text:
What would be the criteria being a twink?
Reason I ask is I think my new bf is a twink but he disagrees.
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What would be the criteria being a twink?
Reason I ask is I think my new bf is a twink but he disagrees.
Hairless and skinny.
Attachment 881949
Yes, but I need to see more.
fit 12 on keychain they a twink?
or dat 24?
go check wit cleopatra cause straight worlds so a many tags
hold ya chains
A young guy age-18-21 most likely smooth to light hair, slim cute, nice body/face.
Some people put guys in the 30's and call them twink and they are far from it....
These are 2 twinks
Skinny and hairless. Young, short, usually a bottom. Big lips and usually fem
By my definition, twinks:
* are white/Caucasians. I don't think of "twinks" as any other race.
* are young in fact and in appearance. As in "could pass for a high school student".
* have a minimum of body hair between their nose and feet - maybe a bit under the arms, a bit around the pubes, but that's about it.
* weigh less than average. No curves anywhere.
* have a generically "cute" face. Nothing "rugged", just sort of androgynously "cute".
* aren't too bright.
I realize I'm putting myself on the line with that last bit. But please note that I'm not saying everybody who meets the other characteristics meets the last one. Just if you there's a pretty smart kid who has the other characteristics, I wouldn't think of him as a "twink". I tend to think of "twinks" as...well, simple. Young, inexperienced, pretty shallow, enjoying idle chit-chat about this and that. And please note I'm not putting myself above them. I don't think I'm "better" than twinks. I'm just not in the same social sphere. :)
Skinny, young, cute or pretty face.
if a not a nose da straight world mark up ans tags of eons fa selection a bods on sale ya land
is a idea fa you
just a call ya bod wot ya leekin ova COCK or Butt or 3 in 1 or woteva is ofs fit ya wot ya like
if a no figa think a awsum worlds lands ways a call economics ans stuff fa eons
now ta dive inta icebucket happy cock day
Sponge cake with cream filling.
Twink: gay male between 18 and 26, slim with little to no muscle definition, very little or no body or facial hair, "cute" face, generally very young in appearance and attitude. Twinks are usually Caucasian and blond, though not necessarily so.
I've noticed a few people think along these lines, and I'm always shocked. I've met so many Latin twinks in my time.
I also have found it interesting that you mentioned lack of curves. People tend to associate being a "twink" with having virtually no ass. I've never seen it that way.
Ethnic twinks with meat in the right places... I am ALL up on that.
I have nothing against ethnic guys with curves...I just wouldn't use the term "twink" to describe them. :)
^I'm not saying you do, but I still find that standpoint incredibly weird.
But hey, this is probably why I should just stick to my stance of hating labels.
Labels are for food.
--Michael Stipe
[OBLIGATORY SHADE]Guys who look like prepubescent boys and attract pedophiles.[/OBLIGATORY SHADE]
There, I said it. Now it's out of the way. :rolleyes:
Where the hell did the term Twink come from anyway? If I were in that group and got called that I'd be pissed.
Hairless, skinny pretty boys with little to no muscle definition.
The muscle definition isn't a hard and fast rule; I've seen who I'd consider to be twinks with six-pack abs.
I don't think twink is just an age or a bodytype, it's an attitude.
melts in your mouth, not in your hand. :p
then you are way hot
Blond hair, bottom, sort of albonish eyes or very pale colour and when talking sounds like thuhthathuthithuh,,
Thinner, cute young looking face, dresses slightly nicer than most guys, has a good haircut all the time
18-22 cute young jock boy type.
One direction :roll:
a twink is just something someone calls themselves to advertise they are a bottom.
Don't talk about her like that!!!
Anything with a heartbeat and no batteries found in my bed besides me.
One step above a street-lizard but better attired.
^ facts don't need to necessarily be agreed with ;)


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US 6689268 B2 Abstract A composite material includes a structural carrier layer and a relatively thin metal foil layer separated by a release layer. The release layer, that may be an admixture of a metal such as nickel or chromium and a non-metal such as chromium oxide, nickel oxide, chromium phosphate or nickel phosphate, provides a peel strength for the metal foil layer from the carrier strip that is typically on the order of 0.1 pound per inch to 2 pounds per inch. This provides sufficient adhesion to prevent premature separation of the metal foil layer from the carrier layer, but easy removal of the carrier layer when desired. Typically, the metal foil layer is subsequently bonded to a dielectric and the carrier layer then removed. The metal foil layer is then imaged into circuit features in the manufacture of printed circuit boards and flexible circuits.
Claims(10) 1. A method for the manufacture of a composite material comprising the steps of:
providing an electrically conductive support layer;
anodically treating said electrically conductive support layer in a first aqueous electrolyte containing first metal ions and hydroxide ions to produce an anodically treated electrically conductive support layer;
subsequent to said anodically treating step, cathodically depositing a release layer onto said anodically treated electrically conductive support layer in a second aqueous electrolyte containing second metal ions and hydroxide ions; and
electrolytically depositing a metal foil layer on said release layer.
2. The method of
3. The method of
4. The method of
5. The method of
6. The method of
7. The method of
8. A method for the manufacture of a composite material comprising the steps of:
providing an electrically conductive support layer;
forming a release layer on said electrically conductive support layer, said release layer comprising a first portion and a second portion, said forming step comprising the steps of:
(i) electrolytically depositing said first portion of said release layer adjacent said electrically conductive support layer, said first portion of said release layer being a metal selected from the group consisting of nickel, chromium and mixtures thereof; and
(ii) applying said second portion of said release layer over said first portion by immersion coating, said second portion of said release layer being an admixture of chromium and chromium phosphate; and
electrolytically depositing a metal foil layer on said release layer.
9. The method of
10. The method of
Description This patent application is a divisional of U.S. patent application Ser. No. 09/522,544 entitled �Peelable Thin Foil� by Szuchain Chen, et al. that was filed on Mar. 10, 2000 now U.S. Pat. No. 6,346,335. The disclosure of U.S. patent application Ser. No. 09/522,544 is incorporated by reference in its entirety herein. 1. Field of the Invention This invention relates to a composite material having an intervening release layer. More particularly, a copper foil layer is releasably bonded to a carrier layer for transport and assembly. The release layer disposed between the carrier layer and the copper foil layer facilitates separation. The copper foil layer may be laminated to a dielectric substrate in the manufacture of printed circuit boards. 2. Description of Related Art As electronic devices evolve, there is a need for thinner and smaller printed circuits. This leads to a requirement for finer line to line spacing to increase circuit trace density. Most printed circuit boards have a dielectric substrate, such as an epoxy or polyimide, laminated to a layer of copper foil. The copper foil is etched into a desired circuit pattern. As the need for finer line resolution increases, thinner copper foil is required. This is because when copper foil is etched, etching occurs in both a vertical direction and in a horizontal direction at about the same rate. While the vertical etching is required to create spaces between adjacent circuit traces for electrical isolation, horizontal etching at the base of a trace damages the integrity of the circuit traces. Horizontal etching limits the minimum line-to-line spacing to approximately the thickness of the copper foil. Another problem with thicker copper foil is that a longer time is required to etch the foil increasing the manufacturing cost and increasing the environmental concern due to the disposal or reclamation of dissolved copper. One copper foil presently utilized in the manufacture of printed circuit boards is referred to as one-half ounce foil. One square foot of this foil weighs approximately 0.5 ounce and has a nominal thickness of about 18 microns. Thinner copper foil, such as 9 micron thick foil, is available in the marketplace, however special care is required in handling 9 micron foil to prevent wrinkling and damage. Facilitating the handling of 9 micron, and thinner, foils is the use of a carrier strip. The carrier strip is releasably bonded to the foil for manufacturing and lamination. Once the foil is laminated and supported by a dielectric, the carrier strip is removed. One common carrier strip is aluminum that may be removed by chemical etching, such as by immersion in sodium hydroxide, without damage to the copper foil. Etching is time-consuming and disposal may create environmental problems. Alternatively, a carrier layer, typically formed from copper, is coated with a release layer. The copper foil layer is formed on the release layer, typically by electrolytic deposition. Adhesion between the release layer and the copper foil layer is high enough so that the copper foil layer does not separate from the carrier layer prematurely, but is also sufficiently low that separation of the carrier layer following lamination does not tear or otherwise damage the copper foil layer. U.S. Pat. No. 3,998,601 to Yates et al. discloses a release layer formed from either a sulphide or chromate of chromium, lead, nickel or silver. An alternative release layer is disclosed to be chromium metal. U.S. Pat. No. 4,503,112 to Konicek discloses that chromium metal release layers have unpredictable adhesion and that preferred release layers include nickel, nickel/tin alloys, nickel/iron alloys, lead and tin/lead alloys. U.S. Pat. No. 5,114,543 to Kajiwara et al. discloses a composite release layer having an immersion deposited chromate layer that is coated with an electrolytically deposited copper/nickel alloy. The U.S. Pat. Nos. 3,998,601; 4,503,112 and 5,114,543 patents are incorporated by reference herein in their entireties. U.S. Pat. No. 5,066,366 to Lin discloses forming a release layer on a copper alloy foil carrier by treating the carrier with an aqueous solution containing chromic acid and phosphoric acid. While a generally acceptable process, areas of unacceptable high adhesion may occur when a chrome phosphate release layer is formed directly on a copper alloy carrier. U.S. Pat. No. 5,066,366 is incorporated by reference in its entirety herein. There remains a need for an improved release layer that consistently provides adequate adhesion between a carrier layer and a copper foil layer to insure that the copper foil layer remains attached to the carrier layer during transport and processing, such as lamination to a dielectric substrate. However, the adhesion to the release layer is sufficiently low that the carrier layer may be removed following lamination without damaging the copper foil layer. Accordingly, it is an object of the invention to provide a thin metallic foil that is releasably attached to a carrier layer. A second object of the invention is to provide a method for the manufacture of the metallic foil/carrier layer composite. A further object of the invention is to provide a thin copper foil useful for lamination to a dielectric substrate for the manufacture of printed circuit boards and flexible circuits. It is a feature of the invention that the metal foil is releasably attached to a carrier layer and a force of at least 0.05 pound per inch is required to separate the layers thereby insuring that the metal foil layer is not prematurely released. It is a further feature of the invention that a maximum force of 2 pounds per inch, and typically less than 1 pound per inch, is required to separate the metal foil layer from the carrier layer thereby facilitating removal of the carrier layer without damage to the copper foil layer. A further feature of the invention is that the chemical solutions utilized for deposition of the release layer are dilute aqueous solutions that are believed to present less of an environmental hazard than more concentrated electrolytes previously utilized to deposit release layers such as metallic chromium. Among the advantages of the invention are that the metal foil layer may be a thin copper foil with a thickness of 9 microns or less. Such a thin foil facilitates the manufacture of printed circuit boards and flexible circuits with a very fine circuit trace to circuit trace pitch. A further advantage is that the carrier layer is mechanically separatable from the metal foil layer and does not require etching for removal. A further advantage is that the foils of the invention have less surface roughness than conventionally formed foils. As a result, undercutting during etching is reduced. In accordance with the invention, there is provided a composite material. The composite material has a support layer and a metal foil layer. A release layer is disposed between and contacts both the support layer and the metal foil layer. This release layer consists essentially of an admixture of a metal and a non-metal. In one embodiment of the invention, the composite material is then laminated directly to a dielectric substrate. There is further provided a method for the manufacture of a composite material that includes the steps of (1) providing an electrically conductive support layer; (2) anodically treating the electrically conductive support layer in a first aqueous electrolyte that contains first metal ions and hydroxide ions; (3) subsequently cathodically depositing a release layer onto the electrically conductive support layer in a second aqueous electrolyte that contains second metal ions and hydroxide ions; and (4) electrolytically depositing a metal foil on the release layer. One embodiment of this method of manufacture includes the additional steps of laminating the metal foil layer to a dielectric substrate and then separating the electrically conductive support layer and the release layer from the laminate. The metal foil layer, now bonded to the dielectric layer, may then be formed into a plurality of electrically isolated circuit traces. The above stated objects, features and advantages will become more apparent from the specification and drawings that follow. FIG. 1 illustrates in cross-sectional representation a composite material in accordance with the invention. FIG. 2 illustrates in cross-sectional representation the composite material of the invention laminated to a rigid dielectric as a precursor to a printed circuit board. FIG. 3 illustrates in cross-sectional representation the composite material of the invention laminated to a flexible dielectric as a precursor to a flexible circuit. FIG. 4 is a perspective view of the printed circuit board precursor subsequent to removal of the carrier layer. FIG. 5 illustrates in top planar view circuitry formed from the structure of FIG. 4. FIG. 6 illustrates an alternative release layer in cross-sectional representation. FIG. 1 illustrates in cross sectional representation a composite material 10 in accordance with the invention. The composite material 10 includes a support layer 12 and a metal foil layer 14. The support layer 12 may be formed from any material capable of supporting the metal layer 14. Preferably, the support layer 12 is formed from an electrically conductive metal and has a thickness of at least 20 microns (1 micron=1�10−6 meter). Suitable materials for the carrier layer include stainless steel, aluminum, aluminum alloys, copper and copper alloys. Preferred for the support layer are copper alloys such as those alloys designated by the CDA (Copper Development Association, New York, N.Y.) as copper alloy C110 (nominal composition by weight 99.95% copper (minimum) and 0.04% oxygen), copper alloy C715 (nominal composition by weight of 30% nickel and 70% copper), copper alloy C510 (nominal composition by weight of 94.5% copper, 5% tin and 0.2% phosphorous) and copper alloy C102 (oxygen-free high copper having a minimum copper content of, by weight, 99.9%) as well as brasses, mixtures of copper and zinc containing up to 40%, by weight, of zinc. Most preferably, the support layer 12 is a wrought material as opposed to electrolytically formed. The wrought materials tend to have a higher strength and a higher stiffness enhancing peelability of a deposited foil. The support layer may be coated with a copper flash to cover up defects, such as incurred during rolling, that may interfere with the deposition or removal of the foil layer. The support layer 12 may be a single material or a composite material with the second layer applied by any known process including rolling, plating and sputtering. Combinations of copper and nickel and copper and aluminum are believed useful as composite support layers. Preferably, the thickness of the support layer 12 is from 25 microns to 140 microns and more preferably from 35 microns to 70 microns. The metal foil layer 14 is any electrolytically deposited metal or metal alloy and is preferably copper. The metal foil layer typically has a thickness of under 10 microns and is preferably in the range of from about 3 to about 6 microns and nominally about 5 microns. As described below, the metal foil layer 14 may be deposited from a single electrolyte or from combinations of multiple electrolytes. Disposed between and contacting both the support layer 12 and the metal foil layer 14 is a release layer 16. The release layer 16 consists essentially of an admixture of a metal and a non-metal, with the bulk believed to be the non-metal. It is believed that the metal component forms from 5% to 40%, by weight, of the release layer. Suitable metals are those that are reversibly, electrochemically, oxidizable in a suitable electrolyte, as opposed to dissolving. The list of suitable metals includes nickel, chromium, titanium, copper, manganese, iron, cobalt, tungsten, molybdenum and tantalum. Preferred metals are nickel, chromium and mixtures thereof. Preferred non-metals are oxides, phosphates and chromates of the metals. Preferred combinations are mixtures of chromium and chromium oxide, nickel and nickel oxide, chromium and chromium phosphate, nickel and nickel chromate, and nickel phosphate. The release layer is quite thin, on the order of 0.012 micron (120 angstroms) thick and typically from about 0.001 micron to about 0.03 micron thick. Alternatively, the release layer 16 is a composite as illustrated in cross sectional representation in FIG. 6. A first portion 30 of the release layer 16 is a metallic layer, as described above, and is preferably selected to be nickel, chromium or a mixture thereof. This first portion 30 directly contacts the support layer 12 and is typically deposited by electroplating. Other methods of deposition such as immersion plating or vapor deposition may also be utilized. A second portion 32 of the release layer 16 is an admixture of a metal and a non-metal as described above. The second portion 32 directly contacts the metal foil layer 14. With reference back to FIG. 1, on a side 18 of metal foil layer 14 opposite the release layer 16, a bond strength enhancing agent 20 may be deposited. Suitable bond strength enhancing agents include electrolytically deposited copper dendrites having a height of between about 0.5 and 2 microns and a height to diameter aspect ratio of between about 3 and 10. Such dendrites may be electrolytically deposited from an aqueous solution containing copper ions and copper electrodes with the composite material 10 as the cathode. Pulses of DC current are applied between the anode and the cathode as more fully described in U.S. Pat. No. 4,515,671 to Polan, et al., that is incorporated by reference in its entirety herein. Other bond strength enhancing agents include an electrolytically deposited mixture of chromium and zinc as disclosed in U.S. Pat. No. 5,230,932 to Lin, et al., a silane based coating as disclosed in U.S. Pat. No. 5,071,520 to Lin, et al., copper oxides, mechanical abrasion of surfaces, alternating current etching and micro-etching. For the manufacture of a printed circuit board, the composite material 10 is bonded to a dielectric substrate 22 as illustrated in FIG. 2. Metal foil layer 14 may be laminated through the addition of heat and pressure to a rigid dielectric for the manufacture of a printed circuit board. Typical lamination parameters are a temperature of about 180� C. for 50 minutes. Optionally, a polymer adhesive may assist in formation of the bond. Typical rigid materials for the dielectric substrate include fiberglass reinforced epoxies such as FR4. The dielectric substrate may also be an electrically conductive material coated with a dielectric material such as a metal cored printed circuit board substrate or anodized aluminum. Alternatively, as illustrated in FIG. 3, the dielectric substrate 22 is a flexible polymer film such as a polyimide or polyamide. In this instance, the use of a polymer bond agent 24 such an acrylic or epoxy polymer is preferred. As in the preceding embodiment, metal foil layer 14 is bonded to the dielectric substrate 22. Rather than laminating the flexible polymer to the metal foil layer, the flexible polymer may be cast on to the metal foil layer as a liquid or gel and cured to a flexible film. After the composite material 10 is bonded to the dielectric substrate 22, the carrier layer 12 and release layer 16 are removed by mechanical means. Typically, removal is by applying a force to the carrier layer/release layer in one direction and an opposing force to the dielectric substrate/metal foil layer in a different direction. The forces may be either manually or mechanically applied. The force required for separation, referred to as peel strength, is at least 0.05 pound per inch and preferably at least 0.1 pound per inch. This minimum peel strength is required to prevent the metal foil layer 14 from separating from the support layer 12 prematurely, such as during transport or during bonding to the dielectric substrate. The peel strength should also be less than 2 pounds per inch and preferably less than 1 pound per inch to ensure that during removal the metal foil layer remains adhered to the dielectric substrate 22 and does not tear or partially remain with composite material 10. Preferably, the peel strength is between 0.1 pound per inch and 2.0 pounds per inch and more preferably between about 0.2 pound per inch and 1.0 pound per inch. FIG. 4 is perspective view of metal foil layer 14 bonded to dielectric substrate 22. While FIG. 4 shows a single metal foil layer bonded to the dielectric substrate 22, additional metal foil layers may be bonded to top surface 25 of the metal foil layer to form a multi-layer printed circuit board. With reference to FIG. 5, the metal foil layer 14 may be chemically etched to form a plurality of conductive features such as circuit traces 26 and die pads 28. Electrical isolation between conductive features is provided by dielectric substrate 22. Electrically conductive features may be formed by any process known in the art such as photolithography. The following methods are useful for producing the composite material described above. It is recognized that variants of each method may be utilized and that different aspects of the various methods may be mixed together to produce a desired result. All methods generally require appropriate degreasing or cleaning as a first step and rinsing, such as with deionized water, between appropriate steps. In accordance with a first embodiment, a carrier strip formed from copper or a copper alloy has a thickness effective to support a metal foil layer. An exemplary nominal thickness for the carrier strip is 70 microns. The carrier strip is immersed in a dilute aqueous, alkaline sodium dichromate solution having the parameters specified in Table 1. All solutions disclosed herein are aqueous, unless otherwise specified. When a single value is given, that value is nominal.
The carrier strip is immersed into an electrolytic cell containing the electrolyte and a voltage is impressed across the cell with the carrier strip as the anode. The anodic treatment generates a uniform microroughness on the surface of the carrier strip and induces a subsequent uniform metal foil layer copper deposit. On completion of the anodic treatment, the carrier strip is maintained in the same electrolyte and the polarity of the electrolytic cell is reversed. The carrier strip is made the cathode to deposit a thin, on the order of 10-300 angstrom, layer that is believed to be an admixture of chromium and chromium oxides on the carrier strip. This admixture forms the release layer that facilitates separation of the carrier strip subsequent to lamination or other processing. The release layer is formed to a maximum thickness of about 300 angstroms. When the release layer thickness exceeds this maximum, the minimum peel strength requirements are not consistently achieved. Since the thickness of the release layer may be less than the microscopic surface roughness of the copper foil, the precursor anodic treatment is used to achieve a more uniform surface finish. Subsequent to rinsing, a seed layer of copper with a nominal thickness of between 0.2 and 0.5 micron of copper is deposited on the release layer utilizing the parameters specified in Table 2.
The seed layer forms a nucleating agent for the subsequent high speed deposition of a copper foil layer. While the seed layer is preferably formed from copper, it may be any electrically conductive metal that is etchable in the same chemical solutions as copper. Such other metals for the seed layer include copper alloys, chromium, molybdenum, tungsten, nickel, cobalt, etc. The seed layer protects the release layer from chemical attack in an electrolyte utilized to deposit the bulk of the metal foil layer thickness. Typically, to maximize manufacturing speed, an acid copper electrolyte as specified in Table 3 is utilized.
To enhance adhesion, a dendritic treatment may be used to roughen the outside surface of the metal foil layer. One suitable dendritic treatment utilizes the parameters specified in Table 4. Alternatively, an anti-tarnish layer such as a mixture of chromium and zinc may be deposited to increase adhesion without increasing surface roughness.
In a second embodiment, a carrier strip as described above is immersed in the solution of Table 1 for a time of from two to sixty seconds without utilizing electric current. A nominal 5 micron copper foil layer and dendritic treatment is then applied as above. In accordance with a third embodiment of the invention, a copper carrier strip, as described above, is electrolytically coated with a thin, on the order of between 0.05 micron and 2 microns, layer of nickel utilizing the parameters described in Table 5.
A chromium phosphate release layer is then applied over the thin layer of nickel by immersion in a dilute chromic acid/phosphoric acid solution having the parameters disclosed in Table 6.
A nominal 5 micron copper foil metal layer is then deposited as above followed by a dendritic treatment as above. In accordance with a fourth embodiment of the invention, a thin, on the order of between 0.05 micron and 2 microns, layer of nickel is deposited on a copper alloy carrier strip as above. A release layer is deposited from an aqueous solution containing sodium dioxide as disclosed in Table 7.
The nickel coated carrier strip is first made anodic and then cathodic to form reduced nickel oxides. Approximately 5 microns of copper is then applied as the metal foil layer followed by a dendritic treatment as described above. In each of embodiments 1-4, an alkaline copper plating bath was preferably used to deposit a seed layer having a thickness of from about 0.2 to about 0.5 micron of copper prior to depositing up to 5 microns of copper plating in an acidic bath. The initial use of an alkaline copper bath avoids potential attack to the chromium oxide, nickel oxide or nickel phosphate release layer as could happen in the acidic copper bath thus improving the reliability/integrity of the release interface. Embodiments five and six describe methods for forming a composite material having similar reliability and integrity without the need for an alkaline copper bath. In embodiment five, a smooth nickel deposit is formed on the copper alloy carrier strip utilizing a suitable nickel plating bath, such as the nickel sulfamate electrolyte of Table 5. The nickel plated carrier strip is then immersed in an aqueous electrolyte containing sodium hydroxide utilizing the parameters recited in Table 6. The carrier strip is first made anodic and then cathodic. A copper metal foil layer is then deposited using a copper sulphate bath (Table 3) followed by dendritic treatment (Table 4). In a sixth embodiment, a thin layer of nickel, having a thickness on the order of between 0.05 micron and 2 microns, is applied to the carrier strip (Table 5) as described above followed by treatment in an aqueous solution containing sodium hydroxide with the carrier strip first forming the anode and then the cathode as in Table 5. Next, the nickel is treated cathodically in an acid copper sulfate bath at low current density and the parameters illustrated in Table 8.
Copper deposition as in Table 3 is then utilized to increase the thickness up to a nominal 5 microns. Dendritic treatment as in Table 4 completes the process. Composite materials formed from any one of the above processes may then be used to manufacture either printed circuit boards or flex circuits as described above. The advantages of the invention will become more apparent from the examples that follow. A 2 oz. wrought copper foil was used as a carrier strip. The strip was electrocleaned in an alkaline commercial cleaner using 20 ASF current density for 40 sec. The foil was rinsed and then the release layer treatment was conducted in 20-35 g/l NaOH+0.5-5 g/l chromium ions as sodium dichromate solution using an anodic current of 1-5 ASF followed by a cathodic current of 1-20 ASF for 5-20 sec. The anodic treatment appeared to generate a uniform micro-roughness on the surface of the foil and induce a uniform copper deposit. The cathodic treatment appeared to deposit a transparent layer of chromium and chromium oxides, which is believed to be responsible for the release of the carrier strip after lamination. A seed layer of 0.2-0.5 micron copper was electroplated in an alkaline copper plating solution. A 5 micron copper deposit was then electroplated, using 60-70 g/l copper ions as copper sulfate and 60-75 g/l sulfuric acid at 40-100 ASF for 5.4-2.1 minutes, followed by a dendritic copper or copper/nickel treatment. After lamination to an FR-4 epoxy substrate, the 2 oz carrier was easily peeled with a measured bond strength of 0.1-1.0 lb/in. A 2 oz. wrought copper foil was used as a carrier strip. The strip was electrocleaned in an alkaline commercial cleaner using 20 ASF current density for 40 sec. The foil was rinsed and then the release layer treatment applied by electroplating in a solution of 20-35 g/l NaOH+0.5-5 g/l chromium ions as sodium dichromate. This treatment appeared to form a transparent layer of chromium and chromium oxides. A seed layer of 0.2-0.5 micron copper was electroplated in an alkaline copper plating solution. A 5 micron copper deposit was then electroplated using 60-70 g/l copper ions as copper sulfate and 60-75 g/l sulfuric acid at 40-100 ASF for 5.4-2.1 minutes, followed by a dendritic copper or copper/nickel treatment. After lamination to an FR-4 epoxy substrate, the 2 oz. carrier was easily peeled with a measured bond strength of 0.1-1.0 lb/in. After cleaning the copper carrier strip, a nickel layer was first electroplated with 0.15 micron nickel in a nickel sulfamate bath at 30 ASF for 20 sec. The foil was then immersed in a solution containing 0.2-10.0 g/l chromic acid and 0.5-40 g/l phosphoric acid for 10-40 sec at ambient temperature. The alkaline copper seed layer and acidic copper plating were conducted as described in Example 1. A peelable foil resulted after lamination with 0.2-2.0 lb/in release force. As in Example 2, a nickel layer was first electroplated. The nickel surface was then anodically treated in a 20-50 g/l NaOH solution at 0.5-10 ASF for 5-30 sec to generate a nickel oxide release layer. This nickel oxide layer was then cathodically reduced in a 20-50 g/l NaOH solution at 0.5-50 ASF for 5-30 sec. This cathodic treatment appeared to produce reduced oxides and enlarge the operating window. Without the cathodic treatment, if the anodic current is too low, a non-peelable foil would be produced. If the anodic current is too high, the plated 5 micron foil often delaminates or forms blister even before lamination and renders the product useless. After the nickel and nickel oxide treatment, the alkaline copper seed layer and 5 micron acidic copper are deposited. A release force of 0.35-1.0 lb/in was obtained. Use of a copper seed layer may be problematic from the standpoint of foil production for other reasons not the least of these is the fact that the process uses non-consumable (stainless steel) anodes. Hence during operation of a production line, the copper content of the electrolyte must be held constant by the addition of soluble copper ions. Such occurs by the additions of appropriate replenishment salts supplied by the manufacturer of the plating bath. Thus while the bath copper content can be maintained, the concentration of other chemical species (pyrophosphate, phosphate, sulfate, etc.) must increase. In this example, the inventors have identified an approach that is accomplished without need for a seed layer from an alkaline copper bath. The formation of a smooth nickel deposit onto a carrier strip has been shown to be very easily accomplished by deposition out of a nickel sulfamate bath using a current density of 30 to 50 ASF with times of 20 to 30 seconds. Treatment of the nickel plate in a solution of 30 g/l sodium hydroxide was then conducted with an anodic treatment of 20 to 40 ASF for 20 to 40 seconds with subsequent cathodic treatment in the same solution at 25% to 50% of the anodic current density and for half the time. No seed layer was used, rather the nickel coated support layer was cathodically treated in acid-copper sulfate bath at low current density, 60 seconds at 0.03 to 2 ASF, followed by plating of copper from the acid copper sulfate bath at 65 ASF for 3.5 minutes to achieve the desired 5 micron thickness. The foils retained their peelability following lamination. For comparison, it was demonstrated that the above low current treatment resulted in peelable foils free of defects while foils made using identical conditions, but without the low current treatment, were full of defects and not peelable following lamination. It is apparent that there has been provided in accordance with the present invention a composite material including a releasable metal foil layer and methods for the manufacture of such a composite material that fully satisfies the objects, means and advantages as set forth herein above. While the invention has been described in combination with embodiments thereof, it is evident that many alternatives, modifications and variations will be apparent to those skilled in the art in light of the foregoing description. Accordingly, it is intended to embrace all such alternatives, modifications and variations as fall within the spirit and broad scope of the appended claims. Patent Citations
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JACS 2013 (Joint Area Study Centers Symposium) "The Future of Waste"
Speaker Keynote by Martin Medina Sr., Catherine Alexander Anthropology, Univ. of Durham, UK, Stephanie Foote English and Gender Studies, UIUC, Nicky Gregson Geography, Univ. of Durham, UK, Darrin Durant Geography ,York University, Daniel Schneider NRES, UIUC, Jonathan Bloom Independent investigative journalist, Janet Kalish Reegan.info, New York City, Michelle Schmidt Sociology, UIUC, Steven Sonka ADM Inst.Post-harvest Loss, UIUC, Zsuzsa Gille Sociology, UIUC
Date Mar 1, 2013 - Mar 2, 2013
Location Illini Union, room 314 A
Cost free and open to the public
Sponsor ADM | Anthropology |Center for African Studies | Center for East Asian and Pacific Studies| Center for Global Studies | Center for International Business and Education Research | Center for Latin American and Caribbean Studies | Center for South Asian and Middle Eastern Studies | European Union Center | Lemann Institute for Brazilian Studies |Russian, East European and Eurasian Center | Sociology | SDEP
Contact Jeffrey Friedman; Alejandra S-Seufferheld
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CART race number 8 of 16 Sunday, July 5, 1992 at New Hampshire International Speedway, Loudon, NH 200 laps on a 1.058 mile paved track (211.6 miles)
Glossary 1992 CART results / 1992 standings
All times are shown in seconds. * - includes time spent in garage.
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Reviewed scalloped potato gratin
Apr 20, 2014 on FoodNetwork.com
"Really tasty but I have tried it 3 times now and have had to cook it way longer than the recipe calls for. Left it in over an hour today and still had to put it back in the oven for longer. Used food processor to ensure the potatoes were really thin, and there is lots of liquid for them to cook in so don't know what is wrong."
Reviewed Baked Macaroni and Cheese
Jan 6, 2013 in Food Network Community Toolbox on FoodNetwork.com
"A little too oniony but otherwise really good ... Will make it again. Easy recipe.""
Reviewed Omelet for Two
Jan 5, 2013 in Food Network Community Toolbox on FoodNetwork.com
"Really good, and easy. This recipe is in our regular rotation - especially good on a busy weeknight when you are just too tired.""
Reviewed Hunter's Minestrone
Dec 31, 2012 in Food Network Community Toolbox on FoodNetwork.com
"Just fabulous!
Favorited Turkey Roulade with Apple-Cider Gravy
Reviewed Banana Chocolate Chip Cookies
Jun 10, 2012 in Recipes on Cooking Channel
"easy and tasty, a nice way to use up ripe bananas if you're tired of banana bread""
Favorited Go Get 'Em Smoothie
Favorited Monkey Tail Banana Cake
Favorited Banana Chocolate Chip Cookies
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Reviewed Perfect Roast Chicken
Apr 7, 2012 in Food Network Community Toolbox on FoodNetwork.com
"Excellent - easy and tasted wonderful."""
Reviewed English Onion Soup with Sage and Cheddar
Feb 26, 2012 in Recipes on Cooking Channel
"This is the best onion soup I have ever had! """
Reviewed Garden Vegetable Frittata
Jul 23, 2011 in Recipes on Cooking Channel
"This was my first attempt at a frittata and it worked out perfectly. It was easy and quick and tasted great. I used a sharp cheddar because I had it on hand, and I used 6 eggs instead of 8 because I only had a 10 inch pan and I think a large is 12 inches. It might be better to specify the dimensions of the pan in the recipe. Anyway, 6 eggs wer""
Reviewed Veal Chops with Stewed Tomatoes and White Beans
Jul 3, 2011 in Recipes on Cooking Channel
"Tastes awesome! However, I used dried beans, soaked overnight, as the written recipe says, and they were nowhere near done after 30 minutes in the oven. I want to see the episode again because I'm wondering if there is an error in the written version?""
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Jan 1, 2011 in Food Network Community Toolbox on FoodNetwork.com
"Easy and very good - the best black-eyed peas recipe I've had."


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Critics say Democrats' focus on "women's issues" failed in 2014, but the party has no plans to abandon the line of attack.
As aspiring Republican presidential candidates compete for donor support, the old rules no longer apply.
The rapper is considering running for "this little mayor thing" in his Georgia hometown.
The tweet storm after the snowstorm.
Matt Bevin is back, and that means trouble for Kentucky's Republican establishment.
As the House prepares to push through a bill to make the border stronger, we don't know where we stand today.
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Costs and Financial Aid
Tuition costs and costs of living at Iowa are significantly lower than at peer institutions, please see this chart (and click on "International," if appropriate) for more information. The tuition rate is $20,000 per year for the residents of the state of Iowa, and $24,000 per year for residents of other states and foreign countries. The new tuition rates will go into effect fall of 2014. Tuition discounts (at the resident rate) are provided for students employed by faculty as research assistants, and many LLM


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Reviewed Guacamole
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"I'm not much of a guacamole eater, but my friends are and they ate it up! I have never made guacamole dip so this was a new experience for me. The recipe was super easy and it was a lot of fun to make even if I didn't get a taste. It got rave reviews!"""
Reviewed Delicate Mint Sandwich Holiday Cookies
Dec 6, 2011 in Food Network Community Toolbox on FoodNetwork.com
"Most of the reviews that I saw said that the cookies was bland and not much taste. I wanted to try it anyway because it looked pretty. Well, first off, mine were not as pretty, but 2nd, I added 1/2 tsp. of almond extract to the cookie dough and that really gave it some flavor. I loved the mint frosting too. I took them to a party, and everyone wh..."


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Update your outdoor patio's look with the addition of the colorful Acrylic Chaise Lounge Chair Cushion. Designed to last, this decorative yet functional outdoor cushion is driveways..
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The Health Professions Committee is comprised of faculty from the sciences and mathematics, and is chaired by Dr. Kevin Crisp (Biology Department). It provides both informal advising and a formal service to students interested in medical, dental, and many other health careers.
- Application Deadline – April 1, 2015
- Applying to Professional Schools
- How to Set Up an HPC Interview
- Email Alias
Current Committee Members
- Kevin Crisp, Chair of the HPC, Biology
- Wes Pearson, Chemistry
- Beth Abdella, Chemistry (on sabbatical 2014-2015)
- Diane Angell, Biology
- Dipa Kalyani, Chemistry
- Minda Orina, Psychology
- Jay Demas, Physics
- Katie Ziegler-Graham, Statistics (on sabbatical 2014-2015)
- Nicole Beckmann, Nursing
- Karen Renneke, Academic Administrative Assistant
Applying to Professional Schools
Here are some resources to help you explore the application process for health-related professional schools:
"What do I need to do to get into medical school?"- written by Ted Johnson & Jean Porterfield, edited by Kevin Crisp
- MCAT 2015: Student information about taking the MCAT and applying to AMCAS
- Medicine: Medical school application process
- Medicine/Dentistry: Health Professions Manual
- Medicine/Nursing: Certified Nursing Assistant Information and Resources
- Osteopathic Medicine: an excellent, well-researched overview
- Osteopathic Medicine: The American Association of Colleges of Osteopathic Medicine (AACOM) – Career Planning & Guides
- Pre-Health: Ted Johnson's Advising Manual: Finding Your Way to a Career in the Health Profession
- Pharmacy: Doug Beussman's pharmacy school advising resource
- Graduate School: Piper Center for Vocation and Career's general grad school resources
Applying to a Health Professional Program?
St. Olaf College and the University of Minnesota's Health Careers Center have teamed up to offer you a series of interactive, online workshops aimed at helping you with applying to health professional programs at the University of Minnesota or anywhere else in the country.
St. Olaf Students, Faculty, & Staff
St. Olaf Alumni
How to Set Up an HPC Interview
- Fill out an Interview Form (student use ONLY) to request a Health Professions Interview. You can type this form, but you will not be able to save it unless you have Adobe Writer; print, sign, and submit the form to Karen Renneke (RNS 336).
- Choose 3-5 faculty to fill out an Evaluation Form ((PDF file faculty use ONLY). Evaluation Form Document (faculty can use this if they wish to fill out the form and save the form, BUT please do not expand this form, I can ONLY use 2 pages, these go to the medical, dental and other health profession schools). Ask individuals receiving the forms to return them in approximately two weeks. This form is for all schools, including medical, dental, and other health profession related schools. Students may ask members of the HPC to fill out a form if they know the student well. Students should NOT use the forms for anyone outside of St. Olaf – those recommendations will factor in later in the process. You can type this form, but you will not be able to save it unless you have Adobe Writer; faculty should print, sign, and submit this form to Karen Renneke (RNS 336) in a confidential envelope.
- Print and submit an unofficial grade audit (which you can obtain from the Student Information System) to Karen Renneke (RNS 336).
How to Prepare for Your HPC Interview
Email Alias
If you would like to be on the St. Olaf College Health Professions emailing list, email Karen Renneke with the email address you wish to use as well as your graduation year.


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Deadly end for argument at shebeen
Comment on this storyJohannesburg -
A man has been arrested in Orlando West, Soweto, for allegedly stabbing his friend to death, Gauteng police said on Monday.
The man would appear in the Protea Magistrate's Court on Tuesday on a charge of murder, Constable Sibusiso Chauke said.
The two men were at a shebeen in Meadowlands, Zone Five, when they began arguing on Saturday around 2am.
The 34-year-old allegedly stabbed his 30-year-old friend, who died on the scene.
"Preliminary investigations revealed that the suspect fled and hid in Orlando West," Chauke said.
Police found him and arrested him shortly after 4am. - Sapa
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Government Performance:
2007 Federal Managers Survey on Performance and Management Issues: (GAO-08-1036SP, July 2008), an E-supplement to GAO-08-1026T
GAO-08-1036SP: Published: Jul 24, 2008. Publicly Released: Jul 24, 2008.
Additional Materials:
- Full Report:
(202) 512-6543
Office of Public Affairs
(202) 512-4800
This e-publication supplements our testimony GAO-08-1026T by presenting the item by item results of our web-based survey of federal managers which was conducted between October, 2007 and January, 2008. The purpose of the survey was to update information obtained from three previous GAO surveys of federal managers conducted over the last decade. The questionnaire was designed to obtain the observations and perceptions of respondents on various aspects of such results-oriented management topics as the presence and use of performance measures, hindrances to measuring performance and using performance information, and agency climate. In addition, the questionnaire included a section requesting respondents' views on the Office of Management and Budget's (OMB) Program Assessment Rating Tool (PART) and the priority that should be placed on various potential improvements to it. The questionnaire was administered to a stratified random probability sample of 4,412 persons from a population of approximately 107,326 mid-level and upper-level civilian managers and supervisors working in the 24 executive branch agencies covered by the Chief Financial Officers Act of 1990 (CFO). Survey stratification by agency included an additional breakout of 5 selected agencies that are components of the CFO Act agencies. We received useable questionnaires from about 70 percent of the eligible sample. The response rate across the 29 agencies ranged from 55 percent to 84 percent. This e-publication presents the weighted survey percentages for all respondents, i.e., government-wide, and for each of the 29 agencies. The unweighted number of respondents for each item is also shown. See the report referenced above for a more detailed discussion of our scope and methodology as well as a discussion of survey results. Please note that for questions 15 through 19 in the PART section, only respondents who indicated on question 14 at the beginning of the PART section that they had low to extensive knowledge of the PART were instructed to complete the remaining PART items. The "No response" category includes all other respondents who were instructed to skip these questions. Also, for these items, we do not display responses by individual agency due to the low number of respondents at some agencies. We conducted our work in accordance with generally accepted government auditing standards. Those standards require that we plan and perform the audit to obtain sufficient, appropriate evidence to provide a reasonable basis for our findings and conclusions based on our audit objectives. We believe that the evidence obtained provides a reasonable basis for our findings and conclusions based on our audit objectives.
Jan 29, 2015
Federal Construction Subcontracting:
Insight into Subcontractor Selection Is Limited, but Agencies Use Oversight Tools to Monitor PerformanceGAO-15-230: Published: Jan 29, 2015. Publicly Released: Jan 29, 2015.
Dec 22, 2014
Federal Subcontracting:
Further Actions Needed to Improve Oversight of Pass-through ContractsGAO-15-200: Published: Dec 22, 2014. Publicly Released: Dec 22, 2014.
Dec 18, 2014
Electronic Submissions in Federal Procurement:
Implementation by the Army Corps of Engineers and Department of the Interior's Bureau of ReclamationGAO-15-253R: Published: Dec 18, 2014. Publicly Released: Dec 18, 2014.
Dec 17, 2014
State and Local Governments' Fiscal Outlook:
2014 UpdateGAO-15-224SP: Published: Dec 17, 2014. Publicly Released: Dec 17, 2014.
Dec 11, 2014
Federal Subcontracting:
Linking Small Business Subcontractors to Prime Contracts Is Not Feasible Using Current SystemsGAO-15-116: Published: Dec 11, 2014. Publicly Released: Dec 11, 2014.
Dec 3, 2014
Federal Data Transparency:
Effective Implementation of the DATA Act Would Help Address Government-wide Management Challenges and Improve OversightGAO-15-241T: Published: Dec 3, 2014. Publicly Released: Dec 3, 2014.
Nov 14, 2014
2013 Government Shutdown:
Three Departments Reported Varying Degrees of Impacts on Operations, Grants, and ContractsGAO-15-86: Published: Oct 15, 2014. Publicly Released: Nov 14, 2014.
Nov 13, 2014
Program Evaluation:
Some Agencies Reported that Networking, Hiring, and Involving Program Staff Help Build CapacityGAO-15-25: Published: Nov 13, 2014. Publicly Released: Nov 13, 2014.
Nov 12, 2014
Federal Real Property:
Strategic Focus Needed to Help Manage Vast and Diverse Warehouse PortfolioGAO-15-41: Published: Nov 12, 2014. Publicly Released: Nov 12, 2014.
Oct 31, 2014
Government Efficiency and Effectiveness:
Inconsistent Definitions and Information Limit the Usefulness of Federal Program InventoriesGAO-15-83: Published: Oct 31, 2014. Publicly Released: Oct 31, 2014.
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Suite 840
Modesto, CA 95356
Phone: 209.846.6940
Restaurant Hours
11am-12am Monday-Thursday11am-1am Friday
10am-1am Saturday
10am-12am Sunday
Location Links
- See employment opportunities for the Modesto location.
- Order Food Online
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Something Delicious For Every Member of the Family in Modesto, CA
When it's time to find a place to dine in Modesto, CA, it can be a challenge to please every member of the family. BJ's Restaurant and Brewhouse, though, has something for everybody to love among our extensive 120-plus item menu. We're always Pursuing Amazing™ which means that everything we serve is carefully crafted using only the finest ingredients. Regardless of your tastes, it's easy to find something to love at BJ's! Our signature pizzas, delicious pasta favorites, garden fresh salads, housemade soups and more are sure to delight. Dining with the little ones is never a problem at BJ's, we offer many smaller entrees and option designed just for the kids and, if you're watching what you eat a little more closely, you'll appreciate our flavorful EnLIGHTened Entrees® and our selection of gluten-free menu options.
At BJ's Restaurant and Brewhouse, we don't kid around when it comes to beer. Our experienced team of brewers is dedicated to crafting only the best beers, evidenced by the fact that our craft beer has taken home many prestigious awards over the years. Try one of our always-on-tap beers like our popular HopStorm® IPA, Brewhouse Blonde®, LightSwitch® Lager or Harvest Hefeweizen®. We're also extremely proud to offer incredible seasonal beers and our top-quality limited edition Brewmaster's Reserve™ brews, making it easy to find a beer to suit your taste. Experience the difference that Pursuing Amazing™ makes and experience the quality at BJ's Restaurant and Brewhouse in Modesto, CA! We can't wait to serve you!


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From Wikipedia, the free encyclopedia - View original article
Pedro or the archaic Pêro is a masculine given name. It is a Portuguese, Galician and Spanish form of the name Peter,[1] which is derived, via Latin "petra", from the Greek word "η πετρα" meaning "stone, rock".[2] The name Peter itself is a translation of the Aramaic Kephas or Cephas meaning "stone".
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Aliens: Colonial Marines has been delayed from a spring release to a tentative autumn 2012 one, Gearbox has confirmed to CVG.
The developer has issued the below statement, confirming the delay following a report on a revised release date appearing on the game's official website earlier today.
"Aliens: Colonial Marines is a process of creativity and invention and those don't necessarily follow the structure of an assembly line," said a Gearbox rep.
"While setting clear goals, deadlines and predictions is helpful, they are often subjective. We don't want to sacrifice the creative process just for the sake of following a blue print. We prefer to have the creative discovery shape that blue print because our goal is to make a great game, and we are prioritizing this goal over the previously targeted date."
The rep made no mention of the revised date, which now sits at 'autumn' on the official site.


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The change of season has me eager to do something so I thought I'd find a few somethings to do with my family and share them with all of you. Here's a list of what I came up with.
Featured Spring Activity and Craft
- Beth at Smart Family Tips shared a link with me. She wrote Good, Green Cheap Fun. She shares some fun ideas for your family that will cost very little (if any) money. The great thing about her site is that she focuses on green living so you'll find tips and hints for using safer products for your family.
- Brittany, the Super Mom of the Clarke Family shared a really adorable idea. She wrote a post on how to make Flower Pens. Easy, cheap and fun!
A few more ideas from around the web and my very own head!
- Kate over at Curiositys sewed the loveliest little Embroidered Bookmark as a gift. Don't be intimidated if you don't sew. It's a great beginner project!
- Skip to my Lou has a post making flowers out of egg cartons. They're cute and easy. She's also got links to a few more spring crafts at the bottom of that post.
- At Frugal Fancy's Blog she posted a bunch of Crafty Freebies. She gives links for free patterns, offers and ideas. Go check it out!
- I made these Pencil Pinwheels with the girls the other day. Perfect for windy spring days!
- Picked up a thing of sidewalk chalk at the store for $1 a couple days ago. Talk about cheap fun!
- There's an adorable Paper Flower Garden Hat over at Flipflops and Applesauce.
- Ramblings Of A Crazy Woman has a great project for preschoolers, a Fruit Loop Rainbow.
- Having a lot of rainy spring days? Head over to Let's Explore and see how they made Rain Art.
- I found 14 Family Activities To Do Before The End Of The Year over at Mommy's Idea Book.
- What better excuse than spring to sew yourself this great Buttercup Bag found over at Made By Rae.
- Why not make the Eggshell Seedlings found at … all the little things through Crafty Crow.
- Paint your toenails and get ready for flip-flops. (Order a pair of Old Navy flip-flops for each family member!)
- Go to an open area and fly a kite!
Do you have anything to add to our list? Write about it in the comments or feel free to share a link!
Why I do what I do ~ My daughter used chopsticks for the first time this past weekend – one in each hand.Have you liked Domestic Cents on Facebook yet?


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New King James Version (NKJV) | New International Version (NIV) |
1 Then Moses and the children of Israel sang this song to the Lord, and spoke, saying: "I will sing to the Lord, For He has triumphed gloriously! The horse and its rider He has thrown into the sea! | 1 Then Moses and the Israelites sang this song to the LORD: "I will sing to the LORD, for he is highly exalted. The horse and its rider he has hurled into the sea. |
Scripture taken from the New King James Version. Copyright © 1982 by Thomas Nelson, Inc. Used by permission. All rights reserved. (New King James Version) | Scripture quoted by permission. Quotations designated (NIV) are from THE HOLY BIBLE: NEW INTERNATIONAL VERSION®. NIV®. Copyright © 1973, 1978, 1984 by Biblica. All rights reserved worldwide. (New International Version Bible Online) |


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Godspeed, brothers and sisters. You fought the good fight. Now rest in peace…
Officer Down: Trooper Randall Wade VetterOfficer Down: Trooper Randall Wade Vetter - [, Texas]Age: 28 Cause of Death: Gunfire Trooper Randall Vetter died from a gunshot wound he received four days earlier while conducting a traffic stop. Trooper Vetter had stopped a 72-year-old driver for not wearing a seatbelt. While he was sitting in his patrol car, the suspect exited his vehicle and opened fire with a rifle. The trooper was struck in the head. Trooper Vetter was able to return fire but did not hit the suspect. The suspect then used the patrol car's radio to say he shot the officer and then attempted to flee the scene. An off duty officer who was passing by, witnessed the shooting and alerted other officers. The suspect was then taken into custody after a brief standoff on the roadway. The suspect was known to local officers for claiming he would shoot any officer who tried to write him a ticket for not wearing a seatbelt. The suspect was convicted of murder and sentenced to life. He died in prison in 2008. Trooper Vetter had served with the Texas Department of Public Safety for six years. He is survived by his wife and eight-month-old son. |
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You read it right: "music lesson" I like to compose beats out of chinese sentences and upload them regularly at my facebook group "learn chinese with music" Lesson contents are specifically suitable for hsk3, hsk4 levels. This technique helps me a lot to retain words and their usages in sentences.
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Do you have anything to add to this page? Have we made any mistakes... or do you ahve any additional information about Robot Rampage? If so, we would love to hear from you. Please send us a quick note with your additions or corrections to this page, and we will make the corrections as soon as possible!
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Robot Rampage
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Nelvana Limited
Gordon Pinsent, Dawn Greenhalgh, Lea-Helen Weir, Bobby Becken, Stuart Stone, Lisa Yamanaka, Elizabeth Hanna, Chris Wiggins, Stephen Ouimette; Full Voice Cast ..
Jean de Brunhoff
- 1991
- Nelvana Limited
- Babar Episode Guide
- Cartoon Characters: King Babar, Queen Celeste, Flora, Pom, Alexander, Isabelle, The Old Lady, Cornelius, Pompadour, Uncle Arthur, Zephir, Rataxes, Lady Rataxes, Victor, Basil.
- Vocal Talent: Gordon Pinsent (King Babar), Dawn Greenhalgh (Queen Celeste), Lea-Helen Weir (Flora), Bobby Becken (Pom), Stuart Stone (Alexander), Lisa Yamanaka (Isabelle), Elizabeth Hanna (The Old Lady), Chris Wiggins (Cornelius), Stephen Ouimette (Pompadour), Paul Haddad (Uncle Arthur), Jeff Pustil (Zephir), Allen Stewart-Coates (as Allen Stewart Coates) (Rataxes), Corrine Koslo (Lady Rataxes), Noah Godfrey (Victor), John Stocker (Basil), Raymond Accolas, Tomy Bewick, Katie Coristine, Dan Hennessey, Keith Knight, Marsha Moreau, Greg Swanson, Peter Wildman.
- Written By Jean de Brunhoff (Original Books).
Submit Additional Information:
Cartoon Summary:
Arthur builds a flawed robot, but he will not admit his mistake. In trying to cover up the situation, things get out of control.
Cartoon Comments:
Do you love Robot Rampage, or do you think it is the worst cartoon ever? Let us know what you think! Surely you have an opinion... so share what you think. Take a minute and post your own comments about this cartoon here.


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Well i like Gundam better then DBZ im not a big fan of DBZ though..
I'm a DBZ fan and a friend of mine is a Gundam fan and he says it is alot better.
I think Gundam great but, I'm still a to the limit DBZ fan.
So, I was wondering what others thought.
Well i like Gundam better then DBZ im not a big fan of DBZ though..
Your signature image was found to exceed the maximum allowed size of 450x110.
ummm.....these two anime are not really related in any way but that they both are old and staples of anime development, you may find a better discussion of (Gundam vs Macross, which did more for the genre and which was beter) or (RahXephon vs Neon Genesis Evangelion, which is better) and for (which was better DB, DBZ, or DBGT?)
Predictable, gaint-fighting robots with over-used plots or repeated plots with drawn out climaxes that make worth missing 5 episodes while character developement is 0.
I'll pass at both. DBZ is neat at first but grows old quickly. Gundam is over-dramatic and the ideas have been used before. I liked the animation though--hated the dubs.
They're different worlds so you can't say one is better etc really. It's a matter of preference.
That is a good point and I think DB was good but, DBZ was the best.
Alright this is the same as a "What's your favorite?" thread except there are only two choices. Closing.


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Netflix working with cable companies as on-demand alternative?
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Read what other Viator.com travelers think about the Chiang Dao Elephant Jungle Trek and Ping River Rafting Tour from Chiang Mai. What they loved, what they liked and what they think could be improved, it's all here to help you make the most of your next trip.
Click here for tour details, schedule and pricing
The best experience in our Thailand's trip.
It was not only the unique ride on an elephants and ruffling but also professionalism, punctuality and hospitality of our guide Bua.
On the way back we were offered to stop in the tiger farm where you can get into the cage with tigers, pet them and make pictures to show your friends.
This was outstading!!! Our guide was fantastic! very informative and because we were the only ones on tour he took us to more places then advertised we went to the orchid garden and the tiger Kingdom. This was worth every penny
Excellent! Highly recommended. It was the highlight of our Chiang Mai trip.. The local lunch was also surprisingly good. I think it was the best meal I have had in a long time. Our tour guide hung around the camp waiting for us and was always looking out for us, telling us where to sit down to eat for the best view, or when to get on the raft so we could get started earlier etc.
This was fabulous. If you are wondering which trip to take, go on this one. Roong was terrific and very informative. The elephants are treated with respect and the honor they deserve. It is not a "circus-like" camp and I went away feeling like I saw the real deal. Lunch was fantastic. The float down the river was peaceful and unassuming. I am very happy I researched this trip and the result was exactly as I had anticipated. My only minor complaint is that I felt the Lisu Hill Tribe village visit was a bit staged. But, you should go into this trip knowing what you are doing......you are a tourist and this village earns its income from your visit. Do not miss out on this trip! Thank you Viator for your excellent follow-up, especially making sure you picked us up at our hotel!
Duluth, MN May 2012
Rocky Y
Elephant shows were very entertaining. Elephant "jungle trek" and Ping River rafting tour were enjoyable.
We really enjoyed this day. Saw the elephants in action and went for the ride for 90 mins through water and jungle. The food was fantastic. Staff friendly and helpful. The tour people stopped off at Tiger kingdom for us on the way back, which was nice of them to rearrange the buses for us. It was the best day and would recommend.
This was one of the high-spots of our trip to Thailand. It was very well organized; the guide was great; the transport comfortable; and the lunch extremely good. The elephant display was really interesting and had just the right amount of show-biz about it. The trek on the elephant to the village was just long enough and gave us what a taste of what it would be like to go a long distance on elephant back.
The rafting tour was fun too, and relaxing.
We had an unscheduled stop at Tiger Kingdom because several people had asked the guide about it and it was on the way. That was excellent too, and the animals are in splendid condition.
Was awesome...
This trip was excellent. The trek through the jungle area didn't feel commercial at all and we got about an hour trek. It was also great to feed the elephants and watch them bathe. Unlike the picture we didn't get to wade through the water on the elephants but we did enjoy the rafting down the river which was very peaceful.
Fantastic adventure, I would recommend this trip to anyone staying in the Chiang Mai area. It was a full day adventure worth every penny. Very well organized from start to finish.
I would recommend light clothing and sandels and don't forget your hat and sunscreen!
Susan S
United Kingdom
Fantastic day out, loved the elephant ride and the rafting trip, lunch was surprisingly good. Would recommend this to everyone. Thanks viator.
United Kingdom
A wonderful day with the elephants, seeing them demonstrate how they were used for logging etc, and not playing football (previous other elephant tours had this sadly!). Watching them enjoy their food, lots of it!, being cleaned and the best of all a lovely ride through the jungle on the elephant with a great finale down the river. Pleasant river raft to finish. Many thanks, would recommend to anyone.
Karen Y
This was a highlight of our Thailand trip. What a great experience... The elephant ride and rafting was wonderful. Lunch was delicious.
Alan B
United Kingdom
This was our favourite excursion!! 'A must do' if you intend Elephant Trekking, this particular one must rate higher than any other, set in the National Park, the elephants were well looked after and appeared contented. Nong our guide was informative and quite the comedian, more than happy to go along with our requests, visiting Tiger Kingdom on our return journey. Lunch was very good with plenty to eat. HIGHLY RECOMMENDED. Thanks.


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The Outspoken Apple Doesn't Fall Far From The Tree: Madonna's 13-year-old daughter Lourdes is hoping to convince her icon mom that she's mature enough to live on her own.Lourdes, also known as Lola, is planning to become an entertainer, just like her famous mother and has her heart set on earning emancipation from her [...] Continue reading Madonna's Daughter Moving Out? Lourdes Leon Wants Own Apartment
Tag Archive: leon
Lourdes Leon has landed her first ever magazine cover. European mag Quality seems to think the 13-year-old Madonna Mini-Me has already got enough star power in her own right – giving Lourdes what is believed to be her very first cover-star moment! Continue reading Lourdes Leon Quality Magazine Cover


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05/14/2014 | Petition to Expand RFID Use on 70 Centimeters Withdrawn
A Petition for Rule Making that would have expanded RFID use on 70 centimeters has been withdrawn by its sponsor and dismissed by the FCC..
Learn More -
10/31/2013 | FCC Fines CBer for Operating Illegal Transmitter With Linear
The FCC has fined an Alaska CBer $500 for operating a non-certificated transmitter with a linear amplifier.
Learn More -
10/24/2013 | FCC Fines Former Radio Amateur for Unlicensed Operation on 20 Meters
A former Missouri ham has been fined by the FCC for operating without a license.
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Sure enough, Samsung has branched out its Galaxy S5 line beyond the original flagship, adding new members to its clan. Get to know them here.
The virtual currency has expanded beyond Kindle owners to all Android users in the United States and elsewhere.
The New York-based startup "builds social products to empower conversation" and is backed by an incubator that former Twitter bigwigs Evan Williams and Biz Stone created.
He's brought us silly videos of animals and hilarious shots to the groin for over a decade. Now it's time for payback, and all Fark.com founder Drew Curtis asks in return is your vote.
BlackBerry says it has not engaged in discussions with Samsung, while Samsung called the report "groundless."
At CES 2015, the device-maker lays out plans to go way, way beyond its smartphone persona and into gadgets for health and home.
Cricket throws its once baked-in limitless music service out the window in favor of an upgraded offering for $6 per month.
Instead of renting one title at a time for a set period of time, subscribers will have access to a full array of titles.
The restaurant's branch in Brooklyn has a very modern festive idea. Until the drone goes off course and strikes a photographer in the face.
More than 50 staff are affected by the closure of the Samsung Experience store in Westfield Stratford City.


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Shane O'Neill's CLG © 2014
Cairde Sheáin Uí Néill of Shane O'Neill's, are people who have a strong belief and a firm committment to the Camloch area and its people.
We believe Camloch is an important place… because its our place. We believe its young people are important ….. because they're our young people. Above all we believe that a hugely important contributor to the life and wellbeing of our young people is the Shane O'Neill's GAA Club.
Like the rest of Ireland, our local area changes on a daily basis. Not all that change is good and our young people in particular face new and growing pressures and difficulties.
We unashamedly see Cumann Sheáin Uí Néill and our delivery of gaelic games as a bulwark against those pressures and difficulties. Everything we do at the club is aimed at:
The work we do – or don't do – now will shape the Shane O'Neill's of the future. And that is something vitally important for all of us.
" Mura gcuirfidh tú san earrach,
Ní bhainfidh tú san fhómhar "
All the work we deliver as a club at Shane O'Neill's and elsewhere is provided on
a voluntary basis. We are GAA people because we believe in the GAA and because we
believe in the well-
But building and maintaining a club like ours costs money. Volunteer effort isn't enough on it's own. That's where Cairde Sheáin Uí Néill (The Friends of Shane O'Neill's) comes in.
Cairde S.O.N members agree to contribute £10 per month, for a set period or open-
We won't use your money for our day-
" Bígí linn is cuidigh linn "
Download the 'Standing Order Form' below and return it to:
Brendan Osborne
29, Lisdarragh
Armagh Road
Newry Co.Down
(028) 30251254 or 07543806274


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I was extremely disappointed with this purchase because it looks so cute in the photo. It said that the legs have wire in them so I thought the legs would look like they do in the photo. But no...they just hang down. You cannot tell what this even is. She looked more like a car wash than a spider. We had to buy a different costume because we were so disappointed.
Never received�was out of stock & I had to call to find this out. Cancelled order
I liked the costume, and it is hard to find one to fit my 85 pound golden retriever, and it was new and different. What disappointed me was that I couldn't manipulate the arms as was advertised.
Sign into your EntirelyPets Account for the best experience!


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Oragenics-Intrexon Collaboration Announces Significant Progress Towards Commercial Production Of Lead Lantibiotic MU1140
Oragenics, Inc. (OTCBB: OGEN) announced today that its Exclusive Channel Collaboration (ECC) with Intrexon Corporation, a synthetic biology company, has produced an exponential increase in the fermentation titer of the target compound MU1140 and the discovery of a promising new purification process for this product. This demonstrates significant progress toward the commercial production of its lead lantibiotic, MU1140, and delivers an important step in validating the lantibiotics platform targeting infectious diseases. Oragenics and Intrexon have been working together through the ECC to produce a pipeline of new lantibiotics that have been shown to be active against essentially all Gram-positive pathogens, including vancomycin-resistant enterococci (VRE), Clostridium difficile, methicillin-resistant Staphylococcus aureus (MRSA), as well as multi-drug resistant strains of Mycobacterium tuberculosis.
"The ability to manufacture MU1140 by fermentation was originally thought not to be commercially feasible due to low titers and difficulties in purification. The Oragenics-Intrexon ECC clearly shows that the application of specific expertise in these areas represents a breakthrough by developing a potentially viable commercial process for these important anti-infective agents," stated Dr. John N. Bonfiglio, Chief Executive Officer of Oragenics. In addition to the optimization of fermentation and purification strategies, Oragenics and Intrexon are working to leverage Intrexon's genetic and cell engineering expertise to produce analogs of MU1140 and a pipeline of new lantibiotics. "We believe the newly developed process will provide for the first time, the necessary quantities of MU1140 to complete critical development activities," added Dr. Bonfiglio.
About Oragenics, Inc.
Oragenics, Inc. is focused on becoming the world leader in novel antibiotics against infectious disease and probiotics for oral health for humans and pets. Oragenics, Inc. has established an exclusive worldwide channel collaboration for lantibiotics, a novel class of broad spectrum antibiotics, with Intrexon Corporation Inc., a synthetic biology company. The collaboration will allow Oragenics access to Intrexon's proprietary technologies with the idea of accelerating the development of much needed new antibiotics that will work against resistant strains of bacteria. Oragenics also develops, markets and sells proprietary probiotics specifically designed to enhance oral health for humans and pets, under the brand names Evora and ProBiora in over 13 countries worldwide.
For more information about Oragenics, visit www.oragenics.com. Follow Oragenics on Facebook and Twitter. Safe Harbor Statement: Under the Private Securities Litigation Reform Act of 1995: This release includes forward-looking statements that reflect the Company's current views with respect to future events and financial performance. These forward-looking statements are based on management's beliefs and assumptions and information currently available. The words "believe," "expect," "anticipate," "intend," "estimate," "project" and similar expressions that do not relate solely to historical matters identify forward-looking statements. Investors should be cautious in relying on forward-looking statements because they are subject to a variety of risks, uncertainties, and other factors that could cause actual results to differ materially from those expressed in any such forward-looking statements. These factors include, but are not limited to our ability to raise additional capital to sustain our operations beyond June 30, 2012 and those set forth in our most recently filed annual report on Form 10-K and quarterly report on Form 10-Q, and other factors detailed from time to time in filings with the U.S. Securities and Exchange Commission. We expressly disclaim any responsibility to update forward-looking statements.Check Out Our Best Services for Investors
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