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Bethlehem NY
Stories from Bethlehem residents, shopkeepers and community organizations.
Posts filtered on Category
Tour the town in a trolley
Town historian Susan Leath will lead a trolley tour through the town, teaching those interested on the history of the town of Bethlehem. Tours will start this Friday and continue on Saturday, Feb. 20; Friday, March 5; Saturday, March 20; Friday, April 16 and Friday, April 30. All tours begin at 10 a.m. at the […] [Read More]
The North Bethlehem Chill Factors.
There's a chill in the air, and it's not from the Arctic front that brought sub zero temps to the area. Nope. In fact, this chill just might melt ice cream, Stewart's Ice Cream, to be exact. According to Spotlight Newspapers, Russell Road Partners, a developer, has submitted to the Bethlehem Planning Board, a proposal […] [Read More]
Grab a grocery cart.
This morning I woke up, and like Rip Van Winkle, realized things were different. As I looked around, the IGA in Slingerlands was now a deli. The A&P on Delaware Ave now a Spa. The Empire at the Four Corners is still a market, but under a different venue. Nick's is a Chinese restaurant. Markus' […] [Read More]
Normanside Country Club dining ends for the winter
From Steve Barnes… BETHLEHEM — Normanside Country Club in Delmar, which in past winters has served lunch to the public Thursday through Saturday, Sunday brunch and dinner Friday and Saturday, has closed its restaurant for three months. No reason for the change was given, but the golf club's Web site says that the restaurant will […] [Read More]
A candle, cookies and donut holes
It's been great writing here the past few months. It's kinda like an extended family. We all put our two cents worth in, and some times get a nickel in change. I have no idea how our little town of Bethlehem received it's name. Nor where or when the custom of "candles" in the window […] [Read More]
Bethlehem Decoration Tour
A little while ago, after a chatter, with my consultant, Pat, it was decided that I should go out on a limb, too, and pose my readers a definitely personal opinion option for this post. Pretend you are setting up a walking, or driving tour of our town. List the various must see decorated sites that you like, […] [Read More]
The newest TU blogger
From its launch in late 2004 until its crash and burn in December 2006, AlbanyEye was arguably the most popular blog in the Capital Region. The anonymous blogger racked up 'most popular blogger' awards while skewering local media personalities, including TU reporters, and positively hammering politicians. It was funny, witty and satirical, and a must-read. […] [Read More]
Free form Friday
Add a comment below and use this space to promote your Bethlehem event or just your random thought du jour. My thought? I'm bummed to learn that Tri-Village Little League has cancelled this weekend's games due to the forecast for cold and nasty weather. I understand the decision. Fall ball is always chancy because of […] [Read More]
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Duquesne University adjunct instructors have won a vote to organize as a collective bargaining unit under the United Steelworkers.
A preliminary ballot count conducted Thursday afternoon showed the part-time instructors winning the vote 50-9. Eighty-eight adjuncts were eligible to cast ballots.
The count took place at the National Labor Relations Board's regional office in Pittsburgh.

subset: commoncrawl


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Hold down Control (PC) or Command (Mac) key + mouseclick to select more than one option
|Avg. Dinner Entrée
|Greater than $25
|$18.01 - $25
|$12.01 - $18
|$7.01 - $12
|Less than $7
Posted by anonymous on 03/15/2012
I'm reluctant to rave about the s'mores pie for fear that they'll be out of it when I come in!
Posted by Kelly on 08/31/2010
Hands down the best cupcakes, ever!! A must stop shop and you will not be disappointed.
Posted by anonymous on 07/30/2009
Sweet Mandy B's has the BEST cupcakes in Chicago! The frosting was delicious and the cupcakes were so moist! The atmosphere is so cool because you get to see them make the frosting and cupcakes. Plus, it is very kid-friendly. They are definitely worth the money. We bought a box of 12 cupcakes and everyone loved them!
Posted by Kelsey on 04/23/2008
If you want to know why this place put Chicago on the map for gourmet cupcakes, just bite into a creamsicle cupcake. Good lord, you'll forget about anything that's been bugging you. Each one of their desserts is like a little piece of heaven. ...And I want one now...
Posted by Robert P. on 12/19/2006
The best place in lincoln park for a dessert after a meal or for a snack. Mud pies, cookies, ice cream, cakes, all with a home made feel and all extremely tasty and under the dollar mark.


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Good Clean Love, Almost Naked Personal Lubricant, 4 fl oz (120 ml) (Discontinued Item)
Items 1-2 of 2 total
does the job
Posted by Reviewer2910193 on Aug 14, 2013
we need a lot of.. lube. and this is great, not tested on animals and such.
Was this review helpful to you?
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Note: iHerb does not imply any medical claims from this review. Disclaimer.
Been using this exclusively for a couple of years now
Posted by 5047457829053537877 on Sep 09, 2013
Never had a big issue with this product. The "touch of vanilla" is light and pleasant smelling. It might take 5-10 minutes to get tacky/dry, but rehydrates with additional application. Better than some non-natural alternatives we've tried. Knowing and being OK with the ingredients used is a major plus.


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Kansas City, Mo. — You spend thousands of dollars on gas and groceries every year. There are new ways to help you save at the pump after your trip to the store. So pick your favorite place and find out how to save!
Hy-Vee Fuel Saver Card
- Buy specially marked items in stores
- Scan card at register
- Pay at the pump at more than 1200 Hy-Vee, Shell and Casey's gas stations
- No minimum to buy before you can start earning discounts
- Large number of participating gas stations
- Price drops automatically at the pump when you scan your Fuel Saver Card
- Savings will add up over a 4 week period
- Another card to carry
- There's not a huge selection of participating items yet
Price Chopper
- Earn $0.05 off for every $50 spent
- Earn extra savings when you buy specially marked items
- Earn extra savings when you fill prescriptions
- You can earn savings on everything you need to buy
- Prescriptions will earn you extra savings
- Veterans and members of the military get extra savings on Veterans Day
- You have to spend at least $50 in one trip before any discount kicks in
- Can only be redeemed at QuikTrip locations
Murphy USA
- Pay with a Walmart Gift Card save $0.10 on every gallon
- Pay with a Walmart Credit Card save $0.15 on every gallon
- You don't have to buy anything to get the discount
- There is only one location in the metro (It's at Walmart near I-70 and Adams Dairy)
- Deal ends on 12/24/12
- You have to refill the Gift Card in store before using it at the pump


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Marine Weather
Melbourne Bays Marine Weather Overview
|Swell height
|Districts with warnings
|Observed wind
most recent warnings
Melbourne Bays Current Conditions
Weather News
Tsunamis in Australia?
With another earthquake of 5.7 magnitude being recorded today near off the southern Queensland coast, meteorologists and oceanographers are keeping a wary eye on the potential for tsunamis.
Hobart hopes for snow on Monday.
A series of strong cold fronts which are moving in quick succession over southeastern parts of Australia threaten to bring low level snow over the coming days to parts of Tasmania.
Adelaide records coldest July in almost 20 years
Adelaide has recorded its chilliest July in close to 20 years, with both maximum and minimum temperatures colder than average.


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Hotels in 13342 - Garrattsville NY
Only hotels in 13342 zip code are listed below. Search for cheap and discount hotel rates in Garrattsville, NY for your upcoming leisure or conference / group travel. We list the best 13342 hotels and motels so you can review the Garrattsville hotel list below to find the perfect lodging. Hotels in Otsego county and area code 607 are also listed.
13342 Hotels & Accommodations
Next: Show All Available 13342 Hotels with Pricing >


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FPS staff report
December 20, 2010
Conotton Valley 75, Strasburg 73 (OT)
The Rockets' Brandon Bailey poured in 36 points to lead Conotton Valley to a 75-73 win over visiting Strasburg last Tuesday night in overtime.
The win improved the Rockets to 3-1 for the year and 1-1 in the Inter-Valley Conference.
Shawn Bailey pulled down 12 rebounds for the Rockets.
Hunter Schneiter led the Tigers with 24 points and Lance Dillehay added 12.
Last Friday night, Brandon Bailey had another huge game for the Rockets as he poured in 32 points, including going 10-for-10 from the foul line to lead the Rockets to a 72-66 win over Tuscarawas Central Catholic.
Nick Galigher also had a big night for CV, finishing with 17 points, which also included a 12-of-16 night from the line. Shawn Bailey added 13 points for the Rockets.
In all, the Rockets hit 29-of-37 shots from the charity stripe.
The Saints led 16-6 after the first quarter, but the Rockets rallied in the second to tie the game at 26-26 at halftime and led 48-43 going into the final quarter.
Jimmy Fickes led the Saints with 20 points, while Brandon Sweet and Jimmy Tolloti finished with 14 and 12 points, respectively.
Malvern 80, Sandy Valley 41
Malvern junior Travis Tucci led four Malvern players in double figures as the Hornets defeated rival Sandy Valley 80-41 last Tuesday night at Malvern.
Tucci finished with 24 points, including going 11-for-13 at the foul line. Sophomore Max Kapron added 16 points and seven rebounds, Clay Davis had 13 points and Shawn Ball 12 points for the Hornets, who improved to 2-1 in the Inter-Valley Conference and 3-1 overall.
The Hornets led 20-7 after the first quarter, 43-20 at halftime and 66-29 at the end of the third period.
Shooting, the Hornets hit 29-of-48 action shots and 18-of-25 free throws.
For the winless Cardinals, Cole Lutz led the way with 11 points.
Sandy Valley was 17-of-46 from the floor and 3-of-11 from the line.
Last Friday night, host Garaway broke open a close game in the third quarter and defeated the Hornets 59-48 in a big IVC contest.
Travis Tucci and Kapron led the Hornets with 12 points each, while Trey Tucci added nine.
Garaway led 16-13 after the first quarter, and the contest was tied at 31-31 at halftime.
The third quarter proved to be the difference in the game as Garaway outscored the Hornets 12-4 to take a 43-35 advantage into the final quarter.
Malvern hit what shots they got, going 17-for-31 from the field and 8-of-16 from the line.
The Pirate defense forced 23 Malvern turnovers.
Duane Troyer led the Pirates with 24 points, who remain undefeated on the year. They were to play undefeated Hiland Tuesday night for the top spot in the IVC.
Alliance 46, Minerva 43
Alliance outscored visiting Minerva 11-2 in the final period in rallying for the 46-43 Northeastern Buckeye Conference win last Friday night.
The Aviators trailed by six points going into the fourth quarter.
Mike Mayle led the Lions with 14 points, while Andre Spinell added 13.
Denzell Faulk led the Aviators with 13 points and Vernon Martin added 12.
Minerva led 17-13 after the first quarter, 30-25 and 41-35 going into the final quarter of play.
The Free Press Standard invites you to post your thoughts on the story in the box below.
These posts do not reflect the views of the The Free Press Standard or its employees.
©2010 The Free Press Standard
Contact the webmaster at: firstname.lastname@example.com


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- Areas of Study
- Learning Outcomes
- Art & Design Alumni
- Art & Design Events
- Art & Design History
- Art & Design News
- Current Students
- Faculty, Staff & Directors
- Gallery and Exhibitions
- Programs & Student Life
- Prospective Students
You are here
Art & Design Community Programs
Visiting Artists Program
Our visiting artists program regularly brings to campus well-known artists and scholars. The program provides important educational opportunities for students and the University community. The Elzay and Stambaugh Studio galleries feature exhibit space for experimental works by faculty, alumni, students and internationally, nationally and regionally prominent artists. The visiting artists give students learning experiences through workshops, lectures and networking.
Recent visiting artist have included Nancy Sirkis (photographer), Sean McConnor (painter), Kylie Heidenheimer (painter), Bernie Casey (painter), Michael Howell (professor and sculptor), Robbie Bailey (photographer), Kate Bender (printmaker), Michael Robinson, Liz Sparks (ceramicist), Brett Price (sculptor), Paul Osbourne (graphic designer) and Jill Davis (charge artist).
For more information about our visiting artists program, to receive the the exhibit schedule or to be added to the mailing list, please contact the department of art and design at (419) 772-2160.
Visiting Artist-in-Residence Program
The department of art and design also hosts visiting artists in residence throughout the year. During the fall 2007 quarter, distinguished photographer Robert Bailey of New York City taught two photography courses and gave lectures about his work. Beginning in January, his students' work was displayed in the Stambaugh Studio Theatre Gallery. Robert's work has been featured on the Today Show, NBC Nightly News, the Washington Post, USA Today and the Discovery Channel. Notable clients include Unicef, Nike, United Air Lines and the U.S. Treasury Department.
Another recent visiting artist was Marilyn Lysohir, BA '72, a distinguished ceramic sculptor. While on campus, she taught a course in large-scale ceramic-sculpture construction and created her own ceramic sculptures in an art department studio space, which was accessible to the general public. Marilyn also mounted two ceramic installations in the university galleries. One exhibit featured The Dark Side of Dazzle, an interpretation of a camouflaged battleship based from childhood memories. The other installation was Fish Dreams, a series of ceramic fish. The fish were on sale for the benefit of an ONU art student scholarship.
Film Series Program
The department sponsors a quarterly film series for students and the University community. Past films have included Brazil, Delicatessen and The Wall. The films are shown in the Wilson Art Center on Wednesday nights beginning at 6 p.m. For a complete schedule, visit http://www.onu.edu/academics/getty_college_arts_sciences/areas_study/art_design/film_series.
Exhibition and Gallery Program
Operated by the department of art and design, the Elzay and Stambaugh Studio Theatre Galleries are educational art galleries for the Ohio Northern community and for the Northwest Central Ohio region. The gallery season is designed to serve as a cultural resource, host national and international touring exhibitions and programs and host original exhibits distinctly suited to an academic environment.
The exhibition and gallery program's mission is to showcase shows and events of invited artists and designers who encourage dialogue about the visual arts: studio processes, history, criticism, curation and cultural context.
Admission to the Elzay and Stambaugh Galleries is free and open to the public, daily from noon until 5 p.m. The Stambaugh Studio Theatre Gallery also is open prior to Freed Center events. For additional information, to schedule a tour or to be placed on the arts exhibition mailing list, please contact the department of art and design at (419) 772-2160 or email@example.com.
Student Exhibitions
The department of art & design considers exhibition opportunities for students to be an important component of the educational process and mission. Student shows include:
Foundations Honors Exhibit
The Foundations Honors Exhibit is held at the end of each academic year. The exhibit is set up to assess artistic development and personal artistic direction. All art and design students, regardless of major, are required to submit work after the first year of study. Students submit work that depicts proficiency in media, techniques and processes, and proficiency in the works' relationship to intent, image and artistry. Students consult with their studio advisors at the beginning of spring quarter to identify work to be submitted for the exhibit. The foundations program faculty helps students prepare for the show.
Jurors look for essential competencies of basic composition principles, concepts, media and formats; of basic foundation techniques; of basic abilities to conceive, design and create work in one or more fine arts areas; and of basic knowledge of various production methods and their relationship to the conceptualization, development and completion of the work.
Junior BFA/BA Exhibition
All art and design juniors are required to participate in the junior BFA/BA exhibit, usually scheduled at the end of spring quarter. This exhibit begins the thesis/capstone program and is intended to provide a forum for the display, critique and discussion of work.
Faculty members assess student artistic development, including concept development, formal design, craftsmanship and presentation of work. Other assessments include the ability to create and develop visual form in response to communication problems, the ability to understand the relevancy of tools and technology that shape visual solutions, and the ability to understand the history, theory and criticism of design from a variety of perspectives.
Works-In-Progress Exhibition
All graduating art and design seniors participate in the works-in-progress exhibition. Currently, the exhibit is held in the Wilson Art Center. The intent of this exhibition is to provide students a forum for display of new work and current directions. This show provides an opportunity for faculty and other students to review work and become acquainted with the direction of senior students. Faculty assess student artistic development and personal direction, including concept development, formal design, craftsmanship and presentation of work. Other assessments include the ability to solve communication problems, the ability to describe and respond to the audiences and contexts that communication solutions must address, the ability to create and develop visual form in response to communication problems, the ability to understand the relevancy of tools and technology that shape visual solutions, the ability to understand the history, theory and criticism of design from a variety of perspectives, and an understanding of basic business practices.
Senior Capstone Experience
All art and design students are required to complete a senior capstone. This allows students to integrate many concepts and theories from their major course of study into a final project and/or activity. For graduating art and design majors, a research project, portfolio, exhibit and public lecture are part of the capstone experience.
As a graduation requirement, students complete a final exhibit of work completed in the BA/BFA program in art, art education, advertising design and graphic design. This exhibit is scheduled prior to graduation during spring quarter.
Faculty members assess student development and personal intent, including concept development, formal design, craftsmanship and presentation of work. Graphic design assessments include the ability to solve communication problems, to describe and respond to the audiences and contexts that communication solutions must address, to create and develop visual form in response to communication problems, to understand the relevancy of tools and technology that shape visual solutions, the ability to understand the history, theory and criticism of design from a variety of perspectives, and an understanding of basic business practices.
The Annual Student Juried Exhibition
This exhibit features work in all media by currently enrolled students. All art majors are required to enter work in the annual student juried exhibition, which is held each spring in the Elzay Gallery of Art. Two professional artists and/or designers jury entered work into the exhibit. They are also hired to award prizes in two-dimensional (drawing, illustration, painting, printmaking, photography), three-dimensional (sculpture, ceramics) and graphic design. Majors with sophomore standing are responsible for the organization and presentation of the show.
The Fine Art Exhibition and Sale
One of the department's annual events is the winter and spring exhibition and sale, which displays and sells some of the best work by students and faculty. The proceeds support both the Kappa Pi art honorary and the artists.
Summer Trips Abroad
The department has a well-established travel tradition, offering fine art and cultural emphasized trips to Europe every two years. Trips have included a broad range of artistic, historical and cultural experiences, and have included trips to countries such as Spain, Italy, France and Greece. These trips are open to all art students and the University community. In summer 2008, a trip to England was planned.


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IT in the Primary Classroom A (EDUP4066)
This unit builds on student's knowledge and skills gained from their previous ICT related units of study. Technical aspects will be drawn from the use of ICT tools and construction of appropriate ICT teaching and learning resources, presentation software and desktop publishing. The unit will deal with aspects of technology for teachers' professional practice, the evaluation of IT related resources for the classroom and the integration of IT into teaching and learning.
Further unit of study information
1x2-hr seminar/wk for 10 wks
1000wd online resources (20%) and ICT project (60%) and online reflective journal (20%)
Faculty/department permission required?
Unit of study rules
Prerequisites and assumed knowledge
120 credit points of units
Study this unit outside a degree
Non-award/non-degree study
If you wish to undertake one or more units of study (subjects) for your own interest but not towards a degree, you may enrol in single units as a non-award student.
Cross-institutional study
If you are from another Australian tertiary institution you may be permitted to underake cross-institutional study in one or more units of study at the University of Sydney.


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Bryan Adams' Hit-Heavy Fox Show
By Jeremy Essig
Lightning Bolt's Sharp New Sound
By Jason Robinson
Fleetwood Mac Back with Classic Lineup
By Hans Morgenstern
Here's Who's Making STL Noisy This Spring
By Joseph Hess
Beatles Sister Louise Harrison Departs the Midwest
By Peter Gilstrap
By Julia Burch
Working Class Dogs to Honor Rick Springfield
By Jeremy Essig
Torche Gets Back Into Its Heavy Groove With Restarter
By Nathan Smith
Jana McCall's Jana McCall (Up) highlights a songwriter who evokes the parental wish to cook some soup for a songwriter capable of writing creepy, crawly songs evoking this kind of reserve and sadness. "Today" almost takes off, but the rest of the songs stay resolutely on the ground, spare and weirdly sorrowful.
The Selby Tigers' Year of the Tigers (The Bread Machine) bristles with youthful energy and pop-punk riffs, all the while keeping a steady eye on crackling choruses and sing-along verses. Punchy tunes that stick-and-move.
Swell's For All the Beautiful People (Beggar's Banquet) continues the band's established pattern of high-concept, low-fidelity recordings. The formula ain't broke, so why fix it? Moody, slightly menacing, more tuneful than Mercury Rev's widely-hailed Deserter's Songs.
Ani DiFranco's Little Plastic Castle (Righteous Babe) plays to the choir with the usual tales of how fame ain't what it's cracked up to be. At the album's best ("Gravel"; the seething, stripped-down "Pulse"), you forget about that.
Creeper Lagoon's I Become Small and Go (NickelBag) is one weird, trippy spin, with every manner of instrument introduced for a quick cameo. The songs resonate with gussied-up simplicity. Not the most hummable disc, but a welcome relief from indie's de rigueur bombast.
Grasshopper and the Golden Crickets' The Orbit of Eternal Grace (Beggars Banquet) highlights two members of Mercury Rev in another quirky, off-center attack on skewed pop.
Butterfly Child's Soft Explosives (HitIt!) is lush, New Wave-styled pop along the lines of the Chills, Aztec Camera and mid-period Talk Talk. Strings and soaring vocals abound, compliments of mastermind Joe Cassidy.
Jeff Buckley's Sketches (For My Sweetheart the Drunk) (Sony) may not be the record he envisioned, but Disc 1, with its Tom Verlaine-produced tracks, more than lives up to the standard that Buckley established on Grace. Deeper in originals and less reliant on Buckley's voice, these songs stress themselves rather than studio trickery or his ridiculously wide vocal range. Lovely stuff, really.
Also: Massive Attack, Mezzanine (Virgin); John Easdale, Bright Side (Eggbert); P.J. Harvey, Is This Desire? (Island); St. Etienne, Good Humour; Drugstore, White Magic for Lovers (Roadrunner).
Jordan Oakes
1998 was a very good year. Sadly, it took something as momentous as Frank Sinatra's death to make me rediscover his vast, luxuriant catalog. I'd grown up with Sinatra on the back burner of my music-listening range -- my father was a huge fan -- but my appreciation was one of irony and distance. Here was a guy who, with the snap of his fingers and the swing of a microphone, captured the ritzy bustle of postwar nightlife, the fizz and romance of a generation. Here in '98, I was fascinated with the phase that linked the "good old days" to the '60s era, where the power of trend-setting shifted to the young. Dean Martin found a vehicle for this, however laughably, in the Matt Helm films; Sinatra did it musically (and a great deal more subtly) on Francis Albert Sinatra and Antonio Carlos Jobim (Reprise). To me, this was the Sinatra reissue of the year and an album that sounds great outside the lounge.
In the same vein, investigate a new three-song CD of tunes Sinatra recorded with daughter Nancy in the late '60s, For My Dad (DCC Compact Classics). "Feelin' Kinda Sunday" is the kind of Turtles-ish pure pop I thought I'd never hear Frank attempt. But Nancy takes his hand and leads him into a groovy performance that lights up the song. By the way, I still don't get Tony Bennett.
Other chill-up-the-spine releases of '98 include Painted from Memory, the vivid masterpiece by collaborators Elvis Costello and Burt Bacharach. It's sure to be on many best-of lists, and it sounds like an album that will age with winelike grace. Other stuff I sipped: The New Radicals came out of nowhere and staked out territory on the charts. For that reason, I can already sense contempt for them in the air -- humid with elitism -- but I really like their Maybe You've Been Brainwashed Too (MCA). Any album that reminds me simultaneously of World Party, Lloyd Cole and Todd Rundgren can't be instantly forgettable -- so the term "disposable pop" (personified, still, by the Knack) can be thrown away in this case.
Also giving power-pop a new spin -- a turn of events -- were gems by Randell Kirsch, Mark Johnson and David Grahame, all of whom should appeal to Marshall Crenshaw fans -- if they can find their albums (check out RFT back issues for contact info). By contrast, a great pop find was Tommy Keene's Isolation Party (Matador), which is accessible in both senses. Hey -- the nonexistent audience that keeps missing the excellent local Love Nut appearances might start showing up after they hear Life on Planet Eartsnop (Not Lame), a solo release by top Nut Andy Bopp. For alleged "toss-offs" (Bopp insists they are), and despite one of those shoot-itself-in-the-foot titles, the home-recorded album occasionally evokes the tragic magic of Badfinger. It's also a better collection than Love Nut's Baltimucho.
Terry Perkins
Chucho Valdes, Bele Bele en la Habana (Blue Note). Cuba's foremost jazz pianist shows exactly why he richly deserves that title. Tim Hagans and Marcus Printup, Hub Songs (Blue Note). Two of the best young trumpeters around tackle the music of Freddie Hubbard with the help of Vincent Herring, Javon Jackson, Benny Green, Peter Washington and Kenny Washington -- with Hubbard producing. Harp-bop heaven! Brad Mehldau, Songs: The Art of the Trio, Vol. 3 (Warner Bros.). This year's hottest pianist, who's definitely found his own voice.
Sponsor Content


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You won't be able to dismiss this by usual means (escape or click button), but you can close it programatically based on user choices or actions.
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An electronic device or devices and method for producing a device is disclosed. One embodiment provides an integrated component, a first package body and a contact device. The contact device penetrates the package body.
1. A method for producing a device, comprising:
arranging contact devices on a carrier;
arranging an integrated component on the carrier between the contact devices;
introducing a material into an intermediate space between the contact devices and the integrated component to provide a package body such that the material directly contacts the contact devices;
working the material back on one side, so that the contact devices are exposed on the worked-back side of the package body;
applying solder paste projections on the exposed contact devices; and
thermally treating the solder paste projections to provide solder regions having a diameter smaller than a diameter of the contact devices,
wherein a thickness of the contact devices in a direction perpendicular to the carrier at least equals a thickness of the integrated component in the direction perpendicular to the carrier.
2. The method of
3. The method of
4. The method of
5. The method of
6. The method of
7. The method of
8. The method of
9. The use of a ball placing machine for carrying out a method of
a machine which arranges more than 1000 contact devices simultaneously.
10. The method of
11. The method of
12. The method of
13. The method of
14. The method of
15. The method of
16. The method of
17. A method for producing a device, comprising:
providing a carrier with an adhesive on the carrier;
arranging contact devices on the adhesive, the contact devices having a first thickness in a direction perpendicular to the carrier;
arranging an integrated component on the adhesive between the contact devices, the integrated component having a second thickness in the direction perpendicular to the carrier, the first thickness being at least equal to the second thickness;
introducing a material into an intermediate space between the contact devices and the integrated component to provide a package body such that the material directly contacts the contact devices, the integrated component, and the adhesive;
working the material back to expose the contact devices;
removing the carrier and the adhesive from the contact devices, the integrated component, and the material;
producing a wiring arrangement on the integrated component, the material, and on at least one of the contact devices;
applying a solder resist layer on the wiring arrangement;
applying solder paste projections on the exposed contact devices opposite the wiring arrangement; and
thermally treating the solder paste projections to provide solder regions having a diameter smaller than a diameter of the contact devices.
18. The method of
19. The method of
wherein introducing the material comprises introducing the material using a compression-molding process.
20. The method of
21. A method for producing devices, comprising:
providing a carrier;
arranging contact devices on the carrier, the contact devices having a first thickness in a direction perpendicular to the carrier;
arranging at least two integrated components on the carrier between the contact devices, the integrated components having a second thickness in the direction perpendicular to the carrier, the first thickness being at least equal to the second thickness;
introducing a material into an intermediate space between the contact devices and the integrated components to provide a package body such that the material directly contacts the contact devices and the integrated components;
working the material back to expose the contact devices;
removing the carrier from the contact devices and the integrated components; and
separating the integrated components from each other to provide at least two devices, each device including an integrated component and at least one contact element.
22. The method of
23. The method of
24. The method of
25. The method of
26. The method of
applying solder paste projections on the exposed contact devices; and
thermally treating the solder paste projections to provide solder regions having a diameter smaller than a diameter of the contact devices.
27. The method of
producing a wiring arrangement on the integrated components, the material, and on at least one of the contact devices; and
applying a solder resist layer on the wiring arrangement.
28. The method of
producing a wiring arrangement on the integrated components, the material, and on at least one of the contact devices;
applying a solder resist layer on the wiring arrangement;
applying solder paste projections on the exposed contact devices opposite the wiring arrangement; and
thermally treating the solder paste projections to provide solder regions having a diameter smaller than a diameter of the contact devices.
This Utility Patent Application claims priority to German Patent Application No. DE 10 2006 037 538.6 filed on Aug. 10, 2006, which is incorporated herein by reference.
The invention relates to an electronic device, in particular with an integrated component or chip.
An integrated component includes, for example, an integrated circuit, for example with a number of circuit elements, for example transistors or sensors, or with just one circuit element. Such integrated components are used, for example, in electronic circuits of motor vehicles, cellphones, cameras, etc.
The devices are provided, for example, with a package body. In spite of the package body, the device is however intended to be as small as possible.
There is a need for a simply constructed device which can in particular be produced in a simple manner. The device is intended to have a small overall height and/or be simple to mount. In particular, there is a further need for a device stack. Furthermore, there is a need for a production method for a device. There is also a need for the use of a ball placing machine for this method, in particular a solder ball placing machine.
For these and other reasons, there is a need for the present invention.
The accompanying drawings are included to provide a further understanding of embodiments and are incorporated in and constitute a part of this specification. The drawings illustrate embodiments and together with the description serve to explain principles of embodiments. Other embodiments and many of the intended advantages of embodiments will be readily appreciated as they become better understood by reference to the following detailed description. The elements of the drawings are not necessarily to scale relative to each other. Like reference numerals designate corresponding similar parts.
In the following Detailed Description, reference is made to the accompanying drawings, which form a part hereof, and in which is shown by way of illustration specific embodiments in which the invention may be practiced. In this regard, directional terminology, such as "top," "bottom," "front," "back," "leading," "trailing," etc., is used with reference to the orientation of the Figure(s) being described. Because components of embodiments can be positioned in a number of different orientations, the directional terminology is used for purposes of illustration and is in no way limiting. It is to be understood that other embodiments may be utilized and structural or logical changes may be made without departing from the scope of the present invention. The following detailed description, therefore, is not to be taken in a limiting sense, and the scope of the present invention is defined by the appended claims.
It is to be understood that the features of the various exemplary embodiments described herein may be combined with each other, unless specifically noted otherwise.
In one embodiment, a component is provided. The component includes an integrated circuit, a package body, and a first contact device, the contact device penetrating the package body.
In another embodiment, a method for producing a device is provided. The method includes arranging contact devices on the carrier, arranging an integrated component on the carrier, and introducing a material into the intermediate spaces between the contact devices and the circuit.
One embodiment provides a device with a compression-molded package body, which is arranged on a device stack or a printed circuit board. In one embodiment, the stacking of semiconductor devices or components is a suitable measure for increasing the packing density of semiconductor components by utilizing the third dimension. There is the stacking of semiconductor dice or chips (die stacking) and the stacking of devices or packaged components (package stacking).
When stacking semiconductor dice, previously exposed, i.e. unpackaged, semiconductor dice or chips are stacked in a single package body. This has the advantage that the stack has a small height and small lateral dimensions. Furthermore, the stack can be produced at low cost. However, the semiconductor die used must be one which has already been found to be defect-free, i.e. a "known good die" (KGD), in order to solve a problem with the yield in semiconductor die stacking. However, it is not possible, or only with considerable effort, to test an exposed semiconductor die in the same way as a semiconductor die already provided with a package.
When stacking devices or packaged components, semiconductor components are first provided with a package and then tested. After that, these devices are then stacked one on top of the other to form a device stack. For this purpose, a connection in the vertical direction is required in the device stack.
The integrated component may, for example, include a semiconductor substrate, in particular a silicon substrate or a compound semiconductor substrate. However, SOI (silicon on insulator) substrates may also be used. The integrated component may include a multiplicity of electronic semiconductor components, for example, bipolar transistors or CMOS (complementary metal oxide semiconductor) transistors.
The package body may, for example, consist of or contain an electrically insulating material or else, given appropriate electrical insulation with respect to the contact devices, an electrically conductive material. Polymers, such as resins or plastic materials, can be used, for example, as a package body. The package body holds the constituent parts of the device together and protects the chip from environmental influences, such as moisture or mechanical stress. The package body can be produced, for example, by compression molding, printing, spin-coating or pouring and possibly subsequent curing.
In the case of one embodiment, the contact devices may consist completely of a metal or a metal alloy or have a metallic surface. Suitable metals are, for example, copper, copper alloys with more than 80 atomic percent of copper or solder materials. Solder balls may be used, for example, as contact devices. For example, lead-free solders are used, but also other solders.
The penetration of the package body may be understood, or is understood, as meaning that the contact element penetrates right through the package body from one surface region to another surface region. The penetration of the package body may mean, or does mean, that the contact element is enclosed or encapsulated by the package body, except for two ends of the contact element.
For example, the contact devices are completely filled bodies, in particular of a homogeneous material. The contact devices have a hollow core or a core of a different material than a metallic shell of the contact devices. For example, the core is likewise electrically conductive or electrically insulating.
For example, conducting structures included in a wiring arrangement may connect the integrated circuit to the contact devices. The conducting structures may, for example, be conducting tracks or plated-through holes or vias.
In one embodiment of a device, the integrated circuit and the filling material as well as the contact devices may lie in a first plane. The chip, the filling material and the contact devices are on the same side of the wiring arrangement. This measure already allows the overall height of a packaged component to be reduced considerably. In one embodiment, in the case of a compact construction, the wiring arrangement extends along its width in a second plane, which lies parallel or substantially parallel to the first plane.
The contact devices may advantageously be balls. The ball form is used because spherical contact devices can be produced in a simple manner, for example by solidifying metal drops. The molten metal thereby assumes the ball form of its own accord, to minimize the surface tension. The use of balls also offers the advantage that, when soldering the contact devices, the contact devices can be securely held in the package body. Should the contact devices become soft, for example during soldering, they will not change their shape again on account of the surface tension, so that no intermediate spaces occur between the contact devices and the package body.
The balls may in each case have a deformed side. For example, in each case a piece of the balls has first been removed in a planarizing process and then solder material has been re-applied to these locations. In another embodiment, deformed locations may also be present on two sides of the balls that are facing away from each other.
In one embodiment, the contact devices may consist completely or to 100 percent of solder material, i.e. of a material with a melting temperature lower than 400° C. (degrees Celsius). The contact devices may contain solder material, for example to at least 75 atomic percent. Smaller proportions than 75 atomic percent of solder material are sufficient, for example if a coating of a solid core with solder material is chosen. The use of solder material ensures good solderability in the mounting of the package device. Furthermore, solder balls offer the advantage that they retain their ball form when heated, because this is a low-energy state. For example, cylindrical contact devices of solder material have a greater tendency when heated for a solder ball to form at an end of a cylindrical bore or opening. In this embodiment, however, solder would be sucked out from the bore or opening, so that solder-free locations may also occur, and these would lead to incorrect contacting.
The contact devices may have in each case a curved line of intersection with a plane that extends in the direction normal to the first plane. This requirement is also met, for example, by contact devices of an ellipsoid form, barrel form etc. The aforementioned technical effects consequently continue to apply, albeit to a reduced extent.
In one embodiment, the contact devices may be adjacent the filling material or the package body, or the first component or the circuit and the contact devices are enclosed by the package body. This is the consequence of a production method explained below for producing a packaged component which includes the package body, the integrated component and the contact devices. In one embodiment, the package body is homogeneous, in particular with regard to its composition.
The package body may consist of a resin, or it contains a resin. In one embodiment, epoxy resins are particularly well suited for compression-molding processes, with which devices for high requirements can be produced in a simple and low-cost manner.
The wiring arrangement may have a layer thickness of less than 15 micrometers or even of less than 10 micrometers. Consequently, the wiring arrangement is not a printed circuit board which contains, for example, FR4 (flame retardant type 4) or FR5 or BT material (bismaleimide triazine). This is because such printed circuit boards have thicknesses of greater than 150 micrometers, even if they only include one or two layers. The wiring arrangement with the small thickness of less than 50 micrometers is, in particular, a wiring arrangement produced by the thin-film technique, which is preferably produced directly on the circuit or on the package body. Consequently, there are no bonding processes or flip-chip processes at this point, and very high-quality connections can be produced between the circuit and the contact devices. Furthermore, the thin-film technique is particularly suitable for producing the packaged components at wafer level, i.e. a number of devices are processed in a slice that has the outer dimensions of a semiconductor wafer.
Also used, however, are wiring arrangements not produced by the thin-film technique on the package body, in particular wiring devices of the materials mentioned, such as FR4, FR5, BT or else of ceramic, etc. The wiring arrangement may, for example, also be formed from bonding wires or in some other manner.
In one embodiment, at least one lateral dimension, i.e. the width and/or the length, of the packaged component may be less than 30 mm (millimeters) or less than 20 mm. Typical packages even have dimensions of less than 7 mm. The height of the packaged component is also very small, for example less than 1 mm. For example, the package is only less than 10 percent higher than the contact devices. The package body has the same height as the integrated component. On one embodiment, devices of small dimensions are inserted in small, portable devices, such as for example cellphones, with a largest dimension of less than 10 cm (centimeters).
The package device also includes a second packaged component or even more than two packaged components. The second packaged component has preferably been produced by the same method as the first packaged component or as the first device. The two packaged components preferably lie parallel to each other, deviations occurring within the limits of mounting tolerances, which however are smaller than, for example, 3° (angular degrees). In one embodiment, the device stack is also particularly flat, in particular in comparison with a device stack with devices in which contact devices and chips are respectively arranged on sides of the wiring arrangement that are facing away from each other.
The contact devices of the one package may preferably be soldered, for example, onto conducting structures of the wiring arrangement of the other package. Consequently, the two components can be connected in a simple manner to form a component stack, in particular by flip-chip processes.
Furthermore, an embodiment of a method for producing a component is provided, performing the processes of:
providing a carrier,
arranging a multiplicity of contact devices on the carrier,
after arranging the contact devices or before arranging the contact devices, arranging an integrated circuit on the carrier, and
after arranging the circuit and the contact devices, introducing a material into the intermediate spaces between the contact devices or between the contact devices and the circuit. The material is preferably electrically insulating.
The method serves in particular for producing an aforementioned circuit arrangement, so that the technical effects mentioned there also apply to the method.
The contact devices may be arranged on the carrier in the solid state. Solid means here that the contact devices are not applied as a paste, i.e. in a pasty state.
Solder balls may preferably be arranged as contact devices. Used, for example, in this case is a commercially available machine that is also used for the placing of solder balls on intermediate printed circuit boards, for example in the production of what is known as a BGA (ball grid array). The solder balls are sucked by the machine, for example with the aid of a negative pressure or a vacuum, onto a holding device, which contains bores at the locations at which solder balls are to be arranged. The holding device is then set down on the carrier, where the solder balls are released from the holding device, for example by switching off the negative pressure. This procedure is likewise suitable for processes that are carried out at wafer level, i.e. here a wafer formed by the filling material or package bodies. In this case, for example, over 1000 solder balls are placed simultaneously.
In one embodiment, a filling material for the package body may be introduced by a compression-molding process. These compression-molding processes are likewise suitable for the production of wafers from the filling material or package bodies. Consequently, after the compression-molding, the filling material has dimensions like a semiconductor wafer, for example a diameter of 20 cm (centimeters), 30 cm or more than 30 cm. Consequently, machines that are otherwise used or could be used for the processing of semiconductor wafers are used or can be used in particular for producing the wiring arrangement.
The filling material or the package body is or may preferably be worked back, so that the contact devices are exposed on the worked-back side of the filling material or package body. For example, an etching-back process or a chemical-mechanical polishing process is used. Just mechanical polishing processes may also be suitable. The working-back process produces a planar surface, which facilitates later mounting. Furthermore, the planar surface is particularly suitable for carrying out further method processes, for example, as part of a thin-film technique or screen printing to apply a solder paste to the contact devices.
In one embodiment, a wiring arrangement may be produced by the thin-film technique on the circuit or on the contact devices and on the package body. Consequently, layer depositing processes and lithography processes such as are used in the case of integrated circuits are used, although in the case of the thin-film technique the minimum dimensions are typically greater than or equal to the minimum dimensions in the upper metallization layer of an integrated circuit. A very flat packaged component is obtained, in particular requiring no printed circuit board. The thin-film technique is also suitable for processing at wafer level, i.e. here a number of packaged components can be produced from or in a filling-material wafer.
The contact devices may also be provided with a solder material, for example, with solder paste, on the side that is facing away from the wiring arrangement. The solder paste is applied, for example, by using screen printing. The thermal loading is particularly low when solder paste is used in this method.
In particular, the packaged component or the device may be soldered onto a further device after singulating or before singulating, the further device likewise including an integrated component. This produces a device stack of a small overall height.
The stated method processes may be carried out simultaneously in joint operations for a number of devices, in particular at wafer level. Consequently, the devices can be produced in a very low-cost way.
Furthermore, protection is afforded to the use of a ball placing machine for carrying out one of the stated processes, in particular a machine which places more than 1000 balls simultaneously.
To sum up, the proposed solutions mean that an intermediate carrier board (interposer) and wire bond connections can, but do not have to be, substituted by thin-film rerouting. Furthermore, the conductive filling for the instances of contacting in the z direction can be carried out at the same time as the production of the packaged component. In particular, known, commercially available and inexpensive materials are used, for example preformed solder balls or compression-molding compounds that are available on the market.
The production is also possible at wafer level, which ensures a high degree of parallelism, and consequently low costs. The lateral dimensions of the packaged component can likewise be kept adequately small on account of high-precision placement processes. A very small package height is also obtained on account of the embedding of the contact devices in the filling material. In addition, matching of the coefficient of thermal expansion (CTE) allows, for example, solder balls of a small diameter to be used in the case of comparatively large dimensions of the packaged component, of, for example, greater than 7 millimeters in width, and the thermomechanical reliability is nevertheless great. In particular, the diameter lies below 500 micrometers, below 400 micrometers or even below 200 micrometers. However, the diameter is greater than, for example, 100 micrometers.
In one embodiment, a universal package wafer compression-molding concept is provided, with solder balls also being embedded in a molding compound in addition to chips. This allows low-cost, flexible and very simple contacting in the z direction to be achieved. In one embodiment, a package-on-package stack can be constructed in a simple manner. The matching of the coefficients of thermal expansion of the materials used, for example the coefficient of thermal expansion of the molding compound is equal to the coefficient of thermal expansion of a printed circuit board onto which the packaged component is soldered, allows solder balls of a comparatively small diameter to be used, so that a particularly flat PoP (package on package) can be produced.
Whenever "can" or "may" is mentioned in this application, both the possibility and the actual realization of the stated measure in an embodiment are meant. Several embodiments of the invention are presented below on the basis of figures, which serve merely for purposes of illustration and are not intended to restrict the scope of the invention.
In the case of an alternative exemplary embodiment, the device stack 10 also includes a third device 20, see line 18. The third device 20 has then been soldered or mounted in some other way on the device 14.
The device 12 includes an integrated component 22 or an integrated circuit 22, for example based on a silicon substrate, in particular on an already ground-thin silicon substrate. The integrated component 22 includes a multiplicity of active semiconductor components, see, for example, transistor 23. In the exemplary embodiment, the active side of the component 22 is arranged toward a wiring arrangement 30. However, this is not necessarily so. The integrated component 22 also includes at least one or more metallization layers, which however are not represented and lie between the active components and a wiring arrangement 30 explained in more detail further below.
Furthermore, the device 12 also includes solder balls 26 and 27, which lie in the cross section of the device 12 that is represented in
The device 12 has been soldered onto the printed circuit board 16 by soldered connections 28, 29. The soldered connections 28 and 29 have been produced, for example, from a solder paste. Arranged on the side of the device 12 that is facing away from the printed circuit board 16 is a wiring arrangement 30, which in the example is produced by the thin-film technique. The wiring arrangement 30 includes, for example, an electrically insulating layer 32, for example a silicon dioxide layer, and a multiplicity of conducting tracks, of which two conducting tracks 34 and 36 are represented in
In the exemplary embodiment, the device 14 is constructed in a way similar to the device 12, in particular solder balls 126 and 127 and an integrated component 122 are arranged in a package body 124. However, the component 122 has, for example, different functions than the component 22. The functions of the components 22 and 122 are the same, for example a memory function. A transistor 123 of the component 122 is represented in
In the case of the exemplary embodiment, the device 20 also has a construction similar to that of the devices 12 and 14. In one embodiment, there is an integrated component 222, a package body 224, solder balls 226, 227 and a wiring arrangement 230.
As represented in
As represented in
As represented in
In the case of another configuration, the sequence of the method processes is changed over, so that the circuits 22, 22 a, 22 b are placed first and then the solder balls 26, 27, etc.
As represented in
As illustrated in
As represented in
As represented in
As represented in
For example, solder paste projections 328, 329, etc. are applied with the aid of a screen-printing process at the locations at which the contact devices 26, 27, etc. are exposed.
As represented in
Subsequently, the devices 12, 12 a, 12 b, etc. are separated from one another at separating lines 450, 452. This is followed by mounting, the component 12, for example, being introduced into the device stack 10. Subsequently, the device stack 10 is soldered on the printed circuit board 16. In this soldering operation, the soldered connections 28, 29, etc. are produced from the solder regions 428, 429, etc., see
In other exemplary embodiments, at first only one device of the device stack is mounted on the printed circuit board 16. Only after that is a further device, or are further devices, soldered or mounted on the first-mounted device.
In other exemplary embodiments, underfillings are used, for example, between the device 12 and the printed circuit board 16 or else between the devices 12 and 14.
In one or more embodiments, there are a number of layers of conducting tracks in the wiring arrangements 30, 130, etc. It is also not imperative that in each case a solder ball 26 and a solder ball 126 are arranged one above the other. Devices with solder balls that are offset in relation to one another can also be connected to one another by using the wiring arrangements lying in between.
In another exemplary embodiment, the component 12 is individually soldered onto the printed circuit board 16, without further components 14, etc. being soldered on or mounted later. In this case, the wiring arrangement 30 preferably does not include a solder resist layer and/or any openings in the solder resist layer.
In another exemplary embodiment, different dimensions are used, in particular the devices 12, 14, etc. may have dimensions that are different from one another. Furthermore, in the case of other exemplary embodiments, a different arrangement of contact devices is chosen, for example, more than one row is arranged around the circuit, for example two rows, three rows or more than three rows, but preferably, for example, fewer than twenty rows.
In a further exemplary embodiment, integrated components with functions that are different from one another are arranged in a package body 324, 324 a, and then the method processes explained on the basis of
It is also possible for a number of integrated components to be arranged next to one another for each device.
The wiring arrangement 506 is, for example,
a thin-film wiring arrangement,
a printed circuit board, for example plastic-based or ceramic-based,
another wiring arrangement, for example initially self-supporting, see, for example, bonding wires 514, 516 of, for example, Au, Al or Cu.
The device also includes a package body 508, for example epoxy-based. Arranged in the package body 508, to the side of the component 502, are contact devices, which penetrate the package body, for example:
contact cylinders 510, for example of copper, copper alloy, aluminum or an aluminum alloy.
The contact cylinders 510, the package body 508 includes contact bodies 512, which are likewise arranged to the side of the component 502 and penetrate the package body 508. The contact body 512 has, for example, a barrel form or an ellipsoid form. In one embodiment, the contact cylinder 510 or the contact body 513 may protrude somewhat from the package body 508 toward the wiring arrangement 506 or terminate with the package body 508. Otherwise, for example, the production processes explained above are carried out to produce the device 500.
If a self-supporting wiring device 506 is used, the bonding wires 514, 516, for example, are only attached after the package body 508 is produced.
Although specific embodiments have been illustrated and described herein, it will be appreciated by those of ordinary skill in the art that a variety of alternate and/or equivalent implementations may be substituted for the specific embodiments shown and described without departing from the scope of the present invention. This application is intended to cover any adaptations or variations of the specific embodiments discussed herein. Therefore, it is intended that this invention be limited only by the claims and the equivalents thereof.
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One of the best parts about watching Mob Wives is the Twitter commentary that comes with the show as the ladies live-tweet while they watch. This week, the ladies get to talking about the relationship between Love and Carla, which will soon come to light on the series, and get in a few hilarious side comments about their own personal dramas, too. Read the best tweets of the night right here.
Jumped By Ninjas: Read The Best Mob Wives Tweets Of The Night
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over 6 years ago
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Thank you be safe out there!!!
over 6 years ago
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How are things your way??? Here the snow is melting and things seem good...Just thought I would drop ya a line...Keep it real
over 6 years ago
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You too. stay safe
over 6 years ago
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Hey Marco, thanks for the add, Am glad you like Juanes, hope my music is no sound to crazy for the Firelink, take care My friend and Keep in touch
He mein Bruder, I' ll bilden ein Abkommen mit Ihnen, wenn Sie wünschen. Sie zahlen das Verschiffen und das I' ll spenden die Barbecue-Soße. 3 Flaschen flüssiger Himmel. Sie denken an ihn und informieren mich. - Chef Matt-
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Kurt Kamm
One Foot in the Black
How about sending a couple of paragraphs about your most memorable fire experience for the blog?
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same to you man, be safe out there
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Danke, Hier alles im grünen... in 2 wochen flieg ich in urlaub, NY und costa rica tauchen.. urlaubsreif bin ich schon lange.. bis bald.. grüsse aus Karlsruhe
Thank you so much for the add! Have an awesome week!
Hi Marco, grüsse aus Karlsruhe - wünsche Dir ne gute Woche. Patric
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Zsuzsanna Anderson, wife of Steve L. Anderson, from her blog Are They All Yours?!?? She is speaking of a sex ed class given to engaged young women at First Baptist Church/Hyles-Anderson College. In all the years at the college, I only attended one class there. It was taught by Dr. Creeper Streeter himself, and open only to the engaged young college ladies getting married at the church in the near future. At the time, I of … [Read more...]
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by CaluluHigh school graduation loomed for Tom's oldest non-disabled kid, a son that's as bright as they come. The son has always been in the gifted and talented program at the local schools and was eligible for a few different college scholarships. The problem was that except for the small scholarship money there was no other funds for college. the scholarships were about enough to pay Tom Jr.'s tuition at community college but not enough to pay for books, a car, and gas back and forth much less pay for room, board and tuition at one of Virginia's four year universities.How do I know that? Because Hubby was the recipient of a late night drunken call from Tom, a call out of the blue. … [Read more...]
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by Libby AnneRaised Quiverfull Introduction — Questioning SummaryPlease be sure to click the above links to see an introduction to and explanation of this project, which involves a panel of nine young adults who were raised in Quiverfull families and have since questioned and left that ideology answering questions about their experiences. Question 1: What sort of a church did your family go to while you were growing up? Were the other families who attended the church also involved in the Christian Patriarchy/Quiverfull movement?Joe:Before my parents divorced in 1987, we attended an American Lutheran Church in Minneapolis, Minnesota, USA. It was … [Read more...]
Review: Pixar's Brave is Braver Than it Looks
by SierraPixar's Brave is every fairy tale and none of them. It's every trope and none of them. It's filled with lovable scamps, bumbling eccentrics, defiant courage, enchanted landscapes, stifling expectations and unintended consequences. And it's filled with beautiful brogue and wayward redheads.I'm going to talk my way through this movie. It's currently 10:30pm. I left the movie theater 30 minutes ago, oddly silent as I tried to figure out what the message was that I got from that film. What follows is my first attempt to process the story, and to figure out whether or not it follows in the footsteps of Tangled, the cinematic anthem for ex-fundamentalist daughters.My re … [Read more...]
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by MillipedeIn face of these events, I found work. Once I overcame my husband's reluctance to enter the workforce, he seemed to accept the situation. He drove me to pick up applications. He still held to his Patriarchal beliefs, but in light of our situation, he got over issue of my returning to the workplace.Things went smoothly for a couple of months and then came the phone call. My sister in law who lived at our previous residence called. She had received a notice for my husband to appear in civil court. It was an old medical bill from years back. This wasn't exactly a novel experience. In the last year that my husband was working, we had almost been sued over a smaller bill. … [Read more...]
Baptist Taliban: Part 3
by Cindy FosterTHE CHURCH WE WEREThe Preacher and his wife graduated from Baptist Bible College in Springfield, Missouri. At the time he attended there, the college was quite conservative. There were strict rules about dress, dating, curfews, entertainment, music and much more.The Preacher actually grew up in Springfield and was a member of a church that was not nearly as rigid in its standards as the college was, so in the beginning of his ministry as pastor, he did not have the extreme beliefs that he eventually embraced later in his ministry.It was several years after the church had started and was established with its own building that the more relaxed climate began … [Read more...]
Who Was That Masked Man? Part 8
by CaluluTom comes back to church by late fall and he is in his Mr. Charlie Church mode again, except he doesn't exactly get with the program.During that summer many of us, myself included, started going off to conferences many weekends, to places like Toronto Airport Christian Fellowship or Life Center to the Voice of the Apostles weekends in Harrisburg PA. I added in going down to Brownsville AoG revival in Pensacola and flying off to Fresh Fire in Abbottsford Canada.If it was November we'd all be at Global Awakening's Voice of the Apostles conference. If it was July we'd been in Toronto for the Worship Party Conference and all over the place the rest of the time. We averaged … [Read more...]
Millipede: Part 9
by MillipedeThat what was forgotten....All this time though a dark wave was cresting over our existence.Through the years as my husband gained weight until he was morbidly obese, health problems cropped up, some requiring hospitalization. As you can guess the bills started coming in. While he was able to pay some of them, the larger one's were never fully paid off. Then there was the truck driving school lone. For a while, my husband was able to make the minimum payment. Then he got behind and was never able to get caught up. He would pay, but always be a month or to behind. All it would take was some other financial need to crop up and we would miss a payment. This made the … [Read more...]
Submission and Prison Cells: Part 2
by Melissa Permission to Live Click here for Part OneLet me start by saying a sincere "I am sorry" to "Yellowbunnys" (whoever she was, and wherever she is now) and to all the other women I shamed that day. I was wrong. I was arrogant. I was hurtful.It is painful for me to even read what I believed then, much less how I judged others and tried to force them to believe it too.At the time I wrote that, I was barely getting past Post-Partum Depression with my first baby, and was about to be hit with a second wave of it after the birth of my second. I struggled to fulfill my self-imposed idea of perfection, but believed that any and all of the seeming problems with the submissi … [Read more...]


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Tunette's Baby Steps
Tunette Powell shares the joys and struggles of motherhood.
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A Taste of Daycare…
Jason Jr. and I have had very different childhood experiences thus far. When I was growing up my mother wasn't married to a man that jumped for joy at the idea of babysitting. No, instead I was hauled off, every morning, to a daycare to hang out with other unfortunate cry babies. Jason Jr., until […] [Read More]


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Wow what a stunning lack of judgment. First of all every NCAA sanction occurs after the fact and long after the perpetrators have left. It is the nature of the beast.
Secondly, the death penalty is usually reserved for repeat offenders. It certainly be argued that PSU engaged in a continuous cover-up for at least 14 years.
Thirdly, your reasoning - "You could argue that covering up Sandusky aided the team. But it just allowed Penn State to conduct football business as usual. Harboring a pedophile did not give the Nittany Lions a recruiting advantage." is about the dumbest statement I have read in many years. The whole point is that conducting business as usual was the entire motive for the cover-up and avoiding bad publicity certainly did give PSU an advantage that it would otherwise not have enjoyed had the scandal gone public.
Whatever civil penalties the university and the individuals involved get will be richly deserved but that does not mean that the NCAA is relieved of its responsibilities to administer deserved sanctions if only in fairness to the other member institutions. The By-laws do n ot say check to see what other punishment has been served up by other bodies.
Who then hell raised you anyway?
You are spot on Hiker49. If they do not invoke the Death Penalty for these vile offenses that went to the very top of the institution, then they should just take the Death Penalty off the books.
No question - just thanks for being such a class act.
Fantastic! I have no doubt I will see you on Sundays. All the best.
Children were at risk and the PS did nothing? I guess they were someone else's children so it didn't matter.
I only have one question for the PS: How do you people live with yourselves?
The problem is that when you look at conference play the only standouts are Provo and Bailey. Nassib has really been terrible in conference play other than WV, which plays a passive defense. He has not connected on along pass play since the Pinstripe Bowl. Defenses are not afraid of the deep threat and can take away the short to intermediate pass game.
DM has to make some coaching changes starting with Hackett or he will be blown out himself with another bad year. He will start to show up on the coaches hot seat lists and the drumbeat will start. I hope he has the smarts and is tough enough to make coaching and offense changes. I would like to see him succeed.
The last time we looked for a HC nobody showed interest except Holtz and we wouldn't pay him. DM needs to get a real OC and a ST coach. If he doesn't, the calls for his scalp will be very loud next year and it gets tougher as we play USC, Northwestern and MN instead of Tulane and Wake.
If DM does not make major changes he will loose the rest of his support. I am pulling for him.
We could see this coming a mile away. We had trouble with URI and Tulane for Pete's sake. And face it, we actually lost the Tulane game on the field - we were just lucky the replay official blew the PAT call. We only beat Wake because their QB went down during the game. Back then many of us were concerned about what would happen in conference play.
West Va played a passive 5-5-1 against us and Ryan picked it apart. Everything worked. As soon as we saw 4-3's and 3-4's we stunk averaging only 16 ppg excluding WV.
Our recruiting is not going to change anything as it is the worst in the BE.
I am starting to believe that the only hope for turning things around is by playing great D and having a dual threat QB. We don't have the talent to play a pro style offense and we are not going to have it any time soon. Hackett needs to go and we need a real OC with college experience.
Defense is the one place where good athletes playing a sound well-coached system can be greater than the sum of its parts.
A dual threat QB can shorten the game and with a consistently good D we could be competitive again. We have always done better with a dual threat QB style of play.
The one thing DM had achieved was a change in the culture of the program. These kids played their heart out in the first half of the season and just were not up to conference play. Doug needs to reevaluate everything he is doing including the staff and make appropriate changes. I hope he does as I really want to support him and want him to succeed.
We have been outplayed and out-coached. We have the wort Points For average (21) in Big East play and the third worst Point Against (27). If you take out the highest and lowest games we have averaged only 16.8 ppg. The next lowest is UCONN at 21.
Our current recruiting class is one of the statistically worst in years.
I want to be supportive but I am having a hard time finding something to hang my hat on.
We have an OC that has no experience and doing OTJ training. We deserve better than that.
I do not pretend to know the answer but I do knows that losing is wearing thin.
I wish recruiting was just fine but I am afraid that is not the case. We are the worst team in the BE and so is our recruiting. I hate it but I fear it is true.
We continue to play lousy even after a bye week to prepare for Cincy without Collaros. Nothing has changed. The offense basically sucks in BE play with the only exception being against WV who played a passive 3-3-5 against us. Apparently, all you have to do is play a 4-3 blitzing defense and our Offense is incapable of more than an average of 16 points in BE play (minus WV). Hackett is the worst OC in the BE. He has no experience and it shows. Something has to change next year because the recruiting certainly has not.
I certainly do remember and that has nothing to do with a coach that has been promoted to a very important position and just is not cutting it. I am a big supporter of Marrone and the rest of the staff but I think the jury is in on Hackett. I think DM knows it and he will be gone by next year. If not, I will hope for his success.
It seems to me that unless Hackett figures out how to stop aggressive blitzing teams we are in big trouble because that is what every remaining game will be like.
West Virginia's passive 3-3-5 is tailor made for our offense. Why they conintue to play that against us I will never know but thanks.
Hackett has no experience as an OC and it shows. He is playing checkers against DCs who are playing chess.
We really need to get a real live OC next year. IF DM is going to bring this program back he will have to make the tough decisions and improve this sorry part of our program.
Well, these linemen did pretty good - Mike McCarthy, TE; Bill Belichick, Center/TE; Andy Reid, OL.
Get help Christian. Maybe Katie can help - she has the right numbers.
We beat them last year with their stupid 3-3 5 and we crushed them this year again. It's not like they didn't have 2 weeks to plan for a team that upset them last year. They were out coached and outplayed. So much for offensive geniuses.
This was a statement win and we got great coverage on ESPN and elsewhere. On Friday we had 2 of the top 10 plays (Lemon's catch and Graham's KOR).
Being members of the ACC and wins like this will help tremendously with recruiting. Now, if sometime this year or next we can sneak into the top 25, if even for a few weeks, we will really be on our way.
The pride is back - Go CUSE!!
There are really big problems on both sides of the ball and if you read between the lines, there are changes coming in the offensive game planning. That will be most welcome. I am heartened that DM seems to be on top of it and not in denial.
Marrone was left with a cesspool. IMO he has started to take the team in the right direction. It takes time to rebuild from the GROB disaster and he has done admirably so far. He is .500 with a bowl win during what can only be charitably described as rebuilding.
Time will tell abut his recruits. He has chosen to rebuild the NYS network and is making progress in FL & GA. There are some really exciting freshmen and there are definitely some stars in the group.
The next two years will gauge if we are really on the right track and I am betting we are.
Go Orange!
Nassib is fine and will bounce back, There are reports that he dealt with a hand problem all week in practice. He deserves a little support at the moment - he has earned that much.
DM is fine but he needs to change the ST coaching setup because it ain't working and won't.
The problem is Hackett! He is in way over his head and needs to go back to coaching QBs and TEs.
We need to hire a special teams coach. We treat ST as an after thought. Really dumb idea to have the coaches share ST responsibility.
Hackett's play calling just gets worse and worse. Our running game was gaining traction and we have the ball 1st and goal on the 5. Bailey had already scored from the 5 earlier...so what does Hackett call? - A slant pass into a crowded area from an empty backfield!
Now, the end zone is 10 yards deep so from the five there is 15 yards with 22 bodies occupying the territory. A slant goes right in to the heart of that traffic and in that limited space is always susceptible to tips and deflections. With an empty backfield there is only the QB to track down an interception. We are very lucky that was not a pick 6. Run the darn ball a couple of times and then throw a low risk pass like a fade. At the very least we get 3 points and there is no OT.
I truly believe that one of the problems with our offense is that Hackett just can't hack it. We need a real offensive coordinator. Instead we have a guy learning on the job.
Kudos to Shafer and the D - great job.


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May has come and gone and summer is in sight! The weather is heating up and so are the Twitpics and Instagrams from our favorite scantily clad celebs. All in all, goods things are going down.
All the usual suspects and old favorites are here! Everyone's favorite good-girl-gone-bad Rihanna continues to be pretty much the hottest person on Instagram (debatable), but she has some serious competition. VH1's very own Draya Michele modeled her vast collection of swimwear via social media, as did Ice-T's lovely model wife Coco. Recent birthday girl Heidi Klum proves that she's still flawless at 40, and Ireland Baldwin is probably giving her dad Alec a heart attack! If you can't stand the heat, stay out of the gallery above. It's filled with the best that social media had to offer from the month of May. But if you're into that kind of thing (and we definitely are), enjoy!
[Photo: Twitter/Instagram]
RELATED: The 30 Hottest Twitpics And Instagrams Of April 2013


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This so-called "Downy cell" is typical of lymphocytes infected by EBV (Epstein Barr Virus) or CMV (Cytomegalovirus) in infectious mononucleosis. Downy cells may be classified as types I, II, or III. This is a type II Downy cell.
Saint Agnes Medical Center | 1303 E. Herndon Ave. Fresno, CA 93720 | 559-450-3000


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Your invitation to experience the ideal business – DoTerra.
A major American financial company called Paine Webber created a list of elements for the ideal business.
1. The Ideal Business sells the world rather than a single neighborhood or even a single city or single state. In other words, it has an unlimited global market.
2. The Ideal Business offers a product, which enjoys an inelastic demand. Inelastic refers to a product that people need or desire almost at any price.
3. The Ideal Business markets a product that cannot be easily copied. This means that the product is an original or, at least, it is something that can be copyrighted or patented.
4. The Ideal Business has minimal labor requirements. The fewer personnel, the better.
5. The Ideal Business operates on a low overhead. It does not need an expensive location. It does not need large amounts of electricity, or advertising, or legal advice, or high-priced employees, or a large Inventory.
6. The Ideal Business does not require big cash outlays or major investments in equipment or product. In other words, it does not tie up your capital.
7. The Ideal Business enjoys cash billing. In other words, it does not tie up your capital with lengthy or complex credit terms.
8. The Ideal Business is relatively free of all kinds of government regulations or structures.
9. The Ideal Business is portable or easily moveable. This means you can take your business and yourself anywhere you want to.
10. The Ideal Business satisfies your intellectual needs. There is nothing like being fascinated with what you do.
11. The Ideal Business leaves you with free time. In other words, it doesn't require your labor and attention 12, 16, or 18 hours a day.
12. The Ideal Business is one in which your income is not limited by your personal output. In the Ideal Business, you can sell to 10,000 customers as easily as you can one.


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My Tot Travels
Lilliana is a wife, mother, employee and entrepreneur trying to balance responsibilities with fun while raising her first child. A former PR pro and current Marketing Director for a group of doctors, Lilli and her husband loved travel, and when they had their daughter realized what a production it could be to take a trip with a baby (or any kids for that matter).
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Mean mom seeks help…
Have you ever been the mean mom? Not because you said "no" to your teenager but because you seem to be constantly fighting with your preschoolers? I know mother/ daughter relationships can be very complicated but I thought that didn't start until they were teens. I have been blessed with two amazing little girls that […] [Read More]
To my daughters on Mother's Day
Today is supposed to be a celebration of motherhood & all that comes with that. For us, since I'm your mom, it's by default a celebration of me. Oddly, I can't think of celebrating without either of you being the focus. Actually, most decisions in my life have both of you at the center. So […] [Read More]
Project 52:15 – late
52:15 our journey is: late but better than never in many ways we started late: older parents, second marriages and since we are older we treasure our family all the more he said she said If you want to learn more about our project 52 and why ours consists of two pictures click here. Sometimes […] [Read More]
Project 52:10 – fun
52:10 our journey is: fun playful moments give our souls richness bring us closer together and help us weather life's storms so daily we try to have at least a little fun he said she said If you want to learn more about our project 52 and why ours consists of two pictures click here. […] [Read More]
Project 52:9 – a celebration
52:9 our journey is: a celebration life is to be savored experienced and enjoyed because each day with our children is a gift worthy of a celebration WE said If you want to learn more about our project 52 and why ours usually consists of two pictures click here. Amazing how quickly time seems to […] [Read More]
I have struggled with whether I should write this post or not but my heart tells me I have to. Recently several different couples around us have come to a crossroads in their marriages. For most, it is about infidelity. It hurts to know their lives are changing so drastically and that they are experiencing […] [Read More]
Project 52:4 – nourishing
52:4 our journey is: nourishing wholesome, rich and delicious parenting nourishes our soul first foods nourish baby's tummy while we all learn and grow together she said he said If you want to learn more about our project 52 and why ours consists of two pictures click here. Last week was intense but this week […] [Read More]
I haven't talked about my second pregnancy much in this blog with the exception of mentioning pregnancy hormones making me extra sensitive. I didn't share because frankly I was terrified of the possibility of losing the baby. I am now about 5 weeks away from my due date and feel a little better sharing. My […] [Read More]
Work in Progress
Some days are hard. You seem to start on the wrong side of everything and all tasks seem like an uphill climb. Sometimes it's physical or emotional or a little of both. Those days are often accompanied by a not-so-great-mood and making it through the day takes every bit of strength and energy that I […] [Read More]
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Video:Tips for Shotgun Safetywith Mike Sebbert
Want to learn about shotgun safety? Here, see tips for making sure that you're minding rules and safety tips when shooting.See Transcript
Transcript:Tips for Shotgun Safety
Hello my name is Mike Sebbert, and I am an avid lifetime hunter, a member of the NRA, the National Wild Turkey Federation, and the Kansas First Upland Pioneer Chapter. I am here today to talk about shotgun safety for About.com.
Tips for Shotgun Safety
The importance of shotgun safety is the fact that you are responsible, and you should know and be comfortable with the weapon you are holding. When it comes to shotgun safety you can never be too safe. There are many, many things put in place on shotguns and hunting rifles in order for you to not hurt anybody or yourself. One thing is I always carry my gun with the breach open in order that you can always see that there is not a shell in the magazine ready to fire.
More Tips for Shotgun Safety
Secondly every gun is equipped with a safety. This one is right here and if you push this button it is now fire ready. You always want to make sure your safety is on when you are ready to go. When transporting a weapon always have it pointing up or down, never at someone else. Never transport it with your finger on the trigger. Always have your finger away. The only time you put your finger on the trigger is if you are ready to shoot. If you have kids in the house, I would never store a loaded gun in the house. The only way you could get away with that, if you are comfortable is a gunsafe. I would choose a very nice gunsafe with a combination lock, never let your kids have the combination or play on, in, or around a gun safe.
Additional Tips for Shotgun Safety
When you keep a gun in a gunsafe, the humidity control keeps your gun from rusting out therefore keeping your gun in working order. Never clean a loaded weapon, make sure that the barrel is free and unobstructed from anything, you have no shells in the magazine you do not want an accidental fire or discharge. It works for storing, cleaning or hunting. Never have a loaded gun while you are traveling to and from where you will be hunting or in storage to and from your hunting destination. When you are ready to actually hunt and/or fire your gun the only safe option is to have your safety on until you are ready to shoot. I always have my finger on the safety and if a bird or an animal or whatever I am hunting pops up I can easily transition from pushing the safe off to fire and then pulling the gun up to fire.
Shotgun Safety
When hunting, before you go out always check with your local laws and check with your state hunting practices to find out what you can and cannot do and all your other safety procedures.
Before you start a hunt , make sure you are mentally prepared and you have a mental checklist of things you need to do and take care of before you begin. Always keep your safety on, follow your safety guidelines. When you are in the middle of a hunt always look where you are hunting and where others are around you.
You never want to point a gun at anybody or even close to around somebody. Your shot will go somewhere. Always take into consideration it can go further. It will not stop when it hits your target or your intended target. It can go further and may even go farther than you intend.
Thank you for watching and for more information on shotgun safety check us out on the web at About.com.


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Moscow's mojo [1]
The Exile: sex, drugs and libel in the new Russia
Mark Ames and Matt Taibbi Grove Press, 256pp
The Exile: sex, drugs and libel in the new Russia
Mark Ames and Matt Taibbi Grove Press, 256pp
by Oliver Ready [2] Published
The gifts bestowed by freedom on 1990s Moscow - the teenage prostitutes from the provinces cheek by jowl in the subways; the courtyard shoot-outs; the barely credible excesses of poverty and wealth - were grist to the satirist's mill. The invasion of the foreign legion, moving between their western-style apartments, American diners and botched reform projects, added its own hue to the madness. Since 1997, Mark Ames and Matt Taibbi, the editors of the biweekly tabloid eXile, have been the expats' principal caricaturists, on a mission to "at least make it tough for them [the "corporate henchmen"] to maintain their public superiority complex while they went about their business of fucking up huge historical missions like the reform of post-Soviet Russia".
In this, they succeeded. Ames and Taibbi, two self-styled "American suburban yo-yos", have brought genuine inventiveness to the task of making prominent westerners and others look exceptionally stupid, extracting serious opinions from a former Moscow bureau chief of the World Bank about a fictional financial crash in Mongolia, or interesting the Gorbachev Foundation in sending their president to undertake a perestroika of the New York Jets. All this is then written up and served, over breakfast or lunch, at all the main expat points within the "Garden Ring".
But their role is more than clean mischief. Ames and Taibbi want to be the definers and chroniclers of what they affectionately call Moscow's "rape-camp mojo". It's a vibe that pulses from the pages of their clubbing guide, which lists your chances of getting beaten up or laid in any of the city's countless nefarious nightspots, as from their "Death Porn" section, which details the most gruesome crimes of the week. Exploitation, of Russia's economy and women, was at the heart of the "mojo". In their book, as in their paper, Ames and Taibbi opine with exaggerated concern about the first and revel in the second. Ames's misogynistic outpourings - and those of the National Bolshevik leader, Edward Limonov, a regular contributor - became an editorial speciality, while an infamous "rape" column by a phantom club reviewer took eXile further beyond the pale and higher still in the public consciousness.
Freedom of speech brought an understandable, if immeasurably harmful, wave of pulp to Russia, and it takes only a glance at a local provincial newspaper to understand the popularity of the pirate-video culture. Another more serious issue is why there should be a need for pulp among Moscow's affluent expatriates and tourists. Ames and Taibbi's paper, it seems, has always responded to the gap-year mentality that is characteristic of many visitors to Russia. It panders, with its very name, to the deliberate self- delusion that living there, in eXile, is somehow difficult and heroic, and that, therefore, anything goes.
With their book, Ames and Taibbi have tried to put themselves at the centre of the legend - which has been doing the rounds in Moscow since the crash in 1998 (when the exodus of foreigners began) - that the mid-1990s were an epoch of unprecedented freedom and degeneracy. But their messy rebel-narrative is no more than an assembly of strands often of little interest to the international audience - an entire chapter is dedicated to the virtues of speed, another to Michael Bass, a fourth-rate celebrity once regrettably prominent in the expat firmament. There are insights worth reading, such as Taibbi's deconstruction of western reporting out of Russia; and, on occasion, the boys can write. But they have little to say about Russia or Russians beyond the glitter of money and sex. Worse, with their aggressively self-conscious prose, the would-be anarchists fail to communicate the cherished "mojo". You are left wondering whether they really did have a good time with all their speed and compliant girls.
Oliver Ready is the books editor of the Moscow Times