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E. Sun Villa Hotel & Resort
E. Sun Villa Hotel & Resort
Hotel Freebies Available*
• Free Internet in Room show dates
E. Sun Villa Hotel & Resort
Set in a prime location of Chiayi, E. Sun Villa Hotel & Resort puts everything the city has to offer just outside your doorstep. The property features a wide range of facilities to make your stay a pleasant experience. Facilities like free Wi-Fi in all rooms, 24-hour front desk, 24-hour room service, luggage storage, Wi-Fi in public areas are readily available for you to enjoy. Comfortable guestrooms ensure a good night's sleep with some rooms featuring facilities such as television LCD/plasma screen, non smoking rooms, air conditioning, desk, balcony/terrace. The hotel offers various recreational opportunities. E. Sun Villa Hotel & Resort combines warm hospitality with a lovely ambiance to make your stay in Chiayi unforgettable. ...read more
E. Sun Villa Hotel & Resort Amenities
- 24-Hour Front Desk
- 24-Hour Room Service
- Air Conditioning
- Balcony/Terrace
- Bathrobes
- Bathtub
- Business Center
- Car Park
- Chinese (Mandarin)
- Coffee/Tea Maker
- Complimentary Bottled Water
- Desk
- Dvd/Cd Player
- Elevator
- English
- Family Room
- Free Wi-Fi In All Rooms
- Hair Dryer
- In Room Safe
- Internet Access - Lan
- Internet Access - Lan (Complimentary)
- Ironing Facilities
- Laundry Service
- Luggage Storage
- Mastercard
- Meeting Facilities
- Non Smoking Rooms
- Refrigerator
- Restaurant
- Room Service
- Satellite/Cable Tv
- Separate Shower And Tub
- Shops
- Shower
- Television Lcd/Plasma Screen
- Visa
- Wi-Fi In Public Areas
- Beverly Garden Motel (0.4mi)
- Shianghu Boutique Hotel from $79 (0.5mi)
- Day Plus Hotel from $62 (0.6mi)
- Ever Delightful Business Hotel from $51 (0.6mi)
- Oh Ya Boutique Motel Chiayi from $81 (0.7mi)


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Looking for Solstice fashion inspiration? We've put together a list of five ensembles inspired by pieces in our collection!
The Thinker: A CMA Blog
visitors guest artists performing arts birthday podcast African Art wari Contemporary Art curator Caravaggio Collection exhibitions treasures of heaven Paul Gauguin: Paris playlists university circle art Events community arts conservation Cleveland Special Exhibition Education Exhibition behind the scenes five things happening this week this week at cma The Cleveland Museum of Art senufo Photography textiles music film interview Parade the Circle Video international Gauguin #get2knowcaravaggio museum

subset: commoncrawl


text: 437 FXUS63 KLOT 220843 AFDLOT Area Forecast Discussion National Weather Service Chicago/Romeoville, IL 343 AM CDT FRI JUL 22 2016 .SHORT TERM... 342 AM CDT Through Saturday... Heat and humidity continue through Saturday as does an unstable atmosphere that could result in more storms. The only changes I made to the heat headlines was adding a heat advisory Saturday for Kendall and Will counties in IL and Jasper, Benton, and Newton counties in Indiana. Otherwise the going heat headlines seem accurate with no need to adjust them. Today: A weak cold front is across southern MN and central WI this morning and it will drop south into northern IL today. At the same time a weak upper level disturbance currently over SD will shift east and weaken as it does so. Not expecting much if any forcing from these features today. Also expecting cloud cover to linger through at least the morning. The impressive convective cloud shield overhead is inhibiting fog formation and will likely take awhile to clear today. Given the lack of forcing and lingering cloud cover, have low confidence in convection today. Forecast soundings feature a stout cap that I don`t think there will be enough forcing nor mixing to overcome it. However, with a little forcing in place, did not feel comfortable going dry either. Liking the CR-HRR and NMM-East solutions that feature mainly dry conditions with perhaps a few isolated showers and storms. As such kept PoPs in the slight chance to low chance range. The cloud cover may impact temps slightly, and I did lower high temps by a couple of degrees today. Also lowered dewpoints a bit given current conditions. This resulted in max heat indices ranging from 110-115 east of I-39 and south of I-80 but all areas will see heat indices of 100+. Decided to keep the heat headlines as is because it will feel icky outside regardless of the exact heat index. The message of taking precautions to avoid heat related illnesses is still valid. The front hangs around Saturday and could see additional convection fire along it. Guidance once again features a cap in the morning, but this time it looks like the cap will be eroded leading to convection especially Saturday night. Confidence increases through Saturday afternoon into Saturday night as the cap weakens and an upper level shortwave swings through. Kept high temps in the 90s except along the lake where a lake breeze should keep temps in the 80s. Added a heat advisory for a few counties where heat indices will be around 105. JEE && .LONG TERM... 342 AM CDT Sunday through Thursday... A cold front swings through Sunday with a chance of showers and storms ahead of it. Thinking Sunday will be the final day of heat and humidity. A heat advisory may be needed for most of the warning area. Heat indices vary from 100 to 110. Slightly cooler and drier conditions move in Monday and Tuesday with highs in the 80s. A more active pattern returns mid and late in the week with periodic chances of storms. High temps look to remain in the 80s. JEE && .AVIATION... For the 06Z TAFs... Concerns: - Gusty south winds for the next few hours - Lower visibilities late tonight into early Friday - Thunderstorm chances today - Wind shift to east and timing - Fog Friday night into early Saturday A wake low behind earlier thunderstorms will create a temporarily strong pressure gradient over our eastern terminals such that gusts to 25-30 kt are possible for a few hours. The rain shield will be shifting south in the next few hours. The next concern shifts to visibilities later tonight. The back edge of the thicker cirrus shield is moving southeast through Central Wisconsin, and visibilities are tanking. The trailing end of the cirrus still has several more hours before getting close to the Illinois- Wisconsin border. Have indicated some mvfr vsby for now as as the clearing may take place just past the diurnal minimum, but it is possible that things drop quickly to ifr or lifr at or around sunrise and this will bear watching given the light winds that will arrive in a few hours once the wake low eases. Next concerns center around convective chances. Have hung onto the Prob30 timing for now, but confidence is low. Forcing mechanisms center around a south ward moving frontal boundary or possible lake breeze, and any subtle west-southwest moving shortwaves. The RUC/HRRR dampen the waves in the plains as they approach, and convergence on the front/lake breeze appears weak, such that a cap in forecast soundings may not be broken. Will re-evaluate in the 9z and 12z AMDs to see if thunder chances can be pulled. If no convection occurs, light winds and moist conditions will likely result in fog Friday night. KMD && .MARINE... 259 AM CDT Winds this morning should ease as high pressure gradually shifts east over the lake later today into tonight. A weak cold front will also move south across the lake today but winds should remain relatively weak. The high will shift east Saturday, and this coupled with low pressure that will move to south of Hudson Bay Sunday will allow a warm front to lift north across the lake Sunday. Winds may gust to 25 possibly 30 kt Sunday. A weak cold front will return Sunday night followed by high pressure through mid week. Waves are still a bit disturbed this morning following thunderstorms last night, but expect that they will continue to ease this morning. KMD && .LOT WATCHES/WARNINGS/ADVISORIES... IL...Excessive Heat Warning...ILZ003-ILZ004-ILZ005-ILZ006-ILZ011- ILZ012-ILZ013-ILZ014-ILZ020-ILZ022 UNTIL 7 PM Friday. Heat Advisory...ILZ020-ILZ022...7 PM Friday TO 7 PM Saturday. Excessive Heat Warning...ILZ008-ILZ010-ILZ019-ILZ021-ILZ023- ILZ032-ILZ033-ILZ039 UNTIL 7 PM Saturday. IN...Heat Advisory...INZ001-INZ002 UNTIL 7 PM Friday. Heat Advisory...INZ010-INZ011-INZ019 UNTIL 7 PM Saturday. LM...NONE. && $$ VISIT US AT HTTP://WEATHER.GOV/CHICAGO (ALL LOWERCASE) FOLLOW US ON FACEBOOK...TWITTER...AND YOUTUBE AT: WWW.FACEBOOK.COM/NWSCHICAGO WWW.TWITTER.COM/NWSCHICAGO WWW.YOUTUBE.COM/NWSCHICAGO


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Formal Request to the Galactic Underworld. (OOC & Sign-ups)
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Fumblez, you disappoint me. What did we say about bios? It's far more interesting when they are discovered during the RP. (#5)
I'm also not sure if it is a good idea to try to keep everything that's not RP in this thread. Especially cross references, like feedback to story postings. Not sure about that, though, but I actually liked IC and OOC posts in one thread. But I'm not sure about that one and we'll see how it works out. (#4)
Galaxy altering events... need to be checked with the others. If we could work the plotlines into them, instead of them destroying the plotlines, it could be fun. But all in all, we are more limited. (#1)
But now I'd like to know: Did you and the others discuss all this (and, for Example, when to set it) in PMs and just didn't send them to me? Or did you decide these things on your own?
"I was one of many. We were servants of the dark side… Sith Lords, we called ourselves. So proud.
In the end we were not so proud. We hid… hid from those we had betrayed. We fell… and I knew it would be so."
-Ajunta Pall


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no better feeling than mud between your toes
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Below are top resources on SparkPeople for Healthy Dinner Dishes.
We all have those days when there's barely a minute to breathe, much less time to shop for ingredients and prepare a complicated home-cooked meal. A busy schedule doesn't mean you're destined for the drive-thru window, though. Delic... Read more
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Any advice on healthy recipes... Read more
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A must on you list of places to eat. Food was reasonably priced, portion sizes large, staff were friendly and atmosphere great
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Significado de "be that as it may" - Diccionario Inglés
(Definition of "be that as it may" from the Cambridge Advanced Learner's Dictionary & Thesaurus © Cambridge University Press)
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Palabra del día
to sew two things together, or to repair something by sewing
Palabras nuevas


text:
The Chelsea
100 - 249
20 - 50 Million
SIC Code:
7011 - Hotels and Motels
Full company description is available with the free trial.
Additional Info:
This member of the Hotels/motels industry is located in Atlantic City, NJ and you can find important contact information regarding significant company contacts on their Lead411 profile like linkedin, phone numbers, facebook and cfo details. The profile also contains The Chelsea email addresses which have a domain of @thechelsea-ac.com format. If you sign up for our free trial you will see our email@example.com addresses.
Company Background:
Full company description is available with the free trial.
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Wyndham Worldwide
Wyndham Worldwide, a business led by CEO Stephen Holmes, is part of the Hotels/motels industry. Wyndham Worldwide email with the @wyndhamworldwide.com format, you can check their Lead411 profile. They hold their main office in Parsippany, NJ and more data like cfo contacts and linkedin data can be found within our profiles. If you sign up for our free trial you will see our email@example.com addresses.
Tropicana Casino and Resort
Want to know how to get in touch with them? Lead411 has the email addresses of Tropicana Casino and Resort's top officials for the company domain @tropicana.net format. Tropicana Casino and Resort is a Hotels/motels company centred in Atlantic City, NJ and our profiles could include more contact information like cfo people, linkedin contacts, phone numbers and facebook pages. If you sign up for our free trial you will see our email@example.com addresses.
Horizon Hotels Ltd
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Company Directory > The Chelsea


text:
|By Business Wire
Article Rating:
|April 10, 2014 07:00 AM EDT
As the consumer, industrial and automotive infotainment markets evolve rapidly to meet the demands of increasingly discerning end-users, systems designers need processors with the performance to run rich user interfaces without sacrificing real-time responsiveness or power efficiency. To achieve this, systems designers often must choose between multi-chip solutions, which increase cost, board space, and system complexity; or adopting virtualization on a multicore processor, which can negatively impact real-time performance and system power.
To address this challenge, Freescale Semiconductor (NYSE:FSL) introduces the industry's first applications processor to integrate an ARM Cortex-A9 processor and an ARM Cortex-M4 processor in a single chip design. This design enables enhanced flexibility, performance and low-power functionality for the company's flagship i.MX 6 applications processor family.
"Freescale has leveraged its experience and deep understanding of microcontrollers, microprocessors and heterogeneous SoC design to deliver yet another industry first," said Rajeev Kumar, worldwide director of marketing and business development for Freescale's MCU business. "For our customers, this innovative device provides the most comprehensive solution available in a single chip for applications requiring rich user interfaces, real-time responsiveness and optimized low power operation."
Freescale's i.MX 6 series of applications processors is growing quickly, particularly in the automotive space, where shipments grew more than 50 percent from 2012 to 2013. According to analyst firm Strategy Analytics, Freescale ranks #2 in automotive market share for applications processors.
Integrating a Cortex-M4 processor alongside a Cortex-A class system provides customers with a cost-effective single-chip solution that can run a sophisticated operating system and provide real-time responsiveness to help build the next generation of connected, highly graphical and system-aware devices. Freescale's innovative heterogeneous applications processor design provides additional low power modes to significantly reduce standby power consumption, allows for smaller form factor design, and executes fast, real-time responsiveness to system inputs.
To support applications which simultaneously require real-time task processing and compute-intensive capabilities, the SoC incorporates four independently controlled resource domains for optimal flexibility when partitioning system resources such as memory and peripherals. As a result, peripheral and memory access requests are hardware-verified to provide secure isolation and prevent tainting of system resources.
Additional features of the newest i.MX 6 series processor include:
- Dual-port gigabit Ethernet audio video bridging (AVB) for quality-of-service in automotive and other applications with enhanced traffic shaping and packet prioritization.
- Cost-effective 2D and 3D graphics processing unit (GPU) for enhanced HMI development.
- Flexible boot options, including support for quad SPI and raw NAND, and a memory controller that interfaces to both DDR3 and low power DDR2.
- Smart integration of standard system interfaces, including multiple interface options for UI and wireless connectivity to provide system design flexibility and low overall BOM.
Alpha samples of this expanded i.MX 6 processor are available now, with full production expected in Q4 2014. The design is available with a comprehensive set of development tools and software support including Android and Linux operating systems for the Cortex-A9 processor, the MQX™ OS for the Cortex-M4 processor and the broad ARM community of support. Also planned for availability in Q4 is the expanded i.MX 6 series SABRE board. The newest i.MX device joins an already-broad portfolio of i.MX 6 series products shipping today, offering multiple processing and integration options for maximum flexibility and scalability.
About Freescale Semiconductor
Freescale Semiconductor is a global leader in embedded processing solutions, providing industry leading products that are advancing the automotive, consumer, industrial and networking markets. From microprocessors and microcontrollers to sensors, analog integrated circuits and connectivity - our technologies are the foundation for the innovations that make our world greener, safer, healthier and more connected. Some of our key applications and end-markets include automotive safety, hybrid and all-electric vehicles, next generation wireless infrastructure, smart energy management, portable medical devices, consumer appliances and smart mobile devices. The company is based in Austin, Texas, and has design, research and development, manufacturing and sales operations around the world. http://www.freescale.com.
Freescale and the Freescale logo are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. All product or service names are the property of their respective owners. ARM and Cortex are trademarks or registered trademarks of ARM Ltd. or its subsidiaries in the EU and/or elsewhere. All rights reserved. All other product or service names are the property of their respective owners. © 2014 Freescale Semiconductor, Inc.
The Internet of Things will challenge the status quo of how IT and development organizations operate. Or will it? Certainly the fog layer of IoT requires special insights about data ontology, security and transactional integrity. But the developmental challenges are the same: People, Process and Platform. In his session at @ThingsExpo, Craig Sproule, CEO of Metavine, demonstrated how to move beyond today's coding paradigm and shared the must-have mindsets for removing complexity from the develo...
Jul. 28, 2016 02:30 AM EDT Reads: 1,519
SYS-CON Events announced today that MangoApps will exhibit at the 19th International Cloud Expo, which will take place on November 1–3, 2016, at the Santa Clara Convention Center in Santa Clara, CA. MangoApps provides modern company intranets and team collaboration software, allowing workers to stay connected and productive from anywhere in the world and from any device.
Jul. 28, 2016 02:15 AM EDT Reads: 1,388
IoT is rapidly changing the way enterprises are using data to improve business decision-making. In order to derive business value, organizations must unlock insights from the data gathered and then act on these. In their session at @ThingsExpo, Eric Hoffman, Vice President at EastBanc Technologies, and Peter Shashkin, Head of Development Department at EastBanc Technologies, discussed how one organization leveraged IoT, cloud technology and data analysis to improve customer experiences and effi...
Jul. 28, 2016 02:00 AM EDT Reads: 2,040
The IETF draft standard for M2M certificates is a security solution specifically designed for the demanding needs of IoT/M2M applications. In his session at @ThingsExpo, Brian Romansky, VP of Strategic Technology at TrustPoint Innovation, explained how M2M certificates can efficiently enable confidentiality, integrity, and authenticity on highly constrained devices.
Jul. 28, 2016 01:45 AM EDT Reads: 1,099
In today's uber-connected, consumer-centric, cloud-enabled, insights-driven, multi-device, global world, the focus of solutions has shifted from the product that is sold to the person who is buying the product or service. Enterprises have rebranded their business around the consumers of their products. The buyer is the person and the focus is not on the offering. The person is connected through multiple devices, wearables, at home, on the road, and in multiple locations, sometimes simultaneously...
Jul. 28, 2016 01:15 AM EDT Reads: 817
"delaPlex Software provides software outsourcing services. We have a hybrid model where we have onshore developers and project managers that we can place anywhere in the U.S. or in Europe," explained Manish Sachdeva, CEO at delaPlex Software, in this SYS-CON.tv interview at @ThingsExpo, held June 7-9, 2016, at the Javits Center in New York City, NY.
Jul. 28, 2016 01:00 AM EDT Reads: 1,610
"We've discovered that after shows 80% if leads that people get, 80% of the conversations end up on the show floor, meaning people forget about it, people forget who they talk to, people forget that there are actual business opportunities to be had here so we try to help out and keep the conversations going," explained Jeff Mesnik, Founder and President of ContentMX, in this SYS-CON.tv interview at 18th Cloud Expo, held June 7-9, 2016, at the Javits Center in New York City, NY.
Jul. 27, 2016 10:30 PM EDT Reads: 1,407
Internet of @ThingsExpo, taking place November 1-3, 2016, at the Santa Clara Convention Center in Santa Clara, CA, is co-located with the 19th International Cloud Expo and will feature technical sessions from a rock star conference faculty and the leading industry players in the world and ThingsExpo Silicon Valley Call for Papers is now open.
Jul. 27, 2016 10:00 PM EDT Reads: 2,665
The IoT is changing the way enterprises conduct business. In his session at @ThingsExpo, Eric Hoffman, Vice President at EastBanc Technologies, discussed how businesses can gain an edge over competitors by empowering consumers to take control through IoT. He cited examples such as a Washington, D.C.-based sports club that leveraged IoT and the cloud to develop a comprehensive booking system. He also highlighted how IoT can revitalize and restore outdated business models, making them profitable ...
Jul. 27, 2016 09:45 PM EDT Reads: 2,003
"delaPlex is a software development company. We do team-based outsourcing development," explained Mark Rivers, COO and Co-founder of delaPlex Software, in this SYS-CON.tv interview at 18th Cloud Expo, held June 7-9, 2016, at the Javits Center in New York City, NY.
Jul. 27, 2016 08:00 PM EDT Reads: 2,034
We all know the latest numbers: Gartner, Inc. forecasts that 6.4 billion connected things will be in use worldwide in 2016, up 30 percent from last year, and will reach 20.8 billion by 2020. We're rapidly approaching a data production of 40 zettabytes a day – more than we can every physically store, and exabytes and yottabytes are just around the corner. For many that's a good sign, as data has been proven to equal money – IF it's ingested, integrated, and analyzed fast enough. Without real-ti...
Jul. 27, 2016 07:30 PM EDT Reads: 1,109
"There's a growing demand from users for things to be faster. When you think about all the transactions or interactions users will have with your product and everything that is between those transactions and interactions - what drives us at Catchpoint Systems is the idea to measure that and to analyze it," explained Leo Vasiliou, Director of Web Performance Engineering at Catchpoint Systems, in this SYS-CON.tv interview at 18th Cloud Expo, held June 7-9, 2016, at the Javits Center in New York Ci...
Jul. 27, 2016 06:45 PM EDT Reads: 2,070
I wanted to gather all of my Internet of Things (IOT) blogs into a single blog (that I could later use with my University of San Francisco (USF) Big Data "MBA" course). However as I started to pull these blogs together, I realized that my IOT discussion lacked a vision; it lacked an end point towards which an organization could drive their IOT envisioning, proof of value, app dev, data engineering and data science efforts. And I think that the IOT end point is really quite simple…
Jul. 27, 2016 06:45 PM EDT Reads: 1,179
A critical component of any IoT project is what to do with all the data being generated. This data needs to be captured, processed, structured, and stored in a way to facilitate different kinds of queries. Traditional data warehouse and analytical systems are mature technologies that can be used to handle certain kinds of queries, but they are not always well suited to many problems, particularly when there is a need for real-time insights.
Jul. 27, 2016 04:30 PM EDT Reads: 1,879
Big Data, cloud, analytics, contextual information, wearable tech, sensors, mobility, and WebRTC: together, these advances have created a perfect storm of technologies that are disrupting and transforming classic communications models and ecosystems. In his session at @ThingsExpo, Erik Perotti, Senior Manager of New Ventures on Plantronics' Innovation team, provided an overview of this technological shift, including associated business and consumer communications impacts, and opportunities it ...
Jul. 27, 2016 04:30 PM EDT Reads: 213
You think you know what's in your data. But do you? Most organizations are now aware of the business intelligence represented by their data. Data science stands to take this to a level you never thought of – literally. The techniques of data science, when used with the capabilities of Big Data technologies, can make connections you had not yet imagined, helping you discover new insights and ask new questions of your data. In his session at @ThingsExpo, Sarbjit Sarkaria, data science team lead ...
Jul. 27, 2016 04:15 PM EDT Reads: 1,145
Extracting business value from Internet of Things (IoT) data doesn't happen overnight. There are several requirements that must be satisfied, including IoT device enablement, data analysis, real-time detection of complex events and automated orchestration of actions. Unfortunately, too many companies fall short in achieving their business goals by implementing incomplete solutions or not focusing on tangible use cases. In his general session at @ThingsExpo, Dave McCarthy, Director of Products...
Jul. 27, 2016 04:00 PM EDT Reads: 1,744
Is your aging software platform suffering from technical debt while the market changes and demands new solutions at a faster clip? It's a bold move, but you might consider walking away from your core platform and starting fresh. ReadyTalk did exactly that. In his General Session at 19th Cloud Expo, Michael Chambliss, Head of Engineering at ReadyTalk, will discuss why and how ReadyTalk diverted from healthy revenue and over a decade of audio conferencing product development to start an innovati...
Jul. 27, 2016 04:00 PM EDT Reads: 1,070
WebRTC is bringing significant change to the communications landscape that will bridge the worlds of web and telephony, making the Internet the new standard for communications. Cloud9 took the road less traveled and used WebRTC to create a downloadable enterprise-grade communications platform that is changing the communication dynamic in the financial sector. In his session at @ThingsExpo, Leo Papadopoulos, CTO of Cloud9, discussed the importance of WebRTC and how it enables companies to focus...
Jul. 27, 2016 03:30 PM EDT Reads: 977
SYS-CON Events announced today that 910Telecom will exhibit at the 19th International Cloud Expo, which will take place on November 1–3, 2016, at the Santa Clara Convention Center in Santa Clara, CA. Housed in the classic Denver Gas & Electric Building, 910 15th St., 910Telecom is a carrier-neutral telecom hotel located in the heart of Denver. Adjacent to CenturyLink, AT&T, and Denver Main, 910Telecom offers connectivity to all major carriers, Internet service providers, Internet backbones and ...
Jul. 27, 2016 11:00 AM EDT Reads: 738


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...All my students have shown a significant improvement in their grades which has given me a high degree of satisfaction. I would like to continue helping students in the Southern Chester County area improve their grades in math and science subjects. For the student`s convenience I typically meet at their home with a parent required to be present.
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New Lightweight Hoodies. Great for laziness, business, or any other -ness.
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As shocking and truthful as the literary classic "Everybody Poops,' this book entitled 'All of my Friends are Dead,' explores everyone from clowns to zombies to dinosaurs and their complaints about life (or death).
Reading this book is a matter of life and death -- literally. If you're the only dinosaur of your kind or you just like a good laugh, 'All of my Friends are Dead' offers a lighthearted look at death and all of life's little grievances.
Death Mocking Books
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Homemade Baby Food Deliveries
Bacon-Wrapped Cheese Buns
Female Scientist LEGO Sets
Future Festival 2016
LEGO Particle Colliders
'All of my Friends are Dead' Takes a Lighthearted Look at a Serious Subject
Sep 14, 2010By: Shelby Lee Walsh -
References: nomorefriends.net & urbanoutfitters
References: nomorefriends.net & urbanoutfitters


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Engine information: 4 Cylinder Engine Vehicle options: Driver Air Bag;Passenger Air Bag;Front Side Air Bag;Front Head Air Bag;Rear Head Air Bag;AM/FM Stereo;ABS;Front Disc/Rear Drum Brakes;Rear Defrost;Child Safety Locks;Front Wheel Drive;4 Cylinder Engine;Floor Mats;Gasoline Fuel;Daytime Running Lights;Power Door Locks;Heated Mirrors;Power Mirror(s);Pass-Through Rear Seat;Bucket Seats;Power Steering;Adjustable Steering Wheel;Temporary Spare Tire;Traction Control;Power Windows;Intermittent Wipers;MP3 Player;Steering Wheel Audio Controls;Security System - Engine Immobilizer;Driver Vanity Mirror;Passenger Vanity Mirror;Remote Trunk Release;Trip Computer;Bluetooth Connection;Stability Control;Brake Assist;Rear Bench Seat;Passenger Air Bag Sensor;Knee Air Bag; Wheels: 16" Steel w/Full Wheel Covers, Variable Intermittent Wipers, Trunk Rear Cargo Access, Trip Computer, Transmission: Continuously Variable (CVTi-S), Torsion beam rear suspension w/coil springs, Tires: P205/55R16 -inc: temporary spare tire, Strut Front Suspension w/Coil Springs, Steel Spare Wheel, Splash Guards. This Toyota Corolla has a powerful Regular Unleaded I-4 1.8 L/110 engine powering this Variable transmission. These Packages Will Make Your Toyota Corolla LE The Envy of Your Friends Spare Tire Mounted Inside Under Cargo, Single stainless steel exhaust, Side impact beams, Seats w/Cloth Back Material, Remote Releases -Inc: Mechanical Trunk/Hatch and Mechanical Fuel, Remote Keyless Entry w/Integrated Key Transmitter, Illuminated Entry and Panic Button, Rear Cupholder, Rear child safety locks, Radio: AM/FM/CD w/MP3/WMA Audio Capability -inc: 6.1 inch display audio, voice recognition, audio auxiliary input jack, USB audio input, Bluetooth capability, 6 speakers and glass imprinted antenna, Radio w/Seek-Scan, Clock, Speed Compensated Volume Control, Steering Wheel Controls and Radio Data System, Premium fabric seat trim, Power Rear Windows, Power Door Locks w/Autolock Feature, Power 1st Row Windows w/Driver 1-Touch Up/Down, Outside temp gauge, Outboard Front Lap And Shoulder Safety Belts -inc: Rear Centre 3 Point, Height Adjusters and Pretensioners, Manual Tilt/Telescoping Steering Column, Manual air conditioning, Light Tinted Glass, Leather/Metal-Look Gear Shift Knob."
Quebec (Quebec) - For a car enthusiast, the launch of a new Toyota Corolla is not an event that is circled on the calendar. For Toyota however, the launch of the 2014 Toyota Corolla, the 11th generation of the popular compact sedan, is an event of immeasurable importance.See the Editor's Review
Based on 5 reviewsSee the Reviews Submit a Review


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- Les anges exterminateurs (16 pics) ... Stéphanie
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Marie Allan is a French actress. She appeared as a leading actress in Jean-Claude Brisseau's 2006 Cannes Film Festival film Les Anges Exterminateurs, which considers female eroticism.
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The people are great, the atmosphere is amazing. Unfortunately, there are more bugs in the rooms than grains of sand on the beach. Repairs are needed everywhere. When using a microwave, all the lights in the surrounding rooms visibly dim. The water pressure is great, but it smells greatly of eggs. The AC units work fantastically, providing your room is one of the few that has knobs on the appliances. Bring your own fridge, toilet paper, towels, telephone and cleaning supplies, as the service is nonexistant.
Property: Pier One Motel & RestaurantAddress: 3430 Rte. 37 E, Toms River, NJ 08753
Location: United States > New Jersey > Jersey Shore > Toms River
Ranked #9 of 11 Hotels in Toms River
Price Range (Based on Average Rates): $
Number of rooms: 278


text:
Tetra Whisper Air Pump 10-30
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About this item
About this item
Important Made in USA Origin Disclaimer: For certain items sold by Walmart on Walmart.com, the displayed country of origin information may not be accurate or consistent with manufacturer information. For updated, accurate country of origin data, it is recommended that you rely on product packaging or manufacturer information.
The Tetra Whisper Air Pump operates with minimal noise and maximum efficiency. This fish tank air pump features sound dampening chambers and a suspended pump motor to enable ultra-quiet operation. This Tetra Whisper Air Pump 10-30 also has rubber feet. The Tetra air pump for aquariums has a unique dome shape that actually flattens out sound wave frequencies. This Tetra Whisper Pump also reduces noise by preventing reflective sounds from bouncing off nearby surfaces. Together, the features in this Tetra Whisper Pump help keep your aquarium working as it should without excess or disturbing noise.
Tetra Whisper Air Pump 10-30:
- Minimal noise, maximum air flow
- Dome shape actually flattens sound wave frequencies
- Includes sound dampening chambers
- Rubber feet and suspended motor prevent sound waves from reflecting off surfaces
|Gray , Black
|Pet Food Form:
|Pet Grooming
|3 Watts
|1 Count
|Pet Grooming
|Assembled Product Dimensions (L x W x H):
|2.75 x 4.00 x 6.25 Inches
Customer Reviews | 42 reviews | 3.8 out of 5
Customer Reviews
Customer review by sandollars
The pump works great. I have a Hawkeye 2 gallon aquarium (which Goldie and I love!) and it puts out more than enough air. A couple of things I didn't know until after I purchased it. I should have maybe read up on it a little better. You will need a regulator to control the air flow, other wise it just pumps a one speed which is a pretty good flow. (I have to turn it off when I feed my goldfish, otherwise the food goes all over the place). If you are going to put the pump on a counter or something like that you also need something for the backflow, or put the pump higher than the tank to prevent the water going back into the pump when you turn it off. Other than that, I am very happy with my purchase. Goldie, my fish, loves it. Would recommend:)
Read all 42 reviews
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- Wall power - no batteries.by C6666/11/2016Was this answer helpful? (5) (1)Was this answer helpful?
- Outlet no batteryby BigBigone6/24/2013Was this answer helpful? (0) (0)Was this answer helpful?
- No battery straight plug and play very simple. One speedby Averagejor4807/31/2013Was this answer helpful? (1) (0)Was this answer helpful?
- You have to plug it in to an outlet.by sandollars6/11/2015Was this answer helpful? (1) (0)Was this answer helpful?
- It plugs into an outlet.by teacherDar11/9/2012Was this answer helpful? (0) (0)Was this answer helpful?
- outlet onlyby romar0810/21/2012Was this answer helpful? (1) (0)Was this answer helpful?
- Nope - get the hose and back flow valve separately.by C6666/11/2016Was this answer helpful? (1) (0)Was this answer helpful?
- It has no hose. It has to be purchased separately.by teacherDar12/4/2013Was this answer helpful? (4) (0)Was this answer helpful?
- no it does notby ALTHEPAL558/25/2013Was this answer helpful? (1) (1)Was this answer helpful?
- No it doesn't but you can get the hose for around $1.75by LoverOfAllCritters7/31/2013Was this answer helpful? (2) (0)Was this answer helpful?
- NO, you need to buy a seperate air hose.by Fishhobby12/6/2015Was this answer helpful? (2) (2)Was this answer helpful?
- Probably the number of gallons in the tank it can service.by C6665/26/2014Was this answer helpful? (0) (0)Was this answer helpful?
- I believe it means it is for a 10-30 gallon aquarium.by teacherDar11/9/2012Was this answer helpful? (0) (0)Was this answer helpful?
- 10-30 gallons so it is for 10-30 gal tanksby ALTHEPAL558/27/2012Was this answer helpful? (1) (0)Was this answer helpful?
- It tells how many gallons it's for. In this case it's for a 10 to 30 gallon tankby kakamom5/24/2014Was this answer helpful? (2) (0)Was this answer helpful?
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Listed by Hall Truck & Auto Sales Inc.
This is a very nice 1969 Buick GS California edition. Extremely rare and very hard to find car. This is
Listed by Cruisin Classics
1969 Buick Gran Sport 400 ConvertibleCruisin Classics is proud to introduce a spectacular classic. This (REAL)1969 Buick Gran Sport 400
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For sale in our Nashville showroom is a real and rare 1969 Buick Gran Sport 400 convertible. With just over
Listed by Streetside Classics - Atlanta
No, your eyes aren't deceiving you: this is a numbers-matching 1969 Buick GS400 with a nice restoration for a price
Listed by Champion Pre-Owned Classics
This is a very rare 1969 Buick Skylark Sport Wagon. It has the Buick 400 cu in engine, automatic transmission,


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Former Florida Gov. Jeb Bush plans to endorse former Massachusetts Gov. Mitt Romney before the Jan. 31 Florida primary, a Florida GOP source close to Bush told BuzzFeed Thursday.
The endorsement from Bush, who despite prodding from members of his famous family and prominent Republicans decided to sit out the 2012 contest, is the latest sign that the Republican establishment is coalescing around Romney after months publicly griping about finding another candidate.
Bush is the brother of President George W. Bush, who has not endorsed anyone in the race, and the son of President George H. W. Bush who endorsed Romney last month. His son, Jeb, Jr., endorsed former Utah Gov. Jon Huntsman in an overhyped event in August. He currently chairs the campaign's GenH young professionals arm.
The Florida Herald-Tribune reported yesterday that First Lady Laura Bush told a Sunshine State audience this week that her husband "and I wish he would [run for president.] We wanted him to this time."
Bush did not immediately respond to a request for comment.
- The Democratic National Committee on Monday apologized for remarks sent over email criticizing the Bernie Sanders campaign 🇺🇸
- At least 15 people died and 45 others were injured in a knife attack at a facility for the disabled near Tokyo, Japan.
- Verizon is buying Yahoo's core business for about $5 billion, ending the web pioneer's run as an independent company.


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|Publication number
|Publication type
|Application number
|Publication date
|Aug 24, 2004
|Filing date
|Aug 22, 2001
|Priority date
|Aug 22, 2000
|Fee status
|Also published as
|Publication number
|Masahiko Takeuchi, Kazuhiko Mizuuchi, Hironobu Kawasato
|Original Assignee
|Nippon Steel Chemical Co., Ltd.
|Export Citation
|BiBTeX, EndNote, RefMan
|Patent Citations (13), Non-Patent Citations (9), Classifications (30), Legal Events (5)
|External Links: USPTO, USPTO Assignment, Espacenet
This invention relates to a photo- or heat-curable resin composition suitable for insulating a printed wiring board and to a multilayer printed wiring board containing an insulating resin layer formed from said photo- or heat-curable resin composition.
In recent years, the on-going miniaturization of electronic instruments has led to the development of a multi-level system for printed wiring in order to attain a higher degree of integration of electronic devices and the so-called build-up process which is put into practice by forming an insulating layer and a conductive layer alternately and laminating them together has come into frequent use. And here, high reliability is demanded for the resin materials to be used for insulation. Moreover, it is often the case that a printed wiring board is covered with an insulating layer to protect the surface or the mounted chips.
In the use of insulating materials based on organic resins in multilayer printed wiring boards, however, the organic resins differ greatly in the thermal expansion coefficient from the active parts such as semiconductor devices and the passive parts such as capacitative elements and resistors and, still more, from substrates such as sintered alumina materials, epoxy resins on glass cloth formed by impregnating glass cloth woven from glass fibers with epoxy resins, and silicon wafers; in case a large thermal stress results from the difference in the thermal expansion coefficient between the organic resins and other components, the stress causes cracking and splitting apart of semiconductor devices, capacitative elements, and conductive wirings and the affected devices cease to function normally.
Now, a practice of incorporating fillers in resin insulating materials is known from old and the incorporation of fillers in the resin components constituting the resin insulating layers of multilayer wiring boards is also known. In JP 09-148748 (1997)A1, for example, a filler is used for roughening the surface of a resin insulator in order to improve the adhesion of resin insulator to wiring; however, the filler here is used not only for the object different from that of this invention but also at a high rate of incorporation on the order of 5-50% by weight and the practice as described here cannot manifest a sufficient effect in the thermal shock test which is a typical reliability test.
On the other hand, JP 10-242650 (1998)A1 has an object of reducing cracking in the thermal shock test and attempts to realize this by reducing the thermal expansion coefficient of an insulating material by adding a filler. In this case again, the content of the filler is high on the order of 10-95% by weight and fine patterns are difficult to obtain when the resin insulating layer is processed.
Wet plating and dry plating are known in the manufacture of multilayer printed wiring boards by a process such as the build-up process; the former requires the uneven condition in practice which makes its use difficult in a high frequency region and the latter is gaining favor.
Accordingly, an object of this invention is to provide a photo- or heat-curable resin composition which cures into a film of high reliability as tested by the thermal shock test which is a typical test for reliability of substrates as a resin composition for forming a resin insulating layer in a wiring board. Another object of this invention is to provide a resin composition which can be processed to yield fine patterns. A further object of this invention is to provide a cured resin which is heat- and solvent-resistant and suitable for use as an interlayer insulating layer in a multilayer printed wiring board.
The present inventors have conducted extensive studies to solve the aforementioned problems, found that incorporating in a resin a fine filler with its particle diameter controlled in the specified range contributes to produce an effect of preventing the formation of minute cracks when the resin is used as an insulating layer in a wiring board, and completed this invention.
This invention relates to a photo- or heat-curable resin composition which is intended for forming an insulating layer in a multilayer printed wiring board and comprises 0.1-5 parts by weight of an inorganic filler with its average particle diameter controlled in the range 5 nm-0.5 μm per 100 parts by weight of the resin-forming component.
Moreover, this invention relates to the aforementioned photo- or heat-curable resin composition comprising (A) 100 parts by weight of a photopolymerizable unsaturated compound represented by the following general formula (1)
wherein R is a hydrogen atom or a methyl group, A is a group represented by the formula (2)
(wherein R1 and R2 are hydrogen , an alkyl group with 1-5 carbon atoms, or a halogen) and X is —CO—, —SO2—,—C(CF3)2—,—Si(CH3)2—, —CH2—,—C(CH3)2—,—O—, —S—,
or a single bond, Y and Z are respectively the residue of a polycarboxylic acid or its acid anhydride, and m and n are the number of structural units at a molar ratio (m/n) 0/100-100/0,
(B) 0-50 parts by weight of a compound containing an epoxy group, and
(C) 0-10 parts by weight of a photopolymerization initiator or sensitizer.
Still more, this invention relates to the aforementioned photo- or heat-curable resin composition comprising silica sol as an inorganic filler. Furthermore, this invention relates to a multilayer printed wiring board comprising a cured product of the aforementioned photo- or heat-curable resin composition as an insulating layer.
This invention will be described in detail below.
A photo- or heat-curable resin composition of this invention comprises 100 parts by weight of the resin-forming component and 0.01-5 parts by weight of a filler with its average particle controlled in the range 5 nm-0.5 μm. The resin-forming component refers to a component which cures into a resin and is computed as the sum of a resin and a monomer (including a curing agent). A photo- or heat-curable resin composition of this invention may comprise an initiator, a solvent and other additives in addition to the resin-forming component and filler.
A photo- or heat-curable resin composition of this invention preferably comprises a photopolymerizable unsaturated compound, a compound containing an epoxy group, a photopolymerization initiator or sensitizer, and a filler as essential components. More preferably, the composition comprises a photopolymerizable unsaturated compound represented by the aforementioned general formula (1) or the component (A) and a compound containing an epoxy group or the component (B) as the resin-forming component, a photopolymerization initiator or sensitizer or the component (C) as the initiator component, and an inorganic filler with its average particle diameter controlled in the range 5 nm-0.5 μm or the component (D) as the filler component. The incorporation of a photopolymerizable unsaturated compound other than the component (A) or the component (F) may also be beneficial.
A compound which contains an ethylenic unsaturated bond and is liquid at normal temperature can generally be cited as a photopolymerizable unsaturated compound, but what is preferred here is a photopolymerizable unsaturated compound represented by the aforementioned general formula (1) or the component (A). The component (A) can be prepared, for example, by epoxidizing a bisphenol which contains X at its center, treating the epoxidized bisphenol with (meth)acrylic acid, and then treating the resulting (meth)acrylate with the anhydride of a polybasic acid. The procedure for preparing the component (A) is not limited to the aforementioned; for convenience' sake, however, the aforementioned procedure will be explained below.
Concrete examples of useful bisphenols are as follows: bis(4-hydroxyphenyl) ketone, bis(4-hydroxy-3,5-dimethylphenyl) ketone and bis(4-hydroxy-3,5-dichlorophenyl) ketone for X=—CO— in the general formula (1) and (2); bis(4-hydroxyphenyl) sulfone, bis(4-hydroxy-3,5-dimethylphenyl) sulfone and bis(4-hydroxy-3,5-dichlorophenyl) sulfone for X=—SO2—; bis(4-hydroxyphenyl)hexafluoropropane, bis(4-hydroxy-3,5-dimethylphenyl)hexafluoropropane and bis(4-hydroxy-3,5-dichlorophenyl)hexafluoropropane for X=—C(CF3)2—; bis(4-hydroxyphenyl)dimethylsilane, bis(4-hydroxy-3,5-dimethylphenyl)simethylsilane and bis(4-hydroxy-3,5-dichlorophenyl)dimethylsilane for X=—Si(CH3)2—; bis(4-hydroxyphenyl)methane, bis(4-hydroxy-3,5-dibromophenyl)methane and bis(4-hydroxy-3,5-dichlorophenyl)methane for X=—CH2—; 2,2-bis(4-hydroxyphenyl)propane, 2,2-bis(4-hydroxy-3,5-dimethylphenyl)propane and 2,2-bis(4-hydroxy-3,5-dichlorophenyl)propane for X=—C(CH3)2—; bis(4-hydroxyphenyl) ether, bis(4-hydroxy-3,5-dimethylphenyl) ether and bis(4-hydroxy-3,5-dichlorophenyl) ether for X=—O—; bis(4-hydroxyphenyl) sulfide, bis(4-hydroxy-3,5-dimethylphenyl) sulfide and bis(4-hydroxy-3,5-dichlorophenyl) sulfide for X=—S—; 9,9-bis(4-hydroxyphenyl)fluorene, 9,9-bis(4-hydroxy-3-methylphenyl)fluorene, 9,9-bis(4-hydroxy-3-chlorophenyl)fluorene, 9,9-bis(4-hydroxy-3-bromophenyl)fluorene, 9,9-bis(4-hydroxy-3-fluorophenyl)fluorene, 9,9-bis(4-hydroxy-3-methoxyphenyl)fluorene, 9,9-bis(4-hydroxy-3,5-dimethylphenyl)fluorene, 9,9-bis(4-hydroxy-3,5-dichlorophenyl)fluorene and 9,9-bis(4-hydroxy-3,5-dibromophenyl)fluorene for X=fluorene-9-ylidene; and 4,4′-dihydroxybiphenyl and 3,3′-dihydroxybiphenyl for X=direct bond.
The epoxidation of the aforementioned bisphenols can be effected in the usual manner. For example, a bisphenol is dissolved in excess epichlorohydrin and allowed to react in the presence of an alkali metal hydroxide such as sodium hydroxide and potassium hydroxide at 50-150� C., preferably at 60-120� C., for 1-10 hours.
The reaction of an epoxy compound and (meth)acrylic acid is effected by treating each 1 mole of the epoxy group in the epoxy compound with 0.8-1.5 moles, preferably 0.9-1.1 moles, of (meth)acrylic acid. In this reaction, methyl ethyl ketone or Methyl Cellosolve acetate may be used as a diluent. Also, a catalyst such as triethylamine, benzyldimethylamine, methyltriethylammonium chloride and triphenylphosphine may be used to accelerate the reaction. The catalyst is used in an amount corresponding normally to 0.1-10% by weight, preferably to 0.3-5% by weight, of the reactant mixture, the reaction temperature is kept at 60-150� C., preferably at 80-120� C., and the reaction time is 5-60 hours, preferably 10-50 hours.
The groups Y and Z in the aforementioned general formula (1) respectively designate the residue of a polycarboxylic acid or its acid anhydride and, preferably, Y is the residue of an acid anhydride and Z is the residue of an acid dianhydride. Polycarboxylic acids or their acid anhydrides that can form such residues as Y and Z include maleic acid, succinic acid, itaconic acid, phthalic acid, tetrahydrophthalic acid, hexahydrophthalic acid, methyl-endomethylenetetrahydrophthalic acid, chlorendic acid, methyltetrahydrophthalic acid, pyromellitic acid, benzophenonetetracarboxylic acid, biphenyltetracarboxylic acid, and diphenyl ether tetracarboxylic acid and their anhydrides. They can be used singly or as a mixture of two kinds or more.
The reaction of an epoxy (meth)acrylate with a polycarboxylic acid (or its acid anhydride) can be effected in a known manner. A polycarboxylic acid or its acid anhydride to be used here is preferably a tribasic or higher carboxylic acid or its anhydride or a mixture of the two so that the resulting photopolymerizable unsaturated compound (it may be in the form of a resin) represented by the general formula (1) exhibits an acid value of 10 mg KOH/g or more and manifests sufficient solubility in alkali.
The component (A) represented by the aforementioned general formula (1) is not necessarily limited to the aforementioned compounds and it may be used as a mixture of two kinds or more. Moreover, a monoanhydride and a dianhydride of polycarboxylic acids are used simultaneously at a molar monohydride/dianhydride ratio 0/100-100/0, preferably 1/99-90/10. Moreover, it is preferable that the inherent viscosity of a solution of 0.5 g of the component (A) in 100 ml of N-methylpyrrolidone at 30� C. is 0.1 dl or more.
A compound containing an epoxy group or the component (B) is used for the purpose of improving adhesion and alkali resistance and examples of such a compound include epoxy resins such as phenol novolak epoxy resins, cresol novolak epoxy resins, bisphenol A epoxy resins, bisphenol F epoxy resins, bisphenol S epoxy resins, biphenyl epoxy resins, and alicyclic epoxy resins and compounds containing at least one epoxy group such as phenyl glycidyl ether, p-butylphenyl glycidyl ether, triglycidyl isocyanurate, allyl glycidyl ether and glycidyl methacrylate.
It is permissible to use a curing agent for epoxy compounds together with the component (B), but there is no need of that in case a compound containing a carboxyl group such as the component (A) is present.
In addition to the aforementioned resin-forming component consisting of the component (A), component (B) and curing agent, it is possible to incorporate another resin or monomer exhibiting a property of undergoing polymerization or condensation as the component (F) in a photo- or heat-curable resin composition of this invention. In case the matrix resin component is soluble in alkali, it is advisable to select a resin or monomer for the component (F) and incorporate it so that this property of alkali solubility is maintained. By maintaining the alkali solubility, it becomes possible to form fine patterns by alkali development in processing an insulating layer of the substrate.
Resins or monomers suitable for incorporation with the alkali solubility kept intact include alkali-soluble resins whose skeleton alone is modified or other (meth)acrylates.
The (meth)acrylates here include the following: hydroxyl-containing (meth)acrylate such as hydroxyethyl (meth)acrylate, hydroxypropyl (meth)acrylate, 2-hydroxyethylhexyl (meth)acrylate, polyethylene glycol mono(meth)acrylate, polypropylene glycol mono(meth)acrylate, butanediol mono(meth)acrylate, and chlorohydroxypropyl (meth)acrylate; aliphatic (meth)acrylates such as allyl (meth)acrylate, butoxyethyl (meth)acrylate, triethylene glycol butyl ether (meth)acrylate, t-butylaminoethyl (meth)acrylate, caprolactone (meth)acrylate, butyl (meth)acrylate, hexyl (meth)acrylate, cyanoethyl (meth)acrylate, dimethylaminoethyl (meth)acrylate, diethylamino (meth)acrylate, ethoxyethyl (meth)acrylate, ethylhexyl (meth)acrylate, isodecyl (meth)acrylate, isooctyl (meth)acrylate, lauryl (meth)acrylate, octyl (meth)acrylate, stearyl (meth)acrylate, succinic acid (meth)acrylate, methacryloyloxypropyltrimethoxysilane, methoxyethyl (meth)acrylate, cyclodecatrienyl (meth)acrylate, glycerol (meth)acrylate, glycidyl (meth)acrylate, isocyanatoethyl (meth)acrylate, heptadecafluorooctyl (meth)acrylate, octafluoropentyl (meth)acrylate, tetrafluoropropyl (meth)acrylate, trifluoroethyl (meth)acrylate, and dibromopropyl (meth)acrylate; alicyclic-modified (meth)acrylates such as cyclohexyl (meth)acrylate, dicyclopentanyl (meth)acrylate, dicyclopentenyl (meth)acrylate, isobornyl (meth)acrylate, tetrahydrofurfuryl (meth)acrylate, and morpholino (meth)acrylate; aromatic (meth)acrylates such as phenoxyethyl (meth)acrylate, phenoxyhydroxypropyl (meth)acrylate, polypropylene glycol nonylphenyl ether (meth)acrylate, phenyl (meth)acrylate, phthalic acid (meth)acrylate, and benzyl (meth)acrylate; phosphorus-containing (meth)acrylates such as phenoxylated phosphoric acid (meth)acrylate, phosphoric acid (meth)acrylate, butoxylated phosphoric acid (meth)acrylate, and octoxylated phosphoric acid (meth)acrylate; and water-soluble (meth)acrylates such as sodium sulfonate (meth)acrylate.
The monomers in question also include the following bifunctional compounds: ethylene glycol di(meth)acrylate, diethylene glycol di(meth)acrylate, hexanediol di(meth)acrylate, di(meth)acrylates of long-chain aliphatic diols, neopentyl glycol di(meth)acrylate, hydroxypivalic acid neopentyl glycol di(meth)acrylate, stearic acid-modified pentaerythritol di(meth)acrylate, propylene glycol di(meth)acrylate, glycerol di(meth)acrylate, triethylene glycol di(meth)acrylate, tetraethylene glycol di(meth)acrylate, triethylene glycol divinyl ether, tetramethylene glycol di(meth)acrylate, butylene glycol di(meth)acrylate, dicyclopentanyl di(meth)acrylate, polyethylene glycol di(meth)acrylate, polypropylene glycol di(meth)acrylate, triglycerol di(meth)acrylate, neopentyl glycol-modified trimethylolpropane di(meth)acrylate, allylated cyclohexyl di(meth)acrylate, methoxylated cyclohexyl di(meth)acrylate, acrylic group-substituted isocyanurate, bis(acryloyloxyneopentyl) adipate, bisphenol A di(meth)acrylate, tetrabromobisphenol A di(meth)acrylate, bisphenol S di(meth)acrylate, butanediol di(meth)acrylate, phthalic acid di(meth)acrylate, phosphoric acid di(meth)acrylate, zinc di(meth)acrylate, divinylbenzene, and divinyl ether.
Furthermore, the monomers in question include the following trifunctional or higher compounds: trimethylolpropane tri(meth)acrylate, trimethylolethane tri(meth)acrylate, glycerol tri(meth)acrylate, pentaerythritol tri(meth)acrylate, alkyl-modified dipentaerythritol tri(meth)acrylate, phosphoric acid tri(meth)acrylate, tris(acryloyloxyethyl) isocyanurate, tris(methacryloyloxyethyl) isocyanurate, pentaerythritol tetra(meth)acrylate, dipentaerythritol tetra(meth)acrylate, ditrimethylolpropane tetraacrylate, alkyl-modified dipentaerythritol tetra(meth)acrylate, dipentaerythritol penta(meth)acrylate, dipentaerythritol hexa(meth)acrylate, alkyl-modified dipentaerythritol penta(meth)acrylate, urethane tri(meth)acrylate, ester tri(meth)acrylate, urethane hexa(meth)acrylate, ester hexa(meth)acrylate, trivinyl ether and hexavinyl ether.
Modifications by caprolactone, propylene oxide or ethylene oxide of the aforementioned monofunctional, difunctional, trifunctional and higher compounds containing ethylenic unsaturated groups can also be used in the same manner. Other polymerizable monomers, for example, monofunctional vinyl compounds like vinyl acetate, vinylcaprolactam, vinylpyrrolidone, and styrene can be used if necessary. Resins such as polyesters and polyvinyl resins can also be used if necessary. In the use of the aforementioned monofunctional, difunctional, trifunctional and higher compounds, modifications and resins, not only one kind can be used alone but also two kinds or more can be used simultaneously.
In the case in which good photo-curability or high sensitivity is demanded in addition to alkali solubility for a resin composition of this invention, the resin or monomer to be incorporated contains preferably two or more polymerizable double bonds (binfunctional or higher), more preferably three or more polymerizable double bonds (trifunctional or higher), in the molecule.
As for the proportion of the aforementioned resin and monomer to be incorporated in the case in which good photo-curability is required, an insufficient incorporation of, for example, trifunctional or higher acrylates does not cause photo-curing to proceed sufficiently thereby causing the exposed regions to dissolve out on occasion; on the other hand, too much incorporation generates the cases in which even the unexposed region cannot be developed and there is the possibility of the tack-free property being lost depending upon the degree of polymerization and the structure of acid anhydrides.
The resin-forming component of a photo- or heat-curable resin composition of this invention consists of the component (A), the component (B), a curing agent and other resin or monomer and the resin-forming component comprises at least one kind of them, preferably the component (A) and another kind, more preferably the component (A), the component (B), and other resin or monomer composed essentially of a trifunctional or higher resin or monomer. The component (A) suitably accounts for 30-80% by weight of the resin-forming component, the component (B) 10-50% by weight, and other resin or monomer 10-40% by weight. Other resin or monomer is preferably a polyfunctional acrylate containing two or more (meth)acrylate groups. The proportions of the three are 100 parts by weight of the component (A), 0-50 parts by weight of the component (B), and 0-100 parts of other resin or monomer.
An inorganic filler with its average particle diameter controlled in the range 5 nm-0.5 μm is used in a photo- or heat-curable resin composition of this invention. The filler is not restricted to any particular kind as long as its average particle diameter is in this range and it can be selected suitably in consideration of such factors as its compatibility with the matrix-forming resin component and dispersibility. Silica sol is preferable and its dispersion in an organic solvent is more preferable, the latter being commercially available.
The average particle diameter of a filler useful for this invention varies more or less with the end use of the resin composition, but it needs to be in the range 5 nm-0.5 μm. In case the composition is intended for resin insulation in wiring boards, the average particle diameter is preferably in the range 7 nm-0.3 μm, more preferably 10-100 nm, An average particle diameter of less than 5 nm produces a weak reinforcing effect while an average particle diameter in excess of 0.5 μm rather lowers the mechanical properties of resin.
The amount of inorganic filler to be added in this invention is in the range 0.01-5 parts by weight for every 100 parts by weight of the resin-forming component in the resin composition although it varies somewhat with the property of the filler in use. An amount of 0.01 part by weight or less produces a weak reinforcing effect while an amount of 5 parts by weight or more rather deteriorates the properties such as reliability of the resin composition. As the filler to be used in this invention is small in average particle diameter, it produces an anticipated effect even when it is added in a relatively small amount. Among the aforementioned amounts to be added, the range 0.1-1 part by weight is preferable.
In case an inorganic filler to be used in this invention contains a solvent as silica sol, the amount to be added refers to the solid content expressed in part by weight.
The average particle diameter and range of addition of the aforementioned inorganic filler being as described above, the most preferable procedure is to add 0.1-0.6 part by weight of the filler with its average particle diameter controlled in the range 5-30 nm to 100 parts by weight of the resin-forming component.
In case the aforementioned silica sol is used, the kind dispersed in an organic solvent may be used and dispersion media include methanol, ethylene glycol, propylene glycol monomethyl ether, ethylene glycol mono-n-propyl ether, methyl ethyl ketone, isopropanol and butyl acetate. A dispersion medium is not restricted in any specific way and it is selected adequately, for example, by using dispersibility of the filler in resin as criterion.
A photopolymerization initiator or sensitizer to be used in this invention or the component (C) is intended not only for the component (A) but also for a photopolymerizable (meth)acrylic monomer or oligomer to be incorporated as needed. The component (C) to be used for such a purpose includes known photopolymerization initiators such as radical-generating Michler's ketone and cation-generating triarylsulfonium salts and diaryliodonium salts and these initiators can be used singly or as a mixture of two kinds or more. The component (C) is not always necessary in case the resin composition is thermally polymerizable, but it gains importance when patterns are formed by such steps as exposure to light and development.
The aforementioned photopolymerization initiators can be used in combination with known photosensitizers such as ethyl N,N-dimethylaminobenzoate, isoamyl N,N-dimethylaminobenzoate, triethanolamine and triethylamine and the photosensitizers here may be used singly or as a mixture of two kinds or more.
The aforementioned photopolymerization initiator or sensitizer is used at a dombined proportion of 0-10 parts by weight, preferably 1-5 parts by weight, per 100 parts by weight of the resin-forming component. Use of more than 10 parts by weight increases light absorption and develops the possibility of light not penetrating to the lower region. In case the component (A) is used, the photopolymerization initiator or sensitizer in question is incorporated at a rate of 0.01-10 parts by weight, preferably 1-5 parts by weight, per 100 parts by weight of the component (A).
It is allowable to incorporate, together with the aforementioned essential components, additives such as curing accelerators for epoxy resins, polymerization inhibitors, plasticizers, leveling agents, and antifoaming agents in a photo- or heat-curable resin composition of this invention as needed. Such additives include the following compounds: amines, imidazoles, carboxylic acids, phenols, quaternary ammonium salts, and methylol group-containing compounds as curing accelerators for epoxy resins; hydroquinone, hydroquinone monomethyl ether, pyrogallol, tert-butylcatechol, and phenothiazine as thermal polymerization inhibitors; dibutyl phthalate, dioctyl phthalate, and tricresyl phosphate as plasticizers; and silicones, fluorine-containing compounds, and acrylic compounds as antifoaming agents and leveling agents.
Moreover, the viscosity of a photo- or heat-curable resin composition of this invention can be adjusted by incorporating a solvent as needed. A solvent for this use needs to be capable of dissolving the aforementioned matrix resin component and yet nonreactive with the resin in the matrix resin component and the additives and, as long as these conditions are satisfied, there are no other restrictions.
A photo- or heat-curable resin composition of this invention is formulated so that it comprises 99-80% by weight of the resin-forming component, 0.01-5% by weight of a filler, and 0.1-20% by weight of an initiator and other additives exclusive of a solvent and the viscosity is adjusted to the desired value by proper incorporation of a solvent.
Furthermore, it is possible to use a photo- or heat-curable resin composition of this invention in the form of dry film.
The method of forming a conductive layer on the surface of a layer of cured resin is not restricted. For example, a circuit is formed by applying a resin composition to the base material by spin coating or curtain coating, drying, exposing to light, developing and curing by heat. The surface of the cured resin is planarized by buffing as needed and a known dry plating process is applied. Then, a known process for electrolytic copper plating is applied to form a conductive layer.
A photo- or heat-curable resin composition of this invention is also used as a protective film on the surface of a wiring board or as a protective insulation layer of chips mounted on a wiring board.
[Preparation of Resin Compositions]
Photo- or heat-curable resin compositions of Examples 1 to 3 containing about 50% by weight of a resin as solid, exhibiting a viscosity of about 200 c.p. at 23� C., and differing in the amount of an inorganic filler were prepared as a dispersion at room temperature by mixing resin (A) or the compound represented by the general formula (1) wherein X is fluorene-9-ylidene and the following additives in accordance with the following recipe and adding an inorganic filler. The inorganic filler used here was silica sol with a particle diameter of 10-20 nm (Organosilica Sol NPC-ST available from Nissan Chemical Industries, Ltd.; content of silica, 30%) and it was incorporated at a rate of 0.25 part by weight as silica (or 0.83 part by weight as organosilica sol) in Example 1, 0.5 part by weight in Example 2, and 0.75 part by weight as silica (or 2.50 parts by weight as organosilica sol) in Example 3 per 98 parts by weight of the resin-forming component.
In the recipe, the tetramethylbiphenylepoxy resin was Epikote YX4000 available from Yuka Shell Epoxy K.K., the polyfunctional acrylate was KAYARAD TMPTA available from Nippon Kayaku Co., Ltd., the photopolymerization initiator was Irgacure 651 available from Ciba-Geigy, and the solvent was propylene glycol monomethyl ether acetate (PGMEA).
Resin A
parts by weight (60 g)
Tetramethylbiphenylepoxy resin
parts by weight (12 g)
Polyfunctional acrylate
parts by weight (26 g)
Sensitizer (Michler's ketone)
part by weight (0.08 g)
Photopolymerization initiator
part by weight (2 g)
parts by weight (100 g)
A photo- or heat-curable resin composition was prepared from 200 g of the aforementioned photo- or heat-curable resin composition (exclusive of the inorganic filler) by adding 0.5 part by weight of Organosilica Sol EG-ST-ZL (content of silica, 20%; particle diameter, 70 nm; available from Nissan Chemical Industries, Ltd.) as inorganic filler to 98 parts by weight of the resin-forming component.
The aforementioned photo- or heat-curable resin composition less the inorganic filler was used as a comparative specimen.
A photo- or heat-curable resin composition was prepared as in Example 1 except incorporating 10 parts by weight of the inorganic filler (Organosilica Sol NPC-ST) per 98 parts by weight of the resin-forming component.
A photo- or heat-curable resin composition was prepared as in Example 1 except incorporating 20 parts by weight of the inorganic filler (Organosilica Sol NPC-ST) per 98 parts by weight of the resin-forming component.
A photo- or heat-curable resin composition was prepared as in Example 1 except incorporating 0.5 part by weight of a filler with an average particle diameter of 2 μm [Poly(methyl methacrylate) Filler MX-180, available from Soken Kagaku K.K.) per 98 parts by weight of the resin-forming component.
The conditions for preparing a base material for evaluation are as follows.
On a commercially available FR-4 base material copper-clad on both sides (MCL-E-67 available from Hitachi Chemical Co., Ltd.: thickness of copper wiring, 18 μm) were formed 1350�4 dumbbell-shaped patterns and the surface of the copper was roughened by the Neobrown process of Ebara Densan K.K. to prepare a base material for evaluation.
The base material for evaluation was spin-coated with the aforementioned photo- or heat-curable resin composition to a thickness of 20 μm, dried at 110� C. for 10 minutes, photo-cured by irradiating with a 500-W high-pressure mercury lamp at 200 mj/cm2 (i-line), developed by a developer (V-2590D, available from Nippon Steel Chemical Co., Ltd.), and post-cured in air at 180� C. for 90 minutes.
Method for Evaluating Reliability
The thermal shock test was conducted under the following conditions to evaluate reliability.
Each of the base materials for evaluation prepared under the aforementioned conditions was subjected to a test consisting of 250 cycles of immersion in a liquid at −65� C. for 5 minutes and then in another liquid at 125� C. for 5 minutes in a thermal shock tester, TSB-1L manufactured by TABAI ESPEC K.K., and the number of cracks on each base material was noted for comparison.
Method for Evaluating Resolution
Resolution was assessed by determining the minimum width of line and space with which a circuit can be formed at a film thickness of 20 μm.
Method for Evaluating Heat Resistance
The glass transition temperature (Tg) was determined by a known dynamic viscoelastic method.
The results of evaluation of Examples and Comparative Examples are shown in Table 1.
Content of
of filler
Part by wt
Example 1
Example 2
Example 3
Example 4
Comp. ex. 1
Comp. ex. 2
Comp. ex. 3
Comp. ex. 4
As is apparent from the aforementioned results of Examples 1 to 4 and Comparative Examples 1 to 4, dispersing a small amount of a fine inorganic filler produces good resistance to cracking. In addition, both high glass transition temperature and high resolution are obtained.
Photo- or heat-curable resin compositions of this invention cure into resins with minimal cracking and high reliability. Properly selected resins help to yield resin compositions of good heat resistance due to high glass transition temperature and good microfabrication quality and such resin compositions are useful for forming peripheral materials of electronic parts such as semiconductor devices by the build-up process, for example, insulation layers in multilayer printed wiring boards and WL-CSP.
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|"fill-er" from American Heritage dictionary of the English language, Second College edition, p. 503, Houghton Mifflin Company, Boston, MA 1982.*
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|AERISIL Datasheet, three pages, , Aerosil 380, degussa Ag, from website htp://x:email@example.com/sivento/sili. . ilica13 datasheet.aps?id+512&definito and www.aerosilcom.*
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|U.S. Classification
|430/18, 522/77, 430/280.1, 430/311, 430/285.1, 524/493
|International Classification
|Cooperative Classification
|European Classification
|Oct 2, 2001
Owner name: NIPPON STEEL CHEMICAL CO., LTD., JAPAN
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Owner name: NIPPON STEEL & SUMIKIN CHEMICAL CO., LTD., JAPAN
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Blog URL http://bear-foot.blogspot.co.uk
Hello, and Here's Where to Go Now Added 29 July 14, 12:16
Life is a Happy Shed
Blog URL http://www.happyshed.blogspot.co.uk
Music Monday – one that makes me cry Added 28 July 14, 21:08
Blog URL http://mumorama.wordpress.com