text:
Basket-style conga stand with patented design and stable legs.
The Meinl Woodcraft Series Conga Stand features 90° angled legs for added stability, metal spikes attached to the bottom of every leg to prevent movement, and a U-shaped notch in the ring of the drum stand for quick set up and breakdown. Height adjustability is quick and hassle-free. Includes allen wrench.


text:
Linaria vulgaris Commonly known as yellow toadflax, butter and eggs
Yellow toadflax, also known as butter and eggs, wild snapdragon, Jacob�s ladder, and common toadflax, is a short-lived, creeping perennial herbaceous species found in the Figwort (Scrophulariaceae) family, currently invading New Mexico. It aggressively invades disturbed communities including roadsides, graded areas, abandoned lots, rangelands, and riparian communities, displacing native and desirable species. Although cattle avoid grazing the species, yellow toadflax contains a poisonous glucoside harmful to cattle if consumed in large quantities.
Yellow toadflax seedlings germinate in early May, while resprouts from underground stems appear as early as March. Lateral roots form adventitious buds which sprout and form into new independent plants. Yellow toadflax is a relatively short-lived perennial species with individualssurviving an average of 4 years. Flowers are formed in the axils of upper leaves from May through August and seeds are produced from July through October. Unlike Dalmatian toadflax, yellow toadflax seed viability is quite low, and relies on vegetative reproduction for most of its spread and persistence in the field.
Yellow toadflax is native to southeastern Europe and southwestern Asia. It was first introduced into the United States from Wales during colonial time as an ornamental species and to make yellow dye, and escaped from colonial gardens (Mitich 1993). It is a weed common in the eastern U.S., but found throughout the United States and Canada, with heavy infestations in Idaho, Montana, Oregon, and Washington (Saner et al. 1995). It is listed as a noxious weed in New Mexico, Arizona, Colorado, and Nevada. In New Mexico, it was first documented in 1961 in Sandoval county, and is currently widespread in the northern counties.
Yellow toadflax stems grow 1-3 feet tall, are generally woody at the base and smooth near the tip. Leaves are soft, linear to linear lanceolate, sessile though not clasping, and pale green. They are generally about 1.0-2.5 inches long and 0.1-0.2 inches wide. Yellow flowers form in the axils of the upper leaves are approximately 1 inch long, and resemble those of the snapdragon with an orange bearded throat and a yellow spur. Flowering occurs from May through August with the youngest flowers forming at the tip of stems. As plants mature, fruit form that are brown,globed-shaped, two-celled, capsules. Seeds are long, flattened, dark brown to black in color, and winged.
Table 1: Differences in growth and reproduction in Dalmatian and yellow toadflax
|Dalmatian toadflax
|yellow toadflax
|Shoot emergence
|May onwards
|Waxy blue green color, ovate to heart shaped; clasping upper portion of stem. 0.5-2.3 inches long
|Pale green, linear to linear lanceolate; sessile but not clasping. 1-2.5 inches long, 0.1-0.2 inches wide.
|Average 3 feet tall
|1-3 feet tall
|Irregularly shaped two-celled capsules
|Globe shaped two celled capsules
|Black, sharply angled and slightly winged
|Dark brown to black long, flattened, winged
|Seed production
|500,000 seeds/plant
|30,000 seeds/plant
|Seed viability
|High viability with germination rates as high as 75%
|Low viability with 10% germination rates under field conditions
|Vegetative reproduction
|Root buds and lateral growth begins 9 weeks after germination
|Root bud and lateral root growth begins 2-3 weeks after seed germination
Reproduction and Spread
Yellow toadflax reproduces by both seed and vegetative growth from underground roots. Mature plants can produce up to 30,000 seeds annually (McClay 1992), although generally only about 40-50% of the seeds are viable and 10% germinate under field conditions (Clements and Cavers 1990, Saner et al. 1995). Seedlings can begin producing vegetative shoots from root buds as early as 2-3 weeks after germination, and lateral roots can spread several yards away from the initial plant. Yellow toadflax seed dispersal begins in August, and continues through the winter. Although wind was initially thought to be an important dispersal mechanism, studies have shown that 80-90% of the seeds fall within 18 inches of the parent plant (Nadeau and King 1991). Wind dispersal is only important when entire floral stalks break from the plant and roll across the landscape (Lajeunesse 1999). Seeds appear to be more important in the establishment of new infestations, although in arable lands, root fragments that cling to farming equipment can also begin new infestations. Lateral roots and root fragments play the dominant role in establishment and expansion of infestations of yellow toadflax, as seed viability and germination are low for this species.
Preventing the establishment of populations of yellow toadflax is the most effective way of controlling this species. Farm, rangeland, and outdoor recreation equipment can transport seeds, and should be cleaned thoroughly before moving from infested areas to un-infested areas. Livestock can also transport seeds. Seedlings are poor competitors and highly susceptible to dehydration, therefore are the easiest stage to control. Once the root system is established, these species are extremely competitive for water and resources, and are difficult to control/eradicate. Management should primarily focus on controlling vegetative spread for yellow toadflax, and secondarily focus on preventing seed formation.
Hand-pulling small infestation of yellow toadflax can be an effective way of controlling the species, especially if established in a sandy or moist soil. Pulling must continue for 5-6 yearsto remove all root fragments including lateral roots. Physical removal of root fragments is quite effective at deterring spread, but the site must be revisited for 10-15 years to assure the removal of seedlings produced from dormant seeds (Lajeunesse 1999). Mowing and burning are ineffective at controlling either toadflax species as they do not affect the root stocks or buried seeds. Cultivation can be used to control toadflax species where feasible although it must be done repeatedly as plants can re-sprout from root fragments as small as 0.5 inches. Parker andPeabody (1983) found that cultivation repeated every 7-10 days with sweep-type cultivators, repeated for 2 years can effectively eradicate these species. Well adapted rangeland species can be highly competitive with toadflax seedlings. A combination of toadflax control with seeding of a variety of species with different phenologies and rooting systems (shallow, intermediate, and deep rooted species) should effectively outcompete yellow toadflax. In croplands, barley has been shown to inhibit vegetative reproduction of yellow toadflax as well (Nadeau and King 1991). Overgrazing of fields by cattle can increase the spread of toadflax infestations as the toadflax species are generally not grazed. If animals are used to manage yellow toadflax they should be held in corrals for 11 days before moving from an infested area to an un-infested area so that viable seeds can pass through their systems (Lajeunesse 1999).
Biological control
Eight insects have been introduced and approved by the USDA-APHIS-PPQ for release as biocontrol agents for both Dalmatian and yellow toadflax in the United States with varying success. Brachypterolus pulicarius, a shoot and flower feeding beetle can reduce seed set on attacked plants by 74% (McClay 1992). Gymnaetron antirrhini, and Gymnaetron netum, bothseed-capsule feeding weevils, have been shown to impact seed production in these species and reduce seed production in yellow toadflax by 85-90% (Rees et al. 1996). Calophasia lunula, a moth introduced from Eurasia, has been shown to defoliate up to 20% of a plant (Montana State University 2000). Currently none of these agents have been released in New Mexico.
Herbicides alone and in combination with seeding of competitive species can control yellow toadflax. Most herbicide treatments are recommended at the flowering stage, with seeding of desirable competitive species the following spring. Herbicide control of yellow toadflax can vary dramatically because of the large genetic variation within the species. Even when herbicide treatments appear successful, follow-up may be necessary every 3-4 years for as long as 12 years to eradicate the species. See table for a list of herbicides available. Use lowerrate when plants are growing in sandy soils. It is important to read the herbicide label BEFORE making any application, as different herbicides will have different requirements and restrictions.
Distribution Map
Weed Classification
|Noxious Weed Class
|Not designated a New Mexico noxious weed
|Weed Type
|Found in
|not milky
|Growth Habit at Maturity
|Leaf Arrangement
|Leaf Type
|not lobed
|Presence of Leaf Tendils
|Leaf Succulence
|not succulent
|Stem Shape
|Flower Color
|Flower Symmetry
There is also a printable factsheet for this weed available.
Image Gallery
Herbicide Table
|App Rate
* Many types of this herbicide are available for use.
† Indicates product is a restricted use pesticide in New Mexico
‡ Use of a nonionic surfactant at 0.5 - 1.0 % is recommended.
|1-2 qt/A
|Flowering to fall. Especially effective after first hard frost.
|Residual herbicide. Selective. Retreatment for several years may be required.
|2-3 oz/A + 0.25% v/v non-ionic surfactant
|Flowering or in the fall.
|Residual herbicide. Selective. Persistant in high pH soils. Retreatment for several years may be required.
|Banvel, Clarity, Vanquish
|2-4 qt/A
|Flowering or in the fall.
|Residual herbicide. Selective. Retreatment for several years may be required.
|Many compounds*
|3-4 lbs ai/A
|Early bloom
|Nonselective. Will suppress in current year, but abundant regrowth will occur the following year.
|Plateau + MSO
|Imazapic + methlylated seed oil
|8-12 fl oz/A + 1 qt methlyated seed oil
|Fall, after hard frost
|Residual herbicide. Selective. Use lower rate when cool season grasses are present.
Biology and Management of the Toadflaxes
A Colorado State University Cooperative Extension publication.
Element Stewardship Abstract
Element Stewardship Abstracts (ESAs) are prepared to provide The Nature Conservancy's Stewardship staff and other land managers with current management-related information on those species and communities that are most important to protect, or most important to control. The abstracts organize and summarize data from numerous sources including literature and researchers and managers actively working with the species or community.
Fact sheet for Dalmatian toadflax and Yellow toadflax
This is the fact sheet from the California Department of Food and Agriculture.
Managing Yellow and Dalmatian Toadflax
This is a University of Nevada Cooperative Extension fact sheet.
- Clements, D. R., and P. B. Cavers. 1990. easonal seed viability patterns and the role of incomplete seed development in the life history strategy of Linaria vulgaris. Le Naturaliste Canadien. 117: 189-198.
- Lejeunesse, S. 1999. Dalmatian and yellow toadflax. In: R. L. Sheley, and J. K. Petroff (eds). Biology and Management of Noxious Rangeland Weeds, Oregon State University Press, Corvallis, OR.
- McClay, A. S. 1992. Effects of Brachypterolus pulicarius (L.) (Coleoptera: Nitidulidae) on flowering and seed production of common toadflax. The Canadian Entomologist 124: 631-636.
- Mitich, L. W. 1993. Yellow toadflax. Weed Tech. 7: 791-793.
- Montana State University. 2000. Dalmatian and Yellow Toadflax; Weeds of Pasture and Rangeland. MSU Extension Services, Bozeman, MT.
- Morishita, D. W. 1991. Dalmatian toadflax, yellow toadflax, black henbane, and tansymustard: importance, distribution, and control. ages 399-408 In L. F. James, L. O. Evans, M. H. Ralphs, and R. D. Child (Eds) Noxious Range Weeds. Westview Press, Boulder, CO.
- Nadeau, L. B. and J. R. King. 1991. Seed dispersal and seedling establishment of Linaria vulgaris Mill. Can. J. Plant Sci. 71: 771-782.
- Parker, R., and D. Peabody. 1983. Yellow toadflax and Dalmatian toadflax. Pacific Northwest Coop. Ext. Bull. 135. Wash. State Univ., Pullman, WA.
- Rees, N. E., P. C. Quimby Jr., G. L. Piper, E. M. Coombs, C. E. Turner, N. R. Spencer, and L. V. Knutson (Eds). 1996. The biological control of weeds in the West. Western Society of Weed Science in Cooperation with the USDA Agricultural Research Service, Montana Department of Agriculture, and Montana State University. Bozeman, MT.
- Saner, M. A., D. R. Clements, M. R. Hall, D. J. Doohan, and C. W. Crompton. 1995. The biology of Canadian weeds. 105. Linaria vulgaris Mill. Can. J. Plant Sci. 75: 525-537.

subset: commoncrawl


text:
Allan L. Beck, PGA
Main Address:
Golf Pro to Go
Apt B
St Petersburg, FL 33713-5023
(727) 218-6604
Apt B
St Petersburg, FL 33713-5023
(727) 218-6604
Allan went to school in San Bernardino, CA and graduated in 1973. He entered the USAF in 1976 and has 34+ years of continuous service working for the USAF (18 years as active duty, MSgt highest rank achieved; 16+ years as a Golf Course Manager). He has managed six different golf courses around the world. Arnold AFS, TN 1994-1997; Brooks AFB, TX 1997-1999; Aviano AB, Italy 1999-2003; Andersen AFB, Guam 2003-2006; Ramstein AFB, Germany, 2006-2007; Aviano AB, Italy 2007-present. He attained his PGA Class A card in August 2002; and has four certiifcations by the PGA in: General Management, Golf Operations, Instruction, and Retail. He has an Associate's Degree in Recreation Management. Has experience in managing the following activities: golf courses, restaurants, military dining facilities, Youth Centers, Arts & Crafts Centers, Outdoor Recreation, Community Center, Bowling Centers & Fitness Centers.
Services Offered:
- Instruction
National Awards
- 2009 PGA President's Council on Growing the Game
- 2006 PGA President's Council on Growing the Game
- 2005 PGA President's Council on Growing the Game
Home » Golf Courses » Florida » Belleair » Allan L. Beck, PGA
PGA of America Championships
Philadelphia Cricket Club
Philadelphia, Pa.
Whistling Straits
Kohler, Wis.
Hazeltine National Golf Club
Chaska, Minn.


text:
Ky. man faces multiple charges
LOUISA, Ky. — Police say a man trying to elude a state trooper caused a fatal crash in eastern Kentucky and is now facing charges including murder.
A statement from Kentucky State Police says 34-year-old Joshua A. Fitzpatrick of Paintsville was charged Friday after the vehicle he was driving crashed into a motorcycle being operated by 40-year-old Johnny K. Maynard Jr. of Catlettsburg. Maynard was taken to a hospital, where he was pronounced dead.
Police say Trooper Devan Cleaver began chasing Fitzpatrick's vehicle in Louisa after taking a report of a car driving recklessly. The driver fled before losing control and crashing. Fitzpatrick is also charged with fleeing and evading police, operating a vehicle under the influence of alcohol or drugs and driving on a suspended license.
It was unclear whether Fitzpatrick has an attorney.
The Herald-Dispatch welcomes your comments on this article, but please be civil. Avoid profanity, obscenity, personal attacks, accusations of criminal activity, name-calling or insults to the other posters. Herald-dispatch.com does not control or monitor comments as they are posted, but if you find a comment offensive or uncivil, hover your mouse over the comment and click the X that appears in the upper right of the comment. If you do not want your comment to post to your personal Facebook page, uncheck the box below the comment.


text:
Hold down Control (PC) or Command (Mac) key + mouseclick to select more than one option
|Avg. Dinner Entrée
|Greater than $25
|$18.01 - $25
|$12.01 - $18
|$7.01 - $12
|Less than $7
Posted by Kay on 03/24/2014
Food is excellent. Service is not. Wait staff is very rude. This is with the exception of one excellent bartender. Besides working on the staff's attitudes, the food and atmosphere is great. Will definitely come back.
Posted by Geraldine Myers on 06/03/2011
Excellent lamb - tender and flavorful. And lots of it. Veggies were tasty also. Gyro meat not the usual fare - far more meaty and tasty. Good service - nice waitstaff and concerned manager. Highly recommend this place.
Posted by Patrice on 04/09/2009
On a recent Saturday, the music was a bit loud, but who cares when you're watching pretty belly dancers and fun-loving patrons dance on the tables as napkins flutter around their heads! A decent, not expensive wine list. world-class Greek salad and fresh Mediteranian speciallties are not to be missed! Most fun with a large party.
Posted by Anonymous on 10/21/2008
Great place to hang out, lots of parking spaces. The food's good, service's nice, but it's a little pricy for a casual hang out.
Posted by Alexandra on 02/02/2008
Excellent service, clean and fun atmosphere. Great place to take a date. I highly recommend this spot for a fun night out.


text:
Monday, 25 Aug 2008 09:57 AM
U.S. voters have serious misgivings about both US presidential candidates — Democrat Barack Obama and Republican John McCain — faulting the former for lack of experience and the latter for close ties with President George W. Bush, according to a new opinion poll.
The survey by USA Today/Gallup showed that Obama was still leading McCain 47 percent to 43 percent among registered voters and 48 percent to 45 percent among likely voters.
Both leads were within the margins of error of plus or minus four percentage points.
The survey came as Democrats prepared to launch their national convention in Denver, Colorado, on Monday.
Half of those surveyed worry Obama "may be too closely aligned with people who hold radical political views," and 57 percent said they were concerned he lacked the experience to be an effective president, USA Today said.
Moreover, 53 percent of the respondents said Obama can handle the responsibilities of commander-in-chief and 44 percent said he cannot.
On the other hand, four in 10 said they are worried McCain, who turns 72 next Friday, is too old for the presidency, and 67 percent said they're concerned he'll pursue policies too similar to Bush's.
According to the poll, the electorate remain fairly fluid. Three out of 10 of those polled said they might change their minds between about voting for either of the candidates between now and November 4.
Meanwhile, a separate survey, conducted by CNN/Opinion Research Corporation found that 47 percent of those questioned were backing Obama with an equal number supporting McCain.
Those poll numbers also showed 27 percent of Hillary Clinton supporters had now switched for McCain.
Copyright 2008 AFP
Friday, 04 Jan 2013 13:06 PM
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. . .
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If the Dems continue to support PP then I can no longer support them. This...
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Well, so much for The Donald's campaign being over due to the negative comments...
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text:
A stacked multichip assemblage including a plurality of integrated circuit die directly attached to a substrate having pads corresponding to terminals on the die, and interconnections between the die, and also to external contacts. The stacked integrated circuit arrangement includes a first chip(s) having an array of bumped terminals positioned on the corresponding pads of the substrate, a larger integrated circuit chip having perimeter bump terminals located over the first chip, and the terminals directly bonded to corresponding pads on the substrate.
1. A stacked multichip device comprising a larger circuit die having solder bumped terminals near the die perimeter, one or more smaller solder bumped integrated circuit dice, and a substrate having printed wiring conductors for interconnection between said dice and external contacts; wherein
a) said substrate includes a surface having a plurality of outer contact pads aligned with the input/output pads of said larger die, and a plurality of inner contact pads aligned with the input/output pads of said smaller die or dice,
b) one or more of said smaller integrated circuit dice contacting the pads on said substrate inside said perimeter defined by the bumped terminal connectors of the larger die, and
c)said larger circuit die is located over the smaller die and is connected to said outer substrate pads.
2. A device as in
3. A device as in
4. A device as in
5. A device as in
6. A device as in
7. A device as in
8. A device as in
9. A stacked multichip device comprising a larger circuit die having bumped terminals near the die perimeter, one more smaller bumped integrated circuit dice, and a substrate having printed wiring conductors for interconnection between said dice and external contacts; wherein
a) said substrate having a surface with a plurality of outer contact pads corresponding to the input/output pads of said larger die, and a plurality of inner contact pads corresponding to the input/output pads of said smaller die or dice,
b) one or more of said smaller integrated circuit die contacting the pads on said substrate inside said perimeter defined by the bumped terminal connectors of the larger die, and
c) said larger circuit die is located over the smaller die and is connected to said outer substrate pad; and
d) said bumped terminals of each integrated circuit dice comprise the same material, thereby having the same thermal properties so that all electrical contacts may be
This application is related to co-assigned Application Ser. No. 60/078056, Mar. 16, 1998.
This invention relates generally to the field of integrated circuit devices, and in particular to an arrangement for integrated circuit assembly.
Maximizing performance, lowering cost and increasing the density of integrated circuits are ongoing goals of the electronics industry. In particular, portable systems, such as computers and telecommunications have spurred the efforts to define reliable technology for supplying circuits in the smallest possible area, and for many applications with increased operating speed.
Advances in interconnect technology have provided the key enablers toward these ends. Direct connection of the active surface of a semiconductor die to a substrate or package, using solder balls for flip-chip attachment, furnished the basic technology for low inductance, area array assembly of integrated circuits. This technology developed years ago has surged recently as more practical means of forming and attaching bump terminals has evolved. New methods including plating solders, or using solder or conductive polymers to adhere conductive spheres or columns to pads on the device have begun to replace the original process of evaporating and patterning solders.
Not only are chips attached to substrates by flip-chip connections replacing wire bonding, but ball grid array (BGA) and chip scale packages (CSP) are attached to boards or other next level interconnection by means of balls or bumps, rather than by leads. Ball sizes vary from those in the range of 75 microns used for flip-chip attachment to those greater than a millimeter in diameter for CSP and BGA attachment. FIG. 1 provides a cross sectional view of a prior flip-chip 105 assembly in a BGA package 106, and demonstrates the use of different ball sizes, i.e. solder balls 115 on the flip-chip assembly typically yield a stand off height of about 65 microns, whereas balls 116 on the BGA package have about 0.9 mm stand off. Not only is performance enhanced by lower inductance of short, wide ball connections, versus long, thin wire bond or lead conductors, but arraying the terminals in the area under the device, rather than at the perimeter minimizes space, and thereby supports increased packing density.
While bump or ball interconnect technology allows a mechanism for low inductance assembly of semiconductor devices, multichip modules provide a means for fabricating subsystems by interconnecting chips on a common substrate or package. FIG. 2 demonstrates an example of such an assemblage wherein a die 201 may be connected by flip-chip terminals 202 or by wire bonds 203 to the substrate. The substrate 211 provides the wiring connection both between the chips within the assembly, and to external contacts 230 which in turn contact the next level of interconnection, such as a printed wiring board 220. In multichip assemblies interconnections between chips often provides a means for decreasing the total number of output pins on the module, as compared to the number required for individual components, and thereby decreases the printed circuit board space required. Performance is enhanced as a result of shorter interconnections with lower inductance. In addition, common power and ground lines further decrease the input/outputs requirements and provide enhanced performance; multichip modules having multilevel substrates frequently include such designs.
Another technique for increasing density of integrated circuit devices has been stacked packages and/or stacked chips. Double-sided printed wiring boards with surface mount packages on each side was a forerunner of stacking packages face-to-face. There have been many iterations of stacked assemblies, including memory modules either as chips or packaged devices wherein the devices of similar device size and type are stacked back-to-front with vertical electrical interconnections on the perimeter.
Alternately, chips have been stacked face-to-face on a common wiring board. One such assembly, shown in FIG. 3 provides a first flip-chip 301 positioned face-to-face with a second flip-chip 302 on a substrate 303 interposed between the chips to provide electrical connection 313 among the flip-chip terminals 311, and to external circuitry 315. However, this assembly uses a flex circuit as the interposer 303 between the facing flip-chips and requires a separate mechanical support 320, which in turn has contact connections to the next level of interconnection. This results in a complex assembly.
It would be advantageous to develop a technique for increasing the packing density of integrated circuits which takes advantage of the low inductance of ball connections, the decreased number of input/output contacts as found with multichip or stacked assembly, good thermal dissipation, and the low cost of standardized packaging technology.
It is the primary object of the present invention to provide a novel packaging structure for improvement of packing density and performance of integrated circuits. The above and other objects, features and advantages of the present invention will be apparent from the following descriptions.
It is an object of this invention to provide a high density multichip assemblage wherein the active circuits are within the area of the largest single integrated circuit device in said assemblage.
The device of this invention includes two or more integrated circuit dice having flip-chip terminals, and a rigid substrate having a surface with printed wiring interconnections and a plurality of flip-chip pads. The device provides that a die having perimeter bump terminals is located on top of a smaller die or dice having bump terminals, bumps from all dice are aligned to pads on the substrate, and are electrically connected.
It is further an object of this invention to provide a stacked multichip assemblage having multiple packaging options, including BGA, CSP, cavity down BGA, cavity down CSP, Board-on-Chip(BOC), or chips directly attached to a printed wiring board. The assemblages may be encapsulated by a protective material such as an epoxy or ceramic layer, which in turn may have heat spreaders attached for improved thermal performance, but it should be noted that the encapsulation layer is not required to effectuate the purpose of the present invention.
It is also an object of this invention to provide a stacked flip-chip device wherein the effects of thermally induced mechanical stress on the bump terminals is minimized by having larger bumps on those die with maximum thermal mismatch to the substrate, and further reducing the effects of stress by encasing the bump connections of all die with an underfill material.
Another object of the invention is to provide a stacked multichip assemblage having good thermal dissipation as a result of multiple thermal conduction paths.
It is an object of this invention to provide a stacked chip assembly having low inductance advantages realized from bump connections, and from short interconnections between chips.
It is still further an object of this invention to provide a stacked flip-chip assembly which is capable of having fewer external input/output connections than would be required for each of the individual chips.
It is yet another objective of this invention that the bump terminals comprise electrically and thermally conductive materials, wherein provisions can be made for an assembly thermal hierarchy.
It is still further an objective of this invention to provide a stacked flip-chip assembly wherein the largest chip has perimeter contacts, and the smaller chips have latitude for perimeter, center or area arrayed terminals.
In accordance with the present invention, there is provided a method for forming the mechanical and electrical connection of the multiple chips of the stacked flip-chip assembly to the substrate in a single reflow process. The technique is applicable to packaging options such as BGA, CSP and/or directly attached to a printed circuit board.
The drawings constitute a part of this specification and include exemplary embodiments to the invention which may be embodied in various forms. It is to be understood that in some instances aspects of the invention may be shown exaggerated or enlarged to facilitate and understanding of the invention.
FIG. 1 demonstrates a flip-chip device in a BGA package (Prior art)
FIG. 2 shows a cross section of a multichip module. (Prior art)
FIG. 3 demonstrates a stacked chip on flex interposer package. (Prior art)
FIG. 4 is a cross sectional view of the present invention.
FIG. 5 shows a substrate contact pattern for a stacked chip assembly of the present invention.
FIG. 6A demonstrates a cross sectional view of a BGA/CSP package with stacked flip-chips.
FIG. 6B demonstrates a cross sectional view of an encapsulated BGA/CSP package with an attached heat spreader.
FIG. 6C demonstrates a cross sectional view of a Cavity down BGA/CSP with stacked flip-chips.
FIG. 7 demonstrates a stacked flip-chip assembly with greater than two chips.
Turning now to the drawings which describe the current invention. FIG. 4 shows a cross section of a stacked flip-chip device assembled on a substrate 400. The device comprises integrated circuit dice 401 and 402, wherein each die having bump terminals for direct flip-chip interconnection on the active surface and the active circuits are contained within the area of the largest die in the assemblage. Die 401 is located over die 402 and both dice are electrically connected to pads on one surface of a substrate; said pads correspond to bump terminal locations on the dice. Metal traces connect the substrate pads to a plurality of external contacts (not shown). A major advantages of providing such an arrangement of stacked multichips wherein one die is located over top of the second die and both die are directly attached to a single surface of the substrate is realized in that only one substrate interconnection surface is required.
The bump terminals 411 of integrated circuit die 401 are located around the perimeter of the die, and the area inside the bump terminals is greater than the total surface area of semiconductor die 402. Bump terminals on die 401 provides stand-off clearance between the active surface of die 401 and the backside of die 402 after all terminals have been connected to the substrate.
In practice, the diameter of flip-chip bumps is limited by the density of chip pads and the chip size. In the preferred embodiment, bumps on die 401 are larger than those on die 402. The bump terminals of die 402 are consistent with the size of those on existing flip-chip die, typically 0.05 to 0.25 mm in diameter. Die 401 spans a greater distance than die 402; its terminal connections are subjected to larger thermally induced stresses arising from expansion mismatches between chip and the substrate and therefore, the bump contact dimensions are increased in order to minimize the effect of said stresses. The bump terminals of die 401 in the preferred embodiment are in the range of 0.25 to 0.6 mm.
In the preferred embodiment of this invention, not only is the bump contact area made as large as possible on the larger die 401 in order to enhance reliability of the solder joints, but stress reduction is further assured by the presence of a filled thermosetting plastic compound generically referred to as "underfill" 410 which surrounds the bumps and absorbs some stresses arising from thermal mismatch. Solder fatigue which can result from mismatch in expansion coefficient and Young's modulus between the substrate and the silicon die is greatest at the furthermost point from the center of the assembly, but a relatively low expansion underfill polymer has been shown to mitigate such thermally induced stress. Therefore, the preferred embodiment includes a polymer compounded with a low expansion filler completely surrounding all bumps in the assemblage.
In densely packed multichip modules, heat from active circuits can be a serious reliability issue. In order to effectively resolve the problem, multiple thermal conduction paths from each die are needed. The underfill material 410 comprises a thermosetting polymer compounded with thermally conductive, electrically insulating particles which serve not only to lower expansion, but also to dissipate heat from the surfaces of the dice. Thermally conductive underfill allows localized heat from the active circuits to be spread and conducted away from the source. In the preferred embodiment, the underfill surrounds the smaller dice, contacts the active surface of the larger die, and thereby provides a thermal path to the outside of the package for each integrated circuit. Heat from both the active surface of die 402, as well as the backside is dissipated into the underfill. In addition, high thermal conductivity paths are provided from each die to the substrate by way of bumps which are not only electrically conductive, but are also highly thermally conductive, such as lead/tin solders. Further, thermal conduction paths may also be provided by high thermal dissipation packaging options.
In practice, tolerances of the printing wiring technology used for the substrate coupled with the pad pitch on die 401 dictate allowable bump diameter for die 401. Bumps of the larger die 401 create a stand-off space between the active surface of said die and the backside of die 402, as well as the space for underfill material 410. For those devices allowing a maximum of 0.35 mm diameter bumps, it is necessary to control the thickness of die 402 to 0.2 mm or less.
Integrated circuit die are typically 0.25 to 0.5 mm in thickness, but for thin packages, it is not unusual for integrated circuit wafers to be thinned to 0.15 mm. In the embodiment shown in FIG. 4, the surface of the substrate 400 having a plurality of pads which correspond to the flip-chip terminals is at single height, thereby requiring die 402 to be thinned sufficiently to assure clearance between the backside of die 402 and the active surface of die 401.
To further explain the device of the current invention, FIG. 5 depicts on side "A" an example of the substrate 400 including a simple conductor pattern and contact pads, and the stacked flip-chips of this invention. For reference, side "B" of FIG. 5 shows only the bump terminals 411 and 412 of dice 401 and 402 respectively. The bump terminals 412 of die 402 are aligned to pads 502 on the substrate, and the terminals 411 of die 401 are aligned to substrate pads 501. Bump terminals of die 402 may be located on the perimeter, area arrayed, or may have center bond pads as are typical of DRAM devices. For the large die 401 bump terminals 411 are located at or near the perimeter of die 401 to allow clearance for die 402.
Substrate conductors are metallic traces 520 typically comprised of copper which interconnect circuits within the flip-chip assemblage, and between each of the integrated circuits and an external contact point. In the example depicted in FIG. 5 the traces are configured to be contacted at the device edge, with some lines 521 to provide connection between die 401 and die 402. Interconnections between chips serve both to decrease the total number of external contacts required for the system, and to provide very short conductor lengths between chips. The potential for high speed performance of the device of this invention is supported by short interconnections and by low inductance bump contacts.
Multilayer substrates (not shown) are a means to further reduce the number of input/output connections by including common ground and/or power planes. Some packaging options which are applicable to this invention are commercially available which multilevel substrates. Performance, reduced area and thermal dissipation are improved by such metal rich planes.
FIG. 6A depicts the preferred embodiment of this invention. It comprises a BGA (Ball Grid Array) or CSP (Chip Scale Package) substrate 610 and a flip-chip assemblage having a larger die 401 with perimeter bumps located on top of a smaller flipchip die 402. While there are many different types of Chip Scale Packages, for purposes of this specification, package size and interconnection dimensions are inferred as the difference between BGA and CSP package types, and they will be presented as either BGA or CSP. The required feature of either package is that the substrate 610 provides a printed wiring surface having contact pads for the flip-chip bump terminals, interconnections between the chips, and interconnections to the external circuitry. Vias (not shown) to solder bumps 611 on the opposite surface of said substrate contact the next level of interconnection, such as a printed wiring board. Variations of BGA/CSP devices may have single or multilevel substrates, either of which is amenable to this assemblage.
Mechanical and environmental protection of the stacked multichip device in a BGA /CSP packages may be offered by encapsulation in a plastic molding compound by transfer or vacuum molding, a ceramic shell or premolded plastic shell filled with a potting polymer. FIG. 6B shows an example of a molded plastic BGA 640 with a heat spreader 641 attached by a thermally conductive adhesive 642 to the backside of die 401 to further dissipate heat away from the active devices. It should be noted that the encapsulation is not required to effectuate the purpose of the present invention.
FIG. 6C demonstrates an alternate packaging option wherein the substrate 620 comprises the first level of interconnection of a cavity down BGA/CSP package. Cavity down BGA packages are characterized by having die attached to a substrate, conductors are routed to the perimeter where vias 621 contact a second 631, third 632, or more (not shown) interconnect levels, which in turn are routed to BGA bump terminals 611. The cavity formed by multiple interconnection levels on the package perimeter is typically filled with a filled epoxy 622, and a heat spreader (not shown) may be attached to the substrate surface opposite the flip-chip assemblage. The assembled package is attached to the next level of interconnection, such as printed wiring board, with the cavity facing the board. A cavity down BGA/CSP package may be very well suited for this stacked flipchip assemblage in the case where chip 401 is correctly sized to be attached to the second 631 interconnect level, and the smaller chip 402 or chips are positioned on the first level of the substrate 620. In the example depicted in FIG. 6C wherein die 401 is attached to the second level of interconnection, the multilevel structure allows additional degrees of latitude in the dimensional requirements of components of his multichip device, such as thickness of die 402 may be increased, bump diameter of said die 402 may be maximized, and more space is allowed for underfill compound 410 as a result of the additional standoff height created by the second interconnect level.
The bump terminals of dice 401 and 402 comprise a highly electrically conductive material. In the preferred embodiment said bumps comprise solder having a liquidus temperature greater than the reflow temperature of eutectic solder, about 183 degC. Higher reflow temperature of the flip-chip devices insures that the die do not move significantly during assembly of the BGA package to the printed wiring board. Solder balls 611 on the opposite surface of the BGA/CSP substrate from the flip-chip assembly are typically eutectic solder, and the infrastructure for assembly of such packages to the next level of interconnection is well established.
Further, in the preferred embodiment, flip-chip bumps of die 401 and of die 402 comprise the same material so that all dice of the multichip assemblage are electrically and mechanically connected to the substrate in the one thermal attachment process.
Alternate materials for bump terminals of die 401 and 402 are conductive polymers, lead free solders, composite balls attached by means of either solder or conductive polymers. A number of composite bumps have been disclosed previously in a related disclosure from Texas instruments, Inc. in U.S. Ser. No. 60/078056, filed Mar. 16, 1998 which is included herein by reference.
A further embodiment of the present invention is demonstrated in FIG. 7 wherein multiple dice 703 and 704 are placed on the substrate 700 and die 701 is located over top of both smaller dice. Said assemblage having more than two active integrated circuits comprises bumped die and a substrate having the same materials and limitations as the assemblages shown in FIGS. 4, 5, and 6A 6B and 6C.
Turning now to a method for fabricating a stacked multichip assemblage of the preferred embodiment of this invention, a BGA substrate 610 having a plurality of pads which correspond to the bump input/output terminals of die 401 and die 402 is treated with solder flux to coat each pad. The bump terminals of die 402 are aligned to and brought into contact with their respective pads on said substrate using flip-chip alignment equipment known in the industry, and the die is temporarily held in its correct position by the flux. In a similar manner, the bump terminals of die 401 are aligned to and brought into contact their respective pads, and the thixotropic nature of the flux holds the die in place. The assemblage is passed through a heating apparatus suitable for flip-chip processing which has been programmed with a thermal cycle specified for reflowing the solder bumps and for cooling the assemblage. An underfill material 410 is applied, allowed to flow under chip 401 and 402 before heating to set the compound. The BGA package assembly is completed using materials and processes typical in the industry and as specified by the manufacturer.
In summary, the present invention provides a novel integrated circuit assemblage which supports very high density and high performance needs in a stacked multichip package. The device of this invention places the smaller chip(s) of the system face down on a printed wiring substrate, and a larger die is located face down over top of the first. Simultaneous reflow of all chips supports low cost assembly needs.
While the invention has been described in connection with preferred embodiments, it is not intended to limit the scope of the invention to a particular form set forth, but on the contrary, it is intended to cover alternatives, modifications, and equivalents as may be included within the spirit of the invention within the spirit and scope of the invention as defined by the appended claims.
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Health Services
Health services is one of Massachusetts' fastest-growing - and most demanding - industries. Hospitals, physician practice groups, community health centers, and clinics continue to grow, affiliate and merge in unprecedented numbers. Complex regulatory and administrative pressures mount. While some costs have leveled, others have risen sharply.
At Sherin and Lodgen, we appreciate that health service companies need practical, forward-looking advice. Our lawyers represent a wide variety of health care providers, including:
- Community health centers
- Community hospitals
- Non-acute health care facilities
- Multi- and single-specialty physician practices, both small- and medium-sized
- Clinics
- Long-term care and assisted-living companies
Some of the services we provide are:
- Comprehensive general corporate services, including organization and formation
- Obtaining and preserving recognition as tax exempt organizations
- Mergers and acquisitions
- Operation and governance
- Managed care and risk contracting
- Real estate
- Financing and leasing
- Employment
- Litigation
- Partnership structures
- Regulatory requirements, and
- Dissolutions or purchases of practices
We also counsel financially troubled health care entities and have successfully brought health care providers through Chapter 11 Bankruptcy Reorganization proceedings.
Representative Experience
- Advising a 25-member South Shore physician practice group on issues ranging from retention of medical records, compliance with Stark, dissolution of limited liability companies, leasing of office space, employment agreements, and corporate structuring
- Representing a physician in the purchase of an ophthalmology practice
- Representing a physicians' organization affiliated with a Massachusetts hospital in real estate and partnership issues
- Representing a community health center in negotiation of a joint venture agreement with a major Boston area teaching hospital system enabling the health center to expand the programs and services available to its patients (the first joint venture of its kind to be negotiated with a health center in the Boston area, it was used as a model for several other subsequent joint ventures between the teaching hospital and other health centers)


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August 3, 2015
WASHINGTON (AP) - Kenya's foreign minister says "two or three Americans" and "one Brit" were among those who attacked a Nairobi shopping mall. More than 60 people have been killed in the assault on the upscale mall, which has lasted for three days. The foreign minister, Amina Mohamed, said in an interview with PBS' "NewsHour" program that the Americans were 18 to 19 years old, of Somali or Arab origin and lived "in Minnesota and one other place" in the US.
U.S. officials said they were looking into whether any Americans were involved. State Department spokeswoman Jen Psaki (SAH-kee) said Monday the department had "no definitive evidence of the nationalities or the identities" of the attackers.
Authorities in Kenya are trying to wrap up their standoff with al-Shabab, a group allied with al-Qaida.
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Red Ken Livingstone, the Mayor of London seriously risks not being reelected if he continues with his 20mph (32kph) speed limit proposal for London and the tripling in congestion charge. In fact, New York's lawmakers have simply ignored Mayor Bloomberg's proposal and let the bill lapse. Unlike London, though, Manhattan's apathy means it misses out on US$350m of Federal money earmarked for mass transit initiatives.
Red Ken thinks he's doing a favour for the environment by reducing the speed to 20mph but he's not because cars are less efficient at low speed. The Germans, however, are doing the environment a favour. Reports are surfacing that the autobahns will get a speed limit of 120kph where no speed limit exists at the moment. Not that it'll make a major difference – we don't imagine a huge proportion of people travel at speeds vastly exceeding 120kph. Therefore to me it seems there could be revenue generating aspect as well. But then I'm quick to jump to cynical conclusions.


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Narrow your search
It's not the most elegant mouse, nor does it feel worth the $130 price, but Razer's Naga Epic and its built-in, 12-button keypad could help gamers and others gain mastery over MMOs and other applications with complicated control schemes.
The term "peripherals" is wide-reaching on purpose to include all the accessories that will surely complete any home office or entertainment set up. Our CNET Editors have tallied the scores and provided their top picks in the list below.
But there's a silver lining: buy the PC/Mac version now, and transfer your character to consoles later for $20, or £12.99 in the UK.
Square Enix announces its lineup for the European gaming show; Just Cause 3, Dragon Quest Heroes, and more will be playable.
The makers of H1Z1, an open-world zombie survival game, gave a small number of banned players a way to get their accounts back: Openly admit (and apologize for) their transgressions, and post the video to YouTube.
Players of the augmented-reality title have long had the pleasure of experiencing its unique take on smartphone gaming. Now, Ingress is bringing some more traditional elements into the mix.
This free 3D online advergame is hard to stop playing, and yes, a bit corny. Crave's Michael Franco finds out what it's like to blast people with "love pushes" and a "kiss gun."
Baad-ass! A new patch for the game Goat Simulator adds a pseudo online multiplayer mode so you can headbutt and lick things with all of your pretend goat friends.
We can't believe these tiny sculptures (created by artist Jonty Hurwitz) are thinner than the width of a human hair and relatively detailed for their size. If you wanted to see them, though, you'd need to have an electron microscope handy.
One of the most successful video games ever made is a decade old. What's Blizzard's next act?
The "transmedia" sci-fi game Defiance goes on sale today, with the first episodes of the show to air on 18 April.


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Animanga changed from Apr. 7 to Apr. 12
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Fri, 2010-03-26 17:17
Due to a last minute change the April Teen Animanga Club meeting is being moved from Wed. 4/7/10 to Mon. 4/12/10. Put the word out. Same great anime zaniness, different date. Next month it will resume being on Wednesdays (May 12th).


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Posted at: 04/03/2013 5:29 PM
By: Laura Lee
(ABC 6 News) -- This weeks Excellent Educator is from Austin. Brandon Button is an elementary school teacher at Banfield Elementary in Austin.
His enthusiastic energy is hard to miss, "I try to make anything fun, for example, to teach fraction, I brought in doughnuts to everyone and we cut them into halves and thirds and quarters."
When we stopped in, students were working on a science project studying absorption.
The kids even got to test for themselves.
'It's a huge privilege to be a teacher and its a big responsibility, a big job, teachers work very hard," says Button, "knowing what you do makes a difference and that is really important."
Another important thing, is keeping students engaged. "Bring them food, of course food is very engaging for students always," chuckles Button.
At the end of the day, he says his classroom is where is heart is.
"That's why you get up in the morning and come to work, that's why we're here."


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Getting funded by a record label
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Getting funded by a record label
In my life i have, and am still, dealing with debt. My goal is to get out of debt and to stay that way for the rest of my life. I have thought about how that will apply to any bands that i am in that will sign with a record label (indie or major). So here are my thoughts as to how i think my band, and any band really, should handle the issue of going into debt with any record label.
Bands usually brrow money from record labels when they are on the label to finance a tour or the making of an album. Then they have to pay this money back. Most of the times this leaves the band in debt to the label. My goal is to not go into debt with a label EVER. As a matter of fact my goal is to not go in debt in any way 99.9 % of the time.
I think that a band should find a way to where they dont have to go into debt with their label to make an album or to fund a tour or to distribute their album when they make one. I think that a band should save the money themselves to make their own albums and to finance their own tours. I think that once they get going in this way that they can keep doing this better and better with the money that they make from each new album and each new tour. That way the albums can get better production and the tours can get bigger and bigger.
I think that if a band cant afford to distribute a huge number of albums without going into debt with their label that they should just distribute all that they can until they can afford to distribute more albums. This may take longer to get albums into more fans hands but it will keep the band out of debt with the label and ultimately put more money in the bands pocket. I also feel that if a band cant fund a big tour on their own that they should start small and build it up from there until they can fund a huge tour all with their own money. Again, this would keep them out of debt with the label and this would put more money in the bands pocket.
I think that a band should not take any cash advances from a label because this is just going to put the band over a barrel with the lable for who knows how long. If a lable says that they wont sign a band if they wont go into debt with them and if the band wont take money advances from them i think that they band should not sign with them.
The way that i think is the best way for a band to be on a label is for the label to have the distribution and marketing ability to help the band. But only as so much that the band can pay for it themselves. So that the more money the band has coming in the bigger things get. But not going into debt with the label, or anyone else, to get bigger. That way the label can push the bands albums into bigger markets and advertise in bigger magazines and websites but only with the money that the band gives them.
The whole thing for me is keeping my bands that im in out of debt with labels and anyone else that way we dont end up getting messed over and that way the label does not have leverage over my bands.
What are all of your thoughts on these things?
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The Greatness of Ramadaan
The Greatness of Ramadaan
The Greatness of Ramadaan
– celebrating the Quran and celebrating Taqwa
Shaykh Seraj Hendricks, Head Mufti of Cape Town, South Africa
Azzawia Mosque 20 November 1998
"The month of Ramadaan is the month in which the Quran was revealed as a guidance for humanity, as a clear proof of that guidance, and as a criterion for distinguishing between right and wrong" (2 : 185).
In as much as celebrating the Prophet's birthday (the Milad un-Nabi) can be read as a celebration of the greatness of the Prophet (SAW) in his aspect of the perfect man (Insan ul-Kamil); and in as much as Yaum Ashura can be read as a celebration of the saving of Nabi Musa (AS) from the tyrannical pharaonic oppressors; similarly Ramadaan can be read as a celebration of the revelation of the Quran during this month. It is a celebration of the Quran as both a living guidance and a living proof to humanity. It stands as a living proof of the divinity of Allahu Ta'aala, as a living proof of the authenticity of the prophethood of Muhammad (SAW), and of the supremacy of revelation over all else.
But the Quran is also a Huda (a guidance). And as Huda – as true guidance – it teaches us how to live our lives as complete human beings. It teaches us how to live our lives with respect, dignity, honor, and love. It further teaches us that Allahu Ta'aala is a divinity that embraces the concerns of all humanity.
It is also important to remember that the guidance and concerns of Allahu Ta'aala are not limited to mere theoretical or idealistic utterances. The guidance of Allahu Ta'aala plunges us into the mainstream of our earthly existence. One of the ways in which Allahu Ta'aala has done this is by making the fast obligatory upon all of us.
Not only are we required to sympathize with the poor and the hungry, but we are thrown into the very experience of hunger.
Not only are we required to reflect upon our condition in a society with its mores, customs, habits, rules, and general routine – which looms far greater than the sum of its individuals, but it forces us to reflect upon the very nature of that society. It is so easy to become a cog in the political, economic, social, and industrial machine. In short to become a spiritually forgetful being in the material and mechanical processes of ordinary life.
Fasting forces us to break this forgetfulness, and forces us to anchor the consciousness of truth and spirituality in every domain of our existence i.e. to act upon the truth of Islam and to live by its spirituality.
Fasting, by depriving us of the daily luxuries and niceties of our mundane existence asserts the supremacy of our essential condition as beings endowed with a soul (ruh) over our condition as material and temporal beings. Fasting, therefore, at once draws us into the bosom of Allahu Ta'aala and allows us to reflect upon the high moral, social, and spiritual values which Islam sets for us. In other words fasting focuses our attention on the broader meaning of Taqwa as expressed in the following verse:
"O you who believe, fasting has been prescribed upon you as it has been prescribed upon those before you so that you may learn Taqwa" (2 : 183).
The Arabic of the phrase in the above verse "so that you may learn Taqwa" reads as "l'allakum tattaqun". The term "taqwa" – in its narrower meaning – has been variously translated as fear, piety, self-restraint, and guarding against evil. However, to do justice to its meaning, and to better understand the link between the Quran as Huda (true guidance) and Taqwa as one of the most desired virtues in man, a more comprehensive understanding of the term is required. That understanding is dependent on our understanding of the nature of man and woman.
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Today we celebrate the birth of Victor Ross, with L.A. Models and Major in NYC. He is suave, debonair and can't be stopped. Victor Ross is on the rise! I met Mr. Ross almost 4 years ago and have witness much growth in this male model, and I know there is much more to come.
Keep rising, Victor!
He also has a Motorola Xoom Vendetta tablet commercial currently running on television.
Sunday, February 27, 2011
Tuesday, February 22, 2011
A Little Black Turtleneck
I previously featured male model, Brandon Espy, with L.A. Models and NTA Talents, back in October for his birthday and here are images from his latest shoot with me. Brandon has grown tremendously since I first shot him 4 years ago and I look forward to see him continue to rise. Here he sports what every man needs in his closet; a little black turtleneck.
Thursday, February 17, 2011
Happy Birthday Frank
You may remember Frank from my past summer/ fall art project that was published in Ohlala magazine. He is now signed with Photogenics Model Agency and is a personal trainer at Equinox in West Hollywood. Today Frank is celebrating his birthday. I wish him much success in the future with Photogenics and all his endeavors and a blessed birthday!
And here is an image from our first shoot that was published in Ohlala
And here is an image from our first shoot that was published in Ohlala
Lana Santorelli "LUST" art exhibit - NYC
I just came across images from last year's group art exhibit that I participated in, back in May of 2010, at the Lana Santorelli gallery in New York City. Unfortunately I was not present for the showing but the gallery posted images on their facebook page and I was able to snatch up a couple of images. It had a great turn out and displayed some great work. My work was amongst some great artist.
Monday, February 14, 2011
Happy Birthday Hiro!!!
The Adventures of Stephy C
On this Valentine's Day, we find our lovely Stephy C home alone and bored. What is a girl to do?
So she decides to take it to the street, where she meets up with Tia and all makes for a better Valentine's adventure...
It just goes to show, you can find love anywhere. And you can find more adventures of Stephy C by going to her website by clicking on her name. You won't be disappointed. Happy Valentine's Day!
So she decides to take it to the street, where she meets up with Tia and all makes for a better Valentine's adventure...
It just goes to show, you can find love anywhere. And you can find more adventures of Stephy C by going to her website by clicking on her name. You won't be disappointed. Happy Valentine's Day!
Pic for the day
Friday, February 11, 2011
Complexd magazine cover
This is my first magazine cover for Complexd magazine, based out of the UK. Check out the lastest issue of Complexd and the feature of the beautiful Tarren.
Thursday, February 10, 2011
Don't Get It Twisted!
And another birthday shout out from cycle 5 of America's Next Top Model, Ebony. Don't get it twisted! This soul sister was fun to shoot. I did this shoot with her about 5 or 6 years ago, so it's an oldie but it's a great representation to all my soul sisters out there! Happy birthday, Ebony!!!
Birthday shout to Jason Olive!
My 3 favorite models of all time are Iman, Naomi Campbell and Jason Olive and I had the pleasure of working with him in 2009, which you can see from my past blog post by clicking here. So I want to give a warm shout out to actor/ model Jason Olive on his earth day.
Wednesday, February 9, 2011
Behind the Music
I recently shot promotional shots for a 19 year old recording artist name Stacy, that is signed with Subliminal Records, through Universal Music Group. Here in Los Angeles, it is always good to have your hands in the entertainment industry. There is definitely a big market here for that so here is a sample of my work with a musician. Stacy is very pretty. I suggested the red hair so the hairstylist changed the color before the shoot to give that extra pop. It is challenging for me to work with a full team; wardrobe stylist, make up artist, hair stylist and art director, because I have to wait hours before the model is ready and then the team jumps in and fix the model after every click of the shutter; but it is something I have to get use to and the results are always great.
Right after I clicked the shutter and there is our stylist!
Right after I clicked the shutter and there is our stylist!
And this is the producer and creator behind Subliminal Records, Deja the Great, shot in Hollywood. Look for his CD to come out soon.
Monday, February 7, 2011
Pic for the day
Thursday, February 3, 2011
A different tune at the dunes
Here are a few more snaps from my recent Imperial Dunes shoot, this time featuring the wonderful Vel Jones. This setting is like a blank canvas to create. I love it.
Adding a little more of an artistic flair
And then even more of an artistic flair
Pic of the day.
Last week I had a surprise visit from, Anthony Garibai, a model I shot several years ago, who lives near Monterey, CA. He was in town for a job interview so we did lunch and took a couple of snaps on my rooftop. Once we got up there, I discovered that the elevator shaft was open so of course I had to take advantage of that.
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Guest Check
When inviting guests to dine, always ask if there are foods they avoid. Some guests won't be impolite by telling you up-front; but why prepare food they will only decline (and leave you scrambling to find them something else)? If guests with special needs offer to bring their own food rather than have you prepare it, allow them to do so. It makes them comfortable, and it doesn't make you an inadequate host. Do, however, ask if they can have specific garnishes, and make their plates look festive when you bring their food to the table.
Be a Guest Tipster. Click here to send us your gourmet tip and you could see your name in this very space.
The new Online magazine about specialty foods And
the gourmet life
february 2005
The newsletter will still focus on one weekly product. Here online, you'll find many more product reviews each month, along with regular features, how-to's, glossaries, entertaining ideas and recipes. Our goal is to seek out the best specialty foods for every day as well as for special occasions, and offer suggestions beyond the obvious on how to enjoy them.
If you're not already a subscriber to THE NIBBLE's weekly newsletter, each Tuesday we e-mail our top food pick of the week to opt-in subscribers. It's free—just click here to have it delivered directly to your e-mailbox. Of the thousands of specialty foods we taste each year, these are our favorites for both home use and gift-giving. You won't want to miss them!
As we evolve our content and our format, we look forward to your comments and any suggestions you have about how we can make THE NIBBLE™ magazine and newsletter more valuable to you. Click here anytime to send us a note.
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To take a peek at the March table of contents,
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For additional information on federal issues, please contact Mark Ames, ASHRAE's Senior Manager of Federal Government Affairs, at email@example.com.
Twice-a-year ASHRAE's President, President-Elect, Treasurer, and Executive Vice President travel to Washington, DC to strengthen existing relationships and explore possible new opportunities with a number of associations, technical societies, and federal agencies. Recently, ASHRAE's senior officers met with the following entities:
The U.S. Department of Housing and Urban Development (HUD) and U.S. Department of Agriculture (USDA) are proposing to update their energy codes for single and multifamily housing to the 2009 IECC and ASHRAE 90.1-2007, respectively. As part of this process, HUD and USDA recently issued a preliminary determination that the 2009 IECC and (with the exception of Hawaii) ASHRAE 90.1-2007 will not negatively affect the affordability and availability of housing covered by the Energy Independence and Security Act (EISA) of 2007.
In its comments, ASHRAE commends HUD and USDA for this action, and encourages them to further update their codes for multifamily buildings to 90.1-2010, noting that the U.S. Department of Energy (DOE) has already evaluated the 2010 version, and has recently provided a preliminary determination that 90.1-2013 would achieve greater energy efficiency than the 2010 version. Consequently, "ASHRAE strongly encourages HUD and Agriculture Departments to provide a consistent Federal Government approach, particularly for 3 story of greater buildings, by endorsing and incorporating into the above regulations ASHRAE 90.1-2010. Further, after the DOE formal evaluation of ASHRAE 90.1-2013 is completed, HUD and Agriculture Departments should promptly update their regulations to include that reference, presuming a favorable DOE determination. A single, consistent US Standard will enable better enforcement and compliance and avoid marketplace confusion", ASHRAE stated in its comments.
To view ASHRAE's comments, please click here (PDF).
Below is the text on NGBS in the Senate version of the NDAA FY 2015:
"All residential buildings funded, planned, remodeled, or authorized by this Act that will be designed and constructed to meet an above code green building standard or rating system may use the ICC 700 National Green Building Standard, the LEED Green Building Standard System, or an equivalent protocol which has been developed using a voluntary consensus standard, as defined in Office of Management and Budget Circular Number A-119."
For additional information on international, state, and local government affairs, please contact Jim Scarborough, ASHRAE's Manager of Grassroots Government Affairs, at email@example.com.
The Building Codes Assistance Project (BCAP) is pleased to announce that, beginning June 1, 2014, BCAP ended its status as a program of the Alliance to Save Energy (the Alliance) and became a stand-alone organization, receiving fiscal sponsorship and non-profit status from a new partner, the Trust for Conservation Innovation (TCI).
BCAP was started in 1994 as a joint project of the Alliance, the Natural Resources Defense Council and the American Council for an Energy-Efficiency Economy. "The BCAP team and our many partners are enormously grateful for the twenty years of stewardship provided by the Alliance, and for the encouragement they are giving us as we begin this new adventure," said Maureen Guttman, AIA, President of BCAP. "There are exciting opportunities for BCAP as we move forward and explore new areas of growth."
Through its work at the national, state and local levels, BCAP provides education and technical support for code adoption proceedings, promotes collaboration among stakeholders to achieve action at the state level, and addresses common barriers to compliance through the development of innovative programs and tools. The building sector accounts for around 40% of total energy use and over 70% of electricity use in the U.S. and thus is a key target sector for the deployment of energy efficiency measures. Adoption and enforcement of the nation's model energy codes is, by far, the simplest and most effective means of achieving widespread savings in the built environment.
For additional information on the past and future of BCAP, please see Maureen Guttman's blog post on OCEAN.
Recent communication from NEEP has provided information about new energy code adoptions.
The Massachusetts Department of Energy Resources (DOER) is pleased to announce the release of the Program Opportunity Notice (PON) for the Pathways to Zero Grant Program. This program will support the deployment of demonstration building projects that intend to achieve or exceed a Zero Net Energy Buildings (ZNEB) goal in the residential, multifamily, commercial and institutional building sectors.
Grants are available for up to $10,000 for single family homes, up to $400,000 for multi-family residential buildings, and up to $500,000 for commercial and institutional buildings. All projects are eligible to receive funding for construction costs. Multi-family residential, commercial and institutional projects are also eligible for funding for feasibility studies and integrated design services.
More details can be found in the PON via the COMMBUYS website. Responses are due July 15th, 2014, and a bidder's conference will be held on May 27th at 11am via webinar; more details will be posted on DOER's Grants page.
The Ohio House has passed a controversial measure that pulls back on the state's renewable energy standards. Senate Bill 310, which passed 53-38 on the afternoon of May 28, had previously passed the Senate. Once the Senate agrees to the minor changes made by the House, the measure will go to the governor for his signature. The bill includes a two-year freeze on standards that apply to electricity utility renewable energy and energy efficiency programs. It also makes major changes to the rules when they resume in 2017, ending a requirement that utilities purchase half of their renewable energy from within the state and expanding the types of projects that count as "energy efficiency" for purposes of regulation. Governor Kasich indicates he will sign the legislation. For more information on the legislation, please click here.
The Utah Uniform Building Code Commission met on June 11, 2014. On their agenda was discussion of moving to a six year cycle. Quite a number of people spoke in opposition to changing the code cycle and the Commission did not make or recommend any changes. It is still likely that the issue will resurface in next year's legislative session so it will be necessary to educate legislators.
Aaron Smith, Halifax Chapter Grassroots Government Activities (GGAC) Chair, recently contacted the Building Code Coordinator for the Public Safety Division of the Nova Scotia Labour & Workforce Development Office to commend the government of Nova Scotia for adopting an energy code for commercial buildings. The Province of Nova Scotia adopted the National Energy Code of Canada for Buildings (NECB) 2011 and the Halifax Chapter of ASHRAE has asked that ANSI/ASHRAE/IESNA Standard 90.1 be accepted as an alternative compliance path for the design, construction, and renovation of commercial buildings.
ASHRAE advances the arts and sciences of heating, ventilation, air conditioning and refrigeration to serve humanity and promote a sustainable world. With more than 53,000 members from over 132 nations, ASHRAE is a diverse organization representing building system design and industrial processes professionals around the world.


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|Civil Engineer Active in Following organizations: Estonian NY house, The Nordic Press, Estonian Cultural Alliance, Estonian Educational Society, "EKL" 23 folders: Documents- Personal, Accounting notebooks of expenses, Business Budget/Notebooks, correspondence, Education: Notebooks elementary, secondary, Technical books - prayer, song, bulletins, receipts, programs, church, organizations, Building plans clippings
|Collection ID:
Collection acquired from the Estonian Archives in the U.S.A., Lakewood, New Jersey, in 2003-2005.
The Espenbaum, Richard collection is available for public research.
The Espenbaum, Richard collection is the physical property of the Immigration History Research Center, University of Minnesota.
For further information regarding the copyright, please contact the IHRC.
The Espenbaum, Richard Papers, Estonian American Collection, Immigration History Research Center, University of Minnesota


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Seattle Seahawks & NFL News
Seattle Seahawks news, including Seattle Seahawks trades, statistics, roster and draft news, Hawks and NFL rumors, game scores and game schedule information
Posts filtered on Tag
Doug Baldwin leads three Seahawks receivers on list of NFL's best prospects
Outside of the Baldwin household back in Gulf Breeze, Fla., there are probably few NFL fans who would call second-year Seahawks receiver Doug Baldwin the best prospect in football. Yet that's exactly what analyst Aaron Schatz of Football Outsiders and ESPN.com called Baldwin in his list of the NFL's top 25 prospects, published on Tuesday […] [Read More]
Seahawks activate Deon Butler, put Kris Durham on IR
As expected, the Seahawks activated wide receiver Deon Butler from the physically unable to perform list Tuesday. To make room for Butler on the 53-man roster, wide receiver Kris Durham was placed on injured reserve. Also Tuesday, the team signed defensive tackle Pep Levingston from the practice squad and released defensive tackle Al Woods. [Read More]
NFL draft: Seahawks add 7 'unique' players on final day
RENTON – There was no quarterback. No sure-fire stopper for the defensive line. Nobody that Seattle Seahawks fans were intimately familiar with, unlike last year's NFL draft in which Seattle made a splash by selecting two immediate starters in the first 14 picks. What the Seahawks did get, though, were players that coach Pete Carroll […] [Read More]
NFL draft: Seahawks take WR Kris Durham with second 4th-round pick
RENTON — The Seattle Seahawks used their second pick of Saturday's fourth round to select Georgia receiver Kris Durham. Durham caught 32 passes for 659 yards and three touchdowns his senior season, starting eight of the 11 games he played. He's 6-foot-5 and 216 pounds, and ran a 4.46 40-yard dash at Georgia's pro day. […] [Read More]


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None of the choices on Hoekstras web site is appropriate for this time in the study of whether wind turbines shoulod be placed, and that is what I told the Congressman.
It is unfortunate that the anonymity of this type of forum allows people to make comments about things they know nothing about.
Senate Majority Leader Michael Bishop, R-Rochester has started many times that "government spending" is out of control apparently failihng to realize that he is part of that problem if it in fact does exist. His party has moved legislation that requies the Michigan Department of Corerections to hold onto the prisoners they have for longer periods of time but then they cut the amount of money allocated to that department makikng it dificult to do the job as mandated by the legislature.
Far too many people seem to have forgotten that taxes are what pays for those things we , the government, do together to make out lives more comfortable, roads, law enforcment, fire suppression, often emergency medical response, education, as well as keeping people convicted of crimes off the streets.
I hear people rail about "politicians" every day but if anyone has ever stood up at a township board or city commision meeting to speak they are then politicians and if they have never done that and do not get involved they are part of the problem. We are the government.
Since 2001 we have lost 2,200 law enforcement officers because tax cuts and a declining economy has reduced government income, taxes. Many people like Cox and Hoekstra are telling us that they will keep more prisoners in prisons, arrest more people to put into those prisons, have these outlaws stay in prison longer ands cutr out taxes some more so the various levels of government (us by the way ecause we are the government) have les money to work with.
They are also going to do a better job of educationg the children by also cutting taxes, reducing the amount of money availalble to operate the schools which will require laying off more teachers and thereby necessitating larger classes with less time to do the work that needs to be done.
If anyone has doubts that racism does not exist in this area simply needs to read some of the posts. These people do not need that kind of comment on top of the vandalism they have suffered.
Some of the comments are a further indication of the loss of civility we are experiencing.
The court transripts do not show the evidence the proecutor withheld that would have shown Carter was not in the area at the time. If he was not in the area at the time he could not have done trhe crime.
It is totally amazing, to me, the number of people that seem to think that "government" is some invisible entity off in a corner somewhere that exists solely to harress them. Many people seem not to understand that we are the government.
I have read Rick Snyders 10 point plan to reinvent Michigan and find that there is nothing there that I have not heard every election since G. Mennan Williams was Governor. What we need are not more Michael Bishops but more Jerry Fords, people that are more interested in solving problems then holding onto a very wrong concept of how "government" should work.
It is totally amazing, to me, the number of people that seem to think that "government" is some invisible entity off in a corner somewhere that exists solely to harress them. Many people seem not to understand that we are the government.
I have read Rick Snyders 10 point plan to reinvent Michigan and find that there is nothing there that I have not heard every election since G. Mennan Williams was Governor. What we need are not more Michael Bishops but more Jerry Fords, people that are more interested in solving problems then holding onto a very wrong concept of how "government" should work.
I have no idea how that post ended up here because it was supposed to be posted at the article by Peter Luke.
People that have no idea what they are talking about will talk about what they have no idea about. The problems that plague Muskegon Heights are multiple and are not limited to the Heights. Those same problems exist every else also and they include "parenting" or the lack of it, peer pressure, and in some instances poor teachers. Simply having a child or 10 does not make one a parent and in some instances you will see the mother or father (if one is even present) trying to cope with a set of problems they have no idea how to cope with. A single parent family is a disaster in most cases becase the single parent needs to spend so much energy just trying to earn a living with no energy left to raise the children. Peers are pushing hard to make others think that getting an education is stupid, peer pressure. Don't demonstrate how smart you are in school, misbehave, do what you can to disrupt.
We have all heard that it takes a village to raise a child and it does. Are you a mentor in your school? If not why not? If you do not like how things are get involved and change things.
I see there are a number of people that cannot discuss issues with demeaning someone.
John Engler was supposed to reform and reduce the state government so why are we still having to do that, or did he lie about that? What, specifically, needs to be reformed? What, specifically, needs to be cut? What services are you willing to do without? Are we supposed to "Do unto others as we would have others do unto us" or is it supposed to be "Do unto others before they do unto us"? Are we suppoosed to "Do justice and help the poor, the widows, the orphans" or are we to ignore them.
There is no chance that evidence was withheld? The appeals courts, wrongfully, would not let new evidence be introduced and decided the case only on the court transcripts which were fraut with bad evidence because the prosecutor withheld evidence. This won't happen?
It does all the time. Why did the governor of Illinois suspend the death penalty after 13 people on death row were found to have been convicted due to prosecutorial misconduct?
The saying "The price of liberty is eternal vigilance" means we need to keep an open mind and pay attention to our law enforcement people as well as those we elect to represent us.
That information will be available at Muskegon City Hall during regular business hours.
I have read Rick's 10-point plan to reinvent Michigan and it is the same drivel every candidate for almost every office in Michigan has espoused since G. Mennen Williams. Hoekstra, Cox, Dillon. and all the others have nothing better to offer either.
The governor of Michigan will not creeate any new jobs any more than the legislature will. They might be able to put even more tax breaks in place than we have today, but I doubt that is the reason a new business would come here totally. In spite of what some of our "business leaders" would have us believe there are new businesses starting up in Michigan every day.
We have reformed our tax system every year since G. Mennen Williams was governor and we still don't have a system that many people like. It matters not what is done many business leaders will never be happy with the tax system until they pay none.
We have had people "fix" the broken state government since John Egeler, or was it Jim Blanchard, or Bill Milliken, or G. Mennen Williams. Why does it need to be fixed? What is wrong with it? Platutides are meaningless.
An environment that will keep our youth here is on that encourages good paying jobs. That the young people leave Michigan for jobs is not new and has been happening since I graduated from high school, and longer.
Over the years many ideas have been tossed out to control urban sprawl and give restore cities. Few have actually worked because in many cases it was easier to build a new house then rehab an old house. In some instances suburban sprawl occured because new shopping centers were built and new homes were built near them on cheaper land with fewer restrictions. Look closely at the real cost of this misuse of our land and make policies to prevent that from happening.
Our schools need help, starting with money. However, in the distant past when I graduated from high school you were asked for your diploma when you applied for a job. When did that change and why. I hear people saying we need to educate our children for the jobs of the future. How? What will these jobs be? When I was in school we did not know about computers, we had to learn about them while on the job and that is what the job of the future will be too.Learn as you go because we do not know what those future jobs will be, and anyone that believes they are oracle enough to figure that out really needs to step forward.
Health care all across the United States needs to be reformed.
Winning is an atitude that already exists in Michigan, except for a few loud voices, such as Michael Bishop, that have no idea what they are talking about and do so often.
Who is this Kid Rock and why should what he says be something of interest to me? "Polls say americans want smaller government" but reality proves that wrong. Many people want "government" reduced and taxes cut, but put more law enforcement people on the streets, don't cut the parks programs, keep the roads repaired at no cost to me, and have the services I want avaialable whenever I want them. Can't have both.
I would bet that the Engineer (that is what the drivers of Fire Engines and Ladder Trucks are called) was concentrating more on the accident he was responding to and not nearly enough where he was. If the Ladder Truck was properly staffed, a minimum of 4 firefighters, there really was no reason for the engineer to be more than a couple of feet fro the truck although since that engineer was part of the rescue team that was foremost in his mind. Often, in an emergency, our minds do not function like we expect them and we all often do really stupid things.
As speaker Dillon will demonstrate even more why he should not be governor, so leave him be.
If the choice ever works out to be Andy Dillon or Pete Hoekstra, or Andy Dillon or Rick snyder, or Andy Dillon or Mike Cox, there would be no choice it would have to be "none of the above. " Unfortunately that is not a ballot choice. No one else that has yet declared offers anything better either.
According to the New York Times, Washington Post, and Chicago Tribune articles about this some senior advisors have recommended changing venue but no decision has been made by the
President yet. People being tried by military tribunals are still given the same rights as the rest of us have so changing from civilian courts to military courts shouild mean little or nothing.
Since there has been no declaration of war be congress we are not at war and these people are common criminals and should be rtried in civilian courts. Accordin to the New York Times article the 9/11 survivors group would prefer these people be tried in ciilian courts.
For those that want to use this these people all live were the water service comes from Muskegon Heights.
New Boilers, energy efficient lighting. sensors to shut off lights in unused rooms, better air handling equipment, better HVAC controls will all contribute toward that $100,000.00 savings, not just the wind turbine.


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August 4, 2015
TERRELL, Texas (AP) - A Saturday funeral is scheduled for a North Texas prosecutor shot dead by a masked gunman near the county courthouse where the prosecutor worked.
The funeral for Kaufman County Assistant District Attorney Mark Hasse (HA'-see) is scheduled for Saturday afternoon at the Terrell Performing Arts Center.
The 57-year-old prosecutor was shot multiple times the morning of Jan. 31 just after he'd stepped from his car to walk to the Kaufman County Courthouse in Kaufman. No arrests have been made in the case, but federal, state and local investigators are working to find his killer.
Hasse had been with Kaufman County for three years and was a former assistant Dallas County district attorney.
(Copyright 2013 The Associated Press. All rights reserved. This material may not be published, broadcast, rewritten or redistributed.)
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I know this is the wrong section but, I have also put it inthe Fanatasy Football section, I just don't know if it gets alot of traffic so I put it here.
Mods, I fully expect you to move tis thread quickly, but at least this way more people will see it and whoever wants to reply can......Anyways....
It is almost time for me to select my keepers for my fantasy league. Hoping to get some opinions to help me out.
I get to keep three players.
I am for sure keeping Ricky.
I am also leaning towards keeping Culpepper.
I also have:
M. Faulk
Chad Johnson
A. Brooks
B. Favre
J. Horn
D. Staley
and Chambers.
Who should my 3 keepers be?


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Kate Campbell Stevenson to Use Historic Documents to Share Women's Stories
Lakewood, N.J., Feb. 20, 2011—Celebrate Women's History Month at Georgian Court University as performer Kate Campbell Stevenson shares the lives of fascinating women in "It's Real, It's Relevant, It's Revolutionary!" on Thursday, March 1, at 6:30 p.m. The performance will take place in the Little Theatre on GCU's Lakewood campus.
Ms. Stevenson will highlight women's history (including the lives of several New Jersey women) using original documents such as photos, diary entries, suffrage cartoons, magazine ads, land contracts, sculptures, manifold lists, banners, historical jewelry, maps, and stamps. Each of these original documents tells a fascinating woman's story. Participants will look at everyday items in a completely different way after the event. As the Girls Scouts celebrate their 100th anniversary, guests will also hear from founder "Juliette Gordon Low" on how it all began.
Tickets are $10 per person. Reservations are required and can be made by contacting the Office of Conferences and Special Events at 732.987.2263 or email@example.com.
Kate Campbell Stevenson has starred in over 30 Broadway musicals produced in regional theaters across the United States, including Camelot, Carousel, My Fair Lady, The King and I, Show Boat, and the Music Man, as well as performed in radio and TV commercials. In her one-woman show, Ms. Stevenson brings to life historical women with "can do" attitudes. She has performed at the Kennedy Center and for the Office of the President of the United States and has inspired audiences all over the nation.
As part of its Women's History Month celebration, GCU is also offering the following event:
Dinner with the Fine Arts: American Female PhotographersFriday, March 9, 6:30 p.m., North Dining Room$37 per person; includes a multicourse 1940s homestyle dinner and a multimedia lecture; reservations required
Explore the lives and work of three ground-breaking female photographers of World War II: Dorothea Lange (1895–1965), who photographed the forced evacuation of Japanese Americans to relocation camps; Margaret Bourke-White (1904–1971), who was the first female war correspondent and the first woman allowed to work in combat zones during the war; and Lee Miller (1907–1977), who worked as a war correspondent for Condé Nast, documenting the first use of napalm and the horrors of concentration camps.
Founded in 1908 and sponsored by the Sisters of Mercy, Georgian Court University is a comprehensive university with a strong liberal arts core and a special concern for women. A forward-thinking university that supports diversity and academic excellence, Georgian Court serves more than 2,500 students of all faiths and backgrounds in a residential Women's College and a coeducational University College with undergraduate and graduate programs. Georgian Court's main campus is located at 900 Lakewood Avenue, Lakewood, N.J., on the picturesque former George Jay Gould estate, now named a National Historic Landmark. Georgian Court also offers classes at its site at One Woodbridge Center in Woodbridge, at Coastal Communiversity in Wall, and at Cumberland County College in Vineland.
# # #
Tuesday, Aug 4Graduate Information Sessions
Wednesday, Aug 12Summer Visit Days
Monday – Friday and selected Saturdays throughout the year
Campus Tours


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Masterpiece Anacapri (Local products) Anacapri
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- Original gifts in art glass
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Ask an islander where's the best place on Capri to purchase a unique item of gold or silver, a designer watch, or a precious piece of hand-blown glass and, nine times out of ten, they'll say "Masterpiece": the shop in the heart of Anacapri famous for its precious costume jewelry, elegant timepieces and Murano-glass tableware.
You'll know you've come to the right place long before you get close enough to read the sign. Masterpiece's windows are filled with a dazzling display of necklaces by Antica Murrina Veneziana, watches by Capri Time, Murano glass by Yalos and Formia and gold and silver jewelry by Pandora.
Years of experience coupled with the highest standards of customer care, make Masterpiece Anacapri the perfect place to shop for that special gift for that special someone.
And once you've decided which vase, necklace or watch to buy, Masterpiece will make sure it's delivered to your door, using UPS worldwide shipping service.


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Aerobic exercise gets the heart working to pump blood through the body more quickly and with more force than normal. Breathing quickens so the lungs deliver extra oxygen to the blood. Aerobic exercise strengthens the heart and boosts "good" (HDL) cholesterol levels. Low-impact aerobics include walking and swimming. Running, tennis, and basketball are high impact aerobics.
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The information provided herein should not be used during any medical emergency or for the diagnosis or treatment of any medical condition. A licensed medical professional should be consulted for diagnosis and treatment of any and all medical conditions. Call 911 for all medical emergencies. Links to other sites are provided for information only -- they do not constitute endorsements of those other sites. © 1997- 2013 A.D.A.M., Inc. Any duplication or distribution of the information contained herein is strictly prohibited.