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Disclosed is a semiconductor wafer, and the method of making the same, the wafer being formed to have a multiplicity of raised contact pads on its surface. The contact pads are formed with conductors which are disposed on the surface of the wafer and which are coupled to internal circuitry embedded in the wafer rough vias in the wafers surface. The contact pads are in a raised elevational relationship relative to the surface conductors. After the wafer is fully processed, by dicing individual integrated circuit chips out of the wafer, each chip can then be mounted on a higher level of assembly, such as a printed circuit board. The raised contact pads originally formed on the wafer, and therefore formed on each individual chip, provide the contact points by which the chip can be bonded with matingly arranged contact pads on the higher level of assembly.
1. A method of processing a semiconductor wafer comprising the steps of:
depositing on a top surface of the wafer a surface conductor, such that the surface conductor is at a given elevation;
depositing on the top surface of the wafer a contact pad, such that the contact pad is coupled to the surface conductor and the contact pad is at an elevation that is different than the elevation of the surface conductor; and
creating a bump of non-conductive material on the top surface of the wafer, such that the bump is adhesively mounted between the conductive pad and the top surface of the wafer.
2. The method as in claim 1 wherein the bump is created using a photolithographic process.
3. The method as in claim 1 further comprising the step of creating a via in the top surface of the wafer so that the surface conductor is coupled with circuitry embedded within the wafer during said surface conductor depositing step.
This application is a division of application Ser. No. 08/518,740 filed Aug. 24, 1995 which application is now U.S. Pat. No. 5,874,782.
The present invention relates to a semiconductor wafer that is formed to have elevated contact structures for mounting chips, which are diced out of the wafer, to a higher level of assembly, by using the elevated contact structures as the points for physical and electrical connection.
There are a number of methods by which integrated circuit chips may be mounted on a higher level of assembly, such as a printed circuit board. For example, one such technique generally known as "A-wire" or "lead on chip" (LOC) involves placing the chip inside a plastic package and coupling certain contact points on the chip with somewhat rigid conductive leads by means of a thin wire bond. The leads are then bonded to corresponding contact pads on a printed circuit board, which thereby enables the chip to communicate with the board. In an alternative packaging scheme, generally referred to as "tape automated bonding" (TAB) the chip is mounted on a tape which is configured to also have a series of conductive leads, albeit somewhat flexible ones, which are used to make contact with conductive points around the periphery of the chip. The end of the lead opposite to the connection with the chip is then used to make contact with the higher level of assembly, which again may be a printed circuit board. In both LOC and TAB the leads establish the electrical paths by which the chip is accessed for signal transmission, as well as for providing power and ground.
With regard to LOC and TAB, both such techniques generally require the higher level of assembly, such as a printed circuit board, to have a place for mounting the chip package which is larger than the chip itself. Since in both instances the chip, either by itself or when surrounded by a plastic package, will have the leads extend out from its periphery, the finished chip package will make a so-called "footprint" on the higher level of assembly that is necessarily larger than the chip itself. A further limitation of the TAB method of packaging in particular, is that TAB has been used for making connection with chip contact pads that are positioned around the periperhy of the chip, but not contact pads disposed in the central region of the chip. Many modern chips are now designed with their contact points in the center, as that particular arrangement tends to reduce the noise which may effect the operation of the electrical circuits contained within. TAB, therefore, is not well suited for use with chips configured with their contact points centrally located.
Still another method of mounting a chip on a higher level of assembly, is the so-called "C4" technique, which generally involves creating a plurality of dome-like solder balls on one side of the chip. The C4 balls are the connection points by which the chip is accessed for sign transmission, as well as for providing power and ground. One of the limitations of C4 technology, however, is that power and ground signs or the circuits located in a given portion of the chip are provided through localized C4 connections. In other words, circuits in one region of the chip will be serviced by one set of C4 balls carrying power and ground, while circuits in a second region will be serviced by another set of C4 balls carrying power and ground, and so on for all of the circuits on the chip. As a result, chips having C4 connections tend to have a large number of power and ground C4 balls, which are in addition to the multiplicity of C4 balls that are needed for signal connections. Accordingly, due to the inherent spacing limitations of the chip's side, designing a chip for connection to a higher level of assembly through C4 balls can be problematic.
It is, therefore, an object of the present invention is to provide a chip connection technique which provides as small a chip footprint on the higher level of assembly as is possible.
Another object of the present invention is to provide a chip connection system which includes as few as one power and one ground bus on the chip itself.
Yet another object of the present invention is to provide a chip connection technique that can be implemented using existing semiconductor wafer processing techniques so that the invention can be implemented in a cost efficient manner.
In its preferred embodiment, the invention relates to a semiconductor wafer that has raised contact pads that are formed at the wafer level. The contact pads are the conductive elements by which chips, which are eventually diced out of the wafer, can be mounted onto a higher level of assembly, such as a printed circuit board. Since the raised contact pads are actually formed at the wafer level, existing methods of performing photolithography on semiconductor substrates may be used to create the elevated structures. Additionally, such photolithography can be used to create interconnect wiring and power and ground buses on the surface of the wafer. Wafers processed using this particular technique can then be diced into individual chips, and the chips will be suitable for mounting on a higher level of assembly without any additional chip packaging. Because the chip requires no additional packaging and because all the connections between the chip and the higher level of assembly are contained within the perimeter established by the sides of the chip, chips made using the technique can be packed quite densely on the higher level of assembly since each chip's footprint is no larger than the chip itself.
The novel features believed characteristic of the invention are set forth in the appended claims. The invention itself however, as well as a preferred mode of use, further objects and advantages thereof, will best be understood by reference to the following detailed description of an illustrative embodiment when read in conjunction with the accompany drawings, wherein:
FIG. 1A is top view of a wafer, processed in accordance with the preferred embodiment of the present invention, the wafer being shown to include a multiplicity of integrated circuit chips;
FIG. 1B is an isometric view of the wafer of FIG. 1A;
FIG. 2 is a top view of one of the chips (including partial adjoining chips) of the wafer shown in FIGS. 1A and 1B.
FIG. 3A is a side, sectioned view of the chip shown in FIG. 2, as such chip is shown in FIG. 2 to be sectioned along the line 3A--3A.
FIG. 3B is an enlarged view of a portion of the chip shown in FIG. 3A.
FIGS. 4A-4D are a series of drawings which illustrate the process steps by which the wafer, and therefore chips, of FIGS. 1-3 are processed.
FIG. 5 is a side sectioned view of a the chip of FIGS. 1-4 mounted on a printed circuit board.
In accordance with the preferred embodiment of the present invention, FIGS. 1A and 1B provide, respectively, a top view and isometric view of wafer 20. Wafer 20 is principally made up of a semiconductor substrate material, such as silicon, which is processed with conductive and insulative materials to form integrated circuits embedded within the substrate. Typically a complete, integrated circuit pattern will be replicated a number of times on wafer 20 so that, after processing is completed, wafer 20 is formed to contain a plurality of discrete, individual chips 22 which are substantially identical to one another. As shown on FIGS. 1A and 1B, each discrete chip 22 is separated from any adjoining chip 22 on wafer 20 by kerf regions 24. Kerf regions 24 not only define the boundaries of chips 22 on wafer 20, but at later stages of wafer 20 processing, wafer 20 will be "diced" along the kerf regions 24 to separate the individual chips 22 into the integrated circuit chips that are used as the building blocks of many electronic systems. Although wafers processed in accordance with the preferred embodiment of the invention are eventually diced into individual chips, it is important to note that the processing steps and the resulting structure discussed in this detailed description are carried out at the wafer level, meaning before the wafer 20 is diced into individual chips 22.
As best seen by reference to FIG. 1A, the surface of each individual chip 22 contains a plurality of conductors 26 which, as will be detected below, are used for the purpose of connecting any given chip 22 to the next higher level of assembly after hips 22 are diced out of wafer 20. Further details relating to conductors 26, the process by which they are formed, and the manner by which they can be used to connect chip 22 to the next higher level of assembly are provided in connection with the discussion of FIGS. 2-5.
Referring now to FIG. 2, an enlarged, top view of chip 22 is given to provide enhanced detail of conductors 26 shown in FIGS. 1A and 1B. As can be seen in the greater detail of the enlarged illustration, the top surface of chip 22 includes a plurality of conductors 26. In accordance with the present invention, conductors 26 are formed during wafer processing by depositing the metallurgy that forms conductors 26 in a manner similar to the metal deposition steps used to form the internal circuitry of chip 22. That is to say, photolithographic techniques that are available for the creation of the internal circuitry and wiring patterns in a chip (ie. the processes of material deposition, mask exposure, and etch) can also be used to form conductors 26 on the surface of wafer 20, and thereby on the surface of each chip 22 which will be diced out of wafer 20. Of course, conductors 26 may be far thicker and wider than wiring that interconnects the circuit elements embedded within the chip 22; nonetheless, such greater dimensions may be accomplished through the appropriate adjustments and variations of the photolithographic process. Although many different conductive materials may be used to form conductors 26, in the preferred embodiment, conductors 26 are made of plated copper.
Still referring to FIG. 2, one end of each conductor 26 is shown to be deposited in a via 30; however, vias 30 are not directly visible in the top down view of FIG. 2 and are therefore shown in dashed lines. As will be further detailed in connection with the discussion of FIG. 3, each such via 30 opens to a via contact (shown as reference number 40 in FIG. 3). Via contact 40 is coupled to the internal circuitry of chip 22, such that each via 30 provides an opening through which conductors 26 on the surface of a given chip 22 may make physical connection with the internal circuitry of that chip 22.
Also shown on FIG. 2 is raised bump 32, the elevation of which is not visible in the top view of FIG. 2, but is visible in the side sectioned view of FIGS. 3-5. Additionally, each bump 32 is only partially visible in the top view of FIG. 2 because contact pad 34 is formed over the top of bump 32 which is also shown in FIGS. 3-5. As will also be detailed in connection with the discussion of FIGS. 3A and 3B, bump 32 provides a raised landing area which is elevated above the plane defined by the portion of conductors 26 disposed directly on the top surface of wafer 20. It can also be seen from the top view of chip 22 provided in FIG. 2 that each contact pad 34 of each conductor 26 is formed such that it is spaced back from the perimeter defined by the four sides 28a, 28b, 28c, 28d of the given chip 22 on which it is placed. Given that all contact pads 34 are contained within the perimeter defined by the four sides 28a, 28b, 28c, 28d of chip 22, chip 22 may be mounted side by side with other chips 22 on a printed circuit board, for example, for a very densely packed mounting arrangement.
From the detail of FIG. 2, it can be seen that two of the conductors on the top surface of chip 22 run its entire length, and thereby run in close proximity to vias 30 which are centrally disposed on chip 22. In the preferred embodiment, conductor 26a is a power distribution bus, and conductor 26b is a ground bus. As such, chip 22 includes one single power bus and one single ground bus servicing the entire chip. Moreover, conductor 26a and 26b each have only two contact pads 34 on either end of the respective conductive strips forming the buses, which considerably reduces the number of contact pads 34 needed to provide power and ground service to all of the circuitry embedded within chip 22.
Referring now to FIG. 3A, a side, sectioned view of chip 22 (including partial views of adjoining chips 22), as sectioned along the line 3A--3A shown in FIG. 2, is provided. With regard to FIG. 3A (and also FIGS. 4A-4D below) it should be noted at a vertical dashed line has been provided to assist in distinguishing one complete chip 22 from the partial chips 22 beside it. As indicated above, however, it should be understood that because the processing steps detailed herein are performed before the wafer is diced into individual chips, the dashed line should not be interpreted to suggest that the wafer is divided in FIG. 3A.
As stated above, chip 22 is made up of a semiconductor substrate, which in the preferred embodiment is silicon, and is shown to include circuitry 36. In FIGS. 3-5 circuitry 36 is simply shown in logic block form because its actual design may vary widely based on the function of chip 22, and its full detailed illustration is not essential to the description of the present invention. Near the upper surface of chip 22 is via contact 40 which is a metallurgical (or other conductive) structure that is electrically coupled to circuitry 36. An insulator coating 42, such as a relatively thick layer of polymide or other suitable insulator material, is layered over the surface of wafer 20. Via 30 (two of which are shown in FIG. 3A) is formed by an opening in insulator coating 42, which thereby provides access to via contact 40. In the preferred embodiment, via contact 40 is physically and electrically coupled with conductor 26 through its corresponding via 30 so that each such conductor 26 may carry electrical signals between circuitry 40 of chip 22 and another electrical component, such as a printed circuit board to which chip 22 may be eventually attached.
Also as seen in the side sectioned view of FIG. 3A, disposed on the surface of insulator coating 42 is bump 32, which is raised in elevation relative to the plane defined by the portion of conductors 26 disposed directly on the top surface of wafer 20. In the preferred embodiment, bump 32 is made of a relatively thick layer of insulation material, which could also be polymide. It should be noted, however, that because bump 32 is electrically isolated from the substrate of wafer 20 by insulator coating 42, in other embodiments of the invention bump 32 may also be made of a conductive material, such as plated copper. In yet other embodiments of the invention, bump 32 may actually be stamped from a material and then adhesively mounted onto the surface of wafer 40, instead of being formed by the process of photolithography. In short, the actual material composition and method of formation of bump 32 can vary, provided bump 32 creates an elevational structure that is raised relative to surface conductor 44.
Still referring to FIG. 3A, conductor 26 includes space conductor 44, which is the portion of conductor 26 that runs on top of the major, horizontal surface of insulator coating 42 and therefore the top, major, horizontal surface of wafer 20. As shown in FIG. 3A, one end of surface conductor 44 is formed to fill the opening of via 30, and thereby makes physical and electrical contact with via contact 40. Conductor 26 further includes contact pad 34, which is generally at the end opposite to the connection with via contact 40. Given that contact pad 40 is disposed over bump 32, it is also in a raised elevational position relative to the plane defined by surface conductor 44.
Referring now to FIG. 3B, an enlarged view of a portion of conductor 26, as shown in FIG. 3A, is provided. As can be seen through the enhanced detail, the top surface of surface conductor 44 defines a plane (represented by the lower dashed line), which is separated by a height (H) from the plane (represented by the upper dashed fine) defined by the top surface of contact pad 34. It will be understood that although only a segment of one conductor 26 is shown in FIG. 3A, the planes defined by the one surface conductor 44 and the one contact pad 34 shown in FIG. 3A are generally the same planes defined by the other surface conductors 44 and contact pads 34 on wafer 20.
Referring now to FIGS. 4A-4D, a series of drawings are provided to illustrate the process by which the structure of the preferred embodiment of the invention is formed. In FIG. 4A wafer 20 is shown to be formed with circuitry 36, which can be designed to accomplish a very wide variety of functions. Via contacts 40, which are electrically connected to circuitry 36, as detailed above, are shown to be near the upper surface of the wafer 20, but are actually covered by insulator coating 42. During the initial process steps, insulator coating 42 is patterned to form the openings which will eventually become vias 30, and then insulator coating 42 is cured.
FIG. 4B shows the results of an etch process step whereby vias 30 are created in insulator coating 42 to expose via contacts 40, and also insulator coating 42 is removed in the kerf regions 24 separating adjoining chips 22. FIG. 4C is next processed to create bump 32, which as discussed above, can be accomplished through photolithography, or stamping, and adhesive attachment. In the embodiment shown in FIG. 4C, bump 32 is shown to be deposited through a polyimide deposition, cure, and etch process, similar to the processing of insulator coating 42.
After the formation of bump 32, wafer 20 is next coated with a blanket deposit of a thin conductor, which is then patterned in accordance with the form of the permanent conductors 26. Then the wafer is electroplated with copper, the resist is stripped, and an etch step is performed to expose the thin conductor. The resulting structure is shown in FIG. 4D, from which it will be seen that conductors 26 (including conductors 26a and 26b) have been formed over the surface of insulator coating 42 and bump 32, and surface conductor 44 is deposited in via 30 in contact with via contact 40.
Given that the processing steps discussed in connection with FIGS. 4A-4D occur before wafer 20 is diced into individual chips 22, wafer 20 has on its surface a plurality surface conductors 44, which may run in any desired pattern and a plurality of conductive raised elevational structures, namely contact pads 34 disposed on the tops of bumps 32. Although the act elevation of such contact pads 34 may vary, it will be understood that the elevation should be great enough so that if, after dicing, chip 22 is mounted on a higher level of assembly, contact pads 34 could make contact with the surface of the higher level of assembly without having surface conductors 44 or any other part of chip 22 simultaneously make such contact. Greater particulars on this feature are discussed in connection with FIG. 5.
Referring now to FIG. 5, chip 22 of FIGS. 1-4 is shown to be separated from the other chips 22 on wafer 20. Additionlly, in this particular illustration, chip 22 has been flipped upside-down (relative to the other Figures), and it has been mounted on printed circuit board 50, which is shown in partial side sectioned view. Board 50 could be made of a rigid fiberglass, or a flexible polyimide, while in yet other embodiments, chip 22 may be mounted on other types of higher levels of assembly, such as ceramic boards or multichip modules. In the preferred embodiment, board 50 is shown to include two board contacts 52 which are matingly adapted for connection with contact pads 34. In the particular embodiment shown, an intermediate conductor 54, such as a tin/lead solder, is used to bond contact pads 34 of chip 22 to their respective board contacts 54. Additionally, in the particular embodiment shown, the space between the top side of board and the bottom side of chip 22 is filled with an insulative epoxy 56.
From FIG. 5, it can now be appreciated that due to the elevated structure of each contact pad 34, chip 22 can be mounted on a printed circuit board without having surface conductor 44 or any other part of chip 22 make contact with the board, which might cause electrical shorting. Additionally, it can now be appreciated that the preferred embodiment of the invention affords an economical and simplified process by which integrated circuit chips 22 can be mounted to boards or other higher levels of assembly. Depending upon the locations of board contacts 52 with which chip 22 must be mated, during wafer 20 processing bumps 32 may be situated in widely varying patterns on chip 22, and the contact pads 34 which overlay bumps 32 may simply be connected to the appropriate via contacts 40 by means of the customized routing of surface conductor 44 on the surface of wafer 20. Yet another benefit is that chip 22 includes both power and ground buses on the chip itself, but only has two contact pads 34 for each. Finally, given that the particular conductive elements of chip 22 which make contact with the higher level of assembly, namely contact pads 34, are formed within the periphery of the chip 22 sides, chips made in this manner may be densely packed side by side on a given higher level of assembly because each one establishes a footprint which is no bigger than the chip itself.
Changes may be made to the above detailed process or structure without departing from the scope of the invention described herein. It is intended that all the mater contained in the above description or shown in the accompanying drawings shall be interpreted in an illustrative and not in a limiting sense. Thus, other alternatives and modifications will now become apparent to those skilled in the art without departing from the spirit and scope of the invention, as set forth in the following claims.
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United Natural Foods, Inc. Stock Quote & Summary Data
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Company Description (as filed with the SEC)
Unless otherwise specified, references to "United Natural Foods," "we," "us," "our" or "the Company" in this Annual Report on Form 10-K ("Annual Report" or "Report") mean United Natural Foods, Inc. and all entities included in our consolidated financial statements. See the consolidated financial statements and notes thereto included in "Item 8. Financial Statements and Supplementary Data" of this Report for information regarding our financial performance. Overview We believe we are a leading distributor based on sales of natural, organic and specialty foods and non-food products in the United States and Canada, and that our thirty-two distribution centers, representing approximately 7.2 million square feet of warehouse space, provide us with the largest capacity of any North American-based distributor in the natural, organic and specialty products industry. ... More ...
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Fort Carson Soldiers Killed
Updated: 04/20/2005 - Three Fort Carson soldiers died in an attack on a base in Ramadi, Iraq.
Updated: 04/20/2005 - Three Fort Carson soldiers died in an attack on a base in Ramadi, Iraq.
Updated: 04/20/2005 - Wednesday is a day of reflection for Columbine High School and the sixth anniversary of the nation's deadliest school shooting.
Updated: 04/19/2005 - Frontier Airlines wants to expand its service to Mexico.
Updated: 04/19/2005 - A Defense Department official has decided against moving chemical weapons from stockpiles in Colorado and Kentucky. Instead, the agency will move forward with plans to build plants to destroy munitions at the sites.
Updated: 04/19/2005 - People convicted of giving alcohol to minors would lose their drivers' licenses for six months under a bill moving through the Colorado Legislature.
Updated: 04/19/2005 - A retired Air Force general could be the person to lead the University of Colorado committee that's examining tenure.
Updated: 04/19/2005 - For more than two decades, he has been the cardinal in charge of Vatican doctrine.
Updated: 04/18/2005 - The Civil Air Patrol has called off the search for two elderly pilots from Pueblo and their plane that has been missing since April seventh.
Updated: 04/18/2005 - Target stores in Colorado and across the country are about to pull cold medicines from regular shelves -- and sell them only from pharmacy counters.
Updated: 04/18/2005 - After years of wrangling, lawmakers agreed today to ask voters to give up more than three (B) billion dollars in surplus tax refunds over five years to pull the state out of its budget crisis.
Updated: 04/18/2005 - For the second year in a row, lawmakers have scuttled proposals to make identity theft a felony.
Updated: 04/17/2005 - Should children of illegal immigrants be getting a break in tuition at the state's colleges and universities? That's the debate members of the House Appropriations Committee are taking up.
Updated: 04/17/2005 - On the job, but not at the job...
Updated: 04/17/2005 - If your tax refund isn't quite what you expected, you could be the victim of a new law.
Updated: 04/17/2005 - It's been a rough road for the University of Colorado. And now, image is everything.
Updated: 04/17/2005 - He's been on the job for 30 years but it hasn't slowed down Colorado Springs Police Chief Luis Velez.
Updated: 04/16/2005 - They're out to get him. U.S. Senator Ken Salazar will be the target of Focus on the Family.
Updated: 04/16/2005 - State lawmakers are concerned about the shortage of National Guard members. Several are on overseas missions, leaving behind depleted units.
Updated: 04/16/2005 - A joint effort by University of Colorado and Colorado State students in changing marijuana policies at the two schools.
Updated: 04/16/2005 - Two former C.U. students, who filed a lawsuit against the school, are asking the judge to reconsider after he dismissed their case.
Updated: 04/16/2005 - If you're feeling a bit crowded, you have good reason to. El Paso County could soon surpass Denver County as the most populated county in the state.
Updated: 04/15/2005 - Hunters and anglers would get help to shoulder the cost of wildlife management under a bill approved by Colorado lawmakers. The bill still needs the governor's signature to make it law.
Updated: 04/15/2005 - University of Colorado regents Friday voted unanimously to offer former US Senator Hank Brown the presidency of the state's flagship university beginning August first.
Updated: 04/15/2005 - Police say what started off as a carjacking in Colorado Springs, turned into a shootout, and ultimately, a manhunt.
Updated: 04/15/2005 - The El Paso County Sheriff's Office is looking for a man who prompted an Amber Alert late Wednesday night.


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The Satco S1713 is an excellent all-purpose incandescent bulb. This 75-watt A19 shaped bulb is a frugal option for home and business lighting. The Satco S1713 frosted bulb is equipped with a C-9 filament, allowing it to last up to 1,500 life hours when operated at 120 volts. These standard shaped incandescent bulbs are sold only by the 4-pack.


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By: Donald Heath on August 20, 2007 - 11:50pm - Add new comment
Georgia Southern will be playing five top-25 programs according to the Football Championship Subdivision Coaches Poll released Monday.
Appalachian State, the division's defending two-time champion, is ranked No. 1. Furman is No. 10; Wofford No. 15; South Dakota State No. 19 and Coastal Carolina No. 20.
Of course, the Eagles have another toughie on the schedule when they travel to Fort Collins, Colo., to play Football Bowl Championship Subdivision (former I-A) Colorado State.
Here's GSU's 2007 schedule with my point-spread guess.
Sept. 8 WEST GEORGIA (GSU by 28)
Sept. 15 at Coastal Carolina (GSU by 3)
Sept 22 CHATTANOOGA (GSU by 10)
Sept. 29 WESTERN CAROLINA (GSU by 17)
Oct. 6 SOUTH DAKOTA ST. (Even)
Oct. 13 at Elon (GSU by 10)
Oct. 20 at Appalachian St. (ASU by 14)
By: Donald Heath on August 25, 2007 - 12:09am - Add new comment
The media has been trying to explain the Hatch Attack ever since Coach Chris Hatcher arrived at Georgia Southern on Jan. 19.
Here's how Hatcher described it recently when questioned.
"There's nothing to write about. There's nothing special about it. You have good coaches. At Valdosta State we had a great coaching staff. We had great players and they played hard. And that's the reason we won as many games as we did. I'm being honest. You're asking questions and there's nothing to it."
I'm not sure I'd say nothing. Valdosta State averaged 34.9 points a game last season. GSU averaged 21.4. The extra points could make a big difference this year.
By: Donald Heath on September 1, 2007 - 9:22pm - Add new comment
Black Saturday just got a little darker.
Before Saturday, maybe Georgia Southern fans thought Appalachian State was beatable. Even in Boone.
The Eagles held a fourth-quarter lead and took the Mountaineers to double overtime last season before losing to the two-time Football Championship Subdivision (I-AA) champions 27-20.
But Appalachian's 34-32 victory over #5 Michigan Saturday confirmed what many experts thought about the Mountaineers. ASU will be an overwhelming favorite to three-peat in the division.
ASU's offense has break-away speed at wide receiver, a dependable running back and a sophomore quarterback who continues to get better.
The defense also looked solid and opportunistic.
So it will be interesting when GSU heads to Kidd Brewer Stadium on ASU's campus Oct. 20. It'll be a big game for the Eagles, but definitely a tough one to win.
By: Donald Heath on September 2, 2007 - 12:23am - Add new comment
For the first time in his professional career, running back Adrian Peterson will be in the position to make an impact with the Chicago Bears as a running back.
The former Georgia Southern star is in his sixth season with the Bears after being picked in the sixth round of the 2002 draft.
But he's usually been far down on the depth chart, often hoping, at this time of the season, just to make the team. He has been the ultimate team player, rarely complaining and happy to make his mark on special teams.
During the offseason, however, the Bears let 1,210-yard rusher Thomas Jones go to the Jets for a draft pick. That left Chicago with Cedric Benson as a starter and Peterson second string.
Garrett Wolfe, a rookie from Northern Illinois, will be the team's third choice in the one-back system.
By: Donald Heath on September 8, 2007 - 8:05pm - Add new comment
STATESBORO – Georgia Southern trails West Georgia 21-10 with 11 minutes to go in the third quarter.
The Eagles got on the scoreboard early on a 54-yard touchdown run by Jayson Foster, who started the game at quarterback.
But the Division II Wolves, who won only one game last season, retaliated by outscoring the hosts 21-3 the rest of the way.
UWG quarterback Keats Baldwin has thrown for a touchdown and run for another.
West Georgia holds a 255-135 advantage in total yards at half.
GSU drove to the Wolves 5-yard line to begin the third quarter but a Travis Clark fumble halted the march.
By: Donald Heath on September 10, 2007 - 10:11pm - Add new comment
It's been said thousands of times -- 38 points a game can make up for a lot of mistakes.
Last season, Georgia Southern got rid of its explosive triple-option offense, went more conservative and averaged nearly 17 points less a game.
That meant any mistake in a close game could determine the outcome. And Southern made mistakes, missed field goals and subsequently lost six games by a total of 21 points on the way to a 3-8 record.
The Eagles didn't play particularly well in the first half against West Georgia, a Division II squad that won only one game last season. The Wolves led 21-10 at halftime, taking advantage of a soft defense and a GSU fumble.
During the first eight minutes of the second half, Southern overcame another fumble, a gutsy West Georgia fake punt that picked up a first down at the Wolves' 20 and an official's call that negated a touchdown.
By: Donald Heath on September 17, 2007 - 8:07am - Add new comment
Georgia Southern had 570 yards of offensive Saturday night against Coastal Carolina.
The Eagles had two 200-yard rushers, one who quite possibly will be named the nation's top performer of the week later today.
But a game that seemed to be slipping away, shifted back toward GSU on a simple 4-yard run up the middle.
It could have been easy to forget unless you've been sifting through the play-by-play of Southern's action-packed 42-34 victory in quaint, but not so friendly Brooks Stadium.
Late in the third quarter, the Eagles lined up to punt after getting into a fourth-and-four situation from the Coastal 33. The Chants had held GSU to a minus yard of offense during the Eagles' first two second-half possessions, then tied the game at 21-21 with the longest drive of the contest – a 12-play, 78-yard march – capped by Will Richardson's 1-yard sneak.
By: Donald Heath on September 21, 2007 - 11:18am - Add new comment
I may be wrong but…
Here's how I see the weekend of football in our area.
Alabama 28, Georgia 20 – Tide should be confident at home and after big win over Arkansas.
Auburn 24, New Mexico St. 12
Florida 60, Ole Miss 14
Kentucky 21, Arkansas 17
LSU 31, South Carolina 7
Mississippi St. 45, Gardner-Webb 7
Tennessee 56, Arkansas St. 17
Georgia Tech 24, Virginia 21, Grumbling Tech gets it done on the road for big division win
Clemson 28, North Carolina St. 14
South Florida 30, North Carolina 28
Boston College 38, Army 3
Navy 35, Duke 20
Virginia Tech 38, William and Mary 10
Wake Forest 17, Maryland 14
Georgia Southern 20, Chattanooga 17, Eagles win surprisingly low-scoring game, maybe by taking advantage of a key turnover
By: Donald Heath on September 24, 2007 - 10:34pm - Add new comment
Too bad John Mohring didn't have another year of eligibility. Or Charrod Taylor.
Georgia Southern needs a playmaker. Not on Jayson Foster's side of the ball. The other side.
The Eagles defense hasn't registered a sack during the last two games against Football Championship Subdivision teams. It's not like the chances haven't been there. Quarterbacks for Coastal Carolina and Chattanooga combined to throw 59 passes.
The last two opponents have 19 tackles for losses. GSU has 8.
Southern expected to miss Mohring and Taylor – two outstanding defensive performers with a penchant for big plays. So far no one has stepped up to take their places.
The result? 45 points allowed against Chattanooga – a team that averaged 18.3 points a game last season. I don't think the Mocs offense improved THAT much from a year ago.
By: Donald Heath on September 26, 2007 - 11:23pm - Add new comment
It's the fourth game of the season and Georgia Southern is in a must-win scenario.
Sounds ridiculous, but if you can't beat teams picked to finish seventh and eighth at home in your eight-team conference, what chance do you have against the others?
Southern already lost to No. 7 Chattanooga last week.
Not No. 7 in the country. No. 7 in the conference.
The Eagles won only three games last season and really six wins this season would be marked improvement.
The Southern Conference is loaded with quality football teams. Games with Appalachian State, Wofford and Elon on the road would be difficult for anyone in the Football Championship Subdivision.
A home game with The Citadel – which had Wisconsin tied at halftime – won't be easy. Neither will a game with Furman.


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proposal on french riviera
I have sort of an odd request. My partner and I are going to visit friends who just moved to Nice, and while we are there we want to propose to each other for our wedding in August (Yes, it is planned, not a surprise proposal). Does anybody have an idea for a nice, somewhat secluded beach on the Rivieria (not too crowded but it doesn't need to be vacant)where we could do this? We will be staying in Nice and Antibes. April 12-20. Pete (seattle)


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The Barclays ETN+ S&P VEQTOR™ ETNs (the "ETNs") are senior, unsecured debt securities issued by Barclays Bank PLC that are linked to the performance of the S&P 500®; Dynamic VEQTOR™ Total Return Index (the "Index"). Investors can trade the ETNs on the NYSE Arca exchange at a market price or receive a cash payment (less an investor fee) at the scheduled maturity or upon early redemption.
The Index seeks to provide investors with broad equity market exposure with an implied volatility hedge by dynamically allocating its notional investments among three components: equity, volatility and cash. The equity component of the Index is represented by the S&P 500® Total Return and the volatility component of the Index is represented by the S&P 500® VIX Short-Term Futures™ Index.
1 The investor fee is calculated on a daily basis in the following manner: The investor fee on the initial valuation date will equal zero. On each subsequent calendar day until maturity or early redemption, the investor fee will increase by an amount equal to the Annual Fee times the closing indicative note value of your securities on the immediately preceding calendar day times the closing level of the Index on such calendar day divided by the closing level of the Index on the immediately preceding calendar day (or, if such day is not an index business day, the such quotient will equal one) divided by 365. Because your notes are subject to an investor fee, the return on the ETNs will always be lower than the total return on a direct investment in the Index.
2 The "Closing Indicative Note Value" is historical, does not guarantee future performance, and is shown for illustrative purposes only. The issuer or an affiliate will provide the official redemption value to the redeeming holder in advance of any redemption.
3 Market Capitalization = Closing Indicative Note Value x Notes Outstanding.
Selected Risk Considerations:An investment in the ETNs described herein (the "ETNs") involves risks. Selected risks are summarized here, but we urge you to read the more detailed explanation of risks described under "Risk Factors" in the applicable prospectus supplement and pricing supplement.
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Credit of Barclays Bank PLC: The ETNs are unsecured debt obligations of the issuer, Barclays Bank PLC, and are not, either directly or indirectly, an obligation of or guaranteed by any third party. Any payment to be made on the ETNs, including any payment at maturity or upon redemption, depends on the ability of Barclays Bank PLC to satisfy its obligations as they come due. As a result, the actual and perceived creditworthiness of Barclays Bank PLC will affect the market value, if any, of the ETNs prior to maturity or redemption. In addition, in the event Barclays Bank PLC were to default on its obligations, you may not receive any amounts owed to you under the terms of the ETNs.
Automatic Redemption: If specified in the applicable prospectus, Barclays Bank PLC will automatically redeem a series of ETNs (in whole only, but not in part) at the specified automatic redemption value if, on any valuation date prior to or on the final valuation date, the intraday indicative note value of the ETNs becomes less than or equal to the applicable level specified in the prospectus.
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Standard & Poor's®, S&P 500®, S&P® and S&P 500® Total Return are registered trademarks of Standard & Poor's Financial Services, LLC ("S&P") and Dow Jones® is a registered trademark of Dow Jones Trademark Holdings LLC ("Dow Jones"). These trademarks have been licensed for use by S&P Dow Jones Indices LLC and its affiliates and sublicensed for certain purposes by Barclays Bank PLC. The Shiller Barclays CAPE US Core Sector Index (the "Index") which is based on the S&P 500® and the Sector Indices is not sponsored or endorsed by S&P Dow Jones Indices LLC, Dow Jones, S&P, or any of their respective subsidiaries or affiliates (collectively, "S&P Dow Jones Indices"), but is published with their consent. The ETNs based on the Index are not sponsored or endorsed by S&P Dow Jones Indices or any of their respective affiliates and S&P Dow Jones Indices makes no representation or warranty, express or implied, to the owners of the ETNs or any member of the public regarding the advisability of investing in securities generally or in the ETNs particularly or the ability of the Index to track general market performance.
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Atlantic Trust Select MLP Index is a trademark of Barclays Bank PLC.
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text:
Logitech z560 speaker set
3.5 out of 5
The quality
No remote control for independent adjustments
The new 5-piece Z560 THX certified speaker system from Logitech produces over 400 watts of power via four satellites and large sub-woofer. Not surprisingly the system gives you a very clear sound that copes superbly with bass and treble alike.
Trying hard to get a wow factor from the moment you open the box the speakers are well designed with a slick back finish, aluminium stands that can also be fixed to the wall and home stereo style connectors for easy connection and cabling extension.
Remove the front grills and it reveals a polished aluminium phase plus mechanism, typically found in high-quality home cinema systems.
The system is all controlled via a desktop control unit that houses the main volume, bass and fader options as well as a switch that allows you to convincingly take a 2-channel stereo source and give the impression it's actually surround sound via Logitech's M3D Matrix technology.
An inclusion of a remote control would have been a nice touch and a control deck that was built into the front speaker as seen in the Z540 and Z340 might appeal to those who are already struggling for space on a over crowded desk.


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13 Biggest Bros Of Congress
Cool story, bro!
So you don't think a BRO can get elected to congress?
13. Meet Rep. Bruce Braley (D-IA)
He wears short-shorts.
He Bros out with other tie wearing Bros.
And he Bros out with a chainsaw on his knees.
He also likes staring at short-shorts.
Still not convinced?
12. Meet Rep. Trey Radel (R-FL)
He Bros out internationally.
And he makes his own tequila, Bro!
Cool story Bro!
Nice right?
11. Meet Rep. Adam Kinzinger (R-IL)
He chills out at the ballpark Bro!
He takes these awesome shots of John Kerry!
He rocks a Bro stance with the best of em!
BRO! Cool story!
Awesome right? Get ready for more.
10. Meet Rep. Jon Runyan (R-NJ)
He has a Bro-cycle.
Cool grill Bro.
But there are more…
9. Meet Rep. Aaron Schock (R-IL)
He loves Taylor Swift.
Which is so chill Bro!
There is no situation that he cannot Bro-handle!
Cool story Bro!
8. Meet Senator Chris "Murf" Murphy (D-CT)
Via http://Kathleen%20Schassler/West%20Hartford%20News


text:
Originally written on Pro Sports Daily | Last updated 10/23/12
Nobody is having more fun in the postseason than San Francisco Giants second baseman Marco Scutaro. He'll turn 37 soon. He's playing on his sixth team. He's going to his first World Series. "I'm just enjoying this moment, man," he said. "When things are going really good, you've got to enjoy it, right?" Scutaro was named MVP of the NLCS after hitting .500 with 14 hits in 28 at-bats. And to think, back in Game 2, it seemed as if he'd be knocked out of the postseason on a hard slide by Matt Holliday. Instead, he rebounded and turned the series into his little playground. He said the Holliday slide, which temporarily sidelined Scutaro with hip and knee injuries, wasn't a motivating factor. "No," he said. "I was inspired because the playoffs had started. I was focused on helping the team go to the next round." In the Game 7 victory over the Cardinals, Scutaro had three hits and a walk. "Absolutely deserving of the MVP," teammate Hunter Pence said. Now comes the World S...
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- Jim Carrey Apologizes to Family After Posting Photo of Autistic Boy Without Permission Us Weekly - 50 minutes ago
Jim Carrey issued a public apology on Twitter Thursday night after using a photo of an autistic boy without his family's permission More »Jim Carrey Apologizes to Family After Posting Photo of Autistic Boy Without Permission
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This article, Nicolas Cage's Superman Test Footage Is the Most '90s Thing Ever, originally appeared on TVGuide.com. There have been a lot of different takes on Superman over the years, but this might be the most ridiculous one yet. In the late '90s, Tim Burton was working on a Superman movie that was going to star Nicolas …
- Marvel's Black Panther Loses Ava DuVernay Over Creative Differences TV Guide - 1 hour 20 minutes ago
This article, Marvel's Black Panther Loses Ava DuVernay Over Creative Differences, originally appeared on TVGuide.com. Marvel has lost yet another exciting director over creative differences: Ava DuVernay has decided not to direct the 2017 Black Panther feature. In an interview with Essence, the Selma director revealed …
- Josh Hartnett Is Going to Be a Dad! TV Guide - 1 hour 25 minutes ago
Josh Hartnett and his girlfriend Tamsin Egerton are expecting their first child, Page Six reports. Hartnett, 36, has been dating Egerton, a 26-year-old British actress and model, for four years after meeting on the set of The Lovers in 2011. "Everybody makes mistakes dating people they work with," Hartnett told Playboy …
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Is it OK to use one's military credentials to raise awareness of a nonmilitary product?
It's always OK. 59%
It's sometimes acceptable. 28%
Keep your military background out of it. 13%
Votes Cast: 32
This survey is not a scientific sampling, but offers a quick view of what readers are thinking
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text:
Yeah, it's those little one liners that help one get through life lol.
Damn, I've got a hell of a list of things to watch. Thankfully most are on NetFlix.
OK, ultimate nerd test. What about... The new Star Trek movies?
I stuck with South Park for a few seasons, and it's definitely had its moments and funny one liners I've repeated ad nauseum with my buddies "YOU TOOK OUR JERBS!" is one I've used a few times when bantering with the Polish guys at work lol.
What about Arrow? Is that as good as everyone raves about? My bro started watching it the other day and is hooked.
Thanks for the links!
Yeah. It's the best. Lol I even loved the soundtrack. The animation was actually done by both Japanese and American animators, and a friend and I once sat the watching it deciphering who did what. Having watched all of the Japanese transformers cartoons it was quite easy to spot.
Yeah, Fam Guy is losing it's touch now as well. I need a new adult type cartoon to follow. South Park is another that I've done to death.
Lol, I was about six or seven.
Care Bear Stare, bitch!!
What site is that? I need a new one ever since Project Free TV got blocked by Sky (wankers! Lol).
You know it! Transformers was soooo good. I used to love that shit as a kid. When the first movie came out and Optimus Prime spoke for the first time and I realised it was the same voice I flipped out!! I also am in love with the cartoon movie, and it has to be one of my favourites of all of the times lol.
Yeah, the guy who played Brody was in Band Of Brothers which instantly made me feel at home with the show. I find it's always easier to get into something if there's someone you know in it.
I haven't seen Simpsons in a while, and kinda fell out of love with it once I found Family Guy. It's still a great show tho. The movie was so good. I think that's when I stopped watching it--it couldn't get any better than that!
Care Bear movie was awesome btw. My sis made me watch that until I knew all of the words lolol
Lol the main reason I've watched a ton of movies recently is because I've just got a new laptop, and my one before had a busted DVD drive so I couldn't watch anything other than what was on NetFlix which while fantastic for TV shows, it's a little poor for movies.
Speaking of NF and old cartoons. I have been watching all the old Transformers and GI Joe cartoons recently. Nothing like revisiting ones childhood lol. I also watched like ten seasons of Futurama. Lol I thought that show got canceled after four seasons so I was pleasantly surprised.
One thing I have watched recently (via Canadian Netflix) that I thought was really good was the first season of Homeland. Definitely going to be checking out the next two seasons.
In one day? Wow, that's some feat. I almost watched all three Bats movies yesterday but passed out somewhere after Bane broke his back. I finished it this morning the watched Argo. Lol I've watched a shit load of movies over the past few days.
Insomnia does suck. My sleeping patterns are the worst--either I can't sleep for love nor money, or I'm just knackered all of the time. I really need a normal job with normal hours lol.
Scott Pilgrim is sooooo cool! Stupid as fuck, but it totally works as a movie for me. The comic was kinda hard work tho.
Age Of Ultron is on my list. My bro and I both pledged £20 for our Christmas pressies for each other, and I was torn between AoU and AvsXMen. Lol I was in Waterstones for ages trying to decide with my bro saying "hurry up man the shops are gonna be closing soon!"..
Never been a Wonder Woman fan. She's just sooooo booooring lol. Plus, has she even got a super villain? If she has I've never heard of him/her.
Have you read Kick Ass? I've read the first two but yet to read the third one.
Wanted was really good as well. Totally different from the movie.
Speaking of independent comics: currently watching Scott Pilgrim. So good!
Might do the Star Wars movies next, I don't think I've ever watched all six in a row (not in one day obvs lol)
What are your favourite comics? Other than Batman obvs lol
Other than Bats I kinda struggle with DC, although I did read the entire Blackest Night mega series with the black lanterns. That was wicked. Generally I'm an X-Guy, but the Marvel mega stories really piqued my interest. Civil War and all those that followed it are what I currently read (I downloaded a million and one comics once I found out how to do it, and have been slowly catching up on everything.)
Also, I can't wait for the new Star Wars films.
Lol it's not a hard thing to do. He was particularly smug when talking about his interactions with Daniel Radcliffe when he saw him on set, and referred to him as "Dan". Prick
I used to work with the chef who helped make all the food for the first three movies. Apparently after the third they decided it was cheaper to go with plastic food.
Have you seen the new Hobbit movie? It's meant to be better than the first one, which IMO wasn't as great as I thought it was going to be. I think it was because there were just too many little folk in there to keep track of. It also kinda flirted with being too comical for my liking. Don't get me wrong, everyone likes a little fella in these sort of films, I just thought there were a few too many for me to take it seriously.
Yeah, it certainly was a story to tell the grandkiddies!
Another film related story is that my brother worked on the set of the last Harry Potter movie with the lighting team and he saw three of the midgets who played the goblins get into a big fight with one of the make up guys. Lol I would have loved to seen that. Even better for him was when he was asked to play one of the death eaters as an extra. I couldn't have been more jealous of the little git! He got to go to the after production party and everything. I deffo hated him for a while after that one lol
The Trinity
Black Ninja!
Normal Member
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text:
- List of properties
- Properties on map
752 commercial properties for sale found
77,012 sq ft
Warehouse for sale High Bay 9, Birmingham, B9 4HF
A HIGH BAY industrial warehouse of steel portal frame construction situated very close to Birmingham City and J6 of the M6 Motorway. The building benefits from 10.5 m eaves, lighting, THREE LEVEL LOADING DOORS, one dock level loading door and a LARGE SECURE YARD. More details ›
56 acres
Land for sale Essington Quarry, Bognop Road, Essington, Wolverhampton, WV11 2BG
The property comprises a FORMER QUARRY with potential for a variety of uses subject to planning approval. The quarry is well placed to benefit from EXCELLENT LINKS WITH THE MOTORWAY NETWORK being within easy reach of the M54 motorway which leads to the M6 and the A460. More details ›
71,341 sq ft
Warehouse for sale Former Ralph Martindale Premises, Manfield Road, Wolverhampton, WV13 3RX
The property comprises a SELF CONTAINED SITE, accessible from Manfield Road. Situated on the site is a single storey warehouse with ancillary office accommodation, yard and additional expansion land. The property benefits from a LARGE CONCRETE SURFACED YARD area accessed from Manfield Road. More details ›
£2,600,000 Offers in Region of
Offers in Region of £2,600,000
69,785 sq ft
Warehouse for sale Fortnum Close, Kitts Green, Birmingham, B33
RARE FREEHOLD OPPORTUNITY SECURE SELF-CONTAINED site with gatehouse. Loading on MULTIPLE ELEVATIONS. EXCELLENT TRANSPORT LINKS to J7 of M42 & J4 of M6 Motorways. More details ›
16,277 sq ft
Office for sale International House, Siskin Parkway East, Middlemarch Business Park, CV3 4FJ
The property BENEFITS from EXCELLENT ROAD COMMUNICATIONS, with the A45 linking the M42 and M1 Motorway. The property comprises a two-storey OFFICE building, the offices are predominantly OPEN PLAN AND BENEFIT FROM MANY SPECIFICATIONS. More details ›
£2,300,000 Guide Price
Guide Price £2,300,000
16,277 sq ft
Office for sale International House Middlemarch Business Park, Coventry, CV3
The property COMPRISES a two-storey OFFICE building of steel frame construction arranged over ground and first floors. Internally, the OFFICES ARE PREDOMINANTLY OPEN PLAN. LOCATED immediately ADJACENT to Coventry Airport and approximately 3 MILES SOUTH OF COVENTRY CITY CENTRE. More details ›
175,982 sq ft
Residential Development for sale Land south of Dixon Street and east of DUrberville Road, Wolverhampton, WV2 2DB
CANAL SIDE RESIDENTIAL DEVELOPMENT SITE with over 200m of canal frontage. The property lies south of Dixon Street and east of DUrberville Road to the south-east of WOLVERHAMPTON CITY CENTRE which is approximately 1.5 miles away. More details ›
76,676 sq ft
Light Industrial for sale Crossfield Road, Kitts Green, Birmingham, B33 9HP
The property is constructed of brick elevations, sectioned of duo pitched and flat roofs. The main pitched roof is formed of steel trusses and the roof covered with felt and Georgian wired glass sky lights. To the front elevation is a single storey section of felt roof covering and raised Georg... More details ›
60,799 sq ft
Warehouse for sale Rigid Charta, Cheston Road, Nechells, Birmingham, B7 5EA
The property comprises a modern detached THREE BAY distribution warehouse with a two storey integral OFFICES. The property has the benefit of three ROLLER SHUTTER bays and an eaves height to a maximum of 5.15m. The property benefits from a SECURE YARD to the front with four double entry gates. More details ›
12,935 sq ft
Office for sale The Oaks, No 1, Westwood Way, Westwood Business Park, Coventry, West Midlands, CV4 8JB
The Oaks is a two storey self contained office building, situated at the front of Westwood Business Park & set within LANDSCAPED GROUNDS, located just 4 miles west of Coventry. The premesis benefits from male & female WCs on each floor, suspended ceilings, car parking & EXCELLENT BUS LINKS. More details ›
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Honda preparing Dakar assault
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too old
Keen supporter
Joined: Nov 2011
Location: Sandy waste
Oddometer: 3,493
Originally Posted by
I just got the actual order for training roadbooks from JCR, so it looks like the team will indeed be coming over for some fun and sun.
The routes Johnny selected (for those who have ridden some of these and remember) are Pahrump Loops (281mi, 452km), Pahrump-Jean Loop (226mi, 364km), Bishop-Dumont (316mi, 509km), Primmo (301mi, 487km).
Each of these routes are almost entirely dirt, with little or no liaison. Average high temperature for Pahrump in August is 100°F, 38°C, yikes!
On the Bishop-Dumont day they'll hit a high altitude of 9636ft (2937m), and a low altitude of -213ft (-65m) BELOW sea level in Death Valley, all in about a 2 to 3 hour period. That should be a good stress test on the bikes and riders!
Could be a decent liaison both ends if they decide to ride from LA - unless they are flying into Vegas
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June 6, 2013
After hitting .298 in April and jumping out to the MLB lead in homers, Atlanta's Justin Upton has cooled off considerably, batting just .223 with 38 strikeout in 30 games.
Stories this photo appears in:
BRAVES NOTEBOOK: First B.J., now Justin --- Upton brothers take turns struggling at plate
Atlanta Braves star B.J. Upton began the season cold before heating up as of late, while brother Justin is now experiencing the same issues — only in reverse order. (ADDS: notebook items on Heyward heating up; Braves' bullpen becoming solid; Simmons streaking; and Ayala close to returning)
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Save vs. Splurge: Bronzy Wedding Day Makeup
Get a natural looking sun-kissed look for your wedding day without the harmful UVA rays! All you need to fake a post-honeymoon glow in the dead of winter is a quick contour on your cheeks and a golden smoky eye. The Secret? Picking creamy formulas that blend easily on your skin. See below for the best products that will help you achieve bridal... read more


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Originally written on Fox Sports Florida | Last updated 9/29/12
TAMPA, Fla. (AP) -- EJ Manuel threw for 242 yards and a touchdown, helping No. 4 Florida State remain unbeaten with a 30-17 victory over South Florida on Saturday night. Receiver Rashad Greene got the Seminoles going with a 10-yard touchdown run, Christian Jones scored on a 12-yard fumble return and Penn State transfer Kevin Haplea had a 1-yard TD reception as the Seminoles (5-0) survived their first road test of the season by pulling away from a three-point lead with two TDs and a field goal in the final 5:09 of the third quarter. Three years after returning to his hometown of Tallahassee to lead USF (2-3) to a 10-point upset of Florida State in his first college start, B.J. Daniels threw for 143 yards and ran for 72 more and two touchdowns for the Bulls.
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I am trying to install .30 using the update option in .29. It says that it's downloading changelog ... and nothing seems to be happening. Can anyone help??
ok, finally got it working. priiloader installed and hacks enabled...... yay. thanks for the help guys.
hi locjaw4x4
after installing, and enabling hacks and re-booting the wii, does ur screen return to the proper channel screen or do u get a black screen. i have softmooded my 4.2E wii and installed and enabled the hacks and after re-booting got a black screen with 4.2E
Preloader/hacks - WiiBrew to update my hack file
Wii system menu 4.1BootMii/boot2Priiloader .30cIOS38rev14
I just performed the preloader 0.3r4 before reading up the full article and now have message saying Error auto booting system menu.
ES_Diversify failed.
After reading theough all the article it seems most are for 4.2 menus. i already performed the 4.1E moding on this forum.
i want to get back the channels now, so not sure if i need to install the patched IOS70 wad with wadmanager and then this will bring back all my channels. or do i need to do more. (note: i am able to get hbc up to use wad manager)
If you are on 4.1 you don't use IOS70.
Reinstall your system menu, that will remove preloader and hopefully restore your menu.
Best to use priiloader rev48.
Thanks WiiJohn,
Thats the exact thread i am still reading up and was planning to ask if this is the correct way. i.e ios 60 patched then system menu 4.1
looks like that is the case.
Will feedback.
Just reinstall patched ios60 man it will come right back up
I have a wii 4.1U with HBC and Preloader v0.29. Can I install r4 without problem? And two more things:
First, Preloader on it v0.29 doesn't boot HBC. If I update it will work?
Second, I don't know if my ios are already patched and the ios that my system run (I think it's 60) How can i know that?
If I need to patch them, have any tutorial only for it?


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Gregg Bernstein
Prosecutor Won't Intervene In GPS Alibi Case
Baltimore's top prosecutor won't intervene in the case of a man serving life plus 30 years in a Maryland prison despite GPS evidence that says he couldn't have been the triggerman in a shooting that paralyzed a 5-year-old girl.
Mosby Upsets City State's Attorney Bernstein, Wins Democratic Primary
Major upset. City State's Attorney Gregg Bernstein loses his bid for re-election to a former prosecutor, who, at one time, briefly worked for Bernstein.
Mosby Defeats Bernstein In Close Race For Baltimore City State's Attorney
Former prosecutor Marilyn Mosby has won the election for Baltimore State's Attorney, defeating incumbent Gregg Bernstein.
City State's Attorney's Race Garners High-Profile Endorsements
Baltimore's City State's Attorney race is grabbing attention for its high-profile endorsements.
Violent Crime Focus Of Baltimore City State's Attorney Primary Race
Curbing violent crime continues to be a priority in the city. Baltimore saw an eight percent increase in the murder rate last year, and there have been six homicides in the first four days of June.
Key Interviews Released In Controversial Baltimore City Death-In-Custody Case
The death of a man during a chaotic arrest sparks outrage and several investigations. After clearing officers, Baltimore's top prosecutor releases key interviews conducted in the case.
Family Cries Cover-Up: No Criminal Charges Filed Against Officers In Death Of Tyrone West
Justifiable force. The state prosecutor will not file charges against the officers involved in the in-custody death of Tyrone West. Now his family is vowing to continue their fight for justice as police make changes to the way these cases are handled.
No 4th Trial For Man In Deaths Of 3 Relatives
A man convicted of conspiracy in the slayings of three young relatives won't be retried a fourth time on murder charges.
Baltimore City State's Attorney's Son Charged With Second-Degree Assault
Baltimore City State's Attorney Gregg Bernstein's son has been charged with second-degree assault.
Bernstein Reflects On First Year As State's Attorney
In his first year as state's attorney for Baltimore, Gregg Bernstein has faced some growing pains, but he also began making changes in the office.
Prosecutor Hosts Witness Intimidation Summit
Witnesses are crucial to the criminal justice system's success, so Baltimore State's Attorney Gregg Bernstein says it's no wonder that the "enemies of justice" try to stop them from cooperating.
Baltimore State's Attorney Lays Off 9
The Baltimore State's Attorney's Office has laid-off nine community liaisons due to budget constraints.


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Hostelworld "meet the world" by Lucky Generals
Rating: 5.0
By Gordon MacMillan, marketingmagazine.co.uk, Thursday, 01 November 2012 11:00AM
1. Couldn't Say It Better (official)
A montage of speeches about the problems of unemployment and the middle class, ending with Vice President Joe Biden admitting that the past four years have, indeed, 'buried' the middle class.
Shares 295,674
2. RNC* web ad 'Laughing at the Issues' (official)
This video focuses on how Democrat Joe Biden laughed at the serious issues his counterpart Paul Ryan discussed in the vice-presidential debate.
Shares 235,759
3. 12 Million Jobs (official)
Romney gives the breakdown of how he plans to create 12m jobs, should he be elected.
Shares 225,612
4. America's Comeback Team (official)
Vice-presidential nominee Paul Ryan leads a motivational speech in this clip, which introduces the Republican ticket.
Shares 205,125
5. We've Heard It All Before (official)
These clips from both Obama's Presidential campaigns highlight the promises he has failed to deliver on.
Shares 198,266
1. Samuel L Jackson - Wake the F*** Up
This video, endorsed by Super PAC group The Jewish Council for Education and Research (JCER), stresses the dangers of complacency and how important it is to vote for President Obama.
Shares 655,202
2. Sarah Silverman - Let My People Vote
This profanity-strewn clip, also endorsed by the JCER, highlights how new voter ID laws make it difficult for certain demographics to vote.
Shares 335,459
3. The Road We've Traveled (official)
This is a 16-minute long documentary on Obama's presidency and the challenges of the past four years.
Shares 334,564
4. Mitt Romney Debates Himself
This clip demonstrates how Romney often seems to contradict himself.
Shares 231,581
5. Happy Mother's Day (official)
Obama talks about his relationships with the women in his life, using a montage of photos.
Shares 205,316
Source: Unruly, measured on 25 October 2012 *Republican National Congress
This article was first published on marketingmagazine.co.uk
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Rating: 5.0
Agency: Grey London
Rating: 5.0


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HSBC "lift" by Grey London
Agency: Grey London
Rating: 5.0
By Sam Howroyd, brandrepublic.com, Monday, 08 October 2012 08:30AM
Looking at the latest research on Brand Republic's Intelligence section a few things really stick out, with the past couple of weeks seeing a focus on new technologies and how they are used by consumers.
According to Ipsos MediaCT's Tech Tracker survey, more than 10% of UK consumers now own a tablet and these devices are going to penetrate even further into the mass market, with many Brits saying they are interested in buying one in the near future.
Of course, tablet ownership is far higher among the better off, with Ipsos revealing that more than 40% of the business elite - a group it's been surveying since 1973 - are tablet owners. As with the rest of the population, the business elite has shown a marked increase in multiplatform behaviour, with around 35% of those who access media content doing so via more than one platform.
One other thing noted by Ipsos is that this group's interest in China seems to be waning due to a continued slowdown. However, it wasn't just in China that there was a downturn in the amount of business conducted, with many developing or emerging markets also experiencing this for the first time in a number of years.
Something that continues to grow, despite its less than stellar share performance since its IPO, is Facebook. Figures from GlobalWebIndex show that the social network is booming in emerging markets such as Brazil and India.
According to GlobalWebIndex's data, Facebook will reach two billion accounts worldwide by the fourth quarter of 2014, with India overtaking the US as its largest market.
Interestingly, when looking at mobile usage the data shows that just 5% of Facebook's user base exclusively use a mobile device.
Last week Facebook announced that 600 million users access it via a mobile device.
This article was first published on brandrepublic.com
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If you see a comment you find offensive, you can flag it as inappropriate. In the top right-hand corner of an individual comment, you will see 'flag as inappropriate'. Clicking this prompts us to review the comment. For further information see our rules for commenting on articles.
Agency: Grey London
Rating: 5.0


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April 24, 2013
Who says box wine isn't classy? We love this creative wine "purse" from Volére (available in pinot noir, pinot grigio, and rosé)! The rosé (pictured) is an Italian wine with notes of raspberry, strawberry, and rose petals. The cardboard "purse" contains an inner plastic bag that holds the wine, and there's a handy shoulder strap as well as a side spout so you can wear your purse while you pour! For only $13.99 for 1.5L we think this is the perfect gift! Check out the Merlot/Pinot Noir purse and the Pinto Grigio purse.
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DDR Enhanced Memory Controller (uMCTL2) supporting DDR4, DDR3, DDR2, LPDDR4, LPDDR3, and LPDDR2
Sonics Licenses On-Chip Network Technology To MediaTek
MILPITAS, Calif., Jan. 8, 2014 -- Sonics, Inc., the world's foremost supplier of network-on-chip (NoC) technologies and services, today announced that it has licensed its on-chip interconnect technology to MediaTek Inc., a leading fabless semiconductor company for wireless communications and digital multimedia solutions. MediaTek will use Sonics' technology in a forthcoming new line of systems-on-chip (SoC).
"We are excited to add MediaTek to our growing stable of on-chip network customers. They are one of the top 20 fabless semiconductor companies in the world and have deep technical expertise in developing heterogeneous computing SoCs," said Grant Pierce, president and CEO of Sonics. "We look forward to working closely with MediaTek to ensure the best NoC design experience for its next-generation, multi-core SoCs. Employing our NoC in its SoCs enables MediaTek's system architects and IC engineers to deliver the performance, power, and security required in the silicon as well as by the consumer electronic products these chips will ultimately drive."
"We are pleased to become a Sonics technology licensee," said Star Hung, senior manager at MediaTek. "The Company's NoC products have been proven in many of the most demanding SoC designs over the past decade and we look forward to partnering with Sonics for our SoC design success."
About Sonics, Inc.
Sonics, Inc., is a pioneer of network-on-chip (NoC) technology and was the first company to develop and commercialize on-chip interconnect to accelerate volume production of complex, systems-on-chip (SoC) containing multiple processor cores since 1996. Sonics offers SoC designers a comprehensive portfolio of interconnect technologies that deliver the communication performance required by today's most innovative consumer digital, communications, and information technology devices and electronic products. Sonic's global customers have shipped more than two billion SoCs and the company holds more than 138 patent properties. Sonics is headquartered in Milpitas, CA, for more information, please visit http://www.sonicsinc.com.
Search Silicon IP
Sonics, Inc. Hot IP
- The SonicsSX on-chip communications network contains a high performance, advance ...
- GHz On-Chip Network
- Intelligent Dynamic Random Access Memory scheduler
- SonicsExpress provides a high bandwidth OCP2 bridge between two clock domains, w ...
- SonicsLX on-chip communications network contains a high performance advanced fab ...
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text:
It's the same old, just the same old
How the game go, where the pain go, where the blame go
from Pusha T (Ft. Jeezy & Kevin Cossom) – No Regrets Lyrics on Genius
It's the same old story with the drug dealing game.
Who suffers? The crack addict or the remorseful dealer.
Who's to blame? The crack addict who made the decision to buy it in the first place, or the dealer who made the decision to deal it.
To help improve the quality of the lyrics, visit Pusha T (Ft. Jeezy & Kevin Cossom) – No Regrets Lyrics and leave a suggestion at the bottom of the page


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Find a copy in the library
Finding libraries that hold this item...
|Bible records
Land grants
Letters (correspondence)
|Named Person:
|Lelia Coles Bennett; Mary Walker Carter Carter; Selina Skipwith Coles; Tucker S Coles; Francis Fauquier; George Gilmer; Gilmore family.; Hudson family.; Thomas Jefferson; Skipwith family.; Grey Skipwith; Peyton Skipwith; Grey Skipwith Staples; Thomas Walker; Claudia Coles
|Document Type:
|Archival Material
|All Authors / Contributors:
Ruth Dettor Gilmer; Francis Fauquier; George Gilmer; Grey Skipwith; Mary Walker Carter Cabell; Tucker S Coles; Selina Skipwith Coles; Grey Skipwith Staples; Lelia Coles Bennett; Claudia Coles
|OCLC Number:
|Reproduction Notes:
|7 items.
Also include handwritten copy of a letter, 5 August 1848, from Grey Skipwith, Warwickshire, England, to Mary Walker Carter Cabell, Nelson County, Va., regarding his children and his brother, her grandfather, Peyton Skipwith; deed, 1880, Tucker S. Coles and his wife, Selina Skipwith Coles, regarding lands in Albemarle County, Va.
Also include letter, 24 September 1920, from Grey Skipwith Staples, Smithfield, N.C., to Lelia Coles Bennett, North Garden, Va., regarding the purchase of the Prestwould, the Skipwith family estate; letter, imperfect, ca. 1925, from Claudia Coles, Warwickshire, England, regarding the Skipwiths.
Similar Items
Related Subjects:(21)
- Bennett, Lelia Coles.
- Carter, Mary Walker Carter.
- Coles, Selina Skipwith.
- Coles, Tucker S.
- Fauquier, Francis, -- 1704?-1768.
- Gilmer, George, -- 1745-1792.
- Gilmore family.
- Hudson family.
- Jefferson, Thomas, -- 1743-1826 -- Medical examinations.
- Skipwith family.
- Skipwith, Grey.
- Skipwith, Peyton.
- Staples, Grey Skipwith.
- Walker, Thomas, -- 1715-1794.
- Albemarle County (Va.) -- History -- 19th century.
- Augusta County (Va.) -- History -- 18th century.
- Genealogical correspondence -- Virginia.
- Physicians -- Virginia -- History -- 18th century.
- Plantations -- Virginia -- Mecklenburg County -- History -- 20th century.
- Slaves -- Medical care -- Virginia -- History -- 18th century.
- Coles, Claudia.


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Results 1 to 3 of 3
Thread: new year new sketchbook
January 13th, 2012 #1
new year new sketchbook
Ive decided to start a new sketchbook so here goes, feel free to crit the hell out of it. I can take it
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line and color sense are really nice. for the first pic (of the jungle) I'd wish to see the fg developed a little more.. the composition and coloring is so nice but it looks unfinished in the larger image.
January 13th, 2012 #3
With the first image think about the foliage and how much light is getting through it. The boardwalk seems evenly lit but in reality maybe there should be some shadows from the leaves.
I really like your line work in the other images!
Keep at it!
Learn something new everyday
My Sketchbook
My Website
My CA Gallery


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The Mobile Academy: MLearning for Higher Education
John Wiley & Sons, Oct 18, 2011 - Education - 120 pages
A fundamental revolution in higher education is being sparked by the ubiquity of mobile devices used by students, faculty, and administrators. The opportunity is ripe for institutions, instructors, and instructional designers to take advantage of mobile technology to enhance the learning experience. To do this, we need to understand the power on tap, examine fundamental principles, review illustrative examples, and ultimately think through ways to improve the learner experience.
The Mobile Academy contains theoretical and practical guidance on the ways mobile devices can be used most effectively in higher education. It is a guide for systematically integrating mobile devices into courses and other academic and student support services in order to facilitate learning outcomes and student success.
The book covers a wealth of topics, including the use of text messages, mobile web, e-books, and mobile apps, as applied to:
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