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219 - Electric heating
219121110 - By arc
219121600 - Using laser
219121670 - Cutting
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|LASER PROCESSING SYSTEM, OBJECT MOUNT AND LASER PROCESSING METHOD - A processing system includes a common base, an object mount configured to hold an object for inspection or processing, and at least one aperture plate provided on the object mount. The aperture plate has at least one aperture The processing system also includes a laser device mounted on the common base and configured to scan a laser beam across a scan region, and a transport device configured to displace the object mount relative to the common base from a first position to a second position. When the object mount is in the first position, the object and the at least one aperture are positioned within the scan region of the laser device. The processing system also includes at least one light guide provided on the object mount. The light guide has an input port provided by the at least one aperture, and an output port. The processing system also includes at least one light detector mounted at a fixed position relative to the common base and configured to detect light emerging from the output port of the light guide.
|IN-LINE METROLOGY METHODS AND SYSTEMS FOR SOLAR CELL FABRICATION - In-line metrology methods and systems for use with laser-scribing systems used in solar-cell fabrication are disclosed. Such methods and systems can involve a variety of components, for example, a device for measuring the amount of power input to a laser, a power meter for measuring laser output power, a beam viewer for measuring aspects of a laser beam, a height sensor for measuring a workpiece height, a microscope for measuring workpiece features formed by the laser-scribing system, and a system for monitoring a laser-scribing system and annunciating a warning(s) and/or an error message(s) when operational limits are exceeded. In-line metrology methods can also include the processing of output beam reflections so as to track beam drift over time and/or provide for focusing of an imaging device.
|METHOD OF CUTTING PLASTIC SUBSTRATE AND APPARATUS FOR CUTTING PLASTIC SUBSTRATE - A laser emitter arranged to face a plastic substrate makes relative movement along a surface of the plastic substrate, while it is emitting a laser, so as to laser-cut the plastic substrate. In this process, a shield member is arranged outside a laser irradiation region on the plastic substrate.
|METHOD OF LASER MICRO-MACHINING STAINLESS STEEL WITH HIGH COSMETIC QUALITY - A process to laser micro-machine a metal part with a high cosmetic quality surface includes applying a protective coating layer to at least one surface of the part before micro-machining the part with a laser. The protective coating applied to the high quality cosmetic surface can have a thickness of between about 5 mil and about 10 mil, inclusive and have sufficient adhesion strength to adhere to the part without delaminating during processing. The protective coating applied to the machining surface of the part can be a metallic material, such as a metallic foil or tape.
|APPARATUS AND METHOD FOR LASER MACHINING - A laser machining device includes a laser oscillator, a laser machining head, an optical fiber transmitting the laser beam oscillated by the laser oscillator to the laser machining head, and an assist gas supply supplying an assist gas of oxygen to the laser machining head. The optical fiber includes a remover removing a clad transmitting beam or reducer for reducing the beam. The laser beam leaked from the core of the optical fiber into the clad is absorbed by a beam absorber at the remover. The structure ensures a high quality surface with no irregularity on the metal surface cut by the laser beam projected from the machining head.
|Apparatus for cutting substrate - An apparatus for cutting a substrate includes a laser oscillator generating a femtosecond laser beam, a first beam splitter splitting the femtosecond laser beam into first and second femtosecond laser beams, a first condenser lens receiving the first femtosecond laser beam and condensing the first femtosecond laser beam to have a first focal depth, a second condenser lens receiving the second femtosecond laser beam, and condensing the second femtosecond laser beam to have a second focal depth different from the first focal depth, and a second beam splitter receiving and splitting the first femtosecond laser beam condensed through the first condenser lens and the second femtosecond laser beam condensed through the second condenser lens, and irradiating the split first and second femtosecond laser beams at different positions on a substrate to be cut.
|Fiber Laser Cutting Process with Multiple Foci - A process for laser cutting a workpiece comprising the steps of providing a fiber-type laser resonator; providing a workpiece to be cut having a thickness of at least 1 mm; generating a laser beam using the laser resonator; focusing the laser beam in several distinct focus points, at least one of said focus points being focused in the thickness of the workpiece to be cut; and cutting said workpiece at a speed of at least 20 m/min.
|DEBRIS CAPTURE AND REMOVAL FOR LASER MICROMACHINING - A method of capturing and removing metallic debris created on a target side of a target metal specimen undergoing laser micromachining entails providing a barrier that encompasses the immediate volume surrounding a laser cutting head output nozzle to contain the ejected debris and extracting the debris through a vacuum outlet. A preferred system implementing this approach to debris management includes a barrier in the form of a flexible fiber brush configured in the shape of a ring and positioned to trap ejected debris within a localized area surrounding a target area where the laser beam is incident on the target metal specimen. The ring brush is made of material that is robust to molten metals. An inert gas directed at a high flow rate along the target surface of the metal specimen carries ejected surface debris trapped in the ring brush toward a vacuum outlet.
|LASER PROCESSING APPARATUS AND LASER PROCESSING METHOD - A laser processing apparatus including a holding unit for holding a workpiece, a processing unit for applying a laser beam to the workpiece held by the holding unit, a surface displacement detecting unit for detecting a surface displacement of the workpiece, and a focal position adjusting unit for adjusting the position of a focusing lens provided in the processing unit according to the surface displacement detected. The surface displacement detecting unit includes a detecting light source capable of oscillating light having a plurality of wavelengths different from the wavelength of the laser beam and a wavelength selecting section configured to select one of the plurality of wavelengths as the wavelength of detecting light. The detecting light having the selected wavelength is focused by the focusing lens and applied to the workpiece.
|SYSTEM METHOD AND APPARATUS FOR DRY-IN, DRY-OUT, LOW DEFECT LASER DICING USING PROXIMITY TECHNOLOGY - A substrate processing system includes a first, movable surface tension gradient device, a dicing device and a system controller. The first, movable surface tension gradient device is capable of supporting a first process within a first meniscus. The first meniscus being supported between the first surface tension gradient device and a first surface of the substrate. The first movable surface tension gradient device capable of being moved relative to the first surface of the substrate. The dicing device is oriented to a desired dicing location. The desired dicing location being encompassed by the meniscus. The system controller is coupled to the dicing device and the surface tension gradient device. The system controller includes a process recipe. A method for dicing a substrate is also described. The method of dicing a substrate including placing a substrate in a substrate dicing system, forming a meniscus between a proximity head and a first surface of the substrate, dicing the substrate at a desired dicing location and simultaneously capturing any particles and contaminants generated by dicing the substrate within the meniscus, the meniscus including the desired dicing location and moving the meniscus in a desired dicing direction.
|LASER DICING METHOD - A laser dicing method for a substrate to be processed having a metal film on a surface thereof includes a metal film removing step for placing the substrate to be processed on a stage, irradiating the metal film with a defocused pulse laser beam, and removing the metal film, and a crack forming step for irradiating a region where the metal film is removed of the substrate to be processed with a pulse laser beam, and forming a crack in the substrate to be processed.
|Masking device for laser machining system and method - A laser machining system for machining a workpiece is disclosed. The workpiece may have a primary surface and a secondary surface. The system may have a laser emitter configured to emit a laser beam. The system may also have a masking device having an absorbing portion formed from corundum. The absorbing portion may have a surface portion shaped to approximately correspond to a contour of an inner side of the primary surface of the workpiece.
|Method and system for cutting solid materials using short pulsed laser - A method of cutting a solid material using a pulsed laser includes providing a pulsed laser beam, selecting a target point in the solid material, focusing the pulsed laser beam on the solid material such that at the target point in the solid material the pulsed laser beam has at least the minimum energy density required to ablate the solid material, and effecting relative motion of the pulsed laser beam with respect to the solid material such that the pulsed laser beam traces a first path to form a scribe line in the solid material and then a second path to form a second scribe line in the solid material, wherein the first path and the second path are essentially parallel and the first and second scribe lines overlap to form a single cut line in the solid material.
|METHOD FOR PARTIALLY STRIPPING A DEFINED AREA OF A CONDUCTIVE LAYER - A method for partial detachment of a defined area of a conductive layer using a laser beam includes forming a conductor track with a defined path from the conductive layer on the substrate, the path defining main axes. The area is segmented into zones. A linear recess is provided along a respective perimeter of each of the zones. Each of the zones has a strip shape such that the recesses extend along paths that are substantially straight lines not parallel to either of the main axes. One of the zones to be removed is heated using laser radiation until adhesion of the conductive layer to the substrate is substantially reduced and the zone to be removed is detached in a surface-wide manner from the substrate under external influences. Laser-beam parameters are set such that only the conductive layer is removed without affecting an underlying substrate.
|LASER WORKING METHOD - A converging point of processing laser light is made to accurately follow a laser light irradiation surface of an object to be processed. An object to be processed
|SYSTEM AND METHOD FOR MULTIBEAM SCANNING - System and method of photoaltering a material. The system includes a laser source operable to produce a primary pulsed beam, a holographic optical element configured to receive the primary pulsed beam and transmit a plurality of secondary beams, and a scanner operable to direct the secondary beams to the material. The secondary beams are based on the primary pulsed beam. The method includes phase shifting a pulsed laser beam to produce an input beam, holographically altering the input beam to produce a plurality of transmission beams, and scanning a portion of the material with the transmission beams.
|LASER PROCESSING METHOD AND LASER PROCESSING APPARATUS - The present invention provides a method and an apparatus for efficiently processing in patterning of an electronic circuit board even when laser beams of differing intensities and wavelengths are irradiated in multiple stages. A laser processing apparatus is provided with first and second laser oscillators for emitting laser beams of which at least the wavelength or the intensities are different from each other; a stage apparatus for moving a workpiece to be processed; and optical systems for guiding the laser beams to prescribed positions of the workpiece. The optical systems can be moved by means of an adjusting device according to the relative moving direction of the laser beams and the workpiece to permit the prescribed position of the subject to be irradiated with laser beams in that order so that the workpiece can be processed by the laser beams. Thus, efficient laser processing can be performed without limiting the relative moving direction of the laser beams and the workpiece and without unnecessary movement.
|Laser Processing Machines and Methods of Processing Workpieces - A laser processing machine for processing workpieces, in particular metal sheets, includes a workpiece support and a beam receiver for the laser beam used as a processing tool. The distance between a workpiece lying on the workpiece support and the beam receiver is variable, owing to the fact that the workpiece support and the beam receiver are positionable relative to one another along the beam axis of the laser beam by means of an adjusting drive of an adjusting device with a positioning movement of a variably definable magnitude. A method for processing workpieces, in particular metal sheets, is also provided.
|LASER PROCESSING METHOD AND LASER PROCESSING DEVICE - A laser processing method for forming a modification region serving as a starting point of cutting inside a member to be cut along a planned cutting line by relatively moving an optical axis of a condenser lens along the planned cutting line of the member and by irradiating the member with focused laser light, wherein a plurality of cross-sectional focused spots is simultaneously formed on a section which is perpendicular to the optical axis of the condenser lens at positions having a predetermined depth from a surface of the member and which is parallel to the surface and, at that time, at least one cross-sectional focused spot of the plurality of cross-sectional focused spots is formed on a projection line of the planned cutting line onto the cross section to form one or more inside modification regions having a desired shape.
|SURFACE PROTECTION SHEET FOR LASER MATERIAL PROCESSING - The object of the present invention is provision of a surface protection sheet for laser processing to be applied to the surface on the opposite side of the laser beam irradiation face, which can protect the surface of an application object, and does not allow easy development of a dross during laser cutting processing. According to the present invention, a surface protection sheet
|LASER PROCESSING METHOD AND LASER PROCESSING SYSTEM - An object to be processed
|Laser Machining Method - A laser processing method which can reduce the chipping generated when a plate-like object to be processed formed with a modified region is turned into small pieces in steps other than its dividing step.
|LASER PROCESSING METHOD - To provide a laser processing method which is capable of enhancing the dividing performance according to a required quality. By irradiating an object to be processed with a laser light L having a pulse waveform in which its half width and its bottom width are equal to one another, a plurality of modified spots are formed along a line to cut inside the object, and a modified region is formed with the plurality of modified spots. Here, a laser light source
|LASER CUTTING HEAD AND METHOD FOR CUTTING A WORKPIECE BY MEANS OF A LASER CUTTING HEAD - The invention relates to a device (
|CUTTING PROCESS AND CUTTING DEVICE - In a process for cutting a work piece
|Autofocus for Ablation Laser - A laser ablation system is controlled by an autofocus subsystem particularly optimized for precision ablation of large workpieces, in an open factory environment where temperatures are not tightly controlled, where the workpieces may have high-spatial-frequency features that affect the focus condition of the working beam. The autofocus operates at a high bandwidth to support high process speed. The autofocus beam shares most of its optical path with the working beam, so its measurements account for thermal effects in the beam train as well as the workpiece. The autofocus beam measures target or adjacent areas just before, or during, ablation, so that temperature drifts do not have time to change the effective focus error. The autofocus spot is substantially the same size as the working spot, so its measurements account for workpiece features of the same spatial frequencies that affect the working beam.
|Method and device for dividing a plane-parallel plate made of a brittle material into a plurality of individual plates by means of a laser - The present invention relates to a method of dividing a plane-parallel plate made of a brittle material into a plurality of individual plates having a specified edge length, in which break-off cuts are made along specified scored lines that form a lattice-like pattern by introducing thermally induced stresses by means of a laser beam, and in which, after making the break-off cuts along a first working direction, the resultant plate strips are spaced out at intervals in that a framed stretch film to which the plane-parallel plate is bonded is stretched by means of a vacuum device. The invention also relates to a device with a special clamping table for use in carrying out the method.
|LASER PROCESSING METHOD - Laser lights L
|LASER MACHINING DEVICE AND LASER MACHINING METHOD - A laser machining device is provided with a laser light source, a spatial light modulator, a driving unit, a control unit, and a condensing optical system. The control unit selects a basic hologram corresponding to each basic machining pattern included in a whole machining pattern in a workpiece from a plurality of basic holograms stored by the storage unit, and determines a display region of the basic hologram in the spatial light modulator so that the deviation of the value of "Iη/n" becomes small for the selected respective basic hologram when the intensity of a laser beam input to a display region of the basic hologram in the spatial light modulator is defined as I, the diffraction efficiency of the laser beam in the basic hologram is defined as η, and the number of condensing points in a basic machining pattern corresponding to the basic hologram is defined as n.
|METHOD OF LASER MICRO-MACHINING STAINLESS STEEL WITH HIGH COSMETIC QUALITY - A process to laser micro-machine a metal part with a high cosmetic quality surface, including applying a protective coating layer to at least one surface of the part to physically isolate the surface from air prior to micro-machining the part with a laser, and sacrificing the protective layer to block/consume oxygen in air by carbonization and oxidation due to strong laser irradiation. The protective coating applied to at least one of a front side high quality cosmetic surface and a back side surface of the part. The coating layer being highly transparent to an applied laser beam, having a thickness of between approximately 5 mil and approximately 10 mil, inclusive, and having sufficient adhesion strength to adhere to the part without delaminating during processing. The laser can be selected from a nano-second pulse width laser and a micro-second pulse width laser to process the part.
|Method for producing coarse surface structures - A method for producing rough surface structures comprising the following step: running a laser beam along filling lines (
|METHOD FOR LASER PROCESSING GLASS WITH A CHAMFERED EDGE - A laser machining process is described for laser machining glass or glass-like materials. This process machines articles or features in articles with chamfered edges in one manufacturing operation. Chamfered edges are desirable in glass and glass-like materials because they resist fracturing or chipping and eliminate sharp edges. Producing articles or features in articles in one manufacturing operation is desirable because it can save time and expense by eliminating the need to transfer the article to a separate machine for chamfering after laser machining. Alternatively, it can permit use of less expensive equipment because the same laser used for machining can be used to form the chamfer instead of having a separate process perform the chamfering. Producing chamfers with laser machining results in high quality chamfers without the need for a separate polishing or finishing step.
|ENERGY EFFICIENT, LASER-BASED METHOD AND SYSTEM FOR PROCESSING TARGET MATERIAL - An energy-efficient method and system for processing target material such as microstructures in a microscopic region without causing undesirable changes in electrical and/or physical characteristics of material surrounding the target material is provided. The system includes a controller for generating a processing control signal and a signal generator for generating a modulated drive waveform based on the processing control signal. The waveform has a sub-nanosecond rise time. The system also includes a gain-switched, pulsed semiconductor seed laser for generating a laser pulse train at a repetition rate. The drive waveform pumps the laser so that each pulse of the pulse train has a predetermined shape. Further, the system includes a laser amplifier for optically amplifying the pulse train to obtain an amplified pulse train without significantly changing the predetermined shape of the pulses.
|METHOD AND DEVICE FOR MONITORING A LASER PROCESSING OPERATION TO BE PERFORMED ON A WORKPIECE AND LASER PROCESSING HEAD HAVING SUCH A DEVICE - The invention relates to a method for monitoring a laser machining operation to be performed on a workpiece, comprising the following steps: detecting at least two current measured values by at least one sensor, which monitors the laser machining operation, determining at least two current characteristic values from the at least two current measured values, wherein the at least two current characteristic values jointly represent a current fingerprint in a characteristic value space, providing a predetermined point set in the characteristic value space, and classifying the laser machining operation by detecting the position of the current fingerprint relative to the predetermined point set in the characteristic value space, wherein the at least one sensor comprises at least one camera unit, which records camera images with different exposure times and processes them together by using a high dynamic range (HDR) method, in order to provide images having a high contrast ratio as the current measured values.
|METHOD AND APPARATUS FOR LASER STRIP SPLICING - A splicing apparatus for joining a trailing end of a downstream metal strip to the leading end of an upstream metal strip includes a base having a working surface, a cover assembly operatively connected to the base and movable between an open position and a closed position, a fixed platen fixedly secured to the working surface, a moving platen slidably connected to the working surface, and a laser device for both cutting said downstream and upstream metal strips and for welding said metal strips together, the laser device including a laser source and a laser head in communication with the laser source, the laser head being connected to said cover assembly.
|LASER MACHINING SYSTEMS AND METHODS WITH MOVING LASER SCANNING STAGE(S) PROVIDING FORCE CANCELLATION - Laser machining systems and methods may use one or more moving laser scanning stages with force cancellation. The force cancellation is provided by moving masses linearly with equal and opposition motion. One or more of the masses may be a laser scanning stage. The laser machining systems may be used to scribe one or more lines in large flat workpieces such as solar panels. In particular, laser machining systems and methods may be used to scribe lines in thin film photovoltaic (PV) solar panels with accuracy, high speed and reduced cost.
|LASER MACHINING SYSTEMS AND METHODS WITH MULTIPLE BEAMLET LASER BEAM DELIVERY SYSTEMS - Multiple beamlet laser beam delivery systems and methods may be used in laser machining systems and methods to machine multiple regions on a workpiece simultaneously. One embodiment of a laser machining system and method may be used, for example, to scribe one or more lines in large flat workpieces such as solar panels. In particular, laser machining systems and methods may be used to scribe lines in thin film photovoltaic (PV) solar panels with accuracy, high speed and reduced cost. The multiple beam delivery systems may be movable to scribe multiple lines simultaneously in the workpiece.
|METHOD OF DIVIDING WORKPIECE USING LASER BEAM - A workpiece including an irregularly shaped portion on a dividing line is divided along the dividing line by detecting the location of the irregularly shaped portion, applying a detecting laser beam to an area of the workpiece except for the detected location, along the dividing line to detect the height of a surface of the workpiece except for the location, applying and focusing a machining laser beam having a wavelength which permeates the workpiece within the workpiece while moving a focused spot of the machining laser beam based on the detected height of the surface of the workpiece to form a modified layer in an area of the workpiece except for at least the location of the irregularly shaped portion along the dividing line, and applying an external force to the modified layer to divide the workpiece along the dividing line.
|FILM CUTTING APPARATUS AND FILM CUTTING METHOD - A film cutting device and a film cutting method, in which smoke produced while a protective film is being cut by a laser along the outer and inner edges of a substrate can be prevented from adhering to the film and be efficiently exhausted, are provided. The device has a laser radiation device
|LASER PROCESSING APPARATUS AND METHOD USING BEAM SPLIT - Disclosed are a laser processing apparatus and method that can effectively remove a low-k material formed on a wafer. A laser processing apparatus of the invention is a laser processing apparatus that processes a subject on which a low-k material is formed. The laser processing apparatus includes a laser generating unit that emits a laser beam; and an optical system that splits the laser beam emitted from the laser generating unit into two and irradiates the split laser beams onto the subject In this case, the optical system includes a pair of condensing lenses in which cut surfaces that are cut at a predetermined distance from central axes to be parallel to the central axes contact with each other, and the interval between the two split laser beams is the same as the interval between two edges of the low-k material in a removal subject region. According to the invention, after splitting a laser beam into two laser beams and primarily removing the edges of the low-k material in the removal subject region using the laser beams, the remaining low-k material between the edges is removed. As a result, it is possible to improve processing quality.
|Method for Cutting Stainless Steel with a Fiber Laser - The invention relates to a laser cutting method for cutting a stainless steel workpiece using laser beam generation means comprising a silica fibre with an ytterbium-doped core to generate the laser beam. Preferably, the laser beam generated by the ytterbium-based fibre has a wavelength between 1.07 and 1.09 μm, a quality factor of the laser beam is between 0.33 and 8 mm.mrad, and the laser beam has a power of between 0.1 and 25 kW. The assistance gas for the laser beam is chosen from nitrogen, helium, argon and mixtures thereof, and, optionally, it further contains one or more additional compounds chosen from O
|METHODS AND APPARATUS FOR REDUCING VARIATIONS IN THE LASER INTENSITY DURING SCRIBING A PHOTOVOLTAIC DEVICE - Methods are generally provided of reducing speckle of a laser beam from a laser source guided through an optical waveguide. The method includes vibrating an optical waveguide at a first point along the optical waveguide at a first frequency (e.g., having a range of about 20 kHz to about 20 GHz) for a certain distance (e.g., a distance of about 0.1 mm to about 5 cm), and directing the laser beam out of the optical waveguide from the laser source to a target. Such methods are particularly useful for scribing a thin film layer on a photovoltaic module (e.g., a cadmium telluride-based thin film photovoltaic device). Fiber optic laser systems are also generally provided for reducing speckle of a laser beam from a laser source guided through an optical waveguide.
|Method And Device For Processing A Movable Substrate By Means Of Laser - The invention relates to a method for processing a movable substrate by means of laser, wherein the processing results in the release of material separated from the substrate, wherein during processing of the substrate a higher pressure prevails on the side of the substrate where the substrate is impinged by the laser beam than on the other side of the substrate, and to a device for performing such a processing, wherein the device comprises guide means for guiding the substrate and laser processing means adapted to cast onto the substrate a laser spot which processes the substrate in a laser processing zone, and comprises means for generating a higher pressure on the side of the substrate where the substrate is impinged by the laser beam than on the other side of the substrate.
|Process For Laser Cutting A Metal Plate - The present invention provides a process for laser cutting a metal plate that comprises a) providing at least a laser cutting device, b) providing a metal plate to be cut from a metal coil, c) providing at least a holding apparatus holding and maintaining the metal plate, d) cutting said metal plate by means of at least a laser beam delivered by said at least one laser cutting device In this process, during step d), the metal plate is first cut by a first line comprising at least a first cutting machine, into at least one peripheral blank, and at least one peripheral blank is subsequently fed to at least a second line comprising at least a second cutting machine, to be cut into several smaller individual final blanks. With regard to this process, the first line produces peripheral blanks faster than at least one second cutting machine of the second line can cut them into several smaller individual final blanks. During laser cutting in the second line, said peripheral blank is held and maintained in position by said at least one holding apparatus.
|LASER PROCESSING METHOD AND LASER PROCESSING APPARATUS - A laser processing method of applying a pulsed laser beam to a workpiece formed from a transparent member, thereby performing laser processing to the workpiece. The laser processing method includes a first laser processing step of applying a first pulsed laser beam to a subject area of the workpiece to roughen the subject area and a second laser processing step of applying a second pulsed laser beam to the subject area roughened by the application of the first pulsed laser beam immediately after performing the first laser processing step, thereby forming a recess in the subject area. The first laser processing step and the second laser processing step are repeated to thereby form a continuous groove in the subject area.
|OPTICAL FILM CUTTING METHOD AND OPTICAL FILM - This invention relates to an optical film cutting method which includes cutting an optical film by irradiating the optical film with a laser beam under conditions that an energy per unit length is 0.12 to 0.167 J/mm and that a continuous irradiation time is 0.1 msec or less; as well as to an optical film that is cut by the cutting method and has a size of a raised part generated on a cutting surface thereof of 30 μm or less. According to the optical film cutting method of this invention, it is possible to maintain the raised part size on the optical film cutting surface as small as possible even in the case where the laser beam has characteristics of a gaussian beam, thereby enabling prevention of bonding defect and optical defect when the optical film is incorporated into various optical panels.
|Implant Device and Method for Manufacture - Disclosed are systems, devices and methods for optimizing the manufacture and/or production of patient-specific orthopedic implants. The methods include obtaining image data of a patient, selecting a blank implant to be optimized for the patient, and modifying the blank implant utilizing techniques disclosed herein to alter specific features of the implant to conform to the patient's anatomy.
|WORKPIECE SPLITTING METHOD AND OBJECT PRODUCING METHOD - A workpiece splitting method includes mounting a protection sheet on a first surface of a workpiece to transmit a first laser beam through the sheet and protect the first surface; forming a modified region by multiple photon absorption inside the workpiece by concentrating, inside the workpiece, the first laser beam applied to the workpiece from a first surface side of the workpiece and transmitted through the protection sheet; and removing, from the first surface, a part of the protection sheet positioned on a line of intersection between the first surface and a splitting plane formed on the workpiece when splitting the workpiece at a portion where the modified region is formed, so as to split the workpiece at the modified region-formed portion.
|LASER MACHINING SYSTEMS AND METHODS WITH VISION CORRECTION AND/OR TRACKING - Vision correction and tracking systems may be used in laser machining systems and methods to improve the accuracy of the machining. The laser machining systems and methods may be used to scribe one or more lines in large flat workpieces such as solar panels. In particular, laser machining systems and methods may be used to scribe lines in thin film photovoltaic (PV) solar panels with accuracy, high speed and reduced cost. The vision correction and/or tracking systems may be used to provide scribe line alignment and uniformity based on detected parameters of the scribe lines and/or changes in the workpiece.
|Method for Manufacturing Display Apparatus and Manufacturing Apparatus of the Display Apparatus - [PROBLEM] A thin film laminated substrate is cut by a laser beam under certain conditions, so that a cut surface which is sufficient for a display apparatus can be obtained without damaging the thin film laminated substrate, and the cutting is enabled by a low-output inexpensive apparatus, so that a reduction in cost can be expected.
|Support Table Frame For High Speed Laser Blanking - The present invention provides an apparatus for laser cutting that comprises a rigid support table frame having a X-axis and a Y-axis, and one or more bridge rail modules running across the Y-axis of the table frame, each bridge rail module comprising at least one hold-down device module. The present invention further provides a process for laser cutting a metal plate using this apparatus.
|LIGHT BEAM SCANNING APPARATUS, LASER MACHINING APPARATUS, TEST METHOD AND LASER MACHINING METHOD - An apparatus for scanning a light beam, the apparatus comprises a mirror configured to reflect an incident light beam, a motor configured to rotate the mirror so change a direction along which the light beam reflected by the mirror travels, a detector configured to detect tilt of a detected region of the mirror with respect to a rotation angle of the mirror, and a processor configured to calculate an amount of tilt of the mirror with respect a direction along a rotation axis of the motor, based on the rotation angle of the mirror and the tilt of the detected region detected by the detector.
|METHOD FOR PRODUCING BLANK PRINTING SLEEVE FOR LASER ENGRAVING, AND APPARATUS FOR PRODUCING THE SAME - The present invention provides a method for producing a blank printing sleeve for laser engraving, comprising: (1) a step of laminating a photosensitive resin composition layer (a) on a hollow cylindrical support (b); (2) a step of photo-curing the laminated photosensitive resin composition layer (a) to form a cured photosensitive resin layer (c); and (3) a step of cutting the hollow cylindrical support (b) and the cured photosensitive resin layer (c) approximately in a circumferential direction of the hollow cylindrical support (b) by a laser cutting method and/or a water beam cutting method.
|Manufacturing system having delivery media and grin lens - A manufacturing system is disclosed. The manufacturing system may have a laser source configured to generate a laser beam, and a delivery media operatively connected to the laser source. The manufacturing system may also have a gradient index lens located at a tip end of the delivery media to refract and focus the laser beam exiting the delivery media.
|Method and device for the removal of material by means of laser pulses - The invention relates to a method for removing material by means of a laser, wherein a sequence of laser pulses is generated and an area of material to be machined is irradiated with the sequence of laser pulses. Methods of this kind are used to cut a number of different materials. One problem with this method is that thermal or mechanical damage occurs in the surroundings of the area being machined and causes impairment of areas of material that are not being machined. The invention solves this problem by the pulse energy of a single pulse in the sequence of laser pulses being lower than the laser pulse energy required to produce material removal using an isolated laser pulse in the region irradiated with the single laser pulse of the sequence of laser pulses.
|RELIEF MANUFACTURING APPARATUS AND RELIEF MANUFACTURING METHOD - A relief manufacturing apparatus includes: a laser beam irradiating device configured to irradiate laser beam on an engraving material; a scanning device configured to move at least one of the engraving material and the laser beam irradiating device; a numerical value acquiring device configured to acquire a numerical value including a first inclination angle indicating inclination of the inclined face of the relief; a control device configured to control the scanning device and the laser beam irradiating device so that the laser beam is irradiated on a surface of the engraving material to form an initial inclined face having a second inclination angle smaller than the first inclination angle and thereafter the laser beam is irradiated on the initial inclined face to enlarge the inclination of the inclined face from the second inclination angle to the first inclination angle.
|METHODS FOR LASER PROCESSING ARRAYED OPTICAL FIBERS ALONG WITH SPLICING CONNECTORS - A method for laser processing arrays of optical fibers and high-fiber count splicing connectors and adapters are disclosed. The method includes the steps of providing a structure having optical fibers arranged in a plurality of rows and placing a protection element adjacent to a first row of optical fibers and a second row of optical fibers. Thereafter, the first row of optical fibers can be processed using the laser. The protection element may also be used to move optical fibers. In one embodiment, the protection element has a first portion and a second portion that have relative movement therebetween. In other variations, an absorption element may be provided adjacent the first row of optical fibers for inhibiting incidental damage to the structure.
|METHOD OF CUTTING PARTS TO BE MACHINED USING A PULSED LASER - The invention relates to a method for cutting parts (
|TOOL HOLDING SYSTEM - Tool holding systems described herein include a tool holder configured to releasably retain a metal-processing tool and to define a tool holder passage extending along a stroke axis, an adjustment drive operable to rotate the tool holder about the stroke axis, and a stroke drive including a spindle operable independent of the adjustment drive to translate the tool holder along the stroke axis. The stroke drive defines a stroke drive passage cooperating with the tool holder passage to define a waste disposal passageway through the tool holding system.
|Method and apparatus for scoring and separating a brittle material with a single beam of radiation - A method and an apparatus for both scoring and separating a brittle material, and in particular a glass sheet or substrate, using only a single laser beam. A radiation zone created by the beam incident on the glass substrate, and the radiation zone is effectively formed into two portions by a coolant jet incident on the radiation zone. The radiation zone is separated into a leading portion, which generates a vent crack partially through a thickness of the substrate, and a trailing portion that propagates the vent crack through the remainder of the substrate, thereby separating the substrate.
|LASER PROCESSING METHOD - While a converging lens
|LASER SYSTEMS AND METHODS USING TRIANGULAR-SHAPED TAILORED LASER PULSES FOR SELECTED TARGET CLASSES - Processing workpieces such as semiconductor wafers or other materials with a laser includes selecting a target to process that corresponds to a target class associated with a predefined temporal pulse profile. At least one of the predefined temporal pulse profiles may be triangular. The target class may include, for example unpassivated electrically conductive links or other bare metal structures. Based on the target class associated with the selected target, a laser pulse is generated having a triangular temporal pulse profile. The generated laser pulse is used to process the selected structure.
|Laser Processing Apparatus and Laser Processing Method - A laser processing apparatus for processing a multitude of portions to be processed in an area to be processed in a subject W to be processed, including a laser device, a focusing or imaging means for laser beams provided by the laser device, and an arranging means for arranging the subject W to be processed, in which the subject W to be processed and the focusing or imaging means are fixed, and the subject to be processed is processed while relatively shifting the laser beams and the focusing or imaging means so that the focusing or imaging means is irradiated from different areas in the laser beam, inside and outside the area to be processed, and that cumulative laser beam irradiation time during the processing of each of the multitude of portions to be processed is equalized.
|Laser Processing Method and Device - A laser processing method which can efficiently perform laser processing while minimizing the deviation of the converging point of a laser beam in end parts of an object to be processed is provided.
|Laser Cutting Machine - A laser cutting machine includes a platform and a motion system. The motion system includes a first prismatic joint facilitating a first motion of the platform along a first direction and a second prismatic joint facilitating a second motion of the platform along a second direction. A galvano arranged on the platform, such that a motion of the platform causes a motion of the galvano, the galvano including a first mirror, wherein a third motion of the first mirror positions the laser beam along a third direction, and a second minor, wherein a fourth motion of the second mirror positions the laser beam along a fourth direction. A control module controls concurrently the motion system and the galvano, such that a position of the laser beam on the workpiece is a vector sum of the first motion, the second motion, the third motion, and the fourth motion.
|LASER CUTTING METHOD - Laser cutting method using a CO
|METHOD FOR CUTTING WORKPIECE - A method of cutting an object to be processed is provided, which can accurately cut an object to be processed comprising a substrate and a multilayer part provided on the front face of the substrate while having a plurality of functional devices into the functional devices along a line to cut in a short time even when the substrate is thick. A substrate
|METHOD AND SYSTEM FOR HIGH-SPEED, PRECISE MICROMACHINING AN ARRAY OF DEVICES - A method and system for high-speed, precise micromachining an array of devices are disclosed wherein improved process throughput and accuracy, such as resistor trimming accuracy, are provided. Beam scanning and deflection are both used to distribute beam spots to elements of an array of elements for selective processing. The deflection can be performed with a solid state deflector.
|MACHINING SCORE LINES IN A RUPTURE DISC USING LASER MACHINING - A method of forming a score line in a rupture disc using a laser is provided, wherein the method includes selecting a wavelength for the laser that maximizes absorption of the laser radiation by the disc material, selecting a pulse duration for the laser that maximizes a peak power of the laser, selecting a pulse repetition rate for the laser that reduces a heat affected zone of the rupture disc during ablation, and selecting the speed of relative motion between the laser and the rupture disc. The score line is ablated in the rupture disc using the laser to remove material from the rupture disc as vapor without melting or oxidizing disc material adjacent the material being removed.
|Laser Processing Method - A laser processing method by which an object to be processed can be cut with a high precision is provided.
|Laser machining apparatus and method of adjusting the same - A laser machining apparatus includes a laser generator for generating a laser beam and a driver unit for moving the laser beam relatively with respect to a workpiece as to emit the laser beam on the workpiece. The laser beam includes plural laser pulses. The laser pulses have spots each having a longitudinal direction. The driver unit moves the laser beam in the longitudinal direction relatively with respect to the workpiece so that the spots overlap each other. This laser machining apparatus can process the workpiece at high quality and high productivity.
|Method and apparatus for processing substrates using a laser - The invention relates to a method and apparatus for processing substrates, such as glass and semiconductor wafers. The method comprises directing to the substrate from a laser source a plurality of sequential focused laser pulses having a predetermined duration, pulsing frequency and focal spot diameter, the pulses being capable of locally melting the substrate, and moving the laser source and the substrate with respect to each other at a predetermined moving velocity so that a structurally modified zone is formed to the substrate. According to the invention, the pulse duration is in the range of 20-100 ps, pulsing frequency at least 1 MHz and moving velocity adjusted such that the distance between successive pulses is less than ⅕ of the diameter of the focal spot. The invention can be utilized, for example, for efficient dicing, scribing and welding of materials which are normally transparent.
|LASER PROCESSING METHOD - A laser processing method for preventing particles from occurring from cut sections of chips obtained by cutting a silicon wafer is provided. An irradiation condition of laser light L for forming modified regions
|Laser machining apparatus and method for the manufacture of a rotationally symmetrical tool - The invention resides in a method and an apparatus for the manufacture of a tool from a blank (
|FIBER-OPTIC BEAM DELIVERY SYSTEM FOR WAFER EDGE PROCESSING - A method and apparatus for processing substrate edges is disclosed that overcomes the limitations of conventional edge processing methods and systems used in semiconductor manufacturing. The edge processing method and apparatus of this invention includes a laser and fiber-optic system to direct laser radiation onto a rotating substrate supported by a chuck. A laser beam is transmitted into a bundle of optical fibers, and the fibers accurately and precisely direct the beam to remove or transform organic or inorganic films, film stacks, residues, or particles, in atmosphere, from the top edge, top bevel, apex, bottom bevel, and bottom edge of the substrate in a single process step. Reaction by-products are removed by means of an exhaust tube enveloping the reaction site. This invention permits precise control of an edge exclusion width, resulting in an increase in the number of usable die on a wafer. Wafer edge processing with this invention replaces existing methods that use large volumes of purified water and hazardous chemicals including solvents, acids, alkalis, and proprietary strippers.
|Method for Determining Focal Position - A method for determining a reference focal position of a focused laser beam passing through an opening in a nozzle body of a laser processing nozzle relative to a workpiece, in which the method includes: simultaneously cutting off a portion of the workpiece using the focused laser beam to form an edge on the workpiece and altering a distance between a focal point of the focused laser beam and the workpiece in a direction of an axis of the laser beam; determining coordinates of the edge formed on the workpiece; based on the determined coordinates, determining a section of the edge that protrudes the furthest from the workpiece; and establishing a reference focal position FL of the laser beam based on the determined coordinates corresponding to the section of the edge that protrudes the furthest from the workpiece.
|APPARATUS AND METHOD FOR CUTTING HOLLOW CYLINDRICAL WORKPIECE - A rotatable workpiece holder for holding a hollow cylindrical workpiece thereon functions as a chiller for cooling the hollow cylindrical workpiece. A coolant, e.g., water, is supplied to the hollow cylindrical workpiece through second coolant passages and branch passageways defined in the workpiece holder, thereby cooling the hollow cylindrical workpiece. The coolant forms a film in a clearance between the outer surface of an annular side wall of the workpiece holder and the inner circumferential surface of the hollow cylindrical workpiece.
|LASER PROCESSING METHOD - A modified region
|Method for Producing a Sealing Ring - A method for producing a sealing ring in which a hollow cylinder is first formed from a sheet metal, the mutually contacting edges of the sheet metal being joined in a substance-to-substance bond, the bond being produced in such a way that a bead is formed at least on the outer periphery, along the mutually contacting edges, and is flattened in a subsequent working process.
|PROGRESSIVE LASER BLANKING DEVICE FOR HIGH SPEED CUTTING - A laser blanking device for high speed cutting of a rapidly fed strip of coil stock includes a pin conveyor traveling a recurring loop along a longitudinal axis. At least two moveable gantries are supported above the pin conveyor. Each gantry is capable of moving at least a limited length along the longitudinal axis. At least one moveable laser head is suspended on each gantry, and the laser heads are capable of moving along the corresponding gantry along multiple axes transverse to or parallel to the longitudinal axis of the device. The device further has an entry pinch roll assembly and a second pinch roll assembly positioned at opposed ends of the conveyor. A pair of pinch rollers cooperates with each pinch roll assembly to apply tension to the strip traveling therebetween. Each pinch roller continually feeds the moving strip along the conveyor while the laser heads situated between the pinch roll assemblies move and progressively cut a perimeter portion of a blank or cut-out from the moving strip.
|Optimized machining of a contour using a pulsed tool - A pulsed machining method for the optimized machining of a contour which is characterized in that the instantaneous frequency ratio of φ of the pulse frequency of tool f
|METHOD OF MANUFACTURING COLUMN AND BED OF MACHINE TOOL AND STRUCTURE THEREOF - A technique of easy manufacture of a column and a bed of a machine tool in a short time is provided by having an assembly structure of sheet metal members. A column body of the machine tool is constituted by combining a front member with a rear member
|Automatic Cutting Device and Production Method for Beveled Product - A plasma cutting device performs cutting in a plurality of stages. In a first cutting sub-process, a manufactured product is cut out from a base material upon a stage according to an NC program. Next, images of respective regions in the vicinities of proper positions at two corner points of the manufactured product which has been cut out are photographed by an image sensor, the actual positions of these two corner points of the manufactured product are detected from these images which have been photographed, and the translation distances and the rotational angle between the actual positions which have been detected and the proper positions are calculated. The NC program is corrected. And, in a subsequent cutting sub-process, additional cutting for beveling is carried out upon cutting surfaces at the outer circumference of the manufactured product, according to the corrected NC program.
|LASER PROCESSING METHOD AND LASER PROCESSING APPARATUS - In six rows of molten processed regions
|SYSTEM AND METHOD FOR LASER MACHINING OF THREE-DIMENSIONAL STRUCTURES - A system and method of laser machining rotates a workpiece about an axis of rotation, and translates the workpiece in a first direction along the axis of rotation. A mask defining a shape is translated in a second direction opposite the first direction, and a laser beam is directed at the mask such that the laser beam is scanned across the mask and at least a portion of the laser beam passes through the mask and toward the workpiece. The mask and the workpiece are translated with coordinating opposing motion to cause the laser beam to be imaged onto the workpiece with a shape or pattern corresponding to a shape or pattern defined by the mask. Rotation of the workpiece and the shape of the image on the workpiece produce different vectorial intensities such that material of the workpiece is removed to different respective depths to form a three-dimensional structure.
|LASER PROCESSING METHOD AND LASER PROCESSING DEVICE - In the laser processing method, the cross-sectional form of laser light L at a converging point P is such that the maximum length in a direction perpendicular to a line to cut
|LATITUDINAL ISO-LINE SCRIBE, STITCHING, AND SIMPLIFIED LASER AND SCANNER CONTROLS - The stitch points of segments formed into a workpiece by laser scribing can be improved by controlling aspects such as the velocity of the scanner and the switching points of the laser, such as to allow for lead-in, lead-out, and overlap periods. The locations of the stitch points also can be selected to coincide with existing lines such that the existing lines will function to connect the segments in the event of an offset.
|SYSTEM AND METHOD FOR MINIMIZING FORMATION OF STRIATION PATTERNS IN LASER CUTTING - The system and method for minimizing formation of striation patterns in laser cutting provides real-time monitoring and control of laser cutting quality. Laser cutting of a workpiece is controlled through monitoring of thermal radiation generation, particularly during a laser gas-assisted cutting process. The apparatus includes an optical probe positioned adjacent the impingement point of the laser beam on the workpiece. The optical probe is in communication with a signal analyzer for measuring electrical voltage generated by thermal radiation generated by the cutting of the workpiece. A controller is provided for comparing the measured electrical voltage with a desired threshold voltage. Control signals are generated to selectively adjust output frequency of the laser responsive to the compared measured electrical voltage and the desired threshold voltage to minimize striation pattern generation.
|Machining method and machining system for micromachining a part in a machine component - When forming a micromachined part by water jet guided laser machining at a machine component
|METHODS AND SYSTEMS FOR LASER CUTTING AND PROCESSING TUBING TO MAKE MEDICAL DEVICES - Methods for making devices include providing a tubular member to be formed into a device, placing a removable sacrificial block material in the lumen of the tubular member and laser cutting the tubular member. A doping material can be added to the melted portion of the tubular member to promote the formation of brittle slag. A fixture can be used to hold a cut workpiece in order to ream sacrificial material from the surface of the workpiece. Pressurized gas can be supplied to the inner lumen of the tubular member to cause slag to form on the outside surface, rather than the inner surface, of the tubular member. A tubular member made from nickel-titanium alloy can be tightly adhered to a sacrificial sleeve utilizing the phase changes associated with nickel-titanium. A rotating mandrel can be placed within the lumen of the tubular member during laser cutting. A mandrel which includes an enlarged diameter section causes the workpiece to expand slightly within its elastic deformation range to dislodge islands from the workpiece. Such a mandrel could be formed from a tubular member which has a central lumen that can be used to deliver a pressurized medium to "blast" islands from the workpiece.
|METHOD AND DEVICE FOR MACHINING A WORKPIECE - In a method for machining a workpiece, a laser beam (
|FINE PROCESSING METHOD FOR A MATERIAL OF SINTERED DIAMOND WITH A LASER BEAM, A CUTTER WHEEL FOR A SUBSTRATE MADE OF A BRITTLE MATERIAL AND ITS PRODUCING METHOD THEREOF - The present invention provides a manufacturing method for accurate, fine and efficient processing of a work piece to be processed and prevention of graphitization of the work piece to be processed, when sintered diamond is processed by a laser beam.
|MULTIPLE BEAM LASER SYSTEM FOR FORMING STENTS - A system and method for precision cutting using multiple laser beams is described, The system and method includes a combination of optical components that split the output of a single laser into multiple beams, with the power, polarization status and spot size of each split beam being individually controllable, while providing a circularly polarized beam at the surface of a work piece to be cut by the laser beam. A system and method for tracking manufacture of individual stents is also provided.
|LASER PULSE SYNTHESIS SYSTEM - A laser pulse synthesis system is provided. A further aspect of the present system uses a phase-only modulator to measure ultrashort laser pulses. An additional aspect achieves interferences between split subpulses even though the subpulses have different frequencies. Yet another aspect of a laser system employs multi-comb phase shaping of a laser pulse. In another aspect, a laser system includes pulse characterization and arbitrary or variable waveform generation through spectral phase comb shaping.
|MOLD REMOVING METHOD - A laser mold removing method of the invention is for processing a composite material composed of a plurality of materials having different reflectances to a laser beam, and includes emitting laser beam in which a processing laser beam for processing the processing object and a measurement laser beam adapted to irradiate the processing object and having an output smaller than that of the processing laser beam are emitted, measuring a reflected light quantity of the measurement laser beam reflected by the processing object, and controlling based on the reflected light quantity.
|METHOD FOR PRODUCTION OF SAFETY/RUPTURE DISCS HAVING PRE-CALCULATED BREAKING THRESHOLD - A method for production of safety/rupture devices having pre-calculated breaking threshold comprises the steps of providing a plate (
|METHOD AND DEVICE FOR MACHINING A WORKPIECE - The invention relates to a method for machining a workpiece by means of a laser beam, wherein a laser beam is guided by a beam guiding device over the surface of the workpiece within a working window. The beam guiding device and the workpiece are arranged in such a way that they are movable relative to one another in a direction of displacement along a displacement section and that they can occupy a first and a second relative working position to one another. According to the invention, a point on the workpiece can be machined from the second relative working position, said point being located behind the point which is machined from the first relative working position when viewed in the direction of displacement.
|ABSORBING METHOD AND APPARATUS FOR REAR SIDE LASER PROCESS - An absorbing method and apparatus for rear side laser process is disclosed. A conductive plate contacts or separates above a flexible substrate which is deposited a conductive film therebelow. A power source electrically connects the conductive plate and the conductive film, or only the conductive plate. After the power source provides voltages, a Coulomb electrostatic force is produced between the conductive plate and the conductive film, so as to absorb the flexible substrate and the conductive film. A light source is disposed above the conductive plate and emits a laser beam which in series passes through the conductive plate and the flexible substrate, and then focuses on rear side of the conductive film to process. Therefore, it is able to avoid the flexible substrate bent or drooping, and improve yield rate.
|Method and Apparatus for Laser Machining - A method and apparatus is presented for laser machining complex features in workpieces using programmable laser focal spot shapes. A deformable mirror is inserted into the laser beam path of a laser machining system and programmed to alter the shape of the laser beam focal spot in real time as the workpiece is being laser machined in order to achieve improved control over the shape and size of laser machined features.
|MINIMIZING THERMAL EFFECT DURING MATERIAL REMOVAL USING A LASER - A process to cut sheet material using a laser is improved by performing a first plurality of routings using a first toolpath for the laser and performing at least a second routing using a second toolpath for the laser after performing the first plurality of routings using the first toolpath, the second toolpath traverse from a kerf formed by the laser as a result of performing the first plurality of routings. A z-height shift can be simultaneously implemented with the transverse shift. By shifting the toolpath, interference of plasma generated during laser processing is minimized by maximizing the coupling of the laser and the material, resulting in less discoloration and/or burning of the material.
|LASER PROCESSING METHOD FOR WORKPIECE - A processing method for a workpiece which includes a first modified region forming step of forming first modified regions along first division lines and second division lines near the front side of the workpiece, a second modified region forming step of forming second modified regions at intersecting regions between the first division lines and the second division lines at predetermined positions between the back side of the workpiece and the first modified regions formed in the workpiece by performing the first modified region forming step, and a dividing step of applying an external force to the workpiece after performing the first and second modified region forming steps to thereby divide the workpiece along the first division lines and the second division lines into individual chips.
|METHODS AND APPARATUSES FOR FORMING CUTTING ELEMENTS HAVING A CHAMFERED EDGE FOR EARTH-BORING TOOLS - Apparatuses for forming chamfers on superabrasive tables of cutting elements for earth-boring tools include a chuck for temporarily holding and positioning a cutting element, and at least one emitter for emitting a beam of energy toward an edge of a superabrasive table of a cutting element held and positioned by the chuck. Methods of forming cutting elements for earth-boring tools and methods for forming earth-boring tools are also disclosed.
|Gas Mixture For Laser Beam Fusion Cutting - A gas mixture for laser beam fusion cutting is disclosed. The gas mixture essentially contains N
|Laser processing machines - A laser processing machine is provided which has a machine frame and a laser generator fastened to the machine frame. The laser generator is movable relative to the machine frame.
|Vacuum debris removal system - A turbulence-controlled vacuum debris removal subsystem safely exhausts particles ejected during photoablation. Nested interconnected chambers provide diminishing sweeping gas partial pressure and diminishing turbulence, ejecting particles from the ablation beam path between pulses, without compromising continuing particle conductance. Removal rate (debris generation rate) depends on conductance and particle sizes. The chambers interconnect through metering holes which enable optimization of partial pressure differentials. Controlled flow accomplishes debris removal, reducing turbulence of the mixture of debris and sweeping gases. A preferred embodiment uses a nest of concentric chambers, providing a clear light path. Another preferred embodiment uses orifices on chamber faces for removal and forming an envelope of gas around the processing region for dynamically containing the ejected particulate matter from the ablation site to the exhaust.
|METHOD FOR SEPARATING A SHEET OF BRITTLE MATERIAL - A method for separating sheet of brittle material having a thickness equal to or less than about 1 mm is disclosed. Once an initial flaw or crack is produced, a full body crack can be propagated across a dimension of the brittle material with a laser beam that is substantially absorbed proximate the surface of the sheet to produce sub-sheets. In some embodiments, only a single pass of the laser beam over a surface of the sheet is necessary to separate the sheet. In other embodiments a plurality of passes may be used. Sub-sheets can be further processed into electronic devices by depositing thin film materials on the sub-piece.
|SYSTEM AND METHOD FOR CUTTING USING A VARIABLE ASTIGMATIC FOCAL BEAM SPOT - A variable astigmatic focal beam spot is formed using lasers with an anamorphic beam delivery system. The variable astigmatic focal beam spot can be used for cutting applications, for example, to scribe semiconductor wafers such as light emitting diode (LED) wafers. The exemplary anamorphic beam delivery system comprises a series of optical components, which deliberately introduce astigmatism to produce focal points separated into two principal meridians, i.e. vertical and horizontal. The astigmatic focal points result in an asymmetric, yet sharply focused, beam spot that consists of sharpened leading and trailing edges. Adjusting the astigmatic focal points changes the aspect ratio of the compressed focal beam spot, allowing adjustment of energy density at the target without affecting laser output power. Scribing wafers with properly optimized energy and power density increases scribing speeds while minimizing excessive heating and collateral material damage.
|PROCESS AND APPARATUS FOR ABLATION - An ablation method including a steps of ablating a region of a substrate (
|SUBSTRATE CUTTING APPARATUS AND METHOD OF CUTTING SUBSTRATE USING THE SAME - A substrate cutting apparatus including: a stage to support a substrate; a laser generator to emit a laser beam; a beam oscillator to oscillate the laser beam onto a cutting line of the substrate, to heat the substrate; and a cooling unit to cool the heated substrate.
|LASER WORKING METHOD, LASER WORKING APPARATUS, AND ITS MANUFACTURING METHOD - An object to be processed
|METHOD OF BREACHING A BARRIER - A portable cutting device and related method of use are disclosed. The method may include the steps of providing a laser source and a battery power supply, and housing the laser source and the battery power supply in at least one storage container carried by a user. The method may further include the step of cutting a barrier with optical energy produced by the laser source and delivered by a handheld laser directing device.
|LASER PROCESSING METHOD - Provided is a laser processing method capable of improving precision of a processing shape and degree of freedom of the processing shape. When a recess portion is formed in a substrate (W) which is an object to be processed, an inner portion of the substrate (W) is scanned with a condensing point (L
|METHOD AND SYSTEM FOR HIGH-SPEED, PRECISE MICROMACHINING AN ARRAY OF DEVICES - A method and system for high-speed, precise micromachining an array of devices are disclosed wherein improved process throughput and accuracy, such as resistor trimming accuracy, are provided. Beam scanning and deflection are both used to distribute beam spots to elements of an array of elements for selective processing. The deflection can be performed with a solid state deflector.
|METHOD FOR MATERIAL REMOVAL AND DEVICE FOR CARRYING OUT SAID METHOD - A method and device for the material removal to a predetermined removal depth from a workpiece employs a laser beam consisting of one or more sub-beams, each of the latter having a defined beam axis. The axis of the laser beam or the individual axes of the sub-beams are guided along a removal line at a predetermined travelling speed and the laser beam has a predetermined spatial energy flow density that defines a Poynting vector S with a value I
|METHOD FOR MACHINING MATERIAL USING LASER RADIATION AND APPARATUS FOR CARRYING OUT THE METHOD - A method and device for machining material uses laser radiation, in which the unfocused laser radiation is focused through a focusing optics to a smaller beam cross section. The optical axis of the focused laser radiation, referred to as beam axis, is directed at the material surface. The beam waist, which results from the focusing operation, of the focused laser radiation is held in the region of the interface, which forms of laser radiation and material. The laser radiation is partially absorbed on the interface such that due to induced material removal or induced material displacement the interface and thus also the laser radiation penetrate into the material. The spacing of the beam waist from the upper or lower side of the interface in the axial direction corresponds at most to triple the value of the penetration depth of the interface into the material. The focusing operation is effected such that components of the laser radiation are made divergent not just in the propagation direction downstream of the beam waist but also in the beam waist and/or also in the propagation direction upstream of the beam waist and are thus directed away from the beam axis. These components and angles of divergence are larger than those of the effects of imaging errors, which are inadvertently produced using standard optics and are tolerated.
|Laser machining calibration method - A calibration method is disclosed. The method includes locating a focal point of a laser relative to at least one reference datum of a workspace, the focal point being where the laser produces machining. The method also includes machining at least one reference mark onto a work piece via the laser machining at the focal point and measuring an offset between a reference point on the work piece and the at least one reference mark.
|CONTROL METHOD OF OPTICAL CUTTING - The invention discloses a control method of optical cutting. A laser processing module is used to generate a cutting heat source and an auxiliary heat source. The control method of optical cutting includes the steps of determining a cutting path on the work piece first; then calculating a thermal stress distribution along the cutting path according to a heating condition; next determining an irradiation condition for the auxiliary cutting heat source according to the thermal stress distribution induced by the cutting heat source; and irradiating the work piece along the cutting path with the cutting heat source and simultaneously irradiating the work piece with the auxiliary cutting heat source. The cutting of the work piece is therefore finished.
|Laser Processing Nozzles and Methods - The invention relates to a laser processing nozzle for processing metal sheets. The processing nozzle includes a supply chamber for a processing gas and a laser beam and a mouth region which directly adjoins the supply chamber along the longitudinal axis of the nozzle. The mouth region is narrowed relative to the supply chamber and forms a minimum diameter of the laser processing nozzle. A step is formed between the supply chamber and the mouth region for swirling the processing gas, and an opening region which widens relative to the mouth region adjoins the mouth region along the longitudinal axis of the nozzle.
|LASER PROCESSING METHOD FOR TRANSPARENT MATERIAL - Laser processing methods are provided that are capable of processing a surface to be processed of a transparent material with a high accuracy even if the transparent material has a rear surface with a large roughness or has defects therein. The laser processing methods for processing a transparent material using a laser light, can include: attaching a laser light absorbing substance having an absorption coefficient for the laser light of 1 μm
|LASER-BASED MATERIAL PROCESSING APPARATUS AND METHODS - Various embodiments may be used for laser-based modification of target material of a workpiece while advantageously achieving improvements in processing throughput and/or quality. Embodiments of a method of processing may include focusing and directing laser pulses to a region of the workpiece at a pulse width sufficiently short so that material is efficiently removed by nonlinear optical absorption from the region and a quantity of heat affected zone and thermal stress on the material within the region, proximate to the region, or both is reduced relative to a quantity obtainable using a laser with longer pulses. In at least one embodiment, an ultrashort pulse laser system may include at least one of a fiber amplifier or fiber laser. Various embodiments are suitable for at least one of dicing, cutting, scribing, and forming features on or within a composite material.
|METHOD AND APPARATUS FOR LASER SINGULATION OF BRITTLE MATERIALS - An improved method for singulation of electronic substrates into dice uses a laser to first form cuts in the substrate and then chamfers the edges of the cuts by altering the laser parameters. The chamfers increase die break strength by reducing the residual damage and removes debris caused by the initial laser cut without requiring additional process steps, additional equipment or consumable supplies.
|Method For Laser Fusion Cutting Without Cutting Gas - A method for laser fusion cutting of a metal workpiece including applying a laser beam to the workpiece, where a kerf is melted in the workpiece by the laser beam and a laser beam diameter in a working point is configured to expel molten material from the kerf without cutting gas.
|METHOD FOR LASER CUTTING TUBING USING INERT GAS AND A DISPOSABLE MASK - A method for making a device includes providing a tubular member which will be formed into the device, masking at least a portion of the inner surface of the tubular member with a removable sacrificial material, selectively removing a portion of the tubular member and sacrificial material using a laser device, and mechanically removing the sacrificial material from the inner surface of the tubular member. The method may also include applying a chemical solution to the tubular member and sacrificial material which primarily attacks the either the tubular member or sacrificial material.
|LINK PROCESSING WITH HIGH SPEED BEAM DEFLECTION - Link processing systems and methods use controlled two dimensional deflection of a beam along an optical axis trajectory to process links positioned along and transverse to the trajectory during a pass of the optical axis along the trajectory. Predictive position calculations allow link blowing accuracy during constant velocity and accelerating trajectories.
|CUTTING METHOD USING A LASER HAVING AT LEAST ONE YTTERBIUM-BASED FIBER, IN WHICH AT LEAST THE POWER OF THE LASER SOURCE, THE DIAMETER OF THE FOCUSED BEAM AND THE BEAM QUALITY FACTOR ARE CONTROLLED - The invention relates to method for cutting a part using a laser beam, involving the use of laser beam generation means comprising at least one ytterbium-based fibre having a wavelength of between 1 and 4 μm in order to generate the laser beam. The laser beam is selected to have a power of less than 100 kW, a power density of at least 1 MW/cm2, a focused beam diameter of at least 0.1 mm and a quality factor (BPP) of less than 10 mm·mrad.
|LIGHT CONDENSING OPTICAL SYSTEM, LASER PROCESSING METHOD AND APPARATUS, AND METHOD OF MANUFACTURING FRAGILE MATERIAL - A condensing optical system having a condensed light spot with a small size and a large focal depth without causing a problem of a decrease in intensity of the condensed light spot or discontinuity of an intensity distribution in front and rear areas of a focal position is provided. The condensing optical system that condenses a laser beam generated by a laser source at a predetermined focal length is designed to satisfy Expressions (a) to (d), thereby producing 3rd and 5th spherical aberrations:
|System and method for efficient laser processing of a moving web-based material - Systems and methods are described for efficient laser processing of a moving web-based material. In one embodiment, a moving web is provided at a selected speed. A laser beam is generated having a focal point positioned to provide either a score or cut in the web. The focal point of the laser beam is moved at a speed less than the selected speed for a selected distance thereby producing a discreet score or cut in the web in the machine direction. The focal point is repositioned to form another discreet score or cut once the prior discreet score or cut is formed. The repositioned focal point is moved at a speed less than the selected speed for another selected distance. The step of repositioning is repeated to form a plurality of discreet scores or cuts in the web moving at the selected speed. The laser beam is therefore able to be generated using less power than would be needed to produce the same type of discreet score or cut if the focal point were stationary as the web is moved at the selected speed.
|Method and Device for the Fracture Separation of Workpieces - A method and device for fracture separation of a workpiece into components of the workpiece, wherein a recess is produced by a material processing device in a predetermined area of the components by removal of material from the components. The recess serves as a crack initiation site for the separation of the components. The component is heated in an area of the recess by the material processing device, and the heating takes place with a predetermined heat input in such a way that a temperature of the components does not exceed a predetermined temperature.
|LASER PROCESSING METHOD, METHOD FOR DIVIDING WORKPIECE, AND LASER PROCESSING APPARATUS - A laser processing method for performing laser processing for reducing light absorption on a processing trail is provided. When an irradiated range on a surface of a workpiece is modulated by modulating an irradiating state of a pulse laser beam from a light source, a processed region which has a continuous portion in a first direction and in which a state of a cross section vertical to the first direction changes in the first direction is formed. Concretely, scanning by means of the pulse laser beam is performed under an irradiating condition that beam spots of the laser beam per unit pulse are discrete along the first direction, or scanning by means of the pulse laser beam in the first direction is performed while the irradiation energy of the pulse laser beam is being modulate, or scanning by means of the pulse laser beam in a second direction and a third direction that have predetermined angles with respect to the first direction are alternatively repeated. As a result, a scanning trajectory of the pulse laser beam on the workpiece is allowed to cross the division planned line along the first direction repeatedly and alternatively so that the processed region can be realized.
|APPARATUS AND METHOD of MANUFACTURING SPECIMEN - An apparatus and a method of manufacturing a specimen. The specimen manufacturing apparatus can include a stage to put a substrate thereon, and a laser beam unit to emit a laser beam to the substrate to cut out a specimen having an analysis region from the substrate.
|Laser Cutting Method and Equipment, with means for Modifying the Laser Beam Quality Factor by a Diffractive Optical Component - A method of cutting a work-piece to be cut by a laser beam, in which an incident laser beam is generated that has an initial beam parameter product (BPP), given by means of a laser source, preferably an ytterbium-doped or erbium-doped fiber laser source, coupled to at least one optical fiber for conveying the beam. Said incident laser beam is brought to a focusing head comprising at least one optical focusing device. The incident laser beam is focused by means of said optical focusing device, so as to obtain a focused laser beam, and the work-piece is cut by means of the focused laser beam. According to the invention, the quality factor of the incident laser beam is adjusted or modified by means of an optical device designed to be able to modify or vary the BPP of a laser beam so as to obtain a modified focused laser beam having a modified BPP which is different from the BPP of said incident laser beam. Associated equipment for implementing said method.
|SUBSTRATE CUTTING APPARATUS AND METHOD OF CUTTING SUBSTRATE USING THE SAME - A substrate cutting apparatus includes a stage configured to support a substrate to be cut along a virtual cutting line, a laser generator configured to emit an ultraviolet (UV)-based laser beam for cutting the substrate by removing part of the substrate along the cutting line, and a beam oscillator disposed on a beam path of the laser beam and configured to perform a beam swing on the laser beam in a direction parallel to the length direction of the cutting line by oscillating a tilt angle of the laser beam toward the cutting line.
|METHOD FOR LASER CUTTING TUBING USING INERT GAS AND A DISPOSABLE MASK - A method for making a device includes providing a tubular member which will be formed into the device, masking at least a portion of the inner surface of the tubular member with a removable sacrificial material, selectively removing a portion of the tubular member and sacrificial material using a laser device, and mechanically removing the sacrificial material from the inner surface of the tubular member. The method may also include applying a chemical solution to the tubular member and sacrificial material which primarily attacks the either the tubular member or sacrificial material.
|METHOD AND APPARATUS FOR SCRIBING BRITTLE MATERIAL BOARD AND SYSTEM FOR BREAKING BRITTLE MATERIAL BOARD - During scribing processes of a brittle material substrate, the present invention prevents the generation of an unnecessary crack deriving in an unspecified and uncontrollable direction.
|LASER DICING APPARATUS AND DICING METHOD - Performing a high precision dicing without being affected by a step on a wafer surface, and preventing a particle generation caused by ablation is enabled. A laser dicing apparatus (
|Method For Laser Cutting Material Plates, Especially Metal Sheets, and Cutting System For Carrying Out Said Method - Disclosed is a method for laser cutting material plates (
|LASER PROCESSING A WORKPIECE - A method is described for simultaneously writing patterns in thin films of material coated on the opposite sides of thin glass or plastic substrates by direct write, laser ablation. The substrates are fully or partially transparent to the laser radiation used and in addition the surfaces of the substrates are not assumed to be flat. Different registered patterns may be applied at the same time to opposite sides of the substrates.
|LASER MACHINING AND SCRIBING SYSTEMS AND METHODS - A laser machining system may include an opposite side camera to provide workpiece alignment from an opposite side of the system (i.e., the side opposite the laser machining process). The opposite side camera may be used with an air bearing positioning stage, and a portion of the stage and/or the opposite side camera may be moved to allow the opposite side camera to image a feature on the workpiece to be aligned. The opposite side alignment may be used with back side scribing and/or dual side scribing of a workpiece with alignment from one or both sides of the workpiece. Laser machining systems and methods may also be used to provide quasi-stealth scribing and multi-beam scribing.
|METHODS AND SYSTEMS FOR KEYHOLE-FREE LASER FUSION CUTTING - The invention relates to methods and systems for keyhole-free fusion cutting of a workpiece, wherein the workpiece is melted by a laser beam along a cutting joint and the molten mass produced is expelled from the produced cutting joint, e.g., by a gas jet at high pressure. According to the new methods at least one laser beam follows the laser beam in the cutting direction and influences the molten mass in such a manner that at least one of the two cutting flanks of the workpiece has a better cutting quality than when cutting without the trailing laser beam.
|METHOD OF CUTTING BULK AMORPHOUS ALLOY - A method of cutting bulk amorphous alloy includes: positioning a target cutting path of the bulk amorphous alloy in an atmosphere of an inert gas; cutting the target cutting path to form a cut surface using a pulsed laser; and removing a plurality of burrs located on the cut surface produced during the cut.
|LASER DICING METHOD AND LASER DICING APPARATUS - The present invention provides a laser dicing method that optimizes an irradiation pattern of a pulse laser beam to control generation of a crack and has a superior cutting characteristic. The laser dicing method includes loading a work piece on a stage, generating a clock signal, emitting a pulse laser beam synchronized with the clock signal, relatively moving the work piece and the pulse laser beam, and switching irradiation and non-irradiation of the pulse laser beam onto the work piece in the unit of a light pulse by controlling pass and interception of the pulse laser beam in synchronization with the clock signal, thereby forming a crack running up to a work piece surface in the work piece.
|LASER SEPARATION OF GLASS SHEETS - Methods of using a laser to separate a glass sheet is presented that employs an elongated and, preferably, asymmetrically-truncated laser beam. The methods allow glass sheets suitable for use in modern display applications to be separated at speeds up to about 200 mm/s with low levels of residual stress, e.g., levels of residual stress which are less than or equal to 100 psi, and preferably less than 50 psi. Glasses with high coefficients of thermal expansion (e.g. greater than about 35×10
|REDUCING BACK-REFLECTIONS IN LASER PROCESSING SYSTEMS - Systems and methods reduce or prevent back-reflections in a laser processing system. A laser processing system includes a laser source to generate an incident laser beam, a laser beam output to direct the incident laser beam toward a work surface, and a lens to receive the incident laser beam along a first axis of propagation that is substantially perpendicular to the work surface. The lens includes a primary axis that is substantially parallel to, and offset from, the first axis of propagation. The lens is configured to focus the incident laser beam onto the work surface along a second axis of propagation that forms a non-perpendicular angle with the work surface such that at least a substantial portion of a reflected laser beam from the work surface does not return to the laser beam output.
|METHOD AND SYSTEM FOR LASER-BASED FORMATION OF MICRO-SHAPES IN SURFACES OF OPTICAL ELEMENTS - A method of forming a surface feature extending into a sample includes providing a laser operable to emit an output beam and modulating the output beam to form a pulse train having a plurality of pulses. The method also includes a) directing the pulse train along an optical path intersecting an exposed portion of the sample at a position i and b) focusing a first portion of the plurality of pulses to impinge on the sample at the position i. Each of the plurality of pulses is characterized by a spot size at the sample. The method further includes c) ablating at least a portion of the sample at the position i to form a portion of the surface feature and d) incrementing counter i. The method includes e) repeating steps a) through d) to form the surface feature. The sample is free of a rim surrounding the surface feature.
|Method For Severing Brittle Flat Materials by Laser Beam With Previously Produced Traces - The invention relates to a method for severing brittle flat materials, for example made of glass, ceramic, silicon, gallium arsenide or sapphire. The method includes the step of heating the flat material along desired dividing lines below its melting temperature by means of a laser along desired separating lines. Then the material is shocked by a coolant jet so that a thermally-induced mechanical stress difference brings about a material separation. Traces are formed in the flat material in advance along the separation lines, so that the flat material has a lower breaking stress along the traces than in the unworked flat material, and the separation with the laser takes place along these traces.
|WAFER DIVIDING METHOD USING CO2 LASER - A wafer dividing method for dividing a wafer into individual devices along a plurality of division lines formed on the front side of the wafer, the individual devices being respectively formed in a plurality of regions partitioned by the division lines. The wafer dividing method includes a division inducing region forming step of applying a laser beam having a transmission wavelength to the wafer along the division lines in the condition where the focal point of the laser beam is set inside the wafer, thereby forming a plurality of modified layers as division inducing regions inside the wafer along the division lines; and a dividing step of applying a CO
|FIBER LASER SYSTEMS FOR COLD ABLATION - Scribing operations with reduced substrate heating can be provided by applying multiple optical pulses to a substrate within a time interval that is less than a material recombination time. Typically a series of pulses of durations of 5-200 ps with pulse energies of less than about 0.002 mJ can be applied at rates of about 1 MHz to about 30 MHz. Beam area and beam scanning are configured to provide substantial overlap so that material can be removed by cold ablation.
|ELIMINATION OF SHORT CIRCUITS BETWEEN CONDUCTORS BY LASER ABLATION - A method of selectively eliminating electrical shorts and other electrical defects from specific layers of a multilayer electronic device without damaging underlying layers. The method is based on a combination of an automated detection of the defects and selective laser ablation patterning (SLAP).
|PRE-PROCESS STRESS LOADING COMPONENTS FOR POST-PROCESS WARP CONTROL - A process and apparatus neutralizes a warp effect resulting from a build up of micro strains caused by machining a part with a long wavelength laser. The part to be machined is pre-stressed in an opposite direction of a warp stress due to machining using a fixture for holding the part without yielding any other features in the part. The part is machined while held in the pre-stressed position in the fixture.
|LASER CUTTING PROCESS FOR FORMING STENTS - Systems and methods for improving the cutting efficiency and cut profile of stent strut is provided. A means for altering the energy distribution of a laser beam is provided, along with various ways of controlling a laser to provide for improved strut configurations are provided. A method for improved cutting speeds using a combination of laser sources is also provided.
|LASER BEAM MACHINING - A method for laser beam machining of a workpiece in which a laser beam is focused by an objective, into or onto the workpiece having a boundary surface, to produce a machining effect by a two-photon process, and the position of the focal point with respect to the workpiece is shifted. To obtain a reference for the position of the focal point, an image of a luminating modulation object is projected through the objective onto the workpiece into the focal plane or so as to intersect it. Reflections of the image occurring at the boundary surface are imaged into an autofocus image plane, and are detected by a camera. The camera image plane either intersects the autofocus image plane when the image of the illuminating modulation object lies in the focal plane, or lies in the autofocus image plane when the image of the modulation object intersects the focal plane.
|PROCESS FOR LASER-CUTTING A PATTERN FOR DECORATING TEXTILE ARTICLES - Process for laser-cutting a complex for its application as decoration on a textile material, includes the following stages:
|LASER CUTTING SYSTEM AND METHOD - A laser cutting system and method are provided. The system (
|METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD - A method of manufacturing a printed circuit board is disclosed. The method in accordance with an embodiment of the present invention includes providing an insulation layer having a first area and a second area formed thereon, forming a solder resist layer on the insulation layer, in which the solder resist layer has a first opening formed thereon and the first opening exposes the first area, forming a first surface treatment layer on the first area inside the first opening, forming a second opening on the solder resist layer, in which the second opening exposes the second area, and forming a second surface treatment layer on the second area inside the second opening.
|LASER MACHINING SYSTEM AND METHOD - A laser machining system comprises a laser configured to generate a laser output for forming a molten pool on a substrate, a nozzle configured to supply a growth material to the molten pool for depositing the material on the substrate, and an optical unit configured to capture a plurality of grayscale images comprising temperature data during the laser deposition process, wherein the grayscale images correspond to respective ones of a plurality of radiation beams with different desired wavelengths. Further, the laser machining system comprises an image-processing unit configured to process the grayscale images to retrieve the temperature data according to linear relationships between temperatures in the laser deposition process and the corresponding grayscales of the respective images. A laser machining method is also presented.
|METHOD OF ABLATING A SURFACE LAYER OF A WALL, AND ASSOCIATED DEVICE - The invention relates to a method of ablating a surface layer of a wall by sweeping the said layer, comprising: a step of directional control by an optical deflector of a plurality of pulsed laser beams; a step of ablating the layer on impact zones created by the plurality of laser beams, each impact zone being defined by a centre and by a characteristic dimension; the method is characterized in that the impact zones are disjoint, the distance between each centre of the impact zones being equal to at least ten times the largest characteristic dimension of the impact zones. The invention also relates to a corresponding device.
|PRECISION LASER SCORING - Method and apparatus for laser scoring a sheet material. An elongated laser beam having S-mode intensity profile in the width direction and a flat-top-mode profile in the length direction is used to achieve high precision scoring. The invention can be used for scoring large-size glass substrates for LCD displays.
|LASER SCRIBING APPARATUS AND PROCESS FOR SOLAR PANEL - A laser scribing apparatus includes a chamber, a transferring line, a laser head and a pair of air vacuum device and air knife device. The chamber includes an input door and an output door, through which a processing target is input and output respectively. The transferring line is to transfer the processing target through the input door and output door. The laser head is disposed within the chamber. The air vacuum device and air knife device are disposed outside the chamber and adjacent to the input door for cleaning and cooling the processing target.
|METHOD OF MACHINING A ROLLER - A method of machining a roller utilizes a laser machining system is disclosed. The roller includes a main body and two spindles extending from opposite end surfaces of the main body. The laser machining system includes a laser device, an adjustment device, and a controller. The laser device scans the position of the roller and sends a scanned signal to the controller. The controller analyzes the scanned signal, and if the roller is positioned at the exact position, the controller will send a signal to the laser device, and then the laser device begins to machine the roller. If not, the controller will send a signal to the adjustment device, the adjustment device adjusts the roller to the exact position, then the controller sends a signal to the laser device, and the laser device begins to machine the roller.
|Laser cutting method and method of manufacturing organic light-emitting device - A laser cutting method includes providing a multi-layered substrate, such that the multi-layered substrate includes a circuit pattern between stacked first and second substrates, and removing a part of the second substrate by irradiating a laser beam on the second substrate, the laser beam being irradiated at an oblique angle with respect to an upper surface of the second substrate.
|PROCESSING METHOD FOR A WORKPIECE, DIVIDING METHOD FOR A WORKPIECE, AND LASER PROCESSING APPARATUS - Provided are a processing method for forming division originating points in a workpiece and a laser processing apparatus performing the method, which are capable of reducing light absorption in a processing trail, increasing light extraction efficiency from sapphire, and performing high speed processing. A pulsed laser beam is irradiated to a workpiece so that irradiation regions for each of unit pulsed beams of the pulsed laser beam of ultra-short pulse are formed discretely in the workpiece, and cleavage or parting of the workpiece is sequentially generated between the irradiation regions by a shock or a stress when each of unit pulsed beam is irradiated at an irradiation point, to thereby form originating points for division in the workpiece.
|Method for the Cutting Machining of Workpieces Using a Laser Beam - A method is for cutting machining of a workpiece using a laser beam. The method includes (a) directing the focused laser beam onto a surface of the workpiece for a formation of a kerf; and (b) removing a material exclusively by ablation. The laser beam has a power density in a focal point of at least 1*107 W/cm
|LASER PROCESSING METHOD AND CHIP - An object to be processed can be cut highly accurately along a line to cut.
|Laser Processing Method and Equipment - A laser processing method and apparatus capable of forming an extremely minute modified area not exceeding half the diffraction limit value of the laser wavelength used for processing without causing plasma in a processing object such as a dielectric material substrate or semiconductor material substrate. In this technology, attention is paid to the fact that new damage is caused even at laser intensity that does not cause plasma at all, and a laser beam (
|LASER MACHINING APPARATUS WITH SWITCHABLE LASER SYSTEM AND LASER MACHINING METHOD - A laser machining apparatus and method for producing from a workpiece a rotating cutting tool having a cutting edge and a flank. The laser machining apparatus works in two different operating modes. In the first operating mode, a first laser head is used for machining the workpiece at high advance speeds of the workpiece relative to the first laser head to form a rough desired contour with pulses having a duration in the nanosecond range resulting in laser melt cutting. Subsequently, the laser machining apparatus is operated in the second operating mode generating laser pulses with having a pulse duration in the picosecond range. In the second operating mode, a second laser head is activated by means of an optical scanner system and directs the laser pulses onto a two-dimensional pulse area on the surface of the workpiece, the material removal is accomplished by laser ablation.
|METHOD FOR PRODUCTION OF SAFETY/RUPTURE DISCS - A method for production of safety/rupture discs comprises the steps providing a foil element, selecting a wavelength for a laser beam of a pulse laser within a range of between 800 nanometers and 1800 nanometers, selecting a pulse repetition rate for the laser beam within a range of between 15 KHz and 800 KHz, selecting a pulse duration for the laser beam less than 10 nanosecond and ablating at least one non-through cut in the foil element by directly applying said laser beam to the foil element to remove material from the foil element thereby obtaining a safety/rupture disc.
|Method for Cutting C-Mn Steel with a Fiber Laser - The invention relates to a laser cutting method for cutting a C—Mn steel workpiece, characterized in that laser beam generation means comprising at least one silica fiber with an ytterbium-doped core is used to generate the laser beam. Preferably, the ytterbium-based fiber has a wavelength between
|FABRIC CUTTING SYSTEM AND METHOD - A fabric cutting system and/or method can include a mandrel having a body and first and second legs, a centered chuck, and an offset chuck, each chuck configured to receive either one of the legs or body to rotatingly support the mandrel between the chucks. When one of the legs is inserted into the centered chuck and the mandrel body is inserted into the offset chuck, the mandrel can be rotated and the fabric mounted on the mandrel can be cut about the leg at a location beyond the end of the other leg. One of the legs can include a leg extension removable from a leg base that when removed allows the other leg to be cut beyond the end of the leg base. The fabric can be cut with a cutting laser, which may be a multi-axis laser, and/or have low power.
|METHOD OF TRANSFERRING DEVICE - A method of transferring a device includes the steps of: arranging a first substrate, on which a device is provided with a release layer having a planar shape equal to or smaller than the device interposed therebetween, and a second substrate, on which an adhesive layer is provided, so as to be spaced from and opposite each other in a state where the device and the adhesive layer face each other; and irradiating a laser beam having an irradiation area larger than the base area of the release layer onto the entire surface of the release layer from the first substrate side so as to ablate the release layer, to separate the device from the first substrate, and to transfer the device on the second substrate.
|METHOD OF CUTTING AN OBJECT TO BE PROCESSED - A method of cutting an object which can accurately cut the object is provided. An object to be processed
|LASER PROCESSING METHOD AND LASER PROCESSING APPARATUS - A laser beam machining method and a laser beam machining device capable of cutting a work without producing a fusing and a cracking out of a predetermined cutting line on the surface of the work, wherein a pulse laser beam is radiated on the predetermined cutting line on the surface of the work to cause multiple photon absorption and with a condensed point located inside of the work, and a modified area is formed inside the work along the predetermined determined cutting line by moving the condensed point along the predetermined cut line, whereby the work is cut with a small force by cracking the work along the predetermined cutting line starting from the modified area and, because the pulse laser beam is hardly absorbed onto the surface.
|METHODS FOR LASER SCRIBING AND BREAKING THIN GLASS - A method of forming a vent in a glass substrate includes forming a defect in the glass substrate on a scribe line. A beam spot of a laser may be directed onto the defect and advanced along the scribe line. A cooling jet may be directed onto the defect such that the surface of the glass substrate is cooled from a maximum temperature. Thereafter, the cooling spot may be advanced along the scribe line with the beam spot to form the vent in the glass substrate.
|Orientating a Laser Cutting Beam - A method for orientating a focused laser cutting beam eccentrically relative to the nozzle axis of a cutting gas nozzle and a laser processing machine for performing the same, the method including: arranging a redirecting mirror in a beam path of the laser cutting beam upstream of the cutting gas nozzle, the mirror being rotated about a direction which is coaxial with the nozzle axis and/or about a direction which is perpendicular relative to the nozzle axis and which corresponds to the beam incidence direction of the laser beam on the redirecting mirror. The cutting gas nozzle and the redirecting mirror are arranged in a second structural unit of a laser processing head, for rotation about the direction corresponding to the beam incidence direction relative to a first structural unit.
|LASER MACHINING APPARATUS AND LASER MACHINING METHOD - A laser machining apparatus includes an irradiating section and a control section. The control section causes, in a first period, the irradiating section to perform a first cutting process for cutting a workpiece in a region between a first region and a second region in such a manner that a state in which the first region is retained by the second region in the workpiece is kept, and causes, in a second period later than the first period, the irradiating section to perform a second cutting process for cutting the workpiece within the region between the first region and the second region in the workpiece, where a rear surface is exposed because a part of the protective sheet has been melted in the first cutting process, to separate the first region from the second region together with dross adhering to the rear surface in the first cutting process.
|OPTICAL FILM CUTTING METHOD, AND APPARATUS USING THE SAME - A suction table
|Apparatus and method for controlling laser cutting through surface plasma monitoring - The apparatus and method for controlling laser cutting through surface plasma monitoring provides real-time monitoring and control of laser cutting quality. Laser cutting of a workpiece is controlled through monitoring of surface plasma generation, particularly during a laser gas-assisted cutting process. The apparatus includes a Langmuir probe positioned adjacent the impingement point of the laser beam on the workpiece. The Langmuir probe is in communication with a signal analyzer for measuring electrical voltage generated by plasma generated by the cutting of the workpiece. A controller is provided for comparing the measured electrical voltage with a desired threshold voltage. Control signals are generated to selectively adjust output power of the laser responsive to the compared measured electrical voltage and the desired threshold voltage to minimize plasma generation.
|Method and Device for Laser Inscribing - In order to obtain a laser inscribing unit that is compact for inscribing cards on two sides which also includes a magnet chip inscribing unit, a laser beam is only deflected in one spatial direction in a fan shape, and in the other spatial direction the movement of the card received in the card slide is provided. In spite of inscribing the card in the same receiving position from the top side and also from the bottom side this yields a very compact configuration.
|METHOD AND APPARATUS FOR REDUCING TAPER OF LASER SCRIBES - Methods and apparatuses for reducing taper of a laser scribe in a substrate are described. One method includes aiming a laser beam at a surface of the substrate in a first direction perpendicular to a first cutting direction of the beam and aiming it at the surface in a second direction perpendicular to the first cutting direction. In each position, the laser beam is tilted at a beam tilt angle with respect to a line perpendicular to the surface. A single scribe line is formed in the surface by applying the laser beam to the surface while aiming the laser beam in the first direction and cutting in the first cutting direction and applying the laser beam to the surface while aiming the laser beam in the second direction and cutting in one of the first cutting direction and a second cutting direction opposite the first cutting direction.
|HYBRID STENT AND METHOD OF MAKING - A stent is formed by encasing or encapsulating metallic rings in an inner polymeric layer and an outer polymeric layer. At least one polymer link connects adjacent metallic rings. The stent is drug loaded with one or more therapeutic agent or drug, for example, to reduce the likelihood of the development of restenosis in the coronary arteries. The inner and outer polymeric materials can be of the same polymer or different polymer to achieve different results, such as enhancing flexibility and providing a stent that is visible under MRI, computer tomography and x-ray fluoroscopy.
|Laser thermal processing with laser diode radiation - A method and apparatus for performing laser thermal processing (LTP) using one or more two-dimensional arrays of laser diodes and corresponding one or more LTP optical systems to form corresponding one or more line images. The line images are scanned across a substrate, e.g., by moving the substrate relative to the one or more line images. The apparatus also includes one or more recycling optical systems arranged to re-image reflected annealing radiation back onto the substrate. The use of one or more recycling optical systems greatly improves the heating efficiency and uniformity during LTP.
|LASER PROCESSING METHOD - The present invention relates to a laser processing method capable of arbitrarily controlling a concentration distribution of an assist gas supplied for an object having a complicated surface, together with a laser beam. In the case of laser-processing a tape-shaped cord including several coaxial cables, the method is applied for cutting ground lines surrounding each coaxial cable. Prior to a laser irradiation, at the tip portion of the cord, a flow pathway for the assist gas is ensured between the coaxial cables by removing the resin covering each surface of the coaxial cables. Since each coaxial cable has a non-flat shape, a first surface domain, on which the laser beam is incident at an approximate right angle, and a second surface domain, on which the laser beam is incident at a smaller angle, exist in each surface of the coaxial cables. The second surface domain constitutes part of a wall of the flow pathway for the assist gas, and therefore the concentration of the assist gas in the vicinity of the second surface domain increases rather than that of the assist gas in the vicinity of the first surface domain. As a result, a sufficient laser processing efficiency can be ensured even in the second surface domain on which a laser processing efficiency remarkably decreases.
|LASER PROCESSING METHOD - A modified region is accurately formed at a desirable position with respect to a laser light irradiation surface of an object to be processed. When an average difference γ has a value exceeding a predetermined threshold during trace recording, a particle segment Z including a line segment S where the average difference γ exceeds the predetermined threshold is defined. This determines that a particle exists on a line to cut
|LASER PROCESSING METHOD - While six rows of molten processed regions
|LASER MACHINING DEVICE AND LASER MACHINING METHOD - A laser machining device
|FLUID LASER JETS, CUTTING HEADS, TOOLS AND METHODS OF USE - There are provided high power laser systems, apparatus and methods for performing laser operations in particular in environments where an optically obstructive medium may be present in the laser beam path, such as within the borehole of an oil, gas or geothermal well, or below the surface of a body of water. Further, there are provided such systems, apparatus and methods that manage potentially damaging back reflections that may be generated during such laser operations. The high power laser operations would including tasks, such as, window cutting, pipe cutting and other workover completion activities, as well as decommissioning, plugging and abandonment tasks.
|METHOD AND SYSTEM FOR SCRIBING A MULTILAYER PANEL - The present invention provides method of scribing a multilayer panel. The method comprises (a) providing a multilayer panel comprising a substrate layer, a transparent conductive layer disposed thereupon, a first semiconducting layer disposed upon the transparent conductive layer; (b) configuring the multilayer panel relative to a laser machining device, the machining device comprising a laser head and an optical sensor; (c) inducing a motion of the laser head relative to the multilayer panel such that a laser beam contacts the panel along a transverse line across the panel, the laser beam incident upon the panel having sufficient energy to ablate one or more layers of the multilayer panel within a zone irradiated by the laser beam irradiated to provide a scribed panel; (d) simultaneously irradiating the scribed panel with a first light source; and (e) detecting the light emerging from the scribed panel at the optical sensor in real time. Also provided is a system for scribing a multilayer panel.
|Laser Machining Apparatus and Method with a Vacuum Extracting System and at Least a First Containement Zone for Containing Deposition of Emitted Hazardous Material - A laser machining apparatus arranged to machine material which emits a hazardous material during machining, includes a vacuum extraction system
|METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE FORMED USING A SUBSTRATE CUTTING METHOD - A laser beam machining method and a laser beam machining device capable of cutting a work without producing a fusing and a cracking out of a predetermined cutting line on the surface of the work, wherein a pulse laser beam is radiated on the predetermined cutting line on the surface of the work to cause multiple photon absorption and with a condensed point located inside of the work, and a modified area is formed inside the work along the predetermined determined cutting line by moving the condensed point along the predetermined cut line, whereby the work is cut with a small force by cracking the work along the predetermined cutting line starting from the modified area and, because the pulse laser beam is hardly absorbed onto the surface.
|METHOD FOR EXPOSING AN ELECTRICAL CONTACT - A method for exposing at least one electrical contact, which is covered by at least one layer made of plastic, by means of a laser beam. In order to allow the targeted and reproducible exposing of the electrical contact in an automated process, the location of the at least one electrical contact is determined by means of a sensor, and the at least one layer made of plastic is removed in a flat area, in consideration of the determined location of the electrical contact and according to a pattern stored in a controller of a laser scanner, the projection of said flat area being inside of the contact in the direction of the contact.
|Oblique Laser Beam Cutting - A method for oblique laser beam cutting of a workpiece and system for performing the same, in which a supersonic flow of cutting gas discharged from a cutting gas nozzle is orientated at an oblique cutting angle with respect to a surface of a workpiece, and in which the workpiece and the laser beam are moved relative to each other during the oblique laser beam cutting operation. The oblique cutting angle extends along a plane that is perpendicular to a direction of advance. During operation, the position of the laser beam on the workpiece surface is adjusted in such a manner that the laser beam strikes the workpiece surface in a high-pressure region formed within the supersonic flow of the cutting gas.
|METHOD OF MANUFACTURING DIAMOND PIPES AND TUBES - Diamond pipes (
|LASER PROCESSING A MULTI-DEVICE PANEL - A system for processing a multi-device panel, comprising a substrate having front and rear surfaces, a first array of device regions located on the front surface and a second array of device regions on the rear surface, by vector direct-write laser ablation, comprising a first processing station comprising a pair of opposedly-mounted processing heads, each processing head comprising a laser beam delivery apparatus comprising a laser beam scanner and a lens unit, and a distance measurement means, mounting means for mounting the panel between the processing heads of the first processing station such that the relative position of the panel and the first processing station can be adjusted so that the processing heads are brought into alignment with selected front-surface and rear-surface device regions to be processed, wherein each processing head is operable to make an estimate of the distance between the lens unit and the surface of the device region to be processed using the distance measurement means, control the focus the lens unit dependent on said estimate and vector direct-write the device region.
|METHOD FOR CUTTING OR PERFORATING FILM - A method of cutting or perforating a thin film (
|VERTICAL STENT CUTTING PROCESS - A system and method for processing a tubular member for producing a medical device, wherein the tubular member is oriented in a longitudinally vertical position during processing.
|METHOD FOR DICING WAFER STACK - A method for dicing a wafer stack having a first wafer and a second wafer stacked under the first wafer includes the steps of cutting the first wafer by a cutting blade to form a first cutting location on the first wafer, then cutting the first wafer by a laser stealth dicing process to form a second cutting location on the first wafer, and then removing the portion defined by the first and second cutting locations. In this way, it can avoid the to-be-removed portion from flying off from the first wafer during cutting.
|METHOD FOR MANUFACTURING PHOTOELECTRIC-CONVERSION-DEVICE, DEVICE FOR PHOTOELECTRIC-CONVERSION-DEVICE MANUFACTURING DEVICE, AND PHOTOELECTRIC CONVERSION DEVICE - Provided is a method for manufacturing a photoelectric-conversion-device capable of controlling the groove depth of a processed groove to a desired value. The method for manufacturing a photoelectric conversion device (
|WORKPIECE DIVIDING METHOD - A workpiece dividing method for dividing a workpiece having an uneven incident surface upon which a pulsed laser beam falls. The workpiece dividing method includes a coating step of applying a coating member to the incident surface of the workpiece, thereby planarizing the incident surface of the workpiece, the coating member transmitting the pulsed laser beam and having a refractive index close to that of the workpiece for the pulsed laser beam, a modified layer forming step of applying the pulsed laser beam to the workpiece from the side of the incident surface in the condition where a focal point of the pulsed laser beam is set inside the workpiece after performing the coating step, thereby forming a modified layer inside the workpiece, and a dividing step of applying an external force to the workpiece after performing the modified layer forming step, thereby dividing the workpiece as starting from the modified layer formed inside said workpiece as a break start point.
|LASER PROCESSING MACHINE - A laser processing machine is provided which includes a chuck table adapted to hold a workpiece; and a laser beam irradiation unit for emitting a laser beam to the workpiece held by the chuck table. The laser beam irradiation unit includes a single laser beam oscillating unit for emitting a laser beam; a beam splitter which splits the laser beam emitted from the laser beam oscillating unit into a first laser beam propagating along a first path and a second laser beam propagating along a second path; a first condenser which condenses the first laser beam; and a second condenser which condenses the second laser beam.
|METHOD AND APPARATUS FOR FORMING GROOVES IN THE SURFACE OF A POLYMER LAYER - A method for the formation of grooves (
|DUAL GAS LASER CUTTING OF MEDICAL DEVICES - A system prevents oxidation of a laser cut workpiece by utilizing a laser source that utilizes laser source with an inert gas, such as argon or helium, rather than air or oxygen, to create the slots or kerfs which form the pattern cut into the workpiece. The system introduces oxygen gas through the workpiece as it is being laser cut to oxidize any slag or dross created during the laser cutting process. Oxygen or a mixture of oxygen with other gases cools the slag and the workpiece while at the same time oxidizing the slag to either completely burn or partial burn the slag before it strikes an exposed surface of the tubular member.
|LASER MACHINING METHOD - An object to be processed
|CONTROLLING DYNAMIC AND THERMAL LOADS ON LASER BEAM POSITIONING SYSTEM TO ACHIEVE HIGH-THROUGHPUT LASER PROCESSING OF WORKPIECE FEATURES - A method of accomplishing high-throughput laser processing of workpiece features arranged in a densely spaced pattern minimizes workpiece feature processing inaccuracy and quality degradation that result from dynamic and thermal loads on laser beam positioning and optical components directing the laser beam during workpiece feature processing. A preferred embodiment is implemented with a laser beam positioning system composed of a zero-inertia optical deflector of an acousto-optic beam deflector (AOD) or an electro-optical deflector (EOD) type, a galvanometer head, and a linear stage cooperating to position the laser beam among the workpiece features.
|LASER CUTTING SYSTEM - A workpiece cutting apparatus includes a laser source, a first suction system, and a first finger configured to guide a workpiece as it moves past the laser source. The first finger includes a first end provided adjacent a point where a laser from the laser source cuts the workpiece, and the first end of the first finger includes an aperture in fluid communication with the first suction system.
|LASER CUTTING METHOD, LASER CUTTING NOZZLE, AND LASER CUTTING DEVICEAANM Nagahori; MasayukiAACI SaitamaAACO JPAAGP Nagahori; Masayuki Saitama JPAANM Numata; ShinjiAACI SaitamaAACO JPAAGP Numata; Shinji Saitama JPAANM Itoyama; MasafumiAACI SaitamaAACO JPAAGP Itoyama; Masafumi Saitama JP - A laser cutting nozzle configured such that a laser beam is irradiated through a nozzle hole formed in a nozzle main body from an opening of the nozzle hole, and an assist gas surrounding the laser beam is emitted. The nozzle hole includes a first control flow path, a second control flow path, and a third control flow path formed in a coaxial cylindrical shape, in sequence from upstream toward downstream in a flow direction of the assist gas. If a diameter of the first control flow path is φA, a diameter of the second control flow path is φB, and a diameter of the third control flow path is φC, an equation φA<φC<φB is satisfied.
|LASER MODULES AND PROCESSES FOR THIN FILM SOLAR PANEL LASER SCRIBING - Laser systems for laser scribing are provided. The systems include a remote module coupled to a laser module through a cable. The remote module includes a controller and a chiller. The laser module has at least a laser source and a cooling plate. The laser module is operable to remove material from at least a portion of a workpiece. The systems also include a plurality of termination modules coupled to the laser module through a plurality of optical fibers. Each of the termination modules includes a mechanical interface. The mechanical interface is coupled to a respective optical fiber. The systems further include a plurality of scanning devices operable to control a position of the output from the laser. Each of the scanning devices is coupled to a respective mechanical interface.
|METHODS FOR PRECISE LASER MICROMACHINING - Methods for laser micromachining a material are disclosed. The methods include machining a hole in the material by guiding a laser along a predefined path or applying the laser at a predefined beam angle. A shape of the hole is then characterized. Then, the difference between the shape of the hole and a target shape for the hole is calculated. The predefined path or beam angle of the laser is adjusted based on the difference between the shape of the hole and the target shape for the hole.
|ORTHOGONAL BEAM DELIVERY SYSTEM FOR WAFER EDGE PROCESSING - A method and apparatus for processing substrate edges is disclosed that overcomes the limitations of conventional edge processing methods and systems used in semiconductor manufacturing. The edge processing method and apparatus of this invention includes a laser and optical system to direct a beam of radiation onto a rotating substrate supported by a chuck, in atmosphere. The optical system accurately and precisely directs the beam to remove or transform organic or inorganic films, film stacks, residues, or particles from the top edge, top bevel, apex, bottom bevel, and bottom edge of the substrate in a single process step. Reaction by-products are removed by means of an exhaust tube enveloping the reaction site. This invention permits precise control of an edge exclusion width, resulting in an increase in the number of usable die on a wafer. Wafer edge processing with this invention replaces existing methods that use large volumes of purified water and hazardous chemicals including solvents, acids, alkalis, and proprietary strippers.
|METHOD FOR IRRADIATION AND REMOVAL OF MATERIAL FROM A SURFACE OF A STRUCTURE - A method irradiates an interaction region of an inhabitable structure with laser light to remove material from the structure. The method includes releasably affixing an anchoring mechanism to the structure by vacuum pressure. The method further includes releasably affixing the anchoring mechanism to a laser head configured to receive laser light from a laser generator, such that the laser head is in a drilling position relative to the interaction region. The method further includes receiving the laser light from the laser generator and directing the laser light to the interaction region of the structure. The method further includes confining the material and removing the material from the interaction region resulting from irradiating the structure with the laser light.
|Unloading Device for a Processing Device for Processing Pipes and Related Methods - The invention relates to an unloading device for a processing device for processing pipes by cutting, having a catching lance which is movable in the longitudinal direction of a pipe and which is insertable into the interior of a pipe to be processed. The unloading device includes at least one vertically movable, especially roller-shaped, support element for supporting the catching lance and/or includes a vertically movable depositing surface for depositing at least one pipe portion to be severed from the pipe during processing by cutting. The invention also relates to a method for processing a pipe by cutting by a processing device with which such an unloading device is associated.
|SYSTEMS AND METHODS OF LASER TEXTURING OF MATERIAL SURFACES AND THEIR APPLICATIONS - The surface of a material is textured and by exposing the surface to pulses from an ultrafast laser. The laser treatment causes pillars to form on the treated surface. These pillars provide for greater light absorption. Texturing and crystallization can be carried out as a single step process. The crystallization of the material provides for higher electric conductivity and changes in optical and electronic properties of the material. The method may be performed in vacuum or a gaseous environment. The gaseous environment may aid in texturing and/or modifying physical and chemical properties of the surfaces. This method may be used on various material surfaces, such as semiconductors, metals and their alloys, ceramics, polymers, glasses, composites, as well as crystalline, nanocrystalline, polycrystalline, microcrystalline, and amorphous phases.
|EXTENSION DEVICE FOR AN AIR GUIDE BOX - An air guide box of a paper production installation has a front broad side and a rear broad side, each having a width b. An extension device is attachable to a broad side of the air box guide and has a width of at least 0.25*b and a length of at least 10 mm. A surface thereof is defined with at least one recess having a maximum clear opening of at least 0.1 mm for the through passage of at least one high-pressure water jet or at least one laser beam.
|LASER MACHINING APPARATUS, METHOD FOR LASER MACHINING, AND MEDIUM FOR LASER MACHINING PROGRAM - A method which processes a work-piece by a laser machining apparatus, the method includes: forming a groove by laser light irradiated from the laser machining apparatus along a target line of the work-piece which is the boundary between a first area remaining after laser machining and a second area to be removed in the laser machining under a first machining condition in which the work-piece is not penetrated by the laser machining; and irradiating the work-piece with the laser light at a position that is in the second area and at least partially overlaps the groove under a second machining condition in which the work-piece is penetrated.
|METAL RING MANUFACTURE METHOD AND METAL RING MANUFACTURE DEVICE - Provided is a metal ring manufacture method and a metal ring metal device capable of manufacturing a plurality of metal rings at good efficiency without damaging the metal rings. The metal rings (R) are detached from a drum retaining unit (
|METHOD FOR FABRICATING WORKPIECE AND LASER PROCESSING APPARATUS - According to an aspect of an embodiment, a method for fabricating a workpiece comprises the steps of: irradiating the workpiece with a laser light to raise a temperature of the workpiece at an elevated level under which at least a part of the workpiece is melted, and maintaining at least a part of the workpiece to be melted until the part of the workpiece is separated.
|LASER ASSISTED MACHINING SYSTEM FOR CERAMICS AND HARD MATERIALS - An improved apparatus and method for laser assisted machining are provided, by utilizing a computer to develop interrelated heating and machining plans, from a variety of input data describing the material to be machined, the properties of lasers and pyrometers used for heating the material, and computer models of the machining arrangement, workpiece and final part to be produced. An iterative process continues until the machining and heating plans result in the cutting zone of the workpiece being maintained at a desired temperature with no obstruction in the line-of-sight of at least one laser and pyrometer throughout the machining process, while also maintaining the cutting tool at or below a desired maximum temperature.
|Apparatus and Methods for Controlling Machining Systems - The present invention is directed to implementations of apparatus and methods for controlling a machining system by means of a control program. In some implementations, apparatus include a data storage, in which standard machining parameters are stored to which the control program refers, an adjustment device can be activated in accordance with the invention for adjusting the machining parameters in a preset fashion based on the material properties of a workpiece to be processed and/or a selectable machining target value.
|LASER CUTTING METHOD - The laser cutting method for cutting a pair of plate materials, each of which has a different thickness and melting point, by irradiating them with a laser is provided with a plate material placement process for placing the pair of plate materials side by side so that, out of the pair of plate materials, an opposite surface of a laser irradiated surface of a plate material with a lower melting point protrudes more than an opposite surface of a laser irradiated surface of a plate material with a higher melting point, a focus adjustment process for aligning a focus position of the laser with an undersurface opposite the laser irradiated surface of the plate material with a higher melting point out of the pair of plate materials, and a plate material cutting process for cutting the pair of plate materials through irradiation with the laser according to a series of operations while sustaining a focus position of the laser to the pair of plate materials.
|ANTI-SPATTER COMPOSITION - An anti-spatter composition for use with the laser cutting of titanium or titanium containing materials. The anti-spatter composition includes Lecithin and one or more organic solvents. The one or more organic solvents are absent halogen and halogen containing compound. The anti-spatter composition can also include surfactant and water. The surfactant is generally halogen free.
|LASER CUTTING DEVICE AND LASER CUTTING METHOD - An object is to obtain a laser cutting device and a laser cutting method with which a thick processing item can be cut by using laser light whose wavelength is shorter than that of CO
|METHOD FOR USE OF A DEVICE FOR CUTTING THE PERIPHERAL ISOLATION LINES OF SOLAR PANELS - The present invention provides a cutting method for a cutting device to cut the peripheral isolation lines of solar panels, having the following steps: preparing a solar panel and installing an image acquisition device at the corresponding position on the solar panel; setting the image acquisition device to move along the solar panel edge and acquire the image of the solar panel edge by means of located whole acquisition or line scan, and using an image processing device to calculate the location data of the edges of the solar panel; and setting a cutting device to cut the isolation line of the solar panel according to the edge location data. The present method can accurately judge the locations of the solar panel edges through image processing algorithm to find the parts near the margins and avoid defects, so that the solar panel can have maximum efficacy and utility.
|LASER MACHINING METHOD FOR METALLIC WORKPIECE - A laser machining method for metallic workpiece, including providing a metallic workpiece, heating the metallic workpiece with a heater controller, and machining the metallic workpiece with a laser beam.
|LASER PROCESSING APPARATUS - A laser processing apparatus for cutting substrates comprises a laser head for generating a laser beam and first and second work holders on which substrates are mountable. A diverter positioned along a path of the laser beam is operative to selectively direct the laser beam towards a first substrate mounted on the first work holder to cut the first substrate, or towards a second substrate mounted on the second work holder to cut the second substrate, so that contemporaneous operations may be conducted on one substrate while the other substrate is being cut.
|PANEL AND METHOD OF MANUFACTURE - A panel, in particular a floor panel, has a core of a wooden material, in particular MDF or HDF, or a wooden material/plastic mixture. A pattern is arranged on a visible side. The visible side is provided on at least one side edge (I, II) with a chamfer running at an angle α hereto and a length (L). The angle α of at least one of the chamfers varies over the length (L).
|METHODS AND SYSTEMS FOR LASER-SCRIBED LINE ALIGNMENT - Methods and systems for laser-scribing lines within a controlled separation from previously-formed lines are provided. A laser-scribing method includes providing a workpiece having a plurality of previously-scribed lines, forming a first adjacent scribed line adjacent to a first previously-scribed line, using an imaging device to measure a position of a previously-scribed line, using the imaging device to measure a position of the first adjacent scribed line, and using the measured positions to control the formation of a second adjacent scribed line adjacent to a second previously-scribed line.
|PHOTONIC CLOCK STABILIZED LASER COMB PROCESSING - Processing a workpiece with a laser includes generating laser pulses at a first pulse repetition frequency. The first pulse repetition frequency provides reference timing for coordination of a beam positioning system and one or more cooperating beam position compensation elements to align beam delivery coordinates relative to the workpiece. The method also includes, at a second pulse repetition frequency that is lower than the first pulse repetition frequency, selectively amplifying a subset of the laser pulses. The selection of the laser pulses included in the subset is based on the first pulse repetition frequency and position data received from the beam positioning system. The method further includes adjusting the beam delivery coordinates using the one or more cooperating beam position compensation elements so as to direct the amplified laser pulses to selected targets on the workpiece.
|Methods and Systems for Laser Processing of Materials - A method of processing a work material using a laser can include directing a laser beam of optical energy from a laser to a work material; processing the work material with the laser beam of optical energy in accordance with at least one processing parameter to modify the work material, the processing of the work material having associated therewith an optical signature; sensing a characteristic of the optical signature; and varying the at least one processing parameter responsive to the sensing of the characteristic of the optical signature. Other related methods are disclosed, as are laser processing systems, which systems can be used to practice the methods.
|LASER WORKING METHOD - An object to be processed is restrained from warping at the time of laser processing. A modified region M
|METHOD OF CUTTING OBJECT TO BE PROCESSED - A method of cutting an object to be processed comprises the steps of irradiating an object to be processed with a laser light which is an elliptically-polarized light having an ellipticity other than 1 such that a direction of polarization of the laser light intersects a line to cut the object and a thickness direction of the object, while locating a converging point of the laser light within the object, so as to form a modified region within the object along the line and generate a fracture from the modified region in the thickness direction of the object, and causing the fracture to reach front and rear faces of the object so as to cut the object along the line.
|LINK PROCESSING WITH HIGH SPEED BEAM DEFLECTION - The present invention relates to the field of laser processing methods and systems, and specifically, to laser processing methods and systems for laser processing multi-material devices. Systems and methods may utilize high speed deflectors to improve processing energy window and/or improve processing speed. In some embodiments, a deflector is used for non-orthogonal scanning of beam spots. In some embodiment, a deflector is used to implement non-synchronous processing of target structures.
|LASER IRRADIATION APPARATUS, LASER IRRADIATION METHOD, FABRICATION METHOD FOR THIN FILM SEMICONDUCTOR DEVICE AND FABRICATION METHOD FOR DISPLAY APPARATUS - A laser irradiation apparatus, including: an optical system configured to form laser light of a linear cross section to be irradiated on an irradiation object; and a cutting member having a light blocking portion configured to block the laser light formed in the linear cross section by the optical system to cut the laser light so as to have a predetermined length along a line longitudinal direction; the light blocking portion having a plurality of fins provided on the light blocking portion thereof so as to fetch and absorb the laser light.
Patent applications in class Methods