text:
A ball grid array (BGA) package that includes a central cavity for receiving a semiconductor die therein is disclosed. The die rests on a base laminate, the die side of which includes traces therein extending into the cavity, which is framed at least by an anisotropically conductive adhesive layer. Bond pads on the die are electrically connected, as by wire bonds or, in the case of a flip-chip configured die, solder balls or conductive adhesive elements, to the traces. The traces are, in turn, electrically connected through conductive vias to conductive element sites on the opposite side of the base laminate through a dielectric layer, the conductive element sites carrying solder balls or other discrete conductive bonding elements for connection to higher-level packaging. A ground or other reference voltage plane, which is also electrically connected to at least one trace through the anisotropically conductive adhesive layer, may extend over the adhesive layer and frame the cavity, or also extend over the cavity to provide an enclosure for the die. In the former case, an encapsulant is applied over the die and electrical connections to the traces.
1. A semiconductor die package, comprising:
a package substrate having at least one conductive trace on a surface thereof;
a semiconductor die attached to the package substrate;
a layer of anisotropically conductive material disposed over the surface of the package substrate and defining a cavity surrounding the semiconductor die; and
a conductive reference plane element disposed over the layer of anisotropically conductive material, wherein the layer of anisotropically conductive material provides an electrical connection between the conductive reference plane element and the at least one conductive trace.
2. The semiconductor die package of
3. The semiconductor die package of
4. The semiconductor die package of
5. The semiconductor die package of
6. The semiconductor die package of
7. The semiconductor die package of
8. The semiconductor die package of
9. The semiconductor die package of
10. The semiconductor die package of
11. The semiconductor die package of
12. The semiconductor die package of
13. The semiconductor die package of
14. The semiconductor die package of
15. A method of fabricating a semiconductor die package, comprising:
providing a package substrate;
forming at least one conductive trace on a surface of the package substrate;
attaching a semiconductor die to the package substrate;
applying a layer of anisotropically conductive material over the surface of the package substrate to define a cavity for surrounding the semiconductor die; and
applying a conductive reference plane element over the layer of anisotropically conductive material, wherein the layer of anisotropically conductive material provides an electrical connection between the conductive reference plane element and the at least one conductive trace.
16. The method of
forming an insulative layer over the at least one conductive trace; and
forming at least one aperture within the insulative layer to permit electrical contact between the at least one conductive trace and the layer of anisotropically conductive material.
17. The method of
18. The method of
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20. The method of
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[0001] This application is a continuation of application Ser. No. 10/011,525, filed Nov. 5, 2001, pending, which is a continuation of application Ser. No. 09/567,633, filed May 9, 2000, now U.S. Pat. No. 6,326,244, issued Dec. 4, 2001, which is a continuation of application Ser. No. 09/146,643, filed Sep. 3, 1998, now U.S. Pat. No. 6,084,297, issued Jul. 4, 2000.
[0002] This invention relates generally to integrated circuit packages and, more particularly, to the fabrication of integrated circuit packages having multiple layers, and the resulting structure. More particularly still, the present invention relates to a fully populated ball grid array integrated circuit package providing a cavity for mounting of a semiconductor die therein and a ground plane element extending about or optionally over the die.
[0003] In recent years, semiconductor miniaturization has resulted in the development of very large scale integrated circuit (�VLSI�) devices including perhaps thousands of active components thereon. Such devices may typically be encapsulated in a protective package providing a large number of pin-outs for mounting or interconnection to external circuitry through a carrier substrate such as a printed circuit board or other higher-level packaging. The pin-outs for such packages may include, for example, a pin grid array (�PGA�), or a ball grid array (�BGA�). Both PGA and BGA packages allow for surface mounting upon a printed circuit board. PGA arrays include a two-dimensional array of metal pins that can be directly connected, as by soldering, to the printed circuit board or inserted in a mating socket arrangement carried by the board. On the other hand, a BGA array includes a two-dimensional array of conductive elements formed as, for example, balls, bumps or pillars instead of metal pins. The conductive elements may, by way of example only, be formed as solder (typically lead/tin, although other alloys are employed) balls, may each comprise a relatively higher melting point ball or bump having a solder or other relatively lower melting point outer covering, or may comprise conductive bumps or pillars formed of a conductive or conductor-filled adhesive such as an epoxy.
[0004] The bond pads of the semiconductor die disposed within a package must be connected to the printed circuit board via conductors carried by the package, either by direct contact therewith in a flip-chip orientation through conductive balls, bumps or pillars or, alternatively, by intermediate connector elements comprising wire bonds, or TAB (flexible circuit) connections. Finally, the semiconductor die is usually protected on the package by an encapsulant of a plastic, epoxy or silicone material or by being housed in a rigid-walled chamber. Exemplary BGA structures are disclosed in the following U.S. Pat. Nos. 5,397,921, 5,409,865, 5,455,456, 5,490,324, 5,563,446, 5,586,010, 5,594,275, 5,596,227, 5,598,033, 5,598,036, 5,598,321 and 5,708,567. BGA packages are offered by various manufacturers and include, among others, the Tessera μBGA, the Advanced Semiconductor Assembly Technology BGA, the Motorola PBGA (OMPAC), the Yamichi YFlex-LCP, the ProLinx VBGA�, and the IBM TBGA.
[0005] The use of BGA packages is becoming widely accepted within the industry due to the ability of BGA designs to accommodate a large number of I/Os, the number of which appears to be ever-increasing for all die types, in the relatively compact area defined within the conductive element array. However, a number of conventional BGA packages are not capable of supporting a fully populated array of conductive ball elements, as the manner in which the die is mounted in the package, or electrically connected to the package traces, requires a conductive element-devoid area in the middle of the conductive element array and so limits the number of solder balls or other conductive elements in the array.
[0006] In addition, there is a continued trend in the computer industry toward ever-higher speed integrated circuit (IC) assemblies based upon semiconductor die technology. Such high signal speeds, however, lack utility unless accompanied by suppression of system noise to an acceptable level. The trend toward lower operational signal voltages in combination with such high speeds exacerbates noise problems.
[0007] At state-of-the art operational speeds, signal propagation delays, switching noise, and crosstalk between signal conductors resulting from mutual inductance and self inductance phenomena of the conductive paths all become significant to signal degradation. Mutual inductance results from an interaction between magnetic fields created by signal currents flowing to and from a packaged IC die through leads or traces, while self inductance results from the interaction of the foregoing fields with magnetic fields created by oppositely directed currents flowing to and from ground.
[0008] Therefore, the integrated circuits carried on a semiconductor die would ideally be electrically connected to conductive traces on carrier substrates such as printed circuit boards and thus to other integrated circuits carried on the same or other such substrates by infinitesimally short conductors, eliminating impedance problems such as undesirable inductance and other conductor-induced system noise.
[0009] As a practical matter, however, as the capacity and speed of many integrated circuit devices such as dynamic random access memories (DRAMs) have increased, the number of inputs and outputs (I/Os) to each die has increased, requiring more numerous and complex external connections thereto and, in some instances, requiring undesirably long traces to place the bond pads serving as I/Os for the typical die in communication with the traces of the carrier substrate.
[0010] While lead inductance in IC packages has not traditionally been troublesome because slow signal frequencies of past devices render such inductance relatively insignificant, faster and ever-increasing signal frequencies of state-of-the-art electronic systems have substantially increased the practical significance of package lead or trace inductance. For example, at such faster signal frequencies, performance of IC dice using extended leads or traces for external electrical connection is slower than desirable because the inductance associated with the elongated conductive paths required slows changes in signal currents through the leads or traces, prolonging signal propagation therethrough. Further, digital signals propagating along the leads or traces are dispersing or �spreading out� because the so-called �Fourier� components of various frequencies making up the digital signals propagate through the inductance associated with the leads or traces at different speeds, causing the signal components and thus the signals themselves to disperse. While mild dispersion merely widens the digital signals without detrimental effect, severe dispersion can make the digital signals unrecognizable upon receipt. In addition, so-called �reflection� signals propagating along the leads or traces as a result of impedance mismatches between the lead fingers and associated IC die or between the leads or traces and external circuitry, caused in part by lead-associated inductance, can distort normal signals propagating concurrently with the reflection signals. Further, magnetic fields created by signal currents propagating through the lead or trace-associated inductance can induce currents in adjacent leads or traces, causing so-called �crosstalk� noise on the latter. While these various effects might be troublesome in any electronic system, the aforementioned trend toward lower voltage systems (currently 3.3 volts) and away from the traditional 5.0 volt systems increases their visibility and significance.
[0011] The ever-more-popular BGA die and package configurations described previously serve to exacerbate the noise problems by favoring a large plurality of laterally adjacent traces of substantial and varying lengths extending from adjacent, generally centralized die locations to the horizontally spaced, offset locations of vias extending to solder balls or other conductive elements for securing and electrically connecting the package to a carrier substrate. While a mechanically and electrically desirable packaging concept to accommodate the ever-increasing numbers of I/Os for state-of-the-art dice, long, varying-length, closely mutually adjacent trace runs over the package substrate become abusive in terms of unacceptably increasing real impedance as well as lead inductance (both self and mutual) in the circuit. These trace runs also increase 1) signal reflection in the circuit due to transmission line effects and degrade signal integrity due to the aforementioned, 2) propagation delays, 3) switching noise, 4) crosstalk and 5) dispersion. Further, elimination of a die-attach pad, as in many BGA packages, also eliminates the potential for employing a ground plane under the die, and such a ground plane in any case would not alleviate the problems attendant to use of the long package trace runs.
[0012] Therefore, it would also be desirable for a BGA package to accommodate and substantially overcome inductance-related deficiencies so that full advantage of the beneficial aspects of the packaging concept might be realized in a relatively simple, cost-effective BGA package.
[0013] The present invention provides a BGA package supporting a fully populated array of solder balls or other conductive elements and exhibiting superior inductance characteristics.
[0014] The BGA package of the present invention comprises a base laminate or sandwich of a dielectric interposed between two conductive sheets and which, in turn, are respectively partially covered by two outer insulative layers. One conductive sheet is patterned to provide sites for the conductive elements of an array for connecting the semiconductor die of the package to external circuitry. The other conductive sheet is patterned to define a plurality of conductive traces, each trace extending from an interior die-attach location on the laminate to a location above a conductive site, or to a location suitable for connection to a ground plane for the package. A conductive die-attach pad may be provided at the same time as the traces and communicate with a trace for providing a ground or reference voltage for the semiconductor die. Vias formed with conductive material extend from the traces on one side of the laminate through the dielectric to the conductive element sites on the opposing side. An anisotropically or �Z-axis� conductive adhesive layer in the form of a film configured as a frame is then applied over the trace side of the laminate to define an interior region cavity including the die-attach location as well as openings in the frame to allow electrical connection between a conductive stiffener for the package formed as a lid extending over the die-attach location and appropriate conductive traces. The cavity is large enough to leave inner trace ends exposed for connection of bond pads of the semiconductor die thereto by wire bonds, although the invention is not limited to this interconnection technology. For example, the inner trace ends may be patterned as a conductive pad array to connect to intermediate conductive elements such as solder balls or epoxy pillars protruding from the active surface of a flip-chip configured die placed face down on the laminate.
[0015] A ground or other voltage reference plane element (hereinafter sometimes referenced generally as a �reference plane element�) is secured to the adhesive layer. Various embodiments of the structure of the BGA package of the invention include differing reference plane element structures, which in turn also permit different die enclosure techniques. In each embodiment, however, the insulative layer over the traces is provided with at least one through hole for connection of one or more circuit traces to the reference plane element by mutual contact with the anisotropically conductive adhesive layer.
[0016] In one embodiment, the reference plane element is also formed as a frame of like size and shape to the adhesive frame, and placed thereover in alignment therewith, providing a deepened cavity. It should be noted that the use of a relatively thick, and thus rigid, reference plane element permits the use of a flexible, tape-type base laminate in the package, and also provides additional mass to facilitate heat transfer from the semiconductor die. After the semiconductor die is back-bonded to the die-attach location on the base laminate, connections are formed between the traces and the bond pads of the die, after which the die, inner trace ends and connections may be encapsulated with a so-called �glob top� of dielectric material, providing physical and environment protection for the encapsulated elements. The reference plane element and underlying adhesive provide a four-sided dam to prevent unwanted lateral encapsulant spread.
[0017] In another embodiment, the reference plane element comprises an imperforate conductive sheet extending over the cavity defined by the adhesive frame. If the adhesive is particularly thick, the semiconductor die relatively thin, or a recess is provided in an unusually thick dielectric portion of the base laminate, the reference plane element may be planar in nature, providing a flat lid for the cavity containing the die. If, however, the die thickness plus the height of connecting elements such as wire bonds exceeds the thickness of the adhesive frame, the reference plane element may be formed with a central dome or protrusion over the cavity area to provide adequate clearance. Such a feature may also enhance package rigidity, while permitting use of thinner conductive sheet material for the reference plane element. In this embodiment, the die is connected to the conductive traces of the base laminate before the reference plane element is applied. A thick encapsulant may again be used to protect the die and connections, but it may be preferred, in this instance, to employ a low viscosity dielectric material to merely coat the exterior of the die and the connections to prevent shorting of the latter against the inner side of the reference plane element.
[0018] As alluded to previously, yet another embodiment of the invention includes a package configured for use with a flip-chip configured semiconductor die, wherein the upper conductive sheet of the base laminate is patterned with traces having ends configured and arranged in an array of pads or terminals for contact with intermediate conductive elements, such as solder balls or conductive epoxy pillars, protruding transversely from the active surface of the die. An encapsulant may be employed to surround and in-fill between the active surface of the die and the pads, or a reference plane element employed as a lid over the cavity area to enclose the die.
[0019]FIG. 1 is a top view of one embodiment of a ball grid array package according to the present invention;
[0020]FIG. 2 is a partial cross-sectional side view of the ball grid array package according to FIG. 1;
[0021]FIG. 3 is a partial cross-sectional side view of a first variant of another embodiment of the ball grid array package of the invention;
[0022]FIG. 4 is a partial cross-sectional side view of a second variant of the embodiment of FIG. 3 of the ball grid array package of the present invention;
[0023]FIG. 5 is an enlarged partial cross-sectional side view of a flip-chip embodiment of the present invention; and
[0024]FIG. 6 is a block diagram of an electronic system incorporating the semiconductor package of the invention.
[0025]FIGS. 1 and 2 depict an exemplary ball grid array integrated circuit (�IC�) package 10 having a cavity 12, shown in cross-section in FIG. 2, for receiving an integrated circuit device, such as a semiconductor die 14. In some instances, the number of elements depicted on these and the remaining drawing figures herein has been limited for clarity of illustration only, and is not intended or to be taken as a limitation on the invention as claimed.
[0026] IC package 10 includes a base laminate 16 formed of a dielectric film or sheet 18, which may comprise a polyimide such as a KAPTON� film, sandwiched between two conductive layers 20 and 22, preferably of copper, over which are located two insulative layers 6 and 8, preferably of Taiyo 9000� solder mask, although other alternative materials are suitable. The base laminate 16 may be procured as one system through Shedahl, Inc. of Northfield, Minn. as ViaThin� integrated circuit substrate. In the package 10 as illustrated, the lower conductive layer 20 has been patterned to define an exemplary 6�12 array of pad-type conductive element sites 24 (only some shown for clarity) on which a like number of conductive elements 26 for connecting die 14 to external circuitry 28 on a carrier substrate 30 (shown in broken lines in FIG. 2) are placed or formed. The copper conductive element sites 24 are preferably plated with nickel and then gold before conductive elements 26, in the form of tin/lead solder balls, are formed thereon. The upper conductive layer 22 has been patterned to define a plurality of circuit traces 32, the trace inner ends 46 of at least some of which extend from locations within cavity 12 to locations of conductive vias 34 extending through dielectric film 18 to conductive element sites 24. Upper conductive layer 22 may also be patterned to provide a conductive die-attach pad 36, as well as traces 32 extending to the locations of vias 34 and sites 44 for connection of a ground or reference plane thereto, as hereinafter described. Die-attach pad 36 and traces 32 (or at least trace inner ends 46) preferably comprise a lay-up of gold over nickel over the copper of layer 22.
[0027] Patterning of the conductive layers 20 and 22 may be effected by any technique known in the art, such as application of a positive or negative photoresist, selective exposure of the resist layer through a mask to define the desired pattern followed by removal of the unfixed resist from the sheet, and chemical etching of the exposed conductive sheet material. Formation of the conductive vias 34 may be effected by 1) photo-etching, laser ablation or numerically controlled punching of apertures through the laminate structure followed by 2) electroless or electrolytic plating of a metal, preferably copper.
[0028] After conductive element sites 24 and traces 32 have been defined and conductive vias 34 formed and filled, solder mask insulative layers 6 and 8 are respectively formed over the lower and upper surfaces of the laminate. Apertures exposing conductive element sites are defined through lower solder mask layer 6, while upper solder mask layer 8 is imperforate except over die-attach pad 36 or a die-attach area of the upper surface of the base laminate if no die-attach pad is employed and at locations where conductive paths of Z-axis adhesive layer 40 (see below) are to connect to vias 34 extending through base laminate 16 and connecting a conductive ground or reference plane element 50 (see below) to a conductive element site 24 and its associated conductive element 26. It should be noted that lower solder mask layer 6 defines the locations for conductive elements 26 in the form of solder balls or bumps formed or placed on conductive element sites 24 and constrains migration of the solder during reflow when the package 10 is attached to a carrier substrate 30.
[0029] A Z-axis adhesive layer 40, which may comprise Nitto ACF� anisotropic conductive film available from Nitto Denko America, Inc. of Fremont, Calif., is applied over the base laminate 16 to at least partially define cavity 12 in which die 14 will reside. As known to those of ordinary skill in the art, a �Z-axis� or anisotropically conductive adhesive comprises an adhesive or adhesively coated dielectric or insulative film or layer having laterally separated conductive paths 52 (some shown in broken lines) extending therethrough in an orientation transverse to the plane of the film or layer. Adhesive layer 40 is preferably applied in the form of a frame-shaped, preform sheet by which one or more traces 32 may be electrically connected to ground or reference plane element 50. Trace inner ends 46 of traces 32 extend from under adhesive layer 40 into central aperture 42 framed thereby, so that bond pads 14 a of die 14 may be wire-bonded or otherwise connected as shown at 48 to the trace inner ends 46.
[0030] In the embodiment of FIGS. 1 and 2, a frame-shaped ground or reference plane element 50 having a central aperture 54 of like size and shape with central aperture 42 of adhesive layer 40 is applied over adhesive layer 40 in alignment therewith. The combined thicknesses of adhesive layer 40 and reference plane element 50 define the depth of cavity 12. Ground or reference plane element 50 is preferably formed of copper, and may be selected to be at least of a thickness to provide desired rigidity to package 10. Additional thickness may be incorporated in reference plane element 50 to provide a heat sink and facilitate heat transfer from die 14. Z-axis adhesive layer 40 electrically connects ground or reference plane element 50 to the upper end of a via 34 exposed through an aperture in solder mask layer 8. In fabricating package 10, a complete base laminate 16 with conductive elements 26, Z-axis adhesive layer 40 and reference plane element 50 is assembled prior to affixation of die 14 thereto.
[0031] Die 14 may then be secured to a conductive die-attach pad 36 (if used) by a conductive epoxy, silver solder, or other conductive bonding agent known in the art. If a conductive back side connection for die 14 is not required, numerous bonding agents may be employed. Further, if die 14 is secured by a dielectric adhesive, traces 32 may be patterned to extend from the edge of die 14 back under the die-attach adhesive for connection through vias 34 to underlying conductive element sites 24 to achieve the aforementioned fully populated array of conductive elements 26. Alternatively, if a conductive die-attach pad 36 is employed, traces 24 a may be patterned on the lower conductive layer 20 extending from vias 34 laterally offset from die 14 to conductive element sites 24 directly under die 14. Die 14, attached to die-attach pad 36 with a conductive bonding agent, may be connected through an appropriate via 34, conductive element site 24 and conductive element 26 typically to Vss (ground) or Vbb (back bias, or reference, potential), or even possibly to Vcc (power), depending upon the application. In the latter instance, use of a non-conductive die-attach adhesive would naturally be required. However, using die-attach pad 36 for power as suggested provides great flexibility in the number of options available for connecting power input bond pads of the die 14 to the die-attach pad 36.
[0032] Subsequent to die attach, wire bonds 48 are formed between bond pads 14 a of die 14 and trace inner ends 46, using gold, aluminum, or other suitable materials as known in the art. After wire bonding is completed, a so-called �glob top� encapsulant 56 (shown for clarity in broken lines) comprising a mass of non-conductive epoxy or silicone may be applied over die 14 to fill cavity 12 to a level high enough to submerge the wire bonds 48 in encapsulant to protect the package components within cavity 12 against physical and environmental damage. It is desirable that encapsulant 56 be thermally conductive to facilitate heat transfer from die 14 during operation. A suitable thermally conductive, electrically insulative encapsulant may by a Hysol� compound, as offered by Dexter Electronic Materials of Industry, California.
[0033] Referring now to FIG. 3, another embodiment 100 of the package of the present invention is depicted. The same reference numerals are employed in FIG. 3 to identify the same features as in FIGS. 1 and 2 for clarity. Package 100 is similar to package 10, with the base laminate 16, conductive element sites 24, conductive elements 26, traces 32, solder mask insulative layers 6 and 8, die-attach pad 36 (if employed) and anisotropically conductive adhesive layer 40 being configured and assembled as described with respect to package 10. It is at this juncture, differing from the assembly process for package 10, that die 14 would be attached and wire-bonded, before a ground or reference plane element 150 is affixed. The ground or reference plane element 150 of package 100 is configured as an imperforate, substantially planar sheet (again, preferably of copper) extending over cavity 12 and providing a lid therefore, the combination of adhesive layer 40 and reference plane element 150 providing an environmentally sealed chamber 152 for die 14. In this embodiment, of course, the thickness of adhesive layer 40 may be sufficient to provide clearance for die 14 and wire bonds 48 under ground or reference plane element 150. Alternatively, reference plane element 150 may be provided with an underside recess 154 to be aligned with cavity 12. While a �glob top� encapsulant is not required in this embodiment, a low-viscosity dielectric material may be applied after wire-bonding to prevent shorting of the wire bonds 48 against the underside of reference plane element 150. Alternatively, a dielectric film 156 may be applied to the underside of reference plane element 150 in the central area wherein it extends over cavity 12.
[0034] Referring now to FIG. 4, a variation 200 of package 100 is depicted. Package 200 and its assembly process flow are similar to that of package 100, and the same reference numerals are used in FIG. 4 to identify the same features present in FIGS. 1-3. Ground or reference plane 250 of package 200, rather than being planar, includes a central dome or protrusion 260 defining a recess 254 thereunder, which is located to be above cavity 12 in assembled package 200 and thus define an environmentally sealed chamber 252 of enhanced height to clear die 14 and wire bonds 48. Such a configuration may be required to accommodate an unusually thick die or excessive wire bond height. Again, a dielectric film 256 may be formed on the underside of ground or reference plane 250 to preclude wire bond shorting, or a dielectric coating may be applied to the wire bonds 48.
[0035] In the embodiment of FIG. 5, a flip-chip configured die 14 is carried in package 300, only the die cavity 12 portion of which is depicted for clarity, all other aspects of package 300 corresponding to the structure of one or more of the previously described packages 10, 100 or 200. The same reference numerals are used in FIG. 5 to identify the same features present in FIGS. 1 through 4. In package 300, die-attach pad 36 is eliminated and base laminate 16 includes traces 32 extending into cavity 12 defined by central aperture 42 of adhesive layer 40 and terminating at trace inner ends 46 sized, shaped and located to define a terminal array 302 configured to connect to intermediate conductive elements 126 extending transversely from active surface 14 as of a flip-chip configured die 14. Conductive elements 126 may comprise solder, or a conductive- or conductor-carrying adhesive. Reference plane element 50 may surround cavity 12 as shown, or extend thereover as shown in broken lines at 50 a. In the former instance, a connection between the back side 14 b of die 14 and the reference plane element 50 may be effected by a wire or strap 51 (which may even comprise a protrusion of the reference plane material over central aperture 42), while in the latter instance, a conductive material such as a conductive epoxy or silver solder or even a resilient conductive element may be interposed between the back side 14 b of the die and the underside of the reference plane element 50, such interposed structures shown in broken lines and generally designated by reference numeral 53 in FIG. 5.
[0036] In all its embodiments, the present invention comprises a packaged semiconductor device wherein inductance and impedance of a group of adjacent, substantially co-planar circuit traces is reduced, and reflection and signal integrity improved, through the use of at least one voltage reference plane element in close, overlapping or superimposed proximity to the plane of the traces. As noted above, while in many, if not most, instances the voltage potential will be connected to ground, or Vss, it is contemplated that there are some applications where another reference potential may be employed with the plane element.
[0037] The reference plane element of the present invention reduces the self inductance associated with closely adjacent elongated traces by reducing the magnetic flux caused by oppositely directed currents flowing in the traces and the reference plane element, typically ground. The reference plane element reduces the self inductance through an increase in effective width and a decrease in the distance between the voltage reference plane and the traces. Similarly, the immediate proximity of the reference plane element to closely laterally adjacent traces of the base laminate exhibiting troublesome inductance characteristics reduces mutual inductance by interruption of the magnetic fields generated by adjacent traces and thus the effects of their interaction. As a result of the presence of the reference plane element in the package, circuit switching times are reduced while noise is maintained at a tolerable level.
[0038] The voltage reference plane arrangement of the invention also provides at least a nominal heat sink effect to the semiconductor device as housed in the central cavity of the package, promoting more even distribution of heat generated during operation of the semiconductor die than might be achieved through the traces alone. As noted above, the heat sink effect may, of course, be enhanced by increasing the mass of the reference plane element, as by enhancing its thickness within the constraints of the package dimensions. A further advantage of the present invention resides in the bending and torsional rigidity, mechanical support and protection provided the traces, the base laminate and the package as a whole by the reference plane element.
[0039] Those skilled in the art will appreciate that semiconductor dice usable with packages according to the present invention may comprise an integrated circuit die 14 employed for storing or processing digital information, including, for example, a Dynamic Random Access Memory (DRAM) integrated circuit die, a Static Random Access Memory (SRAM) integrated circuit die, a Synchronous Graphics Random Access Memory (SGRAM) integrated circuit die, a Programmable Read-Only Memory (PROM) integrated circuit die, an Electrically Erasable PROM (EEPROM) integrated circuit die, a flash memory die and a microprocessor die, and that the present invention includes such devices within its scope. In addition, it will be understood that the shape, size, and configuration of dice and bond pads thereon may be varied without departing from the scope of the invention and appended claims.
[0040] As shown in FIG. 6, an electronic system 400 includes an input device 402 and an output device 404 coupled to a processor device 406 which, in turn, is coupled to a memory device 408, at least one of the processor device 406 and the memory device 408 being configured as one of the exemplary integrated circuit packages 10, 100, 200 or 300 according to the invention.
[0041] Although the invention has been described in detail, it should be realized that certain modifications can be made within the scope and spirit of the invention by those skilled in the art. For example, although less preferred, in lieu of an anisotropic adhesive layer, an insulative layer defining one or more suitably placed apertures therethrough housing conductive materials may be employed to connect the ground or reference plane element to a trace on the base laminate, to a via therethrough and ultimately to higher-level packaging through a conductive element on the bottom of the base laminate. In such an arrangement, the upper insulative film may be eliminated. Conductive elements other than solder may be employed, and other materials may be substituted for those disclosed for use in the various other structural features of the invention. Therefore, the invention should be limited only by the following claims.
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We previously reported that Scarlett was really close to signing a deal for a new movie. Well, I have the pleasure to confirm that Scarlett has signed to star in Cameron Crowe's upcoming film We Bought a Zoo! The shooting starts this January, and we are suuuper excited! What are your first thoughts on this project? (You can read more about it here*)
Scarlett Johansson is in final negotiations to star alongside Matt Damon in We Bought A Zoo, the Cameron Crowe-directed adaptation of the Benjamin Mee memoir for 20th Century Fox about an American who moves to England to operate a zoo. Deadline reported on Monday that Johansson had the inside track on the role, but she and the studio were apart on money. Fox was also talking to Amy Adams, Mary Elizabeth Winstead and Rachel McAdams. Crowe and Aline Brosh McKenna wrote the script. Johansson has been on the short list for several plum parts recently. She is in contention to play Daisy Buchanan in Baz Luhrmann's The Great Gatsby, along with several other actresses. Lionsgate also wanted her for Pride, Prejudice and Zombies, but that now appears in doubt.
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PIc is based on Michel Faber's tome, published by Canongate. Glazer ("Birth," "Sexy Beast") penned the adapted script with Walter Campbell, and is set to begin production in late spring 2011.
Nick Wechsler and James Wilson are producing. Film4's Tessa Ross is exec producing, while Tanya Seghatchian is shepherding for the U.K. Film Council with assistance from Scottish Screen.
Storyline revolves around an alien disguised as a mesmerizing woman who snares human prey on remote highways and other desolate spots with her voracious sexuality. But over time, she begins to change her thinking about humans and finds herself on a collision course with her own kind.
"We're so very excited to be working on this arrestingly original movie," Basner said. "How could we pass up the chance to work with a visionary director like Jonathan, especially when combined with the intriguing notion of Scarlett Johansson as a ruthless alien seductress?"
source: Variety
Scarlett Johansson will host the sketch comedy series Saturday Night Live for her third time with musical guest Arcade Fire on November 13th.
That means new videos, new photoshoot, and new acting! I always love to see her comic side in SNL, so yay!
Scarlett is the image of the 2010/2011 Winter Mango Collection. This is her sixth campaign for MNG and as I've been told, she has renewed her contract, she was also caught last week in Barcelona doing a new photoshoot for the brand, so more gorgeousness coming in spring! But for now, enjoy all the great Winter ads in our gallery. As a curiosity, the campaign was again shot by photographer Mario Sorrenti, but this time in a beautiful house in London.
– Other Projects: Modeling: Mango > 2010 Winter Campaign
J. Ralph confesses to having a major cultural flashback experience while working with the stellar musical lineup he assembled to record songs for a new documentary about autism, "Wretches and Jabberers: And Stories From the Road."
The remarkably diverse list of participants includes Norah Jones, Scarlett Johansson, Carly Simon, Devendra Banhart, Antony Hegarty, Ben Harper, Vashti Bunyan, Bob Weir, Stephen Stills and Vincent Gallo among many more.
They all signed on to be part of producer-director Gerardine Wurzberg's film centering on a road trip undertaken by two autistic adult men.
"It was the craziest thing," said Ralph, the New York singer and songwriter who composed scores for two previous Academy Award-winning documentaries, James Marsh's "Man on Wire" in 2008 and Louis Psihoyos "The Cove" from last year. Ralph's work on those projects prompted Wurzberg to seek him out to supply music for her exploration of the isolation and alienation that often accompanies autism.
Scarlett's husband, Ryan Reynolds, celebrated his 34th birthday yesterday! From Scarlett-Fan we'd like to wish him a Happy (belated) Birthday! We hope he enjoyed a beautiful day with his wifey and we wish him all the best in his career and of course with their marriage.
If you like Ryan and you'd like to know all his latest you can visit our sister site Ryan Reynolds Fan.
Scarlett won the Scream Award (Best Science Fiction Actress) for her role as Black Widow in Iron Man 2! Her Iron Man 2 co-stars Robert Downey Jr and Mickey Rourke received awards for Best Superhero and Best Villain. She didn't attend the awards on October 19th as you may know but well, congrats to her! You can see the full list of the winners here*
Scarlett attended to the Fashion Awards 'El Botón' by Mango today in Barcelona. She was wearing a cute MNG black mini dress, and during the gala she had the honor to give the Golden Button Long Achievement Award to fashion designer Jean-Paul Gaultier. She's also been in Spain to shoot the next Spring 2011 campaign for the brand, as she has renewed her contract.
Finally our girl showed up! First HQ pics from the Awards added to the gallery, so check them out! And let us know what you think of Scarlett's look!
– Public Events 2010 > 'El Botón' Mango Fashion Awards


text: Kid Cries For Iron Maiden – Thrashman Wipes Away A Tear [VIDEO] By Johnny Thrash October 10, 2011 2:34 PM Share on Facebook Share on Twitter In what would make any dad proud, this little dude decides he ain't gonna be happy until he gets some Iron Maiden. Now someone please throw on some Maiden. Click Here To Watch The Video Filed Under: iron maiden Category: Humor, Videos Share on Facebook Share on Twitter More Leave a comment Send to a friend! Print this page Pin it! Reddit This! Share on Tumblr! Best of 106.3 The Buzz Recommended For You Around the Web


text:
|By Business Wire
Article Rating:
|December 4, 2012 02:47 PM EST
The digitizing of America continues at a rapid pace spurred on by mobile devices. IDG Research Services surveyed more than 3,100 visitors to IDG technology media sites in the U.S., such as PCWorld, Macworld, CIO, and Computerworld, to determine information consumption behaviors. The research—"The Echo Effect: Understanding the Value of Tech Buyers"—underscores the power of social media, the widespread use of mobile devices, and the reliance on video to make purchase decisions.
The Social Shopper
Ninety-five percent of the respondents use one or more social media sites. Exposure to a tech product in the social web positively affects likelihood to purchase (44%), overall satisfaction with a company (44%), willingness to recommend a company (42%), and feelings of brand loyalty (40%). When asked how marketers should engage with prospects, just over 50% said respond to questions from customers and provide information about products. Just under 50% want product reviews/rankings, product specs/pricing, the opportunity to provide feedback, and resolve customer service issues.
Mobile Worker and Consumer
A smartphone or tablet is replacing PC-based activities. At least once a month, a large majority of users go mobile for email, use apps to seek tech news and information, engage in purchase-related activity and view video or other multimedia experiences.
Two-thirds of the tech-savvy respondents own/regularly use two or more mobile devices and one-third of their time is spent each week accessing tech info online via a mobile device.
Though advertising on mobile devices significantly lags consumer use of the devices, users are influenced by mobile ads. In the survey last summer, tech consumers noted that they have taken the following actions as a result of seeing a mobile ad on their smartphone in the past six months: researched a product (43%), looked for a product in a retail store (28%), clicked an ad (22%), and purchased a product (21%). The percentages were even higher among tablet users.
"The reliance on mobile devices for purchase decisions tied to an ad is an important new factor," said Matthew Yorke, president, IDG Global Solutions. "Mobile usage has been soaring for a while but advertising has not. This research is a wakeup call for marketers." According to Yorke, "mobile and social are converging to become one of the most powerful ways for marketers to influence prospects when they're shopping."
Tech Consumers Overwhelmingly Drawn to Videos
Consumers find it hard to resist tech-related videos as 93% said they watched them and 72% reported they have forwarded, shared, or posted a video. And, given the mobile findings it is not surprising that four in 10 consumers are watching videos on a smartphone or tablet. Viewers are turning to video for product reviews, information to inform buying decisions, and to learn how to use a new product/service.
Video viewing also drives purchase behaviors: 64% of consumers have researched a product as a result of watching a tech-related video in recent months and close to half of them looked for a product in a retail store (45%), visited a vendor website or contacted a vendor for information (45%), or purchased a product (44%).
Grazing for Information
By a large margin, consumers choose technology websites for technology news and information (87%) but approximately half seek out technology-related print media (52%) or tech blogs (49%). Farther down the list are video-sharing sites and social/business networking sites. When asked for extremely/very valuable sources for finding relevant content, respondents said regular visits to tech sites (86%), traditional search engines (70%), and recommendations or posts in social media (40%) -- an increase of 14% for social channels in two years.
While search is highly rated as a means of finding content, search ranking alone does not drive trust in online content. Only 14% said a listing on the first page of a search result increases trust. Rather it is an association with a known, familiar source (well-known journalist or blogger, tech content site or tech marketer) that drives consumer trust in online information and content. In fact, 73% report an association with a familiar source is important, while 45% note it is recommendations from family, friends, or peers that increase their trust in information they read online.
About International Data Group (IDG)
International Data Group (IDG) is the world's leading technology media, events and research company. Founded in 1964 and headquartered in Boston, Massachusetts, IDG products and services reach an audience of more than 280 million technology buyers in 97 countries.
IDG Communications' global media brands include ChannelWorld®, CIO®, CSO®, Computerworld®, GamePro®, InfoWorld®, Macworld®, Network World®, PCWorld® and TechWorld®. IDG's media network features 460 websites, 200 mobile sites and apps and 200 print titles spanning business technology, consumer technology, digital entertainment, and video games worldwide. The IDG TechNetwork represents more than 500 independent websites in an ad network and exchange complementary to IDG's media brands.
With expertise in branding, lead generation, and social media marketing, IDG marketing services programs are strategically designed and implemented to influence technology vendor prospects worldwide.
A recognized leader in conference and exhibition management, IDG produces more than 700 globally branded technology and entertainment conferences and events in 55 countries.
International Data Corporation (IDC), a subsidiary of IDG, has more than 1,000 analysts who provide global, regional, and local expertise on technology and industry opportunities and trends in more than 110 countries.
Additional information about IDG, a privately held company, is available at http://www.idg.com
Trademarks and registered trademarks are owned by International Data Group, Inc. All product and company names are trademarks of their respective companies.
Photos/Multimedia Gallery Available: http://www.businesswire.com/multimedia/home/20121204006559/en/
Wearable technology was dominant at this year's International Consumer Electronics Show (CES) , and MWC was no exception to this trend. New versions of favorites, such as the Samsung Gear (three new products were released: the Gear 2, the Gear 2 Neo and the Gear Fit), shared the limelight with new wearables like Pebble Time Steel (the new premium version of the company's previously released smartwatch) and the LG Watch Urbane. The most dramatic difference at MWC was an emphasis on presenting wearables as fashion accessories and moving away from the original clunky technology associated with t...
Mar. 31, 2015 10:00 PM EDT Reads: 1,599
SYS-CON Events announced today that robomq.io will exhibit at SYS-CON's @ThingsExpo, which will take place on June 9-11, 2015, at the Javits Center in New York City, NY. robomq.io is an interoperable and composable platform that connects any device to any application. It helps systems integrators and the solution providers build new and innovative products and service for industries requiring monitoring or intelligence from devices and sensors.
Mar. 31, 2015 06:00 PM EDT Reads: 1,602
Internet of Things (IoT) will be a hybrid ecosystem of diverse devices and sensors collaborating with operational and enterprise systems to create the next big application. In their session at @ThingsExpo, Bramh Gupta, founder and CEO of robomq.io, and Fred Yatzeck, principal architect leading product development at robomq.io, will discuss how choosing the right middleware and integration strategy from the get-go will enable IoT solution developers to adapt and grow with the industry, while at the same time reduce Time to Market (TTM) by using plug and play capabilities offered by a robust I...
Mar. 31, 2015 04:00 PM EDT Reads: 623
After making a doctor's appointment via your mobile device, you receive a calendar invite. The day of your appointment, you get a reminder with the doctor's location and contact information. As you enter the doctor's exam room, the medical team is equipped with the latest tablet containing your medical history – he or she makes real time updates to your medical file. At the end of your visit, you receive an electronic prescription to your preferred pharmacy and can schedule your next appointment.
Mar. 31, 2015 03:45 PM EDT Reads: 1,025
SYS-CON Events announced today that Solgenia will exhibit at SYS-CON's 16th International Cloud Expo®, which will take place on June 9-11, 2015, at the Javits Center in New York City, NY, and the 17th International Cloud Expo®, which will take place on November 3–5, 2015, at the Santa Clara Convention Center in Santa Clara, CA. Solgenia is the global market leader in Cloud Collaboration and Cloud Infrastructure software solutions. Designed to "Bridge the Gap" between Personal and Professional Social, Mobile and Cloud user experiences, our solutions help large and medium-sized organizations dr...
Mar. 31, 2015 03:00 PM EDT Reads: 3,052
While not quite mainstream yet, WebRTC is starting to gain ground with Carriers, Enterprises and Independent Software Vendors (ISV's) alike. WebRTC makes it easy for developers to add audio and video communications into their applications by using Web browsers as their platform. But like any market, every customer engagement has unique requirements, as well as constraints. And of course, one size does not fit all. In her session at WebRTC Summit, Dr. Natasha Tamaskar, Vice President, Head of Cloud and Mobile Strategy at GENBAND, will explore what is needed to take a real time communications ...
Mar. 31, 2015 02:39 PM EDT Reads: 567
SYS-CON Events announced today that Litmus Automation will exhibit at SYS-CON's 16th International Cloud Expo®, which will take place on June 9-11, 2015, at the Javits Center in New York City, NY. Litmus Automation's vision is to provide a solution for companies that are in a rush to embrace the disruptive Internet of Things technology and leverage it for real business challenges. Litmus Automation simplifies the complexity of connected devices applications with Loop, a secure and scalable cloud platform.
Mar. 31, 2015 12:00 PM EDT Reads: 667
The world's leading Cloud event, Cloud Expo has launched Microservices Journal on the SYS-CON.com portal, featuring over 19,000 original articles, news stories, features, and blog entries. DevOps Journal is focused on this critical enterprise IT topic in the world of cloud computing. Microservices Journal offers top articles, news stories, and blog posts from the world's well-known experts and guarantees better exposure for its authors than any other publication. Follow new article posts on Twitter at @MicroservicesE
Mar. 31, 2015 12:00 PM EDT Reads: 1,574
SYS-CON Events announced today the IoT Bootcamp – Jumpstart Your IoT Strategy, being held June 9–10, 2015, in conjunction with 16th Cloud Expo and Internet of @ThingsExpo at the Javits Center in New York City. This is your chance to jumpstart your IoT strategy. Combined with real-world scenarios and use cases, the IoT Bootcamp is not just based on presentations but includes hands-on demos and walkthroughs. We will introduce you to a variety of Do-It-Yourself IoT platforms including Arduino, Raspberry Pi, BeagleBone, Spark and Intel Edison. You will also get an overview of cloud technologies s...
Mar. 31, 2015 11:00 AM EDT Reads: 2,251
Containers and microservices have become topics of intense interest throughout the cloud developer and enterprise IT communities. Accordingly, attendees at the upcoming 16th Cloud Expo at the Javits Center in New York June 9-11 will find fresh new content in a new track called PaaS | Containers & Microservices Containers are not being considered for the first time by the cloud community, but a current era of re-consideration has pushed them to the top of the cloud agenda. With the launch of Docker's initial release in March of 2013, interest was revved up several notches. Then late last...
Mar. 31, 2015 09:15 AM EDT Reads: 2,306
The WebRTC Summit 2015 New York, to be held June 9-11, 2015, at the Javits Center in New York, NY, announces that its Call for Papers is open. Topics include all aspects of improving IT delivery by eliminating waste through automated business models leveraging cloud technologies. WebRTC Summit is co-located with 16th International Cloud Expo, @ThingsExpo, Big Data Expo, and DevOps Summit.
Mar. 31, 2015 09:00 AM EDT Reads: 1,733
SOA Software has changed its name to Akana. With roots in Web Services and SOA Governance, Akana has established itself as a leader in API Management and is expanding into cloud integration as an alternative to the traditional heavyweight enterprise service bus (ESB). The company recently announced that it achieved more than 90% year-over-year growth. As Akana, the company now addresses the evolution and diversification of SOA, unifying security, management, and DevOps across SOA, APIs, microservices, and more.
Mar. 31, 2015 08:30 AM EDT Reads: 2,115
The list of 'new paradigm' technologies that now surrounds us appears to be at an all time high. From cloud computing and Big Data analytics to Bring Your Own Device (BYOD) and the Internet of Things (IoT), today we have to deal with what the industry likes to call 'paradigm shifts' at every level of IT. This is disruption; of course, we understand that – change is almost always disruptive.
Mar. 30, 2015 04:00 PM EDT Reads: 1,200
SYS-CON Events announced today that SafeLogic has been named "Bag Sponsor" of SYS-CON's 16th International Cloud Expo® New York, which will take place June 9-11, 2015, at the Javits Center in New York City, NY. SafeLogic provides security products for applications in mobile and server/appliance environments. SafeLogic's flagship product CryptoComply is a FIPS 140-2 validated cryptographic engine designed to secure data on servers, workstations, appliances, mobile devices, and in the Cloud.
Mar. 30, 2015 11:00 AM EDT Reads: 1,558
GENBAND has announced that SageNet is leveraging the Nuvia platform to deliver Unified Communications as a Service (UCaaS) to its large base of retail and enterprise customers. Nuvia's cloud-based solution provides SageNet's customers with a full suite of business communications and collaboration tools. Two large national SageNet retail customers have recently signed up to deploy the Nuvia platform and the company will continue to sell the service to new and existing customers. Nuvia's capabilities include HD voice, video, multimedia messaging, mobility, conferencing, Web collaboration, deskt...
Mar. 30, 2015 01:00 AM EDT Reads: 1,535
SYS-CON Media announced today that @WebRTCSummit Blog, the largest WebRTC resource in the world, has been launched. @WebRTCSummit Blog offers top articles, news stories, and blog posts from the world's well-known experts and guarantees better exposure for its authors than any other publication. @WebRTCSummit Blog can be bookmarked ▸ Here @WebRTCSummit conference site can be bookmarked ▸ Here
Mar. 29, 2015 10:00 PM EDT Reads: 1,885
SYS-CON Events announced today that Cisco, the worldwide leader in IT that transforms how people connect, communicate and collaborate, has been named "Gold Sponsor" of SYS-CON's 16th International Cloud Expo®, which will take place on June 9-11, 2015, at the Javits Center in New York City, NY. Cisco makes amazing things happen by connecting the unconnected. Cisco has shaped the future of the Internet by becoming the worldwide leader in transforming how people connect, communicate and collaborate. Cisco and our partners are building the platform for the Internet of Everything by connecting the...
Mar. 29, 2015 07:00 PM EDT Reads: 5,294
Temasys has announced senior management additions to its team. Joining are David Holloway as Vice President of Commercial and Nadine Yap as Vice President of Product. Over the past 12 months Temasys has doubled in size as it adds new customers and expands the development of its Skylink platform. Skylink leads the charge to move WebRTC, traditionally seen as a desktop, browser based technology, to become a ubiquitous web communications technology on web and mobile, as well as Internet of Things compatible devices.
Mar. 29, 2015 06:00 PM EDT Reads: 1,898
Docker is an excellent platform for organizations interested in running microservices. It offers portability and consistency between development and production environments, quick provisioning times, and a simple way to isolate services. In his session at DevOps Summit at 16th Cloud Expo, Shannon Williams, co-founder of Rancher Labs, will walk through these and other benefits of using Docker to run microservices, and provide an overview of RancherOS, a minimalist distribution of Linux designed expressly to run Docker. He will also discuss Rancher, an orchestration and service discovery platf...
Mar. 29, 2015 04:15 PM EDT Reads: 2,480
SYS-CON Events announced today that Vitria Technology, Inc. will exhibit at SYS-CON's @ThingsExpo, which will take place on June 9-11, 2015, at the Javits Center in New York City, NY. Vitria will showcase the company's new IoT Analytics Platform through live demonstrations at booth #330. Vitria's IoT Analytics Platform, fully integrated and powered by an operational intelligence engine, enables customers to rapidly build and operationalize advanced analytics to deliver timely business outcomes for use cases across the industrial, enterprise, and consumer segments.
Mar. 29, 2015 03:30 PM EDT Reads: 2,241


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Chilling with the Cousins
... amp; Lauren did their teen version of Boston sightseeing. Millie & Abbey had a ball and got spoilt by Maddy, Tanita & Carroline.
It was a perfect way to spend out last day in Boston.
Thanks for the great memories!
http://www.bostonmethodist.org.uk/index .php?p=building
Rowe - Smith Family Reunion
... came together a treat. It was one of the most fabulous evenings ever, Alexis was in awe of all her new relatives, Vince rolled out his humour and Abbey and Millie became the best of friends.
Meeting my Uncle Alan, Dad's brother was something I anticipated doing years ago. To finally achieve my goal to meet our British family after my search began in Boston 20 years ago was both rewarding and satisfying.
We have an amazing family!
Our Caribbean adventure
... idea to go for my birthday and Christmas as we were going to be at home on our own as all our family are scattered over this country and the world. We were delighted when our good friends, Keith and Chris decided to come on the same cruise. Originally they were in the next balcony cabin to ours, until we were upgraded and moved to mid ships. We are now getting excited and are starting to ...
Birding the Norfolk Coast
... and others by size and shape since they are all about the same color.
Tuesday we head to Titchwell Marsh which is a RSPB Reserve. People here are still excellent birders but more open and friendly. They are quick to share anything interesting and we get some good reinforcement on our identifications. We also pick up several new birds including a Hobby (very peregrine falcon like), the ...
Back to the sea
... turns out. The flowers are waning and the kitchen garden is lush with vegetables. We can feel fall in the air and see it in the garden. It's a little sad but how lucky we've been to experience the gardens from the first daffodils until now. We had such a lovely day. No real agenda, no rush and time to visit with the Quakers and car club members, stop for a coffee and watch some cricket. I don't think it gets much better than this.


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So Pretty !!!
Par Cee Bee
de Sarnia , Ontario
I just received this watch and I absolutely love it . I got the orange because I wear a lot of beiges and olive greens . It's beautiful and it fits me perfect as my wrist measures just under 7 inches . It's nice to have something that is easy to put on . I really wanted something from Joan's collection and I'm definitely NOT disappointed !!!
En résumé
Oui, je recommanderais ceci à un ami
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Joan's Bangle Watch
Par SPorcer
de Timmins, ON
Absolutely love Joan's bangle watches. Ordered this one in orange & I receive alot of compliments. Was so saddened on Joan's untimely death. My heart goes out to you on the Shopping Channel-as loved her shows & your interactions with her. She will be missed along with all her products.
( 0 of 1 clients ont trouvé ce commentaire utile)
Beautiful time piece!
Par Chris
de Fredericton (New Brunswick)
I feel compelled to write and strongly disagree with the customers who gave this watch a low rating. I bought the watch in white leather as a showstopper and keep wanting to get another colour - only holding back because I'm on a budget this summer. The quality is second to none. It's a great fit for my average-size wrist. And I have had many compliments on the style factor. It's even an item you keeping admiring when you have it on yourself. I love it! I see watch is featured again today (August 23) on TV and I keep hoping price will be reduced sometime so I can splurge and get another.
( 2 of 2 clients ont trouvé ce commentaire utile)
Classy Watch
Par lovemyjewels
de Ontario
I got the black and find it a very classy looking.The crystals add that bit of sparkle. The numerals on the face look very polished and are a nice size. At 1/2" wide the band is narrower than 1" wide bangle watches I usually wear the only reason I gave 4 star instead of 5 star. The hinges metal caps on the end make taking the watch on and off a breeze.I am happy with my purchase.
( 4 of 4 clients ont trouvé ce commentaire utile)
Nice Face Cheap Strap
Par MAG from NB
de Miramichi, NB
What a disappointment. Have several of Joan's pieces but quality of this one is not so good. Lovely face but very dull cheap-looking strap. Wouldn't know it was leather. Black patent leather would have been much nicer. Also when David said it's a bit large and Joan wears as bracelet he neglected to say it's so big it's constantly turning so you're only seeing the back. Set it aside and forgot about sending back until too late. I'll give it to a friend with a really large wrist. Suggest offering two sizes next time and I'd up my rating.
En résumé
Non, je ne recommanderais pas ceci à un ami
disappointed in the watch
Par Mumsy
de Kingston, Ontario
Although I agree with most of what has been said I have found that the watch has already tarnished on the back making it look cheap.
good looking watch
Par NORMA
de TORONTO
I bought this watch in pink and orange. I liked the look very much. As usual the quality of Joan's watches is exceptional (I have many). I had to return them though...seems bangle watches are not for me. I guess I like tight to the wrist and I found the bangle just a bit too loose on these.
Par mocha
de Vancouver
This is my first Joan Rivers watch, and I'm loving it in black. I especially love the black face with silver details as it is very easy to read. The face is the perfect size, the leather bangle styling fits my wrist exactly, and there's just enough tasteful bling to make me want to wear it every day. This watch is beautiful, stylish and very comfortable. Don't hesitate. I have ordered another one in white, and I'm debating on the other colours.
Par Sherrill
de Port Coquitlam, BC
I received this watch today in the mail. It is my 4th watch in JR's Classic Collection and as always never dissapoints! The turquoise colour is beautiful and the width of the bangle strap is perfect....very elegant on the wrist. The face is (as always) easy to read and the watch stays in place (doesn't turn) because of the oval design. The crystal bezel is just enough bling without looking cheap. Thank you Joan for bringing your loyal customers at TSC such quality watches.
nice and good weight
Par EM
de Ottawa
when I received the watch bangle in the white, I was a bit surprised my the weight which is more than I had anticipated. I found the watch gorgeous, but too small because I prefer a looser fit. I have an average wrist size though.Please bring a larger size. Had to return this one, so disappointed.


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Robert in TX
If you only use with their cleaning and oiling products, they are ok. If you're on a budget, you still might think about a better filter when you factor in the cost of their cleaning and oiling products. Any thing else degrades the filter quickly. If you clean your filter every to every other ride, you might consider Uni or Twin Air. It gets 3 stars because it adequately does its job. Just doesn't do it great for very long.Read All Reviews
Gabriel in TX
noticed power gains with this filter!Read All Reviews
eric in MA
Fit grate and no worried about water going into the intake... No more looming for duck tape to make a seal...Read All Reviews
William in ID
Filter works better than stock and cleans easy. Hate cleaning with gas or solventRead All Reviews


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Sonsire Audiology Associates provideS complete comprehensive hearing care services to patients of all ages. Our highly experienced clinical professionals provide a full range of testing, evaluations and can help you make he best choices with all of your hearing needs that best suit your needs and lifestyle. We offer the most advanced hearing devices that are available and Sutter Medical has several locations in the surrounding community to better serve you.
»Call (607) 215-4245
(0.8 miles)
At Audiology Center of Elmira our licensed audiologist, Lawrence H. Mathieu provides a multitude of services including hearing tests, tinnitus ...
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The team takes a break in Nha Trang to unload the stress of jet lag and culture shock. Coconuts & Cuttlefish for everyone.
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This article is part of the Seeking Alpha PRO subscriber-only research library, which covers more than 3,800 companies. Click here for more on subscribing to Seeking Alpha PRO.
Dril-Quip Grows Backlog By 54% And Boosts Guidance (Again) By $0.20/Share
Nov. 11, 2013 2:05 PM ET | About: Dril-Quip, Inc. (DRQ) This article is now exclusive for PRO subscribers.


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A little piece of New Mexico in West Sussex England.
It looks like a little piece of New Mexico transplanted to Southern England
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Photo taken in The Greater World Earthship Community, Earthship Way, El Prado, NM 87529, USA
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OP Junior Member
Angeles City
Thanks Meter: 3
5 posts
Join Date:Joined: May 2014
hello felas! another mods for our preloved NOTE 1 SHV-E160K
note: do it at your own risk the tab bar is not part of the apk. it is part of my framework
*Rooted note 1 shv-e160k jb 4.1.2 (deodexed)
*Root browser
*a little bit of knowledge in replacing apps
1. backup your original musicplayer.apk by opening root browser located in system/apps
2. download the file,after your download is done, place it anywhere inside your phone
3. open root browser, then copy the modified systemui.apk to system/apps. replace the old one
4. change the permission to rw-r--r--
5. restart and your done
faq: i dont know if this mods will work on other korean models.
if the music player did not work, just replace it with the original one.
i am now working for my s5 rom for this version of note 1. its already 90% done
Last edited by aejayromero; 4th September 2014 at 06:22 PM. Reason: its in the wrong thread.. sorry.. :)


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Category:Malagasy language
Definition from Wiktionary, the free dictionary
» All languages » Malagasy language
Malagasy language
|Malagasy language edition of Wiktionary
|Wikipedia article about Malagasy language
|Malagasy language
|Links related to Malagasy language in sister projects at Wikimedia Commons
|Malagasy language
|Malagasy language considerations
|Wiktionary:About Malagasy
|Malagasy language index
|Malagasy language entry
This is the main category of the Malagasy language.
Information about Malagasy:
|Canonical name
|Language code
|Language family
|East Barito
- Category:Malagasy lemmas: Malagasy lemmas, categorized by their part of speech.
- Category:mg:All topics: Malagasy terms organized by topic, such as "Animals" or "Chemistry".
- Category:Malagasy entry maintenance: Malagasy entries, or entries in other languages containing Malagasy terms, that are being tracked for attention and improvement by editors.
- Category:Malagasy templates: Malagasy templates, containing reusable wiki code that help with creating and managing entries.
- Category:Malagasy terms by etymology: Malagasy terms categorized by their etymologies.
- Category:Malagasy terms by usage: Malagasy terms categorized by the manner and context in which they are used by speakers.
- Category:Terms derived from Malagasy: Categories with terms derived from Malagasy in various specific languages.
- Category:User mg: Wiktionary users categorized by fluency levels in Malagasy.
This category has the following 11 subcategories, out of 11 total.
- ► Malagasy lemmas (8 c, 3321 e)
- ► mg:All topics (10 c, 0 e)
- ► Malagasy terms with audio links (0 c, 166 e)
- ► Malagasy entry maintenance (7 c, 1 e)
- ► Malagasy non-lemma forms (3 c, 14 e)
- ► Malagasy shortenings (1 c, 0 e)
- ► Malagasy templates (0 c, 4 e)
- ► Malagasy terms by etymology (4 c, 0 e)
- ► Malagasy terms by semantic function (1 c, 0 e)
- ► Malagasy terms by usage (2 c, 0 e)
- ► Terms derived from Malagasy (4 c, 0 e)
Pages in category "Malagasy language"
The following 3 pages are in this category, out of 3 total.


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The Soul of Beretta
What's at the core of the Beretta brand? The values, principles and vision that drive us.
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PoliceOne top 5
- 1 Supreme Court considers impact of disability law on police
- 2 DOJ report on Philly PD cites poor training
- 3 Wis. trooper, suspect, motorist killed in shootings
- 4 Suspect dead, 8 cops injured in Ariz. melee
- 5 Video: Ariz. cop escapes death as gunman attempts to sneak up behind him


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SR beats DRake!!
San Rafael softball beat Drake yesterday! It was a battle until the 7th inning but they took the win 7-4!!
Standouts: Kailey Brown went 4 for 4 with a single, two doubles and a home run. Kailey also caught and amazing game.
Olivia Dallara had a home run as well.
Ellie Bauer pitched a great game.
One of our new players, Sandra Gonzalez, got her first hit ever and performed excellently in right field.
Players of the game were Kailey Brown and Sandra Gonzalez.
Great job Lady Dawgs!!


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1 full page of shukobutsu's ad =DDD
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Chen Bu Qun~!!! =DDD
Here's the video on the result segment. =)
Fashion show segment~!!!
Elvin so cute~!!! =DDD
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If you like this, Harlequin recommends
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The police arrive too late--coffee shop owner Sailor Conyers's business partner has been murdered. What's worse, the bullet may have been meant for her. Her only protection is self-appointed bodyguard Officer Gabe Sloan. He'd be perfect defender material--if he weren't her ex-boyfriend.
Dealing with flying bullets tests Sailor's faith, but her dependence on Gabe tests her resolve. She'd turned away from him before out of fear. Now, desperation is drawing them together. Can she let go of the painful past and accept Gabe's love and protection? Or will the killer's aim shatter their chance at a future together?


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Missing Calif. deputy found dead on hiking trail
By Denisse Salazar, Jon Cassidy, Sean Emery and Vik Jolly
Orange Country Register
CALIFORNIA — A Los Angeles County sheriff's deputy who went missing Sunday while hiking in the Cleveland National Forest was found dead Tuesday.
Zoltan Tombol, 42, of Yorba Linda, an avid hiker and cross country runner, went missing near Green River Road and the 91, said Brea police Sgt. Bill Smyser.
Copyright © 2013 LexisNexis, a division of Reed Elsevier Inc. All rights reserved.
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Full story: Missing Calif. deputy found dead on hiking trail
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Missing Calif. deputy found dead on hiking trail
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Ex-police officer indicted for excessive use of ECD at traffic stop
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Clarks black 'General Strides' leather slip on shoes
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Ok fans! Here we go with a full lineup of gigs in the New Year. We've got LOTS of new music to get out of our system, so check out our schedule for upcoming events at your favorite venues!
We're in session right now working up new material plus a new website makeover for 2014. Keep your eyes on the updates, we've got lots to share!
Talk about a great weekend of music with Bent Rail in the great outdoors! Saturday we're at the Coxsackie Riverside Festival with John Pinder from 5-7pm. Then on Sunday it's the beautiful park at Clifton Commons for an evening performance, show time is 7pm. Check out our show listings for details. Both are sure to be great summer fun, come join us!
Bent Rail is back at the newly renovated Tiki Bar at Valkin Restaurant Valatie! Come join us for a fun night of great food, drink, and music in the outdoors of the Tiki!
Thanks to all you fans, Bent Rail has once again taken top spot in the Metroland Reader's Poll as Best Local Blues/R&B band for 2013!! We plan to pay our fans back in full with tons of great performances this year! Thanks again!
Along with spring comes festivals, park concerts, and outdoor music at some of our favorite spots! Look for updates in our schedule as we book up for the spring & summer. See you out & about!
We've got a busy start to the New Year 2013! Check out our schedule for events in January, February, and March. Happy Holidays from Bent Rail!
We just wanted to take a moment to thank the amazing and talented David Mayfield Parade for coming to Albany. It was our pleasure to open for him last night, and we really suggest you get out to see him while he's on tour! Most of the band hails from Ohio and are managed through a Nashville agency. Difficult to describe, and the band leaves you speechless, the Parade is a treat for music listeners of any age and crosses genres. Check him out! His tour moves to Brooklyn tonight.
Our next jam is Friday 10/26 at Sidelines Restaurant & Sports Bar in Red Hook! Get set for a great night; the menu is great and the bar is gonna be lit up with blues and rock! See you there, Bent Rail
Bent Rail returns to Dino BBQ Friday 8/24 for a summer night of great food, drink, and kickin' music!. Come to downtown Troy and sample blues, rock, country and more with BRBB! Keep an eye on our website, there's more events coming soon & much more music to be played


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MenuDirections 2012: Day 1 Photos
The first day of the conference offered attendees a slew of healthy ideas and a taste of Charleston.
High Cotton also served portobello fries and hummus.
High Cotton also served portobello fries and hummus.
What's New
University dining services director says his program offers healthy options and actively seeks student input.
Industry News & OpinionView All
In response to student complaints that it was serving nearly raw meat and rotten produce, Aramark says it will step up its feedback process at a Canadian university.
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A recent survey of its members by the School Nutrition Association revealed that many operators are facing moderate to serious challenges in meeting the stricter nutritional requirements set by the U.S. Department of Agriculture.
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Repainting / Restoring Old windows Questions with Pictures
Hi Everyone.
We have a 1923 brick house. We have been in the home for about 6 years and the inside is up to date for the most part. The exterior is now a priority. The windows are the original windows to the house with the exception of two additions which were done in the 90s. The newer windows are good and will only need to be scraped and painted.
The original windows need a lot of work. They were modernized at some point so they do not have the pulley and weight system, which saddens us. Instead they have an aluminum track on the side of the sash. They work ok. I am going to be re-glazing the windows where necessary, with window putty, not new window glass. I am also stripping them down to the wood and starting from there. We are also removing the triple track storm windows.
I have some concerns that I would like some advice on.
Here is a picture of the area where the window frame meets the brick.
Previously someone used a boat load of caulk!! I'm ripping it all out, however, lots wants to stay, do any of you know any good tricks? Should I use a heat gun?
Once the caulk is removed there are some spots where there is a large gap.
How should I treat this? Should I nail up a new piece of molding that closes the gap, yet makes the window less symmetrical, or should I spray foam the gap, trim the excess, and then caulk over that?
The two above pictures are below the sill of the window. It seems there was concrete there at one point. In some cases there is nothing but a space, was caulked, or there is loose morter that I could just pull out very easily. Should I re-morter this space? or spray foam and caulk. Or is there a better solution to the large gaps around the windows?
On the interior of the house we used PPG or porter paint and are very happy with them. We are considering using their Permanizer acrylic exterior paint and the primer they recommend. Have any of you used this and what results have you had? Also need a recommendation on exterior caulk.
here's the house. The section to the right with the arch top windows was the primary addition.
Also, the house was originally stucco and was bricked over at some point as well.....
Thanks for all your help, I appreciate it! I really want to do this the correct way!
First, get everything stripped and primed with oil primer.
You could certainly foam around the perimeter, carefully trim the excess with a razor knife then skim over it with caulk. You could also use "backer rod" and caulk. For this application I have used "Big Stretch" caulk with success. Don't use cheap painter's caulk here just because it's a big job.
Don't use any caulk at all at the casing/brickmold + wood sill seam. This is a water trap waiting to happen which will rot the casing and the sill. "Paint only" on horizontal seams, (except between dis-similar materials; caulking horizontal seams at masonry/wood is OK).
Foam will stop some of the draftiness too.
I would try to use a much of the old molding if it is wide enough to move over and cover the gap.
You need at least a small gap between the brick mold and wood to limit water absorption by the wood.
If te molding is not wide enough some new molding tghat comes closer to closing the gap might be in order.
Areal lumberyard may have a stock pastern, cut wider molding from stock lumber, or you could probably find the correct pattern router bit and make the molding yourself.
Amana router bits in particular has a number of bits designed to duplicate old molding patterns.
It comes down to how authentic you want the materials and the appearance to be.
Note that if you use backer rod ad caulk with paint it is going to look almost exactly the same as wider molding from a distance, and likely worse up close.
I'd use backer rod rather than foam, trim, and caulk.
backer rods come in different sizes so get an assortment.
insert backer rod, caulk both sides of backer rod.
when it dries caulk over backer rod & finish out
with caulk.
paintable caulk, long life.
foam is very messy to work with imo.
looks like a big job...
best of luck
I thought of this; if the side gaps are consistently 1/4" or better, then pull off the backband and add a suitable strip of wood to the edge, with glue and stainless brads, to get the gap to within caulking range.
If the gap is irregular, it's some kind of filler in place.
Adding a strip atop the backband would be a character-changing alteration to the historic facade :P~
Thanks everyone for your replies. It seems that the only large gaps are only on the outside edges of the outermost windows on the facade. Hope that made sense. Most of the other windows have a very small gap, which seems reasonable.
For the backer rod, do you simply caulk that in place or is there another form of attachment method that I should use first?
I plan on doing this the right way so I don't have to redo it in the near future.
Any of you ever try to get caulk off of brick??? That's my next big puzzle.......
"For the backer rod, do you simply caulk that in place or is there another form of attachment method that I should use first? "
It should be large enough to require forcing into place before covering with caulk.
About 505 wider than the gap seems to work well.
If you need to you can even split the rod using a sharp utility knife.
Uneven gaps can be a PITA to fill.
the backer is just there as a base for the caulk, so using separate pieces as a long gap varies in width is not a problem (except for installing it).
if any gaps remaining are small enough, caulk will not get through them badly anyway.
Tiny gaps at mortar joints (less than 1/8 inch or so) can usually be tolerated.
Part depends on how thick (viscosity wise) the caulk you are using is.
A smooth caulk surface will look better up close, and if you apply it carefully ad too it smooth can look acceptable.
You get some relief on second story work since no one normally can get close enough to see it well (but around a front door or ground level window looking onto the front steps needs to look nicer).


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Pronunciation: culeşer
Added on: 2012-05-24 Listened: 1 timesin: substantiv, neutru, singular
Pronunciation in Romanian [ro]
- Pronunciation by RoxanaC (Female from Spain)
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Putnam Street, Lodi, NJ 07644
Thursday, January 29, 2015
BOYS BASKETBALL:Cliffside wins its spot in the Jambo
By Rich Barton
NJS.com Staff Writer
CLIFFSIDE PARK – As Cliffside Park's Gabriel Valerio walked up to the foul-line for the biggest free-throws he has ever taken, a million thoughts could have run through his mind. With just 31 seconds remaining and the Red Raiders clinging to a one-point lead against pesky Lodi with a berth in the Bergen County Jamboree on the line, Valerio did what any poised player on any level of basketball would do; he took a deep breath, cleared his mind and focused on the task on the hand. The junior guard calmly knocked down both foul shots and Cliffside Park survived a pair of game-tying three-point attempts to earn its second straight bid to the Bergen County Jamboree with a 50-47 victory over Lodi on Wednesday afternoon. "We had a lot of confidence coming into this season and coming into this game," said Valerio. "Our Jambo started today." MORE...
GIRLS BASKETBALL:In a defensive struggle, Lodi snaps Pompton's win streak
FOOTBALL:Lodi opens its season with a win over Hawthorne
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Costco (Nasdaq: COST) operates a nation-wide chain of discount warehouse stores.
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With memories of peak prices in 2007-8 still vivid, manufacturers must keep a close watch on commodity markets. Sudden shifts can have a massive, overnight impact on costs - and worsen food insecurity in developing countries.
Price policies could encourage healthier diets, according to a new publication by the World Health Organisation (WHO) Europe.
European food companies are illegally grabbing land from smallhold farmers in Africa as part of the G8 New Alliance project, says an Action Aid report published this month.
As MEPs prepare to discuss proposed amendments to TTIP's investor principle in Riga next week, the European Commission says that most of the controversy springs from 'common misconceptions'.
The drop in corporation tax, promise of increased investment funding and support for British farmers in the 2015 UK budget were largely supported by British food and drink manufacturers.
Online grocery shoppers tend to prefer navigating to product pages rather than searching for specific products, according to a study funded by the European Research Council.
Friends of the Earth Germany has said it will step up its fight to protect bees after German chemical giant Bayer CropScience failed to sue it in court for claiming...
Russian sanctions have affected its salt supplies after it banned imports from state-run Ukrainian firm Artyomsol, which previously accounted for 24% of the market.
Unique cultivation methods and upcoming innovative applications help Nutress stand out in the bustling Chlorella vulgaris market, says the Dutch company.
Global food prices have dropped to their lowest level since July 2010, according to the United Nations' Food and Agriculture Organisation (FAO).
Dutch supermarkets Jumbo and C1000 have boycotted Bertolli olive oil and products from Ferrero and Douwe Egberts following a pricing row – although Douwe Egberts products returned to shelves last...
The Swedish National Food Agency (NFA) has called on the government for more legislative changes and better support from courts to fight food fraud.
Private label food and drink products have encroached on brands' market share – but what are the factors that lead to own-brand success, and why do they only apply in...
A nationwide campaign to highlight the contribution of food and farming to British national life and the economy, ahead of the general election will be launched by the National Farmers...
Aldi has seized 8% of the UK rapeseed market through a single £1.2M deal with Phoenix Speciality Oils.
Mondelēz International will withdraw from certain retail customers in Europe that have refused chocolate price hikes.
Members of the European Parliament (MEPs) have voted by majority to create legislation that could see country of origin labelling used for all meat used in processed foods.
We must follow the example of Sweden and bring together the two "very noisy" movements of workers' trade unions and Fairtrade, the CEO of Fairtrade International Harriet Lamb has said....
Nearly £400m (€538m) was wiped from Tate & Lyle's stock value on Friday after it issued its third profit warning in a year.
The Malaysian government has launched its own sustainable palm oil certification standard – but will this add to or detract from sustainability and transparency efforts in the sector?
Lower oil prices may affect retail food prices in the long run, but they are unlikely to have a large effect on the food industry, says a new analysis from...
We need a strong portfolio of voluntary and mandatory measures to tackle the huge burden of diet-related diseases, according to the chair of the UK Responsibility Deal food network....
Unilever has reported a 5% increase in net profit during 2014, although growth was weak in emerging markets.
Massive predicted durum wheat losses have driven German firm to research alternative formulation options for pasta manufacturers.
Weak fourth quarter cocoa grinds in developed markets suggest that consumers have reacted negatively to wholesale chocolate price hikes from the major brands, according to an analyst.
The FAO monthly food price index dipped once more in December, after three months of relative stability.
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