text:
Curriculum & Common Core
Updated March 31, 2011
* Notes new items with latest upate
Social studies is the integrated study of the social sciences to prepare young people to become responsible citizens.
The purpose of social studies is to develop social understanding and civic efficacy (the readiness and willingness to assume citizenship responsibilities and to make informed and reasoned decisions for the public good as citizens of a democratic society).
The social studies curriculum builds four capacities in young people: disciplinary knowledge, thinking skills, commitment to democratic values, and citizen participation.
CLICK HERE to navigate to the Michigan Department of Education Social Studies site. (Website)
Click the links below for faster navigation
MC3 Grade Level/Course Google Discussion Groups
Connect with other Social Studies teachers who use MC3 across the state:
MC3 Update
Social Studies Network Meetings - Setup to meet one Monday a month after school (secondary/middle school 3:30 - 5:00 and elementary 4:30-6 PM), these meetings are designed to provide Social Studies teachers with an opportunity to develop a better understanding of the content expectations, programs that may used to supplement curriculum, and strategies and techniques used across the county/state. Teachers will also have time to plan and "network" with other teachers in similar grade levels/courses. Please bring lesson plans, textbooks, and other resources to each meeting so that you will be able to plan and develop lessons based on what is shared at the K-12 discussions and other dialogue with your colleagues.
MDE K-12 Alignment Documents - These are the GLCE clarification documents for each grade level K - 12.
- MDE PowerPoint for Alignment Project - Use this PowerPoint with the above link to clarify the format and codings used for each content expectation.
Reosurces for all in one place! - This site is through Nystrom, but it porvides links to many different resources separated by Content Area within Social Studies.
Great Migration Resource - This document correlates GLCE's in Science and Social Studies that center around Nation Geographics work on The Great Migration.
Document Based Questions Project - The following standards from the National Core Curriculum document http://www.corecurriculum.org are supported by the implementation of the Document Based Question (DBQ) Project http://www.dbqproject.comin English Language Arts and Social Studies classrooms, grades 4-12. DBQ Project is a well-developed strategy that provides students in-depth interaction with primary and secondary source historical documents about American and World History events and issues. DBQ is especially powerful and meaningful for student learning when English Language Arts and Social Studies/History teachers collaborate in curriculum integration.
Great Timeline Site - This site provides timelines for people and events. Maps are also available. Great to use with students individually or large group.
6th and 7th Grade Capstone Project Clarification - MDE clarification document (Word Document)
MC3 Unit and Lesson Plans - This resource is the result of a combined effort of many teachers and ISD consultants that came together under the MCCC (Michigan Citizenship Collaborative Curriculum).
MC3 Grade Level Google Discussion Groups: Connect with other Social Studies teachers who use MC3 across the state:
K-4 Skills/Concepts Overview (Word Document)
Social Studies Content Expectations (K-8) are now available on line!
*NOTE - this PDF file may take several minutes to open, please be patient.
Social Studies
Content Expectation Resource
Alignment Chart
Social Studies Toolkit Link (K-8) are now available to help with the alignment of the GLCE's. (Website)
1st Grade GLCE Clarification - May 2008 (Word Doc.)
4th Grade Resources (Word Document)
GLCE & HSCE Clarification (April 14, 2008). (Word Document)
Unpacking the Expectations for Classroom Assessment & Instruction - Created by Stan Masters - Lenawee ISD (PPT)
MEECS Project - The Department of Education has finished the alignment of the five Michigan Environmental Education Curriculum Support (MEECS) units to the GLCE's and HSCE's
5th Grade African GLCE's Resource - The attached document outlines a variety of resources that are available on the Charles H. Wright Museum of African American History's new educators' web page, the African American History Teaching and Learning Modules are specific to Grade 5.
4th Grade Regions Resources - This is a link to a website that Stan Masters from Lenawee ISD and Maggie Patterson from Nystrom worked collaboratively on this Spring.
Social Studies in Michigan Site - This site is designed to help you be an even more effective social studies educator in the great state of Michigan. Stay in the loop on relevant policy news, and find easy to use teaching strategies (with a little fun along the way). Please add your advice and thoughts by leaving a comment after a post. We can always learn from each other!
MISSION US Online Game - Take young learners on a virtual adventure into American History with Mission US, the "revolutionary" multimedia project previewed at the 2010 Celebration of Teaching & Learning.
Mission US is a free, new interactive adventure game series designed to improve the understanding of American history by students in grades 5 through 8. The project website includes a vast suite of classroom resources.
MDE K-12 Alignment Documents - These are the GLCE clarification documents for each grade level K - 12.
- MDE PowerPoint for Alignment Project - Use this PowerPoint with the above link to clarify the format and codings used for each content expectation.
MiVote Resources - MiVote is designed for High School Civics/Social Studies students to motivate them to become informed about political issues and participating in the political process. Participating in MiVote allows students to become engaged in the political process and provides a real life experience in how to research issues and voice their opinions on issues using 21st century technology to inform and influence others. The following suggested activities are designed to help students gain background knowledge and develop their own voice and viewpoint regarding political to participate in MiVote.
Timing: 3 to 4 class periods: Times are written for 70 minute class periods. Click here for the unit plan.
MC3 Unit and Lesson Plans - This resource is the result of a combined effort of many teachers and ISD consultants that came together under the MCCC (Michigan Citizenship Collaborative Curriculum).
MC3 Course Google Discussion Groups: Connect with other Social Studies teachers who use MC3 across the state:
Pacing Guides for High School Courses - These were developed by Roy Sovis (Social Studies Coordinator - Genesee ISD) based on the MC3 curriculum.
Reosurces for all in one place! - This site is through Nystrom, but it porvides links to many different resources separated by Content Area within Social Studies.
Great Timeline Site - This site provides timelines for people and events. Maps are also available. Great to use with students individually or large group.
High School Content Expectations are now available. (PDF)
WWI Online Resources (Word Doc.)
MEECS Project - The Department of Education has finished the alignment of the five Michigan Environmental Education Curriculum Support (MEECS) units to the GLCE's and HSCE's
National World War II Museum Website - Great site for teachers and students that includes a narrated virtual tour of the musuem and virtual field trip videoconferences just to mention a few of the great available resources.
World History Support Site - Bill Strickland, a World History & Geography teacher at East Grand Rapids High School and a highly respected leader in the Michigan WHG community, has started a social network specifically for WHG Teachers on Ning.com. It's goal is to share WHG teaching strategies and resources.
Other Online Resources
If there are other sites/resources you think would benefit others, please e-mail email@example.com with the information and we will get them added to the list below.
Literature Books for the Core Democratic Values
- Literature Book List - This is an everchanging list that I am compiling, so if you have additions please e-mail your suggestions to email@example.com. Remember, any of these books can be used at ANY level to present examples of the the Core Democratic Values. Yes, picture books can be used at the high school level.
Michigan Supreme Court Site - This site allows teachers access to the Learning Center which has information about the GLCE's/HSCE's, curriculum materials, tours, and special events.
Justia - the Michigan Supreme Court Learning Center's e-newsletter for educators.
"Our Courts" Game Site - Great for students of all ages to play games testing their civics knowledge (Try the "Do I have a Right?" game, be careful it is addicting).
CNN for Students - This link provided by Shelley Mannor from Vandercook is a ten minute newscast updated daily, geared to students. It is applicable for grades 6-12 based on the changing news topics of the day. Also, safe as far as profanity/violent content that can be problematic with other news sites.
This Day in History - This History.com link provides a daily 2 minute(ish) video about the events in history for each day, with previous days archived for reference.
The History of the World in 4 Minutes
Cost of Life - This website allows students the opportuity to experience life and the choices that have to be made in a third world country. This is through the UNICEF website.
Civics Resource - This site was recommended by a high school teacher at the last network meeting. It is a resource for ALL levels that provides lesson plans and many other resources.
Project Citizen - This program allows students an opportunity to reserach real world problems/issues and to take the appropriate steps to make change.
World History for Us All - Great website to get information and resources on the different eras. This site was instrumental in the development of Michigan's Conetent Expectations.
Dancing Around the World - Kelli Sweet used this website in the 6th and 7th grade workshop. It is a fun link that shows people dancing from all over the world.
Discovery Site - This site is from Discovery.com where you can search by course or subject and/or grade level for lessons and resources.
The League.org - The LEAGUE brings together Learning and Doing to empower young people to get in the Game of Giving. Students and schools earn points by participating in service events.
Learning to Give.org - The curriculum division of The League. The world's leading developer of lessons and resources that teach giving and volunteerism, civic engagement, and character through service learning.
http://www.gilderlehrman.org/ - This link has great resources for Teachers and Students (Several different lectures available through an audio download in addition to many other great offerings).
Digital Storybook Software Download - This link is for a program (Celtx) that allows for the creation of digital storybooks.
Software and Instructional Support - This link (www.tech4learning.com) has a variety of resources for teachers.
TV From Around the World - This site provides links for TV in over 100 different countries where students can choose by topic (News, entertainment, sports, weather).


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The history of the Fung Ping Shan Library dates back to 1929, when the late Mr. Fung Ping Shan (1986-1931) donated a building to the University of Hong Kong to be used as a Chinese Library. Sir William Peel, then Governor of Hong Kong and Chancellor of the University, opened the Fung Ping Shan Library on 14 December 1932. Since that time, Fung Ping Shan Library has served not only the University and the Hong Kong community but also scholars from different parts of the world.
Fung Ping Shan Library has a focus in oriental languages, principally Chinese, with other East Asian Language materials including Japanese and Korean. As at 30 June 2014, the Library had a stock of over 1.05 million volumes, more than 13,000 periodicals titles and some 170 Chinese newspapers from Mainland China, Taiwan, Japan and Southeast Asian countries. Its collections also consisted of 5,400 titles of microfilm, more than 1,000 microfiche titles and 20,000 items of audio-visual materials. Of growing importance is its digital collection, comprising key Chinese online databases such as Scripta Sinica Database, Chinese Classic Ancient Books, Sikuquanshu, China Journal Net, China Yearbook Database, China Doctor Dissertations Database, China Reference Works Online, China Infobank, WiseNews, Duxiu, Chinamaxx Digital Libraries, SuperStar Digital Library and Apabi Digital Library, etc.
Collection highlights:
- Rare books
The Library's collection of rare books (published in or before the year 1795) is one of the largest in Hong Kong. It comprises more than 700 titles in 14,000 volumes, including 4 Song Dynasty editions, 18 Yuan Dynasty editions, as well as block prints from Ming Dynasty and manuscripts from Qing Dynasty.
- Genealogical materials
About 400 titles, most of them from clans in Guangdong and Hong Kong, are available. These are highly valuable primary sources for studying the history of Hong Kong and the region.
- Stone rubbings
A notable part of the collection is some 1,500 pieces of rubbings engraved during the early 1900s. The Library acquired the collection from a private collector in the 1960s
- Periodicals and newspapers
About 13,000 periodical titles, of which more than 1,200 are current, are in the collection. The Library is notably rich in its collection of periodicals on literature, history, fine arts and archaeology published between the 1900s and Sino-Japanese War, as well as publications of government departments and academic institutions in Guangdong during the Republican period.
More than 170 titles of print Chinese newspapers are available, including a variety of pre-1949 titles and thirty current titles. Some 100 titles of Mainland newspapers are in microfilm. Full-text newspapers, including two from Taiwan and eleven from Mainland China, are also available online.
- Taiwan Research Collection
Established in 2000 with the objective of supporting teaching and research activities in Taiwan studies, Taiwan Research Collection comprises publications relating to political, economic and social development of Taiwan, mostly published by the government.
Some 10,000 local gazetteers and over 200 titles of seal impressions are also available in the library collection.
Library Classification Schemes
1.Fung Ping Shan Library Classification System, a hybrid system of Dewey Decimal Classification (DDC), Lai Yung-xiang (Lai), and a number of local adaptations was used to classify library materials before 15 April 2002. A typical call number comprises a location code and Arabic numbers:
2. The Library of Congress Classification (LCC) System has been used to classify library materials since 15 April 2002. LCC numbers utilize alphanumeric system. Below is an example:
3. Doo Ding-U's Book Classification Scheme was used before the adoption of Fung Ping Shan Library Classification System in the 1960s. Books classified by the Doo Scheme are called 杜Collection and housed in the Storage.
All monographs in open stack are using LCC. See the Library of Congress website (http://www.loc.gov/catdir/cpso/lcco/) for detailed LCC list. Serials currently classified by the Fung Ping Shan Library system will be re-classified using LCC very soon. Click here for the mapping table between the Fung Ping Shan Library System and LCC System.
Fung Ping Shan Library's catalogue was fully automated in 1997. The online catalogue displays bibliographic information of an item such as title, name of author/editor, edition, publication place, publisher, publication year, pagination, location symbol, classification number, barcode, subjects, etc. Please note that:
- Author and title heading
Apart from headings of personal author/editor, entries such as associations, enterprises, conferences, academic institutions and government bodies are also included.
Examples :
Zhongguo ke xue yuan
Quan guo sheng wu hua xue xue shu hui yi (1st : 1960 : Shanghai, China)
Hong Kong (China) Education Dept.
Taiwan yin hang
- Subject headings
Most records catalogued before April 2002 in the Library have Chinese subject headings. Subject headings indicate the content of items and can be further subdivided.
Items catalogued after April 1996 are assigned with Library of Congress subject headings.
Example :
Literature--Study and teaching
- Location symbol and classification number
Location symbol indicates the location of an item while classification number reflects its subject content. Location symbol, classification number and author number together form a call number that decides where an item is to be shelved.
Materials of Fung Ping Shan Library are either shelved in open stack or closed stack. Readers can access items on open stacks by themselves while closed stack items can be retrieved by submitting a completed loan form to the G/F Lending Services counter or 1/F Special Collections counter.
- Open stack collections
Location symbol Nature Shelving Location 中 Ordinary books 5F, 6/F R Reference books 5/F 大R Large reference books 5/F 大A Large books 5/F 臺 Taiwan research collection 5/F 臺期 Taiwan research collection periodicals 5/F 期,大期 Periodicals, Large periodicals 4/F, 5/F BC Recreational reading G/F CMF, CMPT Microform 1/F Special Collections av, avs Audio-visual materials 1/F AV & Reserve
- Closed stack collections
Location symbol Nature Circulation Procedure 特P Photocopies of theses Request at 1/F Special Collections Counter 地圖 Maps 羅 Lo Hsiang Lin Collection 善 Rare items 特 Special Collection 特C Chan Kwan Po Collection 特山 Pre-1912 books 特期 Pre-1950 periodicals 杜* Pre-1950 books 大 Pre-1950 large books G/F Lending ServicesCounter Bound newspapers RD Reference CD-ROMs, databases Register for use at Information Counter (3/F., Main Library) 山 Ordinary books Request at G/F Lending Services Counter 山大 Ordinary large books 山A Accompanied materials X中 Collections at Storage Complete the HKUL Storage Collection Request e-forms. X山 X杜* XR X大A X大R 期, 大期 Periodicals, Large periodicals
* 杜 is used in the OPAC for identification only and will not be shown on the label of an item.
Some Chinese/Japanese/Korean materials are located at the following locations according to their content and nature:
Location Symbol Branch/Location D, D期, DR, DBC Dental Library E, E期, ER, EX Education Library HK, HKC, HKLB, HKS, HKP Hung On To Memorial Library 法, 法期, 法R, 法av Lui Che Woo Law Library 農, 農R Kadoorie Agricultural Research Centre 音, 大音, 音期, 音R, 大音R Music Library 醫, 醫期, 醫R, 醫BC Yu Chun Keung Medical Library
Newly Catalogued Items
Most of the newly catalogued items will be displayed on the New Books Shelves on Ground Floor for one week. Display is changed every Wednesday. Users can also browse the addition lists on the Libraries' webpage.

subset: commoncrawl


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Lynn Little
College of Science & Mathematics
» Dean
» Professor
Contact firstname.lastname@example.com
My Websites
|Course #
|Course Name
|Days / Times
|Spring 2013
|Virology Seminar
|Bolin Hall 212
|Graduation Date
|The University of Texas at Arlington
|B.S. - Biology
|1965-5-31 0:0:0
|University of North Texas
|M.S. - Biology
|1968-1-31 0:0:0
|The University of Texas Southwestern Medical Center
|Ph.D. - Microbiology
|1981-6-8 0:0:0
|Harvard Medical School
|Postdoctoral Fellowship
|1983-7-31 0:0:0
|The University of Texas at Dallas
|M.B.A. - Master of Business Administration
|1995-8-25 0:0:0
|The University of Texas School of Public Health
|M.P.H. - Master of Public Health
|2008-5-2 0:0:0
|Start Date /
|End Date
|The University of Texas Southwestern Medical Center
|Chairman, Department of Medical Laboratory Sciences
|Howard Payne University
|Dean, School of Science and Mathematics
|Midwestern State University
|Dean, College of Science and Mathematics
Little, L.M. 2005. Managerial problem solving and decision making. Module 2 – Unit 5. MT 5442 Management,
UT Southwestern/Blood Systems Laboratories Online Blood Bank Technology Program.
Little, L.M. 2005. Management functions. Module 2 – Unit 4. MT 5442 Management, UT Southwestern/
Blood Systems Laboratories Online Blood Bank Technology Program.
Little, L.M. 2004. Leadership versus management: understanding the differences. Tech Sample – Management
and Education Series, No. MGM-5. American Society of Clinical Pathologists, Chicago, IL.
Little, L.M. 2002. Using the fundamental leadership process to develop your leadership skills. Tech Sample
– Management and Education Series, No. MGM-5. American Society of Clinical Pathologists,
Chicago, IL.
Little, L.M. and D. M. Harmening, 2000. Pioneering allied health clinical education reform: report of a
national consensus conference. J. Allied Health 29:171-176.
Little, L.M., 2000. Essential functions of the supervisory process. Tech Sample – Management and
Education Series, No. MGM-5. American Society of Clinical Pathologists, Chicago, IL.
Little, L.M., 1995. Pathogenesis of infectious disease. Clin. Lab. Sci. 8:44-49.
Shannon, D., and L.M. Little, 1994. Evaluation of medical technologists' interest in attaining certification as
specialists in blood bank. Clin. Lab. Sci. 7:289-291.
Rawlings, J.A., L.B. Elliott, and L.M. Little, 1985. Comparison of latex agglutination procedure with the
microimmunofluorescence test for Rickettsia typhi. J. Clin. Microbiol. 21:470-471.
Whittenburg, R.A., M.A. Roberts, L.B. Elliott, and L.M. Little, 1985. Comparative evaluation of commercial
rubella virus antibody kits. J. Clin. Microbiol. 21:161-163.
Little, L.M., J. Zavada, C.J. Der, and A.S. Huang, 1983. Identity of HeLa cell determinants acquired by vesicular stomatitis virus with a tumor antigen. Science 220:1069-1071.
Little, L.M., G. Lanman, and A.S. Huang, 1983. Immunoprecipitating human antigens on the surface of vesicular stomatitis virus grown in HeLa cells. Virology 129:126-136.
Little, L.M., and J.A. Shadduck, 1983. Pathogenesis of rotavirus infections. Prog. Food Nutr. Sci. 7:179-187.
Little, L.M., and J.A. Shadduck, 1982. Pathogenesis of rotavirus infection in mice. Infect. Immun. 38:755-763.
Davis, L.E., R.E. Lynch, L.M. Little, R. Steward, J.W. Neuman, D.K. Ziegler, and T.D.Y. Chin, 1971. Viral infections in multiple sclerosis patients on low-dose immunosuppression. Neurology 21:765-768.
Vance, B.D., and L.M. Little, 1971. Effects of phytohormones on the growth and
morphology of Escherichia coli. Tex. J. Sci. 22:187-197.


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(A) No person shall operate any motor vehicle or vehicle or ride any APV, snowmobile, bicycle, dog sled, or horse within any state forest except over and upon roads, trails or other facilities designated and provided and posted for such purpose unless authorized by the chief or his authorized agent.
(B) No person shall cause a motor vehicle or vehicle, dog sled, bicycle, APV, snowmobile or horse to be operated or lead in a careless, negligent or reckless manner.
(C) This rule shall not restrict the use of a motorized wheelchair or scooter by a person who is non-ambulatory in any area open to the public and where not otherwise restricted for safety purposes, resource protection, or by designation of the chief or authorized agent.
Eff 9-16-74; 7-16-95;
Rule promulgated under: RC 119.03
Rule authorized by: RC 1503.01
Rule amplifies: RC 1503.01
R.C. 119.032 review dates: 02/17/2009 and 02/01/2014


text:
Department of biochemistry and Molecular biology
Ala Bielawska, PhD
Research Professor
Biochemistry and Molecular Biology
2001-Present Director, Lipidomics Shared Resources, MUSC
2000-Present HCC Member, MUSC, Charleston, SC
1998-2007 Research Associate Professor , Dept of Biochemistry and
Molecular Biology, MUSC
1993 Assistant Professor, Duke University Medical Center
1990 Postdoctoral Fellow, Duke University Medical Center
1978 Postdoctoral Fellow, Faculte Chimique Univ. P. Sabatier, France
1975 Ph.D., Technical University of Wroclaw, Wroclaw, Poland
1969 M.S., Technical University of Wroclaw, Wroclaw, Poland
Contact Info
Email: email@example.com
Office: 843-792-0273
Lab: 843-792-7726/ 843-792-8853
Fax: 843-792-6080/ 843-792-1627
Research Interests
Research focuses on lipid synthesis, analysis and therapeutic application of novel bioactive molecules targeting sphingolipid metabolism. Current research interest relates to organelle-targeting sphingolipids and organelle-targeting inhibitors of sphingolipid metabolizing enzymes concentrating on mitochondria and lysosomes. Lipidomics Shared Resource at MUSC, directed by me, provides conceptual and practical training in various aspects of lipidology, qualitative and quantitative analysis of lipid components from different biological materials, synthetic molecular tools to study lipid metabolism and assists investigators in experimental design, selection of lipid of interest and interpretation of the analytical results. Analytical approach is based on High Performance Liquid Chromatography-Tandem Mass Spectrometry (LC-MS/MS) technology.
Recent Publications
Perera MN, Ganesan V, Siskind LJ, Szulc ZM, Bielawski J, Bielawska A, Bittman R, Columbini M. (2012) Ceramide channels: Influence of molecular structure on channel formation in membranes. Biochim Biophys Acta 1818 (5):1291-1301. PMID: 22365970
Perera MN, Lin SH, Peterson YK, Bielawska A, Szulc ZM, Bittman R, Colombini M. (2012) Bax, Bcl-xL exert their regulation on different sites of ceramide channel. Biochem J 445(1):81-91.
Separovic D, Nicholas J, Breen P, Bielawski J, Pierce JS, Van Buren E, Bhatti G, Saad ZH, Bai A, Bielawska A. (2011) Combining anticancer agents photodynamic therapy and LCL85 leads to distinct changes in the sphingolipid profile, authophagy, caspase-3 activation in the absence of cell death, and long-term sensitization. Biochemistry and Biophysical Research Communications 409(3):372-377.
Hu X, Yang D, Zimmerman M, Liu F, Yang J, Kannan S, Burchert A, Szulc Z, Bielawska A, Ozato K, Bhalla K, Liu K. (2011) IRF8 regulates acid ceramidase expression to mediate apoptosis and suppresses myelogeneous leukemia. Cancer Res 71(8):2882-91. Epub 2011 Apr 12
Hou Q, Jin J, Zhou H, Novgorodov SA, Bielawska A, Szulc ZM, Hannun YA, Obeid LM, Hsu YT. (2011) Mitochondrially targeted ceramides preferentially promote autophagy, retard cell growth, and induce apoptosis. J Lipid Res 52(2):278-88. Epub 2010 Nov 16.
Separovic D, Saad ZH, Edwin EA, Bielawski J, Pierce JS, Van Buren E, Bielawska A. (2011) C16-ceramide analog combined with Pc4 photodynamic therapy evokes enhanced total ceramide accumulation, promotion of DEVDase activation in the absence of apoptosis, and augmented overall cell killing. J of Lipids 2011:713867.
Szulc ZM, Bai A, Bielawski J, Mayroo N, Miller DE, Gracz H, Hannun YA, Bielawska A. (2010) Synthesis, NMR characterization and divergent biological actions of 2-hydroxy-ceramide/dihydroceramide stereoisomers in mCF7 cells. Bioorg Med Chem 18(21):7565-79. Epub 2010 Jul21
Hammad SM, Pierce JS, Soodavar F, Smith KJ, Gadhan MM, Rembiesa B, Klein RL, Hannun YA, Bielawski J, Bielawska A. (2010) Blood sphingolipidomics in healthy humans: impact of sample collection methodology. J lipid Research 51(100):3074-87. Epub 2010 Jul 21.
Bielawski J, Pierce JS, Snider J, Rembiesa B, Szulc ZM, Bielawska A. (2010) Sphingolipid analysis by high performance liquid chromatography-tandem mass spectrometry (HPLC-MS/MS). Adv Exp Med Biol 688:46-59. Review. PMID: 20919645


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Hang tight!
Recipe by NomNom
"An awesome traditional favorite to have at every cookout or holiday table. These smokey, sweet beans are great with a variety of meats and are a wonderful addition to any meal. This is a great side dish your sure to love!"
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1 tablespoon
1 small
onion, diced
1/2 pound
1 (28 ounce) can
baked beans (such as Bush's Original®)
2 teaspoons
Worcestershire sauce
1 tablespoon
1 teaspoon
prepared yellow mustard
1 cup
brown sugar, divided
Used this as a base recipe and really enjoyed it. I was asked to make 20 servings of baked beans for a child's party. I used 2 (55 oz each) cans and 1 (28 oz) can of Bush's Original baked beans, 4 packages of Oscar Meyer bacon crumbles (the ones in the bag near the croutons, salad dressing, etc.), 1 large onion (minced fine), 1 1/2 cups of brown sugar (which was plenty), 3 1/2 Tbsp of ketchup, 1 1/2 Tbsp of mustard, 1 3/4 Tbsp of Worcestershire and added 1 1/2 - 2 tsps. of Liquid Smoke along with 1 tsp of garlic powder and 1 tsp of black pepper. Cooked in the slow cooker on low for 4 1/2 hours then switched to warm to keep them hot for the party. Everyone loved them. I will definitely make these again for family gatherings!
I thought these tasted pretty good, but very sweet. I even used two cans of baked beans and didn't double the sugar and they were still too sweet. I used store brand baked beans and I do not recommend doing that as they were very runny right from the beginning, which made for runny finished beans. I think I would use this recipe as a base next time to make baked beans to suit my personal taste
49 Ratings
DELICIOUS recipe. I double the recipe to make it a main dish and it was a hit. There was only 1/4 of the casserole left over. I added more ketchup & mustard to make it more moist. I used hamburger instead of bacon. I didn't get to use Worcestershire sauce, because I did not have any. That didn't matter to the family. I topped it off w/ cornbread batter on top of the casserole the last 15 minutes and baked some more until cornbread was done. I wanted to use Pillsbury Biscuits, but didn't have any :-) Great recipe and thanks for sharing. It was nice having something new at the table.
Excellent baked beans. I made bbq ribs, mashed potatoes and these beans. The beans were everyone's favorite. I didn't measure anything, but otherwise didn't make any changes to the recipe
7/2/15 update: I have been making this for parties on Memorial Day, 4th of July, etc. for several years now. I love the recipe as-is, but have found that adding some cooked ground beef adds an excellent twist. I discovered this one year when I had too many burger patties. I just grilled a couple of the extras and through it in the beans with the bacon. Very tasty!
I give this 5 starts b/c it's delicious! Even when I accidentally put 1 tablespoon of mustard in instead of teaspoon and no bacon b/c I didn't have any. It is very, very tasty! I say try it, next time I will add the bacon.
Used this recipe at a Sunday family luncheon. It was easy and oh so good! Everyone enjoyed. Will definitely use again and again.
So easy, so good! I only used 3 slices of bacon and it was amazing. Thanks for a great and easy recipe.
This was great! Tasted yummy and pretty easy to make even for me. I wouldn't change a thing. It did seem like a lot of work for what you can buy in the store, but I think it tasted a bit better than the store. Oh and I used turkey bacon. Just as good.
* Percent Daily Values are based on a 2,000 calorie diet.
3BC (Best Baked Bean Casserole)
Serving Size: 1/6 of a recipe
Servings Per Recipe: 6
Amount Per Serving
Calories: 355
Calories from Fat: 68
We have over 100 cucumber salads to help you keep your cool.
Meatloaf is the hearty, family-pleasing meal that makes the greatest leftovers ever.
Delicious recipes, party ideas, and cooking tips! Get a year of Allrecipes magazine for $7.99!
A shortcut recipe for green bean casserole you'll want to have.
See how to make super quick-and-easy baked beans.
See how to make classic French onion and green bean casserole.


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Hold down Control (PC) or Command (Mac) key + mouseclick to select more than one option
|Avg. Dinner Entrée
|Greater than $25
|$18.01 - $25
|$12.01 - $18
|$7.01 - $12
|Less than $7
Posted by Rod on 01/16/2015
All the construction issues must be very challenging for your restaurant but we had no problem getting in and out with some delicious take-out. From Fairless Hills it is super easy and well worth it. Thanks so much for staying open while the bridge is under construction. Yummy Food!
Posted by Anonymous on 11/16/2014
Best Chinese food I've ever had. Service is great. Portions are big. Excellent menu and great value.Very different and much, much better from the regular Chinese restaurants.
Posted by Claudia on 02/21/2014
Food and service is great. Love the walnut shrimp! Went to pick up an order with two babies in the car and they brought it out for me ! I don't know any other place that would give me that service.
Posted by Rich from Langhorne on 12/24/2012
I'm lucky enough to live 1/2 mile from Chinatown Cafe. Absolutely the best Chinese food I have ever had. For a special occasion, order the Peking Duck for 4. Marvelous duck along with several other platters, enough to feed at least 6 people, and all so delicious. Will order it for our Christmas dinner tonight, yum!
Posted by ag19 on 10/27/2011
After 6 years living in Bucks county, I finally found my favorite Chinese restaurant. It's a small restaurant, but the food is excellent. Their roasted duck is no difference than the one you normally have in a China town restaurant in Philadelphia, and is way better than the one served in all Chinese restaurant in central NJ. The fried dumpling is my daughter's favorite appetizer. All dishes come with a good portion. I have been there several times, and every time I can find something new that I like and would come back for.
Posted by Kelly on 12/23/2010
I have been eating Chinese for 50 years and I have never tasted Wonton soup so delicious. The Won Tons melt in your mouth. The steamed dumplings are hand made and hand rolled right there by the chinese mom. The Price is right too!
Posted by anonymous on 12/02/2010
Friendly owner and waitress. Food is great! Try the duck, roast or peking duck. Seafood hotpot, salt and pepper spare ribs, Singapore noodles, all very authentic chinese dishes.


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A mechanism for accurately mounting a large area semiconductive device within a larger system is disclosed. The semiconductive device, formed by the linear abutment of semiconductive sub-units divided from a larger semiconductive wafer must be accurately positioned to enable the operation of which it was intended. In one embodiment, the sub-units are thermal ink jet arrays which are abutted to form a pagewidth printhead. The semiconductive device includes a reference plate or substrate having a generally planar surface for mounting an array of functional sub-units thereon. The semiconductive device further includes two or more individual sub-units which are also affixed to the planar surface, thereby forming alignment pads for the assembled semiconductive device. When incorporated into the system, the alignment pads are received by frame members or alignment points to provide positive alignment of the reference plate, and the attached array of sub-units, within the system.
1. An apparatus having a large area semiconductive device which is positioned to operate with respect to a target, said semiconductive device being formed by linear placement of functional sub-units, each functional sub-unit having a planar semiconductive substrate with an array of active elements, and supporting circuitry on a first surface thereof, said functional sub-units having been divided from a larger semiconductive wafer, comprising:
a reference plate;
a plurality of said functional sub-units affixed to said reference plate to form a linear array of sub-units thereon;
at least two locating sub-units affixed on opposite ends of said reference plate to form alignment pads thereon; and
means, located within the apparatus, for receiving said alignment pads in order to align said reference plate and the affixed linear array of sub-units in at least one dimension with respect to the target wherein the first surface of the functional sub-units is unobstructed by the receiving means.
2. The apparatus of claim 1, wherein said plurality of sub-units affixed to said reference plate form an array of abutted sub-units.
3. The apparatus of claim 1, wherein said plurality of sub-units affixed to said reference plate from an array of staggered sub-units.
4. The apparatus of claim 1, wherein the sub-units are smaller linear arrays of semiconductive elements from the group consisting of:
thermal ink jet elements;
light emitting elements; and
light sensitive elements.
5. The apparatus of claim 1, wherein said sub-units are thermally activated ink jet sub-units and wherein the semiconductive device further comprises:
an ink manifold adapted to supply ink to the ink jet sub-units; and
means for electrically interconnecting the ink jet sub-units to an external system.
6. The apparatus of claim 1, wherein said locating sub-units are semiconductively non-functional sub-units.
7. The apparatus of claim 6, wherein said locating sub-units are spaced away from said linear array of abutted sub-units.
8. A thermal ink jet printer, comprising:
a frame;
at least one ink manifold adapted to supply printing ink, said manifold having outlets therein to enable ink to flow from said manifold;
a pagewidth printhead, including; a reference plate, a linear array of jet sub-units disposed on said reference plate, each ink jet sub-unit having a semiconductive substrate with at least one ink jet nozzle and supporting circuitry, said ink jet sub-units being sealingly aligned with said manifold outlets to enable ink to flow from said manifold to said nozzles, and a plurality of alignment sub-units affixed on opposite ends of said reference plate;
locating means for aligning said pagewidth printhead, on said frame;
means for moving a sheet and said ink jet nozzles relative to one another; and
means for selectively activating said nozzles to produce a printed image on the sheet.
9. The thermal ink jet printer of claim 8, wherein said linear array of ink jet sub-units disposed on said reference plate form a linear array of abutted sub-units.
10. The thermal ink jet printer of claim 8, wherein said linear array of ink jet sub-units disposed on said reference plate form a linear array of staggered sub-units.
11. The thermal ink jet printer of claim 8, wherein said locating means includes alignment points which engage said alignment sub-units, so that said reference plate and attached array of ink jet sub-units are aligned with respect to said frame.
12. The thermal ink jet printer of claim 8, wherein said alignment sub-units are semiconductively non-functional sub-units.
13. The thermal ink jet printer of claim 12, wherein said alignment sub-units are spaced apart from said linear array of ink jet sub-units.
14. The thermal ink jet printer of claim 13, wherein said ink jet sub-units and at least one of said alignment sub-units are produced from the same semiconductive wafer.
15. A thermal ink jet printer, comprising:
a frame;
at least one ink manifold adapted to supply printing ink, said manifold having outlets therein to enable ink to flow from said manifold;
at least two pagewidth printheads, each of said pagewidth printheads including a reference plate, a linear array of ink jet sub-units disposed on said reference plate, each ink jet sub-unit having a planar semiconductive substrate with at least one ink jet nozzle and supporting circuitry, said ink jet sub-units having one or more apertures sealingly aligned with said manifold outlets to enable ink to flow from said manifold to said nozzles, and at least two alignment sub-units affixed on opposite ends of said reference plate;
locating means, for receiving said alignment sub-units in order to align said pagewidth printheads with said frame;
means for moving a sheet and said pagewidth printheads relative to one another; and
means for selectively activating said nozzles of said pagewidth printheads to produce a printed image on the sheet.
16. The thermal ink jet printer of claim 15, wherein said locating means include alignment points which engage said alignment sub-units so that each said reference plate and attached arrays of ink jet sub-units are aligned with respect to said frame.
17. The thermal ink jet printer of claim 15, wherein said linear array of ink printer sub-units is an abutted array, so that each of said page width printheads is capable of printing in a continuous fashion across a page.
18. The thermal ink jet printer of claim 15, wherein said sub-units which form said linear array of ink jet sub-units are spaced apart from one another to form a staggered array, so that two or more of said pagewidth printheads working in conjunction with one another, are requried to enable printing in a continuous fashion across a page.
19. The thermal ink jet printer of claim 15, wherein said alignment sub-units are semiconductively non-functional sub-units.
20. The thermal ink jet printer of claim 15, wherein said alignment sub-units are spaced away from said linear array of abutted ink jet sub-units.
21. The thermal ink jet printer of claim 16, wherein said ink jet sub-units and said alignment sub-units are produced from the same semiconductive wafer.
22. The thermal ink jet printer of claim 15, wherein said pagewidth printheads print with the same color ink, thereby enabling the sheet to be moved at a faster speed while passing said pagewidth printheads.
23. The thermal ink jet printer of claim 15, wherein said pagewidth printheads each print with a different color ink, thereby providing the capability for multicolor printing on the sheet.
1. Field of the Invention
This invention relates generally to the fabrication and precision alignment of an array of semiconductive chips, and more particularly to an improved method of aligning such an array when assembled into a printing subsystem.
2. Description of the Prior Art
Fabrication of pagewidth silicon devices from sub-units, such as image sensor arrays having photosites and supporting circuitry integrated onto a silicon substrate and thermal ink jet printheads having an etched silicon structure mated and bonded to a silicon substrate with heating elements and addressing electrodes, impose economically difficult fabricating processes on manufacturers because of the close tolerance requirement for the abutting edges of side-by-side sub-units assembled to produce the pagewidth devices. Furthermore, once such arrays are fabricated to close tolerances, they must be aligned within the larger apparatus and/or with respect to additional arrays within the apparatus. For example, in a multicolor printing system, having a plurality of single color ink jet printhead arrays, the individual arrays must be aligned to produce the desired spacing for respective colored ink dots which are deposited on an output sheet.
Although the standard technique of dicing or scribing and cleaving silicon wafers used by the semiconductive industry produces silicon devices or chips having reasonably controlled dimensions, the microscopic damage occurring to the chip surface during the scribing or dicing operation has effectively precluded the deposition of circuitry or photosites at the chip edge. This has necessitated that a safe distance be maintained. between the last circuit element or photosite and chip edges, if operation of these adjacent photosites or ink jet circuitry is not to be impaired by the presence of either microcracks or silicon chipping along the cleaved or diced edges. Moreover, once the devices or chips are assembled into an array and affixed to a support member, there is no assurance that required dimensional tolerances with respect to positioning of the array will be met.
U.S. Pat. No. 4,851,371 to Fisher et al., discloses a fabrication process for large area semiconductor devices. A pagewidth printing device may be assembled by abutting silicon device sub-units comprising a channel plate and a heater plate which are bonded together. Prior to bonding the channel plate to the heater plate, the channel plate is formed having a trapezoidal shape by etching elongated slots into the plate. After bonding, the heater plates are diced to form kerfs having vertical to inwardly directed sides which enable high tolerance linear abutment.
U.S. Pat. No. 4,822,755 to Hawkins, et al., discloses a method of fabricating large area semiconductor arrays and a method of separating chips formed on a silicon substrate which uses reactive ion etching techniques combined with orientation etching to make integrated chips which may be precisely butted to form a large array. Chip separation is accomplished by dice cutting along a back of the heater plate.
U.S. Pat. No. 4,814,296 to Jedlicka et al, discloses a method of fabricating image sensor dies for use in scanning arrays. V-shaped grooves are etched on the active side of the wafer prior to sawing to prevent cracking and chipping due to sawing.
U.S. Pat. Nos. 4,690,391 and 4,712,018 to Stoffel et al. disclose methods and apparatus for fabricating long, full width scanning arrays by assembling smaller scanning arrays in abutting end-to-end relation. An aligning tool, having predisposed pins, is used to mate a series of smaller arrays in the abutting relationship. FIGS. 3 and 4 of both patents, illustrate the arrays 10, aligning tool 25 and aligning pins 30 thereon which are used to mate with V-shaped aligning grooves in the arrays, thereby enabling alignment of the arrays.
U.S. Pat. No. 4,829,324 to Drake et al., discloses a large array ink jet printhead having two parts, the first having heating elements and addressing electrodes on the surface thereof. The second part containing the liquid ink handling system. The two parts are formed on distinct wafers, with at least the second part being formed on a silicon wafer. The two wafers, having the described features thereon, are aligned and bonded together, then diced into complete printhead sub-units which have abutting side surfaces that are {111} planes for accurate side-by-side assembly.
U.S. Pat. No. 4,929,300 to Wegleiter discloses a process for separating LED chip arrangements fabricated on a substrate wafer so that they can be arrayed in a series with other LED chips. Chips are separated from the wafer by etching a depression in the back side of each chip prior to double saw cutting the chips to produce chips which can be precisely aligned, as illustrated in FIG. 1.
Thermal ink jet printing systems use thermal energy selectively produced by resistors located in capillary filled ink channels near channel terminating nozzles or orifices to momentarily vaporize the ink and form bubbles on demand. Each temporary bubble expels an ink droplet and propels it towards a recording medium. The printing system may be incorporated in a pagewidth type printer, as disclosed in U.S. Pat. No. 4,463,359 to Ayata et al., which teaches printhead having one or more ink filled channels which are replenished by capillary action. A meniscus is formed at each nozzle to prevent ink from weeping therefrom. A resistor or heater is located in each channel upstream from the nozzles. Current pulses representative of data signals are applied to the resistors to momentarily vaporize the ink in contact therewith and form a bubble for each current pulse. Ink droplets are expelled from each nozzle by the growth of the bubbles which cause a quantity of ink to bulge from the nozzle and break off into a droplet at the beginning of the bubble collapse. The current pulses are shaped to prevent the meniscus from breaking up and receding too far into the channels, after each droplet is expelled. Various embodiments of linear arrays of thermal ink jet devices are shown, such as those having staggered linear arrays attached to the top and bottom of a heat sinking substrate for the purpose of obtaining a pagewidth printhead. Such arrangements may also be used for different colored inks to enable multi-colored printing.
Furthermore, U.S. Pat. No. 4,774,530 to Hawkins, discloses the use of an etched thick film insulative layer to provide the flow path between the ink channels and the manifold, and U.S. Pat. No. 4,786,357 to Campanelli et al., discloses the use of an etched thick film insulative layer between mated and bonded substrates. One substrate has a plurality of heating element arrays and addressing electrodes formed on the surface thereof and the other is a silicon wafer having a plurality of etched manifolds, with each manifold having a set of ink channels. The etched thick film layer provides a clearance space above each set of contact pads of the addressing electrodes to enable the removal of the unwanted silicon material of the wafer by dicing without the need for etched recesses therein. The individual printheads are produced subsequently by dicing the substrate having the heating element arrays.
Drop-on-demand thermal ink jet printheads discussed in the above patents are generally fabricated using silicon wafers and processing technology to make multiple small heater plates and channel plates. This works extremely well for small printheads. The fabrication approaches for making either large array or pagewidth thermal ink jet printheads can be divided into basically two broad categories; namely, monolithic approaches in which one or both of the printhead components (heater substrate and channel plate substrate) are a single large array of pagewidth size, or sub-unit approaches in which smaller sub-units are combined to form the large array or pagewidth print bar. For examples of the sub-unit approach, refer to U.S. Pat. No. 4,829,324 to Drake et al. The sub-units approach results in a much higher yield of usable sub-units, if they can be precisely aligned with respect to one another. The assembly of a plurality of sub-units, however, require precise individual registration in both the x-y-z planes as well as the registration of the assembled array in the x-y-z planes. The alignment problems for these assembled arrays presents quite a formidable task, and one which has, up to this point, required expensive alignment mechanisms and techniques.
The present invention is an alignment apparatus used to align a large area semiconductive device, such as a pagewidth printhead or image sensor, with respect to a target. The semiconductive device is formed by the linear alignment of sub-units, where each sub-unit has a planar semiconductive substrate with an array of active elements and supporting circuitry on its surface. Moreover, the sub-units are produced by dividing them from a larger semiconductive wafer. The apparatus includes a reference plate, a plurality of functional sub-units affixed to the reference plate to form a linear array of sub-units. The apparatus also includes at least two locating sub-units which are affixed to the reference plate to form alignment pads. These alignment pads are used to align the reference plate and attached array in at least one dimension with respect to the target.
The present invention may be incorporated within a thermal ink jet printer, which would include a frame, at least one ink manifold adapted to supply printing ink, and at least one pagewidth printhead. As previously described, the pagewidth printhead would include a reference plate, a linear array of ink jet sub-units affixed to the reference plate, and a plurality of alignment sub-units affixed on opposite ends of the planar surface of said reference plate. Moreover, each ink jet sub-unit has a planar semiconductive substrate with at least one ink jet nozzle and supporting circuitry on its surface. In addition, the ink jet sub-units are sealingly aligned with the ink manifold to enable ink to flow from the manifold to the nozzles. The ink jet printer would also include alignment or reference points for engaging the alignment sub-units and thereby aligning the pagewidth printhead with respect to the frame. In operation, a sheet would be moved past the ink jet nozzles, while selectively activating the nozzles to produce a printed image on the sheet.
The present invention will be described in the environment of a printing subsystem, wherein a printhead is assembled from aligned and mated silicon heating element plates and silicon ink flow directing channel plates, though other large array devices assembled from silicon sub-units, such as image sensors and LED bars, are equally improved by this invention. Furthermore, other semiconductive material such as, for example, gallium arsenide may be used instead of silicon.
Briefly, the heating element plates, each containing a linear array of heating elements and addressing electrodes, are bonded to channel plates having ink channels formed therein to produce complete printhead sub-units. The sub-units, are obtained by a sectioning operation performed on a wafer having a plurality of sets of heating elements and associated addressing electrodes patterned on one surface thereof, said surface also having mating channel plates bonded thereto. The sides of the heating element plate, which are to be linearly abutted together to form the pagewidth printhead, are sectioned by cutting along a cutting line with an angled dicing blade to produce a heating element side that slopes inwardly from the top surface. After the cut, the wafer is rotated 180� and a parallel second cut is made with the blade maintained at the same predetermined angle with respect to the wafer, so that the sides of the adjacent heating element plates also have inwardly sloping sides. Thus, each heating element plate has inwardly sloping side walls on the opposite sides which are to be abutted, and results in a heating element plate having a larger top surface than its bottom surface. The top surface is where the heating elements and addressing electrodes reside, and these top surfaces are substantially contiguous when abutted together, while the opposite bottom surfaces are separated from each other.
The foregoing features will become apparent from a reading of the following specification in conjunction with the drawings, wherein like parts have the same index numerals.
FIG. 1 is a cutaway view of a printer utilizing a pair of pagewidth printheads positioned in accordance with the present invention.
FIG. 2 is a plan view of one of the pagewidth printheads used in the printer of FIG. 1.
FIGS. 3A, 3B and 3C are enlarged elevational views of one end of the pagewidth printhead, illustrating the alignment mechanisms used to position the printhead within the printer of FIG. 1.
FIG. 4 is an enlarged, partially shown, elevational view of the active portion of the pagewidth printhead of FIG. 1.
FIG. 5 is a perspective view of a mechanism used to align the individual semiconductive devices of the pagewidth printhead during the process of assembling the pagewidth printhead.
In FIG. 1, ink jet printer 12 is illustrated with pagewidth printheads 14 and 16, disposed therein to produce printed output on sheet 18. Printheads 14 and 16 each comprise a substrate 20, upon which an array of printhead sub-units 22 are affixed in abutted fashion. Alternatively, individual sub-units 22 may be spaced apart from one another by a distance approximately equal to the length of a single sub-unit. This is commonly known as staggered array, where pagewidth printing is enabled by the use of 2 or more staggered arrays. In one embodiment, sub-units 22 may be similar in construction to those sub-units described in U.S. Pat. No. 4,851,371 to Fisher et al., the relevant portions of which are hereby incorporated by reference. The forward facing edges of sub-units 22 are maintained in close proximity to the surface of sheet 18. Also affixed to substrate 20, at a position behind the abutted sub-unit array, is printed wiring board (PWB) 24. PWB 24 contains the circuitry required to interface and drive the individual ink jets which are exposed on the front face of sub-units 22. While not shown, PWB 24 is connected to individual contacts contained on the sub-units via a commonly known wire bonding technique. The data required to drive the individual ink jets of the printhead sub-units is supplied from an external system by a standard printer interface, modified and/or buffered by control logic (not shown) within the printer, and transferred to the printheads via ribbon cable 26 and pin-type connector 28.
Ink is supplied to the individual ink jet nozzles 82 of FIG. 4, via internal channels (not shown), which are connected to through vias or apertures (not shown) in the upper surface of printhead sub-units 22. Further description of such an arrangement may be found in U.S. Pat. No. 4,829,324 to Drake et al., the relevant portions of which are hereby incorporated by reference. Ink is supplied to the through vias by ink manifolds 30 which are, in turn, supplied from an ink reservoir (not shown) through ink supply hoses 32. Alternatively, ink may be supplied to the ink jet nozzles 82 (through vias) by any known reservior/manifold or cartridge technique suitable for sealing mating with the upper surface of the sub-units 22. Also affixed to the surface of substrate 20 are locating or alignment pads 34 which are used to accurately position the array within printer 12. The location of pagewidth printheads 14 and 16 is particularly important to accurately position the abutted printhead sub-units comprising each array. The relative positions of the arrays becomes particularly important in printers employing more than a single pagewidth printhead. Such a printer would be able to produce multicolored output, which requires accurate placement of the ink droplets from each printhead relative to one another, in order to achieve the desired output quality.
As further illustrated in FIG. 1, sheet 18 is fed in the direction of arrow 36 as ink droplets are ejected from the front face of sub-units 22 to produce output image 38 thereon. The paper is fed by conventional paper feeding mechanisms (not shown), and is maintained in close proximity to the front face of the printheads by one or more paper guides 40. The spacing between the front face of the printhead sub-units where the ink jet nozzles are found and the surface of the paper sheet, commonly referred to as the z-direction, is important to control the position and size of the ink droplets ejected from the individual nozzles. Furthermore, the spacing between two parallel and adjacent pagewidth printheads, for example printheads 14 and 16, must be maintained within close tolerance.
As an example of the close tolerances required for a two color, 300 spot per inch (spi) printer, the spacing between the printhead arrays, the y-direction, should be maintained within about �50 μm. That is, the distance separating the parallel linear arrays of ink jet nozzles should be controlled to be within an established tolerance of about �50 μm. In a similar system operating at 600 spi, the tolerance for the distance separating the printheads is approximately half, or �25 μm. For a single color printer, one which simultaneously uses both printheads for the same output color to enable a higher paper velocity, the tolerance in a 300 spi system must be maintained to within about �12 μm. With respect to the vertical alignment of corresponding ink jet nozzles on adjacent arrays, x-direction, similar tolerances must be met. In other words, the end nozzles of two parallel, adjacent pagewidth printheads in a 300 spi color printer should be within about �50 μm in vertical alignment with one another.
Printer 12 also includes rigid frame members 42 which provide mechanisms, such as reference points, for receiving alignment pads 34 and for holding the pagewidth printheads 14 and 16 in alignment during operation of the printer. As the frames and mounting mechanisms incorporated therein generally have some associated dimensional tolerances, it is even more important to produce the pagewidth printheads and associated alignment pads to more exacting tolerances. Finally, the previously described elements of printer 12 are generally enclosed within upper and lower covers, 44 and 46 respectively, upper cover 44 having an elongated opening in the center of its upper surface to enable sheet 18 to exit the printer.
Referring now to FIG. 2, which illustrates one of the two similar pagewidth printheads 14 or 16, the printhead is built upon rigid substrate 20. Along the front face of substrate 20, a linear array of ink jet printing sub-units 22 are positioned with their exposed ink nozzles (not shown) facing outward. The array of ink jet printing sub-units is permanently affixed to the substrate by a thin layer of epoxy material which is sandwiched between the sub-units and the substrate. Behind this array of sub-units lies PWB 24 which is fastened to substrate 20 by screws 60. Alternatively, PWB 24 may be detachably fastened to substrate 20 with clips or other suitable fastening mechanism. PWB 24 is shown in FIG. 2 with a male type pin connector 62 suitable for use with connector 28 of FIG. 1. Next, ink manifolds 30 are placed over the upper surface of printing sub-units 22 and a portion of PWB 24. The ink manifolds have outlets (not shown) in their underside to allow the flow of ink from the aligned outlets into vias (not shown) in the upper surface of the printing sub-units. In operation, ink is supplied to the manifolds by hoses which are connected to couplings 64, the ink being supplied from a larger reservoir (not shown) within the printer.
The pagewidth printhead also includes a pair of alignment pads 34 for positioning the printhead within the printer. In one embodiment, the alignment pads are provided by a pair of functional or non-functional sub-units which are affixed to the outer ends of the substrate at about the same time, and in the same manner as the printing sub-units. By utilizing non-functional sub-units, ideally sub-units produced from the same silicon wafer as the functional printing sub-units, the alignment pads will be representative of the dimensions and tolerances of the printing sub-units which are used to produce the array. There is generally no additional cost for using non-functional sub-units, as typical semiconductor industry yields for such devices is on the order of seventy percent, thus assuring ample supply of the non-functional sub-units. However, as mentioned, functional sub-units may be used in these non-operational positions. By affixing the functional or non-functional sub-units on the substrate in the same manner and at approximately the same time as the printing sub-units are affixed to the substrate, alignment pads 34 may be used to accurately locate the assembled pagewidth printhead. Alignment points 66a,b, which are rigidly connected to frame 42 of printer 12 (FIG. 1), contact the front surface of pads 34. More specifically, alignment points 66a,b are integrated with locating means 68a and 68b, respectively. Locating means 68a and 68b extend from, or are machined into, frame 42 to provide rigid mounts for alignment points 66a and 66b. Furthermore, the position of alignment points 66a,b with respect to one another and with respect to the surface of sheet 18 (FIG. 1) must be accurately maintained to assure proper placement of the printhead in the z-direction. Once the pagewidth printhead is installed in the printer, alignment pads 34 and alignment points 66a,b work in conjunction to control the position of the printhead in the z-direction and with respect to the surface of the paper sheet which passes the array of printing sub-units 22. This effectively controls the distance over which the ink droplets must travel upon being expelled from the ink jets.
Referring now to FIG. 3A, which illustrates an end portion of the front face of assembled pagewidth printhead 14 or 16, substrate 20 has an alignment pad 34 placed at two or more locations thereon. While only one end of the pagewidth printhead is illustrated in FIG. 3A, it should be understood that the opposite end of the printhead would be similar in design and function. Above and behind alignment pad 34 lies ink manifold 30 as previously described with respect to FIGS. 1 and 2. Referring also to FIG. 4, which is an enlarged view of another portion of the pagewidth printhead 14 or 16, showing an operational portion of the printing array as assembled from printhead sub-units 22. Schematically illustrated heating elements 80 are shown in each channel through nozzles 82. The confronting walls 84 of heating element plates 86 are produced, for example, by angled dicing of the silicon wafer and enable the close tolerance abutting of the printhead sub-units 22 as described by U.S. Pat. No. 4,851,371 to Fisher et al.. As previously described, pagewidth printheads 14 and 16 are assembled on support substrate 20, which may also act as a heat sink for the attached printhead sub-units.
When two or more pagewidth printheads are incorporated into a printer, as illustrated in FIG. 1, it is imperative that the position of the nozzles be accurately controlled relative to each other. As previously described, the relative spacing of a nozzle on one printhead must be controlled with respect to the corresponding nozzles on the other printheads within the printer. With alignment pads 34 and printhead sub-units 22 commonly affixed to substrate 20 under close dimensional tolerance, it is possible to position the printhead sub-units 22 by accurately controlling the position of alignment pads 34. Alternatively, it may be possible to affix alignment pads 34 to substrate under less critical dimensional tolerances, and subsequently dice or trim the outer or exposed ends of pads 34 to the desired dimensional tolerance.
FIGS. 3A, 3B, and 3C illustrate the use of locating means 68a, which further incorporates alignment points 70 and 72 in addition to alignment point 66a of FIG. 2, for positioning pagewidth printheads 14 and 16 within the printer. As previously described, locating means 68a is rigidly connected to, or machined into, frame 42 of FIG. 1, to provide an accurate and fixed location for the alignment points. Installing a pagewidth printhead (14 or 16) within printer 12 is thus enabled by simply sliding the printhead into the recesses formed by the locating means and alignment points, and securing the printhead in a manner to assure that the alignment points are in contact with the alignment pads. Generally, the pagewidth printheads would be forceably held in contact with the alignment points, via spring loading or other commonly known method, to assure accurate positioning of the printheads at all times.
In the embodiment illustrated in FIG. 3A, the x-y position of the printhead is controlled by alignment of the outer and lower edges of the alignment pad. Generally, outer or x-direction alignment point 70 would be in contact with the channel plate 74 or upper portion of the sub-unit, while the lower or vertical alignment point 72a would be in contact with the heater plate 76 of the device. Locating pagewidth printheads 14 and 16 in this manner enables the relative position of the ink jet nozzles to be maintained within about �14 μm in the y-direction and within less than �12 μm in the x-direction. The variability results primarily from the variation in thickness of heater plate 76. Alternatively, the non-functional device used for alignment pad 34 may be modified to expose the lower edge of channel plate 76 as illustrated in FIG. 3B. Modification of the non-functional sub-unit enables the accurate positioning of the linear array of ink jet nozzles, by locating the printhead with respect to channel plate 74 using contact point 72b, thereby removing the variability in position due to heater plate 76. Yet another method of mounting is illustrated in FIG. 3C, wherein an unmodified, non-functional sub-unit is used to align the pagewidth printhead. Specifically, side and top surface channel plate references are used to position the printhead using alignment points 70 and 72c, respectively. Use of the alignment approach illustrated in FIG. 3 would result in a �14 μm variation in the y-direction, due primarily to the variation in thickness of the channel plate.
Referring now to FIG. 5, which illustrates the assembly of the pagewidth printhead of the present invention, chip alignment jig 100 is first used to accurately locate the sub-units, printing and non-functional, with respect to one another. Alignment jig 100 generally comprises a flat, rigid base plate 102, which has a raised reference edge 104 on the upper surface thereof. The reference edge also has a series of tabs 106, 108, and 110 extending from one side in the plane of the reference edge. Tabs 106, 108, and 110 provide surfaces to which the sub-units may be abutted. As illustrated in the figure, a plurality of sub-units 22 are abutted along the central portion of reference edge 104, between tabs 108 and 110. Furthermore, non-functional sub-units are positioned against the outer tabs, 106 and 110, to produce alignment pads 34.
Assembly of the printhead proceeds first with the placement of an outer alignment or locating pad, 112 in abutting contact with edges 114 and 116. Pad 112 is placed on the surface of plate 102 in an upside-down orientation with respect to the operating orientation. A non-functional semiconductive sub-unit is used for the pad. Once placed in the appropriate position, pad 112 may be temporarily maintained in its place by the application of a vacuum to the underside of the sub-unit. As shown at the opposite end of plate 102, vacuum orifices 118 underlay each of the sub-units and may be connected to a negative pressure source (not shown) on a selective sub-unit by sub-unit basis. In general, application of the vacuum force holds the sub-units in their respective positions during the placement of subsequent sub-units of the array.
Continuing with the assembly, the first functional or printing sub-unit is then placed in abutting contact with tab 108 and reference edge 104, along edges 120 and 122, respectively. Again, the sub-unit may be held in place with the selective application of a negative pressure to the underside of the sub-unit. Likewise, additional sub-units 22 are positioned in abutting contact with edge 122 and the exposed end of the previously placed sub-unit. This process is repeated until the last sub-unit of the array, sub-unit 124, is placed in position. Subsequently, the second alignment pad is provided by the placement of non-functional sub-unit 126 in abutting contact with edges 128 and 130 in a manner similar to that previously described with respect to pad 112.
Once all the sub-units, both functional and non-functional have been placed along the reference edge, a thin bead or layer of epoxy resin is applied prior to assembling the sub-units and substrate 20. The resin is applied to the underside of substrate 20 near edge 132 so that when placed in contact with the sub-units the resin will contact the top facing surface of the sub-units. Alternatively, the resin may be applied to the top facing surface of the sub-units. After the resin has been applied, substrate 20 is brought into contact with the sub-units. Using a thixotropic die bond epoxy, the sub-units become sufficiently "tacked" to substrate 20 to prevent movement. Subsequently, the epoxy resin is cured in an oven to permanently affix sub-units 22 to substrate 20. Once the resin is cured, the vacuum applied to the chips is released and the substrate is removed with the sub-units permanently affixed thereto. Subsequently, the substrate is inverted in order to complete the assembly of the printhead with the remaining elements, PWB 24, ink manifold 30 and screws 60, as illustrated in FIG. 2.
In an alternative assembly method, alignment or locating sub-units 112 and 126 would be placed at approximately the same positions indicated in FIG. 5, however, the sub-units would be displaced outwardly along the registration edge. More specifically, alignment sub-units 112 and 126 would be spaced farther from the abutted printing array sub-units 22, thus overhanging the edge of substrate 20 by a greater amount than indicated in FIG. 5. In other words, tabs 106 and 110, which are used to control the spacing of alignment sub-units 112 and 126, respectively, would be spaced further from the center of the reference edge 104. Positioning sub-units 112 and 126 in this manner would provide some excess exposure of the sub-units beyond the edge of substrate 20, and would enable subsequent trimming or dicing of the exposed ends of the alignment sub-units. Highly accurate dicing of alignment sub-units 112 and 126 in this manner would produce accurate edges for positioning the pagewidth printheads in the x-direction as previously illustrated in FIGS. 3A, 3B, and 3C.
While the present invention has been described with respect to the accurate positioning of pagewidth thermal ink jet printheads, it is certainly applicable to the positioning of pagewidth image scanning arrays or LED bars. For example, an array as disclosed in U.S. Pat. No. 4,712,018 to Stoffel et al. might be employed in a multiple array scanning system to scan color images, where each pagewidth scanning array was sensitive to a certain color spectrum. Moreover, many modifications and variations are apparent from the foregoing description of the invention and all such modifications and variations are intended to be within the scope of the present invention.
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See definition in Oxford Advanced Learner's DictionarySyllabification: ro·bust
Pronunciation: /rōˈbəst/ /ˈrōˌbəst/
Definition of robust in English:
adjective (robuster, robustest)
1Strong and healthy; vigorous: the Caplans are a robust, healthy lot
More example sentences
- Her body, once the robust athletic image of health, now requires a machine to keep it alive.
- Mid-summer plantings of short-season tomato cultivars can provide vigorous, robust plants from which to harvest high-quality fruit.
- Losey's health, never robust, failed during the production of the film and he died in London on 22 June 1984.
1.1(Of an object) sturdy in construction: a robust metal cabinet
More example sentences
- The wear and tear after twelve weeks of children running, jumping, and rarely standing still further supports Waterson's choice of robust construction elements, hazard signs and protective barriers.
- Playing with the values of bookmaking and book arts, he has produced a series of artists' books robust enough to be handled by the public.
- The robust steel and concrete construction and strong geometric forms of the two buildings reinforce their physical relationship.
1.2(Of a process, system, organization, etc.) able to withstand or overcome adverse conditions: California's robust property market
More example sentences
- The robust economy has resulted in more than seven million people worldwide now classed as high-net-worth individuals, with assets of $1 million or more.
- He adds that the move is justified by a 'more receptive' public looking for more upscale choices in today's robust economy.
- Dot-com fever and a robust economy had money pouring into the museum from longtime benefactors and new supporters alike.
1.3Uncompromising and forceful: the country's decision to bow to UN pressure was preceded by a robust defense of its policies he took quite a robust view of my case
More example sentences
- There will be even less robust debate and argument, as everybody runs scared of being accused of bullying.
- We have had a very robust debate this afternoon, and I encourage that.
- He advocated theories existence that would be sufficiently robust to reveal the larger patterns of society and do justice to its intricacies and complexities.
1.4(Of wine or food) strong and rich in flavor or smell.
Example sentences
- Meeting the growing demand for robust cheeses relies on good milk, strong starters and quality flavors.
- The specialty cheese segment has played well to consumer desires for foods with more robust and unique flavors.
- You're planning a dinner for eight important guests and want the perfect robust red to go with filet mignon.
strong, full-bodied, flavorful, rich
- 1
- Example sentences
- His paintings were characteristically semi-abstract, strongly-coloured, robustly worked, and often violent in expression - cockfighting was a favourite theme.
- Detailing is robustly and legibly expressed, echoing the temporary site and construction structures that have become an inescapable part of the Lower Manhattan landscape.
- Secondly, most of his works have a robustly individual conceptual framework which can seem to exist independently from the musical material involved in any one realisation of that work.
- 2
- Example sentences
- The rootedness of a culture has traditionally been a test of its strength, robustness, and the health of its imperial prospects.
- Do short revolving periods jeopardize the cooperative's financial health and robustness?
- He has recovered something of his original robustness of physique and voice, following his health problems.
Pronunciation: /rōˈbəstlē/ /ˈrōˌbəstlē/adverb
Pronunciation: /rōˈbəstnəs/ /ˈrōˌbəstnəs/noun
Mid 16th century: from Latin robustus 'firm and hard', from robus, earlier form of robur 'oak, strength'.
corroborate from mid 16th century:
If someone corroborates an account or story, the facts are strengthened. Corroborate was first recorded in the sense 'make physically stronger' from the Latin verb corroborare 'strengthen' from robur 'strength' source of robust (mid 16th century).
Words that rhyme with robustadjust, august, bust, combust, crust, dust, encrust, entrust, gust, just, lust, mistrust, must, rust, thrust, trust, undiscussed
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Scott Centenary 2011–2012
British Antarctic Survey are linked to a number of events and news stories celebrating the 100 year anniversary of Captain Robert Falcon Scott's journey to the South Pole in 1911/12. Scott and his men perished on the infamous return to their camp at Hut Point. His remarkable journey involved pioneering scientific research, some of which is still valuable today and forms a benchmark for modern science.
British Antarctic Survey news stories
- 28 Mar 2012 — Staff remember Antarctic explorer at special commemorative service
- 16 Feb 2012 — New Gallery for Captain Lawrence Oates
- 17 Jan 2012 — Centenary of Captain Robert Falcon Scott's expedition to the South Pole
- 29 Nov 2011 — Captain Robert Falcon Scott's last expedition
- 21 Nov 2011 — Antarctic Field Season kicks off for Centennial Year
- Observing the Earth's magnetic field - Scott's South Pole scientific legacy (BGS)
- Scientists and the Heroic Age
- A day in the life' with Scott party descendant Alistair Wilson working in Antarctic
- Captain Scott's enduring legacy - descendants of Captain Scott's team and other Antarctic experts talk about the expedition's achievements
- 'The lost diary' - a commemorative film about Captain Robert Scott made by staff at Rothera Research Station
- Scott's Last Expedition - Natural History Museum YouTube Channel playlist
- Scott and Antarctica videos from the Natural History Museum
Events supported by British Antarctic Survey
- Frozen Planet — the BBC's landmark series about the Earth's polar regions
- 'Scott's Last Expedition' — an upcoming exhibition at the Natural History Museum in London
- Centenary Exhibition — Plymouth Art Gallery and Museum
- Lawrence Oates Gallery — Oates Museum in Selborne, Hampshire
- British Services Antarctic Expedition 2012 — an expedition to commemorate Scott's outstanding contribution to the nation and to science
External Links
- Scott100.org — a comprehensive list of Scott Centenary events
- 100 years of Australian Antarctic Expeditions — centenary events taking place in Australia
- The Nansen-Amundsen-Year - centenary events taking place in Norway
- U.S. National Science Foundation - South Pole Station Celebrates a Century of Science
- Scott's Last Expedition - exhibition at the Cadbury Research Library, University of Birmingham