text:
Prince Gong (Qing dynasty)
|This article needs additional citations for verification. (April 2008)
- This is a Manchu name; the family name is Aisin Gioro.
|Aisin Gioro Yixin
|Prince Gong of the First Rank
|In office
25 February 1850 – 29 May 1898
|Appointed by
|Daoguang Emperor
|Preceded by
|(None. Title created.)
|Succeeded by
|Leader of the Zongli Yamen
|In office
20 January 1861 – 8 April 1884
also bore the title Prince Regent (議政王)
|Xianfeng Emperor
Tongzhi Emperor
Guangxu Emperor
|Succeeded by
|Prince Qing
|In office
29 September 1894 – 29 May 1898
|Guangxu Emperor
|Preceded by
|Prince Qing
|Succeeded by
|Prince Duan
|Chief Councillor of the Grand Council
|In office
1853-1855, 1861-1884
|Xianfeng Emperor
Tongzhi Emperor
Guangxu Emperor
|Personal details
|11 January 1833
|29 May 1898
(aged 65)
Beijing, China
|Lady Guwalgiya
|Daoguang Emperor (Father)
Empress Xiaojingcheng (Mother)
Xianfeng Emperor (Brother)
Tongzhi Emperor (Nephew)
Guangxu Emperor (Nephew)
|Kurun Princess Rongshou
|Prince Gong Mansion
|Aisin Gioro Yixin
|Traditional Chinese
|Simplified Chinese
|Prince Gong
|Traditional Chinese
|Simplified Chinese
Yixin (Manchu: ᡳ ᡥᡳᠨ I Hin, Chinese: 奕訢; 11 January 1833 – 29 May 1898), commonly known by his title Prince Gong (Chinese: 恭亲王), was an imperial prince of the Manchu Aisin Gioro clan, and a statesman and major political figure of the late Qing dynasty in China. He was the sixth son of the Daoguang Emperor and a half brother of Daoguang's successor, the Xianfeng Emperor. He served as a regent during the reign of Xianfeng's son and successor, the Tongzhi Emperor. Having established the Zongli Yamen — a government body in charge of foreign affairs — in 1861, Yixin is best remembered as a proponent of friendly relations between the Qing government and other great powers of that era, as well as for his attempts to modernise China in the late 19th century. The last decades of his career were marked by conflict with conservative elements in the court, and he died in relative disgrace.[1]
Early life[edit]
Yixin was born of the Manchu Aisin Gioro clan, the imperial clan of the Qing dynasty, as the sixth son of the Daoguang Emperor. His mother was Noble Consort Jing (posthumously known as Empress Xiaojingcheng) of the Mongol Borjigit clan.
Yixin was mentored by Zhuo Bingtian (卓秉恬) and Jia Zhen (賈楨), and was known to be a bright and diligent student. When the Daoguang Emperor was selecting an heir apparent from among his sons, he was unable to decide between Yixin and his fourth son, Yizhu (the future Xianfeng Emperor), but eventually wrote a secret edict in 1846 announcing that he had designated the latter as his successor. Three years later, the Daoguang Emperor had a tomb built in the consorts' cemetery for Yixin's mother, Noble Consort Jing, and ordered that she must be buried there after death. Daoguang's action hinted that he would never appoint Yixin as his successor because if Yixin did become the emperor later, his mother would be posthumously honoured as an empress. Qing empresses who died before their husbands were buried together with their husbands, while those who died after their husbands had individual tombs for themselves. Since Daoguang already had a tomb built for Yixin's mother before she died and ordered that she be buried there after death, this meant that he only regarded her as a secondary spouse, so her son would never become the emperor.
In February 1850, before his death, the Daoguang Emperor revealed the secret edict he wrote in 1846,[2] which decreed that Yizhu would be instated as the Crown Prince (皇太子), while Yixin would become a Prince of the First Rank (親王). Yixin married the daughter of Guiliang (桂良), an important court official of the Manchu Gūwalgiya clan. The marriage is often seen as a sign that the Daoguang Emperor favoured Yixin, but in fact the marriage was arranged after Daoguang had appointed Yizhu as his heir, so this marriage may only be viewed as an act of "compensation" for Yixin. Besides, Yixin's wife was not a favourite daughter of Guiliang and was born to Guiliang's secondary spouse.
During the Xianfeng Emperor's reign[edit]
During the reign of the Xianfeng Emperor, Yixin and his mother (who held the title of Dowager Consort) falsified an imperial edict in Xianfeng's name that granted Yixin's mother the title of "Empress Dowager". Xianfeng was greatly displeased but he did not rescind the edict in order to save himself from public embarrassment. Yixin's mother died after being the Empress Dowager for eight days and was posthumously honoured as Empress Xiaojingcheng. Yixin did not play an important roles in politics and only served as a military minister from 1853 to 1855.
In 1860, during the Second Opium War, Yixin was appointed as an Imperial Envoy with Full Authority (全權欽差大臣) and was ordered to remain in the capital, Beijing, to negotiate with the British, French and Russians on behalf of the Qing government. The Xianfeng Emperor fled from Beijing and moved his imperial court to the Chengde Summer Palace in Hebei. Yixin was successful in the negotiations and concluded the Convention of Beijing with the Western powers.
The Xianfeng Emperor died in the summer of 1861 in the Chengde Summer Palace and was succeeded by the young Tongzhi Emperor. Before his death, Xianfeng appointed Zaiyuan, Duanhua, Sushun and five other senior court officials to serve as regents for the Tongzhi Emperor.
As Prince-Regent[edit]
In November 1861, Yixin plotted with the empress dowagers Cixi and Ci'an to launch a coup, known as the Xinyou Coup (辛酉政變), to seize power from the eight regents. The regents were escorting the Xianfeng Emperor's coffin back to the Forbidden City when they were intercepted upon arrival and placed under arrest. Zaiyuan and Duanhua were forced to commit suicide, Sushun was executed, while the five other regents were stripped of power.
After the Xinyou Coup, the empress dowagers Cixi and Ci'an became co-regents of the Qing government while Yixin was appointed as Prince-Regent (議政王) and placed in charge of important state affairs, including control over the Grand Council. Yixin remained in power as regent from 1861 to 1884 throughout the reigns of the Tongzhi and Guangxu emperors. In 1861, Yixin established the Zongli Yamen, which functioned as the Qing government's de facto ministry of foreign affairs. As the longstanding leader of the organisation, Yixin was responsible for spearheading various reforms during the early part of the Self-Strengthening Movement, a series of measures taken by the Qing government to modernise China. He also founded the Tongwen Guan in 1862 for Chinese scholars to read foreign languages and study technology.
Fall from grace[edit]
In 1865, Yixin was accused by Cai Shouqi (蔡壽祺) of "monopolising state power, accepting bribes, practising favouritism, behaving arrogantly, and showing disrespect towards the emperor." Empress Dowager Cixi became suspicious of Yixin and stripped him off his position of prince-regent. Despite so, Yixin continued to remain as a central figure of power in the Qing imperial court. In 1869, An Dehai (安德海), a eunuch and close aide of Empress Dowager Cixi, was executed by Ding Baozhen for travelling to Shandong, because eunuchs were forbidden to travel out of the Forbidden Palace without permission. Ding Baozhen was believed to have been instigated by Yixin. Cixi was very unhappy with Yixin. In 1873, Yixin strongly opposed the construction of the New Summer Palace and further incurred Cixi's anger towards him.
In 1884, when the Sino–French War broke out, Yixin was in charge of directing the Military Department (軍機處), which was disorganised and indecisive on whether to fight or make peace. This resulted in a Chinese defeat in the war and caused Yixin to lose considerable prestige. Later that year, Empress Dowager Cixi dismissed Yixin from office and ordered him to remain at home to "recuperate from illness". Yixin was replaced by his younger half brother, Yixuan. Some officials such as Baoyun (寶鋆), Li Hongzao (李鴻藻), Jinglian (景廉) and Weng Tonghe who previously served under Yixin's administration were removed from office. This incident was known as the "Cabinet Change of Jiashen" (甲申易樞) or "Political Change of Jiashen" (甲申朝局之變) because it took place in the jiashen year according to the Chinese sexagenary cycle.
After his dismissal, Yixin remained in Jietai Temple in western Beijing most of the time. In 1894, on the outbreak of the First Sino-Japanese War, Yixin, who was already in his old age, was recalled to the imperial court to deal with the situation. He served in the Military Department and Zongli Yamen until he became critically ill in 1898 and eventually died in that year.
|This section does not cite any references or sources. (September 2009)
In the 20th century, Yixin was vilified by as the man responsible for "selling" the country to the western powers through his various reforms and talks with the foreigners. In recent times he has been recognized as an exemplary statesman of equal calibre as Li Hongzhang.
- Father: Daoguang Emperor
- Mother: Empress Xiaojingcheng
- Spouse: Lady Guwalgiya (瓜爾佳氏)
- Children:
- Gulun Princess Rongshou (榮壽固倫公主), Yixin's eldest daughter.
- Zaicheng (載澂; 1858–1885), Yixin's eldest son, granted the title of beile.
- Zaiying (載瀅; 1861–1909), Yixin's second son, granted the title of a beile. He was adopted by Yihe (奕詥), Prince Zhong of the Second Rank.
- Zaijun (載濬), Yixin's third son, granted the title of Duke Who Assists the Nation (輔國公), died early.
- Zaihuang (載潢), Yixin's fourth son, died early.
- Grandchildren:
- Great-grandchildren:
- Yuzhan (毓嶦; 1923-), Puwei's son.
- Puru's children:
- Taohua (韜華)
- Yuli (毓岦)
- Yucen (毓岑)
- Yuqi (毓岐)
|Ancestors of Prince Gong (Qing dynasty)
Names and titles[edit]
- Names:
- Clan name / family name: Aisin Gioro (simplified Chinese: 爱新觉罗; traditional Chinese: 愛新覺羅; pinyin: Àixīn Juéluó)
- Personal name: Yixin (simplified Chinese: 奕䜣; traditional Chinese: 奕訢; pinyin: Yìxīn; Wade–Giles: I-hsin)
- Pseudonym or art name: Master of the Yuedao Hall (simplified Chinese: 乐道堂主人; traditional Chinese: 樂道堂主人; pinyin: Yuèdàotáng Zhǔrén)
- Titles:
- Prince Gong of the First Rank (simplified Chinese: 恭亲王; traditional Chinese: 恭親王; pinyin: Gōng Qīnwáng), simplified to Prince Gong (or Prince Kung in Wade–Giles). Yixin held this title from 1850 until his death in 1898.
- Posthumous title (in full): Prince Gongzhong of the First Rank (simplified Chinese: 恭忠亲王; traditional Chinese: 恭忠親王; pinyin: Gōngzhōng Qīnwáng)
- Other references:
- Sixth Prince (simplified Chinese: 六王爷; traditional Chinese: 六王爺; pinyin: Lìu Wángyé)
- "Devil Number Six" (Chinese: 鬼子六; pinyin: Guǐ Zǐ Lìu)
Prince Gong Mansion[edit]
A former residence of Yixin in the western part of central Beijing is now open to the public as a museum called the Prince Gong Mansion.
Portrayals in media[edit]
In 2006, Yixin's life story was adapted into a Chinese television series titled Sigh of His Highness, starring Chen Baoguo as the prince.
See also[edit]
|Wikimedia Commons has media related to Yixin, 1st Prince Gong.
- ^ Fang, Chao-ying (1943). "I-hsin". In Arthur W. Hummel. Eminent Chinese of the Ch'ing Period. Washington: United States Government Printing Office. pp. 380–384.
- ^ http://history.cultural-china.com/en/46History5505.html
- Fang, Chao-ying (1943). "I-hsin". In Arthur W. Hummel. Eminent Chinese of the Ch'ing Period. Washington: United States Government Printing Office. pp. Volume I 380–384.
Prince Gong (Qing dynasty)Born: 11 January 1833 Died: 29 May 1898
|Preceded by
None. Title created.
|Prince Gong of the First Rank
|Succeeded by


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A 3-dimensional circuit assembly includes a lower substrate, a first integrated circuit (IC) layer that is adhered to and electrically insulated from the substrate, electrical contacts for the IC layer, and separate electrical contacts for the substrate that extend through and are insulated from the IC layer. The IC layer is surmounted by an insulating layer through which the electrical contacts also extend, and across which interconnections between different contacts may be made. The IC layer and substrate are held together by an adhesion layer, with the adhesion, IC and insulating layers all being thin enough to assume the coefficient of thermal expansion for the underlying substrate, which is much thicker. The substrate may itself have a second IC layer to which contacts are made, or it may be implemented as the photodetector of a focal plane array. Two standard wafers are used to form the package, with the substrate for the upper wafer removed either before or after bonding to the lower wafer. Additional IC layers may be added by adding additional wafers in a similar fashion.
1. A method of fabricating a three-dimensional (3-D) circuit assembly, comprising:
providing a first substrate with a first set of at least one electrical contact pad thereon,
adhering a first IC layer to said first substrate and electrically insulating said first IC layer and said first substrate from each other with an adherent material, said first IC layer provided with a layer of insulative material on its opposite side from said adherent material,
establishing a first set of at least one electrical contact to said first IC layer,
forming a first set of at least one opening through said layer of insulative material, said first IC layer and said adherent material to said first set of at least one electrical contact pad on said first substrate
forming a second set of at least one opening through said layer of insulative material and through said first IC layer, said first set of at least one electrical contact extending through said second set of at least one opening,
establishing a second set of at least one electrical contact through said first set of openings to said first set of at least one electrical contact pad on said first substrate.
2. The method of claim 1, wherein said layer of insulative material is initially provided on a second substrate and said second substrate is removed from said layer of insulative material prior to forming said first and second sets of at least one opening.
3. The method of claim 1, wherein said second substrate is removed by etching and said layer of insulative material is used as an etch stop.
4. The method of claim 1, wherein at least some of said first and second sets of at least one electrical contact are extended over said layer of insulative material whereby at least some of said first set of at least one electrical contact is in electrical contact with at least some of said second set of at least one electrical contact.
5. The method of claim 1, further comprising the step of lining said first and second sets of at least one opening with an electrically insulative material before said first and second sets of at least one electrical contact are extended through their respective openings.
6. The method of claim 1, further comprising the steps of forming one additional IC layer over said layer of insulative material, extending said first and second sets of at least one opening and at least one electrical contact through said additional IC layer, forming an additional respective set of at least one opening to said additional IC layer through said insulative layer, and establishing an additional respective set of at least one electrical contact through said additional set of openings to said additional IC layer.
7. The method of claim 1, wherein said adherent material comprises an adhesive and said first IC layer and said first substrate are adhered together by sandwiching said adhesive between them and curing the adhesive.
8. The method of claim 1, wherein said adherent material comprises a layer of thermally fusible material on each of said first IC layer and said first substrate, and said first IC layer and said first substrate are adhered together by sandwiching said layers of thermally fusible material between said first IC layer and said first substrate and thermally fusing said layers of thermally fusible material together.
9. The method of claim 1, wherein said adherent material is a layer whose thermal movements are controlled by said first substrate.
10. The method of claim 1, wherein a second IC layer is provided in said first substrate facing said first IC layer, and said second set of at least one electrical contact is established with said second IC layer.
11. The method of claim 1, wherein said first substrate comprises a photodetector and is provided with an array of pixel contact pads facing said first IC layer, and said second set of at least one electrical contact is established by forming discrete electrically conductive members through said first set of at least one opening to establish electrical contact with respective pixel contact pads.
This is a divisional of application Ser. No. 07/918,343 filed Jul. 21, 1992 now abandoned.
1. Field of the Invention
This invention relates to high density circuit packages, and more particularly to three-dimensional circuit assemblies and fabrication techniques for packaging either multiple integrated circuit layers as a unitary assembly, or a focal plane array together with associated readout circuitry.
2. Description of the Related Art
In an attempt to increase the density of integrated circuit (IC) packages, efforts have been made to incorporate multiple circuit layers within the same package, with various mechanisms for interconnecting the different layers and providing externally accessible input/output ports. In a similar vein, effort has also been directed towards integrating the fabrication of a focal plane array with its readout circuitry.
One of the challenges in successfully implementing a 3-D circuit package has been to bring connections for the interior circuit layers out to the exterior of the package so they can be readily addressed by the user. One method to accomplish this has been developed by Hughes Aircraft Company, the assignee of the present invention, and is referred to as the thermal gradient zone melt technique. This approach is described in M. J. Little et al., "The 3-D Computer", Proc. of IEEE Int'l. Conf. on Wafer Scale Integration, Jan. 3, 1989, pages 55-64. It involves the distribution of aluminum dots on the surface of a silicon wafer within which circuit layers have been fabricated. A device is heated to about 1,100�-1,200� C., causing the aluminum dots to melt and dissolve into the underlying silicon. This produces a conductive feedthrough composed of an aluminum/silicon alloy extending into the wafer from the location of each dot, and having a much lower resistivity than the surrounding silicon. The feedthroughs extend down to the circuit layer and thereby provide an external electrical access. While successfully producing feedthroughs to the circuit layers, this technique is subject to density limitations in the zone melts, and can result in a feedthrough capacitance that is excessive for certain applications.
In the area of focal plane arrays, a "loop hole" or "VIMIS" (vertically integrated metal-insulator-semiconductor) technique has been developed in which a chip of photodetector material is glued to readout circuitry. The photodetector is then thinned, and openings are etched through it to access contact pads for an integrated circuit on the other side of the chip. The openings are then metallized to provide electrical connections through the detector to the readout circuitry. This technique is described, for example, in Amingual, "Advanced Infrared Multiple Plane Arrays", SPIE Infrared and Optoelectronic Materials and Devices, Vol. 1512, 1991, pages 40-51. However, it is limited to n on p detectors and has a fill factor limitation, meaning that the etched openings through the photodetector reduce the amount of material left to perform the photodetection function. Since the detector substrate must be relatively thick, the etched openings expand to undesirably large dimensions towards the surface of the photodetector.
Another focal plane array assembly uses indium "bumps" to mechanically secure a detector chip to a cell processing chip, and to provide a matrix of electrical contacts therebetween. This technique is described in U.S. Pat. No. 4,740,700, assigned to Hughes Aircraft Company, and is also referred to in the Amingual reference mentioned above. Although the bumps establish interconnects between two interior layers of the overall device, they do not provide access to the readout circuitry from an exterior surface of the device.
The present invention seeks to provide a 3-D circuit assembly that does not suffer from the limitations described above in connection with the prior devices, that allows for a higher circuitry density and if desired a mix of process technologies or materials, that is readily expandable to add additional circuit layers as desired, and that does not use up photodetector area for other purposes when used for a focal plane array.
In the accomplishment of these goals two completed wafers are bonded together, one of which has an IC layer on its surface and the other of which either has a second IC layer or is a photodetector substrate. The first wafer preferably consists of, in sequence, a substrate, a thin insulative layer, and the first IC layer. When the two wafers have been bonded together, preferably either by an insulative adhesive or insulative thermal fusion layers, the upper substrate is removed to expose the upper insulative layer. A first set of openings is then formed through the upper insulative layer to the first IC layer, and a second set of openings is formed through the insulative, first IC and adhering layers to the lower substrate. These openings are filled with a conductive material to establish externally accessible electrical connections with the upper IC layer and lower substrate, with the connections interconnected as desired by extending them over the surface of the upper insulative layer. The upper IC layer and lower substrate layer may be provided with respective contact pads, with the electrical connections routed to respective pads.
The lower substrate may include a second IC layer with which electrical contact is established. Alternately, when the lower substrate serves as a photodetector, it is provided with pixel contact pads with which the electrical connections are made through the openings in the overlying layers. The openings are preferably lined with an insulative material to avoid shorting out the upper IC layer.
Although the bonding material used to secure the two parts of the assembly together will normally have a coefficient of thermal expansion that substantially differs from that of the lower substrate, it is made thin enough so that it substantially assumes the substrate's thermal movements. The upper IC and insulative layers likewise assume the thicker substrate's thermal movements. Additional IC layers can be fabricated over the upper insulative layer, with each additional IC layer electrically insulated from the IC layer immediately below by a respective insulative layer. A set of electrical contacts for each additional IC layer is fabricated through the IC and insulative layers above the subject IC layer in a manner similar to the electrical contacts for the first IC layer and the lower substrate. Each of these additional layers are also preferably thin enough to substantially assume the lower substrate's thermal movements.
These and other features and advantages of the invention will be apparent to those skilled in the art from the following detailed description, taken together with the accompanying drawings, in which:
FIGS. 1a, 1b and 1c are sectional views, not to scale, showing three successive stages in the fabrication of a 3-D circuit assembly in accordance with the invention;
FIGS. 2a and 2b are sectional views, not to scale, illustrating successive steps in the fabrication of a circuit assembly with at least one additional circuit layer to those employed in FIGS. 1a-1b; and
FIG. 3 is a sectional view, not to scale, of a focal plane array assembly that incorporates the invention.
The present invention makes it possible to fabricate a 3-D circuit structure from two or more standard wafers, each of which has its own circuit layer. The first step in the preferred fabrication method is illustrated in FIG. 1a. Two conventional bonded silicon wafers 2a and 2b are shown, with the upper wafer 2b inverted and secured to the lower wafer 2a by a thin layer of electrically insulating adhesive 4 that is cured after the wafers are positioned. Accurate wafer alignment techniques are available that have been developed in connection with the known bump bonding technology mentioned above.
Each wafer includes a relatively thick silicon substrate 6a, 6b, a thin electrically insulative silicon dioxide layer 8a, 8b on the silicon substrate, and a thin silicon-based IC layer 10a, 10b on the respective SiO2 layer 8a and 8b. The insulator layer 8a may be omitted unless it is desired as an insulator for IC layer 10a. It is generally desirable to include insulator layer 8b, even if there is not a need for upper insulation of IC layer 10b, since layer 8b serves as an etch stop during the subsequent removal of the upper substrate 6b, as described below. Lower substrate 6a would not normally be removed, so insulator layer 8a serves only an insulating and not an etch stop function.
Typical thicknesses for the elements of each bonded wafer are 525 microns for the silicon substrates 6a, 6b, 0.2-2 microns for the SiO2 layers 8a, 8b, and 0.2-2 microns for the IC layers 10a, 10b. Details of the actual circuitry fabricated in the IC layers are not shown, but generally the circuitry itself would extend about 0.3 microns deep into the IC layers and can include devices such as transistors, capacitors, etc. Aluminum contact pads 12a, 12b are provided on the circuit faces of the two wafers 2a, 2b for making electrical contacts to their respective ICs through openings in a thin insulating film (not shown).
One of the advantages of the invention is that the circuitry on the two wafers may be formed with different process techniques, such as bipolar vs. CMOS (complementary metal-oxide-semiconductor); since the wafers are provided as standard items before being bonded together, they can be fabricated totally independent of each other. Furthermore, although silicon based circuits are illustrated, other materials such as GaAs could also be used; one material could be used for one wafer and other material for the other wafer so long as they are compatible with the interconnections provided between the two. There is also flexibility in the choice of material for the isolation layers 8a and 8b; aluminum nitride or silicon nitride might be substituted for silicon dioxide.
The silicon substrates 6a, 6b and silicon-based IC layers 10a, 10b will generally have similar coefficients of thermal expansion, but this coefficient will generally be different from the temperature coefficients for the isolation layers 8a, 8b and the adhesive 4. While this might ordinarily be expected to result in the possibility of cracking over the normal design temperature range of -55� C.-125� C., the adhesive layer 4 is kept to a few microns in thickness. The thin dimensions for both the adhesive and isolation layers cause them to effectively assume the thermal expansion coefficient of the much thicker silicon substrate 6a to which they are bonded, so that the thermal expansion and contraction of the adhesive and isolation layers is controlled by and generally matches the thermal expansion of the silicon substrate. This stretching of the thinner material layers inhibits either cracking or delamination when significant temperature differentials are encountered.
A suitable material for the adhesive layer 4 is produced by Ablestick, Inc. under the designation GA47-2LV. Instead of the adhesive layer 4, thin layers of a fusible bonding material such as high temperature glass could be used, with the wafers bonded together by heating the fusible material. In this event the thickness of the bonding layer would still preferably be restricted to a few microns.
In the next fabrication steps, the results of which are illustrated in FIG. 1b, the upper substrate 6b has been removed, preferably by etching it away while using the SiO2 layer 8b as an etch stop. Alternately, the substrate 6b can be removed first and the remaining IC layer 10b and insulative layer 8b aligned to the underlying wafer 2a with the assistance of an intermediate carrier. Openings are then made through the assembly to access selected contact pads 12a, 12b, and thus expose a path to electrically contact the portions of the circuitry to which these pads are connected.
The contact pad 12b for the IC layer 10b are accessed with via openings 14b through the upper SiO2 layer 8b and IC layer 10b, while the contact pads 12a for the lower IC layer 10a are accessed with via openings via 14a through the upper SiO2 layer 8b, upper IC layer 10b and the adhesive layer 4. Presently available trenching techniques, such as disclosed in Copper, et al., "Physical and Electrical Characteristics of Submicron Trench Capacitors", Extended Abstracts, The Electrochemical Society, Vol. 90-2, Oct. 14-19, 1990, pages 410-411; and U.S. Pat. No. 4,702,795 to Douglas, permit these openings to be kept to a few microns in diameter or less. Since the relatively thick upper substrate 6b has been removed before the openings are made, the openings need extend only through the thin layers 8b, 10b and 4, and thus any spreading is minimized.
The via openings 14a and 14b can be formed by either chemical etching or reactive ion etching. Although trenching to the contact pads 12a and 12b is illustrated, the via openings 14a and 14b could also be established to desired metallization locations directly on the ICs themselves; the metallization of either the ICs or contact pads are preferably used as an etch stop. The via opening locations are controlled by a conventional mask technique, in which the upper SiO2 layer 8b can function as the etch mask.
FIG. 1c shows a later stage in the device's fabrication. The sidewalls of the via openings have been coated with respective sleeves 16 of an insulative material such as glass (SiO2). The sleeves 16 are applied by a process such as chemical vapor deposition, with the insulative coating removed from the bottoms of the via openings preferably by a photoetching process, either reactive ion etching or hydrofluoric acid. A metallization 18, preferably aluminum, is then deposited over the upper surface of the SiO2 layer 8b and into the via openings, through which it forms electrically conductive members that establish electrical connections to their respective contact pads 12a and 12b. The sleeves 16 insulate the electrical contacts from the surrounding IC layer 10b.
The metallization layer on the upper surface of SiO2 layer 8b is next photoetched to establish desired interconnections between the contact pads for the two IC layers 10a and 10b. Where desired, the metallization layer may be left intact so as to extend over the surface of SiO2 layer 8b and interconnect a contact to one IC layer with a contact to the other; such an interconnection is indicated by numeral 20.
At this point the device may be considered to be essentially complete, and the wafer can be tested and diced using conventional techniques. The result is a set of high density 3-D circuit chips that have a sturdy construction, are useable over the full normal temperature range, and can have different circuit layers that employ different circuitry processes and even different materials.
A variation of the 3-D circuit package and fabrication technique of FIGS. 1a-1c is illustrated in FIGS. 2a and 2b. In FIG. 2a a third conventional bonded wafer 2c has been inverted and adhered to the SiO2 isolation layer 8b of the wafer 2b, after the removal of the upper substrate 6b (FIG. 1a) from wafer 2b. The new wafer 2c consists of a silicon (or other desired semiconductor) substrate 6c, an insulation layer 8c and an integrated circuit layer 10c with associated contact pads 12c. It is adhered to the underlying insulation layer 8b by a thin layer of adhesive or fusion bonded material 22 similar to the adherent material 4. The uppermost wafer's insulating layer 8c, IC layer 10c and adherent layer 22 are again thin enough so that they each expand and contract along with the much thicker bottom substrate 6a.
After the upper wafer 2c has been attached its substrate 6c is etched away. Alternately, the substrate 6c can be removed first and the remainder of the wafer aligned and adhered to the lower assembly with the assistance of an intermediate carrier. Openings are then etched to selected contact pads for the three different IC layers, as illustrated in FIG. 2b, in a manner similar to the formation of the access openings shown in FIG. 1c, and the openings are lined with insulating sleeves 16'. A metallization 18' is then applied to the upper surface of the top SiO2 layer 8c and into the access openings, where it is insulated from the surrounding IC layers by the insulating sleeves. As with the embodiment of FIG. 1c, the metallization 18' is etched to leave desired metal interconnects 20' extending across the surface of upper SiO2 layer 8c and thereby interconnect selected contact pads at different levels in the device, while removing the metallization from the areas where it is not needed.
Additional IC layers can be added in a similar fashion. However, the circuit density achievable with each additional layer will be progressively reduced somewhat, since the upper IC layers are traversed by both their own leads (if their contact pads are on their underside) and by the leads for all of the lower IC layers. Furthermore, since the provision of additional layers increases the total thickness of the material that must be etched to access the lower IC layers, the access openings for those layers will tend to spread somewhat as they approach the upper surface of the package, thus further reducing the area available for circuitry in the upper layers.
Another application of the invention is for the detection of electromagnetic radiation, such as with an infrared focal plane array. As example of this application is shown in FIG. 3. Instead of the lower bonded wafer 2a of FIGS. 1a-1c and 2a-2b, a lower substrate 24 formed from a suitable photodetector material such as HgCdTe/CdTe is used to sense IR radiation that strikes the underside of the package. The photodetection can be accomplished either with a photoconductive material whose resistance is sensitive to radiation, or with a photovoltaic material whose voltage is sensitive to radiation. The radiation first passes through an anti-reflection coating sheet 26 on substrate 24, which is organized into a matrix of pixels, each pixel being provided with a respective pixel contact pad 12a on the upper surface of the substrate. With a photoconductive substrate, a voltage is supplied to electrode 26 and the voltage drop across the substrate 24 is determined for each pixel by the amount that pixel is illuminated by the radiation of interest. With a photovoltaic substrate, a contact (not shown) is made to the same surface of substrate 24 as the contacts 12a, and a voltage is dropped across photodiode depletion region of substrate 24.
The IC layer 10b and insulative layer 8b of the upper wafer 2b are adhered to the photodetector substrate 24 in a manner similar to the previously described embodiments. The readout circuitry for the focal plane array is provided in the IC layer 10b, and is interconnected with the various pixel contact pads 12a by metallized interconnections as in the previous embodiments. The result is a unitary focal plane array package that has a capacity for a high density readout circuitry layer integrated with the photodetector. If desired, additional layers of readout circuitry can be provided as illustrated in FIGS. 2a and 2b.
While different embodiments of a high density circuit assembly and an associated fabrication method have thus been shown and described, numerous variations and alternate embodiments will occur to those skilled in the art. Accordingly, it is intended that the invention limited only in terms of the appended claims.
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In later April I was provided with a free sample of some ProFoot Plantar Fasciitis inserts . I have been wearing them consistently ever since and am not ready to report some of my results.
While I was hopeful, I did not realistically think that some shoe inserts would automatically cure my plantar fasciitis. And, in fact, these did not "cure" my PF. I still feel pain in my heels every time I wake up in the morning or stand from an extended time sitting. PF really does suck.
However, the inserts have definitely helped to make my feet feel better. My runs are much less painful and I can stand for an extended period of time without the build-up of excruciating pain. In that sense, I'm very happy to have the inserts and will likely go buy some more. I saw they are on sale at the Walgreens next to my house.
Multiple pairs – There were a few things that I realized that would make the experience of using these inserts better. First, it would be helpful to have a set of inserts for every pair of shoes, or at least one set for running shoes and one set for non-running shoes.
Padding breakdown – My inserts started to loose padding after about a month of regular use. I probably run harder on my shoes than most other people but I would've hoped they would last longer. So, realize you'll need to replace them after about 2-3 months.
Wear every day – To get the most out of these inserts, you need to use them every day and in every pair of shoes that you have. On the few days that I skipped wearing them, the pain in my heels came back quickly.
Overall, I am happy to have gotten these Profoot Plantar Fasciitis inserts. They really have helped reduce the pain I feel in my heels and they make running (and joggling) much less painful. I think with another couple months of use my PF just might be completely gone. Or maybe not. I guess I'll just have to find out.
Joggle on.


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I finished Jan's quilt today, & she came & picked it up. She seemed pleased.
COLD FEET QUILTER-------A journal of an Alaskan Quilter, fiber artist, teacher & Longarm quilter.Life in the Last Frontier.
Your quilting is as stunning as usual!!! Wow.
My son is heading your way in December for 10 days to scope out Anchorage with his buddy. He'll be out of Afgh. soon (AMEN!) and plans to move to AK in 2011, so I hope to meet you at some point. Do you teach out of a particular quilt shop?
Fabulous quilting - I love the border especially.
Great job on the quilting!
Quilting is amazing!!! Wish you were my neighbor......
Amazing quilting! I'll bet she was pleased!
Talk about understatement-'seemed pleased'! She is probably speachless with delight! Stunning work, Deb.
How did you think of the diamonds? Beautiful!!
Wow, your quilting is beautiful. And so is the quilt.
Wow, Deb, I am inspired.
Wow, so impressive! I love how it looks like the flowers are sitting on a table. Gorgeous!


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You can now invite anyone to meet at your favorite Starbucks.
Limited-time feature
42 year old woman | Alameda, CA, USA | Seeking men 42-52 within 100 miles
Active within 3 days
Living on the Bright Side of Life
I'm at one of the best stages in my life. Young enough to pursue anything I'm passionate about, yet mature enough to define boundaries and assume responsibilities. I enjoy reading, movies,coffee shops around the corner, a long walk along the beach as well as many many small but beautiful things in life. Just need to find a great person to double the pleasure. Seeking a wonderful man....... someone who's caring and down-to-the-earth, a best friend with whom I can exchange happy thoughts and share the joy of life,someone desires a soul mate in life and a long term relationship with the possibility of a happy family.........:)
Alumni connections , Camping , Coffee and conversation , Cooking , Dining out , Gardening/Landscaping , Movies/Videos , Museums and art , Music and concerts , Exploring new areas , Performing arts , Playing sports , Travel/Sightseeing , Volunteering , Watching sports , Wine tasting
Cycling, Dancing, Running, Skiing, Swimming, Tennis / Racquet sports, VolleyBall, Walking / Hiking, Weights / Machines, Yoga
I exercise 3-4 times per week.
I like Birds, Cats, Dogs, Fish
Middle of the Road
any island on earth, San Francisco, small coffee shops around the corner, Tuckers "( ice cream store)....more to come as I am continuing exploring this big world
the ocean, sunrise/sunset, flowers, big smiles, any book / movie touches my heart, music,outdoor sports,traveling
reading, cooking at home, movies, music, museums, biking, hiking,swimming, tennis, road trip and sightseeing, spending time w/ friends and family
Seabiscuit. My second time reading it. Love almost every character in the book and still touched/ inspired by the story of this 'unlikely champion and a symbol of hope to many US citizens during the Great Depression.'
Z{{Cta}} {{#if HasMoreInfo}} ?{{CtaSecondary}} {{/if}}
|What she is looking for
|5'7" (170cms)
|5'10" (177cms) to 6'4" (193cms)
|Body type:
|Slender, About average, Athletic and toned
|Blue, Brown, Green, Hazel
|Black, Light brown, Dark brown, Blonde, Dark blonde
|No Way
|No Way
|Social Drinker
|Social Drinker
|Financial / Accounting / Real Estate
|No preference
|I'll tell you later
|No preference
|Never Married
|Never Married, Divorced
|Have kids:
|Wants kids:
|Definitely, Someday
|Asian, Pacific Islander, White / Caucasian
|Christian / Other
|Christian / Catholic, Christian / Protestant, Christian / Other
|Graduate degree
|Bachelors degree, Graduate degree, PhD / Post Doctoral


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Offensive and punting struggles put more pressure on defense to perform in Lions' second loss to Terapins since 1961.
Firefighters are on the scene of a Large Fire in Hollidaysburg. It's taking place at 117 Allegheny Street.
Thousands joined in the festivities on the boroughs special day.
WTAJ's Political Analyst Dr. Nicholas Pyeatt discusses the tight race in the 12th Congressional District, the race for U.S. Senate as well as Pennsylvania's role in the Presidential Election Vote ahead of polls closing.
AT 10:00pm ET CBS News projects Utah and Montana go to Romney.


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Click here to access news, information and interviews on the 66 athletes representing Great Britain across 12 different sports at the World University Games.
World University Games Coverage
Find out which teams came out on top in the men's championship final, the women's championship final and the men's trophy final.
Cricket championship and trophy final results
In this three part interview series, hear from GB gymnastic hero Beth Tweddle on her experiences at the 2005 and 2009 World University Games and what advice she has for current student athletes.
Beth Tweddle on university sport
The annual BUCS Conference and Awards Dinner will take place from 14-17 July at the University of Liverpool. Bookings have now closed. Click here for programme.
Conference and Awards Dinner 2015
Latest tweetsFollow
@BUCSsport02-Jul-2015 11:04
Competing in #WUGSGB, @UniofBath tennis ace Alex Walker was mentioned in the @BathChron: http://t.co/VDlLi0Jq50. @bathsport
@BUCSsport02-Jul-2015 02:03
That's hard to comprehend at the moment, but the #Lionesess have done the nation proud. What a great tournament #eng http://t.co/q2mU2AzNMT
@BUCSsport01-Jul-2015 22:23
RT @carnegiesport: We wish @LeedsBeckett Alumni @LucyBronze & @jade_moore20 good luck tonight in their semi final clash against Japan #WWC2�
@BUCSsport01-Jul-2015 21:17
We will be cheering on @england #Lionesses tonight against #Japan in the #WWC2015 semi-final tonight. Will you? #Eng http://t.co/DDzMWGp6bP
@BUCSsport01-Jul-2015 18:22
RT @hayconnor: 24 hours & I'll be on a plane to Korea with the GBR badminton team for the world student games ?? @BUCSsport @BadmintonEnglnd
@BUCSsport01-Jul-2015 16:57
British diver and @marjonuni student @RheaGayle, recently feratured in the @PlymouthHerald ahead of #WUGSGB. http://t.co/b133BdH1VE
@BUCSsport01-Jul-2015 12:26
RT @StirUni: Cheer on our fantastic 5 athletes at the World University Games. #StirlingSport #WUGSGBnhttp://t.co/LEcLdRDnGu http://t.co/m2T�
@BUCSsport30-Jun-2015 11:07
#FootballFuture students are learning about officiating from @FARefereesDept at the #FFConf15 today http://t.co/Cz0D9JSGBE
@BUCSsport29-Jun-2015 21:47
Bingo is well underway at the #FFConf15 who's going to be the big winner this evening? http://t.co/FiPqLHFay1


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Dalton Del Don
Mostly MLB Notes: Talking Zack Greinke and a look around the leagueDalton Del Don at Roto Arcade 2 days ago
I mostly stayed away from Zack Greinke in my drafts before the season, worried about him having to receive a "lubricating injection" in his elbow in February. But that's clearly been to my detriment, as his consecutive scoreless innings streak is now up to 27.2, a span in which he's posted a 0.65 WHIP. He's also allowed one run or fewer in 10 of his last 12 starts, yielding more than three in just one of 17 outings this season. Greinke's LOB% (88.9) is the highest in MLB, so he's clearly been lucky with runners on base, but no pitcher with a 1.58 ERA won't have some statistical category that isn't fortunate compared to league average. And while that will regress, Greinke has otherwise been unlucky with a modest seven wins while pitching so well for a Dodgers team with a 114 wRC+ that ranks second in all of baseball. He sports an 11.0 SwStr% and has been the No. 11 fantasy player over the past two weeks. Greinke has been one of the biggest fantasy steals so far this season.
This disc golf shot was no joke.
Daily Dime: Going with Carlos Martinez, Joey Votto, Troy Tulowitzki and even Mike TroutDalton Del Don at Roto Arcade 4 days ago
Here are 10 DFS recommendations for Saturday but be sure to double-check the weather and lineups before first pitch approaches.
Carlos Martinez, SP, vs. SD (Despaigne), $10000 at FanDuel: His control could still use some improvement, but Martinez has a 25.9 K% combined with a 2.20 GB/FB ratio this season. He also sports a 10.4 SwStr%, so he's become an elite pitcher, thanks mostly to his newfound ability to get left handers out. The Cardinals are one of the most favored teams Saturday (-185), while the Padres' .668 OPS against RHP has been the fifth worst in all of baseball this season.
Joey Votto, 1B, vs. Mil (Nelson), $3400: He has nine homers over 127 at bats with a .406 OBP and a .504 SLG at home this year. In fact, he has more walks (31) than strikeouts (30) at GAB. Jimmy Nelson has allowed a .308 BAA with a 1.76 WHIP when facing LHB.
Robinson Cano, 2B, at Oak (Graveman), $2700: He's 7-for-14 with two doubles and a homer over his past three games, so I'm going to continue to go with someone with such a strong track record at such a cheap price.
Daily Dime: Going chalk with Max Scherzer and then digging for hitting sleepersDalton Del Don at Roto Arcade 6 days ago
Here are 10 DFS recommendations for Thursday but be sure to double-check the weather and lineups before first pitch approaches.
Max Scherzer, SP, at Atl (Banuelos), $12500 at FanDuel: As usual, I'll recommend paying up for a top pitcher, especially with the softer pricing on FanDuel this year. Scherzer certainly qualifies as one, as he's top-three among all starters in MLB in ERA (1.79), FIP (2.02), WHIP (0.79), K-BB% (27.4) and SwStr% (14.2). He owns a 1.40 ERA and 0.83 WHIP on the road, and he'll be facing a Braves team Thursday that's scored the fifth-fewest runs at home and will be missing its best hitter. The Nationals are easily the most favored team (-200) on the day while tied for the lowest over/under (6.5). Scherzer is expensive, however, so let's dig for some cheap hitting options to fill out a lineup.
Josh Donaldson, 3B, vs. Tor (Miley), $3900: He's batting .368/.397/.667 against southpaws with a 1.069 OPS at home. He's $1200 cheaper than the most expensive third baseman and is just $300 more than Matt Duffy.
Daily Dime: Paying for Paul Goldschmidt and then digging for bargainsDalton Del Don at Roto Arcade 7 days ago
Here are 10 DFS recommendations for Wednesday but be sure to double-check the weather and lineups before first pitch approaches.
Paul Goldschmidt, 1B, vs. LAD (Anderson), $5400 at FanDuel: He has an 11-game hitting streak and is on pace to finish with 116 runs scored, 42 homers, 138 RBI and 32 steals with a .354 batting average. He will be a top-three pick next year and is a beast against anyone, but Goldschmidt is especially tough against southpaws, whom he's hit .387/.465/.694 against. He's also 7-for-11 with an 1.848 OPS versus Brett Anderson during his career. If you're going to spend big on a hitter Wednesday, Goldschmidt is the one in which to do so.
Dee Gordon, 2B, vs. SF (Heston), $3000: He's batting .341 against RHP this season and has recorded 2.8 FPPG, which is the same as Jose Altuve, only he's $1400 cheaper. Chris Heston has allowed a 1.47 WHIP against LHB this season.
Robinson Cano, 2B, at SD (Shields), $2500: If you want to spend even less on a second baseman, look at Cano, who owns a .402/.435/.690 career line over 87 at bats against James Shields.
Mostly MLB Notes: Talking Nolan Arenado and a look around the leagueDalton Del Don at Roto Arcade 9 days ago
Nolan Arenado has been the No. 1 overall fantasy player over the past month, and it's not even close. He's scored in 12 consecutive games, totaling 17 runs, eight homers and 17 RBI over those dozen contests. Arenado is on pace to finish with 53 homers, 105 runs scored and 147 RBI while batting .293. The crazy thing about his season is that the third baseman is hitting better on the road (1.028 OPS) than at Coors Field (.890) as well as against right handers (.989) opposed to southpaws (.833). The fact Arenado doesn't walk (4.4 BB%) or strike out (13.8%) much might actually help his counting stats and therefore his fantasy value. It's too bad he doesn't steal bases (although he is terrific defensively), but his .266 BABIP sure looks unlucky, especially considering Coors Field has increased batting average by 17 percent over the past three seasons, which is 11% more than the next best park. Arenado is clearly a star and might very well only get better moving forward. He's still just 24 years old. Only health can prevent Arenado from being a first round fantasy pick next year.
Daily Dime: Starting Madison Bumgarner and looking for hitting bargainsDalton Del Don at Roto Arcade 10 days ago
Here are 10 DFS recommendations for Sunday but be sure to double-check the weather and lineups before first pitch approaches.
Madison Bumgarner, SP, vs. Col (Kendrick), $11,100 at FanDuel: He has just one win in more than a month, although he's sported a 0.93 WHIP with a 47:6 K:BB ratio over 37.2 innings over that span, which suggests there may have been some bad luck in the win department to say the least. The Giants are by far the most favored team Sunday (-230), and Colorado has the fourth-worst OPS against LHP (.662) among all teams this season.
Jose Abreu, 1B, at Det (Price), $3600: He was drafted as a top-10 fantasy player entering the year and while a disappointment so far, he hasn't been quite the bust this price suggests. Abreu has hit .328/.407/.598 versus lefties during his MLB career, and he's not priced as a top-10 first baseman here.
David DeJesus, OF, vs. Bos (Masterson), $2200: He's cheap and hitting cleanup. Meanwhile, Justin Masterson has allowed a .300 BAA and a 1.73 WHIP when facing LHB this year.
Daily Dime: Going chalk with Clayton Kershaw and stacking the DodgersDalton Del Don at Roto Arcade 11 days ago
Here are 10 DFS recommendations for Saturday but be sure to double-check the weather and lineups before first pitch approaches.
Clayton Kershaw, SP, at Mia (Koehler), $12300 at FanDuel: This is obviously going chalk, but the prices lately with hitters have made paying up for the No. 1 SP of the day more palatable. The Marlins have scored the seventh-fewest runs in MLB this year (although to be fair they've been better against LHP), and the Dodgers are easily the most favored team Saturday (-200). Kershaw is sitting with just a 5-5 record on the year and a disappointing (for him) 3.33 ERA, but I'd still bet on him being the best pitcher from here on out. He's struck out 41 batters over his last four starts, spanning 27.2 innings.
Victor Martinez, C, vs. CHW (Danks), $3400: He owns a .452/.514/.645 line against southpaws and hits in the middle of Detroit's lineup as the DH. His struggles against RHP (.495 OPS) thanks to an injury really brings his price down here.
Daily Dime: Going with Charlie Blackmon, David Ortiz and Kolten WongDalton Del Don at Roto Arcade 12 days ago
Here are 10 DFS recommendations for Thursday but be sure to double-check the weather and lineups before first pitch approaches.
Charlie Blackmon, OF, vs. Ari (De La Rosa), $4600 at FanDuel: During his current seven-game home stand, he's batting .429 with a homer, four steals and nine RBI. Blackmon owns a .915 OPS against right-handed pitchers this season (with a combined 25 homers/steals) over 195 at bats and is batting leadoff in the best hitter's park in all of baseball. Meanwhile, Rubby De La Rosa has allowed a .316 BAA and a 1.70 WHIP against lefties, including a whopping 10 homers over 40.0 innings.
David Ortiz, 1B, vs. Bal (Gonzalez), $2900: He continues to be cheap despite having a .930 OPS against right-handers. Ortiz has also homered in two of the past three games and remains Boston's cleanup hitter.
Manny Machado, 3B, at Bos (Rodriguez), $4400: He's batting .333/.369/.533 against southpaws, will be playing in one of the best hitter's parks in all of baseball and has been the No. 6 ranked fantasy player over the past month.
Daily Dime: Paying for Gerrit Cole and looking for hitting bargainsDalton Del Don at Roto Arcade 13 days ago
Here are 10 DFS recommendations for Wednesday but be sure to double-checkthe weather and lineups before first pitch approaches.
Gerrit Cole, SP, vs. Cin (Leake), $11,100 at FanDuel: I'm as big a fan of Chris Sale as anyone, but he's more expensive, and the Pirates are bigger favorites Wednesday (an MLB-high -190). Of course, Cole isn't exactly cheap, but as usual, I recommend spending big on SP, and he's emerged as a true ace this season, combining a 20.7 K-BB% with a 1.98 GB/FB ratio and a 10.0 SwStr%. The Reds also rank in the bottom-five in baseball in runs scored both on the road and against RHP. Cole has a 1.88 ERA and 1.02 WHIP with a 42:6 K:BB ratio over 38.1 innings at home this season.
Kevin Kiermaier, OF, vs. Tor (Estrada), $2800: He's a leadoff hitter who's 8-for-17 (.471) with two steals over his past four games and is facing a pitcher who's typically been very homer-prone during his career.
Mostly MLB Notes: Talking Chris Sale, Robinson Cano and a look around the leagueDalton Del Don at Roto Arcade 16 days ago
Chris Sale recently became the third player ever to record 12 strikeouts in five straight games and has recorded double-digit Ks in six straight starts, which has occurred in just 10 other instances in MLB history. You obviously don't need me to tell you Sale is good at baseball, but his fantasy owners have been unlucky he's gotten just six wins while posting a 2.74 ERA and 0.94 WHIP this season. Sale's 34.3 K% leads MLB, as does his 28.5 K-BB% and 16.0 SwStr%. Over the past month, he's struck out 13 of 24 LHB he's faced, which is an MLB-high 54.2%. The league average is 18.9% (h/t Inside Edge). If a draft were held today, I'd easily make him a top-10 overall pick. There's a strong argument he's the best pitcher in baseball. Just imagine if he pitched in the National League and not in a home park that's increased run scoring more than any in MLB over the past three years other than Coors field. Since May 12, Sale has easily been the No. 1 overall fantasy player, and that's with him not recording a win in four starts in which he combined for a 1.76 ERA.


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Newspaper Columnists as Heroes
Don McNay | Posted 03.07.2014 | Books
Read More: Newspaper Columnists, Newspapers, Opinion Page, National Society of Newspaper Columnists, Journalism Schools, Media, Journalism, Opinion Writing, Books News
Columnists are the rock stars of the newspaper world. Suzette Martinez Standring is definitely a rock star. That is why her first book, The Art of Column Writing, has been such a major success for several years and the second, The Art of Opinion Writing, will be even bigger.
It's New York Times ombudsman Clark Hoyt's recent distinction between "straight news" and "personal opinion" that I think captures the reason that journalism is on the skids.


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In September 2011, a select group of design, lifestyle and travel bloggers were invited to London to participate in a pioneering concept: the idea was to create design tours powered by the social media influence of bloggers. This breakthrough concept was developed and executed to complete perfection by two extraordinary individuals, Veronika Miller and Tim Bogan of Modenus. The concept? … Read More
Cheryl Clendenon's Style Maker Look Book: Dream Bath Design
Shopping Resources and Designer Notes: Dream Bath Look Book by Style Maker Cheryl Clendenon Designer Notes: Bookcase/fireplace area: 3 inch thick high gloss lacquer shelves with mirror behind them. The fireplaces is a Wittus Fireplace and is flush to the wall. Designer Notes: Tub is the Ravello from Victoria and Albert and is volcanic limestone. Sinks are from Stone Forest. … Read More
Dream Bath Look Book by Style Maker Cheryl Clendenon:Designer Notes
Cheryl Clendenon's Style Maker Look Book: Dream Bath Design Hot Pink Fabric "Kimura" (Romo) on slipper chairs. Ravello tub – Victoria and AlbertBrizo custom shower in polished nickel (Virage handles) Clarita sconces with polished nickel finish – Artcraft White Bronze Color Shimmer "Victoria White" tiles for flooring and "Chateau" Danse Blanc tiles which will go behind the vanities, above and … Read More


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What does this guy know?
Nothing. Stop acting like he does. Just because he is military, doesn't give him credit.
originally posted by: GogoVicMorrow
a reply to: LibertasIntel
I was done listening when he said they were a branch of al Qa'ida in Iraq.
They were a branch of the rebels we armed in Syria. IS has nothing to do with al Qa'ida.
The only thing the two have in common is they are portrayed as Muslim militants rather than just nutty militants, and they were armed by the US.
originally posted by: aightism2
wow ! first the jews blow up the wtc´s now this
originally posted by: GogoVicMorrow
originally posted by: aightism2
wow ! first the jews blow up the wtc´s now this
Not the Jews. There is possible connections with Mossad and obviousl Saud Arabia.
I mean.. you realize that the attackers were Saudi right and for some reason we went to Afghanistan. We should have gone into Saudi Arabia, cut funding to Israel, and Pakistan instead of Afghanistan.