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You can't go a day without being bombarded by some company touting the latest secret to happiness, longevity, or riches... Yet somehow the secret always involves you forking over your cash to them.
"And now back to 'The Totally Unbiased Secret to Healthy Living', brought to you by McDonald's, the official restaurant of the Olympics!"
It's all bullshit. Who *can* you trust these days? Even the "science" is skewed. Every day there's another headline-making study. Every following day there's a headline-making discovery about where the funding for said study came from.
***the non-milk drinkers studied also happened to be heroin addicts"
So basically, you can't trust anyone these days. But you can still trust yourself, right?
The companies don't want you to think so. They want you to be so deeply entrenched in misery and self-doubt that you'll try ANYTHING. They've done a good job convincing most of us that our instincts are wrong.
I'm here to make a potentially controversial claim: your instincts are probably trying to tell you something! But the message is drowned out by commercials designed to get in our heads and stay there, by our lying government telling us we'll shrivel up and die if we don't eat a buttload of whole grains at every meal, but it's perfectly fine to ingest milk from cows pumped with antibiotics and proven-to-be-carcinogenic growth hormones.
You don't want to be the n00b the marketing execs are talking about in meetings when they say "yessss, the cussstomers will LOVE our new purrrrrple box...yessss...casssssh" do you? I sure don't. I want to be an informed consumer. I want to be able to sort through the wealth of information coming at me. I've done some research, and I've refined my inner bullshit detector, and now I want you to join me in voting with your dollars for real food over packaged, processed, nutrition-less crap designed to drain your money and keep you hungry for more.
It's common knowledge that cigarette companies add a bazillion things to cigarettes. Most of them are DESIGNED TO GET YOU ADDICTED. Food companies do the same thing. Look at the label of that "healthy" Kashi bar or whatever. Do you know what half that shit is? No? Do you know why it's in your food? No?
Your body's all you have. Conventional wisdom places God-like value on certain things. I hear people say stuff all the time like "I can't get through the day without coffee! I'm tired, I must need some coffee! Oh magical beverage how I worship thee!" (maybe no one's saying the last one, but they might as well be). Yet people laugh at the same logic applied in other ways-- "I can't get through the day without a salad" "LOL R U ONE OF THOSE HEALTH WEIRDOS?? HAHA SUXX....gee man, I'm tired, wonder why...it couldn't possibly be a nutritional deficiency, I mean those aren't real....magic beverage time!"
I'm rambling now. The world needs more informed citizens. For that to happen, we need more good ol' unbiased sources of information. So here I am! I genuinely want you to be healthy. I want you to feel as good as I do. I want to spread the word about poor nutrition and depression. This is going to be the era of health, I can feel it. Who's with me??
Show some love: Become a member of this site! Members can submit their own blog posts and add to the wealth of knowledge we have here. Is there something you know a lot about, that you think it would help others to know? Join and share it!


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Chemical Week Magazine :: New Construction Projects
Petrokemya Signs Deal with Tecnicas Reunidas for ABS Plant
7:39 AM MDT | June 15, 2012
Arabian Petrochemical Co. (Petrokemya; Jubail, Saudi Arabia), a Sabic affiliate, has signed a letter of intent with Tecnicas Reunidas (Madrid) for the engineering, procurement, and construction of an acrylonitrile butadiene styrene (ABS) plant at Jubail. The total investment in the project is expected to reach $561 million and the company is planning to finance the capital costs from its own resources. The ABS project is expected to be mechanically completed during the fourth quarter of 2014. It will be designed to produce 140,000 m.t./year of a variety of grades...
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subset: commoncrawl


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The Kid's Culinary Camp is settled in Northern Vermont Farmland. The Camp farmhouse was originally built in 1811. In 2006, Chef Kelly commissioned a major remodeling program and built a large commercial kitchen ideal for teaching Culinary Arts at the Highgate, Vermont campus. From there the Camp expanded considerably over each year adding facilities and new curriculum. In 2010 we kicked off our all New State of the Art Bake shop and Pastry Arts program.
In 2012 and 2013 plans to build a new media center for students, Maple Sugar House, Outdoor Cooking Pavilion,
The facilities include:
The Dormitories:
We are located off Route I-89. Take Route I-89 north to exit 20. After exiting turn right on route 207 and go approximately 7 miles to route 78. Turn right on route 207 and 78. Go 2 tenths of a mile and turn left on to Route 207 north. This is Gore Road. We are located just under 5 miles on the right hand side. It is a beige house with a blue roof and 3 silos in the back. If you reach the Canadian Morses line road you have gone to far.
Highgate Campus


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Excellent location. 10 mins to Times Square and 5 to Central Park. Safe and quick access to the subway. Fine selection of eating and entertainment all within easy reach. I paid top dollar for a corner room on a high floor. Be aware high floors start at 8 and is pretty noisy! I didn't think the staff were the most helpful or as friendly as I have experienced elsewhere in NY. Room cleaning could have been better."
This hotel is in a great location! We were not far from everything. Clean rooms and nice housekeeping ladies!Just wish it had a pool/hot tub to enjoy and relax after a full day of walking! We will definitely stay here again!"
I was in town for a festival and this hotel was the perfect location. I was able to walk where ever I needed to and felt safe. Right across the street form Penn Station."
The staff was great, the room was clean and perfect for the amount of time we spent there."
My family and I only stayed for one night but we were very comfortable. The room was very clean and we especially loved the climate control, especially in the Vegas heat. Room service was speedy in tending to what we needed."
Got to hotel at midnight and long line to check in. Got to room and had ajoining door to next room. We could hear loud talking. Went down and had little trouble getting another room. From there, really enjoyed our stay. Everthong right there on hotel, casinos, restaurants, shops, rides and free viewing from the tower. Rooms comfortable. A little wakk to the strip."
ACME was a fun hotel with a quirky and catchy sense of design and marketing. Everything was great: staff, location, room, check in/out process. We'd go back for sure!"
Very impressed the room had sleep number bed! Great hotel."
Convenient location after helping my son move in to his new apartment. It provide a much needed restful night's sleep!"
very nice downtown hotel. As with all the downtown hotels the bum problem is getting to be a real problem. It is not the hotels responsibility but that of the city."
Fine - better than expected, but did not spend much time in the hotel."
It was a short walk to everything. We enjoyed our stay."
They call New York the city that never sleeps, and for good reason, because you can find something to...
With a palpable energy and dynamic vibe, New York City enchants visitors of all ages. Whether you're...
Orlando has been nicknamed as 'The City Beautiful' and the world's 'Theme Park Capital,' and it is...
The Puritan City has come a long way over the years, and there's no need to worry - modern Boston is...
Let little imaginations run free as you explore this family-friendly city's wealth of inspiring...


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Hang tight!
Recipe by Jan
"These are fantastic. You have got to try them."
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2 cups
semisweet chocolate chips
3/4 cup
crunchy peanut butter
3 cups
toasted oat cereal
great beginner recipe. I used natural, smooth pb and honey nut cheerios w/ great results. These are pretty melty on your fingers as you eat them so I think wrapping each serving separately in wax paper or saran wrap and storing in the fridge would be a good idea...
These were just too soft and messy. They were great just out of the refrigerator, but after a bit they became gooey enough to fall apart when I picked them up.
9 Ratings
A great recipe to share with a beginning cook. The young cooks can make as a treat. Very easy with minimal dishwashing but with a great tasted
Tasted ok...huge mess. I would rather make other desserts than this again.
Very easy to make. I took them to work and everyone loved them.
easy, delicious, and fun. A great treat to make with the girls or with kids.
These are really messy to eat, but tasty. I used Lucky Charms and they turned out great.
My BF's boys think I am the absolute BOMB in the kitchen with the recipes I get from this site! I doubled the recipe, put it in a 9x13 pan, used up the last of the Cheerios (which came to about 7 cups total and they were still all evenly covered with chocolate). They set up perfectly and got rave reviews. Will definitely be making this one again. Thanks for another new favorite!
* Percent Daily Values are based on a 2,000 calorie diet.
Crunchy Chocolate Bars
Serving Size: 1/24 of a recipe
Servings Per Recipe: 24
Amount Per Serving
Calories: 126
Calories from Fat: 76
With our 2,700+ chicken breast recipes, you'll never serve the same old chicken again.
The firm, juicy texture of zucchini make them a perfect side to toss on the grill.
Delicious recipes, party ideas, and cooking tips! Get a year of Allrecipes magazine for $7.99!
Green minty cheesecake brownies are festive for St. Patrick's Day.
See how to make chocolate cookies coated in confectioners' sugar.
Time to get your nom-noms on! It's peanut butter and chocolate in a bar.


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From the blog
If there is a place that does not disappoint for Restaurant Week, it is Benoit, the French bistro owned by Chef Alain Ducasse. This is the perfect occasion to try this place that I visited before (check my review of Benoit here).
I love the feel of that place that makes you travel miles away, in an elegant French bistro in Paris.
Tiny's and The Bar Upstairs is a popular place located in TriBeCa and housed in a three story building that dates from 1810. There, siblings Ana, Jack and Matt Abramcyk paired with Chef Paul Warthen to serve to an hungry crowd some American dishes with southern and French influences.
The first time I tried Quiznos, I did not need to be pushed to get toasted as they say: I mean, I love their steak sandwiches. I discovered them few years ago and was definitely worried that they would close when I heard that they had difficulties and filed for chapter 11 bankruptcy in 2014, from which they emerged few months later, after closing few locations.
Jodi and I were looking for a restaurant on Opentable for a dinner on a Friday. We decided to book a table at Cara Mia, an Italian restaurant in Hell's Kitchen. We passed in front of it few times, so I thought we should give it a try. I admit that when we arrived, I has a bad feeling; it might be the fact that one of the staff members was outside, trying to convince people to come for dinner...
I remember that when I was a kid, I used to see TV series or movies where people were making pancakes, wondering what it was, as we did not have that in France. In all cases, I would definitely not say that crepes are like pancakes and it makes me cringe when I hear people comparing the two as they are totally different!
Anyway, here is the way I make pancakes at home.
I love BAO, these steamed buns of all sorts of shapes that you can find in Chinese restaurants. I love it so much that I was curious to know how to make it and decided to try myself. I made two versions: pork belly for me and tofu for Jodi (not entirely vegetarian as it contains fish sauce). It is not that this recipe is complicated, but it takes some time.
During our trip to Florence, we had some amazing Tuscan white bean soup. This recipe is inspired from it. Enjoy (I did)! and bon appétit!
A very comforting pasta dish, full of veggies. You will also learn how to make ravioli!
Bugnes are some sort of beignets that are popular in Central-Eastern France, the most known being the bugnes de Lyon. There are two sorts: the soft and the crunchy, the difference between the two being the presence of yeast (soft) or not (crunchy). It is not difficult to make, but takes a bit of time as the dough has to rise.
I love paella and tried to recreate my own version, made with meat and seafood and cooked for long enough so the rice gets very soft and flavorful. In this recipe, I have replaced the saffron by turmeric, to give to the rice this nice yellow color, saffron being expensive. Here is the recipe:
Check out this recipe to make some delicious butternut squash ravioli with taleggio cream. In this recipe you will learn how to make homemade pasta! Yum!
It has been a while we were talking about going on a food tour, when I received an email inviting us to one of the tours organized by Like A Local Tours, a company that proposes food tours in the Flatiron area as well as Brooklyn. We decided to try the Flatiron History & Food Tour. Ok, I admit that I was more interested by the food than by the history, but was in fact quite pleased to learn a bit of the past of this area I often visit. It was also a good occasion to take the time, in this fast paced city, to stop and admire the architecture of the buildings we passed so many times in front of, without even noticing how beautiful they were.
Pick of the month
© www.ijustwanttoeat.com 2011-2014. Unauthorized use and/or duplication of this material without written permission from this blog's author is strictly prohibited. Excerpts and links may be used, provided that full and clear credit is given to Jean-Philippe Gerbi and www.ijustwanttoeat.com with appropriate and specific direction to the original content.


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Items are for sale onsite at the NVTI training hotel. Purchases may also be made by completing the NVTI Store Order Form and mailing this and your check to the NVTI Alumni Office. If you would like to pay by credit card, please call the NVTI Alumni Office at 303-315-2333 to process your payment.
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All trademarks are registered property of the University. Used by permission only.


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We developed a remote-control for a Sony-Camera on a MikroKopter. Here I show how good it works.
- OktoKopter-XL with 10.000mAh Lipo and Carbon props
- SLR2 cameramount
- Sony CX730 Camera
- Graupner MC-32 Transmitter with a MikroKopter - Firmware
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Embodiments of the present invention relate generally to solder bump formation and semiconductor device assemblies. One embodiment related to a method for forming a bump structure includes providing a semiconductor device (10) having a bond pad (12), and forming a first masking layer (20) overlying the bond pad (12). The first masking layer (20) is patterned to form a first opening (22) overlying at least a portion of the bond pad (12). A second masking layer (40) is formed overlying the first masking layer (20), and the second masking layer (40) is patterned to form a second opening (42) overlying at least a portion of the first opening (22). The method further includes forming a stud (30) at least within the first opening (22) and a solder bump (60) at least within the second opening (42).
1. A method for forming a bump structure, comprising:
providing a semiconductor device having a bond pad;
forming a first masking layer overlying the bond pad;
patterning the first masking layer to form a first opening overlying at least a portion of the bond pad;
forming a stud at least within the first opening;
forming a second masking layer overlying the first masking layer;
patterning the second masking layer to form a second opening overlying at least a portion of the first opening;
forming a first solder bump at least within the second opening; and
removing the first masking layer and the second masking layer.
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The present invention relates to surface-mount semiconductor device processing, and, more particularly, to solder bump formation on semiconductor devices and products.
Electronic assemblies often employ integrated circuit (IC) devices, which are generally characterized as being electrically and mechanically attached to a substrate of an electronic circuit assembly with a number of terminals or leads that are soldered, such as with a tin-lead solder, to conductors on the surface of the substrate. A prominent example of a SM IC is a flip chip, which has terminals typically in the form of solder bumps. Due to the numerous functions typically performed by the microcircuitry of a flip chip, a relatively large number of solder bumps are often required.
As integrated circuit sizes continue to shrink, there is an increased need for fine pitch solder bump flip chip assemblies in order to provide enhanced electrical performance together with reduced cost. However, existing solder bump technology provides insufficient solder volume to ensure reliable performance for devices with less than a 225 um pitch. Pitch is defined as the minimum center-to-center distance between solder bumps on a particular flip chip assembly. Moreover, because existing electroplate bump technology uses a single photo exposure to define the openings for both the conductive stud and solder bump plating, the plated solder volume is limited by both diameter and circular shape of the conductive stud.
FIG. 1, labeled prior art, illustrates in cross-section a portion of a semiconductor device 13 that has been partially fabricated using a single photo exposure step to define the openings for both a copper stud and solder bump plating. Semiconductor device 13 includes substrate 10, bond pads 12, passivation layer 11, barrier layer 14, photoresist 16, plated copper studs 18, and plated solder bumps 17 and 19. As shown in FIG. 1, plated solder bumps 17 and 19 have been grown from copper studs 18 and mushroomed over photoresist layer 16. That is, plated solder bumps 17 and 19 overflow edges 21. When the existing technology is used for fine pitch application, plated solder bumps 17 and 19 encroach upon each other, as shown in FIG. 1, possibly shorting bond pads 12. Furthermore, as pitch decreases, the volume of solder bumps 17 and 19 also typically decreases to prevent such a shorted condition. Reduced solder volume causes lessened standoff between surface-mount coupled devices which results in the inability of underfill material to flow between the coupled devices. Both reduced standoff and insufficient underfill flow could result in lessened reliability.
The present invention may be better understood, and its numerous objects, features, and advantages made apparent to those skilled in the art by referencing the accompanying drawings. The use of the same reference symbols in different drawings indicates similar or identical items.
FIG. 1, labeled prior art, is a cross-sectional view of the conventional fabrication of a semiconductor device having solder bumps.
FIGS. 2-8 are cross-sectional views of the fabrication of a semiconductor device having solder bumps.
FIG. 9, labeled prior art, shows a conventional mask feature and the resulting solder bump structure.
FIGS. 10-12 show the use of various paired mask features and corresponding resulting solder bump structures.
FIG. 13 is a flow chart illustrating a method for fabricating a semiconductor device having solder bumps.
Skilled artisans appreciate that elements in the figures are illustrated for simplicity and clarity and have not necessarily been drawn to scale. For example, the dimensions of some of the elements and figures may be exaggerated relative to other elements to help improve understanding of embodiments of the present invention.
Embodiments of the present invention relate generally to solder bump formation and semiconductor device assemblies. One embodiment, related to a method for forming a bump structure, includes providing a semiconductor device having a bond pad, and forming a first masking layer overlying the bond pad. The first masking layer is patterned to form a first opening overlying at least a portion of the bond pad, and a stud is formed at least within the first opening. A second masking layer is formed overlying the first masking layer and the stud, and the second masking layer is patterned to form a second opening overlying at least a portion of the stud. The method further includes forming a solder bump at least within the second opening.
Another embodiment related to a method for forming a bump structure includes providing a semiconductor device having a bond pad and forming a masking layer overlying the bond pad having a first portion and a second portion. The first portion of the masking layer is closer to the semiconductor device than the second portion of the masking layer. A first opening is formed in the first portion of the masking layer and a second opening is formed in the second portion of the masking layer. The first opening overlies at least a portion of the bond pad and the second opening overlies at least a portion of the first opening. The method further includes forming a solder bump at least within the second opening.
One embodiment related to a semiconductor device assembly includes a substrate and a semiconductor device attached to the substrate via a plurality of solder bumps. The plurality of solder bumps have a pitch that is less than or equal to approximately 200 microns and at most approximately four times a distance between the substrate and the semiconductor device.
The following discussion is intended to provide a detailed description of at least one example of the invention and should not be taken to be limiting of the invention itself. Rather, any number of variations may fall within the scope of the invention which is properly defined in the claims following this description.
As is discussed in greater detail below, a first resist layer or masking layer overlays a semiconductor device for Cu stud plating, and a second, often thicker, resist layer or masking layer is overlaid for solder plating. By using two separate resist layers, the mask opening area for solder plating can be increased. For example, a first opening having a first size and shape may be used to define the studs, and a second, larger size and shape may be used to define the solder bumps, thereby increasing the solder volume of the resulting solder bump while allowing finer pitch solder bump formation with improved standoff. This method also offers the mask designer the flexibility to further increase the solder volume when the IC does not have a full area array of bumps. Increased solder volume provides increased standoff distance between flip chip interconnected semiconductor devices and substrates (flip chip assemblies). Increased standoff provides improved underfill flow between the interconnected devices and substrates, which in turn increases reliability of the resulting flip chip assembly.
For example, in one embodiment, calculations have shown that for a 150 μm full area array device, the maximum solder volume for one previously existing electroplating bumping process is 378,000 μm3. Based on the teachings herein, the maximum solder volume may be increased to 720,000 μm3 on a similar device. In addition, such an increase in solder volume offers, for example, a 79 μm standoff after assembly. With such a standoff, the existing assembly and underfill process offer greatly improved reliability and performance. Thus, the solder bump volume can be increased by up to and over 90% using 150 μm pitch as an example.
Referring now to FIGS. 2-8, a method of fabricating a semiconductor device to have a solder bump will now be described in detail. The cross-sections of FIGS. 1-8 illustrate this method as a portion of an overall process flow for fabricating the semiconductor device. As will be apparent to those of ordinary skill in the art, the partial process flow to be described herein may be applied in the fabrication of many types of semiconductor devices, in which the full process flow will include many other process steps conventional in the art.
Referring to FIGS. 2 and 13, wafer 23 is provided at step 131. Wafer 23 includes substrate 10 with bond pads 12 and passivation layer 11 overlying substrate 10. Substrate may be any type of appropriate substrate material such as silicon or gallium arsenide. Substrate 10 can include a variety of semiconductor devices and integrated circuits. Bond pads 12 may be any appropriate material such as aluminum or copper. Passivation layer 11 may be any type of appropriate passivation layer material such as silicon nitride, oxynitride, polyimide, or PSG.
At step 132, barrier layer 14 is formed over passivation layer 11 and bond pads 12. Barrier layer 14 may be any type of appropriate barrier layer material such as titanium tungsten and/or titanium tungsten nitride. Barrier layer 14 may also include a sputtered layer of copper overlying the titanium tungsten and/or titanium tungsten nitride layers to provide a seed layer for electroplating, for example. Barrier layer 14 may also include an adhesion layer such titanium tungsten, titanium tungsten nitride, tantalum nitride, or chrome. Barrier layer 14 may therefore include a plurality of layers, each performing a different function and including different materials. Alternate embodiments may not include a barrier layer, or may include only an adhesion and/or a seed layer, for example.
At step 133, a first resist layer 20 is formed over barrier layer 14. Resist layer 20 may be a photoresist layer or any other appropriate photo imageable polymer or other appropriate photoresist material. Alternatively, any type of resist or masking layer may be used such as resist layers responsive to nonvisible radiation. In one embodiment resist layer 20 is in a range of approximately 5 to 50 microns. In another embodiment, photoresist layer 20 is in a range of approximately 10 to 20 microns, and preferably approximately 15 microns thick. At step 134, resist layer 20 is patterned to form openings 22 where, in one embodiment, openings 22 are smaller than bond pads 12.
Referring to FIGS. 3 and 13, copper studs 30 are formed over barrier layer 14 and bond pads 12 in openings 22 at step 135. Copper stud 30 is grown from a seed layer contained in barrier layer 14. Although the present embodiment includes copper studs 30, other embodiments may include other materials (such as other conductive materials) to construct studs in openings 22. Also in the present embodiment, copper studs 30 are totally within openings 22. In other embodiments using other processes, copper studs 30 may overlap edges 31 of photoresist layer 20.
Referring to FIGS. 4 and 13, a second resist layer 40 is formed over resist layer 20 and copper studs 30. Just as resist layer 20, resist layer 40 may be a photoresist layer or any other appropriate masking layer. Resist layer 40 may even be of a different type of masking layer than resist layer 20. At step 137, the second resist layer 40 is patterned to form openings 42. In one embodiment, openings 42 are larger than openings 22. Also in the present embodiment, openings 22 are centered within openings 42. However, they need not be centered within openings 42, as will be discussed with reference to FIG. 5 below. Openings 42 can be as large as possible to accommodate sufficient solder volume so long as the reflowed solder bumps do not encroach upon each other.
Resist layer 40 is generally thicker than resist layer 20; however, alternate embodiments may use two resist layers of equal thickness, or resist layer 20 may even be thicker than resist layer 40. Also, openings 42 can be of various different shapes such as circular, rectangular, or other shapes depending on the solder bump layout. Openings 22 can likewise be of various shapes and sizes and are not limited to circles.
An alternate embodiment may use a single masking layer having two portions where a first portion contains openings 22 and a second portion contains openings 42. One way to accomplish this result is to use a signal pass photoresist coating and expose it twice. The first exposure creates the small opening to define the copper stud, while the second exposure creates the large opening for defining the solder. The exposure time and energy for the second exposure is controlled in such a way that it only exposes a certain depth of the photoresist. Therefore, a first opening is formed in the masking layer to define the stud, followed by a second opening in the same masking layer to define the solder bump. This embodiment would provide similar flexibilities as discussed with the two separate masking or resist layers.
If copper studs 30 overlap edges 31 of resist layer 20, openings 42 are patterned in the present embodiment to expose a portion of resist layer 20. In one embodiment, resist layer 40 is approximately 20 to 60 microns thick, preferably approximately 35 microns thick. In another embodiment resist layer 40 is approximately 50 microns thick. As shown in FIG. 5, openings 52 in photoresist layer 40 can be offset to allow bond pads 12 to be closer together while still assuring sufficient solder volume without encroachment possibly causing a short circuit between bond pads 12. FIG. 5 depicts an example where openings 22 are not centered within openings 52.
Referring to FIGS. 6 and 13, at step 138 solder bumps 60 and 62 are plated on copper studs 30. Solder bumps 60 and 62 may be any appropriate solder material. For example, plated solder bumps 60 and 62 may be any appropriate composition of tin or lead or any other appropriate plating material. Resist layer 40 prevents solder bumps 60 and 62 from encroaching upon each other while allowing sufficient solder volume. Openings 42 in resist layer 40 provide wells for solder bumps 60 and 62 to prevent such encroachment. However, in one embodiment, solder bumps 60 and/or 62 may still slightly mushroom over resist layer 40. That is, solder bumps 60 and/or 62 may still overlap edges 41 of FIG. 6.
Referring to FIGS. 7 and 13, during step 139, the first and second resist layers 20 and 40 are removed. Exposed portions of barrier layer 14 are also removed leaving an under bump metallurgy layer portion of barrier layer 14 under copper studs 30.
Referring to FIGS. 8 and 13, solder bumps 60 and 62 are heated in a reflow process to form substantially spherical reflowed solder bumps. In one embodiment solder bumps 60 and 62 have a center to center pitch 80 of approximately 150 microns. Solder volume and bump height 82 depends on the thickness of resist layer 40 and the size of openings 42. For example, if resist layer 40 is 50 microns, bump height 82 is approximately 98 microns high. In alternate embodiments, solder bumps 60 and 62 may not be reflowed until after being attached to a substrate.
Alternatively, both openings can be formed prior to forming the copper stud. In reference to FIG. 13, block 135 can be performed after block 137 and prior to block 138. For example, a first masking layer can be patterned to form a first opening to define the copper stud, followed by a second masking layer patterned to form a second opening. At this point, a copper stud is formed within at least a portion of the first opening, and a solder bump is then plated on the copper stud. Processing can then continue in a similar fashion as described above.
FIGS. 9-12 show various masking features (90, 100, 102, 110, 112, 120, and 122) and the corresponding resulting solder shapes (92, 104, 114, and 124). In one embodiment, the masking features may correspond to openings in a photoresist layer assuming positive photoresist is being used. However, alternate embodiments may require different masking features.
FIG. 9 labeled prior art shows a final plated solder shape 92 using a traditional single mask 90 process. For example, the single mask resist thickness of 50 microns would produce a solder volume of 0.378 cubic millimeters resulting in a solder bump height of 77 microns. FIG. 10 shows a novel dual mask process, using a first mask feature 100 and a second mask feature 102, resulting in the final plated solder shape 104. A first mask resist thickness of 15 microns with a second mask resist thickness of 35 microns results in, for example, a solder volume of 0.496 cubic millimeters. FIG. 11 shows a similar novel dual mask process, using a first mask feature 110 and a second mask feature 112, wherein the second mask is patterned to produce a square shaped well resulting in a final plated solder shape 114 whose top view is a square. Such an embodiment allows an increase in solder volume of up to approximately 0.604 cubic millimeters. FIG. 12 shows a further novel dual mask process, using a first mask feature 120 and a second mask feature 122, resulting in a final plated solder shape 124. In this embodiment, the second mask is increased in thickness from 35 microns to 50 microns to result in a taller final plated solder shape which also results in an increased solder volume of approximately 0.702 cubic millimeters or more. Such an embodiment results in a height of greater than or equal to approximately 98 microns.
Referring to FIG. 13, at step 141 the semiconductor device is singulated from wafer 23 and attached to a substrate using the solder bumps as the interconnect means using known methods. For example, the semiconductor device may be attached to a ceramic substrate or circuit board or other appropriate substrate. The bumps of the semiconductor device are reflowed while in contact with an array of pads on the substrate to provide electrical and mechanical interconnection. Various materials are then used to underfill the semiconductor device and encapsulate the resulting solder joints to reduce and distribute stress on the solder joints due to, for example, thermal expansion. The underfill provides matching thermal expansion characteristics to prevent interconnect fatigue and maintain the electrical and mechanical integrity of the solder interconnects. Based on the teachings herein, solder bumps 60 and 62 provide increased solder volume which provides increased standoff distance between the semiconductor device and the substrate, which results in improved underfill which increases reliability of the resulting flip chip assembly.
In the past, the ratio of solder bump pitch to the standoff distance has been greater than four to one with a solder bump pitch of greater than 200 microns. That is, in the past, the solder bump pitch was at least greater than four times the standoff distance. However, some embodiments of the present invention allow for a ratio of at most approximately four to one while maintaining a solder bump pitch of at most 200 microns. That is, for a flip chip assembly, or any other assembly described herein above, manufactured in accordance with an embodiment of the present invention, a pitch of only 200 microns may now correspond to a standoff of 50 microns. Therefore, a ratio of less than four to one can still allow for a reasonable standoff, which leads to improved reliability, even as pitches continue to decrease.
The above description is intended to describe at least one embodiment of the invention. The above description is not intended to define the scope of the invention. Rather, the scope of the invention is defined in the claims below. Thus, other embodiments of the invention include various modifications, additions, and/or improvements to the above description.
The foregoing components and devices are used herein as examples for sake of conceptual clarity. As for non-exclusive example, any type of appropriate surface mount technology may be used. Semiconductor device 23 is utilized as an exemplar of any general surface mount semiconductor device, including but not limited to flip chip assemblies. A flip chip or flip chip assembly includes any type of flip chip interconnect related package including for example, direct chip attach (DCA), various types of chip scale packages (CSP), chip-on-board (COB) or flip-chip-on-board (FCOB), Chip On Glass, and any like structures or assemblies. Consequently, as used herein these specific exemplars are intended to be representative of their more general classes. Furthermore, the use of any specific exemplar herein is also intended to be representative of its class and the non-inclusion of any specific devices in any exemplary lists herein should not be taken as indicating that limitation is desired.
Those skilled in the art will recognize that the operations described in exemplary embodiment are for illustration only. For example, some of the operations of FIG. 13 may be combined or the functionality of the operations may be distributed in additional operations or may even be performed in different orders.
Those skilled in the art will readily implement the steps necessary to provide the structures and the methods disclosed herein, and will understand that the process parameters, materials, dimensions, and sequence of steps are given by way of example only and can be varied to achieve the desired structure as well as modifications that are within the scope of the invention. Variations and modifications of the embodiments disclosed herein may be made based on the description set forth herein, without departing from the spirit and scope of the invention as set forth in the following claims.
While the above is a complete description of specific embodiments of the invention, various modifications, alternative constructions, and equivalents may be used. The above description is not intended to present an exhaustive list of embodiments of the invention. Although an attempt has been made to outline some exemplary embodiments and exemplary variations thereto, other embodiments and/or variations are within the scope of the invention as defined in the claims below.
Patent Citations
Referenced by
Legal Events
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Personal and Corporate Software Inspector
Secunia Personal Software Inspector (PSI), available for Windows operating systems, helps you identify the software installed on your computer and keep it up to date. Secunia PSI scans your computer for thousands of known programs, checks for missing security patches and vulnerabilities in those programs, and reports back to you with information on how to update them.
Download the Personal Software Inspector
IU LSPs who deploy CSI agents to systems should provide notification to the users describing who will use the tool, how, and for what purpose, as well as anticipated use of the resulting information.
For more information about the PSI and CSI products, see:
Frequently Asked Questions
Below are several frequently asked questions about the implementation and use of CSI, including email notices that are sent.
- Why do I need to keep my software updated?
- What are the risks of having vulnerable software installed?
- How did CSI get installed on my computer?
- How does IU know that I have peer-to-peer software installed?
- What information is CSI collecting?
- How is the information about my computer protected?
- If I receive a notice from the UIPO generated by Secunia CSI, does that constitute a disciplinary action and will it affect my academic standing or employment status?
- How can I remove peer-to-peer file sharing software?
- How can I remove the Secunia CSI agent?
- What options are available to IT professionals?
Why do I need to keep my software updated?
Software and operating systems aren't coded perfectly, and attackers are always searching for vulnerabilitiies. Vendors continually work to patch these vulnerabilities — and when they do, the patches are released in the form of updates. You risk leaving your computer and personal information vulnerable by neglecting to timely update and patch your software.
What are the risks of having vulnerable software installed?
After software is released, vulnerabilities are frequently found that allow attackers to exploit the program and gain access to your computer and files. Therefore vendors frequently distribute fixes to update the programs and remove the vulnerabilities. When you don't keep it up to date, attackers are able to target you and use the vulnerability to get to your data. So keep your software applications up-to-date by removing or patching vulnerable ones.
How did CSI get installed on my computer?
The Indiana University versions of PSI and CSI may have been installed on your Windows computer in one of three ways:
- Via Get Connected (if you live in the residence halls)
- Via IUware (if you installed the Secunia PSI from IUware)
- By your department's local support provider (LSP)
How does IU know that I have peer-to-peer software installed?
The CSI agent that is installed on your computer sends information about the software programs on your computer to the CSI server run by the UIPO.
What information is CSI collecting?
The CSI agent collects a list of software applications installed, along with their version numbers, and locations on the computer. It does not collect the content of any files. See a detailed response in the "Privacy notice" section of http://kb.iu.edu/data/azfj.html
How is the information about my computer protected?
All data sent from your CSI agent to the CSI server at IU is communicated via an encrypted connection (SSL).
If I receive a notice from the UIPO generated by Secunia CSI, does that constitute a disciplinary action and will it affect my academic standing or employment status?
The notice isn't discipline of itself, but creating risks to institutional data or engaging in unlawful file sharing may lead to discipline and personal liability.
How can I remove peer-to-peer file sharing software?
How can I remove the Secunia CSI agent?
See http://kb.iu.edu/data/azfk.html
What options are available to IT professionals?
The UIPO licensed Secunia Corporate Software Inspector (CSI) to provide IT professionals with an easy way to monitor software vulnerabilities. Additionally software packages can be patched via Microsoft SCCM or WSUS. IT professionals who run their own WSUS or SCCM servers may be interested in running their own Secunia CSI console account in order to create and push out these patches.
IT professionals who want a console account can contact the UIPO to request an account.
Don't want to run the console?
IT pros who want to take advantage of the CSI but don't want to run the console may distribute the generic Secunia CSI agent and view the results via the UIPO's Self-Service Unblock.
To distribute the agent, link the "IU-UISO-CSI" GPO to your OU. For instructions, visit: Link a Group Policy Object from Microsoft TechNet.


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New extended warranty on commercial refrigeration provides extra protection
Traulsen has announced it will offer customers an amazing value-added protection on its commercial refrigeration models starting Jan. 1, 2013. That's when the company will begin providing a three-year extended warranty on all purchases of its commercial refrigerators. That means three years of coverage for parts and labor on every one of Traulsen's great units, from back of bar refrigeration to salad and sandwich prep tables.
Traulsen is the first manufacturer in the commercial refrigeration industry to announce a standard 3-year extended warranty on its products. The extra protection is in addition to the five-year warranty Traulsen offers on every compressor on its commercial refrigerators.
Value-added extended warranty protection on Traulsen commercial refrigeration
For years Traulsen has offered the option of a two-year extended warranty, though with an extra cost. Having that added protection standard on commercial refrigeration the company sells means you, the customer, are getting an amazing deal. You'll be paying the same price, while getting coverage for your commercial refrigeration that could save you hundreds of dollars over the two free years. It's like Traulsen's giving out an early Christmas present that keeps on giving.
Your commercial refrigeration order may be grandfathered
Speaking of early, don't despair if you've recently purchased one of KaTom's commercial refrigerators from Traulsen; the company has decided to offer the extended warranty protection to every commercial refrigeration model ordered since Dec. 1, 2012. So, whether you've already taken delivery or you're tracking a custom order through the build process, as long as you placed your order with KaTom on or after Dec. 1, 2012, you're covered.
The only exception to this amazing value-added protection is Traulsen's RAC family of air curtain commercial refrigerators. Those models will continue to carry the one-year parts and labor warranty, as well as the five-year compressor warranty.
For more information about the Traulsen extended warranty on commercial refrigeration, please call one of KaTom's helpful customer service representatives at 800.541.8683 or e-mail us at firstname.lastname@example.com.


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- Willamette
- Athletics
- News Archive
- 2011
- November
- Willamette Holds Off Alumni
Men's Basketball | Saturday, November 12, 2011
Mounts Scores 22 Points, as Bearcats Hold Off Alumni, 82-74
SALEM, ORE. -- Senior Taylor Mounts (Wing/Post, Kailua, HI/Iolani School) scored a game-high 22 points and led all players with nine rebounds, helping the Willamette University men's basketball team defeat the Willamette Alumni, 82-74, on Saturday, Nov. 12 at Cone Field House. Mounts hit 8 of 13 field goals and made 5 of 6 free throws.
The Bearcats placed four players in double figures, but couldn't put away the talented group of former Willamette players on the Alumni team until the closing minutes.
Other double-digit scorers for the Bearcats were Terrell Malley (Jr., G, Portland, OR/Roosevelt HS) with 16 points, Trevor Bos (So., G, Lakewood, CA/St. John Boscoe HS) with 15 points and Ryan Meehan (Sr., Wing, Beaverton, OR/Beaverton HS/MSU-Billings) with 11 points. Malley and Bos tied for the team lead with three 3-pointers.
Nik Lubisich and John Olinger tied for the Alumni's scoring lead with 17 points apiece. Marcus Holmes chipped in nine points.
Lubisich, who still holds Willamette's single game record for 3-pointers with nine in two different games, sank 5 of 13 trifectas on Saturday. As a team, the Alumni went 10 for 36 from three-point range (27.8%).
Willamette held a slim 37-35 lead at halftime. The Bearcats trailed by as many as five points in the second half, as the Alumni took a 44-39 lead with 18:35 left on a layup by Olinger and held a 55-50 advantage with 13:13 to go following a layup by Holmes.
Each time, Willamette rallied to regain the lead. After Olinger's layup, the Bearcat varsity went on a 11-5 run to take a 50-49 lead. Mounts scored the first five points of the run and Meehan tallied the final six points.
The Alumni countered with a 6-0 run that was capped off by the layup from Holmes. Willamette offset the run with five consecutive points of its own on a jumper by Mounts and a 3-point basket by Derek Newhof (Fr., G, Mercer Island, WA/Mercer Island HS). The game was tied, 55-55, with 12:28 to go.
Olinger put in a layup at the 11:28 mark. Cory Lowe tacked on another layup with 10:38 left to give the Alumni their final lead at 59-55.
Willamette tallied the next eight points, surging into the lead on a pair of free throws by Malley at the 7:03 mark and extending the margin to four points, 63-59, on a layup by Meehan with 6:41 remaining.
Mike Plank ended a scoreless streak of 4:19 for the Alumni when hit one of two free throws with 6:19 on the clock.
The varsity team for Willamette led by as many as six points several times in the closing minutes. Even so, the Alums pulled within three points at 76-73 when Lubisich sank a 3-point shot with 1:30 left.
Bos increased the lead to 78-73 with a pair of free throws at the 1:13 mark. After Lubisich missed a 3-pointer for the Alumni with 53 seconds left, Avery Manu (So., Wing, Pocatello, ID/Highland HS) sank 1 of 2 free throws for Willamette to give the current Bearcats a 79-73 lead.
The Alumni added a free throw by Robbie Kunke with 29 seconds remaining, but Willamette secured the win by converting 3 of 4 free throws the rest of the way.
Willamette shot 41.2% from the field (28 of 68) and made 9 of 26 three-pointers (34.6%). The Bearcats hit 17 of 25 free throws (68.0%). The Alumni was successful on 28 of 75 field goals (37.3%) and made 8 of 19 free throws (42.1%).
Both teams committed a significant number of turnovers, as the Bearcats finished with 30 and the Alumni had 25. The Alums achieved 19 steals, led by five each from Harold Sublett and Kunke. Willamette attained 10 steals, including three by Mounts.
Willamette will open the regular season against D'Youville College (N.Y.) on Friday, Nov. 18 in the first round of Calvin Tip-off Tournament at Calvin College in Grand Rapids, Mich. Game time is set for 2:30 p.m. (PST).
BOX SCOREWillamette University 82
Willamette Alumni 74


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Buck Harvey on Sports
Between columns, Buck discusses the major developments in sports and what's on his readers' minds.
Monthly Archive for March, 2011
Memory of Liz — Jerry begins the circus
In the first month of his first season in Dallas, Jerry Jones outlined what kind of owner he would become. Then, before a game against the Redskins in Texas Stadium, this is how an official began the coin toss: "Captains from Dallas, meet the captains from Washington. Captains from Washington, meet Liz Taylor and Jerry […] [Read More]
Spurs sometimes cry, too
It was June 1999. And in the back of the Madison Square Garden visitor's locker room, standing alone, were two friends already comparing championship notes. That's when Antonio Daniels told Tim Duncan he couldn't believe what had almost happened. Daniels admitted to Duncan he'd almost cried out on the floor, in front of everyone. Duncan […] [Read More]


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Step 1: Toast cornbread
While the cornbread is in the oven we'll prepare the rest of the ingredients.
Step 2: Prepare base
~2T butter or olive oil
onions, chopped
garlic, chopped
celery and/or fennel stalks, chopped
peppers, chopped (Hot, bell, chipotle, etc; I used all of these.)
leeks, chopped (optional)
Combine ingredients and saute until onions are soft.
Add chopped apples and a bag of cranberries, stir, and remove from heat.
Note that I'm NOT giving you quantities here- it's entirely a question of personal taste. Just about anything will work.
Step 3: Prepare sausage
Try to get one of the "spicy/hot breakfast sausages"; these usually come in a tube, and can be made of pork or turkey. Extrude the mush into a hot pan, and stir around until fully cooked.
The other variety should be a chorizo, linguica, or other Iberian sausage. These are often pre-cooked, and just need to be into bite-size pieces for addition to the dressing.
Step 4: Combine ingredients
*Any combination of fresh parsley, rosemary, tarragon, sage, oregano, thyme, etc. I usually add ground allspice at this point too.


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Lupus Foundation of America, Heartland Chapter Opens Office in Kansas City
The Lupus Foundation of America, Heartland Chapter (Heartland Chapter) is pleased to announce the grand reopening of their administrative operations in Kansas City, Missouri. The Heartland Chapter incorporated the greater Kansas City area into their chapter territory in 2010 and recently hired a staff member and reopened their office in the Research Medical Center Doctors Building at 6400 Prospect Avenue West.
The Heartland Chapter developed a five-year strategic plan last year with a focus on greatly expanding programs and services to individuals affected by lupus throughout Missouri, eastern Kansas and southern Illinois. The first phase of this outreach is the greater Kansas City area. Daphne Reitz has been hired as the Heartland Chapter's Community Outreach Coordinator and will be responsible for expanding awareness, community involvement, educational programming and fundraising. She will coordinate the successful Walk to End Lupus Now ™ on September 13, 2014 at Shawnee Mission Park and support other fundraising efforts.
About Lupus
Lupus is an unpredictable and misunderstood autoimmune disease that ravages different parts of the body. It is difficult to diagnose, hard to live with, and a challenge to treat. Lupus is a cruel mystery because it is hidden from view and undefined, has a range of symptoms, hits out of nowhere, and has no known cause and no known cure. Its health effects can range from a skin rash to a heart attack. Lupus is debilitating and destructive and can be fatal, yet research on lupus remains underfunded relative to its scope and devastation.
About the Lupus Foundation of America, Heartland Chapter
The Lupus Foundation of America, Heartland Chapter is part of a national force devoted to solving the cruel mystery of lupus while providing caring support to those who suffer from its brutal impact. We work with local health professionals and volunteers to provide information and programs to ensure people with lupus and their families get answers and health professionals know about new means to diagnose and manage the disease. With the help of informed volunteers and committed supporters, we conduct activities to increase awareness of lupus, we rally support for those who are affected by lupus and advocate on their behalf, and we raise money to support research and education programs so everyone affected by lupus can have an improved quality of life.
Together we will solve the cruel mystery!


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The new Washington Post/ABC News poll reported yesterday, showing a slim plurality approving of Obamacare, arrives at those results by over-sampling Democrats. The result, by sampling Democrats who are heavily supportive of Obamacare and including too many of them in the sample, creates a skewed result. The poll reports 49 percent supporting Obamacare while 48 percent are opposed to the health care reform law.
The poll also reveals that Democrats favor Obamacare 76 percent to 21 percent while Republicans oppose it 78 percent to 20 percent. Independents, who make up typically about one-third of the voting electorate, oppose Obamacare 54 percent to 44 percent in favor of it. Calculations based on these numbers estimate that about 40 percent of those surveyed self-identified as Democrats while the sample included about 27 percent Republicans and 30 percent independents. No current legitimate survey data suggests that 40 percent of voters are Democrats. Once again, like many of the polls in 2012, this survey over-sampled Democrats to show a skewed results.
Based on the 2012 exit poll data showing the electorate to including 37 percent Democrats, 32 percent Republicans and 29 percent independents, if Mitt Romney had received 21 percent of Democrats, 78 percent of Republicans, and 54 percent of independents as opposition to Obamacare received, he would have won the 2012 election 52 percent to 48 percent over Obama. Clearly, those results can't legitimately show 49 percent in favor of Obamacare.
The data from the Washington Post/ABC News polls, unskewed, indicates 55 percent opposing Obamacare while 43 percent support it. This would still vary greatly from the Associated Press/GfK survey last week that showed Obamacare having a 26 percent approval rating.
It should be noted also, the Washington Post/ABC News poll was the first reported to be skewed, and likewise unskewed, in this column here on Examiner. During the 2012 election season, this particular poll remained among the most skewed of media-commissioned surveys.
Earlier this week, the latest CNN/ORC poll was similarly skewed. In 2012 during the last presidential election on the Fox News segment "Campaign Insiders" show, Democratic pollsters Pat Caddell and Doug Schoen both confirmed their belief that major polls are skewed in favor of the Democrats by over-sampling of Democratic voters when the surveys are conducted.
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text:
Overall Review:
3 out of 5.
Libigrow is a male-enhancement supplement designed to enhance libido. Along with others from the Libi line of supplements — LibiGirl and LibiShots — LibiGrow is made from all-natural herbs and other ingredients that have shown positive results in tackling the problem of desire, especially as we age.
L-Arginine, Ginseng, and Horny Goat Weed are three of the main components of this formula. When taken properly, L-Arginine can work to promote the production of nitric oxide, an essential process in gaining an erection. Stacking well with Ginseng and Horny Goat Weed, these products can also enhance desire as well as heighten blood flow, another necessary component of sexual performance: the more blood that can flow into the penis, the more efficient and potentially stronger a man's erection can become.
Libigrow claims to work quickly to arouse desire, and offers other products on their website that are variations of itself, catering to convenience.
- may improve libido
- promotes positive overall health
- all-natural formula
- ingredients may not be powerful enough to combat severe erectile dysfunction
- may not work quickly for all men
- Cordyceps
- Flat stem milkvetch
- Chinese dodder
- Ligustrum
- Cnidium
- Cherokee Rose
- Walnut
- Dong Quai
- Astragalus
- Schizandra
- Korean Ginseng
- Vitamin E
- Niacin
- Zinc
- L-Lysine
- Ginkgo Biloba
- Caffeine
- L-Arginine
- Horny Goat Weed
- Green Tea Extract
- Maca
- Rice Flour
Collected on March 29, 2011
Please contact us if this information is incorrect.
Clinical Studies:
Please feel free to share your comments or leave your own review on Libigrow below.
12. Nov, 2013
this a pretty good product got hard and stayed hard
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Mini Games
Posted by admin under Skylanders Universe | Permalink | | Leave A Comment
Mini-Games can be found all over Skyland and exist out of a whole range of levels which need to be unlocked by completing previous levels or playing together with friends. On your personal Skyland, you will be able to find the three basic mini-games, namely Sky Defence, Ground Defence and Castle Assault. A wide array of other mini-games can be found on the Mainland such as Sheep Shot, SWAT, Runes Run and many more.
- 1. Sky Defence
Sky Defence is a great mini-game which can be found in your Skyland, usually on the right of your Lair. The aim of Sky Defence is to shoot down flying enemy ships and projectiles which will be fired to you.
You can fire by simply clicking your left mouse and can create a shield by holding your mouse still in order to protect you from flying enemy projectiles. If you hold down the mouse you will be able to boost your attack by using boost points gained before you started the game. Dependant on the element of your chosen character will depend on the boost effect created during the game. If you have a wide range of Skylanders figures, you will be able to choose the right character for the chosen game and therefore created an in-game advantage.
Tip: If you aim to the weak spots/targets of your enemy, the enemy will receive more damage which will lead to a quicker and easier defeat of the Skyland invader.
- 2. Ground Defence
The Ground Defence mini-game can be started by clicking what looks like a bursting pot in the floor. The aim of the Ground Defence game is to protect the treasure from invading pirates. If you do not protect the gems accurately, the pirates will steal the gems and run off with them, which will end game as defeat. Simply play the game by moving your character and clicking on the enemy to beat them up. You should make sure to move away when an air attack, also known as Boom Fiends, is about the happen as otherwise you might be stunned which can lead to an advantage for the pirates.
Tip: You can use boost points by clicking the special power button on your boost bar in order to release a powerful attack. Sheep Shot
- 3. Castle assault
Castle Assault is one of our favourite mini-games in which you need to try and destroy the Cyclops and other enemy invaders by aiming your catapult and destroying the structure the aliens are stood on. You simply need to aim your catapult in the right angle and hold your mouse down to create power in order to destroy the structure. You can use your boost button to increase the strength and size of your projectile.
Tip: You will receive bonus points for hitting sheep and treasure chests. You should however try to not hit Mabu, a mole-like friendly creature.
One Response to "Mini Games"
Comment by: Tonio at 4:01 AM, 23 January 2013
The developers of Skylanders said that when they first approached a new Spyro game, they wanted something dark, bloody, and violent. After a while, they realized that's not what gamers wanted from another Spyro game, so they went back to the drawing board and came up with the ingenious idea of interacting with physical toys to power a video game. That idea works brilliantly, but as an adult gamer, I can also see where their original desire to create a game for older players shines through, even if only a little bit. Make no mistake this is a game designed for kids. But any geeky adult, of either the standard hardcore gamer or the action figure-collecting variety, will likely fall in love with the mechanics in play here. Especially if you've got friends (or your kids have friends) that pick this up, too. In a nutshell, the game is powered by your physical action figures, which load up your in-game characters when they're placed on the Portal pad. The figurines have memory chips, and your in-game progress and awards/power-ups are stored on the physical pieces themselves, meaning you can take one of the figures over to a friends house to hop into their game. And here's the kicker it doesn't matter if your friend is playing on Wii, PS3, Xbox, or even 3DS because the figures store their in-game progress, it doesn't matter what console or device you play them on. I plan on picking up the 3DS version as well, so I can play with my characters on the big screen at home, and them bring them with me on the road whenever I can.As far as actual gameplay goes, the first hour is slow, but the platforming and puzzles start to get much more interesting after that. And after you start opening up the world, it really feels like an old-school Spyro game (PS1 era, like the original). This starter pack includes 3 figures: 1 tech, 1 magic, and 1 water. Those are 3 of the EIGHT elements in the game. So make no mistake: if you want to play 100% of the game, you WILL have to purchase at least 1 figure from each of the other elements. They can be easily found for $8 each, or $20 for a 3-pack. There are also Adventure packs that are $20 and come with a character, a level (more like a world), and some extra bonus items. Those adventure packs are the worst deal, in my opinion, but it looks like they'll almost be required purchases if you want to collect all 32 of the Skylanders figures. All things considered, I'm very pleasantly surprised by this game. It's got some depth for the pen-and-paper gamers out there (represent), but will also really light up most kids. Very interactive and original. Can't wait to see how they expand this franchise.


text:
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I think these righties should totally stand by Chick-fil-A and show their support by eating that yummy food. Eat that yummy, fried, fatty food every day to show their support! And while they're eating it, they should continue to fight against buying health insurance, which is an infringement on their constitutional rights. That's right! Eat up that yummy, arterly clogging food, everyday...and don't buy in surance.
I agree! Please encourage people with the same views to eat Chick-fil-A and take a stand. Encourage them to eat it EVERYDAY. EVERYDAY! Eat that yummy, greasy, fat filled, fried food EVERYDAY. And, while eating it...continue to fight the government imposing unfair requirements to buy health insurance. Yes! Yes! Please eat the artery clogging fat filled food every day...and don't buy health insruance!!! :)
Yeah OK....and the Jets will make it to the Superbowl....hahahahahahahahaha!
Yawn. It doesn't really matter what this man thinks. NJ's electoral votes go blue...reliably...so vote for who you want sir...Obama will still carry the state....easily.
Dude I wish! A Nugent VP pick would be AWESOME! Talk about a quick way to end the elction and give Obama the win! Fingers crossed!
Those are some pretty heavy GOP hitters! I wonder what the agenda looks like? I'm thinking there is a field trip to berate the poor at 9, a stop at a children's hospital at 11 to let them know that health care is not a right and that its their fault for getting sick, a lavish lunch with the Koch brothers at 1, a stop at a health clinic at 3 to try and force women to have unwanted babies, and then a follow up visit at 4 to a ghetto to thank those who didn't get abortions but remind them that the government won't be providing funding for the kids they were forced to have, and maybe some good old fashioned puppy kicking in the evening to pass the time away. Sounds like a lot of fun!
Is it that time already? Another pre-season of multiple non-Super Bowl winning Jets stories and one teany tiny mention at the bottom of the page for the multi-ringed Giants. Apparently its another summer of reading about the Jets being the second coming and curing cancer....even though the praise has not been substantiated...REPEATEDLY.
Just about every team that competes in the games is funded through public money. The U.S. team is funded through donations and private sponsorships. Unless you're willing to use some of your tax dollars to fund the U.S. team, you should have no say or complaints regarding where the uniforms are produced. Put your money where your mouth is...or keep it shut.
Technically prostitution is not legal in Las Vegas....it is legal in surrounding counties, but not Clark County, Nevada.
Might as well try and get some money from the state....Romney certainly won't be getting our electoral votes.
How absurd. What a great lawsuit to contribute to the clog up of our court system.
Enjoy filling out that part of job applications that ask if you've ever been convicted of a crime...for the rest of your life :) I take my coffee with sugar and milk...thanks!
Has nothing at all to do with the article...typical conservative....don't like something we read so we put our fingers in our ears and pretend it isn't happening.
No smoking allowed = not worth a lot of gamblers time. The money that goes to AC is from young, 20 and 30 somethings who want to have a cigarette when they are partying at night in an adult atmosphere...not the over 50s sitting at the slot machines, eating the buffet, and going to bed at 10.
If the Ledger is to liberal for you...you're invited to go read the Washington Post. They'll be happy to blow Fox News smoke up your a$$.
Yeah we don't elect Republicans in the 9th district, but thanks for trying.
In NJ it also doesn't really matter who the GOP nominee is for president in November. The state's electoral votes will handily go for the current president, like it or not.
Fire the person who refused to sell it. Be it because it was a man or because of some other "objection" (which I suspect was the case given our social fall back to the 1950s lately), its not acceptable.
I hope all of you obnoxious naysayers have your kids private sexual encounters taped and broadcast....its just a prank after all.
Maybe it was the tatoo....anything above the shoulders = TRASH


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Scooped: Really Dark Chocolate Sorbet
Brits love their multi-layered peanut-caramel-cookie-nougat-and-air-bubble-filled concoctions, but ask for real dark chocolate, and they start muttering about the fall of the British Empire. In an attempt to satisfy my craving for intense, bitter dark chocolate after moving to London, I tried this sorbet recipe: it's a wonderful, incredibly creamy frozen dessert that is so rich and smooth, no one will believe it's a sorbet. More


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- Juan Mari Arzak born (1942)
Why Coffee Smells Better Than It Tastes
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For some, there's nothing like the scent of a fresh cup of coffee brewing. And for some, that wonderful scent is ruined by the bitter taste of the beverage. So why does the smell of coffee seem so much better than the actual taste of the drink?
The Telegraph reports on a new discovery from scientists that proves why scent can be more pleasing than taste. The gist? When you swallow a sip of coffee, the scent travels up the back of your throat and into the nose, where the olfactory receptors signal a reaction to the smell. But the receptors go to a different part of the brain, where taste isn't as well-received. It's what's called the "second sense of smell," or the "retronasal" sense of smell. (The first kind of smell is when you inhale a scent from your environment.)
Seems like kind of a bummer for coffee lovers, huh? At least fans of smelly cheeses have retronasal smell going for them. Said researcher and professor Barry Smith to the British Science Festival, "It smells like the inside of a teenager's training shoe. But once it's in your mouth, and you are experiencing the odour through the nose in the other direction, it is delicious." So enjoy that early-morning scent, but don't hold your breath for a great cup of coffee — it's science, after all.
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