text:
A new method and device to encapsulate integrated circuits such as flip chips and BGA packages. A special mold to surrounds the chip to be encapsulated in a cavity, and the encapsulant is injected into the cavity at an elevated pressure, and possibly at an elevated temperature. This shortens the cavity filling time by two or three orders of magnitude, compared to the conventional dispensing process. The reliability of the package is increased by increasing the adhesion of encapsulant to the package, by controlling fillet shape through in-mold curing, and by completely filling the cavity through proper mold design and, optionally, evacuation of the cavity prior to injection. The invention also allows the use of a wider range of encapsulants, including highly viscous material, fast curing materials and reworkable materials.
1. A method of underfill encapsulation of an integrated circuit chip against a substrate, using a mold head for enclosing the chip and encapsulant, comprising the steps of:
a) locating the mold head over the chip;
b) lowering the mold head into contact with the substrate, the chip fitting within a cavity within the mold head, and the mold head sealing around the periphery of the chip creating a side region for formation of a fillet around the chip, the mold head contacting the upper surface of the chip and holding it in position against the substrate;
c) applying a clamping force to the mold head;
d) injecting the encapsulant under pressure through an inlet into the cavity, and allowing entrapped air to escape through an air vent in the mold head; and
e) lifting of the mold after the completion of encapsulant flow.
2. The method of claim 1, further comprising the step, after step (c) thereof, of applying a vacuum to evacuate the air from the cavity.
3. The method of claim 1, further comprising the step, after step (d) thereof, of curing of the encapsulant in the mold by applying heat to the mold.
4. A method of underfill encapsulation of an integrated circuit chip against a continuous substrate, using a mold head for enclosing the chip and encapsulant, comprising the steps of:
a) locating the mold head over the chip;
b) lowering the mold head into contact with the substrate, said substrate being continuous under said mold head, the chip fitting within a cavity within the mold head, and the mold head sealing around the periphery of the chip creating a side region for formation of a fillet around the chip, the mold head contacting the upper surface of the chip and holding it in position against the substrate;
c) applying a clamping force to the mold head;
d) injecting the encapsulant under pressure through an inlet into the cavity, and allowing entrapped air to escape through an air vent in the mold head; and
e) lifting of the mold after the completion of encapsulant flow.
5. The method of claim 4, wherein said pressure ranges from approximately 15 psi to 1,000 psi.
6. The method of claim 4, further comprising the step, before step (d), of placing at least one dam in said side region.
The invention pertains to the field of manufacture of integrated circuitry. More particularly, the invention pertains to an improvement in encapsulation for the "flip chip" type of integrated circuit.
A "flip chip" is a semiconductor die having terminations all on one side in the form of solder pads or bump contacts. After the chip has been passivated or otherwise treated, it is flipped over for attaching to a matching substrate. A "BGA" or "Ball Grid Array" chip is similar to the "flip chip", except that the chip is mounted on a carrier, with wires connecting the chip to the carrier, and the carrier has the solder pads for connection to the substrate.
The use of flip chips and BGA chips have inherent advantage over other methods in high-density electronic packaging because it provides an area array (2 dimensional) that interconnects the chip and the substrate Tummala and Rymaszewski, 1989). However, due to the high production cost of today's technology, its market share among semiconductor chip industry is low as yet. As the flip-chip and BGA technology improves, their uses are expected to increase drastically in the near future. The Semiconductor Industry Association projects a 250-fold increase in IC functional density over the next 15 years. Flip-chip technology and BGA technology is expected to play a major role in accomplishing such a goal due to its capability of connecting high numbers of i/o and compactness. However, the predicted growth rate by experts all depends on the ability to reduce production cost significantly.
Traditionally, flip-chip technology uses ceramic material as chip carrier or substrate (see Miller, L. F., 1969, "Controlled Collapse Reflow Chip Joining", IBM J of Res. and Dev., v. 1 3, 239-250.). Because of the similarity of the thermal-expansion coefficients of the chip and ceramic, thermal stresses during thermal excursions were not a serious problem.
Recently, the desire for low cost mass production has resulted in the growing use of organic materials for substrates (Flip chip on board or "FCOB"). The current process typically uses solder to connect the chip to the board. Although efforts are being made to use electrically conductive polymers to connect the chip to the board (see Dion, J., Borgesen, P., Yost, B., Lilienfeld, D. A. and Li, C. Y., 1994, "Material and Reliability Considerations for Anisotropically Conductive Adhesive Based Interconnects", Mat. Res. Soc. Symp., Proc. 323, Pittsburgh, Pa.), such development is still in the research stage.
In FCOB, the difference in thermal-expansion coefficient between the chip (2.5 ppm/�C.) and the organic substrate (15 ppm/�C.) causes significant shear strain on the interconnects during temperature cycling, ultimately resulting in fatigue cracking and electrical failure (Machuga, S. C., Lindsey, S. E., Moore, K. D. and Skipor, A. F., 1992, "Encapsulation of Flip Chip Structures", IEEE/CHMT Symposium, p.53.). This is particularly true as the size of the chip increases because the thermal stress in the interconnect increases with DNP (distance from the neutral point).
This problem can be significantly reduced by encapsulating the space between the solder joints with encapsulant to provide mechanical reinforcement. Because the encapsulation is provided mainly under the chips, this process is called "underfill encapsulation". Underfill encapsulation is different from encapsulation of other packages such as DIP or PGA, which require encapsulation on all sides of the chip.
Underfill encapsulation has resulted in more than a ten-fold increase in the reliability of the flip chip on board technology (Nakano, F., Soga, T., Amagi, S., 1987, "Resin Insertion Effect on Thermal Cycle Resistivity of Flip-Chip Mounted LSI Devices", ISHM Conf., 536-541; Suryanarayana, D., Hsiao, R., Gall, T. P., McCreary, J. M., 1991, "Enhancement of Flip Chip Fatigue Life by Encapsulation", IEEE CHMP, v.14, 218-223). The same is true for BGA technology.
Currently, most flip chip and BGA packages are encapsulated by dispensing the encapsulant along the periphery of one or two sides of the chip. Capillary action (i.e. a surface-tension phenomenon) drives the encapsulant through the space between the chip and the board. After the filling is complete, the board is taken to an oven where it is cured. The current encapsulation process has the following problems:
(1) Filling and curing: Because the current process fills the cavity (space between the chip and the board) by capillary action, it is very slow and could be incomplete, resulting in voids. The filling problem becomes even more serious as the chip size increases. The fill time is proportional to the square of the length of the chip. (See Suryanarayana, D., Wu, T. Y., Varcoe, J. A., 1993, "Encapsulants Used in Flip-Chip Package", 43rd ECTC, Orlando, Fla.) For example, in a typical encapsulation operation, the filling takes about 2 minutes for a small chip (1/4") to 15 min. for a large chip (3/4"). Because the filling is slow, the encapsulant has to be a slowly curing material. Thus, curing of the encapsulant typically requires several hours in an oven. The slow filling and curing process is detrimental to mass production.
(2) Adhesion: Adhesion of the fluid to the chip is essential for achieving good reliability of the encapsulated chip. High wettability of the fluid requires low surface tension which, in turn, leads to an even slower cavity filling.
(3) Encapsulant: Development of materials suitable for flip chip encapsulation is difficult. The encapsulant needs to have good fluidity, wettability, matching thermal expansion coefficient with the solder and with appropriate curing kinetics. It is difficult to satisfy all these at the same time. Currently, most encapsulants are epoxy-based thermoset which are filled with solid fillers (O'Malley, G., Giesler, J. and Machuga, 1994, "The Importance of Material Selection for Flip Chip on Board Assemblies", IEEE CPMT, Pt. B, v.1 7, 248.). On one hand, It is desirable to increase the filler content to match the thermal-expansion coefficient of the solder but on the other hand, the viscosity increases sharply with the filler content, which make the flow more difficult. Another problem with the current encapsulant is because of its thermosetting nature, the repair of the board is difficult.
Some recent inventions have tried to improve the flip-chip encapsulation process.
U.S. Pat. No. 5,218,234 granted to Thompson, K. R., Banerji, K. and Alves, F. D., in 1993 for a "Semiconductor Device with Controlled Spread Polymeric Underfill", teaches creating a window-frame shaped opening in the film on the substrate. The semiconductor device lies in the interior perimeter of the opening. The window frame opening in the film serves to confine the encapsulant which fills the space between semiconductor device and substrate to within the opening. This prevents unwanted spread of the encapsulant and help form an ideal fillet geometry. Other than this, this invention still suffers from the disadvantages that the dispensing process have.
U.S. Pat. No. 5,203,076, granted to Banerji, K., Alves, F. D., and Darveaux, R. F., in 1993 "Vacuum Infiltration of Underfill Material for Flip-Chip Devices", applies and removes vacuum to encapsulate the chips. In this process, a bead of underfill material is provided on the substrate about the periphery of integrated circuit. Vacuum is then applied to evacuate the area between integrated circuits and the substrate through the underfill encapsulant. After that, the vacuum is removed forcing the underfill material into the evacuated area. This process, however, involves three steps and requires a vacuuming process which is not effective for highly viscous encapsulant. The key differences between Banerji's patent and our invention can be summarized as follows:
1. Banerji's method depends first on a partial vacuum to "suck out" the air from the under-chip area and let it "bubbling through the polymer infiltration" (line 54, p. 2)--a method inherently impossible to get all the air out. This is even after the air is let in (at the atmospheric pressure) again to push the polymer to infiltrate the partially-vacuumed under-chip area. The air in the chamber always maintains a uniform pressure (i.e. no gradient) except at the instant when the vacuum is applied or removed. On the contrary, our invention pushes the air out of the under-chip area by the flow front of the liquid polymer coming in at one point (gate) driven by a pressure gradient from the injection system. The flow front advancement can be predicted by computer simulation to ensure that all the air is evacuated (not bubbling through).
2. Because of high pressure gradient (which can be as high as 1000 psi), the filling time in the present invention is less than one second, not "about 50 seconds" in Banerji's patent, or 5 to 20 minutes in conventional underfill method.
3. The fillet geometry is considered critical to the reliability of the package. In Banerji's invention, the shape of the fillet is determined by the force balance of the surface tension and gravity on the encapsulant. This limits controllability of the shape of the fillet, because neither factor can be controlled. In contrast, in the present invention, the fillet shape can be controlled by the proper design of the mold. Especially when in-mold curing is used, the fillet shape will exactly follow that of the mold cavity.
4. Also, because of the fast filling time with the current invention, fast-curing encapsulant can be used to reduce the cycle time. U.S. Pat. No. 5,381,599, granted to Hall, G. L., in January 1995, for "Liquid Crystal Polymer Encapsulated Electronic Devices and Methods of Making the Same", uses a high pressure and high temperature process to encapsulate flip-chips with a rigid liquid crystal polymer. The encapsulation is applied over the flip-chips. Epoxy polymer can be applied over and part of under the chip before applying liquid crystal polymer. This process cannot fill the cavity underneath the chip completely, which will be detrimental to the reliability of the package. Also, the encapsulant used is liquid crystal polymer which is as yet less popular than epoxy.
A new method and device to encapsulate integrated circuits such as flip chips and BGA package has been developed. This process involves a special mold to surround the chip to be encapsulated and injection of the encapsulation material at elevated pressure.
Flip Chip on Board (FCOB) technology and Ball Grid Array (BGA) technology generally requires encapsulation of the solder joints to reduce the loads on such joints during thermal excursions. At present, the encapsulation process constitutes the primary obstacle to widespread acceptance and implementation of FCOB or BGA technology because of the long process times involved, and because of the subsequent lack of reparability. The process developed here addresses both of these issues.
The present invention has the following advantages:
(1) The filling time can be reduced dramatically compared to dispensing encapsulation process. For example, for a 0.3" chip, the fill time can be as much as 100 times or more smaller. For the test case described below, the filling time was reduced by 100 times. The curing process can also be shortened by using a faster-curing encapsulant, which is impractical in the current process.
(2) The filling process can be done at room temperature if in-mold curing is not needed, as compared to the prior-art dispensing process which typically requires heating. Alternatively, in-mold curing can be used to get the best quality of encapsulation, which will require mold heating.
(3) Another benefit that can be achieved from this process is a potential increase in reliability of the package. First, as indicated in Giesler et al. (Giesler, J., O'Malley, G., Williams, M. and Machuga, S., 1994, "Flip Chip on Board Connection Technology: Process Characterization and Reliability", IEEE CPMT, pt. B, v. 1 7, 256-263.), reliability of the package increases as the encapsulation temperature decreases. Because in the new process, encapsulation can be conducted at room temperature, the reliability of the package increases compared to other processes which are done at elevated temperature. Second, it is well known (see Giesler et al.) that the reliability of the package depends on the fillet shape. The current process can control the fillet shape better than the dispensing process by designing the mold appropriately. Third, for the in-mold curing process, the curing will take place under high pressure which will enhance the adhesion of encapsulant to the package. The enhanced adhesion will improve the reliability of the package.
(4) The selection or development of encapsulant will become much more flexible. For example, it is no longer necessary to compromise the wettability and the surface tension. Also, the process will be able to handle materials with higher viscosity thus allowing more fillers to be added to the encapsulant in order to better match the thermal-expansion coefficients of the encapsulant and the solder. It can also handle thermoset material with much faster curing kinetics. It will also be possible to add rubbery plastic to the encapsulant. This will soften the cured encapsulant when heated, making the reworkability of the package possible.
FIG. 1 shows a view of the apparatus of the invention.
FIG. 2 shows a side cut-away view of a chip after encapsulation without in-mold curing.
FIG. 3 shows a side cut-away view of the mold of the invention in an embodiment having bumpers at the bottom edge of the mold body.
FIG. 4 shows a side cut-away view of another embodiment of the mold of the invention, having bumpers inside the corners of the mold cavity.
FIG. 5 shows a side cut-away view of another embodiment of the mold of the invention, using a resilient plate in the top of the mold cavity as a bumper.
FIG. 6 shows a side cut-away view of another embodiment of the mold of the invention, using a plate with springs in the top of the cavity as a bumper.
FIG. 7 shows a side cut-away view of another embodiment of the mold of the invention, having heating means for in-mold curing of the encapsulant.
FIG. 8 shows a view of the mold of the invention from the underside, with a chip in place.
FIG. 9 shows a similar view to FIG. 8, with an adaptation having dams to facilitate underfill of the chip.
FIG. 10 shows a similar view to FIG. 8, with an adaptation having movable dams to facilitate underfill of the chip.
FIG. 11 shows a similar view to FIG. 8, with the addition of vacuum to facilitate underfill.
FIG. 12 shows an underside view of an alternate mold for use with multiple chips, having a single injection system.
FIG. 13 shows an underside view of an alternate mold for use with multiple chips, having a multiple injection systems.
FIG. 14 shows a similar view to FIG. 2, showing the control of fillet shape using in-mold curing.
The method and apparatus of the invention represents a novel advance in the technology of encapsulating integrated circuits such as the flip chip and BGA chip. The method and apparatus of the invention can improve processability and reliability of flip-chip or BGA packaging, and allows the use of a reparable encapsulant such as thermoplastic polymer.
The overall schematic of the encapsulation apparatus of the invention is shown in FIG. 1. This device consists of a translation system (9) and (10), clamping system (8), an encapsulant injection system (5), (6) and (7), and an enclosed mold-head (4) which will support the chip (3) and confine and seal the flow of encapsulant during encapsulation. A bracket (11) connects the translation system to the mold/clamping system.
The chip (3) has been soldered to its substrate (2), which is mounted on a platen (1) for the encapsulation process. The apparatus is mounted on a base plate (12) which is mounted rigidly relative to the chip holding platen (1), so that the planes of the chip (3), substrate (2), platen (1), mold (4), and the translation system plates (9) and (10) are parallel.
The translation system preferably has three independent parts for accurate motion of the mold in the X and Y horizontal directions, and possibly also in the Z vertical direction (in which case the vertical movement of the translation system can also function as the clamping system). It should be noted that these directions are intended to refer to motion relative to the chip. While it is possible that the apparatus might be mounted sideways from the orientation shown, encapsulating chips on a vertical substrate, the terms "X" and "Y" and "horizontal" will be used herein to mean "parallel to the plane of the chip", and "Z" or "vertical" to mean "orthogonal to the chip".
The translation system can be any two- or three-dimensional movement system known to the art, and is shown in a preferred embodiment of two flat tables (9), and (10), each movable in only one axis (X, and Y respectively). In order to allow the most accurate movement possible in each axis, the tables are moved by stepper motors, although worm-gear or rack-and-pinion or other systems are also possible within the teachings of the invention.
The exact control circuitry used by the apparatus to move the mold head through the translation system will depend upon the exact mechanism chosen to move the translation system, and in any case would be within the ability of one skilled in the art to design.
Preferably, the translation system is controlled through a vision system which can automatically locate the mold-head (4) over the chip (3). The vision system can be a commercial system designed for the purpose, such as is available from Universal Instrument Corporation, Binghamton, N.Y.
The mold (4) is pressed down against the substrate (2), surrounding the chip (3), through the force exerted by the clamping system (8), which moves the mold (4) in the vertical or "Z" direction. The clamping system exerts a precise force on the chip (3) to counteract the pressure of the pressurized encapsulation fluid being injected into the mold.
The clamping force can be applied through electrical motor system, using stepper motors such as are preferably used in the translation system or a rack-and-pinion or worm-gear system.
Alternatively, a fluid pressure system using air or hydraulic pressure against a piston could be used. When the clamping is done through an electrical system, a sensor to detect the clamping force will be required to maintain appropriate clamping force during encapsulation. On the other hand, when fluid pressure is used for clamping, the fluid pressure can be varied to get an appropriate clamping force.
In another alternate embodiment, the translation system can have a "Z" axis component to position and lower the mold over the chip and also to provide the clamping force.
The encapsulant is kept in a reservoir (5), which is preferably pressurizable by a piston mechanism (6) activated by a fluid pressure or electrical signal routed by appropriate cabling or tubing (7). Preferably, the piston is actuated by fluid pressure, for ease of regulation. Alternatively, a sealed reservoir could be used, which is pressurized by air pressure to force the encapsulant into the mold.
The injection system can be either position or pressure controlled. In pressure-controlled system, the fluid pressure (air or hydraulic) at the piston in the injection system, injecting the encapsulant at constant pressure. In this case, the completion of the mold filling will be when the injection velocity drops to near zero. On the other hand, in position-controlled system, the position of the piston is controlled to inject the encapsulant at a certain speed. In which case, the completion of mold filling will be when the injection pressure suddenly rises to a high value.
The mold-head (4) is specially configured to fit the chip geometry with its lower end in close contact with the board surface (2) to seal off the area.
The design of mold-head is shown in detail in FIGS. 3 through 13.
Referring to FIG. 3, the mold body (31) has a cavity (43) which is sized to surround the chip (32) closely on top, with a gap left around the periphery of the chip to create a side region (51) for the formation of a fillet.
The size of the gap forming the side region (51) has to be designed carefully. Typically, the thickness of the side region (51) will be much bigger than that of the cavity region between the chip (32) and the board (33). If the size of the side region is too big, the flow of encapsulant in the side during encapsulation may precede the flow under the chip because of the lower flow resistance in the side region. If the flow in the side region is much faster than that in the cavity region, the flow in the side region may block the flow in the cavity region resulting in voids in the cavity.
The chip (32) is mounted to the substrate (33) by solder connections (37). The lower sides of the mold body (35) are firmly held against the substrate (33) by the clamping force (38) to prevent the leakage of encapsulant outside the mold during encapsulation. The mold body presses down upon the chip (possibly through a bumper or plate as described below, or by directly contacting the upper surface of the chip) to firmly and accurately position the chip and to keep the chip from being lifted off the substrate or forced laterally by the force of injection of the encapsulant.
An inlet channel (45) connects the cavity (43) to the reservoir of encapsulant (41). A piston (40) allows an injection force (39) to force encapsulant through the inlet channel (45) into the cavity under pressure. At the opposite side of the mold from the inlet channel (45), an air vent (36) allows air to escape during encapsulant injection. The air vent is preferably very small (perhaps less than one mil), and is preferably machined as a small slot or indentation in the lower edge of the mold.
To seal the mold cavity, hold the chip without damage and to accommodate the variations in chip size and height, a resilient bumper is used to counteract the clamping force and support the mold against the substrate. Four different designs are shown in FIGS. 3 through 6 and described below. In all but the design of FIG. 6, the bumper is made of resilient material such as silicone rubber.
FIG. 3 shows a design in which the bumper (34) is formed by making the lower region of the mold-head (31) of resilient material. The mold body (31) directly contacts the top of the chip (32) in this embodiment.
In FIG. 4, the cavity (43) is made taller, leaving a gap (52) above the chip (32). Bumpers made of resilient material (44) are placed in the corners of the mold cavity (43). FIG. 5 is basically an extension of FIG. 4, in which the bumper is made of a plate (50) made of resilient material which fills the entire upper part of the mold cavity, fitting between the chip and the mold. The size of the bumper has to be designed carefully to ensure adequate sealing while not damaging the chips.
Referring to FIG. 6, a movable plate (60) has been used to seal the top area of the chip (32). A controlled clamping force can be applied to the plate using springs (61) between the mold body (31) and the plate (60).
FIG. 8 shows a bottom view of a chip (73) with its array of solder connections (74) in place in the cavity (71) in a mold (70). The side region (72) of the cavity forms a gap around the chip (73). The inlet (75) enters the mold at the side of the cavity (71), communicating with the side region (72) through a gate (76) area. At the opposite side of the mold (70) from the gate (76), an air vent (77) allows the entrapped air in the mold to escape. As discussed above, the air vent need not be very large--one mil or less would be sufficient.
In some cases, special gate system has to be designed to prevent the formation of voids under the chip, such as shown in FIG. 9. For example, for a chip which has lots of solder connections in the central region of the chip, the flow in the outer region of the cavity between the chip and the board will precede the flow in the central region because of the bigger flow resistance in the central region. This may lead to the formation of voids underneath the chip.
FIG. 9 shows an arrangement of the gate which is intended to minimize the possibility of voids under the chip. In this embodiment, dams (80) are placed in the side region (72) surrounding the entrance region (81). These dams (80) prevent the flow of the encapsulant into the side region (72) right after passing the gate region (81). In this case, the encapsulant will pass through the central region under the chip before spreading to the outer region. This will prevent the formation of voids.
FIG. 10 shows a similar arrangement to FIG. 9, except that the dams (101) retract into slots (100) when the mold is not in use. The dam can be extended beneath the chip between the solder connections, if desired, to further guide the encapsulant under the chip. This allows the mold (70) to be lowered over the chip (73), and then the dams (101) are extended to create the passageway to direct the flow of encapsulant under the chip. Then, the dams (101) are retracted into their slots (100) as the encapsulant fills the mold, so as not to leave voids in the fillet around the chip. A mechanism may be provided to accomplish this retraction, or the pressure of the encapsulant filling the mold can be used to automatically force the dams back against a spring or other resilient means in the slot.
If desired, as shown in FIG. 11, a vacuum (106) can be applied to the air vent (77) of the mold (70) through a tube (105). This allows the mold (70) to be evacuated prior to introduction of the encapsulant. Without air in the mold, the problem of voids caused by air entrapment is eliminated.
Faster underfilling of multiple chips on a single substrate can be facilitated through the design of a mold head having multiple cavities for multiple chips. FIGS. 12 and 13 show two embodiments of such a multiple-chip encapsulating mold.
In FIG. 12, the mold shown in the earlier figures is simply doubled, with two mold cavities (123) and (124) spaced as needed to encompass the two chips (73). As in the single chip embodiment, a single injector injects encapsulant into a single inlet (120), which communicates with the two cavities through runners (121) and (122).
Alternatively, as shown in FIG. 13, two injectors can be used, ganged to inject simultaneously through inlets (130) and (131). This can be extended to cases with more than two chips, using the same principles within the teachings of the invention.
Control of the shape of the fillet around the chip and substrate can be very important in ensuring reliability of the chip. In the past, with underfill accomplished by capillary action of encapsulant applied around the chip with a dispenser, the shape of the fillet was not controllable. The present invention, due to the use of the mold, allows much better control of this fillet shape.
FIG. 2 shows how, when the encapsulant is not cured in the mold, the encapsulant which is on the side of the chip (20) may flow after the lifting of the mold-head to form a fillet (23) around the chip (20). Although the shape of this fillet (23) is determined both by mold shape and by the characteristics of the encapsulant as it flows when the mold is lifted, the invention allows the fillet to be kept far more uniform than is possible in dispensing/capillary underfill techniques.
If exact control of the fillet is desired, the encapsulant should be cured in the mold. FIG. 14 shows the result of the use of a mold such as shown in FIG. 7 to cure the encapsulant in the mold. As can be seen, the fillet (140) is shaped exactly as designed into the mold, without the slumping which results when the mold is lifted before curing.
In-mold curing can be facilitated by the addition of mold heating to the apparatus. FIG. 7 shows how the mold of FIG. 4 can be adapted for in-mold curing. The mold body (31) is surrounded by thermal insulation (78) to help retain the heat in the mold. If desired, as shown in FIG. 7, the insulation may also surround the inlet channel (45) from the reservoir of encapsulant, in order to prevent the curing of the encapsulant in the inlet channel. A resistive heater (80) is preferably used to heat the mold, although other methods of mold heating such as circulation of heated fluid are possible within the teachings of the invention. If desired, a thermocouple (79) or other temperature sensor can be provided in the body of the mold (31) to provide for exact regulation of mold temperature. In combination with mold heating, a back-plate (83) under the substrate (33) could also be heated through the inclusion of a similar resistive heating layer (84) or the like.
An automatic scrap ejection system can also be used to clean the scrap after each encapsulation, as is used in the prior art molding machines.
The operation of the apparatus may be summarized as follows:
1. The mold-head is moved to the location where the chip encapsulation will take place via an X-Y translation system. A vision system, using a sensor in the mold, is preferably used to assure precision X-Y alignment of the chip within the cavity.
2. The mold head is then lowered over the chip, enclosing the chip within the cavity within the mold head.
3. After the mold-head is placed over the chip, a clamping force will be applied to the mold head. An adequate clamping force has to be applied, so as to seal the chip properly while not damaging it.
4. The encapsulant will then be transferred into the mold cavity through an inlet, by the movement of piston in the injection system. The encapsulant infiltrates under the chip and fills the side region around the chip, expelling the air in the mold cavity through an air vent in the mold, preferably at a point opposite the inlet. The encapsulant is injected under pressure, which will be determined based on the characteristics of the encapsulant chosen, the chip design, mold design, desired fill time, and other factors. The upper limit on the pressure applied is set by the need to avoid damage to the chip or substrate during injection, the need to counteract the force with a downward force on the mold and practical problems dealing with extremely high pressures. Pressures of up to 1,000 psi are practical with the apparatus of the invention.
5. After the filling of the cavity is complete, if in-mold heating is desired to cure the encapsulant, heat is applied to the mold. In this case, the mold is left in place until the encapsulant is cured.
6. The mold is lifted.
7. Scrap is cleaned and the system is ready for the next cycle.
An apparatus constructed according to the teachings of the invention was used to encapsulate a typical flip chip which has a dimension of 0.3 inch square. Hysol� FP 4510 thermosetting polymer encapsulant, manufactured by The Dexter Corporation, 2 Elm Street, Windsor Locks Conn., was used.
The process was done at room temperature with injection pressure of 40 psi. The filling time was about 3 seconds. Further experiments have shown that this time could be reduced, if a higher pressure injection or higher temperature is used. After completion of the filling, the encapsulant was cured at 150� C. for about 2 hours.
After encapsulation, the chip was gradually ground off and the encapsulated layer was inspected visually. The encapsulant was found to have completely underfilled the chip without voids or gaps.
Accordingly, it is to be understood that the embodiments of the invention herein described are merely illustrative of the application of the principles of the invention. Reference herein to details of the illustrated embodiments are not intended to limit the scope of the claims, which themselves recite those features regarded as essential to the invention.
Alves, F. D., Banerji, K. and Darveaux, R. F., 1993, "Vacuum Infiltration of Underfill Material for Flip-Chip Devices", U.S. Pat. No. 5,203,076.
Dion, J., Borgesen, P., Yost, B., Lilienfeld, D. A. and Li, C. Y., 1994, "Material and Reliability Considerations for Anisotropically Conductive Adhesive Based Interconnects", Mat. Res. Soc. Symp., Proc. 323, Pittsburgh, Pa.
Giesler, J., O'Malley, G., Williams, M. and Machuga, S., 1994, "Flip Chip on Board Connection Technology: Process Characterization and Reliability", IEEE CPMT, pt. B, v. 1 7, 256-263.
Hall, G. L., 1995, "Liquid Crystal Polymer Encapsulated Electronic Devices and Methods of Making the Same", U.S. Pat. No. 5,381,599.
Machuga, S. C., Lindsey, S. E., Moore, K. D. and Skipor, A. F., 1992, "Encapsulation of Flip Chip Structures", IEEE/CHMT Symposium, p.53.
Miller, L. F., 1969, "Controlled Collapse Reflow Chip Joining", IBM J of Res. and Dev., v. 1 3, 239-250.
Nakano, F., Soga, T., Amagi, S., 1987, "Resin Insertion Effect on Thermal Cycle Resistivity of Flip-Chip Mounted LSI Devices", ISHM Conf., 536-541.
O'Malley, G., Giesler, J. and Machuga, 1994, "The Importance of Material Selection for Flip Chip on Board Assemblies", IEEE CPMT, Pt. B, v.1 7, 248.
Suryanarayana, D., Hsiao, R., Gall, T. P., McCreary, J. M., 1991, "Enhancement of Flip Chip Fatigue Life by Encapsulation", IEEE CHMP, v.14, 218-223.
Suryanarayana, D., Wu, T. Y., Varcoe, J. A., 1993, "Encapsulants Used in Flip-Chip Package", 43rd ECTC, Orlando, Fla.
Thompson, K. R., Banerji, K. and Alves, F. D., 1993, "Semiconductor Device with Controlled Spread Polymeric Underfill", U.S. Pat. No. 5,218,234.
Tummala, R. R., Rymaszewski, E. J., 1989, Microelectronics Packaging Handbook, Van Nostrand Reinhold, N.Y.
Patent Citations
Non-Patent Citations
Referenced by
Legal Events
Original Image


text:
NOISE: ERROR IN THE VOID_ScanLAB Projects
21 Mar 2014 – 14 May 2014
Cost of entry
AboutUsing terrestrial LIDAR technology it is now possible to capture the world in three dimensions. This technology can create near perfect digital 3D replicas of buildings, landscapes, objects and events. But these digital replicas are always an illusion of perfection. NOISE: ERROR IN THE VOID explores the inherent mistakes made by modern technologies of vision. Here we see the unedited view of the world as seen through the eyes of the LIDAR machine. Reality is shrouded in a cloud of mistaken measurements, confused surfaces and misplaced three dimensional reflections. ScanLAB Projects is a London based design studio experimenting with the potentials of large scale 3D scanning. They work internationally, taking hyper surveys of the world alongside scientists, activists, architects and filmmakers. The work they create is a response to these collected digital doppelgangers, manifested as objects, installations, images and film. Their work has been exhibited internationally, recently at Bergen KunstHall, Norway, The Louisiana Museum of Modern Art, Copenhagen, CinemaXXI, Rome, The Architectural Association, London, and the Royal Academy, London.
Art form
Have you been to this event? What do you think? Join the discussion here!
Remember, you can include links to your instagram pictures and to videos.

subset: commoncrawl


text:
Myasthenia Gravis Study (H-28126)
Myasthenia gravis is a chronic autoimmune neuromuscular disease characterized by varying degrees of weakness of the skeletal (voluntary) muscles. MG is caused by a defect in the transmission of nerve impulses to muscles. It occurs when normal communication between the nerve and muscle is interrupted at the neuromuscular junction, which is the place where nerve cells connect with the muscles they control. The purpose of this study is to test the effectiveness and safety of an experimental drug. This investigational drug may partially improve muscle strength in patients with MG.


text:
Printable View
I like HEAD too
Originally Posted by Gold I didn't like the redesign while it lasted. I liked the header, and I don't think a makeover would be a bad thing, but overall that was too busy.
That header wasn't supposed to transfer over- I was just eliminating the image menu and will be increasing font size trying to minimize loading time and bring the content further up the screen.
I like what we have right now personally.


text:
Search for any place in the USA:
Cost of Living,
Profile: Large coastal city complex Location: Southern California coast, 120 miles south of Los Angeles and 20 miles north of Mexican border Elevation: 28 Time zone: Pacific Standard Time
Click here to View Profile
Click here to Hide Profile
San Diego's endearing ocean-moderated Southern California climate is hard to beat and enables year-round enjoyment of the area's many outdoor amenities and activities. The economy has typically been strong and the city is well endowed with arts and recreational amenities. This has drawn the crowds, including retirees, overseas and domestic migrants, and migrants from other parts of California. The cost of living, once a relative bargain for California coastal cities, is no longer low. Commute times have risen and air quality problems have worsened.
All this said, the San Diego area still has a lot to offer. Downtown is mix of modern and old Mission-style architecture, pleasant but nondescript with a nice waterfront area dominated by hospitality activities. Balboa Park just to the north is an urban treasure. San Diego Bay and Mission Bay offer excellent boating and water recreation, and Sea World and the San Diego Zoo are nationally famous.
Farther to the north along the coast, La Jolla is an attractive if expensive beach enclave. Residential areas have grown to the north along State Route 163 and I-15 in places like Poway and Rancho Bernardo. Still farther north along the coast lies the entertainment, shopping and retirement seaside town of Carlsbad, pleasant but expensive, and San Marcos lies inland near the more famous desert retirement enclave of Escondido. Most of these communities are very attractive but demand and geographic limitations have raised prices considerably.
A number of companies, particularly in high tech, have located facilities in these northern areas thus avoiding the need to commute downtown, or, worse, across the area's mountain ranges. Areas to the south toward Mexico have a working-class character. Travel downtown and to the airport is easy at all but the worst times, and suburban roadways are generally well planned and devoid of major traffic bottlenecks.
San Diego itself is located on a narrow coastal plain giving way to desert foothills to the east and north. Local vegetation is sparse coastal bush and grasses, with desert scrub inland. The Mediterranean climate is pleasant year-round. The strong Pacific influence creates cool summers and warm winters in comparison with other places at the same latitude. The climate varies according to proximity to the coast. Temperatures below freezing are rare, while desert-influenced temperatures above 90 or even 100 do occur. Desert winds bring the highest temperatures during early fall. Most precipitation falls in winter, but there may be an occasional thunderstorm or tropical rain. Morning ocean-borne low clouds (called "fog" or "June gloom" locally) occur in summer but usually dissipate by afternoon. Humidity is low and sunshine is plentiful for a marine location.
As of 2014, Lakeside's population is 21,191 people. Since 2000, it has had a population growth of -2.03 percent.
The median home cost in Lakeside is $381,000. Home appreciation the last year has been 17.30 percent.
Compared to the rest of the country, Lakeside's cost of living is 46.60% Higher than the U.S. average.
Lakeside public schools spend $11,158 per student. The average school expenditure in the U.S. is $12,435. There are about 22.1 students per teacher in Lakeside.
The unemployment rate in Lakeside is 6.00 percent(U.S. avg. is 6.30%). Recent job growth is Positive. Lakeside jobs have Increased by 1.04 percent.
Ranked #2 Drought-Riskiest CitiesRanked #2 Best-Rested Cities 2011Ranked #2 America's Most Playful CitiesRanked #3 Sleep in the City StudyRanked #3 America's Best (and Worst) Cities for DatingSee More Rankings Click Here
Average Commute time is 25 minutes. The National Average is 25 minutes.
Lakeside's Real Estate Market (click to see properties) • Newly Listed Homes • Most Expensive Listing • Million Dollar Houses • Homes from $750,001 to $1,000,000 • Homes from $500,001 to $750,000 • Homes from $250,000 to $500,000 • Homes under $250,000 • Median Priced Homes
its turned all to hell: i used to be proud of where i live and where i am from .. but it has gotten so nasty . i can't wait to move .. lakeside used to be country living.. and sure some people... (read more)Exspesnsive : San Diego County is very exspensive no matte where you live, however I would recommend moving to Lakeside as it is about 3% more cost effective to live in the area and... (read more)Lakeside California: We have lived in Lakeside for 8 years and love it. Our home has a nice big yard, views of rocky El Capitan, and you can hear the coyotes at night. Just 30 miles east... (read more)Have an opinion about Lakeside? Leave a commentTo See All SperlingViews for Lakeside Click Here


text:
Thanks for redeeming.{{else}}
Success! Thanks for repurchasing.{{/if}} {{else}} {{#if Expired}}
Increase my visibility!{{else}} {{#if IsMultiPack}}
{{#if HasMultiPack}} You have {{MultiPackCount}} top spot(s) left. Now loading you into the search listings... {{else}} You have used all top spots. Now loading you into the search listings... {{/if}}{{else}}
We are loading you into the search listing pages...{{/if}} {{/if}} {{/if}} {{/if}}
{{Current}} just saw you!{{/if}} {{#if LastTopSpotPurchaseIsMulti }} {{#if HasAnyTopSpot}}
{{#if HasFreeTopSpot }} {{ UnclaimedTopSpotFree }} Free {{/if}} {{#if HasPaidTopSpot }} {{#if HasFreeTopSpot }} & {{/if}} {{ MultiPackCount }} {{/if}} Top Spot{{#if Plural}}s{{/if}} Left{{else}}
0 Top Spot{{#if Plural}}s{{/if}} Left{{/if}} {{else}} {{#if HasFreeTopSpot }}
{{ UnclaimedTopSpotFree }} Top Spot{{#if Plural}}s{{/if}} Left{{/if}} {{/if}} {{else}} {{#if HasResults}}
{{Current}} see you now!{{else}} {{/if}} {{/if}}
You can now invite anyone to meet at your favorite Starbucks.
Limited-time feature
28 year old woman | Hialeah, FL, USA | Seeking men 26-40 within 50 miles
Prince charming.... Where are youu??!:)
Im a really outgoing, relax girl, Down to earth. I dont play games. I have strong character and I work very hard. I always finish what I start. I consider myself funny, loving, caring, love to spoiled people I love :) love to have long conversations by the beach and I'm a great listener as well. My friends always say I'm very mature for my age . Love to hangout with my friends, have fun, go to the beach, concerts, etc. I really enjoy cooking, reading, shopping, I'm a independent organized person. I have two beatiful and awesome kids which I love to death , they are my motivation , my everything. Im looking for someone that enjoys long conversations, go watch a movie, cook dinner together, have fun :). I will love someone that either has kids or likes kids of course, Due to I have two little ones. I will like someone that can go out and have fun or also stay home and cuddle watching a movie. someone that supports me in every aspects and shares every experience with me, good or bad.
Coffee and conversation , Cooking , Dining out , Movies/Videos , Music and concerts , Exploring new areas , Nightclubs/Dancing , Shopping/Antiques , Wine tasting
Bowling, Dancing, Soccer, VolleyBall
I exercise 1-2 times per week.
Z{{Cta}} {{#if HasMoreInfo}} ?{{CtaSecondary}} {{/if}}
|What she is looking for
|5'7" (170cms)
|5'5" (165cms) to 7'11" (241cms)
|Body type:
|Slender, About average, Athletic and toned, A few extra pounds, Stocky
|No preference
|No preference
|No Way
|No preference
|Social Drinker
|No preference
|Executive / Management
|No preference
|I'll tell you later
|No preference
|No preference
|Have kids:
|Yes, and they live at home
|No preference
|Wants kids:
|No preference
|Latino / Hispanic
|Latino / Hispanic, White / Caucasian, Other
|Christian / Catholic
|No preference
|English, Spanish
|No preference
|Associates degree
|No preference


text:
Privacy and Cookies
Pipistrel rolled out the first prototype Panthera light general aviation aircraft on 28 March at its factory in Ajdovscina, Slovenia.
The company says its engineers and technician started-up the aircraft's 210hp (157kW) Lycoming engine and conducted ground runs. Pipistrel will continue working on functional ground tests in preparation for first flight, it says.
"It is very exciting to witness the tests and see the aeroplane come to life for the very first time," Ivo Boscarol, Pipistrel's chief executive officer says. "This is definitely a very important milestone in the development of Panthera. We look forward to the continuation of tests and the first flight soon!"
Pipistrel says the Panthera is a four-seat aircraft capable of flying 1,000nm (1,852km), cruising at 200kt (370km/h), while burning 10gal (37.9l) per hour. It can be equipped with a conventional, hybrid, or an all-electric propulsion system, Pipistrel says.
Aircraft | Aerospace | Aviation | Military | Business aviation | MRO | General aviation | Space | Airports | Engines and propulsion | Flight tests | Accidents and incidents | Flightglobal blogs | E-newsletters |
Flightglobal dashboard | ACAS | MiliCAS | Ascend Fleets | Flightglobal Insight | ICAO | CapStats | Airport charges | Ascend Values | Aviation Exchange | Aircraft Ratings | Helicopter Fleets | Market Commentaries | FlightMaps Analytics | Industry resources
Browse by job role | Career advice | Jobs by email | Jobs search | Recruiter services
Airline Strategy Awards | Air shows | Conferences | Exhibitions | Flightglobal events
… part of Reed Business Information Copyright © 2015


text:
2 Reviews
5 star
4 star
2 star
1 star
Average Customer Review
Share your thoughts with other customersCreate your own review
Most Helpful First | Newest First
5 of 5 people found the following review helpful
3.0 out of 5 stars A Limited Edition for the Ultimate Phantom Fan...emphasis on LIMITED,
This review is from: Phantom Of The Opera - 25th Anniversary Deluxe Edition (Audio CD)
My first theatre experience was "The Phantom of the Opera" when it premiered in Toronto back in 1989 with Colm Wilkinson and Rebecca Caine. My father took me when I was only 5 years old and it definitely made an impression on me for life. Upon leaving the show that night my father bought me the CD and the hard cover book entitled, "The Complete Phantom of the Opera" from the gift shop. When I heard of this 25th Anniversary set, I needed to have it!
The set is quite impressive:
-the blue box with the 25th Anniversary mask emblem
-the original program from the London premiere
-Remastered Original London Cast Recording (certainly beats the original 1 track discs of the entire 1st and 2nd acts)
-"Love Never Dies" Cast Recording this was a pleasant surprise as we here in Toronto have not been given the pleasure of seeing the sequel to the Phantom. After hearing the entire score I have a new love for this story and I hope ALW will eventually bring this show here.
-25th Anniversary book which is a fabulous companion to my original "The Complete Phantom of the Opera" including a libretto in the back as well as updated pictures from both stage, the film and "Love Never Dies"
-Souvenir medallion
-The Phantom Phenomenon DVD with music videos, interviews and selections from ALW's 50th birthday
As much as this set is impressive it does have a few draw backs:
- the DVD could have had more content, it definitely doesn't seem like an hour's worth of Phantom features. It could have had more "Behind the Mask" if you will.
-A libretto for "Love Never Dies" would have been great considering most of the world has not seen this musical and could follow what is going on more clearly and also get to know the lyrics quicker for those singers out there. I know I love reading what I'm hearing!!
-The 25th Anniversary concert and recording would have made this set even better and more complete.
I think $140 is quite a bit for a 4 CD's that most of us already have 2 of and a DVD of snippets that most of us have seen on youtube.com. I do realize this is a limited edition but outside of the book and the "Love Never Dies" cast recording, this 25th Anniversary Edition is very LIMITED!!!! If you are a true blue Phantom fan this is definitely for you just be prepared you are paying more for the presentation of the set than content in the set.
3 of 3 people found the following review helpful
3.0 out of 5 stars Could have been so much better,
This review is from: Phantom Of The Opera - 25th Anniversary Deluxe Edition (Audio CD)
As a big Phantom fan I had to add this to my collection but was extremely disappointed with the contents. The Cd's don't have lyrics and are in paper sleeves and the discs fall out easily. Most of the content on the DVD can be seen on youtube and when I think of all the amazing stuff they could have put on it, I'm very disappointed. I will never understand why on earth they didn't include the 25th anniversary concert in this box set - unbelievable! We assumed it would be in there and were floored when it wasn't.
The book is awesome though - talks about the novel, musicals around the world, on film and love never dies. But not worth the money you pay for the whole set unless you're a die-hard fan. Great idea but poorly put together - whoever chose the contents should be ashamed :(
Most Helpful First | Newest First
Phantom Of The Opera - 25th Anniversary Deluxe Edition by Original Cast (Audio CD - 2011)
Click for more info
Not in stock; order now and we'll deliver when available


text:
Upload Photo
Located in The Garden City Hotel, Rein is under new management, as well as a new chef. Whether dining for brunch or for a special-event dinner, the food is satisfying and the restaurant is a great spot to look into if you're staying at the hotel itself.
16 hidden restaurants worth the hunt 50 Cheap Eats to try on LI Recent restaurant closures on Long Island The 10 best Italian restaurants on Long Island Recent Long Island restaurant openings 28 places to get amazing ice cream on LI 40 favorite outdoor dining spots on LI 23 must-eat lobster rolls on LI 21 new East End eateries to check out Restaurants with a water view 10 great eats en route to Jones Beach Dining on Fire Island: 9 picks


text:
Pictured in Red.
Click here to return to lifestyle photo.
A newer version of the Flash Player is required to enable the zoom feature.
Click here to get the current version.
OGIO® - Vault Messenger. 417012
This streamlined messenger holds all the essentials while protecting your tech gadgets.
OSFA: In Stock
Price starts at: $67.65
For detailed PRICING, please select "Add to
" to view the ordering/pricing grid.


text:
Colombian court: U.S. base agreement unconstitutional
- By Joshua Keating
Joshua Keating is associate editor at Foreign Policy and the editor of the Passport blog. He has worked as a researcher, editorial assistant, and deputy Web editor since joining the FP staff in 2007. In addition to being featured in Foreign Policy, his writing has been published by the Washington Post, Newsweek International, Radio Prague, the Center for Defense Information, and Romania's Adevarul newspaper. He has appeared as a commentator on CNN International, C-Span, ABC News, Al Jazeera, NPR, BBC radio, and others. A native of Brooklyn, New York, he studied comparative politics at Oberlin College.
Colombia's top court may have just put new President Juan Manuel Santos in something of a tough spot:
The Colombian constitutional court ruled yesterday that last year's agreement giving the US military access to more bases in the country is unconstitutional because it was not approved by legislators.
The court's decision, reached by a 6-3 majority, said however that the ruling does not affect US military personnel and contractors working from Colombian bases covered by earlier accords.
This means any US personnel at the seven bases included in the 2009 pact could shift to bases permitted by previous agreements while the government decides whether to put the latest accord before congress, where new President Juan Manuel Santos has a big majority.
Santos has defended the deal, which was inked by his predecessor Alvaro Uribe, but has also made a point early in his presidency of trying to improve relations with neighboring Venezuela, which is strongly opposed to the construction of a new U.S. base in Colombia.
While Santos may be able to get the agreement through congress easily, doing so will require him to take political ownership of the issue and force him to choose between increasing tensions with Venezuela just when they were starting to ease and offending Colombia's longtime backers in Washington.


text:
Solo Timelines
Category page
73,746pages on
this wiki
this wiki
This category details solo timelines. For a view of these timelines in tabular format, see Soloing Timeline.
"Tradeskillers have a series of quests available to them outside of the standard repeatable work...Tradeskill Timeline
"The main quests of the questline start with "Shattered Seas: ", during those signature quests...Shattered Seas Timeline
"The following quests give a positive faction reward for Othmir of Velious (Faction). The...Great Divide Timeline
"Soliddar will not talk to you until you complete the Mark of Awakening quest. The rewards of...Vesspyr Isles Timeline
"You MUST BE LEVEL 92 or better to begin this quest chain. Discovered item quests are possible...The Eidolon Jungle Timeline
"You need to be a lvl 95 crafter to start the quest. You will get an ingame mail. Read it to...Altar of Malice Crafting Timeline
"These quests become available after completing Some Assembly Still Required . For tradeskill...The Withered Lands Timeline
This category has only the following subcategory.
- [×] Chains of Eternity Timelines (3 P)
Pages in category "Solo Timelines"
The following 87 pages are in this category, out of 87 total.


text:
Originally written on The 6th Sens | Last updated 5/4/12
OTTAWA - DECEMBER 28: Alex Kovalev #27 and Peter Regin #43 of the Ottawa Senators have a few words before a faceoff against the Montreal Canadiens during their NHL game at Scotiabank Place on December 28, 2009 in Ottawa, Ontario, Canada. The Senators defeated the Canadiens 4-2. (Photo by Phillip MacCallum/Getty Images)
The Senators announced this afternoon that they have re-signed Peter Regin to a one year one-way contract. Steve Lloyd was the first one with the financial terms... Peter Regin joins us at 3:40. Has signed a new 1 year, 1 way contract with the #Sens. He made $1m last year, new deal is $800,000. — Steve Lloyd (@Steve_Lloyd) May 4, 2012 As lockers were being cleared out last Saturday, Regin made it clear he wanted to stay with the organization:"Well my contract is done. But I hope we can get something done so I can get a shot at coming back here. I love it here and this is where I want to be, so hopefully we can work something out and I can get another shot at it."He also spoke to the real concerns about his health going forward:"I'm still recovering, but it's looking good. The surgery went well and the structure inside the shoulder and everything is good, so now I just have to get stronger. ... It was a different injury this time, so it wasn't the same. It was just unlucky it...
Comments are closed.
What do you think?To leave a comment, you can:
NHL News
Delivered to your inbox
You'll also receive Yardbarker's daily Top 10, featuring the best sports stories from around the web. Customize your newsletter to get articles on your favorite sports and teams. And the best part? It's free!
Follow us on Twitter
|Best of Yardbarker
|NFL News
|MLB News
Today's Best Stuff
For Bloggers
Join the Yardbarker Network for more promotion, traffic, and money.
Company Info
What is Yardbarker?
Yardbarker is the largest network of sports blogs and pro athlete blogs on the web. This site is the hub of the Yardbarker Network, where our editors and algorithms curate the best sports content from our network and beyond.
|© 2015 Yardbarker, Inc. All rights reserved. Use of this website (including any and all parts and components) constitutes your acceptance of these Terms of Use and Privacy Policy. (What's New?)


text:
Boko Haram is wild and frightening, which is undermining the support it had. The Nigerian government could take advantage of this weakness.
The recent Chibok abduction has ignited widespread anxiety in Nigeria about the Boko Haram insurgency, which has gained momentum since 2009 following its attacks on police stations, and government buildings. Despite a year of emergency rule and military operations in the northeast, the insurgents are still able to execute ambitous operations, such as the mass abduction of 234 school girls in plain sight.
The Chibok abduction has, on the one hand, been a blow to the counter-insurgency efforts by the government, exposing the irrefutable security gaps in the Borno State. Insurgents are still able to operate with impunity in many rural areas, untouched by the military. However, the very nature of the Chibok abduction has also been a public relations disaster for Boko Haram revealing a disregard for even the most vulnerable civilians. Chibok is only one recent example of the insurgency's attacks on civilian targets. Over the last few months they have raided dozens of villages, killing hundreds of civilians.
Losing friends and alienating people
Insurgencies usually need some level of local support to survive in the long term. Popularity provides vital benefits including access to funding networks, a large pool of willing recruits, acquiescence and even support from local elites, and shelter from the military forces. Without these benefits, insurgencies are far more vulnerable to military defeat. In Afghanistan, the Taliban have for a number of years commanded the support of approximately a third of the Afghan population. This is one reason why they have proven extremely difficult to eliminate. But there are indications that Boko Haram's attacks on civilian targets are starting to undermine its local support base in Borno.
Recruitment challenges
International Crisis Group claimed in a recent report that the Boko Haram rank and file have been decimated by military operations. Interestingly, they appear to have struggled to regenerate through voluntary recruitment. The report suggests they have instead resorted to forced conscription and recruiting criminal guns-for-hire. They have also taken to recruiting from across the border in Cameroon, Niger, and Chad.
Although, these recruits might be considered as foreigners, the idea of distinct borders applies very loosely as with many nations across Africa. The recruits are Kanuri, tied to Borno by ethnic and cultural ties stretching back hundreds of years. Nonetheless, they are still outsiders in the sense they are not from local communities.
A few years ago Boko Haram would not have struggled to attract recruits in Borno. It started off as a mass movement, preying on the grievances of Borno's youth - unemployment, inequality, marginalisation, chronic poverty, and disillusionment with a government seen as distant and corrupt. It attracted followers by delivering services that the government couldn't provide. In addition to its Islamic appeal, it also became an expression of north-eastern nationalism; a conduit through which the people of the northeast could express their dissatisfaction with their region's increasing exclusion from the political and economic life of the rest of the country.
Unattractive leadership
However, under the leadership of Abubaker Shekau Boko Haram's popularity and therefore its ability to recruit, seems to be compromised. Shekau's alienating tactics will not come as a surprise to those who keep track of his public statements. His video messages often degenerate into violent, angry rants. In one recent example, he stated, "our religion and our way of worship is nothing but killings, killings and killings."
Arguably, Shekau has also gone out of his way to repudiate any sense that Boko Haram is a vehicle for north-eastern or northern nationalism. In a recent message transcribed in the New Issues Magazine Shekau explained, "Nigerians, let me let you know that you are in serious disaster. Don't think we are northerners, because you are misunderstanding the whole thing" then adding, "[we] are not fighting the north, we are fighting the world. And you will see us fighting the world. This is our job."
Equally, he has jeopardised the group's appeal to Muslims by threatening to kill Borno's Muslim leaders and by ultimately killing more Muslims than Christians.
More moderate voices within Boko Haram have reportedly been purged in recent years, including those who have advocated for dialogue with the government. Left without their moderating influence, Shekau seems to be turning Boko Haram from a mass movement into a rampaging, LRA-like sect with outsiders, criminals, and forced conscripts for soldiers.
Security and politics
Therefore, Boko Haram would be vulnerable to a counter-insurgency strategy that includes political elements. The strategy advocated by the president's new National Security Adviser, Sambo Dasuki, is promising in this respect. For the first time, it acknowledges the role of political counter-insurgency. An alternative to the solely military strategy the government has pursued up until now, with all its collateral damage, has undoubtedly left many in Borno wondering which is worse, Boko Haram or the security forces.
There is the potential for Nigeria to build the counter-insurgency campaign into a mass movement, rather than a solely military enterprise. "I don't mean turning millions of civilians into soldiers. I mean simple things like encouraging people to inform on Boko Haram rather than sheltering them, and to dissuade their sons, brothers, and friends from joining them", Dasuki explained.
Although, the following steps appear to be simple, they are quite the opposite, requiring close relationships between the army, the police, the government, and the conflict-affected communities. They require diplomacy and trust. It remains to be seen whether the Nigerian government actually takes advantage of this weakness.
Andrew Noakes is a writer and journalist formerly of Amnesty International and Save the Children. Follow him at @andrew_noakes.


text:
Introduces the basic and not-so-basic features of mental ray, the production-proven renderer of choice for many 3ds Max users.
Create highly realistic 3D architectural drawings (including interior/exterior elements) with the lights, materials, camera, and render options in Twilight.
Create highly realistic 3D architectural drawings with V-Ray, a popular third-party renderer for SketchUp.
"Wow! It just keeps getting better and better. I hate the fact that I will never be able to quit—I am now a lynda.com addict." —Sharon W.
more from our members »


text:
Fish Nicoise
5 Nov 2010
|1 Kilogram, skinned and filleted
|Bechamel sauce
|250 Milliliter (1 cup)
|Court bouillon
|1 1⁄4 Cup (20 tbs)
|Grated cheese
|100 Gram (1 cup)
|Tomato sauce
|500 Milliliter (2 cup)
|Lemon juice
|2 Tablespoon
|Chilli powder
|1 Teaspoon
|Green chillies
|3 , chopped
|2 Teaspoon
|Freshly ground black pepper
|1⁄2 Teaspoon
|5 , stoned and sliced (for garnish)
|Chopped garlic
|2 Tablespoon, salted lightly (for garnishing)
1. Wash and pat dry fillet. Sprinkle salt, pepper and lemon juice.
2. Cut the fillets into 2 or 3 parts or roll them up before cooking.
3. Chop the fish trimmings. Mix chilli powder with bechamel sauce.
4. Spread the sauce mixture on each fillet. Sprinkle grated cheese and roll up each piece carefully.
5. Place on a baking dish, cover with court bouillon. Cover and bake in moderate oven (1 80°C-350°F-gas mark-4) for 20 minutes.
6. Drain well and transfer to a clean baking dish. Keep warm.
7. Just before serving coat well with hot tomato sauce. Garnish with chopped chillies, garlic and olives.
Recipe Summary
Rate It
0 Comments
Fish Nicoise Recipe


text:
Thanks for redeeming.{{else}}
Success! Thanks for repurchasing.{{/if}} {{else}} {{#if Expired}}
Increase my visibility!{{else}} {{#if IsMultiPack}}
{{#if HasMultiPack}} You have {{MultiPackCount}} top spot(s) left. Now loading you into the search listings... {{else}} You have used all top spots. Now loading you into the search listings... {{/if}}{{else}}
We are loading you into the search listing pages...{{/if}} {{/if}} {{/if}} {{/if}}
{{Current}} just saw you!{{/if}} {{#if LastTopSpotPurchaseIsMulti }} {{#if HasAnyTopSpot}}
{{#if HasFreeTopSpot }} {{ UnclaimedTopSpotFree }} Free {{/if}} {{#if HasPaidTopSpot }} {{#if HasFreeTopSpot }} & {{/if}} {{ MultiPackCount }} {{/if}} Top Spot{{#if Plural}}s{{/if}} Left{{else}}
0 Top Spot{{#if Plural}}s{{/if}} Left{{/if}} {{else}} {{#if HasFreeTopSpot }}
{{ UnclaimedTopSpotFree }} Top Spot{{#if Plural}}s{{/if}} Left{{/if}} {{/if}} {{else}} {{#if HasResults}}
{{Current}} see you now!{{else}} {{/if}} {{/if}}
You can now invite anyone to meet at your favorite Starbucks.
Limited-time feature
30 year old man | Lewisville, TX, USA | Seeking women 18-35 within 100 miles
Do you have a Band-Aid? Because I just scraped my knee falling for you.
I'm an easy going guy who doesn't take himself too seriously. Friendly and personable, people open up around me and seem to enjoy my company. My laid back personality makes it so I can enjoy the little things in life like taking my dog to the park or catching a casual round of golf. I'm a caring and considerate guy who puts emphasis on what matters: spending time with my family and friends. Now I'm going to move on to more serious things. I have a few unhealthy weaknesses that I couldn't live without like sweet tea, pizza, and gummy bears. I've been told I make the best four cheese lasagna Hamburger Helper by multiple people. It will probably be served on plastic plates I got from Target for a dollar just because I really like lime green. What I'm looking for is a lady who is a lot like me, especially when it comes to being outgoing. I'm looking for that down to earth woman who is easily approachable. She'll be independent, but still interested in making this into a long term relationship. Smart, funny and beautiful, she makes me want to be a better man for her. Most of all, it's her vivacious (is that the word I'm looking for?) spirit and playful personality that attracts me.
Coffee and conversation , Cooking , Dining out , Movies/Videos , Museums and art , Exploring new areas , Playing sports , Shopping/Antiques , Travel/Sightseeing , Video games , Watching sports
Baseball, Basketball, Bowling, Football, Golf, Running, Soccer, Swimming, Tennis / Racquet sports, Walking / Hiking, Weights / Machines
I exercise 3-4 times per week.
I have Dogs, Fish
I have a Shiba Inu named Zoey who is quite the handful and a beta fish named Jaws.
I enjoy going out to Mexican, Italian, and Cajun places. I have a weekly appointment with the local Which Wich sandwich shop and Target.
Vernon College, Vernon, TX
Musically, I listen to country and alternative rock artists like: Taylor Swift, Blake Shelton, Gary Allen, Eli Young Band, Florida Georgia Line, Casey Donahew Band, Daughtry, Linkin Park, Lifehouse, Stone Sour, Shinedown, and Maroon 5.
I enjoy golfing and going to the dog parks with Zoey. The outdoors in general is always nice and I like to get out to the local parks or hiking trails. I like watching or playing football, basketball and soccer.
I pick up the occasional Golf Digest, but I really enjoy movies. From Forgetting Sarah Marshall and The Dark Knight Rises, to Gone in 60 Seconds and anything with Will Ferrell in it, I'm always game for a good movie. I also enjoy The Big Bang Theory!
Z{{Cta}} {{#if HasMoreInfo}} ?{{CtaSecondary}} {{/if}}
|What he is looking for
|6'2" (187cms)
|5'0" (152cms) to 6'3" (190cms)
|Body type:
|Slender, About average, Curvy, Athletic and toned
|No preference
|Dark brown
|No preference
|No Way
|No Way
|Never, Social Drinker
|Retail / Food services
|No preference
I work at Amazon. Work hard. Have fun. Make history.
|$35,001 to $50,000
|No preference
|Never Married
|Never Married, Divorced
|Have kids:
|Yes, and they sometimes live at home, No, Yes, and they live away from home, Yes, and they live at home
|Wants kids:
|Definitely, Someday, Not sure
|White / Caucasian
|Asian, Latino / Hispanic, White / Caucasian
|Christian / Other
|No preference
|Some college
|No preference
I went to a two-year training center for my Airframe and Power plant License.


text:
July 3, 2015
Stay Connected Anywhere
Stay Connected Anywhere
TOPEKA, Kan. (AP) _ The state's pension system has been looking healthier thanks in part to investment gains and legislative changes that boosted employer and employee contributions.
Patrice Beckham, an actuary with the Cavanaugh Macdonald consulting firm, told the Kansas Public Employees Retirements System's Board of Trustees that the state's pension system has reached an important benchmark of 60 percent funded at the end of 2013.
The state's pension system improved in part because of a 17 percent investment return last year.
The Topeka Capital-Journal reports that KPERS was last above 60 percent funded in 2010. Beckham also said the pension system's projected debt dropped by almost $500 million in 2013, from about $10.3 billion to about $9.8 billion.
Posted by: Lindsay Sax
Click Here to access the online Public Inspection File
Viewers with disabilities can get assistance accessing this station's FCC Public Inspection File by contacting the station with the information listed below. Questions or concerns relating to the accessibility of the FCC's online public file system should be directed to the FCC at 888-225-5322, 888-835-5322 (TTY), or email@example.com.


text:
Task force to chase fugitives
U.S. Marshal to help county nab violent criminals
The Nueces County Sheriff's Department will get a hand with warrants for violent offenders and will be eligible for as much as $15,300 in annual overtime for a deputy assigned to a new task force headed by the U.S. Marshals Service.
U.S. Marshal Carlos Trevizo is coordinating the Gulf Coast Violent Offender and Fugitive Task Force, which will use law enforcement agencies from surrounding counties to go after violent offenders and fugitives.
Nueces County Commissioners on Wednesday unanimously agreed to a cooperative agreement with the Marshals Service that will allow some 1,300 active felony warrants to be chased in Nueces County alone. Trevizo said participating agencies get an entire task force, including federal agents in other states, to chase their bad guys.
"Each representative gives one body for the task force, and we adopt their warrants," Trevizo said. "If you have a burglar with a violent history, that automatically falls into our responsibility. We will also pursue out-of-state warrants. We will say, 'we have a guy out of Nueces for murder,' and they go get him."
The warrants must include a crime of violence or an offender with a history of violence that would allow the task force to pursue things such as probation violations.
"This allows Nueces County to continue to cooperate fully with all levels of law enforcement and particularly in an area as important to the citizens of the county such as drug trafficking," County Judge Loyd Neal said.
The goal, Trevizo said, is to grow the task force. Similar organizations in other states pay as much as $42,000 in annual overtime to law enforcement officers, he said.
"It's new to Corpus Christi," he said. "We have to start somewhere to see if we are serious and interested in having this task force."
Contact Jaime Powell at 886-3716 or firstname.lastname@example.com
Subscribe to the Caller-Times
Need Help? Call us at 1-800-566-8098.
Monday-Friday: 6am-3pm / Saturday: 7am-11am / Sunday: 7am-11am


text:
Love Story, A
Customers Who Bought This Product Also Bought
Fall in love with their story.
New romance novelist Michael (Xander Corvus) is experiencing writers block after the love of his life walks out on him. With his publishers' deadline fast approaching, his agent brings in Danielle (jessica drake). She's tasked with getting him back on track to finish his latest masterpiece. The two couldn't be more different, but they soon realize that opposites attract. The underlying sexual tension between them breathes new life into the hot, steamy characters in the book. When Danielle walks in on her boyfriend doing a little romancing of his own, she ends up back at Michael's. Before the night is over the new lovers show that their passion isn't confined to the pages of his novel. But with the final chapter is in sight, will "The End" mean the end of their budding romance?
Product Information
DetailLength 1 hrs. 36 mins.
Rating XXX
Released May 09 2012
Added Apr 24 2012
Production Year 2012
Empire SKU 1613269
Studio Wicked Pictures
Number of Discs 1
UPC Code 713079759037
Interactive Menus
Chapter Selection
Website Information
Bonus Scenes
- Jessica Drake - (bio) - (interview)
- Kiara Mia
- Tasha Reign - (bio)
- Aleksa Nicole
- Xander Corvus
- Rocco Reed
- Niko
- Marco Rivera
- Brad Armstrong Director


text:
Total Items: 0 Current Total: $0.00
View Larger Image
Email this product to a friend
The Resilient Valve Fed M.IV Steampunk Vaporiser is the ideal sidearm for a man who likes to travel and has an amiable temperament about his persona. The resilient Valve allows up to eight hours of power and no need of steam in any way, makes for a quieter and more enjoyable experience. This item is removable from the stand. The Steampunk Vaporiser is made of cold cast resin, and its details have been hand painted. It measures 7 inches long.
Steampunk item
Removable from stand
Cold cast resin
Hand painted details
Measures 7 inches
Copyright © 1995 - 2015 By The Sword All rights reserved
Contact Us: firstname.lastname@example.com


text:
Your browser does not support iframes.
Philadelphia Phillies (62-73) at New York Mets (63-73), 1:10 p.m.
Probable Starting Pitchers: Philadelphia - A.J. Burnett (7-14, 4.30) New York - Dillon Gee (5-6, 3.77)
(SportsNetwork.com) - The Philadelphia Phillies have had trouble with the New York Mets this season, but can record a series win Sunday in the finale of a three-game set from Citi Field.
The Phillies are only 6-12 against the NL East-rival Mets and evened this series with Saturday's 7-2 triumph behind another strong start from Jerome Williams and a five-run sixth inning. Williams is 3-0 with the Phillies and allowed two runs in 6 1/3 innings.
Marlon Byrd homered to open the scoring in the fifth and Ryan Howard drove in two runs in the sixth inning. Howard had three RBI on the night, while Domonic Brown and Cody Asche both knocked in runs for the Phillies, who are aiming to win four straight series for the first time since July 2-14, 2013.
"Guys did the job with men on third base, key hits, sac flies. We really made the most of our opportunities with men in scoring position," Phillies manager Ryne Sandberg said.
Philadelphia will also visit Atlanta and Washington on this nine-game road trip and is a half-game behind the Mets for last in the NL East.
Hoping to pitch the Phils out of the division basement Sunday will be A.J. Burnett. Burnett was 0-6 in seven starts -- all Philly losses -- from July 18 - Aug. 19 and defeated Washington on Monday in a 3-2 triumph. Burnett struck out 12 batters and allowed just one run in seven innings for his first win since July 11 versus the Nationals.
The veteran right-hander improved to 7-14 with a 4.30 ERA in his first season with the Phillies and hopes to find some success on the road, where he is 3-8 in 14 chances. In 23 career starts against the Mets, Burnett has a 5-8 mark and a 4.04 ERA.
New York has lost three of four and eight of its last 12 games.
Bartolo Colon fell apart late in the start for the Mets last night and was touched for six runs and nine hits in 5 1/3 innings.
"Obviously he was getting way too much of the plate," Mets manager Terry Collins said of Colon.
Wilmer Flores and Juan Lagares each had an RBI, while Matt den Dekker recorded a team-best two hits for the Mets, who haven't won a series since winning three of four games in south Philly from Aug. 8-11.
New York will next visit Miami and Cincinnati after hosting the Phils.
The Mets will hand Dillon Gee the ball Sunday and he is 5-6 with a 3.77 earned run average. Like Burnett, Gee halted a winless streak his last time out in a 3-2 win over Atlanta by tossing 6 2/3 innings of two-run ball. He was 0-5 in his previous seven outings and won for the first time since July 9 versus the Braves.
Gee, a right-hander, is 3-3 in 10 home starts and 3-4 with a 6.53 ERA in 13 career games (12 starts) against the Phillies. He defeated the Phillies on the road Aug. 9 by holding them to a run in seven innings of a 2-1 victory. However, Gee gave up five runs in 6 2/3 innings of a 6-0 loss versus Philadelphia on July 29.
The Phillies have lost 11 of their last 15 games against the Mets. New York hasn't defeated the Phillies 13 times in one season since 1987. It also posted 13 wins back in 1970, 71 and 72.


text:
my rig at 2560x1600
So I purchased a 3008wfp this morning, I should be getting it tomorrow.
Anyhoo, i'm sold on the monitor now i'm wondering if my rig will be up to spec when it comes to gaming at 2560x1600 and if not what should I be looking at as my upgrade path.
Wait for Fermi to be released and get two of those (selling my 285's of course), or pickup dual 5870's in xfire?
I don't have a PSU strong enough for tri sli so I believe adding a third 285 is out of the question and purchasing a psu + 3rd 285 would more than likely be around the same price as two new gpu's.
So to sum it up, what should I be looking at to make my hd gaming more enjoyable?
I play a bit of everything but mainly shooters.
Re: my rig at 2560x1600
If your current cards don't cut it, I'm certain dual 5870s would. :D
Fermi is so up in the air right now, I'd not wait for it you have the money for new cards now.
It could be a stellar performer, or it could be the GFFX series all over again.
It could be released in two months, or four- nobody but nVidia's higher ups know it seems.
So, I'd just get the 5870s. If Fermi comes out and proves to be the best thing since sliced bread- sell the 5870s and get a couple "Fermis". If it proves to be a flop then you're still set with the two 5870s.
That's my opinion. :D
Re: my rig at 2560x1600
I can game at 2560x1600 very acceptably with 2x GTX 280 in SLI on nForce980a with a 3.8 gig Phenom II (need a larger heatsink to get much faster).
I doubt you will have any trouble with two 285's.
Re: my rig at 2560x1600
Well thats assuring, I will try it and see what I get performance wise in the few games I have installed.
Re: my rig at 2560x1600
i have a 30 inch apple display and one 260gtx i game mostly call of duty 5 or 6
but they play fine at 2560x1600 on highest in game setting and 8xaf 2xaa
aa is the killer for my card at that res but not really needed at that res
now a game like arma2 is another story but i think that that game kills almost any card setup
oh 920 i7 6gig ram vista 64 and junk
Re: my rig at 2560x1600
oh yea, i'd wait for nvidia
Re: my rig at 2560x1600
Yeh i'd wait... 285's in SLI should handle that res fine in almost any game save for crysis... Even then I'm sure it'll be acceptable just not what you're used to
Re: my rig at 2560x1600
And slawter, its not an ACD but it'll do for me :)
I'm picking it up during lunch!
I can't freaking wait lol
EDIT: Oh I missed the second monitor you had listed.
Re: my rig at 2560x1600
I don't know how well this will translate to your setup, but here's my config:
i7 920 @ stock
Intel x58 mobo
2x 8800GTXs (slightly downclocked to help keep them cool).
I'm able to play the original Crysis in DX10 (all in-game settings maxed, and all driver control panel options maxed for highes possible IQ- including SLi 32x AA) and still have perfectly smooth gameplay. How? Well, I'm gaming on a 17" (15" viewable) LCD I pulled from recycling at work. It's max res is 1024 x 768.
But still, with all that eye candy even at that low of a resolution- I'd wager your current cards should be fine. Maybe not with SLi 32xAA but they'll still get the job done. :lol:
If not, I can guarantee two 5870s will. ;)
Re: my rig at 2560x1600
And I think its my turn for dinner today, so i'll see what the lady wants to eat.
I love the look of the box so far though! lol, i'll post up my thoughts later this evening. I'm going to install Warhead tonight as well just so I can see the performance.
And I can't hook up my macbook to this I don't think because hdmi won't send 2560x1600 or at least i'm told it won't (doesn't hdmi 1.3 support that?).
Display port adapter is on the way as well.
Re: my rig at 2560x1600
This monitor is bad ass...
I just got home and got it connected
Re: my rig at 2560x1600
|All times are GMT -5. The time now is 12:30 PM.
Powered by vBulletin® Version 3.7.1
Copyright ©2000 - 2015, Jelsoft Enterprises Ltd.
Copyright ©1998 - 2014, nV News.


text:
The Times and N.B.A. Settle Lawsuit Over Photos
By DAVID D. KIRKPATRICK
Published: April 10, 2001
The New York Times Company and the National Basketball Association have settled a lawsuit over who owns the right to sell newspaper photographs taken at basketball games.
The lawsuit is part of a wave of disputes pitting sports leagues and other live entertainment companies against news organizations. Both sides are eyeing the money to be made selling images and information about live events over the Internet and elsewhere. Sports leagues argue that depictions of their events are their intellectual property and subject to their rules. In response, news organizations say that the pictures and information they gather are their own property, and that disseminating them is their right under the First Amendment.
Last spring, The New York Times began selling on its Web site a collection of photographs from its archives, including five photographs of the 1999 basketball playoffs.
In July, the basketball association filed suit against The Times in New York State Supreme Court, contending that selling the photographs breached a contract on the back of journalists' press passes. The press passes' label prohibits the use of information or pictures from the games except for reporting the news.
To settle the suit, The Times and the basketball association agreed that The Times would display an N.B.A. logo on its Web site and in any advertisements for the photographs. The Times Web site will also include a link to the N.B.A.'s.
Several sports organizations have recently explored making similar claims. Last month, Major League Baseball began asserting new rights to control pictures and reports about its games. The organization proposed that to enter its games reporters and photographers must sign a statement restricting the use of photographs and information about the games.
News organizations are close to a settlement with Major League Baseball over the proposal.
Lawyers for the news organizations have won the right to use photographs in advertisements promoting their publications. They also point to a precedent in which Motorola defeated a challenge by the N.B.A. to the company's practice of broadcasting scores in real time over pagers.
But reporting scores and selling pictures pose distinct legal issues, said Lorin L. Reisner, an intellectual property lawyer at the firm of Debevoise & Plimpton who has represented the National Football League and the National Hockey League in similar matters. He also filed a brief in the case against Motorola.
That lawsuit charged the violation of specific prohibitions against the misappropriation of ''hot news.'' Motorola won because the basketball league failed to show it was harmed.
On the other hand, courts have sometimes blocked Web sites from broadcasting play-by-play details of sporting events while they are taking place.
Mr. Reisner said cases about the sale of posters and other products derived from games were essentially business disputes between two commercial enterprises and depended on the details of the agreements between them. He noted that in applying the First Amendment judges distinguished between reporting the news and selling commercial products like posters.
Among other arguments, the lawyers for The Times disputed the validity of the press pass as a contract. They also argued that the images were journalism, protected by the First Amendment.
Officials for the basketball association said they would seek only to control the use of images for commercial purposes, not for news reporting.


text:
Peter Jackson 'eviscerated' 'The Hobbit,' 'LOTR,' says Tolkien son
Christopher Tolkien, son of J.R.R. Tolkien and executor of his father's literary estate, expressed disappointment in the films made of the books by Peter Jackson.
During his first interview in 40 years in June, with the French publication Le Monde, Tolkien, 87, said that Jackson "eviscerated the book by making it" into "an action movie for young people aged 15 to 25," he said of the "Lord of the Rings" films. "And it seems that 'The Hobbit' will be the same kind of film." »Read Full Blog Post(1)
Video: The Concert Corner - Previewing Imagine Dragons, Tame Impala and more
It's a busy weekend for shows in Milwaukee, with fast-rising alternative rock act Imagine Dragons at Eagles Ballroom and critically acclaimed psychedelic group Tame Impala at Turner Hall Sunday. Unfortunately both shows are already sold out. But in this week's Concert Corner video chat with CineStars' Brittany Umar, I talk about another promising show (actually, series of shows) happening Saturday--although the promoter told me that he's expecting all the tickets will be bought in advance.
The poetry of Kevin Giese's Winter Chapel
What a lovely and generous project. Every year, the Portrait Society Gallery commissions an artist-made winter chapel, a place for reflection and quietude during these months of harsh weather and inwardness in the Midwest. This year's chapel, one of my favorites, was created by Kevin Giese. It is so simple, constructed with a curved wall and hollow, hand-stitched birch trees.
Four Oscar-nominated films coming to Milwaukee
Of the five foreign-language Oscar nominees, only one - the winner, "Amour" - is showing locally, at the Downer Theatre, where it will continue at least through early March.
But the four other films have yet to play here. »Read Full Blog Post
Oscar ratings down locally
The 2013 Oscar telecast on ABC affiliate WISN-TV (Channel 12) earned a 25 rating among total households, down slightly from last year's 27 rating.
The ratings for the show, which officially lasted 3 hours and 37 minutes, peaked at 7:45 p.m. with a 28.2 rating but were otherwise remarkably steady through Ben Affleck picking up the best picture Oscar for "Argo." »Read Full Blog Post
Hispania, a Mexican fusion restaurant, planned for Delafield
A Mexican-fusion restaurant called Hispania is expected to open in May on Genesse St. in Delafield.
It will be in the same building that houses Oliva Di Vita, InStep Running and Elements East. »Read Full Blog Post(2)
John Axford has near-perfect night with Oscars
Phoenix - Brewers closer John Axford, a real movie buff, has fun every year picking the winners in various categories for the Academy Awards, tweeting his choices ahead of time.
Axford almost ran the table in the 15 categories in which he made picks Sunday night, missing only Best Director. He went with Steven Spielberg of "Lincoln" and Ang Lee of "Life of Pi" was the winner in probably the biggest upset of the night. »Read Full Blog Post(1)
TV's Jillian Michaels, Katey Sagal at Riverside this spring
Two of TV's toughest ladies—"Biggest Loser" fitness coach Jillian Michaels and "Sons of Anarchy" star Katey Sagal—are coming to the Riverside Theater May 5 and April 19, respectfully.
Harbor House will hold its first classes, with tastings
Starting in March, chef Zach Espinosa will lead the first classes at Harbor House, the Bartolotta group's seafood restaurant at the lakefront.
The classes are: »Read Full Blog Post
Billboard changes "Shake" up Top of the Charts
This week Billboard announced a change to its Hot 100 formula for chart methodology that now incorporates YouTube views alongside radio play, digital sales and online radio play. The result finds a song that rose to popularity due much to its own YouTube video falling to a chart newcomer that found success as the basis of the biggest current Internet meme. Take a look below to find out the full scoop and the jump back to find out which songs were the biggest hits this week in 2007, 1997, 1987 and 1977.
No. 1 hit Feb. 25, 2013 »Read Full Blog Post
On Tap for Today: Marquette on the court and a CD release party
Did you stay up late for the Academy Awards? How about that Best Picture Oscar? Whew.
So you want to know what's going on today. Here are a few things that might whet your whistle for entertainment. »Read Full Blog Post
Summerfest Rock Stage to become Uline Warehouse
The Summerfest Rock Stage is getting a new name and more types of music.
Uline, Inc., the Pleasant Prairie-based distributor of shipping, industrial and packaging materials, has signed a three-year stage sponsorship deal with Summerfest. As a result of the agreement, whose financial details have not been disclosed, the Summerfest Rock Stage on the far north end of the grounds will be called the Uline Warehouse. »Read Full Article(9)


text:
The lobby full of people shouting into cell phones is a giveaway that this is the city's best business hotel. It's on a hill high above Parque Los Tecajetes, so there's a nice view, but you'll need to take taxis back and forth into town.
Victoria at Bustamante, , Zona Centro, Xalapa, Veracruz, 91000, Mexico
228-818–2222; 228-817–7064
Website: www.hotelxalapa.com.mx
Hotel Details:
Oct 3, 2012
The guest room smells of mildew, probably from the worn out and outdated carpeting. The bathroom needs updating as well. There is no way to control the temperature of the room. It was hot and even after calling the front desk and asking if there was any way to turn up the air conditioning and being told that it would be taken care of it was still hot for the rest of the night, especially in the bathroom were there is no air conditioner vent. When
I tried to use the iron, the room´s power went out. I had to call the front desk to get it turned back on and the same thing happened a little while afterward and a little while after that. There is no refrigerator in the room but there is a coffee maker. The hotel provides one single brew bag of coffee (Caffeinated or decaf, who knows?)and a few sugar packets. Again, we called the front desk and asked for some creamer and splenda and another pack of coffee for in the morning and their reply was that they only provided what was in the room as a courtesy and could not give us anything in addition to that. The complimentary continental breakfast consisted of a cup of coffee a small plate of fruit and a few rolls. Is this the quality of service that people in Mexico are accustomed to paying for? I could pay $30 in any American roach motel and get a room with proper air conditioning, electricity capable of powering the tv and the iron at the same time, as many packs of coffee as I want, and a continental breakfast 100 times more nutritious. Its time for the service industry in Mexico to step up to international standards.
No Thanks


text:
FZ150 accessories
Started Jan 14, 2013 | Discussions thread
Regular Member • Posts: 152
FZ150 accessories
Jan 14, 2013
I have these items listed for the Panasonic FZ150 in the "For Sale Section"...!!!! http://forums.dpreview.com/forums/post/50475002
Panasonic Lumix DMC-FX150 Panasonic Lumix DMC-FZ150
If you believe there are incorrect tags, please send us this post using our feedback form.
Reply to thread Reply with quote Complain
|Post ()
|Posted by
|Jan 14, 2013
|Jan 14, 2013
|Jan 15, 2013
|Jan 15, 2013
|Jan 15, 2013
|Jan 15, 2013
Keyboard shortcuts:
FForum PPrevious NNext WNext unread UUpvote SSubscribe RReply QQuote BBookmark post MMy threads
Color scheme? Blue / Yellow