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Mar 1
Jan 26
The traveling minstrel from Syracuse, NY heads to the Flying Monkey in Plymouth, NH to regale it denizens with his eclectic, folksy, blues style.
Dec 21
Oct 19
Oct 19
Bobby Yang guest solos with The Alternate Routes at the Quick Center!
Bio: The Alternate Routes' name suits them well. Without a definitive genre to reference or an established scene to rally behind them, they are something of a rogue wave in an ocean of bands. They've built a fan base the old-fashioned way: driving around the country in a big, white Ford Econoline van ...See Full Bio


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iHerb 顾客评论
2 个顾客认为以下的评论有帮助
5572549375743988355发表于 Jun 25, 2014
Very good texture, taste. easy to use as spread or to turn into milk. highly recommended!
1 个顾客认为以下的评论有帮助
Reviewer1533331发表于 Sep 25, 2014
This product is very smooth and less bitter than other hemp seed butter. The jar is teensy though.
Love it!
1 个顾客认为以下的评论有帮助
Reviewer1922848发表于 Feb 03, 2014
I like the taste, texture and the fact it is so healthy!
1 个顾客认为以下的评论有帮助
5219788476217161666发表于 Mar 04, 2014
great for desserts, salad dressing, even mixing it with chocolate & dried coconut dessert balls, healthy too
Addicted to it!
5204196752948176147发表于 Feb 26, 2015
I love this spread. It's a great substitute for any nut butter. Spreads easily, has a nice nutty taste. I love it on my bread or in my yoghurt.

subset: commoncrawl


text:
Unbox suffers "teething" issues
updated 04:35 pm EDT, Fri September 8, 2006
Unbox suffers "teething"
Amazon's new Unbox video store has marked the highest-profile movie download launch thus far, but poses some significant quality issues and "teething" problems, according to various members of the press. CNET's Tom Merritt says purchases require intrusive and imperfect custom Amazon software to work, while underlying issues potentially hurt the long-term success of Unbox Video, according to BusinessWeek. Aside from the common but glaring inability to burn to DVD, rental restrictions are especially limited, according to Electronista: rented movies must be played in their entirety 24 hours after playback begins, or they must be rented a second time. Amazon additionally suffers from the longer-term conflict of interest that might arise from its existing movie sales; as it benefits from purchases of physical DVDs, the online retailer has little incentive to extend its usage rights or lower prices.
Apple is expected to unveil its own movie offering in the near future, and recently released a new iMac with high a enough screen resolution to play HD video without downsampling. Industry watchers also expect the Cupertino-based company to produce a new widescreen video iPod in the near future -- possibly at the company's upcoming special event scheduled for September 12th touting "one more thing" with an Apple logo amidst Hollywood spotlights.


text:
|Publication number
|Publication type
|Application number
|Publication date
|Mar 20, 2001
|Filing date
|Jun 30, 1999
|Priority date
|Jul 31, 1995
|Fee status
|Also published as
|Publication number
|Kenneth B. Gilleo, Konstantine Karavakis
|Original Assignee
|Tessera, Inc.
|Export Citation
|BiBTeX, EndNote, RefMan
|Patent Citations (41), Non-Patent Citations (3), Referenced by (68), Classifications (10), Legal Events (5)
|External Links: USPTO, USPTO Assignment, Espacenet
The present application claims benefit of U.S. Provisional Application Ser. No. 60/001,669, filed Jul. 31, 1995.
The present application is a divisional of U.S. patent application Ser. No. 08/777,307 filed Dec. 27, 1996, now U.S. Pat. No. 5,971,253, which in turn is a continuation of U.S. patent application Ser. No. 08/681,847, filed Jul. 29, 1996, now abandoned.
The present invention relates to components and methods for making connections in microelectronic devices.
Microelectronic devices such as semiconductor chips require large numbers of electrical connections in a small area. For example, a complex semiconductor chip may have hundreds of contacts for signal input and output and for power supply, all within an area of a few cm2. These contacts must be reliably connected to corresponding contact pads on a substrate such as a chip mount, circuit panel or multichip module. The connection between the chip and the substrate must meet numerous, often contradictory requirements and desires. It should be low in cost, and yet highly reliable. It should require only the minimum amount of area on the substrate. Ideally, the connected chip should be accommodated in an area of the substrate approximately equal to that of the chip itself. The connections should be robust and capable of withstanding repeated changes in the temperature of the chip and the substrate, and the associated differential thermal expansion and contraction of the chip and substrate. Moreover, the connection systems should not impose unusual or costly requirements in fabrication of the chip or substrate. The connection system desirably should facilitate testing of the chip, and the connection system itself, before the chip is finally assembled to the substrate. All of these considerations, taken together, represent a formidable engineering challenge. These considerations are present, to a greater or lesser degree, in other connections used in microelectronic devices as, for example, connections between substrates or circuit panels.
Numerous solutions to these problems have been proposed heretofore. One common method of making connections to a semiconductor chip or a similar device is wire bonding. In wire bonding, numerous fine wires are connected to the contact pads of the chip and extend outwardly, over the edges of the chip, to corresponding contact pads on a substrate. The process requires individual connections of each contact on the chip and also requires an area of the substrate substantially larger than the chip itself. In a further method referred to as tape automated bonding or "TAB", fine metallic leads are disposed on a polymeric tape. The leads may be connected individually or en masse to the contact pads of the chip and to the contact pads of the substrate. This method also requires a substantial area of the chip substrate surface. In so-called "flip-chip" bonding, the front or contact-bearing surface of the chip faces downwardly to the substrate, and each contact on the chip is connected to the corresponding contact pad on the substrate by a solder column. This method can mount a chip in an area of the substrate substantially equal to the area of the chip itself, but suffers from drawbacks such as poor resistance to thermal cycling, cost and process difficulties.
Numerous other chip mounting methods have been proposed. For example, Patraw, U.S. Pat. Nos. 4,695,870 and 4,716,049 disclose a package for a microelectronic chip utilizing hollow metallic "compressive pedestals" engaged between the chip and the substrate and making a spring-loaded electrical connection. McMahon, U.S. Pat. No. 5,321,583, discloses a second level interconnect, i.e., an interconnect arranged to connect an already packaged device to a circuit panel. This interconnect uses apparently solid metallic spheres disposed between the package and the circuit panel and an external spring to maintain engagement of all of the components. Tsukagoshi et al., U.S. Pat. No. 5,120,665, discloses an isotropic electrically conductive adhesive with numerous deformable electroconductive particles disposed therein. The particles may include a polymeric core with a thin metallic layer, typically less than about 1 micron thick. These particles are distributed at random between a chip and a substrate, so that those particles which are engaged between contacts of the chip and contact pads on the substrate will permit electrical conduction between the so-engaged pad and contact. As noted in International Interconnection Intelligence Flip Chip Technology Impact Report, pp. 3-79 to 3-80, a Seiko Epson Corporation process uses gold plated resin balls mixed with adhesive and printed onto a substrate contact. The substrate is then engaged with a chip and secured by a separate adhesive. Despite these efforts in the art, still further improvement would be desirable.
One aspect of the present invention provides methods of making microelectronic element assemblies. Methods according to this aspect of the present invention desirably include the steps of providing a plurality of deformable, electrically conductive elements, each such element including a thin, flexible metallic shell extending over at least a portion of the surface of the conductive element, and connecting the conductive elements to contacts on the microelectronic element so that the metallic shells are exposed, and then connecting the microelectronic element to a substrate by bonding the shells of the conductive elements to contact pads on the substrate. Because the shells are flexible, they can deform as the test probes engage the shells. The shells therefore can compensate for deviations from perfect planarity of the microelectronic element, of the shells themselves, or of the substrate. This helps to assure reliable engagement between the contact pads on the substrate and the shells. The method according to this aspect of the invention may also include the step of testing the microelectronic element prior to substrate bonding by forcibly engaging the substitute contact pads, or pads of a test probe, with the exposed shells and applying signals to the microelectronic element through the engaged robes and shells.
Each shell may be in the form of a hollow spheroid such as a hollow sphere. Each conductive element may incorporate a mass of a flexible, compressible polymeric material such as an elastomer inside the spheroidal shell. The polymeric material may itself be in the form of a hollow spheroid, such as a hollow polymeric sphere. Alternatively, each shell may be empty. The shells may be bonded to the contacts of the microelectronic element before or after engagement to the substrate, as by forming a metallurgical bond, by soldering, brazing, diffusion bonding, eutectic bonding or similar methods. These bonding methods may be performed using bonding materials carried by the shells themselves.
In a method according to a further embodiment of the invention, each conductive element incorporates a soft, electrically conductive material such as a conductive polymer, partially cured or uncured conductive adhesive or the like, extending outside of the shell. Thus, each shell may be in the form of a dome-like cap overlying one end of a soft conductive element. These conductive elements can be engaged with the contacts of the microelectronic elements so that the soft conductive materials bears of the contacts and is bonded thereto, whereas the dome-like shells project away from the microelectronic element. For example, the conductive elements can extend through holes in a dielectric sheet having a first side and a second side, with the soft conductive elements being disposed on the first side and the dome-like shells protruding outwardly from the second side. The entire sheet, with the conductive elements thereon, can be juxtaposed with the microelectronic element so as to engage all of the contacts on the microelectronic element with the conductive elements carried by the sheet simultaneously. Conductive elements incorporating the spheroidal shells discussed above may also be provided within holes of a dielectric sheet. Desirably, each such spheroidal element protrudes beyond each of the first and second surfaces of the sheet, so that numerous spheroidal shells can be engaged with numerous contacts on the microelectronic element simultaneously by juxtaposing the sheet and the microelectronic element.
Further aspects of the present invention provide components for connecting microelectronic elements. Connection components according to this aspect of the invention desirably include a dielectric sheet having first and second surfaces and having holes extending between the surfaces, and also include electrically conductive elements, one such electrically conductive element being disposed within each such hole. Preferably, the sheet is flexible. Each such conductive element includes a thin, flexible metallic shell exposed at the second surface of the dielectric sheet. In one embodiment, each such shell is spheroidal and is exposed at the first surface of the dielectric sheet. Desirably, each such spheroidal shell protrudes beyond the surfaces of the sheet at both surfaces. Each such shell may be hollow and may include a polymeric material disposed within the shell. Such polymeric material may itself be in the form of a hollow spheroidal body. The polymeric material may be soft and flexible. Each such shell may include interruptions extending through its wall. Such interruptions are provided to permit movement of the interior polymeric material during compression of the shell. Preferably, each such shell is less than about 10 microns thick, and may be formed by processes such as electroless plating, electroplating or sputtering on the polymeric material. The shells may be formed from metals such as gold, nickel, copper, titanium and alloys and combinations thereof, and may include shape memory alloys, commonly referred to as superplastic materials. Electrically conductive bonding materials desirably overlie each shell.
Alternatively, each conductive element may incorporate a mass of a soft, electrically conductive material disposed in each hole of the sheet and extending to the first surface thereof. Where such a soft electrically conductive material is employed, each shell may be either a spheroidal shell seated in the soft material or a convex, dome-like shell capping the conductive material at the second surface of the sheet.
Still further aspects of the present invention provide methods of making connection components.
These and other objects, features and advantages of the present invention will be more readily apparent from the detailed description of the preferred embodiments set forth below, taken in conjunction with the accompanying drawings.
FIG. 1 is a diagrammatic sectional view depicting a component in accordance with one embodiment of the present invention together with a microelectronic device.
FIGS. 2 and 3 are similar to FIG. 1, but depict the component and microelectronic element at later stages of the connection process.
FIGS. 4, 5 and 6 are views similar to FIG. 1, but depict components according to further embodiments of the invention.
FIG. 7 is a fragmentary of a sectional view on an enlarged scale depicting a portion of a component according to a further embodiment of the invention.
FIG. 8 is a fragmentary, diagrammatic sectional view depicting portions of a component according to FIGS. 1-3.
FIGS. 9a and 9 b are fragmentary perspective views depicting portions of components according to further embodiments.
FIG. 10 is a diagrammatic perspective view of an assembly in accordance with a further embodiment.
FIG. 11 is a diagrammatic sectional view along lines 11—11 in FIG. 10.
As shown in FIG. 1, a connection component 20 in accordance with one embodiment of the present invention incorporates a dielectric sheet 22, such as a sheet of a flexible but substantially inextensible material such as a polyimide about 15 to about 30 microns thick. Connection component 22 has holes 24 disposed in a regular, predetermined pattern. Each hole 24 has an electrically conductive element 26 disposed therein. As best seen in FIG. 8, each conductive element 26 incorporates a flexible body 28 covered by a thin, flexible conductive shell 30. In the embodiment illustrated, each body 28 is in the form of a hollow sphere. Flexible body 28 may be formed from essentially any flexible polymer which is compatible with the manufacturing process used to fabricate the system and which does not cause corrosion or other adverse reactions with the surrounding components during use. Preferred polymers include thermoplastics such as polystyrene, polyethlyene, acetal, polybutadiene and polyetherimide and thermosets such as epoxies and polyimide. Elastomers and gels such as silicone elastomers, silicone gels, and other natural and synthetic elastomers can be used. Each polymeric body desirably has a diameter between about 50 and about 150 μm. The wall thickness of the body is selected depending upon the properties of the polymer to provide a body flexible enough to deform as described below under relatively low loads, so as to avoid imposing damaging stresses on other components. For relatively soft polymers such as elastomers, gels and the softer thermoplastics, the wall thickness may be so great that the body is entirely solid.
Each shell 30 is formed from a highly conductive material suitable for making connections to semiconductor chips. Metallic conductive materials are particularly preferred. Particularly preferred metallic conductive materials include gold, silver, platinum, nickel, palladium, copper, titanium and alloys and combinations thereof. The shell may be formed in a single layer of uniform composition, in multiple layers of different compositions or as one or more layers having progressively graded composition. The shell may be formed on the exterior of the polymeric body 28 by conventional metal deposition processes such as sputtering, chemical vapor deposition, plasma enhanced chemical vapor deposition, electroless plating and electroplating. Particularly preferred metals for the shell include gold, nickel, copper, titanium and alloys and combinations thereof. Gold is especially preferred. The shell preferably is less than about 3 microns thick, and more preferably between about 1 and about 2 microns thick. Alloys of the type referred to as "shape memory" alloys, also known as superplastic alloys may be employed. These alloys provide good deformability and fatigue resistance during service. However, they generally relatively low electrical conductivity. Where a shape memory alloy or other material of low conductivity is employed for part of the shell, a further layer should be provided on the outside of such material, the further layer including a highly conductive material such as copper or, more preferably, gold.
As illustrated in FIG. 9a, each shell 30 has interruptions formed therein at random locations on its surface. The interruptions desirably are relatively small in comparison to the radius of the shell. That is, each interruption preferably is a spot having a diameter less than the radius of the shell and preferably less than about half of the radius of the shell. Alternatively, the interruptions may be formed as slits 34 (FIG. 9b) through the shell. Holes 32 can be formed by passing the shells, at random orientation, through one or more pulsed radiant energy beams, such as KrF excimer laser beams. For example, the conductive elements, with the shells thereon, can be poured repeatedly through a confined space while directing the radiant energy beams into the space. The actual location and formation of the openings on each sphere are random, and the number of openings formed in each sphere are also theoretically random in this process. Slits 34 can be formed after the conductive elements are positioned in the holes of dielectric sheet 22. Thus, the radiant energy beam may be scanned across the surface of the sheet and pulsed upon reaching each conductive element. This places a preselected number of interruptions in each shell at preselected locations relative to the dielectric sheet. Regardless of the method used to form the interruptions in the shell, it is preferred that the shell remain continuous. That is, each portion of the shell surface desirably remains connected to each other portion of the shell surface by a path leading across still other portions of the shell surface.
The conductive elements are mounted in holes 24 by any suitable mechanical means as, for example, by rolling a large number of conductive elements over the surface of the sheet so that one conductive element becomes lodged in each hole, removing any excess conductive elements and then forcing the conductive elements downwardly into the holes, as by pressing the conductive elements with a flat platen while supporting the dielectric sheet on a platen having holes aligned with the holes in the dielectric sheet. After assembly, each conductive element extends entirely through dielectric sheet 22, from the first surface 34 of the sheet to the second surface 36, and each conductive element protrudes slightly from each surface of the dielectric sheet.
Each conductive element 26 is provided with an electrically conductive bonding material 38 covering the portion of shell 30 exposed on the first surface 34 of the dielectric sheet, and with a similar conductive bonding material 40 covering that portion of the shell exposed on second surface 36. Conductive bonding material 38 may be essentially any conductive bonding material capable of forming an electrically conductive bond between the shell and the mating contacts and contact pads. Bonding materials 38 and 40 may be the same or different. Preferred bonding materials include diffusion bonding alloys, eutectic bonding alloys, solders, brazing alloys and conductive materials incorporating polymers, such as inherently conductive polymers, thermoplastic polymers with small particulate conductive additives and thermosetting polymers with particulate conductive additives. The bonding materials may be applied after assembly of the conductive elements to the dielectric sheet, by conventional processes commonly used to deposit such material such as selective electroplating, silk screening or stenciling. The location of the bonding material on each conductive element is not particularly critical, although it should extend over the point of maximum protrusion from the dielectric sheets and should not extend to the next adjacent conductive element. Alternatively, the bonding material can be applied onto the outer surface of the shells before the conductive elements are assembled to the dielectric sheet.
In an assembly process according to a further embodiment of the invention, connection component 20, including the dielectric sheet 22 with the conductive elements 26 thereon is juxtaposed with a microelectronic device 42 such as a semiconductor chip having contacts 44 disposed in a preselected pattern on its front or contact-bearing surface 46. Contacts 44 are connected to the internal components (not shown) of element or chip 42. Each contact 44 may be provided with a "bump" or coating 48 of a material such as gold adapted to facilitate bonding of the contact by the bonding material carried on the conductive elements 26. The pattern of contacts 44 on surface 46 corresponds to the pattern of holes 24 and conductive elements 26 extending through the dielectric sheet 22. However, the connection component may include some excess conductive elements. For example, the contacts of the chip may be disposed at some locations of a so-called "area array" or regular grid pattern, whereas the conductive elements 26 of the connection component may be provided at all locations of the grid pattern. Thus, the same type of connection component can be used for different chips having contacts at different selected locations of the grid.
The dielectric sheet is juxtaposed with microelectronic device 42 so that one hole, and hence one conductive element 26, is aligned with each contact 44 of the device, whereupon the connection component and microelectronic device are engaged with one another so as to engage one conductive element with each contact on the device. The connection component may be aligned with the microelectronic device using conventional techniques such as are commonly employed to align semiconductor chips with automated bonding tapes or substrates, such as machine-vision systems, manual alignment using a microscope or the like. After alignment, the conductive elements 26 can be engaged with contacts 44 by pressing the conductive elements against the contacts. As illustrated in FIG. 2, the conductive elements can be engaged with individual contacts 50 of a test fixture 52. The contact pads 50 of the test fixture are also arranged in a pattern corresponding to the pattern of conductive elements and contacts, such as the regular grid pattern mentioned above. The microelectronic device and test fixture are advanced toward one another and held in position by a clamp or fixture (not shown), so that each conductive element 26 is engaged between one contact 44 on the device and one contact 50 on the test fixture. In this condition, neither the conductive elements 26 nor the dielectric sheet 22 of the connection component 20 is bonded to the microelectronic device. Rather, electrical connections are established by the forcible engagement between contacts 24, conductive elements 26 and contact pads 50.
Both the flexibility of sheet 22 and the flexibility of the shells 30 facilitate simultaneous engagement of all of the chip contacts and all of the contact pads 50. Thus, sheet 20 can bend to accommodate conditions where the contacts 44 and contact pads 50 are not precisely coplanar. Each conductive element 26, and hence each shell, is deformed slightly by engagement with the mating contact and contact pad. The flexibility of the shell compensates for differences in the vertical distances between device contacts 44 and test fixture contacts 50. Such differences may be caused by differences in the heights of the contacts, and differences in the diameters of the conductive elements themselves. Because the system can compensate for such differences, all of the conductive elements can be reliably engaged with the chip contact and test fixture contact pads. During such engagement, the microelectronic device 42 may be actuated by supplying signals, power or both through the test fixture. Such actuation may include a short term test, and may also include long-term operation or "burn-in". This test actuation detects both defects in the microelectronic device and defects in the connection component 20, such as missing or defective elements 26.
Following test, the test fixture is removed. As shown in FIG. 3, a substrate 54 having contact pads 56 in a similar regular pattern is engaged with the connection component and a microelectronic element. The contact pads 56 of the substrate may be formed from a material adapted for bonding with the bonding materials carried on the connection component, and may have a coating 58 of a material adapted to facilitate such bonding. For example, where the contact pads are formed from copper, and the bonding material 40 (FIG. 8) on the second surface 36 of the component is a diffusion bonding alloy, pad 56 may be provided with a coating 58 formed from gold or other diffusion bondable metal. Pads 56 are connected to conductors (not shown) within the substrate. Substrate 54 may be a circuit panel; a chip mounting, or an active microelectronic device. For example, both device 42 and substrate 54 can be semiconductor chips, so that the mounting serves to interconnect the chips to one another. Alternatively, substrate 54 may be a circuit panel incorporated in a so-called "multichip module" and may have connections for mounting other microelectronic devices such as additional chips, as well as internal circuitry (not shown) connecting the various elements mounted to the substrate.
Substrate 54 and microelectronic device 42 are urged together by conventional means such as clamping platens (not shown) and the bonding materials 38 and 40 (FIG. 8) are activated simultaneously, as by heating. Here again, the flexibility of dielectric sheet 22 and the deformability of the shells and conductive elements provides good engagement for all of the contact pads and contacts. Thus, even where both the microelectronic element 42 and substrate 54 are rigid elements, and even where the contacts of the chips and/or the contact pads of the substrate are slightly out of plane or of different heights, good connections can be made to all of the chip contacts. The bonding material disposed at the first surface 34 of the dielectric sheet forms bonds between the device contacts 44 and the conductive shells, whereas the bonding material on the of the second side 36 of the dielectric sheet forms bonds between the substrate contact pads 56 and the shells of the conductive elements. This establishes a permanent electrical connection between each contact of the microelectronic and the corresponding contact pad on the substrate. After bonding, a compliant dielectric encapsulant 60 is injected between the microelectronic device and dielectric sheet 22 and between the dielectric sheet and the substrate. The dielectric encapsulant may be a curable liquid material such as a silicone elastomer or gel. It is injected in liquid form and then cured to provide a permanent environmental seal.
The finished assembly provides reliable low-impedance connections between the chip and the substrate, in an area of the substrate no larger than the chip itself. Moreover, it provides good resistance to thermally-induced stresses. Because each conductive element 26 is flexible, it can deform to permit relative motion of the device contact 46 and substrate contact 56 bonded thereto. For example, where differential thermal expansion of the device and substrate cause movement in the horizontal or x-y directions parallel to the contact-bearing surfaces of the microelectronic element (to the left and right as seen in FIG. 3), the conductive element, including its metallic shell can deform slightly. Also, if thermally induced stresses cause warping of the device, the substrate or both, dielectric sheet 22 can flex. Also, each conductive element can be compressed or elongated somewhat in the vertical directions, normal to the surfaces of the chip and substrate (upwardly and downwardly in FIG. 3) so as to permit relative movement over a limited range, sufficient to compensate for warpage.
The interruptions 32 or 34 (FIGS. 9a and 9 b) in the shells permit the polymeric core 28 (FIG. 8) to bulge outwardly as the shell is compressed, thereby relieving internal pressure which might otherwise tend to rupture the shell. Also, they reduce the spring constant of the shell and hence permit deformation with relatively low forces.
In a variant of the method discussed above, substrate 54 itself is used as a test fixture and hence test fixture 52 (FIG. 2) is not employed. In this variant, the chip and substrate are brought together, with connection component 20 disposed therebetween, so that each conductive element 26 is compressed between the associated device contact 44 and substrate contact pad 56. At this stage of the process however, the bonding materials are not activated, so that the contacts are maintained only under mechanical pressure. The microelectronic device and substrate may be actuated and tested. If they prove satisfactory, the bonding materials may then be activated to form a permanent bond, and the encapsulant may be injected. In a further variant of this process, the device and substrate are held against one another in the same manner and, after optionally testing the assembly, the encapsulant is injected and cured while maintaining the force of engagement between the device and substrate. After the encapsulant is cured, the externally applied forces are released, and the encapsulant holds the assembly together. Each conductive element 26 tends to return to its original shape under the influence of its own resiliency. However, because the encapsulant holds the device and substrate in position relative to one another, each conductive element is retained in a compressed condition and bears effectively on the device contact and substrate contact pad. This creates a permanent mechanically engaged connection. The bonding materials are omitted in this variant.
As illustrated in FIG. 4, a connection component 120, having conductive elements 126 similar to those discussed above, may be permanently mounted to the microelectronic device 142 to form a subassembly, which is then engaged with a substrate, such as the substrate discussed above, and attached thereto. Thus, the dielectric sheet 122 overlies the contact-bearing surface 146 of the device, and each conductive elements 126 of the connection component is electrically connected to one contact 144 of the device. The connection component may be secured to the device by a layer of an adhesive 161, which may incorporate an anisotropic conductive adhesive in the vicinity of the contacts to make the electrical connection between the shell of the conductive element and the various contacts. Alternatively, a bonding material on the portion of the conductive element facing towards the device contact may be activated to bond each conductive element to the associated device contact. Thus, the conductive elements are bonded to each device contact before the substrate is assembled. After assembly of the substrate, the substrate contact pads are bonded to the conductive elements. The conditions used to activate the bonding material for bonding the substrate should not disturb the bonds previously made with the contact pads 144. Thus, the bonding material applied to the conductive elements 126 on the first or device side 134 may be a relatively high-temperature solder or diffusion bonding alloy, whereas the bonding material applied to the conductive elements on the second or substrate side 136 may be a relatively low-temperature solder or bonding alloy. Also, the bonding material on the second or substrate side may be applied after assembly of the connection component 120 to device 142. In a further variant, the bonding materials may be provided on the device contacts, on the substrate contact pads, or both, so that the corresponding bonding materials need not be applied on the connection component. In yet another variant, the material of the shell 30 itself may serve as part or all of the bonding material. For example, the shell may be formed in whole or in part from tin, so as to form an eutectic bond with mating gold contacts.
In the embodiments discussed above, the conditions used to activate the bonding materials typically include heat. The polymeric cores may melt or soften during the bonding process. Such melting or softening normally does not affect performance of the finished device. However, violent gas evolution from the polymeric body is not desirable. Preferably, the maximum temperature achieved during the bonding operation is below the heat deflection temperature of the polymeric core but above its Tg or glass transition temperature.
A connection component 220 (FIG. 5) according to yet another embodiment of the invention incorporates a dielectric sheet 222 having holes 224 therein and also having conductive elements 226 extending through each hole. Here again, each conductive element incorporates a shell 230. Each shell is aligned with one hole 224. Each shell 230 is not a closed, generally spheroidal shape. Rather, each shell is in the form of a spherical segment or hemisphere. Each such shell is disposed at the second or device side 236 of dielectric layer 220 and protrudes outwardly from such second surface. The convex surface 232 of each shell faces away from surface 236 and away from the dielectric layer 220, whereas the concave side 234 faces towards the dielectric layer and opens towards the associated hole 224.
A mass 228 of a soft, electrically conductive material is disposed within each hole and extends from each hole to fill the interior of the associated shell 230. Each mass 228 also extends from the first or device side 234. Thus, each shell 230 and mass 228 form a composite conductive element. Masses 228 may be formed from electrically conductive polymers such as inherently conductive polymers or polymers loaded with particulate conductive materials. Silver-filled flexible epoxies and flexible elastomers are preferred. Preferably, the soft conductive material is a curable material such as a partially-cured or "b-stage" epoxy or polyester resin loaded with silver or other conductive particles. The conductive masses 228 may be formed by silk screening or stenciling the conductive material. The shells may be formed by plating a metal onto the second side of the dielectric layer, and onto the exposed surfaces of masses 228.
In use, the component is engaged with a device 242, and the soft, conductive materials are bonded to the contacts 244 of the device. An encapsulant (not shown) may be injected between dielectric sheet 220 and the device. The resulting subassembly can be tested by engagement with a test fixture, such as test fixtures 52 (FIG. 2) or by engagement with a substrate under mechanical load. Shells 230 facilitate such testing. Typically, it is difficult to make effective contact with a solder or conductive polymer "bump". The metal of the shell desirable does not oxidize to an appreciable degree, and therefore provides a good surface for pressure contact engagement. Further, the component can be permanently secured to a substrate by bonding, using bonding materials carried either on the shell or on the contact pads as the substrate in the manner discussed above. The relatively soft conductive material masses 228 may have appreciable height, on the order of about 125 to about 175 microns, and therefore can flex to accommodate relative movement of the device contacts and substrate contacts.
The subassembly of FIG. 6 is generally similar to that shown in FIG. 5, except that each shell 330 is a spheroidal shell, similar to shells 30 discussed above. Each such hollow spheroidal shell may itself have a polymeric core 329, which in turn may be hollow or solid. Each such shell is continuous with a mass of soft conductive material 328 disposed within the associated hole in the dielectric sheet 320. Here again, the shell and the polymeric mass 328 form a composite conductive element extending through the dielectric sheet.
In the arrangement of FIG. 7, the dielectric sheet 420 is provided with metal-filled vias 421 extending between its first and second surfaces. The vias can be formed by conventional methods, such as laser ablation of the polymeric sheet to form a hole, electroless plating and electroplating to form a conductor extending entirely through the dielectric sheet. Continuous sheets of electrically conductive material such as copper 423 and 425 are provided on the first and second surfaces 434 and 436 respectively of the dielectric sheet. After formation of the vias and conductive sheets, small masses of a flexible polymer 428 and 429 are deposited on the vias by silk screening or stenciling a curable material or by other conventional depositing processes. Thin, flexible shells 430 and 431 are then formed by electrolessly plating the entire assembly to provide a "seed" layer on the surfaces of masses 428 and 429, and then electroplating a shell metal using conductive layers 423 and 425 to carry the plating current.
This forms a plurality of composite conductive elements, each including the thin, flexible shell 430 at one end, the conductive material 421 in the via and the thin flexible shell 431 at the opposite end. After the plating step, conductive layers 423 and 425 are etched so as to electrically isolate each composite conductive element from the others. The resulting connection component has the flexible shells protruding from both sides of the dielectric sheet. It can be used in substantially the same way as connection component 20 discussed above.
The roles of the device and the substrate in the embodiments discussed above can be reversed. That is, a subassembly of the connection component and the substrate can be fabricated, and then joined to the device.
As shown in FIGS. 10 and 11a, a connection component of 520 in accordance with yet another embodiment of the invention includes a polymer sheet 522 having holes 524 extending therethrough. Holes 524 may be about 0.012 inches (about 0.3 mm) in diameter. Here again, the dielectric sheet may be between about 25 and about 75 μm thick. A pad 523 is formed at each hole 524 on the second or substrate side 536 of the dielectric sheet. A composite conductive element 526 is provided by stenciling a small column or "mass" of a curable elastomeric material 528 on each pad 523, within each hole 524, so that the mass of compliant material 528 protrudes upwardly through the hole 524 and extends beyond the first or device side of 534 of the dielectric sheet. An electrically conductive shell 530 is formed over each mass 528 by masking the first surface 534 except at the holes 524, electrolessly plating and then electroplating. Pads 523 may be initially provided as a part of a larger, electrically continuous sheet or assembly, and this sheet or assembly may be used to convey the electroplating current. Following the electroplating operation, the sheet or assembly may be etched to separate the pads 523 from one another. Each shell 530 is electrically and mechanically connected to the associated pad 523.
This connection component can be used in conjunction with a chip or other device 542 and a substrate 554. The conductive shells 530 are bonded to the contacts 544 over the chip using bonding material carried out on the shells or on the contacts Pads 523 are connected to contacts 556 of the substrate. As seen in FIG. 11, each pad 523 may be bonded to the contact pads 556 of the substrate by a conventional solder bump 559. Some of the pads 523 are provided with leads 525 extending in the horizontal directions along dielectric sheet 522 to auxiliary bonding pads 527. These auxiliary pads are secured to the contact pads 556 of the substrate.
As shown in FIG. 10, connection component 520 is fabricated as a partial "fan out" structure. That is, the chip 542 conductive elements 526 and pads 523 are disposed in a central region of dielectric sheet 522 whereas at least some of the auxiliary pads 527 are disposed in a peripheral region of the sheet. Thus, leads extending from pads 523 to auxiliary pads 527 extend in outward horizontal directions, from the central direction to the peripheral direction. The contacts thus "fan out" away from the chip and away from the central region. This effectively expands the array of pads to an area larger than the area of the chip, and spreads the electrical pads out over a wider area. Thus, the connections to the substrate 554 can be made using conventional surface mount or other simple techniques. The reverse arrangement can be used to provide a "fan-in" effect. That is, some chips have contacts disposed adjacent the periphery of the chip. To provide a fan-in arrangement, pads 523 and conductive elements 526 can be disposed adjacent the periphery of the dielectric sheet, whereas the auxiliary pads 527 can be provided adjacent the center of the dielectric sheet.
Numerous variations and combinations of the pages discussed above can be utilized without departing from the present invention. For example, each conductive element can be mounted to the associated contact on the device or substrate without using a dielectric sheet as in the embodiments discussed above. Thus, a plate formed from stainless steel or other bonding-resistant material may be disposed over the contact-bearing surface of the chip. The plate has holes aligned with the individual contacts. The conductive elements, such as those discussed above, are deposited in the plate, and bonded to the contacts, whereupon the plate is removed. Also, although the assembly operations discussed herein have been discussed with reference to a single microelectronic device or semiconductive chip, they can be performed in a wafer scale arrangement. Thus, a connection component can be fabricated as a sheet large enough to cover an entire wafer containing numerous semiconductor chips. The conductive elements of the connection component may be connected to the contacts of all of the chips on the wafer. The dielectric sheet and the wafer may then be severed to provide units, each including a portion of the dielectric sheet and a single chip. Desirably, an encapsulant is injected between the dielectric sheet and the wafer prior to such severance.
As these and other variations and combinations of the features discussed above can be utilized without departing from the present invention as defined by the claims, the foregoing description of the preferred embodiments should be taken by way of illustration rather than by way of limitation of the claimed invention.
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|Molex Incorporated
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|Formfactor, Inc.
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|Cookson Electronics, Inc.
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|Sumitomo Electric Industries, Ltd.
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|Apr 28, 2005
|Sumitomo Electric Industries, Ltd.
|Method of manufacturing protruding-volute contact, contact made by the method, and inspection equipment or electronic equipment having the contact
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|Jun 23, 2005
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|Dec 1, 2005
|Atsuhito Noda
|Electro-formed ring interconnection system
|May 27, 2005
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|Atsuhito Noda
|Flexible scrub ring contact
|Sep 27, 2005
|Feb 2, 2006
|Formfactor, Inc.
|Helical microelectronic contact and method for fabricating same
|Feb 27, 2006
|Jun 29, 2006
|Formfactor, Inc.
|Layered microelectronic contact and method for fabricating same
|May 26, 2006
|Nov 30, 2006
|Volkan Ozguz
|Stackable tier structure comprising prefabricated high density feedthrough
|Sep 20, 2006
|Feb 15, 2007
|Volkan Ozguz
|Stackable tier structure comprising high density feedthrough
|Jan 25, 2007
|May 31, 2007
|Atsuhito Noda
|Flexible ring interconnection system
|Jun 11, 2007
|Oct 4, 2007
|Megica Corporation
|Method for fabricating thermal compliant semiconductor chip wiring structure for chip scale packaging
|Mar 26, 2007
|Dec 13, 2007
|Formfactor, Inc.
|Electrical Contactor, Espcecially Wafer Level Contactor, Using Fluid Pressure
|Aug 23, 2007
|Aug 7, 2008
|Tessera, Inc.
|Microelectronic packages and methods therefor
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|Mar 19, 2009
|Formfactor, Inc.
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|Oct 24, 2006
|Mar 26, 2008
|Irvine Sensors Corp.
|Stackable tier structure comprising an IC die and a high density feedthrough structure
|U.S. Classification
|International Classification
|Cooperative Classification
|European Classification
|Sep 11, 2001
|Certificate of correction
|Nov 27, 2001
|Certificate of correction
|Sep 3, 2004
|Fee payment
Year of fee payment: 4
|Sep 5, 2008
|Fee payment
Year of fee payment: 8
|Sep 14, 2012
|Fee payment
Year of fee payment: 12


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Gravity - Review and Discussion Thread
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October 18 2013, 09:24 PM
Rear Admiral
Location: the real world
Re: Gravity - Review and Discussion Thread
I always tend to think of "masculino-fascist" type of concepts as what you get when you have a right-winger embarrassed by their cherished reactionary illusions trying to sound leftish by trying to copy Marxism without ever, ever bothering to find out anything about it.
Then, when I see people trying to turn an internet post into a bloody shirt they wave around to inspire rage, I get queasy.
Material conditions determine ideas, not the other way around. There will never be any way to liberate humanity by persuading enough people to think differently. By now, every effort to do so betrays a commitment to backwards notions about souls and sin, however they may try to disguise them.
The people of this country need regime change here, not abroad.
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text:
PrideInn Sai Rock Beach Hotel
u Show map
2.6 / 10
Hotel description PrideInn Sai Rock Beach Hotel
Our whole staff would like to cheerfully welcome you to the PrideInn Sai Rock Beach Hotel. The PrideInn Hotels & Conferencing family happily welcomes you to the PrideInn Sai Rock Beach Hotel! Beach Hotels are easy to find, but they are not all created equal. Make the right choice and book a room at this quaint hotel to enjoy all of its features and benefits!
Our hotel offers ample free parking spots.
We provide guests with a complimentary bottle of water.
Make yourself at home
Our reception team is available day and night, we offer a wake-up call service as well as a safe for your valuables.
The knowledgeable team at the reception can provide you with more information on our in-house car hire service.
Bring the family - the hotel can always provide an extra bed and the children will have an enjoyable time in our safe play area.
Culinary greetings from the kitchen
Indulge in a refreshing drink at the pleasant hotel bar. But first fill your stomach at the restaurant that also serves vegetarian meals.
Where you will stay
You'll find a minibar filled with a large quantity of beverages in your hotel suite as well as a strong box, a convenient phone and a writing table. Our hotel also provides you broadband internet access in the air-conditioned suites. Guests of our hotel appreciate the in-room entertainment provided by their own TV set (with cable TV). Satellite TVs are provided in each of the hotel rooms. Rooms come with coffee making utensils.
In your room's bathroom you'll find a shower as well as a hand-held hair-dryer. Every bathroom has a bathtub for your convenience.
At the hotel you'll always have a tower. The rooms, too, have a great mobile connection.
Relax or be active
Our sauna and steam bath are a big hit among our guests. The indoor pool at the hotel as well as the one outside also make for a fun-filled time. Energetic guests can take advantage of the well-equipped fitness room.
You can book a beauty treatment in our hotel. Enquire about our massage and treatment options.
Diving tours are run from our hotel.
Reception hours
On business days 24 hours
Check-in time:12:00
Check-out time:11:00
Like this hotel?
Then save it in your bookmarks.
u Show map
Diani Beach Road, 99160-80107 Mombasa, Kenya
Distances (km)
|Metro / suburban train
|City district (Mombasa)
|Airport (Mombasa Moi International Airport (MBA))
|Airport (Malindi Airport (MYD))
For HOTEL INFO guests
Pay TV for free
Upgrade to higher room category
Late Check-Out
Parking spaces at the hotel
Free WI-FI
Hotel features
- Single rooms: 81
- Double rooms: 81
- Suites: 4
- Apartments: 18
- Wellness
- TV room
- Business Centre
- Swimming pool (indoor)
- Playground
- Safe at reception
- Swimming pool (outdoor)
- Mobile phone reception
- Laundry service
- Car hire
- Bus stop near the hotel
Room features
- Desk
- Centrally-managed air-conditioning unit
- Telephone
- Satellite TV
- Non-smoking room
- Mini bar
- Safe
- Trouser press
- Air conditioning
- Hairdryer
- Coffee maker
- Bathtub
- Cable TV
- Shower
Sport/leisure activities
- Fitness room
- Hairdresser
- Sauna
Accepted credit card payments
- AmericanExpress
- DinersClub
- MasterCard
- Visa
Hotel location
|15.54 km/9.7 mi
|3 km/1.9 mi
|no details


text:
Hilary Swank or Jon Bon Jovi?
I don't care what anyone says, I think she's hot.
Somewhere her agent is still putting up missing person flyers.
Make all the snarky comments you want, but Bruce Jenner's transformation turned out really well.
Always had a great ass…..her face, its another story
…great tits too, don't forget …and you'd be surprised, in person, she's actually really attractive.
Wow, it's Paris and there's no shit on her shoe.
A little late to the 'chicken go like dis' party.
Haven't seen much of her in a while…business must be good blowing dictators.
I've always found her very attractive. Nice ass.
I would bet she's much prettier in person than she is on film.
Urgh, it's that transvestite from the bar last night who turned out didn't have a penis. Look away.
I think she is damn fine looking, although the swimsuit pics are more appreciated.
Always been a fan.
Great ass!


text:
Looking for a Used 560-Class in your area?
CarGurus has 57 nationwide 560-Class listings and the tools to find you a great deal.
Have you driven a 1990 Mercedes-Benz 560-Class?
Average User Score
4.6 ⁄ 5 stars
Based on 16 reviews
1990 Mercedes-Benz 560-Class Overview
Overall User Score
Based on 16 reviews
If you've ever driven one of Mercedes' large luxury coupes or sedans, such as those of the 560-Class, you know what to expect. The cars feel as if they were carved from a block of granite, they're that solid. Everything is so well made that at times they feel over-engineered, but that's not necessarily a bad thing. They are vehicles that must be driven to be truly appreciated.
For 1990, the Mercedes-Benz 560-Class cars - the 560SEL Sedan and 560SEC Coupe - sat at the top of the automaker's offerings, and indeed, at the top of the car-making world. Little else on the road could approach the style, power, and luxury of these cars, save a few of the exotic automobiles out of Italy.
The SEL and SEC were powered by a 5.6-liter V8 that produced 238 hp, and was coupled with a 4-speed automatic transmission. Standard equipment included leather seats, power windows, power door locks, anti-lock brakes, air conditioning, heated front and rear seats, automatic climate control, cruise control, headlight cleaners, and much more.
What's your take on the 1990 Mercedes-Benz 560-Class?
Mercedes-Benz 560-Class Questions
Head Bolt Torque?
1990 Mercedes 560 Sel Won't Start.
I was driving along and the car just stalled. It's a 1990 560 sel. The vehicle will not start now. I am getting fuel to injectors. I pour gas into intake and it will not run.i have spark. The vehi...
1990 560 Sel Will Not Start. Not Getting Fuel To Engine
I have a 1990 560 sel. Vehicle wil not start now. Not getting fuel to engine. I pour gas into intake and it will run. Fuel pumps or relay fuse need replacing??
I Desperately Need A Grille For A 1990 560 Sec. Anyone Know Where I Can Get...
Bottom Bolt Om Water Pump Replacement , Best Way To Remove And Procedure?
water pump replacement instructions.


text: I grew up in Marin County riding my whole life (35yrs old). I've owned 25 bikes but none in the last 5 years. Just borrow buddies bikes to ride. I'm thinking if I spend $500-700 for a good used bike I can get a bike that was $1000+. I don't want anything older than 2004...What brand should I get and is ebay worth checking? My problem is I don't know anything about todays components.


text:
The Impact of Social Values on the Psychology of Gender among Arab Couples: A View from Psychotherapy/Commentary
Abu-Baker, Khawla, Al-Solaim, Lamis S., The Israel Journal of Psychiatry and Related Sciences
Khawla Abu-Baker, PhD
Department of Behavioral Science, Emek Yezreel College, Israel
Abstract: Three major psychosocial conditions have an effect upon the establishment of psychological problems within individuals and in the relationship of couples in the Arab family: (a) gender-dependent assessment of emotions, i.e., holding two different unequal yardsticks for two highly-genderized value systems; (b) imposing conflicting value demands on women; (c) glorifying and giving much respect to the notion of women's suffering in silence, a state described here as the "Mastoura" (tight lipped) woman, equivalent to the "learned helplessness" state. This article will also focus on the common forms of the manifestation of psychological or marital problems: sexual dysfunctions, somatic behavior and the usage of metaphoric language of psychosomatics. The article presents frequent complaints of couples who seek marriage therapy and the characteristics of each group.
Although Arab societies vary in their structure and their complexity and even though what has been termed the "changing family" has begun to emerge, it is still possible to generalize and say that Arab family declared values have remained essentially traditional. These values emphasize the collective, the family and an agreed-upon structure whereby preference is given to males and to age (1, 2). Hence, despite the techno-economic changes currently impinging upon the entire Arab world, modern patterns developing within Arab societies are rebuilding and recreating the structure and function of the hamula or extended family, often with semi-modern embellishments (see also 3).
This paper is based on content analysis of 90 cases of couples who sought therapy or counseling during five years (1999-2004). It will try to analyze: (a) the clients' reasons for seeking therapy, (b) the clients' complaints about their partners, (c) the clients' suggestions for improving their situation, and (d) the reactions of the significant others to the clients' problems. All categories suggested were used by the clients themselves.
Three major trends in the values underlying the psychosocial structure have a direct effect upon the emergence and establishment of emotional problems. The impact of these trends crosses individual and demographic lines and can be seen among all couples. The trends are as follows:
Gender-dependent assessment of emotions in the Arab family
Arab society and the Arab family relate to the feelings of men and of women using two different yardsticks. Females are encouraged to express emotions that elicit support and reflect weakness, such as fear, unhappiness and helplessness. Men, on the other hand, are encouraged to express emotions that encourage action, such as anger, anxiety and revenge (4, 5). During the socialization process, members of each gender group learn to adhere to those emotional behaviors that have been designed for them and that indeed mold them into who they are. For either gender group, crossing the boundaries occasions harsh social sanctions.
The differential psychosocial value applied to a husband's emotional grievances and those of his wife have led to the development of two versions of social therapy for such grievances, one for each gender group. Both the attitude taken toward a problem and the type of support provided differ depending upon who is seeking help. Women seeking support are given sympathy and are thought of as unfortunate creatures in need of protection from their parents or their extended families, but are rarely afforded any other response. In contrast, when men seek help, the response is usually to bring about a rapid change in the circumstances that led to his distress. For example, if a man complains about emotional anguish because his wife refuses to have sexual relations with him, the social group surrounding him will intervene and try to change his wife's behavior. If that does not succeed, he will be helped to divorce her and to marry another woman in order to fulfill his right to sexual satisfaction. …


text:
KCSO probing disappearance of man last seen in March
The Knox County Sheriff's Office is requesting information from the public about a man who has been missing since mid-March.
Adam Dewberry, 34, was last seen on March 13 withdrawing money from an ATM inside a Knoxville Walmart, according to the Sheriff's Office.
He left his Old Maynardville Highway home on March 7 to go camping, and was supposed to have returned home on March 9. He told his landlady he was going camping, but gave no specific destination, according to a KCSO report.
Dewberry left with a backpack, propane heater, tent and other camping gear. He was driving a 1999 Mazda Protégé, gold in color but with the left front fender painted brown. The vehicle has a Tennessee tag, F48 37K.
He took no extra clothing, and left behind a number of personal items and bank statements.
Dewberry's landlady filed the missing persons report after speaking with Dewberry's employer and his relatives in Texas.
She told the Sheriff's Office that he had recently visited several websites about camping, and that this is believed to have been only his second time to go camping.
Anyone with information as to Dewberry's whereabouts is asked to call the Sheriff's Office at 856-215-2243.
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text:
Collectible Card Game based on Conan.
Artwork and ideas pulled mainly from Robert E. Howard's works with other sources to follow in expansions.
The goal is to become King of Aquilonia. Your version of Conan (each player will have one of their own) needs to gain renown by defeating enemies. These foes come in varying strengths and attempt to flank your Conan card to inflict as many hits as possible. If your Conan falls to 0 health, you lose. The choice lies in heaving many weak foes at Conan, or 1 or 2 major enemies.
The combat mechanic involves the comparison of icons along the sides of the moves and maneuvers performed by Conan and his various foes. These will determine hits, misses, and blocks.
The game features new artwork from Dark Horse artist Paul Lee, CCG artists such as Alex Horley and Patrick McEvoy, and legendary fantasy artist, Ken Kelly. Some art is taken from current Dark Horse comics, as well as some old Savage Sword covers.
This game ended production as a collectible game, and is currently being redesigned for release as a non-collectible game.


text:
unfolding coluds as simplicity
trading places so that I might witness poetic juxtopositions.
trampoline dive into the dust... broken hearted girl on electric overload
in light of your jumpsuit beauty.
despite a complete hesitation
i wanted to thank you for the touch
waves stirring a frozen landscape
too desperate to find solice in heat.
wish that i had been brave...


text:
Hot Gossip
Another Round of Diamond Ring Rumors for Reese
By Kat Giantis
Reese Witherspoon has roundly denied persistent reports that she's engaged to agent beau Jim Toth, but with their one-year anniversary fast approaching, the rumor mill continues to push for a proposal.
The latest betrothal chatter comes from RadarOnline, which claims the high-powered CAA exec wants to lock down the Oscar-winning actress "very soon," and has already selected a sizable (but not overly so) sparkler.
"He was looking for something pretty big, around three or four carats," alleges a source, who predicts a holiday question-popping for the refreshingly low-key pair. "Reese probably wouldn't wear anything larger than that since she's not showy."
RELATED: Reese: R.Pattz is a 'very handsome man'
But Witherspoon, 34, laughs off the nuptial speculation in the latest Entertainment Weekly.
"My mom always texts me, like, 'Are you getting married?'" says the former Mrs. Phillippe, who is mom to Ava, 11, and Deacon, 7. "I'm like, 'Mom, come on! You would know if I was getting married.'"
The actress began dating Toth shortly after her bust-up with Jake Gyllenhaal in late 2009, and they quickly became joined at the hip, from attending her kids' soccer games to working out together to going to church on Sunday.
RELATED: Reese gets a Hollywood star
"I feel very lucky to have the chance to try again, you know?" she recently acknowledged to Glamour. "What I'm finding out is that it's very comfortable to be with somebody who understands my career, but doesn't do what I do. He's a great guy. He's wonderful."
These latest ring rumblings follow Us Weekly's cover story on how a seemingly marriage-minded Toth was designing a ring for the "head over heels" A-lister.
A month earlier, In Touch claimed that the agent had been seen bauble-shopping at several high-end Los Angeles jewelry stores and was searching for a ring that was "classic and beautiful, just like Reese herself." A "surprise" proposal was said to be imminent.
RELATED: 'Funny doesn't sag,' says Reese
"[Getting engaged] is a natural step for them, but they're not in a rush," a confidant explained to People in October. "There's no deadline, no timetable. But it's something in the future."
Speaking of the future, that's exactly what Witherspoon is focused on as she assures EW that she regrets nothing.
"I don't feel bad about any of the things I've gone through, whether it's divorce or breakups or anything like that, because that's all part of the life journey, and I have those experiences just like anyone else," she tells EW. "My favorite quote is from Martha Stewart: 'I have a short memory for painful things.' And I do."
Explains Reese, "I have one of those incredible memories where I just erase painful things. Maybe that's really unhealthy, and I probably need to see a therapist. But I don't dwell. You just keep going forward."
Read more Hot Gossip
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The HCG diet refers to a restriction diet which is based on 500 calories each day. The diet is supplemented either with oral HCG drops or daily injections of HCG hormone. Here are the facts behind this VLCD (Very Low Calorie Diet).
Occasionally, a new diet usually sweeps across the world, promising rapid and easy weight loss in for a very little effort. The HCG diet for weight loss is an example of such a diet. The diet was first seen in 1950's, had resurgence in 1970's and is back again. The HCG diet is popular in the US and has continued to gain popularity in the UK and all over the world.
What is HCG?
HCG is the abbreviated form of Human Chorionic Gonadotropin which is a hormone that is found in the human body. The hormone is found in the urine during pregnancies. Human Chorionic Gonadotropin is also produced by pituitary gland and certain tumors.
How Does HCG Hormone Work?
HCG normally triggers the human body to mobilize the fat stores so as to bring energy to the growing embryo. Being also gonadotropic, HCG also prompts genital developments. As such, the hormone is usually used as a fertility treatment.
How Does Human Chorionic Gonadotropin Diet Work?
The idea behind the HCG diet in general is simply that the hormone normally allows the body to access the fat stores faster than normal. Instead of having to lose muscle and bone mass, you will begin losing body fat immediately.
When following HCG diet plans, the theory is that the intake of low calorie allows you to begin losing weight while the HCG drops or HCG injections reduce your appetite and ensure that you are actually burning fat instead of muscles.
Although all this sounds plausible, there's no scientific proof to really prove that HCG supplementation truly works. In 1995, a British Journal of Clinical Pharmacology published reports which showed no relationships between Human Chorionic Gonadotropin and weight loss.
What Does Human Chorionic Gonadotropin Diet Cost?
There are several HCG diets that are springing up around the world as this diet continues to gain popularity. The cost of the diet is significant for the individuals who go to surgeries for their consultations and injections; 1150 Euros for 30 days supply.
For the drops, you should expect to pay around 49.95 Euros for a single bottle, (2 fl oz, and 60ml). There shall also be additional costs for books, recipe guides and meal plans which can all be purchased from HCG Activate.
The Cons of the Human Chorionic Gonadotropin Diet
- Exercise is not promoted as being part of the overall health.
- Calorie restriction is usually way below what's deemed safe by the greater part of the medical professions.
- Side effects of the use of HCG aren't understood.
- Some cancers might not be caught in the early stages since HCG injections might mask certain indicators.
- Lifestyle changes are not stressed.
- Health concerns like Depression, Irritability and mood swings Dizziness, Constipation, Blood clots and Diarrhea
The HCG diet claims that you're capable of losing a pound every day. This shall be due to the lack of calories as opposed to any influences of the drug. Successful weight loss plans is all about getting the right balance and adopting healthy lifestyles.


text:
Top Definition
A good looking, tall and intelligent guy who may seem like a douche at first but will prove to be an excellent friend with a great taste in music.
Has an undeniably sweet side, tendency to give nicknames.
Has an undeniably sweet side, tendency to give nicknames.
person 1:"got to know Pascal and he's a great guy really"
person 2:"I knew he had a nice side to him"
person 2:"I knew he had a nice side to him"
door sparkofdraco 25 september 2011
Weapon used to piss on hobos
verb- To Pascal someone
verb- To Pascal someone
"Dude, I saw a homeless guy asking me money today, I Pascaled him"
door Jefefe DunHAM dot com 31 januari 2009
An underrated high-level programming language developed in the 1970s by Niklaus Wirth. Pascal was originally intended to teach good programming practices, but in the early 1980s, Borland took the language and made it more powerful and widespread by introducing Turbo Pascal. Today, Pascal is still used in the form of Delphi, a Windows RAD development tool similar to Visual Basic, but much more powerful. Applications developed using Pascal usually contain far fewer bugs than other high-level programming languages.
Contrary to popular belief, Pascal, today, is just as powerful as C, C++, or Java.
door signull 30 juli 2006
A display of the skin on a man's chest through a revealing piece of clothing (i.e., a deep V-neck, a dress shirt with only the lower-half of the buttons done, a stretched out collar).
- "That guy's rocking a Pascal."
- "A bit of Pascal can be really hot."
- "A bit of Pascal can be really hot."
door zetizzun 31 maart 2011
A very handsome and sexy guy. He is also tall and really good in relationships and is very loyal to his partner. A Pascal might seem awkward at first, bit once you get to know him he is really funny and hyper. Pascal can also be a real asshole sometimes but he is a good friend most of the time.
"dude Pascal is so awkward"
"Pascal is fucking hot"
"Pascal is fucking hot"
door Fuck_Dick_Ass_Cunt 20 juli 2014
Scale from o to Pascal to determine one's level of stokeness.
O being the lowest and Pascal being so stoked.
O being the lowest and Pascal being so stoked.
Dude how stoked are you about the football game on Monday?
Dude, I'm like totally Pascal stoked!
Dude, I'm like totally Pascal stoked!
door Buddaayyy 3 september 2010
A gay person. A man who likes cock.
I love cock, I'm so Pascal
door Whiskykid 26 februari 2015


text: Featured comments + Add comment Comments (3) Featured legendoflex "Deus Ex is I'm sure going to be awesome, especially if Straight Right is handling and uses the GamePad nearly as well as they did with Mass Effect 3. However, therein lies the problem: it's probably going to sell like Mass Effect 3. You'd think HD co..." 987d ago stragomccloud "Agreed. " 986d ago DonFreezer "It's simple Sony pays them to not release the collections to other platforms. " 982d ago


text:
E. Tennessee St. 70 at Kennesaw St. 60
Hot-shooting ETSU defeats Kennesaw State 70-60Saturday, Jan 19, 2013
KENNESAW, Ga. (AP)—Lester Wilson scored 19 points as East Tennessee State shot 69.2 percent from 3-point range and 63.2 percent from the field to defeat Kennesaw State 70-60 Saturday in Atlantic Sun Conference action.
The Buccaneers (5-14, 3-3), coming off a 78-59 loss at Mercer on Thursday, hit 24 of 38 from the field and 9 of 13 from long range—including 8 of 11 in the first half—to beat the Owls for the 14th straight time.
Wilson made 3 of 3 3-pointers and Jarvis Jones knocked down 4 of 5 to finish with 15 points. Kinard Gadsden-Gilliard added a career-high 14 points.
Kennesaw State (2-17, 1-6), which lost its fourth straight, shot 33.3 percent (8 of 24) en route to trailing 37-24 at halftime and could get no closer than eight in the second half.
Aaron Anderson led the Owls with 13 point and 14 rebounds.


text:
Dark actions ... by aoao2Watch
©2012-2015 aoao2
thank you ^^
For Gimp you don't need actions to do this.
Open the photo.
Click "Colors".
Click "Curves".
Play around until it looks good.
You can try the other color tools too.
Open the photo.
Click "Colors".
Click "Curves".
Play around until it looks good.
You can try the other color tools too.
Thank you so much!
Shit, Avengers aint got nothing on this ACTION!!!!!!!!!!!!!
so beautiful ewé ♥.♥¡
photoshop make this photo magic :3
Would you be so kind to say how you do this on photoshop? I've been trying to find out how to do so, but i don't know if its a function provided on Photoshop or if you have to do it manually.
I'm sorry if this is bothersome, but how do you install these? ^.^;
great one ... love it
Thaaaaanx alot
Thaaaaanx alot
Color overlay?
ok, can u tell me how to download actions? im so dumb T^T
You can do this with Gimp (free) and it takes 10 seconds to do.
I don't get the point of this deviantion.
I don't get the point of this deviantion.
these are so lovely cant wait to try these out they look just amazing
Oh wow amazing!! I'll use this in the future for sure
That is so beautiful ! Photo shopped , but beautiful . <3
This particular photoshop action isn't impressive at all. It's so easy to do. Some of the other ones where they change the seasons and that kind of thing are actually nice to look at.
No xD I can do it in about 20-30 seconds
very cool..* __ *...does it take long to do that ? ^_^
Ohh, pretty 0-0 I love how they all look like they belong, like how you would actually see a forest each way as shown, COOL!
please..stop with the actions and more with the amazing pictures o3o
very nice however i prefer the original colors
i need photoshop D::
its good make tutorial it will be better


text:
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Poep Sa Frank Jude Boccio is a certified Yoga Teacher and Dharma Teacher, ordained by Korean Zen Master, Samu Sunim. His eclectic approach is influenced by his study of a variety of Yoga approaches and his many years of Dharma practice, evidenced by his emphasis on mindfulness and compassionate action. His book, Mindfulness Yoga: The Awakened Union of Breath, Body, and Mind is the first to apply the Buddha's mindfulness meditation teachings (satipatthana) to yogasana practice.


text:
Behind the scenes with Hope Vance: Legal assistant makes directorial debut with Town & Gown's production of Neil Simon's 'Biloxi Blues'
Hope Vance makes her directorial debut with the production of 'Biloxi Blues'
R.C. Rique/Staff
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DUBAI, Nov 26- Speculation that Saudi Arabia could devalue its currency may owe more to a poor public relations effort by Saudi authorities than to the economic pressures on the kingdom. Riyadh has the tools available to protect itself as low oil prices push the current account and budget balances of the world's top crude exporter deep into deficit, senior...» Read More
United Continental has issued two vague statements since CEO Oscar Munoz was hospitalized.
Joe Biden in 2016? No need to rush, says consultant Mark Macias. Here's how the vice president can gain by taking his time.
Peter Kellner, Yougov president, says he would be astonished if Labour party leader Jeremy Corbyn, who wants to nationalise Britain's railways, becomes prime minister in the next general election.
LAUNCESTON, Australia, Sept 24-- Can the coal industry win a public relations battle, and does it even matter if it can't? Does this mean that the Minerals Council of Australia's new, and seemingly costly, campaign in support of the fuel is simply raging against the inevitable, or does it herald a new front in the war between coal miners and anti-coal...
Sept 23- British communications and events company UBM Plc said on Wednesday it was in "highly preliminary" talks about a sale of press release distributor PR Newswire. UBM, which has been looking to sell the business since April, said it was in talks with a number of parties but there was no certainty about a deal being reached. Reuters reported on Tuesday that...
Sept 22- Cision, a provider of public relations software and intelligence, is working on a bid to acquire press release distributor PR Newswire Association LLC, according to people familiar with the matter. Cision, owned by private equity firm GTCR LLC, is participating in an auction run by British communications and events company UBM Plc, which owns PR Newswire,...
Scott Walker dropped out of the GOP primary race. So, who wins — from a media perspective?
The last GOP debate was pretty fiery. Here are 8 questions media strategist Mark Macias says the candidates need to be ready for this time.
Yannick Bollore, chairman and CEO of French advertising conglomerate Havas, says the shift in China's economy is "not bad" for industries such as advertising.
Carly Fiorina is impressive in interviews and debates. Here's how she can get closer to the GOP nomination, says media strategist Mark Macias.
Here's what Ashley Madison can do to regain the public's trust after the hack, says media consultant Marc Macias.
Hillary Clinton's camp is running the wrong kind of campaign, but Mark Macias says there's still time to turn it around if they takes these steps.
Trump made a big mistake in the GOP debate. And Bush? Mark Macias says he's seen stronger fights on "Gossip Girl." Here's what they did wrong.
Media consultant Mark Macias offers up his advice for what Scott Walker needs to do to get America's attention.
BRUSSELS, July 27- In early 2013, President Barack Obama's call for a U.S.-EU trade deal generated such optimism in Europe that the graffiti "NO TAFTA, NO TTIP" scrawled under a bridge near the EU headquarters in Brussels was an isolated message of dissent. More than two years on, with the graffiti still there, European officials are ruing their failure to spot early...
Media consultant Mark Macias offers up his advice for what Bernie Sanders needs to do to beat Hillary Clinton.
Media consultant Mark Macias offers up his assessment of Chris Christie's shot at the GOP nomination for 2016.
Latinos have a message for Donald Trump: He's messing with the wrong demographic, says Beatriz Acevedo.
Media consultant Mark Macias says it will be a total disaster if Donald Trump gets a spot in any presidential debate.
Jeb Bush hasn't met the high expectations set for him, says this media consultant. But there is something he can do about it.