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Customizable semiconductor/devices, integrated circuit gate arrays and techniques to produce same are disclosed. The devices comprise integrated circuit blanks having a collection of semiconductor elements and at least one metal layer including fusible links interconnecting said collection of semiconductor elements into an inoperably connected integrated circuit blank. At least one metal layer is first etched thereby to define a pattern of conductors. A passivation layer is provided over at least one metal layer, afterwhich at least one metal layer is etched a second time for selectably removing the fusible links, thereby converting the inoperable integrated circuit blank into a selected operable electronic function.
1. A CMOS gate array device comprising:
a substrate,
a collection of individual semiconductor elements formed on the substrate, and
a plurality of links interconnecting the collection of individual semiconductor elements into an inoperably connected CMOS gate array device, some of said plurality of links having designated fuse locations,
said collection of semiconductor elements being interconnected for converting the inoperable CMOS gate array device into a selected operable electronic function upon disconnection of predetermined ones of plurality of links at said designated fuse locations.
2. A CMOS gate array device according to claim 1, wherein said collection of semiconductor elements is comprised of transistors, and the substrate is comprised of silicon.
3. A CMOS gate array device according to claim 1, wherein said plurality of links comprise a first plurality of connection links operative to provide a plurality of connections between individual semiconductor elements to define functional groupings thereof, and a second plurality of connection links operative to provide a plurality of connections between the functional groupings.
4. A CMOS gate array device according to claim 2, wherein said plurality of links comprise a first plurality of connection links operative to provide a plurality of connections between individual semiconductor elements to define functional groupings thereof, and a second plurality of connection links operative to provide a plurality of connections between the functional groupings.
5. A CMOS gate array according to claim 3, wherein said functional groupings define individual cells.
6. A CMOS gate array according to claim 4, wherein said functional groupings define individual cells.
7. A CMOS gate array device according to claim 3, wherein both the first and second pluralities of connection links are fusible for defining the operable function of the device upon the fusing of predetermined one of said connection links.
8. A CMOS gate array device according to claim 4, wherein both the first and second pluralities of connection links are fusible for defining the operable function of the integrated circuit upon the fusing of the predetermined connection links.
9. A CMOS gate array device according to claim 1, wherein said plurality of links are arranged for fusing in response to the direct application of separating means from an external fusing apparatus.
10. A CMOS gate array device according to claim 2, wherein said plurality of links are arranged for fusing in response to the direct application of separating means from an external fusing apparatus.
11. A CMOS gate array device according to claim 9, wherein said separating means is laser radiation directed to the fusible links and from an external laser cutter apparatus.
12. A CMOS gate array device according to claim 10, wherein said plurality of links interconnect the collection of semiconductor elements for fusing in a plurality of alternative arrangements.
13. A CMOS gate array device comprising:
a substrate,
a collection of transistors mounted on the substrate having input/output pins for operating the CMOS gate array device and,
a plurality of links connecting the transistors into an inoperable circuit device, said plurality of links having designated fuse locations and being without electrical fusing connections capable of fusing the links at said fuse locations by electrical current supplied through the input/output pins of the circuit, said collection of transistors being interconnected for converting the inoperable circuit device into an operable circuit device upon disconnecting of predetermined ones of said plurality of links at ones of said designated fuse locations.
14. A CMOS gate array device according to claim 13 and wherein the transistors have input/output pins and wherein the plurality links are without electrical fusing connections capable of fusing by electrical current supplied through the input/output pins of the device.
15. An integrated circuit device according to claim 13 and wherein the device is in the form of a die.
This application is a continuation of Ser. No. 07/626,199, filed Dec. 7, 1990, abandoned, which is a CIP of 07/344,582, filed Apr. 28, 1989, issued as U.S. Pat. No. 5,049,969, which is a CIP of Ser. No. 07/222,514, filed Jul. 21, 1988, issued as U.S. Pat. No. 4,933,738, and is a continuation of Ser. No. 07/499,063, Dec. 18, 1989 issued as U.S. Pat. No. 4,924,287, which is a continuation of Ser. No. 07/311,397, Feb. 16, 1989, abandoned, and a continuation of Ser. No. 273,706, Nov. 15, 1988, abandoned, which is a continuation of Ser. No. 819,707, Jan. 17, 1986, abandoned.
The present invention relates to semiconductor devices generally and more particularly to customizable semiconductor devices and to a technique for fabricating same.
Integrated circuits are electronic circuits which normally include a very large number of semiconductor elements, such as transistors and diodes, as well as other electronic components, in highly compact form on a silicon wafer. The basic principle underlying integrated circuits is that instead of building an electronic circuit out of discrete components such as transistors, diodes, resistors and capacitors, the entire circuit is fabricated on the same piece of silicon in the form of a number of superimposed layers of conducting, insulating and transistor forming materials. By arranging predetermined geometric shapes in each of these layers, a circuit having a required function is realized.
The process by which an integrated circuit is fabricated is long and complex and basically includes the following steps:
1. A polished silicon wafer is exposed to an appropriate material in a high temperature furnace in order to "grow" a uniform layer of the material on its surface.
2. After the wafer is cooled, it is coated with a thin film of resist material, which is dried and baked.
3. At the same time, a mask for the appropriate layer is created, which defines the precise pattern required on the silicon surface.
4. This mask is brought firmly into proximity with the coated wafer and exposed to intense ionizing radiation such as ultraviolet light or low-energy x-rays. In areas wherein the mask is transparent to such radiation, the ionizing radiation passes into the resist and breaks down its molecular structure. The portions of the resist that are covered by opaque portions of the mask are not affected.
5. The resist is then developed by immersing the silicon wafer in a solvent which dissolves the resist only at the locations which were exposed to the ionizing radiation.
6. The wafer is then exposed to an appropriate etching material which is effective to remove the material grown previously thereon (Step 1), except where the material is covered by resist, thus defining a desired pattern of the grown material.
7. The remaining resist material is then removed.
The above process is repeated for each of the layers of material Forming the integrated circuit. In most integrated circuit technology one or more layers of metal are employed For internal connections on the integrated circuit. These metal layers are usually formed last.
As can be readily appreciated, the above process requires sophisticated machinery and custom masks which must be specially set up for each specific type of custom integrated circuit to be fabricated. For the process to be at all economical, extremely large quantities of integrated circuits must be produced for a given set up. Since there exist applications wherein the quantities desired of a specific circuit are not extremely large, techniques have been developed for producing integrated circuits known as gate arrays. In these gate arrays, a large amount of transistors and other components are produced by the above-described mass production techniques. Specific interconnections therebetween suitable for a specific circuit are then formed on the chip by etching a suitable metal layer thereon. There exist advanced gate-arrays wherein two or more layers of custom metal interconnections may be custom etched.
Despite the use of sophisticated computer aided design and semi-custom devices, the widespread use of dedicated non-standard integrated circuits is still limited because of the high costs and long lead time involved in their fabrication. Many users of integrated circuits still make extensive use standard, "off the shelf" available small scale and medium scale integrated circuits.
Electronic circuits manufactured by combining a large number of such standard integrated circuits have a number of disadvantages:
a. A large number of printed circuit boards are required, resulting in an expensive product, relatively long assembly time, relative difficulty in maintenance and troubleshooting and large size.
b. Lower electrical power efficiency is realized. As a result, relatively larger power sources are required and heavier and larger products result.
There are known integrated circuits such as EPROMS and PALS (programmable array logic) which are programmed by fusing which is accomplished electrically via the integrated circuit's input/output pins, requiring elaborate extra fusing circuitry for this purpose.
There are also known techniques for increasing yield of integrated circuits by excising inoperative portions thereof by fusing. This is normally done on wafers including a multiplicity of integrated circuits.
It is also known to produce gate arrays which are laser programmable. Such devices are described in a publication of Laserpath, Inc. of Sunnyvale, Calif. 94086 U.S.A. entitled "One Day Prototype Laser Programmed Arrays" dated Feb. 26, 1986.
Dual metal layer integrated circuit technology has been developed in recent years to enable automatic computer software controlled generation of integrated circuit layouts, commonly known as routing. In the early years of integrated circuit development, routing was done by hand. Due to the increased complexity and density of contemporary integrated circuits, manual routing is no longer possible.
Dual metal layer technology provides two independent routing layers extending in respective perpendicular directions, commonly termed North-South and East-West. Changes in direction are provided by vias which interconnect the two layers, the vias typically being defined by an opening in the insulating layer between the two metal layers, being filled by metal from one of the two layers. A simple dual mental layout wherein vias are positioned at the locations of the desired direction changes is shown in FIG. 10A, wherein the horizontal strips are typically a metal I layer, indicated as M1, the vertical strips are typically a metal II layer, indicated as M2, and the vias interconnecting the two layers are labeled. The metal II layer overlies the metal I layer.
In order to permit rapid customization of dual metal type integrated circuits, it is desired that such customization be solely produced by fuse disconnection rather than by applying metal across a gap. Accordingly, configurations such as that shown in FIG. 10B were developed to combine the advantages of automatic routing with those of rapid customization, such that customization can be carried out by an automatic routing technique. In the configuration of FIG. 12B the North-South strips are indicated to be metal II while the East-West strips are indicated to be metal I and a via connecting the metal I and metal II layers is disposed adjacent each crossing of the respective metal I and metal II strips. The via underlies the metal II strip and is joined to the metal I strip by means of a branch having a fuse formed thereon. Fuses are also provided along the metal II strips between adjacent vias and along the metal I strips between adjacent branches.
Customization of the blank shown in FIG. 10B takes place by traveling along the metal I strips and fusing all fuses on the branches which are not used. If a direction change is desired, a branch is used to establish a connection to the metal II layer. When traveling along the metal II strips, if the desired direction of the strip is, for example, West, the fuses lying to the East are fused or vice versa. FIG. 10C illustrates the equivalent circuit to that shown in FIG. 10A embodied in the structure of FIG. 10B, where /'s over the fuse indicate fused fuses.
U.S. Pat. No. 4,197,555 to Uehara describes a structure in which a relatively long strip of M1 is used. Although this structure is adequate for PAL configuration applications, it is relatively unsuitable for gate array applications, particularly if an automatic place-and-route program is used. Also, the length of the M1 strip acts to increase the line capacitance.
The present invention seeks to provide selectably customizable semiconductor devices of the types described above which are suitable for prototype and small scale production and which are compact and thus compatible with high-density architecture, and is useful inter alia in gate array technology and particularly in CMOS gate array technology.
The present invention also seeks to provide a technique for production of the selectably customizable integrated circuits from finished integrated circuit blanks whereby it is possible to selectively remove portions of the metal conductor at a plurality of metal layers in the finished integrated circuit blank using a single mask.
The present invention will be understood and appreciated more fully from the following detailed description taken in conjunction with the drawings in which:
FIG. 1 is a general illustration of one type of an integrated circuit of conventional design to which the invention may be applied;
FIG. 2 is a detailed illustration of a portion of a layout shown in FIG. 1, illustrating fusible interconnections between individual semiconductor elements and between functional groups of areas defining gates;
FIGS. 3A, 3B and 3C are illustrations of the part of the integrated circuit shown in FIG. 2, wherein selected ones of the fusible interconnections have been fused, in three different configurations;
FIGS. 4A, 4B and 4C are illustrations of the electrical equivalent circuits to the circuits of FIGS. 3A, 3B and 3C respectively;
FIG. 5 is an enlarged illustration of a metal on metal structure of a gate array according to still another preferred embodiment of the invention;
FIG. 6 is an enlarged illustration of the structure of FIG. 5 configured to define the layout of FIG. 10A;
FIG. 7 is a block diagram illustration of apparatus for use in customizing integrated circuits;
FIG. 8 is a pictorial overlay illustrating the layout of a portion of a customizable array useful in an embodiment of the present invention;
FIGS. 9A-9D are illustrative sectional views representing the various stages of a technique provided in accordance with one embodiment of the present invention;
FIGS. 10A-10C are illustrations of prior art layouts.
The invention is applicable to a portion of a typical CMOS gate array circuit of the type illustrated in FIG. 1A of U.S. Pat. No. 4,924,287. The CMOS gate array is used as an example for the purposes of illustration herein. The invention is equally applicable to other types of gate arrays such as, for example, ECL and TTL and to the various designs of gate arrays of these types and others made by various manufacturers. The invention is also applicable to integrated circuits in general other than gate arrays.
The typical CMOS gate array circuit includes an array of semiconductor elements which may be interconnected by at least one and typically two suitable metal layers to define the electrical function of the circuit. According to the present invention, fusible links are provided between the semiconductor elements in a manner which enables the functions to be selected by the user.
The basic structure of FIG. 1 is as follows: A first plurality of gates 20 arranged on the integrated circuit is separated from a second plurality of power lines 30, arranged as part of the at least one metal layer of the integrated circuit by sections 40 of layered semi-conductor material such as doped silicon. The interconnections between the various conductors define the electronic function provided by the integrated circuit.
More specifically each junction across the semi-conductor material defines a semiconductor element in its most basic Form. A combination of these junctions may define a cell and a plurality of such combinations may define an electronic function equivalent to a plurality of cells.
The illustration of FIG. 1 does not illustrate the interconnections between the semiconductor elements. Those interconnections are provided in accordance with the present invention, as illustrated in FIG. 2.
FIG. 2 illustrates a portion of the gate array of FIG. 1 onto which interconnections have been made in accordance with the present invention. The interconnections are made by and between the metal interconnections layers formed, normally, as the layers before the last layer during the fabrication of the integrated circuit.
Turning to FIG. 2, and adopting the reference numerals already used in connection with FIG. 1, it is seen that gates 20 and groups 22 of gates 20 are interconnected directly or through underpasses 24, by means of a multiplicity of fusible links 50. Fusible links 50 also interconnect gates 20 with power lines 30. According to a preferred embodiment of the present invention, the fusible links 50 provide a plurality of alternative interconnections between the various gates and power lines, such that until some of the fusible links are fused, the gate array is not practically useful.
It is emphasized that the invention is not limited to any particular pattern of fusible link interconnections between conductors.
Further in accordance with a preferred embodiment of the present invention, the fusible links are not arranged such that they can be fused by means of providing electrical current through the external connections of the integrated circuit. No such electrical connections are provided for that purpose. Thus fusible links 50 are adapted for fusing by application of energy locally to the links themselves or to the vicinity thereof. Obviating the need for electrical connections for fusing greatly simplifies the design and increases the circuit carrying capacity of integrated circuits.
The fusible links 50 illustrated in FIG. 2 have a number of different functions. They may serve as "substructure" links which join semiconductor elements so as to define functions of individual logic gates. Alternatively or additionally they may serve as "interconnection" links, which serve to join individual cells in a predetermined order to provide a desired multiple cell function. This is known as "routing" due to the necessity to rout the interconnections properly to avoid undesired short circuits. FIG. 2 shows a circuit having inputs A,B,C, and D and an output O.
The effect of fusing selected fusible links will now be considered with reference to FIGS. 3A-3C and 4A-4C. To aid in this consideration, the individual fusible links illustrated in FIG. 2 will be identified by numbers beginning with 101.
In FIG. 3A, the following links are fused: 102, 104, 106, 108, 109, 114, 116, 117, 118, 119, 120, 121, 126, 127, 129 and 131. The remaining links remain intact.
FIG. 4A illustrates the resulting equivalent logic circuit which includes a NAND gate 150 operating on inputs A, B and C and a second NAND gate 152 operating on the output from NAND gate 150 as well as input D. The output O from NAND gate 152 is the logic Function: A B C+D.
In FIG. 3B, the following links are fused: 101, 103, 104, 107, 108, 109, 114, 115, 116, 117, 118, 119, 120, 121, 123, 129, 130 and 131. The remaining links remain intact.
FIG. 4B illustrates the resulting equivalent logic circuit which includes a NAND gate 150 operating on inputs B and D and a second NAND gate 152 operating on the output from NAND gate 150. The output O from NAND gate 152 is the logic function: B D.
In FIG. 3C, the following links are fused: 102, 104, 106, 110, 114, 116, 117, 118, 119, 120, 121, 126, 127 and 132. The remaining links remain intact.
FIG. 4C illustrates the resulting equivalent logic circuit which includes a NOR gate 158 operating on inputs A, B and C and a second NOR gate 160 operating on the output from NOR gate 158 and input D. The output O from NOR gate 160 is logic Function: (A+B+C)D.
From the above examples it may be appreciated that the following fusible links may be considered as "substructure links": 108, 109, 110, 111, 112, 113, 130, 131, 132, 133 and 134.
Likewise, the Following fusible links may be considered as "interconnection" links: 101, 102, 103, 104, 105, 106, 107, 114, 115, 116, 117, 118, 119, 120, 121, 122, 124, 125, 126, 127, 128, and 129.
It is possible, of course, for fusible links to have both functions.
The process of integrated circuit fabrication in accordance with the present invention is summarized as follows: The steps include providing a conventional gate array or any other integrated circuit without an interconnection layer and providing interconnections between the various elements in the gate array including multiple fusible connections, as shown hereinbelow with reference to FIGS. 5 and 6. Alternatively, they can be carried out by the manufacturer of the integrated circuit in accordance with the present invention.
The integrated circuit is then supplied to the customer, such as a manufacturer of electronic equipment. In the form supplied, the integrated circuit is normally not usable for any usual commercial function.
The customer then fuses selected fusible links on the individual integrated circuits to define a particular desired electronic function. According to an embodiment of the invention with reference to FIG. 7, the fusing step is carried out by operation directly on the fusible link by a source of fusing energy, such as laser energy. According to an alternative embodiment of the invention with reference to FIGS. 9A-9D, the fusing step carried out using etching techniques. Once the appropriate links have been fused, as aforesaid, and the integrated circuit has been tested appropriately, it is ready for incorporation into an electronic system.
Reference is now made to FIG. 5, which illustrates a metal on metal routing structure of a device constructed and operative in accordance with the present invention. The structure of FIG. 5 is similar to that shown in FIG. 10B but provides sharing of vias by two adjacent strips. This arrangement has been found to be highly effective in providing enhanced compactness. For convenience in description, directions East, West, North and South are defined on FIGS. 5 and 6. These designations have no other significance and do not indicate any preferred orientation of the device or of the metal structure thereof.
A first metal layer 74, typically metal I, is disposed in the plane of the paper and comprises a plurality of parallel elongate strips 76, extending East-West. A second metal layer 70, typically metal II, is disposed in a plane generally parallel to the plane of the first metal layer and is electrically insulated therefrom. The second metal layer comprises a plurality of parallel elongate strips 72, extending North-South.
It is noted that the regions at which the strips 72 and 76 overlie in electrically insulative relationship are here termed elongate strip overlap locations and are indicated by reference numerals 78.
Interconnecting adjacent pairs of elongate strips 72 are a plurality of branch strips 80. The branch strips 80 are straight and extend in overlapping relationship with strips 76. Formed on each of branch strips 80 are a pair of fusible links 82 and 84. Intermediate the fusible links 82 and 84 is a branch overlap location indicated by reference numeral 86. It is noted that branch overlap locations 86 are not found at elongate strip overlap locations 78.
At each branch overlap location 86 there is defined a via 88, providing electrical communication between the branch 80 and the elongate strip 76.
Additionally fusible links, here labelled 90, are provided along strip 76 between adjacent pairs of strips 72. Fusible links 92 are provided along strips 72 between adjacent strips 76.
The structure of FIG. 5 is highly compact but requires the ability to fuse a metal II fuse without disturbing an underlying metal I strip.
Reference is now made to FIG. 6 which illustrates the structure of FIG. 5 which has been customized to correspond to the circuit layout of FIG. 10A. Fuses which have been fused are shown with a superimposed /.
Reference is made to the following copending patents and applications of the Applicant: U.S. Ser. No. 819,707, filed 17 Jan. 1986 and issued May 8, 1990 as U.S. Pat. No. 4,924,287; U.S. Ser. No. 117,943, filed 6 Nov. 1987; U.S. Ser. No. 172,235, filed 23 Mar. 1988 and issued 24 Oct. 1989 as U.S. Pat. No. 4,875,971; U.S. Ser. No. 117,580, filed 6 Nov. 1987; U.S. Ser. No. 222,514 filed 21 Jul. 1988 and issued 12 Jun. 1990 as U.S. Pat. No. 4,933,738; and U.S. Ser. No. 344,582, a continuation of U.S. Ser. No. 222,514, filed 28 Apr. 1989. The disclosures thereof, which are incorporated herein by reference, pertain to apparatus and techniques, particularly with respect to fusing, which may be useful in putting the present invention into practice.
It will be appreciated that the layers referred to hereinabove as metal I and metal II layers need not, in fact, be made specifically of metal, but rather may be formed from any suitable electrically conducting material.
Reference is now made to FIG. 7 which illustrates, in block diagram form, apparatus for fusing fusible links 90 utilizing laser energy. The apparatus is based on a conventional laser cutter 200 such as that manufactured by Florod Corporation of Hawthorne, Calif., U.S.A.
A dedicated workstation 202 is preferably but not necessarily provided for input of desired design and operation data and may include logic simulator apparatus 204, circuit verification apparatus 206, as well as automatic placement and routing apparatus 208 and 210 respectively for determining the cutting pattern design.
The workstation 202 communicates with various input and output elements, such as a graphics terminal and tape or disk storage apparatus, not shown and also communicates with a host computer 212, such as a PDP-11/23. The host computer receives the cutting pattern design from the workstation and provides control commands to the laser cutter 200 and positioning apparatus 214. A position verifier circuit 216 provides confirmation of correct positioning and cutting. Additional testing and cut program recording apparatus 218 and 220 is also provided. The information recorded in apparatus 220 may be used for direct mass production of integrated circuits including a metal layer laving the desired interconnection links.
It will be appreciated by persons skilled in the art that the invention can be carried out using the conventional Florod laser cutter or equivalent available apparatus together with conventional available computer technology without the special purpose apparatus described in FIG. 7.
Reference is now made to FIGS. 8-9D, which illustrate a technique for manufacture of a customized integrated circuit in accordance with a preferred embodiment of the present invention.
Specifically considering FIGS. 8 and 9, a portion of a customizable integrated circuit blank is seen wherein strips of a metal I layer 410 and of a metal II layer 412 are generally arranged in mutually perpendicular orientation so as to define a grid. Vias interconnecting the metal I and metal II layers are indicated at reference numeral 414 and contacts for the connection of semiconductor elements, such as transistors, are indicated at reference numeral 416.
The metal I and metal II layers 410 and 412 are separated by insulative material, not shown, which prevents electrical contact therebetween, except at vias 414.
The arrangement of the various layers may be additionally appreciated from a consideration of FIG. 9A, which illustrates in section a portion of an integrated circuit blank. The blank includes a substrate 420 onto which is formed semiconductor material layers 422, 424, 426 and 428. A contact layer 430 is formed thereover, typically comprised of an insulative material, such as SiO2, and with contact holes 432 formed therein to allow contacts to be made between the semiconductor elements 424 and 428 and metal 410 formed thereover.
A metal I layer 410 is formed over the contact layer and defines a contact 432 in electrical contact with semiconductor material 424. A via layer 434 is shown disposed over metal I layer 410, and metal II layer 412 is shown disposed over via layer 434 and extending therethrough at vias 414 into electrical contact with the metal I layer 410. A passivation layer 436 is formed over the metal II layer 412 and the via layer 436, where exposed.
It is a particular feature of the present invention that the various layers are configured such that the metal I and metal II layers are always exposed for etching at locations where removal thereof may be desired thereby to produce fusing. This is seen from a consideration of FIG. 8 which shows a multiplicity of fusible links, or potential removal regions, 438 wherein those fusible links for the metal I layer are not covered with the metal II layer.
The technique of the present invention will now be described with particular reference to FIGS. 9A-9D. The configuration illustrated in FIG. 9A and described hereinabove is characteristic of a integrated circuit blank which is ready for single mask specific configuration in accordance with a preferred embodiment of the invention.
In accordance with the present invention, as illustrated in FIG. 10B, a photoresist layer 440 is deposited over the passivation layer 436. Then, in accordance with a preferred embodiment of the present invention, an application-specific mask may be used to expose the photoresist layer 440 and to define openings 442 in the photoresist layer. This application-specific mask defines openings 442 at desired regions selected from the potential fusible links 438 which are called for by the given application.
Following exposure of the photoresist layer, the photoresist overlying the selected fusible links 438 is removed, thereby defining the openings 442. The passivation layer 436 and the via layer 434, where present, are removed, as by etching at the regions defined by openings 442. The result of such removal is illustrated in FIG. 9C.
The metal layers, which typically include both metal I and metal II layers, are then removed at the regions underlying openings 442, as by etching. The result of this removal is illustrated in FIG. 9D and provides an application specific integrated circuit in accordance with the present invention.
If desired, an additional passivation layer may be added over the integrated circuit.
According to an alternative embodiment of the present invention, a generalized mask may initially be used to expose photoresist layer 440 at all of the potential fusible links 438. Thereafter the photoresist at the exposed region is removed and the passivation layer 436 and the via layer 434, where present, are etched at all of the exposed potential fusible links 438. The etched wafers are then covered once again with photoresist. Only thereafter is a single application-specific mask used to define those potential fusible links 438 at which metal II and/or metal I is to be removed.
One advantage of this alternative technique, particularly when a precisely formed general mask is employed, is that the subsequently used single mask need not be as precise in its pattern definitions of the region to be removed, since the configuration of all of the potential fusible links has already been precisely defined by the general mask. As a further alternative, the general mask may in fact be comprised of a plurality of general masks, each specifically configured for a given metal layer, which masks are sequentially exposed.
It is a particular feature of the present invention that openings 442 define windows which relate to a particular predetermined customized configuration of a mass-produced, relatively general purpose integrated circuit blank. It is also a particular feature of the present invention that a plurality of metal layers are etched simultaneously.
In accordance with a preferred embodiment of the present invention the mask may be produced by laser radiation of chrome or any other suitable material. According to one embodiment of the invention, the application-specific single mask may be generated from the general mask by blocking the regions corresponding to non-selected potential fusible links 438.
It will be appreciated by persons skilled in the art that the present invention is not limited by what has been particularly shown and described above and is defined only by the claims which follow:
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Police: Man arrested picking up potNovember 16,2012
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CHATTANOOGA, Tenn. –TDOT bridge inspectors will perform their regular quarterly inspection on the Market Street Bridge in downtown Chattanooga on Sunday, February 6, 2011. Beginning at 8:00 a.m. EST the bridge will be closed to traffic as crews conduct the inspection and open the drawbridge portion of the bridge. The bridge will be reopened to traffic by no later than noon.
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Wednesday, 27 July 2011 02:00 batteryfast.com Administrator The Hot Tablet Landscape by Platform, Summer 2011 Version The Hot Tablet Landscape by Platform, than the original kept customers buying the iPad Summer 2011 Version 2 by the millions. Apple's latest figures show it has sold over 9 million iPads, making it clear the iPad Since the arrival of the iPad on the scene, tablets has dominated the tablet landscape. The iPad 2 will have been a common topic for discussion. The get even better with the release of iOS 5 later this conversation goes far beyond the tablet from Apple year which improves the platform for both the iPad as competitors are busy trying to get a competing and iPhone. product to share the wealth. The race to produce a hot tablet that competes with the iPad has not had Android Honeycomb a winner yet, and it is worth a look at the tablet ta- bleau by platform to see where things currently fall. iOS/ iPad Google's Android OS has only been in existence for a short period but has dominated the smartphone space for a lot of that time. The company's latest figures show that 550,000 Android devices are ac- Apple set the tech world on its ear with the release tivated daily, and 130 million of them have been of the original iPad, not only because it was so thin activated to date. The rapid rise of the Android and light, but because it was much cheaper at $499 smartphone coupled with the good customer reac- than anyone was prepared for. This entry level pri- tion to the iPad led Google to produce Honeycomb, cing was brilliant in that it virtually guaranteed it the version ofAndroid designed strictly for tablets. would be a success given how good a product it was. joliprint The first Honeycomb tablet, the Motorola XOOM, That was followed up this year with the iPad 2, an was released early this year to mixed reviews. Ho- improved model that quickly sold faster than Apple neycomb 3.0 was buggy and didn't do Google any could produce them. The addition of a rear camera, favors for the platform. Since the shaky release, Printed with along with a new form even thinner and lighter two updates have been produced addressing the http://batteryfast.com/battery-wiki/component/content/article/3-newsflash/136-the-hot-tablet-landscape-by-platform-summer-2011- Page 1 Wednesday, 27 July 2011 batteryfast.com The Hot Tablet Landscape by Platform, Summer 2011 Version majority of Honeycomb's problems. The first of these dock available that turns the tablet into a netbook updates Honeycomb 3.1 is now shipping on a lot of alternative. The rash of tablets becoming available the Android tablets available currently. Honeycomb make this a mobile segment to watch, as companies 3.2 is rumored to be even more stable than 3.1, but it are fighting with different hardware components is not yet available on many of the shipping tablets. and price. If prices drop low enough Android tablets may start selling in numbers worth tracking. This fragmentation issue that has plagued Android on the smartphone side is already a factor on the PC giant Lenovo is preparing to enter the Honey- tablet side. Buyers of Android Honeycomb tablets comb tablet race with acouple of models. One of have no guarantee that updates will be released those is a ThinkPad Tablet aimed at professional by the OEM and the carrier (for those tablets sold workers, and it has features not found on existing by them). This situation means prospective buyers tablets. The ThinkPad will bring a pen to the slate, al- shopping for a Honeycomb tablet are often unclear lowing full interaction with the screen by pen along on which version of the OS a particular model is with handwriting on the screen that is converted shipping with. This is significant on Android tablets to text as desired. given how bad Honeycomb was at release (3.0) and the uncertain nature of Android updates. If you buy There is no clear indication how many Android ta- a tablet shipping with version 3.1 of Honeycomb, you blets are selling nor how many have sold to date, but have no guarantee of getting the already released it is almost certain far fewer are selling than iPads. 3.2 which further fixes bugs. Those of us keeping an eye out for tablets in public rarely see an Android tablet in use, but iPads are In addition to having the very buggy Honeycomb literally everywhere. Android is the number one 3.0, the Motorola XOOM was rushed to market with competitor to the iPad, so we need to see these things hardware components that didn't work, and big start appearing in public to prove they are moving promises that the model sold by Verizon would re- in significant numbers. Google's own figures aren't ceive an LTE upgrade shortly. XOOM owners are still telling a compelling story for Honeycomb tablets. waiting the availability of that LTE upgrade, and are understandably upset that the just released Sam- sung Galaxy Tab 10.1 will be available for purchase in just a few days with LTE integration. Early adop- ters (XOOM buyers) will not get the first Honeycomb tablet capable of blazing LTE speeds. Samsung has become one of the top sellers of An- droid phones, and it jumped on the tablet space with the original Galaxy Tab last year. The new Galaxy Tab 10.1 is the thinnest and lightest 10-inch tablet in existence, having beaten the iPad in these key areas. joliprint Other OEMs have been releasing Honeycomb ta- blets, with models by ASUS and Acer among those currently shipping. There are innovative offerings Printed with like the Transformer by ASUS which has a keyboard http://batteryfast.com/battery-wiki/component/content/article/3-newsflash/136-the-hot-tablet-landscape-by-platform-summer-2011- Page 2 Wednesday, 27 July 2011 batteryfast.com The Hot Tablet Landscape by Platform, Summer 2011 Version BlackBerry PlayBook HP webOS (TouchPad) Beleaguered BlackBerry maker RIM was counting HP paid $1.2 billion to acquire Palm to get possession on the PlayBook tablet released early this year to of the webOS platform. The recently released Tou- help turn the company around. Even though the chPad is the first webOS tablet produced out of that hardware on the PlayBook was viewed as quite good, acquisition, and while it shows promise the shaky reviewers of the tablet were surprised to find that release hasn't done HP any favors. core tablet capabilities were missing. Releasing the PlayBook without native email, contact mana- Reviews of the TouchPad were uniformly bad at gement and calendar functions, all features the release, due to bugs and performance issues. HP BlackBerry smartphone has been famous for, was immediately responded that an update was already viewed as a major faux pas by RIM. being prepared to address those issues, and it is ex- pected in just a few days. Inside information tells us Sales of the 7-inch PlayBook have been so poor that this does address the performance of the TouchPad, RIM is rumored to have cancelled work on the 10- along with adding some new features. inch PlayBook that was expected later this year. The company's recent announcement of layoffs and The TouchPad with webOS is a compelling tablet due executive shuffling don't paint a good picture for to the ability of HP to do something with the product. the PlayBook's future. The company is throwing a lot of engineering and resources into both webOS and the TouchPad, and the potential is there for a good run at the iPad. The combination of technical ability, production capabilities and large distribution system make the HP TouchPad a product line to watch. joliprint HP is going to produce a second TouchPad, a 7-inch version, later this year. The webOS platform as it has evolved on the tablet is a nice alternative to Printed with http://batteryfast.com/battery-wiki/component/content/article/3-newsflash/136-the-hot-tablet-landscape-by-platform-summer-2011- Page 3 Wednesday, 27 July 2011 batteryfast.com The Hot Tablet Landscape by Platform, Summer 2011 Version the iPad and Android, and with HP's backing has a decent shot at getting into the enterprise. Other Business News: joliprint Printed with http://batteryfast.com/battery-wiki/component/content/article/3-newsflash/136-the-hot-tablet-landscape-by-platform-summer-2011- Page 4
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Tuesday, March 31 2015
Leon Bridges Is the Music Man of the Moment
The man and his music were seemingly on everyone's lips, and his final showcase of the festival, an intimate performance at St. David's Episcopal Church, drew so many people it was very nearly shut down by the fire marshal.
Umami - 'Ephemeral' (album stream) (Premiere)
With Ephemeral, the Minneapolis group Umami has concocted a mad scientist's stew of synth-pop, dance rock, and a smattering of other sounds.
'Mad Max' Conquering Cannes
It took 30 years for "Mad Max" to return, but now that he's coming back, he's doing it in style. "Mad Max: Fury Road,"
Ringo Starr Focuses on the Next Move
A day before Ringo Starr's new solo album, "Postcards From Paradise," was slated for release, the former Beatle was at the hub of a frenzy of activity. He bounded from one room to the next in his top-floor suite at a West Hollywood hotel, hustling through a string of interviews.
Led Zeppelin - "Brandy and Coke (Trampled Under Foot)" (video)
As a tie-in to the recent release of the 40th anniversary edition of Physical Graffiti, Led Zeppelin have released an "interactive video" for "Brandy and Coke", the initial rough mix of the classic "Trampled Under Foot".
The Staves with Justin Vernon - "Make It Holy (Live at Wilton's Music Hall)" (video)
Angelic vocal harmonies and a wintry mood make the Staves' "Make It Holy" a stunner of a live track.
Squarepusher Releases Live Video for "Rayc Fire 2"
"Rayc Fire 2" is a big beat banger off Squarepusher's upcoming release Damogen Furies, which is the electronic musician's first album since 2012's Ufabulum.
Monday, March 30 2015
Alex Cuba - "Half a Chance (feat. Ron Sexsmith)" (audio) (Premiere)
"Half a Chance" finds the Cuban-Canadian singer/songwriter Alex Cuba joining his smooth brand of songwriting with that of legendary troubadour Ron Sexsmith.
Basic Shapes - "Shining Armor" (video) (Premiere)
The music video to the buoyant bit of synth-pop that is "Shining Armor" pays homage to Azealia Banks's "212" video.
Friday, March 27 2015
Scarlette - "6ft Woman" (video) (Premiere)
British rock 'n' roller Scarlette stars in a flashy music video for her tune "6ft Woman", which runs through a stylish history of cinematic iconography.


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Help with dying Yulan Magnolia
I have a young Yulan Magnolia that only bloomed for the first time this spring. About a week ago, just overnight, the leaves wilted and now they are all brown. There is nothing on the leaves (eg disease, insects etc.)
Anyone know what happened? Can I still save it? What do I do?
Your help is appreciated.
I have a Magnolia grandiflora (Southern Magnolia) that did a similar disservice. The leaves that normally were a healthy, medium, shiny green, curled and went brown just this past July. I have no clue as to why. However, I suspect the the unusual amount of rainfall we have had this summer may be the cause.
My soil is clay, that I mix with compost and sand to create a better growing medium. Given the amount of water we had on almost a daily basis, I tend to doubt the ability of a clay base soil to drain properly.
In desperation I redirected the water away from the tree with a small furrow. The tree is now responding well and new leaves have sprouted.
I am not sure if this helps or not. Given that your situation involves a different type of Magnolia and a different soil, there may be a very different cause for the dieing off of the leaves.


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Sher Shah (VC)
|This article needs additional citations for verification. (September 2014)
|Sher Shah
|14 February 1917
Chakrala, Punjab (in what is now Pakistan.)
|20 January 1945 (aged 27)
Kyeyebyin, Burma
|British India, United Kingdom
|British Indian Army
|Lance Naik
|7th Battalion, 16th Punjab Regiment
|Victoria Cross
Sher Shah VC (14 February 1917 – 20 January 1945) was a British Indian Army soldier who received the Victoria Cross which is the highest and most prestigious award for gallantry in the face of the enemy that can be awarded to British and Commonwealth forces.
Military career[edit]
He was the son of Barkhurdar (probably of a Rajput tribe[1]) and Makda; husband of Mehr Bhari, from the village of Chakrala, about 30 km east from Mianwali, Punjab region that is now Pakistan. He was 27 years old, and a Lance Naik in the 7th Battalion of the 16th Punjab Regiment, in the Indian Army during World War II when the following deed took place for which he was awarded the VC.[2]
On 19/20 January 1945 at Kyeyebyin, Kaladan, Burma (now Myanmar), Lance Naik Sher Shah was commanding a left forward section of his platoon when it was attacked by overwhelming numbers of Japanese. He broke up two attacks by crawling right in among the enemy and shooting at point-blank range. On the second occasion he was hit and his leg shattered, but he maintained that his injury was only slight and when the third attack came, he again crawled forward engaging the enemy until he was shot through the head and killed.
Sher Shah's Battalion 7/16 Punjab Regiment, affectionately known as "Saat Solah Punjab" is now a part of the Pakistan Army, proudly known as the "Sher Shah Battalion".
See also[edit]
- Monuments to Courage (David Harvey, 1999)
- The Register of the Victoria Cross (This England, 1997)
- ^ Some sources, including the Indian Army Lists, enter his tribe as Rajput. However, most records and archival sources simply list him as 'Sher Shah' without any reference to any tribe or caste
- ^ http://www.cwgc.org/find-war-dead/casualty/2525452/SHER%20SHAH
External links[edit]
- Sher Shah(This page/link not available)
- Burial location of Sher Shah "Burma"
- News item "Sher Shah's Victoria Cross sold at auction"
- CWGC :: Casualty Details at www.cwgc.org Citation - Commonwealth War Graves Commission
|This article about the military of India is a stub. You can help Wikipedia by expanding it.


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John Donne
John Donne was an English poet, satirist, lawyer and priest. He is considered the pre-eminent representative of the metaphysical poets. His works are noted for their strong, sensual style and include sonnets, love poetry, religious poems, Latin translations, epigrams, elegies, songs, satires and sermons. His poetry is noted for its vibrancy of language and inventiveness of metaphor, especially compared to that of his contemporaries. Donne's style is characterised by abrupt openings and various paradoxes, ironies and dislocations. These features, along with his frequent dramatic or everyday speech rhythms, his tense syntax and his tough eloquence, were both a reaction against the smoothness ... more »
Click here to add this poet to your My Favorite Poets.
John Donne Poems
No Man Is An Island
No man is an island, Entire of itself, Every man is a piece of the continent, A part of the main.
Death Be Not Proud
Death be not proud, though some have called thee Mighty and dreadfull, for, thou art not soe, For, those, whom thou think'st, thou dost overthrow, Die not, poore death, nor yet canst thou kill mee.
A Valediction: Forbidding Mourning
As virtuous men pass mildly away, And whisper to their souls, to go, Whilst some of their sad friends do say, 'The breath goes now,' and some say, 'No:'
For whom the Bell Tolls
PERCHANCE he for whom this bell tolls may be so ill, as that he knows not it tolls for him; and perchance I may think myself so much better than I am, as that they who are about me, and see my state, may have caused it to toll for me, and I know not that. The
A Hymn To God The Father
Wilt thou forgive that sin where I begun, Which was my sin, though it were done before? Wilt thou forgive that sin, through which I run, And do run still, though still I do deplore?
Air And Angels
Twice or thrice had I loved thee, Before I knew thy face or name; So in a voice, so in a shapeless flame, Angels affect us oft, and worshipped be;
Confined Love
Some man unworthy to be possessor Of old or new love, himself being false or weak, Thought his pain and shame would be lesser If on womankind he might his anger wreak,
Go and Catch a Falling Star
Go and catch a falling star, Get with child a mandrake root, Tell me where all past years are, Or who cleft the devil's foot,
A Lame Beggar
The Sun Rising
Busy old fool, unruly Sun, Why dost thou thus, Through windows, and through curtains, call on us?
Good Morrow
I wonder, by my truth, what thou and I Did, till we loved; were we not weaned till then, But sucked on country pleasures, childishly? Or snorted we in the Seven Sleepers' den?
A Burnt Ship
Out of a fired ship, which by no way But drowning could be rescued from the flame, Some men leap'd forth, and ever as they came Near the foes' ships, did by their shot decay;
A Fever
Oh do not die, for I shall hate All women so, when thou art gone, That thee I shall not celebrate, When I remember, thou wast one.
The Flea
Mark but this flea, and mark in this, How little that which thou deny'st me is; It sucked me first, and now sucks thee, And in this flea, our two bloods mingled be;
Quotationsmore quotations »
''To be no part of any body, is to be nothing.''John Donne (c. 1572-1631), British divine, metaphysical poet. letter, Sept. 1608, to Sir Henry Goodyer. Complete Poetry and Selected Prose, ed. John H...
''When one man dies, one chapter is not torn out of the book, but translated into a better language.''John Donne (c. 1572-1631), British divine, metaphysical poet. repr. In Complete Poetry and Selected Prose, ed. John Hayward (1929). Devotions Upon Eme...
No man is an island entire of itself; every man is a piece of the Continent, a part of the main.... Any man's death diminishes me because I am involved in Mankind; and therefore never send to know for...John Donne (c. 1572-1631), British divine, metaphysical poet. repr. In Complete Poetry and Selected Prose, ed. John Hayward (1929). Devotions Upon Eme...
''But I do nothing upon myself, and yet am mine own executioner.''John Donne (c. 1572-1631), British divine, metaphysical poet. repr. In Complete Poetry and Selected Prose, ed. John Hayward (1929). Devotions upon Eme...
''Humiliation is the beginning of sanctification.''John Donne (c. 1572-1631), British divine, metaphysical poet. Eighty Sermons, sermon 7 (1640).
Comments about John Donnemore comments »
Pamela Leschevin D'ere
Very interesting comments. Not enjoying poems on love seems a great sadness, I'd like to quote that Love is never wasted, even when it doesn't last, lines by Panmelys a new member, myself. John Donne is a great favorite and brings much joy to many, this is greatness. Like many others in this period, it's amazing how modern they seem, in spite of the gabs between epochs. Panmelys
Harvey Rabbit
The quote beginning Actually, if my business was legitimate, is not from John Donne, who was not a prostitute, did not have to deal with a corporate income tax, and would not likely have begun a sentence with actually. The real author appears to be Xaviera Hollander.
Punky Daly John
i read this John Donne Poems in Chapters only once with inner peace music
Grace Bunton
You forgot to mention that the first 2 stanzas of Go: and Catch a Falling Star were used in Diana Wynne Jones' book Howl's Moving Castle
Shahzeb Azhar
Hi i don't like poems or story acording to love
Maya Angelou
(4 April 1928 - 28 May 2014)
Robert Frost
(March 26, 1874 – January 29, 1963)
Emily Dickinson
(10 December 1830 – 15 May 1886)
William Shakespeare
(26 April 1564 - 23 April 1616)
Pablo Neruda
(12 July 1904 – 23 September 1973)
Langston Hughes
(1 February 1902 – 22 May 1967)
Edgar Allan Poe
(19 January 1809 - 7 October 1849)
Walt Whitman
(31 May 1819 - 26 March 1892)
William Wordsworth
Charles Bukowski
(16 August 1920 – 9 March 1994)
No Man Is An Island
No man is an island,
Entire of itself,
Every man is a piece of the continent,
A part of the main.
If a clod be washed away by the sea,
Europe is the less.
As well as if a promontory were.
As well as if a manor of thy friend's
Or of thine own were:
Any man's death diminishes me,
Because I am involved in mankind,
And therefore never send to know for whom the bell tolls;
It tolls for thee.


text:
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46, Marion, IAI am a person who loves to laugh and have fun. I enjoy being social and enjoy my family and friends. I like to go with the flow and enjoy the simple things in life and shari...
52, Marion, IAI am really passionate about Our Lord and Savior, Jesus Christ! I look forward to payday, but my goal is toward the payday in heaven forever! My mom was the most influential...
Browse Catholic Singles by Gender:
Catholic Dating By Major City:
- Olin,
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- Oxford Junction,
- Tipton


text:
US and EU Clash Over Whois Data 67
from the not-going-to-spark-world-war-3 dept.
We've improved Slashdot's video section; now you can view our video interviews, product close-ups and site visits with all the usual Slashdot options to comment, share, etc. No more walled garden! It's a work in progress -- we hope you'll check it out (Learn more about the recent updates).
Why would you store credit card information in WHOIS? I already get mail from registrars wanting me to "renew" my domains (read Transfer them to them) for a "reduced rate" of $30 (I pay $12 a year). If the credit card information was in there as well, what would stop shady organizations from using that information for other scams? WHOIS certainly doesn't keep my physical address safe from scammers.
Why would you store credit card information in WHOIS? I already get mail from registrars wanting me to "renew" my domains (read Transfer them to them) for a "reduced rate" of $30 (I pay $12 a year).
This is just another intentionally misleading headline. Card data is not going into whois.
The issue is requiring registrars to hang on to CC data so that governments would be able to "lawfully" request from the registrar if that registrar is operating within jurisdiction of said goverment.
Rather than addressing data retention standards with legislation as decided by each countries government...such as thru a billing passed by congress and signed by the president they are essentially attempting an end run around democractic process to get a desired outcome.
None if it is defensible...both ICANN and FTC are in the wrong regardless of what you feel about the issue of data retention.
What's to stop companies from continuing the "private registration" feature that they already offer (often for a significant fee) to hide the domain owners name, address and other personal details?
Are you aware of the requirements that apply to domain registrars, including ones that implement that function?
Every domain registrar is Required to retain the WHOIS data, and all the pertinent details for all their customers, and make all that information available to organizations designated by ICANN.
Buying a private registration gets you a public WHOIS listing, but all your information is still available.
Unless you have a 3rd party registrar-unaffiliated proxy service, register the domain, own the domain in place of you, and provide their information to the registrar, instead of yours.
Then there's a risk, however, if the proxy service goes bankrupt: ownership of the domain could get included in the proxy services' assets and liquidated to pay creditors of the proxy service.
GANDI.NET doesn't charge. They provide a tick box to remove your details from public WHOIS and even encourage you to tick it. To hell with the nickel and dimers gouging you for basic functionality.
It's nothing to do with spam. It's so the intellectual property crowd can sue the right person.
Think! Who else in the domain ecosystem needs to know exactly who you are?
The meat is rotten, but the booze is holding out. Computer translation of "The spirit is willing, but the flesh is weak."


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I Put the Ultimate Beer Koozie to the Test and It Did Not Let Me Down
Koozies. They keep your hand from getting cold and your beer from getting warm—what could be better? One that keeps your beer cold for much, much longer, that's what. »
Koozies. They keep your hand from getting cold and your beer from getting warm—what could be better? One that keeps your beer cold for much, much longer, that's what. » 2/13/15 4:20pm 2/13/15 4:20pm
Coolers: often ugly, frequently necessary. You can get a styrofoam piece of junk that you're going to spend $3 on only to throw away later, or you could spend $50 or more on a hunk of ugly plastic that will sit in your garage nine months of the year collecting cobwebs. Those aren't your only options, however. These… » 7/10/12 7:40pm 7/10/12 7:40pm
A fisherman that had been swept out of his boat off the coast of Japan's Niigata prefecture managed to stay alive for 24 hours, while he clung to his plastic esky that acted as a life-aid. » 8/01/11 7:52am 8/01/11 7:52am
These cardboard coolers are a must for any summer event: smart, green, recyclable and can fit 35 lbs worth of beer and goodies. It's like a cross between the heavy duty plastic coolers and the disposable styrofoam ones...but better. » 7/26/11 11:20am 7/26/11 11:20am
Liquid cooling, long the geeky masterwork of any PC gaming champion, has become simpler to set up, with pre-assembled, self-contained units available for any dummy in search of a cooler CPU. Maingear says their newest cooler frosts like a boss. » 4/26/11 10:20pm 4/26/11 10:20pm
In the future, when humans are extinct and watermelons evolve into sentient beings capable of mastering fusion energy and interstellar travel, someone will find the Marugoto Tamachan—a portable watermelon cooler—and they will be as puzzled as we are. » 7/19/10 1:40pm 7/19/10 1:40pm
Cool-er's lineup of readers is getting new models such as the super-small Compact, the Wi-Fi-enabled Connect, and the appropriately named 3G. Based on previous models, it's quite possible that these will find a place in the hearts of bargain shoppers. » 1/04/10 2:00pm 1/04/10 2:00pm
If you watched any football this weekend, you saw But Light's "Tailgate Approved" parody infomercials. But hey, maybe they weren't parodies; you can buy all that stuff, including the awesome-looking Grooler, online. » 9/15/09 11:40am 9/15/09 11:40am
Carrying a cooler full of Pabst into a job interview may seem like bad form, but hauling a twelve-pack in a Dolores Cooler shaped like a messenger bag is just the thing to show off your go-getting attitude. » 7/01/09 5:20pm 7/01/09 5:20pm
The Gadget: The Cool-er, a lower (compared to the Kindle) priced eBook reader that lacks built-in wireless functionality and a hardware keyboard, but adds music, an SD card slot and PDF/MP3 support. But of course, the lower price is the big draw. » 5/27/09 4:20pm 5/27/09 4:20pm
One look at this conglomeration and you pretty much know it's from Brando. Their latest clunky tech masterpiece is officially named a USB Notebook Cooling Pad + 3-Port Hub + 2.5" HDD. » 12/02/08 9:00am 12/02/08 9:00am
Add this one to the "ouch, ouch, ouch" Photoshop bin. Yeah, I can use the pen tool to smoothly decapitate R2 and throw a Coke can top and USB cord in too. What I can't do, though, is build an actual USB beverage can cooler out of a shrunken R2-D2 model. Which I would want. It's up for pre-order at Play.com for… » 8/06/08 12:45pm 8/06/08 12:45pm
The Gadget: The Moshi Zefyr, which is a collapsible USB-powered notebook cooler for the MacBook and MacBook Air (MacBook Pro version coming soon). The USB slot is pass-through, which lets you plug in another USB device so as to break even, and the whole thing can collapse into itself for easy transport. » 7/01/08 11:00am 7/01/08 11:00am
We first wrote about the Cruzin Cooler, literally a motorized cooler scooter, here on Giz way back in 2006. Frankly, we're kind of baffled today that it took more than two years for the thing to log its first DWI arrest. First of all, yes, the Cruzin Cooler counts as a vehicle, and that is why Whitehall, NY resident… » 6/08/08 7:30pm 6/08/08 7:30pm
Designer Karim Rashid has turned out this multifunction champagne cooler just in time for the upcoming Milan Design Fair, and we have to admit it's rather beautiful. Produced in collaboration with Veuve Clicquot, the Globalight is supposed to keep your champers chilled for two hours and also sheds a halo of pink… » 4/15/08 6:33am 4/15/08 6:33am
The Skinny: No more yelling across the room, ordering the kids to bring you that brewski when you have an RC Cooler from Inter Active Toy. The Catch: It runs on eight C batteries, but they are said to last for six hours of continuous use. We just wish it were rechargeable, with its own little charging garage. » 1/05/08 9:31pm 1/05/08 9:31pm
If it weren't for my obnobvious headline, you'd all be wondering what the hell this is. Just 15 of these Champagne tower chillers, with room for a dozen magnums in individual, lit drawers, have been designed for Veuve Cliquot by Porsche Design. Want to see what it looks like open? » 12/06/07 4:30am 12/06/07 4:30am
According to the product page, the Franklin Digital Cooler uses "a tiny NASA microchip" that allows the device to go from "hot to freezing cold in a matter of minutes." So, theoretically, you can keep you hot dishes hot and your cold dishes cold when traveling. There is even an LED thermometer and thermostat that… » 10/18/07 8:30pm 10/18/07 8:30pm


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Press release from PR Newswire
National Survey Finds 51 Percent of Professionals Plan to Participate in Office Pools During National College Basketball Tournament
Monday, March 14, 2011
National Survey Finds 51 Percent of Professionals Plan to Participate in Office Pools During National College Basketball Tournament16:37 EDT Monday, March 14, 2011OfficeMax's 2011 "Hoops at Work" survey explores the effects of the college basketball tournament on camaraderie and productivity in the workplaceNAPERVILLE, Ill., March 14, 2011 /PRNewswire/ -- With the national college basketball tournament quickly approaching, Americans are busy spending time around the clock researching teams and making tournament predictions. According to OfficeMax's 2011 "Hoops at Work" survey(1), many employed Americans are not afraid to show their college basketball team spirit or join in tournament pools and brackets at the office. In fact, some professionals are so excited that they readily bring the tournament to work by wearing team apparel, decorating their workspaces, and even treating colleagues to sweets decorated with team colors and logos. Not surprisingly, while team spirit and office camaraderie are focused on the love of the game, work details may become a secondary concern.To view the multimedia assets associated with this release, please click: http://multivu.prnewswire.com/mnr/officemax/46662/Fifty-one percent of working Americans say that professionals at their workplace typically organize an office pool where anyone can place bets on their favorite teams during the national college basketball tournament ? even if the company discourages the behavior. The other 49 percent do not engage, as such activities are strictly prohibited by their employers. Therefore, it's not surprising that more than half (51%) of employed Americans reportedly plan to partake in an office pool during the basketball tournament if a colleague organizes one. More men than women (59% vs. 44%) plan to join a pool at their place of employment if available.Being part of a tournament pool means keeping up to date on team statistics, wins and overall progress. Nearly half (48%) of employed Americans check the game scores online at least once a day while at work. Of that 48 percent, on average those employees will scope out game results five times a day when they are on the clock at work. About two-thirds (67%) of working Americans are allowed to openly celebrate their favorite teams in the workplace and display their team spirit by wearing team apparel like jerseys or hats (52%), donning their team's colors (50%), or proudly displaying their bracket boards to track their team's progress (25%).But amidst the fun and excitement, productivity may suffer. Perhaps some companies discourage celebration of the national college basketball tournament because more than four in ten (42%) employed Americans openly admit that workplace productivity is negatively impacted. Some report that colleagues talk about the games instead of doing their jobs (55%), watch the games on TV or online ignoring their workload (47%), or even leave work early (21%) or arrive late (19%) because they are watching the tournament.Whether you officially partake in the college basketball tournament pools or not, the reality is that many professionals are excited about the playoff games this March, and it's more likely than not that team spirit and tournament pools will, for a time, overshadow work productivity.About OfficeMaxOfficeMax Incorporated (NYSE: OMX) is a leader in both business-to-business office products solutions and retail office equipment. The OfficeMax mission is simple. We help our customers do their best work. The company provides office supplies and paper, in-store print and document services through OfficeMax ImPress®, technology products and solutions, and office furniture to consumers and to large, medium and small businesses. OfficeMax customers are served by more than 30,000 associates through direct sales, catalogs, e-commerce and approximately 1,000 stores. For more information, visit OfficeMax.com.Research Methodological Notes: The 2011 OfficeMax Custom Survey was conducted by Kelton Research between February 18 and February 25, 2011 using an email invitation and an online survey. Results of any sample are subject to sampling variation. The magnitude of the variation is measurable and is affected by the number of interviews and the level of the percentages expressing the results. In this particular study, the chances are 95 in 100 that a survey result does not vary, plus or minus, by More than 2.9 percentage points from the result that would be obtained if interviews had been conducted with All persons in the universe represented by the sample.OfficeMax Media ContactsInvestor ContactBill BonnerJennifer RookMike Steele630 864 6066630 864 6057630.864.6826(1) National internet study among 629 employed Americans ages 18-years and older conducted by Kelton Research in February 2011.SOURCE OfficeMaxFor further information: Bill Bonner, +1-630-864-6066, or Jennifer Rook, +1-630-864-6057, Media; or Mike Steele, +1-630-864-6826, Investors


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NFL Player List
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Dolphins free agent bracket: Who is the best FA signing in team history?
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2015 NFL Draft Includes 8 Picks for Falcons
How did ESPN grade the Giants in free agency?
The Chicago Bears have signed cornerback Alan Ball
Jets travel across the country to get closer look at Marcus Mariota
Owner Martha Firestone Ford expects excellence from Detroit Lions in future
Why people need to shut up about Aaron Rodgers' support of Wisconsin basketball
Jarrett Boykin Signs With Carolina
Quick-hit thoughts around Patriots, NFL
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POLL: What grade would you give the Giants in free agency?
Saints Cornerback Arrested In Miami Beach
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Whats Missing? Romulan Carrier.
Now first off, the bigger thing thats missing is more Romulan Science ships, that's a given and there are other topics about that, but another thing thats missing is a true Romulan carrier.
The obvious option is the Scimitar, especially considering in Nemesis itself it was shown have huge flight decks with Scorpion Fighters. And lets be honest, the Scimitar is most likely coming to the cstore at some point, but personally i'd also like to see an escort carrier, maybe a fleet version of the Dhelan.
So anyway these are my thoughts and just wondering if anyone else here feels the same. Personally i'll be enjoying flying around in my mogai and tvaro but i'm going to miss my pets and would love to see romulans get a carrier soon.
Basic thoughts on stats, and i've added fleet science versions to both because science toons need some love. and since the fleet dhelan was engineering based i made a engineering based carrier version.
Scimitar type true carrier, similar to the jem'hadar dread
4 fore 4 aft
41,000 hull
1.05 shield mod
2 Hanger Bays
3000 Crew
3 Device Slots
5 Turn rate (maybe 5.5 or 6)
Impulse 0.17
+10 Weapons
+10 Aux
basic: 4 tac 3 eng 2 sci
fleet version:
standard: 4 tac 3 eng 3 sci
science version: 4 tac 2 eng 4 sci
Commander Tac / LT.CMDR Universal / LT Science / LT Engineering / Ensign Universal
Science version switches commander tac to sci and lt sci to tac
Escort Carrier, based off of the Dhelan and armitage. basing it off the Dhelan because it seems more like a possible carrier to me verses toe mogai. To be honest, a brand new design would be even better.
4 Fore 3 Aft
31,500 hull
.90 shield mod
1 Hanger Bays
400 Crew
2 Device Slots
15 Turn rate (maybe 14)
Impulse 0.20
+10 Weapons
+10 Aux
basic: 3 tac 3 eng 2 sci
fleet version:
standard: 4 tac 3 eng 3 sci
engineering version: 4 tac 4 eng 2 sci
Commander Tac / LT.CMDR Universal / LT Science / LT Engineering / Ensign Universal
engineering version switches commander tac to eng and lt eng to tac
Anyway, just some fun thoughts.
No, NO. Stop it! We don't need more pet spam in this game! We don't need more carriers! We never needed them.
Both really good points. a talshair lockbox could easily be the scimitar, but at the same time i do agree that that probably wouldn't be something cryptic/cbs would want in a lockbox for fed/kdf.
making the scimitar like the oddy/bort would make sense, but that might be a little overkill if it's a carrier too which it should be, even though we didn't see it launch the fighters it obviously could.
as far as the lockbox, it probably will be a new ship, maybe one of the new alien ones, that would actually make sense considering the aliens are working for them, and it would make it a non faction ship sorta like the rest of them other than the temporal ships.
3 pack would be good for it though to get tac/sci/eng versions and the romulan side really does need more variety.
I can't wait to see the turn rate on the real Romulan carrier. It should be hilarious.
Well, what about a Reman carrier?
I realize the Romulan Republic uses a pretty standardized navy of Warbirds, but who's to say they can have a few exotic ships of strictly Reman design floating about - a bit like the Atrox, Kumari or D'kyr mixed in with Starfleet? Reman-specific designs seem especially viable when you've got Obisek rallying a 'freedom force' against the Tal Shiar.
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Colfax (aka. Daniel Berkman) in his 2nd installation of improvisations for Handsonic, QY100 and Line 6 DL4. Filmed February 12, 2008 by Jeremy Fortes.
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Contact us at (202) 208-6416.
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Secretary Jewell, Governor Brown Celebrate Landmark Agreements to Conserve up to 2.3 Million Acres of Sagebrush Habitat in Oregon
landmark agreements that will allow landowners in all eight Eastern and Central Oregon counties with greater sage-grouse habitat to enroll their property in a voluntary conservation program
Interior Department, Barrick Gold of North America & The Nature Conservancy Announce Partnership to Protect Sagebrush Habitat
Today Interior, in partnership with Barrick Gold of North America and The Nature Conservancy, announced an agreement to provide credit for greater sage-grouse habitat improvements in Nevada while continuing to support gold mining in the state.
Department of Energy, Department of the Interior and Army Corps of Engineers Renew Five-Year Partnership to Advance Hydropower
Memorandum of Understanding (MOU) and new 5-Year Action Plan to advance hydropower across the country.
Media Advisories
Secretary Jewell to Join Governor Brown to Announce Landmark Agreement to Benefit Greater Sage-Grouse
The agreements are part of an overall partnership approach to conserving the sagebrush landscapes throughout the West while providing regulatory certainty for landowners.
Secretary Jewell to Participate in Panel Discussion on National Park Service at University of California at Berkeley
U.S. Secretary of the Interior Sally Jewell will discuss the future of the National Park Service and the importance of connecting young adults to America's public lands
Department of Energy, Department of the Interior and Army Corps of Engineers to Renew Five-Year Partnership to Advance Hydropower
U.S. Department of the Interior to renew a Memorandum of Understanding (MOU) and new 5-Year Action Plan to advance hydropower across the country.
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This Week at Interior March 20, 2015
Secretary Jewell offers her vision for a safe, secure, and prosperous future for American energy; an oil and gas lease sale in the Gulf of Mexico; and the USGS is among the partners releasing a report this week on frozen methane deposits around the world.
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This would be the first World Heritage listing for the U.S. in the field of modern architecture. The Wright works would join the Sydney Opera House, the city of Brasilia and the Bauhaus School in Germany as examples of modern architecture.
Other News
Secretary Sally Jewell: Commonsense Rules for Safe and Responsible Energy Development
As Secretary of the Interior, I am fortunate to oversee American treasures like the Grand Canyon, the Statue of Liberty, and the Everglades.These are places owned by each and every American.


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'Les Misérables' Lent Course started 19th February, 7:45pm
At Heworth Methodist Church
|Feb 19th
|The Film (Part 1)
|Feb 26th
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|March 19th
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|March 26th
Next Messy Church Lite, Saturday 28th March 11:30am to 1pm
Children must be accompanied by an adult.
What is it? - Craft based church, and a meal, for all the family.
How does it work?
- Time to chat and play board games over a coffee / tea / juice
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- Short time of worship to celebrate and share what we have done together
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A Word in Time - Methodist Online Bible Study
An online Bible study called A Word in Time. It features a daily Bible reading, background and an explanation of the text, reflections and questions to ponder from that week's contributor, and follows the readings in the Methodist Prayer Handbook. You can read the study, or download audio files for each day's Bible study to a computer or mp3 player and listen at a time convenient to yourself.
3 minute retreats
Changed daily, an opportunity to take a brief time out to relax, and reflect and pray with a Bible passage. 'Three minutes a day can give you 24 hours of peace'. Rooted in the Roman Catholic tradition.
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Last updated 25/03/2015


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HSBC Bank USA, National Association v. Hine et al
|USA, Bob Nelson, Sherri Hine, Nina Nelson, Richard Hine, Unknown Owners and Non-Record Claimants
|HSBC Bank USA, National Association
|Case Number:
|April 17, 2013
|Illinois Southern District Court
|East St. Louis Office
|Presiding Judge:
|G. Patrick Murphy
|Referring Judge:
|Stephen C. Williams
|Nature of Suit:
|Real Property: Foreclosure
|Cause of Action:
|28:1444 Petition for Removal- Foreclosure
|Jury Demanded By:
Available Case Documents
The following documents for this case are available for you to view or download:
|Date Filed
|Document Text
|March 14, 2014
|MEMORANDUM AND ORDER, The Court finds that defendants, Unknown Owners and Non-Record Claimants are DISMISSED from this action without prejudice and DIRECTS the Clerk of Court to enter judgment accordingly at the close of the case. Signed by Judge J. Phil Gilbert on 3/14/2014. (jdh)
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text:
Colts MLB's emergence proving to be therapeutic
Gary Brackett's big game last week lost some of its luster since he no longer has his parents or brother to share in his excitement.
For the reigning AFC defensive player of the week, a stellar 10-tackle, two-interception performance for the Indianapolis Colts in last Sunday's lopsided win at Baltimore might have defined the term bittersweet.
|Patrick Ramsey and the Redskins have denied it, but the QB wants out. And given the lack of faith the organization has shown in him, he would be better off elsewhere. Len Pasquarelli addresses that subject and more Inside Tip Sheet. Story
"After every game, no matter what, I would call them," recalled Brackett on Thursday, as he spoke of the enormous loss he has suffered in a little less than two years. "The good part for me [last Sunday night], I guess, was that I had so many people there for me. It was great, don't get me wrong, but it still wasn't the same thing as being able to pick up the phone and tell my folks that I had played really well."
Indeed, sometimes it is easier to plug the B-gap hole against the off-tackle run than it is to fill a void in your heart. So while Brackett still struggles at times with the latter issue, the former Rutgers star uses the former as a convenient diversion, and clearly is finding it to be emotionally therapeutic.
And the Colts, it seems, are finding the unheralded Brackett to be a nice fit, not just with the linebacker corps, but with the overall defensive scheme.
The Indianapolis blueprint is designed, of course, around speed and quickness. Brackett, whose lone previous start came in the meaningless 2004 season finale at Denver, after the Colts had already secured a playoff spot and cemented their perch as the No. 3 seed in the AFC bracket, has provided both. And against the Ravens, he demonstrated he can give coach Tony Dungy and defensive coordinator Ron Meeks big plays as well.
A onetime walk-on at Rutgers, and signed by the Colts as an undrafted college free agent in 2003, Brackett played primarily as a "nickel" linebacker his first two NFL seasons, and had 43 tackles, three interceptions and one sack in that role. But in replacing Rob Morris as the starter this season, Brackett has proved to be a more well-rounded defender than some skeptics anticipated, and has melded nicely into a linebacker corps whose success is predicated on getting to the football, and certainly not on size.
Listed on the Colts' roster at 5-feet-11 and 235 pounds, Brackett acknowledged that he is at least an inch shorter and five pounds lighter than those advertised dimensions. As such, he is part of an inarguable trend in the league toward more mobile middle linebackers. Over the past three seasons in particular, teams have increasingly incorporated into their defensive schemes middle linebackers who could run, not just stop the run.
On opening day last weekend, 20 franchises deployed a 4-3 defense at the start of their games. The other dozen clubs either opened in a 3-4 front or a "sub" package. Counting Brackett, the 20 middle starting middle linebackers last week averaged 239.8 pounds and a shade under 6-feet-1. Three starters last weekend were in the 220s. Only nine of the 20 weighed more than 240 pounds and just three -- Brian Urlacher of Chicago (258), Kansas City's Kawika Mitchell (253) and Mike Labinjo (255) of Philadelphia -- weighed more than 250 pounds.
Contrast that to opening day 1995, when the starting middle linebackers averaged 246.3 pounds and all but four checked in at more than 240 pounds.
"I haven't been around all that long," Brackett said, "but even I can see just in my three years how much the league has changed. There's more [emphasis] now on guys who can run, who can get to the football, and that's what our defense is all about. For me, it's a great defense to be in, because the things we stress are the things I think I do well. I don't know that I could be in a better situation."
Appropriately, in the fourth season of Dungy's stewardship, the "Cover 2" design that he brought with him from Tampa Bay, and which has been modified only a little during his Indianapolis tenure, might be significantly better in 2005. The unit has kind of been on a precipitous statistical slide, ranking eighth in 2002, then sliding to 11th in 2003, and plummeting all the way to No. 29 last season. There is a feeling this season, however, that the Colts have the right components to be markedly improved.
For openers, the young players who have been in the system are more familiar with its demands now. And the Colts have added three new starters in first-round cornerback Marlin Jackson, free-agent defensive tackle Corey Simon and Brackett.
A four-year starter, Morris was a solid defender versus the run and he averaged 93.5 tackles during his time in his lineup. But in Brackett, who is flanked by very athletic outside 'backers in David Thornton on the strong side and former college safety Cato June at the weak-side spot, the Colts now have a similarly mobile player. And since Brackett does not have to come off the field on third down, as Morris did, the Colts coaches have enhanced flexibility and maneuverability.
"He's been in the program and, when he played, we felt like Gary played well," Dungy said. "We were comfortable moving him in [to the starting lineup]."
Brackett, 25, has obviously located his comfort zone pretty quickly, in part because he has been working with the first unit since the spring mini-camps, when Morris was still a free agent, and it was obvious there was going to be a change in the middle. Brackett allowed this week that he has worked hard on his core strength because, as he noted, being on the field for first and second downs now places more emphasis on physicality. As the nickel linebacker, Brackett was preoccupied with technique more than toughness.
The youngster certainly must possess plenty of mental toughness, though, to have gotten through the adversity that has marked the past two years.
In the fall of '03, his father, Granville Brackett, died after a series of physical and mental setbacks. A veteran of the Vietnam War, the elder Brackett had been through at least two heart attacks, several surgeries, depression and stints in a mental health facility. The same year, Brackett's brother, Greg, was diagnosed with T-cell leukemia. And then just four months after his father's death, Brackett's mother, Sandra, died suddenly following what was supposed to have been fairly routine surgery.
Last spring, Gary Brackett donated bone marrow for transplants to his brother. But Greg Brackett, who spent the final months in and out of a coma, died in February of this year.
|The good part for me [last Sunday night], I guess, was that I had so many people there for me. It was great, don't get me wrong, but it still wasn't the same thing as being able to pick up the phone and tell my folks that I had played really well. "
|—MLB Gary Brackett
"What's that old saying about what doesn't kill you makes you tougher?" Brackett said, in explaining how he has weathered the incredible emotional toll. "Yeah, there have been some tough times lately. I mean, last year, before they took the marrow from me for my brother, I had to inject myself with [a drug] that basically made me sick. That's how they increase the [blood] cell count. So here I am, an athlete, trying to take care of my body, and I'm basically injecting a flu into myself every day. But it wasn't much of a price if you consider what my brother was going through. I mean, I survived, and I'm healthy and doing something I love doing."
Brackett has always been a survivor. Essentially unrecruited after his high school career, he walked on at Rutgers, skipped football his first year in school to work on academics, and then became a very good player. Two years into his college playing career, with his parents and he still footing the bill for tuition, Brackett was about one semester away from running out of money, and having to transfer to Rowan University, a Division III school in Glassboro, N.J. Finally, the coaches awarded him a scholarship.
General manager Bill Polian and his personnel staff, a group of scouts that annually has one of the best undrafted free-agent crops, unearthed Brackett. He is one of 13 undrafted players on the current Indianapolis roster, and clearly one of the team's best finds.
Not every game, for sure, will be like last Sunday's for Brackett, a player admired by his teammates for his perseverance and character. But it appears he has lent stability and new playmaking potential to the middle linebacker spot for the Colts. And there is, at least recently, a new stability in his life as well.
"I've been given an opportunity," said Brackett, who, counting his scrimmage and special teams duties, logged about approximately 75 plays last Sunday night. "I was raised in a good environment, and to believe that the best way you honor the dead is with how you live your life. No matter how stormy it gets, there's going to be a rainbow sooner or later, and maybe this is the time for my rainbow."
Len Pasquarelli is a senior NFL writer for ESPN.com. To check out Len's chat archive, click here .
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Portishead Announce 2013 Tour Dates
Three European Festival Gigs
Portishead have confirmed a trio of new tour dates, performing at various European festivals in 2013. The UK threesome are scheduled to play at the Caprices Festival in Crans-Montana, Switzerland in March, followed by two June appearances at Sweden's Hultsfred Festival and Denmark's NorthSide Festival.
Still no word on when the band's promised next record will see the light of day.
Portishead Tour Dates:
03/12 – Crans-Montana, CH @ Caprices Festival
06/13-15 – Hultsfred, SE @ Hultsfred Festival
06/14-16 – Aarhus, DK @ NorthSide Festival
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