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The invention describes an electrical receptacle comprising a housing having apertures for receiving blade-type contacts of a plug in which the plug is formed with an aperture at its free end, and a pair of contacts secured in the interior of the housing in longitudinal alignment with the apertures for electrically conductively contacting plug contacts inserted through the apertures, each contact member having a flexible contact portion having a projection releasably interlockable with the aperture of a plug contact to prevent inadvertent withdrawal of the plug contacts from the housing and an arrangement for selectively manually displacing the contact portions for releasing the plug contacts.
1. A duplex electrical receptacle, comprising:
a housing having a base and a cover releaseably secured to the base, said base and cover together defining an interior chamber, said base having a support surface and means for introducing electrical conductors into said chamber, said cover having a pair of spaced aperture means for admitting blade-type contacts of a plug into said chamber, and a pair of spaced slots in said cover associated with each said aperture means and extending between said chamber and an exterior surface of said housing;
a pair of blade-type electrical contact members disposed in said chamber, each said member having an elongated base adapted to be releasably secured to said support surface and electrically connected to an electrical conductor, an arm extending longitudinally from each end of said base, a flexible contact portion extending from each said arm and being longitudinally aligned with an aperture of one of said aperture means for electrically contacting a plug contact inserted through said aperture, a projection extending from a side surface of each said contact portion for interlockingly engaging an aperture in a plug contact, each said projection having having a locking surface extending substantially transversely of said side of said contact portion and a camming surface extending from said locking surface to said side at an angle thereto and toward a free end of said side, and a finger extending from said arm and outwardly of said chamber through one of said slots, said fingers being arranged to laterally displace said contact portions and release interlocking engagement between said contact portion and a plug contact upon movement of said fingers along said slots.
2. An electrical receptacle as defined in claim 1, further including electrical circuit means in said housing for indicating electrical continuity through conductors connected to said contact members and a source of power.
The present invention relates to an electrical receptacle and, more specifically, to a receptacle which is adapted to be releasably secured or interlocked with a mating electrical plug.
As is well known, conventional electrical plugs are held in electrical contact with conventional electrical receptacles by frictional contact between the contact members of the plug and receptacle. This arrangement is quite acceptable for most applications in which the appliance is not moved during use. Such applications include for example lamps, radios, and other such appliances. However, there are applications, such as in the use of power tools and the like, in which electrical appliances are moved during use and as often happens excessive tension applied to the electrical cord of the appliance disconnects the plug from the receptacle. Not only is this inconvenient, it can create a hazardous condition. There are other situations in which it is essential that the plug not become inadvertently disconnected from the receptacle. The frictional contact forces generated by conventional plugs and receptacles is insufficient to provide the security required in the latter situations.
There are also situations in which it is desirable to have a visible indication of electrical continuity in a conductor and, particularly, through a plug-receptacle connection.
The present invention seeks to provide an electrical receptacle which is releasably and positively secured to the plug with which it is used so as to preclude inadvertent disconnection of the plug and receptacle. The present invention also seeks to provide a receptacle which provides a visual indication of electrical continuity.
In accordance with the present invention there is provided an electrical receptacle comprising a housing having aperture means therein for receiving at least a pair of blade-type male contact members each having a recess or aperture extending transversely therethrough and at least one pair of transversely flexible blade-type contact members secured to the interior of the housing in longitudinal alignment with the aperture means for electrically conductively contacting male contact members inserted into the housing through the aperture means. Each flexible contact member has interlocking means releasably engageable with the aperture of a male contact member for preventing withdrawal of the male contact member from the housing. The receptacle further includes means extending from the housing for flexibly displacing each of the flexible contact members and disengaging the flexible and male contact members.
These and other features of the invention will become more apparent from the following description in which reference is made to the appended drawings, wherein:
FIGURE 1 is a perspective view of an electrical receptacle in accordance with the present invention;
FIGURE 2 is a cross-sectional view taken along line 2--2 of FIG. 3;
FIG. 3 is a cross-sectional view taken along line 3--3 of FIG. 2;
FIG. 4 is a perspective view of a contact member disposed in the receptacle illustrated in FIG. 1;
FIG. 5 is a perspective view of a duplex receptacle constructed in accordance with the present invention;
FIG. 6 is a plan view of the base of the duplex receptacle illustrated in FIG. 5;
FIG. 7 is a broken perspective view of the engagement between the contact members of the receptacle illustrated in FIGS. 5 and 6 and the contacts of a plug; and
FIG. 8 is a perspective view of a contact member disposed in the receptacle illustrated in FIG. 5.
FIGS. 1 to 4 illustrate one embodiment of the the electrical receptacle of the present invention which is specifically adapted for use with extension cords and the like.
Generally, the electrical receptacle of FIGS. 1 to 4 is comprised of a housing 10 having aperture means 12 therein for receiving a pair of blade-type male contact members 14 (FIG. 3), of a plug 15, each having a recess or aperture 16 extending transversely therethrough. The receptacle includes a pair of transversely flexible blade-type contact members 20 secured to the housing interiorly thereof in longitudinal alignment with aperture means 12 for electrically conductively contacting male contact members 14 inserted into the housing through the aperture means. Each flexible contact member 20 has interlocking means 22 which are releasably engageable with aperture 16 of a male contact member for preventing withdrawal of the male contact member from the housing. The receptacle further includes means 24 extending from the housing for flexibly displacing each of the flexible contact members so as to thereby disengage the flexible and male contact members.
Housing 10 includes a first housing section or base 26 having a neck portion 28 and a second housing portion 30 releasably secured to the base by screws 32 to enable attachment of conductors 34 of an electrical cord 36 to the the flexible contact members as explained below. Sections 26 and 30 together define a chamber 38 in which the flexible contact members are disposed. The chamber includes a support surface 40 to which the contact members are secured by screws 42. Screws 42 also serve to electrically connect conductors 34 to the contact members as shown. A channel 44 extends concentrically through neck 28 from the support surface to end face 46 of the neck for admitting cord 36 into chamber 38.
As best illustrated in FIG. 3, aperture means 12 are transversely spaced slots 48 which extend longitudinally of the section 30 from chamber 38 to end face 50 of section 30. Section 30 includes a transversely extending wall means or partition 52 for electrically separating contact members 20 from one another as shown in FIGS. 2 and 3. A pair of channels 54 extend transversely of section 30 from chamber 38 to the exterior surface of the receptacle at which openings 56 are formed. Channels 54 serve to communicate displacing means 24 to the exterior of the housing. Openings 56 are closed by flexible covers 58, constructed of rubber or like material, secured to the exterior surface of the receptacle. Covers 58 each include a rigid projection 60 for transferring inwardly directed forces to the ends of the displacing means.
FIG. 4 is a perspective view of a flexible contact member 20. Member 20 includes a base 62, having a hole 63 for receiving a screw 42, and an elongated flexible contact portion 64 arranged to be longitudinally aligned with a slot 48. Free end 66 of contact portion 64 is inclined so as to form a camming surface 68 engageable with the end of a male contact member during insertion. A projection 70 extends from a side surface 72 of contact portion 64 and includes a generally transversely extending surface 74 and an inclined surface 76. Projection 70 terminates in a point 77 so as to facilitate reception of the projection in the aperture of a male contact member.
It will be seen therefore that when the male contacts of a plug are inserted into slots 48, the ends of the contacts will first engage and transversely displace the free ends of the contact portions of contacts 20. Continued insertion of the contacts 14 will result in reception of projections 70 into apertures 16. Engagement between surfaces 74 and the edges of the recesses will prevent withdrawal of contacts 14 from the receptacle.
Displacing means 24 are of the form of integral arms 78 having bent over end portions 79 extending from contact portions 64 and positioned in channels 54 as previously explained. Thus, when inward pressure is applied to covers 58, projections 60 thereof engage the ends 79 of arms 78 and urge the arms and contact portions inwardly until projections 70 exit the apertures of the male contacts.
FIGS. 5 to 8 illustrate a duplex receptacle 100 constructed in accordance with the present invention. The receptacle includes a base 102 and a cover 104 secured to the base by screws 106. Both members are constructed of nonconductive material such as plastic. Base 102 and cover 104 together define a chamber 108 in which a pair of electrical contacts 110 are disposed. The cover is provided with a pair of aperture means 112 and 114 of substantially the same construction as those of the embodiment of FIGS. 1 to 5 for reception of the bladed prongs or contacts of a plug.
Contacts 110 are secured to a support surface 120 of base 102 by screws 122 and each contact services an aperture of each aperture means 112 and 114 as is conventional in duplex receptacles. As best shown in FIG. 8, each contact 110 is an integral component constructed of electrically conductive material and has an L-shaped base 124, having apertures 126 for reception of screws 122, and a pair of arms 28 which are integrally and flexibly connected to and extend longitudinally of each end of the the base. Each arm 128 includes a contact portion 130 which is arranged to be aligned with an aperture of aperture means 112 or 114 and is formed with a projection 132 in the same manner as the contacts of the preceeding embodiment. Similarly, the ends 134 of contact portions 130 are inclined at a suitable angle to the planes of the contact portions to facilitate insertion of the male contact members into the receptacle. The free ends of each arm 128 is formed with a transversely extending finger 136 which is arranged to pass through an associated slot or opening 138 in cover 104 as illustrated in FIG. 5. The natural resilience of the contacts urges fingers 136 to the laterally outer ends of their associated slots.
In operation, it will be seen that upon insertion of the contacts of a plug, the ends of the contacts will engage and laterally inwardly displace the free ends of an adjacent pair of contact portions 130 of contacts 110. Further insertion of the plug contacts will result in reception of projections 132 into the apertures of the plug contacts and interlocking of the plug contacts and contacts 110 as shown in FIG. 8. When it is desired to remove a plug, an adjacent pair of fingers 136 are manually urged laterally inwardly to the opposite ends of their associated slots. This action laterally inwardly displaces contact portions 130 of contacts 110 and disengages projections 132 from the apertures of the plug contacts.
In order to provide an indication of continuity, a light 140, such as a light emmitting diode, is secured to the exterior surface of the receptacle with its leads connected in parallel with the two contacts. Thus, when the receptacle is connected to a source of power, the light will be activated indicating electrical continuity between the receptacle and the source of power.
It will be understood that various modifications and alterations may be made to the above described device without departing from the spirit of the appended claims.
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text:
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subset: commoncrawl


text:
Who Can Help You With Jump Drive Data Recovery?
Jump Drives, USB Flash Drives, and secure Digital Cards are some of the electronic data storage devices people often use in daily activities. However, sometimes the worst can happen to these storage devices. Data in such devices can get lost due to a number of reasons: the device can get damaged by fire or water, data can be erased accidentally, or the device can be formatted, leading to loss of all saved data. These occurrences may require professional discovery services to retrieve the lost data.
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August 1, 2015
HEALDTON, OK - Smoke filled the air in downtown Healdton Thursday afternoon when a local business caught fire.
The warehouse connected to the Healdton Family Center store on Main St. caught fire around 12:30 p.m.
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Ratliff City Police Chief Robert Thornton said it's lucky no one was injured.
A state fire marshal is currently investigating what ignited the fire.
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text:
DVD and Blue Ray Players
Step into a new dimension of viewing with DVD and Blue-ray players. With high-density data storage capacity and HD resolution, they promise an unforgettable TV viewing experience.
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VERY Special Thank You To The Sponsors This Year!!! Sponsors For This Year Are:
Type in your favorite, then use the "TAB" key to navigate to the next box. When finished, click "SUBMIT".
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Using the Enter or Return keys when filling out form will submit. Use TAB key to navigate to next field.


text:
Hi there, I'm Katie. I'm a follower of Christ, wife and mom to two great kids (Delton, age 2 and Adalae, <1). I love the written word: reading, writing and the like. I'd love to one day write a novel and see it published, but for now, I suppose I stay busy enough. I have a B.A. in Communication, specifically Advertising and Public Relations.
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Want to read more by Katie? Check out more articles below!
Whose Approval Are You Seeking?
Divergent: What It Means and Why You Should Be
Revenge: Where is Your Standard for Forgiving?
Picture This: What Image Does Your Profile Pic Portray?
"Do Not Turn to Idols: I Am the Lord Your God"
The Human Body: Created Beautifully and For a Purpose
Don't Be Idle: Four Ways to Make the Most of Your Summer
Abigail: A Lesson in Peace (Among Other Things)
Silence and Speaking: Working for Growth


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Diplodocs - Find your user manual, user guide, instruc...
content violation
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A technique is described for increasing the adhesion between metals and organic substrates, where the metals are those which normally only very weakly bond to the substrate. These metals include Ni, Cu, Al, Ag, Au, Ta, Pt, Ir, Rh, Pd, Zn, and Cd. The organic substrates include mylar, polyimides, polyesters, polyethylene, polystyrene, etc. Enhanced adhesion occurs when intermixing between the depositing metal atoms and the substrate is optimized to a depth less than about 1000 angstroms into the substrate. This occurs in a critical substrate temperature range of about (0.6-0.8) Tc, where Tc is the curing temperature of the substrate. The deposition rate of the metal atoms is chosen such that the arrival rate of the metal atoms at the surface of the substrate is comparable to or less than the rate of diffusion of metal atoms into the substrate. This provides optimum intermixing and maximum adhesion.
1. A method for producing a metal-organic substrate composite with increased adhesion between the metal and the organic substrate, where the metal has only weak intrinsic bonding to the organic substrate, including the steps of:
heating the organic substrate to a temperature approximately 0.6-0.8 of its curing temperature Tc, and
depositing said metal onto said organic substrate while said substrate is heated to a substrate temperature within the range of about (0.6-0.8) Tc until at least a few atomic layers of continuous metal are formed on said substrate, said deposition occurring at a rate such that the diffusion of depositing metal atoms into said organic substrate is equal to or greater than the arrival rate of said metal atoms at the surface of said organic substrate, said metal being one which has only weak chemical bonding to the atomic constituents of said organic substrate.
2. The method of claim 1, wherein said metal is selected from the group consisting of Ni, Cu, and Al.
3. The method of claim 1, where said metal deposition rate does not exceed about 1/10 of the diffusion rate of said metal atoms into said organic substrate.
4. The method of claim 1, where said metals are selected from the group consisting of Ni, Cu, Al, Ag, Au, Ta, Pt, Ir, Rh, Pd, Zn, and Cd.
5. The method of claim 1, where said substrate is an organic polymer.
6. The method of claim 1, where said substrate is polyimide.
7. A method for depositing a metal onto an organic polymer substrate in order to maximize the adhesion between the metal and the substrate, including the steps of:
heating said organic polymer substrate to a temperature approximately (0.6-0.8) of its curing temperature Tc,
depositing on said organic polymer substrate a metal selected from the group consisting of Ni, Cu, Al, Au, Ag, Ta, Rh, and Pd, said substrate being heated to a temperature within the approximate range (0.6-0.8) Tc during the deposition of said metal thereon at least until a few atomic layers of a continuous metal film are formed on the surface of said substrate, said substrate temperature and the deposition rate of metal atoms onto said substrate being chosen such that intermixing of metal atoms and said substrate is optimized to a distance less than about 1000 angstroms into said substrate to maximize adhesion between said metal and said substrate.
8. The method of claim 7, where said substrate is polyimide.
9. The method of claim 8, wherein the arrival rate of metal atoms at the surface of said organic polymer substrate does not exceed the diffusion rate of said metal atoms into said organic polymer substrate.
10. The method of claim 8, where said metal atoms are deposited by evaporation or sputtering.
11. A method for making a metal layer-organic substrate composite having increased adhesion between the metal layer and the organic substrate, including the steps of
heating said organic substrate to a temperature approximately (0.6-0.8) of its curing temperature Tc,
depositing thereon a metal selected from the group consisting of Ni, Cu, Al, Ag, Ta, Pt, Ir, Rh, Pd, Zn, and Cd, said deposition being at a rate sufficiently slow that diffusion of metal atoms into said organic substrate can occur, said organic substrate being heated to a temperature in the approximate range (0.6-0.8) Tc during said deposition for a time sufficiently long to allow optimum intermixing between said metal and the atomic constituents of said substrate over a distance less than about 1000 angstroms into said organic substrate in order to maximize adhesion between said metal and said substrate.
12. The method of claim 11, where said organic substrate is polyimide.
13. The method of claim 11, where said substrate is an organic polymer.
14. The method of claim 13, where said deposition rate is less than the diffusion rate of metal atoms into said substrate.
15. The method of claim 1, where said substrate is selected from the group consisting of mylar, polyimide, polyesters, polyethylene, epoxies, and polystyrene.
16. A method for producing a metal-polyimide composite having good adhesion between said metal and polyimide, comprising the steps of:
depositing a metal selected from group consisting of Cu, Ni, and Al onto said polyimide while said polyimide is heated to a temperature in the range of about (0.6-0.8) Tc, where Tc is the curing temperature of said polyimide, and
adjusting the rate of arrival of atoms of said metal at the surface of said polyimide to be about equal to or less than the diffusion rate of said metal atoms into said substrate.
17. The method of claim 16, where said rate of arrival of said metal atoms does not exceed about 0.1 of said diffusion rate.
This application is a continuation of Ser. No. 690,567, filed Jan. 11, 1985, now abandoned.
This invention relates to techniques for improving adhesion between polymers, and more particularly to improved adhesion between organic polymer substrates and metals which have very weak chemical bonding with the constituents of these substrates.
In the microelectronics industry, in particular, thin films of metals are often deposited on insulating substrates, where the insulators are typically organic polymers, such as polyimide and other types of plastics and polyesters. In current microelectronics technology, polymer materials and their interfaces (such as those with metals) play a very important role. With the trend toward higher speed semiconductor devices and higher density circuits on semiconductor chips, signal delays on chips have become comparable to or shorter than those associated with the packaging of the chip-i.e., wiring between chips located on the same or different substrates, cards, boards, etc. As the packaging delays have become comparable to chip delays, new packaging schemes utilizing thin film metal interconnections electrically isolated by polymeric materials have been adopted. These techniques have been motiviated by cost and reliability considerations, as well as by the required compatability with manufacturing automation.
The use of polymers offers a number of intrinsic advantages in microelectronics applications. Polymers are low in cost and relatively easy to handle, and in addition offer a variety of desireable properties. These properties include flexibility, planarizability and stability. The polymers generally can be tailored to match the needs of the particular application by using polymer chemistry and engineering. Additionally, they can be processed readily in a variety of ways, such as plasma etching, reactive ion etching, and laser ablation. Relatively high temperature stability is especially attractive for those applications where annealing steps are involved in the processing. For example, polyimide is a widely used insulator since it is stable to approximately 400° C.
The miniaturization of semiconductor devices and other microelectronic devices requires a further reduction of device dimensions and multilevel wiring schemes on the chip. The insulators used between these wiring levels have to fulfill a number of requirements, which are generally well met by various types of organic insulators, including polymers. These insulators must be applied with good thickness uniformity, have excellent electrical integrity and thermal stability, and exhibit good adhesion to the metal layers they keep separated. This last problem-that of metal/polymer adhesion-has not been entirely successfully addressed by the industry.
Many metals bond very well to polymer-type substrates, such as polyimide. The metals which generally bond well to provide good adhesion are those which form relatively strong chemical bonds to the polyimide atomic constituents (carbon, oxygen, nitrogen, and hydrogen). However, many metals are very weakly interacting with the microscopic constituents of these types of substrates and do not bond well. For these metals, the adhesion problem described previously has not been solved.
Various treatments have been utilized in the prior art to enhance adhesion between metals and polymers. These techniques include roughening of the polymer surface and chemical pre-sensitizing prior to the deposition of a metal, as described in U.S. Pat. No. 3,881,049.
Another technique for depositing copper on polyimide was described by M. Terasawa et al at the International Symposium on Hybrid Manufacturing (ISHM), Oct. 31-Nov. 2, 1983, Philadelphia. In this technique, copper and aluminum are deposited by ion-plating using electron beam deposition in order to enhance the conductor adhesion. Chromium is used as a substrate metal to provide enhanced adhesion between the copper or aluminum and the Cr-coated substrate.
The use of heating to promote adhesion between metals and polymers is well known in the art. For example, reference is made to U.S. Pat. No. 4,152,195, in which a polyimide resin layer is partially cured by heating to approximately 200° C. for 20 minutes and then to approximately 275° C. for 30 minutes, prior to metal deposition. After a metal is vapor deposited on the partially cured polyimide, the entire structure is fully cured by heating to 350° C. This reference also describes other techniques to improve the adherence of aluminum layers to polyimide surfaces. These prior techniques include roughening of the polyimide surface by sputtering, by chemical solutions, or by the presence of oxygen atoms and electrical discharges which partly burn the polyimide surfaces. Fully curing the polyimide prior to metal deposition is also described in this reference.
Another reference which describes improved adhesion between copper and polyimide is U.S. Pat. No. 4,386,116. In this reference, the polyimide is heated to a temperature of approximately 360°-380° C. during the evaporation of chrome-copper. A critical substrate temperature of 360°-380° C. was required to produce copper-copper interface vias with good electrical conductivity and to provide optimum polyimide stability. It was suggested that a chemical reaction between copper and nitrogen in the polyimide provided the necessary adhesion.
In the prior art, it has been the situation that the polyimide substrate is heated to a temperature as high as possible, that is, to a temperature approximating the c-curing temperature of the polyimide. For example, chromium is generally deposited on polyimide at high temperatures, such as approximately 360°-380° C., in order to provide enhanced adhesion. Thus, the teaching of the prior art has been to use temperatures as high as possible in order to promote enhanced bonding of a metal to a polymer substrate, within the limits of the temperature stability of the polyimide. This approach has been used both for metals which chemically bond (i.e., strongly interact) with the polymer substrate as well as those which are only very weakly interacting with the substrate.
In the course of applicants' experimentation, it has been discovered that, for those metals which have only very weak bonding with polymer substrates, a critical range of substrate temperatures and deposition rates exists in which adhesion can be maximized. Applicants have discovered that intermixing of the depositing metal atoms and the polymer substrate occurs at the interface as a result of heating. This intermixing is increased when the metal atoms have sufficient time to diffuse into the polymer substrate before combining with further incoming metal atoms. The time required for diffusion into the polymer substrate is shorter at higher substrate temperatures. Thus, the substrate temperature, deposition rate, and annealing time are adjusted so that diffusion of the metal atoms (i.e., intermixing) into the polymer substrate occurs prior to the combination of the metal atoms with other metal atoms. If the deposition rate of the arriving metal atoms is small with respect to the diffusion rate of metal atoms into the substrate, significant intermixing will occur. However, applicants have discovered that the amount of intermixing has to be optimized in order to maximize adhesion. It has also been found that, contrary to the teaching of the prior art, a substrate temperature less than the temperature at which the polymer cures produces optimum intermixing and, therefore, maximum adhesion. For example, in the case of copper or nickel deposition onto polyimide, a substrate temperature of approximately 240°-280° C. provides maximum adhesion. Generally, the optimal temperature range is approximately (0.6-0.8) Tc, where Tc is the curing temperature of the polymer substrate.
Accordingly, it is a primary object of the present invention to provide a technique for depositing selected metals onto polymer substrates with improved adhesion, where the metals are those which only weakly intrinsically bond to the atomic constituents of the polymer substrate.
It is another object of the present invention to provide improved polymer substrate-metal structures which exhibit improved adhesion, where the metal overlayers are those which normally only weakly bond to the substrates.
It is another object of the present invention to provide improved adhesion of Ni, Cu, and Al to polymer substrates.
It is another object of the present invention to maximize the adhesion between intrinsically weakly bonding metals and organic substrates, which technique can be readily adapted into manufacturing lines.
It is another object of this invention to provide improved packaging techniques and microelectronic structures having enhanced adhesion at metal-polymer interfaces.
It is another object of this invention to provide structures including interfaces between polymers and metals that intrinsically bond very weakly to the polymer constituents, where enhanced adhesion is produced between the metals and the polymers.
This invention relates to the provision of metals on organic substrates where there is enhanced adhesion between the metals and the substrates. These metals are those which intrinsically weakly interact with the atomic constituents of the organic substrates, where the substrates include the commonly used polymer-type substrates. It has been found that optimum intermixing between the metals and the substrates and presumably optimum concentration gradients of metals into the organic substrates, and therefore increased adhesion, occur when the substrate temperature and arrival rate of metal atoms on the substrate are so chosen that the arrival rate of metal atoms is small with respect to the diffusion rate of metal atoms into the substrate.
Contrary to the teaching of the prior art, enhanced adhesion occurs at a temperature less than the curing temperature of the substrate. Generally, the substrate temperature during deposition of the metal is approximately 0.6-0.8 of the substrate curing temperature. If the time for metal atoms to diffuse into the substrate is approximately the same or less than the time required for another metal atom to arrive in the vicinity of a deposited metal atom, diffusion into the substrate will predominate, and strong intermixing will occur. However, the amount of intermixing has to be optimized to produce maximum adhesion.
It has further been found that the amount of intermixing into the substrate can be controlled by varying the time during which the polymer is maintained at the deposition temperature. For optimum adhesion, diffusion should be over a distance of approximately 1000 angstroms, and can be as little as about a few hundred angstroms. Thus, the substrate temperature and deposition rate are adjusted so that optimum intermixing occurs into the substrate, to a distance less than about 1000 angstroms. After this intermixing and after a few atomic layers (30-50 angstroms) of the metal are deposited on the substrate surface, the deposition conditions can be changed.
The metals which can be deposited in this manner are those which weakly bond to the substrate, and include metals such as Ni and Cu. Although Al is somewhat more chemically reactive with the organic substrates than these other metals, it has been found that it also follows these general guidelines for increased intermixing and therefore enhances adhesion. Other metals which can be deposited in this manner to provide maximum adhesion include Ag, Au, Ta, Ir, Rh, Pd, Pt, Zn, and Cd. The organic substrates are those which are polymer-like substrates including polyimide, mylar (a trademark of E. I. dePont de Nemours, Inc.), polyesters, plastics, epoxies, polyethylene, polystyrene, etc.
These and other objects, features, and advantages will be apparent from the following more particular description of the preferred embodiments.
FIG. 1 is an illustration of a structure in which a thin metallic layer is located on an organic substrate, such as a polymer.
FIG. 2 is an illustration of a more complex structure in which a semiconductor, glass, or ceramic wafer includes overlying metal layers M1, M2 which are separated by a polymer insulator P, such as polyimide.
FIG. 3 illustrates the distribution of copper in a polyimide substrate, as a function of the substrate temperature, for four different substrate temperatures ranging from room temperature (25° C.) to 300° C. The number of copper atoms/cm2 evaporated on the samples is indicated for each temperature.
FIG. 4 is a schematic plot of adhesion strength and intermixing distance versus substrate temperature, which illustrates the discovery of the present invention.
FIG. 5 is a plot of peel strength measured in grams per millimeter as a function of evaporation temperature, for copper strips of various widths evaporated onto polyimide substrates.
FIG. 6 is also a plot of peel strength versus evaporation temperature for a copper strip deposited on polyimide, in the temperature range 240°-360° C.
In the practice of this invention, it has been found that metals which intrinsically weakly bond with organic substrates, such as polymers, can be formed with enhanced adhesion to the substrates if intermixing between the metal atoms and the substrate is optimized. This is done by having the substrate temperature be within a critical range which is dependent upon the nature of the substrate. It has been found that if the substrate temperature is kept in a range between approximately 0.6 and 0.8 of the curing temperature Tc of the material forming the substrate, and if a proper deposition rate is used, intermixing is optimized to provide strong adhesion between the deposited metal and the substrate. In particular, it is desirable that the metal atoms arrive at the substrate at a rate which is slow with respect to the rate of diffusion of the metal atoms into the substrate. If this occurs, optimum intermixing of the metal atoms and the substrate will occur over a distance of less than approximately 1000 angstroms into the substrate, and the adhesion of the metal to the substrate will be enhanced.
In general, when metal atoms arrive at a substrate, by processes such as evaporation, sputtering, etc., they can chemically bond to the substrate if they are strongly interacting with the substrate, or they can bond to one another if the rate of arrival of the metal atoms is rapid. If either of these events occurs, there will be little intermixing of the metal atoms within the substrate itself. For metal atoms which only weakly chemically bond with a substrate, it has been found that maximum adhesion to the substrate is produced only if there is optimum intermixing of the metal atoms and the substrate. While increased temperatures have been used in the past to enhance adhesion, it has now been found that there is a critical temperature range, less than the curing temperature, which will maximize adhesion of the metals to the substrate. If the substrate is kept at this critical temperature range during the early stages of metal deposition and, if the metal atoms arrive at a rate which is slow with respect to the rate of diffusion of these metal atoms into the substrate, optimum intermixing between the metal atoms and the substrate will occur and the adhesion will be maximized. After the intermixing has been optimized and a few atomic layers (30-50 angstroms) of continuous metal are formed on the substrate surface, the rest of the deposition can continue without critical concern with respect to the deposition conditions.
The adhesion of the metal film to the substrate is dependent on the amount of intermixing which occurs within a depth of approximately 1000 angstroms from the surface of the substrate, and more particularly to a depth of about a few hundred angstroms. To provide maximum adhesion, it is desirable that there be a relatively smooth gradient of metal atoms in the substrate over approximately a few hundred angstroms into the substrate. In particular, it has been found that if the arrival rate of the metal atoms on the substrate surface is approximately the same or less than the diffusion rate of metal atoms into the substrate, then intermixing will be optimized by controlling the the substrate deposition temperature, and optimum intermixing can occur in the top 1000 angstroms or less of the substrate, resulting in maximum adhesion.
Metals which can be deposited with maximum adhesion in accordance with this invention include Ni, Cu, and Al (even though Al is more somewhat strongly reactive with the substrate). Other metals which also can be deposited with maximum adhesion include Ag, Au, Ta, Pt, Ir, Rh, Pd, Zn, and Cd.
Substrates of particular interest in the practice of this invention include organic substrates having polymer chains, such as mylar (a trademark of E. I. duPont de Nemours, Inc.), polyimide, polyesters, epoxies, polyethylene, polystyrene, etc.
In the practice of this invention, the basic structure of the polymer does not seem to be altered, and the intermixing of the metal atoms in the polymer is primarily a process of metal diffusion into the polymer substrate. If chemical bonding between metal and polymer constituents were present, the likelihood of good adhesion to the substrate would be due to this bonding, but the invention has particular utility for use with those metal-substrate combinations where only very weak, or no, intrinsic chemical bonding to the substrate occurs.
In order to maximize adhesion between the metal and the substrate, it is desireable to have maximum intermixing of metal atoms and the substrate within a few hundred angstroms of the surface of the substrate (or to a maximum depth of about 1000 angstroms). One way to do this is to choose the substrate temperature and deposition rate so that a quasi equilibrium is obtained wherein the diffusion rate of metal atoms into the substrate occurs much more rapidly than the arrival rate of the metal atoms at the substrate. Following the general guideline of using a substrate temperature of approximately (0.6-0.8)Tc, the deposition rate is calculated with respect to the rate of diffusion of the metal atoms into the chosen substrate. Using this deposition rate, substrate temperature, and annealing time, a concentration of metal will be found in the first few hundred angstroms of the substrate. Once a few atomic layers of continuous metal are formed on the surface of the substrate, these substrate temperature and deposition rate conditions can be changed. It is only intermixing that occurs between metal atoms and the substrate which provides good adhesion.
Another way to provide maximum adhesion by optimizing intermixing is to use a fixed deposition rate and change the substrate temperature during deposition until the concentration of metal atoms is optimized in the top few hundred angstroms of the substrate. That is, measurements can be made of the substrate at different temperatures for a fixed deposition rate in order to determine the concentration of metal atoms in the substrate. This is done by known techniques, such as medium energy ion scattering (MEIS) and cross section transmission electron microscopy (TEM). When there is a concentration of metal atoms in the top few hundred angstroms of the substrate, the proper temperature of the substrate will be known for that deposition rate. Of course, if the deposition rate is too rapid, it can be reduced so that the process of metal atom diffusion in the substrate can occur for different substrate temperatures.
As a general guideline, deposition rates which provide optimum intermixing are less than about 10 angstroms/second, but can be higher if diffusion into the substrate occurs rapidly. For example, for the formation of copper or nickel layers on a polyimide substrate, deposition rates of a few (1-3) angstroms per second are preferred when the substrate temperature is 240°-280° C. These conditions can be maintained for about 1/2-2 minutes, which will produce a metal film of 30-60 angstroms thickness on the substrate. After that, the deposition conditions can be changed to more rapidly deposit the remaining thickness of metal film.
With these steps generally in mind, reference will now be made to the drawing. In particular, FIGS. 1 and 2 illustrate representative environments in which the invention can be practiced to provide improved structures. In FIG. 1, a substrate 10 has a metal layer M thereon. Substrate 10 is one of the organic substrates described hereinabove, while metal layer M is one of the aforementioned metals which weakly interact with polymer substrate 10.
FIG. 2 shows a structure of the type which might be present in a semiconductor circuit or package. Here, layer 12 can be a semiconductor, a glass, or a ceramic layer, etc. which has a first metallic coating M1 thereon, and a layer of electrically insulating material such as a polymer P. A polymer which is often used for this purpose is polyimide. Located on the polymer P is a second metal layer M2, which is a metal that weakly bonds with the polymer layer P.
In general, this invention relates to any type of structure including a metal-substrate combination, where the metal and the substrate are those which have been mentioned previously. This type of structure occurs in many different environments, such as those illustrated in FIG. 2.
In order to understand the application of the invention to different metal-substrate combinations, several examples will be presented. The first example is the deposition of copper onto polyimide. The copper layers were evaporated from small beads, molten onto a tungsten wire in vacuum. The evaporation rate was of the order of 2 angstroms per minute. The polyimide substrates were prepared by spinning a thin layer of polyimide onto an Al-coated Si substrate and then curing the sample (annealing in an inert gas ambient) to cause imidization. After mounting in the ultra high vacuum (UHV) chamber, the samples were annealed at 300° C. for five minutes to desorb the water present in the polyimide film. Copper was evaporated on these films at room temperature (25° C.), and at elevated temperatures. As will be seen, temperatures of 150° C., 250° C., and 300° C. were chosen. The ion scattering analysis to determine the presence of copper in polyimide was performed at room temperature.
After completion of the ion scattering experiments, the samples were taken out of the UHV chamber and further prepared for TEM analysis.
In these studies, medium energy ion scattering (MEIS) was used to characterize the polyimide-Cu interface prepared in UHV at temperatures between 300° and 600° K. Afterwards, the samples were studied with cross-section transmission electron microscopy (TEM) to obtain additional information on the interface morphology.
FIG. 3 shows an energy spectrum for different samples of copper evaporated on polyimide. Samples were evaporated at room temperature (R.T.), 150° C., 250° C., and 300° C. The number of counts of backscattered ions is plotted against the backscattered energy for each of these four samples. The number of copper atoms/cm2 evaporated on the samples is indicated for each substrate deposition temperature. Copper at the surface is indicated by the vertical line 14 at the right hand side of this energy distribution plot, while the numeral "2" is merely a scale factor. From these plots, it is evident that there is very little diffusion of copper into the polyimide when the polyimide is held at room temperature. In this case, most of the copper is present very close to the surface of the polyimide. When the substrate temperature is increased to 150° C., there is some diffusion of copper into the polyimide but the maximum amount of copper is found close to the surface of the polyimide. However, at 250° C., there is strong diffusion of copper into the polyimide and a maximum distribution of copper at some distance below the surface of the polyimide. This is a temperature in the range where optimum intermixing occurs.
At 300° C., there is strong diffusion of copper into the polyimide, but the temperature is sufficiently high that the copper diffuses evenly throughout the depth of the polyimide. This will not provide good adhesion since most of the copper merely diffuses into the depth of the polyimide and its concentration within a few hundred angstroms of the interface is insufficient for achieving good adhesion. In this situation, the diffusion rate into the polyimide is too high with respect to the arrival rate of copper atoms at the polyimide surface so that a quasi equilibrium of the type heretofore mentioned cannot be well established. From data on the peel strength of these films, the adhesion of copper films deposited at 300° C. is signficantly less than that of copper films deposited at 250° C. Thus, even though intermixing is greatly increased at 300° C. due to increased diffusion, the intermixing is not optimized and maximum adhesion does not result.
From the changes in the copper peak shapes it is clear that copper strongly diffuses into the polyimide. Even though the coverages at high temperatures are significantly larger than at low temperatures, the observed signal intensities are much smaller. This again is due to diffusion of copper deep into the polyimide. The tails of scattering intensity at lower energy are a direct indication of this diffusion. However, the depth distributions observed do not resemble simple diffusion profiles. In particular, the occurrence of a maximum concentration below the surface indicates that simple diffusion is not taking place. These spectra indicate the existance of copper clusters buried at the polyimide.
It appears that the copper forms clusters (spheres) at all of the temperatures which were studied. After deposition at 300° K., the copper spheres do not grow upon annealing. The copper atoms have become immobile and are only covered by a thin polyimide film upon annealing. However, with increasing deposition temperature the size of the copper spheres increases. At a given temperature, the spheres all have approximately the same size.
These observations can be explained by considering the low deposition rates used in the study. At 2 angstroms per minute, the copper atoms arrive at the polyimide surface one by one. They do not interact with other copper atoms arriving on the surface at the same time. The individual copper atoms do not have a strong chemical interaction with the polyimide. However, they can diffuse freely through the polyimide. The diffusion length of the copper in the polyimide is limited by the temperature. Thus, at room temperature the copper atoms do not diffuse very deeply into the polyimide, but at high temperatures they do. The copper atoms diffuse around until they meet other copper atoms with which they conform a cluster. Such clustering is favorable because of the cohesive energy of solid copper. Both the depth at which the copper spheres nucleate and the size of the spheres are related to the diffusion length. Chemical processes do not seem to be of any particular importance in the formation of the clusters, although they may occur at the cluster surfaces. The clusters have electronic properties very different from those of isolated copper atoms, and the associated chemistry may very well be different.
Copper is characteristic of the types of metals which intrinsically weakly bond with these organic substrates. For these metals, there is a criticality of the substrate temperature with respect to intermixing and maximum adhesion. This critical temperature range occurs at temperatures less than the curing or glass transition temperatures of the substrate. These metalpolymer interfaces follow a physical characteristic, in contrast with those wherein stronger chemical processes occur. In the latter situation, these strong chemical processes are likely to arrest strong diffusion and give rise to much sharper interfaces which are less affected by the deposition temperature. In fact, this has been seen for the deposition of Cr on polyimide, wherein a critical temperature range for maximum adhesion, less than the substrate curing temperature, was not found. FIG. 4 plots adhesion strength and intermixing distance versus substrate temperature, and illustrates what is meant by optimum intermixing.
Intermixing is generally increased as substrate temperature increases, due to enhanced diffusion of metal atoms into the substrate. Thus, as this temperature increases, the distances into the substrate through which the metal atoms diffuse also increase. This is indicated by the dashed curve in FIG. 4, showing a generally increasing distance over which intermixing occurs.
However, where it would at first seem that maximum intermixing, and therefore maximum temperature, is needed to maximize adhesion of the metal to the substrate, such is not true. The solid curve, plotting adhesion strength, shows a maximum at temperatures less than the temperatures where intermixing distances are maximized. Thus, the amount of intermixing which yields maximum adhesion is termed "optimum" intermixing, and is that which occurs at temperatures in the range (0.6-0.8)Tc. This unexpected discovery forms the basis for the present invention.
FIGS. 5 and 6 plot the peel strength, measured in grams per millimeter, against substrate evaporation temperature for copper samples of various widths deposited on polyimide. FIG. 5 covers the temperature range of room temperature (RT)-250° C. for some samples, while FIG. 6 covers the temperature range 240° C.-360° C. for other samples. The samples were measured before and after baking at 300° C. in a nitrogen atmosphere. From the curves of FIG. 5, it is apparent that a maximum adhesion strength for these samples exists at a temperature range 240°-280° C., and more particularly at approximately 260° C. This critical substrate range existed for all of the samples of copper on polyimide, regardless of the sample width.
FIG. 6 plots the peel strength of other copper samples on polyimide versus the substrate evaporation temperature, for four temperatures: 240°, 280°, 320°, and 360° C. Plots are shown for samples which have been nitrogen baked and for these samples before nitrogen baking. For these samples, the peel strength was maximized at a deposition temperature of 240° C., and diminished thereafter. The difference between these samples and those depicted in FIG. 5 relates to the different treatment given to each set of samples.
The second set of samples (FIG. 6) didn't go through the whole temperature range from approximately 100° C., so the overall behavior for these samples is not as clear. However, the results do indicate the degradation of adhesion due to excess diffusion at high temperatures. This means that an optimum intermixing is important.
In all of the samples studied, it was determined that intermixing of the metal and polyimide was optimized in the critical temperature range 240°-280° C. In particular, the metal/polymer intermixing was greater and more optimum than for samples deposited at 25° C. followed by annealing. This occurred in spite of the fact that the latter involved longer heat treatments than direct deposition in the temperature range 240°-280° C. The point is simply that it is intermixing during deposition which is important.
In further experiments, nickel was deposited on polyimide at different temperatures ranging from room temperature to 360° C. For nickel, it was found that maximum intermixing, and therefore adhesion, occurs at a critical temperature range less than the c-cure temperature (360° C.) commonly used to cure the polyimide substrate. The temperature range 240°-280° C. is also very favorable for nickel deposition. In the following Table I, copper and nickel were deposited on polyimide, and the peel adhesion strength of the samples in grams/mm was measured. This was done for samples deposited at different deposition temperatures, with and without post-annealing. The nickel samples were approximately 1000 angstroms thick, while the copper samples were 8 microns thick. The deposition rate for the copper and nickel samples was about 10 angstroms/second.
TABLE I______________________________________Metal/Polyimide Peel Adhesion Strength (g/mm)DEPOSITION TEMPERATURE (°C.)ME- 25 240 280 320 360TAL (a) (b) (a) (b) (a) (b) (a) (b) (a) (b)______________________________________Cu -- -- 18.4 32.3 16.1 29.6 11.8 25.0 11.5 15.4Ni 0.9 0.7 -- -- 36.2 32.0 -- -- 10.1 9.1______________________________________ (a) without postannealing (b) with postannealing at 360° C./ 30 min: Cu: in nitrogen atmosphere Ni: in 1 × 10-6 torr vacuum
Substrate heating is used shortly before (one hour or less) metal deposition, and during metal deposition. Of course, once a few atomic layers of continuous metal are formed on the substrate surface, intermixing is complete and the substrate temperature as well as the deposition rate can be changed to continue growing the rest of the film.
Although the increased adhesion of these metals to the substrate can be explained by enhanced intermixing, recent ultraviolet and x-ray photoemission studies have demonstrated particular changes in the chemical and material characteristics of the polyimide surface and the metal-polymer interface at these critical temperature ranges, as compared to both higher and lower temperatures. These changes may explain the results of Table I.
Table II shows data corresponding to other Ni-polyimide interfaces where the adhesion strength has been measured as a function of deposition temperature and diffusion annealing. As with the data of Table I, the present data indicates that maximum peel adhesion strength was found for deposition at 280° C., for all samples, i.e., without regard to the annealing process. This high peel adhesion strength for samples deposited at 280° C. was found to be maintained even under a very detrimental temperature and humidity (T and H) test which subjected the samples to 1000 hours at 85° C. and 80% relative humidity. For these samples, the nickel was deposited at different temperatures after the substrate was heated for about 20 minutes prior to evaporation of the nickel.
TABLE II______________________________________Polyimide-Ni/Cu Peel Adhesion Strength (in gr/mm) as aFunction of Deposition Temperature and Diffusion AnnealingANNEALING SPECIMEN SPECIMEN GROUPSCHEDULE NO. A* B* C*______________________________________As received 1 11.8 35.4 1.0(No Annealing) 2 9.3 37.1 .9405° C./15 min 3 10.2 27.1 .7 4 9.9 32.2 .720 min 5 7.2 32.8 -- 6 9.6 29.1 .840 min 7 11.8 27.8 .8 8 9.8 35.1 .7360° C./15 min 9 7.3 27.0 .8 10 8.1 29.5 .830 min 11 9.5 32.8 .7 12 8.7 31.2 .760 min 13 10.2 33.5 .7 14 6.2 30.6 .7280° C./20 min 15 10.1 19.2 .8 16 10.0 27.3 .940 min 17 10.5 33.5 -- 18 7.1 24.7 .990 min 19 9.8 34.8 .9 20 9.8 33.6 --T & H/1000 hr 21 9.3 28.7 1.2 22 9.1 33.2 1.4______________________________________ *The substrate temperatures of specimens A, B and C during metallization were 360, 280 and 25° C. respectively.
In the practice of this invention, the technique for depositing metal atoms is not critical. Any technique, such as evaporation or sputtering, can be used. Also, the results showing improved adhesion at critical substrate temperatures less than the curing temperature remain, regardless of post deposition conditions (such as post-annealing). The important factor is the optimization of intermixing during the initial stages of metal deposition.
What has been described are structures and techniques for providing maximum adhesion between a certain class of metals and polymer substrates on which the metals are deposited. These are metals which weakly bond or do not bond at all to the substrates. A possible exception in this metal group is Al, which does exhibit some weak bonding to the substrate constituents, but which undergoes enhanced intermixing in the critical temperature range.
The temperature range of approximately (0.6-0.8) Tc is substantially definite, but does include some leeway in it, such as a few degrees outside 0.6 Tc and 0.8 Tc.
For example, for polymers with very low curing temperatures, such as polyethylene for which Tc is about 200°, a usable upper temperature can approach 0.85 Tc.
While the invention has been described with respect to particular embodiments thereof, it will be appreciated by those of skill in the art that other embodiments can be envisioned within the spirit and scope of this invention. For example, combinations of these metals can be deposited at the same time onto the substrates, and the substrate temperatures can be adjusted within the critical temperature range for different deposition rates, in order to tailor the amount of adhesion between the metal and the substrate. Also, the invention can be used in any type of application such as, for example, packaging, circuitry, printing, etc.
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Evans does not deserve a title fight at middleweight. With that said...I'd love to see him get one simply because he feels like a bigger threat to Anderson's title than anyone else that actually fights at MW right now IMO
Evans does not deserve a title fight at middleweight. With that said...I'd love to see him get one simply because he feels like a bigger threat to Anderson's title than anyone else that actually fights at MW right now IMO
Favorite Fighters
Chuck Liddell|BJ Penn|Lyoto Machida|Kid Yamamoto|Urijah Faber|Dan Henderson|Daniel Cormier|Anthony Pettis
Rashad vs Weidman fights Vitor
Problem solved.
Anderson Silva:
Best Fighter on the planet.
Rashad Evans knows he'd beat Anderson Silva, not gunning for 'bittersweet' fight | News
"I'm not a good matchup for him," Evans told MMAjunkie.com (UFC blog for UFC news, UFC rumors, fighter interviews and event previews/recaps). "I'm sure he's not chomping at the bit to fight me. He doesn't really have anything to gain from fighting me, so I don't know if he would even want to fight me. I don't know why he would go out of his way to fight somebody like me. If the UFC is not going to make him fight me, then I don't see why he would fight me.
"Besides that, I love Anderson. He's a great guy outside of the cage, and he's one of my favorite fighters to watch inside the cage. To me, to fight him would be a little bittersweet because I know I would beat him. I know I would beat him."
The 5-foot-11 Evans actually made his UFC debut as a heavyweight, defeating Brad Imes in the final bout of "The Ultimate Fighter 2" to claim that season's tournament title. He immediately dropped to light heavyweight, where he became UFC champion in 2008 with a win over Forrest Griffin. He would later surrender the title to Lyoto Machida, and he recently failed in a bid to gain it back by losing a unanimous decision to former friend and training partner Jon Jones.
That was nine months ago, and Evans admits he needed a little time away from the sport to again find his motivation.
"After you climb the top of the mountain and you don't get where you want to go and you kind of fall down a bit, it takes a little bit of a mental break to help to kind of recuperate and get yourself feeling right to get back out there and climb that mountain again," Evans admitted. "I did find the motivation again, but it was difficult.
"That fight with Jones, it took a lot out of me emotionally more than anything. Not having the results I wanted, it was a bit of a heartbreak for me. It was just more a relief that that part was over in my life. I had to kind of come to peace with everything and the way things happened, and it was kind of closing a chapter in my life. That was something important for me to have happen."
Evans kept busy by working with FUEL TV as a UFC analyst, and he hopes he can transition in a full-time broadcasting gig when his fighting days are over. But he's not ready to make that switch just yet.
Instead, he now meets Antonio Rogerio Nogueira (20-5 MMA, 3-2 UFC) at this weekend's UFC 156 event in Las Vegas. The bout serves as the co-main event on the evening's pay-per-view broadcast.
Evans is a heavy favorite in the fight, and some pundits wondered aloud why the fight was booked with "Little Nog" struggling through a 1-2 stretch. However, Evans said the fight booking provided plenty of motivation for him, and he's looking forward to competing against such a respected opponent.
"I have huge respect for the Nogueira brothers and the legacies that both of them have created," Evans said. "At the end of the day, when my career is said and done, I want to say that I competed against some of the best guys in the business, and he's somebody that I consider one of the best guys in the business. He and his brother are both legends, and I'm excited to compete against him.
"'Little Nog' took some time off, and I think that kind of refreshes the body both physically and mentally. With the time off and a fresh feel, not to mention the fact that he's got incredible heart, I'm expecting a good fight. I'm going to go out there and put on a good performance and bring it."
But what comes next isn't exactly clear. His fight with Jones was one of the most anticipated of 2012, but the champ's victory was undeniable. A rematch wouldn't seem to be in the cards for quite some time, but Evans isn't fully letting go of the possibility.
"I still watch Jon, and I love to see him fight," Evans said. "I love to see his creativity. I still watch him, and I still want to get a chance to fight him again. I know and I believe that if I fight him again, things will definitely be different. I feel like I've got what it takes to beat him. I've studied his game, and I know it. I feel like it would be a different fight this time around.
"I'm just excited to climb the ladder again, and however long it takes, it takes, but I'm a student of the game, and that's what I want to continue to be. I want another chance to fight for the belt, and when I do, it will be worthwhile for me."
So what about a quick trip to middleweight for a meeting with Silva? While fans have asked about it, the matchup doesn't seem to be a part of the UFC's immediate plans. And for that matter, Evans isn't even sure he could make the weight.
"I would have to do a practice cut and see what would happen before I even would agree to something like that," Evans said. "It's kind of hard for me to make 205 sometimes. So 185, I don't know what I'd have to do. I'd probably have to lose some weight in my legs or something, and I don't know how to do that."
He's also not looking past the challenge ahead of him this weekend, even if others might be.
"They're overlooking Nogueira, but I'm not," Evans said. "They've already got me winning the fight and wanting to fight at 185. But for me, it's first things first, and that's fighting Nogueira. That's the only thing I really care about right now. Anderson is I guess a fantasy fight. It has to be the right deal for it to even happen.
"It's just a matter of getting that belt back around my waist. I just want to go out there and compete with the best guys. If I get a chance to fight Jon Jones or Anderson Silva or whoever may have the belt at the time, that's what it's about. I just want to go out there and compete and have fun competing."
And if you want beef, then bring the ruckus
Rashad to the press:
- I can beat Jon Jones
- Jones destroys Rashad in a fairly lopsided fight
- I think Jon Jones would lose to Anderson Silva
- I think I can beat Anderson Silva
Blah he gets beat worse by Silva and possibly knocked out quicker than when Machida cleaned his clock.
Anderson Silva:
Best Fighter on the planet.
If Rashad destroys Nogueira that could set up the hype train and start the whole respect issues with Silva.
Looking back at Rashad's fights against Thiago Silva and Machida I can't see him protecting his chin well enough for 5 rounds against Anderson though
I like rashad, but i'll be rooting for the underdog, Nogueira, in this fight.
Silva's getting to the age and mind set were training gets harder to complete to there full potential. Rashad has a shot a a less than Silva but his best shot is at a dec.
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Fact-Finding without Facts
The Uncertain Evidentiary Foundations of International Criminal Convictions
- Author: Nancy A. Combs
- Date Published: July 2010
- availability: In stock
- format: Hardback
- isbn: 9780521111157
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Fact-finding Without Facts explores international criminal fact-finding – empirically, conceptually, and normatively. After reviewing thousands of pages of transcripts from various international criminal tribunals, the author reveals that international criminal trials are beset by numerous and severe fact-finding impediments that substantially impair the tribunals' ability to determine who did what to whom. These fact-finding impediments have heretofore received virtually no publicity, let alone scholarly treatment, and they are deeply troubling not only because they raise grave concerns about the accuracy of the judgments currently being issued but because they can be expected to similarly impair the next generation of international trials that will be held at the International Criminal Court. After setting forth her empirical findings, the author considers their conceptual and normative implications. The author concludes that international criminal tribunals purport a fact-finding competence that they do not possess, and as a consequence, base their judgments on a less precise, more amorphous method of fact-finding than they publicly acknowledge. The book ends with an exploration of various normative questions, including the most foundational: whether the international tribunals' fact-finding impediments fatally undermine the international criminal justice project.Read more
- Considers ways that fact-finding accuracy can be improved in international criminal tribunals
- Explores international criminal fact-finding - empirically, conceptually, and normatively
- Based on the review of thousands of pages of transcripts from various international criminal tribunals
Reviews & endorsements
"Fact-Finding Without Facts is stunning in its quality, meticulous in its methodology, and revolutionary in its effects. Combs cracks the conventional wisdom that international criminal trials successfully determine who did what to whom during the cataclysm of mass atrocity. Hers is a grounded critique -- piercing, precise, yet itching with the promise of institutional reform. Fact-Finding Without Facts is among the most impressive publications to appear in the past decade in the field of post-conflict justice."
Mark A. Drumbl
Class of 1975 Alumni Professor of Law
Director, Transnational Law Institute
Washington and Lee University, School of Law
See more reviews
"Nancy Combs's latest book, Fact Finding Without Facts provides a startling indictment of the fact-finding process in international criminal law. Her conclusion that "more than 50% of the witnesses appearing in these trials testified in a way that was seriously inconsistent with their pre-trial statements" is chilling. Those interested in social epistemology, normative inquiry, and legal theory, as well as practitioners in international criminal law cannot afford to ignore this brilliant book."
Larry May
W. Alton Jones Professor of Philosophy and Professor of Law
Vanderbilt University
"Fact-Finding Without Facts is an excellent and unique study on what is the core of every criminal trial, proper and accurate fact-finding. Based on meticulous research, Combs makes us aware of the fragile state of international criminal proceedings. The field of international criminal law is in dire need of this type of critical study for further improvement. But Combs not only criticizes, she also offers highly valuable recommendations. This book is a must-read for everybody who sincerely wishes to improve the quality of fact-finding in international criminal trials."
G. K. Sluiter
Professor of International Criminal Law, University of Amsterdam
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Product details
- Date Published: July 2010
- format: Hardback
- isbn: 9780521111157
- length: 430 pages
- dimensions: 235 x 158 x 25 mm
- weight: 0.7kg
- availability: In stock
Table of Contents
1. The evidence supporting international criminal convictions
2. Questions unanswered: international witnesses and the information unconveyed
3. The educational, linguistic, and cultural impediments to accurate fact-finding at the international tribunals
4. Of inconsistencies and their explanations
5. Perjury: the counter-narrative
6. Expectations unfulfilled: the consequences of the fact-finding impediments
7. Casual indifference: the trial chambers' treatment of testimonial deficiencies
8. Organizational liability revived: the pro-conviction bias explained
9. Help needed: practical suggestions and procedural reforms to improve fact-finding accuracy
10. Assessing the status quo: they are not doing what they say they are doing but is what they are doing worth doing?
11. Conclusion.
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Below is the poem entitled Daybreak which was written by poet
Shannon. Please feel free to comment on this poem. However, please remember, PoetrySoup is a place of encouragement and growth.
Read Poems by
Andrew Shannon
I wake on the sand
Right near the beach
You have yet to awake
Far out of reach
And Daybreak has arrived
A beauty unlike any other
Comparable only to us, girl
And how we love each other
So I gaze up alone
Marveling up at the sky
The warmth of the sun
Drying my eyes
I'm reflecting on us
Oh how each other we trust
I'm just so happy we're together
And I think to myself,
Just as this sun, we'll last forever
Then returning to be with you
I lay again now
Place my hand gently
On your warm tender shoulder
While I think of our lives today, love
And how they'll be when we're older...
I know there'd be no other way
So "I Love You" I make sure I say
To you, each and everyday
A comment has not been posted for this poem. Encourage a poet by being the first to comment.


text:
VCNB reporter wins statewide award
Earlier this spring, the New Mexico Medical Society announced Valencia County News-Bulletin reporter Julia M. Dendinger was named one of two recipients for its 2013 Guy Rader Award.
The award is given annually for excellent journalistic reporting in the field of health. Dendinger received the award for her 12-part series on addiction and recovery in Valencia County, which ran monthly in 2013.
This year was the first time in the award's history that the committee was unable to narrow down the entries to select a single reporter as this year's winner, wrote Angela Chair MD, chair of the society's public relations committee.
The series delved into addiction and recovery in the county, focusing on what happens after a person decides to become clean and sober.
"I was thrilled when they contacted me," Dendinger said. "It was a project I felt strongly about and I am so proud that it was recognized."
Dendinger went on to say that the topics of addiction and recovery need to be talked about more often to help diminish the stigma.
"We all know someone — a friend, family member, coworker — who has struggled with addiction," she said. "And if you think you don't, you really are fooling yourself.
"Our goal with this series was to let people know they aren't alone and there is something better out there. If just one person was able to make a change in their life because of the work we did, then this project was a success."
News-Bulletin Editor Clara Garcia said she is very proud of Dendinger, who has worked as the newspaper's county reporter since October 2006.
"Julia is one of the brightest and most diligent reporters I've ever known," Garcia said. "Her passion for her work and for this community is substantial, and we're extremely lucky to have someone with her talents at the Valencia County News-Bulletin.
"This series took an incredible amount of time and hard work, but her tireless efforts paid off with a series that, we believe, informed our readers of a very important issue."
The other winner for 2013 was Leigh Black Irvin, the health reporter for The Daily Times in Farmington. Irvin's article delved into a Farmington doctor's study of local honey's wound-healing properties.
The award is named in memory of Dr. Guy Rader, who was known for his special interest in the quality of published medical information.
Rader was a member of the American Academy of Pediatrics, chief of staff of St. Joseph Hospital in Albuquerque, and chairman of several committees of the New Mexico Medical Society.
At the time of his death in 1961, Rader was president of the Bernalillo County Medical Association, now known as the Greater Albuquerque Medical Association.
At the start of each year, the New Mexico Medical Society Public Relations Committee solicits entries from newspapers across the state for a news story, series, or column published between January 1 and December 31 of the prior year.


text:
After the Yankees' 11th walk off win of the season, Steve listed the walk offs and linked to the relevant boxscores. With one home game remaining and the Yankees walk-off total up to 15, I thought it would be fun to run through them all, with the links pointing towards replays of each exciting walk off hit.
4/22- Yankees beat A's 9-7 on two run homer by Melky Cabrera in the 14th. It was Melky's second home run of the day.
5/1- The Yankees score 6 runs in the last two innings to turn a 9-4 deficit into a 10-9 win over the Angels. Jorge Posada delivered the game winning two run single.
5/15- The Yankees began Walk off Weekend with a 5-4 victory over the Twins. Brett Gardner had an inside the park home run, and Melky Cabrera notched a two run single off Joe Nathan to win it.
5/16- Walk off weekend continues as A-Rod hits a two run homer in the 11th to win it.
5/17- Walk off Weekend concludes with another extra inning victory over the Twins, as Johnny Damon's solo shot in the 10th provides the drama.
5/23- The Yankees come back against Brad Lidge and the Phils to win 5-4. A-Rod hit a two run homer to tie, and Melky's RBI single won it.
6/12- A-Rod pops up to Luis Castillo. You know the rest.
7/4- Roy Halladay serves up 3 homers and allows 5 runs, but the game goes to extras. Posada's RBI single wins it.
7/20- Matsui walks-off with a home run against the Orioles, after the Yankees make two plays at the plate to keep the O's at 1 run.
8/7- Game of the year, as the Yankees and Red Sox remain scoreless into the 15th. Once there, A-Rod launches a 2 run homer off Tazawa, and the division race was effectively over.
8/12- In the very next series, the Yankees avoided a let down and notched another walk off against the Jays, with Robbie Cano supplying an RBI single in the 11th.
8/28- Cano comes through again, this time with a 3 run homer in the 10th to defeat the White Sox 5-2.
9/8- Nick Swisher finally broke through at home with 2 home runs, including the game winner in the 9th.
9/16- Hideki Matsui tied the game in the 8th with a solo shot, and Frankie Cervelli delived an RBI single in the 9th for the victory. The Blue Jays were once again the hard luck losers.
9/29- Old friend Kyle Farnsworth shockingly blows a lead, as rookie Juan Miranda's infield single caps off a season full of drama.


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Monday, August 18, 2014
Goose Creek Police continue to search for an unidentified suspect in a Monday night shooting.
According to reports, police responded to a call reporting shots fired at S&K Apartments on Carolina Avenue. When officers arrived at 10:22 p.m., they found a 33-year-old black male slumped in a chair. He was stabilized by emergency responders and taken to Trident Medical Center.
The hospital had no record of the victim Tuesday afternoon,
Anyone with information is encouraged to contact the Goose Creek Police Department at 863-5200, extension 2313, or Crime Stoppers at 554-1111.
Continue to check back for details at ourgazette.com as they become available.
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text:
Police officers and deputies chasing a suspicious man through Hanahan and Goose Creek neighborhoods prompted the lockdown of two schools this afternoon, according to authorities.
School officials at Sedgefield Intermediate and Goose Creek High, which are both near Garwood and Red Bank roads, made the move as a precaution. They received no direct threats, and the police said they were never in danger.
The measure has since been lifted.
The ordeal began about 1:30 p.m. when a resident spotted a man carrying items through a backyard on Painted Bunting Way, which is off Foster Creek Road, according to Hanahan Police Department Lt. Michael Fowler.
The resident called the police and used her car to follow the suspected burglar, Fowler said. She saw the man first hide behind a neighborhood sign, then climb into a vehicle.
But she continued to follow him.
Deputies from the Berkeley County Sheriffs Office eventually caught up with the vehicle. But when it came to a stop, the man jumped from the passenger seat and ran.
Fowler said deputies chased the man, but lost him. Goose Creek police officers got in on the action, but they lost him, too, Fowler said.
To make a long story short, he got away, Fowler said.
Hanahan police detectives and Sheriffs Office investigators planned to speak with the driver of the vehicle in an attempt to figure out the mans identity.
Sheriffs Office spokesman Dan Moon said school administrators made the decision to lock down the buildings when they saw all the hubbub.
Reach Andrew Knapp at 937-5414 or twitter.com/offlede.
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text:
Set of 15 personalized note cards. Note cards measure 5.5" x 4.25". These flat cards are printed on heavy weight stock. Typestyle, positioning and imprint color only as shown. Blank white envelopes included. Printed return address available.
If bullet points (•) are wanted, please include in personalization. Will be printed in green ink as shown.


text:
The debate goes on about the Boston terrorists. I have always said, America is like the United Nations. Go to any city and you will find people from all around the world living together and getting along. And this makes America unique among nations -- it's a country made up of immigrants, where everyone has a chance to succeed.
But there are those who oppose our way of life and want to impose their way of life on us. Thankfully, America is well-equipped to fight this threat, but you cannot deny it exists, for America has been in a war on terrorism since 9/11.
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You've reached a sold out collectible that is no longer available.
Sideshow Collectibles proudly introduces the Predator 2 Legendary Scale bust. Depicted in approximately 1:2 scale, every aspect of the fearsome hunter is captured with painstaking attention to detail. This tremendous bust measures approximately 18 inches tall, each piece is individually hand painted and finished, creating an exceptional addition to any Predator display.
Size and weight are approximate values.
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