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MLewyn's blog
My new bookSubmitted by MLewyn on Tue, 05/08/2012 - 9:19am
My book, "A Libertarian Smart Growth Agenda" is available at amazon.com . If you don't want to pay for the book, you can read the article that it was based on here.
Three-cornered politicsSubmitted by MLewyn on Sun, 05/06/2012 - 1:47pm
In metro Atlanta, the Sierra Club is allying with Tea Party activists to fight a one-cent sales tax increase designed to raise additional funds for both roads and transit, primarily because of concerns about increased funding for sprawl-creating expressways.
"Suburbs" don't have to equal "Sprawl"Submitted by MLewyn on Mon, 04/30/2012 - 10:28am
Minimum parking requirements upheld- or, when will they ever learn?Submitted by MLewyn on Sun, 04/29/2012 - 10:09am
Last month, a New York appellate court upheld minimum parking requirements in Syracuase, on the ground that such rules are reasonably related to the city's goal of "enhanc[ing] traffic safety by removing cars from the [City's] streets"(1)
zoning budgets- one way to keep NIMBYism under controlSubmitted by MLewyn on Fri, 04/27/2012 - 9:50am
Roderick Hills and David Schleicher, two law professors, have proposed one way to limit NIMBY-inspired downzonings: a "zoning budget." Specifically, they propose that cities require every downzoning to be matched by an upzoning somewhere else, so that the city's "budget" was always balanced. (See http://papers.ssrn.com/sol3/papers.cfm?abstract_id=1816368 for the article, or http://www.cato.org/pubs/regulation/regv34n3/regv34n3-6.pdf for a shorter version).
Housing costs and centralizationSubmitted by MLewyn on Thu, 04/26/2012 - 10:43am
In my limited experience, commentators who oppose regional land use regulations like urban growth boundaries (or at least worry about the impact of such regulations on housing costs) tend to favor keeping cities constrained within their 1950 boundaries, while people who favor such regulations tend to favor city-county mergers, revenue sharing, and other ways to essentially merge city and suburb.
Why we shouldn't get too obsessed with congestionSubmitted by MLewyn on Thu, 04/08/2010 - 4:37pm
As I explain in my most recent Planetizen blog post, there isn't really a strong correlation between regional growth and traffic congestion.
Maybe transcripts as well as presentations?Submitted by MLewyn on Mon, 07/20/2009 - 7:37pm
I just started reading the slideshows of CNU 17 presentations- certainly an excellent resource, since there were typically several presentations going on at one time (which means that I inevitably mis
What I remember most about CNU 17Submitted by MLewyn on Sun, 06/14/2009 - 12:20am
*The tours. Boulder's success in building a prosperous, pedestrian-friendly downtown and its utter failure in promoting affordable housing.
another environmental cost of sprawlSubmitted by MLewyn on Tue, 05/06/2008 - 1:37pm
Randall O'Toole has another piece out on Cato Institute letterhead (http://www.cato.org/pub_display.php?pub_id=9325 ) in which he argues that rail transit is less efficient than bus service.


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Issue 1 • Date Jan. 2013
Filter Results
Front CoverPublication Year: 2013 , Page(s): C1| | PDF (335 KB)
IEEE Transactions on Components, Packaging and Manufacturing Technology publication informationPublication Year: 2013 , Page(s): C2| | PDF (122 KB)
Table of contentsPublication Year: 2013 , Page(s): 1 - 2| | PDF (131 KB)
Formation and Growth of Intermetallics in an Annealing-Twinned Ag-8Au-3Pd Wire Bonding Package During Reliability TestsPublication Year: 2013 , Page(s): 3 - 9
Cited by: Papers (4)| | Quick Abstract | PDF (1453 KB) | | HTML
Wire bonding on Al pad packages with an innovative annealing twinned Ag-8Au-3Pd alloy wire results in a sufficient interfacial intermetallic layer at the initial as-bonded stage, while its growth during the further temperature cycling test and pressure cooker test is very slow. Even after prolonged high-temperature storage at 150°C for 500 h, the thickness of its intermetallics is only around 1.7 μm. In contrast, a very thin CuAl2 intermetallic layer appears at the interface of the Pd-coated Cu wire bonded package, and a thick layer of Au8Al3 intermetallic compounds forms in the Au wire package, which grows to a thickness of around 4.0 μm after high-temperature storage at 150°C for 500 h. Energy dispersive X-ray spectrometry analyses indicate that AgAl2, Au8Al3, and CuAl2 are the main intermetallic phases formed in the packages bonded with Ag-8Au-3Pd, and Au and Pd-coated Cu wires, respectively. However, an additional Pd-containing Ag2Al layer found at the AgAl2/Al interface of Ag-8Au-3Pd wire bonded package can interrupt its intermetallic reaction, and the annealing twins can further slow the intermetallic growth. View full abstract»
Transceiver Design for High-Density Links With Discontinuities Using Modal SignalingPublication Year: 2013 , Page(s): 10 - 20
Cited by: Papers (1)| | Quick Abstract | PDF (1337 KB) | | HTML
In high-speed chip-to-chip single-ended signaling links, far-end crosstalk presents one of the dominant noise sources, limiting the performance of the link. Diagonalizing the channel using modal decomposition has been proposed to mitigate the crosstalk, but so far only the transceiver designed for uniform low-loss homogenous media channels has been investigated. Furthermore, a practical circuit implementation of such a transceiver system will unavoidably deviate from the ideal (crosstalk-free) eigenvalue decomposition. In this paper, the impact of modal encoder/decoder coefficient quantization, random common noise, and uncorrelated noise on signal integrity is analyzed in terms of system-level performance metrics, signal-to-noise ratio at the receiver slicer, and bit error rate. Also discussed is the optimal selection of decoder coefficients with respect to the input-referred noise at the receiver. Based on these guidelines, a circuit design of a modal transceiver system over a typical memory bus with discontinuities is presented in detail. The proposed approach is verified using circuit-based link simulation, and the performance compared to several other proposed crosstalk-cancellation techniques. View full abstract»
Analytical Design of Via Lattice for Ground Planes Noise Suppression and Application on Embedded Planar EBG StructuresPublication Year: 2013 , Page(s): 21 - 30
Cited by: Papers (1)| | Quick Abstract | PDF (1353 KB) | | HTML
Periodic ground via lattice is investigated to suppress the propagation of parallel-plate mode between two ground planes in a multiple layer package or printed circuit board. This parallel-plate mode (or ground/ground mode) plays a main role in the noise coupling or electromagnetic interference of the power planes or signal traces embedded between two ground planes. An analytical solution of the stopband cutoff frequency for designing the ground via pitch and diameter is derived, based on the eigenfunctions expansion method of the cavity model. Using the ground via lattice method and the analytical design solution, coupling noise mitigation and radiation emission reduction of power planes embedded between ground planes are demonstrated numerically and experimentally. Another example is the design of embedded planar electromagnetic bandgap (EBG) structure. The etched power plane of planar EBG structure embedded between the ground planes does not have a bandgap due to the coupling of the ground/ground mode. The minimum ground via number is designed to reproduce the bandgap of the embedded planar EBG structures by using the proposed analytical solution. View full abstract»
Novel Design Method for Electrically Symmetric High-Q Inductor Fabricated Using Wafer-Level CSP TechnologyPublication Year: 2013 , Page(s): 31 - 39
Cited by: Papers (1)| | Quick Abstract | PDF (2886 KB) | | HTML
High-Q spiral inductors are described that are embedded in the wafer-level chip-size package (WLP) and suffer from unfavorable two-port asymmetric characteristics. To solve this problem, a novel clip-type inductor is proposed, where an electrode crossover point in multiturn inductor structures is modified from a conventional mirror symmetric point to a novel electrical symmetric point. These novel clip-type inductors are designed and fabricated using the WLP technology. By means of a developed 4 nH novel clip inductor, a Q factor value difference between the two ports can be significantly reduced to 1.4% from 14.8% at 1.4 GHz. The Q factors of developed inductors are evaluated under both a conventional short-circuited load condition and an impedance-matched condition. In addition, a novel evaluation method for inductance values for inductors is also described. By using newly derived formulas, inductance values for a fabricated WLP clip-type inductor and a fabricated meander-type inductor are evaluated. This method represents the inherent nature of inductor devices under test including circuit parasitic elements. View full abstract»
Study on Bump Arrangement to Accelerate the Underfill Flow in Flip-Chip PackagingPublication Year: 2013 , Page(s): 40 - 45| | Quick Abstract | PDF (863 KB) | | HTML
Flip-chip packaging is an integrated circuit packaging technique that uses solder bumps to connect chip with substrate. The underfill process uses epoxy encapsulant to solve this problem and improves the reliability of flip-chip packaging. The encapsulant is filled into the gap between the chip and substrate by the capillary force so that the thermal stresses may disperse into the underfill materials to avoid crack generation. The filling time in the underfill process strongly depends on the arrangement of the solder bumps. The edge effect can enhance the filling speed during the underfill encapsulation if the void formation can be avoided. With distributed bump pitch design, the filling time of the underfill can be reduced. There exists an optimal selection of the pitch variation during the use of distributed bump pitch. Another method of using a center bump-free channel can also increase the filling efficiency. The optimization method is used to determine the size of the channel that is found to increase the filling speed dramatically in the case of underfill of the chip with a fine bump pitch. View full abstract»
Study on Effects of Solder Fluxes on Catastrophic Mirror Damages During Laser Diode PackagingPublication Year: 2013 , Page(s): 46 - 51| | Quick Abstract | PDF (1046 KB) | | HTML
Solder fluxes have been commonly used in die bonding of high-power semiconductor lasers via indium solder. In this paper, the effects of some fluxes, with respect to reflow duration and cleaning solvent residues on the catastrophic mirror damage (CMD), are investigated. Scanning electron microscopy with an energy dispersive X-ray indicates that an increment of the sites of CMDs, size, and quality, obtained by increasing the reflow duration, depends on the type of the used flux. Fourier transform infrared spectroscopy confirms that nearly no contamination of the flux exists after the cleaning process. X-ray photoelectron spectroscopy analysis revealed that the flux or flux cleaning solvent residues could not be the main source of carbon or carbon compounds on the surface and, hence, the CMDs attributed to them. Finally, indium packaging of a diode laser by means of these rosin fluxes shows that RA flux has the best die bonding quality among other fluxes. View full abstract»
Effects of Package Level Structure and Material Properties on Solder Joint Reliability Under Impact LoadingPublication Year: 2013 , Page(s): 52 - 60
Cited by: Papers (3)| | Quick Abstract | PDF (1470 KB) | | HTML
In this paper, the effects of package level structures and material properties on solder joint reliability subjected to impact loading are investigated by the integrated experimental testing, failure analysis, and finite element modeling. Three different package structures: ball on I/O wafer level package (WLP), copper post WLP, and chip-scale (CS) ball grid array (BGA) package, are studied. Experimental testing based on JESD22-B111 is conducted to obtain the components' failure mode, rate, location, and the corresponding board strains and accelerations. Finite element models are developed and validated against the experimental results. For a CS BGA package, the compliance of the plastic substrate/mold compound provides a "stress buffer mechanism" at corner joints in BGA to relieve stresses. For a copper post (or pillar) WLP, wafer level epoxy, which encapsulates copper pillars, serves as a compliant layer for solder joint stress reduction under dynamic loading. Comprehensive data from simulation and experimental results show that package structure and material properties play a significant role on the dynamic responses of solder joints. The actual solder joint reliability performance of a CS BGA or WLP package depends on the resultant effects of package structure, material properties, package body size, and the component locations. View full abstract»
Comprehensive Thermomechanical Analyses and Validations for Various Cu Column Bumps in fcFBGAPublication Year: 2013 , Page(s): 61 - 70
Cited by: Papers (3)| | Quick Abstract | PDF (2260 KB) | | HTML
Since the employment of copper (Cu) column bump (with lead-free solder cap) interconnect offers flexibility in the aspect ratio, increases the I/O density, and provides the characteristic of fine-pitch bumps in flip-chip technology (less than 150 μm bump pitch), a significant amount of research on Cu column bumps in flip-chip packages has been carried out in recent years. For the implementations of Cu column bumps, the architectures of bump-on-capture (BOC) pad with solder bump on pre-solder and bump-on-lead (BOL) with solder bump on Cu trace are usually adopted in flip-chip packages. For the purpose of realizing the mechanical behaviors for fcFBGA (flip-chip fine-pitch ball grid array) with lead-free (LF) bump, Cu column bump, and Cu column bump without (w/o) LF solder cap (Cu column w/o solder cap), this paper presents 3-D finite element analysis (FEA) and compare their warpage and stress responses. The experimental coplanarity measurements for these three types of bumps in fcFBGA are carried out to validate the FEA results. Moreover, the reliability assessment for the underfill selection is further validated with an FEA study. Through validation and simulation, it is observed that the use of an LF bump was better at preventing extreme low-k (ELK) failure and aluminum (Al) pad/underbump metallurgy (UBM) delamination, while the use of Cu column bump with and without a solder cap can avoid pre-solder crack failure. In addition, because the packaging geometry and material always play important roles in determining mechanical behaviors, identifying the most significant factors that affect the stress and warpage responses is useful if stress and warpage reductions in fcFBGA are required. In order to gain the essential factors in fcFBGA, systematic simulation studies for LF bump, Cu column bump, and BOL are illustrated. The impact levels for the top significant factors that influence the ELK, UBM, and bump stresses as well as the warpage are obtained thr- ugh systematic simulation studies. Several suggestions for reducing warpage and the critical stresses in fcFBGA with Cu column bumps are recommended. The results show that the stresses in ELK, UBM, and bump in the BOL structure are smaller than those in a BOC structure, demonstrating that the BOL structure provides a reliable fcFBGA package without any ELK damage, UBM delamination, or bump crack issues. The perpendicular BOL orientation in the corner bump area also prevents damage that can be caused by a Cu trace or LF bump. It is believed that the proposed results will provide design guidelines to enhance package reliability and reduce the package cost during the development stage. View full abstract»
Effects of Board Design Variations on the Reliability of Lead-Free Solder JointsPublication Year: 2013 , Page(s): 71 - 78| | Quick Abstract | PDF (2153 KB) | | HTML
Sn-Ag-Cu (SAC) solder alloys, such as Sn-3.0Ag-0.5 Cu (SAC305) are the popular choices of lead-free solders replacing SnPb solders. However, SAC solders are more brittle in nature due to stiffness and excessive intermetallic compounds growth at the solder joint to pad interface. This leads to higher risk of solder joints failures. Memory module-type smaller lead-free ball grid array (BGA) packages are constantly under dynamic stresses during handling and thermal stresses during operations. It is important to understand the dynamic performance and long-term reliability of memory module lead-free BGAs. It is believed that the printed circuit board (PCB) design variations cause dynamic and long-term failure discrepancies in the fields. In this paper, different pad and trace designs are introduced to evaluate the effects of PCB design variations on the bend and accelerated thermal cycling (ATC) performance of lead-free solder joints. Pad designs with nonsolder mask defined, solder mask defined (SMD), and a unique web design are assembled and tested. Different solder alloys, including SAC305, Sn-1.0Ag-0.5Cu (SAC105) SAC105, and SnPb solders, have been evaluated in this paper. Different PCB materials have also been evaluated in the test. Four-point monotonic bend tests are performed to characterize the bending performance variations with different PCB designs and compared with conventional Sn-Pb solder. The SMD pad is shown to have the best bend performance among all other types of designs in this paper. In addition, this design also shows improvement in mitigation of PCB pad cratering with lead-free solders. Wide trace width seems to degrade the strength and is not preferred. Just as it shows superior shock resistance when compared with SAC305, the SAC105 solder alloy also shows better bend performance. There is no significant improvement in bend performance with web design. After aging treatment, bend performance of both SAC305 and SAC105 degraded by up to 34% and 29%,- respectively. However, the bend performance of eutectic SnPb is actually improved after aging. ATC tests are performed to investigate the effects of design variations on the long-term reliability of lead-free solder joints; SMD design shows less reliability life than others. The implications of these results for the reliability of lead-free solder joints are discussed in this paper. View full abstract»
Improved Thermal Interfaces of GaN–Diamond Composite Substrates for HEMT ApplicationsPublication Year: 2013 , Page(s): 79 - 85
Cited by: Papers (4)| | Quick Abstract | PDF (1073 KB) | | HTML
High-power operation of AlGaN/GaN high-electron-mobility transistors (HEMTs) requires efficient heat removal through the substrate. GaN composite substrates, including the high-thermal-conductivity diamond, are promising, but high thermal resistances at the interfaces between the GaN and diamond can offset the benefit of a diamond substrate. We report on measurements of thermal resistances at GaN-diamond interfaces for two generations (first and second) of GaN-on-diamond substrates, using a combination of picosecond time-domain thermoreflectance (TDTR) and nanosecond transient thermoreflectance techniques. Two flipped-epitaxial samples are presented to determine the thermal resistances of the AlGaN/AlN transition layer. For the second generation samples, electrical heating and thermometry in nanopatterned metal bridges confirms the TDTR results. This paper demonstrates that the latter generation samples, which reduce the AlGaN/AlN transition layer thickness, result in a strongly reduced thermal resistance between the GaN and diamond. Further optimization of the GaN-diamond interfaces should provide an opportunity for improved cooling of HEMT devices. View full abstract»
Performance of Online and Offset Micro Pin-Fin Heat Sinks With Variable Fin DensityPublication Year: 2013 , Page(s): 86 - 93| | Quick Abstract | PDF (824 KB) | | HTML
A comparison of the performances of online and offset micro pin-fin heat sinks with variable fin density is given in this paper. The cooling systems generate uniform junction temperatures, which improves the integrated circuit (IC) chip's performance. Water is used as a coolant in the single phase and laminar regime. 4748 micro flat fins with rounded sides, which are distributed in three different sections along the flow length, are used in these configurations. The bottom wall temperature profile along the flow length, overall thermal resistances, pressure drops, and pumping powers for both configurations are presented. The results indicate that the offset micro pin-fin heat sink is a good alternative for cooling the IC chips of 2016. The cooling system using this fin configuration is capable of achieving a thermal resistance as low as 0.1 K/W with a pumping power requirement of 0.45 W. Comparisons with other cooling devices reported in the technical literature are presented. View full abstract»
Power Multiplexing for Thermal Field Management in Many-Core ProcessorsPublication Year: 2013 , Page(s): 94 - 104| | Quick Abstract | PDF (1760 KB) | | HTML
This paper presents the effect of proactive spatiotemporal power multiplexing on the thermal field in many-core processors. Power multiplexing migrates the locations of active cores within a chip after each fixed time interval, referred to as the migration interval, to redistribute the generated heat and thereby reduce the peak temperature and spatial and temporal nonuniformity in the thermal field. Clock and supply gating is used to minimize the power of the deactivated cores. The control of the migration interval is studied considering a 256-core processor at the predictive 16-nm node to evaluate the conflicting impact of the migration interval on thermal field and system performance. View full abstract»
Dual-Bandpass Filters With Individually Controllable PassbandsPublication Year: 2013 , Page(s): 105 - 112
Cited by: Papers (3)| | Quick Abstract | PDF (991 KB) | | HTML
A novel dual-band filter based on split-ring resonators (SRRs) and double-slit complementary SRRs is presented. The size of the filter is small and the two passbands can be individually designed. The basic cell of the filter is presented and analyzed, and then the multistage dual-passband filter is achieved by cascading basic cells. The design graphs for external quality factors of the resonators at input and output stages and the coupling coefficient between the adjacent resonators are constructed. The design graphs are utilized to determine the proper geometric parameters of each filter stage for a given filter specification. As an example, a prototype three-stage Chebyshev filter with a fractional bandwidth (FBW) of 2% at 0.9 GHz and a FBW of 3% at 1.3 GHz is demonstrated. The prototyped filter has an equal ripple of 0.4 dB at both passbands. The measurements of the prototyped filter agree well with the simulation results. The center frequencies and the FBWs of the two passbands of the prototyped filter can be individually designed with more flexibility compared to dual-band filters that utilize resonances of higher order modes. The overall size reduction of the proposed filter can be as high as by a factor of 3 compared to that of edge-coupled microstrip filters. View full abstract»
Analytical Transfer Functions Relating Power and Ground Voltage Fluctuations to Jitter at a Single-Ended Full-Swing BufferPublication Year: 2013 , Page(s): 113 - 125
Cited by: Papers (1)| | Quick Abstract | PDF (1201 KB) | | HTML
The transfer functions relating supply voltage fluctuations to jitter are analytically derived in closed form expressions for a single-ended buffer. The analytic transfer functions are derived from a linear differential equation obtained from asymptotic linear inverter I-V curves. The transfer functions are validated by comparison with HSPICE simulations. The estimated jitter is compared with the simulated jitter using eye diagrams with single-frequency and multitone supply voltage fluctuations. View full abstract»
40-Publication Year: 2013 , Page(s): 126 - 132| | Quick Abstract | PDF (5201 KB) | | HTML
Flip-chip interconnect joints of copper/gold (Cu/Au) with 40-μm diameter and 100-μm pitch were made between silicon (Si) chips and Cu substrates using solid-state bonding at 200°C with a static pressure of 250-400 psi (1.7-2.7 MPa). The array of 50 × 50 Cu/Au columns was first created. In fabrication, photoresist with 50 x 50 cavities of 40-μm diameter and 45-μm depth were produced on Si wafers, which were first coated with 30 nm chromium and 100 nm Au films. Cu of 25-μm thickness was electroplated in the cavities, followed by 10 μm of Au. After stripping the photoresist, the array of 50 x 50 Cu/Au columns was obtained on a chip region of the wafer. The 50 x 50 Cu/Au columns on the chip were bonded to a Cu substrate by solidstate bonding. No molten phase was involved and no flux was used. No underfill was applied. The corresponding load for each column was only 0.22-0.35 g. Cross-section scanning electron microscopy images show that Cu/Au columns were well bonded to the Cu substrate. Despite the large mismatch in the coefficient of thermal expansion between Si and Cu, no joint breakage was observed. The pull test was performed and the fracture modes were evaluated. The fracture force and fracture strength obtained were 11.2-14.2 kg and 35-44 MPa (5000-6400 psi), respectively. The measured fracture force is four times larger than the criterion of the pull-off test in MIL-STD-883E. View full abstract»
Constitutive Models for Intermediate- and High-Strain Rate Flow Behavior of Sn3.8Ag0.7Cu and Sn1.0Ag0.5Cu Solder AlloysPublication Year: 2013 , Page(s): 133 - 146| | Quick Abstract | PDF (2739 KB) | | HTML
In much of the existing research, SnAgCu solder alloys are characterized at low strain rates, typically in the 10-6 to 1 s-1 range. In this paper, we report experimental results and constitutive models for two popular SnAgCu solder alloys at intermediate and high strain rates, ranging from 10-2 to 103 s-1 at room temperature. These experiments were performed using two different experimental setups: a MTS 810 uniaxial compression tester, and a split-Hopkinson pressure bar. In conjunction with our previous work at lower strain rates (10-6 to 10-3 s-1), these results yield the plastic flow response of these solders over nine decades of strain rate, and demonstrate a remarkably consistent relationship between the yield stress and the strain rate over the entire nine decades. We also develop the Anand viscoplastic constitutive model, and demonstrate that fit parameters for the low-strain rate regime can be extrapolated to accurately predict the experimental response at high strain rates. Thus, the model presented here proffers the capability of modeling solder deformation under a wide range of loading conditions using most commercially available finite element (FE) programs. To illustrate the validity of the model parameters, we develop idealized FE models together with cohesive zone failure descriptions at the interface between the solder and the intermetallic compound. We demonstrate that when used in conjunction with appropriate failure models, the constitutive model developed here accurately captures the empirically observed shift in failure modes from bulk failure to interfacial failure under tensile loading at higher strain rates. View full abstract»
Design and Experiment of a Jetting Dispenser Driven by Piezostack ActuatorPublication Year: 2013 , Page(s): 147 - 156
Cited by: Papers (1)| | Quick Abstract | PDF (1835 KB) | | HTML
To make up for the insufficiency and instability of contact dispensers that are used for fluid dispensing in microelectronic packaging, a noncontact jetting dispenser driven by a piezostack actuator is introduced in this paper. After describing the structural components and operating principle of the dispensing mechanism, a fluid model is presented to discuss the dynamic properties of the fluid and analyze the key parameters of the proposed dispenser. The ANSYS simulation software is used to design the displacement amplifier, which is an important component of the dispenser. The maximum displacement output of 323 μm is obtained by optimizing. Subsequently, the dynamic behavior of the displacement amplifier is measured by an optical displacement sensor. The displacement change with the driving voltage amplitude and frequency is also investigated; the maximum displacement is 320 μm, and the error between the simulation and the measurement result is just 0.75%. In order to verify the practicality of dispenser, experiments are conducted to examine the effects of the driving voltage, backpressure, working temperature, and distance between the nozzle and the collector on the jetting performance and droplet diameter. The dispenser can dispense droplets uniformly and steadily. Its maximum jetting frequency is 65 Hz, and droplets of 1.07-mm diameter are produced by a stainless steel nozzle of 0.25-mm diameter in the experimental study, with the variation of the droplet diameter being within ±2%. View full abstract»
Empirical Equation of Wire Sag Model for Semiconductor Packaging With Numerical and Experimental VerificationPublication Year: 2013 , Page(s): 157 - 167| | Quick Abstract | PDF (1029 KB) | | HTML
For the semiconductor packaging industry, the issue of wire sag has not been touched upon because only one single layer of wire bond is constructed along the perimeter of the chip system. Over-sag deflections may not cause any problems. However, driven by the demands for smaller and faster advanced microelectronic devices, modern 3-D and multichip modules have become the solution of choice in delivering higher integration and more multifunctional products to meet consumer needs. For 3-D and multichip packaging, excessive wire sag can lead to wires touching against the lower layer, causing a short-circuit and failure of chip functionality. Therefore, gaining knowledge of wire bond sag theory becomes extremely important for advanced packaging. We propose an empirical model to predict the sag stiffness of a wire bond. The sag stiffness of a wire bond is defined to represent its resistance to the sag drag force occurring during the encapsulation process by the molding flow. A higher sag stiffness of a wire bond gives the premise of less sag deflection, thereby avoiding short-circuiting and/or double wire crosstalk due to the closeness of the top-layer to the bottom-layer wire bonds. The theory of sag regarding semiconductor wire bonding has not been documented, to our knowledge, in the literature. Therefore, to deal with this issue, this paper will primarily focus on the theoretical and numerical analysis of sag deflection of a wire bond. A set of sag experiments is conducted to verify the validity of the sag model hypothesis outlined in the earlier paper. Subsequently, an empirical sag model could be put forward to predict the sag stiffness of a wire bond if the corresponding bond spans, bond heights, and material properties are known. The engineered design of a wire bond can be improved through the use of this sag equation. By making use of the proposed sag model, one can attain not only a first-order estimation of the sag deflection but also omit the tedious procedu- es of numerical analysis. View full abstract»
Surface-Tension-Driven Self-Assembly of 3-D Microcomponents by Using Laser Reflow Soldering and Wire Limiting MechanismsPublication Year: 2013 , Page(s): 168 - 176| | Quick Abstract | PDF (3176 KB) | | HTML
This paper proposes a surface-tension-driven self-assembly method for manufacturing highly 3-D microstructures in microelectromechanical systems (MEMS). By using laser reflow soldering, various MEMS microstructures, even including the thermal-sensitive components, are able to be effectively assembled. Moreover, an energy-based numerical model is established for predicting the equilibrium geometry of a self-assembled structure. Based on the calculated results of energy and torque, an analysis is carried out on the factors affecting the self-assembled equilibrium position. In addition, the self-assembly process is also investigated experimentally by fabricating a popped-up microstructure with two light-emitting diodes die. Experimental studies, combined with the modeling results, have demonstrated that the self-assembly angle can be controlled within ±2.5°. Furthermore, in order to enhance the precision of self-assembly, a novel low-cost wire limiter structure fabricated by the wire bonding process is presented, which reduces the assembly angle variation down to ±0.5°. View full abstract»
Effects of ACF Bonding Parameters on ACF Joint Characteristics for High-Speed Bonding Using Ultrasonic Bonding MethodPublication Year: 2013 , Page(s): 177 - 182| | Quick Abstract | PDF (1002 KB) | | HTML
As the use of anisotropic conductive films (ACFs) in flex-on-board bonding has increased recently, the need for high-speed bonding for higher productivity has developed. For high-speed bonding, a fast-curable acrylic resin has been used instead of an epoxy resin, and ultrasonic (US) bonding is introduced to allow for short bonding time at high bonding temperatures. However, it is possible for fast curable acrylic ACFs at 250°C to be fully cured before the resins flow out sufficiently between the electrodes. In such cases, the ACF joints could show poor electrical characteristics due to there being no conductive particle capture. Therefore, in this paper, in order to understand important factors for high-speed bonding, the effects of the bonding parameters, substrate geometry, and ACF material property on the ACF joint characteristics, such as resin flow and joint resistance, are investigated using acrylic-based ACFs and US bonding. The fast-curable acrylic resin is fully cured at a bonding temperature of 250°C within 1 s. However, the ACF joints bonded at 250°C show joint gaps larger than the diameter of conductive particles, i.e., 8 μm, due to insufficient resin flow and open failure due to no particle capture. As the bonding pressure increases from 2 to 4 MPa, the ACF joint gap at 250°C is smaller than the conductive particle size, and the joint resistance reaches about 20 mΩ within 7 s when using 3-mm-long electrodes and a high-viscosity resin. However, in order to use a shorter bonding time and the common bonding pressure of 3 MPa, the effects of substrate geometry and resin property on ACF joint characteristics are investigated. As the electrode length of the substrates are decreased from 3 to 1 mm, the ACF joints show stable ACF joint gaps and joint resistance at 3 MPa despite the bonding temperature of 250°C applied within 1 s. In terms of the ACF resin properties, when a resin with low minimum viscosit- is used, the ACF joint gaps are smaller than the diameter of the conductive particles. Furthermore, the joint resistance of low-minimum-viscosity ACF is more stable than that of the ACF joints bonded with the high-minimum-viscosity resin at 250°C within 1 s, even though a 3-mm-long electrode is used. These results indicate that the substrate geometry of the printed circuit board and the ACF resin viscosity are significant factors for high-speed bonding to obtain stable ACF joints at a high bonding temperature of 250°C within 1 s. View full abstract»
[Blank page]Publication Year: 2013 , Page(s): 183 - 184| | PDF (6 KB)
Open AccessPublication Year: 2013 , Page(s): 185| | PDF (1156 KB)
Aims & Scope
IEEE Transactions on Components, Packaging, and Manufacturing Technology publishes research and application articles on modeling, design, building blocks, technical infrastructure, and analysis underpinning electronic, photonic and MEMS packaging.
Meet Our Editors
Managing Editor
R. Wayne Johnson
Auburn University

subset: commoncrawl


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Europe's pork and bacon supply declining
But the association said supermarkets can protect consumers from shortages if "they pay Britain's loss-making pig farmers a fair price, to help them remain in production".
Around the world, pig farmers are selling their herds because they can no longer afford to feed their pigs. In the United States the government introduced a pork-buying programme in a bid to keep its pig farmers in business. And the Chinese government is putting pork into cold storage, as a buffer against shortages and high prices next year.
Pig industry leaders from across the European Union met in London earlier in the month to explore ways to ensure pork remains the world's most affordable red meat. They reported that pig herds are being sold because prices are not rising fast enough in supermarkets to cover the cost of record-high pig-feed costs.
"It usually takes at least six months for higher production costs to filter through to shop prices — but pig farmers simply haven't got that long," said National Pig Association chairman Richard Longthorp, who farms outdoor pigs in Yorkshire.
"Some have got only a few weeks left before they run out of credit at the bank and have to sell up, and this is happening all over Europe."
New data shows the European Union pig herd is declining at a significant rate, and this is a trend that is being mirrored around the world. Pig farmers have been plunged into loss by high pig-feed costs, caused by the global failure of maize and soya harvests.
All main European pig-producing countries report shrinking sow herds. Falling numbers in the 12 months to June 2012 have been reported this week by Denmark (-2.3), Germany (-1.3), Ireland (-6.6), Spain (-2.8), France (-3.2), Italy (-13), Hungary (-5), the Netherlands (-3.6), Austria (-2.8), Poland (-9.6) and Sweden (-7.2).
"British supermarkets know they have to raise the price they pay Britain's pig farmers or risk empty spaces on their shelves next year," said NPA chairman Richard Longthorp. "But competition is so fierce in the high street at present, each is waiting for the other to move first."
In its Save Our Bacon campaign, NPA is asking shoppers to make a point of selecting pork and bacon with the British independent Red Tractor logo, as an increase in demand for British product now may help persuade supermarkets to act before it is too late.
Sainsbury's has increased the price it pays to a few of its pig farmer suppliers and NPA has welcomed this gesture. But it says the major supermarkets need to do much more, if they want to protect their customers from shortages and high prices next year.
British Pig Executive Mick Sloyan warned a private meeting of British and mainland Europe retailers at a Brussels summit yesterday that a fall of only 2 percent in slaughterings next year will cause prices to rise by 10 percent.
NPA believes slaughterings could fall by as much as 10 percent in the second half of next year, which indicates a doubling of the price of European pork and pork products. "If supermarkets act now, they can prevent this happening," says NPA.
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Whenever I edit an image (RAW or JPG) in any of my suite of Topaz plug-ins, the resulting Tiff file has been stripped of nearly all metadata when it returns to Lightroom 4. I'm using currently-updated LR and Topaz products on a Mac running Mountain Lion with 8GB of memory. Does anyone else experience this, and perhaps knows of a workaround? (I don't have this issue with other plug-ins, such as Silver EFEX and HDR EFEX Pro).
Here is a Topaz link to your question. It sounds like a good fix is immanent for FXLab and Lightroom and may actually be out there already with the recent upgrade for FXLab for Clarity.http://www.topazlabs.com/forum/showthread.php?t=12416Rick
Thanks; I missed this thread when I tried searching their site. I also just received (after three attempts) a reply from Topaz to my question about the problem, and it just said they were "working on a fix". No date was promised.
I tried the earlier poster's suggestion that the updated PhotoFx Lab might have the fix, and it seems to work. I was able to process a RAW file in both Clarity and Adjust after updating the Lab, and all metadata was preserved.


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Quiz: Remember the definition of mal de mer?
in animals, the use of biological coloration to make an organism unique and highly visible as compared with the background, thereby providing easily perceived information as to its location, identity, and movement. Such advertisement may serve the function of attracting individuals in order to enter into some advantageous interaction (e.g., courtship for reproductive purposes) or of warning or repelling other organisms


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Bradley, Barone among four fired
Updated: January 14, 2009, 8:51 AM ETAssociated Press
SAN DIEGO -- Chargers coach Norv Turner got rid of four assistants on Tuesday, two days after San Diego was eliminated from the playoffs by the Pittsburgh Steelers.
Secondary coach Bill Bradley and tight ends coach Clancy Barone were fired. The team said offensive line coach Jack Henry and assistant secondary and quality control coach Kevin Ross will not have their contracts renewed when they expire in February.
Turner didn't immediately return a phone call seeking comment.
The ...
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Watch a Guy Build Bender in Minecraft
In 24 hours, no less—although the video clocks in at just 4 minutes. Thank goodness for timelapse. »
In 24 hours, no less—although the video clocks in at just 4 minutes. Thank goodness for timelapse. » 1/19/15 8:30am 1/19/15 8:30am
When your TV show's writing staff includes folks with PhDs in maths and sciences, you're bound to end up with some spectacularly nerdy jokes. And if you dig a little deeper into some of the jokes in Futurama, you won't just laugh — you may actually learn something. » 12/31/14 10:15am 12/31/14 10:15am
*coughs, sips water* Good news, everyone! » 11/13/14 3:30pm 11/13/14 3:30pm
We love happy endings. In fact, a big part of why we devour stories is to escape from reality, where endings are by definition unhappy. And a really wonderful happy ending can make you turn your bullshit detector all the way off. Here are 10 somewhat contrived happy endings we can't help falling in love with. » 9/03/14 9:29am 9/03/14 9:29am
"Captain's log: the Wasteland just got sexier." » 8/04/14 10:00pm 8/04/14 10:00pm
Look, I don't want a 3D Futurama movie and neither do you. But I'll be damned if this test shot doesn't give me the shivers. » 7/15/14 2:00pm 7/15/14 2:00pm
Using sculpting, molding and animatronics, effects artist Frank Ippolito and Tested have done excellent things with this Dr. Zoidberg outfit that was shown off at this year's Wondercon. » 5/11/14 8:04pm 5/11/14 8:04pm
Harrison Krix is a guy who we normally post about for his props work, recreating famous video game weapons, but this piece is a little different. » 3/24/14 8:00pm 3/24/14 8:00pm
Kayleigh O'Connor turned a bad habit into a good one when she realized she could actually design the fake nails she glued on to prevent herself from biting at her fingertips. » 2/06/14 2:30pm 2/06/14 2:30pm
Crayons aren't just for coloring books, people. Crayons can be art, too. » 1/16/14 5:30pm 1/16/14 5:30pm
There was much excitement over the Futurama x Adventure Time crossover happening this week—the question was, how would it work? And now that the "Leela and the Genestalk" episode of Futurama aired last night, we know. » 8/08/13 1:00pm 8/08/13 1:00pm
Your eyes don't deceive you, nor is this fan art. That's Adventure Time's Finn and Jake in Futurama. This week's Futurama episode will feature a crossover...which will be interesting because Jake and Bender are voiced by the same person! » 8/06/13 12:30am 8/06/13 12:30am
In memory of Futurama, which last week was killed off for a second time, here's a Team Fortress 2 video that recreates the show's classic Robot Hell song & dance routine. » 4/28/13 8:00pm 4/28/13 8:00pm
We've got a long list of television to keep you cool and safe from the terrible, terrible outdoors. No longer is summer where bad TV goes to die. Under the Dome, True Blood, Axe Cop and Falling Skies are just among the few of some of the shows being aired in the high heat months. Here's our ultimate guide to summer TV. » 4/25/13 1:13pm 4/25/13 1:13pm
If you can steel yourself for a post-modern jumble of space exploration and robotic sing-song, Upside Down Cake's "Star Strike" offers a neat walk through Atari antiquity. Some of these games certainly deserve the homage. » 1/12/12 6:30pm 1/12/12 6:30pm
Futurama meets classic RPG Chrono Trigger in this great piece by artist Tom Preston. » 12/14/11 7:00am 12/14/11 7:00am
Artist Nina "spacecoyote" Matsumoto, an occasional Simpsons Comics contributor, has good news, everyone! She's finally managed to mash-up beloved RPG Chrono Trigger with Futurama in a surprisingly good fit. » 7/14/11 6:40pm 7/14/11 6:40pm
It's Wednesday night. You have no date, a two-liter bottle of Shasta, your all-Rush mixtape, and, now, this impossibly good Space Invaders clone built on Futurama's epic "Raiders of the Lost Arcade" vignette from the third season of Futurama. » 12/30/09 10:00pm 12/30/09 10:00pm
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Free will stay with Cowboys with reduced deal
The impasse between the Dallas Cowboys and maligned offensive tackle Doug Free is over.
Free will remain with the Cowboys after agreeing to a pay cut as part of a new two-year contract that will pay him $7 million total in 2013 and 2014, according to multiple sources Thursday.
Only his $3.5 million salary in 2013 is guaranteed, making it essentially a one-year deal.
Free was scheduled to make $7 million in 2013 as part of a four-year, $32 million deal he signed in 2011.
He has started 48 games with the Cowboys but struggled last season, so much so that he was forced to share snaps with Jermey Parnell at right tackle.
The Cowboys have been clear that they wanted Free to return to the team in 2013 and continue to compete with Parnell at right tackle. But they were also clear that they weren't going to pay him $7 million to do so.
If Free hadn't agreed to a pay cut, he would have been released.
In the end both sides got something out of deal. It was unlikely Free would have gotten $3.5 million guaranteed for this season on the free-agent market, especially at this late date.
The Cowboys were able to clear salary room, so they may possibly pursue other free agents or give a veteran player a contract extension.
Roster moves
The Cowboys bolstered their defensive line by signing veteran defensive end Anthony Hargrove to a one-year deal.
The Cowboys released guard D.J. Hall to make room for Hargrove, who will get the veteran minimum of $840,000 in 2013. He will count $555,000 against the salary cap.
Hargrove didn't play in 2012 after being suspended for the first eight games for his involvement in the New Orleans Saints bounty scandal. Hargrove had signed with the Green Bay Packers in the spring of 2012 but was released before the season and was not signed by another team. The suspension was vacated by former NFL commissioner Paul Tagliabue.
A third-round pick of the St. Louis Rams in 2004, Hargove was suspended for the 2008 season for violating the NFL's substance abuse policy.
He played with the Saints in 2009 and 2010 before spending one year in Seattle in 2011.
Hargrove, who has also played with the Buffalo Bills, has appeared in 102 NFL games, starting 25. He has 19.5 career sacks.
The Cowboys, who have switched to a 4-3 defense, have no proven depth at defensive end behind starters DeMarcus Ware and Anthony Spencer.
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The Panama City Beach Chamber of Commerce has teamed up with the Florida Restaurant and Lodging Association (FRLA) to co-own and host a Seafood and Music Festival. The event will take place at Grand Lagoon Marina between Captain Anderson's and Boatyard restaurants on Wednesday, October 24, 2012, until Sunday, October 28, 2012. The Beach Chamber is excited to work with Carol Dover and Ray Green of the FRLA, Dan Rowe and… (Read More)
The Thunder Beach Spring bike rally brought the party to Panama City Beach!
U.S. 98 was established in 1933 as a route between Pensacola and Apalachicola and later was extended into Mississippi and across the Florida peninsula, leading to the creation of area landmarks along its path. With so much to do and see as development has extended into outlying areas, there's only one answer: Take a road trip. Whether you are heading down U.S. 98 or taking the Alternate 98 (Front Beach… (Read More)
Memorial Day Weekend on Panama City Beach is the traditional opening of the summer season, and is the perfect opportunity to explore this vacation paradise. And, there's even a music and barbecue festival to keep your toes tapping and your belly full! Most of the major attractions, restaurants and beach clubs are now open, and are swinging into high gear in an effort to entice visitors to the World's Most… (Read More)
Lately there have been many reports of flooding along Florida's Gulf Coast. Cities such as Pensacola, less than 100 mi. west of Panama City Beach, have seen upwards of 23 inches of rain in the past week. Luckily, as far as Panama City Beach is concerned, there's been plenty of sun and plenty of fun. Don't let the national weather reports deter you and your family from the world's most… (Read More)
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WAMC New York News
4:37 pm
Thu April 29, 2004
EPA Recommends PCB Processing Sites
By Allison Dunne
Fort Edward, NY – The Environmental Protection Agency is recommending three sites on which to build facilities to process PDB-laden sediment from the Hudson River. From a list of seven, the EPA eliminated two, and placed another two on a list of sites it considers suitable. Some town supervisors say they are disappointed, but not surprised. WAMC's Hudson Valley Bureau Chief Allison Dunne has more.


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OmniMapFree: A unified tool to visualise and explore sequenced genomes
1 Centre for Sustainable Pest and Disease Management, Rothamsted Research, Harpenden, Herts, AL5 2JQ, UK
2 Centre for Mathematical and Computational Biology, Rothamsted Research, Harpenden, Herts, AL5 2JQ, UK
BMC Bioinformatics 2011, 12:447 doi:10.1186/1471-2105-12-447Published: 15 November 2011
• Background
Acquiring and exploring whole genome sequence information for a species under investigation is now a routine experimental approach. On most genome browsers, typically, only the DNA sequence, EST support, motif search results, and GO annotations are displayed. However, for many species, a growing volume of additional experimental information is available but this is rarely searchable within the landscape of the entire genome.
• Results
We have developed a generic software which permits users to view a single genome in entirety either within its chromosome or supercontig context within a single window. This software permits the genome to be displayed at any scales and with any features. Different data types and data sets are displayed onto the genome, which have been acquired from other types of studies including classical genetics, forward and reverse genetics, transcriptomics, proteomics and improved annotation from alternative sources. In each display, different types of information can be overlapped, then retrieved in the desired combinations and scales and used in follow up analyses. The displays generated are of publication quality.
• Conclusions
OmniMapFree provides a unified, versatile and easy-to-use software tool for studying a single genome in association with all the other datasets and data types available for the organism.


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Aspirin Linked to Blinding Eye Disease »
"Jan. 22, 2013 -- Regular aspirin users are more likely to develop the "wet" form of age-related macular degeneration compared to people who rarely or never take the drug, a new study shows.
Aspirin is one of the most widely used drugs in th"...
ILEVRO™ (nepafenac ophthalmic suspension), 0.3% is contraindicated in patients with previously demonstrated hypersensitivity to any of the ingredients in the formula or to other NSAIDs.
Last reviewed on RxList: 1/4/2013
This monograph has been modified to include the generic and brand name in many instances.
Ilevro FDA Prescribing Information
Additional Ilevro Information
Report Problems to the Food and Drug Administration
You are encouraged to report negative side effects of prescription drugs to the FDA. Visit the FDA MedWatch website or call 1-800-FDA-1088.
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Nissan Armada Custom & Factory Tail Lights
The Armada is the kind of vehicle that gives you the freedom to go almost anywhere you can think of but it gives you that freedom in a comfortable package so it's also perfect for all your daily tasks. That means that you spend a lot of time driving it so you want to make sure that it looks as good as it possibly can and visual upgrades are the easiest way to achieve that. We have a wide range of them including the Nissan Armada tail lights that can give you massive benefits!
Your vehicle's back end can be completely changed with the right tail lights so it's important to get the right ones for your personal style and any existing upgrades you have. We have a wide range of different lights from those that can give your vehicle's back end a subtle change that completes it or those that can give it a complete transformation and make sure that all who sit behind you are staring. They're the easiest way to make sure that your vehicle looks exactly right and they cost much less than you would expect for the benefits you get!
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- Eagle® Replacement Tail Lightfrom $120.93 - $134.33# 17200511
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- Dorman® Replacement Tail Lightfrom $110.35 - $113.48# 34593675
- AMI® Pedestal 3rd Brake Lightfrom $48.15 - $67.83# 4309871
- Dorman® Power Window Regulatorfrom $90.75 - $188.76# 16088519
- A1 Cardone® Remanufactured Engine Control Modulefrom $271.33 - $401.47# 25244292
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- 3rd Brake LightsNissan Armada
- Euro Tail LightsNissan Armada
- Factory Tail LightsNissan Armada
- LED Tail LightsNissan Armada
- Black Tail LightsNissan Armada
| Posted by Freddie | (New Castle, DE)
The taillights makes the truck look beautiful and different.
- Nissan Armada Models
- Armada Base Tail Lights
- Armada LE Tail Lights
- Armada Platinum Tail Lights
- Armada SE Tail Lights
- Armada SE Off-Road Tail Lights
- Armada SL Tail Lights
- Armada SV Tail Lights
- Armada Titanium Tail Lights


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On the occasion of Bishop Peter Ingham's 50th Anniversary of his ordination to the priesthood, ABC Illawarra's Nick Rheinberger sat down with Bishop Ingham for an extended interview covering topics such as Bishop Ingham's reasons for becoming a priest, the difficulties of his priesthood, the recent Royal Commission, his role as Bishop and employer of the Diocese of Wollongong and Bishop Ingham's letter that he received from Pope Francis congratulating him on his 50th anniversary. Listen to the interview here!
Half way through his third year of studies for the priesthood, 27-year-old seminarian Matthew "Matt" Meagher boarded a plane for Rome last weekend to spend the next four to five years studying theology at Italy's acclaimed Pontifical Gregorian University.
St John Paul II established that, on the solemnity of the Sacred Heart (27 June), the Church will observe the World Day of prayer for the Sanctification of Priests.
In this video, Br. Thomas Azzi talks of his journey in the Dominicans in light of his upcoming Priestly Ordination in Sydney.
Former Archbishop of Sydney, Cardinal George Pell who was appointed Prefect of the Secretariat for the Economy of the Holy See in March attended this week's Ordination to the Diaconate of Sydney priest-in-training, Thomas Stevens. The Ordination was held at the historic Basilica of St Paul's Outside the Walls which is one of Rome's four major basilicas.
At the top of her flourishing career, a beautiful Spanish model has given it all up to become a nun. Olalla Oliveros, a beautiful and well known Spanish model who did advertisements, television commercials, and worked as an actress has given up her career and decided to become a nun. Last month, Oliveros entered the semi-cloistered Order of Saint Michael.
The moment was truly unforgettable in more ways than once, for Eduardo Andres and Juan Pablo. They were two of 13 priests the Pope ordained at St. Peter's Square, a tradition that dates back to 1993: "I was very excited when the Pope finally kissed our hands. I was really excited. I thought that he would greet the cardinals that were waiting on the side. But he didn't. He went one by one, kissing our hands. I couldn't believe it."
Sr. Maria Kim has been a perpetually professed sister for almost a year. In this article from Life Teen, shares what it was like to find out God was calling her to religious life, and reflects on why she chose to join the Daughters of St. Paul.
According to the latest statistics from the Vatican, there are now 1.229 billion baptized people in the world, a ten percent increase since 2005. The Church has grown the fastest in Africa, where the number of Catholics increased by 29 percent. Meanwhile, Europe was the only region with a decrease in growth. The figures, gathered in December 2012 and released recently, show that the number of priests changed from 406,000 in 2005, to 414,000. Bishops showed a similar growth rate, reaching 5,000 today, while seminarians topped 120,000.
What do you get when you cross the Muppets with Frozen and add a Vocations Discernment theme? This video was prepared for the Here I Am, Lord Conference and represents the vocational journey of a young woman named "Annie," who, will be "Aspirant Annie" in the fall of this year, beginning the first year of formation as a Salesian Sister.
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Big Ken and Colleen
On Demand
Thursday, September 12, 201309/12/2013
Audio: Why Did Coach Ferentz Almost Call Coach Rhoads?
During our interview with Kirk Ferentz, he admitted to us that he almost called Paul Rhoads this week to talk about something…find out what!
Thursday, September 12, 201309/12/2013
Audio: Mal the Sports Gal's Official Iowa/ISU Prediction
Do you agree or disagree with Mal's official prediction?
Wednesday, September 11, 201309/11/2013
Audio: What's Your Quirky…Quirk?
We all have him…sure, they might be considered a little OCD…but today…they're quirks
Wednesday, September 11, 201309/11/2013
Audio: Mal the Sports Gal – Workplace Rivalries
Is this the year to be making big bets on the game? Mal the Sports Gal gives us her take!
Wednesday, September 11, 201309/11/2013
Video: The New Iphone 5s Commercial
It's the same…but now with colors…we are rushing to the stores immediately!
Wednesday, September 11, 201309/11/2013
Video: Seeing Her for the First Time
This man is waking up after surgery…and he's a little groggy, but that doesn't stop him from being absolutely stunned by his wife's beauty!
Tuesday, September 10, 201309/10/2013
Audio: Coach Paul Rhoads Interview
We love having him on the show, and we appreciate him taking time out of this week's busy schedule to talk to us!
Tuesday, September 10, 201309/10/2013
Audio: Theo's First Football Game
Ken's son, Theo, played in his first tackle-football game…and has come up with a bettter way to avoid getting tackled.
Tuesday, September 10, 201309/10/2013
Video: The Epic "Twerking Girl On Fire" Video..a Hoax!
Jimmy Kimmel one-upped everyone with this hoax
Tuesday, September 10, 201309/10/2013
Video: Branden Oliver's "Kick Off is Coming"
Braden Oliver made a video to go with "Kick Off is Coming"


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July 17, 2014
Eaton has been selected by Navistar as the truck maker's new supplier of heavy-duty remanufactured transmissions.
The majority of the deliveries, which started July 1, to Navistar's roughly 350 North American dealers will be Eaton Flex Reman transmissions.
The Flex Reman transmissions ticketed for Navistar will include a customized design with shift bars in a forward configuration on the housings. Ten part numbers will be available with this design.
"This new agreement with Navistar promises to bring a wealth of benefits to our mutual fleet and independent trucker customers," said Shane Groner, global account director, Navistar, Eaton commercial vehicle group. "We are continuously enhancing our Flex Reman lineup of transmissions and we're happy to see that the industry as a whole and Navistar specifically are supporting these improvements in a big way."
Eaton recently added several new enhancements to its Flex products, including a new pricing structure with logistic center, direct ship and truck-down orders all priced the same. Delivery changes and 24-hour availability have also been added, and recent additions to the Flex lineup now brings Eaton's coverage to more than 50 part numbers that cover up to 80% of industry demand, according to Eaton.
Standard warranty coverage for Flex Reman transmissions is two years/unlimited miles, but can be extended.
Eaton said in addition to the exclusive use of genuine OEM-quality parts, all its heavy-duty remanufactured transmissions have roughly 20% more new parts than most other remanufactured transmissions and all units are performance tested to ensure Eaton standards and specifications are met.
The transmissions are backed by the Roadranger network, which includes more than 200 drivetrain professionals throughout North America.
We offer e-newsletters that deliver targeted news and information for the entire fleet industry.
The expert, Mark Betner from CITGO, will answer your questions
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Drones And the Future of Package Delivery
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Ultimate Test Drive Video: Brain and Brawn
Ultimate Test Drive Video: Small Block, Big Load
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Cloud-Based In-Cab Video System Launched
Fan Drive Cools Better in Severe Applications


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Here's a taste of what TheBody.com has to offer on this topic:
Ask the Experts
The fear of HIV is taking over my life, please help. (PROPER CONDOM USE, 2010)hello dr frascinofirst off i hope all is well with you, and your life partner dr steve. ive seen pictures, and u both are very handsome men. and you both look so happy with eachother.well to my current situation on april 3, i had sex with an unknown...
Response from Robert J. Frascino, M.D.
The Robert James Frascino AIDS Foundation...a condoms as in the archives it says if condoms are used correctly there is no chance of HIv transmission. Now this is what scares me, after she gave me oral I checked to see there were no breaks, and I didn't think there were because it appeared... Read more »
protected oral sex with old condom (CONDOM IN CAR, 2009) (PROPER CONDOM USE, 2009)I received a protected oral sex in a massage parlor for a minute or two. But the condom I used was... Read more »
condom broke in vaginal intercourse, possibility of infection?Hello Dr Frascino, First of all I would to thank you for providing scientific and... Read more »
Couples With Mixed HIV Status...feelings about their body and their health. It may be difficult to feel attractive and have a normal romantic relationship. Fear of transmitting HIV can cause an excess of caution. This might even stop all sexual activity. Review the... Read more »
HIV Transmission...body fluids transmit HIV? How well does HIV survive outside the body? Can I get HIV from anal sex? Can I get HIV from vaginal sex? Can I get HIV from oral sex? How can I prevent HIV transmission when using sex toys? Can I get... Read more »
HIV Transmission...spread through the following body fluids: Blood (including menstrual blood) Semen and other male sexual fluids ("pre-cum") Vaginal fluids Breast milk HIV is not spread through these body fluids: Sweat Tears Saliva (spit) The... Read more »
Reducing the Risk of Getting HIV From Sexual Activities...with someone else's fresh semen or vaginal secretions on the hand. Solo Masturbation With solo masturbation there is no fear of infection. Anything done solo is okay as long as someone else's infectious fluids are not present. Body... Read more »
Connect With Others
scared to death
Posted by therigwelder, 2 Replies...napkin then wiped my penis with a napkin and i am not sure if it was a clean napkin or the one she removed the condom with.i am scared to death that i contracted hiv from her she is a sex worker.i was married for 25 yrs and havent had intercourse... Read more »
Posted by Anonymous, 6 Replies...I recently had PROTECTED sex with a spanish working girl..oral to start and vaginal for maybe one minute. all the time with a condom used properly and effectivly. What is the risk that i may have contracted HIV. Read more »
scared to death
Posted by therigwelder, 1 Reply...i had vaginal sex with a woman at a massage parlor,i applied a condom before she touched me.i do not think i have any cuts on my penis,i fell Read more »
I fear the worst. Could this be ARS?
Posted by Anonymous, 1 Reply...that I must have gotten from them. Now, I know I've read a million people say condoms equal safe sex, but I used a condom for vaginal penetration and got it anyway. This is 12 weeks after the incident but I have had slowly swelling lymph nodes... Read more »
Resource Centers
Guides for People With HIV


text: Save The Date – Lubbock Lions Club Pancake Festival Is February 22nd By Tom Collins February 2, 2014 8:41 PM Share on Facebook Share on Twitter The Lions Club Pancake Festival is February 22nd. Jason Gloe of the Lubbock Lions Club will join Tom and Laura on Lubbock's First News on Monday at 7:20 a.m.Each year the Lubbock Lions Club hosts the Largest Pancake Festival in the world… to support local charities. Since 2009 the Lubbock Lions hold the world record for the most pancakes served in an eight hour period by a non profit organization. Category: Collins and Mac Share on Facebook Share on Twitter More Leave a comment Send to a friend! Print this page Pin it! Reddit This! Share on Tumblr! Best of KFYO Recommended For You Around the Web


text: ""; ?> Red October guitar chords, guitar tabs and lyrics - chordie guitar tabs, guitar chords and lyrics Artists Songs Public booksPublic My songbookSongbook ResourcesDiv Forum Browse artists: A B C D E F G H I J K L M N O P Q R S T U V W X Y Z # -first letter-A B C D E F G H I J K L M N O P Q R S T U V W X Y Z # Filter the songs: Show all songs Show only songs that are easy to play Show only songs with formatted chord grids Show only songs with tabs Chordie needs editors! Improve this page Red October MusicRed October Songs There was no article about Red October in Wikipedia. If you know anything about Red October, please contribute to the free encyclopedia by writing an article. Red October Rollin Conundrum (1) play their songs - buy their music - support the artists copyright © 2011 chordie guitar chords 5 popular songs Hit The Road, Jack Traditional Let It Be Beatles Take Me Home Country Roads John Denver Perfect Day Lou Reed Let Her Cry Hootie & The Blowfish


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Harry with a fan today in Spain - 10.12.13 +
Harry with a fan today in Spain - 10.12.13 +
Harry's tattoo…what in the world is it?
10.12.13 - Florence Welch at HAIM's gig in London .
Kelley Blue Book
Liam with a fan today in Spain - 10.12.13 +
Jay-Jay, Mike and Dom with Louis and Zayn-October 12th 2013 (x)
Nick today in Providence, RI.
Niall today with a fan in Spain - 10.12.13 +
October 12th 2013 (x)
More from tonight.
@niallhoran Me , @kimbleyd and bill bloombield went for dinner !
Crowd surfing at tonight's HAIM gig in London (10.12.13)
From the HAIM gig tonight (10.12.13). At the end you can see este and flo crowd surfing! (x)
It really sucks to me how one minute you can be best friends with someone without knowing three years from then you won't even look them in the eye anymore when you pass by each other in the hall. I sometimes wonder why I even bother to make meaningful connections with people because nothing lasts forever and I'm starting to realize that firsthand. As we grow up we'll drift apart and things simply won't be the same. I've learned to hang on way too tightly to things I should've let go of a long time ago. But the thing is that even way after everything has been done and over with, I remember everything. I still remember the tiniest details of my ex-bestfriends and their parents, the way their house used to smell and every single time we hung out. Things from first grade with plastic wands and silly fights, falling off the monkey bars and having her yell at me when I cried, cold nights sitting in a hot tub with the people who I thought I'd be friends with forever, trick-or-treating in a random neighborhood in July, folding 647 paper cranes and losing half of them, just everything
And it sucks to know that people I treasured the most have moved on, made new friends, and forgotten all of this. Meanwhile I sit here and think of everything that could have been different if we were still friends
and that is how you lose her. //
you see the hollowness in her eyes. quick "love you's" fall down short from your mouths, and you rush out the door, forget to inquire about it. that was your own undoing. minuscule salt particles are scatted upon the pillowcase, the remnants of dried tears—nights she had spent stifling her crying, chest heaving with effort as she maintained her silence, body wracked with inexplicable grief and regret. when you reach out and touch her, she slips through your fingers, and it's as if she's not really there at all. a cloudy substance fading to a dying mist. her collarbone has become more prominent these days. when your hands run down her torso, you feel her bones shatter, splinter, beneath your lightest touch. she welcomes it though, closes her eyes, her mouth forming a silent 'o', a slight breathy gasp leaving her lips. any pain is preferable to this self-induced coma of nothingness. the first time you see her, she's commuting on the train. she meets your eyes and smiles a wane smile—a tired, slanted, broken crescent that takes away your breath, leaves you enraptured, hazy. you took her home that night, poured whisky over ice and offered it to her. she declined. made you drink it all instead. the whisky tastes different on your tongue, she said, as she lapped it from your mouth. less burn; more distilled alcohol. she said once that she wanted to try smoking a cigarette. you warned her against it, made her promise you. she promised you—a contrite smile playing on her face—she would never pick one up. but you come home at night, and she's already sleeping—a hunched, curled up figure beneath the sheets—and the room smells of stale smoke. you kiss her closed eyelids, trail your fingers down her cheek, press your lips against hers, and all you taste is that wretched smoke.
and that is how you lost her. //


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If you're wondering what to do with your old electronic equipment, Dell can help. To reduce the environmental impact of technology and help you resell or dispose of your older equipment, we offer the following convenient, easy-to-use and responsible recycling options.
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To register or for questions, please email Val Silvestrini or call (321) 674-7199.
2015 Softball Camps
Val Silvestrini
Head Coach
Val Silvestrini enters her sixth season as Florida Tech's head softball coach. In her inaugural year in 2010, she guided the team to 22 victories, the most in three years, including an impressive win over then No. 15 Nova Southeastern. Under her watchful eye, FIT's hurlers combined for a miniscule 1.40 ERA, sixth-lowest in Division II. Following the season, two Panthers were named All-Sunshine State Conference and one was tabbed All-South Region as a utility player.
Silvestrini gained her coaching experience at three institutions, North Florida, Charleston Southern and Armstrong Atlantic State. Before joining the coaching ranks, she played for the Argentinean National Team from 1998-2007, serving as the team's captain from 2005 until she retired. She holds a bachelor's degree in physical education teaching and coaching along with a master's in sports medicine.


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Sesame Street
SNUFFY'S INVISIBLE - PART 1Series Website »
Episode Guide »
Snuffy receives a magic ukulele in the mail that makes him disappear and Big Bird must help him.
Holly is on a mission to get to know more Vermonters, what inspires them, what makes them tick, and to learn how Vermont PBS can better serve. Watch the video...
Did you miss Brothers of the Gut? You can still order the DVD. Check out the documentary page for more info!
Original series, specials, documentaries and web shows produced by Vermont PBS
A second HD broadcast service offering alternative programming and more content from local and regional producers.


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The online seekers are required to submit the complete data of birth to get the unique Astrology interpretations. For instance, it is advised to provide the clear pieces like September 12, 1991, 7:10 PM, Denver, Colorado. By doing this, your readings are secured with the sufficient insights about the innate personalities as well as future aspects. In addition to the Zodiac signs, the full Astrology readings also cover the matters of planets and transits. Anyway, read more about the Astrological signs to identity your typical archetype from birth!
Free Online Psychic Readings…!
Get the Psychic Reading Chat Immediately!
Thanks to the Zodiacal interpretations, it is possible to disclose lots of details about each Zodiac and incorporate them into the readings for the practical application in real life. Due to the certain scopes of birth date, identify your Zodiac sign first! For example, those born between March 21 and April 20 come under the first sign of the Zodiac – Aries. Basically, the Aries people are likely to be categorized as the warriors or the fighters who have the strong fighting spirits and courage.
Next, it is about the second Zodiac sign – Gemini. With the natures of freedom and social endeavor, the Gemini individuals are known as the great communicators who feel good when being in the social contexts. With the perfect communication skills and sense of humor, the Gemini sign finds it fantastic to hold intimate relationship with people around. How about Cancer? With the typical Water sign traits, the Cancerians are famous as the nurturers who care for their families and relatives wholesomely. The emotional sign loves to get indulged into the home comfort.
Differently, Leo sign is called as the absolute leader or performer who loves to take the lead and show off the abilities to gain recognition in the publics' eyes. When it comes to the sixth Zodiac sign, Virgo, it is the healer or server who likes to serve the public; hence, the Virgos have the tendency to work well as the polices, researches, or analysts.
Thanks to the great compromising tactics, the Libra people gain fame as the skilful diplomats who can handle most of the conflicts well. What's more, the Scorpios are described as the devoted seekers while the Sagittarius individuals are classified as the energetic explorers. With the perfect compassion and emotion, the Capricorn guys are ranked as the top fathers of sons and daughters. Lastly, Aquarius people are the free-minded reformers whereas Pisces ones are the ideal dreamers.
For more info about the article "Astrological Signs And Human Archetypes", please feel free to leave the queries in our contact boxes.
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