text: Resources Connection Company Profile (NASDAQ:RECN) Analyst Ratings Earnings Estimates Dividends Insider Trades Headlines Social Company Profile Chart About Resources Connection Resources Connection, Inc. is a multinational consulting firm. The Company's operating entities primarily provide services under the name Resources Global Professionals (RGP). It provides consulting and business initiative support services to its global client base in the areas of accounting; finance; corporate governance, risk and compliance management; corporate advisory, strategic communications and restructuring; information management; human capital; supply chain management; healthcare solutions, and legal and regulatory. It provides its services and solutions to a client base in a range of industries. Its information management practice provides planning and execution services in four primary areas: program and project management; business and technology integration; data strategy and management, and information technology (IT) strategy and advisory. The two primary areas of its human capital practice are change management/business transformation and human resources operations. Industry, Sector and Symbol: Sector: Business Services Industry: Staffing & Outsourcing Services Sub-Industry: Research & Consulting Services Exchange: NASDAQ Symbol: RECN CUSIP: 76122Q10 Key Metrics: Previous Close: $14.6750 Day Moving Average: $14.90200 Day Moving Average: $14.8752-Week Range: $12.30 - $18.71Trailing P/E Ratio: 18.11Foreward P/E Ratio: 15.12P/E Growth: 2.24Market Cap: $531.71MOutstanding Shares: 36,245,000Beta: 1.27Profitability:Net Margins: 5.09%Return on Equity: 8.86%Return on Assets: 7.38%Debt:Current Ratio: 3.20%Quick Ratio: 3.20% Additional Links: Visit Resources Connection's Official WebsiteView RECN on Google FinanceView RECN on Yahoo FinanceView RECN's Company Profile on ReutersSearch for Resources Connection Inc. on Google Companies Related to Resources Connection:Navigant Consulting (NYSE:NCI)TrueBlue (NYSE:TBI)US Ecology (NASDAQ:ECOL)Qiwi PLC (NASDAQ:QIWI)Hertz Global Holdings (NYSE:HRI)National CineMedia (NASDAQ:NCMI)National Research Corp. (NASDAQ:NRCIB)ICF International (NASDAQ:ICFI)Zhaopin Ltd (NYSE:ZPIN)Tarena International (NASDAQ:TEDU) Analyst Ratings Consensus Ratings for Resources Connection (NASDAQ:RECN) (?) The ratings breakdown includes the most recent rating from each analyst that has rated the stock within the last twelve months. The ratings score is a calculation of the average number of sell, hold, buy and strong buy ratings (0-1.5 = Sell, 1.5-2.5 = Hold, 2.5-3.5 = Buy, >3.5 = Strong Buy). The consensus price target is a mean average of the most recent price target set by each analyst that has set a price target for the stock in the last twelve months.Ratings Breakdown: 1 Sell Rating, 1 Buy RatingConsensus Rating:Hold (Score: 2.00)Consensus Price Target: $13.00 (11.38% downside) Analysts' Ratings History for Resources Connection (NASDAQ:RECN) Show: All Ratings For This Stock Only the Most Recent Rating From Each Brokerage DateFirmActionRatingPrice TargetDetails8/17/2016Deutsche Bank AGInitiated CoverageSell$13.004/9/2016Robert W. BairdReiterated RatingBuy(Data available from 9/27/2014 forward) Earnings Earnings History for Resources Connection (NASDAQ:RECN)DateQuarterConsensus EstimateActual EPSRevenue EstimateActual RevenueRelease LinkConference CallDetails10/5/2016 7/14/2016Q416$0.21$0.23$152.20 millionViewListen4/7/2016Q3$0.16$0.16$148.40 millionViewN/A1/6/2016Q216$0.25$0.23$150.90 millionViewN/A10/7/2015Q116$0.16$0.19$148.30 millionViewN/A7/16/2015Q415$0.22$0.21$150.34 million$148.80 millionViewListen4/8/2015Q315$0.12$0.16$146.80 millionViewN/A1/7/2015Q2 15$0.16$0.22$151.50 millionViewN/A10/2/2014Q115$0.13$0.16$143.40 millionViewListen7/17/2014Q414$0.18$0.23$154.97 million$156.80 millionViewListen4/2/2014Q3$0.05$0.06$135.40 million$132.70 millionViewListen1/2/2014Q2$0.15$0.18$139.50 million$146.00 millionViewListen10/1/2013Q114$0.12$0.09$133.43 million$131.70 millionViewN/A7/16/2013Q4 2013$0.15$0.13$141.67 million$140.20 millionViewN/A4/2/2013Q3 2013$0.11$0.11$140.88 million$138.00 millionViewN/A12/20/2012Q2 2013$0.17$0.14$143.95 million$141.20 millionViewN/A10/2/2012Q113$0.12$0.12$138.01 million$136.90 millionViewN/A7/12/2012$0.15$0.21ViewN/A3/28/2012$0.08$0.10ViewN/A1/4/2012$0.12$0.11ViewN/A10/4/2011$0.05$0.06ViewN/A7/14/2011$0.10$0.12ViewN/A3/31/2011$0.07$0.02ViewN/A1/5/2011$0.08$0.09ViewN/A(Data available from 1/1/2011 forward) Estimates Earnings Estimates for Resources Connection (NASDAQ:RECN)Current Year EPS Consensus Estimate: $0.83 EPSNext Year EPS Consensus Estimate: $0.97 EPS Dividends Current Dividend Information for Resources Connection (NASDAQ:RECN)Annual Dividend:$0.44Dividend Yield:3.00%Payout Ratio:54.32% (Based on Trailing 12 Months of Earnings) 53.01% (Based on Current Year Consensus EPS Estimate)45.36% (Based on Next Year Consensus EPS Estimate)Dividend History for Resources Connection (NASDAQ:RECN)AnnouncedPeriodAmountYieldEx-Dividend DateRecord DatePayable Date8/2/2016quarterly$0.112.94%8/22/20168/24/20169/21/20164/27/2016quarterly$0.102.71%5/17/20165/19/20166/16/20161/26/2016quarterly$0.102.75%2/16/20162/18/20163/17/201611/3/2015quarterly$0.102.2%11/23/201511/26/201512/24/20158/3/2015quarterly$0.102.46%8/21/20158/25/20159/22/20154/28/2015quarterly$0.082%5/19/20155/21/20156/18/20151/27/2015quarterly$0.081.9%2/17/20152/19/20153/19/201510/28/2014quarterly$0.082.09%11/18/201411/20/201412/18/20148/5/2014quarterly$0.082.11%8/26/20148/28/20149/25/20144/29/2014quarterly$0.072.06%5/20/20145/22/20146/19/20141/28/2014quarterly$0.072.04%2/18/20142/20/20143/20/201410/29/2013quarterly$0.072.16%11/19/201311/21/201312/19/20137/29/2013quarterly$0.072.12%8/20/20138/22/20139/19/20134/23/2013quarterly$0.062.17%5/14/20135/16/20136/13/20131/29/2013quarterly$0.061.98%2/19/20132/21/20133/21/2013(Data available from 1/1/2013 forward) Insider Trades Insider Trading History for Resources Connection (NASDAQ:RECN)Insider Ownership Percentage: 8.60%Institutional Ownership Percentage: 87.39%Transaction DateInsider NameTitleBuy/SellNumber of SharesAverage Share PriceTotal TransactionDetails5/11/2016Anne ShihDirectorSell2,430$15.08$36,644.40 1/8/2016Anthony CherbakCEOBuy2,000$14.00$28,000.00 10/9/2015Tracy B. StephensCOOSell18,000$17.04$306,720.00 7/24/2015Anthony CherbakCEOBuy1,500$15.03$22,545.00 1/14/2015Anthony CherbakCEOBuy2,000$17.14$34,280.00 1/13/2015Tracy B StephensCOOBuy1,500$16.91$25,365.00 10/29/2013Tracy B StephensCOOSell2,500$13.25$33,125.00 7/30/2013Donald B MurrayChairmanSell33,147$13.12$434,888.64 7/25/2013Kate W DucheneEVPSell25,000$13.39$334,750.00 7/24/2013Donald B MurrayChairmanSell36,045$13.18$475,073.10 (Data available from 1/1/2013 forward) Headlines Latest Headlines for Resources Connection (NASDAQ:RECN)DateHeadlineResources Global Professionals to Announce Fiscal 2017 First Quarter Results on October 5, 2016 (NASDAQ:RECN)www.publicnow.com - September 7 at 7:07 PMResources Connection Shares Could Trade Down To $13, Deutsche Bank Warns (NASDAQ:RECN)www.benzinga.com - August 19 at 6:56 PMResources Global Professionals names CFO and chief accounting officer (NASDAQ:RECN)www2.staffingindustry.com - August 19 at 6:56 PMResources Connection, Inc. (RECN) Ex-Dividend Date Scheduled for (NASDAQ:RECN)www.nasdaq.com - August 19 at 6:56 PMCFO Moves: Resources Connection (NASDAQ:RECN)blogs.wsj.com - August 18 at 10:08 AMResources Global Professionals Announces New Chief Financial Officer (NASDAQ:RECN)www.publicnow.com - August 17 at 7:27 PMRESOURCES CONNECTION INC Files SEC form 8-K, Change in Directors or Principal Officers, Regulation FD Disclosure, Fin (NASDAQ:RECN)biz.yahoo.com - August 17 at 7:27 PMRESOURCES CONNECTION INC Files SEC form 10-K, Annual Report (NASDAQ:RECN)biz.yahoo.com - August 11 at 10:20 AMETF's with exposure to Resources Connection, Inc. : August 9, 2016 (NASDAQ:RECN)www.capitalcube.com - August 9 at 7:22 PMResources Connection, Inc. breached its 50 day moving average in a Bullish Manner : RECN-US : August 8, 2016 (NASDAQ:RECN)www.capitalcube.com - August 8 at 11:48 AMResources Connection Inc. (RECN) is Trading Higher on Unusual Volume for August 03 (NASDAQ:RECN)www.equities.com - August 5 at 10:07 AMResources Global Professionals Announces 10% Increase in Quarterly Dividend and Dividend Payment Date (NASDAQ:RECN)www.publicnow.com - August 2 at 7:26 PMResources Connection, Inc. breached its 50 day moving average in a Bearish Manner : RECN-US : July 25, 2016 (NASDAQ:RECN)www.capitalcube.com - July 25 at 8:36 AMResources Connection, Inc. :RECN-US: Earnings Analysis: Q4, 2016 By the Numbers : July 22, 2016 (NASDAQ:RECN)www.capitalcube.com - July 22 at 10:47 AMResources Connection, Inc. :RECN-US: Earnings Analysis: 2016 By the Numbers : July 22, 2016 (NASDAQ:RECN)www.capitalcube.com - July 22 at 9:02 AMResources Connection, Inc. – Value Analysis (NASDAQ:RECN) : July 18, 2016 (NASDAQ:RECN)www.capitalcube.com - July 18 at 4:14 PMEdited Transcript of RECN earnings conference call or presentation 14-Jul-16 9:00pm GMT (NASDAQ:RECN)finance.yahoo.com - July 15 at 2:28 AMQ4 2016 Resources Connection Inc Earnings Release - After Market Close (NASDAQ:RECN)biz.yahoo.com - July 14 at 7:07 AMResources Connection, Inc. breached its 50 day moving average in a Bullish Manner : RECN-US : July 11, 2016 (NASDAQ:RECN)www.capitalcube.com - July 11 at 9:53 AMResources Connection, Inc. breached its 50 day moving average in a Bearish Manner : RECN-US : June 27, 2016 (NASDAQ:RECN)www.capitalcube.com - June 27 at 11:13 AMResources Global Professionals to Announce Fiscal 2016 Fourth Quarter and Year End Results on July 14, 2016 (NASDAQ:RECN)finance.yahoo.com - June 22 at 4:05 PMETF's with exposure to Resources Connection, Inc. : June 17, 2016 (NASDAQ:RECN)www.capitalcube.com - June 17 at 5:31 PMResources Connection, Inc. breached its 50 day moving average in a Bearish Manner : RECN-US : June 15, 2016 (NASDAQ:RECN)www.capitalcube.com - June 15 at 8:34 AMResources Connection, Inc. :RECN-US: Earnings Analysis: Q3, 2016 By the Numbers : June 13, 2016 (NASDAQ:RECN)www.capitalcube.com - June 13 at 10:00 AMResources Connection Inc. (RECN) Drops 5.26% on June 02 (NASDAQ:RECN)www.equities.com - June 4 at 7:07 PMResources Global Professionals (RGP) to Present at Baird's 2016 Global Consumer, Technology & Services Conference (NASDAQ:RECN)finance.yahoo.com - May 19 at 4:05 PMCommit To Buy Resources Connection At $12.50, Earn 8.1% Annualized Using Options (NASDAQ:RECN)www.thestreet.com - April 15 at 12:04 PMResources Connection, Inc. – Value Analysis (NASDAQ:RECN) : March 10, 2016 (NASDAQ:RECN)www.capitalcube.com - March 10 at 1:15 PMResources Global Professionals to Announce Fiscal 2016 Third Quarter Results on April 7, 2016 (NASDAQ:RECN)finance.yahoo.com - March 9 at 4:05 PMResources Connection, Inc. breached its 50 day moving average in a Bullish Manner : RECN-US : March 8, 2016 (NASDAQ:RECN)www.capitalcube.com - March 8 at 8:17 AMPullman Regional Hospital Deploys Pavisse™ To Enhance Patient Safety (NASDAQ:RECN)finance.yahoo.com - February 3 at 9:00 AMResources Global Professionals Announces Quarterly Dividend Payment Date (NASDAQ:RECN)www.publicnow.com - January 26 at 4:32 PMRESOURCES CONNECTION INC Files SEC form 8-K, Other Events, Financial Statements and Exhibits (NASDAQ:RECN)biz.yahoo.com - January 26 at 4:06 PMSitrick Adds Dennis Kneale, Former Anchor at CNBC and Fox Business Network, Managing Editor of Forbes and Sr. Editor at WSJ and Stuart Pfeifer, Healthcare Journalist at LA Times, As Members of the Firm (NASDAQ:RECN)finance.yahoo.com - January 20 at 2:00 PMResources Connection, Inc. Earnings Analysis: Q2, 2016 By the Numbers (NASDAQ:RECN)www.capitalcube.com - January 20 at 11:10 AMRESOURCES CONNECTION INC Financials (NASDAQ:RECN)finance.yahoo.com - January 12 at 1:04 PMRESOURCES CONNECTION INC Files SEC form 10-Q, Quarterly Report (NASDAQ:RECN)biz.yahoo.com - January 7 at 1:56 PMEdited Transcript of RECN earnings conference call or presentation 6-Jan-16 10:00pm GMT (NASDAQ:RECN)finance.yahoo.com - January 7 at 5:02 AMRESOURCES CONNECTION INC Files SEC form 8-K, Results of Operations and Financial Condition (NASDAQ:RECN)biz.yahoo.com - January 6 at 5:01 PMResources Connection Inc Earnings Call scheduled for 5:00 pm ET today (NASDAQ:RECN)biz.yahoo.com - January 6 at 5:00 PMResources Connection, Inc. Reports Second Quarter Results for Fiscal 2016 (NASDAQ:RECN)www.noodls.com - January 6 at 4:25 PMResources Connection posts 2Q profit (NASDAQ:RECN)sg.finance.yahoo.com - January 6 at 4:23 PMQ2 2016 Resources Connection Inc Earnings Release - After Market Close (NASDAQ:RECN)biz.yahoo.com - January 6 at 7:07 AMWhy It's Time to Detach From Resources Connection (NASDAQ:RECN)www.thestreet.com - January 1 at 6:45 AMResources Global Professionals to Announce Fiscal 2016 Second Quarter Results on January 6, 2016 (NASDAQ:RECN)finance.yahoo.com - December 8 at 4:05 PMMee Memorial Hospital Selects Pavisse™ to Support Quality and Accountability (NASDAQ:RECN)finance.yahoo.com - November 17 at 9:00 AMRESOURCES CONNECTION INC Files SEC form 8-K, Submission of Matters to a Vote of Security Holders, Other Events, Finan (NASDAQ:RECN)biz.yahoo.com - November 3 at 5:01 PM Social Resources Connection (NASDAQ:RECN) Chart for Tuesday, September, 27, 2016 Last Updated on 9/27/2016 by MarketBeat.com Staff


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Meaning of "rave" - Learner's Dictionary
(Definition of "rave noun" from the Cambridge Learner's Dictionary © Cambridge University Press)
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a group of people, especially within a political party, who try to encourage other people to follow a new, more interesting, or more active way of doing things
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Midpoints and Segment Bisectors
A midpoint is a point on a line segment that divides it into two congruent segments.
If are collinear, and is the midpoint of . Any line segment will have exactly one midpoint. When points are plotted in the coordinate plane, you can use slope to find the midpoint between then. We will generate a formula here.
Here are two points, (-5, 6) and (3, 4). Draw a line between the two points and determine the vertical distance and the horizontal distance.
So, it follows that the midpoint is halfway down and halfway over from the upper point to the lower one. The midpoint would then be down 2 (or up -2) from (-5, 6) and over positive 4. If we do that we find that the midpoint is (-1, 4).
Let's create a formula from this. If the two endpoints are (-5, 6) and (3, 4), then the midpoint is (-1, 4). -1 is halfway between -5 and 3 and 4 is halfway between 6 and 2. Therefore, the formula for the midpoint is the average of the values and the average of the values.
Midpoint Formula: For two points, and , the midpoint is
A line, segment, or ray that passes through a midpoint of another segment is called a segment bisector. A bisector cuts a line segment into two congruent parts. A segment bisector is called a perpendicular bisector when the bisector intersects the segment at a right angle.
is the perpendicular bisector of , so and .
For every line segment, there is one perpendicular bisector that passes through the midpoint. There are infinitely many bisectors, but only one perpendicular bisector for any segment.
Determining the Midpoint
Is a midpoint of ?
No, it is not, because and .
Calculating the Midpoint
1. Find the midpoint between (9, -2) and (-5, 14).
Plug the points into the formula.
2. If is the midpoint of and , find .
Plug what you know into the midpoint formula.
Another way to find the other endpoint is to find the difference between and and then duplicate it on the other side of .
values: , so 4 on the other side of 3 is
values: , so -5 on the other side of -1 is
is still (-1, 4). You may use either method.
Drawing a Bisector
Use a ruler to draw a bisector of the segment below.
The first step in identifying a bisector is finding the midpoint. Measure the line segment and it is 4 cm long. To find the midpoint, divide 4 by 2.
So, the midpoint will be 2 cm from either endpoint, or halfway between. Measure 2 cm from one endpoint and draw the midpoint.
To finish, draw a line that passes through the midpoint. It doesn't matter how the line intersects , as long as it passes through .
Investigation: Constructing a Perpendicular Bisector
- Draw a line that is at least 6 cm long, about halfway down your page.
- Place the pointer of the compass at an endpoint. Open the compass to be greater than half of the segment. Make arc marks above and below the segment. Repeat on the other endpoint. Make sure the arc marks intersect.
- Use your straight edge to draw a line connecting the arc intersections.
This constructed line bisects the line you drew in #1 and intersects it at . So, this construction also works to create a right angle.
Example 1
Which line is the perpendicular bisector of ?
The perpendicular bisector must bisect and be perpendicular to it. Only satisfies both requirements. is just a bisector.
Example 2
Find and .
The line shown is the perpendicular bisector. So, . And, .
Example 3
Find the midpoint between (3, 7) and (7, 11)
Interactive Practice
1. Copy the figure below and label it with the following information:
For 2-8, find the lengths, given: is the midpoint of and is the midpoint of is the perpendicular bisector of and and .
- How many copies of triangle can fit inside rectangle without overlapping?
- Construction Using your ruler, draw a line segment that is 7 cm long. Then use your compass to construct the perpendicular bisector. What is the measure of each segment?
- Construction Using your ruler, draw a line segment that is 4 in long. Then use your compass to construct the perpendicular bisector. What is the measure of each segment?
For questions 11-14, find the midpoint between each pair of points.
- (-2, -3) and (8, -7)
- (9, -1) and (-6, -11)
- (-4, 10) and (14, 0)
- (0, -5) and (-9, 9)
Given the midpoint and either endpoint of , find the other endpoint.
- and
- and
- Error Analysis Erica is looking at a geometric figure and trying to determine which parts are congruent. She wrote . Is this correct? Why or why not?
- Construction Challenge Use construction tools and the constructions you have learned in this section to construct two 2 inch segments that bisect each other. Now connect all four endpoints with segments. What figure have you constructed?
Review (Answers)
To view the Review answers, open this PDF file and look for section 1.4.


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Mormon Books Win Awards
Calgary, Alberta—A hint of apprehension hung in the air at the MacEwan Centre on the University of Calgary campus when the Mormon History Association gathered for its annual awards banquet. To the surprise of some, the Best Documentary Book Award went to a work by 34-year-old John S. Dinger, who edited The Nauvoo City and High Council Minutes, a book reflecting the collaboration of some fourteen historians and researchers. The minutes are kind of Pentagon Papers for Mormons. The original documents have been under lock and key at the Mormon Church's History Library in Salt Lake City.
The minutes confirm the role of polygamy in the martyrdom of Mormon founder Joseph Smith (1805-1844) and the bullying of dissenters by Mormon civic leaders in Nauvoo, Illinois, the headquarters for the Mormon Church in the 1840s. They also chronicle the power grab by the Church's Twelve Apostles in expelling from the Church the only surviving member of the First Presidency and heir apparent after Smith's death.
In December 2011, the month Dinger's book was published, the Church History Library made the Nauvoo city council, but not the Nauvoo high council, minutes available to scholars and said it was "an oversight" that the minutes had been restricted. The high council minutes, a record of ecclesiastical controversies, remain sequestered.
"Through a cataloging oversight," wrote Robin Scott Jensen of the Church History Library in the current issue of the Journal of Mormon History, "the Nauvoo City Council Minutes were identified as both restricted and open for research." But independent researchers have confirmed that the original documents were restricted prior to December. Dinger had to rely on typescripts prepared in the 1970s by three different historians.
Dinger is Deputy Prosecuting Attorney in Boise, Idaho, where he works through the complexities of documentary evidence to piece together what happened at crime scenes. He finds the record from early Mormonism to be fascinating. "I think it enriches our understanding of Nauvoo," he writes. "It shows us an intelligent Joseph Smith, a courageous stake president William Marks, and a villain in the apostate John C. Bennett." It also shows "a city being formed from the ground up and the development of an important religious body."
In the introduction to his 700-page book, Dinger calls the minutes a "treasure trove of material relating to the religious and secular life of the early Latter-day Saints."
"These sets of documents are, I believe, two of the most important primary sources for the period," he writes. Regarding the Church's attempts to keep the minutes under wraps, the high council meetings were not originally private, Dinger responds. The meetings were held in rooms that were "crowded to excess" with "curious onlookers." If too many spectators appeared, the council moved to a bigger space "to accommodate the large audience." The high council trial of Smith's councilor, Sidney Rigdon, was held outdoors so everyone could attend. The charges and verdicts and sometimes the minutes were published in Church newspapers to dissuade others from contemplating sin.
"The book is well done and makes a significant contribution to the canon of published primary sources in Mormon studies," writes attorney Morris Thurston, who has done research for the Church Historians Press and wrote the foreword to Dinger's book. The typescripts Dinger drew from are housed in the Beinecke Library at Yale University, the Marriott Library at the University of Utah, and the Merrill-Cazier Library at Utah State University. They were prepared by historians who had access to the documents during the 1970s when the Church History Library's collections were more open.
Other awards announced in Calgary include the Best Book Award for a book from Oxford University Press, Parley P. Pratt: The Apostle Paul of Mormonism, written by University of Richmond English professor Terryl L. Givens and director of publications at the LDS Church History Department Matthew J. Grow. The Best Biography Award went to a volume from Kofford Books of Sandy, Utah, "Swell Suffering": A Biography of Maurine Whipple by southern Utah artist Veda Hale. The Best International Book Award was won by BYU religion professor Reid L. Neilson for To the Peripheries of Mormondom: The Apostolic Around-the-World Journey of David O. McKay, 1920-1921, published by University of Utah Press. A Best Family History Award went to LDS historian William G. Hartley for Another Kind of Gold: The Life of Albert King Thurber. The association also gives an award to a first-time author, in this case to Utah physician Samuel M. Brown for In Heaven as It Is on Earth: Joseph Smith and the Early Mormon Conquest of Death, published by Oxford.
In his review of Dinger's book in the Journal of Mormon History, Jensen asserted that Dinger should have described the physical appearance of the documents, that Dinger should have insisted that Church archivists, like Jensen, show him the documents or help him in "confirming transcriptions and providing descriptions."
"What a clever bit of wordplay," Dinger says in response. "One of the sources I relied on for better understanding the content and providing annotation for readers was Selected Collections from the Archives of the Church of Jesus Christ of Latter-day Saints, a set of 74 DVDs with photographs of documents prepared by Church archivists. Anyone who has used this resource knows the archivists blacked out key information. They look like redacted FBI files."
"The real value of the minutes is that they were recorded in dramatic eye-witness fashion," Dinger says. Readers are introduced to "conflict among the political and religious powerbrokers," and light is shined on "behind-the-scene issues" in Joseph Smith's "struggle for control, the conflicts with significant community leaders, and the pulse-pounding events that ended in Smith's death, followed by the evacuation of the second-largest city in Illinois. As you read, you can feel the tension on every page. The reading is sometimes pretty gripping."
Mormons may be surprised, Dinger explains in the annotation, to learn that the concept of a "high council" is not biblical. Joseph Smith originally met with ad hoc groups to make plans and resolve disputes. Later he formed a permanent council that met in his home, and he called it the "high council of the church of Christ." It became the primary governing Church body and appellate court for other Church councils.
The Mormon History Association
2011 Book Awards (Presented in 2012)
Best Book Award ($2,000)
Parley P. Pratt: The Apostle Paul of Mormonism
by Terryl L. Givens and Matthew J. Grow
The Best Book Award is given to the best book published during the year on Mormon history. It is intended to honor and encourage a sense of purpose, dedication, excellence of study, research, and scholarship in the field of Mormon history. It is funded by Curtis T. Atkisson Jr. in memory of his wife, Mary Ann Atkisson, a lover of history, an accomplished artist, and an MHA member.
Smith-Pettit Best First Book Award ($1,200)
In Heaven as It Is on Earth: Joseph Smith and the Early Mormon Conquest of Death
by Samuel Morris Brown
Awarded for the best first book written by an author in Mormon history, the prize is funded by the Smith-Pettit Foundation, a private organization, in support of scholarly Mormon studies.
Turner-Bergera Best Biography Award ($1,000)
"Swell Suffering": A Biography of Maurine Whipple
by Veda Hale
Given to the best published biography in Mormon history, the award is named after Ella Larsen Turner, a published historian and genealogist. After her death, family members wanted to honor her by encouraging scholarship in personal histories. Her daughter, Ella Ruth Turner Bergera, taught children's literature for 20 years at Brigham Young University and was a published novelist and poet.
Steven F. Christensen Best Documentary History/Bibliography Award ($1,000)
The Nauvoo City and High Council Minutes
John S. Dinger, editor
This award is given to the best published documentary or bibliography on a Mormon topic. Steven Christensen's interest in Mormon history and documents, as well as his love for his family and life generally, was tragically cut short in 1985 with his death by Mark Hoffman. Members of his family created this award in his honor.
Geraldine McBride Woodward Best International Book Award ($1,000)
To the Peripheries of Mormondom: The Apostolic Around-the-World Journey of David O. McKay, 1920-1921
by Hugh J. Cannon, Reid L. Neilson editor
Awarded for the best international Mormon history, the prize honors an outstanding woman who loved her Mormon heritage. Her family funds the award to recognize her advancement of Mormon history and her own place in it.
Winchester Family and Community History Award ($500)
Another Kind of Gold: The Life of Albert King Thurber, a Utah Pioneer, Explorer, and Community Builder
by William G. Hartley
Awarded to the most thoroughly researched family or community history relating to Mormonism prior to 1980, the book may be published commercially or privately. The award is intended to honor the memory of Marjorie June Winchester Scott, a local historian, museum curator, and MHA member. It is funded by her children. Her ancestors, the Winchesters, were early converts who survived the tumultuous first one and a half centuries.


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Reviewed By SFC J (Eagan, MN) Reviewed for a 2008 Audi A5 —8/12/2015 5:11 PM
I haven't installed them yet, but the quality is apparent. Performance will be the key.
Reviewed By charlie c (MEMPHIS, TN) Reviewed for a 2006 GMC Sierra —9/21/2016 8:49 AM
I ordered a combo brake and rotor kit and they sent the wrong brake pads for my vehicle. In necessity I had to purchase brakes locally for the install. They sent the correct brakes in a few days and now I have an extra set for the next change. Customer service was nice and accommodating. I only wish the pads had been correct.


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This Day in History: Happy Birthday, Tempest 2000
April 13, 1994: Atari ships Jeff Minter's Tempest 2000, the highlight of its Jaguar library.
On this day in 1994, Atari began shipping Tempest 2000 for its Jaguar home console, often considered the highlight of the system.
Tempest 2000 was a then-modern update to Atari's original 1980 arcade game. While the original used a vector monitor to simulate its 3D perspective and vanishing point, this update used the built-in 3D capabilities of the Jaguar itself to achieve its effects.
The game was designed by Jeff Minter a British programmer and llama enthusiast known for his impressive and often psychadelic visual effects.
"We are pleased to offer Jaguar players Tempest 2000, which has already captured the attention and praise of the industry's leading game publications," said Atari president Sam Tramiel in a press release issued that day. "Tempest 2000 has hit the ground running -- Jaguar's 64-bit technology has allowed us to make one of the industry's most exciting, challenging games even more outstanding."
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Comments (8)
Nothing wrong with the price...Posted: May 20, 2010 12:00AM PST by Karyyk
Not sure where you guys are getting the figures, but the Jag debuted at $249.99, well below the $300 price point (I think you're probably thinking of the $700 3DO's and CDi's at the time). The Jag also had more good/decent games than people thought, but none of them were big name games from big developers. That Jag had very little third party support, and the ones who did support it just released quick ports of their Genesis/Amiga games thanks to the fact that the Jag had a Motorola 68000 CPU (completely ignoring the GPU and blitter unit). Atari didn't have the clout or money to attract any decent support and the system died a quiet death. The Jag really kind of got me back into gaming at the time, so I owe it that, and I still play Tempest 2000, AvP and Doom from time to time.
Only system i regret getting more than N64Posted: May 07, 2010 12:00AM PST by tical2399
Can't wait to swipe at the ps3 huh. Well maybe if you had the cash to get one you wouldnt pretend to hate it so much. As far as the jaguar having good games, thats pretty much a lie I was stupid enough to own it and it had about 4 good games. AvP, Wolfenstien, Tempest 2000 and....uh.....uh...Rayman, nba Jam T.E and Raiden. So my mistake it had six good games,
JaguarPosted: Apr 13, 2010 12:00AM PST by andyrew
I kind of feel bad for the Jaguar. I get it tried to be different, but their pricing just wasn't realistic. They'd have really been better off to hold out until the 32-bit era came along, and thrown something out for $300 before the PSX hit.
Have it for my saturn...Posted: Apr 13, 2010 12:00AM PST by wolfgang12
With the big ass plastic case.
hmmmmPosted: Apr 13, 2010 12:00AM PST by HPBloodbath
The only Jag game I bought before I returned the whole damn thing. Shitty system but a good game still.


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Granny Wig
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Granny Grey Wig
A Great Granny Wig
Includes: Old style grey wig with traditional bun in the back. Makes a great character wig.
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- One Size Fits Most
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text:
|Publication number
|Publication type
|Application number
|Publication date
|Aug 4, 1987
|Filing date
|Mar 14, 1986
|Priority date
|Mar 14, 1986
|Fee status
|Also published as
|Publication number
|Gary M. Bates, William R. Haaf, Sai-Pei Ting
|Original Assignee
|General Electric Company
|Export Citation
|BiBTeX, EndNote, RefMan
|Patent Citations (1), Referenced by (15), Classifications (16), Legal Events (6)
|External Links: USPTO, USPTO Assignment, Espacenet
Thermoplastic resin compositions having improved impact strength and thermal properties are provided by combining a polyphenylene ether resin, an optional alkenyl aromatic resin and an impact modifier having a core-shell structure comprised of a crosslinked acrylate core and a crosslinked styrene shell which forms an interpenetrating network between core and shell with minimal grafting between the structures.
Polyphenylene ether resins have long been recognized as useful thermoplastic materials for a wide range of applications. Such polyphenylene ether aromatic compositions have superior physical, electrical and thermal properties as well as excellent hydrolytic and dimensional stability.
Polyphenylene ether compositions are combinable with alkenyl aromatic compositions (such as polystyrene) in virtually all proportions and have been improved by the addition of various impact modifiers when additional impact strength is desired. Such impact modifiers are typically natural or synthetic rubber compounds including polymeric and copolymeric compounds such as butadiene rubber, EPDM rubber, di- and triblock copolymers of styrene and butadiene, as well as other elastomeric products. Many of these are commercially available from a variety of sources.
One of the most important impact modifiers for polyphenylene ether-alkenyl aromatic compositions is a saturated rubber known as Kraton G, available from Shell Chemical Company. Kraton G is a saturated triblock copolymer styrene-butadiene-styrene or styrene-ethylene-butylene-styrene (SEBS rubber). These compounds afford useful impact strength improvements as well as superior thermal aging performance. The latter property is especially important in polyphenylene ether-alkenyl aromatic compositions designed for medium to high heat requirement applications. Such superior performance, however, has been achieved at relatively great expense compared to conventionally available impact modification systems and many manufacturers have sought to improve the properties of polyphenylene ether-alkenyl aromatic compositions with other impact modifier candidates.
It has now been discovered that useful polyphenylene ether compounds can be provided which exhibit an improved combination of impact strength and thermal stability in many thermoplastic applications. This improvement is achieved by a combination of the base resin and a modifying compound comprising a crosslinked acrylate core surrounded and interpenetrated by a crosslinked styrene shell. This crosslinked core-shell modifier appears to improve the properties of the basic polyphenylene ether-alkenyl aromatic resin without suffering from the thermal degradation often experienced by conventional modifiers of the unsaturated, i.e. non-hydrogenated type.
The improved thermoplastic compositions of the present invention are based upon a combination of a polyphenylene ether resin, an optional alkenyl aromatic resin, and a property improving amount of a core-shell modifier having a crosslinked acrylate core which is surrounded and interpenetrated by a crosslinked styrene shell. The integrity of the core-shell structure is maintained by the interpenetration and entanglement of the crosslinked components rather than by grafting.
The polyphenylene ethers may be utilized alone or in combination with alkenyl aromatic resins. Particularly preferred are combinations of poly(2,6-dimethyl-1,4-phenylene ether) and polystyrene (especially rubber modified polystyrene known as high impact polystyrene). A preferred thermoplastic base resin will typically be comprised of 10 to 90 weight percent polyphenylene ether and 90 to 10 weight percent of the alkenyl aromatic component.
The base resin can be improved with various amounts of the core-shell modifier depending upon the particular thermoplastic application. Typically, at least 1 part by weight of the core-shell modifier will be required per 100 parts of the polyphenylene ether-alkenyl aromatic base resin combination. Less than one part will not ordinarily provide very much beneficial effect in the overall composition. Also, greater than 40 parts by weight of the core shell modifier will not ordinarily be utilized per 100 parts of the base resin since the beneficial properties of the polyphenylene ether and alkenyl aromatic resins can be overshadowed by the high rubber content of this loading of the core-shell modifier.
In typical embodiments, 5 to 30 parts by weight of the core-shell modifier will be utilized per 100 parts of the base resin.
Regarding the core-shell modifier, a preferred embodiment would be comprised of a crosslinked butyl acrylate core. This acrylate core will ordinarily comprise approximately 40 to 90 weight percent of the core-shell combination. As stated previously, the preferred shell component is comprised of crosslinked polystyrene.
Polyphenylene ethers are a well known class of compounds sometimes referred to as polyphenylene oxides. Examples of suitable polyphenylene ethers and processes for preparation can be found in U.S. Pat. Nos. 3,306,874; 3,306,875; 3,257,357; and 3,257,358. Compositions of the present invention will encompass homopolymers, copolymers and graft copolymers obtained by the oxidative coupling of phenolic compounds. The preferred polyphenylene ethers used as base resins in compositions of the present invention will be comprised of units derived from 2,6-dimethyl phenol. Also contemplated are PPE copolymers comprised of units derived from 2,6-dimethyl phenol and 2,3,6-trimethyl phenol.
A particularly useful polyphenylene ether would be poly(2,6-dimethyl-1,4-phenylene ether) having an intrinsic viscosity (I.V.) greater than, approximately 0.10 dl/g as measured in chloroform at 25� C. The I.V. will typically be between 0.30 and 0.50 dl/g. PPE having high glass transition temperatures will ordinarily improve the stiffness of the resin compositions.
The alkenyl aromatic resins useful in the present invention are typically the well-known styrenic-based materials which are conventionally utilized in combination with polyphenylene ethers. Preferred styrenics are polystyrene and rubber-modified polystyrene (HIPS). The rubber modified styrenes can be provided by combining or grafting natural or synthetic rubber compounds (e.g. polybutadiene, EPDM) with styrene polymers. These well-known materials are available from a variety of commercial sources.
Those skilled in the art will be able to provide impact improved compositions comprising various proportions of the polyphenylene ether resin, the optional alkenyl aromatic resin and the core-shell impact modifier. Conventional thermoplastic compounding technology such as single or twin screw extrusion can be utilized to provide composition of the present invention.
The above-described weight ratios and percentages represent the compositional formulations of the present invention. The order of combining the components to provide final products may be varied as will be described below.
The preferable core-shell interpolymer modifiers are those having a crosslinked acrylate rubber core, such as butyl acrylate. Surrounding this crosslinked core is a shell-like structure of crosslinked styrenic resin, preferably styrene, which surrounds and interpenetrates the crosslinked core. Incorporation of small amounts of other monomers such as acrylonitrile and/or methyl methacrylate with styrene in the shell can also provide useful products if the resulting copolymer shell does not cause significant incompatibility with the polyphenylene ether-polyamide matrix. The integrity of such preferable core-shell structures is maintained by the interpenetrating network of the several crosslinked moieties rather than by grafting the structures together. The interpenetrating network is provided when the monomers forming the shell structure are polymerized and crosslinked in the presence of the previously polymerized and crosslinked acrylate core.
The core-shell interpolymer compositions may be formed by the following type of two-step, sequential polymerization process:
1. emulsion polymerizing an acrylate monomer charge (herein designated "acrylate", for purposes of the present invention), of at least one C2 -C10 alkyl acrylate, C8 -C22 alkyl(meth)acrylate, or compatible mixtures therof, in an aqueous polymerization medium in the presence of an effective amount of a suitable di- or polyethyleneically unsaturated crosslinking agent for such type of monomer, with the C4 -C8 alkyl acrylates being the preferred acrylate monomers for use in this step;
2. emulsion polymerizing a monomer charge of styrene in an aqueous polymerization medium, also in the presence of an effective amount of a suitable di- or polyethyleneically unsaturated crosslinking agent for such monomers, said polymerization being carried out in the presence of the product from Step 1 so that the crosslinked (meth)acrylate and crosslinked styrene components form an interpolymer wherein the respective phases surround and penetrate one another.
Such a two-stage polymerization process is analogous to the three step process for producing an acrylate-styrene-acrylonitrile (ASA) terpolymer, as taught by Yu, et al. in U.S. Pat. No. 3,944,631 (which is hereby incorporated by reference).
This core-shell product, which is used as the interpolymer impact modifier in the PPE-alkenyl aromatic blends of the present invention generally comprises from about 40% to about 90%, by weight, of at least one of the above-identified crosslinked acrylates, and from about 10% to about 60%, by weight, of the crosslinked styrene component. It contains little graft polymerization between the crosslinked styrenic copolymer components and the crosslinked acrylate polymeric component. In the preferred embodiments, the core will comprise 50 to 80 weight percent crosslinked acrylate, based on the weight of crosslinked core and crosslinked shell taken together. Further details regarding this type of polymer composition can be found in the aforementioned U.S. Pat. No. 3,044,731 to A. J. Yu, et al. The core-shell interpolymer provided by the foregoing process can be isolated and dried by conventional means and can be provided in powder or pellet form.
The compositions of the present invention will generally be comprised of approximately 1 to 30 parts by weight of the core-shell interpolymer modifier based upon 100 parts of the base resin. It is particularly preferred that about 5 to 25 parts by weight of the core-shell interpolymer additive will be used per 100 parts of the base resin.
The foregoing constituent ingredients can be compounded and molded by conventional means. The order of mixing and degree of shear experienced during extrusion can be varied. It would be expected that the physical properties could vary as such processing conditions are varied. Those skilled in the art will be able to achieve optimum processing conditions which may vary for different thermoplastic applications.
Thus in one instance, each of the ingredients could be blended and extruded at once, thereby providing thermoplastic resin having a particular property profile. Alternatively it may be desirable to pre-blend or precompound some of the ingredients while the remaining ingredients are charged later in a compounding or extrusion process.
In one embodiment, the polyphenylene ether could be pre-compounded with the core-shell interpolymer impact modifier. Thereafter, the alkenyl aromatic resin could be charged to the extruder downstream, at a point sufficient to provide adequate mixing but with minimum risk of degradation due to excess heat.
Additionally, it is expected that conventional additives such as fillers, pigments, stabilizers, plasticizers and flame retarding compounds can be incorporated in the thermoplastic compositions of the present invention, thereby providing a variety of useful products. For fillers, both reinforcing and non-reinforcing fillers are contemplated, including glass, clay and other mineral fillers. Conventional heat and oxidative stabilizers may be used. Among the useful flame retarding compounds which may be utilized are organic and inorganic halogen and phosphorus compounds with or without synergists such as, for example, antimony trioxide.
Specific embodiments of the present invention are taught in the following examples which are not limiting in any way. All parts are by weight unless otherwise indicated. All of the foregoing U.S. patents are hereby incorporated by reference.
A crosslinked polybutylacrylate core having an interpenetrating, crosslinked polystyrene shell was prepared in a five liter, three-necked flask equipped with a heating/cooling jacket, a Teflon blade agitator, a thermometer and a nitrogen purge.
The following solutions were prepared:
______________________________________Solution A: n-butyl acrylate 751.4 g 1-3 butyleneglycol diacrylate 1.27 gSolution B: Sodium Metabisulfite 1.75 g deionized water 27.4 gSolution C: Ammonium Persulfate 4.84 g deionized water 76.1 gSolution D: styrene 250.6 g divinyl benzene 2.65 g (55% active solution from Dow Chemical)______________________________________
Into the reaction flask was charged: 3,460 g deionized water, the following emulsifying agents: 2.1 g Sipex UB sodium lauryl sulfate (from Alcolac, Inc.) and 4.2 g Aerosol A-268, a disodium sulfosuccinate (from American Cyannamid), and 14.6 g of Solution B. The flask was stirred with N2 sparge at room temperature for 30 minutes, to reduce th 02 content.
Thereafter, 150.5 g of N2 sparged Solution A was added. The flask contents were heated to 55� C. and then 13.5 g of Solution C was added to initiate polymerization.
After 1.5 hours of reaction, a sample showed 4.1% resin solids indicating approximately 96% conversion. The remainder of solution A as well as 14.6 g Solution B and 40.4 g Solution C were added. After 2.5 hours of additional reaction time at 55� C. a sample showed 17.2% resin solids, indicating greater than 97% conversion.
The reaction mixture was cooled to 35� C. and Solution D was added and mixed for 15 minutes at 35� C. The reaction mixture was then heated to 60� C. and the remainder of Solution C was added. The mixture was reacted for 1.25 hours. The temperature was raised to 75� C. and maintained for 45 minutes. A final sample showed 22.4% resin solids indicating a conversion greater than 98%.
The product latex was coagulated in a solution of 0.25 weight percent CaCl2 in methanol at a rate of 1600 ml methanol per 800 ml latex. The coagulum was filtered, rinsed with fresh methanol, and dried in a vacuum oven at 60� C.
The product had a rubber content of 75% by weight, a number average latex particle diameter of 211 nanometers, a swell index in methyl ethyl ketone (MEK) of 8.1 and a percent Gel fraction from MEK extraction of 91.1%.
A crosslinked polybutyl acrylate core with an interpenetrating but uncrosslinked styrene shell was provided in the same manner as for Preparation A, except that the divinyl benzene crosslinker in Solution D was eliminated. A product having a final conversion of approximately 97% was recovered as in Preparation A. The product of preparation B had a rubber content of 75%, an average latex particle diameter of 203 nanometers, a swell index in MEK of 14.4 and a % Gel from MEK extraction of 63.4%.
A crosslinked polybutyl acrylate core with an interpenetrating, crosslinked poly(styrene-co-acrylonitrile) shell was prepard according to the method for Preparation A, except that 30 weight percent acrylonitrile and 70 weight percent styrene monomers were used in Section D.
Experimental thermoplastic blends were mixed by a Henschel mixer, extruded by a 28mm Werner & Pfleiderer twin screw extruder and injection molded into ASTM specimens by a 4 ounce Newbury injection molding machine. Extrusion and molding conditions are described in Table 1. Tables 2-5 describe formulations and properties for compositions of the present invention as well as comparative compositions. Parts are by weight.
All blends contained a total of 1.3 parts by weight of conventional thermoplastic additives ZnO, ZnS and tridecylphosphite. Stereon 840A is a styrene-butadiene rubber compound from Firestone. Kraton G1651 is a styrene-ethylenebutylene-styrene triblock copolymer from Shell Chemical. KM330 is an Acryloid core-shell impact modifier from Rohm & Haas. The polyphenylene oxide is poly(2,6-dimethyl-1.4-phenylene ether) having an intrinsic viscosity of approximately 0.46 dl/g as measured in chloroform at 25� C. The high impact polystyrene is conventional butadiene modified polystyrene. The mineral oil and polyethylene are conventional processing additives. The Izod impact numbers are reported in ft-lb./in., notched. Dynatup falling dart impact is reported in in.-lb. (max. load). Tensile yield and ultimate strengths are KPSI. The degree of delamination was judged from examination of the fractured surfaces of molded parts upon bending, where zero represents no delamination and 5 represents significant delamination.
TABLE 1__________________________________________________________________________ Temperature Profile, �F. SetExtrusion Conditions 1 2 3 4 5 6 Screw Rpm Torque__________________________________________________________________________Samples - Tables 2 & 3 300 450 480 540 540 540 275 approx. 600Samples - Tables 4 & 5 300 450 500 575 575 575 275 approx. 600__________________________________________________________________________ Mold Backpressure Total MeltMolding Condition Temperature �F. (PSI) Cycle (sec.) Temperature �F.__________________________________________________________________________Samples - Tables 2 & 3 170 75 40 575Samples - Tables 4 & 5 200 100 40 605-610__________________________________________________________________________
TABLE 2__________________________________________________________________________ A* B* C* D* 1__________________________________________________________________________ComponentsPolyphenylene Oxide 44 44 44 44 44High Impact Polystyrene 56 56 56 56 56Rubber Modifiers:Stereon 840A 4.95 4.95 4.95 4.95 4.95Kraton G1651 4.95KM330 -- 4.95 -- -- --Preparation A (XL Core/XL Styrene Shell) -- -- -- -- 4.95Preparation B (XL Core/Lin Styrene Shell) -- -- -- 4.95 --Preparation C (XL Core/XL SAN Shell) -- -- 4.95 -- --Mineral Oil 2.2 2.2 2.2 2.2 2.2Polyethylene 1.1 1.1 1.1 1.1 1.1PropertiesHeat Distortion Temperature (�F.) 220 223 224 222 220Flow Channel (in.) 17.0 17.4 18.1 18.0 17.5Izod Impact (Room Temperature) 8.1 6.3 7.6 7.5 7.5(-20� F.) 4.9 2.5 3.3 3.9 4.5(-40� F.) 4.9 2.5 3.2 3.4 3.9Dynatup Impact (Room Temperature) 481 407 462 447 455(-20� F.) 310 171 295 263 248(-40� F.) 280 170 243 218 308Tensile Yield Strength 5.8 5.7 5.7 5.7 5.7Tensile Ultimate Strength 5.6 5.7 5.7 5.8 5.7Tensile Elongation (%) 67 61 75 83 80Delamination (4 in. � 1/8 in.) 0.5 1 1 1 1__________________________________________________________________________ *Comparative Examples
TABLE 3__________________________________________________________________________ E* F* G* H* 2__________________________________________________________________________ComponentsPolyphenylene Oxide 44 44 44 44 44High Impact Polystyrene 56 56 56 56 56Rubber Modifiers:Kraton G1651 9.9 -- -- 13 13KM330 -- 9.9 -- -- --Preparation A (XL Core/XL Styrene Shell) -- -- -- -- 9.9Preparation B (XL Core/Lin Styrene Shell) -- -- -- 9.9 --Preparation C (XL Core/XL SAN Shell) 9.9Mineral Oil 2.2 2.2 2.2 2.2 2.2Polyethylene 1.1 1.1 1.1 1.1 1.1PropertiesHeat Distortion Temperature (�F.) 222 227 228 223 223Flow Channel (in.) 17.9 19.0 21.1 21.5 17.8Izod Impact (Room Temperature) 8.7 3.4 5.9 7.0 8.4(-20� F.) 5.7 1.7 2.0 3.1 5.4(-40� F.) 5.4 1.7 1.9 3.0 4.8Dynatup Impact (Room Temperature) 463 347 411 443 458(-20� F.) 396 108 137 354 286(-40� F.) 410 111 55 173 106Tensile Yield Strength 5.6 5.7 5.6 5.8 5.9Tensile Ultimate Strength 5.4 5.8 5.3 5.7 5.8Tensile Elongation (%) 83 72 49 62 69Delamination (4 in. � 1/8 in.) 0.5 1 4 2 1__________________________________________________________________________ *Comparative Examples
TABLE 4__________________________________________________________________________ I* J* K* L* 3__________________________________________________________________________ComponentPolyphenylene Oxide 72 72 72 72 72High Impact Polysterene 28 28 28 28 28Rubber Modifiers:Kraton G1651 5 -- -- -- --KM330 -- 5 -- -- --Preparation A (XL Core/XL Styrene Shell) -- -- -- -- 5Preparation B (XL Core/Lin Styrene Shell) -- -- -- 5 --Preparation C (XL Core/XL SAN Shell) -- -- 5 13 --PropertiesHeat Distortion Temperature (�F.) 280 284 280 285 288Flow Channel (in.) 12.9 12.3 13.9 14.0 12.7Izod Impact (Room Temperature) 5.1 4.1 4.3 3.9 4.6(-20� F.) 2.8 2.1 2.4 2.4 2.2(-40� F.) 2.3 1.9 2.3 2.3 2.7Dynatup Impact (Room Temperature) 392 376 435 459 379(-20� F.) 165 89 148 160 267(-40� F.) 162 58 54 162 187Tensile Yield Strength 9.2 9.5 9.6 9.9 9.7Tensile Ultimate Strength 7.7 7.7 7.7 7.7 8.1Tensile Elongation (%) 17 21 24 24 17Delamination (4 in. � 1/8 in.) 1 1 3.5 2.5 2__________________________________________________________________________ *Comparative Examples
TABLE 5__________________________________________________________________________ M* N* O* P* 4__________________________________________________________________________ComponentsPolyphenylene Oxide 72 72 72 72 72High Impact Polystyrene 28 28 28 28 28Rubber Modifiers:Kraton G1651 10 -- -- -- --KM330 -- 10 -- -- --Preparation A (XL Core/XL Styrene Shell) -- -- -- -- 10Preparation B (XL Core/Lin Styrene Shell) -- -- -- 10 --Preparation C (XL Core/XL SAN Shell) -- -- 10 -- --PropertiesHeat Distortion Temperature (�F.) 278 287 284 281 281Flow Channel (in.) 13.0 13.5 15.1 16.0 13.6Izod Impact (Room Temperature) 7.1 4.7 4.3 5.2 7.2(-20� F.) 4.0 2.0 2.0 2.3 3.6(-40� F.) 3.3 2.0 2.1 2.6 3.6Dynatup Impact (Room Temperature) 505 423 165 261 464(-20� F.) 356 191 34 31 404(-40� F.) 396 105 43 34 313Tensile Yield Strength 8.6 8.8 8.7 9.1 9.1Tensile Ultimate Strength 7.1 7.3 8.2 8.4 7.4Tensile Elongation (%) 22 23 16 13 18Delamination (4 in. � 1/8 in.) 0.5 2.5 5 5 2.5__________________________________________________________________________ *Comparative Examples
Several blends of polyphenylene oxide and impact modifiers were prepared on a 3/4 inch Brabender single-screw extruder, at a temperature of approximately 310� C. Pellets of the blended products were molded by a 3 ounce Newbury injection molding machine having a melt temperature of 590� F. and a mold temperature of 190� F. The Hostastat HS-1 is a sodium salt of lauryl sulfonate, available from American Hoechst, and is utilized as a flow promoter for PPO, and is especially useful in compositions as here where the PPO is not plasticized with polystyrene. Each blend also contained 0.3 parts of ZnS and ZnO together. Table 6 describes the formulations and physical properties.
TABLE 6______________________________________SAMPLE Q* 5 6 R* S*______________________________________Polyphenylene Oxide 100 100 100 100 100Hostastat (HS-1) 1 1 1 1 1Impact Modifier With -- 5 10 -- --X-Link Styrene ShellImpact Modifier With -- -- -- 5 10Linear Styrene ShellHDT (�F.) 357 355 352 354 354IZOD (FT-LBS/IN) 1.0 2.0 5.0 1.8 3.0GARDNER (IN-LBS) 309 286 244 274 22TENSILE YIELD 10460 10010 9580 10090 7980STRENGTH (psi)TENSILE ULTIMATE 8820 9900 8030 9470 6650STRENGTH (psi)TENSILE ELONG (%) 83 151 75 118 10______________________________________
|Cited Patent
|Filing date
|Publication date
|Mar 8, 1982
|Dec 27, 1983
|Basf Aktiengesellschaft
|Thermoplastic molding materials
|Citing Patent
|Filing date
|Publication date
|Aug 3, 1989
|Jan 15, 1991
|Bayer Aktiengesellschaft
|Reinforced/filled blends of thermoplastic interpolymers and polyamides and a process for their production
|Nov 8, 1989
|Feb 2, 1993
|Takeda Chemical Industries, Ltd.
|Polymer particles, production and use thereof
|Mar 16, 1992
|Apr 27, 1993
|Takeda Chemical Industries, Ltd.
|Core-shell polymer, resin composition and molded articles thereof
|May 14, 1993
|Aug 16, 1994
|General Electric Company
|Polyetherimide ester elastomeric compositions
|Jan 10, 1994
|Dec 27, 1994
|General Electric Company
|Polyphenylene ether compositions having improved flow
|Mar 29, 1995
|Sep 24, 1996
|Sumitomo Chemical Company, Limited
|Thermoplastic resin compositions comprising blends of polyphenylene ether and polystyrene copolymer resins
|Feb 22, 1993
|Nov 11, 1997
|Rohm And Haas Company
|Core-shell impact modifiers for styrenic resins
|Feb 23, 1996
|May 5, 1998
|Shell Oil Company
|Clear polyphenylene ether/block copolymer composition
|Apr 3, 1997
|Mar 14, 2001
|Technology for producing nucleocapsid particle flexibilized polystyrene material
|Apr 3, 1997
|Mar 14, 2001
|Cross-linked nucleocapsid copolymerized particle
|Apr 3, 1997
|Mar 14, 2001
|Nucleocapsid particle flexibilized transparent polystyrene material
|Jun 22, 1988
|Jan 25, 1989
|General Electric Company
|Impact modified poly(alkenyl aromatic) resin compostions
|Mar 29, 1990
|Oct 3, 1990
|Takeda Chemical Industries, Ltd.
|Core-shell polymer, resin composition and molded articles thereof
|May 31, 1990
|Dec 12, 1990
|General Electric Company
|A polyphenylene ether composition characterized by improved melt flow
|Aug 7, 1992
|Mar 10, 1993
|BASF Aktiengesellschaft
|Thermoplastic moulding masses with improved multiaxial toughness
|U.S. Classification
|525/68, 525/152, 525/905, 525/48
|International Classification
|Cooperative Classification
|European Classification
|Mar 14, 1986
Owner name: GENERAL ELECTRIC CORP., A CORP. OF NEW YORK
Free format text: ASSIGNMENT OF ASSIGNORS INTEREST.;ASSIGNORS:BATES, GARY M.;HAAF, WILLIAM R.;TING, SAI-REI;REEL/FRAME:004527/0225
Effective date: 19860311
|Nov 23, 1990
|Fee payment
Year of fee payment: 4
|Dec 27, 1994
|Fee payment
Year of fee payment: 8
|Feb 23, 1999
|Maintenance fee reminder mailed
|Aug 1, 1999
|Lapse for failure to pay maintenance fees
|Oct 12, 1999
|Expired due to failure to pay maintenance fee
Effective date: 19990804


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text:
|Publication number
|Publication type
|Application number
|Publication date
|Jul 10, 2007
|Filing date
|Nov 4, 2004
|Priority date
|Sep 2, 2004
|Fee status
|Also published as
|Publication number
|Kook Hyun Sunwoo, Jong Oh Kwon, Joo Ho Lee
|Original Assignee
|Samsung Electro-Mechanics Co., Ltd.
|Export Citation
|BiBTeX, EndNote, RefMan
|Patent Citations (18), Referenced by (4), Classifications (12), Legal Events (4)
|External Links: USPTO, USPTO Assignment, Espacenet
The present application is based on, and claims priority from, Korean Application Number 2004-69892, filed Sep. 2, 2004, the disclosure of which is hereby incorporated by reference herein in its entirety.
1. Field of the Invention
The present invention relates to a package fabrication method using laser illumination. More particularly, the present invention relates to a Wafer Level Package (WLP) fabrication method capable of welding a lid wafer with a device wafer by using laser illumination.
2. Description of the Related Art
As well known in the art, electronic devices such as a Film Bulk Acoustic Resonator (FBAR) and a Surface Acoustic Wave (SAW) filter are being rapidly reduced in size as well as required of high reliability.
In these days, electronic devices are being rapidly reduced in size and thickness according to various requirements such as functional improvement and reduction in power consumption and device size. FBARs largely used in mobile phones are also following this trend. In the FBARs, accordingly, Chip Size Packages (CSPs) are gradually drawing attention, and Wafer Level Packages (WLP) are also being attempted in various aspects in order to improve productivity while reducing fabrication cost. Such a WLP is generally regarded as a major decisive factor in the competitiveness of a product in the market.
A WLP FBAR as above includes a device wafer having a micro drive unit such as a circuit mounted thereon, a lid or cap wafer coupled to the top of the device wafer and a side wall made of a metal strip for coupling the periphery of the device wafer with that of the lid wafer while sealing an air cavity or internal space designed for seating the drive unit from the outside. The cavity functions to protect internal electrode patterns from bad effects of hostile environments and foreign materials.
WLP electronic devices are fabricated according to a conventional fabrication process as follows: First, a drive unit is formed on a wafer, a cavity surrounding the drive unit is formed, and then a cap or lid is covered on the cavity via adhesive or other suitable bonding techniques to seal the cavity. Since any materials deposited on the top of the drive unit degrades the performance of a device, it is important to separate the lid from the drive unit to a predetermined gap.
Generally in the conventional fabrication process, a plurality of drive units and cavities are generally formed on a bulk wafer, and the bulk wafer is cut into a plurality of package-sized unit wafers each having a drive unit and a cavity before the lid is covered on each of the unit wafers via adhesive and so on.
However, this process has a problem in that following process steps are difficult since the bulk wafer is cut into small package-sized unit areas. In addition, since the lid is coupled to the wafer via adhesive and so on, there is a drawback in that a junction is fragile to external thermal impact.
As an improvement, such a wafer level electronic device can be fabricated into a WLP based upon a technique for designing RF device packages, particularly, eutectic metal bonding.
The eutectic metal bonding hermetically couples a cap or lid to a wafer by using a low temperature thermal reflow technique or an ultraviolet lamp technique. In more detail, a bonding metal strip is formed around a drive unit on a device wafer thereby forming a cavity, a lid is covered on the strip, and the bonding metal strip is melted via the low temperature thermal reflow technique or the ultraviolet technique to couple the lid to the device wafer. Alternatively, a corresponding metal strip may be formed on the lid to bond with the metal strip on the device wafer.
However, the above low temperature or ultraviolet lamp technique has following drawbacks. First, since these bonding techniques are performed at a relatively low temperature, the bonding metal strip is heated for a long time exposed to a heat source and thus the drive unit of the device wafer is also heated along with the bonding metal. This as a result exposes the drive unit to the heat source for a long time, excessively raising the temperature of the drive unit, so that thermal impact is applied to the drive unit degrading its properties. In particular, these bonding techniques need a relatively long working time (e.g., several minutes), and thus cause a higher risk of degradation to the drive unit. In addition, the long bonding operation of the prior art increases the entire process time and thereby lowers the productivity of a packaging process.
In order to overcome the foregoing drawbacks, it is required for the bonding metal strip to couple the upper lid wafer and the lower device wafer together for a short time period in a relative low temperature range which does not give thermal impact or effect to the device drive unit. However, since the device drive unit is made of heat sensitive material such as Au, those metals can rapidly weld via the thermal reflow at a temperature range, which is low enough not to give any thermal impact to the heat sensitive material, are very rare.
The present invention has been made to solve the foregoing problems of the prior art and it is therefore an object of the present invention to provide a WLP fabrication method which can rapidly weld bonding metal strips of device and lid wafers with each other in order to couple the lid wafer with the device wafer while sealing an internal cavity from the outside without giving any thermal effect to a drive unit in the device wafer.
It is another object of the present invention to rapidly couple the device and lid wafers of the WLP by using the laser in order to shorten the entire WLP fabrication process thereby improving workability.
It is further another object of the present invention to bond metals or alloys together with the laser, applying a lower load to the wafers compared to a conventional thermal reflow, in order to prevent any degradation in bonding uniformity and reliability induced from the repulsive force of metal atoms.
It is other object of the present invention to couple a bulk lid wafer with a bulk device wafer before cutting a resultant bulk package into WLP unit in order to prevent high error rates induced from operations such as lid-mounting and metal strip-welding on small-sized wafers.
It is yet another object of the present invention to perform a bonding step to the bulk wafers in order to reduce the entire working time and therefore improve workability.
According to an aspect of the invention for realizing the object, there is provided a method for fabricating wafer level packages, the method comprising the following steps of:
(a) preparing a device wafer having a micro-drive unit arranged in at least one package area and an enclosed metal strip arranged along a periphery of the package area spaced from the drive unit;
(b) preparing a lid wafer having an enclosed metal strip formed thereon matching the metal strip on the device wafer;
(c) mounting the device wafer on a support member with the metal strip facing upward, and mounting the lid wafer on the device wafer with the metal strip of the lid wafer butting on the metal strip of the device wafer;
(d) illuminating a laser beam from a laser source onto the entire package area to weld the metal strips together without thermal effect to the drive unit so as to seal an internal space defined by the metal strips between the wafers; and
(e) cutting a resultant structure along an outer periphery of a resultant welded metal strip.
Preferably, the mounting step (d) comprises mounting an upper jig on the lid wafer, the jig capable of transmitting the laser beam onto the package area.
Preferably, the metal strips are made of at least one selected from the group consisting of Sn, eutectic SnPb, Sn—Ag—Cu, Sn—Ag—Bi, Ag—Sn—Bi—In, Sn—Zn—Bi, An-Cu—Ni and AuSn alloys.
The illumination step (d) illuminates the laser beam preferably for about 0.01 to 10 seconds and more preferably for about 1 to 10 seconds.
Preferably, the illumination step (d) illuminates a plurality of package areas at the same time.
Preferably, the laser source is a YAG laser (1064 nm), a TAG laser or a laser diode (808 nm).
Preferably, the device and lid wafers are made of Si or glass.
Preferably, the lid wafer is made of transparent material.
A preferred embodiment of the present invention will now be described in detail with reference to the accompanying drawings.
A WLP fabrication process according to the preferred embodiment of the invention will be described in general with reference to
First, a bulk device wafer of predetermined thickness and area is prepared, and a plurality of drive units and enclosed bonding metal strips surrounding the respective drive units are formed on one side of the bulk device wafer in S102. Herein parts of the bulk wafer on which the drive units and the metal strips are will be referred to as "package areas" for the convenience's sake of description. Then, a bulk lid wafer of predetermined thickness and area is prepared, and a plurality of enclosed bonding metal strips are formed on one side of the bulk lid wafer to match the bonding metal strips on the bulk device wafer on S104. In S106, the bulk device wafer is mounted on a support, the bulk lid wafer is mounted on the device wafer so that the metal strips of the bulk lid wafer are aligned with the metal strips of the bulk device wafer, and an upper jig is further mounted on the bulk device wafer. Then, a laser beam is illuminated onto the bulk wafers from above to weld the metal strips of the bulk wafers, which are piled one atop the other, to produce a bulk package in S108.
In succession, the bulk package produced through the laser illumination is cut according to the package areas in S110 to produce a plurality of Wafer Level Packages (WLPs) in S112.
As shown in
The bulk device wafer 12 is made of for example Si or glass, and preferably has a thickness of about 1000 μm or less, and more preferably 700 μm or less. Each of the package areas has horizontal and longitudinal dimensions of about 1 mm or less, and each of the drive units 14 has a circuit formed of for example a metal pattern.
The metal pattern is generally made of at least one selected from the group consisting of Au, Cu, Mo, Pt, Ti and alloys thereof, in which melting points of Au, Cu, Mo, Pt and Ti are 1064, 1084, 2610, 1772 and 1675� C., respectively. Preferably, each of the bonding metal strips 16 has a thickness of 50 μm or less, and is made of a material of a melting point significantly lower than those of the above elements or their alloys consisting of the metal pattern. Suitable examples of the bonding metal strips 16 may include pure Sn, eutectic SnPb (63/37), Sn—Ag—Cu, Sn—Ag—Bi, Ag—Sn—Bi—In, Sn—Zn—Bi, An-Cu—Ni, AuSn alloy, AuSn (80/20) and so on, in which for instance pure Sn has a melting point of 231.79� C., eutectic SnPb (63/37) has a melting point of 182.8� C., and AuSn (80/20) has a melting point of 280� C.
Then, as shown in
Upon the preparation of the bulk device and lid wafers 12 and 18 as above, as shown in
The upper jig 32 functions to fix the bulk lid wafer 18 in position with respect to the bulk device wafer 12. The upper jig 32 is made of a transparent material such as glass. Alternatively, those parts of the upper jig 32 corresponding to the package areas may be so designed to transmit the laser beam.
Instead of the upper jig 32, different type of jigs or chucks may be used, which can grasp lateral portions of the bulk lid wafer 18 to locate the bulk lid wafer 18 in position with respect to the bulk device wafer 12 so that the upper side of the bulk lid wafer 18 is exposed from above.
In the meantime, when the bulk lid wafer 18 is mounted on the bulk device wafer 12, a suitable detecting means may be applied to detect whether or not the lid wafer metal strips 20 are aligned with and butted upon the device wafer metal strips 16 in order to adjust the position of the bulk lid wafer 18 in response to a detection result.
A suitable location detecting means may be also applied to more precisely adjust the position of the bulk device wafer 12 and the upper jig 32 when mounting the bulk device wafer 12 and the upper jig 32.
In addition, these detecting means may be connected to a control unit such as a computer in order to raise process precision as well as improve productivity.
Then, as shown in
In this case, sources of the laser beam may include a Yttrium Aluminum Garnet (YAG) laser and a Terbium Aluminum Garnet (TAG) laser. As an instance, a laser welder is available from Pac Tech GmbH of Germany, in the model name of Laplace. In this case, the bulk wafers (e.g., 4 inch wafers) can be illuminated with a laser beam or laser beams having a wavelength of about 1064 nm (YAG) or 808 nm (TAG) under a maximum power of 1.5 kW for about 0.01 to 10 seconds, preferably, for about 0.1 to 1 seconds. Then, the laser illumination can weld the bonding metal strips 16 and 20 together without giving any thermal effect to the metal patterns such as the drive units 14 since the metal patterns have a melting point that is significantly higher than that of the bonding metal strips and thus the metal patterns are not influenced by the laser illumination which is continued only for a short time period to melt the bonding metal strips. In addition, since those metal patterns are of a layered structure which does not adopt any alloy between metal layers to lower the melting point, any thermal degradation does not take place. This as a result can realize the advantage of the invention capable of protecting the drive units from thermal impacts which have been a problem in the thermal reflow of the prior art.
On the other hand, although it has been described in
It is required for about 10 minutes or less to perform the alignment of the bulk wafers 12 and 18 (see
Then, the laser illumination as above causes the bonding metal strips 16 and 22 to completely bond together, thereby producing a bulk package having side walls 24 as shown in
In addition, the foregoing process steps can be performed under the control of a suitable control unit such as a computer in order to improve the workability and precision of the operation.
As described above, since the fabrication process of the invention comprises the step of coupling the bulk device wafer 12 with the bulk lid wafer 18 before cutting the bulk package into the respective WLP units, high error rates induced from operations such as lid-mounting and metal strip-welding on small-sized wafers can be prevented. Also, since the bonding step is performed to the bulk wafers, it is possible to reduce the entire working time and therefore improve workability.
As shown in
As shown in
A WLP produced was according to the WLP fabrication method of the present invention as described above, and a bonded state of the resultant WLP will described with reference to
Four inch (4 in) bulk wafers having a thickness of 700 μm were used, and bonding metal strips were made eutectic Au/Sn (80/20) at a thickness of 50 μm. A laser source was a TAG laser welder commercially available from Pac Tech GmbH of Germany, in the model name of Laplace. A laser beam having a wavelength of about 808 nm was illuminated at an output power of about 400 W for about 0.1 seconds.
Upon the illumination as above, the bonding metal strips 24 were welded together as shown in
The fabrication process as above is performed at a significantly short time period compared to the conventional thermal reflow, and thus it is possible to minimize or remove thermal effect or impact applied to the drive unit having the metal patterns.
Atom (%)
Wt %
Wt % Error
Sn (L)
Au (L)
(Chi-sqd = 1.13, Live time = 120.0 sec)
Since Au/Sn has a melting point of 280� C. at the above ratio, it can be suitably used as a bonding material of the invention.
As described above, the WLP fabrication method of the invention can rapidly weld the bonding metal strips of the device and lid wafers with each other in order to couple the lid wafer to the device wafer while sealing the internal cavity from the outside without giving any thermal effect to the drive unit in the device wafer.
In addition, the invention can rapidly couple the device and lid wafers of the WLP by using the laser in order to shorten the entire WLP fabrication process thereby improving workability.
Also, since the bulk lid wafer is coupled with the bulk device wafer before the bulk package is cut into the WLP units, high error rates induced from operations such as lid-mounting and metal strip-welding on the small-sized wafers can be prevented. Also, since the bonding step is performed to the bulk wafers, it is possible to reduce the entire working time and therefore improve workability.
Moreover, the invention bonds metals or alloys together with the laser, thereby applying a lower load to the wafers compared to the conventional thermal reflow, and therefore can prevent any degradation in bonding uniformity and reliability induced from the repulsive force of metal atoms.
While the present invention has been shown and described in connection with the preferred embodiments, it will be apparent to those skilled in the art that modifications and variations can be made without departing from the spirit and scope of the invention as defined by the appended claims.
In addition, while the FBARs and SAW filters have been disclosed as technical fields of the invention, the invention can be applied to all types of wafer level electronic devices that have air cavities to be sealed.
|Cited Patent
|Filing date
|Publication date
|Apr 10, 1981
|Sep 20, 1983
|Kiyoshi Nagai
|Hermetically sealed flat-type piezo-electric oscillator assembly
|Jul 3, 1986
|Aug 18, 1987
|Amp Incorporated
|Dual slot electrical contact and method of making same
|Aug 22, 1994
|Sep 22, 1998
|Danfoss A/S
|Valve, in particular expansion valve for refrigeration systems, and a method for the manufacture thereof
|Feb 22, 1999
|Nov 2, 1999
|Mitsubishi Denki Kabushiki Kaisha
|Vehicle alternator and method of manufacture therefor
|Dec 20, 1996
|Sep 19, 2000
|Rf Monolithics, Inc.
|Method of forming an electronic package with a solder seal
|Sep 14, 1998
|Feb 27, 2001
|Motorola, Inc.
|Low-profile microelectronic package
|Mar 6, 2002
|Jul 13, 2004
|Robert Bosch Gmbh
|SI wafer-cap wafer bonding method using local laser energy, device produced by the method, and system used in the method
|Mar 9, 2001
|Aug 17, 2004
|Seiko Epson Corporation
|Package sealing method, manufacturing method of electronic device modules, sealing apparatus, and packaged product
|Nov 14, 2003
|Nov 8, 2005
|Stark David H
|Wafer-level hermetic micro-device packages
|Jul 3, 2003
|Jan 3, 2006
|Xponent Photonics Inc
|Micro-hermetic packaging of optical devices
|Jul 26, 2005
|Feb 13, 2007
|United Microelectronics Corp.
|Flip chip package with reduced thermal stress
|Dec 17, 2003
|Jul 15, 2004
|Bewlay Bernard P.
|Hermetical lamp sealing techniques and lamp having uniquely sealed components
|Apr 21, 2005
|Oct 27, 2005
|Michael Gay
|Optical fiber equipped tubing and methods of making and using
|Title not available
|Title not available
|Title not available
|Title not available
|Jan 27, 2004
|Aug 12, 2004
|David Stark
|Hermetic window assemblies and frames
|Citing Patent
|Filing date
|Publication date
|Mar 5, 2013
|Hewlett-Packard Development Company, L.P.
|Wafer bonding method
|Oct 23, 2007
|Feb 28, 2008
|Kirby Sand
|Wafer Bonding Method
|May 31, 2013
|Nov 3, 2015
|Samsung Electronics Co., Ltd.
|Graphic user interface for a display screen or a portion thereof
|May 31, 2013
|Nov 24, 2015
|Samsung Electronics Co., Ltd.
|Graphic user interface for a display screen or a portion thereof
|U.S. Classification
|International Classification
|Cooperative Classification
|European Classification
|Jan 5, 2007
Owner name: SAMSUNG ELECTRO-MECHANICS CO., LTD., KOREA, REPUBL
Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:SUNWOO, KOOK HYUN;KWON, JONG OH;LEE, JOO HO;REEL/FRAME:018714/0571
Effective date: 20041014
|Feb 14, 2011
|Maintenance fee reminder mailed
|Jul 10, 2011
|Lapse for failure to pay maintenance fees
|Aug 30, 2011
|Expired due to failure to pay maintenance fee
Effective date: 20100703


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Arizona Inn
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How has this hotel rated in the past?
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Historical Traveler Reviews Arizona Inn Tucson
Little oasis in the city
Our family of five stayed here at the end April for two nights and really enjoyed the relaxed atmosphere with the convenience of being close to town. The grounds are beautiful and the hotel has such character - we especially enjoyed the walk to the pool for a swim at night. Sometimes with a large resort, the grounds can be overwhelming and places too spread out. This hotel has all the conviences of a large resort in a more intimate and accessible environment. We had a deluxe room with plenty of space for our family. One disappointment - check in was 3 but we didn't get into our room until after 4 - spent 2 hours by the pool waiting for our room. Also beware - the complimentary breakfast that I had read about is only available from June 1st through the summer. There was a complimentary tea every afternoon that we enjoyed, and the rooms included an empty refrigerator which we appreciated. The staff were friendly and helpful. We would definitely choose this hotel again - wished we had stayed longer.
Mixed Bag
I stayed here for 5 days with wife and 2 kids. The hotel and grounds are absolutely beautiful - it really is an oasis within the desert.
I guess my issue with this property is that I never really felt welcome. In the 5 days we were there, none of the employees (other than the maid) smiled or even said "hello". When we walked by anyone, they either looked away or put their head down.
The room we had was set up oddly - perhaps the age of the property - the bathroom was inbetween the two rooms, so we had to walk through the bathroom to get into the other room. I've never seen that before. The soundproofing is awful - we could hear the conversations in the other room like we were there. It also seemed that all the families were in the same wing so as not to "bother" the other guests.
I would stay here again only with the wife - I would not return with the family.
Overall I'd give it a 6 out of 10.
First Class Service & Accomodations at The Arizona Inn
I recently enjoyed a very pleasant stay at The Arizona Inn In Tucson. The staff was very friendly and courteous and the facility was outstanding - well manicured grounds, a large pool, a workout room, and a beautiful library just off the lobby. Our room was spacious and also had a nice supply of reading material including the New York Times, books, and magazines. The food in the dining room was excellent and I also had the opportunity to enjoy a tasty poolside snack, one of the house specialties. A true garden spot within the desert.
Loved This Hotel!!
We loved this quiet and very private resort. I'm just mad we didn't know about it sooner. We've always booked at the Westin Resort which is very fair. The Arizona Inn is such a wonderful place. The grounds are beautiful, and the rooms were very private and nice. The staff couldn't have been BETTER! Everyone was wonderful from the moment we arrived. The FREE breakfast was amazing, as well as the wonderful Ice Cream socials by the pool. This hotel is a MUST STAY if visiting Tucson.
And on a side note, I left my jewlery case in the room by accident and when I arrived home back to Phoenix and realized it, I called immediately and the Arizona Inn Fed Ex'd it to my office the next day! Now that is SERVICE!
I miss it already!
By far the best hotel experience I have had - - like stepping back in time to the 1930s and being treated with civility that is no longer easily found. You're treated like an old time movie star or senator would have been 70 years ago. Service was accommodating but unobtrusive, rooms were beautifullly appointed with comfy pillows and mattresses. The bathroom was appointed with everything you would expect, dressing area was well lit, mini-fridge was perfect for keeping bottled water that's so needed in the desert.
Room service was top notch, and the hotel restaurant and piano bar had a nice variety of options with fantastic presentation.
I can't wait to go back!
Pure Bliss
Of all the places we've been fortunate enough to stay in, the Arizona Inn ranks as number one! The rooms are gracious and comfortable. the staff friendly and accommodating and the martinis, terrific.
We think back wistfully to our stay there. It truly is a little piece of heaven!
Best Hotel We've Ever Stayed At!!
We visited the Arizona Inn in Tucson over Veteran's Day. IT was a wonderful experience! We started our stay by attending the complimentary daily tea in the library. The Inn offers little appetizers and a wide variety of teas. We had booked only a standard, but it felt like a suite. There was a sitting room with TV/DVD, a wet-bar, desk and beautiful view. The bedroom was large as well, with a huge comfortable bed and very DARK!! Everything was clean, orderly, classy and elegant! The service was immpeccable! In the morning we ordered room service it arrived on time and was absolutely delicious. The Inn itself is special - it is no ordinary commercialized big-time resort. It is understated elegance and a real sophisticated but fantastic experience. Inside there are fresh flowers, acres of green gardens, a sparkling pool and tennis courts. The Inn offers all sorts of services like tennis pros and tours around the city. It is located in a ritzy residential area, and is made of AZ signature adobe. The history spans almost 100 years and is filled with many famous figures of the wild west. The restaurant (though we didn't visit it) looked gorgeous and is highly recommended. All in all this was a beautiful and spectacular stay. I can't express how much we enjoyed it!!
A memorable experience
Stayed at the Arizona Inn based on the recommendations on this site. I was not disappointed. Upgraded to a huge room which was awsome. The gift shop was closed due to illness when I checked in around 4pm. With out asking they opened up the gift shop so I could get my daughter a present. The service was incredible. I just wish I had more time. Everything was perfect. Just thinking about the Inn brings a smile to my face. They do "get it". Will be back.
One of most civilized inns in the world
Arizona Inn has to be one of the most civilized inns in the world.
What makes the Arizona Inn such a singular environment:
1) The grounds are extensive -- and the units are 'integrated' into a beautiful landscape.
2) The units -I hesitate using such a 'commerical' term for the lovely rooms- are 'residential' -- with furnishings, art-work, lighting, etc. that have come down through time. The originality of the architecure, furnishings, and artifacts is key to the quality and character of the Inn.
3) The atmosphere is absolutely restful. "Peace, privacy, and sunshine" are the three original concepts used in the Arizona Inn's fliers when it opened in 1930, and they apply today.
4) The wonderful service in emcompassing: in room-service, at the pool, the breakfast buffet, business office, and throughout in every facet of the Inn.
5) The quiet, the courtesy, and utterly seamless service and attention to detail set a standard. After the Arizona Inn, one needs to go back and re-evaluate assessments of any other places -- no place quite meets the standard of civility of the Arizona Inn.
Beauty and Tranquility in Arizona
In February, 2002 my companion and I were fortunate to walk into the Arizona Inn, and book a junior suite for five nights. We really fell in love with the Inn at first sight. Those five days kept us feeling pampered and priveleged. The architecture and landscaping of the Inn held endless pleasures for us. There was a true Southwestern flavor to our surroundings, seemingly the best elements combined with outstanding pool side bar and dining, and very pleasant service. The library had an outstanding regional and eclectic collection, accessible to the guests. The room was supremely comfortable and tranquil. Now I look forward to my son's University of Arizona graduation, not only for his academic achievement, but for another occasion to stay at the Arizona Inn.
TripAdvisor Reviews Arizona Inn Tucson
Travel Blogs from Tucson
New Zealand Travel Guidance You Ought To Know
... in contact directly with the listening audience. I also needed to journey around, because becoming isolated in a studio didn't really feel like the complete image for me. There was something lacking. What: The Asheville Art Museum houses some remarkable long term assortment pieces by American artists from the 20th and 21st century. In addition, you will discover works by previous and current Western North ...
We're Now in Arizona -- After Another Bump
... After spending the night in their parking lot (surrounded by a 7,000 volt electric fence!) we were able to leave at noon today for Catalina State Park just north of Tucson, AZ. We had trailer brakes, flowing propane hoses, a new tire, and some other new parts underneath the trailer. God is good and life is good, but please, NO MORE BUMPS! This state park is beautiful -- it's located at the base of the Santa Catalina Mountains in ...
Here we are in Arizona.
... coming after Dorothy in The Wizard of Oz.
Tucson provided us with a week in a real house. We met our friends Tony and Heather there and together rented a beautiful, modern house near the center of town. Heather planned the week's activities with a scientist's attention to detail and managed to satisfy the whims and desires of each of us.
We all agreed the ...
Our Times in Tucson
... early evening. I guess there are some big jobs in the area which solicit workers throughout the state/from other states.
10/8/14 - Bruce made a service appointment for the motorhome to get some regularly needed maintenance done and we also made an appointment to have Sandy groomed. While the motorhome was in service and Sandy at the groomer, we were able to venture to downtown Tucson. It's really an awesome town - big. The ...
Revisiting the past in more ways than one!!
... br> Other actors who also made a movie here were Brian Keith, Maureen O'Hara, Sidney Poitier, Paul Newman, Clint Eastwood, Gene Wilder and the list goes on. Little House on the Prairie was filmed here.
During the day there are many shows that you can catch, such as a stunt show, gun shootout, dance hall girls, you can take a train or stage coach ride, etc. A little hokey at times, but it was fun ...


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- Andre Bormanis, Star Trek writer and consultant
Topics:Support Planetary Radio
SPECIAL EDITION: Saturn's moon has been revealed as never before by the European Space Agency's Huygens spacecraft. The Planetary Society lets you not just see but HEAR Titan, as we join the celebration. You'll also help explore Saturn in the imagination with Bill Nye the Science Guy, John Rhys-Davies and other special guests. Bruce Betts moderates a panel discussion, and presents a new What's Up! segment and Titanic trivia tournament.
No trivia contest spoilers please!
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