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After Paul Left Corinth: The Influence of Secular Ethics and Social ChangePaperback
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- Publisher: William B Eerdmans Publishing Co
- Format: Paperback | 368 pages
- Dimensions: 153mm x 228mm x 19mm | 547g
- Publication date: 19 March 2001
- Publication City/Country: Grand Rapids
- Illustrations note: 1, black & white illustrations
- Sales rank: 92,904
Product description
After Paul Left Corinth gathers for the first time all the relevant extant material from literary, nonliterary, and archaeological sources on what life was like in the first-century Roman colony of Corinth. Using this evidence, Bruce Winter not only opens a fascinating vista on day-to-day living in the Graeco-Roman world but, more importantly, helps us understand what happened to the Christian community after Paul left Corinth. As Winter shows, the origin of many of the problems Paul dealt with in 1 Corinthians can be traced to culturally determined responses to aspects of life in Corinth. The significance of the role that culture played in the life of the Corinthian Christians has either been ignored or underestimated in explaining the reasons for their difficulties after Paul left. Winter first examines the extent to which Paul communicated alternative ways of behaving while he was in Corinth. Winter then explores the social changes that occurred in Corinth after Paul left. Severe grain shortages, the relocation of the Isthmian Games, the introduction of a new federal imperial cult, the withdrawal of kosher meat from the official market-all of these cultural events had a substantial impact on the life of the emerging Christian community. Accentuated with photos of relevant archaeological artifacts, this volume provides a significant new perspective from which to read Paul's Corinthian correspondence.
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Roman Style Artichokes & Peas
|Baby artichokes
|1 1⁄2 Pound (Each 3 Inches Long)
|1 Medium
|Olive oil
|2 Tablespoon
|Shelled frozen peas/1 cup frozen tiny peas
|1 Pound (About 1 Pound Unshelled)
|Chopped fresh mint
|1⁄4 Cup (4 tbs), chopped
|To Taste
Fill a large bowl with cold water.
Cut lemon in half and squeeze juice into water; then drop lemon halves into water.
Remove tough outer leaves from each artichoke until tender yellow inner leaves are exposed.
Trim base and about 1/2 inch from top of artichoke; cut artichoke in half.
As each artichoke is prepared, drop it into lemon water.
Set aside.
Trim root end and tough green tops from leek.
Split leek lengthwise, rinse thoroughly, and thinly shce crosswise.
Heat oil in a wide frying pan over medium heat.
Add leek and cook, stirring often, until softened (about 5 minutes).
Drain artichokes and add to pan.
Cook, stirring, until hot (about 3 minutes).
Add peas and 1 tablespoon of the mint; stir well.
Pour in 1/3 cup water and bring to a boil; then reduce heat to low, cover, and cook until artichokes are tender when pierced (about 30 minutes), adding a few tablespoons more water if vegetables begin to stick.
Remove vegetables from heat and stir in remaining 3 tablespoons mint.
Season to taste with salt.

subset: commoncrawl


text:
Sunday, January 18, 2009
© Copyright 2015 Gwinnett Daily Post
Applebee's raises $20,000 for organtransplants LAWRENCEVILLE - Greater Atlanta area Applebee's Neighborhood Grill & Bar restaurants partnered with the Georgia Transplant Foundation this holiday season to raise funds for Georgia's organ transplant community. "The Giving Tree" annual fundraising campaign from Nov. 28 to Dec. 24 raised $20,153 for the foundation. Throughout the initiative, AppleCreek Management Co.'s 40 Applebee's locations displayed Christmas trees featuring paper ornaments, set in increments of $1, $5, $10 or $25. Diners made donations by adding the cost of an ornament to their checks. The McDonough Applebee's location brought in the most donations, with a total of $5,368. The Douglasville, Pleasant Hill, Monroe and Town Center locations were the next biggest contributors to the campaign. Gwinnett team wins horse knowledge competition LAWRENCEVILLE - The Gwinnett County 4-H Senior High Horse Quiz Bowl Team on Jan. 10 won the State 4-H annual horse knowledge competition. The contest, held at Rock Eagle 4-H Center in Eatonton, showcases horse knowledge in all aspects of the industry. In the double-elimination style quiz bowl, 4-H members learn not only equine science-related subject matter, but the valuable skills of contributing to a group effort, teamwork, learning to learn, critical thinking, planning, organization, cooperating and communicating. Team members are Kaitlyn Chandler, who served as captain, Lauren Bailey, Mary Davis and Hannah Carruth. The team was coached by 4-H volunteer Lori Chandler. This team will represent Georgia 4-H at the Western National 4-H Roundup in Denver next January. UGA ranked a 'Best Value' by Princeton Review ATHENS - The University of Georgia ranks ninth as the "Best Value" public college for 2009, according to The Princeton Review, which teamed with USA Today to present the "Best Value" colleges list for 2009. According to The Princeton Review, "The University of Georgia's star is rising in academic reputation, as a result of notice from the popular press and the prestigious awards and grants bestowed on faculty and students." The "Best Value" colleges list, reported in the Jan. 8 print edition of USA Today, and online at www.princetonreview.com/bestvaluecolleges and www.BestValueColleges.usatoday.com, features 100 schools in all: 50 public and 50 private colleges and universities. The Princeton Review selected the institutions as its "best value" choices for 2009 based on its surveys of administrators and students at more than 650 public and private colleges and universities. The selection criteria covered more than 30 factors in three areas: academics, cost of attendance and financial aid. Gwinnett Gab appears in the Thursday and Sunday editions of the Gwinnett Daily Post. To submit an item to Gwinnett Gab, e-mail firstname.lastname@example.com.
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- Quiz Bowl gives local college students a big buzz ( January 25, 2009 )


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Star Alliance member carrier LOT Polish Airlines hosted the mid-year Chief Executive Board (CEB) Meeting during which the member carrier CEOs endorsed enhancements to further improve the network travel experience offered to customers and gave the go-ahead for the inclusion of a new member in Brazil.
- 2015 19Star Alliance LAX Lounge Wins SKYTRAX Award - Voted Best Alliance Lounge
The Star Alliance Lounge in the Tom Bradley International Terminal (TBIT) of Los Angeles International Airport (LAX) has been voted best Alliance Lounge by Skytrax.
- 2015 17EVA AIR Ranks "The World's Top Ten Best Airlines" and "Best Airline Cabin Cleanliness" in SKYTRAX's 2015 World Airline Awards
Taiwan's leading independent airline, EVA Air ranks top ten for "The World's Best Airlines of 2015" and the first place for "Best Airline Cabin Cleanliness of 2015" category at SKYTRAX's annual World Airline Awards. Presented at the Paris Air Show on 16th June 2015
- 2015 4EVA Air & Turkish Airlines Initiating Code-Share on Taipei – Istanbul Route Effective from June, 2015
TAIPEI (Jun 04, 2015) –Star Alliance members EVA Air and Turkish Airlines have signed a code share agreement on the Taipei-Istanbul v.v. route to be effective as of today, 2015.
- 2015 27EVA Air Official Wrap-Up Statement Bomb threat against BR12, TPE – LAX 26 May, 2015
After a thorough investigation, the FBI, Los Angeles Police Department Bomb Squad and airport officials have confirmed that the security threat against EVA Air BR12 flight from Taipei to Los Angeles today was a false alarmEVA Air Official Statement Bomb threat against BR12, TPE – LAX 26 May, 2015
EVA Air flight BR12 from Taipei to Los Angeles landed safely at Los Angeles International Airport at 15:40 (3:40 pm) on Tuesday, May 26, 2015. EVA used a Boeing 777-300ER for the flight
- 2015 4EVA to Brighten Texas' Summer Skies with Specially Painted Airplane Introducing Hello Kitty Shining Star Jet flights, Houston-Asia
EVA Air will use its newest Hello Kitty Jet, a brand-new, specially painted Boeing 777-300ER, to launch non-stop flights from Houston to Taipei
- 2015 16EVA Air Hello Kitty Jet Lands in Singapore With Brand New Theme
Singapore to host first EVA Air Hello Kitty jet scheduled for Southeast Asia
- 2015 9EVA Serves Inflight Meals by Michelin Three-Star Nakamura Kyoto "Ichigo ichi," meaning "treasure every encounter for it may never reoccur"
EVA Air has teamed up with three-star Michelin Restaurant Nakamura Kyoto to create gourmet inflight meals for both business and economy passengers on EVA flights from Taipei's Taoyuan International Airport to Osaka, starting on 10 March, 2015. Motokazu Nakamura, the restaurant's sixth-generation chef, is also preparing vegetarian selections so that every passenger can experience the style and techniques of Kyoto's traditional culinary arts and kaiseke dining.
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- 2015 12EVA to Launch Second Fukuoka Route, Fly from Kaohsiung Airline continues to grow Taiwan - Japan service network
EVA Air will launch its second Fukuoka route and begin flights from Kaohsiung in Southern Taiwan on March 31, 2015. Travelers can book flights and reserve seats now for nonstop service between Taiwan's second-largest city and the largest city in Japan's Kyushu region by contacting a travel agent, an EVA ticket office or clicking on the airline' website at www.evaair.com.
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TAIPEI, (February 12, 2015) – Taiwan-based EVA Air unveiled a new "Story Island – Round the World" inflight meal service series designed by renowned album cover designer and four-time Grammy Award nominee Xiao Qing-Yang on February 10, 2015. The specially created tablecloth, menus and wine list will be introduced in EVA's Royal Laurel, Premium Laurel and Business Class cabins, starting March 1, 2015.
- 2015 16EVA Nears Top of Global Airline Safety Index, Ranks 3rd Annual AERO International report scrutinizes 60 largest carriers
Taiwan-based EVA Air ranks third among the world's safest airlines on the annual index reported by Germany's AERO International Magazine. After ranking among the top 10 seven times since 2004, EVA rose from 5th on last year's list to achieve its highest score. The publication's 2014 assessments were released in its February 2015 edition on January 16. With its safety programs, consistent record and high standards, EVA has solid standing among leading international airlines and ranks just behind Cathay Pacific Airways and Emirates on the AERO International list.
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text:
©2015 Boston Globe Media Partners, LLC
Some dealerships may offer July 4th deals, but the holiday weekend can attract lots of customers, so be prepared.
With its 610 horsepower, 5.2-liter, V10 engine, the Huracán is capable of more than 200 mph.
The 2015 Land Rover Discovery Sport makes the vehicle's space work effectively.
In a new CarGuru's report, Boston ranks as number two on a list of cities with consumer interest in Asian cars.
Every year, the list of models on the Cars.com American-Made Index shrinks.
A host of racing cars made their British debuts at the 2015 Goodwood Festival of Speed, an annual hill climb race and car show that attracts thousands of attendees and car buffs.
We have the perfect list of used cars that can help you can feign success without breaking the bank.
A new report by Autotrader showed that shoppers prefer the in-person experience and an overwhelming majority of motorists prefer the experience you can only get...
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text:
This kit caught my eye when i was at the Tigerfest show i had to have it . Im planning on detailing this one. The color im using is Dupli-Color Radiant Silver as a basecoat and the topcoat is Dupli-Color Metalcast Blue Anodized to replicate that Candy Blue that was used on all the Jungle Jim cars.
Heres the box art.
Edited by Car Crazy 81, 08 August 2013 - 09:25 AM.


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Thanks for your thoughts. I would like to clarify the how the 2 sensors will control those 4 cameras with a simple scenario:
Say I want to capture a brown bear. Bears tend to follow the same routes, and so it is easy to set up a photo-trap and take some pictures. I would use 2 laser beams, set up so that they both cross the route of the bear.
On the control unit I would select a sequencial function A->B with a 1 second offset, which means that in case the laser beam A was broken and 1 second later laser beam B was also broken, the control unit will trigger the cameras. This way I can make sure that the bear is aproaching and not departing when trigger goes off.
I will use up to 4 cameras, to capture the scene from different view points. So all cameras are triggered whenever the trigger criteria is fulfilled, but the I will be able to set individual delays and trigger patterns (for instance: continous shooting at the camera's rate, single shot or say 7 shots with a 500 milisec period...).
The reason behind the 2 input 4 output architecture is simple. We need 4 plugs for the 2 sensors, as the lasers will need transmitter and receiver components. There are 4 outputs, simply for allowing the photographer to use multiple cameras for multiple viewpoints. This way we would have 4 input and 4 output plugs.
The XLR plugs I intend to use are faily big, but perfectly suitable for the task. The device would be something wich can be handheld, at least 12cm wide, so that the sensor plugs fit on the top side and the actuator plugs on the bottom side of the device.
We are still in the design phase and that's why we wanted to have some input what kind of features should we integrate into this device and to make some market research too
Thanks once more, if anybody else has something to say, I am very interested.


text:
Call for an expert storm damage assessment and solution
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How is TBRC changing the roofing industry? By helping building owners verify hail damage to their dented metal roofs thru science. TBRC is the only roofing company in the country with an exclusive agreement to an insurance accepted testing process that can scientifically prove hail damage on a dented metal roof panel.


text:
A process control and manufacturing information database client application is disclosed displaying received time-series data in an unambiguous manner when a displayed range of time-series data includes a DST transition for a designated time zone for displaying the data. A data acquisition interface obtains timestamped time-series data values for an observed parameter from the process control and manufacturing information database. The data values are requested/received/stored by the client application, for example, according to the UTC time standard. The client application renders the timestamped time-series data values as a series of points on a time-line graph. The time-line graph includes alphanumeric time labels specified in accordance with a designated time zone. The display function renders the time-line graph without disruptions over a time span containing a Daylight Savings Time (DST) transition for the designated time zone.
1. A computer system having computer readable medium including computer-executable instructions comprising a process control and manufacturing information database client application for displaying received time-series data, the client application comprising:
a data acquisition interface for obtaining timestamped time-series data values for an observed parameter from the process control and manufacturing information database; and
a display function for rendering the timestamped time-series data values as a series of points on a time-line graph including alphanumeric time labels specified in accordance with a designated time zone, and the display function renders the time-line graph without disruptions over a time span containing a Daylight Savings Time (DST) transition for the designated time zone.
2. The computer system of
3. The computer system of
4. The computer system of
a time zone designation interface comprising a list of named entities and associated time zone identification information.
5. The computer system of
6. The computer system of
7. The computer system of
8. The computer system of
9. A method for displaying, by a process control and manufacturing information database client application, received time-series data, the method comprising the steps of:
obtaining, by a data acquisition interface of the client application, timestamped time-series data values for an observed parameter from the process control and manufacturing information database; and
rendering, by a display function of the client application, the timestamped time-series data values as a series of points on a time-line graph including alphanumeric time labels specified in accordance with a designated time zone, and during the rendering step the display function renders the time-line graph without disruptions over a time span containing a Daylight Savings Time (DST) transition for the designated time zone.
10. The method of
11. The method of
12. The method of
presenting, via a time zone designation interface, a list of named entities and associated time zone identification information.
13. The method of
14. A computer readable medium including computer-executable instructions for displaying, by a process control and manufacturing information database client application, received time-series data, the computer-executable instructions facilitating performing the steps of:
obtaining, by a data acquisition interface of the client application, timestamped time-series data values for an observed parameter from the process control and manufacturing information database; and
rendering, by a display function of the client application, the timestamped time-series data values as a series of points on a time-line graph including alphanumeric time labels specified in accordance with a designated time zone, and during the rendering step the display function renders the time-line graph without disruptions over a time span containing a Daylight Savings Time (DST) transition for the designated time zone.
15. The computer-readable medium of
16. The computer-readable medium of
17. The computer-readable medium of
presenting, via a time zone designation interface, a list of named entities and associated time zone identification information.
18. The computer-readable medium of
19. The computer-readable medium of
20. The computer-readable medium of
The present invention generally relates to computing and networked data storage systems, and, more particularly, to techniques for managing (e.g., storing, retrieving, processing, etc.) streams of supervisory control, manufacturing, and production information. Such information is typically rendered and stored in the context of supervising automated processes and/or equipment. The data is thereafter accessed by a variety of database clients such as, for example, by trending applications.
Industry increasingly depends upon highly automated data acquisition and control systems to ensure that industrial processes are run efficiently and reliably while lowering their overall production costs. Data acquisition begins when a number of sensors measure aspects of an industrial process and report their measurements back to a data collection and control system. Such measurements come in a wide variety of forms. By way of example the measurements produced by a sensor/recorder include: a temperature, a pressure, a pH, a mass/volume flow of material, a counter of items passing through a particular machine/process, a tallied inventory of packages waiting in a shipping line, cycle completions, etc. Often sophisticated process management and control software examines the incoming data associated with an industrial process, produces status reports and operation summaries, and, in many cases, responds to events/operator instructions by sending commands to actuators/controllers that modify operation of at least a portion of the industrial process. The data produced by the sensors also allow an operator to perform a number of supervisory tasks including: tailor the process (e.g., specify new set points) in response to varying external conditions (including costs of raw materials), detect an inefficient/non-optimal operating condition and/or impending equipment failure, and take remedial action such as move equipment into and out of service as required.
A very simple and familiar example of a data acquisition and control system is a thermostat-controlled home heating/air conditioning system. A thermometer measures a current temperature, the measurement is compared with a desired temperature range, and, if necessary, commands are sent to a furnace or cooling unit to achieve a desired temperature. Furthermore, a user can program/manually set the controller to have particular setpoint temperatures at certain time intervals of the day.
Typical industrial processes are substantially more complex than the above-described simple thermostat example. In fact, it is not unheard of to have thousands or even tens of thousands of sensors and control elements (e.g., valve actuators) monitoring/controlling all aspects of a multi-stage process within an industrial plant or monitoring units of output produced by a manufacturing operation. The amount of data sent for each measurement and the frequency of the measurements varies from sensor to sensor in a system. For accuracy and to facilitate quick notice/response of plant events/upset conditions, some of these sensors update/transmit their measurements several times every second. When multiplied by thousands of sensors/control elements, the volume of data generated by a plant's supervisory process control and plant information system can be very large.
Specialized process control and manufacturing/production information data storage facilities (also referred to as plant historians) have been developed to handle the potentially massive amounts time-series of process/production information generated by the aforementioned systems. An example of such system is the WONDERWARE IndustrialSQL Server historian. A data acquisition service associated with the historian collects time-series data values for observed parameters from a variety of data sources (e.g., data access servers). The collected time-series data is thereafter deposited with the historian to achieve data access efficiency and querying benefits/capabilities of the historian's relational database. Through its relational database, the historian integrates plant data with event, summary, production and configuration information.
Traditionally, plant databases, referred to as historians, have collected and stored in an organized manner (i.e., "tabled"), to facilitate efficient retrieval by a database server, streams of timestamped time-series data values for observed parameters representing process/plant/production status over the course of time. The status data is of value for purposes of maintaining a record of plant performance and presenting/recreating the state of a process or plant equipment at a particular point in time. Significant effort has been expended to ensure that, at the time of acquisition, data is accurately timestamped by synchronized data acquisition points in a distributed enterprise. System designers have gone so far as to install Global Positioning System receivers to synchronize the clocks of the data acquisition points. Each node uses an exact same time frame (e.g., Coordinated Universal Time (UTC), Eastern Standard Time (US), etc.) when assigning timestamps. Thus, when data is accumulated by a historian from a variety of locales across multiple time zones, the information is completely synchronized.
Information is retrieved from the tables of historians and displayed by a variety of historian database client applications including trending and analytical applications at a supervisory level of an industrial process control system/enterprise. Such applications include displays for presenting/recreating the state of an industrial process or plant equipment at any particular point (or series of points) in time. A specific example of such client application is the WONDERWARE ActiveFactory trending and analysis application. This trending and analysis application provides a flexible set of display and analytical tools for accessing, visualizing and analyzing plant performance/status information.
Process historians, and the data sources that provide them with timestamped content that fills their tables, generally operate continuously. Furthermore, it is common practice today for geographically distributed enterprises to have timestamped time-series data values for observed parameters provided by historians to geographically remote client applications anywhere in the world, via the Internet or other long distance data communications networks.
In accordance with the present invention, a client application coordinates time zone and daylight savings time designations to timestamps associated with received timestamped time-series process data to ensure that the process data, when retrieved and presented to a user by the client application, correctly displays dates/times associated with a series of timestamped data points as a continuum and unambiguously reflects the time zone and the DST in effect for any particular timestamped data point of interest.
The present invention comprises a process control and manufacturing information database client application for displaying received time-series data in an unambiguous manner when a displayed range of time-series data includes a DST transition for a designated time zone for displaying the data. The client application comprises a data acquisition interface for obtaining timestamped time-series data values for an observed parameter from the process control and manufacturing information database. The data values are requested/received/stored by the client application, for example, according to the UTC time standard. The client application also includes a display function for rendering the timestamped time-series data values as a series of points on a time-line graph. The time-line graph includes alphanumeric time labels specified in accordance with a designated time zone. The display function renders the time-line graph without disruptions over a time span containing a Daylight Savings Time (DST) transition for the designated time zone.
In accordance with an aspect of an embodiment of the invention, an interface (e.g., dialog box) is provided that allows users to designate a time-zone context for the labels of the time-line graph that displays the time-series data for a particular time period. In a particular example, the historian client application maintains a record of the time zone currently assigned to various entities including: the historian client application, historian servers (the sources of trending data), and the client machine upon which the historian client application resides. The set of entities and associated time zones are extensible and are user modifiable to include any number of potentially relevant entities (e.g., central headquarters, a remote observation facility, etc.) and their associated time zones.
While the appended claims set forth the features of the present invention with particularity, the invention, together with its objects and advantages, may be best understood from the following detailed description taken in conjunction with the accompanying drawings of which:
A control system/plant historian service supports retrieval operations wherein previously tabled data is provided on demand and in response to client requests. The term "tabled" is used herein to describe data received by the database/historian server and stored in an organized manner to facilitate later retrieval by the database/historian server in response to client requests. The terms "client requests" and "on demand" are intended to be broadly defined. A "client request", unless specifically noted, includes requests initiated by human machine interface users and requests initiated by automated client processes.
Client applications that request and display trending timestamped data provided, for example, by the aforementioned historian server over a designated time span have not adequately addressed presenting data across differing time zones and interruptions/overlaps created by Daylight Savings Time (DST) changes. Process historians generally operate continuously, often archiving data from diverse locations using a synchronized timer/format (e.g., UTC), but also capable of rendering data in a time zone-specific context (such as the time zone of the physical computer upon which a process historian resides). As will be shown by way of graphic illustrations, a historian client application embodying the present invention displays date/time as a non-overlapping and continuous sequence of data values and associated timestamps. The graphical displays of trending data values, for selected status variables, unambiguously incorporate the daylight savings time (DST) in effect for a designated time zone for each displayed time label (e.g., a horizontal axis, a particular data point referenced on a graph, a pointer/slider control, etc.).
Further, the historian client application embodying the present invention supports maintaining/enumerating a set of time zones for a set of entities of particular interest to a user. The entities and their associated time zones are presented, for example, in a dialog box or other suitable enumeration display interface. Thereafter, in an exemplary embodiment a user need only select an entry for an entity in the set of entities in the enumeration display interface to view the historian's information according to the time-frame of the selected entity. Alternatively, the entries merely display an entity and corresponding time zone. A user selects a time zone from a list (e.g., a drop-down list) of time zones using the enumerated entities and their associated time zones as a guide. Examples of such enumerated entities and associated time zones include the historian server, or the client application itself which is presenting the information. In the illustrative embodiment, the configured time zones of the data sources (e.g., historians) and client machine are acquired by the historian client application without user intervention. Therefore users of the historian client application need not know the specific time zone associated with the data sources or the machine upon which the client application resides to view trending data rendered in graphical form by the client application in the time zone context of the particular entity of interest.
The following description is based on illustrative embodiments of the invention and should not be taken as limiting the invention with regard to alternative embodiments that are not explicitly described herein. Those skilled in the art will readily appreciate that the illustrative example in
The exemplary network environment includes a production network 110. In the illustrative embodiment the production network 110 comprises a set of client application nodes 112 that execute, by way of example, trending applications that receive and graphically display time-series values for a set of data points. One example of a trending application is Wonderware's ACTIVE FACTORY application software. The data driving the trending applications on the nodes 112 is acquired, by way of example, from the plant historian 100 that also resides on the production network 110. Alternatively, the client applications reside on non-local nodes communicatively connected to the historian 100 via a wide area network link. The historian 100 includes database services for maintaining and providing a variety of plant/process/production information including historical plant status, configuration, event, and summary information.
A data acquisition service 116, for example WONDERWARE'S remote IDAS, interposed between the I/O servers 104 and the plant historian 100 operates to maintain a continuous, up-to-date, flow of streaming plant data between the data sources 102 and the historian 100 for plant/production supervisors (both human and automated). The data acquisition service 116 acquires and integrates data (potentially in a variety of forms associated with various protocols) from a variety of sources into a plant information database, including timestamped data entries, incorporated within the historian 100.
The physical connection between the data acquisition service 116 and the I/O servers 104 can take any of a number of forms. For example, the data acquisition service 116 and the I/O servers can comprise distinct nodes on a same network (e.g., the plant floor network 110). However, in alternative embodiments the I/O servers 104 communicate with the data acquisition service 116 via a network link that is separate and distinct from the plant floor network 101. In an illustrative example, the physical network links between the I/O servers 104 and the data acquisition service 116 comprise local area network links (e.g., Ethernet, etc.) that are generally fast, reliable and stable.
The connection between the data acquisition service 116 and the historian 100 can also take any of a variety of forms. In an embodiment of the present invention, the physical connection comprises an intermittent/slow connection 118 that is potentially: too slow to handle a burst of data, unavailable, or faulty. The data acquisition service 116 and/or the historian therefore include components and logic for handling streams of time-series data values for observed parameters from components connected to the plant floor network 101. The time-series data received by the historian 100 are preferably assigned timestamps at the point of acquisition rather than at the time of reception by the historian 100 to ensure the values are properly sequenced. Furthermore, the points of acquisition preferably utilize synchronized clocks (e.g., GPS clock signal) to ensure that all sources of data accurately assign timestamps to their data prior to submission to the historian 100 (via the data acquisition service 116).
Turning to
By way of example, the tables 202 include time-series pieces of data values for observed parameters received by the historian 100 via a data acquisition interface to a process control/production information network such as the data acquisition service 116 on network 101. In the illustrative embodiment each piece of data is stored in the form of a value, quality, and timestamp. These three parts to each piece of data stored in the tables 202 of the historian 100 are described briefly herein below.
The historian 100 tables data received from a variety of "real-time" data sources, including the I/O Servers 104 (via the data acquisition service 116). The historian 100 is also capable of accepting "old" data from sources such as text files. By way of example, "real-time" data can be defined to exclude data with timestamps outside of �30 seconds of a current time of a clock maintained by a computer node hosting the historian 100. However, data characterizing data is also addressable by a quality descriptor associated with the received data. Proper implementation of timestamps requires synchronization of the clocks utilized by the historian 100 and data sources. In an exemplary embodiment, all data values are assigned UTC timestamps. However, this is not essential for carrying out the present invention. The client application need only know, through implicit/explicit designation, the time zone assigned to the timestamp for a data point value.
The Historian 100 supports two descriptors of data quality: "QualityDetail" and "Quality." The Quality descriptor is based primarily on the quality of the data presented by the data source, while the QualityDetail descriptor is a simple indicator of "good", "bad" or "doubtful", derived at retrieval-time. Alternatively, the historian 100 supports an OPCQuality descriptor that is intended to be used as a sole data quality indicator that is fully compliant with OPC quality standard(s). In the alternative embodiment, the QualityDetail descriptor is utilized as an internal data quality indicator.
A value part of a stored piece of data corresponds to a value of a received piece of data. In exceptional cases, the value obtained from a data source is translated into a NULL value at the highest retrieval layer to indicate a special event, such as a data source disconnection. This behavior is closely related to quality, and clients typically leverage knowledge of the rules governing the translation to indicate a lack of data, for example by showing a gap on a trend display.
The following is a brief description of the manner in which the historian 100 receives time-series data for observed parameters from a real-time data source and stores the data as a timestamp, quality and value combination in one or more of its tables 202. The historian 100 receives a data point for a particular tag (named data value) via the storage interface 200. The historian compares the timestamp on the received data to: (1) a current time specified by a clock on the node that hosts the historian 100, and (2) a timestamp of a previous data point received for the tag. If the timestamp of the received data point is earlier than, or equal to the current time on the historian node then:
On the other hand, if the timestamp of the point is later than the current time on the historian 100's node (i.e. the point is in the future), the point is tabled with a timestamp equal to the current time of the historian 100's node. Furthermore, a special value is assigned to the QualityDetail descriptor for the received/tabled point value to indicate that its specified time was in the future (the original quality received from the data source is stored in the "quality" descriptor field for the stored data point).
The historian 100 can be configured to provide the timestamp for received data identified by a particular tag. After proper designation, the historian 100 recognizes that the tag identified by a received data point belongs to a set of tags for which the historian 100 supplies a timestamp. Thereafter, the timestamp of the point is replaced by the current time of the historian 100's node. A special QualityDetail value is stored for the stored point to indicate that it was timestamped by the historian 100. The original quality received from the data source is stored in the "quality" descriptor field for the stored data point.
As will be appreciated from the above-discussion, the historian 100 is capable of storing timestamped data in a variety of ways. This variability extends to handling of time zones associated with the timestamps. In an exemplary embodiment the historian 100 assigns timestamps for received/tabled data values according to a single configured time zone standard. By way of example, the time zone used to store the time stamped data is based upon the currently configured time zone of a database server machine (or machines) upon which the historian 100 operates. Alternatively, the time zone is based upon a user-configured selection that overrides the time zone presently associated with a server machine. Yet other embodiments of the historian 100 utilize the UTC time zone standard.
In an illustrative embodiment, the time zone associated with data stored within the historian 100 is inconsequential to a historian client application because the historian server provides the requested data according to a requested time zone. By way of example, the client application requests and receives data according to the UTC time zone standard. In an alternative embodiment the historian client application converts the timestamped data, upon receipt from the historian, to a single standardized time zone (e.g., UTC). Requesting/receiving data from the historian according to a particular time zone (e.g., UTC) and/or converting a time zone for timestamped data at the time of storing data received from the historian 100, so that the received data is stored according to the particular time zone (e.g., UTC) is separate and distinct from applying a designated time zone when a trending application displays a sequence of such previously stored timestamped data values for one or more monitored parameters/variables of a process or manufacturing operation.
It is also noted that in an exemplary embodiment the historian 100 supports application of a rate deadband filter to reject new data points for a particular tag where a value associated with the received point has not changed sufficiently from a previous stored value for the tag.
Having described a data storage interface for the historian 100, attention is directed to retrieving the stored data from the tables 202 of the historian 100. Access, by data acquisition interfaces of clients of the historian 100, to the stored contents (e.g., time-series data values for observed parameters) of the tables 202 is facilitated by a retrieval interface 206. The retrieval interface 206 exposes a set of functions/operations/methods callable by the data acquisition interfaces of client applications residing on client nodes attached to the network 110 (e.g., a trending client application executing on node 112 a), for querying the contents of the tables 202.
In response to receiving a query message, the retrieval interface 206 supplies timestamped series data to the requesting client application. In an exemplary embodiment, the timestamps for the data provided via the retrieval interface 206 of the historian are based upon any time zone standard specified by the client application (e.g., UTC). The client applications, by way of example, request and store time-series data values from the retrieval interface 206 of the historian 100 according to a single time zone standard (e.g., UTC). Alternatively, the client applications convert the timestamps of received time-series data values to the single time zone standard upon receipt from the historian 100. Thereafter, the client applications present the timestamped data via a graphical display with time labels based upon a designated presentation time zone that is potentially different from the time zone standard used to store the data on the client application's machine.
In order to display the data in a meaningful manner, when presenting the received data series to a user, the client application on node 112 a converts the received timestamped data series times in accordance with a configurable, user-designatable time zone entity selected via a time zone configuration dialog/interface (see, e.g.,
Turning to
Turning to
Similarly, turning to
Turning to
The presence of two, "2:00" time labels on the horizontal graph may create user confusion. Therefore, in an alternative embodiment, a "1" is placed along-side the "2:00" label on the horizontal axis of the graph to provide a special indication of the DST/standard transition to an observer of the display.
As mentioned previously herein above, an exemplary historian client application assigns time labels for retrieved data for viewing by a user based upon a designated time zone (or alternatively an entity with an affiliated time zone). The historian client application, prior to presenting any time label for a line chart on a display, converts the label from a continuous base time zone (e.g., UTC) used to determine point positions on the graph to a currently designated time zone that may include disruptions due to DST transitions. The conversion includes applying any applicable DST status changes associated with the designated time zone. The actual data points are plotted/presented along a time continuum (without either gaps or overlaps) on the time-line graph including the converted labels. In an exemplary embodiment, plotting the data points as a continuum is achieved by utilizing their assigned UTC values to plot their positions on a time-line graph. The actual method/order of execution for generating the plot of data points, without discontinuities or overlaps, and assigning time labels to a time axis of the graph varies in accordance with embodiments of the invention.
Turning to
However, in an alternative embodiment, additional functionality is associated with the list field 502. First, the list field 502 of the historian client application is configurable/extensible to allow a user to add any desired further "entity" entries and specified time zone and DST transition dates/times. Thus, the configurable/extensible list 502 supports identifying a time zone context (thereafter designated in the time zone field 500) for displaying continuous time-series (e.g., trend) data in cases where a user is aware of a particular listed entity for which a time context is desired. However, the user need not know the particular time zone within which the entity resides and/or the DST status for the entity.
Having described an exemplary functional/structural arrangement for a historian incorporating time-zone context configuration and presentation features, attention is directed to a flow diagram summarizing states representing the general operation of the historian client application (running on node 112 a) identified in
At stage 602 a user of the historian client application, via the time zone designation interface depicted in
Thereafter, during stage 604 the client application presents/positions time-series data point values for selected parameters/variables over a designated time span (potentially including a DST transition) as a continuum—i.e. without gaps/overlaps at DST transitions—on a time-line graph. The positions of the data point values along a time axis of the time-line graph are determined, as noted above, in accordance with a continuous (uninterrupted/non-repeated) time span associated with the graph. In an exemplary embodiment, the data values are stored by the client application with UTC timestamps—which do not contain DST transitions/discontinuities. The data points are thereafter positioned on the line graph according to their UTC timestamp values. Laying out the data values on a graph according to their UTC timestamp values avoids DST transition gaps/overlaps. As shown in
Furthermore, during stage 604, the time labels/text assigned to various elements (e.g., time division markers on the horizontal axis, slider bar, etc.) of the displayed graph are generated by applying the client application's current time zone context, designated during stage 602, to each UTC time value. Thus, if a selected time span for a designated time zone context traverses a DST status change, then one or more labels falling on or after the DST transition are positioned along the graph's horizontal (time) axis according to their UTC values in relation to the continuous (i.e., uninterrupted/non-overlapping) time span represented by the graph; however, the corresponding alphanumeric string for any label is generated based upon the currently selected time zone context. In accordance with various embodiments of the invention, any continuous (non-interrupted) timing convention serves as the basis for storing data values and marking the relative temporal positions between a beginning/end of a time span represented in a displayed time-line graph. Such values are converted according to a specified time zone context when generating time labels on the displayed graph.
Turning to
At step 612 the historian client application generates one or more lines (706) representative of values for one or more data points over the designated time span. The position of the data points along the horizontal (time) axis is based upon actual elapsed time from the beginning of the designated time period and do not take into consideration DST transitions for a selected time zone context. In an exemplary embodiment, the positions of data points on the graph are based upon the UTC timestamps stored with the data points upon receipt from a historian server.
At step 614 the historian client application generates alphanumeric time labels for the line graph. In contrast to the placement of data points and time divisions on the graph during steps 610 and 612, the text time labels generated and displayed on the graph during step 614 take into consideration the historian client application's currently designated time zone context and any DST transitions falling within the continuous time span of the graph. Examples of labels generated during step 614 include time division marker times (710), slider data value selection controls (712, 714), specific data points representing actual data point values provided by the historian—as opposed to values falling on a line connecting two actual data point values.
Furthermore, in an illustrative example, if a DST transition falls within a displayed time span, then an appropriate label is generated for that point in time on the horizontal axis of the graph to prevent user confusion arising from the DST transition (gap/overlap). One way to provide a label to avoid such confusion is by providing two, side-by-side, values at any transition—as shown in
In view of the many possible embodiments to which the principles of this invention may be applied, it should be recognized that the embodiments described herein with respect to the drawing figures, as well as the described alternatives, are meant to be illustrative only and should not be taken as limiting the scope of the invention. The functional components disclosed herein can be incorporated into a variety of programmed computer systems as computer-executable instructions (provided on a computer-readable medium) in the form of software, firmware, and/or hardware. Furthermore, the illustrative steps may be modified, supplemented and/or reordered without deviating from the invention. Therefore, the invention as described herein contemplates all such embodiments as may come within the scope of the following claims and equivalents thereof.
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School Overview
|School Membership(s)School Assoc.
|National Catholic Educational Association (NCEA)
|Religious Affiliation
|Roman Catholic
|Grades Offered
|Grades 9 - 12
|Year Founded
Student Body
|Total Students
|325 students
|Student Body Type
|% Students of Color
State avg.: 32%
|Students by Grade
Academics and Faculty
|Total Classroom Teachers
|30 teachers
|Student : Teacher Ratio
National avg.: 13:1
|% Faculty w/Advanced Degree
|Average Class Size
|18 students
|Number of AP Courses
|7 courses
|List of Courses Offered
|Link to List of Courses
|Classroom Dress Code
(School uniform)
Finances and Admission
|Admission Deadline
|None / Rolling
|Yearly Tuition Cost
|% on Financial Aid
|Admissions Director
|Tatyana Rodriguez
|Admissions Associate
|Samara Galvan
|Total Sports Offered
|9 sports
|Baseball, Basketball, Cheering, Cross Country, Flag Football, Soccer, Softball, Track and Field, VolleyballBaseball, Basketball,
Cheering, Cross Country,
Flag Football, Soccer,
Softball, Track and Field,
|Total ExtracurricularsTotal Extra-curric.
|23 extracurriculars
|Ambassadors Club, Arts Reaching To Society, Black Student Umoja, Cheerleading, Chess Club, Debate, Drama Club, Gospel Choir, Holy Trinity Women In Action, Job Book Club, Link Crew, National Honor Society, Newspaper, Parents as Partners, Pet Club, Poetry Club, Poetry Slam, Student Council, Student Organization of Latinos, Tech Squad, Virtual Tigers Computer Gaming Club, Yearbook, Young Alumni Committee Cheerleading, Chess Club, Debate, Drama Club, Gospel Choir, Job Book Club, Link Crew, Newspaper, Pet Club, Poetry Club, Poetry Slam, Tech Squad, Yearbook, Ambassadors Club,
Arts Reaching To Society,
Black Student Umoja,
Holy Trinity Women In Action,
National Honor Society,
Parents as Partners,
Student Council,
Student Organization of Latinos,
Virtual Tigers Computer Gaming Club,
Young Alumni Committee,
School Notes:
Profile last updated: 01/10/2014
Nearby Schools:
- School Location Miles Students Grades
ChicagoNear North Montessori School
1434 W Division Street
Chicago, IL 60642
(773)384-1434Montessori School0 mi | 519 students | Gr. PK-8
ChicagoEarly College High School
1135 N Cleaver St
Chicago, IL 60642
(773)935-9925Alternative School0.2 mi | 141 students | Gr. 9-12
ChicagoSt Stanislaus Kostka School
1255 N Noble St
Chicago, IL 60642
(773)278-4560(Roman Catholic)0.2 mi | 222 students | Gr. PK-8
ChicagoSt Mary Of The Angels School
1810 N Hermitage Ave
Chicago, IL 60622
(773)486-0119(Roman Catholic)0.8 mi | 223 students | Gr. PK-8
ChicagoEsperanza School
520 N Marshfield Ave
Chicago, IL 60622
(312)243-6097Special Education School0.8 mi | 47 students | Gr. K-12


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petsupplies.com > Dog Supplies > Beds > Crate Pads > Item # 402886
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Available formats: epub mobi pdf rtf lrf pdb txt html
Sam Hunter - the best selling author of the Makaveli's Prince books. Book One is a genuine master piece and hip-hop's answer to The Da Vinci Code. Find out who is next in line to the vacant throne of hip-hop and discover its darkest secrets.
The urban fiction genre has no rival when it comes to action, gun-play and life on the streets. Sam Hunter is a writer with depth, whose books you won't be able to put down. Packed with conspiracy, drama and centered on strong female characters, you're in for a ride.
Sam Hunter welcomes you to reach out to him via Facebook, Twitter or Google+.


text:
MotoGP Austin, April 19-21, 2013
View Single Post
where's ya too?
Joined: Feb 2008
Location: Stoney Creek, ON
Oddometer: 107
Originally Posted by
Lot G was only closed on Friday. You could park there on Sat/Sun. We did.
Yep, we parked in G for Sat/Sun. The signage leaving Friday was clear. Fri morning was different. As I'm sure you know G was blocked off without any info or persons to explain. F had a couple of people who didn't know anything other than F was closed as well and to head towards the grandstand and make a uturn to access another lot. After doing that we were then sent back out the entrance we came in to go to lot M. When we got there they were shocked they were sending G as well. We didn't mind doing that but to know why would have made it less frustrating.
Everything else about the event was great (minus timing issues). I agree with Jim Moore above, any event regardless has prices like this for food and drink. To be shocked at this is like being shocked at the fact you need oxygen to live. I'm not saying they should be this high but they are.
I was super happy to have seen the small(ish) sign at the Motul booth advertising the Tech 3 team signing Saturday. I was about 6-7th in line to meet Bradley and Cal. Got a poster & hat signed.
We had a good time in Austin all around, from the bats on the Congress St. bridge, 6th street, the food. I hope we'll be able to go back for another race.
Stoney Creek, ON
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Roast Turkey With Orange-Rice Stuffing
|12 Pound
|1 Cup (16 tbs)
|Chopped onion
|1 Cup (16 tbs)
|Orange juice
|1 Cup (16 tbs)
|Grated orange rind
|3 Tablespoon
|Chopped celery
|4 Cup (64 tbs)
|Poultry seasoning
|1 Teaspoon
|Precooked rice
|5 1⁄3 Cup (85.33 tbs)
|Chopped parsley
|1⁄2 Cup (8 tbs)
Pat turkey cavity dry with paper toweling, leaving outside moist.
Sprinkle cavity with salt to taste and pepper.
Melt butter in large saucepan; add onion.
Saute until onion is tender but not browned.
Add 4 cups water, orange juice, orange rind, celery, 2 tablespoons salt and poultry seasoning.
Bring to a boil; stir in rice.
Cover; remove from heat.
Let stand for 5 minutes; stir in parsley, fluffing rice with fork.
Stuff rice mixture into neck and body cavity of turkey.
Fasten neck skin to body with skewer.
Push legs under band of skin at tail.
Place turkey, breast side up, in shallow roasting pan.
Cover with loose tent of aluminum foil if desired.
Bake at 325 degrees for 4 hours and 30 minutes.
Let stand for 15 to 20 minutes for easier carving.


text:
A stackable layer and stacked multilayer module are disclosed. Individual integrated circuit die are tested and processed at the wafer level to create vertical area interconnect vias for the routing of electrical signals from the active surface of the die to the inactive surface. Vias are formed at predefined locations on each die on the wafer at the reticle level using a series of semiconductor processing steps. The wafer is passivated and the vias are filled with a conductive material. The bond pads on the die are exposed and a metallization reroute from the user-selected bond pads and vias is applied. The wafer is then segmented to form thin, stackable layers that can be stacked and vertically electrically interconnected using the conductive vias, forming high-density electronic modules which may, in turn, be further stacked and interconnected to form larger more complex stacks.
1. An electronic module comprising:
a plurality of semiconductor chip layers, wherein at least one of the plurality of semiconductor chip layers includes a semiconductor substrate having a first surface and a second surface;
electronic circuitry comprising a plurality of circuit elements defined on the first surface during a predetermined series of semiconductor process steps using a predetermined reticle set;
a trench having an interior surface between at least one of the plurality of circuit elements and the second surface, wherein the trench is defined concurrently with the electronic circuitry during the predetermined series of semiconductor process steps using the predetermined reticle set;
a dielectric material located on the interior surface;
an electrically conductive material located on the dielectric material;
an electrically conductive via defined by removing a predetermined portion of the second surface to expose the electrically conductive material, wherein the plurality of semiconductor chip layers are stacked and bonded to form a module, and wherein the electrically conductive via electrically couples the electronic circuitry of the at least one of the plurality of semiconductor chip layers to the electronic circuitry of at least one other of the plurality of semiconductor chip layers in the electronic module; and
an element disposed between at least two of the plurality of semiconductor chip layers and configured to provide thermal management for at least one of the plurality of semiconductor chip layers.
2. The electronic module of
3. The electronic module of
4. The electronic module of
5. The electronic module of
6. An electronic module comprising:
a plurality of semiconductor chip layers; and
an element located between two of the plurality of semiconductor chip layers and configured to provide thermal management for at least one of the plurality of semiconductor chip layers;
wherein at least one of the plurality of semiconductor chip layers includes:
a substrate comprising a first surface and a second surface;
electronic circuitry comprising a circuit element formed on the first surface;
a trench located in the first surface between the circuit element and the second surface of the substrate, wherein the trench has an interior surface;
a dielectric material on the interior surface of the trench; and
a conductive material located within the trench and configured to form an electrically conductive via between the first and second surfaces of the substrate, wherein the electrically conductive via is electrically connected to the electronic circuitry.
7. The electronic module of
8. The electronic module of
9. The electronic module of
10. The electronic module of
11. The electronic module of
12. The electronic module of
13. The electronic module of
14. The electronic module of
15. The electronic module of
16. The electronic module of
17. An electronic module comprising:
an element located between a first semiconductor chip layer and a second semiconductor chip layer and configured to provide thermal management for at least one of the first and second semiconductor chip layers, wherein the first and second semiconductor chip layers each include:
a substrate comprising a first surface and a second surface, wherein the first surface has electronic circuitry provided thereon;
a trench in the first surface between the electronic circuitry and the second surface, wherein the trench has an interior surface covered, at least in part, by a dielectric material; and
a conductive material disposed within the trench to form an electrically conductive via between the first and second surfaces of the substrate.
18. The electronic module of
19. The electronic module of
20. The electronic module of
21. The electronic module of
22. The electronic module of
23. The electronic module of
24. The electronic module of
25. The electronic module of
26. A semiconductor chip layer comprising:
a substrate including a first surface and a second surface;
electronic circuitry including a circuit element disposed on the first surface;
a trench in the first surface between the circuit element and the second surface of the substrate, wherein the trench has an interior surface with a dielectric material thereon;
a conductive material disposed within the trench and configured to act as an electrically conductive via between the first surface of the substrate and the second surface of the substrate; and
an element adjacent to at least one of the first or second surfaces of the substrate and configured to provide thermal management for at least one of the substrate or the electronic circuitry.
27. The semiconductor chip layer of
28. The semiconductor chip layer of
29. The semiconductor chip layer of
30. The semiconductor chip layer of
31. The semiconductor chip layer of
32. The semiconductor chip layer of
33. The semiconductor chip layer of
34. The semiconductor chip layer of
This application is a continuation in part of U.S. patent application Ser. No. 10/663,371, filed on Sep. 16, 2003, now abandoned entitled "Stacked Microelectronic Module With Vertical Interconnect Vias", which in turn, claims priority to provisional application No. 60/410,895, filed on Sep. 16, 2002, and this application is a continuation in part of U.S. patent application Ser. No 11/003,429 filed on Dec. 6, 2004, entitled "Wearable Biomonitor With Flexible Thinned Integrated Circuit", which, in turn is a division of application Ser. No. 10/197,006 filed on Jul. 16, 2002, now abandoned which is a continuation-in-part of U.S. patent application Ser. No. 09/190,378 filed Nov. 10, 1998, now abandoned entitled "Method for Thinning Semiconductor Wafers with Circuits and Wafers Made by the Same", which claims the benefit of provisional application Ser. No. 60/065,088, filed Nov. 11, 1997, entitled "Method for Thinning Semiconductor Wafers with Circuits" and claims the benefit of U.S. provisional patent application Ser. No. 60/305,353, filed Jul. 16, 2001, entitled "Biomonitor Device", all of which are incorporated herein by reference.
1. Field of the Invention
The invention relates to electronic integrated circuit chips. Specifically, the invention relates to a method for forming conductive vias in semiconductor wafers and die to form high density electrical interconnection structures and a device made from the method.
2. Description of the Prior Art
Industry continues to seek devices that allow high-density electronic circuitry to occupy a very small space. Satellites, aerospace applications, military weaponry and surveillance, and consumer electronics all require ever-smaller electronic circuitry. It has been determined that stacking layers of electronic circuitry and vertically interconnecting the layers provides a significant increase in circuit density per unit area. Examples of related three-dimensional stacking inventions are disclosed in a number of patents issued to common assignee, Irvine Sensors Corp., such as U.S. Pat. No. 6,560,109, U.S. Pat. No. 4,525,921, and U.S. Pat. No. 4,646,128, each of which is incorporated herein by reference.
High-speed electronic applications operating in the gigahertz range also create unique circuit design concerns with respect to capacitance, inductance and "time of flight" for electron travel. Shorter lead lengths within a high-speed circuit help minimize these design concerns.
It has been determined that stacking of individual, unpackaged, integrated circuit die allows for a very small form factor, while achieving ultra-high circuit density and minimal lead lengths. But stacking of individual circuit die undesirably includes yield problems when a stack includes a failed layer, as well as complications related to interfacing, wire bonding and/or side-bussing of stacked integrated circuit die. Additionally, wirebonding interface interconnects creates longer lead lengths with associated problems of cross talk and electron time of flight.
Conductive via interconnects can be used beneficially to electrically connect a semiconductor layer with electronic circuitry with an adjacent layer but, because of the fabrication processes associated with via formation, existing electronic circuitry can be damaged during via formation. This is because via formation presently occurs after the electronic circuitry is formed on the semiconductor wafer of substrate. Because of the photolithographic and etching processes associated with via formation, the fragile electronic circuitry on a die or wafer can easily be damaged.
Therefore, a need exists in the art which allows for the efficient, scalable stacking of integrated circuit die which reduces yield problems, manufacturing concerns and problems associated with wire bonding and unnecessary lead lengths.
The present invention includes stackable layers comprised of individual, pretested integrated circuit die, or substrates, that are unpackaged. One or more vias, or trenches, are formed at predetermined locations on individual integrated circuit die preferably at the wafer level as part of the semiconductor process steps used to define the electronic circuitry on the substrate. The trenches are formed concurrently with and as part of the electronic circuit fabrication. Deep reactive ion etching (DRIE) processes are used, such as are used in DRAM trench capacitor formation, to form very small, high aspect ratio trenches. Typical DRIE processes include SF6 reaction which is suitable for forming high aspect ratio trenches with well-defined, vertical side walls.
A passivating, dielectric layer is disposed on the internal surface of the trench cavity and a conductive material (e.g., doped polysilicon or metal) is disposed upon the dielectric layer within the trench. Preferably, the trench is substantially filled with the conductive material. These DRIE, passivating and metalizing processes are compatible with the processes involved in the formation of electronic circuitry on a semiconductor wafer and are performed during wafer fabrication, i.e., the trench features are defined as part of the reticle set/photomask set associated with the electronic circuitry defined on the substrate.
The active, or first, surface of the wafer that contains the electronic circuitry is passivated with a suitable insulative material such as an oxide. The individual die's bond pads are exposed through the passivation layer at the wafer level. Electrically conductive traces between the exposed bond pads and/or conductive material with the trenches are formed the wafer level using well-established metal plating processes.
In one aspect of the invention, the inactive, or second, surface of the wafer is backthinned using conventional thinning techniques to expose the conductive material in the trench to create a through-hole via that can be accessed from the first and second surface of the substrate. The individual integrated circuits can be diced from the wafer, individually, or as an array of multiple uncut die, using a dicing saw.
In another aspect of the invention, the die streets (inactive borders of individual die on the active surface of a wafer) on an unthinned wafer can be grooved to a predetermined depth and the active surface of the wafer bonded to a substrate. The entire wafer can then be backthinned to expose the conductive material within the trench and beyond the depth of the preformed groove, resulting in the low mechanical stress singulation of the individual die of the wafer.
The individual die or array of die are bonded together and electrically interconnected at the predetermined vias and bond pads so as to form "ministacks" comprising two to four layers. Solder reflow, if appropriate is performed to provide electrical connection of the solder at the via/bond pad interface. Alternatively, a Z-conductive or anisotropic epoxy may be used to bond and interconnect the layers. These mini-stacks are tested and may be assembled into larger stacks which are ensured of containing functional layers. The second surface of the bottom-most die in the stack may have vias or ball bonds which can be interconnected to external circuitry.
In this manner, very small form factor, multilayer stacks of individual integrated circuit die are achieved with minimal lead lengths, with or without the use of external side bus conductors.
Accordingly, the invention provides a stackable, integrated circuit die layer that is highly reliable and which may be interconnected to adjacent layers using vertical area vias as well as a multilayer module comprised of such layers that is low-cost, easy to test and assemble in high volume.
Turning now to the figures wherein like numerals designate like elements among the several views,
In the invention's preferred embodiment, die 5 are tested at the wafer level to ensure the use of functional die within a stack and to identify functional die or sets of die (arrays) on the wafer. Additionally, because of the flexibility of the invention, both individual die or matching layers of equal sized die arrays on a wafer may be concurrently processed under the proposed invention.
Wafer passivation across all die on the wafer is performed to insulate circuitry and vias and to provide control of via capacitance.
As can be seen in
The unique ability to vary the via formation, dielectric application and conductive via fill processes to control via diameter, dielectric thickness and via conductor diameter also allow the formation of various in situ passive components such as capacitors and resistors at and within the via sites and layer.
Turning now to
After wafer level via/bond pad interconnection, the inactive surface of the wafer optionally may be back-thinned using mechanical or chemical techniques as are well known it the art such as grinding and/or remote atmospheric plasma etching, alternative embodiments of which will be further discussed.
Further testing to identify functional die or die arrays is preferably performed prior to segmenting of the wafer into individual die or die arrays.
Die 5 are segmented from wafer 1 prior to interconnection and stacking.
Turning to
In an alternative embodiment, micro-heat pipe structures, interleaved copper thermal management layers, thermal adhesive film such as ATTA LM-2 available from Btechcorp, thermally conductive adhesives or equivalent thermal management means may be incorporated into the stack where appropriate if in-stack power dissipation or stack thermal management is a concern.
As can be seen, under the present invention, a user may selectively process heterogeneous or homogenous integrated circuit die to form modular, scalable, building blocks of circuits. In this manner, each layer may be designed to form a building block of a desired circuit (e.g. op amp, ADC) that, in turn will be assembled into a final circuit of desired complexity. Alternatively, the ministack formed at this step may result in the final, desired circuit.
An alternative preferred embodiment includes circuit design and die layout specifically providing for efficient bond pad and via locations and for the design of partial circuit "unit cell" layers, that can be assembled as layers to form complete circuits where the vias provide all unit cell interconnections necessary to realize full circuit functionality.
To maximize final stack yield, testing of the ministacks is performed prior to further incorporation into subsequent assemblies. In an alternative preferred embodiment, the ministacks can be bonded and electrically interconnected together to form a stacked electronic module of greater circuit density.
It is important to note that the design and layout with respect to via formation and filling, bond pad exposure, interconnection metallization, and layer interconnection scheme must consider the layer-to-layer bond pad and via registration to ensure accurate and reliable bond pad and via interconnections when the layers are assembled.
By progressively testing and stacking die or die arrays, i.e. die to ministacks to final stacks, yield is greatly improved since a single failed layer or failed ministack is identified early in the manufacturing cycle under the present invention does not result in the loss of a completed multilayer stack.
A preferred embodiment of the invention comprised of defining vias at the reticle/photomask lever fits well with standard semiconductor process steps. As is well known in the semiconductor manufacturing arts, a common series of semiconductor process steps is involved in the manufacturing of integrated circuit die. Generally, such semiconductor process steps comprise:
1. Functional and schematic circuit design,
2. Circuit layout which will be dependant on factors such as feature size, material characteristics and foundry capabilities resulting in a composite circuit layout or drawing from which individual layer patterns are generated,
3. Digitizing each layer drawing,
4. Creating a reticle from each layer drawing comprising an image for directly pattering the image on a wafer or for the generation of a photomask which may comprise multiple reticle images. (Chrome on glass/quartz is a typical reticle construction),
5. Forming an oxide layer on the surface of a semiconductor wafer to form a protective layer and doping barrier,
6. Patterning the oxide layer to define locations for circuit elements,
7. One or more additional layering, patterning and doping operations for the creation of desired circuit elements such as transistors (n-type an/or p-type), capacitors, diodes, resistors and the like, and the creation of insulation and/or conductive regions using appropriate passivation materials (e.g., polysilicon), dopants, and metallization.
Upon completion of the above semiconductor process steps, wafer sort, test and dicing of the wafer for further processing typically follow.
As discussed above, capacitor formation occurs during one or more of the semiconductor process steps. Because of limited wafer surface, trench, (or buried) capacitors, which are etched vertically into the wafer, have been adopted because of their relatively small surface area. Typical sizes of trench capacitors are 2 microns wide by 8 microns deep but much smaller diameter, deeper trench geometries are achievable. A trench capacitor may be formed either isotropically or, preferably, using anisotropic techniques such as dry reactive ion etching. Typically, subsequent trench capacitor processing includes oxidation of the sidewalls of the trench to create a dielectric layer and filling the trench with a deposited polysilicon.
The features of the trench capacitor and the process steps associated with their formation desirably lend themselves toward use as interconnect via structures when modified according to the present invention.
An exemplar structure of a trench is shown in
In a preferred embodiment of the invention, trenches are formed during and as part of the above semiconductor process steps relating to formation of electrical circuitry on the wafer surface. After the trench formation, such as by DRIE process, and interior trench surface oxidation, the trench interior is at least partially filled with doped polysilicon such as by deposition processes well known in the industry. The polysilicon is doped using diffusion before, or implantation after, deposition to provide a predetermined resistivity in the polysilicon material. It has been determined that doping polysilicon decreases resistance allowing the polysilicon to act as a conductor within the trench structure.
Alternatively, the interior of the trench structure may be plated or substantially filled with a suitable conductive material, such as a metal whereby the interior of the trench defines a conductive region.
Upon completion of the semiconductor process steps necessary to form the integrated circuitry on the active surface of the wafer, which steps include the trench formation and conductor fill, a predetermined portion of the inactive surface of the die is removed to expose the conductive polysilicon or metal to define a high aspect ratio, conductive via. A cross-section of an exemplar trench, before and after removal of a predetermined portion 100 of the inactive surface is shown in
Note that the die streets can be grooved with a dicing saw or equivalent means to create grooves 110 of a predetermined depth that is lower than the depth of the active circuitry on the chips, about the periphery of the die (i.e., the die streets) on the wafer.
As is disclosed in U.S. patent application Ser. No. 09/190,378 filed Nov. 10, 1998, entitled "Method for Thinning Semiconductor Wafers with Circuits and Wafers Made by the Same", above, when the inactive surface of the grooved wafer is backthinned up to the groove depth, the resultant die are concurrently backthinned and singulated in a manner that minimizes mechanical stresses on the die. By way of example and not by limitation of the steps associated with the use of the preformed grooving embodiment of the invention, (also referred to as a "dice before grind"), are:
The removal of a predetermined portion of the inactive surface may occur before or after dicing, i.e., at the wafer level, and may be done by chemical, mechanical or combined chemical/mechanical polishing methods as are common in industry.
In yet a further alternative embodiment of the invention, the stack of semi-conductor chips, or substrates, may each have a passivation layer disposed over the surface of each layer. Individual I/O pads are exposed and/or the conductive material within the vias rerouted to desired locations (e.g., other I/O pads, one or more conductive vias and the like) upon the passivated surface using plated-on metallized conductive paths. Further, the I/O pads of a layer can be rerouted to the edge of the layer whereby they are subsequently interconnection. After each layer is stacked to form a module with lateral surfaces, the terminated edge traces are exposed using a semiconductor etch back process. The exposed leads can then be interconnected using plated-on metal "side bussing" on the lateral surfaces of the module to form T-connects which further increases interconnection density. An exemplar T-connect 120 structure is shown in
From the foregoing description, it will be apparent the apparatus and method disclosed in this application will provide the significant functional benefits summarized in the introductory portion of the specification.
The following claims are intended not only to cover the specific embodiments disclosed, but also to cover the inventive concepts explained herein with the maximum breadth and comprehensiveness permitted by the prior art.
Many alterations and modifications may be made by those having ordinary skill in the art without departing from the spirit and scope of the invention. Therefore, it must be understood that the illustrated embodiment has been set forth only for the purposes of example and that it should not be taken as limiting the invention as defined by the following claims. For example, notwithstanding the fact the elements of a claim are set forth below in a certain combination, it must be expressly understood that the invention includes other combinations of fewer, more or different elements, which are disclosed above even though not claimed in such combinations.
The words used in this specification to describe the invention and its various embodiments are to be understood not only in the sense of their commonly defined meanings, but to include by special definition in this specification structure, material or acts beyond the scope of the commonly defined meanings. Thus, if an element can be understood in the context of this specification as including more than one meaning, then its use in a claim must be understood as being generic to all possible meanings supported by the specification and by the word itself.
The definitions of the words or elements of the following claims are, therefore, defined in this specification to include not only the combination of elements which are literally set forth, but all equivalent structure, material or acts for performing substantially the same function in substantially the same way to obtain substantially the same result. In this sense it is therefore contemplated that an equivalent substitution of two or more elements may be made for any one of the elements in the claims below or that a single element may be substituted for two or more elements in a claim.
Although elements may be described above as acting in certain combinations and even initially claimed as such, it is to be expressly understood that one or more elements from a claimed combination can in some cases be excised from the combination and that the claimed combination may be directed to a sub-combination or variation of a sub-combination.
Insubstantial changes from the claimed subject matter as viewed by a person with ordinary skill in the art, now known or later devised, are expressly contemplated as being equivalently within the scope of the claims. Therefore, obvious substitutions now or later known to one with ordinary skill in the art are defined to be within the scope of the defined elements.
The claims are thus to be understood to include what is specifically illustrated and described above, what is conceptually equivalent, what can be obviously substituted and also what essentially incorporates the essential idea of the invention.
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text: Jay Z will be Kanye's best man under one condition Jay Z and Kanye West Sun-09-Mar-14 21:58 Share this Tell Us What You Think WTF 0 LOL 0 FAIL 0 OMG 0 HOT 0 CUTE 0 ] By Steph Monks Kanye West and Kim Kardashian have released their wedding date – May 24th. And it's likely it's going to be filmed for reality TV. Kanye West has asked Jay Z to be his best man. But, Jay Z has said he'll only do it under one condition – that himself, Beyoncé and Blue Ivy would not be filmed. Apparently it is because Beyoncé doesn't want to lower her standards for anyone or any occasion. The thought of appearing on Keeping Up With The Kardashians 'mortifies' her. You May Also Like Jay-Jay, Mike and Dom re-create Kim K's Paper Mag photoshoot (NSFW) Behind the scenes: JMDBreakTheInternet (NSFW) Beyonce divorcing Jay Z: After Solange attacks Jay Z for cheating on Bey (report) Become a fan of The Edge on Facebook and on Twitter .


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Picture: Martin Scorsese Royal Film Performance 2011: Hugo in 3D at Odeon Leicester Square - Arrivals London, England - 28.11.11
Legendary director Martin Scorsese contemplated quitting Hollywood and becoming a teacher after the first version of The Last Temptation Of Christ was cancelled.
The auteur shot to fame in the 1970s thanks to the acclaim surrounding his gritty movies Mean Streets and Taxi Driver, but his career took a hit after follow-ups including New York, New York and The King of Comedy failed to make an impact at the box office.
Scorsese's confidence slumped to such a low after his original version of the story of Jesus Christ was scrapped by studio bosses in 1983, he considered turning his back on directing to teach schoolkids.
He tells Britain's The Sun, "After The Last Temptation Of Christ was cancelled I was with (director) Brian De Palma, they had just screened his movie Scarface and the reaction in Hollywood had been hostile.
"I said, 'What should we do?' and he said, 'I don't think we should continue making movies' and I said, 'Probably not, we haven't got a chance here.' So for me the first thing I thought of was teaching. I enjoyed working with younger people and encouraging them. I have worked with many young people."
Scorsese's The Last Temptation of Christ finally hit the big screen in 1988, and earned him an Oscar nomination for Best Director. Meanwhile, De Palma's Scarface went on to garner a huge cult following.


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MMO MMORPG Games » MMORPG Games News » Chinese Tanks Now Available In World Of Tanks
Chinese Tanks Now Available In World Of Tanks
Wargaming.net have just announced the latest update released for their record-breaking, third-person action MMO, World of Tanks. The update, which went live earlier today, includes the first arrival of the highly anticipated Chinese tanks. Although already available to North American players, Korean fans will have to wait until January 21st before they're able to get into the action.
The Type 97 Chi-Ha is the first Japanese made tank to enter the game, creating an exciting new era for World of Tanks players. Amassing millions of players worldwide, and winning rewards from a huge variety of media outlets, World of Tanks continues to grow in popularity thanks to exciting new content such as the introduction of Chinese tanks.
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Kate Gosselin Says the Kids Miss the Cameras
"They cried in the van on the way home from school the other day. I finally admitted to them, they kept asking, 'Where's the camera crew? Where's the camera crew? We miss them.' And I said, 'Our show is over.' ... Eight sobbing kids driving home from school," Gosselin tells Walters on 'The 10 Most Fascinating People of 2009' show.
Kate's estranged husband, Jon Gosselin, filed a suit to stop TLC from filming his eight children after they dropped him from the title of the show -- it was to become just 'Kate Plus 8.'
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- TV News
- Wednesday 09 DecemberBy bhockey47Low Ranked Vote downVote upReport this
The kids may miss the camera's, but I miss Kate.
- Wednesday 09 DecemberBy Diana
Happily the New Year will not be filled with suspense filled trailers baiting everyone to watch the Gosslin gossip. Kate is a has been in a few years no one will recognize the kids in their hand me down clothes and their trailer park address because Kate spent all the money. But they will survive hopefully; however, it will be tough with the two nut cases they have for parents. At least they will have each other
- Wednesday 09 DecemberBy atragon
The network is every bit as liable for allowing this abomination to air. When DCFS steps in and removes the kids, reality will hit home. Are you listening, Octomom? You're next!
- Wednesday 09 DecemberBy bill
worst show ever, even worse than mr ed...
- Wednesday 09 DecemberBy cin
I do think TLC has some responsibility in this....it looks like the Roloffs from Little People Big World are also headed for divorce.....TLC is out to make money..but at what price?
- Wednesday 09 DecemberBy PR
It had to end sooner or later Kate, so maybe it's a good thing that the kids get this out of their system now. You, on the other hand, can't seem to get over the fact that the gravy train has ended and your kids will have to lead a normal life...hopefully.
- Wednesday 09 December
All these no-talent celebrity wannabes out there who feign all this objection to publicity, exposure, et al, and once its not there they're crying about it? What is this saying about our pathetic society?
- Wednesday 09 DecemberBy Greg
looks like Kate will be going back to the trailer park she came from, hope she didn't sell the double wide.
- Wednesday 09 DecemberBy Vanessa
I can understand them missing the camera crew (keyword: CREW) They seemed to do a lot of babysitting. So invite them over for Christmas but WITHOUT camera's. Those kids don't need to be filmed for tv. Buy a camera yourself and film them for yourself like normal parents do. I loved Jon & Kate plus 8, but I'm glad it is OVER...the only thing I didn't like about the last episode is that Mady and Cara weren't on there. But that is it. Let it go, let it be. Do something else and keep it moving.
- Wednesday 09 DecemberBy lsgiff
Only a supersized egotistic mom like Kate would give a TV interview saying her kids cry and misbehave because they miss being on TV.
I hope their school is watching out for their mental health because their parents sure as Hell aren't.
- Wednesday 09 DecemberBy cj
Kate is so blinded by fame she thinks her kids miss the TV show! It's the nice crew that treated them better than their parents that they miss.
I'd be crying, too, if the adults in my life were limited to Kate & Jon.
Why doesn't Kate try out for "The Love of Ray J" or something like that?
- Wednesday 09 DecemberBy Sharon
Kate, please, it's about time this show was taken off the air. The kids are missing the extra people in their life not being filmed and on TV. Kate you are so full of yourself and your endless attempts to continue to be in the spotlight show that you are only concerned with your own "celebrity". Give it up and raise your kids. If more attention had been paid to the family rather than to the camera maybe the Gosselin family would still be together.
- Wednesday 09 DecemberBy Rae
finally a healthy family decision for jon and kate + 8. right now the children are crying but in the long run it IS THE BEST DECISION. TLC IS A BUSINESS AND THIER ONLY CONCERN IS MONEY (and maybe only kates concern as well.)
- Wednesday 09 DecemberBy newfiepride
maybe kate will have to go have a date with tiger
- Wednesday 09 DecemberBy Juli
The kids miss the cameras? REALLY??? And just when she was gaining some sympathy the beast once again rears it's ugly head.
- Wednesday 09 DecemberBy Lisa
Kate Hated The paparazzi remember well she should be happy now nobody will follow her anymore and She could by a trailor in a year and be near her Mom...You get what you deserve in this life...Blessed Be
- Wednesday 09 DecemberBy Michael J
WHO GIVES A F--K WHY THEY'RE CRYING???? God-damn-it, it's good to be rid of them already!!!!!!!!!!!
- Wednesday 09 DecemberBy hunkindoo1
Leave Jhn alone, we all know woman are insane! Woman you know!
- Wednesday 09 DecemberBy Mark
Above the Heading of the Story was : Kate Gosselin Says the Kids Miss the Cameras??And Barbara Walters Fell for that ??Cmon Barbara with the "'The 10 Most Fascinating People of 2009'" where is that Iron Maiden Facade you have put on all these Years??!!and why would Kate or Jon be Fascinating the way they Have Conducted themselves on and off the Camera is Very Irresponsible without any real regard to their Children "and For Kate? You Miss the show and Cameras,and the Papparazzi and so does Jon !!Your Kids could care less I would rather hear it form the mouths of your Kids Without Being Coached by you or your Ex and your Phony ass PA Wackadoo Fkng Hairstyle did a Pensylvannia Hay stack land on your head ?Im surprised that her show didnt get cancelled the way she carried on and treated her Kids and Her Husband on the show and off the Show which they have caught a few times If I was one of her Kids and she treated me like she treated her Kids ..I tell you what a Mommie Dearest type of story would be in order in the Future for her and Her Irresonsible adolescent Ex Husband..
- Wednesday 09 DecemberBy szqz35
The real reason the kids are sobbing-they have Jon and Kate for parents and thanks to reality TV the whole world knows it. They are sobbing out of embarassment for the way their parents act all the time.
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