text:
Circuit boards are manufactured by forming a substrate with a dielectric surface, laminating a metal foil and a peelable film to the substrate, and forming holes in the substrate through the peelable film and foil. A filler material with an organic base may be filled with electroconductive particles or dielectric thermoconductive particles. The filler material is laminated onto the peelable film with sufficient heat and pressure to force the filler material to fill the holes. For thermoconductive filler the holes are filled sufficient for electrical connection through the holes. The filler material is abraded to the level of the foil and is then copper plated. The copper is patterned to form a wiring layer. A permanent dielectric photoresist layer is formed over the wiring layer and via holes are formed through the photoimageable dielectric over pads and conductors of the wiring layer. Holes are formed through the substrate and the photoimageable dielectric, walls of the via holes, and walls of the through holes are copper plated. The copper plating on the photoimageable dielectric is patterned of form an exterior wiring layer. Components and/or pins are attached to the surface of the circuitized substrate with solder joints to form a high density circuit board assembly.
1. A method for producing a circuit assembly, comprising:
providing a circuitized substrate;
forming holes in said circuitized substrate;
providing a filler material;
injecting said filler material into said holes;
forming a first wiring layer of patterned metal on a surface of said circuitized substrate including plating an external surface of said filler material with electroconductive metal;
depositing a layer of photoresist over said first wiring layer;
forming conductive vias through said layer of photoresist;
forming a second wiring layer over said layer of photoresist including forming connectors to electrically connect electronic components to said second wiring layer;
providing electronic components with terminals;
providing joining material on said connectors or said terminals of said electronic components, or both;
placing said components onto said circuitized substrate with said terminals positioned for connection to said connectors; and
heating said joining material sufficient to form interconnection joints.
2. The method of claim 1 in which:
the step of providing said joining material comprises providing an electroconductive organic based material.
3. The method for producing a circuit assembly of claim 1, further comprising securing a structure having at least one separable layer to said circuitized substrate prior to forming holes in said circuitized substrate and injecting said filler material into said holes, and thereafter removing said at least one separable layer of said structure.
4. The method for producing a circuit assembly of claim 3 further comprising:
providing a metal foil; and
laminating a removable covering to said metal foil, thereby forming said structure having said at least one separable layer.
5. The method for producing a circuit assembly of claim 1 in which the step of providing a filler material further comprises:
providing an organic base; and
filling said organic base with electrically conductive particles.
6. A method for producing a circuit assembly, comprising:
providing a circuitized substrate;
forming holes in said circuitized substrate;
providing a filler material;
spreading said filler material against said circuitized substrate;
placing a sacrificial carrier in contact with said filler material;
applying sufficient heat and pressure to said sacrificial carrier to force said filler material into said holes, substantially filling said holes;
forming a first wiring layer of patterned metal on a surface of said circuitized substrate including plating an external surface of said filler material with electroconductive metal;
depositing a layer of photoresist over said first wiring layer;
forming conductive vias through said layer of photoresist;
forming a second wiring layer over said layer of photoresist including forming connectors to electrically connect electronic components to said second wiring layer;
providing electronic components with terminals;
providing joining material on said connectors or said terminals of said electronic components, or both;
placing said components onto said circuitized substrate with said terminals positioned for connection to said connectors; and
heating said joining material sufficient to form interconnection joints.
7. The method of claim 6 in which the step of providing said joining material comprises providing an electroconductive organic based material.
8. The method for producing a circuit assembly of claim 6, further comprising securing a structure having at least one separable layer to said circuitized substrate prior to forming holes in said circuitized substrate and injecting said filler material into said holes, and thereafter removing said at least one separable layer of said structure.
9. The method of producing a circuit assembly of claim 8, further comprising:
providing a metal foil; and
laminating a removable covering to said metal foil, thereby forming said structure having said at least one separable layer.
10. The method of producing a circuit assembly of claim 6 in which the step of providing a filler material further comprises:
providing an organic base; and
filling said organic base with electrically conductive particles.
This invention relates to high density computer systems using circuit board assemblies and manufacture of circuit board assemblies in which surface mount components and pin in hole components are attached to circuitized substrates by soldering component terminals into plated through holes and to connection pads on the substrate. More particularly this invention relates to methods for forming electrically conductive vias between buried wiring layers; forming multiple very fine external wiring layers; and organic materials made conductive by filling with conductive particles.
The following background is for convenience of those skilled in the art and for incorporating the listed citations by reference. The following background information is not an assertion that a search has been made, or that the following citations are analogous art, or that any of the following citations are pertinent or the only pertinent art that exists, or that any of the following citations are prior art.
The continued introduction of very high I/O and very high density surface mount components especially 0.2-0.4 mm gull wing leaded components, 40 mil ball grid array BGA modules, as well as the direct connection flip chips to circuit boards, has resulted in a need for very high density conductor fan out at these components. At the same time, decrease in the size of plated through holes PTHS which interconnect between wiring layers, has not kept up with these requirements for fan out. PTHS require substantial surface area which can not be easily reduced because seeding and plating require circulation of fluids in the holes. Reducing the size of connections between wiring layers has become critical for continued increase in circuit board density.
For such high density surface mount components, solder volumes are a critical process variable, but when components are attached to PTHS even those filled with solder, the solder volume between the terminals of the components and the PTHS can not easily be controlled.
Those skilled in the art are directed to the following references. U.S. Pat. No. 4,967,314 to Higgins, III suggests filling via interconnect holes with a conductive epoxy. U.S. Pat. No. 3,163,588 to Shortt suggests stripable frisket, seeding and electroplating. Face Protection of Printed Circuit Boards by McDermott in IBM Technical Disclosure Bulletin Vol. 11 No. 7 Dec. 1968 describes peelable coverings and pressing resin into plated through holes. Printed Circuit Base by Marshall in IBM TDB Vol. 10, No. 5, October 1967, describes a sensitizing material. U.S. Pat. No. 4,590,539 to Sanjana discloses epoxies, fillers, curing agents, and catalysts. U.S. Pat. No. 4,791,248 to Oldenettel suggests peel apart coverings, filling holes with resin, and planing off resin nubs. U.S. Pat. No. 4,893,440 to Shirahata discloses buried vias and electroconductive organic based paste. U.S. Pat. No. 4,964,948 to Reed suggests methods for seeding a substrate for electroplating. U.S. Pat. Nos. 4,991,060 and 5,028,743 to Kawakami suggests filling through holes with electroconductive paste and buried vias. U.S. Pat. No. 5,065,227 to Frankeny suggests electrically conductive paste filling a via hole. U.S. Pat. No. 5,243,142 to Ishikawa discloses hole fill. U.S. Pat. No. 5,271,150 to Isasaka discloses manufacturing methods for multi-layer ceramic substrates including filling holes punched in green sheets with conductive paste. U.S. Pat. No. 5,319,159 to Watanabe suggests method of manufacturing a double sided printed wiring boards with resin filled PTHs. Japanese application 2-045998 suggests filling through holes with electroconductive thermosetting paste. Japanese application 2-184626 to Honda suggests using a novolac epoxy resin such as cresol novolac epoxy resin for a circuit board. U.S. Pat. No. 5,346,750 to Hatakeyama suggests a method to prevent bleed out of paste from a filled via. U.S. Pat. Nos. 4,354,895 to Ellis, 5057372 to Imfeld, and 5,262,247 to Kajiwara suggests a metal foil with a peel apart protective layer. U.S. Pat. Nos. 5,200,026 to Okabe and 5,266,446 to Chang suggest processes for forming thin film structures on substrates. U.S. Pat. Nos. 4,940,651 to Brown, 5,026,624 to Day, 5,070,002 to Leech, 5,300,402 to Card, 5,427,895 to Magnuson, and 5,439,779 to Day discuss photoresists. U.S. Pat. Nos. 4,127,699 to Aumiller, 4,210,704 to Chandross, 4,731,503 to Kitanishi, 4,747,968 to Gilleo, 4,822,523 to Prud'Homme, 4,880,570 to Sanborn, 4,904,414 to Peltz, 4,999,136 to Su, 5,082,595 to Glackin, 5,220,724 to Gerstner, and 5,463,190 to Carson suggest various electrically isotropically conductive organic materials. New Avenue for Microvias in Electronic Engineering Times, Mar. 18, 1996 p. 68 reports that Prolinx Labs Corp of San Jose Calif. has developed an additive technology for blind and buried vias filled with conductive material. The proceeding citations are hereby incorporated in whole by reference.
In the invention of Applicants, holes in a first substrate structure are filled with an organic based conductive material and additional substrate layers are laminated to the substrate without causing the organic material to bleed out between the first substrate and the additional substrates during lamination. Also, metal may be plated over the organic material prior to laminating additional substrates onto the first substrate. The organic material may be filled with thermoconductive dielectric particles for better thermal performance or filled with electroconductive particles to provide conductive holes. Conductive vias in the additional substrates may be plated to connect to the conductive material in the filled holes. A cresol-novolac epoxy precursor may be filled with 70-80% by weight electroconductive particles such as copper and/or silver powder and cured and may subsequently be plated with copper. This allows conductive vias such as PTHs filled with electroconductive or thermoconductive material or holes filled with electroconductive material to be buried in the substrate and avoids excessive surface area from being utilized for vias between internal wiring layers. Also, the exterior substrate may be provided with photo-vias which require much less surface area than PTH's. The invention allows decreased wiring lengths between components so that a computer system utilizing such circuit boards will operate at a higher speed.
The invention includes a process for producing the circuit boards of the invention. In the process a peel apart structure including a copper foil and removable film is positioned with the copper foil in contact with the substrate and is laminated to a substrate. Then holes are formed in the substrate through the peel apart structure. Also, a sacrificial carrier is coated with an organic resin filled with conductive particles and then partially cured to form a carrier structure. The partially cured resin is positioned between the removable film and the sacrificial carrier and heat and pressure is applied to force the partially cured filler material into the holes with the peel apart structure acting as a mask. Finally, the removable film, the sacrificial carrier, and the conductive material remaining therebetween are peeled away leaving the copper foil laminated to the substrate.
The surface of the filler material is flattened by abrasion to the same level as the copper foil and the surface of the filler material is plated with copper. The copper foil is patterned to form a wiring layer then a dielectric photoresist is laminated to the wiring layer. Since the filler material is partially cured and covered by electroplated copper it does not bleed from the holes in between the wiring layer and the photoresist. Conductive photo visa which are connected to the wiring layer, are formed through the photoresist and copper is deposited on the photoresist and patterned to form another wiring layer over the photoresist and also connected to the conductive vias.
The invention also includes the structures that result from the process including the substrate with the peel apart structure and carrier structure laminated thereto; the substrate with holes filled with the filler material; and the substrate with the photoresist laminated thereto with conductive vias and exterior wiring layer over the photoresist. The invention also includes an improved circuit board assembly including surface mount components placed at a higher density to allow faster circuit board speeds. Furthermore, the invention includes a computer system which operates faster due to the shorter signal flight times which result from the higher wiring densities of the invention.
Other features and advantages of this invention will become apparent from the following detailed description of the presently preferred embodiments of the invention illustrated by these drawings.
FIG. 1(a)-1(j) is a flow diagram illustrating a specific embodiment of the process of the invention.
FIG. 2(a)-2(c) is another flow diagram illustrating an alternative specific embodiment of the invention.
FIG. 3 schematically shows a portion of a substrate of the invention with holes through a peel apart structure and a transfer structure with filler material before lamination.
FIG. 4 schematically shows the portion of the substrate of FIG. 3 with holes substantially filled with electroconductive material after lamination and peeling apart.
FIG. 5 schematically shows the portion of the substrate of FIG. 3 after additional layers have been formed.
FIG. 6 schematically shows circuit assemblies of the invention assembled into an enclosure with a power supply to form the computer system of the invention.
The following detailed description discusses specific examples and embodiments of the inventions including the best mode for utilizing the inventions, in such detail that anyone skilled in the art may utilize the invention without an undo amount of experimentation.
In step 100 of FIG. 1(a) a circuit board substrate is formed. The substrate may be a ceramic substrate (e.g. alumina, or beryllia); or a metal substrate (e.g. Cu, Al, Invar, Covar, or Cu-Invar-Cu) covered with dielectric material (e.g. polyimide, or epoxy); or an organic substrate (e.g. epoxy) preferably filled with axially stiff fibers (fiberglass or polyaramide fibers) or a flexible substrate of dielectric polymer films (e.g. polyimide) and metal foils (e.g. copper). For example in FIG. 3 circuit board substrate 302 includes two buried metal wiring layers 304,306 (power and ground planes) and three dielectric layers 308,310,312. The dielectric layers may be ceramic or organic material.
In step 102 of FIG. 1(a) metal foil is laminated to a removable covering to form a peel apart structure. Preferably the metal of the foil is copper and the removable covering is a dry polyimide film or a second metal foil. A dry adhesive film may be provided between the metal foil and the removable foil. The adhesion between the adhesive film and the removable layer should be greater than the adhesion between the adhesive film and the metal foil or the adhesive film will have to be stripped off the foil after peeling. Also, for this process a layer of photoresist may be provided between the removable layer and the metal foil. After the removable layer is peeled off, the copper layer will be ready for photolithography. The adhesion between the removable covering should be sufficient to prevent separation during normal handling, but should be sufficiently low to prevent tearing the metal film or removable film during peeling and prevent delamination of the copper film from a substrate during peeling.
A peel apart copper structure is available from Gould.
In step 104 the peel apart structure is positioned adjacent the circuit board with the copper foil against the circuit board substrate. In step 106 the peel apart structure is laminated to the circuit board substrate. The copper foil is laminated to a dielectric surface of the circuit board substrate. These steps may be performed by feeding the boards together with the peel apart structure between two heated rollers. FIG. 3, shows a peel apart structure laminated to each side of the substrate. On the top of the substrate a metal foil 314 is laminated to dielectric layer 308 and removable layer 316 is laminated to metal foil 314. On the bottom of the substrate metal foil 318 is laminated to dielectric layer 312 and removable layer 320 is laminated to foil 318 with intermediate layer 322 between the metal foil and removable film. The intermediate layer may be a photoresist which is left on the foil after peeling to provide for photolithographically patterning the foil. Alternately the intermediate layer may be an adhesive for lamination which is preferably peeled off with the removable layer.
In step 108 holes are drilled into the substrate through the peel apart structure. As shown in FIG. 3, hole 326 extends through the substrate and through both peel apart structures laminated to the surfaces of the substrate. Holes 328,330,332 are blind holes or cavities that preferably extend through the peel apart structure and into the substrate to buried wiring layers as shown. The holes are 4 to 24 mils in size, preferably 8 to 16 mils, most preferably about 12 mils. Filling holes as small as 2 mils may be possible if the substrate is thin and the process is optimized. The through holes may be plated at this time if a dielectric filler material is to be used to provide filled PTHs.
In step 110 of FIG. 1(b) an organic filler material is prepared. The organic material may be filled with electroconductive particles to form an organic based conductive material. Alternately, the organic material may be filled with thermoconductive dielectric particles to increase thermal performance. The organic material may be a thermoset or a thermoplastic resin and preferably is an adhesive (epoxy or silicone) and more preferably 20% to 30% by weight phenol cured cresol-novolac resin. Methyl ethyl ketone solvent may be added to the organic material to achieve suitable viscosity for coating. A tertiary amine catalyst is added for curing. Electroconductive particles may include metal or carbon and may include silver flakes or silver particles but are preferably copper particles. Alternatively the particles may include a transient liquid phase TLP particle system. Preferably the coefficient of thermal expansion of the filler material matches the coefficient of thermal expansion of the substrate in the direction of the through hole. Preferably conductive particles have a maximum size of 6 microns.
TLP systems when initially heated form a molten eutectic alloy portion which immediately resolidifies because the molten alloy portion is in contact with a supply on one of the constituent elements of the alloy which element dissolves into the molten alloy until the molten alloy is no longer eutectic and melting temperature is increased. TLP particle systems for organic based electroconductive materials are based on solder alloys in which the elements of the solder alloys are not yet alloyed. For example binary eutectic solders are alloys of a first metal and a second metal and a binary TLP particle system may contain particles of the first metal coated with the second metal or the first metal coated with the eutectic alloy of two metals or particles of the first metal mixed with particles of a eutectic alloy of the two metals or a mixture of coated particles and uncoated particles. Trinary and quatrinary solders can also be used. TLP particle systems when heated initially form a melted eutectic portion at the particle surface to connect the particles together, but the core of the particles include non-eutectic amounts of one of the metal constituents of the alloy so that as more of the particle dissolves into the molten surface the molten alloy becomes non-eutectic and the melting temperature of the molten portion rises until it solidified even at constant temperature. For example lead particles coated by a tin layer having 3% of the mass of the particle when heated to 180� C., will initially form a molten coating of eutectic 63/37% Sn/Pb alloy, allowing adjoining particles to connect together. As more of the Pb core of the particle dissolves into the molten portion the lead content of the molten alloy increases and melting temperature increases and the molten portion solidifies. Tin particles coated with lead will react similarly and mixtures of pure Pb particles and eutectic Pb/Sn particles will also react similarly where dissimilar particles meet.
In step 112 a sacrificial carrier is coated with the filler material to form a transfer structure and in step 114 the filler material is heated until partially cured. The sacrificial carrier may be a metal foil or an organic film such as polyimide. For thermosets containing solvents partial curing comprises heating for driving out the volatile solvents and for epoxies partial curing includes heating to form long polymer chains until a B-stage is reached. In step 116 the transfer structure is positioned adjacent to the substrate with the filler material against the removable layer of the peel apart structure. FIG. 3 shows a transfer structure on each side of substrate 302. On the top surface of the substrate, filler material 340 is deposited on sacrificial layer 342 and the transfer structure is positioned with the filler material against removable layer 316 of the peel apart structure. On the bottom surface of the substrate, filler material 344 is deposited on sacrificial layer 346 and the transfer structure is positioned with filler material 344 against removable layer 320 of the peel apart structure.
In step 118 the transfer structure is laminated to the substrate with sufficient heat and pressure to force the filler material to fill the holes. For electroconductive filler material the holes must be filled sufficiently to provide electrical connection between the ends of the filled holes. A lamination press is preferred for this lamination step because of the high pressures and relatively high thickness of the transfer structure.
In step 120 of FIG. 1(c) the removable layer along with the sacrificial layer and filler material remaining between the layers is peeled off the substrate. FIG. 4 shows the resulting structure with nubs 350 of filler material extending from the holes. In this view the filler material 352 in through hole 326 is continuous from metal layer 314 to metal layer 318 to provide electrical interconnection. Any voids 354 are sufficiently small that electrical conduction is not significantly affected.
In step 122 the nubs are abraded off even with the external surface the copper foil. This is shown in FIG. 4 where nubs 350 are shown extending above the level of the copper foil 314 and where any filler material extending beyond foil layer 318 has been removed by abrasion (sanding). Alternately the material may be removed by planing.
If only one surface wiring layer is desired on each side of the substrate and unfilled plated through holes PTHs are desired for example to attach pin in hole PIH components, then holes should be drilled through the substrate and seeded for electroless metal plating before step 124.
In step 124 metal is deposited on the filler material and metal foil to form a continuous layer of metal on each of the major surfaces of the substrate. For electroconductive filler material the conductive material may be prepared for plating by exposing conductive particles on the surface of the conductive material. The deposition may include sensitizing or seeding the surface of the filler material and electrolessly plating to form a thin coating of copper on the surface of the filler material. Preferably the deposition includes electroplating of copper onto the filler material on both major surfaces. This step seals the filler material into the holes and for electroconductive material provides a better electrical connection than the connection between the conductive material and the walls of the holes through the metal film. Preferably the plating continues until 0.5 to 2 mils of copper are deposited on the walls of the plated through holes and 0.2 to 1.0 mils are deposited on the surface of the filler material in the holes. FIG. 5 shows the metal plated over the filler material for example at 502.
The metal surface may be vapor blasted and/or treated in a chloriting bath to increase adhesion to a photoresist. Also, microetching or pumice washing may be used to improve adhesion.
In step 130 of FIG. 1(d), a layer of first photoresist is formed over the continuous layer of metal. A liquid precursor may be spun on the surface and cured or more preferably a dry film photoresist 0.1 to 4 mils thick is used. In step 132 the photoresist is exposed to a pattern of electromagnetic radiation or a particle beam. The radiation may be produced in a pattern using a laser or a source of visible light, UV light, or X-ray which may be directed through a mask to form a pattern. The type of radiation or particle beam depends on equipment availability and the chemistry of the photoresist. In step 134 the photoresist is developed to form a first pattern of photoresist. The pattern covers portions of the metal layer which will form a wiring layer on the surface of the substrate. Other portions of the continuous metal layer are exposed and in step 136, the exposed portions are etched away to form a first wiring layer (signal layer). For copper the preferred etchant is cupric chloride but other etchants used for etching copper in circuit board manufacture may be used. The first wiring layer 504 and 506 is shown in FIG. 5. Then in step 138 of FIG. 1(d) the first photoresist is stripped away for example by rinsing with deionized water. The photoresist may be a positive resist in which case exposed portions become softened and are rinsed away to form the photoresist pattern and after etching the remaining photoresist is exposed to radiation and rinsed away to strip the photoresist off the metal layer. Alternatively, for negative photoresists the exposed portions become hardened and the unexposed portions are rinsed away. Then the first photoresist pattern is removed using a solvent or etchant.
Preferably in wiring layers 504,506 a narrow metal land surrounds the exterior ends of the holes filled with filler material as at 507 in FIG. 5.
If only one external wiring layer is desired on each side of the substrate then the circuit board may be completed by covering each side with a layer of solder resist and forming windows in the solder resist for surface mount connection pads. Otherwise if more layers are desired then processing continues as follows.
The following steps 140-166 may be performed sequentially multiple times as desired, to provide multiple wiring layers on each of the surfaces of the substrate.
In step 140 in FIG. 1(e) a layer of second photoresist is formed over the wiring layer. Again, a dry film photoresist is preferred. The second photoresist can be the same material or a different material than the first photoresist and either a positive or negative photoresist. Preferably the second photoresist is a photoimagable and can be treated for use as a permenent dielectric layer (photoimagable dielectric) that can withstand solder reflow temperatures.
If desired, additional holes filled with filler material such as hole 516 in FIG. 5, may be formed some time between steps 140 and 150 by laminating a peelable layer over the photoimagable dielectric; drilling holes through the peelable layer, photoimagable dielectric, and into the substrate; plating the holes with metal if desired; laminating another transfer structure to the peelable layer with sufficient heat and pressure to force the filler material into the holes; and peeling away the peelable layer and transfer structure.
In step 142 the photoimagable dielectric is exposed to a pattern of electromagnetic radiation or particle beam, and in step 144 the photoimagable dielectric is developed to form a corresponding pattern of photoresist. Preferably as shown in FIG. 5, the pattern of photoresist layers 508,510 consist only of via holes such as at 512,514 that extend through the photoresist over pads or conductors of the first wiring layer. In step 146 the photoresist is treated to make it permanent for example by baking a positive photoresist so that it is not affected by subsequent exposure to light. If components need to be attached by solder reflow the permanent photoresist layer must be capable of withstanding those temperatures. Other attachment methods such as ECA component attach require much lower cure temperatures. This step may be required for some negative photoresists so that subsequent plating, etching, developing steps do not affect the photoresist. Other negative photoresists may not require this step.
In step 150 in FIG. 1(f) a third layer of photoresist is formed over the photoimagable dielectric, and in step 152 the third photoresist is exposed to a pattern of electromagnetic radiation or particle beam. Again this is commonly done by directing light (visible, or UV) from a source through a mask. In step 154 the third photoresist is developed to form a third photoresist pattern.
The following steps 156 and 158 are performed when PIH components are required when forming the last wiring layer on each surface of the substrate. For example in FIG. 5 three external wiring layers are provided and PTHs 518 are only provided when forming the final wiring layer.
In step 156 of FIG. 1(f) holes are formed through the substrate to provide interconnection between wiring layers and/or PTHs for PIH components. The holes may be formed by laser drilling, punching, or by mechanical drilling using a drill bit. In step 158 the holes are treated to remove debris and improve electrical connection. For holes mechanically formed using a drill bit, the holes should be deburred and chemically cleaned to remove smear from internal wiring layers for electrical connection thereto.
In step 160 of FIG. 1(g) the surface of the photoimagable dielectric as well as the walls of the photo-vias and any holes for PIH components, are seeded for electroless metal plating. In step 162 a thin coat of metal is formed on the seeded surfaces by electroless plating. In step 164 a thicker metal coating is formed by electroplating. Preferably the thicker coating is copper with a thickness of 0.2 to 4 oz of Cu per square foot, more preferably about 1 oz (0.5-2 oz) per square foot. Preferably the copper is at least 1 mil thick in any plated through holes. Finally in step 166 the layer of third photoresist is stripped to remove metal plating covering the third photoresist and form a second wiring layer. Alternatively, the surface of the substrate may be flattened (planarized) using chemical-mechanical polishing to remove any metal plating the third photoresist to form the second wiring layer.
A second wiring layer 530 is shown in FIG. 5 which is not an external wiring layer. In order to produce the structure of FIG. 5 after steps 140-166 were all completed (except steps 156 & 158 were not done the first time) then the steps were all performed a second time to produce a third wiring layer 532.
In step 170 of FIG. 1(h) a layer of solder resist 533 is formed over the exterior wiring layer 532 as shown in FIG. 5. The solder resist may be applied as a liquid or paste by roller coating, curtain coating or screening onto the surface or dry film may be laminated to the surface. Then in step 172 of FIG. 1(h) windows 534 are formed in the solder resist over pads 536 and 537 for surface mount components and lands 538 for PIH components. Preferably, the photoresist is a photoimagable dielectric and windows are photoimaged and then the dielectric may be cured to make it permanent. For screened solder resist the windows are formed during screening onto the wiring layer. Pads 536 are preferably spaced 5 to 15 mils apart for connection of a flip chip, or 10 to 30 mils for leaded components and pads 537 are spaced at 30 to 50 mils for connection of a BGA (Ball Grid Array) module.
The circuitized substrate of the invention has improved wirability due to reduced via diameters and reduced land diameters of the first and second wiring layer. In step 180 of FIG. 1(i) joining material 540 (FIG. 5) is screened into the windows onto the pads for surface mount connection. Alternately the joining material may be screened onto the component terminals or the pads or terminals may otherwise be coated with joining material. The joining material may be an ECA with conductive particles or a TLP system or a solder paste or a solder alloy may be provided on the pads or terminals and a flux applied to the pads and/or terminals for soldered connection. Solder paste consists of liquid flux and metal particles which melt during reflow heating to form molten solder alloy such as eutectic Pb/Sn solder (e.g. Pb and 30-80% Sn preferably 55-70% Sn). In step 182 the terminals (balls, leads, pads) of surface mount components are positioned at the pads (close enough for reflowed connection between the pads and the terminals). In step 184 the joining material is cured. For solder paste the curing includes heating the paste above the melting temperature of the solder alloy. In step 186 the joining material is cooled to form solid joints between the terminals and pads.
When PIH components are required then steps 190-196 of FIG. 1(j) are also performed. In step 190 PIH components are placed on the substrate with pins or leads of the component in PTHs. In step 192 flux is applied into the holes to provide a more solder wettable metal surface. In step 194 the substrate is moved over a wave or fountain of solder in contact with the molten solder which wets to lands on the bottom of the board and fills the PTHs by capillary action (surface tension). Then the solder is cooled to form solid joints of solder alloy.
Alternatively, for PIH components solder paste may be applied to the top surface of the substrate over the lands around the PTHs and the pins of the components inserted through the paste deposits. Then during reflow for the surface mount components the solder paste reflows to form solder alloy which fills up the respective PTH to connect the PIH components.
FIGS. 2(a)-22(c) illustrate an alternative embodiment for the steps 140-166 in FIGS. 1(e)-1(g) of the process for forming additional wiring layers such as a second wiring layer on each side of the substrate. FIGS. 1(e)-1(g) illustrate an additive process and FIGS. 2(a)-2(c) illustrate a subtractive embodiment.
Steps 200-202 in FIG. 2(a) are similar to steps 156-158 and the above discussion thereof applies. Steps 210-230 are similar to steps 160-164 in FIG. 1(g) and the above discussion thereof applies. Steps 220-244 are similar to steps 150-154 above in FIG. 1(f) and the above discussion applies. In step 246, exposed copper is etched to form a second wiring layer interconnected to the first wiring layer by conductive vias. In step 248, the third layer of photoresist is stripped.
FIG. 6 illustrates computer system 600 of the invention with increased performance due to higher component densities and resulting shorter signal flight time. The system includes an enclosure 602 in which a power supply 604 and one or more circuit boards 606,608,610 are mounted. The circuit boards communicate through interconnect bus 612. The circuit boards include multiple components including pin grid array module 614, thin small outline package 616, ceramic J-lead component 618, ball grid array module 620, quad flat pack 622, flip chip 624, column grid array module 626. The components include one or more CPUs, dynamic RAMs, static RAMS, and I/O processors connected to ports 626, 628 for communication with computer peripherals such as keyboards, mice, displays, printers, modems, networks.
Although the invention has been described specifically in terms of preferred embodiments, such embodiments are provided only as examples. Those skilled in the art are expected to make numerous changes and substitutions, including those discussed above, in arriving at their own embodiments, without departing from the spirit of the present invention. Thus, the scope of the invention is only limited by the following claims.
Patent Citations
Non-Patent Citations
Referenced by
Legal Events
Original Image


text:
Register now for free, or sign in with any of these services:
Want to set your local edition?
Select an edition for more focused local news coverage when you visit NOLA.com.
Don't worry. You can change this setting at any time to another local edition.
This is ridiculous! With all the problems with the catholic church and they are worrying about fixing something that isn't broke. The paddle is effective, point blank! Alumni and Black community need to get-up and be heard on this. Sounds like the good ol arch. and Josephites are more wrapped in politics than the addresseing the "REAL" issues pressing the African-American community and Catholic church. I'm so glad I am a "PURPLE KNIGHT"
Sad...something doesn't sound right....but still sad...
A true legend in every sense of the word! You will be missed! c/o 97
Congrats to the kid! 5'6! He is a lil dude, huh!
This is waste of a bill, this is not going to stop people from firing a gun! If they wanna fire a gun they will, with me remorse of the law! Its like passing a bill saying you can't drink liquor when your 19, when the law states the legal drinking age is 21!
Cleveland would have given a better series! Not to say cleveland would have won it! Its a game of match-ups! Congrats to Lakers! They did it like champions do it!
If u remember, Peter King was one of the main voices constantly talking about the saints leaving new orleans! So, what happened: a mega deal for the state and saints to stay here! Peter King needs to shove it!
He wants to be president! So one has to wonder, was this move for the state or himself or both!
Of course T-Mac is beating Paul, everybody in China voting for Yao is gonna vote for T-Mac, cause they are teammates!

subset: commoncrawl


text:
Lee County High School's Thespian Troupe #5297 has collected almost 3000 pounds of food for the needy as part of this year's national Trick or Treat So Kids Can Eat community service program sponsored by the International Thespian Society and the Educational Theatre Association. Theatre honors students from Lee County High visited homes in neighborhoods across the Leesburg/Albany area on Halloween to accept donations from generous families to support Second Harvest food bank of South Georgia.
This is the first year that Lee County's Thespians have joined the national Trick-or-Treat So Kids Can Eat effort, but they hope to make it an annual project. More than 20 students in the Thespian honor society at LCHS, assisted by two parent volunteers, coordinated the group's effort to collect both food and monetary donations to aid local families in need as the holiday season approaches.
About the International Thespian Society
The International Thespian Society, founded in 1929, is an honorary organization for high school and middle school theatre students located at more than 3,900 affiliated secondary schools across America, Canada, and abroad. The mission of the society is to honor student achievement in the theatre arts. High school inductees are known as "Thespians" and junior high/middle school inductees are known as "Junior Thespians." Lee County High School's Thespian Troupe was chartered in 1992.


text:
National Theatre
'Stomp' Returns To D.C. With National Theatre Stop
The popular percussion show known as "Stomp" is returning to Washington with a touring engagement at the National Theatre.
'Porgy And Bess' Returns To D.C.'s National Theatre
One of 2012's celebrated musicals from Broadway that also has a unique role in American theater history is opening this week at the National Theatre in Washington.
'If/Then' Brings New Life To D.C.'s National Theatre
A Washington theater with a long history of incubating Broadway-bound shows is getting a rebirth of its own while hosting a new world premiere from the creative team behind "Next to Normal" and the star power of "Rent."
D.C.'s National Theatre Announces New Broadway Shows
National Theatre has announced an extensive slate of productions, including its first subscription season in more than a decade.


text:
Charlie Sheen's Fighting Words: His Most Outrageous Sound Bites
From calling "rock bottom" a "fishing term" to touting the greatest drug ever made ("I'm on a drug, it's called 'Charlie Sheen'") to making sure he sticks it to those who have wronged him, Sheen is whipping out the fighting words.
But what makes Sheen a winner? Check out the most outrageous sound bites form the 45-year-old star's tornado of recent talk show appearances and interviews with the likes of NBC, TMZ and ABC.
We give it a week before we see teenage Sheen wannabes walking around with T-shirts emblazoned with his face and the words, "My conduct is bitchin'."
Check out Charlie's most outrageous quotes after the jump!
Charlie the "Warlock"
►"I'm on a quest to claim absolute victory on every front."
►"I'm proud of what I created. Why wouldn't I be? I exposed people to magic. I exposed them to something that they otherwise would not see in their boring normal lives. And I gave that to them!"
►"Dying is for fools. Amateurs."
►"Resentments are the rocket fuel that lives in the tip of my saber."
See Charlie tell the 'Today' show about his "war" against CBS:
Charlie the "Winner"
►"[I was] bangin' 7-gram rocks and finishing them because that's how I roll. I have one speed, one gear ... go!"
►"I mean, what's not to love? Especially when you see how I party. Man, it was epic. The run I was on made Sinatra, Flynn, Jagger, Richards all of 'em just look like droopy-eyed armless children."
►"What's the cure, medicine to make me like them? Not gonna happen. I'm bi-winning. I win here, I win there. Now what? If I'm bipolar, aren't there moments when a guy like crashes?"
►"You borrow my brain for five seconds and just be like 'Dude, can't handle it! Unplug this bastard!' ... It fires in a way that is perhaps not from this terrestrial realm."
►"I am on a drug, it's called 'Charlie Sheen.' It's not available 'cause if you try it once you will die. Your face will melt off, and children will weep over your exploded body."
See Sheen talk face-melting on ABC:
Charlie the "Poet"
►"I've got magic. I've got poetry at my fingertips."
►"I wanted to watch 'Jaws' on the ocean in the dark and be afraid."
►"It's been a tsunami. And I've been riding it on a mercury surfboard."
►"I'm still alive, which is pretty cool."
See PopEater editors sound off on Sheen's wild ways:
- Filed under:
- TV News -
- Troublemakers -
- Charlie Sheen
- Tuesday 01 MarchBy Guy
Besides going off the deep end and ruining a good show, what about his cast members? There are some good actors that are now out of a job and worse yet off of a tv show that was doing well. Seems to me he's just selfish and totally uncaring about anyone but himself. Sorry Charlie, you've lost any credability now and in the future.
- Friday 04 MarchBy Gus
just remember. CBS put stop at the show. not Charlie.
- Tuesday 01 MarchBy Greg
I think Charlie is just responding to everyone sticking their big noses into HIS business. If he is doing something illegal, then let the police deal with him. If he is doing something immoral, then let God deal with him. If he is doing something offensive to you, then don't watch him or read about him. There are tons of people out there doing a lot of worse things than what Charlie is doing (mostly to himself). He's an entertainer...and he's still doing a good job entertaining us IMO. And btw, I do think he is crazy...like a fox.
- Thursday 03 MarchBy Courtney
That's great. I agree 100%
He's been amazing, just cuz he did drugs shouldn't take all that back. He's still one of the best &I think he always will be.
- Tuesday 01 MarchBy Buzz
Charlie deserves a raise.....3 million per show..
- Tuesday 01 MarchBy opinionlady
I love it! Charlie Sheen is finally interesting and fun! These quotes are the best ever. Don't stop Charlie...
- Tuesday 01 MarchBy Christine
I love Charlie. This whole ugly mess makes me sad. I wish him the best in his recovery. I agree that AA is not the best or only solution, but it does work for some people. Whatever works, do it.
- Tuesday 01 MarchBy Michelle
I think Mr Sheen is very ill and is being highly exploited by the media. He needs help, not the self serving media . Either help get him help or leave him alone.
- Friday 04 March
I agree Charlie is probably ill but don't blame the media for exploitation. He is calling them! AND you cant help someone who doesn't want it.
- Tuesday 01 MarchBy zackattack
Poor guy...
One day (I'm hoping very soon) he will realize how much he screwed up his life and his family.
Charlie, get yourself diagnosed by a professional! You are an actor - NOT A PSYCHIATRIST!!! And if you do it soon, you'd still have a chance to finish season 8.
Don't do it for yourself - do it for your kids.
- Friday 04 March
He won't do it for his kids because he doesn't CARE about his kids. He is a selfish git who needs to get OVER HIMSELF!!!
- Wednesday 02 March
Yeah keep smoking crack, idiot.... see what happens...
- Friday 04 March
Stop playing games with your life. Give up the coke and friends that do it. Don't thro your life away.
- Friday 04 MarchBy david
CRACK HEAD CHARLIE was given a blood test after the hotel incident and they found 11 ELEVEN different drugs in his system. I did not know there were eleven drugs to get high on. His Brain is Burnt Out!
- Friday 04 MarchBy Brian
Charlie is my hero. GO CHARLIE
- Friday 04 MarchBy Julie
So Charlie is your hero. I guess this means you like being violent toward your women and celebrating it, doing addictive drugs and celebrating it, and making irrational justifications on our national media. Good luck, Brian.
- Friday 04 MarchBy Erin
I just think it's funny that no one can take him seriously anymore. What a joke.
- Friday 04 MarchBy Rodge
First of all, Charlie Sheen is NOT a good actor. He's just playing himself on 2 1/2 MEN. Anyone can do that. Granted he has done some good work in the past but that was due to the directors he was working under. He's typical of the megalomaniacs who prevail in the entertainment and sports world - they make so much money they believe themselves to be above the rules and requirements of any social order, so consequently they feel they can do anything they wish to do and everyone else has to just deal with it. I've written to the sponsors of the show and told them if they hire him back I've used their products for the last time, and am spreading the word. He's a disgrace to the human existence, addictions and all the rest!
- Friday 04 MarchBy dchan242
What a nut case!!
- Friday 04 MarchBy GoodStew
AA is about humility and honesty. Charlie has neither... Has anyone seen his '99 interview after he came out of (an AA based) rehab? Did you notice how healthy, honest and happy he appeared back then? Today? not so much... Now he's an arrogant, wasted, scarecrow, just blowin' smoke. Anything for attention. I hope he finds the truth 'cause he really is a sicko. I suspect his arrogance and denial will eventually kill him... probably an overdose.
MORE ABOUT Charlie Sheen
Find the latest stories, biography, photos, videos, and more.Read more about Charlie Sheen Li
Jennifer Aniston
Is it Brad(ley) and Jen take 2? Jen was spotted out on the town with dreamboat ...
Paris Hilton
After Fairly Legal actress, Sarah Shahi, laid into Paris via Twitter for almost...
Kate Middleton
Kate Middleton is officially a princess. She walked the aisle in an Alexander...
Denise Richards
According to Denise, she's not sure that her estranged ex is completely sober....
Popeater Hot Topics
- Kevin Zegers, Wife Jaime Feld Still Awaiting Birth of Their Twin Daughters
- Bachelorette After the Final Rose Recap: Nick Viall's Awkward Confrontation with Kaitlyn Bristowe
- Real Housewives of Orange County Recap: Vicki Gunvalson Accuses Meghan Edmonds of Being a Gold Digger
- Bill Cosby's accusers: 35 women speak out in 'New York Magazine' cover story
- Puddle of Mudd frontman Wes Scantlin accused of DWI, fleeing police in Minnesota
- Box Office Top 20: 'Ant-Man' beats 'Pixels' by a tentacle; 'Southpaw' outclasses 'Paper Towns'
- Poems, Jars & The Biggest Joke in the World: The Bachelorette Season 11 Has Finally Come to A Close
- Pregnant Ashlee Simpson and Evan Ross Are Fashion Twins Days Before Welcoming a Baby Girl—See the Hot Pic!
- Boy Scouts of America Will Now Allow Gay Scout Leaders
Sites We Love
- Bill Cosby's accusers: 35 women speak out in 'New York Magazine' cover story
- Puddle of Mudd frontman Wes Scantlin accused of DWI, fleeing police in Minnesota
- More From Foxnews.com
- The Bachelorette's Runner-Up Tells PEOPLE: 'I Was in Shock'
- Tom Cruise Takes on Jimmy Fallon in an Epic Lip Sync Battle
- More From PEOPLE.com
- Shia LaBeouf's Shocking Fight With Girlfriend Mia Goth Caught On Camera: "I Would Have Killed Her"
- UPDATE - Bobbi Kristina Death Being Investigated As A Homicide, Father Bobby Brown Releases Statement
- More From x17online.com
- Kim Kardashian's Baby Bump Looks Suspiciously Smaller In Tight White Dress — Pic
- Soulja Boy: Rapper & Producer Turns 25 — Happy Birthday
- More From Hollywoodlife.com


text:
Deviant Art
Crash Course on Drawing Male and Female Profile!-YouTube Channel: http://www.youtube.com/user/dexelkyr
-Facebook Page : http://www.facebook.com/pages/Dex91/346330452135645
-Twitter: Dex911
New YouTube Video, Quick Crash Course of about 4 mins on the differences between male and Female Profile!
Heya there Guys!
After the Tutorial on the Side View in general, this time we deal with the Male and Female main differences in their profile, with a quick Crash Course of about 4 mins! This is less serious than the last Tutorial, i hope you'll enjoy this and that this short video will be intense enough for you to like/share it, and maybe even subscribe if you want to see more of my videos in the future
Feel free to like the Facebook Page/the video or share any video if you appreciate what i'm doing *-* (Do i need to say anything about subscribing if you liked it and want to see more in the future? )
And don't forget to leave a Comment about this video if you can (possibly on YouTube but here is of course much
|Sta.sh Submit


text:
netstat -A -a yields:
0xd09052b0 tcp6 0 0 *.www *.* LISTEN
but there is no corresponding line with "tcp" instead of "tcp6"
If I add http stream tcp nowait root /usr/sbin/httpd httpd
to /etc/inetd.conf
then netstat -A -a yields:
0xd0905968 tcp 0 0 *.www *.* LISTEN 0xd09052b0 tcp6 0 0 *.www *.* LISTEN
and the browser says:
(48)Address already in use: make_sock: could not bind to address [::]:80 no listening sockets available, shutting down Unable to open logs
I think this must be rather simple and apologize if this is really dumb.
TIA Bernard Higonnet


text:
HTML & CSS Resources
One of the beauties of a good content management system is its WYSIWIG interface. Make web pages, no coding required. This page, for example, is typed right into the Tiny MCE web editor in Concrete5.
But for the intrepid, knowing (at least) a little HTML and CSS code satisfies a certain need for sophistication, for stylishness. Here's a little HTML cheatsheet (MS Word).
And below are HTML resources for beginners and for experienced Web developers.
For beginners, turn to "If you know nothing about HTML, this is where you start." Find out how HTML tags work and learn how to use them to manipulate text, graphics, and hyperlinks.
Find a terrific tutorial and reference on HTML5 at W3schools. Worthy of a bookmark.
For the experienced, we highly recommend the HTML/CSS overview from the World Wide Web Consortium (W3C).Geeks: check out the W3C cheatsheet, a lookup guide for hundreds of specifications.
Scroll down to the "quick" table of contents for detailed description of elements like HTML text, tables, stylesheets, and those cute little character entities.
The CSS Box Model. For more information on the CSS Box Model, visit SitePoint's reference on the subject.


text:
the gates(markers on the ground) are distracting in FPS view, because their splash animation makes it looks like there is a brief lag. Maybe you can find another way to give feedback when the player hit a gate.
Beating the AI seems very easy, but I can imagine this to be a cool game when played with friends. Would go well on any handheld, I imagine (with wi-fi connectivity, instead of LAN)


text:
The woman charged with playing sex games with skeletons parts has been judged as sane ahead of the trial starting Tuesday, news agency TT reports.
Police found six skulls and many other skeleton parts when they raided the 37-year-old's Gothenburg apartment. According to the prosecutor, she used the bones for sex acts.
"If we go back 15 or 20 years in time, then it would have been obvious she was had a mental disorder," Sten Levander, a professor in judicial psychiatry, tells TT.
But, says Levander, the woman has not been found to have acted by compulsion, which by today's standards for psychiatric exminations means she will be considered sane in the trial.
More from…Crime
Nedanstående kommentarer kommer från användare och är inte en del av det redaktionella innehållet. I och med att du skickar in en kommentar bekräftar du också att du accepterar The following comments have been made by visitors to sverigesradio.se and are not part of the editorial content. Comments may be moderated after they are published. By leaving a comment, you confirm your acceptance of Swedish Radio's rules on commenting.
Du kan kommentera anonymt. Vill du inte uppge din e-post kan du därför skriva in en påhittad t ex "firstname.lastname@example.com"


text:
Nepal, B'desh to sign zero-tariff pact
Nepal and Bangladesh are all set hold commerce joint-secretary-level talks on February 17, in which the government will sign some crucial trade agreements, including the zero tariff facility under which 146 Nepali agro-goods can enjoy free market access to the country's second largest trading partner in South Asia.
The Nepal government is also likely to take a decision on the Bangladesh government's demand that some of its products be given preferential treatment in the Nepali market.
During a secretary-level meeting between the two countries held in Kathmandu on June 30, 2012, the Bangladeshi side had agreed in principle to provide duty-free access to Nepali vegetables, fruits.
In that meeting, Nepal had sought the facility for 246 Nepali products, including lentils, tomato and herbs, among others. The meeting had formed a bi-lateral technical committee to study and decide on how many and which Nepali products would get duty-free access to the Bangladeshi market.
The committee was led by Naindra Prashad Upadhya, joint-secretary at the Ministry of Commerce and Supplies.
"The upcoming meeting, which is being held in Dhaka, is the meeting between these two technical committees," said a ministry official.
The ministry has prepared a list of agro items to recommend for duty-free market access to Bangl-adesh. The list was prepared in coordination with private sector bodies including the Federation of Nepalese Chambers of Commerce and Industry (FNCCI).
Exporters have been complaining that despite huge demand, Nepali agriculture products are facing difficulties to enter the Bangladeshi market due to high duty.
During the 2012 meeting, the Bangladeshi side had demanded trade expansion and tariff cut for their products to five percent. The tariff cut was sought on products such as juice, fish, clothes, tissue paper, electrical goods, pharmaceuticals and cement, among others. "We will try to explore possibilities to fulfill their demands," said the ministry official.
In the upcoming meeting, Nepal will ask the Bangladeshi side to endorse the transport agreement signed in 2006. The agreement envisages connecting Nepal and Bangladesh directly through India and is expected to ease and enhance trade between the two countries. "Besides, the meeting will also discuss other modalities of transportation," said Upadhya who will lead the Nepali side in the meeting.
He said the Nepali side will also forward a draft of the agreement on the food quarantine certification system.
"As per the request of the Bangladesh government, we are handing over the draft of the memorandum of understanding on the food quarantine certification system," he said.
Posted on: 2013-02-11 08:54


text:
South Korean Stocks: Hyundai Heavy, Hyundai Motor, NCsoft, OCI
July 17 (Bloomberg) -- Shares of the following companies had unusual moves in South Korea trading. Stock symbols are in parentheses and prices are as of the close in Seoul. The Kospi index added 0.2 percent to 1,821.96, rising for a third day.
Hyundai Motor Co. (005380 KS), South Korea's biggest carmaker, slipped 2.4 percent to 223,000 won. Hyundai Heavy Industries Co. (009540 KS) sold 3.2 million shares of Hyundai Motor at 220,000 won apiece, or 3.7 percent lower than yesterday's price, according to data compiled by Bloomberg. Hyundai Heavy shares added 0.9 percent to 238,500 won.
NCsoft Corp. (036570 KS), an online-game maker, added 6.2 percent to 222,000 won, after tumbling 6.7 percent yesterday. The recent drop in the share-price is "excessive," Lee Chang Young, an analyst at Tong Yang Securities Inc., said in a report.
OCI Co. (010060 KS), South Korea's biggest polysilicon maker, retreated 3.5 percent to 204,500 won. China has started a probe into possible polysilicon dumping by South Korea, Edaily reported, citing unidentified industry officials.
To contact the reporter on this story: Saeromi Shin in Seoul at email@example.com
To contact the editor responsible for this story: Darren Boey at firstname.lastname@example.com


text:
The College of the Canyons Library welcomes you!
Spring semester dates are February 6 to June 5, 2015. Check the library hours link to find out when we're open.
Search books and articles at the same time with the library's discovery system. Check out the search box below!
Got a question? We've got answers! Try the Ask A Librarian chat service (it's that chat box below) for 24/7 assistance!


text:
Being in the software business, it's in our best interest to always be watching and utilizing the newest technology to keep up with the market and customers. People want the best and newest that's available. Anything older just won't do!
But how many of us – when confronted with the newest tech gadget or hot new website – scratch our heads and say, "I don't get it, what was wrong with the old way of doing this?"
Out With the New, In With the Old
By THOMAS BARTLETT
Progress is overrated. Or so says Martin A. Rice, Jr., an associate professor of philosophy at the University of Pittsburgh at Johnstown. He has no love for the computer (the keys are "too mushy," he says). He despises PowerPoint. He prefers plain paper over glowing screens. If he could go back to making copies on a mimeograph, he would. "I'm fond of the old and suspicious of the new," he says.
Mr. Rice explains all this over a rotary telephone from the 1970s. Later he bangs out a follow-up message on his 1938 Underwood Champion portable typewriter. Mr. Rice will often write a letter on his typewriter, scan it into his computer, and then send the image as an e-mail attachment. "Some people are tickled by it," he says. "Some people are absolutely annoyed."
For the rest of this great article click on over to the Chronicle.com
Link via BoingBoing
'Chelle Parmele
Like this article? Please share it:
How to make faster, more informed business decisions
Your business is up and running, and now you're laser-focused on growth. And you're smart: you want to keep your finger on the pulse of the financial health of your business. But, you don't have time to run reports or analyze endless spreadsheets.
What if you had an easy-to-use financial dashboard that gave you a visual overview of all your key business numbers? What if you could set up budgets and sales forecasts without sacrificing critical time away from your business?
This is where a powerful, yet easy to configure business dashboard comes into play. Click to learn more about how a business dashboard can help you grow faster and make smarter, more informed decisions.Click to continue


text:
Narrow your search
This sub-$200 smartphone from Verizon has entry-level features for those who are just getting started, or who like their Androids simple.
You can finally buy Pebble's latest smartwatch in stores.
In advance of a new model Band being cooked up by Microsoft, the current version is on sale for $150 at Target until this Saturday.
"Solid frame rate is the most important thing." says Kurt Margenau, lead designer for the game.
After finding that federal employees' Social Security numbers were stolen, the US government discovers another breach, which exposed data on intelligence agents and others.
The search giant says Adobe Flash "puts a squeeze on your laptop's battery." Its solution: automatically pause unnecessary Flash content in the Chrome browser.
The executive offers a gracious assessment of the impact of the Web retail giant, but added he doesn't believe Amazon "owns that experience."
The company, which already offers free mobile phone service via Wi-Fi networks, is trying to make a name for itself with the introduction of a $99 Android handset.
Target stores are highlighting the smart home with new Connected Life sections.
Capcom announces when Street Fighter V will arrive on PlayStation 4 and PC and shares an initial sales target.


text:
Apply now for scholarship to go on a 2015 tour. The deadline is March 6, 2015. Application formats PDF or DOCX.
EST is the premiere Black College Tour program in California. Register today because time and space is limited!
Catch the excitement of the Black College Expo!
Our tours have been conducted for 36 years! Learn more about the background of Educational Student Tours.
Donate Today--Make a Difference!
EST is a federally recognized non-profit. Your donation will be used to support foster and low-income students in their quest to go to college.


text:
Thursday, December 26, 2013
Some of the best-behaved children in the area gathered at Inlet Square Malls center court Saturday to welcome a special guest.
Some were dressed in their Sunday best. Others clutched papers on which they had printed their hopes and dreams. And as the clock ticked down to 10:30 a.m., the excitement was palpable.
Suddenly, there he was. Towed on a Coastal Marine boat, Santa steered into the malls new holiday scene that had been erected especially for him.
As he disembarked from his fishing boat, the youngsters quickly surrounded him.
And the jolly old elf didnt disappoint.
What grade are you in this year? he asked one youngster.
Have you been brushing your teeth? he queried another. And one by one they answered his questions, some shyly, some more boisterously.
I get to talk to Santa, said Isaac Lowery, 6, of Myrtle Beach, assuring the questioner with a sideways glance at his mother that he indeed had been a good boy this year.
McClure Hopkins, 5, of Murrells Inlet, who had been checking out the presents that led to Santas seat of honor with a sense of awe, was among the first to greet Santa, and it was obvious from the look McClure gave Santa that he did indeed believe in him.
For 3-year-old Wyatt James, Santas arrival was his chance to share his wish list, topped by a Skylanders and the SWAP Force figure, among this years hottest toys.
Jonathan Riveras list was longer, but not as specific. He wanted movies, a bike and toys.
Other special guests
While Santa was the guest of honor, the youngsters were just as taken with the other special guests.
Splash, the Myrtle Beach Pelicans mascot engaged some of the children, including a pair who found Santa just too intimidating. Also joining in the fun were the Sonic mascot and Mr. Peach from the malls newest store, the Fuzzy Peach.
Santa will be available for pictures through Christmas Eve. Check the malls website for his schedule.
South Strand News is pleased to offer readers the enhanced ability to comment on stories. We expect our readers to engage in lively, yet civil discourse. We do not edit user submitted statements and we cannot promise that readers will not occasionally find offensive or inaccurate comments posted in the comments area. Responsibility for the statements posted lies with the person submitting the comment, not South Strand News.
If you find a comment that is objectionable, please click "report abuse" and we will review it for possible removal. Please be reminded, however, that in accordance with our Terms of Use and federal law, we are under no obligation to remove any third party comments posted on our website. Read our full terms and conditions.
© 2015 South Strand News an Evening Post Industries company. All Rights Reserved.
Registration on or use of this site constitutes acceptance of our Terms of Service, Privacy Policy and Parental Consent Form.


text:
When you're planning your wedding, you might be tempted to go away for the big day. However, Orlando is a great city for weddings. Why not stay at home near your apartment in Orlando, FL, and enjoy one of these magical spots for your ceremony and reception?You can't mention a magical place to get married in Orlando without thinking of the Magic Kingdom. Disney World offers a number of wedding packages and locations; magical sites include the Cinderella Castle and the Wedding Pavilion on the shore of the Seven Seas Lagoon. You can add a Disney theme to your wedding or choose another that is meaningful to you.
In downtown Orlando, the Courtyard at Lake Lucerne provides wedding packages in an historic setting. Weddings at this bed-and-breakfast take place at the I.W. Phillips House, which features restored period décor, a magical courtyard, and a gazebo perfect for the ceremony itself.
If you love the thought of a lakeside setting for your wedding, the Cypress Grove Estate House is the place near apartments in Orlando, FL. Situated on Lake Jessamine, the grounds feature oak and cypress trees, a 1925-vintage Estate House, and a Cottage House perfect for more intimate ceremonies.
Photo courtesy: cypressgroveestatehouse.com


text:
Start-Up Strategies
From writing a business plan to choosing a corporate structure to raising money, starting a business is full of daunting challenges. Here's how to get started.
Essential Reading
Small-Business Guide
How to Win a Business Plan Competition
It takes more than a good idea to start a business — or to win a contest for business plans.businessNews
In the Hunt
In Pitching to Angel Investors, Preparation Tops Zeal
Two studies show that faking enthusiasm and other hints at slickness can kill a deal.businessNews
Financing, With Strings Attached
Small business owners should think carefully before accepting an investor's offer of cash.businessNews
Small Business 101: How to Get Started
It has never been easier to lay the groundwork for starting a small business.businessNews
Steep Discounts a Boon for Customers, but a Gamble for Start-Ups
As new tech companies spend huge amounts to lure customers with deals, it's a great time to be a consumer. But can these companies ever turn a profit?
July 30, 2015, Thursday
MORE ON START-UP STRATEGIES: Venture Capital , Postmates Inc , Entrepreneurship , E-Commerce , Start-ups , Computers and the Internet , Silicon Valley (Calif) , Advertising and Marketing , Discount Selling , Jet.com Inc , Shopping and Retail
Stripe, Digital Payments Start-Up, Raises New Funding and Partners With Visa
The San Francisco-based digital payments start-up now has a $5 billion valuation and a partnership with Visa to help it compete.
July 28, 2015, Tuesday
MORE ON START-UP STRATEGIES: Stripe Inc , Visa Inc , Start-ups , PayPal , Square Inc , Sequoia Capital , American Express Company , Mobile Commerce and Payments
Deliveroo, an On-Demand Food Delivery Service, Raises $70 Million
The London-based start-up raised an additional $70 million as its founders took advantage of the appetite for the so-called on-demand economy.
July 27, 2015, Monday
MORE ON START-UP STRATEGIES: London (England) , GrubHub , Delivery Services , Venture Capital
Square's Filing Turns Talk to Dorsey's Juggling Skills
The confidential filing allows the mobile payments start-up, which has expanded its ambitions, to keep the offering paperwork private until it is ready to seek investors.
July 25, 2015, Saturday
MORE ON START-UP STRATEGIES: Dorsey, Jack , Square Inc , Twitter , Initial Public Offerings , Start-ups , Mobile Commerce and Payments
A Startup for Geeks in Gaza
Gaza Sky Geeks has sparked an unlikely startup movement in Gaza, which has an unemployment rate of 43 percent.
July 24, 2015, Friday
MORE ON START-UP STRATEGIES: Thiel, Peter A , Gaza Strip , Google Inc , IndieGoGo.com , Mercy Corps , Computers and the Internet , Entrepreneurship , Palestinians , Start-ups
Blackstone C.F.O. Is Said to Be Headed to Airbnb
Laurence Tosi, chief financial officer of the Blackstone Group, is being courted for the same position by Airbnb, people briefed on the matter said.
July 24, 2015, Friday
MORE ON START-UP STRATEGIES: Airbnb , The Blackstone Group , Tosi, Laurence A Jr , Appointments and Executive Changes , Private Equity , Start-ups
Starbucks Joins With Lyft on Loyalty Program
Starbucks and Lyft strike a partnership agreement that lets riders of the car-hailing service earn cups of joe through a loyalty program.
July 22, 2015, Wednesday
MORE ON START-UP STRATEGIES: Lyft Inc , Starbucks Corporation , Uber Technologies Inc , Car Services and Livery Cabs , Coffee , Coffeehouses , Customer Loyalty Programs , Mobile Commerce and Payments , Start-ups
Limits at Gawker? Rules at Reddit? Wild West Web Turns a Page
The digital media companies are struggling with a tough transition — from underfunded start-ups to mature businesses.
July 22, 2015, Wednesday
MORE ON START-UP STRATEGIES: Gawker Media , Reddit Inc , Denton, Nick , Huffman, Steve (1983- ) , Start-ups , News and News Media , Social Media , Freedom of Speech and Expression
Building a Start-Up Culture in a Broken-Down Economy
Some young Greek entrepreneurs are thriving with the help of international investors, providing a glimmer of hope for the economy.
July 19, 2015, Sunday
MORE ON START-UP STRATEGIES: Greece , Entrepreneurship , Start-ups , European Sovereign Debt Crisis (2010- ) , Athens (Greece) , European Union , Labor and Jobs , Computers and the Internet
Lawrence Summers to Join Board of 'Hyperdata' Start-Up
The appointment of the former Treasury secretary is a coup for Premise, whose local-data-amassing app has the potential to track global prices more quickly than official sources.
July 16, 2015, Thursday
MORE ON START-UP STRATEGIES: Premise Inc , Summers, Lawrence H , Data-Mining and Database Marketing , Mobile Applications , Venture Capital , Soloff, David , Palihapitiya, Chamath
- Accounting »
- Business Travel »
- Buying & Selling a Business »
- Family Businesses »
- Finance and Capital »
- Franchising »
- Going Global »
- Health Care »
- Human Resources »
- Insurance »
- Legal Issues »
- Management »
- Marketing »
- Personal Finance »
- Real Estate »
- Retailing »
- Start-Up Strategies »
- Sustainability »
- Technology »
Rss Feeds On Start-Up Strategies
Subscribe to an RSS feed on this topic. What is RSS?


text:
Tips on Healthy Chinese Food Options – Part 2
Posted on Jan 25, 2012 | 2 comments
As with many holiday celebrations, it may be tempting to overeat during Chinese New Year. However, there are ways to eat healthier and still feel satisfied. Even small, simple changes can lead to a healthier you.
Ideas for specific food changes
Roast Duck and Roast Pork
- For roast duck, take a serrated knife and cut off the fat in between the skin and the meat.
- For roast pork, cut off the pieces of fat before eating.
- Only eat half of the skin that is put on your plate and avoid the high sodium seasoning that comes with the dish.
Soda at Chinese Dinners and Banquets
- Often at Chinese banquets, there are several bottles of soda in the middle of the table. Soda is high in sugar and can increase one's risk for high triglycerides and diabetes.
- Suggestion for change: If you really love soda, try just drinking one cup of soda with ice as a treat each banquet. After this cup, stick to water or tea. Avoid soda outside of these special occasions, such as family banquets.
Top Ramen and Cup Noodles
- In these hard economic times, a cheap, tasty meal is very appealing. Many of you and your family members may eat instant noodles, such as Cup of Noodles, Instant Lunch, or Top Ramen. Unfortunately, these instant noodles have extremely high levels of sodium (mainly in the broth) and fat (from the deep fried noodle).
- Suggestion for Change: Try limiting your consumption of instant ramen. If your family does give you some to eat, try limiting the amount of seasoning you put into the broth to half of the packet. Alternatively, try putting some additional water into the noodle mix in order to dilute the sodium and fat content.
How to eat healthy at a Chinese restaurant
- Choose your main course wisely: Avoid fat, salt, and excess carbohydrates. Pick something from the "vegetarian" section.
- Choose brown rice over white rice.
- Cut down on your portion size by sharing a plate and an appetizer with a friend or family member. Pack your food to take home when it arrives to avoid overeating.
- Choose "Steamed" foods over "Fried" foods.
- Choose stir-fried vegetables, as this is lower in oil and increases nutritional value. However, avoid stir fried rice or noodles.
- Eat a dish with tofu as a source of protein, instead of beef or pork.
- Avoid eating too much fish that is high in mercury, such as shark fin.
- Fill up on soup.
- Drink tea or water, not soda.
- Eat the fruit that is given as a dessert instead of the other sweetened desserts.
- Ask for the sauce (such as sweet and sour sauce) on the side.
- Eat with chopsticks to slow down your meal.
- Make half your plate vegetables, and eat only a quarter plate of carbohydrates such as rice or noodles, and a quarter plate of protein.
There are many helpful websites that can provide healthy alternative recipes for Chinese meals. The Eating Well website has an entire section on Chinese recipes.
Happy Chinese New Year and best wishes as you continue to work towards a healthier you!
Note: This blog post is the second article in a two-part series. Yesterday's blog post was Tips to Prepare Healthy Chinese dishes.
A group of PAMF physicians from the Cardiology, Hematology, Family Medicine, Internal Medicine, Pediatrics and Urgent Care Departments contributed to this blog post. They are Doctors Enoch Choi, Amy Lin, Terence Lin, Albert Wang, Angela Wong, Sandra Wong and Edmund Tai.
2 Comments
As much as I appreciate this post and the sentiment behind it, I have to say I don"t believe several things outlined here are applicable or realistic for CNY and the Chinese culture. Firstly, appetizers are not traditional fare in Chinese food. This is especially true during holidays and special events when you most likely eat a banquet style meal, consisting of 8-10 consecutive dishes. Having boxes prepared in the beginning of the meal is somewhat of a preposterous notion. And because the dishes continue to come over the course of 1-2 hours, it is not possible to "make half your plate vegetables" as the "half" that is occupied would continually be rotated with something else. Sweet-and-sour sauce is an American invention, and mentioning this belies the authors" cultural experience. Moreover, if you are Chinese, you have grown up learning to eat with chopsticks. You can use them to eat quickly or slowly. They are not a hindrance to your meal and in fact you can use them to shovel food into your mouth. Lastly, I don"t know many Asian Americans, besides college students, who eat instant noodles. Our parents, who have braved through the immigrant experience, did not even indulge frequently in this stuff.
I think it is more appropriate to address elements of Chinese culture and thinking in the way it relates to increased consumption of meat, fried foods, and soda. There is a concept that the rich get to eat meat and especially since we live in the Bay Area, we are a successful, model minority, we feel we are entitled to enjoy meat as a reflection of our improved socioeconomic status. We lead a more sedentary lifestyle, working in cubicles and commuting to work. And we are influenced by the American diet around us: the government subsidies that inadvertently advocate the production of high fructose corn syrup, meat, and white breads and pastas. Perhaps this is beyond the scope of this post but if we are to return to a healthier diet of Chinese food, these mediating factors should be addressed through education and intervention. I think your audience is educated and health-conscious enough to appreciate that level of dialogue.
Dear Christina,
Thank you for taking the time to read and comment on this blog article. We appreciate your thoughts and insights, and will keep them in mind as we prepare future articles that may pertain to Chinese health education and nutrition. This blog post was second in a two-part series, and we invite you to read the introductory blog post for additional perspective: Tips to Prepare Healthy Chinese Dishes http://bit.ly/wqlYCC. Thanks again for taking the time to share your thoughts and recommendations – we appreciate it.
Dr. Sandra Wong (article co-author)
PAMF Family Medicine
Leave a Reply
If you liked this article, you may also like:
Is It Depression or Just the Blues? Common Rashes in Kids: What to Know Do Vitamins Boost Health?


text:
Experts want to test for gas off the Whitehaven coast
Last updated at 12:18, Thursday, 01 May 2014
A COMPANY wanting to use underground coal seams to produce gas has been in Whitehaven to look at maps of underground mines.
By Margaret Crosby
The West Cumbrian coalfield is one of five coastal sites around the UK that Cluff Natural Resources is considering with a view to establishing a "coal gasification" operation in deep coal reserves.
Underground coal gasification – or UCG – involves drilling a deep hole and igniting the coal before piping the gas to the surface. By pumping oxygen and steam into the seams, gas is released which can be collected and used to supply the National Grid.
Permits are needed before drilling can start but in the meantime Cluff has asked geologists to do a seismic appraisal and investigate whether the offshore deposits are suitable. The next stage would be to drill an exploratory borehole.
Dr Michael Green, an advisor to Cluff, said: "It will take around three months to look at the geology, then we will decide whether there is any coal and whether it is worth pursuing.
"If it is we would make an application with the local authority and then put it out for consultation, with the public, the mineral committees, the Environment Agency and the Health and Safety Executive.
"This offshore area is one of several we are currently looking at. We hold a conditional licence from the Coal Authority for each of them. If we can access low cost syngas it should create some opportunities for jobs."
The process is not the same as fracking (hydraulic fracturing) which involves the release of a high-pressure mix of water, sand and chemicals to crack rocks and release gas. In UCG, oxygen combusts with the coal-producing synthesis gas (syngas), a combination of carbon dioxide, carbon monoxide, methane and hydrogen.
Dr Green was accompanied on his visit to Whitehaven by chairman and chief executive of Cluff Natural Resources, Algy Cluff, who in the 1970s discovered one of the North Sea's biggest oil fields off Aberdeen.
Cluff says there is no threat to the environment nor any risk to local people. But in Wales, where the company is similarly looking at the Dee and Loughor estuaries, concerns have been raised about environmental impact and the use of new technology, untried in this country. It has also proved controversial among communities at the Firth of Forth in Scotland.
Cluff Natural Resources has five UCG licences in the UK with more applications pending. "Our priority is to advance the planning process to enable us to commence drilling our first demonstrator holes. We believe only limited exploration work is required," the company says. "These inshore coal areas situated alongside Workington and Whitehaven offer the UK the potential of a secure and long-lasting source of gas for industrial and power generation use, which it is estimated will be cheaper than imported natural gas."
While in Whitehaven the Cluff representatives met with Britain's Energy Coast which recently won £225,000 of funding for West Cumbria from the Department of Energy towards the development of low carbon heat propositions for investors.
In Copeland the money will be used to explore the potential of extracting heat from water and gas in disused mineworkings.
Geothermal researchers from Durham University were in Whitehaven last week, at Haig, with a view to compiling a desktop study on the feasibility of bringing up heated water from the mine. It would be used for social housing and domestic purposes. They are working with a team from Sweden where geothermal technology has been used for decades.
First published at 11:53, Thursday, 01 May 2014
Published by http://www.whitehavennews.co.uk
Have your say
I know nothing of UCG technology, but I am willing to bet it is costly, dangerous, risky, won't bring any money into Whitehaven (even if it is a success), and is not environmentally-friendly. So lets go for it!
Not only is UCG technology "untried in this country", it has only ever been put into full production in a few places in the former USSR. Experimental projects in other parts of the world (notably Australia and Spain) have ended in disaster. Moreover, it has never even been tested in an offshore setting. The environmental risks are as great as for other forms of unconventional energy production, with the added fear of starting underground fires that can't be put out. Why should the people of this country be the guinea pigs for such a dangerous process?


text:
SilverChair Partners finds assistants who can handle everything from slicing apples to test tube babies.
Hundreds gathered at Grand Central Terminal's main concourse to celebrate the station's 100th birthday.
Caroline Kennedy's daughter, Tatiana, received a flurry of love notes and gifts from admitted stalker Naeem Ahmed.
Naeem Ahmed is charged with stalking and harassing Tatiana Schlossberg.
Naeem Ahmed, 41, was found mentally competent to stand trial and turned down a plea deal Monday.
Alleged stalker Naeem Ahmed, 41, must undergo a psychiatric evaluation, a judge said Friday.
The man arrested for stalking Caroline Kennedy's 20-year-old daughter had obsessed over her for eight years.
The Brearley School has purchased three buildings on East End Avenue to add teaching space.
Get our daily New York City news and alerts!
Terms of Use |Privacy Policy
Thank you for signing up!
Would you like to sign up for additional newsletters?
Thank you for signing up for additional newsletters.


text:
Oracle's patent battle against Google is a Fight about Oracle's future, The New York Times reports.
An analyst dissed Facebook CEO Mark Zuckerberg's signature hoodie, saying it's a sign of his immaturity, Bloomberg reports.
CNN examines the tax bills awaiting all those new Facebook millionaires.
The New York Times profiles Morgan Stanley's Michael Grimes, who has become the banker of choice for tech firms looking to go public.
A California judge tossed out a Chinese firm's lawsuit against Apple over the iPad name, according to Reuters.
Wireless carriers are looking to stop picking up the tab for devices in smartphone contacts, the Wall Street Journal reports.
China's biggest micro-blogging site appears to be giving in to government censors, CNET reports.
Wikipedia has pulled an entry tying Obama's "Forward" slogan to socialist media, according to the The New York Times.


text:
Designtalk: Light – Magic – Technology with Adrian van Hooydonk and Paul Cocksedge. Highlight Summary.
"Today, our customers expect the cars to work very well but they buy our products for something else, something that is more emotional. With the lamps, we have reached that level where it began to be more than just a functional piece."
"We try to use the technology in a way that it strengthens the character of the car and becomes a design project in and of itself so that it's something that … CONTINUED


text:
Posted: December 6th, 2012
Eat'n Park giving $5 bonus with gift card purchase
Buy $25 in gift cards from Eat'n Park and you'll get a $5 winter bonus card.
But be aware that the bonus card isn't good until Jan. 1 and expires on March 31.
You also have to go to a restaurant to get the bonus card and there's a limited supply so once a restaurant is out of them, you don't get a bonus with your gift card purchase.
Go to www.eatnpark.com or http://blog.eatnpark.com/2012/12/bonus-cards-are-back.html to learn more.
Posted in: Uncategorized


text:
Balloon Film
High-quality, expertly-printed metalized films for the balloon film industry
For over 4 decades, Glenroy has been a leading supplier for the metalized balloon film industry. The balloon film roll stock Glenroy manufactures and prints is supplied to balloon manufacturers for the forming and sealing, packaging, and distribution process.
"We've been doing business with Glenroy for over 25 years. Glenroy has produced excellent quality, and has always bent over backwards to address our needs. Glenroy is more than just a trusted supplier; Glenroy is a strategic partner, which is crucial in today's economy."
Pioneer Balloon Co.
When you choose Glenroy balloon film, you'll receive:
- Strong seal strength and long-lasting float times
- The lowest cost of use of any balloon films available
- The highest level of service in the industry
- Exceptional lead times
- Film for printed balloons up to 36" in diameter
- Film for double-sided balloons
- Film for uniquely shaped balloons (hearts, stars, etc.)
- 10-color flexographic printing on state-of-the-art presses
- Optimum graphics quality yielding bright colors, defined images, and distinct lines
- Superior coating and laminating methods
- Ability to partner with customers in developing innovative new balloon materials


text:
Racks & Reels
News and information on hunting, archery and fishing in South and Central Texas. Boating, lake level and river level information provided for Braunig Lake, Lake Calaveras, Canyon Lake, Medina Lake and others. Whitetail deer and turkey season information and tips.
Posts filtered on Tag
Parks, shooting ranges get nearly $2 million in grants
Parks in San Antonio and Bexar County were approved to receive $1.75 million from the Texas Parks & Wildlife Commission this week while shooting range facilities in San Antonio, Kerrville and Waco will get $240,000 in matching grants for construction and renovation projects. $1 million was awarded for a 4,000-square-foot urban ecology center at Voelcker […] [Read More]


text:
Kitchen Wares
Ball, 1/2 Gallon (64 oz), Wide Mouth, Mason Canning Jars, 6-Pack 68100$12.99
Ball, 1/2 Gallon (64 oz), Wide Mouth, Glass Preserving Jars, are ideal for fresh preserving apple and grape juices. Our famous glass jars and closures go beyond fresh preserving to help you with serving, creative decor, and gift-giving.
How to Store:
- Enjoy Now - refrigerate up to 3 weeks
- Fresh Preserve - store up to 1 year
- 6-Ball, 1/2 Gallon (64 oz), Wide Mouth Glass Preserving Jars
- 6-Ball, Wide Mouth Lids with Bands
- Step-by-Step instructions on bottom of package
- Height with lid: 9.25 inches
- Width: 4.47 inches
Ball Mason Jar 24 Oz 9 Wide Mouth Pack 144065500$11.99
Longer vegetables such as asparagus, cucumbers, & long beans now have a jar that's made just for them! This 24-oz jar is an excellent choice for portioning soups and sauces. Perfect when pints are too small & quarts are too big.
- Fit in standard canning pots
- Use with recipes that call for quart size jars
- Freezer safe
- Hold 3 cups of food
- Diameter : 3-in.
- Height : 6.75-in.
- Material : Glass with Tinplate Steel
- Origin : United States
- Size/Capacity : Set of 9/1.5-pt.
Presto Microwave Bacon Powercrisp Cooker 05100$12.99
The easy way to make crisp, delicious bacon in your microwave. Bacon cooks leaner and healthier than pan fried.
- Special cooking racks allow fat to drip down into the exclusive deep base.
- An easy-grasp handle wraps around the entire base so it's always within reach.
- Cooked bacon easily lifts away with the edge of a knife.
- Bacon cooker is fully immersible and dishwasher safe.
- Removable cooking racks separate and stack in base for compact storage.
- 1-year limited warranty.
- 9.5L x 9.5W x 6H
Love Bacon but don't want to Microwave it? Check out our other product! The Norpro 9" Round Cast Iron Bacon Press 1401.Learn More
Nesco Add-A-Tray Accessory Pack For FD-80 SQT-2$14.99
Need more room to dry your food or jerky? Add-A-Tray® Accessory Packs add 2 extra trays to expand your dehydrator's capacity. Perfect for drying more beef jerky with Nesco's famous jerky seasonings!Learn More
Nesco ''How to Dry Foods'' Book by Deanna DeLong HP-9$14.99
Dehydrating just got easier with the ''How to Dry Foods Cookbook'' by Home Economist Deanna DeLong. Everything you need to know about drying foods is included in this 160 page soft cover book. Lots of recipes, hints, and tips. Includes sections on fruit, fruit leathers, vegetables, herbs & spices, nuts & seeds, meat, and fish. Also covers the history, methods, and equipment for drying.Learn More
Wilton 17" x 13" Recipe Right Roasting Pan 2105-965$12.99
Recipe Right® is constructed of heavy-gauge steel that provides an even-heating performance, baking experts prefer for perfectly-browned baked goods. The non-stick coating makes food release and clean-up a breeze!Learn More
LEM 10lb Trail Bologna Kit 9285$10.99
Product Features
Fresh sausage seasonings are great blends for fresh sausage links or patties. Great for breakfast or anytime!Learn More
Norpro 9" Round Cast Iron Bacon Press 1401$12.99
- Press surface is 9 inches/23cm diameter
- Features a wooden handle that stays cool to the touch.
- Ideal for bacon, grilled sandwiches, hamburgers and quesadillas
- Includes instructions for seasoning before use, cleaning and storage
- Hand wash, rinse thoroughly and dry with a paper towel - never soak cast iron
Norpro, Deluxe Cherry Stoner/Pitter 5120$14.99
- Easily and snugly clamps onto counter tops.
- Clamp width up to 1.75"/4.5cm.
- Speed up the tedious task of removing pits quickly without bruising or crushing cherries.
- No mess or wasted fruit.
- High vacuum suction base keeps pitter in place during use. Sturdy spring-loaded flunger.
- Features automatic feed tray and catch hopper.
- Light and easy to clean.
- Ideal for canning, freezing, dehydrating and baking.
Presto Pressure Regulator 09978$10.99
Pressure Indicator & Regulator, For All Pressure Cookers Manufactured After 1957 Except 01/PA4, 01/PA6, 01/PA4H, 01/PA6H, 01/PA6HB, 01/PE3, 01/PE6, 0121001, 0125001, 0122101, 0126101, 0211101, 0115101.Learn More


text:
in this issue
premium services
online directory
customer care
World News and Views :: Projects
Petronas's Rapid project likely to again miss FID deadline
9:41 AM MST | February 24, 2014 | Natasha Alperowicz
Petronas (Kuala Lumpur), the state-owned energy group, is likely to again miss a final investment decision (FID) for a previously announced $19-billion Refinery and Petrochemical Integrated Development (Rapid) project at Pengerang, Johor State, Malaysia, The Edge Financial Daily newspaper reported today, citing unnamed sources familiar with the situation. Petronas said last July that external factors beyond its control led to the FID being postponed from June 2013 to March of this year. But, this deadline is also expected to be missed the newspaper says...
This information is only available to Chemical Week subscribers.
Forgot your user ID or password?
Not an IHS Chemical Week member yet?
Here's why you should be:
100% Satisfaction Guarantee
contact us | about us | customer care | privacy policy | sitemap | advertise
Copyright © 2015 IHS, Inc. All rights reserved. Reproduction in whole or in part without permission is prohibited.


text:
Occupational Identity Development, School Performance, and Social Support in Adolescence: Findings of a Dutch Study
Meeus, Wim, Adolescence
According to Erikson (1968), the most important developmental task in adolescence is the formation of an identity. Marcia's (1966) identity status model is held to be the major elaboration of Erikson's views on identity formation in adolescence (Cote & Levine, 1988). Identity, Marcia suggests, is an ego structure--an internal, self-constructed and dynamic organization of aspirations, skills, beliefs, and individual history.
Following Erikson, Marcia looks upon adolescence as the period in which youngsters experience an identity crisis, which they solve by making choices regarding their future in a number of life domains. Crisis and commitment are the core variables in Marcia's identity status model. These variables make it possible to distribute adolescents over four identity statuses. Identity diffusion indicates that the adolescent has made no commitment as yet regarding a specific developmental task and may or may not have experienced a crisis in that domain. Foreclosure holds that the adolescent has made a commitment without having experienced a crisis. In Moratorium, the adolescent is in a state of crisis and has made no commitment or at best an unclear one. Identity achievement signifies that the adolescent has surmounted the crisis and made a commitment.
Table 1. Marcia's identity status model IDENTITY FORECLOSURE MORATORIUM IDENTITY DIFFUSION ACHIEVEMENT CRISIS/ EXPLORATION yes or no no actual yes, past COMMITMENT no yes unclear yes
Reviews of research using Marcia's paradigm (Marcia, 1980; Waterman, 1982) indicate that the identity statuses can be divided into two groups: identity achievement and moratorium are generally associated with positive characteristics (e.g., high levels of self-esteem, autonomy, reasoning in terms of moral values), whereas foreclosure and identity diffusion are associated with negative characteristics (e.g., low levels of self-esteem, autonomy, reasoning). While there are exceptions (cf. Meeus, 1991), overall the division is valid (see Marcia, 1980, and Archer & Waterman, 1988, for a discussion of whether the various identity status categories for men and women can indeed be divided into the same two groups).
Marcia's paradigm assumes that identity formation is domain-specific. That is, adolescents will or may have a distinct identity status in the areas of school/occupation, politics/ideology, and intimate relationships. The present study concentrated on the development of occupational identity, and the factors that influence this process.
Adolescence, Status Insecurity, School
The transition from school to job is a crucial passage in adolescence. In general, the lifelong occupational die is cast at an early age. In view of the fact that occupational position is a major indicator of social status, one can define adolescence as the period in which social status is assigned (Kreutz, 1974).
This stamps adolescence as a time of both opportunity and uncertainty. Side by side are the challenge to move up the social ladder and the threat of moving down. Young people may aspire to a higher occupational level than that of their parents (upward mobility); a lower occupational level implies downward mobility.
As can be adduced from much research on schooling and occupational careers (Diederen, 1983; Meijers & Wesselingh, 1983; Meijers, 1989), the educational level attained determines labor-market opportunities. For this reason, the transition from a lower to a higher educational level in adolescence can be defined as upward mobility as well, and the move from a higher to a lower educational level as downward mobility.
Educational level and school performance, then, are very important to young people. A review article spanning thirty years of research (Nurmi, 1991) indicates that, in planning for the future, adolescents are most preoccupied with their careers in school and work. …


text:
Belkin's iPhone camera remote and stand takes the pain out of group photos
Taking group photos with the iPhone is a pain. The phone doesn't have a timer, so you need to grab a stranger to take the picture for you. And while some camera apps do have a timer, it's not easy to prop the iPhone up at an acceptable picture-taking angle.
That's where Belkin's LiveAction Camera Remote comes into play. The pocketable device, above, allows you to remotely take photos or video with your iPhone. The remote also houses a small stand that can hold the phone while you take pictures. Simple, right?
Belkin's iPhone Remote works with Belkin's LiveAction camera app and connects to the iPhone via Bluetooth. You can download the LiveAction app for free from the iTunes app store.
No word on pricing or availability, but the LiveAction remote passed through the FCC today, which means a launch should be coming soon.