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The Homeland Security Department is updating its law enforcement technology capabilities with plans for migrating to mobile devices and advances in information sharing, according to CIO Richard Spires.
DHS has set up a joint program office to plot the migration of its law enforcement agents from tactical radios to modern smart phones within five years.
"This is a very big initiative," Spires said at the AFCEA-Bethesda Law Enforcement Information Technology Day conference on April 18. The phased change in devices could take about five years, he added.
"We want to transition from Land Mobile Radios to a 4G LTE (Long-Term Evolution) world," Spires said. The LTE technical standard applies to smart phones developed in 2011 or later.
One of the prime motivators for the change is the "promise of on-demand video to law enforcement agents in the field. That is very compelling, and will support effective use," Spires said.
Another factor is the desirability of mobile devices that can allow for biometric identification checks in the field for individuals detained near the border, he added. Customs and Border Protection agents have been asking for that capability, he said.
The joint program office reports directly to himself, Spires added. It is reaching out to industry to leverage available capabilities already in the market. DHS expects to carry out an innovation competition with prizes to spur development of additional capabilities for its needs, he said.
Meanwhile, while subject matter expects from throughout the department are being pulled together for the program office, the department expects to continue to support land mobile radios in the interim.
DHS recently awarded a contract valued at a maximum of $3 billion over five years to 30 vendors of tactical radios.
Spires said the interagency National Information Exchange Model (NIEM) framework for exchanging information has provided a technical underpinning allowing for exchange of data between DHS, Justice, Health and Human Services and others, for a total of 16 federal agencies. The NIEM is an Extensible-Markup Language based system for exchanging data.
Offering an example of how NIEM is applied, Spires said the framework creates a common platform to access numerous state databases for license plate holders, essentially creating a nationwide license-plate search capability that allows officers to check whether a plate is reported stolen or whether its owner is wanted on suspicion of criminal activity. However, while NIEM has been a very useful tool, it has received no line item funding from Congress, he added.
"I am trying to get a line item for it in the budget," Spires said. "I have tried for three years, and I am not giving up."
About the Author
Alice Lipowicz is a staff writer covering government 2.0, homeland security and other IT policies for Federal Computer Week.
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Leidos, Accenture and Cerner pull off an unexpected win of the multi-billion-dollar Defense Healthcare Management System Modernization contract, beating out the presumptive health-records leader.
Millions of background-check records were compromised, OPM now says. Here's the jaw-dropping range of personal data that was exposed.
The General Services Administration is going to great lengths to gather feedback on its IT services GWAC. Will it make for a better acquisition vehicle?
Agency details results of an "interagency forensic investigation," plans for assisting affected individuals.
Merit Systems Protection Board data from as far back as November 2014 could be missing.
Three-time Federal 100 winner is leaving government in July.
Members of Congress heaped hard questions on federal IT leaders at a June 16 hearing and suggested strongly that somebody needs to be fired.
Senate bill carves out exemption for supercomputing and other lab IT; an earlier version of the measure would have exempted the entire Department of Energy.
OPM is partnering with CSID to try to manage the fallout from a massive breach of some 4 million federal personnel records.
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Learn to solder class!
August 4, 2011| 26.61 USD
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Have you been dabbling in electronics and building all your circuits on breadboards? Maybe it's time you learn how to solder with Workshop 88! Want to improve your soldering skills? Come to our soldering class and see what you can do to make you soldering better. We've got some great new soldering irons that you'll get to make use of during the class.

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I just can't stop laughing at these pictures. Here's The Tiz in Milan, promoting an Italian clothing line called Puerco Espin.
Now, I don't know what "Puerco Espin" actually means in Italian. And I'd rather not have anyone tell me. Because right now I'm translating it in my head as Pork Spin, and it's making me think of porkspin.com and that's cracking me up. (WARNING: DO NOT click on that link at work. In fact, do not click on it EVER. Just email the link to someone you really hate, and then bury it deep in the darkest recesses of your memory, where you keep things like the places your uncle touched you and the early Miss Bliss episodes of Saved by the Bell.)


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|Reps. Rahall, Mica, Capito
Speakers included representatives of state and local governments, contractors, and business.
Interesting tidbits from the meetings:
Ranking Minority Member Nick Rahall said he "envisions reauthorization legislation containing about half the money" compared to last year's draft $500b bill, and that the lower amount won't even maintain current needs.
Public private partnerships can be a good approach but won't help some states. WV State DOT Director Paul Mattox noted that due to the West Virginia terrain "our construction costs are too high and our traffic loads too low," said Mattox, "making it a challenge for us to attract private partners" who would build new highways in exchange for toll revenues.
There are other approaches that can save money and time, Mattox explained, citing the "combining planning and construction bids into single "design-build" contracts as a way the state is saving money on road work. He said more than $20 million was saved on the U.S. 35 upgrade alone."
Transit is important also, even in rural states, Mattox observed. "Many West Virginians, particularly in the rural areas, are transit-dependent and utilize these services to get to work, the doctor, shopping and to take care of the necessities of life." This comment from a State DOT Director reflects the belief of most State DOTs and runs counter to the erroneously claims constantly promoted by some interest groups that state DOTs care only about roads.
One construction company executive commented on the growing mantra of doing more with less: "If we continue doing more with less, soon we'll be doing nothing." Another executive noted that "We need a comprehensive bill passed, so we can know what to expect and make informed decisions on things like what equipment to buy."
Rahall addressed the controversy of earmarking: "I strongly believe that an elected representative knows his or her district better than an unelected bureaucrat in Washington, or even the President of the United States," Rahall said. "If we were to eliminate such a process as earmarking, we would be empowering those unelected bureaucrats in Washington and/or the President of the United States."
"Highway funding woes bring hearings to state," Charleston Gazette
"Beckley hosts U.S. House transportation hearing," The Register-Herald
Image: (Kenny Kemp, Charleston Gazette)


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With the elegance of a master's hand in the sure and solid strokes of a pen of silver, these Sterling Silver Cubic Zirconia Cursive Initials bring the letters to life. The flowing symbols are imbued with twinkling cubic zirconias to give them a flash of life as well as enhancing their beauty. Personalize the necklace by choosing the cursive initial charm you would like added to a 16 inch silver rhodium chain, to create a cursive initial necklace. Each CZ Cursive Initial charm measures 1 inch in diameter and dangles from a snake chain.
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You may return or exchange your jewelry within 60 days of purchase if you are not satisfied with it. The jewelry must be returned in its original condition for a refund or exchange. Engraved, personalized, photo, monogram, name and initial, chocolate and clearance items are not returnable or exchangeable.


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Michael De Leon
Michael A. De Leon is a graphic designer by day, but wears many hats in his off time. In 2004, after several years of covering the Spurs, he started Project Spurs, a Spurs team fansite as an outlet to provide content to Spurs fans, while continuing to write for himself and learning the ins and outs of online publishing and web design. He has since built a writing team and started a popular weekly Spurs podcast called the Spurscast.
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Should Spurs target Aaron Gray?
By Jason Rogers, Project Spurs New Orleans Hornets big man Aaron Gray has informed his team that he will be opting out of his contract and testing the waters of free agency: The New Orleans Hornets lost another player to unrestricted free agency Monday afternoon when backup center Aaron Gray informed the team he was […] [Read More]


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Pet Top Combo Pack Portable Water Bottle Drinking Adaptor for Pets
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Pet Top Combo Pack Portable Water Bottle Drinking Adaptor for Pets
Pet Top Combo Pack Portable Water Bottle Drinking Adaptor for PetsThe Pet Top portable drinking device for pets is a great accessory which comes in handy if you take your pet on long walks, to the park, or on trips. The Pet Top Portable Water Bottle Drinking device is a unique patented bottle top which fits most standard water bottles, so you'll always have a ready source of water nearby. Provides a neat and convenient water supply for your pet when you're on the go and can't be bothered with the mess, hassle and waste of pouring water into a bowl. It's small enough to fit in a jogging pack, purse or pocket when not in use.It's adjustable so it works for any size pet! You adjust the flow of water by simply turning the cap, so your pet gets just the right amount. And our unique ratchet-action keeps the Pet Top portable drinking device open at your desired setting while in use, so your pet gets the right amount of water throughout! And it automatically stops when the pet stops drinking. So there's no muss, no fuss. Easy to clean - it's dishwasher safe. The Pet Top makes a great gift for any pet lover - a must have.
1. Simply twist the Pet Topr drinking device onto one of the many compatible water bottles, by gripping the base of the unit and turning clockwise onto the bottle neck until it fits snugly.2. Hold the base of the device and turn the upper cap counterclockwise to the open position that's best for your pet. Indicator markings help you easily remember the desired open position and ratchet-action keeps the device open at the desired setting. IMPORTANT: The Pet Top drinking device is designed to be used by pets of various sizes-to minimize drips and prevent your pet from taking in water too fast, please use the smallest opening that works for your pet and do not squeeze the bottle. When you get to the maximum open position (largest indicator marking) you should feel greater resistance-please do not loosen the upper cap beyond the largest indicator marking as the ball may dislodge or you may damage the device.3. Turn the bottle upside down and allow your pet to lick the ball. Do not squeeze the bottle. Most pets intuitively take to the device, especially if they're thirsty. TIP: If your pet doesn't readily lick the ball, first wet the ball by rolling it with your finger. If necessary, place some peanut butter or corn syrup on the rim around ball until your pet learns to use it.4. When done, turn the upper cap clockwise until it seals tightly with the ball.5. To refill the bottle, simply remove the device by twisting the base counterclockwise, fill with water, and reattach as in Step 1. It's easy to clean! The Pet Top portable drinking device is dishwasher-safe! Just open the Pet Top device to the largest indicator marking (maximum open position), secure the device on the top rack, use normal cycle and do not heat-dry. Please take care not to force the Pet Top device beyond the largest indicator marking, as the ball may dislodge and/or you may damage the device.Warning: This device has small parts that may be a choking hazard if used improperly, so please keep this product away from children under 3 years old. Do not allow your pet to chew on device. Do not open upper cap beyond largest indicator marking as ball may dislodge or device may be damaged. Please inspect your Pet Top drinking device prior to each use. To minimize drips and excess water to your pet, use the smallest opening that works for your pet and do not squeeze the bottle. Do not use while driving.
Pet Top Combo Pack Portable Water Bottle Drinking Adaptor for Pets
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text:
Electronic modules are formed by encapsulating microelectronic dies within cavities in a substrate.
1. A method for constructing an electronic module, the method comprising:
forming a fill hole in a first side of a substrate and a cavity in a second side of the substrate, the cavity in fluidic communication with the fill hole;
forming a post within the cavity by, at least in part, positioning a via chip within the cavity, the via chip comprising a matrix disposed around the post;
positioning a die within the cavity; and
injecting an encapsulant through the fill hole into the cavity to encapsulate the die positioned therein.
2. The method of
disposing the die on a dielectric layer; and
disposing the dielectric layer over the second side of the substrate such that the die is disposed within the cavity.
3. The method of
4. The method of
5. The method of
6. The method of
7. The method of
8. The method of
9. The method of
10. The method of
11. The method of
12. The method of
13. The method of
14. A structure comprising:
a substrate defining at least one fill hole in a first side thereof and a cavity in a second side thereof, the cavity in fluidic communication with the at least one fill hole;
a via chip positioned within the cavity, the via chip comprising a matrix disposed around a post formed within the cavity; and
a die at least partially encapsulated within the cavity by an encapsulant.
15. The structure of
16. The structure of
This application claims the benefit of and priority to U.S. Provisional Application Ser. No. 61/042,512, filed Apr. 4, 2008, the entire disclosure of which is hereby incorporated herein by reference.
The present invention relates, in various embodiments, to the construction and fabrication of high density heterogeneous electronic modules.
High density electronic modules have been designed and fabricated to satisfy the increasing demand for high levels of functionality in small packages. Products that may be made from the modules include memory, digital logic, processing devices, and analog and RF circuits. Typically, the integration density of electronic modules is many times greater than surface mount technology ("SMT") is capable of achieving, but less than an application specific integrated circuit ("ASIC"). However, for low volume production, these modules offer an alternative to ASIC devices, as they require less set-up cost and development time. Moreover, modules may be optimized for particular applications that demand multiple functions—for example, a pre-fabricated microelectronic die optimum for each desired function is selected, and the multiple dies are then interconnected and packaged together to form the module. Often, the pre-fabricated dies will have different form factors and thicknesses, making attempts to package them together in a single module problematic. Additional difficulties may arise when attempting to vertically interconnect different layers of dies together in a single module, as the requisite processing may damage the dies in each layer.
The fabrication of electronic modules typically features pre-thinned microelectronic dies simply positioned on an adhesive-coated substrate. A custom-machined spacer is then placed over and between the dies in order to provide a planar surface for further processing, including metal deposition, patterning, and interconnection. A thin dielectric layer is often laminated (via application of high pressure) over the dies and spacer to provide the requisite isolation between the dies and the metal interconnects. Vias to the die pads (i.e., the conductive contact pads connecting to the inner circuitry of the die) are then laser drilled and filled with a conductive material. Although high integration density may be achieved using this method, there are certain limitations. For example, dies thinned to less than 100 μm, e.g., approximately 35 μm or less, might not survive the high pressure used for lamination. Furthermore, the dies that are used typically cannot be thinned after they are placed on the module substrate, limiting the module thicknesses that may be achieved. Another limitation of this method is the use of laser-drilled vias, which are typically limited in diameter to approximately 40 μm. This puts constraints on die pad sizes, which restricts design choices to certain devices. In addition, spacing between dies must typically be greater than the via diameter to allow deep via formation. Finally, deep, high-aspect-ratio vias are often difficult to reliably and repeatably fill with the conductive material (as is required to interconnect multiple layers in a module).
Thus, in order to service the demand for increasingly small microelectronic systems, improved systems and methods for constructing high-density electronic modules are needed.
In accordance with certain embodiments, a technique is provided for forming high-density electronic modules that include encapsulated dies and reliable interlayer and/or intradie interconnections. The dies are preferably encapsulated with a bipartite structure that includes a dielectric layer protecting the active device surface and an encapsulant surrounding the rest of the device. Moreover, posts are preferably simultaneously formed with cavities that contain the die. These posts form at least a portion of electrical connections between dies or across a single die.
In one aspect, embodiments of the invention feature a method for constructing an electronic module. The method includes forming at least one fill hole in a first side of a substrate and a cavity in a second side of the substrate. The cavity is in fluidic communication with the fill hole, and a die is positioned within the cavity. An encapsulant is injected through the fill hole into the cavity to encapsulate the die. The die may be disposed on a dielectric layer that is disposed over the second side of the substrate such that the die is within the cavity.
Embodiments of the invention may include one or more of the following. At least one post may be formed within the cavity, and the post may be formed during cavity formation. Forming the post may include positioning a via chip within the cavity, and the via chip may include a matrix disposed around the post. The matrix may include silicon and the post may include a metal, e.g., copper. Forming the via chip may include defining a hole through the thickness of the matrix and forming a metal within the hole to form the post.
A conductive material may be formed over the post and the interior surface of the cavity. The encapsulated die may be electrically connected to a second die, and at least a portion of the electrical connection may include the post. At least one layer of conductive interconnections may be formed over the second side of the substrate. At least a portion of the first side of the substrate may be removed to expose at least a portion of the die, and at least one layer of conductive interconnects may be formed over the exposed portion of the die. A handle wafer may be disposed over the second side of the substrate prior to removing at least a portion of the first side of the substrate. A temporary bonding material may be formed over the handle wafer prior to disposing it over the second side of the substrate. The encapsulated die may be individuated.
In another aspect, embodiments of the invention feature an electronic module that includes a die encapsulated within each of a plurality of cavities in a substrate. At least one post defines at least a portion of an electrical connection through the substrate. The post and the substrate may include the same material, which may be a semiconductor material. The die may be encapsulated by an encapsulant and a dielectric layer, which may include different materials. The encapsulant may include a filled polymer and the dielectric layer may include an unfilled polymer. Each die may have a surface that is substantially coplanar with a surface of each other die. A conductive material may be disposed over at least the lateral surfaces of the post.
In yet another aspect, embodiments of the invention feature a structure that includes a substrate defining at least one fill hole and a cavity in fluidic communication with the fill hole. The fill hole is in a first side of the substrate and the cavity is in a second side of the substrate. A die is at least partially encapsulated within the cavity by an encapsulant. A dielectric layer may be disposed over the cavity and in contact with the die. A plurality of fill holes may be in fluidic communication with the cavity.
These and other objects, along with advantages and features of the invention, will become more apparent through reference to the following description, the accompanying drawings, and the claims. Furthermore, it is to be understood that the features of the various embodiments described herein are not mutually exclusive and can exist in various combinations and permutations.
In the drawings, like reference characters generally refer to the same parts throughout the different views. Also, the drawings are not necessarily to scale, emphasis instead generally being placed upon illustrating the principles of the invention. In the following description, various embodiments of the present invention are described with reference to the following drawings, in which:
Referring to
Referring to
Referring to
In a preferred embodiment, dielectric layer 220 is a good electrical insulator, forms uniform coatings over uneven surfaces, and is relatively transparent. Dielectric layer 220 may be initially formed on film 210 as a liquid. In one embodiment, dielectric layer 220 is capable of being used to produce coatings or films with uniform thickness using equipment typically employed in fabrication of semiconductor devices. Initial heat treatments of dielectric layer 220 may allow it to become "tacky," or at least mildly adhesive. Further heat treatments may ultimately cure/crosslink dielectric layer 220 such that it becomes a rigid structural material.
In one embodiment, dielectric layer 220 is selected for its sensitivity to light (i.e., it is photosensitive or photoimageable). Thus, areas of dielectric layer 220 may be removed by standard photolithographic methods, e.g., prior to being fully cured. In another embodiment, dielectric layer 220 is not sensitive to light. In such a case, dielectric layer 220 may be patterned using mechanical methods such as masking, machining, deep reactive ion etching (DRIE), or ablation with a laser, before or after it is fully cured.
In order to facilitate accurate placement of microelectronic dies 200, film 210 may be placed over die placement mask 230 containing features corresponding to the pattern of cavities 140 and posts 150 defined on substrate 100. Film 210 and dielectric layer 220 are preferably at least partially transparent, and, as such, the microelectronic dies 200 may be placed on dielectric layer 220 in locations defined on the die placement mask 230 thereunder. Film 210 may include or consist essentially of a substantially transparent material (e.g., Mylar or Kapton), and it (and dielectric film 220 thereover) may be supported around its perimeter by an alignment ring 240. In an embodiment, alignment ring 240 includes or consists essentially of a rigid material such as a metal. Die placement mask 230, film 210, and dielectric layer 220 are preferably heated by a heated platen 250 disposed below die placement mask 240 to a temperature of approximately 60� C. to approximately 100� C. The elevated temperature softens dielectric layer 220 such that, as each microelectronic die 200 is placed in a desired location (dictated by the pattern on die placement mask 230), it adheres to dielectric layer 220. Once in contact with dielectric layer 220, the front, active surfaces of microelectronic dies 200 may be approximately coplanar, within �2 μm. The front surfaces of microelectronic dies may be substantially coated, i.e., "sealed," by dielectric layer 220.
Referring to
Referring to
In an exemplary embodiment, microelectronic dies 200 are encapsulated according to the following steps. First, platen 410 is heated to approximately 30� C. and encapsulation chamber 400 is evacuated for approximately 5 minutes in order to out-gas encapsulant 450. The vacuum in encapsulation chamber 400 also substantially prevents the formation of trapped air bubbles in cavities 140 during encapsulation of microelectronic dies 200 (as described below). Fill holes 110 are aligned above pockets 445, and force is applied to pressure plate 420 in order to seal the back surface of substrate 100 to o-rings 430 covered with film 440. A pressure of approximately 15 pounds per square inch (psi) is applied to the back surface of film 440 via the introduction of compressed gas through holes 460, thus forcing encapsulant 450 through fill holes 110 into cavities 140. Dielectric film 220, supported by pressure plate 420, at least substantially prevents the flow of encapsulant 450 between microelectronic dies 200 and dielectric film 220, maintaining the substantial coplanarity of the top surfaces of microelectronic dies 200. The pressure is applied for approximately 5 minutes, whereupon the pressure is reduced to, e.g., approximately 1 psi. Platen 410 is heated to approximately 60� C. for a time period sufficient to at least substantially cure encapsulant 450, e.g., approximately 4 hours. As encapsulant 450 cures, its volume may be reduced, and the pressure applied to film 440 is sufficient to inject additional encapsulant 450 into cavities 140. Thus, cavities 140 are continuously filled with encapsulant 450 during curing, ensuring that cavities 140 are substantially or completely filled with encapsulant 450 after curing. Substrate 100 is then removed from encapsulation chamber 400, and excess encapsulant 450 present on the back surface of substrate 100 may be removed by, e.g., scraping with a razor blade and/or application of a suitable solvent. Curing may be continued at a temperature of approximately 60� C. for a period of approximately 3 hours to approximately 5 hours. Film 210 is then removed from substrate 100, leaving dielectric layer 220 substantially or completely intact. After removal of film 210, the exposed surface of dielectric layer 220 is preferably planar to within �2 μm. The presence of dielectric layer 220 over microelectronic dies 200 preferably maintains this planarity even after introduction of encapsulant 450, obviating the need to separately planarize encapsulant 450 and/or microelectronic dies 200 after encapsulation. In other embodiments, other techniques are utilized to introduce encapsulant 450 into cavities 140. For example, a syringe, an injection-molding screw, or a piston pump may be utilized to introduce encapsulant 450 into cavities 140 through fill holes 110.
In an exemplary embodiment, encapsulant 450 includes or consists essentially of a filled polymer such as molding epoxy. The filler may reduce the thermal expansion of the polymer, and may include or consist essentially of minerals, e.g., quartz, in the form of particles, e.g., spheres, having characteristic dimensions, e.g., diameters, smaller than approximately 50 μm. Encapsulant 450 may be an insulating material having a coefficient of thermal expansion (CTE) approximately equal to the CTE of silicon. Encapsulant 450 may be present in pockets 445 in the form of a paste or thick fluid, or in the form of a powder that melts upon application of pressure thereto. Subsequent processing may cure/crosslink encapsulant 450 such that it becomes substantially rigid. In various embodiments, encapsulant 450 includes or consists essentially of a heavily filled material such as Shin-Etsu Semicoat 505 or SMC-810.
As described above, encapsulant 450 and dielectric layer 220 may cooperatively encapsulate microelectronic dies 200. Encapsulation by multiple materials may be preferred, as encapsulant 450 (which is molded around the majority of each microelectronic die 200) and dielectric layer 220 (which coats the surface of each microelectronic die 200 containing active circuitry) may advantageously have different material properties and/or methods of processing. Encapsulant 450 may wet to and bond directly to dielectric layer 220, thereby forming a substantially seamless interface.
Referring to
Referring to
Referring to
After handle wafer 700 is bonded to a first surface of pre-thinned module layer 600, a thinning process may be performed, as illustrated in
Referring to
Thinned module layer 720 with backside interconnection layer 830 may optionally be connected to a second, similarly processed, thinned module layer 850 by, e.g., bonding the backside interconnection layers of each module 720, 850 together, as shown in
The terms and expressions employed herein are used as terms and expressions of description and not of limitation, and there is no intention, in the use of such terms and expressions, of excluding any equivalents of the features shown and described or portions thereof. In addition, having described certain embodiments of the invention, it will be apparent to those of ordinary skill in the art that other embodiments incorporating the concepts disclosed herein may be used without departing from the spirit and scope of the invention. Accordingly, the described embodiments are to be considered in all respects as only illustrative and not restrictive.
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In spite of what may have appeared to be radio silence on the art front, I've been working quite diligently on another project. These will be 16 illustrations for a short but brutal, terrifying and spiritual book coming out later this year, co-written by two brilliant author / poets. I'm not sure how much more I can say now, but I'll start posting some of the scans soon. The book has 16 short chapters, so I am creating an illustration as a visual response to each one. They will be printed in black and white, but I hope that one of my pieces may be used for the cover so I am including some red and gray in each piece. When reproduced in black and white, the red will look fine as gray. Also, in spite of the fact that the book will probably be a small paperback, I am working large. These are all 11" by 14", ink on watercolor paper, and ready to frame. Here is a quick snapshot of the first nine illustrations. What do you think so far?
Wednesday, January 23, 2013
New Work
Posted by Matt Kish at 11:32 AM
2 comments:
Brutal and terrifying indeed! Not sure which one I like better. The project sounds interesting, can't wait to see more of you work!ReplyDelete
I will be able to post these original scans soon, probably starting tomorrow. It's a pretty intense book, which is thrilling, but it is brutal and dark and I think after this I will take a short break.ReplyDelete
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NEW YORK (AP) — Pop star Shakira says her hips don't lie but her ex-boyfriend does.
The singer and judge on "The Voice" is asking a New York judge to throw out a $250 million lawsuit filed by her ex, Antonio de La Rua (ROO'-ah).
De la Rua is the son of former Argentine President Fernando de la Rua. He dated Shakira for more than a decade before they split in 2011.
De la Rua has been waging an international war against his ex, saying he shaped the "Shakira brand."
The Daily News reports that Shakira said in court papers filed in Manhattan that she does not owe her success to de la Rua.
She says he was just one of her numerous advisers.
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HAMDEN, Conn. Four members of the Quinnipiac University men's soccer team were honored by the National Soccer Coaches Association of America as members of the All-North Atlantic Regional Team. Two-time Northeast Conference Player of the Year Graciano Brito (Sao Nicolau, Cape Verde) was named to the First Team for the second year in a row. Juniors Shane Recklet (Shelton, Conn.) and Freddy Hall (St, George, Bermuda) were honored as members of the Second Team, while Fabricio Silva (Belo Horizonte, Brazil) was named a member of the Third Team.
This is the second season in a row that the Bobcats have had four players selected for the All-North Atlantic Regional Team. Last season, Brito was also selected to the First Team after finishing second in the conference in scoring, while Hall led the nation in save percentage and was named to the Second Team. This season, Brito led the NEC with 18 goals and 39 points and the nation in goals per game (0.95) and second in points per game (2.05). Hall posted seven shutouts and 10 wins in leading the Bobcats to their first postseason appearance in four seasons. Hall had a 369:06 stretch without allowing a goal from Oct. 31 to Nov. 14.
Recklet began the season by scoring the Bobcats' first three game-winning goals. His goal at Iona on Aug. 29 was the first of his career and he followed that with game winners in two of the next three games. Recklet added a two-goal game at Canisius on Sept. 13 before his late game-tying goal at Robert Morris gave the junior defender five goals. His 11 points ranked third on the Bobcats in scoring.
Silva finished tied for the team lead with three assists this season. Starting in 18 games, Silva contributed at both the offensive and defensive ends of the field. His second assist of the season came on Brito's 10th goal of the year against Loyola on Oct. 4. His three points ranked sixth on the team in scoring this season
Brito was honored as the conference's top player for the second consecutive season, while also being named an NSCAA/adidas All-American as a member of the Third Team. His four Brine/NEC Player of the Week honors were also the top figure in the conference this year. Brito became just the fifth player in conference history to be selected as NEC Player of the Year in back-to-back campaigns.
"I am very happy for all four of these young men and thank them for the commitment that they have put into this program," said Head Coach Eric Da Costa. "For the second consecutive year we have been well represented within our region and it is the reflection of the dedication and pride our players have for this program."


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Learn how to generate high-quality output directly from Revit, and create photorealistic renders for presentations and visualizations.
Learn to build curtain walls ranging from simple, preconfigured options to custom and free-form curtain walls with Revit.
Learn to build roofs with Revit: from flat roofs to crazy free-form roofs and everything in between (hip, gable, mansard, Dutch hip combination, and gambrel).
Tame unruly parametric curves with the Revit Family Editor, and start controlling circles, arcs, arches, splines, and even complex curves like cyma moldings.
An introduction to Revit, the building information modeling software for architects and structural engineers.
Discover how to create detailed architectural models and documentation in Revit Structure.
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Sept. 14, 2008
NORTHRIDGE, Calif. - University of Wisconsin-Milwaukee (2-2-0) midfielder Peter Sanger scored the only goal of the game at the 81st minute mark as the Panthers held on for a 1-0 victory against the Matadors (3-3-0) in the closing match of the 35th Annual Panther Invitational.
Both teams had their difficulties playing on a field that was in terrible condition and saturated with water as the previous game was played under a constant shower.
For the second straight game the Matadors out-shot their opponent, this time by an 18-12 margin. Forward Camilo Rojas was one of seven different Matadors who were able to fire a shot on goal, and led the team with three in that category.
Robert Pate and Chad Borak played the entire 90 minutes for the second time in as many games for the Matadors. The duo were the only players who participated in each and every minute of action throughout the entire tournament for the Matadors.
With the win, the Panthers improved their overall home record at Engelmann Field to a staggering 53-8-4 (.846), one of the best home records in the nation.
The loss is the second in a row, and closes out a challenging weekend in Milwaukee for the Matadors.
Appearing in his 66th game in goal for the Matadors was senior Kevin Guppy as he set a new all-time record for matches played in goal, breaking the previous mark of 65 games set by Christian Perez from 1997-2000.
Guppy was one of two Matadors who were named to the All-Tournament Team, with Borak also earning All-Tournament honors.
Once they return from Milwaukee, the team has six days to prepare for their next game, as the Sacramento State Hornets travel to Matador Field for the first time in eight years to take on the Matadors on Sunday. Kick-off is scheduled for 2:30 p.m.


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Gift Guide2007
See next gift »The goal of this game is to build the most reptiles from a stack of severed snake cards (some heads, some tails, and some middles). Here's how it works: the whole pile of tiles are fanned out on the floor and players take turns picking a card and trying to match it to a piece with the same color. If there's no match available, they can start a new snake. The player with the most snakes in the snake pit when the game ends, wins. This game, a great stocking stuffer, gets kids practicing pattern recognition, color matching, thinking ahead, and logic. (Gamewright, 2-5 players, $9.99)
Reviewed for Kindergarten, 2007
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Provides crisp, full-sounding voice pickup and it's effective for acoustic guitars and horns too.
The AT831R also excels as an instrument mic, especially for pickup of acoustic guitar with the included AT8444 guitar adapter. The mic is ideal for higher SPL applications, such as pickup for horns with the included AT8418 UniMount microphone instrument mount. Excellent gain before feedback and suppression of background noise. Operates on phantom power only.


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It was just a decade ago that salvation for suffering Pennsylvania homeowners was on its way.
Unfair property taxes must be reduced, politicians thundered in Harrisburg, and they were determined to get it done even if it meant engaging in one of the most corrupt legislative processes ever seen inside the state Capitol building.
The best way to reduce property taxes would be to legalize slot machine casinos so that tons of casino revenue would flow into Harrisburg, where it could be divvied up to benefit individual owners of homes and other property.
A plan hatched in 2003, said a story in The Morning Call at the time, would "use money from slot machines to underwrite an average 20 percent property tax break for Pennsylvania homeowners."
The story quoted then-Lehigh Valley state Rep. T.J. Rooney as saying, "We need to tap that new revenue to prevent people from being forced out of their homes because they can't afford skyrocketing tax bills." Opposition to the influx of gambling casinos by some legislators, he said, "just doesn't make sense."
A gambling industry foe, state Rep. Paul Clymer, R-Bucks, said it was the casino plan that "doesn't make any sense at all," but he and other foes would be overwhelmed by the Legislature's most powerful leaders — Vince Fumo, Bill DeWeese, John Perzel and Mike Veon.
After those four leaders used blatantly unconstitutional methods to ram through the slots legislation in the following year, The Morning Call reported this: "Lawmakers estimate property owners will see cuts ranging from $150 to $800 a year when everything is up and running."
Then-Gov. Ed Rendell was quoted as saying that "Pennsylvanians have waited too long for property tax reform." A story in The Morning Call said average homeowners in Allentown could expect a tax break of between $592 and $741 a year, while the range of annual savings in Easton would be from $368 to $470.
"This was a monumental, colossal victory," DeWeese said in celebration after the casino measure was enacted. That, of course, was before DeWeese went to prison on corruption charges — as did Fumo, Perzel and Veon — although the charges were unrelated to the gambling casino measure.
So now we have gambling casinos all over the place — with thousands of rigged slot machines to bamboozle suckers who think they have a chance to win big jackpots — and that may be upsetting to some people, but just think of all those splendid property tax breaks.
Well, perhaps they are not so splendid.
As reported over the weekend by the Pittsburgh Tribune-Review, the "property tax cuts promised by gambling's supporters have not materialized for most homeowners."
The Tribune-Review said it analyzed what happened in the state's 501 school districts, comparing property taxes in the 2003-04 school year to what we have 10 years later: In almost every district, "the average homeowner pays more today than he or she did in the 2003-04 school year."
That is because the promised windfall of $300 or more from gambling proceeds for an average homeowner actually turned out to be only $180 a year, and that was more than offset by an average tax increase of more than $1,000 for each homeowner.
The Tribune-Review story said casinos paid the state $1.3 billion in 2013, but just as critics of the 2004 legislation had predicted, much of that money flows to government operations and other purposes, and not directly to property tax relief.
Instead of being applied directly to tax relief for homeowners, much of the money is sent to school districts. That, I suspect, means only that the politicians who run local school districts are able to spend lavishly on what they want, such as a proliferation of six-figure salaries for superintendents and other paper-shufflers.
Meanwhile, many politicians in Harrisburg filled their pockets with enormous "political campaign contributions" from gambling interests.
Suddenly, the message from Harrisburg has changed. Gov. Tom Corbett, the Tribune-Review story said, is now saying that, shucks, the 2004 gambling casino law "was never about property tax … it was just to help horse racing in Pennsylvania."
It was what? All that political dialogue in 2004 was not about property taxes? It was just about horse racing? Where are we? In the Twilight Zone?
Anyway, the biggest tangible impact of Pennsylvania's gambling juggernaut, the Tribune-Review story observed, was in New Jersey, when tens of thousands of rubes started flocking to various joints in Pennsylvania instead of Atlantic City, where casino revenue dropped from $9.3 billion in 2004 to less than $4.1 billion in 2013. That, it has been widely reported, resulted in four huge Atlantic City casinos going bust or announcing plans to do so in recent months.
Now there are movements in other neighboring states — New York, Delaware, West Virginia — to enact legislation sought by the gambling industry. I'm not good at predictions, but somehow I have a feeling that when every neighboring state has oodles of competing casinos, that $180 per year benefit you are enjoying will go the way of the Trump Plaza.
Gambling industry's moguls will not be hurt; neither will any of the politicians they have in their pockets. That leaves only one class of individuals who will feel the pain of being duped by the lies and false promises of 2004. Guess who they are.
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Paul Carpenter's commentary appears Sundays, Wednesdays and FridaysCopyright © 2015, The Morning Call


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Octopus and Starfish by Sara Delaney
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Octopus and Starfish
This pattern is available for free.
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Your welcome. Always glad to help.
They lost 5 of 6. I rest my case.
You say the Mets can hang with anybody, I (basically), say they can't, you say yes they can, and I say well, they can't hang with the Yanks...which makes me a hypocrite, who taunts & insults. ??? OK , I'll say it again...seems like the Mets can't hang with the Yanks. Certainly not taunting, just a form of response. And how is that in any way an insult? To whom?? You put words in my mouth, and then try to twist things your way. Really bad, my friend. You're losing my respect.
I didn't use the word weak, you put it in my mouth. And yes, that's what I truly believe. Mets getting by with very good starting pitching... no power, no bullpen, will probably be their un-doing.
Today, your reminding me of njmac... bust out a ton of stats trying to show that your right. You may notice that I don't taunt, gloat...but, since you brought it up, sure doesn't look like Mets can hang with the Yanks.
No surprise...power, bullpen the difference. What does "can hang with" actually mean ? I'd say it about a team that is as good or better than anyone. Certainly would not apply to Mets. Maybe your trying to simply say that they will be a tough out for anyone ? So far, true. Have serious doubts that will continue. Not many good players, starting pitching must (underlined) continue to be better than good. But, said before, not many good teams to beat in NL. Considering how awful Phils, Marlins are, maybe selling very mediocre Mets short.
Not a big Collins fan, but here, he wasn't out of line at all. Comments blown far out of proportion by Orr, lame attempt at arson. jp2... all visiting teams welcome to hit "cheap" HR's in Y Stadium.
Hoyt Wilhelm, strictly knuckle- baller, elected to HOF in the 80's I believe. Went from a started to closer, pitched well into his 40's, seems like he appeared in about 10,000 games. Dickey pitched well last year, more reason to feel he will have continued success.
Must be hard to judge a knuckleball from ump's position, as well as watching on tv. Looked like Dickey got a lot of help from home plate ump with balls & strikes. And Davis had better have crushed that pitch... fattest one he's seen since the one Soriano layed in last weekend. But, I guess a month ago, he would have missed it, or popped it up. joep2..how do you remember what I said about Mets trade? I'm sure I said it, but, wow... ???
Collins trying to be real players manager, take the heat. I guess a good thing, basically, but taking blame for Santana just stupid, phony. He breezed through the 1st, and later retired 7 straight. In between, served up a few very fat pitches, to players who make a living feasting on them. Honestly feel extra rest not a factor at all. Don't enjoy Swisher's personna, will make small allowance that antics last night confined to dugout.
Didn't see the guy on the field episode, just heard about it. Even though 99% of the people who do it are completely harmless, and simply a bit drunk, just can't allow it...and penalty must be very severe as a deterrent to others. Players (any sport) must stay out of stands, specs. must remain off the stage. Court, field, ice..whatever
LGM......you're kidding, right? If you actually think that I was trying to compare my ability with that of a major league pitcher, you're dumber than I could possibly imagine. The situations were similar, in that we were both helped by bad calls. One by an umpire, one by a scorekeeper.
Soapbox? What ever you say, sure, give it any twist you want. Find it interesting that you would use that term. Simply saying that those who viewed Santana's effort as tainted, angered some to the point of tossing insults, and name calling. Don't get it, sorry. So Bill the Yankee fan says the no-hitter was less than genuine, and this makes him a --(insert vulgarity). ???
In Santana's case, ump responsible for making instant, no-thought call, as opposed to scorer assessing situation, and deciding what to do. And situation not what you make it out to be. Fact is, he gave up a clean hit, however close the call was. Totally different than a strike being called a ball, then giving up a hit, and "oh well, that's the breaks". And please, not saying ump made horribly bad decision on an easy call... certainly not the case. Maybe main difference between us, is that I have no problem with admitting when my team gets a huge break, actually welcome them...what fan wouldn't?. Tell certain fans that their team got lucky, and you are a &@#%$%& idiot, &^%$#@ loser, etc. Not a bad thing to admit it when your team gets lucky.
About the "no-hitter". (refrained from saying 1 hitter). I was fortunate enough to be in the same position when I pitched in HS... was working on a no -hitter (vs very weak opponent), when someone smoked a bullet grounder to third baseman, who was very fortunate to knock it down, located it, and threw wildly to 1st... had it been a good peg, the hitter would have beaten it, for sure.
We were home team, so our scorer was official...and he called it an error, and handed me the no-hitter. Was years ago, haver never checked, but would imagine could still be in schools records as official no hitter. But I knew in my heart that I didn't pitch a no-hitter that day, and know it to this day. Wonder if Santana does (or will) feel the same.
The absurd face to face shouting matches between umps & players, mgrs., are seldom instigated by ump...but the fact that that point is reached, is totally umps fault. Takes 2 to argue, and umpires don't need to argue with anyone. Listen..warn..eject..walk away. Certain that Billy Martin, Earl Weaver, prided themselves as being real men, tough guys. Yet they would kick dirt all over an umps shoes, legs, to put an exclamation point on an argument.
Doesn't matter who favors who, just 2 back-ups, really. Too bad McElroy won't get a real chance.
Agree generally. Also, appreciate that he was willing to play 3rd in order to become a Yankee. Definitely one of the top 10 players I have ever seen, and I go back to the 50's. But he used steroids, banned substances. Certainly not a lying creep like some, but, still guilty. Would not argue with those who would leave him out of HOF.
Would bet that that is grossly inflated figure, don't believe it went for nearly that much. MG fails to say exactly who his source is. Not saying he erred in any way, just feel he's been mis-led.
Guarantee if he sought help... extensive re-hab, meetings, counseling... the Giants would have stepped in, in some way. The fact that they didn't, says a lot about the shape he's in.
Good pitching will almost always prevail. But agree somewhat. Last few years, they have been making average pitchers look very good. Too often. Wouldn't say quite yet that Pineda trade a bad one...he's very young, career needs to be played out.


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This is an unadvertised deal at Target for Gold 'N Plump Drumsticks, so your price may vary. Either way, this is a nice coupon stack!
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Gold N' Plump Drumsticks just $.49 at Target!
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Boeing has increased the maximum takeoff weight (MTOW) of its 747-8 Intercontinental and 747-8 freighter after its flight loads survey revealed additional structural margin available to customers.
According to its latest airport planning document, Boeing has increased the aircraft's MTOW to 448t (987,000lb), an increase of 6t (13,000lb) from 442t (975,000lb).
Early freighter deliveries, said Boeing, have been certified at 442t MTOW and, after April, deliveries will reflect the expanded 448t MTOW. A service bulletin to operators expected at the same time will approve the 442t MTOW aircraft for operation at 448t, the airframer said.
Boeing completed 747-8F and Intercontinental certification flight testing in August and October, respectively.
While Boeing said the move is not aimed specifically at regaining payload and range capability after a growth in structural weight during development, the programme has faced cancellations due to a performance shortfall of early freighters.
Atlas Air Worldwide Holdings cancelled three 747-8F aircraft in September 2011 after "lengthy delays and performance considerations."
Additionally, Boeing's December 2011 update to its 747-8 and -8F airport planning document included references to the aircraft's operating empty weight (OEW) and max structural payload.
The document listed the maximum structural payload for the passenger configured model as 82.1t (181,000lb) and the pre-service bulletin for the 747-8F at 134t (295,200lb), which increased after April's update to 139t (306,000lb).
Further, the OEW of the freighter model was set to transition from 191.3t to 190.9t (421,800lb to 421,000lb), a reduction of 363kgs (800lb), while the passenger model was listed at 213t (470,000lb).
The figures were later listed as "TBD" or to be determined and Boeing said the removal was due to a further review of its catalog weights and ranges for the 747-8 family.
Boeing delivered a total of nine 747-8F aircraft in 2011, and is readying to deliver its first 747-8 to a completion centre for outfitting for a VIP customer in February, followed by airline launch customer Lufthansa in March, said programme sources.
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116 Shouts - 7,028 Scrobbles
Polish oldschool thrash metal band, founded in 2010 in Żory, Poland. Band was formed in 2010 in Żory, Poland, by Ajdżors, who was quickly joined by Więchu. They play thrash metal stylistically borrowing from the 80s while being heavily influenced by teutonic thrash scene of the time. Started out as a duo, without the drums. July, 2011 brought a change as Więchu switched to the drums and the band acquired the bassist, Kotwa. The first gig was done on 14th of October, 2011 in Żory. The band carried on doing gigs throughout 2012, mainly in Silesia, Poland.
Read more about Raging Death on Last.fm.
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Chuck Wolfe
Chuck Wolfe is an environmental and land use lawyer with a graduate degree in regional planning, and over 24 years of experience in environmental and land use law, innovative land use regulatory tools and sustainable development techniques.
Monthly Archive for August, 2011
Retaining Sustainable Storefronts in the Urban Realm
Vital storefronts are an indicator of urban success, while empty businesses are akin to the ruins of Pompeii. Even when storefronts go empty, some cities find ways to simulate that all is well. False facades, community art and the look and feel of a vibrant business district often substitute for empty spaces through glass. That's […] [Read More]
Uncovering Embedded 'Patterns of Place' in the City
Amid the roads, sidewalks and places that you have visited before, there are often embedded patterns to uncover, read and reinterpret. This exploration is an archaeology which involves more than unearthing distinct artifacts from another era. For me, it includes observing the place-based impacts of four interactive factors: The intersection of the built and natural environments; […] [Read More]


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Hacker Working With GM To Fix OnStar... Car Tech
August 1, 2015
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July 31, 2015
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If you want to race an SRT Viper GTS-R in competition, your options are somewhat limited. One way is to prove that you're significantly faster around a race track than Jonathan Bomarito, Ryan Hunter-Reay, Dominik Farnbacher, Marc Goosens, Tommy Kendall and Kuno Wittmer, then show up in the... read more
Today at Motor Authority, we have a live mega-gallery of the 2013 Nissan GT-R and Jaguar is touring the U.S. in an XF clean diesel. Ferrari is planning to use aluminum... read more November 9, 2011 by Joel Feder
Not to be out-done by the recent Gran Turismo 5 downloadable content packs, Turn 10 has announced the November Speed Pack. In the pack, out now, your $7 or 560 Microsoft... read more November 7, 2011 by Antony Ingram
Ford began promoting its vehicles in video games with the 1995 release of Sega Rally, and since then the automaker has included its wares in over 250 million distributed... read more November 3, 2011 by Kurt Ernst
Got Forza Motorsport 4 for the XBox 360? Good. Got a 2012 BMW M5? No? Then this might interest you. Video games aren't just video games any more, they're the gateway to... read more October 17, 2011 by Antony Ingram
While the people behind Need For Speed: The Run are giving away a 2012 Porsche 911 Carrera S for registering on the video game's website, Microsoft has announced that... read more October 17, 2011 by Viknesh Vijayenthiran
If you're a fan of the Forza Motorsport racing simulator for Microsoft's Xbox 360 gaming platform, we've got some bad news for you: the latest installment, Forza... read more August 29, 2011 by Kurt Ernst
If you want to buy a brand-new Ferrari 458 Italia, the price of admission starts at $225,325, and that's before you begin adding options. On the other hand, for $89.99... read more August 23, 2011 by Kurt Ernst
While we all want a Ferrari 458 Italia, not all of us are fortunate enough to have the means. Luckily, Thrustmaster has come to save the day with a new Ferrari 458 steering... read more August 23, 2011 by Joel Feder
The 1980s was an exciting time to be a young person. The reason? Video games. From coin-operated arcade games to the advent of home games consoles a whole generation had a... read more August 19, 2011 by Antony Ingram
Many consider the Forza series of XBox racing games to be the best console racers... in the world. One thing is for sure though, it's the only racing game that's voiced by... read more July 28, 2011 by Antony Ingram
We're all big automotive enthusiasts here, but for those of us who don't have a Zondar R or Bugatti Veyron Super Sport in the garage, there's always video games. All three... read more June 8, 2011 by Kevin Lee
Anyone into racing video games should own a steering wheel controller. The extra dimension it adds to any racer over a traditional joypad hugely improves the gaming... read more June 7, 2011 by Antony Ingram
As we reported earlier, Forza Motorsport 4 has had a major presence at this year's Electronic Entertainment Expo (E3) in Los Angeles. In fact, just a few days ago we... read more June 6, 2011 by Viknesh Vijayenthiran
The latest installment of the brilliant Forza Motorsport series for Xbox 360 is about to bring a whole new sense of realism to the world of racing sims thanks to... read more June 3, 2011 by Viknesh Vijayenthiran
Just a couple of days after the launch of Need For Speed Shift 2 Unleashed comes this official preview clip of Forza Motorsport 4, a game we've previously professed our... read more April 4, 2011 by Viknesh Vijayenthiran