text:
By Linda D. KozarynAmerican Forces Press Service
WASHINGTON, July 16, 1997 There's hard work ahead for the three Eastern European nations tapped to become NATO's first new members since 1982 and for those nations seeking future membership, according to U.S. Defense Secretary William S. Cohen.
NATO in early July invited Hungary, Poland and the Czech Republic to join the security alliance. The three former-Soviet bloc nations are now working to achieve full membership by 1999. Other nations such as Bulgaria, Slovenia and Romania hope to receive invitations in the future.
Countries selected must meet the responsibility of being "a contributor -- not just a consumer -- of collective security," Cohen said. New members must restructure their military forces to be compatible with other NATO forces.
Following a NATO summit in Madrid July 7 to 9, Cohen traveled to Hungary, where he congratulated Hungarian officials on their selection. He also traveled to Bulgaria and reassured its officials the first new members will not be the last.
Bulgaria is a serious contender and candidate for future membership rounds, Cohen said July 13 at the Atlantic Club in Sofia, Bulgaria. "NATO and the United States are committed to walking side by side with Bulgaria down that path and providing all the help we can."
A number of other states have declared their desire to join NATO, and many of them are making excellent progress in preparing themselves for membership, Cohen said. Partnership for Peace remains the best means of preparing for membership, he stressed.
Joining the partnership allows countries seeking membership to interact with NATO and demonstrate they are ready to shoulder membership responsibilities. Since the partnership was formed three years ago, he said, "there have been hundreds of exercises and activities, and the partnership has succeeded beyond the most optimistic expectations."
Enlarging NATO benefits both old and new members, Cohen said. "For new members, it means being part of the most successful peacetime military alliance in history and building closer and stronger ties with the West," he said. "For NATO, it means a stronger alliance by erasing the artificial line that divided Europe and extending a circle of security that can better protect the peace and prevent future war."
But membership also carries heavy obligations, Cohen told Bulgarian officials. "There must be no dilution of NATO's strength," he said. "We must not weaken NATO in the process of enlarging it or threaten overall stability in Europe."
For those countries seeking membership that are on the right path but need more time, Cohen said, it is wise for NATO "to defer invitations, encourage and support continuing reforms, and make sure the door remains open when they are ready."
Once selected nations begin the entry process, Cohen said, the United States and other NATO nations will look for clear assurances that new members understand, and are ready to shoulder, the burdens of membership. This includes the "one for all, all for one" defense commitment at the heart of the security alliance.
When new members' flags are unfurled at NATO headquarters in Brussels, Cohen said, their political and military leaders will help formulate NATO policies and strategies that their forces will help carry out. They will help NATO meet today's security challenges -- forging new ties with Russia, settling regional quarrels, promoting stability and reform in Ukraine, Romania, Slovakia and the Balkans.
The greatest challenge for new members will be to plan and fund compatible military capabilities, stressing interoperability at all levels and training officers to speak English, he said. Restructuring their armed forces will make member nations better able to defend their own territory, contribute to the defense of the alliance and take part in the full range of alliance missions.
NATO will expect new members to complete a national security strategy and invest in training to retain quality forces. It will also expect them to adapt their military doctrine and procedures and upgrade air defense command, control and communications systems to be compatible with NATO.
In the months ahead, NATO staff will visit the three candidate nations to help develop force goals and to answer NATO's Defense Planning Questionnaire, Cohen said. "NATO and the United States are prepared to share our expertise in defense planning and force development in air defense, logistics, infrastructure, training and personnel, and technical advice."
NATO will also help Bulgaria and the others prepare for future invitation rounds. "We are going to share ideas about how forces are organized within democracies, about the defense planning process, about budgets and transparency," he said. "We will offer advice on training issues and creating professional forces. We will provide assistance in becoming interoperable with NATO in the areas of communications, command, control, intelligence and logistics."
Twelve original members founded NATO in 1949: the United States, Belgium, Canada, Denmark, France, Iceland, Italy, Luxembourg, the Netherlands, Norway, Portugal and the United Kingdom. Greece and Turkey joined in 1952, Germany in 1955 and Spain in 1982.


text:
Book Depository BlogRSS
It's Usborne Day!
Thu, 03 Oct 2013 09:18
To celebrate 40 years of Usborne books this year, Saturday 5th October has been declared Usborne Day! As part of the celebrations, we've got a brilliant prize to give away, comprising of 40 bestselling Usborne titles, as well as lots of Usborne Day goodies, including a T-shirt and limited edition tote bag! To enter, simply answer the question below. Good luck! Competition closes October 28th.
PLUS: We also have some fun activity sheets for you to download and print off!
Competition now closed
Posted by Adam
Categories: prize, competition, Usborne, 40th
Permalink: Its-Usborne-Day
Usborne Day
Show/Hide Terms and Conditions
- 1. No purchase necessary. Proof of entering is not proof of receipt of entry.
2. To be eligible, entries must be received on or before the competition closing date. All entries shall become the property of The Book Depository, and their directors, officers, representatives, advertising and promotional agencies are not responsible for contacting or forwarding prizes to entrants who provide unclear or incomplete information or for entries lost, misdirected, delayed or destroyed.
3. The competition is open to all excluding residents of Italy. Parents/guardians must submit the entry for those under the age of 16. Images must not contain photographs of minors without an adult's consent.
4. The prize winner will be decided by The Book Depository. The Book Depository will not enter into correspondence about the choice of winner.
5. The competition ends as specified on the competition page -- no entry received after that time will be considered. The winner will be announced as specified on the competition page. There is one prize
6. The promoter reserves the right to amend the specification of the prize or offer an alternative prize of equal or greater value.
7. The prize winner will be notified by telephone/email. If the selected entrant does not meet all of the contract conditions, another entrant will be selected from the remaining eligible entries.
8. The competitions are not open to employees of The Book Depository and their sponsors or their immediate families.
9. By entering the contest, entrants, consent to the use of their names, city of residence, photograph and/or image for publicity purposes in all media carried out by The Book Depository, without payment or compensation.
10. The decisions of the contest judges are final. The prize must be accepted as awarded.
11. The right is reserved to terminate or withdraw this contest at any time.
12. All entries become the property of The Book Depository, who assume no responsibility for lost, stolen, delayed, damaged or misdirected entries or for any failure of the website during the promotional period, for any problems or technical malfunction of any telephone network or lines, computer online systems, servers, access providers, computer equipment, software, failure of any email or entry to be received by The Book Depository on account of technical problems or traffic congestion on the Internet or any website, or any combination thereof including any injury or damage to an entrant's or any other person's computer related to or resulting from playing or downloading any material in the promotion. The Book Depository reserve the right, in its sole discretion, to cancel or suspend the email portion of this contest should a virus or bug or other cause beyond the reasonable control of The Book Depository corrupt the security or proper administration of the contest. Any attempt to deliberately damage any website or undermine the legitimate operation of this promotion is a violation of criminal and civil laws, and should such an attempt be made, The Book Depository reserve the right to seek remedies and damages to the fullest extent permitted by law, including criminal prosecution. Entries are subject to verification and will be declared invalid if they are illegible, mechanically reproduced, mutilated, forged, falsified, altered or tampered within any way. Entrants agree to abide by the Contest Rules and the decisions of the independent judging panel, which are final.
13. Entries must be submitted by the named entrant (or their parent/guardian for children aged 16 or under) and will be invalid if found to come from a third party. Multiple entries from a single source (e.g 'competition entry' website/company) will be disqualified.
14. For name/county of prize winner, please send a stamped addressed envelope marked The Book Depository, Thames Central, Hatfield Road, Slough, Berkshire, SL1 1QE. No entries should be sent to this address.
15. Entry to the competition is conditional on acceptance of these terms and conditions.
16. The email address and phone number you provide to enter the competition will be used by us to contact you if necessary, and will not be shared with other companies. The Book Depository will only use your email address in compliance with the provisions of the Data Protection Act 1998 and in accordance with our privacy policy.
17. The Promoters have organised these prize draws in good faith and do not accept liability relating to the prize.
- veronica bingham
I can easily resist a kindle as nothing equals the smell and feel and experience of reading a good book. Fantastic contest, will keep the fingers crossed.. :)
- Posted Mon, 07 Oct 2013 01:09
- carole eaves
happy birthday. this is my first visit, but certainly not the last, were book munchers in our house cant get enough of them, strongly resisting a kindle at the present.
- Posted Sun, 06 Oct 2013 20:03
- Irene
Our family love reading and we are a great fan of Book Depository. I often purchase english books for my children from Book Depository. English books are rare and i find it difficult to get especially from where we are. Would be awesome if we can win these Usborne books. The children would be thrilled. Happy Usborne Day.
- Posted Sat, 05 Oct 2013 15:39
- John Lee
a good site
- Posted Sat, 05 Oct 2013 15:07
- Bruce PATERSON
Would have loved this package when I came out on the First Fleet
- Posted Sat, 05 Oct 2013 08:42
- Brenda Cooke
That's my Contest - it's so squashy!
- Posted Sat, 05 Oct 2013 03:57
- Sarah Robbins
Thank you for this competition!
- Posted Fri, 04 Oct 2013 23:39
- Victoria Mackey
What a great comp and prize, my kiddlets and I are 'soups' excited. Fingers crossed!
- Posted Fri, 04 Oct 2013 23:09
- Mindy Janicke
Happy Usborne Books day (a day early)! Books are such an amazing aspect of everything we do. As a mother, book blogger, beta reader and obsessive reader since I was four I honestly love and support all aspects of the written words if books. We can never stop learning and should never want to stop. Thank you for books!!!!
- Posted Fri, 04 Oct 2013 22:31
- Adriano
Happy anniversary!!! We are wishing you will make your magnificent books for thousand and thousand years more!!!!
- Posted Fri, 04 Oct 2013 17:46
I love Usborne books!!! They really attract EFL students - and teachers like me.
- Posted Fri, 04 Oct 2013 17:36
- abudulai abubakari
Include Bank money transfer details to your money transfer list for orders to enable readers in GHANA to benefit . I never won any competition like this before so I am watching .Thank you.
- Posted Fri, 04 Oct 2013 16:48
- Carol Lee
Happy Birthday Usborne!! I would really love to win this competition and have books to share with my 5 grandchildren
- Posted Fri, 04 Oct 2013 16:37
- Jennifer Moore
as an avid book lover this is my idea of a competition, thanks.!!!!
- Posted Fri, 04 Oct 2013 14:00
- Nathan Goss
Great competition, good luck to the winner of this prize, I have never won any competitions; I'm crossing my fingers and toes thanks book depository
- Posted Fri, 04 Oct 2013 12:45
- Pat King
Usborne Books, uniquely good for children who love to read. Some adults, too!
- Posted Fri, 04 Oct 2013 12:09
- B Alam
Yes, it's so good... My child Lolarina is sooo excited about winning the prize, all the best and luck to the winner! :)
- Posted Fri, 04 Oct 2013 12:04
- Mariska Joan Schouten
Cellebrating books is always a good thing!
- Posted Fri, 04 Oct 2013 11:36
- Evelyn Kelly
Back to college again :o(. All my funds will be spent on course material... so I need a little free light reading lol
- Posted Fri, 04 Oct 2013 11:02
- Tara Headley
I've been collecting books since we started homeschooling and was running out of room, so I bought a cheap second hand bookshelf, and now my other one is as bare as Mother Hubbard's cupboard. lol It definitely needs some more books to fill up the gaps. All the best to everyone who enters. :D
- Posted Fri, 04 Oct 2013 10:25
- Mrs Jacqueline Manning
Happy Birthday Usborne, I would love to win as both my daughters had loads of Usborne Books and my grand-daughters at an age where she'll love them
- Posted Fri, 04 Oct 2013 10:19
- Denise Tyrrell
What I couldn't do with this prize - just started a children's book club at home with my 10 grandchildren. This would go a long way to get them on the reading track.
- Posted Fri, 04 Oct 2013 09:45
- kathy butler
Why do all you people bother saying how much you want to win? Nobody enters if they don't want to win.
- Posted Fri, 04 Oct 2013 09:38
- Ainul Azeline Jamaludin
Happy Usborne Day!
- Posted Fri, 04 Oct 2013 08:44
- Aukje Atsma
Happy Birthday to you all. You are still one of my favourite bookshops in europe. I still enjoy the books I bought from you from Tomoko Takamichi. I wish to win the prize so I can enjoy many books about patterndrafting.
- Posted Fri, 04 Oct 2013 08:28
Write a Comment
You need to get logged in to make a comment. Please log in or create an account.
- 1. No purchase necessary. Proof of entering is not proof of receipt of entry.
- Book Depository Team
- Anna Content Manager View posts >
- Adam Spinach View posts >
- Noriko Tsuchiya Author View posts >
- Eric Admin View posts >
- Ben Elliss Head of IT View posts >
View more team members >
- Admin The Book Depository View posts >
- Mr McPaws Poet and kitten View posts >
- Alice Hart Davis Author View posts >
- Sibella Court Author View posts >
- Gordon Grice Gordon Grice View posts >
- Barry Chicken House View posts >
- Hugh Aldersey Williams Author View posts >
- Mark Forsyth Author View posts >
- Stevo Senior Designer View posts >
- Thalia Guest blogger View posts >
- Jason Senior front end Dev View posts >
- Mark Content Manager View posts >
- Publisher Blogs
- Alma Books Bloggerel
- Continuum philosophy
- Faber's Thought Fox
- Harvard University Press Publicity
- Indiana University Press
- Jam Language Publishing
- MobyLives
- North Atlantic Books
- View more publisher blog >

subset: commoncrawl


text:
I accidentily deleted the Blackshot soundpack, where can I download the original english one?
I accidentily deleted the Blackshot soundpack, where can I download the original english one?
I am god
Hi weijiaxi, it would be more advisable for you to reinstall Blackshot.
Hey GM,Dun say like that...I have released the original english soundpack.....
Weijaxi..U wan download it..download it at :-http://www.mediafire.com/?yyk0rk3n43l8cbx
at in there have 2 soundpack....
Dont hijack someone else thread
Last edited by Mr.GinTama_XIV; 12-24-2012 at 11:31 PM.
_. Modder (H) - Gamer (SH) - Forumer (H)._
How to use soundpack korean GM ?
Hi dm.member,
I'm afraid we are unable to comment on the issue as modding is done at a on your own risk basis.
Players would have to determine the steps from external sources.
Proceeding to close thread.
Please do not PM me unless requested.
All other PMs will not be entertained.
Hijackers will also be ignored.
Kindly post your issues in a new thread.


text:
Faculty and Staff Web Pages
Next Steps
Now that you've decided how to build your site:
Then, when you're finished with your site, do you:
1. Need to get a link to it from an ASU department page?
- Contact Jen Stoughton at x7846 or:
2. Need to get a link to it from the ASU Staff & Faculty Search page?
3. Need to use Blackboard in conjunction with your site?
Need help with an ASU Department page?
Contact Jen in the Office of Communications.


text:
In a busy moment, the latest book of exchanges was Marie'd.
Saturday, May 22, 2010
Another Use of the Verb "Marie"
Posted by Participant at 2:31 PM
Subscribe to: Post Comments (Atom)
General Economy Exquisite Exchange (GEEE) is a campaign produced by the Cream Co. arts organization promoting an economy based on neighborly trade. GEEE currently operates in its fourth iteration at the the Archive House of Theaster Gates' Dorchester Project. In the form of a Garden/Culture Exchange and Trading Post, GEEE demonstrates how local abundance supports an economy open to more than just currency.


text:
The 2013 Philadelphia Wine & Food Festival - VIP Tasting/Early Entry
Friday, May 10, 2013 from 5:30 PM to 9:30 PM (EDT)
Who's Going
Loading your connections...
3 of your friends are going. Share it to get more people on board! Share
Sara Haughty
San Francisco, California
San Francisco, California
Luke Picard
London, United Kingdom
London, United Kingdom
Rick Vespucio
Florence, Italy
Florence, Italy
Event Details
On Friday, May 10, Philadelphia magazine and PA Wine and Spirits Stores will present The 2013 Philadelphia Wine & Food Festival at Lincoln Financial Field, in the SCA Club.
Over 150 of the world's finest wineries - pouring over 600 different wines - and a wide selection of local restaurants will join us at this year's Festival.
The VIP experience begins at 5:30 pm with early entry into the Festival, a more intimate atmosphere, and an opportunity to taste rare and high-end wines while speaking one-on-one with the winemakers, representatives, and chefs.
Guests are then invited to stay for the Grand Tasting, from 7:00-9:30 pm.
A portion of proceeds will benefit The Children's Hospital of Philadelphia.
*Admission is limited. You must be 21+ to attend. Refunds will not be issued. Thank you for your understanding.
Have questions about The 2013 Philadelphia Wine & Food Festival - VIP Tasting/Early Entry? Contact GPhilly
When & Where
Lincoln Financial Field, SCA Club
1020 Pattison Ave
Friday, May 10, 2013 from 5:30 PM to 9:30 PM (EDT)
Add to my calendar


text:
The murals contain images ranging from skylines to paper airplanes.
A sampling of some of the best restaurants in the neighborhood.
The popular Port Morris eatery will reopen in October, though an internal dispute rages on.
A dispute over post-Sandy repairs is in court, while a feud between the co-owners is in arbitration.
Edward Jahn has applied for legal protection for his live-in loft inside a commercial building.
The popular Bruckner Bar and Grill suffered major flooding. Another business had its ceiling collapse.
The city's only mainland borough had fewer power outages and evacuees and no deaths by Tuesday evening.
The Clock Bar at Bruckner Blvd. and Lincoln Ave. stayed open as floodwaters surged from the Harlem River.
The new merchants group wants to lure visitors and investors to their stretch of Bruckner Boulevard.
Two Port Morris hangouts, the Bruckner and Clock Bar, recently launched new gay and lesbian nights.
The free and ticketed events begin Thursday and conclude with a parade and festival on May 20.
The Clock Café and Martini Bar opened last month. Ceetay, an Asian-fusion restaurant, opens soon.
Get our daily New York City news and alerts!
Terms of Use |Privacy Policy
Thank you for signing up!
Would you like to sign up for additional newsletters?
Thank you for signing up for additional newsletters.


text:
The AllerAir® AirMedic+ Exec is the most efficient air purifier in the AllerAir® lineup specifically designed for particle control and is the ideal air purifier for allergy and asthma sufferers. It contains advanced air filtration technology and performs at a higher level than other air purifiers which only use standard HEPA filters. The AllerAir® AirMedic+ Exec is recommended for individuals who need exceptional particulate control and where available space is a primary concern. The AirMedic+ Exec is quite compact, yet performs extremely well, offering reliable chemical, gas and odor filtration too. Aside from utilizing a specialized Medical-Grade HEPA filter, the AirMedic+ Exec uses an 18 lb., 3" deep-bed, activated carbon stage and an easy-clean pre-filter.
The AllerAir® AirMedic+ Exec is subjected to a number of rigorous tests, one being the independent DOP Test. This testing method is a Government Standard Test (SF209) which tests for any possible HEPA filter leakage. Generally referred to as the Di-Octyl Phthalate (DOP) test, it introduces a dense cloud of sub-micronic particulate which are then condensed to form 0.3 micron particles with very little variation in size, straight into the membrane of the HEPA filter. Only air purifiers of the highest integrity and design, pass this test. The AllerAir® AirMedic+ Exec is proud to be DOP Certified.
White, Black, Sandstone
Item No. ALLERAIR-AIRMEDIC-PLUS-EXEC
Regular Price: $949.98
Lowest Price: $899.98
Activated carbon is at the heart of an AllerAir® air purifier. The exclusive role of the carbon stage is to neutralize, absorb and remove airborne chemicals, gases and odors. Some manufacturers only use a few ounces of carbon or a carbon-sprayed mesh in their air purifiers, which is simply inadequate. Because of AllerAir's firm commitment to quality and performance, AllerAir® uses many pounds of deep bed activated carbon to effectively absorb dangerous airborne substances.
To be truly efficient, carbon filters need to provide enough exposure time for pollutants to be absorbed. This means that larger and deeper bed carbon filters will absorb more airborne pollutants. This variety of carbon is used widely by hospitals, the military, scientific and industrial facilities and disaster response units for its safe and powerful absorbing properties. The more carbon an air purifier has, the more chemicals it will be able to absorb. For serious chemical and gas absorption, only an air purifier with significant amounts of granular activated carbon will be effective.
HEPA (High Efficiency Particulate Air) refers specifically to a filter that can remove at least 99.97% of airborne particles measuring 0.3 microns or larger. True HEPA filters are composed of a dense web of specialized fibers and are considered the safest and most efficient method for eliminating particles. When used in combination, activated carbon and HEPA filters offer the most comprehensive air purification available to treat airborne particles, chemicals, gases and odors.
Customize the AllerAir® AirMedic+ Exec air purifier with an additional level of air filtration by adding a UV (ultra violet) germicidal lamp. UV light works by breaking down microorganisms and disrupting their DNA, making them unable to reproduce and in effect, "kills" or neutralizes them. Excellent for controlling airborne mold mycotoxins, bacteria and viruses.
|AllerAir AirMedic+ Series
|Allergen Control
* Particle Control
* Mold spore control
* Pet dander control (cat, dog, etc.)
* House dust mite allergen control
* Pollen control
Light Odor Control
* Pet odors
* Musty odors
* Cooking odors
* Paint odors
Light Molecular Control
* Molecular (gaseous chemical) Control
|Filter Configuration
|1 Pre-Filter
1 Activated Carbon Filter
1 HEPA Filter
|Average Filter Life
|Pre-Filter: 3 Months
Activated Carbon Filter: 2-3 Years
HEPA Filter: 3-5 Years
|18 lb. Carbon Filter, Medical-Grade HEPA and Pre-Filter. DOP Tested & Certified.
|1) All Steel Housing
2) 3 Stage Wide Spectrum Filtration Protection
3) Easy to Replace Filters
4) Purifiers are Non Ozone Emitting
5) Very Energy Efficient
6) ECO-Friendly/Green Materials Used
7) Styrofoam Free Product
8) Packaging is Made of Recycled Cardboard
|The AllerAir® AirMedic+ Exec comes complete with filters, user manual, set of 4 casters and 8 foot power cord.
|System Efficiency for Particles
|99.97 percent at 0.3 microns
|Maximum Coverage Area
|600 sq ft
|Number of Fan Speeds
|Variable Speed
|Air Delivery Speed
|Between 10 - 280 cfm
|Decibel Levels
|Between 10 - 75 dB
|Ratings (CADR)
|Maximum Energy Consumption
|Between 35 - 115 Watts
|Standby Energy Consumption
|Power Requirements
|120 V, 115 Watts, 60 Hz. All electrical components are UL certified.
|LCD Control Panel Display
|Variable Timer
|Replace Filter Indicator
|Remote Control
|Odor Control
|Smoke Removal
|Mold Spores Removal
|Dust Removal
|Gas/Carbon Filter
|HEPA Filter
|Ozone Emission
|UV Lamp
|Total Number of Filter Stages
|Pre-Filter Frame Material
|Pro-Dense Cotton
|Gas/Carbon Phase Filter Material
|18 lbs of deep bed granulated activated virgin carbon to filter out chemicals, gases and odors.
|Post-Filter Frame Material
|Medical-Grade HEPA filter guaranteed to trap 99.97% of airborne particles 0.3 microns in size.
|Post-Filter Sleeve Material
|Housing Material
|All-Steel Housing, Non-Offgasing Powder-Coat Paint
|Rated Airflow
|Media Area
|Composite Average Efficiency
|Pressure Drop
|Capacity Rating
|Product Dimensions
|17.5" H x 15" D
|Net Weight (including filters)
|44 lbs.
|10 year warranty on parts, 5 year warranty on labor.


text:
C. 2000 Vintage AAron Basha Blue Murano Glass and Diamond Flower Stud Earrings in 18kt White Gold
Item#: 862707
C. 2000. Designer Aaron Basha defines his design style as "whimsical elegance," appealing to a fun and youthful spirit. From our Estate collection, these stud earrings by the designer create flowers from carved blue Murano glass and round brilliant-cut diamond accents. Post/clutch, 18kt white gold earrings. Exclusive, one-of-a-kind Estate Jewelry.
Product Details (for C. 2000 Vintage AAron Basha Blue Murano Glass and Diamond Flower Stud Earrings in 18kt White Gold)
Stud close STUD: An earring that sits stationary on the ear and doesn't drop below the lobe.
3/16 inch
18kt close 18KT: Karat (abbreviated kt or K) is a unit that indicates the purity of gold in the metal. 18kt is 75% gold. In Europe, 18K yellow gold is most favored and used in jewelry. White Gold close WHITE GOLD: Gold is a precious metal which is naturally quite soft. To give it a white color and increase its strength, gold is alloyed with white metals, such as silver and/or palladium, and often plated with rhodium. The purity of the metal is indicated by a unit called a "karat," with 24kt having the highest percentage of natural gold.
Polished close POLISHED: A buffed-out finish used to produce a mirror-like shine.
Post/Clutch close POST/CLUTCH: An earring with a post insert and a slide-on clutch backing to hold it in place.
Gemstone 1:
Diamond close Diamond: The hardest and most brilliant of all gemstones, a diamond can make the heart race with its pure and fiery spark. An ancient symbol of love, a diamond is the preferred gemstone for tokens of affection, such as rings, earrings, necklaces and bracelets. Diamond is the birthstone for April. (Quantity: 2, Shape & Cutting Style: Round Brilliant close BRILLIANT: A gemstone cut to enhance brilliance without sacrificing much carat weight. Typically has 58 facets. , Color Grade: G-H close Color Grade G-H: Near-colorless , Clarity: SI1-SI2 close CLARITY SI1-SI2: Slightly Included. Inclusions are noticeable under 10x magnification. , Weight: 0.02 ct. t.w.)
Gemstone 2:
Glass close GLASS: A delicate, translucent to transparent noncrystalline material made by fusing sand with other materials , such as soda and lime, and then cooling it quickly. Glass is used in anything from windows to drinkware. In jewelry, glass is used for ornamentation, to make doublets, and to simulate gemstones. (Color: Blue, Quantity: 2, Shape & Cutting Style: Carved close CARVED: When a gemstone is cut so that the outline or surface takes the form or likeness of a specific image or pattern. , Size: 5.5 mm)
All weights and measures are approximate.
Ross-Simons Presentation Box Your purchase includes an elegant Ross-Simons presentation box.
100% Moneyback Guarantee every item, every order, every day
Free Shipping on orders $250 or more
Only $7.95 Flat Rate for any order under $250
24/7 Live Help toll free at 1-800-835-0919
100% Secure Checkout verified by Norton Security
Recently Viewed Items:
Learn More About Blue Diamonds Diamond Buying Guide Estate Jewelry White Gold Earring Buying Guide Polished Finish Diamond Glass


text:
What is now call Presidents Day was originally established in 1885 to recognize President GeorgeWashington and is officially called "Washington's Birthday" by the federal government. It was originally celebrated February 22, Washington's actual day of birth. After his death he was venerated as the most important figure in American history. The holiday initially only applied to the District of Columbia, but in 1885 it was expanded to the whole country. It later became known as Presidents' Day after it was moved as part of 1971's Uniform Monday Holiday Act, an attempt to create more three-day weekends for the nation's workers.
Today, the February holiday has become well known for being a day in which many stores, especially car dealers, hold sales. Until the late 1980s, corporate businesses generally closed on this day. With the late 1980s advertising push to rename the holiday, more and more businesses are staying open on the holiday each year. Most notably, however, banks close for the say and the mail service is supended.
While several states still have individual holidays honoring the birthdays of Washington, Abraham Lincoln and other figures, Presidents Day is now popularly viewed as a day to celebrate all U.S. presidents past and present.


text:
Posted: May 24, 2011
Premier Guitar catches up with Gretsch signature artist G. Love of Philadelphia's alt-rock/blues/hip-hop trio G. Love & Special Sauce for a rig rundown. Fast forward to the 7:28 mark to hear him simply gush over his Gretsch axes.
Tags: G Love, G Love rig, G. Love and Special Sauce, Gretsch Guitars, Premier Guitar
Posted In: Artists Blogs, Product Plugs | Leave a comment
Keep in touch with the latest Gretsch news, pictures and videos.
New From The Gretsch Blog.
What are you interested in?
View Past Blogs.


text:
In-home Puppy and Dog Training - Oakland, Berkeley & the East Bay
Providing experienced dog training for the entire East Bay, including Oakland, Berkeley, San Leandro and Piedmont, The Dog Squad is an in-home dog trainer and personalized dog obedience school offering professional dog training services that help Oakland, Berkeley and East Bay families solve all types of dog behavior problems, including dog aggression. The Dog Squad also has classes in Nosework, Tricks and AKC Canine Good Citizen Prep.
Oakland-based dog trainer Steve Bettcher, a Certified Dog Trainer by the International Association of Canine Professionals and a certified Nosework Instructor, has over 15 years of dog training experience in the Bay Area... and over 45 East Bay veterinarians refer their clients to him for in-home dog behavior training and problem solving.
Dog obedience problems often stem from a lack of communication, lack of clear boundary setting, and lack of consistent discipline. Steve teaches pet owners how to train their puppies and dogs using a humane approach to dog obedience training that teaches you how to communicate effectively with your pet, so that your dog understands clearly what you want and expect. He acts as your coach, by working with your dog on and off-leash, and then showing you how to get the exact same results. The Dog Squad obedience training produces dogs that listen better and respond to you even when distracted.
Many dog training schools and obedience classes only cover basic dog manners and obedience, and do not deal with specific problem dog behavior. Steve works with all breeds of dogs, all canine temperaments, and all dog behavior problems.
The Dog Squad offers a variety of private in-home dog training programs and obedience classes using traditional and remote dog collar training for puppies and adult dogs and offers classes in Nosework, Tricks and ACK Canine Good Citizen. No dog problem is too challenging for us to help you solve. Because I travel from Oakland to your location Steve covers only Alameda and Contra Costa County for his in-home dog training programs. The Dog Squad does work with people from outside the area by special arrangement.
Call The Dog Squad for an In-home Dog Behavior Evaluation. We train puppies and dogs seven days a week and we offer lifetime dog training support.
Call us today at 877-632-3647


text:
A first semiconductor wafer having a semiconductor element such as a piezoresistive element or any integrated circuit located on a top surface thereof is bonded to a second semiconductor wafer so that the semiconductor element on the first wafer is received in a cavity sealed from the outside environment. The bottom surface of the second water is prepared by etching it about a mask pattern so that the pattern projects from the bottom surface, thereby forming the cavity and defining projecting surfaces which are bonded to corresponding projecting areas on the first wafer to create a hermetic seal therebetween. The second wafer is electrochemically etched to produce porous silicon with regions of non-porous monocrystalline silicon extending between the top and bottom surfaces. The porous areas are thermally oxidized to convert them to silicon dioxide while the non-porous regions bonded to bond pads of the resistive pattern on the first wafer act as extended contacts.
1. A semiconductor structure comprising:
a first semiconductor wafer having a semiconductor element located on a surface thereof;
a second wafer coupled to said first wafer, said second wafer having electrically isolated regions of monocrystalline semiconductor material of a given conductivity which extend between opposed surfaces thereof; and
wherein said first semiconductor wafer and said monocrystalline regions of said second wafer define cavity means for enclosing said semiconductor element.
2. A semiconductor structure according to claim 1, wherein said cavity means comprises a conductive first rim portion on said first semiconductor wafer and a second rim portion formed by said monocrystalline regions on said second wafer.
3. A semiconductor structure according to claim 2, wherein said rim portions are fusion bonded to form a hermetic seal therebetween.
4. A semiconductor structure according to claim 1, wherein said second wafer comprises a layer of dielectric material.
5. A semiconductor structure according to claim 4, wherein said dielectric material is silicon dioxide and wherein said monocrystalline region is silicon.
6. A semiconductor structure according to claim 1, wherein said monocrystalline region is comprised of the same material as said semiconductor element.
7. A semiconductor structure according to claim 5, wherein said semiconductor element is a piezoresistor.
8. A semiconductor structure according to claim 7, wherein said first semiconductor wafer includes a dielectric layer on a surface thereof for dielectrically isolating said piezoresistor element therefrom.
9. A semiconductor structure according to claim 6, wherein said semiconductor element is an integrated circuit.
10. A semiconductor structure according to claim 9, wherein said integrated circuit includes at least one P-N junction device.
11. A semiconductor device comprising:
a device wafer fabricated from a semiconductor material, said device wafer having at least one semiconductor element formed on a surface thereof and
a cover wafer having first and second surfaces, said cover wafer being fabricated from said semiconductor material, said second surface of said cover wafer being bonded to said surface of said device wafer to hermetically seal said at least one semiconductor element, said cover wafer having at least one electrically isolated conductive pathway of said semiconductor material extending between said first and second surfaces of said cover wafer, said at least one conductive pathway providing at least one electrical contact on said first surface of said cover wafer for said semiconductor element.
12. The semiconductor device of claim 11, wherein said semiconductor material is silicon.
13. The semiconductor device of claim 12, wherein said silicon is monocrystalline.
14. The semiconductor device of claim 11, wherein said at least one conductive pathway is electrically isolated in silicon dioxide.
15. The semiconductor device of claim 11, further comprising cavity means for enclosing said semiconductor element, said cavity means being defined by said cover wafer and said device wafer.
16. The semiconductor device of claim 15, wherein said cavity means comprises a conductive first rim portion on said device wafer and a second rim portion formed by said at least one conductive pathway on said cover wafer.
17. A semiconductor device comprising:
a device wafer fabricated from a semiconductor material having at least one semiconductor element formed on a surface thereof;
a cover wafer transformed from said semiconductor material having opposing first and second surfaces, said second surface of said cover wafer being bonded to said surface of said device wafer to hermetically seal said at least one semiconductor element; and
at least one electrically isolated conductive member of said semiconductor material extending between said first and second surfaces of said cover wafer, said at least one conductive member providing at least one electrical contact on said first surface of said cover wafer for said semiconductor element.
18. The semiconductor device of claim 17, wherein said semiconductor material is silicon.
19. The semiconductor device of claim 18, wherein said silicon is monocrystalline.
20. The semiconductor device of claim 17, wherein said at least one conductive member is electrically isolated in silicon dioxide.
21. The semiconductor device of claim 17, further comprising cavity means for enclosing said semiconductor element, said cavity means being defined by said cover wafer and said device wafer.
This invention relates to semiconductor devices generally, and more particularly, to a semiconductor structure having environmentally isolated circuit elements disposed thereon.
Integrated circuit devices generally comprise one or more circuit elements, such as P-N junction devices, MOS devices (diodes, transistors, etc.) and resistors, capacitors, and the like formed on or within a substrate. These devices, in particular, have found a multitude of applications in the field of electronics, ranging from rectification of electrical currents to amplification of electrical signals and many others. Such devices have also been used in the conversion of a mechanical or acoustical signal into an electrical signal, or vice versa.
Although semiconductor devices are extremely small, they possess high reliability and have been utilized in many applications where the external environment imposes difficult operating conditions on the semiconductor structure. For example, semiconductor transducers have been employed in aircraft, automobiles, and other vehicles in which the transducer is exposed to moisture, fuel, solvents, hydraulics, and the elements in general. Exposure to moisture and to airborne contaminants prevalent in the aforementioned environments can harm the piezoresistive elements employed in conventional transducers. Integrated circuit chips may also be exposed to the same environmental conditions and p-n junction devices utilized thereon are equally susceptible to damage from such operating conditions. However, it is well known that any of these devices should be enclosed in some sort of hermetic package for environmental protection.
Accordingly, many schemes have been devised for the protection of the circuit elements of integrated circuit chips and other semiconductor structures in harsh environmental conditions, but these are uneconomical, imperfect, and introduce various problems. One widely accepted method of providing protection to the piezoresistive elements of semiconductor pressure transducer, for example, is to utilize a metal isolation diaphragm coupling the pressure applied through a fluid transmitting medium. For one example of a device constructed in accordance with this approach, see U.S. Pat. No. 4,406,993 entitled OIL FILLED PRESSURE TRANSDUCERS, issued on Sep. 27, 1983 to Anthony D. Kurtz and assigned to the assignee herein. One problem associated with fluid encased configurations, however, is that the oil must be seated in an absolutely hermetic manner. Such a seal is difficult to obtain with a silicon chip. Another disadvantage is that the trapped oil expands at high temperatures, thereby causing an unwanted pressure signal. Accordingly, devices constructed in that manner are not suitable for the hot sections of aeronautical propulsion systems and other applications in which high temperature conditions exist.
In U.S. Pat. No. 3,900,811 entitled ECONOMICAL PRESSURE TRANSDUCER ASSEMBLIES, METHODS OF FABRICATING AND MOUNTING THE SAME, issued on Aug. 19, 1975 to Anthony D. Kurtz and assigned to the assignee herein, there is disclosed another technique for hermetically isolating a pressure transducer assembly in which the transducer chip is placed in a transistor housing assembly such as a TO-5 package. This is accommodated by ball bonding the contacts of the transducer to the posts of a Kovar base plate and capping it with a cylindrical Kovar header.
A chief disadvantage of this technique, however, is that it requires the individual steps of ball bonding and hermetic packaging, which can not be performed as part of a batch process. There are of course a multitude of other hermetic headers or fiat pack enclosures for assuring environmental protection. However, all involved separately mounting chips or dies within each enclosure, making individual electrical contacts from selected points on the chip or die to terminal pads on the enclosures and then individually sealing each enclosure.
It is therefore an object of the present invention to provide an environmentally isolated semiconductor structure which prevents contamination of the semiconductor elements disposed thereon. This invention seeks to provide a mechanical structure which is practical and economical for implementation in hermetically sealing the circuit elements disposed on or in any integrated circuit chip, thereby protecting such elements from environmental contamination. This sealing process is accomplished in wafer form so that a multiplicity of enclosures and lead connections are simultaneously made in a batch process.
A method of fabricating a hermetically sealed semiconductor structure comprises the steps of providing a first semiconductor wafer having a plurality of individual semiconductor circuits located on a surface thereof, providing a second semiconductor wafer which includes a plurality of dielectrically isolated, conductive single crystal regions or vias separated by regions of silicon dioxide and extending from one surface of the wafer to the other and separately dielectrically isolated rim structures each enclosing at least one of the conductive regions but being isolated therefrom, and bonding or joining the second semiconductor wafer to the first semiconductor wafer.
The bonding is done in such a way that each respective contact surface of the second wafer is coupled to a corresponding conductive pad of the first wafer and such that each cavity defined therebetween encloses one of the semiconductor circuits. Each semiconductor circuit is surrounded by at least one sidewall formed between the first and second semiconductor wafers.
Preferably, the second wafer is fabricated from a single crystal wafer by first preferentially masking the desired contact vias and the rim vias and converting the remaining material to porous silicon. After suitable oxidation, the porous material is converted to a continuous SiO2, thereby dielectrically isolating the conductive single crystal vias and said rims, each from each other. This makes possible combining the separate steps of hermetically sealing and contacting within a batch process, thereby obviating the individual processes of ball bonding and separate packaging for hermetic seals heretofore required.
FIG. 1 is a cross sectional view of a semiconductor wafer used to fabricate the protective cover of the present invention.
FIG. 2 is a cross sectional view depicting a step utilized to form the protective cover from the wafer illustrated in FIG. 1.
FIG. 3 is a top plan view showing a mask pattern utilized in accordance with one embodiment of the inventive method.
FIGS. 4-8 show a series of cross sectional views depicting a method of fabricating the protective cover of the present invention.
FIG. 9 is a top plan view of a plurality of diffused circuits to be hermetically sealed using the protective cover of the present invention.
FIG. 10 is a cross sectional view taken across line X--X in FIG. 9.
FIG. 11 is a top plan view showing an individual diffused circuit.
FIG. 12 is a cross sectional view depicting the fusion of the protective cover of the present invention to the wafer of FIGS. 9 and 10 in accordance with one exemplary use the novel cover wafer of the present invention.
Before proceeding with the detailed description, it should be understood that although the specification will make reference to a piezoresistive transducer in which piezoresistive elements are incorporated in a bridge configuration on a substrate, the inventive technique for hermetically sealing such elements thereon is not to be limited to transducer devices and is, in fact, applicable to other classes of semiconductor devices, such as integrated circuits generally as well as other structures utilizing circuit elements diffused or otherwise disposed on a semiconductor substrate.
In accordance with the present invention, a protective cover 10 comprised of both conductive and dielectric materials is formed which is adapted to be bonded to a surface of a semiconductor device so that electrical contact is maintained with electrical contacts thereon while the circuit elements associated therewith are hermetically sealed and isolated from the outside environment. As shown in FIG. 1, the protective cover 10 is conveniently formed from a 3.5 mil thick P-type wafer of low resistivity silicon 12, the back surface 14 of which is contacted by a conductive metal pad 16 which will form an ohmic contact. The conductivity type of the wafer 12 is selected to correspond to the electrical contact surfaces of a semiconductor structure having elements thereon which are to be environmentally isolated. Accordingly, while the illustrative wafer 12 is doped with p-type impurities, it is understood that it may also be doped n-type as required by the application. It is of course understood that with conventional IC techniques, semiconductor wafers greater than 3.5 mils thick are employed. Therefore, the wafer thickness is not critical.
With reference now to FIG. 2, it can be seen that the front surface 18 of wafer 12 is treated or coated to form an etching mask layer 20 thereon. The mask layer 20 can be formed of silicon nitride and may be applied by any known method (e.g., by sputtering). A layer of photoresist (not shown) is then deposited on top of the mask layer. The layer of photoresist is patterned to form a resistive pattern over the mask layer 20. This is done by a conventional photolithography technique and is well known. A plan view of the resultant pattern is shown in FIG. 3 after etching the unwanted portions of the mask layer. For a purpose which will be explained later, the patterned portions of the mask layer comprise a grid of intersecting line portions 22 which define a plurality of rectangular areas 24. Within each rectangular area 24 are additional masked portions 26, 27 and 28 having a purpose which will be explained shortly.
A cross sectional view of a portion of the wafer 12 showing one rectangular area 24 and the masked portions thereof is illustrated in FIGS. 4-8. It will, of course, be appreciated that the process steps discussed below are applicable to each rectangular area 24. As shown in FIG. 5, trenches 30, 31 and 33 are formed on the front surface 18. The location of central trench 31 is selected so that it may be aligned with circuit elements of a chip to be environmentally isolated, defining a hermetically sealable recess or cavity which receives the circuit elements. The positions of the remaining trenches determine the shape and location of contact projections 35 and 37, and a projecting rim portion 39 which circumscribes each rectangular area 24, each having a purpose which will be explained later. The trenches, which may be 5-10 μm deep or smaller or larger, can be formed by a conventional etching process using a selective etchant which will not attack the mask layer 20. For example, if silicon nitride is used to form the mask layer, potassium hydroxide may be utilized as the etchant since it will etch silicon without affecting silicon nitride. Once the pattern of trenches has been established, porous silicon regions are formed in the wafer 12. There is extensive literature in the prior art relating to the formation of porous silicon, and for this reason a detailed description of such processes has been omitted. A good reference is the article by R. L. Smith and S. D. Collins appearing in the Journal of Applied Physics, Volume 8, R1 (1992). In that reference, there is disclosed a porous silicon formation process utilizing electrochemical anodization. In such a process, the back surface 14 of the wafer 12 is coated with a suitable encapsulant such as black wax. The wafer 12 is then placed in an electrochemical cell containing an electrolytic solution such as dilute hydrofluoric acid (HF) and having a saturated calomel reference electrode and a platinum wire counter-electrode. The anodization time, applied potential, and pH are controlled in a conventional manner to obtain the desired porosity and pore morphology and to achieve the configuration shown in FIG. 6.
As shown in FIG. 6, the entire thickness of the anodized silicon wafer 12 is porous in areas which were exposed to the electrolytic solution. The back surface 14, and the areas 34a, 34b and 34c between the front surface 18 and the back surface which were masked remain non-porous and monocrystalline. However, since the pore formation process is isotropic, a slight amount of undercutting of the silicon nitride mask will take place, so that the non-porous monocrystalline areas 34a-34c are characterized by an increasing cross section as measured from the front surface to the back surface. If desired, monocrystalline areas 34a', 34b' and 34c' having a more uniform cross section axially may be obtained by masking the same pattern of silicon nitride portions 22' and 26'-28' on both surfaces of silicon wafer 12' and anodizing them simultaneously. An anodized wafer processed in this manner is illustrated in FIG. 7.
Once the cover wafer 10 has been anodized to create the configuration of porous and non-porous regions of silicon shown in FIG. 6 or 7, it is subjected to a thermal oxidization process. During the oxidation process all porous areas of silicon are converted to silicon dioxide while the silicon nitride masks the monocrystalline silicon areas from the oxidation. Processes which convert porous silicon to silicon dioxide are well known in the art. One such process is described in an article by C. Oules et al appearing in the Journal of the Electrochemical Society, Volume 139, No. 12 (1992). As disclosed in the Oules et al article, the oxidized regions of porous silicon can be densified by heating it in an oxygen ambient, thereby resulting in a continuous (i.e. non-porous) layer of silicon dioxide. A silicon dioxide wafer 12 having regions of monocrystalline p-type silicon 34a, 34b, and 34c obtained in the above described manner is shown in FIG. 8. The mask layer 20 is then removed using a suitable etchant, such as hot phosphoric acid in the case of a silicon nitride mask, which will not attack the silicon dioxide or silicon.
At this point, the front surface of cover wafer 10 may be bonded to a sensor wafer having circuit elements thereon. However, in order to facilitate ohmic contact with the electrical bond pads of the semiconductor device to which it will be bonded, a p+ region is preferably formed on the crystalline contact surfaces 35a and 37a of projections 35 and 37, respectively, which will be placed in contact with the aforementioned bond pads. This may be accomplished using a well known thermal diffusion process in which boron is diffused into the front surface of the wafer. It will, of course, be appreciated that this diffusion process may be performed before or after the wafer 12 is oxidized.
As indicated earlier, the cover wafer 10 formed in accordance with the present invention may be used to hermetically seal and environmentally isolate circuit elements on any substrate surface. However, if the cover wafer is to be used for sealing IC's or any other device which cannot stand high temperature processing, the exposed surface of the rim and the contact regions should be coated with a suitable conductive material such as thin metal film, which can affect a seal at a low temperature to the rim and the contacts on the IC wafer. The sealing occurs by a melting process employing low melting point conductive layers. Eutectic bonds are also applicable. Moreover, the present invention permits the fabrication of such isolated circuits in an economically attractive manner. For illustrative purposes, the use of the inventive cover wafer is now applied to the construction of piezoresistive transducers.
As is well known, a semiconductor transducer typically employs one or more piezoresistive elements which are mounted or diffused in a bridge pattern of resistors on a thin diaphragm member. The diaphragm member, which may be fabricated from silicon, flexes upon application of force thereto and thereby causes fiber stresses on the top surface. These stresses elongate or shorten the piezoresistors and cause them to vary their resistance according to the deflection of the diaphragm. Reference may be had to U.S. Pat. No. 4,498,229 entitled PIEZORESISTIVE TRANSDUCER, issued on Feb. 12, 1985 to Leslie B. Wilner and to U.S. Pat. No. 4,672,354 entitled FABRICATION OF DIELECTRICALLY ISOLATED FINE LINE SEMICONDUCTOR TRANSDUCERS AND APPARATUS, issued on Jun. 9, 1987 to Anthony D. Kurtz et al., assigned to the assignee herein, as illustrative examples of piezoresistive transducer construction.
With reference now to FIG. 9, there is shown a top view of a silicon wafer 50, incorporating on a surface thereof a plurality of individual bridge configurations 51, 52, 53, 54 and 55. While the top five bridge configurations have been referenced, an additional number are shown beneath. It is, of course, understood, that many more such configurations can be accommodated on a silicon wafer 50, strictly dependent upon wafer size and bridge dimensions. In any event, a plurality of piezoresistive bridge patterns can be conveniently formed on the wafer 50 of silicon using conventional semiconductor techniques. Each pattern is representative of a bridge configuration, by way of example, and contains four piezoresistive elements to form a typical Wheatstone bridge configuration. The wafer 50 is preferably monocrystalline and, in the illustrative embodiment, is doped with an n-type impurity. A grid-like pattern of projecting silicon line segments 56 alignable with the silicon rim portions 39 formed on the cover wafer 10 around each rectangular area 24 and of the same conductivity type (p-type in the illustrated embodiment) is also formed on the surface wafer 50, with each bridge pattern being bounded on all sides by segments thereof. It will thus be apparent that each bridge pattern is alignable with, and is adapted to be received within, a corresponding trough or cavity 31 formed on the cover wafer. Similarly, it will be appreciated that a plurality of individual integrated circuits may be similarly arranged on a substrate and adapted to be received in the aforementioned cavity 31.
FIG. 10 shows a cross sectional view taken through line X--X of FIG. 9 and the patterns are generally represented in FIG. 9 by numerals 51-55, which for clarity, are shown as rectangular configurations. As shown in FIG. 10, each of the piezoresistors included in each bridge pattern, such as 51, may be isolated from the silicon wafer or substrate 50 by means of a dielectric layer 58 between the sensing elements 51-55 and the silicon diaphragm 60. The construction of a dielectrically isolated silicon sensor chip such as the one illustrated in FIG. 10 is shown and described in the aforementioned U.S. Pat. No. 4,672,354, the disclosure of which is incorporated herein by reference. It is again emphasized that the novelty of the present invention does not lie in the precise construction of the semiconductor chip 50 and that a dielectrically isolated piezotransducer structure is utilized herein for purposes of illustration only.
With reference now to FIG. 11, it can be seen that each bridge pattern also includes silicon electrical bond pads 66 and 68 associated therewith, these being of the same conductivity type as the monocrystalline areas 34b and 34c of the cover wafer and alignable therewith (p-type in the illustrated embodiment). Using a conventional silicon fusion bonding process, the front surface of the cover wafer is bonded to the front of the sensor wafer as shown in FIG. 12. The raised p-type silicon areas on the wafer 50 are bonded to the p-type silicon areas of the cover wafer 10. As such, the silicon rim portions 39 and 56 form a hermetically sealed cavity area 31 in which the circuit elements aligned therewith are received, thereby isolating them from ambient conditions. The cover wafer should have a minimum thickness oxide layer on it to ensure a good rapid seal. Preferably, the two wafers are sealed briefly at low temperatures to prevent any unwanted diffusion processes from occurring. After the seal is formed, the structure is subjected to a short anneal to ensure that the contacts between the cover wafer and the sensors are ohmic. It is of course understood that fusion bonding is not suitable for sealing of IC wafers. For IC wafers sealing is accomplished at lower temperatures because of the low melting point conductive layers which were previously applied to the cover wafer. In IC's, the metal can be applied to either, or both wafers.
It should now be readily appreciated that the crystalline areas 34a, 34b and 34c of the cover wafer act as extended contacts for the sensing elements. These areas can be depressed relative to the rim to enable one to form solder terminal pads on the respective contact areas. This facilitates the mounting of the resultant chip on a circuit board or other substrate. The sensing elements themselves are well protected within sealed cavity 31. Pressure can now be applied to the diaphragm 60 on the back surface thereof, while the sensitive surface of the sensor chip 10 is completely protected from the outside environment.
The composite structure of FIG. 12 is now scribed, cut or otherwise separated along the dashed lines and along other lines (not shown) to separate the plurality of transducers or other circuits into individual circuit assemblies. Thus, a great number of hermetically sealed individual circuit devices are obtained via the above described common processing procedure.
Patent Citations
Referenced by
Legal Events
Original Image


text:
This 2005 Chrysler Crossfire 2dr Convertible features a 3.2L V6 CYLINDER 6cyl Gasoline engine. It is equipped with a 6 Speed Automatic transmission. The... More
var x = document.getElementsByClassName("phone");var i;for (i = 0; i ";}The Chrysler Town and Country is one of the most cherished true American Classic Cars... More
We'll admit that the 1962 Chrysler Imperials are polarizing machines, but when you consider that this Imperial convertible was the equal of any Cadillac... More
2002 CHRYSLER PROWLER CONVERTIBLE SPECTACULAR CONDITION! ONLY 7,554 CAREFULLY DRIVEN MILES! LAST YEAR FOR THIS COLLECTIBLE MODEL! MOST DESIRED AND SOUGHT AFTER COLOR COMBINATION! 1 OF ONLY 1,436 BUILT! FULL... More
1966 Chrysler Newport Convertible This fine Chrysler convertible came to us from a retired physician that had owned the car for the past... More
1989 Chrysler's TC by Maserati 2 Passenger Roadster For over 60 years I have been selling Rolls Royces and Bentleys, both new and pre owned and... More
var x = document.getElementsByClassName("phone");var i;for (i = 0; i ";}Rare Chrysler survivor DC Phaeton 1 of 6 known to exist; 1 of 248 built. This... More
Yes!! Only 6,320 miles!! Fully equipped with Power Retractable Top, Leather Trimmed Bucket Seats, Heated Seats, Power Driver Seat, Power Passenger Seat, Dual Zone... More
1981 Chrysler Imperial coupe, Chrysler's most elegant car for 1981. Finished in stunning Manilla Cream with saddle tan Mark Cross leather 60/40 w/arm rest... More
You are viewing my 1968 Imperial Crown Coupe, equipped with a 440 cubic in. V8 engine, automatic transmission, black leather interior and power everything. The... More
Thank you for viewing my 6-passenger 1966 Chrysler Town & Country Wagon, equipped with a 383 cubic inch V8 engine and optional roof rack. ... More
Just arrived, this luxury car is in excellent condition. The Chrysler Broughams of these 1970 were well optioned and appointed with many luxury accessories. Sold new to... More
1989 Chrysler TC by Maserati Convertible (Two Tops) Only 15,000 miles! Powered by the 2.2 Litre Turbo II Motor, Automatic Transmission, Full Power Equipment... More
~CALL US FOR A DETAILED DESCRIPTION OF THE CAR! WE DO A 150+ POINT CHECK ON EACH VEHICLE AND ARE HAPPY TO... More
2005 Chrysler 300 Touring, blue exterior with tan leather interior, power seats, power windows, power door locks, am/fm radio, cd player, a/c, heat, rear... More
Just in! Call or visit our website for more information.... More
For sale in our St. Louis showroom is a beautiful 1948 Chrysler Windsor C38 7P. The Chrysler Windsor was produced from 1939 to 1961... More
1964 Chrysler Imperial Crown Convertible For Sale or Trade. One of only 922 Imperial convertibles produced by Chrysler for '64. Originally priced at $6,003, this... More
SUMMARYFrame-up restorationHighlander Scottish Plaid upholsteryCorrect 250 cubic inch Spitfire 6-cylinderCorrect Fluid Drive 2-speed semi-automatic transmissionColor-keyed cloth top / Glass rear windowMotorola AM radioSumac Red... More
~CALL US FOR A DETAILED DESCRIPTION OF THE CAR! WE DO A 150+ POINT CHECK ON EACH VEHICLE AND ARE HAPPY TO... More
Gorgeous 1962 Chrysler 300H Convertible. Fully restored in Sage Green with green interior and top. 413ci V-8 with inline dual-quad carbs. Push-button shifted A727... More
1964 Chrysler Crown Imperial coupe, Numbers matching car.413 wedge v8 runs great.Transmission shifts smoothly.Clutch plates just replaced. Brakes stop properly.Cold A / C. New... More
A rare gold color 2002 Prowler ready for you to step in, sit down and drive. This Prowler is loaded and will turn heads... More
1962 Chrysler 300 ConvertibleThis car just came in.More information and additional pictures will follow as soon as possible.For more information you should contact us.... More
West Coast Classics are proud to present an exceptionally straight and rust free and great daily driving survivor of this very rare and original... More
1956 Chrysler Windsor Sedan For Sale or Trade Finished in blue and white, complemented with a blue interior. Famed auto designer Virgil Exner's monumental breakthrough... More
1959 Chrysler Crown Imperial 2 dr hardtop -- 413 auto -- ran & drove last year original paint except hood -- needs interior redone power windows and seats -- original rims... More
2001 Chrysler Town & Country LX minivan (VIN: 2C4GP44301R335501), dark blue with tan cloth, 250,750 miles, auto trans, 3.3L V6 drives great, power mirrors... More
1967 Chrysler New Port ConvertibleThis model made Chrysler more known for its luxurious vehicles. Therefore this classic car offers plenty of space and comfort.... More
BEAUTIFUL 1967 CHRYSLER NEW YORKER TOWN AND COUNTRY 9 PASSENGER WAGON 383 4 BARREL ENGINE NEW JUST 63000 MILES CALIFORNIA ONE OWNER WAGON THIS... More


text:
Rossford Christmas display raises funds for churchWritten by Jason Mack | | firstname.lastname@example.com
Setting up a musical Christmas light display is time-consuming, but occasionally a moment arises to remind Robert Densic why he started his show seven years ago.
"This guy showed up last year, and he had been showing up with his wife for years since we started this," Densic said. "He was in his mid-80s and his wife had just passed away a week before the lights came on. He said, 'She was so looking forward to coming and seeing what you were doing this year. I just had to bring her.' He had her in her urn. That's when you know all the time, effort and standing out in the freezing rain, snow and cold is worth it."
Densic upgraded this year's display, called "The Ageless Childs' Christmas," from 55,000 to 66,000 lights connected with nearly three miles of extension cord. At full tilt, the display draws 135 amps of power.
"When everything goes bright outside, everything goes dim inside," Densic said. "We have a 200-amp service. If we're pulling 135 amps out here, it doesn't leave us much inside. If we're cooking dinner, our lights will dim. I don't have much of a problem."
The neighbors have also come to expect the display.
"They enjoy it as well," Densic said. "One neighbor next door and another across the street insisted we start using their yard. They are all very supportive and come out to help."
The lights are managed with 23 control boxes, each of which controls 16 different elements in the show. Everything is connected with computer wiring and runs off a computer in the house. With such a complex system, the process of setting up the show starts long before the holiday season.
"The whole family is involved in the setup," Densic said. "My wife and I start in early October. I program year-round. The setup and programming are separate aspects. My family, her family and friends come out and help. My mother, niece and nephew were here constantly helping every weekend for a month. We need that. Our neighbors help us set up. It took us just shy of seven weeks to set this all up."
The idea for the display came to Densic and his wife seven years ago.
"There was a video that started flying around the Internet of a house in southern Ohio done to the music of Trans-Siberian Orchestra," Densic said. "Everybody saw the house and thought it was amazing. I saw the video and thought, 'Wow. I have to do that.' I still had dial-up, so it took about two hours to download the video. I called my wife, and she said we had to do it. We thought it was a great way to celebrate Christmas."
This year's show includes seven songs from Trans-Siberian Orchestra.
Densic, a Toledo Free Press political columnist, was enthusiastic about decorating for Christmas even before starting the light show. He decorated outside with 17,000 icicle lights, which used more power than his new display.
"I almost tripled the number of lights but went down in electrical costs," Densic said. "That's the first question we get from people, is what is our electric bill like. Honestly, it's not that bad. At any given point in time, they are not all on, compared to a display where you just have timers with everything on. I keep arguing that as a cost-saving measure, I should put more lights and more controllers in the show, because obviously we're saving money."
Densic isn't just saving money, he's raising it by accepting donations. Since Cedar Creek Church had to cancel its light show, Densic and other members are raising money for the church.
The lights are on display from 5:30-10:30 p.m. Sundays-Thursdays and until midnight on Fridays and Saturdays. Hours will be extended until midnight on Christmas Eve, Christmas, New Year's Eve and New Year's Day. Densic's home is located at 107 Birch Drive in Rossford. Visit the web site TheAgelessChildsChristmas.com for directions and more information.
Tags: Cedar Creek Church, Christmas, Robert Densic, Rossford


text:
Country Forecasts focus on the key factors affecting a country's political and economic outlook and its business environment five years ahead. Each report covers an individual country and is written from the perspective of foreign investors.
These reports have been recently updated to include more practical data. The business environment rankings allow comparisons to be made quickly and easily on business conditions in different countries. The labour market forecasts allow for more effective costing of business operations. Each report also contains extended coverage of sectoral output, market size, policy indicators and social and demographic data.
Country Forecast Greece September 2014 Updater
The Economist Intelligence Unit
September 15, 2014
International: +1.240.747.3093
Or leave us a message and we'll call you back!
Receive bi-weekly email alerts for new market research.


text:
Ruby Cantonese Restaurant - the original Lichfield Chinese restaurant serving authentic oriental food. The restaurant is situated in one of Lichfield's beautiful listed buildings with low ceilings and exposed oak beams. The atmosphere is welcoming, the food is delicious and the service is perfect. The only Chinese restaurant with alfresco dining in their garden restaurant.read more
Pizza by Goli in Lichfield is a fabulous Italian Restaurant serving mouthwatering Italian cuisine in a modern, comfortable environment. Whether you enjoy pasta, pizza, fish, chicken or meat dishes, you'll find something to suit your taste at Pizza by Goli.read more
The Spark Lichfield is a continental-style bar in Lichfield serving great coffee and lunches during the day in a relaxed and welcoming environment - open seven days a week!read more


text:
Update June 4, 2014: ADP revised its April reading to show that the U.S. private sector added 215,000 jobs to its payrolls.
Out Wednesday, ADP's April National Employment Report shows private payrolls added 220,000 jobs last month, on the high end of economists' expectations. ADP also revised its March reading up from 191,000 to 209,000 jobs added.
Mark Zandi, chief economist of Moody's Moody's Analytics, which collaborates with the payroll company on the report, noted in a statement on the results, "The job market is gaining strength. After a tough winter employers are expanding payrolls across nearly all industries and company sizes. The recent pickup in job growth at mid-sized companies may signal better business confidence. Job market prospects are steadily improving." ADP — Automatic Data Processing – says that private companies added 245,000 and 191,000 jobs in November and December 2013 respectively. The results plummeted to 121,000 in January and 193,000 in February before picking up in March.
ADP's CEO Carlos Rodriguez pointed out that 220,000 is "well above" the twelve-month average, adding, "Job growth appears to be trending up and hopefully this will continue."
Looking toward the April jobs report PNC economists Stuart Hoffman and Gus Faucher wrote in a note that the ADP number "supports PNC's forecast for job growth of 200,000 in April when the Bureau of Labor Statistics releases the official employment report on Friday."
Referring to the gross domestic product advance estimate also released Wednesday, Hoffman and Faucher wrote, "The weak pace of first quarter GDP growth does not reflect the pace of the labor market recovery. Business are responding to better demand by boosting their hiring, and job gains will average around 200,000 per month over the rest of this year. PNC expects the unemployment rate to fall from 6.7% in March to 6.6% in April, even as the labor force grows as more people look for work, encouraged by the improving job market."
By company size, ADP showed businesses with less than 50 employees adding the most jobs in April at 82,000 with the smallest — under 20 employees — doing more than 60% of small business hiring. Mid-sized businesses with 50 to 499 employees were not far behind with 81,000 jobs added. Large businesses added 57,000 jobs.
All major industries covered by ADP's report added jobs last month with professional and business services adding 77,000 jobs, trade/transportation/utilities adding 34,000 and construction adding 19,000. Manufacturing and financial activities industries were far behind other industries adding 1,000 and 8,000 jobs respectively. With 197,000 jobs added service-providing businesses significantly out-hired goods-producing business which added 24,000 jobs.
Earlier this week Paychex Paychex, another payroll provider, released its monthly Paychex | IHS Small Business Jobs Index which also showed solid job growth in April. The index looks at changes in worker count at 350,000 of Paychex's 570,000 clients. Each business in the sample group has fewer than 50 employees and 80% have fewer than 20. The index increased 0.1% in April to 101.26 bringing the three-month growth rate to 0.22%. The barometer has increased 0.5% in the last 12-months.
James Diffley, chief regional economist at IHS IHS which works with Paychex on the index, said in a statement on the results, "The April increase in the Paychex | IHS Small Business Jobs Index adds to a series of optimistic signals in 2014 that job security and employment conditions are improving for American workers."
The mountain region — which includes Idaho, Nevada, Arizona, Utah, Montana, Wyoming, Colorado and New Mexico — had the highest 12 months growth rate in April at 1.75%. The east south central region — Kentucky, Tennessee, Mississippi and Alabama — had the biggest contraction at negative 1.12%.


text: Piaf is a medium-dark gray with a silver, metallic sheen. It had decent pigmentation, but the texture was slightly powdery/dry. CoverGirl Charcoal (335) (P, $4.99) is lighter. MAC Diesel (LE, $15.00) is darker. Disney by Sephora Midnight Hour #3 (LE) is lighter. Giorgio Armani #21 is darker. (LE, $33.00) See comparison swatches.


text:
This game must have been a massive relief to Canucks fans who were tired of the low-scoring, defensive snoozefests that the Canucks have been known for recently. For once, the Canucks didn't sit on a one-goal lead and bore fans to tears. This game was wide open right from puck drop, with goals galore. Heck, even one of Wayne Gretzky's seemingly unbreakable records was broken, tonight! What more could you ask for?
Wait, you wanted the Canucks to score? You didn't want more goals in general, only more goals for the Canucks? Oh.
Well, crud. That sure didn't happen. I watched this game.
Sweet game. I enjoyed watching the Casucks get rolled. If any Casucks fans think this team will survive a seven game series against a gritty, hard hitting team like Chicago or Boston, they are deluded. Vigneault will be out coached again. Mary Kate and Ashley will disappear again. There will be no takers for Luongo and Vigneault will have have to flip a coin to decide which goaltender chokes in the net for the Casucks.
I know I shouldn't get annoyed by a troll, but my name sort of precludes that. Casucks, sisters, etc – you must have this blog mistaken for Facebook or something.
Also, I understand the whole thing about "free speech" and all that crap, but seriously, can you give us an insight to your pysche and tell us why you only post during a Canucks loss? One of the definitions of mystic is inspiring mystery and wonder, so it's a mystery and wonder to, I'm sure, most of us, why you would bother. Of course, another definition is relating to occult practices and rites. If that's your go, well, no further explanation is necessary.
However, since I'd suggest that you didn't foretell a Stanley Cup for an outfit that managed to squeak into the playoffs by the barest of margins and then destroy better teams last year, then I'm going to suggest you have no clue about what's going to happen at the start in four weeks. I'm not suggesting that a Cup will happen to the Canucks – after 37 years of following the blue, my outlook remains hopeful, not optimistic, sadly – but really, who the hell knows what's going to happen against a team like Chicago or Boston. Especially on the basis of one poor game out of 48.
The negative, one should eschew,
Like heaping scorn on Bobby Lu,
Or speaking ill of David Booth
And his own version of the truth.
As no one knows what's going on,
At least until they're dead and gone,
You should shut-up and see the game
For win or lose it's all the same.
Just put your ego on the shelf,
Until you've time to find yourself.
Meanwhile fix focus on the now
For every goal's the cat's meow,
No matter which team scored, because
The beauty's in the way it was.
Probably need more Chris Neil/Steve Ott/Shane Doan kinds of players on the team, behind Luongo (a fair long ways back) at least Bieksa least showed a bit of fight, Burrows was trying… not sure how most of the team faces their family after a performance like that, they should be down right embarrassed about that effort (as should the coaches)…
I was half expecting the title of the blog to be changed to "I watched this period"
I almost always watch games to the bitter end, but I bailed after the 1st period last night.
From what I saw, the defense looked like amateurs against a young, fast, and highly skilled group of Oilers.
In Edmonton on Saturday
'Tis simply one that gets away
The Oilers score an early two
And AV goes with Bobby Lou
Seconds later and down by three
Sure not the start I thought I'd see
Still in the first it's five on four
And once again the Oilers score
But I remain to watch this game
Though after two the score's the same
The playoffs now a month away
An early summer some will say
The Wild again are back in first
And our PP must be the worst
Neither fact's a valid reason
To dismiss the second season
Which when it comes I still suggest
Canucks will prove to be the best
After the Oilers scored their third goal I just started laughing. I mean, really, what else could I do? It was like watching a train wreck; I knew it wasn't going to get any better. I really hope our boys can put this game behind them (way, way, way behind them) and put in a solid effort tomorrow night. I'll be in the Tank cheering them on.
I Watche This Game…like the Canucks I'm going to just forget about "D". Though not scoring any goals (or even looking that close to doing so) was similarly disappointing. I do often look to you guys for some optimism (even though I am a curmudgeon) but appreciate that sometimes there's really none to be had.
It's amazing to have to say that a goalie who let in 2 of the first 3 shots he faced was probably our best player. Amazing to think that there's a chance that could be the last time we see Bobby Lu in a Canuck uniform. Right after one of his best (may have been the blocker against Hall), the Canucks rushed back up the ice and Hansen put a shot squarely into Dubnyk's chest. I turned to my buddy (we were sitting in a San Francisco bar full of people watching other games but occasionally looking over to see what these two weirdos were so upset about on the best TV in the place that we'd convinced them to switch to the Canucks) and said "that back and forth sequence is a symbol of what's wrong with the team". I like Jannik Hansen just fine, but as a third liner. Same with all of our team that isn't the Sedins, Burrows and Kesler. I was starting to hope they'd get even more ventilated, because Gillis needs to get the message that this team is not good enough, period, and it's his job to improve it. That message should've been clear since last year's playoff exit (I for one am a broken record on the subject), but Gillis seems to have a massively thick skull. We know that they can play defence most games, so as ugly as that was, at least there's some demonstrated ability there. Not so much for scoring.
I have to say, one of the worst players on the ice last night was Steve Pinnizotto. Still waiting to see why you guys are so high on him. Edler's play is also as bad as ever, I particularly loved that drop pass where he was steps from the blue line and then dropped it to a guy at center ice, who, predictably couldn't really advance the puck with all of the Oiler PK guys converging on him. Newell Brown must have some compromising photos, because I don't think I've ever seen the Canuck PP this inept, and I watched a fair number of games in the Messier era.
I fired on Bulk and Skull while reading and writing this whole thing, and I have to say it does seem perfectly appropriate. The Benny Hill theme also comes to mind.
I seriously worry about Edler. This season he seems to have regressed about two years in his development. Does he need a Salo-type to lean on or what?
If there are changes to be made post-season — and who believes there shouldn't be? Then Edler would be top of my list. He's still carries the "potential" label so you'd expect he'd be a desirable option for someone, but not this club. Too bad he just signed a new contract.
I second that. Edler's been careless and not playing a smart game since at least mid-season last year. And his vaunted shot seems to be losing accuracy.
Is he just not that good, is potentially good but isn't responding to the coaching he's getting? Or is he just as good as ever, and I'm about to be attacked by folks here for even suggesting Alex is regressing to the point of hurting the team?
I hope he figures it out.
I'm kind of glad that this game wasn't played at home because the arena would have been empty after the first.
It's kind of sad that at games recently, when the Canucks are winning with three minutes to go, everyone is piling out of the arena. Makes my blood boil every time.
This felt a taste of things to come from the Oilers who with all those first round picks are starting to really play well, which will be bad news for the Canucks and a lot of other teams in the league. I wouldn't be surprised to see the Oilers make the playoffs and potentially pull off an upset in the first round.
I didn't/couldn't watch the game…lucky, apparently.
Everyone is up-in-arms but the most concerning aspect is not a new phenomenon: The Canucks can't score.
I question AV's decision to pull Schneider. How many times was Luongo given rope to recover from a bad start?
Schneider was the biggest reason for the 6 game streak. He has worked himself up to top 5 in stats (svpct, gaa).
Was AV saving Schneider from his own team? Or, did he hope to wake the team up?
Did he call a time out? No.
Anyone hear the post-game and hear the reason/s?
This, on the surface, with the limited information I have, was yet another questionable move by AV.
In fact, it seems a little insulting.
Are you saying that Schneider was to fault on those goals? Did he look 'off'?
So, if Stamkos scores twice on 2 breakaways early in a period, would the goalie get pulled.
(Wait a minute! Is this soft relativism?)
My ultimate point is: if Schneider wasn't at fault, he shouldn't have been yanked when you consider the entire context.
If AV's reasoning was to save him because there wasn't a team in front him and, in essence, rest him for next game…okay. I can understand that, which is why I asked about post-game comments.
If not…
It's a combination of things. The Canucks looked incredibly flat to start the game (though Daniel Sedin nearly scored a beauty on a spin-o-rama in between the first and second goals), so it could be that AV saw the writing on the wall and wanted to spare his "number one" from getting shelled.
On the other hand, the Canucks had a 6-game win streak on the back of Schneider making some impressive stops. Both goals came on breakdowns, but during the win streak, Schneider made big saves on similar breakdowns. On the first goal, Hall's shot was beautiful, but he beat Schneider short side. Ask any goalie in the NHL and they'll tell you that the last place they want to get beat is on the short side. On the second goal, you could argue that Schneider needed to battle more to get into a good position to stop the slap shot.
I wouldn't characterize either goal as being Schneider's fault at all, but he also didn't step up to make a big save. Neither did Luongo on the next two goals, but AV wasn't likely to go back to Schneider after pulling him, so they were stuck with Luongo. On the plus side, he did step up throughout the rest of the game to make those types of saves.
So, it's a combination of it being 2 goals on 2 shots, which generally gets a goaltender pulled no matter what, and protecting a goaltender from getting shelled and embarrassed.
A goalie gives up 2 goals on 2 shots in 2 minutes and he usually gets pulled. This wasn't a coaching blunder or an insult, you're just looking to blame Vigneault because you don't like him. It wasn't an effective wake up call but it was a very standard move.
Blame rhymes with lame. Blame AV for what?
Were they bad goals? Partial breakaway and a seeing-eye screen shot. I think not.
Standard move? As I mentioned, it would have been a standard move to yank Luongp umpteen times in the past, but AV let him play through it.
It seems standard that you would call a time-out and tear a strip off your team, including the goalie if necessary whether it's 2 goals on 2 shots or 2 goal on 4 shots.
I say again, they weren't even bad goals by Schneider.
Way to show your number 1 goalie some support, a goalie that has saved the team's collective bacon.
Standard move, yes. Standard context, no.
Questionable move, clearly.
Weak response, Chris.
i know what you're saying, tom but i think it was more a case of saving schneider for the next start and letting lou do some backup dirty work. schneider is number one. AV was just making quick trades down on the floor, being ruthless and efficient:)
there's a lot more to worry about than who pulled who. that was a scary game.


text:
Loading stream...
|All Content
|View all podcasts & RSS feeds
A Pickerington cardiologist was shot and killed in Pakistan on Monday.
Doctor Medhi Ali Qamar was visiting his parents' graves when two gunmen approached and opened fire in front of his wife and two-year-old son, who were not hurt. Qamar was on a three-week medical mission and had worked at Fairfield Medical Center for more than a decade.


text:
As I logged into Citibank's credit card website to review their extended warranty offer, I was presented with the option to assign new security questions, whose answers may be verified occasionally. I could have postponed changing the security settings, but after a few visits to the website, it would be mandatory.
I also noticed CitiBank will be redesigning the interface for the credit card website with a "fresh look and improved navigation" in 2007.
Updated May 26, 2009 and originally published December 15, 2006. If you enjoyed this article, subscribe to the RSS feed or receive daily emails. Follow @ConsumerismComm on Twitter and visit our Facebook page for more updates.


text:
Uncle Sam could put student loans in the hands of Wall Street. On Thursday, the U.S. House passed a bill that would tie interest rates to treasury bills.
That bill still has to get through the Senate. But even as Congress grapples over this legislation, student loan interest rates are set to double on July 1st to 6.8 percent.
That means thousands of Northeast Ohio graduates will be digging deeper into their pockets to pay off loans.
Tara Killmer graduated from Cleveland State University two weeks ago with a degree in International Relations. She already has her first job lined up.
She doesn't know what her paycheck will look like, but has a good idea about how much she'll be paying in student loans.
"I'll have $63,000 when I'm done, well, when I consolidate it all," says Killmer.
The average student borrows $23,000 in subsidized student loans. A higher rate could mean tens of thousands of dollars in interest over the course of 10 to 30 years.
"It means they're less likely to buy a car, less likely to buy a house, less likely to start a business, and that ripple effect all across Northeast Ohio has a dampening effect on our economy," says U.S. Sen. Sherrod Brown.
Brown is introducing his own legislation, asking the government to freeze the interest rate for subsidized loans at 3.4 percent. He says Congress was able to stop the rate from going up a year ago and he doesn't see why they can't do it again.