text: mental health Legislative Leaders Reach Deal On Guns, School Security, and Mental Health Post Newtown By Jeff Cohen • Apr 1, 2013 State lawmakers have reached a deal on what they're calling some of the toughest gun laws in the country. As WNPR's Jeff Cohen reports, the announcement is the product of weeks of bipartisan talks after the Newtown shootings. If it passes, the bill would mean universal background checks for the sale of all firearms. It would also tighten the state's existing ban on assault weapons, require a background check to buy ammunition, and ban the sale of magazines that hold more than 10 bullets. Democrat Don Williams is the state senate president. "In Connecticut, we've broken the mold. Report: Adam Lanza's Home Was Stocked With Weapons, Ammunition By Audie Cornish • Mar 28, 2013 Copyright 2014 NPR. To see more, visit http://www.npr.org/. Transcript AUDIE CORNISH, HOST: Regaining Balance By Faith Middleton • Mar 28, 2013 Ethan Sherbondy/flickr creative commons Everybody gets knocked off course. How do you rebalance in an unpredictable world? Bruce Clements joins Faith to talk about the art of restoring balance. Are there go-to tactics that work for most people? Or is the answer different depending on what happens to you? What can we learn from others? How do you get perspective when the clear mind you need is clouded and confused? Regaining Balance By Faith Middleton • Mar 28, 2013 Ethan Sherbondy/flickr creative commons Everybody gets knocked off course. How do you re-balance in an unpredictable world? Bruce Clements joins Faith to talk about the art of restoring balance. Are there go-to tactics that work for most people? Or is the answer different depending on what happens to you? What can we learn from others? How do you get perspective when the clear mind you need is clouded and confused? Connecticut's National Guard Forced To Adapt For War By Samaia Hernandez • Mar 19, 2013 From colonial militias to combat reserve, the role of the National Guard has varied in more than 376 years. It shifted again after the attacks on 9-11. Appearing on WNPR's Where We Live, Colonel John Whitford of the Connecticut National Guard says people enlisted for different reasons over the last 13 years. "You've seen the guard change from a strategic force to an operational force. That's when you've seen many Connecticut National Guard army and air units going to Iraq to provide that assistance to the combatant commander." Meditation and Psychotherapy By Faith Middleton • Mar 12, 2013 Wieritz on Flickr Creative Commons Today Faith tackles meditation and its affects on psychotherapy. VA Gives Gun Locks To Veterans To Prevent Suicides By Lucy Nalpathanchil • Mar 7, 2013 Lucy Nalpathanchil Every day an estimated twenty-two veterans kill themselves in the U.S. and most of them will use a gun to do so according to the US Department of Veterans Affairs. This trend mirrors the general population where more people kill themselves with guns than with all other methods combined. The VA is trying to help with a program that offers gun locks to veterans for free. The thinking is that if they lock their guns up they might not reach for them in the spur of the moment. May I Be Happy and a Look at Germs By Faith Middleton • Feb 27, 2013 Saroj Regmi/flickr creative commons Police Set New Ways To Deal With Trauma After Newtown By Samaia Hernandez • Feb 25, 2013 The shooting deaths of 20 children and six adults in Newtown have forced law enforcement officials in Connecticut to come up with new procedures to help police. The measures could change the way law enforcement responds to life-changing trauma. Exploring Human Cognition By Ray Hardman • Feb 25, 2013 Digitalbob8 on Flickr Creative Common Dr. Amy Arnsten, Professor of Neurobiology and Psychology at Yale University, spoke to WNPR's Ray Hardman, on her recently released findings from a study exposing the importance of healthy NMDA receptors needed for higher-level thinking and their potential link to illnesses like schizophrenia and Alzheimer's disease when this pre-frontal cortical circuitry is damaged. Real Life Survival Guide Episode 71 By Bruce Barber • Feb 24, 2013 Cindy Papish Gerber This time we'll be talking about "Grief and Loss", an issue we've been struggling with since the unthinkable violence in Newtown on December 14th. As you'll hear in the podcast, grief and loss comes in many different forms - everything from the the sudden death of a spouse or a child to the loss of a job, a pet, a relationship... or sometimes even "all of the above". Why Worry? By Faith Middleton • Feb 13, 2013 Jonathan McNicol Clifford Beers Clinic to Help Military Families By Lucy Nalpathanchil • Jan 31, 2013 Courtesy of Clifford Beers Clinic A New Haven mental health clinic has received a federal grant to help the children of military families. The clinic aims to use the funding to fill a gap that exists in the VA health care system. At Legislature, Mental Health Takes Center Stage By Jeff Cohen • Jan 29, 2013 Lawmakers are hearing/heard testimony on mental health services in the state, as part of the legislature's response to the shootings at the Sandy Hook Elementary School in Newtown. WNPR's Jeff Cohen reports. Patricia Rehmer had a note of caution for lawmakers. She's the state's commissioner of Mental Health and Addition Services. "We do not have any information about the mental health or any mental health issues that the shooter in the Newtown tragedy may have. Assisted Outpatient Treatment Laws By John Dankosky • Jan 28, 2013 epSOS.de on Flickr Creative Commons The Sandy Hook shootings have resulted in a special bipartisan task force of the Connecticut legislature. Last week's public hearing dealt with recommendations to enhance school safety. Today's lengthy hearing is about reducing gun violence, and tomorrow they'll talk about increasing access to mental health care. A Month Later, Many Questions Remain In Newtown, Conn. By Jeff Cohen • Jan 24, 2013 Transcript ROBERT SIEGEL, HOST: From NPR News, this is ALL THINGS CONSIDERED. I'm Robert Siegel. MELISSA BLOCK, HOST: And I'm Melissa Block. UConn Study Focuses on Children Who Lose Autism Diagnosis By Lucy Nalpathanchil • Jan 23, 2013 Courtesy of Flickr CC by BLW Photography A study by University of Connecticut researchers has found that some children diagnosed with autism at a young age improved to a point where they no longer had symptoms of the disorder. Treating Trauma Before It Hurts By John Dankosky • Jan 16, 2013 Kortunov on Flickr Creative Commons After Newtown, school nurses and teachers have been asking for training to identify the early signs of trauma in children. The Child Health and Development Institute held two training sessions last week for school personnel in Connecticut with several more planned in the following weeks. Joining us this morning is Dr. Robert Franks, a trauma expert and Vice-President of The Child Health and Development Institute. Families Of Newtown Victims Launch New Initiative By Jeff Cohen • Jan 14, 2013 Transcript AUDIE CORNISH, HOST: From NPR News, this is ALL THINGS CONSIDERED. I'm Audie Cornish. Family members of those killed at Sandy Hook Elementary in Newtown, Connecticut, have spent the past month grieving. Now, some of them have banded together and say they're ready to be part of a national discussion about how to make our communities safer. They call themselves the Sandy Hook Promise. Jeff Cohen, of member station WNPR, has the story. Gov. Dannel Malloy on Newtown, Gun Control By John Dankosky • Jan 11, 2013 Chion Wolf / WNPR Last month, on December 13, Governor Malloy appeared on our show for his monthly visit. We talked about the budget and the upcoming legislative session, and the issues he hoped to work on in the coming year. The next morning, everything changed. Court Ordered Outpatient Commitment For Mental Illness By Ray Hardman • Jan 11, 2013 Wikimedia Commons In the wake of the shooting at Sandy Hook Elementary School, lawmakers and advocates are taking a second look at the state's outpatient commitment laws. Connecticut is only one of six states that does not allow court ordered treatment for people suffering with mental illness that could be a danger to themselves or others. Joining us by phone is Dr. Harold Schwartz, Psychiatrist-In-Chief at the Institute of Living and Vice-President of Behavioral Health, Hartford Hospital. Malloy Says Newtown Motive May Never Be Known By Jeff Cohen • Jan 3, 2013 Jeff Cohen/WNPR The investigation into last month's shooting at the Sandy Hook Elementary School may take months to complete. The governor says the shooter's motive may never be known. The State of Mental Health Care in Connecticut By Colin McEnroe • Dec 17, 2012 Chion Wolf I'm not a big fan of getting ready to fight the previous war. Our next crisis will not be Adam Lanza. It will not be an exact replica of the facts of his life, not that we know those for sure yet. (I would say, parenthetically, that the worldwide rush to diagnose Lanza makes me massively uncomfortable.) Real Life Survival Guide Episode 67 By Bruce Barber • Dec 16, 2012 Cindy Papish Gerber For episode 67 of the RLSG, we decided to talk about "holiday stress". This was before our perception of the world changed - just two days ago - as the heartbreaking series of events played out in Newtown. There will be more than the normal level of stress during this holiday season, and for too many, life will never be the same. It is with thoughts of those who are no longer with us, and of those who will never see their loved ones again, that we go forward, hoping for a future in which we can live together in peace. Suicide 'Epidemic' Among Active Duty Military and Veterans By Lucy Nalpathanchil • Dec 13, 2012 Photo courtesy of Truthout.org Listen Listening... / Defense Secretary Leon Panetta has called on military leaders to explore a "epidemic" of suicide among active duty servicemembers and veterans. Each day, 18 veterans kill themselves according to the federal Department of Veterans Affairs. In Connecticut, 30 veterans have died this way since 2009, but those are only the suicides that the VA knows about. Sharp: A Story Of Psychosis, Self-Mutilation & Brave Reemergence By Colin McEnroe • Aug 16, 2012 Iraq and Afghanistan Veterans on Trial By John Dankosky • Aug 2, 2012 U.S. Army (Flickr Creative Commons) In the Civil War, it was called soldiers heart or nostalgia. In WWI, it was known as shell shock. These days, it's known as Post Traumatic Stress Disorder, or PTSD. Talk to any veteran and they'll tell you: war changes you. Attorney Seeks to Improve Claims Process for Victims of Military Sexual Trauma By Lucy Nalpathanchil • Jul 18, 2012 CVLC A Connecticut attorney testified before Congress Wednesday on ways to improve the claims process for veterans who've been sexually assaulted while in the military. When veterans are raped or sexually assaulted while in the service, it's called military sexual trauma or MST. The Department of Defense estimates more than 19,000 sexual assaults happened in 2010, but it's a problem that's often under-reported. Student Nurses Learn How to Care for Veterans By Lucy Nalpathanchil • Apr 26, 2012 Dr. Suzanne Campbell Fairfield University is participating in the nationwide initiative, Joining Forces, to to help veterans. WNPR's Lucy Nalpathanchil spoke with the Dean of the School Of Nursing, Dr Suzanne Campbell. Analysis of Defense Department Records Show Veterans Wrongfully Discharged By Lucy Nalpathanchil • Mar 26, 2012 March 23, 2012-An analysis of Department of Defense records shows that hundreds of veterans have been wrongfully discharged since 2008. The Vietnam Veterans of America allege that service members were incorrectly diagnosed with "personality disorder." Pages« first ‹ previous 1 2 3 4 5 6 7 next › last »


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Christopher Heine | March 15, 2011 | Comments
Southwest Airlines rewards 10 airline tickets to attendees checking in at an outdoor location.
Austin, Texas -- Dozens of marketing and tech pros stampeded across Trinity, Bravos, and San Jacinto Streets here on a windy Sunday, some dodging traffic in a devil-may-care run towards free roundtrip plane tickets from Southwest Airlines. The contest participants were charged with being one of the first ten people to arrive in Loopt's dedicated parking lot space to get the reward. Upon arrival, the sprinters huffed and puffed, as they thumbed around on their smartphones and checked into the Loopt app.
Ten lucky winners got their free tickets and cheered loudly in an unusual scene that had young Hollywood star Michael Sera momentarily taking notice as he walked by. If Sera thought the whole thing was a little over the top, he was probably right.
But Southwest's promotion underscored a brand that's been willing to take creative chances with social media during the last 15 months or so.
In the below video, ClickZ speaks with Southwest's Alice Wilson, associate social media manager, and Brooks Thomas, spokesperson. We also check in with one of the winners of the geo-social spectacle:
Want to learn more?
Attend ClickZ Live New York March 30 - April 1. With over 15 years' experience delivering industry-leading events, ClickZ Live brings together over 60 expert speakers to offer an action-packed, educationally-focused agenda covering all aspects of digital marketing. Register today!
Christopher Heine was a senior writer for ClickZ through June 2012. He covered social media, sports/entertainment marketing, retail, and more. Heine's work has also appeared via Mashable, Brandweek, DM News, MarketingSherpa, and other tech- and ad-centric publications. USA Today, Bloomberg Radio, and The Los Angeles Times have cited him as an expert journalist.
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text: We live in Brooklyn, NY (though we both grew up in San Diego, CA). Our favorite things to do are going to art shows, having a couple (not too many) drinks with good friends, and experiencing new cultures. Well, our last favorite thing to do is playing with our two wiener dogs but they can't come with us on this trip.


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Home > Clock Making Kits > Weather Station Kits > Highlander Weather Station Kit
The Highlander Weather Station Kit is a distinctive weather station kit that creatively displays three 2-3/4" inserts (clock, barometer and hygrometer), along with an 11" Galileo thermometer. This kit includes everything needed to build this unique weather station - includes your choice of gold or cream inserts, see below. Finish with your choice or paint or stain.
Wood: Red Oak
Stain/Finish Shown: Antique Oak with clear, satin finish
Kit Includes all pre-cut wood parts (pre-machined and factory sanded) required for assembly. This kit will also include assembly hardware, three (3) inserts, one (1) 11" Galileo thermometer, and step-by-step written assembly instructions with supporting assembly illustration.
General Assembly & Wood Finishing Steps:
Glue dowels into instrument mount stand
Glue bottom plate to base plate
Stain and/or finish
Place Galileo thermometer into top plate
Mount weather instruments and clock insert
Set time and complete certificate of origin
Finished Size: 13"H x 8-1/4"W x 3-1/2"D
Video Demonstration:
Category and Tools
Category 1 is described as:Easiest and quickest to complete.Very few wood parts and assembly steps required.Can be completed in a few hours or in a few evenings.
Plan and Components Also Available
Stock No.
Kit with Gold Inserts
Kit with Cream Inserts
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Because we at Klockit understand that this is possibly a once in a lifetime purchase, the delivery of your Howard Miller grandfather clock
is completed with our Ultimate white glove delivery crew.
The delivery is completed by a 2 man service and placed in the room of your choice.
The unit is then unpacked, the carton packaging is removed, and any light assembly (up to 30 minutes) is completed.
Finally, you get the opportunity to inspect and sign off on the delivery before the delivery crew leaves your house to insure your satisfaction.


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Durian cupcakes
Today I baked some durian cupcakes for Christmas gifts. I used a frozen durian and baked them into mason jars so I can seal them with lids and give them out. Once the jars are properly sealed they last up to a year. I used a recipe from a gentleman's blog, supposedly it is good for chempedak too.
here is the original recipe
I made a few slight modifications by adding 1/4tsp. salt and 1/2tsp. vanilla extract since I am unable to add the pandanus cream. Though weighing is the most accurate way to go with baking and grams are more accurate than oz. here is a rough conversion. I did use a scale for mine. Try to have everything at room temp too.
3 eggs
170g durian flesh (forgot to write down conversion amount)
1 1/4C. AP flour
12Tbs. butter
3/4C. sugar
2 tsp. baking soda
2 Tbl. coconut cream
1/4 tsp. salt
1/2 tsp. vanilla extract.
To start I pressed the durian flesh through a mesh screen to remove any fibers.
Using a mixer, cream the sugar and butter, then add eggs, then add durian flesh mixing between additions. Scrape the sides of the bowl and add remaining ingredients.
I used 1/2 pint mason jars that were sprayed with nonstick and filled 1/2 way with batter. The conversion in oven temp comes out to 356F but since I was using glass and they were small I set mine about 330F +/-. I set the 1/2 filled jars directly on the oven rack and baked for about 25-30 mins. Check them with a toothpick do not underbake. During this whole time I had a pan of water with the mason jar lids gently simmering on the stove. When I removed the hot jars I place the lids on top and tightened the band. I placed these on a wire rack to cool and hear the 'pop' of the sealing lids. The jars will show condensation at first but if you let them sit for a week the moisture will reabsorb into the cake making them very moist. If the lid does not seal eat within a day or two, if there is mold when you open it, dont eat it.
I did have one not seal so I'll try it tomorrow.
whole frozen mornthong durian
cut open, still kinda frozen
nice sized chunks of flesh some with ice crystals
finished product
some of the gifts for Christmas
back row L to R: home brewed beer, orange cream ale, nutmeg brown and doppio malto plus some pickled green beans.
front row L to R: home grown Tropic pink guava jelly, home grown dwarf Namwah banana nut bread and durian cupcake.
Merry Christmas all,
As a little kid, I thought Durian was awful! But now it doesn't smell too bad and I actually like it. Your Durian cupcakes looks fantastic! And, wow, your orange creme ale, banana nut bread and guava jelly looks delicious too! Thanks for sharing, Ethan. ( :
Thank you Bo and Cath for your kind words.
I'm sitting here trying one of the jars of cake right now. The cake is nice and moist with gentle underlying flavors and a very bold durian flavor. What is nice though is the cooking process or other ingredients have mellowed some of the sharper aspects of the durian's taste a little. A little dollop of whipped cream dresses it up nicely too.
It is funny Cath, since I've been brewing my # of friends has increased steadily despite being a horrible person with no personal hygeine. ;)
BTW, cats like durian cupcakes too.
Having traveled with you in Puerto Rico,on at least one occcasion in extremely tight quarters, I can most assuredly say you are not a horrible person.....now the personal hygiene issue...that is something else. No, just kidding.......how much alcohol content does your beer have??
No...seriously Harry...Ethan's personal hygiene issue was bound to come up sooner or later!!!! Afterall...you guys had to sit real close-like with him on the trip back from Bryan's!!! LOL! We should have video'd that episode. That was just way too funny. Wasn't it Gerry who way putting his feet out the window??!!
Anyway...Ethan...that cake looked pretty good until you posted the pic of that cut open frozen durian. OMG!! That looked like something from a horrible lab experiment. Certainly something that shouldn't be ingested! Gnarly!
I was just glad no one had to ride in the trunk, esp me.
Harry, the beer is about 4.5% alcohol, since it is a gift to a wide range of palates I tend to make them somewhat mild. On rare occasions I make barley wines or doppel helles bocks that range in the 10-12% area. A nice sipping beer for those cold Miami nights.
Jay, maybe I can be durian boy's (man's) apprentice, I still have a ways to go on the durian train. That durian not only looked scary but by the time I was done cooking everything and eating the leftover durian flesh, the entire house was thick with durian funk. I had to go outside for fresh air for a couple minutes. My daughter was unfazed and today enjoyed sharing a cupcake with me, tough little kid.
I'm lucky I didn't have to experience that man-packed ride back from Bryan's. Maybe I just had the keys all along and just didn't want to have to drive Ethan around any longer.
So.. any chance any of those beers will be making their way to FL?
Beers Sheehan?? Probably not after that last comment!!! LOL! I've heard a rumor that Ethan is now experimenting with durian bath products...soap, cologne, deodorant. Should be a hit!
there will be some beer headed to FL., but whether they make it to you or not is another story. Just stand by your mailbox until they arrive.
Stan, I've seen durian ice cream, jam, chips and probably other products, for as bad as it's reputation is, it is very popular.


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April Luncheon: Simplify Your Marketing, Get More – Do LessPosted on: March 31st, 2015
Is your business running you? With so many marketing options, it's tempting to try it all… which can lead to overwhelming sense of frustration, not results. The good news? By doing less, your marketing can become more effective. Embrace the practice of simplification, and you will get great clients & customers and keep your sanity intact! Mary will discuss how to identify the best marketing strategies for your business so you can stop wasting time on complicated schemes (ones that ultimately don't work anyway) and the costs of making the most common marketing mistakes and how to avoid them.
With more than a decade of entrepreneurial experience to her credit, Mary Cravets is a San Luis Obispo, CA based Business Coach who works with highly driven entrepreneurs who are tired of working all the time, and who want their business to run like a well-oiled machine and get paid what they're worth. Mary's entrepreneurial journey includes successful careers in Real Estate, Direct Sales, business-to-business Networking Events and now Business Coaching.
Tuesday, April 21st
Atlantis – Casino Resort Spa
3800 S. Virginia St
Networking: 11:30 AM
Lunch: Noon to 1PM
RSVP by 12pm, Friday, April 17th
Luncheon Pricing
$25 AMA Members with RSVP
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$40 Without RSVP (Seating is on a space-available, first-come, first-serve basis)
Please Note: The AMA bills RSVP'd no-shows. Please notify us no less than 48 hours before the event, so we have time to cancel your meal.


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842 photos found.
Asia dec2011 by miguel
Tallest Christmas Tree in Asia by eves calajate
Golden Arches Meets Asia by Kent Serene
Common Mormon / Southeast Asia by Shirley Valencia
Great Mormon / Southeast Asia by Shirley Valencia
The rose red yellow from Asia by Deni Irawan Thamrin
Asia Bank: Best Service by Marissa Maccioli
sunset inthe beach Asia by Deni Irawan Thamrin
asia pacific down hill challenge 2010 by andy suryawan
Asia 4 by Mike D.
Southern-most Tip of Mainland Asia by Roslan Tangah
Standing on the highest point in South East Asia! by Edward DSilva
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Saurus Hotel
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... was an ice skating rink so Liam had a chance to show off his skating skills again and absolutely loved it. This time Liam convinced Rob to have a go, he did well after going around holding the rail twice he got a little brave and said he was ready to show me his Torvil & Dean act! Not so but he did stay on his feet the whole time. We've had some nice meals in the evening, and the coffee is good in this ...
Heartburn Problems- Avoid These Foods
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... not stirred. Reflecting on a top arvo in Bari on treadlies with our extended family of kiwis and Californians. Just like the ANZUS treaty, Johnny Howard would be so proud. The tour was kind of nothing really but featured some great moments of immersion in the local lifestyle in the town. Some fresh pasta being made in the courtyard , which ...
... better Phil.
We set off for Matera which is about one hour away to the southwest. It has been voted in as another one of the amazing cities of Italy – this one has been UNESCO listed as a World Heritage site because of its 'SASSI' (which means stones) but it is actually a whole old city built into the caves/mountainside. And what a sight it truly was. The drive into this town was actually crazy – SO ...
Off on our annual pilgramage
... with just being here at this wonderful place. Us included. Hope you like the pictures.
One of the things ...


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Male, 20 years old
4.05 out of 10 (what is this?)
Public Records
Arrest Records
Search Their Arrest Record, Driving Record, Marital Status and More...
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View Social Profiles on Facebook and 60+ Networks for originalhustla
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Marcus Davis is 20 years old. He lives in Auburn, WA. He has also lived in Dallas, TX; Plano, TX and Lakewood, WA.
He is an alumnus of the Auburn Riverside High School and Schools. He has worked for Dallas Mavericks and Jobs. Hip Hop, Lupe Fiasco and R&b are among his favorite bands. His favorite movies are Dodgeball, Scarface, Napoleon Dynamite, Boyz N The Hood and Harold & Kumar Go To White Castle.
On the web, Marcus goes by the alias originalhustla.


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- Product Information
Product Description
She's a Semper Fi femme fatale in this sexy version of the USMC dress uniform. She's ready to welcome her favorite maritime men home when she shows her support for the troops in this Adult Marine Major Mayhem Costume. Pair with your favorite Jarhead for a marine loving couples costume idea. This fanciful frock is perfect for photo shoots, too! Oorah for Halloween in this Adult Marine Major Mayhem Costume that includes; cotton/polyester ribbon trimmed stretch twill dress with gold button accents, military medal detail and fringed shoulder epaulettes. Stockings, shoes and hat not included. Available in adult sizes; small, medium and large.
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Spend a Day in Paris with a Paris Party!
Add a Paris theme to any type of soiree with the help of Paris decorations and French treats. Use these party planning tips and ideas to help you prepare for your party!
Totally 80's Party Ideas
Add an 80's theme to an upcoming party of event! Use these party tips to help you set up for an 80's theme party, complete with decorations, food ideas and more.
Add a Pink and Gold Color Scheme to Your Party!
Throwing a party? Try using a mix of pink and gold colors to create the color scheme for your party décor. This color combination can be used for birthday parties, bridal parties, baby showers, and much more!


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HENRI PFR project
Closed - This job posting has been filled and work has been completed.
Job Description
Hi , I'm looking a good photoshop designer who can replace the name of this picture :
by the name "HENRI PFR" and put the name design on this background with a fade :
(I just need a picture not an animation !)
You have in the link the tutorial too for the name design ..
Thanks , I need that really fast !


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Hi! My name is Aria. I came to SaveABunny after Zooh Corner rescue near San Gabriel asked for emergency rescue
assistance. My time had run out at the shelter and I needed someone to take me in and care about me. SaveABunny came through and I was safe!
As you can see from my photos I am quite a pretty girl. I'm cocoa brown and just a stunning spayed girl. I'm also a smart bunny. All you bunny savvy people know what that means...
I like things to go my way. I am particular about my housing and discriminating about which people I like and allow to snuggle me. I'm actually a real softie at heart, but I may make you work a bit for my love. It's worth it. I'm a truly lovely and loving girl. Just give it a little time to truly get to know me. I'm worth it and will become your very best and loyal friend.
CUSTOM and MADE-TO-ORDER!!
Stunning , lightweight, special made -to-order embossed polymer clay pendant. Your choice of photo and colors! We can add gemstones, crystals and other embellishments. Prices will vary depending on materials. Starts at $49 for classic look shown here. Bring your loved ones and special totem with you wherever you go.


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Dr. Luis A. Gonzalez, MD
Adolescent Medicine
- 5505 S Expressway 77 Ste 100
Harlingen, TX 78550
- 2 Locations
- (956) 425-4325
Dr. Luis A. Gonzalez graduated from the Univ Evangelica, Fac De Med, San Salvador, El Salvador in 1990. He works in Harlingen, TX and 1 other location and specializes in Adolescent Medicine and Family Medicine. Dr. Gonzalez is affiliated with Harlingen Medical Center, Knapp Medical Center and Valley Baptist Medical Center. He speaks English and Spanish.
Gender: Male
Languages Spoken: English, Spanish
Adolescent Medicine, Family Medicine
Medical School: Univ Evangelica, Fac De Med, San Salvador, El Salvador; Graduated 1990
*This physician has multiple office locations. See Office Information for details.


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After submitting my 4th order I must share joy of finding a reliable, service minded and dependable supplier. Even after finding a cheaper source on...Read More ->
I could just write a one-time testimonial as I only do my magic purchases with MJM. But each time I order from them, it just gets better and better!...Read More ->


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Event Details
Location: Bear Gulch Area Time: 8:30 PM to 1:00 AM Fee Information: Free; Park Entrance Fee Applies Contact Name: Pinnacles Visitor Center Contact Phone Number: (831)389-4485
From under a canopy of stars, become a nocturnal Pinnacles hiker with Volunteer Ranger Peter Szydlowski on this easy, two-mile hike on thelevel Bench and South Wilderness trails. This evening journey offers the unique opportunity to reconnect to natural darkness on this dark sky hike. Become attentive to your night vision and join the natural quiet and stillness of Pinnacles National Park.
Duration of hike: 90 minutes. Overcast sky will cancel hike.
Meet at the High Peaks Picnic Area at 8:30 pm with layered clothing, sturdy boots, water, small flashlights with red lens (we will provide red-lenses if needed).This hike is limited to 25 people and reservations are required. Sign up at the Pinnacles Visitor Center desk during open hours, 9:30 am to 5 pm or call 831-389-4485. Groups of less than 6and children over 5 years old are preferred


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- 7
- 4
This freshly renovated four bedroom holiday home is flawless for your family holiday break. After undergoing a complete makeover, one of the prime features of the property is the fully paved and covered outdoor area, featuring a bar/servery adjoining from the kitchen to the outdoor setting with BBQ.
Furthermore featuring all brand new appliances, furnishings, bedding, fixtures, carpet and floorboards.
Accommodating up to 7 people:-
Bedroom 1: 1 x King Single
Bedroom 2: 1 x King
Bedroom 3: 2 x Single
Bedroom 4: 1 x Queen
Property Features:
* 4 Bedroom
* 1 Bathroom
* Fully fenced backyard
* 2 x TV's
* 2 x Living areas
* Split system heating & cooling
* 30 Second walk to the beach and playground
* Fully covered outdoor area - ideal for rain, hail or shine
* Brand new appliances, furnishings, bedding, carpet and floorboards ect:
Note: Pricing is subject to change, and a minimum stay period and other conditions may apply. You should confirm pricing with the property owner.
Prices listed based on 1 adults. Property has 4 beds and can sleep a maximum 7 people.
Request a booking or make an enquiry
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Victorian bar pins, Lucite cameos, and costume jewelry by designers such as Miriam Haskell, DeRosa, and Coro fill MORNING GLORY ANTIQUES & JEWELRY in Albuquerque, N.M.'s Antique Connection Mall; morninggloryantiques.com, (505) 296-2300. At PIPPIN, a tiny vintage-jewelry shop in Manhattan, look for Art Deco necklaces, glittery 1950s brooches, and drawers of bargain-priced baubles; (212) 505-5159. At HOUSE OF VINTAGE, in Delray Beach, Fla., costume jewels from Kramer, Vendome, and Chanel mix it up with enameled pins and charm bracelets from the 1950s; myhouseofvintage.com, (561) 276-7477. Located at Houston's Antique Pavilion, BARBARA B. WOOD'S ANTIQUE COSTUME JEWELRY specializes in Bakelite bangles by designers such as Shultz, Clarke, Foltz, and Weeks; bwoodantiques.com.
Shopping for Costume Jewelry
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How to Make Your Jewelry Shine Like New
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Trisha Yearwood Shares Her Country Essentials for Spring
The country music star and cookbook author shares her spring favorites.
Lauren Bacall's Home Was an Antique Lover's Dream
There's a vibrant, vintage surprise around every corner.
31 Mason Jar-Inspired Products We Love
Our favorite canning and crafting supply as muse.
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text:
Sleep Inn
5703 Oakley Blvd
Wesley Chapel, FL 33544
Phone: (813) 973-1665
Fax: (813) 435-7437
Outdoor Activities
American Balloons
4906 Land O' Lakes Boulevard
Land O' Lakes, FL 34639
+1 813 243 9507
Mo to Su from 08:00 AM to 08:00 PMAt American Balloons, reaching new heights in outdoor entertainment is their goal. Take to the skies on a thrilling hot air balloon ride and enjoy the scenic views below as the balloon makes its way over the Tampa Bay landscape. Select a group ride with friends and family or choose a private couple's ride that can be customized for a special event or occasion. Tethered balloon rides are also available if you prefer to stay in one place. Feel like a bird as the hot air balloon glides along in an approximately hour-long ride. -Vickie Ferguson
Earn valuable points toward free nights.


text:
Changes related to "Category:Life Preserver"
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2 March 2015
22:33 (Page translation log) Tigersharke (Talk | contribs) marked Life Preserver/10.1.1 for translation
22:32 Life Preserver/10.1.1 (diff; hist; +3) Tigersharke


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He lived an unhappy life.
- samueldora
- Nov 18th 2011, 23:04
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Welcome to our Patient Portal
See how we're bringing more power to the patient. » Click here
Say hello to all the things you gain, when you lose weight.
Active quality time with family is just one of the many reasons to join Lighten Up Onslow. » Sign up now
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State-of-the-art treatment right here in Jacksonville » Learn more
On your way to new health insurance options.
Learn more about the Health Insurance Marketplace » Click here
Join us in making Onslow a healthy, happy place, and discovering all the ways you can say "Hello Healthy."
QUICK LINKSCareers Map & Directions OMH Foundation Annual Report O'Healthy Phone Directory Caring Bridge Labor and Delivery Medical Records Pay Your Bills Top Hospital Charges Patient Portal
twitter: @ONSLOWHOSPITAL


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What Are the Side Effects of Working the Night Shift on Your Health?
bhupe1 posted in Miscellaneous 1 day ago
www.muneshchahar.com - Where as many people find it helpful working at night shifts, as it helps them produce more efficient work, with little to worry about management and unfriendly p... read more
3 ways to survive information overload
webdesignerdepot posted in Miscellaneous 7 days ago
www.webdesignerdepot.com - Whether we're self-taught or university educated, we're all expected to keep learning as the... read more
The Essential Web Hosting Guide for Beginners
addythomson posted in Miscellaneous about 1 month ago
www.byteswire.com - Coming up with a desired domain name for your new website, the next imperative move is to ch... read more
Google Now takes a bite out of your privacy
webdesignerdepot posted in Miscellaneous about 1 month ago
www.webdesignerdepot.com - Google has always been the recipient of criticism that it wants to know more about its users... read more
Infographic: SEO Checklist 2015
orphicpixel posted in Miscellaneous about 1 month ago
www.coalesceideas.com - With the ever changing landscape of Digital and especially SEO in 2015 more than ever it is critical for businesses to understand what will benefit and what will ... read more
21 collaboration tools to streamline your teamwork
webdesignerdepot posted in Miscellaneous 2 months ago
www.webdesignerdepot.com - If you work with a team, then you may be struggling with the question of how to best collabo... read more
How Should Freelance Designers Increase Work Rates
bhupe1 posted in Miscellaneous 3 months ago
theneodesign.com - What's your first reaction when one says s(he) is working from home and is a full time freelancer? Wow lucky person, isn't it? Freelancing is the latest buzz as m... read more
The Journey Into Youtube
julioariverajr posted in Miscellaneous 8 months ago
www.underworldmagazines.com - Hey everyone I have great news! I'm moving into the Youtube space and will be making videos ... read more
I hate design…now what?
webdesignerdepot posted in Miscellaneous 8 months ago
www.webdesignerdepot.com - So you've been working as a designer for the past few years. You're good at it. You're succe... read more
The secret to Airbnb's successful rebrand
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www.webdesignerdepot.com - Unless you've been abstaining from social media this week, it can hardly have escaped your n... read more


text:
Phone 408-250-7607
Pacific Grove, CA
SAT PSAT and LSAT Prep Tutoring
My official scores on the new SAT (the SAT we have now) are 790, 800, 800 (total of 2390 out of 2400), all of which are well into the 99th percentile. I took the new SAT in 2009 in order to get recent scores and to get a score on the new test (old test was out of 1600 points).
Most people know very little about the SAT and PSAT, although most people know a student's SAT score counts at least as much as all four years of high school grades when it comes to the college admissions process. Some of what people think they know is actually incorrect. Probably the most surprising fact is that the math and writing sections of the SAT cover only a very limited range of topics. In fact, the vast majority of the math most high school students take, is not on the SAT. Nor do high school math classes cover all of the math that is on the SAT I.
Of course it would do your score no good to study that which is not even on the test. So although I may teach a couple of grammar rules or writing techniques that are important for college writing but are not found on the SAT, the vast majority of what I teach is on these tests. Of course, I also teach test-taking strategies, which are skills that will help on other standardized tests. Some of my test-taking strategies I learned from being a psychology major studying how psychologists devise tests.
My approach is both academic and psychological, and it works: I have helped kids get accepted into NYU and MIT, as well as Stanford and the UCs.
I offer my tutoring services to the students of Pacific Grove, CA 93950. While I meet most of my students in their homes, I can conduct tutoring in other locations, such as the Pacific Grove Library.
My email address is email@example.com
My cell is 408-250-7607
Pacific Grove Library website


text:
Evolutionary innovation in the vertebrate jaw: A derived morphology in anuran tadpoles and its possible developmental origin
Article first published online: 14 APR 2005
DOI: 10.1002/bies.20224
Copyright © 2005 Wiley Periodicals, Inc.
Volume 27, Issue 5, pages 526–532, May 2005
Additional Information
How to Cite
Svensson, M. E. and Haas, A. (2005), Evolutionary innovation in the vertebrate jaw: A derived morphology in anuran tadpoles and its possible developmental origin. Bioessays, 27: 526–532. doi: 10.1002/bies.20224
Publication History
- Issue published online: 14 APR 2005
- Article first published online: 14 APR 2005
- Abstract
- References
- Cited By
The mouthparts of anuran tadpoles are highly derived compared to those of caecilians or salamanders. The suprarostral cartilages support the tadpole's upper beak; the infrarostral cartilages support the lower beak. Both supra- and infrarostral cartilages are absent in other vertebrates. These differences reflect the evolutionary origin of a derived feeding mode in anuran tadpoles. We suggest that these unique cartilages stem from the evolution of new articulations within preexisting cartilages, rather than novel cartilage condensations. We propose testing this hypothesis through a search for similarities in the development of the suprarostral and infrarostral cartilage articulations and of the primary jaw joint. In Xenopus, the gene zax is expressed in a region corresponding to the infrarostral cartilage. This gene is related to the bapx1-gene, which regulates jaw joint development. Further investigation of these genes, as well as other genes with joint-related functions, in anuran craniofacial development may provide a connection between the morphological diversity seen in the vertebrate head and the corresponding diversity in genetic regulatory processes. We believe that the evolution of larval jaws in anurans may shed light on the general evolutionary mechanisms of how new articulations, not only in the jaw region, could have arisen in the vertebrate skull. BioEssays 27: 526–532, 2005. © 2005 Wiley periodicals, Inc.


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1 posters
1 groups
Mayhem reigns supreme in the animated kingdom as whiz kid Jimmy Neutron and Timmy from "The Fairly Oddparents" swap places in each other's worlds. Features include bonus episodes, three of "Jimmy Neutron" ("Crime Sheen Investigation," "Sleepless in Retroville" and "Maximum Hugh") and three of "The Fairly Oddparents" ("Cosmo Con," "Timvisible" and "The Switch Glitch").
© 2004 - 2015 The Internet Movie Poster Database | This page was executed in 0.75278 sec.


text:
Posted on: January 21, 2011 12:45 pm
If today were Selection Sunday
My seeds 1 - 4 would look like this:
1 Seeds
2 Seeds
3 Seeds
4 Seeds
Some Thoughts:
I think that San Diego State needs a quality win over BYU to have a better resume than the Top 4.
The last 4 seeds were nearly impossible to predict. Purdue is a slim way away from a 4 seed. They don't have as many quality wins as Illinois, but Illinois has that one really bad loss. Illinois got the edge for the wins.
Kentucky beat Washington head to head so that gives them the edge + the quality wins. Kentucky's loss to Alabama will hurt them come tournament time if they are relatively close matched with other teams (same with Illinois).
Pittsburgh resume is really good right now.
Duke is a really good team, that loss to FSU hurts, it isn't bad, but it isn't good either. They lack the quality wins that Cuse and Pitt have, and they are not undefeated like OSU and Kansas.
I did this fairly quickly so I may re-evaluate later.
Posted on: January 15, 2011 4:20 pm
Edited on: January 15, 2011 4:25 pm
10 Teams most likely to make it to the Final Four
Week 10
Category: NCAAB
Tags: Final Four, Kansas, OSUBuckeyeFan, UTEA
Posted on: January 9, 2011 2:21 pm
Edited on: January 9, 2011 2:29 pm
10 Teams most likely to make it to the Final Four
Week 9
Category: NCAAB
Tags: Final Four Rankings, OSUBuckeyeFan, UTEA
Posted on: December 21, 2010 1:06 pm
Edited on: December 21, 2010 3:25 pm
Testing 2
Thank you for voting! What an interesting week this became after a Tennessee loss to Oakland and and a Louisville loss to Drexel. It was supposed to be a down week in the excitement, and boy was that wrong. Stunning upsets every day, exciting games, and probably our most divided poll to date. This is what happens when kids have more then one thing on their mind on a hetic finals week. Merry Christmas to everyone and we'll see what this coming week has to offer. In case you missed this week or would like to take a look at the ballots, you can check them here.
1. (34) Duke (-)(10-0)
Votes -969, HR -1, LR -3, StDev -0.43, AP -1, Coaches -1, POM -1
Did not play. Smart kids, taking finals more important than game. – AlecRaenos
2. (4) Ohio St. (-)(10-0)
Votes -930, HR -1, LR -5, StDev -0.74, AP -2, Coaches -2, POM -3
Games Played this week:
Wed, Dec-15 Win Florida Gulf Coast (2-7) (83-55) Home
Sat, Dec-18 Win South Carolina (7-2) (79-57) Home
Draw a line below Ohio State; along with Duke they are in a whole 'nother class than the rest of College Basketball. Sullinger is a beast. – Lobofan2003
3. (1) Kansas (-)(10-0)
Votes -893, HR -1, LR -5, StDev -0.82, AP -3, Coaches -3, POM -2
Games Played this week:
Sat, Dec-18 Win Southern California (6-5) (70-68) Home
Games Played next week:
Wed, Dec-22, @ California
Squeeked by a USC team that lost at home to Rider by 20; everyone has bad games and they won theirs – OSUbeatMICHIGAN
4. Syracuse (+1)(11-0)
Votes -840, HR -2, LR -6, StDev -0.76, AP -5, Coaches -5, POM -14
Games Played this week:
Sat, Dec-18 Win Iona (7-4) (83-77) Home
As good as the Orange seem to be, they couldn't break loose from Iona this week. – wachoosay
5. Connecticut (+1)(8-0)
Votes -831, HR -3, LR -14, StDev -1.91, AP -4, Coaches -4, POM -27
As good as they are, do you think they could beat the women's team? – Marinoisgod
6. Pittsburgh (+2)(11-1)
Votes -732, HR -5, LR -15, StDev -2.22, AP -6, Coaches -6, POM -4
Games Played this week:
Sat, Dec-18 Win Maryland Eastern Shore (2-8) (97-64) Home
Rebounded after the loss to Tennessee and plastered Maryland-Eastern Shore. – AlecRaenos
7. San Diego St. (+2)(12-0)
Votes -723, HR -3, LR -13, StDev -1.83, AP -7, Coaches -7, POM -13
Games Played this week:
Mon, Dec-13 Win Cal Poly (3-7) (51-45) Home
Sat, Dec-18 Win UC Santa Barbara (5-4) (90-64) Home
Not sure they're this good, but I'll reward them for being undefeated – Paul4Cats
8. Georgetown (+5)(10-1)
Votes -659, HR -6, LR -21, StDev -2.77, AP -10, Coaches -9, POM -8
Games Played this week:
Sat, Dec-18 Win Loyola MD (4-6) (99-75) Home
I don't honestly believe that 5 of the nation's top ten teams have a home in the Big East...but right now it's hard to argue with the Hoyas resume, or any of the others up here. What a "down year" this conference is having! – pittbaster
9. Villanova (+3)(9-1)
Votes -647, HR -5, LR -NR, StDev -2.91, AP -8, Coaches -8, POM -21
Games Played this week:
Sat, Dec-18 Win Delaware (5-3) (78-59) Home
If there's such a thing as a "quiet" top ten team from a major league, Villanova is it this year. Folks seem to have forgotten about them since they lost that NIT championship game. They have scary-good guard play, as always, and that will keep them in most games. – pittbaster
10. Missouri (+5)(10-1)
Votes -541, HR -6, LR -NR, StDev -2.44, AP -9, Coaches -10, POM -31
Games Played this week:
Thu, Dec-16 Win Oral Roberts (4-6) (81-62) Home
Sat, Dec-18 Win Central Arkansas (3-8) (116-63) Home
Had seven players in double figures in their last game... good depth ... young team that is still learning how to play together for a full game – dmmizzou123
11. Kentucky (+5)(8-2)
Votes -497, HR -6, LR -NR, StDev -3.66, AP -13, Coaches -14, POM -6
Games Played this week:
Sat, Dec-18 Win Mississippi Valley St. (1-9) (85-60) Home
I'm calling this team Schrödinger's Cat(s). They seemingly exist in two states and you never know when you open the box whether you'll get a dead cats or the much more lively Cats – Logan Big Ears
12. Kansas St. (-5)(9-2)
Votes -459, HR -7, LR -NR, StDev -3.34, AP -11, Coaches -11, POM -28
Games Played this week:
Sat, Dec-18 Loss (18)Florida (8-3) (44-57) Semi-Away
One really bad half against Florida. One loss to Duke. Still a tough out for any team. - patriots9911
13. Purdue (+5)(10-1)
Votes -441, HR -8, LR -NR, StDev -3.52, AP -14, Coaches -13, POM -11
Games Played this week:
Sat, Dec-18 Win Indiana St. (5-6) (65-52) Neutral
Is this too high for them, maybe, but also a byproduct of teams above losing and wins are wins. – jhzak
14. Minnesota (+7)(10-1)
Votes -359, HR -8, LR -NR, StDev -3.87, AP -17, Coaches -16, POM -51
Games Played this week:
Wed, Dec-15 Win Akron (5-4) (66-58) Home
No real quality wins, so I hesitate to rank them too high. However, we'll know real soon whether they're for real. – OSUBuckeyeFan
15. Michigan St. (+5)(8-3)
Votes -355, HR -6, LR -NR, StDev -4.62, AP -12, Coaches -12, POM -15
Games Played this week:
Sat, Dec-18 Win Prairie View A&M (1-10) (90-51) Home
Gained a beat without Izzo on the bench as Summers found his shot and Lucas didn't turn the ball over. – SporTEmINd
16. Baylor (-6)(7-1)
Votes -341, HR -9, LR -NR, StDev -3.83, AP -15, Coaches -15, POM -7
Games Played this week:
Wed, Dec-15 Win Bethune Cookman (5-7) (83-39) Home
Sat, Dec-18 Loss Gonzaga (6-5) (64-68) Semi-Home
First game against good team was a lost. Had to drop them a long way. – concrete man
17. Memphis (+2)(8-1)
Votes -281, HR -10, LR -NR, StDev -4.58, AP -16, Coaches -17, POM -36
Games Played this week:
Thu, Dec-16 Win Austin Peay (7-6) (70-68) Home
What have you done for me lately? – gezemice
18. Florida (+11)(8-2)
Votes -267, HR -9, LR -NR, StDev -3.99, AP -20, Coaches -19, POM -16
Games Played this week:
Sat, Dec-18 Win (12)Kansas St. (9-2) (57-44) Semi-Home
Shellacked Kansas State - proving the pre-season hype was warranted. With Central Florida moving into most polls, their losses are downright respectable – gezemice
19. Notre Dame (+4)(10-1)
Votes -262, HR -12, LR -NR, StDev -3.66, AP -22, Coaches -20, POM -39
Games Played this week:
Sun, Dec-19 Win Stony Brook (4-6) (88-62) Home
Still tough at home. We'll see how they do away from home once conference play starts. – patriots9911
20. Brigham Young (-6)(10-1)
Votes -249, HR -7, LR -NR, StDev -4.46, AP -23, Coaches -23, POM -10
Games Played this week:
Sat, Dec-18 Loss UCLA (6-4) (79-86) Semi-Away
Loss to UCLA may sting a little. – jasonwells1982
21. Texas (+3)(9-2)
Votes -233, HR -13, LR -NR, StDev -2.88, AP -18, Coaches -22, POM -22
Games Played this week:
Tue, Dec-14 Win North Florida (4-7) (70-48) Home
Sat, Dec-18 Win North Carolina (7-4) (78-76) Semi-Away
Good team - not great - but a character building win over the Tar Heels this week! – Pels
22. Central Florida (+5)(10-0)
Votes -208, HR -11, LR -NR, StDev -4.38, AP -24, Coaches -, POM -35
Games Played this week:
Wed, Dec-15 Win Louisiana Lafayette (2-8) (79-58) Home
Sat, Dec-18 Win Miami FL (7-3) (84-78) Away
9-0 with a win over Florida deserves some respect. – nekco
23. Texas A&M (+2)(10-1)
Votes -187, HR -11, LR -NR, StDev -2.87, AP -25, Coaches -24, POM -29
Games Played this week:
Sat, Dec-18 Win Arkansas (7-2) (71-62) Neutral
There D keeps them in every game and they've made good decisions at the ends of games. – Marionisgod
24. Illinois (-13)(10-2)
Votes -166, HR -13, LR -NR, StDev -3.52, AP -21, Coaches -21, POM -20
Games Played this week:
Sat, Dec-18 Loss Illinois Chicago (5-7) (54-57) Neutral
Hands up if you had heard of anyone on Illinois-Chicago's roster? Hell, hands up if you had heard of Illinois-Chicago... anyone? – canuck23
25. Tennessee (-21)(7-2)
Votes -146, HR -11, LR -NR, StDev -3.97, AP -19, Coaches -18, POM -26
Games Played this week:
Tue, Dec-14 Loss Oakland (6-6) (82-89) Home
Fri, Dec-17 Loss Charlotte (5-6) (48-49) Away
Oakland? Okay. Charlotte? Really? – cuse1788
Others Receiving Votes: Temple(84), Louisville(64), Wisconsin(55), West Virginia(40), Vanderbilt(40), Boston College(32), Cincinnati(31), Washington St.(23), Oklahoma St.(13), Xavier(12), Old Dominion(12), Washington(11), Nevada Las Vegas(9), Arizona(7), Drexel(7), Florida St.(6), Utah St.(4), Wichita St.(3), Northwestern(2), Cleveland St.(2), St. Mary's(2)
Dropped From Rankings: Louisville(17), Nevada Las Vegas(22)
New this week: Florida(18), Central Florida(22)
Biggest jumps: Florida(+11), Minnesota(+7), Georgetown(+5), Missouri(+5), Purdue(+5), Kentucky(+5), Michigan St.(+5), Central Florida(+5), Notre Dame(+4)
Biggest drops: Tennessee(-21), Nevada Las Vegas(-16), Illinois(-13), Louisville(-10), Brigham Young(-6), Baylor(-6), Kansas St.(-5)
What it all means: Rank. (First Place Votes) Team (Change since last week) (Wins-Losses), Votes , HR -Highest Rank, LR -Lowest Rank, STDev -Standard Deviation, AP -AP rank, Coaches -Coaches poll rank, Pom -Pomeroy rank. Games played this week.
Standard Deviation measures how varied the votes are for that team. The higher it is, the more disagreement is between voters on the placement.
What!?! How can ____ not be ranked! Or how did ____ get a first place vote? Click here to check out TPP Poll Attacks!
Click here to check out this weeks People's Pollspeak.
We had 39 voters this week. Thank you for all who voted!
Posted on: March 20, 2010 11:50 am
Saturday Round 2 Predictions
There are some interesting matchups today but i don't see there being many upsets. There were so many upsets in the first round they're are plenty of uneven matchups.
Here are my predictions for today:
#2 Villanova 82 over #10 St. Mary's 78
#5 Butler 65 over #13 Murray State 57
#6 Tennessee 76 over #14 Ohio 73
#1 Kansas 84 over #9 Northern Iowa 72
#3 Baylor 56 over #11 Old Dominion 43
#3 New Mexico 79 over #11 Washington 77
#2 Kansas State 68 over #7 Brigham Young 61
#1 Kentucky 74 over #9 Wake Forest 70
Category: NCAAB
Tags: Matchups, Predictions, Upsets
Posted on: March 20, 2010 11:38 am
Upset Meter Round One
This year we had plenty of Thursday upsets. We had 7 Thursday upsets and 3 Friday upsets.
Round 1 Upsets:
Old Dominion (11) over Notre Dame (6)
Murray State (13) over Vanderbilt (4)
St. Mary's (10) over Richmond (7)
Northern Iowa (9) over UNLV (8)
Washington (11) over Marquette (6)
Ohio (14) over Georgetown (3)
Wake Forest (9) over Texas (8)
Cornell (12) over Temple (5)
Missouri (10) over Clemson (7)
Georgia Tech (10) over Oklahoma State (7)
Last year we also had 10 upsets in the first round. The year before that we had 8.
There were only 1 round 2 upsets last year.
With teams on the rise we could easily see plenty of upsets today and tomorrow.
Will the Upset Meter continue to rise the next two days? We'll see.
Category: NCAAB
Tags: Round 1, Upset Meter, Upsets
Posted on: March 14, 2010 3:54 pm
Edited on: March 14, 2010 4:12 pm
Selection Sunday Bracketology (1 Game Remaining)
8) Marquette vs. 9) California
5) Vanderbilt vs. 12) Virginia Tech
4) Purdue vs. 13) Houston
6) Richmond vs. 11) Utah State
3) New Mexico vs. 14) Ohio
7) Oklahoma State vs. 10) Saint Mary's
2) West Virginia vs. 15) UC Santa Barbara
8) Missouri vs. 9) Louisville
4) Temple vs. 13) Oakland
6) Butler vs. 11) Georgia Tech
3) Baylor vs. 14) Wofford
7) Xavier vs. 10) Cornell
2) Georgetown vs. 15) Vermont
8) Northern Iowa vs. 9) UTEP
5) Maryland vs. 12) Siena
4) Villanova vs. 13) Murray State
6) Brigham Young vs. 11) Washington
3) Pittsburgh vs. 14) North Texas
7) Texas vs. 10) Clemson
2) Ohio State vs. 15) Montana
8) UNLV vs. Florida State
5) Texas A&M vs. 12) Mississippi State
4) Tennessee vs. 13) New Mexico State
6) Gonzaga vs. 11) San Diego State
3) Wisconsin vs. 14) Sam Houston State
7) Notre Dame vs. 10) Old Dominion
2) Kansas State vs. 15) Morgan State
Last 4 IN: Utah State, Wake Forest, Mississippi State, Virginia Tech
First 4 OUT: Florida, Minnesota, Illinois, Rhode Island
Category: NCAAB
Tags: Bracketology, East, Midwest, Selection Sunday, South, West
Posted on: March 13, 2010 10:30 pm
Edited on: March 13, 2010 10:30 pm
3/13/10 PM Bracketology
I don't have time to have all of the locations, so I'm going to settle with just putting East, Midwest, South, and West! Please comment and have suggestions to fix things or if i missed a game or something along those lines. Remember im new to this! :)
Category: NCAAB
Tags: Bracketology, Duke, East, First Four Out, Kansas, Kentucky, Last 3 in, Midwest, Next Team Out, South, Syracuse, West


text:
A bump shear test is disclosed for evaluating the mechanical integrity of low-k interconnect stacks in an integrated circuit which includes a die test structure (11) having a stiff structural component (501, 502) positioned above and affixed to a conductive metal pad (103) formed in a last metal layer (104). The die test structure (11) may also include a dedicated support structure (41) below the conductive metal pad which includes a predetermined pattern of metal lines formed in the interconnect layers (18, 22, 26). After mounting the integrated circuit in a test device, a shear knife (601) is positioned for lateral movement to cause the shear knife to contact the stiff structural component (501). Any damage to the die test structure caused by the lateral movement of the shear knife may be assessed to evaluate the mechanical integrity of the interconnect stack.
1. A bump shear testing method for evaluating a semiconductor structure for mechanical integrity, comprising:
providing a semiconductor structure, said semiconductor structure comprising a die test structure having a stiff structural component positioned above and affixed to a conductive metal pad formed in a last metal layer and a dedicated test support structure underlying the conductive metal pad;
moving the shear knife laterally in relation to the semiconductor structure to cause the shear knife to contact the stiff structural component during lateral movement of the shear knife; and
assessing any damage to the die test structure caused by the lateral movement of the shear knife to evaluate the mechanical integrity of one or more interconnect layers in the dedicated test support structure of the semiconductor structure.
2. The bump shear testing method of
3. The bump shear testing method of
4. The bump shear testing method of
5. The bump shear testing method of
6. The bump shear testing method of
7. The bump shear testing method of
8. The bump shear testing method of
9. The bump shear testing method of
10. The bump shear testing method of
11. A method of testing a mechanical integrity measure of a low-k interconnect stack, the method comprising:
fabricating a semiconductor structure with a test structure comprising:
a stiff structural component affixed over a conductive metal pad formed in an upper layer of a low-k interconnect stack, and
a dedicated support structure below the conductive metal pad comprising a predetermined pattern of metal lines formed in the low-k interconnect stack;
performing a bump shear test on the test structure by aiming a shear knife at the stiff structural component; and
assessing a mechanical integrity measure for the low-k interconnect stack by determining whether the low-k interconnect stack passes the bump shear test.
12. The method of
13. The method of
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17. The method of
1. Field of the Invention
The present invention is directed in general to the field of semiconductor devices. In one aspect, the present invention relates to a test structure for testing integrated circuits.
2. Description of the Related Art
The use of conductive balls, such as solder balls, to make electrical connection to a bond pad is a known method to make electrical connection to electrical circuitry of a semiconductor die. Conductive ball packaging is one type of semiconductor packaging known in the industry as flip chip interconnection. As geometries in semiconductors continue to shrink in size due to improvements in the technology for making semiconductors, the sizes of bond pad regions have become smaller, resulting in increased stress to the bond pad structure when physical connection is made to the semiconductor die. Additional mechanical integrity problems are created by the interconnect structures used with the manufacturing smaller geometry semiconductors. For example, bond pad structures fabricated with copper interconnect metallization and low dielectric constant (low-k) dielectrics are susceptible to mechanical damage during the bonding process, due to the lower Young's modulus and lower fracture toughness of such materials. As a result, the underlying stack of metal and dielectric layers in such bond pad structures may mechanically fracture more easily or otherwise be subject to mismatch stresses (such as generated during die attach process).
To detect such device defects, a variety of techniques have been proposed for characterizing the properties and the integration capability of these films, such as nano-indentation and four-point bend delamination tests for mechanical and adhesion properties, and die pull tests and thermal cycling tests for characterizing the behavior of low-k films in a flip chip package. However, these tests have one or more drawbacks in failing to quickly and reliably provide feedback on the quality of the mechanical integration of the back end of the line (BEOL) structures.
Accordingly, there is a need for improved semiconductor processes and devices to overcome the problems in the art, such as outlined above. Further limitations and disadvantages of conventional processes and technologies will become apparent to one of skill in the art after reviewing the remainder of the present application with reference to the drawings and detailed description which follow.
The present invention may be understood, and its numerous objects, features and advantages obtained, when the following detailed description of a preferred embodiment is considered in conjunction with the following drawings, in which:
It will be appreciated that for simplicity and clarity of illustration, elements illustrated in the drawings have not necessarily been drawn to scale. For example, the dimensions of some of the elements are exaggerated relative to other elements for purposes of promoting and improving clarity and understanding. Further, where considered appropriate, reference numerals have been repeated among the drawings to represent corresponding or analogous elements.
A method and apparatus are described for effectively evaluating the integration quality of integrated circuits formed with low dielectric constant (low-k) materials before die packaging occurs, such as by using an improved bond pad structure as a mechanical test feature to provide location-specific integration quality data on one or more locations on a single die. Various details are set forth in the following description, but it will be appreciated that the present invention may be practiced without these specific details, and that numerous implementation-specific decisions may be made to the invention described herein to achieve the device designer's specific goals, such as compliance with process technology or design-related constraints, which will vary from one implementation to another. While such a development effort might be complex and time-consuming, it would nevertheless be a routine undertaking for those of ordinary skill in the art having the benefit of this disclosure. For example, selected aspects are depicted with reference to simplified cross sectional drawings of a semiconductor device without including every device feature or geometry in order to avoid obscuring the present invention. Such descriptions and representations are used by those skilled in the art to describe and convey the substance of their work to others skilled in the art. While various illustrative embodiments of the present invention will now be described in detail with reference to
While the mechanical test procedures of the present invention may be used to evaluate the mechanical integrity of any integrated circuit structure, the procedures are especially useful for testing structures that are fabricated with low-k dielectrics. For example, low-k interconnect stacks are formed below a metal interconnect pad that is placed at the surface of an integrated circuit where an electrical connection is made from the pad to one or more underlying interconnect layers. In a typical integrated circuit design, multiple interconnect layers separated by interlayer dielectrics are formed in a stack to provide the required interconnections between devices in the semiconductor substrate. Examples of an interconnect pad include, but are not limited to, a wire bond pad, a probe pad, a flip-chip bump pad, a test point or other packaging or test pad structures that may require underlying structural support. Because the advanced low-k interlayer dielectrics used today have a lower dielectric constant and lower Young's modulus than dielectrics used in earlier generation products, integrated circuit structures may more easily mechanically fracture the underlying stack of metal and dielectric layers. As will be appreciated, a low modulus material is a material having a value typically less than sixty GPa (Giga-Pascals), and a low-k material is a material having a relative permittivity or dielectric constant typically less than four. It should be noted that many of the low-k dielectrics in use have low moduli. The use herein of a high modulus material is a material having a value typically equal to or greater than sixty GPa (Giga-Pascals). Dielectrics having any modulus value may be used in connection with the methods and structures described herein.
In a selected embodiment, the mechanical integrity of back end of the line (BEOL) structures (including but not limited to low-k structures) may be evaluated using an improved bump shear test. Under the test, a die test structure is provided that includes a rigid or stiff structural component, such as a bond pad structure which includes a solder bump with a tall stud (or the stud alone) as part of the under bump metallization (UBM). The die test structure is used, alone or in combination with a dedicated support structure formed with a predetermined layout pattern of metallization and dielectric in the interconnect stack underlying the pad, to form an improved mechanical test structure and methodology. By setting the parameters of the shear process (such as the shear knife speed, height, etc.) so that the shear knife is aimed at the rigid or stiff structural component that is effectively integrated with the underlying support structure, the bump shear test can provide detailed and accurate information about the integration robustness on almost any location on a die. Once the bump shear test procedures are calibrated, the load curve and maximum load recorded on the bump shear system may be analyzed to characterize the material properties of the low-k material and/or the quality of the BEOL integration. In addition, by using predetermined layout patterns in the metallization and dielectric stack underlying the pad, a uniform mechanical test structure may be formed in each die and in different wafers so that meaningful comparisons may be made of test results across different die and different wafers.
The die test structure 11 embodiment depicted in
In the illustrated embodiment, the conductive solder ball 502 is solder but may be other electrically conductive materials, including various metal alloys. Layer 501 may be formed of a high modulus material, such as copper. Layer 105 may also be optionally provided as a metal cap layer comprised of aluminum (Al) or an alloy thereof, copper (Cu) or an alloy thereof, or a composite of a thin aluminum layer formed on a thinner tantalum layer. Layer 103 (in the last metal layer) may be optionally provided as a conductive bond pad formed of aluminum (Al), copper (Cu), or the like. However, it should be well understood that various metals may be used with the structure described herein.
As for the under bump metallization layer 200, various metal layers or composite metal layers may be used, including but not limited to a sputtered and electroplated copper layer formed over a sputtered titanium tungsten (TiW) layer, a NiAu bump layer, a Cr/CrCu bump layer, or the like. For example, the under bump metallization layer 200 may be optionally provided as a composite metal layer comprising a metal layer 201 (disposed to contact the exposed portion of layer 105), a metal layer 202 (disposed or deposited over layer 201), and a metal layer 203 (disposed or deposited over layer 202). Layers 201 and 202 may serve as barrier layers, and layer 203 may serve as a seed layer for a subsequent plating step. All of layers 201, 202, and 203 can be sequentially sputtered in-situ to thicknesses of approximately seventy nanometers (nm), approximately two hundred nm, and approximately five hundred nm, respectively. As an example, layer 201 may be formed of a thin layer of titanium tungsten (TiW), layer 202 may be formed of a thin layer of copper and layer 203 may be formed of a solderable metal comprised of copper. For example, a first layer 201 of TiW is sputtered to a first thickness (e.g., 230 nm), then a second layer 202 of Cu is applied to a second thickness (e.g., 530 nm). Next, a layer of photoresist is applied at a third thickness (30 um), is patterned to form an opening (e.g., with dimensions of 75 um by 80 um), and a layer of copper is plated to a fourth thickness (e.g., 18 um).
Insulating layers adjacent to the test bump structure 21 are used for passivation of the underlying metal in the last interconnect layer 104. For example, a passivation layer 301 may be formed by depositing Si3N4 or SiON over selected portions of the dielectric (e.g., TEOS) in the last interconnect layer 104 and the bonding pad 103, and then forming an opening or hole in the passivation layer 301 through which electrical and physical contact may be made with the bonding pad 103 (such as by using a metal cap layer 105). An additional passivation layer 302 may optionally be formed of a polyimide layer (to provide a stress buffer) or other passivation materials (such as Si3N4 or SiON) over selected portions of the first passivation layer 301 and metal cap layer 105, thereby forming an opening or hole through which the under bump metallization layer 200 makes electrical and physical contact with the metal cap layer 105.
The test bump structures described thus far may be placed at any interconnect pad site including active circuit contact pads or specially designated test pad locations. The test bump structures described herein provide an advantage over conventional bump shear tests which apply a shear pin or knife to conventional solder balls which are formed of soft tin/lead solder material. Using a stiff bump/stud shear test provides more accurate information about the underlying integration and can be done on any designated location on the die. Also, a stiff bump/stud can apply higher a stress distribution in the BEOL layers on the die than any other test method.
While bump shear testing may be improved by using a stiff bump/stud shear test structure, test bump structures fabricated with copper interconnect metallization and low dielectric constant (low-k) dielectrics are susceptible to differing rates of mechanical fracture that result from the use of low-k interlayer dielectrics that have a lower Young's modulus and lower fracture toughness. The metal density within the area defined by 64 can be different from the area outside of 64. In particular, it will be appreciated that the metal line density of a typical integrated circuit (such as that exemplified by the structure outside of the support structure region 64) varies randomly, depending on the circuit design layout. Density variations are depicted in
Accordingly, selected embodiments of the present invention provide an improved bump shear test by including a dedicated support structure 41 as part of (or below) the test structure 21, thereby improving the overall toughness and strength of a die test structure 11 formed over a low-k stack. By providing each wafer or wafer die with test bump structure that includes a dedicated support structure 41 having a predetermined metal density or amount of metal present in the interconnect layers below the test bump structure 21, bump shear testing on the different wafers or wafer die can be used to meaningfully compare and evaluate the different wafers or wafer die. As will be appreciated, the predetermined metal density may be determined with reference to the amount of metal in the interconnect layers 18, 22, 26, but may also take into account the amount of metal or other via materials in the via layers 16, 20, 24. In addition to evaluating mechanical integrity, shear strength tests can also be used to differentiate high yielding die from low yielding die, as well as edge die versus center die, or failing die versus passing die.
As for the lateral extent of the support structure 41, a stress boundary 64 defines a force region spanning the portion of the integrated circuit directly underlying the conductive bond pad 103 and extending laterally a limited distance. The force region is a region within the integrated circuit 100 in which forces are exerted on the interconnect layers when a bump shear test is performed on the test bump structure 21. The stress boundary 64 defines where the stress from the bump shear test is determined to be at or about zero. While the shape and contour of the force region may be arbitrarily defined, depending upon device technology and geometries, in an exemplary embodiment involving a square conductive pad 103 having lateral dimensions of 75�75 microns, the stress boundary 64 defines a cubic force region having lateral dimensions of 140�140 microns centered about the conductive pad 103. Alternatively, the lateral area of the stress boundary 64 may be defined as a ratio of the pad area to the stress boundary area (e.g., Pad Area/Stress Boundary Area=0.287). The lateral extent of the stress boundary is advantageously used to locate the die test structure of the present invention on a wafer die so that any mechanical fracture resulting from a bump shear test does not impair the remaining circuit functionality.
Whatever the size of the force region, it will be appreciated that the predetermined pattern of metal layers 1, 2, 3 in the support structure 41 may require, in some embodiments, that the support structure 41 be mechanically, functionally and/or electrically independent of the remaining circuit. In various embodiments, the metal layers 1, 2, 3 in the interconnect layers 18, 22, 26 are electrically independent of the remaining circuitry or are electrically grounded. While this feature means that space on an integrated circuit is used for nonfunctioning interconnect layers, the resulting bump shear test benefits obtained from the improved die test structure 11 outweigh any drawback from having unused integrated circuit space.
An example will now be described of how the die test structure 11 may be used in a bump shear test. When the shear knife 601 is applied or moved laterally against the die test structure 11 so as to intersect with the stiff structural component of the die test structure (e.g., the stud 501), increased stress is translated into the die. This increases the likelihood of inducing fracture in the weak interface/film in the die, as compared to conventional bump shear tests, thereby providing a better test for the mechanical integrity of the underlying interconnect layers. For example, if a solder bump 502 is formed with an 18 μm Cu stud 501 attached to the UBM 200, a shear knife 601 applied at a height of 5 μm will apply its force directly through the Cu stud 501 and into the interconnect layers. In contrast, a shear knife that is applied at a height of 20 μm will bypass the Cu stud 501 and its force will primarily be applied to the softer solder ball 502. By providing a die test structure 11 with a stiff structural component (e.g., a copper stud or other material having a modulus meeting or exceeding substantially sixty GPa), a bump shear test that aims the shear knife at the stiff structural component will translate the stress from the shear knife into the die to cause inter- or intra-film fracture, thereby providing much meaningful information about the integration of the die interconnect stack.
By also including a structural support 41 formed from a predetermined pattern of metal lines in each die test structure 11, mechanical die integrity test results from one wafer may be meaningfully compared with mechanical die integrity test results from another wafer. This structural support 41 accomplishes two things to make this possible. First, the provision of a uniform structural support 41 in the interconnect layers fabricated with copper interconnect metallization and low modulus dielectrics allows a target or baseline level of metal density (e.g., 40%) and strength to be established in each die test structure. Second, when the die test structures in a plurality of wafers or wafer die formed with a shared, predetermined metal line pattern, an apples-to-apples comparison can be made on bump shear tests of the plurality of die test structures.
By positioning the height of the stiff structural component of any test bump (or stud) and the height of the shear knife for direct impact during bump shear testing, the overall toughness and adhesion of the low-k interconnect stack, as well as other qualitative measures of the integrated circuit, may be measured. In a selected embodiment, the stiff metal studs (with or without solder) should be at least 5 um tall to facilitate bump shear testing. By including a stiff structural bump component that is affixed to the UBM and by appropriately defining the metal density of the underlying support structure (e.g., at forty percent per metal layer), a passing bump shear test result should only cause the portion of the bump above the UBM to fail during the shear test. If any fracture below the UBM layer happens, then it indicates a low-k BEOL failure, which is considered as not a good die. Alternatively, if the bump shear test removes all or part of the solder ball (or stud) or the UBM and nothing more, then the test indicates that the die is a �good die.�
In addition, by providing multiple die with the same test bump and support structure and then performing bump shear tests, the differences in maximum load and characteristics of the load curves may be used to evaluate and compare the multiple die in terms of mechanical integrity, yield and other qualitative measures. In particular, the disclosed bump shear test structure and methodology may be used to monitor the under pad low-k BEOL fracture toughness, the quality of adhesion in low-k interconnect layers, variations in dielectric material strength, integration and layout weaknesses, or processing defects that are not detectable during processing (such as uniformity of layer porosity). Thus, the disclosed test structure and method is ideal for packaging development and monitoring product quality, especially for devices with low-k dielectric materials that are sensitive to the variance in dielectric material properties AND the quality of the integration. This makes it possible to provide rapid feedback to the die manufacturing facility without running time-consuming package tests and qualifications. Alternatively, the disclosed test structure and method can be used to evaluate non-low-k devices.
In addition to the die test structure and parallel-type support structure depicted in
Another embodiment of the present invention is illustrated in
It will be appreciated that any combination of the test bump structures and predetermined support structures described herein may be use to obtain the advantages of the present invention. For example and with reference to
Whatever die test structure configuration is used, a selected embodiment of the present invention provides a test pad guard structure or ring around the die test structure to protect the die from any fracture damage caused during a bump shear test. An example embodiment is illustrated in
In the cross-sectional view of
Although not required for purpose of a test structure, vias between metal layers (LM, LM-1, LM-2, . . . ) can be placed in the underlying support structure 44 to connect the metal lines to the substrate 102 for purposes of avoiding electrical discharging during subsequent processing. Alternatively, contact to the substrate 102 could be made by connecting one end of the metal lines to the guard structure that connects to the substrate 102. In the case of electrical connection to ground or substrate, it is recommended that the vias be placed at an edge of the support structure 44. If placement of vias within support structure 44 is done, the increase in the complexity of the structure increases the complexity of identifying a failure mode. In practice, few functional devices have via metal densities greater than 20%, and therefore the dielectric and metal properties dominate the robustness of the area under a bond pad. Consequently, a structure with no vias may be the most straight forward way to identify a good die from a bad die.
The dedicated die test structure disclosed herein may advantageously be incorporated at any desired location on a wafer, including on a functional die or a wafer die scribe, street or any desired location on the wafer, even if there is no functional integrated circuitry at that location. For example, rather than using active contact bumps for bump shear testing, the die test structures of the present invention may be used as dedicated test bump locations on a functional die to provide a mechanical test feature for each die. This is illustrated in
When one or more test bumps (or studs) are placed on a die, the placement of each test bump may be determined with reference to the force region for that test bump. For example, a stress boundary 58 for a first test bump 53 defines the force region for that test bump, and is used to place the test bump 53 away from any other circuitry in the die 50 so that any mechanical fracture caused by a bump shear test of the test bump 53 does not affect the remainder of the die circuitry. In addition or in the alternative, a guard structure or ring may be used to physically isolate the test bumps. While an independent guard ring (e.g., guard ring 54) may be formed around a test bump (e.g., test bump 51), the die protection function may also be achieved by tying a guard structure 56 to an existing fracture-prevention structure in the die, such as the moisture/metal diffusion barrier 52 formed about the periphery of the die 50. This implementation is illustrated at test bump 55, where the guard structure 56, in combination with the edge seal 52 (which acts as a diffusion barrier and crack stop), protects the remainder of the die from any mechanical fracture induced during bump shear testing of the test bump 55.
When more than one die test structure is included on a die or a wafer, the number of variance tests per die or wafer may be increased. In a selected embodiment, between one and four die test structures are included on each die for use in performing in-line integrity monitoring. By providing each die test structure with a different support structure that is designed to approximate a different interconnect region on the die, the bump shear tests may effectively evaluate the mechanical integrity of the different interconnect regions. As an example, the four corner die test structures on each die can thus serve as the equivalent of several hundred conventional die tests that use die pull or other full die test techniques.
Whether used to evaluate wafers, wafer die, or different locations on a wafer die, the mechanical integrity test methodology of the present invention provides a way to distinguish dielectric material differences, to detect structure differences and to find interface or interconnect weaknesses at the bond pad scale of a die.
The description of the illustrative methodologies for performing bump shear testing with a stiff die test structure can begin at step 630, where the die test structure is designed for fabrication on one or more die. The design step 630 may include specifying one or more design parameters, such as defining a force region 631, specifying a solder ball/stud structure 632, defining a metallization pattern for the interconnect layers in the support structure 633 and/or defining a guard structure or ring for the die test structure 634. In an example embodiment, the die test structure is defined to include a copper stud (with a diameter of 80 μm and a height of at least 5 μm) formed over a copper bond pad (75 μm�75 μm) with an orthogonal-type support structure in one or more of the interconnect layers.
Once a die test structure is fabricated in a die, a bump shear test may be performed on the die test structure (step 640). In order to obtain meaningful results, the shear knife should be positioned to intersect with the stiff structural component of the die test structure. In other words, the shear knife should be aimed at the stud. In this way, the mechanical integrity of the underlying support layers may be evaluated since this approach applies the lateral force from the shear knife to the support layers instead of primarily impacting only the softer solder ball material.
In accordance with various embodiments of the present invention, the bump shear test on the die test structure may be performed on the wafer prior to singulation of the wafer into individual die and prior to encapsulation or packaging. In addition, the bump shear test may be performed on a test structure located on a �dummy� die that has no functioning integrated circuitry, thereby providing data on the mechanical integrity of the stack on the dummy die which would be representative of functional die. Similarly, the bump shear test may be performed on a test structure that is located in a scribe area of a wafer, thereby providing test results without sacrificing functioning die.
Next, the bump shear test results are assessed at step 650. This may be done with a visual inspection of the die test structure to see which layers were fractured by the bump shear test. For example, if only the solder ball and/or copper stud are removed or sheared by the test, then the underlying support structures have the desired mechanical integrity, and the die passes 680 (affirmative outcome to decision 660). However, if any part of the underlying support structure (or even the copper bond pad or metal cap layer) is fractured by the bump shear test, then the underlying support structures does not have the desired mechanical integrity, and the die fails 670 (negative outcome to decision 660). The bump shear test may the performed on the next die (step 690).
The bump shear test results may also be assessed at step 650 by comparing the bump shear test results with the load curve and maximum load recorded in a database of bump shear measurements to qualitatively characterize the material properties of the underlying support layers, which may be formed from low-k materials. If the test result passes the comparison analysis (affirmative outcome to decision 660), then the die passes 680. Otherwise (negative outcome to decision 660), the die fails 670.
By now it should be appreciated that there has been provided a bump shear technique, die test structure and predetermined support structure for providing structural support during bump shear test operations. In one form, there is provided herein a bump shear test for evaluating the mechanical integrity of interconnect layers in an integrated circuit for mechanical integrity. First, an integrated circuit having a die test structure is mounted on a test device. As fabricated, the die test structure includes a stiff structural component positioned above and affixed to a conductive metal pad formed in a last metal layer. In various embodiments, the die test structure is formed as a solder ball formed with a high modulus material (such as lead-free solder), as a solder ball containing a high modulus stud, or as a stud formed with a high modulus material such as copper, tantalum, tungsten or chromium. In addition, the die test structure may include a dedicated support structure that is formed with a plurality of low-k dielectric layers in a force region below the conductive metal pad. The support structure may be formed as a predetermined pattern (e.g., parallel, orthogonal or random) of metal lines formed in one or more interconnect layers in the integrated circuit. The integrated circuit may also include a guard structure disposed in the interconnect layers and outside of a force region to protect the integrated circuit from any fractures in the die test structure. By positioning and laterally moving the shear knife laterally in relation to the integrated circuit, the shear knife contacts the stiff structural component. Any resulting damage to the die test structure caused by the lateral movement of the shear knife is assessed to evaluate the mechanical integrity of the interconnect layers.
In another form, a testing method is provided for measuring the mechanical integrity of an integrated circuit formed with a low-k interconnect stack. First, an integrated circuit is fabricated with a die test structure that includes a stiff structural component affixed over a conductive metal pad formed in an upper layer of the low-k interconnect stack. As fabricated, the stiff structural component may be formed as a solder bump and an internal stud structure formed of a stiff material, as a stud structure alone or as a solder bump formed of a high modulus material. In addition, the die test structure may include a dedicated support structure formed with a predetermined layout pattern of metallization and dielectric in the interconnect stack underlying and affixed to the conductive metal pad. After fabricating the integrated circuit, a bump shear test is performed on the die test structure by aiming a shear knife at the stiff structural component. The mechanical integrity of the integrated circuit is then assessed to determine whether the integrated circuit passes the bump shear test. If only the stiff structural component is removed or sheared by the test, then the underlying support structures in the integrated circuit have the desired mechanical integrity, and the die passes. However, if any part of the underlying support structure is fractured by the bump shear test, then the underlying support structures does not have the desired mechanical integrity, and the die fails.
In yet another form, an integrated circuit structure and fabrication method is provided for forming a die test structure over a substrate. First, a low-k interconnect stack is formed over the substrate, where the low-k interconnect stack includes a dedicated support structure having a predetermined pattern of metal lines in a plurality of interconnect layers. A bond pad is then formed in a last metal layer of the low-k interconnect stack, and one or more under bump metallization layers formed over and attached to the bond pad. Finally, a copper stud is formed over and attached to the under bump metallization layer, where the height of the copper stud is selected to contact a shear knife during a bump shear test. The die test structure may also include a test pad guard structure formed around at least part of the die test structure to protect the integrated circuit from any fracture damage caused during a bump shear test.
Those skilled in semiconductor fabrication will appreciate that additional, conventional processing steps (not depicted) are performed as part of the fabrication of each die. As examples, transistors may be formed with various gate electrode formation, extension implant, halo implant, spacer formation, and source/drain implant steps may be performed to complete the transistors. In addition, conventional backend processing (not depicted) typically including multiple levels of interconnect is then required to connect the transistors in a desired manner to achieve the desired functionality.
Although the described exemplary embodiments disclosed herein are directed to various semiconductor device structures and methods for making same, the present invention is not necessarily limited to the example embodiments which illustrate inventive aspects of the present invention that are applicable to a wide variety of semiconductor processes and/or devices. Thus, the particular embodiments disclosed above are illustrative only and should not be taken as limitations upon the present invention, as the invention may be modified and practiced in different but equivalent manners apparent to those skilled in the art having the benefit of the teachings herein. Accordingly, the foregoing description is not intended to limit the invention to the particular form set forth, but on the contrary, is intended to cover such alternatives, modifications and equivalents as may be included within the spirit and scope of the invention as defined by the appended claims so that those skilled in the art should understand that they can make various changes, substitutions and alterations without departing from the spirit and scope of the invention in its broadest form.
Benefits, other advantages, and solutions to problems have been described above with regard to specific embodiments. However, the benefits, advantages, solutions to problems, and any element(s) that may cause any benefit, advantage, or solution to occur or become more pronounced are not to be construed as a critical, required, or essential feature or element of any or all the claims. As used herein, the terms �comprises,� �comprising,� or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
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