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|Publication number
|Publication type
|Application number
|Publication date
|Mar 14, 2000
|Filing date
|Jul 16, 1998
|Priority date
|Jul 25, 1997
|Fee status
|Publication number
|Sung-kyeong Kim, Hun Cha
|Original Assignee
|Samsung Electronics Co., Ltd.
|Export Citation
|BiBTeX, EndNote, RefMan
|Patent Citations (3), Referenced by (4), Classifications (10), Legal Events (4)
|External Links: USPTO, USPTO Assignment, Espacenet
1. Field of the Invention
The present invention relates to a method of etching metallic films for semiconductor devices, and more particularly, to a method of etching metallic films using plasma formed by electrostatic shielded radio frequency (ESRF) inductive-coupled plasma sources.
2. Description of the Related Art
Generally, during the fabrication of semiconductor devices, an etching process is performed in order to form patterns on a film deposited on a semiconductor substrate. The parameters of the etching process depend on the characteristics of the materials and structures designed for the semiconductor device. With more highly integrated semiconductor devices, the pitch, i.e., the horizontal spacing, of structures has become smaller, while the number of layers has increased, leading to the need for creating trenches through more layers. That is, there is a need for a decreased minimum pitch (critical dimension) and an increased aspect ratio (i.e., the ratio of depth of a trench to width of the trench) of the patterns formed in the films for integration scales beyond large scale integration (LSI). Productivity of the fabrication process also depends on etching rate, i.e., the depth of a film that can be etched in a unit of time.
To date, a variety of etching methods have evolved--from wet etching using chemicals, to several dry etching methods including using pure plasmas, reactive ion etching (RIE), magnetically enhanced reactive ion etching (MERIE), electron cyclotron resonance (ECR) plasmas, and electrostatic shielded radio frequency (ESRF) inductive coupled plasma sources.
The etching rates of most of these methods are limited by the depletion of etching agents in the vicinity of a film being etched as the etching progresses, a phenomenon called micro-loading. Micro-loading can be greatly affected by the rate at which reactive etching agents are supplied to the vicinity of the film and the rate at which products of the reaction are carried away.
Plasmas are generated in plasma chambers in which electrons of a source gas, such as air at normal pressure, are excited by radio frequency (RF) high voltages applied across two electrodes or induced by RF electric current flow in a coil. The excited electrons then collide with the molecules of an etching gas, i.e., a process gas, to produce ions and radicals. The ions and radicals then etch the film deposited on the substrate.
Pure plasma etching generates chemical agents including ions and radicals from a plasma of excited electrons so that the ions and radicals can react chemically with the film deposited on the substrate. The effectiveness of this type of etching depends greatly on the material being etched and so provides a high degree of selectivity, like chemical etching. For many materials this pure plasma etching proceeds in all directions, i.e., the etching is isotropic.
Reactive ion etching (RIE) further accelerates the ions and radicals toward the film to increase the kinetic energy of collisions between the reactive ions and radicals and the molecules of the film. This ionic bombardment increases the effectiveness of etching, especially in the direction of bombardment, generally perpendicular to the film. Therefore more directional, i.e. more anisotropic, etching occurs than with pure plasma etching. RIE also tends to depend less on the material of the film, i.e., RIE provides less selectivity than pure plasma etching. In a typical RIE device the RF is at 13.56 MegaHertz (MHz), and a capacitor in the grounding line allows a negative charge to accumulate on the walls of the chamber and the on the wafer. The negative charge repels electrons in an adjacent region called a sheath, and accelerates positive ions and radicals toward the walls and wafer.
Electron densities sufficient to produce ions and radicals can be achieved at low pressures by introducing a magnetic field that constrain the electrons to move in circular or helical trajectories as in MERIE. In ECR plasmas, the magnetic field strength is selected to produce a Lorenz force that causes circular or helical electron trajectories with a cyclotron frequency that matches the RF applied to the electrodes. In ECR plasmas, efficient coupling is obtained between the power applied to the electrodes and the energy given to the electrons. This is called resonant energy coupling, and usually uses a RF at 2.45 GigaHertz (GHz).
Independent plasma generation and ion acceleration is achieved in the inductive coupled plasma sources. In these devices, electrons are excited to form a plasma by an RF magnetic field induced by applying RF power to a helical coil. The plasma is constrained in a plasma region by the RF magnetic filed. A process gas is introduced into the chamber and is ionized by the plasma. A separate bias voltage is applied to the wafer to accelerate the ions and radicals into the wafer at steep angles. To reduce acceleration of plasma and ions and radicals into the walls of the chamber by secondary electric fields produced by the coil as a byproduct of the RF magnetic field, an ESRF inductive coupled plasma source provides a slotted cylindrical conductor around the wall of the chamber as an electrostatic shield. The electrostatic shield prevents the accumulation of charge on the chamber walls by shorting the fields directed perpendicular to the wall, which cause a capacitive coupling, to ground. A solid electrostatic shield would also block the propagation of RF electromagnetic waves into the chamber. However those waves are needed to establish the axial RF magnetic field. Therefore the shield is slotted to allow the RF electric fields to propagate that support the axial RF magnetic field desired, and that block the waves that provide perpendicular RF magnetic fields. In this arrangement ions and radicals can be accelerated into the wafer with less acceleration into the walls of the chamber, and the ions and radicals can be accelerated with a power independent of the plasma generating RF power. As a result low energy ion bombardment and high pressure operations are possible.
The desirability and efficiency of the plasma processes depend on many parameters such as the efficiency of electron excitation, the temperature, pressure and mix of gases that react with the electrons of the plasma to produce ions and radicals, the bias in the electric and magnetic fields that accelerate the ions and radicals onto the film, and the contaminating effects of plasma interactions with other surfaces in the plasma chamber such as the side walls of the plasma chamber. All these parameters can be varied almost continuously, so that extensive experimentation is required to determine what new combinations of parameters produce results that meet particular manufacturing design specifications. Such specifications include the selectivity for one film over another, the critical dimension, the aspect ratio of the resulting structures, the depth and steepness of the trench sides, i.e. the trench profile, and the etching rate.
As the complexity and integration of semiconductor devices continue to increase beyond LSI, limitations in the existing etching methods, such as low selectivity, poor anisotropy, micro-loading, and the difficulty in identifying new combinations of parameters with desirable results, inhibit the productivity of a fabrication facility. These problems are especially severe in the etching of metallic films for forming fine contact holes. The problems become worse as the number of different metallic layers in a metallic film increases.
The conventional processes for established semiconductor devices typically are not applicable to the new devices being designed and manufactured. As a result, the conventional etching processes cannot satisfy the modem trend toward highly-integrated semiconductor devices beyond LSI devices, and so these conventional etching processes limit the utility and reliability of fabrication facilities.
The present invention is directed to provide a method of etching metallic film on a semiconductor substrate in order to satisfy the manufacturing specifications for the modem, highly integrated semiconductor devices beyond large scale integration (LSI) devices.
To achieve these and other advantages, there is provided a method of etching metallic film for a semiconductor device in which a semiconductor substrate with a metallic film exposed in a film pattern is inserted onto a chuck in a chamber of an electrostatic shielded radio frequency (ESRF) inductive-coupled plasma source, the ESRF inductive-coupled plasma source also including a coil connected to an upper electrode, a lower electrode connected to the chuck, a gas supply assembly, a pressure control assembly and a temperature control assembly. An etching gas is supplied to the chamber at a predetermined etch gas supply rate. Pressure inside the chamber is maintained at a predetermined pressure level. The upper and lower electrodes are powered with predetermined upper and lower powers, respectively, at predetermined upper and lower RFs, respectively. The chamber walls are cooled to a predetermined temperature. The metallic film is etched such that trenches in the metallic film are formed with predetermined trench qualities including a predetermined trench critical dimension no greater than a critical dimension associated with large scale integration.
In other aspects of the method, the metallic film includes aluminum, and the etching gas includes chlorine supplied at a rate in a range from about 30 cc/min to about 100 cc/min mixed with boron trichloride supplied at a rate less than about 100 cc/min. In still other aspects, a pressure is maintained at a predetermined pressure in the range from about 3 milliTorr (mTorr) to about 15 mTorr, and a temperature is maintained at a predetermined temperature in the range from about 30� C. to about 50� C.
The present invention is described with reference to the accompanying drawings in which:
FIG. 1 is a cut away perspective view of the ESRF inductive-coupled plasma source used in the etching process according to the present invention; and
FIG. 2 is a cross-sectional view showing a multi-layered metallic film on a semiconductor substrate that is etched where exposed by a photoresist pattern according to the present invention.
The invention is here described in terms of examples including the preferred embodiment with reference to FIG. 1 and FIG. 2.
FIG. 1 shows a chamber 1 of an electrostatically shielded radio frequency (ESRF) inductive-coupled plasma source. The source has a chuck 12 placed inside the chamber 1 for mounting a semiconductor substrate such as a wafer 10 in the chamber 1. The chuck 12 is electrically powered through a lower electrode (not shown). The chamber 1 has substantially concentric cylindrical inner wall 14 and outer wall 16. The chamber 1 has a gas supply assembly including a cover 18 attached to the top of the inner wall with holes a certain distance apart from each other to supply gases into the chamber 1. The chamber 1 also includes a floor (not shown) which is connected to the bottom of the inner wall 14. The cover 18, inner wall 14, and floor are connected so that a predetermined pressure can be maintained between them in a plasma region as part of a pressure control assembly. The inner wall 14 is formed with non-conductive material such as quartz or ceramic, or other insulating material; and the outer wall 16 is formed with conductive material.
The chamber 1 also includes a helical coil 20 powered through an upper electrode (not shown). The helical coil is disposed in the space between the inner wall 14 and the outer wall 16 so that the central axis of the coil is substantially concentric with the central axis of the inner wall 14 and the outer wall 16.
An electrostatic shield 22 is installed in the inner wall 14. Also installed between the inner wall 14 and the outer wall 16, below the coil 20, is a cooler 24 in contact with the inner wall 14 to cool the inner wall 14, as part of a temperature control assembly.
The plasma is formed in the plasma region of the chamber of the ESRF inductive-coupled plasma source. Gas, such as etching gas and supplemental gas, is supplied through the holes of the cover 18 to provide both electrons for the plasma and ions and radicals for etching the film on the wafer 10. The upper electrode and the lower electrode 26 are driven at specified RFs, for example, both at 13.56 Mega Hertz (MHz). The coil RF power supplied to the upper electrode excites the electrons to escape the molecules of at least one species of the gases (either one species of the etching gas or one of the supplemental gas) thus forming the plasma. The coil RF power also constrains the electrons to orbit in a plasma region away from the chuck 12. The electrons of the plasma then interact with other species of the etching gas to form ions and radicals. The chuck RF power supplied to the lower electrode then accelerates the ions and radicals onto the semiconductor substrate such as the wafer 10 to etch trenches into the exposed metal film.
The ESRF inductive-coupled plasma source allows the user to establish predetermined pressures and temperatures of operation that can significantly affect etching rates and selectivity. Predetermined temperatures are attained by cooling using the cooler 24 disposed between the inner wall 14 and the outer wall 16. The cooler 24 passes a cooling fluid such as liquid helium to absorb heat from the plasma region of the chamber 1 through the inner wall 14.
The method of etching metallic film according to the present invention uses plasma formed by the ESRF inductive-coupled plasma source of FIG. 1 to etch a metallic film. Referring to FIG. 2, a metallic film may include several layers 34, 36 and 38 of different metals. A photoresist 40 is formed as an etching mask pattern on the metallic film layers 34, 36, 38, which themselves are deposited on an oxide film 32 on the semiconductor substrate 30. By properly choosing the etching gas, pressure, and temperature, the selectivity can be varied so that the various metallic layers are completely etched away while the photresist is not completely etched and the underlying oxide film is not substantially etched. The anistropy supplied by the ESRF inductive-coupled plasma source can be tuned by varying power to the upper and lower electrodes to allow one etching process to form deep trenches in several metallic layers of the metallic film with reduced undercutting so that steep sided profiles can be obtained.
In example embodiments of the method of the present invention, the metallic film is an aluminum (Al) film. In the preferred embodiment, the metallic film is multi-layered with a layer of titanium (Ti) 34 underlying a layer of aluminum (Al) 36, itself underlying a layer of titanium nitride (TiN) 38. In the example embodiments, the Al film 36 includes about 0.8% to 1.2% of silicon (Si) and may also include about 0.4% to 0.6% of copper (Cu). In the preferred embodiment, the Al layer 36 has 0.8 to 1.2% of Si but substantially no copper.
In the preferred embodiment, the main etching gas is a mixture of boron trichloride (BCl3) gas and chlorine (Cl2) gas; but, Cl2 gas could be used alone. According to an embodiment of the present invention, the BCl3 gas is supplied at a rate less than about 100 cubic centimeters per minute (cc/min), and the Cl2 gas is supplied at a rate of about 30 to 100 cc/min. In the preferred embodiment, BCl3 gas and Cl2 gas are supplied at the rate of 80 cc/min each. These etching gases become electrolytic dissociated in the plasma and the electrolytic ions and radicals react chemically with the metallic film.
Nitrogen (N2) gas can be supplied as a supplementary gas, besides the main etching gas, and at a rate of about 5 to 30 cc/min. It is supplied at the rate of 10 cc/min in the preferred embodiment. The role of the supplementary gas is to provide electrons for the plasma or to bind with the chemical products of etching to form chemical species that can be more easily removed from the wafer than the chemical products of etching themselves. The supplementary gas can reduce the effects of microloading.
According to another embodiment of the present invention, the etching process is carried out at low pressures with the pressure maintained at a predetermined level in the range from about 3 to 15 milliTorr (mTorr). In the preferred embodiment, the predetermined pressure is maintained at about 5 mTorr. The low pressure is maintained to prevent loss of bombarding energies of the ions and radicals by reducing interactions between gas molecules and to evacuate products of the reactive etching.
According to another embodiment of the present invention, the etching process is performed at a temperature in the range from about 30 to 50� C., by cooling. In the preferred embodiment, the temperature is cooled to about 40� C. by passing liquid helium through the cooler 24.
In another embodiment of the present invention, the power applied to the upper electrode can be greater than the power applied to the lower electrode. The source power applied to the upper electrode should be in the range from about 700 to 3500 W, and the bottom power applied to the lower electrode should be less than 500 W. In the preferred embodiment, the source power is about 800 W, and the bottom power is about 120 W.
The present invention provides the conditions for forming trenches in all layers 34, 36, 38 of the multi-layered metallic film including aluminum, without etching away the photoresist, without too much diluting of the reactive agents, and without contamination from the inner wall 14. That is, trenches can be formed that meet the design specifications for critical dimension, anisotropy, trench profile, selectivity, and micro-loading. Thus the etching process of the present invention satisfies the design specifications to fabricate the fine patterns of modern, highly integrated, complex semiconductor devices.
Now the functions and effects of a concrete embodiment of the present invention are illustrated in detail with reference to FIG. 2. First, the oxide film 32 is deposited on the semiconductor substrate 30 of a wafer 10, and then the Ti layer 34, the Al layer 36, and the TiN layer 38 of the metallic film are successively deposited. In order to form a designed pattern of trenches in the metallic film, a photoresist 40 layer is formed on the TiN layer 38, the uppermost metallic layer, and then photolithography is carried out on the photoresist to form an etching mask that exposes the metallic film in the designed pattern.
Then the metallic film etching process operates on the exposed metallic film 34, 36, 38 as patterned. The wafer 10 with the semiconductor substrate 30, oxide layer 32, and metallic film 34, 36, 38 is mounted in the chamber 1 on the chuck 12. A plasma is formed in the chamber of an ESRF inductive-coupled plasma source with the source power (i.e. an upper power) of the upper electrode at 800 W, and the lower power of the lower electrode at 120 W. Then the main etching gas, a mixture of BCl3 gas and Cl2 gas each supplied at the rate of 80 cc/min, is introduced into the chamber 1. At the same time, supplementary N2 gas is supplied at the rate of 10 cc/min. The chamber is maintained at a pressure of 5 mTorr and cooled to a temperature of 40� C. In order to maintain 40� C. of temperature, the chamber 1 uses a cooler 24 with liquid helium (He) supplied with 12 Torr of pressure.
Accordingly, Cl ion and Cl radical are generated from the ionized chlorine gas by the plasma. The Cl radical reacts with the layers 34, 36, 38 of the metallic film in order to etch through all three layers. In addition, the BCl3 gas is also ionized by the plasma and reacts with the layers 34, 36, 38 of the metallic film in order. The N2 gas controls the etching rate during the etching process and improves the profiles of the pattern formed by the etching process.
The specific conditions described for the concrete example are considered optimum for the anisotropic etching of a metallic film having layers of titanium, aluminum, and titanium nitride using a patterned photoresist as a mask. If the etching process is carried out within the wider ranges of the processing conditions for the present invention, as described preceding the concrete example, the present invention should satisfy modern specifications of an etching process for a multi-layered metallic film, including selectivity and anisotropy, at critical dimensions smaller than those associated with LSI devices.
Therefore, the present invention can be effectively applied during modern, more highly integrated semiconductor device fabrication that is more demanding in terms of the critical dimension of fine patterns formed, and more complex in terms of design specifications. Thus the present invention provides increased reliability for modern semiconductor device fabrication.
While the present invention has been described in detail, it should be understood that one of ordinary skill in the art can make various changes, substitutions and alterations without departing from the spirit and scope of the invention as defined by the appended claims and their equivalents.
|Cited Patent
|Filing date
|Publication date
|Sep 9, 1987
|Sep 20, 1988
|Kabushiki Kaisha Tokuda Seisakusho
|Vacuum processing apparatus wherein temperature can be controlled
|Nov 15, 1991
|Jul 23, 1996
|Tokyo Electron Limited
|Electrostatic chuck having a multilayer structure for attracting an object
|Mar 3, 1995
|Sep 17, 1996
|Tokyo Electron Limited
|Plasma etching apparatus
|Citing Patent
|Filing date
|Publication date
|Nov 26, 2001
|Jun 15, 2004
|Sumitomo Electric Industries, Ltd.
|Etching method for ZnSe polycrystalline substrate
|May 5, 2009
|Mar 27, 2012
|Hitachi High-Technologies Corporation
|Dry etching method
|Sep 26, 2003
|Jun 10, 2004
|Tokyo Electron Limited
|Electrostatically shielded radio frequency plasma apparatus and method of manufacturing
|Nov 12, 2009
|Satoshi Une
|Dry etching method
|U.S. Classification
|International Classification
|Cooperative Classification
|European Classification
|Oct 29, 1998
Owner name: SAMSUNG ELECTRONICS CO., LTD., KOREA, REPUBLIC OF
Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:KIM, SUNG-KYEONG;CHA, HUN;REEL/FRAME:009555/0049
Effective date: 19980718
|Aug 19, 2003
|Fee payment
Year of fee payment: 4
|Aug 17, 2007
|Fee payment
Year of fee payment: 8
|Aug 29, 2011
|Fee payment
Year of fee payment: 12


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Stay in any of our private homes and cabins for the summer season and save BIG! Save 15% off 2 nights or 25% off 4 nights! Choose from fully equipped cabins to 3 or 7-bedroom private homes. We also have premier townhomes. Depending on location, amenities can include indoor and outdoor hot-tubs, steam rooms, decks and more. This offer is valid for new bookings only and cannot be combined with any other offers. Certain blackout dates will apply! This offer is valid for stays between 6/1-9/1. Must be booked by 6/30/16. Call 1-800-595-6421. VACATIONS INC - "9,000 feet Above the Ordinary"
Expires: Jun. 30th, 2016
Steps away from Lake Dillon. Keystone, Copper and Arapahoe Basin (6-10 miles away). Call 800.842.5939 for information and reservations. www.ptarmiganlodge.com
Expires: Sep. 30th, 2016
Snowmass offers something for everyone! You'll be amazed at the beauty of our town and the friendliness of the people. There is so much to see and do, it's impossible to squeeze it all in one weekend so...stay longer and receive 10% off on your stay*! Explore and learn more about our summer activities and adventures by calling (1-844-564-8160) or emailing our concierge (email@example.com). Go ahead...eat, play and have fun like a local! *Valid on Monday through Thursday stays only, 10% off lodging at Capitol Peak, Hayden Lodge and Snowmass Mountain Chalet. Some black-out dates may apply, Valid on new bookings only, cannot be combined with any other discount. 2 nights minimum at Capitol Peak and Hayden Lodge, one night stays at Snowmass Mountain Chalet.
Expires: Oct. 30th, 2016
Come see for yourself why families just love our playground in the Rocky Mountains. Get a jump on summer lodging deals visit: http://www.playwinterpark.com/summer-lodging-deals/
Expires: May. 31st, 2016
Save up to 15% on spring travel to Breckenridge when you book with promo code LASTMINUTE through June 3, 2016. Call 855-450-4821 to speak with a vacation specialist. Book here: http://bit.ly/USFamilyGuide_BRK_Specials
Expires: Jun. 3rd, 2016
Buy one trip at full price and the second person rafts for 1/2 price! Offer valid for any size group. A variety of trips for all ages and ability levels on 5 of Colorado's most spectacular rivers! Award winning service with over 25 years of experience! Give us a call -You'll be glad you did!
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Stay in any of our condos, townhomes or cabins for the summer season and save BIG! Save 15% off 2 nights or 25% off 4 nights! Choose from fully equipped studios to 3-bedroom condos, standard to deluxe townhomes. Depending on location, condo and townhome amenities can include indoor and outdoor swimming pools and hot-tubs, workout facilities, steam rooms, decks and more. This offer is valid for new bookings only and cannot be combined with any other offers. Certain blackout dates will apply. This offer is valid for stays between 6/1-9/1. Must be booked by 6/30/16. Call 1-800-595-6421. VACATIONS INC - "9,000 feet Above the Ordinary"
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In summer, Aspen's mountain terrain transforms into a green oasis for outdoor adventure. For golfers, two golf clubs lie within a mile of The Inn at Aspen. Area rivers offer fishing, float trips and whitewater rafting, while the expansive White River National Forest boasts an extensive trail system for hiking and mountain biking. Enjoy the fresh mountain air and abundant sunshine! Book your summer stay and save 15% on 4 nights and 20% on 5 nights or more at the recently renovated Inn at Aspen. Offer is valid for travel June 1st to September 30th, 2016, when you book with promo code SUMMERSALE. With our gorgeous scenery, pleasant climate and world class restaurants and shopping, summer is a season not to be missed in Aspen. Book here: http://bit.ly/USFamilyGuide_Aspen_Specials
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Expires: Jun. 8th, 2016


text:
Malls and Shopping Areas Refuse to Put Up Maggie Q's Sexy and Fiery 'Nikita' Billboards
Billboards promoting actress Maggie Q's new TV show "Nikita" are causing a controversy across America because they're too sexy and too fiery. The bosses of some malls and shopping areas have refused to put up the posters for fear of offending people.
The varied billboards feature the scantily clad "Live Free or Die Hard" star holding a series of killer weapons. Officials at top Los Angeles shopping center The Grove passed on an image of Q wearing a leather outfit. Malls in Chicago, Illinois and New York also passed on the image, according to Variety.
Some outlets have now erected a replacement ad featuring the actress in a long red dress and brandishing a machine gun. But even that has upset some community members - those "Nikita" replacement ads have been pulled from billboards located near schools and churches in the Los Angeles area.
Maggie Q will be the third Nikita when the all-action show debuts in America later this year - French actress Anne Parillaud played the assassin in Luc Besson's 1990 movie and Peta Wilson took over the part in late 1990s TV show "La Femme Nikita".
- Police Found No Evidence of Physical Abuse in Amber Heard's Case
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- 'Pretty Little Liars' Star Teases Jenna's Return: 'I'm in Most of the Season'
- Victoria's Secret Angels Give Justin Timberlake's 'Can't Stop the Feeling' Hotter Music Video


text:
Atari 5200 Games
Missing dot for Pac-ManHome / Atari 5200 /
This page contains Pac-Man Hints for Atari 5200 called "Missing dot" and has been posted or updated on Aug 25, 2006 by cmc101.
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Boxshot & Details
- Developer: Atari
- Publisher: Atari
- Genre: Action
- Release: Not Set
- ESRB: Not Set
Missing dot
Begin game play on the Cherry screen. Move to the right and move up and into the right side tunnel. A chomp sound will be heard as Pac-Man disappears. Pause game play and look to the left of your starting location to find one of the dots to the left of Pac-Man's starting location is now missing.
Report Problem
Please Submit a Problem for any incomplete, non-working or fake cheat listed above.
More Hints
From: lmtsantos
Back to all Cheats
From: cmc101
Stuck in this game? Set a specific, clearly defined question and let other gamers answer your question or view answers to previously asked questions. If you think you are an expert then please try to help others with their questions.
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text:
Have a Quick Look v1.0
This script uses the UNIX qlmanage command to display a Quick Look window of the selected track(s), which can be audio, video, and, perhaps most usefully, PDF, whereby Preview.app is not necessary. Also handy for playing a single track out of playlist context. Need I add that a keyboard shortcut makes this very handy.
Caveats: 1) under Leopard a media file will begin playing immediately, so the script uses a hack to prevent this, 2) under Snow Leopard and better the QL window's title contains "[DEBUG]" which cannot be suppressed, and 3) the QL window can only be dismissed by clicking on its close box.
Latest version:
download ⬇
Current v1.0
Free to use, but a payment
in appreciation is requested. Thanks!
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Speaks the name, artist, and album of each track as it starts playing
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Log playing tracks to text file
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Tracks Without Embedded Artwork v1.3
Gather audio tracks whose files contain no artwork metadata
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Set choice of various number tags of selected tracks incrementally
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Append user-entered text to beginning or ending of selected tag of each selected track
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Remove n Characters From Front or Back v5.3
Delete characters from the beginning or ending of selected tracks' name, artist, album, comments, composer, or show tags
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Albums Assemble v1.3
Gather all tracks of selected tracks' albums to single playlist
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Use tag data to formulate new file name for selected tracks' files
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List MIAs v4.4
Display, create text file listing info of dead tracks
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List tracks not assigned to playlists
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Create a playlist of random Artists and set number of random songs back-to-back
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Emulates iTunes search and copies results to a playlist
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Create a playlist for each entry of a specified tag
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'Bones' Final Season Is Pushed to Midseason. Find Out the Replacement
- 11:07 AM, May 21
The BAFTA Los Angeles 2012 Britannia Awards
Photo credit: Adriana M. Barraza / WENN
To fit your screen, we scale this picture smaller than its actual size. The original picture size is 659x1000 pixels and this photo has been viewed 1184 times since November 07, 2012


text:
TSMC Updates 1Q'14 Guidance
Hsinchu, Taiwan, R.O.C. – March 12 , 2014 –TSMC (TWSE: 2330, NYSE: TSM) today updates the first quarter 2014 guidance and provides additional comments on its outlook for the first quarter.
Compared to the guidance offered by the Company on January 16, 2014, first quarter revenue, gross profit margin and operating profit margin are all expected to exceed the high end of the guidance. First quarter revenue is expected to be about NT$147 billion. Gross profit margin is expected to be about 47% and the operating profit margin is expected to be about 35%.
"The upside to the first quarter guidance comes mainly from the increases in demand for our 28-nanometer wafers and from customers' active restocking of their inventory," said Lora Ho, SVP and Chief Financial Officer of TSMC. "The first quarter upside is perhaps a good prelude to an already anticipated strong year."
Search Silicon IP
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Helicopter wreck discovery: Families' emotions raw
Relevant offers
The families of a helicopter pilot and passenger missing for almost nine years are grieving again after the discovery of helicopter wreckage in Fiordland.
Police yesterday confirmed the wreckage found near the Humboldt Falls was that of a Hughes 500 helicopter that went missing in 2004.
The helicopter had been carrying the pilot, Campbell Montgomerie, 27, of Waikato, and his girlfriend, Hannah Rose Timings, 28, of Gloucestershire, England.
The pair have yet to be formally identified. It will be done through DNA.
Both families have been contacted and Mr Montgomerie's parents, Liz and Ian, travelled to Queenstown yesterday to see the wreckage first-hand and meet the searchers.
"It's still a shock," a tearful Chris Montgomerie, the pilot's sister, said yesterday.
"It's the shock of it that's bringing up a lot of stuff.
"I guess it's something we always thought might happen, but it's a bolt out of the blue, really."
It was something the family had always hoped for.
"But it still feels like we said our goodbyes nine years ago. So in my mind, we've had that closure. But I guess that's why it's strange how raw it still feels, actually," she said.
The accident unfolded after the pair flew from Queenstown bound for Milford on January 2, 2004, but set down near the Howden Hut on the Routeburn track in bad weather.
After taking off from the helipad at the hut, they were not seen again. They were declared dead at an inquest in Te Anau in August 2004.
Yesterday morning, seven police search-and-rescue specialists and two personnel from an Alpine Cliff Rescue team were flown by helicopter to the foot of three sheer rockfaces, at an altitude of 1340 metres, just above where the first traces of the wreckage were found.
Parts of the helicopter were seen among rocks and scrub just above the snowline, and showed the extent of the accident impact.
Extensively damaged sections of the helicopter, barely visible yesterday from the air because of their similar colour to the scrub and rocks, as well as intermittent cloud, were scattered throughout the rugged terrain.
The surrounding terrain was so difficult that the two alpine cliff rescue team members were unable to be seen easily from the helicopter without high-visibility gear, after they were taken to the site.
Inspector Olaf Jensen, one of those who travelled to Te Anau, said that on January 3, 2004, the helicopter had been en route in difficult weather from Howden Hut to Milford Sound when it lost radio contact with the Milford Radio Tower shortly before 9am.
An extensive search and rescue operation was mounted the same day throughout the Hollyford Valley.
The scenario-based search covered the various routes that the helicopter might have taken from Lake Howden to Milford Sound and included more than 200 flying hours and 2500 man-hours, Mr Jensen said.
The wreckage was found at the extremity of the original search area, which comprised extraordinarily difficult and complex terrain, he said.
The wreckage was spotted about 4pm on Wednesday by Queenstown-based helicopter pilot Brendan Hiatt.
Mr Hiatt said he was on his way back to Queenstown after picking up two American couples who had been on a cruise around Milford Sound, when he saw something below.
"I just spotted something glinting that just didn't look quite right among the snow, so I said 'We'll just take a look'.
"It's happened before, where you see a glinting rock or something that you go in closer for a look at.
"We got close and it was pretty evident what it was."
The helicopter got within about 20m of the wreckage. Those on board could see a section of the tail and a rotor blade, he said.
"It was destroyed. It's been a very, very violent impact," he said.
The remote location was likely the reason why the helicopter had not been found.
"The lower part of the valley is pretty bushy so the access in there would be pretty difficult.
"That's probably why nobody's come across it before.
"There's plenty of them [missing aircraft] around, though, so you're always looking, I guess."
Civil Aviation Authority spokesman Mike Richards said yesterday that two police disaster victim identification officers had been at the site all day yesterday photographing and taking video of the scene.
The images would be passed on to the authority for review to see if there were any obvious indicators of equipment or mechanical failure which might result in a key safety lesson.
However, it looked like the wreckage was the subject of a fire and that, coupled with sustained exposure to extreme weather conditions since 2004, would make it difficult to assess, he said.
The authority was assisting police with any records from its files that might help identify the helicopter, he said.
The couple spent their last night at the Howden Hut, eating, drinking and playing cards with a group of trampers.
They had turned up unexpectedly when the weather closed in and they were unable to reach Milford Sound from Queenstown in January, 2004.
They were never seen again after leaving in the morning.
Yesterday helicopter wreckage was found and police last night confirmed it was the missing Hughes 500.
Among the trampers at the hut were New Zealand-born Brendan Grainger and his wife, who were living in the United States, but were on holiday and walking the Routeburn Track.
Mr Grainger said it was the last night on the track for his group and a couple of other trampers.
"We combined all our food and cooked up a feast for us all.
"Campbell and Hannah didn't have any food, but Campbell did have a couple of bottles of wine. After we'd drunk it all, out of our plastic mugs, he said: 'Not bad for a $200 bottle'. I just about fell off my chair. It was a really nice night. Awesome," he said.
The trampers farewelled the helicopter in the morning and it was not until 6pm they learned the pair had not reached their destination.
"The ironic thing is he'd been cautious enough to land at Howden Hut that night. The next day he took off in really low cloud.
"He really just wanted to get to Milford Sound and show her around."
In the years since, Mr Grainger checked regularly to see if the helicopter had been found and was shocked to learn yesterday about the discovery of the wreckage.
"It must be bittersweet for the family. I hope it will bring some closure for them."
Private investigators who helped search for the missing Hughes 500 helicopter in remote Fiordland were yesterday relieved the eight-year mystery was solved.
Retired Civil Aviation Authority investigator Tom McCready and Westpac search and rescue pilot Darryl Sherwin, who helped recover the wreckage of multimillionaire Michael Erceg's helicopter in 2005, spent long hours privately investigating the disappearance of ZK-HNW.
Mr McCready said the possibility of finding the wreckage in Fiordland was remote.
They investigated fuel efficiency, GPS co-ordinates and plotted tracks using radio records for the Hughes 500, which was last reported as nine nautical miles (16.5 kilometres) out of Milford.
"We put a lot of effort into it.
"A lot of search and rescue people will tell you it's extraordinary how often the aircraft are found very close to where they were last seen but they are very hard to find. New Zealand has very good LandSAR organisations and they do extremely well but the fact remains that finding an aircraft in difficult terrain is extremely difficult, even sometimes when you know where it is."
Mr Sherwin said he and other private investigators compiled witness reports, GPS data from an identical model, a Garmin 195, and logged VHF radio coverage, a line-of-sight positioning method used in mountainous terrain without radar.
Radio coverage was lost about 9pm and it would be interesting to find out whether a crash analysis could determine the time of impact, he said.
"Hunters and trampers, if they come across anything that seems out of place . . . [they should] photograph [it] or carry it out.
"It's great news for the families, giving them some sort of closure and solves another mystery in aviation history."
Rescuers spent 204 flying hours and 2300 man hours searching the mountainous area where the four-seater privately owned helicopter was lost.
The Hughes 500 was reportedly the only missing helicopter in New Zealand and its discovery reduces the number of missing aircraft to 17.
- The Southland Times
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text:
William "Bill" Clarence Whiten, Sr.
Published: Friday, December 9, 2011 at 8:14 a.m.
Last Modified: Friday, December 9, 2011 at 8:14 a.m.
BLACKSBURG, SC-- William Whiten, Sr., 74, of 119 Seven Springs Road, died December 6, 2011.
White Columns
Reader comments posted to this article may be published in our print edition. All rights reserved. This copyrighted material may not be re-published without permission. Links are encouraged.


text:
GARDEN GROVE, CA—International design firm Ware Malcomb has begun construction on the Great Wolf Lodge indoor waterpark resort here. This will be the first California location for the brand, a leaderin the waterpark-resort industry and operated by Great Wolf Resorts Inc. based in Madison, WI.
As GlobeSt.com previously reported, Great Wolf Resorts Inc. broke ground in May on the 600-room indoor waterpark resort. City Council member Steve Jones from the City of Garden Grove; Chad McWhinney, CEO and co-founder of McWhinney; Mayor Bruce Broadwater; and Kimberly Schaefer, CEO of Great Wolf Resorts, gathered for the groundbreaking ceremony for the brand's 13th resort.
Great Wolf Lodge Southern California will be located within the Grove District in one of the region's most popular tourist areas at 12681 Harbor Blvd., bringing a new destination for families to the area. The indoor waterpark resort, which will offer more than 600 suites, will include a 328,000-square-foot, 12-story high-rise, concrete-frame hotel and a 130,000-square-foot indoor/outdoor waterpark. In addition, the project will feature 30,000 square feet of conference facilities, 18,000 square feet of retail shops and restaurants and a parking structure.
According to Tom Myers, principal of Ware Malcomb's commercial architecture group, "This is a unique project that is sure to have an indelible impact on the resort industry here in Southern California."
Ware Malcomb serves as architect of record for the project, which is expected to be completed and open in early 2016. When finished, it will be the largest Great Wolf Lodge location in the country.
As GlobeSt.com reported in May, Ware Malcomb has merged with Connell Design Group of Seattle. The merger allows Ware Malcomb to create a new presence in the Pacific Northwest and brings the total number of its regional offices spanning the US, Canada, Mexico and Panama to 15. The transaction also bolsters the architecture and design capabilities of the combined office to better serve corporate and commercial real estate clients in the Seattle market. Terms of the transaction, which closed last month, were not disclosed.


text:
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I have a copyright on all photographic angles of every landscape image image created, going to be created in any medium known or yet to be invented.
Polaroid licensee sues GoPro over cube-shaped Session action camera
C&A Marketing, a Polaroid licensee that makes the Cube action cameras, has sued GoPro over its newly introduced Hero4 Session camera. The new GoPro model is cube-shaped and resembles Polaroid's own Cube and Cube+ action camera models, allegedly infringing upon C&A's design patent. The lawsuit was filed today in U.S. District Court in Newark, New Jersey.
The Polaroid Cube has been on the market for about a year, while the GoPro Hero4 Session camera has only been on the market a few months. The cameras are unmistakably similar in design, each with a cube-shaped body, a single control button on the top and a lens on the front.
GoPro holds European Union design patents for the Session, as well as a US patent for a cube-shaped camera case. The company applied for a patent on the Session's design last year on January 6th, which it is still waiting for. One day prior on January 5th 2014, C&A Marketing filed for its patent. The company is suing for all profits made on the Session, in addition to cessation of that camera's sales.
Now all car makers are gonna sue each other for the shape of the car that resembles the other brand... ha ha ha!
This type of patents are complete joke! The problem is all created by the governing body thought! Polaroid didn't invent cube shape and apple didn't invent retangular sharp! End of! Stop these nonsenses!
What's next? China & Egypt patent all their inventions? Pi, gun powder, arch bridges, compass........
Polaroid would have a point if you pick up a GoPro and mistake it as a Polaroid. But I don't see how that's possible! Complete joke!
I am not trying to justify Polaroid's lawsuit action, but it is not just a cube shape, they are strikingly similar in size and layout as well.
I can understand that patenting a cube shaped little camera sounds ridiculous, but what if that was the whole point of such product's existence?
I mean.. if you produce a product in hope of attracting consumers by uniqueness of design, just to get your thunder stolen.. that really sucks..
As a result, I am sure Polaroid is getting a sizable damage in profit.
When was the last time you saw someone toting a Polaroid camera? ; )
Isn't that beside the point?
"what if that was the whole point of such product's existence?"
What if? That doesn't mean a square should be patentable. As far as "layout" goes... what other options are there? It's a tiny cube. It's not as if there are copious options for placing a button on it.
You are still selectively nitpicking at the shape, when the product design should be considered as whole.
It is not just shape thing, or layout thing, the striking similarity is unmistakable.
It's time to take a step further - I would patent square shape in general. That would allow me to sue both Polaroid and GoPro; both would be subjected to 6 lawsuits, one for each wall of the cube.
Let's not forget about the patent I have for red color (in general).
"Greed Is Good" Haven't you seen the movie?!
A camera shaped like a cube? Now that's thinking outside the box, and is definitely worthy of a patent!
This shape licencing nonsense is beyond ridiculous.
who's suing sjcam or is sjcam suing apple or others? LOL
i was hoping other reputable manufacturers jump on cube shape but now probably won't happen. I like cube.
Does anyone really give a toss about this "Mini Box Brownie" story?
Well maybe GoPro and Polaroid, who appear to be still in business in some form, but don't deserve to be.
HISTORY LESSON: A box? Really? Kodak couldn't keep Fotomat from using their color yellow and font in court. Well, no love lost here in Massachusetts where Polaroid did a scale model Enron with their retirees; screwed them and the local economies due to their own greed and hubris. Polaroid was at one time in a better place during the late '80s and early '90s to make the digital transition. Instead the oligarchical corporate frame work left in place by Ed Land saw it differently. All the brilliant engineers, physicists, chemists and photo scientists left in droves like rats from a sinking ship. Polaroids' answer was to close up shop and leave vested employees with nothing. Hope the group that owns their licensed name loses this case.
"slow news day"
It reminded me of good old-DOS days. Lotus 1-2-3 sued the Twins, VP-Planner, Quattro Pro and VisiCalc for looks and feels.
I actually know what you're talking about which really shows my age.
Except back then there was a little more sanity. Apple tried to sue Microsoft for "look and feel" and was smacked down in court.
Now we have an outrageously derelict patent office and an administration that has utterly failed to enact desperately needed patent reform (the abolishment of software and "business method" patents).
At one time the Polaroid brand meant something and was a very innovative company. For a ggd while I would say they were the most technically sophisticated camera on the market, Crap like this suit, makes me wish Polaroid had never licensed their Name. The new company hasn't shown any sign or inkling of the creativity of the original company that bore the name Polaroid. So I guess they've resorted to filing frivolous law suits to try and prop up their bottom line.
SMH at C&A Marketing for going after GoPro because their camera is a cubical in shape, has a lens in the front and one control button on top. Maybe P.A.R.C. should've gone after Apple for patent infringement on the single button mouse.
People keep referring to this company as Polaroid, it is NOT Polaroid. They just paid a licensing fee to use the brand name. Put the blame where it belongs, C&A Marketing and NOT Polaroid..
I don't actually agree that this is "not Polaroid". If Polaroid collects a licensing fee for use of the name, it can expect to be involved - in the minds of the public - when the behaviour of the licensee is in question. If a product carrying the Polaroid name is good, the Polaroid name benefits. If it's bad, the reputation suffers, regardless of who it is who is using the name on their product. Same applies here - the brand name suffers, regardless of whose name is on the paperwork.
This "Polaroid Licensee" should consider court marshaling their designers and engineers for design work unbecoming of a manufacturer. I hope GoPro cleans their clock.
Polaroid makes a cube shape action camera? Polaroid is still making any kind of camera? Well I'll be darned.
They're about as similar as two random smartphones ..
Canon has a new cube camera. What will they do? Oh, nooo.
Leica SL copied a boxy mirrorless body design from Sony A7 series! 😅
We need retroactive lawsuits since the beginning of time.
This is like Ford suing Chevrolet for building cars with four wheels.
No, no it isn't. Not even a little bit.
SLR cameras look identical. Point and shoot cameras are no "different" either. Form follows function.
Hasselblad should sue Polaroid and GoPro then. Cube shape with a lens on the front is not new. Patent the shape of a camera, an awkward one at that? One button cameras are not unique. Now we know how Polaroid is going to make any money. Patent pirate.
Dear Polaroid, please just go into bankruptcy and NEVER return
- The photography community of the world.
This would be a valid argument if Polaroid was the market leader and some other small company copied it's design to try to fool people into thinking they are getting an equally good product. That's why design patents exist.
However, in this case it appears that Polaroid are simply going for a cash grab instead of riding on the coat tails of Gopro and bettering their product.
The business leaders at Polaroid should realize that imitation is the best form of flattery.
As I understand it Polaroid went out of business. Some businessman bought the right to license the name. The Polaroid Cube is a cheap rip off of the GoPro by one of those licensees. This is like someone patenting a flat rectangular shape for a phone and then suing everyone for patent infringment.
The basis of your argument is incorrect. Design patents exist exactly for this reason. It the criteria you suggested determined whether or not a patent is being infringed then companies like Samsung for example would be able to copy anything they wanted from any other smartphone manufacturer and get away with it. See a great new design by an unknown brand and just copy it before they get too big thus killing competition.
My first camera, a Kodak Brownie (not sure it was called a brownie) that I think used 127 film, was basically a cube or square box. It was given to me in 1958. So I don't think there is any particular innovation in designing a cube shaped camera. Seems like they can protect the trade name "Polaroid." But a "cube" shaped camera? What would Rubic have to say about that!
Sheesh! Polaroid are worried that, what, the recognised market leader might sully their own good name? A case of beware of higher quality imitations?
What about dice manufacturers?
They use that shape for ages.
Half of these comments are along the lines of: "My beer comes in a cube shaped box, are they going to sue them too?"
No because a case of beer is not a tiny cube-shaped action video camera with obvious design similarities. Stop being obtuse.
Well, that's one creative way to make money...
Protecting your design and future marketability? Not all that creative, but it is good business practice.
Have to agree with tkbslc...it's just a fact of our connected world that if a company doesn't fight tooth and nail to avoid unfair competition they'll quickly be destroyed by copies, counterfeits, and any sort of thievery you can imagine. It sucks, but even huge companies like Apple can't stop all the fakes out there so imagine what would happen if nobody even tried to protect their intellectual property.
A cube is now considered "intellectual property"? Wow how far civilization has come...
No, but even with nearly identical smartphones they have to do something unique. I do various artwork, and small details in design make a huge impact on sales and aesthetic appeal. Someone may see one of my pieces and think "no big deal, I can replicate that." If it was so obvious why didn't you do it before me?
They should sue the BORG too :-))
Hey C&A watch out for the apparel company that will sue you for your name. To pay your lawyers you can also start suing Canon: https://i.ytimg.com/vi/SThuDehMLPs/maxresdefault.jpg
Yet another patent law absurdity. I doubt any of these companies invented a cube, so how on earth can one patent a cube whatever?
it's not as simple as patenting a shape, it's also the function tied to that shape, but yes you can patent a cube toilet paper roll, or a cylindrical mobile phone and if Apple was to copy your design you could, and rightfully so, sue them, after all you thought of a cylindrical phone first.
Dear Polaroid, please make this camera Windows Phone comparable that I can buy at least one! TOMORROW!
So, if I patented cylinder, I could sue all toilet paper and steam roller manufactures? .. I wonder, what geometrical shapes are still available to put patent on? :D
I imagine that nobody patented the rhombicosidodecahedron-shaped camera... yet!
Put fins on it. It'll be much more aerodynamic.
Surely Fox Talbot holds the patent for boxes with lenses on the front? He must be a rich man...
Here how this is going to go in the courts, simplified:
Hey your's looks like mine.
No it doesn't.
Yes it does.
No it doesn't.
I'm gonna tell.
Go ahead and tell.
Mommy, he's copying me.
Stop taddling on your brother and you two get along, now.
Well, that's pretty much the extent of the rounded rectangle arguments that came out of the Apple-Samsung case.
As if they weren't already making enough money. Go give the money to charity than waste it on ridiculous lawsuits.
I have bever heard of anything so ridiculous! So I wonder if Box Brownie has a case to sue Poloroid?
It is ridiculous that a shape as basic as a cube can be patented for use in a camera. Besides, Kodak had a box-shaped camera with a lens on the front about a century ago.
Too much time and money is spent on senseless litigation, which serves only to stifle business and innovation, and to make lawyers rich.
Strange to see people here defending 'GoPro' for infringing a design patent, while at the same time many of these people attack Samsung for infringing the looks of an iPhone.
Must probably have to do with American Patriotism i'll guess...
You spelled fanboi-ism wrong.
How this qualifies as innovative and non-obvious to a person having ordinary skill in electronics/camera design is beyond me.
Instead of wasting time trying to sue because Gopro stole their lunch, Polaroid should be spending their time resurrecting the SX-70
The Polaroid of the SX70 went bust a long time back. The name and IP was sold to another company which kept making Polaroid cameras until 2007. They went bust around 2008 and yet another company bought the name, and licences companies (I think mostly Chinese) to use it for their products.
Interesting....maybe that's why they're suing, to save them from going bust again
All so American.
A good sign on the Polaroid desperation:
First doing it themselves: http://www.engadget.com/2013/10/15/nikon-sues-sakar-polaroid-im1836-kirf/
And when it didn't work out, try to sue others for the same thing.
How patents like this can even exist, I have no idea.
Did anyone patent the sphere shape? it not, i think i'll apply, maybe someday i can sue someone...
They are a special class of patent for the "look" of a functional object, they are what a lot of the rest of the World calls a "registered design". In both cases it's to stop people making knock-offs of your product and using your design/marketing efforts. They do look pretty similar so I think they are in a with a shot here.
patent stuff is fuzzy in general... while you do have a point, and while my first post was in jest, there should be reasonable limits...
Yes, it makes sense to patent an advanced aerodynamic form for an airplane or car... but "patent for a cube camera" or patent for "rounded corners for a smartphone" ... are just things that should be ruled as invalid.
Car firm lawyers must have a field day regarding 'shape', many new cars look ever so similar to my untrained eye :o)
One is original, one is overpriced, over-hyped copycat. =D
Polaroid is really desperate.
Nobody loves a patent troll !
This is so frivolous !
It's not Polaroid that's suing, it's C&A Marketing.
Maybe read the article?
You're not a Patent Troll if you are selling a product and someone makes a copy of it. (Patent Trolls buy patents but don't make products with them, just bill people.) Although this sounds more like an issue of design copyright than patents anyway... Ah, in the US a "Design Patent" is like a "Registered Design" in many other countries...
Polaroid doesn't exist. You can pay to use the Polaroid name on a product.
"Polaroid Corporation" is still around, but its connection to the former Polaroid company is tenuous/complicated.
I read the article again. I assumed Polaroid gave its blessing on this action, as the name Polaroid was going to be dragged in this.
I used the troll term very loosely. Sorry.
There should be a term for frivolous patents cry baby.
Rubik sues Polaroid.. Fischer Price sues Rubik. Jello sues Fisher Price.
The Borg don't sue. They assimilate.
Ha ;) easily the best post in this articles comment section ;)
So. is the D/SLR shape public domain?
US design patents last 14 or 15 years, so would be long expired. In Europe it's 25 years (for a registered design, which is the equivalent) if you renew it along the way.
I think it's 20 years in the US. It used to be 17 years back in mid 1980s.
Negotiations must have failed. Now that the issue is in court, we are looking at a minimum cost of $1 million. Lawyers must be very happy.
If Apple against Samsung can win the rounded edges patent (which is ridiculous), I think C&A Marketing has a good legal case.
Most likely this will be settled out of court.
BTW, talked to a GoPro exec and they agree with me that this is the cheapest publicity they can buy. They noted that they have patents on the cam that predates Polaroid by a couple of years.
My (total) guess is that GoPro will threaten to invalidate Polaroid's design patent, and the parties will (eventually) settle.
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Fixed-Price - Entry Level ($) - Est. Budget: $15 - PostedSkills: Adobe Illustrator Graphic design Illustration
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text:
Archpriest Alexander Rentel, a 1995 M.Div. graduate of St. Vladimir's, finished his doctoral dissertation under the direction of Fr. Robert Taft, SJ, at the Pontifical Oriental Institute in Rome in January 2004. Prior to coming to St. Vladimir's as a professor, Fr. Alexander was a 2000-2001 Junior Fellow in Byzantine Studies at Dumbarton Oaks, Washington, D.C. He has taken numerous research trips to Greece, Italy, and France. He was ordained to the priesthood in July 2001. He and his wife, Nancy (née Homyak, M.Div. 1995) are the proud parents of three children, Dimitrios, Maria, and Daniel.
Additional information:
(914) 355-1470 – cell
alexander.rentel - Skype
(914) 961-4507 – fax
PONTIFICAL ORIENTAL INSTITUTE, Rome, Italy
Doctor in Scientiis Ecclesiasticis Orientalibus, Summa Cum Laude 2004
Faculty of Eastern Christian Studies, Liturgical Section
Dissertation topic: "The 14th Century Patriarchal Liturgical Diataxis of Dimitrios Gemistos. Edition and Commentary"
Licentiate, Magna Cum Laude 1999
Faculty of Eastern Christian Studies, Liturgical Section
Thesis: "An Introductory Study of the Liturgical Diataxis of Dimitrios Gemistos"
MIDDLEBURY COLLEGE, Middlebury, Vermont
Intensive summer Russian language program 1995
ST. VLADIMIR'S ORTHODOX THEOLOGICAL SEMINARY, Yonkers, New York
Master of Divinity 1995
Thesis topic: "John VI Kantakouzenos and the Hesychast Councils of the Fourteenth Century"
THE OHIO STATE UNIVERSITY, Columbus, Ohio
Bachelor of Arts, English 1990
2006-2007 Lilly Research Expense Grant through The Association of Theological Schools for the project: "The Development of the Orthodox Prothesis Rite. Part I: the Diataxis Tradition"
2001 recipient of Dissertation Grant from Medieval Academy of America
2000-2001 Junior Fellow in Byzantine Studies, Dumbarton Oaks, Washington, D.C.
1997 and 1998 recipient of Summer Research Stipend from the Hilander Research Library/Resource Center for Medieval Slavic Studies, the Ohio State University, Columbus, Ohio
Member: Society of Oriental Liturgy
Ancient, Biblical, and Byzantine Greek, French, German, Italian, Russian
I am interested in the interpretation and application of canon law. I am in the midst of considering various questions on the status of those outside the canonical limits of the Church. I am working slowly on a book on the so-called Diataxis of Philotheos Kokkinos and another on the Diataxis of Dimitrios Gemistos.
Germack 03
914.961.8313 x369
[1] http://www.svots.edu/sites/default/files/images/profiles/fr_alex.jpeg
[2] http://www.svots.edu/sites/default/files/alexander_rentel_cv.pdf
[3] mailto:firstname.lastname@example.com