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I'm looking at buying a hard shell for early spring and late fall backpacking.The temperatures can be from 10F to 40F and I need something that can repel water as well as keep me bone dry. Hypothermia is just too dangerous. I'm also planning on using it as plan B in the summer of the winter looks bad.So I imagine what I really need is a medium level hard shell. Not as insane as some of the mountaineering options but also strong enough that I can go over significant peaks @ 8-10k without having to worry insane weather killing me.I was thinking of getting the Montbell Torrent Flier:http://montbell.us/products/disp.php?cat_id=2003&p_id=2328280&gen_cd=1http://www.backpackinglight.com/cgi-bin/backpackinglight/00334.html#.UzzLFq1dVvABPL gives it 4.5 starts in terms of features but only 3.5 in terms of value... but the price has come down about $50 and it's also lighter now.The other jacket I was looking at was the Super Mica from Marmot.It's REALLY hard to compare all these jackets. Each vendor has about ten different hard shells and it's difficult to figure out which one I should go with.
Kevin,Will your jacket see significant abrasion, as in scraping against granite while climbing or mountaineering, or extended bushwhacking through dense vegetation?If this jacket will see significant abrasion, then you will legitimately need a jacket with heavier and more durable fabric, but for general on-trail backpacking, abrasion risk is highly overstated.Whether you are at 10,000 feet or sea level won't make any difference. The jacket still serves the same function and will basically do it equally well regardless of what the ambient atmospheric pressure is.Just get something light and with the features you want (pockets, pit zips, etc.). And there is really no need to spend more than about $150.All these "waterproof breathable" jackets are glorified plastic bags. Some have better construction, fit, and features than others, but they are all universally poor at being breathable. Don't kid yourself: they won't breath much. Venting is the best option for breathability with any of these hard shells.If this is just for run-of-the-mill backpacking, then I'd tell you to go with the Super Mica because it is cheap, and Marmot is really good about standing by their products for life. They have replaced two different WPB jackets for me that delaminated after a few years, and they didn't give me a hard time about it. They are a good company in my experience.There are plenty of other good jackets out there as well though.
Edited by dmusashe on 04/02/2014 23:53:23 MDT.
Unlike Derek I HAVE had good experiences with Gore-TEX and VERY good experiences with eVent hardshells. Gore-Tex is great for alpine skiing and lighter activity.My favorite is REI's Kimtah eVent parka (and pants). Makes a good windshell and is very breathable. Plus it is the best eVent shell for the money.True, you'll get sweaty with hard exertion but that's true even with quite breathable clothing. But with moderate exertion the eVent parka will keep you quite well ventilated.
First, don't plan on wearing a hardshell below freezing unless you're getting wet snow or the wind is super strong with a dangerous windchill. Relatively poorly breathing hardshells do even worse in the cold, which contributes to getting wet from the inside and hypothermia. When someone says spring and fall backpacking, I think of the possibility of cold rain, wet mixed precip, and strong winds. All of these recommend a slightly burlier shell. While there is no inherent reason light face fabrics can't resist wetting out in these conditions, most suffer anyway. A good DWR is vital. A stiffer jacket fabric also provides more wind protection when things are nasty.The Torrent Flier and Super Mica are very poor choices here. Montbell has a fairly poor DWR treatment, and both coats are quite thin.One route would be to get a lighter, simpler Goretex coat. Probably talking around 13 ounces and 300 bucks. The Patagonia Super Cell, for example. Another approach if you prefer to spend less would be a PU coated coat with a heavier face fabric, like the Patagonia Torrentshell.If you want to spend still more you can save a bit of weight with a high-end coat like the Arcteryx Alpha SL or Haglofs Gram Comp. Both will be excellent long term investments.
I'm really just saying what others have said differently, but ideally you need a soft shell and a hard shell for that temp range. Maybe around 20-25F is the starting lower range for using a hard shell, but I've used an eVENT hard shell down to 10F with pit zips. I think you could get by with only an eVENT shell.My soft shell is cotton canvas and was $15. It's a bit heavy, more durable (particularly around fire), and works great. I use it for around 20F and below.
Edited by AndyF on 04/03/2014 08:58:30 MDT.
Kevin - I just did a 20+ mile day last week in central Pa in the Kimtah eVent parka. Temp outside was 15 degrees and the jacket breathed very well. I used an ibex 150 weight short sleeve shirt and an ibex hoodie indie. The combination of these 3 pieces were perfect. Ventilation is the key and would just unzip the jacket and hoodie when i was ascending the typical Pa terrain.
Wow. This is a complicated thread with lots of differing advice.Sounds like I should probably get two jackets. A decent soft shell and a decent but light hard shell.I don't do much hardcore bush whacking where the hard shell would see any damage. Even when I DO it's at much higher altitude and I'm not running into much brush. In the Sierra Nevadas there forest floor is pretty open.So get a decent soft shell for winter conditions where it will be cold and wind issues are a problem. I can then use this soft shell for cold temperatures WELL below freezing.I can bring BOTH for intermediate temps 20-40. This way if it starts to rain hard I can just throw on the hard shell.Then I can just bring the hard shell for temps > 32 where rain and hypothermia is the issue.I want the hard shell for the summer as well. I'd like a decent plan B in the case of SEVERE weather and catastrophic shelter damage. Something I can just sit around in overnight under a tree waiting for a storm to end.Plus I can do some decent mileage this way.
When you need a rain shell, you need a rain shell. I don't see any seasonal differences in hard shell rain protection. It is just a matter of weight, durability and budget. You have something like DriDucks at one end of the spectrum with a $500 Arcteryx shell at the other. The 2.5 layer shells offer a good range of features for the weight, running about 12oz to 16oz and $65 on up. If you want the best of the best, I would lean to an eVent jacket with all the vents you can find. That will typically run you $200+. I don't mind a few ounces more in a rain shell if I'm going to be wearing it all day. Hauling a rain shell seems more of a burden in good summer weather or climates with less precip. The problem with the uberlight rain shells is that they lack ventilation features. It's easy to overwhelm any breathable fabric when walking uphill with a load and vents are the only way to tackle the issue. Pit zips, venting pockets and snaps or velcro tabs on the front zipper will allow you to get some air exchange when you are working hard in wet conditions. Ponchos are an option too, giving good ventilation at low weight and cost. A $60 poncho can fill the same niche as a $200 7oz rain shell. You get emergency shelter and a pack cover in the bargain. Soft shells are okay for day use where you know the conditions, like downhill skiing, but they are heavy and don't provide much insulation. They are NOT a substitute for a rain shell: once a soft shell wets through, you have a nice mess on your hands. They do provide good wind protection and are abrasion resistant, so they are handy for climbers. I have compared soft shells to a synthetic denim jacket for warmth. You can haul a thick fleece or a very lofty down top for the same weight as a soft shell. IMHO, a windshirt and light fleece like an R1 will provide all the protection of a soft shell at less weight and far more versatility.
Edited by dwambaugh on 04/03/2014 11:35:58 MDT.
Kevin, I'd recommend a windshirt and a hardshell for this sort of thing. The windshirt gets worn 95% of the time, with layers underneath adjusted to suit. The hardshell goes over the whole deal when it's raining hard, snaining, hailing, etc. I strongly prefer one of he stretch woven, more breathable windshirts.Be honest about how often and hard you'll use both. If the hardshell is going to sit in the pack most of the time, a light, fragilish, 150 dollar PU coat is just fine.
David's insights and suggestions are good ones, IMO.
Here are some good resources on the materials of these jackets:https://gearx.com/blog/knowledge/technical-outerwear-apparel/how-to-choose-rainwear/http://gearx.com/blog/knowledge/technical-outerwear-apparel/rainwear-comparison-chart/I think I'm leaning towards the Super Mica- same price as the Kimtah eVent- has high vis colors (bright yellow)- has great reviews- about half the weight as the REI Kimtah eVent... Marmot DOES seem to have a Nano jacket that is GoreTex and slightly beefier but that might be overkill.Here's a good comparison of the two:http://www.backpackinglight.com/cgi-bin/backpackinglight/forums/thread_display.html?forum_thread_id=35266man these decisions are hard!$250 isn't an insane amount of money but what usually happens is that if I don't do the research I have to buy 2-3 things before I find something I like. And it can add up fast.
Edited by rmjapan on 06/21/2015 12:14:36 MDT.
Interesting but OR doesn't (yet?) have the Helium HD on their website. They're saying spring 2014 in that video. I also can't get specs to compare them.
What's the $250 price tag referring to, Kevin?You should be able to get a Marmot Super Mica for around $150. You can check Amazon after reading this post and see for yourself that this is the case. I wouldn't spend much more than that on a lightweight PU coated WBP jacket. Lots of people like the Outdoor Research jackets as well, like the ones suggested above.
Not the Super Mica specifically just that every piece of backpacking gear is about $250...
Kevin - they are herehttp://www.outdoorresearch.com/en/mens/jackets/mens-helium-hd-jacket.htmlAlot of good suggestions for a jackets and in your initial post you mentioned a jacket that will take you down to 10 degrees. I dont' know about you, but I'd want something that is bombproof once below freezing and the possibility of wet weather.
well.. anything LESS than 32 is going to be frozen. So even just a soft shell and a down jacket is fine. The REAL issue is when it's raining and still cold. And I will RARELY need it ... so I think something more suited for a variety of conditions is best.Plus... if it gets REALLY bad I have my tarp. I can just use that. Having BOTH is really valuable though. It means I can deal with severe weather if something like my tarp rips and I have to stay outside overnight. That's my real fear. I've been in a couple of situations where I was thinking that if my tarp were to tear it would be very bad. Mostly worried about a limb falling and tearing my tarp. In that situation I could just throw on my jacket and then hike until I find some shelter.
Both of these jackets:http://www.outdoorresearch.com/en/mens/jackets/mens-helium-hd-jacket.htmlhttp://marmot.com/products/details/super-mica-jacket-new#seem very competitive against one another.The Super Mica is $25 more... BUT .. the super mica comes in the high contrast yellow. Which means that I have a piece of gear that could come in handy in a rescue situation. Which I kind of like. Normally I like blending in ... mostly so other people don't see me and I don't ruin their wilderness experience.. But in rainy conditions it's ok to be seen IMO
OR has the best warranty in the businesssome BPLers have stated issues with marmots warranty on their rain jackets ... do a searchwith OR if you dont like it for any reason at all you send it inwhen buying these UL rain shells, warranty matters ... hell even the BPL SOTM report had a montane event shell fail on themas to what to buy ask yourself how often youll be using it ... if its always then get something a bit burlier ... if its a "just in case" then a UL shell will be fine;)
Edited by rmjapan on 06/21/2015 12:15:12 MDT.
"anything LESS than 32 is going to be frozen. So even just a soft shell and a down jacket is fine."There are no absolutes though. :) It could be 28F, and a warm rain won't freeze until it's on the ground for a while. Snow will still melt on your shell into the 20's because it's warmed by body heat. At some point, a soft shell will wet-out in those conditions. You may not notice it until it soaks into the down and makes you cold. Also, I never wear any down while moving because perspiration will soak into it and wet it out. Polyester or polyester fleece is the best choice for insulation while moving in these conditions.
Edited by AndyF on 04/05/2014 11:52:18 MDT.
As has been mentioned, opt for the better warranty. A 2.5 layer shell WILL wet out on you someday, often not long after purchasing it, and it's nice to be able to replace it hassle-free. Marmot will probably honor the warranty, but it may take FOREVER (in my experience). OR is great about replacing damaged gear no questions asked and ASAP.That said, if you want a strictly shoulder-season shell, consider investing in a 3-layer fabric--eVent or NeoShell or GTX Pro. The Patagonia M10 might be perfect for you, albeit at a higher pricepoint than the jackets you've mentioned. I think the added breathability and durability are worth the peace of mind if you regularly find yourself in cold-and-wet conditions.
> IMHO, a windshirt and light fleece like an R1 will> provide all the protection of a soft shell at less> weight and far more versatility.Windshirts aren't anywhere close to the breathability of a softshell. That's their downfall. For colder temperatures (or pants), where you'll likely be wearing a windshirt almost the entire time, I much prefer a softshell. I find it much more comfortable and much easier to regulate temperature to avoid sweating. (doesn't really hurt pack weight either, since it's a 'worn' item)For me, in Colorado, this is pretty much any winter trip, and some of the colder fall/spring trips.I find windshirts and down jackets a better compliment than windshirts and fleeces, because of this. If I'm cold enough when active to wear a fleece and windshirt, I'd rather bring a softshell. If it's too warm to wear the fleece when active, then the windshirt makes sense, and the fleece is useless, since a down jacket provides more warmth and weighs less.I always bring a rain jacket, unless it's too cold for rain (almost all winter and many spring/fall days).
Edited by lindahlb on 04/07/2014 16:13:30 MDT.
Brian,You said that "Windshirts aren't anywhere close to the breathability of a soft-shell." There are windshirts available with air permeability near hard shells to those equal to the air permeability of typical summer shirts. Soft-shells also fall in this exact same air permeability range.
I don't think much of the insulating power of the soft shells I have tried. You get a thick slab of smith faced polyester that protects from abrasion, wind and light precip, but when it's cold and the shell is in contact with your base layer, it is cold. I really do find a 100w fleece and a windshirt to be warmer and have better moisture transport, plus the ability to wear them in combination and with my rain shell and even for sleep. IMHO, soft shells are heavy and too single purpose for a hiker who can come up with a wide range of weather conditions. I am adamant that a soft shell can't be substituted for a rain shell.
I've gotta agree with Dale on this one.Also, I find the statement "[it] doesn't really hurt pack weight either, since it's a 'worn' item" absolutely hilarious.Not trying to pick on Brian (or anyone, for that matter), but I am just constantly amused by the mental gymnastics many of us do to wish weight away.
I agree with Dale on "softshells". Mine is COLD compared to even 200 wt. pile under a windshell or eVent parka. For the weight I don't think a "softshell" is at all worth carrying. Good synthetic fiber insulated jackets (Climashield, for ex.) coupled with a windshell or GOOD WPB parka are very warm for the weight.
Edited by Danepacker on 04/16/2014 23:35:06 MDT.
Love my Westcomb Focus LT Hoody. Winter camped to 20F with it several times, down shirt underneath, felt fine. Made in North America. A bit pricey, though you can sometimes find it for $200 on sale, and you don't have to buy a soft shell. Minimalist, no pockets.
Edited by erikusis on 04/19/2014 18:38:35 MDT.
I used a Mountain Hardwear Quasar (event) pullover last autumn and really liked it.
my Helium spends 95% of the time in my pack, but those 5% of the times I need it- it does the job; it's a no frills hardshell that works, the Helium HD might be worth looking into as well
> Also, I find the statement "[it] doesn't really hurt> pack weight either, since it's a 'worn' item" absolutely> hilarious.In my experience, having the weight of something distributed over your entire body is a HUGE difference from having that weight in your pack.> I don't think much of the insulating power of the soft> shells I have tried. You get a thick slab of smith faced> polyester that protects from abrasion, wind and light> precip, but when it's cold and the shell is in contact> with your base layer, it is cold. I really do find a> 100w fleece and a windshirt to be warmer and have better> moisture transport, plus the ability to wear them in> combination and with my rain shell and even for sleep. Hmm, I've never been too cold in just a baselayer and a thin softshell when working hard, even in temperatures around 0 degrees F. I do use a variety of baselayer weights, though, including powerstretch in sub-zero temperatures. When are you actually wearing both your 100w fleece and windshirt during activity?> There are windshirts available with air permeability> near hard shells to those equal to the air permeability> of typical summer shirts. Soft-shells also fall in this> exact same air permeability range.http://www.backpackinglight.com/cgi-bin/backpackinglight/alpine-start-review-chenault.htmlAccording to the above review, both are heavier stretch-woven garments. In my opinion, this puts them in the softshell category. Rab also even calls the Boreas a softshell. They're certainly VERY lightweight softshells, and perhaps more accurately described as a windshirt-softshell crossover? They're quite heavy if you were to consider them as a 'windshirt', at least compared to the rest of the windshirt market. They're about twice the weight, if not more. They also take up much more space in your pack.
Edited by lindahlb on 04/18/2014 12:47:06 MDT.
Brian,I find it more constructive to just ignore all of the marketing hype's slicing and dicing names. In reality a shell is either a rain-proof type or a non-rain-proof type. In those two categories select the characteristics that are important to you. SeeHere
Edited by richard295 on 04/16/2014 21:41:53 MDT.
"In my experience, having the weight of something distributed over your entire body is a HUGE difference from having that weight in your pack."Brian,This is a perceptual illusion. Lift a quart of water in one hand and a 2 lb. down sleeping bag with the other and tell me which one feels heavier. For most people, it's a no-brainer: the water seems heavier, even though the muscles in both arms are working just as hard to lift each item.It goes without saying that having an item on your person versus having it in your pack does not change its physical mass, even though it might seem like it does. At the end of the day, you are basically burning the same amount of calories. That was my point.Apologies for the thread drift.
Edited by dmusashe on 04/17/2014 00:24:49 MDT.
It's not a perceptual illusion when it's throwing off your center of balance and your back and shoulders start getting sore. It's not all about burned calories. ;)
Edited by lindahlb on 04/18/2014 12:45:08 MDT.
1) your heart and muscles can't tell the difference2) you need to load your gear properly or get a better packWeigh is weigh and it takes the same calories to move it a meter up hill regardless if it is on your pack or worn. You can pile the manure any way you like, but a soft shell is inefficient in terms of weight, performance and versatility. It won't keep you dry, it won't keep you warm and weighs as much as 3 useful layers. Great for climbers, skiers, or posing at the bus stop, but not in an UL kit.
Like I said... it's not all about the calories. And yes, my muscles can certainly tell the difference between weight on my shoulders and weight distributed across my body. I'm much more comfortable when it's distributed across my body. It has nothing to do with loading gear properly or getting a better pack. It has everything to do with the fact that the weight is being supported by shoulder straps and a hipbelt versus being supported by every inch of your skeletal and muscular system. There's no changing that fact. Perhaps some of us are more sensitive to it than others?Dale, can you answer the following?:I've never been too cold in just a baselayer and a thin softshell when working hard, even in temperatures around 0 degrees F. I do use a variety of baselayer weights, though, including powerstretch in sub-zero temperatures. When are you actually wearing both your 100w fleece and windshirt during activity?
Seems like a lot of good advice and info in here; your choice is probably going to come down to your specific needs and desires.Personally, I'm a fan of GoreTex, and specifically Arcteryx GoreTex jackets. Keep in mind that even though it may be snow, once it hits your jacket, even with the best insulation, it'll eventually melt and turn to water, and you don't want to get wet in those temperatures. I have an Arcteryx Alpha SV I picked up a few months ago and couldn't recommend it more. I do a fair bit of rock climbing (what this jacket was intended for), and it's consistently blown everything else out of the water (no pin intended). It's not great for around town (no hand warmer pockets), it's fairly heavy, pricey, and fairly stiff / noisy, but short of taking a saw to it (which isn't even valid since I've seen it hold up to plenty of ice axes), it'll last you a lifetime. They make a bunch of other models (Alpha is climbing oriented, Beta is an all around, FL is the lighter weight version of the SV) that have different purposes and may be worth a look at.
Brian asked, "Dale, can you answer the following?:I've never been too cold in just a baselayer and a thin softshell when working hard, even in temperatures around 0 degrees F. I do use a variety of baselayer weights, though, including powerstretch in sub-zero temperatures. When are you actually wearing both your 100w fleece and windshirt during activity?"I would normally wear a base layer appropriate to the basic temperature and would add or subtract the windshirt as needed. It would indeed be cold if I needed a 100W fleece with high exertion, but it would be a great combo for lighter levels of activity. My point was that the two garments are lighter than a typical softshell while giving higher performance and greater versatility. Once you stop moving the softshell is a cold boat anchor. Overcome the DWR and it will take a long time to dry. So there you are, wet, no loft, and you need yet more layers to make up for the deficiencies of the softshell. They don't work for me.
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We are excited to announce that our Trapeze LED Table Light is a finalist in the California Home + Design 2011 Hit List! The Trapeze is a collaboration between JOBY and famed industrial designer Peter Stathis and a new product that we are extremely excited about. Readers of CA Home + Design nominated 2011's most […]
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Trapeze is a Finalist in CA Home + Design Hit List!
September 1, 2011 – 11:54 am
By JOBY Inc | Posted in Uncategorized | Also tagged California Home + Design, Home Lighting, JOBY | Peter Stathis, Lighting, Peter Stathis, Trapeze | Comments (0)

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Open Source UI framework comparable to Lazlo
Now, before I go on, I want to address a very strong prejudice that I've noticed in my dealings with Open Source developers. It's the old familiar sentiment that if it isn't built in Java, it ain't worth using.
That might be true for a lot of people, and I have a lot of respect for that sentiment--it's an important one for our community. We're doing more than writing software in a certain language here. What we're doing is contributing to the development of a J2EE development platform. We're building tools for each other to use. If you've got the right tools, all the jobs in the world open up for you. For instance. There are precious minerals deep in the earth waiting to be harvested. These minerals are incredibly valuable and useful in industry. But if you're up on the surface walking around with only a stone axe and a loincloth you'll never be able to do that job. Another irony about tools is that sometimes you have to acquire and master the tools before you can even learn that a job exists. The creative reapplication of tools toward new industrial pursuits is what opens up entire new markets.
Another example. When I was seven years old, nobody in the world could make a living as a multimedia internet programmer. There were no Flash designers, because there was no Flash. When I was 21, that had all changed. I knew a lot of people who were making big dollars just to play around with Flash. One of the reasons for this, perhaps the biggest reason, is that by the time I was 21, the tools had improved.
That said, let's try to keep our input streams open to the possibility that Flash is still a very useful and cool piece of software (especially for those who know how to use it), and not relegate it to the status of "web designer's toy". I'll be the first to admit that the potentials of Flash have been largely squandered on sick cartoons and the infamous "Flashturbation" sites that every budding C-Corp and their brother launched in 1999 (you know--the ones with the contrived techno scores, who desperately wanted to be 2advanced?)
Well, for a while I made a living chasing that ghost, then gave it up for a while, returned to school, read some John Milton, some Thomas Paine and some Robert LeFevre, and now I'm back at it, looking for ways to develop new and better tools. This time, however, to retain my sanity, I'm doing it without a host company (for-profit or otherwise). And this time it has proven to be a lot more fun.
So here are some of my ideas. I want to build a manageable, rules-based J2EE development framework that enables the liquid UI capabilities of Flash on the presentation side. I want this thing to stream dyanically generated XML content to the client-side application and to completely automate the persistance layer. On the client side, I want to build an abstract UI engine in which users can plug in Swiff graphics libraries. Ideally, the UI engine would be able to digest swiff files and use them to skin the entire application.
If this software is built correctly, it should allow Flash developers to design skins which overlay UI components. They wouldn't have to deal with data maintenence at all--just building innovative graphics libraries. The app should easily plug into J2EE persistence. A lot of the contrived Flash apps of the 90s were IMNSHO a result of the nigh impossibility of reaching the persistence layer without having to fork over 35,000 USD for Generator.
The tools were the problem then, and the tools are the problem now. FlashMX costs a pretty nickel, and there seems to be a shortage of Open Source Java middleware developers in the world who know Flash like the back of their hand and have experience developing abstract application frameworks. To prove that point, I'm sounding out. If there are any more of you guys out there, for God's sake, drop me a line. We'll throw a party and write some new Flash tools, or maybe Macromedia will shoot us with the money gun and comp us FlashMX development suites in return for the fruits of our Open Source loins. In the meantime, 'll fork over the 75 bucks to launch a little non-profit company so we can get started right away.
Barring that, I'd settle for SVG, but I'm not convinced yet that it's worth its spurs.
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After years of vacillation we finally bought a new range to replace the ageing Caloric that came with the apartment. The oven door was lacking one hinge and needed to opened with a knee against the left side. The burners heated unevenly, especially on low. The thing was setting off the carbon monoxide detector almost every day.
So we got an NXR, a semi-pro 30" gas range that I don't think has been discussed on eGullet before. It's comparable to the big names in performance and repair record, with a nice finish (though not quite as nice as a Wolf or a Blue Star or a Viking), has minimal electronics and well-made parts from Germany and America, assembled in China. The repair record appears to be good, from what I've read on Chowhound, Gardenweb and the other usual sources.
We've only had it since Thursday and used it to make Zuni chicken with rice and green beans, plus boiling water for coffee and tea. It will be put through its paces in the coming weeks! But I have to say we're delighted with the 15K burners (all four identical, all four capable of excellent simmer mode), the beautiful blue enamel oven, the sleek look and feel (it slid exactly into the space, despite not technnically being a slide-in range), and of course the performance. Oven calibration at 475 for the Zuni measured pretty much perfect with my oven thermometer. The door is heavy and solid and lets no heat out. The knobs feel pretty great and the click and ignition for each of the burners is a joy. The oven is not self-cleaning, but has a convection feature as well as an excellent internal light. It was a revelation actually to be able to read the oven thermometer through the glass door while the chicken was cooking.
Here are some photos. We're very happy!
(note: there is a center grate for it which is on back order.)


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Jon Heyman On Gresh & Zo: Red Sox Looking For Younger Manager
October 4, 2011 12:42 PM
BOSTON (CBS) – Jon Heyman, our MLB Insider, joined Gresh, Zo and Dan Shaughnessy to discuss the Red Sox mess.
Who are the candidates for the Sox Manager position? What kind of qualities will the Sox look for this time around?
Will Theo Epstein stay with the Sox and if not, are the Cubs and Angels viable options?
That and a ton more about the unsettling Red Sox situation with Jon Heyman.
Jon Heyman: Red Sox Are Looking At Youth For Manager Spot


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Tabletop Game Club
The Tabletop Game Club seeks to create a fun and inviting environment for students to pay tabletop games including board games, card games, and pen and paper games. While having a casual atmosphere the club will also host tournament-style events and students will be able to gain more understanding of the competitive environment on campus and within the local community. The club has a selection of games to choose from, and welcomes any participants to bring more! Any game that doesn't plug in is welcome, as are any students who wish to join. Members are encouraged to bring friends!
Meeting Time:
The club meets Wednesdays from 5:30-11pm on the third floor of Joyce.
Contact Info:
Faculty Contact: Stephen Wehmeyer
Student Contact: Matthew Lantagne & Dan McLean


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|Numéro de publication
|Type de publication
|Numéro de demande
|Date de publication
|29 mars 1994
|Date de dépôt
|2 nov. 1992
|Date de priorité
|28 juin 1991
|État de paiement des frais
|Autre référence de publication
|Numéro de publication
|Alfred E. Dunlop, Thaddeus J. Gabara, Scott C. Knauer
|Cessionnaire d'origine
|At&T Bell Laboratories
|Exporter la citation
|BiBTeX, EndNote, RefMan
|Citations de brevets (9), Citations hors brevets (6), Référencé par (57), Classifications (9), Événements juridiques (3)
|Liens externes: USPTO, Cession USPTO, Espacenet
This is a division of application Ser. No. 07/724,560 filed Jun. 28, 1991, now U.S. Pat. No. 5,194,765.
This invention relates to integrated circuits and, more particularly, to integrated circuits where control of variability in the effective size of elements within the integrated circuits enhances the operation of such circuits.
Substantial variations can occur in the performance of integrated circuits simply because the manufacturing processes that are employed can not be carried out with the desired precision. Indeed, it is not uncommon to find substantial performance variation between integrated circuits of identical design that are manufactured on a single semiconductor wafer but at a different location on the wafer. This includes variations in delay, speed (frequency response) and power consumption.
Designers who intend to use integrated circuits must account for all possible variations in ICs' performance. Consequently, in many circumstances designers develop worst case designs, which are designs that assume all IC parameters, or characteristics, to be at their worst specified levels. Manufacturers specify the minimum and maximum values in both speed and power characteristics of their ICs. That means, of course, that the manufacturer must assure itself somehow that the integrated circuits do lie within the promised bounds of operational characteristics. In turn, that means that integrated circuits which lie outside the promised bounds have to be discarded as "defective".
Clearly, being able to narrow the variation in speed and power consumption of manufactured ICs would result in higher yield for the IC manufacturer and more desirable integrated circuits for the designer.
Whereas in bipolar ECL technology circuit means can be provided for self-control of the power dissipation within the integrated circuits, no such circuit means are available for MOS integrated circuits because of their inherently different mode of operation. The only solution for MOS circuits is, as indicated above, to select the integrated circuits that match the specifications, after those circuits have been manufactured.
An issue that is related to speed and power dissipation of elements throughout the integrated circuit is the issue of creating specific impedances that are presented at input/output terminals of the integrated circuits. This issue encompasses both digital and analog signals (i.e., both digital and analog ICs) and encompasses terminals that transmit signals as well as terminals that receive signals.
When signals exit an IC terminal, flow along a signal path over an appreciable distance and enter another IC terminal, signal reflections can be experienced from impedance discontinuities along at any point along the signal path, and specifically from the terminals. Most reflections can cause considerable problems in both digital and analog environments (e.g., mis-detection of digital signals). It is well known, however, that when the signal path is viewed as a transmission line with a characteristic impedance, undesirable reflections are eliminated when the transmission line is terminated at the sending and/or receiving ends with impedances having a value equal to the characteristic impedance of the transmission line. In other words, what is needed for effective transmission of very high frequency signals through signal paths of appreciable length is integrated circuits where both input and/or output terminals have specified and well controlled impedances.
The most general requirement for such termination impedances is that the impedance be the same for both positive and negative signals. A somewhat weakened version of this requirement is permitted when the circuit either delivers or expects to receive signals of a single polarity. One example of this situation is found when the integrated circuit delivers power in digital form (either delivers some power, or delivers no power). The same applies when the circuit absorbs power. Only when power is delivered must be output impedance be equal to the transmission line characteristic impedance. Also, even in the absence of a transmission line, it is well known that for optimum power transfer the output impedance of a signal source must equal the load impedance.
In an article titled "A Self-Terminating Low-Voltage Swing CMOS Output Driver", IEEE Journal of Solid-State Circuits, Vol. 23, No. 2, pp. 457-464, April 1988, Knight et al. described one CMOS circuit arrangement for developing a digital signal at an output terminal that is characterized by a specified and controlled output impedance. The output buffer of their arrangement consists of a series connection of a P-channel transistor having its drain connected to the drain of an N-channel transistor, while the sources of the two transistors are connected to their respective power supplies. The junction point where the drains of the two transistors are connected is also connected to the output terminal. The gate of each of the transistors is driven by a separate pre-drive circuit, and the pre-drive circuits enable and control their respective transistors in an alternating fashion. More specifically, each pre-drive circuit sets the gate-to-source voltage of its respective transistor to a specified level to insure that the transistor presents a predetermined impedance to the terminal.
Each of the pre-drive circuits is a digital inverter connected between a fixed voltage source and a variable voltage source. Each pre-drive circuit is also responsive to a digital input signal. The digital signal of one pre-drive circuit is the logical inverse of the digital signal of the other pre-drive circuit.
The Knight et al. arrangement suffers primarily from a number of deficiencies. Each of the pre-drive circuits requires a controllable analog voltage, and since the levels for this voltage must be maintained under changing operating conditions, the circuitry for creating this voltage is difficult to design, comprises a substantial number of components and consumes a considerable amount of power. Noise is also a problem.
Effective control of impedance values in integrated circuit applications is achieved with an integrated circuit transistor whose size is digitally controlled. The digitally controlled size is achieved, for example, with a parallel interconnection of MOS transistors. In one application, the digitally controlled transistor serves as a controlled impedance connected to an output terminal of an integrated circuit. In that application, a number of transistors are enabled with control signals, and the collection of enabled transistors is responsive to the input signal that normally is applied to a conventional transistor. In another application, where the digitally controlled transistor serves as a controlled impedance at the input of a circuit, only the control signals that enable transistors and thereby determine the effective developed impedance are employed. In still another application, the digital control of the transistor's size is employed to control the speed or power consumption of the effective transistor. Such control is exercised to erase the manufacturing variability of the integrated circuit. Alternatively, such control is exercised as part of a feedback control of the operational characteristics of the entire circuit. In the feedback control application, the digital signals that control the transistor's size are obtained from an assessment of the circuit's operation. In the manufacturing variability control application, the digital signals that control the transistor's size are obtained from a measure of the integrated circuit's parameters relative to a reference element.
FIG. 1 presents an idealized view of an output drive circuit;
FIG. 2 presents a diagrammatic view of the FIG. 1 arrangement, accentuating the signal interfaces to the output drive elements;
FIG. 3 presents a schematic diagram of one embodiment for digital impedance block 20 of FIG. 2;
FIG. 4 illustrates the circuitry for controlling digital impedance 20;
FIG. 5 depicts circuitry for controlling digital impedance 30 of FIG. 2;
FIG. 6 presents an application where different sets of circuit elements are controlled with related digital control signals;
FIG. 7 illustrates an application where the different control of different circuit elements is under processor control, and
FIG. 8 presents an application where the digitally-sized transistor is controlled via functional signal feedback.
The principles of this invention, as disclosed in greater detail below, are advantageously applicable to the two applications described above. That is, the disclosed principles are applicable to the task of reducing the manufacture-related variations in transistor size between integrated circuits of a given design. And, they are eminently applicable to the task of controlling the impedance presented at input/output terminals of integrated circuits. The terminal impedance issue is addressed first. Thereafter, the general sizing control application is described.
FIG. 1 presents an idealized view of an output terminal 10 that delivers a digital signal to a transmission line 200. Block 100 represents the functional circuitry that is associated with output terminal 10, and that functional circuitry may have other terminals (input and/or output) with which it is associated. For purposes of this disclosure, the exact nature of circuitry 100 is irrelevant and, for sake of simplicity, the relationship of circuitry 100 with other terminals is not treated.
The output drive stage of circuitry 100 that is associated with terminal 10 is idealized with impedances 11 and 13. Impedance 11 has one lead connected to ground potential and the other lead connected to one lead of controllable switch 12. The other lead of switch 12 is connected to terminal 10. Similarly, a resistor 13 is connected to a fixed negative potential and to controllable switch 14. Like switch 12, switch 14 has one lead connected to terminal 10.
Switch 14 is controlled by a digital input signal Sin and switch 12 is controlled by its logic inverse, Sin. When switch 14 is closed and switch 12 is open, current flows from transmission line 200 to the fixed negative potential, and the impedance that this current encounters is impedance 13. When switch 14 is open and switch 12 is closed, current flows from the ground potential into transmission line 200, and the impedance encountered by this current is impedance 11. Ideally, impedances 11 and 13 are equal to each other and set to correspond to the characteristic impedance of the transmission line; e.g., 50 ohms.
In connection with the need to make elements 11 and 13 equal to each other and also set them to a predetermined value the following should be noted. First, the most prevalent realization of an impedance within an MOS integrated circuit is an MOS transistor that is turned on. The degree to which the transistor is turned on provides one avenue of control over the value of the generated impedance, and the size of the transistor provides another avenue of control over the value of the generated impedance. Although the principles of this invention apply to other realizations of impedances, this disclosure deals only with this most-prevalent approach. Second, with the design techniques available today, it is possible to create integrated circuit MOS transistors which have very similar characteristics in the same environment. Hence, it is not too difficult to create impedances 11 and 13 that have essentially the same value, or that are related to each other by a predesigned fixed ratio. However, it is extremely difficult to (consistently) manufacture impedances 11 and 13 with a specific value.
Recognizing this great difficulty, in accordance with the principles of this invention, the values of impedances 11 and 13 are controlled digitally during the circuit's operation.
FIG. 2 presents a diagrammatic view of the FIG. 1 arrangement. It includes a digital impedance block 20 responsive to input signal Sin and to the negative voltage source. It also includes a digital impedance block 30 that is responsive to the inverse of Sin (derived via inverter 15) and to the ground potential. The outputs of blocks 20 and 30 (23 and 33) are interconnected and applied to output terminal 10. To provide for the aforementioned digital control, block 20 is responsive to digital control signal bus 21 and block 30 is responsive to digital control signal bus 31.
FIG. 3 presents one embodiment for digital impedance block 20 (block 30 is of essentially identical construction). It is basically a digitally-sized transistor. The kernel of FIG. 3 comprises a parallel interconnection of MOS transistors 24 between the block's fixed negative potential terminal 22 and the block's output terminal 23. In the "impedance control" application, this arrangement basically represents a parallel connection of resistive paths. The number of transistors 24 used is a design choice. Each of transistors 24 is controlled (at its gate terminal) with a NAND gate 25. Gates 25 are two input gates. One input of gates 25 is connected to input terminal 26 of the digitally sized block which, in this case, is a digital impedance block. The remaining inputs of gates 25 are combined to form the digital control bus (21) of the digital impedance block.
The basic idea behind the FIG. 3 structure of digital impedance circuit 20 is that a number of transistors 24 are fully turned on by the control signals and thereby placed in their low impedance state. By placing a sufficient number of such transistors in their low impedance state, the effective impedance between terminals 22 and 23 can be lowered to the desired level. It is simply an addition of conductances.
As an aside, although FIG. 3 is depicted with a parallel interconnection of resistors, the principles of this invention can be applied with equal effectiveness, where the applications calls for, to other interconnection arrangements, such as a series connection of elements, or a series and parallel connection of elements. Also, a skilled artisan should realize that transistors 24 may be N-channel rather than P-channel as depicted in FIG. 3, and gates 25 would then be AND gates rather than NAND gates. In some applications, a different logic function in gates 25 may prove useful, such an OR, NOR or EXOR.
In the FIG. 3 arrangement, transistors 24 can be sized identically. In that case, each transistor that is enabled by control bus 21 increases the conductance between terminal 22 and 23 by a fixed increment. This provides a linear stepwise adjustment function in the conductance between terminal 22 and 23.
Another approach to sizing of transistors 24 is to make the impedances of transistors 24 related to each other by a power of 2. That is, the first and smallest transistor may have a conductance X, the second transistor (of the same length) is twice as wide and has the conductance 2X, and the nth transistor is 2n times as wide and has the conductance 2n X.
This binary approach requires a fewer numbers of parallel paths than the approach employing equally sized transistors (log K transistors for the binary approach vs. K transistor for the uniform approach). However, a timing problem is sometimes encountered when a given transistor is enabled and, concurrently, all the previously enabled transistors must be disabled (e.g., switch from 01111111 to 10000000).
Still another approach to sizing of transistors 24 groups transistors 24 into two or more subsets. When two subsets are used, the transistors in one subset are used to coarsely adjust the overall impedance, while the transistors in the other subset are then used to finely adjust the overall impedance. Of course, more than two subsets can be used to produce an "in between" coarseness adjustment capability. In one coarse/fine control embodiment, for example, the total width of the transistors in the "fine" subset was made to equal the width of a single transistor in the "coarse" subset, and there were 16 transistors in each of the subsets.
FIG. 4 illustrates the circuitry for developing the impedance control signals. More specifically, it illustrates the circuitry for developing the impedance control signals for digital impedance block 20 of FIG. 2. The circuit of FIG. 4 is basically a Wheatstone bridge. It includes an impedance 41 connected between the ground potential terminal and balance terminal 51, an impedance 42 connected between the negative potential terminal and balance terminal 51, a reference impedance 43 connected between the ground potential terminal and balance terminal 52, and a digital impedance block 44 connected between the negative potential terminal and balance terminal 52. Impedances 41 and 42 are of any convenient value but of a given ratio. Impedance 44 is the impedance that is controlled in the course of balancing the bridge, and impedance 43 is the reference impedance. Since only the ratio of impedances 41 and 42 is important for balancing the bridge, those impedances can be impedances that are created on the integrated circuit. Impedance 44 is a controlled impedance and being on the integrated circuit it, if effect, tests the manufacturing quality of the integrated circuit. Impedance 43 is the only impedance that must be accurately formed. Of course, impedances 41 and 42 do not have to be created on the integrated circuit, and when they are created on the integrated circuit, care must be exercised to make the of a known ratio and track each other. A possible arrangement that satisfies this criterion is resistances made within a highly doped poly-silicon layer formed on the integrated circuit substrate.
In operation, when the ratio of impedance 44 to impedance 43 is not equal to the ratio of impedance 42 to impedance 41, a voltage difference appears between balance terminals 51 and 52. This voltage difference is measured by comparator 53. The objective in balancing the bridge is to make this voltage approach zero. This objective is realized in a clocked fashion by applying to converter 54 a clock and the output of comparator 53. The clock is derived from oscillator 55.
Converter 54 develops a set of digital signals that are applied to the impedance control bus of digital impedance block 44. When the parallel arrangement of the resistive paths in block 44 comprises transistors of equal size, converter 54 may be implemented simply with a bi-directional shift register having the left-shift input supplying a logic level 1, and the right-shift input supplying a logic level 0. The output of comparator 53 determines whether the shift register shifts to the right or to the left. When the comparator output indicates that the voltage at terminal 52 is lower than the voltage at terminal 51, the need is to shift more 0's into the shift register.
When the parallel arrangement of the resistive paths in block 44 comprises transistors that are related to each other in the binary manner described above, converter 54 may be implemented with an up/down counter that is advanced by the clock, where the up/down control of the counter is responsive to comparator 53. When the comparator output indicates that the voltage at terminal 52 is lower than the voltage at terminal 51, the need is to reduce the count in the counter and, therefore, the up/down control is set for "count-down".
When the parallel arrangement of resistive paths in block 44 comprises subsets of transistors in accordance with the coarse/fine control schema described above, converter 54 is only slightly more complex. It can be implemented, for example, with a binary up/down counter as described above, followed by a number of sub-converters that are responsive to the up/down counter. The sub-converters convert a binary number to an equivalent number of 1's. In the implementation described above where there are two subsets and where the subset of the small transistors includes 16 transistors with a combined width equal to the width of a single transistor in the subset of large transistors, a first sub-converter is connected to the four least significant bits of the up/down counter and a second sub-converter is connected to the higher order bits of the up/down counter.
As suggested above, the bridge of FIG. 4 operates on impedance 44 but impedance 44 merely evaluates the characteristics of the integrated circuit. More particularly, impedance 44 evaluates the variability in the integrated circuit characteristics from some nominal value. This evaluation is reflected in the control signals that are developed by converter 54. If block 20 is constructed in a manner that is compatible with the construction of impedance block 44 then, consequently, the developed control signals that are applied to digital impedance block 44 can be applied to block 20 directly. For example, when the parallel resistive paths within block 44 are of equal impedance, and the parallel resistive paths within block 20 are also of equal impedance, then the digital control signals developed by converter 54 can be applied directly to bus 21. The resistances of the resistive paths in block 20 need not be the same as the resistances of the resistive paths in block 44; but when they are not, the effective impedance presented by block 20 is different from the effective impedance presented by block 44 (but a fixed ratio between their values is maintained). Actually, a different resistors schema can exist in block 20 than in block 44 (e.g. binary values in one, and equal values in the other) but, if that is the case, the control signals of impedance block 20 must be appropriately translated to correspond to that different schema. Such translation may be accomplished with a separate translator (not shown) that is interposed between converter 54 and bus 21. The sub-converters described above are such translators.
When the differential voltage applied to comparator 53 reaches a minimum, the operation of the FIG. 4 circuit tends to result in oscillations, with the output of comparator 53 regularly alternating between logic level 1 and logic level 0. Although such oscillations are not a real problem, it makes sense to block the oscillations from the control to block 20. The advantage in such isolation lies in the fact that the signal lines that communicate the digital information to block 20 do not have to be continually raised to one level only to be lowered to another level at the subsequent clock period. This conserves power and prevents injection of unnecessary noise that is induced by the switching. In FIG. 4 this isolation is carried out with detector block 56 and register 57. Block 56 is connected to comparator 53. It is set to detect the presence of a sequence of alternating 1's and 0's (i.e., a chosen number of 1,0 pairs) in the logic output of comparator 53. When the sequence it detected, it develops a disablement signal and applies it to register 57. Register 57 is connected to the output of converter 54 so that each change in the output of converter 54 is reflected in the output of register 57 until the disablement signal freezes the output of register 57. The output of register 57 remains frozen as long as comparator 53 continues to output a sequence of alternating 1's and 0's.
In FIG. 4, the output of register 57 is a set of digital signals that are applied to bus 21 of FIG. 3. Actually, since it is expected that register 57 will alter its state rather seldomly, the expected data rate between the bridge of FIG. 4 and the NAND gates of FIG. 3 is very low. If signal lines are very expensive to create (e.g. occupy too large a portion of the substrate), the information from the bridge of FIG. 4 to the NAND gates of FIG. 3 can be sent serially. This can be done by sending the shift-right/shift-left signals of converter 54 (which are enabled by detector 56) directly to the FIG. 3 circuit, where a converter that is similar to converter 54 is included.
It is quite likely that the control signals applied to digital impedance block 20 are different from the control signals that need to be applied to digital impedance block 30. This is because the transistors in block 20 have a back-gate bias effect which the transistors in block 30 do not.
FIG. 5 presents the circuit for creating the control signals for block 30. It is essentially identical to FIG. 4, except that in FIG. 4, a fixed "reference" impedance 43 is employed, while in FIG. 5 a digital impedance block 45 is used. Block 45 is identical to block 44 of FIG. 4 and is controlled by the signals controlling block 44 (after register 57). In FIG. 5, the impedance that is controlled and thus modified is digital impedance 46.
As suggested above, the accuracy of the impedances derived with the digital control signals developed in the FIG. 4 and FIG. 5 circuits is related to a) the accuracy of the ratio of impedances 41 and 42 and b) the accuracy of the absolute value of impedance 43. Since the only element that must be accurate in the absolute sense is impedance 43, it means that all of the other elements contained in FIGS. 1-5 can be created within an integrated circuit substrate, together with functional circuitry 100. As for impedance 43, until a technique is developed for creating an accurate impedance on a substrate, impedance 43 must be realized with an "off the chip" component. Of course, it is known that under certain circumstances accurate resistors can be created in silicon with the use of laser trimming, laser/electrical blowing of links, etc.
It should be noted that there is a need for only one reference impedance 43 for as large a circuit (functional circuitry 100) as is reasonably expected to maintain the same, or tracking, characteristics. In the case where the same impedances are needed and those impedances are subjected to the same variations to which impedance 20 is subjected, the control signals applied to block 20 can be applied to all impedances that are connected between an output terminal and the negative fixed potential, and the control signals applied to block 30 can be applied to all impedances that are connected between an output terminal and the ground potential. In the case where there is a fixed relationship between the block 20 impedance and some other impedances, a translation circuit can be interposed between the control circuits of block 20 and the control terminal of those different impedances. This is illustrated in FIG. 6 where the digital control signals generator 110 sends digital signals to controlled impedances 103 and 105 of functional circuitry 100, and translation circuit 102 translates those signals and sends them to other controlled impedances (e.g. 104) of functional circuitry 100. Note that reference source 120 is outside circuitry 100. Translation circuit 102 can actually be modifiable, for example under program control, and that is depicted in FIG. 7 with translators 105-109.
The FIG. 3 diagram depicting digital impedance block 20 creates an impedance that is also controlled by an input signal (terminal 26). The control at terminal 26 basically enables the impedance when the appropriate input signal is applied, and completely disables the impedance otherwise. This effectuates the switch action of FIG. 1 and serves the function of the digital signal control of element 20. Element 20, thus, is not merely an impedance, but a controlled impedance signal transmitting element. When a terminal is used to receive information, no such switch action is necessary or desired in the impedance presented at the terminal. Rather, what is needed is a fixed input impedance of a given value. This can easily be achieved by simply replacing NAND gates 25 in FIG. 3 with inverters that are responsive to the control signals of bus 21. Or, for certain applications where the digital impedance serves the function of an input terminating impedance, it nevertheless can be disabled by the signal at terminal 26.
In some cases it is known that the signal applied to an input terminal is uni-directional, in the sense that current always flows in one direction through the terminal (e.g., into the terminal). The current may alternate between a large value and a small value, but it may still be uni-directional. Such a condition exists, for example, when the source that delivers such a signal is an emitter coupled logic (ECL) device. In such a circumstance, there is no need to provide two digital impedances as depicted in FIG. 2. One is sufficient.
There are also some applications where power is delivered at a terminal in a uni-directional manner and it is not important to provide an equal impedance in the other direction. For example, an integrated circuit that drives a laser diode delivers power to the diode only at logic level 1. Again, only one of the digital impedances in FIG. 2 need be used.
The above disclosure addresses primarily the issue of controlling the value of an impedance presented at a terminal of the circuit. It should be appreciated that this is a very important capability in integrated circuit technology where precise impedances are hard to come by. However, the principles of this invention may be applied to other aspects, such as controlling the manufacturing variability of other components within the integrated circuits (and thereby more tightly controlling the operational characteristics of such circuits). For example, control of the characteristics of a MOS transistor as a transistor.
When an integrated circuit is designed, it is almost always possible to analyze the design (prior to the circuit's manufacture) and identify sections of the circuit, or specific elements of the circuit, i.e., transistors, that are critical to the operation of the circuit in one sense or another. Typically, the parameter of interest to designers is speed of the circuit (or, frequency response of the circuit), delay of signals through the circuit, and power consumption of the circuit. Having identified the critical elements in a circuit, the designer may choose to alter the design by replacing all critical transistors with their digitally altered equivalents (FIG. 3 elements). Thus, when a manufactured integrated circuit happens to come out of the production line with all transistors larger than expected, the digital equivalents adjust themselves during the circuit's operation, according to the principles diclosed herein, to reduce their effective size. A reduction in the transistor's effective size decreases its speed, increases its impedance and reduces its power consumption.
The capability to affect the critical transistors in functional circuitry 100 is suggested in FIG. 1, with blocks 100 (which may be identical to blocks 20 or 30, depending on their placement within circuitry 100). The capability is merely suggested because the exact placement of blocks 101 within circuitry 100 depends on the circuit itself and does not form a part of this invention.
The above disclosure concentrates on controlling the effective size of transistors in order to control a terminal's impedance or to compensate for manufacturing variations in elements within the functional circuitry of the integrated circuit. As disclosed above, this is accomplished with the aid of a bridge having a reference impedance 43 and an "IC sampling" impedance 44. The bridge arrangement develops signals that control the effective size of the transistors. However, control of the effective size of a digitally sized transistor does not have to be limited to a measure of the integrated circuit's variability from a reference. The effective size of the transistor can also be controlled from a measure of the functional effectiveness of the function circuit itself. This is a utilization of the digital size control of a transistor in the classic feedback or feed-forward mode.
FIG. 8, for example, depicts elements of a system where an integrated circuit 120 is coupled to a laser diode 121 at a terminal 122. The light output of laser diode 121 is coupled to fiber 123, passes through the fiber, and at the "far end" is applied to light detector 124. The electronic output of detector 124 is applied to peak detection means 125 which compares the received signal peak to a given threshold. With a circuit not unlike converter 54 of FIG. 4, a digital signal is developed which is indicative of how closely the received peak signal approaches the desired peak, as specified by the given threshold. That digital signal is communicated via path 126 back to integrated circuit 120, where it is appropriately buffered and applied to the digitally controlled drive circuit 127 that drives laser diode 121 through terminal 122, to affect the amount of power that is injected into laser diode 121.
|Brevet cité
|Date de dépôt
|Date de publication
|26 juil. 1972
|6 nov. 1973
|Hitachi Ltd
|Light amplifier for use in optical communication system
|3 aoűt 1979
|12 janv. 1982
|Pitney Bowes Inc.
|Communication means with transducer physically spaced from interior wall of secure housing
|29 mars 1982
|27 mai 1986
|International Business Machines Corporation
|Versatile digital controller for light emitting semiconductor devices
|21 mai 1984
|1 juil. 1986
|Banner Engineering Corp.
|Automatic power control for modulated LED photoelectric devices
|4 févr. 1986
|8 mars 1988
|Audio System Db Ag
|Circuit arrangement for electronically generating a resistor setting and audio system based thereon
|5 nov. 1987
|8 aoűt 1989
|Texas Instruments Incorporated
|Output buffer having programmable drive current
|9 juil. 1990
|10 mars 1992
|Cselt - Centro Studi E Laboratori Telecomunicazioni S.P.A.
|Automatic system for adjusting the output impedance of fast cmos drivers
|7 juin 1990
|28 juil. 1992
|International Business Machines Corporation
|Self-adjusting impedance matching driver
|24 oct. 1991
|8 déc. 1992
|Intel Corporation
|Ultra-low noise port output driver circuit
|Conf. Proc. Military Microwaves 88 5 7/7/88 London (GB); P. G. A. Jones: Digitally Controlled MMIC Attenuators Techniques and Applications pp. 217 222.
|Conf. Proc. Military Microwaves '88 5-7/7/88 London (GB); P. G. A. Jones: "Digitally Controlled MMIC Attenuators-Techniques and Applications"pp. 217-222.
|IEEE Journal of Solid State Circuits, vol. 23, No. 2, Apr. 1988, A Self Terminating Low Voltage Swing CMOS Output Driver , Thomas F. Knight, Jr., pp. 457 464.
|IEEE Journal of Solid-State Circuits, vol. 23, No. 2, Apr. 1988, "A Self-Terminating Low-Voltage Swing CMOS Output Driver", Thomas F. Knight, Jr., pp. 457-464.
|Sensor Circuit, Patent Abstracts of Japan, Publication No. JP 59051303, publication date Mar. 24, 1984, Eguchi Osamu et al. Translation: Abstract only.
|Sensor Circuit, Patent Abstracts of Japan, Publication No. JP-59051303, publication date Mar. 24, 1984, Eguchi Osamu et al. Translation: Abstract only.
|Brevet citant
|Date de dépôt
|Date de publication
|22 avr. 1993
|9 mai 1995
|Honeywell Inc.
|Optical switch with tamper indicating feature for discouraging the use of an external light source to defeat the intended operation of the optical switch
|26 juin 1996
|24 mars 1998
|Lucent Technologies Inc.
|Integrated circuit chip with adaptive input-output port
|8 oct. 1996
|26 mai 1998
|Lucent Technologies Inc.
|Communication system having a closed loop bus structure
|21 avr. 1997
|13 oct. 1998
|Nt International, Inc.
|Low level, high efficiency DC/DC converter
|15 déc. 1995
|15 févr. 2000
|Intel Corporation
|System utilizing distributed on-chip termination
|24 aoűt 1998
|5 sept. 2000
|Samsung Electronics Co., Ltd.
|Integrated driver circuits having independently programmable pull-up and pull-down circuits therein which match load impedance
|18 déc. 1997
|14 nov. 2000
|Lucent Technologies, Inc.
|Integrated circuit having controlled impedance
|4 mai 1999
|26 déc. 2000
|Telefonaktiebolaget Lm Ericsson
|Output buffer circuit with switchable common mode output level
|7 mai 2001
|20 mai 2003
|Cicada Semiconductor, Inc.
|Pad calibration circuit with on-chip resistor
|21 mars 2002
|4 nov. 2003
|Advanced Micro Devices, Inc.
|Method and apparatus for controlling output impedance
|8 sept. 2003
|2 aoűt 2005
|Rambus Inc.
|Calibration methods and circuits for optimized on-die termination
|19 déc. 2003
|27 déc. 2005
|Rambus Inc.
|Calibration methods and circuits for optimized on-die termination
|10 juin 2004
|23 mai 2006
|Theta Microelectronics, Inc.
|One-pin automatic tuning of MOSFET resistors
|6 avr. 2005
|19 déc. 2006
|Rambus Inc.
|Calibration methods and circuits for optimized on-die termination
|20 déc. 2004
|27 mars 2007
|Rambus Inc.
|Systems and methods for controlling termination resistance values for a plurality of communication channels
|28 juin 2005
|24 avr. 2007
|Rdc Semiconductor Co., Ltd.
|Tristate startup operating mode setting device
|6 juin 2003
|8 mai 2007
|Jds Uniphase Corporation
|Integrated driving, receiving, controlling, and monitoring for optical transceivers
|6 juil. 2005
|17 juin 2008
|Rambus Inc.
|Driver calibration methods and circuits
|23 nov. 2005
|5 aoűt 2008
|Rambus Inc.
|Calibration methods and circuits for optimized on-die termination
|19 déc. 2005
|21 oct. 2008
|Rambus Inc.
|Configurable on-die termination
|7 mars 2007
|21 oct. 2008
|Rambus Inc.
|Systems and methods for controlling termination resistance values for a plurality of communication channels
|13 déc. 2006
|28 avr. 2009
|Rambus Inc.
|Calibration methods and circuits for optimized on-die termination
|17 aoűt 2007
|21 juil. 2009
|Rambus Inc.
|Calibration methods and circuits to calibrate drive current and termination impedance
|7 déc. 2007
|1 juin 2010
|Lctank Llc
|Assembling stacked substrates that can form cylindrical inductors and adjustable transformers
|22 juin 2010
|Rambus Inc.
|Calibration methods and circuits to calibrate drive current and termination impedance
|21 oct. 2008
|10 aoűt 2010
|Rambus Inc.
|Configurable on-die termination
|7 mai 2008
|5 oct. 2010
|Rambus Inc.
|Driver calibration methods and circuits
|19 déc. 2009
|12 oct. 2010
|METAMEMS Corp.
|Assembling stacked substrates that can form 3-D structures
|7 déc. 2007
|12 oct. 2010
|METAMEMS Corp.
|Levitating substrate being charged by a non-volatile device and powered by a charged capacitor or bonding wire
|9 janv. 2004
|19 oct. 2010
|Vitesse Semiconductor Corporation
|Output clock adjustment for a digital I/O between physical layer device and media access controller
|7 déc. 2007
|4 janv. 2011
|METAMEMS Corp.
|Using multiple coulomb islands to reduce voltage stress
|8 mars 2007
|12 avr. 2011
|Akros Silicon Inc.
|Digital isolator with communication across an isolation barrier
|19 avr. 2011
|Rambus Inc.
|Calibration methods and circuits to calibrate drive current and termination impedance
|7 déc. 2007
|24 mai 2011
|METAMEMS Corp.
|Decelerometer formed by levitating a substrate into equilibrium
|28 mai 2010
|24 mai 2011
|Rambus Inc.
|Configurable on-die termination
|7 déc. 2007
|21 juin 2011
|METAMEMS Corp.
|Using coulomb forces to form 3-D reconfigurable antenna structures
|29 juin 2010
|9 aoűt 2011
|METAMEMS Corp.
|Assembling substrates that can form 3-D structures
|12 aoűt 2010
|23 aoűt 2011
|METAMEMS Corp.
|Connect and capacitor substrates in a multilayered substrate structure coupled by surface coulomb forces
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|30 aoűt 2011
|METAMEMS Corp.
|Using coulomb forces to study charateristics of fluids and biological samples
|7 déc. 2007
|13 sept. 2011
|METAMEMS Corp.
|Forming large planar structures from substrates using edge Coulomb forces
|7 avr. 2010
|4 oct. 2011
|Intel Corporation
|Staged predriver for high speed differential transmitter
|9 févr. 2011
|6 déc. 2011
|Rambus Inc.
|Integrated circuit with configurable on-die termination
|7 déc. 2007
|17 avr. 2012
|METAMEMS Corp.
|Reconfigurable system that exchanges substrates using coulomb forces to optimize a parameter
|3 aoűt 2010
|7 aoűt 2012
|Rambus Inc.
|Driver calibration methods and circuits
|2 oct. 2012
|Rambus Inc.
|Calibration methods and circuits to calibrate drive current and termination impedance
|6 déc. 2011
|18 juin 2013
|Rambus Inc.
|Integrated circuit with configurable on-die termination
|7 déc. 2007
|10 sept. 2013
|METAMEMS Corp.
|Coulomb island and Faraday shield used to create adjustable Coulomb forces
|30 mai 2013
|27 janv. 2015
|Rambus Inc.
|Integrated circuit with configurable on-die termination
|6 aoűt 2012
|24 mars 2015
|Rambus Inc.
|Driver calibration methods and circuits
|8 sept. 2003
|10 mars 2005
|Nguyen Huy M.
|Calibration methods and circuits for optimized on-die termination
|19 déc. 2003
|23 juin 2005
|Best Scott C.
|Calibration methods and circuits for optimized on-die termination
|6 avr. 2005
|11 aoűt 2005
|Nguyen Huy M.
|Calibration methods and circuits for optimized on-die termination
|10 juin 2004
|15 déc. 2005
|Yannis Tsividis
|One-pin automatic tuning of MOSFET resistors
|23 nov. 2005
|6 avr. 2006
|Rambus Inc.
|Calibration methods and circuits for optimized on-die termination
|20 déc. 2004
|22 juin 2006
|Rambus Inc.
|Integrated circuit device with controllable on-die impedance
|28 juin 2005
|23 nov. 2006
|Rdc Semiconductor Co., Ltd.
|Tristate startup operating mode setting device
|6 juil. 2005
|11 janv. 2007
|Rambus Inc.
|Driver calibration methods and circuits
|Classification aux États-Unis
|327/108, 250/551, 326/21, 250/205, 327/514, 326/62
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|23 sept. 2005
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text:
Grafenberg Wagrain Resort is a brand new apartment complex with many facilities for all ages. The slopes and the ski lift can be found just 50 meters away from Grafenberg Resort and the ski bus, which stops outside the resort, will take you to other parts of Schladming Dachstein ski area. The apartments are modern with a flat screen TV, free Wi-Fi, and can accommodate up to eight people. Grafenberg Resort is a family resort and there is a play area for children. The adults can relax in the wellness center / spa. The sauna, steam room and whirlpool are available free of charge. At the end of the afternoon you can chat about your day on the slopes with a drink in the bar at the resort. In the morning, if you are half-board, you can even have breakfast in your apartment and after your breakfast find your boots in the heated ski storage, ready for another day in the snow.
Interested in the prices?
The huge Ski Amade consists of five different areas: Salzburg Sports World, Hochkönig, Schladming-Dachstein, Gastein Grossarltal. Together they account for around 270 lifts and approximately 860 kilometers of groomed slopes. These areas are among the best in the world and the world championships are held here regularly. This area also benefits from a long season and the Dachstein glacier can often be skied into April. Is there little snow when you are travelling? No problem. Snowblowers are ready to cover up to 88% of the slopes with a beautiful white powder coating. This year, the number of Wi-Fi hotspots expanded to about 300. These hotspots are located in the valley and mountain stations and a also within number of huts and mountain restaurants. You just log in and can easily plan your ski route, keep in touch with home or do some shopping while up the mountain! With the Ski Amade ski pass you can ski in all five ski areas. These areas are not connected to each other, but accessible with public transport.
Sunweb Holidays offers options to the following areas:
Salzburg Sports World - Ski Amade
The ski resorts of Flachau, Wagrain, St. Johann-Alpendorf, Radstadt, Altenmarkt-Zauchensee, Kleinarl, Eben and Filzmoos ski together form the Salzburger Sportwelt. The approximately 350 kilometers of slopes and over 90 ski lifts make this a paradise for people who love beautiful ski tours.
The simple and intermediate pistes ensure that beginners and intermediate skiers can enjoy the entire ski area. There are also some challenging black runs, particularly Zauchensee (accessible via Flachauwinkl). The ski resort of Filzmoos is not directly connected to the other ski areas. In Filzmoos there are 8 lifts and 13 km varied slopes. Salzburg Sports World offers approximately 230 kilometers of cross-country trails!
Hochkönig - Ski Amade
This welcoming and cozy ski resort at the foot of the Hochkönig is a dream for skiers, snowboarders, skiers, hikers and families with children. From the quaint villages Mühlbach, Maria Alm Dienten you can enjoy a beautiful day on the snowy slopes. From Maria Alm the cable car brings you directly up to the 2000 meter high Aberg where the best slopes are.
For snowboarders in Dienten there is loads to choose from, including a 35 meter half pipe! Cross-country skiing can be done around all three villages and in total there are about 40 kilometers of trails. The longest trail in Maria Alm is 12 kilometers long. In Maria Alm is a 2 km long trail that is even lit during the evenins!
Schladming-Dachstein - Ski Amade
This ski area Schladming-Dachstein is one not to skip! The world championships are held from 4 to 17 February 2013. During the World Cup 2013, 85% of the slopes are open so everyone can ski to your hearts content. The ski slopes in the Hauser Kaibling, Hochwurzen and Reiteralm before and during the world championships just opened. The annual night slalom, is not only a serious race, but also a festival with lively music, that will attract thousands of visitors on January 24, 2013.
This modern ski resort has nine mountains with three of them above 2000 meters in altitude. Four of the nine mountains in this area are connected by connecting Elevators: Hauser Kaibling, Planai, Hochwurzen and Reiteralm. Schladming-Dachstein offers lots for advanced skiers. The Planai, for example is very fast with steep slopes and the Reiteralm has, among other things, a black mogul field! On the Planai you can even measure your speed, and if that is not enough, your action shots you can be put straight onto the Internet to show off to your friends back home!
Families can visit the excellent Galsterbergalm, Fageralm, Stoderzinken and, on the other side of the Enns Valley, Ramsau am Dachstein. In Ramsau you can also take one of the many cross-country trails, it is also a hikers delight. On the Planai you will find beautiful beginner slopes, and there is the Hopsi-Kinderland. A beautiful descent through the woods that takes you to Haus im Ennstal from the Hauser Kaibling. The Hofi area on this mountain is suitable for beginners and snowboarders.
This accommodation has special conditions for groups of different sizes. Please fill in the size of your group.
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How did Ron Paul lose Alaska?
Posted By kurtnimmo On March 8, 2012 @ 2:27 pm In Old Infowars Posts Style,Tile,U.S. News | Comments Disabled
Eric Christopher Adams
Alaska Dispatch
March 8, 2012
How did Ron Paul lose Alaska?
Paul's ardent supporters here in the 49th state were on Wednesday casting a wide net, including allegations of polling impropriety, disenfranchisement and other shenanigans by Alaska Republican Party officials.
As the only Republican presidential candidate to make the lonely journey to Alaska this election cycle, and with a groundswell of support from the state's libertarian-leaning independents, many national pundits and local political watchers had expected a Ron Paul win here on Super Tuesday.
It did not come to pass. Paul ended up placing third in Alaska's presidential preference poll. Mitt Romney won Alaska by the skin of his nose, taking 32.4 percent of the vote, according to The Associated Press. Rick Santorum, in what seemed surprising, came in a strong second here, taking 29.2 percent. Paul received 3,175 votes, or 24 percent of the turnout. That should net Paul about six delegates to the GOP National Convention in August.
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Hunter Douglas Acquires Gulf Coast Window Covering
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My Second "Daily Wild" post, Crabapple Spring and Fall The gear: Canon T2i (550D), 70-200 L, Final Cut Pro, Compressor
Crabapple Spring and Fall
Do You See What I See?
For a week, I'm going to post a nature related video every day. That's the idea, at least. Hopefully, it will continue and I can go for longer. If you see any wildlife or nature related stuff in WNC, please let me know. I'd love to check it out and record it for others to […]


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About the Modest Means Project
The purpose of the Arizona Modest Means Project is to provide low-cost legal assistance to people who cannot afford the expertise of attorneys at the standard rates, but who cannot qualify for free legal services due to income qualification or other restrictions. The Project serves those whose income is less than or equal to 250% of the federal poverty guidelines.
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Active Questions
|House & Home / 12:36 AM - Thursday August 08, 2013
my neighbor is wasting water...
I live in Texas and in my area there are stage 3 water restrictions which basically states we can only water our lawns once a week. My neighbor has been watering their lawn every night for 3 months straight now!
- Asked by stmeow, A Thinker, Female, 22-25, Dallas, Medical / Dental
Mind your own business. Innocent people do not need their lives ruined because of snitches who think they're doing the world a favor by brown nosing the authorities who make up asinine *rules*.
- Response by jillopo, An Alternative Girl, Female, 29-35
Community Rating: Community Star
Oh, dear. First,you "wrote up a letter to them and made it look like it was from our Town Hall, it even has the logo on it and everything." Be glad you didn't put in on their door or anywhere else, because that may have cost you some jail time.
- Response by texasgg, A Married Girl, Female, 56-65, Houston, Self-Employed
First off, your idea is great but it is illegal. What you need to do is to get a petition out and speak with your community about it and let them be aware of the situation. That way more voices your town hall hears, the more likely they will listen. However, I am curious though, watering at night is a sneaky way to do it, therefore you should video tape there land too as to when it starts to when it ends. So you have more work madam. But if you want a camera set up. You need a timer for it and you need it set so it only goes off at a certain and leave it on for a week to prove your point and also share it with your community. I hope this helps.
- Response by womanv, A Career Woman, Female, 36-45, New York, Self-Employed
why ru so concerned about your neighbor wasting water? i think that is her problem. I know "tamppering" with a mailbox is illegal but i would be more concerned about using a town hall logo. I think thats illegal and there is a word for it but i cant think of it now. like plagerism or something like that. i guess that it is stealing someone elses words or logo. if it were me, i would not do it but its up to U
- Response by need2knowy, A Creative, Female, 26-28, Who Cares?
They are selfish and inconciderate. I hate when some think they are above the law.If the town allows them there is not much you can do.
- Response by frenchkiss49, A Thinker, Female, 66 or older, Tampa, Who Cares?
Mind your own water business.....
- Response by richard77, A Creative, Male, Who Cares?
Mind your own business. What goes around comes around.
- Response by doodlebug612, A Sweet Sarah, Female, 36-45, Cleveland, Who Cares?
Sooooo.... what happened?
- Response by pjd1701, A Guy Critical, Male, 29-35
There is nothing that you can do unless you do something illegal like herbicides or cutting hoses. I would through beer cans right at the property line and park a coupled of junk cars there too. -Richard
- Response by stick4013, A Creative, Male, 66 or older, Artist / Musician / Writer
With water restrictions, they usually get people because of reports from the water company, that their bill is higher than it should be if they were obeying restriction.
- Response by jjcabin, An Intellectual Guy, Male, 46-55, Washington, DC, Technical
- Response by pjd1701, A Guy Critical, Male, 29-35


text:
« Peptide Craziness |
| Back To Life »
Posted by Derek
The hexacyclinol controversy has taken a very interesting new twist, which I learned about on Friday from Dylan Stiles. To recap: the molecule is a complex natural product, which was the subject of a total synthesis paper earlier this year by James La Clair. The paper had several unusual features, such as single authorship with acknowledgements to several unnamed co-workers, an odd source (the "Xenobe Research Institute" and "Bionic Bros. GmbH" and (not least) several key chemical steps that appear to make little sense, backed up by fishy NMR data.
Then Prof. Scott Rychnovsky of UC-Irvine popped up with a proposal that the structure of hexacyclinol had been wrongly assigned in the first place. He assigned a completely different structure, with rather solid-looking reasoning behind it, which raised the question of just what La Clair had synthesized. How can you get the right spectral data by making the wrong structure, when the structures are so different as to make that impossible?
Turns out that Rychnovsky had another ace to turn over. The web site for Angewandte Chemie, where the original La Clair paper ran, has now put up advance notice of a paper on the synthesis of the revised structure of hexacyclinol, which appears to indeed match the published spectral data. This grenade is from Paul John Porco at BU, some of his students, and. . .Scott Rychnovsky, who apparently wasn't going out on as much of a limb as I thought.
La Clair has seen the writing on the wall, and apparently realizes that he has indeed been weighed in the balance and found wanting. During the day on Friday, the Xenobe Research Institute web page was updated. It now features Rychnovsky's revised structure (Update: or does it? See the comments!), with this text:
Desoxoudol (previously named desoxohexacyclinol)...
Efforts are underway to identify pathways that regulate the growth and development of four parasites responsible for Malaria, Plasmodium vivax, P. malariae, P. falciparum and P. ovale. Our first study conducted on desoxohexacyclinol, currently renamed as desoxoudol, is a terpene isolated from cultures of a German Borstiger Knäueling mushroom (Lentinus strigosus = Panus rudis Fr.). Earlier 2006, Dr. La Clair published the synthesis of desoxoudol demonstrated its conversion to udol and 5-epi-udol. Due to the unconventional nature of this effort, efforts are now underway to repeat this isolation and synthesis. Samples of these intermediates will be verified through analysis by a panel of external laboratories.
Unconventional. . .well, yeah, in a way. It's unconventional to synthesize a complex molecule and get the NMR structure of something completely different, that's for sure. But it's very conventional indeed to go back and attempt to spray-paint the record to make it appear as if something strange and embarassing hadn't happened. Oh, that part happens all the time. And that's exactly what I think is going on here.
For more comments on all this, see the Stiles link and The Chemblog. This is turning into the biggest stink-bomb in organic synthesis in many years.
Comments (12)
+ TrackBacks (0) | Category: Chemical News
1. MTK on July 23, 2006 10:55 PM writes...
After reading through all the comments on this and the tenderbutton blog, I was struck that not one person asked for the names of the five technicians who worked on this project.
If this is fraudelent, I doubt that he could produce five people who could all get their stories straight.
2. McPostdoc on July 23, 2006 11:39 PM writes...
I'm sure La Clair's talk at the upcoming ACS meeting will be quite entertaining. I won't be there, but I bet there will be a plethora of chemists willing to report the details.
Oh, and it's John Porco, not Paul.
3. Canuck Chemist on July 24, 2006 1:28 AM writes...
This Xenobe Research Institute looks very fishy indeed. If you go to the website (xenobe.org), you will find that they have no addresses, no contact information, and no descriptions of anyone involved in the organization. It describes itself as a non-profit organization, involved in over 80 studies. Has anyone met anyone other than Dr. LaClair who is a part of this organization? Where are the donors to pay for all these studies? This kind of "mystery" seems more like something one would see from someone trying to sell miracle cures to gullible people. I'm guessing that something of this level of fishiness in the small and well-educated world of organic synthesis and chemical biology must take an extremely high level of self-delusion. It'll be interesting (but likely not pretty) to see how this plays out.
4. Still Scared of Dinosaurs on July 24, 2006 5:24 AM writes...
Right near the top of the list of reasons I never, in earnest, advocate cheating is the conviction that I'm gonna get caught. This is in the analysis of clinical trials data, where something like a fortuitous (sp?) programming error could easily be excused, especially when cheating takes the form of finding the bug and not reporting it.
It just stuns me that someone could try to cheat, and I'm assuming this is the case here based on my very nonexpert reading of the above, when reporting molecular synthesis, cloning humans, missing link skulls, divinely regulated evolution, WMDs, honest elections in Ohio, the Prime Minister of Germany secretly wants you, and stuff like that.
On second thought, maybe there is reason to believe you can get away with anything in this world.
5. JM on July 24, 2006 5:34 AM writes...
Derek - the structure posted on the Xenobe website is not Rychnovsky's new structure. It is actually the original structure from the J Antibiotics isolation paper - in his arrogance LaClair has just renamed it! So, all he has conceded is that hexacyclinol is the name that should be used for Rychnovsky's structure - LaClair still believes that Desoxoudol is isolated from the natural source and that the proposed structure is correct.
6. JSinger on July 24, 2006 8:50 AM writes...
My favorite, in the ChemBlog comments:
Oh my, Scott D. Rychnovsky's student is in the same session as La Clair. This will be the best ACS conference ever.
7. MTK on July 24, 2006 11:26 AM writes...
I'm actually a little dismayed at some of the comments regarding the ACS meeting. It's almost like people going to a car race just to see the wrecks. Some of the poters want to see a steel cage death match, not a real scientific debate. I can understand the appeal of a good debate and the fireworks that can result, but this looks like it's going to have all the suspense of the Christians vs. lions.
8. Elia Diodati on July 24, 2006 4:37 PM writes...
If anyone's interested, I did a reasonably high-level ab initio calculation on the two reported structures. At the LMP2/cc-pVDZ level of theory with optimized geometries, La Clair's structure has a higher ground state energy than Rychnovsky's structure by 61.87 kcal/mol. It's not a screaming red flag, but it's worth noting.
9. Petros on July 25, 2006 4:14 AM writes...
Fascinating saga. Sounds like the ACS session might be entertaining, if JJC shows up.
Interestingly Googling around finds such wonders as
"James J. La Clair, Founder, BIONIC Bros GmbH,"
"The BIONIC BROS GmbH, a Berlin Germany based bioelectronics company, announce the release of a new Artificial Life gaming engine. Initially developed for the biotechnolgy and information technology sectors, the engine behind this game offers a dynamic realm of new challenges for its players. The game is in itself a piece of scientific research. A sneak preview of the this system can be viewed now through www.bionicbros.de. It can be played simultaneously using cards, dice or a PC."
And JJC still found time for all that synthesis as well.
10. Steven Jens on July 26, 2006 8:42 PM writes...
MTK, surely there is room at the ACS conference for both serious scientific debates and really cool car crashes, don't you think?
11. Hap on July 28, 2006 12:20 PM writes...
There is now a C+E News story on this fiasco in which the writers talked to Dr. La Clair (and in which he is quoted), and at Chemical Forums there is an account by another scientist as the Natural Products Gordon Research Conference in which Dr. La Clair gives an explanation of the situation (although the author was inebriated, the account is confirmed by another attendee who wrote on Dylan Stiles' blog (the original posting site) - don't know either of them though).
This just keeps getting more bizarre.
12. MTK on July 28, 2006 1:52 PM writes...
I guess a fiery wreck or two is OK.
I'll admit I'm wavering on this one bit. On one hand, I'm not in favor of public executions, but on the other hand, the guy has it coming to him.
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