text:
A thermally-conductive compound for forming a layer which is conformable between a first heat transfer surface and an opposing second heat transfer surface to provide a thermal pathway therebetween. The compound is an admixture of a thermal grease component and a dispersed constituent forming discrete domains within the grease component, the domains being form-stable at normal room temperature in a first phase and conformable between the first and second heat transfer surface in a second phase, and the domains having a domain transition temperature above normal room temperature from the first phase to the second phase. The dispersed constituent may be a fusible, i.e., low temperature melting, metal or metal alloy.
1. A thermally-conductive compound for forming a layer which is conformable between a first heat transfer surface and an opposing second heat transfer surface to provide a thermal pathway therebetween, the compound comprising an admixture of:
(a) a thermal grease component; and
(b) a dispersed component forming discrete domains within the thermal grease component, the domains being form-stable at normal room temperature in a first phase and conformable between the first and second heat transfer surface in a second phase, and the domains having a transition temperature above normal room temperature from the first phase to the second phase.
2. The compound of
3. The compound of
4. The compound of
5. The compound of
6. The compound of
7. The compound of
8. The compound of
the first heat transfer surface is located on a heat-generating source having an operating temperature range above normal room temperature; and
the domain transition temperature is within the operating temperature range the heat-generating source.
9. The compound of
10. The compound of
11. The compound of
the first heat transfer surface is located on a heat-generating source having an operating temperature range above normal room temperature; and
the transition temperature of the domains is within the operating temperature range the heat-generating source.
12. The compound of
the heat-generating source is an electronic component; and
the second heat transfer surface is located on a thermal dissipation member.
13. The compound of
14. The compound of
15. The compound of
16. The compound of
17. The compound of
18. The compound of
19. The compound of
20. The compound of
21. The compound of
22. The compound of
23. The compound of
24. The compound of
25. The compound of
26. The compound of
27. The compound of
28. The compound of
29. The compound of
30. A thermal management assembly comprising:
a first heat transfer surface;
a second heat transfer surface opposing said first heat transfer surface; and
a thermally-conductive interface interposed intermediate the first and said second heat transfer surface to provide a thermally-conductive pathway therebetween, the interface comprising a thermally-conductive compound formed into a layer which is conformable between the first and second heat transfer surface, the compound comprising an admixture of:
(a) a thermal grease component; and
(b) a dispersed component forming discrete domains within the thermal grease component, the domains being form-stable at normal room temperature in a first phase and conformable between the first and second heat transfer surface in a second phase, and the domains having a transition temperature above normal room temperature from the first phase to the second phase.
31. The assembly of
32. The assembly of
33. The assembly of
34. The assembly of
35. The assembly of
36. The assembly of
37. The assembly of
the first heat transfer surface is located on a heat-generating source having an operating temperature range above normal room temperature; and
the domain transition temperature is within the operating temperature range the heat-generating source.
38. The assembly of
39. The assembly of
40. The assembly of
the first heat transfer surface is located on a heat-generating source having an operating temperature range above normal room temperature; and
the transition temperature of the domains is within the operating temperature range the heat-generating source.
41. The assembly of
the heat-generating source is an electronic component; and
the second heat transfer surface is located on a thermal dissipation member.
42. The assembly of
43. The assembly of
44. The assembly of
45. The assembly of
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47. The assembly of
48. The assembly of
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51. The assembly of
52. The assembly of
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55. The assembly of
56. The assembly of
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58. The assembly of
[0001] This application is a continuation-in-part of U.S. application Ser. No. 10/277,970, entitled "Thermal Management Materials Having A Phase Change Dispersion," filed Oct. 21, 2002, and claiming priority to U.S. provisional application Serial No. 60/354,810, filed Feb. 6, 2002, the disclosure of each of which is expressly incorporated herein by reference.
[0002] The present invention relates broadly to thermal management materials for electronic devices. Such materials commonly are used as heat transfer interfaces between, for example, the mating heat transfer surfaces of a heat-generating, electronic component, such as an integrated circuit (IC) chip, and a thermal dissipation member, such as a heat sink or spreader, for the conductive cooling of the electronic component. More particularly, the present invention relates to a thermally-conductive interface material which is formed as an admixture of a continuous phase constituent and a dispersed phase constituent which is provided to be solid, semi-solid or otherwise form-stable in a first state at normal room temperature but conformable with the continuous phase constituent in a second state within the operating temperature of the electronic component to provide an enhanced low thermal impedance interface between the component and the dissipation member.
[0003] Circuit designs for modern electronic devices such as televisions, radios, computers, medical instruments, business machines, communications equipment, and the like have become increasingly complex. For example, integrated circuits have been manufactured for these and other devices which contain the equivalent of hundreds of thousands of transistors. Although the complexity of the designs has increased, the size of the devices has continued to shrink with improvements in the ability to manufacture smaller electronic components and to pack more of these components in an ever smaller area.
[0004] As electronic components have become smaller and more densely packed on integrated boards and chips, designers and manufacturers now are faced with the challenge of how to dissipate the heat which is ohmicly or otherwise generated by these components. Indeed, it is well known that many electronic components, and especially power semiconductor components such as transistors and microprocessors, are more prone to failure or malfunction at high temperatures. Thus, the ability to dissipate heat often is a limiting factor on the performance of the component.
[0005] Electronic components within integrated circuits traditionally have been cooled via forced or convective circulation of air within the housing of the device. In this regard, cooling fins have been provided as an integral part of the component package or as separately attached thereto for increasing the surface area of the package exposed to convectively-developed air currents. Electric fans additionally have been employed to increase the volume of air which is circulated within the housing. For high power circuits and the smaller but more densely packed circuits typical of current electronic designs, however, simple air circulation often has been found to be insufficient to adequately cool the circuit components.
[0006] Heat dissipation beyond that which is attainable by simple air circulation may be effected by the direct mounting of the electronic component to a thermal dissipation member such as a "cold plate" or other heat sink or spreader. The dissipation member may be a dedicated, thermally-conductive ceramic or metal plate or finned structure, or simply the chassis or circuit board of the device. However, beyond the normal temperature gradients between the electronic component and the dissipation member, an appreciable temperature gradient is developed as a thermal interfacial impedance or contact resistance at the interface between the bodies.
[0007] That is, and as is described in U.S. Pat. No. 4,869,954, the faying thermal interface surfaces of the component and heat sink typically are irregular, either on a gross or a microscopic scale. When the interfaces surfaces are mated, pockets or void spaces are developed therebetween in which air may become entrapped. These pockets reduce the overall surface area contact within the interface which, in turn, reduces the heat transfer area and the overall efficiency of the heat transfer through the interface. Moreover, as it is well known that air is a relatively poor thermal conductor, the presence of air pockets within the interface reduces the rate of thermal transfer through the interface.
[0008] To improve the heat transfer efficiency through the interface, a pad or other layer of a thermally-conductive, electrically-insulating material typically is interposed between the heat sink and electronic component to fill in any surface irregularities and eliminate air pockets. Initially employed for this purpose were materials such as silicone grease or wax filled with a thermally-conductive filler such as aluminum oxide. Such materials usually are semi-liquid or solid at normal room temperature, but may liquefy or soften at elevated temperatures to flow and better conform to the irregularities of the interface surfaces.
[0009] Alternatively, another approach is to substitute a cured, sheet-like material in place of the silicone grease or wax. Such materials may be compounded as containing one or more thermally-conductive particulate fillers dispersed within a polymeric binder, and may be provided in the form of cured sheets, tapes, pads, or films. Typical binder materials include silicones, urethanes, thermoplastic rubbers, and other elastomers, with typical fillers including aluminum oxide, magnesium oxide, zinc oxide, boron nitride, and aluminum nitride.
[0010] Exemplary of the aforesaid interface materials is an alumina or boron nitride-filled silicone or urethane elastomer which is marketed under the name CHO-THERM� by the Chomerics TEC Division of Parker-Hannifin Corp., 16 Flagstone Drive, Hudson, N.H. 03051. Additionally, U.S. Pat. No. 4,869,954 discloses a cured, form-stable, sheet-like, thermally-conductive material for transferring thermal energy. The material is formed of a urethane binder, a curing agent, and one or more thermally conductive fillers. The fillers, which may include aluminum oxide, aluminum nitride, boron nitride, magnesium oxide, or zinc oxide, range in particle size from about 1-50 microns (0.05-2 mils).
[0011] Sheets, pads, and tapes of the above-described types have garnered general acceptance for use as interface materials in the conductive cooling of electronic component assemblies such as the semiconductor chips, i.e., dies, described in U.S. Pat. No. 5,359,768. In certain applications, however, heavy fastening elements such as springs, clamps, and the like are required to apply enough force to conform these materials to the interface surfaces in order to attain enough surface for efficient thermal transfer. Indeed, for some applications, materials such as greases and waxes which liquefy, melt, or soften at elevated temperature continue to be preferred as better conforming to the interface surfaces under relatively low clamping pressures.
[0012] Recently, phase-change materials ("PCM") have been introduced which are self-supporting and form-stable at room temperature for ease of handling, but which liquefy or otherwise soften at temperatures within the operating temperature range of the electronic component to form a viscous, thixotropic phase which better conforms to the interface surfaces. These phase-change materials, which may be supplied as free-standing films, or as heated screen printed onto a substrate surface, advantageously function much like greases and waxes in conformably flowing within the operating temperature of the component under relatively low clamping pressures of about 5 psi (35 kPa). Such materials are further described in commonly-assigned U.S. Pat. No. 6,054,198, and in the commonly-assigned publications U.S. Pat. No. 20020135984, WO0036893, and WO02059965, and U.S. application Ser. No. 10/277,970, filed Oct. 21, 2002, entitled "Thermal Management Materials Having A Phase Change Dispersion." Such materials are marketed commercially under the names THERMFLOW� T310, T443, T705, T710, T725, and A725 by the Chomerics Division of Parker-Hannifin Corp., 16 Flagstone Drive, Hudson, N.H. 03051. Other phase-change materials are shown in U.S. Pat. No. 6,391,442, and are marketed commercially by the Bergquist Company (Minneapolis, Min.) under the tradename "HI-FLOW™," by Thermagon, Inc. (Cleveland, Ohio.) under the tradename "T-PCM™," and by Orcus, Inc. (Stilwell, Kans.) under the tradename "THERMAPHASE." A phase-change material/metal foil laminate is marketed by Thermagon, Inc. under the tradename "T-MATE™."
[0013] For typical commercial application, the thermal interface material may be supplied in the form of a tape or sheet which includes an inner and outer release liner and an interlayer of thermal compound. Unless the thermal compound is inherently tacky, one side of the compound layer may be coated with a thin layer of a pressure-sensitive adhesive (PSA) for the application of the compound to the heat transfer surface of a heat sink. In order to facilitate automated dispensing and application, the outer release liner and compound interlayer of the tape or sheet may be die cut to form a series of individual, pre-sized pads. Each pad thus may be removed from the inner release liner and bonded to the heat sink using the adhesive layer in a conventional "peel and stick" application which may be performed by the heat sink manufacturer.
[0014] With the pad being adhered to the heat transfer surface of the thermal dissipation member such as a heat sink or spreader, and with the outer liner in place to form a protective cover the outer surface of the compound layer, the dissipation member and pad may be provided as an integrated assembly. Prior to installation of the assembly, the outer release liner is removed from the compound layer, and the pad positioned on the electronic component. A clamp may be used to secure the assembly in place.
[0015] Other materials, as exemplified in U.S. Pat. No. 5,467,251, and in commonly-assigned U.S. Pat. No. 5,781,412, and as marketed commercially by the Chomerics Division of Parker-Hannifin Corp. under the name "THERM-A-FORM™," are commonly referred to as thermal interface compounds, caulks, form-in-place materials, or encapsulants. These materials typically are supplied as charged within one or more tubes, containers, and the like as, most often, one or two-part liquid or otherwise fluent, filled reactive systems which cure at room or elevated temperatures to be formed-in-place within the gap or component to which the compound is applied. Application may be cartridge or tube guns or other dispensing systems.
[0016] In view of the foregoing, it will be appreciated that further improvements in thermal management materials would be well-received by electronics manufacturers.
[0017] The present invention is directed to a thermally-conductive interface, and a material therefor, for a thermal management assembly involving, for example, a heat source such as an electronic chip or other heat-generating component and a thermal dissipation member such as a heat sink or spreader disposable in thermal adjacency with the electronic component for the conduction of heat therebetween. Particularly, the invention is directed to a material in the form of a thermally-conductive compound which may be provided as a sheet or pad, and/or which may be dispensable, such under an applied pressure as issued as a bead or mass from a nozzle or other orifice, for forming an interlayer which is compliant or otherwise conformable between the interfacing surfaces of the electronic component and the heat sink or spreader to provide a low thermal impedance across the assembly, and which affords lower thermal impedance for improved heat transfer performance.
[0018] Heretofore, materials of the type herein involved, and particularly those of a phase change variety, conventionally were formulated as a blend of a resin or wax binder and a thermally-conductive, particulate filler which may be one or more metal powders or metal or non-metal nitrides or oxides. Such fillers have a fixed particle size within the material such that the maximum particle size thereof defines the minimum thickness of the material within the interface formed between the respective surfaces of the assembly. Advantageously, it has been observed that by utilizing a thermally-conductive, a phase change material ("PCM") which forms a dispersed phase within a continuous phase of one or more polymeric materials, a thermal interface compound may be formulated which is highly conformable for lower contact resistance, and which the minimum thickness thereof within an interface or bondline need not be determined by the maximum particle size of a filler.
[0019] In an illustrative embodiment, the thermally-conductive compound of the present invention is formulated as an admixture of a non-curing thermal grease, which may be a paste or paste-like in consistency, and a fusible, i.e., low temperature melting, metal component. The grease may be based on a silicone fluid, or on another fluid or oil such as a mineral or hydrocarbon oil., and may contain one or more thermally-conductive particulate fillers. The metal component may be formulated as a mixture of one or more fusible metals, one or more fusible metal alloys, or a blend of one or more fusible metals and one or more fusible metal alloys. The fusible metal component is selected to be form-stable at normal room temperature in a first phase or state, and conformable within the interface in a second phase or state, and as having a transition temperature, such as a melting point (Tm) or glass transition (Tg) in the case of the polymeric component, and a melting point, solidus, or liquidus in the case of the fusible metal component, or a transition temperature range from the first phase to the second phase which is within the operating temperature range of the electronic component, and typically between about 40-100� C.
[0020] Advantageously, the fusible metals and/or alloys herein involved exhibit thermal conductivities on the order of about 20 W/m-K or more which are comparable to those exhibited by conventional metal powder particulate fillers. Moreover, within the interface or bondline, such metals and alloys also are conformable with the thermal grease such that the minimum thickness of the interface material need not be limited by the size of the fusible metal. Further, by virtue of the use of a thermal grease which remains viscous at room temperature, a relatively thin minimum bondline thickness ("MBLT") may be achieved under relatively low applied pressures and at room temperature, with the MBLT becoming even thinner in service as the fusible metal changes phase upon the powering of the electronic component.
[0021] The present invention, accordingly, comprises the combination of elements which are exemplified in the detailed disclosure to follow. Advantages of the present invention include a thermal interface material which is fully conformable for lowered contact resistance and more efficient heat transfer. Further advantages include a thermal interface material which may be formulated for use in applications requiring thin minimum bondline thicknesses ("MBLT"), but which as also specifying a material having high bulk thermal properties. Still further advantages include a thermal interface material which may be supplied in a sheet, tape, or pad, or in a syringe, gun, or other dispensable form.
[0022] For a fuller understanding of the nature and objects of the invention, reference should be had to the following detailed description taken in connection with the accompanying drawings wherein:
[0023]FIG. 1 is a perspective view of a representative thermal interface pad having a conformable layer of a thermally-conductive compound formulated in accordance with the present invention;
[0024]FIG. 2 is a cross-sectional view of the thermal interface pad of FIG. 1 taken through line 2-2 of FIG. 1;
[0025]FIG. 3 is a depiction showing the morphology of the thermal compound forming the conformable layer of the thermal interface pad interface of FIG. 1;
[0026]FIG. 4 is a perspective, somewhat schematic view of a representative application of the thermally-conductive compound of the present invention as dispensed onto a surface;
[0027]FIG. 5 is a perspective view showing the thermal interface of FIG. 1 as bonded to a plate-fin heat sink for use in a representative thermal management assembly;
[0028]FIG. 6 is a cross-sectional view of a representative thermal management assembly wherein the heat sink and interface of FIG. 5 are disposed in heat transfer adjacency with a heat generating electronic component with the interface being interposed in conductive heat transfer contact with the heat sink and component to provide a low thermal impedance pathway therebetween;
[0029]FIG. 7A is a magnified view of a portion of the interface pad of FIG. 6 showing the morphology thereof prior to phase change in enhanced detail;
[0030]FIG. 7B is a magnified view as in FIG. 7B showing the morphology the interface pad of FIG. 5 after phase change; and
[0031]FIG. 8 is a plot of thermal impedance versus pressure for a representative formulation of the thermally-conductive compound of the present invention, and as compared to a standard thermal grease.
[0032] The drawings will be described further in connection with the following Detailed Description of the Invention.
[0033] Certain terminology may be employed in the description to follow for convenience rather than for any limiting purpose. For example, the terms "forward," "rearward," "right," "left," "upper," and "lower" designate directions in the drawings to which reference is made, with the terms "inward," "interior," "inner," or "inboard" and "outward," "exterior," "outer," or "outboard" referring, respectively, to directions toward and away from the center of the referenced element, and the terms "radial" or "horizontal" and "axial" or "vertical" referring, respectively, to directions, axes, planes perpendicular and parallel to the central longitudinal axis of the referenced element. Terminology of similar import other than the words specifically mentioned above likewise is to be considered as being used for purposes of convenience rather than in any limiting sense. Also as used herein, "state change" may be used interchangeably with "phase change" to avoid confusion with the description of separate material phases, such as a continuous and a dispersed phase, within a compound or layer thereof.
[0034] In the figures, elements having an alphanumeric designation may be referenced herein collectively or in the alternative, as will be apparent from context, by the numeric portion of the designation only. Further, the constituent parts of various elements in the figures may be designated with separate reference numerals which shall be understood to refer to that constituent part of the element and not the element as a whole. General references, along with references to spaces, surfaces, dimensions, and extents, may be designated with arrows.
[0035] For the illustrative purposes of the discourse to follow, the thermally-conductive interface and material therefor of the invention herein involved is described in connection with its use within a thermal management assembly as a pad, which may be die or kiss-cut from a sheet or roll, which is adhered to a heat transfer surface of a thermal dissipation member such as a heat sink for heat transfer contact with a mating heat transfer surface of a electronic component. Such assemblies and thermal interface materials therefor are elsewhere described in U.S. Pat. Nos. 6,096,414; 6,054,198; 5,798,171; 5,766,740; 5,679,457; 5,545,473; 5,533,256; 5,510,174; 5,471,027; 5,359,768; 5,321,582; 5,309,320; 5,298,791; 5,250,209; 5,213,868; 5,194,480; 5,137,959; 5,167,851; 5,151,777; 5,060,114; 4,979,074; 4,974,119; 4,965,699; 4,869,954; 4,842,911; 4,782,893; 4,764,845; 4,685,987; 4,654,754; 4,606,962; 4,602,678; 4,473,113; 4,466,483; 4,299,715; and 3,928,907. It will be appreciated, however, that aspects of the present invention, which alternatively may be provided in other roll, sheet, film, or layer form such as a tape, may find use in other thermal management applications. The material of the invention also may be liquid dispensed or otherwise applied in a layer or pattern onto one of the heat transfer surfaces by direct or indirect means such as spraying, knife, roller, drum or other coating, brushing, casting, dipping, extrusion, screen, transfer, or other printing, and the like. Such uses and applications therefore should be considered to be expressly within the scope of the present invention.
[0036] Referring then to the figures wherein corresponding reference characters are used to designate corresponding elements throughout the several views with equivalent elements being referenced with prime or sequential alphanumeric designations, a representative thermally-conductive interface pad in accordance with the present invention is shown generally at 10 in perspective in FIG. 1 and in cross-section in FIG. 2. Within a thermal management assembly, pad 10 is interposable intermediate, for example, a pair of opposing heat transfer surfaces, such as from a heat sink or spreader and a heat-generating electronic component (see FIG. 6) to provide a low impedance, thermally-conductive pathway therebetween. In this regard, a first interface surface, referenced generally at 12, of pad 10 is disposable in conductive heat transfer contact or adjacency with one of the heat transfer surfaces, with an opposing second interface surface, referenced generally at 14, of the pad 10 being disposable in conductive heat transfer contact or adjacency with the other of the heat transfer surfaces.
[0037] Pad 10 may be provided in the form of, or as formed from, such as by die or kiss-cutting, a sheet, roll, tape, or the like. In basic composition, pad 10 is formed of a layer, 20, of a. thermally-conductive compound formulated in accordance with the precepts of the present invention, which layer 20 forms the surfaces 12 and 14 of the pad 10, and which layer 20 is compliant or otherwise conformable between the heat transfer surfaces of the thermal management assembly. For most applications, compound layer 20 will have thickness, referenced at "t" in FIG. 2, of about 5 mils (125 μm) or less and not greater than about 20 mils (510 μm), and will exhibit a thermal impedance, such as in accordance with ASTM D5470, of between about 0.01-0.02� C.-in2/W (0.065-0.13� C.-cm2/W), and a thermal conductivity, such as also in accordance with ASTM D5470, of at least about 0.7 W/m-K.
[0038] In accordance with the present invention, the thermally-conductive compound of the conformable layer 20 is formulated, with reference momentarily to the somewhat stylized morphological, i.e., photomicrographical, depiction of layer 20 which is referenced at 30 in FIG. 3, as a blend or other admixture of a continuous phase component or other constituent which forms a generally continuous matrix phase, 32, in layer 20, and a dispersed phase component or other constituent which forms generally discrete domains, one of which is referenced at 34, within the matrix phase 32.
[0039] The continuous phase component be provided as what is generally termed a thermal grease or paste, with the term "thermal grease" herein being adopted and used interchangeably with the term "thermal paste." Depending upon its viscosity (absolute or intrinsic) which may range between about 10,000-300,000 cp (10-300 Pa-s), such non-curing grease may be generally form-stable or gel-like, i.e., non-running, slumping, or sagging at normal room temperature (between about 25-30� C.), but otherwise may be semi-solid, semi-liquid, or otherwise viscous or viscoelastic and/or thixotropic.
[0040] Particularly, the thermal grease may be oil-based, and more particularly based on a mineral or hydrocarbon oil, a synthetic oil such as a glyceride, or, preferably, a silicone oil or, as commonly termed, "silicone fluid," which may be an organosiloxane, or a blend of one or more of any of the aforementioned. The grease may be formulated to be inherently tacky or sticky to enable one or both of the surfaces 12 and 14 of the layer 20 to adhere, such as by means of surface tension, at room temperature under a low applied pressures of about 5 psi (35 kPa) or less to the surface of the heat sink, spreader, or the like.
[0041] Additional fillers and additives may be included in the thermal grease compound depending upon the requirements of the particular application envisioned. Such fillers and additives, which may be compounded with the oil component in a conventional mixing apparatus, may include conventional wetting agents or surfactants, opacifying or anti-foaming agents, chain extending oils, tackifiers, pigments, lubricants, stabilizers, flame retardants such as decabromodiphenyl oxide, antioxidants, thermally-conductive fillers, stabilizers, dispersants, flow modifiers, tackifiers, film-reinforcing polymers and other agents, and inert fillers such as fumed silica.
[0042] For optimal thermal performance, the oil component may be compounded with a conventional thermally-conductive particulate filler, particles of such filler being represented at 40 in the view 30 of FIG. 3. The filler typically will be included within the oil component in a proportion sufficient to assist in providing the thermal conductivity desired for the intended application, and generally will be loaded at between about 20-80% by total weight of the oil component and filler. The size and shape of the filler is not necessarily critical for the purposes of the present invention. In this regard, the filler may be of any general shape including spherical, flake, platelet, irregular, or fibrous, such as chopped or milled fibers, but preferably will be a powder or other particulate to assure uniform dispersal and homogeneous mechanical and thermal properties. The particle size or distribution of the filler typically will range from between about 0.01-10 mil (0.25-250 μm), but may further vary depending upon the thickness of layer 20. Suitable thermally-conductive fillers, which may be either electrically-conductive or nonconductive, include boron nitride, titanium diboride, aluminum nitride, silicon carbide, graphite, metals such as silver, aluminum, and copper, metal oxides such as aluminum oxide, magnesium oxide, zinc oxide, beryllium oxide, and antimony oxide, and mixtures thereof. Such fillers characteristically exhibit a thermal conductivity of about 25-50 W/m-K. For reasons of economy, an aluminum oxide, i.e., alumina, or zinc oxide may be used, while for reasons of improved thermal conductivity a boron nitride would be considered more preferred, although a combination of one or more oxides and boron nitride may be used as a compromise. Loaded with the thermally-conductive filler, the thermal grease itself typically will exhibit a thermal conductivity, per ASTM D5470, of between about 0.1-5 W/m-K and a thermal impedance, also per ASTM D5470, of less than about 1� C.-in2/W (6� C.-cm2/W). As admixed with the filler, the silicon or other oil component generally forms a binder into which the filler particles are dispersed.
[0043] The dispersed component forming the domains 34 is phase or state changing in being selected to be form-stable at normal room temperature, i.e., about 25� C., in a solid, semi-solid, glassy, or crystalline first phase or state, but as substantially conformable at an elevated temperature or temperature range in a liquid, semi-liquid, or otherwise viscous second phase or state. The phase transition temperature of the dispersed phase component, which may be its melting temperature from a form stable first phase to a flowable second phase, is preferably between about 40-80� C., and may be tailored to fall within the operating temperature of most electronic components.
[0044] The dispersed phase component forming the domains 34 may be resin or other polymeric-based PCM, but for optimal thermal performance is provided to be a fusible, i.e., low melting point, metal or metal alloy of the type which is commonly used as solders and thermal links or fuses. Particularly, the dispersed phase may be one or more of such fusible metals, one or more of such fusible metal alloys, or a mixture or other combination of one or more fusible metals and one or more fusible metal alloys. Such metals and alloys typically have melting points, or melting ranges such as from a solidus temperature to a liquidus temperature, of between about 50-260� C. (124-500� F.), and usually contain one or more of bismuth, lead, tin, cadmium, and indium, but also may one or more other metals such as silver, zinc, copper, and antimony. Often, a eutectic alloy is formulated of a mixture of such metals, such eutectic having a definite melting point which may be lower in than that of each of the constituents of the mixture.
[0045] Representative fusible metals and metal alloys for the dispersed phase component include ASTM Alloy 117 and, particularly, lead and cadmium-free alloys of bismuth, tin, and indium having a melting point of about 141� F. (61� C.). A particularly preferred alloy having a melting point of 141� F. (61� C.) is a eutectic of 32.5% bismuth, 16.5% tin, and 50% indium.
[0046] The fusible metals and metal alloys are included within the thermal grease or other polymeric constituent in a proportion sufficient to provide the thermal conductivity desired for the intended application, and generally will be loaded at between about 5-25% by total weight of the thermally-conductive compound, i.e., the thermal grease, including any admixed thermally conductive filler and other additives, and the metal or metal alloy. As shown in FIG. 3, within the continuous phase of the thermal grease 32, the fusible metals and/or metal alloys form the discrete domains 34 which are co-dispersed with the filler component 40 of the grease. Typically, the domains 34 will have a diametric or other extent, referenced at "d" in FIG. 3, of between about 0.4-3 mils (10-75 μm) and, depend upon the degree of dispersion within the matrix 32, such domains 34 may form agglomerations having an extent, referenced at "D," of up to about 3 mils (75 μm) or more. As used herein, the term "discrete domains" should be understood to refer to either such domains individually or to the agglomerations thereof.
[0047] Following the heating of the layer 20 to a temperature which is above the phase transition temperature of the fusible metal or alloy, the domains 34 may form an emulsion with the matrix phase 32. Advantageously, however, by virtue of the thermal grease matrix, the viscosity (absolute or intrinsic) of the emulsified compound may be maintained to be, for example, between about 10,000-300,000 cp (10-300 Pa-s) within the operating temperature range of the electronic component involved, or otherwise between about 40-80� C., such that the emulsion is sufficiently viscous to remain in the bondline. Moreover, it has been observed that the addition of alumina, boron nitride, or other thermally-conductive filler particles to the formulation, although not necessarily required, provides optimal thermal performance in that the filler particles 40 may function as a thermal bridge between the domains 34 of the dispersed phase component giving the apparent effect of domain to domain contact along a thermal path or network. Such filler particles also can be used to modify the viscosity, and hence to control the flow, of the compound.
[0048] Returning to FIGS. 1 and 2, in the production of commercial quantities of pad 10, the thermally-conductive compound of layer 20 may be compounded as an admixture of the thermal grease, as may be filled with thermally-conductive particulate fillers, and the dispersed phase component under conditions of high shear in a roll mill or other mixer. In the case of the dispersed phase component being incorporated as one or more fusible metals and/or metal alloys, the metals and alloys may be introduced in the form of a bar, rod, ingot, pellet, powder, or the like, and admixed with the thermal grease under conditions of elevated temperature which exceed at least the phase transition temperature of the metals and alloys. In the case of a powder, the fusible metal in whatever form provided, first may be milled or otherwise ground or comminuted to effect a powder having a desired particle size or distribution, which powder then may be incorporated into the thermal grease component at either elevated or ambient temperatures.
[0049] After compounding, the admixture may be thinned with a solvent or other diluent. Thereafter, a layer 20 of the compound may be coated on a release liner or other carrier strip or sheet, such as the liner referenced at 42 in FIGS. 1 and 2, in a conventional manner such as by, for example, spraying, knife coating, roller coating, casting, drum coating, dipping, dispensing, extrusion, screen printing, or other direct process, or by a transfer or other indirect process. After coating, the resultant layer 20 may be dried to flash the solvent to develop an adherent film, coating, or other residue of the layer 20 on the release liner 42. As a result of the inherent tack of the thermal grease or the flow thereof, an adhesive and/or mechanical bond may be developed between the layer 20 and the liner 42.
[0050] Although not required, a carrier or reinforcement member, referenced at 43 in FIG. 2, optionally may be incorporated within layer 20 as an interlayer therewithin, as shown, or alternatively on one or both of the surfaces 12 and 14 to provide increased tear resistance. In either arrangement, the member 43 may be formed as having interstices or holes within which the thermally-conductive compound may be impregnated otherwise carried. Particularly, such member 43 may be provided as a film formed of a thermoplastic material such as a polyimide or polyetheretherketone (PEEK), a layer of a woven or non-woven, e.g., needled, fiberglass fabric, cloth, web, or mat, or an aluminum or other metal foil, screen, or expanded mesh. In addition to functioning as a carrier for the compound, the reinforcement also may be used to improve the physical strength of the layer 20 and pad 10 to better facilitate handling at higher ambient temperatures and die cutting into a variety of geometries. The reinforcement member typically will have a thickness of between about 0.5-5 mil (12.5-125 82 m), with a thickness of about 1-2 mils (25-50 μm) being preferred for metal foils.
[0051] With continuing reference to FIGS. 1 and 2, as mentioned, layer 20 may be formed on a release liner 42 which thereupon covers the surface 14 of the layer. For ease of handling and/or as a protective layer for shipping, a second release liner, 44, may be laminated or provided over the other surface 12 of layer 20. Exemplary materials for either or both of the liners 42 and 44 include face stocks or other films of polyolefins, plasticized polyvinyl chloride, polyesters, cellulosics, metal foils, composites, and waxed, siliconized, or other coated paper or plastic having a relatively low surface energy to be removable without appreciable lifting of the layer 20 from the other liner or the substrate to which the layer may be applied. Depending upon the intended application and method of dispensing such as by pick-and-place or other automated dispensing means, kiss-cut pads 10, or continuous lengths of layer 20, may be carried, with or without covering liner 44, on a sheet or tape of liner 42, and supplied in the form of a sheet or roll. Alternatively, individual pads 10 may be die-cut from sheets of liner 42, again with or without liner 44.
[0052] Alternatively, the layer 20 may be formed by coating or other dispensing a substrate other than a liner, such as directly on one of the heat transfer surfaces. In this regard, the viscosity of compound may be controlled or adjusted, such as by means of the filler loading level, the selection of the thermal grease, and/or the addition of solvents or other diluents, to accommodate the equipment or process to be employed for the application involved. For dispensing applications, the compound may charged into individual tubes, cartridges, or containers and stored for later application using, for example, a hand-held applicator gun or syringe, or, alternatively, automated metering and dispensing equipment such as a robotic applicator.
[0053] Looking now to FIG. 4, a mass or "blob," 45, of the compound is shown as being dispensed under an applied pressure, illustrated by the arrow designated "P," onto a primed or unprimed surface, 46, which may be a plastic, metal, or ceramic surface of, for example, a heat sink, cold plate, circuit board, housing part, or electronic component. In this regard, a supply of the compound, referenced at 47, is shown to be charged as a one-part system into a cartridge, tube, or other container, 48, connected in fluid communication, which may be directly as shown or via hose or other conduit connected to a nozzle, 49.
[0054] Under the applied pressure P, which may be manually applied using a gun or syringe, or developed by air or airless metering equipment such as a proportioning cylinder or a pump, a metered amount of the compound may be issued from nozzle 49 and onto the surface 46. As applied, the mass 45 may be substantially self-adherent to the surface 46, such as by surface tension, an inherent tack, or other adhesive force. As with the layer 20, the mass 45 advantageously may be form-stable at normal room temperature such that the part or component to which it is applied may be handled for assembly or otherwise. Alternatively, the mass 45 may be runny or otherwise non-form stable and may be contained on the surface via a dam or other barrier (not shown). The compound forming the mass 45 also may be injected directly into a gap (such as gap 72 shown in FIG. 6) maintained between the surface 46 and an opposing surface (surfaces 80 and 82 in FIG. 6) such as via an opening (referenced at 50 in FIG. 6) provided through one of the surfaces.
[0055] Turning next to FIGS. 5 and 6, the use of pad 10 of FIGS. 1 and 2 (or the mass 45 of FIG. 4) is illustrated in connection with the thermal management assembly referenced generally at 51 in FIG. 5 which includes a thermal dissipation member, 52, having a heat transfer surface, 54, which is disposed in conductive heat transfer adjacency with an opposing heat transfer surface, 56, of a heat-generating analog, digital, or other electronic component, 58, supported on an associated printed circuit board (PCB) or other substrate, 59. For illustrative purposes, thermal dissipation member 52 is shown to be a heat sink which may be of a plate-fin variety having a generally planar base portion, 60, from which extends a plurality of cooling fins, one of which is referenced at 62. Alternatively, thermal dissipation member 52 may be provided as a pin fin or other heat sink, heat exchanger, cold plate, or heat spreader structure, or even a printed circuit board, housing, or chassis. Dissipation member 52 typically will be formed of a ceramic material such as alumina, or a metal material such as aluminum or copper having a heat capacity relative to that of component 58 to be effective is dissipating thermal energy conducted or otherwise transferred therefrom.
[0056] With continuing reference to FIG. 5, electronic component 58 may be an integrated microchip, microprocessor, transistor, or other power semiconductor device, an ohmic or other heat-generating subassembly such as a diode, relay, resistor, transformer, amplifier, diac, or capacitor, or, alternatively, another heat-generating source. Typically, component 58 will have an operating temperature range of from about 60-100� C. For the electrical connection of component 58 to board 59, one or more pair of solder balls, leads, or pins, one pair of which is referenced at 70 a-b, are provided as extending from component 58 into a soldered or other connection with board 59. Leads 70 additionally may support component 58 above board 59 to define a gap, represented at 72, of about 3 mils (75 microns) therebetween. Alternatively, component 58 may be received directly on board 59.
[0057] Returning momentarily to FIGS. 2 and 4, with pad 10 of FIG. 2 removed from the liner 42 to expose the surface 14 of layer 20, pad 10 may be bonded or otherwise attached to the heat transfer surface 54 of the dissipation member 52. In this regard, and as aforementioned, pad 10 may be die or kiss-cut or otherwise sized from a larger sheet or from a roll or other length of tape stock. Typically, the margins of the applied pad 10 will be sized smaller than the area of the surface 54 or other surface to which the pad is applied to accommodate for an increase in the surface area coverage of the pad as the thickness thereof decreases under an applied pressure in the conformable phase of the layer 20. Alternatively, the compound may be dispensed onto the surface as the mass 45 as was described in connection with FIG. 4.
[0058] With the applied pad 10, dissipation member 52 may be packaged and shipped, with the liner 44 covering the other surface 12 of the pad 10, as an integrated unit to an electronics manufacturer, assembler, or other user. The user then simply may remove the liner 44 to expose the surface 12 of layer 20, position the exposed surface 12 on the heat transfer surface 56 of electronic component 58, and, lastly, apply a clip, clamp, screw, or other another means of external pressure (not shown) to dispose the dissipation member 52 in thermal adjacency with the component 58 as is shown in FIG. 6.
[0059] With continuing reference to FIG. 6, within assembly 51, pad 10 provides a low impedance conductive pathway for the transfer of heat from component 58 to dissipation member 52. Such pathway may be employed without or in conjunction with convective air circulation for effecting the cooling of component 58 and ensuring that the operating temperature thereof is maintained below specified limits. Although thermal dissipation member 52 is shown to be a separate heat sink member, board 59 itself may be used for such purpose by alternatively interposing pad 10 within the gap 72 between an upper surface, 80, of the board 59 thereof and an opposing surface, 82, of the electronic component 58.
[0060] As mentioned, the thermally-conductive compound of layer 20 may be formulated to be form-stable at normal room temperature, i.e., about 25� C., in a first phase of the fusible metal and/or metal alloy constituents, which is solid, semi-solid, glassy, or crystalline, but to be substantially conformable in service in a second phase thereof, which second phase may be a liquid, semi-liquid, or otherwise viscous emulsion, between the heat transfer surfaces 54 and 56. More specifically, the phase transition temperature of the fusible metals and/or alloys is preferably between about 40-80� C., and generally is tailored to fall within the operating temperature of electronic component 58.
[0061] Turing now to FIG. 7A, an enlarged view of the region referenced at 90 in FIG. 5 is shown to detail the morphology thereof prior to heating by the energization of electronic component 58. As may be seen, prior to heating, the bondline between the heat transfer surfaces 54 and 56 defines a first MBLT, referenced at t1, which may be substantially filled by the layer 20 of the thermal compound of pad 10 of the present invention. Advantageously, by virtue of the use of the thermal grease component, a relatively thin thickness t1 of about 1 mil (25 μm) or less, and a correspondingly low thermal impedance, may be effected at room temperature and under a relative low given applied pressure, for example, a pressure of about 1 psi (6 kPa) or less.
[0062] With reference next to the depiction at 90' shown in FIG. 7B, upon heating and the resultant phase change of the dispersed domains 34 into their conformable second phases, which phases may form an emulsion with the thermal grease component of the matrix phase 32, an even thinner MBLT, now referenced at t2, between the surfaces 54 and 56 may be achieved. The thickness t2 may be reduced, such as under the continuing application of the given applied external pressure which may be developed from a spring clip or the like, by about 20-50% or more as compared to the thickness t1, with a corresponding increase in the surface area of pad 10 which thereby may flow to substantially fill the margins of the bondline gap between the surfaces 54 and 56, and a correspondingly decreased thermal impedance.
[0063] The Examples to follow, wherein all percentages and proportions are by weight unless otherwise expressly indicated, are illustrative of the practicing of the invention herein involved, but should not be construed in any limiting sense.
[0064] In representatives formulations of the thermally-conductive compound of the present invention were prepared by admixing a fusible metal ASTM Alloy 117 in a boron nitride (BN) and zinc oxide-filled, silicone-oil based thermal grease (DC 340™, Dow Corning Corp., Midland, Mich.) having a reported thermal conductivity of 2.0�10−3 cal/s-cm-� C. Such 117 alloys are specified per ASTM B774 as eutectics having a melting point of 117� F. (47� C.) and comprising between 44.2-45.2% bismuth, 22.1-23.2% lead, 7.8-8.8% tin, 18.6-19.6% indium, and 4.8-5.8% cadmium. The specific low metal alloy ("LMA") used in this Example 1 was a 44.7% bismuth, 22.6% lead, 8.3% tin, 19.1% indium, and 5.3% cadmium powder (AIM47™, AIM, Montreal, Quebec, Canada) having a average particle size of about 0.04-40 mils (1-1000 μm) This alloy was reported as having a an apparent thermal conductivity of about 20 W/m-K.
[0065] Samples of the thermal grease-alloy admixture were compounded at loading levels of 0, 5, 10, 15 and 20% of the alloy filler, with the 0% level being neat DC 340™ thermal grease for purposes of comparison. It was observed upon mixing that the viscosity of the thermal grease, which was believed to be between about 20,000-30,000 cp (20-30 Pa-s), was sufficient to blend easily with the powder of the alloy, and to maintain the powder in suspension after blending.
[0066] The thermal impedances of the samples were determined according to ASTM D5470 under an applied pressure of 50 psi (300 kPa) and at a minimum bondline thickness (MBLT) of less than about 1 mil (25 μm). The results obtained are reported in Table 1 below.
[0067] The data of Table 1 show that that a thermal grease-LMA compound formulated according to the present invention exhibits improved thermal performance over the unfilled grease.
[0068] The thermal performance of a 15% LMA-thermal grease compound formulated as described in connection with Example 1 was further characterized by measuring impedance as a function of pressure at 70� C., 50�, and at 50� C. following a burn-in at 65� C. The measurements were obtained in accordance with ASTM 5470, and are plotted in FIG. 7 as "T851." The results for the neat DC 340™ grease at 70� C. are also plotted in FIG. 7 as "T850." The result show an appreciable drop in impedance as a function of temperature. for the LMA-filled sample versus the neat grease.
[0069] As it is anticipated that certain changes may be made in the present invention without departing from the precepts herein involved, it is intended that all matter contained in the foregoing description shall be interpreted as illustrative and not in a limiting sense. All references including any priority documents cited herein are expressly incorporated by reference.
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What do you think? Give us your opinion. Anonymous comments allowed.
Reply+3#1 - threadz (07/20/2013) [-]
I assume this would be called Pokemon: Gore Edition. The versions would be Guts and Blood
Reply+2#3 to #1 - lecommentingderp (07/20/2013) [-]
Reply-2#66 to #3 - kokkodellrrisch (07/20/2013) [-]
The Wii U can't handle these textures.
Reply+11#5 to #4 - lecommentingderp (07/20/2013) [-]
and seriously, money is not an issue for Nintendo.
#50 to #6 - theavatarspupil (07/20/2013) [-]
You have to imagine the serious money they would make on this game. If this was announce, just imagine the rise in Wii U sales (like the sales now, because of all the rad **** they announced at E3, but tripled), and then everyone buying the game. It would break records...
#51 to #50 - theavatarspupil (07/20/2013) [-]

subset: commoncrawl


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Proposition 122, which advocates tout as a measure that will help Arizonans resist unconstitutional or otherwise overreaching actions by the federal government, has a healthy lead and appears poised to pass.Read More »
Author Archives: Jeremy DudaFeed Subscription
Reagan tops Goddard in secretary of state's race
In a race that many expected to come down to the wire, Republican Sen. Michele Reagan defeated Terry Goddard by a healthy margin in the race for secretary of state, dashing one of the Democrats' best hopes of winning a statewide office for the first time since 2006.Read More »
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Mark Brnovich's supporters in the Republican primary cast him as the best hope of keeping the Attorney General's Office in GOP hands following years of scandal from incumbent Tom Horne. The former prosecutor delivered on that optimism as he defeated Democrat Felecia Rotellini in one of Arizona's most hard-fought statewide contests.Read More »
DuVal concedes as Ducey is elected Arizona's 23rd governor
Doug Ducey won Arizona's first wide-open gubernatorial race in 12 years, cruising to election as the state's 23rd governor.Read More »
Tax credit foes urge caution after Apple factory bankruptcy
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Goddard, Reagan plans about more than dark money
Thanks to the unprecedented millions of dollars in anonymous campaign spending that has poured into Arizona this year, dark money has taken center stage in the election the for Arizona's next secretary of state.Read More »
Candidates play up endorsements, but do they really matter?
From presidents and senators to businessmen and celebrities to mayors and city council members in rural communities, candidates for office can't get enough endorsements and are all too happy to tout that support on the campaign trail.Read More »
Rhetoric vs. reality: Prop. 122 aims to counter federal laws
The grandiose rhetoric of Proposition 122 doesn't match its actual language. The measure seeks to restrict the use of state resources to enforce federal laws deemed unconstitutional. But it appears to authorize lawmakers and voters to do only what can be done already.Read More »
McNeil says allegations in complaint mischaracterized
Former Arizona Department of Administration Director Brian McNeil defended himself from an employee's accusations that preceded his firing, saying the events in her complaint to federal officials were mischaracterized and that he's never discriminated against anyone.Read More »
McNeil firing followed EEOC complaint on racial, gender comments
One day before Gov. Jan Brewer fired Arizona Department of Administration Brian McNeil, the Governor's Office received a complaint filed against him with the Equal Employment Opportunity Commission alleging that he'd created a hostile work environment by making inappropriate comments about an employee's ethnicity and gender.Read More »


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Nungambakkam Hotels, Chennai
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Nungambakkam is a locality in Chennai, India's fourth largest metropolitan city. The area is abounding with multi-national commercial establishments, important government offices, foreign consulates, etc. The place is located a little away from the city center, which is George Town. Nungambakkam is also famous as a cultural centre in the city. Valluvar Kottam is a popular monument dedicated to the classical Tamil poet, saint and philosopher Thiruvalluvar who wrote the Thirukkural over 2000 years ago. Christ the King Church is an architectural marvel. The building is a typical Gothic style structure featuring high vaults, stairway leading to the spire and pointed arches. Its spire reaches to an incredible height of 157 feet from the ground. The stained glass windows of the church create an aura of spirituality around the church. The Doveton House is a classic example of European architecture here. The house was built by a renowned architect named Benjamin Roebeck. It was primarily built for European officers. The arched staircase at the back of the house resembles a crescent moon in shape. At present, it is the administrative quarters of the Women's Christian College. There is a number of sprawling malls and restaurants where you can spend quality time. To book hotels in Nungmbakkam, Chennai you can go to MakeMyTrip.Com and also avail benefits. Chennai hotels provide excellent accommodation facilities to tourists.
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text:
Will the West Stop Iran Before It's Too Late?
Cross-posted at UNCOVERAGE.net
Saturday: State Dept. denies that Iran is building missile bases in Venezuela.
Sunday: Qiyam 1 missile in mass-production.
The temperature has just increased by several degrees in the Iranian hostility toward the U.S. yet there is no national discussion of it. There are many fast-moving Iranian developments, all of which involve a looming crisis for Israel, the U.S., and the West.
Iran's heavy hand, along with the Muslim Brotherhood, has been guiding much of the so-called "Arab Spring" unrest. Iran and Syria's involvements in missile bases in Venezuela, reported the past week, may be setting up an eventual "Cuban missile crisis" scenario in South America.
For now, a third aircraft carrier group is setting up in the Mediterranean region:
[hat tip: Tyler Durden, Zero Hedge via Stratfor]
"According to the latest Naval update, not only are there now two aircraft carriers situated at the Straits of Hormuz, but a third one, CVN 77 G.H.W. Bush, is under way on a deployment to the 5th and 6th fleet AORs."
Increased tensions within Iran, 30 "spies for U.S." rounded up
There are many reasons why a "heightened" presence is necessary:
Within the past week, Die Welt newspaper of Germany reported in great detail that Venezuelan president Hugo Chavez has given Iran permission to begin building missile launch pads in far north Peninsula de Paraguana in Venezuela. [see also Venezuelan Analysis]
Update: Sunday: Iran announces mass-production of Qiyam 1 "finless" missile, claiming it has 186 mile range.
Update: Saturday: The U.S. state department says such construction, if true, could inspire a military "crisis" in the region. Indeed. The U.S. and Venezuela has just DENIED reports of any Venezuelan/Iranian agreement to build missile silos in South America.
It has been known for a few years that undocumented flights have been ferrying missile materials and personnel between Caracas, Damascus and Tehran, yet nothing has been done to stop them. Israel has recently seized Iranian weapons and supplies from a ship bound for Syria.
Jed Babbin connected the dots in December, describing the byzantine relationships in South America which may soon cause a crisis for Israel.
There has been an odd rift in the past month between Iranian president Mahmoud Ahmadinejad and Islamic ruling cleric Ayatollah Khomeini. The latest indicator: Ahmadinejad did not give the "official" reaction to President Obama's speech on Israel/Palestinian borders, the nuclear energy negotiator did. Last week, president Ahmadinejad was publicly remonstrated by the regime for "unlawfully" attempting to represent Iran in OPEC oil cartel meetings.
Today, Iran announced 30 "spies for the United States" have been arrested. Espionage can carry a death penalty.
In a statement released on Saturday, the Intelligence Ministry said it could disband a "complex sabotage and espionage network affiliated to the US spy agency (CIA) following a series of extensive intelligence and counter-espionage measures and operations inside and outside Iran".
The statement further pointed out that senior CIA agents had created a number of nodes for this network in different world countries, and said these centers "which worked in disguise deceived Iranian citizens under different pretexts like job associations and educational centers to collect information and intelligence on Iran".
"The network used a wide range of data bases and US embassies and consulates in several countries, specially in the UAE, Malaysia and Turkey, to collect information on Iran's scientific, research and academic centers in areas of nuclear energy, air and defense industries and biotechnology," the Iranian Intelligence Ministry said.
The statement further pointed out that the US spy network also collected information on Iran's oil and gas pipelines, power and telecommunication grids, airports, customs departments, network security and banks for future sabotage operations.
"The skillful and faithful forces of the Intelligence Ministry have arrested a number of 30 American spies in their strong confrontation with the CIA agents," the statement said
The Intelligence Ministry also stated that it has succeeded in feeding misinformation to the CIA through a number of double-agents.
"Hence, not only was the CIA's heavy aggressive operation defused, but a number of 42 CIA field officers and operatives in different countries were identified by the Iranian Intelligence Ministry," it added.
Al Arabiya's account of the arrests leaves a nagging question: Did WikiLeaks "out" these operatives?
"Spying in Iran usually carries the death penalty, often implemented without a full trial.
Washington has had no diplomatic presence in Iran since the 1979 theocratic revolution that deposed the US-backed Shah Mohammed Reza Pahlavi, and was followed by the occupation of the US embassy for 444 days.
Diplomatic cables published by the WikiLeaks Website showed the United States operated information-gathering desks on Iran in neighboring countries where diplomats would seek to glean intelligence from travelling Iranians."
All this occurs as 9/11 families in New York are making new blockbuster allegations. They have filed evidence under seal that claims Iran was involved in the planning of the 9/11 attacks. [read also at NY TIMES]
"There is 'clear and convincing' evidence for damages and a federal judge should find Iran culpable in the terror attacks, according to papers filed in Manhattan, New York.
Three defectors from Iran's intelligence service testified they worked in positions giving them access to sensitive information about Iran's state sponsorship of terrorism, the lawyers said.
The testimony supports a claim that Iranian officials had advanced word of the attacks and that Iran helped train those who carried it out, they allege.
Iran has not responded to the lawsuit – first filed in Washington D.C. and transferred to New York.
The Shiite regime in Iran and Sunni group Al Qaeda are natural enemies, though they have had a relationship of convenience based on their shared hatred of the U.S.
The lawyers said Iran and 'its proxy terrorist organization', the Lebanese group Hezbollah, entered into a terrorist alliance with Al Qaeda in the early 1990s.
This continued throughout the preparations for the 2001 attacks, they allege.
They said Iran and Hezbollah gave material support to Al Qaeda after the attacks by helping some of the terrorist group's leaders and their families escape from the U.S.-led invasion of Afghanistan.
The lawyers are filing videotaped testimony under seal which show three defectors from Iran's intelligence service 'circumstantially and directly' implicate Iran and Hezbollah in 9/11.
Iran and Hezbollah had 'foreknowledge of, and complicity in, the overall design of, and preparations for, the 9/11 attacks, involving, but not limited to, facilitation of the hijackers' international travel, training and through Iran provision of safe haven for Al Qaeda after the attacks,' the lawyers wrote.
They said the unidentified witnesses also provided testimony revealing that then-senior Hezbollah operative Imad Mughniyah had an integral role in the Iran-Hezbollah-Al Qaeda terror alliance.
One of the witnesses testified that Iran anticipated a retaliatory strike against Iran if its role in the 9/11 attacks was discovered. Mughniyah died in a car bombing in 2008.
The lawyers said it was necessary to file the testimony under seal because the witnesses have reason to fear for the safety of themselves and their families if the testimony became public."
This is a summary from a few days ago of US/Iranian tensions:
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The Boy Scouts of America enact a measure to allow gay men into the neckerchief-based organization, and a former NFL player assaults his ex-boyfriend.
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(Dan Rosenstrauch/Bay Area News Group)
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Are you a family oriented woman who enjoys a fine balance of excitement and relaxation in her life? If so we should talk! I'm an honest, down-to-earth guy who's not afraid to jump from a plane or just sit quietly by a campfire enjoying the company I'm in. Hopefully that company will soon be my soul mate. Family is a top priority for me. Raising my stepson as my own came naturally to me and he continues to live with me while in school. I love being a father and hope to have my own kids some day as well. I'd love to take them (and you) hiking or out for a delicious dinner. The outdoors is always a relaxing place for me, but I'm not opposed to something more adventurous, like racing motorcycles or going to the shooting range. Really, I'm open to many different things as long as I have someone great to share it all with. The woman for me is honest, loyal and hardworking (like me). She has a big heart and genuine soul, which I can see right through her beautiful eyes. If you like a bit of excitement, but are also completely content with life's simple pleasures, send me a note. I look forward to learning more about you!
Camping , Coffee and conversation , Dining out , Movies/Videos , Exploring new areas , Nightclubs/Dancing , Playing cards , Watching sports
Auto racing / Motorcross, Billiards / Pool, Cycling, Football, Martial arts, Swimming, Walking / Hiking, Weights / Machines
I exercise 5 or more times per week.
I have Cats, Dogs
My Cairn Terrier's name is Bella and Aries is my orange tabby cat.
Locally I love Red Koi, Yuphas Thai Kitchen & Carrabas. My travels, however have taken me to Puerto Rico, St. Thomas, St. Croix & Mexico…I prefer the warmer climates!
Hiking, camping and enjoying the outdoors. Catching ASU football games. Target shooting & fixing just about anything. Spending time with friends & family.
Z{{Cta}} {{#if HasMoreInfo}} ?{{CtaSecondary}} {{/if}}
|What he is looking for
|6'2" (187cms)
|5'6" (167cms) to 5'11" (180cms)
|Body type:
|Athletic and toned
|Slender, About average, Athletic and toned
|No preference
|Dark brown
|No preference
|I'll tell you later
|No preference
|Social Drinker
|Social Drinker, Moderately
|Financial / Accounting / Real Estate
|No preference
I've worked in the mortgage business for 11 years now.
|I'll tell you later
|No preference
|Never Married, Currently Separated, Divorced
|Have kids:
|Yes, and they live at home (1)
|No preference
|Wants kids:
|Not sure
|Definitely, Someday
|White / Caucasian
|Asian, Latino / Hispanic, Pacific Islander, White / Caucasian
Born in Puerto Rico, I'm of Spanish & Italian background.
|No preference
I'm not overly religious, but I'm open to dating within any faith.
|Some college
|No preference


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The Message audio Bible is now available on Bible Gateway! Click to learn more.
2:2–35 The first group listed is the laity. The list is in two parts: part one (vv. 3–20) gives the family names of the returnees, and part two (vv. 21–35) lists their towns. The laity are mentioned ahead of the clergy, in keeping with the emphasis in Ezra and Nehemiah on the significance of the common people in rebuilding the kingdom (2:1–70 note).


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1,001 MORE Things You Always Wanted to Know About the Bible - eBook
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The Bible has inflamed the hearts of poets and martyrs, spawned revolutions and reformations, and influenced cultures and personal lives in sometimes small, sometimes dramatic ways. With a teacher's wit and knowledge, bestsellling author J. Stephen Lang again turns to the Bible and navigates more of its immense treasures in his easily accessible and informative style in 1,001 More Things You Always Wanted to Know About the Bible.
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Norment won't discuss lobbyist relationship
Story | Apr 3, 2015 | 3:21 PM
Norment won't discuss lobbyist relationship
Story | Apr 3, 2015 | 3:21 PM
Lawmakers make 10th Amendment, token gift arguments in McDonnell case
Story | Mar 11, 2015 | 5:52 AM
Among the ten friend-of-the-court briefs Gov. Bob McDonnell's legal team filed Monday is one from nearly 40 current and former members of the House and Senate. They're almost exclusively Republican. Much of Virginia Beach is represented, as are the...
Va. budget deal done
Story | Feb 24, 2015 | 3:15 PM
RICHMOND – State lawmakers are set to sign off on a state budget that includes employee raises and none of the controversy that extended last year's budget battle into months of legislative limbo. This budget again strips Gov. Terry McAuliffe's...
Dominion sees good policy, critics a power grab
Story | Feb 12, 2015 | 7:24 AM
Virginia's largest electric utility says a bill sailing through the General Assembly would keep rates consistent over the next several years, protecting customers from the potential for higher bills as power producers face stricter environmental rules....


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Restaurants in Toronto
For a fusion style meal, visit the Sen5es restaurant on Wellington Street. This Toronto restaurant is one-part café and one-part modern dining room, serving up sophisticated lunches and dinners. Wayne Gretzky's restaurant is Canadian through and through, named after the legendary hockey star. While the food is excellent, most people trek to this Toronto restaurant for the hockey memorabilia covering every wall.
If you want to purchase some groceries and do your own cooking, then visit St. Lawrence or Kensington Market, two large food bazaars, that in addition to farmer's markets, host restaurants, galleries, delis, bakeries, and grocery markets. You can also purchase a pre-made meal from places like Quik Sushi and Everyday Gourmet.
Caffé Ritazza is the place to get your tea fix. This Toronto café is located in the airport and serves foods like Panini and imported coffee and tea. Union, Toronto has a French influence and, on Sunday nights, the menu is geared more towards French cuisine. It is one of the best restaurants in Toronto. Toronto restaurants provide food from around the world from Thai to Canadian fare. The best part is that restaurants in Toronto offer many outstanding deals.
The renovated luxury restaurant incorporates a dimly lit wine cellar with exposed beams, a casual café, fine dining area, chic bar, and lounge space, as well as an events room for private bookings.
From his humble beginnings in a Hong Kong hotel kitchen, chef Susur Lee now brings his internationally-known talents to LEE restaurant in the King West neighborhood. Inside, the restaurant boasts bright red walls, candle lit tables, and floor-to-ceiling windows.
A mecca for well-to-do Canadian socialites and international celebrities, gold rims nearly everything at One Restaurant in Yorkville, bill included.
Located on an up-and-coming street in the heart of West Queen West, Union, Toronto serves up culinary Canadiana in a Parisian-bistro-inspired locavore restaurant.
This restaurant shares a name—and an aesthetic—with Toronto's streetcars. Handrails line the dark-red booths, track marks decorate the floor, and the tables all have "windows" (actually large color photos) over the city's areas of interest.
c5 Restaurant Lounge is located on the top floor of the Royal Ontario Museum's Michael Lee-Chin Crystal wing, a 175,000 square-foot structure designed by Daniel Libeskind and composed of five interlocking prisms that render light in a cinematic style.
The oyster saloon outpost of Rodney Clark's two-restaurant bivalve empire sits on a quiet street close to the Bay Street financial district. Clark's maritime background — he's a native of Prince Edward Island, home to some of the world's best oyster beds — has made him quite knowledgeable.
Located in the super-trendy King West neighborhood, Blowfish occupies a former red brick Bank of Toronto building (which explains the high ceilings). The long, narrow space's minimalist design incorporates cool, red and blue LEDs, and limited seating is available at the sleek bar.
Located in the historic Queen West area of Toronto, Czehoski restaurant and lounge is housed inside a 19th century building with a faded wooden sign out front dating back to 1924 — but don't be fooled by the stark exterior.
After debuting in 2008, Lucien wasted little collecting accolades, earning "Best New Restaurant" by Toronto Life and getting mentioned in Food & Wine.
Lai Wah Heen, which translates to "luxurious meeting place," serves an upscale dim sum menu that's often lauded as the best in Toronto.
A nod to "the Beach," a hippie-turned-yuppie Toronto nabe on the shores of Lake Ontario, this café has a wide-ranging menu—think spicy Thai soup, curried chicken tikka masala, and expertly muddled mojitos.


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Export Credit Agencies:
Movement Toward Common Environmental Guidelines, but National Differences Remain
GAO-03-1093: Published: Sep 10, 2003. Publicly Released: Sep 10, 2003.
Additional Materials:
- Highlights Page:
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Export credit agencies (ECA) are responsible for providing billions of dollars worth of support for large-scale industrial projects annually, but until recently most ECAs did not formally review the environmental impacts of these projects. The United States, whose Export-Import Bank began using environmental guidelines in 1995, pushed for negotiations on common ECA environmental guidelines at the Organization for Economic Cooperation and Development (OECD). The OECD negotiations halted in 2001 because the United States believed that the results, called the Common Approaches, were insufficient. The remaining OECD members then pledged to voluntarily implement the Common Approaches. In response to congressional interest in ECA environmental guidelines, GAO assessed (1) the level of convergence among OECD members and the prospects for further advancement and (2) what impacts such guidelines may have on U.S. exports.
Since OECD negotiations began, members have made progress in developing environmental guidelines for their ECAs and are moving toward common environmental review practices. However, important differences remain. Having agreed to voluntarily implement the Common Approaches beginning in 2002, many OECD members adopted similar basic procedures for reviewing sensitive projects. However, OECD members' guidelines and practices differ in areas where the United States believes it has among the more advanced policies, including which technical standards ECAs use to review projects and the extent to which environmental impact information is publicly disclosed. Although OECD members are considering revising the Common Approaches in 2003, the United States is unlikely to achieve all of its original negotiating objectives because of the desire by some OECD members to gain more experience with the guidelines before renegotiating them and the reluctance of other members to take any steps that might be perceived as having a negative effect on the competitiveness of their exporters. There is limited evidence that the Export-Import Bank's environmental guidelines have affected U.S. exports, although the complexity of potential effects and the lack of information make identifying and quantifying impacts difficult. The evidence GAO reviewed indicates that impacts are likely to be concentrated in the energy sector. Most Export-Import Bank transactions do not require an environmental review because they are either short-term transactions, are in certain excluded sectors, or are not considered environmentally sensitive. Finally, while some businesses are more concerned about the impacts of environmental guidelines than others, their specific concerns are largely anecdotal and difficult to confirm.
Jun 24, 2015
Renewable Energy:BLM Has Limited Assurance That Wind and Solar Projects Are Adequately BondedGAO-15-699T: Published: Jun 24, 2015. Publicly Released: Jun 24, 2015.
Jun 9, 2015
Missouri River Basin:Agencies' Progress Improving Water Monitoring Is LimitedGAO-15-558R: Published: Jun 9, 2015. Publicly Released: Jun 9, 2015.
Jun 4, 2015
EPA's Science Advisory Board:Improved Procedures Needed to Process Congressional Requests for Scientific AdviceGAO-15-500: Published: Jun 4, 2015. Publicly Released: Jun 4, 2015.
May 20, 2015
EPA Science Advisory Panels:Preliminary Observations on the Processes for Providing Scientific AdviceGAO-15-636T: Published: May 20, 2015. Publicly Released: May 20, 2015.
May 11, 2015
Forest Restoration:Adjusting Agencies' Information-Sharing Strategies Could Benefit Landscape-Scale ProjectsGAO-15-398: Published: Apr 9, 2015. Publicly Released: May 11, 2015.
May 7, 2015
Hanford Waste Treatment:DOE Needs to Evaluate Alternatives to Recently Proposed Projects and Address Technical and Management ChallengesGAO-15-354: Published: May 7, 2015. Publicly Released: May 7, 2015.
May 6, 2015
Oil and Gas Resources:Interior's Production Verification Efforts and Royalty Data Have Improved, but Further Actions NeededGAO-15-39: Published: Apr 7, 2015. Publicly Released: May 6, 2015.
Apr 16, 2015
Bureau of Land Management:More Information Needed to Implement the Helium Stewardship Act of 2013GAO-15-394: Published: Apr 16, 2015. Publicly Released: Apr 16, 2015.
Mar 23, 2015
Nuclear Waste:DOE Needs to Improve Cost Estimates for Transuranic Waste Projects at Los AlamosGAO-15-182: Published: Feb 18, 2015. Publicly Released: Mar 23, 2015.
Mar 4, 2015
Indian Irrigation Projects:Deferred Maintenance and Financial Sustainability Issues Remain UnresolvedGAO-15-453T: Published: Mar 4, 2015. Publicly Released: Mar 4, 2015.
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text:
Man Claims His Flatulence Sounds Like a Symphony [AUDIO]
Excuse me while my inner child comes out and plays for awhile. I have always said that the day I don't find fart sounds funny is the day I die. Today I am very alive and well because this cracked me up big time.


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Rev. Irene Monroe: To a nationwide community of same-gender loving (SGL), bisexual, transgender and progressive heterosexual African American men, Manago is the MAN!, seen as a visionary, game changer and "social architect."
Progressive Media Advocates
Treva Brandon Scharf: Confident people don't bash themselves; they don't let negative thinking and self-loathing screw up a good workout or undermine their progress.
Edward Wasserman: The larger question, to me, was less why she did what she did, but why everybody seemed to care so much, and why her case provoked so much anger.
ack in the late 1970s, my husband and I had recently married and purchased our first (and only) home. It was at that time that Howard Jarvis introduced a California statewide initiative (which was voted on and eventually became a State Constitutional Amendment). Its goal, among other things, was to limit the amount of property […]


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Kuehn is a 2003 graduate of Perryville High School, and expects to complete her EMT-B in 2005. She is employed at Independence Square and Court.
Triller is a 2003 graduate of Perryville High School. He is employed by Kurre Construction.
A June 25 wedding is planned at First Baptist Church.


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just On Call - SABMiller innovations will fill Europe's profits hole - COO
SABMiller is using innovation to drive Europe volumes in the hope that higher margin products can reverse declining profits from the region, the company has revealed.
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Sometimes, it feels as if we are eavesdropping on day-to-day conversations rather than just hearing the usual litany of platitudes and regrets.
Sometimes, it feels as if we are eavesdropping on day-to-day conversations rather than just hearing the usual litany of platitudes and regrets.
"Stray Dog" largely succeeds because Granik's technique complements her subject. Both he and the film are modest in their goals and cherish the value of…
"The Ballad of Narayama" is a Japanese film of great beauty and elegant artifice, telling a story of startling cruelty. What a space it opens…
Patrice Leconte's "Monsieur Hire" is a tragedy about loneliness and erotomania, told about two solitary people who have nothing else in common. It involves a…
Nick Allen picks one of his favorite Roger reviews.
An excerpt of Tony Fitzpatrick's column, "Dime Stories," which has its first published compilation in stores this month.
Nick Allen picks one of his favorite Roger reviews.
An excerpt of Tony Fitzpatrick's column, "Dime Stories," which has its first published compilation in stores this month.
A review of Han Gong-ju from a Far Flung Correspondent.
An FFC responds to Kyle Smith's assertion that women can't enjoy GoodFellas.
America takes on Trump; "St. Elmo's Fire" turns 30; Music in Sofia Coppola's films; Chat with "Vampire Diaries" DP Darren Ganet; R.I.P. Brian Clark.
The table of contents for RogerEbert.com's complete coverage of AFI Docs 2015.
I'm going to try to review Bill Maher's "Religulous" without getting into religion. Is that OK with everybody? Good. I don't want to fan the flames of a holy war. The movie is about organized religions: Judaism, Christianity, Islam, Mormonism, TV evangelism and even Scientology, with detours into pagan cults and ancient Egypt. Bill Maher, host, writer and debater, believes they are all crazy. He fears they could lead us prayerfully into mutual nuclear doom. He doesn't get around to Hinduism or Buddhism, but he probably doesn't approve of them, either.
This review is going to depend on one of my own deeply held beliefs: It's not what the movie is about, it's how it's about it. This movie is about Bill Maher's opinion of religion. He's very smart, quick and funny, and I found the movie entertaining, although sometimes he's a little mean to his targets. He visits holy places in Italy, Israel, Great Britain, Florida, Missouri and Utah, and talks with adherents of the religions he finds there, and others.
Or maybe "talks with" is not quite the right phrase. It's more that he lines them up and shoots them down. He interrupts, talks over, slaps on subtitles, edits in movie and TV clips, and doesn't play fair. Reader, I took a guilty pleasure in his misbehavior. The people he interviews are astonishingly forbearing, even most of the truckers in a chapel at a truck stop. I expected somebody to take a swing at Maher, but nobody did, although one trucker walked out on him. Elsewhere in the film, Maher walks out on a rabbi who approvingly attended a Holocaust denial conference in Iran.
Maher had a Jewish mother and a Catholic father, and was raised as a Catholic until he was 13, when his father stopped attending services. He speaks with his elderly mother, who tells him, "I don't know why he did that. We never discussed it." He asks her what the family believed, before and after that event. "I don't know what we believed," she says. No, she's not confused. She just doesn't know.
Most everybody else in the film knows what they believe. If they don't, Maher does. He impersonates a Scientologist at the Speakers' Corner in London's Hyde Park, and says Scientology teaches that there was a race of Thetans several trillion years old (older than the universe, which is only 13.73 billion years) and that we are born with Thetans inside us, which can be detected by an E-Meter, on sale at your local Scientology center, and driven out by "auditing," which takes a long time and unfortunately costs money.
Many of Maher's confrontations involve logical questions about holy books. For example, did Jonah really live for three days in the belly of a large fish? There are people who believe it. Is the End of Days at hand? A U.S. senator says he thinks so. Will the Rapture occur in our lifetimes? Widespread agreement. Mormons believe Missouri will be the paradise ("Branson, I hope," says Maher). There are even some people who believe Alaska has been chosen as a refuge for the Saved After Armageddon. In Kentucky, Maher visits the Creation Museum, which features a diorama of human children playing at the feet of dinosaurs.
His two most delightful guests, oddly enough, are priests stationed in the Vatican. Between them, they cheerfully dismiss wide swaths of what are widely thought to be Catholic teachings, including the existence of Hell. One of these priests almost dissolves in laughter as he mentions various beliefs that I, as a child, solemnly absorbed in Catholic schools. The other observes that when Italians were polled to discover who was the first person they would pray to in a crisis, Jesus placed sixth.
Maher meets two representations of Jesus. One is an actor at the Holy Land Experience theme park in Orlando. He stars in a re-enactment of the Passion, complete with crown of thorns, wounds, a crucifix, and Roman soldiers with whips. I suppose I understand why Florida tourists would take snapshots of this ordeal, but when Jesus stumbles, falls and is whipped by soldiers, I was a little puzzled why they applauded. The other Jesus, Jose Luis de Jesus Miranda, believes he actually is the Second Coming -- i.e., Jesus made flesh in our time. He explains how the bloodline traveled from the Holy Land through France to Spain to Puerto Rico. He has 100,000 followers.
Why have I focused on the Christians? Maher also has interesting debates with Muslims about whether the Koran calls for the death of infidels. And he interviews an Israeli manufacturer who invents devices to sidestep the bans on Sabbath activity. Since the laws prohibit you from operating machines, for example, they've invented a "negative telephone." Here's how it works: All the numbers on the touchpad are constantly engaged. All you do is insert little sticks into holes beside the numbers you don't want to work.
I have done my job and described the movie. I report faithfully that I laughed frequently. You may very well hate it, but at least you've been informed. Perhaps you could enjoy the material about other religions, and tune out when yours is being discussed. That's only human nature.
A rebuttal to Joni Edelman's piece on "Inside Out."
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Three films starring Gina Lollobrigida have been released on Blu-ray; Glenn Kenny looks at them and her entire career.
MTV's Scream and CBS's Zoo premiere tonight. One is worth your time. Which one?


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Everything tagged
Latest from The Spokesman-Review
University of Idaho president focuses on safety after shooting spree
Jan. 25, 2015 in City on Page B3 MOSCOW, Idaho – University of Idaho President Chuck Staben understands the concerns parents have surrounding safety when they send their children to college. "I'm a parent so I know it's …
Jim Kershner's this day in history
Jan. 25, 2015 in City on Page B1 From our archives, 100 years ago Dutch Jake Goetz, Spokane's hotel-saloon-gambling entrepreneur, got himself arrested in Moscow for "discharging firearms on Sunday within the city limits." 1
3 killed, 1 injured in Moscow shootings, suspect arrested after high-speed chase
Jan. 10, 2015 in City Three people were killed and another critically injured Saturday when a man shot them in three separate incidents in Moscow. 38
UI student found dead under bridge
Jan. 23, 2013 in City on Page A1 A University of Idaho student froze to death under a bridge after leaving a fraternity party this weekend. Moscow police found the body of Joseph Wiederrick, 18, of Hailey, Idaho, … 10
UI student freezes to death after fraternity party
Jan. 22, 2013 in City A University of Idaho student froze to death under a bridge after leaving a fraternity party this weekend. 27
Police team up to catch suspect
May 17, 2010 in City, Idaho on Page A6 A suspected robber is in jail after Moscow and Pullman police worked together Saturday to apprehend him in connection with a gunpoint holdup earlier in the week.


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Slow Cooker Brisket of Beef
YIELD Makes 10 to 12 servings
|whole well-trimmed beef brisket (about 5 pounds)
|teaspoons minced garlic
|teaspoon black pepper
|large onions, cut into 1/4-inch slices and separated into rings
|bottle (12 ounces) chile sauce
|cups beef broth, dark ale or water
|tablespoons Worcestershire sauce
|tablespoon packed brown sugar
|Red boiling potatoes, carrots, sliced parsnips or turnips (optional)
Slow Cooker Directions
- Place brisket, fat side down, in 4- to 5-quart slow cooker. Spread garlic evenly over brisket; sprinkle with pepper. Arrange onions over brisket. Combine chile sauce, broth, Worcestershire sauce and sugar in medium bowl; pour over brisket and onions. Cover; cook on LOW 8 hours.
- Turn brisket over; stir onions into sauce and spoon over brisket. Add vegetables, if desired. Cover; cook 1 to 2 hours or until fork-tender. Transfer brisket to cutting board. Tent with foil; let stand 10 minutes.*
*At this point, brisket may be covered and refrigerated up to one day before serving. To reheat brisket, cut diagonally into thin slices. Place brisket slices and juice in large skillet. Cover and cook over medium-low heat until heated through.
- Stir juices in slow cooker. Spoon off and discard fat from juices. (Juices may be thinned to desired consistency with water or thickened by simmering, uncovered, in saucepan.) Carve brisket across grain into thin slices. Spoon juices over brisket.
This recipe appears in: Beef
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