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Process for making an integrated circuit module and product thereof including a carrier supporting a plurality of precisely aligned semiconductor circuit chips having uniform thicknesses.
1. An integrated circuit module, comprising:
a common permanent chip carrier;
a plurality of integrated circuit chips assembled on said common permanent chip carrier at predetermined intervals and aligned with respect to each other, said integrated circuit chips comprising:
a substantially planar backside surface contacting said common permanent chip carrier;
a frontside surface including active devices, said frontside surface having one or more cavities;
an insulator material filling said cavities, wherein said insulator material and said frontside surface form a substantially planar surface,
wherein each chip of said plurality of integrated circuit chips have substantially equal thicknesses to each other defined by a vertical distance between said substantially planar frontside and backside surfaces of said each chip.
2. The integrated circuit module of claim 1, wherein said plurality of integrated circuit chips includes at least two semiconductor chips.
3. An integrated circuit module according to claim 1, wherein said cavities have beveled side edges.
4. An integrated circuit module according to claim 1, wherein said insulator material is polyimide.
5. An integrated circuit module according to claim 1, further comprising:
a space between said each chip of said plurality of integrated circuit chips; and
said insulator material filling said space such that a top surface of said insulator material is substantially planar with said substantially planar frontside surface.
6. An integrated circuit module according to claim 5, wherein said insulator material is polyimide.
7. An integrated circuit module according to claim 6, further comprising a metallization interconnect contacting said substantially planar surfaces of said plurality of integrated circuit chips.
1. Field of the Invention
This invention relates to manufacture of multichip integrated circuit device configurations.
2. Description of the Related Art
In the manufacture of integrated circuit devices, system level integration on a single highly wirable substrate is desirable for achieving higher system functionality and performance. Namely, it is desirable to integrate high performance logic, dense memory, RF circuitry, other analog functions, microelectro-mechanical function, and so forth, on a single substrate. However, the technologies used in these individual functions are diverse, and they employ highly varied base technologies, different costs and yields. While it is possible to integrate a few of these components in a given semiconductor technology, such an approach requires compromises in technology with a concomitant degrading of some of the technology attributes, e.g., a reduction of DRAM density in a logic based merged logic and technology, or a reduction of logic performance in a DRAM based merged logic and DRAM technology.
Advances occurring in semiconductor processing have permitted the scale of individual integrated circuit devices to be shrunk to make it possible to incorporate increasing amounts of functionality in a single integrated circuit chip. For example, sixteen 1 MBIT Dynamic Random Access Memory (DRAM) chips of equal size in 1984 required a total chip area of 800 mm2, while a single 16 MBIT design containing the same functionality in 1990 required only 110 mm2. Thus, although the individual chip size has increased by approximately 50%, the net chip area has been reduced by a factor of 8. Accordingly, as integrated circuit chips are required to incorporate more and more functionality, the size of the chips has been steadily increasing.
However, there are practical problems associated with continually increasing the maximum chip size. A first set of problems relates to the physical limits of present day fabrication equipment. For example, state-of-the-art manufacturing lithography equipment commonly used to expose high resolution patterns through masks onto semiconductor substrates effectively limits chip size to the size of the lithography exposure field of the equipment. The size of the direct exposure field of state-of-the-art manufacturing lithography equipment in the mid 1990s is generally on the order of 25 mm in diameter, allowing square chip design exposure of about 324 mm2 (18 mm�18 mm). Most DRAM chip designs in development are rectangular and tend to be 20 mm�10 mm, or larger. A solution to the exposure field/stitching problem is to develop fabrication equipment having a larger exposure field and, therefore, the capability to manufacture larger chips without stitching masks together. However, such a solution would require massive financial investment in research and development.
Another problem relates to the general trend of wafer yields decreasing with increasing chip size. That is, it has been observed that as chip area increases, the effective chip yields reduce nearly linearly. The decrease in yield with increasing chip size can be attributed to the fact that for the same quality of semiconductor, any defect existing in a larger chip results in an overall greater area waste than is the case with smaller chip wafers. As chip size increases, the cost of manufacturing due to yield degradation becomes prohibitive.
Conventional multi-chip modules (MCM's) have avoided the problems associated with producing large chips by combining a plurality of small-sized chips in a larger package. For example, U.S. Pat. No. 4,489,364, assigned to IBM, discloses a ceramic chip carrier for supporting an array of chips by means of solder balls, such as controlled collapsed chip connections (i.e., C4). However, such MCMs tend to be extremely expensive due to their multilayered ceramic features and they require significantly more area than the net overall area of the combined set of chips. As a consequence, the wiring density is not sufficiently high for current requirements in many cases.
Prior to the present invention, there was an unsatisfied need for a multichip integration scheme for combining, in close proximity, a plurality of semiconductor integrated circuit chips.
It is an object of the present invention to provide a manufacturing process for forming a very dense integrated circuit module with integrated circuit chips and a substrate carrier assembled in a self-aligned manner.
It is another object of the invention to provide an ability to planarize a plurality of integrated circuit chips having non-uniform thicknesses for attachment to a common substrate carrier.
It is yet another object of the present invention to provide a composite integrated circuit module with more precise chip positioning and tighter chip-to-chip placement on a permanent substrate carrier.
These and other objectives are achieved in the present invention by providing a high level, low profile wafer level integrated system on a single substrate carrier using silicon based technology.
The present invention uses a scheme for front reference placement of a diced component chip (DCC) that permits the retention of a planar wiring surface. A mechanical interlock is provided between a three-dimensional topography formed in the surface of a temporary mandrel and a three-dimensional topography formed in the front surface of one or more circuit chips which ensures maintenance of precise alignment of the chip array during a backside planarization operation preformed on the chips that renders their thicknesses uniform before transferring the precisely aligned chip array to a planar surface of a permanent carrier substrate.
In one embodiment, this mechanical interlock of the temporary mandrel and circuit chips is accomplished by crystallographically anisotropic orientational etching of projection and recess surface profiles, respectively, in similar semiconductor bulk materials used in the mandrel and chip integrated circuit materials. The juxtaposed sloping angled faces of the chip recess and the mandrel projection permit insertion of mandrel projection into the chip recess until the opposing major flats of the chip and mandrel come into intimate contact with each other.
In one embodiment, alignment of each chip on the mandrel preferably involves a match-up between two or four pairs of juxtaposed sloping faces, i.e., when the mandrel projection is inserted within a trench or a four-sided well, respectively, provided in the front face of the circuit chip, preferably at its kerf area. This invention permits very dense packing of a plurality of variegated planarized circuit chips on a common carrier substrate.
High performance DRAM and logic components are tested and integrated by the inventive method. The present invention offers the advantage that it can make use of commercially available substrates and wafer bonding technology and silicon back end (BEOL) technology.
In the chip module configurations made by the present invention, the wiring loads are significantly lower than packaging loads even though the wiring loads are greater than conventional silicon wiring loads.
The inventive process permits erector-set type chip building opportunities. For instance, the invention provides for higher yielding smaller chips to be placed on a carrier substrate to permit generation of effectively larger composite chips with higher yields. Also, different chips can be optimized in standard (e.g., DRAM, SRAM, Logic, and so forth) process lines before their marriage with other chips from other process lines, on a common carrier substrate, as opposed to attempting to generate one large chip containing all elements of the final chip. Using such smaller chips as "chip sectors" in this way, the chip sectors can be separately pre-tested for quality and functionality before final placement on a common substrate, thereby optimizing final chip yields. The present invention also allows for a mix and match approach to chip placement with each other on a carrier substrate to realize large chip hybrids (e.g., GaAs with SOI, DRAM with Logic, and so forth).
The foregoing and other objects, aspects and advantages will be better understood from the following detailed description with references to the drawings, in which:
FIG. 1A is an elevational view depicting locations of masked areas to be used in the formation of positioning guidance keys to permit and maintain aligned association of integrated circuit chips with a temporary mandrel during processing according to the process of the invention.
FIG. 1B is an elevational view depicting the manner of aligned association of integrated circuit chips with the temporary mandrel using their respective mesa guide keys and cavities made according to the process of the invention.
FIGS. 2A-2D shows a process scheme for forming a recess in the chip substrate at the kerf areas where dicing can be performed to provide individual chips with alignment cavities.
FIG. 3A is an elevational view showing an array of positioning guidance cavities formed in the front side kerf area of an integrated circuit chip.
FIG. 3B is an elevational view of a diced chip positioned on the mandrel by mechanical interlock of a cavity in the chip with a mesa on the mandrel.
FIG. 3C is an enlarged view taken perpendicular to direction A--A of area Q indicated in FIG. 3B.
FIG. 3D is an enlarged cross-sectional view of a mesa-to-cavity interlock according to one embodiment of this invention taken along the centerline CL shown in FIG. 3B.
FIG. 3E is an enlarged view of a mesa-to-cavity interlock according to another embodiment of this invention taken along the centerline CL shown in FIG. 3B.
FIGS. 4A-4E depict the overall scheme of process steps according to the invention for making an assembly of planarized circuit chips processed to have uniform thickness.
FIG. 5 depicts a top view of hybrid chip module assembled according to the invention.
With reference to FIG. 1A, the process of the invention begins by providing a removable mandrel 1. The removable mandrel 1 is used as a temporary chip support in the inventive process scheme. The mandrel 1 is a semiconductor substrate, e.g., a silicon wafer, with at least the major face thereof to be processed according to this invention polished and thermally oxidized according to conventional practices. The thickness tolerance is not critical, and the overall thickness may be as thin as may be reliably processed in the manner described herein. The crystallographic orientation is preferably (100). The mandrel 1 is lightly doped (e.g., 1-10 ohm-cm) with an n-type or p-type dopant. The mandrel is lightly doped with such impurities so that it can be selectively etched away when it is time in the process to selectively etch-remove the mandrel from integrated circuit chips after they have been positioned and appropriately processed thereon in a manner described herein.
Alignment marks (not shown) for aligning a subsequent etch mask to be formed on the mandrel surface are provided by printing pattern marks onto a major face 10 of the mandrel 1 at otherwise non-used regions. The alignment marks are used to align the etch mask next formed on the mandrel surface 10, and the alignment marks are used to ensure that the mask is aligned with the [110] direction. The alignment pattern marks can be made by conventional methods, such as by forming alignment forks according to the techniques described by M. Vangho and Y. Baecklund, J. Micromech. Microeng., vol. 6, pp. 279-284 (1996), which permit a rapid and precise determination of the crystallographic orientation in silicon wafers and which can be used to align subsequent masks. The alignment forks permit alignment accuracies of �0.05 degrees to be achieved. Alignment pattern marks are also printed onto an opposing major face of each chip wafer to be positioned upon the mandrel 1.
Then, the oxidized surface of the mandrel 1 is patterned to leave discrete rectangular or elongated box structures 11 of silicon oxide at the desired locations of the mandrel silicon surface 10. For example, photolithography is used to leave silicon dioxide masking areas 11 on the silicon surface 10 corresponding to the locations desired for the generation of mesa structure 2 (see FIG. 1B).
Standard pattern etching is then performed which results in upraised mesa structures 2, such as shown in FIG. 1B, being formed in the surface 10 of the mandrel 1 after the surrounding exposed silicon is anisotropically etched away from the rest of the mandrel surface 10. That is, crystallographically anisotropic etching is performed on the exposed unmasked surface region 11' using masking pattern layer 11 as a mask resulting in removal of surface matter from mandrel 1 at rates which differ depending on crystallographic direction. The preferential etching is applied to the bulk portions of the mandrel 1. For this etching step, the etchant preferably can be KOH, EPW (ethylenediamine/pyrocatechol/water), or a modified EPW such as (ethylenediamine/pyrocatechol/quinoxaline/water). Also, other useful etchants include hydrazine, quaternary ammonium hydroxides, and ethylenediamine solutions, such as disclosed in the J. Electrochem. Soc. (JECS), Vol. 139, No. 4 April 1992, pages 1170-1174, which teachings are incorporated herein by reference.
As indicated in FIG. 1B, the use of the anisotropic etchant results in (111) oriented sidewalls 3 on the mesas structures 2 formed in the surface 10 of the mandrel 1. The mesa structures 2 are located as an array 7 in such a way on the mandrel 1 so that prefabricated integrated circuit chips 4, 5 can be placed closely adjacent to each other on the mandrel 1. Preferably four mesas 2 will be positioned on the mandrel 1 to interlock with four cavities formed in kerf areas at four sides of each chip (4 or 5). For example, array 7 includes a group of four separate, yet adjacent mesa structures 2. It will be appreciated that the array of mesa structures 2 shown in FIG. 1B is representative and not meant to be limiting. Other array configurations of the mesa structures 2 also could be used as long as each array is sufficient to prevent lateral displacements of the corresponding integrated circuit chips 4,5 when positioned on the mandrel 1 during processing. Also, the number of IC chips 4,5 shown in FIG. 1B is also chosen arbitrarily merely to facilitate the illustration.
To form cavities 6 in chips 4, 5 to receive the mandrel alignment mesas 2, and all other IC chips desired to be integrated together and planarized while positioned on the alignment mesas 2 of the mandrel 1, separate processing takes place on the semiconductor wafer or wafers bearing prefabricated IC chips 4, 5, i.e., active areas have been fabricated in the surface of a semiconductor substrate die, but the chips 4, 5 have not yet been diced (separated) out.
Although the following description illustrates the sourcing of the IC chips 4 and 5 from the same original substrate, it will be understood that the chips 4 and 5 in FIG. 1B. could be derived from different substrates.
The cavity formation in the IC chips is now discussed in more detail with reference to the process scheme shown in FIGS. 2A-2D. As shown in FIG. 2A, the IC chips 4 and 5 initially form part of a larger common substrate wafer 21 constituting chip workpiece 206. Wafer 21 is a semiconductor wafer, such as silicon. Kerf area 8, e.g., a silicon dioxide or other insulator material, forms a non-active area between chips 4 and 5. The back-end-of-line (BEOL) processing metallization 41, 51 has already been performed on the active areas 401, 501 formed in wafer substrate 21 of the chips 4, 5, respectively. The active areas 401, 501 provided will depend on the type of integrated circuit devices desired, for example, bipolar, CMOS, biCMOS, optoelectronics, and so forth. After such devices are formed in the active areas, metallization is provided by conventional metallization techniques to form connections between devices within the same active area. Preferably, additional metal layers (not shown), sufficient for enabling the testing of the finished integrated circuit chip, are also deposited at this step. Such testing preferably provides the ability to screen out defective integrated circuit chips after testing and prior to incorporating them into a larger package, thereby enhancing overall yield of the ultimate assembly. After local metallization and testing, the BEOL metallization 41, 51 for the active areas 401, 501 of the chips 4, 5, respectively, can optionally be coated with a temporary protective layer (not shown), e.g., disposed between layers 51, 202 for device 501 and disposed between layers 41, 202 for device 401, to shield the active areas 401, 501 during further processing. The protective layer could comprise one of many polymers (for example, polyimide or other insulators), which are readily applied, are surface conformal, have adequate thickness (approximately 1-5 μm), and can withstand subsequent planarization processing. After any such optional protective layer is placed on the metallization, the surfaces of the chip substrate material 21 are ready for processing according to this invention as described below.
Continuing in the description of the inventive process, and as shown in FIG. 2B, the kerf area 8 common between chips 4,5 of the front surface 203 of the silicon substrate 21, is appropriately patterned to form mask pattern 202, e.g., a photolithographically patterned Si3 N4 film. As shown in FIG. 2C, the exposed area of the substrate 21 is then wet etched to create the recess 20. The nature of this etch operation is set forth in greater detail hereinafter.
The chip 5 is formed in a single crystal semiconductor wafer substrate 21 in which the mask 202 is aligned with the [110] direction of the upper surface 203 of the silicon substrate 21. A crystallographic anisotropic wet etch of the substrate 21, where exposed through mask 202, is used to form recesses 20 comprised of beveled side edges 9 terminating on a flat bottom 9' in the bulk of substrate wafer 21 in the kerf area 8 dividing the active areas 401 and 501 of neighboring chips 4, 5. The side edges 9 of recess 20 form an angle α with substrate surface 203. While silicon nitride is preferred for mask layer 202, the present invention is not limited thereto, as other conventional mask materials used for anisotropic wet etching of silicon wafers also could be used.
The wet anisotropic etchants that can be used for etching cavities 20 in the silicon substrate 21 located below the kerf area 8 between adjacent chips 4 and 5 include the same etchants used for etching the mesa structures 2 on the mandrel 1. These etchants, due to their anisotropic nature, have differential etch rates for different crystallographic planes, thereby creating a tapered or beveled side edge in the recess or cavity created. Therefore, anisotropic etchant results in (111) oriented sidewalls 9 on the cavities 20 formed in the kerf areas 8 between chips 4 and 5. For example, using KOH etchant on a (100) silicon wafer, the etch angle α will be 54.7� relative to the (100) plane.
The geometric dimensions of the unexposed (masked) silicon surface areas 203 have the important function of controlling the lateral dimensions of the beveled recess edges 9 of the cavities 20. Since the silicon etch is anisotropic, a (100) crystal surface forms a planar recess bottom 9' bounded by (111) sidewall edges 9.
In FIG. 2D, the mask 202 and remaining kerf area 8 has been removed so that the extension of the angled surface 9 offers clearance access, as indicated by hatched lines "IC" extending beyond the thickness "t" of each of the BEOL regions 41 and 51, for a mesa 2 of a mandrel 1. At this stage of processing any optional protective layer that has been previously applied to the BEOL 41, 51, as described above, is removed. The thickness of the PECVD layer 204 is formed sufficiently thin relative to the thickness of the BEOL areas 41, 51 such that its thickness can be practically disregarded insofar as the clearance C.
As also shown in FIG. 2D, an important operation performed at this stage of processing is that the outer surface of the workpiece 206 is coated with a thin layer 204 of PECVD SiO2.
At this point, the substrate 21 is diced through at the centerline CL of recess 20 to separate chip 5 from chip 4, as shown in FIG. 3A. The diced chips 4, 5 retain a major portion of each half of the geometry of original cavity 20. The dicing will remove some minor portion of the cavity 20 by virtue of the thickness of the dicing wheel blade (unless cleaving is instead used). However, the (111) oriented sidewall 9 adjacent to the device active area 22 remains with the chip 5 (and similarly to chip 4).
The sum of the width of the cavities 6 left in each of chip 5 and chip 4 (separated from chip 5) are slightly less than one half the original width of original recess 20 indicated in prior FIG. 2D. However, if conventional cleaving is instead used to separate chips 4 and 5, the sum of the cavities 6 shown in FIG. 3A on chip 5, which were concurrently formed on several different sides of chip 5 in the manner described above, are essentially the same size as the original width of original recess 20.
The positions and number of cavities 6 in the kerf areas 8 can vary, as do the length of them. However, the ultimate geometry, size and number of cavities 6 in each kerf area 8 formed on and as part of the integrated circuit chip 5 must be related to the geometry, size and number of corresponding mesa structures 2 formed on the mandrel 1, as explained in detail hereinafter.
The key consideration is the manner in which the alignment cavities 6 in FIG. 3A have been formed in the kerf area of each IC chip 4, 5 to be integrated together. In this regard, the objective is to form an etched recess 20 (e.g., see FIG. 2D) in the kerf area of a substrate wafer, which upon dicing down its centerline CL, provides a chip 5 having a frontside 201 with cavities 6 in the kerf area 8 bounding the chip's active area 501 and where each cavity 6 fits over a portion of a mesa projection 2 of the mandrel 1 (see FIG. 3B).
The geometries involved with mating integrated circuit chip 5, for example, to a mesa 2 on the surface of a temporary mandrel 1 are shown with greater detail in the enlarged views of FIGS. 3C-E. Although only the chip 5 is shown as positioned on the mandrel 1 in FIGS. 3C-E for illustrative purposes, it will be understood that the present invention encompasses positioning a single chip or a plurality of chips presented on mesas 2 formed on the mandrel 1.
For this illustration, the chip cavity 6 is a four-sided well configuration with a flat bottom 9', illustrated in cross-section in FIGS. 3C-E, while the mandrel mesa projection 2 is a 4-sided structure with a flat plateau 3' that is inserted into cavity 6 of chip 5.
In this manner, each of chips 4 and 5 will have appropriate cavities 6 formed in the silicon substrate 21 thereof with beveled edges 9 and a bottom depth of each cavity 6 permitting placement of the side edges 3 and height dimension of the mesa structures 2 formed on the mandrel 1 within cavity 6 at least until the outer major planar flat 201 of the chips meets the outer major planar flat 10 of mandrel as shown in FIG. 3C. As also indicated in FIG. 3C, a gap 208 remains between the mesa plateau 3' and the bottom 9' of cavity 6 of chip 5 when the major flats (201, 10) are brought into physical co-planar contact.
Referring to FIGS. 3C-E, it is imperative that the cavity 6 and mesa 2 be sized to permit the major flats, i.e., front surface 201 of the chip 5, and the outer surface 10 of the mandrel 1, to directly contact each other in co-planar fashion before, or at the latest, simultaneous to when, the mesa plateau 3' contacts the cavity flat 9' at its bottom. The cavity sidewalls 9 and the opposing side edges 3 of the mesa 2 are sloped at the same angle to permit conformal contact sliding between the two.
In the embodiment shown in greater detail in FIG. 3D where the metallization 51 is stepped back from the mesa 2 (such as in the intermediate assembly formed as shown in FIG. 2D), the height d of the mesa 2 from flat 210 is a smaller value than the combined depth d1 comprised of the cavity depth d2 in the substrate 21 plus the thickness d3 of the overlying metallization 51. The hatched lines in FIG. 3D indicate the ability for inserting the mesa 2 into cavity 6 in which the cavity sidewalls 9 conformally confront the side edges 3 of the mesa 2.
In an alternate embodiment of the invention shown in FIG. 3E, the edges "e" of metallization 51 and active area 501 of chip 5, where bordering cavity 6, is arranged to be flush with the side edges 3 of mesa 2 when fully positioned within cavity 6. To accomplish this, the width x of the mesa 2 is sized to be smaller than the width x' of the opening "o" formed in the active area 501 and metallization 51 to define the entrance to cavity 6, i.e., the lateral distance between active areas 501 and overlying metallization 51. This sizing arrangement locks the mesa 2 inside cavity 6 with the sloped cavity edge 9 being in contact with the sloped side 3 of the mesa 2. Thus, by providing mesa side edges 3 and cavity sidewalls 9 at the same angle, and by providing a mesa height y that is smaller than the combined depth y' of the cavity 6 plus the thickness of the metallization 51, the mesa 2 can also interlock with the outer profile presented by chip 5 at the edges "e" of the BEOL metallization 51 and active area 501 bordering cavity 6.
A combination of different sized chips and/or chips having different shapes defined by their peripheral edges (e.g., mixtures of squares and rectangles, and so forth) can be positioned on the common mandrel 1 in the above manners, as long as the chip depressions and mandrel mesa projections are dimensioned in compliance with the constrains described herein.
Where chips 4 and 5 are intended to ultimately remain side-by-side in close proximity to each other in a finished electronic package, the spacing of gap 32 can be reduced to a gap dimension convenient for gap filling and dicing. If the gap 32 is made too small, it can be difficult to wick filler into the gap. This gap 32 can be filled by a material having a flowable state to facilitate complete filling of the gap 32. The gap filling material should be selected as a material able to tolerate the heat associated with additional subsequent metallization operations, e.g., polyimide, epoxy, or SOG.
As indicated by the hatched lines in FIG. 1B, and with the resulting assembly shown in FIG. 4A, the diced integrated circuit chips 4, 5 are each placed face down, i.e., with active areas 401,501 facing mandrel 1, onto and against the corresponding located mesa structure 2 on the mandrel 1 to which it is mated with a standard pick and place tool. Contact is made between the major surface 10 of the mandrel 1 and the exposed oxidized layer 204 previously formed on BEOL area 51 and cavities 6 of the chip 5. Van der Waals forces cause the two surfaces to attractively associate. A brief anneal can be applied for several minutes at a low temperature (350-450�) by either a hot stage or lampheating to cause the diced component chips 4, 5 to enhance the adherence between the mandrel 1 and diced chips 4,5. The elevated temperature bonding is done after the mandrel wafer 1 is fully populated with the desired collection of integrated circuit chips 4,5. Alternatively, the integrated circuit chips 4,5 can be adhesively bonded to the mandrel 1 with the use of an appropriate adhesive, such as a temperature stable epoxy that can tolerate temperatures greater than 400� C. Critical to the success of the bonding is surface cleanliness. Therefore, just prior to the association step, the mandrel 1 and the integrated circuit chips 4, 5 preferably are subjected to a conventional cleaning procedure.
Upon mating the chip cavities 6 with the mesa structures 2 on the mandrel 1 in this manner, the position of the chip 5 is fixed for purposes of further processing involving planarizing the backside of the integrated circuit chips, as described hereinafter.
In any event, referring now to the process scheme shown in FIGS. 4A-D, after mating chip 5 and chip 4' to mandrel 1 and providing a gap filler 32 (e.g., polyimide), the next step of the process is performing backside planarization of the chips 4' and 5. This planarization procedure equalizes the chip thickness "tc" of chips 4' and 5 such that the overall workpiece backside 33 extends co-planar with both chip backsides 33' and 33" created by the planarization process.
Chip 4' has been processed in a similar manner as chips 4 and 5 as described above insofar as the positioning cavity formation, except that chip 4' is derived from a chip workpiece other than workpiece 206 as shown in FIG. 2A). Separate chips derived from the same or different chip workpieces generally will not have identical thicknesses. For example, the thickness of the semiconductor substrate wafer may vary between chips derived from separate workpieces and/or different active area and metallization processing will cause variations in thickness between separate chips. Therefore, the back surface profile 31 is not co-planar with all the chip backsides 31' and 31". Accordingly, at this stage of processing, the back surfaces 31' and 31" are simultaneously planarized using high speed silicon polishing, e.g., conventional CMP, used in wafer polishing, resulting in the planarized backside 33 extending co-planar with both chip backsides 33' and 33", as shown in FIG. 4B. After completing planarization, the overall remaining thickness of all the planarized chips 4' and 5 of uniform thickness can be as little as 200 μm, or even smaller. This surface is then coated with a thin PECVD SiO2 film.
Then, a permanent substrate carrier 34 is provided for chip bonding, as shown in FIG. 4C. The permanent substrate carrier is pretreated prior to contact with the chips and mandrel assembly whereby a thin film (not shown) of thermal oxide or PECVD silicon dioxide is formed on both its backside 36 and what will be its chip receiving face 33'". The backside oxide will be used as an etch stop while the frontside oxide formed on carrier 34 in this manner will facilitate joinder to the chips 4', 5. The polished backside 33 with the PECVD Si O2 film of the bonded chips 4', 5 is then placed in contact with the planar, oxidized surface 33'" of carrier wafer 34. The bonding process is then repeated so that the bonded chips 4', 5 at this time are sandwiched in-between the original mandrel 1 with its mesas 2, and the planar carrier wafer 34, with the resulting assembly shown in FIG. 4C.
The low doped mandrel 1 is then selectively removed by immersing the mandrel 1 in KOH, EPGW, or another anisotropic etchant for silicon, to remove the temporary support 1 from the chips 4', 5 to leave chips 4',5 exposed on the front outermost planar surface 201 having the metallization 41, 51 and active device areas 401, 501, respectively, while retaining the attachment of the back sides 33', 33", respectively, of the chips 4', 5 to carrier wafer 34, and resulting in the structure shown in FIG. 4D. To reduce the processing time needed to remove the mandrel 1, it is also possible to perform a preliminary operation on the mandrel 1 in which it is mechanically lapped to remove a significant thickness of the mandrel 1 from its exposed side, and then lapping is discontinued when only a relatively small thickness of the mandrel 1 remains for etch removal. PECVD silicon oxide layer 204 (FIG. 2D) that was previously formed on the surfaces of the chips 4' and 5 provides a natural etch stop to protect chips 4' and 5 from the etching operation used to remove the mandrel 1. Likewise, the PECVD silicon oxide layer formed on the back face 36 of the permanent substrate 34 protects it from the etchant used to remove mandrel 1. The mandrel 1 was low doped to be selectively etched at a higher rate from a productivity standpoint since a highly doped mandrel, which could be used, will etch relatively more slowly.
The removal of the mandrel 1 in this manner will leave behind, in those areas where the mesas 2 were positioned into the cavities 6, an open set of cavities. These must be filled and planarized with an appropriate insulating material 35, such as polyimide, as shown in FIG. 4D.
To provide inter-DCC wiring, the exposed front surface 21 of the collection of chips 4', 5 is subjected to conventional BEOL interconnect metallurgy processing to provide BEOL interconnect 205. This can be accomplished due to the accuracy of the earlier step of chip positioning onto the temporary mandrel 1. Vias are cut through the outer oxide layer on the front surface of the chips 4', 5, filled with metal and polished down as in standard via-stud processing. If the line width and pitch permit, both lift off and sub-etch process may also be used. In order to accommodate the tolerances of DCC placement, a set of buffer pads between the DCCs may be employed as intermediate landing sites for the inter DCC wiring. Multilevel metallization is formed by conventional methods to complete the wafer level wired system shown in FIG. 4E.
In this manner, several DCCs with different functionality can be wired with line widths, pitches and distances that are characteristic of a backend process rather than a MCM process.
FIG. 5 depicts a top view of an example of hybrid chip package that can be assembled according to the invention. Using the chip depression/mandrel projection system of this invention during simultaneous backside planarization of a plurality of different thickness chips, a variety of different types of integrated circuit chips and sizes can be assembled together on a common substrate. As illustrated in FIG. 5, the final integrated module 500 has variegated chips 503a-e comprised of ROM, MCU, DSP, SRAM and FLASH chips positioned on a common carrier substrate 502. It should be noted that the integrated circuit chips 503a-e, which are assembled together in the module 500, are not limited to the examples provided here, and they may be formed from substrates of similar or dissimilar materials, and the processing methods to form the active devices in the integrated circuit chips may have been radically different from each other as long as the chip positioning means of the present invention is employed.
The mandrel projections 2 are illustrated in FIG. 1B as four-sided mesa-like structures having four sloping sidewalls. It can be understood that if an etch mask stripe is provided to extend partly from one edge of the mandrel wafer 10 towards an opposite edge thereof that a ridge-like projection would be created by the etching procedure instead of a mesa. This embodiment would prevent movement of a chip positioned on the ridge in lateral direction to the ridge, although the chips could slide along the ridge. Therefore, in this optional scenario, the ridge should be made discontinuous with a terminus provided at both ends before the ridge reaches either edge of the mandrel wafer to afford some ultimate sliding movement control for chips positioned thereon. Such a ridge-like projection on the mandrel could be used where a trench-like depression (i.e., two spaced beveled edges extending along a common flat trench bottom) is formed on the bottom surface of a chip from one edge thereof to the other for chip positioning purposes.
Also, while the semiconductor wafer material used for chips 4 and 5, and the mandrel 1, have been exemplified as silicon, these materials also may be other semiconductor materials such as germanium, gallium arsenide, a compound of a Group II element and a group VI element, a compound of a Group III element and a group V element, or any other semiconductor material susceptible to crystallographic anisotropic etching. The wafer thicknesses used in practicing this invention can be a standard wafer thickness in the industry, such as about 700 to 800 μm for a 200 mm diameter wafer, although it is not limited thereto, as long as the mandrel and chips must have sufficient thickness to allow the alignment mesas and cavities, respectively, to be formed in the wafer thicknesses provided.
In the implementation of this invention, conventional chip handling and placement tools, such as robotic placement chucks and vacuum probes capable of controlled x-y movement, may be used to position an integrated circuit chip fabricated according to this invention such that its surface depression is interfitted with a corresponding surface projection provided on the mandrel surface. Once the circuit chip is properly oriented, a robotically controlled vacuum probe will place the chip onto mandrel mesa projections, the orientation of which has been similarly aligned. Once in place, the chips are mechanically agitated to insert fully onto the mandrel mesa projections.
Optionally, one or more pressure relief holes (not shown) can be drilled through the mandrel, preferably prior to assembly, in order to relieve pressure created by trapped gases. Suitable drilling techniques include laser ablation, ion beam milling or cryogenic plasma etching.
The present invention enjoys various advantages over prior art schemes. The present invention permits the accommodation of chip modules that are of different thicknesses by use of the front surface leveling scheme. The front reference placement scheme of this invention allows the retention of a planar wiring surface. The result is a high level, low profile wafer level integrated system on a single low cost substrate that can use silicon based technology.
Also, since the respective depressions and projections provided in both the integrated circuit chips and the temporary mandrel are defined lithographically, and created with anisotropic etching methods, the respective dimensions are highly controllable. The method also reduces the overall areal size of the assembly due to smaller space requirements.
Still another advantage is improved overall chip yields of such chip assemblies over single large area chips having similar functionality. The improved yield derives from the generally superior yields of smaller chips coupled with pretesting of such chips prior to final assembly.
Still another advantage is the ability to assemble dissimilar integrated circuit chips (e.g. silicon, gallium arsenide, etc.), requiring different processing conditions, into a final chip assembly.
While the invention has been described in terms of a few preferred embodiments, those skilled in the art will recognize that the invention can be practiced with modification within the spirit and scope of the appended claims.
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LISTEN!! Digital Music News: Rub a Dub Dub, Modern Jazz, Does Brad Really Suck?
YOU can access over 1,000 digital music albums directly through our AADL.org catalog. Stream or download as much as you like, DRM free, on any device you choose. No waiting for a copy. No due dates. Hooray!
Burning Babylon: Super Fine Dub
Give a listen to the superfine dub of Knives To The Treble by Burning Babylon. Hypnotic beats, synthie sound carpets, excellent effects—it's one of those albums you'll find yourself putting on again and again. Subtly funky beats range from the 70s oriented "Roots Fi Cool" to technoid dubs like "Babylon Overdrive" to the heavy mellow groove of "King Dubby". Positive, laid back, deeply cool.
Park St Trio: Catchy, Melodic Jazz For All Occasions
Like Goodnight Daylight, the first Park St. Trio album, 3 Plus 5 was recorded to 1-inch tape with no overdubs, no "fixing" of notes, no redos. On this album, what you hear is what they played. In the studio the band did three takes per song and selected their favorite one. True to the art of jazz, they invited a number of guest musicians, five to be exact, to record with them to add excitement, depth and unpredictability to the music. Recorded at Little Red Wagon Studios, and mastered at Headless Buddha Studios, the outcome is a catchy, quality album that establishes Park St. Trio on the Bay Area jazz scene.
Brad Sucks: Brilliantly Sardonic Indie Rock
Guess Who's a Mess is the third self-recorded and produced release from Brad Sucks. A more uptempo and aggressive outing than I Don't Know What I'm Doing (2003) and Out of It (2008), Guess Who's a Mess mixes funky beats, noisy synths and big guitars with Brad's wry, world-weary vocals about handling people's expectations and learning to be true to yourself.

subset: commoncrawl


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So I was playing a game as Aquaman yesterday on Gotham Divided, and me and my team did the Raider. When you kill that guy, a large truevision tower drops as a beacon. However, I was standing in the centre of the entrace to the Raider pit, exactly where the beacon spawns. When we killed it, the beacon spawned right inside of me and I was frozen in place until someone picked it up. I tried using my gap-closer (E) on aquaman and thankfully that got me un-stuck.
So please make the raider beacon not spawn inside a player when that player is in the exact place the beacon spawns in. If there was an enemy team nearby that tried to engage on us, and I didn't have a dash, I would've been toast .


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Even though Oldsmobile has been gone for more than a decade— doomed in the marketplace, no doubt, by the focus-group-dismaying first three letters in its name— we still celebrate the marque in music to this day. You don't see many 1965-70 Olds 88s, on the street or otherwise, these days, so this non-cancerous Colorado '67 four-door hardtop is a good junkyard find. (Read More…)
Tag: 1967
I spent a week in Sweden back in June, and I'm only now getting caught up on the photos I shot of interesting machinery at the Bloms Bilskrot yard, located in Söråker. We saw this '63 Ford Taunus 17M a while back, there was this straight-outta-1978-San Diego customized '69 Econoline van, and now we're going to admire one of the earliest Toyotas sold in Europe. (Read More…)
The 1961-1969 Lincoln Continental, with its suicide doors and slab sides, is recognized by most as the styling pinnacle of the Lincoln brand in the postwar era. Very nice early examples are worth pretty decent money, but a '67 in beyond-basket-case condition is worth whatever scrap cars are fetching per ton. Here's a thoroughly used-up '67 that I found recently in a Denver wrecking yard. (Read More…)
Some old cars have managed to maintain a steady trickle of fresh examples into self-serve wrecking yards since I began crawling around in such yards, back in 1981 or so. The kings of this phenomenon are, of course, the Fiat 124 Sport Spider (in a few years of this series we've seen this '71, this '73, this '75, this '78, and this '80), and the MGB (so far, this '67, this '71, this '75, this '79, and this '79 with Toyota 20R power). The MGB's British Leyland cousin, the Triumph Spitfire, has been a rarer but just-as-steady find for me; first this '65 and then this '75, and the prehistory of this series gives us this Spitfire-sibling '67 GT6 as well. What these cars have in common is near-scrap value when in rough shape, respectable price tags when in nice condition, and a tendency to be hoarded by guys who plan— someday— to turn the former condition into the latter condition. Eventually, reality sets in and a car that sat in a driveway from the time of the Chowchilla Kidnapping until a few months ago takes its final trip. Here's a rust-free, fairly complete, restorable early-ish Spitfire that I saw last month in a Northern California yard. (Read More…)
The march of the Chrysler A-bodies into The Crusher's jaws continues in Colorado; in this series prior to today, we've seen this '75 Duster, this '75 Dart, this '64 Valiant wagon, this '68 Valiant Signet, this '66 Dart, this '73 Valiant, and this '61 Valiant. Most of these cars' contemporary competitors— Chevy Novas, Ford Falcons and Mavericks, AMC Gremlins— were crushed decades ago, but plenty of the old 318- and Slant 6-powered Chrysler commuters managed to hang on in everyday service for nearly half a century. This '67 sedan still looks pretty solid, but these days only the Dart coupes are worth fixing up. (Read More…)
The MGB is not at all uncommon in American self-service wrecking yards these days— perhaps a bit less numerous than the Fiat 124 Sports Spider, but I still see a few Crusher-bound MGBs every year. I had an MGB-GT daily driver about 25 years ago, and so I'm very familiar with this car's many drawbacks… but I still think the B was a pretty good car for its time, so it saddens me to see yet another doomed one. Here's an early B that I spotted at a Denver self-service yard a few weeks ago. (Read More…)
Of all the racing venues I visit during my travels as Chief Justice of the 24 Hours of LeMons Supreme Court, the ritzy clubs tend to be the weirdest. We went to the Monticello Motor Club in New York a few weeks back, and twice a year the LeMons Traveling Circus rolls into the Autobahn Country Club in Illinois. The reaction of the members, who must navigate the madness of the LeMons pit scene as they drive their GT3s and Facel-Vegas to the clubhouse, runs the gamut from loathing to delight. Most of the time I ignore these guys— I always feel like we're caddies in the pool in that setting— but as the owner of an A100 I just had to talk to the owner of this truck that showed up at the 2012 Showroom-Schlock Shootout. (Read More…)
Mother's Day last weekend got me to thinking about the first car ride I ever took: a cruise home from the hospital in my parents' 1956 Olds 88. Thing is, that car got destroyed by a combination of Minnesota rust and Minnesota deer a few months later and I don't remember it. My first identifiable car memory involves crawling around on the slippery blue vinyl back seat (without benefit of baby seat or even seat belts) of my dad's late-60s company car: a 1967 Ford Custom 500 sedan with three-on-the-floor and overdrive. What's yours? (Read More…)
Back when I lived in Alameda, California (also known as "The Island That Rust Forgot"), I photographed and posted nearly 600 interesting street-parked cars and trucks on Jalopnik. The first one was this Cadillac Cimarron d'Oro, back in May of '07; the next 499 may be found here. I moved to Denver last year… which means the ITRF has had ample time to add many new DOTS candidates. I was on the island for a very brief time over the weekend and managed to shoot a couple of them. (Read More…)
With all the relatively solid big Detroit cars from the 1960s getting eaten by The Crusher in these days of $4/gallon gasoline and $250/ton scrap steel prices, how does a rough survivor like this sedan manage to stay out of the Chinese steel foundries? (Read More…)


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Informative books to help you enrich your and your
avian companion's life together! The CD's are aids for teaching canaries to sing
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Finally the perfect Cd for Parakeets and Cockatiel owners. This Disc holds 65 words and whistles designed for our little feathered friends.


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Stroller Boards
Have an older child who does not want to sit in the stroller anymore? Stroller ride on boards are the perfect solution for your toddler. Some are brand specific and some are universal. Please call if you have questions about compatibility.
For customer support, please email us at firstname.lastname@example.com
or call toll free at (866) 293-5642.


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Dakota Fanning and Danielle Macdonald Join Amy Berg's Narrative Debut 'Every Secret Thing'Read More »
As we had previously reported, director Amy Berg, whose documentary West of Memphis screened at TIFF, is directing her first narrative feature Every Secret Thing starring Diane Lane with a script adapted by Nicole Holofcener. Over the weekend it was announced that Berg's new film will be finan...Read More »
Nicole Holofcener's untitled new project began principal photography on Monday in Los Angeles. The film will be distributed by Fox Searchlight.Read More »
Two exciting new women-directed projects were announced this week.Read More »
Earlier this year, documentarian Amy Berg ("Deliver Us From Evil") arrived at the Sundance Film Festival with mild controversy and lots of interest with "West of Memphis," a brand new documentary on the West Memphis Three with some startling new revelations. For better or worse, a lot of the attenti...Read More »
Some news on two of the top tier female directors-Read More »
Apparently Columbia University's film school doesn't think so. They are holding a panel at their 25th anniversary film festival on May 9 entitled: What Glass Ceiling? The Remarkable Success of Columbia's Women Filmmakers.Read More »
The news from the Hollywood Reporter is that Nanette Burstein (Going the Distance) will direct Unforgiving World a remake of a French film with a script written by writer/director Nicole Holofcener for Focus Features.Read More »
As I watched the Oscars and the Independent Spirit Awards this weekend you could see one clear difference between the two events (aside from the formal dresses and the hosts) -- the presence of female winners. The Oscars followed the usual path and having male winner after male winner, especially i...Read More »
To me a new film from writer/director Nicole Holofcener is a reason to rejoice. One reason is because she unapologetically tells stories from a female perspective. But one would be remiss and quite frankly an idiot to paint her work with the chick flick brush just because her film's are told from ...Read More »


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Top Teachers: Debbie Waldenmaier
Colonial Trail E.S., third grade
As a sixth-grader in Brentwood, N.Y., Debbie Waldenmaier struggled with reading and had difficulty grasping some concepts that didn't involve visual or audible elements. But her teacher spent extra time with her and helped create new ways for her to learn that eventually allowed her to thrive.
As a third-grade teacher at Colonial Trail Elementary School, Waldenmaier prides herself upon her ability to do the same for her students.
Because so many students learn in different ways, she has spent extra effort developing unique lessons for individual students, taking their strengths and weaknesses into account as she does so.
"Her classroom is a hands on, challenging learning environment," one nominator wrote of Waldenmaier. "Her enthusiasm and love of what she does is clear."
To Waldenmaier, her teaching style is a natural extension of who she is.
"I think it comes naturally because of the way that I learn," she said. "I was a very eclectic learner – I needed to touch, see, hear it."
To help her students understand the larger world around them, she has arranged for pen pal partnerships with students in Italy and Niger, Africa – students with whom her own class communicates in writing and through video conferencing.
"We sent candy canes to them for Christmas, we've exchanged DVDs. The experience is so real for them," Waldenmaier said of her students.
Moments of recognition and clarity excite Waldenmaier, who feels at home with third-graders and relishes her role assisting in their transition from students who are learning how to read to students who are reading to learn.
"It's just a wonderful transformation over the course of the year," she said. "They become much more independent."
Last year, Waldenmaier – a 16-year teaching veteran who has spent the past four years at Colonial Trail – earned teacher of the year honors at her school. In November, she was one of several recipients of the REB Award, which is given annually to a select few teachers in Metro Richmond. The $10,000 award will help fund a trip to Greece and Italy this summer, during which she plans to document her visits to the historical sites her students can't quite fathom.
"It's really difficult for them to make the connection that a building was built 2,000 years ago and still exists," she said.
Her trip, she hopes, will make the connection a real one for students in the future. Her classroom message is not unlike her favorite quote from Mother Theresa: "Speak kind words, and you will hear kind echoes."
"We teach them to be good citizens and about the differences between people and accepting people for who they are," she said.
10th annual Filipino Festival coming in August
The 10th Annual Filipino Festival will be held Aug. 7-8 at Our Lady of Lourdes Church, 8200 Woodman Rd., beginning with opening ceremonies at 5 p.m. Friday and continuing with live entertainment, food and exhibits until 10 p.m. On Saturday the festival will take place from 10 a.m. to 10 p.m. with a full schedule of performances featuring traditional Filipino dance, music and song.
Filipino cuisine, including BBQ, pansit, lumpia, adobo, halo-halo, lechon, empanada and leche flan, will be available for purchase. The festival will also feature a children's area, church tours, exhibits, and health screenings. > Read more.
CMoR reopens at new Short Pump site
The Children's Museum of Richmond last week opened its new Short Pump location at Short Pump Town Center, to the delight of children who attended a sneak preview of the location July 10. The new facility, located under the forthcoming LL Bean store (formerly the food court) is 8,500 square feet in size – much larger than CMoR's former Short Pump location at West Broad Village, which opened in 2010. The new space includes The CarMax Foundation Service Station, the Silver Diner, a grocery store, a performance stage and an art studio, as well as a giant Light Bright Wall. > Read more.
Weekend Top 10
The Virginia Hispanic Chamber of Commerce and Henrico Police are both presenting community events tomorrow, Aug. 1. The Feria Community Resource Fair at Richmond International Raceway brings together community service providers, embassies/consulates from Latin American countries, government agencies, nonprofit organizations and corporations that impact the Latino community. The Division of Police's Community Day will feature demonstrations and displays from police, fire, animal protection and sheriff's office, as well as family activities, food, entertainment and more. Other events this weekend include wine, chess and theatre! For all our top picks this weekend, click here! > Read more.
3 community meetings planned about September UCI championship cycling races
Three Henrico students participating in 8-day James River Expedition
CASA volunteers sworn in
Police arrest man in upskirting case
Business in brief
- More News
Print Edition
Jul. 16, 2015Click here to read the print edition.
Weekend Top 10
Minion mania
Weekend Top 10
Weekend Top 10
Weekend Top 10
- More Entertainment
Obituary – Bernice Lauterbach
Obituary – Marion P. Breschel
Obituary – Marian S. Blankenship
- More Obituaries
10th annual Filipino Festival coming in August
CMoR reopens at new Short Pump site
Prince George man wins Walmart Bass Fishing League event in Henrico
- More Community
The greatest love of all
My daughters' other dads
All hail to mothers and the hardest job of all
- More Opinions
Athlete of the Week – July 3: Kayla Sell
Athlete of the Week – June 19: Sydney Whitaker
Steward School's Enright drafted by NY Mets
- More Sports
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ClassifiedsATTENTION DIABETICS with Medicare. Get a FREE talking meter and diabetic testing supplies at NO COST, plus FREE home delivery! Best of all, this meter eliminates painful finger pricking! Call… Full text
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CalendarSt. John's Catholic Church, 813 W. Nine Mile Rd., will hold its annual Summer Fest from 10 a.m. to 5 p.m. The church is accepting applications from vendors, crafters, artisans… Full text


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Are the Twins slowing the maturation of Carlos Gomez by not sending him to AAA?
At only 22 years old Carlos Gomez has already shown he is an elite major league center fielder, where so far this year he has a perfect fielding percentage. In his major league career he has more outfield assists then errors. He has also shown the ability to read the ball well off the bat and use his speed to track down hard to get to balls, making several highlight reel catches. He also has a cannon for an arm.
He is showing signs of having excellent base running skills, or at least the raw speed to bunt for base hits, take the extra base, and steal his way into scoring position. In a game against the Red Sox on Wednesday, he attempted to take home in the 7th inning and seeing that Boston catcher George Kottaras was blocking the plate ready to make the tag, Gomez lowered his shoulder and tried to run right through Kottaras. I am not sure how he held onto the ball, but it was great to see the young Twin playing such hard-nosed baseball. It reminded me a lot of former Twins center fielder Torii Hunter. Carlos Gomez has also been compared to A's great Ricky Henderson.
The problem however, is that he has not been able to hit for average at the major league level. Although he has already hit for the cycle in his young career, a sure sign of his raw talent, he has a career batting average of only .250 and a career on base percentage of under .300. So far this year he is hitting just .225, and that leads to the bigger problem...
With the emergence of Denard Span, hitting .317 on the year, Jason Kubel, hitting .340 on the year, and Michael Cuddyer hitting .330 with 7 home runs in May; there just hasn't been much playing time for Gomez. And what he needs is just that, more playing time. He has only started 25 games this year, several of which where as a result of Delmon Young being on bereavement leave for 9 days. Currently Gomez is being used mostly as a pinch runner and defensive replacement.
I believe that the future of the Twins outfield consists of Carlos Gomez, Denard Span, and Delmon Young. The Twins, in my opinion, would be better served sending Gomez down to thier AAA affiliate, the Rochester Red Wings. That way he would get a chance to get a full slate of in game at bats, and continue to work on his excellent potential on the bases. He would then be able work on things like taking pitches and 2 strike hitting with out it costing the big club a win.
As a minor leaguer in the New York Mets system Gomez saw an improvement in batting average every year, at each level. In 2005 playing A ball he has a batting average of .275 and an on base percentage of .331. In 2006 playing AA ball those numbers jumped to a .281 AVG and a .350 OBP. When he played AAA for 36 games in 2007 he got his average up to .286 and his on base percentage to .363. It appears that with work and regular at bats Gomez has shown the ability to make improvements on hitting.
Hopefully the Twins will give their young outfielders all they will need to reach their full potential, because if these emerging stars continue to progress, the Minnesota outfield could be the envy of the bigs for years to come.


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Chagpori Tibetan Medical
Principal: Dr. Jampa Khedup
Teachers: Dr. Lobsang Choephel and Dr. Tenzin Youtso
Chagpori Tibetan Medical College is at this moment located at Takdah Cantonment, about twenty-seven kilometres from Darjeeling.
The College has been training students since 1992. The students have to complete five years of studies after which they have one year of internship. During the first five years they study the theory and basics of Tibetan medicine and also Tibetan grammar and English.
During the internship period the students are given the opportunity to learn the different aspects of clinical practice and medicine-making. Throughout the entire period emphasis is also on the study and practice of Medicine Buddha rituals and dharma teachings related to healing. These are the important aspects which characterise the Chagpori system of medicine.
The 4th intake of nine Chagpori doctors successfully completed their medical studies. In June 2011 convocation of the Chagpori doctors was held at Chagpori College, Darjeeling. It is the first time to have a batch of only female doctors graduating, in the history of Chagpori.
The fifth intake of twelve doctors successfully graduated in 2014. Presently we have fifteen students enrolled in the sixth and seventh intake of students. We are still looking for sponsors for the students to help us supplement the expenses of their studies.
Qualifications were originally awarded by CTMI and the Tibetan Medical and Astro Institute (Men-Tsee-Khang) which administered the examinations, but now with the current students the final examinations will be supervised by representatives of the Central Council of Tibetan Medicine.
The Governing Board
Chagpori Amchis
Photo Galleries
Dr. Jampa Khedup
New Admission at Chagpori 2015
English version (Word)
Tibetan version (JPEG)


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|« Back to Article
Late surge by Perkins produces starry finish
By Terrence Thomas : May 17, 2014 : Updated: May 17, 2014 11:51pm
Photo By Billy Calzada / San Antonio Express-NewsStars center Jayne Appel, who scored four points, shoots over Tulsa's Vicki Baugh during San Antonio's 80-76 victory in its home opener Saturday night at the AT&T Center.
Photo By San Antonio Express-NewsJayne Appel of the San Antonio Stars saves the ball from going out of bounds during WNBA action against Tulsa in the AT&T Center on Saturday, May 17, 2014.
Photo By San Antonio Express-NewsDanielle Adamsd shoots for three points against Tulsa during WNBA action in the AT&T Center on Saturday, May 17, 2014.
Photo By San Antonio Express-NewsJia Perkins, led the San Antonio Shock with 20 points, shoots agains the Tulsa Shock during WNBA action in the AT&T Center on Saturday, May 17, 2014.
Photo By Photos by Billy Calzada / San Antonio Express-NewsGuard Danielle Robinson drives to the basket on Tulsa guard Skylar Diggins in the Stars' win in its home opener at the AT&T Center.
Jia Perkins, shooting over Tulsa's Roneeka Hodges, had a game-high 20 points, including eight in the final 45 seconds to rally the Stars to victory.
SAN ANTONIO — As Jia Perkins dribbled out on the wing, her team trailing by a point and the clock ticking down late in the fourth quarter Saturday, several things crossed her mind.
She thought about how a day earlier the Stars let a win "slip away" when they faltered down the stretch in a season-opening loss at Atlanta. Even more, the former Texas Tech standout knew how devastating another close loss would be.
Perkins drained a go-ahead 3-pointer over Tulsa's 6-foot-3 forward Glory Johnson with 15.8 seconds left, lifting the Stars to an 80-76 win before 7,665 at the AT&T Center.
"I was just trying to make a basketball play," said Perkins, who tied a game high with 20 points. "Glory was on me, and she's so long that it was going to be hard to take it to the basket. She's probably going to block it. I just tried to size her up and shoot over her."
Tulsa had a chance to tie the game with one second left, but Courtney Paris missed two free throws, the second when she was called for a lane violation. Perkins added two free throws with 0.7 seconds remaining.
"I thought it was a hard-fought game," said Tulsa guard Skylar Diggins, who also had 20 points. "It's a tough one to digest. I wish we could have had a few of those possessions back at the end of the game, but the team fought all the way through, and you have to credit Jia for being able to knock down two dagger threes at the end."
Perkins scored eight points in the final 45 seconds, including the go-ahead three and two clinching free throws. The 3-pointer came only 15 seconds after Diggins made two free throws to give Tulsa a 76-75 lead with 29.8 seconds left.
"It was just a really good basketball game, and I thought our execution at the end was good," Stars coach Dan Hughes said. "I thought our players dug in a little bit. The ability for us to execute and get our shots, and for Jia to knock them down, was big."
While Perkins' 3-pointer was the defining moment in a furious fourth quarter that featured nine lead changes — four in the final minute — and four ties, the impetus for the Stars' comeback started in the third quarter.
Behind the play of Sophia Young-Malcolm and Danielle Robinson — who combined for 11 of their team's final 13 points of the frame — the Stars (1-1) led 59-58 going into the final period. Young-Malcolm had six of her eight points during the stretch, while Robinson chipped in four of her 17.
"I knew my shot was going to take awhile before it was back, so what I tried to do is go out there and hustle and let the game come to me," Young-Malcolm said. "Those kinds of hustle plays are something that builds up that energy, that intensity level.
"It gets everybody all riled up, and you see passion within us."


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• weight room
• gymnasium
• Indoor basketball
• playground
• dance studio
• 26 acres
• nature trails
• meeting & game room
• accessible parking
Cumberland Estates Recreation Center
4529 Silver Hill Drive
Northwest Knoxville
Directions: From I-40, merge onto 640E. Take the TN-62/WESTERN
AVE exit- EXIT 1. Head west on WESTERN AVE. Turn RIGHT onto PALMETTO
RD. Turn LEFT onto LANDON DR. Turn RIGHT onto NEWBERRY RD. Turn LEFT
onto SILVERHILL DR. End at 4529 Silverhill Dr Knoxville, TN 37921-2424,
Cumberland Estates Recreation Center is located in a wooded area of Northwest Knoxville. This recreation center is one of the largest in the City, boasting a full-sized gym, fully-equipped weight room, a dance studio, and meeting/game room.
Cumberland Estates Recreation Center rests on a 26-acre wooded lot, which has an outdoor playground and nature trails.
The following are prohibited in city recreation centers:
1) Possession of firearms and weapons
2) Possession of drugs, alcohol, or any elicit substance
3) Smoking or use of tobacco products
4) Gambling
5) Use of profanity
6) Fighting
7) Dunking or hanging on rims of basketball goals
8) Pets
9) Only indoor court shoes allowed (ex: tennis shoes or non-marking
Violation of these rules or any other rules set by individual centers
may result in suspension from this center and others. Suspension
terms will be set by each center.


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We are here to serve you!
A university-wide undergraduate population of nearly 7,000 students, working in
partnership with faculty, staff, parents, and family members.
To make you feel at
home, we pledge to:
Top Reasons to Visit
2130 Fulton St.San Francisco, CA 94117-1045Tel: (415) 422-5050
Fax: (415) 422-2133Email: email@example.com: @itweetusf
Hours:Monday-Friday 9:00 AM - 5:00 PM


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Bracket MountsRAM Mounting Systems for Portable ElectronicsRAM Mount TAB DOCK-N-LOCK Sync & Lock Cradle for iPad 4
RAM Mount TAB DOCK-N-LOCK Sync & Lock Cradle for 4th Generation Apple iPad w/ Lightning Connector - w/ o Case
DetailsRAM MOUNT TAB-DOCK LOCKING SYNC CRADLE F/ APPLE IPAD 4RAM TAB DOCK-N-LOCK Model Specific Sync & Lock Cradle for the 4th Generation Apple iPad with Lightning Connector WITHOUT CASE
The RAM-HOL-TABDL14U consists of a spring loaded back plate, custom support cups, Uni-Conn docking connector and locking mechanism for the 4th generation iPad with factory lightning connector. The Uni-Conn features a unique design which enables the use of the factory iPad lightning connector for charging as well as other functions. This spring loaded design makes it easy to load and unload your iPad, along with keeping it secure while on the go. Cup ends are designed to optimize the functionality of your iPad, allowing access to audio jacks, usb, power, and other ports, your iPad can be used just as it was intended. Quickly lock the cradle, keeping your iPad secure and safe from theft.
The RAM-HOL-TABDL14U cradle is compatible with the following tablets:
Apple iPad 4 (With Lightning Connector) WITHOUT CASE
- Docking Cradle: Yes
Locking Cradle: Yes
Fits Tablets with Heavy Duty Cases: No
Fits Tablets with Light Duty Cases: No
Fits Tablets without Cases: Yes
Low Vibration Environment: Yes
High Vibration Environment: Yes
Cradle Features:
- 1. Uni-Conn docking connector provides custom connection to the Apple iPad lightning connector
2. Locking mechanism for theft deterrence
3. Support cups contain open slots to accommodate for tablets of various sizes
4. Back plate can support various size support cups
5. Spring loaded tension provides secure support for your tablet
6. Spring loaded cradle allows for quick release of your tablet
7. High strength materials maximize longevity of cradle
8. Full access to all ports
9. Lifetime warranty
High Strength Composite
The "U" in the part number reflects product packaged in poly bag. RAM docks do not include the RAM-B-202U (Round Base & 1" Ball) or RAM-202U (Round Base & 1.5" Ball), required to attach to the dock and RAM mounting system. To insure your mount is "theft deterrent" proof, it is recommended that the RAM-KNOB3LU be purchased; this part attaches to the mount.
- Wrist / Fitness GPS
- Automotive GPS Units
- Handheld GPS Units
- Chartplotters / GPS
- Fishfinders / GPS
- Motorcycle / ATV GPS
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Thursday at 3 on A Juneau Afternoon, Shona Strauser hosts.
We'll hear from Kim Heacox;
Ken Waldman will be here;
Scott Burton will talk with Todd Grebe;
We'll talk with Bonsoir Caitin, the Guest Artists for the 40th Annual Alaska Folk Festival;
And Nancy DeCherney will be here with Art's Up!
That, Writer's Almanac,Bird Note, music and more, Thursday at 3 on A Juneau Afternoon.


text: After watching how the first four games of the playoffs have unfolded between the Clippers and the Grizzlies, it's easy to see why teams put so much stock in having home court advantage. Championship teams will win anywhere, of course, and will find a way to impose their will no matter the venue. But in this series, we've seen the home team put together largely dominant performances, so as things shift back to Los Angeles for Game 5, the Clippers have to hope they can regain their swagger from the first two games, or they know their time in this postseason will be set to expire.


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110 W. New York Ave.
DeLand, FL 32720
Recommends Allebach
posted Aug 7, 2012 - 2:11:30pm
Editor, The Beacon:
I would like to recommend Jeff Allebach for the District 1 County Council seat!
I totally support Jeff, and am asking all my neighbors in District 1 to vote for him. As a former chairman of the Volusia County Council, I know what it takes to do the job, and Jeff has the experience and education to represent us fairly.
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It is therefore probable that Africa was formerly inhabited by extinct apes closely allied to the gorilla and chimpanzee; and as these two species are now man's nearest allies, it is somewhat more probable that our early progenitors lived on the African continent than elsewhere. But it is useless to speculate on this subject, for an ape nearly as large as a man, namely the Dryopithecus of Lartet, which was closely allied to the anthropomorphous Hylobates, existed in Europe during the Upper Miocene period; and since so remote a period the earth has certainly undergone many great revolutions, and there has been ample time for migration on the largest scale.
It is interesting to note that Darwin considered modern humans more closely related to chimpanzees and gorillas, African apes, than to orangutans and gibbons. This must have led him to include us with the African group and consequently to consider us at least as much an ape as the orangutans and gibbons, which had separated previously from a common root. We would therefore be a highly evolved form of African ape. The same resemblance between us and the African apes had been noted previously in 1863 by Huxley (1959): "It is quite certain that the Ape which most nearly approaches man, in the totality of its organization, is either the Chimpanzee or the Gorilla." Nevertheless, this did not lead Huxley to group us in the same taxonomic category with the African apes. Rather, it was they who were grouped with the other great ape, the orangutan, along with the lesser apes, the gibbons, in the same category: "The structural differences between Man and the Man-like apes certainly justify our regarding him as constituting a family apart from them."
The only way that modern humans are included within the group of apes, in which we are considered apes, is if we are more closely related phylogenetically to some of them (the African apes) than to others (the Asian apes). If this were not the case, the apes would form one clade (a natural group with an exclusive common ancestor) and we would form another, the human clade (sister group), connected with them at a lower node. This is what Darwin believed (1871a, p. 197):
If the anthropomorphous apes be admitted to form a natural sub-group, then as man agrees with them, not only in all those characters which he possesses in common with the whole Catarhine group, but in other peculiar characters, such as the absence of a tail and of callosities and in general appearance, we may infer that some ancient member of the anthropomorphous sub-group gave birth to man. It is not probable that a member of one of the other lower sub-groups should, through the law of analogous variation, have given rise to a man-like creature, resembling the higher anthropomorphous apes in so many respects. No doubt man, in comparison with most of his allies, has undergone an extraordinary


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Chiaravalle ("Care-a-volley") Montessori School was incorporated in 1965 by nine couples committed to offering a Montessori education to children in the Rogers Park/Evanston area. The name is taken from the birthplace of Maria Montessori and means "Valley of Light."
From its beginnings in the basement of Bethlehem Lutheran Church the school has grown from a preschool with twelve students to a pre-eminent educational institution, serving children aged 6 months to 14 years.
As it met the community's desire for expanded program offerings, the School moved a number of times. In 1980, it settled into its present location, the historically significant H.H.C Miller Public School building, designed by Daniel Burnham.
In 1973, Parent/Child and Toddler classes were added, full day-care options were enlarged, and the School was able to accept developmentally challenged children. The Elementary program was inaugurated in 1980, coinciding with the final move. At the request of parents, the Middle School program of sixth through eighth grades was added in 1992.
By the mid-1990s, Chiaravalle had achieved full accreditation by the American Montessori Society and the Independent Schools Association of the Central States.
In 1998, Chiaravalle was granted long-term lease with the City of Evanston to remain in its present location. The subsequent $2.5 million, two-year renovation enhanced and updated the facility, adding full handicapped accessibility and major aesthetic improvements to the century-old building.
In 2003, Chiaravalle made additional infrastructure improvements to the infant/toddler floor through the investment of $500,000. The Middle School was moved to rented space at the First Congregational Church of Evanston in 2006, one block from the 425 Dempster Street site.
To ensure that a Montessori education is available for children in Evanston and the surrounding communities, Chiaravalle is working to secure a permanent home. In 2010, Chiaravalle purchased its historic brick building from the City of Evanston. Concurrently, the school launched the Campaign for Chiaravalle: Preparing the Environment, outlining the long-range vision of the schools future and the funding needed to support that vision. The projects begun through the Campaign included purchasing the building and renovating second and third floor classrooms.
In 2012, Chiaravalle extended the lease from the First Congregational Church for the suite of Middle School classroom spaces. This allowed the school to invest in extensive refurbishment of the Middle School.
The Third Teacher + team from Cannon Design has been engaged in the Discovery and Activation phases of the process to re-envision and rebuild the annex space that currently houses our gym and Community Room.
The Town Hall Meeting and Parent Coffees at Chiaravalle October 9 and 12 officially kicked off the project to rebuild our annex.


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This post contains recommendations from a CPL librarian. To get your own customized recommendation, just fill out the May We Suggest form — you can expect results within 10 days. All suggestions can be found on the May We Suggest blog or by liking May We Suggest on facebook.
Look What's In Large Print, June 2012
Angelina's bachelors [Large print]: a novel, with food by Brian O'Reilly; recipes by Virginia O'Reilly
Gabby: [large print] a story of courage and hope by Gabrielle Giffords and Mark Kelly with Jeffrey Zaslow
How it all began [Large print] by Penelope Lively
Need you now [Large print]: a novel by James Grippando
The cat's table [Large print] by Michael Ondaatje
May 31, 2012
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Grand Trunk Silk Sleep Sack Double
Key Features
Adds 10°-12° to your sleeping bag
Natural, breathable silk construction
Attached waterproof stuff sack
Pillow compartment included
Ties included on each side for a snug fit
Our Price $99.99
Availability: Sold Out
- Please note: This item can only be shipped to U.S. addresses.
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Product DescriptionAdding 10°-12° to your sleeping bag, the Grand Trunk Silk Sleep Sack will keep you warm on chilly nights. Ideal for use as a stand-alone sleeping sack when staying in hotels, hostels, inns, etc. Natural, breathable silk provides a luxurious and comfortable sleeping environment. The attached waterproof stuff sack prolongs the life span of your liner and is great for storage. Pillow compartment included. Side/top entrance. For use in any style sleeping bag. Ties included on each side for a snug fit.
• Weight: 1 lb.
• Material: 100% silk


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News, trends and ideas we're tracking today.
Posts filtered on Tag
Bush 43 responds to squabbling over Cheney book — Fox **Update**
Former Secretary of State Condoleezza Rice said this week she resents what she sees as an attack on her integrity by former Vice President Dick Cheney in his just-published memoir, Reuters is reporting. [Read More]


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Dr. Joseph Yavornitzky, Program Director
(440) 826-3539
Learn more about BW's new pre-med track for aspiring primary care physicians.
Baldwin Wallace Establishes Partnership With Lake Erie College of Osteopathic Medicine
Baldwin Wallace University has entered into an affiliation agreement with the Lake Erie College of Osteopathic Medicine (LECOM) that will give BW pre-med students a distinctive new pathway to becoming a primary care physician.
This is BW's second early acceptance medical school partnership under the umbrella of the new BW Primary Healthcare Advancement Program, an exclusive pre-med track linked with BW's Public Health major and focused on fostering aspiring primary care physicians to address a nationwide shortage.
Early Acceptance into Three-Year Medical School Program
Students accepted into the LECOM program will enter a unique "Primary Care Scholars Pathway (PCSP)," a three-year medical school program for primary care physician training-only. Students graduating from the LECOM program will be eligible to practice Family Medicine and Internal Medicine exclusively, and they finish medical school in just three years.
"Another difference in this medical school program is that PCSP combines unique courses with patient case-based directed study modules with very few traditional lectures, so it's suited for students who thrive outside of the traditional classroom setting and are independent in their learning," explained Dr. Joseph P. Yavornitzky, director of BW's Primary Healthcare Advancement Program.
"PCSP is one of only a few three-year programs for physicians in the country," said Richard Ortoski, D.O., LECOM Regional Dean for Clinical Education. "At LECOM we continue to train more primary care physicians than any other U.S. medical school. We look forward to having Baldwin Wallace graduates enter PCSP and take their place among the primary care physicians among our alumni."
Developing Early Assurance Options for BW Students
Yavornitzky said the new LECOM alliance, added to BW's existing affiliation with Ohio University's Heritage College of Osteopathic Medicine, gives students in BW's Primary Healthcare Advancement Program the opportunity to pursue the right "fit" from two distinctive early assurance medical school options. "We are also working to establish agreements with M.D. schools, so each of our students will truly be able to select a medical school that matches their personal mission," Yavornitzky added.
Students who successfully complete the BW Primary Healthcare Advancement program also should be well prepared to take the new MCAT and to compete for admission to any primary care-focused medical school.
About LECOM
The Lake Erie College of Osteopathic Medicine (LECOM) is the nation's largest medical college and is the only Academic Health Center in the osteopathic profession. The Erie, Pa.-based college and Millcreek Community Hospital are at the core of a highly innovative and affordable medical education system preparing the next generation of health care professionals in osteopathic medicine, pharmacy and dental medicine.
Posted June 2014


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- The new Ikusa 12oz gloves from Hayabusa were scientifically engineered for maximum performance for the professional fighter in the ring. Yet, their remarkably versatile design also makes them perfect for speed and heavy bag work in the gym.
- The Ikusa 12oz glove is the standard by which all other professional fight gloves must be judged. Hand-crafted with the exclusive patented Dual-X closure system, these premium gloves provide superior fit, wrist support and striking dynamics.
- And with an ultra-reactive inner core complex and advanced moisture wicking interior lining, you get only the utmost in hand and ligament protection with zero shifting.
- Engineered leather and exclusive inner lining for perfect fit and feel
- Superior to regular gloves for performance and protection
- For competitive use; also for use with speed & heavy bags and pads
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From What A Girl Needs; Simple Song; Embellished Ink; Studio on Fire;
This is my collection of things that catch my eye, from interior design and pretty places to good food and generally quirky cool stuff. Come take a look around, leave me a comment and say hello - I'd love to hear from you! Read more about me
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- Katie's shop
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- Ham Made
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- Mengsel Design
- Poppytalk Handmade
- Famille Summerbelle
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- Mr Wingate
- We Love Kaoru
- To Dry For


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Hold down Control (PC) or Command (Mac) key + mouseclick to select more than one option
Home >
Downtown/Waterfront >
Indian >
Kennedy's Irish Pub & Curry House
Posted by Andy on 05/11/2011
Awesome food. Their parathas and biryani are really good.
Posted by Anonymous on 05/03/2006
Great food, and the ambience is cool, though it smells of Indian food....but isn't that why you're there in the first place!


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Jun 10
Eversave (daily deal site) is selling vouchers for a $4 Meal Deal at Subway today. The $4 Subway meal deal includes a foot-long sandwich, 21 ounce drink, chips and a cookie! That's a $10.50 value.
If you have never signed up with Eversave, you can start by going to Eversave here to create and account and you will get a sign up credit of $3. Thats means you could get this meal deal for $1 after your free credits.
The only bad news, it is only redeemable at the following four Seattle area locations:
3829 Delridge SW
Building C Ste C 205
Seattle, WA 98106, USA
10406 16th Ave SW
Seattle, WA 98146
6760 W Marginal Way SW
Falcon Fast Fuel
Seattle, WA 98106
12500 Lake City Way NE
Seattle, WA 98125


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Disabled Maureen's paint stripper shock
Posted: May 16, 2013|
A DISABLED pensioner had paint stripper thrown over her car, causing £5,000 damage.
Maureen Parker said when she alerted the police to the incident the call operator told her it would send an officer round to take details.
But by the following lunchtime nobody had called at the 71-year-old's Derby house.
So she walked to nearby St Mary's Wharf police station, where she claimed she was left standing for 25 minutes before collapsing in the reception area.
Related content
The force said it had no record of Ms Parker falling at St Mary's Wharf but that it was investigating the crime.
Ms Parker said she believes the chemical was thrown over her car by accident by someone targeting another car on her road.
She said: "The police said they would send someone round and because it happened late on Sunday I didn't expect someone straight away.
"But by the following morning I was waiting and waiting so in the end I thought I'd walk round to St Mary's Wharf myself.
"I got to the reception area and they kept me standing there for 25 minutes. In the end I collapsed and had to be taken to a side room."
The car incident took place in Keys Street at around 9.30pm on Sunday.
Ms Parker, who shares the house with lodger Stephen Mee, said he noticed the damage.
The police were phoned but it was not until the following evening, 24 hours after the damage took place and more than six hours after Ms Parker said she went to St Mary's Wharf, that an officer went round to take statements.
Ms Parker suffered a brain haemorrhage six years ago and is registered disabled.
She said: "I am the oldest of eight children and I'm a fighter. I think the damage was meant to happen to someone else's car and I would say it will cost more than £5,000 to put right. I just think the police might have come round a bit sooner bearing in mind my condition."
A police spokesman said they had an entry on their computer system of Ms Parker attending St Mary's Wharf inquiry office to ask when officers would be attending but it did not say anything about her collapsing.
He said: "Police were called about damage to a car parked outside a house in Derby at around 10.30pm on Sunday.
"The victim did not want to discuss the circumstances on the phone with the call handler and asked to see an officer in person.
"An officer was allocated to attend the following morning but there was a delay due to that officer having to deal with an arrested suspect.
"The victim was visited at home that evening within 24 hours of reporting the crime."


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Can You Guess The Real Housewives' Eyebrows?
guess the eyebrows 062909 m jpg
1 of 5
The Real Housewives have no problem expressing themselves with their mouths, but their eyebrows are another story. A Botox injection here and there has left some of the Housewives with permanent evil brows, or given them a too-high forehead. We thought we'd play a game and see how well you can guess the eyebrows. Tell us your guesses in the comments and click through for the answers.


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Profile created by Parent
29 yrs,
5' 11",
Never Married
, Tamil
, Caste no bar
Masters degree in Engineering/ Technology
Mechanical / Production Engineer
Lives in Detroit, USA
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About him
This profile has been created for our son who is well settled and works for one of the big three auto companies in Detroit.
We are a small happy family of 4, my husband a banker and me a house wife. Our younger son is an industrial engineer working in Bangalore. We believe that a marriage is a relationship between two families. We are looking for a bride with good family values and a mix of modern and traditional views.
We do not have a checklist of expectations in choosing our bride. It would be nice to have someone who enjoys similar interest as our son.
In his own words:
I have had a great bachelor life full of fun, family, friends and good memories. Its time to move on and find that one special person whom I would like to share the good times with.
About me: I am very passionate about my job and I am working hard on building a successful career. I simply love cars and that exactly what I
engineer for a living. I like being ambitious, it keeps me busy and there is always something to look forward to.
I believe every weekend serves a purpose and a majority of them are spent in travel, outdoors, and exploring new places. However once in a while I also enjoy a laid back weekend of cooking a tasty meal and catching up with a movie. I like to experiment - try new stuff in sports, places, cuisine or activities. Eating right and having a healthy lifestyle is very important to me.
What I am looking for is pretty simple, an honest and intelligent person with a positive outlook towards life. I am confident i can brew the chemistry;) Good luck with your search.
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Lives in Detroit, MI, USA (Work Permit)
Grew up in India, USA
Can Speak Kannada, Spanish, Tamil
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his family
Ours is an upper middle class family, originally from Chennai, with moderate values. His father is employed and his mother is a homemaker. He has 1 brother (unmarried).
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Action, Comedy, Documentaries, Drama films, Epic films, Horror, Sci-Fi & Fantasy
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Business casual - semi-formal office wear, Casual - usually in jeans and T-shirts, Trendy - in line with the latest fashion
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22 to 26
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Microsoft Virtual Academy
Get 50% off eBooks plus
40% off print books at
The Microsoft Press Store
Have you always wanted to get started in game development? Here's your chance to learn how to create games from the ground up, using C++ and DirectX. Learn about the game loop, input detection, applying basic shaders, state management, and more. With these skills, you'll be building the engine, not just the game—and you'll up-level your employability options with AAA companies at the same time.
Instructors | Michael "Mickey" Macdonald – Microsoft Technical Evangelist; Bryan Griffiths - triOS College Software Engineer
Related MVA Course(s) | Gaming Engines for Windows 8 Jump Start; Developing Windows Store Apps with C# Refresh; Advanced Windows Store App Development with C# Refresh
This module covers how to implement the main game loop that drives the system forward.
In this module, we explore how to manipulate objects within the game and how to create more instances of them (without all of the overhead of the first instance).
With a basic game loop in place, this module investigates how to set up and manage a larger state system that most games require.
Here, we explore the basics in user input capturing. We then investigate how to apply that input to the various game states and objects throughout a game.
In this module, we cover basic physics and the collision detection methods required to create the gameplay.
With the majority of game elements and systems in place, this module takes a look at how we can apply textures and different shaders to dress up the game objects and menus.
Please peruse this section for additional information that supports this Jump Start event. This is an opportunity for you to dive deeper into platform for C++ and DirectX game development at your own pace.


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dwell products
Ethical Sourcing
dwell are committed to ethical sourcing and we ensure all our product suppliers treat their employees (whether permanent, temporary or migrant) fairly and with respect for their basic human rights.
We have long-standing relationships with many of our suppliers and these relationships not only ensure that we get the quality we expect; they also give us the satisfaction and surety that all employees are being well-treated.
All dwell suppliers are assessed against Ethical Standards and Quality Procedures. This assessment includes our minimum expectations on pay, working hours and workers rights and an absolute ban on child labour and under age workers. We call this the dwell Code of Conduct and it consists of 8 critical failure points. A supplier must meet all of the critical failure points in order to start business with us. In some cases, we will even work with suppliers to improve both conditions for employees and quality as necessary.
dwell are also committed to sourcing sustainable materials and our products are created using wood which has been legally logged from sustainable forests. Where possible, we purchase FSC approved materials and products that contain FSC approved materials are highlighted throughout our website. Where we cannot purchase FSC approved materials we ensure that we know, with 100% clarity, that the materials do come from a sustainable source.
dwell Environment
We work hard to limit the amount of waste we send to landfill and we recycle all waste cardboard and metal at our distribution centre. We have a number of clearance stores where we can sell on damaged product instead of disposing of it.
We have our own fleet of delivery vans and lorries. They use the latest in computerised route planning to ensure any collections are made on the same trip and reduce the amount of fuel used. Each of the vehicles uses AdBlue™ technology which greatly reduces the release of CO2 emissions into the environment.