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Bees have five eyes, two of which are made up of over six thousand hexagonally shaped lenses each, giving them what must be god-like vision that makes that of mere mortals pale by comparison.
The ability to see, to regard on multiple levels of dimension is the gift and promise if of using a depth psychological lens to understand ourselves and our relation to the world around us. Depth Psychology encompasses Jungian Psychology, developed around the theories of one of the pioneers of Depth Psychology, Swiss psychiatrist C.G. Jung.
Depth Insights is the publisher of the semi-annual scholarly e-zine of the same name and offers media, education, and consulting to help individuals and organizations see through, beneath, between, and beyond to achieve new perspectives for learning, integration, transformation, and growth.
3-Webinar Series: "Conversations between a Psychologist and a Poet: The Healing Power of Language"- Robert Romanyshyn, PhD and poet Brian Tracy with Bonnie Bright, moderator—3 Wednesdays in April
Latest Blog Post from Bonnie Bright: "Inside vs. Outside: A Depth Psychological Perspective on the Planetary Crisis and the Psyche/Nature Split"
Read the Fall 2014 issue of Depth Insights scholarly ezine — Loaded with great Jungian and depth psychology essays, articles, art, and poetry.
Not a subscriber?—SIGN UP HERE to receive the link in your inbox every time it comes out!
UPCOMING EVENTS for Bonnie Bright
April 8, 15, 22: 3-Webinar Series: "Conversations between a Psychologist and a Poet: The Healing Power of Language"- Robert Romanyshyn, PhD and poet Brian Tracy with Bonnie Bright, moderator—3 Wednesdays in April
PAST EVENTS with Bonnie Bright
2/5/15—Webinar: "Conversations between a Psychologist and a Poet: The Healing Power of Language"- Robert Romanyshyn, PhD and poet Brian Tracy with Bonnie Bright, moderator
12/12/14—Culture Collapse Disorder: Ecopsychopathy, Exile, and the End of "Home"—Oral Dissertation Defense at Pacifica Graduate Institute
9/12-14/2014—Bonnie Bright serves as co-Master-of-Ceremonies at the Synchronicity Symposium in Joshua Tree, CA
8-22 thru 9/18, 2014—6-week webinar course in Applied Mythology with Craig Chalquist on Depth Psychology Alliance hosted by Bonnie Bright
5/10/13 05/10/13 -- Bonnie Bright interviewed on "Patterns We Live By" radio hosted by Dr. Michael Conforti as they discuss Jungian psychology and the underlying patterns at work in our current culture (30 mins)
2/1/12 Depth Psychology Alliance Meetup & Speaker Evening in the SF Bay Area: Ancestral Healing with Featured Speaker, Daniel Foor, PhD, MFT
4-week FREE teleseminar: "The War of the Gods in Addiction" with Jungian David Schoen; moderated by Bonnie Bright. Runs January 9th through 30th.
12/27/12 SECOND FREE Teleseminar Thursday, December 27: "Beyond Horror and Hope (PART 2): The Archetypal Intersection of Innocence and Evil," a depth psychological look at the Sandy Hook Connecticut school shooting by Jungian Analyst Michael Conforti, Ph.D., moderated by Bonnie Bright, M.A.
12/20/12 - FREE Teleseminar: "Beyond Horror and Hope: The Archetypal Intersection of Innocence and Evil," an exploratory conversation in response to the Sandy Hook Connecticut school shooting by Jungian Analyst Michael Conforti, Ph.D., moderated by Bonnie Bright, M.A.
8/18/12 San Francisco Bay Area Alliance Meetup: Craig Chalquist presents "EarthRise: A Beacon for a New Worldview" - Refreshments, commmunity, learning.
8/10/12 Presentation at JSSS (Jungian Society for Scholarly Studies) in New Orleans, August 8-11, 2012. >More info
7/28/12 San Francisco Bay Area Alliance Meetup: Book Celebration and Author Event,"Marked by Fire: Stories of the Jungian Way" with Jungian Analysts Patricia Damery and Naomi Ruth Lowinsky. Pre-registration required.
7/16/12: Archetypal Personality Patterns: Special presentation at the 24th Annual Assisi Conference, an interdiscplinary gathering on Arts, Archetypes, and the Transcendent The conference, Assisi Italy. >More info
6/2/12: Panel moderator on Transformation at the Climate Change Forum in Portland, OR, June 1-3, in conjunction with Deep Democracy Institute International (led by Jungians & climate scientists among others) >Download a PDF flyer >More info
3/23/12: San Francisco Bay Area Meetup and Speaker Evening for Depth Psychology Alliance featuring speaker Gary Bobroff, M.A.; hosted by Bonnie Bright
3/23/12: Interview: Bonnie Bright with Radio Show Host Jenny Sieck on Inner Voice Intuitive Hour discussing Depth Psychology Alliance, the free online Book Club, and more.
7/14/11: Assisi Institute's 23rd Annual Conference "Transcendent Wonder: Peering Beyond the Veil" featured Jungian James Hollis and Michael Conforti (founder of Assisi Institute) along with Bonnie Bright, and artist Makoto Fujimura in Assisi, Italy, July 2011.
7/14/11: Audio presentation at JFK University, Pleasant Hill, CA, of "Between Honey & Pain: Colony Collapse Disorder and the Colonization of the Wild" (based on the anthology "Rebearths: Conversations with a World Ensouled" approx 22 mins)


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VMware Member of Technical Staff Software Engineer Interview Questions
Interview Experience
Interview Experience
Getting an Interview
Getting an Interview
Interview Difficulty
Interviews for Top Jobs at VMware
- Member of Technical Staff (43)
- Software Engineer (41)
- Intern (24)
- Senior Member of Technical Staff (21)
- Technical Support Engineer (18)
- Inside Sales Representative (16)
- QA Engineer (8)
- Technical Account Manager (7)
- Senior Software Engineer (6)
- Systems Engineer (6)
- Marketing Manager (6)
- Staff Engineer (5)
- Senior QA Engineer (5)
- Project Manager (5)
- Engineering (5)
- Senior Consultant (5)
- Member of Technical Staff II (5)
- Business Analyst (5)
- Manager (4)
- Sales Representative (4)
- Member of Technical Staff Software Engineer (4)
- Program Manager (4)
- Software QA Engineer (4)
- Senior Manager (4)
- Analyst (4)
- Senior Systems Engineer (4)
- Web Developer (3)
- Strategic Account Manager (3)
- Senior Program Manager (3)
- Sales Engineer (3)
Member of Technical Staff Software Engineer Interview
Contacted by the recruiter, and talked for about one hour. The recruiter then arranged a technical phone screen with the hiring manager. The technical screening consists of some c++/ood questions and some coding questions. We use the online shared session for the coding. Couple daysa after the screening I was informed that offer has went out to other candidates
- I was asked some technical questions on the first phone call by the recruiter, which I didn't expect. Answer Question
Other Interview Reviews for VMware
Member of Technical Staff Software Engineer Interview
Application DetailsI applied through a recruiter. The process took 2 days – interviewed at VMware in December 2011.
Interview DetailsCRAZY company.
Both my phone interview and team interview went well and they informed my about the "next step" which will be a second round interview. Next, after 3 weeks later, I just got a short email stating that the team has re-accessed that position and not willing to move forward with me!!!
My question then why did you talk about "next step" ???
It is not that I am out of job or begging a job from them - but some professional communication is rare there.
It is a bureaucratic company who got some cash in their hands - but lacks of decent, bare minimum professionalism.Interview Questions- Given a series of strings, find the biggest common prefix. View Answers (3)
No OfferNegative ExperienceDifficult Interview -
1 person found this helpful
Member of Technical Staff Software Engineer Interview
Application DetailsThe process took a day – interviewed at VMware in August 2010.
Interview Details4 interviewers, one at a time (in a conference room), seeking technical and algorithmic analysis. Lunch with prospective manager at company cafeteria. Was also to meet with VP, but VP was unavailable that day.
Company has good orientation for new employees (covering products and benefits). Comfortable place to work, with a info packed quarterly meetings, free breakfast and snack foods and drinks. Very green company (e.g., dishwasher and washable drink glasses).Interview Questions- How many race heats are needed to find the 3 fastest pinewood derby cars out of a field of 8, if only 4 cars can run at a time (assuming that every car will always run the way/speed and each lane is exactly equivalent)? View Answers (4)
Negotiation DetailsAsk for 5-15% more than you are offered.Accepted OfferPositive ExperienceDifficult Interview -
Member of Technical Staff Software Engineer Interview
Application DetailsI applied online – interviewed at VMware.
Interview Detailsit was just a basic questions ..to test basic skills...keep solving basic programming questions and some of the operating system concepts ..which are commonly asked ..since it is based on virtualization ...be focused on virtualization...there were two technical rounds
Interview Questions- dsc c cpp Answer Question
No OfferPositive ExperienceAverage Interview

subset: commoncrawl


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Thom Browne
Safety Pin Oxford
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Cotton oxford button down with chest pocket and safety pin detail encompassing each open sleeve trimmed with grosgrain ribbon. Available in White. Made in U.S. Cotton. Machine wash.
Style # 502376655His theatrical runway presentations never fail to make waves, but designer Thom Browne—who effectively created the now-iconic shrunken suit silhouette—expertly distills his creative vision into collections that are ultimately wearable (with a wink).
Need Help? Have Questions? Contact Us.
Please call 1.888.222.7639 to speak with a Customer Service Representative.
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What does HR mean in Physiology?
This page is about the meanings of the acronym/abbreviation/shorthand HR in the Medical field in general and in the Physiology terminology in particular.
Headache Removal
Find a translation for HR in other languages:
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- hour, hr, 60 minutes(noun)
- a period of time equal to 1/24th of a day
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"HR." Abbreviations.com. STANDS4 LLC, 2015. Web. 2 Mar. 2015. <http://www.abbreviations.com/term/71731>.
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I stayed in Wigmore Court Hotel for one night during a business trip to London. It is standard London Hotel (purpose made Victorian house). Location is great. Very clean hotel and the room was spotless. The bathroom was slightly small but functional with a good working shower. I had breakfast which was standard. The staff are helpful and the free... More
- Reservation Options:
- TripAdvisor is proud to partner with HotelTravel.com and TripOnline SA so you can book your Wigmore Court reservations with confidence. We help millions of travelers each month to find the perfect hotel for both vacation and business trips, always with the best discounts and special offers.
- Also Known As:
- Wigmore Court Hotel London
- London Minotel
- Wigmore Court London, England


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Public Policy
In this issue: Philanthropy Week in Washington; Tax Policy Happenings; Government spending debate; IRS updates revenue procedures
This series of in person and media events will demonstrate the vital role of charitable giving and its inextricable link to thriving communities.
"Philanthropy Week in Washington," hosted by Council on Foundations, is the new theme for a week of activities including Foundations on the Hill, the ACR Summit for Leaders, and other public policy related activities.
The effort to reach an agreement on the federal budget gives hope that Congress can work together in a bipartisan manner. This could be a positive sign that comprehensive tax reform might gain momentum in 2014.
In this issue:Thune-Wyden Letter on the Charitable Deduction; Tax Reform on hold until 2014; New IRS 501(c)(4) political activity regulations; Public Good IRA Rollover Act; Budget Conference Deadline Looms; Pay for Success Incentive Fund; American Enterpr
The Council has actively supported extending and expanding the IRA charitable rollover since its inclusion in The Pension Protection Act of 2006 (PPA).
On November 20, in conjunction with the Charitable Giving Coalition's "Protect Giving Day," Senators John Thune (R-SD) and Ron Wyden (D-OR) issued a letter in full support of the charitable deduction.
This is an incredibly exciting time at the Council on Foundations. We recently wrapped up our Fall Conference for Community Foundations Conference in San Diego, our fourth major conference since I came to the Council.
Meeting with a member of Congress or with congressional staff is an effective way to convey a message about a specific issue or legislative matter. Below are some suggestions for making the most of your visit.
Each member of Congress has staff to assist him or her during a term in office. To be most effective in communicating with Congress, it is helpful to know the titles and principal functions of key staff.


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W.A. Stevens was established in Maidstone, Kent in 1897 by William Arthur Stevens and had by 1906 built its first petrol-electric vehicle using designs patented by Percival (Percy) Frost-Smith. A petrol engine was connected to an electrical generator and the current produced passed to a traction motor which drove the rear wheels. According to the website of the Birmingham and Midland Motor Omnibus Trust[1] the simpler to operate petrol-electric transmission was popular among bus drivers rather than the conventional crash gearbox (in the days before synchromesh) as few bus staff had previously driven motor vehicles.
Tilling-Stevens factory was situated in St Peter's St, Maidstone. The factory buildings, built in the 1920s in the Daylight style, survive as of 2012. They were Listed as Grade II in July 2011. It is described as "one few buildings of this style not to have undergone significant alteration from the original".[2]
The petrol-electric transmission was fitted to chassis built by J.E. Hall and Co, of Dartford, (who used the trade name "Hallford", so these were known as "Hallford-Stevens") and Dennis Bros, of Guildford (as "Dennis-Stevens"), until an arrangement was agreed with a large bus operator, Thomas Tilling, who wanted to produce their own vehicles which were named Tilling-Stevens. The ease of driving and soundness of construction of these vehicles soon led to the company supplying chassis to many bus operators in the UK, and several abroad as well.
Tilling-Stevens Motors Ltd consolidated its position with bus operators in World War I because the petrol-electric chassis were not considered suitable by the Army for use in France. However, many men were trained to drive in the War on vehicles with conventional gearboxes which led to a decline in popularity of Tilling-Stevens' system. By the 1930s, chassis were being produced with conventional petrol/diesel engines, gearboxes and transmission.
Tilling-Stevens split from Thomas Tilling in 1930 and renamed itself T S Motors Ltd (TSM) in 1932, but were again renamed Tilling-Stevens before World War II had broken out.
Tilling-Stevens was still manufacturing buses after World War II, with a large order built in 1947/1948 for export to Hong Kong (China Motor Bus (108) & Kowloon Motor Bus (50)).[2]
Goods vehicles[edit]
Tilling-Stevens also produced goods chassis available with either petrol-electric or conventional gearbox transmissions and built many trucks during World War I. Their cast aluminium radiators were distinctive, with "Tilling-Stevens" cast into the top and either "Petrol-Electric" or "Maidstone" into the bottom tanks.[3]
After the war, they failed to invest in updating their products and acquired Vulcan Trucks of Southport, Lancashire in 1930 to extend their range (and use Vulcan petrol engines). Production stayed at Maidstone.
The unusual electric transmission became less of an advantage as other makers developed their simpler mechanical transmissions to be reliable and easier to drive. Tilling-Stevens specialised in some unusual markets where the transmission could offer a particular advantage, by also using it as a generator. Some early turntable ladder fire engines were produced where arc lamps for lighting and the electric motors to raise the ladder could be powered by it.[4]
In the 1930s the lorries also lost the large cast radiators in favour of first a thinner cast aluminium shell and then a cheaper steel pressed bonnet and a small diamond-shaped "TSM" badge.
Leading up to World War II they specialised in the searchlight trucks for which they are probably still best known today.[5]
Rootes Group[edit]
In 1950, the company was sold to Rootes Group, and complete vehicle production ceased soon afterwards. The plant continued to produce light commercial engines (particularly the iconic Commer TS3 2 stroke diesel) and vehicle bodies, before finally closing in the 1970s, some years after the group had been acquired by Chrysler.
The Tilling-Stevens petrol-electric bus is interesting as an early example of a hybrid vehicle, although without any direct engine propulsion or battery storage. As the petrol engine ran continuously, it was almost certainly less fuel efficient than a competing petrol engine, which may have contributed to its demise. However hybrid petrol-electric cars, such as the Toyota Prius, are now seen as being a partial solution towards cutting carbon dioxide emissions and reducing the risks of damaging global warming.
- ^ The Transport Museum, Wythall - Midland Red/Birmingham City Transport O 9926
- ^ a b "Saved in the nick of time!". Kent Messenger (9 March 2012). p. 12.
- ^ "1924 Tilling-Stevens TS3A petrol-electric lorry".
- ^ "Tilling-Stevens fire engine in New Zealand.".
- ^ "Tilling Stevens TS20 searchlight lorry".


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Wednesday, April 21
Great American Ball Park
Attendance: 12,203
Cincinnati, OH (Sports Network) - Rafael Furcal had three hits and drove in four runs, powering the Los Angeles Dodgers to a 14-6 win over the Reds in the middle installment of a three-game series.
Manny Ramirez added three hits and knocked in two, including the go-ahead single that scored Furcal in the fifth inning. Andre Ethier had three hits, including a solo homer and ended with two RBI. Matt Kemp tacked on a two-run homer and scored four times.
It was a particularly efficient offense for Los Angeles, which went 11-for-17 with men in scoring position.
Hiroki Kuroda (2-0) lasted 5 2/3 innings, allowing seven hits and six runs -- three earned -- to get the win.
Aaron Harang (0-3) saw his ERA rise to 8.31 in 2010 after giving up 10 hits and seven runs -- six earned -- over 5 2/3 innings.
Joey Votto hit a two-run homer and Scott Rolen added a solo shot, both in the first inning, but the Reds lost for the sixth time in seven games.
The Reds tied the game 4-4 in the fourth inning, but not after some controversy. They loaded the bases thanks to a single from Rolen, an error by third baseman Blake DeWitt and a two-out walk to Ramon Hernandez. Harang then lined a ball to short right field. Ethier charged and was ruled to have made a sliding catch, but the inning didn't come to a conclusion.
First base umpire Tim McClelland originally made the out call, but replays showed Ethier took the ball on a hop. Although the play wasn't allowed for video review by the umpires, they got together and changed the call and each player moved up a base on Harang's single. Chris Dickerson struck out to end the inning.
Furcal walked to start the fifth, and Ethier singled with one out to put runners at the corners. Ramirez then singled softly to right field.
"It's good when you're feeling 100 percent healthy," Furcal said. "There's nothing to think about. I had a tough spring training, but spring training is over. I'm feeling pretty good now."
The Dodgers padded their lead by scoring seven times over the next two innings. Furcal and Ethier singled in runs during the sixth inning, when Harang was chased from the game. Ethier's hit came off Micah Owings. James Loney's base hit off Danny Herrera scored two more runners for a 9-4 cushion.
Orlando Cabrera's single to left field scored two in the bottom of the sixth, but Furcal tripled in a run and then crossed the plate on Kemp's blast over the wall in right field in the seventh.
Casey Blake added an RBI single in the eighth inning, and Reed Johnson singled home Kemp in the ninth.
Ramirez had an RBI base hit in the first, but Votto and Rolen homered in the bottom half for a 3-1 Reds lead.
Furcal tied the game with a two-run double in the second and Ethier's lead-off shot to right in the third made it 4-3.
"It's just bad luck," Harang said. "This game's about luck and it's a bad spell now. I just have to keep hanging in there and things will eventually change, hopefully."
Adrian Johnson
Tim McClelland
Mike Everitt
Andy Fletcher


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This is the search of all human consciousness; this is the search of all living beings. This is the source from where we have come, and this is the goal to where we are going.
Once the circle is complete - the source and goal meet together - you have come to a perfection of which you cannot even have a dream. You cannot even visualize what that perfection is. Even after reaching it, you cannot manage to describe it, you cannot manage to explain it, you can simply dance.
Your eyes will shine with it,
your silence will become a song about it.
Your words may carry a little fragrance of it.
Your very existence will radiate
with the light that you have found
in the completion of the circle.
The source and the goal meeting.now, once this happens to any consciousness, any human being, he is not to be born again into a prison of body, of bones and blood and flesh. Then he disappears into the cosmos and becomes one with the cosmos.
Just a sincere passion
to disappear into the cosmos
is needed.
It is not a long journey,
it is just a quantum leap.
And you are trying the best that you can do.
I am absolutely happy about you. And the day when you all will start blossoming into buddhas will not only be a day of happiness for you, it will be a day of great celebration for the whole of existence.


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What does IMB mean in Chat?
This page is about the meanings of the acronym/abbreviation/shorthand IMB in the Internet field in general and in the Chat terminology in particular.
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"IMB." Abbreviations.com. STANDS4 LLC, 2015. Web. 26 Feb. 2015. <http://www.abbreviations.com/term/511937>.
IMB also stands for:
- I aM Back
- Idaho Message Board
- Illawarra Mutual Building
- Illini Marching Band
- Imbaimadai Airport, Imbaimadai, Guyana
... and 34 more »
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text: On Thu 02 Jan 2003 21:28, you wrote: > Alas! John Gay spake thus: > > use grub to boot the CD directly. > > Yeah, that's how I'd do it, personally. As a proof of concept, I loaded a Suse 7.1 live eval disk I had lying around and tried to boot it directly from grub, but it could not find the boot file, which was in /Suse/Images/Boot Seems that although grub can recognise most file systems, it can't mount a CD to boot from. Next best thing would be to copy the boot image from the CD to floppy and use that to boot from. If that fails too, I can still fall back on using Toms floppy to boot the PC and then mount the CD and build from there. Cheers, John Gay -- Unsubscribe: send email to listar at linuxfromscratch.org and put 'unsubscribe lfs-support' in the subject header of the message


text: "Hi Jen (Faith), just wanted to thank you once again for your assistance and being always reachable every time me and my husband come to Roxas City. A never-ending thanks to you and ADC staff for always so accommodating with our requests – property documentations, etc. – from the beginning to end of purchase."


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Culture Connect Featured Event
The University of Saint Joseph and Amistad Center for Art and Culture will host mystery writer Attica Locke in a conversation with National Public Radio correspondent Karen Grisby Bates about Locke's latest book, The Cutting Season.
This "Authors at Amistad" event will take place on September 26, 2013 from 5:30-7:30 p.m. in the Hoffman Auditorium, located on the University's main campus at 1678 Asylum Avenue, West Hartford, Conn.
Locke and Grisby Bates will lead a discussion on the book, followed by a book sale and signing. Participants are asked to read the book in advance and to come prepared to answer a question about the book.
Correct respondents will be entered to win a complimentary one-year membership in The Amistad Center's Leadership Society. Audience members can also submit a question in advance to: [email protected] to receive a free gift at the event.


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For the second time in four years, I had the great honor of seeing one of my photos take first prize at the Sarthe Endurance Photos contest. Here's the full story.
Open to amateurs and professionals, the competition aims to show the world of sportscar and endurance racing and its many facets.
With the New Year upon us, we thought it would be great to compile our list of the top 20 moments of the season, from our series that ran this holiday season.
Looking back over the top moments of 2014, we hit #11, and the emotional announcement that Danish driver Tom Kristensen would be leaving motorsports after 2014.
Looking back over the top moments of 2014, one has got our heart racing. Nissan announced their efforts to field an LMP1 car for 2015.
Audi with over 80-percent win rate at Le Mans; Audis hybrid technology unbeaten at Le Mans; 263,300 spectators attend the greatest endurance race.
Here's some eye candy from the 24 Hours of Le Mans for you to enjoy!
On the eve of one of the most prestigious motorsport events in the world, Nick DeGroot takes a moment to talk about Le Mans.
Below is a summary of all that took place at Le Mans Thursday.
Below is a summary of all that took place at Le Mans Wednesday.
Scrutineering is complete at Le Mans.
Endurance Info's Laurent Mercier and Motorsport.com's Eric Gilbert took time between the Le Mans Test Day and the busy race week to visit the famous museum located at the entrance of the famed circuit.
We've all heard the term 'aero package' before, but what exactly does it mean?
A couple 'Did you know?' facts for you to chew on ahead of Le Mans.
Ahead of Le Mans, Nissan tested the strength of the ZEOD RC in the event of a crash.
American driver Dion von Moltke talks about his team heading to Le Mans, and what it takes to make it to the biggest race on the planet.
Coming off a banner season in 2013, topped off with the European Le Mans Series title, SMP Racing will be active on several fronts this year, and not only in endurance racing.
Motorsport.com talks to Henrique Cisneros about the Sebring 12 Hours, balance of performance and his plans to get to Le Mans in 2015.
Motorsport.com spent the final weeks of 2013 announcing its top moments of the year. Here they all are. Please take a moment and vote for your favourite moment of the year.
24 Hours of Le Mans organisers, the Automobile Club de l'Ouest give support to the injured Schumacher.
Audi is promising an official video of its new car with trailers circulating in the web...
Celebrating the Le Mans 24 Hours, 90th anniversary, the Le Mans Drivers Hall of Fame includes Richard Thompson.
Patrick Dempsey and Patrick Long star in a new viral video.
Beginning at 10 p.m. ET/PT on Wednesday, August 28th, the four-part documentary will be aired.
Today marks the 25th anniversary of Enzo Ferrari's death...here are some of his biggest accomplishments on pavement.
A quarter of a century has passed since that Sunday 14th August back in 1988, the day Enzo Ferrari passed away.
The son of the founder of Ferrari shares his memories of Enzo Ferrari on the twenty fifth anniversary of his death.
Benoît Tréluyer reflects on his recent challenge at the 24 Hours of Le Mans and the loss of Aston Martin driver Allan Simonsen.
The 2013 24 Hours of Le Mans is now in the record books and we are concluding our in-depth look at the work that goes into fielding a world-class entry with our final installment that takes place once the checkered flag waves.
Weekend celebrations for Audi at Le Mans has been dampened by recent deaths in the racing world.
Patrick Dempsey is one of three drivers in this year's races only all American lineup.
Don Panoz's love affair with sports cars: It started with 'The Bug'
As Level 5 Motorsports prepares to return to France for the 24 Hours of Le Mans, we are taking an in-depth look at the preparation. This installment in our series breaks down the numbers to give you an idea of just how much equipment is required to...
Back in 2000, the Viper GTS-R was the best sports car in the world. Last year in August, the Viper made its in return to the sportscar stage at the ALMS race in Mid-Ohio and now they are making their return to the 24 Hours of Le Mans.
An in-depth look by Level 5 as they prepare for Le Mans. The fifth special feature looks at the all important test day at Le Mans.
Teams and drivers who have never raced in the 24 Hours of Le Mans must participate and complete a minimum of 10 laps at the test.


text:
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Forum List » Income Investors' Forum Ideas for Income Investors. High Dividend Stocks, Mutual Funds etc. Sysco Corporation (SYY) Dividend Stock Analysis
Posted by: Dividends4Life
(IP Logged)
Date: January 10, 2013 09:24AM
Linked here is a detailed quantitative analysis of Sysco Corporation (SYY). Below are some highlights from the above linked analysis: Company Description: Sysco Corporation is a large distributor of food and related products, primarily to the foodservice or food-away-from-home industry. Fair Value: In calculating fair value, I consider the NPV MMA Differential Fair Value along with these four calculations of fair value (see page 2 of the linked PDF for a detailed description): 1. Avg. High Yield Price 2. 20-Year DCF Price 3. Avg. P/E Price 4. Graham Number SYY is trading at a premium to all four valuations above. The stock is trading at a 18.1% premium to its calculated fair value of $27.07. SYY did not earn any Stars in this section. Dividend Analytical Data: In this section there are three possible Stars and three key metrics (see page 2 of the linked PDF for a detailed description): 1. Free Cash Flow Payout 2. Debt To Total Capital 3. Key Metrics 4. Dividend Growth Rate 5. Years of Div. Growth 6. Rolling 4-yr Div. > 15% SYY earned two Stars in this section for 2.) and 3.) above. The stock earned a Star as a result of its most recent Debt to Total Capital being less than 45%. SYY earned a Star for having an acceptable score in at least two of the four Key Metrics measured. The company has paid a cash dividend to shareholders every year since 1970 and has increased its dividend payments for 42 consecutive years. Dividend Income vs. MMA: Why would you assume the equity risk and invest in a dividend stock if you could earn a better return in a much less risky money market account (MMA) or Treasury bond? This section compares the earning ability of this stock with a high yield MMA. Two items are considered in this section (see page 2 of the linked PDF for a detailed description): 1. NPV MMA Diff. 2. Years to > MMA SYY earned a Star in this section for its NPV MMA Diff. of the $753. This amount is in excess of the $500 target I look for in a stock that has increased dividends as long as SYY has. The stock's current yield of 3.47% exceeds the 2.42% estimated 20-year average MMA rate. Memberships and Peers: SYY is a member of the S&P 500, a Dividend Aristocrat, a member of the Broad Dividend Achievers™ Index and a Dividend Champion. The company's peer group includes: Nash Finch Co. (NAFC) with a 3.3% yield, Spartan Stores Inc. (SPTN) with a 2% yield, and United Natural Foods, Inc. (UNFI) with a 0.0% yield. Conclusion: SYY did not earn any Stars in the Fair Value section, earned two Stars in the Dividend Analytical Data section and earned one Star in the Dividend Income vs. MMA section for a total of three Stars. This quantitatively ranks SYY as a 3-Star Hold stock. Using my D4L-PreScreen.xls model, I determined the share price would need to increase to $37.46 before SYY's NPV MMA Differential decreased to the $500 minimum that I look for in a stock with 42 years of consecutive dividend increases. At that price the stock would yield 3.5%. Resetting the D4L-PreScreen.xls model and solving for the dividend growth rate needed to generate the target $500 NPV MMA Differential, the calculated rate is 2.1%. This dividend growth rate is lower than the 3.7% used in this analysis, thus providing a slight margin of safety. SYY has a risk rating of 1.50 which classifies it as a Low-risk stock. SYY has the largest market share in a relatively stable industry. Over the last 40 years, SYY has developed an extensive distribution network that no other competitor has been able to replicate. SYY consults with its customers on how they can drive sales and minimize costs. Near term, relatively high levels of unemployment will likely limit growth in what consumers spend at restaurants Over time, the company's profitability should benefit from consolidation of purchasing, regional distribution centers and tighter management of freight and inventory. SYY is trading above my fair value price of $27.07, but that is not what is keeping me from buying. At 104% (down from 119% in the last review), its free cash flow payout is well above my acceptable level. I will wait until this number comes down to a more reasonable level before adding to my position. Disclaimer: Material presented here is for informational purposes only. The above quantitative stock analysis, including the Star rating, is mechanically calculated and is based on historical information. The analysis assumes the stock will perform in the future as it has in the past. This is generally never true. Before buying or selling any stock you should do your own research and reach your own conclusion. See my Disclaimer for more information. Full Disclosure: At the time of this writing, I was long in SYY (1.8% of my Dividend Growth Portfolio). See a list of all my dividend growth holdings here. Related Articles: - Northwest Natural Gas Co. (NWN) Dividend Stock Analysis - Automatic Data Processing Inc. (ADP) Dividend Stock Analysis - International Business Machines Corp. (IBM) Dividend Stock Analysis - Hasbro, Inc. (HAS) Dividend Stock Analysis - More Stock Analysis Stocks Discussed: SYY, NAFC, SPTN, UNFI,
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Home›Destinations›South America›Brazil›Best of Brazil & Argentina›Best of Brazil & Argentina ItineraryBest of Brazil & Argentina Itinerary
See the very best of Brazil and Argentina on a short adventure from rollicking Rio to stylish Buenos Aires via the spectacular Iguazu Falls.
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Days 1-2 Rio de Janeiro
Welcome to Rio! On arrival be transferred to your hotel before meeting the group for a guided tour of the city's sights. Climb aboard a historic streetcar for a clattering journey to Bohemian Santa Teresa, discover Ipanema's plush cafes and smouldering jazz bars and head up Corcovado for unforgettable views of the city.
Days 3-4 Iguazu Falls
Fly to Puerto Iguazu, the base for trips out to the incredible Iguazu Falls. Over 90 m high and shrouded in lush jungle, the views are impressive from every angle. For a full sense of their size and power, an adrenaline-pumping boat ride at the base is definitely the way to go.
Days 5-7 Buenos Aires
Uncover the diverse districts of Buenos Aires. For tango and weekend markets, San Telmo is the place to go, while the Microcentro, with churches, cathedrals and old buildings, is where the city's historic heart beats. A guided walking tour will help you get some bearings, but forging your own trail through this seductive city is really half the fun!
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Best of Brazil & Argentina Reviews
Our Best of Brazil & Argentina trips score an average of 4 out of 5 based on 3 reviews in the last year.
Best of Brazil & Argentina, March 2014
Sing Yew Foo
Overall the experience was very good. The itinerary was well paced.
Review submitted 18 Apr 2014
Best of Brazil & Argentina, December 2012
Caroline Clarke
I do think it was bad of Intrepid to change the times of our flight from Brazil to Agentina for a cheaper flight so that people whe wanted to do the ride over the falls were not able to. I on the other hand had done the longer trip before do to bad experiences and felt for those who hadn't. And the fact that we had all ready paid for the trip therefore paid for the more expensive flight was very dishonest and people do do their research with airlines etc.
Review submitted 01 Feb 2013
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About LIM College
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- 09/04/2014 - Thursdays in Black: Campaign Launch Event on Sept. 4 a campaign of advocacy and solidarity against all forms of sexual and gender-based violence
- 08/25/2014 - Welcome Week Events: Aug. 25 through Sept. 5 Campus Life Fair, Yankees Game, Urban Food Discovery and more
- 08/24/2014 - LIM College Street Fair: August 24 from 12-4 p.m. Join us for a carnival! Food, games, dancing and more...
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- 06/04/2014 - Women & Fashion FilmFest Events at LIM College: June 4-6 Featuring panels with leading magazine editors, fashion business executives, top models and more
- 06/04/2014 - LIM College to Serve as the Main Venue for the 2014 Women & Fashion FilmFest Leaders in fashion, media and entertainment come together to support and empower women and girls
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The Belgian Grand Prix at Spa-Francorchamps is one of the few races that double world champion Fernando Alonso has not won. Given Renaults recent form, that situation is unlikely to change this weekend, but that doesnt mean the Spaniard is not looking forward to the race. After the disappointment of retiring in front of his home crowd on lap one in Valencia, Alonso is out to make amends at Spa, as Renault chase fourth in the constructors championship
Q: Fernando, you had to retire early from your second home Grand Prix in Valencia. You must have been extremely disappointed
Fernando Alonso: I knew that my weekend would be difficult after qualifying - starting so far down the field on a street circuit is never where you want to be. I was hit on the first lap and lost my rear wing. My mechanics did everything to try and get me back out, but my race was already compromised. I'm disappointed not to have been able to drive in front of my supporters as I wanted to give them a special race, but that's in the past now and I am looking forward to the race in Belgium.
Q: As you say, this weekend is the Belgian Grand Prix in Spa. Is it a circuit that you enjoy?
FA: Spa is one of those exceptional circuits on the Formula One calendar. Like all the older circuits, there is always a very special and warm atmosphere. For the drivers, Spa is an unbelievable challenge and is a very enjoyable place to drive a Formula One car. I have never won at Spa and hope that one day I can add a win here to my list of achievements.
Q: What are the demands of the Spa-Francorchamps circuit?
FA: It's a very long circuit, which generally emphasises the gaps between the cars. It requires a very complete car and so we will have to work hard on the set-up to make sure we are competitive in the quick sections as well as in the slower corners. The compression in Eau Rouge is still an impressive part of the circuit.
Q: Do you think you can have a strong race in Spa as the team chases fourth position in the constructors' championship?
FA: Even though the European Grand Prix turned out to be a race to forget, we should not lower our aims. I am sure that the team is giving 100 percent to achieve our objective and I will also give my maximum to try and get a strong result and score some points. At the beginning of the season things were not easy, but we have improved and we are determined to continue in this direction.


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Financial News
Amazon Shares Slide Despite Profit Rise
Online retail giant Amazon has seen its value drop after crucial Christmas trading failed to meet expectations.
The Seattle-based firm said it made £145m in the three months to the end of December, up from £58m the previous year.
But the figure did not encourage the investors, and shares slid 10% in after-hours trading.
Amazon said its sales rose by a fifth to £15.5bn in the period, although analysts expected it to be higher.
Its forecast for the current quarter is also below analysts' expectations.
The company does not give a breakdown for its UK or European units.
Amazon has long focused on ploughing money into business expansion, including streaming videos to e-readers and grocery delivery in some areas, but the market has shown a shifting mood.
Investors have previously ignored its low profit margins and instead watched revenue growth and long-term potential.
The company posted losses in the previous half-year however its share price still hit a record high of around £250 last week.
:: Watch Sky News live on television, on Sky channel 501, Virgin Media channel 602, Freeview channel 82 and Freesat channel 202.


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Ian Joughin A new study published Thursday in the journal Science provides the most definitive — and accurate — evidence yet that polar ice caps on Greenland and Antarctica are melting.
Shrinking ice is not the only telltale sign that climate change is real. From rising air and ocean temperatures to stronger storms to record droughts, evidence of a changing global climate is all around us.
The Intergovernmental Panel on Climate Change (also known as the IPCC) has linked many of these changes in climate to an increase in greenhouse gas emissions from human activities, which was documented in a 2007 assessment report compiled by thousands of scientists over decades of research and debate.
Regardless of their causes – whether you believe in anthropogenic drivers, like fossil fuels from power plants and cars or not — the observed changes in climate are scientific facts that have grave implications for the future of natural and human systems.
Melting into the sea.
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The Story of How Law Enforcement Uses Photoshop to Fight Crime
Though we all are pretty familiar with how Photoshop has helped make us better photographers and digital artists, what we don't often think about is how the program has affected non-artistic segments of society. Today, in honor of National Police Week, Adobe has decided to show how law enforcement uses Adobe Photoshop to help combat crime. It's the kind of thing we all have seen on the television series CSI for years, but never really believed was real.


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By Apple
Open the Mac App Store to buy and download apps.
Create gorgeous documents in minutes with the all-new Pages for Mac word processor — featuring a stunning new design, new writing tools, and improved performance. Start with an Apple-designed template or create your own design using fonts, styles, and tools from the intelligent Format Panel. Easily add images, movies, charts, and more. And use change tracking, comments, and highlights to review your work.
With iCloud, your documents are kept up to date across all your devices. You can instantly share a document using just a link, giving others the latest version and the ability to edit it directly with Pages for iCloud beta from www.icloud.com using a Mac or PC browser. And with a new unified file format across Mac, iOS, and web, your documents are consistently beautiful everywhere you open them.
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• Turn on iCloud so your documents are automatically available on your Mac, iPad, iPhone, iPod touch, and iCloud.com
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* MathType and EndNote both sold separately. EndNote integration requires plug-in available from Pages support link.
Some features may require Internet access; additional fees and terms may apply.
Pages does not include support for some Chinese, Japanese, or Korean (CJK) text input features such as vertical text.
Pages for iCloud beta is currently available in English only.
What's New in Version 5.5.2
This update contains stability improvements and bug fixes.
Customer Reviews
DO NOT BUY THIS IF YOU NEED MAIL MERGE FUNCTIONALITY. There is no mail merge. If it exists, it is very well hidden. I have been through support documentation, and there appears to be no way to create a document of envelopes or mailing labels from a spreadsheet. Same for creating a catalog document from a spreadsheet of items. This is something I do frequently, and I need this functionality. If you are a current MS Word user and need this feature, be aware that you will not have what you need with Pages.
Update: Apparently one cannot create mailing labels, either. I would like to create a sheet of lables with my business logo and return address. This is not possible AT ALL from Pages. It appears that the only way to do this is with the Contacts App, which is an awkward work around at best and apprears to create a text only label (I see no way to insert a graphic, must only use the data in the contacts app).
Apple: Please make this a reasonable product for those of us who need more than a basic text editor. I don't edit documents on my phone, have never even opened pages on my phone, don't ever plan to edit a document on my phone. If I want to edit a document away from my office, I will use my laptop wtih a fully functioning piece of software installed. Why not limit the features accessible on the mobile versions instead of making a desktop product that does not begin to meet basic business needs?
After a lifetime with Microsoft Word, when I retired from my most recent job I wanted an MS-free laptop. I found Pages and initially, it seemed like it was enough to suit my needs. When I starting picking up consulting jobs, however, I found I needed something more sophisticated and considered how I would peacefully co-exist with the Word juggernaught without compromising my decision to keep the program off my Macbook. I considered Office 365 with severe trepidation - especially after hearing the plight of other Mac users who felt forced down a similar path. Fortunately, Pages has been evolving and I can export to Word, pdf and others when I need to collaborate with folks using those programs. It retains some simplicity and has had it's hurdles along the way but what program hasn't? The learning curve was similar to my experience with many of the Apple products - confusingly simple compared to what I was used to, but as I went along, much of it turned out to make a lot more sense.
Pages is amazing
I read all of the reviews lambasting Pages. I also just installed Yosemite. I bought Pages because I thought that even if it had issues, Apple would get it right. I do a lot of business writing in the office on a PC with Word and Excel. I can't believe the versatility of pages. The simplicity of the interface is amazing, given the horsepower in the package. I don't know how all of these people had such issues with Pages. It works flawlessly. My only issue is that I don't know if it will do a mail merge. The directory merge feature in MS Word will turn a spreadsheet into a catalog. I'd miss that. I'd also like to be able to make a sheet of Avery standard labels. Other than that, I'd suggest that if you're running Yosemite, invest the $20.
PS: One of the reviews said that the spell checker doesn't highlight and it just replaces. Not correct.
- $19.99
- Category: Productivity
- Updated: Jan 08, 2015
- Version: 5.5.2
- Size: 295 MB
- Languages: English, Arabic, Catalan, Chinese, Croatian, Czech, Danish, Dutch, Finnish, French, German, Greek, Hebrew, Hungarian, Indonesian, Italian, Japanese, Korean, Malay, Norwegian, Polish, Portuguese, Romanian, Russian, Slovak, Spanish, Swedish, Thai, Turkish, Ukrainian, Vietnamese
- Seller: Apple Inc.
- © 2005-2015 Apple Inc.
Compatibility: OS X 10.10 or later


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US 6062959 A Abstract A polishing system such as a chemical mechanical belt polisher includes a hydrostatic fluid bearing that supports polishing pads and incorporates one or more of the following novel aspects. One aspect uses compliant surfaces surrounding fluid inlets in an array of inlets to extend areas of elevated support pressure around the inlets. Another aspect modulates or reverses fluid flow in the bearing to reduce deviations in the time averaged support pressure and to induce vibrations in the polishing pads to improve polishing performance. Another aspect provides a hydrostatic bearing with a cavity having a lateral extent greater than that of an object being polished. The depth and bottom contour of cavity can be adjusted to provide nearly uniform support pressure across an area that is surrounded by a retaining ring support. Changing fluid pressure to the retaining ring support adjusts the fluid film thickness of the bearing. Yet another aspect of the invention provides a hydrostatic bearing with spiral or partial cardiod drain grooves. This bearing has a non-uniform support pressure profile but provides a uniform average pressure to a wafer that is rotated relative to the center of the bearing. Another aspect of the invention provides a hydrostatic bearing with constant fluid pressure at inlets but a support pressure profile that is adjustable by changing the relative heights of fluid inlets to alter local fluid film thicknesses in the hydrostatic bearing.
Claims(10) 1. A support for a polishing tool, including a hydrostatic fluid bearing that comprises:
a plate defining a depression having an area greater than that of an object to be polished, the depression being surrounded by a ridge in the plate; an inlet leading to the depression, for connection to a fluid source; and an outlet for connection to a fluid sink, the outlet being in an area surrounding the ridge. 2. The support of claim 1, wherein the outlet and inlet are formed in the plate.
3. The support of claim 1, further comprising a support ring surrounding the depression, wherein the outlet is between the ridge and the support ring.
4. The support of claim 3, wherein the support ring comprises a plurality of pads, each pad having an inlet for fluid flowing across the pad.
5. The support of claim 3, wherein the depression has an adjustable bottom plate which can be moved to change a depth of the depression.
6. The support of claim 1, wherein the depression is elongate along a direction of motion of the object during polishing.
7. The support of claim 5, wherein the bottom plate is mounted with adjustment screws that permit adjustment of the depth of the depression.
8. The support of claim 4, wherein fluid pressure to the inlet leading into the depression is controlled separately from fluid pressure to the inlets of the pads.
9. The support of claim 1, wherein a flat bottom surface covers the area of the depression.
10. The support of claim 1, wherein a contoured bottom surface covers the area of the depression.
Description 1. Field of the Invention This invention relates to polishing systems and particularly to chemical mechanical polishing systems and methods using hydrostatic fluid bearings to support a polishing pad. 2. Description of Related Art Chemical mechanical polishing (CMP) in semiconductor processing removes the highest points from the surface of a wafer to polish the surface. CMP operations are performed on unprocessed and partially processed wafers. A typical unprocessed wafer is crystalline silicon or another semiconductor material that is formed into a nearly circular wafer about one to twelve inches in diameter. A typical processed or partially processed wafer when ready for polishing has a top layer of a dielectric material such as glass, silicon dioxide, or silicon nitride or a conductive layer such as copper or tungsten overlying one or more patterned layers that create projecting topological features on the order of about 1 μm in height on the wafers surface. Polishing smoothes the local features of the surface of the wafer so that ideally the surface is flat or planarized over an area the size of a die formed on the wafer. Currently, polishing is sought that locally planarizes the wafer to a tolerance of about 0.3 μm over the area of a die about 10 mm by 10 mm in size. A conventional belt polisher includes a belt carrying polishing pads, a wafer carrier head on which a wafer is mounted, and a support assembly that supports the portion of the belt under the wafer. For CMP, the polishing pads are sprayed with a slurry, and a drive system rotates the belt. The carrier head brings the wafer into contact with the polishing pads so that the polishing pads slide against the surface of the wafer. Chemical action of the slurry and the mechanical action of the polishing pads and particles in the slurry against the surface of the wafer remove material from the surface. U.S. Pat. Ser. No. 5,593,344 and 5,558,568 describe CMP systems using hydrostatic fluid bearings to support a belt. Such hydrostatic fluid bearings have fluid inlets and outlets for fluid flows forming films that support the belt and polishing pads. To polish a surface to the tolerance required in semiconductor processing, CMP systems generally attempt to apply a polishing pad to a wafer with a pressure that is uniform across the wafer. A difficulty can arise with hydrostatic fluid bearings because the supporting pressure of the fluid in such bearings tends to be higher near the inlets and lower near the outlets. Also, the pressure profile near an inlet falls off in a manner that may not mesh well with edges of the pressure profile an adjacent inlet so that pressure is not uniform even if the elevate pressure areas surrounding two inlets overlap. Accordingly, such fluid bearings can apply a non-uniform pressure when supporting a belt, and the non-uniform pressure may introduce uneven removal of material during polishing. Methods and structures that provide uniform polishing are sought. Hydrostatic bearings include or employ one or more of the aspects of the invention to support polishing pads for uniform polishing. In accordance with one aspect of the invention a hydrostatic bearing support in a polishing system provides a fluid flow across fluid pads having compliant surfaces. The support pressure of a fluid film flow from a fluid inlet and across a compliant pad drops more slowly with distance from the fluid inlet than does the support pressure over a rigid pad. Thus, an array of inlets where some or all of the inlets are surrounded by compliant pad can provide a more uniform pressure profile. In accordance with another aspect of the invention, a fluid flow is varied in a hydrostatic bearing that supports a polishing pad in contact with a wafer or other object being polished. In one case, the fluid flow is periodically reversed by alternately connecting a fluid source to inlets so that fluid flows from the inlets to outlets and then switching the fluid source to the outlets so that fluid flows from the outlets to inlets. Reversing the fluid flow changes the bearing from a configuration in which support pressure is higher over the inlets to a configuration in which support pressure is higher over the outlets. On a time average basis, the support pressure is thus more uniform than if the fluid flow was not reversed. The changes in direction of fluid flow also can introduce vibrations in the polishing pad thereby aiding polishing. Another case of varying the fluid flow introduces pressure variation in the fluid to transmit vibrational energy to the polishing pads. The pressure variation can be introduced, for example, via an electrically controlled valve connected to a fluid source, an acoustic coupling that transfers acoustic energy to the fluid, or a mechanical agitator in the fluid. In accordance with another aspect of the invention, a hydrostatic bearing includes a large fluid cavity having a lateral size greater than the lateral size of a wafer (or other object) to be polished. The large fluid cavity can provide a large area of uniform support pressure. In one embodiment of the invention, the large fluid cavity is surrounded by a support ring including fluid inlets connected to an independent fluid source. The support ring is outside the area of support for polishing pads in contact with a wafer, but fluid flow from the inlets in the support ring is connected to fluid source having a pressure independent of the pressure in the large fluid cavity. Thus, changing fluid pressure in the support ring can change the fluid film thickness (and support pressure) in the large cavity. In accordance with yet another aspect of the invention, a hydrostatic bearing has a non-uniform support pressure profile but a wafer (or other object being polished) is moved so that average support pressure is constant across the wafer when averaged over the range of motion. One such hydrostatic bearing includes drain grooves that spiral from an outer region to a central region of the hydrostatic bearing. The spiral drain grooves may follow, for example, a path that is a part of a cardiod. Inlets arranged on concentric circles surrounding the central region have fluid pad areas with boundaries partially defined by the spiral drain grooves. These fluid pads extend along the spiral grooves so that the fluid pads associated with one ring of inlets extend to radii that overlap the radii of the fluid pads for adjacent rings of inlets. The fluid pads are further disposed so that the same percentage of each circumferential path about the center of the bearing is on or over fluid pads. Thus, each point on a wafer that is rotated about the center of the bearing experiences the same average pressure. This hydrostatic bearing can also be used with a support ring of independently controlled fluid inlets outside the outer region of the bearing. In accordance with another aspect of the invention, a hydrostatic fluid bearing has constant fluid pressure at each fluid inlet and adjusts support pressure by changing the height of one or more inlets and fluid pads with respect to the object being supported. In various embodiments employing this aspect of the invention, a hydrostatic fluid bearing includes a set of inlet blocks where each inlet block includes one or more fluid inlet (and associated fluid pad). The inlet blocks are mounted on a mechanical system that permits adjustments of the relative heights of the inlet blocks. Such mechanical systems can be operated, for example, by air or hydraulic cylinders, piezoelectric transducers, or electrically power actuators or solenoids. The various aspects of the invention can be employed alone or in combinations and will be better understood in view of the following description and accompanying drawings. FIG. 1 shows a belt polisher in accordance with an embodiment of the invention. FIG. 2 shows a plan view of a hydrostatic bearing for a belt support in the belt polisher of FIG. 1. FIGS. 3A, 3B, and 3C respectively show cross-sectional views of inlets with fluid pads having compliant surfaces for use in the fluid bearing of FIG. 2. FIG. 4 shows a cross-sectional view of an outlet for the fluid bearing of FIG. 2. FIG. 5 shows plots of support pressure verses distance from the center of an inlet when the surrounding pad has a compliant surface or a rigid surface. FIG. 6 shows a perspective view of a hydrostatic bearing having a large fluid cavity that covers a supported polishing area. FIG. 7 shows a perspective view of a hydrostatic bearing having spiral or cardiod fluid drain grooves. FIG. 8 shows a perspective view of a hydrostatic bearing having inlets with adjustable relative heights for adjusting local fluid film thicknesses and support pressures. Use of the same reference symbols in different figures indicates similar or identical items. In accordance with the invention, hydrostatic bearings for supporting polishing pads provide pressure profiles that contribute to uniform polishing. Embodiments of the invention employ a number of inventive aspects that can be used alone or in combinations. In accordance with one aspect of the invention, a hydrostatic bearing uses pads with compliant rather than rigid surfaces. The compliant surface surrounding a fluid inlet changes the pressure profile surrounding the inlet and particularly changes the rate of pressure drop with distance from the inlet. With the changed pressure profiles, broader uniform pressure regions are achieved and overlapping of pressure fields from multiple inlets can provide a more uniform pressure field that would rigid inlets. In accordance with another aspect of the invention, the fluid flow in a hydrostatic bearing is modulated or periodically reversed to reduce the effects of pressure difference between areas near fluid inlets and areas near fluid outlets. The fluid flow rate and direction can be altered in continuously or switched back and forth from a normal direction to a reversed direction. During normal operation pressure is higher near the inlets and lower near the outlets in a fluid bearing. Reversing the fluid flow causes pressure to be higher near the outlets and lower near the inlets. The periodic changes in pressure can provide a more uniform time-averaged material removal rate across the surface of a wafer being polished. Reversing or modulating the fluid flow can also introduce vibrations in polishing pads that the bearing supports. The vibrations improve the rate and uniformity of polishing. Yet another aspect of the invention provides fluid bearing configurations that provide uniform polishing. One such hydrostatic bearing includes a fluid inlet to a cavity that is large, e.g., larger than the wafer or other object to be polished. The pressure field across the cavity is nearly constant. Other hydrostatic bearings permit non-uniformity in the support pressure profiles but limit the non-uniformities according to the motion of wafers during polishing. For example, non-uniformities in support pressure are permitted if rotation of the wafer during polishing effectively averages the different polishing rates caused by the pressure differences. Example configurations and shapes of inlets, outlet, and channels for desired non-uniformity in a hydrostatic bearing are described below. In one embodiment, drain grooves defining boundaries of fluid pads follow a spiral or a partial cardiod path. The non-uniform pressure provides uniform polishing when a wafer is rotated about a central axis of the drain grooves. A further aspect of the invention provides a hydrostatic bearing support that attaches constant pressure sources to fluid inlets but adjusts the support pressure profile by changing film thickness in the hydrostatic bearing. In particular, fluid inlets in the hydrostatic bearing have adjustable heights to vary fluid flim thickness above individual inlets and fluid pads. The change in film thickness changes the support pressure at the polishing pad and allows adjustments of the fluid bearing to improve uniformity of polishing. Exemplary embodiments of polishing systems in which aspect of this invention can be employed are described in U.S. Pat. No. 5,957,764. entitled "Modular Wafer Polishing Apparatus and Method", which is hereby incorporated by reference herein in its entirety. FIG. 1 illustrates a chemical mechanical polishing (CMP) system 100 which can employ the various aspects of the invention. CMP system 100 includes a wafer carrier head 110, a support assembly 140, and a belt 130 which is between head 110 and support assembly 140. Mounted on belt 130 are polishing pads that are made of an abrasive material such as IC1400� available from Rodel, Inc. that is divided into areas (or lands) about 1/2"�1/2" in size. The width of belt 130 depends on the size of the wafer to be polished; but for an 8-inch wafer, belt 130 is approximately 12 inches in width and about 100 inches around. During polishing, belt 130 and the polishing pads are conditioned with a slurry such as SEMI-SPHERSE 12� available from Cabot Corporation. A processed or unprocessed wafer to be polished is mounted on head 110 with the surface to be polished facing the polishing pads on belt 130. Head 110 holds a wafer in contact with the polishing pads during polishing. Ideally, head 110 holds the wafer parallel to the surface of the polishing pads and applies a uniform pressure across the area of the wafer. Exemplary embodiments of wafer carrier heads are described in a co-filed US patent application entitled "Wafer Carrier Head with Attack Angle Control for Chemical Mechanical Polishing", Ser. No. 08/965,033, which is hereby incorporated by reference herein in its entirety. Support 140 and head 110 press polishing pads against the wafer mounted on head 110 with an average pressure between 0 and about 15 psi and a typical polishing pressure of 6 to 7 psi. A drive system 150 moves belt 130 so that the polishing pads slide against the surface of the wafer while head 110 rotates relative to belt 130 and moves back and forth across a portion of the width of belt 130. Support 140 moves back and forth with head 110 so that the centers of support 140 and head 110 remain relatively fixed. Alternatively, support 140 could be fixed relative to system 100 and have a lateral extent that supports belt 130 under the range of motion of head 110. The mechanical action of the polishing pads and particles in the slurry against the surface of the wafer and a chemical action of liquid in the slurry remove material from the wafer's surface during polishing. The polished wafer becomes uneven if the polishing consistently removes more material from one portion of the wafer than from another portion of the wafer. Different rates of removal can result if the pressure of the polishing pads on the wafer is higher or lower in a particular area. For example, if head 110 applies a greater pressure to a specific area of the wafer being polished or if support 140 applies a greater pressure to a specific area, a higher rate of material removal can result in those areas. The rotational and back and forth motion of head 110 relative to belt 130 averages the variations in material removal rates. However, the differences in material removal can still result in annular variation in the surface topology of the wafer after polishing. Embodiments of the invention provide supports that reduce unevenness in the support pressure and/or reduce the effect that an uneven support pressure has on polishing. FIG. 2 shows plan view of a hydrostatic bearing 200 that uses compliant pads 230 to form a hydrostatic bearing including an array of inlets 210 with compliant pads 230 in accordance with an embodiment of the invention. Hydrostatic bearing 200 includes a plate 240 on which compliant pads 230 are mounted. Plate 240 is made of a rigid material such as aluminum or any other material of sufficient strength and chemical resistance to withstand the operating environment of a CMP system. Plate 240 is machined or otherwise formed to include inlets 210, outlets 220, and fluid conduits 215 and 225. During normal operation of bearing 200, fluid conduits 215 and 225 respectively connect inlets 210 to one or more fluid sources and outlets 225 to a fluid sink so that fluid from inlets 210 flows across compliant pads 230 and provides the fluid film above compliant pads 230. The fluid film is preferably a liquid such as water and provides a support pressure to support a belt and/or polishing pads. A ridge 290 defines the boundaries of the bearing area and is of sufficient width that a fluid film created by leakage over ridge 290 prevents direct contact between plate 240 and the belt. FIGS. 3A, 3B, and 3C show cross-sectional views of compliant hydrostatic bearings 301, 302, and 303 that can be formed at each inlet 210 of FIG. 2. In FIG. 3A, compliant bearing 301 has compliant pad 230 on a top surface of rigid plate 240. Compliant pad 230 is an elastomer material such as rubber or neoprene. For operation of bearing 200, a fluid such as water at a pressure selected according to the leakage from bearing 200 and the load that bearing 200 carries passes from inlet 210 through a hole 330 in the center of compliant pad 230. An inlet pressure between 0 and 15 psi is typical when supporting a polishing pad during polishing. Pad 230 is sized according to the density of inlets in bearing 200 and in an exemplary embodiment are about 0.75" in diameter for an array of inlets separate by about 1.125". In this exemplary embodiment, the hole in pad 230 and inlet 210 at its widest is between 0.020" and 0.0625" in diameter. Inlet 210 also includes orifice or restriction 320 that restricts bearing stiffness, fluid flow rates, and other attributes of bearing 200. Compliant bearing 301 provides a broader area of elevated support pressure than do hydrostatic bearings having rigid surfaces. FIG. 5 shows respective plots 510 and 520 of normalized pressure versus radius for a compliant bearing such as bearing 301 and a non-compliant hydrostatic bearing having rigid surfaces. When a weight is supported by either type of hydrostatic bearings, the support pressure is at its maximum pressure P over the fluid inlet, but outside the radius of the fluid inlet pressure drops. Plot 510 shows that pressure initially falls off much more slowly for a compliant bearing than for a non-compliant bearing. For example, at a radius about four times the radius of the inlet, the support pressure from the compliant bearing is about four times the support pressure of the non-compliant bearing. The wider area of significantly elevated pressure in a compliant bearing is believed to be caused by deformation of compliant pad 210 changing the fluid film thickness. Where pressure is highest, pad 210 is compressed which increases film thickness. Where pressure is lower, pad 210 expands to decrease film thickness and maintain pressure at a higher level than would a rigid surface. A wider area of significantly elevated pressure for a compliant bearing reduces the size of low pressure areas between inlets 210 in an array such as in bearing 200 of FIG. 2. Thus, the support pressure profile of bearing 200 is more nearly constant. Additionally, individual inlets 210 can be placed close enough together in an array that elevated pressure areas overlap if drains 220 are less than 100% efficient at reducing pressure between inlets. Compliant bearing 302 of FIG. 3B has compliant pad 210 counter sunk into plate 240 so that in a relaxed state, a top surface of compliant pad 210 is flush with the top surface of plate 240. Compliant bearing 303 of FIG. 3C has compliant pad 210 further counter sunk into plate 240 so that in a relaxed state, a top surface of compliant pad 210 is below the top surface of plate. Bearings 302 and 303 have pressure profiles that include features from both compliant and non-compliant hydrostatic bearings. The counter sinking of compliant pads 210 changes the stiffness of the fluid bearing. Accordingly, the amount of counter sinking can be selected according to the desired stiffness for the bearing. Alternatively, a mounting that permits movement of the pad 230 to change the depth of the fluid pocket over pad 230 to provide bearing 200 with adjustable stiffness. FIG. 4 shows a cross-sectional view of an embodiment of one of outlets 220 of FIG. 2. Each outlet 220 is connected to one of conduits 225 which are formed in plate 240 above or below conduits 215. During normal operation, conduits 225 are connected to a fluid drain or sink. In accordance with an aspect of the invention, fluid flow between inlets 210 and outlets 220 is modulated by varying the fluid flow, e.g., varying the pressure, flow rate, or the direction of fluid flow. For example, a fluid source and a fluid sink can be periodically switched between a normal configuration where the fluid source is connected to conduits 215 and inlets 210 and the fluid sink is connected to conduits 225 and outlets 220 and a reversed configuration where the fluid sink is connected to conduits 215 and inlets 210 and the fluid source is connected to conduits 225 and outlets 220. In the normal configuration, fluid films around inlets 210 provide the highest pressure to support belt 130, and lower pressures are near fluid outlets 220. Accordingly, the polishing pad areas that are above inlets 210 tend to remove wafer material faster than polishing pad areas over outlets 220, which can result in uneven polishing. In the reverse configuration, highest support pressure regions form near outlets 220. Thus, in the reverse configuration, the polishing pad areas that are above outlets 220 tend to remove wafer material faster than polishing pad areas over inlets 210. Periodically, switching between normal and reverse configurations tends to average the removal rates for all polishing pad areas. Such switching can be for all inlets 210 and outlets 220 simultaneously or sequentially in some pattern. The array of inlets 210 and outlets 220 in bearing 200 is asymmetric in that inlets 210 differ in sizes, number, and distribution from outlets 220. A more symmetric fluid bearing having outlets of the same or similar size, number, and distribution as inlets may improve the smoothing effects caused by periodically reversing the fluid flow. However, smoothing of the average pressure profile by periodically switching the direction of fluid flow can be applied to any hydrostatic bearing and is not limit to a symmetric bearing configuration or to the configuration of bearing 200. Another effect from periodically reversing the direction of fluid flow is that the changing pressures in support 140 or bearing 200 introduces oscillations or vibrations in belt 130 and the polishing pads. Depending on vibration of polishing pads alone can provide superior polishing but at low polishing removal rates. The combined effects of belt rotation and vibrations are believed to improve polishing performance over belt rotation alone. Vibrations can be introduced in belt 130 by reversing fluid flow or by alternative methods such as modulation of fluid flow. For example, fluid flow rates or pressure can be changed smoothly, for example, sinusoidally between the normal configuration to the reversed configuration. Modulating the fluid flow without reversing the direction of fluid flow can also introduce vibrations and can be achieved in a number of ways. For example, an electric signal having the desired frequency can operate an electromechanical pressure controller (e.g., a solenoid valve) to modulate the pressure or flow rate at the desired vibrational frequency. Alternatively, an acoustic coupler or a mechanical agitator in the fluid can introduce acoustical energy or mechanical vibratory energy that is transmitted through the fluid to belt 130 and the polishing pads. Such modulation or vibrational energy transfers can be uniform for all inlets 210 or individually controlled for single inlets or groups of inlets. Yet another alternative for causing vibration in the polishing pads is to vibrate support 140 to alter film thickness in the hydrostatic bearing. Embodiments of the invention described below in regard to FIG. 8 provide control of the film thickness for individual or groups of inlets for better control of vibrations introduced. In accordance with another embodiment of the invention, FIG. 6 shows a hydrostatic fluid bearing 600 having a cavity 610 with a diameter larger than that of the wafer to be polished. In particular, fluid in cavity 610 supports the entire area of belt 130 where the wafer can contact polishing pads. In the embodiment shown, bearing 600 is circular to match the shape of a wafer and moves during polishing to follow the motion of wafer. Alternatively, bearing 600 and cavity 610 can be elongated to support the polishing pads covering the entire range of motion of a wafer during polishing. Cavity 610 is surrounded by an elevated ridge or lip 615 that separates cavity 610 from a drain ring 620. A fluid inlet 650 at the center of cavity 610 fills cavity 610 with fluid that overflows ridge 615 and drains out of bearing 600 through drain ring 620. A retaining ring support 630 formed from fluid bearings associated with inlets 640 surrounds drain ring 620 and supports belt 130 around but outside the area where the wafer contacts polishing pads during polishing. Bearing 600, thus, supports belt 130 entirely on fluid to provide nearly frictionless and non-wearing bearing. A head on which the wafer is mounted may include a retaining ring that contacts the pads overlying retaining ring support 630. The pressure to inlets 640 is controlled separately from the pressure to inlet 650 of cavity 610 and can be adjusted for the pressure provided by the retaining ring on the wafer head. The pressure to retaining ring support 630 can also be used to adjust the fluid film thickness and fluid depth in cavity 610. Fluid from retaining ring support 630 drains outward from bearing 600 to purge contaminants such as slurry or residue from a polishing process away from cavity 610. Large cavity 610 has the advantage of providing a nearly uniform pressure for wafer support without regard for induced flow effects that motion of belt 130 causes. Induced flow effects can be changed by shaping cavity 610. In particular, the depth of cavity 610 can be adjusted, the shape of cavity 610 can be changed (e.g., the bottom of cavity 610 can be flat or contoured), and additional inlets (or even outlets) can be introduced to cavity 610 to provide a favorable pressure distribution. In the embodiment shown in FIG. 6, a bottom plate of cavity 610 is mounted with adjustment screws that permit adjustment of the depth of cavity 610, and sensors 670 in cavity 610. Sensors 670 can be distance sensors to measure the distance to belt 130 (or equivalently the film thickness) or pressure sensors to monitor the pressure distribution. Control unit 180 uses the sensor measurements for possible system adjustment such as changing cavity depth or the fluid pressure to inlet 650. Deeper pockets tend to handle induced flow effects more efficiently, where shallower pockets are more affected by motion of the belt. A suitable depth is typically about 1/2". As an alternative to attempting to provide uniform pressure, a non-uniform pressure distribution is acceptable if motion of a wafer averages the effects of the non-uniform pressure. For example, the pressure is non-uniform in a hydrostatic bearing including uniform pressure pads if drain groves in the support area provide a lower support pressure. However, if each point on a wafer is over a pressure pad for the same percentage of polishing time, the average applied pressure is constant for all points on the wafer, and the sum or average of polishing due to the non-uniform distribution of pressure results in uniform polishing. FIG. 7 shows a plan view of a hydrostatic bearing 700 that has a non-uniform pressure distribution but provides uniform average pressure to a wafer when the wafer rotates relative to a center axis 750 of bearing 700. Bearing 700 includes pressure pads 710, radial drain grooves 720, and cardiod drain grooves 730. Drain grooves 720 and 730, which connect to a fluid sink, define the boundaries of pressure pads 710. In particular, each cardiod drain groove 730 follows the trace of a part (about half) of a cardiod so that some of the sides of pads 710 are also sections of cardiods. More generally grooves 730 are not required to follow a partial cardiod path but alternatively follow a path that spirals between an outer region and a central region of bearing 700. A star shaped pressure pad 740 is in a region at the center 750 of bearing 700 where grooves 720 and 730 (if extended) would intersect with insufficient space between the grooves for fluid pads. Each fluid pad 710 includes a fluid inlet 712, a cavity 714, and a landing 716. Fluid inlets 712 are located on concentric circles, and each fluid inlet 712 is in an associated cavity 714 that is bounded by an associated landing 716. Alternatively, multiple inlets could be provided in each cavity 712. During normal CMP operations, a fluid flow from inlets 712 across landings 714 to drain grooves 720 and 730 maintains a nearly constant pressure to a portion of belt 130 supported by the fluid film above pads 710. Pressure to the portion of the belt over drain grooves 720 and 730 is lower than the pressure over pads 710. Bearing 700 also includes inlets 762 and pressure pads 760 that form a retaining ring support outside the area under a wafer during polishing. Pads 760 provide additional support for belt 130 to maintain desired film thickness in bearing 700. Fluid pressure to pads 710, 740, and 760 can be separately controlled. In accordance with an aspect of the invention, rotation of a wafer about center 750 causes each point on the wafer (not above center pad 740) to cross pressure pads 710, radial drain grooves 720, and cardiod drain grooves 730. Ideally, during a revolution, the percentage of time that any point on the wafer spends over pads 710 is the same as the percentage of time that every other point on the wafers spends over pads 710. To achieve this goal, the total angular extent of pads 710 should be the same for any circle centered about axis 750. Using cardiod or spiral grooves 730 helps achieve this goal. In particular, each pad 710 can be classified by the circle intersecting the inlet 712 for the pad, and pads 710 having inlets 712 on a circle of inlets extend radially (or along cardiod grooves 730) to overlap the radial extent of pads 710 with inlets 712 on a smaller circle and pads 710 with inlets 712 on a larger circle. Each circular path for a point on a wafer crosses pads 710 and cannot be entirely within a groove. Second, cardiod grooves 730 become closer to tangential with increasing distance from center axis 750, and a circumferential crossing distance of a cardiod groove 730 becomes longer with increasing radius. Thus, the effective groove width increases to match increases in pad size, keeping the angular extent of pads 710 roughly constant. Center pad 740 has a separate inlet pressure control that can be adjusted so that pad 740 provides about the same average pressure over a circle as do pads 710. In accordance with another aspect of the invention, a hydrostatic support bearing uses a constant fluid pressure from a fluid source and at fluid inlets but changes the local fluid film thickness to adjust the support pressure profile of the hydrostatic support. In one embodiment of the invention, a mechanical system changes the fluid film thickness by changing the relative heights of pads surrounding fluid inlets. While the inlet fluid pressure is constant, the support pressure can be increased in the area of a pad by moving the pad toward the belt to decrease the fluid film thickness above the pad. In a typical hydrostatic bearing with an average fluid film thickness of about 0.001 inches, height adjustments on the order of 0.0001 or 0.0002 inches give a range of support pressure suitable for adjustment of a polishing system. FIG. 8 shows a perspective drawing of a portion of a hydrostatic bearing 800 employing a movable inlet block 810 that contains inlets 812, pads 814, and a fluid conduit 816 that connects inlets 812 to a constant pressure fluid source during operation of bearing 800. The full fluid bearing 800 contains six inlet blocks 810, and an associated deflection beam 820 supports each block 810. FIG. 8 shows only one inlet block--deflection beam pair to better illustrate structures underlying deflection beams 820. Spaces between inlet blocks 810 form fluid drains. Each deflection beam 820 rests on contact point 830 and is mounted in a clevis mount 840. Contact points 830 apply upward forces to deflect associated deflection beams 820 and move associated inlet blocks 810. The amount of deflection of (or equivalently the amount of force applied to) each defection beam 820 determines the height of pads 814 and the overlying fluid film thickness during operation of bearing 800. Independent control of contact points 830 provides independent control of the heights of blocks 810. Each contact point 830 is on an associated lever arm 860 having a pivot point 870. Independent actuators 850 connect to lever arms 860 and apply torques to the associated lever arms 860 to control the forces on deflection beams 220. Many alternative systems for changing the height of an inlet block may be employed. For example, hydraulic or air cylinder or a piezoelectric actuator can be directly attached to move deflector beam 820 and/or inlet block 810. During operation of fluid bearing 800, each conduit 816 is connected to a constant pressure fluid source so that the pressure of fluid exiting inlets 812 is nearly constant. The exiting fluid from inlets 814 forms fluid films in the areas of pads 814 and between blocks 810 and the belt or other surface supported by bearing 800. With constant inlet pressure and pad area, the support pressure depends on film thickness. A user of a polishing system can manipulate actuators 850 to change height of pads 814 and therefore change the film thickness in the neighborhood of specific pads and the support pressure in that neighborhood. Changing the support pressure can correct uneven polishing for example, by increasing or decreasing the support pressure in areas have too low or too high of a rate material removal. In bearing 800, each inlet block 810 contains a linear array of inlets 812 and pads 814. Fluid bearing 200 of FIG. 2 contains such linear arrays, and a set of inlet blocks 810 can form the inlet pattern of bearing 200. Pads 814 can have either compliant (as in bearing 200) or rigid surfaces. Alternatively, any shape inlet block with any desired pattern of inlets and pads can be mounted on a mechanical system that raises or lowers the block. In particular, a bearing can include inlet blocks that are concentric rings where each inlet block has independently adjustable height and a ring of inlets formed in the block. The pads surrounding the such inlets can have any desired shape including, for example, the shapes of pads 710 in fluid bearing 700 of FIG. 7. A retaining ring support including pads 760 and inlets 762 can have adjustable height (or fluid film thickness) or an independent fluid pressure from the remainder of the pads. In yet another alternative embodiment, each pad in a hydrostatic fluid bearing has an independently controlled height to allow user variation of film thickness for each pad individually. Although the invention has been described with reference to particular embodiments, the description is only an example of the invention's application and should not be taken as a limitation. For example, although the specific embodiments described are CMP belt polishing systems for polishing semiconductor wafers, other embodiments include other types of polishing systems that may be used for other purposes. For example, the hydrostatic bearings and supports described herein can be employed in a mechanical polishing system having polishing pads on a rotating disk or belt for polishing semiconductor wafers or optical or magnetic disks for use in CD ROM drives and hard drives. Various other uses, adaptations, and combinations of features of the embodiments disclosed are within the scope of the invention as defined by the following claims. Patent Citations
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There's been some recent confusion regarding how Custom Game Achievements vs. A.I. opponents are earned. These achievements are earned by creating a "Custom Game" match in multiplayer, and adding A.I. opponents per the description on the specific achievement. Note that these achievements are not earned by playing against A.I. players in a "Versus A.I." match in single-player.
For those unfamiliar with creating a custom match in multiplayer, simply enter multiplayer, select "Create A Game" in the Custom Game section, select your desired map, and then add an A.I. player (+A.I.) to your game. Achievements are earned for matching up against Medium A.I. and higher. |
i got my guide two achievements facing very easy ai
do the games have to be on blizz maps to count? I'm appearing to get mixed results but I can't tell if it's because of the custom maps I play melee on. Pretty sure they do else the achievements will be worthless as many people make 'cheap' maps that take zero skill to beat comps in. ~~~~~~~~ And thanks for this thread. An in-game tooltip would be very useful though for people not already aware of this. |
This makes me feel like a complete dip-@#%#
Is there a way to add a game to your custom list that you downloaded outside of battlenet? I've downloaded this nifty unit tester map, and every time i want to run it, i have to exit starcraft 2 completely, launch the map editor and test the map. Is there an easier way than that to run a map downloaded from one of the map sites?
Edited by Malminos on 8/17/2010 6:40 PM PDT
Why doesn't the Zergling Rush achievement come up? According to the build order stats my best time was four minutes, seven seconds. This time it was done in four minutes, six AND I know I was connected to Battlenet, because I got the "Zerglot" achievement [play Zerg and snagging a protoss worker to eventually use a warp prism to warp in a zealot]. I have the replay if someone from Blizzard wants to review it and see if there's a glitch at work. |
No custom game achievements work for me, except for 1. I've followed these steps and done it on bliz maps, and fan maps but nothing works.
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