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[Cosima Marriner, Elisabeth Sexton and Mark Coultan] Property developers are becoming a more important source of funding for political parties as big companies stop donating. more
[Paul McGeough, Chief Herald Correspondent, in Baghdad] Amar Ahmed Mohammed had the mind of a four-year-old. But insurgents strapped explosives to his chest and blew him up. more
[Anne Davies, State Political Editor] Joe Tripodi's elevation to Minister for Housing and his contentious past have exposed a new flank in the NSW Government. more
[Cynthia Banham and agencies] A US court decision that declared the Guantanamo Bay military commissions unconstitutional has intensified calls for the Australian Government to demand David Hicks get a fair trial or be brought home. more
John Howard flies into Indonesia's most politically sensitive province today, confident that Australia's response to Aceh's earthquake and tsunami catastrophe have bridged a five-year rift over his intervention in East Timor. more
[Linda Morris, Stephanie Peatling and Connie Levett] The nation's religious leaders have stepped back from pushing for an outright ban on abortion, opting to call for an end to late-term terminations. more
[Anne Lampe] Nicholas Whitlam agreed to resign from the NRMA in return for "the maximum retirement benefit which the law permitted", a court has heard. more
[Graeme Philipson] It has been a difficult few years for Australia's university IT faculties, but as the 2000 tech wreck's IT winter shows the first signs of thaw, educators feel optimistic about the future. more
The latest how-to book on modern dating takes its cues from a far more modest era. more
[Chloe Saltau] Australian selectors are considering leaving Matthew Hayden behind while the one-day side is in New Zealand later this month. more
[John Huxley] The Premier, Bob Carr, has successfully kicked off a minor Middle East peace initiative by announcing a grand match between Australia and Iraq. more
Help is on the way for worried parents as researchers examine what it takes to raise a happy and healthy child. more
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IT support staff know far more about you and your computer habits than you realise, Radar reports. more
In the fuss over uni fees, a better deal on HECS has been overlooked, writes Ross Gittins. more
A newspaper in India says hundreds of women have gathered at a fair to have ghosts beaten out of them with a broom. more
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Far from being bland and boring, the national capital has aged gracefully to become a great modern city, writes Frank Moorhouse. more
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Talks continue in 'cone of silence'
WASHINGTON -- NFL Commissioner Roger Goodell, union executive director DeMaurice Smith and members of their negotiating teams participated in a second consecutive six-hour session with a federal mediator Saturday, trying to spur progress before the league's labor deal expires on March 3.
They're finally talking to each other -- but they're not revealing how well it's going.
"I have nothing to say, obviously," Jeffrey Kessler, a lawyer for the NFL Players Association, said on his way out of the meeting. "We're in a cone of silence."
For the second day in a row, the two sides convened at the office of George Cohen, director of the Federal Mediation and Conciliation Service, a U.S. government agency. They met with Cohen for the first time Friday after agreeing to the mediation, which is not binding but is meant as a way to initiate progress in the slow and sometimes contentious bargaining.
The plan calls for several days of negotiations with Cohen, who asked participants to not make any public comments on the process.
Report says Bears great died of self-inflicted gunshot: The Chicago Tribune is reporting former Bears safety Dave Duerson died of a self-inflicted gunshot wound to the chest, and the co-director of a medical school program tells The Associated Press his family has agreed to donate his brain for research.
The Tribune reported on its website that Duerson's death has been ruled a suicide. His body was found Thursday in Sunny Isles Beach, Fla. A Miami-Dade police supervisor said the department had no information regarding the cause of Duerson's death.
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subset: commoncrawl


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Corporate social responsibility and organizational identity in post-crisis economy
Today, building up organizational identity in post-crisis economy becomes a bet, as we are looking for new interpretative coordinates. First of all, we have to take into account the ability to communicate. Second in line, as an extension of the above mentioned ability, we have to highlight the corporate social responsibility (CSR). Nowadays, the road map of modern business environment can be identified only by a new philosophy of business administration. This is the result of try and error and/or success of companies, greater or smaller companies, about their ability to develop a dialogue with their own audience and corporate communities. This dialogue involves approaching the role of the social corporate responsibility (CSR), to create the fundamentals of public policies of modern organizations. Therefore, the new corporate identity, which is the object of our study, we believe it to be the result of the intensive development of corporate communication and the responsible approach of companies to the global issues of the world.
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Volume (Year): XVIII(2013) (2013)
Issue (Month): 1(578) (January)
Pages: 113-120
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Category: Atticus Finch
By Linda Rosenkrantz
It always strikes me as somewhat curious when a name that has been hidden in plain sight for decades—or longer—attached to a significant literary or real life character will suddenly pop into the zeitgeist and take off. Sometimes the contributing factors are obvious—sharing with a more recent celebrity (looking at you, Ms Johansson) or its discovery by the parents of a starbaby. And sometimes, it just remains a mystery.
Some prominent examples:
Atticus. The Harper Lee novel To Kill a Mockingbird was published in 1960, and the movie, starring Gregory Peck as principled lawyer and role-model dad Atticus Finch, was released two years later. Between then and now, the book has been a mainstay of English class curricula, working its way into the collective consciousness of future baby namers, while Atticus Finch was voted the greatest hero of American film by the AFI.
As the fiftieth anniversary of To Kill a Mockingbird is being celebrated, the thought comes to mind that it sometimes can take decades for an iconic fictional character –usually one imprinted on our minds from a classic read during our formative adolescent years—to take off as a baby name.
A prime example of this is Atticus, as in Atticus Finch, that noble lawyer/father Atticus Finch in Harper Lee's novel, which appeared in print in 1960 and on screen in 1962, and yet didn't make it onto the Social Security baby name list until 2004. The same is true of Holden: J.D. Salinger's Holden Caulfield appeared in The Catcher in the Rye in 1951, but not on the pop charts until 1987. Scarlett O'Hara (GWTW book 1936, movie 1939) didn't hit the top half of the list until 2004—when it combined with the Johanssen factor. And if we want to go back even further, it took Huckleberry well over a century to suddenly be used by a couple of celebs.
Below are some literary names from 20th century American novels and plays, a few of which, like Daisy, Owen and Ethan, have already made their comebacks, others which conceivably could, plus a few that are probably too eccentric to be condsidered.
As always there's the caveat that not all these characters were particularly likable or noble namesakes. Some American literary names to consider, for both boys and girls, include:
ALABAMA –Zelda Fitzgerald, Save Me the Waltz
ÁNTONIA — Willa Cather, My Ántonia
AURORA — Larry McMurtry, Terms of Endearment
BLANCHE — Tennessee Williams, A Streetcar Named Desire
BONANZA– Tom Robbins, Even Cowgirls Get the Blues
BRETT — Ernest Hemingway, The Sun Also Rises
CLARICE — Thomas Harris, The Silence of the Lambs
CLYTEMNESTRA (CLYTIE) — William Faulkner, Absalom, Absalom!
DAISY– F. Scott Fitzgerald, The Great Gatsby
DENVER — Toni Morrison, Beloved
DOMINIQUE — Ayn Rand, The Fountainhead
ESMÉ – J D Salinger, "For Esmé—With Love and Squalor"
EULALIA — William Faulkner, Absalom, Absalom!
FRANCESCA — Robert James Waller, The Bridges of Madison County
INDIA – Evan S. Connell, Mrs. Bridge
ISADORA — Erica Jong, Fear of Flying
We've looked at some of the trends in movie character names of Hollywood's Golden Age – the widespread use of nickname names and boys' names for girls and place names. Now, here are some of the more unusual character names (and the sometimes surprising actors who portrayed them) thought up by the screenwriters—or novelists or playwrights who originally created them) of that era , as well as some that haven't been heard of for some time and might be worth reviving.
Get ready for a looooong list, even though we haven't included the iconic Rhetts and Ricks:
On the eve of the Academy Awards, one of our favorite bloggers, Abby Sandel, creator of the always informative appellationmountain.net, has searched through the annals of Oscar history and come up with some great lists of award-worthy male winners' names.
Many of today's most popular names conjure up Hollywood at its most glamorous, especially for girls. I've met plenty of toddlers named Audrey, Ava and Natalie. But ever since Kevin Nealon called his son Gable–as in Clark–I've been wondering about screen legend names for boys.
Here's a short list culled from Best Actor and Best Supporting Actor nominees and winners, and the characters they played, from the 1920s through today.
Some of these are household names, while others are more obscure. A few have surprising roots–Denzel, for example, can be found in use in Medieval England. But all share a certain dashing quality.


text:
Beautiful Beads
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Bangle Bracelet
By: Bead Studio
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Choose your own beads and design a funky Bangle Bracelet. Free bracelet patterns don't have to require a ton of time and effort. In fact, this is a fun and easy project that's perfect for beginners. You only need a few beads and some wire to get started, so you won't break the bank when you're working on this project. Chose contrasting beads to make the colors stick out - this will help you get noticed. Be sure to make a pretty bracelet for yourself and give another to a friend. This is a meaningful and inexpensive gift idea that can be worn all season long.
- Coiling Gizmo
- Wire Cutter
- Round Nose Pliers
- Chain Nose Pliers
- Steel Black and Hammer
- 1 foot 14g Wire
- Assorted beads with hole size that fits 14g wire
- 5 foot 22g soft wire
- Set up the coiling gizmo according to the instructions included in the box.
- Use the small mandrel and anchor the 22g wire to the loop on the handle.
- Win the entire length of the 22g wire into a tight coil.
- Remove coil from Mandrel and trim ends; set aside.
- Cut an 8 inch piece of 14g wire and slide the focal beads to the center of the 14g wire.
- Cut a piece of the coil for each side of the beads, leaving about 1" of wire on each side.
- Gentely form the wire into a circular form. Use the round nose pliers to create a large loop on each end, hammer for strength, and set aside to make clasp.
Making the Clasp:
- Use the remaining 4" piece of 14g wire and hammer both ends flat --- just the ends, about ½".
- Form a small loop with the tip of the round nose pliers. Then with the fullest part of the pilers, make a hook.
- With the other end of the wire create a spiral until you have about 1½" from the bottom of the hook to the end of the coil.
- Use the deep end of the chain nose pliers and place on wire next to the spiral, push the hook towards the spiral making sure the hook is facing out not in.
- Hammer the clasp hook and triangle to strengthen. Gently open loop on one side of the bracelet and attach the triangle end of clasp.
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emmalouisepoyser12 34567 3910876
Feb 12, 2013
Jazzimay - You can but one from jewellerymaker.co.uk
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Aug 23, 2010
Where does one find a coiling gizmo?
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Jun 07, 2010
Wow, very nice piece. I sooo like it :D
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Member 6567267
Mar 02, 2010
This bracelet is awesome - I must try making it!
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Gmail for Android has been updated to include support for label-specific ringtone, priority mail sync, download attachments, and more.Read More
Developers are up in arms about a glitch in the Android Market has led to several devs losing up to 80% of their revenue.Read More
Facebook for Android has been updated to version 1.6.1. The latest update improves Pages support, besides fixing several bugs.Read More
Google is blocking rooted devices from running the recently launched Android movie rentals; however, a work around has already been found.Read More
Opera Mobile 11.1 and Opera Mini 6.1 introduces auto-suggest (Google Suggest) and auto-complete (auto-complete).Read More
Facebook for Android 1.6 introduces video uploads, enhanced news stream, and support for Facebook Pages.Read More
Cut the Rope, the bestselling game for iPhone, iPad and iPod from Zeptolab, is now available for Android.Read More
Hulu Plus is now availabe for Android devices. Hulu Plus users can watch TV shows on Android now. However, Hulu Plus only supports certain devices including Nexus One, Nexus S, HTC Inspire 4G, Motorola Droid II, Motorola Droid X, and the Motorola Atrix with support for other devices coming out soon.Read More
Leaked picture of new dual core Android handset from Sony Ericsson.Read More
Sony Ericsson Xperia X10 might receive multi-touch, 16 million colors, new kernel, and an unlocked bootloader with the upcoming Gingerbread update.Read More
Facebook is working on its own HTML5 powered mobile app store, codenamed project spartan, which will initially target the iPhone and the iPad.Read More
Rumored specs of Google Nexus 4G, the successor to Google Nexus S.Read More
The official iPhone app of the blockbuster movie Super 8 from J.J. Abrams is a must have.Read More
The proliferation of games that are exclusive to certain hardware might turn out to be the bane of the Android ecosystem.Read More
A quick look at the new features in Opera Mini 6 for iPhone and iPad, which is now available for download from the App Store.Read More


text:
Lyons Pool
Directions to Lyons Pool
Know Before You Go
Lyons Pool Recreation Center
On Friday, July 3, this Recreation Center is open 9:00 a.m. - 5:00 p.m. On Saturday, July 4, this Recreation Center is closed. We hope you enjoy the holiday!
Anticipated Completion: 07/04/2015
Lyons Pool Weather
Know when to go:
View upcoming athletic area usage in
Lyons Pool


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Free 208x208 Mobile Games
208x208 Mobile Games. Download Mobile Games for free to your Nokia and any Java mobile phone, select an item below and download the jar or jad file. Why not share your Java games & applications with Mobiles24 users? Click here to upload your apps to Mobiles24
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text:
ModSecurity is a web application firewall for Apache, IIS ang Nginx. It provides logging, monitoring and filtering features.
141 views
Which OWASP modsecurity crs version to install on apache 2.2.22
Hello I am considering installing owasp mod_security crs on an ubuntu 12.04.4 which comes with apache 2.2.22. On the github page I have seen many version's but all tutorials were using 2.2.7 First I ...


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The Road to "42nd Street:" What goes on behind the curtain? Go backstage on "42nd Street!"
Where did those tap shoes go? Lost props. Floating feathers. Rolling canes. Wig off, wig on. Where's that mirror!
Chris Silk spent three months with The Naples Players as they cast and rehearsed their summer musical "42nd Street." "42nd Street" closes July 30. Follow along at naplesnews.com/42
Audiences coming to see the Naples Players production of "42nd Street" will see the singing, the dancing and of course the glorious tap dancing.
There's another show going on backstage - stripping, shoving, pushing, yelping and feathers flying.
There's an entire world - with an ecosystem built on stage managers, assistant stage managers, dressers, stage hands and frantic actors - that exists in the wings.
In front of the lights, success is measured in laughter and tears, graceful movements and the soaring trill of a soprano belting out a ballad so high, so far that the roof trembles.
In the shadows backstage, the currency comes down to seconds of precious time wasted trying to yank down a recalcitrant zipper and get into a sequined vest and full tuxedo for a costume change. Where did those tap shoes go? Lost props. Floating feathers. Rolling canes. Wig off, wig on. Where's that mirror! Chorus girls taking a corner at a dead run hurrying to make a change. Laughter. Smiles. Hugs.
Pay no attention to those folks behind the curtain.
Although the Sugden Community Theatre stage might look vast, dressers, dancers and crew fight for space backstage on a nightly basis.
There are 30 cast members, plus a dozen or so crew. Couple that with four massive set pieces - plus a van-load of props - and remember that everything has to stay out of sight of the audience.
Things get hairy on a nightly basis.
From the audience, the show zips by. From backstage, it feels like slamming ten espresso shots and out-running a bullet train all while standing in the middle of Times Square at rush hour on the hottest day of the year.
Yet, the audience never sees anything but a perfectly delivered show.
"Everything is timing. It is always a calamity," said dresser Peggy Doherty. "With the dresses, you have to listen to the song. I have three of them I have to unzip and zip. If I don't send out any girl with men's shoes on, it is good."
Space is always an issue - even more so in "42nd Street."
The huge staircase used in the "Dames" and "Lullaby of Broadway" numbers is eight feet tall and eight feet wide; it takes at least four people to shove it across the stage.
The crew has less than four minutes to get the huge piece on stage during act one - and about only slightly more time to get it back off. They have 15 minutes during intermission to get it ready for the second scene of Act II - but have to be done by the time the curtain rises; they can't be banging around with tools while the cast is speaking just a few feet in front of them.
While "42nd Street" is difficult, Fernandez remembers "Beauty & the Beast" back in summer 2007 - one of the Naples Players best-remembered shows.
"Whole villages going on and off," Fernandez groaned.
Actors, dressers and crew check, re-check and triple check props and costumes again and again.
"I'm always assuming something is going to go wrong," chorus member Matt Reed said as he brought out his shoes and costume for a quick change nearly an hour before Wednesday's final dress rehearsal. Reed was back to check twice more before the curtain went up.
Debi Guthery - clad in the regal white outfit, furs and elegant cap her Dorothy Brock character wears during the first half - paces nervously just off-stage. In the minutes before her grand entrance, Guthery opens and closes a brown leather purse half a dozen times, checking to make sure the piece of blue paper - the character's contract - is inside.
"I have to make sure the paper is in the right spot so that when I grab it, it flips out right," Guthery said.
On stage, her character grabs the paper and CRACKS out the contract with a single flick of the wrist. The flourish needs to make a satisfying "whoosh" sound to be impressive - or else the detail is lost on the audience - and makes her character seem less grand. Guthery wants it to be right every night.
Actors aren't the only ones with an eye for detail.
Dresser Alyssa Haney shares a trick she uses - taught to her by Molly Eovino - to help keep dancers cool.
"We take wash cloths and hand towels from from the costume shop, get them a little damp and put them in the freezer right as we get to the theater," Haney said. "We take them out before the show starts - and they have an icy towel to cool off with."
Some crew members - Fernandez, assistant stage manager Wylie Cassidy and Todd Irby - have been with the show for weeks.
Others, like longtime dressers Gabrielle Weger and Jane Armstrong, simply love theater.
Weger knows nearly all the tap steps to "42nd Street," and can be seen performing them along with the cast, quietly, in the far stage left quick-change corner.
Armstrong, who's been on stage in "A Little Night Music," "Annie Get Your Gun" and "She Loves Me," peers through the curtain and sways with the music of "Dames" for a brief few seconds before turning to lay out dresses on the floor so that chorus girls can step out of one costume and into another.
Cast members watch the show too.
Before her entrance after the opening tap number, Rachel Aryn floats backstage, checks a list of costumes (she never gets to a dressing room during the first act) and runs through a quick series of tap steps before pirouetting into the first wing to wait for the piano tones that signify her entrance.
The maroon chaise lounge used in the Regency Hotel sequence holds four suitcases, Abner Dillon and two chorus boys, plus assorted props.
Gary Strahan sits quietly, waiting amidst the noise for his entrance. Guthery steps by, grabs his hand and they sail on to the stage. Chorus boys crowd on the vacant space to peer out for a moment before running to change their shoes and find the straw hats and umbrellas used in the next number.
The precisely choreographed actions under the lights give lie to the chaos that happens in the darkness lit only by blue lamps backstage.
While the first act of "42nd Street" officially runs 80 minutes, it flies by backstage - pulsing with the energy of actors racing back and forth, chorus boys peeling off sweaters and grabbing for hats and canes, stagehands slapping down a pile of dimes and rushing to push out a huge staircase.
Feathers - from half a hundred costumes - float on puffs of air from curtains going up and down. Wheels on huge sets groan as they get pushed out by invisible stagehands the audience never sees. Zippers shriek as they race up the backs of lithe showgirls and shoes squeak across the floor.
Magic happens on - and off - the stage every night.
It is just that audiences never see the delicate, frantic, fantastic drama that happens backstage.
Pay no attention to the man behind the curtain.
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text:
Engine 249cc, 4 Stroke, 2-CYL. Bore x Stroke(mm) 57 x 48.8 Compression Ratio 10.4 : 1
250cc Chopper Custom Built Motorcycles
The brand new products comes with complete accessories in their original factory sealed
Elegant, stylish and fun. The rage is packed with the very latest features and offers superb value f
Super Clean And Hardly Used 2000 Model Suzuki Quad Runner. 250 CC. Only 98.9 Miles! 5 Forward Speed
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After months of partisan bickering Senate leaders finally reached an agreement to break the logjam over federal judicial nominees.
The result means that 12 federal district court judge picks and two circuit court nominees will get confirmation votes before the summer. The agreement came just hours before Senate Majority Leader Harry Reid (D-NV) had planned to being a series of procedural votes that would have forced confirmation votes through the Senate floor, even if it would take weeks to accomplish.
The agreement requires the Senate act on two judicial nominees per week before May 7.
It's a good start, but will not go far enough to address the crisis facing the federal judiciary as a result of judicial vacancies.
There are a total of 22 judicial nominees awaiting action on the Senate floor. That means that eight of the judges, including five district nominees and three appellate nominees still won't get a vote.
Those judges who will get confirmation votes are Stephanie Thacker in the 4th Circuit and Jacqueline Nguyen in the 9th Circuit. The 12 district court judges include Gina Marie Groh of the Northern District of West Virginia; David Nuffer of Utah; Michael Walter Fitzgerald of the Central District of California; Ronnie Abrams of the Southern District of New York; Rudolph Contreras of the District of Columbia; Miranda Du of Nevada; Susie Morgan of the Eastern District of Louisiana; Gregg Costa of the Southern District of Texas; David Guaderrama of the Western District of Texas; Brian Wimes of the Western District of Missouri; Kristine Baker of the Eastern District of Arkansas; and John Lee of the Northern District of Illinois.
The circuit judicial nominees who did not make the deal include Andrew Hurwitz of the 9th Circuit; Paul Watford, also of the 9th Circuit; and Patty Shwartz of the 3rd Circuit. The district court nominees who didn't make the list included John Tharp of the Northern District of Illinois; George Russell III of Maryland; Mary Lewis of South Carolina; Jeffrey Helmick from the Northern District of Ohio; and Timothy Hillman of Massachusetts.
Read more: federal courts, federal judiciary, filibuster, senate-republicans
Photo from dctim1 via flickr.
Finally! The republican party is so f++++d up. They are committing political suicide by accommodating their radicals.
The flat earth party doesn't know how to govern properly because they are stuck in medieval times. Until we get rid of the tea party Republicans and the ultra conservatives who get their marching orders from Limbaugh, and appear regularly on the Fox liar channel, and elect moderate, and progressive people we will remain stuck in reverse or neutral.
I read the first, pivotal paragraph over three times and it still doesn't make sense. Was a phrase deleted by mistake?
I enjoy reading Care2 articles, but they are too often not properly proofread. I hope this will change. Though it's a screen instead of a printed page, I still want to be able to rely on what I'm reading.
This is just the beginning folks. As the election approaches, we need more pressure on the Do Nothings, so that we can finally move ahead. There is a flood of things which have to be done and the dam GOP has blocked the waters. We need jobs. We need tax restructuring. We need regulation. We have to allow some form of automatic recusal for SCOTUS, so as to assure that there is no hint of impropriety. We need term limits for Congress. We need some way for the voters, nationally, to petition and force a Congregssional election when Congress is immobile. We need a privacy amendment to the Constitution, which assures women that men will not try to control their health, nor their bodies. This is just a short list. I am sure that there are many other items that folks would love to add, however nothing gets done overnight.
The Teapublicans have been dragging their feet on this, too, in the attempt to make the Obama administration look like it was "failing."
I just wish Harry Reid had pulled his forced confirmation plan out of the hat two years ago.
Still partisan crap. The three Appeals Court nominees who were excluded are as good or better than the others. Still, it resembles long overdue progress.
The most lasting legacy any president has is his judicial appointments. God forbid that the Stone Age party (guess which that is!) gets to appoint more judges anytime soon. One has only to look at the Neanderthal section of the Supreme Court to understand why.
Well, it's a start.
crack that whip and stop playing games now
Disclaimer: The views expressed above are solely those of the author and may
not reflect those of
Care2, Inc., its employees or advertisers.
Thanks for sharing.
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And now for a feel good story........who really cares about poor Americans.......when the best are protecting…


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A three dimensional packaging architecture for ultimate high performance computers and methods for fabricating thereof are described. The package allows very dense packaging of multiple integrated circuit chips for minimum communication distances and maximum clock speeds of the computer. The packaging structure is formed from a plurality of subassemblies. Each subassembly is formed from a substrate which has on at least one side thereof at least one integrated circuit device. Between adjacent subassemblies there is disposed a second substrate. There are electrical interconnection members to electrically interconnect contact locations on the subassembly to contact locations on the second substrate. The electrical interconnection members can be solder mounds, wire bonds and the like. The first substrate provides electrical signal intercommunication between the electronic devices and each subassembly. The second substrate provides ground and power distribution to the plurality of subassemblies. Optionally, the outer surfaces of the structure that can be disposed a cube of memory chips.
1. A structure comprising:
a plurality of subassemblies;
each of said subassemblies comprising:
a first substrate having a first side and a second side;
at least one electronic device disposed on said first side and said second side;
a plurality of first contact locations on said first side;
a plurality of second contact locations on said second side;
a plurality of second substrates;
each of said subassemblies is disposed between a first one of said plurality of second substrates and a second one of said plurality of second substrates;
first means for electrically interconnecting said plurality of first contact locations to said first one of said plurality of second substrates;
second means for electrically interconnecting said plurality of second contact locations to said second one of said plurality of second substrates.
2. A structure according to claim 1, wherein said first means and said second means are selected from the group consisting of solder mounds and wire bonds.
3. A structure according to claim 1, wherein there are a plurality of electronic devices on said first side and a plurality of electronic devices on said second side.
4. A structure according to claim 1, wherein said electronic device is a semiconductor device selected from the group consisting of a silicon integrated circuit chip and a gallium arsenide integrated circuit chip.
5. A structure according to claim 1, wherein said first substrate has electrical conductors for electrically interconnecting said electronic devices.
6. A structure according to claim 1, wherein said second substrate has electrical conductors for providing power and ground to said subassemblies.
7. A structure according to claim 1, further including a third substrate, each of said second substrates has an edge having electrical conductors at said edge, said edge is disposed in electrical communication with electrical conductors on said third substrate.
8. A structure according to claim 7, wherein said electrical conductors at said edge are electrically conducting pins.
9. A structure according to claim 7, further including a stack of memory devices in electrical communication with one of said second substrates.
10. A structure according to claim 9, further including at least one memory device disposed in electrical contact with said second substrate.
11. A structure according to claim 1, further including means for directly electrically interconnecting said at least one electronic device to at least one of said plurality of second substrates.
12. A structure according to claim 11, wherein said means for directly electrically interconnecting said at least one electronic device to said at least one of said plurality of second substrates is a solder mound.
13. A structure comprising:
a plurality of subassemblies;
each of said subassemblies comprises a first substrate having a first side and a second side, a first at least one logic electronic device being disposed on said first side, a second at least one electronic devices being disposed on said second side, said first substrate has electrical conductors for electrical interconnection to said first and said second, said first substrate has a plurality of first contact locations;
a plurality of second substrates, each having an end;
said subassemblies are disposed between said second substrates;
said second substrates have a plurality of second contact locations;
said first contact locations are disposed adjacent said second contact locations;
a means for providing electrical interconnection between said second substrates and said first substrates;
a third substrate;
said ends of said second substrates being disposed adjacent said third substrates;
means for providing electrical interconnection of electrical conductors at said ends with electrical conductors in said third substrate.
The present invention relates to a package and architecture which allows very dense packaging of multiple integrated circuit chips for minimum communication distances and maximum clock speeds.
To reduce the cost and increase the performance or electronic computers, it is desirable to place as many electronic circuits in as small a region as possible in order to reduce the distance over which electrical signals must travel from one circuit to another. This can be achieved by fabricating, on a given area of a semiconductor chip, as many electronic circuits as feasible within a given fabrication technology. These dense chips are generally disposed on the surface of a substrate in a side by side arrangement with space left therebetween to provide regions for electrical conductors for electrical interconnection of the chips. The chip contact locations can be electrically interconnected to substrate contact locations by means of wires bonded in between the chip contact location and substrate contact locations. Alternatively, a TAB tape (which is a flexible dielectric layer having a plurality of conductors disposed thereon) can be used for this electrical interconnection. Alternatively, the semiconductor chips may be mounted in a flip-chip configuration wherein an array of contact locations on the semiconductor chip is aligned with and electrically interconnected to an array of contact locations on a substrate by means of solder mounds disposed between corresponding chips and substrate contact locations. This side by side arrangement of electronic devices is not the most dense configuration which can be achieved.
In the microelectronics industry, integrated circuits, such as semiconductor chips, are mounted onto packaging substrates to form modules. In high performance computer applications, the modules contain a plurality of integrated circuits. A plurality of modules are mounted onto a second level of packages such as a printed circuit board or card. The cards are inserted into a frame to form a computer.
For nearly all conventional interconnection package, except for double sided cards, signals from one chip on the package travel in a two dimensional wiring net to the edge of the package, then travel across the card or board or even travel along cables before they reach the next package which contain the destination integrated circuit chip. Therefore, signals must travel off of one module onto wiring on a board or onto wiring on a cable to a second module and from a second module to the destination integrated circuit chip in the second module. This results in a long package time delay and increases the demands on wireability of the two dimensional wiring arrays.
As the performance requirements of a mainframe computer continue to increase, the signal propagation time for communications from module to module, chip to chip and even device to device become critical. The current solution to this problem is to place the chips as close together as possible on a planar substrate and combine as many circuits as possible onto the substrate using insulators having dielectric constants as low as possible between wiring layers.
However, it is becoming apparent that such solutions will not allow future generation machines to reach the desired performance levels. One of the most significant factors is the time required for a signal to cross the length of a module. Three dimensional packaging structures will overcome the problem of the signal propagation distances in the planar packages, but the difficulty has been finding a suitable way to interconnect the devices in such a structure.
An improvement in chip interconnection propagation time and an increase in real chip packaging density can be achieved if three dimensional wiring between closely spaced planes of chips can be achieved.
It is an object of the present invention to provide an improved packaging structure wherein the integrated circuit devices are packaged in a three dimensional structure.
It is another object of the present invention to provide such an improved packaging structure with both horizontal electrical interconnections and vertical electrical interconnections.
It is a further object of the present invention to provide an improved packaging structure which is composed of a plurality of subassemblies each of which are separately testable and electrically interconnected by vertical electrical interconnections.
It is yet another object of the present invention to provide an improved packaging structure for providing electrical interconnection to high I/O count chips and providing a means for dissipating heat generated in the chips.
A broad aspect of the present invention is an integrated circuit packaging structure formed from a plurality of subassemblies. Each subassembly has a first substrate having a first side and a second side. There is at least one electronic device disposed on the first side and on the second side. There are a plurality of second substrates. The subassemblies are disposed between the second substrates. The subassemblies are in electrical communication with the second substrates.
In a more particular aspect of the present invention, the first substrates have electrical conductors for providing electrical interconnection between the first and second sides of the first substrate.
In another more particular aspect of the present invention, the electrical conductors of the first substrate predominately provide signal I/O to the electronic devices.
In another more particular aspect of the present invention, the second substrates predominately provide power distribution to the subassemblies.
In another more particular aspect of the present invention, the first substrates have a plurality of contact locations and the second substrates have a plurality of contact locations. Each of the first plurality of contact locations is disposed adjacent one of the second plurality of contact locations. There is an electrical interconnection means between the adjacent contact locations for providing electrical communication between the first substrates and second substrates.
In another more particular aspect of the present invention, each of the second substrates has an end which is disposed in electrical communication with a third substrate.
In another more particular aspect of the present invention, the first plurality of electronic devices and the second plurality of electronic devices are logic devices.
In another more particular aspect of the present invention, a stack of integrated circuit memory devices are disposed in contact with at least one of the second substrates.
These and other objects, features and advantages of the present invention will become apparent upon consideration of the following detailed description of the invention when read in conjunction with the drawing figures in which:
FIG. 1 is a side view of the structure according to the present invention.
FIG. 2 is a perspective view of the structure of FIG. 1.
FIG. 3.1 is a top view of a subassembly of the structure of FIGS. 1 and 2 wherein solder mound bonding is used.
FIG. 3.2 is a top view of another subassembly of the structure of FIGS. 1 and 2 wherein wire bonding is used.
FIGS. 4-9 show a method of fabricating the subassemblies of the structure of FIG. 1.
FIGS. 10-14 shows another method for fabricating the subassemblies for the structure of FIG. 1.
FIGS. 15-22 show the method of fabricating a metal core card for use in the structure of FIGS. 1 and 2.
Referring to FIG. 1, there is shown a side view of the structure of the present invention. FIG. 2 shows a perspective view of the structure shown in FIG. 1. FIGS. 1 and 2 show a module 2 which is mounted onto an electronic substrate 4, such as a printed circuit board. Module 2 comprises at least one subassembly 6 or 7. The subassembly 6 comprises a substrate 8 such as a printed circuit board, a circuitized ceramic packaging substrate, a circuitized glass ceramic packaging structure, a circuitized polymeric packaging substrate, a circuitized metal packaging substrate, a circuitized glass packaging substrate a circuitized semiconductor substrate and the like. Substrate 8 has a first side 10 and a second side 12 on each of which there is preferably disposed an electronic device 14 and 16 respectively. The electronic devices 14 and 16 are typically an integrated circuit chip. There can be a plurality of devices 14 and 16 on sides 10 and 12, respectively. Between the subassemblies 6 there is disposed a second substrate 18. Substrate 18 can be a circuitized ceramic, glass ceramic, glass, polymer, metal or semiconductor substrate or a printed circuit board or a combination thereof. On both ends of the structure of FIG. 2 there are substrates 20 and 22. Substrates 20 and 22 are similar to substrate 18. Each substrate 8 has a first side 24 and a second side 26. On side 24 there are a plurality of electrical contact pads 28 and on side 26 there are a plurality of electrical contact pads 30. On substrate 18, which is disposed between subassemblies 6 and 7, there are contact pads 32 on side 34 of substrate 18 and contact pads 36 on side 38 of substrate 18. Contact pads 36 are aligned with contact pads 28 on subassembly 7. Between contact pads 36 and 28 there is disposed an electrical interconnection means 29 which is preferably a solder mound which is soldered to pads 36 and 28. On surface 40 of substrate 20 there are a plurality of contact pads 50. Surface 46 faces surface 44 of subassembly 6. On surface 44 there are pads 48 which are aligned with and adjacent to pads 50 on surface 46 of substrate 20. Between pads 48 and 50 there is disposed electrical interconnection means 52 which is preferably a solder mound soldered between pads 48 and 50. Ends 54, 56 and 58 of substrates 22, 18 and 20, respectively, are disposed adjacent surface 60 of substrate 4. Electrical conductors in substrates 18, 20 and 22 extend to ends 56, 58 and 54, respectively, to provide electrical interconnection to electrical conductors in substrate 4. The electrical interconnection means 87 electrically connecting ends 54, 56 and 58 to substrate 4 can be a commonly used plug and socket or electrically conducting pads on ends 54, 56 and 58 can be solder bonded to a corresponding set of pads on surface 60 of substrate 4 (as described in U.S. patent application Ser. No. 07/760,038, filed Sep. 3, 1991, the teaching of which is incorporated herein by reference) or any commonly used electrical interconnection means of one substrate to another can be used. Optionally, on one of the outer surfaces 62 or 64 of the combination structure 2 of FIG. 2 there can be disposed an integrated circuit device. In FIG. 2 there is shown a stack 66 of integrated circuit devices 68 which have an adhesive material 70 disposed between adjacent integrated circuit devices 68 in the stack to hold it together. U.S. patent application Ser. No. 07/760,038, filed Sep. 13, 1991, assigned to the assignee of the present invention, the teaching of which is incorporated herein by reference and U.S. patent application Ser. No. 07/903,838, filed Jun. 24, 1992, assigned to the assignee of the present invention, the teaching of which is incorporated herein by reference, teach stacked chip structures which are useful to practice the present invention. In the preferred embodiment from stack 66 there extends a plurality of electrically conducting wires 72 which are electrically interconnected to pads 74 on surface 62 of substrate 20. Electronic devices 16 and 14 are preferably logic integrated circuit devices and chip stack 66 is preferably a stack of integrated circuit memory devices. Although only one integrated circuit device 14 and 16 is shown disposed on surfaces 10 and 12 respectively of substrate 8, there can be a plurality of such integrated circuit devices disposed on these surfaces. The electrical conductors within substrate 8 provide communication of electrical signals to the integrated circuit devices 14 and 16. These signals go through pads 28 through solder mounds 52 to pads 36, through electrical conductors in substrates 18, 20 or 22, through electrical interconnection means 80, 84 or 86 to electrical conductors on substrate 4. The electrical conductors on substrate 18, 20 and 22 also provide for power and ground distribution from substrate 4 to integrated circuit devices 14 and 16 on subassemblies 6 and 7.
In FIGS. 1 and 2, electronic device 14 can have pads 31 on surface 33 of device 14. Pad 31 can be bonded by wires 35 to pads 37 on surface 10 of substrate 8. Pad 57 can be in electrical connection with pads 28 through electrical conductors in substrate 8. Electronic device 16 can have pad 41 on surface 43 of device 16. Pad 41 can be bonded by wire 45 to pad 47 on surface 12 of substrate 8. Alternatively, as shown with respect to device 14' pad 31' on the surface 32' of the electronic device can be bonded by solder mound 35' to pad 37' on surface 10' of substrate 6. Electronic device 16' can have pad 41' on surface 43' of device 16'. Pad 41' can be bonded by solder mound 45' to pad 47' on surface 12' of substrate 6. Alternatively, electronic devices 14, 16, 14' and 16' can be bonded in a flip-chip-configuration with solder mounds electrically connected pads on the device surface to pads on the surfaces of substrates 6 and 8.
FIG. 3.1 is a top view of substrate 6 showing integrated circuit device 16' surrounded by contact pads 48 on which are disposed solder mounds 52 and vias 80 which provide electrical connection between surfaces 12' and 10' which are on the opposite side of substrate 6 or between electrical conductors on surface 12' or surface 10' to electrical conductors within substrate 6. Optional solder mounds 45' are also shown with provide electrical connection from integrated device 16' to substrate 20' FIG. 3.2 shows a top view of substrate 7.
Substrate 8 of subassemblies 6 and 7 is preferably a silicon wafer having electronic devices fabricated on opposite sides thereof.
FIGS. 4-9 show a process of fabricating a double sided silicon wafer by processing one side of the silicon wafer to form the integrated circuit device thereon and processing another in the same manner and laminating the two together. FIGS. 10-14 show an alternate method of fabricating structure 8 by the epitaxial growth of semiconductor material on a substrate with subsequent lamination onto a pretested power signal distribution substrate.
The structure of the present invention consists of preferably four or more levels of devices, with capacity for through vias. Between two double sided devices 6 and 7 there is a substrate 18 having on surfaces 34 and 36 a thin film distribution layer 18 which reroutes the interconnections from one side 34 of the package to the other side 36 of the package. This substrate 18 and additionally the optional substrates 20 and 22 on the outsides of the package carry both power to the electronic devices 16 and 14 I/O of the package. The preferred methods of how to manufacture double sided devices 6 and 7, will now be described.
FIGS. 4-9 show one method of forming subassembly 6 or 7 of FIG. 1 or 2. FIG. 4 shows silicon wafer 100. On silicon wafer 100 there is disposed a multilevel semiconductor substrate 102 having devices, such as, transistors, resistors, capacitors and metallization layers as commonly used to fabricate semiconductor devices. Contact pads 104 are deposited onto semiconductor structure 102. Solder mounds 106 commonly referred to a C4 solder balls, are disposed onto contact pads 104 by evaporation through metal masks or plate up as is common in the art. Alternatively, instead of using C4 balls surface mount structures can be fabricated as represented by regions 108 of FIG. 7 which shows a land grid array. Surface 110 of wafer 104 which is opposite to the surface on which active device layer 102 is disposed is ground down or etched.
The silicon wafers can be ground to medium thickness's by conventional chem-etch processing, as known in the art. The limitation on the final thickness of the wafer is the aspect of the through vias which can be formed in subsequent operations. For loose or current ground rule requirements, thin wafers can be obtained by first doping the silicon with boron. This provides a very uniform depth of boron atoms, which provides substantially greater solubility of the doped silicon compared with undoped silicon. This method provides minimal mechanical stress on the thinned wafer, thus preventing breakage and increasing the yield of product. Either of these processes can be performed at the wafer level or chip level.
Subsequently, electrically conducting vias 102 as shown in FIG. 8 at surface 114 are formed by selective doping. Surface 114 is disposed onto surface 116 of substrate 118. Substrate 118 is preferably a metal core, the fabrication of which is shown in FIGS. 15-22 described below. On side 120 of substrate 118 there is disposed another structure such as the structure of FIG. 8 to form a double sided structure 6 as shown in FIGS. 1 and 2. The substrate 118 acts as an expansion matched power bus while also providing thermal management and isolated signal through holes. The core is prepatterned with a via grid matching that of the electrically conducting vias 112.
In FIGS. 10-14 a metal substrate 200, such as a molybdenum substrate has a plurality of electrically conducting through vias 202 formed therein surrounding the interior sidewall of through via 102 there is a dielectric material 204 such as a polyimide. As shown in FIG. 11, a layer of semiconducting material 206 such as silicon is grown by epitaxial methods known in the art onto surface 208 of substrate 200. As in conventional integrated circuit chips, electronic devices such as transistors, diodes, resistors and capacitors are fabricated in the semiconducting material layer 206. As shown in FIG. 12, metallization layers 208 are fabricated on semiconducting structure 206. Metallization 208 can be a multilevel dielectric/electrical conductor substrate as is commonly used in the integrated circuit art, such as multilayer silicon dioxide/electrical conductor structures and multilayer polyimide electrical/conductor structures. As shown in FIG. 13, electrically conducting pads 210 are fabricated on surface 212 of multilayer structure 208. On pads 210 there are disposed solder mounds 214 or C4s. Two structures 216 as shown in FIG. 3 are disposed so that sides 218, which are opposite the side on which pads 210 are disposed, are placed adjacent each other with an adhesive layer 220 as shown in FIG. 14 there between to form structure 222 of FIG. 14 which is a double sided electronic device. Structure 222 of FIG. 14 can be used as subassembly 6 or 7 of FIGS. 1 and 2.
The metal cores, 118 in FIG. 9 and 220 in FIG. 14 can additionally act as multichip modules as an alternative to ceramic or silicon based modules. It can also act as part of a laminated power supply, in which the metal core acts as the primary means for distributing the power and limiting current and voltage drops due to resistance of the carrier and a thin film structure of circuit board structure laminated to this core provides the primary paths for signals to connect the electronic devices to each other and to external connections.
This carrier can be fabricated as shown in FIGS. 15-22. FIG. 15 shows a metal sheet 300, preferably molybdenum, with substantially planar surfaces. Holes 302 and 303 are produced in 300 using drill, if the ground rules permit it, such as for applications as multichip modules and laminated power supplies. When fine holes are required, patterned electroetching is the preferred method. Holes 302 and 303 are different sizes, depending on whether an insulated through via is to pass through at that position or a connected via. These holes are subsequently filled using a highly efficient filling polymer dielectric, 304, preferably a thermosetting type, such as an epoxy resin, cyanate ester resin, etc, which has the thermal properties suitable for the final application, to form structure 306. Furthermore, a dielectric such as polyimide or epoxy can be conformally coated using electrophoretic, electrodeposition, powder or spray coating.
A plurality of structures similar to 306 are stacked and laminated with alternating layers of a partially cured polymer dielectric, 308 and 310 in FIG. 18, which will ultimately act as an insulator to prevent electrical connection between the adjacent layers of metal. These polymer dielectric layers are preferably, but not necessarily the same composition as the dielectric 304 used to fill the holes in FIG. 17. Inorganic materials, such as ceramic green sheet can also be utilized as 308. The structures 306 are aligned as necessary to provide power and ground layers for the final structure. Holes are drilled in the structure to provide paths for electrical signals to pass, in some cases insulated from the metal layer being passed or in electrical contact.
Alternatively, holes can be formed in the polymer filler, 304, in positions which will ultimately be the positions for electrically connected vias. This can be accomplished by another drilling operation or through dry or wet etching as is commonly performed in the art. Similarly, holes are formed in in the interlayer dielectric material, 308 and 310 and the layers aligned, stacked and laminated similarly to that shown in FIG. 18. Alternatively, the holes in 308 and 310 are not formed until after lamination, using hole already formed in structure 306 as the mask. This eases alignment requirements.
The laminated structure 312 in FIG. 20 is then exposed to a solution which preferentially etches the dielectric in a uniform manner to ensure that good electrical contact with the internal metal features can be obtained, to produce structure 314 in FIG. 21. The metal features are optionally etched to produce structure 316 in FIG. 22, which is suitable for plating of the through holes. This can be performed utilizing electroless processes known in the art, following the formation of a seed layer. Without the final metal etching, voids in the final plated through holes can be formed, which will impact reliability of the structure.
The final metal core structure can be used as a circuit board for direct mounting of chips or thin film redistribution layer. It can also function as a laminated power distribution structure and heat sink device for thermal management.
In summary, a three dimensional packaging architecture for an ultimate high performance computer has been described which allows the very dense packaging of multiple integrated circuit chips for minimum communication distances there between and maximum clock speeds. The structure is comprised of a plurality of subassemblies, each subassembly having at least one integrated circuit structure on both sides of a substrate which provides signal wiring between the integrated circuit devices within the substrate. Between adjacent subassemblies there is disposed a second substrate which provides power and ground distribution to the structure.
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Why do guys touch me intentionally but then...
Tell me not to touch them? It's kind of weird. Like these guys always poke me, tap me or touch me thigh, arm, hand
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What Guys Said 1
What Girls Said 3
So they poke/hit/punch you and you go to hit back and they won't let you? Yeah, this always happens to me. I'm pretty sure it means they like you and/or find you attractive. Do they hit ugly/fat girls? Probably not... Like the guy who used to do that to me showed up at my house one day saying he was just in the neighborhood-at 9:00 at night when it's 20 degrees... But, yeah just sass them and say, "Why are you gay? You don't want girls to touch you?".
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News Headlines
- Fri, Jul 03
- Neoseeker's Best of E3 2015 Awards: Game of the Show
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- Skyforge, F2P MMO collaboration between Obsidian and Allods, starts Open Beta on July 16
- Trials Fusion's Awesome Level MAX DLC gameplay isn't too extreme, but does have cats on unicorns
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Skidmarksdeluxe Jan 22, 13
It's a nice drive. I hope it can help pull OCZ out of the s..t
hiigaran Feb 5, 13
i swear this looked like a credit card from the images in the forum
Cryonicstate Feb 5, 13
It does look like a credit card even when you are holding it. And it is an awesome drive, a pair of these in raid 0 would be really nice.
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1. David Crosby, who Monday hit a runner with his car [1] on a rural California road. This song [2] may or may not have been on Crosby's radio at the time.
2. McDonald's, which, The Wall Street Journal reports, "has launched a line of hamburger-themed clothing in Sweden." [3](Thanks, Jeff Dengate.)
3. Mo Farah, who set a European and British record [4] last weekend, running 59:32 at the Lisbon Half Marathon.
4. Xenophobia, which Webster's defines as this [5].
5. New Balance's limited-edition shoe for this year's Boston Marathon [6], which offers the wearer this valuable racing advice:
6. Incredibly handsome cops, like the one who disrupted a race in China as female runners crowded around his van [7] for a closer look. (Thanks, Kit Fox.)
7. Threats, assaults, and harassment against runners. A Philadelphia man is tracking all those things in an online database [8] to create a "heat map" of trouble spots for Philly runners. As usual, Remy's World is here to do it bigger and better:
Plan your runs accordingly.
8. NASA's Opportunity rover, which has finally covered 26.2 miles [9] on the surface of Mars. Its "finish time" was 11 years and 2 months. Which prompted this [10].
9. Travel-sized running shoes, the newest trend [11] in athletic footwear.
10. That football player who pooped his pants during a televised game – remember him? [12] – who now says, looking back on it [13], that the incident helped his career [14].
See you next week, everyone.
Have a tip? Suggestion? Career that's been helped by soiling yourself? Write me at firstname.lastname@example.com [15].
Also? Go like the Remy's World Facebook page [16].


text:
This Might Be The Grossest Hashtag Ever
Get a room!
The Funniest Parody Account You'll See Today
Does this selfie make me look fat?
#ThanksMichelleObama: Students Tweet Concern Regarding Officious Food Tips
Your #SATWordOfTheWeek… Officious, adj; "offering one's services when they are neither wanted nor needed." In a pop culture sentence? "Disgusted students nationwide found the First Lady's healthy cafeteria food officious, taking to Twitter with picture-laden complaints." Remember […]
New App Let's Women Rate Their Dates
This new app called Lulu allows women to rate their dates and there is a breakdown of what women said by city. Just a little taste of what was said (through the use of hashtags, […]
American Idol Wants Your Twitter Thoughts
American Idol wants the show to be interactive, when you are watching look for the hashtags on the show and start tweeting. The singing competition is looking to integrate the large number of people who […]
Election Day Secrets
While election news broke, setting a new Twitter record, some people were using the platform to reveal their bizarre #electiondaysecrets.


text:
The 2014 Garmin Sharp Team Viva Skull Cap is designed to be worn under your helmet on cold days. Made from thin Lycra material, the skull cap will keep your head warm but it's not too bulky so that your helmet won't fit. It's ideal for keeping your head warm while you're cycling in the winter or spring. - A.D.
Key Features:
|Cycling Team:
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Home » Bread » Fruit Bread » Banana Bread » Banana Wheat Bread » Whole Wheat Banana Bread
Whole Wheat Banana Bread
17 Dec 2009
|Whole wheat flour
|2 Cup (32 tbs)
|1⁄4 Cup (4 tbs)
|Baking soda
|1 Teaspoon
|Baking powder
|1 Teaspoon
|2 Cup (32 tbs), mashed (very ripe ( about 4 large))
|Skim milk
|1⁄4 Cup (4 tbs)
|Vanilla extract
|1 Teaspoon
|1⁄3 Cup (5.33 tbs), chopped
1. In a large bowl, combine the flour, sugar, baking soda, and baking powder, and stir to mix well. In a small bowl, combine the banana, milk, and vanilla extract. Add the banana mixture to the flour mixture, and stir just until the dry ingredients are moistened. Fold in the walnuts if desired.
2. Coat an 8-x-4-inch loaf pan with cooking spray. Spread the batter in the pan, and bake at 350°F for 45 minutes, or until a wooden toothpick inserted in the center comes out clean.
3. Remove the bread from the oven, and let sit for 10 minutes. Invert the loaf onto a wire rack, turn right side up, and cool to room temperature before slicing.
Recipe Summary
Difficulty Level:Easy
Course:Side Dish, Fruit Dessert
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Whole Wheat Banana Bread Recipe


text: New York Mets ace Matt Harvey is used to getting approached by fans at ballparks. Posting a 4-0 record and miniscule 1.44 earned-run average this season will earn any major-league pitcher that kind of attention. But when a group of fans recently greeted the 24-year-old before a game in St. Louis, the topic of discussion wasn't baseball. It was hockey, specifically the New York Rangers.


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Protiviti Offers Webinar: Understanding the New Payment Card Industry Data Security Standard Protiviti experts to provide insights on upcoming PCI changes and new requirements PR Newswire MENLO PARK, Calif., Nov. 4, 2013 MENLO PARK, Calif., Nov. 4, 2013 /PRNewswire/ -- Protiviti, a global consulting firm, will host a webinar to WHAT: discuss and provide a holistic view of the Payment Card Industry Data Security Standard changes (PCI DSS 3.0) from both a compliance and threat intelligence perspective. The PCI standard is changing to address an advancing threat landscape, new business and technology platforms, and evolving requirements of the payments community. Experts will answer questions about the "what" and "why" of the new mandate. Join the webinar to learn: oKey changes and what's driving them, including: oA higher bar to achieve "segmentation" oA new definition of systems components oA new set of control requirements for point-of-sale devices oPotential implications for companies affected by the new standard oPreparation for the new mandate effective Jan. 1, 2014 oHow to gain competitive advantage WHEN: Wednesday, November 13, 2013 10:30 a.m. PST/1:30 p.m. EST (duration approx. 60 minutes) WHERE: Please register: http://www.protiviti.com/webinars WHO: Presentation speakers: oScott Laliberte, managing director, Protiviti oJeff Sanchez, managing director, Protiviti (Logo: http://photos.prnewswire.com/prnh/20090115/AQTH541LOGO) SOURCE Protiviti Website: http://www.protiviti.com Contact: Editor contact: Kathy Keller, (650) 234-6252, firstname.lastname@example.com
Protiviti Offers Webinar: Understanding the New Payment Card Industry Data Security Standard
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Blastoise wrote:
I luv this game alot but I think its sad that the overpriced projects and expensive prices for upgrading homes/stores can only be dealt with one way: grinding late night at a island. In the beginning, I embraced that and loved islanding grinding repeatedly. Now that alotta time has passed since I first started, its kinda pushing me away from playing. I still love the game, though. When people ask me should they buy the game, I tell them: "Its a great game and its even better with friends. Just beware of how expensive things get as you progress."
Also show Blather's alot of fossils and fish in the river from 4PM to 9AM


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If necessary, use an eye mask, ear plugs, or white noise to help tune out disruptions.
They reduce the tension to the visual equivalent of white noise and encourage musing as much as monitoring.
For today's men, though, perhaps the key to modern manhood is more simple: Drown out the white noise.
"sound made up of a random mixture of frequencies and intensities," attested by 1970.


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Why state regulators may soon be on your case about cyber security (and why it's a good thing)
Editor's note: Some electric power utilities take a reactive approach to cyber security -- "we'll do something when mandated." But many industry observers -- including me -- think they need to be more proactive. So when I saw a recent white paper from the California Public Utilities Commission (CPUC) suggesting a proactive approach -- and making specific recommendations -- I asked for permission to run a short summary here.
California is a progressive state that is watched closely by others. What's more, commissions in Michigan, Pennsylvania and Texas are also developing cyber security policies. In other words, if you haven't yet heard from your PUC about the issue, you probably will soon. If I were you, I'd be getting ready right now. The article below is a good starting point. -- Jesse Berst
By Elizaveta Malashenko
With grid modernization underway, cyber security is recognized as an increasingly important factor in ensuring resiliency, reliability and safety. Indeed, it has become a top national security issue. Many cyber security events have already taken place, including Stuxnet, Aurora, RuggedCom, smart meter hacks and others.
From a regulatory perspective, grid cyber security has been addressed most actively at the Federal level through the North American Electric Reliability Corporation (NERC) Critical Infrastructure Protection (CIP) requirements. However, the NERC-CIP framework has important limitations.
First, NERC-CIP primarily covers only generation and transmission assets that qualify as "critical." Estimates suggest that 80-90% of grid assets are outside NERC-CIP's scope. Second, NERC-CIP is primarily compliance-based. Compliance is important, but it is not enough to ensure that the rapidly evolving risks are adequately considered and acted upon.
Issues to address
Regulators should explore cyber security best practices and develop a recommended approach for their investor-owned utilities. California has already instituted an explicit safety and security risk assessment (including cyber security) as cornerstone of its approach to reliability and safety. It has also established privacy rules for customer data and has required utilities to report on cyber security activities in their Smart Grid Deployment Plans. Other potential issues include:
· What actions can regulators take to address cyber security to ensure public safety and reliability?
· What is their position whether and how NERC-CIP cyber security requirements should be applied to the distribution grid?
· What are the proper regulatory mechanisms to ensure cyber security, including both compliance-based and risk assessment-based approaches?
· How can regulators ensure that utilities and technology providers are properly incentivized to adequately address cyber security?
· What requirements should be developed to ensure that the electric system is designed to be resilient to cyber-attack?
· What are the metrics to track the effectiveness of cyberseucirty policies and investments?
· How do confidentiality rules apply to cyber security reporting?
· Should regulators consider safe harbor protections to encourage utilities to share cyber security information?
Cyber security is a cornerstone of safe and reliable electric power. Regulators should take a proactive approach.
Elizaveta Malashenko is Program and Project Supervisor for Grid Planning and Reliability in the Energy Division of the California Public Utilities Commission. This article was adapted with permission from the CPUC staff paper "Cyber security and the Evolving Role of State Regulation: How it Impacts the California Public Utilities Commission," which is available for free download at the CPUC Reports and White Papers web page (scan for the Sept 19, 2012 report).
More on cyber security and the grid...
FERC ramps it up on energy cyber security
Nervous China plans massive increase in grid security spending
Cyber security alert - these days, it is the devices that are most vulnerable


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BA is flying the Olympic flame from Greece to the UK on Firefly, a specially liveried A319
Archive | May, 2012
The Olympic flame flying to the UK on BA's Firefly
By Miquel Ros on 18 May, 2012 in Aircraft, Airlines
Galileo: second pair to launch 28 September
By Dan Thisdell on 3 May, 2012 in Uncategorised
The European Space Agency is to launch a second pair of Galileo navigation satellites on 28 September before beginning a fast-track launch schedule in 2013 to orbit 18 satellites by the end of 2014 for a functional service, and 26 satellites by the end of 2015 for near-global coverage. The full constellation of 27 spacecraft […]
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CUPERTINO, Calif. — November 5, 2007 — Symantec Corp. (Nasdaq: SYMC) today announced it has signed a definitive agreement to acquire Vontu, the leader in Data Loss Prevention (DLP) solutions, for $350 million, which will be paid in cash and assumed options. The acquisition is expected to close in the fourth calendar quarter of 2007, subject to receiving regulatory approvals and satisfaction of other customary closing conditions.
Data loss prevention solutions help organizations prevent the loss of confidential or proprietary information wherever it is stored or being used. Vontu's products will complement Symantec's existing portfolio of endpoint and network security, storage and compliance solutions, to provide customers with the most comprehensive platform for data loss prevention on the market today. The acquisition builds on Symantec's strong partnership with Vontu and will provide an important component of Symantec's Security 2.0 vision, which shifts the focus of security from simply securing systems and devices to also protecting the information itself.
"The combination of Symantec's existing portfolio and Vontu's leading products and dedicated team enables us to deliver a central component of our Security 2.0 vision to customers - information-centric security that protects both the device and the information itself," said Tom Kendra, group president, Security and Data Management Group, Symantec. "In a business environment that is increasingly competitive, transparent and regulated, companies need confidence that their most valuable asset – information – is safe. Only then will security become more of a business enabler rather than a business inhibitor."
Companies today are struggling to determine where their most sensitive information is stored, how it is being used, who has access to it and how to prevent it from being lost or compromised. To address the risk of data loss, organizations in every industry are adopting DLP solutions that enable them to find and protect sensitive data stored throughout the enterprise, monitor and prevent confidential data from being copied or sent outside the company and automatically enforce data protection policies.
"The next wave of security is based on one simple idea – it's about the information," said Joseph Ansanelli, CEO, Vontu, Inc. "By joining forces with Symantec and building upon their strength in enterprise security and storage solutions, we will be uniquely positioned to help customers answer the important questions as to where their confidential information is stored, how it is being used, and how best to prevent its loss."
Symantec expects this transaction to be $0.02 dilutive to FY08 non-GAAP earnings per share and expects FY08 GAAP earnings per share to be more diluted due to purchase accounting, stock based compensation and acquisition related charges associated with the transaction.
Vontu will bring a best-in-class DLP platform to Symantec's already strong security and storage portfolio. Vontu's Network and Endpoint Data Discovery and Protection solutions help organizations understand where confidential information is stored and quickly "find and fix" exposed data on servers, systems and endpoints. Vontu Data Monitoring and Prevention solutions stop confidential data from being sent outside the organization through email, web or IM. They also monitor and prevent confidential data on endpoints from being copied to removable media or downloaded to local drives. Vontu also offers a centralized platform with all of its products for policy management, detection, workflow and remediation.
For more information on how Vontu will complement Symantec's existing offerings and planned integration between the portfolios, please visit: http://www.symantec.com/about/news/release/article.jsp?prid=20071105_02
There will be an analyst and investor conference call conducted by management teams of both Symantec and Vontu to discuss the transaction, today at 2:00 p.m. PST/ 5:00p.m. EST. The live discussion can be accessed by dialing 877-419-6603 or 719-325-4903, passcode: 9387849. A webcast of the Symantec/Vontu analyst and investor conference call will also be available on the Internet at www.symantec.com/invest. There will be replay of the webcast available on the Web site for those shareholders and analysts who are unable to listen to the live call.
For additional information on the Vontu acquisition please visit: http://go.symantec.com/vontu
Vontu is the leading provider of Data Loss Prevention solutions that combine endpoint and network-based technology to accurately detect and automatically protect confidential data wherever it is stored or used. By reducing the risk of data loss, Vontu helps organizations ensure public confidence, demonstrate compliance and maintain competitive advantage. Vontu customers include many of the world's largest and most data-driven enterprises and government agencies. Vontu has received numerous awards, including IDG's InfoWorld 2007 Technology of the Year Award for "Best Data Leak Prevention," as well as SC Magazine's 2006 U.S. Excellence Award for "Best Enterprise Security Solution" and Global Award for "Best New Security Solution." For more information, please visit www.Vontu.com.
Linda Smith Munyan
Symantec Corporation
Sherri Walkenhorst
Connect PR
Helyn Corcos
Symantec Corporation


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Friday 21 November 2014
How do we remember and how do we forget in a world dominated by a collective digital brain called the Internet? Live screening with Antoine Viviani's new interactive film In Limbo, Kutiman's Thru You Too and an unforgettable digital travel story by Zilla van der Born.
This event is part of DocLab: Immersive Reality, a co-production of IDFA DocLab and De Brakke Grond.
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2006 Redzone mock Draftee's- 1(st) Daniel Bard(redsox), 1(st sup)( Jordan Walden (Angels), 2(nd) rd.- Zach Britton(Orioles), 3(rd) Blair Erickson(Cardinals), 3(rd) Tim Norton( Yankees),(cuz its a Tim Hortons thing
Pain heals. Chicks dig scars. Glory... lasts forever.
Simple question...at what level would you expect a 2006 draft pick to be at in 2007, regardless of their age or previous level of competition (HS vs college)? How many players go from draft pick to some high level in way less than one full season? I know there are one off examples of players who jumped to the majors very quickly, but are we looking for that one in a million superstar, or the remaining 24 guys to fill out the squad?
Baseball, it is said, is only a game. True. And the Grand Canyon is only a hole in Arizona. Not all holes, or games, are created equal. ~George Will
How long are people going to keep giving Krivsky a free pass on the rotation? The rotation could easily have been Arroyo, Harang, Bailey, Lincecum, and Germano by the end of this July. And we'd still have Zach Ward, plus the money wasted on Cormier and the money spent on Lohse. And by the way, we won't know how to evaluate K's 2006 draft for another year anyway. If at the end of this season, Turner, Valaika, and Stubbs are putting up good numbers at Sarasota, then we'll know we've got something. I happen to think they will but it's still too early to know anything realistic about how those guys will develop. Also, it's unfair to O'Brien to link him up just with Bailey and Bruce. Take a look at what he did with an 11th round pick--Carlos Fisher is developing into a big time pitching prospect.
Nobody is down grading what O Brien did, I was a (one of the few) huge supporters of what he did in his tenure. Basically I was just looking back on last year since the draft was coming up. I like to call it as I see it and you can go back and search my comments on O Brien. The free pass on Krivsky is what he has earned as far as drafting last year goes. Lincecum yeah has jumped out the gate on fire, but Krivsky's draft was pretty damn good, I call them as I see them.
I see no reason as yet to call Krivsky's 2006 draft good. His highest picks are having success at Low A ball. That's good, but they were all major college players and are not doing any more than one would expect from them. I actually like his draft, though I'd have liked it a lot more if the first pick had been Lincecum. But it's way too early to evaluate it properly.
I'll just give a few bullet-point thoughts:O Brien had some pretty good drafts (Bailey, Bruce) Krivsky clearly raised the bar though. Just looking at Dayton stats and just about every draft pick on that team is clearly a legit hitting prospect even down to kids like Phipps and Heisley. Then the top 4 pitching prospects have unreal WHIPs.
Jordan Smith 0.95
Sean Watson 0.98
Rafael Gonzalez 1.11
Travis Webb 0.99
1) If Bailey and Bruce equated to "pretty good" drafts, who is even close to these two from the '06 draft?
2) Rafael Gonzalez was drafted in 2004 by Dan O'Brien.
3) I guess my major point from this thread is that judging college players in low A ball cannot "raise the bar" from drafts which have yielded Bruce and Bailey. It makes no logical sense.
Now to answer your question. Where do I expect a 2006 draft pick to be right now, regardless of age or level of competition? That depends on a few things. It HAS to be with regard to their age. It also has to be with regard to their draft position. A first-round college pick should be more advanced than a 7th round high school pick, no? Where they should be is on a case by case basis. Maybe they should be in Low A...that's fine. But we shouldn't be deeming the '06 draft a winner because of their success there.
Listen...I think these guys are having good season so far. But, IMO, they should be having some success for them to currently have some worth. If they were getting shelled in Low A, I'd be worried. Low A isn't exactly cream of the crop.
Here's a real life example of what I am trying to say.
2nd round picks from 2006:
21 year old pitcher in Low A (will be 22 in July '07): 3-1 with a 2.09 ERA. 56-5 K/BB ratio. .237 BAA, 0.98 WHIP.
19 year old pitcher in Low A (won't be 20 until February '08): 5-3 with a 2.06 ERA. 62-7 K/BB ratio. .237 BAA, 1.01 WHIP.
Which season has been more impressive so far? All things being equal (I'm not sure about lineups each have faced and league/ballpark effects), the 19 year old is having a more impressive season because of his age. The 21 year old is obviously Sean Watson and the 19 year old is Brett Anderson for Arizona. Anderson is someone people were predicting to go early on in the draft and he dropped into the 2nd round. I know I was dying for Cincy to pick him. He's 3 years behind Watson and is having virtually the same season. Natural progression would lead anyone to believe that Anderson should improve and, in 3 years, be better than what he is now. But as we know, nothing is a guarantee in this game.
That's my thought process. Take it for what it's worth.
Are we grading the drafting ability of Krivsky or the outcome of the 2006 draft? These are two very distinct questions. The outcome of the 2004 draft is that Homer Bailey has become one of the top pitching prospects in baseball. The strategy of drafting Bailey that high in the first round is still poor because history has shown that high school pitchers are nearly impossible to accurately predict.
If we are grading Krivsky's drafting last year, it is suspect. Drafting a project like Stubbs in the first round when your team needs contributors sooner rather than later is foolish. Watson and Valaika are off to very good starts on their pro careers, however they appeared to have been overdrafted at the time. It is too early in Krivsky's career to make any kind of call on whether he was lucky in drafting them or does he have a knack for identifying talent that others have overlooked.
By the way, Lincecum is beating Roy Oswalt tonight. That's what you call "raising the bar" in drafting.
I think its a huge mistake to call anything "Krivsky's" draft or "O'Brien's" draft.
I have a long time friend & neighbor who is currently an MLB scouting director. He's told me on plenty of occasions the GM's role in the draft is extremely limited - and he has nearly total autonomy - and he's been thru 2 GMs. The current GM is even less into the draft than the prior - last year my friend pretty much told him he wanted player X unless he was picked before, then he wanted player Y. The GM pretty much said sure thing whatever you want to do. And that player is having a monster season so far. I'm sure all over baseball there are different levels of involvement, but even draft connoisseur Billy Beane still lets his guys make the decisions.
So thank or blame Terry Reynolds or Chris Buckley.
Good point. Though Terry Renyolds was against drafting HS pitchers in the first round in his Dodger days. Considering the time it took the Reds to draft in 2004, I wonder who really made that final call. I remember waiting for the pick, it was like getting NFLish in its delay lol.
I think it was pretty clear from Buckley's quotes, he was pushing for Stubbs.
"[He] as all the tools you look for, plays at a top-flight program," Reds scouting director Chris Buckley said from Great American Ball Park in Cincinnati. "We're thrilled to have him. For me, he was the best athlete in the draft, so we're excited to have him with the eighth pick."
"He's a top-flight center fielder, he's got all the skills," general manager Wayne Krivsky said. "We're just real pleased to get him. I trusted Chris and his staff to do the right thing, and pick the best player in each round."
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text: Tuesday Twitter roundup Strike two for Trudy Wade: NC House refuses for now to rework GSO's city structure. More headlines for your Tuesday morning: http://t.co/xXDKmiDgMQ #gsopol #ncpol — 88.5 WFDD (@wfdd) June 30, 2015 If she had any sense, she would drop this now. But apparently she doesn't. Read more about Tuesday Twitter roundupscharrison's blog2 commentsLog in or register to post comments


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The AZL Reds trail 4-0 in the 6th inning. Cory Thompson is 1-for-3 with a double.
Jackson Stephens (RHP, 18th round pick out of an Alabama HS in 2012) makes his Dayton debut tonight. He posted a 9.28 K/9, 1.27 BB/9, and 4.64 ERA but 2.78 FIP in 21.1 innings with the AZL Reds last season.


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Author Archive
September 15th, 2007 at 1:50 pm
Gorman vs. Seidman: Over/Under
Katie Couric Experiment lasts: 1 more year Gorman: OVER! Les Moonves jumped into this with both feet, and he is not a[Read-More]
September 14th, 2007 at 11:50 pm
HD Currently Subscribed to in 10.7m Homes
TVbytheNumbers sheds light on HD numbers TVbytheNumbers.com estimates that non OTA (over the air) High Definition content is only currently available in 10.7[Read-More]
September 14th, 2007 at 9:45 am
DirectTV: 100 HD Channels May Not Be an Easy Sell
One thing that surprised me looking through DirecTV's earnings (ticker: DTV) was how high the churn is (greater than 1.5% monthly).[Read-More]
September 13th, 2007 at 6:23 pm
The Numbers Say TV is Getting Worse: But the Numbers Lie
Today I saw several stories that the public has weighed in, and 62% of us say TV programs are getting worse[Read-More]
September 12th, 2007 at 9:21 am
Nielsen Top 20 Cable TV Show Ratings, Sept 3-9
(click on chart for full-sized image) The Closer would have placed #16 on the Broadcast list. Britney's meltdown on the VMA certainly[Read-More]
September 11th, 2007 at 5:26 pm
Why We Use 'Viewers' in Our Rankings
A Note on Our Rankings The detailed oriented reader may notice that although we use the numbers from Nielsen, we sometimes have[Read-More]
September 10th, 2007 at 6:00 am
DVR Usage for Syndicated Shows: Can that Be Right?
My mind is struggling with the low impact of DVR usage for the top syndicated shows. I can't reconcile Bill[Read-More]
September 10th, 2007 at 12:00 am
IVM Panel: Comscore's Gian Fulgoni's Full Responses
1. What is are the biggest challenges of measuring Internet video? Lack of technical standards o Variety of different technologies being used[Read-More]


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At Marriott International, Chairman Bill Marriott has not only contributed the maximum $4,600 to Republican John McCain's presidential campaign, he's also an active McCain "bundler," who has raised between $100,000 and $250,000 from others.
At the table at Marriott board meetings is director Debra Lee, chairwoman of BET Holdings, parent company of Black Entertainment Television. Lee not only has given the maximum to Democrat Barack Obama, but is a bundler for his camp and has raised nearly $100,000. The Marriott board is a conglomerate of political givers: four other directors to Obama and/or Hillary Clinton, three others to McCain and/or Mitt Romney.
For 20 years, large companies have recruited directors of color to their boards, and by doing so, they have installed into the corporate system an unforeseen byproduct: political diversity. Among the 200 largest Standard & Poor's 500 companies, 78% have at least one African-American director, says executive search firm Spencer Stuart. Executive search firm Korn/Ferry International says that 78% of Fortune 1000 companies have a director who is a minority, up from 47% in 1995.
And while Obama has substantial support among white business leaders, too, the outcome of efforts at Marriott and elsewhere to diversify the board has meant that at most quarterly meetings, staunch Obama supporters sit congenially, but eye to eye, with those staunchly supporting McCain.
There are strange political boardfellows at Commonwealth Edison, The Gap, General Electric, McDonald's, Time Warner and Wal-Mart, among others. Even Halliburton, where Dick Cheney was chairman before becoming George Bush's running mate eight years ago, has on its board two Obama contributors, including Milton Carroll, African-American chairman of CenterPoint Energy.
Dow Chemical Chairman Andrew Liveris, an Australian citizen who can't vote here, has contributed to McCain and Romney. Dow Chemical director James Bell, an African-American chief financial officer at Boeing, has contributed to Obama. At General Mills, white Chairman Kendall Powell is a McCain contributor. African-American director Dorothy Terrell, an accomplished technology executive, is an Obama bundler who has raised between $50,000 and $100,000.
Nationwide, about 90% of African Americans say they will vote for Obama, vs. 3% for McCain, according to the latest polling by Gallup. African-American directors appear almost as solid in their support, USA TODAY research finds. There are 191 African Americans on the boards of the largest 250 companies, according to Black Enterprise.
Using the Center for Responsive Politics Internet site OpenSecrets.org, USA TODAY was able to identify 99 of the 191 who contributed to at least one presidential candidate during this election cycle. Of those 99, 83% contributed to Obama, and 95% contributed to Obama or Clinton, or both.
Mary Bush, an African American and the newest member of the Marriott board, is a childhood friend of Secretary of State Condoleezza Rice and was appointed by President Bush to chair a commission to reform foreign aid.
"I don't think she will be supporting Obama," Bill Marriott said without knowing that Mary Bush contributed to Obama first, then to McCain. Mary Bush declined comment.