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CURT Manufacturing's Spyder gooseneck hitches are designed to mount to all standard fifth wheel rails. Their easy four locking pin installation and removal allows for full access to your truck bed. Their durable Evergloss powdercoated finish resists rust and corrosion. These hitches have a 25K towing capacity, safety chain hookups, and a 2 5/16 in. trailer ball.
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Gooseneck Hitch, Carbide, Bed Mount, 2 5/16 in. Ball, Each
Part Number: CHT-16085 More Detail...
Estimated Ship Date: Monday 2/2/2015
Order this item and get free delivery and handling on your entire order! Oversize fees also waived on this item. Valid on orders shipped in the contiguous United States.
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Subatmospheric gas storage and delivery: Past, present and future
Thu, 6 Jun 2014Storing gas on a sorbent provides an innovative, yet simple and lasting solution.
Flexible glass firms branch into new applications
Sun, 6 Jun 2014Ultrathin glass is well suited for use as interposers in semiconductor packaging applications.
Noise cancellation: The new failure and yield analysis superpower
Sun, 6 Jun 2014Root cause deconvolution is a quick and cost effective way to determine the underlying root causes represented in a population of failing devices from test data alone.
UC Riverside to lead new energy frontier research center project
Wed, 6 Jun 2014SHINES will investigate several aspects of basic research: new ultrathin films, nanostructured composites, high resolution imaging, the transport of electrical signals, heat and light.
ConFab panelists discuss optimizing R&D in the changing semi landscape
Tue, 6 Jun 2014Overheard @The ConFab: "I feel the best I've felt about semi since 2009." –Mike Noonen, Silicon Catalyst
Breakthrough research in the semiconductor industry
Mon, 6 Jun 2014Research forms the DNA of the semiconductor industry — few other industries invest as much as a percentage of revenue.
EVG clears key barriers to 3DIC/TSV HVM with fusion wafer bonding solution
Mon, 6 Jun 2014EV Group today unveiled the GEMINI FB XT—its next-generation fusion wafer bonding platform, which combines several performance breakthroughs to move the semiconductor industry closer to the goal of high-volume manufacturing (HVM) of 3D-ICs with through-silicon vias (TSVs).
Solid State Equipment wins 2014 3D InCites Award for WaferEtch TSV Revealer
Tue, 7 Jul 2014Solid State Equipment LLC (SSEC), a provider of single-wafer wet processing systems for advanced packaging (including 2.5D and 3D ICs), MEMS, and compound semiconductor markets, was awarded a 2014 3D InCites Award in the category of 2.5D/3D Manufacturing Equipment.
Compact vibration harvester power supply with highest efficiency opens door to "Fix-and-Forget" sensor nodes
Wed, 7 Jul 2014OMRON and Holst Centre/imec have unveiled a prototype of an extremely compact vibrational energy harvesting DC power supply with worlds' highest efficiency.
A new multi-bit 'spin' for MRAM storage
Wed, 7 Jul 2014Interest in magnetic random access memory (MRAM) is escalating, thanks to demand for fast, low-cost, nonvolatile, low-consumption, secure memory devices. MRAM, which relies on manipulating the magnetization of materials for data storage rather than electronic charges, boasts all of these advantages as an emerging technology, but so far it hasn't been able to match flash memory in terms of storage density.
Superfast stress inspection for overlay control
Mon, 7 Jul 2014Tighter overlay requirements are motivating device manufacturers to explore new ways to characterize and manage overlay to improve yield.
Taking great ideas from the lab to the fab
Tue, 8 Aug 2014NSF and Intel support the development of domain-specific hardware to address health care needs.
SRC, UC Davis explore new materials and device structures to develop next-generation "Race Track Memory" technologies
Tue, 8 Aug 2014University of California, Davis researchers sponsored by Semiconductor Research Corporation (SRC), a university-research consortium for semiconductors and related technologies, are exploring new materials and device structures to develop next-generation memory technologies.
MEMSIC introduces the world's first monolithic and wafer level packaged 3D-axis accelerometer
Fri, 8 Aug 2014MEMSIC, Inc., a MEMS sensing solution provider, announced today the availability of its MXC400xXC, the world's first monolithic 3D accelerometer, and also the first 3D accelerometer to utilize WLP technology.
Renesas Electronics expands portfolio of Simple Power Supply ICs
Wed, 8 Aug 2014Renesas Electronics America, a leading supplier of advanced semiconductor solutions, today expands its portfolio of Simple Power Supply ICs, with innovative 16V input capable synchronous buck regulators that deliver up to 3A continuous current to loads at voltages as low as 0.8V.
Renasas introduces new package for safety systems for industrial equipment
Tue, 8 Aug 2014Renesas Electronics Corporation, a supplier of advanced semiconductor solutions, today announced that it has obtained IEC 61508 (Functional Safety) certification for the RX631, RX63N Safety Package.
Scientists craft a semiconductor only three atoms thick
Wed, 8 Aug 2014Scientists have developed what they believe is the thinnest-possible semiconductor, a new class of nanoscale materials made in sheets only three atoms thick.
Samsung adopts ProPlus Designs' 14nm finFET process
Wed, 9 Sep 2014ProPlus Design Solutions, Inc. today announced Samsung Electronics has extended its partnership with ProPlus through the deployment of ProPlus' BSIMProPlus modeling platform for its 14-nanometer (nm) FinFET SPICE modeling.
Contour Semiconductor awarded three new U.S. patents
Thu, 9 Sep 2014Contour Semiconductor, Inc., a developer of non-volatile memory technologies, today announced it has been awarded three new patents to back its Diode Transistor Memory (DTM) technology, the world's lowest production-cost, non-volatile memory technology.
UCSB researchers develop ultra sensitive biosensor from molybdenite semiconductor
Thu, 9 Sep 2014Move over, graphene. An atomically thin, two-dimensional, ultrasensitive semiconductor material for biosensing developed by researchers at UC Santa Barbara promises to push the boundaries of biosensing technology in many fields, from health care to environmental protection to forensic industries.
Cree SiC MOSFETs help power Japan's growing solar energy infrastructure
Mon, 9 Sep 2014Cree, Inc. has announced that its C2M, 1200V, 80mOhm SiC MOSFETs have been selected by Sanix Corporation, Japan, to be designed into their new 9.9kW three-phase solar inverters for use in the construction of commercial photovoltaic systems in the fast-growing Japanese solar energy market.
Doped graphene nanoribbons with potential
Mon, 9 Sep 2014Researchers from Empa and the Max Planck Institute for Polymer Research have now developed a new method to selectively dope graphene molecules with nitrogen atoms.
GLOBALFOUNDRIES and SRC announce new scholarship for undergraduate engineering students
Tue, 9 Sep 2014GLOBALFOUNDRIES, a provider of advanced semiconductor manufacturing technology, today announced the "GLOBALFOUNDRIES Undergraduate Research Scholarship," a new scholarship recognizing and rewarding aspiring, leadership-oriented engineering students interested in careers in the semiconductor industry.
Fermilab implements Ziptronix's DBI hybrid bonding in high-end 3D image sensors
Tue, 9 Sep 2014Ziptronix Inc. today announced that its Direct Bond Interconnect (DBI) hybrid bonding has been implemented by Fermi National Accelerator Laboratory (Fermilab) to improve the performance of high-end 3D sensor arrays, which are used for particle detection in large-scale particle physics and x-ray imaging experiments.
A fundamental truth of process control
Tue, 9 Sep 2014You can't fix what you can't find. You can't control what you can't measure.
Samsung now mass producing industry's first 20nm 6Gb LPDDR3 mobile DRAM
Thu, 9 Sep 2014The new mobile memory chip will enable longer battery run-time and faster application loading on large screen mobile devices with higher resolution.
For electronics beyond silicon, a new contender emerges
Thu, 9 Sep 2014Silicon has few serious competitors as the material of choice in the electronics industry. Yet transistors, the switchable valves that control the flow of electrons in a circuit, cannot simply keep shrinking to meet the needs of powerful, compact devices; physical limitations like energy consumption and heat dissipation are too significant.
NSF and SRC announce research awards to 10 universities
Tue, 9 Sep 2014The National Science Foundation (NSF) and Semiconductor Research Corporation (SRC) today announced nine research awards to 10 universities totaling nearly $4 million under a joint program focused on Secure, Trustworthy, Assured and Resilient Semiconductors and Systems (STARSS).
Future flexible electronics based on carbon nanotubes
Wed, 9 Sep 2014Study in Applied Physics Letters show how to improve nanotube transistor and circuit performance with fluoropolymers
TSMC delivers first fully functional 16 finFET networking processor
Mon, 9 Sep 2014TSMC today announced that its has successfully produced the foundry segment's first fully functional ARM-based networking processor with FinFET technology, through its collaboration with HiSilicon Technologies Co, Ltd.
A new dimension for integrated circuits: 3D nanomagnetic logic
Tue, 9 Sep 2014Electrical engineers at the Technische Universität München (TUM) have demonstrated a new kind of building block for digital integrated circuits.
New technology may lead to prolonged power in mobile devices
Tue, 9 Sep 2014Researchers from The University of Texas at Dallas have created technology that could be the first step toward wearable computers with self-contained power sources or, more immediately, a smartphone that doesn't die after a few hours of heavy use.
FlipChip International creates 250 multi-product wafer bump designs
Wed, 10 Oct 2014FlipChip International (FCI), the global technology leader in flip chip bumping and advanced wafer level packaging, announced that their engineering team had completed design and production of the 250th Multi-Product Wafer Bump design since January 2013.
Albert Theuwissen of Harvest Imaging honored with European SEMI Award 2014
Wed, 10 Oct 2014Albert Theuwissen, CEO of Harvest Imaging and professor at Delft University of Technology, is the recipient of the European SEMI Award 2014.
Managing oxide growth on in-process storage wafers for cost and yield impact
Mon, 10 Oct 2014A system is described that mitigates unintended oxide growth for bare wafers while in-process storage and potentially post process at tools using nitrogen purge.
Element Six introduces new thermal grade of CVD diamond
Wed, 10 Oct 2014Element Six this week announced the development of a new thermal grade of diamond grown by chemical vapor deposition (CVD), DIAFILM TM130.
Intel and IBM to lay out 14nm FinFET strategies on competing substrates at IEDM 2014
Thu, 10 Oct 2014The development of increasingly sophisticated and energy-efficient CMOS technology for mobile, client and cloud computing depends on a continuing stream of advances in the process technologies with which the complex integrated circuits are built.
Samsung starts mass production of 8Gb DDR4 based on 20nm process technology
Wed, 10 Oct 2014Samsung today announced that it is mass producing the industry's most advanced 8-gigabit (Gb) DDR4 memory and 32-gigabyte (GB) module, both of which will be manufactured based on a new 20-nanometer (nm) process technology, for use in enterprise servers.
Imec, Coventor partner to advance CMOS process development
Tue, 10 Oct 2014Imec researchers using Coventor's SEMulator3D platform to model and optimize 7nm manufacturing technology.
'Nanomotor lithography' answers call for affordable, simpler device manufacturing
Tue, 11 Nov 2014Nanoengineers at the University of California, San Diego recently invented a new method of lithography in which nanoscale robots swim over the surface of light-sensitive material to create complex surface patterns that form the sensors and electronics components on nanoscale devices.
Kandou introduces in-package chip interconnect enabling lower cost semiconductor solutions
Tue, 11 Nov 2014Kandou Bus has announced the Glasswing family of chip interconnects targeted for in-package chip-to-chip links.
Applied Materials develops advanced patterning solution for memory devices
Mon, 11 Nov 2014Applied Materials, Inc. today announced it collaborated with Samsung Electronics Co., Ltd. and PSK Inc., a Korea-based leader in photoresist removal, to develop an advanced patterning solution for the manufacture of future generations of NAND and DRAM device designs.
Hybrid Memory Cube Consortium releases new specification
Mon, 11 Nov 2014The Hybrid Memory Cube Consortium (HMCC), dedicated to the development and establishment of an industry-standard interface specification for Hybrid Memory Cube (HMC) technology, today announced the finalization and public availability of its HMCC 2.0 specification (HMCC 2.0).
Soitec announces new world record for solar cell efficiency at 46%
Wed, 12 Dec 2014The record multi-junction solar cell converts 46 % of the solar light into electrical energy.
Intel announces IoT platform
Thu, 12 Dec 2014Intel Corporation today announced the Intel IoT Platform, an end-to-end reference model designed to unify and simplify connectivity and security for the Internet of Things (IoT).
Leti will discuss CoolCube technology for 3D transistor stacking at workshop preceding IEDM 2014
Thu, 12 Dec 2014CEA-Leti will present its latest results on CoolCube, the technique for stacking transistors sequentially in the same process flow for 3D-VLSI, at a Dec. 14 workshop in San Francisco, Calif.
Laser spike annealing resolves sub-20nm logic device manufacturing challenges
Thu, 12 Dec 2014LSA technology plays an enabling role to overcoming manufacturing challenges for sub-20nm logic devices.
From transistors to bumps: Preparing SEM cross-sections by combining site-specific cleaving and broad ion milling
Thu, 12 Dec 2014Cross section sample preparation is demonstrated using a workflow that combines High Accuracy Cleaving I(HAC) and Broad Ion Beam (BIB) milling.
ON Semiconductor demonstrates high efficiency 3D sensor stacking technology
Tue, 1 Jan 2015ON Semiconductor has successfully characterized and demonstrated its first fully-functional stacked CMOS imaging sensor featuring a smaller die footprint, higher pixel performance and better power consumption compared to traditional monolithic non-stacked designs.
Silicon Space Technology partners with GLOBALFOUNDRIES to deliver processors and memory solutions
Fri, 1 Jan 2015Silicon Space Technology, an industry innovator in high-temp and rad-hard embedded system solutions, announced today the company has partnered with GLOBALFOUNDRIES to build commercial-ready products for extreme environments and applications.
Samsung Electronics starts mass producing industry's first 8-gigabit graphics DRAM
Thu, 1 Jan 2015Samsung Electronics Co., Ltd. announced today that it has begun mass producing the industry's first 8 gigabit (Gb) GDDR5 DRAM, based on the company's leading-edge 20-nanometer (nm) process technology.

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International Programs at KUMC
International Programs > Programs and Events > Global Connections Program
International Programs > Programs and Events > Global Connections Program
Application (PDF)
Please email your application to firstname.lastname@example.com or bring it to the Office of International Programs, 5010 Wescoe.
Global Connections is a service offered by the Office of International Programs that connects you with a partner on campus or in the community who shares an interest in developing multi-cultural awareness. Sharing information and experiences about culture and language, history, values and lifestyles through Global Connections will help you meet new people, grow as an individual, prepare for and adapt to international experiences and increase your understanding of the world.
a. Connect students who have completed an international educational experience with students who will be going to the same country
b. Connect internationals to the local population for language and culture exchange purposes


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Robot Actress Makes Stage Debut In Japan
Re:Scary (140 comments)
In games it's a matter of level of detail though (either for the CPU/memory or simply workload for the animators). A body skeleton typically consists of around 30 bones. If two hands with 5 fingers get 3 bones extra that doubles the load for relatively little effect. For a single player character it's still worth it. For NPCs it typically does not make the cut.
In animation each bone typically has 6 degrees of freedom so it is no problem to copy any hand movement. Doing the same with servos in robots at a natural speed and in a coordinated manner is a lot harder.


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Gourmet | June 1994
The dressing was very bitter. Ended up adding some orange flavored olive oil and orange flavored vinegar to thin it out and cut out some of the bitterness.
Many layers of taste. Perfect with falafel.
28 reasons why doughnuts (and doughnut holes)baked or fried, glazed or dustedare perfect morning, noon, and night
plus: everything you need to know about making doughnuts at home ›
Get the inside dish on 10 restaurants Parisians don't want you to know about
plus: Over 1,300 recipes à la Française to cook at home ›


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This police adventure game features a unique visual style and the deep voice of Jon St. John.
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America's got superpowers and they can be found in this game.
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The developers take us through a level of the upcoming game, 40 zombies.
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See what's new in the unique RTS, Freaking Meatbags.
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Steam Heroes brings the excitement of a match-3 game and adds an RPG twist.
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Check out the varied environments found in Vektor Wars.
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Hug the turns in this exciting track found in Ride.
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Drive Any Track is a high octane music based racing game where racetracks are created from the songs in your music library.
Views: 248 | Posted: 01/30/2015
Guide Pix through multiple levels to rack up the score and best your friends' times.
Views: 152 | Posted: 01/30/2015
Get the cheese and bring it home in this "free-to-win" platformer, featuring hats!
Views: 323 | Posted: 01/30/2015
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The most popular Heroes title of all time is back in HD! Re-live the epic tale of Queen Catherine Ironfist, as she...
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Don your cape and mask and join the Supreme League of Patriots in this hilarious and irreverent superhero comedy...
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Life is Strange is a five part episodic game that allows the player to rewind time and affect the past, present and...
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Hektor is a first-person, psychological horror game where nothing ever stays the same for long.
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The Witcher series has expanded into open-world monster hunting territory with its latest iteration. Expect plenty...
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Built with the same high quality and dependability that Spro is known for, the Spro Three Way Swivels deliver reliable performance that anglers can trust. Designed with three points-of-contact, the Spro Three Way Swivels reduce line twists and provide secure connection for any presentation where three lines are needed.
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