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|Publication number
|Publication type
|Application number
|Publication date
|Jan 2, 1990
|Filing date
|Apr 11, 1986
|Priority date
|Aug 3, 1981
|Fee status
|Also published as
|Publication number
|Jan Bloem, Wilhelmus A. P. Claassen
|Original Assignee
|U.S. Philips Corporation
|Export Citation
|BiBTeX, EndNote, RefMan
|Patent Citations (9), Non-Patent Citations (4), Referenced by (10), Classifications (37), Legal Events (3)
|External Links: USPTO, USPTO Assignment, Espacenet
This is a division of application Ser. No. 664,635, filed Oct. 25, 1984, and now abandoned, said application Ser. No. 664,635 being a continuation of application Ser. No. 396,921, filed July 9, 1982 and now abandoned.
The invention relates to a semiconductor device having a semiconductor body which comprises a circuit element with a part formed from doped polycrystalline silicon.
The term semiconductor device includes, for example, diodes, transistors and integrated circuits.
Polycrystalline silicon is silicon in which crystallites can be demonstrated by X-ray analysis. The size of said crystallites is at least approximately 15 Å.
The presence of grain limits in polycrystalline silicon means that, electrically, this material is inhomogeneous, while amorphous and monocrystalline silicon -in the absence of grain limits-are homogeneous materials, electrically.
In semiconductor devices, polycrystalline silicon is used for many purposes, for example, as a diffusion source on a semiconductor body, as a conductive material, for example, for gate electrodes in MOS transistors, and as a resistive material.
In all these applications the polycrystalline silicon may comprise a dopant influencing the electric conductivity, which dopant as such determines the electric conductivity in the polycrystalline silicon and/or can be transferred to a semiconductor body.
A problem with polycrystalline silicon is that treatments at elevated temperatures, as are usual upon tempering and diffusion, for example, may give rise to reduced stability and poorer reproducibility of the semiconductor device.
For example, crystal growth easily occurs in polycrystalline silicon when the temperature rises. When the crystal size becomes of the order of magnitude of the thickness of a polycrystalline layer, a substrate on which the layer is present can be undesirably attacked upon etching.
One of the objects of the invention is to avoid the above problems at least to a considerable extent.
The invention is inter alia based on the recognition of the fact that the properties of polycrystalline silicon can be improved by the incorporation of certain substances.
Therefore, according to the invention, the semiconductor device mentioned in the opening paragraph is characterized in that the polycrystalline silicon is doped with carbon in a concentration which is higher than 1 part per million (ppm.).
In this concentration range of the carbon the properties of polycrystalline silicon are stable and reproducible and the grain size of the polycrystalline silicon remains substantially constant independently of treatments at temperatures which are usual in the manufacture of semiconductor devices.
It is to be noted that in growing monocrystalline silicon it is endeavoured to keep the carbon content as low as possible, preferably lower than 1 ppm (10-4 per cent by weight), because it is difficult to grow monocrystalline material at a higher carbon content.
It is known to add carbon to amorphous silicon so as to prevent crystallites developing in this material by treatments at elevated temperature. Comparatively large amounts of carbon are used, namely up to approximately 20 per cent by weight.
The conductivity of the polycrystalline silicon doped with carbon can further be adjusted particularly suitably if the polycrystalline silicon is further doped with a dopant determining the conductivity type.
It has been found that at low concentrations of, for example, phosphorus and with comparatively low carbon concentrations, both the electric resistance and the activation energy of the electric resistance of the polycrystalline silicon decrease when the carbon concentration increases. With these small concentrations the carbon atoms are probably present at the boundaries of the silicon crystallites and increase the mobility of the charge carriers over the grain limits. At higher phosphorus concentrations the influence of small carbon concentrations on the resistance is small.
When the carbon concentration in the polycrystalline silicon is further increased, both the resistance and the activation energy of the resistance increase at all phosphorus concentrations. This is associated with the presence of silicon carbide and/or carbon as the second phase beside the polycrystalline silicon. In forming polycrystalline silicon with such a carbon content and such properties the grains are generally smaller than at lower carbon content.
When the carbon concentration is still further increased, the resistance and the activation energy of the resistance decrease again. The comparatively low resistance is possibly associated with conductivity via carbon bridges. The silicon, in particular when low formation temperatures are used, has then become substantially amorphous.
The polycrystalline silicon in the semiconductor device according to the invention may form the gate electrode of MOS transistor or the polycrystalline silicon locally forms a resistor on the semiconductor body.
The polycrystalline silicon may form a resistance layer for the draining of charge on a p-n junction, for example, in a high-voltage transistor.
The invention furthermore relates to a method of manufacturing a semiconductor device according to the invention.
For that purpose, for example, carbon may be implanted in a provided polycrystalline silicon layer. In order to obtain a homogeneous distribution of carbon through the silicon, the voltage upon implantation must continually be varied in the course of the process so as to adjust the desired carbon concentration in any place in the silicon. As a matter of fact, a temperature treatment cannot improve the homogeneity of the carbon distribution, since carbon diffuses very slowly into silicon even at elevated temperatures.
In manufacturing a semiconductor device in accordance with the invention the doped polycrystalline silicon is preferably formed from a gaseous silicon compound and a gaseous unsaturated carbon compound at a temperature above 700� C.
Acetylene is very suitable for incorporation of carbon in the polycrystalline silicon.
In manufacturing the semiconductor device the polycrystalline silicon may be used as a diffusion source to obtain a doped region in the semiconductor body.
In the drawing FIG. 1 and FIG. 2 are diagrammatic sectional views on a part of the semiconductor device of the invention in various stages of its manufacture by the method of the invention.
The invention will now be described in greater detail with reference to a few examples and the accompanying drawing. FIGS. 1 and 2 of the drawing are diagrammatic sectional views of a part of a semiconductor device in successive stages of the manufacture by means of the method according to the invention.
For eample, in the manufacture of a MOS transistor (see FIG. 1) a semiconductor body 1 of silicon is provided at a stage of the manufacture in a usual manner with a 0.2 μm thick layer 2 of silicon dioxide on which a 0.5 μum thick layer 3 of polycrystalline silicon is provided.
According to the invention the layer 3 is doped with carbon in a concentration above 1 ppm and it is formed from a gaseous silicon compound and a gaseous unsaturated carbon compound at a temperature above 700� C.
As a carbon compound there is used, for example, acetylene (C2 H2). At a temperature of 850� C. and a concentration of 10-3 % by volume of acetylene is hydrogen as a carrier gas, a carbon content in layer 3 is obtained of 1000 ppm (5�1019 at/cm3) with a grain size of the silicon in layer 3 of 0.1 μm.
This grain size is substantially not varied in later process steps when source and drain regions 4 and 5 of the MOS transistor are obtained.
The polycrystalline silicon layer 3 may furthermore be doped with a dopant determining the conductivity type. The dopant may be present as gaseous PH3 during the formation of layer 3. Said dopant may also be introduced in the already formed polycrystalline silicon by diffusion by means of a POC13 source or by ion implantation.
After the partial removal (see FIG. 2) of the layers 2 and 3, the gate insulation 6 and the gate electrode 7 thereof remain and the source region 4 and the drain region 5 are provided and the usual additional treatments to obtain the MOS transistor are carried out.
When a thermal treatment is used upon doping the polycrystalline silicon with a dopant determining the conductivity type, in the absence of carbon in the polycrystalline layer, a considerable enlargement of the crystals in said layer may occur and the crystals may become equal to or larger than the thickness of the layer.
As is usual, such a thermal treatment of the polycrystalline layer is carried out in an oxygen atmosphere, in which a silicon oxide layer is formed on the polycrystalline layer.
The gate electrode 7 is also used as a mask during the introduction of a dopant in the silicon body 1 so as to obtain the source and drain regions 4 and 5.
An oxide layer formed during said treatments may be removed from the gate electrode by etching. When the gate electrode has become coarse crystalline, the gate insulation below the gate electrode can also be attacked easily and short-circuit with the silicon body occurs during subsequent metallization of the gate electrode.
This problem does not occur in the semiconductor device and the method according to the invention. Herewith a polycrystalline silicon layer is formed the crystal size of which can be chosen to be sufficiently small. Said grain size remains constant and does not increase in subsequent thermal treatments.
Carbon-doped polycrystalline silicon layers may also be used as a resistor. They have the advantage over resistors in a monocrystalline semiconductor body that the area required for that purpose may then be used for other circuit elements.
A polycrystalline resistor is then provided on an insulating layer and, for example via apertures in said layer, contacts an underlying monocrystalline semiconductor body and/or, via apertures in an insulating layer present on the resistor, contacts a wiring pattern present above the resistor.
By doping the polycrystalline silicon with 1019 atoms C/cm3 and a dopant determining the conductivity type, for example phosphorus, resistivities of the polycrystalline silicon between 1 and 105 Ω cm may be adjusted.
In the absence of carbon in the polycrystalline silicon it is difficult to obtain stable resistance values in the said region. This is associated with the fact that the resistance then depends considerably on the crystal size.
In the presence of carbon the resistance has become little dependent on subsequent treatments at high temperatures. Both the value of the resistance and the temperature coefficient then are constant and reproducible.
By suitable choice of the dimensions of the resistor the desired resistance can be chosen within wide limits.
Carbon-doped polycrystalline silicon layers may also be used as a passivating layer on a p-n junction. For that purpose, in high voltage diodes and transistors a layer of high-ohmic material which also forms a controlled leakage path is often desirable. A 0.2 μm thick layer having a crystal size of 0.1 μm which has a resistivity of 1010 Ω/□ and comprises a silicon dioxide layer forms a suitable passivation for p-n junctions operated at high reverse voltage.
Carbon-doped polycrystalline silicon layers may be used as a diffusion source in order to obtain a doped region in a semiconductor body.
For this purpose, polycrystalline silicon layers, as described above in connection with the manufacture of gate electrodes and resistors, are often provided as conductor tracks on and as a diffusion source in apertures of a masking layer. After the diffusion treatment the diffusion source is maintained as a contact in the apertures on the semiconductor body.
The crystal size of the diffusion source is chosen to be small and remains constant during the diffusion treatment so that upon removing the oxide layer from the polysilicon an oxide layer, if any, present below the polysilicon is not attacked.
The invention is not restricted to the examples described which are meant as an illustration of the invention.
Suitable temperatures for providing the polycrystalline layer are normally between 700� and 1000� C. and the pressures used are generally between 65 and 105 Pa.
A semiconductor body on which the polysilicon is provided may also consist, for example, of AIII BV material.
|Cited Patent
|Filing date
|Publication date
|Feb 20, 1967
|Feb 24, 1970
|Westinghouse Electric Corp
|Passive circuit elements
|Sep 10, 1971
|Aug 7, 1973
|Motorola Inc
|Poly-silicon electrodes for c-igfets
|Jan 10, 1975
|Jan 25, 1977
|Agence Nationale De Valorisation De La Recherche (Anvar)
|Method for improving the doping of a semiconductor material
|Dec 22, 1978
|Feb 26, 1980
|Eastman Kodak Company
|Silicon charge-handling device employing SiC electrodes
|Mar 21, 1980
|May 11, 1982
|Matsushita Electric Industrial Co., Ltd.
|Semiconductor device and method of manufacturing the same
|Jul 1, 1981
|Dec 7, 1982
|Siemens Aktiengesellschaft
|Method for preparing a protective amorphous silicon passivating film on a semiconductor device
|Dec 22, 1980
|Sep 6, 1983
|Shunpei Yamazaki
|MIS Type semiconductor photoelectric conversion device
|Feb 18, 1982
|Mar 27, 1984
|Atlantic Richfield Company
|Plasma assisted deposition system
|Sep 24, 1982
|Jun 18, 1985
|Tokyo Shibaura Denki Kabushiki Kaisha
|Method for manufacturing a semiconductor device
|Bloem et al., Appl. Phys. Lett. 40 (Apr. 1982), pp. 725 726.
|Bloem et al., Appl. Phys. Lett. 40 (Apr. 1982), pp. 725-726.
|Claassen et al., J. Electrochem. Soc.: Solid State Science and Technology, 130 (Jul. 1983), pp. 1586 1592.
|Claassen et al., J. Electrochem. Soc.: Solid-State Science and Technology, 130 (Jul. 1983), pp. 1586-1592.
|Citing Patent
|Filing date
|Publication date
|Jan 17, 1990
|Aug 6, 1991
|Industrial Technology Research Institute
|Method of fabricating a thin film polysilicon thin film transistor or resistor
|Apr 11, 1990
|May 18, 1993
|Secretary Of State For Defence In Her Britannic Majesty's Government Of The United Kingdom
|Substitutional carbon in silicon
|May 30, 1997
|Mar 23, 1999
|Advanced Micro Devices, Inc.
|Reduction of dopant diffusion by the co-implantation of impurities into the transistor gate conductor
|Aug 24, 1998
|Sep 28, 1999
|Advanced Micro Devices, Inc.
|Reduction of dopant diffusion by the co-implantation of impurities into the transistor gate conductor
|Apr 22, 1999
|Jul 10, 2001
|Smith & Nephew, Inc.
|Middle ear fluid aspirator
|Apr 11, 2001
|Jun 10, 2003
|Texas Instruments Incorporated
|Carbon doped epitaxial layer for high speed CB-CMOS
|May 17, 2002
|Aug 10, 2004
|International Business Machines Corporation
|Incorporation of an impurity into a thin film
|Oct 27, 2008
|Jun 15, 2010
|Taiwan Semiconductor Manufacturing Company, Ltd.
|Reducing poly-depletion through co-implanting carbon and nitrogen
|Dec 12, 2003
|Jul 29, 2004
|International Business Machines Corporation
|Incorporation of an impurity into a thin film
|Oct 27, 2008
|Apr 29, 2010
|Keh-Chiang Ku
|Reducing poly-depletion through co-implanting carbon and nitrogen
|U.S. Classification
|International Classification
|Cooperative Classification
|European Classification
|Aug 3, 1993
|Maintenance fee reminder mailed
|Jan 2, 1994
|Lapse for failure to pay maintenance fees
|Mar 15, 1994
|Expired due to failure to pay maintenance fee
Effective date: 19931226

subset: commoncrawl


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1 Review
Excellent recipe; a little different and very tasty. It wasn't overly spicy (could have used more perhaps), but the mixture of spices, herb and lime juice was a nice combination. I made a couple low-fat adjustments with lite tofu (extra firm) and a mix of part skim mozzarella and low-fat mexican cheese mix (as that was what I had in the fridge). I recommend using a non-stick frying pan. Also I think here in the U.S. coriander is more commonly referred to as cilantro. Fortunately I remembered this while I was unsuccessfully looking for fresh coriander! Thanks very much Sueie for this exceptional recipe!


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Free game kick-start with the PSP Go
PSP owners thinking of upgrading to the PSP Go can let out a little whoop of joy today with the promise of three free games as soon as their new handheld is out of the box. Sony has set up a special offer through the PlayStation Network to help ease the tricky transition from the UMD removable discs to pure digital downloads by letting you choose from 17 classic titles without so much as spending a bean.
Anyone with a PSP-1000, 2000 or 3000 and at least one UMD should log on to the Network with both consoles, register for the PSP Go Rewards and then have a big smile when they get an e-mail voucher for their freebies. The games include Wipeout Pure, Killzone: Liberation, Everybody's Golf and Buzz Brain Bender but no need to chose in a hurry. The offer lasts from 1st October 2009 and 31st March 2010.
Not a bad way to start your digital games collection and, with 16GB of onboard storage, there'll still be plenty of room for all your vids, pics and tunes, and any other shoot 'em ups, smack 'em downs and whatever else takes your fancy.
Xbox One Slim set for E3 2016, more powerful Xbox upgrade coming 2017
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Bring a buddy.4.53 / 5.00 8,068 Views
Yugi and Kaiba have a duel to the death!4.48 / 5.00 30,054 Views
Vampire Pixel in the Neon City
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National Sports
Rockets' No. 1 turns down D-League assignment
12/31/2012 @ 5:49 AMHOUSTON (AP) - Rockets first-round pick Royce White has refused his assignment to Houston's D-League affiliate, yet another setback to his return to the court.
White was the 16th overall pick in the June draft. He has spent most of the season on Houston's inactive list while he and the team figure out how to handle his anxiety disorder and overall mental health.
See other NationalSports news:New Orleans Pelicans Player Bryce Dejean-Jones Shot Dead in Dallas
Cleveland Cavaliers Advance to NBA Finals
Raptors' Bismack Biyombo Faces Suspension After Fourth Flagrant Foul
Ole Miss Responds to NCAA Allegations with Self-Imposed Penalties
NFL Hopeful Stands Outside Patriots' Stadium for Chance to Try Out


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Several human rights groups, including Covenants Watch, Taiwan Alliance to End the Death Penalty and the Taiwan Association for Human Rights, jointly issued a statement condemning the executions, while saying that they would pursue legal action against the ministry officials and civil servants involved in the decisionmaking process.
Sat, Apr 20, 2013 - Page 1 News List
Six death-row inmates executed
COVENANTS BROKEN:Human rights activists vowed to file lawsuits against ministry officials over the decision to execute the convicts before their appeals had been heard
By Rich Chang and Loa Iok-sin / Staff reporters
This story has been viewed 5730 times.
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Number of Spaces : 40
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Long Description
PINE HAVEN RETREAT is a RV Park in or near the town of St John. It is a somewhat small park with a reported 40 rv sites to park your coach. This park has pull thru pads if you are uncomfortable with backing your rig. If you are driving a large RV, then you are in luck since there are some extra long pads. You will be able to connect your RV to electric. You will be thrilled to know that 50 amp service is provided. For the true RV experience – water hookups are provided – much better than camping in a tent! Some really good news is that a sewer connection is provided. If you are lucky, you might be able to use your cellular for internet, but otherwise there is no Wireless Internet. We have no idea of the over the air TV, but we do know that no Cable TV is provided. Animals are welcome here. If you like to REALLY get outside, you would be thrilled to know that you can camp in a tent here. If you ever get near St John make sure you stop on by the PINE HAVEN RETREAT.
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More than 850,000 people in Somalia are in desperate need of food and ''in crisis and emergency conditions,'' the director of UN humanitarian operations said Tuesday.
John Ging, who just returned from a three-day visit to Somalia, said another 2 million Somalis are considered to be ''food insecure.''
''These figures are very, very large,'' he told a news conference. ''They tell us a simple message which is that the situation in Somalia for Somalis on the humanitarian side is very grave. It's also very fragile.''
Ging said the UN World Food Program's Food Security and Nutrition Analysis Unit reported this month that 857,000 Somalis are in acute crisis conditions and require urgent humanitarian assistance. This is ''a modest improvement'' from the previous six months when 870,000 Somalis desperately needed food, he said.
Somalia has long been a rudderless nation plagued by cyclical drought and famine and decades of armed conflict. Its population is estimated to be about 10 million.
In recent years it has made some strides in security and governance, particularly since August 2011, when al-Shabab militants were forced out of the capital, Mogadishu. But the al-Qaida linked rebels have not been defeated and the government controls only small parts of the country and is struggling to provide security and battle corruption.
The food security unit said about 75 percent of the 857,000 Somalis who urgently need food are displaced from their homes, largely as a result of fighting, insecurity and lack of food. Ging said others are in rural areas that are very hard to access.
''In 2011, we had a global tragedy where 260,000 people died of famine in Somalia,'' Ging said. ''We are working very hard to help the people recover in circumstances which are extremely difficult — the climate is very harsh and the security situation equally so.''
The United Nations appealed for $933 million for the humanitarian crisis in Somalia this year, but Ging said so far it has received only $36 million which is ''very ominous.''
In 2011, the UN appeal for Somalia was 86 percent funded, but in 2013 it was just 50 percent funded, he said.
''Somalis have suffered endlessly for almost 25 years. We cannot be distracted now from our task to stay with them, to help to consolidate these fragile gains ... and this requires funding,'' Ging said. ''We need to keep our attention on Somalia. It's incredibly fragile and we don't want a repeat of what happened in 2011."
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text:
|By Business Wire
Article Rating:
|November 27, 2012 10:30 AM EST
Red Hat, Inc. (NYSE: RHT), the world's leading provider of open source solutions, today announced the next step in the delivery of its Platform-as-a-Service (PaaS) strategy with the general availability of OpenShift Enterprise, an enterprise-ready PaaS product from Red Hat that is designed to be installed on-premise within customer datacenters or private, public or hybrid clouds. The product enables customers to streamline and standardize developer workflows, facilitating increased IT service delivery velocity that can better support business demands. This news fulfills Red Hat's plans for an on-premise PaaS offering, first announced in May 2012, and establishes the industry's first comprehensive, open on-premise PaaS for enterprises.
OpenShift Enterprise provides enterprise users with access to a cloud-based application platform, enhancing an enterprise's ability to build the applications it needs and have them run in a cloud architecture. It automates much of the provisioning and systems management of the application platform stack in a way that enables the IT operations team to more easily meet growing business demands for new application services. OpenShift Enterprise also provides an on-demand, elastic, scalable and fully configured application development, testing and hosting environment for application developers so that they can focus on coding these new application services. With its unique Security-Enhanced Linux (SELinux) approach, OpenShift Enterprise also offers reliable security and multi-tenancy with the ability to subdivide the Node instances.
OpenShift Enterprise is built on a trusted stack of open source-based Red Hat technologies, including Red Hat Enterprise Linux, JBoss Enterprise Application Platform and OpenShift Origin, the basis for Red Hat's existing online OpenShift PaaS service that has been available in a free beta since May 2011. With the inclusion of JBoss Enterprise Application Platform 6, OpenShift Enterprise becomes the only Java EE 6-certified on-premise PaaS available to enterprises today. OpenShift Enterprise also benefits from the consistent innovation and contributions driven by the open source Origin project community focused on OpenShift. As a polyglot, or multi-language, PaaS, OpenShift Enterprise supports Java, Ruby, Python, PHP and Perl and it includes a cartridge-based architecture to enable customers to include their own middleware services.
OpenShift Enterprise is available today with support from Red Hat. The product is initially offered in North America, the United Kingdom and Continental Europe, with plans for global availability in the future. The OpenShift PaaS online service remains available in developer preview via https://openshift.redhat.com.
Supporting Quotes
Ashesh Badani, general manager, Cloud Business Unit and OpenShift, Red Hat
"We're excited to offer our enterprise customers the only comprehensive, open on-premise PaaS offering ready for enterprise deployment today with OpenShift Enterprise. This product offers our customers further freedom and choice in the cloud with the backing of Red Hat's full stack and open source leadership. Developers are now able to choose among leading application development languages and tools for the job, and IT operations leaders can choose to deliver these application stacks to their enterprise on their choice of clouds in compliance with their security, governance and compliance requirements. This offering stands to revolutionize how enterprises use PaaS platforms."
Stephen D. Hendrick, group vice president of application development and deployment research, IDC
"The worldwide public PaaS market grew over 40% in 20111 as organizations continued to leverage the benefits of platform services to develop, deploy and manage applications of all types. Advanced PaaS products support multiple development patterns, high availability, high performance, automated provisioning, dynamic scalability and shared services delivered as public, private or hybrid clouds. OpenShift Enterprise brings Red Hat's advanced PaaS capabilities into the private datacenter where they are most needed and enables hybrid cloud computing with enhanced security, flexibility and consistency."
For more information on OpenShift Enterprise, join Red Hat executives for a virtual press conference announcement at 11:00 a.m. ET on Nov. 27. The webcast will also be available for replay. To register for the live broadcast or to access the replay, visit https://vts.inxpo.com/Launch/QReg.htm?ShowKey=11748.
For more information
- Learn more about OpenShift Enterprise
- Register to learn more about OpenShift Enterprise during Red Hat's Optimizing IT virtual event and in-depth virtual sessions, kicking off at 11:00 a.m. ET on Dec. 5, 2012
- Learn more about Red Hat Cloud
Connect with Red Hat
- Get more Red Hat news or subscribe to the Red Hat news RSS feed
- Follow Red Hat on Twitter
- Join Red Hat on Facebook
- Watch Red Hat videos on YouTube
About Red Hat, Inc.
Red Hat is the world's leading provider of open source software solutions, using a community-powered approach to reliable and high-performing cloud, Linux, middleware, storage and virtualization technologies. Red Hat also offers award-winning support, training, and consulting services. As the connective hub in a global network of enterprises, partners, and open source communities, Red Hat helps create relevant, innovative technologies that liberate resources for growth and prepare customers for the future of IT. Learn more at http://www.redhat.com.
Forward-Looking Statements
Certain statements contained in this press release may constitute "forward-looking statements" within the meaning of the Private Securities Litigation Reform Act of 1995. Forward-looking statements provide current expectations of future events based on certain assumptions and include any statement that does not directly relate to any historical or current fact. Actual results may differ materially from those indicated by such forward-looking statements as a result of various important factors, including: risks related to delays or reductions in information technology spending; the effects of industry consolidation; the ability of the Company to compete effectively; uncertainty and adverse results in litigation and related settlements; the integration of acquisitions and the ability to market successfully acquired technologies and products; the inability to adequately protect Company intellectual property and the potential for infringement or breach of license claims of or relating to third party intellectual property; the ability to deliver and stimulate demand for new products and technological innovations on a timely basis; risks related to data and information security vulnerabilities; ineffective management of, and control over, the Company's growth and international operations; fluctuations in exchange rates; and changes in and a dependence on key personnel, as well as other factors contained in our most recent Quarterly Report on Form 10-Q (copies of which may be accessed through the Securities and Exchange Commission's website at http://www.sec.gov), including those found therein under the captions "Risk Factors" and "Management's Discussion and Analysis of Financial Condition and Results of Operations". In addition to these factors, actual future performance, outcomes, and results may differ materially because of more general factors including (without limitation) general industry and market conditions and growth rates, economic and political conditions, governmental and public policy changes and the impact of natural disasters such as earthquakes and floods. The forward-looking statements included in this press release represent the Company's views as of the date of this press release and these views could change. However, while the Company may elect to update these forward-looking statements at some point in the future, the Company specifically disclaims any obligation to do so. These forward-looking statements should not be relied upon as representing the Company's views as of any date subsequent to the date of this press release.
Red Hat, Inc. Red Hat, the Shadowman logo and JBoss are registered trademarks of Red Hat, Inc. in the U.S. and other countries. Linux is a registered trademark of Linus Torvalds.
1 Source: Worldwide Public Platform-as-a-Service 2011 Vendor Shares, IDC #236959, September, 2012
In his keynote at 18th Cloud Expo, Andrew Keys, Co-Founder of ConsenSys Enterprise, will provide an overview of the evolution of the Internet and the Database and the future of their combination – the Blockchain. Andrew Keys is Co-Founder of ConsenSys Enterprise. He comes to ConsenSys Enterprise with capital markets, technology and entrepreneurial experience. Previously, he worked for UBS investment bank in equities analysis. Later, he was responsible for the creation and distribution of life ...
May. 26, 2016 10:00 PM EDT Reads: 1,877
With major technology companies and startups seriously embracing IoT strategies, now is the perfect time to attend @ThingsExpo 2016 in New York and Silicon Valley. Learn what is going on, contribute to the discussions, and ensure that your enterprise is as "IoT-Ready" as it can be! Internet of @ThingsExpo, taking place Nov 3-5, 2015, at the Santa Clara Convention Center in Santa Clara, CA, is co-located with 17th Cloud Expo and will feature technical sessions from a rock star conference faculty ...
May. 26, 2016 10:00 PM EDT Reads: 2,532
SYS-CON Events announced today that Commvault, a global leader in enterprise data protection and information management, has been named "Bronze Sponsor" of SYS-CON's 18th International Cloud Expo, which will take place on June 7–9, 2016, at the Javits Center in New York City, NY, and the 19th International Cloud Expo, which will take place on November 1–3, 2016, at the Santa Clara Convention Center in Santa Clara, CA. Commvault is a leading provider of data protection and information management...
May. 26, 2016 09:30 PM EDT Reads: 2,995
Companies can harness IoT and predictive analytics to sustain business continuity; predict and manage site performance during emergencies; minimize expensive reactive maintenance; and forecast equipment and maintenance budgets and expenditures. Providing cost-effective, uninterrupted service is challenging, particularly for organizations with geographically dispersed operations.
May. 26, 2016 09:15 PM EDT Reads: 1,848
SYS-CON Events announced today that Tintri Inc., a leading producer of VM-aware storage (VAS) for virtualization and cloud environments, will exhibit at the 18th International CloudExpo®, which will take place on June 7-9, 2016, at the Javits Center in New York City, New York, and the 19th International Cloud Expo, which will take place on November 1–3, 2016, at the Santa Clara Convention Center in Santa Clara, CA.
May. 26, 2016 09:15 PM EDT Reads: 2,236
In his session at 18th Cloud Expo, Bruce Swann, Senior Product Marketing Manager at Adobe, will discuss how the Adobe Marketing Cloud can help marketers embrace opportunities for personalized, relevant and real-time customer engagement across offline (direct mail, point of sale, call center) and digital (email, website, SMS, mobile apps, social networks, connected objects). Bruce Swann has more than 15 years of experience working with digital marketing disciplines like web analytics, social med...
May. 26, 2016 09:00 PM EDT Reads: 1,256
Designing IoT applications is complex, but deploying them in a scalable fashion is even more complex. A scalable, API first IaaS cloud is a good start, but in order to understand the various components specific to deploying IoT applications, one needs to understand the architecture of these applications and figure out how to scale these components independently. In his session at @ThingsExpo, Nara Rajagopalan is CEO of Accelerite, will discuss the fundamental architecture of IoT applications, ...
May. 26, 2016 08:45 PM EDT Reads: 1,119
18th Cloud Expo, taking place June 7-9, 2016, at the Javits Center in New York City, NY, will feature technical sessions from a rock star conference faculty and the leading industry players in the world. Cloud computing is now being embraced by a majority of enterprises of all sizes. Yesterday's debate about public vs. private has transformed into the reality of hybrid cloud: a recent survey shows that 74% of enterprises have a hybrid cloud strategy. Meanwhile, 94% of enterprises are using some...
May. 26, 2016 08:45 PM EDT Reads: 3,076
SYS-CON Events announced today that BMC Software has been named "Siver Sponsor" of SYS-CON's 18th Cloud Expo, which will take place on June 7-9, 2015 at the Javits Center in New York, New York. BMC is a global leader in innovative software solutions that help businesses transform into digital enterprises for the ultimate competitive advantage. BMC Digital Enterprise Management is a set of innovative IT solutions designed to make digital business fast, seamless, and optimized from mainframe to mo...
May. 26, 2016 08:00 PM EDT Reads: 2,061
As cloud and storage projections continue to rise, the number of organizations moving to the cloud is escalating and it is clear cloud storage is here to stay. However, is it secure? Data is the lifeblood for government entities, countries, cloud service providers and enterprises alike and losing or exposing that data can have disastrous results. There are new concepts for data storage on the horizon that will deliver secure solutions for storing and moving sensitive data around the world. ...
May. 26, 2016 08:00 PM EDT Reads: 1,226
Join us at Cloud Expo | @ThingsExpo 2016 – June 7-9 at the Javits Center in New York City and November 1-3 at the Santa Clara Convention Center in Santa Clara, CA – and deliver your unique message in a way that is striking and unforgettable by taking advantage of SYS-CON's unmatched high-impact, result-driven event / media packages.
May. 26, 2016 08:00 PM EDT Reads: 2,295
SYS-CON Events announced today that EastBanc Technologies will exhibit at SYS-CON's 18th International Cloud Expo®, which will take place on June 7-9, 2016, at the Javits Center in New York City, NY. EastBanc Technologies has been working at the frontier of technology since 1999. Today, the firm provides full-lifecycle software development delivering flexible technology solutions that seamlessly integrate with existing systems – whether on premise or cloud. EastBanc Technologies partners with p...
May. 26, 2016 08:00 PM EDT Reads: 2,110
SoftLayer operates a global cloud infrastructure platform built for Internet scale. With a global footprint of data centers and network points of presence, SoftLayer provides infrastructure as a service to leading-edge customers ranging from Web startups to global enterprises. SoftLayer's modular architecture, full-featured API, and sophisticated automation provide unparalleled performance and control. Its flexible unified platform seamlessly spans physical and virtual devices linked via a world...
May. 26, 2016 07:30 PM EDT Reads: 2,022
SYS-CON Events announced today that ContentMX, the marketing technology and services company with a singular mission to increase engagement and drive more conversations for enterprise, channel and SMB technology marketers, has been named "Sponsor & Exhibitor Lounge Sponsor" of SYS-CON's 18th Cloud Expo, which will take place on June 7-9, 2016, at the Javits Center in New York City, New York. "CloudExpo is a great opportunity to start a conversation with new prospects, but what happens after the...
May. 26, 2016 07:15 PM EDT Reads: 995
The essence of data analysis involves setting up data pipelines that consist of several operations that are chained together – starting from data collection, data quality checks, data integration, data analysis and data visualization (including the setting up of interaction paths in that visualization). In our opinion, the challenges stem from the technology diversity at each stage of the data pipeline as well as the lack of process around the analysis.
May. 26, 2016 07:00 PM EDT Reads: 1,341
The 19th International Cloud Expo has announced that its Call for Papers is open. Cloud Expo, to be held November 1-3, 2016, at the Santa Clara Convention Center in Santa Clara, CA, brings together Cloud Computing, Big Data, Internet of Things, DevOps, Containers, Microservices and WebRTC to one location. With cloud computing driving a higher percentage of enterprise IT budgets every year, it becomes increasingly important to plant your flag in this fast-expanding business opportunity. Submit y...
May. 26, 2016 07:00 PM EDT Reads: 1,928
Internet of @ThingsExpo, taking place November 1-3, 2016, at the Santa Clara Convention Center in Santa Clara, CA, is co-located with the 19th International Cloud Expo and will feature technical sessions from a rock star conference faculty and the leading industry players in the world and ThingsExpo New York Call for Papers is now open.
May. 26, 2016 06:00 PM EDT Reads: 1,757
The IoTs will challenge the status quo of how IT and development organizations operate. Or will it? Certainly the fog layer of IoT requires special insights about data ontology, security and transactional integrity. But the developmental challenges are the same: People, Process and Platform. In his session at @ThingsExpo, Craig Sproule, CEO of Metavine, will demonstrate how to move beyond today's coding paradigm and share the must-have mindsets for removing complexity from the development proc...
May. 26, 2016 04:30 PM EDT Reads: 1,865
The IoT is changing the way enterprises conduct business. In his session at @ThingsExpo, Eric Hoffman, Vice President at EastBanc Technologies, discuss how businesses can gain an edge over competitors by empowering consumers to take control through IoT. We'll cite examples such as a Washington, D.C.-based sports club that leveraged IoT and the cloud to develop a comprehensive booking system. He'll also highlight how IoT can revitalize and restore outdated business models, making them profitable...
May. 26, 2016 04:15 PM EDT Reads: 2,751
SYS-CON Events announced today that Enzu, a leading provider of cloud hosting solutions, will exhibit at SYS-CON's 18th International Cloud Expo®, which will take place on June 7-9, 2016, at the Javits Center in New York City, NY. Enzu's mission is to be the leading provider of enterprise cloud solutions worldwide. Enzu enables online businesses to use its IT infrastructure to their competitive advantage. By offering a suite of proven hosting and management services, Enzu wants companies to foc...
May. 26, 2016 04:15 PM EDT Reads: 2,181


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Paul Armstrong
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Find me at: http://wiseacrephoto.com
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Jolly Santa Welcome - Cross Stitch Pattern
MarNic Designs
$6.00 $5.39 + $3.29 shipping within the U.S.
In Stock. Usually ships in 1-2 business days.
Item: 12-3096 - Type: Cross Stitch Patterns.
Model stitched on 32 Ct. Antique White Jobelan with Caron Waterlilies, DMC floss, Kreinik #4 Braid, Rainbow Gallery Fancy Fur (FN62), Mill Hill Beads, Gentle Art Sampler threads and Threadworx. Stitch Count: 110W x 91H.
123Stitch.com ships via the U.S. Postal Service to anywhere in the world. Orders to the U.S. typically arrive 3-5 days after we ship.
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- akingham26
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- No Industry Selected - No Status Selected
Hi Guys,
Been lurking around WSO for some weeks now but this is my first post; sorry it's a tad long. I've recently moved from Australia to London in an attempt to gain some international experience and take advantage of the opportunities the city can offer in comparison to my home town!
I graduated from a top Australian University in 2011 (which I now know doesn't mean jack-shit over here) with a Commerce and International Studies double degree and a 2:1 equivalent, I also passed level 1 of the CFA in June. I started working at a PWM/Stockbroking firm part time in my last semester of Uni which then moved to FT once I finished. I was in a middle office function with some exposure to research; this is what kept me looking for other roles as the research exposure was expected to increase. Needless to say a restructuring of the research team and movement away from my town left me high and dry! That's when I decide to take a chance and make the move.
I knew it wouldn't be smooth sailing however 3 months in and I'm stil jobless and starting to get slightly concerned! Ideally I'm keen to get into ER however given my lack of experience and the current environment my plan was to try to secure a buy side ops role and hopefully in time try to sneak into a research role. Realistically I need to lock something down ASAP so I'm prepared to take anything; as such I've been applying for everything I can.
I've signed up and had numerous interviews with recruiters who have got me 2 interviews and a phone interview. I crashed and burnt in the phone interview but I thought the other 2 went well, which obviously wasn't the case as I didn't get either position. I've been doing the usual cold emailing and going to CFA events, I even handed out CV's to well-dressed middle aged men in the city in an attempt to build up my non-existent network and create a 'lucky' break!
So far none of these tactics have been particularly successful so I was just wondering if anybody on here has been in a similar situation and can offer any advice? Or if there are any Londoners on here who have some advice on how I might go about getting my foot in the door in the city?
Comments (8)
- EURCHF parity
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- Other - 2nd Year Analyst
Could you post here, in three paragraphs of about 10 lines each (one per idea), 3 FTSE 100/250 ideas that you have written up over the past 3 months?
The WSO Advantage - Land Your Dream Job
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- Ovechkin08
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- Other - 2nd Year Analyst
Put your CV on efinancialcareers.co.uk.
UK market is tough right now and ER is even tougher. Are you working in a non-finance related job while you search?
- G.M.Trevelyan
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- akingham26
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EURCHF parity:
Could you post here, in three paragraphs of about 10 lines each (one per idea), 3 FTSE 100/250 ideas that you have written up over the past 3 months?
Here are three stocks I have been interested in since moving over (one of them admittedly is not overly original). I'd be interested to know what you think, I did just do them for my own practice and are very basic, so they could be rather rubbish.
Halma (HLMA)
Halma is an electronic and electrical equipment producer, which has subsidiaries that are separated into three distinct divisions, which include health and analysis, infrastructure sensors and industrial safety. The company's position in developing markets is of particular interest and ensures it's less affected by the economic drama's occurring across the UK, US and Europe. Revenue from outside these regions has doubled since 2008 and now represents 25% of total revenue, with a target of 30% set for 2015. The company has a number of expansion projects in Brazil and China and with the health and safety regulations of the construction and mining industry steadily improving in these countries it provides a foundation for future growth. Halma's ROE has been steadily increasing to 21% and with a ROCE of 76.26% which has been also been steadily increasing for the past 4 years, suggests the company is highly efficient. Overall the company's long term prospects look promising and although this has been reflected in the price rise over the past 12 months if they continue to seek growth in developing countries then the long term outlook for the share price should be positive.
UK Mail (I jotted these notes down in late Sept, not FTSE 250 but quite interesting) (UKM)
UK Mail fits the classic value investor's criteria of being a market leading company that has a long history of profits and consistent dividend payments to shareholders. UK Mail is the leading alternative to Royal Mail for any business mail requirements; this also fits the value investor's criteria in that it the business is easy to understand. UK Mail had a dividend yield of 7.4% in March and despite the recent increase in price is still yielding above 5%, although it has traded on low volumes. This along with the company's low levels of debt and stable earnings means the stock is ideal for investors who may be looking for some additional yield to compensate for the low interest rate environment; this in turn should drive the price higher. Even if the price doesn't continue to increase the attractive yield and secure financial position of the company suggest UKM is a solid investment.
Unilever (ULVR)
Unilever being one of the world's largest companies is a mature and stable stock which although unlikely to break out and provide outrageous returns should continue to offer dividend growth and a relatively stable capital return. Although possibly a 'boring' stock; in this environment it is a stable investment which is held by many pension funds and money managers which will should assist in preventing any steep falls in price. This along with Unilever's huge investment and growth in developing countries ensures the company is on target to continue sales growth of 11-13% which is has achieved over the past 3 years. ULVR has had a 5 year average dividend growth rate of 7.4% and EPS growth of 15.7% and is in a secure financial position to weather any potential storms they may face.
- akingham26
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I've been trying efinancialcareers but haven't had any bites. I'm going to start looking for non-finance related part time work this week as I need to start getting some cash in the bank whilst I continue searching.
Haha brave is one way to put it, yeah I've pretty much been focussing on Ops roles whilst holding out a glimmer of hope for a junior analyst role or research assistant position.
- G.M.Trevelyan
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I like how there's no hold, buy, or sell overall rec in yours
- akingham26
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HLMA even though it as had a nice run I would have a 'buy' recommendation due to its long term prospects. ULVR would be a 'hold' as I think it is becoming a tad expensive to buy into. UKM was a 'buy' in Sept when I wrote it but due to it's recent rally is now expensive and I would take the profits and therefore put a 'sell' rec on it.
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text:
|Publication number
|Publication type
|Application number
|PCT number
|Publication date
|Jun 29, 1999
|Filing date
|Aug 1, 1995
|Priority date
|Aug 12, 1994
|Fee status
|Also published as
|Publication number
|Gabriele Muzzarelli
|Original Assignee
|Farmer Engineering Gesellschaft M.B.H.
|Export Citation
|BiBTeX, EndNote, RefMan
|Patent Citations (12), Referenced by (5), Classifications (15), Legal Events (5)
|External Links: USPTO, USPTO Assignment, Espacenet
This invention relates to a complete self-contained multipurpose dairy processor unit for milk derivatives production for bovine, buffalo, sheep and goat holdings and for public-access farms.
Various types of plants for milk conversion in small quantity are known, constructed according to the classical scheme of the dairy farm and based on a coagulation vessel, the walls of which have an interspace through which hot or cold water is circulated to achieve heat transfer with the milk or whey contained in it. These vessels are sometimes provided with mechanical means for stirring and cutting the curd.
The use of this interspaced coagulation vessel usually requires two specific hot or cold water feed systems which very often require a considerable time for accumulating the energy required for the process. They are always in the form of plants composed of piping, valving, connection fittings, hydraulic pumps and reservoirs requiring particular plant design and installation, with considerable cost and processing time, as the milk to be processed, contained in the coagulation vessel, keeps the entire plant engaged until the end of the entire coagulation process. These plants are hence designed for specific milk quantities and are able to process only such specific milk quantities at a time.
U.S. Pat. No. 2,078,000 discloses an apparatus for thermal treatment of liquids, particularly milk, comprising a heat exchanger device in the form of a coil which can be immersed in the liquid to be trated. The coil is selectively feedable with hot water, steam, or cold water, depending on whether heat is to be transferred to the liquid or removed from it. The coil has a vertical axis around which it can rotate in order to improve the heat transmission. However, this apparatus is unsuitable for producing cheeses. In fact such a coil is unable for generating an effective flow in the liquid. Therefore, if the liquid to be trated is a curd (in which lumps of casein are dispersed in a liquid phase) from which a cheese has to be obtained, the lumps of casein adhere to the coil and degrades ("burn") thus compromising the wanted result. Furthermore, within a short time the quantity of casein on the coil also hinders the mechanical function of the coil which in practice is no longer able to generate any flow.
An object of the present invention is to provide the user with a complete self-contained multipurpose dairy processor unit for the production of milk derivatives, which allows the sequential processing of several milk quantities in several simple containers not forming part of the processor unit, with considerable utilization versatility and in any environment, while satisfying health regulations.
Further objects of the invention are:
from the technical viewpoint, to advantageously replace the many plants and machines of the traditional cheese dairy, so achieving independence from the milk quantities to be processed;
from the technological viewpoint, to enable all the processes of any cheese dairy to be effected, to obtain all types of cheese both from unpasteurized and from pasteurized milk, buttermilk curd, butter, yoghurt, etc.;
from the time viewpoint, to have available a processor unit which is of immediate use, which enables the coagulation time to be drastically reduced, and allows processing to be effected in sequence on several milk containers, which may be of different capacities.
A further object of the invention is to provide a dairy processor unit which is easy to clean, so offering maximum guarantee of hygiene and avoiding contamination of the liquid (milk or whey) to be treated, and is simple and economical to operate, without the use of specialized labour or complicated technologies.
The invention hence consists of having concentrated in a single processor unit all the heat transfer, physical-chemical, microbiological and mechanical functions currently performed in the various sectors and plants of a traditional cheese dairy, while satisfying health regulations and without modifying the technology of traditional cheeses.
These and further objects which will be apparent hereinafter are attained by a dairy processor unit comprising:
a hot-water or steam generator device (14);
a heat exchanger device (18) immersible in the liquid to be treated and selectively feedable with hot water or steam produced by the hot-water or steam generator device (14), or with cold water, depending on whether heat is to be transferred to the liquid to be treated or removed from it;
means to generate, within the liquid to be treated, a forced flow which grazes the heat exchanger (18);
characterized in that
the hot-water or steam generator device (14) is of the instantaneous type; and
the means to generate within the liquid a forced flow is a variable-speed turbine which draws the liquid form the below and expels it through the exchanger (18).
According to one embodiment of the present invention, mechanical means for stirring and cutting the curd can be connected to the flow generating means.
In this manner a complete self-contained multipurpose dairy processor unit is obtained. It should be noted that the term "cold water" means water the temperature of which is not substantially higher than ambient. Water having a temperature satisfying this requirement is for example mains water, well water or spring water.
The hot water or steam generator is conveniently of the type using liquid or gaseous fuel, and provided with operating and control means powered by the electric mains or by an electrical generator unit.
The lifting means can be operated either manually (in which case it is conveniently of the counterweighted type to limit operator fatigue), or by a pneumatic or hydraulic actuator, or by a geared motor unit powered by the electric mains or by the said electrical generator unit. The turbine for generating flow within the liquid to be treated can also be operated by a geared motor powered in the same manner.
The various components of the processor unit according to the present invention can be mounted on one and the same support structure or base.
To allow the processor unit to be easily moved, the said structure can be provided with wheels to allow it to be moved by pushing.
If the amount of movement required of the processor unit is considerable, it can be motorized for this purpose and provided with a driver's position, to finally assume the form of an actual motor vehicle with an internal combustion engine.
According to a modified embodiment of the present invention, the heat exchanger device can consist of several heat exchangers, each provided with a turbine. Such a modified embodiment can be useful if the mass of liquid to be treated is considerable.
According to a further modified embodiment of the present invention, the lifting means can also consist of a monorail, possibly directionable, with a hoist from which the heat exchanger and relative turbine are suspended.
The processor unit can also be provided with a conventional control device, for example of microprocessor type, to totally or partially automate its operation.
Further characteristics and advantages of the invention will be more apparent from the description of one embodiment thereof given hereinafter with reference to the accompanying drawings, on which FIG. 1 shows a very schematic side elevational view of the complete self-contained dairy processor unit according to the present invention.
FIG. 2 shows a schematic side elevational view of the complete self-contained dairy processor unit according to the invention including a variable speed turbine (and wherein the same elements of FIG. 1 are primed); FIG. 3 shows a view of the arm of the dairy processor unit in accordance with the invention including a stirrer device (wherein the same element of FIG. 1 is double primed); and FIG. 4 shows a view of the arm of the dairy processor unit in accordance with the invention including curd cutting means (wherein the same element of FIG. 1 is triple primed).
As can be seen from the figure, the processor unit 10 comprises a base 12 carrying an instantaneous steam generator 14. The base also carries a lifting means 16, from the rotatable arm 24 of which there is suspended a heat exchanger 18, within the tube bundle of which there is coaxially positioned a variable speed turbine 35 (FIG. 2 and which includes vanes 35a as is known in the art) which generates a flow within the liquid by drawing liquid from below to then expel it laterally and radially through the vertically extending tube bundle. A heat exchanger of this type is for example described in Italian patent application No. MO93A 000005 in the name of the present applicant and entitled a "Radial Dynamic Heat Exchanger of Immersion Type".
Said turbine is supported by the heat exchanger 18 and is operated by a geared motor 22 positioned above the heat exchanger 18.
As can be seen from the figure, the lifting means 16 basically consists of an upright 17, to the upper end of which there is hinged an arm 24 operated by a cylinder-piston mechanism 19 via a suitable control unit 30 (FIG. 2 and which includes vanes 35a as is known in the art) carried by the base 12. It should however be noted that the lifting means can also be operated in a different manner, for example hydraulically or by a geared motor, or even manually if provided with a counterweight to limit operator fatigue. As already stated it can also be in the form of a monorail, possibly directionable, with a relative lifting hoist.
As shown in the figure, the arm 24, and consequently the heat exchanger 18, can assume two significant positions, namely a working or lowered position in which the heat exchanger 18 is immersed in the liquid to be treated contained in the vessel 20 (this position shown in the figure by full lines), and a raised position in which the heat exchanger 18 is out of the vessel (shown by dashed lines in the figure).
As can be seen from the figure, the shaft of the turbine (not visible) projects beyond the lower edge of the heat exchanger 18 and carries fixed thereto a connection element 28 enabling the shaft to be connected to a stirrer means 38 (FIG. 3) or a curd cutting means 40 (FIG. 4).
For simplicity, the figure does not show the hydraulic connections or the electrical installation, or the valve enabling hot water or steam to pass into the heat exchanger rather than cold water.
These are however obvious to an expert of the art.
As can be seen from the figure, the base 12 is provided with adjustable feet 26. As stated, these can be replaced or supplemented at their sides with wheels 34 (FIG. 2) to facilitate the movement of the processor unit 10.
It should be noted that the vessel 20 normally does not form part of the processor unit 10, as it can be any vessel provided it is suitable for the purpose and satisfies the health regulations applicable to the particular case. In particular, it does not need to be a traditional copper vessel of interspaced type, with all the advantages which this brings.
The operation of the processor unit 10 will now be briefly described, although this should be apparent from the aforegoing. It will be assumed that the heat exchanger 18 is already immersed in the liquid (milk or whey) contained in the vessel 20 and that the turbine enclosed within it is in operation. As soon as the instantaneous hot water or steam generator 14 feeds hot water or steam into the heat exchanger 18 via the relative hydraulic circuit, the heat exchanger 18 begins to transfer heat to the liquid in which it is immersed. This means that at the outlet of the heat exchanger 18 there is condensate which is returned to the instantaneous hot water or steam generator 14 to be retransformed into hot water or steam, to hence repeat the cycle.
If instead the heat exchanger 18 is not immersed in the liquid and the steam generator 14 is operated, the heat exchanger temperature tends to rise to a value close to the temperature of the steam passing through it, with the significant result of sterilizing and disinfecting it.
As already stated, the heat exchanger 18 can also operate in the reverse direction. In this respect it can be used to cool the liquid in which it is immersed merely by closing the steam feed and feeding it with cold water, for example mains water (which normally has a temperature not exceeding 15� C.) or spring, well or similar water. Consequently the heat exchanger 18 then removes heat from the liquid in which it is immersed, to cool it to the required temperature (which for the applications of interest is substantially higher than mains water temperature). The heat exchanger and the turbine enclosed within it, ie those parts of the processor unit 10 which come into contact with the liquid to be treated, are conveniently of stainless steel, this material being preferred from the hygiene viewpoint. This eliminates one of the problems of the traditional dairy industry, in which the vessel itself, necessarily of copper, has to be heated to transfer sufficient heat per unit of time to the liquid to enable the required result to be achieved. The result is that copper particles are transferred to the final dairy product (Japan has recently refused grain consignments because of excessive copper content under Japanese law). In our case, as the heat exchanger used results in a very high heat transfer rate, it is no longer necessary to use copper for those parts transferring heat to the treated liquid, so that the heat exchanger tubes can be constructed of a material of lower thermal conductivity than copper, such as stainless steel, hence overcoming the problem of copper particle release.
As will be apparent to the expert of the art, the described processor unit is of considerable versatility and achieves a very high heat transfer rate because of the presence of a radial dynamic heat exchanger of immersion type. This significantly reduces the time and cost of the production cycle without however changing the typicality of the traditional manufacturing process. In addition the processor unit according to the invention enables any production requirement to be satisfied (from the individual shepherd level to the large industrial cheese dairy), with a truly significant energy saving over a traditional plant.
This also results in a lesser environmental impact due to the significant reduction in burnt gas emission, complete elimination of water consumption for the coagulation, a considerable reduction in detergent effluent, and a significant reduction in the area required for production. Furthermore the processor unit of the invention enables the traditional fixed-volume copper vessel of interspaced type to be completely dispensed with, the vessel now being a simple vessel of any material suitable for food use (such as stainless steel or food-suitable plastics).
|Cited Patent
|Filing date
|Publication date
|Oct 20, 1931
|Jun 20, 1933
|Cherry Burrell Corp
|Liquid heating and cooling apparatus
|Feb 13, 1933
|Apr 20, 1937
|Margaret Jensen Maude
|Apparatus for treating liquids
|Mar 3, 1952
|Mar 13, 1956
|Zamboni Frank J
|Refrigerated milk storage tank and pasteurizer
|Apr 18, 1973
|Jul 8, 1975
|Valspar Corp
|Apparatus for producing polyamide esters
|Nov 1, 1985
|May 26, 1987
|Mars, Inc.
|Closed food processing system and liquid adjustment apparatus for use therein
|Oct 1, 1985
|Jun 2, 1987
|Gabriele Muzzarelli
|Plant for producing plastic curd cheeses
|Sep 18, 1985
|Jul 14, 1987
|Stefano Tomatis
|Cheese hardening machine for pasta filata cheese
|Oct 11, 1988
|Oct 23, 1990
|Bravo, S.P.A.
|Ellipsoidal pasteurizer for food mixtures
|Oct 17, 1996
|Sep 30, 1997
|Ali S.P.A. - Carpigiani Group
|Title not available
|Jan 24, 1994
|Oct 26, 1994
|INVENTA S.r.L.
|Process and apparatus for the heat treatment of liquid food products, particularly for heating milk in the making of dairy products
|Title not available
|Citing Patent
|Filing date
|Publication date
|Jul 28, 2000
|Oct 14, 2003
|Donald M Wyatt
|Attractant scent and solid delivery vehicle and method of manufacture
|Mar 6, 2002
|Feb 5, 2008
|Linde Aktiengesellschaft
|Heat exchanger
|Aug 18, 2009
|May 6, 2014
|Rohde Brothers, Inc.
|Energy-efficient apparatus for making cheese
|Mar 6, 2009
|Sep 10, 2009
|Heald Timothy W
|Home cheese curd making device
|Aug 18, 2009
|Feb 24, 2011
|Rohde Brothers, Inc.
|Energy-efficient apparatus for making cheese
|U.S. Classification
|99/453, 366/144, 165/77, 165/109.1, 99/460, 99/483, 165/74, 366/147
|International Classification
|Cooperative Classification
|European Classification
|Mar 24, 1997
Owner name: FERMENTA ENGINERING, L.L.C., WYOMING
Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:MUZZARELLI, GABRIELE;REEL/FRAME:008413/0007
Effective date: 19970123
|Nov 10, 1997
Owner name: FARMER ENGINEERING GESELLSCHAFT M.B.H., AUSTRIA
Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:FERMENTA ENGINEERING L.L.C.;REEL/FRAME:008816/0883
Effective date: 19971010
|Dec 13, 2002
|Fee payment
Year of fee payment: 4
|Dec 8, 2006
|Fee payment
Year of fee payment: 8
|Nov 5, 2010
|Fee payment
Year of fee payment: 12