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By PR Newswire | Article Rating: |
February 3, 2014 02:00 AM EST | Reads: |
685 |
-- Innovative, integrated solutions and emphasis on market education helps IBM expand its market share in the region
CAPE TOWN, South Africa, Feb. 3, 2014 /PRNewswire/ -- Based on its recent research on the big data solutions market, Frost & Sullivan has presented IBM (NYSE:IBM) with the 2014 Sub-Saharan African Frost & Sullivan Award for Competitive Strategy Leadership. While most companies in Sub-Saharan Africa already undertake various forms of data analytics, one of the key challenges facing big data solutions providers is convincing companies of the longer-term pay-offs resulting from effective big data implementation. Uneven market maturity and a shortage of skilled personnel are other issues specific to the region. IBM has employed a Big Data and Analytics strategy that effectively addresses these challenges, making it a leading local market player.
IBM is already a dominant player in the emerging global big data market and the uptake of its solutions in Sub-Saharan Africa has followed a similar vein across a broad range of industries. To meet growing client demands, IBM has established the world's deepest portfolio of Big Data and Analytics research and development, solutions and software, and assembled a strong team of researchers, mathematicians, data scientists, as well as strategy, analytics and design services consultants. In addition, the company continues to secure numerous patents related to Big Data and Analytics and engage a broad range of university partnerships.
"Competition amongst IT integrators is intense, but one of IBM's key advantages is its ability to provide the full spectrum of big data services – from the infrastructure and hardware aspects through to analytics and visualisation," noted Frost & Sullivan Senior Industry Analyst Gareth Mellon. "This is something that most competitors do not have the capability to offer, particularly in Sub-Saharan Africa."
IBM's ability to partner with specific industry providers at different points in the big data value chain has further entrenched the broad scope of its portfolio and allowed it to offer customisable solutions throughout the market.
Recognising that a viable cost-benefit analysis is critical to achieving big data solution buy-in, IBM has also been purposeful in its efforts to educate the market of the value it can derive from effective big data solutions. This awareness is created through the provision of training materials and online resources, the publication of numerous reports and case studies, and committed involvement with high-profile projects.
"IBM's ability to facilitate integration between the various threads of a business has been critical to its big data solutions offering," added Mellon. "As such, it has both leveraged and reinforced existing market perceptions of it as a leading ICT integrator."
The company's Big Data and Analytics solutions strategy maintains its emphasis on innovation. For instance, IBM is a leading player in the Square Kilometer Array (SKA) project which has significant and highly advanced "big data" requirements. The SKA is an international effort to build the world's largest and most sensitive radio telescope, to help better understand the history of the universe. IBM also continues to build on its renowned Watson cognitive computing system, which is able to draw on big data techniques to provide evidence-based responses.
On the skills side, IBM has gone to considerable lengths to ensure an ongoing supply of skilled personnel in Africa through its establishment of Innovation Centres – it now has three on the continent, with plans to open two more during 2014 – and the provision of online platforms such as 'big data bootcamps' and bigdatauniversity.com.
Numerous case studies testify to the uptake of IBM's solutions by a vast range of companies including banks, insurance providers, petroleum suppliers, healthcare providers, telecommunications operators, research bodies, and various government-related entities. Most recently, IBM announced a partnership with the Union for International Cancer Control (UICC) through which it will establish a comprehensive database of cancer patients in Africa and use big data tools to effectively utilise this information.
An additional opportunity stemming from the rise of big data solutions is the link with smart cities, an emerging field in which IBM has already developed strong competency and is recognised as a 'leading game changer.' See Frost & Sullivan's "Strategic Opportunity Analysis of the Global Smart City Market" (August 2013). Smart cities are characterised by the integration of millions of smart devices and the coordination of businesses, the public sector, knowledge institutions, and a city's inhabitants to produce real-time solutions and services. Effective big data solutions underpin such developments and, while smart cities are not yet a feature of the African landscape, IBM is well-positioned to play a leading role in their establishment on the continent.
Frost & Sullivan's research confirms that IBM has established a compelling case for the adoption of its solutions in Sub-Saharan Africa. In recognition, Frost & Sullivan is pleased to present IBM with the 2014 Competitive Strategy Leadership Award within the Sub-Saharan African big data solutions market.
Each year, Frost & Sullivan presents this award to the company that has leveraged competitive intelligence to successfully execute a competitive strategy that results in stronger market share, competitive brand positioning and customer satisfaction.
Frost & Sullivan's Best Practices Awards recognise companies in a variety of regional and global markets for demonstrating outstanding achievement and superior performance in areas such as leadership, technological innovation, customer service, and strategic product development. Industry analysts compare market participants and measure performance through in-depth interviews, analysis, and extensive secondary research in order to identify best practices in the industry.
About IBM Big Data & Analytics
Each day we generate 2.5 quintillion bytes of data from a variety of sources -- climate information, to posts on social media sites, and purchase transaction records to healthcare medical images. At IBM we believe that data is emerging as the world's newest resource for competitive advantage, and analytics is the key to make sense of it. IBM is helping clients harness Big Data & Analytics to provide insights needed to make better decisions, create value, and deliver that value to customers and society. IBM has the world's deepest and broadest portfolio of Big Data & Analytics technologies and solutions, spanning services, software, research and hardware. For more insights on Big Data & Analytics visit IBM's Smarter Planet blog.
IBM Media Contact:
Lisa Rautenbach
External Relations Manager
E: email@example.com
T: @IBMbigdata and @IBMAnalytics.
For more information about IBM Big Data & Analytics and IBM in Africa
About Frost & Sullivan
Frost & Sullivan, the Growth Partnership Company, works in collaboration with clients to leverage visionary innovation that addresses the global challenges and related growth opportunities that will make or break today's market participants.
Our "Growth Partnership" supports clients by addressing these opportunities and incorporating two key elements driving visionary innovation: The Integrated Value Proposition and The Partnership Infrastructure.
- The Integrated Value Proposition provides support to our clients throughout all phases of their journey to visionary innovation including: research, analysis, strategy, vision, innovation and implementation.
- The Partnership Infrastructure is entirely unique as it constructs the foundation upon which visionary innovation becomes possible. This includes our 360 degree research, comprehensive industry coverage, career best practices as well as our global footprint of more than 40 offices.
For more than 50 years, we have been developing growth strategies for the global 1000, emerging businesses, the public sector and the investment community. Is your organisation prepared for the next profound wave of industry convergence, disruptive technologies, increasing competitive intensity, Mega Trends, breakthrough best practices, changing customer dynamics and emerging economies?
Contact Us: Start the discussion
Subscribe: Newsletter on "the next big thing"
Register: Gain access to visionary innovation
Samantha James
Corporate Communications – Africa
Frost & Sullivan
E: firstname.lastname@example.com
Published February 3, 2014 Reads 685
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text:
Memphis to Manchester (Music)
With John Wendland
Thu Jan 2nd 2014 7.00am–10.00am
R=listener request. N=music new at the station. L=local music. Your purchases using the Buy it! links
Time zone: central
7:02am | Barrence Whitfield and The Savages "I'm Sad About It" from Dig Thy Savage Soul (Bloodshot www.bloodshotrecords.com 2013) —Happy New Year, everybody. This show will be a recap of some of my favorite things I heard in 2013. - This is an incendiary cover version of a Lee Moses song.Buy it! |
7:05am | The James Hunter Six "Heartreak" from Minute By Minute (Concord 2013) —Written by James Hunter and produced by Bosco Mann of the Dap-Kings. Not just a terrific album in 2013 but a terrific live show at the Old Rock House, as well.Buy it! |
7:09am | Sharon Jones & The Dap-Kings "Stranger To My Happiness" from Give The People What They Want (Daptone 2014) N —This album doesn't come out until 2014 but this single from the record came out in 2013. They will be at the Pageant in March (Sunday 3/2) with Valerie June opening. Not to be missed.Buy it! |
7:13am | The Budos Band "My Girl" from The Budos Band II (Daptone 2007) —Music bed. Instrumental and funked up version of the Motown classic written by Smokey Robinson.Buy it! |
7:15am | Laura Mvula "Green Garden" from Sing to the Moon (RCA Victor 2013) —Debut full-length album from the artist based out of Birmingham, UK. This is one of my favorite singles of the year. She's hard to categorize. She's as much influenced by Brian Wilson as she is soul and gospel.Buy it! |
7:19am | Valerie June "On My Way Home" from Pushin' Against a Stone (Concord 2013) —Another artist that isn't easy to categorize. She can sound country and/or Appalachian on one song and like a down and dirty blues singer on the next. She wrote this song with Booker T. Jones who also plays organ and provides backing vocals.Buy it! |
7:22am | Buddy & Julie Miller and the McCrary Sisters "Something Within" from The Oxford American Southern Music CD (Oxford American 2013) —The southern music edition of Oxford American magazine that also comes with a 2-CD compilation is always one of the year's musical highlights. This collection featuring music from TN is one of their best, yet. This was recorded specially for this issBuy it! |
7:25am | Booker T. "Austin City Blues (feat. Gary Clark Jr.)" from Sound the Alarm (Stax Records url 2013) —Music bed. Instrumental written by Booker T. Jones.Buy it! |
7:28am | Booker T. "Your Love Is No Love (feat. Vintage Trouble)" from Sound the Alarm (Stax Records url 2013) —This album is too uneven for me to consider it one of the best albums of the year but this track co-written by Booker T. and Vintage Trouble with an exceptional vocal by Ty Taylor is a definite highlight.Buy it! |
7:32am | Garland Jeffreys "It's What I Am" from Truth Serum (Thirty Tigers www.thirtytigers.com 2013) —This song will never make any Pitchfork top 50 list. OK, so tell me what on their list has this much soul?Buy it! |
7:37am | Mavis Staples "I Like the Things About Me" from One True Vine (Anti- 2013) —Written by Pops Staples and Martha Stubbs and produced by Jeff Tweedy. Backing vocals by Kelly Hogan, Liam Cunningham, Donny Gerrard, and Tiffany "Makeda" Francisco.Buy it! |
7:41am | Ennio Morricone "Muchio Selvaggio" from Action! 15 Cult Movie Classics (Mojo 2013) —Music bed. 1973 instrumental written by Ennio Morricone and found on this 2013 compilation of songs from cult movie soundtracks.Buy it! |
7:44am | Gregory Porter "Hey Laura" from Liquid Spirit (Blue Note 2013) —Composed and sung by Gregory Porter. Just a sublime vocalist.Buy it! |
7:46am | Julia Holter "Hello Stranger" from Loud City Song (Domino 2013) —This Barbara Lewis cover slowly unfolds into a thing of majestic beauty.Buy it! |
7:52am | Dengue Fever "Taxi Dancer" from Girl from the North EP (Tuk Tuk Records 2013) N —New three-song EP from the band out of Los Angeles that mixes up Cambodian pop, surf, Ethiopian jazz, rock, and more. Such a great groove on this.Buy it! |
7:57am | Mulatu Astatke "Yekermo Sew" from Ethiopiques 4 - Ethio Jazz & Musique Instrumentals 1969-74 (Buda Musique 1998) —Music bed. 1969 Ethiopian jazz instrumental composed by Mulatu Astatke.Buy it! |
8:03am | Sam Phillips "You Know I Won't" from Push Any Button (Littlebox Recordings 2013) —This was on my top 10 favorite albums of 2013 list. She never disappoints. This is a great slice of jangly, Beatlesque pop.Buy it! |
8:05am | Grace Basement "Warmest Winter Clothes" from Wheel Within A Wheel (Avonmore 2013) L —Written and sung by Kevin Buckley. Lots of really fine songs on this album from the band based out of St. Louis.Buy it! |
8:07am | Villagers "Earthly Pleasure" from (Domino Recording Co Ltd 2013) —Written and sung by Conor J. O'Brien. The second album from the Irish singer/songwriter and stronger than his acclaimed debut. That bodes well.Buy it! |
8:11am | Shout out Louds "Sugar" from Optica (Merge 2013) —Another typically strong release from the band out of Stockholm, Sweden.Buy it! |
8:15am | Dolly Varden "The Milkshake Incident, Part 1" from For a While (Mid-Fi 2013) —Music bed. Instrumental from the band based out of Chicago. You'll hear more from them later in the show.Buy it! |
8:18am | Neko Case "City Swans" from The Worse Things Get, the Harder I Fight, the Harder I Fight, the More I Love You (Anti- 2013) —This topped my list of favorite albums of 2013. This was written by Neko Case and Paul Rigby. This album has both stripped-down songs and songs with big production. This happens to be one of the big production ones. Both approaches work equally well.Buy it! |
8:21am | Laura Veirs "Dorothy of the Island" from Warp and Weft (Raven Marching Band 2013) —This song combines parts of the traditional song "Motherless Children" with lyrics and music by Laura Veirs. Neko Case adds harmony vocals to this track.Buy it! |
8:27am | Camera Obscura "Every Weekday" from Desire Lines (4AD 2013) —This was also on my top 10 list of favorite albums of 2013. Written and sung by Traceyanne Campbell with backing vocals by Neko Case.Buy it! |
8:31am | The John Barry Orchestra "Beat Girl" from Action! Cult Movie Classics (Mojo 2013) —Music bed. 1961 instrumental composed by John Barry.Buy it! |
8:34am | Dolly Varden "Saskatchewan To Chicago" from For a While (Mid-Fi 2013) —This album also made my top 10 list of favorite albums of 2013. Roy Kasten of "Feel Like Going Home" named this his favorite song of 2013. That's good enough for me.Buy it! |
8:38am | Charles Bradley "You Put the Flame On It (feat. Menahan Street Band)" from Victim Of Love (Dunham 2013) —You guessed it. This is another one that made my top 10 list of favorite albums from 2013. C'mon, try to be in a bad mood after hearing this one.Buy it! |
8:42am | Billie Joe Armstrong and Norah Jones "Long Time Gone" from Foreverly (Reprise 2013) —One of the surprise duet albums of 2013. This Tex Ritter song is off this collection of songs originally written or interpreted by the Everly Brothers on their 1958 album, "Songs Our Daddy Taught Us."Buy it! |
8:46am | Woody Jackson "Pear Shaped" from Good Vibrations: A Record Shop, A label, A Film Soundtrack (Big Beat rhino.com 2013) —Music bed. Instrumental written for this 2013 movie soundtrack.Buy it! |
8:47am | La Luz "Sure As Spring" from It's Alive (Hardly Art 2013) —Featuring the lead vocals and lead guitar of Shana Cleveland. 60s pop and surf-influenced music out of Seattle. Nice harmonies on this album, as well.Buy it! |
8:50am | The Dirtbombs "It's Gonna Be Alright" from Ooey Gooey Chewy Ka-Blooey! (In The Red 2013) —60s bubblegum pop meets Detroit garage rock and soul on this 2013 release. Written by Mick Collins.Buy it! |
8:53am | John Paul Keith "Baby We're a Bad Idea" from Memphis Circa 3AM (Big Legal Mess Records / Fat Possum / Hostess 2013) —Yet another one that made my top 10 list of favorite albums from 2013. Just a collection of really well-written and tuneful pop songs. - Fri 1/10 Motel Mirrors (feat. John Paul Keith, Amy LaVere, and Shawn Zorn) – Off Broadway.Buy it! |
8:56am | King Khan & the Shrines "Thorn in Her Pride" from Idle No More (Merge 2013) —Psychedelic garage rock and soul.Buy it! |
8:59am | The Ventures "Mufreesboro" from Long-Lost Honkers & Twangers (Ace 2013) —Music bed. Previously unreleased instrumental found on this 2013 instrumental collection of rarities and unissued tracks.Buy it! |
9:04am | Jason Isbell "Elephant (Radio Edit)" from Southeastern (Thirty Tigers www.thirtytigers.com 2013) —This made my top 10 list of favorite albums of 2013, as well. #2, I believe. This song kills me. Allen Dahm of "Bittersweet Melody" writes about this song at http://kdhx.org/music/news/best-of-2013-881-kdhx-djs-songs-of-the-year.Buy it! |
9:08am | Laura Marling "Where Can I Go?" from Once I Was an Eagle (Ribbon Records 2013) —This is really a terrific record. One I didn't listen to closely and in its entirety until after top 10 lists were compiled.Buy it! |
9:11am | Linda Thompson "It Won't Be Long Now" from Won't Be Long Now (Pettifer Sounds www.lindathompsonmusic.com 2013) —Beautiful song written by Teddy Thompson and featuring David Mansfield on mandolin. Teddy Thompson will be opening up for Richard Thompson at the Pageant in February (Wed 2/19).Buy it! |
9:14am | Ry Cooder "Dark End Of The Street" from Boomer's Story (Warner Brothers 1972) —Music bed. Instrumental version of the Dan Penn/Chips Moman soul cheating classic.Buy it! |
9:16am | Richard Thompson "Salford Sunday" from Electric (New West www.newwestrecords.com 2013) —Richard Thompson will be performing solo and acoustic and Teddy Thompson is opening at the Pageant in February (Wed 2/19). Highly recommended.Buy it! |
9:20am | Low "Just Make It Stop" from The Invisible Way (Love Da Records 2013) —This one features the lead vocals of drummer Mimi Parker. She sings lead on five songs which is not the norm for Low. Produced by Jeff Tweedy.Buy it! |
9:24am | Willie Nile "The Crossing" from American Ride (River House www.willienile.com 2013) —Gorgeous piano-based song written by Willie Nile and Frankie Lee.Buy it! |
9:27am | David Kitay "Theme from Ghost World" from Ghost World soundtrack (Shanachie 2001) —Music bed.Buy it! |
9:30am | Middle Class Fashion "Perfect Person" from Jungle (Blip Blap! 2013) L —Middle Class Fashion topped the 88.1 KDHX top album spins of 2013 list. 117 spins at the time the list was compiled. Very impressive.Buy it! |
9:33am | Kacey Musgraves "Dandelion" from Same Trailer Different Park (Mercury Nashville Records 2014) —Written by Kacey Musgraves, Brandy Clark, and Shane McNally.Buy it! |
9:36am | Son Volt "Hearts And Minds" from Honky Tonk (Rounder www.rounder.com 2013) L —So many talented St. Louis musicians are on this album including Gary Hunt, Justin Branum, Thayne Bradford and Brad Sarno. I guess by now Mark Spencer is considered a St. Louisan, as well. Really an overlooked album.Buy it! |
9:40am | Brandi Clark "The Day She Got Divorced" from 12 Stories (Slate Creek Records 2013) —Another one off my top 10 list of favorite albums I heard in 2013. Also, the best country album I heard. Written by Brandy Clark, Shane McAnally, and Mark D. Sanders.Buy it! |
9:43am | Santo & Johnny "School Days" from The Best of Santo and Johnny (Stardust 1997) —Music bed. Instrumental version of the Chuck Berry song.Buy it! |
9:45am | Mount Moriah "I Built a Town" from Miracle Temple (Merge 2013) —Sounds like a beautiful hybrid of Dolly Parton, Neil Young's "Helpless", and more. Heather McEntire sings lead on this with Amy Ray on backing vocals. #9 on my top 10 list of favorite albums I heard in 2013.Buy it! |
9:49am | Ransom Note "Georgia" from Big Soul (Tower Groove Records 2013) L —Holy Toledo! I almost left this song off my year-end recap. That wouldn't have been right. Featuring Merv Schrock on lead vocals.Buy it! |
9:53am | Pokey LaFarge "Central Time" from Live at KDHX 5/29/13 (KDHX 2013) L —You would have to say Pokey LaFarge is probably the biggest thing going out of St. Louis right now. Sure, he did this song live on David Letterman. But he also did it live at the KDHX studio in May of 2013.Buy it! |
9:56am | Cave States "Get Along" from The Great Divide (Undertow 2013) N L —This album combines the vocals of Chris Grabau and Danny Kathriner. Danny sings lead on this one.Buy it! |
9:58am | Cave States "Over the Threshold" from The Great Divide (Undertow 2013) N L —Music bed. The only instrumental found on the debut 2013 release by Cave States.Buy it! |
Like everything else, times are approximate. Spinitron and this station are not liable for errors or omissions.

subset: commoncrawl


text:
Aoki Files *VEGAS EDITION* Episode #34 w/ Clinton VanSciver
Get to know the latest addition to the Dim Mak Fam in this four minute exclusive interview with newly signed artist Clinton VanSciver. Listen to samples of the bangin tracks off VanSciver's first ever EP, Indie Anna Jones, as the passionate young artist discusses his unique dirty pop style, his love of Nirvana and 90's grunge, and his take on the ever emerging LA music scene. Head over to iTunes to grab the sexy new Indie Anna Jones EP, out now exclusively on Dim Mak Records. Also be sure to visit VanSciver's artist profile on the Dim Mak website and follow @cvansciver to keep up with all the moves this kid is making.
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Pop Culture
Hollywood Now: A birth, two weddings, and a movieBy Gerri Miller
See who had a baby, who got married (yes, Joseph Gordon-Levitt is off the market) and whose new flick just came out!
Go To Pop CultureSee who had a baby, who got married (yes, Joseph Gordon-Levitt is off the market) and whose new flick just came out!
Go To Pop CultureLearn about Jewish summer camps nationwide that welcome interfaith families.
Go To ParentingThis beautiful booklet tells the historical roots of Tu Bishvat and Judaism's long-standing sacred connection to trees. You will also find suggestions for activities for young children and ideas for hosting a Tu Bishvat seder.
Go To BookletsOne Happy Camper provides need-blind grants of up to $1000 to families with children attending nonprofit, mission-driven Jewish overnight camp for the first time.
Go To All OrganizationsInterfaithFamily and the Workmen's Circle are celebrating Tu B'Shevat, the Jewish New Year for the trees, and you're invited! Join us for a FREE afternoon filled with food, music, art projects and social justice.
Go To All EventsSupporting rabbis and cantors looking to engage interfaith couples and families in their communities and help them make a stronger connection with Judaism.
Go To RCJCA great way for Jewish professionals and volunteers who work with and provide programming for people in interfaith relationships to locate resources and trainings to build more welcome into their Jewish communities; connect with and learn from each other; and publicize and enhance their programs and services.
Go To RCPPThis blog is written by IFF staff and ranges from reactions to news, personal opinions and resources or guides for couples, families or program providers.
Go To Blogs
Added on August 3, 2012 by Kol Hadash Humanistic Congregation Comments (0) Tags: Humanistic Judaism, intermarriage
As the conclusion of Colloquium 2012, Rabbi Adam Chalom explores some of the lessons learned through the conference's exploration of the "heirs of intermarriage." More information on this Colloquium, including how to purchase DVDs of the entire conference, are available at http://iishj.org/colloquium-12.html.
Copyright © 2012 InterfaithFamily.com, Inc. Privacy Policy


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By Business Wire | Article Rating: |
January 10, 2013 08:15 AM EST | Reads: |
549 |
Perforce Software today released six resolutions for software companies to consider when managing their development environments. The resolutions encourage companies to maintain well organized codebases and development processes to foster their growth.
"The new year is an ideal time for every organization to take an inventory of what is working well and find ways to improve—and there's no better place to start than at the very foundation of the code," said Randy DeFauw, technical marketing manager at Perforce. "In my experience with our customers, employing these software practices not only results in fewer issues down the road, but a more manageable codebase."
Perforce's six recommendations for 2013:
- Deliver like Facebook: Facebook leads its industry because it delivers improvements to its site daily. Replicating this strategy is recommended, and easier to do now that the software tool stack can match that velocity. Even if companies are not building a Software-as-a-Service (SaaS) offering, product can still rapidly evolve internally without being formally released to customers. Harnessing the ability to deliver enhancements quickly will buy companies a considerable competitive advantage in their respective sectors. Added bonus: nothing keeps developers happier than seeing their code show up as live improvements in the product.
- Take Agile cross-functional: Agile isn't just for developers anymore, and companies should not limit its use to their software teams. DevOps was all about bridging the gap between development and operations, and companies will find greater success if their entire team is responding as quickly to new requirements as the development team. Consider introducing agile project management to non-techies such as Sales, Marketing and Human Resources teams.
- Get everyone on the mother ship quickly: A software company's two most valuable assets are its employees and its intellectual property. Do not operate them in silos. Instead, reuse IP wherever possible and make sure teams can work with each other. If talent is being acquired by purchasing a startup, ensure their past work can be incorporated into the existing system in a week, not a year. Let them keep using the tools they are accustomed to, even if it means running something more enterprise-ready in the background.
- Look before leaping into the cloud: The low costs, infinite scalability and minimal administration requirements make the cloud seem appealing to any company. The reality, however, is that performance, ownership and reliability issues need to be considered before deploying to the cloud. If employees are asking for a cloud-based solution, figure out why. Do they want Dropbox because there is no decent place to store their design documents and test plans? That can be fixed without cloud services.
- Be realistic: Engineers are practical people. Lay out clear goals with a reasonable time frame. If current delivery cycles are a year, they cannot be shortened to a week overnight. However, reducing the timeframe from a year to three months is indicative of significant progress and achieves buy-in for the next step.
- Study the America Invents Act: A major change to U.S. patent law is going into effect in March 2013. To prevent potential intellectual property lawsuits, it is critical to study and fully understand the nuances of first-to-file, prior use and other looming changes. Have a plan in place for adjusting software processes (from initial design through market introduction) to meet the changing legal framework. Companies using open source software should take particular care to ensure they are in compliance with all the licensing and copyright provisions.
For more than a decade, Perforce has powered the world's most demanding development environments, enabling thousands of organizations to manage and grow their codebase successfully. In addition to source code, Perforce enterprise version management products help teams work in concert on various digital assets including documents, multimedia, spreadsheets, images and more.
Free for Up to 20 Users, Open Source Projects and Educational Institutions
Perforce makes it easy for small companies and start-ups to benefit from enterprise-class software version management. The complete Perforce product family—including the new Git Fusion solution for Git repositories—is available at no cost for up to 20 users or workspaces. Perforce also is available at no cost for open source projects and educational institutions.
Perforce Software enables teams to version everything. Perforce enterprise version management products help teams work in concert on important digital assets including software code, documents, multimedia, spreadsheets, images and more. They are unique in their ability to handle large and distributed collections of content, enabling higher productivity, lower costs and improved security and compliance. Perforce is now making it easy for everyone to take advantage of enterprise version management. The company is headquartered in Alameda, California, with international operations in the United Kingdom, Canada and Australia. For more information, visit www.perforce.com.
Published January 10, 2013 Reads 549
Copyright © 2013 SYS-CON Media, Inc. — All Rights Reserved.
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The Industrial Internet revolution is now underway, enabled by connected machines and billions of devices that communicate and collaborate.
The massive amounts of Big Data requiring real-time analysis is flooding legacy IT systems and giving way to cloud environments that can handle the unpredictable workloads.
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By Carmen Gonzalez The 3rd International Internet of @ThingsExpo, co-located with the 16th International Cloud Expo - to be held June 9-11, 2015, at the Javits Center in New York City, NY - announces that its Call for Papers is now open.
The Internet of Things (IoT) is the biggest idea since the creation of the Worldwide Web more than 20 years ago. Jan. 28, 2015 02:30 PM EST Reads: 2,946 |
By Elizabeth White "People are a lot more knowledgeable about APIs now. There are two types of people who work with APIs - IT people who want to use APIs for something internal and the product managers who want to do something outside APIs for people to connect to them," explained Roberto Medrano, Executive Vice President at SOA Software, in this SYS-CON.tv interview at Cloud Expo, held Nov 4–6, 2014, at the Santa Clara Convention Center in Santa Clara, CA. Jan. 28, 2015 02:30 PM EST Reads: 2,523 |
By Pat Romanski Performance is the intersection of power, agility, control, and choice. If you value performance, and more specifically consistent performance, you need to look beyond simple virtualized compute. Many factors need to be considered to create a truly performant environment.
In his General Session at 15th Cloud Expo, Harold Hannon, Sr. Software Architect at SoftLayer, discussed how to take advantage of a multitude of compute options and platform features to make cloud the cornerstone of your online presence. Jan. 28, 2015 02:15 PM EST Reads: 3,083 |
By Elizabeth White SYS-CON Media announced that Splunk, a provider of the leading software platform for real-time Operational Intelligence, has launched an ad campaign on Big Data Journal. Splunk software and cloud services enable organizations to search, monitor, analyze and visualize machine-generated big data coming from websites, applications, servers, networks, sensors and mobile devices.
The ads focus on delivering ROI - how improved uptime delivered $6M in annual ROI, improving customer operations by mining large volumes of unstructured data, and how data tracking delivers uptime when it matters most. Jan. 28, 2015 02:00 PM EST Reads: 3,715 |
By Pat Romanski In this Women in Technology Power Panel at 15th Cloud Expo, moderated by Anne Plese, Senior Consultant, Cloud Product Marketing at Verizon Enterprise, Esmeralda Swartz, CMO at MetraTech; Evelyn de Souza, Data Privacy and Compliance Strategy Leader at Cisco Systems; Seema Jethani, Director of Product Management at Basho Technologies; Victoria Livschitz, CEO of Qubell Inc.; Anne Hungate, Senior Director of Software Quality at DIRECTV, discussed what path they took to find their spot within the technology industry and how do they see opportunities for other women in their area of expertise. Jan. 28, 2015 01:45 PM EST Reads: 2,174 |
By Carmen Gonzalez DevOps Summit 2015 New York, co-located with the 16th International Cloud Expo - to be held June 9-11, 2015, at the Javits Center in New York City, NY - announces that it is now accepting Keynote Proposals.
The widespread success of cloud computing is driving the DevOps revolution in enterprise IT. Now as never before, development teams must communicate and collaborate in a dynamic, 24/7/365 environment. There is no time to wait for long development cycles that produce software that is obsolete at launch. DevOps may be disruptive, but it is essential. Jan. 28, 2015 01:15 PM EST Reads: 2,453 |
By Elizabeth White Almost everyone sees the potential of Internet of Things but how can businesses truly unlock that potential. The key will be in the ability to discover business insight in the midst of an ocean of Big Data generated from billions of embedded devices via Systems of Discover. Businesses will also need to ensure that they can sustain that insight by leveraging the cloud for global reach, scale and elasticity. Jan. 28, 2015 01:00 PM EST Reads: 4,011 |
By Liz McMillan The Internet of Things will greatly expand the opportunities for data collection and new business models driven off of that data. In her session at @ThingsExpo, Esmeralda Swartz, CMO of MetraTech, discussed how for this to be effective you not only need to have infrastructure and operational models capable of utilizing this new phenomenon, but increasingly service providers will need to convince a skeptical public to participate.
Get ready to show them the money! Jan. 28, 2015 12:30 PM EST Reads: 2,882 |
By Liz McMillan The 3rd International Internet of @ThingsExpo, co-located with the 16th International Cloud Expo - to be held June 9-11, 2015, at the Javits Center in New York City, NY - announces that its Call for Papers is now open.
The Internet of Things (IoT) is the biggest idea since the creation of the Worldwide Web more than 20 years ago. Jan. 28, 2015 12:00 PM EST Reads: 7,854 |
By Elizabeth White Connected devices and the Internet of Things are getting significant momentum in 2014.
In his session at Internet of @ThingsExpo, Jim Hunter, Chief Scientist & Technology Evangelist at Greenwave Systems, examined three key elements that together will drive mass adoption of the IoT before the end of 2015. The first element is the recent advent of robust open source protocols (like AllJoyn and WebRTC) that facilitate M2M communication. The second is broad availability of flexible, cost-effective storage designed to handle the massive surge in back-end data in a world where timely analytics is e... Jan. 28, 2015 12:00 PM EST Reads: 2,448 |
By Liz McMillan The Internet of Things will put IT to its ultimate test by creating infinite new opportunities to digitize products and services, generate and analyze new data to improve customer satisfaction, and discover new ways to gain a competitive advantage across nearly every industry. In order to help corporate business units to capitalize on the rapidly evolving IoT opportunities, IT must stand up to a new set of challenges.
In his session at @ThingsExpo, Jeff Kaplan, Managing Director of THINKstrategies, will examine why IT must finally fulfill its role in support of its SBUs or face a new round of... Jan. 28, 2015 11:45 AM EST Reads: 2,649 |
By Elizabeth White "There is a natural synchronization between the business models, the IoT is there to support ," explained Brendan O'Brien, Co-founder and Chief Architect of Aria Systems, in this SYS-CON.tv interview at the 15th International Cloud Expo®, held Nov 4–6, 2014, at the Santa Clara Convention Center in Santa Clara, CA. Jan. 28, 2015 11:45 AM EST Reads: 3,503 |
By Elizabeth White The BPM world is going through some evolution or changes where traditional business process management solutions really have nowhere to go in terms of development of the road map. In this demo at 15th Cloud Expo, Kyle Hansen, Director of Professional Services at AgilePoint, shows AgilePoint's unique approach to dealing with this market circumstance by developing a rapid application composition or development framework. Jan. 28, 2015 11:30 AM EST Reads: 2,113 |
By Yeshim Deniz ARMONK, N.Y., Nov. 20, 2014 /PRNewswire/ -- IBM (NYSE: IBM) today announced that it is bringing a greater level of control, security and flexibility to cloud-based application development and delivery with a single-tenant version of Bluemix, IBM's platform-as-a-service. The new platform enables developers to build ap... Jan. 28, 2015 11:15 AM EST Reads: 2,906 |
By Elizabeth White Building low-cost wearable devices can enhance the quality of our lives. In his session at Internet of @ThingsExpo, Sai Yamanoor, Embedded Software Engineer at Altschool, provided an example of putting together a small keychain within a $50 budget that educates the user about the air quality in their surroundings.
He also provided examples such as building a wearable device that provides transit or recreational information.
He then reviewed the resources available to build wearable devices at home including open source hardware, the raw materials required and the options available to power s... Jan. 28, 2015 11:00 AM EST Reads: 2,303 |
By Elizabeth White "The age of the Internet of Things is upon us," stated Thomas Svensson, senior vice-president and general manager EMEA, ThingWorx, "and working with forward-thinking companies, such as Elisa, enables us to deploy our leading technology so that customers can profit from complete, end-to-end solutions."
ThingWorx, a PTC® (Nasdaq: PTC) business and Internet of Things (IoT) platform provider, announced on Monday that Elisa, Finnish provider of mobile and fixed broadband subscriptions, will deploy ThingWorx® platform technology to enable a new Elisa IoT service in Finland and Estonia. Jan. 28, 2015 11:00 AM EST Reads: 1,675 |
By Elizabeth White Advanced Persistent Threats (APTs) are increasing at an unprecedented rate. The threat landscape of today is drastically different than just a few years ago. Attacks are much more organized and sophisticated. They are harder to detect and even harder to anticipate. In the foreseeable future it's going to get a whole lot harder. Everything you know today will change. Keeping up with this changing landscape is already a daunting task. Your organization needs to use the latest tools, methods and expertise to guard against those threats. But will that be enough? In the foreseeable future attacks w... Jan. 28, 2015 11:00 AM EST Reads: 3,030 |
By Liz McMillan From telemedicine to smart cars, digital homes and industrial monitoring, the explosive growth of IoT has created exciting new business opportunities for real time calls and messaging.
In his session at @ThingsExpo, Ivelin Ivanov, CEO and Co-Founder of Telestax, shared some of the new revenue sources that IoT created for Restcomm – the open source telephony platform from Telestax.
Ivelin Ivanov is a technology entrepreneur who founded Mobicents, an Open Source VoIP Platform, to help create, deploy, and manage applications integrating voice, video and data. He is the co-founder of TeleStax, a... Jan. 28, 2015 10:45 AM EST Reads: 3,136 |
By Elizabeth White The Internet of Things is not new. Historically, smart businesses have used its basic concept of leveraging data to drive better decision making and have capitalized on those insights to realize additional revenue opportunities. So, what has changed to make the Internet of Things one of the hottest topics in tech?
In his session at @ThingsExpo, Chris Gray, Director, Embedded and Internet of Things, discussed the underlying factors that are driving the economics of intelligent systems. Discover how hardware commoditization, the ubiquitous nature of connectivity, and the emergence of Big Data a... Jan. 28, 2015 10:45 AM EST Reads: 3,032 |


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Join Meir Panim's campaign to "light up" Chanukah for families in need.
"The threat of Iran becoming nuclear is a threat for the people who live in the U.S., Europe and Israel." he said. "No one can guarantee that Iran will use its power only against Israel."
The Times does not inform readers the statement was posted in direct response to public controversy surrounding Rauf's interview with this reporter in which the imam refused three times to condemn Hamas or classify the group as a terrorist organization.
Cordoba Initiative Quietly Deletes
Larijani is an Islamic cleric and serves as secretary-general of Iran's High Council for Human Rights. His brother, Ali Larijani, is Iran's top negotiator for nuclear issues.
Aaron Klein is Jerusalem bureau chief and senior reporter for Internet giant WorldNetDaily.com. He is also host of an investigative radio program on New York's 770-WABC Radio, the largest talk radio station in the U.S., every Sunday between 2-4 p.m.
About the Author: Aaron Klein is a New York Times bestselling author and senior reporter for WND.com. He is also host of an investigative radio program on New York's 970 AM Radio on Sundays from 7 to 9 p.m. Eastern. His website is KleinOnline.com.
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V15′s Bird was marinated in his former boss's hatred of and blame-only Israel mindset.
Palestinian Authority child soldiers – a crime against humanity.
Maybe, just maybe, the new generation of terrorists will one day turn their guns on their oppressors in Gaza.
The White House explains that Taliban is not a terrorist group — it is an "armed insurgency."
The US in November stopped funding a left-wing group that is helping to campaign against Netanyahu
Super Bowl viewers will have to get along with Scarlett Johansson this year.
Cruz and New York Rep. Zeldin complained to Kerry of Obama's "relentless harassment."
A Shin Bet sting nabs Arab Israelis after returning from Syria where they join Al Qaeda and ISIS-linked terror groups — a whole group this month.
That's it. If you didn't register your party by now, you're not running for the upcoming Knesset elections.
Simultaneous explosions in Egypt killed and wounded dozens Thursday night.
National religious voters favoring the new Yachad party headed by Eli Yishai may be wasting their votes.
ISIS threatens to behead Obama, turn the U.S. into a Muslim province, and destroy France and Belgium.
Locked in Auschwitz, their cries for assistance were not heard, so they escaped through an open window, setting off an alarm.
Hezbollah is a terrorist group and terrorist party, but most and worst of all, it is a huge and powerful army.
Lieberman's issues a disproportionate response to polls that show his party will barely squeeze into the Knesset.
Boehner criticized President Obama for failing to take the threat of terrorism and the Iranian nuclear threat seriously.
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Dunes, camels and clay castles
I was following one of Africa's most mythic, and historic, trading routes: the road to Timbuktu.
Surprises at every turn
Once crippled by famine and drought, Ethiopia has moved on from its dark past, discovers Jill Worrall.
Johannesburg: the new hipster hotspot
Organic food and craft beer helping to drive growth in a city still bearing scars of apartheid.
The end of lion hunting
The Maasai community are trading lions for medals in an attempt to end an enduring tradition.
Now is the time for a safari
While the confused and the scaredy-cats wimp out, now's the best time to book a safari.
All Black Liam Messam makes successful start to professional boxing career
Australian Open: Serena Williams wins record sixth title
Sonny Bill Williams wins comfortable unanimous decision
New Zealand Warriors blow massive lead as Auckland Nines hopes hang in the balance
NZ Warriors strip off for Heidi Klum
Moment of terror when woman swept away by monster wave
Clinical New Zealand chase down Pakistan total with ease to claim ODI win
One dead and another in custody following serious incident in Stratford


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Ratings based on 643 Verified Reviews
They paid and stayed. We double-checked.
4.4 Room cleanliness
4.4 Service & staff
4.3 Room comfort
4.3 Hotel condition
They paid and stayed.
We double-checked.
We double-checked.
for Everyoneby A verified travelerfrom Hong Kong
Good location, good security, good staff
Posted Jan 24, 2015Pros: Good for stay paris for a week or more: you can have a secure place to stay even you may back to hotel late at night, also you can cook in your room.
Location: St-michel notre dame, pont arts, museum louvre
Good location: just few minutes to st-michel notre dame station, and many good restaurants around, can walk by the river to pont arts and museum louvre Good secuirty: very important in paris i think, you need to use your own room key card to enter hotel and use the lift. Good staff: very helpful and nice for everyone, they have no hesitation to speak english and actively help you know how to access the local service e.g. post office, supermarket, currency exchange... friendly self-room service: you can easily go down lobby to take many room material you want e.g. new towels, dental kit, facial tissues.. They don't provide daily room cleaning service or you can pay 15EUR for each time.
for Familiesby A verified traveler
Excellent location
Posted Jan 19, 2015I've been staying in Citadines for many years now. It is a good, reliable apart hotel. This one has an excellent location and facilities: A self service coffee area, vending machines, and a room where you can get extra towels and bathroom amenities. The room was a bit smelly when we arrived. It smelled a bit like food so I assume that the previous occupant cooked and the cleaning products where not strong enough... The halls are a bit tired but the rooms are good.
for Familiesby A verified travelerfrom 東京
Posted Jan 17, 2015Pros: 1回のコーヒー、紅茶、ココア、ホットミルクの24時間サービス 部屋の備品の充実
Cons: シャワーの出が少しだけ物足りません
Location: 徒歩5分のサンミッシェル駅は、地下鉄で複数の路線が乗り入れており、移動が便利。サンジェルマンでプレは、食事、買い物に事欠いません。
アパートメントホテルとはいえ、フロントのサービス等通常のホテルと特段遜色はありません。ホテルスタッフは優秀ですし、掃除タオル交換も毎日! 部屋もすごくゆったりで、食洗器、電子レンジ、トースター、冷凍冷蔵庫、カトラリー、食器、フライパン、鍋と何でもそろってます!!近くにはカルフールもあり、短期だけでなく長期の滞在にぴったりです。 シャワーの出が少し物足りまあせんでしたが、普通に使う分には大丈夫でした。 1回のコーヒー、紅茶、ココア、ホットミルクの24時間サービスは物価のたかいパリではありがたかったです。 次のパリ滞在の際にもこちらにお世話になりたいです。
for Everyoneby A verified travelerfrom Jenison, MI
Greatest location
Posted Jan 3, 2015Pros: Location, functionality, simplicity and comfort
Cons: Bathroom infrastructure
Location: The hotel is located in Cartier Latin, a few minutes away from the Notre Dame and about 10 min away from the Louvre. Restaurants around are abandant.
This is my second stay in this hotel and will certainly come back. It is extremely well located, very close to all interesting places. It is also very comfortable and has nice unpretensious classy style. The only problem this time was a broken shower but they upgraded us to a better room to resolve the issue.
Comment from Hotel Management
Jan 7, 2015 by Laurent, Hotel Management
Thank you for your feedback which will be shared with the team at Citadines Saint Germain-des-Prés. Your feedback motivates us to do better to ensure that our residents have a warm and pleasant experience. We regret the technical issue that occured with the broken shower. As we are always seeking to make improvements, we have reminded our engineering service to exercise more preventive maintenance and to make sure all the equipments including plumbing are functionning properly before guest arrive. On a lighter note, we are delighted to learn that our staff addressed the issue with effiency and professionnally with the room move. We look forward to welcoming you again.
by A verified travelerfrom Sao Paulo, Brazil
Great location and that's about it.
Posted Dec 25, 2014This place was a disappointment. I knew it would on the no-frills side but we couldn't even get someone to help us bring the luggage upstairs or mail a letter. Upstairs, although it had two separate rooms, the place was tiny and painted like a hospital room. The worst thing by far though was the WC which smelled horribly (like a public toilet you only use when you have no choice) during our entire 4-night stay. Overall, it wasn't good, although to be fair, the location was perfect.
for Everyoneby A verified traveler
Posted Dec 20, 2014Pros: La posizione e la pulizia
Cons: almeno la ventola nel ripostiglio wc!!! e la sala della colazione un po' fredda e asettica e non molto confortevole...
2 giorni a Parigi con le mie bimbe e un amica, comodissimo e centralissimo come posizione, tutto molto comodo e funzionale...unico neo..l'unico w.c. nell'appartamento posizionato in una specie di ripostiglio senza finestre e senza ventola...
for Familiesby A verified traveler
Posted Dec 20, 2014
Pros: Decent size by Paris standards. Staff was very friendly. Breakfast downstairs saved some money and was good.
Location: Location was perfect for us, a very short walk to RER, Notre Dame, Saint Chapell. Tons of restaurants and cafes nearby.
My family of four had a great experience. Staff was very pleasant.
for Everyoneby A verified traveler
Centralissimo, pulito e ospitalità a 1000
Posted Dec 16, 2014Il mio soggiorno è durato solo un weekend, ottima posizione dell'hotel in pratica quasi in faccia ala cattedrale di Notre-Dame, comodissimo alla metro oltre che alla linea RER per raggiungere l'aeroporto con un solo treno. Molto pulito ed accogliente, appartamenti non enormi ma funzionali e con ogni confort. Fantastica la possibilità di avere bevande calde e acqua a disposizione 24 ore su 24, assolutamente gratuite. Personale disponibile e cortese.
for Everyoneby A verified travelerfrom port leucate
Nice hotel, very convienent
Posted Dec 13, 2014Pros: Its central, nice staff, comfy beds well laid out appartment
Found Paris magical, despite rain, first visit for me, will come back soon.
for Everyoneby A verified traveler
confortevole e ben attrezzato l'appartamento
Posted Dec 9, 2014buona posizione vicino fermata autobus e metro a 300 metri,,ambienti confortevoli ed attrezzati buona l'idea di dispenser per latte the cioccolata etc aperti a tutte le ore nella hall.


text:
US 6281105 B1 Abstract A paste is described for capping electrodes with an oxide free metal layer incorporating a solvent, an unzippable polymer and particles. The electrode could be an interconnect such as a C4 bump. A method for forming a coating and for testing integrated circuit chips is also described. The invention overcomes the problem of interconnecting Pb containing electrodes that are covered with an insulating oxide on integrated circuit chips by coating the Pb containing electrode with Au to provide an oxide free surface for testing and interconnection.
Claims(4) 1. A method for testing an electronic device having electrodes subject to oxidation by a test probe having corresponding pads for contacting said electrodes comprising the steps of:
applying a paste to the surface of said electrodes,
said paste comprising:
a solvent for an unzippable polymer,
an unzippable polymer selected from the group consisting of poly(α-methyl styrene) (PAMS), poly(propylene carbonate), poly(ethylene carbonate) and poly(chloral) dissolved in said solvent to form a solution, and
particles selected from the group consisting of Au, Sn and Au/Sn alloy suspended in said solution,
said particles suitable for coating the surface of said electrodes,
said unzippable polymer comprising 10 wt % or greater of said solution,
said particles in said paste being conductive and adherent to the surface of said electrodes,
heating said paste to remove said solvent and said unzippable polymer, and
contacting said coated electrodes to said pads of said test probe.
2. The method of claim 1 further including the step of applying force between said electrodes and said test pads.
3. The method of claim 1 further including the step of selecting a paste having a thermoplastic material as its unzippable polymer.
4. A method for interconnecting a semiconductor chip having electrodes subject to oxidation to respective electrical pads on a substrate comprising the steps of:
applying a paste to the surface of said electrodes,
said paste comprising:
a solvent for an unzippable polymer,
an unzippable polymer selected from the group consisting of poly(α-methyl styrene) (PAMS), poly(propylene carbonate), poly(ethylene carbonate) and poly(chloral) dissolved in said solvent to form a solution, and
particles selected from the group consisting of Au, Sn and Au/Sn alloy suspended in said solution,
said particles suitable for coating the surface of said electrodes,
said unzippable polymer comprising 10 wt % or greater of said solution,
said particles in said paste being conductive and adherent to the surface of said electrodes,
heating said paste to remove said solvent and said unzippable polymer,
applying conductive adhesive paste including a polymer binder and noble metal particles to said electrical pads on said substrate,
contacting said electrodes to said respective electrical pads, and
bonding said electrodes to said respective electrical pads by heating.
Description This is a division of application Ser. No. 08/965,227, filed Nov. 6, 1997 now U.S. Pat. No. 6,013,713. This invention relates to a paste and more particularly to a paste including an unzippable polymer, solvent and conductive particles for coating electrodes such as C4 bumps with oxide free conductive particles for applications such as low temperature interconnections between an integrated circuit chip and a substrate made of polymer/filler composites, such as an Fr4 printed circuit board. With more and more transistors being placed on a chip to increase the number of functions, the number of input/output (I/O) pads per integrated circuit chip has increased significantly. The increase in the number of I/o pads per chip are making traditional bonding methods, such as wire bonding (WB) and tape automated bonding (TAB) difficult. Flip chip attach (FCA), which is usually an area array in contrast to a peripheral array for WB and TAB, is becoming increasingly pervasive due to the number of pads. In FCA, the chip is bumped with a lead-rich Pb/Sn alloy ball using metal deposition through a resist-mask, for example. The bonding of this chip is achieved by self alignment and placing the chip on the substrate which has been covered with high viscosity flux to reduce oxides. The chip is held in place by the flux. The whole assembly (chip and substrate) is subsequently heated in the range from 350 to 400� C. to a temperature which melts the solder forming an interconnect between balls or bumps on a chip and respective pads on a substrate. Conventionally the substrates were multi-layer ceramic (MLC) structures that could withstand temperatures up to 400� C. Dictated by both the number of pads and lower cost, there is a growing need to attach similar C4 bumped integrated circuit chips to organic substrates made of polymer/filler composites, such as FR4. Such organic substrates degrade at solder reflow temperatures above 300� C. Thus a low temperature joining material is needed to attach the C4 bumps of a chip to respective substrate pads. One method to attach electrodes such as C4 bumped chips to an organic substrate is by capping the C4 bumps first with a low temperature melting Pb/Sn-eutectic solder such as described in U.S. Ser. No. 08/710992 filed Sep. 25, 1996 by Berger et al. entitled �Method for Making Interconnect for Low Temperature Chip Attachment� (YO996073) and assigned to the assignee herein. The Pb/Sn solder cap over the C4 bump may be accomplished by vapor depositing the metal components through a resist mask, followed by solder reflow step. The masking process requires expensive alignment and lithographic steps, and the vapor deposition process is costly due to high vacuum processing. The bonding is accomplished by reflowing the Pb/Sn-eutectic solder at temperatures below 250� C. using acidic flux. Subsequently, the flux is removed using organic solvents that may be chloro-fluoro-carbon (CFC) based. In accordance with the present invention, a paste is described comprising a solvent for an unzippable polymer, an unzippable polymer dissolved in the solvent to form a solution, and particles suspended in the solution. The particles may be suitable for coating the surface of a selected material; and the polymer may comprise 10 wt. % or greater of the solution. The invention further provides a coating comprising a substrate and a layer of the paste mentioned above that leaves a layer of particles which may be heated to form an alloy with the substrate material. The invention further provides a method for testing the integrated circuit chip with C4 bumps that are coated using the disclosed method. The particles in the paste being conductive and adherent to the C4 surface will provide a conductive path between the C4 bumps and conductive pads on the test probe. The invention further provides a method for coating C4 electrodes or bumps on an integrated circuit chip comprising the steps of applying a paste mentioned above to the surface of the C4 electrodes, the particles in the paste being conductive and adherent to the surface of the substrate, and heating the paste to remove the solvent and the unzippable polymer wherein the particles may alloy with the Pb in the C4. The invention provides a low cost C4 capping method. The invention provides a method that does not require any lithography, alignment or vacuum processing steps. The invention provides a bonding process that uses conductive adhesive on the substrate that does not require any flux, hence no cleaning step. The conductive adhesive may typically be a silver or gold filled epoxy. The invention provides a bonding process using a conductive organic composite that allows for greater thermal mismatch between the chip and the substrate than a solid metal solder joint would. The invention provides a bonding process that allows flip chip to pads on organic substrates where the mismatch in the thermal coefficient of expansion (TCE) is significantly larger than the TCE between an integrated circuit chip and a ceramic substrate. The invention provides a testing process that would allow the C4 bumps to be tested by conventional methods of pressure contact before bonding. These and other features, objects, and advantages of the present invention will become apparent upon consideration of the following detailed description of the invention when read in conjunction with the drawing in which: FIG. 1A shows one embodiment of the invention. FIG. 1B shows an intermediate step in using the embodiment of FIG. 1A. FIG. 1C shows the final result of using the embodiment of FIG. 1A. FIGS. 2-4 show a sequence of steps for placing a coating of unzippable paste on C4 bumps of an integrated circuit. FIG. 5 is a SEM image of a C4 bump after a heating cycle having a metal coating as in FIG. 1C. FIG. 6 is a graph of data from Energy Dispersive X-ray Analysis of a gold coated site on the C4 bump after the coating process, and FIG. 7 is a graph of data from Energy dispersive X-ray Analysis of an uncoated site of lead on the C4 bump in FIG. 6. FIG. 8 shows the final structure of a C4 bump coated with oxide free particles to be bonded to a paste bumped substrate. Referring to FIG. 1A, a substrate 10 and a coating of unzippable paste 13 is shown. Unzippable paste 13 comprises an unzippable polymer 15 and/or their blends dissolved in solvent 18, particles 17 such as oxide-free metal. An oxide-free metal or surface is one that does not form an oxide layer to permit a conductivity greater than 1 ohm-cm or the oxide layer is conducting with a conductivity greater than 1 ohm-cm. For example, C4 bumps of an alloy of 97 wt. % Pb and 3 wt. % Sn typically have an oxide coating or layer which provides a contact resistance which is greater than 1 ohm-cm without reflow of the solder in the C4 bump. Unzippable polymer 15 is a polymer that completely volatilizes above a certain temperature defined as the unzipping temperature, Tunzip. Some examples of unzippable polymers 15 include poly(methyl methacrylate) (PMMA), poly(∝-methyl styrene) (PAMS), poly(propylene carbonate), poly(ethylene carbonate), and poly(chloral). All these polymers have a Tunzip below 400� C. Solvent 18 is one that may be organic and dissolves the above mentioned polymers. For example, N-methyl pyrrolidinone (NMP) is a good solvent for PMMA and PAMS. Particles 17 may be composed of one or more metals. At least one of the metal components should form an alloy with Pb or Sn wherein the alloy melts in the temperature range from 150 to 400� C. For example, particle 17 may be Au, Sn, or Au/Sn alloy. The particle should be oxide free or with an oxide that is conductive. The particles could also be made of composite material where the inner core may be ceramic or metal and the outer layer is an oxide free metal or a conductive oxide. Particles in the paste may be in the range from 1 to 50 volumetric %. Solvent 18 in paste 13 is removed by drying at Tdry under a selected environment, leaving polymer 15 and particles 17 on the surface of substrate 10. The temperature is then raised above the unzipping temperature Tunzip of unzippable polymer 15 which results in the degradation and evaporation of the polymer components. FIG. 1C shows the final structure of substrate 10 coated with particles 17 after unzipping. The Tdry is more than 50� C. below the Tunzip. The selected environment may be air, N2, vacuum, forming gas, Ar, He or a combination thereof. Coating 12 may be patterned or uniform over substrate 10. Selective coating 12 may be achieved by a standard dispensing process such as screening, stenciling, etc. Particles 17 shown in FIG. 1C may be in a monolayer or multilayer. Particles 17 may form an interconnected percolating structure or discrete islands. FIGS. 2-4 show steps for coating C4 bumps of an integrated circuit with unzippable paste 13. Unzippable paste 13 is screened on a smooth, clean surface of a solid substrate 22 through an interposer 24. Substrate 22 may be glass, silicon or ceramic. Interposer 24 may comprise polyimide, polyester or other organic material or metal such as molybdenum, nickel, stainless steel, etc. Interposer 24 may have a plurality of openings or vias 26 which are slightly larger than the diameter of the C4 bumps 27 to be coated. The thickness of interposer 24 is less than the height of the C4 bump 27. Typically, the diameter of C4 bump 27 is 75 μm. The diameter of opening 26 may be in the range from 85 to 100 μm and the thickness of interposer 24 may be 50 μm. FIG. 2 shows openings 26 filled with unzippable paste 13. Interposer 24 can be made by chemical etch, laser ablation or other conventional means to match the pattern of C4 bumps on a chip or wafer. Some other method of transferring the unzippable paste 13 to C4 bumps 27 may be by pin transfer, dipping, brushing, etc. Substrate 22 is then placed over or under a chip or wafer 34 of undiced or embedded chips having a plurality of C4 bumps 27 thereon. Openings 26 filled with unzippable paste 13 are aligned with corresponding bumps 27 on wafer 34. The alignment is done by self aligning the chip with the vias 26 in interposer 24. Substrate 22 is brought closer to chip or wafer 34 so that C4 bumps 27 are pressed into openings 26 and in contact with unzippable paste 13 as shown in FIG. 3. Substrate 22 is then separated from or moved away from chip or wafer 34 so that C4 bumps 27 are separated from contact with unzippable paste 13 in openings 26. A thin layer 29 of unzippable paste 13 adheres to C4 bumps 27 as the chip or wafer 34 is removed from proximity of substrate 22 as shown in FIG. 4. In this example, the geometry of each C4 is well defined dimensionally and by composition,the contact area to unzippable paste 13 is nominally identical for each bump. As a result, the thickness and size of the paste film forming thin layer 29 on the C4 bumps 27 are nominally of the same thickness. The thickness of thin layer 29 may be in the range from 0.1 to 50 μm with a thickness variation in the range from 0.05 to 25 μm. The process can be repeated a number of times by heating to Tdry to increase the amount of particles adhering to the C4 bumps. Thin layer 29 is first dried by heating to Tdry, then heated above Tunzip and the melting temperature of the solder metals in the C4 bumps 27. The particles embed into the molten C4 or react with solder metal, to form a strong bond between the particle and the C4. Depending upon the particular unzippable polymer, metal, alloy, or other material selected. Tunzip may be above or below the melting temperature Tmelt of the metal, alloy or other material. Where Tunzip is above Tmelt heating may be above Tunzip in one step. Where Tunzip is below Tmelt, heating may first be above Tunzip and below Tmelt and then raised above Tmelt. Best practice is to completely remove the unzippable polymer prior to raising the temperature to Tmelt or above. Heating is done typically in an oven or zone furnace with a nitrogen or preferably forming gas environment. During this thermal cycle, the unzippable paste 13 unzips and vaporizes and the metal filler particles 17 fuse with respective C4 bumps forming an oxide-free conductive coating 32 on C4 bumps 27. FIG. 5 shows an image of conductive coating 32 on a C4 bump 27 taken by Scanning Electron Microscopy (SEM). The image in FIG. 5 was taken after the heating cycle was completed at 360� C. for 30 mins. in a forming gas environment. Conductive coating 32 as shown in FIG. 5 is a uniform layer or coating of particles 17 which are Au. FIG. 6 is a graph of Energy Dispersive X-ray Analysis of a site on conductive coating 32 on the C4 bump 27 shown in FIG. 5. In FIG. 6 the ordinate represents X-ray intensity and the abscissa represents energy in keV. Curve 42 shows the X-ray intensity as a function of energy from 0 to 20 keV. Peak 44 shows that the top surface of conductive coating 32 is Au with very small traces of Pb. Curve 44 illustrates that conductive coating 32 has a high coverage of gold over C4 bump 27. FIG. 7 is a graph of Energy Dispersive X-ray Analysis of a site on C4 bump 27 without conductive coating 32. FIG. 7 is formed from data obtained from the C4 bump 27 shown in FIG. 5. In FIG. 7, the ordinate represents X-ray intensity and the abscissa represents energy in kev. Curve 46 shows the X-ray intensity as a function of energy from 0 to 20 keV. Peak 48 shows that the surface of C4 bump 27 is Pb. A process for bonding chips 50 to a substrate 52 is now described. The chips 50 to be bonded would be processed to form, as described above, a layer 32 of particles 17 on its C4 bumps 27. A conductive adhesive paste 54 comprising a polymer binder and noble metal particles would be placed on electrical pads 55 on substrate 52. The polymer binder may be a thermoplastic or thermoset polymer. The paste may also contain a solvent system that dissolves the polymer binder. Chip 50, after C4 bumps 27 are processed to contain a Au layer 32, is bonded to paste 54 or paste bump 56 on substrate 52 by a method shown in FIG. 8. An example of a conductive paste suitable for use herein is described in U.S. Pat. No. 5,086,558 by Grube et al. which issued Feb. 11, 1992 and in U.S. U.S. Pat. No. 5,866,044 which issued Feb. 2, 1999 by R. Booth et al. filed Oct. 21, 1996, both of which are incorporated herein by reference. Typically if paste 54 is epoxy based, chip 50 is bonded by heating the assembly in a temperature range from 150 to 250� C. with 0 to 100 psi pressure. If paste 54 is thermoplastic, the temperature range is the same but the pressure can range from 10 to 100 psi. The attached chip 50 is then underfilled by an encapsulant to form a typical finished assembly. A process of testing the chip is now described. The C4 bumps of the chip to be tested would be coated with layer 32 by a process described above. The C4 bumps are electrically connected to the pads of the test probe by either physical contact using force or bonding using the thermoplastic paste method described above. For both methods, the contact pads of the test probe are oxide free. C4 bumped chips are needed to be attached to Fr4 or other organic substates. Such assemblies will be used in computers, office equipment, automobiles and trucks, control systems, cellular phones, etc. While there has been described and illustrated a process for forming a metal coating on a structure such as capping C4 bumps with Au to provide an oxide free surface on C4 bumps on an integrated circuit chip, it will be apparent to those skilled in the art that modifications and variations are possible without deviating from the broad scope of the invention which shall be limited solely by the scope of the claims appended hereto. Patent Citations
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Town Square
Hillary Clinton Book Signing Protest
Original post made by New York Ex-Pat, Menlo Park: Central Menlo Park, on Aug 2, 2014
It's ironic that the Almanac will allow post critical of Republicans to stand; but inconsistently will vacate peoples' first amendment rights when there are posts critical of Democrats.
Web Link
Comments (3)
a resident of Menlo Park: Sharon Heights
on Aug 2, 2014 at 8:12 am
What "post" (sic) crtical or republicans were allowed to stand?
What posts crtical critical of dems were deleted?
a resident of Menlo Park: Sharon Heights
on Aug 2, 2014 at 3:23 pm
President Obama, his national security advisor Susan Rice, and Secretary of State Hillary Clinton all got caught in the most egregious lies about Benghazi-- blaming it on a video when a clearly was a planned terrorist attack. But what was worse than that was Secretary of State Hillary Clinton ignoring Ambassador Stevens pleas for more security while funding comics to perform routines in India.
Then when the consulate was under attack Hillary Clinton turned her back on Ambassador Stevens and the other 3 Americans and let them die. She could not be inconvenienced.
For her to even consider a run for the presidency is a slap in the face to all Americans. She is totally unqualified for any Government post. Then she makes excuses for her shortcomings.
In a Senate hearing she accepts responsibility and then tries to point the blame on the Undersecretaries of State by quoting the Accountability Review Board. Hillary Clinton is a total disgrace. She makes Cyrus Vance look like a veritable genius.
a resident of Menlo Park: Sharon Heights
on Aug 2, 2014 at 5:09 pm
"Secretary of State Hillary Clinton ignoring Ambassador Stevens pleas for more security while funding comics to perform routines in India"
Complete Fox koolaid. Congress funds the State Department and continuously underfunded requested security.
Who? Republicans.
"Republicans have sought to cut hundreds of millions of dollars slated for security at U.S. embassies and consulates since gaining control of the House in 2011.
Democrats are scrutinizing the GOP proposals in the wake of attacks on U.S. embassies and consulates in the Middle East, one of which saw Ambassador to Libya Christopher Stevens and three other Americans murdered.
"This is a disturbing example of the Republicans' meat-ax approach to cutting every aspect of the government, no matter how essential,"
Read more: Web Link
Follow us: @thehill on Twitter | TheHill on Facebook
Typical fox viewer - let the GOP cut funding, then blame Hillary with some clown story.
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