text:
A processing apparatus for processing a microelectronic workpiece includes a metrology unit and a control, signal-connected to the metrology unit. The control can modify a process recipe or a process sequence of the processing apparatus based on a feed forward or a feed back signal from the metrology unit. A seed layer deposition tool, a process layer electrochemical deposition tool, and a chemical mechanical polishing tool, arranged for sequential processing of a workpiece, can be controlled as an integrated system using one or more metrology units. A metrology unit can be located at each tool to measure workpiece parameters. Each of the metrology units can be used as a feed forward control and/or a feed back control at each of the tools.
1. A processing apparatus for processing a microelectronic workpiece, comprising:
an in-line metrology unit having a space for receiving a microelectronic workpiece for measuring a condition of a first layer on said microelectronic workpiece and generating a condition signal;
a control, signal-connected to said metrology unit;
a process unit providing a space to receive said microelectronic workpiece and performing an electrochemical process that is controlled by said control; and
a transport unit positioned to receive the microelectronic workpiece from at least one of the process unit and the in-line metrology unit and move the microelectronic workpiece to the other of the process unit and the in-line metrology unit,
wherein said condition signal from said metrology unit to said control influences said process.
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11-12. (canceled)
13. A method of processing a microelectronic workpiece, comprising the steps of:
providing two processing tools each of which further processes a microelectronic workpiece in a preselected process;
using an in-line metrology unit, determining a condition of a layer on said microelectronic workpiece at one of the tools; and
in response to a signal from the metrology unit, modifying a process parameter in the respective other tool.
14. The method according to
15. The method according to
16. The method according to
17-26. (canceled)
27. An apparatus for processing a microelectronic workpiece, comprising:
a metrology unit having a space for receiving a microelectronic workpiece, the metrology unit being configured to measure a condition of at least one conductive layer of the microelectronic workpiece and generate a condition signal representative of the condition;
an electrochemical processing unit having a space to receive the microelectronic workpiece, the electrochemical processing unit being configured to apply a conductive material to the at least one conductive layer; and
a control unit operatively coupled between the metrology unit and the electrochemical processing unit to receive the condition signal from the metrology unit and transmit a control signal, the control signal influencing at least one of a manner in which the conductive material is applied to the at least one conductive layer of the microelectronic workpiece and a sequence of processes performed on the microelectronic workpiece.
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36. An apparatus for processing a microelectronic workpiece, comprising:
a metrology unit having a space for receiving a microelectronic workpiece, the metrology unit being configured to measure a condition of at least one conductive layer of the microelectronic workpiece and generate a condition signal representative of the condition;
a processing unit having a space to receive the microelectronic workpiece, the processing unit being configured to perform a process on the at least one conductive layer of the microelectronic workpiece, the process including at least one of a repair process and an enhancement process; and
a control unit operatively coupled between the metrology unit and the processing unit to receive the condition signal from the metrology unit and transmit a control signal to the processing unit to influence at least in part the process performed by the processing unit.
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The present invention is directed to an apparatus and method for processing a microelectronic workpiece. More particularly, the present invention is directed to an improved apparatus and method of processing a microelectronic workpiece using a metrology result representative of a microelectronic workpiece condition. For purposes of the present application, a microelectronic workpiece is defined to include a microelectronic workpiece formed from a substrate upon which microelectronic circuits or components, data storage elements or layers, and/or micro-mechanical elements are formed.
The fabrication of microelectronic components from a microelectronic workpiece, such as a semiconductor wafer substrate, polymer or ceramic substrate, etc., involves a substantial number of operations performed on the microelectronic workpiece. Such operations include, for example, material deposition, patterning, doping, chemical mechanical polishing, electropolishing, and heat treatment.
Material deposition processing involves depositing or otherwise forming thin layers of material on the surface of the microelectronic workpiece. Patterning provides deposition or removal of selected portions of these added layers. Doping of a microelectronic workpiece such as a the semiconductor wafer, is the process of adding impurities known as "dopants" to the selected portions of the microelectronic workpiece to alter the electrical characteristics of the substrate material. Heat treatment of the microelectronic workpiece involves heating and/or cooling the microelectronic workpiece to achieve specific process results. Chemical mechanical polishing involves the removal of material through a combined chemical/mechanical process, while electropolishing involves the removal of material from a microelectronic workpiece surface using electrochemical reactions.
Production of semiconductor integrated circuits and other microelectronic devices from microelectronic workpieces, such as semiconductor wafers, typically requires the formation and/or electrochemical processing or one or more thin film layers on the microelectronic workpiece. The microelectronic manufacturing industry has applied a wide range of thin film layer materials to form such microelectronic structures. These thin film materials include metals and metal alloys such as, for example, nickel, tungsten, tantalum, solder, platinum, copper, aluminum, gold, etc., as well as dielectric materials, such as metal oxides, semiconductor oxides, and perovskite materials.
Electroplating and other electrochemical processes, such as electropolishing, electro-etching, anodization, etc., have become important in the production of semiconductor integrated circuits and other microelectronic devices from such microelectronic workpieces. For example, electroplating is often used in the formation of one or more metal layers on the microelectronic workpiece. These metal layers are typically used to electrically interconnect the various devices of the integrated circuit. Further, the structures formed from the metal layers may constitute microelectronic devices such as read/write heads, etc.
Electroplated metals typically include copper, nickel, gold, platinum, solder, nickel-iron, etc. Electroplating is generally effected by initial formation of a seed layer on the microelectronic workpiece in the form of a very thin layer of metal, whereby the surface of the microelectronic workpiece is rendered electrically conductive. This electro-conductivity permits subsequent formation of a blanket or patterned layer of the desired metal by electroplating. Subsequent processing, such as chemical mechanical planarization, may be used to remove unwanted portions of the patterned or metal blanket layer formed during electroplating, resulting in the formation of the desired metallized structure.
Electropolishing of metals at the surface of a microelectronic workpiece involves the removal of at least some of the metal using an electrochemical process. The electrochemical process is effectively the reverse of the electroplating reaction and is often carried out using the same or similar reactors as electroplating.
Anodization typically involves oxidizing a thin-film layer at the surface of the microelectronic workpiece. For example, it may be desirable to selectively oxidize certain portions of a metal layer, such as a Cu layer, to facilitate subsequent removal of the selected portions in a solution that matches the oxidized material faster than the non-oxidized material. Further, anodization may be used to deposit certain materials, such as perovskite materials, onto the surface of the microelectronic workpiece.
As the size of various microelectronic circuits and components decreases, there is a corresponding decrease in the manufacturing tolerances that must be met by the manufacturing tools. It is desirable that electrochemical processes uniformly process the surface of a given microelectronic workpiece. It is also desirable that the electrochemical process meet microelectronic workpiece-to-microelectronic workpiece uniformity requirements.
Multiple processes must be executed upon a microelectronic workpiece to manufacture the desired microelectronic circuits, devices, or components. These processes are generally executed in processing tools that are specifically designed to implement one or more of the requisite processes. In order to automate the processing and minimize operator handling, tool architectures have been developed that incorporate multiple processing stations and automated transfer of the microelectronic workpieces from one processing station to the next.
In such tools, the microelectronic workpieces are processed individually at the various processing stations. Furthermore, multiple microelectronic workpieces are concurrently processed at different processing stations. Thus, one microelectronic workpiece may be processed in one of the processing stations while another microelectronic workpiece is concurrently processed in another one of the processing stations. In this way, a pipeline processing approach can be developed, which enhances production throughput. Additionally, processing steps that take longer to perform may have multiple processing stations devoted to performing that particular processing step, thereby enhancing production throughput.
Numerous processing tools have been developed to implement the foregoing processing operations. These tools take on different configurations depending on the type of microelectronic workpiece used in the fabrication process and the process or processes executed by the tool. An exemplary tool embodiment is disclosed in U.S. patent application Ser. No. 08/991,062, filed Dec. 15, 1997, entitled "Semiconductor Processing Apparatus Having Lift and Tilt Mechanism."
One tool configuration, known as the LT-210C™ processing tool and available from Semitool, Inc., of Kalispell, Mont., includes a plurality of microelectronic workpiece processing stations such as one or more rinsing/drying stations, one or more wet processing stations, and one or more thermal processing stations that includes a rapid thermal processing ("RTP") reactor. Such wet processing operations include electroplating, etching, cleaning, electroless deposition, electropolishing, etc.
In the processing of microelectronic workpieces, the output of one process is the input for the next process, and such output typically influences the output of the next process. This is true, for instance, in the case of a copper damascene interconnect process, with the barrier/seed layer process output influencing the output of the copper electrochemical deposition ("ECD") process, or the output of the copper ECD process influences the output of the copper chemical mechanical polishing ("CMP") process. This is also the case in most thin film ECD processes, where the thickness and the thickness uniformity of the seed layer affect the thickness uniformity of the plated film.
The present inventors have recognized the desirability of, in a process having a sequence of steps, automatically adjusting a workpiece processing step to effect its output in response to the output of a prior step or a subsequent step.
The present invention provides an apparatus and method for processing a microelectronic workpiece, using a metrology measurement of a microelectronic characteristic, such as seed layer thickness or uniformity, measured on a microelectronic workpiece, to influence or control the process. The metrology measurement can be taken subsequent to a prior processing step, i.e., a feed forward control, or subsequent to a process being controlled, i.e., a feed back control. The metrology measurement can be taken on each microelectronic workpiece to be processed, or on a first microelectronic workpiece, or a sample microelectronic workpiece, for a batch of microelectronic workpieces. In general, the invention is useful in situations where a process output affects the output of a subsequent process output in a known manner, or in a manner that can be empirically determined.
When a relationship between a first process output and a subsequent, second process output as described above exists, the second process can be modified in a manner determined by the output of the first process, in order to ensure that the output from the second process is as desired (e.g. as uniform and repeatable as possible), regardless of variation in the output of the first process. The desired output could be different than merely trying to produce uniform results, however; for example, it is possible that intentional variation in one parameter (e.g. film thickness) could be introduced in order to compensate for another non-uniformity (e.g. line width) to produce uniform electrical results. Furthermore, a measurement of the output of the first process can be incorporated into the apparatus that performs the second process, and the data from this measurement can be used as an input to a mathematical algorithm that is used to tune the second process.
The apparatus of the invention can include a control that modifies the process parameters of a process in order to compensate for material variations in the incoming microelectronic workpiece, in order to produce a uniform output or desired output from the process. The material variations in the microelectronic workpiece fed to this second process could be due to variability in a prior process step or to the use of different operations or processing chambers to feed the process. The apparatus of the invention can include an in-line metrology measurement system to determine the condition of the incoming microelectronic workpiece material, and a control for altering the process conditions based on the measurement results, i.e., a feed forward control. The metrology system may additionally be used to measure the output of the process as well. Alternately, the metrology system can measure the output of the process and the control can alter the process conditions of subsequently processed microelectronic workpieces, i.e., a feed back control.
According to one exemplary aspect of the invention, metrology integration and ECD seed layer integration are utilized. The metrology integration, either physical or virtual through a network link, allows dynamic control of the process. The ECD seed layer integration allows clustered processing which lowers costs and facilitates "split lot" processing, i.e., differing process recipes, for two or more groups of workpieces within a batch.
The invention can be advantageously configured in a high volume manufacturing configuration or a process development configuration.
According to the high volume configuration, such as for an ECD tool, the tool preserves high volume ECD capability while also adding a "repair or recovery" mode to maintain the finished plating integrity. Under normal operation, the tool may be used with or without periodic verification through in-line metrology.
The metrology system can be used to measure the first workpiece of a lot, or to measure from a specific process location of the prior step (e.g., a given chamber on a seed layer sputtering tool) to verify good incoming quality of seed layers or other parameters. Likewise, the metrology system can feed forward or feed back uniformity and thickness data to drive the process recipe for electroplating reactors.
The metrology system of the invention is particularly useful in the case of reactors having the advantageous ability to manipulate wafer uniformity through process recipe control. The reactors can be adjusted to varied electrochemical processing requirements, such as in response to metrology data, to provide a controlled, substantially uniform diffusion layer and electrical potential at the surface of the microelectronic workpiece that assists in providing a corresponding substantially uniform processing of the microelectronic workpiece surface (e.g., uniform deposition of the electroplated material). Such electrochemical processing techniques can be used in the deposition and/or alteration of blanket metal layers, blanket dielectric layers, patterned metal layers, and patterned dielectric layers.
The process and apparatus can be controlled with increased versatility when using the metrology data. Based upon the output from the metrology unit, the user can decide to stop the subsequent process to resolve the issues driving the prior process. For example, an electroplating process can be stopped when seed layer thicknesses are below acceptable tolerances. Alternately, the user can continue the subsequent processing and adjust the subsequent process steps or process parameter based upon the output from the metrology unit. For example, where seed layer thickness or uniformity is unacceptable, the user can insert an intermediate step and automatically "fix" a seed layer problem with a seed layer enhancement process, such as an electrochemical deposition (ECD) seed layer enhancement process. The user can also continue the processing and automatically adjust the process recipe on ECD reactors to achieve acceptable plating uniformity and thickness. Also, rather than attempt to fix or compensate for a seed layer non-uniformity, a rejected workpiece can be recovered in a non-compliance station, or sent first to a stripping unit to have the nonconforming layer removed and then sent to the non-compliance station. Microelectronic workpieces stored in the non-compliance station can be removed from the apparatus for recovery (reuse).
Furthermore, the apparatus of the invention is easily configured for high volume manufacturing with ECD seed layer enhancement integrated as part of the standard process, irrespective of the presence of seed layer non-uniformity. The number of ECD seed layer chambers can correlate to the throughput requirement. As dual damascene features continue to become more aggressive, the capability of physical vapor deposition ("PVD") to conformably deposit the requisite seed layer in these features becomes limited. The ECD seed layer is a promising approach to extend ECD processes beyond the limits of current PVD technology.
An alternate exemplary embodiment of the tool incorporating the present invention is a process development configuration. This tool design is directed to developing optimized processes. The configuration allows a wide range of flexibility in process sequence and control. For example, a process engineer might want to measure incoming seed layer thickness, ECD seed layer deposition results, ECD fill results, and post annealing results. Since the plating solution reservoirs can be much smaller, the user may also quickly and easily interchange chemistries for rapid and low-cost experimentation. The user may want to run split lots with a wide variety of process combinations to determine feasibility of a production process.
The invention can be applied to a chemical mechanical polishing ("CMP") tool. For example, metrology can be used to adjust the polishing recipe of the CMP tool based on feed forward data on incoming film thickness, or feed back data from a workpiece measured subsequent to the CMP process.
A further alternate embodiment of the invention is an integrated metrology system for a multi-tool apparatus. The apparatus can, for example, include a seed layer tool, an electrochemical deposition tool, and a chemical mechanical polishing tool. At least one metrology unit is utilized which communicates with a control to influence process recipes or process step sequence on one or more of the tools. Each tool can have a dedicated metrology unit to measure incoming material or output results. The metrology results or data can be fed forward or fed back to the respective other tools to control or otherwise influence the process of the other tools.
Numerous other advantages and features of the present invention will become readily apparent from the following detailed description of the invention and the embodiments thereof, from the claims and from the accompanying drawings.
While this invention is susceptible of embodiment in many different forms, there are shown in the drawings and will be described herein in detail, specific embodiments thereof with the understanding that the present disclosure is to be considered as an exemplification of the principles of the invention and is not intended to limit the invention to the specific embodiments illustrated.
Integrated Processing Tool
Although modularity is not necessary to the overall tool function, the tool 10 is shown as having been separated into individual modular components. The exemplary integrated microelectronic workpiece processing tool 10 of
The input/output section 20 includes an opening 80 through which one or more cassettes can be received or removed. Generally stated, cassettes that are received at the input/output section 20 include microelectronic workpieces that are to be processed within the tool 10, while cassettes that are removed from the input/output section 20 include microelectronic workpieces that have already been processed within the tool 10. However, it will be recognized that a processed microelectronic workpiece may be returned directly to the cassette from which it was respectively provided to the tool.
In the embodiment of
After the microelectronic workpieces are processed, the transfer apparatus 50 places the microelectronic workpieces into a cassette, and the cassette containing the processed microelectronic workpieces are removed from the integrated microelectronic workpiece-processing tool 10 via the opening 80 in the input/output section 20.
Metrology Controlled Processing Tool
The linear robot 226 includes a rail 250 (
In one mode of operation, the in-film metrology unit 228 measures a seed layer thickness or uniformity on a workpiece and communicates the data to a controller 270. The controller can be a programmable controller. Based on the data, decisions concerning the process parameters or recipe downstream from the metrology unit are made. The process recipe for one or more downstream units can be modified based on the metrology results. Alternatively, or additionally, the process sequence can be modified according to the metrology results. For example, if the seed layer thickness or uniformity is insufficient, or less than a tolerance value, the microelectronic workpiece can be delivered to one of the seed layer enhancement units 232 before being delivered to one of the electroplating units 240. Alternatively, if the seed layer is defective or has a thickness out of tolerance by an unacceptable amount, such that the seed layer cannot be repaired or enhanced in the seed layer enhancement unit 232, the microelectronic workpiece can be delivered to one of the stripping units 236 wherein the microelectronic workpiece can be etched, including its process side surface and beveled edge, to be thereafter delivered by the manipulator 256 to the non-process station 248. The non-process station can be a non-compliance station, including a cassette 248 a for holding microelectronic workpieces for returning microelectronic workpieces to a seed layer application station, typically a physical vapor deposition (PVD) apparatus external to the described tool 200. After the microelectronic workpiece has been plated according to the process recipe in one of the electroplating units 240, it can be delivered to the in-line anneal unit for annealing, and thereafter delivered to the input/output station 224 for exporting to a next process tool.
High Throughput Embodiment
A high volume or high throughput tool 300 is illustrated in
The metrology unit can be used to measure the first substrate of a lot, or from a specific process location of the prior step (e.g., a given chamber on a seed layer sputtering tool) to verify good incoming quality of seed layers or other parameters. Likewise, the metrology unit can feed forward or feed back uniformity and thickness data to drive the process recipe for the electroplating reactors 240.
The electroplating units 240 are preferably adjustable reactors (described below) or other type reactors that can adapt to varied electrochemical processing requirements while concurrently providing a controlled, substantially uniform diffusion layer and electrical potential at the surface of the microelectronic workpiece that assists in providing a corresponding substantially uniform processing of the microelectronic workpiece surface (e.g., uniform deposition of the electroplated material). The electroplating units 240 can be controlled by the controller 270 (
The tool 300 can be controlled with increased flexibility when using the metrology unit. Based upon an output from the metrology unit 228 derived from the programmable recipe from the metrology unit 228, the user can decide to stop the subsequent microelectronic workpiece processing, such as the electroplating units 240, and resolve the issues driving the prior process, such as a seed layer deposition process. For example, the electroplating process can be stopped where seed layer thicknesses are below acceptable tolerances.
Alternately, the user can continue the subsequent processing and adjust the order of subsequent process steps, or insert a remedial process step, based upon the output from the metrology unit. For example, the user can first transport the wafer to a seed layer enhancement unit 232 to automatically "fix" or adjust a seed layer problem with the ECD seed layer enhancement process and then transport the microelectronic workpiece to an electroplating unit 240.
Rather than changing the order of the process steps or inserting an intermediate step, the user can also continue the processing and automatically adjust the process recipe in the electroplating unit 240, particularly using variable recipe reactors, for enhanced plating uniformity and thickness.
Still further, if a microelectronic workpiece seed layer is too far out of tolerance in thickness or uniformity, the microelectronic workpiece can be transported to one of the stripping units 236 where the microelectronic workpiece processing side is stripped. The microelectronic workpiece can then be transported to the non-compliance station 248, particularly to the cassette 248 a, for recycling.
The tool 300 is also easily configured for high volume manufacturing with ECD seed layer enhancement integrated as part of the standard process, i.e., the number of ECD seed layer enhancement chambers 232 can correlate with the throughput requirement.
The stripping units 236 can also be used to clean copper contamination from the prior PVD seed layer process from the microelectronic workpiece back, edge and bevel to eliminate problems during chemical mechanical polishing (CMP).
The tool 300 can also include a microelectronic workpiece pre-aligner (not shown). The pre-aligner is described in "Semiconductor Processing Apparatus Having Lift And Tilt Mechanism", U.S. Ser. No. 08/991,062 filed Dec. 15, 1997, and is used to rotationally align microelectronic workpieces initially for precise processing. This is particularly important given the fact that the metrology unit can be utilized for measuring precise points in patterned film layers, i.e., accurate positioning of the microelectronic workpiece is important to obtain an accurate reading.
Process Development Embodiment
An alternate exemplary embodiment of the tool incorporating the present invention is a process development configuration tool 400 illustrated in
The tool 400 includes fewer processing stations than the tool 300 shown in
Process Sequences
Subsequent to the step 504 the workpiece is transferred to a pre-align station to be accurately positioned, in step 506. The microelectronic workpiece is then transported to the metrology unit in a step 508 and film thickness and/or other parameters are measured. In a step 510 the workpiece is annealed in a annealing unit. The workpiece is thereafter transported to be pre-aligned in a step 512 for accurate reference position. In a step 514 the workpiece is transported to the metrology unit to have parameters such as post annealing film thicknesses measured. The pre-align unit can be incorporated into the metrology unit which would eliminate the need to transport the workpiece to and from a pre-align unit. The metrology data derived from steps 508 and 514 can be used to feed back control information, for example, to the ECD (step 502) for controlling process recipe for subsequent workpieces.
The metrology measurement taken in step 606 can be used to control the recipe of the downstream ECD reactor (step 608).
The metrology measurements taken in steps 704 and 710 can be used to control the recipe in steps 706 and/or 712 as a feed forward or feed back control.
After the seed layer is applied, the workpiece is transported to a bevel etch rinse and dry station in a step 808. The workpiece is then transported back to the pre-align station to be accurately reference positioned in a step 810. After being accurately positioned the workpiece is transported to the metrology unit for further accurate measurements in step 812. The workpiece is thereupon transported to an ECD unit such as an electroplating reactor, wherein further processing of the workpiece ensues in a step 814. After such processing, the workpiece is transported to the bevel etch, rinse and dry station and processed accordingly in a step 816.
The workpiece is then transported to a pre-align station and accurately positioned in a step 818. After being accurately positioned, the workpiece is returned to the metrology unit and in a step 820 is accurately measured. The workpiece is then transported to an annealing unit in a step 822 and is annealed.
After annealing, in a step 824 the workpiece is transported to a pre-align station and is accurately reference positioned. After being accurately positioned, in a step 826 the workpiece is transported back to the metrology unit and accurately measured. In a step 828, the workpiece is transported to a chemical mechanical polishing unit ("CMP") for further processing.
The metrology steps 804, 812, 820 and/or 826 can be utilized to feed forward or feed back control of process recipes or control step sequences.
It should be noted that in
Multi-Tool Integrated Metrology Systems
The seed layer tool 906 includes a barrier deposition station 920 and a seed layer deposition station 926. The seed layer tool 920 can also include a cleaning station 930 such as is generally known in the art. A metrology unit 932 can be incorporated as part of the seed layer station for in-line metrology monitoring.
The ECD tool 910 can be configured as the tools 200, 300, 400, and includes an ECD station 940, such as an electroplating unit 240. The ECD tool 910 can also include a metrology unit 942 for in-line metrology monitoring.
The chemical mechanical polishing tool 916 can include a chemical mechanical polishing station 950 and an in-line metrology unit 952 for in-line metrology monitoring.
After layers are formed on the microelectronic workpiece, there is a need to planarize the surface of the workpiece. One method of planarizing is chemical mechanical polishing ("CMP"). According to this method, the workpiece is mounted to a carrier or polishing head. The workpiece is placed against a rotating polishing pad. A polishing-slurry, including at least one chemically reactive agent, is supplied to the surface of the pad.
Chemical mechanical polishing must be carefully controlled to polish the workpiece to a desired flatness or thickness to reach the polishing endpoint. Process variations in the initial thickness of the layer to be polished, the slurry composition, the polishing pad condition, the relative speed between the pad and the workpiece, and the pad load on the workpiece, can cause variations in the material removal rate or polishing rate. The polishing time to reach the polishing endpoint is thus a process variable.
A controller 960 can be provided to coordinate the processing of the workpiece as it progresses from the seed layer tool 906 to the ECD tool 910 to the chemical mechanical polishing tool 916. The controller can be a programmable controller. The metrology units 932, 942, 952 can be configured to send measurement data to the controller 960. The controller 960 can control the process recipes or the sequence of process steps on the three tools 906, 910, 916 based on the metrology results from one or more of the metrology units 932, 942, 952.
For example, a metrology result from the metrology unit 932 of the condition of the seed layer applied sequentially by the barrier deposition station 920 and by the seed layer deposition station 926 can be used to control the process recipe in the ECD station 940 and/or the process recipe in the CMP tool 916. In the CMP tool, the polishing time, the rotational speed of the workpiece or pad, the pressure exerted by the pad on the workpiece, and the radial distribution of pad pressure on the workpiece can be process recipe variables which could be controlled or adjusted. If the film to be polished is center thick, the CMP process may be tuned to polish the center faster.
Also as examples, the metrology result from the metrology unit 952 could be used as feedback to control the process recipes on any of the tools 906, 910, 916. The metrology result from the metrology unit 942 could be used as feed back to control the process recipe in the seed layer tool 906 and/or as feed forward to control the process recipe in the chemical mechanical polishing tool 916.
These configurations are exemplary only, and those skilled in the art will recognize a separate metrology station in lieu of units 932, 942 and 952 to effect process parameter control.
Electroplating Units
The electroplating units 240, 940 of the tools 200, 300, 400, 910 each include a plating reactor such as described in "Improved Anode Assembly For Electroplating Apparatus", U.S. Ser. No. 09/112,300 filed Jul. 9, 1998, or an adjustable plating reactor as described in "Workpiece Processor Having Processing Chamber With Improved Processing Fluid Flow", PCT/US00/10210 filed Apr. 13, 2000 or "System For Electrochemically Processing A Workpiece", PCT/US00/10120 filed Apr. 13, 2000, WO 00/14308 Mar. 16, 2000, all herein incorporated by reference. Alternate reactor types are described in WO 00/20663, published Apr. 13, 2000; WO 99/10566, published Mar. 4, 1999; WO 99/54527, published Oct. 28, 1999; WO 99/54920, published Oct. 28, 1999; and WO 99/25904, published May 27, 1999, and are encompassed by the invention.
Preferably, the plating reactor is an adjustable reactor (as referenced above) that includes a processing container for providing a flow of a processing fluid during immersion processing of at least one surface of a microelectronic workpiece. The processing container comprises a principal fluid flow chamber providing a flow of processing fluid to at least one surface of the microelectronic workpiece. The fluid flow inlets are arranged and directed to provide vertical and radial fluid flow components that combine to generate a substantially uniform normal flow component radially across the surface of the microelectronic workpiece.
The reactor comprises a reactor head including a microelectronic workpiece support that has one or more electrical contacts positioned to make electrical contact with the microelectronic workpiece. A plurality of anodes are disposed at different elevations in the principal fluid flow chamber so as to place them at different distances from a microelectronic workpiece under process. One or more of the plurality of anodes may be in close proximity to the microelectronic workpiece under process. Still further, one or more of the plurality of anodes may be a virtual anode. The anodes used in the electroplating reactor can be placed in close proximity to the surface of the microelectronic workpiece to thereby provide substantial control over local electrical field/current density parameters used in the electroplating process. This substantial degree of control over the electrical parameters allows the reactor to be readily adapted to meet a wide range of electroplating requirements (e.g., seed layer thickness, seed layer type, electroplated material, electrolyte bath properties, etc.) without a corresponding change in the reactor hardware. Rather, adaptations can be implemented by altering the electrical parameters used in the electroplating process through, for example, software control of the power provided to the anodes.
Advantage can be taken of this increased control to achieve greater uniformity of the resulting electroplated film. Such control is exercised, for example, by placing the electroplating power provided to the individual anodes under the control of a programmable controller or the like. Adjustments to the electroplating power can thus be made subject to software control based on a metrology-based signal, based on seed layer thickness, for example.
It will be recognized that the particular currents that are to be provided to the anodes depends upon numerous factors including, but not necessarily limited to, the desired thickness and material of the electroplated film, the thickness and material of the initial seed layer, the distances between anodes and the surface of the microelectronic workpiece, electrolyte bath properties, etc.
Although the aforementioned adjustable reactor controls electroplating power to individual anodes, other methods of controlling electroplating film uniformity in response to metrology results are encompassed by the invention including adjusting current density, using current thieves or controlling workpiece rotation and/or fluid flow.
As an alternative to the electroplating reactors, electroless plating reactors (as described below) can be utilized in some applications.
Stripping Units
An example of the stripping unit 236 is described in "Micro-Environment For Processing A Workpiece", PCT/US99/05676 filed March 15, 1999 and/or in "Selective Treatment Of A Microelectronic Workpiece", PCT/US99/05674 filed Mar. 15, 1999 herein incorporated by reference. The "stripping units" are multifunctional processing capsules which can perform cleaning, stripping, bevel etching, rinsing and drying.
An apparatus for processing a microelectronic workpiece in a "micro-environment" is set forth in the aforementioned PCT applications. The apparatus includes a rotor motor and a microelectronic workpiece housing. The microelectronic workpiece housing is connected-to-be-rotated by the rotor motor. The microelectronic workpiece housing further defines a substantially closed processing chamber therein in which one or more processing fluids are distributed across at least one face of the microelectronic workpiece by centripetal accelerations generated during rotation of the housing.
The microelectronic workpiece housing includes an upper chamber member having a fluid inlet opening and a lower chamber member having a fluid inlet opening. The upper chamber member and the lower chamber member are joined to one another to form the substantially closed processing chamber. The processing chamber generally conforms to the shape of the microelectronic workpiece and includes at least one fluid outlet disposed at a peripheral region thereof. At least one microelectronic workpiece support is provided. The support is adapted to support a microelectronic workpiece in the substantially closed processing chamber in a position to allow centripetal acceleration distribution of a fluid supplied through the inlet opening of the upper chamber member across at least an upper face of the microelectronic workpiece when the microelectronic workpiece housing is rotated. The wafer is further positioned by the support to allow centripetal acceleration distribution of a fluid supplied through the inlet opening of the lower chamber member across at least a lower face of the microelectronic workpiece during the rotation. The at least one fluid outlet is positioned to allow extraction of fluid in the processing chamber through the action of centripetal acceleration.
An etchant capable of removing one or more of the thin film layers, such as the seed layer, can be caused to flow over the front side and an outer margin of the back side while the etchant is prevented from flowing over the back side except for the outer margin. Thus, a non-uniform seed layer, for example, can be stripped from the workpiece.
Seed Layer Enhancement Units
An example of the seed layer enhancement unit 232 is described in "Apparatus And Method For Electrolytically Depositing Copper On A Semiconductor Workpiece", PCT/US99/06306, filed Mar. 22, 1999 and herein incorporated by reference. The seed layer enhancement unit 232 can be embodied as an adjustable plating reactor as described in "Workpiece Processor Having Processing Chamber With Improved Processing Fluid Flow", PCT/US00/10210 filed Apr. 13, 2000 or "System For Electrochemically Processing A Workpiece", PCT/US00/10120 filed Apr. 13, 2000 herein incorporated by reference.
In accordance with a specific embodiment of the process, an ultra-thin adhesion layer, formed by physical vapor deposition (PVD), is enhanced by subjecting the semiconductor microelectronic workpiece to an electrochemical copper deposition process in which an alkaline bath having a complexing agent is employed. The copper complexing agent may be at least one complexing agent selected from a group consisting of EDTA, ED, and a polycarboxylic acid such as citric acid or salts thereof. The alkaline electrolytic copper bath is used to enhance the ultra-thin copper adhesion layer which has been deposited on a barrier layer using a deposition process such as PVD. The enhanced copper seed layer provides an excellent conformal copper coating that allows trenches and vias to be subsequently filled with a copper layer having good uniformity using electrochemical deposition techniques.
Alternately, the seed layer enhancement units 232 can be embodied as electroless plating reactors as described below.
Electroless Unit
Another process for depositing a layer (such as copper) onto a microelectronic workpiece is known as "electroless" plating. Unlike an electroplating reactor, electroless plating does not conduct external electrical power to the surface of a microelectronic workpiece. A catalytic material is used to effect plating of the material on the microelectronic workpiece. Electroless plating reactors and corresponding processes are disclosed in WO 00/03072, published Jan. 20, 2000; and U.S. Pat. Nos. 5,500,315; 5,389,496; and 5,139,818, all incorporated herein by reference. Electroless plating can be used instead of electroplating, or can be used as a seed layer enhancement step.
Annealing Units
The annealing units 244 can be as described in "Method And Apparatus For Tuning Multiple Electrodes Used In A Reactor For Electrochemically Processing A Microelectronic Workpiece", U.S. Ser. No. 60/206,663, filed May 24, 2000, or as in "Method And Apparatus For Low Temperature Annealing Of Metallization Micro-Structures In The Production Of A Microelectronic Device", PCT/US99/02504, filed Feb. 2, 1999; or as in "Method And Apparatus For Processing A Microelectronic Workpiece Including An Apparatus And Method For Executing A Processing Step At An Elevated Temperature", U.S. Ser. No. 09/501,002, filed Feb. 9, 2000; herein incorporated by reference. The annealing units 244 can include a thermal reactor that is adapted for rapid thermal processing (RTP).
The microelectronic workpieces are transferred between the processing stations and the annealing units 244 using the transport unit 256 that is disposed for linear movement along the central track.
Metrology Unit
Each of the metrology units 228, 932, 942, 952, 1020, 1036 can be a four-point probe style metrology tool. The metrology units can use sheet resistance or capacitance to determine layer thickness. Alternately, the metrology units can use optical or thermal reference methods. According to an exemplary embodiment, the metrology units use a laser based non-constant metrology system wherein the laser induces an acoustic response in the measured film and the acoustic response is related to film thickness. This is known as impulsive stimulated thermal scattering (ISTS). One such system is manufactured by Philips Analytical under the model name "IMPULSE" or "EMERALD". Another such metrology unit is manufactured by Rudolf Technologies, under the model name "METAPULSE."
Input/Output Station
The input/output station is described in "Apparatus For Processing A Microelectronic Workpiece Including Improved Input/Output Station," attorney docket no. SEM4492P1240, fled on Jul. 7, 2000 or in "Semiconductor Processing Apparatus Having Lift And Tilt Mechanism", PCT/US98/00076 filed Jan. 5, 1998, both herein incorporated by reference. The input/output section includes an opening through which the one or more cassettes are received by a multi-cassette interface. The multi-cassette interface can selectively adjust the alignment of the one or more cassettes with respect to one or more corresponding direct-access assemblies for transfer therebetween. The one or more direct-access assemblies receive the one or more cassettes from the multi-cassette interface and position them to allow direct access to individual microelectronic workpiece positions of the one or more cassettes, including direct access to any microelectronic workpieces disposed at the microelectronic workpiece positions.
Non-Compliance Station
The non-compliance station comprises a cassette for holding multiple microelectronic workpieces. The cassette can be automated, for example to be sent back to the PVD seed layer deposition station for reestablishing a seed layer on the microelectronic workpiece substrates.
Linear Robot System
The linear robot system can be as described in "Semiconductor Processing Apparatus Having Linear Conveyor System", PCT/US98/00132 filed Jan. 6, 1998; or "Semiconductor Processing Apparatus Having Lift And Tilt Mechanism", PCT/US98/00076 filed Jan. 5, 1998; or "Robots For Microelectronic Workpiece Handling", PCT/US99/15567 filed Jul. 9, 1999, all herein incorporated by reference.
Chemical Mechanical Polishing Station
Chemical mechanical polishing tools are disclosed in WO 00/26609, published May 11, 20000, and U.S. Pat. No. 5,738,574, herein incorporated by reference.
From the foregoing, it will be observed that numerous variations and modifications may be effected without departing from the spirit and scope of the invention. It is to be understood that no limitation with respect to the specific apparatus illustrated herein is intended or should be inferred. It is, of course, intended to cover by the appended claims all such modifications as fall within the scope of the claims.
Patent Citations
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text:
Katy Perry roars past Justin Bieber to become most followed person on Twitter
Katy Perry has ended Justin Bieber's reign as the most popular person on Twitter.
The Roar hitmaker's follower count surpassed those of the 20-year-old singer over the weekend and as of Monday Katy had 46,529,048 to Justin's 46,507,582, with both rapidly rising.
This comes just nine months after Justin took over the most-followed title from Lady Gaga, following a two-year stint at the top.
Roaring success: Katy Perry has topped Justin Bieber to become the most followed person on Twitter
Gaga still holds the number three slot, followed by President Barack Obama and Taylor Swift.
However, it has been claimed that both Katy and Justin have a huge number of 'fake followers'.
According to CNBC, StatusPeople, which determines how many of a Twitter user's followers are fake, estimates 41 percent of Justin's followers are not real, while Katy's total is thought to be 52 percent.
Success: Katy's follower count rose rapidly over the weekend allowing the Roar hitmaker to surpass Bieber as the most-followed person on Twitter
While Bieber is a prolific tweeter, Perry has revealed her 'less is more' motto where Twitter is concerned.
'I've learned how to ride social media,' she told USA Today. 'I have horrible typos. I use "there" or "your" wrong grammatically. But I feel like I've learned how to tame that social media dragon.
Short reign: Just nine months after Bieber ousted Lady Gaga from the top spot, Katy took over
'I see a lot of celebrities send out messages like that online, and I think, "Sweetheart, nobody knows about this so-called issue because we don't have you on Google Alert. You're just throwing another log on the fire." I do it only in extreme cases if someone is jeopardising my character.'
However, Katy's manager Martin Kirkup says social media has been a big part of the singer's success.
"@BiebBiebSee: Katy Perry's Twitter Followers Reach 46.5 Million, Dethrones Justin Bieber http://t.co/pDZa13rk7a" half of them are fake— ♡music mondays♡ (@SilverBiebs) November 4, 2013
Katycats rejoy! @katyperry passes @justinbieber as the world's most followed person on Twitter. Killer Queen! http://t.co/JMbrHlual1— Josep Vinaixa (@josepvinaixa) November 3, 2013
katy perry passed up justin bieber as the most popular person on twitter? this isnt okay.— melissa ♡ anne (@melissagotchalk) November 4, 2013
@katyperry has now taken over @justinbieber as the most followed person twitter #QueenOfTwitter and the queen of everything #KatyCats X— HAPPY BIRTHDAY KATY! (@KatyCatStepper) November 4, 2013
'For Katy, who has always been about making connections with fans, the social networks are a huge advantage, he said. 'I often say that Katy was born on the Internet. She's taken the fullest advantage of the wonderful world of greater connectivity.
While Katy's followers were thrilled with the news, Justin's hit out claiming most of her Twitter fans are fake.
Josep Vinaixa wrote: 'Katycats rejoy! @katyperry passes @justinbieber as the world's most followed person on Twitter. Killer Queen!'
Meanwhile SilverBiebs tweeted: '"@BiebBiebSee: Katy Perry's Twitter Followers Reach 46.5 Million, Dethrones Justin Bieber http://jmp.io/Qmu " half of them are fake'
Meanwhile, the duo are good friends with Katy even dressing up as Bieber for Halloween.
Twitter is expected to go public on the New York Stock Exchange on November 7.
Success: One reason for Katy's increase in Twitter users could be her recent promotion of new album Prism
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subset: commoncrawl


text:
Most Popular "Water Shortage" Titles
- Movies or TV
- Genres
- Keywords
- IMDb Rating
- Instant Watch Options
- In Theaters
- On TV
- Release Year
1. 127 Hours (2010)
R | 94 min | Adventure, Biography, Drama
A mountain climber becomes trapped under a boulder while canyoneering alone near Moab, Utah and resorts to desperate measures in order to survive.
Writers: Danny Boyle, Simon Beaufoy, Aron Ralston | Director: Danny Boyle | Stars: James Franco, Amber Tamblyn, Kate Mara, Sean Bott
Votes: 253,358
2. Dune (1984)
PG-13 | 137 min | Action, Adventure, Sci-Fi
A Duke's son leads desert warriors against the galactic emperor and his father's evil nemesis when they assassinate his father and free their desert world from the emperor's rule.
Writers: Frank Herbert, David Lynch | Director: David Lynch | Stars: Kyle MacLachlan, Virginia Madsen, Francesca Annis, Leonardo Cimino
Votes: 91,055
3. Jericho (2006–2008)
TV-14 | 45 min | Action, Drama, Mystery
A small town in Kansas is literally left in the dark after seeing a mushroom cloud over near-by Denver, Colorado. The townspeople struggle to find answers about the blast and solutions on how to survive.
Creators: Stephen Chbosky, Josh Schaer, Jonathan E. Steinberg | Stars: Skeet Ulrich, Lennie James, Ashley Scott, Kenneth Mitchell
Votes: 45,108
4. Rango (2011)
PG | 107 min | Animation, Adventure, Comedy
Rango is an ordinary chameleon who accidentally winds up in the town of Dirt, a lawless outpost in the Wild West in desperate need of a new sheriff.
Writers: John Logan, Gore Verbinski, James Ward Byrkit | Director: Gore Verbinski | Stars: Johnny Depp, Isla Fisher, Timothy Olyphant, Abigail Breslin
Votes: 164,245
5. Young Ones (2014)
R | 100 min | Action, Drama, Sci-Fi
Set in the future when water is hard to find, a teenage boy sets out to protect his family and survive.
Writer: Jake Paltrow | Director: Jake Paltrow | Stars: Nicholas Hoult, Kodi Smit-McPhee, Michael Shannon, Elle Fanning
Votes: 5,286
6. Dune (2000 TV Mini-Series)
Unrated | 265 min | Adventure, Drama, Fantasy
A three-part miniseries on politics, betrayal, lust, greed and the coming of a Messiah. Based on Frank Herbert's classic science fiction novel.
Stars: William Hurt, Alec Newman, Giancarlo Giannini, Uwe Ochsenknecht
Votes: 13,972
7. The Last Days (2013)
100 min | Adventure, Sci-Fi, Thriller
2013. A mysterious epidemic spreads across the planet. Humanity develops an irrational fear of open spaces that causes instant death. Soon, the world population is trapped inside buildings.... See full summary »
Writers: David Pastor, Àlex Pastor | Directors: David Pastor, Àlex Pastor | Stars: Quim Gutiérrez, José Coronado, Marta Etura, Leticia Dolera
Votes: 4,880
8. Solarbabies (1986)
PG-13 | 94 min | Action, Drama, Sci-Fi
In a future in which most water has disappeared from the Earth, we find a group of children, mostly teenagers, who are living at an orphanage, run by the despotic rulers of the new Earth. ... See full summary »
Writers: Walon Green, D.A. Metrov | Director: Alan Johnson | Stars: Richard Jordan, Jami Gertz, Jason Patric, Lukas Haas
Votes: 2,800
9. Even the Rain (2010)
Unrated | 103 min | Drama, History
As a director and his crew shoot a controversial film about Christopher Columbus in Cochabamba, Bolivia, local people rise up against plans to privatize the water supply.
Writer: Paul Laverty | Director: Iciar Bollain | Stars: Gael García Bernal, Luis Tosar, Karra Elejalde, Juan Carlos Aduviri
Votes: 8,841
10. Jean de Florette (1986)
PG | 120 min | Drama
A greedy landowner and his backward nephew conspire to block the only water source for an adjoining property in order to bankrupt the owner and force him to sell.
Writers: Claude Berri, Gérard Brach, Marcel Pagnol | Director: Claude Berri | Stars: Yves Montand, Gérard Depardieu, Daniel Auteuil, Elisabeth Depardieu
Votes: 18,431
11. The Galapagos Affair: Satan Came to Eden (2013)
120 min | Documentary, Biography, Crime
About a series of unsolved disappearances on the Galapagos Island of Floreana in the 1930s.
Writers: Dayna Goldfine, Daniel Geller, Celeste Schaefer Snyder, Dore Strauch, Margret Wittmer, Friedrich Ritter, Hinz Wittmer, John Garth | Directors: Daniel Geller, Dayna Goldfine | Stars: Cate Blanchett, Sebastian Koch, Thomas Kretschmann, Diane Kruger
Votes: 642
12. Chato's Land (1972)
PG | 110 min | Western
After Pardon Chato, a mestizo, kills a US marshal in self-defense, a posse pursues him, but as the white volunteers advance deep in Indian territory they become more prey than hunters, ... See full summary »
Writer: Gerald Wilson | Director: Michael Winner | Stars: Charles Bronson, Jack Palance, James Whitmore, Simon Oakland
Votes: 3,048
13. The Day the Earth Caught Fire (1961)
Unrated | 98 min | Drama, Sci-Fi, Romance
When the USA and Russia test atomic bombs at the same time, it knocks the Earth out its orbit and sends it spiraling toward the Sun.
Writers: Wolf Mankowitz, Val Guest | Director: Val Guest | Stars: Edward Judd, Janet Munro, Leo McKern, Michael Goodliffe
Votes: 3,012
14. Blood Alley (1955)
Approved | 110 min | Action, Adventure
His ship seized by the Chinese Communists, American Merchant Captain Tom Wilder languishes in prison but Chinese villagers help him escape to sail them to Hong-Kong.
Writer: Albert Sidney Fleischman | Directors: William A. Wellman, John Wayne | Stars: John Wayne, Lauren Bacall, Paul Fix, Joy Kim
Votes: 1,917
15. Sleep Dealer (2008)
PG-13 | 90 min | Drama, Romance, Sci-Fi
The near future. Like tomorrow. In a world marked by closed borders, corporate warriors, and a global computer network, three strangers risk their lives to connect, break through the barriers of technology, and unseal their fates.
Writers: Alex Rivera, David Riker | Director: Alex Rivera | Stars: Luis Fernando Peña, Leonor Varela, Jacob Vargas, Metztli Adamina
Votes: 5,508
16. Stay Filthy, Cali (2015– )
2 min | Short, Comedy
Non-traditional PSA web-series in the form of six short raunchy comedic vignettes made to raise awareness of the water shortage in California. In each episode, the narrator (Bruce Campbell) encourages the viewers to stop wasting water.
Stars: Bruce Campbell, Cerina Vincent, Annika Marks, Mike Estes
Votes: 11
17. The Brest Fortress (2010)
138 min | Action, Drama, History
A war drama set during the Nazi invasion of the Soviet Union in June 1941, in which Russian troops held on to a border stronghold for nine days.
Writers: Aleksey Dudarev, Vladimir Eryomin, Ekaterina Tirdatova, Igor Ugolnikov, Konstantin Vorobyov | Director: Aleksandr Kott | Stars: Aleksey Kopashov, Andrey Merzlikin, Pavel Derevyanko, Aleksandr Korshunov
Votes: 5,730
18. Rio 2096: A Story of Love and Fury (2013)
98 min | Animation, Drama, History
Revolves around the love between an immortal hero and Janaína, the woman he has been in love with for 600 years, through Brazil's colonization, slavery, military regime and the future, in 2096, in the midst of wars for water.
Writer: Luiz Bolognesi | Director: Luiz Bolognesi | Stars: Selton Mello, Camila Pitanga, Rodrigo Santoro
Votes: 704
19. Exterminators of the Year 3000 (1983)
R | 103 min | Action, Sci-Fi
They Killed to Survive...
Writers: Elisa Briganti, Dardano Sacchetti, José Truchado | Director: Giuliano Carnimeo | Stars: Robert Iannucci, Alicia Moro, Luciano Pigozzi, Eduardo Fajardo
Votes: 490
20. Absurdistan (2008)
88 min | Comedy
An allegorical comedy centered on two childhood sweethearts who seem destined for one another until the women of their isolated village, angered by male indifference toward the water ... See full summary »
Writers: Zaza Buadze, Veit Helmer, Gordan Mihic | Director: Veit Helmer | Stars: Kristyna Malérová, Max Mauff, Nino Chkheidze, Ivane Ivantbelidze
Votes: 1,360
21. The Wayward Cloud (2005)
112 min | Comedy, Drama, Musical
Hsiao-Kang, now working as a pornographic actor, meets Shiang-chyi once again. Meanwhile, the city of Taipei faces a water shortage that makes the sales of watermelons skyrocket.
Writer: Ming-liang Tsai | Director: Ming-liang Tsai | Stars: Kang-sheng Lee, Shiang-chyi Chen, Yi-Ching Lu, Kuei-Mei Yang
Votes: 3,649
22. New Eden (1994 TV Movie)
R | 89 min | Action, Sci-Fi
Prisoners are dumped on a sand planet dubbed Earth 21-523 where most are immediately killed by the sand people and the remainder struggle for existence. That is until a new prisoner arrives... See full summary »
Writer: Dan Gordon | Director: Alan Metzger | Stars: Stephen Baldwin, Lisa Bonet, Tobin Bell, Michael Bowen
Votes: 280
23. Earth 2100 (2009 TV Movie)
Documentary, Sci-Fi
Follows the account of Lucy, who is born into a society where people are desperate for natural resources, while the global temperature and population are highly increasing.
Writer: Josh Neufeld | Director: Rudy Bednar | Stars: Jameel Ahmad, Janine Benyus, Malcolm Bowman, Reinhard Buetikofer
Votes: 875
24. Haunts of the Very Rich (1972 TV Movie)
75 min | Drama, Thriller
A group of people, all of whom, we can only assume, are very rich, are on a plane flying to an island resort. When they land, they are greeted by a mysterious black man (Seacrist), and the ... See full summary »
Writers: William Wood, T.K. Brown III | Director: Paul Wendkos | Stars: Lloyd Bridges, Cloris Leachman, Edward Asner, Anne Francis
Votes: 204
25. Apache Drums (1951)
Approved | 75 min | Western
A gambler is thrown out of a western town, but returns when the town is suddenly threatened by a band of marauding Apaches.
Writers: David Chandler, Harry Brown | Director: Hugo Fregonese | Stars: Stephen McNally, Coleen Gray, Willard Parker, Arthur Shields
Votes: 354
26. Badlands 2005 (1988 TV Movie)
48 min | Sci-Fi
In 1995 a severe drought forced Americans to flee the West for the cities. Water became more precious than gold. Now in 2005, settlers are coming back, meeting new challenges, and age-old ... See full summary »
Writer: Reuben Leder | Director: George Miller | Stars: Lewis Smith, Miguel Ferrer, Sharon Stone, Caitlin O'Heaney
Votes: 24
27. The Land (1969)
130 min | Drama
A small peasant village's struggles against the careless inroads of the large local landowner, The Land shows why political oppression does not necessarily lead to a sense of solidarity among the disinherited.
Writers: Abderrahman Charkawi, Hassan Fuad | Director: Youssef Chahine | Stars: Hamdy Ahmed, Yehia Chahine, Ezzat El Alaili, Tewfik El Dekn
Votes: 527
28. The Sand Storm (2014)
9 min | Short, Sci-Fi
In a dystopian future, water is running short. A man has taken to smuggling water to keep it in supply.
Writers: Li-Anne Huang, Jason Wishnow | Director: Jason Wishnow | Stars: Weiwei Ai, Hu Jianing, Peter Le, Sophia McKinnon
Votes: 37
29. Pumzi (2009)
21 min | Short, Sci-Fi
A sci-fi film about Africa in the future, 35 years after World War III, the water war.
Writer: Wanuri Kahiu | Director: Wanuri Kahiu | Stars: Chantelle Burger, Freddy Djanabia, Anton David Jeftha, Kudzani Moswela
Votes: 149
30. Back in the Saddle (1941)
Approved | 73 min | Western
After Gene discovers copper on his ranch, Bennett tries to get control of the fortune by framing him in a jail-break.
Writers: Richard Murphy, Jesse Lasky Jr. | Director: Lew Landers | Stars: Gene Autry, Smiley Burnette, Mary Lee, Edward Norris
Votes: 110
31. The Cowboy and the Indians (1949)
Approved | 68 min | Western
Evil Indian Agent Richards is cheating the Indians into starvation. Gene shows that their raids are only for survival.
Writers: Dwight Cummins, Dorothy Yost | Director: John English | Stars: Gene Autry, Champion, Sheila Ryan, Frank Richards
Votes: 93
32. The Skywalk Is Gone (2002)
25 min | Short, Comedy, Drama
A girl (Shiang-chyi Chen) looks for a street vendor in Taipei. But she can't find him since the Skywalk is Gone.
Writer: Ming-liang Tsai | Director: Ming-liang Tsai | Stars: Shiang-chyi Chen, Kang-sheng Lee, Yi-Ching Lu
Votes: 512
33. One Peace at a Time (2009)
83 min | Documentary
Filmed in 20 countries, with the insights of Nobel Laureates: Muhammad Yunus (Nobel Peace Prize), Steve Chu (Nobel Prize Physics and President Obama's Secretary of Energy) & Desmond Tutu (... See full summary »
Writer: Turk Pipkin | Director: Turk Pipkin | Stars: Donna Berber, Philip Berber, Caroline Boudreaux, Steve Chu
Votes: 56
34. Fontána pre Zuzanu 3 (1999)
98 min | Comedy, Romance
A romantic music comedy located in exotic African scenery.
Writer: Dusan Rapos | Director: Dusan Rapos | Stars: Eva Vejmelková, Alessandro Coari, Ibrahim Maiga, Marián Labuda
Votes: 160
35. The Last Drop of Water (1911)
18 min | Short, Western
A wagon train heading west across the great desert runs out of water, and is attacked by Indians. One man -- their last hope -- is sent out to find water.
Writers: Bret Harte, Stanner E.V. Taylor | Director: D.W. Griffith | Stars: Blanche Sweet, Charles West, Robert Harron, Dell Henderson
Votes: 147
36. Puisque nous sommes nés (2008)
90 min | Documentary
One day, in the impoverished Brazil of the Nordeste, a boy told us with a smile, "I don't have anything, all I have is my life." These words had a lasting effect on us. Where do people who ... See full summary »
Directors: Jean-Pierre Duret, Andrea Santana
Votes: 45
37. Chains (III) (2009)
10 min | Short, Sci-Fi
The place is an underground society of approximately two hundred humans calling themselves the rubbish dwellers, whose existence is much more bleak than the golden ones who live above ... See full summary »
Director: Sharon Lewis | Stars: Rachael Crawford, Awaovieyi Agie, Melanie Nicholls-King, Tanya Fraser
Votes: 15
38. When the Last Tree Dies (2013)
27 min | Documentary, Short
A low budget documentary film about the water crisis in the North China Plain. It depicts the devastating consequences of water scarcity exacerbated by pollution. The film follows a group ... See full summary »
Writers: Gelken Chris, Han Ying Shirley | Directors: Zhang Lynn, Han Ying Shirley
Professor Balthazar (1967–1977)
Amadeusove usi
10 min | Animation, Family, Fantasy
Amadeus is able to repair any machine just by listening to it running. With his sensitive hearing he is able to tell three days in advance when the rain is coming. When the city is ... See full summary »
Writers: Zeljan Palcok, Ante Zaninovic | Director: Ante Zaninovic | Stars: Nada Agbaba, Erik Schumann
2 Broke Girls (2011– )
And the Break-Up Scene
TV-14 | Comedy
Caroline thinks she's doing Max a favor when she takes it upon herself to facilitate her break-up with Robbie.
Creators: Michael Patrick King, Whitney Cummings | Director: James Burrows | Stars: Kat Dennings, Beth Behrs, Garrett Morris, Jonathan Kite
Votes: 449
Spartacus: War of the Damned (2010–2013)
Shadow Games
TV-MA | 55 min | Action, Adventure, Biography
In an effort to bring rain to Capua, the Primus (a prestigious competition for the greatest of gladiators) is announced and Batiatus enters his champion Crixus and Spartacus against ... See full summary »
Creator: Steven S. DeKnight | Director: Michael Hurst | Stars: Andy Whitfield, John Hannah, Peter Mensah, Manu Bennett
Votes: 1,688
The Real Ghostbusters (1986–1991)
The Devil in the Deep
TV-Y7 | Animation, Action, Comedy
Writers: Dan Aykroyd, J.M. DeMatteis, Harold Ramis | Stars: Arsenio Hall, Maurice LaMarche, Lorenzo Music, Laura Summer
Votes: 14
Under the Dome (2013– )
The Endless Thirst
TV-14 | Drama, Mystery, Sci-Fi
After Julia and Dodee speculate that the source of the radio signal jam could be the answer to the dome's origin, they are led to Joe and Norrie. Meanwhile, Angie seeks help after escaping from Junior.
Creator: Brian K. Vaughan | Director: Kari Skogland | Stars: Mike Vogel, Rachelle Lefevre, Natalie Martinez, Britt Robertson
Votes: 957
Space Patrol (1950–1955)
The Wild Men of Procyon
Sci-Fi, Action, Adventure
Commander Corry and his crew investigate a mysterious burst of radiation from outside the Solar System. They trace the source to the surface of a planet whose once great civilization has ... See full summary »
Creator: Mike Moser | Director: Dick Darley | Stars: Ed Kemmer, Lyn Osborn, Ken Mayer, Virginia Hewitt
The A-Team (1983–1987)
Water, Water Everywhere
TV-PG | 49 min | Action, Adventure, Crime
Three Vietnam vets settle in a small desert town and hope to eke out a living with a small hotel they're refurbishing. Unfortunately, a wealthy rancher named Frank Gaines will stop at ... See full summary »
Creators: Frank Lupo, Stephen J. Cannell | Director: Arnold Laven | Stars: George Peppard, Dirk Benedict, Melinda Culea, Dwight Schultz
Votes: 102


text:
CWind, a provider of integrated services to the wind industry, announced today that it is providing corrosion protection services to Ballast Nedam at Butendiek Offshore Wind Farm (OWF).
PPG Industries' protective and marine coatings (PMC) business announced that four individual coatings and primers and two combined coating-and-primer systems
The antifouling biocide Selektope has been approved by the EU Standing Committee on Biocidal Products for EU-wide use from the 1st of January 2016
On the 8th of July,
The U.S. Coast Guard was investigating a large oil sheen off the California coast west of Santa Barbara on Wednesday, a spokeswoman for the agency said.
The slick,
U.S. Coast Guard and firefighter crews helped rescue four people from a boat fire Tuesday afternoon in Alameda, Calif.
Coast Guard Sector San Francisco Command
Philippine generals on Wednesday asked Congress to almost triple annual defence spending over the next five years to upgrade equipment amid an escalating marine dispute with giant neighbour China.


text:
Spinach-Artichoke Pizza
This creamy French bread pizza with fresh spinach, cream cheese, and artichoke is a weeknight dinner dream.
Total Time:
Level: Easy
Yield: 4 main-dish servings
Serves: 4
Advertisement - Continue Reading Below
- 1 loaf soft French or Italian bread
- 2 tbsp. olive oil
- 1.25 c. shredded part-skim mozzarella cheese
- 1 package frozen chopped spinach
- 8 oz. reduced-fat cream cheese (Neufchâtel)
- 0.33 c. fat-free Greek yogurt
- 0.33 c. Grated Parmesan cheese
- 2 clove garlic
- 1 package frozen artichokes
- 1 lemon
- snipped chives
- Preheat oven to 400 degrees F. Cut bread in half lengthwise, then cut each piece in half across. With hands, press bread to flatten. Line large cookie sheet with foil.
- Arrange bread, cut sides up, on prepared pan. Brush with oil and sprinkle with 1 cup mozzarella. Bake 5 to 7 minutes or until cheese melts.
- In large bowl, stir together spinach, cream cheese, yogurt, Parmesan, garlic, and 1/4 teaspoon each salt and pepper until combined. Divide mixture among pieces of bread, spreading evenly. Top with artichokes and remaining 1/4 cup mozzarella. Bake 12 to 18 minutes or until golden brown.
- Grate peel of half of lemon over pizzas. Garnish with chives.
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Indian RAIL PNR Status
Vrinda TechApps India Pvt Ltd
- January 10, 2015
( 226)
RAIL PNR Status app is an useful app to get the PNR information of railway tickets booked with Indian Rail.The one-stop application for Indian Railways train travellers. It is very fast and smooth and has many features like PNR status & PNR train running status.
It has the following features:
It has the following features:
- Check PNR status of your Indian Railways train ticket
- PNR Train running status.
Working superbbbbb
Invalid message! Any PNR i enter, it says please enter a valid PNR! Waste of time
super ui... fast n very neat result
Bakbasss Don't install this many time I have tried to know the pnr status but all the time it's shows that this is invalid pnr . Even this is not able to find out pnr .. So do not install
Good Simple n nice
No train class It displays only some information
What's New
1) Train Class have been included
2) Google Adds .
For any more Issues with app, please mail us at email@example.com
Indian Railways Train PNR Status, Tatkal Tickets and IRCTC Rail info for free


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Monday Morning JETLawg
On August 16, 2010 By JETLaw January 26, 2014
U.S. Patent and Trademark Office rejects Jersey Shore star Snooki's application to trademark her nickname.
Screen Actors Guild reaches tentative settlement of the class action lawsuit accusing it of withholding millions of dollars of overseas distribution revenues from members.
Allbritton Communications seeks to throw up roadblock to [...]Continue Reading →
Screen Actors Guild Requests Federal Mediation in Dispute with Alliance of Motion Picture and Television Producers
On October 22, 2008 By JETLaw October 22, 2008
It's been almost four months since the Screen Actors Guild's (SAG) TV/Theatrical contract with the Alliance of Motion Picture and Television Producers (AMPTP) expired. Despite forty-four days of negotiating, the two organizations have been unable to reach a new agreement. Talks between the organizations halted June 30, 2008, when Hollywood studios [...]Continue Reading →
Has AFTRA Saved Hollywood? Avoiding Another Strike
On June 2, 2008 By JETLaw June 2, 2008
It was a long, cold, and boring winter. November 5, 2007 marked the beginning of the 100 day Writers Guild of America Strike that crippled television and movie production for most of 2007 and 2008. No new episodes of beloved television shows aired for months – if at all – and the 2008 [...]Continue Reading →
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Does anyone know how to set up a direct debit for VAT on the HMRC portal? I seem to remember it offered you the option when you went to complete a VAT return, but now I cannot see it.
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Hi I am relatively new here.
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Has anyone else today started to notice P6 changes in coding as a result of P11D submissions, which include a van benefit when none were advised to HMRC?
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The right of UK sports clubs not to charge VAT on fees for non-members will have to be decided by the European Court of Justice following a referral from a upper tier tax tribunal.
Dear all
A taxpayer who incorrectly claimed tax relief in his tax return has overturned a £14,000 penalty after a tribunal ruled his accountant was to blame for the careless error.
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Everything We Know About The iPhone 6 (AAPL)
Published 6:19 pm, Tuesday, February 18, 2014
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In the past few weeks, we've gotten a seriously healthy dose of new iPhone gossip.
We're going to dig into all of it here.
The iPhone 6 is still many months away from release, but that doesn't mean it's too early to start thinking about it.
The next iPhone will be a break from the look of the iPhone 5/5S.
This is supposedly what the next iPhone will look like.
It's not clear from that photo, but the next iPhone will have a bigger screen. Right now, people are saying it will be a 4.7-inch screen. The current iPhone has a 4-inch screen.
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Florida Grand Opera Distracts Shoppers From IKEA Weekend Hell (Video)
Have you been to IKEA on a weekend? If so, you know about the crushing crowds, the slow march through winding pathways until you find the perfect piece of build-it-yourself furniture for your crappy apartment, and the crushing defeat of making it all the way to the warehouse only to discover the thing you want is out of stock until 2014.
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IT Expert, Web developer, Linux Sysadmin
Algeria - Last active: 1 month ago - Tests: 5 - Portfolio: 13
Holding an Engineering Degree in Control & Automation, with 7+ years experience in the IT field, I am routinely dealing with web projects and embedded systems development. Specialized in Linux/Unix environments, committed to high-standards and a sense of responsibility, I will be happy to collaborate in web-services projects and server administration jobs.
Support Analyst
Brazil - Last active: 16 days ago - Tests: 4
Over the 8 years, I have experience in support to the user for the hardware and software: - Installation, configuration of sharings of nets, print servers, roteadores, switches and wireless; - Installation, configuration and maintenance in computers with Windows or Linux; - Installation, configuration and maintenance in printers with and without net; - Knowledge in net administration and protocols of communication; - Solid knowledge in the operational platform Windows Server and Linux server. I also have experiente in pentesting and and audit of web application security: SQL Injection, XSS, Session Hijacking, and others.
Web Application Developer
Australia - Last active: 08/20/2014 - Tests: 2 - Portfolio: 2
Been a web application developer since 2005, I have been involved in developing a workflow management application for a claims management company. The application was used to manage loss claims for a major insurance company. I have also been involved in developing codeigniter CLI applications which are used to process emails with attachments. One of my key strengths been able to analyze a problem and provide the effective solutions.
Scrum Product Owner, Solution Architecture & Lean Process Improvement
Egypt - Last active: 23 hours ago - Tests: 9 - Portfolio: 9
19+ years of proven experience in both IT solutions project and product management. Including: 5+ years as Agile Scrum Product Owner. Focus on building IT systems solutions to improve business efficiency and productivity, working closely with the client to examine existing business models. processes and flows of data, discussing the opportunities for improvements with the client, and designing the suitable software solution that satisfy the business needs. Ability to use both Agile or Waterfall methodologies for managing Software Development Cycle with a wide variety of tools. Extensive experience in managing software development cycle ( + 85 Projects) for SaaS, web, mobile, and desktop devices in various Business sectors with proven Leadership skills and motivating teams to achieve projects and business objectives. Equipped with Lean Six Sigma Black Belt Professional certificate with extensive experience in business process modeling , documentation ,assessment, reengineering/ improvement, and automation . I believe that may strengths are customer focus ,achieving open communications, maintaining positive relationships, converting conflict and challenge into success, facilitating consensus and commitment, ensuring accountability, promoting progress and feedback, and expanding and adapting agile techniques for maximum effectiveness – all of the above while working with culturally diverse teams, since it is my believe that diversity is a strength. I am a modeler of business processes using the process/workflow software to create process models which can be simulated, analyzed, and even executed directly by the business,helping the business executives in decision making by modeling/simulating "what-if" scenarios. I am usually perform the following on any traditional software development project: 1. Scope the system. Work with key project stakeholders and business people to formulate and communicate the business vision for the project, map out initial requirements and the scope of the project. 2. Interpret business Processes and needs. work with project stakeholders to translate their requirements into something that developers can understand as well as to translate the resulting questions that the developers have into something the stakeholders can understand. 3. Translate technical issues. Breaking down technical and architectural complexities so that project stakeholders can easily understand any issues that crop up. Explain what the developers are doing and why they need to do it, including explanations. 4. Spell out the project details and requirements. work with project stakeholders to identify, model and then document their requirements and business domain details. 5. Test and validation. Work with project stakeholders to validate their requirements and analysis models via techniques such as reviews, walkthroughs and play acting,writing user acceptance test (UAT) cases and be a liaison between project stakeholders and testing team during UAT. 6. Represent project stakeholders throughout the process. the developers treat the BSA as the 'customer' from which requirements, domain information and business priorities are provided. The BSA, in turn, will work with the stakeholders to obtain information and to verify decisions. My responsibilities are to: 1- Identify and model process requirements using Visio , Itp-commerce and I grafx tools 2- Identify and model data requirements 3- Identify business rules requirements ; and test requirements which includes many levels of testing. 4- Manage requirements 5- Help scope the project 6- Write use cases 7- Improve business processes 8- Design screens (or prototypes) 9-Write system technical specifications 10- Determine benefit/cost 11- Lead and manage projects Skills and Competencies · Strong writing skills · Strong logical and analytical skills · Excellent oral and written communication skills · Proficient skills in process and project management Using Agile and Scrum Methodologies · Practical knowledge of Scrum ,Six Sigma, Lean or other process improvement methodologies · Proficient System Analysis and Critical thinking skills · Strong knowledge of industry best practices · Proficient PC skills · MicroSoft Word .Excel, PowerPoint & MicroSoft Project · Database applications like Access, SQL · Strong knowledge of Screen Mockups like Balsamiq, Visio, Smartdraw · Excellent customer service skills · Strong presentation skills Please Review also My LinkedIn Profile :http://eg.linkedin.com/pub/sally-william/22/b84/9bb
VoIP Engineer
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I have 8 years of experience with VoIP. Troubleshooting of networks, VoIP networks and unix servers. SIP, MGCP, Linux Asterisk Opensips Vicidial goautodial Call centers setup VPS
PHP | JQuery | Wordpress | HTML | CSS | C# | ASP.NET | SQL
Czech Republic - Last active: 23 hours ago - Tests: 5 - Portfolio: 5
Over the last 15 years, I have designed and developed many turn-key solutions for small businesses using: - C#/ASP.NET and Microsoft SQL as a data warehouse - PHP/HTML/CSS/JS/jQuery and MySQL as a data storage I have huge experience with Wordpress CMS based development, third-party<->Wordpress integration, theme and plugin development skills. I have a lot of experience with different API and Services development and integration: - Web-Services (SOAP, XML, REST, JSON) - Payment Processors and billing solutions integration using PayPal API, Balanced Payments API - Map Interactions (Google Map API, Open Street Map API) - Web Data Extraction (Web Scraping) and Manipulation In addition, I have strong experience with database design and database programming for Microsoft SQL Server and MySQL databases. My core competency also lies in complete project management of a new development project, and I am seeking opportunities to create the software from the ground up for you or your business.
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Expert in Quality Analysis
India - Last active: 6 days ago - Tests: 4 - Portfolio: 10
I am a senior QA with 6+ years of industry experience and am ready to participate in the development of your website and/or app in giving Quality Assurance to make them bug free and glitch. I have a big experience in automation testing using different solutions, practices and Selenium programming. I've performed the development process streamlining, requirements creation, managing of human resource, test documentation development, etc I am experienced in Functional testing, Integration testing, Automation testing, System testing, Regression testing, User Acceptance, Black box testing, UI testing, browser compatibility testing, Performance testing in different stages of SDLC. My areas of expertise are: - Onsite/offshore team co-ordination, client interaction, testing and defect tracking. - Designing and developing test plan, Test scenarios, Test cases and Defect tracking. - Analysis of software documentation from business, technical and functional Requirement. - SVN and GIT for subversion, Mantis as errors and bug tracking tool. - W3C validation to optimize and increase the visibility of web portals. - Sound knowledge of Software Development Life Cycle (SDLC). - QA Methodology and Validations to ensure the Quality Assurance Control - Strong SQL knowledge for test data verification. - Creating, updating and executing the scripts and tracking the defects, Logging the defects and reporting the defect (bug). I am a good team player with excellent time management skills having profound insight to determine priorities, schedule work and management of testing team. I am an ambitious and confident self-starter with strong communication, trouble-shooting, presentation and planning and execution skills for web application development projects. Feel free to contact me.
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India - Last active: 20 days ago - Tests: 1
Professional Summary BMC Remedy relevant work experience of 8.9 Years in Development, Integrations with other applications, configurations and Customization of ITSM suite of applications. Best experience in transformation Projects; I do requirement gathering, Implementation of new requirements, testing and providing ITSM Training to User. ITIL Foundation Version3 certified from APM Group in Sep 2010. Have got best hands-on/knowledge in configuring foundation data, asset management, approval engine, SLM targets etc. (using data management tool, AR Import & AIE) Good skills in administrating BMC ITSM Suite version 8.1 and version 7.6.03, AR Server & MidTier on Linux and Windows servers. Integrated ITSM with in-house and Third party applications using remedy Web Services. Have done ITSM Installation of both version 8.1 patch 02 and 7.6.03, Midtier 8.1 and required database configuration; By solving all installation issues Exposure to Network Fault Management system. Had undergone corporate training on Tivoli Netcool Omnibus and have good understanding on Impact and Webtop functionalities. Involved in design, workflow and implementation of Trouble Ticketing Management by integrating Netcool and Remedy applications with Gateway. Ability to support and enhance Netcool Automations and Controls by providing valid inputs for enrichment/correlation polices. Got hands on Netcool Webtop end user administration. Actively Involved in GNOC ISO 27K certification procedure. Defined and implemented control and security mechanisms for GNOC OSS environment like Access controls, Incident, change and Asset management. Have got authorized training on Citrix XenApp V6.5 and ability to support GNOC OSS Citrix platform. I have learnt the concepts of BMC Atrium Discovery and Dependency Mapping (ADDM); BMC SRM & Work order Management. Have got hands on business objects server and developing crystal reports and building typical SQL views/queries on remedy tables.
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India - Last active: 2 days ago - Tests: 2 - Portfolio: 2
Software Developer & Programmer, Project Manager, Blogger, Content Writer, Technical Writer and can provide you all kind of services as per your requirement.
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Malware Removal, Virus removal, Website Hack Fix, Joomla, Wordpress
Pakistan - Last active: 23 hours ago - Tests: 4 - Portfolio: 8
I am experienced in Malware Removal, Enhancing Security and doing hosting transfers for Wordpress, Joomla, and other websites. My work is fast and accurate and I give main importance to communication - I'm always available online (Skype, or e-mail) and I'll do my best to keep my clients updated during (and even after!) our collaboration.
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Tom Sawyer's fool-frowning photo of Genie's House and Bother Genie
After you walk through Genie's house, you'll dicover his Secret Silo in the back yard. There you can see Genie as he is taping a scene from his first film, "Paddlewheeler Willie". Be sure to keep it magical!
Don't click Pirate Mode
© copyright 2011–2015
A Pants Aflame production


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The Whispering Pines
Wednesday, July 29, 2015
Tuesday, July 28, 2015
Soups Stews And Chili - Creamy Spinach Soup
Spinach and half-and-half make the best soup! This is a very delicious cream of spinach soup that can be served with a few croutons on top.
Monday, July 27, 2015
Fruits And Vegetables - Strawberry And Mandarin Salad
Sunday, July 26, 2015
Grand Media Room
Saturday, July 25, 2015
Salad - Creamy Italian Dressing Ii
Friday, July 24, 2015
Seafood - Smoky Cod And Parsnip Chowder
Thursday, July 23, 2015
Seafood - Slashed Sea Bass With Red Onions Mushrooms And New Potatoes
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