin metallic film of copper or gold
|Jun 25, 1991
|Mar 31, 1992
|Texas Instruments Incorporated
|Copper dry etch process using organic and amine radicals
|Apr 5, 1991
|Oct 27, 1992
|Massachusetts Institute Of Technology
|Microcellular thermoplastic foamed with supercritical fluid
|Mar 24, 1992
|Dec 22, 1992
|Microelectronics And Computer Technology Corporation
|Methods of forming channels and vias in insulating layers
|Jan 7, 1992
|Oct 26, 1993
|Jet Process Corporation
|Microwave plasma assisted supersonic gas jet deposition of thin film materials
|Aug 24, 1992
|Aug 2, 1994
|Massachusetts Institute Of Technology
|Supermicrocellular foamed materials
|Nov 12, 1992
|Oct 11, 1994
|Northern Telecom Limited
|Method for forming interconnect structures for integrated circuits
|Feb 4, 1994
|Aug 15, 1995
|Motorola Inc.
|Semiconductor device having a low permittivity dielectric
|Mar 7, 1995
|Nov 28, 1995
|Fujitsu Limited
|Process for fabricating integrated circuit devices
|Jun 28, 1993
|Nov 28, 1995
|Lsi Logic Corporation
|Low dielectric constant insulation layer for integrated circuit structure and method of making same
|Mar 23, 1994
|Apr 9, 1996
|Kawasaki Steel Corporation
|Interconnection structure for semiconductor integrated circuit and manufacture of the same
|Jun 7, 1995
|Jun 3, 1997
|International Business Machines Corporation
|Method of replenishing electroless gold plating baths
|Jan 16, 1996
|Oct 7, 1997
|Sematech, Inc.
|Selective electroless copper deposited interconnect plugs for ULSI applications
|Jun 5, 1995
|Oct 21, 1997
|Advanced Micro Devices, Inc.
|Processing techniques for achieving production-worthy, low dielectric, low dielectric, low interconnect resistance and high performance IC
|Dec 22, 1992
|Oct 28, 1997
|Elf Technologies, Inc.
|Method for electroplating a substrate containing an electroplateable pattern
|Nov 20, 1996
|Dec 9, 1997
|Cornell Research Foundation, Inc.
|Use of cobalt tungsten phosphide as a barrier material for copper metallization
|Apr 8, 1996
|Jul 14, 1998
|Chartered Semiconductor Manufacturing Ltd.
|Method for chemical-mechanical polish (CMP) planarizing of cooper containing conductor layers
|Jul 25, 1995
|Jul 28, 1998
|Pixtech S.A.
|Anode for a flat display screen
|Sep 18, 1996
|Aug 11, 1998
|Intel Corporation
|High density plasma physical vapor deposition
|Sep 3, 1996
|Sep 1, 1998
|Motorola, Inc.
|Method of decreasing resistivity in an electrically conductive layer
|Apr 14, 1997
|Apr 6, 1999
|Texas Instruments Incorporated
|Process for conductors with selective deposition
|Oct 28, 1996
|Apr 27, 1999
|International Business Machines Corporation
|High aspect ratio low resistivity lines/vias by surface diffusion
|Mar 18, 1997
|Jun 8, 1999
|Applied Materials, Inc.
|Silicon-doped titanium wetting layer for aluminum plug
|Jul 3, 1997
|Aug 3, 1999
|Micron Technology, Inc.
|Semiconductor circuit interconnections and methods of making such interconnections
|Nov 3, 1997
|Oct 26, 1999
|Motorola, Inc.
|Process for forming a semiconductor device
|May 29, 1998
|Nov 9, 1999
|Micron Technology, Inc.
|Method for forming high capacitance memory cells
|Feb 24, 1998
|Nov 16, 1999
|Applied Materials, Inc.
|Oxygen enhancement of ion metal plasma (IMP) sputter deposited barrier layers
|Mar 19, 1997
|Dec 28, 1999
|Texas Instruments Incorporated
|Method of forming diffusion barriers encapsulating copper
|"Kirk-Othmer Concise Encyclopedia of Chemical Technology", M. Grayson (ed), Wiley-Interscience, New York, NY, 433-435, 926-938 (1985).
|"Properties and Selection: Nonferrous Alloys and Pure Metals", Metals Handbook Ninth Edition, 2, ASM International, 157,395, (1979).
|Abe, K., et al., "Sub-half Micron Copper Interconnets Using Reflow of Sputtered Copper Films", VLSI Multilevel Interconnection Conference, 308-314, (Jun. 25-27, 1995).
|Anonymous, "Formation of Conductors at Variable Depths-Using Differential Photomask, Projecting Images into Insulator by Reactive Ion Etching, Selectively Filling Images with Conductor", Research Disclosure, Disclosure No. RD 291015, Abstract, 1 p. (Jul. 10, 1988).
|Anonymous, "Improved Metallurgy for Wiring Very Large Scale Integrated Circuits", International Technology Disclosures, 4, 1 p., (Sep. 25, 1986).
|Anonymous, "Formation of Conductors at Variable Depths—Using Differential Photomask, Projecting Images into Insulator by Reactive Ion Etching, Selectively Filling Images with Conductor", Research Disclosure, Disclosure No. RD 291015, Abstract, 1 p. (Jul. 10, 1988).
|Bai, G., et al., "Copper Interconnection Deposition Techniques and Integration", 1996 Symposium on VLSI Technology, Digest of Technical Papers, 48-49, (1996).
|Braud, E., et al., "Ultra Thin Diffusion Barriers for Cu Interconnections at The Gigabit Generation and Beyond", VMIC Conference Proceedings, 174-179, (Jun. 18-20, 1996).
|Craig, J.D., "Polyimide Coatings", Electronic Materials Handbook, ASM International, 1, Packaging, 105, 768-772, (1989).
|Ding, et al., "Copper Barrier, Seed Layer and Planerization Technologies", VMIC Conference Proceedings, 87-92, (Jun. 10-12, 1997).
|Ernst, et al., "Growth Model for Metal Films on Oxide Surface: Cu on ZnO(0001)-O", Physical Review B, vol. 47, No. 20, 13782-96, (1993).
|Godbey, D.J., et al., "Copper Diffusion in Organic Polymer Resists and Inter-level Dielectrics", Thin Solid Films, 308-309, 470-474 (1997).
|Hirao, S., et al., "A Novel Copper Reflow Process Using Dual Wetting Layers", 1997 Symposium on VLSI Technology, Digest of Technical Papers, 57-58, (1997).
|Iijima, T., et al., "Microstructure and Electrical Properties of Amorphous W-Si-N Barrier Layer for Cu Interconnections", 1996 VMIC Conference, 168-173, (Jun. 18-20, 1996).
|In: Metals Handbook, 8th Edition, vol. 8, ASM Handbook Committee, (eds.), American Society for Metals, Materials Park, OH, p. 300-302.
|In: Packaging, Electronic Materials Handbook, vol. 1, ASM International Handbook Committee (eds.), ASM International, Materials Park, OH, 767-772, (1989).
|Izaki, M., et al., "Characterization of Transparent Zinc Oxide Films Prepared by Electrochemical Reaction", Journal of the Electrochemical Society, vol. 144, No. 6, 1949-52, (Jun. 1997).
|Jayaraj, K., et al., "Low Dielectric Constant Microcellular Foams", Proceedings from the Seventh Meeting of the DuPont Symposium on Polymides in Microelectrics, 474-501, (1996).
|Jin, et al., "Porous Xerogel Films as Ultra-low Permitivity Dielectrics for AILS Interconnect Applications", Advanced Metallization and Interconnect Systems for ULSI Applications, Boston, MA, (Oct. 1996).
|Kang, H.K., et al., Proceedings of the 10th International VLSI Interconnection Conference, 223, (1993).
|Laursen, T., et al., "Encapsulation of Copper by Nitridation of Cu-Ti Alloy/Bilayer Structures", International Conference on Metallurgical Coatings and Thin Films, Abstract No. H1.03, San Diego, CA, 309, (Apr. 21-25, 1997).
|Miller, et al., "Low Dielectric Constant Polyimides and Polyimide Nanofoams", Seventh Meeting of the DuPont Symposium on Polymides in Microelectronics, 443-473, (Sep. 1996).
|Miyake, T., et al., "Atomic Hydrogen Enhanced Reflow of Copper", Applied Physics Letters, vol. 70, No. 10, 1239-41, (1997).
|Murarka, S.P., et al., "Copper Interconnection Schemes: Elimination of The Need of Diffusion Barrier/Adhesion Promoter by the Use of Corrosion Resistant, Low Resistivity Doped Copper", SPIE, 2335, 80-90, (Oct. 20-21, 1994).
|Palleau, J., et al., "Refractory Metal Encapsulation in Copper Wiring", Advanced Metallization for Devices and Circuits-Science, Technology and Manufacturability, Materials Research Society Symposium Proceedings, 337, pp. 225-231, (Apr. 1994).
|Park, C.W., et al., "Activation Energy for Electromigration in Cu Films", Applied Physics Letters, vol. 59, No. 2, 175, (1991).
|Ramos, T., et al., "Nanoporous Silica for Dielectric Constant Less Than 2", Advanced Metallization and Interconnect Systems for ULSI Applications, Boston, MA, (1996).
|Rossnagel, S.M., "Magnetron Sputter Deposition of Interconnect Applications", Conference Proceedings, ULSI XI, Materials Research Society, 227-32, (1996).
|Saarivirta, M.J., "High Conductivity Copper Rich Cu-Zr Alloys", Transactions of the Metallurigical Society of AIME, 218, 431-437, (1960).
|Shacham-Diamand, Y., "100 nm Wide Copper Lines Made by Selective Electroless Deposition", Journal of Micromechanics and Microengineering, 1, 66-72, (Mar. 1991).
|Srivatsa et al., "Jet Vapor Dedposition: an Alternative to Electrodeposition", Surface Engineering, vol. 11, No. 1, pp. 75-77, 1995.*
|Srivatsa, A.R., et al., "Jet Vapor Deposition: an Alternative to Electrodeposition", Surface Engineering, vol. 11, No. 1, 75-77, (1995).
|Tao, J., et al., "Electromigration Resistance of Copper Interconnects", IEEE Electron Devices Letters, vol. 14, No. 5, 249, (1993).
|Ting, C.H., "Low K Material/Process Development", Multilevel Interconnection State-of-the-Art Seminar, Santa Clara, CA, 172-212, (Jun. 21, 1996).
|Tsukada, T., et al., "Adhesion of copper films on ABS polymers deposited in an internal magnet magnetron sputtering system", J. Vac. Sci. Technol., 16(2), pp. 348-351, (1979).
|Van Vlack, L.H., Elements of Materials Science, Addison-Wesley Publishing Co., Inc. Reading, MA, p. 468, (1959).
|Wang, X.W., et al., "Highly Reliable Silicon Nitride Thin Films Made by Jet Vapor Deposition", Japanese Journal of Applied Physics 34, Pt. 1, No. 23, 955-58, (1995).
|Wolf, S., et al., Silicon Processing for the VLSI Era, vol. 1-Process Technology, Lattice Press, Sunset Beach, CA, p. 514-538, (1986).
|Wolf, S., et al., Silicon Processing for the VLSI Era, vol. 1—Process Technology, Lattice Press, Sunset Beach, CA, p. 514-538, (1986).
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|Publication date
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|Methods for making copper and other metal interconnections in integrated circuits
|Mar 6, 2002
|Jul 25, 2002
|Micron Technology, Inc.
|Multilevel copper interconnects with low-k dielectrics and air gaps
|Oct 10, 2002
|Apr 10, 2003
|Pascal Gardes
|Inductance and its manufacturing method
|Feb 25, 2003
|Aug 28, 2003
|Nec Corporation
|Wiring structure in a semiconductor device
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|May 25, 2004
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|Copper dual damascene interconnect technology
|Jul 12, 2004
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|Barrier-metal-free copper damascene technology using atomic hydrogen enhanced reflow
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|Aug 5, 2003
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|Nov 24, 2003
|May 26, 2005
|Micron Technology, Inc.
|Multilevel copper interconnect with double passivation
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|Via-free interconnect structure with self-aligned metal line interconnections
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|Verfahren zur Herstellung einer Sperr-/ Haftschicht und einer Kristallkeimschicht in einer integrierten Schaltkreisanordnung und zugeh�rige integrierte Schaltkreisanordnung
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|European Classification
|Jul 20, 1998
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Bjarke Ingels' firm has unveiled a duplicate version of its website that mimics 1980s video game Arkanoid (+ game). More »
Tag: games
Václav Mlynár combines physical and digital play in Koski board game
Graduate shows 2016: these simple, wooden blocks designed by Royal College of Art graduate Václav Mlynář's contain a door to a hidden world that can only be unlocked by an iPad (+ movie). More »
Indie developer Sensible Object merges physical and digital gameplay with Fabulous Beasts
Future Makers: advances in digital tools are enabling independent game developers to move into hardware as well as software, says Alex Fleetwood of start-up Sensible Object, which is developing a new hybrid game called Fabulous Beasts (+ movie). More »
"The most important design event in the world
is one you've probably never heard of"
Opinion: the Game Developers Conference is refreshingly free of the superstar egos and the luxury brands that dominate architecture biennales and furniture fairs – and much more significant for the future of design, says Kieran Long. More »
Barbecana by Edward Mascarenhas turns
the Barbican into a video game
A graduate from the Bartlett School of Architecture has turned the iconic Barbican Estate in London into the setting for a proposed augmented-reality video game (+ movie). More »
Mini Golf Club by La Bolleur
Milan 2010: Eindhoven collective La Bolleur will construct a mini golf course in Zona Tortona in Milan this April. More »
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Open Water Check-Out Dives!
We are gearing up for a weekend at the Welland Scuba Park! Our OWD students are preparing to complete their certifications! Details are on the calendar!
... take your 1st Breath Underwater
and discover the Underwater World!
Full training and support for
Technical Divers
We are gearing up for a weekend at the Welland Scuba Park! Our OWD students are preparing to complete their certifications! Details are on the calendar!
We will be closed for Friday July 1st for Canada Day. We will reopen on Saturday July 2nd with regular hours. Thanks!
Ready for a summer of fun diving? We are! We have just posted new Open Water Diver sessions as well as Check Out Dives for those who need to complete their program. If you are already a certified diver and you just want to come out for fun and practice, you are more than welcome […]
Long weekend hours: Friday – Closed for Good Friday Saturday – Open 8:00am – 4:00pm Sunday – As Always…Gone Diving…well we wish…
We have posted some new Technical Diving programs into our calendar as well as more Open Water programs. -Intro to Technical Diving – just posted -Sidemount Clinic – info coming soon! Keep checking the calendar for more updates. As always, if there is a specialty course that you want to take that is not listed […]
We have updated our 2016 Dive Travel Schedule. April 16-23, The Dive Academy, in partnership with Squba Holidays, is heading to St. Maarten, Saba & St. Kitts aboard the beautiful Caribbean Explorer II. Join us for a week of amazing Caribbean diving! Check our Dive Travel page for more details.
Dates have changed! Come and learn about the newest, most innovative, state-of-the-art rebreather offered to the market. The SF2 from Scubaforce! March 12th and 13th. 11:30am – 3:30pm www.scubaforceusa.com Please call The Dive Academy to reserve your spot today as space is limited!
We are proud to present our online video gallery of our dive trips! Take a look and see where we travel underwater! More to be added over time.
During the Outdoor Adventure Show, Feb. 19th – 21st, 2016, Dean McConnachie will be presenting "Why are my Pictures Blue?" & Rebreathers 101: Are they right for you?" Also be sure to check out our great friend, Keith Sahm, with his presentation on "A Divers Best Value for Your Dive Holiday" from Sunset House in […]
Canada's largest showcase of outdoor gear and adventure travel experiences! Get $4 off the price of admission to the 2016 Outdoor Adventure Show and be sure to come by our booth, #607!! Click here for the coupon


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On this page you will find prices and informations to buy your digital cameras Kodak EasyShare Z1085 IS with confidence. Wikio Shopping also provide a price evolution based on lasts six weeks, some customers reviews and photos to help you choose the best Kodak products at the best price.
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The good: 5x zoom lens atypical for the price; easy operation; HD video capture with optical zoom. The bad: Occasionally overexposes photos; only three-shot burst mode; mediocre performance. The bottom line: The Kodak EasyShare Z1085 IS is a solid...
The Kodak EasyShare Z1085 IS is a nice surprise. The camera produces quality images, use is simple and it can shoot high definition (720p) video. However, the lack of a wide angle limits it from obtaining a fourth star.
come in time, but quickly discharged baеtery
Bought this some time ago as a back-up point shoot camera and now it's time for back-up and guess what? Same problems described by so many others - horrible battery life and full lock-ups, especially when you have a good shot in front of you.
Latest - Review by CNET (added 17 January'09) Kodak Easyshare Z1085 IS is an Optical image stabilization 10 megapixel point-and-shoot compact digital camera that features a 5x optical zoom, face detection, an ISO range up to 3200, and HD picture...
The Kodak EasyShare Z1085 IS is a solid value with decent photo quality, a well-rounded feature set, and a compact, solid-feeling design.


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Top Definition
passion killers are the exact opposite of sexy underwear -- you peel away a lady's clothes and find here rgular knickers there and can suffer a slight wilting in the pant's department.
I thought we were getting it on tonight but you're wearing your passion killers.
paul grimsley tarafından 24 Ağustos 2006, Perşembe
Trending Now
Can you define these popular missing words?


text:
Well, this was inevitable. I can only wonder why a Yom Kippur/The Hunger Games mashup didn't happen sooner. I just wish Jim Rash had been available to wear the Effie Trinket costume. … [Read more...]
Yom Kippur and the 'Jewish Hunger Games'
Bobbi Brown Chose Yom Kippur Over Fashion Royalty
Makeup artist Bobbi Brown and her eponymous line of cosmetics are both big successes. But unlike some of her peers, Brown has deliberately chosen to live outside of the New York fashion world. She lives in a New Jersey suburb with her husband, who is not a celebrity or mogul, and her children."My husband taught me I don't have to be part of [the scene]," she told T magazine. She told a story in which she became the Sandy Koufax of the beauty world: I remember one time when I really had to m … [Read more...]


text:
Top Definition
As I was cleaning out my colostomy hole he snuck up slid his pecker in my sidedoor.
додав mardijayne 04 Березня 2009
Trending Now
Can you define these popular missing words?
to discretely exit a social situation, leaving the remaining participants confused as to your wherebouts.
man, where the hell is dave? he must have pulled a side door.
yeah man, the guy's girlfriend was stressing me out so i side doored.
yeah man, the guy's girlfriend was stressing me out so i side doored.
додав lewmoz 26 Жовтня 2007
When someone uses a friend to connect to another
Brandon's girlfriend got my number off his phone and tried to side door me for information about where he was last night.
додав Rodneylr 06 Липня 2016


text: Mini Knife Sharpener Flag this deal What's the matter? Choose a reason Dead deal Duplicate Bad link Spam Inaccurate No value Alive again Edit deal shimisi Jun 26, 2012 I don't know about sharpening a knife with such a small thing, but what I do know is that 79 cents-shipped is pretty sweet! Reply Subha83 Jun 26, 2012 Awesome deal.Good reviews and very good price with free shipping. Reply bagofhurt Jun 26, 2012 .79 and free shipping! how do you beat that? Reply zoneric Jun 26, 2012 I saw a few reviews about this. Looks like a good product. Reply poe601 Jun 26, 2012 Great price and excellent reviews. Ordered some to put in Christmas gifts. Reply ancagavs Jun 26, 2012 Excellent item with an excellent price. Works well with the knive set :) Reply dvinegrace83 Jun 25, 2012 def worth a shot with a price like that, and it seems like it'd do the job! Reply shopange08 Jun 25, 2012 nice and handy.. great find! thanks.. Reply mnvikings11 Jun 25, 2012 Totally awesome deal, I'm in for a few. Reply Florida2Texas Jun 25, 2012 Great reviews, great price and free shipping! Couldnt ask for anything better. Thanks Reply deby32953 Jun 25, 2012 Love it! Gotta have it! Reply iowahawkeyes Jun 25, 2012 Hey, it is less than a dollar, so why not get it? Really nice deal, thanks for the post. Reply nimase85 Jun 25, 2012 This seems like a great price for a Mini Knife Sharpener... I might need to get one of these four our kitchen... Reply vimalr Jun 25, 2012 plussed. Getting one for my self. Reply bigsaturn Jun 26, 2012 I just looking for this tiny thing! Reply encorez Jun 25, 2012 be careful with these, you butter fingers....lol Reply gangstabarbie Jun 25, 2012 A knife sharpener eh? Nice invention. Plussed Reply rendraco Jun 25, 2012 Used to own one long time back. It is a safe & easy one to use.. I am in for one for my kitchen!! Plussed. Reply blackfoot Jun 25, 2012 Great deal, think I'll get one just to give it a test drive. Reply arsiel Jun 25, 2012 Surprisingly great reviews for this little gadget at this price! I might just pull the trigger for this little thing :p Reply themoneyman1113 Jun 24, 2012 Great deal. I may pick up a few. My father in law really likes these little gadgets which he would never purchase for himself. Nice find. Reply erick99 Jun 24, 2012 In for one for my toolbox. Always handy to have a knife sharpener around. Very nice find!! Plussed. Reply Load More Comments


text:
Welwyn Garden City,
Hertfordshire. AL7 1QY
Tel: 01707 328846
Fax: 01707 393543
Email: email@example.com
Panshanger is a one-form entry community primary school offering a broad and balanced curriculum to children of mixed abilities aged from three to eleven years. Visits to the school are warmly welcomed.
© 2015 Panshanger Primary School
Site Admin


text:
Aaron Hernandez leaves game with ugly right leg injury
Credit: AP
Patriots tight end Aaron Hernandez left the game with a bad right leg injury during the second offensive series. Hernandez was lined up wide left and blocking for a bubble screen to Julian Edelman in the slot. Edelman got rolled into the back of Hernandez's right leg, and the $40 million man crumbled to the ground in ugly fashion. Hernandez stayed on the ground for a couple minutes, and he was in obvious pain. The medical staff had to help him get off the field and into the locker room, as he couldn't put any weight on the right leg.
The Patriots announced it was an ankle, and his return is questionable.


text:
Wikipedia:Peer review/Dota 2/archive3
From Wikipedia, the free encyclopedia
Dota 2[edit]
This peer review discussion has been closed.
I've listed this article for peer review because I personally believe it is finally ready for Featured Article status after over four years of editing. I believe it fits the criteria of being well-written, comprehensive, well-researched, neutral, stable, featuring attributes that abide by the style guidelines, features media and is of a proper length. This peer review is to ensure that all of Dota 2's ducks are indeed in a row, so please approach this in the same way you would approach a Featured Article nomination.
Thanks, DARTHBOTTO talk•cont 04:40, 3 January 2014 (UTC)
- Comments by David Fuchs
- Threaten me with a wrench or otherwise get my attention if I don't get something here by the end of this weekend. Der Wohltemperierte Fuchs(talk) 14:21, 3 January 2014 (UTC)
- Ugh, hafta' read what I wrote the last time. Anyhow, thoughts:
- It might be good to give more of a high-level overview of the gameplay right at the beginning, since it's mentioned in the lead but not in the actual article that its a MOBA. I'd bring the peer vs. peer aspects up a bit earlier before diving into the scenario/map setting.
- I think the development section could crib a few sources from the DotA article and explain the origins of the gametype, IceFrog's role in development, and its explosion in the eSports scene. As it is once again the article doesn't really draw up the WCIII relevance until later, in an order somewhat inconsistent with the lead.
- To accommodate Dota 2, Valve worked to upgrade the Source engine to include new features, such as high-end cloth modeling, improved global lighting, as well as improvements to Steamworks, which includes a wider expansion of utilities, such as player guides and the coaching system - the coaching system isn't referenced before now, so it shouldn't be referred to with "the".
- The article's overall layout looks much better since last I looked at it.
- I think the prose could still use work, but I think that's much better accomplished by me actually digging in as opposed to nagging you and filling this page with stuff. Just expect it to take a while.
- I'll take a look at references and possible sourcing issues if any on another pass sometime this week. Der Wohltemperierte Fuchs(talk) 02:46, 7 January 2014 (UTC)


text:
Four memorable games later, the Kentucky Wildcats find themselves heading to North Texas and the 2014 Final Four. Thanks in large part to some timely shooting by Aaron Harrison and some strong late game defense, head coach John Calipari has now taken Kentucky to the Final Four three times in five years.
While the Wildcats have looked good so far in the 2014 NCAA tournament, there are questions heading into their Final Four game against Wisconsin. Whether it's injuries or who will guard who, there still are questions to be answered despite how well the Wildcats have played.
This slideshow will take a look at the five biggest questions Kentucky must answer during its Final Four games.


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- Home
- Prague Photo Workshop
- Itinerary
Prague Photo Workshop
Trip Highlights
On Assignment: Photography
Meet Your Expert
At once ancient and modern, Prague provides a unique and inspiring backdrop to explore the creative and technical aspects of photography. From Bohemian kings to Communist rule and revolution, this city has a story to tell. Learn how to seize that story through images during hands-on classes led by our instructors and a National Geographic photographer. Then hit the streets to experience the grandeur, grit, and enchantment of a city that has captured the hearts of artists, musicians, and writers for centuries.
Prague is a visual feast where Gothic, baroque, art nouveau, and cubist architecture mingle with weird and witty modern sculpture, and a creative energy fills the streets. Our base in this captivating city is at the junction of the Old and New Towns, just steps from the National Museum. Spend time in our classroom each day, learning how to develop your eye and improve your technical skills. Then take to the streets in small groups, practicing what you've learned on photo shoots. Climb up to Prague Castle at the "golden hour" to capture the city's iconic skyline, punctuated by a multitude of spires. Ride a boat down the winding Vltava River to catch the city from a different vantage point. At Letná Park, perched on a hilltop overlooking Prague, frame skateboarders in action and panoramic views of the city.
In the evenings, review the day's work or attend seminars led by our National Geographic photographer and instructors as they share their professional experiences and insights. Then head out to photograph the city at night. Document street life against the dazzling lights of Wenceslas Square, or train your lens on the illuminated arches of the Charles Bridge as they cast reflections on the river below.
Escape to the wooded hills and storied villages of South Bohemia on a three-day photo assignment. Stay in a 14th-century hunting estate and work on your landscape photography while hiking through the Šumava forest and exploring pristine rivers. Capture the faces of our village neighbors and step back in time on a shoot in the labyrinthine medieval city of Český Krumlov.
Throughout the workshop we will prepare for a gallery opening that will feature large-print photos of the group's best work. Help organize and curate the exhibit, and share your images on our final night.
Our Photo Workshop Teams
National Geographic Expert: A National Geographic photographer will join the teaching staff for the duration of the workshop to share their insights and experience, and give you guidance and inspiration as you work through each of your photography assignments. The expert joins the classroom lessons and group critiques, works with students one-on-one in the classroom and in the field, and presents during evening seminars.
Photography Instructors: Our workshop instructors are talented and enthusiastic professional photographers from around the world who, along with the National Geographic expert, work with the students on advanced, hands-on knowledge of a broad range of photography skills and disciplines. With a staff to student ratio of 1 to 8, each instructor is able to work with students one-on-one and give personal assignments based on individual skill level and interests.
We stay in dormitory-style accommodations near central Prague and in a small, family-run hotel in South Bohemia. Breakfast is provided at our residence, while other meals range from picnics to sit-down meals at restaurants. Classrooms are equipped with digital projectors so we can share and critique our work.
NoteThroughout the workshop, students will participate in daily photo shoots and edit-and-critique sessions. The program culminates with a gallery opening on the final evening featuring large-format prints of the students' work.
Dates & Tuition2017 Dates & Prices Coming Soon
Dates & TuitionJuly 3 – July 14, 2016
Airfare is not included. We have arranged a round- trip group flight between New York and Prague. Click here for information on transportation to and from expeditions.
When you travel with us, you make a difference.
Proceeds from our student expeditions help fund the National Geographic Society's core mission programs. By traveling with us, you are helping support our grantees and explorers in their efforts to preserve species and habitats, protect cultures, and advance understanding of our incredible planet.
Trip Schedule • My Digital Locker • Scholarship Program • Trip Leader Opportunities •


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James BengocheaYour Photos -
The ancient Japanese art of cultivating #bonsai takes a new dimension today, gaining a lot of popularity amongst households. Let's see more details on these beauteous plants:
Finally, Apple has released a new beta version of iOS 8.4 for developers that comes with an revamped music application. To get more information on beta version, continue reading this blog..
Read More: http://blogs.perceptionsystem.com/apple-releases-ios-8-4-beta-developers
#iOS #iOS84 #AppleiOS #Apple #iOSBeta #BetaVersion #Developers #MobileApps #iPhone #Tech #Technology #Apps #MobileDevelopment #MobileAppDevelopers #TechBlog #TechNews #News #iOS8 #AppleiOS8 #NewVersion #info #technologytrends #trends #reviews2015 #Application
- Liverpool John Moores UniversityIT & Multimedia, 2005 - 2009
Apollo Elusion Womens Mountain Bike
The Apollo Elusion is a stylish womens MTB with front suspension for extra comfort and control.
iPhone5 Charger Cable - Dragon Mall
Product Information This USB 2.0 cable connects your iPhone, iPad or iPod with Lightning connector to your computer's USB port for syncing a
Pin Art Nature River Trees Foliage Wallpapers Hi on Pinterest
Pin the Art Nature River Trees Foliage Wallpapers Hi video on Pinterest
Catch Notes
Use Catch to capture what matters. Catch Notes is a feature-packed app that allows you to capture your ideas and experiences in text, voice,
Bookmark Sentry - Chrome Web Store
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- University of FloridaLaw, 1964 - 1967
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Dragon Age: Origins
Best way to level up characters
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- Dragon Age: Origins
- Best way to level up characters
neomage23x 7 years ago#1
I was just wondering........but what is usually the best way to allocate the attribute points you get when you level up? especially in the early parts of the game?
Do you pump all of the points into the key stats for the character type, getting those stats into high numbers, while ignoring the lesser stats and leaving them low?
For example, a Warrior should prob focus on Str, Dex, and Con. Will would prob be a 2nd focus, then Cunning ( mainly for persuasion/coercion ), then Magic......
When you 1st create a warrior, he already has his Str and Dex stats higher.
So.....when you allocate the 1st 5 points, and for the 1st few times you level up, should you focus on the "neglected" stats and boost them up a bit?
Or, should you just continue to boost the main stats ( Str, Dex, Con ) by pumping all of the points you receive each time you lvl up to get that stat really high? And then concentrate on the other stats.....
IOW....should you try to build a "well-rounded" character, where the main stats are higher, but the other stats aren't too far behind?
Or....build a character by raising the main stats to really high levels first?
I put all my points into a certain stat for each level. For example if I was putting points into dex, I put all 3 into. Then I would level up a different stat my next level. I also took stat requirement for skills into consideration. I usually leveled up the stats I need for skills I wanted first..such as the last level of duel wielding..I believe you need something like 36 dex for it.
neomage23x (Topic Creator)7 years ago#3
Look at all the skills/talents you can unlock with that char, decide which you want the most. Look at the stat requirements for those skills. Upgrade those attributes until you can unlock everything you want to use. Be happy and sow mayhem.
When in doubt, put points in the main category for your class. So in a rogue, just dump them into DEX and CUN until you know what you want to do. If you are feeling a strong desire to plow points into anything else early on, you might not have chosen the right class for you ;)
"Those willing to give up essential liberities for temporary security, deserve neither liberty or security." -Ben Franklin
i pretty much plowed my war's str stats up at first just so i could wear the dragon armor, then i focused on balancing him out the rest of the game, he's pretty much been unstoppable.
I concerned about equipment for my rogue, in particular having the strength necessary for the weapons are armor I want. Whats the most strength you need for top tier longswords and leather armor?
Not that high pha, and rogues base most of their defense off of evasion, which is controlled by DEX. I would say if it concerns you, take your rogue up to about 24. Any more than that and you might have chosen the wrong class for your play style ;)
"Those willing to give up essential liberities for temporary security, deserve neither liberty or security." -Ben Franklin
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Thank you to all of you for making Food From the Bar such a huge success! In just five weeks, our amazing legal community came together and accomplished:
$697,182 raised
6,299 pounds of food collected
1,724 volunteer hours contributed to the SF-Marin Food Bank
Thank you and congratulations to our winners this year!
Most Points Earned: The Fremont Group
Top Fundraiser: The Fremont Group
Per Capita Winner: Kaufhold Gaskin LLP
Top Food Donor: Orrick, Herrington & Sutcliffe LLP
Most Volunteer Hours: The Fremont Group
Kickoff Award: Keker & Van Nest LLP
Munger Games Winner: Munger, Tolles & Olson LLP
Learn more about the campaign and rules here
Follow Food From the Bar on Facebook
#FoodFromtheBar #RaisetheBarSF
Follow the SF-Marin Food Bank on Social Media
Contact Katy Mann or Winnie Tsang with any questions.


text:
"I think they should actually enforce it some more," said L.C. Valley resident Nathan Logsdon.
The bill, which was approved by house lawmakers in March, with a 29 to six vote, outlaws texting by all drivers.
"When you're looking at your cell phone, answering your cell phone, dropping the cell phone, you're not paying attention to driving, which is what you should be doing," said L.C. Valley resident Annette Schraufnegel.
"People can't do those two things at one time, they can't drive and text," said LC Valley resident Frank Ehrmantraut. "It's unbelievable what they do on the highways. I moved out here from New Jersey and the accidents were like every other mile, people were just texting, and I come out here and it's starting to move the same way out here."
The Senate Bill 1274 focuses on texting alone and does not mention other common smartphone functions. This means anyone with access to the web or other applications can do so. However, the Lewiston Police Department said that won't stop them from pulling you over.
"Surfing the internet would meet the definition of texting while driving, because you're sending data, you're receiving data, and you're doing that on a hand held device," said Lewiston Police Department Caption Roger Linear . "Essentially, the goal of that code is to eliminate distractions from driving."
Being able to stop drivers from texting alone would discourage the practice and save lives. Although people may continue to send texts while driving, the ban would give officers an avenue to potentially prevent a tragedy.
"It will probably save a lot of lives," said Ehrmantraut. "I'm all in favor of it."
"It's a great idea," said Schraufnagel. "I think people are more apt to pay attention road versus looking at their cell phone."
Thirty-five other states, and the District of Columbia, have nixed texting while driving. Idaho joins them as the 36th.
"I don't know what the statistics are and if it's actually helped with accidents," said Logsdon. "But, I think it's a good idea to at least make it illegal."
Violators will be cited with a non moving traffic violation. That means the ticket would not cost them any point on their license.
The ban on texting and driving goes into full effect on Sunday July 1st.


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Contact Us
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Next offering Winter 2014
Credit Towards a Certificate
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Continuing Education
12 Weeks
There are no set times you must be online each week. It is recommended you visit the course site at least 3 times a week. Students should expect to spend 6 - 10 hours per week on completing the elements of the marketing and communications plan.
$549.00 Regular Tuition Fee
Department: Equine GuelphCentre for Open Learning and Educational Support
Heather Gentles
Marketing and communications are an essential part of a strong business plan. Marketing success involves targeting your business communications at a diverse group of audiences. Your customers, potential customers, community members, different levels of government, associations, regulatory bodies are examples of audiences you will market the sale of your goods and services and the promotion of yourself and your business. This course focuses on the dynamic equine industry using a variety of examples to reflect the industries diversity. Key points discussed will help you to develop effective marketing and communications strategies for your equine business.
This course is entirely online, so no travel to the University of Guelph is required.
NOTE: This course is a core (required) course in the Certificate in Equine Business Management program. For details about this Certificate program, please visit the program website. Students in the Diploma in Equine Studies program may use this course as an elective.
Individuals interested in marketing in the equine industry.
Client groups targeted includes small business owners, equine business managers, horse owners, trainers, grooms, breeders, stable employees, veterinary technicians, industry representatives, coaches and individuals with an interest in horses. This course is open to all students.
This course is one of three courses offered in the Certificate of Equine Business Management which we suggest you complete as a series of courses:
Equinomics: The Secret to Making Money with your Horse Business (Tentative)
Author(s): Lanier Cordell
Published by: Esprit de Equestre Publishing in 2003
For more information
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These course details are based on information provided to date by the associated academic department or the course instructor. Course specific information remains subject to change until the actual date of course commencement. In the event of a discrepancy between the course information provided here and on the course website, the course website will be taken as official.
Continuing Education at OpenEd provides innovative, high-quality professional development programs that reflect the unique teaching expertise and research strengths of the University of Guelph. We offer over 100 courses delivered to students in 26 countries, creating a network of learners who bring a rich, diverse cultural experience to our courses and programs.
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Open Learning and Educational SupportContinuing EducationUniversity of GuelphJohnston Hall, Room 160Guelph, ON N1G 2W1 Canada
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The English Language Programs at OpenEd offer English language learners an opportunity to develop their vocabulary, academic skills and overall understanding of Canadian culture.
Our programs have been developed to meet the English language requirements of international students entering undergraduate and graduate degree programs at the University of Guelph.
Open Learning and Educational SupportEnglish Language ProgramsUniversity of GuelphJohnston Hall, Room 160Guelph, ON N1G 2W1 Canada
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The Open Learning program--an open admission, distance-only mode of study--provides access to online degree-credit university courses. The program is well suited for individuals looking to study independently but not currently interested in pursuing a degree. The Open Learning program extends the academic resources of the University to those interested in personal enrichment, professional development or eventual application to a degree program. You may also register in the Open Learning program to satisfy program requirements from other post-secondary institutions.
Open Learning and Educational SupportUniversity of GuelphJohnston Hall, Room 160Guelph, ON N1G 2W1 Canada
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Open Learning and Educational SupportDistance EducationUniversity of GuelphJohnston Hall, Room 160Guelph, ON N1G 2W1 Canada
Classroom Technical Support's primary focus is the learning environment in the University's centrally-reserved classrooms.
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The Educational Development unit at OpenEd supports the University of Guelph's instructors and academic programs as they continually improve their teaching practices and the quality of student learning outcomes and experiences. In addition to offering a variety of workshops and individual consultations on teaching and learning, the unit provides facilitative leadership on program-level curriculum initiatives, teaching conferences, and the scholarship of teaching and learning.
Open Learning and Educational SupportEducational DevelopmentUniversity of GuelphDay Hall, 2nd floorGuelph, ON N1G 2W1 Canada
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Email CourseLink SupportEmail OpenEd Technical Support


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The University football team's summer weight-lifting program will kick off at 9:30 a.m. Monday in the University High School weight room.
The program is open to all players who will be part of the Bulldog's football team this fall.
Workouts will take place Monday-Thursday. Evening times will be announced when sessions become available.


text:
14 search results for Motion City Soundtrack
Motion City Soundtrack - "Go"
Type: Event | Date: Tuesday, Jun 12, 2012Featuring the single, "True Romance"
Motion City Soundtrack - The meaning of Timelines
Type: Video | Date: Monday, May 21, 2012Pop-rock band Motion City Soundtrack discusses the meaning of 'Timelines,' a new song from their fifth full-length album "Go" due on June 12. This track exclusively premieres on HitFix.
Exclusive Premiere: Motion City Soundtrack's 'Timelines' is ready to 'Go'
Type: Post | Date: Monday, May 21, 2012Check out the 2nd song to arrive from the Minneapolis pop-rock band's set
10 Stories you might have missed: Roland Emmerich reveals secrets of 'Independence Day' sequels
Type: Article | Date: Saturday, Mar 30, 2013Also: Chevy Chase and Beverly D'Angelo may go on another 'Vacation'
Almost Alice
Type: Event | Date: Tuesday, Mar 2, 2010Alty pop starlets, indie mainstays, and emo-lite kids make stabs at songs inspired by Alice in Wonderland
Listen: 'Almost Alice' soundtrack takes us down the rabbit hole with several surreal, wonderful tunes
Type: Post | Date: Tuesday, Feb 23, 2010'Alice in Wonderland' inspired-by set features Avril Lavigne, Motion City Soundtrack, Robert Smith, 3Oh!3 and many more
Spoon, 'Crazy Heart' soundtrack, Grammy noms set top Jan. 19 releases
Type: Post | Date: Monday, Jan 18, 2010Can anyone push Vampire Weekend out of the top spot?
Various Artists - Sex in the City 2: Original Motion Picture Soundtrack
Type: Event | Date: Tuesday, May 25, 2010The gals' latest movie, as scored by Alicia Keys, Liza Minnelli and the Sex in the City Men's Choir, among others
Bamboozle Festival adds 60 new acts, including Mike Posner and Kreayshawn
Type: Post | Date: Wednesday, Jan 18, 2012New crop Join headliners Foo Fighters, Bon Jovi and Skrillex
EXCLUSIVE first listen: Owl City combines with Mark Hoppus for new track 'Dementia'
Type: Post | Date: Tuesday, Apr 17, 2012Blink-182 singer and electro-pop star are a perfect combo


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Next year a new Kinect for Windows is coming!
- Posted: May 27, 2013 at 6:00AM
- 4 comments
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By now, most of you likely have heard about the new Kinect sensor that Microsoft will deliver as part of Xbox One later this year.
Today, I am pleased to announce that Microsoft will also deliver a new generation Kinect for Windows sensor next year. We're continuing our commitment to equipping businesses and organizations with the latest natural technology from Microsoft so that they, in turn, can develop and deploy innovative touch-free applications for their businesses and customers. A new Kinect for Windows sensor and software development kit (SDK) are core to that commitment.
Both the new Kinect sensor and the new Kinect for Windows sensor are being built on a shared set of technologies. Just as the new Kinect sensor will bring opportunities for revolutionizing gaming and entertainment, the new Kinect for Windows sensor will revolutionize computing experiences. The precision and intuitive responsiveness that the new platform provides will accelerate the development of voice and gesture experiences on computers.
Some of the key capabilities of the new Kinect sensor include:
- Higher fidelity
- Expanded field of view
- Improved skeletal tracking
- New active infrared (IR)
I'm sure many of you want to know more. Stay tuned; at BUILD 2013 in June, we'll share details about how developers and designers can begin to prepare to adopt these new technologies so that their apps and experiences are ready for general availability next year.
A new Kinect for Windows era is coming: an era of unprecedented responsiveness and precision.
Project Information URL: http://blogs.msdn.com/b/kinectforwindows/archive/2013/05/23/the-new-generation-kinect-for-windows-sensor-is-coming-next-year.aspx
Contact Information:
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Exciting !.. but while the skeletal thing looks cool.. whats the actual use of this? (in gaming or otherwise)?
What will be the commercial limitations on Kinect for Windows, if any?
@Faraz: of Kinect?
@GEN3RIC: I suggest looking over here. This page has EULA and licensing links. http://www.microsoft.com/en-us/kinectforwindows/develop/community_support.aspx
Comments have been closed since this content was published more than 30 days ago, but if you'd like to continue the conversation, please create a new thread in our Forums, or Contact Us and let us know.


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Need help? Check out our Support site, then
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Earthquake warning issued for Southern California
Giants left fielder Angel Pagan tackles fan on field
Eww: Donald Trump Appeared in a Softcore Porn Back in 2000
Anthony Bourdain says no to dining with Donald Trump:...
Giants bodyslam Dodgers with seven-run inning
This clip proves Durant and Thompson are already living up to...
I tried Shake Shack and In-N-Out side by side — and...
Pacific coast tsunami-risk maps: Building codes tweaked so...
Horoscope for Saturday, 10/1/16 by Christopher Renstrom
Fox News poll confirms: Hillary Clinton won the debate in a...
Monthly Archive for June, 2013
Hmmm…same sex marrieds in states that don't recognize their status
Interesting piece in the San Francisco Business Times last week. Apparently Bank of America says it's "too soon" to say how it will handle a gay employee's request to be relocated to a state where …
U.S.suspending trade privileges with Bangladesh
From AP: The United States is expected to suspend trade privileges for Bangladesh because of concerns over labor rights and worker safety that intensified after hundreds died there in the global …
Brand new neighborhood coming to Hunters Point
Finally. After three years of delays, including the collapse of a $1.7 billion funding deal with a Chinese state bank, construction got under way today to turn the Hunters Point Shipyard and …
Hard times for Orchard Supply Hardware. Good times for Lowe's
In the biggest retail failure nationally this year, the Bay Area's Orchard Supply Hardware declared bankruptcy over the weekend, and looks like it's headed into the arms of an out-of-state big box …
Surveillance: Who's being Orwellian?
9/11 had "profound effect" on Sen. Dianne Feinstein, D-Calif., she told the Chronicle last week. To this day she has nightmares, she said, explaining why she stands behiind the U.S. government's …
San Francisco a place to do business? Hmm….
Just when some thought San Francisco was getting to be a better place to do business, along comes the Board of Supervisors to make some think again. Board president David Chiu's proposed ballot …
The (profitable) business of intelligence gathering
"War's gone corporate," says a character in John le Carré's latest novel, about a public-private covert operation that ends badly. So has U.S. intelligence gathering, as we learn from a consulting …
Amazon grocery delivery in Bay Area?
The Bay Area grocery wars are getting to resemble "Game of Thrones" (without the sex and blood, so far). The latest combatant in a field populated by power players from Safeway and Whole Foods to …
Jack Abramoff on Washingon corruption and "ham handed" Silicon Valley
The central figure in one of the biggest political corruption scandals of modern times will be addressing a University of San Francisco audience this evening on "How to Fix a Corrupt Political …


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Travel writer Maureen Littlejohn spent a year in Swaziland volunteering to help reduce violence against women. The country in southern Africa is a patriarchal and polygamous monarchy, with all the unfairness to women that implies.
For much of my life, International Women's Day has been an honourable but distant commemoration.


text:
Category:92 deaths
From Wikipedia, the free encyclopedia
People who died c. 92.
See also: 92 births.
|Wikimedia Commons has media related to 92 deaths.
Pages in category "92 deaths"
The following 5 pages are in this category, out of 5 total. This list may not reflect recent changes (learn more).


text:
Cowboys Sports Bar
Latest Cowboys review, deals, contact details and opening hours. Discover the Bar food menu, and find nearby restaurants and bars in Karama
An archway next to the President Hotel proudly displays the bar's name, but head down the alleyway and you'll start to think it doesn't actually exist. The first door on your right isn't Cowboys. The non-descript second door on the right has a sign that simply says 'push'. This is Cowboys.
On arrival, it's hard to form a first impression due to the darkness. Make sure you watch out for the small staircase descending into the gloom. But once safely in the bar area, you'll find it's actually quite cosy. Tables line the wall, leading into shadowy corners, and three TVs beam eclectic channels. A pool table takes centre stage, and seems popular with regulars.
Best of all, though, are the prices, especially for hops. Pints come in at under Dhs30, and pitchers for less than Dhs100. Grape by the glass is well priced, too, as are the hair-raising mixed beverages. This certainly isn't the place for a lively gathering with friends, but as a hideaway for a few drinks, give Cowboys a try.
The bottom line
By no means flash, this is a place for a relaxed drink in the dark, not a party. Cowboys Sports Bar
|President Hotel - Karama
|04 334 6565
|Trade Center Road
|Live music, Pool table, Dance floor
|Open daily 2pm-3am
|Credit Cards Accepted:
Cowboys Sports Bar on Map
phils Apr 19, 2011 12:27 am
i want to come back there again...next month..
saravanan Aug 27, 2009 01:52 pm
i m going there every weekend...a very place to relax


text:
LOS ANGELES (AP) - A father who saw his unarmed son fatally shot by Los Angeles police on live television filed a $20 million wrongful death lawsuit in federal court against the city Thursday.
SACRAMENTO AP) - The state Legislature on Thursday overwhelmingly passed a fresh version of a rainy day fund measure for the November ballot, a bipartisan plan that seeks to smooth out the boom-and-bust cycles of state budgeting while creating a clear path for paying down California's massive debts and unfunded liabilities.
• TRUCK GOES INTO FUNERAL HOME IN SAN FRANCISCO: SAN FRANCISCO (AP) - Authorities say a major San Francisco thoroughfare was shut down after a big rig crashed into a funeral home and caught fire.
• CAR PLOWS INTO HOME IN MERCED KILLING 2: MERCED (AP) - Police in the Central Valley say two people died when the car they were in crashed into a home and caught fire.
• BILL INCREASES FINES FOR TEXTING WHILE DRIVING: SACRAMENTO (AP) - California drivers would face tougher consequences for chatting and texting on their cellphones while driving under a bill that passed the California Assembly.
FRESNO (AP) - Excessive groundwater pumping for irrigation in California's agricultural belt can stress the San Andreas Fault, potentially increasing the risk of future small earthquakes, a new study suggests.
STOCKTON (AP) - Gov. Jerry Brown is seeking millions of dollars more to fix problems at an $839 million prison medical complex that was built to help end years of federal court oversight.
SAN FRANCISCO (AP) - San Francisco's landmark Coit Tower reopened to the public on Wednesday after a six-month, $1.7 million upgrade that included the restoration of its famed murals.
SACRAMENTO (AP) - A bill to make California the first in the nation to impose a statewide ban on plastic bags at certain retailers passed a key legislative committee on Wednesday, but the legislation faces staunch opposition from bag manufacturers working to stem a flood of local bans meant to end clutter in landfills and beaches.
LOS ANGELES (AP) - A prominent anti-tax group says it won't oppose a bill that would close a loophole in California's Proposition 13, effectively approving a bid to change the landmark law for the first time since voters passed it 36 years ago.
• POLICE RAID SAN FRANCISCO HELLS ANGELS' CLUBHOUSE: SAN FRANCISCO (AP) - San Francisco police have raided a Hells Angels' clubhouse and arrested one person in connection with an assault.
MOUNTAIN VIEW (AP) - Google is once again selling its Internet-connected eyewear to anyone in the U.S. as the company fine-tunes a device that has sparked intrigue and disdain for its potential to change the way people interact with technology.
CARLSBAD (AP) - Flames engulfed suburban homes and shot up along canyon ridges in the worst of a half-dozen blazes that broke out Wednesday in Southern California during a second day of a sweltering heat wave.
MOUNTAIN VIEW (AP) - Google is planning to release statistics documenting the diversity of its workforce for the first time amid escalating pressure on the technology industry to hire more minorities and women.
LOS ANGELES (AP) - Justin Bieber is under investigation after a woman accused the embattled pop singer of trying to steal her cellphone at a family entertainment center, police said Wednesday.
Page 247 of 645
SAN JOSE (AP) - A man is recovering after being brutally attacked with a knife while playing Pokemon Go in San Jose last week.
LOS ANGELES (AP) - Police arrested a suspect in a 16-year-old homicide after a woman browsing the "most wanted" section of the Los Angeles Police Department ...
LIVINGSTON (AP) - Investigators are collecting medical records and lining up interviews with relatives of a bus driver in a crash that killed four passengers in ...
SAN DIEGO (AP) - Investigators viewed body-camera footage to learn how one San Diego police officer was killed and another seriously injured in a gunbattle during ...
BIG SUR. (AP) - Crews battled a massive wildfire near California's Big Sur that is threatening thousands of homes as it burns for the tenth ...
SACRAMENTO (AP) - The conflict between religious freedom and gay rights has a new battleground - California's religious colleges and universities.
STOCKTON (AP) - A gun stolen from the Stockton mayor's home whose theft he failed to immediately report was used to kill a 13-year-old boy ...
LOS ANGELES (AP) - After leaping from an airplane, Luke Aikins rocketed toward earth for two minutes, and then calmly flipped onto his back at the ...
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The 76ers have reached an agreement to hire veteran NBA executive Rod Thorn as team president, a source with knowledge of the situation said Wednesday night.
Yahoo Sports reported Wednesday that the 69-year-old Thorn had confirmed the deal in a text message. The Sixers are expected to make a formal announcement on Thursday.
Ed Stefanski, who as of Wednesday was the president and general manager of the Sixers, will remain in his role as general manager, but now he will work under Thorn.
The pair worked together in similar roles for six years with the New Jersey Nets, where Thorn was president for a decade. When Russian billionaire Mikhail Prokhorov bought the Nets this spring, Thorn opted against signing a short-term contract and said he "felt my time was up" in New Jersey. He left the Nets on July 16.


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|Home Decor
This pattern is for an easy, reversible afghan or lap throw. It can be knit in any worsted weight yarn. (Or try "baby" yarn for a baby blanket.)
The pattern is written and is easily remembered for a perfect project while sitting in front of the t.v, or at a sit 'n knit!
The afghan has a large garter stitch border, and then "cubes" set in a background of stockinette/reverse stockinette stitch.
4 stitches/inch in stockinette stitch