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Event Quicklinks
|David "Polka" Pietka
Foot Traffic's founder and other ownership half is rumored to have jumped over a VW Beetle during his long-jumping heyday at UofO in the 60's. We think that's pretty cool.
|Sean "Padre" Rivers
Sean likes running, arm wrestling, connecting-the-dots, & practicing his handwriting, although the capital "J" gives him fits--as do any customers that don't come away 110% satisfied! Yes, he co-owns Foot Traffic!
|Daniel "Gruff"McDuff
General Manager and Footwear Buyer, this Lewis & Clark standout brings vast amounts of running knowledge, computer literacy, and funky fresh rhymes to his loving co-workers at Foot Traffic.
|Laura "L-train" Thomas
Manager of our super-awesome downtown store, LT was the starting running back on St. Mary's Academy's little-known football team. But one day, she ran in for a 20 yard touchdown and kept running for 3 more miles.
|Morgan "Dragongrip" Saltenberger
Our NE manager extraordinaire, Morgan is one part running/walking genius and two parts trained assassin. With just one touch from his vaunted Dragon Grip, he brings giants to their knees. Coincidentally, this grip works magic for achilles issues.
|Maeby 'Tompkins' Maeby
We found Maeby in the shipping container from a major shoe company. We won't tell you which one, but let's just say she wasn't the size we were looking for. She spends her free time being awesome and riding on the MAX by herself.
|Andrew "Flavor" Warnecke
Our commodities buyer is very thorough when making decisions on what to bring into the store. He's been known to flavor test energy gels submerged under ice cold water, wear water belts while practicing his parallel bar routine.
|Jay "Fireball" Schrotzberger
Head coach of the mighty Lions, manager of the stupendous Sellwood Foot Traffic, Jay has nearly 10 years of specialty running/walking store experience and was voted by staff as "most likely to succeed!"
|Kevin "K-tweet" Fleishman
Warner Pac runner and arm wrestling champ in his height/weight class (we have reason to believe he's the only one in his category), Kevin earns gold-stars every time people rave about his customer service skills (seriously).
|Meaghan "Meg-Train" McCluskey
A veritable freight-train of knowledge, Meaghan delivers running & walking advice in bulk and on time. Ask her anything about shoes or her model train set and prepare for a flood of wisdom!
|Fritz "Fritz" Fitzer
With his long-flowing locks, long legs, and amazing vertical.....knee lift, Fritz is the picture of...well, running inefficiency. But he's superbly adept at providing heaps of footwear and apparel knowledge within a short amount of time!
|Emily "Cutter" Rivers
A cold-blooded numbers killer, Emily is MBA, CCCU, & CPR certified. Our lead accountant is equally capable of obliterating numbers while expunging sour moods...& the occasional case of diaper rash at Foot Traffic headquarters.
|Martin "StoreMom" Mclemore
Once upon a time, we went for a run through campus & found ourselves in a creative writing classroom. Martin was giving a presentation on footwear. His teacher gave him poor marks for improper annotations. We hired him anyway. He has a nice voice.
|Kathleen "Safari" McGaughey
She once tamed a legion of lions, outran a genetically-modified babirusa, and resuscitated a killer whale. Kathleen shrugged her shoulders after completing 26.2 miles! Visit our events/safari specialist at your next event and ask her for advice.
|Alyson "Disco" Drake
Alyson was a free agent pick up from across the border...the northern border...I mean Washington. She's pretty great and totally worth the 10 year contract she demanded!


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2005 Mod of the Year AwardsOfficial event with 40 members, must apply to join
Welcome to Mod DB's official competition which recognizes the best released and upcoming mods from the year just past. Head here to read about the mods...
SHUTDOWN -s -t 01
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8 comments by Gin on Feb 6th, 2009
Needs no paragraph but you'll get a small one.
Find me elsewhere if you knew me. If you didn't you didn't miss anything. Would like to say I enjoyed something about it. But I didn't. Not a thing. From now on I'll be downloading from other websites and using my other accounts. Was here since 2003. Quit today at my 6:45 PM Central Time USA. Reasons for which you may, can, or probably won't speculate about. I go now where the other members who have quit have gone. Somewhere better with more options, more friendly communities, and better staff who have a real mission to give or to help someone. If there was something you'd remember me by, I'd suggest you delete it and move on.
Blind men see nothing.
Welcome to Mod DB's official competition which recognizes the best released and upcoming mods from the year just past. Head here to read about the mods...
Mod DB brings you the best mods in the industry. You decide which ones are worthy of recognition. At the top of this program sits the ultimate prize...
The time has come to decide 2007's elite and what a great year it has been for mods and games alike. We've seen numerous games score 10/10 and now it...
Would you like to Adopt a Bunny?
How goes it, gangsta?
How is Molly?
You should have gotten a poodle :o!
do u have Xfire?
Hey Gin,
Please check my new music reel out...no reggae this time :-)
no offence at all but puppy dogs look ugly.. :#
HERETIC :o
Dogs > Cats
For sure.
I know what j00 looks like D:

subset: commoncrawl


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The natural evolution of the video rental store was the ability to watch content digitally for a set number of days. Amazon Instant Video started out as exactly this kind of service, but had grown into a much larger video distribution system, one that seeks to compete with the 800-pound gorilla of the streaming video world: Netflix.
Pricing and content
The two services also offer fairly different content. Amazon focuses heavily on movies that have already been released to DVD for a while. Netflix offers a lot of older television shows as well, and has recently started offering some television shows the day after they air on broadcast TV. Amazon doesn't have nearly as wide a selection when it comes to movies, and the television shows that they offer with the account can't really compete with Netflix. There are some exclusives that each provider offers over the other. Current shows, like Fringe for example, are only available on DVD with Netflix. The only way to get television shows that aired the previous day on Amazon would be to rent or buy them through the Amazon Video service, which integrates into your Amazon account.
With child specific content, Netflix easily comes out on top. The service provides access to more kid-friendly programming than Amazon by a landslide. Amazon offers access to the same kind of content, but mainly through their digital rental and purchase service (as opposed to Prime Instant Video). Amazon offers the flexibility of being able to bolt on additional content to the service at these additional rates, which is something that can't be done on Netflix.
Prime Instant Video offers a massive digital library that can be streamed from a browser or app, just like Netflix. Both services offer unfettered access to their content for a flat rate, though only Netflix allows users to pay month-to-month.
Amazon's service is $79 per year, and while that is $1.41 cheaper per month than Netflix, you are stuck paying for the whole year up front. Of course, you get a lot more than just streaming video with Amazon Prime, including significant discount on shipping when you shop on Amazon. So, while you can stop the service anytime you want with Netflix, Amazon is the better deal as long as you don't need to buy a lot of extra content.
Using the websites
With both Amazon and Netflix, the primary way to access your account features and watch content is through the respective sites. Because Netflix only offers a video streaming service, and Amazon has bolted their service on to their shopping website, the websites are very different. Netflix offers a simple website with one clear goal in mind, while Amazon's Instant video service spends just as much time offering you free content as it does trying to sell you other content. The biggest reason for this is Amazon isn't only there to offer a streaming video service at a flat rate.
While more complicated, Amazon's service does a great job giving the user options. You can choose to watch an episode of a show in SD or HD, and you are provided with a full description of the episode with a recommendation for other content. The simplistic nature of Netflix's service is designed to automatically format the video for the bandwidth available, with basic descriptions available when you hover over a selection. Amazon is much more mechanical in nature, while Netflix offers an incredibly simple user interface, complete with play buttons that hover over artwork.
When streaming content on the two websites, both Amazon and Netflix offer a full screen and embedded view of the content. Amazon's embedded view only takes up a third of the screen with large black bars on either side of the video and white above and below. Netflix, on the other hand, takes up most of the browser and shows nothing else. Visually, Netflix offers a much better viewing experience when the video is embedded. When in full screen, Netflix and Amazon place their video controls on the bottom of the screen. These two experiences are nearly identical in full screen, though the controls in Netflix look nicer and feature smoother animations.
Streaming apps
Whether it is a box connected to the television or a mobile device, the apps for Amazon and Netflix are a big part of the services they offer. Netflix has worked very hard to make sure their app is available on everything with an Internet connection. Game consoles, smartphones, tablets, even televisions are coming with Netflix pre-installed now. Amazon, on the other hand, has been slower to make it onto every device. While it is available on most of the popular gadgets out there, Amazon's Instant Video apps aren't quite everywhere Netflix is.
The biggest difference between the Amazon and Netflix apps right now is Kid Mode. Netflix has created an entirely different user interface so kids can safely use the service. Children can search for shows by their favorite character, and don't have access to any account tools of any kind. Amazon's service is open, and has plenty of kid-friendly content, so if you have the username and password you can watch whatever you like and even make purchases from the app.
When streaming from Amazon and Netflix, the apps will stream the highest quality based on available bandwidth. When comparing the two services across a variety of devices, Amazon did a much better job in the beginning of a session. Netflix starts low quality and increases until the image is the best it can be, while Amazon determines the best image in the beginning. As a video plays, if the network connection changes for any reason, Netflix will gracefully scale back. Amazon is noticeably less graceful when it comes to determining video quality, but still delivers a great experience most of the time.
Netflix has also made some tremendous strides in remote streaming hardware, like Google's Chromecast. This isn't surprising, since Netflix and Google worked together on the protocol being used by the Chromecast, but Amazon currently has no competing service and does not support remote streaming at all. If you have a Chromecast, Netflix is just that much more convenient than Amazon.
Final thoughts
If you have to choose between the two, Netflix is the better one overall. Even so, a constant critique of Netflix is that new movies aren't available fast enough, which is something Amazon offers as something you can purchase as a part of the Instant Video service. These two aren't exactly the same thing, though they offer enough of the same features to be similar.
In the end, if your goal is to have access to the widest possible all inclusive content database with the best user interface, Netflix is your best bet.
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Chad Stoller | May 22, 2007 | Comments
Earlier this month, I talked about alternative forms of digital marketing that could contribute to an exceptional experience.
One concept was to align brands with shareware developers to provide programs consumers could download. These programs could provide solutions to daily challenges or enhancements to a consumer's digital lifestyle. Getting a screen saver or desktop wallpaper is an expected experience, but it would be a nice surprise to get a program that helped organized your thoughts, made mobile shopping lists, or even kept track of movies you want to see.
Shareware developers spend millions of hours making software to solve problems and fulfill needs unmet by mainstream software publishers like Microsoft, Apple, and Adobe. Sometimes the programs are free (and referred to as freeware), but in most cases the programs are free to use for a limited time and eventually require user registration along with a payment to the developer.
Shareware programs exist for thousands of computing needs. Developers gravitate toward marketplace and lifestyle voids to provide some undeveloped solution. With the diversity of shareware applications and solutions available, there's a good chance there's a program that would enhance your customers' digital lifestyles.
Who makes these programs? Sometimes, it's a small team of developers. Other times, it's a larger team that collaborates from multiple locations across the globe. But most of the time, it's a single developer working out of her home. Often, the software created by these developers is their primary job and source of income. Developing software is a complicated process, but it can be even more challenging to bring it to market. It takes physical and financial resources to get the word out. And because shareware tends to sell in the thousands, it's rare for a developer to have the resources or funds to effectively promote her software.
I recently spoke with Jesse Grosjean of Hog Bay Software in Bangor, Maine. Hog Bay Software is a family business that develops personal productivity software for the Mac, including WriteRoom, Clockwork, and Mori. "Aligning with a brand is something that I haven't heard of before, but it's intriguing," said Grosjean. "Exposure is one of the biggest hurdles when it comes to marketing your programs. If someone were to come in and help me get the word out by exposing my programs to a larger audience that's something I'd be interested in talking about. "Most often, the donations made by customers end up going against the costs to fix bugs, operations costs, and fees associated with keeping the Web site and community going," he continued. "This money isn't going into a marketing or advertising program."
Developers such as Grosjean are competing in a crowded marketplace. There's a large number of shareware developers, and their exposure opportunities are limited and short in time. They don't buy ads in consumer magazines or have a regional sales force that calls on Fortune 500 customers. Generally, their editorial coverage is limited to a top-tools list or a daily entry on an enthusiast's site. From there, they rely heavily on search, word of mouth, and community participation. They covet the opportunity to expand their marketplace. This is where you come in.
Here are some quick tips on how you can partner with a developer:
It's really about the consumer experience. If you can enhance a consumer's daily life, you're over-delivering with your marketing message. It's one thing to have your banner read, and another thing to enhance the consumer's digital experience.
Meet Chad at the ClickZ Specifics: Advertising in Social Media seminar on May 21 in New York.
On the heels of a fantastic event in New York City, ClickZ Live is taking the fun and learning to Toronto, June 23-25. With over 15 years' experience delivering industry-leading events, ClickZ Live offers an action-packed, educationally-focused agenda covering all aspects of digital marketing. Register today!
Chad Stoller is the executive director of emerging platforms at Organic Inc., a leading digital communications agency with clients such as DaimlerChrysler, Sprint, and Bank of America. In this role, Chad leads Organic's strategy on client communication platforms and Organic's Experience Lab. Prior to Organic, he spent 13 years at Arnell Group in various roles, including director of communications solutions, and was responsible for branded entertainment, new media, branded gaming, and marketing alliances. He has developed a series of award-winning programs, including the Cannes Lion winner, "Terry Tate: Office Linebacker," for Reebok and Jeep Evo 4 x 4 for DaimlerChrysler. Chad is also a regular contributor to Organic's blog, ThreeMinds.
June 23-25, 2015
July 9, 2015
August 4-6, 2015
August 10-12, 2015
September 8-10, 2015
Gartner Magic Quadrant for Digital Commerce
This Magic Quadrant examines leading digital commerce platforms that enable organizations to build digital commerce sites. These commerce platforms facilitate purchasing transactions over the Web, and support the creation and continuing development of an online relationship with a consumer.
Paid Search in the Mobile Era
Google reports that paid search ads are currently driving 40+ million calls per month. Cost per click is increasing, paid search budgets are growing, and mobile continues to dominate. It's time to revamp old search strategies, reimagine stale best practices, and add new layers data to your analytics.
Wednesday, June 10, 2015
12pm ET/9am PT
Tuesday, June 16, 2015
12pm ET/9am PT


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We're sorry, we need more information to run your search. Please enter a last name (adding more details will improve your results).
Track down the Johnnie Thomas you are searching for with our people search tools. PeopleFinders.com has an extensive database to help you find people based on age, prior residences, relatives, aliases, and more. Johnnie Thomas was born in 1941 and is 73 years old. Known relatives include .
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Scots just miss upsetting 'Hawks
PULASKI, Tenn. — The No. 6 Martin Methodist RedHawks overcame a 9-point deficit in the last three minutes to edge the Lyon Scots 68-66 here Saturday in a TranSouth Athletic Conference mens basketball game.
The undefeated RedHawks (15-0, 3-0) trailed almost the entire second half and the Scots (6-9, 0-4) were ahead 66-57 with less than three minutes remaining.
Georgia women hit last shot, nip 20th-ranked Arkansas 59-56
FAYETTEVILLE (AP) — Khaalidah Miller hit a 3-pointer with 13.8 seconds remaining to lift Georgia to a 59-56 win over No. 20 Arkansas on Thursday night.
The win was the Lady Bulldogs' second straight over a ranked opponent following a victory at then-No. 10 Kentucky on Sunday. It marks the first time Georgia (13-3, 3-0 Southeastern Conference) has won back-to-back road games over ranked teams in 15 seasons.
The win is also the 800th in school history, with Georgia becoming the 10th program with that many wins.
Greene County Tech juniors thrash Batesville
PARAGOULD — Greene County Tech walloped Batesville in a pair of 5A-East District junior high basketball games here Thursday night.
The Junior Lady Golden Eagles won 46-7 and the Junior Eagles won 47-18.
"They were real physical and real aggressive, and we didn't handle it very well," Batesville Coach Chip McDonald. "They scored a lot of their points off turnovers."
The Junior Lady Pioneers fell to 11-2 overall and 1-5 in the district.
Jace Bristow led the Junior Eagles with 16 points. Nick Morton scored seven points for the Junior Pioneers.
Cave City, Cedar Ridge junior teams win tourney contests, stay unbeaten
STRAWBERRY — The Cave City Junior Cavewomen and Cedar Ridge Junior Timberwolves kept winning here Thursday in the Hillcrest Junior High Tournament quarterfinals.
Led by Jamie Holley's 10 points and Vashti Crick's seven rebounds, the unbeaten Junior Cavewomen downed the Hoxie Junior Lady Mustangs 37-27. The 10-0 Junior Cavewomen are scheduled to host Marianna in 4A-2 District action this afternoon and then they will take on Walnut Ridge at 1 Saturday afternoon in Lynn, the first of four Hillcrest tourney semifinals.
Basketball in town tonight
Blytheville Lady Chickasaws (1-0, 5A-East District; 5-4, overall) at Batesville Lady Pioneers (0-1, 7-6), Pioneer Gymnasium, 5:30
Senior guards Charmaine Selvy and Alicia Stone are leading the way for the Lady Chicks. Selvy, quick and a good shooter, recorded a career-high 40 points in nonconference action against Osceola on Nov. 16. The Lady Chicks, district runners-up last season, defeated the visiting Beebe Lady Badgers in a district opener last weekend. Meanwhile, the Lady Pioneers were dropping their district opener at Paragould High.
Cold second half dooms Lyon men
The west goal of Becknell Gymnasium was not friendly to the homesteading Lyon Scots Thursday night.
After leading the No. 17 Union Bulldogs 37-36 at halftime, the Scots suffered a 72-56 beating in a TranSouth Athletic Conference meeting.
"We can't seem to keep it together," Lyon Coach Kevin Jenkins said. "Some of it's our youth. Last night, you have to give kudos to that group in black and part of it goes to not being able to make shots."
Hudson paces No. 1 Union in win against Lyon
The Lyon Scots harassed the No. 1 Union Lady Bulldogs in a TranSouth Athletic Conference showdown Thursday night in Becknell Gymnasium, but when the dust settled, the visitors from Jackson, Tenn., left Batesville with another victory.
Union, ranked No. 1 in 40 straight NAIA polls — dating back to Oct. 2007 — improved to 16-0 overall and 3-0 in the TranSouth with a 65-52 win over No. 30 Lyon (10-5, 2-1). It is the 54th straight TranSouth regular-season win for Union.
Basketball in town tonight
No. 1 Union Lady Bulldogs (15-0, 2-0) at Lyon Scots (10-4, 2-0), Becknell Gymnasium, 6
Junior Lady Pioneers get first victory against 5A-East District basketball foe
The Batesville Junior Lady Pioneers broke through in the 5A-East District basketball standings Wednesday night with a low-scoring victory over the winless Wynne Junior Lady 'Jackets in Pioneer Gymnasium.
"We really struggled to score early, though we got a lot of good looks at the basket," Batesville Coach Chip McDonald said about the 20-6 decision. "Our defense did a good job all night."
Wynne led 2-0 after one quarter of play. Batesville led 11-2 and 15-5 at the next quarter breaks.
Scott named Lyon Sports Information Director
Eric T. Scott has been appointed sports information director at Lyon College. He started Jan. 3, succeeding Gene McCoy, who resigned to pursue other interests.
Scott comes to Lyon from Bartlesville, Okla., where he was sports information director and assistant womens basketball coach at Oklahoma Wesleyan University. He is also founder and owner of BigUSports.com, a sports-related website that covers small college athletics.
Lyon soccer assistant promoted
Mitch McKay has been hired as the head coach of Lyon's mens soccer team, according to a news release from the college.
During the 2010 soccer season, McKay served as the assistant to both the mens and womens teams at Lyon. Each team saw success this past season, with each squad recording the most wins in school history and the women advancing to the TranSouth Athletic Conference Tournament Championship.
A native of Owosso, Mich., McKay attended college at Southern Wesleyan (S.C.), graduating in 2009 with a degree in business administration.
LSU Tigers hold off slow-starting Razorbacks
BATON ROUGE, La. (AP) — LSU made no field goals in the final nine minutes of its 56-53 Southeastern Conference victory against Arkansas on Wednesday night. But Tigers Coach Trent Johnson was still quite satisfied with coming away with a second straight league win.
"That's a good win," Johnson said. "Like a good team, Arkansas made a run and we kept our poise. We had the opportunity to put them away at the free-throw line, but we didn't. But it was a good win for us."


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Houston Dynamo are set to receive a boost just a few games out form the 2013 MLS playoffs.
English winger Andrew Driver, who had been sidelined with a calf injury since early September, returned with a brief stint in last week's win over Montreal Impact and is now feeling good about his fitness ahead of Wednesday's meeting with Sporting Kansas City and the upcoming post-season series.
"It's been a bit of a nightmare coming down to the business end of the season and missing some of these games," said Driver who joined the Dynamo permanently from Scottish club Heart of Midlothian earlier this year after a successful loan spell.
"These are the games as a player you want to be involved. I'm just happy to be back and ready to contribute to the team the rest of the season."
He added: "I think that's been the case in the past where I've been overeager and wanted to get back too fast.
"You don't lose it overnight. I've been involved for like four days where everything's been good and sharp so you get it back pretty quickly. I'll give it my all and give it my 100 percent. If I do contribute and play well that's good for us."
For breaking stories and all the great banter like us on Facebook: facebook.com/tribalfootball


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Is This Red Dust Devil For Real?
Something here seems…off. Supposedly this was filmed in Brazil, where the clay based soil created a uniquely hued funnel cloud.
This post was created by a user and has not been vetted or endorsed by BuzzFeed's editorial staff. BuzzFeed Community is a place where anyone can post awesome lists and creations. Learn more or post your buzz!
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Mobile Money
Turn your mobile phone into a virtual wallet. With GCash, experience safe and convenient money transactions at the speed and cost of an SMS.Learn More
Shopping without a credit card from anywhere in the world: priceless. Enjoy easier and safer shopping with GCash!Learn More
Get the world's hottest games now with GCash American Express® Virtual Pay.Learn More
Grow your business right away! Enjoy the convenience of accepting credit card payments for your business with your smartphone or tablet.Learn More
Send money, pay bills, buy load, enjoy rebates, shop online, play games, and donate to your favorite institution from your mobile phone.
Congratulations to the winners! You can now capture clearer pictures and have more fun taking notes with your new Samsung Galaxy Note 4!Learn More
Turn your mobile phone into a virtual wallet. With GCash, experience safe and convenient money transactions at the speed and cost of an SMS.Learn More
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Be part of #TeamGlobe! Help build livelihood programs in the Philippines and make a wonderful difference.Learn More


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Bobbie Sumburg (MA DHA, 1993; PhD DHA, 2001), curator of costume and textiles at the Museum of International Folk Art, Sante Fe, has published Textiles: Collection of the Museum of International Folk Art (Gibbs Smith, 2010). Sumburg also co-authored Sleeping Around: The Bed from Antiquity to Now (University of Washington Press, 2006).
Sumberg publishes Textiles: Collection of the Museum of International Folk Art
Posted By Michael Fraase
Mar 22, 2010 at 12:26 PM
Mar 22, 2010 at 12:26 PM
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design college of design tom fisher architecture award awards announcement cdes sustainable 2014 students video university of minnesota goldstein museum of design landscape architecture aia exhibition alumni lecture lucy dunne research museum competition minneapolis art community fashion barry kudrowitz event project public interest design events from the dean goldstein international study abroad sustainability conference fashion show haiti awards magazine sustainabiliy conferences csbr graphic design metropolitan design center minnesota schedule star tribune


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Our internal engine was originally derived from the EARTH engine.
No games were found. We suggest you try the games list to see if any show up there. Join now to add a game we are missing or you are currently developing, so people can share news, files and mods related to it.


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Uno Hype ft. Hassani Kwess - Members Only
Artist: Uno Hype
Featuring: Hassani Kwess
Producer: DJ Black Diamond
Album: None (Promo Single)
Avg Rating: 3.3 ( 7 votes )
Even though Christmas is the rapidly approaching, New Years is just around the corner, which means it's time to look back at the year that was. When looking back on 2012, Uno Hype will most definitely be smiling, because, with nine other features and a DJBooth-hosted album, the DMV youngster has made a sizable splash in the Booth. On Members Only, his 10th Booth feature of the year, Hype brings along his amigo Hassani Kwess to inform listeners that you better think twice if you are attempting to mooch of their success. To match the interesting styles of both emcees producer DJ Black Diamond crafts a intricate beat, highlighted by an interesting rhythm and the occasional ringing alarm. While originally placed on DJ Wally Sparks' SPKSMEN Mixtape Vol. 1, Members Only is not attached to a larger project.
Uno HypeHassani Kwess DownloadsIndie
Written by Lucas G. on Dec 18, 2012
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New and Familiar Faces
New and Familiar Faces
Meet new face Scott Spencer, D.P.M., Associate Professor, Orthopedics/Biomechanics, College of Podiatric Medicine
Meet familiar face Irene E. Edge, Assistant Professor, Computer Technology, Regional College
Scott Spencer, D.P.M.Associate Professor, Orthopedics/Biomechanics
College of Podiatric Medicine
New Face
Job Description:Clinical and didactic instruction in orthopedics and biomechanics of the lower extremity and foot
Worked at KSU since:July 2012
Employment Prior to Kent State University:Ohio College of Podiatric Medicine and private practice
Likes Most About Kent State University:A large and growing nationally recognized educational institution
Attraction to Kent State University as an Employer:Excellent reputation
Resides in:Highland Heights, Ohio
Hometown:Cleveland Heights, Ohio
Education:B.S. – biology/pre-med, Secondary Education Grove City College; D.P.M. – Ohio College of Podiatric Medicine
Hobbies:Playing bagpipes! Soccer, golf, land paddling, exercising, computers and technology, reading
Irene E. EdgeAssistant Professor, Computer Technology
Kent State University at Ashtabula
Regional College


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A teaser for the new Ferrari flagship car to be unveiled Tuesday. Click above to see another view of the yet-to-be unveiled car. Facebook
Last month Ferrari beat Apple and Google to become the world's most powerful brand, according to the British research firm, Brand Finance, which analyzed more than revenue when making its determination. The powerful Italian luxury car manufacturer confirms it will unveil its new flagship car—name unknown—at the International Geneva Motor Show, tomorrow.
Following in the line of the F40 (for the 40 year anniversary) F50 (for the 50 year anniversary), the Enzo (after Enzo Ferrari, for the 60 year anniversary), the car is tentatively being referred to as the F70, and a "special series car," though the name hasn't officially been made public.
Click here for another peek at the still secret car.
So how did Ferrari, a company with $3.6 billion in revenue beat Apple with its $87.3 billion revenue, and Google with its $52.1 billion revenue?
"One of the key drivers of brand value is revenue, which, as an exclusive luxury brand, Ferrari cannot compete on compared to huge multinationals," wrote Viknesh Vijayenthiran, of Motor Authority. "However, when you factor in other important financial metrics such as net margins, average revenue per customer, marketing and advertising spend, along with qualitative measures such as brand affection and loyalty, the Prancing Horse comes out on top."
Other than stunning design, and an engine that's so powerful it's occasionally illegal, Ferrari also controls its brand in three innovative ways.
First, its last flagship, Enzo, was only made 399 times. Symbolically, one less than the anticipated demand for the $670,000 car.
Second, buyers were hand-picked by the 70-year-old company.
Michael del Castillo is the technology and innovation reporter at Upstart Business Journal, a member of American City Business Journals. A graduate of Columbia University, his work has appeared in the New Yorker. He is also the cofounder of Literary Manhattan, a nonprofit dedicated to promoting Manhattan's literary community and creating new ways to appreciate literature.
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April 24, 2013 20:22
Vanilla Ice to join Amish community for new reality show
'Vanilla Ice Goes Amish' will be broadcast later in the year
Vanilla Ice Goes Amish will star the rapper – real name Robert Van Winkle – and premiere later in the year on US channel the DIY Network. Ice wrote on his Twitter account of the project:
This show is going to be amazing, pure magical. Get in where you fit in, and I'm sitting in with the Amish. LOL— Vanilla Ice (@vanillaice) April 23, 2013
The show will be filmed in Ohio and see Ice fully immersing himself in the Amish culture with particular focus on the community's construction projects, reports MSN.
A keen handyman, he formerly presented home improvements show The Vanilla Ice Project on the same channel back in 2011.
Vanilla Ice also released his sixth studio album, 'WTF (Wisdom, Tenacity And Focus)', in 2011. It featured a guest appearance from Insane Clown Posse on a track called 'Born On Halloween'.
Ice is currently signed to Insane Clown Posse's own label, Psychopathic Records.
Vanilla Ice shot to fame in 1990 with the single 'Ice Ice Baby', the first hip-hop song to top the US Billboard chart.
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Nevertheless neither is the man without the woman, neither the woman without the man, in the Lord. – 1 Corinthians 11:11
As I prepare to marry a... More.
February 13, 2012 | 10:48 pm
A little over two weeks ago, my lovely Florina and I were "sealed" together in holy matrimony at the LDS Temple in Los Angeles. This is the crowning... More.
January 25, 2012 | 11:38 pm
Nevertheless neither is the man without the woman, neither the woman without the man, in the Lord. – 1 Corinthians 11:11
As I prepare to marry a... More.
January 22, 2012 | 1:34 am
Seek not after riches nor the vain things of this world; for behold, you cannot carry them with you. – Alma 39:14 (Book of Mormon)
But before ye seek... More.
January 15, 2012 | 11:14 pm
On two Sundays a month I teach a spiritual lesson to a group of high priests (mostly older men) in my congregation. Today we began with a spirited... More.
January 12, 2012 | 12:53 am
With the AFC playoff game this weekend, Tebowmania promises to hit new heights. Straight men around the country are openly acknowledging their man crush... More.
January 6, 2012 | 1:21 am
Although the U.S. Constitution declares that the government can't administer a religious test to presidential candidates, individuals are certainly free... More.
December 30, 2011 | 10:30 am
Nevertheless, this did not put an end to the spreading of priestcraft through the land; for there were many who loved the vain things of the world, and... More.
December 22, 2011 | 1:27 am
Thou shalt not commit adultery. – Exodus 20:14
Thou shalt not commit adultery; and he that committeth adultery, and repenteth not, shall be cast out. ... More.


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Top Definition
A hustla is someone skilled at turning a profit no matter what the enterprise.
Master P (Percy Miller) is a hustla, he turns a profit in a lot of different businesses.
by Andrew Nicely March 31, 2004
13 more definitions
Commonly used by rappers to describe a drug dealer, but it's also a street term used for pimps or anyone who makes money illegally on the streets, it can also just mean your getting a lot of money doin what you do best.
Im a hustla homey, you better ask about me.
by Lumpy Baby December 16, 2005
someone who lives to make every dolla outta 15cent-nonstop 24/7
if i'm stavin im robbing, eatin then reachin, livin still driven ,gettin dough is what i live foe .me and money grew up together, both of us got big faces ,immai a hustla nuggah aint shit gonna change this.
by Q. February 15, 2004
Someone Always looking for a way to get more money
Alex & Tanner are hustlas!
by Alexravs July 12, 2006
the male version of a diva.
hustla's gittin money, if you aint gittin money, den you aint got nothin fo me.
by money421 January 01, 2010
A straight up gangsta thug who's focus is on makin that paper. He gets all the women and is a total baller.
See that hustla over there lookin good and makin all that money?
by levirockssss April 11, 2011
Someone who hustles to get by, getting money getting things to have, having to kill someone for something.
"Damn homie you a straight hustla."
by Joel.C.White April 07, 2006


text:
I thought so, yes. And the last Portra I bought, last fall, had reasonably far out expiration dates.
As I said above I'm tempted to go 100% Ilford for black and white. I'd like to support those who best support us, and their materials are superb and I could be quite happy using just Ilford for black and white but that doesn't help with color.


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OKLAHOMA – Offering significant awards and support to artists, the Oklahoma Visual Arts Coalition's (OVAC) Art 365 exhibition challenges local artists to create new, innovative artwork. Five artists each receive $12,000 and one year of curatorial guidance in preparation for an exhibition. Art 365 will travel to the Arts & Humanities Council of Tulsa's Hardesty Arts Center, 101 E. Archer St, Tulsa, May 23-August 9, 2014, with an opening reception on May 23, 6-9 pm. Admission is free.
Artists were selected from a statewide call for proposals by guest curator Raechell Smith, chief curator and founding director of the H&R Block Artspace at the Kansas City Art Institute. Smith reviewed 60 proposals from artists around the state and visited 11 artists in their studios before making her final selections.
Exploring remote portions of our National Parks and wilderness areas, Bryan Cook (OKC) presents large scale photographs of these pristine locations, capturing places and moments that most will never experience with their own eyes.
Motivated to explore the role of smell in our experience of places, Cathleen Faubert (Norman) collects and distills material from Oklahoma's distinct eco-regions creating an imagined aromatic landscape.
Eyakem Gulilat (Norman), an Ethiopian immigrant to Oklahoma, observed the abundant presence of churches in the state and grew curious about the racial, political and socioeconomic relationships within and around churches. His series of aerial photographs explores the role these church buildings play in their surrounding neighborhoods.
Exploring her heritage as a third generation Ukrainian-American, Alexandra Knox (Norman) traveled to the Ukraine to meet family members, conduct research, and gather artifacts for a new installation investigating her cultural identity.
Spurred by her own musings about what life would have been like had she been a mother, Romy Owens (OKC) is creating a room-sized knitted installation where the audience may reflect on their own life decisions.
"The Art 365 exhibition is the kind of opportunity that can transform the artists' careers," said Julia Kirt, executive director of OVAC. "We see rapid advancements in the Art 365 artists' work and professionalism as OVAC provides a year of financial, intellectual, and logistical support."
Art 365 is funded in part by the National Endowment for the Arts, Oklahoma Arts Council, George Kaiser Family Foundation, LEVEL Urban Apartments, NBC Bank, Ad Astra Foundation and Allied Arts. For more information about Art 365, please visit www.Art365.org or call 405-879-2400.
Admission: Free
For more info: http://www.Art365.org


text:
A method for increasing accuracy and reducing the time required to teach the target bonding points on a reference semiconductor device and its associated lead frame comprises manually approximately locating at least a first target bonding point and at each approximately located bonding point causing the pattern recognition system (PRS) of an automatic wire bonder to relocate the exact center of preferred target bonding point automatically. The direction and approximate distance to the next point is programmed into the PRS to enable the PRS to automatically step to the next approximate location of a next bonding point or a pad or a lead. At each pad or lead the PRS is programmed to find or relocate this bonding point at the exact center or preferred target bonding point on the lead or pad. It is possible to program such automatic teach operations on pads or leads over a complete semiconductor or preferably over a plurality of pads or leads arranged in continuing direction and spaced from each other by a predetermined pitch. During bonding of production semiconductor devices the taught bonding points are employed as approximate bonding points which causes the PRS to again relocate the exact preferred target bonding points with reference to the PRS located edges of the pads and leads to be bonded.
1. A method of automatically teaching target bonding points on pads and leads of semiconductor devices to be bonded with an automatic wire bonder of the type having a pattern recognition system (PRS) comprising the steps of:
manually locating the proximity of a first target to be bonded on a reference semiconductor device in a PRS system of the type having electronic indicia indicating the point to be automatically wire bonded,
manually directing said PRS system to automatically find and record an accurate predetermined first target bonding point thereon,
stepping said PRS system to the proximity of a second bonding point which is located a predetermined distance and direction from said first target bonding point,
manually directing said PRS system to automatically teach and record an accurate predetermined second target bonding point on a pad or lead at said second bonding point,
repeating the steps of stepping and directing performed at said second bonding point at a plurality of other bonding points, and
storing first and second target bonding points in a memory to provide an accurate reference bonding program for said PRS system of said automatic wire bonder.
2. A method as set forth in claim 1, wherein said step of directing said PRS system to find and record an accurate predetermined first target bonding point comprises the steps of:
scanning a portion of a PRS memory map containing pixel gray level intensity values,
processing said pixel intensity values to located the edges of the target electrode to be bonded, and
locating the first target bonding point at the exact center between edges of the target electrodes.
3. A method as set forth in claim 2 wherein the step of locating the first target bonding point at the exact center between edges of the target electrode comprises,
electronically scanning a corridor which tranverses the edges of said target electrode at a plurality of different angles to determine the scan angle having the narrowest edge width, and
calculating said exact center as being at one half of the narrowest width.
4. A method as set forth in claim 1 wherein the step of locating a first target to be bonded comprises locating the target on a lead out pad of a semiconductor device.
5. A method as set forth in claim 4 wherein the step of stepping said PRS system to a second bonding point comprises stepping to an adjacent lead out pad located at a pitch P away from said first target to be bonded.
6. A method as set forth in claim 4 wherein the step of stepping said PRS system to a second bonding point comprises stepping to a lead frame lead juxtaposed said lead out pad.
7. A method as set forth in claim 1 wherein the step of repeating the steps of stepping and directing comprises directing said PRS system to repeating a predetermined number of times, and then
waiting for another instruction of step and repeat directions.
8. A method as set forth in claim 7 which further includes the steps of directing a plurality of step and repeat directions culminating in a teach program of all bonding electrodes to the wire bonded, and
checking target bonding points of said teach program automatically.
9. A method as set forth in claim 8 wherein said step of checking target bonding points automatically comprises,
locating the second target bonding points on said lead frame leads at a predetermined distance D from the top of the leads.
10. A method as set forth in claim 1 wherein said step of directing said PRS system to find and record an accurate predetermined second target bonding point comprises,
automatically scanning another portion of said memory map,
processing pixel intensity values to locate a tip edge of a lead frame lead, and
relocating the target bonding point on said lead frame leads a predetermined distance D from said tip edge.
11. A method of automatically relocating target bonding points previously located, comprising the steps of:
automatically teaching the exact center of a plurality of reference bonding pads to provide a plurality of taught first bond targets bonding points on a reference device,
automatically teaching the exact center of a plurality of reference lead frame leads to provide a plurality of taught second bond target bonding points on said referenced device,
automatically teaching and relocating said exact center of said reference lead frame leads a predetermined distance D from the tip of each lead frame lead to be bonded, and
prior to making first and second fine wire bonds at said taught first bond target bonding points and said bond relocated exact center taught bonding points of said lead frame leads,
automatically scanning the lead frame leads of production semiconductor devices to be wire bonded to again relocate the exact center of said production lead frame leads immediately prior to making each second wire bond.
12. A method as set forth in claim 11 wherein the step of automatically scanning the lead frame leads of production semiconductor devices comprises,
first scanning said lead frame leads to establish the edges of the located leads,
determining the exact center of said located leads, and
relocating said exact center of said lead frame leads a predetermined distance D from the tip of each lead frame lead to be bonded.
13. A method as set forth in claim 12 wherein the step of determining said exact center of said lead frame leads comprises the step of scanning a narrow corridor of pixel values stored in a memory map to determine the narrowest width W.
14. A method as set forth in claim 13 wherein the step of scanning comprises scanning a plurality of corridors at different rotational angles.
15. A method as set forth in claim 11 which further includes the step of automatically relocating the exact center of said bonding pads prior to making each first wire bond.
The present invention relates to vision systems of the type employed on wire bonders and die bonders. More specifically, the present invention relates to a novel method for locating a preferred target bond position on a semiconductor device and on a lead frame which form the interconnection points for fine wires during a bonding operation using automatic wire bonding machines and associated vision systems.
Heretofore, automatic wire bonders were known and are classified in U.S. class 228, sub class 4.5 (International Class B23K 20/000). Typical of the early automatic wire bonders is U.S. Pat. No. 4,266,710 which was programmable to be taught predetermined first and second bond positions that could be repeated in a manner similar to numerical control machines to form repeat operations on semiconductor devices in production.
Heretofore, vision systems or pattern recognition systems (PRS) were known and are classified in U.S. class 382, sub class 8 (International Class G06K 9/32). Typical of the early vision systems adapted to be used on automatic wire bonders is U.S. Pat. No. 4,441,205 which was programmable to automatically find the exact X and Y and rotational position of a semiconductor device to be wire bonded using a novel signature generated by adding rows of columns of pixel gray scale intensity values and comparing portions of the generated signature produced from the device to be located with a previously taught sub signature learned (or taught) from a reference semiconductor device whose position was known. The pads on the referenced semiconductor device were also taught during a simulated bonding teach operation. If the production devices were made very accurately, the position of the electrode bonding paths were at the same location taught on the reference device and bonding without relocating the bonding targets was capable of producing high yields of bonded devices.
In using the above mentioned wire bonding patent and the associated vision system patent, it was assumed that the first bond made on bonding pads of the semiconductor were at the predetermined taught positions located manually on the reference device during the teach operation prior to automatic bonding operations on production devices. Further, it was originally assumed that the second bond positions taught on a reference lead frame could be employed to locate second bond positions on production lead frame devices, however, it was found that very high density devices and lead frames did not provide repeatable pretaught locations for second bond positions and it has become necessary to employ some method of checking to determine if the lead frame to which the second bond was to be attached was at the predetermined assumed position. In copending U.S. application Ser. No. 07/085,240, filed Aug. 7, 1987 and assigned to the assignee as the present invention the pattern recognition system was modified to provide an image processing system and a method of verifying the location of the position of the leads on the lead frame. This application teaches that it is possible to locate a candidate lead on a lead frame. Due to false reflections and dark areas on the background between the candidate leads it was necessary to carry out a series of checks and comparisons which consumed enough time to delay the speed of making wire bonded fine wire interconnections between a lead out electrode pad on a semiconductor device and a lead out terminal (or bonding position) on a lead frame. Applicant has concluded that it would be extremely desirable to provide a method and means of substantially improving the accuracy of both the first and second bond position so that all bonds are centered on the pads and leads with sufficient accuracy to meet military specifications, increase the yield of acceptable bonded semiconductor devices and actually increase the bonding speed throughput of devices being bonded.
It is a principal object of the present invention to decrease the time required to teach exact bonding target positions on referenced semiconductor pads and lead frame leads where first and second fine wire bonding interconnections will be made on production semiconductors and lead frames.
It is another primary object of the present invention to increase the accuracy of the location of the first and second bond positions during a teach operation while decreasing the time required to conduct a complete teach operation.
It is another principal object of the present invention to provide a method and means for performing a teach operation using an automatic wire bonder which may be performed by relatively unskilled labor.
It is another principal object of the present invention to automatically locate the semiconductor pads and lead frame leads during an automatic wire bonding operation without decreasing the speed of making wire bonds.
It is another principal object of the present invention to provide a method of locating the exact target bond positions of the next first and second bond positions while performing a wire bonding operation on a previously located first and second bond position.
It is another principal object of the present invention to locate the exact predetermined optimum bonding target on each semiconductor pad and lead frame lead during an automatic wire bonding operation.
It is a general object of the present invention to provide a method and means for substantially eliminating all off center bonds.
It is a general object of the present invention to provide a method and means for eliminating second bond misses.
It is a general object of the present invention to provide a method and means for reducing product overruns by at least one order of magnitude.
It is another general object of the present invention to provide a method and means for reducing the time required for a teach operation by as much as 90%.
It is another general object of the present invention to increase the speed of production of small batches of semiconductor devices and yet provide higher yields.
According to these and other objects of the present invention there is provided apparatus for setting the pad size of a semiconductor pad during a teach operation as well as setting the bonding direction, pitch and number of pads to be located in a series of teach operations. The pattern recognition system on the automatic wire bonder is provided with an electronic indicia for indicating the taught bonding target and is automatically advanced to the next bonding target where the pattern recognition system performs a scan operation which automatically centers itself on the next bonding target using pre-programmed parameters. When there are missing bonding pads or missing leads, the teach operation is automatically interrupted and a position is "skipped", then the next series of bonding positions is taught. Similarly, when the direction, or pitch or lead width changes over a new series of bonding targets, a new teach operation is conducted until all of the first and second bond positions are taught. The information taught may be reviewed and verified before being confirmed and entered as a bonding program. During production wire bonding operations of semiconductor devices to lead frames, the taught bonding program is only used to step the pattern recognition system from one bonding target to the next where the actual bonding point is relocated by the pattern recognition system in order to compensate for differences between bonding points on production devices and production lead frames that differ from the referenced device and the referenced lead frame used to generate the bonding program during the teach operation.
FIG. 1 is an enlarged detail of a corner of a high pin count semiconductor device mounted on a lead frame at the ground plane and having lead frame leads juxtaposed to pads on the semiconductor device;
FIG. 2 is an enlarged detail of a corner of another semiconductor device showing the pads on the device very close to each other;
FIG. 3 is an enlarged detail of three lead frame leads showing irregular spacing and widths of typical leads on which second bonds are to be made;
FIG. 4 is a schematic diagram of a raw video signal showing an increased gray level intensity value which occurs where a pad or lead is found;
FIG. 5 is a schematic diagram of a processed video signal of the wave form shown in FIG. 4;
FIG. 6 is a schematic diagram of a processed wave form signal of the wave form shown in FIG. 5 showing peaks indicative of edges of pads or leads;
FIG. 7 is a flow diagram depicting the steps performed in a typical prior art teach operation of a bond target position;
FIG. 8 is a flow chart depicting the steps which may be performed in teaching a series of first bond positions using the present invention; and
FIG. 9 is a flow chart depicting the steps which may be performed in teaching a series of second bond positions using the present invention.
Refer now to FIG. 1 showing an enlarged detail of a test semiconductor device which was produced to simulate a 304 pin chip with 76 bond points on each side and having skipped spaces between some of the semiconductor pad bond points so as to present an irregular pitch high count device. Further, the test device was produced to simulate an actual semiconductor product to be manufactured for computer applications. Semiconductor device 10 is shown bonded to a ground plane or die paddle 11 connected to a lead frame (not shown) by a tie 12. The lead frame also supports the numerous lead frame leads 13 which are juxtaposed the bonding pads 14 on the periphery of the semiconductor device. Sometimes the pads 14 are referred to as lead out pads or electrodes which are to be bonded by interconnecting a fine gold wire between the pads 14 and a target 16 located at a predetermined distance from the tip of the lead frame leads 13. It will be noted that the lead frame leads 13 are not at constant distance from their associated bonding pads 14 nor are they arranged in a straight or linear fashion nor do the leads have tips which are squared off relative to the axis of the lead frame leads 13. The very high density of this and other similar devices allows substantially no leeway for error in locating the bonding targets at the center of the lead frame leads 13. In some such devices the clearance distance between lead frame leads 13 is so great that the fingers or leads can be bent and moved relative to each other a distance greater than the width of the lead frame lead without touching each other, which is desirable to avoid shorts and inoperable devices However, if this occurs in either the reference semiconductor device or the production semiconductor device, it is obvious that the second bond will not be made at the center of the lead frame lead and a very expensive semiconductor device may be damaged beyond repair Some of these devices now are costing thousands of dollars when bought in quantity.
Refer now to FIG. 2 showing a greatly enlarged detail of a corner of another semiconductor device 17 having a plurality of similar size pads 18. As a typical example, the pads shown could be approximately 31/2 mils on each side and arranged on a 5 mil pitch leaving only 11/2 mils space between pads. Superimposed on one of the pads 18 is a cross-hair 19 and on another pad 18 is a pad outline 21. The purpose for showing the electronically generated cross-hair 19 and pad outline 21 is to show what appears on the television display screen as electronically generated indicia used as an aiming point to locate the center of the bonding pads 18 where the first bond will be made by an automatic wire bonder. Other types of electronically generated indicia have been employed such as other trigonometric shapes to locate the center bonding point. It is known that a ball wire bonder bonds a ball, which is made at a first bond on to a pad 18 which mashes out to 11/2 to 21/2 times the diameter of the wire. If the wire is a 1 mil wire and the pad is a 3.5 mil pad, it is necessary to locate the center bonding point with the automatic wire bonder and its bonding tool to at least one-half of 1 mil to assure that the ball or ball bond is made within the perimeter of the pad 18 to meet a mil spec or best production quality. Ordinarily the bonding pads 18 are made by semiconductor photolithographic processes using mask techniques which permit defining the lines within one-third of 1 micron or 1/100th of a mil. Thus, if the pads are made on the semiconductor device with the most exacting processes available using the latest state-of-the-art equipment they can be accurately located relative to each other and relative in size. Heretofore it was not manually possible to locate the first ball bond at the exact center of an accurately produced bonding pad 18 during a teach operation. Manufacturers of high density semiconductor devices were required to make oversize bonding pads 18 displaced from each other by greater distances than would be required for insulation and design purposes. It will be explained hereinafter that the present invention allows the manufacturers of high density semiconductor devices to shrink the bonding pads 18 and also shrink the peripheral area on which the bonding pads are located by placing them closer to each other.
Refer now to FIG. 3 showing an enlarged detail of three lead frame leads showing irregular spacing and widths of typical leads which are encountered in production. Typically low count lead frames are stamped with precise stamping dies and typically high lead count lead frames are etched using photoresist techniques which increase the accuracy of location of the leads but produce something to be desired on the edge configuration as well as producing fragile fingers which are cantilevered into space. Lead 22 is shown being wider at its tip than along its beam type body. Lead frame lead 23 is shown having a fairly consistent width W but is shown as being irregular as a result of acid etching. The desired target point for the second bond is shown by the cross 24 located at a predetermined preferred distance D from the tip 25 of the lead 23. Lead frame lead 26 is typical of a smooth edge acid etched lead frame lead having a predetermined pitch P distance from its adjacent lead 23 and could ordinarily be bonded at its target point 27 employing the prior art techniques using predetermined bonding points located on a referenced device. However, the pitch P from the target point 24 to the target point 28 is completely off the lead 22 and if bonded using predetermined bonding points taught on referenced devices would result in a missed lead and/or a damaged device.
Assume for purposes of this explanation that a teach operation is being conducted and the aforementioned cross-hair is located over the target point 27 and that the number of leads to be located and the distance from the tip of the lead D is entered into the computer with the pitch P and the width W of the leads. The desired bonding point 27 is entered manually and the vision system is programmed to conduct a scan operation shown by the scan lines 29 to 31 which are representative of a 180� theta scan conducted over 5� increments which determines the orientation of the lead 26 by finding the minimum width W. Thus, it will be understood that the width information W may be obtained automatically and need not be programmed for most teach operations. The narrowest width W occurs along the scan line 30 which is perpendicular to the edge of the lead 26. Having found the edges of the lead 26 it is now possible to electronically relocate the target point 27 even though it may have not been in the exact center of the lead 26. Thus, an unskilled operator that is capable of getting the cross-hair 24 at any target point 27 an a lead 26 has the target bonding point 27 automatically located at the center of the lead in the present invention. Having electronically located the preferred center 27 of the lead 26, it is possible to conduct an orthogonal scan and locate the tip 25 of lead 26. Similarly, the bonding point or target point 27 is relocated by the distance D from the edge 25 to the new target point 27 resulting in the taught bonding point 27 being at an exact predetermined distance D at the center of lead 26. It is now possible to step a distance P from the new point 27 to an adjacent lead at its approximate bonding point location and repeat the process so that the new bonding point 24 for lead 23 is located at the center of the lead 23 at a preferred predetermined distance D from the tip 25. When the novel programmed pattern recognition system is employed in the teach operation to find the preferred bonding point of lead 22, the assumed bonding point 28 is off the lead 22. However, the scan lines 29 to 31 are conducted over a space or area S which embraces both edges of leads 22 and locates the two side edges of lead 22 and locates its scan line 30 orthogonal to the edges of lead 22 as explained hereinbefore. After locating the center target point 20 Of the lead 22, the distance D is determined from the center point and the final target point 20 is then located even though the lead 22 is skewed from its normal axis. It will be understood that sequential stepping and locating of the actual center of the leads at a preferred distance D can be accomplished on any number of leads that have a similar pitch P. When the device being bonded is similar to the device 10, it will reach a point where no interconnecting wire is to be connected to one of the leads. At this point, the operator presses a skip button which enable the pattern recognition system to skip over a single lead and start repeating the series of lead recognition and target point location operations as explained hereinbefore. It is possible to step from one lead to another or automatically step through a number of leads or interrupt a sequence of operations so that the teach operation is conducted substantially automatically by unskilled operations.
It is possible to do a location operation on all of the pads 14 before proceeding to locating the target points on all of the leads 13. It is also possible to teach from pad to lead alternately knowing the pitch between the pads and the pitch between the leads because all the pattern recognition system has to know is to be informed whether it is to locate a first bond or second bond target and the sequence to be followed. On a high pin count device similar to that shown in FIG. 1, locating manually the precise locations of the bonding points during a teach operation may require four hours. However, this time can be reduced to approximately 15 minutes using the present invention. Since the teach operation in the present invention is only used for the approximate location for production bonding it will be understood that the final bond positions are much more accurately located than was possible using the prior art methods and apparatus.
Refer now to FIGS. 4, 5 and 6 showing wave forms employed in the pattern recognition system of the preferred embodiment of the present invention to rapidly find edges of pads and leads. The pattern recognition system of the type shown and described in U.S. Pat. No. 4,441,205 and other commercially available pattern recognition systems all employ video cameras to produce analog signals which may be converted into digital signals and stored in the memory of the associated computer system. The values stored are gray scaled intensity values of the individual pixels and are preferably mapped as full frame maps and/or corridors of the video image. Thus, FIG. 4 is representative of the value of a corridor of information stored in the memory of the pattern recognition system along a scan line which traverses either a pad or a beam. The intensity level shown at point 32 is off lead or off pad and the intensity ramps up over approximately a half pixel to the high reflectivity level or high intensity level 33 as it crosses over a highly reflective lead or pad. Similarly, the intensity level when it reaches the opposite edge ramps down over a half pixel displacement to the same level 32 after leaving the metalized layer of the pad or lead. In the preferred embodiment of the present invention, the information in digital form shown in FIG. 4 may be differentiated so as to produce magnitude peaks 34 and 35 which occur at the ramp up and ramp down portions of curve 32, 33. It is now only necessary to find the center averaged line of the peaks 34 and 35 to determine the edges of the metalized layer of the pad or lead being scanned. The distance X between the center of the peaks 34, 35 is indicative of either a width W of a lead or the side of a pad as the case may be and this distance X may be used to check that the area being scanned on the semiconductor device is truly a pad or a lead. Wave form 36 of FIG. 6 is indicative of the information processed in the computer to determine the distance X between peaks 34 and 35. Several different methods may be employed to compute the peak locations such as paraboloid fit, signature and sub-signature comparison and/or peak detection. However, the fastest and most reliable of these methods is the preferred method for the present invention. In theory, comparison of signatures with sub-signatures should produce the fastest accurate result. However, paraboloid fit comparison will produce greater accuracy and can be performed by high speed computer chips dedicated to the process. It is possible in the present invention to perform the teach operation to obtain the suggested taught bonding program and to start the actual production at a predetermined pad or lead. The automatic wire bonder then bonds a pad to a lead while the pattern recognition system is calculating the actual bonding points for the pads and leads to be bonded next. Thus, it will be understood that in the present invention there is no requirement that the actual bonding points be located at any particular time, however, it is more efficient to locate some or all bonding targets prior to the time bonding will occur.
Refer now to FIG. 7 showing a flow chart depicting the steps performed in a typical prior art teach operation. Block 37 indicates that the automatic wire bonder and its pattern recognition system is powered up and the operator has selected an electronic image of the type explained herein before with reference to FIG. 2 Block 38 indicates that the electronic image size may be varied to accommodate the size of the pad or lead being targeted for the teach operation. In the prior art system the operator was required to move the electronic image to a bond target on the pad or lead as close to center as visually and dexterously possible as shown in block 39. Having once located the bonding target at block 39, it is now possible to press an enter key which records the XY coordinates of the targeted location or electronic indicia as shown at block 41. In the prior art teach system, it was necessary to manually maneuver the electronic image to each of the bonding points on the pads and leads of the device to be bonded as shown at block 42. One of the prior art methods used by a typical large semiconductor manufacturer was to sequence the pattern recognition system through a sequence simulating the bonding operation after performing the teach operation to perform the following: if the electronic cross-hair representative of the bonding point is on a lead at a desired bonding point, then a corridor for scanning may be displayed and rotated so that it is orthogonal to the edges of the lead so that this corridor would be used during the actual production operations to scan for the width of the lead. During this secondary teach operation, the width of the lead may be recorded and used as a check to determine if the leads actually being bonded during bonding operations are the same width as the lead taught on the reference device. Thus, if the actual bonding width of the device being bonded did not fall within the program tolerance of the width permitted, the bonding operation would cease and require manual assistance.
Refer now to FIG. 8 showing a flow chart depicting the steps which may be performed in teaching a series or first bond positions using the present invention. The block 37 is similar to the block 37 in FIG. 7 in which an electronic image or indicia is selected. In the present invention, the pad size may be programmed into the PRS system as a check option as shown in block 43. In block 44 it is possible to set the pad finder or deactivate the pad finder for different reasons. For example, some devices require rectangular pads for multiple bonds and the pad finder feature is not used for such pads. In order to start the auto teach operation, it is necessary to start at a reference point. While such a reference point could be located automatically, it is extremely difficult and in a preferred embodiment of the present invention the electronic image is moved to the first bond target as shown in block 45. As long as the electronic image is on or embraces the bond target point, it is possible to enter an X-Y approximate bond point and the pattern recognition systems locates the exact desired center bonding point as shown in block 47. The vision system indicates the automatically selected bonding pad center and bonding point as shown at block 47 during the teach operation. It is now possible to enter various information into the pattern recognition system such as the number of bonding points to be located in sequence or a series of step operations. The direction in which the sequence is to be executed and the approximate pitch to the next bonding point as shown in block 48. By now pressing the start or enter button a whole series of automatic center locations for bonding points is performed. This sequence of operations occurs so rapidly that it is impossible to visually check the system accuracy and it is shown at block 49 that each sequence may be repeated to visually indicate the actual bonding point entered into the teach program. This sequence of operations may be conducted automatically with a pause between or may be conducted by a step operation controlled by the operator as shown at block 51. Having checked the location of the bonding points, it is now possible to enter these reference taught program bonding points into the computer of the pattern recognition system as shown at block 52.
In the present invention it is possible to teach all of the pads with the vision system and then teach all of the leads. This may be done automatically or semi-automatically as shown by the loop designated 53. It is also possible to program one pad and then one lead and return to the next pad as shown by the loop 54 which returns after locating the second bond via line 55 which connects to loop 53. It will be understood that in some programs the teach operation is entered automatically having once designated the bonding points without subsequent verification.
Refer now to FIG. 9 showing a flow chart depicting the steps which may be performed in teaching a series of second bond positions. It is assumed that power is up and the electronic image for the second bond has been selected and shown at block 56. With the screen and menu active, it is now possible to set the lead tip distance, set the lead pitch, set the target area S and set the number and direction of leads to be sequenced as shown at block 57. Once the lead frame parameters are set, it is now possible to disable the view lead locator (VVL) when an irregular lead is encountered as shown at block 58. It is now possible to start auto lead detection assuming that the view lead locator system is active by moving the electronic image to a bond target and entering a start operation as shown at block 59. After the start or enter button is depressed, the PRS system performs the auto theta scan operation described hereinbefore and locates the edges of the lead being taught or learned as shown at block 61. The vision system now indicates the located lead center and determines the distance D from the tip which was previously entered as a desired parameter as shown at block 62. The bonding point or target point 27 so determined by the auto teach operation is now indicated and may be approved or rejected as shown at block 63. It is now possible to enter into an automatic series of teach operations or to manually step from one lead to the next lead as shown at block 64 and as each lead target point is selected the pattern recognition system may automatically teach the next bonding point on the next lead via loop 65.
It is possible to bypass the manual or pause feature and enter the automatic loop 65 or it is possible to go to a next first bond position as shown at block 66 after the first bond position is located in a manner explained heretofore with reference to FIG. 8. The pattern recognition system comes back to the second bond via the auto loop 65 and the pattern recognition system does an automatic theta and locates the edges of the next lead as shown at block 61. While the enter verify mode-set pause block 67 is shown as the last block in the sequence, it is possible to conduct verification of individual bonding points by inserting this functional block at block 68 between blocks 63 and 64.
Having explained a preferred embodiment of the present invention with reference FIGS. 8 and FIG. 9 where the auto teach operation is the dominant feature of the present invention, it will be understood that the identical structure and mode of operation of part of the teach operation is again employed during the actual bond operation to relocate the bonding target positions on the pads and leads prior to conducting an automatic bond operation with an automatic bonding machine. For most semiconductor devices, the location of the pad on the semiconductor device can be manufactured so accurately during production the semi-conduction devices and again located during a teach operation by the electronic PRS system that individual pad relocation is usually not required during a bonding operation. When mil spec semiconductor devices and very expensive devices are being bonded it may be desirable to buy the insurance of the time required for the auto teach operation auto relocate operation of all of the bonding pads prior to conducting the bonding process which may be done in approximately 0.050 seconds. This could increase the bonding time of the device by up to approximately 50%, but produces near perfect yields.
In the preferred embodiment of the present invention, it is possible to program the pattern recognition system to only bond on first and second bond target positions which meets specified tolerance positions and eliminate or skip the wire connections where target bond positions are indicated that could cause inoperable devices. Thus, the present invention serves as a inspection or check of the integrity of the parts being bonded. In the prior art pattern recognition systems no such check was ever performed. In the prior art the bonding targets for first and second bonds were not relocated for each device being production bonded prior to actual bonding operations.
One of the reasons the prior art pattern recognition systems were not able to relocate the bonding target position on the leads accurately was because the tip geometries of the leads of most lead frames are not in a straight line adjacent to each other nor are they cut orthogonal to the sides of the lead edges. The present invention system having located the preferred bonding point in the center of the lead is capable of locating or relocating this bonding point at an accurate distance from the tip which was not done heretofore.
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