text:
|Publication number
|Publication type
|Application number
|Publication date
|May 20, 2003
|Filing date
|Apr 19, 2000
|Priority date
|Apr 19, 2000
|Fee status
|Publication number
|Michael B. Sinclair, Maarten P. deBoer, Norman F. Smith, Brian D. Jensen, Samuel L. Miller
|Original Assignee
|Sandia Corporation
|Export Citation
|BiBTeX, EndNote, RefMan
|Patent Citations (9), Non-Patent Citations (1), Referenced by (80), Classifications (7), Legal Events (6)
|External Links: USPTO, USPTO Assignment, Espacenet
This invention was made with Government support under Contract DE-AC04-94AL85000 awarded by the U.S. Department of Energy. The Government has certain rights in the invention.
The present invention relates generally to post-process analysis and characterization of micromechanical devices and assemblies, and in particular to automated means for certification of MEMS fabrication processes at the substrate level.
Microelectromechanical systems and their close relatives (which shall be known collectively as MEMS) are becoming attractive for a wide variety of applications, owing to their high functionality, small size, and potentially high reliability and low cost. However, despite the development of a large number of demonstration devices and a small number of commercial devices, design and processing of MEMS-based apparatus remains largely a trial and error process.
Variations in the material properties or gross structure of the MEMS devices can destroy the devices, or simply result in greatly reduced operational lifetimes. For example, two comb-driven micromotors which are apparently identical in structure and operational characteristics when new can show many orders of magnitude difference in the number of rotational cycles required to cause failure. Without sufficient control on the factors leading to such difficulties, widespread commercial application of MEMS technology is not to be expected.
A simplified example of a MEMS fabrication process would involve the deposition, patterning, and planarization of several material layers. The layers comprise such materials as polysilicon, silicon oxides, and silicon nitride. As these materials have different chemical properties, it is possible to use patterned composite structures to form the desired parts from (usually) polysilicon, and then to release the parts from the surrounding materials, primarily using chemical etching. Typical MEMS components have layer thickness of a few microns, and lateral dimensions from perhaps 10 to 1000 microns.
It is easy to list a variety of factors which can alter the functionality of a MEMS device after release. Perhaps the most obvious is the residual stress in the polysilicon components. This residual stress varies from point to point in the processed polysilicon, resulting in residual stress gradients which cause such components to warp in a manner determined by their geometrical structure and the magnitude and direction of the residual stress gradients. Sometimes warping can either be contained or compensated for by the design of the individual component. In other cases, for example meshing gears, where the thickness to diameter ratio can be as small as 1 to 1000, warping of any substantial magnitude cannot be allowed. Even when design can reduce problems associated with warping, a processing glitch which changes the residual stress from the design value can result in fabrication of components with reduced operational lifetimes. Similar problems can appear if the residual stress is not constant over the substrate, if the layer thicknesses vary from the design values, if the layer thicknesses are not consistent across the substrate, or if the surrounding materials are not entirely removed in the release process.
All of the above process errors interfere with the operation of the MEMS device through changing the expected degree of component warping, and do so while the component dimensions remain inside tolerances. Clearly, changes in component geometry will also cause warping to change. In principle such changes can also result from unexpected changes in the elastic properties of the polysilicon from which they are formed. Such changes can occur through a faulty polysilicon deposition (e.g. if voids or impurities are produced), if the surrounding materials are not completely removed in the release process, or (effectively) if geometric flaws in the components produce stress concentrations.
Although component warping is a serious problem, it is not the only route through which process variations can produce faulty MEMS devices. If a gear revolves around a simple hub, the rate of wear will depend on many factors, among which are the levels of friction and stiction between the surfaces, and the clearances, vertical and in shaft-aperture diameter difference, between the moving gear and the fixed hub. Process problems which can alter the expected levels of friction and stiction include producing rough or smooth interaction surfaces on release, not entirely removing the surrounding materials on release, growth of atypical material at the polysilicon/supporting material interfaces, and various types of unwanted surface contamination. The geometric clearances between the hub and the gear can be altered dramatically by small changes in layer thicknesses, by unexpected warping (e.g., the gear may warp so that it is forced up against the top of the hub), and by the presence of surrounding materials which are not entirely removed during the release process.
The above has only begun to touch on the enormous variety of MEMS processing problems that can lead to reduced lifetime of the resulting devices, or even to complete non-functionality. However, it is sufficient to suggest that a major barrier against routine commercial production of complex MEMS devices exists. This problem is made more difficult owing to the difficulty of detecting such process failures, especially in the absence of immediate structural failure when the device is released. An inappropriately warped part can be hidden in an internal portion of the device, where the degree of warping cannot be measured. If it is visible, the detection of an extra half-micron of component warp on a released component which is free to move and vibrate is not an easy challenge. Detection of residual material left after release is very difficult, as the changes in dimensions can be very small. Similarly, surface contamination is difficult to detect, particularly on a substrate with hundreds of highly complex multi-layer devices.
As the MEMS devices being fabricated cannot easily be measured or tested to reveal flaws resulting from processing defects, there is a need for standard test structures which will reveal clearly when such procession defects appear. In addition, in the design process there is a need for the precise measurement of mechanical properties, including the levels of friction and stiction expected in various regimes. This can also be addressed through the use of standard test structures.
Some work has appeared along these lines. However, the results of such measurements, even when carried out on a single substrate, are inconsistent. A group at MIT has examined the use of pull-in cantilever and fixed-fixed beam test structures to evaluate the quality of MEMS devices which are co-fabricated. They used the well-known transition which occurs as an attractive force is applied electrostatically between a supported member and a surface, between gradual bending of the member toward the surface, and abrupt collapse of the member onto the surface. The diagnostic quantity is the pull-in voltage (the voltage at which abrupt collapse occurs), the collapse being detected by the electrical contact made between the member and the surface.
A detailed mechanical model of the apparatus and the electrostatic forces associated not only with deflection of the cantilever, but of the highly nonlinear effects which enter in as the distance between the cantilever and the surface varies (that distance itself being a function of position along the cantilever) must then be used to extract, e.g., elastic properties from the pull-in voltage. However, the same process failures with which a commercial fabricator has to be concerned will act to change the interpretation of that measurement. Residual stress gradients and anchors which do not hold the beam parallel to the wafer surface will change the level of stress needed to get to the pull-in condition, and hence will alter the pull-in voltage with no other signature. Changes in component geometry or material from the expected can seriously alter the results of a pull-in measurement, again with telltale signatures. Finally, pull-in measurements give no information on friction or parallel stiction, although they can be used to infer some information concerning adhesion between surfaces.
To summarize, although the MIT techniques, when combined with state of the art geometric measuring devices, can provide useful information on certain elastic properties on a non-routine basis, it provides neither the breadth of information, nor the reliability of interpretation, which is needed for practical monitoring of commercial processes.
Other techniques have also been utilized to measure mechanical properties of MEMS structures, although they have not been applied to the problem of certification of large-scale commercial manufacture. In addition to the pull-in measurements described above, elastic properties have been measured by determining the resonance frequency of beams, and by measuring the force required to stretch a test member directly. Residual stress has been measured using arrays of buckled beams, passive deformable sensors (usually using capacitance as a probe), and by optically measuring the warping of a released MEMS element.
Unfortunately, the accuracy of these methods has been most unsatisfactory. Values for the Young'modulus vary from 90 to 190 GPa, with the value expected from bulk measurements being about 170 GPa. Similarly, the reported values for residual stress resulting from similar processing procedures vary widely, with the errors between competing techniques often being similar in magnitude to the actual levels of residual stress. In addition, these methods generally cannot resolve residual stresses below about 1 MPa, whereas good process control requires maintaining residual stresses below this value.
There is a need for an integrated and automated system, comprising accurate measuring techniques, equipment, and test structures, which can be used in a production process line to detect processing failures on a substrate-by-substrate basis. The instant invention is intended to address this need.
The invention is directed at providing reliable diagnostic information reflecting the quality of fabrication of MEMS devices. This is accomplished by cofabricating IMaP test structures, and then measuring their deformation behavior under particularly simple conditions of applied stress. The resulting data can be analyzed via detailed mechanical response models of the test structures to obtain useful information ranging from simple quality control feedback to accurate determination of material properties.
FIG. 1 is a schematic illustration of a cantilever beam structure. FIG. 1a shows an ideal unloaded beam, and FIG. 1b shows a beam whose free end is being subjected to a downward force. Note that both the anchor and the substrate also deform in response to this force.
FIG. 2 shows several sources of error in analysis of the deformation of a cantilever beam structure. FIG. 2a shows initial beam deflection driven by a residual stress gradient. FIG. 2b shows irregular initial beam deflection driven by inhomogeneous residual stress distribution in the beam. 2 c shows a beam with an initial offset angle, usually driven by inhomogeneous residual stresses in the anchor.
FIG. 3 shows a cantilever beam in various stages of deformation. FIG. 3a shows a beam which is bent, but not enough to make contact with the substrate. FIG. 3b shows a beam which has adhered to the substrate.
FIG. 4 shows multiply-anchored suspended beams. FIG. 4a is a generic version, while FIG. 4b is a fixed-fixed beam configuration.
FIG. 5 shows several alternate IMaP compliant members. FIG. 5a is a multiply-attached plate, and FIG. 5b is a multiply-attached plate where the plate is multiply connected. FIG. 5c shows an edge-supported diaphragm.
FIG. 6 shows several modes of stress loading which can be applied to IMaP test structures. FIG. 6a shows distributed loading. FIG. 6b shows point loading. FIG. 6c shows torsional loading.
FIG. 7 shows an IMaP dimensional standard for direct measurement of layer thickness.
FIG. 8 shows IMaP dimensional standards. FIG. 8a shows a typical linear dimensional standard, and FIG. 8b shows a typical orientation standard.
FIG. 9 shows a basic design for a sliding friction/stiction tester.
FIG. 10 shows a sliding friction/stiction tester including a friction pad hinge.
FIG. 11 shows an IMaP fracture tester.
FIG. 12 shows an imaging interferometer suitable for use with IMaP diagnostic methods.
FIG. 13 shows a typical flow diagram for implementation of the IMaP diagnostic method within a MEMS production run.
Some thirty years of experience with microelectronics, especially integrated circuits, has shown the need for efficient and effective avenues for post-growth testing for the quality of the fabrication processes used to create the final devices. It has been found that the brute force approach of thorough functional testing of the circuits is not only time consuming, but does little toward prediction of premature failure or detection of uncommon error modes.
Among the quality control procedures developed in microelectronic fabrication is the co-fabrication of simple test devices and circuits on all production wafers. These test devices and circuits are thoroughly tested and characterized, and the results compared to those from equivalent test circuits fabricated under what is thought to be near-optimum conditions. If your integrated circuit has an insulating layer which holds off voltage pulses with a nominal voltage of 3 volts, it is very useful to know that, as actually grown, some process flaw caused the breakdown voltage of that layer to be 3.2 volts in the test devices, rather than the 6 volt design value. Although such circuits would probably function initially, they would likely experience premature failure. Further, such issues are wafer-scale, that is, probably affecting the entire wafer. As a result, finding a problem in characterizing the test circuits allows one to quickly identify entire wafers as suspect or simply as faulty. Such techniques have proven invaluable in the microelectronics industry. The present invention extends this approach to quality control testing to the realm of MEMS devices and apparatus.
As discussed earlier, past attempts at measuring mechanical properties associated with MEMS devices i.e., elastic properties, frictional forces, fracture thresholds, etc.) have proven to be both difficult to carry out, and quite inaccurate, with that inaccuracy not even being consistent within the use of a single technique. As a result, MEMS-based test structures have played little past role in quality control.
Applicants have succeeded in forming a system, called IMaP (Interferometry for Material Properties in MEMS), which provides reliable and rapid feedback concerning the effect of processing variables and conditions on the ultimate mechanical and structural behavior of MEMS devices. IMaP is a high-resolution interferometric imaging technique which measures complete deflection curves for electrostatically-actuated micromachined test structures. The deflection curves are routinely measured using one implementation of the instant apparatus to accuracies of about 2 nm.
Such deflection curves can be used in a variety of ways. By combining the detailed deflection curves with precise mechanical modeling of the test structures, it is possible to obtain material properties such as elastic constants, sliding friction and stiction coefficients, residual stress and residual stress gradients (induced during the growth and fabrication process), surface adhesion forces, and fracture limits.
Although this level of information is vital for the design of new devices, it is somewhat difficult to connect directly to the functionality of a specific device—particularly when a device flaw affects longevity, rather than initial function. If the issue is process control on an established process for an established device, it is possible to place limits on the deflection curves themselves which are obeyed in a high-quality process, but are violated when quality degrades to a level that interferes with the desired level of functionality. Such simple criteria encourage the use of such feedback routinely in production facilities.
The complete working out of material properties for a MEMS fabrication process, and the quick and dirty use of measured deflection curves for instant quality control feedback are perhaps two ends of a spectrum of potential uses for the instant invention. In all cases, however, various sources of error had to be identified, and either eliminated or compensated for.
The primary experimental technique is the measurement of the deformation of surfaces when loaded with (usually) well-characterized forces. When the forces are not well-characterized, errors appear which are difficult to compensate for without additional knowledge. An example is the effect of residual stress in measurements of elastic properties. One approach toward measuring elastic properties is to form a cantilever beam over a surface, and then to measure deflection while a voltage is applied between the surface and the beam. This produces an electrostatic force which serves to pull the beam toward the surface. The shape of the deflection curve is then determined by the force, the geometry of the beam, and the material properties of the beam. If two sets of information are known, then the third can be obtained. Usually it is assumed that the geometry of the beam and the force applied are known, and the elastic properties of the beam are obtained by continuum mechanical modeling.
However, there are several sources of potentially serious errors in this apparently simple experiment, leading to published "experimental" values for the Young'modulus of polysilicon ranging from 90 to 190 GPa—the actual value is about 160 GPa. One source of error is mechanical stress left in the beam by the fabrication process. Such residual stresses are commonplace, and often cause a cantilever beam to curl up or down. The error results partially from the fact that the residual stress has to be added to bending stresses generated by the applied electrostatic force. This skews the measurement of elastic properties by an amount which depends on the ratio between the residual stress and the stress induced in the beam by the electrostatic activation. This ratio is often large enough to signal the presence of very large errors.
Another common source of error is that, unlike the assumption made in analytic beam flexure calculations, the supports of the beam are compliant, and themselves deform when the beam is loaded. This action relieves some of the force otherwise acting to bend the beam, thereby introducing an error into the evaluation of elastic properties.
An additional source of error is that, as implemented using common MEMS fabrication processes, the supports of the beam do not produce in the unstressed state a beam which initially runs parallel to the substrate surface. Instead, a small angular offset appears to be induced by the supports. The magnitude of these nonidealities can be determined from the results of a suite of other IMaP measurements. If ignored, however, the associated artifacts can dramatically alter the values determined for, e.g., the elastic constants. In the IMaP technique as claimed here, all these quantities are obtained from data from a single testing apparatus and method.
There are three major areas on which the instant invention depends—the proper design of IMaP test structures, precise measurement of test structure deflection, and a highly-sophisticated IMaP test structure modeling capability. These aspects, and their interconnection and interrelation in the instant invention, are discussed below.
A variety of MEMS structured devices have proven of value for IMaP applications. These include devices designed to measure bending and torsion in beams, frictional and stictional forces between sliding surfaces, surface adhesion forces, and various fracture modes near stress concentrators. These devices are based on a common set of submechanisms which are easy to fabricate, measure, and interpret for MEMS quality control purposes.
One set of submechanisms are compliant stress members. These are mechanisms which respond to applied stresses in a manner which is directly related to their geometry and their material properties. A first example appears in FIG. 1, which shows an ideal model of a cantilever beam structure formed on a substrate. A cantilever beam 12 with an exposed surface 13 is attached to a substrate 10 by anchor 11. Typical cantilever beams have a nominally rectangular cross-section, although this is not necessary for the present application. Similarly, typical cantilever beams for IMaP applications will have essentially constant cross-section on their length away from anchor 11. They thus take the form of a rectangular box, which adds considerably to the simplicity of data interpretation. In practice, the deformation of beam 12 is usually measured by interferometric imaging of exposed surface 13, but a variety of other measurement techniques (profilometry, conformal imaging, evanescent wave optical scanning microscopy, scanning tunneling microscopy, capacitive scanning microscopy, etc.) can be used. The result is what can be called a bending-moment tester, in that a simple bending deformation is generated by a known stress.
Data taken by measuring deformation of cantilever beams cannot properly interpreted unless several sources of potential error in the setup or modeling of the mechanical response problem are included. An important source of modeling error is to ignore the elastic response of anchor 11 and of the substrate 10 to the force applied to and transmitted by beam 12. This response is a deformation, shown in exaggerated form in FIG. 1b, which serves to reduce the stress energy in the bent beam 12. Ignoring the compliance of these structures can induce twofold errors in measurement of elastic constants.
Several process-related sources of error are shown in FIG. 2. Here appear several nonideal cantilever beam structures similar in basic structure to those shown in FIG. 1. FIG. 2a shows the effect of a gradient in residual stress in the material of beam 22. This initial curvature alters both the level and distribution of electrostatic force generated by a potential difference and the amount of beam bending for a given level of applied stress. The initial shape must be measured and included in models if actual values for, e.g., elastic properties are to be extracted from beam bending measurements.
Similarly, FIG. 2b shows a situation where the residual stress gradient through the thickness of the beam is both. non-zero and inhomogeneous on the length scale of the beam. Again, the initial displacement has to be understood, as well as the effect of the warping of exposed surface 23 on the deformation measurement technique being used. A related effect is shown in FIG. 2c. Anchor 21 can have an inhomogeneous residual stress, which induces an initial offset angle θo to beam 22.
The beam is made to deform in response to an applied stress (or a residual material stress), and the deflection of the beam is then measured. There are many ways of applying a bending moment to the beam, but probably the easiest and most directly applicable to MEMS-based structures is to impose a difference in electrical potential between the beam and the substrate. This produces an electrostatic force which is proportional to the magnitude of the voltage difference, but can depend on the amount of beam deflection in a complex manner. Various modes of loading will be discussed later.
Applying a voltage difference will cause beam 32 to approach substrate 30. However, because of the mechanical attachment to anchor 31, the beam does not bend uniformly, but rather takes on a curved form (FIG. 3a). As shown schematically here, anchor 31 also responds to the applied force by bending, thereby reducing the stress energy of beam 32 somewhat. When the free end of beam 32 is bent roughly ⅓ of the distance down to substrate 30, an adhesive catastrophe takes place, and the end of the beam snaps down to the substrate and is adheres to the surface. The surface adhesive forces between these two nearly atomically flat surfaces provide and additional force which leads to the situation in FIG. 3b, where a substantial length 34 of beam 32 has collapsed onto substrate 30.
The basic approach toward analysis of the cantilever beam deformation changes from that of a bent beam in the situation shown in FIG. 3a, to that of fracture mechanics, with the additional notions of crack length s and surface and interfacial energies for the adhered beam of FIG. 3b. The shape of the bent beam is determined primarily by the elastic properties and geometry of beam 30 and of anchor 31 (with some contribution also due to elasticity of the substrate), and the details of how the force is applied to the beam. The primary information obtained in this regime speaks to shape and dimensional quality control. (In principle the deposition could be so defective that the effective elastic properties change, but this is an unlikely situation which carries along other diagnostic information, such as visible changes in growth quality.)
In contrast, the cantilever beam deformation for the adhered beam of FIG. 3b is also influenced by the difference between the free surface energies of the beam and substrate surfaces and the interfacial energy when these surfaces are in contact. If the beam and substrate were clean and flat, these quantities would be dominated by the surface energies, the contact area would be the geometric area, and interpretation of the experimental results would be straightforward.
The actual situation, however, is not so pleasant. The surfaces coming into contact are rough, and usually have a thin contaminated layer. In addition, there can be residual fluids remaining from the release step or other processing steps. The actual surface and interface energies will depend strongly on the nature of the contaminated layer. These energies multiplied by the ratio of actual contact area to geometric contact area (e.g., assuming the surfaces are flat), give what can be called effective surface and interface energies for adhesion. If the surfaces are contaminated on the monolayer scale, but no other effects are relative, the actual contact area to geometric contact area is essentially determined by the roughness of the surfaces, their elastic properties, and the contact pressure.
This situation is not characteristic of actual devices, however. The usual release processes appear to leave a small amount of liquid behind in the surface pores and crenellations of the released surfaces. When the surfaces become adhered, capillary forces can act on this fluid to fill in some of the interfacial cracks, thereby dramatically increasing the actual contact area between the surfaces. As a result, the adhesion energy is generally expected to be a function of contact time, and that dependence will be strongly influenced by processing conditions and flaws.
An additional difficulty is generated by the possible presence of occasional surface structures which are much larger than the surface roughness length scale. Examples would include dust between the surfaces, and sacrificial material which is not totally removed in a defective release step. Such structures, even if they are isolated on the surface, can dramatically reduce the actual contact area, thereby reducing the adhesion between surfaces.
It is clear that measurement of beam deflection and of the adhesion between the surfaces of a beam and a substrate gives a great deal of information concerning how the fabrication process has actually been carried out. Dimensional artifacts, surface roughness, surface contamination, residual process fluids, and dust contamination all will produce anomalous test structure behavior. Such measurements are therefore one of the bases for the instant invention.
A second common type of compliant member is a multiply-anchored suspended beam as shown in FIG. 4. Here a beam 41, which has an exposed surface 42, is suspended over a substrate 40 by multiple anchors 43. In operation, the beam is loaded by a force, often electrostatically generated, which acts to deform beam 41 between the multiple anchors 43. In practice, the most common such structure is the fixed-fixed beam, which is shown in FIG. 4b. Such structures tend to be more robust than are the cantilever beams.
Multiply-anchored suspended beams exhibit deformations which are subject to most of the same interpretive problems as appear for the cantilever beams. Residual stresses and residual stress gradients still affect the initial state of the beam, although the displacements caused thereby are often smaller than for cantilever beams. Stress inhomogeneities still can cause the beam to take on an initial offset angle at each anchor 43, that offset angle being different for each anchor. Stress will still be transmitted through beam 41 to distort the anchors and the underlying substrate. The effects which influence an adhesion measurement also remain present, although the effect of slip along the surface is lessened. As in the case of cantilever beams, therefore, it is necessary to take a wide range of geometric and material effects into account to extract fundamental material properties from deformation measurements on multiply-anchored suspended beams.
Other compliant members which can be used in IMaP test structures are shown in FIG. 5. FIG. 5a shows a multiply-anchored plate, comprising a plate 51 suspended over a substrate 50 by multiple anchors 52. Such structures can always be used for elastic property and adhesion measurements, but are particularly useful when the materials from which the structures are grown show significant anisotropy, as elastic constants along multiple axes can simultaneously be measured. The plate 51 need not be rectangular or, indeed, any simple shape in cross-section parallel to the substrate surface. Multi-axis results can be obtained, for example, if a Y-shaped plate is used.
FIG. 5b shows a multiply-anchored plate similar to that of FIG. 5a, but where the plate 53 has a complex multiply-connected structure. Such structures can be designed to allow measurement of multiple elastic constants using only the single structure.
Finally, FIG. 5c shows an edge-supported diaphragm, which can also be used as an IMaP compliant member. Diaphragm 54 is suspended above substrate 50 by edge anchor 55, which extends entirely around the diaphragm. Again, similar artifacts and errors must be taken into account to properly interpret measured diaphragm displacement.
A second set of submechanisms concerns how a controllable deformation force is applied to the compliant member. In the instant invention the force is applied electrostatically, resulting both in control and flexibility in loading conditions. It is possible to arrange out of plane deformation forces (out of plane deformations are easiest to measure with the accuracy and resolution required) to be generated by, e.g., comb electrostatic actuators, but in general it is easier to use direct electrostatic interaction between the compliant member and the substrate to provide this force.
For purposes of reference the general type of electrostatic actuators which are shown in FIG. 6 will be called capacitive actuators, and function by direct electrostatic interaction between a compliant member and a substrate. FIG. 6a shows the simplest such actuator, here implemented on a cantilever beam 62 anchored on a substrate 60 by anchor 61. As shown, substrate 60 and beam 62 are both electrical conductors, and are insulated from each other. Voltage source 63 produces a voltage between substrate 60 and beam 62, and thus an attractive electrostatic force is generated between the substrate and beam. As this force is applied to the entire length of the beam, this will be called a distributed loading mode. To first order the beam moves toward the substrate as driven by the force, but it is important, as discussed earlier, to include the elastic deformation of anchor 61 and substrate 60.
If the beam is initially flat and parallel to the surface (questionable assumptions, as discussed earlier), the initial stress induced by the applied voltage is rather simple, producing a constant downward pressure over the length of the beam. The force distribution, however, becomes much more complex as the beam deforms. The interaction force between the charges on the beam and the charges on the substrate varies with distance. The bending of the beam not only changes the interaction distance, but also can change the distribution of charges on the beam and on the substrate. As a result, the force actually applied to the beam as a function of applied voltage can be a complex function depending on many factors, geometric and material. Measuring the beam deflection as a function of applied voltage is therefore again confirmed as providing useful process quality control information.
A simpler loading geometry, perhaps more suitable when the goal is to measure the actual values of material properties, is that of point-loading. A version of point-loading is shown in FIG. 6b, where cantilever beam 62 is anchored above substrate 60 by anchor 61. In this case, a conductor 64 which is insulated from the substrate (or which lies in an insulating substrate) crosses under beam 62. Voltage source 63 is now attached to beam 62 and to conductor 64. Because of the inverse-square electrostatic force law, the force resulting from electrostatic interaction between the beam and the conductor is concentrated in the immediate neighborhood of a single point on the beam. The result is a relatively simple dependence of applied force on voltage and the extent of bending. This allows simpler models to be used in analysis of the beam deformation.
A final example, which can be also be used in IMaP test structures, is that of torsional driving. FIG. 6c shows an end view of a torsionally driven fixed-fixed beam structure, in this case implemented as a torsion-moment tester. Beam 65 is suspended at both ends above substrate 60 by anchors 66. At some point between the anchors, beam 65 widens to form paddle-like torsional drive plate 67. A pair of capacitor elements 68 and 69 are positioned on the substrate surface under the ends of torsional drive plate 67, and are insulated from both the substrate and from beam 65. A dual voltage source 610 is attached to the torsional drive, so that beam 65 is grounded, element 68 has a voltage of a first polarity applied, and element 69 has a voltage of a second polarity applied. In general, when voltages are applied the electrostatic interactions will apply a mechanical torque about the long axis of beam 65. This torque can be pure, but more often is combined with a net vertical component of force. If the voltages are adjusted properly, the electrostatic forces can result in a pure vertical force being imparted to beam 65.
Torsional loading capacitive actuators are therefore more versatile in applying force than are the distributed or point loading structures. A single test structure can investigate both uniaxial and torsional loading, thereby providing more data on elastic behavior than do the linear beams. However, the beam deformation is complicated by the stress concentrations and nonuniform stiffness induced by the presence of the torsional drive plate 67. Use of such structures in IMaP testing thus required evaluation of cost-benefit levels for the differing techniques.
Other approaches toward capacitive electrostatic actuators are possible, but are usually minor modifications of the examples shown in FIG. 6, or are combinations of those examples, and are intended to be included in the scope of this invention.
Many practical IMaP test structures consist essentially of a combination of these first two submechanisms, and are capable of measuring beam bending, beam torsion, combined beam deflections and surface adhesion. Any IMaP test structure of this general type, if the capacitive electrostatic actuators is left out, or remains nonfunctional, can be used as a passive IMaP test structure. These are primarily useful for evaluation of residual stress and initial offset angles.
Another class of passive IMaP test structure which can be useful to include are IMaP metrology standards. These are structures whose only purpose is to fabricate structures which are intended to be of a certain size if the fabrication process functions properly. The actual dimensions can be measured using a variety of techniques, including length measurements by profilometer, microscopic image analysis, or electron microscopy, and depth measurements using interferometry, capacitive probes, and profilometry.
There are three major types of IMaP metrology standards, depth standards, length standards, and orientation standards. Most MEMS structures are fabricated using a multilayer process where individual layers are made up of parts and sacrificial material. The function and reliability of the final MEMS device often depends on the layers having the right absolute or relative thicknesses. In addition, having an independent measure of layer thickness makes the modeling and analysis of elastic parameter data from IMaP test structures easier to accomplish. The IMaP metrology standard for layer thickness, as shown in FIG. 7, can be as simple as a series of pits 71 etched in a substrate 70 down to the appropriate layer interfaces 72-75. The pit depth is then measured by any one of a number of conventional methods, some of which were listed above.
IMaP length standards can "piggyback" on the structure of other IMaP test structures, or can stand alone. All that is needed to provide this function is a fabricated feature 81 on a substrate 80, having what should be a known length, as shown in FIG. 8a. Similarly, FIG. 8b shows an IMaP orientation standard can be provided by fabricating a structure 82 on a substrate 80 which clearly identifies at least two orientations which are intended to be separated by a known angle. If post-fabrication measurement reveals a different angle, then some systematic error was inadvertently introduced into the pattern definition steps of the fabrication process. Dimensional information is easy to establish, but is so important for MEMS applications that these independent tests for correct dimensions can be worthwhile.
There are two special IMaP test structures which have special utility. The first is a class of test structures which measure the frictional and stictional forces involved when two processed surfaces slide along each other. Previous groups have studied such effects using a comb actuator driven friction pad, but the levels of sliding stress which can be thus achieved are too small to measure friction and stiction under MEMS operational conditions. The instant sliding friction tester generates large forces over small displacements by bending a beam.
FIG. 9 shows a simple type of such a test structure. Beam 92 is supported above substrate 90 by anchor 91. Friction pad 93 is free to slide along substrate 90 when contact is made between the neighboring surfaces. Friction pad 93 and beam 92 are electrically insulated from substrate 90. An electrostatic load is applied to press the friction pad against the substrate surface by connecting a voltage source 95 between substrate 90 and beam 92. Similarly, an oscillating force is applied to beam 92 by connecting an oscillating voltage 96 between beam 92 and substrate electrode 94.
In use, the friction pad is pressed against the surface of the substrate by a force generated by a first voltage applied between the beam and the substrate. Then a second oscillating voltage applied to electrode 94 causes an oscillating vertical force on the beam 92. This force causes the beam to deflect upward and downward about an equilibrium position. In doing so, the effective length of the beam changes, so that a force appears which attempts to slide the friction pad back and forth along the substrate. If this force is too small, the beam follows fixed-fixed deformation mechanics, as revealed by measurement of the shape of the top surface of the beam.
When the force becomes large enough to overcome stiction between the friction pad and the substrate, however, a finite amount of slip will appear. As a result, the deformation mechanics of the beam will change in character, and this change in character can be detected by measuring the shape of the top surface of the beam as a function of force on the friction pad and magnitude of oscillating force, being careful as always to model all significant mechanical and electrostatic effects. In principle one can measure both sliding friction and stiction with such a device. As these quantities depend strongly on surface contamination, surface roughness, and the like, their determination is quite useful for quality control purposes.
The device described in FIG. 9, unfortunately, does not function properly in practice. Detailed functional modeling reveals that the friction pad does not remain in solid contact with the substrate, even for large values of friction pad loading and small values of oscillating force. As a result, the measurements are essentially impossible to relate to any fundamental material properties.
A modified sliding friction tester as is shown in FIG. 10 overcomes these problems. The structure is similar to that in FIG. 9, save that the friction pad 103 and the beam 102 are attached not by a solid connection between the two bodies, but through the action of hinge 107. The friction pad 103 is free to rotate about hinge 107, and hence will remain in true sliding contact with substrate 102 if the voltage from voltage source 105 is large enough. Now the measurements of the shape of the top surface of the beam as a function of the magnitude of the two voltages can be analyzed to give the frictional and stictional properties of the surfaces of the friction pad and the substrate.
The second special type of IMaP test structure studies the fracture mechanics of the MEMS structural layers. Fracture limits reflect such material quantities as defect levels, etc., while also being altered by surface roughness and growth irregularities which produce stress concentrators. Fracture threshold can thus be a useful quality control variable, as well as an important design criterion for MEMS design.
FIG. 11 shows an example of a class of fracture testers suitable for IMaP applications. Beam 111, which is typically much wider than it is thick, and which has notch 112, leaving in this area a small "microbeam", is suspended above substrate 110 by anchors 113. A voltage source 116 supplies a driving voltage to beam 111 and to actuator electrodes 114 and 115. The resulting electrostatic force pulls beam 111 downward, resulting in a very large axial force, which is focused by notch 112 to make the microbeam the most highly stressed part of the tester. When the stress levels in the microbeam are high enough to induce fracture, thereof, the two halves of beam 111 will abruptly drop toward the substrate surface, an event which can be easily detected by measuring the shape of the top surface of beam 111 as a function of the driving voltage. As usual, extraction of actual material parameters requires detailed and complete modeling of the relevant physical phenomena, as discussed earlier. However, a simple criterion that fracture not occur below a given test voltage can prove a useful quality control measure.
Numerous IMaP test structures have been described above, together with how they are operated. The requirements of mechanical and electrostatic modeling required to extract real material and structural parameters from this data have been discussed. The primary element which has yet to be discussed is how the shape of the compliant member (usually of an exposed surface thereof) is to be measured. There are numerous measurement techniques which could be used to measure the shape, e.g., of a bending beam in an IMaP test structure. These include profilometry, interferometric imaging, confocal microscopy, evanescent wave microscopy, capacitive probe microscopy, tunneling probe microscopy, and many others. However, in order to routinely obtain the precision required (2-5 nm) in a rapid and user-friendly manner, the implementations we have carried out have been based on interferometric imaging.
Interferometric imaging is carried out using a microscope-based interferometer operating in the visible. Such an interferometer is shown schematically in FIG. 12. A sample 120 is positioned at the focal point of microscope 121. Monochromatic light is provided by laser 122, and is directed in to beam expander 124 by mirror 123. The expanded laser beam then is split by beam splitter 125 into a pair of beams. One beam goes to reference mirror 126, and then returns to the beam splitter. The other beam passes through the microscope 121, reflects off the substrate surface, and returns to the beam splitter. When the two beams return to the beam splitter, they are combined into a single beam which is directed into camera 127. On being focused within the camera an image of the substrate surface appears. This image is covered by interference fringes which reveal height variations along the surface being imaged.
A computerized fringe counting system is used to analyze the vertical displacement information carried by the fringes. We have succeeded in determining vertical displacement with a precision of as small as 2 nm, corresponding to being able to detect fringe position to about 1% of a single fringe separation. This level of precision allows the routine measurement of displacements due to stress levels as low as 0.1 MPa.
A final requirement for the IMaP apparatus is that means to support and handle the substrate, usually in the form of a thin wafer, without introducing clamping or contact stresses at a level which would negatively impact the IMaP measurements must be used. Applicants have successively used a conventional vacuum chuck, where the vacuum is relieved before measurement are taken. In this case, the contact forces of the voltage probes on the contact areas suffices to hold the substrate from sliding. Alternate approaches would include uses of compliant adhesive materials to limit mounting stresses.
A coarse diagram of the key steps in carrying out the IMaP processes for quality control and/or material property measurement purposes appears in FIG. 13. Note that this is only one possible sequence of steps—any sequence which will not violate the basic principles of IMaP diagnostics could also be used.
Process step 1 is the cofabrication of the desired MEMS devices and the IMaP test structures. It is important to carry these out via the same processes, so that anomalies in the behavior of the IMaP test structures will reflect something that also affects the MEMS devices.
Process step 2 is the release of the MEMS devices and the IMaP test structures from the sacrificial material which defined their structure and holds their components motionless. There can be a large number of process steps between these two, such as fabrication of microelectronic circuitry on the substrate, but these do not alter the basic IMaP procedures. Process step 2 calls for co-release of the MEMS and IMaP structures. As discussed earlier, this is not required.
Process step 3 calls for the substrate to be positioned so that the diagnostic surfaces of an IMaP test structure are imaged by the imaging interferometer. It is possible to activate and measure multiple IMaP test structures simultaneously, provided they are simultaneously imaged and the required driving voltages can be delivered.
Process step 4 calls for the voltage probes to be placed on the contact sites for the IMaP test structures to be examined. Again, this can be individual or multiple IMaP test structures. Also, alternate means of making contact to the test structures are possible, and can be substituted without leaving the IMaP process.
Process step 5 calls for the interferometric measurement of the initial shapes of the IMaP diagnostic surfaces. The fringe data is digitized and analyzed by a computer to obtain vertical surface information. The various discussions on test structure modeling reveal how important taking this information into proper account is in determining material properties using IMaP.
Process step 6 calls for the test voltages to be applied to the IMaP test structures. There can actually be a series of such voltages to be applied—such repetition will be provided for in a future process step.
Process step 7 calls for measurement of the displacement of the IMaP diagnostic surfaces in response to application of the test voltages in process step 6. There are occasions, such as measurement of surface adhesion, when steps 6 and 7 can best be carried out simultaneously.
Process step 8 allows the setup and measurements of steps 3-7 to be repeated with different conditions and on different IMaP test structures until the entire suite of diagnostic measurements is finished.
Process step 9 calls for fitting the suite of diagnostic data to the detailed IMaP mechanical and electrical response models, so that the key parameters of those models can be determined. The level and sophistication of this analysis will depend on the goal for the diagnostic process. It can be easier to obtain useful quality control information than to obtain accurate material properties.
Finally, process step 10 calls for reporting quality control results and/or materials properties data as obtained based on the IMaP measurements.
As mentioned before, there are many approximately equivalent process paths through which the IMaP diagnostic procedures can be applied to provide quality control and/or material property information. The specific implementation given in FIG. 13 and the above is for purposes of illustration, and is not intended to limit the scope of the instant invention.
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|U.S. Classification
|700/110, 702/84, 700/121, 257/48
|International Classification
|Cooperative Classification
|European Classification
|Feb 25, 2003
Owner name: ENERGY, U.S. DEPARTMENT OF, DISTRICT OF COLUMBIA
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text:
Solutions for Chapter 3 Problem 19SQ
Consider an object on the surface of the Earth. Hence, the separation between two centers of the object and Earth is equal to the radius of the Earth.
The gravitational attraction force between Earth and the object is given by the following Newton's law of gravitation law.
Here, is the universal gravitational constant, is the mass of the Earth, is the mass of the object, and is the radius of the Earth.

subset: commoncrawl


text:
May 2, 2012 - Researchers believe millions of lives could be saved if more countries adopted anti-smoking policies. 174 nations have increased cigarette prices and implemented ad campaigns encouraging smokers to quit. Doctors at the University of Michigan say if all countries did the same, the number of smokers worldwide could eventually be cut by about a third. Without the World Health Organization voluntary tobacco control policy, and with the same starting and quitting rates, smoking prevalence is estimated at about 23 percent by the year 2020. The study shows that doubling the price of cigarettes will have the biggest impact on tobacco use.
Also, lifting heavy weight might not be the only way to build big muscles. Researchers from McMaster University found lighter weight combined with a higher number of repetitions can be just as effective.They say the secret is not the size of the weight you lift, but stimulating the muscles until they become fatigued. Data also shows practical significance for gym enthusiasts but also for people with compromised skeletal muscle mass, such as the elderly, patients with cancer, or those who are recovering from trauma, surgery, or even stroke.


text:
Chateau Margaux 1996
Bordeaux Red Blends from Margaux, Bordeaux, France
Winemaker's Notes
This vintage ended up producing a wine which will go down in history for its classicism and purity. The Cabernet Sauvignon has seldom achieved such a perfection of style and such good balance. What is even rarer perhaps, is to find in a young wine, only just after its blending, the ability to impress and move us at once through the purity of its fruit, the density of its structure and the harmony of its shape. It is a dream of a Margaux.
Critical Acclaim
The Wine Advocate - "The 1996 Chateau Margaux, which was bottled in September, 1998, is undoubtedly one of the great classics produced under the Mentzelopoulos regime. In many respects, it is the quintessential Chateau Margaux, as well as the paradigm for this estate, combining measured power, extraordinary elegance, and admirable complexity. I tasted the wine on three separate occasions in January, and in short, it's a beauty! The color is opaque purple. The wine offers extraordinarily pure notes of blackberries, cassis, pain grille, and flowers, gorgeous sweetness, a seamless personality, and full body, with nothing out of place. The final blend (85% Cabernet Sauvignon, 10% Merlot, and the rest Petit Verdot and Cabernet Franc) contains a high percentage of Cabernet Sauvignon. It tastes complete and long, although backward. My instincts suggest this wine will shut down, but at present it is open-knit, tasting like a recently bottled wine. The fruit is exceptionally sweet and pure, and there are layers of flavor in the mouth. I do believe this wine will develop an extraordinary perfume, and possess a high level of richness. Anticipated maturity: 2005-2040."
Vinous / Antonio Galloni - "Bright full ruby. Pure, perfumed aromas of cassis and violet. Dense and tactile in the mouth; a huge, chewy wine with major extract but also considerable refinement. Almost painfully backward today, and a bit less perfumed than it was in the year or so after the bottling, but the huge tannins show no hardness. Another great expression of cabernet sauvignon from the '96 vintage. Drink 2015 through 2040. 96+"
Wine Spectator - "Fully formed now, with a rush of steeped currant and black tea notes that are melded with a backdrop of anise, sandalwood, bergamot and charcoal. The long, suave finish lets the perfume linger, with a weighty feel. This seems to mark the start of the refinement of tannins; despite the power, this is all grace and elegance."
- View All
Chateau Margaux Winery
Château Margaux, a Premier Grand Cru Classé Bordeaux, is one of the most famous wines in the world. Care has been lavished on the property by a line of owners with an abiding concern for the reputation of the estate.
For more than five hundred years, season after season, generations of vineyard-workers, grapeharvesters, cellar-workers, coopers and many other craftsmen have all played a part in making Château Margaux what it is today: a wine with an incomparable personality, reflected in the elegant Palladian building which adorns its label. In 1977, the estate was purchased by the late André Mentzelopoulos, and it is now run by his daughter, Corinne Mentzelopoulos. View all Chateau Margaux Wines
About MargauxView a map of Margaux wineries (mahr-GOH)
Soft, elegant, feminine… these are words often used to describe the wines of Margaux. The commune is different from its northern neighbors of the Haut-Médoc in both geography and style. Home to the name-sharing premier cru, Margaux lays a few marshlands south of St.-Julien.
Notable FactsAs in other Medoc appellations, Cabernet Sauvignon leads the blends of the region, but the percentage of Merlot in Margaux's wines is higher than other left bank communes. Add that to a diverse soil, lighter than that in the north, and you have a softer, more voluptuous wine. In the best years, wines of Margaux are delicate, elegant and refined - structured, but not austere. Chateau Margaux is, of course, a first growth and a highly esteemed and sought-after wine. Chateau Palmer, a third growth, is also well-respected and often commands prices equivalent of first growths. Look for Cru Bourgeois if you want to try the finesse of Margaux at a lower price.
About France - Other regionsWhen it comes to wine, France is a classic. Classic blends, grapes and styles began in the country and they still remain. Think about it - people ask for a Burgundian style Pinot Noir, they refer to wines as Bordeaux or Rhone blends - Champagne even had to pass a law to stop international wineries from putting their region on the label of all sparkling wine.
The top regions of France are: Bordeaux, Burgundy, Champagne, Languedoc-Roussillon, Loire, Rhone. And these regions are so diverse! It makes sense that wine regions throughout the world try to emulate their style. Pinot Noir, Chardonnay, Cabernet Sauvignon and Syrah are no longer French varieties, but international varieties. They may not be the leader of cutting edge technology or value-priced wines, but there is no doubt that they are still producing wines of great quality and diversity.
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text:
Pleasant Central Room in Venice
Maksimum Konuk Sayısı3
Yatak odası1
Boyut14 metrekare
Floor No.2
- Çamaşır makinesi / Kurutma makinesi
- Aile / Çocuk dostu
- Kilitlenebilir oda
- Havlu
- İnternet/Kablosuz ağ
- Bebek karyolası
|calle Franco Passarella, 30132 Venice, İtalya
|Mülkiyet türü
|Özel oda
|Referans kodu
|Acceptance rate
|Response time
|A few hours
|Calendar updated
|2 days ago
The room can accommodate up to 4 guests and there is a double bed and raised bed. Guests have access to shared bathroom in the apartment. The room also offers a wardrobe and a hairdryer.
A range of amenities including a supermarket and a number of Italian restaurants are within a short walk of the apartment . The shores of Venice can be easily reached within 5 minutes on foot.
The bustling Piazza San Marco, the iconic centre of Venice, is a 20-minute walk from the apartment. The Biennale D'Arte Moderna modern art gallery is also easily accessible. A number of vaporetto water taxi stops in the city offer links directly to the apartment's neighbourhood.
|Weekly rate for 1 guest
|Monthly rate for 1 guest
|> 1 misafir için ücret
|TRY 70 misafir başına/ekstra gece
|Maksimum Gece Sayısı
|1 month
|Check-in Saati (Sonrası)
|Check-in before
|Check-out Saati (Öncesi)
|İptal Koşulları
Excellent experience!
Nice flat with nice rooms.
Quiet area, perfect for relaxation.
Adriano is a kind helpful man.
Adriano is very friendly and ready to help, the room and the two bathrooms were clean, the flat is very near to th waterbusstation and near to bianale, thera three small shops to buy some food and bars to drink a coffee. We enjoyed it!
Good place to stay in Venice. Adriano is very nice and gives useful tips for the stay in the City.
I enjoyed my experience of holidaying alone in Venice, and was pleased with stay at Adriano's apartment. Sant' Elena district is a great location, mostly when you want to visit Biennale, what I did, and to be away from hordes of tourists. Nevertheless, it takes just a few minutes to get to the water bus stop, from where you can make a trip on waterborne routes. I definitely intend to have the same type of holiday again, and repeat at Adriano's apartment. Thanks Adriano!
very good place to discover the less known venice, not far away to the well known venice.
Very nice flat - clean bathroom and friendly and familiar athmosphere.
Just a few minutes from Biennale Gardini away.
The cosy appartement, its location in the calm and beautiful Castello and the discreet and attentive welcome of Adriano and his family, all this together with a nice spring weather has made our stay simply wonderful. Grazie mille, Adriano.
Everything was perfect! The location of the appartment, the room and the great hospitality of Adriano made our one week holiday a wonderful experience. We can really recommend it.
- Kalite güvenceli konaklama
- Her ev sahibi telefonla doğrulanmıştır
- SSL şifrelemesi ile güvenli ödeme


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Debenhams Silver Sputnik Wall Clock
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Item No.3270142723
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Carla Naumburg, PsychCentral: A few weeks ago, I was on a retreat as part of a year-long course I recently took on Mindfulness and Psychotherapy. (For the record, the course meets in person in the Boston area and online for those of you around the world, and it's fantastic. If you're a mental health professional interested in integrating mindfulness into your practice, I highly recommend you check it out.) Anyway, we spent about 36 hours of the retreat in silence, during which time our goal was to meditate on whatever we were doing: sitting, walking, washing dishes, and eating.
At each meal, I tried …
The Westmorland Gazette: Meditation could soon be on the curriculum for primary school pupils thanks to a programme devised by a Lake District woman.
Holly Horsley, 25, is on a mission to reduce stress caused by the school curriculum which, she says, focusses 'too much' on career-led subjects and not enough on life skills to combat pressure.
She is working with national charity, Fixers, to produce an information pack about the benefits of meditation, which will be sent out to local schools.
"I like to find a quiet place and just sit there and be in my element," she explained.
"To me, meditation is …
Mary MacVean, Los Angles Times: Hundreds of schools in California alone have mindful meditation programs, and educators see benefits. Mindfulness is said to help with focus, attention, calming the emotions and school performance.
Erica Eihl speaks in a voice that her kindergartners can hear only if they are as quiet as the church mice in children's storybooks.
And with a couple of squirrelly exceptions, they stay that quiet for 15 or 20 minutes — a near eternity — as Eihl guides them to use all their senses to consider a piece of apple, with directions such as, "Looking at the apple, look on the outside …
David L. Kirp, SFGate: At first glance, Quiet Time – a stress reduction strategy used in several San Francisco middle and high schools, as well as in scattered schools around the Bay Area – looks like something out of the om-chanting 1960s. Twice daily, a gong sounds in the classroom and rowdy adolescents, who normally can't sit still for 10 seconds, shut their eyes and try to clear their minds.
This practice – meditation rebranded – deserves serious attention from parents and policymakers. An impressive array of studies shows that integrating meditation into a school's daily routine can markedly improve the lives of …
Are you sitting comfortably? Have you silenced all the alarms on your computer and phone? Have you closed all other windows or switched your browser to full screen mode? Have you taken three full breaths, closed your eyes, and spent a few minutes quietly listening to the world around you? No? OK, go do that now…
I adore Ms. Underwood's books. So does my six-year-old daughter and, to a lesser extent, my four-year-old son. My wife's a big fan, too. Underwood writes a lot … Read more »
Room to Breathe is a documentary about teaching mindfulness to students of the troubled Marina Middle School in San Francisco, which tops its district for disciplinary suspensions, and has overcrowded classrooms creating an environment in which it's almost impossible for learning to take place. As assistant principal Anthony Braxton explains near the opening of the film, a significant number of students at Marina "don't do school" — they don't see school as being for them.
In the class of Seventh Grade teacher Tom Ehnle, we see kids who are unable to stay on task or to pay attention. They seem to be in a constant state of fidgeting, wrestling with each other, carrying on side-conversations, … Read more »
Here are seven practices that you can do with young children, to help bring mindfulness into your home.
British Psychological Society: A short training course in mindfulness improves children's ability to ignore distractions and concentrate better.
These are the findings of a study carried out by Dominic Crehan and Dr Michelle Ellefson at the University of Cambridge being presented today, 6 September 2013, at the British Psychological Society's Cognitive Developmental Psychology Annual Conference at the University of Reading.
Dominic explained: "Mindfulness involves paying attention in a particular way – on purpose, in the present moment, and non-judgementally. It has been shown to reduce levels of stress and depression, and to improve feelings of well-being, but to date researchers have not established…


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Doylestown, PAUSA
September 10, 2012
High school
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Help support your Meetup
This Meetup is intended to help you meet other local Spanish language and culture lovers for conversation and fun! Come to a Bucks County Spanish Language Meetup and make new amigos as you practice speaking, meet Latin professionals and have some fun!
The Bucks Country Spanish Language Meetup will be featuring different guest speakers, hold conversational groups and also hold several fun workshops with assistance from the friendly folks at Hispanic American Access LLC.
All ages and levels welcome and no experience neccessary.
Hope you'll join!
"Let us be your access to success" Spanish classes available daily.
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Jackie Daly, Managing Editor, KBB Magazine
Wednesday, 17 October 2012
Counterweighted Equilibrium
11 comments:
El color verde me parece ESPECTACULAR....muy elegante y moderno.ReplyDelete
Tengo un blog dedicado a la Decoración en la cocina, os invito a visiarlo http://kansei-estudiodecocinas.blogspot.com
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(207) 861-3000 / (800) 491-8600 Community Health Needs Assessment
At Inland Women's Health Care you can count on respectful, considerate and attentive care. We believe that we can best help you by listening first! At every step your wishes, needs and concerns shape the care we provide in partnership with you and your family. We are privileged to help deliver your baby, provide routine and preventative care, offer the latest surgical advances, and help you age with dignity and grace.
Our office is conveniently located at 180 Kennedy Memorial Drive, Medical Arts Building-Suite 104 in Waterville (872-5529). Call us today and we'll get you right in!
We are proud to share that Inland Women's Health Care is the only OB/GYN practice in Maine and the tri-state region to earn a special safety SCOPE certification! We are also excited to share that Inland Hospital is a four time recipient of the Women's Choice Award for being one of America's Best Hospitals for Patient Experience in Obstetrics! We strive for excellence every day with you and your family in mind!
Inland Women's Health Care is a department of Inland Hospital. Inland is a proud member of EMHS.
Our Providers:
William K. Bradfield, MD
OB/GYN Physician
Danielle Gagnon, MD
OB/GYN Physician
Mark Klemperer, MD
OB/GYN Physician
Mary Vaughan, MD
OB/GYN Physician
Sally Stothoff, FNP
Family Nurse Practitioner
Helen Price-Wharff, FNP
Family Nurse Practitioner
Inland Women's Health Care Services:
As a member of EMHS, Inland has access to resources and best practices that help us provide the highest quality healthcare. A multitude of specialists are available at both Inland Hospital and Eastern Maine Medical Center, our system's advanced medical care center, and include cardiology, pulmonology, rheumatology, obstetrics, endocrinology, orthopedics, oncology, physiatry, urology, and vascular care.
Office Hours:
Monday: 8am - 5pm
Tuesday: 8am - 5 pm
Wednesday: 8am - 5pm
Thursday: 8am - 5pm
Friday: 8am - 5pm
Every effort is made that allows our patients to schedule their appointment day and time that best fits their schedule. From time to time a delivery will prevent your provider from being available for your appointment. We will attempt to reach you prior to your visit to reschedule your appointment. We appreciate your understanding in this circumstance.
Telephone Services:
Our staff handles all incoming phone messages for our healthcare providers. You will be called back with their response as soon as possible. If you need assistance after hours, the provider on call can be reached by calling 207-861-3000 and Inland's staff will be happy to page the doctor on call for you. If you are pregnant and are having an emergency, patients are encouraged to contact the Inland Birthing Center at 207-861-3100.
Cancellation Policy:


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Volume 92 Issue 15 | p. 6 | News of The Week
Issue Date: April 14, 2014
Issue Date: April 14, 2014
Daiichi Quits On Ranbaxy
Generics: India's Sun Pharma will take on Ranbaxy and its quality woes
A little more than five years after acquiring a majority stake in Ranbaxy Laboratories, Japan's Daiichi Sankyo is throwing in the towel on the troubled Indian firm. Sun Pharmaceutical Industries, one of India's largest manufacturers of generic drugs, will acquire Ranbaxy for about $4.0 billion.
Sun will pay for Ranbaxy with stock. When the deal is completed, Daiichi Sankyo will end up with a 9% stake in Sun . . .
You Do Not Have Access to C&EN Protected Content.
- Chemical & Engineering News
- Copyright © American Chemical Society


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Fit my 05 YZ250 like it should, radiator shrouds fit nice, everything fits the way it should!
Acerbis Gas Tank
- Description
- 72 Reviews
- 66 Questions
- Fitment
Today, Acerbis continues to produce innovative and protective aftermarket accessories with the same enthusiasm and passion as their founder had in the early years. Over 30 years of experience with the best off-road racers in the world has enriched their constant technical development, allowing them to become a premier company within the motorcycle industry.
Acerbis fuel tanks provide additional fuel capacity while still providing slim ergonomics and sleek styling.
- Impact and abrasion-resistant polyurethane provides years of service with proper care.
- Tank has a narrow profile for optimal control of the motorcycle.
- Compatible with aftermarket fan kits and radiator braces.
- All fuel tanks include Acerbis gas cap, mounting kit, vent hose, and all necessary mounting hardware and instructions.
- Applications that require special fuel Y-fittings, petcocks, etc. will come with the tank.
- Size and shape may very from application to application.
- Notes: EFI tanks do NOT come with the fuel pump; they are designed to accept the stock one. Image is for representation only; actual items may vary by fitment.
Acerbis Tank Warranty:
ACERBIS stands behind their products against manufacturer defects. In situations where a crash occurs, a solvent, liner or paint is applied, a product is improperly installed, or in a case of general neglect, ACERBIS is not liable and all warranties are void.
- Paint that is added to the interior or exterior of any ACERBIS fuel tanks will in turn void any and all warranties. ACERBIS' tanks are made from polyethylene, which is a porous material that allows fuel vapor to escape. The minimal vapor that vents through is normal and will not affect the performance of the tank.
- Vinyl wraps and or stickers will also impede the tank's ability to vent and should not be used. And, they can also vapor lock the vehicle. In most if not all cases, the wrap or sticker will bubble from the escaping fumes.
- Internal coatings added to ACERBIS tanks are not recommended and should be avoided. ACERBIS tanks are perfectly functional and do not require the addition of internal coatings. Polyethylene can react negatively to a variety of chemicals so applying any second-party products will void any and all warranties.
- If an ACERBIS tank is punctured in the event of a crash, ACERBIS is not liable for replacement.
Read More
Does not fit a 04 YZ250F,
Easy job , just have to shim the middle part on the tank for covers
I have a 94 Honda xr650 and always looking for the next gas station. This acerbic 5 gallon tank assembled gassed up and down the road in an hour. Thank you moto sport for the 2 day delivery and best price.
The 2.9 gallon fit perfect on my 2008 crf450. I have radiator guards but all you have to do is flip them upside down and the tank fits perfect. No cutting or grinding needed.
Berry Good
I have a 1994 suzuki dr 350 se model and this tank was listed for the s model and they didn't list the se in their fitment chart. I asked if it would fit mine and they couldn't say for sure but said if it didn't I could return it. I purchased this tank and it was a perfect fit. Great tank and great place to do business with! Thanks for everything
A bit disappointed as this was described as a 4.25 gallon tank but after two fills from empty at two different gas stations, it only holds 3.8 gallons. This is on a Suzuki DR350. I do like the dual petcocks though, and it's well built and fits good.
Acerbis replacement tank. Looks & fits great easy install on my KTM 450 XC-f the black looks way better than the natural tank that came on it I got the 3.1 gallon tank not needing anything bigger really nice my second experience with acerbis and I love them they give you plenty of hardware that you don't even need but just in case
Installed this tank on my new bike. Easy to install and I really like the extra gas and the look on the bike. It fills in the void space and makes it look beafier. Make sure and get acerbis locking gas cap to it has a check valve built into it so you don't have to deal with a vent hose
This acerbis tank was an amazing addition to my CRF250L. The tank is made out of great quality plastic. Installation wasn't too difficult, but did have a few speedbumps. One, the fuel pump has to be inserted reversely compared to how the tank is stock, and there were some fitting difficulties that were easily fixed. Plus, the extra mileage is always nice. The longer time out riding, the bigger smile appears on the face, and riders are happy. Great product!
This product is not made for the Honda CRF250X, it is for a Honda CRF250R!
That being said, and the fact that the frames ARE different, this tank will fit but requires a hole approximately 7/8 of an inch below the stock mounting hole. 5mm drill/6 mm tap will do the trick in minutes and the look is great!
Just think of the new hole as weight savings :)
I bought this tank for extra fuel capacity. It's a good design and fits well. The original seat fits well with the new tank and the bike is still comfortable to ride. I'm generally happy with this tank.
I do not like the fact that the valves attach to the tank with lag screws instead of threaded inserts. Also the plastic T-fitting include with the plumbing kit is garbage and should be replaced with a metal fitting.
It's a good thing to have more fuel, but somethings you need to know are 1: it will not fit unless you do a smog delete to remove the can. 2:: it is pretty tough to get your factory plastic back on, but it can be done. 3: it will fit with radiator braces and a fan. It looks fine but is more yellow than I'd like. I also don't care for the pump being mounted by plastic screws instead of into metal thread inserts. All in all I needed a bigger tank and to keep my six days looking stock and it worked
Very nice fit with the exception of the airbox covers. This tank was designed for 2013 and prior years, my 2014 required airbox covers (additional $30) from a 2013 and then the fit was perfect. Came with all the fittings and hardware for installation. Tank is definitely wider up near the built in shrouds, tank/seat junction is nearly the same as with the stock tank. It easily cleared the cooling fan and Enduro Engineering radiator guards. Claimed capacity was 4.1 gallons, actual capacity is 4.2 gallons.....bonus.
Acerbis does it right. Tank fit perfect on my 2007 Honda crf 450. I got the natural color. It's nice an clear not all yellowed like you find on ims tanks. If your gonna purchase any type of plastics for your bike stick with acerbis they been doing since 1973.
Tank installed with out any mods very simple down side is it cant be painted but the extra fuel is nice to have. 95 dr 350se
I recently installed this on my 2006 KX450F for a Hare and Hound race. The quick fill cap malfunctioned and the spring loaded cap got stuck and did not allow fuel to enter the tank. The cap being stuck also allowed fuel to spill out which almost sanded me 30miles out in the desert. After working on the cap for several minutes I got the spring to wedge closed. This poor design cost me 15min overall on my time and almost left me stranded.
Great piece. 5.3 Gallons for my 2016 KTM 500 EXC sounds great. Easy install, complete kit. Wish there were more safari tank options for these bikes, but you get what you pay for.
Overall a great product! I love the slim line of such a large capacity tank. Finish is great, comes with easy to use directions and all required fittings. My only wish is that they would have made the fit next to the side covers more exact. there is a good 3/8" gap between the tank and the side covers. Word to the wise...when buying any new tank- flush that bad boy prior to install! Acerbis did a good job but I flushed out several curls and chips of plastic out of the tank- would have been a bad day if those clogged the filter/injector!
Read More
Dirt Bike: 1-888-676-8853
You can also contact Acerbis directly at: firstname.lastname@example.com or (800) 659-1440
Read More
Read More


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When I embed YouTube video in my blog post with Usernoise on, it gets reduced to a small display instead of the full 560x315 display in IE9. Not sure about IE8 or 7, but this problem is not there in FF or Chrome.
I've tested with all other plugins by sequentially uninstalling them but the problem persists with Usernoise. The moment I uninstall it the video displays properly.
Looks like there is some conflict of scripts. Please help.


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Department of Greek & Latin
Departmental Manager
Greek & Latin: position now being advertised. Closing date 1 Sept. 2016 More...
Guardian League Table 2017
UCL Humanities Ranked 5th in World
In the The Times Higher Education World University Rankings 2015-16
Use and Abuse of Law in the Athenian Courts
Organisers: I. Giannadaki, C. Carey
Tuesday 16th April
Key-note Speech, Chair: C.CAREY
M. Gagarin - " Abuse is in the Eye of the Beholder (keynote speech) "
SESSION 1, Chair: C. Carey
I. Arnaoutoglou - " «…τους νόμους διαστρέφειν...» What is (ab)use of law in 4th-century Athens? "
R. Osborne - " The Elasticity of the Athenian Law "
E. M. Harris - " The Athenian View of an Athenian Trial "
Wednesday 17th April
SESSION 1, Chair: L. HORVATH
A. Efstathoiu - " Playing games with law: the case of Demosthenes and Aeschines "
L. Rubinstein - " Clauses out of context: partial citation of statutes in Attic forensic oratory "
A. L. Delli Pizzi - " Impiety and the Legal Sphere: Analysis of Athenian Court Speeches "
SESSION 2, Chair: M. GAGARIN
D. Mirhady - " Crime-scene Athens: Homicide and the Problem of Place "
M. Edwards - " The use and abuse of law in the speeches of Antiphon "
D. Phillips - " Athenian Homicide Law and the Model Penal Code "
SESSION 3, Chair: M. EDWARDS
M. Aloumpi - " Law, hybris, and the untold story of Meidias' offence (Dem. 21) "
B. Griffith-Williams - " Use or Abuse of diamartyria in an Athenian inheritance case? "
SESSION 4, Chair: R. OSBORNE
L. Horváth - " Delaying the legal Procedure "
N. Sato - " Abusing Legal Procedures for Impeding Legal Procedure "
Thursday 18th April
SESSION 1, Chair: C. KREMMYDAS
F. Carugati - " Nie Pozwalam! The patrios politeia debate and the procedure of graphe paranomon revisited "
V. Wohl - " Jurisdiction and jurisprudence in D. 23 "
I. Giannadaki - " Throwing sand in the eyes of the dikastai "
M. Canevaro - " Laws against Laws: the Athenian ideology of legislation and its abuses "
SESSION 2, Chair: B. GRIFFITH-WILLIAMS
E. Volonaki - " The abuse of the eisangelia procedure in the fourth century B.C "
A. Lanni - " Law, Norms, and Persuasion in Against Leocrates "
R. Hatzilambrou - " Isaios' abuse of law: a scholarly misconception? "
SESSION 3, Chair: A. LANNI
G. Thür - " Misuse of the laws of homologein, ancient and modern "
K. Apostolakis - " Liturgies and the Rhetoric of Law in Fourth-century Athens "
D. Spatharas - " Emotions and the Law "
SESSION 4, Chair: V. WOHL
C. Carey - " Legal Play in Menander "
The organisers are pleased to announce that the oral presentations are also available on the iTunes Store, accessible to a wider audience, for use both by professionals in research and teaching and by interested members of the public.
C. Carey - Opening thoughts
Speakers' interviews - Closing comments
Monday 5th August 2013
After the successful 'Use and Abuse' conference in April 2013 and the publication of the talks online, the organisers are pleased to announce that they are also planning to publish the proceedings in book form. 'The best is yet to come'. More updates to follow soon.
Generously sponsored by


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Leonard Cohen's drummer tells Tap what he's listening to
Leonard Cohen's touring drummer Rafael Gayol poses during a sound check at the Olympic Stadium in Amsterdam; you'll notice Mr. Cohen in the background in a fedora. Photo by Hattie Webb (who sings and plays harp and mandolin in Cohen's band). »Read Full Blog Post
Olly Murs brings a mixed bag of tricks to The Rave
Olly Murs has been touted as the U.K.'s answer to Bruno Mars ahead of his new campaign to break out stateside.
Thing is, we already have a Bruno Mars. »Read Full Article(1)