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Self Annihilate
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subset: commoncrawl


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A system and method for projecting reliability to manage system functions includes an activity module which determines activity in the system. A reliability module interacts with the activity module to determine a reliability measurement for the module in real-time based upon the activity and measured operational quantities of the system. A management module manages actions of the system based upon the reliability measurement input from the reliability module. This may be to provide corrective action, to reallocate resources, increase reliability of the module, etc.
1. A method for monitoring a module, which includes one of a chip, integrated circuit printed wiring board and software module, based upon projected reliability, comprising the steps of:
dividing a module into regions;
determining a module-wide reliability projection by performing reliability evaluations for module operations based upon measured operating physical characteristics of the module while the module is operating, the reliability projection including a measure of the reliability of the module based on current operating conditions of the module;
determining a reliability projection in each region;
comparing the reliability projection to a threshold to determine if an action is needed; and
in accordance with the comparing step, adjusting operating conditions of the module to modify the reliability projection as feedback for continuing operations in accordance with the threshold.
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11. A program storage device readable by machine, tangibly embodying a program of instructions executable by the machine to perform method steps for monitoring a module, which includes one of a chip, integrated circuit printed wiring board and software module, based upon projected reliability, the method steps comprising:
dividing a module into regions;
determining a module-wide reliability projection by performing reliability evaluations for module operations based upon measured operating physical characteristics of the module while the module is operating, the reliability projection including a measure of the reliability of the module based on current operating conditions of the module;
determining reliability projections in each region;
comparing the reliability projections to a threshold to determine if an action is needed; and
in accordance with the comparing step, adjusting operating conditions of the module to modify the reliability projections as feedback for continuing operations in accordance with the threshold.
12. A method for monitoring a module, which includes one of a chip, integrated circuit printed wiring board and software module, based upon projected reliability, comprising the steps of:
dividing the module into regions;
determining reliability projections in each region by performing reliability evaluations based upon measured operating physical characteristics of the module in each region;
comparing the reliability projection in each region to a threshold to determine if an action is needed; and
in accordance with the comparing step, adjusting operating conditions of the module.
13. The method as recited in
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1. Field of the Invention
The present invention relates to a systematic, method and apparatus for reliability monitoring and, more particularly, to a finite state machine as part of a microprocessor chip and used to control and enhance the reliability and/or the performance of the microprocessor system. The present invention further relates to the ability to capture the manner in which mean time to failure (MTTF) varies as a function of the input workload executing on the microprocessor or microprocessor-based system and using this information in either enhancing reliability or boosting microprocessor performance.
2. Description of the Related Art
Advances in semiconductor (specifically, complementary metal oxide semiconductor (CMOS)) technology have been improving microprocessor performance steadily over the past few decades. However, such advances accelerate the onset of reliability problems. Specifically, one of the consequences of progressive scaling of device and interconnect geometries is the increase in average and peak power densities (and hence temperatures) across the chip.
The inherent increase in static (leakage) power with scaling into the deep sub-micron region, adds to these issues. In addition, the major components of leakage power increase with temperature, making the problem even harder to control. Despite advances in packaging and cooling technologies, it is an established concern, that the average and peak operating temperatures within key units inside a microprocessor chip will be higher with the progressive scaling of technology.
Already, to protect against thermal runaways, microprocessors (e.g., INTEL� Pentium 4™ and IBM� POWER5™) have introduced on-chip temperature monitoring devices, with mechanisms to throttle the processor execution speeds, as needed. The objective is to reduce on-chip power when maximum allowable temperatures are approached or exceeded.
Failure rates of individual components making up an integrated circuit (or a larger system) are fundamentally related to operating temperatures, i.e., these rates increase with temperature. As such, chips or systems designed to operate at a given average temperature range, are expected to fail sooner than specified, if that range is routinely exceeded during normal operating conditions.
Conversely, consider a case where a chip or system is designed to meet a certain mean time to failure (MTTF), at an assumed maximum operating temperature. In this case, the designed chip or system will be expected to have a longer lifetime, if the actual operating temperatures happen to be lower. Thus, it may be possible to "overclock" (or speed up) the processor during phases of the workload when the operating power and temperature values are well below the maximum temperatures assumed during the projection of expected MTTF.
Electromigration and stress migration effects in the chip interconnects are major sources of failures in a chip and, they both have a direct dependence on operating temperature. However, aspects of reliability degradation with CMOS scaling, are not solely due to the power and temperature implications. For example, time-dependent dielectric breakdown (TDDB) is an extremely important failure mechanism in semiconductor devices. With time, the gate dielectric wears down and fails when a conductive path forms in the dielectric.
With CMOS scaling, the dielectric thickness is decreasing to the point where it is only tens of angstroms. Coupled with the fact that there has been a general slowdown in the way the supply voltage is scaling down, the intrinsic failure rate due to dielectric breakdown is expected to increase.
Furthermore, TDDB failure rates also have a very strong temperature dependence. Thermal cycling effects, caused by periodic changes in the chip temperature are another factor that degrades reliability. Again, this factor is not directly related to the average operating temperature; rather, it is a function of the number of thermal cycles that the chip can go through before failure.
Since the power consumed by the chip (or system) varies with the executing workload, it is clear that the actual operating temperature and failure rate of a component (and hence of the system) depend on the workload.
A reliability calculator and monitoring system that can be located on a microprocessor chip is disclosed. During program run or workload execution, it can collect information and estimate chip wide reliability by aggregating together the individual structures'reliability values for the various parts of the microprocessor floorplan.
The prior art lacks disclosure of workload-dependent variability of failure rates and overall MTTF of a microprocessor which is projected or estimated during program run and such transient or average reliability information is used to control the operation of the microprocessor. Currently, no online reliability assessments can be done for a chip after it is shipped. Traditionally, reliability assessments are done only at the back-end technology qualification stage and once a design is qualified no further steps are taken to equip a given released chip from susceptibility to reliability degradation and failures.
With the possible emergence of external hardware system attacks from thermal viruses (e.g. a piece of code written to exhaustively exercise an individual structure like a functional unit on-chip), the reliability of various on-chip structures of a microprocessor core can be stretched beyond their electromigration, gate-oxide breakdown, stress migration, and thermal cycling-tolerable limits, thereby leading to the failure of the chip.
An aspect of the present invention includes the adoption of a step-by-step methodology, based on fundamental formulations in the physics of temperature-sensitive degradation of chip reliability factors, of workload-dependent variation of failure rates and mean time to failure. Another aspect of this invention includes the adoption of a step-by-step methodology, based on fundamental formulations in the physics of CMOS technology scaling and temperature-insensitive degradation of chip reliability factors, of workload- and CMOS generation-dependent variation of failure rates and mean time to failure.
A system and method for projecting reliability to manage system functions includes an activity module which determines activity in the system. A reliability module interacts with the activity module to determine a reliability measurement for the module in real-time based upon the activity and measured operational quantities of the system. A management module manages actions of the system based upon the reliability measurement input from the reliability module. This may be to provide corrective action, to reallocate resources, increase reliability of the module, etc.
The present invention incorporates these methods in a computer module that can be integrated in a microprocessor for deriving the transient and steady-state reliability of a given microprocessor chip and using such information to control the operation of the microprocessor to enhance its overall reliability and/or boost performance.
Another aspect of the present invention is the implementation of variations of the methods in on-chip hardware controls that can be used to manage the microprocessor's power consumption (and performance) in response to changes in the projected reliability metrics of individual units or components, over time and as a function of the input workload.
These and other objects, features and advantages of the present invention will become apparent from the following detailed description of illustrative embodiments thereof, which is to be read in connection with the accompanying drawings.
The invention will be described in detail in the following description of preferred embodiments with reference to the following figures wherein:
The present invention includes systematic methods and devices for putting together a reliability monitoring and reliability enhancing system. The device may be implemented as a finite state machine as part of a microprocessor chip, and the method of use may be implemented to control and enhance the reliability of the microprocessor system.
With one-time only late-stage evaluation capability (which represents current state-of-the-art), microprocessor designs are likely to encounter post-silicon surprises in terms of severely reduced reliabilities that may cause a product to be prematurely withdrawn from the marketplace, for example. The present invention provides a "self-healing" mechanism (preferably, on-chip) that can help detect potential failure behavior and respond with a corrective action. In addition, the apparatus can also be used to raise and improve processor performance in situations where the microprocessor is operating below the temperature/power/reliability that it was designed for.
The present invention also offers the microprocessor designer the opportunity to design without hard and strict temperature guard band limits, hence reducing the cost of design.
In one aspect of the present invention, a microarchitecture-level reliability finite state machine is provided for dynamically estimating on-chip reliability, embodied in the form of either a software or hardware module, that is integrated as part of the microprocessor chip and is used to monitor and enhance the reliability of a microprocessor.
One embodiment either dynamically or a-priori divides the whole on-chip floorplan into a finite number of individual discrete structures or regions. Each individual region or structure potentially covers one or more functional units or other logic or memory structures on-chip. The individual regions or structures are each equipped with on-chip data sensors (for gathering instructions per cycle (IPC)/activity, power, and/or temperature data) that can be probed periodically to ascertain instant (transient or steady-state) respective values of the corresponding individual region or structure on chip.
The device in accordance with the present invention will periodically sample on-chip individual region/structure sensors during workload execution and use these individual regional/structure values in collaboration with other embedded reliability determinants to estimate individual regional/structure and chip-wide reliability on the fly.
The resulting reliability estimate(s) are then checked against original kept microprocessor reliability target(s) to ascertain whether or not an individual unit, region and/or structure on chip or the whole chip is degrading in reliability. If it is determined that the reliability of an individual unit, region or structure on-chip is deteriorating or there is the danger of a chip-wide reliability deterioration, the device may kick off one or more various corrective actions.
On the other hand, if it is determined that the processor is well below and within an earlier set acceptable reliability threshold, the device may apply actions to increase or boost the system performance. Based on the capabilities embedded in the design of the microprocessor, examples of these actions may include a triggering mechanism for chip-wide and/or individual region/structure voltage and/or frequency up and down scaling, job migration from one region to another, a slowdown/reduction in work per an affected region/structure, and/or an increase in the amount of work in a chip region/structure.
One major advantage of using the present invention is the ability to dynamically detect potential reliability problems across a chip that is already installed in the field and react to avert a failure due to reliability degradation. The present invention has the potential to work to counteract, e.g., thermal virus hardware breakdown threats on a chip. Another major advantage includes adjustment of a microprocessor's performance upwards in situations where it is found that the microprocessor is running far below a set reliability threshold.
The present invention provides reliability feedback, based on fundamental formulations in the physics of complementary metal oxide semiconductor (CMOS) technology scaling and temperature-insensitive degradation of chip reliability factors, of workload and CMOS generation-dependent variation of failure rates and mean time to failure, to control chip or system reliability and performance.
Some of the known and researched failure mechanisms responsible for CMOS chip reliability include electromigration, stress migration, gate oxide breakdown and thermal cycling. There are many such mechanisms that affect on-chip reliability that are not discussed here in detail, but all such mechanisms can be incorporated in the reliability estimating tool of the present invention as described herein.
Electromigration occurs, especially in aluminum and copper interconnects due to the mass transport of conductor metal atoms in the interconnects. Conducting electrons transfer some of their momentum to the metal atoms of the interconnect. This "electron wind" driving force creates a net flow of metal atoms in the direction of electron flow. As the atoms migrate, there is depletion of metal atoms in one region and pile up in other regions. The depletion sites can see increased interconnect resistance or open circuits, and extrusions can occur at sites of metal atom pile up. Electromigration has an exponential dependence on temperature.
Extensive research has been performed by the material science and semiconductor community on modeling the effects of electromigration, and it is a well understood failure mechanism.
A model used for electromigration includes:
Much like electromigration, stress migration is a phenomenon where the metal atoms in the interconnects migrate. It is caused by mechanical stress due to differing thermal expansion rates of different materials in a device. A model used for stress migration includes:
Time-dependent dielectric breakdown (TDDB), or gate oxide breakdown, is another failure mechanism in semiconductor devices. The gate dielectric wears down with time, and fails when a conductive path forms in the dielectric. The model used for TDDB includes:
Temperature cycles can cause fatigue failures. Damage accumulates every time there is a cycle in temperature, eventually leading to failure. Although all parts of the device experience fatigue, the effect is most pronounced in the package and die interface (for example, solder joints). The model used for thermal cycling includes:
To obtain the overall reliability of a processor, the effects of the above-mentioned different failure mechanisms and other prominent mechanisms not mentioned here are combined across different structures. This includes knowledge of lifetime distributions of the failure mechanisms, and is generally difficult. One model used in the industry is the sum-of-failure-rates (SOFR) model, which makes two assumptions to address this problem: (1) the processor is a series failure system, in other words, the first instance of any structure failing due to any failure mechanism causes the entire processor to fail; and (2) each individual failure mechanism has a constant failure rate (equivalently, every failure mechanism has an exponential lifetime distribution).
The above two assumptions imply (1) the MTTF of the processor, MTTFp, is the inverse of the total failure rate of the processor, λp; and (2) the failure rate of the processor is the sum of the failure rates of the individual structures due to individual failure mechanisms. Hence,
The individual failure mechanism models can be made to provide failure rates for fixed instantaneous operating conditions even though when an application runs, these parameters all vary with time. This variation may be accounted for by: (1) calculating a failure rate based on instantaneous parameters; and (2) using an average over time of these values to determine the actual failure rate for each structure for each failure mechanism when running the application.
It should be understood that the elements shown in the FIGS. may be implemented in various forms of hardware, software or combinations thereof. Preferably, these elements are implemented in a combination of hardware, firmware and/or software on one or more appropriately programmed general-purpose digital computers or solid-state chips, which may include one or more of a processor, memory and input/output interfaces. A module referred to herein may include a chip, system of chips, integrated circuit, printed circuit board or a computer rendered simulation of a chip. Module and chip may be employed synonymously herein. A module may further include a chip design, printed circuit board or a software module in the context of computer implementations.
Referring now to the drawings in which like numerals represent the same or similar elements and initially to
Data sensors may include fabricated devices formed on the chip, such as transistors, diodes, capacitors, etc. or structures, such as registers, functional units and even additional chips. These devices/structure may be designed to measure parameters such as temperature, voltage, workload, frequency, number of operations, etc. As mentioned, these data sensors are used for collecting various data (power, frequency, activity, temperature, etc.), which are fed into a reliability estimating tool or calculator for the purpose of calculating the same.
One approach is described in commonly assigned U.S. patent application Ser. No. 10/829,741, to P. Bose et al., entitled, "SYSTEM AND METHOD OF WORKLOAD-DEPENDENT RELIABILITY PROJECTION AND MONITORING FOR MICROPROCESSOR CHIPS AND SYSTEMS," filed Apr. 22, 2004 and incorporated herein by reference.
It is further assumed that there are available on the chip, various logic and resources that the system can use in making necessary instant decisions and in taking corrective actions. Some of these decisions may be to either improve reliability on various chip regions/structures or globally if it is noted that reliability is deteriorating, or to boost regional or full chip performance if it seen that the system is running far below a given reliability threshold and more performance can be harnessed without negatively impacting reliability. Some corrective actions may be the ability to adjust up and down the global or regional chip voltage, the ability to adjust up or down global or regional chip frequency, the ability to clock-gate or power-gate a given region or structure on chip, and the ability to move computation (job migration) from one section of the chip to another section. In particular, it may be possible to "overclock" (or speed up) the processor during phases of the workload when the reliability estimates are far lower from the expected chip MTTF.
As depicted in
With the assistance of preset data and thresholds, the system then determines whether there is a chip-wide reliability problem in block 102. If the determination is yes, then a global corrective action is taken in block 103. It is to be noted that a chip-wide reliability problem here can be considered in a plurality of ways. These may include, for example, either the chip-wide reliability is degrading, for which a corrective action should be taken, or the chip-wide reliability is notably too low, below the system's accepted threshold, again for which a performance boost corrective action may be taken.
In the absence of a chip-wide reliability problem, the system checks for individual structure/regional reliability problems in block 104. If it is determined that such problems exist, then individual structure/regional corrective action may be taken in block 105. If no reliability problem is registered in the present cycle or time period, the system takes no action and goes into a waiting mode to restart for the next invocation period in block 106.
Referring to
In an alternate embodiment, mechanism 205 may be used as part of an operating system. For example, instead of having on-chip reliability calculation hardware, the readings from temperature sensors 201, electrical/power sensors 202, frequency sensors 203, other sensors 204 and activity counters CTR 200 may be collated by an operating system where a kernel program can calculate processor reliability and output a projection or metric. Unit weights, Wi, determined or generated in, for example, an unconstrained power profile of the chip in block 207 may be stored on-chip or off-chip in memory 206, e.g., programmable read-only memory and employed to assist in the calculation of reliability projections.
Referring to
The reliability savings accumulator 303 (one such embodiment is illustratively shown in
This embodiment also makes use of a throttle logic facility 302, which provides logic and/or clock control signals 305 to the various functional units or regions/structures on chip. The throttle logic 302 is responsible for applying the necessary corrective action for either improving the microprocessor reliability or boosting microprocessor performance. If it is determined that the reliability of an individual region/structure on-chip is deteriorating or there is the danger of a chip-wide reliability deterioration, a "savings" signal or flag (e.g., '0') is sent to the throttle logic 302 to kick off one or more various local or global corrective actions 305.
If it is determined that the processor (e.g., monitor 301 ) is well below and within an acceptable reliability threshold, the embodiment sends a different "savings" signal (e.g., '1') to the throttle logic 302 to apply actions that increase or boost the system performance, and this can either be local or global 305.
Based on the capabilities embedded in the design of the microprocessor or system, examples of such actions may include voltage and/or frequency up and down scaling, job migration from one region to another, work slowdown/reduction in a region/structure, and an increase in the amount of work in a chip region/structure.
Referring to
Referring to
In an illustrative example, when counter 407 indicates that a count threshold has been exceeded, clock rate selector 403 is notified to maintain the clock rate or adjust the clock rate in accordance with one of the plurality of clock signals. Other actions and conditions for regulating reliability are also contemplated.
In addition, the system scans global threshold and unit or local regions in block 401 to determine if reliability thresholds have been exceeded in each region, unit or other discrete area.
Logic devices such as NOR 402, AND 403, OR 405, and inverter 409 may be replaced by other circuit configurations.
Referring now to
Based on the determination, a signal is sent to throttle logic 530, which based on the signal, can invoke a collection of corrective or performance actions 535 or no action at all. Examples or actions may include performing functions in other areas of a chip, adjusting the clock rate, turning on a cooling system, adjusting power globally or locally, etc.
Having described preferred embodiments of a method and apparatus for monitoring and enhancing on-chip microprocessor reliability (which are intended to be illustrative and not limiting), it is noted that modifications and variations can be made by persons skilled in the art in light of the above teachings. It is therefore to be understood that changes may be made in the particular embodiments of the invention disclosed which are within the scope and spirit of the invention as outlined by the appended claims. Having thus described the invention with the details and particularity required by the patent laws, what is claimed and desired protected by Letters Patent is set forth in the appended claims.
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Review: This place has an enchanting atmosphere, we were greeted by the owner, very nice lady, we were so happy to find this OASIS in the island, AND IT truly was, we juice everyday at home, it was amazing that we could start our day with healthy fresh fruit. We had our juices that were freshly made for us to order and we took to go delicious smoothies for our trip back home, you can spend everyday of your trip here all the food is grown in their own garden and market has lots of great gluten free and natural products, wishing we had an Oasis in San Antonio!!
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M.A. Sonoma State University (Master's)
I am a certified teacher with current licenses in the states of Oregon, California and Montana. My professional teaching experience began the school year of 2007 when I taught Middle School Social Studies, Pre-Algebra & Language Arts at a school in Corvallis Oregon that integrated Science into all subject matter. I then moved to California in the summer of 2008 and began teaching at El Verano School as the Core Replacement teacher until June 2011. There I instructed 4th and 5th grade students who were two or more years behind in Language Arts and/or Mathematics. Both schools that I taught at had a high percentage of English Language Learners. My current education position is that of a mommy to two little ones!
My own personal educational background consists of a BA in Education with an emphasis in mathematics from Western Oregon University, and a MA in Reading and Language Arts from Sonoma State University.
As an educator I take a holistic view on teaching where I highly value the relationships I build with my students. Each person is a unique individual and has a learning style that is all their own. As I get to know my students I develop a better understanding of how they learn and see the world, which enables me to deliver instruction that is specific to their learning style. We live in a world where everything is interconnected, thus I believe that our subject matter should be as well. I strive to constantly relate content back to students personal lives to make connections that will foster comprehension and retention. I am a certified teacher with current licenses in the states of Oregon, California and Montana. My professional teaching experience began the school year of 2007 when I taught Middle School Social Studies, Pre-Algebra &… Read more
Rachel is such a fantastic tutor that I have mixed feelings about posting this review. She's so good that I hesitate to tell others for fear of losing her availability for my son, but she's so lovely that I want to support her. She's everything we want in a tutor: excellent teaching methodology, connects well with my son, keeps it positive, great business acumen (returns messages quickly...) and is fair and honest. The fact that she is a credentialed teacher shows. Her tutoring services are worth top dollar.
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I taught an intervention program for struggling 4th and 5th graders for 3 years. A main aspect of the program was helping students learn effective organizational and study skills.
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Escaping a typhoon, Perseids meteor shower, Paramore on stage
49 of 50
Mostly Palestinians from the West Bank enjoy the Mediterranean Sea on the last day of the Eid-al-Fitr holiday, in Tel Aviv, Israel, Sunday, Aug 11, 2013. The three-day Eid al-Fitr holiday marks the end of the holy fasting month of Ramadan. One of the most important holidays in the Muslim world, Eid al-Fitr, is marked with prayers, family reunions and other festivities. Tens of thousands of Palestinians visit Tel Aviv and other places in Israel after Israel granted travel permits to West Bank Palestinians. (AP Photo/Oded Balilty)
Photo by Oded Balilty
Photo by Oded Balilty
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How the bears and orangutans keep cool at the zoo
Heran and Keema keep cool at the Woodland Park Zoo in Seattle with frozen treats.
U.S. Open at Seattle's South Lake Union
Activities at the Open for All Fan Experience at South Lake Union Park were set up to connect golf fans with the Chambers Bay tournament.
John Kerry visits Seattle
U.S. Secretary of State John Kerry greets employees at the Seattle Passport Agency on May 18. The location is one of 29 domestic passport agencies that the State Department runs. Kerry returned to the United States following a three-day trip to China and South Korea.
Week in photos
Photos from around the world this week.


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YIELD: Makes about 1 quart
In a large bowl lightly whisk yolks. In a 3-quart heavy saucepan cook sugar, fresh gingerroot, and water over moderate heat, stirring occasionally, 5 minutes. Add half-and-half and bring to a simmer. Add hot half-and-half mixture to yolks in a slow stream, whisking, and pour into pan. Cook custard over moderately low heat, stirring constantly, until a thermometer registers 170°F. (Do not let boil.)
Pour custard through a sieve into cleaned bowl and stir in cream and vanilla. Cool custard. Chill custard, its surface covered with plastic wrap, until cold, at least 3 hours, and up to 1 day.
Finely chop crystallized ginger. Freeze custard in an ice-cream maker, adding crystallized ginger three fourths of way through freezing process. Transfer ice cream to an airtight container and put in freezer to harden. Ice cream may be made 1 week ahead.


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Last Updated: June 25, 2015
Last updated: Apr, 2015
Apart from being a critical driver of economic growth, foreign direct investment (FDI) is a major source of non-debt financial resource for the economic development of India. Foreign companies invest in India to take advantage of cheaper wages, special investment privileges like tax exemptions, etc. For a country where foreign investments are being made, it also means achieving technical know-how and generation of employment.
The continuous inflow of FDI in India, which is now allowed across several industries, clearly shows the faith that overseas investors have in the country's economy.
The Indian government's policy regime and a robust business environment have ensured that foreign capital keep flowing into the country. The government has taken many initiatives in recent years such as relaxing FDI norms across sectors such as defense, PSU oil refineries, telecom, power exchanges and stock exchanges, among others.
FDI into India through the approval route shot up 162 per cent to US$ 1.91 billion in the first ten months of the ongoing fiscal year, indicating that government's effort to improve ease of doing business and relaxation in FDI norms may be yielding results.
FDI to India doubled to US$ 4.48 billion in January 2015, the highest inflow in last 29 months, from US$ 2.18 billion in January 2014.
The foreign inflows have grown to touch US$ 25.52 billion during the April-January 2014-15, up 36 per cent year-on-year (y-o-y), from US$ 18.74 billion in the corresponding period last fiscal, according to Department of Industrial Policy and Promotion (DIPP) data. The top 10 sectors receiving FDI include telecommunication which received the maximum FDI worth US$ 2.83 billion in the 10 month period, followed by services (US$ 2.64 billion), automobiles (US$ 2.04 billion), computer software and hardware (US$ 1.30 billion) and pharmaceuticals sector (US$ 1.25 billion).
India received the maximum FDI from Mauritius at US$ 7.66 billion, followed by Singapore (US$ 5.26 billion), the Netherlands (US$ 3.13 billion), Japan (US$ 1.61 billion) and the US (US$ 1.58 billion) during April-January 2014-15 period. Healthy inflow of foreign investments into the country helped India's balance of payments (BoP) situation and stabilised the value of rupee.
Also, deals worth US$ 3.4 billion across 118 transactions were struck in January in India, compared with US$ 1.6 billion across 87 transactions in January last year and US$ 1.2 billion across 74 deals in the same month a year before that, according to a Grant Thornton report on merger and acquisition (M&A) and private equity (PE) activity.
Inbound deals have more than tripled in value, led by the Herman-Symphony transaction worth US$ 780 million and three other deals worth more than US$ 100 million each.
Based on the recommendations of Foreign Investment Promotion Board (FIPB) in its meeting held on February 17, 2015, the Government has approved ten proposals of FDI amounting to Rs. 2,857.83 crore (US$ 452.72 million) approximately.
The Government has amended the FDI policy regarding Construction Development Sector. The amended policy includes easing of area restriction norms, reduction of minimum capitalisation and easy exit from project. Further, in order to give boost to low cost affordable housing, it has been provided that conditions of area restriction and minimum capitalisation will not apply to cases committing 30 per cent of the project cost towards affordable housing.
Relaxation of FDI norms are expected to result in enhanced inflows into the Construction Development sector consequent to easing of sectoral conditions and clarification of terms used in the Policy. It is likely to attract investments in new areas and encourage development of plots for serviced housing given the shortage of land in and around urban agglomerations as well as the high cost of land. The measure is also expected to result in creation of much needed low cost affordable housing in the country and development of smart cities.
The government has also raised FDI cap in insurance to 49 per cent from 26 per cent through a notification issued by the DIPP. The limit is composite in nature as it includes foreign investment in forms of foreign portfolio investment, foreign institutional investment, qualified foreign investment, foreign venture capital investment and non-resident investment.
Also, India's cabinet has cleared a proposal which allows 100 per cent FDI in railway infrastructure, excluding operations. Though the initiative does not allow foreign firms to operate trains, it allows them to do other things such as create the network and supply trains for bullet trains etc.
Foreign investment inflows are expected to increase by more than two times and cross the US$ 60 billion mark in FY15 as foreign investors start gaining confidence in India's new government, as per an industry study. "Riding on huge expectations from the incoming Modi government, global investors are gung ho on the Indian economy which is expected to witness over 100 per cent increase in foreign investment inflows – both FDI and FIIs – to above US$ 60 billion in the current financial year, as against US$ 29 billion during 2013-14," according to the study.
India will require around US $1 trillion in the 12th Five-Year Plan (2012–17), to fund infrastructure growth covering sectors such as highways, ports and airways. This requires support in terms of FDI. The year 2013 saw foreign investment pour into sectors such as automobiles, computer software and hardware, construction development, power, services, and telecommunications, among others.
Exchange Rate Used: INR 1 = US$ 0.0157 as on April 28, 2015
References: Media Reports, Press Releases, Press Information Bureau


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Alice Louise Chapman
May 11, 1947
Lake County
Illinois, USA
Jan. 22, 1965
Charles City
Floyd County
Iowa, USA
Alice Louise Chapman was born May 11, 1947 at Waukegan, Ill. She & her family moved from Des Moines to Charles City in 1963 when her father assumed the pastorship of the First Congregational Church.
She is survived by her parents, The Reverend & Mrs. Leslie W. Chapman & one sister, Mrs. Peter (Ruth) Connel, Cheshire Connecticut.
Cause of death: Accidental carbon monoxide poisoning.
Mason City Globe Gazette - January 25, 1965
Alice Chapman
Charles City - Funeral services for Alice Chapman, 17, were held Monday at the First Congregational Church here. Hauser Funeral Home was in charge of local arrangements. Burial will be in High Plains Cemetery in Oakdale, Mass.
Miss Chapman, the daughter of the Rev. and Mrs. L. W. Chapman, was found dead early Friday in a car parked near the east edge of Charles City. With her was Leander A. Schwickerath, 17, son of Mrs. & Mrs. Norbert Schwickerath. He was taken to the Charles City hospital where he was reported to be suffering from carbon monoxide poisoning. He was released from the hospital Sunday.
Medican Examiner Dr. E. J. Goen said carbon monoxide poisoning cause the death of Miss. Chapman.
High Plains Cemetery
West Boylston
Worcester County
Massachusetts, USA
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Record added: May 11, 2002
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Christopher C.
Added: Aug. 10, 2014
Oh sweet girl, you left this world so young and beautiful! God had greater plans for you. You're now a guardian angel, I'm sure of that! We've all been here on earth before, and will be back again in due time. Until then, Sweet dreams!!!!
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Haircuts for Curly Hair
There's nothing more beautiful than long, lustrous curls. But for women with this hair type, perfect spirals are almost impossible to achieve. Heat and humidity, rain and wind—they're at the mercy of the weather. The climate, literally, dictates how their hair will behave.
MORE: The Best Haircut for Your Face Shape
Mechanics of a Curly Haircut
Because no curls are created equal, the cut is that much more important. Your stylist needs to consider the diameter of the curl, as well as its spring factor—how loose or how tight. The curl pattern and how it fits together is also a critical detail. "There's really no room for error. You have to understand curly hair and strategically plan your cut," notes Ouidad.If the hair is cut blunt, it creates a boxy, almost pyramid-like effect.
If thinned or texturized (a technique used to add dimension) the balance of each wave is thrown off, creating an uneven pattern and increased frizz. Dry cutting is not recommended—the hair should be freshly washed and conditioned before cutting. "You need to work with the natural nature of curl. Curly hair dries differently every time so you need to cut it wet to guarantee a balanced, well-fit cut," says Ouidad.
QUIZ: Measure How Healthy Your Hair Looks
The technique most curly haired specialists use is known as carving and slicing. How it works: hair is cut with the curvature of the curl pattern so the curls fit together like a puzzle, as opposed to stacking. The carving and slicing process removes bulk while enhancing the natural curl pattern, resulting in curls that gracefully cascade and are easier to manage (less friction, less frizz).
Haircuts for Long, Curly Hair
For women with long curly hair, you can go blunt along the bottom (the weight of the hair at this length allows for this), but your stylist should slice the outer layer to create movement and keep the hair from appearing triangular. The perfect example: Nicole Kidman, whose hair falls to one length, with strategically placed shorter pieces to create enviable shape, bounce and flow.
Haircuts for Medium, Curly Hair
Medium length, or hair that sweeps the shoulder when dry, looks best when curls are sliced shorter and at different lengths to create movement and maintain balance among the curls (think Katherine Heigl). One thing to note with all lengths, but particularly medium: never layer. Layering is the process of cutting hair straight across at an even level. Curls need to be cut to fit—each one gently meeting the next.
MORE: The Best Hair Color for Your Skintone
Haircuts for Short, Curly Hair


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Creating a virtual radio station with Last.fm
Last.fm tracks your musical tastes and helps you find users with similar interests.
If your computer is anything like mine, it is probably full of MP3 and OGG Vorbis songs from various sources. Internet radio is a genuine alternative to filling up your hard disk with audio files. But just as with ordinary radio, the songs tend to repeat after a while, and you have to look around for a new station. Last.fm [1] is an alternative to traditional Internet radio players. The Last.fm player is linked to an online database that stores information on your musical interests. When you set up a musical profile, you create a space for Last.fm to store information on the music you like. This information can then be used to create a "personal radio station" based on your listening habits. Last.fm builds a music list tailored to your interests.
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Mate 1.1 Arrives
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Hybrid vehicles save more fuel in India, China than in the U.S.
Though hybrid vehicles use about 40 percent less fuel than conventional cars in the United States, those savings are much higher in India and China, research shows.
According to researchers from Lawrence Berkeley National Laboratory, a driver in India might use 48 percent less fuel, and one in China would use 53 percent to 55 percent less.
That's because of the chaotic driving conditions in major cities in those countries, said Anand Gopal, the lead researcher on the study. Noting that traffic in India is "pretty slow, pretty crazy, always congested," Gopal said the official fuel economy test used to evaluate hybrids there is not accurate, giving just a 29 percent fuel savings figure.
Gopal and his team set out to do fuel consumption tests in actual traffic conditions in two Indian cities and 11 Chinese cities. They found three areas where drivers in those conditions might get help from better technology: frequent starting and stopping, long times idling, and low time spent on highways.
Read the full story from San Francisco Business Times.
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by Cherryh, C. J.
Publisher:Phantasia Pr
No one at Meetpoint Station had ever seen a creature like the Outsider. Naked-hided, blunt toothed and blunt-fingered, Tully was the sole surviving member of his company -- a communicative, spacefaring species hitherto unknown -- and he was a prisoner of his discoverer/ captors the sadistic, treacherous kif, until his escape onto the hani ship The Pride of Chanur.
Little did he know when he threw himself upon the mercy of The Pride and her crew that he put the entire hani species in jeopardy and imperiled the peace of the Compact itself. For the information this fugitive held could be the ruin or glory of any of the species at Meetpoint Station.
Cover art by Michael Whelan
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Harley Davidson Men's Constrictor Boots D95276
Regular Price: $129.99
Special Price: $64.93
You want a boot that reflects your sense of independence and adventure. Step into a Legend™ and try these Harley Davidson Men's Constrictor Boots D95276 on for size. Whether you are traveling by bike or on foot, you want the iconic look and feel of the Harley Davidson brand. These boots feature a full grain leather upper, cushion sock lining, inside locking zipper, simulated leather outsole with rubber street side, and Goodyear welt construction.
- Full grain leather upper
- Full length cushion sock lining
- Shaft Height: 9"
- Heel Height: 1.25"
- Inside locking zipper
- Simulated leather outsole with rubber street side
- Goodyear welt construction
Carhartt Legacy 16" Tool Bag 100170$74.99
Product Description:
- Built of 1200D Poly with Rain Defender® Durable Water Repellent and Duravax® base
- 12 exterior pockets, 16 interior pockets and webbing loops
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- 16" x 10" x 10.5"
Carhartt Men's Rutland Thermal-Lined Hooded Zip-Front Sweatshirt 100632From: $64.99
The Carhartt Men's Rutland Thermal-Lined Hooded Zip-Front Sweatshirt is designed with Rain Defender Technology. Rain Defender durable water-repellent makes garments rain, mist and snow resistant. Moisture beads up and rolls off to keep you drier and on the job longer.
Product Features:
- 12-ounce, 50% cotton/50% polyester blend; Carbon Heather fiber content is 55% cotton/45% polyester
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Berne Lodge RealTree Xtra Jacket GJS201XTAFrom: $69.97
Product Features:
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DRI DUCK Men's Cheyenne Canvas Hooded Jacket 5020From: $64.99
Our signature work jacket is built for tough-as-nails guys who work hard and play harder. We engineered this best-seller based on your on-the-job needs. The Cheyenne features rugged work wear styling and relaxed comfort for mobility, no matter what the task. Imported.
Key Features:
Measurement Notes:
- 100% polyester diamond quilted brushed tricot lining
- 3 oz soft touch polyfil
- Nylon taffeta diamond quilted sleeve lining
- High quaility knit rib cuffs/waistband with 6 rows of spandex for better shap retention
- Triple needle stitching at high stress seams
- Articulated elbow pleats for eas of motion
- 3-piece hood for a natural fit
- Oversized front hand pockets
- YKK antique brass metal zipper
- Chest measured 1' below armhole
- Sleeve length measured from center back
- Body length measured from center back
Carhartt Legacy 18" Utility Bag 1521510From: $74.99
Product Description:
- Built of durable 1220D Poly with Rain Defender ® Durable Water Repellent and Duravax abrasion resistant base ™
- U-shaped zippered opening for easy access into large main compartment
- Zippered exterior pocket to store ammo and small items
- 5 additional quick access pockets to store other gear
- Internal mesh pocket for added organization
- Comfort grip haul handles
- Removable, adjustable shoulder strap
First Classics Longer Length Leather Vest FIL545CSLFrom: $73.99Soft Milled 1.1-1.2mm Cow Hide. Very stylish, fitted, sexy style, accentuates female form. It is cut longer especially in the front for ladies who do not want the belly to show when they wear vest. 5 Antique Silver snap front Closure. 2 outside hidden snap closure pockets and 2 inside pockets. Heavy duty long lasting black polyester lining with Custom First Classic Orange Mesh trimming and ever popular First Classic Orange label. Armholes are trimmed with heavy black textile to ensure the orange mesh does not show from the armholes. All metal hardware is guaranteed that it will not rust or corrode. Learn More
Carhartt Legacy Standard Work Pack 1003210From: $69.99
Product Descriptions:
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text:
In the third State of the Union address of his term, President Bush defended the war on Iraq, called for the renewal of the Patriot Act, praised the improving economy and called for a ban on gay marriage. We spend the hour listening to responses to Bush's address that paint a different picture of the State of the Union.
In his State of the Union address last night President Bush defended the war on Iraq, called for the renewal of the Patriot and reached out to the conservative Christian wing of the Republican Party by calling for a ban on gay marriage.
Despite the loss of 2.5 million jobs since he took office, Bush also rigorously praised the improving economy and called for Congress to make last year's tax cuts permanent.
The address was deliberately scheduled to take place a night after the Iowa caucus in an attempt to push the Democratic presidential contenders from the news spotlight. Although Bush never mentioned the election, the speech was seen by many as the start of Bush's re-election campaign. It came three years to the day after he took the oath of the office.
On Iraq, Bush claimed if the US did not invade Iraq, "the dictator's weapons of mass destruction programs would continue to this day." But he did not acknowledge that U.S. inspectors have uncovered no unconventional weapons.
A year ago at the 2003 State of the Union, Bush made the case for war by claiming that Iraq had 25,000 liters of anthrax, 38,000 liters of botulinum toxin, 500 tones of sarin, mustard and VX nerve gas and 30,000 munitions capable of delivering chemical agents.
After 10 months of weapons searches, none of this has been uncovered.
On foreign policy, Bush defended his unilateralist approach saying "America will never seek a permission slip to defend the security of our people." Later in the Democratic response, Nancy Pelosi said "a go-it-alone foreign policy that leaves us isolated abroad and that steals the resources we need for education and health care at home."
We spend the hour listening to responses to Bush's address from award-winning Indian author and activist Arundhati Roy, former head of the UN mission to Iraq Hans Von Sponeck, the Institute for Public Accuracy's Norman Solomon, Leslie Cagan of the United for Peace and Justice, the ACLU's Anthony Romero, TransAfrica President Bill Fletcher and gay community organizer Brendan Fay.
Read the London Independent's statistics on "George W Bush and the real state of the Union"
- Arundhati Roy, Hans Von Sponeck Respond to Bush's State of the Union on Iraq__
- A Look at Bush's Iraq Lies in the State of the Union and Truth-Telling In the Media__
- Bush Calls For Renewal of Patriot Act in State of the Union__
- No Mention of Africa in Bush's State of the Union__
- Bush Denounces Gay Marriage in State of the Union__
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Rival Hot Pot Express 4071WN 32 Ounce Plastic Electric Kettle - White
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text:
Trouver un exemplaire dans la bibliothèque
Recherche de bibliothèques qui possèdent cet ouvrage...
|Format :
|Tous les auteurs / collaborateurs :
Laurel Leff
|9780521607827 0521812879 9780521812870 0521607825
|Numéro OCLC :
|Description :
|Contenu :
|Introduction: the last voice from the abyss; Part I. 1933-41: 1. 'Not a Jewish problem': the publisher's perspective on the Nazis' rise and the refugee crisis; 2. 'This here is Germany': reporting from the Berlin bureau; 3. 'Worthy of France': the Vichy government's anti-semitic laws and concentration camps; 4. 'A new life in Nazi-built ghettos': German domination of Poland, Rumania and the Baltic States; Part II 1941-5: 5. 'To awaken the conscience of Christendom': pressure to publicize the first news of the extermination campaign; 6. 'Amidst the advertisements on page 19': placement decisions and the role of the news editors; 7. 'All Jews are not brothers': the publisher's battle with Zionists; 8. 'The semitic question should be avoided': German atrocities and US Government propaganda; 9. 'Final phase of supreme tragedy has begun': the War Refugee Board and the destruction of Hungary's Jews; 10. 'Political prisoners, slave laborers and civilians of many nationalities': the liberation of the concentration camps; 11. 'Lessons from the Hitler tragedy': the publisher and the aftermath of war; Conclusion: 'the horrible story was not told'.
|Responsabilité :
|Laurel Leff.
Synopsis de l'éditeur
'This is the best book yet about American media coverage of the Holocaust, as well as an extremely important contribution to our understanding of America's response to the mass murder of the Jews.'Lire la suite...


text:
Third time here and the best! Check- in process needs help, but after that- its wonderful. OUR NAME POPPED UP ON THE TV WHEN WE GOT TO THE ROOM. I'm sorry that some had smelly room problems, but we stayed right near the smaller Oasis pool and it was great.
I love the water parks and the 4D movies. My son brought PS3 and I called to have some help setting it up- they came in 10 minutes. Front Desk called to see if everything was ok. I requested extra items from housekeeping- came right away. Again, Front Desk called to check on us. Restaurant is good, however, beware of the food at the foodcourt. Not really good- we ate dinner out.
Lots of fun for the kids; pool games exciting and the night shows are great. Very relaxing stay.
People shouldn't complain when pool closes for maintenence for 45 minutes every day. Go in and cool off with a 4D movie! Express Check out is great!
- Official Description (provided by the hotel):
- Join SpongeBob SquarePants,Dora the Explorer and the Teenage Mutant Ninja Turtles on a family adventure to Nickelodeon Suites Resort in Orlando, Florida. This high-energy resort, set on 24 beautiful acres in Orlando's theme park district, is the ultimate kid's destination-where the whole family plays. From basketball to mini golf and water parks to a mass SLIMING, families will always find activities under the sun at Nickelodeon Suites Resort. And inside, stop by the Mall to meet Nickelodeon characters or visit Studio Nick for live shows like Double Dare LIVE! These activities and more are included. ... more less
- Reservation Options:
- TripAdvisor is proud to partner with Expedia, Hotwire, Booking.com, TripOnline SA, Odigeo, Priceline, Hotels.com and getaroom.com so you can book your Nickelodeon Suites Resort reservations with confidence. We help millions of travelers each month to find the perfect hotel for both vacation and business trips, always with the best discounts and special offers.
- Also Known As:
- Nickelodeon Family Hotel Nick
- Nickelodeon Family Resort Nick
- Nickelodeon Hotel Orlando
- Holiday Inn Orlando
- Nick Hotel Orlando
- Orlando Holiday Inn


text: Each half-hour episode of Let's Polka! is full of bona fide polka fun hosted by Bill Flynn. Tap your toes to the polka beat or dance along in your living room with our live studio audience. Plus, you'll get to know the music and musicians as each episode contains an interview with Bill Flynn and the leader of the band! The week we welcome back the Joe Weber Band!